20. The method of claim 17 , further comprising: triggering DEM manufacturing activities comprising in-line monitoring, process change by the classified at least one of the one or more hotspots, validating the classified at least one of the one or more hotspots through manufacturing, or a combination thereof.
17. The method of claim 1 , further comprising: receiving tape-out of a semiconductor chip design; performing data preparation and lithography verification and simulation to detect one or more hotspots; performing pattern analysis by utilizing pattern database, which is a feature of the knowledge database, to classify at least one of the one or more hotspots; and updating a pattern library associated with the pattern database.