1. One or more non-transitory processor-readable storage media storing computer-executable instructions for causing one or more processors to perform a method, the method comprising: receiving integrated circuit manufacturing process information and layout information of a layout design, the integrated circuit manufacturing process information comprising electrical characteristics of multi-layer substrates in or through which through-silicon vias in the layout design are to be fabricated; performing a function fitting process to generate parameters of a representation for magneto-quasi-static dyadic vector potential Green's functions at a plurality of frequencies of interest based on the integrated circuit manufacturing process information, the representation using a summation involving Hankel funtions to represent an integral involving a diagonal element of the magneto-quasi-static dyadic vector potential Green's functions along a direction perpendicular to the multi-layer substrates; computing matrix elements of a matrix for each frequency in the plurality of frequencies of interest based on the generated parameters, a set of electric current basis functions and the layout information, the set of electric current basis functions being cylindrical conduction mode basis functions, the matrix being a part of a linear system that formulates a relationship of electric current and electric potential difference in various regions associated with the through-silicon vias; computing impedance values associated with the through-silicon vias based on the matrix elements; and outputting the impedance values.