9. The method of claim 8 , wherein transforming the die stack into at least two separate dies involves: identifying a transform boundary between the first die and the second die; and separating the first die from the second die to create a first transformed die and a second transformed die, respectively, wherein the first transformed die includes the first die and at least one metal layer adjacent to the transform boundary in the second die; wherein the second transformed die includes the second die and at least one metal layer adjacent to the transform boundary in the first die; and wherein including at least one metal layer from an adjacent die facilitates maintaining equivalency between the two transformed dies and the die stack.
9. The method of claim 8 , wherein transforming the die stack into at least two separate dies involves: identifying a transform boundary between the first die and the second die; and separating the first die from the second die to create a first transformed die and a second transformed die, respectively, wherein the first transformed die includes the first die and at least one metal layer adjacent to the transform boundary in the second die; wherein the second transformed die includes the second die and at least one metal layer adjacent to the transform boundary in the first die; and wherein including at least one metal layer from an adjacent die facilitates maintaining equivalency between the two transformed dies and the die stack. 11. The method of claim 9 , wherein the first die is a TSV die.