1. A three-dimensional integrated memory (3DiM), comprising: a substrate circuit, said substrate circuit further comprising a substrate integrated circuit and a first address-decoder, said substrate integrated circuit comprising an embedded RWM and/or an embedded processor; a three-dimensional memory (3D-M), at least a memory level in said 3D-M being stacked on top of said substrate circuit, said memory level being connected with said substrate circuit through a plurality of inter-level connecting vias and/or contact vias.