extract components from SMD
What you want is a Hot air rework station:



This uses a gentle stream of hot air (soldering iron temperature) to melt the solder and release the components.  Also, a "hot plate" can be beneficial when working with such components as BGA chips:



Failing that, put it in the oven face down and let the components fall off. (may not work depending on component size - the surface tension of the solder may well hold them in place).