1. A superconducting probe card comprising: a printed circuit board including a dielectric medium that carries at least one conductive trace, wherein the at least one conductive trace is superconducting below a first critical temperature; and at least one conductive needle that is at least partially formed by a material that is superconducting below a second critical temperature, wherein the at least one conductive needle is communicably coupled to the at least one conductive trace and the at least one conductive needle includes a first end that is tapered to form a point, wherein: the first critical temperature of the at least one conductive trace and the second critical temperature of the at least one conductive needle are both approximately equal to or greater than an operating temperature of the superconducting probe card; the printed circuit board carries at least one contact pad that is formed by a material that is superconducting below a third critical temperature, and wherein the at least one contact pad is superconductingly communicably coupled to the at least one conductive trace and the communicable coupling between the at least one conductive trace and the at least one conductive needle is realized through the at least one contact pad; at least a portion of the at least one conductive needle is coated with a solderable material that is superconducting below a critical temperature; and the at least one conductive needle is communicably coupled to the at least one contact pad on the printed circuit board by a superconducting solder connection.