What's the relationship between chips, wafers, and dies in a computer?
Figure 1. One wafer - many dies. Image source: Computer Business Review.

From my understanding is that every chip is made of a wafer which has a lot of dies ...

No. Every chip is made from a die which is a small part of a large wafer.

Figure 1. An Intel 1702A EPROM, one of the earliest EPROM types, 256 by 8 bit. Here you can see the one die bonded to the lead frame of the &quot;chip&quot; package. Source: Wikipedia EPROM.
One wafer will make many dies. Generally one die will be used and packaged in each chip.