Thin FR4 versus Polyimide Flex
The base material can handle that amount of bending,
Just testing on hand with a 1.6mm thick 20x300 mm PCB I have on hand it can be bent to roughly a 0.4m radius before it starts strongly resisting, though I will note it is definitely into the plastic deformation levels of stress to do this. as it does not return to being perfectly flat.
0.7m radius appears to be the limit of the elastic range for my example PCB.
so for a 0.2mm thick pcb, I would certainly say you could even still be in the elastic deformation limits for a 100mm radius
For routing, avoid any sharp corners, your putting things under stress,
Components being fitted before bending could be an issue, ceramic capacitors really do not like being flexed, make sure you only use soft termination smd capacitors for this kind of project,
Make sure as much as possible any SMD components are perpendicular to the bend, the less width they are bent over, the lower the forces,
Use leaded SMD packages for IC's where possible, e.g. SOIC, or even SOT, QFN and BGA would risk lifting pads on that kind of bend.
So yes its possible, and may even have more desirable properties, will just cost you some time to make sure the components can survive it.