1. An improved, non-brominated photosensitive cationically polymerizable epoxy composition for use as soldermask comprising; a. a non-brominated epoxy resin system comprising: i. from about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A, having a molecular weight of between about 40,000 and about 130,000 and a weight per epoxide of from about 20,000 to about 65,000; ii. between about 0% and about 90% by weight of an epoxidized multifunctional bisphenol A formaldehyde novolak resin having a molecular weight of between about 4,000 and about 10,000 and a weight per epoxide of about 180 to 500; iii. between about 25% and about 85% by weight of a solid epoxidized glycidyl ether of bisphenol A having a softening point of between about 60° C. and about 110° C. and a molecular weight of between about 600 and about 2,500 and a weight per epoxide of about 300 to 1250; and, b. from about 0.1 to about 15 parts by weight per 100 parts resin system of a cationic photoinitiator capable of initiating polymerization in said epoxy resin system upon exposure to actinic radiation.