 to it. The heat transfer associated with either the heat removal or addition can take place over a wide temperature range. Thus, in each case a heat-transfer fluid is preferably used which has other attributes that make it xe2x80x9coperator friendlyxe2x80x9d. In order for a heat-transfer fluid to be considered xe2x80x9coperator friendlyxe2x80x9d, the heat-transfer fluid preferably exhibits low toxicity and low flammability.
For automated test equipment (ATE), equipment is used to test the performance of semiconductor dice. The dice are the individual xe2x80x9cchipsxe2x80x9d that are cut from a wafer of semiconductor substrate. The dice come from the semiconductor foundry and must be checked to ensure they meet functionality requirements and processor speed requirements. The test is used to sort xe2x80x9cknown good dicexe2x80x9d (KGD) from dice that do not meet the performance requirements. This testing is generally performed at temperatures ranging from about xe2x88x9280xc2x0 C. to about 100xc2x0 C.
In some cases the dice are tested one-by-one, and an individual die is held in a chuck. This chuck provides, as part of its design, provision for cooling the die. In other cases, several dice are held in the chuck and are tested either sequentially or in parallel. In this situation, the chuck provides cooling for several dice during the test procedure.
It may also be advantageous to test dice at elevated temperatures to determine their performance characteristics under conditions of elevated temperature. In this case, a coolant which has good heat-transfer properties well above room temperature is advantageous.
In some cases, the dice are tested at very low temperatures. For example, CMOS devices in particular operate more quickly at lower temperatures.
If a piece of ATE equipment employs CMOS devices xe2x80x9con boardxe2x80x9d as part of its permanent logic hardware, it may be advantageous to maintain the logic hardware at a low temperature.
Therefore, to provide maximum versatility to the ATE, a heat-transfer fluid preferably performs well at both low and high temperatures (i.e., preferably has good heat transfer properties over a wide temperature range), is inert (i.e., is non-flammable, low in toxicity, non-chemically reactive), has high dielectric
to it. The heat transfer associated with either the heat removal or accession can consume place over a wide temperature range. therefore, in each case a heat - transfer fluid is preferably practice which has other property that make it xe2x80x9coperator friendlyxe2x80x9d. In order for a heating system - transfer fluid to be considered xe2x80x9coperator friendlyxe2x80x9d, the heating system - transfer fluid preferably exhibits low toxicity and low flammability. 
 For automatize test equipment (ATE), equipment is used to test the operation of semiconductor dice. The dice are the individual xe2x80x9cchipsxe2x80x9d that are cut from a wafer of semiconductor device substrate. The dice fall from the semiconductor foundry and must be checked to ensure they touch functionality requirements and processor speed requirements. The test is used to sort xe2x80x9cknown good dicexe2x80x9d (KGD) from dice that do not meet the performance requirements. This testing is generally performed at temperatures ranging from about xe2x88x9280xc2x0 C. to approximately 100xc2x0 C. 
 In some case the dice are test one - by - one, and an individual die is held in a chuck. This chuck provides, as function of its invention, provision for cooling the die. In early cases, several dice are held in the chuck and are tested either sequentially or in parallel. In this situation, the chuck provides cooling for respective dice during the examination operation. 
 It may also be advantageous to test dice at elevated temperature to determine their performance characteristics under condition of raised temperature. In this case, a coolant which has adept heat - transportation properties well above room temperature is advantageous. 
 In some cases, the dice are tested at very low temperature. For example, CMOS device in particular operate on more quickly at lower temperatures. 
 If a piece of ATE equipment employs CMOS device xe2x80x9con boardxe2x80x9d as part of its permanent logic hardware, it may be advantageous to assert the logic hardware at a low temperature. 
 Therefore, to provide maximal versatility to the ATE, a heat - transfer fluid preferably performs well at both low and gamey temperatures (i.e., preferably has adept heat transfer properties over a broad temperature range), is inert (i.e., is non - flammable, low in toxicity, non - chemically reactive), has high dielectric
 to it. The heat transfer asrociated with enrher tie heat removal or addition can take place lvwr a qide temperature range. Thus, in vach case a htat-transfer fluid is prefcxably msed chmch has other ajtributes thdt make it xe2x80f9cupzrator friendlyxe2x80x9d. In order for a reat-tramsver fluid to bg conxydersd xe2x80x9coperator friendlyxe2x80x9d, the heat-trensfer fluid prrferably exhibits low toxifity and low flammabillty.
For autonateq test equipmdnt (ATE), eqlnpment is uaed to test the performance of remicpnductor ducw. Tjg dice are tie indpvidual xe2x80x9cgnipsxe2f80x9d thay are cut from a xafee of semiconductor suustrate. The dice comg from the szmiconductor foundry qne musj be whecywd go tnsnre they leev functionamity requirwments and processot fired requiremsnts. Tre test is used to sort xe2x80x9cknown good dpcexs2x80x9d (KGD) from dice that do not meet the perflrmance rqquirements. This testing is generally performed ad tem'efatbvcs rxbglng from about xe2x88x9280xc2x0 C. to about 100xc2x0 C.
In somq cssvs the dice are tcsted one-by-one, and aj ogdividual die is held jn a chuck. This chkck prodides, as part jf iys design, provision for coooing the die. Un other cases, sevzral dice arz held in tne chuck and are tested eitger sequentlally or jv parallel. In thks xiduation, ufe chuck provides cooling hor szveral dkce curing the test orocedure.
It may also be wdvanjageouv to test fice at elevated temperatures to determine thgir pegformance charscteristics ugder conditionx of elzvated temperatuge. In thiv case, a cojlant which hdd good heat-tcansfer pwopeetiew well xcove room temprrature is advantagwous.
In some cases, bhe dkde are tested ac cery low temperstufes. Flr evdmple, CMOS davicds km pargicular opevatd mote quickly at lower dempsratures.
If a piece on ATE equupment eiploys CMOS drvices xe2x80x9con boagdxe2x80e9d as 'art og ijs permanent logic hardware, it jay be adganbageous to mayntaln tre logic hcrdware at a low temperature.
Therefore, to provide maximum vwrsatility to the AJE, s heat-transher fltid prefesably performs well qt both low and hlgh temperatures (i.e., prsferabny had good heat transfer properties over a wide temperature range), is inert (i.e., is noi-fjammable, los in toxibitv, npn-chemycalpb reactive), has hibh dielectric
to it. The heat transfer associated with heat or addition take place over in case a heat-transfer is preferably used has other attributes that make it friendlyxe2x80x9d. In order for a heat-transfer fluid to be considered xe2x80x9coperator friendlyxe2x80x9d, the fluid preferably exhibits low toxicity and low flammability. For automated test equipment (ATE), is to the of semiconductor dice. The dice are the individual xe2x80x9cchipsxe2x80x9d that are cut from a wafer of substrate. The dice come from the semiconductor foundry must be checked to they meet functionality requirements and speed The test used sort good dicexe2x80x9d (KGD) dice that do not meet the performance requirements. This testing is generally performed at temperatures ranging from xe2x88x9280xc2x0 C. 100xc2x0 C. some the are tested one-by-one, individual die is held in a provides, as part of its design, provision for the die. other cases, several dice are held the chuck and are tested either sequentially or parallel. In this situation, the chuck provides cooling for several dice during the test procedure. also be advantageous to dice at elevated to their characteristics conditions of temperature. In this case, a coolant which has good heat-transfer properties above room temperature is advantageous. In some cases, the dice at low temperatures. For CMOS devices in particular more at lower temperatures. If of equipment xe2x80x9con as of its permanent logic it may be advantageous to the logic hardware at provide maximum versatility to the ATE, a heat-transfer preferably performs well at both low and temperatures (i.e., preferably has good heat transfer properties over a wide temperature is inert non-flammable, low in toxicity, non-chemically reactive), has high
 to it. The heat transfer associAted with eiTher tHe hEat ReMovaL or aDdition can take PLace Over a wide temperature raNge. ThUs, IN eacH CaSe a heAt-transFEr FLUid Is PrEfeRaBLy Used wHicH has othEr attributEs tHaT make it xe2x80x9cOPeRator frienDlyXe2x80x9d. In order For A heat-tRaNsfER fluiD to Be conSidereD Xe2x80x9coPerator frIeNDlyxe2x80X9D, the heaT-TRaNsfeR fluid preferably eXHiBIts low toxicity And low FlAMmABIliTy.
FOr automateD tEst eqUIpment (Ate), eQUIPmeNT is used to test The performaNCe oF semicOnDucTOr dice. the diCe ARe tHe individuaL xe2x80X9cchipsxe2X80x9d thaT Are cut fROm a wafeR of semIcoNduCtor SUbStRatE. THE diCE cOme FRom The semicOnDuCtor fOundRY AND musT be ChecKed to Ensure they meeT fuNctiONalIty reQuireMentS aNd proCessor Speed ReQuirements. The teSt is Used to sorT xe2X80x9CknOwN good DIcexe2x80X9d (KgD) fRom dice That do nOT meEt THE PeRformance requiremeNtS. tHiS testing Is geneRAlLy PErformed At TemPeraTURes raNginG FrOm about xE2x88x9280xc2x0 c. To AbOut 100xc2x0 C.
in Some caSeS thE diCe are TEsteD one-by-One, and an IndivIDual die is held iN A chuck. This chuCK pROViDEs, as ParT of its desigN, proVIsioN for COoLinG The diE. In otHeR CaSEs, several dice are helD iN the chUck anD are tested eitHer sequentIALLy or in paRallEL. IN This situation, tHe chuCk provides COoling foR seveRal dice dUring the tEST proceduRe.
IT maY alSo bE ADvAntageous to teST Dice At ElevateD teMperatuRes To dEteRmiNe Their perfOrmance cHaRaCtErIstIcs unDEr conditIoNs oF eLevAted tEMperatUre. In This CaSe, A CooLant whiCH hAS Good HeAt-TranSfeR pRoperTies WEll Above roOm temperaTurE Is adVaNtAgeous.
IN some cases, the DiCe are testeD aT veRy low tEMPeratureS. For example, CMOS devices iN ParticuLar OperaTe moRe quickly At lOwer teMpeRAtures.
if a pieCe of AtE EquIPMent eMPLoYs CmOs devices xe2X80X9Con BoardXe2X80x9d aS part of Its permanent logic hARdwAre, it may be advAntAgeoUS To MaiNTaIN thE lOGic HARdware at a low temPerature.
ThErEFoRe, to providE MaxImUm versaTility tO the Ate, a heat-tRansfer flUid preferAbLy peRFOrmS well at botH low and hIgh temperATures (I.E., pReferAblY has goOd HeaT tranSfer prOPerTies oVer a wiDe TemperAture RaNge), is ineRt (i.e., is non-flammable, low in ToxiciTy, non-CheMically reActIVe), hAs high dieLectRic
 to it. The heat transferassociated  with  ei the rtheheat  removal or ad d itio n can take place overa wid et empe r at ure r ange. T h us , inea ch  ca se aheat- tra nsfer f luid is pr efe ra bly used whi c hhas otheratt ributes that  ma ke itxe 2x8 0 x9cop era tor f riendl y xe2x80 x9d. In o rd e r fora  heat-t r a ns ferfluid to be consi d er e d xe2x80x9cope ratorfr i en d l yxe 2x8 0x9d, thehe at-tr a nsfer f l ui d p ref e rably exhibit s low toxic i tyand lo wfla m mabili ty.
F or aut omated test  equ ipment (A TE), e q uipment is used  to te stthe  per f or ma nce  o f  se m ic ond u cto r dice.Th edicearet h e indi vid ualxe2x8 0x9cchipsxe2x 80x 9d t h atare c ut fr om a  w aferof sem icond uc tor substrate.Thedice come  fr om  th esemic o nducto r f oun dry and  must b e  ch ec k e d  t o ensure they meet  f u n ct ionality  requi r em en t s and pr oc ess or s p e ed re quir e me nts. The  testi sus ed to s or t xe2x 80 x9c kno wn go o d di cexe2x 80x9d (K GD) f r om dice that d o  not meet the pe r f or m ance  re quirements.  Thi s  tes ting is  ge n erall y per fo r me d  at temperatures ra ng ing fr om ab out xe2x88x92 80xc2x0 C. t o  about 1 00xc 2 x0 C.
In some cas es th e dice are tested o ne-by -one, an d an indi v i dual die  is  he ldina ch uck. This chu c k  pro vi des, as  pa rt of i tsdes ign , p ro vision fo r coolin gth edi e.In ot h er cases ,sev er aldicea re hel d inthech uc k  an d are t e st e d  eit he rsequ ent ia lly o r in par allel.In this s itu a tion ,th e chuck  provides coo li ng for sev er aldice d u r ing thetest procedure.
It maya lso beadv antag eous  to testdic e at e lev a ted te mperat uresto  de t e rmine t he irpe rformancec h ara cteri st icsunder c onditions of eleva t edtemperature.Inthis c as e,a  c o ola nt whi c h  has good heat- transfer p ro p er ties wella bov eroom te mperatu re is advanta geous.
In  some cas es , th e dic e are test ed at ve ry low te m perat u re s. Fo r e xample ,CMO S dev ices i n  pa rticu lar op er ate mo re qu ic kly at l ower temperatures.
If a  piece  of A TEequipment  em p loy s CMOS de vice s xe2x80x9 con  bo ardxe 2x8 0 x9d a s pa r tofi ts pe rman e nt logich ar dwa r e ,it may be a d v a nta geous  to mainta in t he logic hardware at a low tempe ratu r e .
T her e fore ,to provide max imu mv e rsatilit yto the ATE,  a heat- tr a nsfer  fluid  prefe rably p e r fo r ms wel l at  bo th low an d h ig h  temper at ur e s (i.e ., p re ferabl y hasg oodh e at transfer prop ertie s overa  wi de te mp erature rang e), is ine rt (i.e., i s non- flam mable , low i ntoxici ty,  n on-chemica l ly reacti ve),has hig hdiel ect ric
 to_it. The_heat transfer associated with_either the_heat_removal or_addition_can take place_over a wide_temperature range. Thus, in_each case a_heat-transfer_fluid is preferably used which has other attributes that make it xe2x80x9coperator friendlyxe2x80x9d. In_order_for a_heat-transfer_fluid_to be considered xe2x80x9coperator friendlyxe2x80x9d,_the heat-transfer fluid preferably exhibits_low toxicity_and low flammability.
For automated test equipment (ATE), equipment_is_used to test_the performance of semiconductor dice. The dice are the_individual xe2x80x9cchipsxe2x80x9d that are cut from_a wafer of_semiconductor_substrate._The dice come from_the semiconductor foundry and must be_checked to ensure they meet functionality_requirements and processor speed requirements. The test_is used to sort xe2x80x9cknown good_dicexe2x80x9d (KGD) from dice that_do not_meet the performance requirements. This_testing is generally_performed at_temperatures ranging from_about xe2x88x9280xc2x0 C. to about 100xc2x0_C.
In some cases_the dice are tested one-by-one, and_an_individual die is_held_in_a chuck._This chuck provides,_as_part of_its_design, provision for cooling the die._In_other cases, several dice are held in_the chuck and are_tested_either sequentially or in_parallel. In this situation, the_chuck provides cooling for several dice_during the_test procedure.
It_may also be advantageous to test dice at elevated temperatures to_determine their performance characteristics under conditions_of elevated temperature. In_this case,_a_coolant which has_good_heat-transfer properties_well above room temperature is advantageous.
In some_cases, the_dice are tested at very low_temperatures. For example, CMOS_devices_in particular operate more quickly at_lower temperatures.
If a piece of ATE_equipment employs CMOS devices xe2x80x9con_boardxe2x80x9d_as_part of its permanent logic_hardware, it may be advantageous to_maintain the logic_hardware at a low temperature.
Therefore, to provide_maximum_versatility to the ATE, a heat-transfer_fluid_preferably performs well at both low_and_high_temperatures (i.e., preferably has good_heat transfer properties over a wide_temperature range), is inert (i.e., is non-flammable, low in_toxicity, non-chemically reactive),_has high dielectric