1. A method for monitoring fabrication processes of structured surfaces in a semiconductor production, the method which comprises: providing reference signatures of structured surfaces by measuring at least one distribution selected from the group consisting of a local distribution and an intensity distribution of images selected from the group consisting of diffraction images and scattered light images of a plurality of individual structures of surfaces of production prototypes having a specified quality; measuring at least one signature of a test specimen surface to be monitored by simultaneously registering a plurality of individual structures of the test specimen surface to be monitored for providing a measured signature; comparing the measured signature with the reference signatures for providing comparison results; and classifying parameters of the test specimen surface based on the comparison results.