1. An integrated circuit comprising: a substrate; a first plurality of layers including a first programmable circuit; a second plurality of layers including a pattern of metal layers that is associated with predetermined functionality for the integrated circuit; and a third plurality of layers including a second programmable circuit; wherein the first plurality of layers, the second plurality of layers, and the third plurality of layers are formed in a stacked manner, which utilizes a plurality of integrated circuit fabrication masks, on the substrate; and wherein the pattern of metal layers is configured to hard-wire the first programmable circuit and the second programmable circuit with the predetermined functionality.