covered by section 3. (c) Information requested The information sought from a responding entity pursuant to the survey required by subsection (a) shall include, at minimum, information on the following with respect to the manufacture or design of semiconductors by such entity: (1) An identification of the geographic scope of operations. (2) Information on relevant cost structures. (3) An identification of types of semiconductor equipment in operation at such entity. (4) An identification of all relevant raw materials and semi-finished goods and components sourced domestically and abroad by such entity. (5) Specifications of the semiconductors manufactured or designed by such entity, descriptions of the end-uses of such semiconductors, and a description of any technical support provided to end-users of such semiconductors by such entity. (6) Information on domestic and export market sales by such entity. (7) Information on the financial performance, including income and expenditures, of such entity. (8) A list of all foreign and domestic subsidies, and any other financial incentives, received by such entity in each market in which such entity operates. (9) A list of information requests from the People’s Republic of China to such entity, and a description of the nature of each request and the type of information provided. (10) Information on any joint ventures, technology licensing agreements, and cooperative research or production arrangements of such entity. (11) A description of efforts by such entity to evaluate and control supply chain risks it faces. (12) A list and description of any sales, licensing agreements, or partnerships between such entity and the People’s Liberation Army or People’s Armed Police, including any business relationships with entities through which such sales, licensing agreements, or partnerships may occur. 7. Funding for development and adoption of secure microelectronics and secure microelectronics supply chains (a) Multilateral Microelectronics Security Fund (1) Establishment of