Eagle - non solder mask defined (NSMD) pads
Does it mean that there will be no solder on pads?


No, it means there will be no solder mask on the pads.

I don't know about Eagle terminology / settings, but in the software I use this is the equivalent:



(Key: red = solder mask, grey = copper pad, black = substrate).

The pad on the left is "mask defined" in that the area of the copper in the exposed pad is entirely defined by the aperture in the solder mask.  The pad on the right is not "mask defined" in that the copper area is smaller than the solder mask aperture.

The point of this is to prevent the solder mask causing a rise in the overall height of the pads at that location which can cause the module to not sit flat or make good contact with the pads after reflow.

To further illustrate, I have taken your existing picture and depicted what can happen with the two pad layouts:



In the left hand pad the distance between the component and the pad is limited by the thickness of the solder mask.  Unless there is the exact amount of solder paste available the pad won't be soldered reliably as there isn't enough solder to fill the gap.  Voids are formed and a bad connection may well result.  With the right hand pad the solder paste is able to pull the component all the way down to create a proper clean sandwich of solder between the two pads resulting in a much more reliable connection.