Is it good practice to use a flood fill ground plane as a pad for a component?
As said in the comments, there should be thermal reliefs. One or several short trace to the flood fill.
This will avoid not only misalignment but also tombstoning.
To avoid misalignment try to draw traces symmetrically.
Also, vias should be separated from pads by a short trace.
As it is, it could still solder properly in a good reflow soldering because everything is heated evenly but with the risk that it couldn't.
IMO tombstoning is a real risk here, especially with small components.
Absence of thermal relief would make hand rework with an solder iron very difficult.