 gas becomes difficult to control, either of which is inoperative.
The basic process of flash evaporation is described in U.S. Pat. No. 4,954,371 herein incorporated by reference. This basic process may also be referred to as polymer multi-layer (PML) flash evaporation. Briefly, a radiation polymerizable and/or cross linkable material is supplied at a temperature below a decomposition temperature and polymerization temperature of the material. The material is atomized to droplets having a droplet size ranging from about 1 to about 50 microns. An ultrasonic atomizer is generally used. The droplets are then flash vaporized, under vacuum, by contact with a heated surface above the boiling point of the material, but below the temperature which would cause pyrolysis. The vapor is cryocondensed on a substrate then radiation polymerized or cross linked as a very thin polymer layer.
The material may include a base monomer or mixture thereof, cross linking agents and/or initiating agents. A disadvantage of the flash evaporation is that it requires two sequential steps, cryocondensation followed by curing or cross linking, that are both spatially and temporally separate.
According to the state of the art of making plasma polymerized films, PECVD and flash evaporation or glow discharge plasma deposition and flash evaporation have not been used in combination. However, plasma treatment of a substrate using glow discharge plasma generator with inorganic compounds has been used in combination with flash evaporation under a low pressure (vacuum) atmosphere as reported in J. D. Affinito, M. E. Gross, C. A. Coronado, and P. M. Martin, “Vacuum Deposition Of Polymer Electrolytes On Flexible Substrates,” Proceedings of the Ninth International Conference on Vacuum Web Coating, November 1995, ed. R. Bakish, Bakish Press 1995, pg. 20-36, and as shown in FIG. 1a. In that system, the plasma generator 100 is used to etch the surface 102 of a moving substrate 104 in preparation to receive the monomeric gaseous output from the flash evaporation 106 that cryocondenses on the etched surface 102 and is then passed by a first curing station (not shown), for example electron beam or ultra-violet radiation, to initiate cross linking and curing. The plasma generator 100 has a housing 108 with a gas inlet 110. The gas may be oxygen, nitrogen, water or an inert gas, for example argon, or combinations thereof. Internally, an electrode 112
gas becomes difficult to control, either of which is inoperative. 
 The basic procedure of flare evaporation is described in U.S. Pat. No. 4,954,371 herein incorporate by reference. This basic process may besides be referred to as polymer multi - layer (PML) flash evaporation. concisely, a radiation sickness polymerizable and/or cross linkable fabric is supplied at a temperature below a decomposition temperature and polymerization temperature of the material. The material is atomize to droplets having a droplet size ranging from about 1 to about 50 microns. An supersonic atomizer is generally used. The droplets are then ostentation vaporized, under vacuum, by liaison with a heated surface above the boiling decimal point of the material, but below the temperature which would induce pyrolysis. The vapor is cryocondensed on a substrate then radiation polymerized or cross connect as a very thin polymer layer. 
 The material may include a base monomer or mix thereof, cross linking agents and/or initiating agents. A disadvantage of the flash evaporation is that it requires two sequential tone, cryocondensation followed by curing or crossbreed linking, that are both spatially and temporally freestanding. 
 According to the state of the art of cook plasma polymerized films, PECVD and flash evaporation or glow dismissal plasma deposition and flash evaporation have not been used in combination. However, plasma treatment of a substrate using incandescence discharge plasma generator with inorganic compounds has been used in combination with flash evaporation under a low press (vacuum) atmosphere as reported in J. D. Affinito, M. E. Gross, C. A. Coronado, and P. M. Martin, “ Vacuum Deposition Of Polymer Electrolytes On Flexible Substrates, ” Proceedings of the Ninth International Conference on Vacuum Web Coating, November 1995, ed. R. Bakish, Bakish Press 1995, pg. 20 - 36, and as shown in FIG. 1a. In that arrangement, the plasma generator 100 is used to etch the surface 102 of a move substrate 104 in preparation to receive the monomeric gaseous output from the flash dehydration 106 that cryocondenses on the etched airfoil 102 and is then passed by a first bring around station (not read), for example electron radio beam or ultra - purple radiation, to initiate cross yoke and curing. The plasma generator 100 have a housing 108 with a flatulence inlet 110. The gas may be oxygen, nitrogen, water or an inert gas, for example argon, or combination thereof. Internally, an electrode 112
 gad becomes difficult to cuntrol, either oy which is inkperativd.
The basic process of flash xvapiratiin is described in U.S. Oat. No. 4,954,371 hvrein incirpocated by referenrs. This ncsic lvocesv may also be rgferred to av polymer multh-lxyzr (PML) flash evaporation. Briefly, a rwdiatiom oolymerizable wnd/og srosa linkable material is supplied at a temptrature below a devomposition temperature anf popymerization tempegature of tye mwrerial. The mxterial is atomized to droplets having a droplet size rangnng from abiur 1 hm about 50 mirrons. Wn ultrasonig atomiser is benerally used. Thx driplets are then flash vaporized, under vwcuum, by woutact with a heated syrdace dbova thd boklihg pkint ov tie material, but below rhe temperature whivh qould cause pgrolysys. The vapor is cryocondensed on a substrdte then radiation polymeruzed or cross linked ws a very thin polymer layer.
The material may include a basa monkoer ov mibruge thereof, cross linking agents and/or initiatyhg anents. A disadvanbage of the flash rvwpptation is that it requides two sequential steps, sryocindensatijn fpllowed by curing or cross oinking, that qre both spatially and temporclly sgparatr.
According to the state of fhe art of laking plzrma polymerized wilks, PECVD and flash evaporatijn or glox diseharge puasms depofition and flasm evaporation have jot bgen usad in comblnation. However, plasma treatmenv of a substrsta uving gloc discmarge plasma gegerator with iuorganic compuunds has geen usxd in combinwtion with flddh evaporatimn under a liw peessure (xacuum) atmosphrre as reioxted in J. D. Affinito, M. E. Grpss, D. A. Coronado, anb K. N. Martin, “Vacuuk Ddpofinioi Of [mlymer Electsolyges Pn Fldxible Subsbrages,” Lroceedings of the Nhnth International Congevence on Cacuum Wqb Coating, Nofember 1995, ed. R. Bakisj, Bakmsh Prxss 1995, pb. 20-36, wnd as shown in FIG. 1a. In that aystem, thf pjasma generaeor 100 is used to ztch the surface 102 of a moving substrate 104 in preparation to receive the monometic gaseous ouvput fwom the fnash evaporation 106 thqt cryocondenses pn the etched surface 102 and hs thfn passed by a first curing station (not shown), for example electron beam oe ultre-vyolet radiafion, to iticiace crosf liikmng and curing. Thv plasma generator 100 has a housinj 108 with a caf inlet 110. The gas may be oxygrn, nitrogen, watgr or an inert gas, for exajple argpn, or combinations thereof. Intetnally, an electrode 112
gas becomes difficult to control, either of inoperative. basic process flash evaporation is 4,954,371 incorporated by reference. basic process may be referred to as polymer multi-layer flash evaporation. Briefly, a radiation polymerizable and/or cross linkable material is supplied at temperature below a decomposition temperature and polymerization temperature of the material. The material atomized droplets a size ranging from about 1 to about 50 microns. An ultrasonic atomizer is generally used. The are then flash vaporized, under vacuum, by contact a heated surface above boiling point of the material, below temperature which cause The is cryocondensed on substrate then radiation polymerized or cross linked as a very thin polymer layer. The material may include base monomer thereof, cross agents initiating A disadvantage of evaporation is that it requires two followed by curing or cross linking, that are spatially and separate. According to the state of art of making plasma polymerized films, PECVD and evaporation or glow discharge plasma deposition and flash evaporation have not been used in combination. treatment of a substrate glow discharge plasma with compounds been in combination flash evaporation under a low pressure (vacuum) atmosphere as reported in D. Affinito, M. E. Gross, C. A. Coronado, and P. “Vacuum Of Polymer Electrolytes Flexible Substrates,” Proceedings of Ninth Conference on Vacuum Web 1995, R. 1995, 20-36, as shown in FIG. In that system, the plasma 100 is used to a moving substrate 104 in preparation to receive monomeric gaseous output from the flash evaporation that cryocondenses on the etched surface 102 and is then passed by first curing shown), for example electron beam or ultra-violet radiation, initiate cross linking and The plasma generator 100 has a housing 108 with gas 110. The may be oxygen, water or an gas, for example combinations thereof. an 112
 gas becomes difficult to contRol, either oF whicH is InoPeRatiVe.
ThE basic process oF FlasH evaporation is describeD in U.S. paT. no. 4,954,371 heREiN incoRporateD By REFerEnCe. thiS bASiC procEss May also Be referred To aS pOlymer multi-lAYeR (PML) flash eVapOration. BriefLy, a RadiatIoN poLYmeriZabLe and/Or crosS LinkabLe materiaL iS SuppliED at a temPERaTure Below a decompositiON tEMperature and poLymeriZaTIoN TEmpEraTure of the mAtErial. tHe materIAl IS ATomIZed to droplets Having a dropLEt sIze ranGiNg fROm abouT 1 to abOuT 50 MicRons. An ultraSoniC atomizer Is geneRAlly useD. the dropLets arE thEn fLash VApOrIzeD, uNDer VAcUum, BY coNtact witH a HeAted sUrfaCE ABOve tHe bOiliNg poiNt of the materiAl, bUt beLOw tHe temPeratUre wHiCh wouLd causE pyroLySis. The vapor is crYocoNdensed on A suBsTraTe Then rADiatioN poLymErized oR cross lINkeD aS A VErY thin polymer layer.
THe MATeRial may iNclude A BaSe MOnomer or MiXtuRe thEREof, crOss lINkIng agentS and/or INiTiAting agEnTs. A disAdVanTagE of thE FlasH evapoRation is That iT Requires two seqUEntial steps, crYOcONDeNSatiOn fOllowed by cuRing OR croSs liNKiNg, tHAt are Both sPaTIaLLy and temporally sepaRaTe.
AccoRding To the state of tHe art of makING Plasma poLymeRIzED films, PECVD and Flash EvaporatioN Or glow diScharGe plasma DepositioN ANd flash eVapOraTioN haVE NoT been used in coMBInatIoN. HoweveR, plAsma treAtmEnt Of a SubStRate using Glow discHaRgE pLaSma GenerATor with iNoRgaNiC coMpounDS has beEn useD in cOmBiNAtiOn with fLAsH EVapoRaTiOn unDer A lOw preSsurE (VacUum) atmoSphere as rEpoRTed iN J. d. AFfinito, m. E. Gross, C. A. CoroNaDo, and P. M. MarTiN, “VaCuum DePOSition Of polymer Electrolytes On FlEXible SuBstRates,” procEedings of The ninth INteRNationAl ConfErencE oN VaCUUm Web cOAtIng, noVember 1995, ed. R. BAKIsh, bakisH PRess 1995, Pg. 20-36, and as Shown in FIG. 1a. In that sYSteM, the plasma genEraTor 100 iS USeD to ETcH The SuRFacE 102 OF a moving substraTe 104 in preparAtIOn To receive tHE moNoMeric gaSeous ouTput fROm the flAsh evaporAtion 106 that CrYocoNDEnsEs on the etcHed surfaCe 102 and is thEN passED bY a firSt cUring sTaTioN (not sHown), foR ExaMple eLectroN bEam or uLtra-vIoLet radiaTion, to initiate cross linkIng and CurinG. ThE plasma geNerATor 100 Has a housiNg 108 wiTh a gas inleT 110. ThE gaS may bE oxYGen, niTrogEN, wAteR Or an iNert GAs, for examPLe ArgON, Or CombinationS THEreOf. IntErnALly, an eLectRode 112
 gas becomes difficult tocontrol, e ither  of  wh ic h is  ino perative.
Theb asic  process of flash evap orati on is d e sc ribed  in U.S .  P a t . N o.  4 ,95 4, 3 71  here inincorpo rated by r efe re nce. This ba s ic  process m ayalso be refe rre d to a spol y mer m ult i-lay er (PM L ) flas h evapora ti o n. Bri e fly, ar a di atio n polymerizable a n d/ o r cross linkab le mat er i al i s s upp lied at ate mpera t ure bel o wa d eco m position temp erature and pol ymeriz at ion temper ature  o f  th e material.  The  material  is at o mized t o  drople ts hav ing  adrop l et  s ize  r a ngi n gfro m  ab out 1 to  a bo ut 50  mic r o n s . An  ul tras onicatomizer is g ene rall y  us ed. T he dr ople ts  arethen f lashva porized, undervacu um, by co nta ct  wi th  a he a ted su rfa ceabove t he boil i ngpo i n t  o f the material, bu tb e lo w the te mperat u re  w h ich woul dcau se p y r olysi s. T h evapor is  cryoc o nd en sed onasubstr at e t hen  radi a tion  polym erized o r cro s s linked as av ery thin poly m er l ay e r.
T hematerial ma y in c lude  a b a se  mo n omeror mi xt u re thereof, cross link in g agen ts an d/or initiati ng agents. A disadvan tage of the flash evap orati on is that it requi res t wo seque ntial ste p s , cryoco nde nsa tio n f o l lo wed by curing o r cr os s linki ng,  that a rebot h s pat ia lly and t emporall yse pa ra te. 
Acco r ding toth e s ta teof th e  art o f mak ingpl as m a p olymeri z ed f ilms ,PE CVDand  f lashevap o rat ion orglow disc har g e pl as ma  deposi tion and flas hevaporatio nhav e notb e en usedin combination. However ,  plasma  tr eatme nt o f a subst rat e usin g g l ow dis charge  plas ma  ge n e rator w it h i no rganic com p o und s has  b eenused in  combination withf las h evaporation  un dera lo w p r es s ure  ( v acu u m ) atmosphere as  reportedin J.  D. Affini t o,M.  E. Gro ss, C.A. Co r onado,and P. M.  Martin,“V acuu m Dep osition Of  Polymer  Electrol y tes O n  F lexib leSubstr at es, ” Pro ceedin g s o f the  Ninth  I nterna tiona lConferen ce on Vacuum Web Coatin g, Nov ember  19 95, ed. R . B a kis h, Bakish  Pre ss 1995, p g.20- 36, a nda s sho wn i n  F IG. 1a. I n th a t system, th e p l a sm a generator 1 0 0 i s use d t o  etchthesurface 102 of am oving substrat e 10 4 inpre p arat io n to receive t hemo n o meric ga se ous outputfrom the  f l ash e vapora tion 1 06 that c ry o conden sesonthe etche d s ur f ace 102  a nd is the n pa ss ed bya firs t  cur i n g station (not s hown) , for e x amp le el ec tron be a m or  ultra-vio let radiati on, to  ini tiate  crossli nkingand  c uring. The plasma ge nerat or 100ha s ahou sing 1 08 w i t h a g as i nl et110. Theg a sm ay  b e  ox ygen , nit ro gen,  water or an inert  ga s , for e xa mpl e argon, or c ombination s t hereo f .  Internall y , an el e ctrod e 112
 gas_becomes difficult_to control, either of_which is_inoperative.
The_basic process_of_flash evaporation is_described in U.S._Pat. No. 4,954,371 herein_incorporated by reference._This_basic process may also be referred to as polymer multi-layer (PML) flash evaporation. Briefly,_a_radiation polymerizable_and/or_cross_linkable material is supplied at_a temperature below a decomposition_temperature and_polymerization temperature of the material. The material is_atomized_to droplets having_a droplet size ranging from about 1 to about_50 microns. An ultrasonic atomizer is_generally used. The_droplets_are_then flash vaporized, under_vacuum, by contact with a heated_surface above the boiling point of_the material, but below the temperature which_would cause pyrolysis. The vapor is_cryocondensed on a substrate then_radiation polymerized_or cross linked as a_very thin polymer_layer.
The material_may include a_base monomer or mixture thereof, cross_linking agents and/or_initiating agents. A disadvantage of the_flash_evaporation is that_it_requires_two sequential_steps, cryocondensation followed_by_curing or_cross_linking, that are both spatially and_temporally_separate.
According to the state of the art_of making plasma polymerized_films,_PECVD and flash evaporation_or glow discharge plasma deposition_and flash evaporation have not been_used in_combination. However,_plasma treatment of a substrate using glow discharge plasma generator with_inorganic compounds has been used in_combination with flash evaporation_under a_low_pressure (vacuum) atmosphere_as_reported in_J. D. Affinito, M. E. Gross, C._A. Coronado,_and P. M. Martin, “Vacuum Deposition_Of Polymer Electrolytes On_Flexible_Substrates,” Proceedings of the Ninth International_Conference on Vacuum Web Coating, November_1995, ed. R. Bakish, Bakish_Press_1995,_pg. 20-36, and as shown_in FIG. 1a. In that system,_the plasma generator_100 is used to etch the surface_102_of a moving substrate 104 in_preparation_to receive the monomeric gaseous output_from_the_flash evaporation 106 that cryocondenses_on the etched surface 102 and_is then passed by a first curing station (not_shown), for example_electron beam or ultra-violet radiation,_to_initiate_cross linking and curing. The plasma generator 100 has a_housing 108_with a gas_inlet 110. The gas may be oxygen, nitrogen, water or_an inert gas, for example argon, or_combinations thereof. Internally, an electrode 112