1. A method for providing a dual magnetic junction on a substrate usable in a magnetic device, the method comprising: providing a first pinned layer; providing a first nonmagnetic spacer layer, the first pinned layer being between the first nonmagnetic spacer layer and the substrate; providing a free layer, the first nonmagnetic spacer layer being between the free layer and the first pinned layer; providing a second nonmagnetic spacer layer, the free layer being between the first and second nonmagnetic spacer layer; providing at least one additional layer; annealing at least the first pinned layer, the first nonmagnetic spacer layer, the free layer, the second nonmagnetic spacer layer and at least a bottom layer of the at least one additional layer at a temperature of at least three hundred and fifty degrees Celsius; and providing a second pinned layer, the second nonmagnetic spacer layer residing between the second pinned layer and the free layer, the free layer being between the substrate and the second pinned layer, the at least one additional layer being between the second nonmagnetic spacer layer and the second pinned layer, the step of providing the second pinned layer including depositing the second pinned layer after the annealing step; wherein the magnetic junction is configured such that the free layer is switchable between a plurality of stable magnetic states when a write current is passed through the magnetic junction.