Why is there a big difference between the temperature parameters of these regulators with the same name?
Notice the TI table has a "Board" column, specifying the part is tested when mounted on the JESD 51-5 high-K  (high thermal conductivity) test board.

This board provides conductive cooling through the lead frame, reducing the thermal resistance \$\theta_{JA}\$ compared to a test done with the part resting in still air or mounted on a board with minimal thermal conductivity.

Most likely the Motorola values are based on tests done without the test board, probably before JESD even standardized thermal test boards.

TI has an app note here and an application report here giving some further details about the test board, but nothing specific to how they test the TO-220 package.