Decoupling capacitors with power pour on top layer of 2-layer board
We had a discussion on this on an answer on here a while back. You can read it here:
Does ground pour circumvent bypass capacitors?
The conclusion I came to was that:
&quot;Hitting the pad first&quot; doesn't matter unless your frequencies are so that you are essentially doing RF in which case you will also be worried about a lot of other stuff the the width, thickness, length of your traces and the way your traces bend. At this point, it is a careful balance between everything and everything else (the factors mentioned above vs hitting the capacitor first to prevent waves from clashing and interfering with each other.
In cases where it doesn't matter, your first priority should be to make the loops and trace lengths between the capacitor and components as small possible. It can also make routing a lot easier (at least on a 4+plane board where you can just toss all the bypass caps under the IC and run each cap terminal and power pin straight to a plane through a via).