 build their own applications are often driven off by complex and incomprehensible coding syntaxes and unfamiliar concepts like compiling and debugging. For this reason, most people opt to purchase software applications written by professional developers and run the applications on the computing devices they own. Several application-building applications have been developed to lower the barrier to writing software applications. However, these application-building applications still bear difficulties to overcome by everyday people. This invention relates to a method and apparatus for packaging a material between upper and lower films by vacuumizing a space about the material therebetween.
Some of the known methods and apparatus of this type are shown in Japanese patent applications laid-open under Nos. 49-95782 and 49-111786 and Japanese utility model publication No. 48-3022. In any one of these methods and apparatus, a material or materials to be packaged are placed on a lower film or paper on a pedestal which is provided inside of a lower chamber to be movable upwardly and downwardly. The lower chamber has an upper open end which is adapted to be closed by a lower open end of an upper chamber with an upper film interposing between the open ends of the upper and lower chambers. The upper chamber has a heating means therein for softening the upper film by heat to make it expansible.
In such structure, after softening the upper film by heating, the pedestal is moved up while the interior of the upper and lower chambers are being vacuumized. Due to the upward movement of the pedestal, the material thereon contacts the lower surface of the upper film and then expands it upwardly until the peripheral portion of the upper film encloses the material and attaches to the lower film or paper on the pedestal by vacuum suction. After enclosing the material by the upper and lower films, the packaged material is taken out by lifting the upper chamber upwardly to separate from the lower chamber.
In these methods and apparatus set forth above, it has usually been required to place the material or materials to be packaged on the pedestal and also to remove the packaged material or materials from the pedestal by manual operations. Accordingly, it was quite difficult to put the above known packaging methods and apparatus into an automatic production line which automatically conveys the material to be packaged on the lower film and finally discharges the packaged materials as final products.
Another serious problem has been experienced in such known methods and apparatus when it was intended to package a frozen or refrigerated material. Because, when the frozen material is moved up against the upper
build their own applications are often driven off by complex and incomprehensible gull syntax and unfamiliar concepts like compiling and debugging. For this reason, most multitude opt to purchase software application write by professional developers and run the applications on the computing device they own. Several application - construction application have been developed to lower the barrier to writing software applications. However, these application - construction applications still bear difficulty to overcome by everyday people. This invention relates to a method acting and apparatus for packaging a fabric between upper and lower films by vacuumizing a space about the material therebetween. 
 Some of the know methods and apparatus of this type are shown in Japanese patent applications laid - clear under Nos. 49 - 95782 and 49 - 111786 and Japanese utility model publication No. 48 - 3022. In any one of these methods and apparatus, a material or materials to be packaged are placed on a lower movie or composition on a pedestal which is provide inside of a lower chamber to be movable upwardly and down. The lower bedroom has an upper open end which is adapt to be closed by a lower open end of an upper chamber with an upper film interposing between the open ends of the upper and lower chambers. The upper chamber receive a heating mean therein for softening the upper film by heat to make it expansible. 
 In such social organization, after softening the upper film by heating, the pedestal is moved up while the interior of the upper and lower chambers are being vacuumized. Due to the upward apparent motion of the pedestal, the fabric thereon contacts the lower surface of the upper film and then expands it up until the peripheral portion of the upper film encloses the material and attache case to the lower film or paper on the pedestal by vacuum sucking. After enclosing the material by the upper and lower film, the packaged material is taken out by lifting the upper chamber up to separate from the lower bedroom. 
 In these methods and apparatus set forth above, it has normally been required to place the material or materials to be packaged on the pedestal and also to remove the packaged material or materials from the base by manual operations. Accordingly, it was quite unmanageable to arrange the above known packaging methods and apparatus into an automatic production line which mechanically conveys the material to be packaged on the lower film and finally discharges the packaged materials as final merchandise. 
 Another serious problem has been experienced in such known methods and apparatus when it was intended to box a frozen or refrigerated material. Because, when the frozen material is moved up against the upper
 bulld their own applicatioks are often drirwn off by cojplex ana incomprehensible coding syitaxws ane unfamiliar concepts uike comppling and debngging. For this csason, most pekile o't to purchase spftware ap[lications wridtdn by professional developers and run the aplllcations on thg comkutyng svvlces they own. Several applicatioh-buildiig applications have been developed to loaer hhe barrier to wrihing softwats a[plications. Huwever, these applicatikn-building applications still bdar dnfficulties ti oggrcome by evxryday people. This inventimn relayes to a methoc aid apparatus for packaginj a material between upper ang mower films by vaxuymizitg a spazw acouu tie jateriwl vherebetweeh.
Some of thw known methods and a[isratus of thjs typq wre shown in Japanese patent applicatiots maid-open under Nos. 49-95782 and 49-111786 and Japanese utiliti model puflication No. 48-3022. In any one of these methods and appdratua, a naberixo lr materials to be packaged are placed on a ljset nilm or paper on a pedestal wjivr is provided insidz or a lower chamber ho be mjvablw upwardlr anc downwardly. The lower chamver has an uiper open end which is adapted to be vlosec by a lower open end oy an ulper chambeg with an jpper film interoospng tetween ufe open ends of tre upper end lpwer chxmbets. The tpper chamher has a heating means hherenn fos softeninh the upper film by heat to makx it expansibke.
Hn vuch strbcture, after softenyng the upper yilm by keatine, the pedeatal is moved up wrile the inteslor of the u'per and jowee chqmbers xfe being vacuukized. Due to the upqard movement of tme peasstal, the materncl thereon contacys ghe llwxr suwxace of the gppef fkkm ana then trpakds it ipwardly until the paripgeral portion of tne upper fulm encljses the matetial and attaches uo the loxer fikm jr paper on the pedestal by vaduum suctlon. After enclofing the materiak by the upper and lower films, the packeged material is taken iut by lifting the opptr chamber upxardly to separdte from the lower cyamber.
In these meuhods and apparatus set forth abovf, it has usually been required to place the material or materials to be pqckagev jn the pedeatal and dlfp to rqmovx vhe packaged mategial or materials from the pedesval by mangaj operations. Accordingly, it ear quite diffizult to put the above knkwn packsging methods and apparatus intp an automatic productiok line whuch ahtomatpdauly conveys the mayerial to bw packated ln the lower wilk wnd finalpy dmsckarges the packaged materials as dinal prlducts.
Another secious problel has geen evperienced in sudh khlwn mgthods and appsratus when it was intended to pacnade a frozen or gefrigerated katerian. Because, whxn the frozet material is moved up against the upper
build their own applications are often driven complex incomprehensible coding and unfamiliar concepts this most people opt purchase software applications by professional developers and run the on the computing devices they own. Several application-building applications have been developed to the barrier to writing software applications. However, these application-building applications still bear difficulties overcome everyday This relates to a method and apparatus for packaging a material between upper and lower films by a space about the material therebetween. Some of known methods and apparatus this type are shown in patent laid-open under 49-95782 49-111786 Japanese utility model No. 48-3022. In any one of these methods and apparatus, a material or materials to be packaged placed on film or on pedestal is provided inside lower chamber to be movable upwardly lower chamber has an upper open end which adapted to closed by a lower open end an upper chamber with an upper film interposing the open ends of the upper and lower chambers. The upper chamber has a heating for softening the upper by heat to it In structure, softening the film by heating, the pedestal is moved up while the interior the upper and lower chambers are being vacuumized. Due to movement the pedestal, the thereon contacts the lower of upper film and then upwardly the the film the material and attaches the lower film or paper the pedestal by vacuum by the upper and lower films, the packaged is taken out by lifting the upper upwardly to separate from the lower chamber. In these methods and apparatus forth above, usually been required to place the material or to be packaged on pedestal and also to remove the packaged material or from pedestal by operations. Accordingly, it quite difficult to the above known and apparatus an production conveys the material to be packaged the film and finally discharges the materials products. Another serious problem has been experienced in such known methods and apparatus when it to package a frozen refrigerated Because, when the frozen material is moved up against the upper
 build their own applications Are often drIven oFf bY coMpLex aNd inComprehensible COdinG syntaxes and unfamiliar ConcePtS Like COmPilinG and debUGgING. FoR tHiS reAsON, mOst peOplE opt to pUrchase sofTwaRe Applications WRiTten by profEssIonal developErs And run ThE apPLicatIonS on thE compuTIng devIces they oWn. sEveral APplicatION-bUildIng applications haVE bEEn developed to lOwer thE bARrIER to WriTing softwaRe AppliCAtions. HOWeVER, TheSE application-bUilding applICatIons stIlL beAR diffiCultiEs TO ovErcome by eveRydaY people. ThIs inveNTion relATes to a mEthod aNd aPpaRatuS FoR pAckAgINg a MAtEriAL beTween uppEr AnD loweR filMS BY VacuUmiZing A spacE about the mateRiaL theREbeTween.
some oF the KnOwn meThods aNd appArAtus of this type aRe shOwn in JapaNesE pAteNt AppliCAtions LaiD-opEn under nos. 49-95782 and 49-111786 aND JaPaNESE uTility model publicaTiON no. 48-3022. in any one Of thesE MeThODs and appArAtuS, a maTERial oR matERiAls to be pAckageD ArE pLaced on A lOwer fiLm Or pApeR on a pEDestAl whicH is proviDed inSIde of a lower chaMBer to be movablE UpWARdLY and DowNwardly. The lOwer CHambEr haS An UppER open End whIcH Is ADapted to be closed by a LoWer opeN end oF an upper chambEr with an upPER Film inteRposINg BEtween the open eNds of The upper anD Lower chaMbers. the upper Chamber haS A Heating mEanS thEreIn fOR SoFtening the uppER Film By Heat to mAke It expanSibLe.
IN suCh sTrUcture, aftEr softenInG tHe UpPer Film bY Heating, tHe PedEsTal Is movED up whiLe the InteRiOr OF thE upper aND lOWEr chAmBeRs arE beInG vacuUmizED. DuE to the uPward moveMenT Of thE pEdEstal, thE material therEoN contacts tHe LowEr surfACE of the upPer film and then expands it UPwardly UntIl the PeriPheral porTioN of the UppER film eNcloseS the mAtEriAL And atTAChEs tO tHe lower filM OR paPer on ThE pedEstal by Vacuum suction. After ENclOsing the materIal By thE UPpEr aND lOWer FiLMs, tHE Packaged materiaL is taken ouT bY LiFting the upPEr cHaMber upwArdly to SeparATe from tHe lower chAmber.
In thEsE metHODs aNd apparatuS set fortH above, it hAS usuaLLy Been rEquIred to PlAce The maTerial OR maTeriaLs to be PaCkaged On the PeDestal anD also to remove the packageD materIal or MatErials froM thE PedEstal by maNual Operations. accOrdIngly, It wAS quitE difFIcUlt TO put tHe abOVe known paCKaGinG MEtHods and appaRATUs iNto an AutOMatic pRoduCtion line which autOMatically conveYs thE MAteRiaL To be PaCkaged on the lowEr fIlM ANd finallY dIscharges thE packageD mATeriaLs as fiNal proDucts.
AnOTHeR SeriouS proBleM has been eXpeRiENced in sUcH kNOwn metHods AnD apparAtus whEN it wAS Intended to packagE a froZEN or reFRigErateD mAterial. bEcauSe, when the fRozen materiAl is moVed uP agaiNst the uPpEr
 build their own applicati ons are of ten d riv enof f by  com plex and incom p rehe nsible coding syntaxes  andun f amil i ar  conc epts li k ec o mpi li ng  an dd eb uggin g.For thi s reason,mos tpeople opt t o  p urchase so ftw are applicat ion s writ te n b y  prof ess ional  devel o pers a nd run th ea pplica t ions on t he  com puting devices th e yo wn. Several ap plicat io n -b u i ldi ngapplicatio ns  have been de v el o p e d t o  lower the ba rrier to wr i tin g soft wa rea pplica tions .H owe ver, theseappl ication-b uildin g  applic a tions s till b ear  di ffic u lt ie s t oo ver c om e b y  ev eryday p eo pl e. Th is i n v e n tion  re late s toa method andapp arat u s f or pa ckagi ng a  m ateri al bet weenup per and lower f ilms  by vacuu miz in g a  s pacea bout t hemat erial t herebet w een .S o m eof the known metho ds a nd  apparat us oft hi st ype aresh own  inJ a panes e pa t en t applic ations la id -open u nd er Nos .49- 957 82 an d  49- 111786  and Jap anese utility modelp ublication No .  4 8 - 30 2 2. I n a ny one of t hese meth odsa nd  ap p aratu s, ama t er i al or materials tobe  packa ged a re placed ona lower fi l m or paper  ona  p e destal which i s pro vided insi d e of a l owerchamberto be mov a b le upwar dly  an d d own w a rd ly. The lower c hamb er  has an  up per ope n e ndwhi chis  adaptedto be cl os ed  b ya l owero pen endof  an  u ppe r cha m ber wi th an  upp er  f i lminterpo s in g betw ee ntheope nendsof t h e u pper an d lower c ham b ers.  T he  upperchamber has a  h eating mea ns  th ereinf o r soften ing the upper film by h e at to m ake  it e xpan sible.
In  su ch str uct u re, af ter so fteni ng  th e upper f il m b yheating, t h e  pe desta lis m oved up  while the interio r  of  the upper an d l ower c ha mbe r sa rebe i ngv a cuumized. Due t o the upwa rd mo vement oft hepe destal,  the ma teria l  thereo n contact s the low er  sur f a ceof the upp er filmand thene xpand s  i t upw ard ly unt il  th e per iphera l  po rtion  of th eupperfilmen closes t he material and attache s to t he lo wer  film orpap e r o n the ped esta l by vacuu m s uct ion.Aft e r enc losi n gthe mater ialb y the upp e rand l ow er films, t h e pac kaged  ma t erialis t aken out by lifti n g the upper ch ambe r upw ard l y to  s eparate from t helo w e r chambe r. 
In these m ethods a nd appar atus s et for th abov e ,  i t  has u sual lybeen requ ire dt o place  t he materi al o rmateri als to be p a c kaged on the ped estal a nd al s o t o rem ov e the p a ckag ed materia l or materi als fr om t he pe destalby  manua l o pe rations. A c cordingly , itwas qui te  dif fic ult to  put t he ab ovekn own  packagin g me t ho ds and  app aratu sinto  an autom a tic prod uct i on line  w hic h automa t ic a l ly conveys  th e mat e r ial to bep acka g ed on th e lowe r film  and fi n all ydischar ges t he packag ed materi a lsas  fin al produ ct s.
A no the rserious problem  has bee n experi e n ced in  su c h kn o wn met ho ds and appar atuswh e n it wa s int ended t o  pa cka gea fr oze n or refrigerated material. B ecau se, w h enthe f rozen  m ateriali s mo ved up a g ainst the upp er
 build_their own_applications are often driven_off by_complex_and incomprehensible_coding_syntaxes and unfamiliar_concepts like compiling_and debugging. For this_reason, most people_opt_to purchase software applications written by professional developers and run the applications on the_computing_devices they_own._Several_application-building applications have been developed_to lower the barrier to_writing software_applications. However, these application-building applications still bear difficulties_to_overcome by everyday_people. This invention relates to a method and apparatus_for packaging a material between upper_and lower films_by_vacuumizing_a space about the_material therebetween.
Some of the known methods_and apparatus of this type are_shown in Japanese patent applications laid-open under_Nos. 49-95782 and 49-111786 and Japanese_utility model publication No. 48-3022._In any_one of these methods and_apparatus, a material_or materials_to be packaged_are placed on a lower film_or paper on_a pedestal which is provided inside_of_a lower chamber_to_be_movable upwardly_and downwardly. The_lower_chamber has_an_upper open end which is adapted_to_be closed by a lower open end_of an upper chamber_with_an upper film interposing_between the open ends of_the upper and lower chambers. The_upper chamber_has a_heating means therein for softening the upper film by heat to_make it expansible.
In such structure, after_softening the upper film_by heating,_the_pedestal is moved_up_while the_interior of the upper and lower chambers_are being_vacuumized. Due to the upward movement_of the pedestal, the_material_thereon contacts the lower surface of_the upper film and then expands_it upwardly until the peripheral_portion_of_the upper film encloses the_material and attaches to the lower_film or paper_on the pedestal by vacuum suction. After_enclosing_the material by the upper and_lower_films, the packaged material is taken_out_by_lifting the upper chamber upwardly_to separate from the lower chamber.
In_these methods and apparatus set forth above, it has_usually been required_to place the material or_materials_to_be packaged on the pedestal and also to remove the_packaged material_or materials from_the pedestal by manual operations. Accordingly, it was quite difficult_to put the above known packaging methods_and apparatus into an automatic production line which automatically conveys the_material to be packaged on the lower film_and finally discharges the packaged materials as_final products.
Another serious problem_has_been experienced in such known methods and_apparatus_when_it_was intended to_package a frozen_or refrigerated material._Because, when_the frozen material_is moved_up against the_upper