 and the like. Most of these manufacturing techniques are relatively expensive to implement and require high production quantities to amortize the cost of the fabrication equipment.
Techniques for forming microstructures on a substrate include screen printing. During screen printing, a fine mesh screen is positioned on the substrate. Fluid material is microdeposited through the screen and onto the substrate in a pattern defined by the screen. Screen printing requires contact between the screen and the substrate. Contact also occurs between the screen and the fluid material, which contaminates both the substrate and the fluid material.
Photolithography is another manufacturing technique that is used to manufacture microstructures on substrates. Photolithography is also not compatible with the fabrication of some devices. Manufacturing processes using photolithography generally involve the deposition of a photoresist material onto a substrate. The photoresist material is cured by exposure to light. A patterned mask is used to selectively apply light to the photo resist material. Photoresist that is exposed to the light is cured and unexposed portions are not cured. The uncured portions are removed from the substrate. An underlying surface of the substrate is exposed through the removed photoresist layer. The cured portions of the photo resist layer remain on the substrate. Another material is then microdeposited onto the substrate through the opened pattern on the photoresist layer, followed by the removal of the cured portion of the photoresist layer.
Photolithography has been used successfully to manufacture many microstructures such as traces on circuit boards. However, photolithography contaminates the substrate and the material formed on the substrate. The cost of the photolithography process can be prohibitive when relatively small quantities are to be fabricated.
Spin coating has also been used to form microstructures. Spin coating involves rotating a substrate while depositing fluid material at the center of the substrate. The rotational motion of the substrate causes the fluid material to spread uniformly across the surface of the substrate. Spin coating is also an expensive process because a majority of the fluid material does not remain on the substrate. Additional material is wasted due to the requirement that the entire surface of the substrate must be coated with a uniform layer. While laser ablation can be used to remove material, laser ablation requires expensive equipment. Laser ablation may also create ash, which contaminates the substrate. In addition, the size of the substrate is limited by the spin coating process to less than approximately 12″, which makes spin coating unsuitable for larger devices such as PLED televisions. This invention relates to processes for producing a 7-isoindoline-quinol
and the like. Most of these manufacturing techniques are relatively expensive to implement and command eminent production quantities to amortize the cost of the lying equipment. 
 Techniques for forming microstructures on a substrate include blind printing. During screen impression, a all right mesh screen is put on the substrate. Fluid material is microdeposited through the screen and onto the substrate in a radiation pattern defined by the screen. Screen printing requires liaison between the screen and the substrate. Contact also occur between the screen and the fluid fabric, which contaminates both the substrate and the fluent material. 
 Photolithography is another manufacturing technique that is used to manufacture microstructures on substrates. Photolithography is besides not compatible with the fabrication of some devices. Manufacturing processes using photolithography generally imply the deposition of a photoresist material onto a substrate. The photoresist material is cured by exposure to light. A patterned mask is used to selectively apply light to the photograph resist fabric. Photoresist that is exposed to the light is cured and unexposed parcel are not cured. The uncured portions are removed from the substrate. An implicit in surface of the substrate is exposed through the removed photoresist layer. The corned portions of the photo resist layer remain on the substrate. Another material is then microdeposited onto the substrate through the opened traffic pattern on the photoresist layer, followed by the removal of the cured portion of the photoresist level. 
 Photolithography has been used successfully to fabricate many microstructures such as traces on circuit boards. However, photolithography contaminates the substrate and the material formed on the substrate. The monetary value of the photolithography process can be prohibitive when relatively small quantities are to be manufacture. 
 Spin coating has also been used to form microstructures. tailspin coating involves rotating a substrate while depositing fluid fabric at the center of the substrate. The rotational motion of the substrate causes the fluid fabric to spread uniformly across the surface of the substrate. tailspin coating is also an expensive process because a majority of the fluid material does not stay on the substrate. Additional fabric is wasted due to the requirement that the entire surface of the substrate must be coat with a uniform layer. While laser ablation can be used to murder material, laser ablation requires expensive equipment. Laser ablation may besides create ash, which contaminates the substrate. In addition, the size of the substrate is limited by the spin coating process to less than approximately 12″, which makes spin coating unsuitable for bigger device such as PLED television. This invention relates to processes for producing a 7 - isoindoline - quinol
 anf the like. Most of these manufacturing jexhniquxs are delativeuy expensive to implement anv rewuire high production quantkties to wmortize the xost of thx fabrication seuipkxnt.
Techniques fpr forming microstructuras ou a substrate include screen printind. Durinb dcreen printind, a gyne jvsm screen is positioned on the sugstrate. Fluid materisl is microdeposited throuhh tje screen and onto the substrqte yb a pattern aefined by the screen. Acreen printing requires contacg betceen the sctzwn wtd the subsvrate. Bontact also occurs batween yhe screen and thx flyid material, which coitaminates both the fubstrate aud the fluid material.
Phitolijhogrdphy us xnouhec mznufachurmng techniqhe that is ysed to manufacture mybtostructures on sufserates. Photolithography is also not comkatibme with the fabrication of some devices. Manuvacturing processes using photolithography generally involee thx aepisltiov ov a photoresist material onto a substrate. The lhptpresist matericl is cured by ecplsite to light. A katternzs jask is used to sepectivejy apply light to yhe photo resist material. Pyotoresist tkat is exposed to the light is cbred amd unrxposed portions are noc cures. The uncurfd portiohr are removed frum nhe vubstratt. An underlying suwface of vhe sbbstrate is gxposed through tje removed photoresist lwyer. Jhe cused portiojs of the photo resist layer remain on the sunsdrane. Anothex matevial is then misrodeposited outo the fubstfate throufh the mpened pattqrn on the phmjoresist layec, followeq by the removau of the cured lortion oy the photoresist layer.
Ihotoujthography has yten used successfukly to mwnnfacttse many micrmstrjctjtes sjch as uxaccs un corcuit boards. Howeves, phktolithography conyaiinates jhe substwate and the katerial formed on the vubrtratr. Tre cost of the photolithographg process cak be prohibityve qhen relativzly small quantities are to be fabricatev.
Spin coating has also veen used to form mncvostructures. Spin coating hnvolves rotating a wubstrate while dtpositing fluid materiam at tve cejter of the substrate. The rotational motion of the substrate causes the fouid metqrial to spdead unifmriky acrjss vhx surface of the xubstrate. Spin coating is also en expensiee process because a majority pf the fluid majerial does not remain on fhe subsyrate. Additional material is waxted due to the requiremcnt that rhe ehtire surfece of the substrate must ye coared wity a mniform layer. Dhike laser abpatipn can be used to remove material, oaser qbpation requires xxpensive eqmikment. Lzser aflation may also crezhe asf, which contakinates the sunstrate. In addition, nhe size of the sygstrate is lomited ty the spin roating procass to less than approximately 12″, which makes spin cozting unshitable nor larger devicex such as PLED televisipnf. This ivvention reldtes to processes for producing a 7-isoindoliig-quinou
and the like. Most of these manufacturing relatively to implement require high production of fabrication equipment. Techniques forming microstructures on substrate include screen printing. During screen a fine mesh screen is positioned on the substrate. Fluid material is microdeposited the screen and onto the substrate in a pattern defined by the screen. printing contact the and the substrate. Contact also occurs between the screen and the fluid material, which contaminates both substrate and the fluid material. Photolithography is another technique that is used manufacture microstructures on substrates. Photolithography also compatible with fabrication some Manufacturing processes using generally involve the deposition of a photoresist material onto a substrate. The photoresist material is cured by to light. mask is to apply to the photo Photoresist that is exposed to the and unexposed portions are not cured. The uncured are removed the substrate. An underlying surface of substrate is exposed through the removed photoresist layer. cured portions of the photo resist layer remain on the substrate. Another material is then the substrate through the pattern on the layer, by removal the cured of the photoresist layer. Photolithography has been used successfully to manufacture microstructures such as traces on circuit boards. However, photolithography contaminates and material formed on substrate. The cost of photolithography can be prohibitive when quantities to coating also used to form microstructures. coating involves rotating a substrate depositing fluid material at The rotational motion of the substrate causes the material to spread uniformly across the surface the substrate. Spin coating is also an expensive process because a majority the fluid not remain on the substrate. Additional material is due to the requirement the entire surface of the substrate must be coated a layer. While ablation can be to remove material, ablation requires expensive ablation may create which In addition, the size of the is by the spin coating process less 12″, which makes spin coating unsuitable for larger devices such as PLED televisions. This invention processes for producing a
 and the like. Most of these manuFacturing tEchniQueS arE rElatIvelY expensive to imPLemeNt and require high producTion qUaNTitiES tO amorTize the COsT OF thE fAbRicAtIOn EquipMenT.
TechniQues for forMinG mIcrostructurES oN a substratE inClude screen pRinTing. DuRiNg sCReen pRinTing, a Fine meSH screeN is positiOnED on the SUbstratE. fLuId maTerial is microdepoSItED through the scrEen and OnTO tHE SubStrAte in a pattErN defiNEd by the SCrEEN. scrEEn printing reqUires contacT BetWeen thE sCreEN and thE subsTrATe. COntact also oCcurS between tHe screEN and the FLuid matErial, wHicH coNtamINaTeS boTh THe sUBsTraTE anD the fluiD mAtErial.
photOLITHogrAphY is aNotheR manufacturinG teChniQUe tHat is Used tO manUfActurE microStrucTuRes on substrates. photOlithograPhy Is AlsO nOt comPAtible WitH thE fabricAtion of SOme DeVICEs. manufacturing proceSsES UsIng photoLithogRApHy GEnerally InVolVe thE DEposiTion OF a PhotoresIst matERiAl Onto a suBsTrate. THe PhoTorEsist MAterIal is cUred by exPosurE To light. A patterNEd mask is used tO SeLECtIVely AppLy light to thE phoTO resIst mATeRiaL. photoResisT tHAt IS exposed to the light iS cUred anD unexPosed portions Are not cureD. tHE uncured PortIOnS Are removed from The suBstrate. An uNDerlying SurfaCe of the sUbstrate iS EXposed thRouGh tHe rEmoVED pHotoresist layER. the cUrEd portiOns Of the phOto ResIst LayEr Remain on tHe substrAtE. ANoThEr mAteriAL is then mIcRodEpOsiTed onTO the suBstraTe thRoUgH The Opened pATtERN on tHe PhOtorEsiSt Layer, FollOWed By the reMoval of thE cuREd poRtIoN of the pHotoresist layEr.
photolithoGrAphY has beEN Used succEssfully to manufacture maNY microsTruCtureS sucH as traces On cIrcuit BoaRDs. HoweVer, phoTolitHoGraPHY contAMInAteS tHe substratE ANd tHe matErIal fOrmed on The substrate. The cosT Of tHe photolithogRapHy prOCEsS caN Be PRohIbITivE WHen relatively smAll quantitIeS ArE to be fabriCAteD.
SPin coatIng has aLso beEN used to Form microStructureS. SPin cOATinG involves rOtating a Substrate WHile dEPoSitinG flUid matErIal At the Center OF thE subsTrate. THe RotatiOnal mOtIon of the Substrate causes the fluid MateriAl to sPreAd uniformLy aCRosS the surfaCe of The substraTe. SPin CoatiNg iS Also aN expENsIve PRocesS becAUse a majorITy Of tHE FlUid material DOES noT remaIn oN The subStraTe. Additional materIAl is wasted due tO the REQuiRemENt thAt The entire surfaCe oF tHE SubstratE mUst be coated With a uniFoRM layeR. While Laser aBlation CAN bE Used to RemoVe mAterial, laSer AbLAtion reQuIrES expenSive EqUipmenT. Laser ABlatION may also create asH, whicH COntamINatEs the SuBstrate. iN addItion, the siZe of the subsTrate iS limIted bY the spiN cOating ProCeSs to less thAN approximAtely 12″, Which maKeS spiN coAting uNsuiTABle foR larGeR deVices such AS pLed tElEVisIons. this iNvEntiOn relates TO processEs fOR producInG a 7-iSOIndoliNE-qUINol
 and the like. Most of the se manufac turin g t ech ni ques  are  relatively ex p ensi ve to implement and re quire  h i gh p r od uctio n quant i ti e s  to  a mo rti ze th e cos t o f the f abrication  eq ui pment.
Techn i qu es for for min g microstruc tur es onasub s trate  in clude  scree n  print ing. Duri ng screen printin g ,  a  fin e mesh screen isp os i tioned on thesubstr at e .F l uid  ma terial ismi crode p ositedt hr o u g h t h e screen andonto the su b str ate in  a  pa t tern d efine db y t he screen.Scre en printi ng req u ires co n tact be tweenthe  sc reen an dthe  s u bst r at e.C ont act also  o cc urs b etwe e n t he s cre en a nd th e fluid mater ial , wh i chconta minat es b ot h the  subst ratean d the fluid mat eria l.
Photol ith og rap hy  is a n otherman ufa cturing  techni q ueth a t is  used to manufactu re m ic rostruct ures o n  s ub s trates.Ph oto lith o g raphy  isa ls o not co mpatib l ewi th thefa bricat io n o f s ome d e vice s. Man ufacturi ng pr o cesses using p h otolithograph y  g e n er a llyinv olve the de posi t ionof a ph oto r esist  mate ri a lo nto a substrate. Th ephotor esist  material iscured by e x p o sure toligh t .A  patterned mas k isused to se l ectively  appl y lightto the ph o t o resist  ma ter ial . P h o to resist that i s expo se d to th e l ight is  cu red  an d u ne xposed po rtions a re  n ot  c ure d. Th e  uncured  p ort io nsare r e movedfromthesu bs t rat e. An u n de r l ying  s ur face  of  t he su bstr a teis expo sed throu ght he r em ov ed phot oresist layer .The curedpo rti ons of t he photo  resist layer remain on the sub str ate.Anot her mater ial  is th enm icrode posite d ont othe s ubstr a t ethr ou gh the ope n e d p atter non t he phot oresist layer, fol l owe d by the remo val  oft h ecur e dp ort io n  of t he photoresistlayer.
Pho to l it hography h a s b ee n usedsuccess fully to manu facture m any micro st ruct u r essuch as tr aces oncircuit b o ards. Ho wever , p hotoli th ogr aphycontam i nat es th e subs tr ate an d the  m aterialformed on the substrate . Thecostofthe photo lit h ogr aphy proc esscan be pro hib iti ve wh enr elati vely sm all quant itie s  are to b e  f abr i c at ed.
Spin co a t i nghas a lso been u sedto form microstru c tures. Spin co atin g inv olv e s ro ta ting a substra tewh i l e deposi ti ng fluid ma terial a tt he ce nter o f thesubstra t e .T he rot atio nal  motion o f t he substra te  c a uses t he f lu id mat erialt o sp r e ad uniformly acr oss t h e  surf a ceof th esubstra t e. S pin coatin g is also a n expe nsiv e pro cess be ca use amaj or ity of the fluid mat erial  does n ot  rem ain  on th e su b s trate . Ad di tio nal mater i a li swa s ted  due  to t he  req uirementt hat theent i re surf ac e o f the su b st r a te must be  co atedw i th a unifo r m la y er .  Whil e lase r abla tion ca n  be  u sed torem o v e materia l, lasera bla ti on r equiresex pens iv e e qu ipment. Laser a blationmay also c reateash ,  whi c h cont am inates the s ubstr at e . In ad d i tio n, thes ize  of  th e su bst rate is limited by the spin c oati ng pr o ces s tolessth an appro x imat ely 12″, which makes s pin coating uns u ita b le f orl ar ge r devices  su c h asPLED  te levi sio ns.T h is i n vent i on  rel ates t o pr oc es ses for p ro ducinga  7-i s oin doli ne-qu in ol 
 and_the like._Most of these manufacturing_techniques are_relatively_expensive to_implement_and require high_production quantities to_amortize the cost of_the fabrication equipment.
Techniques_for_forming microstructures on a substrate include screen printing. During screen printing, a fine mesh_screen_is positioned_on_the_substrate. Fluid material is microdeposited_through the screen and onto_the substrate_in a pattern defined by the screen. Screen_printing_requires contact between_the screen and the substrate. Contact also occurs between_the screen and the fluid material,_which contaminates both_the_substrate_and the fluid material.
Photolithography_is another manufacturing technique that is_used to manufacture microstructures on substrates._Photolithography is also not compatible with the_fabrication of some devices. Manufacturing processes_using photolithography generally involve the_deposition of_a photoresist material onto a_substrate. The photoresist_material is_cured by exposure_to light. A patterned mask is_used to selectively_apply light to the photo resist_material._Photoresist that is_exposed_to_the light_is cured and_unexposed_portions are_not_cured. The uncured portions are removed_from_the substrate. An underlying surface of the_substrate is exposed through_the_removed photoresist layer. The_cured portions of the photo_resist layer remain on the substrate._Another material_is then_microdeposited onto the substrate through the opened pattern on the photoresist_layer, followed by the removal of_the cured portion of_the photoresist_layer.
Photolithography_has been used_successfully_to manufacture_many microstructures such as traces on circuit_boards. However,_photolithography contaminates the substrate and the_material formed on the_substrate._The cost of the photolithography process_can be prohibitive when relatively small_quantities are to be fabricated.
Spin_coating_has_also been used to form_microstructures. Spin coating involves rotating a_substrate while depositing_fluid material at the center of the_substrate._The rotational motion of the substrate_causes_the fluid material to spread uniformly_across_the_surface of the substrate. Spin_coating is also an expensive process_because a majority of the fluid material does not_remain on the_substrate. Additional material is wasted_due_to_the requirement that the entire surface of the substrate must_be coated_with a uniform_layer. While laser ablation can be used to remove material,_laser ablation requires expensive equipment. Laser ablation_may also create ash, which contaminates the substrate. In addition, the_size of the substrate is limited by the_spin coating process to less than approximately_12″, which makes spin_coating_unsuitable for larger devices such as PLED_televisions._This_invention_relates to processes_for producing a_7-isoindoline-quinol