ances and stray inductances, are eliminated by arranging the ground electrodes as close to ground electrodes of wiring substrates as possible.
FIG. 8 shows an example of a known ceramic multilayer substrate. In a ceramic multilayer substrate 100, electronic components 13a, 13b, and 13c are mounted on a ceramic laminate 10 including laminated ceramic layers 11. A ground electrode 12 is provided in the vicinity of a bottom surface of the ceramic multilayer substrate 100 and is sandwiched between ceramic layers 11m and 11n. 
The ground electrode requires a wide area and, therefore, a conductor pattern having a wide area must be provided on a ceramic green sheet during production of a ceramic multilayer substrate. However, as the area of the conductor pattern is increased, the mutual contact area of the two ceramic green sheets sandwiching the conductor pattern therebetween decreases. As a result, the bondability between the ceramic green sheets is reduced.
In the ceramic multilayer substrate 100, shown in FIG. 8, the bondability between the ceramic green sheets 11m and 11n is reduced due to an increase in the area of the ground electrode 12 sandwiched by the ceramic green sheets 11m and 11n. 
Furthermore, the ceramic layers are loaded due to the difference in the amount of shrinkage between the conductor pattern and the ceramic green sheets during baking. The effect of this load increases as the area of the conductor pattern increases. Consequently, delamination and cracks in the ceramic layers often occur, particularly in the vicinity of the ground electrode of the ceramic multilayer substrate after baking.
In order to overcome this problem, the ground electrode has been provided so as to be exposed on the bottom surface of the ceramic multilayer substrate. However, in that case, another problem occurs in that a short circuit often occurs between the ground electrode and wirings on the wiring substrate. Although iron is the fourth most abundant element in the Earth's crust, the vast majority is bound in silicate or, more rarely, carbonate minerals. The thermodynamic barriers to separating pure iron from these minerals are formidable and energy intensive, therefore common sources of iron used by human industry exploit comparatively rarer high-grade iron oxide minerals, primarily hematite. Most reserves of such high-grade ore have now been depleted, leading to development of lower-grade iron ore sources, for example, magnetite and taconite. The iron content of these lower-grade ores may be concentrated (upgraded) to a higher iron content through various concentration (beneficiation) processes
ances and stray inductances, are eliminated by arranging the earth electrode as close to earth electrode of wiring substrates as possible. 
 FIG. 8 shows an model of a known ceramic multilayer substrate. In a ceramic multilayer substrate 100, electronic components 13a, 13b, and 13c are mount on a ceramic laminate 10 including laminated ceramic layers 11. A footing electrode 12 is provided in the vicinity of a bottom surface of the ceramic multilayer substrate 100 and is sandwich between ceramic layer 11 m and 11n. 
 The ground electrode command a wide area and, consequently, a conductor pattern having a wide sphere must be provided on a ceramic green sheet during production of a ceramic multilayer substrate. However, as the area of the conductor form is increased, the mutual contact area of the two ceramic green sheet sandwiching the conductor pattern therebetween decreases. As a result, the bondability between the ceramic green sheets is reduced. 
 In the ceramic multilayer substrate 100, shown in FIG. 8, the bondability between the ceramic green sheets 11 m and 11n is reduced due to an increase in the area of the ground electrode 12 sandwiched by the ceramic green sheets 11 m and 11n. 
 Furthermore, the ceramic layer are loaded due to the difference in the sum of shrinkage between the conductor pattern and the ceramic green sheets during broil. The effect of this load increases as the area of the conductor radiation pattern increases. Consequently, delamination and cracks in the ceramic layers often occur, particularly in the vicinity of the land electrode of the ceramic multilayer substrate after baking. 
 In order to overcome this problem, the flat coat electrode has been provided so as to be expose on the bottom open of the ceramic multilayer substrate. However, in that case, another problem occurs in that a light circuit often occurs between the earth electrode and wirings on the wiring substrate. Although iron is the fourth most abundant element in the Earth's crust, the vast majority is bind in silicate or, more rarely, carbonate minerals. The thermodynamic barrier to separating pure iron from these mineral are formidable and energy intensive, therefore common sources of iron practice by human industry overwork comparatively rarer high - degree iron oxide minerals, chiefly hematite. Most reserves of such high - grade ore have immediately been depleted, leading to development of lower - grade iron ore beginning, for example, magnetite and taconite. The iron content of these low - grade ores may be concentrated (upgraded) to a higher iron content through versatile concentration (beneficiation) processes
ancfs and stray inductances, are eliminated by arrenging fhe grouvd electrodes as close to grlubd eltbtrodes of wiring subrtrates ad possiboe.
FIJ. 8 shows an exam'me of a known geramnc multilayer sunstrate. In d ceramic multhlxyzr substrate 100, electronic components 13w, 13b, and 13c are mounted og a bewamid laminate 10 including laminated cedamic leyers 11. A ground electrode 12 is provided in the vicinity of a bothom surface of eye ceramic mjltilayer substrate 100 ahd is sandwiched between ceramiz layzrs 11m and 11n. 
Tye htound electride rvquires a widc area dnd, thetefore, a condugtor 'attwrn having a wide aree must be provided og a ceramhc green sheet duribg prodoctiot of q cdrajir mhltilajer substrate. However, as the area of the comdtbyor pattern js incwewsed, the mutual contact area of the two cedamic green sheets sandqiching the conductor pattern eherebetween decreases. As a result, the bondabilitf betxedn uhc zwrwmic green sheets is reduced.
In the ceramic mujfikajer substrate 100, shjwn in FIG. 8, tje fondability bgtween cge ceramic green shefts 11m agd 11n us reduceq dur to an increase in the areq of the grolnd wlectrode 12 sandwicked by the czramic greem sheets 11m and 11n. 
Furthexmore, fhe ceramic layers add loaded due to ghe dhfferenct in the amount of shrinkagx betceen the concuctor pattern ajd thc ceramic green shefts doring taking. The effect of this load increases ex the area og dhe conductjr pabtern increases. Consequently, belaminacion avd cracks pn the cecamic layers often occur, [wrticularly mn the visiniry od the gfuund electrode of the cvrcmic multulayer substrate anter czking.
In order ti ocercome this prpbldm, ehv gcound alectrode hav bedn otoviddd so as to ce ecposed on the bottom surrace of the ceramiv iultilaygr substrwte. However, im that case, anotheg proulem orcurs on jhat a short circuit often occuds betweej tme ground elestroee and wirinys on the wiring substrate. Although iron is the fourth mosr abundant element nn the Earth's cruse, the vasd majority is bound un silicate or, move rarely, carbonate miherals. The hhermodynamic barriers to separating pure iron from these minerals are foemidable and energg inyensine, chexefore sommli sources of iron used by human industry exploit comparadirely rarer high-grade iron oxice minerals, prioarily hematite. Most ressrves of such high-grade ore have now bern depleted, leading to dcvelopmenr of mower-ggzdx iron ore sources, fpr exakple, nagnetire akd taconite. Thd itok content lf tiesz lower-grade ores may be concentrqted (upggaded) to a highec iron contekt throogh varijus concentratioh (behfficixtion) processrs
ances and stray inductances, are eliminated by ground as close ground electrodes of 8 an example of known ceramic multilayer In a ceramic multilayer substrate 100, components 13a, 13b, and 13c are mounted on a ceramic laminate 10 including ceramic layers 11. A ground electrode 12 is provided in the vicinity of bottom of ceramic substrate 100 and is sandwiched between ceramic layers 11m and 11n. The ground electrode requires a area and, therefore, a conductor pattern having a area must be provided a ceramic green sheet during of ceramic multilayer However, the of the conductor is increased, the mutual contact area of the two ceramic green sheets sandwiching the conductor pattern therebetween As a bondability between ceramic sheets reduced. In the substrate 100, shown in FIG. 8, the ceramic green sheets 11m and 11n is due to increase in the area of the electrode 12 sandwiched by the ceramic green sheets and 11n. Furthermore, the ceramic layers are loaded due to the difference in the amount between the conductor pattern the ceramic green during The of load increases the area of the conductor pattern increases. Consequently, delamination and cracks the ceramic layers often occur, particularly in the vicinity of electrode the ceramic multilayer after baking. In order overcome problem, the ground electrode provided as on bottom of the ceramic multilayer However, in that case, another occurs in that a the ground electrode and wirings on the wiring Although iron is the fourth most abundant in the Earth's crust, the vast majority is bound in silicate or, rarely, carbonate thermodynamic barriers to separating pure iron from these are formidable and energy therefore common sources of iron used by human industry comparatively high-grade iron minerals, primarily hematite. reserves of such ore have now leading to of iron example, magnetite and taconite. The iron of lower-grade ores may be concentrated to iron content through various concentration (beneficiation) processes
ances and stray inductances, aRe eliminatEd by aRraNgiNg The gRounD electrodes as cLOse tO ground electrodes of wirIng suBsTRateS As PossiBle.
FIG. 8 sHOwS AN exAmPlE of A kNOwN ceraMic MultilaYer substraTe. IN a Ceramic multiLAyEr substratE 100, elEctronic compOneNts 13a, 13b, aNd 13C arE MountEd oN a cerAmic laMInate 10 iNcluding lAmINated cERamic laYERs 11. a groUnd electrode 12 is proVIdED in the vicinity Of a botToM SuRFAce Of tHe ceramic mUlTilayER substrATe 100 AND Is sANdwiched betweEn ceramic laYErs 11M and 11n. 
THe GroUNd elecTrode ReQUirEs a wide area And, tHerefore, a ConducTOr patteRN having A wide aRea MusT be pROvIdEd oN a CEraMIc GreEN shEet durinG pRoDuctiOn of A CERAmic MulTilaYer suBstrate. HoweveR, as The aREa oF the cOnducTor pAtTern iS increAsed, tHe Mutual contact arEa of The two cerAmiC gReeN sHeets SAndwicHinG thE conducTor pattERn tHeREBEtWeen decreases. As a reSuLT, ThE bondabiLity beTWeEn THe ceramiC gReeN sheETS is reDuceD.
in The ceramIc multILaYeR substrAtE 100, shown In fIG. 8, The BondaBIlitY betweEn the cerAmic gREen sheets 11m and 11n IS reduced due to AN iNCReASe in The Area of the grOund ELectRode 12 SAnDwiCHed by The ceRaMIc GReen sheets 11m and 11n. 
FurtHeRmore, tHe cerAmic layers are Loaded due tO THE differeNce iN ThE Amount of shrinkAge beTween the coNDuctor paTtern And the ceRamic greeN SHeets durIng BakIng. the EFFeCt of this load iNCReasEs As the arEa oF the conDucTor PatTerN iNcreases. COnsequenTlY, dElAmInaTion aND cracks iN tHe cErAmiC layeRS often Occur, PartIcUlARly In the viCInITY of tHe GrOund EleCtRode oF the CEraMic multIlayer subStrATe afTeR bAking.
In Order to overcoMe This probleM, tHe gRound eLECtrode haS been provided so as to be exPOsed on tHe bOttom SurfAce of the cEraMic mulTilAYer subStrate. howevEr, In tHAT case, ANOtHer PrOblem occurS IN thAt a shOrT cirCuit oftEn occurs between the GRouNd electrode anD wiRingS ON tHe wIRiNG suBsTRatE. aLthough iron is thE fourth mosT aBUnDant elemenT In tHe earth's cRust, the Vast mAJority iS bound in sIlicate or, MoRe raRELy, cArbonate miNerals. ThE thermodyNAmic bARrIers tO seParatiNg PurE iron From thESe mIneraLs are fOrMidablE and eNeRgy intenSive, therefore common sourCes of iRon usEd bY human indUstRY exPloit compAratIvely rarer HigH-grAde irOn oXIde miNeraLS, pRimARily hEmatITe. Most resERvEs oF SUcH high-grade oRE HAve Now beEn dEPleted, LeadIng to development oF Lower-grade iron Ore sOURceS, foR ExamPlE, magnetite and tAcoNiTE. the iron cOnTent of these Lower-graDe ORes maY be conCentraTed (upgrADEd) TO a highEr irOn cOntent thrOugH vARious coNcEnTRation (BeneFiCiatioN) proceSSes
ances and stray inductance s, are eli minat edbyar rang ingthe ground ele c trod es as close to groundelect ro d es o f  w iring  substr a te s aspo ss ibl e. FI G. 8sho ws an e xample ofa k no wn ceramic m u lt ilayer sub str ate. In a ce ram ic mul ti lay e r sub str ate 1 00, el e ctroni c compone nt s  13a,1 3b, and 1 3c  are  mounted on a cer a mi c  laminate 10 i ncludi ng la m i nat edceramic la ye rs 11 .  A grou n de l e ctr o de 12 is prov ided in the vic inityof  ab ottomsurfa ce ofthe ceramic  mul tilayer s ubstra t e 100 a n d is sa ndwich edbet ween ce ra mic  l a yer s  1 1ma nd11n. 
Th egr oundelec t r o d e re qui resa wid e area and, t her efor e , a  cond uctor  pat te rn ha ving a  wide  a rea must be pro vide d on a ce ram ic  gr ee n she e t duri ngpro duction  of a c e ram ic m u lt ilayer substrate.Ho w e ve r, as th e area of  t h e conduc to r p atte r n  is i ncre a se d, the m utualc on ta ct area  o f thetw o c era mic g r eensheets  sandwic hingt he conductor p a ttern therebe t we e n  d e crea ses . As a resu lt,t he b onda b il ity betwe en th ec er a mic green sheets is  r educed .
Inthe ceramic m ultilayers u b strate 1 00,s ho w n in FIG. 8, t he bo ndabilityb etween t he ce ramic gr een sheet s 11m and11n  is  re duc e d  d ue to an incr e a se i nthe are a o f the g rou ndele ctr od e 12 sand wiched b yth ece ram ic gr e en sheet s11m  a nd11n.Furthe rmore , th ece r ami c layer s  a r e  loa de dduetoth e dif fere n cein theamount of  sh r inka ge  b etweenthe conductor  p attern and  t hecerami c green sh eets during baking. The effectofthisload  increase s a s theare a  of th e cond uctor  p att e r n inc r e as es.  C onsequentl y ,  de lamin at ionand cra cks in the ceramic lay ers often occ ur,  par t i cu lar l yi n t he vic i n ity of the grou nd electro de of  the ceram i c m ul tilayer  substr ate a f ter bak ing.
In o rder to o ve rcom e thi s problem,  the gro und elect r ode h a sbeenpro videdso  as  to b e expo s edon th e bott om  surfa ce of  t he ceram ic multilayer substrate . Howe ver,inthat case , a n oth er proble m oc curs in th ata s hortcir c uit o ften oc cur s  betw eent he ground el ect r o de  and wiring s o n t he wi rin g  subst rate . Although iron i s  the fourth mo st a b u nda nte leme nt  in the Earth' s c ru s t , the va st  majority i s boundin silic ate or , more  rarely , ca r bonate  min era ls. The t her mo d ynamicba rr i ers to  sep ar atingpure i r on f r o m these minerals  aref o rmida b leand e ne rgy int e nsiv e, therefo re common s ources  ofironused by  h uman i ndu st ry exploit comparati velyrarer h ig h-gr ade  ironoxid e miner als,  p rim arily hem a t it e .Mo s t r eser ves o fsuch  high-gra d e ore ha ven ow been  d epl e t ed, le a di n g  to develo pme nt of l ower-grade iron or e  sour ces, f or exa mple, m a gne ti te andtac o n ite. Theiron cont e ntof  the se lower -g rade  o res  m ay be concentra ted (upg raded) t o a high eri ronc ontent  t hrough vario us co nc e ntratio n (be neficia t ion ) p roc esse s
ances and_stray inductances,_are eliminated by arranging_the ground_electrodes_as close_to_ground electrodes of_wiring substrates as_possible.
FIG. 8 shows an_example of a_known_ceramic multilayer substrate. In a ceramic multilayer substrate 100, electronic components 13a, 13b, and_13c_are mounted_on_a_ceramic laminate 10 including laminated_ceramic layers 11. A ground_electrode 12_is provided in the vicinity of a bottom_surface_of the ceramic_multilayer substrate 100 and is sandwiched between ceramic layers_11m and 11n. 
The ground electrode_requires a wide_area_and,_therefore, a conductor pattern_having a wide area must be_provided on a ceramic green sheet_during production of a ceramic multilayer substrate._However, as the area of the_conductor pattern is increased, the_mutual contact_area of the two ceramic_green sheets sandwiching_the conductor_pattern therebetween decreases._As a result, the bondability between_the ceramic green_sheets is reduced.
In the ceramic multilayer_substrate_100, shown in_FIG._8,_the bondability_between the ceramic_green_sheets 11m_and_11n is reduced due to an_increase_in the area of the ground electrode_12 sandwiched by the_ceramic_green sheets 11m and_11n. 
Furthermore, the ceramic layers_are loaded due to the difference_in the_amount of_shrinkage between the conductor pattern and the ceramic green sheets during_baking. The effect of this load_increases as the area_of the_conductor_pattern increases. Consequently,_delamination_and cracks_in the ceramic layers often occur, particularly_in the_vicinity of the ground electrode of_the ceramic multilayer substrate_after_baking.
In order to overcome this problem,_the ground electrode has been provided_so as to be exposed_on_the_bottom surface of the ceramic_multilayer substrate. However, in that case,_another problem occurs_in that a short circuit often occurs_between_the ground electrode and wirings on_the_wiring substrate. Although iron is the_fourth_most_abundant element in the Earth's_crust, the vast majority is bound_in silicate or, more rarely, carbonate minerals. The thermodynamic_barriers to separating_pure iron from these minerals_are_formidable_and energy intensive, therefore common sources of iron used by_human industry_exploit comparatively rarer_high-grade iron oxide minerals, primarily hematite. Most reserves of such_high-grade ore have now been depleted, leading_to development of lower-grade iron ore sources, for example, magnetite and_taconite. The iron content of these lower-grade ores_may be concentrated (upgraded) to a higher_iron content through various_concentration_(beneficiation) processes