Trying to calculate thermal resistance before heat sink for cooling MOSFET.
MOSFET Rjc is given in datasheet. But heat sink will be glued using thermal glue like HC910 which has thermal conductivity of 1.7 W/m\*K

I need to calculate Thermal resistance of glue layer.

So,

Rglue=THICKNESS / ( AREA \* K)

K- thermal conductivity

I my case area is 0.01m\*0.009m=0,0000054 sq.m
K is 1.7
And i have no clue what thickness will be. I took 0.1mm as a wild guess.
I know that thermal paste (like artic silver usually go 0.01-0.02mm, but glue
is thicker.

So, in my case Rglue = 0.53 K/W

Is my logic correct? Any idea about thickness?