1. An integrated circuit, comprising: a first tier; a first back-end-of-line layer on a first side of the first tier, the first back-end-of-line layer comprising a conductive layer coupled to a contact point on a surface of the first tier by a via; and a first contact extending through opposing surfaces of a source region or a drain region in the first tier, the first contact coupled to the conductive layer opposite the via and configured to provide an electrical path through the first tier.