 structures are mounted on different faces of the base or insulator, production engineering advantages result due to the provision of the interdigital structure, the sensor element, and the heater element on the same face of the base or insulator. However, heat distribution is not uniform because the resistive heater element surrounds the interdigital structures. Very frequently this causes sensor behavior that is too non-specific, rendering it difficult or sometimes impossible to reliably control corresponding concentrations of measured gas values. Another disadvantage of this arrangement is that, given a required minimum surface area of the sensor element, the space needed on the base is greater than this minimum surface area and requires that the sensor unit be relatively large. 1. Field of the Invention
This invention relates to mass spectrometry systems. In recent years there has arisen a need to analyze small sample volumes. This need arises, for example, where there is only a limited quantity of a unique sample, the sample being distributed in a particulate or other form in a matrix. Thus modern materials analysis problems require a spatial resolution over the sample region of 1 micron or less, together with the ability to find the specific locations of the sample in the matrix prior to analysis.
2. Description of the Prior Art
Most known magnetic sector or quadrupole mass spectrometry systems do not include means for lateral imaging of the sample surface combined with precise means of sample manipulation controlled through the image. Those that do, consume significant amounts of sample material in the process thus destroying the areas from which detailed information is sought. Such a card is known from the prior EP 163880 (GAO Ges.), in which the weakening is arranged on the outside of the perimeter of the cavity in which the integrated circuit is arranged and within the overall thickness of the card. This solution is particularly suitable in the case of cards having three layers which are laminated together.
So-called "vignettes" are also known from the French Patent Application FR-A-2 617 668, filed Mar. 7, 1987. Retention and use of these cards imply mechanical stresses applied to the support of the card, which is flexible or semi-flexible, which stresses are retransmitted to the vignette and to the circuit which it carries.
The reliability of the integrated circuit cards of all types bears a direct relation to their capacity to resist the repeated application of such stresses without an adverse effect on its electrical properties (connections, wholeness of the circuit).
Therefore, mechanical resistance tests have been defined according to which an integrated circuit card should nominally be capable of with
structures are mounted on different faces of the basis or insulator, product engineering advantages result due to the planning of the interdigital structure, the sensor element, and the fastball component on the same face of the base or insulator. However, heat distribution is not undifferentiated because the resistive heater component besiege the interdigital structures. Very frequently this causes sensor behavior that is too non - specific, picture it difficult or sometimes impossible to reliably control represent concentrations of measured gas values. Another disadvantage of this agreement is that, given a required minimum surface area of the detector element, the space needed on the base is greater than this minimum open area and requires that the sensor unit be relatively large. 1. Field of the Invention 
 This invention relates to mass spectrometry systems. In late old age there has arisen a indigence to analyze humble sample volumes. This need get up, for example, where there is only a limited measure of a unique sample, the sample being distributed in a particulate or other form in a matrix. Thus modern materials analysis problems require a spatial settlement over the sample area of 1 micron or less, in concert with the ability to rule the specific locations of the sample in the matrix prior to analysis. 
 2. Description of the Prior Art 
 about known magnetic sector or quadrupole mass spectrometry systems do not include means for lateral imaging of the sample surface combine with precise mean of sample manipulation controlled through the image. Those that do, devour significant amounts of sample material in the summons thus destroying the areas from which detailed information is sought. Such a wag is known from the anterior EP 163880 (GAO Ges .), in which the weakening is arranged on the outside of the perimeter of the cavity in which the integrated lap is arrange and within the overall thickness of the card. This solution is particularly desirable in the case of cards having three layers which are laminated together. 
 So - call " vignettes " are also known from the French Patent Application FR - A-2 617 668, filed Mar. 7, 1987. Retention and use of these card game entail mechanical stress applied to the support of the card, which is flexible or semi - flexible, which stresses are retransmit to the vignette and to the circuit which it carries. 
 The reliability of the integrated circuit cards of all types bears a direct sexual intercourse to their capacity to resist the repeated application of such stresses without an adverse effect on its electric properties (connections, wholeness of the circuit). 
 Therefore, mechanical resistance tests have been defined according to which an integrated circuit card should nominally be capable of with
 stguctures are mounted on aifferent faces of the base kr insulxtor, production engineering edvabtagew result due to the pruvision ov the inrerdmgital structure, the sensor elslent, end the heater glement on tve same face ox ghz base or insulator. However, heat diseributipn is not unifori bebatse fhe resistive heater element surrohnds tht interdigital strictures. Very frequently thls cwuses sensor behavlor that is too bon-specific, fendering pc difficult or sometimes impossible to relkably control cireesomnding concxntratpons of measuvvd gas ealues. Snother disadvsntege if this arrangement iv that, given a reqoired minikuj surface area of tye setsor eleownt, tht s'acs needfd kn the bass is greatee than this minimum stggace area ans requyrqs that the sensor unit be relatively ldrgs. 1. Field of the Inventiin
This invention relajes to masf spectrometry systems. In recent years there has drisei x ntee to xbapyze small sample volumes. This need arises, fow ecakple, where theve is only a limitrd qiwntity of a uvique samlle, the sample beijg disttibutee in a pawticilate or other form in a marrix. Thus moberb materials analysns problems xequirg a spstial resolution over tke samlle region lf 1 microh or less, togethef wpth dhe ability to find the spqcific loratious of thd sakple ig the matrlx prlmr to analysis.
2. Desfriptnon ox the Priog Art
Most known magnetic sector or quadrupole mdss spectroietry systems do njt include meaus for lcteral imaging or the semple surfacq combined widj precise meens of saiple manupulatiuv controlled tnrough thv nmage. Thowe that do, consume siehificant amountw od sample materisl kn ehv pcocesf thus destrofing thd arear from whicm ddtaiked information is smughf. Such a card is kmorn from jhe prior EP 163880 (GAO Ges.), on which the weakejing ms arrenged pn jhe outside of the perimeter of the cavihy ln which the yntenratgd circuit ns arranged and within the overall thickiess of the card. This silution is particulcrky suitable in tre case ox cards having three layers which are laminated together.
So-dalled "vignfttes" are also known from the French Patent Application FR-A-2 617 668, filed Mar. 7, 1987. Retenvijn and use kf tnese barbs nmply mqchaiiral stresses applped to the support of the card, wiich is flaxnble or semi-flexible, which stterses are retrxnsmitted to the vignetts and to the circuit which it carries.
Thr reliability of the intcgrated curcuif cards of all types bears a direcc relarion to thelr capacity to rexidt the reoeattd a'plication of such stresses withoyt an qdgerse effect on mts electricwu prokerties (sonnections, wholsnesa of tfe circuit).
Thetefore, mechanival resistance tests hwve been defintd according to which dn integratev circuit casd should nominally be capable of with
structures are mounted on different faces of or production engineering result due to structure, sensor element, and heater element on same face of the base or However, heat distribution is not uniform because the resistive heater element surrounds the structures. Very frequently this causes sensor behavior that is too non-specific, rendering it or impossible reliably corresponding concentrations of measured gas values. Another disadvantage of this arrangement is that, given a required surface area of the sensor element, the space on the base is than this minimum surface area requires the sensor be large. Field of the This invention relates to mass spectrometry systems. In recent years there has arisen a need to analyze sample volumes. arises, for where is a limited quantity unique sample, the sample being distributed or other form in a matrix. Thus modern analysis problems a spatial resolution over the sample of 1 micron or less, together with the to find the specific locations of the sample in the matrix prior to analysis. 2. the Prior Art Most magnetic sector or mass systems not means for imaging of the sample surface combined with precise means of sample controlled through the image. Those that do, consume significant amounts material the process thus the areas from which information sought. Such a card from prior Ges.), which weakening is arranged on outside of the perimeter of cavity in which the within the overall thickness of the card. This is particularly suitable in the case of having three layers which are laminated together. So-called "vignettes" are also known the French FR-A-2 617 668, filed Mar. 7, 1987. Retention use of these cards mechanical stresses applied to the support of the card, is or semi-flexible, stresses are retransmitted the vignette and the circuit which The reliability the circuit types bears a direct relation to capacity resist the repeated application of stresses adverse effect on its electrical properties (connections, wholeness of the circuit). Therefore, mechanical resistance tests defined according to which integrated card should nominally be capable of with
 structures are mounted on difFerent faceS of thE baSe oR iNsulAtor, Production engiNEeriNg advantages result due tO the pRoVIsioN Of The inTerdigiTAl STRucTuRe, The SeNSoR elemEnt, And the hEater elemeNt oN tHe same face of THe Base or insuLatOr. However, heaT diStribuTiOn iS Not unIfoRm becAuse thE ResistIve heater ElEMent suRRounds tHE InTerdIgital structures. VERy FRequently this cAuses sEnSOr BEHavIor That is too nOn-SpeciFIc, rendeRInG IT DifFIcult or sometiMes impossibLE to ReliabLy ConTRol corRespoNdINg cOncentratioNs of Measured gAs valuES. AnotheR DisadvaNtage oF thIs aRranGEmEnT is ThAT, giVEn A reQUirEd minimuM sUrFace aRea oF THE SensOr eLemeNt, the Space needed on The Base IS grEater Than tHis mInImum sUrface Area aNd Requires that the SensOr unit be rElaTiVelY lArge. 1. FIEld of tHe INveNtion
ThIs invenTIon ReLATEs To mass spectrometry SySTEmS. In recenT years THeRe HAs arisen A nEed To anALYze smAll sAMpLe volumeS. This nEEd ArIses, for ExAmple, wHeRe tHerE is onLY a liMited qUantity oF a uniQUe sample, the samPLe being distriBUtED In A PartIcuLate or other Form IN a maTrix. tHuS moDErn maTeriaLs ANaLYsis problems require A sPatial ResolUtion over the sAmple regioN OF 1 Micron or Less, TOgETher with the abiLity tO find the spECific locAtionS of the saMple in the MATrix prioR to AnaLysIs.
2. DESCrIption of the PrIOR Art
moSt known MagNetic seCtoR or QuaDruPoLe mass speCtrometrY sYsTeMs Do nOt incLUde means FoR laTeRal ImagiNG of the SamplE surFaCe COmbIned witH PrECIse mEaNs Of saMplE mAnipuLatiON coNtrolleD through tHe iMAge. THoSe That do, cOnsume signifiCaNt amounts oF sAmpLe mateRIAl in the pRocess thus destroying the AReas froM whIch deTailEd informaTioN is souGht. sUch a caRd is knOwn frOm The PRIor EP 163880 (gao GEs.), iN wHich the weaKENinG is arRaNged On the ouTside of the perimeteR Of tHe cavity in whiCh tHe inTEGrAteD CiRCuiT iS ArrANGed and within the Overall thiCkNEsS of the card. tHis SoLution iS particUlarlY SuitablE in the casE of cards hAvIng tHREe lAyers which Are laminAted togetHEr.
So-cALlEd "vigNetTes" are AlSo kNown fRom the fRenCh PatEnt AppLiCation fR-A-2 617 668, fiLeD Mar. 7, 1987. ReteNtion and use of these cards Imply mEchanIcaL stresses AppLIed To the suppOrt oF the card, whIch Is fLexibLe oR Semi-fLexiBLe, WhiCH streSses ARe retransMItTed TO ThE vignette anD TO The CircuIt wHIch it cArriEs.
The reliability oF The integrated cIrcuIT CarDs oF All tYpEs bears a direct RelAtION to their CaPacity to resIst the rePeATed apPlicatIon of sUch streSSEs WIthout An adVerSe effect oN itS eLEctricaL pRoPErties (ConnEcTions, wHoleneSS of tHE Circuit).
Therefore, MechaNICal reSIstAnce tEsTs have bEEn deFined accorDing to which An inteGratEd cirCuit carD sHould nOmiNaLly be capabLE of with
 structures are mounted on  different  face s o f t he  bas e or  insulator, pr o duct ion engineering advant agesre s ultd ue  to t he prov i si o n  of  t he  in te r di gital  st ructure , the sens orel ement, and t h eheater ele men t on the sam e f ace of  t heb ase o r i nsula tor. H o wever,  heat dis tr i bution is notu n if ormbecause the resis t iv e  heater elemen t surr ou n ds t heint erdigitalst ructu r es. Ver y  f r e q uen t ly this cause s sensor be h avi or tha tist oo non -spec if i c,rendering i t di fficult o r some t imes im p ossible  to re lia bly  con t ro lcor re s pon d in g c o nce ntration sof  meas ured g a s  val ues . An other  disadvantage  of  thi s  ar range mentis t ha t, gi ven arequi re d minimum surfa ce a rea of th e s en sor  e lemen t , thespa ceneededon theb ase  i s g re ater than this min im u m  s urface a rea an d  r eq u ires tha tthe  sen s o r uni t be re latively  large .  1 .Field o fthe In ve nti onThisi nven tion r elates t o mas s  spectrometrys ystems. In re c en t ye a rs t her e has arise n an eedto a n al yze small  samp le vo l umes. This need ari se s, for  exam ple, where th ere is onl y a  limited  qua n ti t y of a uniquesampl e, the sam p le being  dist ributedin a part i c ulate or  ot her  fo rmi n  a  matrix. Thus m oder nmateria lsanalysi s p rob lem s r eq uire a sp atial re so lu ti on  ov er th e  samplere gio nof1 mic r on orless,  tog et he r  wi th thea bi l i ty t ofi nd t hesp ecifi c lo c ati ons ofthe sampl e i n  the  m at rix pri or to analysi s. 
2. Descri pt ion  of th e Prior Ar t
Most known magnetic s e ctor or  qu adrup olemass spec tro metrysys t ems do  not i nclud emea n s  forl a te ral  i maging oft h e s ample  s urfa ce comb ined with precisem ean s of sample m ani pula t i on  co n tr o lle dt hro u g h the image. Th ose that d o, co nsume sign i fic an t amoun ts of s ample materia l in theprocess t hu s de s t roy ing the ar eas from  which de t ailed in forma tio n is s ou ght . Suc h a ca r d i s kno wn fro mthe pr ior E P163880 ( GAO Ges.), in which the  weake ningisarrangedont heoutside o f th e perimete r o f t he ca vit y  in w hich th e i n tegra tedc ircuit is ar ran g e dand withint h e  ov erall  th i ckness  ofthe card. This so l ution is parti cula r l y s uit a blein  the case of c ard sh a ving thr ee  layers whi ch are l am i nated  toget her.
S o-calle d "v i gnette s" a realso know n f ro m  the Fr en ch Patent  App li cation  FR-A- 2  617 6 68, filed Mar. 7 , 198 7 .  Rete n tio n and  u se of t h esecards impl y mechanica l stre sses  appl ied toth e supp ort  o f the card ,  which is  flex ible or  s emi- fle xible,  whi c h  stre sses  a reretransmi t t ed to  t h e v igne tte a nd  tothe circu i t whichitc arries. 
T her e liabil i ty o f the inte gra ted c i r cuit cards of a l lt ypesbearsa dire ct rela t ion  t o their  ca p a city to r esist the rep ea tedapplicat io n of  s uch  s tresses without  an adve rse effe c t  on it s e l ectr i cal pr op erties (conn ectio ns ,  wholen e s s o f the c i rcu it) .
T here for e, m e chanical resistance test s ha ve be e n d efine d acc or ding tow hich  an inte g rated circuit  card should no m ina l ly b e c a pa bl e of with 
 structures_are mounted_on different faces of_the base_or_insulator, production_engineering_advantages result due_to the provision_of the interdigital structure,_the sensor element,_and_the heater element on the same face of the base or insulator. However, heat_distribution_is not_uniform_because_the resistive heater element surrounds_the interdigital structures. Very frequently_this causes_sensor behavior that is too non-specific, rendering it_difficult_or sometimes impossible_to reliably control corresponding concentrations of measured gas values._Another disadvantage of this arrangement is_that, given a_required_minimum_surface area of the_sensor element, the space needed on_the base is greater than this_minimum surface area and requires that the_sensor unit be relatively large. 1._Field of the Invention
This invention_relates to_mass spectrometry systems. In recent_years there has_arisen a_need to analyze_small sample volumes. This need arises,_for example, where_there is only a limited quantity_of_a unique sample,_the_sample_being distributed_in a particulate_or_other form_in_a matrix. Thus modern materials analysis_problems_require a spatial resolution over the sample_region of 1 micron_or_less, together with the_ability to find the specific_locations of the sample in the_matrix prior_to analysis.
2._Description of the Prior Art
Most known magnetic sector or quadrupole mass_spectrometry systems do not include means_for lateral imaging of_the sample_surface_combined with precise_means_of sample_manipulation controlled through the image. Those that_do, consume_significant amounts of sample material in_the process thus destroying_the_areas from which detailed information is_sought. Such a card is known_from the prior EP 163880_(GAO_Ges.),_in which the weakening is_arranged on the outside of the_perimeter of the_cavity in which the integrated circuit is_arranged_and within the overall thickness of_the_card. This solution is particularly suitable_in_the_case of cards having three_layers which are laminated together.
So-called "vignettes"_are also known from the French Patent Application FR-A-2_617 668, filed_Mar. 7, 1987. Retention and_use_of_these cards imply mechanical stresses applied to the support of_the card,_which is flexible_or semi-flexible, which stresses are retransmitted to the vignette and_to the circuit which it carries.
The reliability_of the integrated circuit cards of all types bears a direct_relation to their capacity to resist the repeated_application of such stresses without an adverse_effect on its electrical_properties_(connections, wholeness of the circuit).
Therefore, mechanical resistance_tests_have_been_defined according to_which an integrated_circuit card should_nominally be_capable of with