1. A computer-implemented method of detecting features on a semiconductor wafer comprising: collecting data with a plurality of detectors that are positioned about the semiconductor wafer, wherein each detector collects one data frame for each of a plurality of device areas; transmitting the data frames from each detector to a data distribution node, which is part of a set of data distribution nodes; transferring a first data frame along a first data transfer path that connects a first and a second data distribution node; transferring a second data frame along a second data transfer path that connects the first and second data distribution nodes; routing the data frames from the data distribution nodes to processing nodes, wherein the transferring of data frames between data distribution nodes allows data from any one of the detectors to be routed to any one of the processing nodes; processing the data frames within each of the processing nodes, wherein the processing within each processing node includes a composite-row based analysis that involves, generating a plurality of first composite images, each of the first composite images being made up of each of the data frames collected by one of the detectors, wherein each data frame corresponds to a respective device area; and comparing each of the first composite images in order to obtain defect information.