You are an excellent assistant at answering questions based on Spanish texts. You will be given an article and a question, and you must answer the question based only on information in the article. The response should be extracted from the context verbatim.

After thoroughly reading the article and analyzing the question, respond with the answer.

Title:
Printed_circuit_board

Context:
At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significantly higher. As the reinforcement and copper confine the board along the plane, virtually all volume expansion projects to the thickness and stresses the plated-through holes. Repeated soldering or other exposition to higher temperatures can cause failure of the plating, especially with thicker boards; thick boards therefore require high Tg matrix.

Question:
Along with vias, what makes up the components of a board?

joints