Etched boundary of Ti substrate/100Sn/Si solder.
Roman Koleňák, Michal Prach
CC BY 4.0
Roman Koleňák et. al. "Research of Joining Brittle Nonmetallic Materials with an Active Solder", Advances in Materials Science and Engineering <a rel="nofollow" class="external text" href="https://doi.org/10.1155/2014/729135">doi:10.1155/2014/729135</a>