 blocking direct currents and passing alternating currents. Among the solid electrolytic capacitors, the most representative one is a tantalum capacitor which is used in application circuits, of which the rate voltage range is low, as well as general industrial equipments. In particular, the tantalum capacitor is frequently used in circuits requiring an excellent frequency characteristic or for reducing noise of communication equipments.
FIG. 1 is a perspective view of a conventional solid electrolytic capacitor, and FIG. 2 is a cross-sectional view of the conventional solid electrolytic capacitor. As shown in FIGS. 1 and 2, the solid electrolytic capacitor 10 includes a capacitor element 11 which determines the capacity and characteristic of the capacitor and is formed of dielectric ceramic powder, anode and cathode lead frames 13 and 14 which are connected to the capacitor element 11 so as to be easily mounted on a printed circuit board (PCB), and an epoxy case 15 which is molded of epoxy so as to protect the capacitor element 11 from the external environment and to form the shape of the capacitor element.
In one side of the capacitor element 11, a rod-shaped anode wire 12 is formed to project with a predetermined length.
The anode wire 12 has a planar surface 12a provided thereon, the pressed surface 12a increasing a contact area with the anode lead frame 13 and preventing the anode lead frame 12 from rocking from side to side during welding.
The capacitor element 11 is manufactured by the following process. First, dielectric ceramic powder is molded in a rectangular parallelepiped shape in a pressing process and is then sintered. Further, a dielectric oxide film is formed on the surface of the sintered body. Then, the body is dipped into a manganese nitrate solution such that a manganese dioxide layer composed of a solid electrolyte is formed on the outer surface of the body.
A process of connecting the anode and cathode lead frames 13 and 14 to the capacitor element 11 manufactured in such a manner includes two steps. In the first step, the plate-shaped anode lead frame 13 is welded on the planar surface 12a of the rod-shaped anode wire 12, which projects from one side surface of the capacitor element 11 at a predetermined length, so as to derive an anode terminal. In the second step, a cathode terminal is derived through the surface of the capacitor element 11 or a conductive adhesive coated on the cathode lead frame 14.
Then, the capacitor element 11 is electrically connected to the anode and cathode lead frames 13 and 14, respectively, and the epoxy case 15 is molded
blocking direct currents and passing understudy stream. Among the solid electrolytic capacitors, the most representative one is a tantalum capacitor which is use in application circuits, of which the pace voltage range is low, equally well as cosmopolitan industrial equipments. In particular, the tantalum capacitor is frequently use in circuits requiring an excellent frequency characteristic or for reducing randomness of communication equipments. 
 FIG. 1 is a perspective opinion of a conventional solid electrolytic capacitor, and FIG. 2 is a crabbed - sectional view of the conventional solid electrolytic capacitor. As prove in FIGS. 1 and 2, the solid electrolytic capacitor 10 includes a capacitor component 11 which determines the capability and characteristic of the capacitor and is formed of dielectric ceramic powder, anode and cathode lead frames 13 and 14 which are connected to the capacitor chemical element 11 so as to be easily mounted on a printed circuit board (PCB), and an epoxy case 15 which is molded of epoxy so as to protect the capacitor element 11 from the external environment and to form the shape of the capacitor element. 
 In one side of the capacitor element 11, a rod - shaped anode wire 12 is formed to stick out with a predetermined length. 
 The anode telegram 12 have a planar airfoil 12a provided thereon, the pressed surface 12a increase a contact area with the anode lead frame 13 and prevent the anode lead frame 12 from rocking from side to side during welding. 
 The capacitor element 11 is fabricate by the following process. First, dielectric ceramic powder is mold in a orthogonal parallelepiped human body in a pressing process and is then sintered. Further, a dielectric oxide film is formed on the surface of the sinter body. Then, the consistency is dipped into a manganese nitrate solution such that a manganese dioxide layer compose of a solid electrolyte is imprint on the outer surface of the torso. 
 A process of get in touch the anode and cathode lead skeleton 13 and 14 to the capacitor element 11 manufacture in such a manner includes two steps. In the beginning step, the denture - shaped anode lead frame 13 is welded on the planar surface 12a of the rod - shaped anode wire 12, which projects from one slope surface of the capacitor element 11 at a bias length, so as to derive an anode end. In the second step, a cathode terminal is derived through the surface of the capacitor element 11 or a conductive adhesive coated on the cathode lead frame 14. 
 Then, the capacitor element 11 is electrically connected to the anode and cathode star frame 13 and 14, respectively, and the epoxy font 15 is molded
 bllcking direct currents akd passing alteruqting rurrenta. Among ghe solid electrolytic capacmtorw, the most representative ove is a twntalum xaparitor which is used in ai'licaflon cnrruits, of which jhe rate voldage range is nod, cs well as general industrial equipmqnts. In pwrticular, the jantaktm cziagitor is frequently used in circhits rexuiring an exvellent frequency charactegistlc or for reducing noise of cimmugucation equioments.
FIG. 1 is a perspedtive view of a conventional souid ekectrolytix xapwwitor, and FMG. 2 is a cross-sectlpnal vhew of yhe conventionsl volud electrolytic capacmtor. As shown in FIGF. 1 and 2, tve solid electrolytuc capawitos 10 ivxluaes a czpacitlr xlement 11 whjch determibes the capacity anc syaracteristic of thq sapacitor and is formed of dielectric ctramid powder, anode and cathide lead frames 13 and 14 which arq connected to the capacitor element 11 so as to be easimh miukted in a printed circuit board (PCB), and an epoxy casq 15 ehpch is molded of cpoxy so as to proyeft jhe capacitor glement 11 fdom the external ejvironmgnt ane to form the shape of the capacitor elenent.
In one spde if the capacitor epement 11, a rud-shsped snode wire 12 is formed tu prkject with w predetedoined length.
The xnoce wire 12 has a planar surfacq 12a provived tkereon, tfe ptessed furface 12a lncreasing a contact arew witk the anode leaf frame 13 and preventing the anovx lead frame 12 fsom rocking from side to side during weldiny.
The capccitor element 11 ps manufartured by thq following pslcess. First, vielectris ceeamix powdef is molded in s rectangllcr parallwlepiped shape in e prgsaing process anb us then sinterec. Fjrtreg, a dyalectric oxige fklm os fofmed on the rurfsce of the sintered tody. Then, the body is ciiped into a mangagese nitrate xolution such that a maiganesx dioxode layer composed of a solid eledtrolyte ls normed on the outcr sorface of tke body.
A process of connecting the anode and cathode lead drames 13 and 14 to the gapacitor elxment 11 manufactgred in such a mannee includes two sttps. In the first step, tge plade-shaoed anode lead frame 13 is welded on the planar surface 12a of the rod-shaped qnode xiwe 12, which pdojevts fgom pne siqe snrhace of the capacptor element 11 at a predetermined length, vo as to derive an anode termimau. In the secovd step, a cathode terminzl is detived through the surface of thr capacitor element 11 or s conducrive zdhesing cuated on the cathoce leab framw 14.
Then, rhe gapacitor elemdnt 11 ls electrifallb cknnected to the anode and cathodw lead fgames 13 and 14, respxctively, and uhe epoqy case 15 is molded
blocking direct currents and passing alternating currents. solid capacitors, the representative one is used application circuits, of the rate voltage is low, as well as general equipments. In particular, the tantalum capacitor is frequently used in circuits requiring an frequency characteristic or for reducing noise of communication equipments. FIG. 1 is a view a solid capacitor, and FIG. 2 is a cross-sectional view of the conventional solid electrolytic capacitor. As shown FIGS. 1 and 2, the solid electrolytic capacitor includes a capacitor element which determines the capacity and of capacitor and formed dielectric powder, anode and lead frames 13 and 14 which are connected to the capacitor element 11 so as to be mounted on circuit board and epoxy 15 which is epoxy so as to protect the from the external environment and to form the of the element. In one side of the element 11, a rod-shaped anode wire 12 is to project with a predetermined length. The anode wire 12 has a planar surface 12a the pressed surface 12a a contact area the lead 13 preventing the lead frame 12 from rocking from side to side during welding. capacitor element 11 is manufactured by the following process. First, powder molded in a parallelepiped shape in a process is then sintered. Further, oxide is surface the body. Then, the body dipped into a manganese nitrate such that a manganese solid electrolyte is formed on the outer surface the body. A process of connecting the and cathode lead frames 13 and 14 to the capacitor element 11 in such includes two steps. In the first step, the anode lead frame 13 welded on the planar surface 12a of the rod-shaped wire which projects one side surface the capacitor element at a predetermined as to an terminal. step, a cathode terminal is derived the of the capacitor element 11 a coated on the cathode lead frame 14. Then, the capacitor element 11 is electrically connected anode and cathode lead 13 14, respectively, and the epoxy case 15 is molded
 blocking direct currents and Passing altErnatIng CurReNts. AMong The solid electrOLytiC capacitors, the most reprEsentAtIVe onE Is A tantAlum capACiTOR whIcH iS usEd IN aPplicAtiOn circuIts, of which The RaTe voltage ranGE iS low, as well As gEneral industRiaL equipMeNts. iN partIcuLar, thE tantaLUm capaCitor is frEqUEntly uSEd in cirCUItS reqUiring an excellent FReQUency characterIstic oR fOR rEDUciNg nOise of commUnIcatiON equipmENtS.
fig. 1 is A Perspective viEw of a convenTIonAl soliD eLecTRolytiC capaCiTOr, aNd FIG. 2 is a croSs-seCtional viEw of thE ConventIOnal solId elecTroLytIc caPAcItOr. AS sHOwn IN FiGS. 1 ANd 2, tHe solid eLeCtRolytIc caPACITor 10 iNclUdes A capaCitor element 11 wHicH detERmiNes thE capaCity AnD charActeriStic oF tHe capacitor and iS forMed of dielEctRiC ceRaMic poWDer, anoDe aNd cAthode lEad framES 13 anD 14 wHICH aRe connected to the caPaCIToR element 11 So as to BE eAsILy mounteD oN a pRintED CircuIt boARd (pCB), and an Epoxy cASe 15 WhIch is moLdEd of epOxY so As tO protECt thE capacItor elemEnt 11 frOM the external enVIronment and to FOrM THe SHape Of tHe capacitor ElemENt.
In One sIDe Of tHE capaCitor ElEMeNT 11, a rod-shaped anode wirE 12 iS formeD to prOject with a preDetermined LENGth.
The anOde wIRe 12 HAs a planar surfaCe 12a prOvided therEOn, the preSsed sUrface 12a iNcreasing A COntact arEa wIth The AnoDE LeAd frame 13 and preVENtinG tHe anode LeaD frame 12 fRom RocKinG frOm Side to sidE during wElDiNg.
thE caPacitOR element 11 Is ManUfActUred bY The folLowinG proCeSs. fIrsT, dielecTRiC CEramIc PoWder Is mOlDed in A recTAngUlar parAllelepipEd sHApe iN a PrEssing pRocess and is thEn Sintered. FuRtHer, A dieleCTRic oxide Film is formed on the surfacE Of the siNteRed boDy. ThEn, the body Is dIpped iNto A ManganEse nitRate sOlUtiON Such tHAT a ManGaNese dioxidE LAyeR compOsEd of A solid eLectrolyte is formed ON thE outer surface Of tHe boDY.
a pRocESs OF coNnECtiNG The anode and cathOde lead fraMeS 13 AnD 14 to the capaCItoR eLement 11 mAnufactUred iN Such a maNner incluDes two stePs. in thE FIrsT step, the plAte-shapeD anode leaD Frame 13 IS wElded On tHe planAr SurFace 12a Of the rOD-shAped aNode wiRe 12, Which pRojecTs From one sIde surface of the capacitoR elemeNt 11 at a PreDetermineD leNGth, So as to derIve aN anode termInaL. In The seConD Step, a CathODe TerMInal iS derIVed througH ThE suRFAcE of the capacITOR elEment 11 Or a COnductIve aDhesive coated on thE Cathode lead fraMe 14.
ThEN, The CapACitoR eLement 11 is electrIcaLlY COnnected To The anode and Cathode lEaD FrameS 13 and 14, reSpectiVely, and THE ePOxy casE 15 is mOldEd
 blocking direct currentsand passin g alt ern ati ng  cur rent s. Among the s o lidelectrolytic capacitor s, th em ostr ep resen tativeo ne i s a  t an tal um ca pacit orwhich i s used inapp li cation circu i ts , of which  th e rate volta gerangeis  lo w , aswel l asgenera l  indus trial equ ip m ents.I n parti c u la r, t he tantalum capac i to r  is frequently  usedin ci r c uit s r equiring a nexcel l ent fre q ue n c y  ch a racteristic o r for reduc i ngnoiseof  co m munica tioneq u ipm ents.
FIG.1 is  a perspe ctivev iew ofa  conven tional  so lid  ele c tr ol yti cc apa c it or, and  FIG. 2is  a  cros s-se c t i o nalvie w of  theconventionalsol id e l ect rolyt ic ca paci to r. As  shown  in F IG S. 1 and 2, the  sol id electr oly ti c c ap acito r  10 in clu des  a capa citor e l eme nt 1 1  w hich determines th ec a pa city and  chara c te ri s tic of t he  ca paci t o r and  isf or med of d ielect r ic  c eramicpo wder,an ode  an d cat h odelead f rames 13  and1 4 which are co n nected to the ca p a ci t or e lem ent 11 so a s to be e asil y  m oun t ed on  a pr in t ed circuit board (PCB) ,and an  epox y case 15 whi ch is mold e d of epoxy  soa st o protect thecapac itor eleme n t 11 fro m the  externa l environ m e nt and t o f orm  th e s h a pe  of the capac i t or e le ment.
I n o ne side  of  th e c apa ci tor eleme nt 11, a  r od -s ha ped  anod e  wire 12  i s f or med  to p r ojectwitha pr ed et e rmi ned len g th . Thean od e wi re12  hasa pl a nar  surfac e 12a pro vid e d th er eo n, thepressed surfa ce  12a incre as ing  a con t a ct areawith the anode lead fra m e 13 an d p reven ting  the anod e l ead fr ame 12 fro m rock ing f ro m s i d e tos i de  du ri ng welding . The  capa ci torelement  11 is manufacture d  by  the followin g p roce s s .Fir s t, die le c tri c ceramic powderis moldedin arectangula r  pa ra llelepi ped sha pe in a press ing proce ss and is  t hens i nte red. Furth er, a di electrico xidef il m isfor med on  t hesurfa ce oft hesinte red bo dy . Then , the  b ody is d ipped into a manganesenitrat e sol uti on such t hat a m anganesediox ide layercom pos ed of  as olidelec t ro lyt e  is f orme d  on the o u te r s u r fa ce of the b o d y .
A  proc ess of con nect ing the anode and cathode lead f rame s 13and 14 t othe capacitorele me n t  11 manu fa ctured in s uch a ma nn e r inc ludestwo st eps. In t he firststep , t he plate- sha pe d  anodele ad frame13 i swelded  on th e  pla n a r surface 12a of  ther o d-sha p edanode  w ire 12, whic h projects  from one s ide su rfac e ofthe cap ac itor e lem en t 11 at ap redetermi ned l ength,so  astoderive  ana n ode t ermi na l.In the se c o nd st ep ,  acath ode t er mina l is deri v ed throu ght he surf ac e o f the ca p ac i t or element  11  or a c onductivea dhes i ve coate d on t he cat hode le a d f ra me 14.The n ,  the capa citor ele m ent  1 1 is  electri ca llyco nne ct ed to the anode  and cat hode lea d frames  13 and1 4, res pe ctively, and  theep o xy case 1 5 i s molde d 
 blocking_direct currents_and passing alternating currents._Among the_solid_electrolytic capacitors,_the_most representative one_is a tantalum_capacitor which is used_in application circuits,_of_which the rate voltage range is low, as well as general industrial equipments. In_particular,_the tantalum_capacitor_is_frequently used in circuits requiring_an excellent frequency characteristic or_for reducing_noise of communication equipments.
FIG. 1 is a perspective_view_of a conventional_solid electrolytic capacitor, and FIG. 2 is a cross-sectional_view of the conventional solid electrolytic_capacitor. As shown_in_FIGS._1 and 2, the_solid electrolytic capacitor 10 includes a_capacitor element 11 which determines the_capacity and characteristic of the capacitor and_is formed of dielectric ceramic powder,_anode and cathode lead frames_13 and_14 which are connected to_the capacitor element_11 so_as to be_easily mounted on a printed circuit_board (PCB), and_an epoxy case 15 which is_molded_of epoxy so_as_to_protect the_capacitor element 11_from_the external_environment_and to form the shape of_the_capacitor element.
In one side of the capacitor_element 11, a rod-shaped_anode_wire 12 is formed_to project with a predetermined_length.
The anode wire 12 has a_planar surface_12a provided_thereon, the pressed surface 12a increasing a contact area with the_anode lead frame 13 and preventing_the anode lead frame_12 from_rocking_from side to_side_during welding.
The_capacitor element 11 is manufactured by the_following process._First, dielectric ceramic powder is molded_in a rectangular parallelepiped_shape_in a pressing process and is_then sintered. Further, a dielectric oxide_film is formed on the_surface_of_the sintered body. Then, the_body is dipped into a manganese_nitrate solution such_that a manganese dioxide layer composed of_a_solid electrolyte is formed on the_outer_surface of the body.
A process of_connecting_the_anode and cathode lead frames_13 and 14 to the capacitor_element 11 manufactured in such a manner includes two_steps. In the_first step, the plate-shaped anode_lead_frame_13 is welded on the planar surface 12a of the_rod-shaped anode_wire 12, which_projects from one side surface of the capacitor element 11_at a predetermined length, so as to_derive an anode terminal. In the second step, a cathode terminal_is derived through the surface of the capacitor_element 11 or a conductive adhesive coated_on the cathode lead_frame_14.
Then, the capacitor element 11 is electrically_connected_to_the_anode and cathode_lead frames 13_and 14, respectively,_and the_epoxy case 15_is molded