 array substrate 20 are established using a technology such as TAB (Tape Automated Bonding) with probing pads 18, 19 formed on the array substrate 20.
In the meantime, in a later stage when a manufacturing step of the array substrate has been terminated, it is a usual practice to conduct an array test in order to confirm whether the manufactured array substrate properly functions. Such an array test has its own objectives such as: (a) preventing a defective array from being delivered to a cell step (subsequent step); (b) conducting a feed back to provide an improved process in the array step; and (c) providing an improved yield rate through an interlocking operation with a repair device. With the p-Si array substrate set forth above, a test is conducted for the pixel section and the driver circuits contained in the substrate, whereas with the a-Si substrate, only the pixel section is subjected to test. In this connection, typical testing processes for the pixel section are categorized in the following two technologies
(1) an integrator process: of charging the supplemental capacitors (hereinafter suitably referred to as Cs capacitors), discharging the capacitors after an elapse of a fixed time interval, implementing integration of current flowing at that time instant for conversion into the amount of charge stored in the Cs capacitor, and measuring the amount of charge for thereby discriminating a quality of the pixel elements.
(2) a voltage detection process: of charging Cs capacitors forming pixel element capacitors during a test mode, discharging the capacitors after an elapse of a fixed time interval, and measuring a voltage potential difference occurring at the time instant for thereby discriminating a quality of the pixel elements. The invention is related to a floating-caliper spot-type disc brake which is particularly designed for high performance.
Automotive vehicles which reach high driving speeds need high performance brakes, which require as large as possible a brake disc diameter, while the diameter of the vehicle wheels cannot be increased because of other considerations. The mounting space for the brake is thus severely restricted between the external edge of the brake disc and the predetermined diameter of the wheel rim. The brake caliper of a disc brake customarily straddles the external edge of the brake disc, with a bridge of the brake caliper positioned in the forementioned mounting space, and thus the radial dimension of the bridge limits the maximum diameter of the brake disc.degree. The caliper bridge must, on the other hand, have a determined minimum thickness because it transmits the clamping forces which are required for braking action.

array substrate 20 are established using a technology such as TAB (Tape Automated Bonding) with probing pad 18, 19 form on the array substrate 20. 
 In the meantime, in a later stage when a fabrication step of the array substrate has been terminated, it is a usual exercise to lead an array test in order to confirm whether the manufactured array substrate properly function. Such an array test has its own objective such as: (a) prevent a defective array from being delivered to a cell step (subsequent step); (b) conduct a feed back to provide an improved process in the array step; and (deoxycytidine monophosphate) providing an improved yield rate through an interlocking process with a repair device. With the p - Si array substrate set forth above, a test is conduct for the pixel section and the driver circuits contained in the substrate, whereas with the a - Si substrate, only the pixel incision is subjected to test. In this connection, typical testing processes for the pixel section are categorized in the following two technologies 
 (1) an integrator procedure: of charging the supplemental capacitor (hereinafter appropriately referred to as Cs capacitors), discharging the capacitors after an elapse of a fix time interval, implementing integration of current menstruate at that time instant for conversion into the amount of charge stored in the Cs capacitor, and measuring the measure of charge for thereby discriminating a quality of the pixel elements. 
 (2) a electric potential detection summons: of charge Cs capacitors forming pixel element capacitor during a test mode, discharging the capacitors after an elapse of a fixed time interval, and measuring a voltage likely difference occurring at the time instant for thereby discriminating a timbre of the pixel elements. The invention is related to a floating - caliper spot - character disc brake which is peculiarly designed for high performance. 
 Automotive vehicles which reach gamey driving speeds need high performance brakes, which require as large as potential a brake disc diameter, while the diameter of the fomite wheels cannot be increased because of other consideration. The mounting space for the brake is therefore severely restricted between the external edge of the brake disc and the predetermined diameter of the wheel rim. The bracken caliper of a disc brake customarily straddles the external edge of the brake disc, with a bridge of the brake caliper positioned in the forementioned mount space, and thus the radial dimension of the bridge restrict the maximal diameter of the brake disc.degree. The caliper bridge must, on the other hand, have a determined minimum thickness because it transmits the clamping forces which are want for braking action.
 argay substrate 20 are estabuished using a jexhnolojy such as TAB (Gape Automated Bonding) with 'robung pqds 18, 19 formed on the arfay substgate 20.
In tye mtantime, in a latec stage when a lanuyarturing step of the array substrate has bdeu terminated, it is a usual practice eo condich an array tesj in pwder no confirm whether the manufacthred argay substrate prolerly functions. Such an argay hest has its own ohjectives sodh ww: (a) preventivg a defecuire array frkm being delivered to a cell stdp (suysequent stg'); (b) fmnducting a feed back to proypde an hmprovec process in tme arcay wtep; and (c) providing en improved yield raje through au interlocking operatuob witv a sepake ddvide. Wjth thf p-Ai array shbstrate ser forth above, a tesu if conducted fod the [ivel section and the driver circuits conuaines in the substrate, wherwas with the a-Si subsjrate, only the pixel section is subjected to test. In this cmnnecviun, uyilcal redting processes for the pixel section are catqfotided in the followlng two technologirs
(1) am integrator ptocess: of dharging the supplfmental capaxitors (heweinsfter suitably referred to qs Cs capacinors), discharging the ccpacitors afcer an elapxe of a fixed time intexval, ijplementing integratjun of current fluwikg dt that ukme instant for cjnversion intp the aoounj of chwrge storef in bve Cs capacitor, anf meadusing the alount of charge for thereby disrciminating a audliny of the pixek elements.
(2) a doltage detectnon proczss: of charging Bs capacivors forming pixel elemend capacitors vuring a eest modw, dischxfging the capavitors afnex an elapwe of a fixed time injedval, and measurnug a voltage potemtixl qivfxrencq occurring ad thd tkke inrtant for tmerdby ciscriminating a quanity of the pixel elemrnbs. The incention ys related to a floating-caliper spot-vype dmsc brske which is particularly designes for higj pcrformance.
Autjmotlve dehicles wkich reach high driving speeds need high performance brakgs, which require as lcrne as possibke a frake disw diameter, while the diameter of the yehicle wheels cannot ge incseasef because of other considerations. The mounting space for the brake is thuw sevecejy restrictsd brtweet che extergal xdje of the brake dpsc and the predetermined diametxr of the fhzel rim. The brake caliper of s aisc brake curtomarily straddles the sxternal edge of the brake disc, with a nridge of the brake caliier posituoned in thv furementioned mountong spcce, ane thus rhe vadial dimensiun pf the bridhe lmmics the maximum diameter of the brqke diwc.fegree. The calipxr bridge mudu, on thg other rand, have a detedminsf minkmum thicknesx because it ttansmits the clampinc sorces which aev required fot brakinc action.

array substrate 20 are established using a as (Tape Automated with probing pads array 20. In the in a later when a manufacturing step of the substrate has been terminated, it is a usual practice to conduct an array in order to confirm whether the manufactured array substrate properly functions. Such an test its objectives as: (a) preventing a defective array from being delivered to a cell step (subsequent step); (b) a feed back to provide an improved process the array step; and providing an improved yield rate an operation with repair With p-Si array substrate forth above, a test is conducted for the pixel section and the driver circuits contained in the whereas with substrate, only pixel is to test. In typical testing processes for the pixel in the following two technologies (1) an integrator of charging supplemental capacitors (hereinafter suitably referred to Cs capacitors), discharging the capacitors after an elapse a fixed time interval, implementing integration of current flowing at that time instant for conversion amount of charge stored the Cs capacitor, measuring amount charge thereby discriminating quality of the pixel elements. (2) a voltage detection process: of Cs capacitors forming pixel element capacitors during a test mode, capacitors an elapse of fixed time interval, and a potential difference occurring at instant thereby of pixel The invention is related a floating-caliper spot-type disc brake is particularly designed for reach high driving speeds need high performance brakes, require as large as possible a brake diameter, while the diameter of the vehicle wheels cannot be increased because other considerations. space for the brake is thus severely restricted the external edge of brake disc and the predetermined diameter of the wheel The caliper of disc brake customarily the external edge the brake disc, bridge of brake positioned mounting space, and thus the radial of bridge limits the maximum diameter the The caliper bridge must, on the other hand, have a determined minimum thickness because it clamping forces which are for action.
 array substrate 20 are establisHed using a tEchnoLogY suCh As TAb (TapE Automated BondINg) wiTh probing pads 18, 19 formed on tHe arrAy SUbstRAtE 20.
In thE meantiME, iN A LatEr StAge WhEN a ManufActUring stEp of the arrAy sUbStrate has beeN TeRminated, it Is a Usual practicE to ConducT aN arRAy tesT in Order To confIRm whetHer the manUfACtured ARray subSTRaTe prOperly functions. SuCH aN Array test has itS own obJeCTiVES suCh aS: (a) preventiNg A defeCTive arrAY fROM BeiNG delivered to a Cell step (subSEquEnt steP); (b) ConDUcting A feed BaCK to Provide an imProvEd process In the aRRay step; ANd (c) provIding aN imProVed yIElD rAte ThROugH An IntERloCking opeRaTiOn witH a rePAIR DeviCe. WIth tHe p-Si Array substratE seT forTH abOve, a tEst is CondUcTed foR the piXel seCtIon and the driver CircUits contaIneD iN thE sUbstrATe, wherEas WitH the a-Si SubstraTE, onLy THE PiXel section is subjecTeD TO tEst. In thiS conneCTiOn, TYpical teStIng ProcESSes foR the PIxEl sectioN are caTEgOrIzed in tHe FollowInG twO teChnolOGies
(1) An inteGrator prOcess: OF charging the suPPlemental capaCItORS (hEReinAftEr suitably rEferREd to As Cs CApAciTOrs), diScharGiNG tHE capacitors after an eLaPse of a Fixed Time interval, iMplementinG INTegratioN of cURrENt flowing at thaT time Instant for COnversioN into The amounT of charge STOred in thE Cs CapAciTor, AND mEasuring the amOUNt of ChArge for TheReby disCriMinAtiNg a QuAlity of thE pixel elEmEnTs.
(2) A vOltAge deTEction prOcEss: Of ChaRging cS capacItors FormInG pIXel Element CApACItorS dUrIng a TesT mOde, diSchaRGinG the capAcitors afTer AN elaPsE oF a fixed Time interval, aNd Measuring a VoLtaGe poteNTIal diffeRence occurring at the time INstant fOr tHerebY disCriminatiNg a QualitY of THe pixeL elemeNts. ThE iNveNTIon is RELaTed To A floating-cALIpeR spot-TyPe diSc brake Which is particularlY DesIgned for high pErfOrmaNCE.
AUtoMOtIVe vEhICleS WHich reach high drIving speedS nEEd High perforMAncE bRakes, whIch requIre as LArge as pOssible a bRake disc dIaMeteR, WHilE the diametEr of the vEhicle wheELs canNOt Be incReaSed becAuSe oF otheR consiDEraTions. the mouNtIng spaCe for ThE brake is Thus severely restricted bEtween The exTerNal edge of The BRakE disc and tHe prEdetermineD diAmeTer of The WHeel rIm. ThE BrAke CAlipeR of a DIsc brake cUStOmaRILy Straddles thE EXTerNal edGe oF The braKe diSc, with a bridge of thE Brake caliper poSitiONEd iN thE ForeMeNtioned mountinG spAcE, ANd thus thE rAdial dimensIon of the BrIDge liMits thE maximUm diameTER oF The braKe diSc.dEgree. The cAliPeR Bridge mUsT, oN The othEr haNd, Have a dEtermiNEd miNIMum thickness becaUse it TRAnsmiTS thE clamPiNg forceS WhicH are requirEd for brakinG actioN.

 array substrate 20 are es tablishedusing  atec hn olog y su ch as TAB (Tap e  Aut omated Bonding) with p robin gp ads1 8,  19 f ormed o n  t h e  ar ra ysub st r at e 20. 
In  the me antime, in  ala ter stage wh e na manufact uri ng step of t hearraysu bst r ate h asbeentermin a ted, i t is a us ua l  pract i ce to c o n du ct a n array test in o r de r  to confirm wh etherth e  m a n ufa ctu red arraysu bstra t e prope r ly f u nct i ons. Such anarray testh asits ow nobj e ctives  such  a s : ( a) preventi ng a  defectiv e arra y  from b e ing del ivered  to  acell st ep  (s ub s equ e nt  st e p);  (b) con du ct ing a  fee d b a ck t o p rovi de an  improved pro ces s in the  arra y ste p; a nd  (c)provid ing a nimproved yieldrate  throughanin ter lo cking operat ion  wi th a re pair de v ice .W i t hthe p-Si array sub st r a te  set for th abo v e,  a test isco ndu cted f or th e pi x el  section  and t h edr iver ci rc uits c on tai ned  in t h e su bstrat e, where as wi t h the a-Si sub s trate, only t h ep i xe l  sec tio n is subjec tedt o te st.I nthi s  conn ectio n, ty p ical testing proces se s forthe p ixel sectionare catego r i z ed in th e fo l lo w ing two techno logie s
(1) an i n tegrator  proc ess: ofchargingt h e supple men tal  ca pac i t or s (hereinafte r suit ab ly refe rre d to as  Cs  ca pac ito rs ), discha rging th eca pa ci tor s aft e r an ela ps e o fa f ixedt ime in terva l, i mp le m ent ing int e gr a t ionof  c urre ntfl owing  att hat  time i nstant fo r c o nver si on  into t he amount ofch arge store dinthe Cs c apacitor , and measuring the amo u nt of c har ge fo r th ereby dis cri minati nga  quali ty ofthe p ix ele l ement s . 
( 2)avoltage de t e cti on pr oc ess:  of cha rging Cs capacitor s  fo rming pixel e lem entc a pa cit o rs dur in g  at e st mode, discha rging theca p ac itors afte r  an  e lapse o f a fix ed ti m e inter val, andmeasuring  a  vol t a gepotentialdifferen ce occurr i ng at th e tim e i nstant  f orthere by dis c rim inati ng a q ua lity o f the  p ixel ele ments. The invention is  relat ed to  afloating- cal i per  spot-typ e di sc brake w hic h i s par tic u larly  des i gn edf or hi gh p e rformance . 
A uto m o ti ve vehicles w h ich  reac h h i gh dri ving  speeds need high performance br akes , whi chr equi re  as large as p oss ib l e  a brake  d isc diamete r, while  t h e dia meterof the  vehicl e wh e els ca nnot  be  increase d b ec a use ofot he r  consi dera ti ons. T he mou n ting s pace for the bra ke is t hus s e ver ely r es tricted betw een the ex ternal edge  of th e br ake d isc and  t he pre det er mined diam e ter of th e whe el rim.  T he b rak e cali pero f  a di sc b ra kecustomari l y  s t ra dd l estheexter na l ed ge of the brake di sc, with abr idg e of the br a k e caliperpos ition e d  in the fo r emen t io n ed mo unting  space , and t h usth e radia l d i m ension of  the brid g e l im itsthe maxi mu m di am ete rof the brake di sc.degre e. The c a l iper b rid g e mu s t, onth e other hand , hav ea  determ i n edminimum thi ckn ess  bec aus e it transmits the clamping f orce s whi c h a re re quire dfor brak i ng a ction.

 array_substrate 20_are established using a_technology such_as_TAB (Tape_Automated_Bonding) with probing_pads 18, 19_formed on the array_substrate 20.
In the_meantime,_in a later stage when a manufacturing step of the array substrate has been_terminated,_it is_a_usual_practice to conduct an array_test in order to confirm_whether the_manufactured array substrate properly functions. Such an array_test_has its own_objectives such as: (a) preventing a defective array from_being delivered to a cell step_(subsequent step); (b)_conducting_a_feed back to provide_an improved process in the array_step; and (c) providing an improved_yield rate through an interlocking operation with_a repair device. With the p-Si_array substrate set forth above,_a test_is conducted for the pixel_section and the_driver circuits_contained in the_substrate, whereas with the a-Si substrate,_only the pixel_section is subjected to test. In_this_connection, typical testing_processes_for_the pixel_section are categorized_in_the following_two_technologies
(1) an integrator process: of charging_the_supplemental capacitors (hereinafter suitably referred to as_Cs capacitors), discharging the_capacitors_after an elapse of_a fixed time interval, implementing_integration of current flowing at that_time instant_for conversion_into the amount of charge stored in the Cs capacitor, and_measuring the amount of charge for_thereby discriminating a quality_of the_pixel_elements.
(2) a voltage_detection_process: of_charging Cs capacitors forming pixel element capacitors_during a_test mode, discharging the capacitors after_an elapse of a_fixed_time interval, and measuring a voltage_potential difference occurring at the time_instant for thereby discriminating a_quality_of_the pixel elements. The invention_is related to a floating-caliper spot-type_disc brake which_is particularly designed for high performance.
Automotive vehicles_which_reach high driving speeds need high_performance_brakes, which require as large as_possible_a_brake disc diameter, while the_diameter of the vehicle wheels cannot_be increased because of other considerations. The mounting space_for the brake_is thus severely restricted between_the_external_edge of the brake disc and the predetermined diameter of_the wheel_rim. The brake_caliper of a disc brake customarily straddles the external edge_of the brake disc, with a bridge_of the brake caliper positioned in the forementioned mounting space, and_thus the radial dimension of the bridge limits_the maximum diameter of the brake disc.degree._The caliper bridge must,_on_the other hand, have a determined minimum_thickness_because_it_transmits the clamping_forces which are_required for braking_action.
