Checking connection in wire bondings
There is no one simple answer.  You must find a way to test each pin and that means connecting the device pins and testing in turn.  Check with the manufacturer and see if they can tell you what the functionality is of each pin, specifically is there are ESD structures on chip.  For all the pins that do have ESD (and likely all of them do, but it is possible that some do not have ESD protection) with all power rails shorted to ground, drive each pin negative with a weak driver (limited to a few mA drive or perhaps 10 mA drive).  If the wore bond has opened then the voltage will track, if the wire bond is connected you will not be able to drive below about -0.8 V.  You are using the ESD and parasitic Diodes (NWell to substrate etc.) to test the connection.

This presumes a lot of (albeit likely) things about how the sensor is fabricated, which may not be valid.  But probing the pins gently should allow you to characterize the pins and thus the connection.