1. A method of selectively reshaping the surface of a patterned photoresist, comprising: a) providing a patterned photoresist layer overlying a layer of antireflective material; b) accelerating oxygen-comprising species with directionality normal to a surface of said patterned photoresist; c) applying said oxygen-comprising species to said surface of said patterned photoresist until said surface is reshaped to remove standing waves from said surface and to remove at least a portion of a foot present at an interface between said patterned photoresist and said layer of antireflective material.