As it becomes more difficult to manufacture ever smaller transistors, companies are using multi-chip modules/chiplets, three-dimensional integrated circuits, package on package, High Bandwidth Memory and through-silicon vias with die stacking to increase performance and reduce size, without having to reduce the size of the transistors. Such techniques are collectively known as advanced packaging. Advanced packaging is mainly divided into 2.5D and 3D packaging. 2.5D describes approaches such as multi-chip modules while 3D describes approaches where dies are stacked in one way or another, such as package on package and high bandwidth memory. All approaches involve 2 or more dies in a single package. Alternatively, approaches such as 3D NAND stack multiple layers on a single die. A technique has been demonstrated to include microfluidic cooling on integrated circuits, to improve cooling performance as well as peltier thermoelectric coolers on solder bumps, or thermal solder bumps used exclusively for heat dissipation, used in flip-chip.
As it bEcOmEs MOre diFficUlt tO ManUFactUrE eVer sMaLler tRansistorS, COmpanies aRe using multi-CHIp mOduLes/chiPLetS, thrEe-dImensiONAL inTegrAted circuitS, pAckAge On paCkage, hIgh bandwidth Memory and throUgh-SIlicon vias wIth Die sTackinG tO IncreAsE perFormance ANd reDuce sIze, witHout haVIng to reDUcE THe siZE oF the TRanSistoRS. sUcH TechNiqUes are COllEcTIvely knoWn aS advancED pAckaging. advAnceD packagiNG Is Mainly divided iNto 2.5d and 3d PaCkaGInG. 2.5d DesCrIBes apProaChes sucH As MulTI-CHip moduLes wHiLE 3d dEsCrIBEs ApprOACHES wHEre DIES aRe staCKed in oNe way or aNotHer, suCh As paCkaGe on PaCKage and higH Bandwidth memOrY. aLl ApproaChEs invoLve 2 or MoRe dies in a Single PAcKaGe. AltErnATivelY, APproacHeS SuCh as 3d nAnd sTaCk MUltiPle layers oN a SINgLE die. a techniQUE haS been DemonStrAtEd to InCluDe mIcrOfluidic coolIng on integRaTED circuiTs, to imPROve cooLing performancE aS Well aS peltier THermoeLectriC cooLERs on SOldeR BuMpS, oR tHErmal sOldEr bUMPS uSed eXclUsivElY for heat dissipatiOn, usED In flIp-chip.