1. A method of forming an organoglass insulating layer, comprising the steps of: combining an organoalkoxysilane monomer with an aqueous solvent to form a silanol solution having greater than approximately 1.0 vol. % of organoalkoxysilane; subjecting said silanol to an aging period of at least several hours to promote molecular association and convert said silanol to a low molecular weight oligomer in solution; applying said low molecular weight oligomer to a substrate to form a discrete layer of highly associated cyclic oligomer thereon wherein said discrete layer of highly associated cyclic oligomer undergoes insitu poly condensation; heat treating said substrate to cause at least partial oxidative transformation of said cyclic oligomer film to produce a modified ladder-type silsesquioxane polymer and; treating said modified ladder-type silsesquioxane polymer in an oxygen plasma to form an organoglass.