1. A customized wafer that can be used to implement a customized application, the customized wafer comprising the following: at least one base layer configured in a repeating base pattern of individual die such that different configurations of custom layers can be added on top of the at least one base layer to implement different customized applications; at least one custom layer of a die cluster on top of the repeating base pattern of individual die, the die cluster grouping the resources of one or more individual die contained in the die cluster to implement the customized application; and one or more interconnections between the at least one base layer and the at least one custom layer such that the resources in the at least one custom layer can interoperate with resources in the at least one base layer to implement the customized application.