<https://cn.element14.com/kemet/ckc21c204kcglctu/cap-0-2uf-500v-mlcc-2220/dp/3677976>
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"KC-LINK&trade; with KONNEKT&trade; technology surface mount multilayer ceramic chip capacitors are designed for high efficiency and high density power applications. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution for high density packaging. By utilizing KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers and resonators where high efficiency is a primary concern. KONNEKT technology enables a low loss, low inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. With an operating temperature range up to 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling."
<https://cn.element14.com/kemet/ckc21c204kcglctu/-0-2uf-500v-mlcc-2220/dp/3677976>