3. The method of manufacturing an electronic circuit according to claim 1 and wherein said employing a pick & place machine-specific component placement sequence, comprises employing at least a first database containing at least one of pick & place machine independent geometric component data and pick & place machine-independent, component supply data and a second database containing component manufacturer-independent, pick & place machine-specific rules.
3. The method of manufacturing an electronic circuit according to claim 1 and wherein said employing a pick & place machine-specific component placement sequence, comprises employing at least a first database containing at least one of pick & place machine independent geometric component data and pick & place machine-independent, component supply data and a second database containing component manufacturer-independent, pick & place machine-specific rules. 5. The method of manufacturing an electronic circuit according to claim 3 and wherein said first database comprises at least one of: a mapping of Component Vendor/Catalog Numbers (CV/Cat#s) to component vendor-specific component geometric parameters (CCL); a mapping of CV/CatHs to component supply form parameters (CCSL); a mapping of PCNs to component supply form parameters (UMCSL); a mapping of PCNs to CV/Cat#s (MCVL); a mapping of Designer Component Number (DCN) to PCN; a user maintained mapping of CV/Cat# to component vendor-specific component geometric parameters (UMCL); and a mapping of PCN to generic component geometric parameters.