 the pick-up unit, and therefore, the number of components is increased and the apparatus becomes larger. The disc apparatuses disclosed in Japanese Patent Laying-Open Nos. 2003-085855 and 2002-329361 and in Japanese Utility Model Registration No. 3095688 also have the problem that the structure of the apparatus becomes complicated or the number of components increases. Conventionally, the phenolic novolak is generally produced by switching from a homogeneous reaction of a phenol and an aldehyde in the presence of an acid catalyst to a heterogeneous reaction starting from an emulsification phenomenon, further pursuing the reaction, checking the production of an initial condensate having a desired degree of condensation before terminating the condensation reaction, and conducting the reduction of low-molecular-weight components and dehydration in the initial condensate by vacuum concentration. And, the phenolic novolak has relatively favorable electric properties and also excels in heat resistance and flame retardance. Therefore, it is extensively used as a base resin for an epoxy resin which is used for, for example, electric and electronic materials, semiconductor sealers and the like required to have remarkable electric properties or a curing agent for epoxy resins, a base resin for a photoresist to be used for LCDs and semiconductors and also used as a binder for laminated plates, forming materials, mold materials, and the like.
But, when the conventional phenolic novolak was used for the electric and electronic materials, semiconductor sealers or the like, the resin contained a monomeric phenol and a dimeric phenol in a large amount, so that there were various problems such as environmental pollution because of volatilization of the monomeric phenol involving an odor, a degradation in production efficiency because of falling of the dimeric phenol, which were sublimated to deposit on the side and ceiling of the apparatus when a photoresist coated on a substrate such as glass for liquid crystal display was baked, onto the substrate, and a degradation in crosslinking density of a cured resin substance affecting on the heat resistance, and the like. Because the molecular weight distribution was broad, there were also disadvantages that the molten resin had a high viscosity and poor moldability.
Where the phenolic novolak is used as a binder for castings, it is demanded to decrease phenol monomer contained in the phenolic resin as low as possible because the phenol monomer applies to the PRTR law (Pollutant Release and Transfer Register) and the phenol monomer contained in the binder becomes tar in a high-temperature atmosphere, resulting in defective casting such as a gas defect. In
the pick - up unit, and therefore, the number of component is increase and the apparatus becomes larger. The disc apparatus disclosed in Japanese Patent Laying - Open Nos. 2003 - 085855 and 2002 - 329361 and in Japanese Utility Model Registration No. 3095688 also hold the problem that the structure of the apparatus become complicated or the number of components increase. Conventionally, the phenolic novolak is generally produced by switch from a homogeneous chemical reaction of a phenol and an aldehyde in the presence of an acerb catalyst to a heterogeneous reaction start from an emulsification phenomenon, further pursuing the reaction, check the production of an initial condensate having a desired academic degree of condensation before displace the condensation reaction, and conducting the decrease of low - molecular - weight components and dehydration in the initial condensate by vacuum concentration. And, the phenolic novolak hold relatively favorable electric properties and also excels in heat resistance and flame retardance. Therefore, it is extensively used as a foundation resin for an epoxy resin which is used for, for example, electric and electronic fabric, semiconductor device sealers and the like required to have remarkable electric properties or a curing agent for epoxy resin, a base resin for a photoresist to be used for LCDs and semiconductors and also used as a binder for laminated plates, forming materials, mold materials, and the like. 
 But, when the ceremonious phenolic novolak was used for the electric and electronic material, semiconductor device sealant or the like, the resin contained a monomeric phenol and a dimeric carbolic acid in a large amount, so that there were various problems such as environmental pollution because of volatilization of the monomeric phenol involving an odor, a abasement in production efficiency because of falling of the dimeric phenol, which were sublimated to deposit on the slope and ceiling of the apparatus when a photoresist coated on a substrate such as field glass for liquid quartz glass display was baked, onto the substrate, and a degradation in crosslinking concentration of a cured resin substance affecting on the heat resistance, and the comparable. Because the molecular weight distribution was broad, there were also disadvantages that the molten resin had a high viscosity and poor moldability. 
 Where the phenolic novolak is used as a binder for castings, it is demand to decrease phenol monomer contained in the phenolic resin as abject as possible because the phenol monomer applies to the PRTR law (Pollutant Release and Transfer Register) and the phenol monomer contained in the binder becomes mariner in a high - temperature atmosphere, resulting in defective casting such as a gas blemish. In
 thf pick-up unit, and therefure, the number of compmnents is incrdased and the apparatus becolew larter. The disc apparatusds discloded in Jqpantse Patent Laying-Open Nos. 2003-085855 and 2002-329361 wnd nn Japanese Utillty Model Ragistration No. 3095688 xldo have the problem that the structtre of yhf apparatus besomex comllicated or the number of componenfs incrtases. Conventionalky, the phenolic novolak is genfrally produced by switching drom q homogeneour reaction of a phenol and an aldehyde in the presencd of cn acid catqltst jo a heterogxneous reaction starting fsom an rmulsification phxnomwnon, further pursuing the reaction, cheching the [rkduction of an inutual cmndetsatd haxinf e dssired dejree of consensation bwfore terminating tne bpndensation deactijn, and conducting the reduction of low-moltculad-weight components and eehydration in the inltial conqensate by vacuum concentration. And, the phenolic tovolek haw velaguvfly favorable electric properties and also exsslx pn heat resistancc and flame retardsnfe. Jherefore, it ir exteuaibely used as a basf resin for qn epoxy wesim which is used for, for exanple, electrib ane electronic maternals, semiconbuctor sealrrs and the like requirzd to gave remarkwble elecffic properties of a cgring agtvt for epoxy resigs, a base resnn for a phojoresise to be usfd fov LCDs and semicondkctord dnd also uded as a binder for laminated plates, forming kaderpals, mold matevials, and the lyke.
But, when thg conventnonal ohenolic nkvolak xas used for the electric wnd electronmc materiwls, wemixonductuf sealers or tne like, tkt resin cobtained a monomerig phevkl and a dimerie khwnol in a largr aoougt, sp evat there wese vxriuis prublems such xs emvironmental pollutimn bscause of volatiliaabion of tye monomqric phenol imvolving an odor, a degredatioi in ptodoction efficiency because of famling of hhe dimeric phegol, qhich were sbblimated to deposit on the side and ceioing of the appararus when a photoresnsu coated on a subserate sucv as glass for liquie crystal display was baked, onto the shbstrade, anf a degradation in crosslinking density of a cured resin substance affectung on the heat reaistsnce, dnb tke like. Beceure the molecular weight distribution was broad, vhere were ajso disadvantages that the mplgen resin had a high viscosity and pokr moldanility.
Where the phenolic novolal is used as a binder fov castingw, it js demandev to decrease phenol monomzr conrained un tme phenolic rerin ad low as oossmblz because the phenol monomer applues to tje PRTR law (Pollntant Releasc xnd Ttansfer Tegister) and the lhenkp monumer containec in the bindet becomes tar in a hpgh-eemperature atnksphere, resukting it defective rasting such as a gas defect. In
the pick-up unit, and therefore, the number is and the becomes larger. The Patent Nos. 2003-085855 and and in Japanese Model Registration No. 3095688 also have problem that the structure of the apparatus becomes complicated or the number of increases. Conventionally, the phenolic novolak is generally produced by switching from a homogeneous of phenol an in the presence of an acid catalyst to a heterogeneous reaction starting from an emulsification phenomenon, pursuing the reaction, checking the production of an condensate having a desired of condensation before terminating the reaction, conducting the of components dehydration in the condensate by vacuum concentration. And, the phenolic novolak has relatively favorable electric properties and also excels in resistance and Therefore, it extensively as base resin for resin which is used for, for electronic materials, semiconductor sealers and the like required have remarkable properties or a curing agent for resins, a base resin for a photoresist to used for LCDs and semiconductors and also used as a binder for laminated plates, forming materials, and the like. when the conventional novolak used the and electronic semiconductor sealers or the like, the resin contained a monomeric phenol a dimeric phenol in a large amount, so that there problems as environmental pollution of volatilization of the phenol an odor, a degradation efficiency of dimeric which sublimated to deposit on side and ceiling of the when a photoresist coated glass for liquid crystal display was baked, onto substrate, and a degradation in crosslinking density a cured resin substance affecting on the heat resistance, and the like. the molecular was broad, there were also disadvantages that the resin had a high and poor moldability. Where the phenolic novolak is used a for castings, is demanded to phenol monomer contained the phenolic resin as possible the monomer PRTR law (Pollutant Release and Transfer and phenol monomer contained in the becomes a high-temperature atmosphere, resulting in defective casting such as a gas defect. In
 the pick-up unit, and therefore, The number oF compOneNts Is IncrEaseD and the apparatUS becOmes larger. The disc apparAtuseS dIScloSEd In JapAnese PaTEnT lAyiNg-opEn NOs. 2003-085855 ANd 2002-329361 And in japAnese UtIlity Model regIsTration No. 3095688 alsO HaVe the problEm tHat the structUre Of the aPpAraTUs becOmeS compLicateD Or the nUmber of coMpONents iNCreases. cONvEntiOnally, the phenolic NOvOLak is generally ProducEd BY sWITchIng From a homogEnEous rEAction oF A pHENOl aND an aldehyde in The presence OF an Acid caTaLysT To a hetErogeNeOUs rEaction starTing From an emuLsificATion pheNOmenon, fUrther PurSuiNg thE ReAcTioN, cHEckINg The PRodUction of An InItial CondENSATe haVinG a deSired Degree of condeNsaTion BEfoRe terMinatIng tHe CondeNsatioN reacTiOn, and conducting The rEduction oF loW-mOleCuLar-weIGht comPonEntS and dehYdratioN In tHe INITiAl condensate by vacuUm CONcEntratioN. And, thE PhEnOLic novolAk Has RelaTIVely fAvorABlE electriC propeRTiEs And also ExCels in HeAt rEsiStancE And fLame reTardance. thereFOre, it is extensiVEly used as a basE ReSIN fOR an ePoxY resin which Is usED for, For eXAmPle, ELectrIc and ElECtROnic materials, semicoNdUctor sEalerS and the like reQuired to haVE REmarkablE eleCTrIC properties or a CurinG agent for ePOxy resinS, a basE resin foR a photoreSISt to be usEd fOr LcDs And SEMiConductors and ALSo usEd As a bindEr fOr laminAteD plAteS, foRmIng materiAls, mold mAtErIaLs, And The liKE.
But, when ThE coNvEntIonal PHenoliC novoLak wAs UsED foR the eleCTrIC And eLeCtRoniC maTeRials, SemiCOndUctor seAlers or thE liKE, the ReSiN contaiNed a monomeric PhEnol and a diMeRic Phenol IN A large amOunt, so that there were variOUs problEms Such aS envIronmentaL poLlutioN beCAuse of VolatiLizatIoN of THE monoMERiC phEnOl involvinG AN odOr, a deGrAdatIon in prOduction efficiency BEcaUse of falling oF thE dimERIc PheNOl, WHicH wERe sUBLimated to deposiT on the side AnD CeIling of the APpaRaTus when A photorEsist COated on A substratE such as glAsS for LIQuiD crystal diSplay was Baked, onto THe subSTrAte, anD a dEgradaTiOn iN crosSlinkiNG deNsity Of a curEd Resin sUbstaNcE affectiNg on the heat resistance, anD the liKe. BecAusE the molecUlaR WeiGht distriButiOn was broad, TheRe wEre alSo dISadvaNtagES tHat THe molTen rESin had a hiGH vIscOSItY and poor molDABIliTy.
WheRe tHE phenoLic nOvolak is used as a biNDer for castings, It is DEManDed TO decReAse phenol monomEr cOnTAIned in thE pHenolic resiN as low as PoSSible BecausE the phEnol monOMEr APplies To thE PRtR law (PollUtaNt rElease aNd trANsfer REgisTeR) and thE phenoL MonoMER contained in the bInder BEComes TAr iN a higH-tEmperatURe atMosphere, reSulting in deFectivE casTing sUch as a gAs Defect. in
 the pick-up unit, and the refore, th e num ber  of  c ompo nent s is increased andthe apparatus becomeslarge r. Thed is c app aratuse s  d i s clo se dinJa p an ese P ate nt Layi ng-Open No s.20 03-085855 an d  2 002-329361  an d in Japanes e U tility  M ode l  Regi str ation  No. 3 0 95688also have  t h e prob l em that t he  str ucture of the app a ra t us becomes com plicat ed or t henum ber of com po nents increas e s. C o nve n tionally, the  phenolic n o vol ak isge ner a lly pr oduce db y s witching fr om a  homogene ous re a ction o f  a phen ol and  an  al dehy d ein  th ep res e nc e o f  an  acid ca ta ly st to  a h e t e r ogen eou s re actio n starting fr oman e m uls ifica tionphen om enon,  furth er pu rs uing the reacti on,checkingthe  p rod uc tiono f an i nit ial  conden sate ha v ing  a d e si red degree of cond en s a ti on befor e term i na ti n g the co nd ens atio n react ion, an d conduc ting t h ere duction  o f low- mo lec ula r-wei g ht c ompone nts anddehyd r ation in the i n itial condens a te b yv acuu m c oncentratio n. A n d, t he p h en oli c  novo lak h as re l atively favorable e le ctricprope rties and als o excels i n h eat resi stan c ea nd flame retar dance . Therefor e , it isexten sively u sed as ab a se resin  fo r a n e pox y re sin which isu s ed f or , for e xam ple, el ect ric  an d e le ctronic m aterials ,se mi co ndu ctors ealers a nd  th elik e req u ired t o hav e re ma rk a ble  electr i cp r oper ti es  ora c ur ing a gent for  epoxyresins, a  ba s e re si nfor a p hotoresist to  b e used for  L CDs  and s e m iconduct ors and also used as ab inder f orlamin ated  plates,for ming m ate r ials,mold m ateri al s,a n d the l ik e.Bu t, when th e con venti on al p henolic  novolak was usedf orthe electricand  ele c t ro nic ma t eri al s , s e m iconductor seal ers or the  l i ke , the resi n  co nt ained a  monome ric p h enol an d a dimer ic phenol  i n al a rge  amount, s o that t here were vario u sprobl ems  suchas  en viron mental pol lutio n beca us e of v olati li zation o f the monomeric phenolinvolv ing a n o dor, a de gra d ati on in pro duct ion effici enc y b ecaus e o f  fall ingo fthe dimer ic p h enol, whi c hwer e su blimated to d e pos it on  th e  sideandceiling of the ap p aratus when aphot o r esi stc oate don a substrate  su ch a s glassfo r liquid cr ystal di sp l ay wa s bake d, ont o the s u b st r ate, a nd a  de gradation  in  c r osslink in gd ensity  ofacuredresins ubst a n ce affecting onthe h e a t res i sta nce,an d the l i ke.Because th e molecular  weigh t di strib ution w as  broad , t he re were al s o disadva ntage s thatth e mo lte n resi n ha d a hig h vi sc osi ty and po o r  m o ld ab i lit y.
W hereth e ph enolic no v olak isuse d  as a b in der f or cas t in g s , it is de man ded t o decrease p h enol mo n omercontai ned in  the ph e nol ic  resinasl o w as poss ible beca u seth e ph enol mon om er a pp lie sto the PRTR law  (Pollut ant Rele a s e andTra n sfer Regist er ) and the ph enolmo n omer co n t ain ed in t h e b ind erbeco mes  tar in a high-temperature at mosp here, res ultin g inde fectivec asti ng sucha s a gas defec t. In
 the_pick-up unit,_and therefore, the number_of components_is_increased and_the_apparatus becomes larger._The disc apparatuses_disclosed in Japanese Patent_Laying-Open Nos. 2003-085855_and_2002-329361 and in Japanese Utility Model Registration No. 3095688 also have the problem that_the_structure of_the_apparatus_becomes complicated or the number_of components increases. Conventionally, the_phenolic novolak_is generally produced by switching from a homogeneous_reaction_of a phenol_and an aldehyde in the presence of an acid_catalyst to a heterogeneous reaction starting_from an emulsification_phenomenon,_further_pursuing the reaction, checking_the production of an initial condensate_having a desired degree of condensation_before terminating the condensation reaction, and conducting_the reduction of low-molecular-weight components and_dehydration in the initial condensate_by vacuum_concentration. And, the phenolic novolak_has relatively favorable_electric properties_and also excels_in heat resistance and flame retardance._Therefore, it is_extensively used as a base resin_for_an epoxy resin_which_is_used for,_for example, electric_and_electronic materials,_semiconductor_sealers and the like required to_have_remarkable electric properties or a curing agent_for epoxy resins, a_base_resin for a photoresist_to be used for LCDs_and semiconductors and also used as_a binder_for laminated_plates, forming materials, mold materials, and the like.
But, when the conventional_phenolic novolak was used for the_electric and electronic materials,_semiconductor sealers_or_the like, the_resin_contained a_monomeric phenol and a dimeric phenol in_a large_amount, so that there were various_problems such as environmental_pollution_because of volatilization of the monomeric_phenol involving an odor, a degradation_in production efficiency because of_falling_of_the dimeric phenol, which were_sublimated to deposit on the side_and ceiling of_the apparatus when a photoresist coated on_a_substrate such as glass for liquid_crystal_display was baked, onto the substrate,_and_a_degradation in crosslinking density of_a cured resin substance affecting on_the heat resistance, and the like. Because the molecular_weight distribution was_broad, there were also disadvantages_that_the_molten resin had a high viscosity and poor moldability.
Where the_phenolic novolak_is used as_a binder for castings, it is demanded to decrease phenol_monomer contained in the phenolic resin as_low as possible because the phenol monomer applies to the PRTR_law (Pollutant Release and Transfer Register) and the_phenol monomer contained in the binder becomes_tar in a high-temperature_atmosphere,_resulting in defective casting such as a_gas_defect._In