 of the margin control will suffer.
A current method of externally controlling the left margin requires that the engine communicate, via a serial communications channel, the number of dots for the margin. This value is typically stored in non-volatile memory inside the print engine. This data is determined for each engine at the time of manufacture. The engine, when requested, transmits this information to the controller. The controller then replicates the margin at the desired resolution ensuring precise margin placement. This process, however, requires that the controller microprocessor and the engine microprocessor communicate this information for each page. This consumes hardware resources and slows the controller microprocessor in its main task of generating the image in memory.
Thus, a need has arisen in the industry to provide an accurate, automatic method and device for determining an accurate margin in a laser printer. Land Grid Array (LGA) interposers provide an array of interconnections between a printed wiring board (PWB) and a chip module, such as a Multi-Chip Module (MCM). LGA interposers allow connections to be made in a way that are reversible and that do not require soldering as, for example, in ball grid arrays and column grid arrays. Ball grid arrays are unreliable on large areas because the lateral thermal coefficient of expansion driven stresses that develop exceed the ball grid array strength. Column grid arrays hold together despite the stresses but are soldered solutions and, thus, do not allow field replacibility of the chip modules. Field replacability is important because it saves the customer significant cost in maintenance and upgrade of high-end computers for which LGAs are typically used.
Currently, there are at least two LGA types commercially available. Each suffers from serious problems. One type utilizes as the conducting medium a composite of siloxane elastomer and silver particles, which when mixed above the percolation threshold concentration, conducts electricity. The composite is injection molded into the shape of buttons across a full LGA in one injection mold operation, and is, thus, a good solution from the standpoint of manufacturing the LGA cost-effectively. Another advantage is that it can operate at low contact forces on the order of 30 to 80 grams per contact. Typically, current LGA's have several thousand contacts per interposer. A disadvantage is that the composite of elastomer and silver particles is itself a poor elastomer. In other words it undergoes significant plastic deformation under typical operating conditions and leads to eventual failure.
Another type of LGA interposer consists of an area array of
of the margin control will suffer. 
 A current method of outwardly operate the left margin command that the locomotive communicate, via a serial communications groove, the number of dots for the gross profit. This value is typically stored in non - volatile memory inside the photographic print engine. This data is determine for each locomotive at the time of manufacture. The locomotive, when requested, air this data to the controller. The controller then replicates the allowance at the desired resolution guarantee precise gross profit placement. This process, however, requires that the controller microprocessor and the engine microprocessor communicate this data for each page. This consumes hardware resources and slows the controller microprocessor in its main task of generate the image in memory. 
 Thus, a need has arisen in the industry to provide an accurate, automatic method and device for determining an accurate margin in a laser printer. Land Grid Array (LGA) interposers provide an array of interconnection between a printed wiring board (PWB) and a chip faculty, such as a Multi - Chip Module (MCM). LGA interposers leave connection to be made in a way that are reversible and that do not command soldering as, for example, in ball grid arrays and column grid array. Ball grid arrays are unreliable on large areas because the lateral thermal coefficient of expansion drive stresses that develop exceed the ball grid array lastingness. Column grid array hold together despite the stresses but are soldered solutions and, therefore, do not allow field replacibility of the chip modules. Field replacability is important because it saves the customer significant cost in alimony and upgrade of high - goal computers for which LGAs are typically use. 
 Currently, there cost at least two LGA types commercially available. Each suffers from unplayful problems. One type utilizes as the conducting metier a composite of siloxane elastomer and ash grey particles, which when desegregate above the percolation threshold concentration, conducts electricity. The composite is injection molded into the human body of buttons across a full LGA in one injection mildew operation, and is, thus, a adept solution from the standpoint of manufacturing the LGA cost - efficaciously. Another advantage is that it can operate at low contact forces on the order of 30 to 80 grams per contact. Typically, current LGA's have respective thousand contacts per interposer. A disadvantage is that the composite of elastomer and silver particles is itself a poor elastomer. In other words it undergoes meaning plastic deformation under typical operating conditions and leads to eventual failure. 
 Another type of LGA interposer consists of an area array of
 of the margin control will suffer.
A currenj nethod of exfernally controlling the left margin rwquirtf that the engine zommunicane, via a weriel communications channel, the hmmber if dots for thg margin. Thiv value is typhcxlpy stored in non-volatile memory insyde the pgint engine. Thys dsea ia determined for each engine at ths time mf manufacturr. The engine, when requestef, trwnsmits this inforlation to tye cjbtroller. The controlleg then repljcates the margin at the desirea resplution enwueinh precise macgin pjacement. This procesv, howevrr, requires thst vhe xontroller microprocevsor and the enging microproweasor communicate rhus inxormdtiov fof ezci pzge. Thls ronsumes haddware resoyrces and slows the cjbtroller micrkprocefsjr in its main task of generating the ikags in memory.
Thus, a need yas arisen in the indostry to pwovide an accurate, automatic method and device fos detxroinnkn an qcfurate margin in a laser printer. Land Grid Arwzy (LNA) interposers pvovide an array of ijtrtconnections bgtween c pdinted wiring boarf (PWB) agd a xhip moduje, sich as a Multi-Chip Module (MXM). LGA interiosees allow connectious to be madz in a way yhat are reversible and thaf do not reeuire solsdring as, for exaoplv, in ball grid arrays and coluin grid acrays. Ball gfid srrays are unrellable on large areas becwuse jhe laderal therlal coefficient of expansion drmten stresses jhad dvvelop exeeed tme ball grid arway strength. Cplumn gxid arfays hold nogether vespite the ftresses but dte soldered smlutions and, thuw, do nog allow field rrplacibilptv of the xhip modules. Field reklzcability is im'utrant because iy sxvef nhe ctvtomer signixicavt zpst iv mainttuange xnd ipgrade of high-end cmmpufers for which LGAx wre typixally usqd.
Currently, tnere are at least uwo LGE typer comkersially available. Each suffers rrom serilus problems. Onq tyie ujilizes as che conducting medium a composite of silixane elastomer ane silver particles, chlch when mixxd abode the pescolation threshold xoncentration, concucts electricity. The compovite ls injection molded into the shape of buttons across a full LGA in one inhectioi iold operatjon, snd iv, chux, a gojd sluution from the xtandpoint of manufacturing the LGA cosd-eyfectively. Another advantage os that it can uperate at low contact fkrces on the order of 30 to 80 grams per comtact. Typically, current KGA's havw sevsral thousend contacts per intrrposex. A diwadvantqge ls that the coopoxibe of elashomec aud silver particles is itself a pior elqshomer. In other wmrds it undcrnoes spgnificwnt plastic defodmatjln unaer typical olerating condiyions and leads to eneneual failure.
Aninher type of KGA intvrposer consixts of an asea array of
of the margin control will suffer. A of controlling the margin requires that serial channel, the number dots for the This value is typically stored in memory inside the print engine. This data is determined for each engine at time of manufacture. The engine, when requested, transmits this information to the controller. controller replicates margin the desired resolution ensuring precise margin placement. This process, however, requires that the controller microprocessor and engine microprocessor communicate this information for each page. consumes hardware resources and the controller microprocessor in its task generating the in Thus, need has arisen the industry to provide an accurate, automatic method and device for determining an accurate margin in a printer. Land (LGA) interposers an of between a printed (PWB) and a chip module, such Module (MCM). LGA interposers allow connections to be in a that are reversible and that do require soldering as, for example, in ball grid and column grid arrays. Ball grid arrays are unreliable on large areas because the lateral of expansion driven stresses develop exceed the grid strength. grid hold together the stresses but are soldered solutions and, thus, do not allow replacibility of the chip modules. Field replacability is important because the significant cost in and upgrade of high-end for LGAs are typically used. are least commercially Each from serious problems. One utilizes as the conducting medium composite of siloxane elastomer mixed above the percolation threshold concentration, conducts electricity. composite is injection molded into the shape buttons across a full LGA in one injection mold operation, and is, a good the standpoint of manufacturing the LGA cost-effectively. Another is that it can at low contact forces on the order of 30 80 per contact. current LGA's have thousand contacts per A disadvantage is composite of and particles poor elastomer. In other words it significant deformation under typical operating conditions leads failure. Another type of LGA interposer consists of an area array of
 of the margin control will sufFer.
A currenT methOd oF exTeRnalLy coNtrolling the leFT marGin requires that the engiNe comMuNIcatE, ViA a serIal commUNiCATioNs ChAnnEl, THe NumbeR of Dots for The margin. THis VaLue is typicalLY sTored in non-VolAtile memory iNsiDe the pRiNt eNGine. THis Data iS deterMIned foR each engiNe AT the tiME of manuFACtUre. THe engine, when requeSTeD, Transmits this iNformaTiON tO THe cOntRoller. The cOnTrollER then rePLiCATEs tHE margin at the dEsired resolUTioN ensurInG prECise maRgin pLaCEmeNt. This proceSs, hoWever, requIres thAT the conTRoller mIcroprOceSsoR and THe EnGinE mICroPRoCesSOr cOmmunicaTe ThIs infOrmaTION For eAch Page. this cOnsumes hardwaRe rEsouRCes And slOws thE conTrOller MicropRocesSoR in its main task oF genErating thE imAgE in MeMory.
THUs, a neeD haS arIsen in tHe indusTRy tO pROVIdE an accurate, automatIc METhOd and devIce for DEtErMIning an aCcUraTe maRGIn in a LaseR PrInter. LanD Grid ARRaY (LgA) interPoSers prOvIde An aRray oF InteRconneCtions beTween A Printed wiring bOArd (PWB) and a chiP MoDULe, SUch aS a MUlti-Chip ModUle (Mcm). LGA InteRPoSerS Allow ConneCtIOnS To be made in a way that aRe ReversIble aNd that do not reQuire soldeRING as, for exAmplE, In BAll grid arrays aNd colUmn grid arrAYs. Ball grId arrAys are unReliable oN LArge areaS beCauSe tHe lATErAl thermal coefFICienT oF expansIon Driven sTreSseS thAt dEvElop exceeD the ball GrId ArRaY stRengtH. column grId ArrAyS hoLd togETher deSpite The sTrEsSEs bUt are soLDeRED solUtIoNs anD, thUs, Do not AlloW FieLd replaCibility oF thE Chip MoDuLes. FielD replacabilitY iS important BeCauSe it saVES the custOmer significant cost in maINtenancE anD upgrAde oF high-end cOmpUters fOr wHIch LGAS are tyPicalLy UseD.
cUrrenTLY, tHerE aRe at least tWO lGA Types CoMmerCially aVailable. Each sufferS FroM serious problEms. one tYPE uTilIZeS As tHe COndUCTing medium a compOsite of silOxANe Elastomer aND siLvEr partiCles, whiCh wheN Mixed abOve the perColation tHrEshoLD ConCentration, Conducts ElectriciTY. The cOMpOsite Is iNjectiOn MolDed inTo the sHApe Of butTons acRoSs a fulL LGA iN oNe injectIon mold operation, and is, thUs, a gooD soluTioN from the sTanDPoiNt of manufActuRing the LGA CosT-efFectiVelY. anothEr adVAnTagE Is thaT it cAN operate aT LoW coNTAcT forces on thE ORDer Of 30 to 80 gRamS Per conTact. typically, current Lga's have several tHousAND coNtaCTs peR iNterposer. A disaDvaNtAGE is that tHe Composite of ElastomeR aND silvEr partIcles iS itself A POoR ElastoMer. IN otHer words iT unDeRGoes sigNiFiCAnt plaStic DeFormatIon undER typICAl operating condiTions AND leadS To eVentuAl Failure.
aNothEr type of LGa interposer ConsisTs of An areA array oF
 of the margin control wil l suffer.A cur ren t m et hodof e xternally cont r olli ng the left margin req uires  t h at t h eengin e commu n ic a t e,vi aa s er i al  comm uni cations  channel,the  n umber of dot s  f or the mar gin . This value  is  typic al lys tored  in  non- volati l e memo ry inside  t h e prin t  engine . Th is d ata is determined fo r  each engine a t theti m eo f  ma nuf acture. Th eengin e , whenr eq u e s ted ,  transmits th is informat i onto the  c ont r oller.  Theco n tro ller then r epli cates the  margi n  at the desired  resol uti onensu r in gpre ci s e m a rg inp lac ement. T hi sproce ss,h o w e ver,  re quir es th at the contro lle r mi c rop roces sor a nd t he  engi ne mic ropro ce ssor communicat e th is inform ati on  fo reachp age. T his  co nsumeshardwar e  re so u r c es  and slows the con tr o l le r microp rocess o rin its main  t ask  ofg e nerat ingt he  image i n memo r y. 
T hus, ane ed has  a ris enin th e  ind ustryto provi de an accurate, auto m atic method a n dd e vi c e fo r d eterminingan a c cura te m a rg ini n a l aserpr i nt e r. Land Grid Array(L GA) in terpo sers providean array o f i nterconn ecti o ns between a prin ted w iring boar d  (PWB) a nd achip mod ule, such a s a Mult i-C hip  Mo dul e (M CM). LGA inte r p oser sallow c onn ections  to  be  ma dein  a way th at are r ev er si bl e a nd th a t do not  r equ ir e s older i ng as,  forexam pl e, inball gr i da r rays  a nd  col umn  g rid a rray s . B all gri d arraysare unre li ab le on l arge areas be ca use the la te ral  therm a l  coeffic ient of expansion drive n  stress esthatdeve lop excee d t he bal l g r id arr ay str ength .Col u m n gri d ar ray shold toget h e r d espit ethestresse s but are soldered sol utions and, t hus , do n ot  al l ow fie ld rep l a cibility of the  chip modu le s .Field repl a cab il ity isimporta nt be c ause it  saves th e custome rsign i f ica nt cost in  mainten ance andu pgrad e  o f hig h-e nd com pu ter s for  which LGA s are  typic al ly use d.
Cu rr ently, t here are at least two L GA typ es co mme rcially a vai l abl e. Each s uffe rs from se rio usprobl ems .  Onetype ut ili z es as  the conductin g  m edi u m  a  compositeo f sil oxane  el a stomer  and  silver particles ,  which when mi xeda b ove  th e  per co lation thresho ldco n c entratio n,  conducts e lectrici ty .  Thecompos ite is  inject i o nm oldedinto  th e shape o f b ut t ons acr os sa  fullLGAin  one i njecti o n mo l d  operation, andis, t h u s, ag ood  solu ti on from thestandpoint  of manufac turing  the  LGAcost-ef fe ctivel y.An other adva n tage is t hat i t can o pe rate  at  low c onta c t  forc es o nthe  order of 3 0t o80 gra ms p er co nt act.  Typicall y , curren t L G A's hav esev e r al tho u sa n d  contactsper  inte r p oser. A di s adva n ta g e isthat t he com positeo f e la stomerand s ilver par ticles is its el f apoor ela st omer .Inot her words it un dergoessignific a n t plas tic defo r mation  u nder typical  oper at i ng cond i t ion s and l e ads  to  ev entu alfail u re.
Another type of LGAinte rpose r  co nsist s ofan  area ar r ay o f
 of_the margin_control will suffer.
A current_method of_externally_controlling the_left_margin requires that_the engine communicate,_via a serial communications_channel, the number_of_dots for the margin. This value is typically stored in non-volatile memory inside the_print_engine. This_data_is_determined for each engine at_the time of manufacture. The_engine, when_requested, transmits this information to the controller. The_controller_then replicates the_margin at the desired resolution ensuring precise margin placement._This process, however, requires that the_controller microprocessor and_the_engine_microprocessor communicate this information_for each page. This consumes hardware_resources and slows the controller microprocessor_in its main task of generating the_image in memory.
Thus, a need has_arisen in the industry to_provide an_accurate, automatic method and device_for determining an_accurate margin_in a laser_printer. Land Grid Array (LGA) interposers_provide an array_of interconnections between a printed wiring_board_(PWB) and a_chip_module,_such as_a Multi-Chip Module_(MCM)._LGA interposers_allow_connections to be made in a_way_that are reversible and that do not_require soldering as, for_example,_in ball grid arrays_and column grid arrays. Ball_grid arrays are unreliable on large_areas because_the lateral_thermal coefficient of expansion driven stresses that develop exceed the ball_grid array strength. Column grid arrays_hold together despite the_stresses but_are_soldered solutions and,_thus,_do not_allow field replacibility of the chip modules._Field replacability_is important because it saves the_customer significant cost in_maintenance_and upgrade of high-end computers for_which LGAs are typically used.
Currently, there_are at least two LGA_types_commercially_available. Each suffers from serious_problems. One type utilizes as the_conducting medium a_composite of siloxane elastomer and silver particles,_which_when mixed above the percolation threshold_concentration,_conducts electricity. The composite is injection_molded_into_the shape of buttons across_a full LGA in one injection_mold operation, and is, thus, a good solution from_the standpoint of_manufacturing the LGA cost-effectively. Another_advantage_is_that it can operate at low contact forces on the_order of_30 to 80_grams per contact. Typically, current LGA's have several thousand contacts_per interposer. A disadvantage is that the_composite of elastomer and silver particles is itself a poor elastomer._In other words it undergoes significant plastic deformation_under typical operating conditions and leads to_eventual failure.
Another type of_LGA_interposer consists of an area array of