1. A product made by the process comprising: assembling two or more component modules face-down on a carrier substrate, wherein component modules each comprise at least one of an assembly prepared using the metal embedded chip assembly (MECA) process, an integrated circuit (IC) chip, a macro cell, and a die; attaching a packaging form to the carrier substrate such that the two or more component modules extend into a cavity defined by the packaging form; embedding a heat spreader material in the cavity defined by the packaging form; releasing the carrier substrate from the two or more component modules; forming interconnects between the component modules; and connecting discrete components to the two or more component modules by wire bonding, wherein the discrete components are elementary electronic devices constructed as single units.