1. A method for performing enhanced wafer quality prediction in a semiconductor manufacturing process, the method comprising steps of: obtaining, with a processor, data including at least one of tensor format wafer processing conditions, historical wafer quality measurements and prior knowledge relating to at least one of the semiconductor manufacturing process and wafer quality; building, with said processor, a hierarchical prediction model including at least the tensor format wafer processing conditions; and predicting, with said processor, wafer quality for a newly fabricated wafer based at least on the hierarchical prediction model and corresponding tensor format wafer processing conditions.