1. A method for device fabrication, comprising: providing a trailing edge front-end-of-the-line (FEOL) circuitry fabrication technology configured for fabricating FEOL circuitry die on a base wafer at a first investment cost using capital assets that are substantially depreciated and selected for fabricating the FEOL circuitry die at a first cost per wafer; and providing a leading edge back-end-of-the-line (BEOL) memory fabrication technology configured for fabricating one or more BEOL memory layers directly on top of each FEOL circuitry die on the base wafer at a second investment cost that is greater than the first investment cost using capital assets having substantially no depreciation and selected for fabricating the one or more BEOL memory layers at a second cost per wafer that is greater than the first cost per wafer.