1. An electronic assembly comprising: an interposer; a plurality of die disposed at a surface of the interposer and connected via one or more metal layers of the interposer; and a multi-hop network to route packets among the plurality of die, the multi-hop network comprising a router partition and a link partition, the routing partition comprising routing logic disposed at each die of at least a subset of the plurality of die and the link partition comprising the one or more metal layers of the interposer.