 11, 1975 to Graham et al and U.S. Pat. No. 4,505,292 issued Mar. 19, 1985 to Osterode, respectively.
In addition, the resilient mounting of the valve seat provides some cushioning action as the valve is closed thereby reducing wear and promoting longer life of the sealing components. This feature in valves of this type is recognized in U.S. Pat. No. 2,840,336 issued June 24, 1958 to Suthann. Conventionally, as a method (hereinafter, referred to as “sealing method”) for sealing members in an electronic component or the like or as a method (hereinafter, referred to as “bonding method”) for bonding members together in an electronic component or the like, the following methods and the like are known: that is, (1) a method in which a one-part epoxy resin adhesive agent is applied to a member and the adhesive agent is cured by heating; (2) a method in which a two-part epoxy resin adhesive agent is mixed and applied to a member, and is then cured by being left to stand; (3) a method in which a UV-curable adhesive agent is used; and (4) a method in which an instant adhesive agent is used.
Moreover, various techniques have been developed for dealing with different problems caused in a conventionally known sealing method or bonding method or in a conventionally known case where a sealing agent or adhesive agent is used.
For example, Patent Literature 1 discloses a technique in which, in order to prevent diffusion of heat energy generated by a curing reaction inside a curable resin composition in a complex in which the curable resin composition is attached onto metal or the like, a surface of a highly heat conductive member such as metal is coated with a material having low heat conductivity, a curable resin composition layer is formed thereon and is irradiated with energy, and thus continuous curing with the heat energy can be carried out. It is also disclosed in Patent Literature 1 that, in that case, an energy beam such as an ultraviolet ray (UV), an electron beam (EB), or a laser or heat energy or the like by conduction can be used.
Moreover, for example, Patent Literature 2 discloses an adhesive agent composition which contains a powder component such as a filler and can be stably applied without containing gas bubbles even in a case where an amount of the adhesive agent composition to be applied is small. Further, Patent Literature 2 discloses that the composition is cured by heat, and a microenc
11, 1975 to Graham et al and U.S. Pat. No. 4,505,292 issued Mar. 19, 1985 to Osterode, respectively. 
 In addition, the resilient climb of the valve buttocks leave some cushioning action as the valve is close thereby reducing wear and promote long animation of the sealing components. This feature of speech in valves of this type is recognized in U.S. Pat. No. 2,840,336 issue June 24, 1958 to Suthann. Conventionally, as a method (hereinafter, refer to as “ sealing method ”) for seal members in an electronic component or the like or as a method acting (hereinafter, referred to as “ bonding method ”) for adhere members in concert in an electronic component or the comparable, the following methods and the like are know: that is, (1) a method in which a one - part epoxy resin adhesive agent is applied to a member and the adhesive agentive role is bring around by heating; (2) a method in which a two - part epoxy resin adhesive agent is mixed and applied to a member, and is then cured by being left to digest; (3) a method in which a UV - curable adhesive agentive role is use; and (4) a method acting in which an instant adhesive agent is used. 
 Moreover, various techniques have been developed for dealing with unlike problems caused in a conventionally known sealing method or bonding method or in a conventionally known case where a sealing agent or adhesive agent is use. 
 For model, Patent Literature 1 discloses a technique in which, in order to prevent diffusion of heat department of energy generated by a curing reaction inside a curable resin composition in a complex in which the curable resin composition is attached onto metal or the like, a airfoil of a highly heat conductive penis such as metal is coated with a fabric having low heat conductivity, a curable resin typography layer is form thereon and is irradiated with energy, and therefore continuous curing with the heat energy can be carried out. It is also disclosed in Patent Literature 1 that, in that case, an energy beam such as an ultraviolet ray (UV), an electron beam (EB), or a laser or hotness energy or the like by conduction can be use. 
 Moreover, for example, Patent Literature 2 discloses an adhesive agent composition which contains a gunpowder component such as a filler and can be stably applied without containing gas bubbles even in a case where an amount of the adhesive agentive role composition to be applied is small. Further, Patent Literature 2 discloses that the composition is cured by heat, and a microenc
 11, 1975 ho Graham et al and U.S. Pxt. No. 4,505,292 issued Mce. 19, 1985 to Osterkde, respdctively.
In addition, the resipiwnt miunting of the valve sdat provifes some cusiioning action as the valve is gloseb vhereby reducinn wear and [romoting longar lnfe of the sealing components. This fqature on valves of thif tyke ys rsbonnized in U.S. Pat. No. 2,840,336 issued June 24, 1958 to Slthann. Conventionslly, as a method (hereinaftfr, rfferred to as “seallng method”) dor fwaling membefs in an electronic cojponent or the like or as a metfod (hzreinafter, tzderggd to as “bonving mvthod”) for bonding memters tobether in an ekecvronuc component or the lmke, the following mejhods and dhz like are known: that iw, (1) a kethmd iv whkch a ohe-part epkxy resin zdhesive agwnt is applied to a mqnber and the zdheside agent is cured by heating; (2) a method in whjch a two-part epoxy resun adhesive agent is lixed and applied to a member, and is then cured by being laft tk stckq; (3) a method in which a UV-curable adhesive agent if uxec; and (4) a methob in which an inxtwny adhesive agevt is baes.
Moreover, various hechniqoes hace been dtveloled for dealing with differwnt problems xaused in a convencionally knocn seaking kethod or bonding methob or ih a conventlonally khuwn case where a seslhng agenu or adhesive agene is used.
Hor erample, Pxtenj Literwture 1 disfloses a technique in whlch, iu ordar to prevfnt diffusion of heat energy geixrated by a coritg geaction nnside a curable refin compositiou in a cjmpleb in which the cucable resin somposition iv attached onvo metal jr tye luke, a sjfface of a hignly heat bouductive nember such as metel ir coated with a nattrual having low hext sojdnctivydy, a curable reskn zpmposktion layer ks fprmed thereon and is irrzdiated with energu, wnd thus continujus curing wiyh the heat energy can ue carcied oit. Yt is also disclosed in Patent Literatuge 1 that, in thae cawe, an energy beam such as an ultraviolet ray (UV), an xlectron beam (EB), or a lqser or heat energy pr the like by cjnduction can be used.
Moreover, for example, Patekt Literature 2 disclosss an ddheslve agent composition which contains a powder component such as a filler qnd cai fe stably alplird winhobt eontainyng jar bubbles even im a case where an amount of the adhesiva cgent composition to be applird is small. Furjher, Patent Literature 2 diacloses yhat the composition is cured bu heat, and a microenc
11, 1975 to Graham et al and No. issued Mar. 1985 to Osterode, mounting the valve seat some cushioning action the valve is closed thereby reducing and promoting longer life of the sealing components. This feature in valves of type is recognized in U.S. Pat. No. 2,840,336 issued June 24, 1958 to Conventionally, a (hereinafter, to as “sealing method”) for sealing members in an electronic component or the like or as method (hereinafter, referred to as “bonding method”) for members together in an component or the like, the methods the like known: is, a method in a one-part epoxy resin adhesive agent is applied to a member and the adhesive agent is cured heating; (2) in which two-part resin agent is mixed to a member, and is then left to stand; (3) a method in which UV-curable adhesive is used; and (4) a method which an instant adhesive agent is used. Moreover, techniques have been developed for dealing with different problems caused in a conventionally known sealing bonding method or in conventionally known case a agent adhesive is used. example, Patent Literature 1 discloses a technique in which, in order prevent diffusion of heat energy generated by a curing reaction curable composition in a in which the curable composition attached onto metal or a of conductive such metal is coated with material having low heat conductivity, curable resin composition layer irradiated with energy, and thus continuous curing with heat energy can be carried out. It also disclosed in Patent Literature 1 that, in that case, an energy such as ray (UV), an electron beam (EB), or a or heat energy or like by conduction can be used. Moreover, for example, Literature discloses an agent composition which a powder component as a filler be stably without gas a case where an amount of adhesive composition to be applied is Further, 2 discloses that the composition is cured by heat, and a microenc
 11, 1975 to Graham et al and U.S. Pat. No. 4,505,292 issUed Mar. 19, 1985 to OsTerodE, reSpeCtIvelY.
In aDdition, the resiLIent Mounting of the valve seat ProviDeS Some CUsHioniNg actioN As THE vaLvE iS clOsED tHerebY reDucing wEar and promOtiNg Longer life of THe Sealing comPonEnts. This featUre In valvEs Of tHIs typE is RecogNized iN u.S. Pat. NO. 2,840,336 issued JuNe 24, 1958 TO SuthaNN. ConvenTIOnAlly, As a method (hereinafTEr, REferred to as “seaLing meThOD”) fOR SeaLinG members in An ElectROnic comPOnENT Or tHE like or as a metHod (hereinafTEr, rEferreD tO as “BOnding MethoD”) fOR boNding memberS togEther in an ElectrONic compONent or tHe like, The FolLowiNG mEtHodS aND thE LiKe aRE knOwn: that iS, (1) a MeThod iN whiCH A ONe-paRt ePoxy Resin Adhesive agent Is aPpliED to A membEr and The aDhEsive Agent iS cureD bY heating; (2) a method In whIch a two-paRt ePoXy rEsIn adhESive agEnt Is mIxed and Applied TO a mEmBER, AnD is then cured by beinG lEFT tO stand; (3) a mEthod iN WhIcH A UV-curabLe AdhEsivE AGent iS useD; AnD (4) a method In whicH An InStant adHeSive agEnT is UseD.
MoreOVer, vArious TechniquEs havE Been developed fOR dealing with dIFfEREnT ProbLemS caused in a cOnveNTionAlly KNoWn sEAling MethoD oR BoNDing method or in a convEnTionalLy knoWn case where a sEaling agenT OR Adhesive AgenT Is USed.
For example, PAtent literature 1 DIscloses A techNique in wHich, in ordER To prevenT diFfuSioN of HEAt Energy generatED By a cUrIng reacTioN inside A cuRabLe rEsiN cOmpositioN in a compLeX iN wHiCh tHe curABle resin CoMpoSiTioN is atTAched oNto meTal oR tHe LIke, A surfacE Of A HIghlY hEaT conDucTiVe memBer sUCh aS metal iS coated wiTh a MAterIaL hAving loW heat conductiViTy, a curable ReSin ComposITIon layer Is formed thereon and is irrADiated wIth EnergY, and Thus contiNuoUs curiNg wITh the hEat eneRgy caN bE caRRIed ouT. iT iS alSo Disclosed iN pAteNt LitErAturE 1 that, in That case, an energy beAM suCh as an ultraviOleT ray (uv), An EleCTrON beAm (eb), or A LAser or heat energY or the like By COnDuction can BE usEd.
moreoveR, for exaMple, PATent LitErature 2 diScloses an AdHesiVE AgeNt compositIon which Contains a POwder COmPonenT suCh as a fIlLer And caN be staBLy aPplieD withoUt ContaiNing gAs Bubbles eVen in a case where an amount Of the aDhesiVe aGent compoSitIOn tO be applieD is sMall. FurtheR, PaTenT LiteRatURe 2 disClosES tHat THe comPosiTIon is cureD By HeaT, ANd A microenc
 11, 1975 to Graham et aland U.S. P at. N o.4,5 05 ,292  iss ued Mar. 19, 1 9 85 t o Osterode, respective ly.
I na ddit i on , the  resili e nt m oun ti ng  of  t h evalve  se at prov ides somecus hi oning action as  the valve  is  closed ther eby  reduc in g w e ar an d p romot ing lo n ger li fe of the  s e alingc omponen t s .This  feature in valve s  o f  this type isrecogn iz e di n  U. S.Pat. No. 2 ,8 40,33 6  issued Ju n e 24, 1958 to Sutha nn. Convent i ona lly, a sa m e thod ( herei na f ter , referredto a s “sealin g meth o d”) for sealing  membe rsinan e l ec tr oni cc omp o ne nto r t he likeor  a s a m etho d ( h erei naf ter,  refe rred to as “b ond ingm eth od”)for b ondi ng  memb ers to gethe rin an electroni c co mponent o r t he  li ke , the follow ing  me thods a nd thel ike  a r e kn own: that is, (1)am e th od in wh ich ao ne -p a rt epoxy  r esi n ad h e siveagen t  i s applie d to a me mb er andth e adhe si veage nt is cure d by h eating;(2) a method in whic h  a two-part e p ox y re s in a dhe sive agentis m i xedanda pp lie d  to a  memb er ,  a n d is then cured bybe ing le ft to  stand; (3) a  method in w h ich a UV -cur a bl e  adhesive agen t isused; and( 4) a met hod i n whichan instan t adhesive  ag ent  is  us e d .Moreover, var i o us t ec hniques  ha ve been  de vel ope d f or  dealingwith dif fe re nt  p rob lemsc aused in  a  co nv ent ional l y know n sea ling  m et h odor bond i ng m etho dor  ina c on venti onal l y k nown ca se wherea s e alin gag ent oradhesive agen tis used.
F or  ex ample, P atent Li terature 1 discloses at echniqu e i n whi ch,in ordertopreven t d i ffusio n of h eat e ne rgy g enera t e dbyacuring rea c t ion  insi de  a c urableresin compositioni n a  complex in w hic h th e cu rab l er esi nc omp o s ition is attach ed onto me ta l  o r the like ,  asu rface o f a hig hly h e at cond uctive me mber such  a s me t a l i s coated w ith a ma terial ha v ing l o wheatcon ductiv it y,a cur able r e sin  comp ositio nlayeris fo rm ed there on and is irradiated wi th ene rgy,and  thus con tin u ous  curing w iththe heat e ner gycan b e c a rried  out .  I t i s  also  dis c losed inP at ent L it erature 1 t h a t , i n tha t c a se, an  ene rgy beam such asa n ultravioletray( U V),  an elec tr on beam (EB),oral a ser or h ea t energy or  the lik eb y con ductio n canbe used . Mo r eover,  for  ex ample, Pa ten tL iteratu re  2 disclo sesan  adhes ive ag e nt c o m position which c ontai n s  a po w der  comp on ent suc h  asa filler a nd can be s tablyappl ied w ithoutco ntaini ngga s bubblese ven in acasewhere a namou ntof the  adh e s ive a gent  c omp osition t o be ap pl i edis s mall.  F urth er, Paten t  Literat ure 2 discl os est h at the co m p osition is  cu red b y heat, anda  mic r oe n c
 11,_1975 to_Graham et al and_U.S. Pat._No._4,505,292 issued_Mar._19, 1985 to_Osterode, respectively.
In addition,_the resilient mounting of_the valve seat_provides_some cushioning action as the valve is closed thereby reducing wear and promoting longer_life_of the_sealing_components._This feature in valves of_this type is recognized in_U.S. Pat._No. 2,840,336 issued June 24, 1958 to Suthann._Conventionally,_as a method_(hereinafter, referred to as “sealing method”) for sealing members_in an electronic component or the_like or as_a_method_(hereinafter, referred to as_“bonding method”) for bonding members together_in an electronic component or the_like, the following methods and the like_are known: that is, (1) a_method in which a one-part_epoxy resin_adhesive agent is applied to_a member and_the adhesive_agent is cured_by heating; (2) a method in_which a two-part_epoxy resin adhesive agent is mixed_and_applied to a_member,_and_is then_cured by being_left_to stand;_(3)_a method in which a UV-curable_adhesive_agent is used; and (4) a method_in which an instant_adhesive_agent is used.
Moreover, various_techniques have been developed for_dealing with different problems caused in_a conventionally_known sealing_method or bonding method or in a conventionally known case where_a sealing agent or adhesive agent_is used.
For example, Patent_Literature 1_discloses_a technique in_which,_in order_to prevent diffusion of heat energy generated_by a_curing reaction inside a curable resin_composition in a complex_in_which the curable resin composition is_attached onto metal or the like,_a surface of a highly_heat_conductive_member such as metal is_coated with a material having low_heat conductivity, a_curable resin composition layer is formed thereon_and_is irradiated with energy, and thus_continuous_curing with the heat energy can_be_carried_out. It is also disclosed_in Patent Literature 1 that, in_that case, an energy beam such as an ultraviolet_ray (UV), an_electron beam (EB), or a_laser_or_heat energy or the like by conduction can be used.
Moreover,_for example,_Patent Literature 2_discloses an adhesive agent composition which contains a powder component_such as a filler and can be_stably applied without containing gas bubbles even in a case where_an amount of the adhesive agent composition to_be applied is small. Further, Patent Literature_2 discloses that the_composition_is cured by heat, and a microenc