RF layout good practices
While avoiding 90 degree bends is a good idea, for designs below maybe 1 GHz, my experience is that it isn't an absolute requirement.

More important improvements you could make in your design:


Increase track width (which probably means increasing dielectric thickness to maintain the same \$Z_0\$). Wider tracks will have lower loss. Also, if you increase the track width to match the width of the pads of your inductors and capacitors it will reduce the excess capacitance at those pads.
Rotate C32, C33, C41, L7 to be parallel to the signal path, so that their ground connections are nearer to the signal trace. (C41 and L7 could be placed on either side alongside C31) The goal is to reduce the loop area between the signal path and the return path for currents flowing through those shunt elements.

One of the key things you'll learn in your first 2 or 3 RF design projects is to always always consider the return path when making layout decisions.
Increase clearance between silkscreen and pads. Your inductor footprint looks like if there is any mis-registration between silkscreen and solder mask you will end up with ink on the pads.
Probably move C36 to shorten the distance between L2 and C36, but without a schematic I'm not sure about this.