1. A method for detecting spatial failures in a wafer, the method comprising: using a processing system including a processor, to perform at least the following steps: receiving failure coordinates for the wafer, each failure coordinate indicating a spatial failure; generating a failure array based on a resolution of the failure coordinates; detecting a first set of objects in the failure array using transformations; detecting a second set of objects in the failure array using cluster signature analysis; and detecting a third set of objects in the failure array, the third set of objects being combinations of at least two objects in the first and second sets of objects.