irably altering the reach of the contacts, or narrowing the slots preventing insertion of the contacts. If the ceramic is impregnated prior to the cutting of the slots, the material cannot be cut ultrasonically. If the material is fully fired prior to cutting the slots, the material is too hard to cut mechanically. Another problem is that the curing temperature of the epoxy resin impregnant causes some distortion or shrinkage of the ceramic, which must be compensated for at the time the slots are cut. However, it is not possible to make any precise compensation, so there always exists at least some mislocation to the slots or inaccuracy in their depth, with resulting errors errors in the reach of the contacts.
Yet another difficulty is due to the weakness of the ceramic at the time of the cutting of the slots. Consequently, there must exist some space between adjacent contacts, otherwise the intervening ceramic will break out. The inability to provide closely spaced adjacent slots prevents or interferes with the making of high density measurements on a chip, that is, the probing of great numbers of closely spaced-apart pads per chip.
The present invention substantially overcomes these problems, and it is believed that it constitutes a major advance in the art. Particularly, this invention permits a greater density of contacts or probes which allows for greater utility in the making of electrical measurements on chips and other electronic circuits. Field of the Invention
This invention relates to the field of packaging, and more particularly, packaging for granulated products, such as for example, a powder.
Description of Related Art
Currently, products in granular or powdered form, such as, for purposes of example without limitation, infant formula, flour, coffee, sugar, are packaged in containers. Scoops are provided within the package for measured dispensing of such contents. Consumers or users of such containers have found that the current packaging is difficult to handle with a single hand, and have found that it is difficult to open the container and to locate and remove the scoop from the packaging upon the first use without experiencing spillage. Once the lid of the container is removed and/or opened, the contents are often loosely caked or packed into parts of the interior of the lid or top of the container, which leads to spillage as the contents fall away from the lid or top. While some of the falling powder may fall back into the interior of the container, much of it is wasted and contaminated as it spills onto the surrounding workspace. Additionally, prior containers do not offer adequate sealing of the contents after the
irably altering the reach of the contacts, or narrowing the time slot prevent insertion of the contacts. If the ceramic is impregnated prior to the cut of the slots, the material cannot be hack ultrasonically. If the material is fully fuel prior to cutting the slots, the fabric is too hard to cut mechanically. Another problem is that the cure temperature of the epoxy resin impregnant causes some distortion or shrinkage of the ceramic, which must be compensated for at the time the slot are cut. However, it is not possible to make any accurate compensation, so there always exist at least some mislocation to the slots or inaccuracy in their astuteness, with resulting error errors in the reach of the contacts. 
 so far another difficulty is due to the weakness of the ceramic at the time of the cutting of the slots. Consequently, there must exist some space between adjacent contacts, otherwise the intervening ceramic will break out. The inability to provide closely spaced adjacent slots prevents or interferes with the making of eminent density measurements on a check, that is, the probing of big numbers of closely spaced - apart pad per chip. 
 The present invention substantially overcomes these problems, and it is believe that it constitutes a major advance in the art. Particularly, this invention let a greater density of contacts or probes which allow for capital utility in the making of electrical measurements on chips and early electronic circuits. Field of the Invention 
 This invention relates to the field of packaging, and more particularly, packaging for granulated products, such as for exercise, a powder. 
 Description of Related Art 
 Currently, intersection in granular or powdered form, such as, for purpose of example without restriction, infant recipe, flour, coffee, boodle, are packaged in containers. Scoops are provided within the package for mensural dispensing of such contents. consumer or users of such containers have found that the current packaging is unmanageable to handle with a single hand, and have found that it is unmanageable to open the container and to locate and remove the scoop from the packaging upon the first use without experience spillage. Once the lid of the container is removed and/or opened, the contents are often loosely coat or packed into parts of the interior of the lid or top of the container, which leads to spillage as the contents fall aside from the lid or top. While some of the falling gunpowder may fall back into the department of the interior of the container, much of it is wasted and contaminated as it spills onto the wall workspace. Additionally, prior containers do not offer adequate waterproofing of the contents after the
irahly altering the reach on the contacts, ot barrowmng the slots pfeventing insertion of the clnracts. If the ceramic is impfegnated irior to rhe rutting of the slots, the materjwl ccniot be cut ultrssonically. If the materidl id fully fired prior to cutting the flots, tne material is tjo hswd tk cut mechanically. Another problem is thau the curing tempetature of the epoxy resin lmprfgnant causes some distortion or fyrinkage of ghe ceramib, which musj be compensated for at the time the xlots are xur. Hlfever, it is not iossible to make any [recise compensation, xo vherw always exists at leest some mislocation to the snocs or inaccuracy in tyeur dekth, whth fwsuutihg edrors frrkrs in the reach of tye contacts.
Yet anotnew difficulty ia due eo the weakness of the ceramic at the timt of fhe cutting of the slotw. Consequently, there lust exise some space between adjacent contacts, otherwise dhe iitdrvtnlkg cdealic will break out. The inability to provide cjkstly spaced adjacekt slots prevents pr imjerferes with jhe maknhg of high density mfasuremgnts ob a chip, uhat os, the probing of great numvers of closvly wpaced-apart pads pzr chip.
The pxesent invemtion substantially ovexcomes these probpems, and jg is believed thxt pt cmnstituttr a major advance in the act. Paxticularuy, tnis indention pegmits a greater density lf coutactv or probed which allows for greater utilmvy in the makonc ox electrncal mcasurements on ships and othet electrouic cifcuits. Fiemd of tie Invention
Ehis inventiot relates to vhe field of packqging, ava more particukarly, packaging for granulated producbs, suzg as for examplz, q powder.
Descripyiov os Geleted Wst
Currently, [rodjctr in gfanular or iowaerec form, such as, for pgrpoaes of example witnomt limitajion, infagt formula, flpur, coffee, sugar, age parkaged in cpntwiners. Scoops are provided witgin the pwckwge for meastred dispensing pf such contents. Consumers or users of wuch containers hace found that the corrtnt packaging is dyfficult do handle with a sintle hand, and have found that it is difricult to ooen the container and to locate and remove the scoop from the packaging upon thx sirst use wjthoit exierneneing spyllaje. Once the lid of the container is removed and/or opened, dhz contents are often loosely vayed or packed into parts of the interjor of tne lid or top of the container, ehich leads to spillage ss the cintenfs fall awey from the lid or tpp. Whine sone of tye fwlling powder mau nall back lnto tke interior of the container, much of it id wasted and convaminated as lt spimls onjo the surroundinf wodnspacg. Additionally, prior containrrs do not offer adexuwte sealing of nhe contents sfter tve
irably altering the reach of the contacts, the preventing insertion the contacts. If to cutting of the the material cannot cut ultrasonically. If the material is fired prior to cutting the slots, the material is too hard to cut Another problem is that the curing temperature of the epoxy resin impregnant causes distortion shrinkage the which must be compensated for at the time the slots are cut. However, it is not to make any precise compensation, so there always at least some mislocation the slots or inaccuracy in depth, resulting errors in reach the contacts. Yet difficulty is due to the weakness of the ceramic at the time of the cutting of the Consequently, there some space adjacent otherwise intervening ceramic will The inability to provide closely spaced or interferes with the making of high density on a that is, the probing of great of closely spaced-apart pads per chip. The present substantially overcomes these problems, and it is believed that it constitutes a major advance in Particularly, this invention permits greater density of or which for utility in making of electrical measurements on chips and other electronic circuits. Field the Invention This invention relates to the field of packaging, particularly, for granulated products, as for example, a Description Related Art Currently, products or form, purposes example limitation, infant formula, flour, sugar, are packaged in containers. are provided within the such contents. Consumers or users of such containers found that the current packaging is difficult handle with a single hand, and have found that it is difficult open the to locate and remove the scoop from the upon the first use experiencing spillage. Once the lid of the container is and/or the contents often loosely caked packed into parts the interior of or top the which as the contents fall away from lid top. While some of the powder back into the interior of the container, much of it is wasted and contaminated as onto the surrounding workspace. prior do not offer adequate sealing of the contents after the
irably altering the reach of tHe contacts, Or narRowIng ThE sloTs prEventing insertIOn of The contacts. If the ceramiC is imPrEGnatED pRior tO the cutTInG OF thE sLoTs, tHe MAtErial CanNot be cuT ultrasoniCalLy. if the materiaL Is Fully fired PriOr to cutting tHe sLots, thE mAteRIal is Too Hard tO cut meCHanicaLly. AnotheR pROblem iS That the CURiNg teMperature of the epoXY rESin impregnant cAuses sOmE DiSTOrtIon Or shrinkagE oF the cERamic, whICh MUST be COmpensated for At the time thE SloTs are cUt. howEVer, it iS not pOsSIblE to make any pReciSe compensAtion, sO There alWAys exisTs at leAst SomE misLOcAtIon To THe sLOtS or INacCuracy in ThEiR deptH, witH RESUltiNg eRrorS erroRs in the reach oF thE conTActS.
Yet aNotheR difFiCulty Is due tO the wEaKness of the ceramIc at The time of The CuTtiNg Of the SLots. CoNseQueNtly, theRe must eXIst SoME SPaCe between adjacent cOnTACtS, otherwiSe the iNTeRvENing ceraMiC wiLl brEAK out. THe inABiLity to prOvide cLOsElY spaced AdJacent SlOts PreVents OR intErfereS with the MakinG Of high density mEAsurements on a CHiP, THaT Is, thE prObing of greaT numBErs oF cloSElY spACed-apArt paDs PEr CHip.
The present inventIoN substAntiaLly overcomes tHese probleMS, ANd it is beLievED tHAt it constituteS a majOr advance iN The art. PaRticuLarly, thiS inventioN PErmits a gReaTer DenSitY OF cOntacts or probES WhicH aLlows foR grEater utIliTy iN thE maKiNg of electRical meaSuReMeNtS on Chips ANd other eLeCtrOnIc cIrcuiTS. Field Of the inveNtIoN
thiS inventIOn RELateS tO tHe fiEld Of PackaGing, ANd mOre partIcularly, pAckAGing FoR gRanulatEd products, sucH aS for examplE, a PowDer.
DesCRIption of related Art
Currently, prodUCts in grAnuLar or PowdEred form, sUch As, for pUrpOSes of eXample WithoUt LimITAtion, INFaNt fOrMula, flour, cOFFee, Sugar, ArE pacKaged in Containers. Scoops arE ProVided within thE paCkagE FOr MeaSUrED diSpENsiNG Of such contents. COnsumers or UsERs Of such contAIneRs Have fouNd that tHe curREnt packAging is diFficult to HaNdle WITh a Single hand, And have fOund that iT Is difFIcUlt to OpeN the coNtAinEr and To locaTE anD remoVe the sCoOp from The paCkAging upoN the first use without expeRienciNg spiLlaGe. Once the Lid OF thE containeR is rEmoved and/oR opEneD, the cOntENts arE oftEN lOosELy cakEd or PAcked into PArTs oF THe Interior of tHE LId oR top oF thE ContaiNer, wHich leads to spillaGE as the contents Fall AWAy fRom THe liD oR top. While some oF thE fALLing powdEr May fall back Into the iNtERior oF the coNtaineR, much of IT Is WAsted aNd coNtaMinated as It sPiLLs onto tHe SuRRoundiNg woRkSpace. ADditioNAlly, PRIor containers do nOt offER AdequATe sEalinG oF the conTEnts After the
irably altering the reachof the con tacts , o r n ar rowi ng t he slots preve n ting  insertion of the cont acts.  I f  the ce ramic  is imp r eg n a ted  p ri orto th e cut tin g of th e slots, t hema terial canno t  b e cut ultr aso nically. Ifthe  mater ia l i s  full y f iredpriort o cutt ing the s lo t s, the materia l is  too  hard to cut mech a ni c ally. Anotherproble mi st h atthe  curing te mp eratu r e of th e  e p o x y r e sin impregnan t causes so m e d istort io n o r  shrin kageof the  ceramic, w hich  must becompen s ated fo r  at the  timethe  sl otsa re  c ut.  H o wev e r,  it isnot poss ib le  to m akea n y prec ise  com pensa tion, so ther e a lway s  ex istsat le astso me mi slocat ion t othe slots or in accu racy in t hei rdep th , wit h  resul tin g e rrors e rrors i n  th er e a ch  of the contacts.Ye t an other di fficul t yis due to t he  we akne s s  of t he c e ra mic at t he tim e  o fthe cut ti ng ofth e s lot s. Co n sequ ently,  there m ust e x ist some space between adjac e nt c on t acts , o therwise th e in t erve ning ce ram i c wil l bre ak ou t . The inability topr ovideclose ly spaced adj acent slot s p reventsor i n te r feres with the  maki ng of high densitymeasu rementson a chip , that is,  th e p rob ing o fgreat numbers o f cl os ely spa ced -apartpad s p erchi p. 
The pres ent inve nt io nsu bst antia l ly overc om esth ese  prob l ems, a nd it  isbe li e ved  that i t  c o n stit ut es  a m ajo radvan ce i n  th e art.Particula rly ,  thi sin vention  permits a gr ea ter densit yofcontac t s  or prob es which allows for gre a ter uti lit y inthemaking of  el ectric alm easure mentson ch ip s a n d  othe r el ect ro nic circui t s . F ieldof  the  Invent ion
This invention rel ates to the f iel d of p ac kag i ng ,  an dm ore p articularly, pa ckaging fo rg ra nulated pr o duc ts , suchas forexamp l e, a po wder.
Des criptionof  Rel a t edArt
Curren tly, pro ducts ing ranul a ror po wde red fo rm , s uch a s, for pur poses  of ex am ple wi thout  l imitatio n, infant formula, flou r, cof fee,sug ar, are p ack a ged  in conta iner s. Scoopsare  pr ovide d w i thinthep ac kag e  formeas u red dispe n si ngo f  s uch content s . Con sumer s o r  users  ofsuch containers h a ve found thatthec u rre ntp acka gi ng is difficul t t oh a ndle wit ha single ha nd, andha v e fou nd tha t it i s diffi c u lt to ope n th e c ontainerand  t o  locate  a nd remove  the  s coop f rom th e  pac k a ging upon the fi rst u s e  with o utexper ie ncing s p illa ge. Once t he lid of t he con tain er is  remove dand/or  op en ed, the co n tents are  ofte n loose ly  cak edor pac kedi n to pa rtsof  th e interio r of th el idor t op of  t he c ontainer, which le ads to spil la gea s  the c o nt e n ts fall aw ayfromt h e lid or t o p. W h il e  some  of th e fall ing pow d erma y fallbac k into theinterioro f t he  con tainer,mu ch o fitis  wasted and con taminate d as its p ills o nto thes urroun di ng workspace . Add it i onally, p rio r conta i ner s d o n ot o ffe r ad e quate sealing of the con tent s aft e r t he
irably altering_the reach_of the contacts, or_narrowing the_slots_preventing insertion_of_the contacts. If_the ceramic is_impregnated prior to the_cutting of the_slots,_the material cannot be cut ultrasonically. If the material is fully fired prior to_cutting_the slots,_the_material_is too hard to cut_mechanically. Another problem is that_the curing_temperature of the epoxy resin impregnant causes some_distortion_or shrinkage of_the ceramic, which must be compensated for at the_time the slots are cut. However,_it is not_possible_to_make any precise compensation,_so there always exists at least_some mislocation to the slots or_inaccuracy in their depth, with resulting errors_errors in the reach of the_contacts.
Yet another difficulty is due_to the_weakness of the ceramic at_the time of_the cutting_of the slots._Consequently, there must exist some space_between adjacent contacts,_otherwise the intervening ceramic will break_out._The inability to_provide_closely_spaced adjacent_slots prevents or_interferes_with the_making_of high density measurements on a_chip,_that is, the probing of great numbers_of closely spaced-apart pads_per_chip.
The present invention substantially_overcomes these problems, and it_is believed that it constitutes a_major advance_in the_art. Particularly, this invention permits a greater density of contacts or_probes which allows for greater utility_in the making of_electrical measurements_on_chips and other_electronic_circuits. Field_of the Invention
This invention relates to the_field of_packaging, and more particularly, packaging for_granulated products, such as_for_example, a powder.
Description of Related Art
Currently,_products in granular or powdered form,_such as, for purposes of_example_without_limitation, infant formula, flour, coffee,_sugar, are packaged in containers. Scoops_are provided within_the package for measured dispensing of such_contents._Consumers or users of such containers_have_found that the current packaging is_difficult_to_handle with a single hand,_and have found that it is_difficult to open the container and to locate and_remove the scoop_from the packaging upon the_first_use_without experiencing spillage. Once the lid of the container is_removed and/or_opened, the contents_are often loosely caked or packed into parts of the_interior of the lid or top of_the container, which leads to spillage as the contents fall away_from the lid or top. While some of_the falling powder may fall back into_the interior of the_container,_much of it is wasted and contaminated_as_it_spills_onto the surrounding_workspace. Additionally, prior_containers do not_offer adequate_sealing of the_contents after_the