1. An integrated circuit die comprising an array of tiles, the tiles arranged in rows and columns, wherein one of the tiles is a routing tile having four edges, the routing tile having other tiles adjacent each of its four edges, the routing tile comprising: a first routing conductor that extends to a first of the four edges of the tile; and a micropad that has an exposed and conductive upper surface, the micropad being couplable to the first routing conductor such that a signal received onto the micropad from a source external to the integrated circuit die can be communicated from the micropad to the first routing conductor and to the first of the four edges of the tile.