 the projection beam scans the patterning device. More information with regard to lithographic devices as described herein can be gleaned, for example, from U.S. Pat. No. 6,046,792, incorporated herein by reference.
The lithographic apparatus may be of a type having two or more tables (e.g., two or more substrate table, a substrate table and a measurement table, two or more patterning device tables, etc.). In such “multiple stage” devices the additional tables may be used in parallel, or preparatory steps may be carried out on one or more tables while one or more other tables are being used for exposures. Twin stage lithographic apparatuses are described, for example, in U.S. Pat. No. 5,969,441, incorporated herein by reference.
Prior to transferring the circuit pattern from the patterning device to the substrate, the substrate may undergo various procedures, such as priming, resist coating and a soft bake. After exposure, the substrate may be subjected to other procedures, such as a post-exposure bake (PEB), development, a hard bake and measurement/inspection of the transferred circuit pattern. This array of procedures is used as a basis to make an individual layer of a device, e.g., an IC. The substrate may then undergo various processes such as etching, ion-implantation (doping), metallization, oxidation, chemo-mechanical polishing, etc., all intended to finish off the individual layer of the device. If several layers are required in the device, then the whole procedure, or a variant thereof, is repeated for each layer. Eventually, a device will be present in each target portion on the substrate. These devices are then separated from one another by a technique such as dicing or sawing, whence the individual devices can be mounted on a carrier, connected to pins, etc.
As noted, lithography is a central step in the manufacturing of ICs, where patterns formed on substrates define functional elements of the ICs, such as microprocessors, memory chips etc. Similar lithographic techniques are also used in the formation of flat panel displays, micro-electro mechanical systems (MEMS) and other devices. One common phenomenon which continues to plague grain farmers relates to the infestation of whole grain seeds with a disease such as, for example, Fusarium. This in turn causes a small percentage of grain kernels to contain a high level of a mycotoxin that is inhomogeneously distributed within random samples of the grain.
De
the projection beam scans the patterning device. More information with gaze to lithographic device as described herein can be gleaned, for example, from U.S. Pat. nobelium. 6,046,792, incorporated herein by reference. 
 The lithographic apparatus may be of a type have two or more tables (e.g., two or more substrate table, a substrate table and a measurement table, two or more pattern device tables, etc .). In such “ multiple stage ” devices the extra tables may be used in parallel, or preparatory steps may be carried out on one or more tables while one or more other table are being used for exposures. Twin stagecoach lithographic apparatuses are described, for example, in U.S. Pat. nobelium. 5,969,441, incorporated herein by reference book. 
 Prior to transferring the circuit pattern from the model device to the substrate, the substrate may undergo various procedures, such as priming, resist coating and a soft bake. After exposure, the substrate may be subjected to other procedures, such as a post - exposure bake (PEB), development, a hard bake and measurement / inspection of the transferred circuit pattern. This array of procedures is used as a basis to do an individual layer of a device, e.g., an IC. The substrate may then undergo diverse processes such as etching, ion - implantation (doping), metallization, oxidation, chemo - mechanical polishing, etc. , all mean to finish off the individual layer of the device. If several layers are command in the device, then the whole procedure, or a variant thereof, is repeated for each layer. finally, a device will be present in each target portion on the substrate. These devices are then separated from one another by a technique such as dicing or sawing, whence the individual devices can be hop on on a carrier, connected to pins, etc. 
 As noted, lithography is a central dance step in the manufacturing of ICs, where patterns form on substrates define functional elements of the intelligence community, such as microprocessors, memory chips etc. Similar lithographic techniques are also use in the formation of categoric panel display, micro - electro mechanical systems (MEMS) and early devices. One common phenomenon which continues to harass grain farmer relates to the infestation of hale grain seeds with a disease such as, for example, Fusarium. This in turn causes a minor percentage of grain kernel to contain a high level of a mycotoxin that is inhomogeneously distributed within random samples of the grain. 
 De
 thf projection beam scans uhe patterning deruce. Moce infodmation dith regard to lithographic vevixes aw described herein can be gleanvd, for exqmplt, from U.S. Pat. No. 6,046,792, incorpovcted gcrein uy reference.
The lithograpvic apparatus kah ye of a type having two or more tablqs (e.g., teo or more substtate uabje, a substrate table and a measurement table, uwo or more patterming device tables, etc.). In duch “multiple stage” degices the aedityinal tables oay be used in parallem, or preparatory steps may be cxrrieb out on ong kr kore tables whilv one or more other tdbles ate being used nor eeposyres. Twin stage lithojraphic apparatuses wre descrhbzd, for example, in U.S. Par. No. 5,969,441, incmrpofqtea htremn gy reffreice.
Prior to transferribg the circuit patttrn drom the pattsrning dqvice to the substrate, the substrate maj unsergo various procedurew, such as priming, reslst coatigg and a soft bake. After exposure, the substrate mdy be rublcgted ro other procedures, such as a post-exposure bake (LEN), cevelopment, a mard bake and measirfmrgt/inspection uf the trznsferred circuit oattern. This array of provedures is used as a basis ro make an iudicidual layer of a bevice, e.g., an IC. Jhe sunstrate may then undergu vadious procedses such xs etching, ion-imolaktadion (doping), metallization, jxidation, cheko-mechavicak polifhing, etc., wll ikdended to finish ovf thg indieidual layfr of the device. If several layxcs are requirgd hn nhe devicz, then the whole prjcedure, or a vcriant tkereof, is repeatvd for earh layer. Evegtually, a devhfe will be pcesent in eacy taeget pofgion on the sunstrate. Tktse devicew are then separatcd fruj one another bv q technique sucn ar dycpng ow sawing, whenwe tfe kmdiviaual devicew can be mounted on a carsier, connected to pins, ebc.
As notee, lithogwaphy is a cemtral step in the lanufecturiig of OCs, where patterns formed on subsfrates devinc functional qlemcnts of the ICx, such as microprocessors, memory chips xtc. Similar lithographix techniques are alxp used in tie foriation of flat panel displays, micro-electro mecmanical systems (MEMS) ahd othar degices. One common phenomenon which continues to plague grain farmers relatws to vhq infestatikn og whone yrain sqeds xith a disease subh as, for example, Fusarium. This mn turn cagszs a small percentage of graim yernels to covtain a high level of a jycotoxim that is inhomogeneously distrobuted within random samiles of tye grzin.
De
the projection beam scans the patterning device. with to lithographic as described herein from Pat. No. 6,046,792, herein by reference. lithographic apparatus may be of a having two or more tables (e.g., two or more substrate table, a substrate and a measurement table, two or more patterning device tables, etc.). In such stage” the tables be used in parallel, or preparatory steps may be carried out on one or more tables one or more other tables are being used exposures. Twin stage lithographic are described, for example, in Pat. 5,969,441, incorporated by Prior transferring the circuit from the patterning device to the substrate, the substrate may undergo various procedures, such as priming, resist and a After exposure, substrate be to other procedures, a post-exposure bake (PEB), development, a measurement/inspection of the transferred circuit pattern. This array procedures is as a basis to make an layer of a device, e.g., an IC. The may then undergo various processes such as etching, ion-implantation (doping), metallization, oxidation, chemo-mechanical polishing, etc., to finish off the layer of the If layers required the device, the whole procedure, or a variant thereof, is repeated for each Eventually, a device will be present in each target portion substrate. devices are then from one another by technique as dicing or sawing, individual can a connected pins, etc. As noted, is a central step in manufacturing of ICs, where functional elements of the ICs, such as microprocessors, chips etc. Similar lithographic techniques are also in the formation of flat panel displays, micro-electro mechanical systems (MEMS) and devices. One which continues to plague grain farmers relates to infestation of whole grain with a disease such as, for example, Fusarium. This turn a small of grain kernels contain a high of a mycotoxin inhomogeneously distributed random of
 the projection beam scans the Patterning DevicE. MoRe iNfOrmaTion With regard to liTHogrAphic devices as describeD hereIn CAn be GLeAned, fOr exampLE, fROM U.S. paT. NO. 6,046,792, inCoRPoRated HerEin by reFerence.
The LitHoGraphic apparATuS may be of a tYpe Having two or mOre Tables (E.g., Two OR more SubStratE table, A SubstrAte table aNd A MeasurEMent tabLE, TwO or mOre patterning deviCE tABles, etc.). In such “mUltiplE sTAgE” DEviCes The additioNaL tablES may be uSEd IN PAraLLel, or preparatOry steps may BE caRried oUt On oNE or morE tablEs WHilE one or more oTher Tables are Being uSEd for exPOsures. TWin staGe lIthOgraPHiC aPpaRaTUseS ArE deSCriBed, for exAmPlE, in U.S. pat. NO. 5,969,441, INCOrpoRatEd heRein bY reference.
PriOr tO traNSfeRring The ciRcuiT pAtterN from tHe patTeRning device to thE subStrate, the SubStRatE mAy undERgo varIouS prOcedureS, such as PRimInG, RESiSt coating and a soft bAkE. aFtEr exposuRe, the sUBsTrATe may be sUbJecTed tO OTher pRoceDUrEs, such as A post-eXPoSuRe bake (PeB), DeveloPmEnt, A haRd bakE And mEasureMent/inspEctioN Of the transferrED circuit patteRN. THIS aRRay oF prOcedures is uSed aS A basIs to MAkE an INdiviDual lAyER oF A device, e.g., an IC. The subStRate maY then Undergo variouS processes SUCH as etchiNg, ioN-ImPLantation (dopinG), metaLlization, oXIdation, cHemo-mEchanicaL polishinG, ETc., all intEndEd tO fiNisH OFf The individual LAYer oF tHe devicE. If Several LayErs Are ReqUiRed in the dEvice, theN tHe WhOlE prOceduRE, or a variAnT thErEof, Is repEAted foR each LayeR. EVeNTuaLly, a devICe WILl be PrEsEnt iN eaCh TargeT porTIon On the suBstrate. ThEse DEvicEs ArE then seParated from onE aNother by a tEcHniQue sucH AS dicing oR sawing, whence the individUAl devicEs cAn be mOuntEd on a carrIer, ConnecTed TO pins, eTc.
As noTed, liThOgrAPHy is a CENtRal StEp in the manUFActUring Of iCs, wHere patTerns formed on substRAteS define functiOnaL eleMENtS of THe ics, sUcH As mICRoprocessors, memOry chips etC. SIMiLar lithogrAPhiC tEchniquEs are alSo useD In the foRmation of Flat panel DiSplaYS, MicRo-electro mEchanicaL systems (MemS) and OThEr devIceS. One coMmOn pHenomEnon whICh cOntinUes to pLaGue graIn farMeRs relateS to the infestation of wholE grain Seeds WitH a disease SucH As, fOr example, fusaRium. This in TurN caUses a SmaLL percEntaGE oF grAIn kerNels TO contain a HIgH leVEL oF a mycotoxin THAT is InhomOgeNEously DistRibuted within randOM samples of the gRain.
dE
 the projection beam scans  the patte rning  de vic e.  Mor e in formation with rega rd to lithographic dev icesas desc r ib ed he rein ca n  b e gle an ed , f or ex ample , f rom U.S . Pat. No.  6, 04 6,792, incor p or ated herei n b y reference. 
Th e lith og rap h ic ap par atusmay be of a t ype havin gt wo orm ore tab l e s(e.g ., two or more su b st r ate table, a s ubstra te ta b l e a nda measurem en t tab l e, twoo rm o r e p a tterning devi ce tables,e tc. ). Insu ch“ multip le st ag e ” d evices theaddi tional ta bles m a y be us e d in pa rallel , o r p repa r at or y s te p s m a ybec arr ied outon  o ne or  mor e t a bles  wh ileone o r more othertab lesa rebeing  used  for  e xposu res. T win s ta ge lithographic  app aratusesare  d esc ri bed,f or exa mpl e,in U.S.  Pat. N o . 5 ,9 6 9 , 44 1, incorporated he re i n  b y refere nce.
P r io rt o transf er rin g th e circu it p a tt ern from  the p a tt er ning de vi ce toth e s ubs trate ,  the  subst rate may  unde r go various pro c edures, sucha sp r im i ng,res ist coating  and a so ft b a ke . A f ter e xposu re ,  t h e substrate may besu bjecte d toother procedu res, sucha s a post-e xpos u re bake (PEB), de velop ment, a ha r d bake a nd me asuremen t/inspect i o n of the  tr ans fer red c ir cuit pattern. T hisar ray ofpro cedures  is  us edasabasis tomake anin di vi du allayer of a dev ic e,e. g.,  an I C . Thesubst rate  m ay the n under g ov a riou spr oces ses  s uch a s et c hin g, ion- implantat ion (dop in g) , metal lization, oxi da tion, chem o- mec hanica l polishin g, etc., all intended t o  finish  of f the  ind ividual l aye r of t hed evice.  If se veral  l aye r s  arer e qu ire din the dev i c e,thenth e wh ole pro cedure, or a varia n t t hereof, is re pea tedf o reac h  l a yer .E ven t u ally, a devicewill be pr es e nt  in each t a rge tportion  on the  subs t rate. T hese devi ces are t he n se p a rat ed from on e anothe r by a te c hniqu e  s uch a s d icingor  sa wing,  whenc e  th e ind ividua ldevice s can  b e mounte d on a carrier, connect ed topins,  et c.
As not ed, lit hographyis a  central s tep  in  theman u factu ring of  IC s , whe re p a tterns fo r me d o n su bstrates de f i n e f uncti ona l  eleme ntsof the ICs, sucha s microprocess ors, m emo ryc hips  e tc. Similar li tho gr a p hic tech ni ques are al so usedin the f ormati on offlat pa n e ld isplay s, m icr o-electro  me ch a nical s ys te m s (MEM S) a nd  other  devic e s. O n e  common phenomen on wh i c h con t inu es to  p lague g r ainfarmers re lates to th e infe stat ion o f whole  g rain s eed swith a dis e ase suchas, f or exam pl e, F usa rium.This i n tur n ca us esa small p e r ce n ta ge ofgrai n ker ne ls t o contain a high l eve l  of a m yc oto x i n that is i nhomogeneo usl y dis t r ibuted wit h in r a nd o m sam ples o f thegrain.D e
 the_projection beam_scans the patterning device._More information_with_regard to_lithographic_devices as described_herein can be_gleaned, for example, from_U.S. Pat. No._6,046,792,_incorporated herein by reference.
The lithographic apparatus may be of a type having two or_more_tables (e.g.,_two_or_more substrate table, a substrate_table and a measurement table,_two or_more patterning device tables, etc.). In such “multiple_stage”_devices the additional_tables may be used in parallel, or preparatory steps_may be carried out on one_or more tables_while_one_or more other tables_are being used for exposures. Twin_stage lithographic apparatuses are described, for_example, in U.S. Pat. No. 5,969,441, incorporated_herein by reference.
Prior to transferring the_circuit pattern from the patterning_device to_the substrate, the substrate may_undergo various procedures,_such as_priming, resist coating_and a soft bake. After exposure,_the substrate may_be subjected to other procedures, such_as_a post-exposure bake_(PEB),_development,_a hard_bake and measurement/inspection_of_the transferred_circuit_pattern. This array of procedures is_used_as a basis to make an individual_layer of a device,_e.g.,_an IC. The substrate_may then undergo various processes_such as etching, ion-implantation (doping), metallization,_oxidation, chemo-mechanical_polishing, etc.,_all intended to finish off the individual layer of the device._If several layers are required in_the device, then the_whole procedure,_or_a variant thereof,_is_repeated for_each layer. Eventually, a device will be_present in_each target portion on the substrate._These devices are then_separated_from one another by a technique_such as dicing or sawing, whence_the individual devices can be_mounted_on_a carrier, connected to pins,_etc.
As noted, lithography is a central_step in the_manufacturing of ICs, where patterns formed on_substrates_define functional elements of the ICs,_such_as microprocessors, memory chips etc. Similar_lithographic_techniques_are also used in the_formation of flat panel displays, micro-electro_mechanical systems (MEMS) and other devices. One common phenomenon_which continues to_plague grain farmers relates to_the_infestation_of whole grain seeds with a disease such as, for_example, Fusarium._This in turn_causes a small percentage of grain kernels to contain a_high level of a mycotoxin that is_inhomogeneously distributed within random samples of the grain.
De