bˌʌt ɪɾ ɪz nˈɛsᵻsɚɹi tə mˈɑːdəl ˈækjʊɹətli ðɪ ɪndˈʌktəns ænd kəpˈæsɪtəns ʌvðə pˈækɪdʒ ænd tʃˈɪp ænd ˈænɐlˌaɪz ðə ɡɹˈɪd wɪð sˈʌtʃ mˈɑːdəlz, æz ˈʌðɚwˌaɪz ðɪ ɐmˈaʊnt ʌv dᵻkˈʌplɪŋ təbi ˈædᵻd mˌaɪt biː ˌʌndɚɹˈɛstᵻmˌeɪɾᵻd ɔːɹ ˌoʊvɚɹˈɛstᵻmˌeɪɾᵻd.
But it is necessary to model accurately the inductance and capacitance of the package and chip and analyze the grid with such models, as otherwise the amount of decoupling to be added might be underestimated or overestimated.