1. A method, comprising: receiving optical profiles for a plurality of design target features associated with an integrated circuit device in a computing device; receiving optical profiles for a plurality of test features in the computing device; defining an optical proximity correction (OPC) model including a plurality of terms, each term relating to at least one parameter in the optical profiles; identifying a subset of the model terms as being priority terms in the computing device; matching parameters of the optical profiles of the test features to parameters of the optical profiles of the design target features using the priority terms in the computing device to generate a set of matched test features; and generating a metrology request in the computing device to collect metrology data from a test wafer having formed thereon at least a first subset of the matched test features and a second subset of the design target features.