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(1) Field of The Invention
This invention relates to a universal short spine board system for the immobilization of a patient's head, neck and back, and the use of such a spine board system in the performance of emergency medical treatment and transportation.
(2) Description Of The Prior Art
Neck and spinal injuries such as fractures or dislocations of neck vertebrae may occur in a variety of situations, for example, automobile accidents and diving into shallow water. The danger of paralysis is greatest with fractures or dislocations of neck vertebrae, though it is present when other vertebrae are injured. If the spinal chord in the neck is injured, immediate death may result because the nerve supply from the brain to vital organs is shut off. Therefore, fractures of the neck must be handled with utmost caution, keeping the victim absolutely quiet and, if possible, summoning a physician to the scene of the accident. However, in many instances a physician can not be summoned to the scene of an accident, and emergency medical treatment must be given to the patient in anticipation of transporting the patient to a hospital for further diagnosis and treatment. Where transportation is absolutely essential, even for a few feet, it it necessary that, in the case of a neck injury, the person be kept flat on his back, and on a firm frame support.
There are presently available for use by Emergency Medical Teams spine boards and accessories for use in case of cervical and spinal injuries. Those boards of which I am aware comprise either a long or short spine board in combination with a variety of straps by means of which a victim's torso and head are secured to the spine board. Although these various spine boards have been suitable to a certain degree, and are used by a large number of Emergency Medical Teams, there use is attendant with certain disadvantages. Although some of the spine boards available require an inordinant amount of time for application to a victim, e.g., in the seat of an automobile, there are those available provided with special buckles on the straps that can be rather quickly and easily fastened to pins located in openings in the board. Nevertheless, as the straps are the means by which the victim is secured to the spine board, they offer somewhat limited immobility of the patient with respect to the board. This results from the fact that a victim's clothing does not offer good frictional engagement with the spine board and, moreover, because the various straps connecting the victim's body to the spine board do not always conform that well to the contours of the victim's body. | {
"pile_set_name": "USPTO Backgrounds"
} |
The present invention is directed to the total containment welding of plastic tubes. Various prior art exists disclosing different approaches for welding plastic tubes together. Prior patents disclose processes where the weld connection depends on the melt rheology of plastic resulting in non-uniform size of the weld connection. No attempt was made in the prior art to gain control of the size of the weld connection.
Parent application Ser. No. 158,505 discloses various wafer constructions for use in the total containment welding of plastic tubes and in the selective connect and disconnect of the plastic tubes. Such wafers are sufficiently effective that the same wafer could be used multiple times by removing the plastic material accumulated on the wafer after each use. In certain applications, however, it is desired to prevent the multiple use of the wafer and to assure that the wafer will be used only once. | {
"pile_set_name": "USPTO Backgrounds"
} |
The present invention relates to a nonvolatile semiconductor memory device and to a method for fabricating the same. In particular, it relates to a nonvolatile semiconductor memory device having memory elements and peripheral circuits for inputting and outputting data to and from the memory elements formed on a single semiconductor substrate and to a method for fabricating the same.
At present, flash EEPROM (Electrically Erasable Programmable ROM) devices (hereinafter referred to as FEEPROM devices) have been used widely in electronic equipment as nonvolatile semiconductor memory devices which allow for electrical write and erase operations. The structures of memory cells in a nonvolatile semiconductor memory element can be divided roughly into two types, which are a stacked-gate type having a multilayer electrode structure composed of a floating gate electrode and a control gate electrode stacked on a semiconductor substrate and a split-gate type having an electrode structure composed of a floating gate electrode and a control gate electrode each opposed to a channel region in a semiconductor substrate.
The memory cells of the split-gate type are larger in size than those of the stacked-gate type because of the floating gate electrode and the control gate electrode disposed adjacent to each other on the semiconductor substrate. In addition, the floating gate electrode and the control gate electrode adjacent to each other are formed by individual lithographic steps, which requires a margin for the alignment of respective masks used to form the floating gate electrode and the control gate electrode. With the margin, the memory cells tend to be further increased in size.
FIGS. 58A to 58H show the cross-sectional structures of a conventional split-gate FEEPROM device in the individual process steps.
First, as shown in FIG. 58A, an insulating film 202 is formed on a semiconductor substrate 201 composed of silicon. Then, control gate electrodes 203 are formed selectively on the insulating film 202.
Next, as shown in FIG. 58B, the portion of the insulating film 202 on the region of the semiconductor substrate 201 to be formed with drains is removed therefrom by wet etching by using a first mask pattern 251 having an opening corresponding to the drain formation region and the gate electrodes 203 as a mask. Then, boron (B) ions at a relatively low dose are implanted into the semiconductor substrate 201 such that a lightly doped p-type region 204 is formed in the drain formation region.
Next, as shown in FIG. 58C, a silicon dioxide film having a thickness of about 100 nm and doped with boron (B) and phosphorus (P) (BPSG (Boron Phosphorus Silicate Glass)) film is deposited over the entire surface of the semiconductor substrate 201. The deposited BPSG film is etched back by anisotropic etching to form sidewalls 205 composed of the BPSG film on the both side surfaces of each of the control gate electrodes 203.
Next, as shown in FIG. 58D, dry etching is performed with respect to the semiconductor substrate 201 by using a second mask pattern 252 having an opening corresponding to the drain formation region of the semiconductor substrate 201, the gate electrode 203, and the side walls 205 as a mask, thereby forming a recessed portion 201a having a stepped portion composed of the portion of the semiconductor substrate 201 underlying the sidewall 205 as the upper stage and the drain formation region as the lower stage.
Next, as shown in FIG. 58E, arsenic (As) ions at a relatively low dose are implanted into the semiconductor substrate 201 by using the second mask pattern 252, the gate electrode 203, and the sidewall 205 as a mask, whereby an LDD region 206 as a lightly doped n-type region is formed in the drain formation region.
Next, as shown in FIG. 58F, the sidewalls 205 are removed by using vapor-phase hydrofluoric acid and the semiconductor substrate 201 is thermally oxidized in an oxygen atmosphere at about 850xc2x0 C., whereby a thermal oxide film 207 with a thickness of about 9 nm is formed over the entire surface of the semiconductor substrate 201 including the gate electrodes 203. The portion of the thermal oxide film 207 overlying the drain formation region serves as a tunnel oxide film for each of floating gate electrodes.
Next, a polysilicon film doped with phosphorus (P) is deposited over the entire surface of the semiconductor substrate 201 and etched back to form sidewalls composed of the polysilicon film on the both side surfaces of the control gate electrodes 203. Then, as shown in FIG. 58G, the sidewall closer to a region to be formed with sources is removed, while the sidewall closer to the drain formation region of the semiconductor substrate 201 is divided into parts corresponding to individual memory cells on a one-by-one basis, thereby forming floating gate electrodes 208 composed of the polysilicon film in the drain formation region.
Next, as shown in FIG. 58H, arsenic (As) ions are implanted into the semiconductor substrate 201 by using the gate electrodes 203 and the floating gate electrodes 208 as a mask such that source and drain regions 209 and 210 are formed in the source formation region and in the drain formation region, respectively, whereby memory cells in the FEEPROM device are completed.
Since the floating gate electrodes 208 each opposed to the control gate electrode 203 via the thermal oxide film 208 serving as a capacitance insulating film is thus formed by self alignment relative to the control gate electrode 203, it is sufficient to perform only one lithographic step for forming the gate electrode 203 and a displacement does not occur between the control gate electrode 203 and the floating gate electrode 208 during the alignment thereof.
In a typical method for fabricating the conventional FEEPROM device, however, the floating gate electrode 208, the thermal oxide film 207, and the control gate electrode 203 covered with the thermal oxide film 207 which are shown in FIG. 58G are mostly composed of polysilicon, a ""silicon dioxide, and polysilicon, respectively. This causes the problem that, if the floating gate electrode 208 is to be formed selectively by etching, the control gate electrode 203 composed of the same material composing the floating gate electrode 208 may be damaged unless the etching speed is controlled with high precision.
Although the thermal oxide film 207 serving as the capacitance insulating film between the control gate electrode 203 and the floating gate electrode 208 and serving as the tunnel insulating film between the floating gate electrode 208 and the semiconductor substrate 201 is formed in the single step illustrated in FIG. 58F, if the tunnel film is formed after the formation of the capacitance insulating film, the interface between the control gate electrode 203 and the capacitance insulating film is oxidized or a bird""s beak occurs at the interface, which causes the problem that the thickness of the capacitance insulating film is increased locally and the capacitance insulating film does not have a specified capacitance value.
In the split-gate or stacked-gate FEEPROM device, if not only the memory cells but also other elements, particularly active elements such as MOS transistors each of which controls carriers implanted from the source region by using the gate electrode, are formed on a single semiconductor substrate, it is typical to simultaneously form the control gate electrodes of the FEEPROM device and the gate electrodes of the MOS transistors.
In terms of reducing the number of fabrication process steps, the conventional fabrication method is desirable since it simultaneously forms the control gate electrodes of the memory cells and the gate electrodes of the MOS transistors contained in, e.g., peripheral circuits or the like for controlling the memory cells. However, the memory cells of a FEEPROM device are larger in element size than MOS transistors whether the FEEPROM device is of the split-gate type or stacked-gate type. If the memory cells and the MOS transistors are formed simultaneously, each of the memory cells and the MOS transistors cannot be formed as an element with an optimum structure. If the diffusion region of each of the memory cells and the MOS transistors is provided with an LDD (Lightly Doped Drain) structure, the concentration of a diffused impurity differs from one region to another so that it is difficult to provide an optimum structure by forming each of the elements simultaneously.
If a method for fabricating a semiconductor device composed only of existing MOS transistors has been established, it is not easy to form, on a single substrate, the semiconductor device containing the existing MOS transistors and the memory cells of a FEEPROM device as shown in FIGS. 58.
If a method for fabricating a semiconductor device by forming, on a single substrate, other memory cells different in structure from those shown in FIGS. 58 and MOS transistors has been established, it is also not easy to form the other memory cells as a replacement for the memory cells shown in FIG. 58. This is because the fabrication process for the memory cells of the FEEPROM, in particular, adversely affects the fabrication of the MOS transistors.
Since the method for fabricating the split-gate FEEPROM device shown in FIGS. 58 forms the floating gate electrodes 208 after forming the control gate electrodes 203 on the semiconductor substrate 201, the floating gate electrodes 208 can be formed by self alignment relative to the control gate electrode 203 so that the memory cells are reduced in size.
As a method for fabricating such memory cells and MOS transistors on a single semiconductor substrate, the following process steps can be considered.
First, the gate electrodes of the MOS transistors to be formed in the other regions of the semiconductor substrate 201 are formed by simultaneous patterning during the formation of the control gate electrodes 203 shown in FIG. 58A.
Next, as shown in FIGS. 58B to 58G, the process steps for fabricating the memory cells are performed. If the implant conditions for the LDD region 206 coincide with the implant conditions for the LDD region of each of the MOS transistors, the impurity is implanted simultaneously into the LDD region of the MOS transistor.
Next, as shown in FIG. 58H, the source and drain regions of each of the MOS transistors are formed simultaneously with the formation of the source and drain regions 209 and 210 of each o f the memory cells.
Thereafter, a specified interlayer insulating film and a specified multilayer interconnect are formed by a normal fabrication process, whereby a semiconductor device composed of the memory cells and the MOS transistors formed on the single semiconductor substrate 201 is implemented.
In accordance with the fabrication method, however, the thermal oxide film 207 serving as the tunnel oxide film between the semiconductor substrate 201 and each of the floating gate electrodes 208 is formed also on the upper and side surfaces of the gate electrode of each of the MOS transistors, which causes the necessity to remove the portion of the thermal oxide film 207 covering the gate electrode.
It is to be noted that the gate electrode of each of the MOS transistors is typically composed of polysilicon and each of the gate oxide film and the film protecting the source and drain regions of the MOS transistor is a silicon dioxide film. To selectively remove the thermal oxide film 207 from the gate electrode composed of polysilicon, therefore, the etching speed for the MOS transistor should also be controlled with high precision, which renders the fabrication of the semiconductor device more difficult.
If the thermal oxide film 207 of the gate electrode of. each of the MOS transistors is removed by wet etching using hydrofluoric acid, e.g., the thermal oxide film 207 covering the upper and side surfaces of each of the control gate electrodes in the memory cell portion is also etched. If etching proceeds to the control gate electrode 203, the performance of the control gate electrode 203 may also deteriorate.
In addition, etching may also proceed to the LDD and channel regions of each of the MOS transistors formed in the. previous steps after the removal of the thermal oxide film 207. This reduces the depth of a junction in the channel region and increases resistance in the channel region, resulting in a reduced amount of current between the source and drain. As a result, the driving ability of the MOS transistor is lowered.
In the conventional semiconductor device in which the memory cells and the MOS transistors are formed on the single semiconductor substrate, if only the memory cell portion is composed of the split-gate memory cells shown in FIGS. 58, the MOS transistors are influenced by thermal hysteresis, which has not been observed previously. This causes the necessity to change the design of the entire semiconductor device. Since the thermal oxide film 207 is formed after the formation of the LDD region 206, e.g., an implant profile in the LDD region of each of the MOS transistors changes to change the operating characteristics of the MOS transistor, which causes the necessity to change process conditions including an amount of ions to be implanted in the LDD region.
In view of the foregoing problems, it is therefore a first object of the present invention to ensures the formation of memory cells in a split-gate nonvolatile semiconductor memory device. A second object of the present invention is to allow easy replacement of existing memory cells with memory cells according to the present invention by utilizing a fabrication process for a semiconductor memory device in which the existing memory cells and MOS transistors are formed on a single semiconductor substrate and prevent the memory cells according to the present invention from affecting the operating characteristics of the MOS transistors.
To attain the first object, the present invention provides a memory cell having a protective insulating film formed on a side surface of a control gate electrode to protect the control gate electrode from etching.
To attain the second object, the present invention provides a method for fabricating a nonvolatile semiconductor memory device in which the memory cell for attaining the first object of the present invention is formed first and then a transistor is formed, thereby preventing the step of forming the memory cell from affecting the operating characteristics of the transistor.
Specifically, a first nonvolatile semiconductor memory device for attaining the first object of the present invention has a control gate electrode and a floating gate electrode provided on a semiconductor substrate to have their respective side surfaces in opposed relation, the device comprising: a gate insulating film formed on the semiconductor substrate; the control gate electrode formed on the gate insulating film; a protective insulating film deposited on each of the side surfaces of the control gate electrode to protect the control gate electrode during formation of the floating gate electrode; the floating gate electrode opposed to one of the side surfaces of the control gate electrode with the protective insulating film interposed therebetween so as to be capacitively coupled to the control gate electrode; a tunnel insulating film formed between the floating gate electrode and the semiconductor substrate; a drain region formed in a region of the semiconductor substrate containing a portion underlying the floating gate electrode; and a source region formed in a region of the semiconductor substrate opposite to the drain region relative to the control gate electrode.
Since the first nonvolatile semiconductor memory device has the protective insulating film deposited on each of the side surfaces of the control gate electrode to protect the control gate electrode during the formation of the floating gate electrode, the configuration of the control gate electrode is not impaired by etching or the like during the formation of the floating gate electrode. This ensures the formation of a memory cell in the nonvolatile semiconductor memory device.
A second nonvolatile semiconductor memory device for attaining the first object of the present invention has a control gate electrode and a floating gate electrode provided on a semiconductor substrate to have their respective side surfaces in opposed relation, the device comprising: a gate insulating film formed on the semiconductor substrate; the control gate electrode formed on the gate insulating film; a protective insulating film deposited only on that one of the side surfaces of the control gate electrode opposed to the floating gate electrode to protect the control gate electrode during formation of the floating gate electrode; the floating gate electrode opposed to the side surface of the control gate electrode with the protective insulating film interposed therebetween so as to be capacitively coupled to the control gate electrode; a tunnel insulating film formed between the floating gate electrode and the semiconductor substrate; a drain region formed in a region of the semiconductor substrate containing a portion underlying the floating gate electrode; and a source region formed in a region of the semiconductor substrate opposite to the drain region relative to the control gate electrode.
Since the second nonvolatile semiconductor memory device has the protective insulating film deposited only on the side surface of the control gate electrode opposed to the floating gate electrode to protect the control gate electrode during the formation of the floating gate electrode, the configuration of the control gate electrode is not impaired during the formation of the floating gate electrode. This ensures the formation of a memory cell in the nonvolatile semiconductor memory device.
A third nonvolatile semiconductor memory device for attaining the first object of the present invention has a control gate electrode and a floating gate electrode provided on a semiconductor substrate to have their respective side surfaces in opposed relation, the device comprising: a gate insulating film formed on the semiconductor substrate; the control gate electrode formed on the gate insulating film; a protective insulating film deposited on that one of the side surfaces of the control gate electrode opposite to the side surface opposed to the floating gate electrode to protect the control gate electrode during formation of the floating gate electrode; a capacitance insulating film formed on the side surface of the control gate electrode opposed to the floating gate electrode; the floating gate electrode opposed to the side surface of the control gate electrode with the capacitance insulating film interposed therebetween so as to be capacitively coupled to the control gate electrode; a tunnel insulating film formed between the floating gate electrode and the semiconductor substrate; a drain region formed in a region of the semiconductor substrate containing a portion underlying the floating gate electrode; and a source region formed in a region of the semiconductor substrate opposite to the drain region relative to the control gate electrode.
Since the third nonvolatile semiconductor memory device has the protective insulating film deposited on the side surface of the control gate electrode opposite to the floating gate electrode to protect the control gate electrode during the formation of the floating gate electrode, the configuration of the control gate electrode is not impaired during the formation of the floating gate electrode. This ensures the formation of a memory cell in the nonvolatile semiconductor memory device.
In the third nonvolatile semiconductor memory device, the capacitance insulating film preferably has a uniform thickness.
In each of the first to third nonvolatile semiconductor memory devices, the protective insulating film preferably has a uniform thickness.
In each of the first to third nonvolatile semiconductor memory devices, the gate insulating film preferably has a uniform thickness.
In each of the first to third nonvolatile semiconductor memory devices, the tunnel insulating film preferably has a uniform thickness.
Preferably, each of the first to third nonvolatile semiconductor memory devices further comprises an insulating film formed between the control gate electrode and the protective insulating film.
In each of the first to third nonvolatile semiconductor memory devices, the protective insulating film is preferably a multilayer structure composed of a plurality of stacked insulating films having different compositions.
In each of the first to third nonvolatile semiconductor memory devices, the semiconductor substrate preferably has a stepped portion formed to be covered up with the floating gate electrode.
A first method for fabricating a nonvolatile semiconductor memory device, which is for attaining the first object of the present invention, comprises: a control-gate-electrode forming step of forming a first insulating film on a semiconductor substrate, patterning a conductor film formed on the first insulating film, and thereby forming a control gate electrode from the conductor film; a second-insulating-film depositing step of depositing a second insulating film over the entire surface of the semiconductor substrate including the control gate electrode; a protective-insulating-film depositing step of selectively removing the second insulating film so as to leave a portion of the second insulating film located on each of side surfaces of the control gate electrode and thereby forming, from the second insulating film, a protective insulating film for protecting the control gate electrode; a gate-insulating-film forming step of selectively removing the first insulating film so as to leave a portion of the first insulating film underlying the control gate electrode and thereby forming a gate insulating film from the first insulating film; a tunnel-insulating-film forming step of forming, on the semiconductor substrate, a third insulating film serving as a tunnel insulating film; a floating-gate-electrode forming step of forming by self alignment a floating gate electrode capacitively coupled to one of side surfaces of the control gate electrode with the protective insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween; and a source/drain forming step of implanting an impurity into the semiconductor substrate by using the control gate electrode and the floating gate electrode as a mask and thereby forming a source region and a drain region in the semiconductor substrate.
In accordance with the first method for fabricating a nonvolatile semiconductor memory device, each of the side surfaces of the control gate electrode is covered with thee protective insulating film also serving as the capacitance insulating film when the floating gate electrode capacitively coupled to one of the side surfaces of the control gate electrode with the protective insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween is formed by self alignment. The arrangement prevents damage caused by etching to the control gate electrode and ensures the formation of a memory cell in the nonvolatile semiconductor memory device.
A second method for fabricating a nonvolatile semiconductor memory device, which is for attaining the first object of the present invention, comprises: a control-gate-electrode forming step of forming a first insulating film on a semiconductor substrate, patterning a conductor film formed on the first insulating film, and thereby forming a control gate electrode from the conductor film; a second-insulating-film depositing step of depositing a second insulating film over the entire surface of the semiconductor substrate including the control gate electrode; a sidewall forming step of forming sidewalls over the first insulating film and on portions of the second insulating film located on side surfaces of the control gate electrode; a protective-insulating-film forming step of performing etching with respect to the first and second insulating films by using the sidewalls and the control gate electrode as a mask and thereby forming, from the second insulating film, a protective insulating film for protecting the control gate electrode on each of the side surfaces of the control gate electrode, while forming, from the first insulating film, a gate insulating film under the control gate electrode; a tunnel-insulating-film forming step of removing the sidewalls and then forming, in a region in which the semiconductor substrate is exposed, a third insulating film serving as a tunnel insulating film; a floating-gate-electrode forming step of forming by self alignment a floating gate electrode capacitively coupled to one of the side surfaces of the control gate electrode with the protective insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween; and a source/drain forming step of implanting an impurity into the semiconductor substrate by using the control gate electrode and the floating gate electrode as a mask and thereby forming a source region and a drain region in the semiconductor substrate.
In accordance with the second method for fabricating a nonvolatile semiconductor memory device, each of the side surfaces of the control gate electrode is covered with the protective insulating film when the floating gate electrode capacitively coupled to one of the side surfaces of the control gate electrode with the protective insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween is formed by self alignment. The arrangement prevents damage caused by etching to the control gate electrode and ensures the formation of a memory cell in the nonvolatile semiconductor memory device.
In the second method for fabricating a nonvolatile semiconductor memory device, the tunnel-insulating-film forming step preferably includes removing the sidewalls and then selectively removing respective portions of the protective insulating film covered with bottom surfaces of the sidewalls. The arrangement suppresses the trapping of electrons or holes in the portions of the protective insulating film covered with the bottom surfaces of the sidewalls and thereby suppresses the degradation of a memory element due to an increase in the number of write or erase operations performed with respect to the memory clement.
In this case, the tunnel-insulating-film forming step preferably includes the step of selectively removing the respective portions of the protective insulating film covered with the bottom surfaces of the sidewalls and then selectively removing respective portions of the gate insulating film covered with the bottom surfaces of the sidewalls. The arrangement suppresses the trapping of electrons or holes in the portions of the gate insulating film covered with the bottom surfaces of the sidewalls and thereby reduces the degradation of the write and erase characteristics of a memory element.
Preferably, the second method for fabricating a nonvolatile semiconductor memory device further comprises, between the protective-insulating-film forming step and the tunnel-insulating-film forming step, the step of: performing etching with respect to the semiconductor substrate by using the sidewalls as a mask and thereby forming a stepped portion to be covered up with the floating gate electrode in a region of the semiconductor substrate to be formed with the floating gate electrode. The arrangement increases the efficiency with which electrons are implanted into the floating gate electrode.
In the first or second method for fabricating a nonvolatile semiconductor memory device, the tunnel-insulating-film forming step preferably includes the step of forming the third insulating film also on the protective insulating film.
A third method for fabricating a nonvolatile semiconductor memory device, which is for attaining the first object of the present invention, comprises: a control-gate-electrode forming step of forming a first insulating film on a semiconductor substrate, patterning a conductor film formed on the first insulating film, and thereby forming a control gate electrode from the conductor film; a second-insulating-film depositing step of depositing a second insulating film over the entire surface of the semiconductor substrate including the control gate electrode; a protective-insulating-film forming step of selectively removing the second insulating film so as to leave a portion of the second insulating film located on one of side surfaces of the control gate electrode and thereby forming, from the second insulating film, a protective insulating film for protecting the one of the side surfaces of the control gate electrode; a gate-insulating-film forming step of selectively removing the first insulating film so as to leave a portion of the first insulating film underlying the control gate electrode and thereby forming a gate insulating film from the first insulating film; a tunnel-insulating-film forming step of forming, on the semiconductor substrate, a third insulating film serving as a tunnel insulating film; a floating-gate-electrode forming step of forming by self alignment a floating gate electrode capacitively coupled to the side surface of the control gate electrode with the protective insulating, film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween; and a source/drain forming step of implanting an impurity into the semiconductor substrate by using the control gate electrode and the floating gate electrode as a mask and thereby forming a source region and a drain region in the semiconductor substrate.
In accordance with the third method for fabricating a nonvolatile semiconductor memory device, one of the side surfaces of the control gate electrode is covered with the protective insulating film also serving as the capacitance insulating film when the floating gate electrode capacitively coupled to the side surface of the control gate electrode with the protective insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween is formed by self alignment. The arrangement reduces damage caused by etching to the control gate electrode and ensures the formation of a memory cell in the nonvolatile semiconductor memory device.
A fourth method for fabricating a nonvolatile semiconductor memory device, which is for attaining the first object of the present invention, comprises: a control-gate-electrode forming step of forming a first insulating film on a semiconductor substrate, patterning a conductor film formed on the first insulating film, and thereby forming a control gate electrode from the conductor film; a second-insulating-film depositing step of depositing a second insulating film over the entire surface of the semiconductor substrate including the control gate electrode; a sidewall forming step of forming sidewalls over the first insulating film and on portions of the second insulating film located on side surfaces of the control gate electrode; a protective-insulating-film forming step of performing etching with respect to the first and second insulating films by using the sidewalls and the control gate electrode as a mask and thereby forming, from the second insulating film, a protective insulating film for protecting the control gate electrode on each of the side surfaces of the control gate electrode, while forming, from t he first insulating film, a gate insulating film under the control gate electrode; a protective-insulating-film removing step of removing the sidewalls and then selectively removing the protective insulating film so as to leave a portion of the protective insulating film located on one of the side surface s of the control gate electrode; a tunnel-insulating-film forming step of forming, in a region in which the semiconductor substrate is exposed, a third insulating film serving as a tunnel insulating film; a floating-gate-electrode forming step of forming by self alignment a floating gate electrode capacitively coupled to the side surface of the control gate electrode with the protective insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film, interposed therebetween; and a source/drain forming step of implanting an impurity into the semiconductor substrate by using the control gate electrode and the floating gate electrode as a mask and thereby forming a source region and a drain region in the semiconductor substrate.
In accordance with the fourth method for fabricating a nonvolatile semiconductor memory device, one of the side surfaces of the control gate electrode is covered with the protective insulating film also serving as the capacitance insulating film when the floating gate electrode capacitively coupled to the side surface of the control gate electrode with the protective insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween is formed by self alignment. The arrangement reduces damage caused by etching to the control gate electrode and ensures the formation of a memory cell in the nonvolatile semiconductor memory device.
In the fourth method for fabricating a nonvolatile semiconductor memory device, the protective-insulating-film removing step preferably includes the step of removing the sidewalls and then selectively removing respective portions of the protective insulating film covered with bottom surfaces of the sidewalls.
In this case, the protective-insulating-film removing step preferably includes the step of selectively removing the respective portions of the protective insulating film covered with the bottom surfaces of the sidewalls and then selectively removing respective portions of the gate insulating film covered with the bottom surfaces of the sidewalls.
Preferably, the third or fourth method for fabricating a nonvolatile semiconductor memory device further comprises, between the protective-insulating-film forming step and the protective-insulating-film removing step, the step of: performing etching with respect to the semiconductor substrate by using the sidewalls as a mask and thereby forming a stepped portion to be covered up with the floating gate electrode in a region of the semiconductor substrate to be formed with the floating gate electrode.
In the third or fourth method for fabricating a nonvolatile semiconductor memory device, the tunnel-insulating-film forming step preferably includes the step of forming the third insulating film also on the protective insulating film.
Preferably, the third or fourth method for fabricating a nonvolatile semiconductor memory device further comprises, between the control-gate-electrode forming step and the second-insulating-film depositing step, the step of: introducing hydrogen and oxygen into a space over the heated semiconductor substrate, generating water vapor from the introduced hydrogen and oxygen over the semiconductor substrate, and thereby forming an insulating film on each of side portions of the control gate electrode.
In this case, the protective-insulating-film forming step preferably includes forming the protective insulating film by stacking a plurality of insulating films having different compositions.
In the third or fourth method for fabricating a nonvolatile semiconductor memory device, the tunnel-insulating-film forming step preferably includes the step of introducing hydrogen and oxygen into a space over the heated semiconductor substrate, generating water vapor from the introduced hydrogen and oxygen over the semiconductor substrate, and thereby forming the tunnel insulating film, while forming an insulating film having a composition different from a composition of the protective insulating film on a surface of the protective insulating film.
A fifth method for fabricating a nonvolatile semiconductor memory device, which is for attaining the first object of the present invention, comprises: a control-gate-electrode forming step of forming a first insulating film on a semiconductor substrate, patterning a conductor film formed on the first insulating film, and thereby forming a control gate electrode from the conductor, film; a second-insulating-film depositing step of depositing a second insulating film over the entire surface of the semiconductor substrate including the control gate electrode; a protective-insulating-film forming step of selectively removing the second insulating film so as to leave a portion of the second insulating film located on that one of the side surfaces of the control gate electrode opposite to the side surface to be formed with a floating gate electrode and thereby forming, from the second insulating film, a protective insulating film for protecting the control gate electrode; a gate-insulating-film forming step of selectively removing the first insulating film so as to remove a portion of the first insulating film underlying the control gate electrode and thereby forming a gate insulating film from the first insulating film; a capacitance-insulating-film forming step of forming a capacitance insulating film on that one of the side surfaces of the control gate electrode to be formed with the floating gate electrode; a tunnel-insulating-film forming step of forming a tunnel insulating film on the semiconductor substrate; a floating-gate-electrode forming step of forming by self alignment the floating gate electrode capacitively coupled to the side surface of the control gate electrode with the capacitance insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween; and a source/drain forming step of implanting an impurity into the semiconductor substrate by using the control gate electrode and the floating gate electrode as a mask and thereby forming a source region and a drain region in the semiconductor substrate.
In accordance with the fifth method for fabricating a nonvolatile semiconductor memory device, the side surface of the control gate electrode opposite to the floating gate electrode is covered with the protective insulating film when the floating gate electrode capacitively coupled to the side surface of the control gate electrode with the capacitance insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel, insulating film interposed therebetween is formed by self alignment. The arrangement prevents damage caused by etching to the control gate electrode and ensures the formation of a memory cell in the nonvolatile semiconductor memory device.
A sixth method for fabricating a nonvolatile semiconductor memory device, which is for attaining the first object of the present invention, comprises: a control-gate-electrode forming step of forming a first insulating film on a semiconductor substrate, patterning a conductor film formed on the first insulating film, and thereby forming a control. gate electrode from the conductor film; a second-insulating-film depositing step of depositing a second insulating film over the entire surface of the semiconductor substrate including the control gate electrode; a sidewall forming step of forming sidewalls over the first insulating film and on portions of the second insulating film located on side surfaces of the control gate electrode; a protective-insulating-film forming step of performing etching with respect to the first and second insulating films by using the sidewalls and the control gate electrode as a mask and thereby forming, from the second insulating film, a protective insulating film for protecting the control gate electrode on each of the side surfaces of the control gate electrode, while forming, from the first insulating film, a gate insulating film under the control gate electrode; a protective-insulating-film removing step of removing the sidewalls and then selectively removing a portion of the protective insulating film located on that one of the side surfaces of the control gate electrode to be formed with a floating gate electrode; a capacitance-insulating-film forming step of forming a capacitance insulating film on the side surface of the control gate electrode to be formed with the floating gate electrode; a tunnel-insulating-film forming step of forming a tunnel insulating film in a region in which the semiconductor substrate is exposed; a floating-gate-electrode forming step of forming by self alignment the floating gate electrode capacitively coupled to the side surface of the control gate electrode with the capacitance insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween; and a source/drain forming step of implanting an impurity into the semiconductor substrate by using the control gate electrode and the floating gate electrode as a mask and thereby forming a source region and a drain region in the semiconductor substrate.
In accordance with the sixth method for fabricating a nonvolatile semiconductor memory device, the side surface of the control gate electrode opposite to the floating gate electrode is covered with the protective insulating film when the floating gate electrode capacitively coupled to the side surface of the control gate electrode with the capacitance insulating film interposed therebetween and opposed to the semiconductor substrate with the tunnel insulating film interposed therebetween is formed by self alignment. The arrangement reduces damage caused by etching to the control gate electrode and ensures the formation of a memory cell in the nonvolatile semiconductor memory device.
In the sixth method for fabricating a nonvolatile semiconductor memory device, the protective-insulating-film removing step preferably includes the step of removing the sidewalls and then selectively removing respective portions of the protective insulating film covered with bottom surfaces of the sidewalls.
In this case, the protective-insulating-film removing step preferably includes the step of selectively removing the respective portions of the protective insulating film covered with the bottom surfaces of the sidewalls and then selectively removing respective portions of the gate insulating film covered with the bottom surfaces of the sidewalls.
Preferably, the sixth method for fabricating a nonvolatile semiconductor memory device further comprises, between the protective-insulating-film forming step and the protective-insulating-film removing step, the step of: performing etching with respect to the semiconductor substrate by using the sidewalls as a mask and thereby forming a stepped portion to be covered up with the floating gate electrode in a region of the semiconductor substrate to be formed with the floating gate electrode.
In the fifth or sixth method for fabricating a nonvolatile semiconductor memory device, the capacitance-insulating-film forming step and the tunnel-insulating-film forming step are preferably composed of identical steps proceeding concurrently.
In the fifth or sixth method for fabricating a nonvolatile semiconductor memory device, the capacitance-insulating-film forming step or the tunnel-insulating-film forming step preferably includes the step of introducing hydrogen and oxygen into a space over the heated semiconductor substrate, generating water vapor from the introduced hydrogen and oxygen over the semiconductor substrate, and thereby forming the capacitance insulating film or the tunnel insulating film.
In each of the first to sixth methods for fabricating a nonvolatile semiconductor memory device, the second insulating film is preferably a multilayer structure composed of a plurality of stacked insulating films having different compositions.
To attain the second object, in each of the first to sixth methods for fabricating a nonvolatile semiconductor memory device, the semiconductor substrate preferably has a memory circuit formation region including the source region and the drain region and a peripheral circuit formation region to be formed with a peripheral circuit containing a field-effect transistor for generating and outputting a drive signal to the control gate electrode, the floating gate electrode, the source region, or the drain region, the method further comprising the step of: forming the field-effect transistor in the peripheral circuit formation region after forming the source region and the drain region in the memory circuit formation region.
The arrangement prevents the memory cell of the present invention from affecting the operating characteristics of a field-effect transistor composing the peripheral circuit and thereby implements a nonvolatile semiconductor memory device having desired characteristics.
In this case, the step of forming the control gate electrode in the memory circuit formation region preferably includes the step of forming also a conductor film for forming a gate electrode of the field-effect transistor simultaneously with-the formation of the conductor film on the first insulating film. Although the step of completing a field-effect transistor in the peripheral circuit is performed subsequently to the step of producing a memory cell, the conductor film on the first insulating film is formed simultaneously with the formation of the conductor film for forming the gate electrode in the memory circuit formation region. Accordingly, the arrangement omits the step of forming the conductor film for the field-effect transistor without affecting the operating characteristics of the field-effect transistor and thereby reduces the number of process steps.
In this case, the step of forming the control gate electrode in the memory circuit formation region preferably includes the step of patterning also a conductor film for forming a gate electrode of the field-effect transistor simultaneously with the patterning of the conductor film. The arrangement omits the, patterning step for the gate electrode of a field-effect transistor without affecting the operating characteristics of the field-effect transistor and thereby reduces the number of process steps. | {
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In the latter half of the twentieth century, there began a phenomenon known as the information revolution. The information revolution is a historical development broader in scope than any one event or machine, and while often associated with large general-purpose computers, it has often found expression in much smaller devices. In fact, one of the remarkable aspects of the information revolution is how digital electronic processors are used to enhance the capabilities of other devices, from automobiles to refrigerators.
The information revolution has spawned a large variety of portable electrical devices. Specifically, the expanding capabilities and shrinking physical size of digital electronic devices have encouraged the development of portable devices. This phenomenon has made it possible, for example, for anyone to walk into an electronics store and purchase a laptop computer which is far faster and more capable than the most advanced and expensive computing systems of the 1950s, systems which might have occupied entire floors of buildings. Because it is now possible to place powerful processing capability in a single chip on a relatively small device, new uses have been created and are being created for portable devices with digital processing capability. Examples of such portable devices include cell and cordless telephones, personal digital assistants (PDAs), music and video players, laptop computers, and a wide range of sensing, testing and diagnostic devices for medical, environmental, or industrial purposes.
Although some devices are considered “portable” simply because they can be moved from place to place, of particular interest herein are those portable electrical devices which contain their own source of stored electrical energy (e.g. batteries), and are therefore not dependent on the proximity of an external source of electrical power. The information revolution has caused many new and varied types of such portable electrical devices to be used, but it must be remembered that battery-operated portable electrical devices have been around for a long time, and do not necessarily require digital data processing capability. For example, battery operated power tools, toys, flashlights and so forth have been in use for many years, and continue to be used.
Many portable electrical devices, especially digital electronic devices, contain rechargeable batteries. In some cases, these rechargeable batteries are recharged by removing them from the portable device, placing them in a special purpose charging device (usually connected to a line voltage source) until the electrical charge is sufficiently replenished, and then re-installing the batteries in the portable device. This method has obvious disadvantages from the standpoint of convenience to the user, and also introduces the possibility that the user will place the batteries in the charger in an erroneous orientation, re-install the batteries in the device in an erroneous orientation, or in some other manner cause damage to the batteries and/or the electrical device during the process of recharging the batteries. In order to reduce these hazards and make recharging more convenient, many portable electrical devices are design to be coupled directly to a charging device or voltage, without requiring removal of the batteries. This mode of recharging is particularly common in the case of cell and portable telephones, which require frequent recharging.
If a portable device having rechargeable batteries is coupled to a charging device (without removal of the batteries), coupling is typically accomplished by either mating an electrical plug connected by cable to either the charger or the device with a corresponding receptacle, or by placing the portable device in a cradle formed by the charging device so that electrical contacts align. In some cases, the portable device is plugged directly into a line voltage receptacle, the portable device containing all the electronics required for transforming and rectifying a line voltage signal.
Although any of these techniques is generally more convenient than removal of the batteries for recharging, and is less likely to cause damage to the device and/or batteries, these techniques still require a certain level of attention and interaction on the part of the user. I.e., the user must visually or otherwise align certain mating components to a relatively narrow degree, and place the mating components in proper relative position.
While the burden of visually or otherwise aligning a portable electrical device with respect to its corresponding charging device and placing the two in proper position may seem like a small matter, it can cause inconvenience in a variety of ways, particularly as the number of such portable devices increases. For example, it may be difficult to couple the portable device to the charger while performing some other task requiring visual concentration; the need for visual alignment usually limits the acceptable locations of charging devices to those locations having ample light and at the proper height for convenient visual alignment; certain individuals with physical handicaps may find it particularly difficult; etc. As a particular example, a user may wish to couple a portable device to a recharging device while performing another complex task, such as driving an automobile. A need exists, not necessarily generally recognized, for an improved interface between a portable electrical device and its charging device, which will require less attention and interaction on the part of the user. | {
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Many mobile devices, such as smart phones, have been enabled with functionality for communicating with others using any of several different techniques. For example, a mobile device may be used for communicating with another via a voice call, an email, an instant message, a text message, or a social networking service (e.g., FACEBOOK® social networking service). A smart phone may include an address book application containing contacts, and one of the contacts may be selected for communication through one of the communication techniques.
In an example of communicating with a contact, the user may open the address book application and select one of the contacts for communication. Next, the device may present options for communicating with the selected contact. The user may select to initiate a telephone call, an email communication, an instant message, or a text message communication with the selected contact. If, for example, the selected contact does not answer the telephone call, the user may leave a voicemail message on an answering service, or disconnect the call. Afterwards, the user may attempt a different telephone number or communication technique for reaching the selected contact. To again try to reach the contact, the user must select the contact and then select a different communication technique for communicating with the contact. This process can be burdensome to users, especially in the case of emergency situations when it is desired to reach the contact as soon as possible. Similarly, in the case of attempting to reach multiple contacts, this process can be even more burdensome to users, because the user must separately select each contact. Accordingly, it is desirable to provide improved systems and methods for initiating communications with contacts. | {
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In order to optimize oil production from one or more oil wells, on-line measurement of at least the water content of the oil stream is required. Lighter oils can easily be separated from the water, and the oil can be assumed to be 100% oil and the water 100% water. However, these assumptions are not valid for heavier oils because the oil tends to emulsify in the water. So-called "test separators" therefore are used to separate the oil, water and any gas and measure the water content, for example using capacitance or RF admittance probes or conductivity measuring devices.
In traditional test separators, the full flow of the production stream flows through a test separator that includes a vessel in which the oil and water tend to separate. Gas is taken off from the top of the vessel and water from the bottom, while oil is removed from a level above the oil/water interface in the vessel. Individual measurements are taken of the flow of gas, water and oil to indicate the relative proportions of these components in the oil stream.
A large separator vessel is required and both the capital and operating costs of the equipment tend to be high. Also, in practice, the measurements derived from prior art test separators are subject to many errors.
An object of the present invention is to provide a method and apparatus for determining the water content of an oil stream that offers lower capital and operating costs and improved accuracy of measurement. | {
"pile_set_name": "USPTO Backgrounds"
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Stacked sheet separating and gripping apparatuses of this type are known in the art. See, for example, Japanese Patent Publication No. Sho 55-42023.
To better understand the background of this invention, a conventional stacked sheet separating and gripping apparatus will be briefly explained with reference to FIG. 23. In this device, a plurality of sheets S in a stack are laid on a stacker 51 and then urged upwardly by a take-up or a drag roller 53 which abuts against the stacker and which is positioned on its periphery. The drag roller 53 contains a plurality of flexible bristles 52 that radially extended from its surface.
A gripper or holder 54 is positioned at an incline to form a certain angle with the top of the stacked sheets. The gripper 54 includes a plurality of needle-like projections 55 extending from its surface.
The take-up or drag roller 53 is adapted for clockwise rotation to allow the bristles 52 to pick up and draw some of the upper sheets and deliver the uppermost sheet inside out to the gripper 54 when the roller is moved along a guide groove 56 that is parallel to the gripper 54.
When the roller 53 reaches the end of its travel and places the leading edges of the sheets on the gripper 54, the roller 53 is rotated in reverse to return to its lowermost position, leaving the uppermost sheet engaged with the projections 55 and retained on the gripper 54, while other sheets are returned to the stacked sheets S. Thereafter, the sheet on the gripper 54 is conveyed by a separately mounted gripper and conveyor mechanism to a predetermined station, and released.
Another known approach, as shown in FIG. 24, uses a take-up roller 61 having a plurality of bosses to abut against a stack of sheets S. The take-up roller 61 is rotated to bend the uppermost sheet into a loop in a clearance 64, defined by a stationary support 62 and a holder lever 63. Holder level 63 raises the loop from the sheet surface so that a spring 65 pivots the holder lever 63 about a shaft 66 to hold the loop between the stationary support 62 and the holder 63. A similar apparatus can be found, for example, in U.S. Pat. No. 3,940,125.
The conventional stacked sheet separating and gripping apparatuses discussed above require two independent and individual actuators with respect to rotation and displacement of the take-up rollers rendering the structures complicated, and involving troublesome operation.
Furthermore, these apparatuses lack a simplified means for gripping the sheets that remain on the gripper 54 and conveying the same to a given position. When using these apparatuses with a thin sheet, the bristles on the take-up rollers are likely to damage the sheet. The bristles also lack adaptability to the rigidity and pliability of the sheet, rendering a poor separation of one sheet from another.
Accordingly, there is a need for a stacked sheet separating and gripping apparatus that is capable of handling sheets of varying pliability and thicknesses, that is also simple in design and economical to manufacture. | {
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The present invention relates to a press fitting for a tube, the tube being particularly a plastic tube or a plastic/metal compound tube.
Press fittings for tubes generally comprise a fitting body provided with a support shell for mounting thereon the end of a tube which is to be connected. In this arrangement, the press shell and the tube end mounted thereto are surrounded by a plastically deformable press shell which, by means of a press tool, is radially compressed and thus is pressed against the tube so that the tube will both closely abut the press fitting and be fixated thereon.
Further, it is known to provide the press shell (or the fitting body) with an abutment element to be abutted by a pressing tool. Said abutment element serves as a stopper for the pressing tool and for guidance of the pressing tool during the deforming of the press shell.
Finally, it is known to provide the abutment element with press indication portions extending into the region acted on by the press shell. Said press indication portions are arranged in abutment on the press shell externally of the latter and, during the deforming of the press shell, will be separated from the abutment element by means of the pressing tool. Examples of press fittings of the above mentioned type are found in DE 10 2005 028 558 B3, WO 2007/031348 A1, EP 1 790 896 A1, EP 1 596 116 A1 and EP 1 477 719 A1.
During the deformation of the press shell, the pressing tool will by its pressing face engage the press indication portions of the abutment element. In the process, these press indication portions will be bent radially inwardly. In case of inappropriate handling of the press fitting, it may happen that the press shell axially moves relative to the pressing tool, so that the pressing of the press shell does not occur at the prescribed position as defined by the abutment of the pressing tool on the abutment element.
It is the object of the invention to provide a press fitting for a tube, particularly a for plastic tube or a plastic/metal compound tube, wherein the pressing can be handled in a simpler and more reliable manner. | {
"pile_set_name": "USPTO Backgrounds"
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Field of the Invention
The present invention generally relates a table lookup for scalable simulation analysis. An exemplary aspect of this invention is based on efficient deployment of Table Lookup (TLU) methodology in enterprise-level scalable circuit simulation architecture.
Description of the Related Art
In large design groups performing integrated circuit design (digital and/or analog), often the most basic verification for the circuit to be designed is running a circuit simulation, that is a numerical model of the circuit and its excitations (input signals) at conditions specified by the designer (environmental settings). The specifications for the output signal (“output specs”) need to be met in order to vet the circuit design for manufacturing and deployment. The most essential and fundamental verification of the circuit design is based on circuit simulation, commonly known within the industry as SPICE (Simulation Program of Integrated Circuit Emphasis).
A circuit simulation job is performed by a computer using extensive numerical techniques and utilizes device models to solve a nonlinear differential algebraic equation solver (also known as transient analysis) to model the input/output relationship of the circuit and to measure the predicted output of the circuit as they are being manufactured. The fundamental cost of computation of circuit simulation is the evaluation of the device models, which is the input/output relationships of the transistor elements. For each transistor (e.g., a field-effect transistor (FET)) there is a set of device parameters (model parameters) and input voltage settings at its ports that evaluate the known quantities of the transistor device (e.g., charges, port currents and their derivatives with respect to the terminal voltages, etc.).
The circuit analysis flow is normally: Circuit Parse>Formulate>Break Down Device Evaluation>MatrixSolve>Iterate Till Converge. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The present invention relates to a transportation wheel for a treadmill, and more particularly to a transportation wheel having an engraved pattern on a roller where the pattern is similar to a pattern on the inner surface of the traveling belt. Because of the similar patterns, the transportation wheel is able to drive the traveling belt efficiently.
2. Description of Related Art
With reference to FIG. 4, a treadmill (40) has a front end and a rear end and comprises a transportation wheel (41), a freely-rotating wheel (not numbered) and a traveling belt (42). The transportation wheel (41) mounted at the front end of the treadmill (40). The freely-rotating wheel is mounted at the rear end of the treadmill (40) The traveling belt (42) is mounted around the transportation wheel (41) and the freely-rotating wheel.
The transportation wheel (41) is adapted to drive the traveling belt (42) at the same speed as the transportation wheel (41). The transportation wheel (41) comprises a roller (43), which adapts to attach a drive assembly (44) on one end of the roller (43). The roller (43) has two slightly tapered ends, an enlarged middle portion and two engraved helix patterns (45) defined on the middle portion of the outer periphery of the roller (43), wherein the engraved helix patterns are grooves and are formed in opposite directions to be a symmetrical configuration. When a user steps on the treadmill, most of the force is applied to the enlarged middle portion of the roller (43), which makes the traveling belt (42) press the middle portion tighter than the tapered ends of the roller (43). Thus, no side-force is applied to the traveling belt (42), and the traveling belt (42) is not easily detached from the roller (43). Additionally, the engraved helix patterns (45) evenly disperse the forces generated by and applied to the moving traveling belt (42) and keep the traveling belt (42) in the middle portion of the roller (43) even when the roller (43) is rotating.
However, the traveling belt (42) has an inner surface that is made of fabric and has a texture different from the engraved helix patterns (45) on the roller (43). Therefore, the roller (43) cannot provide sufficient friction to drive the traveling belt (42).
The present invention has arisen to mitigate and/or obviate the disadvantages of the conventional transportation wheel. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The present invention relates to a technology for a vehicle comprising a motor which drives front wheels and a motor which drives rear wheels.
2. Description of the Related Art
Conventionally, there has been a proposal for a vehicle comprising a motor which drives front wheels and a motor which drives rear wheels. There further has been proposed a vehicle which comprises a front-wheel drive motor and a rear-wheel drive motor as described above, and also comprises an engine for driving front wheels (for example, see Patent Literature 1). | {
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FIG. 1 shows a conventional guitar 10 having a neck 12, a headstock 14, a plurality of tuning pegs 16, a nut 18, a plurality of strings 20, and a plurality of frets 22. FIG. 2 shows a conventional metal slide 30 in the shape of a cylinder. Slide 30 has open ends so the player's finger may be inserted into either end as desired. The notes on guitar 10 are selected when a player depresses one of the strings 20 using a finger applied against one of the frets 22. String 20 contacts fret 22 and the pitch is increased to sound the desired note. An alternative method of playing a note at the desired pitch is to use a slide 30. This is a cylinder made of metal, glass or ceramic that is worn over the player's finger. The player contacts neck 12 at the desired position with slide 30 to achieve the desired pitch without necessarily contacting frets 22. This method of play offers unique sounds, not achievable with finger contact on frets 22. Slide 30 is somewhat awkward and can be difficult to put on and remove while playing. This is sometimes required, as parts of a song, which may or may not require this technique of play. While slide 30 is being worn, the finger wearing slide 30 cannot be used to depress strings 20 on frets 22 and use of this finger is lost. An expedient means of wearing and removing slide 30 is of value to the guitarist. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The present invention relates to insulated gate field effect transistors, and more particularly, to insulated gate field effect transistors having a high breakdown voltage and a low on-resistance.
2. Description of the Prior Art
Insulated gate field effect transistors (IGFET's) have become increasingly popular as circuit elements for various integrated circuits because their manufacturing is simple and their integration is easy. A major drawback of these transistors, however, has been their low breakdown voltage as measured between the drain and substrate is (40-50 V for P-channel MOS transistors and 20-30 V for N-channel MOS transistors). This low breakdown voltage is due to field concentration in the proximity of a drain region and a gate electrode or the like. As a result the field of application for IGFET's has been limited mainly to digital circuits which are operable in the voltage range of 5-15 V. With the growing use of MOS integrated circuits, the need for high drain voltage operations has been enhanced, and several techniques for making insulated gate field transistors having a high breakdown voltage have been developed.
For example, with regard of silicon high voltage P-channel insulated gate field effect transistors having an ion implanted offset gate structure, even those having a drain breakdown voltage of about 250-300 V have been obtained. These insulated gate field effect transistors have such structure that a pair of source and drain regions are provided in one major surface of a bulk silicon substrate, a gate insulator film is formed on the one major surface of the substrate between the source and drain regions, an extension drain region is formed in the one major surface of the substrate as extended from the drain region towards the source region, and a gate electrode is provided on the gate insulator film at the channel section between the extension drain region and the source region.
In such transistors, since the gate electrode and the high concentration drain region do not overlap with each other in a plan projection, field concentration can be mitigated. Furthermore, the extension drain region formed by ion implantation which is essentially a low concentration impurity region, is pinched off as the drain voltage applied to the drain region is increased, so that it serves as a saturating register. Accordingly, the divided voltage applied across the channel section can be suppressed to a low value, and so, the drain breakdown voltage is enhanced.
Therefore, in an insulated gate field effect transistor having, on its drain side, an offset gate structure consisting of an extension drain region and a bulk silicon substrate adjacent thereto, the drain breakdown voltage can be enhanced, in principle, up to the proximity of the PN junction breakdown voltage by selecting the offset gate length (i.e., the length of the extension drain region) sufficiently long. The PN junction breakdown voltage is determined by the impurity concentration of the bulk silicon substrate.
However, in order to attain a still higher breakdown voltage using a transistor with the above-described structure, it is necessary to greatly sacrifice an "on-resistance" (a series resistance between a source and a drain when a transistor is in a conducting state). As a result of the foregoing the high breakdown voltage and the low on-resistance are mutually complicting factors.
On one hand it is desired that the impurity concentration of the substrate is as low as possible to increase the PN junction breakdown voltage between the drain region and the substrate. On the other hand, it is desirable to have a high ion dose implanted to the extension drain region (that is, the impurity concentration and distribution in said region as measured in the direction of the film thickness) since the ion dose determines the on-resistance of the transistor. However, since it is necessary that upon increase of the drawin voltage the extension drain region serving as a saturating resistor must be pinched off before the divided voltage that is applied across the effective MOS channel section reaches its insulation breakdown voltage (for instance; 40-80 V), the upper limit of the amount of electrically active impurities per unit area which can be doped into said region is determined by the impurity concentration of the bulk silicon substrate. In other words, the offset gate type transistors in the prior art had a disadvantage that if the impurity concentration of the substrate is lowered for attaining a high breakdown voltage of the transistor, then at the same time the ion dose implanted to the extension drain region must be also suppressed. Furthermore, since punch-through between the source and the drain becomes liable to occur by employing a low impurity concentration substrate, it is necessary to make the effective MOS channel section gate length sufficiently long to the extent of, for example, 16-20 .mu.m, and so, the on-resistance at the effective MOS channel section also cannot be lowered.
Still further, in the case of N-channel insulated gate field effect transistors which necessitate a high substrate impurity concentration for an enhancement operation, realization of high voltage transistors having an offset gate structure was difficult. For instance, assuming that an impurity concentration of an N-type bulk silicon substrate is (5-7).times.10.sup.14 cm.sup.-3, P.sup.+ -ype source and drain regions having an impurity concentration of 10.sup.19 -10.sup.20 cm.sup.-3 are formed in the substrate at a depth of 2.4 .mu.m, a P-type extension drain region of 30 .mu.m in length and 0.4 .mu.m in depth is provided with an impurity concentration 2.times.10.sup.16 cm.sup.-3, and a channel length is selected to be 20 .mu.m. Then a breakdown voltage of 250-300 V can be obtained, but a sheet resistivity R.quadrature. in the extension drain region becomes as high as 20 K.OMEGA./.quadrature.-26 K.OMEGA./.quadrature., and therefore an on-resistance Ron of the transistor becomes a high level. On the other hand, if the impurity concentration of the extension drain region is selected to be, for example, 4.times.10.sup.16 cm.sup.-3 for the purpose of lowering the ON-resistance, the the sheet resistivity R.quadrature. of the extension drain region can be lowered to 10 K.OMEGA./.quadrature.-16 K.OMEGA./.quadrature.. However, in this case, in view of the necessity for the inherent operation of the offset gate structure transistors that the extension drain region must be pinched off before the divided voltage which is applied across the MOS channel section reaches the insulation breakdown voltage of that section, the impurity concentration of the bulk silicon substrate must be 3.times.10.sup.15 cm.sup.-3 or higher. Accordingly, the breakdown voltage takes a value of 100 V or lower, and no longer the transistor can be a high voltage MOS EFT.
In addition, the above-described prior art in which the substrate impurity concentration must be selected as low as (5-7).times.10.sup.14 cm.sup.-3, is not adaptive to the N-channel NOS FET. If it is necessary to attain a further enhanced breakdown voltage, it is required to further lower the impurity concentration of the substrate, and thus it is necessitated to suppress the ion does implanted to the offset gate section to a lower value and to select the MOS gate length longer, so that the on-resistance of the insulated gate field effect transistors is inevitably raised. Such an offset gate type transistor in the prior art is disclosed, for example, in "Proceedings of the 6th Conference on Solid State Devices, Tokyo, 1974" Supplement to the Journal of the Japan Society of Applied Physics, Vol. 44, 1975 pp. 249-255. | {
"pile_set_name": "USPTO Backgrounds"
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The present invention relates to a flatbed system for flatbed scanners which consists of four optical units that can be moved relative to the image sensor to change the object distance and the image distance so as to adjust the resolution.
FIG. 1 shows the arrangement of the optical system 20 of a conventional flatbed scanner. This optical system 20 comprises a light source 101, a first reflector 102, a second reflector 103, a third reflector 104, a lens 105, and a CCD (charge-coupled device) 106. The reflectors 102-104, the lens 105 and the CCD 106 are fixed in place. When the optical scanner is operated, the optical system 20 is moved by a step motor through a transmission belt to scan the document. This optical system 20 is heavy, and therefore the power consumption problem is very serious during the operation of the optical scanner. Because the position of the optical system changes continuously during scanning, a flat cable is needed to transmit signals from the CCD 106 to the main board. In order to increase signal transmission speed, the frequency must be relatively increased. When the frequency is increased, the flat cable will cause a relatively serious radiation problem, and this radiation problem must be settled. Furthermore, because the flat cable is moved back and forth frequently, contact errors tend to occur. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field
One or more embodiments of the present invention relate to an operating system for driving an embedded system such as in a mobile device, a multimedia device, a home device, and the like, and more particularly, to a method and apparatus for migrating at least one task so that the task can be performed in a suitable core in an operating system for driving a computer system such as a computer, a notebook, and the like that contains a multi-core.
2. Description of the Related Art
Multi-core platforms have become important due to the performance limitation of single cores in processor technology that has developed through performance/speed competition of cores. Furthermore, it is expected that development will be from multi-core platforms to many-core platforms that use several tens or hundreds of cores.
An operating system assigns each task that is to be performed to each core and schedules each task according to a priority of each task in order to perform multi-tasking in a current multi-core platform. In this regard, a static method and a dynamic method are used to determine in which one of a plurality of cores each task is to be performed and to assign each task to a corresponding core.
In a static method, a core in which a task is to be performed is static and does not change. In more detail, if a task is initially assigned to a core, the core performs the task until it is completed. In a dynamic method, a task migrates to several cores while being performed according to the load of a system or a change in the constitution of an application thereof. In more detail, even if a task is initially assigned to a predetermined core, the task can be performed in another core according to a next situation.
As described above, the static method is used for simple scheduling due to the non-migration of a task, whereas it is not used to actively change a plurality of cores, which reduces utilization of each core and does not cope with dynamic environmental variation. A flexible system is needed to meet a user's various requirements. To this end, a method of dynamically coping with the load of the flexible system or a change in the constitution of an application thereof is required to perform tasks.
However, a task must migrate from an initially assigned predetermined core to another core in order to dynamically change an assignment of the task. In this regard, it is very important to reduce migration costs of resources. In particular, an embedded system that performs a real-time task such as a multimedia task must continue to provide a service in spite of migration of the task. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
This invention pertains to methods and apparatus for vacuum forming an elastomeric transport tire containing a core of belts, plies and beads.
2. Prior Art
The present invention is in a new and unique vacuum forming apparatus for use in an automated method for forming a transport tire from an elastomeric material that includes a core of optimally positioned belts, plies and beads, to provide a balanced transport tire.
Heretofore it was recognized that venting air from a tire tread mold cavity early in a casting process could eliminate the necessity for venting the cavity through spaced holes in the mold that materials from the tread flowed into during casting and formed projections or “tits”. Such extensions or ‘tits’ projected from the tread surface and were either pulled off when the tire was removed from the mold, had to be cut off or wore off during tire use. To prevent this undesirable cosmetic anomaly it was recognized that air could be vented from the mold cavity just before tread casting, eliminating a necessity for providing flow passages or vents from the tire tread mold while still obtaining a smooth, un-pocketed or un-blemished, finished tread surface. Examples of such an introduction of a vacuum into a tire mold just prior to forming a tire tread are shown in U.S. Pat. Nos. 4,573,894 and 5,152,951.
U.S. Pat. No. 4,573,394 sets out a tire mold having a cavity that is for receiving and finally shaping the tire. The patent is defined by a surface that is for contacting the exterior of the tire during tire curing. The cavity is fluid connected to a single vacuum source for evacuating air from within the cavity during an early portion of a tire curing cycle to prevent air and any other fluid from becoming trapped between the tire and the surface that defines the cavity that will become the tire tread. Visual effects in the form of voids in the tire exterior are, thus eliminated.
Like the '894 patent, U.S. Pat. No. 5,152,951 also provides for the elimination of fluid from the mold cavity during an early portion of a tire curing cycle. The patent provides for fluid evacuation through a space between the surfaces of the mold parts that defines the mold parting line region. Both patents provide a single vacuum source and its connection to the mold cavity for forming the tire side wall and tread surfaces. Whereas, the present invention provides for both an evacuation of air from the elastomeric mixture prior to its introduction into the mold cavity, and for pulling the air free mixture through the mold. With that flow filling the area between inner and outer mold walls, traveling through the core of plies, belts and beads, to form a finished transport tire that is free of voids or pockets.
A core of plies, belts and beads for use in the vacuum forming apparatus of the invention is set out in a U.S. patent application for a “Tire Core Package for Use in Manufacturing a Tire With Belts, Plies and Beads and Process of Tire Manufacture” Ser. No. 10/143,678, filed May 13, 2002, of two of the inventor, and is presently pending. This patent application sets out a process, utilizing a sandwich of pre-cured elastomer layers between layers of plies and belts formed over a mandrel for fitting into a mold, for forming a tire utilizing a spin casting method. Also, one of the inventors of the present application is the sole inventor of a U.S. patent application for an “Elastomeric Tire With Arch Shaped Shoulders” filed May 28, 2004, assigned Ser. No. 10/856,652.
The present invention is a new approach to forming a transport tire from an elastomeric material from earlier patent applications for spin casting apparatus and methods for use in such spin casting apparatus for forming a transport tire that are shown and discussed in a recently filed U.S. patent applications of two of the inventors, entitled, “Method and Apparatus for Forming a Core of Plies, Belts and Beads and For Positioning the Core in a Mold For Forming an Elastomeric Tire and the Formed Elastomeric Tire”, filed Jun. 4, 2004, Assigned Ser. No. 10/860,997, and an “Improved Method and Apparatus for Forming a Core of Plies, Belts and Beads and for Positioning the Core in a Mold for Forming an Elastomeric Tire”, filed Aug. 2, 2004, assigned Ser. No. 10/809/807. All of which earlier patents are directed to spin casting methods and apparatus and do not involve a vacuum forming apparatus and method as does the present invention. | {
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Chemical mechanical Polish (CMP) processes are widely used in the fabrication of integrated circuits. When an integrated circuit is built up layer by layer on the surface of a semiconductor wafer, CMP processes are used to planarize the topmost layer to provide a planar surface for subsequent fabrication steps. CMP processes are carried out polishing the wafer surface against a polish pad. A slurry containing both abrasive particles and reactive chemicals is applied to the polish pad. The relative movement of the polish pad and wafer surface coupled with the reactive chemicals in the slurry allows the CMP process to planarize the wafer surface by means of both physical and chemical forces.
CMP processes can be used for the fabrication of various components of an integrated circuit. For example, CMP processes may be used to planarize inter-level dielectric layers and inter-metal dielectric layers. CMP processed are also commonly used in the formation of the copper lines that interconnect the components of integrated circuits.
After a CMP process, the surface of the wafer, on which the CMP process has been performed, is cleaned to remove residues. The residues may include organic matters and particles. In recent generations of integrated circuits, the sizes of the integrated circuit devices are reduced to a very small scale. This posts a demanding requirement to the post-CMP cleaning than for older generations of integrated circuits. For example, the sizes of the metal particles that remain after the post-CMP cleaning cannot exceed a half of the critical dimension (the gate length) of the transistors on the wafer. Obviously, with the reduction of the sizes of the integrated circuit devices, such requirement is tightened.
In conventional post-CMP cleaning, brushes were used to remove the residues on the wafers. | {
"pile_set_name": "USPTO Backgrounds"
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Flexibility in base station design is a desirable feature sought by service providers. Base station design flexibility affords the service providers the opportunity to customize base station installations for a variety of circumstances. One manner of achieving flexibility in wireless communication systems based on the well-known code division multiple access (CDMA) technique is to separate a base station's digital components, such as CDMA channel units having a plurality of channel elements, from a base station's radio frequency (RF) components, such as radio units. Separating the digital components from the RF components allows, for example, the RF components to be mounted at the top of a pole and the digital components to be mounted at the base of the pole. A transmission medium, such as an optical fiber, is used to transport data between the RF and digital components. | {
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Advances in microelectronic technology have cause integrated circuits (ICs) to be formed on microelectronic substrates (e.g., semiconductor substrates) with ever increasing density of active components. IC manufacturing may be carried out by the application and selective removal of various materials on the microelectronic substrate. One aspect of the manufacturing process may include exposing the surface of the microelectronic substrate cleaning treatments to remove process residue and/or debris (e.g., particles) from the microelectronic substrate. Various dry and wet cleaning techniques have been developed to clean microelectronic substrates.
However, the advances of microelectronic IC manufacturing have led to smaller device features on the substrate. The smaller device features have made the devices more susceptible to damage from smaller particles than in the past. Hence, any techniques that enable the removal of smaller particles, and/or relatively larger particles, without damaging the substrate would be desirable. | {
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1. Field of Invention
This invention relates to novelty devices, specifically to water-actuated novelty devices that feature an erectile member.
2. Prior Art
Various novelty devices are known wherein the application of water causes the device to perform a mechanical function. For example, U.S. Pat. No. 4,529,569 to Palau discloses a method for making objects that expand when immersed in water. Both U.S. Pat. No. 6,389,718 to Joo and U.S. Pat. No. 5,946,835 to Boyd disclose ways of making an artificial flower that blooms when given water. And U.S. Pat. No. 4,986,531 to Snaper, et al. discloses a telescoping device that elongates when placed in water. None of these inventions, however, disclose a water-actuated flexible member that changes its state from flaccid to erect upon the application of water.
The present invention makes special use of a hydrophilic material placed inside a flexible tube. Upon absorbing water, the hydrophilic material swells; this internally pressurizes the tube, causing it to become erect. While the principle of internally pressurizing a flexible tube to induce erection is well-known in the arts, the present invention distinguishes itself by the technique used to achieve that result. For example, U.S. Pat. No. 4,574,792 to Trick discloses a penile implant that achieves erection by having a fluid pumped into it. While the penile implant requires the use of a pump, the erectile device of the present invention needs only the application of water.
One embodiment of the present invention is an artificial flower with an erectile stem. In this embodiment, a desirable feature is for the flower to be able to dispense a floral scent or other fragrance. Various inventors have sought to combine scent-dispensing mechanisms with artificial flowers. See, for example, U.S. Pat. No. 6,830,733 to Stanley, III; U.S. Pat. No. 5,077,102 to Chong; and U.S. Pat. No. 3,861,991 to Kim. However, none of these inventions describe a scent-dispensing mechanism combined with an artificial flower that has an erectile stem. | {
"pile_set_name": "USPTO Backgrounds"
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The continuous reduction in reserves of fossil fuels (coal, oil, and natural gas) and the environmental pollution caused by use of fossil fuel directly threaten the survival and development of the human race. Thus, various countries' attentions are being paid to the development of renewable and environment-friendly energy.
Bio-mass is an organic material derived through photosynthesis of a plant. Since bio-mass is widely distributed and used, is cleaner than fossil fuel, and generates no CO2, bio-mass attracts much attention as an important renewable energy. Bio-mass can be converted into synthetic gas or liquefied fuel through such a method as thermal chemistry or biochemistry, and can be applied to power generation, industrial fuel, or chemical industry products. Thus, bio-mass may replace a considerable amount of fossil fuel without changing the existing energy conversion systems. Therefore, bio-mass is being preferentially developed by various countries.
Bio-mass may be converted into synthetic gas or liquefied fuel through various kinds of methods, and the bio-mass gasification technology is viable for a larger number of types of available bio-masses and has greater expandability than other technologies.
The gasification process for bio-mass is performed through a thermal-chemistry conversion process in which a solid bio-mass material and a gasification agent (air, oxygen, vapor, or carbon dioxide) produce a chemical reaction under a high-temperature condition such that the solid bio-mass material is converted into a gas mixture based on hydrocarbon containing carbon, hydrogen, and oxygen. The gas mixture is typically referred to as synthetic gas.
The composition of the synthetic gas generated during the gasification process may be primarily influenced by the material characteristics of the bio-mass used during the gasification process, and differ depending on the type of the gasification agent, the type of a gasifier, and the reaction condition of temperature and pressure. The basic purpose of gasification is to obtain a desired synthetic gas composition, reduce the content of tar oil during the gasification, and maximize the gasification efficiency of the system, the carbon conversion rate, and the content of CO and H2 in the synthetic gas.
In order to accomplish the above-described purpose, an entrained-flow flow gasifier and a fluidized-bed gasifier are provided.
The entrained-flow gasifier sprays pulverized fuel in several tens to hundreds of m with an oxidizing agent so as to form a high-temperature combustion zone at 1,600 degrees or more, and injects a large amount of pulverized fuel around the high-temperature combustion zone so as to perform gasification. The entrained-flow gasifier is mainly utilized for gasifying coal which may be easily pulverized, but bio-mass, bio-mass char, and pre-processed high water content bio-mass (dried sewage sludge) may be pulverized and utilized. Since the entrained-flow gasifier has a simple structure, the entrained-flow gasifier may be easily applied to a pressurized gasification system which can be operated at high pressure.
The fluidized-bed gasifier may use fuel in several mm to several cm, and use sand as a heat medium and a fluidizing material. Thus, the fluidized-bed gasifier is utilized for gasifying a waste material having various properties and a low heat value (or a significant variation in heat value), bio-mass, and low-grade coal which cannot be utilized as pulverized fuel.
In order to operate the fluidized-bed gasifier, gas with a predetermined pressure, a predetermined flow rate, and a predetermined temperature or more is required for fluidization, and a fluidized-bed gasification agent is supplied through a distributor so as to perform gasification.
The synthetic gas generated from the gasification system is refined and used as fuel or utilized for producing a chemical material through a catalyst conversion process. During this process, it is necessary to treat tar, unburned matter, or dust which may be formed within the synthetic gas.
During the refining process, however, the synthetic gas is cooled down. At this time, sensible heat escaping during the refining process may be reused through waste heat recovery, but waste heat recovery efficiency is not very high. | {
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It is common to keep domesticated cats almost exclusively indoors. Thus cats are easily trained to relieve themselves in a given location, such as a litter box filled with an absorbent, granular material or “litter.” A conventional cat litter box receives litter into which a cat evacuates, the litter functioning to absorb moisture and form clumps for removal. Unfortunately, keeping the soiled litter inside the litter box is a problem, since cats tend to scratch and shift the litter to cover the eliminated waste, which causes litter to spray out of the cat litter box. Furthermore, litter particles stick to the cat's paws and are thus carried out of the litter tray by the cat into the surrounding room, resulting in the need for frequent cleaning of the room.
Many attempts have been made to keep the litter from the box from spreading around the surrounding room. For instance, U.S. Pat. No. 5,676,090, issued to Earl W. Cannady, Jr. on Oct. 14, 1997, discloses a SCATTER-RESISTANT LITTER BOX. Cannady presents an enclosed base unit with an opening in one end of the cover unit. A raised ramp below the opening is covered with a carpet like material to trap litter carried on an animal's feet, thereby preventing the litter from being carried from the box. Other solutions are seen in, for example, U.S. Pat. No. 5,092,277 to Baillie, U.S. Pat. No. 6,371,048 to Smith, and U.S. Pat. No. 6,412,440 to Kobayashi, and in U.S. Patent Publication No. 2009/0250014 to Juan.
Despite the wide variety of cat litter box designs that have been developed over the years in an attempt to reduce litter mess, there remains a need for a more effective and economical model. Furthermore, there remains a need for methods of use of new cat litter boxes which will speed acceptance by the cat. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
This invention relates to a fine copper powder suitable for use as filler in a conductive paste or the like, particularly to such a copper powder having improved weatherability.
2. Background Art
Conductive pastes are widely used for forming electronic circuits and the external electrodes of ceramic capacitors. Typical conductive fillers used in conductive pastes include copper, nickel, silver and the like. Among these, copper is used extensively nowadays because it is inexpensive, low in resistance and excellent in anti-migration property. A conductive filler comprising a mixture of copper powders of various particle diameters is usually used in a conductive paste for the external electrodes of a ceramic capacitor. However, in order to form a dense film for improving electrode reliability, the copper powder prior to mixing needs to be one of high fineness, e.g., of a particle diameter of not greater than 0.5 μm, and of uniform particle size.
Methods available for copper powder production include, for example, the atomization process, mechanical crushing process, electrolytic deposition process, vapor deposition process and wet reduction process. The wet reduction process is the main one used today because it is superior in the point of enabling efficient production of a copper powder that is composed of fine spherical particles having a narrow particle size distribution and, as such, is suitable for use in a conductive paste. For example, the prior art includes processes for obtaining fine copper powder by using hydrazine to reduce copper oxide, as taught by JP 10-330801A, JP 1-290706A and JP 5-57324B. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The present invention relates to a developer supplying container, and more specifically relates to a developer supplying container used in connection with a developing device or image forming apparatus employing said developing device.
2. Description of the Related Art
Developer supplying containers have been proposed wherein a container accommodating developer is connected to a developing device or image forming apparatus in a state such that a container aperture is downward facing so that the developer accommodated within the container is supplied to a developing device by falling through said aperture.
Japanese Laid-Open Patent Application Nos. SHO53-146639 and HEI3-2881 disclose developer supplying containers which transport the developer accommodated within the container along a spiral channel via the rotation of the cylindrical container provided with a spiral channel, such that said developer is delivered outside the container from an aperture provided at one end of said container. The aforesaid developer supplying containers are advantageous in that there is scant possibility of soiling the interior of the image forming apparatus or the clothing of a user due to overflow of the developer from the aforesaid aperture when installing or removing the container because the container is connected to the image forming apparatus in a horizontal state.
In the aforesaid developer supplying containers, the developer accommodated within the container is gradually supplied to the developing device so as to be depleted in accordance with the consumption of the developer by the image forming apparatus (developing device). When all of the developer accommodated within the container has been supplied to the developing device, the old empty container is removed from the image forming apparatus or the like and replaced by a new container loaded with developer.
Because toner replenishment is accomplished by replacing the container in the previously described methods, it is necessary to replace the container after all the developer accommodated within the container is supplied to the developing device and said container becomes empty so as not to waste developer remaining in the container. Therefore, the time of developer replenishment is actually limited to times when developer within the developer supplying container is completely depleted, which is disadvantageous from a maintenance perspective.
In copying apparatus, for example, service personnel from the manufacturer or dealer periodically visit the user for typical maintenance procedures such as spot inspections, parts replacement, developer replenishment and the like. At such times, the previously described methods are not capable of toner replenishment even when the developer within the developer supplying container is depleted to the extent that there is not sufficient remaining developer to last until the next service visit, thereby necessitating another visit by service personnel at a later date simply to replenish the developer, i.e., replace the container, or the user himself must replace the container. Since the replacement period is limited, developer replenishment cannot be accomplished with operational efficiency and user convenience even though the user performs the replacement. | {
"pile_set_name": "USPTO Backgrounds"
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The present invention relates to a radar antenna arrangement for radar sensors for motor vehicles, which enable a rotation of the antenna characteristics.
A leaky wave antenna arrangement is known from U.S. Pat. No. 5,572,228 and U.S. Pat. No. 621,186, which is realised as a mechanically rotating antenna, whereby it enables a surface-structured drum to be rotated in immediate proximity to a dielectric waveguide. Here, the surface structure of the drum in U.S. Pat. No. 557,228 is structured from individual metal strips, the distance of which changes when the drum is rotated in the area of the dielectric waveguide. As a result, a rotation angle-dependent power decoupling is produced via a so-called leaky wave from the dielectric waveguide. The decoupled power is in each case distributed in the area in the form of irradiation which can be described by an adjusted antenna characteristic, which is referred to below as the lobe, the maximum intensity of which is thus dependant on the respective angle of rotation of the drum. The polarisation of the radiated wave is here oriented in parallel with the metal strips which are present on the drum.
An alternative embodiment of the drum is described in U.S. Pat. No. 621,186. There, the surface structure is formed from individual rows of elements such as elevations and indentations in the drum, with appropriately selected dimensions with reference to their length and width. As a result of a corresponding design, a targeted influencing of the polarisation plane of the radiated lobes is possible. However, due to the structure with individual rows of elements on the drum, a discrete rotation of the lobe results, whereby in contrast, the above-mentioned embodiment also enables a continuous rotation.
The basic principle of the dielectric waveguide which is disturbed by a variable, structured surface for the purpose of radiating a leak wave has already been disclosed in WO 87/01243.
Alongside the above-mentioned restrictions with regard to polarisation and, in the second case, discrete rotation, the dielectric waveguide contained in the arrangement represents a particular difficulty with respect to the practical realisation of the antenna, which must at least be arranged to a high degree of precision (also under ambient influences such as temperature and vibration) over certain lengths, in such a manner that it is freely suspended in immediate proximity to the drum.
In the orthogonal plane to the plane of rotation of the lobe (section plane through the drum and the dielectric guide), a very broad characteristic of the lobe furthermore results due to the geometry of the dielectric guide, which must be bundled by an additional reflector and/or microwave lens. This produces a highly excessive size of the entire antenna arrangement which unacceptable in particular for motor vehicle applications.
The object of the present invention is to provide a radar antenna arrangement which is suitable for use in a radar sensor for motor vehicle applications. | {
"pile_set_name": "USPTO Backgrounds"
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This invention relates to sterilizing articles utilizing sterilization wrap. More particularly, it relates to sterilization wrap having two plies of sterilization material.
Reusable medical instruments must be sterilized prior to each use. Normally, these instruments are sterilized by steam or ethylene-oxide. In order for the instruments to remain sterile after the sterilization procedure, the instruments must be wrapped in a material called xe2x80x9csterilization wrapxe2x80x9d.
The most common type of sterilization wrap is a three-ply laminate consisting of a layer of melt blown polypropylene sandwiched between two layers of spun bond polypropylene. The wrap includes bond points all across the face of the material so that the material is held together, i.e., laminated. This three-ply material is commonly referred to as xe2x80x9cSMSxe2x80x9d, which is short for spun bondxe2x80x94melt blownxe2x80x94spun bond. Most hospitals specify SMS as the sterilization wrap to be used because SMS is sufficiently porous to permit steam and ethylene-oxide to penetrate through the material to the surgical instruments, but has filtration properties sufficient to prevent the passage of most pathogens therethrough.
In most hospitals, there is a protocol which requires surgical instruments to be wrapped with two separate sheets of SMS so that in the event one sheet becomes torn, there is a redundancy which will maintain the sterility of the surgical instruments. The wrapping of surgical instruments with two separate sheets of sterilization wrap obviously is labor intensive in that the nurse must first place the instruments on one sheet of sterilization material and wrap the instruments, and then place the wrapped package on another sheet of sterilization material and wrap the instruments again.
In an attempt to reduce the labor required to provide dual wrapping of surgical instruments, Kimberly-Clark Corporation has developed a product called xe2x80x9cOne Step Sterilization Wrapxe2x80x9d. One Step Sterilization Wrap is made by bonding two separate sheets of sterilization wrap together. The Kimberly-Clark One Step product is described in U.S. Pat. Nos. 5,635,134 and 5,688,476. However, because the One Step wrap requires separate sheets to be bonded together, manufacturing costs are substantially increased. In addition, it requires precise alignment of the two separate movable sheets during the bonding process.
Thus there is a need for a sterilization wrap which provides two layers of protection, yet is inexpensive to manufacture and is easy to use.
It is therefore one object of this invention to provide an improved two-ply sterilization wrap.
It is another object of this invention to provide a two-ply sterilization wrap which is inexpensive to manufacture and is easy to use.
It is still another object of this invention to provide an improved method for sterilizing an article utilizing an improved two-ply sterilization wrap.
In accordance with one form of this invention, there is provided a sterilization wrap made from a single sheet of sterilization material. The sheet has first, second, third and fourth edges. The sheet is folded in half forming first and second overlapping panels and two layers of sterilization material. The fold runs from the third edge to the fourth edge. Because of the fold, the first edge is adjacent to the second edge and thus two layers of sterilization material are provided for an article to be sterilized by using a single sheet of sterilization material. The two panels may be affixed together along the first and second edges.
In addition, the third edge includes first and second portions and the fourth edge also includes first and second portions. The first panel may be also affixed to the second panel by bonding the first portion of the third edge to the second portion of the third edge, and by bonding the first portion of the fourth edge to the second portion of the third edge. In addition, the two panels may be affixed together by bonding adjacent to the fold.
In accordance with another form of this invention, there is provided a two-ply sterilization wrap made from a single sheet of sterilization material. The sheet is folded in half forming first and second overlapping equally sized panels. Each panel has edges. The first panel is bonded to the second panel so that the edges of the first panel remain adjacent to the edges of the second panel.
In accordance with another form of this invention, there is provided a two-ply sterilization wrap made from a single sheet of sterilization material. The sheet includes two folds. The sheet includes first, second, third and fourth edges. The first edge is adjacent to the second edge, and the third and fourth edges are opposite from one another. The folded sheet forms two adjacent equally sized panels. The first and second edges form an overlapping region. The first and second edges are bonded together along the overlapping region. The third edge includes first and second adjacent portions, and the fourth edge includes first and second adjacent portions. The first portion of the third edge may be bonded to the second portion of the third edge, and the first portion of the fourth edge may be bonded to the second portion of the fourth edge.
In accordance with another form of this invention, there is provided a method for sterilizing an article, including the steps of providing an article, wrapping the articles with sterilization wrap which is formed in accordance with one or more of the above described designs, and applying sterilization conditions to the wrapped article. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The present invention relates to a loudspeaker used as audio equipment, in particular to a loudspeaker having an edge at an outer periphery of a diaphragm, wherein an outer end of the edge is attached on an attaching surface which is formed at the inside of an outer peripheral rim of a speaker frame.
The present application claims priority from Japanese Application No. 2001-304862, the disclosure of which is incorporated herein by reference for all purposes.
2. Description of the Related Art
A conventional loudspeaker for reproducing music or the like has a basic structure as shown in FIG. 4. FIG. 4a is a top plan view, and FIG. 4b is a sectional view taken along a line xxe2x80x94x of FIG. 4a. In FIGS. 4a and 4b, a magnetic circuit 1 comprises a magnet 2, a lower plate 3, and an upper plate 4. In the magnetic circuit 1, a gap between magnetic poles is formed between the upper plate 4 and a center pole 5 which stands straight from a center position of the lower plate 3. A coil bobbin 6 which sets a voice coil 7 by winding is located so as to arrange the voice coil 7 within the gap between the magnetic poles. A center cap 8 is mounted upon an upper end of the coil bobbin 6. At the vicinity of the upper end of the coil bobbin 6, a center portion of a diaphragm 9 is fixed. An annular edge 12 is connected with an outer periphery of the diaphragm 9. The diaphragm 9 is attached on an upper portion of a speaker frame 10, which is provided on the upper plate 4, through the edge 12.
On the upper portion of the speaker frame 10 is formed an outer peripheral rim 10a, which has an attaching surface 10b inside it. At the outer end of the edge 12 is formed an outer end portion 12a, which is mounted on the attaching surface 10b as a part of the speaker frame 10. The outer end portion 12a is pressed down onto the attaching surface 10b by a gasket 13, which is also attached onto the attaching surface 10b, so as to be airtightly attached onto the attaching surface 10b.
In addition, one end of a damper 11 is connected with the coil bobbin 6, and the other end thereof is supported by a damper supporting section 11a, which is connected with the speaker frame 10, so that the voice coil 7 can be accurately held within the gap between the magnetic poles of the magnetic circuit 1.
In such a configured loudspeaker, the coil bobbin 6 is oscillated according to driving signals supplied to the voice coil 7. The diaphragm 9, which is supported by the damper 11 and the edge 12 having a function of suspension, is oscillated by the oscillation of the coil bobbin 6, thereby reproducing sound based on sound signals supplied to the voice coil 7.
In the conventional loudspeaker as mentioned above, an attaching screw section 14 for attaching the speaker frame 10 onto a baffle plate or the other housing is formed on the attaching surface 10b of the speaker frame 10. The gasket 13 has a notch 13a which corresponds to the attaching screw section 14. An outer peripheral surface of the gasket 13 is abutted to an inside of the outer peripheral rim 10a of the speaker frame 10, thereby positioning the edge 12 which is fixed by the gasket 13.
According to such a structure of the speaker, a size of the speaker frame 10 can be set by making the best use of a speaker setting area on a baffle plate or the other housing since the attaching screw section 14 is provided inside the outer peripheral rim 10a of the speaker frame 10. However, since the gasket 13 is provided inside the outer peripheral rim 10a of the speaker frame 10 to fix the edge 12, an outer diameter Lxe2x80x2 formed by the edge 12 and the diaphragm 9 is restricted by a width of the gasket 13. As a result, an inside area of the speaker frame 10 can not be effectively utilized as an oscillation area formed by the diaphragm 9 or the like. In other words, since an outputted sound pressure level of the speaker is in the relation of function with the oscillation area, the conventional structure of loudspeaker has any problem that it is difficult to obtain the enough level of the outputted sound pressure which corresponds to the inside area of the speaker frame 10.
Further, since the gasket 13 is used for positioning and fixing the outer end of the edge 12 in this case, the number of parts are increased to cause a cost-up.
The present invention has been proposed in order to settle the above-mentioned problems. An object of the present invention is to provide a loudspeaker which can obtain an enough level of outputted sound pressure by means of effectively utilizing the inside area of the speaker frame as the oscillation area, and which can reduce the number of parts by the non-use of gasket.
According to the first aspect of the present invention, there is provided a loudspeaker comprising an edge at an outer periphery of a diaphragm, in which an outer end portion of the edge is attached upon an attaching surface formed at an inside of an outer peripheral rim of a speaker frame, wherein the outer end portion is formed with a direction to the inside from the outer most periphery of the edge, and has an outer periphery surface which is allowed to abut on the outer peripheral rim of the speaker frame.
According to the second aspect of the present invention, there is provided a speaker including the first aspect, further comprising an attaching screw section of the speaker frame provided on the attaching surface, wherein the outer end portion has a thicker wall portion than a thickness of a screw head of the attaching screw section, and a notch for avoiding the attaching screw section.
According to such a construction, the present invention performs the following function.
According to the first aspect of the present invention, the outer end portion, which is provided at an outer end of the edge, is formed with a direction to the inside from the outer most periphery of the edge, and is attached onto the attaching surface of the speaker frame. Thus, the outer periphery of the edge is allowed to approach the outer peripheral rim of the speaker frame as much as possible, thereby enlarging an outer diameter composed of the diaphragm and the edge to the maximum of the speaker frame. Consequently, the inside area of the speaker frame is effectively utilized as the oscillation area, so that enough level of outputted sound pressure can be secured.
In addition, since the outer peripheral surface of the outer end portion of the edge is allowed to abut on the outer peripheral rim of the speaker frame to perform the positioning of the edge, the positioning according to a gasket is unnecessary, and then the number of parts can be reduced.
According to the second aspect, in addition to the above function, a size of the speaker frame can be set largely by making the best use of a speaker setting area on a baffle plate or the other housing since the attaching screw section is provided inside the outer peripheral rim of the speaker frame. Further, the inside area of the speaker frame can be effectively utilized as the oscillation area.
Also, since the outer end portion formed at the outer end of the edge has a wall thickness thicker than the screw head of the attaching screw section, and the notch formed for avoiding the attaching screw section, the attaching screw can be prevented from exerting influence to the oscillation of the edge. In addition, according to the desired wall thickness of the outer end portion of the edge, the outer end portion can be bonded onto the attaching surface of the speaker frame, so that the same airtightness as one of gasket can be secured. | {
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The subject matter herein relates generally to photovoltaics modules, and more particularly, to connector assemblies for photovoltaic modules.
Photovoltaic (PV) modules or arrays produce electricity from solar energy. A photovoltaic module is the basic element of a photovoltaic power generation system. A PV module has many solar cells interconnected in series or parallel, according to the desired voltage and current parameters. PV cells are essentially large-area semiconductor diodes. PV cells are connected and placed between a polyvinyl plate on the bottom and a tempered glass on the top. PV cells are interconnected with thin contacts, or bussing foils, on the upper side of the semiconductor material.
PV modules/arrays require specially designed connectors adapted for interconnecting the various PV modules/arrays with each other, and with electrical power distribution systems. PV connection systems are used to accommodate serial and parallel connection of PV arrays. The connectors allow for field installation of made-to-length cable assemblies. The connectors are terminated to the bussing foils at ends of the bussing foils. Typically, the connectors are soldered to the bussing foils or secured to the bussing foils using a specially designed mechanical clamp. Automated connection to the bussing foils has heretofore proven difficult, making connection to the bussing foils is time consuming and expensive.
A need remains for a connector for a PV module that may be made in a cost effective and reliable manner. | {
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The present invention relates to a liquid crystal display device including an illumination unit.
Recently, as the characteristics of liquid crystal display devices have been improved, the range of application of liquid crystal display devices has increased. When liquid crystal display devices are used in toys, clocks, clerical machines, terminal units, automobiles, etc., it is necessary to provide an illumination device which is operable for long periods of time, which has a relatively large panel area, and which is decorative and efficient.
A liquid crystal display device having a backlight unit with a small lamp has been employed for wristwatches. The backlight for such a wristwatch display is used to illuminate the face of the watch to make it possible to read the time at night. Conventional types of backlights for liquid crystal display devices are not fully satisfactory in brightness, illumination intensity uniformity and decorative effect. Accordingly, it would be desirable to provide a liquid crystal display device with a backlight which satisfies the above-described requirements, is thin, highly efficient and can be manufactured at a low cost. | {
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Pull-on disposable diapers are conventionally used.
The pull-on disposable diapers each include a lengthwise direction and a lateral direction orthogonal to each other. Furthermore, the diapers each include a front side portion located on a front side of a wearer, a back side portion located on a back side of the wearer, and a crotch portion located at a crotch part of the wearer. The front side portion and the back side portion are continuous at respective positions of both ends in the lateral direction, thereby forming a waist opening on one side in the lengthwise direction. Moreover, the front side portion and the back side portion are continuous through the crotch portion on another side in the lengthwise direction, thereby forming a pair of leg openings on both sides in the lateral direction of the crotch portion.
FIG. 1A and FIG. 1B are explanatory views of disposal treatment that is performed after using a diaper 1′.
Firstly, as illustrated in FIG. 1A, the diaper 1′ is rolled in the lengthwise direction from a crotch portion 20′ side in the lengthwise direction while making a front side portion 30′ inside, so that the diaper 1′ is made in a compact state with a small size in the lengthwise direction as illustrated in FIG. 1B. Next, a post-treatment tape 48′ provided on a non-skin side surface of a back side portion 40′ is extended toward a waist opening BH′, and thus the post-treatment tape 48′ extends beyond edge portions 30BH′, 40BH′ of the waist opening BH′ in the lengthwise direction. Then, an end portion 48e′ of the post-treatment tape 48′ in the lengthwise direction is fastened with adhesive layer or the like of the end portion 48e′ at a part 1p′ of the diaper, which is located beyond the edge portions 30BH′, 40BH′. Accordingly, the diaper 1′ is held in the above-stated compact state to be disposed of (PTL 1). | {
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It is common practice to dispense cheese sauce, ketchup, mustard, and other flowable food products from a package (e.g., a flexible bag or other similar container) using a pump-like dispensing device. In order to prevent bacterial growth in low acid food products, such as cheese sauce, those products should be maintained at or above an elevated temperature (e.g., 140° F.) after the package is opened.
One type of dispensing device widely used for low acid products has a water jacket which surrounds a large part of the package, and water in the water jacket is heated to the required temperature of the food product. A dispensing valve is typically coupled to the package to selectively dispense the flowable food product from the package. Such a dispensing valve is intended to be reused, and therefore should be cleaned after being removed from an empty package. Since the valve is intended to be reused, it is typically manufactured from a food-grade engineered resin capable of withstanding many heating and cooling cycles without substantially degrading due to the acidity of the food product. However, such a food-grade engineered resin is expensive, and the design of conventional valves incorporates multiple O-rings and additional components that increase the cost of the valves. | {
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The flight control of an aerial vehicle such as a UAV may be configured via combination of elevators, ailerons, rudders, and/or structural combinations: e.g., flaps and ailerons combined as flaperons; elevators and rudders combined as elevons, rudders and elevators combined as ruddervators. An airfoil for a UAV may include an actuator and a hinged flap that may be actuated about a hinge line to function as a control surface for a subsonic UAV. | {
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The present invention relates generally to games, but more particularly to horse racing games It is an improved race game with playing pieces representing horses that are moved over a playing board designed to represent dirt and turf race tracks.
The present invention is an improvement over previous race horse games because it more closely simulates an actual horse race by taking into account such factors as weather, the horses' training and capabilities relative to given track and weather conditions, events such as bumping and interference, and the excitement of photo finishes. | {
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Implantable stimulation devices are devices that generate and deliver electrical stimuli to body nerves and tissues for the therapy of various biological disorders, such as pacemakers to treat cardiac arrhythmia, defibrillators to treat cardiac fibrillation, cochlear stimulators to treat deafness, retinal stimulators to treat blindness, muscle stimulators to produce coordinated limb movement, spinal cord stimulators to treat chronic pain, cortical and deep brain stimulators to treat motor and psychological disorders, and other neural stimulators to treat urinary incontinence, sleep apnea, shoulder subluxation, etc. FIG. 1 shows an implantable stimulation device 1 as may be used for spinal cord stimulation or deep brain stimulation. Such a device 1 typically includes an Implantable Pulse Generator (IPG) 10, which includes a biocompatible device case 12 formed of a conductive material such as titanium for example. The case 12 typically holds the circuitry and battery necessary for the IPG 10 to function, although IPGs can also be powered via external RF energy and without a battery. The IPG 10 is coupled to electrodes 16 via one or more electrode leads 18, such that the electrodes 16 form an electrode array 20. The electrodes 16 are carried on a flexible body which also houses the individual signal wires 24 coupled to each electrode. In the illustrated embodiment, there are eight electrodes on each lead 18, although the number of leads and electrodes is application specific and therefore can vary. The leads 18 couple to the IPG 10 using lead connectors 26, which are fixed in a non-conductive header material 28, which can comprise an epoxy for example.
FIG. 2 shows a first embodiment 201 of implantable stimulation device implanted in a patient for deep brain stimulation and a second embodiment 202 implanted in the patient for spinal cord stimulation. For deep brain stimulation, the IPG 10 is typically embedded in the in the patient's chest inferior to the clavicle. The signal wires 24 are routed beneath the skin of the patient's neck and head and the leads 18 are implanted into the patient's brain 32. For spinal cord stimulation, the IPG 10 is typically embedded in the in the patient's buttock and the leads 18 are implanted into the patient's spinal column.
The implantable stimulation device may further comprise a handheld Remote Control (RC) (not shown) to remotely instruct the neurostimulator to generate electrical stimulation pulses in accordance with selected stimulation parameters. The RC is used to send data to and receive data from the IPG 10. For example, the RC can send programming data to the IPG 10 to dictate the therapy the IPG 10 will provide to the patient. Also, the RC can act as a receiver of data from the IPG 10, such as various data reporting on the IPG's status. Wireless data transfer between the IPG 10 and the RC can take place via magnetic inductive coupling. To implement such functionality, both the IPG 10 and the RC typically have electrical coils that can act as the transmitter or the receiver, thus allowing for two-way communication between the two devices, as is well known in the art.
IPGs are routinely implanted in patients who are in need of Magnetic Resonance Imaging (MRI). Thus, when designing implantable neurostimulation systems, consideration must be given to the possibility that the patient in which neurostimulator is implanted may be subjected to electro-magnetic forces generated by MRI scanners, which may potentially cause damage to the neurostimulator as well as discomfort to the patient. In particular, in MRI, spatial encoding relies on successively applying magnetic field gradients. The magnetic field strength is a function of position and time with the application of gradient fields throughout the imaging process. Gradient fields typically switch gradient coils (or magnets) ON and OFF thousands of times in the acquisition of a single image in the present of a large static magnetic field. Present-day MM scanners can have maximum gradient strengths of 100 mT/m and much faster switching times (slew rates) of 150 mT/m/ms, which is comparable to stimulation therapy frequencies. Typical MRI scanners create gradient fields in the range of 100 Hz to 30 KHz, and radio frequency (RF) fields of 64 MHz for a 1.5 Tesla scanner and 128 MHz for a 3 Tesla scanner.
The strength of the gradient magnetic field may be high enough to induce voltages (5-10 Volts depending on the orientation of the lead inside the body with respect to the MRI scanner) on to the stimulation lead(s) 18, which in turn, are seen by the IPG electronics. If these induced voltages are higher than the voltage supply rails of the IPG electronics, there could exist paths within the IPG that could induce current through the electrodes on the stimulation lead(s), which in turn, could cause unwanted stimulation to the patient due to the similar frequency band, between the MM-generated gradient field and intended stimulation energy frequencies for therapy, as well as potentially damaging the electronics within the IPG. The gradient (magnetic) field may induce electrical energy within the wires of the stimulation lead(s), which may be conveyed into the circuitry of the IPG and then out to the electrodes of the stimulation leads.
Accordingly, the IPG may feature an MM-safe mode that protects the IPG 10 and the patient from damage or injury due to magnetic field-induced electrical energy when the patient undergoes an MRI. For example, in MRI-safe mode, the IPG may cease providing stimulation to the patient. Additionally, (or alternatively) the IPG may increase the voltage within the IPG to prevent unwanted induced current through the IPG. The IPG may modify or suspend other operations, such as passive charge recovery, an operation whereby charge is passively conveyed to AC ground by closing switches associated with the active electrodes. Within an MRI, the closed switches may potentially provide a path for magnetically induced currents into and out of the IPG. The recovery switches are therefore left open during MRI-safe mode.
The IPG can be set to MM-safe mode using the RC. Additionally, some IPGs can be set to MM mode by placing a magnet against the patient's skin over the IPG. Some IPGs include internal magnetic sensors, typically Hall effect magnetic sensors, that are capable of sensing an external magnetic field, such as an MM field. Hall effect magnetic sensor have a limitation in that they are unidirectional. In other words, a Hall effect magnetic sensor is only effective when it is situated in a particular orientation with respect to the magnetic field. Therefore, a series of three orthogonally oriented Hall effect sensors must be used to reliably sense the presence of an external magnetic field. Such a sensor design is undesirably large. | {
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The instant invention relates generally to game boards and more particularly to a table top game board having a pair of folded alleys which meet at a common scoring region.
Table top game boards of various sizes and designs have long been popular as amusement devices. Frequently they are scaled down counterparts of games initially designed as outdoor games. Just as frequently they incorporate variations and additions either permitted or necessitated by their smaller size which add to the fun and challenge of playing.
One general class of games which has undergone such diminution, variation and addition are those which may be generally classified as alley or shuffle board games. Several such board games are the subjects of United States patents. For example, U.S. Pat. No. 2,312,882 illustrates a game board having a single alley bounded at one end and along portions of both sides by resilient bumpers. At the opposite end is a common shooting and scoring area delineated on three sides by a gutter. It is apparent that the common shooting and scoring area can inhibit certain plays and scoring strategies. U.S. Pat. No. 2,990,180 discloses a similar device having a centrally disposed divider which extends along a portion of the playing surface thereby dividing it into first and second shooting and scoring alleys. While this configuration separates the shooting and scoring areas of one player from those of the other, this separation may reduce the challenge of the game inasmuch as players are unable to displace the playing pieces of their opponents from one scoring location to another.
U.S. Pat. No. 3,174,752 teaches a variation of the above-discussed U.S. Pat. No. 2,990.180. Here, a pair of similar alleys are disposed at an acute angle to one another. A rebounding surface disposed across the intersecting common ends of both alleys is so positioned that is permits a single rebound return from the alley of one player to the alley of the other. U.S. Pat. No. 3,239,226 illustrates a miniature curling game table having a movable surface. A single alley includes a shooting area at one end and a circular scoring region at the other surrounded on three sides by rectilinear gutters. Table surfaces are movable to simulate the action of a curling stone on ice.
U.S. Pat. No. 3,762,711 discloses a portable shuffle board game having a single folded alley with adjacent shooting and scoring regions at one end of the game board and a rebounding barrier at the other. Although this device permits players to displace their opponent's pieces in the scoring region, both must use the same shooting alley which is inconvenient and which detracts from the competitive nature of such a game.
From a review of the foregoing devices disclosed in these United States patents, it becomes apparent that additional improvements in the art of table top amusement games are both possible and desirable. | {
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1. Field of Invention
The present invention relates to an active lock system with methods to authenticate users and provide guidance to operate the lock with security and privacy protection. The active lock is communication enabled using wireless communication technology responding to wireless phone calls to perform user identification verification and convenient and secure operation of the lock.
2. Description of the Art
In a society that security and privacy are important elements of life, people need locks for protecting their properties. Hence, numerous inventions on secured locks have been advanced ranging from mechanic locks, for example, bolt lock and double lock, to electronic locks, based on input device and electronic circuit to control the lock mechanism and to remote-control locks involving transmitter and receivers using coded signal such as those used in the car industry and security industry. Given the world is already equipped with various secured locks, mechanical, electronic and electromagnetic programmable locks; a simple and inexpensive system, based on the double lock concept is a desirable way to add security and privacy protection to a locked property and offer convenient but secure access control to such locked properties by keeping the key or code to the locked property locked up by another lock. This practice has been used in the real estate industry known as a “lock box”. The lock box usually contains a ‘key’ or ‘code’ to the already existing secured lock system but the lock box itself is controlled by another ‘key’ using conventional mechanical locks or controlled by a ‘code’ using resettable keyless locks, such as push button pins, keypads, rotating dials and the like.
This double lock concept protects the integrity of the original permanent lock system by avoiding duplications of many keys to the original lock. An inexpensive and portable lock may be used to provide an access to the key of the original lock system for permitted personnel. However, an operational deficiency of the system often causes inconvenience and security compromise. For example, in the real estate industry, many keys have to be made for a lock box placed on a house for sale since these lock box keys have to be distributed to many real estate agents to allow them to show the house to their clients at different times. This practice definitely causes inconvenience. Any agent wishes to show several houses needs to visit the listing realtor's office to get a key for each lock box placed on each house the agent's clients may be interested in. There are potential security problems with too many keys circulating. A more sophisticated lock box uses a keyless lock system, but it still requires an agent to either go to the office to obtain the code before visiting a house or to call the office when the agent is at the house to obtain the code to open the lock box. The latter scenario presents a security exposure since one can not verify who is at the lock box (house) requesting the code. Requiring all agents to visit the office to get the codes for lock boxes not only causes tremendous inconvenience to the agents but also requires a person sitting at the office seven days a week to respond to the code requests by hundreds of agents for hundreds of houses listed with the office. The face-to-face verification of agent identification is also time consuming. Therefore, it is very desirable to introduce an automated system to manage the lock boxes and to access the locked properties.
This invention relates to an active lock system and its secure operating procedures having remote control capability via wireless communication. A wireless phone receiver and an information display and processing unit are integrated with a conventional keyless lock to provide the necessary functions of communication, information entry, identification verification and automated management of access control in an unique way. Operational methods of the active lock system not only provides security and privacy protection but also offers convenience to owners and users in terms of setup, operation and management of the system. The active lock system can be used as a double lock such as in the real estate application as a lock box as well as a single lock for other applications such as for protecting truck containers, warehouse and storage facilities. The lock mechanism itself in this lock system can be flexibly selected according to the applications desired. The skilled in the design and manufacture of locks can apply the present invention to any existing keyless lock. | {
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The invention relates to a flying object with an engine comprising a combustion chamber with a combustion space and a nozzle with a nozzle space following the combustion chamber, the transition between combustion chamber and nozzle lying in a plane in which a cross-section of the combustion space converges.
A rocket engine comprising guide vanes that protrude into the combustion chamber is known from WO 2005/028844 A1.
A yaw control device for an aircraft provided with a supersonic nozzle having a rectangular or flat cross-section is known from DE 10 2006 031 625 A1. The device comprises at least one jet vane in the form of an aileron inside of a nozzle tube, the vane being movable about a pivot axis.
Jet vanes for use in hot gas flows are known from DE 10 2004 037 487 A1.
WO 2006/028516 A2 and U.S. Pat. No. 7,155,898 B2 disclose a thrust vector control system for a rocket with a plug nozzle comprising a housing having a nozzle throat, a plug positioned relative to the housing and positioned within the nozzle throat, thereby defining a space between the plug and the nozzle throat, and having a thrust diverter movably arranged relative to the housing to provide an asymmetric surface pressure distribution along the plug. | {
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The development in the global economy is bringing along a continuous increase in the demand for light olefins around the world. It was predicted that the total global demand for ethylene and propylene will be 140 Mt/a and 86 Mt/a, respectively by year of 2010. In China, due to the rapid increase in the national economy, the annual increase rate in the demand for light olefins is estimated to exceed the world's average level. At present, the increase rate in the demand for propylene exceeds that for ethylene. There are many processes for producing light olefins, wherein a steam-cracking technology using a light feedstock such as naphtha as the hydrocarbon oil feedstock is widely used in the world. More than 90% of the total ethylene and about 70% of the total propylene in the world are produced by the steam-cracking technology using petroleum hydrocarbons as the feedstock. However, this technology can not meet the increasing demand for light olefins. Meanwhile, crude oils become heavier and heavier around the world. The yield to produce light olefins from light hydrocarbons, such as naphtha and straight-run light diesel oil, is generally only about ⅓. Further, China suffers from insufficient supply of fuel oil and low ratio of gasoline/diesel oil output, leading to a severer shortage of light hydrocarbon feedstock. Under this circumstance, the development of a technical route for producing light olefins directly from heavy oil becomes a tendency.
U.S. Pat. No. 5,944,982 and U.S. Pat. No. 6,287,522 disclose a catalytic cracking process and a fluidized catalytic cracking apparatus using a dual riser reactor, wherein heavy feed oil is cracked in a first riser, then introduced to a product fractionating system, further, the separated gasoline or light cycle oil is then introduced to a second riser, wherein deep cracking is further carried out under a very severe condition, so as to produce more light olefins. The two risers of the apparatus share one disengager and one regenerator, while the effluents from the first riser reactor and the second riser reactor enter two fractionating towers, respectively.
CN1118539C discloses a two-stage riser catalytic cracking process, which mainly aims at series oil gas, catalyst relay, sub-section reaction, shortening reaction tilde and enhancing average performance of catalysts by using a two-stage riser reactor.
CN1526794A discloses a catalytic cracking process, which comprises: 1) catalytically cracking a feed oil for less than 1.5 s in a first riser, then introducing the effluent stream to a first fractionator; 2) catalytically cracking the resultant cycle oil from the first fractionator for less than 1.5 s, then introducing the resultant stream to the first fractionator; and 3) catalytically cracking the resultant naphtha (gasoline) and/or optionally the resultant diesel oil from the first fractionator, wherein the reaction conditions in the first to the third risers depend on the catalyst used, which can be determined according to the desired catalytic cracking products.
However, the prior art suffers from the problem that the yield to produce light olefins from feed oil by a catalytic cracking is not so high to meet the increasing demand for light olefins in the industry. Furthermore, a great amount of less valuable dry gas is produced from the catalytic cracking of feed oil. Therefore, how to further enhance the conversion of feed oil to light olefins and simultaneously lower the yield of dry gas remains a problem to be solved in the prior art. | {
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1. Field of the Invention
The present invention relates to a method of forming color image on a silver halide color photosensitive material. More particularly, the present invention relates to a method of forming color image that ensures high sensitivity, excellent storability and further excellent color image storability.
2. Description of the Related Art
In the field of silver halide color photosensitive material, it is a longstanding issue to attain sensitivity enhancement without detriment to graininess. Generally, the photographic speed is determined by the size of silver halide emulsion grains. The larger the emulsion grains, the greater the photographic speed. However, since the graininess would be deteriorated in accordance with an increase of silver halide grain size, the speed and the graininess are in a tradeoff relationship. In the art to which the invention pertains, attaining sensitivity enhancement without detriment to graininess is the most fundamental and important task in the upgrading of the image quality of photosensitive materials.
The technology for attaining sensitivity enhancement without detriment to graininess by incorporating a compound having at least three heteroatoms in a silver halide photosensitive material has been disclosed (see, for example, Jpn. Pat. Appln. KOKAI Publication No. (hereinafter referred to as JP-A-) 2000-194085 and JP-A-2003-156823).
However, although an sensitivity enhancement by the above technology can be recognized, the effect thereof is not satisfactory. Further, a new problem by the use of the above technology has surfaced. It has been found that with respect to the sensitive material obtained by the use of the above technology, the storability of raw sensitive material would be deteriorated. | {
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The present invention relates to an apparatus for automated actuation of a torque transmitting system, such as for example a clutch, a friction clutch, a disc clutch or a torque converter with a bypass (lockup) clutch, in the power train of a vehicle with a driving aggregate (prime mover), such as a combustion engine, and a transmission, with a control unit which communicates with sensors and eventually (if necessary) with other electronic units, and with an actuator or actor which can be activated by the control unit to actuate the torque transmitting system, the control unit being activated for example in response to turning on of the ignition system of the vehicle.
The invention further relates to an apparatus for automated actuation of a transmission in the power train of a vehicle with a driving aggregate (prime mover) and a torque transmitting system, with a control unit which communicates with sensors and eventually with other electronic units and which is activated, for example, in response to activation of the ignition system of the vehicle, with an actuator or actor which is activatable by the control unit to actuate the transmission, such as to shift into different gear ratios.
In such an apparatus, the control unit remains activated when the ignition system of the vehicle is activated in order to ensure that an automated actuation of an aggregate can be carried out at any time.
In a conventional apparatus, the control unit is deactivated, as a rule, immediately after the turning off of the ignition system or shortly thereafter in order to ensure a reliable engagement of the clutch and in order to be in a position to store information (data). This interval of time is within the range of one second so that, for example, one cannot further monitor (follow) long-range effects of the torque transmitting system. Such a long-range effect is, for example, the thermal behavior of the torque transmitting system which relaxes only with a rather long interval following the stoppage of the vehicle (turning off of the ignition), i.e., the temperature of the torque transmitting system varies for an extended interval of time following a stoppage of the vehicle and the turning off of the ignition system. For example, if such data pertaining to the temperature of the torque transmitting system are not determined by resorting to a relatively expensive sensor which is likely to fail, it is advisable to calculate the temperature of the torque transmitting system. The calculation and storing of data, such as for example, temperature data, takes place only when the control unit is active (operative). | {
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Various abbreviations that appear in the specification and/or in the drawing figures are defined as below: 3GPP Third Generation Partnership Project LTE Long Term Evolution BS Base Station MS Mobile Station MME Mobility Management Entity UE User Equipment IMSI International Mobile Subscriber Identity ASME Access Security Management Entity TMSI Temporary Mobile Subscriber Identity MTC Machine Type Communication HSS Home Subscriber Server IMEI International Mobile Equipment Identity AV Authentication Vector USIM Universal Subscriber Identity Module AUTN Authentication Token RAND Random Challenge GPRS General Packet Radio Service SGSN Serving GPRS Support Node XRES Expected Response CK Cipher Key IK Integrity Key AK Anonymity Key XMAC Expected Message Authentication Code MAC Message Authentication Code AuC Authentication Center AKA Authentication and Key Agreement
An AKA procedure is a procedure that has been employed by many communication systems of today for the purpose of improving system security and robustness. One such an AKA procedure has been detailed in 3GPP Technical Specifications 33.102 and 33.401, which are incorporated herein by reference in their entirety. The AKA procedure, which may involve a challenge-response authentication procedure as known in the art, will inevitably cause certain amount of signaling overhead. When the number of devices to be authenticated in the AKA procedure is relatively low, it will merely cause small amount of overhead for the network. However, in a situation where devices to be simultaneously authenticated are numerous, it will generate tremendous signaling overhead that may burden the bandwidth and processing capability of the network. This is especially true for machine-type communications in which many MTC devices formed in groups will initiate their own AKA procedures towards the network simultaneously and thereby make negative impact on the network. For more information regarding MTC communications, see 3GPP Technical Report 33.868, which is also incorporated herein by reference in its entirety.
Therefore, what is needed in the prior art is means for performing a group AKA procedure on a group of devices in an efficient and secure manner such that the impact of signaling overhead on the network could be decreased. | {
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Valve covers mounted on internal combustion engines used with current automobiles are being made of various types of materials. Some are made from a metallic material such as aluminum, magnesium, or steel while others are made using a thermoset plastic or thermoplastic material. The valve covers made of aluminum and magnesium are manufactured using a die cast process and afterwards coated with a clear coat of paint. Those made of steel are made using a stamping process and, afterwards, are also painted. Some of the stamped steel valve covers are tri-layer formed with a plastic constrained layer for sound dampening purposes.
One problem with the valve covers made of aluminum and magnesium is that they are quite costly to manufacture. Those presently made of steel or a plastic material may not be as costly to manufacture but use gaskets which are not part of the cover and are not reusable. As a result, the gasket which may be a molded silicone, a molded silicone with a metal carrier, or an RTV (room temperature vulcanized) silicone must be discarded from and replaced onto the sealing surface of the cover if the cover is removed for maintenance purposes. The aluminum and magnesium covers use a molded silicone gasket which is applied or pressed into a molded groove and is also discarded if the cover is removed for service. In addition, those valve covers which may use isolated fastener systems for sound dampening purposes require separate rubber bushing to be inserted into the mounting holes of the cover. As should be apparent, separate bushing inserts tend to increase the time needed to assemble the cover. | {
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A display device having a non-self-emissive display panel such as a translucent liquid crystal display panel generally has such a configuration that a light source device for a display device that includes a light source is disposed on the back side of the display panel. The light source device includes the light source and a given number of sheet-shaped or film-shaped optical members of given type that are arranged to control the properties of light the light source emits. The light source device projects the light the properties of which have been controlled by the optical members toward the back side of the display panel. The light projected toward the back side of the display panel is transmitted through the display panel, making an image displayed visible on the front side of the display panel.
Examples of the sheet-shaped or film-shaped optical members include a diffusion sheet having a function of diffusing light and a lens sheet having a light gathering function. In order to support the sheet-shaped or film-shaped optical members, a given number of through holes are disposed adjacent to upper sides of the sheet-shaped or film-shaped optical members in a normal usage state, convex hooks are disposed adjacent to an upper side of a chassis of the light source device, and the hooks are fit in the through holes of the sheet-shaped or film-shaped optical members so as to hang the sheet-shaped or film-shaped optical members on the hooks. In particular, a plurality of through holes are provided to the sheet-shaped or film-shaped optical members, a plurality of hooks are provided to the chassis of the light source device, and bosses of the hooks are fit in the through holes so as to hang the sheet-shaped or film-shaped optical members (in other words, the sheet-shaped or film-shaped optical members are hung on the plurality of hooks).
If wrinkle or warpage occurs in the sheet-shaped or film-shaped optical members, the wrinkle or warpage causes irregular brightness or shadow on the front side (screen) of the display panel. The irregular brightness or shadow could decrease display quality of the display device. Accordingly, it is preferable to keep the sheet-shaped or film-shaped optical members with no wrinkle or warpage.
In the configuration that the plurality of through holes are disposed adjacent to the upper sides of the sheet-shaped or film-shaped optical members in the normal usage state and the bosses are fit in the through holes so as to hang the sheet-shaped or film-shaped optical members, the weight of the sheet-shaped or film-shaped optical members is dispersed to the peripheral portions of the plurality of through holes. Thus, occurrence of wrinkle or warpage in the sheet-shaped or film-shaped optical members can be prevented or minimized.
However, this configuration may cause the following problem. The vertical positions of the through holes that are disposed adjacent to the upper sides of the sheet-shaped or film-shaped optical members in the normal usage state are not always precisely aligned. In addition, the vertical positions of the hooks protruding from the chassis of the light source device are not always aligned. Thus, there is a possibility that some of the hooks come into contact with the inner surfaces of the corresponding through holes, so that the weight of the sheet-shaped or film-shaped optical members is put on the peripheral portions of those through holes, and the other hooks do not come into contact with the inner surfaces of the corresponding through holes, so that the weight of the sheet-shaped or film-shaped optical members is not put on the peripheral portions of those through holes. In such a case, the weight of the sheet-shaped or film-shaped optical members is concentrated on the peripheral portions of the through holes that come into contact with the hooks, and wrinkle or warpage could occur in the sheet-shaped or film-shaped optical members.
In view of this, in the configuration that the plurality of through holes are provided to the sheet-shaped or film-shaped optical members and the plurality of hooks protruding from the chassis are disposed adjacent to the upper side of the chassis, the vertical positions of the plurality of through holes in the sheet-shaped or film-shaped optical members and the vertical positions of the plurality of hooks protruding from the chassis should be precisely aligned. However, it is actually difficult to precisely align the vertical positions of the plurality of through holes in the sheet-shaped or film-shaped optical members and the vertical positions of the plurality of hooks protruding from the chassis. | {
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A large proportion (some estimates are as high as twenty-five percent) of the electricity generated in the United States each year goes to lighting. Accordingly, there is an ongoing need to provide lighting which is more energy-efficient. It is well-known that incandescent light bulbs are very energy-inefficient light sources—about ninety percent of the electricity they consume is released as heat rather than light. Fluorescent light bulbs are more efficient than incandescent light bulbs (by a factor of about 10) but are still less efficient than solid state light emitters, such as light emitting diodes.
In addition, as compared to the normal lifetimes of solid state light emitters, incandescent light bulbs have relatively short lifetimes, i.e., typically about 750-1000 hours. In comparison, light emitting diodes, for example, have typical lifetimes between 50,000 and 70,000 hours. Fluorescent bulbs have longer lifetimes (e.g., 10,000-20,000 hours) than incandescent lights, but provide less favorable color reproduction.
Color reproduction is typically measured using the Color Rendering Index (CRI). CRI Ra is a modified average of the relative measurement of how the color rendition of an illumination system compares to that of a reference radiator when illuminating eight reference colors, i.e., it is a relative measure of the shift in surface color of an object when lit by a particular lamp. The CRI Ra equals 100 if the color coordinates of a set of test colors being illuminated by the illumination system are the same as the coordinates of the same test colors being irradiated by the reference radiator. Daylight has a high CRI (Ra of approximately 100), with incandescent bulbs also being relatively close (Ra greater than 95), and fluorescent lighting being less accurate (typical Ra of 70-80). Certain types of specialized lighting have very low CRI (e.g., mercury vapor or sodium lamps have Ra as low as about 40 or even lower). Sodium lights are used, e.g., to light highways—driver response time, however, significantly decreases with lower CRI Ra values (for any given brightness, legibility decreases with lower CRI Ra).
Another issue faced by conventional light fixtures is the need to periodically replace the lighting devices (e.g., light bulbs, etc.). Such issues are particularly pronounced where access is difficult (e.g., vaulted ceilings, bridges, high buildings, traffic tunnels) and/or where change-out costs are extremely high. The typical lifetime of conventional fixtures is about 20 years, corresponding to a light-producing device usage of at least about 44,000 hours (based on usage of 6 hours per day for 20 years). Light-producing device lifetime is typically much shorter, thus creating the need for periodic change-outs.
Accordingly, for these and other reasons, efforts have been ongoing to develop ways by which light emitting diodes can be used in place of incandescent lights, fluorescent lights and other light-generating devices in a wide variety of applications. In addition, where light emitting diodes are already being used, efforts are ongoing to provide light emitting diodes which are improved, e.g., with respect to energy efficiency, color rendering index (CRI Ra), contrast, efficacy (lm/W), low cost, and/or duration of service.
Light emitting diodes are well-known semiconductor devices that convert electrical current into light. A wide variety of light emitting diodes are used in increasingly diverse fields for an ever-expanding range of purposes.
More specifically, light emitting diodes are semiconducting devices that emit light (ultraviolet, visible, or infrared) when a potential difference is applied across a p-n junction structure. There are a number of well-known ways to make light emitting diodes and many associated structures, and the present inventive subject matter can employ any such devices. By way of example, Chapters 12-14 of Sze, Physics of Semiconductor Devices, (2d Ed. 1981) and Chapter 7 of Sze, Modem Semiconductor Device Physics (1998) describe a variety of photonic devices, including light emitting diodes.
The commonly recognized and commercially available light emitting diode (“LED”) that is sold (for example) in electronics stores typically represents a “packaged” device made up of a number of parts. These packaged devices typically include a semiconductor based light emitting diode such as (but not limited to) those described in U.S. Pat. Nos. 4,918,487; 5,631,190; and 5,912,477; various wire connections, and a package that encapsulates the light emitting diode.
As is well-known, a light emitting diode produces light by exciting electrons across the band gap between a conduction band and a valence band of a semiconductor active (light-emitting) layer. The electron transition generates light at a wavelength that depends on the band gap. Thus, the color of the light (wavelength) emitted by a light emitting diode depends on the semiconductor materials of the active layers of the light emitting diode.
Although the development of light emitting diodes has in many ways revolutionized the lighting industry, some of the characteristics of light emitting diodes have presented challenges, some of which have not yet been fully met. For example, the emission spectrum of any particular light emitting diode is typically concentrated around a single wavelength (as dictated by the light emitting diode's composition and structure), which is desirable for some applications, but not desirable for others, (e.g., for providing lighting, such an emission spectrum provides a very low CRI Ra).
Because light that is perceived as white is necessarily a blend of light of two or more colors (or wavelengths), no single light emitting diode junction has been developed that can produce white light. “White” light emitting diode lamps have been produced which have a light emitting diode pixel/cluster formed of respective red, green and blue light emitting diodes. Other “white” light emitting diode lamps have been produced which include (1) a light emitting diode which generates blue light and (2) a luminescent material (e.g., a phosphor) that emits yellow light in response to excitation by light emitted by the light emitting diode, whereby the blue light and the yellow light, when mixed, produce light that is perceived as white light.
In addition, the blending of primary colors to produce combinations of non-primary colors is generally well understood in this and other arts. In general, the 1931 CIE Chromaticity Diagram (an international standard for primary colors established in 1931), and the 1976 CIE Chromaticity Diagram (similar to the 1931 Diagram but modified such that similar distances on the Diagram represent similar perceived differences in color) provide useful reference for defining colors as weighted sums of primary colors.
Aspects related to the present inventive subject matter can be represented on either the 1931 CIE (Commission International de I'Eclairage) Chromaticity Diagram or the 1976 CIE Chromaticity Diagram. FIG. 1 shows the 1931 CIE Chromaticity Diagram. FIG. 2 shows the 1976 Chromaticity Diagram. FIG. 3 shows an enlarged portion of the 1976 Chromaticity Diagram, in order to show the blackbody locus in more detail. Persons of skill in the art are familiar with these diagrams, and these diagrams are readily available (e.g., by searching “CIE Chromaticity Diagram” on the internet).
The CIE Chromaticity Diagrams map out the human color perception in terms of two CIE parameters x and y (in the case of the 1931 diagram) or u′ and v′ (in the case of the 1976 diagram). For a technical description of CIE chromaticity diagrams, see, for example, “Encyclopedia of Physical Science and Technology”, vol. 7, 230-231 (Robert A Meyers ed., 1987). The spectral colors are distributed around the edge of the outlined space, which includes all of the hues perceived by the human eye. The boundary line represents maximum saturation for the spectral colors. As noted above, the 1976 CIE Chromaticity Diagram is similar to the 1931 Diagram, except that the 1976 Diagram has been modified such that similar distances on the Diagram represent similar perceived differences in color.
In the 1931 Diagram, deviation from a point on the Diagram can be expressed either in terms of the coordinates or, alternatively, in order to give an indication as to the extent of the perceived difference in color, in terms of MacAdam ellipses. For example, a locus of points defined as being ten MacAdam ellipses from a specified hue defined by a particular set of coordinates on the 1931 Diagram consists of hues which would each be perceived as differing from the specified hue to a common extent (and likewise for loci of points defined as being spaced from a particular hue by other quantities of MacAdam ellipses).
Since similar distances on the 1976 Diagram represent similar perceived differences in color, deviation from a point on the 1976 Diagram can be expressed in terms of the coordinates, u′ and v′, e.g., distance from the point=(Δu′2+Δv′2)1/2, and the hues defined by a locus of points which are each a common distance from a specified hue consist of hues which would each be perceived as differing from the specified hue to a common extent.
The chromaticity coordinates and the CIE chromaticity diagrams illustrated in FIGS. 1-3 are explained in detail in a number of books and other publications, such as pages 98-107 of K. H. Butler, “Fluorescent Lamp Phosphors” (The Pennsylvania State University Press 1980) and pages 109-110 of G. Blasse et al., “Luminescent Materials” (Springer-Verlag 1994), both incorporated herein by reference.
The chromaticity coordinates (i.e., color points) that lie along the blackbody locus obey Planck's equation: E(λ)=Aλ−5/(e(B/T)−1), where E is the emission intensity, λ is the emission wavelength, T the color temperature of the blackbody and A and B are constants. Color coordinates that lie on or near the blackbody locus yield pleasing white light to a human observer. The 1976 CIE Diagram includes temperature listings along the blackbody locus. These temperature listings show the color path of a blackbody radiator that is caused to increase to such temperatures. As a heated object becomes incandescent, it first glows reddish, then yellowish, then white, and finally blueish. This occurs because the wavelength associated with the peak radiation of the blackbody radiator becomes progressively shorter with increased temperature, consistent with the Wien Displacement Law. Illuminants which produce light which is on or near the blackbody locus can thus be described in terms of their color temperature.
Also depicted on the 1976 CIE Diagram are designations A, B, C, D and E, which refer to light produced by several standard illuminants correspondingly identified as illuminants A, B, C, D and E, respectively.
Light emitting diodes can thus be used individually or in any combinations, optionally together with one or more luminescent material (e.g., phosphors or scintillators) and/or filters, to generate light of any desired perceived color (including white). Accordingly, the areas in which efforts are being made to replace existing light sources with light emitting diode light sources, e.g., to improve energy efficiency, color rendering index (CRI Ra), efficacy (lm/W), and/or duration of service, are not limited to any particular color or color blends of light.
A wide variety of luminescent materials are well-known and available to persons of skill in the art. For example, a phosphor is a luminescent material that emits a responsive radiation (e.g., visible light) when excited by a source of exciting radiation. In many instances, the responsive radiation has a wavelength which is different from the wavelength of the exciting radiation. Other examples of luminescent materials include scintillators, day glow tapes and inks which glow in the visible spectrum upon illumination with ultraviolet light. The expression “lumiphor”, as used herein, refers to any luminescent element, i.e., any element which includes a luminescent material.
Luminescent materials can be categorized as being down-converting, i.e., a material which converts photons to a lower energy level (longer wavelength) or up-converting, i.e., a material which converts photons to a higher energy level (shorter wavelength).
Inclusion of luminescent materials in LED devices has been accomplished by adding the luminescent materials to a clear or translucent encapsulant material (e.g., epoxy-based, silicone-based, glass-based or metal oxide-based material) as discussed above, for example by a blending or coating process.
For example, U.S. Pat. No. 6,963,166 (Yano '166) discloses that a conventional light emitting diode lamp includes a light emitting diode chip, a bullet-shaped transparent housing to cover the light emitting diode chip, leads to supply current to the light emitting diode chip, and a cup reflector for reflecting the emission of the light emitting diode chip in a uniform direction, in which the light emitting diode chip is encapsulated with a first resin portion, which is further encapsulated with a second resin portion. According to Yano '166, the first resin portion is obtained by filling the cup reflector with a resin material and curing it after the light emitting diode chip has been mounted onto the bottom of the cup reflector and then has had its cathode and anode electrodes electrically connected to the leads by way of wires. According to Yano '166, a phosphor is dispersed in the first resin portion so as to be excited with the light A that has been emitted from the light emitting diode chip, the excited phosphor produces fluorescence (“light B”) that has a longer wavelength than the light A, a portion of the light A is transmitted through the first resin portion including the phosphor, and as a result, light C, as a mixture of the light A and light B, is used as illumination.
As noted above, “white LED lamps” (i.e., lamps which emit light which is perceived as being white or near-white) have been investigated as potential replacements for white incandescent lamps. A representative example of a white LED lamp includes a package of a blue light emitting diode chip, made of indium gallium nitride (InGaN) or gallium nitride (GaN), coated with a phosphor such as YAG. In such an LED lamp, the blue light emitting diode chip produces an emission with a wavelength of about 450 nm, and the phosphor produces yellow fluorescence with a peak wavelength of about 550 nm on receiving that emission. For instance, in some designs, white light emitting diode lamps are fabricated by forming a ceramic phosphor layer on the output surface of a blue light-emitting semiconductor light emitting diode. Part of the blue ray emitted from the light emitting diode chip passes through the phosphor, while part of the blue ray emitted from the light emitting diode chip is absorbed by the phosphor, which becomes excited and emits a yellow ray. The part of the blue light emitted by the light emitting diode which is transmitted through the phosphor is mixed with the yellow light emitted by the phosphor. The viewer perceives the mixture of blue and yellow light as white light. Another type uses a blue or violet light emitting diode chip which is combined with phosphor materials that produce red or orange and green or yellowish-green light rays. In such a lamp, part of the blue or violet light emitted by the light emitting diode chip excites the phosphors, causing the phosphors to emit red or orange and yellow or green light rays. These rays, combined with the blue or violet rays, can produce the perception of white light.
As also noted above, in another type of LED lamp, a light emitting diode chip that emits an ultraviolet ray is combined with phosphor materials that produce red (R), green (G) and blue (B) light rays. In such an “RGB LED lamp”, the ultraviolet ray that has been radiated from the light emitting diode chip excites the phosphor, causing the phosphor to emit red, green and blue light rays which, when mixed, are perceived by the human eye as white light. Consequently, white light can also be obtained as a mixture of these light rays.
Designs have been provided in which existing LED component packages and other electronics are assembled into a fixture. In such designs, a packaged LED is mounted to a circuit board (or directly to a heat sink), the circuit board is mounted to a heat sink, and the heat sink is mounted to the fixture housing along with required drive electronics. In many cases, additional optics (secondary to the package parts) are also necessary.
In substituting light emitting diodes for other light sources, e.g., incandescent light bulbs, packaged LEDs have been used with conventional light fixtures, for example, fixtures which include a hollow lens and a base plate attached to the lens, the base plate having a conventional socket housing with one or more contacts which are electrically coupled to a power source. For example, LED light bulbs have been constructed which comprise an electrical circuit board, a plurality of packaged LEDs mounted to the circuit board, and a connection post attached to the circuit board and adapted to be connected to the socket housing of the light fixture, whereby the plurality of LEDs can be illuminated by the power source.
There is an ongoing need for ways to use solid state light emitters, e.g., light emitting diodes, to provide light with greater energy efficiency and with acceptable color rendering index (CRI Ra). | {
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Compositions having isocyanate functional components are utilized to bond substrates together, such as, glass, often in the form of windows, into structures. In automotive assembly plants windows are bonded in with one part adhesive compositions containing isocyanate functional components, which cure by reaction with ambient moisture, and take several hours or days to cure. In the assembly plants, vehicles are not driven for several hours and this is acceptable. One part moisture curing adhesives known in the art are disclosed in U.S. Pat. Nos. 4,374,237; 4,687,533; 4,780,520; 5,063,269; 5,623,044; 5,603,798; 5,852,137; 5,922,809; 5,976,305; 5,852,137 and 6,512,033, relevant portions incorporated herein by reference.
Two-part compositions containing isocyanate functional prepolymers in one part and compounds having isocyanate reactive components in the other part are used where cure speed is important, such as in the automotive aftermarket replacement glass business. Customers desire that the adhesives cure quickly so that the vehicle can be driven as soon as possible after replacing the window. Examples of two-part compositions containing isocyanate functional prepolymers in one part and compounds having isocyanate reactive components in the other part are disclosed in EP 1,524,282, U.S. Pat. Nos. 5,852,103; 6,709,539; 7,101,950 and 7,361.292, relevant parts incorporated herein by reference. For certain applications even two part compositions containing isocyanate functional prepolymers do not cure fast enough for certain applications or customers. One solution is provided by commonly owned patent application titled DUAL CURE ADHESIVE USEFUL FOR BONDING TO GLASS, Jialanella U.S. patent application Ser. No. 13/455,294 filed Apr. 25, 2012, disclosing a composition comprising: a) one or more isocyanate functional prepolymers; b) one or more compounds containing a cycloaliphatic tertiary amine; c) one or more compounds containing a peroxide group; and d) and an acrylate containing component; and, one or more compounds containing one or more acrylate groups; wherein component a) and b) are kept separate from component c) until cure is desired. The cured compositions preferably demonstrate an adhesive strength as measured by lap shear strength according to SAE J1529 of 0.5 MPa or greater after 30 minutes from composition application or 0.25 MPa or greater after 15 minutes from adhesive application. The compositions are useful for bonding glass to other substrates, such as vehicles and buildings and parts of modular components together, such as vehicle modular components, relevant parts incorporated herein by reference.
Adhesive systems that allow for modification of properties to fit the environment of use or the substrates bonded are desired, such as relative elasticity and modulus. Manufacturers desire to handle products as soon as possible to enhance productivity. In modern industrial processes, there is a need to move parts and to place loads on adhesive systems as soon as possible. Adhesives which have a good green strength shortly after application and exhibit longer open time are needed. Open time is the time from contacting the two parts of a composition together until the composition can no longer adhere to a substrate. Open time is important because some time is needed to assemble the parts to be bonded together in the proper arrangement, sometimes the parts need to be adjusted after assembly to achieve the desired arrangement.
Even with the advancements in the art described herein there is a need for even faster curing systems that afford reasonable open times. Thus, what are needed are adhesive systems which exhibit good green strength, even more rapid cure rates, the ability to allow substrates to be handled shortly after application of the adhesive system and sufficient open times to allow proper placement of the parts bonded together. What are also needed are adhesive systems wherein the properties can be adjusted to meet the needs of a particular substrate system. | {
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1. Field of the Invention
The present invention relates generally to catheters and, more specifically, to a catheter assembly wherein said catheter assembly comprises a catheter having a pair of transverse wings extending therefrom forming an integral part therewith. Each of the transverse wings has a top side and a bottom side with the bottom sides having an adhesive layer with a peelably removable cover.
The present invention also provides a catheter assembly having a catheter with a longitudinal body having a transverse attachable detachable fastening member thereunder comprising a pliable polymeric element having a top side and a bottom side with the top side having a longitudinal groove fixedly attached to the catheters longitudinal body with the bottom side having an adhesive layer covered by a peelably removable cover so that when removed the catheter assembly can be adhesively attached to a recipient's skin and when desirous of removal can be peelably removed from said recipient's skin.
Also provided are removal tabs, which are flexible tab end portions having no adhesive providing easy removal of the flexible tabs using one hand.
2. Description of the Prior Art
There are other catheter device designed for medical use. Typical of these is U.S. Pat. No. 3,064,648 issued to Bujan on Nov. 20, 1962.
Another patent was issued to Reiterman on Jun. 20, 1972 as U.S. Pat. No. 3,670,727. Yet another U.S. Pat. No. 4,388,074 was issued to Seberg et al. on Jun. 14, 1983 and still yet another was issued on Jun. 30, 1987 to Jagger et al. as U.S. Pat. No. 4,676,783.
Another patent was issued to Joishy on Oct. 6, 1987 as U.S. Pat. No. 4,698,057. Yet another U.S. Pat. No. 4,820,282 was issued to Hogan on Apr. 11, 1989. Another was issued to Lane, Jr. on Jul. 18, 2000 as U.S. Pat. No. 6,090,076 and still yet another was issued on Aug. 8, 2000 to Brown, Jr. et al. as U.S. Pat. No. 6,099,509.
Another patent was issued to Hancock et al. on Oct. 26, 2004 as U.S. Pat. No. 6,809,230. Yet another U.K. Patent No. GB1243576 was published to Abbott Laboratories on Aug. 18, 1971. Another was published to Howell on Sep. 14, 1999 as International Patent Application Publication No. WO 00/15290 and still yet another was published on Apr. 1, 2004 to Scofield as International Patent Application Publication No. WO 2004/026389. | {
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1. Field of the Invention
The present invention relates to a method and system for image printing, and more particularly to a method and system for image printing that is capable of properly performing a form overlay.
2. Discussion of the Background
In general, a printing system including a host apparatus and a print station has been capable of performing a form overlay with which a document is overlaid on a format or vise versa. For example, this function is used when a logo mark is separately prepared and is needed to be combined with a document. Then, the logo mark is handled as a fixed format to be printed every page. In this case, the positions of the logo mark and the document in the page are different with each other and do not affect each other.
A so-called stamp print and a water marking, both for printing a fixed mark on a document, have also been developed as convenient form overlay functions. These functions can be implemented in a printer driver. The PCL driver manufactured by Hewlett-Packard Co. is one example of such a printer driver.
In using the form overlay function, it is needed to determine whether a document is to be a background or a format is to be a background. Generally, this determination is performed by an application program (hereinafter referred to as an application) or a printer driver. Some printer drivers can use formats created with any application but others cannot.
Some applications, such as Microsoft PowerPoint sold by Microsoft Corporation, are capable of generating a page document and, when these applications perform a form overlay, they paint with a white color a region where the document is expanded before the document is placed on the region. Thus, in a combination use of an application with other applications so as to mix a document and background formats, it is possible that the background format is not shown on the page because the page having the background format is painted with a white color before an image of the document is overlaid on the background format.
The present invention provides a novel printing method for a print system operating with an operating system. In one embodiment, a novel printing system includes the steps of providing, storing, selecting, and executing. The providing steps provide an application for generating print data and a print station. The storing step stored form data. The selecting step selects at least one of a first form overlay instruction for assigning the print data as a background image and the form data as a foreground and a second form overlay instruction for assigning the print data as a foreground image and the form data as a background. The executing executes a first form overlay operation, and includes the steps of adding and transmitting. The adding step adds the form data immediately after each page of the print data when the selecting step selects the first form overlay instruction and the form data in front of each page of the print data when the selecting step selects the second form overlay instruction. The transmitting step transmits the print data added with the form data to the print station.
The above-mentioned method may further include a step of executing a second form overlay operation which includes the steps of sending, storing, generating, adding, and transferring. The sending step sends a form registration instruction and the form data to the print station. The storing step stores the form data in the print station. The generating step generates a form overlay execution command. The adding step adds the form overlay execution command immediately after each page of the print data when the selecting step selects the first form overlay instruction and the form overlay execution command in front of each page of the print data when the selecting step selects the second form overlay instruction. The transferring step transfers the print data added with the form overlay execution command to the print station. In this case, the method further includes a step of choosing at least one of the first and second executing steps.
The storing step may store the print data generated by the application as form data. In this case, the method further includes a step of neglecting a white painting instruction generated by the application. The white painting instruction instructs to paint a background page with a white color before print data is expanded over the background page.
Further, the present invention provides a novel print system which operates with an operating system and an application, compatible with the operating system, for generating print data. In one embodiment, a novel print system includes a print station, a memory for storing form data, and a printer driver which is configured to control a storage of the form data to the memory and to control data transmission of the print data and the form data to the print station. The printer driver includes a first selector and a first form-overlay manager. The first selector selects at least one of a first form overlay instruction for assigning the print data as a background image and the form data as a foreground and a second form overlay instruction for assigning the print data as a foreground image and the form data as a background. The first form-overlay manager executes a first form-overlay operation for adding the form data immediately after each page of the print data when the first selector selects the first form overlay instruction and the form data in front of each page of the print data when the first selector selects the second form overlay instruction, and transmitting the print data added with the form data to the print station.
Further, the present invention provides a novel printer driver of a print system which operates with an operating system and with an application, compatible with the operating system, for generating print data, and which includes a memory for storing form data and a print station for printing the print data. In this case, the printer driver controls a storage of the form data to the memory and data transmission of the print data and the form data to the print station. The printer driver includes a first selector and a first form-overlay manager. The first selector selects at least one of a first form overlay instruction for assigning the print data as a background image and the form data as a foreground and a second form overlay instruction for assigning the print data as a foreground image and the form data as a background. The first form-overlay manager executes a first form-overlay operation for adding the form data immediately after each page of the print data when the first selector selects the first form overlay instruction and the form data in front of each page of the print data when the first selector selects the second form overlay instruction, and transmitting the print data added with the form data to the print station.
Further, the present invention provides a novel method for printer driving in a print system which operates with an operating system and with an application, compatible with the operating system, for generating print data, and which includes a memory for storing form data and a print station for printing the print data. The method include a first selecting step, a first form-overlay executing step, and a transmitting step. The first selecting step selects at least one of a first form overlay instruction for assigning the print data as a background image and the form data as a foreground and a second form overlay instruction for assigning the print data as a foreground image and the form data as a background. The first form-overlay executing step executes a first form-overlay operation for adding the form data immediately after each page of the print data when the first selecting step selects the first form overlay instruction and the form data in front of each page of the print data when the first selecting step selects the second form overlay instruction. The transmitting step transmits the print data added with the form data to the print station.
The present invention further provides a novel computer readable medium which stores computer instructions for performing the steps mentioned above.
This document claims priority rights of and is based on the subject matter described in Japanese Patent Application No. JPAP11-063376 filed on Mar. 10, 1999, the entire contents of which are herein incorporated by reference. | {
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1. Field of Invention
This invention relates to automotive interior trim articles containing a panel structure mountable in an automobile vehicle to form a part of the interior thereof, and in particular to automobile interior trim articles such as instrument panels, door panels, and glove compartment doors. This invention further relates to a process for making automotive interior trim articles.
2. Description of Related Art
Automotive interior trim articles such as instrument panels, door panels, armrests, headrests, floor consoles, knee bolsters, and glove compartment doors conventionally have been constructed by applying a soft decorative covering over a rigid substrate mountable in an automobile vehicular body, with a cellular polyurethane padding interposed between the decorative covering and rigid substrate. A predetermined texture and color is usually provided to the decorative covering in an effort to simulate the appearance and feel of authentic leather.
The preparation of a self-supporting synthetic automotive interior trim article having a dual layer decorative covering is disclosed in U.S. Pat. No. 5,662,996 (corresponding to WO 93/23237), and in particular at Example 2 thereof. In accordance with the method disclosed in the Recticel ""996 patent for preparing this interior trim article, a solvent-based polyurethane lacquer is initially applied to an open mold surface as an xe2x80x9cin-mold paintxe2x80x9d, and then is dried by evaporating off the solvent. A xe2x80x9cskinxe2x80x9d prepared from a two-part polyurethane elastomer is thereafter formed on the inner surface of the dried in-mold paint by employing specialized nozzles and application systems. In practice, suitable spray nozzles and systems that can be employed are disclosed in U.S. Pat. Nos. 5,028,006 and 5,071,683. Next, a polyurethane cellular foam layer is prepared by spraying a polyurethane reaction mixture against the polyurethane elastomer skin. Finally, a polyurethane or polyisocyanurate reaction mixture is applied against the opposing surface of the polyurethane cellular foam layer to obtain a rigid synthetic carrier.
It appears that the commercial merit of this related art dual layer covering containing the in-mold paint disclosed in the Recticel ""996 patent, and the process for making the same, is negligible, as indicated by the current lack of commercial activity of this dual layer covering by Recticel. Recticel does not utilize an in-mold solvent-based lacquer in its own commercial activity. Recticel has even proscribed at least one of its customers from using its in-mold paint.
Further, the use of the solvent-based lacquer as the in-mold paint plagues the preparatory method disclosed in the Recticel ""996 patent with several complications and inefficiencies. For example, these lacquers contain large amounts of atmosphere-polluting volatile organic compounds (VOCs). Due to the extremely flammable and explosive nature of VOCs, such lacquers are subject to strict governmental regulations. Compliance with these governmental regulations often requires additional and expensive equipment designed to ensure worker safety and to protect against environmental pollution. For example, manufacturing facilities equipped for handling such lacquers must include special spray equipment, separate and customized spraying zones, and air cleansing equipment. Workers must also dress in special protective and often bulky and cumbersome gear that is fire resistant and shields against exposure to noxious fumes.
A need therefore exists to provide a process for making a panel structure containing a multi-layered decorative covering in which the panel structure can be produced in a more environmentally-friendly, efficient, and cost effective manner, and in which the resulting panel structure still has a desired high quality, leather-like appearance.
It is, therefore, an object of the present invention to solve the aforementioned problems associated with the related art as well as the need expressed above. In accordance with the principles of the present invention, this object is attained by providing a process for making a panel structure mountable on an automobile vehicle to form a part of the vehicle interior. The panel structure comprises a layered composite structure and a reinforcing substrate, with the substrate being hidden from the vehicle interior when the panel structure is mounted in the automobile. The layered composite structure comprises an outer layer defining at least a portion of an at least partially-exposed exterior surface of the panel structure and an inner layer.
According to one embodiment of this process, at least the following steps are performed to prepare the panel structure. At least one water-dispersed composition comprising at least one light-stable thermoplastic polyurethane (preferably in the form of resin particles in a colloid solution dispersed in water) containing one or more pendent hydroxyl and/or carboxyl functional groups, at least one desired coloring agent, and at least one light-stable, blocked, heat-activated diisocyanate is applied onto a heated mold surface shaped to define a complementary configuration to the outer layer. The light-stable thermoplastic polyurethane and the blocked, heat-activated diisocyanate are heated, preferably by pre-heating the mold surface, and reacted to induce crosslinking of the thermoplastic polyurethane with the blocked, heat-activated diisocyanate. Then, the water-dispersed composition is substantially dried while on the mold surface to coalesce the resin particles into a contiguous film and thereby form the exposed outer layer. Next, a rapidly reacting composition containing at least one aromatic polyisocyanate and at least one polyol is sprayed onto an inner surface of the outer layer while on the mold surface to form the inner layer comprising an aromatic polyurethane elastomer crosslinked with the polyurethane of the outer layer via residual unreacted functional groups of the blocked, heat-activated diisocyanate in the outer layer. Consequently, interfacial chemical bonding is obtained between the inner surface of the outer layer and an adjacent surface of the inner layer to form the layered composite structure. The layered composite structure is then united with the reinforcing substrate so that the reinforcing substrate serves to reinforce the outer layer. Optionally, a soft cellular polyurethane foam layer can be formed intermediate the inner layer and the reinforcing substrate. Consequently, the panel structure retains the touch, color and configuration of the exposed portion and the compressing feel provided to the outer layer by the inner layer and the optional soft cellular foam intermediate layer.
Another object of the present invention is the provision of an automotive interior trim article containing a panel structure made by the method of the present invention, and in particular the provision of a panel structure having an exterior surface which simulates the appearance and feel of authentic leather.
In accordance with the principles of the present invention, this object is attained by providing an article comprising a panel structure mountable in an automobile vehicle to form a part of the interior thereof. The panel structure has an exterior surface at least partially exposed to the vehicle interior and an interior surface which is hidden from the vehicle interior when the panel structure is mounted to the automobile vehicle structure. The panel structure comprises a reinforcing substrate and layered composite structure, with a soft cellular polyurethane foam layer optionally interposed therebetween. The reinforcing substrate has one surface defining the interior surface of the panel structure, and an opposite surface which is united to the layered composite structure. The layered composite structure comprises an outer layer and an inner layer. The outer layer defines at least a portion of the exposed exterior surface of the panel structure, and has the desired touch, color, and configuration of the panel structure, as well as exhibiting good chemical resistance. The outer layer comprises a substantially dried, light-stable, crosslinked polyurethane formulated from a water-dispersed composition comprising at least one desired coloring agent, at least one light-stable thermoplastic polyurethane containing one or more pendent hydroxyl and/or carboxyl functional groups, and a light-stable, blocked, heat-activated diisocyanate cross-linker. The light-stable aliphatic thermoplastic polyurethane and the blocked, heat-activated diisocyanate are heated to thereby produce a crosslinking reaction and molded on a heated mold surface shaped to define a complementary configuration to the outer layer, and then are dried on the mold surface. The inner layer, which is thicker than the outer layer, comprises an aromatic polyurethane elastomer formulated from a rapidly reacting composition containing at least one aromatic polyisocyanate and at least one polyol. The blocked, heat-activated diisocyanate serves to crosslink the aromatic polyurethane elastomer with the light-stable polyurethane of the outer layer. Consequently, the inner layer has a surface adjacent to and interfacially chemically bonded with an inner surface of the outer layer. The interfacial chemical bonds are formed by spraying the rapidly reacting composition onto the inner surface of the outer layer while the outer layer is retained on the mold surface. The reinforcing substrate serves to reinforce the outer layer while retaining the touch and color of the exposed portion and the compressing feel provided to the outer layer by the inner layer and the optionally interposed soft cellular polyurethane foam.
The composite provided in accordance with this embodiment exhibits excellent chemical, scuff and mar resistance to external influences. These and other properties are further enhanced by the selection of an aromatic polyisocyanate, as opposed to an aliphatic polyisocyanate, for making the polyurethane inner layer. Physical properties exhibited by and the processability of aromatic-based elastomers exceed those of aliphatic-based elastomers in several categories that are crucial in the automobile industry. For example, the improved processability of the aromatic-based elastomers is manifested by their better sprayability, reduced run-back, faster cure rates and demolding times, excellent handling, fewer pin holes, and more uniform thicknesses. The aromatic-based elastomers also exhibit higher tensile and tear strengths, better elongation and xe2x80x9ccold flexxe2x80x9d capability, and lower cost than their aliphatic-based counterparts. These characteristics translate into faster production times and higher quality products than could be attained with aliphatic-based elastomers. Moreover, concerns over the aromatic-based elastomer becoming less stable after prolonged exposure to light are obviated, since the light-stable polyurethane outer layer masks the aromatic-based elastomer from direct exposure to sunlight.
Further, appropriate additives can be introduced into the composite to provide the composite with the non-reflective and low gloss surface appearance desired for such panel structures. Furthermore, both the inner and outer layers of the composite are characterized by excellent extensibility, such that the composite can withstand indentation and flexure during use without causing cracking in the outer layer over a wide temperature range, such as from xe2x88x9230xc2x0 C. to 120xc2x0 C.
The principles of the present invention enunciated above are applicable to all types of panel structures, but have particular applicability to instrument panels (also referred to as dashboards) and door panels. Moreover, the principles of the present invention are applicable to various types of vehicles, including passenger cars, trucks, vans, utility vehicles, and others.
These and other objects, features, and advantages of the present invention will become apparent from the following detailed description when taken in conjunction with the accompanying drawings which illustrate, by way of example, the principles of the present invention. | {
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1. Field of the Invention
The present invention relates to printing apparatuses, printing methods, and media storing printing programs that print form data merged with print data.
2. Description of the Related Art
With printing apparatuses, conventionally fees are charged regardless of whether or not there is print data on the pages to be printed. That is, a fee is charged even for blank pages, and therefore there is a demand for fees to be charged flexibly in response to the objects to be printed, with various techniques being developed.
For example, in the case where in a printing apparatus there are pages to be printed that are blank, it is common to not charge a fee for the cost of toner or the like by inserting a “blank page no fee” command into the data of those pages. Furthermore, in order to prevent the “blank page no fee” command being inserted intentionally into non-blank pages to avoid fees, immediately prior to print processing after a rendering process, print data may be cleared for pages in which a “blank page no fee” command has been inserted such that a blank page is discharged (Japanese Patent Laid-Open No. 2004-139465).
In generally performed printing techniques there is form merging printing in which print data for merging and form data are merged. Form merging printing such as this is a technique in which data that has been captured by a scanner or stored as PDL data in advance is superimposed and printed as form data with print data. The aforementioned “blank page no fee” commands are held even in the case where printing is to be performed after data being stored once by a document storage function (also referred to as BOX function) of the printing apparatus, for example. Accordingly, multi-page data stored by the document storage function or the like is used as form data to carry out form merging printing. When a “blank page no fee” command is held in either the form data or the print data at this time, the command becomes valid and a blank page is outputted undesirably.
In recent years there has been increasing demand for printing apparatuses capable of supporting multi-page form data. In the case where the form data is multi-page, it is common that rather than generating all the form data, a user will generate form data by reusing and processing existing data for example. Here, it is conceivable that the aforementioned “blank page no fee” command is already inserted in any of the pages of the form data. If a “blank page no fee” command is inserted in a page that is of no concern to the user, a blank page will be undesirably output according to the original function of the “blank page no fee” command.
Generally, for a user to investigate whether or not a “blank page no fee” command has been inserted in data, it is necessary for that user to be familiar with PDL language for example. Consequently, it may be difficult for a user to delete “blank page no fee” commands when necessary.
Furthermore, there have been various methods in form merging printing in recent years, and representative examples of such methods that can be put forth include a method in which form data is printed on preprinted sheets that have been printed on in advance, and a method in which toner for print data and toner for form data are printed in a one-time operation. Also, in recent years, printing apparatuses have become common that combine these methods. Further still, form merging printing can also be used in, for example, a case where form data to be used indiscriminately for all pages such as a watermark is merged with print data for printing.
Accordingly, it is desirable that the application of blank page commands is flexible as desired by the user in form merging printing in which various functions are combined. | {
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1. Field of the Invention
The present invention relates to a functional material. The term “functional material” as used herein refers to a material which can serve a desired function based on its inherent properties such as electrical properties, dielectric properties, magnetic properties, optical properties, bonding properties or sealing properties. The functional material according to the present invention can be used as a wiring material, an electrode material, a filling material, a sealing material or a bonding material.
2. Description of the Related Art
As a means for realizing a three-dimensional circuit configuration in electronic devices such as various scales of integrated circuits, various types of semiconductor elements or chips thereof, there has been proposed a TSV (through-silicon-via) technology of providing a circuit substrate with a large number of through electrodes and stacking such circuit substrates. By applying the TSV technology to the three-dimensional circuit configuration, many functions can be packed into a small footprint. Moreover, important electrical pathways between elements can be dramatically shortened to increase processing speed. Japanese Patent No. 3869859 discloses a via hole structure essential for the TSV technology.
The via hole structure disclosed in Japanese Patent No. 3869859 must contain a binder and/or a reactive monomer or polymer in addition to a high melting point metal, a low melting point metal or metal alloy and a crosslinking agent. In a cured state within a via hole, a polymeric network generated by crosslinking of organic constituents of a conductive adhesive coexists with an alloyed metal network.
After the via hole structure disclosed in Japanese Patent No. 3869859 is cured within the via hole, the polymeric network coexists with the alloyed metal network, as described in its specification. This degrades electrical conductivity accordingly.
Also, there is a problem inherent in diffusion bonding of metal, i.e., the formation of voids, cracks or the like due to Kirkendall voids. Kirkendall voids arise as atomic vacancies (lattice), which arise from the asymmetry of interdiffusion, accumulate without disappearing. In the case of a Sn/Cu interface, for example, since Sn diffuses less than Cu, the vacancies accumulate at the interface between the intermetallic compound and Cu, thereby forming Kirkendall voids. Such Kirkendall voids may grow into a larger void or crack, deteriorating the reliability or quality of electrodes and therefore causing disconnection. Japanese Patent No. 3869859 does not disclose any countermeasure against this problem.
A similar problem arises when a wiring planar conductive pattern is formed on a surface of a wafer along with or independently of through electrodes, when semiconductor chips are connected to each other in an electronic device, e.g., in the form of three-dimensional system-in-package (3D-SiP), or when sealing is performed in a liquid crystal device or the like. | {
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The technical improvements in evolving video coding standards illustrate the trend of increasing coding efficiency to enable higher bit-rates, higher resolutions, and better video quality. The Joint Video Exploration Team is developing a new video coding scheme referred to as JVET. Similar to other video coding schemes like HEVC (High Efficiency Video Coding), JVET is a block-based hybrid spatial and temporal predictive coding scheme. However, relative to HEVC, JVET includes many modifications to bitstream structure, syntax, constraints, and mapping for the generation of decoded pictures. JVET has been implemented in Joint Exploration Model (JEM) encoders and decoders. | {
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This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present techniques, which are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.
Network-connected devices appear throughout homes, office buildings, and other structures. Some of these devices are capable of communicating with each other using a network. Some of these devices may be hazard detection systems, such as smoke detectors, carbon monoxide detectors, combination smoke and carbon monoxide detectors, or may be other systems for detecting other conditions have been used in residential, commercial, and industrial settings for safety and security considerations. When these systems detect the presence of a dangerous condition, they often sound an audible alarm. The alarm is often characterized as having an extremely loud or ear piercing sound, and can be unpleasant or very uncomfortable to a human listener. Some hazard detectors may permit a user to press a button located on the cover of the unit, sometimes termed a hush button or temporary silence button, when they know an alarm to be caused by a non-emergency situation, such as smoke from cooking. When the hush button or temporary silence button is pressed, the audible alarm noise is temporarily silenced for a predetermined interval of time, such as in the range of four to ten minutes, during which the user has an opportunity to address the situation, such as by opening a window, without being required to endure the ear-piercing sound of the alarm. If the condition persists at the end of the predetermined interval of time, then the audible alarm noise resumes. One issue that can arise in many practical situations is that the hazard detector unit is mounted high on a wall or on a ceiling that is out of the reach of the user, leading many users to seek out a ladder, chair, or broomstick in order to press the hush button or temporary silence button, which can lead to inconvenient, impractical, and/or unsafe scenarios. Other issues arise as would be apparent to a person skilled in the art in view of the instant disclosure. | {
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1. Field of the Invention
This invention relates to a method of investigating materials using x-rays and to apparatus therefor. More particularly, the invention relates to investigating biological specimens under ambient conditions of the environment by means of an x-ray microscope (XM). In a preferred embodiment, a novel scanning x-ray microscope (SXM) is provided and utilized in the method of the invention.
From the time of the discovery of x-ray radiation, x-rays have been utilized in many different ways for the investigation of materials including biological materials. Microscopes have been of great importance in the investigation of both biological and other materials. Optical microscopes are limited in resolution by the wavelength of the photons in a beam of visible light. The electron microscope (EM) was developed using the electromagnetic lens to focus the electrons. Electrons can have extremely short wavelengths which enables the EM to have very high magnification and greatly improved resolution compared with optical microscopes. Electrons are also employed in a scanning electron microscope (SEM), which operates in a different way from the EM. An SEM employs a beam of electrons focused to a spot having a diameter of several nm which is scanned over the surface of a sample in a pattern generating secondary electrons which are detected and amplified for each pixel to collectively compose a picture of the surface of the sample. Compared with an optical microscope, a far better resolution and depth of field is obtained.
However, investigation of materials with an EM or SEM requires examining the specimens in an evacuated environment for the passage of electrons, as well as treatment of the specimens. For investigation with an EM, a very thin specimen must be prepared and stained with heavy metals. The sample for a SEM requires coating with heavy metals.
2. Description of Related Art
A scanning x-ray microscope (SEM) is disclosed in U.S. Pat. No. 4,317,036 granted on Feb. 23, 1982 to Chia-Gee Wang. This patent discloses that prior attempts to construct x-ray microscopes were based on equipping electron microscopes with x-ray detectors and that such a system can function as an x-ray microscope with scanning electron detection. Among the factors stated to cause the prior XM to become complex and expensive was the need for a vacuum housing for the electron beam and the specimen. The invention of this patent was directed towards a more simple system in which a beam of x-rays was attempted to be focused onto a small spot for scanning the beam over a specimen, without the use of vacuum. However, it has been found that the necessary precise focusing of the x-ray beam is complex and difficult in many cases. Accordingly, there is a need in the art for a system which avoids the difficulty of focusing an x-ray beam, while providing a means of analyzing materials or specimens under normal conditions not involving the application of a vacuum to the specimens.
Many types of equipment have been developed to utilize x-rays for investigation or analysis of materials. One such type is an x-ray analyzer, electron-micro probe, generally described in "Van Nostrand's Scientific Encyclopedia", Sixth Edition, pages 3041-3044, the disclosure of which is incorporated herein by reference. This instrument is mainly used for metal-lurgical studies but properly prepared biological specimens may also be analyzed. An optical microscope is used to identify a point of interest on the specimen to be analyzed. An electron beam is focused on such point on the specimen and resulting x-rays are detected and processed to provide quantitative data. In the instrument of this reference, the electron beam is focused directly onto the specimen, both the beam and the specimen being under vacuum. The reference further discloses the production of electron beams and detectors for detection of x-rays.
The field is generally reviewed in "X-ray Microscopy", Proceedings of the International Symposium, Gottingen, Fed. Rep. of Germany, Sept. 14-16, 1983, edited by G. Schmal and D. Rudolph, Springer-Verlag, 1984, the contents being given on pages vii-ix.
X-rays have also been used for the detection of atoms in biological specimens using monochromatic x-rays, as disclosed in U.S. Pat. No. 4,239,966 issued on Dec. 16, 1980 and U.S. Pat. No. 4,382,181 issued on May 3, 1983, both issued to Chia-Gee Wang.
An article in SCIENCE, vol. 237, Aug. 14, 1987, pages 723-724 discusses current research in scanning x-ray microscopy. The article states that biological material in an aqueous environment has been imaged by scanning x-ray microscopy employing a synchrotron light source. X-rays from the light source are focused with use of a Fresnel zone plate. The system is described as not being perfected in view of lengthy time to record images so that dynamic processes cannot be studied and because of noise in the images. Future attempts are to involve brighter soft (long wavelength) x-ray sources, but the article states that it is yet to be demonstrated that cell structures will always survive this soft and intense x-ray dose. Also disclosed in the article are other prior techniques such as contact x-ray micrography in which shadowgraphs of samples illuminated by an x-ray beam are recorded by lithographic means and a transmission electron microscope is used to magnify the image. Prior work has also involved the x-ray analog of an optical microscope. Both the contact method and the optical analog method utilize an intense beam of soft x-rays from a synchrotron light source. The use of a scanning instrument is suggested because of the potential to employ a lower radiation dose and to follow changes within living cells, but the disadvantage of scanning is explained as involving the need to use a very bright x-ray source. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The present invention relates to a pen for receiving eyeglasses, more particularly a pen with a lateral opening to permit access to the interior of the pen from a lateral side thereof for easy storage of a pair of eyeglasses therein.
2. Description of the Related Art
Many people wear eyeglasses only on certain occasions. For instance, people suffering from presbyopia usually wear eyeglasses only for reading and close work, such as writing. Manufacturers have therefore developed a type of pen that has a receiving space for storing a pair of eyeglasses.
U.S. Pat. No. 5,929,967 teaches a pen for receiving eyeglasses, which includes a hollow pen barrel having a first open end and a second open end. The first open end is provided with a writing tip unit, while the second open end has a removable cap mounted pivotally thereon to allow access to an interior of the pen barrel for storage of a pair of eyeglasses from the rear end of the pen. Since the eyeglasses are inserted into the pen barrel via the rear end of the pen, the rear end of the pen, as well as relevant portions of the pen barrel, has to have a sufficiently large diameter for passage of the eyeglasses. As such, the design of the shape of the pen is somewhat restricted. Hence, conventional pens for receiving eyeglasses are generally cylindrical or tubular. In addition, mounting of an additional accessory, such as a flashlight, eraser, etc., to the rear end of the pen is not possible. | {
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1. Field of the Invention
The present invention relates generally to tracking persons and more specifically, to tracking a person of interest through voiceprint identification instead of tracking a caller through specific telephone numbers.
2. Introduction
Currently, when law enforcement or other groups wish to track a specific person's telephone conversations, they must first identify particular phone numbers from which the caller is likely to place calls or phone numbers likely to be called. The identified phone numbers are monitored for calls made and calls received in order to track various aspects of the person, such as location, plans, contacts, etc. Often, as is the case when tracking criminals or terrorists, a tracked person will use borrowed or stolen phones, payphones, disposable cellular phones, pre-paid cellular phones, or even no telephone at all by using VoIP on a computer or similar communications means. Such practices frustrate tracking of persons by monitoring specific telephone numbers. Accordingly, what is needed in the art is a method of tracking a person's telephone and other audio communications independent of specific communications devices. | {
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Embodiments disclosed herein relate to cable connectors and, in some cases, coaxial cable connectors. Such connectors are used to connect coaxial cables to various electronic devices, such as televisions, antennas, set-top boxes, satellite television receivers, etc. A coaxial cable connector may include a connector body for accommodating a coaxial cable, and a nut coupled to the body to mechanically attach the connector to an external device.
The Society of Cable Telecommunication Engineers (SCTE) provides values for the amount of torque recommended for connecting coaxial cable connectors to various external devices. Indeed, many cable television (CATV) providers, for example, also require installers to apply a torque of 25 to 30 in/lb to secure the fittings. The torque requirement prevents loss of signals (egress) or introduction of unwanted signals (ingress) between the two mating surfaces of the male and female connectors, known in the field as the reference plane. | {
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The position recognizing method for detecting the position of an object from a contrast image imaged by an image pickup device is widely used in visual recognition device of robots in various production facilities.
Of the position recognizing method used in such facilities one example of, a prior art device for recognizing the position of a screw hole is described below.
FIG. 5 is a block diagram showing a construction of a position recognizing apparatus utilizing a conventional position recognizing method, in which the central position of a circular object, being a screw hole, is detected. In FIG. 5, reference numeral 20 is image pickup means for picking up an object (not shown) and issuing a video signal, 21 is contrast image memory means for storing the video signal obtained from imaging with the image pickup means 20 as contrast image data, 22 is contrast image scanning means for scanning the contrast image data by a contour scanning window A described later, thereby obtaining scanning data. Reference numeral 23 is position calculating means for calculating the position of the object by using the scanning data.
FIG. 6 shows a construction of the contour scanning window A used in FIG. 5, and in FIG. 6 reference numeral 24 is a contour scanning circle having a diameter equal to the contour of the circular hole in the object, and 25 is a concentration correlation line for measuring the image concentration inside and outside of the contour scanning circle 24, orthogonal to the contour scanning circle 24, and the contour scanning window A is a window comprising a plurality of concentration correlation lines 25.
The position recognizing operation in the position recognizing apparatus in FIG. 5 is explained below as an application in the contour scanning window A in FIG. 6.
The video signal (image data) issued from the image pickup means 20 is stored in the contrast image memory means 21. This is the image data of the circular object, and it is scanned by the contrast image scanning means 22 in the contour scanning window A shown in FIG. 6, and position is calculated by the position calculating means 23 in every concentration correlation line 25, and the position of the contour scanning window A where the number of concentration correlation lines 25 of which value is greater than the threshold is maximum is detected as the position of the circular object.
In this case, the position calculating means 23 calculates the absolute value of the difference between the measured concentration value of a point inside the contour of the object on the concentration correlation line 25, and the measured concentration value of a point outside the contour of the object.
In the conventional method of recognizing the position, however, there are problems. When tightening plural screws from the contrast image data imaged from the top of the workpiece shown in FIG. 2, if the deviation between upper and lower holes was large, then the screw tightening operation was stopped. Each screw hole would then need to be evaluated so that the screws could be tightened. Hence, much processing time was spent performing position recognition.
The invention is intended to solve the problems of the prior art, and it is hence an object thereof to present a method of recognizing a screw hole and screwing method based on the recognition for detecting the deviation of an upper hole in an object and a lower hole in an object of pairs of holes, tightening the screws sequentially from the one of smaller deviation, and tightening all screws. Or detecting the deviation angle of the object to be tightened after detecting positions of two points, calculating the deviation of other holes, and tightening at high speed. | {
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The invention relates to a method of manufacturing optical fibres, in which glass is deposited in layers on the inner wall of a glass tube which is heated to a temperature between 1100.degree. and 1300.degree. C., and simultaneously on a glass rod which is arranged inside the glass tube, by leading a reactive gas mixture through the glass tube at a pressure between 1 and 30 hPa, while inside the glass tube a plasma is made to reciprocate strokewise between two reversal points after which the glass tube is made to collapse, following the deposition of a quantity of glass which corresponds to the intended construction of the optical fibre, so as to form a solid preform from which optical fibres are drawn.
A glass tube and a glass rod are to be understood to mean herein a substrate tube or a tube to be coated and a rod, which consist of synthetically manufactured amorphous silica or of amorphous silica manufactured from quartz crystals by melting fused silica, quartz glass, with the tube material possibly being doped, or which consist of both synthetically manufactured amorphous silica and amorphous silica manufactured from quartz crystals by melting (fused silica, quartz glass), with the tube material optionally being doped. The deposited glass consists of synthetically manufactured amorphous silica which is optionally doped.
The manufacture of optical fibres or optical waveguides according to the above-mentioned method is known from, U.S. Pat. No. Re. 30,635 and U.S. Pat. No. 4,314,833, the version in which the glass is simultaneously deposited on a glass rod arranged inside the glass tube, being known from U.S. Pat. No. Re. 30,635. The method of manufacturing except for said version is in practice referred to as "nonisothermal plasma-CVD-method" (nonisothermal PCVD method, in which P=plasma and CVD=chemical vapour deposition=reactive deposition from the gas phase). In this method, glass layers are directly deposited from the gas phase on the inner wall of the glass tube (hetereogeneous reaction). In this way, the formation of glass soot in the gas phase is prevented; this is described in greater detail in, in particular, U.S. Pat. No. 4,314,833.
By means of the PCVD method both graded-index fibres and stepped-index fibres can be manufactured, with quantities of glass being deposited which correspond to the relevant construction of the fibre.
Single-mode optical fibres having radially symmetrical refractive index profiles can transmit both orthogonally polarized HE.sub.11 -modes. Mode-coupling is obtained by quasi statistically distributed internal and external interferences, so that light transmission while preserving the original direction of polarization is impossible with these fibres. However, polarization-retaining optical fibres are of great interest for applications in interferometry, in coherent optical communication systems, in non-linear optics etc. It is known that such fibres can be obtained by using refractive index profiles which are not radially symmetrical, i.e. having elliptical or other unround fibre cores (for example EP Patent 47,037, U.S. Pat. No. 4,106,847) or by stress-induced birefringence in the core by means of a non-circular, stress-producing optical cladding (for example U.S. Pat. No. 4,274,854). Many appropriate structures for polarization retaining fibres and methods of manufacturing such structures are described by, inter alia, R. H. Stolen et al. (Electron. Lett. 18 (1982) 764-765), T. Hosaka (Electron. Lett. 17 (1981) 530-531, R. D. Birch et al. (Electron. Lett. 18 (1982) 1036-1037) and S. C. Rashleigh and R. H. Stolen (Fiberoptic Techn. (May 1983) 155-160). As regards internal coating methods, all known manufacturing methods are based on mechanical processes to which the substrate tube is subjected (for example grinding or polishing), on deformation during collapsing using an underpressure or on chemical etching (for example gas phase etching or etching in combination with photolithographic means). However, all these techniques have the disadvantage that interfering with the customary fibre-manufacturing process is necessary, causing the introduction of impurities or problems with cracks occurring in the preform, or that the desired geometrical and optical profiles are only reproducible with great difficulties. | {
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An engine compartment is disposed in the rear part of the wheel loader. The engine room accommodates an engine and a cooling device, and further accommodates a fuel tank below the devices. The cooling device is formed by a fan to be rotated by the engine, an intercooler, an oil cooler, a radiator and etc.
For example, Japan Laid-open Patent Application Publication No. JP-A-2002-266376 describes an exemplary conventional structure of such wheel loader rear part. In the rear part structure described in Japan Laid-open Patent Application Publication No. JP-A-2002-266376, a fuel tank is attached to the bottom surface of the rear end part of a vehicle body frame. The rear part of the fuel tank is extended to a position roughly the same as that of the rear end of the vehicle body frame, while being supported by a plate of the rear end of the vehicle body frame. Further, a cooling device, including a radiator and an oil cooler, is disposed above the fuel tank. | {
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Recently, as the demand for portable electronic products such as notebooks, video cameras, mobile phones, etc. are rapidly increasing, so are the development of energy storage batteries, robots, satellites, etc., which is leading to the extensive research on high-performance secondary batteries capable of repeated charge and discharge.
Commercially available secondary batteries at present include nickel-cadmium batteries, nickel-hydrogen batteries, nickel-zinc batteries, lithium secondary batteries, etc. Among them, the lithium secondary batteries are less susceptible to memory effect compared to nickel-based secondary batteries and thus can be freely charged and discharged. Moreover, the lithium secondary batteries are attracting much attention for its very low self-discharge rate and high energy density.
In particular, with the recent increase in the interest in the environment where carbon energy is being depleted, environmentally-friendly vehicles such as hybrid vehicles, electric vehicles, etc. have attracted much attention all over the world, including USA, Europe, Japan, and Korea. In such a hybrid vehicle or electric vehicle, the most critical component is a battery, for it provides a driving force to a vehicle motor. The hybrid vehicle or electric vehicle are powered by the charge and discharge of the battery, and thus have high fuel efficiency and do not emit pollutants compared to conventional vehicles powered by internal combustion engines. As a result, the number of users of such vehicles is significantly increasing.
In the case of the battery that is used in such a hybrid vehicle or electric vehicle, the battery's state-of-charge (SOC) may be reduced to the lower limit during operation of the vehicle, by the natural consumption of the battery, or by a power leakage from the vehicle during stopping of the vehicle. The battery's state-of-charge reduced to the lower limit refers to a fully discharged state. At this time, no power is supplied from the battery, and thus the operation of the electric vehicle or devices powered by the battery is severely limited.
Under normal circumstances, when the battery is fully discharged or approaches the fully discharged state, the battery is charged in a battery charging station or by using a battery charger. However, when the vehicle battery is in the fully discharged state in a situation where the vehicle is not located in the battery charging station, the vehicle will not operate, making it necessary to provide emergency charging to the battery. In such a situation, the emergency charging may be provided by an emergency vehicle or another vehicle, otherwise, an emergency battery may be used instead of the fully discharged battery to move to the station.
As such, a vehicle battery provided with an auxiliary charging terminal to have an emergency charging function, a vehicle battery provided with a space for mounting an auxiliary battery, etc. have been developed to prepare for emergencies. Furthermore, a battery with both the emergency charging function and the auxiliary battery mounting function can be a very useful unit for responding to emergencies.
However, in the case of the battery with both the emergency charging function and the auxiliary battery mounting function, there is a lack of research on how to control the battery for each situation. Moreover, vehicle batteries of recent years are provided with a complex control system and various safety units. Therefore, when the emergency charging function and the auxiliary battery mounting function are simply added to the battery, a battery control apparat8s cannot effectively control the battery, and thus the battery itself may have serious safety problems. | {
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1. Field of the Invention
The invention relates to a method for testing through-silicon-via (hereinafter abbreviated as TSV) structures, and more particularly, to a method for testing electrical continuity of TSV structures.
2. Description of the Prior Art
With progress in semiconductor manufacturing technology, a multitude of chips may now be integrated into one single package. And in a single package, the connection between chips is realized by TSV structures.
Conventionally, a TSV structure is formed by deep etching into the wafer or the substrate, and filling the resulting hole with a liner and a conductive filling layer. Then, the wafer is thinned from its backside, until the conductive filling layer is exposed, and a backside metal and bumps are deposited on the thinned backside for electrical contact. It is well-known that the TSV structures are not functional before forming the backside metal and the bumps. Therefore, it is extremely difficult to determine whether the TSV structure is defective or not by the conventional inline electrical testing before completing the abovementioned steps. Accordingly, throughput, efficiency, and cost of the semiconductor fabrication process are adversely influenced. | {
"pile_set_name": "USPTO Backgrounds"
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A campaign program is a plan to achieve an objective, usually over an extended period of time. The campaign program usually coordinates many activities and uses of resources involving multiple organizations. A campaign program can also have subordinate objectives or intermediate milestones and is often broken down by phases. Campaign programs are often created for health care services, financial services, and other areas. A health campaign program, for example, can be conducted for offering guidance on various health related topics such as weight loss, a workout routine, etc. A finance campaign program can be conducted, for example, to offer guidance on finance related topics such as investments, saving a percentage of monthly income, etc. Traditional campaign programs are typically conducted using media such as email, telephone, print media and television.
Current campaign programs are typically targeted to a general audience, even though they may be intended for only a specific group of people who may be interested in a particular campaign. Further, the campaign programs are typically not customized to specific individuals. Consequently, such campaigns are not very effective because they fail to target the right group of individuals and because they are not relevant to every individual. For example, a health campaign program for weight loss which suggests a general weight loss diet may be relevant to an individual who generally prefers Mexican Cuisine, but may not be relevant to another individual who prefers Italian Cuisine.
Some email based campaign programs are targeted to a set of participants. However, email is not an effective medium for conducting campaign programs. Some studies suggest that only 28% of emails are reportedly read within a few minutes of receipt, and therefore fail to prompt the participants to respond. Accordingly, the current campaign programs are not effective. | {
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The following documents are incorporated by reference herein: [1] Mark Johnson, U.S. Pat. No. 5,629,549 (May 13, 1997). [2] Mark Johnson, B. R. Bennett, P. R. Hammar and M. M. Miller, “Magnetoelectronic Latching Boolean Gate,” Solid State Electronics 44, 1099 (2000). [3] A. Ney et al., Programmable Computing with a Single Magnetoresistive Element,” Nature 425, 485 (2003). [4] P. Xu et al., “An All-Metal Logic Gate Based on Current-Driven Domain Wall Motion,” Nature Nanotech 3, 97 (2008). [5] B. Behin-Aein et al., “Proposal for an All-Spin Logic Device with Built-in Memory,” Nature Nanotech 5, 266 (2010). [6] J. Hong, M. Johnson et al., “Magnetic field controlled reconfigurable semiconductor logic,” published online in Nature, approximately Jan. 30 2013.
The existing technology for information processing is based on digital semiconductor electronics, dominated by Complementary Metal Oxide Semiconductor (CMOS) technology. The basic device is a Field Effect Transistor (CMOS FET), a planar, three terminal device comprising a source, drain, a channel connecting source and drain, and a gate. A gate voltage applied to the gate modulates the source-drain conductance, equivalently the conductance of the channel. Logical gates that perform basic Boolean operations on binary inputs of “0” or “1” are formed using arrangements of 4 to 8 FETs. The basic Boolean operations include AND, OR, NAND, NOR, XOR, and XNOR. More complex logic functions are built up using arrangements of the basic gates. High speed memory cells, Static Random Access Memory (SRAM), also are formed using arrangements of 4 to 8 FETs. Another kind of high speed memory, called a “flip-flop” or a “latch” memory, can be formed from a different arrangement of FETs. A combination of FETs can be arranged to form an on/off or “pass” switch. One example, a tri-state buffer, can pass a “0” or a “1” or it can disconnect its output from the output line. A tri-state buffer (also called an “on (pass)/off” switch) allows multiple outputs to connect to a single wire, permitting only one of them to drive a binary “0” or “1” onto the line.
A CMOS FET is an active device. It is connected to a supply voltage (typically called VDD) and a ground. The FET dissipates power during operation. When idle, the FET dissipates quiescent power in proportion to its characteristic leakage current. Any CMOS logic operation begins by supplying power to the circuit and all CMOS FETs dissipate power at any time that power is supplied. When power to the circuit is removed, all results of the logic operations are is erased unless a separate operation has been used to write the results to a separate memory array, either on- or off-chip. These kinds of logic circuits and operations can be called “volatile” logic, and volatile logic dissipates quiescent power.
FIG. 4 is a block diagram of a prior art microprocessor, adapted from the article “How Microprocessors Work,” by Marshall Brain [http://computer.howstuffworks.com/microprocessor2.htm/]. This represents the architecture of existing logic circuits (prior art), based on FETs. The combinations of devices introduced above form the elements (boxes) in the microprocessor diagram. The detailed operation of logic circuits is not necessary for an understanding of the invention. An introduction and general discussion of a microprocessor may be beneficial and is provided in the following remarks.
The microprocessor represented in FIG. 4 may be a simple unit for simple operations. It may also represent a more complicated unit such as the central processing unit (CPU) of a computer or computing system. The Clock is typically separate from the microprocessor, and there is a separate memory area (on- or off-chip) connected to the processor by one or more bus lines. The ALU is the Arithmetic Logic Unit and it performs binary logic operations. The Instruction Decoder accepts commands from a program (for example, it may retrieve a program from memory), translates the command to binary instructions and operations that can be performed at a low, granular level (sometimes called “machine language”), and controls the individual components of the microprocessor. In the simplest case, the ALU performs one of the basic Boolean operations AND, OR, NAND, NOR, NOT, XOR, XNOR, and operates on single bits. At a slightly higher level, the ALU might be a half adder. A slightly higher level would be a full adder operating on 8 bits. At a rather high level, the ALU might perform addition, subtraction, multiplication and division of n-bit numbers. For a simple example, it may be helpful to think of a basic Boolean operation on two bits, stored in Registers A and B (“flip-flop” or “latch” memory), with the output stored in Register C. In FIG. 4, black lines represent lines that pass data (also called bus lines).
The Instruction decoder has a control line to each element in the microprocessor (gray lines in FIG. 4). These control lines send instructions. For example, the Instruction decoder may send the following instructions: Tell the A register to latch (store) the value currently on the data bus. Tell the B register to latch the value currently on the data bus. Tell the C register to latch the value currently output by the ALU. Tell the program counter register to latch the value currently on the data bus. Tell the address register to latch the value currently on the data bus. Tell the instruction register to latch the value currently on the data bus. Tell the program counter to increment. Tell the program counter to reset to zero. Activate an On (pass)/Off switch, allowing data to pass through (default is Off, an open circuit). Tell the ALU what operation to perform. Tell the test register to latch the test bit from the ALU (e.g. for comparison at later step). Activate the Read line. Activate the Write line.
The Instruction decoder can receive bits of data from the Test Register and the Instruction Register. It is driven by the Clock and can be reset by external command.
Any instruction is implemented as a series of bit patterns, and a set of instructions is a program. The Instruction decoder may receive a program by reading it from memory, or it may receive a program from external input. The Instruction decoder has a list of basic instructions stored in “read only memory” (ROM), and it translates lines of program memory to lines of basic instructions. Simple instructions are coded as words in “Assembly” language. Some examples of simple instructions are given below. In the following, “address” may refer to an external address, such as an address on a different chip or a different sector (e.g. memory). “Address” may also refer to one of the elements in the microprocessor, or to a specific line in the program. LOADA mem# Load register A with the binary value in memory address “mem#” The sequence of low-level instructions would be: send “mem#” to address register (from Instruction Register) activate On/Off switch to open line to Address bus line activate read line (data in address register “mem#” is sent to Data bus) activate On/Off switch to open “Data in” line to Data bus activate On/Off switch to open Register A data is sent to Register A and latched (stored) LOADB mem# Load register B with the binary value in address “mem#” CONB const Load constant value “const” into register B [similar for register A] SAVEA mem# Save the binary value in register A to address “mem#” [similar for registers B, C] ADD Add the values in registers A and B and store the result in register C SUB Subtract the values in registers A and B and store the result in register C MUL Multiply the values in registers A and B and store the result in register C DIV Divide the values in registers A and B and store the result in register C COM Compare the values in registers A and B and store the result in register C JUMP addr# Jump to address “addr#” JEQ addr# If equal, jump to address “addr#” JNEQ addr# If not equal, jump to address “addr#” JG addr# If greater than, jump to address “addr#” JGE addr# If greater than or equal to, jump to address “addr#” JL addr# If less than, jump to address “addr#” JLE addr# If less than or equal to, jump to address “addr#” STOP Stop execution
As another example of a simple operation, the ADD instruction would require the following set of signals from the Instruction decoder: First clock cycle: (load the instruction) Activate the On/Off switch for the program counter Activate the Read line (the current program line address is sent to memory) Activate the On/Off switch for the data-in line Read the instruction into the Instruction Register Second clock cycle: (decode the ADD instruction) set the ALU operation to addition send the output of the ALU to Register C and store (latch) Third clock cycle: (increment program counter) send increment command from Instruction Decoder to Program counter
According to the prior art represented by FIG. 4, all of the digital electronic devices and structures represented with blocks are active devices. They draw power from a power supply at a specified voltage (called VDD for CMOS, as mentioned above). For the microprocessor to operate, a power supply is switched ON and all the elements inside the heavily dotted lines in FIG. 4 draw power. They continue to draw power until the power supply is switched OFF, at which time the results of all logic processes are erased unless they have been stored to a separate nonvolatile storage chip or device. As noted above, the Clock is continuously powered and may reside on the processor chip or may be a separate, stand-alone unit. | {
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1. Field of the Invention
This invention relates to power supply monitoring schemes and, more particularly, to a circuit and method for monitoring the integrity of a power supply by monitoring a level of the power supply and/or an electrical connection between the power supply and a power supply pin.
2. Description of the Related Art
The following descriptions and examples are given as background only.
Many integrated circuits and systems, such as microprocessors, microcontrollers and other programmable logic devices, are sensitive to the output levels of the power supplies driving the systems. In fact, such systems are often characterized by unique requirements for initialization control sequences, power-up and power-down control sequences, and unintentional reset sequences that may occur, e.g., during power glitches.
For instance, many programmable logic devices (PLDs) must be “powered-up” or awakened from a zero power state to a point at which the power supply voltage reaches an acceptable operating voltage level. For example, internal memory cells, registers and configuration state machines of the device may all be initialized according to specific power-up reset sequences. Once the power supply voltage reaches an acceptable operating voltage level, the configuration state machine may take control of the configuration process by loading configuration data into volatile memory cells. When all of the data has been loaded, the I/O pins of the PLD are enabled and the device is ready to begin performing its programmed function.
Another reset process takes place when a device is powered down, i.e., when the power supply voltage is brought down from the operating voltage level to the zero power state (or below a triggering voltage level). During the power-down reset sequence, the PLD may detect that the power supply voltage has reached or is nearing an unacceptably low level. If detected, the PLD performs a sequence of operations such as saving current memory cell, register and state machine information, informing other integrated circuits to stop sending data to the PLD, and so forth.
The power-up and power-down reset procedures are complicated by the fact that power supplies can be noisy, sometimes glitching significantly above and/or below a triggering voltage level. For example, assume that the PLD (or another power-dependent component) is included within a computer system that shares a power supply line with various appliances (such as an air conditioner, electric drill, etc.). In some cases, a large current spike may be introduced into the shared supply line when one or more of the appliances are turned on. If the current spike causes the supply line voltage to drop below the acceptable operating voltage level, the PLD may lose volatile information (such as register and memory content) or may enter the wrong configuration state. In addition to glitches, other types of power failure (such as temporary loss of power) may produce the same results by not giving the PLD enough time to perform a proper power-down sequence.
During the power-up reset sequence, a reset signal is typically asserted (i.e., “ON”) when the power supply voltage is rising towards the acceptable operating voltage level, and deasserted (i.e., “OFF”) once the power supply voltages reaches the acceptable level. The power-down reset sequence is similar; however, the reset signal is asserted once the power supply voltage falls below an unacceptable operating voltage level, and deasserted once the power supply voltage reaches the zero power state. To operate properly, both reset sequences must be asserted for a specific duration of time needed to perform the power-up or power-down sequence of operations.
Most conventional systems include at least one power-on reset (POR) circuit for monitoring the power supply voltage and generating a reset signal, in accordance with a power-up and/or power-down reset operation. The POR circuit may also be implemented to ensure that the reset signals are asserted for the required duration. Most POR circuits are based on circuits comprising resistors and capacitors (e.g., RC POR circuits) or, in some cases, voltage comparators comprising voltage dividers and voltage reference generators (e.g., bandgap POR circuits). All provide an active high (or active low) reset signal to one or more system components, indicating that they should perform the necessary power-up or power-down reset functions. However, none of the conventional POR circuits provide indication as to the cause behind the reset signal, thus, leaving the circuit designer or user in the dark as to the reason for the power failure.
For at least these reasons, a need remains for an improved circuit and method for monitoring the integrity of a power supply, where such method provides the circuit designer/user with additional resources/information for diagnosing a cause behind the reset signal, and thus, a reason for the power failure. | {
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Microchannel plates (MCPs) are used to detect very low fluxes (down to single event counting) including ions, electrons, photons, neutral atoms, and neutrons. For example, microchannel plates are commonly used as electron multipliers in image intensifying devices. A microchannel plate is a slab of high resistance material having a plurality of tiny tubes or slots, which are known as pores or microchannels, extending through the slab. The microchannels are parallel to each other and may be positioned at a small angle to the surface. The microchannels are usually densely packed. A high resistance layer and a layer having high secondary electron emission efficiency are formed on the inner surface of each of the plurality of channels so that it functions as a continuous dynode. A conductive coating is deposited on the top and bottom surfaces of the slab comprising the microchannel plate.
In operation, an accelerating voltage is applied between the conductive coatings on the top and bottom surfaces of the microchannel plate. The accelerating voltage establishes a potential gradient between the opposite ends of each of the plurality of channels. Ions and/or electrons traveling in the plurality of channels are accelerated. These ions and electrons collide against the high resistance outer layer of the pore having high secondary electron emission efficiency, thereby producing secondary electrons. The secondary electrons are accelerated and undergo multiple collisions with the emissive layer. Consequently, electrons are multiplied inside each of the plurality of channels. The electrons eventually leave the channel at the output end of each of the plurality of channels. The electrons can be detected or can be used to form images on an electron sensitive screen, such as a phosphor screen or on a variety of analog and digital readouts. | {
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The present invention relates to hard disk drives used to store data, and more particularly to a head-media system having reduced stiction and low fly height capability.
In the field of hard disk storage systems, continuous improvements have been made in increasing the areal density, i.e., the number of stored bits per unit of surface area. As is well known, decreasing the fly height of the read/write head results in reduced pulse width (PW50) due to a number of factors which allows for greater recording density. For a discussion of the effects of lower fly height, see, for example, U.S. Pat. No. 5,673,156. In any event, bringing the head closer to the media has been a key area of effort in increasing recording densities.
The read/write head is typically a part of or affixed to a larger body that flies over the disk and is typically referred to as a xe2x80x9csliderxe2x80x9d. The slider has a lower surface referred to as the air bearing surface. The air bearing surface typically comprises one or more rails which generally generate a positive air pressure. In addition, there is often a cavity or similar structure that creates a sub-ambient pressure to counterbalance the positive pressure to some extent. The slider body is attached to a suspension via a head gimbal assembly which biases the slider body towards the disk. The net effect of the air bearing surface and the suspension is to cause the slider to fly at the desired height when the disk is at full speed, and to cause the slider to be in contact with the disk surface when the disk is at rest. The portion of the slider that contacts the disk is typically the aforementioned one or more rails. As the fly height of the slider is reduced, it is necessary to produce disks with increasingly smooth surfaces. As is well known, the slider undergoes sliding contact with a portion of the disk whenever the drive motor is turned on or off. This contact between the slider and the disk occurring when the drive is turned on and off is known as contact start stop (CSS) operation.
The CSS motion between the slider and the disk is of great concern in the reliability of the drive since it is generally the major initiator of failure in hard disk drives. In today""s commercially available disk drives, generally 20,000 CSS cycles for desk-top computer applications and up to 100,000 CSS cycles for portable or hand-held computer applications is considered adequate. A greater number of CSS cycles is needed in portable and hand-held computer applications because the drives are frequently turned on and off to conserve battery power. Recently, there has been a trend to reduce power consumption in desktop computers. Therefore it is expected that CSS requirements will greatly increase for desktop applications as well.
In order to improve the CSS performance, it is well understood that friction must be minimized between the slider and the disk. Static friction or stiction is a term used to describe the force exerted against the motion of the slider relative to the disk surface when the slider is at rest on the disk surface. Stiction values are often given in grams to represent the force required to separate the slider from the disk. The stiction is greatly increased if the lubricant that is used on the surface of most disks wets a significant portion of the slider/disk interface.
Often, the term initial stiction refers to the stiction encountered when the slider contacts the disk for a minimal amount of time, without a significant opportunity for lubricant to migrate to the slider/disk interface. Parking stiction is a term used when the disk drive has not been in use, so that the slider has been at rest on the CSS zone for some time and may have some lubricant migration to the interface. Parking stiction is typically greater than initial stiction. Finally, the term fly stiction is used to describe the situation where the slider has flown over the disk for a considerable amount of time so as to pick up lubricant, and then after returning to the disk surface has remained on the disk surface for a sufficient time to allow the lubricant to flow to and significantly wet the interface, thereby greatly increasing stiction. Stiction can be strong enough to prevent the drive motor from turning, or worse yet, can damage the head, cause the slider to become detached from the suspension assembly, or cause the slider to ding the disk surface during separation of the slider from the disk surface. (The term xe2x80x9cdingxe2x80x9d is used in the art to describe an abnormal and sudden impact of the slider against the disk surface which dents the disk surface around the impact area. This can occur, for example, by accidentally dropping the disk drive on a hard surface. This can also occur when the slider is stuck on the disk surface during drive start-up due to high stiction, followed by sudden release of the slider, which causes it to bounce on and thereby dent the disk surface.)
It has been recognized that stiction can be reduced by putting a xe2x80x9cmicro-texturexe2x80x9d on the disk surface to reduce the effective contact area between the slider and the disk. See, for example, Marchon et al., xe2x80x9cSignificance of Surface Roughness Measurements. Application to the Tribology of the Head/Disk Interface,xe2x80x9d Tribology and Mechanics of Magnetic Storage Systems VI, ASLE SP-26, page 71 (1990), which describes the roughness needed to achieve an acceptable rate of increase in stiction under prolonged CSS for a disk comprising an aluminum/NiP substrate with a near concentric texture pattern. Also, Lee et al., describe the effect of texture crossing angle on CSS performance in xe2x80x9cEffect of Disk Cross Hatch Texture on Tribological Performancexe2x80x9d, published in IEEE Transaction on Magnetics, Vol. 28, No. 5, September 1992, pp. 2880-2882. In effect, a rougher texture and modification of texture morphology is needed to achieve acceptable CSS performance. The texture pattern may be put on the disk by mechanically abrading the substrate surface using well known methods.
In contrast to the requirements of CSS operation, for reading or writing data it is desirable that the surface of the disk be as smooth as possible to allow the head to fly as close as possible to the disk surface. Because of these differing requirements, it is known to use zone texturing where a portion of the disk used for CSS operation (the CSS zone) is textured more heavily than the portion of the disk used for data storage (the data zone). One problem with such zone texturing, however, is that it is difficult to create a precisely delineated CSS zone with mechanical texturing methods. Because of this, some portion of the data zone is typically lost, thus reducing the amount of data a disk can hold.
Because the data zone is smoother than the CSS zone, both the glide height (minimum distance at which a slider may fly without contacting any portion of the disk surface) and the glide avalanche height (distance above mean disk surface level at which the slider makes regular and continuous contact with the disk surface) are lower in the data zone than in the CSS zone. However, because it is necessary to move the head from over the data zone to the CSS zone, the glide avalanche height of the CSS zone limits the fly height over the data zone, as the head must be able to safely move between the two zones, without undue contact in the CSS zone which could lead to wear of the disk surface, the slider, and generation of debris. It should be noted that it is difficult to produce mechanical texturing with a high degree of uniformity. This nonuniformity in surface texture means that some portions of the CSS zone may be considerably rougher than average, which poses further limitations on the fly height.
Another known method to provide the necessary texture in the CSS zone is laser zone texturing. An example of this method is described in U.S. Pat. No. 5,108,781. In such a method, a laser beam is focused to a small spot on the disk surface, forming uniformly shaped and sized features in a controllable pattern. Because of the high degree of control possible with a laser system, the CSS zone can be precisely delineated so that loss of data zone area can be minimized. Furthermore, because the size of the features is better controlled than the surface morphology resulting from mechanical texturing, the above-described uniformity problem is greatly reduced. However, because the surface in the laser texture zone has a considerably greater roughness than the data zone, the CSS zone still provides a limitation to the fly height even in laser zone textured disks. See xe2x80x9cThe Special Needs of Server Class Drivesxe2x80x9d by Wachenschwanz et al., IDEMA Insight, Vol. XI, No. 1, January/February 1998 which illustrates that laser zone texturing achieves acceptable stiction performance for today""s devices and further asserts that laser based zone textured disks should be extendible for at least two generations.
Another method to reduce stiction in CSS operation is to provide a texture on the surface of the slider rather than the disk. Such sliders are frequently referred to as xe2x80x9cpaddedxe2x80x9d sliders or xe2x80x9cstiction-freexe2x80x9d sliders. The texture may be provided in a variety of menners. For example, xe2x80x9cNumerical Simulation of the Steady State Flying Characteristics of a Fifty Percent Slider with Surface Texturexe2x80x9d by Wahl et al., IEEE Transactions on Magnetics, Vol. 30, No. 6, November 1994, discloses a slider having a plurality of hemispherical, conical, or cylindrical features arranged in a densely packed pattern thereon. U.S. Pat. No. 5,079,657 teaches several varieties of textured sliders using chemical etching in one embodiment formed by differential etching, and in another embodiment formed by the use of a masked photo resist layer. xe2x80x9cStiction Free Slider for Lightly Textured Disksxe2x80x9d, by D. Yamamoto et al., IEEE Trans. Mag. Vol. 34, No. 4, 1998, shows a textured slider which has one or more xe2x80x9cpadsxe2x80x9d along the length of each rail. Herein, a slider having texture formed by any method, including the foregoing, with any type of pattern is referred to as a xe2x80x9ctexturedxe2x80x9d slider.
FIGS. 1A and 1B show two examples of textured sliders. As shown in FIGS. 1A and 1B, the sliders comprise a slider body 101a/b coupled to suspension 102a/b. Each of the sliders comprises two rails 103a/b (although sliders with a single rail and sliders with more than two rails may be used). Also as shown in FIGS. 1A and 1B, each of the rails has a plurality of pads 104a/b. In the particular slider shown in FIG. 1B, each pad 104b may have dimensions, for example, of approximately 35-50 microns wide by 50-100 microns long. Of course other dimensions may be used.
In the above described textured sliders, the intent is to provide a slider surface that has some portions at a different elevation than others to reduce the total contact area and thereby reduce stiction. One advantage to using such sliders is that a lower roughness of the disk surface is needed to meet stiction requirements. This lower roughness is comparable to the roughness of current data zone texture, so that the entire disk surface may be textured as appropriate for data storage, thus allowing for lower fly heights and increased density. Additionally, textured sliders are intended to eliminate the need for a separate zone, whether by mechanical texturing with its concomitant loss in usable area, or laser zone texturing which typically adds a step to the disk fabrication process. In the above mentioned article by Yamamoto et al., it is stated that the stiction results obtained with the stiction free slider described therein is acceptable even on relatively lightly textured surfaces which have a roughness comparable to current data zone texture. Recently, it has been reported that a textured slider may be extendible for the next several generations of disk drives. See xe2x80x9cFujitsu""s Padded Slider Hold Stiction at Bayxe2x80x9d, Data Storage, May 1998, page 8.
A further approach to the stiction problem is drives using a so-called xe2x80x9cload/unloadxe2x80x9d mechanism. In these drives, when the drive is turned off, the head is parked on a ramp and not on the disk surface. Therefore, in load/unload drives, the problem of stiction is eliminated. However, the load/unload mechanism adds to the cost and complexity of the drive.
As can be seen from the foregoing, current attempts are to either improve the disk texturing, with particular current emphasis on laser zone texturing or alternatively to eliminate the need for a separate zone by providing a textured slider or by providing a load/unload mechanism.
As recording density increases, ever smoother surfaces will be required so that heads may fly lower. Current state-of-the-art systems have glide avalanche heights in the data zone of approximately 0.8 through 1.0 microinch (xcexcxe2x80x3). In the future, glide avalanche heights of approximately 0.4xcexcxe2x80x3 or below will be needed for disks having densities in the range of approximately 3-5 gigabits per square inch (Gb/in2). On a laser zone textured disk, the glide avalanche height for such CSS zone would need to be in the range of approximately 0.6-0.7xcexcxe2x80x3. An average laser bump height in the range of approximately 50-100 angstroms (xc3x85) will provide a glide avalanche height in this range, but is likely to have unacceptably high stiction for conventional sliders. Thus, what is needed is a method and apparatus for providing a slider-head system having very low glide height and acceptable stiction performance.
A method and apparatus having a disk and body for use in a disk drive system is described. In one embodiment, the apparatus includes a disk and a body in sliding contact with a contact surface of the disk during a portion of an operation of the disk. The body has a surface comprising a pattern of features having a first distance between the features. The disk comprises at least a first zone that includes the contact surface. The first zone has a roughness comprising a plurality of protrusions having a second distance between the protrusions. The second distance between the protrusions is less than the first distance between the features.
Other features and advantages of the present invention will become apparent from the detailed description, figures and claims which follow. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The invention relates to storage media, particularly to a quick mounting system and media for video and other recordings.
2. Related Art
Historically, the television and film industry has relied on chemical film to record motion pictures and other videos recordings. This process has a number of disadvantages in that it requires the use of chemical processing which introduces delays between the time footage is recorded and the time the footage may be reviewed. It is also costly to purchase the file media itself and the post processing is expensive and time consuming. In recent years, the industry has moved away from chemical film and started utilizing digital media to record video footage to reduce the time between recoding and reviewing of footage and to realize other benefits.
In both chemical film and digital media, large volumes of media are used during filming. Even in digital media, the volume of media consumed may be so large that in some cases that attempts have been made to record motion pictures on remote storage devices. This requires a video camera to be tethered to a storage device by one or more data transmission cables. As can be appreciated, this arrangement is cumbersome to the camera man and even with high speed connections, the transfer of digital data from one device to another consumes a substantial amount of time.
While some attempts have been made to utilize digital media contained within a camera, such attempts have been unsuccessful except perhaps in simple consumer applications. In addition to such cameras not containing enough media, the transfer process from the media to post processing is too slow and would prevent use of the camera during the transfer.
From the discussion that follows, it will become apparent that the present invention addresses the deficiencies associated with the prior art while providing numerous additional advantages and benefits not contemplated or possible with prior art constructions. | {
"pile_set_name": "USPTO Backgrounds"
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This invention relates to the field of computer systems. More particularly, a system and methods are provided for maintaining and synchronizing lists of content sources, channels, and/or other information.
Websites that serve content to users in different categories or of different types sometimes use an inflexible ordering of those categories or types, which the users cannot change. For example, a website may always provide multiple categories in alphabetical order of the category names, and a user cannot change that order to place their primary interest(s) first. Or, some websites will combine (e.g., interleave) content of different categories in a fixed way for presentation to the user, such as by selecting one item at a time from each category in a fixed order that the user cannot alter.
Even if a website allows a user to re-order content categories or types, the user's changes may not be replicated automatically across all of his or her devices. Thus, a user may take the time to adjust a list of categories exactly to his liking on one device (e.g., a desktop computer). If he then accesses the website from a different device (e.g., a portable computer), he may find that the categories again appear in a default order—that the changes he made on the other device were not replicated.
Or, if a site does allow a user to re-order his interests, and he does so on multiple devices, his changes may not be applied correctly. For example, if he reorders them one way on a first device that is offline and then again on a second offline device, when those devices are again online his changes may not be replicated in the correct order, in which case his most recent changes (which are probably the most accurate and relevant) may be lost.
Not only does this provide the user with a degraded user experience, but may also require the website to store and maintain multiple lists for each user (i.e., for each of the user's devices). For a site that services hundreds of thousands, or millions of users, retaining this much data for each user may not be feasible or may cause a significant expense and/or degrade users' experiences. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The present invention relates to a lifting column, preferably for height-adjustable tables, and a drive unit for lifting columns, just as the invention relates to a height-adjustable table.
2. The Prior Art
A lifting column is a synchronous lifting column, i.e., the second and third member are synchronously displaced; when the third member is displaced a distance upwards or downwards, the second member is likewise displaced a distance upwards or downwards. This is achieved in that the second member is guided in that the second member is connected to a spindle nut, which co-operates with the first spindle. This type of lifting column is, e.g., known from FIGS. 1, 3 and 6a-6b of EP 1 621 055 B1 Linak A/S. In this structure the third member of the guide is secured with its upper end to the underside of the housing by means of welding. The forces are thus led through the first spindle via the spindle nut thereon to the second spindle. From the spindle nut on the second spindle the forces are led to the third member of the guide and from there to the underside of the housing. The connection from the spindle nut on the second spindle to the third member of the guide should thus be dimensioned to be able to transfer these forces. In case of a bias the connection should also be able to withstand a torque load. This again has a negative influence on the mutual telescopic movement of the members, as the torque load is transferred to the guide. Further, it puts stress on the bottom of the housing to which the third member is secured.
The purpose of the invention is to provide a solution, which counters the above disadvantages. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
Embodiments of the present invention generally relate to systems and methods for processing hydrocarbons. More particularly, embodiments of the present invention relate to systems and methods for regenerating spent catalyst.
2. Description of the Related Art
Fluid catalytic crackers (“FCC”) are a mainstay in the conversion of raw hydrocarbons into one or more products. An FCC consists of few components: one or more riser reactors, one or more disengagers, and one or more regenerators. A hydrocarbon feed and one or more catalysts are introduced to the riser reactor which is maintained at an elevated temperature and/or pressure. The cracking of the hydrocarbons within the riser reactor produces one or more cracked hydrocarbons and small quantities carbonaceous coke which is deposited on the surface of the catalyst. The coke includes mostly carbon, but also contains hydrogen, sulfur, nitrogen, and trace amounts of other elements. These coke deposits reduce the catalyst activity after passage through the riser reactor. The cracked hydrocarbons and the coked catalyst or (“spent catalyst”) exit the riser reactor and are introduced to one or more disengagers where the spent catalyst is separated from the cracked hydrocarbons. The cracked hydrocarbons are removed from the FCC for further processing and/or treatment. The spent catalyst is introduced to one or more regenerators where the coke is combusted, oxidized, and/or converted to one or more waste gases.
The combustion process removes coke from the surface of the catalyst, regenerating the catalyst, and permitting its recycle back to the riser reactor. However, the combustion process generates undesirable byproducts, such as nitrogen oxides (“NOx”), which must be removed or at least partially reduced to meet environmental regulations.
There is a need, therefore, for improved systems and methods for regenerating catalyst while producing less undesirable byproducts. | {
"pile_set_name": "USPTO Backgrounds"
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Horse races are typically run on an oval shaped track having a start line and a finish line. Prior to starting the race, a starting gate is positioned at the start line and the horses are placed in the stalls of the starting gate. The race is started by simultaneously opening the front doors of each individual stall, thereby releasing the horses so they can race around the track. The starting gate is moved away from the track immediately after the race has begun to prevent it from impeding the horses as they run around the track. Chamberlain teaches in U.S. Pat. No. 4,311,116 an in-motion starting gate having individual doors that are opened using hydraulic cylinders coupled to the individual doors. Georgette et al. teach in U.S. Pat. No. 2,808,026 opening the doors by using an electromagnet mounted to each individual door. The starting gates in these patents use many parts or components to open the individual doors. As those skilled in the art are aware, the greater the number of components, the greater the likelihood of at least one of the components failing. A common occurrence with some starting gates is gate failure where one of the front doors either fails, allowing a horse to “leak out” of the starting gate, or does not open, holding one horse in the stall. Along similar lines, one door may open more slowly than the others, either putting the horse and rider in that gate at a disadvantage or more often causing the race to be nullified. Because of the large sums of money wagered on individual races, unreliable starting gates negatively impact the profits of both the race track operators, the starting gate owners, and the horse owners.
Accordingly, what is needed is a safe, low cost, reliable starting gate. | {
"pile_set_name": "USPTO Backgrounds"
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In some mapping and surveying systems and techniques a satellite is used for transmitting a signal, and a pole is precisely positioned over a fixed point on the surface of the Earth. An antenna is supported at the top of the pole. A pole is used in order to position the antenna at an elevated height to reduce the effects of obstructions to satellite signals by hills, trees, buildings, etc.
Also in conventional surveying techniques it is often necessary to position a pole over a fixed point which is being used as a point of reference. For example, sometimes the reference point is not visible at ground level. | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The present invention relates to an inductor and a method of producing such an inductor, and more particularly, the present invention relates to an inductor having a conductor (internal conductor) functioning as an inductance element that is located within a magnetic material produced by kneading a magnetic powder and a resin, and a method of producing the inductor.
2. Description of the Related Art
As shown in FIG. 7, a surface-mount inductor including a magnetic material compact body 53 that is produced by molding a magnetic material 51 obtained by kneading a magnetic powder and a resin into a mold in which a coil (internal conductor) 52 functioning as an inductance element is buried in the magnetic material 51, with both ends 52a and 52b of the coil 52 exposed at both end surfaces of the magnetic material compact body 53, and a pair of external electrodes 54a and 54b provided at both end surfaces of the magnetic material compact body 53.
This inductor can be produced by molding the magnetic material 51 obtained by kneading a magnetic powder and a resin to produce the magnetic material compact body 53, and then providing the external electrodes 54a and 54b on the magnetic material compact body 53. Thus, the step of firing the inductor at high temperature is not necessary, which is required for conventional ceramic inductors including magnetic ceramic material. Therefore, the manufacturing cost of producing the inductor is decreased.
However, in forming the external electrodes of the above-described inductor by a method including the steps of coating conductive paste and baking it, like in ceramic inductors, the resin that constitutes the magnetic material compact body decomposes in response to the heat applied during baking of the conductive paste. Under actual conditions, it is very difficult to apply the conventional method using conductive paste without modification.
Therefore, a conventional inductor is shown in FIG. 8, in which metal caps 55a and 55b are mounted as external electrodes to both ends of the magnetic material compact body so as to be connected to both ends of the coil 52. However, the metal caps are expensive and require the step of mounting the metal caps, thereby increasing production cost.
In other conceivable methods of forming the external electrodes using conductive paste, special conductive paste that can be baked at low temperature is used, or a resin having excellent heat resistance is used as the resin that constitutes the magnetic material compact body. However, both of these methods are problematic because they produce inductors with diminished and inferior properties, and decrease the ease and degree of freedom of the manufacturing process.
To overcome the above-described problems, preferred embodiments of the present invention provide an inductor in which external electrodes are efficiently provided without using metal caps or baking conductive paste, and which has high reliability of connection between the external electrodes and an internal conductor, and desired properties. Preferred embodiments of the present invention also provide a method of producing such a novel inductor.
A method of producing an inductor according to preferred embodiments of the present invention includes the steps of molding a magnetic material obtained by kneading a magnetic powder and a resin into a desired shape in which a conductor (internal conductor) functioning as an inductance element is buried to form a magnetic material compact body in which the internal conductor is partially exposed at a surface thereof, and plating the surface of the magnetic material compact body to form external electrodes including a metallic film electrically connected to the portions of the internal conductor which are exposed on the surface of the magnetic material compact body.
The method of producing an inductor according to preferred embodiments of the present invention includes molding the magnetic material obtained by kneading the magnetic powder and the resin into the desired shape to form the magnetic material compact body in which the internal conductor is partially exposed at a surface thereof, and plating the surface to form the external electrodes so that the external electrodes are electrically connected to the internal conductor. Thus, the method according to preferred embodiments of the present invention eliminates the necessity of a heat-treatment step for firing in the step of forming the magnetic material compact body, baking conductive paste in the step of forming the external electrodes, while avoiding decomposition or transformation of the magnetic material in the heat treatment step, thereby permitting the efficient production of an inductor having desired properties. Further, there is also no need for equipment such as a heat treatment furnace, or other similar equipment, and thermal energy used for heat treatment, thereby reducing production costs.
In preferred embodiments of the present invention, the step of molding the magnetic material into the predetermined shape to form the magnetic material compact body in which the internal conductor is partially exposed at a surface thereof is applicable not only where the magnetic material is molded to form the magnetic material compact body including the internal conductor partially exposed at the surface thereof, but also in methods including the step of exposing the internal conductor, such as where the magnetic material compact body is cut and ground to partially expose the internal conductor at the surface after the magnetic material is molded.
The method of producing an inductor according to preferred embodiments of the present invention further includes roughening portions of the surface of the magnetic material compact, on which plated metal films are formed by plating, before such plating is performed.
By performing plating after roughening the portions of the surface of the magnetic material compact body which are to be plated, the strength of adhesion of the plated metal film to the magnetic material compact body is greatly improved, thus significantly improving reliability.
The method of producing an inductor according to preferred embodiments of the present invention includes exposing both ends of the internal conductor at both end surfaces of the magnetic material compact body, roughening at least both end surfaces thereof, and plating at least portions of the roughened surfaces to form the external electrodes.
In the method including exposing both ends of the internal conductor at both end surfaces of the magnetic material compact body, roughening at least both end surfaces thereof, and then plating at least portions"" of the roughened surfaces to form the external electrodes, the external electrodes are provided on both end surfaces of the magnetic material compact body to allow the efficient production of a chip-type inductor having excellent adaptability for surface mounting, thereby increasing the effectiveness of the present invention.
In the method of producing an inductor according to preferred embodiments of the present invention, with the internal conductor including a coiled metal conductor (coil), both end surfaces of the magnetic material compact body are roughened to expose ⅓ to 1 turn of the coil so that the coil partially projects from both end surfaces of the magnetic material compact, and then at least portions of the roughened surfaces are plated to form the external electrodes.
In the method including roughening the surface to expose about ⅓ to 1 turn of the internal conductor, which includes a coiled metal conductor (coil), so that the coil partially projects from both end surfaces of the magnetic material compact, and then forming the external electrodes by plating, a sufficient area of contact between the coil and the external electrodes is ensured, thus significantly improving reliability of electrical contact between the coil and the external electrodes.
Although a coil coated with an insulating coating material is generally used as the coil, the insulating coating material of the coil can be removed by surface roughening. Furthermore, the coil is exposed so as to partially project from both end surfaces of the magnetic material compact, thereby not only increasing the area of contact with the external electrodes, but also increasing the strength of adhesion between the external electrodes and the magnetic material compact body due to the unevenness formed on the surfaces of the magnetic material compact body on which the external electrodes are provided. This further improves the reliability of connection with the external electrodes.
The reason for exposing about ⅓ to 1 turn of the coil from the end surfaces of the magnetic material compact body is that exposure of at least about ⅓ turn of the coil causes sufficient connection reliability, and exposure of more than about 1 turn of the coil causes an undesirable short circuit in the exposed coil.
In the exposed portions of the coil, the coil is preferably exposed so as to project from both end surfaces of the magnetic material compact body by about xc2xd of the diameter of a wire constituting the coil.
The method of producing an inductor according to another preferred embodiment of the present invention includes roughening a region extending from either end surface of the magnetic material compact body to a portion of the peripheral surface (a portion at either end of the peripheral surface), and then forming the external electrode by plating so that the external electrode extends from the either end surface of the magnetic material compact body to the portion of the peripheral surface thereof.
In the method including roughening the region extending from either end surface of the magnetic material compact body to the portion of the peripheral surface thereof, and then forming the external electrode by plating so that the external electrode extends from the either end surface of the magnetic material compact body to the portion of the peripheral surface thereof, for example, in mounting by reflow soldering, the mounting workability is substantially improved, and the reliability of connection (mounting) is also substantially improved.
In the method of producing an inductor according to another preferred embodiment of the present invention, the surface of the magnetic material compact body is roughened by the medium spraying method of spraying a surface roughening medium (powder and granules).
In the method of roughening the surface of the magnetic material compact body by the method of spraying the surface roughening medium (powder and granules), for example, a dry blast method (sand blast method) in which a-medium such as an alumina powder, a silica powder or other suitable material is sprayed together with air to grind the surface of the magnetic material compact, or a wet blast method in which an alumina powder, a silica powder, or other suitable material is sprayed together with a liquid such as water to grind the surface of the magnetic material compact, the surface is efficiently roughened in a short time, thus further improving the effectiveness of the present invention.
In preferred embodiments of the present invention, surface roughening can be performed by another method, for example, which includes the steps of placing a plurality of magnetic material compacts in a barrel, and stirring the compacts. In this case, however, the time required for surface roughening is increased, thereby reducing the production efficiency as compared with the above medium spraying method.
In the method of producing an inductor of according to a preferred embodiment of the present invention, the external electrodes have a multilayer structure including a plurality of plated metal films.
In various preferred embodiments of the present invention, the structure and type of the plated metal film that constitutes the external electrodes are not particularly limited, and the external electrodes may also have a single layer structure. However, in order to ensure the solderability of the external electrodes and reliability of electric connection, a multilayer structure is preferably used. For example, an Ag plated film or Ni plated film is provided as a base electrode, and a Sn plated film or solder plated film is provided on the base electrode to provide an inductor including external electrodes having both excellent reliability of electrical connection and solderability.
An inductor according to preferred embodiments of the present invention is produced by the above-described method, and includes a magnetic material compact body formed by kneading a-magnetic powder and a resin, and molding into a desired shape, a conductor (internal conductor) buried in the magnetic material compact body and functioning as an inductance element, and external electrodes provided on the surface of the magnetic material compact body and including plated metal films electrically connected to the internal conductor.
The inductor produced by the above-described inductor producing method has the above construction, exhibits high reliability of connection between the external electrodes and the internal conductor, and is efficiently produced at low cost.
Other features, elements, steps, characteristics and advantage of the present invention will become more apparent from the following detailed description of preferred embodiments thereof with reference to the attached drawings. | {
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A process for the preparation of aluminosilicates in which surface-active compounds or tensides, which are resistant to the hardness of water are contained in a bound form therein has been disclosed in German Published Application (DOS) No. 2,439,572. A corresponding U.S. application was filed as Ser. No. 811,964, on June 6, 1977, now U.S. Pat. No. 4,126,574. The products are obtained by precipitation resulting from the reaction of water-soluble silicates with water-soluble aluminates in the presence of water and surfactants. This precipitation is preferably carried out by mixing an aqueous aluminate solution with an aqueous silicate solution, the tensides preferably being present in the silicate solution.
The products of the above process are finely divided, X-ray amorphous aluminosilicates which contain tensides in a bound form as well as bound water and which, based on the tenside-free and anhydrous form, have the composition: EQU 0.7-1.5 Me.sub.2 O.multidot.Al.sub.2 O.sub.3 .multidot.0.8-6 SiO.sub.2,
wherein Me.sub.2 O is preferably an alkali metal oxide, in particular Na.sub.2 O. The compounds have a marked calcium binding capacity, amounting to 50 to 200 mg CaO/gm of anhydrous active substance, and an exceptionally high suspension stability in water. The water content of the dried products is generally in the region of from 3 to 8 mols per mol of Al.sub.2 O.sub.3 (8% to 45% by weight).
In the process according to German DOS No. 2,439,572, the preferred alkali metal aluminosilicates are obtained from alkali metal aluminates and alkali metal silicates, generally in the commercial form, which have a certain, fixed ratio of Me.sub.2 O/Al.sub.2 O.sub.3 and Me.sub.2 O/SiO.sub.2. If, using the given aluminate and silicate solutions, the quantities of aluminate and of silicate are calculated according to the desired Al.sub.2 O.sub.3 /SiO.sub.2 ratio in the end product so that no excess aluminate or silicate is present in the mother liquor of the product, then the quantity of alkali metal in the reaction mixture can no longer be freely chosen. This means, however, that the reaction mixture for the precipitation in most cases contains more alkali metal than corresponds to the composition of the desired product. Although a high proportion of the surplus alkali used is removed with the mother liquor when the precipitation product is isolated, the remainder is left in the precipitation product and increases the alkalinity in the interior of the individual particles. It is this enclosed alkali which will hereinafter be referred to as "excess alkali."
Although excess alkali may in some cases be advantageous, for example, as a reserve of alkali when aluminosilicates are used in washing liquors, the use of aluminosilicates with excess alkali in agents which are required to have a low pH gives rise to difficulties in adjustment of the pH since it may take days or even weeks to reach a constant pH due to the delayed release of excess alkali enclosed in the particles.
Another serious disadvantage of the excess alkali is its effect on the tensides contained in the products, especially at elevated temperatures or on prolonged storage. Cationic tensides, which are sensitive to alkali, are particularly seriously affected so that the products gradually turn yellow and develop an unpleasant smell.
To overcome these and other disadvantages, the excess alkali had to be removed by washing or neutralization which requires large quantities of water and prolonged washing. In addition, such a procedure would entail the risk of removing the surfactants which are also enclosed in the particles, in which case the products would lose their special properties. | {
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1. Field of the Invention
The present invention concerns the field of dendritic polymers where dendrimers are an example of the preferred polymers. These polymers have void spaces that may entrap molecules and their surface functionalities may undergo further reactions.
2. Description of Related Art
Branched Polymer Ring Opening Reactions
Various ring opening reactions to prepare branched polymer systems are known. A few of these processes are described below.
Polymerizations using ring opening is well known, particularly with using cyclic ethers, amides, aziridenes, sulfides, siloxanes and others by either anionic, cationic or other mechanisms. (George Odian, Principles of Polymerization, pub. John Wiley and Sons, 1993, Chapter 7.) However, use of ring opening polymerizations in the synthesis of highly branched polymers is less well known. Work has been done in the use of ring opening polymerizations in the synthesis of various hyperbranched polymers. In most of the cases the ring opening polymerization is of the traditional type resulting in random hyperbranched polymers with broad polydispersities.
One of the first examples of ring opening polymerizations to prepare a hyperbranched polymer was the work of Odian and Tomalia [P. A. Gunatillake, G. Odian, D. A. Tomalia, Macromolecules, 21, 1556 (1998)] where hyperbranch materials were made from oxazolines.
Ring opening has been used in the generation of linear or comb-branched polyethers as single ion conductors [X. G. Sun, J. B. Kerr, C. L. Reeder, G. Liu, Y. Han, Macromolecules, 37(14), 5133-5135 (2004)].
Ring-opening polymerization of 2-hydroxymethyloxetane under basic conditions was attempted to obtain hyperbranched polyethers [Y. H. Kim, J. Polym. Sci., Polym. Chem., 36, 1685 (1998)].
D. A. Tomalia's work on ring opening polymerization of oxazolines achieved hyperbranched PEOX or PEI polymers (See U.S. Pat. Nos. 4,690,985, 5,631,329, and 5,773,527).
Hyperbranched dendritic macromolecules have been made using a multibranching polymerization (“MBP”) approach with an initiator at the core, involving ring-opening polymerization including, for example, Pd-catalyzed ring opening polymerization of cyclic carbamates in the presence of an initiator using oxazinones [M. Suzuki; A. Ii, T. Saegusa, Macromolecules, 25, 7071-7072 (1992), and M. Suzuki, S. Yoshida; K. Shiraga, T. Saegusa, Macromolecules, 31, 1716-19 (1998)].
Epoxide ring opening, involving an AB2 type monomer polymerization, is initiated by addition of a catalytic amount of an initiator, such as hydroxide ion, and goes through a novel propagation mode distinct from other hyperbranched polymer methods involving acid- or base-catalyzed reactions [H. T. Chang, J. M. J. Frechet, J. Am. Chem. Soc., 121, 2313-2314 (1999)]. AB2 monomer type glycidols are polymerized to hyperbranched “polyglycerols” by controlled anionic ring opening polymerization to polydispersities below 1.5 [A. Sunder, R. Hanselmalm, H. Frey, R. Mulhaupt, Macromolecules, 32, 4240-4246 (1999)]. Cationic cyclopolymerization of dianhydro-D-mannitol is used to produce hyperbranched carbohydrate polymer [T. Imai, T. Satoh, H. Kaga, N. Kaneko, T. Kakuchi, Macromolecules, 36, 6359-6363 (2003); T. Imai, T. Satoh, H. Kaga, N. Kaneko, T. Kakuchi, Macromolecules, 37, 3113-3119 (2004)].
Hyperbranched polymers are obtained by combining ring-opening polymerization and some features of self condensing vinyl polymerization (“SCVP”), ring opening polymerization of caprolactone to give hyperbranched polyesters having a polydispersity of about 3.2 [M. Liu, N. Vladimirov, J. M. J. Frechet, Macromolecules, 32, 6881-6884 (1999)].
Ring opening polymerization of bis(hydroxymethyl)caprolactones gave hyperbranched polyesters [M. Trollsas, P. Lowenhiehm, V. Y. Lee, M. Moller, R. D. Miller, J. L. Hedrick, Macromolecules, 32, 9062-9066 (1999)].
Cationic ring opening polymerization of ethyl hydroxymethyl oxetanes resulted in hyperbranched polyethers, polydispersities in the range of 1.33-1.61 [Y. Mai, Y. Zhou, D. Yan, H. Lu, Macromolecules, 36, 9667-9669 (2003)].
3-Ethyl-3-(hydroxymethyl)oxetane ring opening is used to generate hyperbranched polyethers [H. Magnusson, E. Malmstrom, A. Hult, Macromolecules, 34, 5786-5791 (2001)].
Dendritic polypeptides were obtained by ring opening polymerization of N-carboxyanhydrides. The method involves repetitive sequences of N-carboxyanhydride ring opening and end-coupling reactions. This process results in polymeric regions with a statistically driven average chain length per branch, having no precise lengths, and results in a polymer with typical polydispersities of 1.2-1.5.
Precise Dendrimer Ring Opening Reactions
Polysulfide dendrimers can be formed by reacting a polythiol under basic conditions with epichlorosulfide to form polyepisulfides (See U.S. Pat. Nos. 4,558,120, and 4,587,329). These same patents also discuss the preparation of a polyaminosulfide dendrimer using a reaction of a polyamino core with an excess of ethylene sulfide to form a polysulfide followed by reaction with excess aziridine to from further generations.
Addition of N-tosyl aziridine is discussed as a way to create a partially protected dendrimer surface (U.S. Pat. Nos. 4,361,337; 4,587,329; and 4,568,737) and is extended to azetidine derivatives.
Precise Dendrimer Ring Opening Reactions for Attachment of Surface Groups
Ring opening reactions are discussed as a way to add terminal groups. For example, U.S. Pat. No. 4,568,737 discloses the use of oxiranes to create a polyol surface on the dendrimer.
Processes for Precise Dendrimer Structures
Many specific reactions have been used to create a wide range of precise dendrimer structures. These reactions typically define a core (“C”), branch structure type (“BR”) and terminal functionality (“TF”). The synthesis of precise dendrimer structures has been performed using two broad approaches that have been categorized as “convergent synthesis” and “divergent synthesis” [Dendrimers and other Dendritic Polymers, eds. J. M. J. Frechet, D. A. Tomalia, pub. John Wiley and Sons, (2001)]. Within these broad categories there are further variations regarding branch cell construction (i.e., in-situ and preformed) or dendron anchoring type construction.
One of the earliest published uses of branch cell reagents involved coupling preformed branch cells around a core to form low molecular weight arborol structures [G. R. Newkome, Z.-Q. Yao, G. R. Baker, V. K. Gupta, J. Org. Chem., 50, 2003 (1985)]. Poly(thioether) dendrimers were synthesized using protected, preformed branch cell reagents based on a pentaerythritol core; Nc=4 and 4-acetothiomethyl-2,6,7-trioxabicyclo[2.2.2]octane; Nb=3. In this case a protected branch cell reagent was used in the building of the dendrimer branch structure, which requires chemical deprotection as an added step to rapidly build structure. Although the reagent used is a polycyclic type ether (i.e., orthoester), the ether ring is not strained and does not ring open during polymerization.
Steric Effects in Traditional Small Molecule Chemistry
Steric effects, as defined in small molecule chemistry, are due to the volume of sub-nanoscale space (i.e., 0.05-1 nm) that all fundamental small molecule “building block components” (i.e. atoms, functional groups, hydrocarbon scaffolding, etc.) occupy and their relationship to each other in critical reaction and assembly events. The effect that their relative sizes have on reactivity, displacements, substitutions, chirality, associations, assemblies, specific product formation and attainable architectures have always remained issues of very high importance both in the academic as well as commercial realms. For example the steric effect that decreases reactivity is call “steric hinderance” [See P. Y. Bruice, Organic Chemistry, 2nd Ed. (1998), p 362, Prentice Hall]. Steric hinderance results from groups getting in the way at a reaction site. Classical examples include the “neopentyl effect”, wherein the relative reactivities of increasingly hindered alkyl halides to SN2 reactions are increasingly suppressed to a point that that a teriary alkyl halide (i.e. neopentyl bromide) is too slow to measure. It is not just the number of alkyl groups attached to the carbon undergoing nucleophilic attack that determines the reaction rate; the relative sizes of the alkyl groups are also very important. Cram's Rule_is another classical example of a small molecule steric effect. While not wishing to be bound by theory, it is believed that steric effects control the stereo selective reactivity at a carbonyl oxygen resulting in chiral introduction. Cram's Rule states that a nucleophile approaches a carbonyl along the smallest substituent alignment. The largest group aligns itself anti to the carbonyl group to minimize the steric effect such that the nucleophile preferentially attacks from the side of the small substituent. [See D. J. Cram, A. Elhafez, J. Am. Chem. Soc. 74, 5828 (1952).]
These above brief examples not only portend the possibility but also the importance that such analogous “steric effects” may offer if discovered and defined for critical construction components at the nanoscale level, (i.e. 1-100 nm). The nanoscale rules for these NSIS effects are virtually unknown. How NSIS relates to this invention is described in the Detailed Description of this specification.
Poly(amidoamine) Dendrimer (“PAMAM”) Synthesis
Some of the difficulties in the synthesis of dendrimers are inherent in the methods used to make them. For example the preparation of poly(amidoamine) (“PAMAM”) dendrimers, one of the key compositional families of these dendritic polymers, currently focuses on Michael addition chemistry with in-situ branch cell formation [Dendrimers and other Dendritic Polymers, eds. J. M. J. Frechet, D. A. Tomalia, pub. John Wiley and Sons, (2001), Chapter 25]. The usual process includes an amidation step which involves slow chemistry, long reaction times and non-differentiated difunctional intermediates. These circumstances force the process to require high dilutions resulting in low capacities and high costs, particularly at higher generations. Additionally, PAMAM dendrimers, due to their specific amide structures have access to low energy routes to degradation through reverse Michael addition reactions and hydrolysis reactions.
Clearly, it would be desirable to find a process to make precise dendrimer structures with a faster reaction time, easier separation with fewer by-products, and lower cost of manufacture than that presently used. Additionally, if the dendrimers were more stable and easier to scale, that also would be desired. | {
"pile_set_name": "USPTO Backgrounds"
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Alkaline zinc galvanic cells are well known in the art and comprise essentially one or more negative polarity zinc electrodes spaced from a counterelectrode (e.g. NiOOH) of opposite polarity and a concentrated (i.e., greater than about 15%) aqueous alkaline electrolyte (e.g. KOH) bridging the space between the electrodes. A microporous separator material physically divides the opposite polarity electrodes from each other to prevent electronic flow while permitting ionic flow therebetween. These cells typically employ a zinc electrode comprising a zinc-rich active material having a conductive substrate embedded therein to both support and provide conductivity throughout the active material. One such cell, for example, is described in Jones U.S. Pat. No. 4,358,517, issued Nov. 9, 1982, is assigned to the assignee of the present invention, and is intended to be incorporated herein by reference. Jones specifically describes a zinc electrode having an active material comprising zinc oxide, calcium hydroxide, Pb.sub.3 O.sub.4, and cellulose fibers supported on a conductive substrate/current collector (i.e., copper).
The substrates for the zinc-rich active material preferably comprise copper for optimum electrode conductivity. So long as metallic zinc is present in the zinc electrode (especially in contact with the copper), the substrate is protected from dissolution in the electrolyte. However, after the zinc electrode has become fully discharged (i.e., by use or self-discharge of the battery) and the zinc has become oxidized, the copper is left unprotected. If the cell remains in this state for a prolonged period of time, the unprotected copper will dissolve in the electrolyte and the performance of the cell deteriorates. In this regard, dissolved copper from the electrolyte deposits in the pores of the separator dividing the electrodes which, depending on its severity, can cause the cell to no longer accept or retain a charge. More specifically, if copper loading of the separator is severe enough the cell can no longer be recharged and must be replaced. If on the other hand, copper loading of the separator is light, the cell may be charged and used immediately (albeit at reduced capacity), but otherwise will rapidly self-discharge and accordingly cannot be left on open circuit stand for any appreciable period of time.
It is the object of this invention to provide an alkaline zinc galvanic cell having improved shelf life, rechargeability, charge retention and capacity retention following complete discharge of the cell's zinc electrodes by means of an electrolyte additive for retarding the dissolution of copper from copper-containing zinc electrodes used therein. This and other objects and advantages of the present invention will be readily apparent from the description thereof which follows. | {
"pile_set_name": "USPTO Backgrounds"
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Arterial blood, which supplies the heart muscle, is able to pass through healthy heart tissue while nourishing the same, yet has difficulty reaching ischemic tissue. As a result, the supply of ischemic tissue with nutrients and the discharge of metabolic catabolites from such ischemic tissue will be impaired.
In this context, it has already been proposed to supply the ischemic tissue with blood through retrograde perfusion. In doing so, attempts have been made to allow the blood to flow back from the coronary sinus through the coronary venous system in counterflow by feeding blood from a different source into the coronary sinus, either by permanently connecting an artery with the coronary sinus or by temporarily inserting a catheter into the sinus, which catheter is supplied with blood taken from a remote artery and transported by the aid of a blood pump located outside the patient's body.
The initially proposed technique for retroperfusion uses an inflatable balloon fixed to the end of a catheter to intermittently occlude the coronary sinus. The blood pressure in the coronary sinus rises during the occlusion at every heart beat so as to cause blood reaching the coronary sinus through the healthy tissue of the heart muscle to be flushed back into the ischemic tissue. For such an intermittent coronary sinus occlusion, the balloon end of the catheter is inserted either percutaneously or surgically. The other end of the catheter is supplied with a gas or fluid by a pump which causes the cyclic inflation and deflation of the balloon.
A typical application of blood retroinfusion in coronary veins by the intermittent occlusion of the coronary sinus applies to myocardial protection during a short-term coronary arterial occlusion in the context of a cardiologic intervention. A typical such intervention, for instance, includes the balloon dilatation of an arteriosclerotically constricted coronary artery. That method, which is also known as percutaneous transluminal coronary angioplasty (PTCA), comprises the conduction of a balloon catheter into the region of the coronary artery stenosis under X-ray control and the compression of the arteriosclerotic plaque by the inflation of the balloon located on the end of the catheter. During the dilatation of the balloon, no supply of the tissue with oxygen-containing blood takes place downstream in the artery, with functional changes in the ischemic area of the myocard being detectable already at dilatations lasting longer than 30 seconds. Problems involved in the ischemic protection of the myocard will also be faced in other interventions aimed at coronary vascularization such as, e.g., atherectomy, coronary endoprostheses, laser applications and percutaneous surgeries of the cardiac valves.
A device for the retroinfusion of coronary veins has, for instance, become known from EP 230 996 A2, by which a pressure-controlled intermittent coronary sinus occlusion can be performed. The device comprises a means for occluding the sinus such as, e.g., an inflatable balloon catheter, a pressure measuring unit for measuring the fluid pressure within the coronary sinus and a control unit which generates triggering signals for the occlusion device to trigger or release an occlusion. The control unit is devised in a manner that the pressure maximum in the coronary sinus is measured during every heart beat, a plateau value of the pressure maxima of consecutive heart beats is estimated by calculation and the occlusion of the coronary sinus is released on the basis of the plateau value of the pressure maxima.
The occlusion of the coronary sinus causes a pressure increase and, subsequently, a retroperfusion of blood via the respective vein into the nutritive capillaries of the ischemic area so as to enable the supply of nutrients to that area. At a release of the occlusion, the retroperfused blood is flushed out while the metabolic waste products are carried off at the same time.
In a series of investigations, it could be demonstrated that endothelial growth factors inter alia respond to the application of mechanical loads and, in particular, pressure. While the blood is passing through the vessels, the endothelium basically is acted upon not only by shearing forces but, naturally, also by the initially mentioned pressures, whereby a pressure increase lasting for as long as possible will, in principle, lead to an increased release of vessel-forming genes (VEGF genes, vascular endothelial growth factor encoding genes), which will be beneficial to the regeneration of the heart vessels and, in particular, neoangiogenesis. It is, however, not possible to achieve an indefinitely long lasting pressure increase by an occlusion using known methods, since the occlusion must again be intermittently released after having reached the plateau value, thus causing the pressure to be lowered again. | {
"pile_set_name": "USPTO Backgrounds"
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Throughout history, engineers have used actuators to move objects providing rotary or linear motion. A rotary actuator is simply a gearing system that either increases or decreases the rotational speed of a prime mover, typically a hydraulic motor, an internal combustion engine, a turbine engine, or an electric motor, to provide a desired level of rotational speed and torque at an output. Examples of rotary actuators include: gearboxes, transmissions, differentials, Rotac® actuators, and rotary electro-mechanical actuators. Linear actuators are machines designed to provide force and linear displacement to an object. Some examples of linear actuators include: rack & pinion actuators, hydraulic rams, ball screw actuators, and crank arm actuators.
Historically, hydraulic/pneumatic motors and hydraulic/pneumatic rams have been the primary source of power for both linear and rotary actuators. Hydraulic systems offer many advantages to the designer including: high power density, accurate position control, low inertia (for high frequency response), and overload protection (via pressure relief valves).
More recently, engineers have replaced hydraulic/pneumatic actuation systems with electro-mechanical actuation systems. Electro-mechanical actuators (“EMA”), which typically include a motor, a gear box and an actuator, offer increased efficiency over their hydraulic and pneumatic counterparts and are less prone to leakage.
When designing small, high power density EMAs, a designer is faced with a problem caused by the rotational inertia associated with the EMAs electric motor. In order to create an EMA with a large force capability, the designer must create an electric motor that is capable of producing a large torque, or must create a gear train that reduces the motor's output torque requirement. If the designer chooses to create a motor with a large torque capability, its rotor will contain a significant amount of rotational inertia. If the designer chooses to utilize a gear reduction system to decrease the motor's output torque requirement, thereby reducing the motor's physical size and rotational inertia, the motor will be required to operate at a faster speed. The inertia of the motor, as felt by the output of the actuator, will be proportional to the motor's inertia multiplied by the gear reduction ratio squared.
The inertia of the EMA motor becomes extremely important when sizing the gear train and/or the actuator structure if, for instance, the actuator hits an internal stop at full speed, or if the actuated structure hits a stop at the end of its travel at full speed. In this scenario, the rotational inertia of the motor will tend to cause the actuator to continue driving through its stop, or through the structure's end stop, causing significant damage to the EMA, or its supporting structure. If the stops and structures are strong enough to maintain their integrity, the next weakest link, most likely the actuator or the gear train driving the actuator will be damaged.
Historically, the gear train and the EMA's stops are overbuilt to handle an intense torque spike associated with the rapid deceleration of the EMA's motor as the actuator hits its stops, and the internal shafting flexes as the motor spins down. This design approach tends to cause the actuator to become significantly larger and heavier than it would otherwise have to be.
Another method to handle the scenario described above is to incorporate a slip clutch in the driveline between the EMA's motor and the EMA's output. Incorporating a slip clutch in the driveline allows the EMA's output to nearly instantaneously stop, while the motor decelerates, with the stored energy of the rotating motor rotor being absorbed by the slip clutch's friction material. This type of system works well, however, it again adds components to the EMA that add size, cost, weight, and reduce the actuator's overall reliability. | {
"pile_set_name": "USPTO Backgrounds"
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(a) Field of the Invention
The present invention relates to a system for transmitting hydraulic pressure in an automatic transmission.
(b) Description of the Related Art
Generally, an automatic transmission includes a gear train with several planetary sets, brakes, and clutches. Hydraulic pressure is used to control the brakes and clutches, and is usually transmitted through a passage in or on a transmission case.
The passage increases the weight and volume of the transmission case, wastes material of the transmission case, an increases manufacturing cost.
The above information disclosed in this Background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art. | {
"pile_set_name": "USPTO Backgrounds"
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For controlling the functions of machines and/or vehicles, joysticks, i.e., control levers, are known which have passive force feedback in the form of a spring-acting return to the center or a fixed retention in any position by means of friction. However, control levers having passive force feedback do not provide any information regarding the condition of the machine or vehicle.
DE 103 43 141 A1 discloses a joystick, or control lever, which is equipped with two electromotors, each having a reduction gear for achieving active force feedback. The two reduction gears, and their motors, operate in opposition to each other. The motors having their gears are connected to the grip lever of the joystick by a torsion spring, so that the motors place the control lever in a position which corresponds, for example, to the steering angle.
A joystick or control lever of this type having the aforementioned active force feedback has a very expensive mechanism as well as expensive optical sensors, which results in significant costs. | {
"pile_set_name": "USPTO Backgrounds"
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Early stage detection is the most important matter for treating tumors. Conventionally, each tumor has been detected by measuring respective substance in blood, generally called a tumor marker. The tumor marker is defined as “among substances which produce cancer cells or substances which are produced by normal cells in the body by reacting with cancer cells, those in which their inspection by blood, tissues, excrements (urine and feces) and the like serves as a marker for the diagnosis or treatment of cancers”.
However, since most of the tumor markers are also produced in small amounts caused by diseases other than cancers, they sometimes show false positive in the case of chronic inflammation and the like. For example, it is said that since carcinoembryonic antigen (CEA) is produced by the cells of many organs such as the stomach, large intestine, pancreas, lungs and the like, it causes about 20% of false positive. In addition, since there are tumors whose appropriate tumor markers have not been found, it is the current situation that a tumor marker which can cover all tumors is not present.
On the other hand, it is known that when δ-aminolevulinic acid (ALA) or a derivative thereof is administered, the protoporphyrin IX induced is accumulated into the tumor and exerts its effect for intraoperative diagnosis and treatment (Patent References 1 and 2). Patent Reference 1: JP-A-11-12197 Patent Reference 2: JP-T-11-501914 | {
"pile_set_name": "USPTO Backgrounds"
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1. Field of the Invention
The present invention relates to improved electrical equipment systems and particularly to apparatus for automatically and simply adapting such systems for use with one of a plurality of line power magnitude availabilities.
2. Description of Prior Art
Some foreign countries have power requirements and specifications different from those in the United States. In certain countries of Europe, for example, power outputs of 220 volts and 240 volts at 50 cps (hertz) are available and widely used. In the United States, there are certain instances where similar voltage magnitudes (rms values) are used. Therefore, the electrical equipment used under these power conditions must be designed for such use.
In the prior art, "designing" for such use generally meant the employment of a suitable step-down (or step-up) transformer for the intended purpose. Alternatively, a general purpose transformer with multiple voltage-taps could be used, by hard wiring to the appropriate taps for the voltage selected. In either case, the prior art required working on the electrical equipment or on the AC Power input circuit in order to "tailor-make" the system to the particular power or voltage availability intended. Thus, some production efforts were necessarily directed to maintaining separate inventories, records, etc. of the variously tailored equipments. Elimination of this effort is a feature of the present invention. | {
"pile_set_name": "USPTO Backgrounds"
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There has been tremendous increase in last few years in the development of cancer vaccines with Tumour-associated antigens (TAAs) due to the great advances in identification of molecules based on the expression profiling on primary tumours and normal cells with the help of several techniques such as high density microarray, SEREX, immunohistochemistry (IHC), RT-PCR, in-situ hybridization (ISH) and laser capture microscopy (Rosenberg, Immunity, 1999; Sgroi et al, 1999, Schena et al, 1995, Offringa et al, 2000). The TAAs are antigens expressed or over-expressed by tumour cells and could be specific to one or several tumours for example CEA antigen is expressed in colorectal, breast and lung cancers. Sgroi et al (1999) identified several genes differentially expressed in invasive and metastatic carcinoma cells with combined use of laser capture microdissection and cDNA microarrays. Several delivery systems like DNA or viruses could be used for therapeutic vaccination against human cancers (Bonnet et al, 2000) and can elicit immune responses and also break immune tolerance against TAAs. Tumour cells can be rendered more immunogenic by inserting transgenes encoding T cell co-stimulatory molecules such as B7.1 or cytokines such as IFN-γ, IL2, or GM-CSF, among others. Co-expression of a TAA and a cytokine or a co-stimulatory molecule can develop effective therapeutic vaccine (Hodge et al, 95, Bronte et al, 1995, Chamberlain et al, 1996).
There is a need in the art for reagents and methodologies useful in stimulating an immune response to prevent or treat cancers. The present invention provides such reagents and methodologies which overcome many of the difficulties encountered by others in attempting to treat cancer. | {
"pile_set_name": "USPTO Backgrounds"
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This invention relates to an improved preparation of Wittig salts of alpha,beta-unsaturated alcohols. The Wittig salts are useful intermediates for synthesizing polyene compounds, such as vitamin A.
Wittig salts of alpha,beta-unsaturated alcohols have heretofore been prepared by treating the alcohol with a phosphine salt of a strong mineral acid, such as hydrochloric acid. See, for example, German Patent No. 1,059,900. Such preparations of Wittig salts have not however been entirely satisfactory. The use of strong acid salts under acidic conditions and in the presence of an unsaturated aldehyde has been found to cause alpha,beta-unsaturated alcohols to dehydrate and/or rearrange. As a consequence, the yields of Wittig salts from such processes have been relatively low due to the formation of dehydration and/or rearrangement by-products.
The formation of by-products has been a particularly severe problem in preparing Wittig salts of tertiary alcohols, wherein the hydroxy group is quite labile and the alcohol is hence quite prone to undergo rearrangement and/or dehydration. In this regard, it has been found that by utilizing, the process disclosed in German Patent No. 1,059,900, the yield of the Wittig salt of vinyl-beta-ionol has been quite low. This means that the overall process furnishes an improved polyene end-product with regard to purity and yield.
There has been an unfilled need therefore for an improved method of producing Wittig salts of alpha,beta-unsaturated alcohols. | {
"pile_set_name": "USPTO Backgrounds"
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The Internet has made it convenient for merchants to sell products and provide customer service on-line. For example, many merchants have established World Wide Web sites containing on-line catalogs of their products. With a Web browser, customers can access such a Web site to view images of the products and to obtain related product information. If a customer is interested in a product contained in the on-line catalog, the customer can place a telephone call to a customer service representative at the merchant. The customer service representative can provide the customer with product information and can take orders for products. An important aspect of this type of transaction is that the customer can remain on-line, so that the customer service representative can direct the customer to particular portions of the on-line catalog. If the customer service representative is provided with a suitable connection to the merchant's Web server, the customer service representative can actively control which portions of the catalog are displayed on the customer's computer. The customer service representative can use this feature to make a sales presentation to the customer.
Sometimes a customer service representative is not available to accept a telephone call from the customer. As a result, the customer must wait on hold until a representative is available. The Instant Answer.TM. service available from AT&T alleviates some of the difficulties associated with this situation. Using the Instant Answer.TM. service, a customer who is browsing an on-line catalog can click on a "call me" button in the on-line catalog when the customer wishes to speak to a customer service representative. Selecting the call me button alerts the merchant that the customer should be called by the next available customer service representative. If no customer service representative is currently available, the merchant's Web server can transmit a message to the customer's computer to let the customer know that all representatives are busy. A message might also be transmitted that indicates in realtime the estimated time remaining before a customer service representative will be available.
While the customer is waiting for a customer service representative from the merchant to call, the customer may wish to continue to browse the Internet. In particular, the customer may wish to access Web sites unrelated to the merchant's on-line catalog. However, when the customer accesses another Web site, the data communications link between the customer's computer and the merchant's server is typically broken. As a result, after the merchant's customer service representative has called the customer, the customer service representative must wait while the customer attempts to reestablish a data communications link between the customer's computer and the merchant's Web site.
It is therefore an object of the present invention to provide a way in which to notify a customer that a customer service representative is available and to facilitate the process of establishing a data communications link with the representative. | {
"pile_set_name": "USPTO Backgrounds"
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When a fault in an integrated circuit chip caused by a manufacturing defect is detected during testing, the entire integrated circuit chip is rendered non-functional unless a method of repair has been provided. Integrated circuit chips having such repair capability may use redundancy, (substitution of redundant circuits for failing circuits) partial good techniques, (ignoring or disabling some circuitry, and accepting reduced function or performance) or a combination of both. When partial good techniques are being used and partial good chips are detected during test, these chips need to be sorted into multiple part numbers based upon the exact circuit or circuit location that has failed. This indicates to the user what the function or performance of each chip will be. With more than a few circuits that could fail and still allow a partial good chip, this method becomes costly and difficult for production control organizations to administer. Therefore, there is a need for methods and integrated circuits that are repairable in a more cost-effective manner. | {
"pile_set_name": "USPTO Backgrounds"
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The present invention relates to computer graphics, and more particularly to interactive graphics systems such as home video game platforms. Still more particularly, this invention relates to techniques for generating shadows using full scene shadow mapping in a low cost graphics system, and to use of graphics pipeline texture coordinate generation and/or texture mapping arrangements to generate precision numerical values supporting shadow comparisons and other effects.
Many of us have seen films containing remarkably realistic dinosaurs, aliens, animated toys and other fanciful creatures. Such animations are made possible by computer graphics. Using such techniques, a computer graphics artist can specify how each object should look and how it should change in appearance over time, and a computer then models the objects and displays them on a display such as your television or a computer screen. The computer takes care of performing the many tasks required to make sure that each part of the displayed image is colored and shaped just right based on the position and orientation of each object in a scene, the direction in which light seems to strike each object, the surface texture of each object, and other factors.
Because computer graphics generation is complex, computer-generated three-dimensional graphics just a few years ago were mostly limited to expensive specialized flight simulators, high-end graphics workstations and supercomputers. The public saw some of the images generated by these computer systems in movies and expensive television advertisements, but most of us couldn""t actually interact with the computers doing the graphics generation. All this has changed with the availability of relatively inexpensive 3D graphics platforms such as, for example, the Nintendo 64(copyright) and various 3D graphics cards now available for personal computers. It is now possible to interact with exciting 3D animations and simulations on relatively inexpensive computer graphics systems in your home or office.
Shadows are important for creating realistic images and providing the viewer with visual cues about where objects appear relative to one another. Many different shadowing techniques are known. See, for example, Woo et al., xe2x80x9cA Survey of Shadow Algorithms,xe2x80x9d IEEE Computer Graphics and Applications, Volume 10, Number 6, pages 13-32 (November 1990).
A problem graphics system designers confronted in the past was how to draw shadows using low cost graphics systems. One known technique for accomplishing this is called shadow mapping. This technique allows a common z-buffer-based renderer to be used to generate shadows quickly on arbitrary objects. See Williams xe2x80x9cCasting Curved Shadows on Curved Surfaces,xe2x80x9d Computer Graphics (SIGGRAPH ""78 Proceedings), Volume 12, Number 3, pages 270-274 (August 1978). Using this technique, the graphics system renders the scene using the z-buffer algorithm with respect to the position and direction of the light source. For each pixel in the z buffer, the resulting rendered z depth contains the distance to the object that is closest to the light source. This depth map is called a shadow map. The scene is then rendered a second time, but this time with respect to the viewer (camera). As each drawing primitive is being rendered, its location (depth from the light) is compared to the shadow map. If a rendered point is further away from the light source than the value in the shadow map, that point is in shadow and its brightness is attenuated. If the rendered point is closer to the light source than the shadow map value, the point is illuminated by the light and is not in shadow.
One efficient way to implement this shadow mapping technique is by exploiting texture mapping hardware to project the shadow map into the scene. See, e.g., Heidrich et al., xe2x80x9cApplications of Pixel Textures in Visualization and Realistic Image Synthesis,xe2x80x9d Proceedings 1999 Symposium On Interactive 3D Graphics, pages 127-134 (April 1999); Segal et al., xe2x80x9cFast Shadows and Lighting Effects Using Texture Mapping,xe2x80x9d Computer Graphics (SIGGRAPH ""92 Proceedings, Volume 26, Number 2, pages 249-252 (July 1992). Using these techniques, the shadow map can be generated using z buffering (that is, lighting, texturing and the writing of color values into the color buffer can be turned off). Then, the scene is rendered from the viewer using only ambient lighting to resolve visibility. A shadow testing step is then performed to compare the z value in the z buffer with the z value (which is transformed from the coordinate system of the light source into the coordinate system of the viewer) in the shadow map. One technique is to set an additional value in the frame buffer for each pixel based on the result of the shadow comparison at that pixel. The whole scene is then rendered using the entire lighting equationxe2x80x94with the final color of each pixel being the color from the ambient lighting pass plus the color from the full rendering pass multiplied by the additional value in the frame buffer.
An extension of Williams"" shadow mapping technique proposed by Wang et al., xe2x80x9cSecond-Depth Shadow Mappingxe2x80x9d (Department of Computer Science, University of North Carolina at Chapel Hill) solves certain self-shadowing problems (where a surface may cast a shadow onto itself due to lack of precision in the shadow comparison) by performing the shadow comparison based on the depth of a second surface defined by a primitive. Wang et al thus suggest using front-faced culling techniques to eliminate the first surface of primitives when generating the shadow map. This prevents limited precision depth comparisons from causing front surfaces to cast shadows upon themselves.
The above-described shadow mapping techniques allow general-purpose graphics hardware to render arbitrary shadows. However, using these techniques, the quality of the shadow produced depends on the resolution (in pixels) of the shadow map, and also on the numerical precision of the z buffer and the depth comparison. See Moller et al., Real-Time Rendering, pages 179-183 (AK Peters Ltd., 1999). Achieving adequate numerical precision for the depth comparison can be a problem for low cost graphics systems such as video game platforms. In full scene shadowing, any object can cast a shadow on any object (including itself). The number of bits of information used to encode the distance value will determine where the near and far planes can be on the projection from the light source, and how much depth complexity can be provided in the rendered shadow map. To find out whether a surface is in shadow or outside of shadow, a depth comparison is performed between the actual distance from the light to the surface being rendered, and the nearest distance from the light (determined by rendering the scene from the light source into the shadow map). The number of bits in this distance value will determine the range that a particular light can cast shadows into the scene. The lower the precision, the less depth complexity that can be provided on the shadows and on the light. Hence, lower precision can limit the number of shadows the light can cast into the scene and how far ranging those shadows can be.
If the graphics pipeline does not provide sufficient numerical precision for shadow mapping effects, higher precision depth values can usually be obtained by having the graphics system host processor perform necessary calculations under software control. However, this places substantial additional loading on the host processor, and may make it difficult or impossible to render full-scene shadows in real time within the context of an interactive animated computer graphics system that allows the user to change the position(s) of one or more objects within the scene at will.
Another way to get around the limited precision problem is to use a form of shadow mapping which does not attempt the shadow depth comparison, but works instead by identifying what is seen by the light. See, e.g., Hourcade et al, xe2x80x9cAlgorithms for Antialiased Cast Shadowsxe2x80x9d, Computers and Graphics, vol. 9, no. 3, pp. 259-265 (1985). If an object is seen from the selected viewpoint and the shadow map indicates that the object is also seen by the light, then the object is illuminated. This technique has the advantage of avoiding the shadow depth comparison. However, areas where objects or polygons meet can be problematic. It is possible to resolve such problem areas by using different identifiers for different objectsxe2x80x94although an object with a single identifier can never cast a shadow upon itself using this algorithm.
While much work has been done in the past, further improvements are possible.
The present invention solves the numerical precision problem while providing techniques and arrangements that perform full scene shadow mapping using low cost, limited precision hardware such as that found, for example, in home video game platforms and personal computer graphics accelerators.
One aspect of the invention uses a texture coordinate generator to assist in calculating distance between light position and a primitive surface at a precision that is based on the dynamic depth of the scene. A texture mapper uses the generated texture coordinates to look up a precision distance value from a ramp function stored as a texture. The resulting precision distance value can be compared with the corresponding depth value in the shadow map to determine whether or not the pixel is in shadow.
In one embodiment, the ramp function is stored as a 2-D texture in such a way that certain texels are redundant and not all texels are used. To eliminate lookup errors, redundant texel values are provided where the ramp function crosses texel row/column boundaries. | {
"pile_set_name": "USPTO Backgrounds"
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The present invention relates to an electrical connector with an assist lever that may be used to mate two halves of the electrical connector. More specifically, this invention relates to an electrical connector with an assist lever and features that allow for a reduction in size of the electrical connector.
Vehicles, such as passenger cars, include an increasing number of electrical devices. Features such as lights, cameras, sensors, motors, blowers, and heaters are used to provide comfort or safety features for passengers of the vehicles. In order to operate these electronic components, electrical connections are provided in the vehicle to transfer operating power and control signals. During assembly of a vehicle, components are typically put in position, and multiple wires are run together in a wire harness. Each of the individual wires can be connected to a separate electrical terminal. Multiple electrical terminals may be placed in a connector that is mated with a corresponding connector in order to make electrical connections to all the wires in a wire harness simultaneously. Connecting multiple terminals simultaneously increases the amount of force an operator has to exert to mate the connectors. In order to remove the need for the operator to use a separate tool, it is known to use lever actuated connectors, such as the one described in U.S. Pat. No. 9,281,614.
As the number of electrical components in vehicles continues to increase, there is a desire to fit an increasing number of electrical connections in confined spaces within the vehicles. As a result, it would be advantageous to have an electrical connector that allows a greater number of electrical terminals to be fit in a location, while still being easy for the operator to use. | {
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Conventionally, it is known that the air-fuel ratio feedback control is performed to correct the fuel injection amount so that the air-fuel ratio of an air-fuel mixture to be combusted in an internal combustion engine is equivalent to a target air-fuel ratio. In particular, when the air-fuel ratio feedback control is executed by means of a control system for an internal combustion engine which uses compressed natural gas (CNG), it is required that the internal combustion engine can be properly operated even when the property of CNG is changed. For this purpose, such a technique is known that a parameter, which relates to the combustion state of the air-fuel mixture, is corrected in accordance with the learning control on the basis of the magnitude of the correction value of the fuel injection amount in the air-fuel ratio feedback control after the charging is performed with fuel (see, for example, Patent Literature 1).
That is, in the case of the internal combustion engine which uses the fuel having a possibility that the property may change every time when the charging is performed, it has been feared that the engine stall or the misfire may arise if the same combustion condition is maintained, resulting from the fact that the stoichiometric air-fuel ratio is changed between the situations provided before and after the charging with the fuel. As a countermeasure thereagainst, the air-fuel ratio feedback control has been performed in some cases while corresponding to the difference in the fuel property by performing the learning correction control with a second correction value so that the magnitude of a first correction value is decreased if the first correction value, which is used in order to allow the air-fuel ratio of the mixture to approach the target air-fuel ratio in the air-fuel ratio feedback control, has the magnitude that becomes excessively large after the charging with the fuel. | {
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Photographic elements are widely known to utilize a silver halide grain as an image capture material. The preparation of silver halide grains is also widely known in the art to involve the reaction product of a soluble silver salt with a soluble halide salt in the presence of a peptizer such as gelatin or the like. Subsequent to formation of the silver halide crystals it is desirable to increase the sensitivity of the crystals with spectral sensitizing dyes as known in the art.
During the formation of the desired insoluble silver halide salt a host of deleterious reaction products are typically formed. These deleterious reaction products are predominantly soluble salts which are known to impede the spectral and chemical sensitization and it is therefore desirable to remove these deleterious reaction products.
Methods of removing the deleterious reaction products include a variety of methods which can be categorized as either precipitation or ultrafiltration. Precipitation involves coagulation of the peptizer to form a solid phase, which contains the silver halide grains, and a liquid phase which contains the deleterious reaction products. Removing the liquid phase separates the grains from the deleterious products. Virgin liquid can be added and the peptizer uncoagulated to obtain the desired product. If desired, the coagulation step can be repeated to reach optimal purity. Precipitation methods are undesirable due to the limited control and the poor reproducibility of the impurity levels in the finished product. Furthermore, the addition of a coagulating agent may increase the viscosity of the resulting solution which is undesirable in the subsequent coating of the silver halide grains on a substrate.
Ultrafiltration is an improvement over precipitation. Undesirable soluble reaction products are removed by passing the solution through a filtering means which is chosen to exclude passage of desirable silver halide grains but not soluble reaction products. The exit stream, or flitrate, and retentate can be monitored and the process stopped at a predetermined level of purity which allows for the formation of a product which is more reproducible than those obtained by the precipitation methods.
Ultrafiltration is thought to affect the surface of silver halide grains in a way which is deleterious to the aggregation of some classes of sensitizing dyes. There has been a long felt need in the art to provide a means for supersensitizing ultrafiltered grains such that the advantages of ultrafiltration and the advantages of spectral sensitizing dyes can be realized in combination. | {
"pile_set_name": "USPTO Backgrounds"
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The invention relates to a process for improving color and color stability of oleic acid.
1. Background of the Invention
Oleic acid has many industrial and commercial uses and applications in which color is a major consideration. When oleic acid is introduced into many consumer products, a colorless or light colored material is required. In addition, when oleic acid is utilized in chemical processes as a reactant, color stability can be important if colorless or light colored products are required.
2. Related Art
It is known that the color and color stability of oleic acid is influenced by small amounts of minor components in oleic acid. The minor components and the effect on color and color stability are discussed in a series of articles which appeared in JAOCS, Vol. 59, No. 1 (January 1982) pgs.42-51; Sherman S. Lin et al., CHARACTERIZATION OF MINOR CONSTITUENTS IN COMMERCIAL OLEIC ACID, JOACS, Vol. 59, No. 1 (January 1982) pgs. 42-46; Yokunobo Murase et al., ORIGIN OF MINOR CONSTITUENTS OF COMMERCIAL OLEIC ACID; JAOCS, Vol. 59, No. 1 (January 1982) Pgs. 47-50; and Sherman S. Lin et al. qualitative and quantitative COMPARISON OF MINOR CONSTITUENTS IN DIFFERENT COMMERCIAL OLEIC ACIDS. JAOCS, Vol. 59, No. 1 (January 1982) Pgs. 50-51.
The articles disclose that about 1.2% of impurities in commercial oleic acid are responsible for the color and color instability of oleic acid. A portion of the color causing materials are present in the tallow (raw material) from which the oleic acid is produced and a portion of the color causing materials are formed during the production of oleic acid from tallow.
The articles disclose that the color causing materials (minor constituents) can be removed from oleic acid by adsorption on activated silicic acid. The method effectively removes the minor components from oleic acid. However, the adsorption method is generally not suitable for a commercial process due to the difficulty in regenerating the activated silicic acid or disposal of the spent solid.
Commercially, high purity, color stable oleic acid is produced by a combination of distillation and absorption methods with the consequent difficulty associated with handling and disposal of the solid adsorbent material. It would be useful to provide a commercial process which effectively improved the color and color stability of oleic acid without need for an absorption step. A number of distillation processes for fatty acids are disclosed in Diechelmann, G and Heinz, H. J., THE BASICS OF INDUSTRIAL OLEOCHEMISTRY, Peter Pomp GmbH (ISBN 3-89355-008-9), pages 52-74.
The color and color stability of oleic acid can be improved by a distillation process which comprises introducing an oleic acid feed into a first distillation zone having an enriching section and a stripping section to separate a minor amount of a topping product and a major amount of a bottoms product containing the oleic acid and introducing the bottoms produced containing oleic acid into a lower portion of a second distillation zone having an enriching section and removing the purified oleic acid as the top product and a residue fraction from the bottom of the second distillation zone.
The process effectively reduces the amounts of the minor components which are responsible for color formation and color instability and produces a commercially useful, color stable oleic acid without need for an adsorption step. The oleic acid produced by the process of the present invention can be superior to, or at least equivalent to, commercially available oleic acid produced by a distillation and adsorption method without the concomitant difficulties associated with handling and disposal of solid materials. | {
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The present invention is directed to the field of low pressure chemical vapor deposition of silicon nitride films using bis(tertiarybutylamino)silane, a novel organosilicon source material for silicon nitride.
In the fabrication of semiconductor devices, a thin passive layer of a chemically inert dielectric material such as, silicon nitride (Si.sub.3 N.sub.4) is essential. Thin layers of silicon nitride function as diffusion masks, oxidation barriers, trench isolation, intermetallic dielectric material with high dielectric breakdown voltages and passivation layers. Many other applications of silicon nitride coatings in the fabrication of semiconductor devices are reported elsewhere, see Semiconductor and Process technology handbook, edited by Gary E. McGuire, Noyes Publication, New Jersey, (1988), pp 289-301; and Silicon Processing for the VLSI ERA, Wolf, Stanley, and Talbert, Richard N., Lattice Press, Sunset Beach, Calif. (1990), pp 20-22, 327-330.
The present semiconductor industry standard silicon nitride growth method is by low pressure chemical vapor deposition in a hot wall reactor at >750.degree. C. using dichlorosilane and ammonia.
Deposition of silicon nitride over large numbers of silicon wafers has been accomplished using many precursors. The low pressure chemical vapor deposition (LPCVD) using dichlorosilane and ammonia requires deposition temperatures greater than 750.degree. C. to obtain reasonable growth rates and uniformities. Higher deposition temperatures are typically employed to get the best film properties. There are several drawbacks in these processes and some of these are as follows:
i) Deposition under 850.degree. C. gives poor hazy films with chlorine and particle contamination; PA1 ii) Silane and dichlorosilane are pyrophoric, toxic compressed gases; PA1 iii) Films formed from dichlorosilane result in the formation of less uniform films; and PA1 iv) Films from dichlorosilane have contaminants, such as chlorine and ammonium chloride, which are formed as byproducts. PA1 1) They contain N-methyl groups, the methyl groups tend to migrate to the silicon surface readily and contaminate the films with carbon during a CVD process. In order to reduce the amount of carbon, the process involves high temperatures (>700) and high ammonia ratios (>10:1). With increased ammonia ratios the deposition rates dramatically reduce due to reactant depletion. PA1 2) They do not contain NH bonding and they do not involve secondary silanes. PA1 3) At lower temperatures the deposition rates and uniformities are very poor (>5%). PA1 a) heating a substrate to a temperature in the range of approximately 500.degree.-800.degree. C. in said zone; PA1 b) maintaining the substrate in a vacuum at a pressure in the range of approximately 20 mTorr-2 Torr in said zone; PA1 c) introducing into said zone ammonia and a silane of the formula: (t-C.sub.4 H.sub.9 NH).sub.2 SiH.sub.2 ; and PA1 d) maintaining the conditions of a) through c) sufficient to cause a film of silicon nitride to deposit on the substrate.
Japanese Patent 6-132284 describes deposition of silicon nitride using organosilanes with a general formula (R.sub.1 R.sub.2 N).sub.n SiH.sub.4-n (where R.sub.1 and R.sub.2 range from H--, CH.sub.3 --, C.sub.2 H.sub.5 --C.sub.3 H.sub.7 --, C.sub.4 H.sub.9 --) by a plasma enhanced chemical vapor deposition and thermal chemical vapor deposition in the presence of ammonia or nitrogen. The precursors described here are tertiary amines and do not contain NH bonding as in the case of the present invention. The deposition experiments were carried out in a single wafer reactor at 400.degree. C. at high pressures of 80-100 Torr. The Si:N ratios in these films were 0.9 (Si:N ratios in Si.sub.3 N.sub.4 films is 0.75) with hydrogen content in the deposited films. The butyl radical is in the form of isobutyl.
Sorita et al., J. Electro. Chem. Soc., Vol 141, No 12, (1994), pp 3505-3511, describe deposition of silicon nitride using dichlorosilane and ammonia using a LPCVD process. The major products in this process are aminochlorosilane, silicon nitride and ammonium chloride. Formation of ammonium chloride is a major drawback of using Si--Cl containing precursors. The formation of ammonium chloride leads to particle formation and deposition of ammonium chloride at the backend of the tube and in the plumbing lines and the pumping system. Processes which contain chlorine in the precursors result in NH.sub.4 Cl formation. These processes require frequent cleaning and result in large down time of the reactors.
B. A. Scott, J. M. Martnez-Duart, D. B. Beach, T. N. Nguyen, R. D. Estes and R. G. Schad., Chemtronics, 1989, Vol 4, pp 230-234., report deposition of silicon nitride using silane and ammonia by LPCVD in the temperature region of 250.degree.-400.degree. C. Silane is a pyrophoric gas and is difficult to control for the deposition of clean silicon nitride due to partial gas phase reaction.
J. M. Grow, R. A. Levy, X. Fan and M. Bhaskaran, Materials Letters, 23, (1995), pp 187-193, describe deposition of silicon nitride using ditertiarybutylsilane and ammonia by LPCVD process in the temperature range of 600.degree.-700.degree. C. The deposited silicon nitride films were contaminated with carbon impurities (10 atomic %). This is mainly due to the presence of direct Si--C bonds in the precursor.
A. K. Hochberg and D. L. O'Meara, Mat. Res. Soc. Symp. Proc,. Vol. 204, (1991), pp 509-514, report deposition of silicon nitride and silicon oxynitride by using diethylsilane with ammonia and nitric oxide by LPCVD. The deposition was carried out in the temperature range of 650.degree. C. to 700.degree. C. The deposition is limited to deposition at 650.degree. C. and the deposition rate drops to below 4 .ANG./min at lower temperatures. In the LPCVD process, precursors which contain direct Si--C carbon bonds result in carbon contamination in the films. Carbon free deposition requires greater than 5:1 NH.sub.3 to precursor ratios. At lower ammonia concentrations, the films were found to contain carbon. Diethylsilane+ammonia processes typically require covered boats or temperature ramping to improve uniformities across the wafers.
U.S. Pat. No. 5,234,869 and R. G. Gordon and D. M. Hoffman, Chem. Mater., Vol. 2, (1990), pp 482-484 disclose other attempts to reduce the amount of carbon involved aminosilanes, such as tetrakis(dimethylamino)silane. The temperature of deposition is in the range of 300.degree.-1000.degree. C. with pressures in the range of 1 mTorr-10 Torr. The presence of direct Si--N bonds and the absence of Si--C bonds were expected to give lower carbon concentrations in the films. However, there are three main disadvantages with precursors of this class.
The prior art has attempted to produce silicon nitride films at low temperatures, at high deposition rates and low hydrogen and carbon contamination. However, the prior art has not been successful in achieving all these goals simultaneously with one silicon precursor. The present invention has overcome the problems of the prior art with the use of a precursor unique to the formation of silicon nitride which avoids the problems of plasma deposition, operates at low thermal conditions, avoids Si--C bonds to reduce carbon contamination of the resulting films, has low hydrogen contamination, as well as avoiding chlorine contamination and operates at low pressures (20 mTorr-2 Torr) in a manufacturable batch furnace (100 wafers or more), as will be described in greater detail below. | {
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Polyetheretherketone (PEEK), successfully developed and commercialized first by Imperial Chemical Industries, Ltd., England, has been used widely in many high-tech fields owing to its excellent comprehensive property. However, PEEK material itself has many disadvantageous: rapid drop in material modulus at high temperature caused by the low glass transition temperature and low application temperature (application temperature for long, ≦240° C.) caused by the low melting point, which greatly limit the range of application. In order to further raise the application temperature of polyaryletherketone material which is a critical material for reforming conventional industry, thereby satisfying the increasing demands on the heat resistance in advanced technical field, such as new energy, nuclear technology, space development, ocean engineering and the like. Many attempts have been made by the scientific research personnels. Firstly, PEEK has been blended with other high-performance materials such as polysulfone (PSF), polyether sulfone (PES), Polyimide (PAI), polyether amide (PEI), polyphenylene sulfide (PPS), polyetherketone (PEK) and so on to obtain a composite material. But phase separation exists in these composite materials and influences the mechanical performance and application of the materials. Next, a stiff structure has been introduced into the main chain of PAEK and the glass transition temperature (Tg) and melting point (Tm) have been raised so as to raise the application temperature of PAEK. New sorts of polymers, such as polyetheretherketoneketone (PEEKK), polyetherdiphenyletherketone (PEDEK), and polyetherdiphenyletherketoneketone (PEDEKK) have been presented in succession to satisfy the urgent needs of some sophisticated techniques. However, the difficulties in processing grow up with the continual increase in Tg and Tm. Recently, the Tm of a new sort of PAEK, developed successfully by the inventors, has reached 469° C., see reference 1 (Zhou H. W., Chen C. H., Wu Z. W. et al., Polymer Preprints [J], 1999, 40(1):203-204) and reference 2 (Zhou H. W., Doctoral Dissertation (Jilin Univ), 1999 “Research on the molecular design and chain structure of PAEK and the structure of condensed phase”). The PAEK material having a very high melting point, theoretically having the application temperature rasied up to 350° C., thus it is very difficult to be put into practice. The most major reason lies in the fact that it is very difficult to form this material into a practicable product. So the method of raising the Tg and Tm of PAIK to raise the application temperature has an obvious disadvantage. In addition, an attempt has been made to introduce a cross-linking point into the PAEK material thereby forming a cross-linked structure to obtain a high-performance material. But a degradation reaction takes place at the selected cross-linking point during the cross-linking reaction and causes the deterioration of the material performance. As a result, the desired result is not achieved.
Polymer materials can be classified into two types: thermoplastic materials and thermosetting materials. These two types of materials respectively have respective strong and weak points: the former has excellent processability and low application temperature, and the latter has high application temperature but is somewhat difficult to be formed into a cast piece having fixed dimension and shape. It is desired to develop a material exhibiting excellent material performances and processing properties by combining the excellent processability of the thermoplastic material with the excellent heat performance of the thermosetting material. It is the hot spot of research and development for the next generation material exhibiting high performance.
Therefore, in respect to the molecular design of PAEK, the strong points of the two types of materials are considered to combine into one material so that both the excellent processability of the thermoplastic material and the excellent heat resistance of the thermosetting material are fully utilized. Based on this design, the present inventors incorporated the thioether structure, which is capable of being subjected to a cross-linking reaction at high temperature or radiation conditions, into the main chain of PAEK as a cross-linking point. No degradation reaction takes place and no small molecules are produced during the cross-linking reaction. After a cross-linked network structure is formed, a high-performance thermosetting material having stable polymer molecular structure and performance can be obtained. In the process of preparation, the segment length between adjacent cross-linking points is made to be basically the same by regulating and controlling the regular distribution of the thioether structure in the PAEK segments by way of block copolymerization. In this way, the uniform distribution of the cross-linking points in the polymer segments is achieved. In addition, a series of controllable cross-linking PAEK can be prepared by changing the ratio of monomers in the polymerization process, to regulate and control the content of thioether structure in polymer segment. The mol percent is controlled in the range of 2.5%-30%. The material performance can be controlled and regulated by controlling and regulating the cross-linking density so as to achieve the object of controlling the material performance of the cross-linked PAEK and satisfying the different application requirements. Combining the excellent characteristics of the thermoplastic and thermosetting resin matrix, without increasing production cost, not only can solve the problem of low heat resistance of thermoplastic resin matrix but also can avoid the disadvantage of poor processability of thermosetting resin matrix. The material can be used at a temperature up to 350° C. It is great significant to develop a PAEK material with improved performance. | {
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In U.S. Pat. No. 3,981,481 granted Sept. 21, 1976, assigned to the same assignee as the present application, a bottom operable tank car valve is disclosed including a valve body attached to an opening in the bottom of the tank. The valve body includes an opening centrally thereof for loading and unloading the lading. A depending housing is attached to the valve body with mechanical fasteners which constitute a shear plane. The housing includes a loading and unloading spout extending radially outwardly from the outlet. An operating assembly for loading and unloading the tank is mounted within a bore in the lower portion of the housing. The operating assembly includes a lower operator which extends below the valve housing and which is adapted to be engaged by a suitable unloading tool. The lower operator has a square opening engaging with clearance a square head on an upper valve operator which extends upwardly within the opening in the valve body. A retainer assembly attached to the valve body maintains the upper operator vertically fixed and spaced from the walls of the valve body. The upper operator engages a depending member from a valve closure. The closure is movable between a closed position engaging the top surface of the retainer assembly, and an open position to load or unload the lading.
In accordance with one embodiment in the '481 patent the upper operator engaging the depending valve closure is located within the valve body at a point above the shear plane defined by the mechanical fasteners holding the housing in engagement with the valve body (FIGS. 10 and 11 of the '481 patent). Thus in the event of impact to the depending housing, the housing will shear off along the shear plane provided in the mechanical fasteners, and the lower operator will drop off, leaving in place the upper operator within the valve body. After such an impact the car can be unloaded by attaching a suitable tool to the head on the upper operator to raise the valve closure and unload the car.
While this arrangement is considered to be highly advantageous in protecting the car against impacts bursting the tank, it does have some disadvantages. If in transit or during derailment the lower portion of the valve housing is impacted, some of the impact force is transmitted to the lower operator, and then upwardly into the upper valve operator. This force may result in damage to the upper operator such as deforming and rendering inoperative the threads for moving the valve closure vertically, or forcing the upper operator upwardly and moving the valve closure out of the closed position, causing lading to come out of the tank. This problem is more serious if the operator neglects to replace a removable cap on the valve housing, which provides some protection against impacts to the lower housing and/or operating assembly being transmitted up into the second operator and valve plug.
Thus it would be desirable to provide a bottom operable loading and unloading valve assembly in which impacts to the lower portion of the housing and valve assembly are less readily transmitted vertically up into the upper operator and into the valve plug.
If the operating assembly for opening the valve is damaged in transit, expensive operator time is required at the unloading site to repair the outlet prior to its unloading. This results in reduced unloading rates and may require the car be taken out of service for repairs.
Furthermore, the depending valve housing is a heavy and expensive member, usually a casting. If this housing could be eliminated, or made smaller, considerable cost and weight savings in the tank car valve assembly would be obtained. Also, the size and weight of this housing makes disassembly and removal of the housing awkward for the operator.
Usually the spout for unloading on the housing extends radially outwardly from the outlet only in one direction. This requires that the unloading operator move the unloading hose and connection adapter so as to engage the unloading spout in the position that the spout is located when the car arrives at destination. Since the unloading hose is often heavy and often includes little surplus length, this can be a difficult operation, and may require relocation of the tank car.
The present housing requires that the unloading hose be attached with a threaded connection. Threads are provided on the housing for attaching the unloading hose and for attaching a removable cap which is applied over the loading and unloading spout. Some receivers prefer to attach the unloading hose to the internal threads where the unloading plug is attached and where the tube for heating congealed lading is usually attached (element 104, FIG. 1 of the '481 patent). In either case attachment of the unloading hose to a threaded fitting may require the cost of the expensive plummer time in some locations to make this connection. Thus a quick-connect-disconnect connection would be more desirable than the threaded connections presently provided on the housing. | {
"pile_set_name": "USPTO Backgrounds"
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Gas turbine engines are used to power aircraft, watercraft, power generators, and the like. Gas turbine engines typically include a compressor, a combustor, and a turbine. The compressor compresses air drawn into the engine and delivers high pressure air to the combustor. In the combustor, fuel is mixed with the high pressure air and is ignited. Products of the combustion reaction in the combustor are directed into the turbine where work is extracted to drive the compressor and, sometimes, an output shaft. Left-over products of the combustion are exhausted out of the turbine and may provide thrust in some applications.
Products of the combustion reaction directed into the turbine flow over airfoils included in stationary vanes and rotating blades of the turbine. The interaction of combustion products with the airfoils heats the airfoils to temperatures that require the airfoils to be made from high temperature materials and/or to be actively cooled by supplying relatively cool air to the vanes and blades. To this end, some airfoils for vanes and blades are being made from composite materials adapted to withstand very high temperatures. Design and manufacture of vanes and blades from composite materials presents challenges because of the complex geometry and strength required for the parts. | {
"pile_set_name": "USPTO Backgrounds"
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Bacterial resistance to antibiotics has long been recognized, and it is today considered to be a serious worldwide health problem. As a result of resistance, some bacterial infections are either difficult to treat with antibiotics or even untreatable. This problem has become especially serious with the recent development of multiple drug resistance in certain strains of bacteria, such as Streptococcus pneumoniae (SP), Mycobacterium tuberculosis, and Enterococcus. The appearance of vancomycin resistant enterococcus was particularly alarming because vancomycin was formerly the only effective antibiotic for treating this infection, and had been considered for many infections to be the drug of “last resort”. While many other drug-resistant bacteria do not cause life-threatening disease, such as enterococci, there is the fear that the genes which induce resistance might spread to more deadly organisms such as Staphylococcus aureus, where methicillin resistance is already prevalent (De Clerq, et al., Current Opinion in Anti-infective Investigational Drugs, 1999, 1, 1; Levy, “The Challenge of Antibiotic Resistance”, Scientific American, March, 1998).
Another concern is how quickly antibiotic resistance can spread. For example, until the 1960's SP was universally sensitive to penicillin, and in 1987 only 0.02% of the SP strains in the U.S. were resistant. However, by 1995 it was reported that SP resistance to penicillin was about seven percent and as high as 30% in some parts of the U.S. (Lewis, FDA Consumer magazine (September, 1995); Gershman in The Medical Reporter, 1997).
Hospitals, in particular, serve as centers for the formation and transmission of drug-resistant organisms. Infections occurring in hospitals, known as nosocomial infections, are becoming an increasingly serious problem. Of the two million Americans infected in hospitals each year, more than half of these infections resist at least one antibiotic. The Center for Disease Control reported that in 1992, over 13,000 hospital patients died of bacterial infections that were resistant to antibiotic treatment (Lewis, “The Rise of Antibiotic-Resistant Infections”, FDA Consumer magazine, September, 1995).
As a result of the need to combat drug-resistant bacteria and the increasing failure of the available drugs, there has been a resurgent interest in discovering new antibiotics. One attractive strategy for developing new antibiotics is to inhibit DNA gyrase, a bacterial enzyme necessary for DNA replication, and therefore, necessary for bacterial cell growth and division. Gyrase activity is also associated with events in DNA transcription, repair and recombination.
Gyrase is one of the topoisomerases, a group of enzymes which catalyze the interconversion of topological isomers of DNA (see generally, Kornberg and Baker, DNA Replication, 2d Ed., Chapter 12, 1992, W.H. Freeman and Co.; Drlica, Molecular Microbiology, 1992, 6, 425; Drlica and Zhao, Microbiology and Molecular Biology Reviews, 1997, 61, 377). Gyrase itself controls DNA supercoiling and relieves topological stress that occurs when the DNA strands of a parental duplex are untwisted during the replication process. Gyrase also catalyzes the conversion of relaxed, closed circular duplex DNA to a negatively superhelical form which is more favorable for recombination. The mechanism of the supercoiling reaction involves the wrapping of gyrase around a region of the DNA, double strand breaking in that region, passing a second region of the DNA through the break, and rejoining the broken strands. Such a cleavage mechanism is characteristic of a type II topoisomerase. The supercoiling reaction is driven by the binding of ATP to gyrase. The ATP is then hydrolyzed during the reaction. This ATP binding and subsequent hydrolysis cause conformational changes in the DNA-bound gyrase that are necessary for its activity. It has also been found that the level of DNA supercoiling (or relaxation) is dependent on the ATP/ADP ratio. In the absence of ATP, gyrase is only capable of relaxing supercoiled DNA.
Bacterial DNA gyrase is a 400 kilodalton protein tetramer consisting of two A (GyrA) and two B subunits (GyrB). Binding and cleavage of the DNA is associated with GyrA, whereas ATP is bound and hydrolyzed by the GyrB protein. GyrB consists of an amino-terminal domain which has the ATPase activity, and a carboxy-terminal domain which interacts with GyrA and DNA. By contrast, eukaryotic type II topoisomerases are homodimers that can relax negative and positive supercoils, but cannot introduce negative supercoils. Ideally, an antibiotic based on the inhibition of bacterial DNA gyrase would be selective for this enzyme and be relatively inactive against the eukaryotic type II topoisomerases.
The widely used quinolone antibiotics inhibit bacterial DNA gyrase. Examples of the quinolones include the early compounds such as nalidixic acid and oxolinic acid, as well as the later, more potent fluoroquinolones such as norfloxacin, ciprofloxacin, and trovafloxacin. These compounds bind to GyrA and stabilize the cleaved complex, thus inhibiting overall gyrase function, leading to cell death. However, drug resistance has also been recognized as a problem for this class of compounds (WHO Report, “Use of Quinolones in Food Animals and Potential Impact on Human Health”, 1998). With the quinolones, as with other classes of antibiotics, bacteria exposed to earlier compounds often quickly develop cross-resistance to more potent compounds in the same class.
There are fewer known inhibitors that bind to GyrB. Examples include the coumarins, novobiocin and coumermycin A1, cyclothialidine, cinodine, and clerocidin. The coumarins have been shown to bind to GyrB very tightly. For example, novobiocin makes a network of hydrogen bonds with the protein and several hydrophobic contacts. While novobiocin and ATP do appear to bind within the ATP binding site, there is minimal overlap in the bound orientation of the two compounds. The overlapping portions are the sugar unit of novobiocin and the ATP adenine (Maxwell, Trends in Microbiology, 1997, 5, 102).
For coumarin-resistant bacteria, the most prevalent point mutation is at a surface arginine residue that binds to the carbonyl of the coumarin ring (Arg136 in E. coli GyrB). While enzymes with this mutation show lower supercoiling and ATPase activity, they are also less sensitive to inhibition by coumarin drugs (Maxwell, Mol. Microbiol., 1993, 9, 681).
Despite being potent inhibitors of gyrase supercoiling, the coumarins have not been widely used as antibiotics. They are generally not suitable due to their low permeability in bacteria, eukaryotic toxicity, and poor water solubility (Maxwell, Trends in Microbiology, 1997, 5, 102). It would be desirable to have a new, effective GyrB inhibitor that overcomes these drawbacks. Such an inhibitor would be an attractive antibiotic candidate, without a history of resistance problems that plague other classes of antibiotics.
Replication fork movement along circular DNA can generate topological changes both ahead of the replication complex as well as behind in the already replicated regions (Champoux, J. J., Annu. Rev. Biochem., 2001, 70, 369-413). While DNA gyrase can introduce negative supercoils to compensate for the topological stresses ahead of the replication fork, some overwinding can diffuse back into the already replicated region of DNA resulting in precatenanes. If not removed, the presence of the precatenanes can result in interlinked (catenated) daughter molecules at the end of replication. TopoIV is responsible for separating the catenated daughter plasmids as well as removal of precatenanes formed during replication ultimately allowing for segragation of the daughter molecules into daughter cells. Topo IV is composed of two ParC and 2 parE subunits as a C2E2 tetramer (where the C and E monomers are homologous to the A and B monomers of gyrase, respectively) that requires ATP hydrolysis (at the N-terminus of the E subunit) to reset the enzyme to re-enter the catalytic cycle. Topo IV is highly conserved among bacteria and is essential for bacterial replication (Drlica and Zhao, Microbiol. Mol. Biol. Rev., 1997, 61, 377).
While little attention has been paid to inhibitors that target ParE of TopoIV, the action of the newer quinolones on the ParC region has been widely studied (Hooper, D. C., Clin. Infect. Dis., 2000, 31(Suppl 2): S24-28). It has been demonstrated that moxifloxacin and gatifloxacin have more balanced activities against Gyrase and TopoIV resulting in expanded Gram positive coverage as well as lower levels of resistance caused primary-target mutation. In those cases, susceptibility is limited by the sensitivity of the second target to the antibacterial agent. Thus, agents that can effectively inhibit multiple essential targets can result in an expanded spectrum of potencies, improved antibacterial potencies, improved potency against single target mutants, and/or lower spontaneous rates of resistance.
As bacterial resistance to antibiotics has become an important public health problem, there is a continuing need to develop newer and more potent antibiotics. More particularly, there is a need for antibiotics that represent a new class of compounds not previously used to treat bacterial infection. Such compounds would be particularly useful in treating nosocomial infections in hospitals where the formation and transmission of resistant bacteria are becoming increasingly prevalent. | {
"pile_set_name": "USPTO Backgrounds"
} |
This invention relates in general to electrostatic fluidized bed apparatus and deals more particularly with improved apparatus for coating articles by the electrostatic deposition of particulate material.
The advantages of electrostatic powder coating are well known and apparatus of the type in general use for the application of such coating usually comprises some form of permanent or semipermanent installation which requires external supporting equipment, which may, for example, comprise an air compressor, or high voltage electrical source connected to the equipment by plumbing or electrical lines. Such equipment is particularly well suited for use where a single coating material is to be applied to a relatively large volume of work. However, when the coating material is changed, it is generally necessary to shut down the equipment and thoroughly clean the fluidizing bed so that the material to be used in the next production run will not be contaminated by material used in the previous run. Further, if the equipment is of a type which employs exposed electrodes, a relatively large quantity of powdered coating material must be used even though the fluidizing bed may be relatively small, since it is usually necessary that the coating material cover the electrodes to assure efficient operation. In such an installation the electrodes must also be cleaned whenever the coating material is changed to avoid risk of contamination. The resulting down time is costly and tends to offset advantages derived from the use of such equipment in short run production. Consequently, such apparatus has not realized its full potential for use in the short run production of articles requiring coatings of differing colors or materials or for laboratory use. The present invention is concerned with the aforedescribed problems. | {
"pile_set_name": "USPTO Backgrounds"
} |
Direct-sequence (DS) spread-spectrum modulation is commonly used in wireless communication systems based on code-division multiple-access (CDMA), where each information symbol is represented by a number of “chips.” Representing one symbol by many chips gives rise to “spreading,” as the latter typically requires more bandwidth to transmit. The sequence of chips is referred to as the spreading code. At the receiver, the received signal is despread using a despreading code, which is typically the conjugate of the spreading code.
Interference and noise are the main signal impairments affecting receiver performance in DS-CDMA systems. Interference, in particular, is a combination of many components, including: self-interference, such as inter-symbol interference (ISI); multiple access interference, i.e., interference due to non-zero code cross-correlation; interference from other cells in the downlink; or interference from other users in the uplink. These impairment components must be suppressed at the receiver in order to achieve good throughput of the system.
One promising approach to suppressing impairment is linear equalization. Linear equalization can be performed either before despreading (referred to as chip-level equalization) or after despreading (referred to as symbol-level equalization). In symbol-level equalization, the received chip-level data is despread at multiple delays, and then the multiple signal images are weightedly combined. Chip-level equalization reverses the order of these operations. The received chip data is first weightedly combined using a linear filter and then despread at a single delay. Under most circumstances, symbol-level and chip-level equalization provide equivalent performance
Where the combining weights are computed based on signal characteristics, e.g. a signal or impairment covariance matrix, those weights may be estimated from either the chip-level or despread versions of the signal. In some scenarios, the combining weights computed from symbol-level signal characteristics are simply scaled versions of the combining weights computed from chip-level signal characteristics. Combining weight computation may therefore be conceptually separated from combining weight application, since, if desired, the weights could be computed at the chip-level, scaled, and then applied in a symbol-level equalization process.
Some contexts, however, threaten this relationship between chip-level and symbol-level equalization weight computation and otherwise threaten the ability of combining weights actually computed at the chip-level to provide the same level of equalization performance as that of combining weights actually computed at the symbol-level. In one such context, spreading codes associated with different impairment components are correlated with the spreading code of a desired component to different degrees, meaning that the despreading process affects different impairment components differently. | {
"pile_set_name": "USPTO Backgrounds"
} |
The present invention relates to a garment for use in current registration of electrocardiographic measurements on a person wherein at least one front portion includes devices for holding a monitoring unit and associated cables.
Garments for holding a monitor for current registration of electrocardiographic measurements or the arterial pressure of the wearer are known. The garments can be divided into two groups, one comprising tight-fitting jackets which in addition to holding the monitor also fixate the electrodes to the skin of the bearer. Generally, these jackets are considered uncomfortable, but the fixed connection between the electrodes and the jacket entails the advantage that the path of the cables between the electrodes and the monitor can be predetermined, as no movement will take place between the jacket and the electrodes.
U.S. Pat. No. 4,698,848 discloses a loose-fitting garment in form of a blouse with an internal pocket, in which the equipment for the current registration can be placed. The electrodes are attached to the skin in a conventional way and connected with cables transmitting the signals to the monitoring equipment. To give the bearer an adequate freedom of movement the cables are to have a certain excess length. This excess of length are often attached to the skin of the bearer by means of a self-adhesive band-aid. This is, however, a solution which is both fairly uncomfortable and which makes the placing of the electrodes and the establishing of the connection between the electrodes and the monitoring unit complicated, when the bearer is to put the garment on. | {
"pile_set_name": "USPTO Backgrounds"
} |
The invention relates to means for electrically connecting the shadow mask to an internal conductive layer of a cathode ray tube. A cathode ray tube typically comprises an envelope having a neck containing an electrode system for generating three electron beams, and a substantially rectangular display window, the inside surface of which carries a display screen with phosphor elements luminescing in different colours. The display screen is coated with an electrically conductive layer. A substantially rectangular shadow mask comprising a large number of apertures, is positioned adjacent the display window, and directs each electron beam to luminescent phosphor elements of one colour. The shadow mask is attached to a substantially rectangular supporting frame. The supporting frame is suspended in the display window from pins connected to an upright edge portion of the display window, each of which has at least partly the shape of a truncated cone. The shadow mask is electrically connected to the conductive layer by at least one contact spring, a part of which engages one of the pins and another part of which engages the layer.
Such a cathode ray tube is known from German Offenlegungsschrift 26 22 695. The electric connection between the shadow mask and the electrically conductive layer in this case is produced by at least one contact spring which is interposed between a mask suspension means and a pin having the shape of a truncated cone, and which is fixed on the pin by the suspension means.
The pressure which the contact spring exerts on the electrically conductive layer depends upon the distance between the place where the contact spring engages the suspension means and the point of electrical contact with the conductive layer. If a good electric connection is to be produced for various types of cathode ray tubes having tolerances in the dimensions of the shadow mask and/or the display window, contact springs of different types or with varying tolerances are necessary. Moreover, since the contact spring engages the suspension means in a resilient manner, the contact spring can perform different movements with respect to the display window for example, vibrations present in the shadow mask transmitted to the suspension means, can result in the contact spring rubbing the electrically conductive layer so that the electric connection is detrimentally influenced. | {
"pile_set_name": "USPTO Backgrounds"
} |
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