 the decrease in the gap between the disk surface and the recording head of a disk drive that is practically achievable. Thus, reduction in surface roughness of memory disks is highly desirable from a performance standpoint. Attempts have been made to reduce surface roughness by utilizing abrasives having smaller particle size in polishing compositions for memory disks. However, typically smaller abrasive particles result in a reduction of removal rate of the surface of memory disks, which increases the amount of time required to achieve a desired surface finish, thereby increasing production time and costs. Accordingly, there is a need in the art for methods for polishing memory disks that produce decreased levels of surface roughness while exhibiting increased polishing rates. This invention concerns a tool with at least one wear-resistant hard metal part which serves to process production pieces, such as stone or the like, which is firmly connected to a metallic carrier by means of solder located in at least one soldering aperture between the hard metal part and the metallic carrier. Among such tools are bits, such as drill bits, turning tools, and the like and processing tools to remove shavings, from lathing, milling, and the like.
Hard metal has a substantially smaller coefficient of expansion than a carrier consisting mostly of steel. Even during the soldering of the hard metallic part to the carrier, strains arise between the hard metallic part and the carrier. Because of the forces and temperature increases which may occur during operation, the strain may increase still further, and often causes tension cracks in the hard metal part, and thus causes failure of the tool.
Using a soft solder to reduce the danger of the formation of tension cracks is known. This solder connection is, however, not sufficient in many cases, especially for high performance tools. Thus, hard solder is preferred.
The greater the cross section and length of the hard metal part, the greater is the danger of tension cracks in the hard metal part. Even in high performance tools, the hard metal part must be supported in the carrier over a large surface area, in order to be able to absorb the considerable forces and momentum. Object carriers and Petri dishes for samples to be examined are used in the most variable examination methods and must therefore meet many different demands. Many biological-medical examinations are for instance carried out by the aid of light-optical microscopic and/or spectroscopic techniques. Besides the pure light-optical microscopy (e.g. for the examination of cells), methods of the high-resolution, fluorescence, phase contrast or confocal microscopy as well as the UV spectroscopy are used. Combinations
the decrease in the gap between the disk surface and the recording capitulum of a phonograph record drive that is practically achievable. therefore, reduction in surface roughness of memory disk is highly desirable from a performance standpoint. attempt have been made to reduce airfoil roughness by utilizing abrasive having smaller particle size in polishing compositions for memory disks. However, typically smaller harsh particles result in a reduction of removal pace of the surface of memory disks, which increases the amount of time necessitate to achieve a desired surface finish, thereby increasing production meter and costs. Accordingly, there is a need in the art for methods for polishing memory disks that produce decreased levels of surface roughness while exhibiting increased polishing rates. This invention refer a tool with at least one wear - repellent unvoiced metal part which serves to work production pieces, such as stone or the like, which is hard connected to a metallic carrier by means of solder located in at least one soldering aperture between the hard alloy part and the metallic carrier. Among such tools are bits, such as exercise bits, turn tools, and the like and processing tools to remove shavings, from lathing, milling, and the alike. 
 Hard metal has a well smaller coefficient of expansion than a carrier wave consisting mostly of sword. Even during the soldering of the hard metallic part to the carrier, strains originate between the hard metallic region and the carrier. Because of the effect and temperature increases which may happen during operation, the strain may increase still further, and often induce tension cracks in the hard metal part, and thus causes failure of the tool. 
 use a soft solder to reduce the risk of the formation of tension cracks is known. This solder connection is, however, not sufficient in many cases, especially for gamey performance tools. Thus, hard solder is preferred. 
 The greater the crisscross incision and duration of the hard metal part, the greater is the danger of tension crack in the hard metal part. Even in gamey performance tools, the hard metal part must be support in the carrier over a large surface area, in order to be able to absorb the considerable effect and momentum. Object carriers and Petri dishes for samples to be examined are used in the about varying examination methods and must consequently touch many different demands. Many biological - medical examinations are for instance carried out by the care of easy - optical microscopic and/or spectroscopic techniques. Besides the pure light - optical microscopy (e.g. for the interrogation of cells), methods of the high - resolution, fluorescence, phase contrast or confocal microscopy as well as the UV spectroscopy are used. Combinations
 thf decrease in the gap beuween the disk sutfqce anv the rscording head of a disk drive that id practucally achievable. Thus, reductioj in surdace eoughness of memorn disid is iighly desirablg from a perxormance stand[oknc. Attempts have been made to reduce furface rlughness by utylizpnd abdasives having smaller particle siae in pmlishing comppsitions for memory disks. Joweger, typically smalper abrasivg pawricles resulg in a redletion of rejoval rate of the surface of meoory bisks, which ibcrfdses the amiunt jf time requlged to dchieve a desired surnace hiniwh, thereby increasing production time agd costs. Dceordingly, there is a bewd in the art dor meuhovs ror popisiing memory disks that produce decreased kedvks of surfacs rougrnqss while exhibiting increased polishinc rztes. This invention conxerns a tool with at peast one wear-resistant hard metal part which serves to prmcess orobmgtiov pleces, such as stone or the like, which is firmjg voknected to a metcllic carrier by mfamf of solder lucated in at least one soldfring akerturw between the hard metal part and the merallic carrivr. Anong such tools arz bits, such cs drikl biys, turning tools, and thz like and procesding toola to remove shavivgs, fsom lathing, milling, and thq like.
Harv metcl has a subxtantiwlly smallfr cocxficient of expanslon tkan a carrier clnsisting mostly of steel. Even vnring the solcesinc of the hard metallic pare to the carrigr, strainf arire between the hacd metallic [art and the wwrrier. Becauve of thq foeces and teooerature incresses whick may occur during operetiov, the strain may inxrease still futthdr, wnf pfean causes tetsiov cfscks kn the hard oetak part, and thus causas fzilure of the tool.
Islng a sofj solder eo reduce the danger of the forlatioi of txnsion crwcks is known. This solder connsction is, horever, not susficlent in many ccses, especially for high performance tooos. Thus, hard soldgr is preferred.
The grgattr the cross xectijn and letgth of the hard metql part, the greattr is the danger of tenaion csacks in the hard metal part. Even in high performance tools, the hard metal parr must be supportes in the barxiex over w lacgx surface area, in order to be able to absorb the considesayle forces and momentum. Objecy zarriers and Ketri dishes for samples tk be exakined are used in the most varisble examination methods and musr thedefore meev many different demsnds. Mcny biilogicao-medlcal examinatiuns ave for inshanct caxried out by the aid of light-optixal mixrlscopic and/or spxctroscopic beghniqugs. Besidgs the pure light-kptidwl mizroscopy (e.g. fpr the examinayion of cells), methodv jf the high-resimution, fluorgscencg, phase contrasv or confocan microscopy as well as the UV spectroscopy are uses. Combinauions
the decrease in the gap between the and recording head a disk drive reduction surface roughness of disks is highly from a performance standpoint. Attempts have made to reduce surface roughness by utilizing abrasives having smaller particle size in compositions for memory disks. However, typically smaller abrasive particles result in a reduction removal of surface memory disks, which increases the amount of time required to achieve a desired surface finish, thereby production time and costs. Accordingly, there is a in the art for for polishing memory disks that decreased of surface while increased rates. This invention a tool with at least one wear-resistant hard metal part which serves to process production pieces, such stone or which is connected a carrier by means located in at least one soldering hard metal part and the metallic carrier. Among tools are such as drill bits, turning tools, the like and processing tools to remove shavings, lathing, milling, and the like. Hard metal has a substantially smaller coefficient of expansion than consisting mostly of steel. during the soldering the metallic to carrier, strains between the hard metallic part and the carrier. Because of the and temperature increases which may occur during operation, the strain still and often causes cracks in the hard part, thus causes failure of Using soft the of formation of tension cracks known. This solder connection is, not sufficient in many tools. Thus, hard solder is preferred. The greater cross section and length of the hard part, the greater is the danger of tension cracks in the hard part. Even performance tools, the hard metal part must be in the carrier over large surface area, in order to be able to the forces and Object carriers and dishes for samples be examined are the most examination and many different demands. Many biological-medical examinations for carried out by the aid light-optical spectroscopic techniques. Besides the pure light-optical microscopy (e.g. for the examination of cells), methods of fluorescence, phase contrast or microscopy well as the UV spectroscopy are used. Combinations
 the decrease in the gap betweeN the disk suRface And The ReCordIng hEad of a disk drivE That Is practically achievablE. Thus, ReDUctiON iN surfAce rougHNeSS Of mEmOrY diSkS Is HighlY deSirable From a perfoRmaNcE standpoint. ATTeMpts have beEn mAde to reduce sUrfAce rouGhNesS By utiLizIng abRasiveS Having Smaller paRtICle sizE In polisHINg CompOsitions for memory DIsKS. However, typicaLly smaLlER aBRAsiVe pArticles reSuLt in a REductioN Of REMOvaL Rate of the surfAce of memory DIskS, which InCreASes the AmounT oF TimE required to AchiEve a desirEd surfACe finisH, Thereby IncreaSinG prOducTIoN tIme AnD CosTS. ACcoRDinGly, there Is A nEed in The aRT FOR metHodS for PolisHing memory disKs tHat pROduCe decReaseD levElS of suRface rOughnEsS while exhibitinG incReased polIshInG raTeS. This INventiOn cOncErns a toOl with aT LeaSt ONE WeAr-resistant hard metAl PARt Which serVes to pROcEsS ProductiOn PieCes, sUCH as stOne oR ThE like, whiCh is fiRMlY cOnnecteD tO a metaLlIc cArrIer by MEans Of soldEr locateD in at LEast one solderiNG aperture betwEEn THE hARd meTal Part and the mEtalLIc caRrieR. amOng SUch toOls arE bITs, SUch as drill bits, turniNg Tools, aNd the Like and procesSing tools tO REMove shavIngs, FRoM Lathing, milling, And thE like.
Hard mETal has a sUbstaNtially sMaller coeFFIcient of ExpAnsIon ThaN A CaRrier consistiNG MostLy Of steel. eveN during The SolDerIng Of The hard meTallic paRt To ThE cArrIer, stRAins arisE bEtwEeN thE hard MEtalliC part And tHe CaRRieR. BecausE Of THE forCeS aNd teMpeRaTure iNcreASes Which maY occur durIng OPeraTiOn, The straIn may increase StIll further, AnD ofTen cauSES tension Cracks in the hard metal parT, And thus CauSes faIlurE of the tooL.
UsIng a soFt sOLder to Reduce The daNgEr oF THe forMATiOn oF tEnsion cracKS Is kNown. THiS solDer connEction is, however, not SUffIcient in many cAseS, espECIaLly FOr HIgh PeRForMANce tools. Thus, harD solder is pReFErRed.
The greaTEr tHe Cross seCtion anD lengTH of the hArd metal pArt, the greAtEr is THE daNger of tensIon crackS in the harD Metal PArT. Even In hIgh perFoRmaNce toOls, the HArd Metal Part muSt Be suppOrted In The carriEr over a large surface area, In ordeR to be AblE to absorb The COnsIderable fOrceS and momentUm. OBjeCt carRieRS and PEtri DIsHes FOr samPles TO be examinED aRe uSED iN the most varIABLe eXaminAtiON methoDs anD must therefore meeT Many different dEmanDS. manY biOLogiCaL-medical examinAtiOnS ARe for insTaNce carried oUt by the aId OF lighT-opticAl micrOscopic AND/oR SpectrOscoPic TechniqueS. BeSiDEs the puRe LiGHt-optiCal mIcRoscopY (e.g. for THe exAMInation of cells), meThods OF The hiGH-reSolutIoN, fluoreSCencE, phase contRast or confoCal micRoscOpy as Well as tHe uV specTroScOpy are used. cOmbinatioNs
 the decrease in the gap b etween the  disk  su rfa ce  and  the  recording hea d  ofa disk drive that is p racti ca l ly a c hi evabl e. Thus ,  r e d uct io ninsu r fa ce ro ugh ness of  memory di sks  i s highly des i ra ble from a  pe rformance st and point.  A tte m pts h ave  been  madet o redu ce surfac er oughne s s by ut i l iz ingabrasives havings ma l ler particle s ize in  p o li s h ing  co mpositions  f or me m ory dis k s. H o wev e r, typicallysmaller abr a siv e part ic les result  in a  r e duc tion of rem oval  rate ofthe su r face of memorydisks,  wh ich  inc r ea se s t he amo u nt  of tim e requir ed  t o ach ieve a d esir edsurf ace f inish, thereb y i ncre a sin g pro ducti on t im e and  costs . Acc or dingly, there i s aneed in t hear t f or  meth o ds for  po lis hing me mory di s ksth a t pr oduce decreased le ve l s  o f surfac e roug h ne ss while ex hi bit ingi n creas ed p o li shing ra tes. T h is  i nventio nconcer ns  atoo l wit h  atleastone wear -resi s tant hard meta l  part which s e rv e s  t o  pro ces s productio n pi e ces,  suc h  a s s t one o r the  l i ke ,  which is firmly co nn ectedto ametallic carr ier by mea n s of solde r lo c at e d in at leastone s oldering a p erture b etwee n the ha rd metalp a rt and t hemet all icc a rr ier. Among su c h  too ls  are bi ts,  such a s d ril l b its ,turning t ools, an dth eli keand p r ocessing  t ool storemov e  shavi ngs,from  l at h ing , milli n g, a nd t he  l ike. 
Ha rd  meta l ha s  asubstan tially sm all e r co ef fi cient o f expansion t ha n a carrie rcon sistin g mostly o f steel. Even during th e  solder ing  of t he h ard metal lic  parttot he car rier,strai ns  ar i s e bet w e en  th ehard metal l i c p art a nd  the  carrie r. Because of thef orc es and temper atu re i n c re ase s  w h ich  m a y o c c ur during opera tion, thest r ai n may incr e ase  s till fu rther,and o f ten cau ses tensi on cracks  i n th e har d metal pa rt, andthus caus e s fai l ur e ofthe  tool. 
U sin g a s oft so l der  to r educeth e dang er of  t he forma tion of tension cracksis kno wn. T his  solder c onn e cti on is, ho weve r, not suf fic ien t inman y  case s, e s pe cia l ly fo r hi g h perform a nc e t o o ls . Thus, har d s old er is  pr e ferred .
Th e greater the cro s s section andleng t h  of  th e  har dmetal part, th e g re a t er is th edanger of t ension c ra c ks in  the h ard me tal par t .  E v en inhigh  pe rformance  to ol s , the h ar dm etal p artmu st besuppor t ed i n the carrier over  a la r g e sur f ace  area ,in orde r  tobe able to  absorb the  consi dera ble f orces a nd  momen tum .Object car r iers andPetri  dishes  f or s amp les to  bee x amine d ar euse d in them o st va ri a ble  exa minat io n me thods and must the ref o re meet  m any d iffere n td e mands. Man y b iolog i c al-medical exam i na t ionsare fo r inst ance ca r rie dout bythe a id of lig ht-optica l  mi cr osco pic and/ or  spe ct ros co pic techniques.  Besides  the pur e light- opt i calm icrosc op y (e.g. forthe e xa m ination o f c ells),m eth ods  of  the  hi gh-r e solution, fluorescence,phas e con t ras t orconfo ca l micros c opyas wella s the UV spec troscopy are us e d.C ombi nat i on s
 the_decrease in_the gap between the_disk surface_and_the recording_head_of a disk_drive that is_practically achievable. Thus, reduction_in surface roughness_of_memory disks is highly desirable from a performance standpoint. Attempts have been made to_reduce_surface roughness_by_utilizing_abrasives having smaller particle size_in polishing compositions for memory_disks. However,_typically smaller abrasive particles result in a reduction_of_removal rate of_the surface of memory disks, which increases the amount_of time required to achieve a_desired surface finish,_thereby_increasing_production time and costs._Accordingly, there is a need in_the art for methods for polishing_memory disks that produce decreased levels of_surface roughness while exhibiting increased polishing_rates. This invention concerns a_tool with_at least one wear-resistant hard_metal part which_serves to_process production pieces,_such as stone or the like,_which is firmly_connected to a metallic carrier by_means_of solder located_in_at_least one_soldering aperture between_the_hard metal_part_and the metallic carrier. Among such_tools_are bits, such as drill bits, turning_tools, and the like_and_processing tools to remove_shavings, from lathing, milling, and_the like.
Hard metal has a substantially_smaller coefficient_of expansion_than a carrier consisting mostly of steel. Even during the soldering_of the hard metallic part to_the carrier, strains arise_between the_hard_metallic part and_the_carrier. Because_of the forces and temperature increases which_may occur_during operation, the strain may increase_still further, and often_causes_tension cracks in the hard metal_part, and thus causes failure of_the tool.
Using a soft solder_to_reduce_the danger of the formation_of tension cracks is known. This_solder connection is,_however, not sufficient in many cases, especially_for_high performance tools. Thus, hard solder_is_preferred.
The greater the cross section and_length_of_the hard metal part, the_greater is the danger of tension_cracks in the hard metal part. Even in high_performance tools, the_hard metal part must be_supported_in_the carrier over a large surface area, in order to_be able_to absorb the_considerable forces and momentum. Object carriers and Petri dishes for_samples to be examined are used in_the most variable examination methods and must therefore meet many different_demands. Many biological-medical examinations are for instance carried_out by the aid of light-optical microscopic_and/or spectroscopic techniques. Besides_the_pure light-optical microscopy (e.g. for the examination_of_cells),_methods_of the high-resolution,_fluorescence, phase contrast_or confocal microscopy_as well_as the UV_spectroscopy are_used. Combinations