1. An integrated circuit comprising: a semiconductor layer consisting essentially of a semiconductor material; and a through-body via (TBV) formed within the semiconductor layer, the TBV comprising: an electrically conductive interconnect consisting essentially of one or more metal materials; and a polymer-based barrier layer consisting essentially of one or more polymer materials between the interconnect and the semiconductor layer, such that the one or more polymer materials is in direct contact with the semiconductor material, and the one or more polymer materials is also in direct contact with the one or more metal materials.