8bda3ad7_ics_made_by_Indium_Corporation__Challenges
[Soldering Process] Vacuum Soldering [Description] Reduction in pressure allows voids in solder to escape prior to reflow, creating much lower voiding in finished solder joint [Our Recommended Products] Solder Preforms (especially AuSn) Solder Spheres Indium8.9 Series Solder Paste SnAg, SnSb, and SnAgCu alloys NC-SMQ92H for Sn63 [Challenges] 
Batch process may be too slow for high volume manufacturing. Requires proper set up, design and material selection
Assembly Products for Medical Devices and Electronics made by Indium Corporation
Challenges