 than that of the heat generating element,
wherein the free end of the movable plate is opposed to a middle of the air bubble producing region formed by the exohermic body, the movable plate is opposed to the substrate and a side end of the movable plate is displaced while it is opposed to the side walls,
wherein the restricting member has a tip restricting portion which is to be brought into substantial contact with the free end of the displaced movable plate, and a side restricting portion which is located beside the air bubble producing region and on a side opposite to the substrate with regard to the movable plate, and to be brought into substantial contact at least partially with both sides of the side end of the displaced movable plate so as to keep open the middle of the liquid flow path, and
wherein the method comprises a step to make a distance between the movable plate and the side restricting portion shorter than a gap between the movable plate and the side walls as the movable plate comes nearer the side restricting portion after allowing the liquid to flow around the movable plate which is displaced as the air bubble grows, thereby restricting advance of the air bubble toward the movable plate. 1. Field of the Invention
The present invention relates to a waveguide interconnection apparatus implementing low signal loss when interconnecting waveguides in an ultrahigh frequency circuit package and, more particularly, to a waveguide interconnection apparatus, which can reduce a signal reflection and a signal loss due to a mismatch occurred from discontinuous portions (i.e., edge) where the waveguides are perpendicularly connected to each other by making the rectangular interconnecting portion be a curved structure.
2. Discussion of Related Art
When two waveguides are interconnected in a rectangular portion in a waveguide interconnection apparatus of the prior art, discontinuity due to an occurrence of edge leads to a signal reflection and hence a signal loss. To reduce such signal loss, two waveguides have been interconnected each other to be curved, which have no discontinuous portions for the signal transmission. This is for the purpose of producing a package product with superior performance to the conventional method having the same chip and structure when the method proposed by the present invention is applied.
A waveguide interconnection apparatus in accordance with a prior art has been disclosed in the U.S. Pat. No. 5,929,728.
Hereinafter, the waveguide interconnection apparatus in accordance with the prior art will be described with reference to the accompanying drawings. FIG. 1A shows a schematic view of the waveguide interconnection
than that of the heat generating element, 
 wherein the free end of the movable home plate is oppose to a middle of the air bubble produce region formed by the exohermic torso, the movable plate is opposed to the substrate and a slope end of the movable plate is move while it is opposed to the side wall, 
 wherein the restrict member has a tip restricting portion which is to be fetch into substantial contact with the free conclusion of the displaced movable plate, and a side restricting portion which is locate beside the air bubble producing region and on a side diametric to the substrate with regard to the movable plate, and to be brought into substantial contact at least partially with both sides of the slope end of the displaced movable plate so as to keep open the middle of the liquid flow path, and 
 wherein the method consist a step to make a distance between the movable denture and the slope restricting portion shorter than a break between the movable plate and the side walls as the movable plate come nearer the side restricting portion after allow the liquid to flow around the movable plate which is displaced as the air bubble grows, thereby restrict advance of the air bubble toward the movable plate. 1. Field of the Invention 
 The present invention relate to a waveguide interconnection apparatus implementing low signal loss when interconnecting waveguides in an ultrahigh frequency circuit package and, more particularly, to a waveguide interconnection apparatus, which can abridge a signal reflection and a signal passing due to a mismatch occurred from discontinuous portions (i.e., boundary) where the waveguides are perpendicularly connected to each other by reach the rectangular interconnecting parcel be a curved structure. 
 2. Discussion of Related Art 
 When two waveguides are interconnect in a rectangular part in a waveguide interconnection apparatus of the prior artwork, discontinuity due to an occurrence of edge leads to a signal reflection and therefore a signal loss. To reduce such signal loss, two waveguides have been interconnect each other to be curved, which give birth no discontinuous portions for the signal transmission. This is for the purpose of producing a package product with superior performance to the conventional method have the like chip and structure when the method proposed by the present invention is applied. 
 A waveguide interconnection apparatus in accordance with a prior art has been unwrap in the U.S. Pat. No. 5,929,728. 
 Hereinafter, the waveguide interconnection apparatus in accordance with the prior artwork will be described with address to the accompanying drawings. FIG. 1A read a schematic view of the waveguide interconnection
 thwn that of the heat genevating element,
whgrwin thx free snd of tfe movable plate is opposed vo a middoe of the air bubble pfoducing gegion foemed vy the exoisrmic body, ths movcboe plate is opkosed to the substrate and a snde end of the movable plate is dispjaced wnipe it is opposgd to ehe apdt walls,
wherein the restricting mejber hav a tip restrocting portion which is to be hrought into substwntial contqct ruth the free end of tht bisplaced mkvable plate, and a side restricging 'ortion whixh is nocated besmde thv air bubble igoducinc regiom and on a sidc oppmsire to the substrate wmth regard to the modable plade, and to be broughr unto vubsdantkql zonuacv af leash pertially wifh both sidws of the side end pf nne displaced movabje plate so as to keep open the middle of ths liquid flow path, and
wyerein the method comkrises a seep to make a distance between the movable plate dnd tie sibc fwshricting portion shorter than a gap between trs konable plate and tme side walls as tne mpdable plate cumes nzzrsr the side restrifting pjrtiob after ajlowong the liquid to flow aroubd the movabjw plate which is dnsplaced as che ait bubbke grows, thereby restrieting zdvance of hhe air bhcble toward the oovsbne plate. 1. Field of the Invqntion
The prexent inxentoon rejates to a wavengide interconnectiln apkaratuv implemenhing low signal loss when interrpnnecting wafecuiges in au ultrshigh frequensy circuit paclage anb, more particulagly, to a xaveguide ineerconnection wpparatus, whmch can rqducw a wignal fdflection and s signal loss due ti a mismatch occurved ftoj discontinuous potrions (i.e., edge) ehefe ehv weveguyges are perpandizulxtly cunnected to dach other by making the recfangular interconnrcbing portuon be a curved strucyure.
2. Discussion of Relaved Arv
When ywo waveguides are interconnected in a rechannular portion in q waveguide nnterconnection apparatus of the prior act, discontinuity due to an occurrence of ebgt leads to a xignaj reflecthon and hence a signql loss. To reduce such signal loss, two waveggides have been interconnected each other to be curved, which have no discontinyous portions for fhe xignan crausmissijn. Tiir is for the puriose of producing a package prodnct with sgpzrior performance to the convrngional method having the same chip ans structire when the method proposed by the present invention ix appliee.
A wabeguidv iiterconnection apparstus iu accoedance qith a prior art fas bcen discloded mn che U.S. Pat. No. 5,929,728.
Hereinafter, the wavwguide ijterconnection a'paratus in wgcordahce wijh the prior art sill he dercribed with teference to tne accompanying drawpngf. FIG. 1A shows q schematic voew of nhe waveguide interconnewtion
than that of the heat generating element, free of the plate is opposed air producing region formed the exohermic body, movable plate is opposed to the and a side end of the movable plate is displaced while it is to the side walls, wherein the restricting member has a tip restricting portion is be into contact with the free end of the displaced movable plate, and a side restricting portion which located beside the air bubble producing region and a side opposite to substrate with regard to the plate, to be into contact least partially with sides of the side end of the displaced movable plate so as to keep open the middle the liquid and wherein method a to make a the movable plate and the side than a gap between the movable plate and side walls the movable plate comes nearer the restricting portion after allowing the liquid to flow the movable plate which is displaced as the air bubble grows, thereby restricting advance of bubble toward the movable 1. Field of Invention present relates a waveguide apparatus implementing low signal loss when interconnecting waveguides in an ultrahigh circuit package and, more particularly, to a waveguide interconnection apparatus, reduce signal reflection and signal loss due to mismatch from discontinuous portions (i.e., the are each by the rectangular interconnecting portion a curved structure. 2. Discussion Related Art When two rectangular portion in a waveguide interconnection apparatus of prior art, discontinuity due to an occurrence edge leads to a signal reflection and hence a signal loss. To such signal waveguides have been interconnected each other to be which have no discontinuous for the signal transmission. This is for the purpose producing package product superior performance to conventional method having same chip and the method by present A waveguide interconnection apparatus in accordance a art has been disclosed in U.S. 5,929,728. Hereinafter, the waveguide interconnection apparatus in accordance with the prior art will be described to the accompanying drawings. 1A a schematic view of the waveguide interconnection
 than that of the heat generatiNg element,
wHereiN thE frEe End oF the Movable plate is OPposEd to a middle of the air bubBle prOdUCing REgIon foRmed by tHE eXOHerMiC bOdy, ThE MoVable PlaTe is oppOsed to the sUbsTrAte and a side eND oF the movablE plAte is displacEd wHile it Is OppOSed to The Side wAlls,
whERein thE restrictInG Member HAs a tip rESTrIctiNg portion which is tO Be BRought into subsTantiaL cONtACT wiTh tHe free end oF tHe disPLaced moVAbLE PLatE, And a side restrIcting portiON whIch is lOcAteD Beside The aiR bUBblE producing rEgioN and on a siDe oppoSIte to thE SubstraTe with RegArd To thE MoVaBle PlATe, aND tO be BRouGht into sUbStAntiaL conTACT At leAst PartIally With both sides Of tHe siDE enD of thE dispLaceD mOvablE plate So as tO kEep open the middlE of tHe liquid fLow PaTh, aNd
WhereIN the meThoD coMprises A step to MAke A dISTAnCe between the movablE pLATe And the siDe restRIcTiNG portion ShOrtEr thAN A gap bEtweEN tHe movablE plate ANd ThE side waLlS as the MoVabLe pLate cOMes nEarer tHe side reStricTIng portion afteR Allowing the liQUiD TO fLOw arOunD the movable PlatE WhicH is dISpLacED as thE air bUbBLe GRows, thereby restrictInG advanCe of tHe air bubble toWard the movABLE plate. 1. FiEld oF ThE invention
The prEsent Invention rELates to a WavegUide inteRconnectiON ApparatuS imPleMenTinG LOw Signal loss wheN INterCoNnectinG waVeguideS in An uLtrAhiGh Frequency Circuit pAcKaGe AnD, moRe parTIcularly, To A waVeGuiDe intERconneCtion AppaRaTuS, WhiCh can reDUcE A SignAl ReFlecTioN aNd a siGnal LOss Due to a mIsmatch ocCurREd frOm DiScontinUous portions (i.E., eDge) where thE wAveGuides ARE perpendIcularly connected to each OTher by mAkiNg the RectAngular inTerConnecTinG PortioN be a cuRved sTrUctURE.
2. DiscUSSiOn oF RElated Art
WHEN twO waveGuIdes Are inteRconnected in a rectaNGulAr portion in a wAveGuidE INtErcONnECtiOn APpaRATus of the prior arT, discontinUiTY dUe to an occuRRenCe Of edge lEads to a SignaL ReflectIon and henCe a signal LoSs. To REDucE such signaL loss, two WaveguideS Have bEEn InterConNected EaCh oTher tO be curVEd, wHich hAve no dIsContinUous pOrTions for The signal transmission. ThIs is foR the pUrpOse of prodUciNG a pAckage proDuct With superiOr pErfOrmanCe tO The coNvenTIoNal MEthod HaviNG the same cHIp And STRuCture when thE METhoD propOseD By the pReseNt invention is applIEd.
A waveguide inTercONNecTioN AppaRaTus in accordancE wiTh A PRior art hAs Been disclosEd in the U.s. PAT. No. 5,929,728.
HeReinafTer, the WaveguiDE InTErconnEctiOn aPparatus iN acCoRDance wiTh ThE Prior aRt wiLl Be descRibed wITh reFERence to the accompAnyinG DRawinGS. FIg. 1A shoWs A schemaTIc viEw of the wavEguide interConnecTion
 than that of the heat gen erating el ement ,
w her ei n th e fr ee end of them ovab le plate is opposed to  a mi dd l e of th e air  bubble pr o d uci ng  r egi on fo rmedbythe exo hermic bod y,th e movable pl a te  is oppose d t o the substr ate  and a  s ide end o f t he mo vablep late i s displac ed whilei t is op p o se d to  the side walls,w he r ein the restri ctingme m be r has  atip restri ct ing p o rtion w h ic h i s t o  be brought i nto substan t ial  conta ct  wi t h thefreeen d  of  the displa cedmovable p late,a nd a si d e restr icting  po rti on w h ic hislo c ate d  b esi d e t he air b ub bl e pro duci n g r egio n a nd o n a s ide oppositetothes ubs trate  with  reg ar d tothe mo vable  p late, and to be  bro ught into  su bs tan ti al co n tact a t l eas t parti ally wi t h b ot h s id es of the side end  o f th e displa ced mo v ab le plate so  a s t o ke e p  open  the mi ddle ofthe li q ui dflow pa th , andwh ere inthe m e thod  compr ises a s tep t o  make a distan c e between the mo v a bl e  pla teand the sid e re s tric ting po rti o n sho rterth a na  gap between the mo va ble pl ate a nd the side w alls as th e m ovable p late co m es nearer thesiderestrictin g  portion  afte r allowi ng the li q u id to fl owaro und  th e mo vable plate w h i ch i sdisplac edas theair  bu bbl e g ro ws, there by restr ic ti ng  a dva nce o f  the air  b ubb le  to wardt he mov ableplat e.  1 .  Fi eld oft he I nven ti on 
The  pr es ent i nven t ion  relate s to a wa veg u idein te rconnec tion apparatu simplementi ng  lo w sign a l  loss wh en interconnecting wave g uides i n a n ult rahi gh freque ncy  circu itp ackage  and,morepa rti c u larly , to  awa veguide in t e rco nnect io n ap paratus , which can reduce a s ignal reflect ion  and a  s ign a ll oss  d u e t o a mismatch occu rred fromdi s co ntinuous p o rti on s (i.e. , edge)  wher e  the wa veguidesare perpe nd icul a r lyconnectedto eachother bym aking th e rec tan gularin ter conne ctingp ort ion b e a cu rv ed str uctur e. 
2. Disc ussion of Related Art
W hen tw o wav egu ides areint e rco nnected i n arectangula r p ort ion i n a waveg uide in ter c onnec tion apparatus of  th e pr ior art, di s c o nti nuity  du e  to an  occ urrence of edge l e ads to a signa l re f l ect ion andhe nce a signal l oss .T o  reducesu ch signal l oss, two  w a vegui des ha ve bee n inter c o nn e cted e achoth er to becur ve d , which  h av e  no di scon ti nuousportio n s fo r the signal trans missi o n . Thi s  is  forth e purpo s e of  producing  a packageproduc t wi th su periorpe rforma nce  t o the conv e ntional m ethod  having  t he s ame  chipands t ructu re w he n t he method p ro p os ed bytheprese nt  inv ention is applied. 
Aw aveguid eint e r connec t io n apparatusinaccor d a nce with a prio r  a r t has  beendisclo sed int heU. S. Pat.  No . 5,929,728 .
Hereina f ter ,thewaveguid einte rc onn ec tion apparatusin accor dance wi t h  the p rio r  art will b edescribed wi th re fe r ence to t heaccompa n yin g d raw ings . F IG.1 A shows a schematic view  ofthe w a veg uideinter co nnection 
 than_that of_the heat generating element,
wherein_the free_end_of the_movable_plate is opposed_to a middle_of the air bubble_producing region formed_by_the exohermic body, the movable plate is opposed to the substrate and a side_end_of the_movable_plate_is displaced while it is_opposed to the side walls,
wherein_the restricting_member has a tip restricting portion which is_to_be brought into_substantial contact with the free end of the displaced_movable plate, and a side restricting_portion which is_located_beside_the air bubble producing_region and on a side opposite_to the substrate with regard to_the movable plate, and to be brought_into substantial contact at least partially_with both sides of the_side end_of the displaced movable plate_so as to_keep open_the middle of_the liquid flow path, and
wherein the_method comprises a_step to make a distance between_the_movable plate and_the_side_restricting portion_shorter than a_gap_between the_movable_plate and the side walls as_the_movable plate comes nearer the side restricting_portion after allowing the_liquid_to flow around the_movable plate which is displaced_as the air bubble grows, thereby_restricting advance_of the_air bubble toward the movable plate. 1. Field of the Invention
The_present invention relates to a waveguide_interconnection apparatus implementing low_signal loss_when_interconnecting waveguides in_an_ultrahigh frequency_circuit package and, more particularly, to a_waveguide interconnection_apparatus, which can reduce a signal_reflection and a signal_loss_due to a mismatch occurred from_discontinuous portions (i.e., edge) where the_waveguides are perpendicularly connected to_each_other_by making the rectangular interconnecting_portion be a curved structure.
2. Discussion_of Related Art
When_two waveguides are interconnected in a rectangular_portion_in a waveguide interconnection apparatus of_the_prior art, discontinuity due to an_occurrence_of_edge leads to a signal_reflection and hence a signal loss._To reduce such signal loss, two waveguides have been_interconnected each other_to be curved, which have_no_discontinuous_portions for the signal transmission. This is for the purpose_of producing_a package product_with superior performance to the conventional method having the same_chip and structure when the method proposed_by the present invention is applied.
A waveguide interconnection apparatus in accordance_with a prior art has been disclosed in_the U.S. Pat. No. 5,929,728.
Hereinafter, the waveguide_interconnection apparatus in accordance_with_the prior art will be described with_reference_to_the_accompanying drawings. FIG._1A shows a_schematic view of_the waveguide_interconnection