Within weeks of Samsung releasing its waterproof Galaxy S5 last year , Apple filed a patent that took its rival ’ s technology a step further . Called ‘ Methods for shielding electronic components from moisture ’ , the filing awarded today describes a way of making the inside of a phone waterproof rather than the outside . Individual components would be covered in a thin film designed to stop liquids damaging the phone , even if it manages to penetrate the outer casing . The patent said protective cases have ‘ little value ’ once water has entered the phone and details a system of adding ‘ hydrophobic coating to components ’ . This coating would be applied using plasma-assisted chemical vapour deposition in which thin films are applied from a gas , or vapour , states to a solid state . Samsung ’ s Galaxy S5 is IP67 rated thanks to a hydrophobic coating and cover that clips into place to protect the handset . The firm also added a rubberized gasket behind the back cover and added a waterproof coating inside the headphone jack . IP stands for Ingress Protection , and was created by the International Electrotechnical Commission . It is used to classify how much a coating provides protection from 'intrusion or immersion ' . The rating is typically followed by two numbers - the first is the level of dust resistance , the second is water resistance . Dust resistance ranges from zero to six , and water resistance ranges from zero to nine . If an X is included , the device does n't offer a classified rating for that substance . A rating of seven on the waterproof scale means : 'Ingress of water in harmful quantity shall not be possible when the enclosure is immersed in water ( up to one metre ) . ' As a result , the S5 can be submerged for up to half an hour at around 3ft ( 0.9 metres ) . However its latest models , the S6 and S6 Edge , have removed this feature . Apple ’ s patent would instead involve coating individual components inside a phone , and within an already assembled circuit board . This coating would be applied using a method called plasma-assisted chemical vapour deposition ( PACVD ) , which desposits thin films from gas , or vapour , states to solid states . The plasma is typically created between two electrodes where reacting gases are added to form the solid . In the case of the fully-assembled circuit board and its electromagnetic interference ( EMI ) shields , Apple proposes perforating ‘ portions of the shields that overlay water sensitive electronics. ’ The coating would be applied through these perforations , and the board-to-board connectors would be covered by a silicone seal . The filing said : ‘ People who rely on electronic devices tend to carry them along to locations in which the electronic devices can incur damage . ‘ One form of damage that can be detrimental to an electronic device is water damage . Samsung ’ s S5 ( pictured ) is IP67 rated thanks to a hydrophobic coating and cover that clips into place to protect the handset . The firm also added a rubberized gasket behind the back cover and waterproof coating inside the headphone jack . As a result , the S5 can be submerged for up to 30 minutes at 3ft ( 0.9 metres ) In the case of the fully-assembled circuit boards and electromagnetic interference ( EMI ) shields , Apple proposes perforating ‘ portions of the shields that overlay water sensitive electronics. ’ The coating would be applied through these perforations , and the board-to-board connectors would be covered by a silicone seal . ‘ Many electronic devices are susceptible to water damage because they are not fully sealed and include various openings for charging , connecting peripherals , and inputting and outputting audio . ‘ While bulky cases have had a certain amount of success at mitigating water entry through the aforementioned openings , a protective case is of little or no value once water has entered a device housing . ‘ When water enters into the device housing , some high powered components and wiring are often subject to damage even when a minimal amount of water enters the electronic device . ‘ In particular , corrosion of soldered components is quite common and can lead to device failure. ’ Meanwhile the board-to-board connectors inside the phones ( components illustrated left ) would be covered by a silicone seal . Despite adding waterproof features to its Galaxy S5 , Samsung removed this for its latest Galaxy S6 and Galaxy S6 Edge handsets unviled at Mobile World Congress on Sunday ( right )
The patent was filed in the US in today and awarded March 2014 . It says protective cases have ‘ little value ’ once water has entered the phone . Files detail a system of adding ‘ hydrophobic coating to components ’ Coating would be applied via plasma assisted chemical vapour deposition . This involves depositing a thin film from a gas state to a solid . Apple proposes perforating circuit boards and applying the film inside . The technology could form part of the Apple ’ s iPhone 7 range . Rival Samsung ’ s Galaxy S5 is IP67 rated waterproof , but its Galaxy S6 isn ’ t .