5ed4b506_CB_vs__MCM_c_Comparison_Matrix__1
[0] Bare chip assembly [2] Plated Cu PCB metallizations require special Au plating for compatibility with chip and wire assembly [3] Conventional thick-film Au metallizations are compatible with chip and wire assembly. Au thick-film conductors have demonstrated robustness in chip and wire processes [1] 
Chip and wire techniques are required to attach bare ICs. Board technology must allow reliable assembly
Appendix A: A PCB vs. MCM-c Comparison Matrix
1