1. A method of making a device comprising the steps of: forming a first conductive material; forming an active material in electrical communication with said first conductive material; forming a second conductive material in electrical communication with said active material, said second conductive material being formed at a temperature less than 300° C., said second conductive material including pores, said pores providing channels to said active material; and forming a containment layer on said second conductive material, said containment layer covering said pores and sealing said active material from the environment surrounding said device.