 xe2x80x94CHxe2x95x90Nxe2x80x94, oxazoles, thiazoles, imidazoles, or mixtures thereof. The heterocycle oligomers may simply need to be doped to exhibit semiconductive properties, and xe2x80x94CHxe2x95x90Nxe2x80x94 bonds may be unnecessary.
While conventional theory holds that semiconductive polymers should have (1) low ionization potentials, (2) long conjugation lengths, and (3) planar backbones, there is an inherent trade-off between conductivity and toughness or processibility, if these constraints are followed. To overcome the processing and toughness shortcomings common with Schiff base, oxazole, imidazole, or thiazole polymers, the oligomers of the present invention, include xe2x80x9csulfonexe2x80x9d (i.e., electronegative) linkages interspersed along the backbone providing a mechanical swivel for the rigid, conductive segments of the arms. Phenoxyphenylsulfone or phenoxyphenylketone moieties are preferred to provide added toughness.
The advanced composite blends of the present invention can be combined with reinforcing materials and cured to composite materials using heat or chemicals to activate crosslinking or interlinking between end caps. Prepregs can be prepared by conventional prepregging techniques. While woven fabrics are the typical reinforcement, the fibers can be continuous or discontinuous (in chopped or whisker form) and may be ceramic, organic, carbon (graphite), or glass, as suited for the desired application. Curing generally is conducted in conventional vacuum bagging techniques at elevated temperatures. The curing temperature varies with the choice of end cap. If desired, mixtures of end caps might be used.
The advanced composite blends of the present invention can also be used as adhesives, varnishes, films, and coatings.
Although polyaryl compounds are generally described, aliphatic moieties can be included in the backbones, in some cases, although the ultimate use temperatures of these oligomers or composites may be lower than those oligomers that have entirely polyaryl backbones.
While para isomerization has primarily been shown, other isomers are possible. Furthermore, the aryl groups can have substituents, if desired, such as halogen, lower alkyl up to about 4 carbon atoms, lower alkoxy up to about 4 carbon atoms, or aryl. Substituents may
xe2x80x94CHxe2x95x90Nxe2x80x94, oxazoles, thiazoles, imidazoles, or mixtures thereof. The heterocycle oligomers may plainly necessitate to be doped to exhibit semiconductive property, and xe2x80x94CHxe2x95x90Nxe2x80x94 bonds may be unnecessary. 
 While conventional hypothesis holds that semiconductive polymers should suffer (1) low ionization potentials, (2) farseeing conjugation lengths, and (3) planar spinal column, there is an inherent trade - off between conductivity and toughness or processibility, if these constraints are succeed. To overcome the processing and toughness defect common with Schiff base, oxazole, imidazole, or thiazole polymer, the oligomers of the present invention, include xe2x80x9csulfonexe2x80x9d (i.e., negative) linkages interspersed along the backbone providing a mechanical swivel for the rigid, conductive segments of the branch. Phenoxyphenylsulfone or phenoxyphenylketone moieties are preferred to provide added toughness. 
 The advanced composite blends of the present invention can be combined with reinforcing materials and cured to composite materials using heat or chemicals to activate crosslinking or interlinking between goal caps. Prepregs can be prepared by ceremonious prepregging technique. While woven framework are the typical reinforcement, the roughage can be continuous or discontinuous (in chop or whisker form) and may be ceramic, constituent, carbon (graphite), or glass, as suited for the desired application. Curing broadly is conducted in conventional vacuum bagging technique at elevated temperature. The curing temperature varies with the choice of end cap. If desire, mixtures of end caps might be use. 
 The advanced composite blends of the present invention can also be used as adhesive material, varnishes, films, and coatings. 
 Although polyaryl compounds are generally describe, aliphatic moieties can be include in the backbones, in some character, although the ultimate use temperature of these oligomers or composites may be lower than those oligomers that have entirely polyaryl backbones. 
 While para isomerization has primarily been show, other isomers are possible. Furthermore, the aryl groups can have substituents, if desired, such as halogen, lower alkyl up to about 4 carbon paper atoms, lower alkoxy up to about 4 carbon paper atoms, or aryl. Substituents may
 xe2d80x94CHxe2x95x90Nxe2x80x94, oxazoles, tmiazoles, imidazoles, or kixturss thereuf. The heterocycle oligomers mqy sinply need to be doped go exhibin semiconeuctmve properties, ais xe2x80x94CMre2x95x90Nsc2x80x94 bmids may be unnegessary.
Whila conventional tfelry holds that semiconductive polymqrs shoilf have (1) low iogizauiog pofvnuials, (2) long conjugation lengths, ahd (3) plaiar backbones, tnere is an inherent trade-ovf bftween conductivitj and toughbess ir processibklity, if these constrajnts are followed. To overcome tfe prpcessing abd tokchness shorvcominds common wibn Schixf base, oxazole, imidadole, mr rhiazole polymers, the oligomers of the kresent ineeution, include xe2x80x9csuofinexe2f80x9d (h.e., euwctfontgavivs) linkwgea interspedsed along rhe backbone providond a mechanical swivej sor the rigid, conductive segments of tht arma. Phenoxyphenylsulfone ir phenoxyphenylketong moieties are preferred to provide added toughness.
The advatced roopowibe buwnfs of the present invention can be combined wyfh rvinforcing matericls and cured to clmljsite materiaus usiuf geat or chemicals ho actidate xrosslinkyng pr interlinking between end caps. Prepreys xan be prepared by conventioncl prekreggimg techniques. While wovzn fabdics are thf typical feinforcement, thd fpberv can be continuous or dissontinuouw (in choppea or whiskqr form) anf may be ceramic, organic, carbln (graphite), lr glass, as suited for the desicxd applicatiom. Wurpng generclly ix conducted ig conventional vacuum baggkng technisues at elevated tqmperatures. Tvg curing tempxrature vwriew wirh the zfoice of end csp. If desprtd, mixturew of end caps mighb be ossd.
The advanced eunposite blends pf ghe pgesxnt igeention can dlso be ised xs adhesivew, varmishes, films, and coadinga.
Although polyaryl cjmpounds are genqrally descrined, aliphatic moieuies cen be mncludrd yn the backbones, in some cases, although thc ultimate usq tenperatures oy these oligomers or composites may be liwer than those olugomers that have eutlrely polyarbl bachbones.
Whine para isomerizatiob has primarily bten shown, other isomers are pmssibpe. Furthermore, the aryl groups can have substituents, if desired, such as hqlogen, lower alkyl up yo abmuc 4 earbon wtomd, lower alkoxy up to about 4 carbon atoms, or aryl. Substitgeuts may
xe2x80x94CHxe2x95x90Nxe2x80x94, oxazoles, thiazoles, imidazoles, or mixtures thereof. oligomers simply need be doped to bonds be unnecessary. While theory holds that polymers should have (1) low ionization (2) long conjugation lengths, and (3) planar backbones, there is an inherent trade-off conductivity and toughness or processibility, if these constraints are followed. To overcome the and shortcomings with base, oxazole, imidazole, or thiazole polymers, the oligomers of the present invention, include xe2x80x9csulfonexe2x80x9d (i.e., electronegative) interspersed along the backbone providing a mechanical swivel the rigid, conductive segments the arms. Phenoxyphenylsulfone or phenoxyphenylketone are to provide toughness. advanced blends of the invention can be combined with reinforcing materials and cured to composite materials using heat or chemicals to crosslinking or end caps. can prepared conventional prepregging techniques. fabrics are the typical reinforcement, the continuous or discontinuous (in chopped or whisker form) may be organic, carbon (graphite), or glass, as for the desired application. Curing generally is conducted conventional vacuum bagging techniques at elevated temperatures. The curing temperature varies with the choice of If desired, mixtures of caps might be The composite of present invention also be used as adhesives, varnishes, films, and coatings. Although polyaryl are generally described, aliphatic moieties can be included in the some although the ultimate temperatures of these oligomers composites be lower than those have polyaryl isomerization primarily shown, other isomers are Furthermore, the aryl groups can substituents, if desired, such to about 4 carbon atoms, lower alkoxy up about 4 carbon atoms, or aryl. Substituents
 xe2x80x94CHxe2x95x90Nxe2x80x94, oxazoles, thIazoles, imiDazolEs, oR miXtUres TherEof. The heterocyCLe olIgomers may simply need to Be dopEd TO exhIBiT semiConductIVe PROpeRtIeS, anD xE2X80x94cHxe2x95X90NxE2x80x94 bondS may be unneCesSaRy.
While conveNTiOnal theory HolDs that semicoNduCtive pOlYmeRS shouLd hAve (1) loW ionizATion poTentials, (2) lOnG ConjugATion lenGTHs, And (3) pLanar backbones, theRE iS An inherent tradE-off beTwEEn CONduCtiVity and touGhNess oR ProcessIBiLITY, if THese constrainTs are followED. To OvercoMe The PRocessIng anD tOUghNess shortcoMingS common wiTh SchiFF base, oxAZole, imiDazole, Or tHiaZole POlYmErs, ThE OliGOmErs OF thE present InVeNtion, InclUDE XE2x80x9cSulFoneXe2x80x9d (I.e., electronegaTivE) linKAgeS inteRsperSed aLoNg the BackboNe proViDing a mechanical SwivEl for the rIgiD, cOndUcTive sEGments Of tHe aRms. PhenOxyphenYLsuLfONE Or PhenoxyphenylketonE mOIEtIes are prEferreD To PrOVide addeD tOugHnesS.
tHe advAnceD CoMposite bLends oF ThE pResent iNvEntion CaN be ComBined WIth rEinforCing mateRials ANd cured to compoSIte materials uSInG HEaT Or chEmiCals to activAte cROsslInkiNG oR inTErlinKing bEtWEeN End caps. Prepregs can bE pRepareD by coNventional prePregging teCHNIques. WhiLe woVEn FAbrics are the tyPical ReinforcemENt, the fibErs caN be contiNuous or diSCOntinuouS (in ChoPpeD or WHIsKer form) and may BE CeraMiC, organiC, caRbon (graPhiTe), oR glAss, As Suited for The desirEd ApPlIcAtiOn. CurINg generaLlY is CoNduCted iN ConvenTionaL vacUuM bAGgiNg technIQuES At elEvAtEd teMpeRaTures. the cURinG temperAture variEs wITh thE cHoIce of enD cap. If desired, MiXtures of enD cAps Might bE USed.
The adVanced composite blends of THe preseNt iNventIon cAn also be uSed As adheSivES, varniShes, fiLms, anD cOatINGs.
AltHOUgH poLyAryl compouNDS arE geneRaLly dEscribeD, aliphatic moieties CAn bE included in thE baCkboNES, iN soME cASes, AlTHouGH The ultimate use tEmperatureS oF ThEse oligomeRS or CoMpositeS may be lOwer tHAn those Oligomers That have eNtIrelY POlyAryl backboNes.
While Para isomeRIzatiON hAs priMarIly beeN sHowN, otheR isomeRS arE possIble. FuRtHermorE, the aRyL groups cAn have substituents, if desIred, suCh as hAloGen, lower aLkyL Up tO about 4 carBon aToms, lower aLkoXy uP to abOut 4 CArbon AtomS, Or AryL. substItueNTs may
 xe2x80x94CHxe2x95x90Nxe2x 80x94, oxa zoles , t hia zo les,  imi dazoles, or mi x ture s thereof. The heteroc ycleol i gome r smay s imply n e ed t o b edo ped  t o  e xhibi t s emicond uctive pro per ti es, and xe2x 8 0x 94CHxe2x95 x90 Nxe2x80x94 b ond s maybe  un n ecess ary .
Whi le con v ention al theory  h o lds th a t semic o n du ctiv e polymers should ha v e (1) low ioni zation  p o te n t ial s,(2) long c on jugat i on leng t hs , a nd( 3) planar bac kbones, the r e i s an i nh ere n t trad e-off  b e twe en conducti vity  and toug hnesso r proce s sibilit y, ifthe secons t ra in tsar e  fo l lo wed .  To  overcom eth e pro cess i n g andtou ghne ss sh ortcomings co mmo n wi t h S chiff  base , ox az ole,imidaz ole,or  thiazole polym ers,  the olig ome rs  of  t he pr e sent i nve nti on, inc lude xe 2 x80 x9 c s u lf onexe2x80x9d (i.e. ,e l ec tronegat ive) l i nk ag e s inters pe rse d al o n g the  bac k bo ne provi ding a me ch anicalsw ivel f or  th e r igid, cond uctive  segment s oft he arms. Pheno x yphenylsulfon e  o r ph e noxy phe nylketone m oiet i es a re p r ef err e d toprovi de ad d ed toughness.
The a dv ancedcompo site blends o f the pres e n t  inventi on c a nb e combined wit h rei nforcing m a terialsand c ured tocomposite m aterials  us ing  he ato r  c hemicals to a c t ivat ecrossli nki ng or i nte rli nki ngbe tween end  caps. P re pr eg scan  be p r epared b ycon ve nti onalp repreg gingtech ni qu e s.While w o ve n fabr ic sarethe  t ypica l re i nfo rcement , the fib ers canbe  c ontinuo us or discont in uous (in c ho ppe d or w h i sker for m) and may be ceramic,o rganic,  ca rbon(gra phite), o r g lass,ass uitedfor th e des ir eda p plica t i on . C ur ing genera l l y i s con du cted  in con ventional vacuum b a ggi ng techniques  at  ele v a te d t e mp e rat ur e s.T h e curing temper ature vari es wi th the cho i ceof  end ca p. If d esire d , mixtu res of en d caps mi gh t be u sed .
The adva nced com posite bl e nds o f  t he pr ese nt inv en tio n can  alsob e u sed a s adhe si ves, v arnis he s, films , and coatings.
Althoug h poly arylcom pounds ar e g e ner ally desc ribe d, aliphat icmoi eties  ca n  be i nclu d ed  in the b ackb o nes, in s o me  ca s e s,  although t h e ult imate  us e  tempe ratu res of these olig o mers or compos ites m aybel ower  t han those olig ome rs t hat have  e ntirely pol yaryl ba ck b ones. 
While  paraisomeri z a ti o n hasprim ari ly been s how n, other i so me r s areposs ib le. Fu rtherm o re,t h e aryl groups ca n hav e subst i tue nts,if  desire d , su ch as halo gen, loweralkylup t o abo ut 4 ca rb on ato ms,  l ower alkox y  up to ab out 4  carbon  a toms , o r aryl . Su b s titue ntsma y
 xe2x80x94CHxe2x95x90Nxe2x80x94,_oxazoles, thiazoles,_imidazoles, or mixtures thereof._The heterocycle_oligomers_may simply_need_to be doped_to exhibit semiconductive_properties, and xe2x80x94CHxe2x95x90Nxe2x80x94 bonds_may be unnecessary.
While_conventional_theory holds that semiconductive polymers should have (1) low ionization potentials, (2) long conjugation_lengths,_and (3)_planar_backbones,_there is an inherent trade-off_between conductivity and toughness or_processibility, if_these constraints are followed. To overcome the processing_and_toughness shortcomings common_with Schiff base, oxazole, imidazole, or thiazole polymers, the_oligomers of the present invention, include_xe2x80x9csulfonexe2x80x9d (i.e., electronegative)_linkages_interspersed_along the backbone providing_a mechanical swivel for the rigid,_conductive segments of the arms. Phenoxyphenylsulfone_or phenoxyphenylketone moieties are preferred to provide_added toughness.
The advanced composite blends of_the present invention can be_combined with_reinforcing materials and cured to_composite materials using_heat or_chemicals to activate_crosslinking or interlinking between end caps._Prepregs can be_prepared by conventional prepregging techniques. While_woven_fabrics are the_typical_reinforcement,_the fibers_can be continuous_or_discontinuous (in_chopped_or whisker form) and may be_ceramic,_organic, carbon (graphite), or glass, as suited_for the desired application._Curing_generally is conducted in_conventional vacuum bagging techniques at_elevated temperatures. The curing temperature varies_with the_choice of_end cap. If desired, mixtures of end caps might be used.
The_advanced composite blends of the present_invention can also be_used as_adhesives,_varnishes, films, and_coatings.
Although_polyaryl compounds_are generally described, aliphatic moieties can be_included in_the backbones, in some cases, although_the ultimate use temperatures_of_these oligomers or composites may be_lower than those oligomers that have_entirely polyaryl backbones.
While para isomerization_has_primarily_been shown, other isomers are_possible. Furthermore, the aryl groups can_have substituents, if_desired, such as halogen, lower alkyl up_to_about 4 carbon atoms, lower alkoxy_up_to about 4 carbon atoms, or_aryl._Substituents_may