1. A mixed three-dimensional printed memory (3D-P) comprising a plurality of memory blocks including a 3D-P block, wherein: said 3D-P block comprises a plurality of vertically stacked memory levels including a topmost memory level, wherein said topmost memory level is the topmost memory level among all of said memory levels; said 3D-P block comprises a first memory array in said topmost memory level; said 3D-P block further comprises at least second and third memory arrays in a memory level below said topmost memory level, wherein said second and third memory arrays are located on a same memory level and do not share any address-select line; said first memory array fully covers both said second and third memory arrays.