Vias in footprint with no thermal relief?
That central pad is for thermal management. Putting thermal reliefs would be unnecessary, since nothing is soldered to it, and counterproductive, since the cutouts would impede heat flow to the vias.

Since the thermal conductivity of solder is about 12% that of copper, I doubt that it matters a whole lot, and I doubt that the recommended via pattern even assumes any solder at all.