and subject to the availability of appropriations for such purposes, provides Federal financial assistance to covered entities to incentivize investment in facilities and equipment in the United States for manufacturing or research and development of printed circuit boards and integrated circuit substrates. (2) Procedure (A) In general A covered entity shall submit to the Secretary an application that describes the project for which the covered entity is seeking financial assistance under the Program. (B) Eligibility Except as provided in subparagraph (C), in order for a covered entity to qualify for financial assistance under the Program, the covered entity shall demonstrate to the Secretary, in the application submitted by the covered entity under subparagraph (A), that— (i) the covered entity has a documented interest in carrying out a project that is a covered incentive