1. An apparatus, comprising: a device under test (DUT) array having a plurality of DUTs coupled in parallel and a plurality of localized heating elements associated with respective ones of the DUTs in the DUT array; and active logic elements coupled to the DUT array for selectively enabling or disabling electro-migration stress testing of individual DUTs in the DUT array, wherein the active logic elements are thermally isolated from the DUT array such that the active logic elements actively operating while the DUT array is subjected to heating by the plurality of localized heating elements.