1. A method of forming a patterned conductive multilayer arrangement on a semiconductor substrate comprising the steps of: providing a dielectric insulation layer on a surface of a semiconductor substrate having a first conductive layer disposed in a selective region thereon such that the insulation layer overlies the region of the first conductive layer; providing a silicon oxynitride layer on the insulation layer sufficiently to form a dielectric antireflective coating thereon; providing an essentially reactive nitrogenous substance-free dielectric spacer layer on the antireflective coating silicon oxynitride layer sufficiently to prevent reactive nitrogenous substance transport therethrough from the silicon oxynitride layer; providing a photoresist layer on the dielectric spacer layer; selectively exposing and developing the photoresist layer to uncover selective pattern portions of the underlying dielectric spacer layer, which pattern portions are in overlying relation to the first conductive layer region in the substrate; removing the uncovered pattern portions of the dielectric spacer layer and corresponding underlying portions of the silicon oxynitride layer for uncovering corresponding portions of the underlying insulation layer; and removing the uncovered portions of the insulation layer to uncover corresponding portions of the region of the first conductive layer in the substrate.