Opening micro-controller package with vacuum pen
They're probably worried about you bending the pins and then wanting to return it, assuming it's something like their 0.5mm pitch LQFP package. 

Usually the outer packaging is either a tray or a cut piece of tape, and you either take the two rigid pieces apart or peel the adhesive top of the sprocketed tape. 

Either way you have to move it to the board (which ideally has solder paste applied with a stencil), position it and reflow solder it, or perhaps use some more manual method. If you bend the leads it will be difficult to get them to line up again. A vacuum pen can be used to lift the chip out of the carrier and deposit it. The cheap ones have a small diaphragm type air pump and a hole that you put your finger over to make them suck, then when you remove  your finger the suction is greatly reduced. Final positioning can be done with fine tweezers and a microscope. I've done it just with tweezers on similar Atmel parts with 144 pins and 0.5mm pitch and it's not all that fussy. 

But really, soldering something like an LQFP-100 should not be attempted unless your skills are fairly well developed on easier parts. It might have been better to start out with an eval board which has the fine pitch parts already attached.