LM2678 PCB Layout question / review
Given the valuable inputs I received about the extra capacitors, not routing under the heatsink on the top layer, and connecting D1 and L1 on the same layer, I would like to update the schematic here for reference.

What I did was:


Add the extra capacitors
Moved the ground plane to top layer. This allows for better (shorter) ground connection to the LM2678 when moving the track under the heatsink to the back layer.
Changed the entire track of D1 to L1 to the bottom layer
Changed all critical ground pins to not have thermal relief spokes.


I think I will construct it then this way, and if I find any problems with it I will update on here with a solution.

Thanks!