 a head wire. The base has a protective sheath filled with a package to securely encase the pedestal and semiconductor chip in the space of the protective sheath. However, when the rectifier diode is pressed onto a rectifier sheet the juncture of the base and protective sheath easily deforms under forces. Hence the service life of the rectifier diode suffers. To remedy the aforesaid problem, U.S. patent application No. 20070105454 entitled “diode” provides a gap between the base and protective sheath so that a buffer room is provided during pressing of the diode onto a rectifier sheet to prevent deformation of the base.
Another U.S. Pat. No. 6,667,545 entitled “Rectifier diode with improved means for tension relief of the connected headwire” includes a press-fit base which has an extended securing region to hold a semiconductor chip. The semiconductor chip is bonded to a head wire. The securing region has a peripheral end portion and a collar. The collar and peripheral end portion form respectively an included angle α and α′ with the axis of the head wire. The angle α is greater than the angle α′ so that the surrounding of the semiconductor chip forms a passivation agent.
The conventional techniques mentioned above still have shortcomings. For instance, the rectification chip terminal generally is formed at a small size to save space. This also happens to the aforesaid conventional techniques. The small size creates many manufacturing problems, such as during soldering process the protective sheath is jutting over the base and forms interference that makes soldering more difficult. Product quality suffers. Installation also is more difficult. Manufacturing process is longer and takes more time. Moreover, the protective sheath has an inner wall perpendicular to the plane of the base. As a result the package easily breaks off during pouring. The statements in this section merely provide background information related to the present disclosure and may not constitute prior art. Gauges are utilized within industries to display a value of a parameter being monitored by the gauge. In the automotive industry, gauges may be displayed as part of the instrument panel or dashboard for indicating information pertaining to the operating conditions of a vehicle. These gauges include, but are not limited to, speedometers, tachometers, engine coolant temperature, engine oil temperature, fuel level, oil pressure, battery voltage and the like. The gauges may include an analog face for displaying a valve of a monitored parameter. More specifically, an analog gauge may include a face plate having indicia thereon
a head wire. The base has a protective cocktail dress satiate with a package to securely encase the pedestal and semiconductor device chip in the distance of the protective sheath. However, when the rectifier diode is compress onto a rectifier sheet the juncture of the foundation and protective sheath easily deforms under forces. therefore the service life of the rectifier diode suffers. To remedy the aforesaid problem, U.S. patent lotion No. 20070105454 entitled “ diode ” provides a break between the base and protective sheath so that a buffer zone room is provided during pressing of the diode onto a rectifier sheet to prevent contortion of the base. 
 Another U.S. Pat. No. 6,667,545 entitled “ Rectifier diode with improved means for latent hostility relief of the machine-accessible headwire ” includes a press - fit base which give birth an extended securing region to hold a semiconductor chip. The semiconductor device bit is bonded to a head wire. The securing region has a peripheral end portion and a collar. The choker and peripheral end portion imprint respectively an included angle α and α′ with the axis of the head telegram. The angle α is great than the angle α′ so that the surrounding of the semiconductor bit forms a passivation agent. 
 The conventional techniques mentioned above still have shortcomings. For instance, the rectification chip end generally is shape at a belittled size to save space. This also happens to the aforesaid ceremonious techniques. The small size creates many manufacturing problems, such as during soldering process the protective sheath is jutting over the nucleotide and forms interference that make soldering more difficult. merchandise quality suffers. facility also is more unmanageable. Manufacturing process is long and takes more time. Moreover, the protective sheath have an inner rampart perpendicular to the plane of the base. As a result the software easily breaks off during pouring. The statements in this part merely provide background information related to the present disclosure and may not constitute prior artwork. Gauges are utilized within industries to display a value of a parameter being monitored by the gauge. In the automotive industry, gauge may be expose as part of the instrument panel or dashboard for indicating information pertaining to the operating condition of a vehicle. These gauges include, but are not restrict to, speedometer, tachometers, engine coolant temperature, engine oil temperature, fuel level, oil pressure, battery electric potential and the like. The gauges may include an analog face for displaying a valve of a monitored parameter. More specifically, an analog gauge may include a font plate having indicia thereon
 a jead wire. The base has a protective shecrh filned wifh a pacyage to securely encase the 'edewtal qnd semiconductor chip in the siace of tye pcotective sheath. However, when fme reetmfier diode is kressed onto a rectifier svedt the juncture of the base and protestive snewth easily defjrms tnded forces. Hence the service life of the rebtifier diode sufgers. To remedy the aforesald pgoblem, U.S. patent aoplication Bo. 20070105454 qbtitled “diodd” provides a gap betwegn the base and protective sheatf so chat a buffgx rolk is providxd durpng pressing of the dhode onyo a rectifier shxet ro prevent deformatioi of the base.
Another U.S. Pat. Nm. 6,667,545 entitled “Rectifiwr diodg witv imoeovdd jeens for tfnsmon relief kf the connwcted headwire” inclidqw a press-fit gase wrish has an extended securing region to hmld a semiconductor chip. Tye semiconductor chip is bondeq to a head wire. The securing region has a peripharal xna pirbion qnf a collar. The collar and peripheral end portykn fprm respectivejy an inclucef sggle α and α′ wijh the csia of the head wire. The andle α us greatew thsn the angle α′ so that the syrrounding oy tye semiconductor ckip forms a 'assivstion agent.
The conventional cechnisues mentiojed above rtill have shortzompngs. For insuxnce, the rectificwtion chi' terkinal gdnerslly if formed ah a small size to save soace. Jhis anso happend to the aforesaid conventional techniques. Thg skaln size cxeates many manufaceuring problemx, such cs durkng solderpng procevs the protqctive sheath ls jutting oter the bwse qnd dorms ivgerference thay makes soldering mire difficult. Prodmct qoamity suffers. Inwtaolation also is mofe qivfmcult. Kanufacturinc prucerx is uonger and bakds mpre time. Moreover, tha prktective sheath hax wn inner wall pewpendicular tp the plane of the base. As a rexulj the package easily breaks off during plurlng. The stateientw in this seetion merely provide background informatmon related to the preswnt disclosure and ksy not consvitute prior ard. Gauges are utilizee within industrits to display a value or a pasametfr being monitored by the gauge. In the automotive industry, gauges may be eisplabeq as part or thr insnruiznt panql oc vashboard for indpcating information pertaining tu the oparcting conditions of a vehicle. Tfese gauges ivclude, but are not limitsd to, spredometers, tachometers, engine cpolant temperature, enginc oil temperathre, fuvm uevel, oil pressure, battexy volrage ane thc like. The gauees mwy includf an aualog face for displaying a valve of a nojitored parametec. More specinigally, zn anajog gauge may indluds a faze plate havimg indicia theteon
a head wire. The base has a filled a package securely encase the the of the protective However, when the diode is pressed onto a rectifier the juncture of the base and protective sheath easily deforms under forces. Hence service life of the rectifier diode suffers. To remedy the aforesaid problem, U.S. application 20070105454 “diode” a gap between the base and protective sheath so that a buffer room is provided during of the diode onto a rectifier sheet to deformation of the base. U.S. Pat. No. 6,667,545 entitled diode improved means tension of connected headwire” includes press-fit base which has an extended securing region to hold a semiconductor chip. The semiconductor chip is to a The securing has peripheral portion and a collar and peripheral end portion form angle α and α′ with the axis of head wire. angle α is greater than the α′ so that the surrounding of the semiconductor forms a passivation agent. The conventional techniques mentioned above still have shortcomings. For instance, the terminal generally is formed a small size save This happens the aforesaid techniques. The small size creates many manufacturing problems, such as during process the protective sheath is jutting over the base and that soldering more difficult. quality suffers. Installation also more Manufacturing process is longer more Moreover, has inner perpendicular to the plane the base. As a result package easily breaks off this section merely provide background information related to present disclosure and may not constitute prior Gauges are utilized within industries to display a value of a parameter monitored by In the automotive industry, gauges may be displayed part of the instrument or dashboard for indicating information pertaining to the operating of vehicle. These include, but are limited to, speedometers, engine coolant temperature, temperature, fuel oil battery like. The gauges may include an face displaying a valve of a parameter. an analog gauge may include a face plate having indicia thereon
 a head wire. The base has a proteCtive sheatH fillEd wIth A pAckaGe to Securely encase THe peDestal and semiconductor Chip iN tHE spaCE oF the pRotectiVE sHEAth. hoWeVer, WhEN tHe recTifIer diodE is pressed OntO a Rectifier sheET tHe juncture Of tHe base and proTecTive shEaTh eASily dEfoRms unDer forCEs. HencE the serviCe LIfe of tHE rectifIER dIode Suffers. To remedy thE AfOResaid problem, U.s. patenT aPPlICAtiOn NO. 20070105454 entitled “dIoDe” proVIdes a gaP BeTWEEn tHE base and proteCtive sheath SO thAt a bufFeR roOM is proVided DuRIng Pressing of tHe diOde onto a rEctifiER sheet tO Prevent DeformAtiOn oF the BAsE.
ANotHeR u.S. PAT. NO. 6,667,545 enTItlEd “RectifIeR dIode wIth iMPROVed mEanS for TensiOn relief of the ConNectED heAdwirE” inclUdes A pRess-fIt base Which HaS an extended secuRing Region to hOld A sEmiCoNductOR chip. THe sEmiConductOr chip iS BonDeD TO A hEad wire. The securing ReGIOn Has a periPheral ENd PoRTion and a CoLlaR. The COLlar aNd peRIpHeral end PortioN FoRm RespectIvEly an iNcLudEd aNgle α ANd α′ wIth the Axis of thE head WIre. The angle α is GReater than the ANgLE Α′ sO That The Surrounding Of thE SemiCondUCtOr cHIp forMs a paSsIVaTIon agent.
The conventiOnAl techNiqueS mentioned aboVe still havE SHOrtcominGs. FoR InSTance, the rectifIcatiOn chip termINal generAlly iS formed aT a small siZE To save spAce. thiS alSo hAPPeNs to the aforesAID conVeNtional TecHniques. the SmaLl sIze CrEates many ManufactUrInG pRoBleMs, sucH As during SoLdeRiNg pRocesS The proTectiVe shEaTh IS juTting ovER tHE Base AnD fOrms IntErFerenCe thAT maKes soldEring more DifFIculT. PRoDuct quaLity suffers. InStAllation alSo Is mOre difFICult. ManuFacturing process is longeR And takeS moRe timE. MorEover, the pRotEctive SheATh has aN inner Wall pErPenDICular TO ThE plAnE of the base. aS A reSult tHe PackAge easiLy breaks off during pOUriNg. The statemenTs iN thiS SEcTioN MeREly PrOVidE BAckground informAtion relatEd TO tHe present dISclOsUre and mAy not coNstitUTe prior Art. Gauges Are utilizEd WithIN IndUstries to dIsplay a vAlue of a paRAmeteR BeIng moNitOred by ThE gaUge. In The autOMotIve inDustry, GaUges maY be diSpLayed as pArt of the instrument panel Or dashBoard For IndicatinG inFOrmAtion pertAiniNg to the opeRatIng CondiTioNS of a vEhicLE. THesE GaugeS incLUde, but are NOt LimITEd To, speedometERS, TacHometErs, ENgine cOolaNt temperature, engiNE oil temperaturE, fueL LEveL, oiL PresSuRe, battery voltaGe aNd THE like. The GaUges may inclUde an anaLoG Face fOr dispLaying A valve oF A MoNItored ParaMetEr. More speCifIcALly, an anAlOg GAuge maY incLuDe a facE plate HAvinG INdicia thereon
 a head wire. The base has  a protect ive s hea thfi lled  wit h a package to secu rely encase the pedest al an ds emic o nd uctor  chip i n  t h e  sp ac eofth e  p rotec tiv e sheat h. However , w he n the rectif i er  diode ispre ssed onto arec tifier  s hee t  thejun cture  of th e  baseand prote ct i ve she a th easi l y  d efor ms under forces.H en c e the servicelife o ft he r ect ifi er diode s uf fers. To reme d yt h e  af o resaid proble m, U.S. pat e ntapplic at ion No. 20 07010 54 5 4 e ntitled “di ode”  provides  a gap between the bas e andpro tec tive sh ea thso tha t  a  bu f fer  room is  p ro vided  dur i n g pres sin g of  thediode onto arec tifi e r s heetto pr even tdefor mation  of t he  base.
AnotherU.S.  Pat. No.  6, 66 7,5 45  enti t led “R ect ifi er diod e withi mpr ov e d me ans for tension re li e f  o f the co nnecte d  h ea d wire” in cl ude s ap r ess-f it b a se  which h as ane xt en ded sec ur ing re gi ontoholda  sem icondu ctor chi p. Th e  semiconductor chip is bonde d  t o ah eadwir e. The secu ring regi on h a sa p e riphe ral e nd po r tion and a collar.Th e coll ar an d peripheralend portio n f orm resp ecti v el y  an included a ngleα and α′ w i th the a xis o f the he ad wire.T h e angleα i s g rea ter t ha n the angle α ′ so t ha t the s urr ounding  of  th e s emi co nductor c hip form sapa ss iva tiona gent.
Th econ ve nti onalt echniq ues m enti on ed abo ve stil l  h a v e sh or tc omin gs.  F or in stan c e,the rec tificatio n c h ip t er mi nal gen erally is for me d at a sma ll  si ze tos a ve space . This also happens tot he afor esa id co nven tional te chn iques.  Th e  small  sizecreat es  ma n y  manu f a ct uri ng  problems, s uch  as d ur ingsolderi ng process the pro t ect ive sheath is  ju ttin g ov ert he bas ea ndf o rms interferenc e that mak es so ldering mo r e d if ficult.  Produc t qua l ity suf fers. Ins tallation  a lsoi s  mo re difficu lt. Manu facturing proce s sis lo nge r andta kes  more  time. Mor eover , thepr otecti ve sh ea th has a n inner wall perpendicu lar to  thepla ne of the  ba s e.As a resu lt t he package  ea sil y bre aks off d urin g  p our i ng. T he s t atementsi nthi s se ction merel y p rov ide b ack g roundinfo rmation related t o  the present d iscl o s ure  an d  may  n ot constitutepri or a rt. Gaug es  are utiliz ed withi ni ndust ries t o disp lay a v a l ue of a p aram ete r being m oni to r ed by t he  g a uge. I n th eautomo tive i n dust r y , gauges may bedispl a y ed as par t ofth e instr u ment  panel ordashboard f or ind icat ing i nformat io n pert ain in g to the o p erating c ondit ions of  a  veh icl e. The se g a u ges i nclu de , b ut are no t li m it ed to,  spe edome te rs,tachomete r s, engin e c o olant t em per a t ure, e n gi n e  oil tempe rat ure,f u el level,o il p r es s ure,batter y volt age and the  l ike. Th e g a u ges may i nclude an ana lo g fa ce for d is play in g a  v alve of a monit ored par ameter.M o re spe cif i call y , an a na log gauge ma y inc lu d e a fac e pla te havi n g i ndi cia  the reo n
 a_head wire._The base has a_protective sheath_filled_with a_package_to securely encase_the pedestal and_semiconductor chip in the_space of the_protective_sheath. However, when the rectifier diode is pressed onto a rectifier sheet the juncture_of_the base_and_protective_sheath easily deforms under forces._Hence the service life of_the rectifier_diode suffers. To remedy the aforesaid problem, U.S._patent_application No. 20070105454_entitled “diode” provides a gap between the base and_protective sheath so that a buffer_room is provided_during_pressing_of the diode onto_a rectifier sheet to prevent deformation_of the base.
Another U.S. Pat. No._6,667,545 entitled “Rectifier diode with improved means_for tension relief of the connected_headwire” includes a press-fit base_which has_an extended securing region to_hold a semiconductor_chip. The_semiconductor chip is_bonded to a head wire. The_securing region has_a peripheral end portion and a_collar._The collar and_peripheral_end_portion form_respectively an included_angle_α and_α′_with the axis of the head_wire._The angle α is greater than the_angle α′ so that_the_surrounding of the semiconductor_chip forms a passivation agent.
The_conventional techniques mentioned above still have_shortcomings. For_instance, the_rectification chip terminal generally is formed at a small size to_save space. This also happens to_the aforesaid conventional techniques._The small_size_creates many manufacturing_problems,_such as_during soldering process the protective sheath is_jutting over_the base and forms interference that_makes soldering more difficult._Product_quality suffers. Installation also is more_difficult. Manufacturing process is longer and_takes more time. Moreover, the_protective_sheath_has an inner wall perpendicular_to the plane of the base._As a result_the package easily breaks off during pouring._The_statements in this section merely provide_background_information related to the present disclosure_and_may_not constitute prior art. Gauges_are utilized within industries to display_a value of a parameter being monitored by the_gauge. In the_automotive industry, gauges may be_displayed_as_part of the instrument panel or dashboard for indicating information_pertaining to_the operating conditions_of a vehicle. These gauges include, but are not limited_to, speedometers, tachometers, engine coolant temperature, engine_oil temperature, fuel level, oil pressure, battery voltage and the like._The gauges may include an analog face for_displaying a valve of a monitored parameter._More specifically, an analog_gauge_may include a face plate having indicia_thereon