1. An integrated circuit disposed on a semiconductor chip having opposing faces, said integrated circuit comprising: a plurality of functional circuit modules, each of said functional circuit modules including a plurality of inputs and at least one output, said at least one output having a first current drive capability; a plurality of I/O nodes of a first type, each including a first conductive structure disposed in a first I/O node array on a surface of one of the opposing faces of the semiconductor chip; a plurality of I/O nodes of a second type, each including a second conductive structure disposed in a second I/O node array on the surface of the one of the opposing faces of the semiconductor chip; a plurality of output buffers, each of said output buffers including an input and an output, said outputs of individual ones of said output buffers connected to a different one of said I/O nodes of a second type and having a second current drive capability larger than said first current drive capability; and an interconnect architecture including a plurality of conductors superimposed on said functional circuit modules, said interconnect architecture having a plurality of interconnect conductors, selected ones of said interconnect conductors connectable to said inputs and at least one output of selected ones of said functional circuit modules by electrically programmable interconnect elements, selected ones of said interconnect conductors connectable to other selected ones of said interconnect conductors by electrically programmable interconnect elements, selected ones of said interconnect conductors connectable to said first I/O nodes by electrically programmable interconnect elements, and selected ones of said interconnect conductors connectable to the inputs of selected ones of said output buffers by electrically programmable interconnect elements.