SMT Multi-Footprint Size to IPC standards for production
I can't see anything in the 610 standard that would preclude this.  Section 5.2.1 allows exposed basis metal on the pad as long as the solder fillet to the part is acceptable, so you don't have to worry about covering the entire pad with solder.  Section 8.3.2.3 specifies end joint width as minimum of 75% of component termination width or land width, whichever is less.  I assume you won't be including this test pad in the final production run so hand soldering just on this test board might be called for if you run into tombstoning.