Do 0402 chip component need solder mask web between the pads?
Mentor Graphics  LP viewer based on IPC has the nominal pad edges just 0.39&nbsp;mm apart for a RESC1005X40N. Our normal target is a 0.1&nbsp;mm gap for copper pad to the resist, I reduced this to 0.0957&nbsp;mm for my 0402 to maintain a 0.2&nbsp;mm resist sliver.

Just my solution of course.