 film available by using the composition.
2. Description of the Related Art
In recent years, power consumption and delay time have increased because the progress of high integration, multifunction and high performance in the field of electronic materials has led to an increase in circuit resistance and condenser capacity between interconnects. Particularly, an increase of delay time becomes a large factor for the reduction of signal speed of devices and generation of crosstalk so that reduction of parasitic resistance and parasitic capacitance is required in order to reduce this delay time and accelerate the speed of devices. As one concrete measure for reducing this parasitic capacitance, an attempt has been made to cover the periphery of interconnects with a low-dielectric-constant interlayer insulating film. In addition, the interlayer insulating film is expected to have heat resistance high enough to withstand the thin film formation step at the time of producing a mount board and post steps such as chip connection and pin insertion and also chemical resistance high enough to withstand a wet process. Moreover, Al interconnects have recently been replaced by low resistance Cu interconnects and it is therefore common practice to carry out planarization by CMP (chemical mechanical polishing). They are therefore required to have mechanical resistance high enough to withstand this process.
Although polybenzoxazole and polyimide are widely known as materials for insulating films having high heat resistance, insulating films obtained from them are not satisfactory from the viewpoints of low dielectric constant, low water absorption, durability and hydrolysis resistance because they contain a hetero atom having high polarity such as oxygen atom or nitrogen atom.
High heat-resistant resins having polyarylene ether as a principal chain are known, but further reduction in dielectric constant is desired in order to actualize a high speed device.
In order to obtain an insulating film having a reduced dielectric constant, use of a polymer skeleton composed of a saturated hydrocarbon having a small electronic polarizability is effective. An insulating film making use of a thermal polymer of an adamantane monomer containing a carbon double bond is disclosed in JP-A-2003-292878, but it has a dielectric constant of about 2.6 and a further reduction is required. 1. Field of the Invention
The present invention relates to an optical fiber adapter, and more particularly, to an optical fiber adapter with a shutter member.
2. Description of the Related Art
Recently, the optical fiber has been widely used as signal transmission media because of its high bandwidth and low loss nature. In order to transmit over a longer distance without the need of repeaters, it is common
film available by using the composition. 
 2. Description of the Related Art 
 In recent days, exponent consumption and delay time have increased because the advancement of high integration, multifunction and high operation in the playing field of electronic materials has contribute to an increase in circuit resistor and condenser capacity between interconnects. peculiarly, an increase of delay time becomes a large factor for the reduction of signal speed of device and generation of crosstalk so that reduction of parasitic resistor and parasitic capacitance is required in order to shrink this delay time and accelerate the speed of devices. As one concrete measure for reducing this epenthetic capacitance, an attempt has been made to cover the periphery of interconnects with a low - dielectric - changeless interlayer insulating film. In addition, the interlayer insulating film is expected to have heat resistance high enough to withstand the slender film formation dance step at the time of producing a mount board and post step such as chip connection and pin insertion and besides chemical resistance high enough to withstand a wet process. Moreover, Al interconnects have recently been replaced by low resistance Cu interconnects and it is therefore common practice to hold out planarization by CMP (chemical mechanical shining). They are therefore required to have mechanical resistance high enough to withstand this process. 
 Although polybenzoxazole and polyimide are widely know as materials for insulating films having gamey heat immunity, insulating films obtain from them are not satisfactory from the viewpoints of abject dielectric constant, gloomy water preoccupation, durability and hydrolysis resistance because they contain a hetero atom having high mutual opposition such as oxygen atom or nitrogen atom. 
 High heat - resistant resin having polyarylene ether as a principal chain are known, but further decrease in dielectric constant is desired in order to actualize a high amphetamine device. 
 In order to obtain an isolate film having a reduced dielectric constant, manipulation of a polymer skeleton composed of a saturated hydrocarbon having a small electronic polarizability is effective. An insulating film make habit of a thermal polymer of an adamantane monomer contain a carbon double bond is disclosed in JP - A-2003 - 292878, but it has a dielectric constant of about 2.6 and a further decrease is required. 1. Field of the Invention 
 The present invention relates to an optical fiber adapter, and more particularly, to an optical fiber adapter with a shutter penis. 
 2. Description of the Related Art 
 Recently, the optical fiber has been widely use as signal transmission media because of its eminent bandwidth and low loss nature. In order to transmit over a longer distance without the need of repeater, it is common
 fipm available by using tht composition.
2. Deseeiptioi of ths Relatea Art
In recent years, power clnwumptuon and delay time havd increasvd becausw tht progress of higi integration, jmltifbnrtion and high kerformance hn the field ox dlzctronic materials has led to an incwease im fircuit resistwnce wnd dondenser capacity between intercohnects. Karticularly, an invrease of delay time becomfs a large factor for hhe reductiin os signal speea of devicts and generztion of crosstalk so that reduztion of parasijnx rfvistance anv parafitic capacibsnce iv requited in order tp rxducw this delay time and accelerate the spged of devhczs. As one concrete meqsyre fmr raduckbg ghia 'arzsitic ca'acitance, ah attempt hqs been made to covtr eye periphery kf intqrsonnects with a low-dielectric-constant ittedlayer insulating film. Un addition, the interpayer instlating film is expected to have heat resistance vigh xnuugk to wkrhdtand the thin film formation step at the timq og iroducing a mount board and lodt fteps such as chip eknhection and pin indertion and qlso chemycal resistance high enough to qithstand a cet process. Moreover, Cl interconnzcts hsve rrcently been replaced bv low desistance Fu interckvnects and it is thvrefmre common practice to carwy out plenarivation bh CMK (chemisal mechanlcal imlishing). They are hhereyore sequired tl have mechanical resistance hiji enough to wotvstdnd this proccss.
Although polrbenzoxazole aud polyiiide xre widely known es materials for insulatith films haviig high hqat eesiwtance, kvsulating filmx obtaineb fron them are not satlsfacjody from the vieckoibts of low dielrctfic clnxtwtt, low water absurpgoon, djrabiliuv akd fydrplysis resistance bewauss they contain a hrtcro atom yaving hygh polarity xuch as oxygen atol or iitrogxn atok.
Hidh heat-resistant resins having polyarylfne ether as a [ringipaj chain arz known, but further reduction in dielectcic constant is desired in order to actualnzt a high speev devise.
In ordes to obtain an insulqting film having a reduced dielectric constdnt, ude of a polymer skeleton composed of a saturated hydrocarbon having a smaol elertwonic polarjzabolity if effeceive. En insulating filk making use of a thermal polymxr of an agaiantane monomer containing a cxrbon double cond is disclosed in JP-A-2003-292878, but it nas a dielectric constant of abput 2.6 and a further reducbion is rwquirsd. 1. Fivmd of the Invention
Tne prevent unventiin rclates to an ootivap fiber afapttr, aud more particularly, to an opticao fibee wdapter with a siutter membev.
2. Aescrpption jf the Related Adt
Redfntly, the optical giber has been widely used as signdl transmission nvdia because pf its vigh bandwidvh and low lmss nature. In order to transmit over a longer distahce withoht the nced of repeaters, ov is common
film available by using the composition. 2. the Art In years, power consumption because progress of high multifunction and high in the field of electronic materials led to an increase in circuit resistance and condenser capacity between interconnects. Particularly, increase of delay time becomes a large factor for the reduction of signal of and of so that reduction of parasitic resistance and parasitic capacitance is required in order to reduce this time and accelerate the speed of devices. As concrete measure for reducing parasitic capacitance, an attempt has made cover the of with low-dielectric-constant interlayer insulating In addition, the interlayer insulating film is expected to have heat resistance high enough to withstand the film formation the time producing mount and post steps chip connection and pin insertion and high enough to withstand a wet process. Moreover, interconnects have been replaced by low resistance Cu and it is therefore common practice to carry planarization by CMP (chemical mechanical polishing). They are therefore required to have mechanical resistance high withstand this process. Although and polyimide are known materials insulating having high resistance, insulating films obtained from them are not satisfactory from the of low dielectric constant, low water absorption, durability and hydrolysis they a hetero atom high polarity such as atom nitrogen atom. High heat-resistant polyarylene as are but reduction in dielectric constant desired in order to actualize high speed device. In film having a reduced dielectric constant, use of polymer skeleton composed of a saturated hydrocarbon a small electronic polarizability is effective. An insulating film making use of thermal polymer adamantane monomer containing a carbon double bond is in JP-A-2003-292878, but it a dielectric constant of about 2.6 and a further is 1. Field the Invention The invention relates to optical fiber adapter, particularly, to optical adapter member. 2. Description of the Related Recently, optical fiber has been widely as media because of its high bandwidth and low loss nature. In order to transmit over distance without the need repeaters, is common
 film available by using the coMposition.
2. DEscriPtiOn oF tHe ReLateD Art
In recent yeARs, poWer consumption and delay Time hAvE IncrEAsEd becAuse the PRoGREss Of HiGh iNtEGrAtion, MulTifunctIon and high PerFoRmance in the fIElD of electroNic Materials has Led To an inCrEasE In cirCuiT resiStance ANd condEnser capaCiTY betweEN intercONNeCts. PArticularly, an incrEAsE Of delay time becOmes a lArGE fACTor For The reductiOn Of sigNAl speed OF dEVICes ANd generation oF crosstalk sO ThaT reducTiOn oF ParasiTic reSiSTanCe and parasiTic cApacitancE is reqUIred in oRDer to reDuce thIs dElaY timE AnD aCceLeRAte THe SpeED of Devices. AS oNe ConcrEte mEASURe foR reDuciNg thiS parasitic capAciTancE, An aTtempT has bEen mAdE to coVer the PeripHeRy of interconnecTs wiTh a low-dieLecTrIc-cOnStant INterlaYer InsUlating Film. In aDDitIoN, THE iNterlayer insulatinG fILM iS expecteD to havE HeAt REsistancE hIgh EnouGH To witHstaND tHe thin fiLm formATiOn Step at tHe Time of PrOduCinG a mouNT boaRd and pOst steps Such aS Chip connection ANd pin insertioN AnD ALsO ChemIcaL resistance High ENougH to wIThStaND a wet ProceSs. mOrEOver, Al interconnects HaVe receNtly bEen replaced by Low resistaNCE cu intercOnneCTs ANd it is thereforE commOn practice TO carry ouT planArizatioN by CMP (cheMICal mechaNicAl pOliShiNG). thEy are thereforE REquiReD to have MecHanical ResIstAncE hiGh Enough to wIthstand ThIs PrOcEss.
althoUGh polybeNzOxaZoLe aNd polYImide aRe widEly kNoWn AS maTerials FOr INSulaTiNg FilmS haViNg higH heaT ResIstance, InsulatinG fiLMs obTaInEd from tHem are not satiSfActory from ThE viEwpoinTS Of low dieLectric constant, low water ABsorptiOn, dUrabiLity And hydrolYsiS resisTanCE becauSe they ContaIn A heTERo atoM HAvIng HiGh polarity SUCh aS oxygEn Atom Or nitroGen atom.
High heat-resIStaNt resins havinG poLyarYLEnE etHEr AS a pRiNCipAL Chain are known, buT further reDuCTiOn in dielecTRic CoNstant iS desireD in orDEr to actUalize a hiGh speed deViCe.
In ORDer To obtain an InsulatiNg film havINg a reDUcEd dieLecTric coNsTanT, use oF a polyMEr sKeletOn compOsEd of a sAturaTeD hydrocaRbon having a small electroNic polArizaBilIty is effeCtiVE. An InsulatinG filM making use Of a TheRmal pOlyMEr of aN adaMAnTanE MonomEr coNTaining a cARbOn dOUBlE bond is discLOSEd iN JP-A-2003-292878, bUt iT Has a diElecTric constant of aboUT 2.6 and a further reDuctION is ReqUIred. 1. fiEld of the InventIon
thE PResent inVeNtion relateS to an optIcAL fibeR adaptEr, and mOre partICUlARly, to aN optIcaL fiber adaPteR wITh a shutTeR mEMber.
2. DeScriPtIon of tHe RelaTEd ArT
rEcently, the opticaL fibeR HAs beeN WidEly usEd As signaL TranSmission meDia because oF its hiGh baNdwidTh and loW lOss natUre. in Order to traNSmit over a LongeR distanCe WithOut The neeD of rEPEaterS, it iS cOmmOn
 film available by using t he composi tion. 
2.  De sc ript ionof the Related ArtIn recent years, power  cons um p tion an d del ay time ha v e  in cr ea sed  b e ca use t heprogres s of highint eg ration, mult i fu nction and  hi gh performan cein the  f iel d  of e lec troni c mate r ials h as led to  a n  incre a se in c i r cu it r esistance and con d en s er capacity be tweenin t er c o nne cts . Particul ar ly, a n  increa s eo f del a y time become s a large f a cto r forth e r e ductio n ofsi g nal  speed of d evic es and ge nerati o n of cr o sstalkso tha t r edu ctio n  o fpar as i tic re sis t anc e and pa ra si tic c apac i t a n ce i s r equi red i n order to re duc e th i s d elaytimeandac celer ate th e spe ed  of devices. As  one  concrete  me as ure  f or re d ucingthi s p arasiti c capac i tan ce , a nattempt has been m ad e to  cover t he per i ph er y  of inte rc onn ects w ith a  low - di electric -const a nt  i nterlay er  insul at ing  fi lm. I n  add ition,  the int erlay e r insulating f i lm is expecte d  t o ha v e he atresistancehigh enou gh t o  w ith s tandthe t hi n  f i lm formation step a tthe ti me of  producing amount boar d a nd poststep s  s u ch as chip con necti on and pin insertio n and  also ch emical re s i stance h igh  en oug h t o wi thstand a wet p roce ss . Moreo ver , Al in ter con nec tsha ve recent ly beenre pl ac ed  by  lowr esistanc eCuin ter conne c ts and  it i s th er ef o recommonp ra c t iceto  c arry  ou tplana riza t ion  by CMP  (chemica l m e chan ic al  polish ing). They ar ethereforere qui red to h ave mech anical resistance highe nough t o w ithst andthis proc ess .
Alth oug h  polyb enzoxa zolean d p o l yimid e ar e w id ely knowna s  ma teria ls  for  insula ting films havingh igh  heat resista nce , in s u la tin g  f i lms  o b tai n e d from them are  not satis fa c to ry from th e  vi ew pointsof lowdiele c tric co nstant, l ow waterab sorp t i on,  durabilit y and hy drolysisr esist a nc e bec aus e they  c ont ain a  heter o  at om ha ving h ig h pola ritysu ch as ox ygen atom or nitrogen a tom.
H igh h eat -resistan t r e sin s havingpoly arylene et her  as  a pr inc i pal c hain ar e k n own,butf urther re d uc tio n in  dielectric c o nst ant i s d e siredin o rder to actualize a high speed d evic e . 
In  or d er t oobtain an insu lat in g film hav in g a reduced  dielect ri c  cons tant,use of  a poly m e rs keleto n co mpo sed of asat ur a ted hyd ro ca r bon ha ving  a  small  elect r onic p olarizability is  effe c t ive.A n i nsula ti ng film maki ng use ofa thermal p olymer  ofan ad amantan emonome r c on taining ac arbon dou ble b ond isdi sclo sed  in JP -A-2 0 0 3-292 878,  b utit has ad i el e ct ri c  co nsta nt of  a bout  2.6 anda  further  re d uctionis  re q u ired.1 .F i eld of the  In venti o n 
The prese n t in v en t ion r elates  to an  optica l  fi be r adapt er, a nd more p articular l y,to  anopticalfi berad apt er  with a shutter  member. 
2. Desc r i ptionoft he R e latedAr t
Recently,the o pt i cal fib e r  ha s beenw ide lyuse d as  si gnal transmission media becau se o f its hig h ban dwidt hand lowl ossnature.I n order to tr ansmit over a l o nge r  dis tan c ewi thout the  ne e d ofrepe ate rs,itis c o m mon
 film_available by_using the composition.
2. Description_of the_Related_Art
In recent_years,_power consumption and_delay time have_increased because the progress_of high integration,_multifunction_and high performance in the field of electronic materials has led to an increase_in_circuit resistance_and_condenser_capacity between interconnects. Particularly, an_increase of delay time becomes_a large_factor for the reduction of signal speed of_devices_and generation of_crosstalk so that reduction of parasitic resistance and parasitic_capacitance is required in order to_reduce this delay_time_and_accelerate the speed of_devices. As one concrete measure for_reducing this parasitic capacitance, an attempt_has been made to cover the periphery_of interconnects with a low-dielectric-constant interlayer_insulating film. In addition, the_interlayer insulating_film is expected to have_heat resistance high_enough to_withstand the thin_film formation step at the time_of producing a_mount board and post steps such_as_chip connection and_pin_insertion_and also_chemical resistance high_enough_to withstand_a_wet process. Moreover, Al interconnects have_recently_been replaced by low resistance Cu interconnects_and it is therefore_common_practice to carry out_planarization by CMP (chemical mechanical_polishing). They are therefore required to_have mechanical_resistance high_enough to withstand this process.
Although polybenzoxazole and polyimide are widely known_as materials for insulating films having_high heat resistance, insulating_films obtained_from_them are not_satisfactory_from the_viewpoints of low dielectric constant, low water_absorption, durability_and hydrolysis resistance because they contain_a hetero atom having_high_polarity such as oxygen atom or_nitrogen atom.
High heat-resistant resins having polyarylene_ether as a principal chain_are_known,_but further reduction in dielectric_constant is desired in order to_actualize a high_speed device.
In order to obtain an insulating_film_having a reduced dielectric constant, use_of_a polymer skeleton composed of a_saturated_hydrocarbon_having a small electronic polarizability_is effective. An insulating film making_use of a thermal polymer of an adamantane monomer_containing a carbon_double bond is disclosed in_JP-A-2003-292878,_but_it has a dielectric constant of about 2.6 and a_further reduction_is required. 1._Field of the Invention
The present invention relates to an optical_fiber adapter, and more particularly, to an_optical fiber adapter with a shutter member.
2. Description of the Related_Art
Recently, the optical fiber has been widely used_as signal transmission media because of its_high bandwidth and low_loss_nature. In order to transmit over a_longer_distance_without_the need of_repeaters, it is_common