1. A method for fabricating a multi-layer printed circuit board containing embedded passive parts, comprising: performing a calibration step wherein a calibration measurement is taken of the geometry or at least one electrical parameter of an arrangement of calibration test points for one or more circuit forming processes; performing a process control step during the process, wherein a process control measurement is taken of at least one electrical parameter at one or more process control test points along one or more axes outside areas in which a circuit is to be formed; analyzing at least said calibration measurement and said process control measurement to calculate at least one CAD geometry change required to improve precision of embedded passive components to be printed on said multi-layer printed circuit board; modifying CAD geometry in accordance with the calculated CAD geometry change; manufacturing one or more multi-layer printed circuit boards containing embedded passive components in accordance with said modified CAD geometry.