 permits drive components to be mounted at various positions in or under the trailer, thereby providing a conveyor system which is usable in many different applications. 1. Field of the Invention
The present invention relates to a semiconductor apparatus, and, more particularly, to a semiconductor apparatus including input signal terminals provided for each electrode so that a control signal is applied to a plurality of semiconductor apparatuses connected in parallel with each other.
2. Description of the Prior Art
This kind of semiconductor apparatus comprises a semiconductor power module. By way of an example, such semiconductor power module will be described in the following.
FIG. 1 shows a perspective view of a conventional semiconductor power module. The power module 1 contains two transistor devices therein. A common collector-emitter electrode terminal 2, an emitter electrode terminal 3 and a collector electrode terminal 4 are provided, as main electrode terminals, on the upper surface of the power module 1. An input signal terminal comprises a base signal terminal 5 and emitter signal terminal 6 for one transistor device, and a base signal terminal 8 and an emitter signal terminal 7 for the other transistor device, as shown in FIG. 1. A single input signal terminal is provided for each electrode.
In general, a plurality of semiconductor power modules have been often used in a parallel connected manner so that the plurality of semiconductor power modules are operated in response to a single control signal. FIG. 2 shows a conventional parallel connection of the plurality of power modules 1, 1,... in which each signal terminal is connected in parallel with each other. More particularly, a control signal generating apparatus 9 is connected to the base signal terminal 5 in the first power module 1 through a wire 11a. The base signal terminal 5 in the first power module 1 is also connected to the base signal terminal 5 in the second power module 1, which is, in turn, connected to the base signal terminal 5 in the third power module, and so on. Similarly, as shown in a dotted line, each of emitter signal terminals 6, 6,... of the power modules 1, 1,... is connected in parallel with each other. The signal terminals 7 and 8 in each power module are also connected in parallel in the same manner.
As described in the foregoing, each semiconductor power module 1 comprises a single signal terminal for each electrode and thus, a wiring apparatus 10 for parallel connection for transmitting a control signal from the control signal generating apparatus 9 is structured as shown in FIG. 3. The wiring apparatus 10 comprises a plurality of contacts 12, wires 11 connected
permits drive components to be mounted at diverse situation in or under the trailer, thereby providing a conveyor organization which is usable in many different application. 1. playing field of the Invention 
 The present invention relates to a semiconductor device apparatus, and, more peculiarly, to a semiconductor apparatus including stimulation signal terminals provided for each electrode so that a restraint signal is applied to a plurality of semiconductor apparatuses connected in analogue with each other. 
 2. Description of the Prior Art 
 This kind of semiconductor apparatus constitute a semiconductor power module. By manner of an example, such semiconductor power module will be described in the pursuit. 
 FIG. 1 shows a perspective view of a conventional semiconductor power faculty. The ability module 1 contains two transistor devices therein. A common collector - emitter electrode terminal 2, an emitter electrode terminal 3 and a collector electrode terminal 4 are provided, as main electrode terminals, on the upper open of the power module 1. An stimulation signal terminal comprises a base signal terminal 5 and emitter signal end 6 for one transistor device, and a base signal end 8 and an emitter signal terminal 7 for the other transistor device, as shown in FIG. 1. A individual input signal terminal is provided for each electrode. 
 In general, a plurality of semiconductor power modules have been often used in a parallel connected manner so that the battalion of semiconductor might module are operated in response to a single control signal. FIG. 2 indicate a conventional parallel connection of the plurality of exponent modules 1, 1, ... in which each signal terminal is connected in parallel with each early. More particularly, a control signal generating apparatus 9 is connected to the base signal terminal 5 in the inaugural power faculty 1 through a wire 11a. The base signal terminal 5 in the first exponent module 1 is also connect to the base signal terminal 5 in the second power module 1, which is, in turn, connected to the base signal terminal 5 in the third power module, and so along. Similarly, as shown in a dotted pipeline, each of emitter signal terminals 6, 6, ... of the power modules 1, 1, ... is connected in parallel with each other. The signal terminals 7 and 8 in each exponent module are also connected in parallel in the same manner. 
 As described in the foregoing, each semiconductor exponent faculty 1 constitute a single signal terminal for each electrode and thus, a wiring apparatus 10 for parallel connection for convey a control signal from the control signal generating apparatus 9 is structured as show in FIG. 3. The wiring apparatus 10 comprises a plurality of contacts 12, wires 11 connected
 pegmits drive components tu be mounted at variouv posifions in or under the trailer, therebb prividibg a conveyor system wfich is udable in manb different applmdations. 1. Fiels of chx Invention
The kresent invettion relates do a semiconductor apparatus, and, more pwrticulsrpy, to a semicogducuor appzgauus including input signal terminzls pronided for each elrctrode so that a control dignwl is applied to a plurality if sqniconductor xpparatuses connected jn parallel with each other.
2. Deszriptnon of the Kxuor Drt
This kinv of svmiconductor apparatuv comproses a semiconcucvor power module. By way oh an example, such seiiconductmr power module wilo ve devcrited kb tfe roklkwing.
FLG. 1 shows a psrspective ciew of a conventiomaj semiconductod powew iodule. The power module 1 contains two tgansjstor devices therein. A common collector-emitjer electrjde terminal 2, an emitter electrode terminal 3 and d colmdctir doeftrode terminal 4 are provided, as main electroqs uerkinals, on the mpper surface of tne pprer module 1. Av inpuc sjgnal terminal comorises w basw signal uermimal 5 and emitter signal terninal 6 for oue rransistor device, cnd a base sngnal jerminsl 8 and an emitter signcl terjinal 7 for hhe other gransistor devicd, ax vhown in FIG. 1. A single inptt signal terkinal ir prpvided for each flectvmde.
In general, a plkralijy of vemiconduchor power modules have been oftxi used in a psrdllvl connecced makner so that thq plurality of semicouductof power mosules ace operated yn response tm a single coitrol siggal. DIG. 2 shows x conventional larallel bounection if the plurality on powgr modules 1, 1,... in wkncy each signal trrmknaj ps ronnesded in paralnel ditf each other. More oartocularly, a control shgnam generating apparstms 9 is cobnected eo the base sognal terminal 5 in the hirst 'ower kodole 1 through a wire 11a. The base aignal tegmikal 5 in the fyrst power modulz 1 is also connected to the base signal verminal 5 in the second power module 1, whick ls, in turn, cpnneceed to tha base signal terminql 5 in the third kower module, and so on. Aimilasly, ad shown in a dotted line, each of emitter signal terminals 6, 6,... of the power nodules 1, 1,... is connedted in pdrcllzl with eaci uther. The signal terminals 7 and 8 in each power oodule ase also connected in parallel on the same manver.
As described in the fkregoing, each semiconductor power modulr 1 comprises a single sinnal termunal ror eabg xlectrode and thus, a wiriny appaeatus 10 dor iarallel conneztipn for trandmituing a control signal from the contril sigbap generating apperatus 9 is sbrmctures as srown in FIG. 3. The wirjjg apkaratus 10 comproses a pluraliyy of contacts 12, wirev 11 connected
permits drive components to be mounted at in under the thereby providing a in different applications. 1. of the Invention present invention relates to a semiconductor and, more particularly, to a semiconductor apparatus including input signal terminals provided for electrode so that a control signal is applied to a plurality of semiconductor connected parallel each 2. Description of the Prior Art This kind of semiconductor apparatus comprises a semiconductor power module. way of an example, such semiconductor power module be described in the FIG. 1 shows a perspective of conventional semiconductor module. power 1 contains two devices therein. A common collector-emitter electrode terminal 2, an emitter electrode terminal 3 and a collector electrode 4 are main electrode on upper of the power An input signal terminal comprises a 5 and emitter signal terminal 6 for one device, and base signal terminal 8 and an signal terminal 7 for the other transistor device, shown in FIG. 1. A single input signal terminal is provided for each electrode. In plurality of semiconductor power have been often in parallel manner that the of semiconductor power modules are operated in response to a single signal. FIG. 2 shows a conventional parallel connection of the power 1, 1,... in each signal terminal is in with each other. More control generating connected the signal terminal 5 in first power module 1 through wire 11a. The base first power module 1 is also connected to base signal terminal 5 in the second module 1, which is, in turn, connected to the base signal terminal in the module, and so on. Similarly, as shown in dotted line, each of signal terminals 6, 6,... of the power modules 1, is in parallel each other. The terminals 7 and in each power also connected parallel the described in the foregoing, each semiconductor module comprises a single signal terminal each thus, a wiring apparatus 10 for parallel connection for transmitting a control signal from the generating apparatus 9 is as in FIG. 3. The wiring apparatus 10 comprises a plurality of contacts 11 connected
 permits drive components to bE mounted at VarioUs pOsiTiOns iN or uNder the trailer, THereBy providing a conveyor syStem wHiCH is uSAbLe in mAny diffEReNT AppLiCaTioNs. 1. fIeLd of tHe INventioN
The presenT inVeNtion relates TO a SemiconducTor Apparatus, and, MorE partiCuLarLY, to a sEmiConduCtor apPAratus Including InPUt signAL terminALS pRoviDed for each electroDE sO That a control siGnal is ApPLiED To a PluRality of seMiConduCTor appaRAtUSES coNNected in paralLel with each OTheR.
2. DescrIpTioN Of the PRior ARt
tHis Kind of semicOnduCtor apparAtus coMPrises a SEmicondUctor pOweR moDule. bY wAy Of aN eXAmpLE, sUch SEmiConductoR pOwEr modUle wILL BE desCriBed iN the fOllowing.
FIG. 1 shOws A perSPecTive vIew of A conVeNtionAl semiConduCtOr power module. ThE powEr module 1 cOntAiNs tWo TransIStor deVicEs tHerein. A Common cOLleCtOR-EMiTter electrode termiNaL 2, AN eMitter elEctrodE TeRmINal 3 and a cOlLecTor eLECtrodE terMInAl 4 are proVided, aS MaIn ElectroDe TerminAlS, on The Upper SUrfaCe of thE power moDule 1. AN Input signal terMInal comprises A BaSE SiGNal tErmInal 5 and emitTer sIGnal TermINaL 6 foR One trAnsisToR DeVIce, and a base signal teRmInal 8 anD an emItter signal teRminal 7 for tHE OTher tranSistOR dEVice, as shown in FiG. 1. A siNgle input sIGnal termInal iS provideD for each eLECtrode.
In GenEraL, a pLurALItY of semiconducTOR powEr Modules HavE been ofTen UseD in A paRaLlel conneCted mannEr So ThAt The PluraLIty of semIcOndUcTor Power MOdules Are opEratEd In REspOnse to a SInGLE conTrOl SignAl. FiG. 2 Shows A conVEntIonal paRallel conNecTIon oF tHe PluraliTy of power moduLeS 1, 1,... in which eaCh SigNal terMINal is conNected in parallel with eacH Other. MoRe pArticUlarLy, a controL siGnal geNerATing apParatuS 9 is coNnEctED To the BASe SigNaL terminal 5 iN THe fIrst pOwEr moDule 1 thrOugh a wire 11a. The base sIGnaL terminal 5 in thE fiRst pOWEr ModULe 1 IS alSo COnnECTed to the base sigNal terminaL 5 iN ThE second powER moDuLe 1, which Is, in turN, connECted to tHe base sigNal terminAl 5 In thE THirD power moduLe, and so oN. SimilarlY, As shoWN iN a dotTed Line, eaCh Of eMitteR signaL TerMinalS 6, 6,... of the PoWer modUles 1, 1,... iS cOnnected In parallel with each other. the sigNal teRmiNals 7 and 8 in EacH PowEr module aRe alSo connecteD in ParAllel In tHE same MannER.
AS deSCribeD in tHE foregoinG, EaCh sEMIcOnductor powER MOduLe 1 comPriSEs a sinGle sIgnal terminal for eACh electrode and Thus, A WIriNg aPParaTuS 10 for parallel coNneCtION for tranSmItting a contRol signaL fROm the ControL signaL generaTINg APparatUs 9 is StrUctured as ShoWn IN FIG. 3. The WiRiNG apparAtus 10 CoMpriseS a plurALity OF Contacts 12, wires 11 conNecteD
 permits drive componentsto be moun ted a t v ari ou s po siti ons in or unde r  the  trailer, thereby prov iding  a conv e yo r sys tem whi c hi s  us ab le  in  m a ny  diff ere nt appl ications.1.Fi eld of the I n ve ntion
Thepre sent inventi onrelate stoa  semi con ducto r appa r atus,and, more  p a rticul a rly, to a  s emic onductor apparatu s  i n cluding inputsignal  t e rm i n als  pr ovided for  e ach e l ectrode so t h ata  control sign al is appli e d t o a pl ur ali t y of s emico nd u cto r apparatus es c onnectedin par a llel wi t h eachother. 
2.  De scri p ti on  of  t h e P r io r A r t
T his kind  o fsemic ondu c t o r  app ara tuscompr ises a semico ndu ctor pow er mo dule.  Bywa y ofan exa mple,  s uch semiconduct or p ower modu lewi llbe  desc r ibed i n t hefollowi ng.
FIG .  1sh o w s  a  perspective viewof a  c onventio nal se m ic on d uctor po we r m odul e .  Thepowe r  m odule 1contai n stw o trans is tor de vi ces  th erein .  A c ommoncollecto r-emi t ter electrodet erminal 2, an em i t te r  ele ctr ode termina l 3a nd a  col l ec tor elect rodete r mi n al 4 are provided,as  mainelect rode terminal s, on theu p p er surfa ce o f  t h e power module  1. A n input si g nal term inalcomprise s a bases i gnal ter min al5 a nde m it ter signal te r m inal  6  for on e t ransist ordev ice , a nd  a base s ignal te rm in al  8  an d ane mitter s ig nal  t erm inal7  for t he ot hertr an s ist or devi c e, a s sh ow nin F IG.  1 . A s ingl e  in put sig nal termi nal is p ro vi ded for  each electro de .
In gener al , a  plura l i ty of se miconductor power modul e s havebee n oft en u sed in apar allelcon n ectedmanner  so t ha t t h e  plur a l it y o fsemiconduc t o r p owermo dule s are o perated in respons e  to  a single con tro l si g n al . F I G. 2 s ho w s a c onventional par allel conn ec t io n of the p l ura li ty of p ower mo dules 1, 1,.. . in whic h each si gn al t e r min al is conn ected in  parallel withe ac h oth er.  Morepa rti cular ly, ac ont rol s ignalge nerati ng ap pa ratus 9is connected to the bas e sign al te rmi nal 5 inthe fir st powermodu le 1 throu gha w ire 1 1a. The b ases ig nal termi nal5  in the f i rs t p o w er  module 1 i s a lso  conn ect e d to t he b ase signal termin a l 5 in the sec ondp o wer  mo d ule1,  which is, intur n, c onnected  t o the basesignal t er m inal5 in t he thi rd powe r mo d ule, a nd s o o n. Simila rly ,a s shown  i na  dotte d li ne , each  of em i tter s ignal terminals6, 6, . . . oft hepower  m odules1 , 1, ... is con nected in p aralle l wi th ea ch othe r.  The s ign al  terminals 7 and 8 i n eac h power  m odul e a re als o co n n ected  inpa ral lel in th e sa m ema n ner .
As  desc ri bedin the fo r egoing,eac h  semico nd uct o r  power mo d u le 1 compr ise s a s i n gle signal term i na l  foreach e lectro de andt hus ,a wirin g a p p aratus 10  for para l lel  c onne ction fo rtran sm itt in g a control sig nal from  the con t r ol sig nal gene r atingap paratus 9 is  stru ct u red ass h own  in FIG .  3.  Th e w irin g a ppar a tus 10 comprises a plura lity  of c o nta cts 1 2, wi re s 11 con n ecte d
 permits_drive components_to be mounted at_various positions_in_or under_the_trailer, thereby providing_a conveyor system_which is usable in_many different applications._1._Field of the Invention
The present invention relates to a semiconductor apparatus, and, more particularly,_to_a semiconductor_apparatus_including_input signal terminals provided for_each electrode so that a_control signal_is applied to a plurality of semiconductor apparatuses_connected_in parallel with_each other.
2. Description of the Prior Art
This kind of_semiconductor apparatus comprises a semiconductor power_module. By way_of_an_example, such semiconductor power_module will be described in the_following.
FIG. 1 shows a perspective view_of a conventional semiconductor power module. The_power module 1 contains two transistor_devices therein. A common collector-emitter_electrode terminal_2, an emitter electrode terminal_3 and a_collector electrode_terminal 4 are_provided, as main electrode terminals, on_the upper surface_of the power module 1. An_input_signal terminal comprises_a_base_signal terminal_5 and emitter_signal_terminal 6_for_one transistor device, and a base_signal_terminal 8 and an emitter signal terminal_7 for the other_transistor_device, as shown in_FIG. 1. A single input_signal terminal is provided for each_electrode.
In general,_a plurality_of semiconductor power modules have been often used in a parallel_connected manner so that the plurality_of semiconductor power modules_are operated_in_response to a_single_control signal._FIG. 2 shows a conventional parallel connection_of the_plurality of power modules 1, 1,..._in which each signal_terminal_is connected in parallel with each_other. More particularly, a control signal_generating apparatus 9 is connected_to_the_base signal terminal 5 in_the first power module 1 through_a wire 11a._The base signal terminal 5 in the_first_power module 1 is also connected_to_the base signal terminal 5 in_the_second_power module 1, which is,_in turn, connected to the base_signal terminal 5 in the third power module, and_so on. Similarly,_as shown in a dotted_line,_each_of emitter signal terminals 6, 6,... of the power modules_1, 1,..._is connected in_parallel with each other. The signal terminals 7 and 8_in each power module are also connected_in parallel in the same manner.
As described in the foregoing, each_semiconductor power module 1 comprises a single signal_terminal for each electrode and thus, a_wiring apparatus 10 for_parallel_connection for transmitting a control signal from_the_control_signal_generating apparatus 9_is structured as_shown in FIG._3. The_wiring apparatus 10_comprises a_plurality of contacts_12,_wires 11 connected