1. A method, comprising: forming a first etch mask above a dielectric material of a metallization layer of a semiconductor device, said first etch mask comprising a mask opening corresponding to a trench to be formed in said dielectric material; performing a material erosion process so as to round edges of said mask opening; forming a second etch mask above said first etch mask after performing said material erosion process, said second etch mask in combination with said mask opening determining a lateral position of a via opening to be formed in said dielectric material so as to connect to said trench; performing a first etch process so as to form said via opening by using said first and second etch masks as an etch stop material; and performing a second etch process so as to form said trench by using said first etch mask as an etch stop material.