Title: 8 Common Errors in Surface Mount Technology | Sierra Circuits
Headings: 8 Common Errors in Surface Mount Technology (SMT)
8 Common Errors in Surface Mount Technology (SMT)
Contents hide
What is surface mount technology?
What are the advantages of surface mount technology?
What is the difference between through-hole and surface mount technology?
Surface Mount Technology Troubleshooting
SMT Error #1 Solder-bridging or electrical bridging
Potential causes:
Possible solutions:
SMT Error #2 Insufficient solder joints or electrical opens
Potential causes
Possible solutions
SMT Error #3 Solder balling
Potential causes
Possible solutions
SMT Error #4 Tombstoning
Potential causes
Possible solutions
SMT Error #5 Non-wetting or de-wetting
Potential causes
Possible solutions
SMT Error #6 Solder beading
Potential causes
Possible solutions
SMT Error #7 Insufficient fills and insufficient solder
Potential causes
Possible solutions
SMT Error #8 Cold solder joint or grainy joint
Potential causes
Possible solutions
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Content: Too much deposition of solder paste can likewise cause bridging. This may happen when the stencil aperture to pad proportion is excessively high. Solder paste cold slump can likewise prompt bridging. An incorrect solder paste metal to flux weight proportion causes a slump. High temperatures and moistness can likewise prompt solder paste slump. The reflow profile may likewise add to bridging. We know the purpose of the reflow process is to melt the powder particles in the solder paste. Along with that, it wets the surfaces being joined together, and finally, solidify the solder to form a strong metallurgical bond. The profile can be broken down into four zones – the preheat, soak, reflow, and cool-down zones. If the pre-heat area has an excessively slow of a ramp rate it can account for bridging.