ᵻlˈɛktɹɑːnbˈiːm fˈɪzɪkəl vˈeɪpɚ dˌɛpəzˈɪʃən, haʊˈɛvɚ, jˈiːldz ɐ hˈaɪ dˌɛpəzˈɪʃən ɹˈeɪt fɹʌm zˈiəɹoʊ.wˈʌn tə wˈʌnhˈʌndɹɪd mjˈuːm slˈæʃ mˈɪn æt ɹˈɛlətˌɪvli lˈoʊ sˈʌbstɹeɪt tˈɛmpɹɪtʃɚz, wɪð vˈɛɹi hˈaɪ mətˈɪɹiəl jˌuːɾɪlᵻzˈeɪʃən ɪfˈɪʃənsi.
Electron-beam physical vapor deposition, however, yields a high deposition rate from 0.1 to 100 μm/min at relatively low substrate temperatures, with very high material utilization efficiency.