 the left eye image and the right eye image, increasing an extent of crosstalk between the left eye image and the right eye image. This invention generally relates to materials used in making multilayer circuits.
As used herein, a circuit subassembly is an article used in the manufacture of circuits and multilayer circuits, and includes circuit laminates, packaging substrate laminates, build-up materials, bond plies, resin coated conductive layers, and cover films. A circuit laminate is a type of circuit subassembly that has a conductive layer, e.g., copper, fixedly attached to a dielectric substrate layer. Double clad laminates have two conductive layers, one on each side of the dielectric layer. Patterning a conductive layer of a laminate, for example by etching, provides a circuit. Multilayer circuits comprise a plurality of conductive layers, at least one of which contains a conductive wiring pattern.
Typically, multilayer circuits are formed by laminating, using heat and/or pressure, two or more materials, at least one of which contains a circuit layer, using bond plies. For example, a bondply can be in contact with a circuit layer of each of two double-clad dielectric substrates, when laminated in proper alignment.
In use, a bondply, or a portion thereof, can flow and completely fill the space and provide adhesion between circuits, between a circuit and a conductive layer, between two conductive layers, or between a circuit and a dielectric layer. The one or more of the polymers in a bondply are designed to soften or flow during manufacture of the multilayer circuit but not in use of the circuit. In multilayer structures, after lamination, known hole-forming and plating technologies may be used to produce useful electrical pathways between conductive layers.
The optimum structural design of a bondply in a laminate would involve a composition that is homogeneous throughout and that provides the same electrical, thermal, and mechanical properties (including low dielectric constant and low dissipation factor) as that of the copper clad laminate. A bondply used in the formation of rigid circuit laminates, multilayer circuits, and subassemblies, can optionally comprise a glass fabric saturated with an uncured or B-staged polymer composition, which cures in the circuit or subassembly lamination process. The glass fabric can provide a hard stop to prevent conductors on opposing layers from coming too close to each other and causing low resistance or other problems.
Bond plies and other circuit subassembly materials can
the left eye image and the right center prototype, increasing an extent of crosstalk between the left center image and the correct eye trope. This invention broadly relates to material used in making multilayer circumference. 
 As used herein, a circuit subassembly is an article use in the industry of circuits and multilayer circuits, and includes circuit laminates, box substrate laminates, build - up materials, alliance plies, resin coated conductive layer, and cover movie. A circuit laminate is a type of circuit subassembly that has a conductive layer, for example, copper, fixedly attached to a dielectric substrate layer. Double clad laminates accept two conductive layers, one on each side of the dielectric layer. Patterning a conductive layer of a laminate, for example by etching, provides a circuit. Multilayer circuits consist a plurality of conductive layers, at least one of which control a conductive wiring design. 
 Typically, multilayer circuits are formed by laminating, using heat and/or pressure, two or more materials, at least one of which check a circuit layer, using bond plies. For exemplar, a bondply can be in contact with a circuit layer of each of two double - clothe dielectric substrates, when laminate in proper alignment. 
 In use, a bondply, or a portion thereof, can flow and wholly fill the space and provide adhesion between circuits, between a circuit and a conductive layer, between two conductive layers, or between a circuit and a dielectric level. The one or more of the polymers in a bondply are designed to soften or flow during manufacture of the multilayer tour but not in use of the tour. In multilayer structures, after lamination, know hole - form and plating technologies may be used to grow useful electric pathways between conductive layers. 
 The optimum structural purpose of a bondply in a laminate would involve a composition that is homogeneous throughout and that provides the same electrical, thermal, and mechanical property (including low dielectric ceaseless and low dissipation gene) as that of the copper clad laminate. A bondply used in the geological formation of rigid circuit laminates, multilayer circuits, and subassemblies, can optionally comprise a glass framework saturated with an uncured or B - spy polymer composition, which cures in the circuit or subassembly lamination process. The glass fabric can supply a hard stop to prevent conductors on pit layers from coming too close to each other and induce low resistance or other problem. 
 Bond plies and other circuit subassembly materials can
 thf left eye image and the right eye imagg, uncreaving ah extent of crosstalk between the leht ete imqge and the right eye kmage. Thid inventuon jenerally relates to matcxials msed nn making multilsyer circuhts.
As used heraiv, c circuit subassembly is an article tsed in tje manufacture of biwcuifs and multilayer circuits, and incmudes cprcuit laminates, lackaging substrate laminahes, huild-up materials, hond plies, tssig coated condjctive laytrv, and covet films. A circuit laminate is a gype pf circuit sybadvembly that has w conductive layer, e.c., coppet, fixedly attaghed vo a dielectric substrate layer. Double clad laminatev kave two conductive lqywrs, ote ot eazy skde oh tge diepecvric layer. Latterning q conductive layer pf q laminate, fod exam[lq by etching, provides a circuit. Multilajer dircuits comprise a plueality of conductive payers, at least one of which contains a conductive wiring [attecn.
Gypngwuoy, multilayer circuits are formed by laminating, hsonn heat and/or prefsure, two ot lotg materials, at least ons of which containd a cirsuit oayer, usigg bpnd plies. For example, a boneply can be pn cintact with a circbit layer of eacn of ywo double-clad dielectrnc subatrates, whej laminatsa in proper aligvmekt.
It use, a bondply, or a portijn thereoh, can flow avd cpmpletqly fill tje space and provide adhfsion batween cirfuits, between a circuit and a conductive layet, batwven two cjnducbive layers, or fetween a circoit and a dieldctric layvr. The onx or more of the polymers ln a bondply are desygnee to soften ur flow during manufactlrt of the myltilayer circuit nut nuf in use of the citxuit. In multilsyef serlctnres, wxter laminathon, ynodm hold-forming anb olatong technologies may be hsed to produce usrfml electrucal patrways between conductive layers.
Uhe opvimum rtrucyurwl design of a bondply in a lajinate wokld involve a cjmpowition that ns homogeneous throughout and that provives the same electrical, thermal, and mechanncsl propertixs (incjuding lof dielectric constanr and low dissipauion factor) as that of fhe co[per flad laminate. A bondply used in the formation of rigid circuit laminates, nultileyqr circuits, and subavszmbkies, cwn o'tmonally comprise s glass fabric saturated with ai uncured mr B-staged polymer composition, wfich cures in the circuit or subassemgly lamimation process. The glass fabric can provide a hard stop to prevwnt cknductors un opposing layers from eoming too clise bo each other xnd cwusing loa rexiatance or other problems.
Bond pliws and ohher circuit subessembly matcrlals czn
the left eye image and the right increasing extent of between the left eye This invention generally to materials used making multilayer circuits. As used herein, circuit subassembly is an article used in the manufacture of circuits and multilayer and includes circuit laminates, packaging substrate laminates, build-up materials, bond plies, resin coated layers, cover A laminate is a type of circuit subassembly that has a conductive layer, e.g., copper, fixedly attached a dielectric substrate layer. Double clad laminates have conductive layers, one on side of the dielectric layer. a layer of laminate, example etching, provides a Multilayer circuits comprise a plurality of conductive layers, at least one of which contains a conductive wiring Typically, multilayer formed by using and/or two or more least one of which contains a bond plies. For example, a bondply can be contact with circuit layer of each of two dielectric substrates, when laminated in proper alignment. In a bondply, or a portion thereof, can flow and completely fill the space and provide circuits, between a circuit a conductive layer, two layers, between circuit and dielectric layer. The one or more of the polymers in a are designed to soften or flow during manufacture of the but in use of circuit. In multilayer structures, lamination, hole-forming and plating technologies used produce between layers. optimum structural design of bondply in a laminate would a composition that is the same electrical, thermal, and mechanical properties (including dielectric constant and low dissipation factor) as of the copper clad laminate. A bondply used in the formation of circuit laminates, and subassemblies, can optionally comprise a glass fabric with an uncured or polymer composition, which cures in the circuit or subassembly process. glass fabric provide a hard to prevent conductors opposing layers from close to other causing other problems. Bond plies and other subassembly can
 the left eye image and the righT eye image, iNcreaSinG an ExTent Of crOsstalk between THe leFt eye image and the right eYe imaGe. tHis iNVeNtion GeneralLY rELAteS tO mAteRiALs Used iN maKing mulTilayer cirCuiTs.
as used herein, A CiRcuit subasSemBly is an articLe uSed in tHe ManUFactuRe oF circUits anD MultilAyer circuItS, And incLUdes cirCUIt LamiNates, packaging subSTrATe laminates, buiLd-up maTeRIaLS, BonD plIes, resin coAtEd conDUctive lAYeRS, ANd cOVer films. A circUit laminate IS a tYpe of cIrCuiT SubassEmbly ThAT haS a conductivE layEr, e.g., coppeR, fixedLY attachED to a dieLectriC suBstRate LAyEr. douBlE ClaD LaMinATes Have two cOnDuCtive LayeRS, ONE on eAch Side Of the Dielectric layEr. PAtteRNinG a conDuctiVe laYeR of a lAminatE, for eXaMple by etching, prOvidEs a circuiT. MuLtIlaYeR circUIts comPriSe a PluraliTy of conDUctIvE LAYeRs, at least one of whicH cONTaIns a condUctive WIrInG Pattern.
TYpIcaLly, mULTilayEr ciRCuIts are foRmed by LAmInAting, usInG heat aNd/Or pResSure, tWO or mOre matErials, at Least ONe of which contaINs a circuit layER, uSINg BOnd pLieS. For example, A bonDPly cAn be IN cOntACt witH a cirCuIT lAYer of each of two doublE-cLad dieLectrIc substrates, wHen laminatED IN proper aLignMEnT.
in use, a bondply, oR a porTion thereoF, Can flow aNd comPletely fIll the spaCE And proviDe aDheSioN beTWEeN circuits, betwEEN a ciRcUit and a ConDuctive LayEr, bEtwEen TwO conductiVe layers, Or BeTwEeN a cIrcuiT And a dielEcTriC lAyeR. The oNE or morE of thE polYmErS In a Bondply ARe DESignEd To SoftEn oR fLow duRing MAnuFacture Of the multIlaYEr ciRcUiT but not In use of the cirCuIt. In multilAyEr sTructuRES, after laMination, known hole-forminG And platIng TechnOlogIes may be uSed To prodUce USeful eLectriCal paThWayS BEtweeN COnDucTiVe layers.
ThE OPtiMum stRuCturAl desigN of a bondply in a lamiNAte Would involve a ComPosiTIOn ThaT Is HOmoGeNEouS THroughout and thaT provides tHe SAmE electricaL, TheRmAl, and meChanicaL propERties (inCluding loW dielectrIc ConsTANt aNd low dissiPation faCtor) as thaT Of the COpPer clAd lAminatE. A BonDply uSed in tHE foRmatiOn of riGiD circuIt lamInAtes, multIlayer circuits, and subassEmblieS, can oPtiOnally comPriSE a gLass fabriC satUrated with An uNcuRed or b-stAGed poLymeR CoMpoSItion, WhicH Cures in thE CiRcuIT Or Subassembly LAMInaTion pRocESs. The gLass Fabric can provide a HArd stop to preveNt coNDUctOrs ON oppOsIng layers from cOmiNg TOO close to EaCh other and cAusing loW rESistaNce or oTher prOblems.
BOND pLIes and OtheR ciRcuit subaSseMbLY materiAlS cAN
 the left eye image and th e right ey e ima ge,  in cr easi ng a n extent of cr o ssta lk between the left ey e ima ge andt he  righ t eye i m ag e .  Th is  i nve nt i on  gene ral ly rela tes to mat eri al s used in ma k in g multilay ercircuits.
As  us ed her ei n,a  circ uit  suba ssembl y  is an  articleus e d in t h e manuf a c tu re o f circuits and mu l ti l ayer circuits,  and i nc l ud e s  ci rcu it laminat es , pac k aging s u bs t r a tel aminates, bui ld-up mater i als , bond  p lie s , resi n coa te d  co nductive la yers , and cov er fil m s. A ci r cuit la minate  is  atype of  c irc ui t  su b as sem b lythat has  a  c onduc tive l a y er,e.g ., c opper , fixedly att ach ed t o  adiele ctric  sub st ratelayer.  Doub le  clad laminates  hav e two con duc ti vela yers, one on  ea chside of  the di e lec tr i c la yer. Patterning aco n d uc tive lay er ofa  l am i nate, fo rexa mple b y etc hing ,  p rovidesa circ u it .Multila ye r circ ui tscom prise a pl uralit y of con ducti v e layers, at l e ast one of wh i ch c on t ains  aconductivewiri n g pa tter n .Typ i cally , mul ti l ay e r circuits are form ed  by la minat ing, using he at and/orp r e ssure, t wo o r  m o re materials,at le ast one of which co ntain s a circ uit layer , using bo ndpli es.  Fo r ex ample, a bond p l y ca nbe in c ont act wit h a  ci rcu itla yer of ea ch of tw odo ub le -cl ad di e lectricsu bst ra tes , whe n  lamin atedin p ro pe r  al ignment . 
I n use,  a  b ondp ly,  o r a p orti o n t hereof,  can flow  an d  com pl et ely fil l the space a nd  provide a dh esi on bet w e en circu its, between a circuita nd a co ndu ctive  lay er, betwe entwo co ndu c tive l ayers,  or b et wee n a cir c u it  an da dielectr i c  la yer.Th e on e or mo re of the polymers ina bondply are  de sign e d  t o s o ft e n o rf low d uring manufactu re of themu l ti layer circ u itbu t not i n use o f the circuit . In mult ilayer st ru ctur e s , a fter lamin ation, k nown hole - formi n gand p lat ing te ch nol ogies  may b e  us ed to  produ ce  usefu l ele ct rical pa thways between conducti ve lay ers.The  optimumstr u ctu ral desig n of  a bondply  in  alamin ate would  inv o lv e a compo siti o n that is ho mog e n eo us througho u t and  that  pr o videsthesame electrical,t hermal, and me chan i c alpro p erti es  (including lo w d ie l e ctric co ns tant and lo w dissip at i on fa ctor)as tha t of th e co p per cl ad l ami nate. A b ond pl y  used i nth e  forma tion  o f rigi d circ u it l a m inates, multilay er ci r c uits, and  suba ss emblies ,  can  optionall y comprisea glas s fa bricsaturat ed  withanun cured or B - staged po lymer  compos it ion,  wh ich cu resi n  thecirc ui t o r subasse m b ly la mi n ati on p roces s.  The  glass fa b ric canpro v ide a h ar d s t o p to p r ev e n t conducto rson op p o sing layer s  fro m  c o mingtoo cl ose to  each o t her  a nd caus ing l ow resist ance or o t her  p robl ems.
Bon dplie sand  o ther circuit su bassembl y materi a l s can
 the_left eye_image and the right_eye image,_increasing_an extent_of_crosstalk between the_left eye image_and the right eye_image. This invention_generally_relates to materials used in making multilayer circuits.
As used herein, a circuit subassembly is_an_article used_in_the_manufacture of circuits and multilayer_circuits, and includes circuit laminates,_packaging substrate_laminates, build-up materials, bond plies, resin coated conductive_layers,_and cover films._A circuit laminate is a type of circuit subassembly_that has a conductive layer, e.g.,_copper, fixedly attached_to_a_dielectric substrate layer. Double_clad laminates have two conductive layers,_one on each side of the_dielectric layer. Patterning a conductive layer of_a laminate, for example by etching,_provides a circuit. Multilayer circuits_comprise a_plurality of conductive layers, at_least one of_which contains_a conductive wiring_pattern.
Typically, multilayer circuits are formed by_laminating, using heat_and/or pressure, two or more materials,_at_least one of_which_contains_a circuit_layer, using bond_plies._For example,_a_bondply can be in contact with_a_circuit layer of each of two double-clad_dielectric substrates, when laminated_in_proper alignment.
In use, a_bondply, or a portion thereof,_can flow and completely fill the_space and_provide adhesion_between circuits, between a circuit and a conductive layer, between two_conductive layers, or between a circuit_and a dielectric layer._The one_or_more of the_polymers_in a_bondply are designed to soften or flow_during manufacture_of the multilayer circuit but not_in use of the_circuit._In multilayer structures, after lamination, known_hole-forming and plating technologies may be_used to produce useful electrical_pathways_between_conductive layers.
The optimum structural design_of a bondply in a laminate_would involve a_composition that is homogeneous throughout and that_provides_the same electrical, thermal, and mechanical_properties_(including low dielectric constant and low_dissipation_factor)_as that of the copper_clad laminate. A bondply used in_the formation of rigid circuit laminates, multilayer circuits, and_subassemblies, can optionally_comprise a glass fabric saturated_with_an_uncured or B-staged polymer composition, which cures in the circuit_or subassembly_lamination process. The_glass fabric can provide a hard stop to prevent conductors_on opposing layers from coming too close_to each other and causing low resistance or other problems.
Bond plies_and other circuit subassembly materials can