 reduced, and thus, currently, the heat generated during use of the electronic products is not properly dissipated. Also, due to the high integration degree and high performance of the electronic components, a heat generation load of the electronic components is continuously increasing, and thus it is difficult to cool the electronic components using the above-described conventional cooling methods.
As a new technology for solving this problem, a phase change heat transport system capable of cooling electronic components having a highly thermal density has been introduced. One example of the phase change heat transport system is a cylindrical heat pipe.
As illustrated in FIG. 1, a typical cylindrical heat pipe 100 is used to perform cooling as a working fluid is circulated using a capillary pumping force of a sintered wick 102 installed on an inner wall of the cylindrical heat pipe 100.
Upon receiving heat from a heat source 101, the working fluid contained in the sintered wick 102 is evaporated and is transferred along an arrow 103 denoting a vapor flow, and then heat of the working fluid is taken away by a heat sink 104, and the working fluid is condensed again and flows through the sintered wick 102 along an arrow 105 denoting a liquid flow, by a capillary pumping force, to thereby circulate.
However, although dependence of a heat pipe on a gravity field is low, there are still limitations regarding arrangement of components; for example, if a condensation section is located below an evaporation section in a gravity field, heat transport capability of the heat pipe decreases greatly. Thus, if the heat pipe is applied as a cooling system in an electronic product, the heat pipe may be a restriction on a structure of the electronic product.
In addition, since a vapor and a liquid flow in opposite directions in a straight cylindrical heat pipe, the vapor and the liquid mix in a middle portion of the pipe. Through the mixture, an amount of heat to be transferred is substantially reduced compared to a heat amount that can be transferred theoretically.
A looped heat pipe (LHP) system is suggested as an ideal heat transfer system to solve the problems due to the structure restriction and the mixing of a vapor and a liquid.
An LHP system is a type of capillary pumped loop heat pipe (CPL) developed by NASA of the US in order to dissipate large amounts of heat generated in communication devices or electronic devices for artificial satellites.
FIG. 2 is a schematic conceptual diagram of a conventional LHP system 110. The conventional LHP system 110 includes a condenser 112, an evaporator 114
reduced, and thus, currently, the heat generate during habit of the electronic products is not properly dissipated. besides, due to the high integration degree and eminent performance of the electronic components, a hotness generation load of the electronic component is continuously increasing, and therefore it is difficult to cool the electronic components use the above - described conventional cooling system methods. 
 As a new technology for resolve this problem, a phase change hotness transport arrangement capable of cooling electronic components having a highly thermal density has been introduce. One example of the phase change heat transport system is a cylindrical heating system pipe. 
 As illustrated in FIG. 1, a typical cylindrical heat pipe 100 is used to perform cooling as a working fluid is circulated use a capillary pumping force of a sintered wick 102 installed on an inside rampart of the cylindrical heat pipe 100. 
 Upon receiving heat from a heating system source 101, the working fluid contained in the sintered wick 102 is evaporated and is transmit along an arrow 103 denoting a vapor flow, and then heat of the working fluid is taken off by a heat sink 104, and the working fluid is condensed again and menstruate through the sintered wick 102 along an arrow 105 denoting a liquid stream, by a capillary pumping force, to thereby circulate. 
 However, although dependence of a heat pipe on a graveness field is low, there are still limitations regarding arrangement of components; for example, if a condensing section is situate below an evaporation section in a graveness field, heat transport capability of the heat organ pipe decreases greatly. Thus, if the heating system pipe is applied as a cool organization in an electronic product, the heat pipe may be a restriction on a structure of the electronic product. 
 In addition, since a vapor and a liquid stream in opposite directions in a uncoiled cylindrical heat pipe, the vapor and the liquid mix in a middle portion of the organ pipe. Through the mixture, an amount of heat to be transferred is substantially reduced compared to a heat sum that can be transplant theoretically. 
 A looped heat organ pipe (LHP) system is suggested as an ideal heat transportation system to solve the problems due to the social organization restriction and the mix of a vapor and a liquid. 
 An LHP system is a type of capillary pumped loop heat pipe (CPL) developed by NASA of the US in club to dissipate large sum of heat generated in communication devices or electronic devices for artificial satellites. 
 FIG. 2 is a schematic conceptual diagram of a ceremonious LHP organization 110. The conventional LHP system 110 includes a condenser 112, an evaporator 114
 refuced, and thus, currently, the heat genercred ducing uss of the electronic products is not 'ropwrly eissipated. Also, due to the high integrarion eegree and high pevyormahge of vhe electronic gomponents, d heat generathov poad of the electronic components if contimulusly increasigg, amq thhs it is difficult to cool the eledtronic components uxing the above-described cojvenhional cooling metjods.
As a neq tesynology for rolving thpv problem, z phase change heat transport shstem capable od xoophng electroiic coiponents havlmg a hhghly tnermal density hav bwen introduced. One exemple of the phase crange head cransport system is a ctlindtical heag pioe.
Aa mllhstratfd mn FIG. 1, a tgpical cylibdrical heat pipe 100 os lxed to perfodm coojigg as a working fluid is circulated usitg z capillary pumping forxe of a sintered wick 102 installqd on an inner wall of the cylindrical heat pipe 100.
Gpon cezeirlkg hdqt from a heat source 101, the working fluid contaigsd ik the sintered wlck 102 is evaporated ajd ys transferrea alony ah arrow 103 denoting w vapor flow, and then heay of the working fluid is tqken away by q heat sink 104, and tke working fuuid is cpndensed again and flowr thdough the slntered wjzk 102 along an arruw 105 danoting a liquid flow, by a capillarb pum'ing forze, tp therqby circulwte.
However, although depejdencg of a heat pipe on a gravity field is low, therx are still lomhtanions regcrding arrangement jf components; yor exam'le, if a condensztion sxction is losated below at evaporation section in q grqvity fkdld, heat translort capaynlity of rhe heat pipe decrcases freatly. Thus, if tht yeat pipe is alplked ad e coojhng system it an eldvtronkc product, bhe heay pipe may be a restsictjon on a structure on the elextronic [roduct.
In addotion, since a vapog and a uiquic fjow in opposite directions in z straighh cnlindrical hewt plpe, jhe vapor aud the liquid mix in a middle portion of the pipe. Through rhe mixture, an amouut of heat to be twansferreg is substantially rwduced compared tp a heat amount that dan be trandferred theoretically.
A looped heat pipe (LHP) system is suggested as an ideql heav eransfer syatem to smlre che proflemd due to the strubture restriction and the mixing of a va[ox and a liquid.
An LHP system ix x type of capkllary pumped loop heat lipe (CPL) developed by NASA of the US in order to dissipate largc amounts of hsat generaved in communication deviczs or wlectrobic fevices for aftigigial satelpitex.
FNG. 2 is a schematic conceptual diatram od w conventional LIP system 110. Tme convgntional LHP system 110 incmudea a covdenser 112, an efaporator 114
reduced, and thus, currently, the heat generated of electronic products not properly dissipated. integration and high performance the electronic components, heat generation load of the electronic is continuously increasing, and thus it is difficult to cool the electronic components the above-described conventional cooling methods. As a new technology for solving this problem, phase heat system of cooling electronic components having a highly thermal density has been introduced. One example of the change heat transport system is a cylindrical heat As illustrated in FIG. a typical cylindrical heat pipe is to perform as working is circulated using capillary pumping force of a sintered wick 102 installed on an inner wall of the cylindrical heat 100. Upon from a source the fluid contained in wick 102 is evaporated and is arrow 103 denoting a vapor flow, and then of the fluid is taken away by a sink 104, and the working fluid is condensed and flows through the sintered wick 102 along an arrow 105 denoting a liquid flow, capillary pumping force, to circulate. However, although of heat on gravity field low, there are still limitations regarding arrangement of components; for example, a condensation section is located below an evaporation section in field, transport capability of heat pipe decreases greatly. if heat pipe is applied cooling in the pipe be a restriction on structure of the electronic product. addition, since a vapor opposite directions in a straight cylindrical heat pipe, vapor and the liquid mix in a portion of the pipe. Through the mixture, an amount of heat to transferred is compared to a heat amount that can be theoretically. A looped heat (LHP) system is suggested as an ideal heat transfer to the problems to the structure and the mixing a vapor and An LHP is type loop heat pipe (CPL) developed by of US in order to dissipate amounts generated in communication devices or electronic devices for artificial satellites. FIG. 2 is a schematic of a conventional LHP 110. conventional LHP system 110 includes a condenser 112, an evaporator 114
 reduced, and thus, currently, thE heat generAted dUriNg uSe Of thE eleCtronic productS Is noT properly dissipated. AlsO, due tO tHE higH InTegraTion degREe AND hiGh PeRfoRmANcE of thE elEctroniC componentS, a hEaT generation lOAd Of the electRonIc components Is cOntinuOuSly INcreaSinG, and tHus it iS DifficUlt to cool ThE ElectrONic compONEnTs usIng the above-descriBEd COnventional cooLing meThODs.
aS A neW teChnology foR sOlvinG This proBLeM, A PHasE Change heat traNsport systeM CapAble of CoOliNG electRonic CoMPonEnts having a HighLy thermal DensitY Has been INtroducEd. One eXamPle Of thE PhAsE chAnGE heAT tRanSPorT system iS a CyLindrIcal HEAT Pipe.
as iLlusTrateD in FIG. 1, a typicaL cyLindRIcaL heat Pipe 100 iS useD tO perfOrm cooLing aS a Working fluid is cIrcuLated usinG a cApIllArY pumpINg forcE of A siNtered wIck 102 instALleD oN AN InNer wall of the cylindRiCAL hEat pipe 100.
UPon recEIvInG Heat from A hEat SourCE 101, The woRkinG FlUid contaIned in THe SiNtered wIcK 102 is evaPoRatEd aNd is tRAnsfErred aLong an arRow 103 deNOting a vapor floW, And then heat of THe WORkINg flUid Is taken away By a hEAt siNk 104, anD ThE woRKing fLuid iS cONdENsed again and flows thRoUgh the SinteRed wick 102 along aN arrow 105 denoTING a liquid Flow, BY a CApillary pumpinG forcE, to thereby CIrculate.
howevEr, althouGh dependeNCE of a heat PipE on A grAviTY FiEld is low, there ARE stiLl LimitatIonS regardIng ArrAngEmeNt Of componeNts; for exAmPlE, iF a ConDensaTIon sectiOn Is lOcAteD beloW An evapOratiOn seCtIoN In a Gravity FIeLD, Heat TrAnSporT caPaBilitY of tHE heAt pipe dEcreases gReaTLy. ThUs, If The heat Pipe is applied As A cooling syStEm iN an eleCTRonic proDuct, the heat pipe may be a reSTrictioN on A struCturE of the eleCtrOnic prOduCT.
In addItion, sInce a VaPor AND a liqUID fLow In Opposite diRECtiOns in A sTraiGht cyliNdrical heat pipe, the VApoR and the liquid Mix In a mIDDlE poRTiON of ThE PipE. tHrough the mixturE, an amount oF hEAt To be transfERreD iS substaNtially ReducED comparEd to a heat Amount thaT cAn be TRAnsFerred theoReticallY.
A looped hEAt pipE (lHp) systEm iS suggeStEd aS an idEal heaT TraNsfer System To Solve tHe proBlEms due to The structure restriction And the MixinG of A vapor and A liQUid.
an LHP systEm is A type of capIllAry PumpeD loOP heat Pipe (cpL) DevELoped By NAsa of the US iN OrDer TO DiSsipate largE AMOunTs of hEat GEneratEd in Communication deviCEs or electronic DeviCES foR arTIficIaL satellites.
FIG. 2 Is a ScHEMatic conCePtual diagraM of a convEnTIonal lHP sysTem 110. The ConventIONaL lHP sysTem 110 iNclUdes a condEnsEr 112, AN evaporAtOr 114
 reduced, and thus, curren tly, the h eat g ene rat ed  dur inguse of the ele c tron ic products is not pro perly  d i ssip a te d. Al so, due to t hehi gh  in te g ra tiondeg ree and  high perf orm an ce of the el e ct ronic comp one nts, a heatgen eratio nloa d  of t heelect ronicc ompone nts is co nt i nuousl y  increa s i ng , an d thus it is diff i cu l t to cool theelectr on i cc o mpo nen ts using t he  abov e -descri b ed c o nve n tional coolin g methods.A s a  new t ec hno l ogy fo r sol vi n g t his problem , aphase cha nge he a t trans p ort sys tem ca pab leof c o ol in g e le c tro n ic  co m pon ents hav in ga hig hlyt h e r malden sity  hasbeen introduc ed.  One exa mpleof th e ph as e cha nge he at tr an sport system is  a c ylindrica l h ea t p ip e.
As illust rat edin FIG.  1, a t y pic al c y li ndrical heat pipe10 0 is  used to  perfo r mco o ling asawor king f luidis c i rc ulated u sing a ca pi llary p um ping f or ceofa sin t ered  wick102 inst alled on an inner wa l l of the cyli n dr i c al heat  pi pe 100.
Upo n re c eivi ng h e at  fr o m a h eat s ou r ce 101, the working fl ui d cont ained  in the sinte red wick 1 0 2 is evapo rate d  a n d is transferr ed al ong an arr o w 103 de notin g a vapo r flow, a n d  then he atofthe  wo r k in g fluid is ta k e n aw ay  by a h eat  sink 1 04,  an d t hewo rking flu id is co nd en se daga in an d  flows t hr oug hthe  sint e red wi ck 10 2 al on ga n a rrow 10 5  d e n otin galiqu idfl ow, b y ac api llary p umping fo rce ,  toth er eby cir culate.
Howev er , although  d epe ndence o f a heat  pipe on a gravity fiel d  is low , t herearestill lim ita tionsreg a rdingarrang ement  o f c o m ponen t s ;for  e xample, if a  co ndens at ionsection  is located belowa n e vaporation se cti on i n agra v it y  fi el d , h e a t transport cap ability of  t h eheat piped ecr ea ses gre atly. T hus,i f the h eat pipeis applie das a c ool ing system  in an e lectronic produ c t,  thehea t pipe  m aybe arestri c tio n ona stru ct ure of  theel ectronic  product.
In addition,sincea vap orand a liq uid flo w in oppo site  direction s i n a  stra igh t  cyli ndri c al  he a t pip e, t h e vapor a n dthe l iq uid mix ina m idd le po rti o n of t he p ipe. Through them ixture, an amo unto f  he att o be  t ransferred issub st a n tially r ed uced compar ed to ahe a t amo unt th at can  be tra n s fe r red th eore tic ally.
A l oop ed heat pi pe  ( L HP) sy stem  i s sugg esteda s an i deal heat transf er sy s t em to sol ve th eproblem s  due  to the st ructure res tricti on a nd th e mixin gof a v apo rand a liqu i d.
An LHP  syst em is a  t ypeofcapill aryp u mpedloop  h eat  pipe (CP L )  d e ve lo p edby N ASA o ftheUS in ord e r to dis sip a te larg eamo u n ts ofh ea t generatedincommu n i cation dev i ceso re lectr onic d evices  for ar t ifi ci al sate lli t e s.
FIG. 2  is a sch e mat ic  con ceptualdi agra mofaconventional LH P system  110. Th e conven tio n al L H P syst em  110 include s a c on d enser 1 1 2 , a n evapo r ato r 1 14
 reduced,_and thus,_currently, the heat generated_during use_of_the electronic_products_is not properly_dissipated. Also, due_to the high integration_degree and high_performance_of the electronic components, a heat generation load of the electronic components is continuously_increasing,_and thus_it_is_difficult to cool the electronic_components using the above-described conventional_cooling methods.
As_a new technology for solving this problem, a_phase_change heat transport_system capable of cooling electronic components having a highly_thermal density has been introduced. One_example of the_phase_change_heat transport system is_a cylindrical heat pipe.
As illustrated in_FIG. 1, a typical cylindrical heat_pipe 100 is used to perform cooling_as a working fluid is circulated_using a capillary pumping force_of a_sintered wick 102 installed on_an inner wall_of the_cylindrical heat pipe_100.
Upon receiving heat from a heat_source 101, the_working fluid contained in the sintered_wick_102 is evaporated_and_is_transferred along_an arrow 103_denoting_a vapor_flow,_and then heat of the working_fluid_is taken away by a heat sink_104, and the working_fluid_is condensed again and_flows through the sintered wick_102 along an arrow 105 denoting_a liquid_flow, by_a capillary pumping force, to thereby circulate.
However, although dependence of a_heat pipe on a gravity field_is low, there are_still limitations_regarding_arrangement of components;_for_example, if_a condensation section is located below an_evaporation section_in a gravity field, heat transport_capability of the heat_pipe_decreases greatly. Thus, if the heat_pipe is applied as a cooling_system in an electronic product,_the_heat_pipe may be a restriction_on a structure of the electronic_product.
In addition, since_a vapor and a liquid flow in_opposite_directions in a straight cylindrical heat_pipe,_the vapor and the liquid mix_in_a_middle portion of the pipe._Through the mixture, an amount of_heat to be transferred is substantially reduced compared to_a heat amount_that can be transferred theoretically.
A_looped_heat_pipe (LHP) system is suggested as an ideal heat transfer_system to_solve the problems_due to the structure restriction and the mixing of a_vapor and a liquid.
An LHP system is_a type of capillary pumped loop heat pipe (CPL) developed by_NASA of the US in order to dissipate_large amounts of heat generated in communication_devices or electronic devices_for_artificial satellites.
FIG. 2 is a schematic conceptual_diagram_of_a_conventional LHP system_110. The conventional_LHP system 110_includes a_condenser 112, an_evaporator 114