1. An electrode and wiring forming method, comprising: a base pattern forming step of forming a base pattern on a substrate; an absorbing step of absorbing an organic metallic compound into the base pattern; and a baking step of baking the base pattern in which the organic metallic compound is absorbed, wherein the base pattern forming step includes: a step of applying a photosensitive resin containing a water-soluble photosensitive resin component and a water-soluble metallic compound onto the substrate; and a step of exposing the photosensitive resin.