3. The method of manufacturing an electronic circuit according to claim 1 and wherein said employing a pick & place machine-specific component placement sequence, comprises employing at least a first database containing at least one of pick & place machine independent geometric component data and pick & place machine-independent, component supply data and a second database containing component manufacturer-independent, pick & place machine-specific rules.
11. The method of manufacturing an electronic circuit according to claim 3 and also comprising, prior to said employing a pick & place machine-specific component placement sequence: obtaining at least one PCN for each of said components; searching said first database for pick & place machine independent component supply data corresponding to said at least one PCN for each of said components; and searching said first database for pick & place machine independent geometric component data corresponding to said at least one PCN for each of said components.