Safely removing bonding glue from an IC in order to identify it?
Usually heated fuming nitric or sulfuric acid is used to remove epoxy encapsulant. A properly passivated chip won't be damaged by this, and you'll still be able to read any text that is visible with a microscope.  

That's assuming it's epoxy. If the material is flexible (such as silicone rubber used in some markets) you might need a different set of chemicals. 

I suggest you find a vendor who does this as a service.