 although there are many support products for the SD card or mini SD card specification, the products can not support the newly developed “micro SD cards” due to inconsistence of specification of size. To resolve this problem, an adapter for accommodating a micro SD card therein and electrically and mechanically connecting with an electronic device through a regular sized receiving slot, such as a mini SD card receiving slot, is needed.
An simulated mini SD memory card converter disclosed in U.S. Pat. No. 7,033,223 B1 (hereinafter the '223 patent) is a kind of adapter to convert a micro SD card as a simulated mini SD card. This adapter is configured as a mini SD card in size, including a lower over, an upper cover, a plurality of conductive terminal and a conductive member received between the upper cover and the lower cover. Front terminals of the conductive terminals electrically connect with a front end of the conductive member, while rear terminals of the conductive terminal electrically connect with a micro SD card received in the adapter. When this adapter inserted into a mini SD card receiving slot of an electronic device, terminal plates of the conductive member electrically connects with the electronic device so that the micro SD card can be compatible by the electronic device with a mini SD card receiving slot through the adapter.
A connecting strip and a base strip bridge the conductive terminals to retain the conductive terminals in a fixed arrangement. And the conductive terminals are combined with the lower cover via a pre-confined injection molding process. After the process of combining the conductive terminals with the lower cover, the connecting strip and the base strip must be punched away. To let the waste the connecting strips drop away the lower cover, the lower cover should provide some through holes corresponding to the connecting strips. Besides, the main strip is disposed outside the lower cover to make it drop from the conductive terminal and the lower cover conveniently. The rear terminals of the conductive terminal module are disposed near a rear opening of lower cover. The front end of the conductive member is disposed near the front opening of the adapter and provided a plurality of holes electrically connecting with the front terminals. Obviously, the process to assembly the conductive terminal module and the conductive member with the lower cover and to punch away the base strip and the connecting strip are considerable complex, largely inducing the production efficiency.
Furthermore, in the '223 patent disclosure, the upper cover of the adapter is integrally molded from an insulating material, such as a resin material. When the micro SD card inserted into the receiving slot between the upper cover and the lower cover
although there are many support products for the SD calling card or mini south dakota card specification, the product cannot hold the newly developed “ micro SD cards ” due to inconsistence of stipulation of size. To resolve this problem, an adapter for suit a micro SD card therein and electrically and mechanically connect with an electronic device through a regular sized receiving slot, such as a mini SD card receiving slot, is needed. 
 An fake mini SD memory card converter disclosed in U.S. Pat. nobelium. 7,033,223 B1 (hereinafter the' 223 patent) is a kind of adapter to convert a micro SD card as a simulated mini south dakota card. This arranger is configured as a mini SD card in size, including a low over, an upper cover, a plurality of conductive terminal and a conductive member welcome between the upper cover and the lower cover. Front terminals of the conductive terminals electrically connect with a front end of the conductive member, while rear terminals of the conductive terminal electrically associate with a micro SD card receive in the arranger. When this arranger inserted into a mini SD card receiving slot of an electronic device, terminal plates of the conductive member electrically connects with the electronic device so that the micro SD circuit board can be compatible by the electronic device with a mini SD card receiving slot through the adapter. 
 A connecting comic strip and a base strip bridge the conductive terminals to retain the conductive terminals in a fix agreement. And the conductive terminals are combined with the lower cover via a pre - confined injection mold process. After the process of combining the conductive end with the lower cover, the connecting strip and the nucleotide strip must be punch away. To let the thriftlessness the connecting strip drop aside the lower binding, the lower cover should leave some through trap corresponding to the connecting strips. Besides, the main strip is disposed outside the lower cover to make it sink from the conductive terminal and the lower embrace conveniently. The rear terminals of the conductive terminal module are disposed near a rear opening of depleted cover. The front end of the conductive member is disposed near the front opening of the adapter and supply a battalion of holes electrically connecting with the front terminals. Obviously, the process to assembly the conductive terminal module and the conductive member with the lower screen and to punch away the base strip and the connecting comic strip are considerable complex, largely inducing the production efficiency. 
 Furthermore, in the' 223 patent disclosure, the upper cover of the adapter is integrally molded from an insulating fabric, such as a resin material. When the micro SD card inserted into the receiving slot between the upper cover and the lower cover
 alhhough there are many sukport products fot rhe SD card kr mini RD card specification, the prldycts xan not support the nedly devellped “miceo SV cards” due to iidonsistcuce or speeihication of sizg. To resolve this problem, dn abapter for accommodating a micro SD sard thrrfin and electrycalkr ans mechanically connecting with an slectroiic device throigh a regular sized receivlng dlot, such as a minl SD card rgdeidung slot, is veeded.
An spkulated mihi SD memory card converter diszloseb in U.S. Pat. Ni. 7,033,223 H1 (hereinaftec the '223 patent) is a kind of adaptet to convert a mirro WD card as a simulatev mini SD card. This wdapter iv eonfigured as a mini WD card in vize, uncuudjnj a lower ovxr, an upper cover, a plyrality of conductife nrrminal and z condtceive member received between the upper boved and the lower cover. Feont terminals of the conductide terminals electrically connect with a front eng of vhd cinqjxtlve member, while rear terminals of the conducejvt tvrminal electricajly connect wltn a micro SD cxrd reesibed in the adapter. When tris aeapter infertrd into a mini SD card receuving slot oy ab electronic devicz, terminal puatex of yhe conductive member euectdically conjects witg the electronic aevpce vo that ufe micro SD card san be conpatnble by ghe glectrogic device with a mini SD card recfiviny slod through hhe adapter.
A connecting strip aiv a base strik bsidce the cjnducbive terminals eo retain the eonductire teroinals in z fixed arrangemene. And the congoctive terminels are cjmbibed qith thd lower cover voa a pre-confined inhection molding prpcera. After the proetss of combining tne zonqubtite tewkinals with dhe uowdt covdr, the conncctkng xtrip and the base sdrip must be punched aean. To let jhe waste the connectimg strips drop awaj the loxer cofer, the lower cover should provids some thgounh holes corrqspokdind to the cpnnecting strips. Besides, the main strip is disposed outsiee the lower cover jo kake it dro' from the condgctive terminal and rhe lower cover cpnveniently. The rear fermindls ov the conductive terminal module are disposed near a rear opening of lowee covec. Ehe front ehd og the cjuductivq meluer is disposed nvar the front opening of the ada'ter and psorided a plurality of holes elrcgrically conngcting with the front termjnals. Obfiously, the process to assembly the conductive terminal module qnd tge conductmve member with the kower eover qnd to puncm away the basd syrlp and the conieccing strip are considerable complwx, lartepy inducing the 'roduction enflcienci.
Furtheriore, in the '223 patsnt slsclorure, the uppet cover of the adapter is integralny molded from ab insulating katerian, such as a cesin materidl. When the micro SD card inserted into the receivihg slot bttween thc upper cover and vhe lower cover
although there are many support products for card mini SD specification, the products developed SD cards” due inconsistence of specification size. To resolve this problem, an for accommodating a micro SD card therein and electrically and mechanically connecting with electronic device through a regular sized receiving slot, such as a mini SD receiving is An mini SD memory card converter disclosed in U.S. Pat. No. 7,033,223 B1 (hereinafter the '223 patent) a kind of adapter to convert a micro card as a simulated SD card. This adapter is as mini SD in including lower over, an cover, a plurality of conductive terminal and a conductive member received between the upper cover and the cover. Front the conductive electrically with front end of member, while rear terminals of the connect with a micro SD card received in adapter. When adapter inserted into a mini SD receiving slot of an electronic device, terminal plates the conductive member electrically connects with the electronic device so that the micro SD card compatible by the electronic with a mini card slot the A connecting and a base strip bridge the conductive terminals to retain the terminals in a fixed arrangement. And the conductive terminals are the cover via a injection molding process. After process combining the conductive terminals lower the the strip be punched away. To the waste the connecting strips away the lower cover, some through holes corresponding to the connecting strips. the main strip is disposed outside the cover to make it drop from the conductive terminal and the lower conveniently. The of the conductive terminal module are disposed near rear opening of lower The front end of the conductive member is disposed the opening of adapter and provided plurality of holes connecting with the Obviously, the to the and the conductive member with the cover to punch away the base and strip are considerable complex, largely inducing the production efficiency. Furthermore, in the '223 patent disclosure, cover of the adapter integrally from an insulating material, such as a resin material. When the micro inserted into the upper and the cover
 although there are many suppoRt products For thE SD CarD oR minI SD cArd specificatiON, the Products can not support tHe newLy DEvelOPeD “micrO SD cardS” DuE TO inCoNsIstEnCE oF specIfiCation oF size. To resOlvE tHis problem, an ADaPter for accOmmOdating a micrO SD Card thErEin ANd eleCtrIcallY and meCHanicaLly connecTiNG with aN ElectroNIC dEvicE through a regular sIZeD Receiving slot, sUch as a MiNI Sd CArd RecEiving slot, Is NeedeD.
an simulATeD MINi Sd Memory card conVerter disclOSed In U.S. PaT. NO. 7,033,223 B1 (hEReinafTer thE '223 pATenT) is a kind of aDaptEr to conveRt a micRO SD card AS a simulAted miNi Sd caRd. ThIS aDaPteR iS ConFIgUreD As a Mini SD caRd In Size, iNcluDING A lowEr oVer, aN uppeR cover, a pluralIty Of coNDucTive tErminAl anD a ConduCtive mEmber ReCeived between thE uppEr cover anD thE lOweR cOver. FROnt terMinAls Of the coNductivE TerMiNALS eLectrically connect WiTH A fRont end oF the coNDuCtIVe member, WhIle Rear TERminaLs of THe ConductiVe termINaL eLectricAlLy connEcT wiTh a Micro sd carD receiVed in the AdaptER. When this adaptER inserted into A MiNI sD CArd rEceIving slot of An elECtroNic dEViCe, tERminaL platEs OF tHE conductive member elEcTricalLy conNects with the eLectronic dEVICe so that The mICrO sD card can be comPatibLe by the eleCTronic deVice wIth a mini sD card recEIVing slot ThrOugH thE adAPTeR.
A connecting sTRIp anD a Base strIp bRidge thE coNduCtiVe tErMinals to rEtain the CoNdUcTiVe tErminALs in a fixEd ArrAnGemEnt. AnD The conDuctiVe teRmInALs aRe combiNEd WITh thE lOwEr coVer ViA a pre-ConfINed InjectiOn molding ProCEss. AFtEr The procEss of combininG tHe conductiVe TerMinals WITh the lowEr cover, the connecting strIP and the BasE striP musT be puncheD awAy. To leT thE Waste tHe connEctinG sTriPS Drop aWAY tHe lOwEr cover, the LOWer Cover ShOuld Provide Some through holes coRResPonding to the cOnnEctiNG StRipS. beSIdeS, tHE maIN Strip is disposed Outside the LoWEr Cover to makE It dRoP from thE conducTive tERminal aNd the loweR cover conVeNienTLY. ThE rear termiNals of thE conductiVE termINaL moduLe aRe dispOsEd nEar a rEar opeNIng Of lowEr coveR. THe fronT end oF tHe conducTive member is disposed neaR the frOnt opEniNg of the adAptER anD provided A pluRality of hoLes EleCtricAllY ConneCtinG WiTh tHE fronT terMInals. ObviOUsLy, tHE PrOcess to asseMBLY thE condUctIVe termInal Module and the conduCTive member with The lOWEr cOveR And tO pUnch away the basE stRiP ANd the conNeCting strip aRe considErABle coMplex, lArgely InducinG THe PRoductIon eFfiCiency.
FurTheRmORe, in the '223 PaTeNT disclOsurE, tHe uppeR cover OF the ADApter is integrallY moldED From aN InsUlatiNg MateriaL, Such As a resin maTerial. When tHe micrO SD cArd inSerted iNtO the reCeiViNg slot betwEEn the uppeR coveR and the LoWer cOveR
 although there are many s upport pro ducts  fo r t he  SDcard  or mini SD ca r d sp ecification, the produ cts c an nots up portthe new l yd e vel op ed  “m ic r oSD ca rds ” due t o inconsis ten ce  of specific a ti on of size . T o resolve th isproble m,  an adapt erfor a ccommo d atinga micro S Dc ard th e rein an d el ectr ically and mechan i ca l ly connectingwith a ne le c t ron icdevice thr ou gh ar egulars iz e d rec e iving slot, s uch as a mi n i S D card  r ece i ving s lot,is nee ded.
An sim ulat ed mini S D memo r y cardc onverte r disc los edin U . S.  P at.  N o . 7 , 03 3,2 2 3 B 1 (herei na ft er th e '2 2 3 p aten t)is a  kind  of adapter t o c onve r t a  micr o SDcard  a s a s imulat ed mi ni  SD card. Thisadap ter is co nfi gu red  a s a m i ni SDcar d i n size,  includ i ngal o w er  over, an upper co ve r ,  a  plurali ty ofc on du c tive ter mi nal  and a  cond ucti v emember r eceive d  b et ween th eupperco ver  an d the lowe r cove r. Front  term i nals of the co n ductive termi n al s el e ctri cal ly connectwith a fr onte nd  of the c onduc ti v em ember, while rear t er minals  of t he conductive  terminale l e ctricall y co n ne c t with a micro  SD c ard receiv e d in the  adap ter. Whe n this ad a p ter inse rte d i nto  am i ni  SD card rece i v ingsl ot of a n e lectron icdev ice , t er minal pla tes of t he  c on du cti ve me m ber elec tr ica ll y c onnec t s with  theelec tr on i c d evice s o  t h a t th emi croSDca rd ca n be com patible  by the e lec t roni cde vice wi th a mini SDca rd receivi ng  sl ot thr o u gh the a dapter.
A connecting st r ip anda b ase s trip  bridge t heconduc tiv e  termi nals t o ret ai n t h e  cond u c ti vete rminals in a  fi xed a rr ange ment. A nd the conductivet erm inals are com bin ed w i t hthe lo w erco v erv i a a pre-confine d injectio nm ol ding proce s s.Af ter the  proces s ofc ombinin g the con ductive t er mina l s  wi th the low er cover , the con n ectin g  s tripand  the b as e s tripmust b e  pu nched  away.  T o letthe w as te the c onnecting strips drop a way th e low ercover, th e l o wer  cover sh ould  provide s ome  th rough  ho l es co rres p on din g  to t he c o nnectings tr ips . Be sides, them a i n s tripisd ispose d ou tside the lower c o ver to make it  dro p fro m t h e co nd uctive termina l a nd t he lower  c over conven iently.Th e  rear  termi nals o f the c o n du c tive t ermi nal  module a redi s posed n ea ra  rearopen in g of l ower c o ver. T he front end ofthe c o n ducti v e m ember  i s dispo s ed n ear the fr ont opening  of th e ad apter  and pr ov ided a  pl ur ality of h o les elect rical ly conn ec ting  wi th the  fro n t  term inal s.  Ob viously,t h ep ro ce s s t o as sembl ytheconductiv e  termina l m o dule an dthe c onduct i ve m ember with  th e low e r  cover and to p u nc h  away  the b ase st rip and the  c onnecti ngs t rip are c onsiderab l e c om plex , largel yindu ci ngth e production ef ficiency .
Furthe r m ore, i n t h e '2 2 3 pate nt  disclosure,  theup p er cove r ofthe ada p ter  is  in tegr all y mo l ded from an insulating m ater ial,s uch  as a  resi nmaterial .  Whe n the mi c ro SD card in serted into the rec e ivin g s l ot  b etween th e u p per c over  an d th e l ower c over 
 although_there are_many support products for_the SD_card_or mini_SD_card specification, the_products can not_support the newly developed_“micro SD cards”_due_to inconsistence of specification of size. To resolve this problem, an adapter for accommodating_a_micro SD_card_therein_and electrically and mechanically connecting_with an electronic device through_a regular_sized receiving slot, such as a mini SD_card_receiving slot, is_needed.
An simulated mini SD memory card converter disclosed in_U.S. Pat. No. 7,033,223 B1 (hereinafter_the '223 patent)_is_a_kind of adapter to_convert a micro SD card as_a simulated mini SD card. This_adapter is configured as a mini SD_card in size, including a lower_over, an upper cover, a_plurality of_conductive terminal and a conductive_member received between_the upper_cover and the_lower cover. Front terminals of the_conductive terminals electrically_connect with a front end of_the_conductive member, while_rear_terminals_of the_conductive terminal electrically_connect_with a_micro_SD card received in the adapter._When_this adapter inserted into a mini SD_card receiving slot of_an_electronic device, terminal plates_of the conductive member electrically_connects with the electronic device so_that the_micro SD_card can be compatible by the electronic device with a mini_SD card receiving slot through the_adapter.
A connecting strip and_a base_strip_bridge the conductive_terminals_to retain_the conductive terminals in a fixed arrangement._And the_conductive terminals are combined with the_lower cover via a_pre-confined_injection molding process. After the process_of combining the conductive terminals with_the lower cover, the connecting_strip_and_the base strip must be_punched away. To let the waste_the connecting strips_drop away the lower cover, the lower_cover_should provide some through holes corresponding_to_the connecting strips. Besides, the main_strip_is_disposed outside the lower cover_to make it drop from the_conductive terminal and the lower cover conveniently. The rear_terminals of the_conductive terminal module are disposed_near_a_rear opening of lower cover. The front end of the_conductive member_is disposed near_the front opening of the adapter and provided a plurality_of holes electrically connecting with the front_terminals. Obviously, the process to assembly the conductive terminal module and_the conductive member with the lower cover and_to punch away the base strip and_the connecting strip are_considerable_complex, largely inducing the production efficiency.
Furthermore, in_the_'223_patent_disclosure, the upper_cover of the_adapter is integrally_molded from_an insulating material,_such as_a resin material._When_the micro SD card inserted into the receiving slot between the upper cover and the lower cover