Due to tight space constraints I need to pass my LTE signal (800-1800 MHz) through a via. The proximity between the antenna connector and the modem is very short (literally on the other side of the pad).

Using impedance calculators, I have found that via diameters/ pads need to be somewhat small (Hole = 12, Pad = 18, Ref plane opening = 32 mils). However impedance controlled signal traces on a 2 layer 63 mil thick PCB are generally pretty wide: 33 mil width with 4mil conductor gap.

My question is how am I to connect the trace to the via when the trace width is substantially larger than the via pad diameter. If I connect it, I would effectively be increasing the via pad diameter to the trace width (33mil), and mess up my impedance.

Thoughts?

Also, here is an image of my PCB with the modem on the top layer, and a u.FL on the bottom layer. Please let me know if you have better ideas on how to connect this or if you see something wrong.

Thanks.

[![enter image description here](https://i.stack.imgur.com/CJitP.png)](https://i.stack.imgur.com/CJitP.png)