Sputtered atoms are ejected into the gas phase but are not in their thermodynamic equilibrium state, and tend to deposit on all surfaces in the vacuum chamber. A substrate (such as a wafer) placed in the chamber will be coated with a thin film. Sputtering deposition usually uses an argon plasma because argon, a noble gas, will not react with the target material.
sputtered atoms are ejected into the gas phase but are not in their thermodynamic equilibrium state and tend to deposit on all surfaces in the vacuum chamber a substrate (such as a wafer) placed in the chamber will be coated with a thin film sputtering deposition usually uses an argon plasma because argon a noble gas will not react with the target material