1. A dual damascene process comprising the steps of: forming a contact hole in an oxide layer; disposing a layer of anti-reflective coating material on top of the oxide layer and filling the contact hole with the anti-reflective coating material; etching the anti-reflective coating material to expose portions of the oxide layer; etching the exposed portions of the oxide layer to form a wiring trough; removing the anti-reflective coating material; and filling the contact hole and the wiring trough with a metal.