d46d3ef8_Banko___Patent_applications__Description
[Patent application number] 20120195008 [Published] 08-02-2012 [Description] 
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
Banko - Patent applications
Description