1. A device including a non-volatile memory device comprising: a first electrode disposed upon a semiconductor substrate; a second electrode comprising a metal material; a resistive switching material layer comprising an amorphous silicon material overlying the first electrode; a dielectric material layer disposed between the second electrode and the resistive switching material layer, the dielectric material layer being sufficiently thin to electrically breakdown in a region when a first voltage is applied to the second electrode and to cause formation of an electrical breakdown open region in a portion of the dielectric material layer, the electrical breakdown open region having a first dimension to allow a first metal region to form within the portion of the dielectric material layer and extending in a portion of the resistive switching material layer from the metal material; and a buffer material layer comprising a p+polycrystalline silicon-containing material disposed between the first electrode and the resistive switching material layer to control an interfacial defect level between the first electrode and the resistive switching material layer; and wherein the non-volatile memory device includes at least the buffer material layer, the dielectric material layer, the resistive switching material layer and a portion of the second electrode.