1. A 3D stacked electro-optical radiation imaging device with a plurality of integrated circuit layers, the device comprising: a pixelated array of semiconductor detector elements, in which each detecting element is electrically connected a stacked integrated circuit; the stacked integrated circuit having a mixed signal layer and a reconfigurable layer; wherein the mixed signal layer has a passive signal path and an active signal path; wherein a readout decoder block controls operation of the passive paths and wherein the active signal path triggers readout upon transient event detection and is readout by an address arbitration control block, the address arbitration control block operating independent and asynchronous to the readout of the passive path, and wherein transient event detection initiates the identification of the location of and readout of the signaling active path; wherein the reconfigurable layer has processing units that each correspond to one or more pixels in the pixelated array, the processing units reconfigurable through signals from either the passive path, the active path, or an external signal; and a controller that programs and communicates with the mixed signal layer and reconfigurable layer.