1. A method of processing a semiconductor wafer, the method comprising: forming a layer on a surface of a semiconductor wafer; obtaining dimensional information describing a first feature on the layer; developing a multiple parameter characterization of the first feature from the first feature dimensional information; and providing the multiple parameter characterization of the first feature as an input to a process control neural network to identify a first process control parameter useful for controlling a process to develop a design feature having predetermined dimensions from the first feature.