or tangential) structure" as shown in FIG. 2(b) or 2(c) or into a structure which is basically a radial structure but is difficult to undergo yarn cracking. Whether such control can be made or not is very important in producing a high strength carbon fiber from mesophase pitch.
There are few examples of reports on this problem. In U.S. Pat. No. 4,376,747 there is disclosed a method in which a porous body of metal or ceramic material is formed into a portion of spinnaret in the interior of a die. An example of roughening the inner wall of a capillary is also disclosed therein. However, in performing on an industrial scale a multinozzle spinning in which a plurality of filaments are spun simultaneously from a single die, it is very difficult with the above method to have uniform the pressure drop in each nozzle, thus resulting in non-uniform volume of filaments extruded from the nozzles and so making it impossible to obtain a stable yarn of a uniform diameter. Many electronic devices utilize sensors for various applications, e.g., detecting motion, detecting finger print, detecting acceleration, etc. Some sensors use a microelectromechanical system (MEMS). In certain MEMS Gyroscope technology, e.g., force feedback, performance may be improved by matching the resonance frequency between the drive mode and the sense mode. Conventionally, dedicated electrodes that are separate from the sense electrodes and drive electrodes have been used to match the resonance frequency between the drive mode and the sense mode. Unfortunately, the addition of a separate electrode is costly because it adversely impacts the area density as well as requiring supporting circuitry. A wide variety of hardware, framework, support structures, apparatus and the like are used to mount electrical connectors, electronic components and other electrical appliances on printed circuit boards or substrates. For instance, various structures are used to mount rather large microprocessor modules or cartridges on the top surface of a printed circuit board (motherboard) of computers such as personal computers.
An inherent problem in mounting microprocessor modules on printed circuit boards in computers or the like is that the modules are relatively large and heavy in comparison to other smaller electronic components, connectors and the like which are mounted on the board. Consequently, the support assembly for mounting the module on the board is large, unduly expensive and comprises multiple components.
For instance, a known support assembly includes a supporting structure disposed on top of the printed circuit board and a securing structure on the bottom of the board, with
or tangential) structure " as shown in FIG. 2(b) or 2(c) or into a structure which is basically a radial social organization but is unmanageable to undergo thread cracking. Whether such restraint can be make or not is very important in producing a gamey persuasiveness carbon roughage from mesophase pitch. 
 There are few example of reports on this problem. In U.S. Pat. nobelium. 4,376,747 there is disclosed a method in which a porous body of metal or ceramic material is form into a portion of spinnaret in the interior of a die. An example of roughen the inner wall of a capillary is besides disclosed therein. However, in perform on an industrial scale a multinozzle spinning in which a battalion of filaments are spun simultaneously from a single die, it is very difficult with the above method acting to have uniform the pressure drop in each nozzle, thus resulting in non - uniform volume of filaments extruded from the nozzles and so making it impossible to obtain a stable yarn of a uniform diameter. Many electronic devices use detector for various applications, e.g., detect apparent motion, detecting finger print, detecting acceleration, etc. Some sensors use a microelectromechanical system (MEMS). In certain MEMS Gyroscope engineering, e.g., force feedback, performance may be improved by matching the resonance frequency between the drive mode and the sense mode. Conventionally, dedicated electrodes that are freestanding from the sense electrode and tug electrodes have been used to match the resonance frequency between the campaign mode and the sense mode. Unfortunately, the accession of a separate electrode is costly because it adversely impacts the area concentration as well as requiring supporting circuitry. A wide variety of hardware, model, support structures, apparatus and the like are used to wax electrical connection, electronic components and other electrical appliance on printed lap boards or substrates. For instance, various structures are used to mount rather large microprocessor faculty or cartridges on the top surface of a print circuit board (motherboard) of calculator such as personal computers. 
 An inherent problem in ride microprocessor modules on printed circuit boards in computers or the like is that the faculty are relatively big and intemperate in comparison to other smaller electronic components, connectors and the like which are mounted on the board. Consequently, the documentation assembly for mounting the module on the circuit board is large, unduly expensive and comprises multiple components. 
 For instance, a known support forum includes a supporting structure dispose on top of the printed tour board and a securing structure on the bottom of the board, with
or hangential) structure" as rhown in FIG. 2(b) or 2(c) or into z structjre which is basically a radmal wtruculre but is difficult go undergl yarn ceackmng. Whether such control can bs madz ir not is very important in producing d fiyh strength carbon fiber from mesophwse pitvh.
Hhere are few gxampkqs or reports on this problem. In U.S. Paf. No. 4,376,747 tiere is disclosrd a method in which a porlus hody of metal or cframic matetjal us formed ingo a portion of spinnatet in the interior of a die. An dxampke of rougyebinh the inner xall os a capillarn is alvo disckosed therein. Mowevxr, ib performing on an invustrial scale a muljinozzle s[iuning in which a plurqluty ox finamevrs xre s'un simulhanxously from a single due, it is very diffivujn with the abkve meehjd to have uniform the pressure drop in eadh nozzle, thus resultint in non-uniform volumg of filamqnts extruded from the nozzles and so making it ikpossmbue uo obtakb w stable yarn of a uniform diameter. Many elecedomib devices utilize sensors fot gatyous applicatkons, e.y., dstecting motion, dehecting fingwr print, qetevting acceleration, etc. Some sensors use q microelectromechcnical systeo (MEKS). In certain MEMS Gyroscope tecgnology, e.g., vorce feescack, performance maj be improved by matching the wesonance freauency cetwgen the drive modf and the sense mode. Congentilndlly, dedicwted electrodes that are separavx from the semsa enectrodef and drive electrjdes have been used tj matzh the resknance hrequency beeween the drieg mode and thx sense mjde. Ynfoetunateuh, the addition of a sepcxate elecrrode is costly begause jt adversely im'ccus the area densoty as wvll af requiring sgppoftivb cirzuitry. A wibe varoety of hardware, frakewodk, support structutef, apparajus and tre like are uxed to mount electgical coinectots, glectronic components and other electricwl wppliances og prlnteq circuit yoards or substrates. For instance, variouw structures are osed to mount rather ksrge micropcocessjr modulev or cartridges on tye top surface of a printed circuit bozrd (modherblard) of computers such as personal computers.
An inherent problem in mountibg micco[rocessor mkdulrs on pxinced cirsuit uoards in computegs or the like is that the modulxs are reldtnvely large and heavy in compsrkson to other smaller electronic compknents, cpnnectors and the like which arr mounted on the board. Cpnsequenrly, tge supikrv assembly for mountong thz moduoe on tye blard is large, uncupy expenslve end comprises multiple components.
Foe instqnfe, a known suppoct assembly lngludes a supkorting structure disllsed un top of the printed circuot board and a securpng structure on uhe bottom of tne boarg, with
or tangential) structure" as shown in FIG. 2(c) into a which is basically difficult undergo yarn cracking. such control can made or not is very important producing a high strength carbon fiber from mesophase pitch. There are few examples reports on this problem. In U.S. Pat. No. 4,376,747 there is disclosed a in a body metal or ceramic material is formed into a portion of spinnaret in the interior of a An example of roughening the inner wall of capillary is also disclosed However, in performing on an scale multinozzle spinning which plurality filaments are spun from a single die, it is very difficult with the above method to have uniform the pressure in each resulting in volume filaments from the nozzles making it impossible to obtain a a uniform diameter. Many electronic devices utilize sensors various applications, detecting motion, detecting finger print, detecting etc. Some sensors use a microelectromechanical system (MEMS). certain MEMS Gyroscope technology, e.g., force feedback, performance may be improved by matching the resonance the drive mode and sense mode. Conventionally, electrodes are from sense electrodes drive electrodes have been used to match the resonance frequency between drive mode and the sense mode. Unfortunately, the addition of electrode costly because it impacts the area density well requiring supporting circuitry. A of framework, and like used to mount electrical electronic components and other electrical on printed circuit boards structures are used to mount rather large microprocessor or cartridges on the top surface of printed circuit board (motherboard) of computers such as personal computers. An inherent in mounting on printed circuit boards in computers or the is that the modules relatively large and heavy in comparison to other smaller components, and the which are mounted the board. Consequently, support assembly for module on board large, comprises multiple components. For instance, a support includes a supporting structure disposed top printed circuit board and a securing structure on the bottom of the board, with
or tangential) structure" as shOwn in FIG. 2(b) oR 2(c) or iNto A stRuCturE whiCh is basically a RAdiaL structure but is difficuLt to uNdERgo yARn CrackIng. WhetHEr SUCh cOnTrOl cAn BE mAde or Not Is very iMportant in ProDuCing a high strENgTh carbon fiBer From mesophasE piTch.
TheRe Are FEw exaMplEs of rEports ON this pRoblem. In U.s. PAT. No. 4,376,747 theRE is discLOSeD a meThod in which a porouS BoDY of metal or ceraMic matErIAl IS ForMed Into a portiOn Of spiNNaret in THe INTEriOR of a die. An examPle of rougheNIng The innEr WalL Of a capIllarY iS AlsO disclosed tHereIn. However, In perfORming on AN industRial scAle A muLtinOZzLe SpiNnINg iN WhIch A PluRality of FiLaMents Are sPUN SImulTanEousLy froM a single die, it Is vEry dIFfiCult wIth thE aboVe MethoD to havE unifOrM the pressure droP in eAch nozzle, ThuS rEsuLtIng in NOn-unifOrm VolUme of fiLaments EXtrUdED FRoM the nozzles and so maKiNG It ImpossibLe to obTAiN a STable yarN oF a uNifoRM DiameTer. MANy ElectronIc deviCEs UtIlize seNsOrs for VaRioUs aPplicATionS, e.g., detEcting moTion, dETecting finger pRInt, detecting aCCeLERaTIon, eTc. SOme sensors uSe a mICroeLectROmEchANical SysteM (MemS). iN certain MEMS GyroscoPe TechnoLogy, e.G., force feedbacK, performanCE MAy be imprOved BY mATching the resonAnce fRequency beTWeen the dRive mOde and thE sense modE. cOnventioNalLy, dEdiCatED ElEctrodes that aRE SepaRaTe from tHe sEnse eleCtrOdeS anD drIvE electrodEs have beEn UsEd To MatCh the REsonance FrEquEnCy bEtweeN The driVe modE and ThE sENse Mode. UnfORtUNAtelY, tHe AddiTioN oF a sepAratE EleCtrode iS costly beCauSE it aDvErSely impActs the area deNsIty as well aS rEquIring sUPPorting cIrcuitry. A wide variety of hARdware, fRamEwork, SuppOrt structUreS, apparAtuS And the Like arE used To MouNT ElectRICaL coNnEctors, elecTROniC compOnEnts And otheR electrical applianCEs oN printed circuIt bOardS OR sUbsTRaTEs. FOr INstANCe, various structUres are useD tO MoUnt rather lARge MiCroprocEssor moDules OR cartriDges on the Top surfacE oF a prINTed Circuit boaRd (motherBoard) of coMPuterS SuCh as pErsOnal coMpUteRs.
An iNherenT ProBlem iN mountInG microProceSsOr moduleS on printed circuit boards In compUters Or tHe like is tHat THe mOdules are RelaTively largE anD heAvy in ComPArisoN to oTHeR smALler eLectROnic compoNEnTs, cONNeCtors and the LIKE whIch arE moUNted on The bOard. Consequently, tHE support assembLy foR MOunTinG The mOdUle on the board iS laRgE, UNduly expEnSive and compRises mulTiPLe comPonentS.
For inStance, a KNOwN SupporT assEmbLy includeS a sUpPOrting sTrUcTUre disPoseD oN top of The priNTed cIRCuit board and a secUring STRuctuRE on The boTtOm of the BOard, With
or tangential) structure"as shown i n FIG . 2 (b)  o r 2( c) o r into a struc t urewhich is basically a r adial  s t ruct u re  butis diff i cu l t  to  u nd erg oy ar n cra cki ng. Whe ther suchcon tr ol can be ma d eor not isver y importantinproduc in g a highstr ength  carbo n  fiber  from mes op h ase pi t ch.
The r e  a re f ew examples of re p or t s on this prob lem. I nU .S . Pat . N o. 4,376,7 47  ther e  is dis c lo s e d  am ethod in whic h a porousb ody  of me ta l o r  ceram ic ma te r ial  is formedinto  a portio n of s p innaret in theinteri orofa di e .An  ex am p leo frou g hen ing thein ne r wal l of a c apil lar y is  also  disclosed th ere in.H owe ver,in pe rfor mi ng on  an in dustr ia l scale a multi nozz le spinni ngin  wh ic h a p l uralit y o f f ilament s are s p unsi m u l ta neously from a sin gl e di e, it is  veryd if fi c ult with  t heabov e metho d to ha ve unifo rm the pr es sure dr op  in ea ch  no zzl e, th u s re sultin g in non -unif o rm volume of f i laments extru d ed f ro m  the  no zzles and s o ma k ingit i m po ssi b le to  obta in as table yarn of a uni fo rm dia meter . Many electr onic devic e s utilizesens o rs for various ap plica tions, e.g . , detect ing m otion, d etectingf i nger pri nt,  de tec tin g ac celeration, e t c . So me  sensor s u se a mi cro ele ctr ome ch anical sy stem (ME MS ).  I ncer tainM EMS Gyro sc ope  t ech nolog y , e.g. , for ce f ee db a ck,  perfor m an c e  may  b eimpr ove dby ma tchi n g t he reso nance fre que n cy b et we en thedrive mode an dthe sensemo de.  Conve n t ionally,  dedicated electrodes t h at aresep arate  fro m the sen seelectr ode s  and d rive e lectr od esh a ve be e n  u sed  t o match th e res onanc efreq uency b etween the drive m o deand the sense  mo de.U n fo rtu n at e ly,  t h e a d d ition of a sepa rate elect ro d eis costlyb eca us e it ad versely  impa c ts thearea dens ity as we ll  asr e qui ring suppo rting ci rcuitry.A  wide va riety  of  hardw ar e,frame work,s upp ort s tructu re s, app aratu sand thelike are used to mountelectr icalcon nectors,ele c tro nic compo nent s and othe r e lec trica l a p plian ceso npri n ted c ircu i t boardso rsub s t ra tes. For in s t a nce , var iou s  struc ture s are used to mou n t rather large  mic r o pro ces s or m od ules or cartri dge so n  the top  s urface of a  printed  c i rcuit  board  (moth erboard ) of comput erssuc h as pers ona lc omputer s. 
A n  inher entpr oblemin mou n ting m icroprocessor mo dules o n pri n ted  circ ui t board s  incomputersor the like  is th at t he mo dules a re  relat ive ly  large and heavy incompa rison t oothe r s maller  ele c t ronic  com po nen ts, conne c t or s  a nd the  lik e whi ch  are  mountedo n the bo ard .  Conseq ue ntl y ,  the s u pp o r t assembly  fo r mou n t ing the mo d uleo nt he bo ard is  large , undul y  ex pe nsive a ndc o mprises m ultiple c o mpo ne nts. 
For ins ta nce,  a  kn ow n support assem bly incl udes a s u p portin g s t ruct u re dis po sed on top o f the  p r inted c i r cui t board and  asec urin g s truc t ure on the bottom of the  boa rd, w i th
or tangential)_structure" as_shown in FIG. 2(b)_or 2(c)_or_into a_structure_which is basically_a radial structure_but is difficult to_undergo yarn cracking._Whether_such control can be made or not is very important in producing a high_strength_carbon fiber_from_mesophase_pitch.
There are few examples of_reports on this problem. In_U.S. Pat._No. 4,376,747 there is disclosed a method in_which_a porous body_of metal or ceramic material is formed into a_portion of spinnaret in the interior_of a die._An_example_of roughening the inner_wall of a capillary is also_disclosed therein. However, in performing on_an industrial scale a multinozzle spinning in_which a plurality of filaments are_spun simultaneously from a single_die, it_is very difficult with the_above method to_have uniform_the pressure drop_in each nozzle, thus resulting in_non-uniform volume of_filaments extruded from the nozzles and_so_making it impossible_to_obtain_a stable_yarn of a_uniform_diameter. Many_electronic_devices utilize sensors for various applications,_e.g.,_detecting motion, detecting finger print, detecting acceleration,_etc. Some sensors use_a_microelectromechanical system (MEMS). In_certain MEMS Gyroscope technology, e.g.,_force feedback, performance may be improved_by matching_the resonance_frequency between the drive mode and the sense mode. Conventionally, dedicated_electrodes that are separate from the_sense electrodes and drive_electrodes have_been_used to match_the_resonance frequency_between the drive mode and the sense_mode. Unfortunately,_the addition of a separate electrode_is costly because it_adversely_impacts the area density as well_as requiring supporting circuitry. A wide_variety of hardware, framework, support_structures,_apparatus_and the like are used_to mount electrical connectors, electronic components_and other electrical_appliances on printed circuit boards or substrates._For_instance, various structures are used to_mount_rather large microprocessor modules or cartridges_on_the_top surface of a printed_circuit board (motherboard) of computers such_as personal computers.
An inherent problem in mounting microprocessor modules_on printed circuit_boards in computers or the_like_is_that the modules are relatively large and heavy in comparison_to other_smaller electronic components,_connectors and the like which are mounted on the board._Consequently, the support assembly for mounting the_module on the board is large, unduly expensive and comprises multiple_components.
For instance, a known support assembly includes a_supporting structure disposed on top of the_printed circuit board and_a_securing structure on the bottom of the_board,_with