Does anyone use Statistical Element Selection for matching integrated circuit components or is this a university exercise?
So the basic idea is to improve matching by selecting the best-matching devices and using them. It seems like a basic type of digital trimming that could be done during wafer probe. Many parts go through a trimming procedure for various parameters. It used to be done by shaving metal off of resistors using a laser, I think, but more commonly in my experience it's done by blowing on-chip fuses. That would work fine for this type of trim, assuming there is an accurate way to determine which devices are best matched at probe.
I'd be surprised if it isn't commonly used in many analog designs. However, it would usually be considered a proprietary implementation detail, not something that would be advertised. Circuit manufacturers are not in the habit of broadcasting exactly how they make their circuits, since it mainly helps their competitors and it can open them up to patent lawsuits.