1. A method of controlling process distribution of a semiconductor process, comprising: receiving process distribution data representing the process distribution of the semiconductor process; receiving a parameter related to the process distribution, wherein the parameter is received from a semiconductor wafer processing apparatus and is received at a semiconductor process controlling apparatus; generating a virtual metrology model corresponding to the process distribution based on a relationship between the process distribution data and the parameter; selecting an optimized process variable affecting the process distribution from among a plurality of process variables; modifying the optimized process variable affecting the process distribution based on the virtual metrology model; and transmitting the optimized process variable from the semiconductor process controlling apparatus to the semiconductor wafer processing apparatus to adjust the process distribution of the semiconductor process in real-time while the semiconductor process is being performed.