 number for a person, business or other entity which he or she desires to call via a number dial or pad. The convenience of this manual interface may be improved in conventional devices by the use of such features as “speed-dial” which allows a user to program frequently called numbers into a memory in the telephone and then dial one of those multi-digit numbers by pressing a single button. Presently, automatic telephone dialing interfaces, that is dialing interfaces which do not require user contact to enter a telephone number to be dialed, are not available other than perhaps in preprogrammed or random number dialing systems. Convenient systems for home or work use that allow a user to automatically dial a particular number of the users choice are unknown.
In addition, the present inventors contemplate that RF controlled telecommunications devices could have a variety of applications beyond conventional telephony. Such applications would require telecommunications devices and systems which incorporate and use RF tag technology in novel ways.
Accordingly, the development and application of RF telecommunications devices and systems which incorporate and use RF tag technology in novel ways is desirable. 1). Field of the Invention
This invention relates to an apparatus that is used for full-wafer testing and/or burn-in testing and/or built-in self-testing.
2). Discussion of Related Art
Microelectronic circuits are usually fabricated in and on semiconductor wafers. Such a wafer is subsequently “singulated” or “diced” into individual dies. Such a die is typically mounted to a supporting substrate for purposes of providing rigidity thereto and electronic communication with an integrated or microelectronic circuit of the die. Final packaging may include encapsulation of the die and the resulting package can then be shipped to a customer.
It is required that the die or the package be tested before being shipped to a customer. Ideally, the die should be tested at an early stage for the purposes of identifying the defects that occur during early-stage manufacturing.
The earliest stage that a die can be tested is after completion of the manufacture of microelectronic circuits at wafer level and before a wafer is singulated. Full wafer testing carries with it a number of challenges. One challenge in full wafer testing is that there is a large amount of contacts on a wafer and that a large number of power, ground, and signal connections thus have to be made. Another challenge is that burn-in testing requires a thermal management system that can maintain the wafer stable at a relatively high temperature, while providing a system that is simple to operate and relatively inexpensive. The bread
number for a person, business or other entity which he or she desires to visit via a numeral dial or pad. The convenience of this manual interface may be improved in ceremonious devices by the use of such features as “ focal ratio - dial ” which allows a user to program frequently call numbers into a memory in the telephone and then dial one of those multi - digit numbers by iron a single button. soon, automatic telephone dialing interfaces, that is dialing interfaces which do not require user contact to enter a telephone act to be dialed, are not available other than perhaps in preprogrammed or random issue dialing systems. Convenient systems for home or employment use that allow a user to automatically dial a particular numeral of the users choice are unknown. 
 In addition, the present inventors contemplate that RF controlled telecommunications devices could have a variety of applications beyond conventional telephony. Such applications would require telecommunications device and systems which incorporate and practice reticular formation rag technology in novel ways. 
 Accordingly, the development and application of RF telecommunications devices and system which incorporate and use RF tag technology in novel direction is desirable. 1). Field of the Invention 
 This invention relates to an apparatus that is used for full - wafer testing and/or burn - in examination and/or build - in self - testing. 
 2). Discussion of Related Art 
 Microelectronic circuits are usually manufacture in and on semiconductor wafers. Such a wafer is subsequently “ singulated ” or “ diced ” into individual dies. Such a die is typically mount to a supporting substrate for purposes of providing rigidity thereto and electronic communication with an incorporate or microelectronic circuit of the die. Final packaging may include encapsulation of the die and the resulting software can then be shipped to a customer. 
 It is required that the die or the package be tested before being ship to a customer. Ideally, the die should be tested at an early stagecoach for the purposes of identifying the blemish that occur during early - phase manufacturing. 
 The early stage that a die can be tested is after completion of the manufacture of microelectronic circuits at wafer level and before a wafer is singulated. entire wafer testing carries with it a issue of challenges. One challenge in full wafer examination is that there is a large amount of contacts on a wafer and that a large number of power, ground, and signal connections thus have to be make. Another challenge is that sunburn - in examination want a thermal management system that can maintain the wafer stable at a relatively high temperature, while providing a arrangement that is simple to operate and relatively inexpensive. The boodle
 nulber for a person, businers or other entnry whirh he od she derires to call via a number dmal ir pae. The convenience of tfis manuap interfqce nqy be improved in gjnvehbionan devices by thg use of sucv features as “vpdeb-dial” which allows a user to program frequemtpy called numbgrs imeo a memory in the telephone and then sial ont of those multi-dibit numbers by pressing a dingpe button. Presentlj, automatic telqphone dialine interfacts, that is djaling interfaces which do not fequixe user conjcxt hm enter a txlephoge number to be dialad, are mot available pthxr tyan perhaps in preprojrammed or random nuiber dialhny systems. Convenient wywtems for homd or wodk uae thah amlow a used to automarically dial a partoctoar number of the ufews choice are unknown.
In addition, the prtsent inventors contemplate rhat RF controlled tepecommunisations devices could have a variety of applicatimns bxyund cjvcejtional telephony. Such applications would reqtjrt tvlecommunications devices anc dyxjems which incurporacs znd use RF tag tecjnology in nivel ways.
Wccotdingly, the development and application if RF telecommunicctions deviczs and systrms which incorporate aud use RF tag tecjnology ih novel ways is ddsigabla. 1). Field of the Invention
Tris invenvion xelates go am appawatus that is used for full-wafer tfstiny and/mr burn-in hesting and/or built-in self-testiij.
2). Discussion pf Renated Arc
Microclectronic circtits are usualky fabrncated in and on semicoiductor wafews. Such a wafat is subsequeitly “singtlatwd” oe “diced” knto individuak dies. Subh a due is typically momnted fo a supporting suvstrate for purlosds jf pcovidytg rigidity dherdto snd euectronic ciomunocation with an intecratsd or microelectromig circuit of the qie. Final paclaging may include enca'sulatmon of thg die and the resulting package can then be shipped to w cuwtomer.
It is xequired that the die or the package be vested before being shipped to a customer. Ndtally, the die shoujd be tesded at an early stagw for the purposex of identifying the sefectv thah occur during early-stage manufacturing.
The earliest stage that a die can ve tesveq is after dompketiot jy the mwnufecvure of microelecnronic circuits at wafer level aid before d cafer is singulated. Full wafet gesting carrigs with it a number of chamlenges. Pne challenge in full wafer tesying is that there is a karge amiunt kf connzcvs on a wafer and thst a lcrge nymber od poaer, ground, ana sogkal connechionx chus have to be made. Another chaloenge us that burn-in tesving required a thgrmal magagement system fhat fan mxintain the wsfer stable at a relatively high tvmpqrature, while kroviding a sysjem that is simple tp operate atd relatively inexpensive. The bread
number for a person, business or other he she desires call via a convenience this manual interface be improved in devices by the use of such as “speed-dial” which allows a user to program frequently called numbers into a in the telephone and then dial one of those multi-digit numbers by pressing single Presently, telephone interfaces, that is dialing interfaces which do not require user contact to enter a telephone number be dialed, are not available other than perhaps preprogrammed or random number systems. Convenient systems for home work that allow user automatically a particular number the users choice are unknown. In addition, the present inventors contemplate that RF controlled telecommunications devices could a variety beyond conventional Such would telecommunications devices and incorporate and use RF tag technology Accordingly, the development and application of RF telecommunications and systems incorporate and use RF tag technology novel ways is desirable. 1). Field of the This invention relates to an apparatus that is used for full-wafer testing and/or burn-in testing self-testing. 2). Discussion of Art Microelectronic circuits usually in on wafers. Such wafer is subsequently “singulated” or “diced” into individual dies. Such a is typically mounted to a supporting substrate for purposes of thereto electronic communication with integrated or microelectronic circuit the Final packaging may include the and can be to a customer. It required that the die or package be tested before Ideally, the die should be tested at an stage for the purposes of identifying the that occur during early-stage manufacturing. The earliest stage that a die can tested is of the manufacture of microelectronic circuits at wafer and before a wafer singulated. Full wafer testing carries with it a number challenges. challenge in wafer testing is there is a amount of contacts wafer and a number and signal connections thus have to made. challenge is that burn-in testing a system that can maintain the wafer stable at a relatively high temperature, while providing a is simple to operate relatively The bread
 number for a person, business oR other entiTy whiCh hE or ShE desIres To call via a numbER diaL or pad. The convenience of This mAnUAl inTErFace mAy be impROvED In cOnVeNtiOnAL dEviceS by The use oF such featuRes As “Speed-dial” whiCH aLlows a user To pRogram frequeNtlY calleD nUmbERs intO a mEmory In the tELephonE and then dIaL One of tHOse multI-DIgIt nuMbers by pressing a sINgLE button. PresentLy, autoMaTIc TELepHonE dialing inTeRfaceS, That is dIAlING IntERfaces which do Not require uSEr cOntact To EntER a telePhone NuMBer To be dialed, aRe noT availablE other THan perhAPs in prePrograMmeD or RandOM nUmBer DiALinG SySteMS. CoNvenient SyStEms foR homE OR WOrk uSe tHat aLlow a User to automatIcaLly dIAl a PartiCular NumbEr Of the Users cHoice ArE unknown.
In additIon, tHe present InvEnTorS cOntemPLate thAt Rf coNtrolleD telecoMMunIcATIOnS devices could have a VaRIEtY of appliCationS BeYoND conventIoNal TelePHOny. SuCh apPLiCations wOuld reQUiRe TelecomMuNicatiOnS deVicEs and SYsteMs whicH incorpoRate aND use RF tag technOLogy in novel waYS.
ACCOrDInglY, thE developmenT and APpliCatiON oF RF TElecoMmuniCaTIoNS devices and systems wHiCh incoRporaTe and use RF tag Technology IN NOvel ways Is deSIrABle. 1). Field of the INventIon
This invENtion relAtes tO an apparAtus that iS USed for fuLl-wAfeR teStiNG AnD/or burn-in testING and/Or Built-in SelF-testinG.
2). DiScuSsiOn oF RElated Art
microeleCtRoNiC cIrcUits aRE usually FaBriCaTed In and ON semicOnducTor wAfErS. sucH a wafer IS sUBSequEnTlY “sinGulAtEd” or “dIced” INto IndividUal dies. SuCh a DIe is TyPiCally moUnted to a suppoRtIng substraTe For PurposES Of providIng rigidity thereto and elECtronic ComMunicAtioN with an inTegRated oR miCRoelecTronic CircuIt Of tHE Die. FiNAL pAckAgIng may inclUDE enCapsuLaTion Of the diE and the resulting paCKagE can then be shiPpeD to a CUStOmeR.
it IS reQuIRed THAt the die or the paCkage be tesTeD BeFore being sHIppEd To a custOmer. IdeAlly, tHE die shoUld be testEd at an earLy StagE FOr tHe purposes Of identiFying the dEFects THaT occuR duRing eaRlY-stAge maNufactURinG.
The eArliesT sTage thAt a diE cAn be testEd is after completion of thE manufActurE of MicroelecTroNIc cIrcuits at WafeR level and bEfoRe a Wafer Is sINgulaTed. FULl WafER testIng cARries with IT a NumBER oF challenges. oNE ChaLlengE in FUll wafEr teSting is that there iS A large amount of ContACTs oN a wAFer aNd That a large numbEr oF pOWEr, ground, AnD signal connEctions tHuS Have tO be madE. AnothEr challENGe IS that bUrn-iN teSting requIreS a THermal mAnAgEMent syStem ThAt can mAintaiN The wAFEr stable at a relatIvely HIGh temPEraTure, wHiLe proviDIng a System that Is simple to oPerate And rElatiVely ineXpEnsive. the BrEad
 number for a person, busi ness or ot her e nti tywh ichhe o r she desirest o ca ll via a number dial o r pad .T he c o nv enien ce of t h is m anu al  i nte rf a ce  maybeimprove d in conve nti on al devices b y  t he use ofsuc h features a s “ speed- di al” which  al lowsa user to pro gram freq ue n tly ca l led num b e rs  int o a memory in the te l ephone and the n dial  o n eo f  th ose  multi-dig it  numb e rs by p r es s i n g a single button . Presently ,  au tomati ctel e phonediali ng int erfaces, th at i s dialing  inter f aces wh i ch do n ot req uir e u serc on ta ctto ent e ra t e lep hone num be rto be  dia l e d ,  are  no t av ailab le other than  pe rhap s  in  prep rogra mmed  o r ran dom nu mberdi aling systems.Conv enient sy ste ms  fo rhomeo r work  us e t hat all ow a us e r t oa u t om atically dial a pa rt i c ul ar numbe r of t h eus e rs choic eare  unk n o wn.
I n ad d it ion, the  prese n tin ventors  c ontemp la tetha t RFc ontr olledtelecomm unica t ions devices c o uld have a va r ie t y  o f  app lic ations beyo nd c o nven tion a ltel e phony . Suc ha pp l ications would requ ir e tele commu nications dev ices and s y s t ems whic h in c or p orate and useRF ta g technolo g y in nov el wa ys.
Acco rdingly,t h e develo pme ntand  ap p l ic ation of RF t e l ecom mu nicatio nsdevices  an d s yst ems  w hich inco rporatean dus eRFtag t e chnology  i n n ov elwaysi s desi rable . 1) .Fi e ldof theI nv e n tion 
T hi s in ven ti on re late s  to  an app aratus th ati s us ed  f or full -wafer testin gand/or bur n- intestin g and/or b uilt-in self-testing.
2 ) . Discu ssi on of  Rel ated ArtMic roelec tro n ic cir cuitsare u su all y fabri c a te d i nand on sem i c ond uctor  w afer s. Such  a wafer is subseq u ent ly “singulate d”or “ d i ce d”i nt o  in di v idu a l  dies. Such a d ie is typi ca l ly  mounted t o  asu pportin g subst ratef or purp oses of p rovidingri gidi t y  th ereto andelectron ic commun i catio n  w ith a n i ntegra te d o r mic roelec t ron ic ci rcuitof  the d ie. F in al packa ging may include encaps ulatio n ofthe  die andthe res ulting pa ckag e can then  be  sh ipped  to a cus tome r .Iti s req uire d  that the di e o r th e package b e t est ed be for e  being  shi pped to a custome r . Ideally, the  die s hou ldb e te st ed at an early  st ag e for thepu rposes of i dentifyi ng the d efects  thatoccur d u r in g  early -sta gemanufactu rin g. The ear li es t  stage  tha ta diecan be test e d  is after comple tiono f  them anu factu re  of mic r oele ctronic ci rcuits at w afer l evel  andbeforeawaferissi ngulated.F ull wafer  test ing car ri es w ith  it anumb e r  of c hall en ges . One cha l l en g ein ful l wa fer t es ting  is thatt here isa l a rge amo un t o f contac t so n  a wafer a ndthata large numb e r of po w er, g round,  and s ignal c o nne ct ions th ush a ve to bemade. Ano t her  c hall enge isth at b ur n-i ntesting require s a ther mal mana g e ment s yst e m th a t canma intain the w aferst a ble ata rel atively hig h t emp erat ure , wh i le providing a system th at i s sim p leto op erate  a nd relat i vely  inexpen s ive. The brea d
 number_for a_person, business or other_entity which_he_or she_desires_to call via_a number dial_or pad. The convenience_of this manual_interface_may be improved in conventional devices by the use of such features as “speed-dial”_which_allows a_user_to_program frequently called numbers into_a memory in the telephone_and then_dial one of those multi-digit numbers by pressing_a_single button. Presently,_automatic telephone dialing interfaces, that is dialing interfaces which_do not require user contact to_enter a telephone_number_to_be dialed, are not_available other than perhaps in preprogrammed_or random number dialing systems. Convenient_systems for home or work use that_allow a user to automatically dial_a particular number of the_users choice_are unknown.
In addition, the present_inventors contemplate that_RF controlled_telecommunications devices could_have a variety of applications beyond_conventional telephony. Such_applications would require telecommunications devices and_systems_which incorporate and_use_RF_tag technology_in novel ways.
Accordingly,_the_development and_application_of RF telecommunications devices and systems_which_incorporate and use RF tag technology in_novel ways is desirable._1)._Field of the Invention
This_invention relates to an apparatus_that is used for full-wafer testing_and/or burn-in_testing and/or_built-in self-testing.
2). Discussion of Related Art
Microelectronic circuits are usually fabricated in_and on semiconductor wafers. Such a_wafer is subsequently “singulated”_or “diced”_into_individual dies. Such_a_die is_typically mounted to a supporting substrate for_purposes of_providing rigidity thereto and electronic communication_with an integrated or_microelectronic_circuit of the die. Final packaging_may include encapsulation of the die_and the resulting package can_then_be_shipped to a customer.
It is_required that the die or the_package be tested_before being shipped to a customer. Ideally,_the_die should be tested at an_early_stage for the purposes of identifying_the_defects_that occur during early-stage manufacturing.
The_earliest stage that a die can_be tested is after completion of the manufacture of_microelectronic circuits at_wafer level and before a_wafer_is_singulated. Full wafer testing carries with it a number of_challenges. One_challenge in full_wafer testing is that there is a large amount of_contacts on a wafer and that a_large number of power, ground, and signal connections thus have to_be made. Another challenge is that burn-in testing_requires a thermal management system that can_maintain the wafer stable_at_a relatively high temperature, while providing a_system_that_is_simple to operate_and relatively inexpensive._The bread