1. A circuit module comprising: a base element integrated circuit having at least two major surfaces and comprising a first and a second set of contacts; a support element integrated circuit having at least two major surfaces and comprising a first and a second set of contacts, the base element integrated circuit and the support element integrated circuit being in a stacked disposition relative to each other; a flex circuit comprising a first conductive layer disposed at a first conductive layer level of the flex circuit and a second conductive layer disposed at a second conductive layer of the flex circuit, between which levels is an intermediate layer, the first conductive layer level having base element flex contacts and the second conductive layer level having support element flex contacts, the base element flex contacts at the first conductive layer level being in contact with the first and second sets of contacts of the base element integrated circuit and the support element flex contacts at the second conductive layer level being in contact with the first and second sets of contacts of the support element integrated circuit.