Wafer-level packaging is implemented before wafer dicing, as shown in Fig. 3(a), and is based on anodic, metal diffusion, metal eutectic, glass frit, polymer adhesive, and silicon fusion wafer bonding.
Single-chip packaging, as shown in Fig. 3(b), is implemented after wafer dicing, using pre-fabricated ceramic or organic packages, such as LCP injection molded packages or LTCC packages.