Find cause of diode destruction from destroyed diode itself
In principle, maybe. 

Your choices seem to be between a very short transient and a longer-term overstressing. A short transient will typically produce arc/burn marks and other indications of localized damage. Long-term overheating will simply cause joint (usually solder) failure, and possibly large areas of discoloration. 

Once the package has started to get into the act and start burning, this will generally obscure the potential differences, so good luck. If you've got a glass package, this will give you the best chance. If it's epoxy, you'll have a much tougher time.