How to explain this difference in pinout?
Per Stevenh's recommendation, I am placing my comment as an answer and extending it.  

Could be desired compatibility with a competing chip.. I used be in Semi and we have done this all the time. The idea was to offer a pin drop out and under cut them to get the biz.
Wirebond is a sturdy piece of technology and last I checked people are moving to copper from gold. Most of the chips are tested at 50g drop tests, I don't remember us failing them at all.(BTW, these tests are never ever mentioned or released unless you are a serious customer due to hassle of answering questions) 

In terms of signaling crossing wires is generally a no no, however don't assume there is a single pad for that pin. Depending on the marketing input, I remember we made several bond out options where we use different pads for the same functionality.