1. A carrier board having opposite first and second sides thereof, said circuit board comprising: first and second pluralities of bonding pads affixed on said opposite first and second sides of said circuit board respectively; a first integrated circuit device having programmable pins bonded to at least a subset of said first plurality of bonding pads; a second integrated circuit device having pins bonded to at least a subset of said second plurality of bonding pads; a plurality of vias formed intermediate said opposite first and second sides of said circuit board for electrically interconnecting opposing ones of said subset of said first and second pluralities of bonding pads; and at least one conductive trace for electrically interconnecting one of said programmable pins of said first integrated circuit device to one of said pins of said second integrated circuit device.