Title of Invention: Positive tone photosensitive compositions containing amic acid as latent base catalyst Abstract: Embodiments in accordance with the present invention encompass photosensitive compositions containing a base soluble polymer, a latent base catalyst, a photoactive compound and an epoxy crosslinking agent. The compositions are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. More specifically, the compositions exhibit increased photo speed, higher elongation to break, higher tensile strength and higher glass transitions temperatures than the conventional compositions, among other enhanced properties. Accordingly, the positive images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements. Detailed Description: Part general_description_paragraphs: Part CROSS REFERENCE TO RELATED APPLICATIONS: This application claims the benefit of U.S. Provisional Application No. 62/848,297, filed May 15, 2019, which is incorporated herein by reference in its entirety. Part BACKGROUND OF THE INVENTION: Part Field of the Invention: The present invention relates to photosensitive compositions encompassing a base soluble polymer, a latent base catalyst, a photoactive compound and an epoxy crosslinking agent. More specifically, the present invention relates to a photosensitive composition containing a polymer having an acidic group, such as polyamic acid or a polymer having a pendent carboxylic acid, phenol or other acidic functional group and a latent base catalyst which upon heat releases the base. The compositions of this invention are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically, such compositions exhibit improved thermal, mechanical and opto-electronic properties. Part Description of the Art: Organic polymer materials are increasingly being used in the microelectronics and optoelectronics industries for a variety of applications. For example, the uses for such organic polymer materials include permanent interlevel dielectrics, redistribution layers (RDL), stress buffer layers, chip stacking and/or bonding, leveling or planarization layers, alpha-particle barriers, passivation layers, among others, in the fabrication of a variety of microelectronic and optoelectronic devices. Where such organic polymer materials are photosensitive, thus self-imageable, and therefore, offer additional advantage of reducing the number of processing steps required for the use of such layers and structures made therefrom. Additionally, such organic polymer materials enable the direct adhesive bonding of devices and device components to form various structures. Such devices include microelectromechanical systems (MEMS), microoptoelectromechanical systems (MOEMS) and the semiconductor device encompassing a complementary metal oxide semiconductor (CMOS) image sensor dam structure, and the like. There has been innumerable polymeric materials used in the art in order to achieve the above noted desired requirements. One such class of polymers include polyimides and its precursor, polyamic acid. However, most of the polyimides disclosed in the art are generally for positive tone image forming films, and many not suitable for many applications. Some of the drawbacks include use of highly toxic and corrosive phenolic monomers which provide alkali solubility that is required for forming positive tone compositions. Other property disadvantages include insolubility of the polyimides and/or the precursor polyamic acids in commonly used solvents in the electronic industry, poor photo imaging capabilities, among others. Even more importantly, such compositions suffer from poor thermo-mechanical properties and may require high cure temperatures, often times higher than 300° C., which are undesirable. See for example, U.S. Pat. No. 8,946,852 B2 and U.S. Pat. No. 7,485,405 B2. Accordingly, it is an object of this invention to provide a series of compositions encompassing base soluble polymer, a latent base catalyst, a photoactive compound and an epoxy crosslinking agent that provide improved thermo-mechanical properties. It is also an object of this invention to provide compositions which can be cured at lower temperatures than the conventional polyimides that exhibit improved thermo-mechanical properties. Other objects and further scope of the applicability of the present invention will become apparent from the detailed description that follows. Part SUMMARY OF THE INVENTION: Surprisingly, it has now been found that incorporating latent base generators, such as mono- or oligomeric amic acids, a product derived from a cyclic anhydride and an amine, with aqueous base soluble polymers, provide compositions that provide improved thermo-mechanical properties, among other property advantages. More specifically, the latent base generators as described herein can be made very readily by reacting a suitable dicarboxylic acid or a cyclic anhydride with a variety of amines, including primary, secondary or tertiary amines. The latent base generators are then combined with a variety of aqueous base soluble polymers, which include among others, polyamic acid and polyimide polymers as disclosed herein as well as polymers containing a pendent acid functional group as described herein. The polymers of this invention can then be combined with a number of additives to form photosensitive compositions which feature excellent thermo-mechanical properties, photo-imaging properties, low cure temperatures, generally below 250° C. or lower, among other property enhancements. Part DETAILED DESCRIPTION OF THE INVENTION: As used herein, the articles “a,” “an,” and “the” include plural referents unless otherwise expressly and unequivocally limited to one referent. Since all numbers, values and/or expressions referring to quantities of ingredients, reaction conditions, etc., used herein and in the claims appended hereto, are subject to the various uncertainties of measurement encountered in obtaining such values, unless otherwise indicated, all are to be understood as modified in all instances by the term “about.” Where a numerical range is disclosed herein such range is continuous, inclusive of both the minimum and maximum values of the range as well as every value between such minimum and maximum values. Still further, where a range refers to integers, every integer between the minimum and maximum values of such range is included. In addition, where multiple ranges are provided to describe a feature or characteristic, such ranges can be combined. That is to say that, unless otherwise indicated, all ranges disclosed herein are to be understood to encompass any and all sub-ranges subsumed therein. For example, a stated range of from “1 to 10” should be considered to include any and all sub-ranges between the minimum value of 1 and the maximum value of 10. Exemplary sub-ranges of the range 1 to 10 include, but are not limited to, 1 to 6.1, 3.5 to 7.8, and 5.5 to 10, etc. As used herein, the expression “alkyl” means a saturated, straight-chain or branched-chain hydrocarbon substituent having the specified number of carbon atoms. Particular alkyl groups are methyl, ethyl, n-propyl, isopropyl, tert-butyl, and so on. Derived expressions such as “alkoxy”, “thioalkyl”, “alkoxyalkyl”, “hydroxyalkyl”, “alkylcarbonyl”, “alkoxycarbonylalkyl”, “alkoxycarbonyl”, “diphenylalkyl”, “phenylalkyl”, “phenylcarboxyalkyl” and “phenoxyalkyl” are to be construed accordingly. As used herein, the expression “cycloalkyl” includes all of the known cyclic groups. Representative examples of “cycloalkyl” includes without any limitation cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, and the like. Derived expressions such as “cycloalkoxy”, “cycloalkylalkyl”, “cycloalkylaryl”, “cycloalkylcarbonyl” are to be construed accordingly. As used herein, the expression “perhaloalkyl” represents the alkyl, as defined above, wherein all of the hydrogen atoms in said alkyl group are replaced with halogen atoms selected from fluorine, chlorine, bromine or iodine. Illustrative examples include trifluoromethyl, trichloromethyl, tribromomethyl, triiodomethyl, pentafluoroethyl, pentachloroethyl, pentabromoethyl, pentaiodoethyl, and straight-chained or branched heptafluoropropyl, heptachloropropyl, heptabromopropyl, nonafluorobutyl, nonachlorobutyl, undecafluoropentyl, undecachloropentyl, tridecafluorohexyl, tridecachlorohexyl, and the like. Derived expression, “perhaloalkoxy”, is to be construed accordingly. It should further be noted that certain of the alkyl groups as described herein, such as for example, “alkyl” may partially be fluorinated, that is, only portions of the hydrogen atoms in said alkyl group are replaced with fluorine atoms and shall be construed accordingly. As used herein the expression “acyl” shall have the same meaning as “alkanoyl”, which can also be represented structurally as “R—CO—,” where R is an “alkyl” as defined herein having the specified number of carbon atoms. Additionally, “alkylcarbonyl” shall mean same as “acyl” as defined herein. Specifically, “(C1-C4)acyl” shall mean formyl, acetyl or ethanoyl, propanoyl, n-butanoyl, etc. Derived expressions such as “acyloxy” and “acyloxyalkyl” are to be construed accordingly. As used herein, the expression “aryl” means substituted or unsubstituted phenyl or naphthyl. Specific examples of substituted phenyl or naphthyl include o-, p-, m-tolyl, 1,2-, 1,3-, 1,4-xylyl, 1-methylnaphthyl, 2-methylnaphthyl, etc. “Substituted phenyl” or “substituted naphthyl” also include any of the possible substituents as further defined herein or one known in the art. As used herein, the expression “arylalkyl” means that the aryl as defined herein is further attached to alkyl as defined herein. Representative examples include benzyl, phenylethyl, 2-phenylpropyl, 1-naphthylmethyl, 2-naphthylmethyl and the like. As used herein, the expression “alkenyl” means a non-cyclic, straight or branched hydrocarbon chain having the specified number of carbon atoms and containing at least one carbon-carbon double bond, and includes ethenyl and straight-chained or branched propenyl, butenyl, pentenyl, hexenyl, and the like. Derived expression, “arylalkenyl” and five membered or six membered “heteroarylalkenyl” is to be construed accordingly. Illustrative examples of such derived expressions include furan-2-ethenyl, phenylethenyl, 4-methoxyphenylethenyl, and the like. As used herein, the expression “heteroaryl” includes all of the known heteroatom containing aromatic radicals. Representative 5-membered heteroaryl radicals include furanyl, thienyl or thiophenyl, pyrrolyl, isopyrrolyl, pyrazolyl, imidazolyl, oxazolyl, thiazolyl, isothiazolyl, and the like. Representative 6-membered heteroaryl radicals include pyridinyl, pyridazinyl, pyrimidinyl, pyrazinyl, triazinyl, and the like radicals. Representative examples of bicyclic heteroaryl radicals include, benzofuranyl, benzothiophenyl, indolyl, quinolinyl, isoquinolinyl, cinnolyl, benzimidazolyl, indazolyl, pyridofuranyl, pyridothienyl, and the like radicals. As used herein, the expression “heterocycle” includes all of the known reduced heteroatom containing cyclic radicals. Representative 5-membered heterocycle radicals include tetrahydrofuranyl, tetrahydrothiophenyl, pyrrolidinyl, 2-thiazolinyl, tetrahydrothiazolyl, tetrahydrooxazolyl, and the like. Representative 6-membered heterocycle radicals include piperidinyl, piperazinyl, morpholinyl, thiomorpholinyl, and the like. Various other heterocycle radicals include, without limitation, aziridinyl, azepanyl, diazepanyl, diazabicyclo[2.2.1]hept-2-yl, and triazocanyl, and the like. “Halogen” or “halo” means chloro, fluoro, bromo, and iodo. In a broad sense, the term “substituted” is contemplated to include all permissible substituents of organic compounds. In a few of the specific embodiments as disclosed herein, the term “substituted” means substituted with one or more substituents independently selected from the group consisting of (C1-C6)alkyl, (C2-C6)alkenyl, (C1-C6)perfluoroalkyl, phenyl, hydroxy, —CO2H, an ester, an amide, (C1-C6)alkoxy, (C1-C6)thioalkyl and (C1-C6)perfluoroalkoxy. However, any of the other suitable substituents known to one skilled in the art can also be used in these embodiments. It should be noted that any atom with unsatisfied valences in the text, schemes, examples and tables herein is assumed to have the appropriate number of hydrogen atom(s) to satisfy such valences. It will be understood that the terms “dielectric” and “insulating” are used interchangeably herein. Thus reference to an insulating material or layer is inclusive of a dielectric material or layer and vice versa. It will be understood that, as used herein, the phrase “microelectronic device” is inclusive of a “micro-optoelectronic device” and an “optoelectronic device”. Thus, reference to microelectronic devices or a microelectronic device assemblies are inclusive of optoelectronic devices and micro-optoelectronic devices as well as assemblies thereof. It will be understood that the term “redistribution layer (RDL)” refers to an electrical signal routing insulation material which features desirable and reliable properties. The term RDL may also be used interchangeably to describe buffer coating layers, such as for example, a stress relief or buffer layer between the solder ball and fragile low-K structure. As used herein, the terms “polymer composition,” “copolymer composition,” “terpolymer composition” or “tetrapolymer composition” are used herein interchangeably and are meant to include at least one synthesized polymer, copolymer, terpolymer or tetrapolymer, as well as residues from initiators, solvents or other elements attendant to the synthesis of such polymers, where such residues are understood as not necessarily being covalently incorporated thereto. But some catalysts or initiators may sometimes be covalently bound to a part of the polymeric chain either at the beginning and/or end of the polymeric chain. Such residues and other elements considered as part of the “polymer” or “polymer composition” are typically mixed or co-mingled with the polymer such that they tend to remain therewith when it is transferred between vessels or between solvent or dispersion media. A polymer composition can also include materials added after synthesis of the polymer to provide or modify specific properties of such composition. Such materials include, but are not limited to solvent(s), antioxidant(s), photoinitiator(s), sensitizers and other materials as will be discussed more fully below. As used herein, the term “modulus” is understood to mean the ratio of stress to strain and unless otherwise indicated, refers to the Young's Modulus or Tensile Modulus measured in the linear elastic region of the stress-strain curve. Modulus values are generally measured in accordance with ASTM method DI708-95. Films having a low modulus are understood to also have low internal stress. The term “photodefinable” refers to the characteristic of a material or composition of materials, such as a polymer or polymer composition in accordance with embodiments of the present invention, to be formed into, in and of itself, a patterned layer or a structure. In alternate language, a “photodefinable layer” does not require the use of another material layer formed thereover, for example, a photoresist layer, to form the aforementioned patterned layer or structure. It will be further understood that a polymer composition having such a characteristic is generally employed in a pattern forming scheme to form a patterned film/layer or structure. It will be noted that such a scheme incorporates an “imagewise exposure” of the photodefinable material or layer formed therefrom. Such imagewise exposure being taken to mean an exposure to actinic radiation of selected portions of the layer, where non-selected portions are protected from such exposure to actinic radiation. As used herein, the term “self-imageable compositions” will be understood to mean a material that is photodefinable and can thus provide patterned layers and/or structures after direct image-wise exposure of a film formed thereof followed by development of such images in the film using an appropriate developer. By the term “derived” is meant that the polymeric repeating units are formed from, for example, condensation of a dianhydride with a diamine. That is, polyimide repeat units are derived from the corresponding dianhydride and diamine. Generally, such condensation reaction first results in a polyamic acid which is further condensed to form a polyimide as described further in detail below. Accordingly, a polyamic acid or a polyimide is generally derived from the condensation of equimolar amounts of at least one dianhydride with one diamine. When a mono-anhydride or a mono-amine is used off-setting the stoichiometry, the resulting polyimide will be end-capped with such excess amount of either the mono-anhydride or the mono-amine employed. Similarly, the other polymers disclosed herein containing acid functional group, such as for example, ring opened maleic anhydride (ROMA) repeat units containing polymers are derived from the corresponding cyclic olefinic monomers and maleic anhydride (COMA), which are then subjected to hydrolysis using a suitable alcohol thereby maleic anhydride ring is opened to generate a base soluble polymer, ROMA polymers. Thus, in accordance with the practice of this invention there is provided a composition comprising: a) a base soluble polymer; b) a compound selected from the group consisting of a compound of formula (IA): wherein R and R4 are the same or different and each independently a divalent organic group selected from the group consisting of (C1-C12)alkylene, (C1-C12)alkenylene, polyalkyleneoxy, (C6-C10)arylene, (C6-C10)aryleneoxy(C6-C10)arylene, (C6-C10)aryleneoxy(C6-C10)aryleneoxy-(C6-C10)arylene, (C6-C10)aryleneoxy(C6-C10)arylenesulfonyl(C6-C10)aryleneoxy(C6-C10)arylene, (C6-C10)arylenesulfonyl(C6-C10)arylene, heteroarylene and (C6-C10)aryleneheteroarylene; R1, R2 and R3 are the same or different and each independently of one another selected from the group consisting of hydrogen, linear or branched (C1-C16)alkyl, hydroxy(C1-C12)alkyl, perfluoro(C1-C12)alkyl, (C6-C10)aryl, (C6-C10)aryl(C1-C3)alkyl and heteroaryl; or R1, R2 and R3 taken together with the nitrogen atom to which they are attached to form a (C7-C15)bicycloalkyl ring optionally containing one or more heteroatoms selected from the group consisting of nitrogen, oxygen, sulfur and phosphorus and optionally containing one or more double bonds; c) a photoactive compound; and d) an epoxy crosslinking agent. Any of the base soluble polymers that will bring about the intended benefit can be used in the compositions of this invention. In some embodiments such base soluble polymers are soluble in variety of organic solvents as well as in water or mixtures thereof. In some embodiments the base soluble polymer is soluble in water especially under basic conditions, such as for example aqueous basic solutions, including alkaline bases as well as organic bases. Example of alkaline base include sodium hydroxide, lithium hydroxide, sodium carbonate, and the like. Organic bases include any of the alkylammonium salts, including without any limitation tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide, and the like. Non-limiting examples of the base soluble polymers that can be employed in the composition of this invention may be selected from the group consisting of: a) a polyamic acid of formula (II): wherein: m is an integer of at least 50; X is one or more distinct tetravalent organic group; and Y is one or more distinct divalent organic group; b) a polymer A comprising one or more distinct first repeating unit represented by formula (IIIA), each of said first repeating unit is derived from a monomer of formula (II): wherein: represents a position at which the bonding takes place with another repeat unit; each of R5, R6, R7 and R8 is independently selected from the group consisting of hydrogen, linear or branched (C1-C6)alkyl, hydroxy(C1-C12)alkyl, perfluoro(C1-C12)alkyl, (C6-C10)aryl, (C6-C10)aryl(C1-C3)alkyl, —CO2Rb, where Rb is (C1-C6)alkyl or tri(C1-C6)alkylsilyl, halogen and a group of formula (A): where Ra is selected from the group consisting of —(CH2)p—, —(CH2)q—OCH2— or —(CH2)q—(OCH2CH2)r—OCH2—, where p is an integer from 0 to 6, q is an integer from 0 to 4 and r is an integer from 0 to 3; one or more distinct second repeating unit represented by formula (IVA), said second repeating unit is derived from a monomer of formula (IV): wherein: each of R9 and R10 is independently selected from the group consisting of hydrogen, linear or branched (C1-C9)alkyl and fluorinated or perfluorinated (C1-C9)alkyl; R11 is selected from the group consisting of hydrogen, linear or branched (C1-C9)alkyl, fluorinated or perfluorinated (C1-C9)alkyl, and —(CH2)a—(O—(CH2)b)c—O—(C1-C6)alkyl, where a, b and c are integers from 1 to 4; and one or more distinct third repeating unit represented by formula (VA), said third repeating unit is derived from a monomer of formula (V): wherein: each of R12 and R13 is independently selected from the group consisting of hydrogen, linear or branched (C1-C9)alkyl and fluorinated or perfluorinated (C1-C9)alkyl; R14 is selected from the group consisting of hydrogen, linear or branched (C1-C16)alkyl, (C3-C9)cycloalkyl, (C3-C9)cycloalkyl(C1-C10)alkyl, (C6-C10)aryl, (C6-C10)aryl(C1-C4)alkyl, (C1-C16)alkylCO2Rc, (C1-C16)alkylCH2ORc, (C6-C10)arylCO2Rc, (C6-C10)arylCH2ORc, where each Rc is independently selected from the group consisting of hydrogen, (C1-C6)alkyl and tri(C1-C6)alkylsilyl; c) a polymer B comprising one or more distinct first repeating unit represented by formula (VIA), each of said first repeating unit is derived from a monomer of formula (VI): wherein: m is an integer from 0 to 2; and , R5, R6, R7 and R8 are as defined above; and one or more distinct second repeating unit represented by formula (IVA) as defined above. The polyamic acid of formula (II) that can be used in the composition of this invention can be synthesized by any of the procedures known to one skilled in the art. For example, such methods include condensation of one or more dianhydrides with one or more diamines essentially in equimolar ratios. Any of the dianhydrides or diamines in combination with substituted cyclic anhydride or their equivalent precursor compounds can be employed. More specifically, the dianhydrides and the diamines that are suitable for forming the polyamic acid used in the composition of this invention can be represented by the following general formulae (IIA) and (IIB) respectively. Wherein X and Y are as defined herein. Thus, any of the dianhydrides of tetracarboxylic acids in combination with any of the diamines can be employed to form the polyamic acid. Again, as noted, any of the techniques known in the art to make polyamic acid can be employed herein. Now turning specifically to X, any of the suitable tetravalent organic group can be employed herein. Non-limiting examples of such X may be selected from the group consisting of: wherein a is an integer from 0 to 4, inclusive; is a single bond or a double bond; each of R15 is independently selected from the group consisting of hydrogen, methyl, ethyl, linear or branched (C3-C6)alkyl, trifluoromethyl, pentafluoroethyl, linear or branched perfluoro(C3-C6)alkyl, methoxy, ethoxy, linear or branched (C3-C6)alkyloxy, (C2-C6)acyl, (C2-C6)acyloxy, phenyl and phenoxy; Z is a divalent group selected from the group consisting of: (CR16R17)b, O(CR16R17)b, (CR16R17)bO, (OCR16R17)d, (CR61R17O)d, (CR16R17)b—O—(CR16R17), (CR16R17)b—O—(SiR16R17)c, (CR16R17)b—(CO)O—(CR16R17)c, (CR16R17)b—O(CO)—(CR16R17)c, (CR16R17)b—(CO)—(CR16R17)c, (CR16R17)b—(CO)NH—(CR16R17), (CR16R17)b—NH(CO)—(CR16R17)c, (CR16R17)b—NH—(CR16R17)c, where b and c are integers which may be the same or different and each independently is 0 to 12, and d is an integer from 1 to 12, inclusive; R16 and R17 are the same or different and each independently selected from the group consisting of hydrogen, methyl, ethyl, linear or branched (C3-C6)alkyl, trifluoromethyl, pentafluoroethyl, linear or branched perfluoro(C3-C6)alkyl, methoxy, ethoxy, linear or branched (C3-C6)alkyloxy, (C2-C6)acyl, (C2-C6)acyloxy, phenyl and phenoxy. Even more specifically, suitable dianhydrides may include the following: Even more specifically, one or more of the dianhydrides of the following formulae can also be employed herein. Where a, Z and R15 are as defined herein. In some embodiments, the polyamic acid of formula (II) used in the composition of this invention are formed using the dianhydrides where X is derived from one or more dianhydrides selected from the group consisting of: As noted, again, any of the diamines known in the art can be used to form the polyamic acid used in the composition of this invention. The diamines can again be broadly classified as aromatic diamines, aliphatic diamines or mixed aliphatic-aromatic diamines which contain a wide variety of bridging groups. A non-limiting generic types of diamines include the following: Where Z and R15 are as defined herein. In some embodiments, the polyimide or polyamic acid of this invention are formed using the diamines where Y is derived from one or more diamines selected from the group consisting of: The polyamic acid used in the composition of this invention having suitable molecular weight can be tailored based on the intended application by employing appropriate polycondensation methods. Accordingly, in some embodiments the number of repeat units, m, in the resulting polyamic acid is at least 50; in some other embodiments m is at least 100, 500, 1000, 2000 or higher. In some embodiments m is from 50 to 2000, inclusive. The degree of polycondensation can be measured by determining the molecular weight of the resulting polyamic acid using any of the known methods in the art, such as for example, by gel permeation chromatography (GPC) equipped with suitable detector and calibration standards, such as differential refractive index detector calibrated with narrow-distribution polystyrene standards. Accordingly, the polyamic acid used in the composition of this invention generally exhibit a weight average molecular weight (Mw) of at least about 5,000. In some other embodiments, the polyamic acid or polyimide as described herein exhibit a weight average molecular weight (Mw) of at least about 20,000. In some other embodiments, the polyamic acid or polyimide made in accordance of this invention has a Mw of at least about 50,000. In yet another embodiment, the polyamic acid or polyimide of this invention has a Mw of at least about 100,000. In some other embodiments, the polyamic acid or polyimide of this invention has a Mw of at least about 200,000. In some other embodiments, the polyamic acid or polyimide of this invention has a Mw ranging from about 50,000 to 500,000, or higher. The polyamic acid used in the composition of this invention generally contains an amic acid repeat unit derived from at least one dianhydride and at least one diamine. In some other embodiments, the polyamic acid or the polyimide of this invention contains an amic acid repeat units derived from two or more anhydrides and two or more diamines as described herein. All of such permutation and combinations are part of this invention. Generally, equimolar ratios of dianhydrides and diamines are employed to form the polyamic acid. That is, one mole of dianhydride is condensed with one mole of diamine. When two or more dianhydrides or diamines are employed, any of the molar ratios of the respective two or more dianhydrides and diamines can be employed so as to tailor the properties of the resulting polyamic acid and depending upon the intended applications. In any event, the polyamic acid used in the composition of this invention contains generally equal molar amounts of the total dianhydride and the total diamines when more than one dianhydride or more than one diamine is employed. That is, a polyamic acid used in the composition of this invention is made by employing equimolar amounts of dianhydride and diamine. Non-limiting examples of a polyamic acid used in the composition in accordance of this invention may be enumerated as follows: A polyamic acid formed from 4,4′-(1,3-phenylenebis(oxy))dianiline (APB), 5,5′-oxybis(isobenzofuran-1,3-dione) (ODPA) and 4,4′-(perfluoropropane-2,2-diyl)bis(2-aminophenol) (BAFA). A polyamic acid formed from 4,4′-([1,1′-biphenyl]-4,4′-diylbis(oxy))bis(3-(trifluoromethyl)aniline) (6BF), 1H,3H-benzo[1,2-c:4,5-c′]difuran-1,3,5,7-tetraone (PMDA) and 4,4′-(perfluoropropane-2,2-diyl)bis(2-aminophenol) (BAFA). A polyamic acid formed from 5,5′-(perfluoropropane-2,2-diyl)bis(isobenzofuran-1,3-dione) (6FDA), 4,4′-([1,1′-biphenyl]-4,4′-diylbis(oxy))bis(3-(trifluoromethyl)aniline) (6BF), and 2-(4-aminophenyl)benzo[d]oxazol-5-amine (BZXPh5). A polyamic acid formed from 5,5′-(perfluoropropane-2,2-diyl)bis(isobenzofuran-1,3-dione) (6FDA), 1H,3H-benzo[1,2-c:4,5-c′]difuran-1,3,5,7-tetraone (PMDA), 4,4′-([1,1′-biphenyl]-4,4′-diylbis(oxy))bis(3-(trifluoromethyl)aniline) (6BF), and 2,2′-bis(trifluoromethyl)-[1,1′-biphenyl]-4,4′-diamine (PFMB). A polyamic acid formed from 5,5′-(perfluoropropane-2,2-diyl)bis(isobenzofuran-1,3-dione) (6FDA), 1H,3H-benzo[1,2-c:4,5-c′]difuran-1,3,5,7-tetraone (PMDA), 4,4′-(((perfluoropropane-2,2-diyl)bis(4,1-phenylene))bis(oxy))dianiline (HFBAPP), and 2,2′-bis(trifluoromethyl)-[1,1′-biphenyl]-4,4′-diamine (PFMB). A polyamic acid formed from 5,5′-(perfluoropropane-2,2-diyl)bis(isobenzofuran-1,3-dione) (6FDA), 1H,3H-benzo[1,2-c:4,5-c′]difuran-1,3,5,7-tetraone (PMDA), 4,4′-([1,1′-biphenyl]-4,4′-diylbis(oxy))bis(3-(trifluoromethyl)aniline) (6BF), and 2-(4-aminophenyl)benzo[d]oxazol-5-amine (BZXPh5). Advantageously, the polyamic acid used in the composition of this invention are soluble in an organic solvent as well as in several aqueous base solutions. Exemplary organic solvents, without any limitation, that can be employed to dissolve the composition of this invention are selected from the group consisting of N-methyl-2-pyrrolidone (NMP), γ-butyrolactone (GBL), N,N-dimethylacetamide (DMAc), propylene glycol monomethyl ether acetate (PGMEA), dimethyl sulfoxide (DMSO), cyclopentanone, cyclohexanone, 2-butanone and 2-heptanone and mixtures in any combination thereof. It should further be noted that any of the aforementioned solvents can be used alone or in combination with one or more solvents, and in combination with aqueous base. Various other polymers, which are soluble in a base can be employed in the composition of this invention. Such, non-limiting examples include polymer A and polymer B as described hereinabove. Polymer A is disclosed in U.S. Pat. No. 9,834,627 B2, pertinent portions of which are incorporated herein by reference. Polymer B is disclosed in U.S. Pat. No. 8,715,900 B2, pertinent portions of which are incorporated herein by reference. Various other polymers which are base soluble are also disclosed in literature, all such polymers are suitable in the composition of this invention. See for example, U.S. Pat. No. 9,291,901 B2 and U.S. Pat. No. 9,422,376 B2. Accordingly, all such polymers can be employed in the composition of this invention. In some embodiments, the polymer A or polymer B employed in the composition of this invention further comprises respectively one or more distinct fourth or third repeat unit of formula (VHA) derived from a monomer of formula (VII): wherein: represents a position at which the bonding takes place with another repeat unit; m is an integer from 0 to 2; each of R18, R19, R20 and R21 is independently selected from the group consisting of hydrogen, linear or branched (C1-C16)alkyl, hydroxy(C1-C12)alkyl, perfluoro(C1-C12)alkyl, (C3-C12)cycloalkyl, (C6-C12)bicycloalkyl, (C7-C14)tricycloalkyl, (C6-C10)aryl, (C6-C10)aryl(C1-C3)alkyl, perfluoro(C6-C10)aryl, perfluoro(C6-C10)aryl(C1-C3)alkyl, (C5-C10)heteroaryl, (C4-C10)heteroaryl(C1-C3)alkyl, hydroxy, (C1-C12)alkoxy, (C3-C12)cycloalkoxy, (C6-C12)bicycloalkoxy, (C7-C14)tricycloalkoxy, —(CH2)e—(O—(CH2)f)g—O—(C1-C4)alkyl, where e, f and g are integers from 1 to 4, inclusive, (C6-C10)aryloxy(C1-C3)alkyl, (C5-C10)heteroaryloxy(C1-C3)alkyl, (C6-C10)aryloxy, (C5-C10)heteroaryloxy, (C1-C6)acyloxy and halogen. In some embodiments the composition of this invention encompasses polymer A, which is having one or more distinct first repeating unit derived from a respective monomer selected from the group consisting of: bicyclo[2.2.1]hepta-2,5-diene (norbornadiene); 2-methylbicyclo[2.2.1]hepta-2,5-diene; 2-butylbicyclo[2.2.1]hepta-2,5-diene; 2-hexylbicyclo[2.2.1]hepta-2,5-diene; 2-octylbicyclo[2.2.1]hepta-2,5-diene; 2-phenethylbicyclo[2.2.1]hepta-2,5-diene; tert-butyl bicyclo[2.2.1]hepta-2,5-diene-2-carboxylate; trimethylsilyl bicyclo[2.2.1]hepta-2,5-diene-2-carboxylate; and bicyclo[2.2.1]hepta-2,5-dien-2-ylmethanol. In some embodiments the composition of this invention encompasses polymer A, which is having one or more distinct second repeating unit derived from a respective monomer selected from the group consisting of: maleic anhydride; 2-methyl-maleicanhydride(3-methylfuran-2,5-dione); 2,3-dimethyl-maleicanhydride(3,4-dimethylfuran-2,5-dione); 2-ethyl-maleicanhydride(3-ethylfuran-2,5-dione); 2,3-diethyl-maleicanhydride(3,4-diethylfuran-2,5-dione); 2-trifluoromethyl-maleicanhydride(3-trifluoromethylfuran-2,5-dione); 2,3-bis(trifluoromethyl)-maleicanhydride(3,4-bis(trifluoromethyl)furan-2,5-dione); and 2-methyl-3-trifluoromethyl-maleicanhydride(3-methyl-4-(trifluoromethyl)furan-2,5-dione). In some embodiments the composition of this invention encompasses polymer A, which is having one or more distinct third repeating unit derived from a respective monomer selected from the group consisting of: maleimide; N-methylmaleimide; N-butylmaleimide; 3-methylmaleimide (3-methylpyrrolidine-2,5-dione); N-cyclohexylmaleimide; N-phenylmaleimide; N-benzylmaleimide; and N-phenethylmaleimide. In some embodiments the composition of this invention encompasses polymer A, which is having one or more distinct fourth repeating unit derived from a respective monomer selected from the group consisting of: norbornene; 5-hexylbicyclo[2.2.1]hept-2-ene; 5-octylbicyclo[2.2.1]hept-2-ene; 5-decylbicyclo[2.2.1]hept-2-ene; 5-((2-(2-methoxyethoxy)ethoxy)methyl)bicyclo[2.2.1]hept-2-ene (NBTON); 1-(bicyclo[2.2.1]hept-5-en-2-yl)-2,5,8,11-tetraoxadodecane; 5-benzylbicyclo[2.2.1]hept-2-ene; 4-(bicyclo[2.2.1]hept-5-en-2-yl)phenol (NBPhOH); 2-(bicyclo[2.2.1]hept-5-en-2-yl)acetic acid (NBCH2CO2H); 3-(bicyclo[2.2.1]hept-5-en-2-yl)propanoic acid (NBCH2CH2CO2H); and 5-phenethylbicyclo[2.2.1]hept-2-ene. In some other embodiments the composition of this invention encompasses polymer A which contains five monomers or more. All such permissible combinations for either polymer A or polymer B are part of this invention. Non-limiting examples of polymer A that can be employed to form the composition of this invention may be selected from the group consisting of: a terpolymer of norbornadiene (NBD), N-phenylmaleimide and maleic anhydride in which maleic anhydride repeating unit is ring opened with methanol; a terpolymer of norbornadiene (NBD), maleimide and maleic anhydride in which maleic anhydride repeating unit is ring opened with methanol; a terpolymer of norbornadiene (NBD), N-cyclohexyl-maleimide and maleic anhydride in which maleic anhydride repeating unit is ring opened with methanol; a tetrapolymer of norbornadiene (NBD), 5-((2-(2-methoxyethoxy)ethoxy)methyl)-bicyclo[2.2.1]hept-2-ene (NBTON), N-phenylmaleimide and maleic anhydride in which maleic anhydride repeating unit is ring opened with methanol; a tetrapolymer of norbornadiene (NBD), N-cyclohexylmaleimide, maleimide and maleic anhydride in which maleic anhydride repeating unit is ring opened with methanol; a tetrapolymer of norbornadiene (NBD), N-phenylmaleimide, maleimide and maleic anhydride in which maleic anhydride repeating unit is ring opened with methanol; a tetrapolymer of norbornadiene (NBD), N-cyclohexyl-maleimide, maleimide and maleic anhydride in which maleic anhydride repeating unit is ring opened with methanol; and a pentapolymer of norbornadiene (NBD), 5-((2-(2-methoxyethoxy)ethoxy)methyl)-bicyclo[2.2.1]hept-2-ene (NBTON), N-cyclohexyl-maleimide, maleimide and maleic anhydride in which maleic anhydride repeating unit is ring opened with methanol. As noted, the composition of this invention contains one or more latent base generators as described herein. Non-limiting specific compounds which are within the scope of the compounds of formulae (IA), (IB), (IC) and (ID) are selected from the group consisting of: Any amount of one or more compounds of formulae (IA), (IB), (IC) and (ID) as latent base generators can be employed in the composition of this invention which will bring about the intended benefit. In some embodiments such amounts may range from 0.2 parts to 15 parts of latent base generator per 100 parts of the base soluble polymer employed. In some embodiments such amount include combined total of more than one latent base generator. In some other embodiments the amount of latent base generator employed ranges from 0.3 weight parts to 10 weight parts per 100 weight parts of the base soluble polymer. In yet some other embodiments the amount of latent base generator employed ranges from 0.4 weight parts to 6 weight parts per 100 weight parts of the base soluble polymer. Surprisingly, employing even such small amounts of the latent base generators impart excellent thermo-mechanical properties of the composition of this invention as demonstrated by specific composition examples that follows. In fact, as further shown by specific examples, the latent base catalysts as employed herein provide hitherto unattainable properties. For example, employing other commonly available bases in place of the latent base catalysts it is not possible to obtain the same enhanced properties. As further noted above the composition further incorporates one or more photoactive compounds (PAC). Therefore, the compositions of this invention are photosensitive, and can be employed in a variety of optoelectronic application for forming a variety of polymeric layers, which may be patternable so as to find applications as dielectric materials. Any of the PACs known to one skilled in the art which would bring about the desired results as further discussed herein can be employed in the composition of this invention. Broadly speaking, the PAC that can be employed in this invention is a photosensitive compound which when exposed to suitable radiation undergoes a chemical transformation such that the resulting product is generally more soluble in a developing solvent, such as for example, alkali solution thus facilitating the exposed regions to dissolve more readily than the unexposed regions, thus forming a positive image upon development. As noted, the composition of this invention further encompass an epoxy resin and a solvent. Further, such compositions are capable of forming films useful as self-imageable layers in the manufacture of microelectronic and optoelectronic devices. That is to say that when image-wise exposed to actinic radiation, such layers (or films) can be developed to form a patterned film, where such pattern is reflective of the image through which the film was exposed. In this manner, structures can be provided that are, or are to become, a part of such microelectronic and/or optoelectronic devices. For example, such films may be useful as low-K dielectric layers in liquid crystal displays or in microelectronic devices. It will be noted that such examples are only a few of the many uses for such a self-imageable film, and such examples do not serve to limit the scope of such films or the polymers and polymer compositions that are used to form them. Generally, the PACs that are suitable in this invention contain a diazo-quinone group of formula (B): Non-limiting examples of such a photoactive compound (PAC) can include one or more of such groups, for example, 1,2-naphthoquinonediazide-5-sulfonyl moiety and/or a 1,2-naphthoquinonediazide-4-sulfonyl moiety as represented by structural formulae (VIIIA) and (VIIIB), respectively: Other such photoactive moieties, among others, include sulfonyl benzoquinone diazide group represented by structural formula (VIIIC): Generally, the functional groups of formulae (VIIIA), (VIIIB) and/or (VIIIC) are incorporated into the photosensitive composition as an esterification product of the respective sulfonyl chloride (or other reactive moiety) and a phenolic compound, such as one or more of the exemplary compounds represented below collectively as structural formulae (IXa) to (IXag). Thus, any one, or any mixture of two or more of such esterification products are combined with the resin in forming the photosensitive resin compositions of the present invention. In the formulae (IXa) to (IXag) below, Q may represent any of the structures (VIIIA), (VIIIB) or (VIIIC). Advantageously, when a portion of a film or a layer of the photosensitive composition is exposed to appropriate electromagnetic radiation, these esterification products generate a carboxylic acid which enhances the solubility of such exposed portion in an aqueous alkali solution as compared to any unexposed portions of such film. Generally, such photosensitive materials are incorporated into the composition in an amount from 1 to 50 parts by weight material to 100 parts by weight base soluble polymer and typically from about 10 to about 40 parts by weight, although other advantageous amounts of such materials are also appropriate and within the scope of the present invention. Where the specific ratio of the photoactive compound to base soluble polymer is a function of the dissolution rate of exposed portions as compared to unexposed portions and the amount of radiation required to achieve a desired dissolution rate differential. In the above listed PACs of formulae (IXa) to (IXag), Q refers to any one of photoactive moieties of formulae (VIIIA), (VIIIB) or (VIIIC) or hydrogen, but at least one of these Q in each of these structures is (VIIIA), (VIIIB) or (VIIIC). Several of the PACs listed above are commercially available. For example, PAC-5570 of formula (IXc) (St. Jean Photochemicals Inc., Quebec, Canada), SCL6 of formula (MX)(Secant Chemicals Inc., Winchendon, Mass., USA), TrisP3M6C-2-201 of formula (IXo), collectively TS-200, TS-250 and TS-300 of formula (IXa), and 4NT-300 of formula (IXe) (all from Toyo Gosei Co. Ltd., Chiba, Japan). It should be noted that for PACs of the types TS-200, TS-250 and TS-300, the degree of substitution of Qs also varies based on the product used. For instance, TS-200 is substituted with 67% of Q, TS-250 is substituted with 83% of Q, and TS-300 with 100% of Q, the unsubstituted portion being hydrogen. Again, Q in each of these instances refers to any one of group (VIIIA), (VIIIB) or (VIIIC). In some embodiments, the composition of this invention contains a photoactive compound selected from the group consisting of: wherein at least one of Q is a group of formula (VIIIa) or (VIIIb): and the remaining Q is hydrogen. It has been further observed that employing one or more photosensitizers in the composition of this invention provides additional beneficial effects. Most notably, the photosensitizers thus employed can activate the photoactive compound at a particular wavelength of the radiated light. For this purpose, any suitable sensitizer compound can be employed in the compositions of the present invention. Such suitable sensitizer compounds include, photosensitizers, such as, anthracenes, phenanthrenes, chrysenes, benzpyrenes, fluoranthenes, rubrenes, pyrenes, xanthones, indanthrenes, and mixtures thereof. In some exemplary embodiments, suitable sensitizer components include mixtures thereof. Generally, as mentioned above, the photosensitizers absorb energy from the radiated light source and transfers that energy to the photoactive compound employed in the composition of this invention so as to form carboxylic acid. It should again be noted that any photosensitizers alone or as mixtures in any combination thereof can be used, and only if needed depending upon the intended use and to obtain the desirable benefit. Again, any amount of one or more of aforementioned sensitizers can be used in the composition of this invention so as to bring about the desired results. Generally it has now been found that such amounts can range from 0 to 5 parts by weight per hundred weight parts of the polymer resin (pphr). In some embodiments such amounts range from 1 to 3 pphr. As noted, the compositions of the present invention also include one or more crosslinking agents that are advantageously capable of bonding with the base soluble polymer when exposed to a suitable radiation. Such materials include, but are not limited to, crosslinking compounds that incorporate one or more of an oxazoline group such as 2-oxazoline-2-yl group, a methylol group such as a N-hydroxy methylaminocarbonyl group or an alkoxymethyl group such as a N-methoxy methylaminocarbonyl group, acrylate group, thiol or thioalkyl group, maleimide, and the like. Generally, the aforementioned bonding with the substituted unsaturated cyclic imide end group of the polyimide is a cross-linking reaction that is initiated by photo radical generated during the photo-irradiation at an appropriate temperature. Further, such crosslinking can be completed further by curing at an appropriate temperature post irradiation, generally at or above 150° C. for an appropriate amount of time. Such thermal curing is further facilitated by thermal radical generator as well as the thermal crosslinking agents such as for example, epoxy groups such as a glycidyl group, an epoxycyclohexyl group, an oxetane group, and the like. It should be noted however that it is surprising that such curing of the composition of this invention can be carried out at much lower temperature than conventionally used especially for polyimides known in the art, which is generally carried out at higher than 250° C. or even higher than 300° C. Accordingly, in some embodiments of this invention, the photosensitive composition of this invention, without any limitation, contains one or more crosslinking agents selected from the following: an epoxy acrylate; a polyester acrylate; a polyether acrylate; an aliphatic urethane acrylate; an aromatic urethane acrylate; a multifunctional epoxy; and a multifunctional mercapto(C2-C8)alkanoate. Exemplary epoxies and other cross-linking additives, as mentioned above, include, but are not limited to, bisphenol A epoxy resin (LX-1—Daiso Chemical Co., Osaka, Japan), 2,2′-((((1-(4-(2-(4-(oxiran-2-ylmethoxy)phenyl)propan-2-yl)phenyl)ethane-1,1-diyl)bis(4,1-phenylene))bis(oxy))bis(methylene))bis(oxirane) (Techmore VG3101L—Mitsui Chemical Inc.), trimethylolpropane triglycidylether (TMPTGE—CVC Specialty Chemicals, Inc.), and 1,1,3,3,5,5-hexamethyl-1,5-bis(3-(oxiran-2-ylmethoxy)propyl)trisiloxane (DMS-E09—Gelest, Inc.), liquid epoxy resins (D.E.R.™ 732, where n=8 to 10, and D.E.R.™ 736, where n=4 to 6—both from Dow Chemical Company), bis(4-(oxiran-2-ylmethoxy)phenyl)methane (EPON™ 862, Hexion Specialty Chemicals, Inc.), triglycidyl ether of poly(oxypropylene)epoxide ether of glycerol (commercially available as Heloxy 84 or GE-36 from Momentive Specialty Chemicals Inc.), 2-((4-(tert-butyl)phenoxy)methyl)oxirane (commercially available as Heloxy 65 from Momentive Specialty Chemicals Inc.) and silicone modified epoxy compound (commercially available as BY16-115 from Toray-Dow Corning Silicone Co., Ltd.) as shown below: Other cross-linking agents that can be used in the compositions of this invention include the following: Still other exemplary epoxy resins or cross-linking additives include, among others Araldite MT0163 and Araldite CY179 (manufactured by Ciba Geigy); and EHPE-3150, Epolite GT300 and (manufactured by Daicel Chemical). The amount of epoxy compound may also vary as noted for PACs depending upon the base soluble polymer employed in the composition and the amount can also vary depending upon the intended result. The amount can vary generally from about 1 to 75 parts by weight per 100 parts of the polymer and typically from about 20 to about 60 parts by weight, although other advantageous amounts of such materials are also appropriate and within the scope of the present invention. In addition, one or more different types of epoxy compounds as enumerated herein can be used in the composition of this invention and the amounts of each can thus be varied as needed. The photosensitive composition of this invention further encompasses one or more compounds or additives having utility as, among other things, adhesion promoter, a surface leveling agent, antioxidants, a synergist, silane coupling agents, phenolic resins, flame retardants, plasticizers, curing accelerators, and the like. In fact, the base catalysts employed herein indeed act as curing accelerators. Examples of surface leveling agents include a variety of non-ionic, amphoteric and anionic surfactants available in the art, which provide, among other things, wetting, spreading and levelling properties. Exemplary surface leveling agents include without any limitation, non-ionic polymeric fluorochemical surfactant, such as for example, FC-4432 available from 3M Advanced Materials Division, a short chain perfluoro-based ethoxylated nonionic fluorosurfactant, such as for example, Chemguard S-550, CAPSTONE fluorosurfactants available as both nonionic and amphoteric forms from DuPont, PolyFox fluorosurfactants from OMNOVA Solutions, and the like. In addition, any of the known conventional surfactants may be used in combination with the above noted surfactants, such known non-ionic surfactants include for example, perfluoroalkyl polyoxyethylene ethanols, fluorinated alkyl esters, perfluoroalkylamine oxides and fluorinated organosiloxane compounds. Various other such commercially available surfactants include Florade FC-4430 from Sumitomo 3M Ltd., Surflon S-141 and S-145 from Asahi Glass Co., Ltd., Unidyne DS-401, DS-4031 and DS-451 from Daikin Industries Ltd., Megaface F-8151 from Dainippon Ink & Chemicals, Inc., and X-70-093 from Shin-Etsu Chemical Co., Ltd. Non-limiting examples of such other compounds or additives are selected from the group consisting of the following, commercially available materials are indicated by such commercial names. Advantageously, it has now been found that polymer compositions of this invention provide several desirable properties especially when compared to several of the polymers reported in the literature for similar applications. For instance, the compositions of this invention exhibit increased photo speed while “image-wise” exposure to a suitable radiation. That is, the images are fixed on the substrates at a much faster speed than most conventional materials. This facilitates faster cycles for forming imaged structures on various substrates. In addition, it has been observed that several of the polymers as described herein exhibit very low dark field loss (DFL) making them more desirable for positive tone (PT) applications. As used herein, the term DFL or the unexposed area film thickness loss is a measure of the film thickness loss after image-wise exposure to suitable actinic radiation and developing in a suitable developer. That is, the polymer compositions of this invention are cast into films, the film thicknesses before and after development in an unexposed region of the film are measured and reported as percent loss of the film thickness in areas of the film that was not exposed to the radiation. Generally, higher the percent of DFL, poorer the performance of the polymer composition, which means that the unexposed areas of the film are more susceptible to the developer and thus dissolves in the developer. In addition, the measured DFL also depends on the developed time employed. Generally, longer the develop time higher the DFL. Surprisingly, the compositions of this invention exhibit very low DFL in that the unexposed area of the film is not lost even at higher develop time. Accordingly, in some embodiments of this invention the DFL of the compositions may be less than about 20 percent; in some other embodiments DFL can be less than 25 percent; and in some other embodiments the DFL may be in the range of from about 0 percent to 30 percent. At the same time the develop time for the compositions of this invention can generally range from about 10 seconds to about 80 seconds; in some other embodiments the develop time can range from about 20 seconds to about 60 seconds; and in some other embodiments the develop time can range from about 30 seconds to about 40 seconds. In addition, advantageously it has also been found that the compositions of this invention exhibit excellent dissolution rate in the developing solvent, such as for example, aqueous based alkali developer, including tetramethylammonium hydroxide (TMAH), among other known aqueous developers. This can further be tailored based on the molar content of the free carboxylic acid group present in the maleic repeat units of formula (IIA) in the polymer. Generally, it has now been found that by judicious selection of the molar ratio of ring opened maleic anhydride repeat units it is now possible to control the dissolution rate of the composition of this invention to the desirable range. Furthermore, the compositions of this invention retain much needed lithographic resolution, photospeed and high degree of chemical resistance, among various other desirable properties. Advantageously, the compositions of this invention exhibit very high thermo-mechanical properties. Specifically, it has now been found that the films formed from the compositions of this invention exhibit excellent tensile properties as well as very high elongation to break (ETB). In addition, the compositions of this invention exhibit excellent photo imaging properties. The films can be readily formed from any of the known solvent casting methods as well as melt extrusion methods. For example, the composition of this invention can be coated onto a suitable substrate, such as for example, spin coating. The coated substrates are then baked to remove any residual solvents. Such post apply baking (PAB) temperatures can range from about 100° C. to 120° C. for a sufficient length of time from about 2 minutes to 10 minutes. In some embodiments such PAB temperature is at about 110° C. for about 3 minutes. The films so formed are then cured at a temperature in the range of from about 150° C. to 200° C. to form the cured films for a sufficient length of time ranging from about 2 hours to 6 hours under inert atmosphere, such as for example, nitrogen atmosphere. In some embodiments such curing is carried out at 170° C. for about 4 hours. In some embodiments such curing is carried out at 200° C. for about 2 hours. It is contemplated that during the curing step the latent base generator releases the base which facilitates the crosslinking of the polymer with epoxy crosslinking agents employed in the composition of this invention. The cured films can readily be lifted out of the substrates for mechanical property testing. The tensile strength of the so formed films are generally in the range from about 70 MPa to about 150 MPa depending upon the type of polymer employed and the type of latent base generator employed in the composition of this invention. In some embodiments the tensile strength is from about 80 MPa to about 120 MPa and in some other embodiments the tensile strength is from about 90 MPa to about 100 MPa. The ETB of the films are generally high as well. The ETB can range from about 15 percent to 50 percent or higher. In some embodiments the ETB ranges from about 20 percent to 45 percent, 25 percent to 40 percent, and so on. In general among other things, various compounds and additives as enumerated herein improve overall performance of the photosensitive composition of this invention thus providing well defined photo-patterned structures having a variety of utilities, including but not limited to chip-stack applications, redistribution layers (RDL) and for forming CMOS image sensor dam structures. Advantageously, it has also been found that certain of the additives as described herein may feature more than one function. For example, some of the additives as enumerated hereinabove may not only exhibit certain photosensitization activity during exposure to radiation but may also facilitate as a cross linking agent, for instance. Therefore, additives as used herein do not limit the activity of such compounds to only one of such property but may also facilitate other functions of the photosensitive compositions of this invention. The photosensitive composition embodiments, in accordance with the present invention, are first applied to a desired substrate to form a film. Such a substrate includes any appropriate substrate as is, or may be used for electrical, electronic or optoelectronic devices, for example, a semiconductor substrate, a ceramic substrate, a glass substrate. With regard to said application, any appropriate coating method can be employed, for example, spin coating, spraying, doctor blading, meniscus coating, ink jet coating and slot coating. Next, the coated substrate is heated to facilitate the removal of residual casting solvent, for example to a temperature from 70° C. to 130° C. for from 1 to 30 minutes, although other appropriate temperatures and times can be used. After the heating, the film is generally imagewise exposed to an appropriate wavelength of actinic radiation, wavelength is generally selected based on the
{'bibliographic_information': "{'country': 'US', 'doc-number': '16874982', 'kind': 'B2', 'date': '20200515', 'invention_title': 'Positive tone photosensitive compositions containing amic acid as latent base catalyst'}", 'source_file': './grant/2021/ipg210713.xml', 'source_data': 'USPTO-Grant'}