. Furthermore, the paste is applied on the stencil during the printing step, in a large amount. The solvent mixed in the paste continually evaporates. As a result, the viscosity of the paste continuously changes during the printing step. The surface uniformity of the plugs is worse because the paste viscosity continuously increases during the printing step.
Accordingly, the present invention provides an apparatus for manufacturing a voidless plug, as well as an improved method of manufacturing a voidless plug.
To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, the invention provides an apparatus for manufacturing a plug. The apparatus includes a closed printing chamber having a baseplate on the bottom of the closed printing chamber. A pressure controlling system is connected to the closed printing chamber. The baseplate includes a heating unit. A paste source tank is located in the closed printing chamber.
To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, the invention provides a method of manufacturing a plug. The method includes the following steps. A baseplate located on the bottom of a closed printing chamber is provided. A printed circuit board and a stencil are mounted on the baseplate in sequence. The stencil is aligned to the printed circuit board. An amount of preheated paste is placed on the stencil. A pressure of the closed printing chamber is adjusted to a first pressure. A printing step is performed to form plugs in the printed circuit board. The pressure of the closed printing chamber is adjusted to a second pressure to remove voids trapped in the plugs. The pressure of the closed printing chamber is adjusted to a third pressure. A scraping step is performed to remove the redundant paste.
The apparatus and the method according to the invention both avoid forming trapped voids in a plug; the reliability of the packages is thus improved and the surface uniformity of the plug is also improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. Handheld electronic devices are becoming increasingly popular. Examples of handheld devices include handheld computers, cellular telephones, media players, and hybrid devices that include the functionality of multiple devices of this type, among others.
Due in part to their mobile nature, handheld electronic devices are often provided with wireless communications capabilities. Handheld electronic devices may use long-range wireless communications to communicate with wireless base stations. For example, cellular telephones may communicate
. Furthermore, the paste is applied on the stencil during the printing step, in a big sum. The solvent mixed in the paste continually evaporate. As a result, the viscosity of the paste endlessly changes during the printing step. The open uniformity of the plugs is worse because the spread viscosity continuously increases during the printing step. 
 consequently, the present invention provides an apparatus for manufacturing a voidless spark plug, as well as an improved method of manufacture a voidless plug. 
 To achieve these and other advantages and in accord with the purpose of the invention, as embodied and broadly describe herein, the invention provides an apparatus for manufacture a plug. The apparatus includes a closed printing chamber give birth a baseplate on the bottom of the closed printing chamber. A pressure see system is connected to the closed printing chamber. The baseplate includes a heating unit. A paste source tank car is located in the closed impression bedroom. 
 To achieve these and other advantages and in accordance with the purpose of the invention, as embody and broadly described herein, the invention provides a method of manufacturing a hack. The method includes the following steps. A baseplate located on the bed of a closed printing chamber is provided. A printed racing circuit board and a stencil are hop on on the baseplate in sequence. The stencil is aligned to the printed circuit board. An sum of preheated paste is placed on the stencil. A atmospheric pressure of the closed printing chamber is adjusted to a beginning pressure. A print step is performed to shape plugs in the print circuit display panel. The pressure of the shut printing chamber is adjusted to a second atmospheric pressure to murder voids trapped in the plugs. The pressure of the closed printing chamber is adjusted to a third pressure. A scrape step is performed to murder the redundant paste. 
 The apparatus and the method acting according to the invention both avoid forming trapped voids in a plug; the reliability of the packages is thus improved and the surface uniformity of the chew is besides improved. 
 It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claim. Handheld electronic devices are becoming increasingly democratic. Examples of hand-held devices include handheld computers, cellular telephones, media players, and hybrid devices that admit the functionality of multiple devices of this type, among others. 
 Due in part to their mobile nature, handheld electronic devices are often provided with wireless communications capabilities. hand-held electronic device may use long - range wireless communications to communicate with wireless base stations. For example, cellular telephones may commune
. Fugthermore, the paste is akplied on the steuxil ducing ths printivg step, in a large amount. Thx soovent mixed in the paste covtinually evaporares. Es a result, the tjscositn of fme pavve continuously changes dgring the prindivg step. The surface uniformity of the plugs os worse because the [asts viscosity continuously increases during the printing step.
Accordingly, the presejt ijvention provides wn apparatuw fow manufacturivg a voidltsv plug, as sell as an improved method of mxnufaeturing a viieledv plug.
To aciieve nhese and othcg advandages amd in accordange wivh tye purpose of the invxntion, as embodied agd broadlf bescribed herein, the uncentimn psoviaws xn zp'arztus flr janufacturjng a plug. Rhe apparatus inclucef a closed prihting shwmber having a baseplate on the bottom mf fhe closed printing chanber. A pressure contrllling syftem is connected to the closed printing chamber. Dhe besdplcbc inzoufes a heating unit. A paste source tank is locwfec pn the closed prikting chamber.
To acnifvr these and otfer adrznfages and in accorfance wyth tye purpost of yhe invention, as embodied abd broadly dvscrubed herein, the inrention provndes a methpd of manufacturing a puug. Fhe method lncludes ffe following steos. S taseplatt located on the bjttom of e cloxed privtinb chamfer is progided. A printed circuit hoard atd a stencll are mounted on the baseplate in sequence. Tne stvncil is clignec to the prineed circuit bocrd. An aiount of preheaned paste is placed jn the stencin. A pressure mf the cjosee prunting zfamber is adjuxted to a first prewsure. A printing sbep ir performed to firm plugs in the ptinged cprcnit bjdrd. The presvure of yhe cuosed printlng chakber is adjusted to d sedond pressure to rrmjve voidw trappeq in the plugx. The pressure of uhe clmsev prinyind chamber is adjusted to a thidd pressuge. W scraping seep ls pgrformed to remove the redundant paste.
The apparatuw and the method axcording to the invgntlon both avomd foriing trap[ed voids in a plug; rhe reliability on the packages is thus improeed ajd the surface uniformity of the plug is also improved.
It is to be understiod thet both the fkregping ceuercl descwiptmoi and the followimg detailed description are exeoplary, atd are intended to provide furyhdr explanatiov of the invention as clzimed. Hamdheld electronic devices are brcoming increasingly popmlar. Examples kf handhelv devices include hamdheld compyters, cwllupar telephoner, mrdla players, and hvbrid devices that include the fubctionqllty of multiple vevices of tmir typg, among jthers.
Due in parf to hheir mobile naturr, handheld elevtronic devices are mfeen provided wunh wireless cpmmunicdtions capabmlities. Handveld electronic devices may use long-range wireless bommunicatjons to gommunicate with emreless base stations. Fov exaiple, celuular telephmnes may communicate
. Furthermore, the paste is applied on during printing step, a large amount. paste evaporates. As a the viscosity of paste continuously changes during the printing The surface uniformity of the plugs is worse because the paste viscosity continuously during the printing step. Accordingly, the present invention provides an apparatus for manufacturing voidless as as improved method of manufacturing a voidless plug. To achieve these and other advantages and in accordance the purpose of the invention, as embodied and described herein, the invention an apparatus for manufacturing a The includes a printing having baseplate on the of the closed printing chamber. A pressure controlling system is connected to the closed printing chamber. The includes a A paste tank located the closed printing achieve these and other advantages and the purpose of the invention, as embodied and described herein, invention provides a method of manufacturing plug. The method includes the following steps. A located on the bottom of a closed printing chamber is provided. A printed circuit board stencil are mounted on baseplate in sequence. stencil aligned the circuit board. amount of preheated paste is placed on the stencil. A pressure the closed printing chamber is adjusted to a first pressure. step performed to form in the printed circuit The of the closed printing adjusted a remove trapped the plugs. The pressure the closed printing chamber is to a third pressure. to remove the redundant paste. The apparatus and method according to the invention both avoid trapped voids in a plug; the reliability of the packages is thus and the of the plug is also improved. It is be understood that both foregoing general description and the following detailed description are and intended to further explanation of invention as claimed. electronic devices are popular. Examples handheld include telephones, media players, and hybrid devices include functionality of multiple devices of type, Due in part to their mobile nature, handheld electronic devices are often provided with wireless Handheld electronic devices may long-range communications to communicate with wireless base stations. For example, cellular telephones may
. Furthermore, the paste is applIed on the stEncil DurIng ThE priNtinG step, in a large aMOunt. the solvent mixed in the paSte coNtINualLY eVaporAtes. As a REsULT, thE vIsCosItY Of The paSte ContinuOusly changEs dUrIng the printiNG sTep. The surfAce Uniformity of The Plugs iS wOrsE BecauSe tHe pasTe viscOSity coNtinuouslY iNCreaseS During tHE PrIntiNg step.
Accordingly, THe PResent inventioN proviDeS An APParAtuS for manufaCtUring A VoidlesS PlUG, AS weLL as an improved Method of manUFacTuring A vOidLEss pluG.
To acHiEVe tHese and otheR advAntages anD in accORdance wITh the puRpose oF thE inVentIOn, As EmbOdIEd aND bRoaDLy dEscribed HeReIn, the InveNTION proVidEs an ApparAtus for manufaCtuRing A PluG. The aPparaTus iNcLudes A closeD prinTiNg chamber having A basEplate on tHe bOtTom Of The clOSed priNtiNg cHamber. A PressurE ConTrOLLInG system is connected To THE cLosed priNting cHAmBeR. the basepLaTe iNcluDES a heaTing UNiT. A paste sOurce tANk Is Located In The cloSeD prIntIng chAMber.
to achiEve these And otHEr advantages anD In accordance wITh THE pURposE of The inventioN, as eMBodiEd anD BrOadLY descRibed HeREiN, The invention provideS a Method Of manUfacturing a plUg. The methoD INCludes thE folLOwINg steps. A baseplAte loCated on the BOttom of a CloseD printinG chamber iS PRovided. A PriNteD ciRcuIT BoArd and a stenciL ARe moUnTed on thE baSeplate In sEquEncE. ThE sTencil is aLigned to ThE pRiNtEd cIrcuiT Board. An aMoUnt Of PreHeateD Paste iS placEd on ThE sTEncIl. A presSUrE OF the ClOsEd prIntInG chamBer iS AdjUsted to A first preSsuRE. A prInTiNg step iS performed to fOrM plugs in thE pRinTed cirCUIt board. THe pressure of the closed prINting chAmbEr is aDjusTed to a secOnd PressuRe tO Remove Voids tRappeD iN thE PLugs. THE PrEssUrE of the closED PriNting ChAmbeR is adjuSted to a third pressuRE. A sCraping step is PerFormED To RemOVe THe rEdUNdaNT Paste.
The apparatUs and the meThOD aCcording to THe iNvEntion bOth avoiD formINg trappEd voids in A plug; the rElIabiLITy oF the packagEs is thus Improved aND the sURfAce unIfoRmity oF tHe pLug is Also imPRovEd.
It iS to be uNdErstooD that BoTh the forEgoing general descriptioN and thE follOwiNg detaileD deSCriPtion are eXempLary, and are IntEndEd to pRovIDe furTher EXpLanATion oF the INvention aS ClAimED. haNdheld electRONIc dEviceS arE BecomiNg inCreasingly popular. eXamples of handhEld dEVIceS inCLude HaNdheld computerS, ceLlULAr telephOnEs, media playErs, and hyBrID deviCes thaT incluDe the fuNCTiONality Of muLtiPle deviceS of ThIS type, amOnG oTHers.
DuE in pArT to theIr mobiLE natURE, handheld electroNic deVICes arE OftEn proViDed with WIrelEss communiCations capaBilitiEs. HaNdhelD electrOnIc deviCes MaY use long-raNGe wirelesS commUnicatiOnS to cOmmUnicatE witH WIreleSs baSe StaTions. For eXAMpLE, cElLUlaR telEphonEs May cOmmunicatE
. Furthermore, the paste i s appliedon th e s ten ci l du ring  the printings tep,  in a large amount. Th e sol ve n t mi x ed  in t he past e  c o n tin ua ll y e va p or ates.  As  a resu lt, the vi sco si ty of the pa s te  continuou sly  changes dur ing  the p ri nti n g ste p.The s urface unifor mity of t he plugsi s worse b ec ause  the paste viscos i ty continuously i ncreas es du r i ngthe  printingst ep.
A c cording l y, t h e p r esent inventi on provides anappara tu s f o r manu factu ri n g a  voidless p lug,  as wellas ani mproved methodof man ufa ctu ring avo idl es s  pl u g. 
To ach ieve the se  a nd ot hera d v a ntag esandin ac cordance with  th e pu r pos e ofthe i nven ti on, a s embo diedan d broadly descr ibed  herein,the  i nve nt ion p r ovides  an  ap paratus  for ma n ufa ct u r i ng  a plug. The appar at u s  i ncludesa clos e dpr i nting ch am ber  hav i n g a b asep l at e on the  botto m  o fthe clo se d prin ti ngcha mber. A pr essure  control lings ystem is conne c ted to the cl o se d pr i ntin g c hamber. The  bas e plat e in c lu des a hea tingun i t. A paste source tank  i s loca ted i n the closedprinting c h a m ber.
Toachi e ve these and othe r adv antages an d  in acco rdanc e with t he purpos e of the i nve nti on,  as e mb odied and bro a d ly d es cribedher ein, th e i nve nti onpr ovides amethod o fma nu fa ctu ringa  plug. T he  me th odinclu d es the  foll owin gst e ps.  A base p la t e  loc at ed  onthe  b ottom  ofa  cl osed pr inting ch amb e r is  p ro vided.A printed cir cu it board a nd  astenci l are moun ted on the baseplate in sequenc e.The s tenc il is ali gne d to t hep rinted  circu it bo ar d.A n  amou n t  o f p re heated pas t e  is  plac ed  onthe ste ncil. A pressure o f  th e closed prin tin g ch a m be r i s  a d jus te d  to a  first pressure . A printi ng st ep is perf o rme dto form  plugsin th e  printe d circuit  board. T he  pre s s ure  of the cl osed pri nting cha m ber i s  a djust edto a s ec ond  pres sure t o  re movevoidstr appedin th eplugs. T he pressure of the clos ed pri nting  ch amber isadj u ste d to a th irdpressure.A s cra pingste p  is p erfo r me d t o  remo ve t h e redunda n tpas t e .The apparat u s and  themet h od acc ordi ng to the inventi o n both avoid f ormi n g  tr app e d vo id s in a plug; t here l i abilityof  the packag es is th us impro ved an d thesurface u ni f ormity  ofthe  plug isals oi mproved .It is tobe u nd erstoo d that both t he foregoing gen erald e scrip t ion  andth e follo w ingdetailed d escriptionare ex empl ary,and are  i ntende d t oprovide fu r ther expl anati on of t he  inv ent ion as  cla i m ed. H andh el d e lectronic d ev i ce sa rebeco mingin crea singly po p ular. Ex amp l es of h an dhe l d  devic e si n clude hand hel d com p u ters, cell u lart el e phone s, med ia pla yers, a n d h yb rid dev ice s that incl ude the f u nct io nali ty of mu lt iple  d evi ce s of this type,  among o thers.
D u e  in pa rtt o th e ir mob il e nature, ha ndhel de lectron i c  de vices a r e o fte n p rovi ded  wit h  wireless communications  cap abili t ies . Han dheld  e lectroni c  dev ices may use long-rang e wireless comm u nic a tion s t o  c om municatewit h  wire less  ba se s tat ions . Fore xamp l e,  cel lulartele ph on es may co mm unicate 
. Furthermore,_the paste_is applied on the_stencil during_the_printing step,_in_a large amount._The solvent mixed_in the paste continually_evaporates. As a_result,_the viscosity of the paste continuously changes during the printing step. The surface uniformity_of_the plugs_is_worse_because the paste viscosity continuously_increases during the printing step.
Accordingly,_the present_invention provides an apparatus for manufacturing a voidless_plug,_as well as_an improved method of manufacturing a voidless plug.
To achieve_these and other advantages and in_accordance with the_purpose_of_the invention, as embodied_and broadly described herein, the invention_provides an apparatus for manufacturing a_plug. The apparatus includes a closed printing_chamber having a baseplate on the_bottom of the closed printing_chamber. A_pressure controlling system is connected_to the closed_printing chamber._The baseplate includes_a heating unit. A paste source_tank is located_in the closed printing chamber.
To achieve_these_and other advantages_and_in_accordance with_the purpose of_the_invention, as_embodied_and broadly described herein, the invention_provides_a method of manufacturing a plug. The_method includes the following_steps._A baseplate located on_the bottom of a closed_printing chamber is provided. A printed_circuit board_and a_stencil are mounted on the baseplate in sequence. The stencil is_aligned to the printed circuit board._An amount of preheated_paste is_placed_on the stencil._A_pressure of_the closed printing chamber is adjusted to_a first_pressure. A printing step is performed_to form plugs in_the_printed circuit board. The pressure of_the closed printing chamber is adjusted_to a second pressure to_remove_voids_trapped in the plugs. The_pressure of the closed printing chamber_is adjusted to_a third pressure. A scraping step is_performed_to remove the redundant paste.
The apparatus_and_the method according to the invention_both_avoid_forming trapped voids in a_plug; the reliability of the packages_is thus improved and the surface uniformity of the_plug is also_improved.
It is to be understood_that_both_the foregoing general description and the following detailed description are_exemplary, and_are intended to_provide further explanation of the invention as claimed. Handheld electronic_devices are becoming increasingly popular. Examples of_handheld devices include handheld computers, cellular telephones, media players, and hybrid_devices that include the functionality of multiple devices_of this type, among others.
Due in part_to their mobile nature,_handheld_electronic devices are often provided with wireless_communications_capabilities._Handheld_electronic devices may_use long-range wireless_communications to communicate_with wireless_base stations. For_example, cellular_telephones may communicate