1. An integrated circuit device on a substrate, comprising: a number of semiconductor surface structures spaced apart along the substrate; a number of plugs contacting the substrate between the number of surface structures, wherein the number of plugs includes an inner plug and a pair of outer plugs, each one of the outer pair being formed adjacent to and on opposing sides of the inner plug, each one of the outer pair having upper portions, wherein the upper portions cover areas of the surface structures; and an inner electrical contact coupling to the inner plug and separated from the upper portions by a pair of opposing spacers.