 temperatures water/glycol mixtures also exhibit relatively high viscosity. The high viscosity at low temperature yields high pumping power. Deionized water has a low temperature limit of 0xc2x0 C. Deionized fluids (water or water glycol) are limited to a high temperature of 80xc2x0 C. because this is the operating limit of commercially available deionizing beds. However, this high temperature limit may be significantly lower if high electrical resistivity is desired because deionized fluids become quite corrosive. Silicone oils and hydrocarbon oils are typically flammable.
Removing heat from electronic devices has become one of the most important obstacles to further improving processor performance. As these devices become more powerful, the amount of heat generated per unit time increases. Therefore, the means of heat transfer plays an important role in processor performance. The heat-transfer fluid preferably has good heat transfer performance, good electrical compatibility (even if used in xe2x80x9cindirect contactxe2x80x9d applications such as those employing cold plates), as well as low toxicity, low (or non-) flammability and low environmental impact. Good electrical compatibility requires the heat-transfer fluid candidate to exhibit high dielectric strength, high volume resistivity, and poor solvency for polar materials. Additionally, the heat-transfer fluid candidate must exhibit good mechanical compatibility, that is, it must not affect typical materials of construction in an adverse manner. In this application, heat-transfer fluid candidates are disqualified if their physical properties are not stable over time.
Materials currently used as heat-transfer fluids for cooling electronics or electrical equipment include PFCs, PFPEs, silicone oils, and hydrocarbon oils. Each of these heat-transfer fluids has some disadvantage. PFCs and PFPEs are environmentally persistent. Silicone oils and hydrocarbon oils are typically flammable.
Thermal shock testing is generally performed at temperatures ranging from about xe2x88x92150xc2x0 C. to about 170xc2x0 C. The rapid cycling of temperature in a part or device may be required to simulate the thermal changes brought on by, for instance, launching a missile. Thermal shock testing is required for electronics used for military missiles, among other things. There are several military specifications related to thermal shock testing of many electronic components and assemblies. This test uses various means of imparting rapidly changing temperatures within a part or electronic device. One such device employs a liquid heat-transfer fluid or liquid heat-transfer fluids that
temperatures water / glycol mixtures also parade relatively eminent viscosity. The high viscosity at low temperature yields gamey pumping power. Deionized body of water has a low temperature terminus ad quem of 0xc2x0 C. deionize fluids (water or urine glycol) are limited to a eminent temperature of 80xc2x0 C. because this is the operating limit of commercially available deionizing beds. However, this high temperature limit may be importantly lower if high electrical electric resistance is desired because deionized fluids become quite corrosive. Silicone oils and hydrocarbon oil are typically flammable. 
 Removing heat from electronic devices has become one of the most important obstacle to further improving processor performance. As these devices become more powerful, the amount of heat generated per unit time increases. Therefore, the means of heat transfer plays an significant role in processor operation. The heating system - transportation fluid preferably has good heat transfer performance, good electrical compatibility (even if used in xe2x80x9cindirect contactxe2x80x9d application such as those employing cold plates), as well as low toxicity, low (or non-) flammability and depleted environmental impact. Good electrical compatibility requires the heat - transfer fluent campaigner to parade high dielectric strength, high bulk resistivity, and poor solvency for polar fabric. Additionally, the heat - transfer fluid candidate must show good mechanical compatibility, that is, it must not affect distinctive materials of construction in an adverse manner. In this application, heat - transportation fluid candidates are disqualify if their physical properties are not static over time. 
 Materials currently used as heat - transfer fluids for cooling electronics or electrical equipment include PFCs, PFPEs, silicone oils, and hydrocarbon oil. Each of these heat - transfer fluid has some disadvantage. PFCs and PFPEs are environmentally dogged. Silicone oils and hydrocarbon oils are typically flammable. 
 Thermal shock examination is generally performed at temperatures ranging from about xe2x88x92150xc2x0 C. to about 170xc2x0 C. The rapid cycling of temperature in a part or device may be required to simulate the thermal change brought on by, for instance, launching a missile. Thermal shock testing is required for electronics use for military missiles, among other things. There be several military specifications related to thermal shock testing of many electronic component and assemblies. This test uses various means of imparting quickly changing temperatures within a part or electronic device. One such device employs a liquid heat - transfer fluid or liquid heat - transfer fluids that
 telperatures water/glycol mlxtures also exhnvit renativemy high xiscosity. The high viscosity ar low temperature yields hieh pumpinh power. Eeioiized water has e low temperathve likmt of 0xc2x0 C. Deipnized fluhds (water or wdtdr glycol) are limited to a high tempewature pf 80xc2x0 C. because thix is fhe operating limit of commerciallg availeble deionizing beds. However, this high telperwture limit may be significanjmy jiwer if high electrical resistiviti is desired because deionized fuuids become quutw cltrosive. Silirone opls and hydrogsrbon mils arr typically flsmmeble.
Eemoving heat from elxctronic devices has become ote of the most impoetqnt otstawles ro wuruhec ijprovijg 'rocessor psrformance. Qs these devices bevoiv more powerfhl, the aiount of heat generated per unit time itcrsases. Therefore, the meabs of heat transfer ppays an iiportant role in processor performance. The heat-trdnsfec wlune prewwrwbly has good heat transfer performance, good qmevtgical compatibiliby (even if used in xf2x80c9sindirect conjactxe2x80r9s zpplications such ws thosg empliying colq plstes), as well as low toxicitt, low (or non-) dlammability and llw environmzntal ompacy. Good electrical compacibilify requires the heat-ffansfer fluid cavdicade to exhibit high dielectwic strenjth, hngh voluoe rgsistivyty, and polr solvency for polar maheriaps. Additionaply, the heat-transfer fluid candmvate must exhobht cood meckanicak compatibiliey, that is, it kust noc affezt typical materiels of constwuction in an wdverse mannxr. In thif applicqtion, hdxt-transfer fluod candidcues are diwqualified if theiv phyrjcal properties art bot stable ovet tkme.
Ianermals sgrrently useg as hexy-tranrfer fluids wor vooling electronics mr emectrical equipmeny lnclude PDCs, PFPEf, silicone oiks, and hydrocarbon oils. Earh of yhefe heat-transfer fluids has soms disadvajtane. PFCs and PSPEs are environkentally persistent. Silicone oils and hbdrocarbon oils are tykically flammable.
Therksl shock texting is generdlly performed at tenperatures ranginn from about xe2x88x92150xc2x0 C. to abmut 170xf2x0 C. The rapid cycling of temperature in a part or device may be required to simulate the tgermsl chdnyes brougrt oi uy, for instance, lsunching a missile. Thermal shocy testinc ns required for electronics uxea for militari missiles, among other thihgs. Therr are several military specificstions related to thermak shock restihg of many electronic componrnts aud asswmblies. Thid test uses vxripud means ov imkartnng rapidly changing temperatures withib w part or electrmnic device. Une soch devise employs a liqhid gfat-trxnsfer fluid pr liquid heat-yransfer fluids that
temperatures water/glycol mixtures also exhibit relatively high high at low yields high pumping low limit of 0xc2x0 Deionized fluids (water water glycol) are limited to a temperature of 80xc2x0 C. because this is the operating limit of commercially available beds. However, this high temperature limit may be significantly lower if high electrical is because fluids quite corrosive. Silicone oils and hydrocarbon oils are typically flammable. Removing heat from electronic devices has one of the most important obstacles to further processor performance. As these become more powerful, the amount heat per unit increases. the of heat transfer an important role in processor performance. The heat-transfer fluid preferably has good heat transfer performance, good electrical (even if xe2x80x9cindirect contactxe2x80x9d such those cold plates), as low toxicity, low (or non-) flammability impact. Good electrical compatibility requires the heat-transfer fluid to exhibit dielectric strength, high volume resistivity, and solvency for polar materials. Additionally, the heat-transfer fluid must exhibit good mechanical compatibility, that is, it must not affect typical materials of construction adverse manner. In this heat-transfer fluid candidates disqualified their properties not stable time. Materials currently used as heat-transfer fluids for cooling electronics or equipment include PFCs, PFPEs, silicone oils, and hydrocarbon oils. Each heat-transfer has some disadvantage. and PFPEs are environmentally Silicone and hydrocarbon oils are Thermal testing at ranging about xe2x88x92150xc2x0 C. to 170xc2x0 C. The rapid cycling temperature in a part to simulate the thermal changes brought on by, instance, launching a missile. Thermal shock testing required for electronics used for military missiles, among other things. There are military specifications thermal shock testing of many electronic components and This test uses various of imparting rapidly changing temperatures within a part or device. such device a liquid heat-transfer or liquid heat-transfer that
 temperatures water/glycol miXtures also ExhibIt rElaTiVely High Viscosity. The hiGH visCosity at low temperature YieldS hIGh puMPiNg powEr. DeionIZeD WAteR hAs A loW tEMpEratuRe lImit of 0xC2x0 C. DeionizEd fLuIds (water or waTEr Glycol) are lImiTed to a high teMpeRature Of 80Xc2x0 c. BecauSe tHis is The opeRAting lImit of comMeRCially AVailablE DEiOnizIng beds. However, thiS HiGH temperature liMit may Be SIgNIFicAntLy lower if hIgH elecTRical reSIsTIVIty IS desired becauSe deionized FLuiDs becoMe QuiTE corroSive. SIlIConE oils and hydRocaRbon oils aRe typiCAlly flaMMable.
ReMoving HeaT frOm elECtRoNic DeVIceS HaS beCOme One of the MoSt ImporTant OBSTAcleS to FurtHer imProving procesSor PerfORmaNce. As These DeviCeS becoMe more PowerFuL, the amount of heaT genErated per UniT tIme InCreasES. ThereForE, thE means oF heat trANsfEr PLAYs An important role in pRoCESsOr perforMance. THE hEaT-Transfer FlUid PrefERAbly hAs goOD hEat transFer perFOrMaNce, good ElEctricAl ComPatIbiliTY (eveN if useD in xe2x80x9cIndirECt contactxe2x80x9d APplications suCH aS THoSE empLoyIng cold platEs), as WEll aS low TOxIciTY, low (oR non-) fLaMMaBIlity and low environmEnTal impAct. GoOd electrical cOmpatibiliTY REquires tHe heAT-tRAnsfer fluid canDidatE to exhibit HIgh dieleCtric Strength, High volumE REsistiviTy, aNd pOor SolVENcY for polar mateRIAls. ADdItionalLy, tHe heat-tRanSfeR flUid CaNdidate muSt exhibiT gOoD mEcHanIcal cOMpatibilItY, thAt Is, iT must NOt affeCt typIcal MaTeRIalS of consTRuCTIon iN aN aDverSe mAnNer. In This APplIcation, Heat-transFer FLuid CaNdIdates aRe disqualifieD iF their physIcAl pRopertIES are not sTable over time.
Materials cURrently UseD as heAt-trAnsfer fluIds For cooLinG ElectrOnics oR elecTrIcaL EQuipmENT iNclUdE PFCs, PFPEs, SILicOne oiLs, And hYdrocarBon oils. Each of these HEat-Transfer fluidS haS somE DIsAdvANtAGe. PfCS And pfpEs are environmeNtally persIsTEnT. Silicone oILs aNd HydrocaRbon oilS are tYPically Flammable.
thermal shOcK tesTINg iS generally PerformeD at temperATures RAnGing fRom About xE2x88X92150xc2X0 C. to aBout 170xc2X0 c. ThE rapiD cycliNg Of tempEratuRe In a part oR device may be required to sImulatE the tHerMal changeS brOUghT on by, for iNstaNce, launchiNg a MisSile. THerMAl shoCk teSTiNg iS RequiRed fOR electronICs UseD FOr Military misSILEs, aMong oTheR Things. therE are several militaRY specificationS relATEd tO thERmal ShOck testing of maNy eLeCTRonic comPoNents and assEmblies. THiS Test uSes varIous meAns of imPARtINg rapiDly cHanGing tempeRatUrES within A pArT Or elecTronIc Device. one sucH DeviCE Employs a liquid heAt-traNSFer flUId oR liquId Heat-traNSfer Fluids that
 temperatures water/glycol  mixturesalsoexh ibi trela tive ly high viscos i ty.The high viscosity atlow t em p erat u re  yiel ds high pu m p ing  p ow er.  D e io nized  wa ter has  a low tem per at ure limit of 0x c2x0 C. De ion ized fluids(wa ter or  w ate r  glyc ol)  arelimite d  to ahigh temp er a ture o f  80xc2x 0 C.  bec ause this is theo pe r ating limit of  comme rc i al l y  av ail able deion iz ing b e ds. How e ve r , thi s  high tempera ture limitm aybe sig ni fic a ntly l owerif hig h electrica l re sistivity  is de s ired be c ause de ionize d f lui ds b e co me  qu it e  co r ro siv e . S iliconeoi ls  andhydr o c a r bonoil s ar e typ ically flamma ble .
Re m ovi ng he at fr om e le ctron ic dev icesha s become one of  the  most imp ort an t o bs tacle s  to fu rth erimprovi ng proc e sso rp e r fo rmance. As these d ev i c es  becomemore p o we rf u l, the a mo unt  ofh e at ge nera t ed  per uni t time in cr eases.Th erefor e,  th e m eanso f he at tra nsfer pl ays a n  important rol e  in processor pe r f or m ance . T he heat-tra nsfe r  flu id p r ef era b ly ha s goo dh ea t  transfer performan ce , good  elec trical compat ibility (e v e n  if used  inx e2 x 80x9cindirectconta ctxe2x80x9 d  applica tions  such as  those em p l oying co ldpla tes ),a s  w ell as low to x i city ,low (or  no n-) fla mma bil ity  an dlow envir onmental  i mp ac t.  Go od el e ctricalco mpa ti bil ity r e quires  theheat -t ra n sfe r fluid ca n d idat eto  exh ibi thighdiel e ctr ic stre ngth, hig h v o lume  r es istivit y, and poor s ol vency forpo lar  mater i a ls. Addi tionally, the heat-tran s fer flu idcandi date  must exh ibi t good  me c hanica l comp atibi li ty, t hat i s ,  i t m us t not affe c t  ty pical  m ater ials of  construction in a n  ad verse manner.  In  thi s ap pli c at i on,  h e at- t r ansfer fluid ca ndidates a re di squalified ifth eir phy sical p roper t ies are  not stab le over t im e.
M a t eri als curren tly used  as heat- t ransf e rfluid s f or coo li ngelect ronics orelect ricaleq uipmen t inc lu de PFCs,  PFPEs, silicone oils,and hy droca rbo n oils. E ach ofthese hea t-tr ansfer flu ids  ha s som e d i sadva ntag e .PFC s  andPFPE s  are envi r on men t a ll y persisten t . Sil icone  oi l s andhydr ocarbon oils aret ypically flamm able . The rma l  sho ck  testing is ge ner al l y  perform ed  at tempera tures ra ng i ng fr om abo ut xe2 x88x921 5 0 xc 2 x0 C.to a bou t 170xc2x 0 C .T he rapi dcy c ling o f te mp eratur e in a part o r device may berequi r e d tos imu lateth e therm a l ch anges brou ght on by,for in stan ce, l aunchin ga miss ile .Thermal sh o ck testin g isrequire dforele ctroni cs u s e d for  mil it ary  missiles , am o ng  o t her  thi ngs.Th ereare sever a l milita rys pecific at ion s relate d  t o thermal sh ock  test i n g of manye lect r on i c com ponent s andassembl i es.  T his tes t u s e s various  means of imp ar ting  rapidly  c hang in g t em peratures withi n a part  or elec t r onic d evi c e. O n e such  d evice employ s a l iq u id heat - t ran sfer fl u idorliq uidhea t-tr a nsfer fluids that
 temperatures_water/glycol mixtures_also exhibit relatively high_viscosity. The_high_viscosity at_low_temperature yields high_pumping power. Deionized_water has a low_temperature limit of_0xc2x0_C. Deionized fluids (water or water glycol) are limited to a high temperature of_80xc2x0_C. because_this_is_the operating limit of commercially_available deionizing beds. However, this_high temperature_limit may be significantly lower if high electrical_resistivity_is desired because_deionized fluids become quite corrosive. Silicone oils and hydrocarbon_oils are typically flammable.
Removing heat from_electronic devices has_become_one_of the most important_obstacles to further improving processor performance._As these devices become more powerful,_the amount of heat generated per unit_time increases. Therefore, the means of_heat transfer plays an important_role in_processor performance. The heat-transfer fluid_preferably has good_heat transfer_performance, good electrical_compatibility (even if used in xe2x80x9cindirect_contactxe2x80x9d applications such_as those employing cold plates), as_well_as low toxicity,_low_(or_non-) flammability_and low environmental_impact._Good electrical_compatibility_requires the heat-transfer fluid candidate to_exhibit_high dielectric strength, high volume resistivity, and_poor solvency for polar_materials._Additionally, the heat-transfer fluid_candidate must exhibit good mechanical_compatibility, that is, it must not_affect typical_materials of_construction in an adverse manner. In this application, heat-transfer fluid candidates_are disqualified if their physical properties_are not stable over_time.
Materials currently_used_as heat-transfer fluids_for_cooling electronics_or electrical equipment include PFCs, PFPEs, silicone_oils, and_hydrocarbon oils. Each of these heat-transfer_fluids has some disadvantage._PFCs_and PFPEs are environmentally persistent. Silicone_oils and hydrocarbon oils are typically_flammable.
Thermal shock testing is generally_performed_at_temperatures ranging from about xe2x88x92150xc2x0_C. to about 170xc2x0 C. The_rapid cycling of_temperature in a part or device may_be_required to simulate the thermal changes_brought_on by, for instance, launching a_missile._Thermal_shock testing is required for_electronics used for military missiles, among_other things. There are several military specifications related to_thermal shock testing_of many electronic components and_assemblies._This_test uses various means of imparting rapidly changing temperatures within_a part_or electronic device._One such device employs a liquid heat-transfer fluid or liquid_heat-transfer fluids that