1. A multi-chip package (MCP), comprising: a first chip, comprising error detection logic and a first fail signature storage element; wherein the first chip is a volatile memory chip; a second chip, comprising a second fail signature storage element; wherein the second chip is a non-volatile memory chip; and a controller chip configured to copy the fail signature data from the first chip to the second chip; wherein the first and second fail signature storage elements are configured for storing fail signature data related to memory errors detected in the MCP; and wherein the chips are encapsulated in packaging thereby forming the multi-chip package.