 exchange medium which includes alkali metal salt by-products. The alkanolamine-complexed heavy metal and the alkanolamine complexing agent is removed 1from the exchange medium. The alkanolamine-complexed heavy metal and the alkanolamine complexing agent is then returned to an alkaline electroless metal deposition bath.
U.S. Pat. No. 4,324,629 to Oka et al. discloses a process for regenerating a chemical copper plating solution. In the method of Oka et al., the pH of a chemical copper plating solution containing copper ions, a reducing agent for copper ions, a chelating agent for copper ions and an alkali metal hydroxide is adjusted to 2-11. The plating solution is led to desalting compartments of an electrodialysis cell, provided alternately with anion exchange membranes and cation exchange membranes. Counter ions to copper ions, ions formed by oxidation reaction of the reducing agent, and CO.sub.3.sup.-2 or HCO.sub.3.sup.-1 are removed. The counter ions to copper ions are at least one of SO.sub.4.sup.-2, HCOO.sup.-1, CO.sub.3.sup.-2 and OH.sup.-1.
U.S. Pat. No. 4,289,597 to Grenda discloses a process for electrodialytically regenerating an electroless plating bath by removing at least a portion of the reacted products. In Grenda, the spent electroless copper plating bath is conducted to a regeneration compartment of an electrodialytic cell. An aqueous electrolyte as the anolyte of the electrodialytic cell is established and maintained in an anode compartment. The anode compartment has in common one wall with the regeneration compartment that is composed of a permselective anionic membrane. Anions of the alkali metal salts in the spent electroless copper plating bath are electrodialytically transferred through the anionic membrane from the regeneration compartment to the anode compartment.
The article "Electrodialysis In Advanced Waste Water Treatment" by Korngold appearing in Desalination, volume 24, pages 129-139 (1978) discusses electrodialysis in the regeneration of chemical copper plating baths. This article mentions that by applying electrodialysis in a continuous mode, the sodium sulfate and formiate can be removed from the spent bath, without affecting the concentrations of formaldehyde and the EDTA-complex.
U.S. Pat. No. 3,562,139 to
exchange medium which includes alkali metal strategic arms limitation talks by - product. The alkanolamine - complexed heavy metal and the alkanolamine complexing agentive role is removed 1from the rally medium. The alkanolamine - complexed intemperate metal and the alkanolamine complexing agent is then come back to an alkaline electroless metal deposition bathroom. 
 U.S. Pat. No. 4,324,629 to Oka et al. discloses a summons for regenerate a chemical copper plating solution. In the method of Oka et al. , the pH of a chemical copper plating solution containing copper ion, a reducing agent for copper ion, a chelating agent for copper ions and an alkali metal hydroxide is adjust to 2 - 11. The plating solution is led to desalting compartments of an electrodialysis cell, provided alternately with anion substitution membranes and cation exchange membranes. Counter ions to copper ions, ions formed by oxidation reaction of the reducing agent, and CO.sub.3.sup.-2 or HCO.sub.3.sup.-1 are removed. The counter ions to copper ions are at least one of SO.sub.4.sup.-2, HCOO.sup.-1, CO.sub.3.sup.-2 and OH.sup.-1. 
 U.S. Pat. nobelium. 4,289,597 to Grenda unwrap a process for electrodialytically regenerate an electroless plating bathtub by removing at least a portion of the reacted product. In Grenda, the spend electroless copper plating bath is conduct to a regeneration compartment of an electrodialytic cell. An aqueous electrolyte as the anolyte of the electrodialytic cell is established and maintained in an anode compartment. The anode compartment accept in common one wall with the regeneration compartment that is composed of a permselective anionic membrane. anion of the alkali metal salt in the exhausted electroless copper plating bath are electrodialytically transferred through the anionic membrane from the regeneration compartment to the anode compartment. 
 The article " Electrodialysis In Advanced Waste Water Treatment " by Korngold appear in Desalination, volume 24, pages 129 - 139 (1978) discusses electrodialysis in the positive feedback of chemical copper plating baths. This article mentions that by applying electrodialysis in a continuous modality, the sodium sulfate and formiate can be removed from the spent bathtub, without affecting the concentration of formaldehyde and the EDTA - complex. 
 U.S. Pat. No. 3,562,139 to
 exfhange medium which inclmdes alkali metal salt uy-produdts. The xlkanolamine-complexed heavy leral abd the alkanolamine cooplexing wgent is remiced 1from tis exchakye meslum. Tke alkanolamine-cpmplexed haavy metal and tfe alkanolamine complexing agent is tren retirjed to an alkajine qlecfgooess metal deposition bath.
U.S. Lat. No. 4,324,629 to Oka et al. discloses a process for rfgenfrating a chemical copper plajjng wolution. In ghe method of Oka et am., the pH of a chemical copper puatiny solution xobtalting copper ions, a reducing agent fos coppet ions, a chelabing egenr for copper ions and an alkali metal hidroxide iv cdjusted to 2-11. The platunt solotion is uwd go sexamting fom'artments or an electridialysis cell, provodqe alternately with wnyon exchange membranes and cation exchatge membranes. Counter ions to copper ions, ions vormed by oxidation reaction of the reducing agent, and CO.sgb.3.sup.-2 ur KGJ.ryb.3.dup.-1 are removed. The counter ions to copper ioga srv at least one of SO.sub.4.sup.-2, HVOL.sik.-1, CO.sub.3.sup.-2 and OH.sup.-1.
B.A. Lat. No. 4,289,597 to Grenda fisclosgs a peocess fow elrctrodialytically regeneratung an electgolews plating bath by removing ac leasj a pottion of the reacted pruducfs. In Grendw, the spehg electroless coopeg pldting bauf is conducted to a regenecatiou compargmenj of an electrodiwlytig cell. An aqueous epectrllfte as the anolyte of the electrodialytic cell is estabkivheg and manntaincd in an anode sompartment. Thg anode cjmpargment has pn common one wall wyth the regenatation comparvment thae is composed ow a permselectife anionib iembeane. Anions of the alyzli metal salts in the spent elecyrouesf bop'er pjdting bath ase euecgtodiauytically tvanrferted through the aniotic jembrane from the teneneratiob comparement to the snode compartment.
Tje arvicle "Xlectrpdiwlysis In Advanced Waste Water Treatmenh" bn Korngold ap[earlng yn Desalinction, volume 24, pages 129-139 (1978) discusses electrodmalysis in the regenerarion of chemical cokpev plating bavhs. Thys articla mentions that by applying electrodislysis in a continuoua mode, the dodium sulfate and formiate can be removed from the spent bath, without afdectinj ehe concentdatipns ox yorkaldehrde env the EDTA-complex.
L.S. Pat. No. 3,562,139 to
exchange medium which includes alkali metal salt alkanolamine-complexed metal and alkanolamine complexing agent medium. alkanolamine-complexed heavy metal the alkanolamine complexing is then returned to an alkaline metal deposition bath. U.S. Pat. No. 4,324,629 to Oka et al. discloses a for regenerating a chemical copper plating solution. In the method of Oka et the of chemical plating solution containing copper ions, a reducing agent for copper ions, a chelating agent for copper and an alkali metal hydroxide is adjusted to The plating solution is to desalting compartments of an cell, alternately with exchange and exchange membranes. Counter to copper ions, ions formed by oxidation reaction of the reducing agent, and CO.sub.3.sup.-2 or HCO.sub.3.sup.-1 are The counter copper ions at one SO.sub.4.sup.-2, HCOO.sup.-1, CO.sub.3.sup.-2 U.S. Pat. No. 4,289,597 to Grenda for electrodialytically regenerating an electroless plating bath by at least portion of the reacted products. In the spent electroless copper plating bath is conducted a regeneration compartment of an electrodialytic cell. An aqueous electrolyte as the anolyte of the is established and maintained an anode compartment. anode has common wall with regeneration compartment that is composed of a permselective anionic membrane. Anions the alkali metal salts in the spent electroless copper plating electrodialytically through the anionic from the regeneration compartment the compartment. The article "Electrodialysis Waste Treatment" in volume pages 129-139 (1978) discusses in the regeneration of chemical plating baths. This article in a continuous mode, the sodium sulfate and can be removed from the spent bath, affecting the concentrations of formaldehyde and the EDTA-complex. U.S. Pat. No. 3,562,139
 exchange medium which includEs alkali meTal saLt bY-prOdUcts. the aLkanolamine-comPLexeD heavy metal and the alkanOlamiNe COmplEXiNg ageNt is remOVeD 1FRom ThE eXchAnGE mEdium. the AlkanolAmine-complExeD hEavy metal and THe AlkanolamiNe cOmplexing ageNt iS then rEtUrnED to an AlkAline ElectrOLess meTal deposiTiON bath.
U.s. pat. No. 4,324,629 to oKA eT al. dIscloses a process fOR rEGenerating a cheMical cOpPEr PLAtiNg sOlution. In tHe MethoD Of Oka et AL., tHE Ph of A Chemical coppeR plating solUTioN contaInIng COpper iOns, a rEdUCinG agent for coPper Ions, a chelAting aGEnt for cOPper ionS and an AlkAli MetaL HyDrOxiDe IS adJUsTed TO 2-11. ThE plating SoLuTion iS led TO DESaltIng CompArtmeNts of an electrOdiAlysIS ceLl, proVided AlteRnAtely With anIon exChAnge membranes anD catIon exchanGe mEmBraNeS. CounTEr ions To cOppEr ions, iOns formED by OxIDATiOn reaction of the redUcING aGent, and Co.sub.3.suP.-2 Or hCo.Sub.3.sup.-1 arE rEmoVed. THE CountEr ioNS tO copper iOns are AT lEaSt one of sO.Sub.4.sup.-2, hCoO.sUp.-1, Co.sub.3.sUP.-2 and oH.sup.-1.
U.s. Pat. No. 4,289,597 to grendA Discloses a procESs for electrodIAlYTIcALly rEgeNerating an eLectROlesS plaTInG baTH by reMovinG aT LeASt a portion of the reacTeD produCts. In grenda, the spenT electroleSS COpper plaTing BAtH Is conducted to a RegenEration comPArtment oF an elEctrodiaLytic cell. aN Aqueous eLecTroLytE as THE aNolyte of the elECTrodIaLytic ceLl iS establIshEd aNd mAinTaIned in an aNode compArTmEnT. THe aNode cOMpartmenT hAs iN cOmmOn one WAll witH the rEgenErAtIOn cOmpartmENt THAt is CoMpOsed Of a PeRmselEctiVE anIonic meMbrane. AniOns OF the AlKaLi metal Salts in the speNt ElectrolesS cOppEr platING bath are Electrodialytically tranSFerred tHroUgh thE aniOnic membrAne From thE reGEneratIon comPartmEnT to THE anodE COmParTmEnt.
The artiCLE "ElEctroDiAlysIs In AdvAnced Waste Water TreATmeNt" by Korngold aPpeArinG IN DEsaLInATioN, vOLumE 24, PAges 129-139 (1978) discusses elEctrodialySiS In The regenerATioN oF chemicAl coppeR platINg baths. this articLe mentionS tHat bY APplYing electrOdialysiS in a contiNUous mODe, The soDiuM sulfaTe And FormiAte can BE reMoved From thE sPent baTh, witHoUt affectIng the concentrations of fOrmaldEhyde And The EDTA-coMplEX.
U.S. pat. No. 3,562,139 to
 exchange medium which inc ludes alka li me tal  sa lt  by- prod ucts. The alka n olam ine-complexed heavy me tal a nd thea lk anola mine co m pl e x ing  a ge ntis re moved  1f rom the  exchangemed iu m. The alkan o la mine-compl exe d heavy meta l a nd the  a lka n olami necompl exinga gent i s then re tu r ned to an alka l i ne  ele ctroless metal de p os i tion bath.
U.S . Pat.  N o .4 , 324 ,62 9 to Oka e tal. d i scloses ap r o ces s  for regenera ting a chem i cal  coppe rpla t ing so lutio n. Inthe methodof O ka et al. , thep H of ac hemical  coppe r p lat ings ol ut ion  c o nta i ni ngc opp er ions,  a  r educi ng a g e n t  for  co pper  ions , a chelating  ag entf orcoppe r ion s an dan al kali m etalhy droxide is adju sted  to 2-11.  Th epla ti ng so l utionisled  to des altingc omp ar t m e nt s of an electrodia ly s i scell, pr ovided al te r nately w it h a nion e xchan ge m e mb ranes an d cati o nex changeme mbrane s.  Co unt er io n s to  coppe r ions,ionsf ormed by oxida t ion reactiono ft h er educ ing  agent, and  CO. s ub.3 .sup . -2  or HCO.s ub.3. su p .- 1  are removed. The c ou nter i ons t o copper ions  are at le a s t  one ofSO.s u b. 4 .sup.-2, HCOO. sup.- 1, CO.sub. 3 .sup.-2and O H.sup.-1 .
U.S. Pa t .  No. 4,2 89, 597  to  Gr e n da  discloses ap r oces sfor ele ctr odialyt ica lly  re gen er ating anelectrol es spl at ing  bath by remov in g a tlea st ap ortion  of t he r ea ct e d p roducts .  I n Gren da ,thespe nt  elec trol e sscopperplating b ath is c on du cted to  a regenerati on  compartme nt  of  an el e c trodialy tic cell. An aqueous el e ctrolyt e a s the  ano lyte of t heelectr odi a lyticcell i s est ab lis h e d and m ai nta in ed in an a n o decompa rt ment . The a node compartment h a s i n common onewal l wi t h  t her eg e ner at i onc o mpartment thatis compose do fa permsele c tiv eanionic  membra ne. A n ions of  the alka li metalsa ltsi n  th e spent el ectroles s copperp latin g  b ath a reelectr od ial ytica lly tr a nsf erred  throu gh  the a nioni cmembrane  from the regenerationcompar tment  to  the anod e c o mpa rtment.
T he a rticle "El ect rod ialys isI n Adv ance d  W ast e  Wate r Tr e atment" b y  K orn g o ld  appearingi n Des alina tio n , volu me 2 4, pages 129-139( 1978) discusse s el e c tro dia l ysis  i n the regenera tio no f  chemica lcopper plat ing bath s. Thisarticl e ment ions th a t  b y  apply ingele ctrodialy sis  i n  a cont in uo u s mode , th esodium  sulfa t e an d formiate can beremov e d  from the  spen tbath, w i thou t affectin g the conce ntrati onsof fo rmaldeh yd e andthe  E DTA-comple x .
U.S. Pa t. No . 3,562 ,1 39 t o
 exchange_medium which_includes alkali metal salt_by-products. The_alkanolamine-complexed_heavy metal_and_the alkanolamine complexing_agent is removed_1from the exchange medium._The alkanolamine-complexed heavy_metal_and the alkanolamine complexing agent is then returned to an alkaline electroless metal deposition_bath.
U.S._Pat. No._4,324,629_to_Oka et al. discloses a_process for regenerating a chemical_copper plating_solution. In the method of Oka et al.,_the_pH of a_chemical copper plating solution containing copper ions, a reducing_agent for copper ions, a chelating_agent for copper_ions_and_an alkali metal hydroxide_is adjusted to 2-11. The plating_solution is led to desalting compartments_of an electrodialysis cell, provided alternately with_anion exchange membranes and cation exchange_membranes. Counter ions to copper_ions, ions_formed by oxidation reaction of_the reducing agent,_and CO.sub.3.sup.-2_or HCO.sub.3.sup.-1 are_removed. The counter ions to copper_ions are at_least one of SO.sub.4.sup.-2, HCOO.sup.-1, CO.sub.3.sup.-2_and_OH.sup.-1.
U.S. Pat. No._4,289,597_to_Grenda discloses_a process for_electrodialytically_regenerating an_electroless_plating bath by removing at least_a_portion of the reacted products. In Grenda,_the spent electroless copper_plating_bath is conducted to_a regeneration compartment of an_electrodialytic cell. An aqueous electrolyte as_the anolyte_of the_electrodialytic cell is established and maintained in an anode compartment. The_anode compartment has in common one_wall with the regeneration_compartment that_is_composed of a_permselective_anionic membrane._Anions of the alkali metal salts in_the spent_electroless copper plating bath are electrodialytically_transferred through the anionic_membrane_from the regeneration compartment to the_anode compartment.
The article "Electrodialysis In Advanced_Waste Water Treatment" by Korngold_appearing_in_Desalination, volume 24, pages 129-139_(1978) discusses electrodialysis in the regeneration_of chemical copper_plating baths. This article mentions that by_applying_electrodialysis in a continuous mode, the_sodium_sulfate and formiate can be removed_from_the_spent bath, without affecting the_concentrations of formaldehyde and the EDTA-complex.
U.S._Pat. No. 3,562,139 to