Question after my first attempt with reflow soldering
Paste solder has flux in it.  The shape of the recommended temperature profile is to bring the system up to a temperature so as to activate the flux, give it time to work, and then melt the solder before the flux becomes deactivated.  

My experience with respect to prototyping is that the stuff is pretty forgiving.  Your profile, though, is a bit slow, and could be about twice as fast.   Indeed, I think your profile moves along slow enough that its pointless to unplug at 90C, but I could be wrong about that.

I recommend trying to get more beef out of the toaster oven.  Certainly, cover any glass with tin foil. Also, I got much better performance by dismantling and insulating with glass wool.

Put the thermocouple on the board, near a big component.  It may not be as hot as you think.

In general, I'd say you have too much solder.  Don't worry about separating the solder on each pad, and just smear about half that amount across all the pads.  Let the surface tension separate the pads and pull the components into place.

Hard to say, but my guess is that some of your joints may be cold.  The fact that the resistors didn't get pulled into a centered position by surface tension probably indicates uneven heating.  You might expect tombstoned 0402's, but the sizes you're using should work just fine.  

Great start!!  

If you're going to keep on doing this, you might consider making boards at a house where they give you a free stencil, like pcb-pool.com