1. A polymer film suitable for fabrication of integrated circuit, the polymer film is prepared from co-polymerization, under vacuum or inert atmosphere with a slow system leakage rate, of intermediate (A) and intermediate (B); wherein the intermediate (A) is an aromatic compound consisting of n′ reactive sites with n′ unpaired electrons; wherein the n′ is an integer of at least 2 but is smaller than, or equal to, the maximum number of sites for the sp 2 C substitution in the intermediate (A); wherein the intermediate (B) is a bridging compound consisting of n″ reactive sites with n″ unpaired electrons; and wherein the n″ is an integer of at least 2 but is smaller than, or equal to, the maximum number of sites for the sp 3 C substitution in the intermediate (B).