1. A method comprising: defining zones of an integrated circuit manufacturing process tool, such that each of the zones corresponds to one or more hardware components of the integrated circuit manufacturing process tool; for each of the zones, grouping a subset of parameters of the integrated circuit manufacturing process tool into the zone based on the corresponding one or more hardware components; collecting inline parameter data associated with the parameters via at least one sensor associated with the integrated circuit manufacturing tool; for each of the zones, performing principle component analysis on a portion of the inline parameter data associated with the respective subset of parameters of the zone, wherein the principle component analysis includes: generating a probability mapping; utilizing the probability mapping to determine a set of principle components based on the portion of the inline parameter data; and reducing the set of principle components such that there are fewer principle components than parameters associated with the zone; and evaluating a condition of the integrated circuit manufacturing process tool based on the grouped parameters and the principle components of the principle component analysis.