1. An interconnect structure for electrically connecting individual circuits and devices on an integrated circuit formed on a semiconductor substrate, said structure comprising at least one refractory core formed on an insulating layer, having a generally rectangular cross-section and having its opposed sidewalls covered and in electrical and physical contact with low resistivity fillets of at least one material selected from the group consisting of aluminum, gold and copper and alloys thereof and having its top surface available for refractory to refractory contact making and its bottom surface available for refractory to refractory contact or refractory to semiconductor contact making, said sidewall material being segmented, comprising discontinuous sections thereof.