1. An integrated circuit comprising: a first interconnect; at least one vertically oriented semiconductor body over the first interconnect, wherein a first end of the at least one vertically oriented semiconductor body is in electronic contact with the first interconnect; a gate structure surrounding channel portion of the at least one vertically oriented semiconductor body, wherein the gate structure is configured as a second interconnect; a third interconnect over the gate structure, wherein a second end of the at least one vertically oriented semiconductor body is in electronic contact with the third interconnect; and a via configured to provide: an electrical connection between the first interconnect and the gate structure; an electrical connection between the third interconnect and the gate structure; an electrical connection between the first interconnect and the third interconnect; and/or an electrical connection between the first interconnect, the gate structure, and the third interconnect.