1. A semiconductor wafer processing machine, comprising: a first loadlock means for receiving a cassette of semiconductor wafers for processing; a second loadlock means for receiving processed wafers; at least one processing chamber; at least two wedge valves; said first loadlock means being in communication with a wafer processing chamber through a first wedge valve when said first wedge valve is open; said second loadlock means being in communication with a wafer processing chamber through a second wedge valve when said second wedge valve is open; each said loadlock means, wedge valve and processing chamber being vacuum-tight and having means for attachment to an external vacuum pumping means; computer means for controlling each said loadlock means, wedge valve and processing chamber; each said wedge valve including; a valve housing having input port and output port; a valve wedge having surfaces sealing to said input and output ports, said valve wedge sealing surfaces being sloped relative to each other, said valve wedge having a storage notch between said sealing surfaces; means for sliding said valve wedge within said housing from a sealing position to an open position so that said valve wedge is clear of a line sight through said input and output ports; a workpiece handling arm capable of being stored in a folded position in said storage notch when said valve is closed.