text{coth}(\frac{\varepsilon}{2k_B T_{bath}})(f_E-f_{E+\varepsilon})-f_Ef_{E+\varepsilon}+1],
\label{eph}\end{aligned}$$ where $f_E(T_1)=\text{tanh}(E/2k_B T_1)$, $M_{E,E'}(T_1)=\mathcal{N}_1(E,T_1)\mathcal{N}_1(E',T_1)[1-\Delta_1^2(T_1)/EE']$, $\Sigma_{S_1}$ is the electron-phonon coupling constant, and $\mathcal{V}_{S_1}$ is the volume of S$_1$. As a set of parameters representative for a realistic microstructure we choose $R_t=2\,\text{k}\Omega$, $R_J=500\,\Omega$, $\mathcal{V}_{dr}=10^{-20}$ m$^{-3}$, $\Sigma_{dr}=3\times 10^9$ WK$^{-5}$m$^{-3}$ (typical of Cu) [@Giazotto2006], $\mathcal{V}_{S_1}=10^{-18}$ m$^{-3}$, $\Sigma_{S_1}=3\times 10^8$ WK$^{-5}$m$^{-3}$ and $\Delta_1(0)=\Delta_2(0)=200\,\mu$eV, the last two parameters typical of aluminum (Al) [@Giazotto2006]. Finally, our thermal model neglects both heat exchange with photons, owing to poor matching impedance [@schmidt; @Meschke2006], and pure phononic heat conduction [@Maki1965; @giazottoexp2012].

![(Color online) (a) Drain temperature $T_{dr}$ vs $\Phi$ calculated at $T_{bath}=250$ mK for several values of source temperature $T_{src}$ for a structure based on a *rectangular* Josephson junction. (b) Flux-to temperature transfer function $\mathcal{T}$ vs $\Phi$ calculated at 250 mK for a few selected values of $T_{src}$. (c) $T_{dr}$ vs $\Phi$ calculated for a few values of $T_{bath}$ at $T_{src}=1$ K. (d) $\mathcal{T}$ vs $\Phi$ at a few selected $T_{bath
text{coth}(\frac{\varepsilon}{2k_B T_{bath}})(f_E - f_{E+\varepsilon})-f_Ef_{E+\varepsilon}+1 ], 
 \label{eph}\end{aligned}$$ where $ f_E(T_1)=\text{tanh}(E/2k_B T_1)$, $ M_{E, E'}(T_1)=\mathcal{N}_1(E, T_1)\mathcal{N}_1(E',T_1)[1-\Delta_1 ^ 2(T_1)/EE']$, $ \Sigma_{S_1}$ is the electron - phonon coupling constant, and $ \mathcal{V}_{S_1}$ is the volume of S$_1$. As a set of argument example for a realistic microstructure we choose $ R_t=2\,\text{k}\Omega$, $ R_J=500\,\Omega$, $ \mathcal{V}_{dr}=10^{-20}$ m$^{-3}$, $ \Sigma_{dr}=3\times 10 ^ 9 $ WK$^{-5}$m$^{-3}$ (typical of Cu) [ @Giazotto2006 ], $ \mathcal{V}_{S_1}=10^{-18}$ m$^{-3}$, $ \Sigma_{S_1}=3\times 10 ^ 8 $ WK$^{-5}$m$^{-3}$ and $ \Delta_1(0)=\Delta_2(0)=200\,\mu$eV, the last two parameter typical of aluminum (Al) [ @Giazotto2006 ]. Finally, our thermal mannequin neglect both heat central with photons, owing to inadequate matching impedance [ @schmidt; @Meschke2006 ], and pure phononic estrus conduction [ @Maki1965; @giazottoexp2012 ]. 

! [ (Color online) (a) Drain temperature $ T_{dr}$ vs $ \Phi$ forecast at $ T_{bath}=250 $ mK for several value of source temperature $ T_{src}$ for a structure establish on a * rectangular * Josephson junction. (b) Flux - to temperature transfer routine $ \mathcal{T}$ vs $ \Phi$ calculated at 250 mK for a few selected values of $ T_{src}$. (c) $ T_{dr}$ vs $ \Phi$ calculate for a few values of $ T_{bath}$ at $ T_{src}=1 $ K. (d) $ \mathcal{T}$ vs $ \Phi$ at a few selected $ T_{bath
texh{coth}(\frac{\varepsilon}{2k_B T_{bxth}})(f_E-f_{E+\varepsilon})-f_Ef_{E+\verepsilkn}+1],
\label{eoh}\end{aligned}$$ where $f_E(T_1)=\text{taih}(E/2k_V T_1)$, $M_{T,V'}(T_1)=\mathcal{N}_1(E,T_1)\mathcal{N}_1(E',G_1)[1-\Delta_1^2(T_1)/EE']$, $\Sigma_{S_1}$ us tie electron-phonoi coupliky conabant, cnv $\mathcal{V}_{S_1}$ is jhe volume ox S$_1$. As a set ox oaxameters representative for a realiseic mictodtructure we croost $R_e=2\,\texf{k}\Omega$, $R_J=500\,\Omega$, $\mathcal{V}_{dr}=10^{-20}$ m$^{-3}$, $\Sigma_{sr}=3\times 10^9$ WK$^{-5}$m$^{-3}$ (typical of Cu) [@Giazotto2006], $\mathcal{V}_{S_1}=10^{-18}$ l$^{-3}$, $\Sihma_{S_1}=3\times 10^8$ WK$^{-5}$m$^{-3}$ and $\Delta_1(0)=\Delta_2(0)=200\,\nu$eV, rhe last two parameters typical of aluminum (Al) [@Giazotto2006]. Finally, ojr thzrmal model nwglfwts both heet excrange with pmptons, mwing tp poor matchinn impxdanxe [@schmidt; @Meschke2006], anv pure phononic heat conductimn [@Maki1965; @giazottoexp2012].

![(Xooor otlina) (a) Aeaiv ttmpxrafure $T_{fr}$ ts $\Phi$ calchlated at $T_{vath}=250$ mK for several vwoues of sourcs tempqrwture $T_{src}$ for a structure based on a *rtctanfular* Josephson junctiob. (b) Flux-to temperaturg transfer function $\mathcal{T}$ vs $\Phi$ calculated at 250 mK for a few adleebcd vxoufs of $T_{src}$. (c) $T_{dr}$ vs $\Phi$ calculated for a few dzliex of $T_{bath}$ at $B_{src}=1$ K. (d) $\mathcal{T}$ fs $\Pny$ at a few seuected $T_{bzth
text{coth}(\frac{\varepsilon}{2k_B T_{bath}})(f_E-f_{E+\varepsilon})-f_Ef_{E+\varepsilon}+1], \label{eph}\end{aligned}$$ where $f_E(T_1)=\text{tanh}(E/2k_B T_1)$, $M_{E,E'}(T_1)=\mathcal{N}_1(E,T_1)\mathcal{N}_1(E',T_1)[1-\Delta_1^2(T_1)/EE']$, the coupling constant, $\mathcal{V}_{S_1}$ is the set parameters representative for realistic microstructure we $R_t=2\,\text{k}\Omega$, $R_J=500\,\Omega$, $\mathcal{V}_{dr}=10^{-20}$ m$^{-3}$, $\Sigma_{dr}=3\times 10^9$ (typical of Cu) [@Giazotto2006], $\mathcal{V}_{S_1}=10^{-18}$ m$^{-3}$, $\Sigma_{S_1}=3\times 10^8$ WK$^{-5}$m$^{-3}$ and $\Delta_1(0)=\Delta_2(0)=200\,\mu$eV, the last parameters typical of aluminum (Al) [@Giazotto2006]. Finally, our thermal model neglects both heat with owing poor impedance [@schmidt; @Meschke2006], and pure phononic heat conduction [@Maki1965; @giazottoexp2012]. ![(Color online) (a) Drain temperature $T_{dr}$ $\Phi$ calculated at $T_{bath}=250$ mK for several values source temperature $T_{src}$ for structure based on a *rectangular* junction. Flux-to temperature function vs calculated at 250 for a few selected values of $T_{src}$. (c) $T_{dr}$ vs $\Phi$ calculated for a few values of at $T_{src}=1$ $\mathcal{T}$ vs at few $T_{bath
text{coth}(\frac{\varepsilon}{2k_B T_{Bath}})(f_E-f_{E+\vaRepsiLon})-F_Ef_{e+\vArepSiloN}+1],
\label{eph}\end{alIGned}$$ Where $f_E(T_1)=\text{tanh}(E/2k_B T_1)$, $M_{E,e'}(T_1)=\matHcAL{N}_1(E,T_1)\MAtHcal{N}_1(e',T_1)[1-\Delta_1^2(t_1)/eE']$, $\sIGma_{s_1}$ iS tHe eLeCTrOn-phoNon CouplinG constant, aNd $\mAtHcal{V}_{S_1}$ is the vOLuMe of S$_1$. As a seT of Parameters rePreSentatIvE foR A realIstIc micRostruCTure we Choose $R_t=2\,\tExT{K}\Omega$, $r_j=500\,\Omega$, $\mATHcAl{V}_{dR}=10^{-20}$ m$^{-3}$, $\Sigma_{dr}=3\times 10^9$ WK$^{-5}$m$^{-3}$ (TYpICal of Cu) [@GiazottO2006], $\mathcAl{v}_{s_1}=10^{-18}$ m$^{-3}$, $\sIGma_{s_1}=3\tiMes 10^8$ WK$^{-5}$m$^{-3}$ and $\DElTa_1(0)=\DelTA_2(0)=200\,\mu$eV, thE LaST TWo pARameters typicAl of aluminuM (al) [@GIazottO2006]. FInaLLy, our tHermaL mODel Neglects botH heaT exchange With phOTons, owiNG to poor MatchiNg iMpeDancE [@ScHmIdt; @meSChkE2006], AnD puRE phOnonic heAt CoNductIon [@MAKI1965; @GIazoTtoExp2012].

![(COlor oNline) (a) Drain teMpeRatuRE $T_{dR}$ vs $\PhI$ calcUlatEd At $T_{baTh}=250$ mK foR seveRaL values of source TempErature $T_{sRc}$ fOr A stRuCture BAsed on A *reCtaNgular* JOsephsoN JunCtION. (B) FLux-to temperature trAnSFEr Function $\MathcaL{t}$ vS $\PHI$ calculaTeD at 250 MK foR A Few seLectED vAlues of $T_{Src}$. (c) $T_{dR}$ Vs $\phI$ calculAtEd for a FeW vaLueS of $T_{bATh}$ at $t_{src}=1$ K. (d) $\Mathcal{T}$ Vs $\Phi$ AT a few selected $T_{BAth
text{coth}(\frac{\varepsil on}{2k_B T _{bat h}} )(f _E -f_{ E+\v arepsilon})-f_ E f_{E +\varepsilon}+1],
\lab el{ep h} \ end{ a li gned} $$ wher e  $ f _ E(T _1 )= \te xt { ta nh}(E /2k _B T_1) $, $M_{E,E '}( T_ 1)=\mathcal{ N }_ 1(E,T_1)\m ath cal{N}_1(E', T_1 )[1-\D el ta_ 1 ^2(T_ 1)/ EE']$ , $\Si g ma_{S_ 1}$ is th ee lectro n -phonon c ou plin g constant, and $ \ ma t hcal{V}_{S_1}$  is th ev ol u m e o f S $_1$. As a  s et of paramet e rs r e pre s entative fora realistic mic rostru ct ure we cho ose $ R_ t =2\ ,\text{k}\O mega $, $R_J=5 00\,\O m ega$, $ \ mathcal {V}_{d r}= 10^ {-20 } $m$ ^{- 3} $ , $ \ Si gma _ {dr }=3\time s10 ^9$ W K$^{ - 5 } $ m$^{ -3} $ (t ypica l of Cu) [@Gi azo tto2 0 06] , $\m athca l{V} _{ S_1}= 10^{-1 8}$ m $^ {-3}$, $\Sigma_ {S_1 }=3\times  10 ^8 $ W K$ ^{-5} $ m$^{-3 }$and  $\Delt a_1(0)= \ Del ta _ 2 ( 0) =200\,\mu$eV, thela s t  t wo param eterst yp ic a l of alu mi num  (Al ) [@Gia zott o 20 06]. Fin ally,o ur  t hermalmo del ne gl ect s b oth h e at e xchang e with p hoton s , owing to poo r  matching imp e da n c e[ @sch mid t; @Meschke 2006 ] , an d pu r epho n onicheatco n du c tion [@Maki1965; @g ia zottoe xp201 2].

![(Color  online) ( a ) Drain te mper a tu r e $T_{dr}$ vs$\Phi $ calculat e d at $T_ {bath }=250$ m K for sev e r al value s o f s our cet e mp erature $T_{s r c }$ f or  a stru ctu re base d o n a  *r ect an gular* Jo sephsonju nc ti on . ( b) Fl u x-to tem pe rat ur e t ransf e r func tion$\ma th ca l {T} $ vs $\ P hi $ calc ul at ed a t 2 50  mK f or a few  select ed values  of $T_{ sr c} $. (c)$T_{dr}$ vs $ \P hi$ calcul at edfor af e w values  of $T_{bath}$ at $T_{s r c}=1$ K . ( d) $\ math cal{T}$ v s $ \Phi$ata  few s electe d $T_ {b ath 
text{coth}(\frac{\varepsilon}{2k_B T_{bath}})(f_E-f_{E+\varepsilon})-f_Ef_{E+\varepsilon}+1],
\label{eph}\end{aligned}$$_where $f_E(T_1)=\text{tanh}(E/2k_B_T_1)$, $M_{E,E'}(T_1)=\mathcal{N}_1(E,T_1)\mathcal{N}_1(E',T_1)[1-\Delta_1^2(T_1)/EE']$, $\Sigma_{S_1}$ is_the electron-phonon_coupling_constant, and_$\mathcal{V}_{S_1}$_is the volume_of S$_1$. As_a set of parameters_representative for a_realistic_microstructure we choose $R_t=2\,\text{k}\Omega$, $R_J=500\,\Omega$, $\mathcal{V}_{dr}=10^{-20}$ m$^{-3}$, $\Sigma_{dr}=3\times 10^9$ WK$^{-5}$m$^{-3}$ (typical of Cu) [@Giazotto2006],_$\mathcal{V}_{S_1}=10^{-18}$_m$^{-3}$, $\Sigma_{S_1}=3\times_10^8$_WK$^{-5}$m$^{-3}$_and $\Delta_1(0)=\Delta_2(0)=200\,\mu$eV, the last two_parameters typical of aluminum (Al)_[@Giazotto2006]. Finally,_our thermal model neglects both heat exchange with_photons,_owing to poor_matching impedance [@schmidt; @Meschke2006], and pure phononic heat conduction_[@Maki1965; @giazottoexp2012].

![(Color online) (a) Drain temperature_$T_{dr}$ vs $\Phi$_calculated_at_$T_{bath}=250$ mK for several_values of source temperature $T_{src}$ for_a structure based on a *rectangular*_Josephson junction. (b) Flux-to temperature transfer function_$\mathcal{T}$ vs $\Phi$ calculated at 250_mK for a few selected_values of_$T_{src}$. (c) $T_{dr}$ vs $\Phi$_calculated for a_few values_of $T_{bath}$ at_$T_{src}=1$ K. (d) $\mathcal{T}$ vs $\Phi$_at a few_selected $T_{bath