1. A method for detecting a first fault condition of a plurality of fault conditions during processing of a first substrate, said method comprising: collecting first data via sensors during said processing of said substrate, wherein said first data includes a first set of samples and a second set of samples; sending said first data to a fault device; processing said first data via said fault device including determining a corrected fault vector including determining a drift vector corresponding to drift in one or more parameters of a plasma processing chamber, determining an uncorrected fault vector based on the first set of samples and the second set of samples, and based on the drift vector, correcting the uncorrected fault vector to generate the corrected fault vector, and comparing a first portion of said first data to a plurality of fault models stored within a fault library, wherein said plurality of fault models correspond respectively to said plurality of fault conditions, wherein said plurality of fault models include respective ones of (i) a plurality of fault vectors, (ii) a plurality of fault boundaries, and (iii) sets of principal component analysis (PCA) parameters, and wherein said plurality of fault vectors include said corrected fault vector; and detecting said first fault condition based on said comparing of said first portion of said first data to said plurality of fault models.