1. A method for characterizing a semiconductor plasma process, the method comprising the steps of: collecting input and output training data, the input training data being based on variables associated with electrical power used to control a plasma etching chamber and resulting from execution of the plasma process; and generating fuzzy logic-based input and output membership functions based on the training data; said membership functions enabling estimation of an output parameter value of the plasma process such that the membership functions characterize the plasma process with regard to the output parameter.