3. The method of claim 1 , wherein the extracting information comprises extracting the information based on features profiling, pattern matching, simulations, lithography simulation, chemical-mechanical polishing (CMP) simulation, Critical Area Analysis (CAA) simulation, Manufacturing Analysis and Scoring (MAS) simulation, or any combination thereof.
1. A method comprising: using a computer for receiving design data related to layout of an integrated circuit (IC); extracting information from the design data; performing analysis on the extracted information; enabling design-for-manufacturing (DFM) and design-enabled-manufacturing (DEM) aware manufacturing (collectively DFM-DEM) applications using information stored in a knowledge database, wherein the knowledge database stores information related to DFM and DEM for facilitating DFM-DEM aware manufacturing; and updating the knowledge database with new information learned from at least the extracted information and the analysis.