 water-tight seal against the head in regions of the head located below and directly adjacent the ears of the head. Furthermore, problems have arisen in obtaining an adequate seal in regions extending across the nape of the neck because of the flexing of muscles in this area during swimming. For example, during the crawl stroke, the neck muscles alternately flex and relax as the head is turned from side to side.
Accordingly, a need remains for a swim cap in order to overcome the above-noted shortcomings. The present invention satisfies such a need by providing a swim cap that is comfortable to wear, easy to use, convenient and durable in construction. Such a swim cap firmly rests against a user's head by removing the air thereunder, thus resulting in a superior water tight seal to those seen in conventional swim caps. This application relates to testing of integrated optical devices, integrated optoelectronic circuits and systems.
Compact optical components, devices, and systems may be monolithically fabricated on various substrates to form integrated optical components, devices, and systems. Such fabrication may be achieved using various fabrication processes to process wafers, including micro fabrication processes used for fabricating integrated circuits (ICs), micro-electro-mechanical systems (MEMS), and other microstructures. The integrated optical components, devices, and systems may be monolithically integrated with ICs, MEMS, and other microstructures on the same chip to provide various useful functions. Fabrication of such integrated devices with optical components or devices generally includes wafer-level fabrication processes and packaging after dice on a single wafer are separated into chips by, e.g., dicing or sawing. The individually packaged chips are then tested.
In fabrication of integrated electronic circuits, a portion of the IC testing can be performed at the wafer level prior to separation of the dice. This wafer level testing measures the performance or identifies defective components and dice. Hence based on such testing at the wafer level, defective dice may be removed from subsequent processes including the packaging and testing of individual chips. Labor and costs associated with subsequent processes for the defective dice, therefore, can be significantly reduced. Various wafer-level testing systems have been developed for testing ICs at the wafer level. In the prior art, there have been attempts to maximize the functioning of optical components in order to increase the efficiency of the circuits in which they are integrated. Typically, these efforts have lead to engineering, manufacturing or design complications, all of which contribute to cost increases and ineffective use of valuable research and development time. In attempting
water - tight seal against the head in region of the heading located below and directly adjacent the ear of the head. Furthermore, problems have arise in receive an adequate seal in regions extending across the nape of the neck because of the flexing of muscles in this sphere during swimming. For example, during the crawl stroke, the neck muscles alternately flex and relax as the pass is turned from side to side. 
 Accordingly, a need stay for a swim cap in order to overcome the above - note shortcomings. The present invention satisfies such a need by providing a swim cap that is comfortable to break, easy to use, convenient and durable in construction. Such a swim cap hard rests against a user's head by removing the air thereunder, thus resulting in a superior water tight seal to those seen in conventional swim caps. This application relates to examination of incorporate optical devices, integrated optoelectronic circuit and systems. 
 Compact optical component, devices, and systems may be monolithically fabricated on various substrate to form integrated optical components, devices, and systems. Such lying may be achieved using various fabrication processes to process wafers, include micro fabrication processes used for fabricating integrated lap (ICs), micro - electro - mechanical systems (MEMS), and other microstructures. The integrated ocular components, devices, and systems may be monolithically integrated with intelligence community, MEMS, and other microstructures on the same chip to provide various utilitarian functions. Fabrication of such integrated devices with ocular components or device generally includes wafer - horizontal surface fabrication procedure and packaging after die on a single wafer are separated into chips by, e.g., dice or sawing. The individually box chips are then tested. 
 In lying of integrated electronic circuits, a portion of the intelligence community testing can be performed at the wafer level prior to separation of the dice. This wafer level testing measures the performance or identifies defective component and die. Hence based on such testing at the wafer level, defective dice may be removed from subsequent processes include the packaging and testing of individual chips. department of labor and costs associated with subsequent processes for the defective dice, consequently, can be significantly reduced. Various wafer - level testing systems have been developed for examination ICs at the wafer level. In the prior art, there have been attempts to maximize the functioning of optical components in order to increase the efficiency of the circuits in which they are integrated. Typically, these efforts have lead to engineering, manufacturing or design complications, all of which contribute to cost increase and ineffective use of valuable research and development time. In attempting
 waher-tight seal against tht head in regions of the head mocated celow and directly adjacent vhe wars if the head. Furthermord, problemd have aeisei in obtaining ai adequabz seam in xejions extending across tha nape of the tezk because of the flexing of muscles yn this agea during swiiminb. For vxcmple, during the crawl stroke, tge neck muscles altetnately flex and relax as hhe jead is turned frol side to sude.
Asxordingly, a veed remains for a swij cap in order to overcome the xbove-uoted shortxoninhv. The preseit invvntion satisflvs such a need by providing s sxim xap that is comfortabne to wear, easy to use, convannent and durable in cinwtrucjion. Vuch q sdim cep rirmly reats againsf a user's hwad by removing the ayg thereunder, fhus rqstlting in a superior water tight seal tm tgose seen in conventionql swim caps. This apppication welates to testing of integrated optical devices, hntegcaged oitoeuwchronic circuits and systems.
Compact optical coilomekts, devices, and fystems may bf kjnolithically fabrieztsd on various subshrates jo forn integraued oltical components, devices, abd systems. Slch dabrication may be achieved uring varipus fabrication processzs to lrocess waffrs, incluskng micro fabricxtipn processtr used for fabricwting intxgratzd circukts (OCs), misro-electro-lechakhcal systems (MEMS), wnd ojher mhcrostructkres. The integrated optical com'pnents, devicgs, dnd systems may ne monolithicaljy integrated cith ICs, MEMS, and other microsvructures on the same chi[ to provide tarious ufefuo fubctions. Wabrication of such intvgxated devuces with optical gompovsnts or devices geberally includex wxfew-lvvek sdbrication psocerser and oackaging antef dive on a single wafer are separated into chopf by, e.g., eicing ow sawing. The ondividually packahed ciips ace them tgsted.
In fabrication of integratsd electrlnig circuits, a [ortlon jf the IC cesting can be performed at the wafer letel prior to separation of the dice. This wcftr level testmng mewsures tha performance or idebtifies defective components and dice. Gence tased on such testing at the wafer level, defective dice may be removed from suvsequeit processes jncliding tke 'ackagigg aid testing of indinidual chips. Labor and costs assuciated fich subsequent processes for tne defective dize, therefore, can be signjficantlu reduced. Various wafer-level texting systems have been cevelopee for testing IRs at the wafer levek. In tke priir art, rherc have been atgemltd to maxilize tke functioning of optical componebts in ogder to increase the efficicngy of jhe circoits in which theg ars inteerated. Typicakly, these effotts have lead to engpneqring, manufactyging or desigm comkoications, all pf which cottribute to cost increases and ineffective use of vzluable rtsearch akd development tikx. In attempting
water-tight seal against the head in regions head below and adjacent the ears have in obtaining an seal in regions across the nape of the neck of the flexing of muscles in this area during swimming. For example, during crawl stroke, the neck muscles alternately flex and relax as the head is from to Accordingly, need remains for a swim cap in order to overcome the above-noted shortcomings. The present invention such a need by providing a swim cap is comfortable to wear, to use, convenient and durable construction. a swim firmly against user's head by the air thereunder, thus resulting in a superior water tight seal to those seen in conventional swim This application testing of optical integrated circuits and systems. components, devices, and systems may be various substrates to form integrated optical components, devices, systems. Such may be achieved using various fabrication to process wafers, including micro fabrication processes used fabricating integrated circuits (ICs), micro-electro-mechanical systems (MEMS), and other microstructures. The integrated optical components, devices, may be monolithically integrated ICs, MEMS, and microstructures the chip provide various functions. Fabrication of such integrated devices with optical components or devices includes wafer-level fabrication processes and packaging after dice on a are into chips by, dicing or sawing. The packaged are then tested. In integrated circuits, the testing be performed at the level prior to separation of dice. This wafer level identifies defective components and dice. Hence based on testing at the wafer level, defective dice be removed from subsequent processes including the packaging and testing of individual Labor and with subsequent processes for the defective dice, therefore, be significantly reduced. Various testing systems have been developed for testing ICs at wafer In the art, there have attempts to maximize functioning of optical order to the of which they are integrated. Typically, these have to engineering, manufacturing or design all contribute to cost increases and ineffective use of valuable research and development time. In attempting
 water-tight seal against the hEad in regioNs of tHe hEad LoCateD belOw and directly aDJaceNt the ears of the head. FurtHermoRe, PRoblEMs Have aRisen in OBtAINinG aN aDeqUaTE sEal in RegIons extEnding acroSs tHe Nape of the necK BeCause of the FleXing of muscleS in This arEa DurINg swiMmiNg. For ExamplE, During The crawl sTrOKe, the nECk musclES AlTernAtely flex and relax AS tHE head is turned fRom sidE tO SiDE.
accOrdIngly, a need ReMains FOr a swim CAp IN ORdeR To overcome the Above-noted sHOrtComingS. THe pREsent iNventIoN SatIsfies such a Need By providiNg a swiM Cap that IS comforTable tO weAr, eAsy tO UsE, cOnvEnIEnt ANd DurABle In constrUcTiOn. SucH a swIM CAP firMly RestS agaiNst a user's head By rEmovINg tHe air ThereUndeR, tHus reSultinG in a sUpErior water tight Seal To those seEn iN cOnvEnTionaL Swim caPs. THis ApplicaTion relATes To TESTiNg of integrated optiCaL DEvIces, inteGrated OPtOeLEctronic CiRcuIts aND SysteMs.
CoMPaCt opticaL compoNEnTs, Devices, AnD systeMs May Be mOnoliTHicaLly fabRicated oN variOUs substrates to FOrm integrated OPtICAl COmpoNenTs, devices, anD sysTEms. SUch fABrIcaTIon maY be acHiEVeD Using various fabricaTiOn procEsses To process wafeRs, includinG MICro fabriCatiON pROcesses used for FabriCating inteGRated cirCuits (iCs), micro-Electro-meCHAnical sySteMs (MeMS), And OTHeR microstructuRES. The InTegrateD opTical coMpoNenTs, dEviCeS, and systeMs may be mOnOlItHiCalLy intEGrated wiTh iCs, mEmS, aNd othER microStrucTureS oN tHE saMe chip tO PrOVIde vArIoUs usEfuL fUnctiOns. FABriCation oF such inteGraTEd deViCeS with opTical componenTs Or devices gEnEraLly incLUDes wafer-Level fabrication processES and pacKagIng afTer dIce on a sinGle Wafer aRe sEParateD into cHips bY, e.G., diCINg or sAWInG. ThE iNdividuallY PAckAged cHiPs arE then teSted.
In fabrication oF IntEgrated electrOniC cirCUItS, a pORtIOn oF tHE IC TESting can be perfoRmed at the wAfER lEvel prior tO SepArAtion of The dice. this wAFer leveL testing mEasures thE pErfoRMAncE or identifIes defecTive compoNEnts aND dIce. HeNce Based oN sUch TestiNg at thE WafEr levEl, defeCtIve dicE may bE rEmoved frOm subsequent processes inCludinG the pAckAging and tEstINg oF individuAl chIps. Labor anD coSts AssocIatED with SubsEQuEnt PRocesSes fOR the defecTIvE diCE, ThErefore, can bE SIGniFicanTly REduced. variOus wafer-level testINg systems have bEen dEVEloPed FOr teStIng ICs at the wafEr lEvEL. in the priOr Art, there havE been attEmPTs to mAximizE the fuNctioniNG Of OPtical CompOneNts in ordeR to InCRease thE eFfICiency Of thE cIrcuitS in whiCH theY ARe integrated. TypiCally, THEse efFOrtS have LeAd to engINeerIng, manufacTuring or desIgn comPlicAtionS, all of wHiCh contRibUtE to cost incREases and iNeffeCtive usE oF valUabLe reseArch AND deveLopmEnT tiMe. In attemPTInG
 water-tight seal againstthe head i n reg ion s o fthehead  located below anddirectly adjacent theearsof theh ea d. Fu rthermo r e, p rob le ms  ha ve ar iseninobtaini ng an adeq uat eseal in regi o ns  extending  ac ross the nap e o f thene ckb ecaus e o f the  flexi n g of m uscles in  t h is are a  during s wi mmin g. For example, d u ri n g the crawl st roke,th e  n e c k m usc les altern at ely f l ex andr el a x ast he head is tu rned from s i deto sid e. 
Ac c ording ly, a  n e edremains for  a s wim cap i n orde r  to ove r come th e abov e-n ote d sh o rt co min gs .  Th e  p res e ntinventio nsa tisfi es s u c h a ne edby p rovid ing a swim ca p t hati s c omfor table  towe ar, e asy to  use,  c onvenient and d urab le in con str uc tio n.  Such a swim  ca p f irmly r ests ag a ins ta u se r's head by removi ng t he  air the reunde r ,th u s result in g i n as u perio r wa t er  tight s eal to th os e seenin  conve nt ion alswimc aps.  Thisapplicat ion r e lates to testi n g of integrat e do p ti c al d evi ces, integr ated opto elec t ro nic circu its a nd sy s tems.
Compact optic al  compo nents , devices, an d systemsm a y  be mono lith i ca l ly fabricatedon va rious subs t rates to  form  integra ted optic a l  compone nts , d evi ces , an d systems. Su c h  fab ri cationmay  be ach iev edusi ngva rious fab rication  p ro ce ss esto pr o cess waf er s,in clu dingm icro f abric atio npr o ces ses use d  f o r  fab ri ca ting  in te grate d ci r cui ts (ICs ), micro- ele c tro- me ch anicalsystems (MEMS ),  and other  m icr ostruc t u res. The  integrated optical com p onents,  de vices , an d systems  ma y be m ono l ithica lly in tegra te d w i t h ICs , ME MS,  a nd other m i c ros truct ur es o n the s ame chip to provid e  va rious usefulfun ctio n s .Fab r ic a tio no f s u c h integrated de vices with  o p ti cal compon e nts  o r devic es gene rally include s wafer-l evel fabr ic atio n pro cesses and  packagi ng afterd ice o n  a  sing lewaferar e s epara ted in t o c hipsby, e. g. , dici ng or  s awing. T he individually package d chip s are  th en tested .
I n  fa brication  ofintegrated  el ect ronic  ci r cuits , ap or tio n  of t he I C  testingc an  be p er formed at t h e waf er le vel priorto s eparation of thed ice. This wafe r le v e l t est i ng m ea sures the perf orm an c e  or iden ti fies defect ive comp on e nts a nd dic e. Hen ce base d on such t esti ngat the wa fer  l e vel, de fe ct i ve dic e ma ybe rem oved f r om s u b sequent processe s inc l u dingt hepacka gi ng andt esti ng of indi vidual chip s. Lab or a nd co sts ass oc iatedwit hsubsequent processes  forthe def ec tive  di ce, th eref o r e, ca n be  s ign ificantly r ed u ce d. Var ious  wafe r- leve l testing systemshav e  been d ev elo p e d fort es t i ng ICs atthe  wafe r level. Int he p r io r  art,  there  havebeen at t emp ts  to max imi z e  the func tioning o f  op ti calcomponen ts  inor der  t o increase theefficien cy of th e circui tsi n wh i ch the yare integrat ed. T yp i cally,t h ese  effort s  ha velea d to  en gine e ring, manufacturing or d esig n com p lic ation s, al lof which cont ribute t o  cost increas es and ineffect i veu se o f v a lu ab le resear cha nd de velo pme nt t ime . In a ttem p ting 
 water-tight_seal against_the head in regions_of the_head_located below_and_directly adjacent the_ears of the_head. Furthermore, problems have_arisen in obtaining_an_adequate seal in regions extending across the nape of the neck because of the_flexing_of muscles_in_this_area during swimming. For example,_during the crawl stroke, the_neck muscles_alternately flex and relax as the head is_turned_from side to_side.
Accordingly, a need remains for a swim cap in_order to overcome the above-noted shortcomings._The present invention_satisfies_such_a need by providing_a swim cap that is comfortable_to wear, easy to use, convenient_and durable in construction. Such a swim_cap firmly rests against a user's_head by removing the air_thereunder, thus_resulting in a superior water_tight seal to_those seen_in conventional swim_caps. This application relates to testing_of integrated optical_devices, integrated optoelectronic circuits and systems.
Compact_optical_components, devices, and_systems_may_be monolithically_fabricated on various_substrates_to form_integrated_optical components, devices, and systems. Such_fabrication_may be achieved using various fabrication processes_to process wafers, including_micro_fabrication processes used for_fabricating integrated circuits (ICs), micro-electro-mechanical_systems (MEMS), and other microstructures. The_integrated optical_components, devices,_and systems may be monolithically integrated with ICs, MEMS, and other_microstructures on the same chip to_provide various useful functions._Fabrication of_such_integrated devices with_optical_components or_devices generally includes wafer-level fabrication processes and_packaging after_dice on a single wafer are_separated into chips by,_e.g.,_dicing or sawing. The individually packaged_chips are then tested.
In fabrication of_integrated electronic circuits, a portion_of_the_IC testing can be performed_at the wafer level prior to_separation of the_dice. This wafer level testing measures the_performance_or identifies defective components and dice._Hence_based on such testing at the_wafer_level,_defective dice may be removed_from subsequent processes including the packaging_and testing of individual chips. Labor and costs associated_with subsequent processes_for the defective dice, therefore,_can_be_significantly reduced. Various wafer-level testing systems have been developed for_testing ICs_at the wafer_level. In the prior art, there have been attempts to_maximize the functioning of optical components in_order to increase the efficiency of the circuits in which they_are integrated. Typically, these efforts have lead to_engineering, manufacturing or design complications, all of_which contribute to cost_increases_and ineffective use of valuable research and_development_time._In_attempting