Several DIP variants for ICs exist, mostly distinguished by packaging material: Ceramic dual in-line package (CERDIP or CDIP) Plastic dual in-line package (PDIP) Shrink plastic dual in-line package (SPDIP) – A denser version of the PDIP with a 0.07 in (1.778 mm) lead pitch. Skinny dual in-line package (SDIP or SPDIPFor instance, Microchip: http://www.microchip.com/packaging) – Sometimes used to refer to a "narrow" 0.300 in. (or 300 mil) wide DIP, normally when clarification is needed e.g. for DIP with 24 pins or more, which usually come in "wide" 0.600 in wide DIP package. An example of a typical proper full spec for a "narrow" DIP package would be 300 mil body width, pin pitch.
several dip variants for ics exist mostly distinguished by packaging material ceramic dual in-line package (cerdip or cdip) plastic dual in-line package (pdip) shrink plastic dual in-line package (spdip) – a denser version of the pdip with a 007 in (1778 mm) lead pitch skinny dual in-line package (sdip or spdipfor instance microchip http//wwwmicrochipcom/packaging) – sometimes used to refer to a "narrow" 0300 in (or 300 mil) wide dip normally when clarification is needed eg for dip with 24 pins or more which usually come in "wide" 0600 in wide dip package an example of a typical proper full spec for a "narrow" dip package would be 300 mil body width pin pitch