1. A process for fabricating a device wherein the device comprising a top conductive layer over an insulating layer over a bottom conductive layer over a substrate, the process comprising: (a) removing a portion of the top conductive layer; (b) selectively removing the remaining top conductive layer with respect to the underlying insulating layer; and (c) removing a portion of the underlying insulating layer to expose the bottom conductive layer at a location farther than the thickness of the insulating layer.