ɪn ɐn ˈɛbpvd sˈɪstəm, ðə dˌɛpəzˈɪʃən tʃˈeɪmbɚ mˈʌst biː ɪvˈækjuːˌeɪɾᵻd tʊ ɐ pɹˈɛʃɚɹ ʌv æt lˈiːst sˈɛvən.fˈaɪv tˈoːɹ tˈɛn mˈaɪnəs tˈuː pˈɑː tʊ ɐlˈaʊ pˈæsɪdʒ ʌv ᵻlˈɛktɹɑːnz fɹʌmðɪ ᵻlˈɛktɹɑːn ɡˈʌn tə ðɪ ɪvˌæpɚɹˈeɪʃən mətˈɪɹiəl, wˌɪtʃ kæn biː ɪnðə fˈɔːɹm əvən ˈɪŋɡət ɔːɹ ɹˈɑːd.
In an EBPVD system, the deposition chamber must be evacuated to a pressure of at least 7.5 Torr (10−2 Pa) to allow passage of electrons from the electron gun to the evaporation material, which can be in the form of an ingot or rod.