Are SMD microcontrollers less affected by noise than DIPs?
If mechanical stress conforms to your definition of "noise", then DIP-based designs will be more prone to failures, mainly because of the greater mass of the components and the device as a whole. Also, DIP-based designs will pick more EMI noise, due to both the increased pin length and longer PCB traces.

Other than that, it's essentially the same chip in a different package, so there is no reason for the electrical characteristics to be different.