ðə pˈækɪdʒ səplˈaɪz kˈɜːɹənts tə ðə pˈædz ʌvðə pˈaʊɚ ɡɹˈɪd ˈiːðɚ baɪ mˈiːnz ʌv pˈækɪdʒ lˈiːdz ɪn wˈaɪɚbˈɑːnd tʃˈɪps ɔːɹ θɹuː sˈiː fˈoːɹ bˈʌmp ɚɹˈeɪz ɪn flˈɪp tʃˈɪp tɛknˈɑːlədʒi.
The package supplies currents to the pads of the power grid either by means of package leads in wire-bond chips or through C4 bump arrays in flip chip technology.