1. An electronic device yield prediction system for predicting manufacturing yield of an electronic device, wherein: the electronic device yield prediction system comprises: a defect density calculation unit, which calculates total number of defects occurring in a manufacturing line; a critical area calculation unit, which calculates a critical area; and a yield calculation unit, which calculates the manufacturing yield by using defect density of the manufacturing line, which has been calculated by the defect density calculation unit, and a critical area of the electronic device, which has been calculated by the critical area calculation unit; and wherein the critical area calculation unit uses a critical area prediction model that calculates a critical area from product characteristics, which are factors characterizing the electronic device.