<http://schema.org/description>
"A dynamically software controlled electroplating tooling concept has been developed to compensate the pattern dependence of the deposited layer thickness on different substrates.  In this paper a validation of this new tooling concept on industry relevant printed circuit boards is presented.  Simulations are compared with experimental results as obtained in a prototype electroplating cell.  A quantitative improvement of the plating thickness uniformity between a standard electroplating cell and the advanced tooling approach is given.  The influence of the conductivity of the electrolyte on the deposit distribution is studied and indicates a way to obtain a significant improvement in uniformity."^^<http://www.w3.org/2001/XMLSchema#string>
<http://www.pfonline.com/articles/validation-of-new-generation-tooling-concept-for-electroplating-of-copper-on-printed-circuit-boards>