Are solder bridges on chips always bad?
In the old days of DIPs, sometimes entire sides of chips were designed as heatsinks, so it made sense to connect them with a big blob of solder too. But this heat-sinking technique is extremely uncommon for SOPs, which usually use pads underneath the package when moderate heat-sinking is needed. (Before someone says that using pins as heat-sinks is nonexistent for SOPs, the SO8 version of OPA551 uses a couple of [non-adjacent] pins as heatsinks).

As for your chip, Wiznet W5100 (which alas I first read as WS100 making me waste some time) there's a datasheet for it; it seems the guys who put together that PCB soldered together most if not all the address pins, which couldn't possibly work.