The main goal of the SECHIS project is to investigate the architectures for high speed serial interfaces using European microelectronics technologies and the implementation of a radiation hardened SERDES chip for use in space environment. The main project result will be a SERDES (Serializer/Deserializer) chip with a throughput over 2Gbps, implemented on IHP’s cutting edge technologies and ready for qualification.
Das Projekt wird von EUREKA-Mitgliedstaaten sowie dem Forschungsrahmenprogramm Horizon 2020 der Europäischen Union gefördert.