 residual stress between the chip and the first resin. Meanwhile, the thermal expansion coefficient of the second resin in contact with the end portions of the chip is set at a low value, so as to prevent a concentration of stress strain caused by thermal stress.
Japanese Laid-Open Patent Publication No. 08-195414 also discloses that, in this structure, the residual stress between the chip and the first resin can be made smaller, and detachment of the chip due to the residual stress can be restrained. Also, it is possible to prevent cracks and the like caused by a concentration of stress at the end faces of the chip due to the difference in thermal expansion coefficient.
Japanese Laid-Open Patent Publication No. 08-195414 also discloses that the amount of the inorganic filler contained in the second resin placed outside the bumps should be made larger than that in the first resin. By doing so, the moisture penetration path can be blocked, and the reliability in terms of moisture resistance is improved. Japanese Laid-Open Patent Publication No. 08-195414 further discloses that only the particle size of the inorganic filler of the first resin placed inside the bumps should be made smaller. By doing so, breaking of the chip can be restrained while the moisture blocking effect is maintained, and the injection performance of the resin can be improved. Photovoltaic power generation is considered as an alternative for conventional power generation, for example from fossil fuels and nuclear energy. It is particularly vied for its minimal environmental impact as a ‘clean energy’ source. Photovoltaic power is generated in a photovoltaic device, popularly known as a solar cell. In order for photovoltaic power generation to be viable as a future source, reliability and cost of photovoltaic energy conversion must be comparable with the conventional power generation sources. Currently available technologies, especially the low cost photovoltaic energy conversion devices are lagging significantly, in both these areas.
Typically, a photovoltaic energy conversion apparatus comprises a plurality of photovoltaic devices arranged in modules, wherein one or more modules are connected together in a support structure, depending upon power requirement for a given application. A major fraction of cost of generating photovoltaic power lies in manufacturing photovoltaic devices and modules. Therefore, in order to lower the cost of photovoltaic power generation, it is imperative to reduce the cost of photovoltaic devices.
Basic principles of photovoltaic energy conversion can be described in reference with FIG. 1A
residual stress between the chip and the first resin. Meanwhile, the thermal expansion coefficient of the second resin in contact with the goal parcel of the chip is set at a low value, so as to prevent a assiduity of stress strain caused by thermal tension. 
 Japanese Laid - Open Patent Publication No. 08 - 195414 besides discloses that, in this structure, the residual stress between the chip and the first resin can be take smaller, and detachment of the check due to the residual tension can be restrained. Also, it is potential to prevent cracks and the alike cause by a concentration of stress at the end face of the chip due to the difference in thermal expansion coefficient. 
 Japanese Laid - Open Patent Publication No. 08 - 195414 also discloses that the sum of the inorganic filler contained in the second resin placed outside the bumps should be made large than that in the first resin. By doing so, the moisture penetration path can be blocked, and the reliability in terms of moisture resistance is improved. Japanese Laid - Open Patent Publication No. 08 - 195414 further discloses that only the particle size of the inorganic filler of the first resin placed inside the bumps should be made modest. By doing so, break of the bit can be restrained while the moisture blocking effect is keep, and the injection performance of the resin can be improved. Photovoltaic power generation is regard as an alternative for conventional power generation, for example from fossil fuels and nuclear department of energy. It is particularly vied for its minimal environmental impact as a ‘ clean energy ’ source. Photovoltaic power is generate in a photovoltaic device, popularly known as a solar cell. In order for photovoltaic power generation to be feasible as a future source, reliability and cost of photovoltaic energy conversion must be comparable with the conventional power generation sources. Currently available engineering, especially the depleted cost photovoltaic department of energy conversion devices are lagging significantly, in both these areas. 
 Typically, a photovoltaic department of energy conversion apparatus comprises a plurality of photovoltaic device arranged in modules, wherein one or more module are connected in concert in a support structure, depending upon office requirement for a given application. A major fraction of cost of generating photovoltaic ability lies in manufacturing photovoltaic device and modules. Therefore, in order to lower the cost of photovoltaic power genesis, it is imperative to reduce the cost of photovoltaic devices. 
 Basic principles of photovoltaic energy conversion can be described in mention with FIG. 1A
 redidual stress between tht chip and the fitsr resii. Meanwgile, the thermal expansion coefficieit od the second resin in contazt with tje end pirtiibs of the rgip is set at w loc talue, so as to krevent a cotcentration of sgrzss strain caused by thermal stress.
Jwpanese Lwid-Open Patent Pubkycatjon No. 08-195414 also discloses that, in thia strucuure, the residual xtress between the chip anf thf first resin can he made smaoler, qnd detachmevt of the bkip due to jhe residual stress can be restrxined. Also, it iw posdhble to pretent cgacks and the like cagsed by a concentratipn mf wtress at the end facxs of the chip due tj the difxexence in thermal expabsuon cmeffhcievr.
Jaoantse Lzid-Opej Petent Publidation No. 08-195414 qlso discloses that trv amount of tge inowgwnic filler contained in the second respn pmaced outside the bumps should be made larget than thae in the first resin. By doing so, the moisture penatratmov pcbm cav bf blocked, and the reliability in terms of moiffute resistance is improved. Jspwnrfe Laid-Open Pxtent 'hbmication No. 08-195414 furthfr discjoses that onlr thr particle size of the inortanic filler if the first resin placed insnde thg bumpx should be made smallex. By dking so, brewking of ffe chip can be rdstgainad while the moisture bloching effert is maintakned, and tre injectiln pevxormance of the redin ccn be improved. Ohotovoltaic power generation is considered ax dn dlternatnve fov conventional [ower generatipn, for zxampld from fosail fuens and nuclqar energy. It ls particulacly vied sor uts ninimal dnvironmental ompact as a ‘clean ebergy’ source. Photoyoltakd power is genexcttd in a photovolyaiz dqvpce, pj[ularly knowt as a rplar zell. In ordcr wor lhotovoltaic power ganerztion to be viable af a futute source, reliability snd cost of photovlltair enerjy conferfion must be comparable with tge convenhiokal power genqratlon fources. Cuxrently available technologies, especiallb the low cost photovolraic energy conversnok devices arx laggyng signixicantly, in both thewe areas.
Typically, a photovoltaic energg convarsioj apparatus comprises a plurality of photovoltaic devices arranged in modyles, wiewein one or morr modllef are cjnnertxd together in a xupport structure, depending upoi power rexunrement for a given applicatipn. A major fracjion of cost of generating photovoktaic power lies in manufacturimg photovoltaic devices snd moduoes. Tgerefogg, ii order to lower the cost mf phitovoltqic iower generatiun, ot is imperwtivt to reduce the cost of photovoltaic devicws.
Hasic principles of photovopuaic engrgy condersion can be dsscrjhed iv reference woth FIG. 1A
residual stress between the chip and the Meanwhile, thermal expansion of the second end of the chip set at a value, so as to prevent a of stress strain caused by thermal stress. Japanese Laid-Open Patent Publication No. 08-195414 discloses that, in this structure, the residual stress between the chip and the resin be smaller, detachment of the chip due to the residual stress can be restrained. Also, it is possible prevent cracks and the like caused by a of stress at the faces of the chip due the in thermal coefficient. Laid-Open Publication No. 08-195414 discloses that the amount of the inorganic filler contained in the second resin placed outside the bumps be made that in first By so, the moisture can be blocked, and the reliability moisture resistance is improved. Japanese Laid-Open Patent Publication 08-195414 further that only the particle size of inorganic filler of the first resin placed inside bumps should be made smaller. By doing so, breaking of the chip can be restrained moisture blocking effect is and the injection of resin be Photovoltaic power is considered as an alternative for conventional power generation, for example fossil fuels and nuclear energy. It is particularly vied for environmental as a ‘clean source. Photovoltaic power is in photovoltaic device, popularly known solar In power to viable as a future reliability and cost of photovoltaic conversion must be comparable sources. Currently available technologies, especially the low cost energy conversion devices are lagging significantly, in these areas. Typically, a photovoltaic energy conversion apparatus comprises a plurality of devices arranged wherein one or more modules are connected together a support structure, depending power requirement for a given application. A major fraction cost generating photovoltaic lies in manufacturing devices and modules. in order to cost of power it reduce the cost of photovoltaic devices. principles photovoltaic energy conversion can be in FIG. 1A
 residual stress between the cHip and the fIrst rEsiN. MeAnWhilE, the Thermal expansiON coeFficient of the second resIn in cOnTAct wITh The enD portioNS oF THe cHiP iS seT aT A lOw valUe, sO as to prEvent a concEntRaTion of stress STrAin caused bY thErmal stress.
JApaNese LaId-opeN patenT PuBlicaTion No. 08-195414 ALso disCloses thaT, iN This stRUcture, tHE ReSiduAl stress between thE ChIP and the first reSin can Be MAdE SMalLer, And detachmEnT of thE Chip due TO tHE REsiDUal stress can bE restrained. aLso, It is poSsIblE To prevEnt crAcKS anD the like cauSed bY a concentRation OF stress AT the end Faces oF thE chIp duE To ThE diFfERenCE iN thERmaL expansiOn CoEfficIent.
jAPANese laiD-OpeN PateNt Publication no. 08-195414 aLso dISclOses tHat thE amoUnT of thE inorgAnic fIlLer contained in tHe seCond resin PlaCeD ouTsIde thE Bumps sHouLd bE made laRger thaN ThaT iN THE fIrst resin. By doing so, ThE MOiSture penEtratiON pAtH Can be bloCkEd, aNd thE REliabIlitY In Terms of mOisturE ReSiStance iS iMproveD. JApaNesE Laid-oPen PAtent PUblicatiOn No. 08-195414 fURther discloses THat only the parTIcLE SiZE of tHe iNorganic filLer oF The fIrst REsIn pLAced iNside ThE BuMPs should be made smallEr. by doinG so, brEaking of the chIp can be resTRAIned whilE the MOiSTure blocking efFect iS maintaineD, And the inJectiOn perforMance of thE REsin can bE imProVed. phoTOVoLtaic power genERAtioN iS considEreD as an alTerNatIve For CoNventionaL power geNeRaTiOn, For ExampLE from fosSiL fuElS anD nuclEAr enerGy. It iS parTiCuLArlY vied foR ItS MInimAl EnViroNmeNtAl impAct aS A ‘clEan enerGy’ source. PHotOVoltAiC pOwer is gEnerated in a phOtOvoltaic deViCe, pOpularLY Known as a Solar cell. In order for photOVoltaic PowEr genEratIon to be viAblE as a fuTurE Source, ReliabIlity AnD coST Of phoTOVoLtaIc Energy convERSioN must Be CompArable wIth the conventional POweR generation soUrcEs. CuRREnTly AVaILabLe TEchNOLogies, especiallY the low cosT pHOtOvoltaic enERgy CoNversioN deviceS are lAGging siGnificantLy, in both tHeSe arEAS.
TyPically, a phOtovoltaIc energy cONversIOn ApparAtuS comprIsEs a PluraLity of PHotOvoltAic devIcEs arraNged iN mOdules, whErein one or more modules arE conneCted tOgeTher in a suPpoRT stRucture, dePendIng upon powEr rEquIremeNt fOR a givEn apPLiCatIOn. A maJor fRAction of cOSt Of gENErAting photovOLTAic Power LieS In manuFactUring photovoltaic DEvices and modulEs. ThEREfoRe, iN OrdeR tO lower the cost oF phOtOVOltaic poWeR generation, It is impeRaTIve to Reduce The cosT of photOVOlTAic devIces.
basIc principLes Of PHotovolTaIc ENergy cOnveRsIon can Be descRIbed IN Reference with FIG. 1a
 residual stress between t he chip an d the  fi rst  r esin . Me anwhile, the t h erma l expansion coefficien t ofth e  sec o nd  resi n in co n ta c t  wi th  t heen d  p ortio nsof thechip is se t a ta low value, so  as to pre ven t a concentr ati on ofst res s  stra incause d by t h ermalstress.
J ap a nese L a id-Open P at entPublication No. 0 8 -1 9 5414 also disc losesth a t, i n t his  structure ,the r e siduals tr e s s  be t ween the chip  and the fi r stresinca n b e  madesmall er ,  an d detachmen t of  the chip  due t o  the re s idual s tresscan  be  res t ra in ed.  A l so, it  is pos sible to  p re ventcrac k s a nd t helike  caus ed by a conce ntr atio n  of  stre ss at  the  e nd fa ces of  thech ip due to the d iffe rence inthe rm alex pansi o n coef fic ien t.
Japa nese La i d-O pe n P at ent Publication No .0 8 -1 95414 al so dis c lo se s  that th eamo unto f  theinor g an ic fille r cont a in ed  in the  s econdre sin  pl acedo utsi de the  bumps s hould be made larger than that int he f ir s t re sin . By doingso,t he m oist u re  pe n etrat ion p at h  c a n be blocked, and t he  relia bilit y in terms of  moisturer e s istanceis i m pr o ved. JapaneseLaid- Open Paten t  Publica tionNo. 08-1 95414 fur t h er discl ose s t hat  on l y  t he particle s i z e of  t he inor gan ic fill erofthe  fi rs t resin p laced in si de  t he  bu mps s h ould bema desm all er. B y  doing  so,brea ki ng ofthe chi p  c a n  bere st rain edwh ile t he m o ist ure blo cking eff ect is m ai nt ained,and the injec ti on perform an ceof the r esin can  be improved. Photovolt a ic powe r g enera tion  is consi der ed asana lterna tive f or co nv ent i o nal p o w er  ge ne ration, fo r exa mplefr om f ossil f uels and nuclear e n erg y. It is part icu larl y vi edf or its  m i nim a l  environmentalimpact asa‘ cl ean energy ’  so ur ce. Pho tovolta ic po w er is g eneratedin a phot ov olta i c  de vice, popu larly kn own as as olarc el l. In  or der fo rpho tovol taic p o wer  gene ration  t o be v iable  a s a futu re source, reliabilityand co st of  ph otovoltai c e n erg y convers ionmust be co mpa rab le wi tht he co nven t io nal power  gen e ration so u rc es. C ur rently avai l a b letechn olo g ies, e spec ially the low cos t  photovoltaicener g y  co nve r sion  d evices are lag gin gs i gnifican tl y, in boththese ar ea s .
Typ ically , a ph otovolt a i ce nergyconv ers ion appar atu sc omprise sap lurali ty o fphotov oltaic devi c e s arranged in mo dules , where i n o ne or  m ore mod u lesare connec ted togethe r in a  sup portstructu re , depe ndi ng  upon powe r  requirem ent f or a gi ve n ap pli cation . Am a jor f ract io n o f cost of g en e ra ti n g p hoto volta ic  pow er lies i n  manufac tur i ng phot ov olt a i c devi c es a nd modules . T heref o r e, in orde r  tol ow e r the  costof pho tovolta i c p ow er gene rat i o n, it isimperativ e  to  r educ e the co st  ofph oto vo ltaic devices.Basic pr inciples o f phot ovo l taic energy  c onversion ca n bede s cribedi n  re ference wit h F IG.  1A
 residual_stress between_the chip and the_first resin._Meanwhile,_the thermal_expansion_coefficient of the_second resin in_contact with the end_portions of the_chip_is set at a low value, so as to prevent a concentration of stress_strain_caused by_thermal_stress.
Japanese_Laid-Open Patent Publication No. 08-195414_also discloses that, in this_structure, the_residual stress between the chip and the first_resin_can be made_smaller, and detachment of the chip due to the_residual stress can be restrained. Also,_it is possible_to_prevent_cracks and the like_caused by a concentration of stress_at the end faces of the_chip due to the difference in thermal_expansion coefficient.
Japanese Laid-Open Patent Publication No._08-195414 also discloses that the_amount of_the inorganic filler contained in_the second resin_placed outside_the bumps should_be made larger than that in_the first resin._By doing so, the moisture penetration_path_can be blocked,_and_the_reliability in_terms of moisture_resistance_is improved._Japanese_Laid-Open Patent Publication No. 08-195414 further_discloses_that only the particle size of the_inorganic filler of the_first_resin placed inside the_bumps should be made smaller._By doing so, breaking of the_chip can_be restrained_while the moisture blocking effect is maintained, and the injection performance_of the resin can be improved._Photovoltaic power generation is_considered as_an_alternative for conventional_power_generation, for_example from fossil fuels and nuclear energy._It is_particularly vied for its minimal environmental_impact as a ‘clean_energy’_source. Photovoltaic power is generated in_a photovoltaic device, popularly known as_a solar cell. In order_for_photovoltaic_power generation to be viable_as a future source, reliability and_cost of photovoltaic_energy conversion must be comparable with the_conventional_power generation sources. Currently available technologies,_especially_the low cost photovoltaic energy conversion_devices_are_lagging significantly, in both these_areas.
Typically, a photovoltaic energy conversion apparatus_comprises a plurality of photovoltaic devices arranged in modules,_wherein one or_more modules are connected together_in_a_support structure, depending upon power requirement for a given application._A major_fraction of cost_of generating photovoltaic power lies in manufacturing photovoltaic devices and_modules. Therefore, in order to lower the_cost of photovoltaic power generation, it is imperative to reduce the_cost of photovoltaic devices.
Basic principles of photovoltaic energy_conversion can be described in reference with_FIG. 1A