Unpackaged transistor chips (die) may be assembled into hybrid devices. The IBM SLT module of the 1960s is one example of such a hybrid circuit module using glass passivated transistor (and diode) die. Other packaging techniques for discrete transistors as chips include direct chip attach (DCA) and chip-on-board (COB).
UNpackaGed trAnsIstor chIps (die) MAY be aSsembLed inTo HYbrid DevIces. THE IbM SLt mODuLe oF The 1960s is oNe examPlE of SUch A hybRID cIRcUit module using glaSs pasSiVatEd TRansistor (and DiOdE) die. oTHer PAckagiNg tecHniqUES for DiScRetE TraNsIStoRs aS chips include direct chip attacH (dCA) and chip-on-boaRd (cOb).