 Unexamined Patent Application Publication No. 2003-68984 Conventionally well-known laminated sheets include paper base phenolic resin laminated sheets, paper base unsaturated polyester resin laminated sheets, and glass-cloth base epoxy resin laminated sheets These laminated sheets have been produced by impregnating the respective base with a resin and heat-curing a plurality of the resulting prepregs. The term "laminated sheet" as used herein means a laminated sheet having a thickness of from 0.5 to 5 mm which is used, for example, as a base of various electronic parts.
During the production of phenolic resin laminated sheets, curing of a phenolic resin is accompanied by the forming of reaction by-products, such as water, which adversely affect physical properties of the resulting laminated sheet. To avoid this, it is necessary to forcedly dissolve water, etc. in the cured product by applying a high pressure by means of a large-sized pressing machine or other machine suitable for applying high pressure to such a cured laminate. Phenolic resins generally require a long time for curing, and the additional application of high pressure also requires additional prolonged periods of time. Moreover, laminated sheets comprising phenolic resins are inferior to alternative component resins in electrical characteristics, such as dielectric constant, dielectric dissipation factor, tracking resistance,.and other relevant characteristics.
During the production of glass-cloth base epoxy resin laminated sheets, on the other hand, high pressures required for production of phenolic resin laminated sheets are not necessary, since the curing reaction is not accompanied by formation of by-products, (e.g., water), as is observed with a condensation reaction of phenolic resins. Nevertheless, curing of epoxy resins still requires long periods of time.
In order to solve these above-mentioned problems, it has been proposed to produce laminated sheets using paper as a base and an unsaturated polyester resin as an impregnating resin. According to this process, since curing is effected through radical polymerization, the time required for curing is reduced to thereby eliminate the above-described disadvantages. However, unsaturated polyester resins have poor heat resistance which results in laminated sheets exhibiting low stiffness and strength under elevated temperatures. A push for higher performance and smaller die size drives the semiconductor industry to reduce circuit chip area by approximately 50% every two years. The chip area reduction provides an economic benefit for migrating to newer technologies. The 50% chip area reduction is achieved by reducing the feature sizes between 25% and 30%. The reduction in feature size is enabled by improvements in manufacturing equipment and materials
Unexamined Patent Application Publication No. 2003 - 68984 Conventionally well - known laminated sheets include newspaper basis phenolic resin laminated sheets, paper floor unsaturated polyester resin laminated sheets, and field glass - cloth base epoxy resin laminate sheets These laminated plane have been produced by impregnating the respective al-qaeda with a resin and heating system - curing a plurality of the resulting prepregs. The term " laminated sheet " as use herein means a laminated sheet having a thickness of from 0.5 to 5 millimeter which is used, for example, as a basis of various electronic part. 
 During the production of phenolic resin laminated sheets, curing of a phenolic resin is accompanied by the forming of chemical reaction by - products, such as water, which adversely affect physical properties of the resulting laminate sheet. To avoid this, it is necessary to forcedly dissolve water, etc. in the cured product by applying a high pressure by means of a bombastic - sized pressing machine or early car suitable for applying high pressure to such a corned laminate. Phenolic resins generally require a long meter for curing, and the additional application of high pressure also ask additional prolonged periods of time. furthermore, laminated plane constitute phenolic resins are inferior to alternative component resin in electrical characteristics, such as dielectric constant, dielectric dissipation factor, tracking resistance,.and other relevant characteristics. 
 During the production of methamphetamine - cloth base epoxy resin laminate sheets, on the early hand, high pressures required for output of phenolic resin laminated sheets are not necessary, since the curing reaction is not accompanied by geological formation of by - products, (e.g., water), as is observed with a condensation reaction of phenolic resins. Nevertheless, curing of epoxy resin still requires retentive periods of time. 
 In order to solve these above - mentioned problems, it has been proposed to grow laminated sheets using paper as a base and an unsaturated polyester resin as an impregnating resin. harmonize to this procedure, since curing is effect through radical polymerization, the time required for curing is reduced to thereby eliminate the above - describe disadvantages. However, unsaturated polyester resins have inadequate heat resistance which results in laminated sheets parade low stiffness and strength under promote temperatures. A push for higher performance and smaller die size drives the semiconductor industry to reduce lap chip area by approximately 50% every two years. The chip area reduction provides an economic benefit for migrating to newer technologies. The 50% chip sphere decrease is achieved by reduce the feature sizes between 25% and 30% . The reduction in feature of speech size is enabled by improvements in manufacturing equipment and materials
 Unfxamined Patent Applicatlon Publication Ui. 2003-68984 Contentionzlly welu-known laminated sheets inclnde paper base phenolic resin lxminated dheets, pqper vase unsatndated polyestsv resnn laminated shegts, and glasv-cloth base epmxh xesin laminated sheets These laminatqd sheeys have been proqucec by jmpregnating the respective base wjth a rtsin and heat-curinb a plurality of the resulhing prepregs. The term "laminated wheee" as used herdin means a laminated aheet having a thickness of froo 0.5 to 5 mm which iw udgd, for exampoe, as a base of various enectronoc parts.
During thx priduction of phenolic cesin laminated sheejs, curing mf a phenolic resin iw accmmpatied vy ghe fprjing ov rxaction by-pdoducts, sucy as water, which adfewwely affect pgysicaj [roperties of the resulting laminated sveef. To avoid this, it is nwcessary to forcedly fissolve rater, etc. in the cured product by applying a high presajre bn mexbs of a large-sized pressing machine or other masgime suitable for cpplying high prrsdutg to such a cuted lamnhafe. Phenolic resins generajly rwquire a jong time for curing, and the adeitional appjucation of high przssure also xequirgs addotional prolonged periobs of fime. Moreovfr, laminafdd sheets compririnn pvenolic resins are inferiow to altecnatire compovent resinf in electgical characteristics, sufh as dhelectric fonstant, dielectric dissipation factor, trackimg revistance,.cnd otmer relevant chwracteristics.
Doring the prodjction of flass-clmth base epjxy resin lamhjated sheets, on the jthee habd, high oressures requored for irjducrion of phenolic rcsin uzminated sheets art bot necessary, xinze ehv cnring seaction is tot xccukpanidd by formabiov of by-products, (e.g., water), as js observed with a cjndensatuon reaceion of phenokic resins. Neverthtless, ruring of eloxi resins still requires long pediods of himc.
In order to folvc thgse above-meutioned problems, it has been proposed to produce laminated sheets using paper ss a base aid an tnsaturatad polyester resin aw an impregnating resin. According to tgis prmcess, since curing is effected through radical polymerization, the time requiree for ruwing is redhced to tvexebv elimigate vhe above-describec disadvantages. However, unsatureted polyevtzr resins have poor heat resixtxnce which rerults in laminated sheeta exhibiying low stiffness and strength under elevated temperatmres. A puwh fod highvt pxrformance and smallrr die size drives the semiconductof imdmstry to rfduct cixcuit chip area by approximately 50% every tao years. The chi' area reducbiun prkvides an economic bensfit vor mkgrating to nrwer technologoes. The 50% chip area rvdustion is achiecvd by reducinb the fvature sizes uetween 25% and 30%. The reduction in feature size is enabled by impronements in manufacburing equipment sid materials
Unexamined Patent Application Publication No. 2003-68984 Conventionally sheets paper base resin laminated sheets, laminated and glass-cloth base resin laminated sheets laminated sheets have been produced by the respective base with a resin and heat-curing a plurality of the resulting The term "laminated sheet" as used herein means a laminated sheet having a of 0.5 5 which is used, for example, as a base of various electronic parts. During the production of resin laminated sheets, curing of a phenolic resin accompanied by the forming reaction by-products, such as water, adversely physical properties the laminated To avoid this, is necessary to forcedly dissolve water, etc. in the cured product by applying a high pressure by of a machine or machine for high pressure to cured laminate. Phenolic resins generally require for curing, and the additional application of high also requires prolonged periods of time. Moreover, laminated comprising phenolic resins are inferior to alternative component in electrical characteristics, such as dielectric constant, dielectric dissipation factor, tracking resistance,.and other relevant characteristics. production of glass-cloth base resin laminated sheets, the hand, pressures for production phenolic resin laminated sheets are not necessary, since the curing reaction not accompanied by formation of by-products, (e.g., water), as is a reaction of phenolic Nevertheless, curing of epoxy still long periods of time. to these has proposed produce laminated sheets using as a base and an polyester resin as an process, since curing is effected through radical polymerization, time required for curing is reduced to eliminate the above-described disadvantages. However, unsaturated polyester resins have poor heat resistance results in exhibiting low stiffness and strength under elevated temperatures. push for higher performance smaller die size drives the semiconductor industry to reduce chip by approximately every two years. chip area reduction an economic benefit to newer The chip achieved by reducing the feature sizes 25% 30%. The reduction in feature is improvements in manufacturing equipment and materials
 Unexamined Patent ApplicatiOn PublicatIon No. 2003-68984 conVenTiOnalLy weLl-known laminatED sheEts include paper base pheNolic ReSIn laMInAted sHeets, paPEr BASe uNsAtUraTeD PoLyestEr rEsin lamInated sheeTs, aNd Glass-cloth baSE ePoxy resin lAmiNated sheets THesE laminAtEd sHEets hAve Been pRoduceD By imprEgnating tHe REspectIVe base wITH a ResiN and heat-curing a plURaLIty of the resultIng prePrEGs. tHE teRm "lAminated shEeT" as usED herein MEaNS A LamINated sheet havIng a thickneSS of From 0.5 to 5 Mm WhiCH is useD, for eXaMPle, As a base of vaRiouS electronIc partS.
during tHE producTion of PheNolIc reSIn LaMinAtED shEEtS, cuRIng Of a phenoLiC rEsin iS accOMPANied By tHe foRming Of reaction by-pRodUcts, SUch As watEr, whiCh adVeRsely Affect PhysiCaL properties of thE resUlting lamInaTeD shEeT. To avOId this, It iS neCessary To forceDLy dIsSOLVe Water, etc. in the cured PrODUcT by applyIng a hiGH pReSSure by meAnS of A larGE-Sized PresSInG machine Or otheR MaChIne suitAbLe for aPpLyiNg hIgh prESsurE to sucH a cured lAminaTE. Phenolic resinS Generally requIRe A LOnG Time For Curing, and thE addITionAl apPLiCatIOn of hIgh prEsSUrE Also requires additioNaL proloNged pEriods of time. MOreover, lamINATed sheetS comPRiSIng phenolic resIns arE inferior tO AlternatIve coMponent rEsins in elECTrical chAraCteRisTicS, SUcH as dielectric CONstaNt, DielectRic DissipaTioN faCtoR, trAcKing resisTance,.and OtHeR rElEvaNt chaRActeristIcS.
DuRiNg tHe proDUction Of glaSs-clOtH bASe ePoxy resIN lAMInatEd ShEets, On tHe Other Hand, HIgh PressurEs requireD foR ProdUcTiOn of pheNolic resin lamInAted sheets ArE noT necesSARy, since tHe curing reaction is not acCOmpanieD by FormaTion Of by-produCts, (E.g., wateR), as IS obserVed witH a conDeNsaTIOn reaCTIoN of PhEnolic resiNS. nevErtheLeSs, cuRing of ePoxy resins still reqUIreS long periods oF tiMe.
In ORDeR to SOlVE thEsE AboVE-Mentioned probleMs, it has beeN pROpOsed to prodUCe lAmInated sHeets usIng paPEr as a baSe and an unSaturated PoLyesTER reSin as an impRegnatinG resin. AccORding TO tHis prOceSs, sincE cUriNg is eFfecteD ThrOugh rAdical PoLymeriZatioN, tHe time reQuired for curing is reduceD to theReby eLimInate the aBovE-DesCribed disAdvaNtages. HoweVer, UnsAturaTed POlyesTer rESiNs hAVe pooR heaT ResistancE WhIch RESuLts in laminaTED SheEts exHibITing loW stiFfness and strength UNder elevated teMperATUreS. A pUSh foR hIgher performanCe aNd SMAller die SiZe drives the SemicondUcTOr indUstry tO reducE circuiT CHiP Area by ApprOxiMately 50% eveRy tWo YEars. The ChIp ARea redUctiOn ProvidEs an ecONomiC BEnefit for migratiNg to nEWEr tecHNolOgies. thE 50% chip arEA redUction is acHieved by redUcing tHe feAture Sizes beTwEen 25% and 30%. the ReDuction in fEAture size Is enaBled by iMpRoveMenTs in maNufaCTUring EquiPmEnt And materiALS
 Unexamined Patent Applica tion Publi catio n N o.20 03-6 8984  Conventionall y  wel l-known laminated shee ts in cl u de p a pe r bas e pheno l ic r esi nla min at e dsheet s,paper b ase unsatu rat ed  polyester r e si n laminate d s heets, and g las s-clot hbas e  epox y r esinlamina t ed she ets These  l a minate d  sheets h av e be en produced by im p re g nating the res pectiv eb as e wit h a  resin and  h eat-c u ring ap lu r a l ity of the result ing prepreg s . T he ter m"la m inated  shee t" asused herein  mea ns a lami nateds heet ha v ing a t hickne ssoffrom 0. 5to5m m w h ic h i s  us ed, forex am ple,as a b a s e of  va riou s ele ctronic parts .
D urin g  th e pro ducti on o fpheno lic re sin l am inated sheets,curi ng of a p hen ol icre sin i s  accom pan ied  by the  formin g  of  r e a c ti on by-products, su ch a swater, w hich a d ve rs e ly affec tphy sica l prope rtie s  o f the re sultin g  l am inatedsh eet. T oavo idthis, it i s nece ssary to  forc e dly dissolve w a ter, etc. int he c ur e d pr odu ct by apply inga  hig h pr e ss ure by me ans o fa  l a rge-sized pressingma chineor ot her machine s uitable fo r a pplyinghigh pr e ssure to sucha cur ed laminat e . Phenol ic re sins gen erally re q u ire a lo ngtim e f orc u ri ng, and the a d d itio na l appli cat ion ofhig h p res sur ealso requ ires add it io na lpro longe d  periods  o f t im e.Moreo v er, la minat ed s he et s  co mprisin g  p h e noli cre sins  ar einfer iort o a lternat ive compo nen t  res in sin elec trical charac te ristics, s uc h a s diel e c tric con stant, dielectric dissi p ation f act or, t rack ing resis tan ce,.an d o t her re levant  char ac ter i s tics. D ur ing  t he product i o n o f gla ss -clo th base  epoxy resin lamin a ted  sheets, on t heothe r ha nd, hi g h p re s sur e s  required for p roductionof ph enolic res i n l am inatedsheetsare n o t neces sary, sin ce the cu ri ng r e a cti on is notaccompan ied by fo r matio n  o f by- pro ducts,  ( e.g ., wa ter),a s i s obs ervedwi th a c onden sa tion rea ction of phenolic resin s. Nev erthe les s, curing  of epo xy resins  sti ll require s l ong  peri ods of ti me.I nord e r tosolv e  these ab o ve -me n t io ned problem s , ithas b een propos ed t o produce laminat e d sheets using  pap e r  as  ab asean d an unsaturat edpo l y ester re si n as an imp regnatin gr esin.  Accor ding t o thisp r oc e ss, si ncecur ing is ef fec te d  throug hra d ical p olym er izatio n, the time r equired for curi ng is r educe d  to  ther eb y elimi n atethe above- described d isadva ntag es. H owever,  u nsatur ate dpolyesterr esins hav e poo r heatre sist anc e whic h re s u lts i n la mi nat ed sheets e xh i bi ti n g l ow s tiffn es s an d strengt h  under e lev a ted tem pe rat u r es. Ap us h for higher  pe rform a n ce and sma l lerd ie sizedrives  the s emicond u cto rindustr y t o reduce ci rcuit chi p  ar ea  byapproxim at ely50 % e ve ry two years. T he chiparea red u c tion p rov i desa n econ om ic benefit f or mi gr a ting to n ewe r techn o log ies . T he 5 0%chip area reduction is achiev ed b y red u cin g the  feat ur e sizesb etwe en 25% a n d 30%. The re duction in feat u res izeise na bl ed by imp rov e ments  inman ufac tur inge q uipm e nt a n dmate rials
 Unexamined_Patent Application_Publication No. 2003-68984 Conventionally_well-known laminated_sheets_include paper_base_phenolic resin laminated_sheets, paper base_unsaturated polyester resin laminated_sheets, and glass-cloth_base_epoxy resin laminated sheets These laminated sheets have been produced by impregnating the respective_base_with a_resin_and_heat-curing a plurality of the_resulting prepregs. The term "laminated_sheet" as_used herein means a laminated sheet having a_thickness_of from 0.5_to 5 mm which is used, for example, as_a base of various electronic parts.
During_the production of_phenolic_resin_laminated sheets, curing of_a phenolic resin is accompanied by_the forming of reaction by-products, such_as water, which adversely affect physical properties_of the resulting laminated sheet. To_avoid this, it is necessary_to forcedly_dissolve water, etc. in the_cured product by_applying a_high pressure by_means of a large-sized pressing machine_or other machine_suitable for applying high pressure to_such_a cured laminate._Phenolic_resins_generally require_a long time_for_curing, and_the_additional application of high pressure also_requires_additional prolonged periods of time. Moreover, laminated_sheets comprising phenolic resins_are_inferior to alternative component_resins in electrical characteristics, such_as dielectric constant, dielectric dissipation factor,_tracking resistance,.and_other relevant_characteristics.
During the production of glass-cloth base epoxy resin laminated sheets, on_the other hand, high pressures required_for production of phenolic_resin laminated_sheets_are not necessary,_since_the curing_reaction is not accompanied by formation of_by-products, (e.g.,_water), as is observed with a_condensation reaction of phenolic_resins._Nevertheless, curing of epoxy resins still_requires long periods of time.
In order_to solve these above-mentioned problems,_it_has_been proposed to produce laminated_sheets using paper as a base_and an unsaturated_polyester resin as an impregnating resin. According_to_this process, since curing is effected_through_radical polymerization, the time required for_curing_is_reduced to thereby eliminate the_above-described disadvantages. However, unsaturated polyester resins_have poor heat resistance which results in laminated sheets_exhibiting low stiffness_and strength under elevated temperatures._A_push_for higher performance and smaller die size drives the semiconductor_industry to_reduce circuit chip_area by approximately 50% every two years. The chip area_reduction provides an economic benefit for migrating_to newer technologies. The 50% chip area reduction is achieved by_reducing the feature sizes between 25% and 30%._The reduction in feature size is enabled_by improvements in manufacturing_equipment_and materials