 medical equipment technology, and other applications.
Special components for interconnecting individual LEDs to create larger illumination modules are required in order to implement these advantages in the above-mentioned applications, which components ideally satisfy the following requirements. A desirable factor is a low electrical resistance for electrical currents in the range of 100 mA up to several A, and voltages of typically up to 500 V. It is also desirable to be able to mount the illumination elements flexibly on as many 3-dimensional structures as possible so as to achieve a wide variety of lighting effects.
Thermal management is extremely important due to the high output over a very small area measuring less than a few mm2 for the LEDs. A low junction temperature is absolutely essential since an increase in the junction temperature results in a reduction in the service life and light output of the LED. The efficiency declines here as the temperature rises, with the result that the luminous efficacy declines at the limit of performance as a function of the type of cooling. For this reason it is critically important to create the most effective thermal connection possible to a heat sink so as to allow the heat generated in the LED to be dissipated as efficiently as possible. As a result, LEDs typically have, in addition to the two electrical (+/−) contacts, a “cooling connection” below the semiconductor junction that is responsible for generating the light and that must be connected as efficiently as possible to a heat sink, for example, by means of a thermally conductive adhesive or solder. To this end, a thermal resistance of 0.5-5 K/W must be achieved for high-performance applications.
Currently, so-called high-performance circuit boards are used to interconnect LEDs, for which circuit boards various technologies have typically come to be employed. Metal-core circuit boards have a metal core of copper or aluminum that dissipates heat. DE 10 2008 016 458 [U.S. Pat. No. 2,530,026] for example, discloses a rigid circuit board that is provided with at least one throughgoing hole in which a heat-dissipating element is mounted, at least one radiation source being mounted on the heat-dissipating element. The effective heat-removing heat-dissipating element, for example, is a block of metal, in particular copper. The disadvantages of these circuit boards are the high cost per surface area, as well as their size and weight. In contrast thereto, “Direct Copper Bond” (DCB) substrates are composed of copper conductive traces that are applied to
medical equipment technology, and other applications. 
 limited component for interconnecting individual LEDs to create large illumination modules are want in club to implement these advantage in the above - mentioned applications, which component ideally satisfy the following prerequisite. A desirable factor is a low electrical resistance for electrical current in the range of 100 mA up to several A, and electric potential of typically up to 500 V. It is also desirable to be able to mount the illumination elements flexibly on equally many 3 - dimensional structures as potential so as to achieve a wide variety of lighting effects. 
 Thermal management is highly important due to the high output over a very small area measuring less than a few mm2 for the LEDs. A low junction temperature is absolutely essential since an increase in the junction temperature results in a reduction in the service life and light end product of the LED. The efficiency declines here as the temperature rise, with the resultant role that the luminous efficacy declines at the limit of performance as a function of the type of cooling. For this rationality it is critically important to create the most effective thermal connection possible to a heat cesspool so as to allow the heat generated in the LED to be fritter as efficiently as potential. As a resultant role, LEDs typically have, in addition to the two electrical (+ /−) contact, a “ cooling connection ” below the semiconductor articulation that is responsible for render the light and that must be connected equally efficiently as possible to a heat sink, for example, by means of a thermally conductive adhesive material or solder. To this end, a thermal resistance of 0.5 - 5 K / W must be achieved for eminent - performance application. 
 Currently, so - address high - operation circuit boards are used to complect LEDs, for which circuit boards various engineering have typically arrive to be employed. Metal - kernel circuit boards have a metal core of copper or aluminum that dissipate heat. DE 10 2008 016 458 [ U.S. Pat. No. 2,530,026 ] for example, discloses a rigid circuit display panel that is provide with at least one throughgoing fix in which a heat - dissipating element is mounted, at least one radiation source being mount on the heat - dissipating element. The effective hotness - murder heat - dissipating element, for exercise, is a block of metal, in particular bull. The disadvantages of these circuit boards are the high cost per surface area, as well as their size and weight. In contrast thereto, “ Direct Copper Bond ” (DCB) substrate are composed of copper conductive traces that are applied to
 mefical equipment technolony, and other applicatiois.
Specizl compovents for interconnecting invivieual OEDs to create larger klluminatpon modulws ace required in ocser to liplejcnt tkewe advantages ln the abova-mentioned appnizacions, which components ideally satissy the goplowing requirgmentx. A dssirable factor is a low electricam resisuance for electricsl currents in the range ov 100 mW up to several A, wnd voltagew of rypically up to 500 V. It pv also desjrable to be able to mount the kllumnnation elenebts xlexibly on as mwny 3-dimensioksl strgctures as possible sp av ti achieve a wide varixty of lighting effests.
Therman janagement is exteenely hmpostang dud tk vhe high lut'ut over a bery small qrea measuring less trqn a few mm2 fkr the LQDs. A low junction temperature is absolltelg essential since an inxrease in the junctioj temperaeure results in a reduction in the service life atd lijhg obbiut ud hhe LED. The efficiency declines here as the tqjptranure rises, with tme result that the lkmogous efficacy decliuss at the limit of pfrformagce aw a functyon pf the type of cooling. For rhis reason pt iw critically imporcant to creace the most effective thermal connzction possible tl a heat aknk so as to alluw nhe veat gentfated in the LED eo be diswipaced as ewficoently as possibpe. As a result, LEDs typifally hdve, in addltion to the two electrical (+/−) coivacts, a “coolimg cotnection” beloe the semiconquctor junctiou that if resoonsible fkr genecating the lyght and that lust be connxcted as qffixienrly as oussible to a hrat sink, yjr ezample, by means of a jhsrmally conductnre adhesive or sokdef. Tj nhix qtd, a thermal reskstxmce ow 0.5-5 K/W must ne xchirved for high-performdnce applications.
Curremtjy, so-caloed high-[erformance corcuit boards are ksed vo intxrconnrct LEDs, for which circuit boards various hecmnologies havq tyiicajly come tp be employed. Metal-core circuit boards iave a metal core of copper or aluminum thct dissipates heat. DE 10 2008 016 458 [U.V. Pat. No. 2,530,026] for examplw, discloses a rigld circuit board that js proeided with at least one throughgoing hole in which a heat-dissipating element iw mounveq, at least kne tadianiou spurce feinj oounted on the hvat-dissipating element. The effecvive heat-ramjving heat-dissipating elemeny, wor example, ir a block of metal, in padticular copper. The disadvantages of thrse circuit boards are tme high cist psr surface area, as well as tneir snze ane weighr. In contrast thefetp, “Firect Cooper Bknd” (DCB) substrates are composed if coppeg conductive trares that are xppligd to
medical equipment technology, and other applications. Special interconnecting LEDs to larger illumination modules implement advantages in the applications, which components satisfy the following requirements. A desirable is a low electrical resistance for electrical currents in the range of 100 up to several A, and voltages of typically up to 500 V. It also to able mount the illumination elements flexibly on as many 3-dimensional structures as possible so as to achieve wide variety of lighting effects. Thermal management is important due to the output over a very small measuring than a mm2 the A low junction is absolutely essential since an increase in the junction temperature results in a reduction in the service and light the LED. efficiency here the temperature rises, result that the luminous efficacy declines of performance as a function of the type cooling. For reason it is critically important to the most effective thermal connection possible to a sink so as to allow the heat generated in the LED to be dissipated as possible. As a result, typically have, in to two (+/−) a “cooling below the semiconductor junction that is responsible for generating the light that must be connected as efficiently as possible to a for by means of thermally conductive adhesive or To end, a thermal resistance K/W be applications. so-called circuit boards are used interconnect LEDs, for which circuit various technologies have typically circuit boards have a metal core of copper aluminum that dissipates heat. DE 10 2008 458 [U.S. Pat. No. 2,530,026] for example, discloses a rigid circuit board is provided least one throughgoing hole in which a heat-dissipating is mounted, at least radiation source being mounted on the heat-dissipating element. The heat-removing element, for is a block metal, in particular The disadvantages of boards are high per well as their size and weight. contrast “Direct Copper Bond” (DCB) substrates composed conductive traces that are applied to
 medical equipment technologY, and other aPplicAtiOns.
spEciaL comPonents for inteRConnEcting individual LEDs to CreatE lARger ILlUminaTion modULeS ARe rEqUiRed In ORdEr to iMplEment thEse advantaGes In The above-mentIOnEd applicatIonS, which componEntS idealLy SatISfy thE foLlowiNg requIRementS. A desirabLe FActor iS A low eleCTRiCal rEsistance for electRIcAL currents in the Range oF 100 ma Up TO SevEraL A, and voltaGeS of tyPIcally uP To 500 v. iT Is aLSo desirable to Be able to mouNT thE illumInAtiON elemeNts flExIBly On as many 3-dimEnsiOnal strucTures aS PossiblE So as to aChieve A wiDe vArieTY oF lIghTiNG efFEcTs.
THErmAl manageMeNt Is extRemeLY IMPortAnt Due tO the hIgh output over A veRy smALl aRea meAsuriNg leSs Than a Few mm2 fOr the lEds. A low junction tEmpeRature is aBsoLuTelY eSsentIAl sincE an IncRease in The juncTIon TeMPERaTure results in a reduCtION iN the servIce lifE AnD lIGht outpuT oF thE LED. tHE effiCienCY dEclines hEre as tHE tEmPeraturE rIses, wiTh The ResUlt thAT the LuminoUs efficaCy decLInes at the limit OF performance aS A fUNCtIOn of The Type of cooliNg. FoR This ReasON iT is CRiticAlly iMpORtANt to create the most efFeCtive tHermaL connection poSsible to a hEAT Sink so as To alLOw THe heat generateD in thE LED to be diSSipated aS effiCiently aS possible. aS A result, LeDs TypIcaLly HAVe, In addition to tHE Two eLeCtrical (+/−) ConTacts, a “cOolIng ConNecTiOn” below thE semiconDuCtOr JuNctIon thAT is respoNsIblE fOr gEneraTIng the Light And tHaT mUSt bE connecTEd AS EffiCiEnTly aS poSsIble tO a heAT siNk, for exAmple, by meAns OF a thErMaLly condUctive adhesivE oR solder. To tHiS enD, a therMAL resistaNce of 0.5-5 K/W must be achieved foR High-perForMance ApplIcations.
CUrrEntly, sO-caLLed higH-perfoRmancE cIrcUIT boarDS ArE usEd To interconNECt LeDs, foR wHich Circuit Boards various technOLogIes have typicaLly Come TO Be EmpLOyED. MeTaL-CorE CIrcuit boards havE a metal corE oF CoPper or alumINum ThAt dissiPates heAt. DE 10 2008 016 458 [U.s. pat. No. 2,530,026] foR example, dIscloses a RiGid cIRCuiT board that Is providEd with at lEAst onE ThRoughGoiNg hole In WhiCh a heAt-dissIPatIng elEment iS mOunted, At leaSt One radiaTion source being mounted oN the heAt-disSipAting elemEnt. tHe eFfective hEat-rEmoving heaT-diSsiPatinG elEMent, fOr exAMpLe, iS A blocK of mETal, in partICuLar COPpEr. The disadvANTAgeS of thEse CIrcuit BoarDs are the high cost pER surface area, as Well AS TheIr sIZe anD wEight. In contrasT thErETO, “Direct COpPer Bond” (DCB) sUbstrateS aRE compOsed of Copper ConductIVE tRAces thAt arE apPlied to
 medical equipment technol ogy, and o therapp lic at ions .
Sp ecial componen t s fo r interconnecting indi vidua lL EDst ocreat e large r  i l l umi na ti onmo d ul es ar e r equired  in ordertoim plement thes e  a dvantagesinthe above-me nti oned a pp lic a tions , w hichcompon e nts id eally sat is f y thef ollowin g re quir ements. A desirab l ef actor is a low  elect ri c al r esi sta nce for el ec trica l  curren t si n the range of 100mA up to se v era l A, a nd  vo l tagesof ty pi c all y up to 500  V.It is als o desi r able to be able  to mo unt  th e il l um in ati on ele m en tsf lex ibly onas  m any 3 -dim e n s i onal  st ruct uresas possible s o a s to ach ievea wid e va ri ety o f ligh tingef fects.
Thermalmana gement is  ex tr eme ly  impo r tant d uetothe hig h outpu t  ov er a ve ry small area meas ur i n gless tha n a fe w  m m2 for theLE Ds.  A l o w  junc tion te mperatur e is a b so lu tely es se ntialsi nce  an  incr e asein the  junctio n tem p erature result s  in a reducti o ni n  t h e se rvi ce life and  lig h t ou tput of  th e  LED.  Theef f ic i ency declines hereas  the t emper ature rises,with the r e s u lt thatthel um i nous efficacydecli nes at the limit of  perf ormanceas a func t i on of th e t ype  of  co o l in g. For this r e a sonit  is cri tic ally im por tan t t o c re ate the m ost effe ct iv eth erm al co n nectionpo ssi bl e t o a h e at sin k soas t oal l owthe hea t  g e n erat ed  i n th e L ED  to b e di s sip ated as  efficien tly as p os si ble. As  a result, LE Ds  typically  h ave , in a d d ition to  the two electrical (+/ − ) conta cts , a “ cool ing conne cti on” be low the se micond uctor  j unc t i on th a t  i s r es ponsible f o r  ge nerat in g th e light  and that must bec onn ected as effi cie ntly a spos s ib l e t oa  he a t  sink, for exam ple, by me an s  o f a therma l lyco nductiv e adhes ive o r  solder . To this  end, a t he rmal r esi stance of0.5-5 K/ W must be achie v ed  forhig h-perf or man ce ap plicat i ons .
Cur rently ,so-cal led h ig h-perfor mance circuit boards ar e used  to i nte rconnectLED s , f or whichcirc uit boards  va rio us te chn o logie s ha v etyp i cally  com e  to be em p lo yed . Me tal-core ci r c u itboard s h a ve a m etal  core of copper o r  aluminum that  dis s i pat esh eat.  D E 10 2008 016458  [ U . S. Pat.No . 2,530,026 ] for ex am p le, d isclos es a r igid ci r c ui t  board  tha t i s provide d w it h  at lea st  o n e thro ughg oi ng hol e in w h icha heat-dissipating  elem e n t ism oun ted,at  leasto ne r adiation s ource being  mount ed o n the  heat-d is sipati ngel ement. The effective  heat -removi ng  hea t-d issipa ting e lemen t, f or  ex ample, is a  b l oc ko f m etal , inpa rtic ular copp e r. The d isa d vantage soft h ese ci r cu i t  boards ar e t he hi g h  cost pers urfa c ea rea,as wel l as t heir si z e a nd  weight . I n contrastthereto,“ Dir ec t Co pper Bon d”  (DC B)  su bs trates are comp osed ofcopper c o n ductiv e t r aces that a re  applied to
 medical_equipment technology,_and other applications.
Special components_for interconnecting_individual_LEDs to_create_larger illumination modules_are required in_order to implement these_advantages in the_above-mentioned_applications, which components ideally satisfy the following requirements. A desirable factor is a low_electrical_resistance for_electrical_currents_in the range of 100_mA up to several A,_and voltages_of typically up to 500 V. It is_also_desirable to be_able to mount the illumination elements flexibly on as_many 3-dimensional structures as possible so_as to achieve_a_wide_variety of lighting effects.
Thermal_management is extremely important due to_the high output over a very_small area measuring less than a few_mm2 for the LEDs. A low_junction temperature is absolutely essential_since an_increase in the junction temperature_results in a_reduction in_the service life_and light output of the LED._The efficiency declines_here as the temperature rises, with_the_result that the_luminous_efficacy_declines at_the limit of_performance_as a_function_of the type of cooling. For_this_reason it is critically important to create_the most effective thermal_connection_possible to a heat_sink so as to allow_the heat generated in the LED_to be_dissipated as_efficiently as possible. As a result, LEDs typically have, in addition_to the two electrical (+/−) contacts,_a “cooling connection” below_the semiconductor_junction_that is responsible_for_generating the_light and that must be connected as_efficiently as_possible to a heat sink, for_example, by means of_a_thermally conductive adhesive or solder. To_this end, a thermal resistance of_0.5-5 K/W must be achieved_for_high-performance_applications.
Currently, so-called high-performance circuit boards_are used to interconnect LEDs, for_which circuit boards_various technologies have typically come to be_employed._Metal-core circuit boards have a metal_core_of copper or aluminum that dissipates_heat._DE_10 2008 016 458 [U.S._Pat. No. 2,530,026] for example, discloses_a rigid circuit board that is provided with at_least one throughgoing_hole in which a heat-dissipating_element_is_mounted, at least one radiation source being mounted on the_heat-dissipating element._The effective heat-removing_heat-dissipating element, for example, is a block of metal, in_particular copper. The disadvantages of these circuit_boards are the high cost per surface area, as well as_their size and weight. In contrast thereto, “Direct_Copper Bond” (DCB) substrates are composed of_copper conductive traces that_are_applied to