This paper presents the implementation of an automated roll-to-roll fluidic self-assembly system based on the surface tension driven self-assembly with applications in the field of macroelectronics. The reported system incorporates automated agitation, web motion, component dispensing, and recycling. The process enables the assembly and electrical connection of semiconductor dieschips in a continuous and parallel fashion over wide area substrates. At present, the method achieves an assembly rate of 15 000 chips per hour and an assembly yield exceeding 99%, testing assembly of standard square-shaped dies, 300-1000 mu m size. Scaling the system to any desired throughput is possible due to the parallel manner of self-assembly. The identification and the modeling of the relationship between process parameters and forces have been studied and experimentally verified by testing the effect of the web angle, agitation on assembly, and detachment rates. As an application, we demonstrate the realization of a solid-state lighting module. This particular application requires the assembly of a conductive multilayer sandwich structure, which is achieved by combining the introduced assembly process with a novel lamination step. [2015-0105]