1. An integrated circuit product comprising: a plurality of connection points; at least one layer comprising routing wires connecting said connection points; a first set of routing wires in said layer connecting along a first direction; a second set of routing wires in said layer connecting along a second direction, said second direction being orthogonal to said first direction; and said first set of routing wires having wire width values substantially different from the wire width values of said second set of routing wires.