PCB design few questions
The tCream layer contains the top side solder paste data for SMD, normally used to make stencils for printing the paste to the board before assembly. So I do not think that it will be necessary for a few prototype panels.

As for pads, it is recommended to use larger pads when hand-soldering because we need more space for the solder-iron. We was told back in class to add a couple tenth of a millimeter in both direction to the pads (red area below).



At thorugh-hole components, hole galvanization should be considered as follows: drill_size= d + 0.3 mm where d is pin diameter.
The copper ring diameter around the hole should be drill_size + 0.5 mm.

These were advices from our teachers when I was desiging my first PCB.