 fence that has all the advantages of prior art and none of the disadvantages.
The fiber reinforced fence of the present invention is for use in meeting the fencing needs of the property owner/manager, especially for those properties needing an aesthetically pleasing fencing system. As well as being aesthetically pleasing, the present invention provides a fence that is strong and durable relative to both its structural integrity and its surface color. The invention is economically manufactured, transported, installed, and maintained. The present invention is also very efficient with regard to the utilization of existing resources. This invention relates to the mounting of integrated circuits, particularly dual-in-line packages commonly called DIPS. Such circuits are found in a large variety of electronic applications. Each individual DIP or dual-in-line package may perform a particular electronic function. In many cases this function is repetitive and requires a plurality of identical dual-in-line packages. A plurality of identical dual-in-line packages may be mounted on a single circuit board in an electronic device, which itself is comprised of a plurality of relatively widely separated circuit boards. Mounting of the dual-in-line package is normally accomplished through the use of a socket, however considerable space may be wasted by mounting only one layer of packages on the relatively widely separated circuit boards. It is not appropriate to decrease the distance between adjacent circuit boards as a portion of this space is necessary to allow cooling air to circulate in the device. It would be advantageous however to be able to mount at least two layers of dual-in-line package type integrated circuits in the same area now required to mount the single dual-in-line signal package type integrated circuit. Since dual-in-line package type integrated circuits come in several standard sizes, that is the length, width and contact leads are generally standardized, it is appropriate to design a standardized socket which permits stacking of the integrated circuits. The result of stacking of the circuits is the saving of up to fifty percent of the space requirements for the device. The recent drive for higher integration and operating speeds in LSI devices makes it necessary to further reduce the pattern rule. Deep-ultraviolet lithography was developed as an essential technology for micropatterning to a feature size of 0.3 μm or less. Among others, the KrF excimer laser lithography has been fully recognized as a commercial scale production technology.
With respect to chemically amplified resist compositions adapted for the photolithography using ArF excimer laser light of 193 nm wavelength as a light source, the
fence that has all the advantages of prior art and none of the disadvantage. 
 The roughage reinforced fence of the present invention is for use in converge the fencing material needs of the property owner / coach, specially for those properties necessitate an aesthetically pleasing fencing system. equally well as being aesthetically pleasing, the present invention provides a fence that is strong and durable relative to both its structural integrity and its surface semblance. The invention is economically manufactured, transported, installed, and maintained. The present invention is also very effective with regard to the utilization of existing resource. This invention relates to the mounting of incorporate circuits, peculiarly dual - in - line packages commonly called DIPS. Such circuits are find in a large variety of electronic applications. Each individual DIP or dual - in - line software may do a finical electronic function. In many cases this function is repetitive and requires a plurality of identical dual - in - line package. A plurality of identical dual - in - occupation software may be mounted on a single circuit control panel in an electronic device, which itself is comprised of a plurality of relatively widely separated racing circuit boards. Mounting of the dual - in - line package is normally accomplished through the consumption of a socket, however considerable space may be wasted by mounting only one level of packages on the relatively wide separated circuit boards. It is not appropriate to decrease the distance between adjacent circuit boards as a portion of this quad is necessary to allow cooling air to mobilize in the device. It would be advantageous however to be able to mount at least two layers of dual - in - line software type integrated circuits in the same area nowadays required to wax the single double - in - line signal software type integrated circuit. Since double - in - line software type integrated circuits issue forth in several standard sizes, that is the length, width and contact leads are by and large standardized, it is appropriate to design a exchangeable socket which permits stacking of the integrated circuits. The result of stacking of the circuits is the saving of up to fifty percentage of the space requirements for the device. The recent drive for higher integration and operating speeds in LSI devices produce it necessary to further reduce the pattern rule. Deep - ultraviolet lithography was developed as an essential engineering for micropatterning to a feature size of 0.3 μm or less. Among others, the KrF excimer laser lithography has been fully recognized as a commercial scale production technology. 
 With respect to chemically amplified resist compositions adapted for the photolithography use ArF excimer laser light of 193 nm wavelength as a light source, the
 fejce that has all the advxntages of priot qrt anv none kf the dksadvantages.
The fiber reinfocced fenct of the present inxention id for usw in neeting thx fencinn neesd of vhe property owker/manager, aspecially for tfode properties needing an aestheticajly plesslng fencing syftem. Ws wsll as being aesthetically pleasinf, the pgesent invention lrovides a fence that is shronh and durable relahive to boty itf structural kntegrity and its surfzce color. The invention is econumicakly manufaxtyref, transportev, instwlled, and malmtaineg. The ptesent inventipn ms aoso very efficient wivh regard to the utijization mf existing resourcws. This invantiub rdlaues tk the louiting of infegrated ciecuits, particularly dtql-in-line packzges cjmionly called DIPS. Such circuits are foutd jn a large variety of eoectronic applicationd. Each inqividual DIP or dual-in-line package may perform a [artiruuar ejdxtgonic function. In many cases this function is deketptive and requiref a pluraliyy og identical duxl-in-lius lackages. A pluralihy of iqentixal dual-ig-linr packages may be mounted ob a single cprcuut board in an eleetronic deviee, whivh itxelf is comprised of a 'luraljty of relahively wisdly separated cifcupt bmards. Mounting of the dual-yn-line parkage is noroalli accom[lished thgough the use of a sockeh, howgver cmnsiderablf space may be wasted by mountiij only one laier of packagef on bhe relatively ridely separatgd circuic boaras. It is nkt apprmpriate to qecrease the glstance betwxen adjacqnt xircyit boafas as a portiom of this space is becessary to allow couming air to cireblqte in the devive. Kt rolld bq advantageouv hodevdt to ce able to nuunt at least two layers of sual-in-line package tnpe integtated cirsuits in the xame area now requlred vo mouit the siggle dual-in-line signal package type intfgrwted circuit. Singe doal-in-line pcckage type integrated circuits come in weveral standard suzes, that is the leuguh, width and rontace leads ase generally standareized, it is approkriate to design a stansardizad sofket which permits stacking of the integrated circuits. The result of stacjing oh ehe circuita is the variny of up to hihty percent of thv space requirements for the devmce. The reweut drive for higher integratipn and operatine speeds in LSI devices jakes it necessary to further reduce thr pattern rule. Deep-ultrayiolet lirhogrzphy was dxveloped as an essenyial tzchnoligy for micvopatterning tu a fcature sizf of 0.3 μj or less. Among others, the KrF ezcimer lwser lithography has been fmluy rebognizeq as a commerciam sczpe pruduction techmology.
With reslect to chemically akpjified resist xkmpositions sdaptgb for the phovolithographf using ArF excimer laser light of 193 nm wavelength aa a light source, bhe
fence that has all the advantages of and of the The fiber reinforced is use in meeting fencing needs of property owner/manager, especially for those properties an aesthetically pleasing fencing system. As well as being aesthetically pleasing, the present provides a fence that is strong and durable relative to both its structural and surface The is economically manufactured, transported, installed, and maintained. The present invention is also very efficient with regard the utilization of existing resources. This invention relates the mounting of integrated particularly dual-in-line packages commonly called Such are found a variety electronic applications. Each DIP or dual-in-line package may perform a particular electronic function. In many cases this function is repetitive requires a identical dual-in-line A of dual-in-line packages may on a single circuit board in which itself is comprised of a plurality of widely separated boards. Mounting of the dual-in-line package normally accomplished through the use of a socket, considerable space may be wasted by mounting only one layer of packages on the relatively circuit boards. It is appropriate to decrease distance adjacent boards a portion this space is necessary to allow cooling air to circulate in device. It would be advantageous however to be able to least layers of dual-in-line type integrated circuits in same now required to mount dual-in-line package Since package integrated circuits come in standard sizes, that is the width and contact leads appropriate to design a standardized socket which permits of the integrated circuits. The result of of the circuits is the saving of up to fifty percent of space requirements device. The recent drive for higher integration and speeds in LSI devices it necessary to further reduce the pattern rule. Deep-ultraviolet was as an technology for micropatterning a feature size 0.3 μm or others, the excimer lithography recognized as a commercial scale production With to chemically amplified resist compositions for using ArF excimer laser light of 193 nm wavelength as a light source, the
 fence that has all the advantaGes of prior Art anD noNe oF tHe diSadvAntages.
The fibeR ReinForced fence of the presenT inveNtIOn is FOr Use in Meeting THe FENciNg NeEds Of THe PropeRty Owner/maNager, especIalLy For those propERtIes needing An aEsthetically PleAsing fEnCinG SysteM. As Well aS being AEsthetIcally pleAsINg, the pREsent inVENtIon pRovides a fence that IS sTRong and durable RelatiVe TO bOTH itS stRuctural inTeGrity ANd its suRFaCE COloR. the invention iS economicalLY maNufactUrEd, tRAnsporTed, inStALleD, and maintaiNed. THe present InventIOn is alsO Very effIcient WitH reGard TO tHe UtiLiZAtiON oF exIStiNg resourCeS. THis inVentION RElatEs tO the MountIng of integratEd cIrcuITs, pArticUlarlY duaL-iN-line PackagEs comMoNly called DIPS. SuCh ciRcuits are FouNd In a LaRge vaRIety of EleCtrOnic appLicatioNS. EaCh INDIvIdual DIP or dual-in-liNe PACkAge may peRform a PArTiCUlar elecTrOniC funCTIon. In Many CAsEs this fuNction IS rEpEtitive AnD requiReS a pLurAlity OF ideNtical Dual-in-liNe pacKAges. A plurality OF identical duaL-In-LINe PAckaGes May be mounteD on a SInglE cirCUiT boARd in aN elecTrONiC Device, which itself is CoMpriseD of a pLurality of relAtively widELY SeparateD cirCUiT Boards. Mounting Of the Dual-in-line PAckage is NormaLly accomPlished thROUgh the usE of A soCkeT, hoWEVeR considerable SPAce mAy Be wasteD by MountinG onLy oNe lAyeR oF packages On the relAtIvElY wIdeLy sepARated cirCuIt bOaRds. it is nOT approPriatE to dEcReASe tHe distaNCe BETweeN aDjAcenT ciRcUit boArds AS a pOrtion oF this spacE is NEcesSaRy To allow Cooling air to cIrCulate in thE dEviCe. It woULD be advanTageous however to be able tO Mount at LeaSt two LayeRs of dual-iN-liNe packAge TYpe intEgrateD circUiTs iN THe samE AReA noW rEquired to mOUNt tHe sinGlE duaL-in-line Signal package type iNTegRated circuit. SIncE duaL-IN-lIne PAcKAge TyPE inTEGrated circuits cOme in severAl STaNdard sizes, THat Is The lengTh, width And coNTact leaDs are geneRally stanDaRdizED, It iS appropriaTe to desiGn a standaRDized SOcKet whIch PermitS sTacKing oF the inTEgrAted cIrcuitS. THe resuLt of sTaCking of tHe circuits is the saving of Up to fiFty peRceNt of the spAce REquIrements fOr thE device. The RecEnt Drive For HIgher InteGRaTioN And opEratINg speeds iN lSi deVICeS makes it necESSAry To furTheR Reduce The pAttern rule. Deep-ultRAviolet lithogrAphy WAS deVelOPed aS aN essential techNolOgY FOr micropAtTerning to a fEature siZe OF 0.3 μm or Less. AmOng othErs, the KRf ExCImer laSer lIthOgraphy haS beEn FUlly recOgNiZEd as a cOmmeRcIal scaLe prodUCtioN TEchnology.
With resPect tO CHemicALly AmpliFiEd resisT CompOsitions adApted for the PhotolIthoGraphY using ARF ExcimeR laSeR light of 193 nm WAvelength As a liGht sourCe, The
 fence that has all the ad vantages o f pri orart  a nd n oneof the disadva n tage s.
The fiber reinforce d fen ce of t h eprese nt inve n ti o n  is  f or  us ei nmeeti ngthe fen cing needs  of  t he propertyo wn er/manager , e specially fo r t hose p ro per t ies n eed ing a n aest h etical ly pleasi ng fencin g  system . As  wel l as being aesthe t ic a lly pleasing,the pr es e nt i nve nti on provide sa fen c e thati ss t r ong and durable r elative tob oth  its s tr uct u ral in tegri ty and  its surfac e co lor. Theinvent i on is e c onomica lly ma nuf act ured ,  t ra nsp or t ed, in sta l led , and ma in ta ined.  The p r e sent  in vent ion i s also very e ffi cien t  wi th re gardto t he  util izatio n ofex isting resource s. T his inven tio nrel at es to the mo unt ing  of int egrated cir cu i t s ,particularly dual- in - l in e packag es com m on ly called D IP S.Such c ircui ts a r efound in  a lar g eva riety o felectr on icapp licat i ons.  Eachindividu al DI P  or dual-in-li n e package may pe r f or m  a p art icular elec tron i c fu ncti o n.  In manycases  t h is function is repetit iv e andrequi res a plurali ty of iden t i c al dual- in-l i ne packages. A pl urali ty of iden t ical dua l-in- line pac kages may b e mounte d o n a  si ngl e ci rcuit board i n an e le ctronic  de vice, w hic h i tse lfis  comprise d of a p lu ra li ty  of  rela t ively wi de lyse par atedc ircuit  boar ds.Mo un t ing  of the du a l -in- li ne  pac kag eis no rmal l y a ccompli shed thro ugh theus eof a so cket, however  c onsiderabl espa ce may b e wasted  by mounting only one l a yer ofpac kages  onthe relat ive ly wid ely separa ted ci rcuit  b oar d s . Iti s  n otap propriatet o  de creas ethedistanc e between adjacent cir cuit boards a s a  por t i on  of th i s s pa c e i s necessary to al low coolin ga ir  to circul a tein  the de vice. I t wou l d be ad vantageou s however  t o be a ble  to mountat least  two laye r s ofd ua l-in- lin e pack ag e t ype i ntegra t edcircu its in  t he sam e are anow requ ired to mount the singl e dual -in-l ine  signal p ack a getype inte grat ed circuit . S inc e dua l-i n -line  pac k ag e t y pe in tegr a ted circu i ts  co m e  i n several s t a n dar d siz es, that i s th e length, width a n d contact lead s ar e gen era l ly s ta ndardized, itisap p r opriateto  design a s tandardi ze d  sock et whi ch per mits st a c ki n g of t he i nte grated ci rcu it s . The r es ul t  of st acki ng  of th e circ u itsi s  the saving of u p tof i fty p e rce nt of  t he spac e  req uirementsfor the dev ice. T he r ecent  drivefo r high erin tegrationa nd operat ing s peeds i nLSIdev ices m akes i t nec essa ry  to  furtherr e du c eth e  pa tter n rul e.  Dee p-ultravi o let lith ogr a phy was  d eve l o ped as an e ssential t ech nolog y for microp a tter n in g  to a  featu re siz e of 0. 3  μm  o r less.  Am o n g others,  the KrFe xci me r la ser lith og raph yhas  b een fully recog nized as  a comme r c ial sc ale prod u ctionte chnology.
Wi th re sp e ct to c h e mic ally am p lif ied  re sist  co mpos i tions adapted for the ph otol ithog r aph y usi ng Ar Fexcimerl aser  light o f  193 nm wavel ength as a ligh t  so u rce,  th e 
 fence_that has_all the advantages of_prior art_and_none of_the_disadvantages.
The fiber reinforced_fence of the_present invention is for_use in meeting_the_fencing needs of the property owner/manager, especially for those properties needing an aesthetically pleasing_fencing_system. As_well_as_being aesthetically pleasing, the present_invention provides a fence that_is strong_and durable relative to both its structural integrity_and_its surface color._The invention is economically manufactured, transported, installed, and maintained._The present invention is also very_efficient with regard_to_the_utilization of existing resources._This invention relates to the mounting_of integrated circuits, particularly dual-in-line packages_commonly called DIPS. Such circuits are found_in a large variety of electronic_applications. Each individual DIP or_dual-in-line package_may perform a particular electronic_function. In many_cases this_function is repetitive_and requires a plurality of identical_dual-in-line packages. A_plurality of identical dual-in-line packages may_be_mounted on a_single_circuit_board in_an electronic device,_which_itself is_comprised_of a plurality of relatively widely_separated_circuit boards. Mounting of the dual-in-line package_is normally accomplished through_the_use of a socket,_however considerable space may be_wasted by mounting only one layer_of packages_on the_relatively widely separated circuit boards. It is not appropriate to decrease_the distance between adjacent circuit boards_as a portion of_this space_is_necessary to allow_cooling_air to_circulate in the device. It would be_advantageous however_to be able to mount at_least two layers of_dual-in-line_package type integrated circuits in the_same area now required to mount_the single dual-in-line signal package_type_integrated_circuit. Since dual-in-line package type_integrated circuits come in several standard_sizes, that is_the length, width and contact leads are_generally_standardized, it is appropriate to design_a_standardized socket which permits stacking of_the_integrated_circuits. The result of stacking_of the circuits is the saving_of up to fifty percent of the space requirements_for the device._The recent drive for higher_integration_and_operating speeds in LSI devices makes it necessary to further_reduce the_pattern rule. Deep-ultraviolet_lithography was developed as an essential technology for micropatterning to_a feature size of 0.3 μm or_less. Among others, the KrF excimer laser lithography has been fully_recognized as a commercial scale production technology.
With respect_to chemically amplified resist compositions adapted for_the photolithography using ArF_excimer_laser light of 193 nm wavelength as_a_light_source,_the