 dead point portion by the escape portion on the distal end of the resilient support element providing a non-contacting state with the lower dead point portion of the spherical bump, the problem of damaging the lower-most point of the spherical bump can be solved effectively.
However, the conventional device has such shortcomings that, since the spherical bump is softened because the aging test is usually carried out at a comparatively high temperature or because the aging test is sometimes carried out for a long time, the contacting end of the contact pin, which contacts the spherical bump under pressure, tends to overly pierce into the bump, thereby to leave a grave piecing trace in the bump. As a consequence, merchandise value is badly jeopardized.
The present invention has been accomplished in view of the above problems. It is, therefore, an object of the present invention to provide a contacting structure with respect to a spherical bump, in which an occurrence of damage to a spherical bump can be minimized while ensuring a reliable electrical contact between an IC package and a contact pin of a socket.
To achieve the above object, from one aspect of the present invention, there is essentially provided a contacting structure with respect to a spherical bump in which the spherical bump is to be contacted with a contact pin, the contact pin includes a contacting portion supported by a resilient support element, and the contacting portion is arranged in opposite relation to that part of a spherical surface of the spherical bump other than a lower-most point portion. The contacting portion has a projection capable of biting (or pressing) into the spherical surface of the spherical bump, and also has a pressure receiving surface for setting a biting amount of the projection (i.e. an amount by which the projection can press into the spherical surface).
From another aspect of the present invention, there is also provided contacting structure with respect to a spherical bump in which the spherical bump is to be contacted with a contact pin, the contact pin includes a plurality of contacting portions supported by a resilient support element, and the contacting portions are arranged in opposite relation to that part of a spherical surface of the spherical bump other than a lower-most point portion. The contacting portions each have a projection capable of biting (or pressing) into the spherical surface of the spherical bump, and also has a pressure receiving surface for setting a biting amount of the projection.
The above and other objects and attendant advantages of the present invention will be apparent to those skilled in the art from a reading of the following description and claims in conjunction with the accompanying drawings which constitute part of
dead point portion by the escape parcel on the distal goal of the resilient support element provide a non - contacting state with the lower dead compass point share of the spherical bulge, the problem of damaging the lower - most compass point of the spherical bump can be resolve efficaciously. 
 However, the conventional device has such defect that, since the spherical bulge is soften because the aging test is usually carry out at a comparatively high temperature or because the aging test is sometimes carry out for a long time, the contacting end of the contact peg, which contacts the spherical bump under pressure, tends to excessively pierce into the bulge, thereby to leave a grave piecing trace in the bump. As a consequence, merchandise value is badly jeopardized. 
 The present invention has been accomplished in view of the above problems. It is, consequently, an aim of the present invention to provide a contacting structure with obedience to a spherical bump, in which an occurrence of price to a spherical bump can be minimized while ensuring a dependable electrical contact between an IC package and a contact pin of a socket. 
 To achieve the above aim, from one aspect of the present invention, there is essentially provided a contacting structure with respect to a ball-shaped bulge in which the spherical bump is to be contacted with a contact peg, the contact pin includes a contacting portion supported by a resilient support component, and the contacting portion is arranged in diametric relation to that part of a spherical surface of the ball-shaped bump other than a lower - most item portion. The contacting share has a project capable of bite (or pressing) into the spherical surface of the spherical bump, and besides has a pressure receive surface for setting a biting amount of the projection (i.e. an amount by which the projection can compress into the spherical surface). 
 From another aspect of the present invention, there is also provided contacting social organization with respect to a spherical bump in which the spherical bump is to be contacted with a contact pin, the liaison pin includes a plurality of contacting portions supported by a resilient support element, and the contacting portions are arrange in opposite relation to that part of a spherical surface of the spherical bulge other than a lower - most point portion. The contacting portions each have a protrusion capable of biting (or pressing) into the spherical surface of the spherical bump, and also has a pressure experience surface for setting a biting amount of the projection. 
 The above and other objects and attendant advantage of the present invention will be apparent to those skilled in the art from a reading of the following description and claims in conjunction with the accompanying drawings which constitute part of
 dewd point portion by the tscape portion on the divtal ehd of thd resilient support element 'rovuding a non-contacting state with the lower dwad koint portion of vge sphevncal gmmp, tke problem of dakaging the lower-most poitt oy the spherical bump can be solved esfectivrlj.
However, the cjnvemeionzl device has such shortcomings thzt, sinct the spherical bukp is softened because the agijg test is usually carried ouj at q comparativdly high ttm'erature or because the aging test is somegimes carried ooc fog a long timx, the bontacting end of the contacy pin, which coktactv tye spherical bump undxr pressure, tends to overly phexce into the bump, theeevy to leaee a traxe kierinf tracf ii the bump. Zs a conseqyence, merchandise vsltv is badly jekpardiseq.
The present invention has been accomplpshes in view of the above problems. It is, thereflre, an obtect of the present invention to provide a contacding agruebmre dutj respect to a spherical bump, in which an occtdrtncv of damage to a fpherical bimo vwn be minimizgd whilz ehsuring a reliable electrycal xontact bttweem an IC package and a contaxt pin of a ficket.
To achieve thz above objeet, frok one aspect of the present nnventjon, there id essentizuly provided a cuntscding structure with respece to a spiericcl bump kn wnich tre sphericwl bump is to be contactfd wijh a cmntact pin, the contact pin includes a convecting portiom vupiorted by a rexilient suppowt element, and the coutactivg portion is arrenged in oppjsite relatiot to that parv of a sprerixal wurface uf the sphericsl bump onhtr than a oower-most point povtion. Fhe contacting 'utrion has a prokecgiog bapeble jx biting (or [resrine) into the spherigal surgace of the spherican bujp, and also has a lrcssure rexeiving furface for srtting a biting amlunt mf vhe prpjestion (i.e. an amount by which ths projectlon can press igto bhe fpherical xurface).
From another aspect of the preseit invention, there is aoso provided contacjinn structure xith rqspect to a spherical bump in which the spherigal bump is to be contzcted fith w contact pin, the contact pin includes a plurality of contacting portions suppoctqd by a resjliemt suipoxt zlement, and vhe contacting pogtions are arranged in opposite celation tm chat part of a spherical surfscd of the sphetical bump other than a loser-most loint portion. The contacting pottions each have a projegtion capqble kf bitphg (or pressing) into yhe spkericao surfaxe on the sphericau bimi, and also has a pressure receiving surface for wettint w biting amount mf the projccuion.
The above and other objecfs ahf attgndant advantabes of the prexent invention will te apparent to tykse skilled on thg art from a reeding of the following description and claims in conjunction wijh the accojpanying vrawings which ronstitute part of
dead point portion by the escape portion distal of the support element providing lower point portion of spherical bump, the of damaging the lower-most point of spherical bump can be solved effectively. However, the conventional device has such shortcomings since the spherical bump is softened because the aging test is usually carried at comparatively temperature because the aging test is sometimes carried out for a long time, the contacting end of contact pin, which contacts the spherical bump under tends to overly pierce the bump, thereby to leave grave trace in bump. a merchandise value is jeopardized. The present invention has been accomplished in view of the above problems. It is, therefore, an of the to provide contacting with to a spherical which an occurrence of damage to can be minimized while ensuring a reliable electrical between an package and a contact pin of socket. To achieve the above object, from one of the present invention, there is essentially provided a contacting structure with respect to a in which the spherical is to be with contact the pin includes contacting portion supported by a resilient support element, and the contacting is arranged in opposite relation to that part of a of spherical bump other a lower-most point portion. contacting has a projection capable (or into of spherical and also has a receiving surface for setting a amount of the projection the projection can press into the spherical surface). another aspect of the present invention, there also provided contacting structure with respect to a spherical bump in which spherical bump be contacted with a contact pin, the contact includes a plurality of portions supported by a resilient support element, and the portions arranged in relation to that of a spherical of the spherical than a point The have a projection capable of biting pressing) the spherical surface of the bump, has a pressure receiving surface for setting a biting amount of the projection. The above objects and attendant advantages the invention will be apparent to those skilled in the art from a the following description with accompanying drawings constitute part of
 dead point portion by the escaPe portion oN the dIstAl eNd Of thE resIlient support eLEmenT providing a non-contactiNg staTe WIth tHE lOwer dEad poinT PoRTIon Of ThE spHeRIcAl bumP, thE probleM of damaginG thE lOwer-most poinT Of The sphericAl bUmp can be solvEd eFfectiVeLy.
HOWever, The ConveNtionaL Device Has such shOrTComingS That, sinCE ThE sphErical bump is softeNEd BEcause the aging Test is UsUAlLY CarRieD out at a comPaRativELy high tEMpERATurE Or because the aGing test is sOMetImes caRrIed OUt for a Long tImE, The Contacting eNd of The contacT pin, whICh contaCTs the spHericaL buMp uNder PReSsUre, TeNDs tO OvErlY PieRce into tHe BuMp, theReby TO LEAve a GraVe piEcing Trace in the bumP. As A conSEquEnce, mErchaNdisE vAlue iS badly JeopaRdIzed.
The present iNvenTion has beEn aCcOmpLiShed iN View of The AboVe problEms. It is, THerEfORE, An Object of the present InVENtIon to proVide a cONtAcTIng strucTuRe wIth rESPect tO a spHErIcal bump, In whicH An OcCurrencE oF damagE tO a sPheRical BUmp cAn be miNimized wHile eNSuring a reliablE Electrical conTAcT BEtWEen aN IC Package and a ContACt piN of a SOcKet.
tO achiEve thE aBOvE Object, from one aspect Of The preSent iNvention, there Is essentiaLLY Provided A conTAcTIng structure wiTh resPect to a sphERical bumP in whIch the spHerical buMP Is to be coNtaCteD wiTh a CONtAct pin, the contACT pin InCludes a ConTacting PorTioN suPpoRtEd by a resiLient supPoRt ElEmEnt, And thE ContactiNg PorTiOn iS arraNGed in oPposiTe reLaTiON to That parT Of A SPherIcAl SurfAce Of The spHeriCAl bUmp otheR than a lowEr-mOSt poInT pOrtion. THe contacting pOrTion has a prOjEctIon capABLe of bitiNg (or pressing) into the spheRIcal surFacE of thE sphErical bumP, anD also hAs a PRessurE receiVing sUrFacE FOr setTINg A biTiNg amount of THE prOjectIoN (i.e. aN amount By which the projectiON caN press into the SphEricAL SuRfaCE).
FROm aNoTHer ASPect of the presenT invention, ThERe Is also provIDed CoNtactinG structUre wiTH respecT to a spherIcal bump iN wHich THE spHerical bumP is to be cOntacted wITh a coNTaCt pin, The ContacT pIn iNcludEs a pluRAliTy of cOntactInG portiOns suPpOrted by a Resilient support element, And the ContaCtiNg portionS arE ArrAnged in opPosiTe relation To tHat Part oF a sPHericAl suRFaCe oF The spHeriCAl bump othER tHan A LOwEr-most point PORTioN. The cOntACting pOrtiOns each have a projeCTion capable of bItinG (OR prEssINg) inTo The spherical suRfaCe OF The spherIcAl bump, and alSo has a prEsSUre reCeivinG surfaCe for seTTInG A bitinG amoUnt Of the projEctIoN.
the abovE aNd OTher obJectS aNd atteNdant aDVantAGEs of the present inVentiON Will bE AppArent To Those skILled In the art frOm a reading oF the foLlowIng deScriptiOn And claIms In ConjunctioN With the acCompaNying drAwIngs WhiCh consTituTE Part oF
 dead point portion by the  escape po rtion  on  th edist al e nd of the resi l ient  support element provi dingan on-c o nt actin g state wi t h  th elo wer  d e ad  poin t p ortionof the sph eri ca l bump, thep ro blem of da mag ing the lowe r-m ost po in t o f  thesph erica l bump can be  solved e ff e ctivel y .
Howev e r ,theconventional devi c eh as such shortc omings  t h at , sin cethe spheri ca l bum p  is sof t en e d bec a use the aging  test is us u all y carr ie d o u t at a  comp ar a tiv ely high te mper ature orbecaus e  the ag i ng test  is so met ime s ca r ri ed  ou tf ora  l ong tim e, the c on ta cting  end o f thecon tact  pin,  which contac tsthes phe rical  bump  und er  pres sure,tends  t o overly pierce  int o the bum p,th ere by  to l e ave agra vepiecing  tracei n t he b u mp . As a consequence ,m e rc handisevaluei sba d ly jeopa rd ize d.
T h e  pres enti nv ention h as bee n  a cc omplish ed  in vi ew  of  th e abo v e pr oblems . It is,  ther e fore, an objec t  of the prese n ti n ve n tion  to  provide acont a ctin g st r uc tur e  with  resp ec t  t o  a spherical bump,in  which  an o ccurrence ofdamage toa s pherical  bum p  c a n be minimized  whil e ensuring a reliab le el ectrical  contactb e tween an  IC  pa cka gea n da contact pin o f aso cket.
T o a chievethe  ab ove  ob je ct, fromone aspe ct  o fth e p resen t  inventi on , t he reis es s ential ly pr ovid ed  a con tacting st r u ctur ewi th r esp ec t toa sp h eri cal bum p in whic h t h e sp he ri cal bum p is to be co nt acted with  a  co ntactp i n, the c ontact pin includes a c o ntactin g p ortio n su pported b y a  resil ien t  suppo rt ele ment,  a ndt h e con t a ct ing  p ortion isa r ran ged i noppo site re lation to that par t  of  a sphericalsur face o fthe sp h eri ca l  bu m p  other than a l ower-mostpo i nt  portion.T heco ntactin g porti on ha s  a proj ection ca pable ofbi ting ( orpressing)into the  spherica l  surf a ce  of t hespheri ca l b ump,and al s o h as apressu re  recei vingsu rface fo r setting a biting amou nt ofthe p roj ection (i .e. anamount by  whi ch the pro jec tio n can  pr e ss in to t h esph e rical  sur f ace).
Fro m  a not h e raspect of t h e pre sentinv e ntion,  the re is also provid e d contacting s truc t u rewit h  res pe ct to a spheri cal  b u m p in whi ch  the spheri cal bump  i s  to b e cont actedwith ac o nt a ct pin , th e c ontact pi n i nc l udes apl ur a lity o f co nt acting  porti o ns s u p ported by a resi lient s uppor t  el ement ,and the cont acting por tions are a rrange d in  oppo site re la tion t o t ha t part ofa  spherica l sur face of  t he s phe ricalbump o therthan  a  lo wer-mostp o in t  p or t ion . Th e con ta ctin g portion s  each ha vea  projec ti onc a pableo fb i ting (or p res sing) i nto the sp h eric a ls urfac e of t he sph ericalb ump ,and als o h a s  a pressu re receiv i ngsu rfac e for se tt ingabit in g amount of the  project ion.
The a bove a ndo ther object sand attendan t adv an t ages of t hepresent inv ent ion  wil l b e ap p arent to those skilled i n th e art fro m a r eadin gof the f o llow ing desc r iption and cl aims in conjunc t ion with  th e  a cc ompanying  dr a wings  whi chcons tit utep a rt o f 
 dead_point portion_by the escape portion_on the_distal_end of_the_resilient support element_providing a non-contacting_state with the lower_dead point portion_of_the spherical bump, the problem of damaging the lower-most point of the spherical bump_can_be solved_effectively.
However,_the_conventional device has such shortcomings_that, since the spherical bump_is softened_because the aging test is usually carried out_at_a comparatively high_temperature or because the aging test is sometimes carried_out for a long time, the_contacting end of_the_contact_pin, which contacts the_spherical bump under pressure, tends to_overly pierce into the bump, thereby_to leave a grave piecing trace in_the bump. As a consequence, merchandise_value is badly jeopardized.
The present_invention has_been accomplished in view of_the above problems._It is,_therefore, an object_of the present invention to provide_a contacting structure_with respect to a spherical bump,_in_which an occurrence_of_damage_to a_spherical bump can_be_minimized while_ensuring_a reliable electrical contact between an_IC_package and a contact pin of a_socket.
To achieve the above_object,_from one aspect of_the present invention, there is_essentially provided a contacting structure with_respect to_a spherical_bump in which the spherical bump is to be contacted with_a contact pin, the contact pin_includes a contacting portion_supported by_a_resilient support element,_and_the contacting_portion is arranged in opposite relation to_that part_of a spherical surface of the_spherical bump other than_a_lower-most point portion. The contacting portion_has a projection capable of biting_(or pressing) into the spherical_surface_of_the spherical bump, and also_has a pressure receiving surface for_setting a biting_amount of the projection (i.e. an amount_by_which the projection can press into_the_spherical surface).
From another aspect of the_present_invention,_there is also provided contacting_structure with respect to a spherical_bump in which the spherical bump is to be_contacted with a_contact pin, the contact pin_includes_a_plurality of contacting portions supported by a resilient support element,_and the_contacting portions are_arranged in opposite relation to that part of a spherical_surface of the spherical bump other than_a lower-most point portion. The contacting portions each have a projection_capable of biting (or pressing) into the spherical_surface of the spherical bump, and also_has a pressure receiving_surface_for setting a biting amount of the_projection.
The_above_and_other objects and_attendant advantages of_the present invention_will be_apparent to those_skilled in_the art from_a_reading of the following description and claims in conjunction with the accompanying drawings which constitute part of