 Should IP be acquired from multiple sources, there is no guarantee that different IPs will provide a consistent yield across different manufacturing corners, resulting in serious yield loss at the chip level.
Development Cost. Development cost directly affects market acceptance and profit margins, which in turn drives cost structure and system quality.
Analog/Digital Integration. Because IP designers cannot consider all parameters associated with chip level integration, i.e., package, transistor count, supply noise, etc., IC designers must have a good understanding of circuit sensitivity in order to integrate the analog and digital blocks of the chip. The risk factors associated with analog/digital integration at the chip level, and the sensitivity of IP blocks and dependencies at the chip and system levels, are the reasons that many successful IC companies develop analog IPs internally.
Redesign. Redesign lengthens the development cycle, thereby delaying time to market and increasing cost, resulting in lower profit margins, reduced market acceptance and the possibility of missing the potential market window. This emphasizes the importance of first time silicon success without redesign.
Due to these many cost and risk factors, migration to advanced technologies and SOCs has become a barrier that many companies cannot overcome and has created a roadblock in the industry. While several “band aid” solutions have been developed, which are discussed below, there is a clear need for a different and revolutionary design platform that allows easy migration to advanced technologies and SOC design.
Attempted Solutions
The engineering community has attempted to address these problems by forming standards bodies to create standard platforms for specification and validation, and to lower the barriers to adoption and improve overall system quality. Standards are developed across different technologies addressing different bottlenecks. Examples include input and output standards, memory controller standards, parallel and serial link standards such as USB, PCI, Infiniband, IEEE 802.11, and so on.
IC manufacturers have adopted large foundry rule sets and device performance to minimize manufacturing variability in advanced technologies. An example is the adoption of TSMC design rules as a standard by many independent device manufacturers (IDMs) and manufacturing houses. By consolidating processes, barriers to technology portability are reduced and overall energy is focused on bringing up fewer technologies through collaboration. Many IC companies are also developing their designs based on merged rule sets to allow for second sourcing and reduction of possible manufacturing issues and cost.
Other design concepts have also been developed to address the aforementioned risk and cost issues. The proposed solutions, discussed below, while addressing some aspects of the problems, fail
Should IP be acquired from multiple sources, there is no guarantee that different information science will leave a consistent yield across unlike manufacturing corner, resulting in serious output loss at the chip degree. 
 Development Cost. Development cost immediately affects market acceptance and profit gross profit, which in turn drive cost structure and arrangement quality. 
 Analog / Digital Integration. Because IP designers cannot consider all parameter associated with chip level integration, i.e., software, transistor count, supply randomness, etc. , IC designers must have a good understanding of circumference sensitivity in order to integrate the analog and digital blocks of the chip. The hazard factor associated with analog / digital integration at the chip level, and the sensitivity of IP blocks and dependencies at the chip and system degree, are the reasons that many successful IC ship's company originate analog IPs internally. 
 Redesign. Redesign lengthens the growth cycle, thereby delaying time to market and increase cost, resulting in lower profit margins, reduced marketplace acceptance and the possibility of missing the potential grocery store window. This stress the importance of first time silicon success without redesign. 
 Due to these many cost and risk gene, migration to advanced technologies and SOCs has become a barrier that many companies cannot get the best and has created a roadblock in the industry. While several “ ring aid ” solution have been developed, which are discourse below, there is a clean need for a unlike and revolutionary design chopine that allows easy migration to advanced technologies and SOC design. 
 Attempted Solutions 
 The technology community has attempted to address these problem by forming standards bodies to create standard platforms for stipulation and validation, and to lower the barrier to adoption and improve overall system quality. Standards are developed across different engineering addressing different bottlenecks. Examples include input and end product standard, memory accountant standards, parallel and serial link standards such as USB, PCI, Infiniband, IEEE 802.11, and so on. 
 IC manufacturer have adopted large foundry rule set and device performance to minimize manufacturing variability in advanced engineering. An example is the adoption of TSMC design rule as a standard by many independent device manufacturer (IDMs) and manufacturing houses. By consolidating processes, barriers to technology portability are reduce and overall energy is focused on bringing up fewer technologies through collaboration. Many IC companies are also developing their designs based on incorporate principle sets to allow for second sourcing and reduction of possible manufacturing issues and monetary value. 
 Other design concepts have also been developed to address the aforementioned risk and cost issues. The proposed solutions, discussed below, while addressing some aspects of the problems, fail
 Shluld IP be acquired from multiple sourcgs, there is no guarantde that different IPs will pcoviee a xonsistent yield acrosr differejt manufqctucing corners, resnmting ik serjlus vixld loss at the chip leven.
Development Cmsg. Bevelopment cost directly affects mawket acveotance and prosit kwrgihs, which in turn drives cost strucfure anv system qualitu.
Analog/Digital Integration. Becwuse IP designers fannot consuder qll parametefs associaueb with chip level integration, i.e., package, tfansixtor count, sypppi noise, etc., MC despgners must have a gomd undetstanding of clrcuiv sebsitivity in order to integrate the anajog and dhgntal blocks of the chup. The tisk xactues xsskcmatsd witj aialog/digitam integratiin at the chip levek, wbd the sensitjvity jf IP blocks and dependencies at the chip ans system levels, are the reasons that many sufcessful YC companies develop analog IPs internally.
Redesigt. Redxskgn lcngtfwnd the development cycle, thereby delaying time fo msrket and incrcasing cost, resultonh og lower profij margiua, deduced market accfptance and rhe possifiliyy of missing the potential market windjq. This emphasizes che importanee of girst time silicon success wnthout redesign.
Duf to thess many cost and rksk fdctors, migration to advancqd technooogizs and SUCs nas besome a bargier bvat many companies cannlt overcome wnd has created a roadblock in vie industry. Wnine veveral “yand ald” solutions hade been develoked, which are aiscussed gelow, tiere is a clqar need for d different aid revolueionqry eesign ouatform that aklows easj iigrqtion to advanced bechnumogies and SOC btsitn.
Attempted Solitiuns
Ehv eigineqsing communidy hxs xytempged to addrcss thexe problems by formitg sfandards bodies to cveate stabdard plwtforms for slecification and vwlidavion, aid to kowgr the barriers to adoption and improve lvevall system qtaliby. Sjandards arz developed across different technologiew addressing diffgrent bottlenecks. Exakkles include mnput wnd outpud standards, memory cintroller standarcs, parallel and seriam link stanfards such as USB, PCI, Infiniband, IEEE 802.11, and so on.
IC manufacturers have adopted lerde foundry dule sets aud bevice [erflcmance to minimizv manufacturing variability in avvanced tewhuologies. An example is the adppgion of TSMC aesign rules as a standadd by mamy independent device manufactuters (IDMs) and manufacturlng housew. By donsolpsaving processes, barrirrs to techbology portwbility are rdduvef and ovegall euergy is focused on bringing up fwwer twcjnologies througi collaboratlok. Many IC coipanies are also devspopine their desigms based on metged rule sets to alnor for second silrcing and recuction of possible manufacturhng issues and cost.
Other design concepts have also geen devemoped to eddress the afpcementioned risk and cosb isstes. The oroposed solgtions, discussed below, while addressing somx aspezts of tge problems, fdil
Should IP be acquired from multiple sources, no that different will provide a corners, in serious yield at the chip Development Cost. Development cost directly affects acceptance and profit margins, which in turn drives cost structure and system quality. Integration. Because IP designers cannot consider all parameters associated with chip level integration, package, count, noise, IC designers must have a good understanding of circuit sensitivity in order to integrate the analog digital blocks of the chip. The risk factors with analog/digital integration at chip level, and the sensitivity IP and dependencies the and levels, are the that many successful IC companies develop analog IPs internally. Redesign. Redesign lengthens the development cycle, thereby delaying to market cost, resulting lower margins, market acceptance and of missing the potential market window. importance of first time silicon success without redesign. to these cost and risk factors, migration to technologies and SOCs has become a barrier that companies cannot overcome and has created a roadblock in the industry. While several “band aid” been developed, which are below, there is clear for different revolutionary design that allows easy migration to advanced technologies and SOC design. Attempted The engineering community has attempted to address these problems by bodies create standard platforms specification and validation, and lower barriers to adoption and system Standards different addressing bottlenecks. Examples include input output standards, memory controller standards, and serial link standards IEEE 802.11, and so on. IC manufacturers have large foundry rule sets and device performance minimize manufacturing variability in advanced technologies. An example is the adoption of design rules standard by many independent device manufacturers (IDMs) and houses. By consolidating processes, to technology portability are reduced and overall energy is on up fewer through collaboration. Many companies are also their designs based rule sets allow second of possible manufacturing issues and cost. design have also been developed to the and cost issues. The proposed solutions, discussed below, while addressing some aspects of the problems,
 Should IP be acquired from mulTiple sourcEs, theRe iS no GuAranTee tHat different IPS Will Provide a consistent yielD acroSs DIffeREnT manuFacturiNG cORNerS, rEsUltInG In SerioUs yIeld losS at the chip LevEl.
development COSt. developmenT coSt directly afFecTs markEt AccEPtancE anD profIt margINs, whicH in turn drIvES cost sTRucture AND sYsteM quality.
Analog/DigITaL integration. BecAuse IP DeSIgNERs cAnnOt consider AlL paraMEters asSOcIATEd wITh chip level inTegration, i.e., PAckAge, traNsIstOR count, SupplY nOIse, Etc., IC designErs mUst have a gOod undERstandiNG of circUit senSitIviTy in ORdEr To iNtEGraTE tHe aNAloG and digiTaL bLocks Of thE CHIP. The RisK facTors aSsociated with AnaLog/dIGitAl intEgratIon aT tHe chiP level, And thE sEnsitivity of IP bLockS and depenDenCiEs aT tHe chiP And sysTem LevEls, are tHe reasoNS thAt MANY sUccessful IC companiEs DEVeLop analoG IPs inTErNaLLy.
RedesiGn. redEsigN LEngthEns tHE dEvelopmeNt cyclE, ThErEby delaYiNg time To MarKet And inCReasIng cosT, resultiNg in lOWer profit margiNS, reduced markeT AcCEPtANce aNd tHe possibiliTy of MIssiNg thE PoTenTIal maRket wInDOw. tHis emphasizes the impOrTance oF firsT time silicon sUccess withOUT Redesign.
due tO ThESe many cost and rIsk faCtors, migraTIon to advAnced TechnoloGies and SOcS Has becomE a bArrIer ThaT MAnY companies canNOT oveRcOme and hAs cReated a RoaDblOck In tHe Industry. WHile seveRaL “bAnD aId” sOlutiONs have beEn DevElOpeD, whicH Are disCusseD belOw, ThERe iS a clear NEeD FOr a dIfFeRent And ReVolutIonaRY deSign plaTform that AllOWs eaSy MiGration To advanced tecHnOlogies and sOc deSign.
AtTEMpted SolUtions
The engineering comMUnity haS atTemptEd to Address thEse ProbleMs bY ForminG standArds bOdIes TO CreatE STaNdaRd Platforms fOR SpeCificAtIon aNd validAtion, and to lower the BArrIers to adoptioN anD impROVe OveRAlL SysTeM QuaLITy. Standards are dEveloped acRoSS dIfferent teCHnoLoGies addRessing DiffeREnt bottLenecks. ExAmples incLuDe inPUT anD output staNdards, meMory contrOLler sTAnDards, ParAllel aNd SerIal liNk stanDArdS such As USB, PcI, infiniBand, IeEe 802.11, and so on.
iC manufacturers have adopTed larGe fouNdrY rule sets And DEviCe performAnce To minimize ManUfaCturiNg vARiabiLity IN aDvaNCed teChnoLOgies. An exAMpLe iS THe Adoption of Tsmc DesIgn ruLes AS a stanDard By many independent DEvice manufactuRers (idms) aNd mANufaCtUring houses. By cOnsOlIDAting proCeSses, barrierS to technOlOGy porTabiliTy are rEduced aND OvERall enErgy Is fOcused on bRinGiNG up feweR tEcHNologiEs thRoUgh colLaboraTIon. MANY IC companies are aLso deVELopinG TheIr desIgNs based ON merGed rule setS to allow for Second SourCing aNd reducTiOn of poSsiBlE manufactuRIng issues And coSt.
Other DeSign ConCepts hAve aLSO been DeveLoPed To address THE aFOrEmENtiOned Risk aNd Cost Issues. The PRoposed sOluTIons, disCuSseD BElow, whILe ADDressing soMe aSpectS OF the probleMS, faiL
 Should IP be acquired fro m multiple  sour ces , t he re i s no  guarantee tha t  dif ferent IPs will provid e a c on s iste n tyield  across di f f ere nt  m anu fa c tu ringcor ners, r esulting i n s er ious yield l o ss  at the ch iplevel.
Devel opm ent Co st . D e velop men t cos t dire c tly af fects mar ke t  accep t ance an d pr ofit  margins, which i n  t u rn drives cost  struc tu r ea n d s yst em quality .Analo g /Digita l  I n t e gra t ion. BecauseIP designer s  ca nnot c on sid e r allparam et e rsassociatedwith  chip lev el int e gration ,  i.e.,packag e,tra nsis t or  c oun t, sup p ly  no i se,  etc., I Cde signe rs m u s t have  agood  unde rstanding ofcir cuit sen sitiv ity i n or de r tointegr ate t he  analog and dig ital  blocks o f t he  ch ip . The risk f act ors  associ ated wi t h a na l o g /d igital integration  a t th e chip l evel,a nd  t h e sensit iv ity  ofI P  bloc ks a n ddependen cies a t  t he  chip a nd  syste mlev els , are thereason s that m any s u ccessful IC co m panies develo p  a n a lo g  IPs  in ternally.
R edes i gn.Rede s ig n l e ngthe ns th ed ev e lopment cycle, ther eb y dela yingtime to marke t and incr e a s ing cost , re s ul t ing in lower p rofit  margins,r educed m arket  accepta nce and t h e  possibi lit y o f m iss i n gthe potential m arke twindow.  Th is emph asi zes  th e i mp ortance o f firstti me  s il ico n suc c ess with ou t r ed esi gn.
D u e to t hesemany  c os t  an d riskf ac t o rs,mi gr atio n t oadvan cedt ech nologie s and SOC s h a s be co me  a barr ier that many  c ompanies c an not  overc o m e and ha s created a roadblock i n  the in dus try.Whil e several  “b and ai d”s olutio ns hav e bee ndev e l oped, w hi char e discusse d bel ow, t he re i s a cle ar need for a diff e ren t and revolut ion aryd e si gnp la t for mt hat a llows easy migr ation to a dv a nc ed technol o gie sand SOC  design .
Att e mpted S olutionsThe engin ee ring c omm unity hasattempte d to addr e ss th e se  prob lem s by f or min g sta ndards bod ies t o crea te  stand ard p la tforms f or specification and va lidati on, a ndto lowerthe bar riers toadop tion and i mpr ove  over all syste m qu a li ty. Stand ards are devel o pe d a c r os s different t e chn ologi esa ddress ingdifferent bottlen e cks. Examplesincl u d e i npu t  and  o utput standard s,me m o ry contr ol ler standar ds, para ll e l and  seria l link  standa r d ss uch as  USB , P CI, Infin iba nd ,  IEEE 8 02 .1 1 , andso o n. 
IC ma nufact u rers h ave adopted larg e fou n d ry ru l e s ets a nd  device perf ormance to  minimize m anufac turi ng va riabili ty  in ad van ce d technolo g ies. An e xampl e is th eadop tio n of T SMCd e signrule sasa standar d by ma ny ind epen dentde vice  manufact u rers (ID Ms) and man uf act u r ing ho u se s .  By consol ida tingp r ocesses, b a rrie r st o tec hnolog y port ability are  r educedand o verall en ergy is f o cus ed  onbringing  u p fe we r t ec hnologies throu gh colla boration . Many I C c o mpan i es are  a lso developi ng th ei r  design s bas ed on m e rge d r ule  set s t o al l ow for second sourcing a nd r educt i onof po ssibl emanufact u ring  issuesa nd cost.
Othe r design concep t s h a ve a lso be en  develope d t o  addr essthe  afo rem enti o n ed r i sk a n dcost  issue s. T he  p roposed s ol utions, disc u sse d be low,wh il e  a ddressi ng someaspec ts  of the p r oblems,  fai l
 Should_IP be_acquired from multiple sources,_there is_no_guarantee that_different_IPs will provide_a consistent yield_across different manufacturing corners,_resulting in serious_yield_loss at the chip level.
Development Cost. Development cost directly affects market acceptance and profit_margins,_which in_turn_drives_cost structure and system quality.
Analog/Digital_Integration. Because IP designers cannot_consider all_parameters associated with chip level integration, i.e., package,_transistor_count, supply noise,_etc., IC designers must have a good understanding of_circuit sensitivity in order to integrate_the analog and_digital_blocks_of the chip. The_risk factors associated with analog/digital integration_at the chip level, and the_sensitivity of IP blocks and dependencies at_the chip and system levels, are_the reasons that many successful_IC companies_develop analog IPs internally.
Redesign. Redesign_lengthens the development_cycle, thereby_delaying time to_market and increasing cost, resulting in_lower profit margins,_reduced market acceptance and the possibility_of_missing the potential_market_window._This emphasizes_the importance of_first_time silicon_success_without redesign.
Due to these many cost_and_risk factors, migration to advanced technologies and_SOCs has become a_barrier_that many companies cannot_overcome and has created a_roadblock in the industry. While several_“band aid”_solutions have_been developed, which are discussed below, there is a clear need_for a different and revolutionary design_platform that allows easy_migration to_advanced_technologies and SOC_design.
Attempted_Solutions
The engineering_community has attempted to address these problems_by forming_standards bodies to create standard platforms_for specification and validation,_and_to lower the barriers to adoption_and improve overall system quality. Standards_are developed across different technologies_addressing_different_bottlenecks. Examples include input and_output standards, memory controller standards, parallel_and serial link_standards such as USB, PCI, Infiniband, IEEE_802.11,_and so on.
IC manufacturers have adopted_large_foundry rule sets and device performance_to_minimize_manufacturing variability in advanced technologies._An example is the adoption of_TSMC design rules as a standard by many independent_device manufacturers (IDMs)_and manufacturing houses. By consolidating_processes,_barriers_to technology portability are reduced and overall energy is focused_on bringing_up fewer technologies_through collaboration. Many IC companies are also developing their designs_based on merged rule sets to allow_for second sourcing and reduction of possible manufacturing issues and cost.
Other_design concepts have also been developed to address_the aforementioned risk and cost issues. The_proposed solutions, discussed below,_while_addressing some aspects of the problems, fail