Designing footprint for LFCSP CP-8-13 what should be the pad size
So, there can be no general answer. The shape and size of pads depend on very many things, among these:


Purpose, usually a mixture of the following, dominated by one purpose:


Thermal transfer
mechanical stability
high current capability
impedance matched high frequency signalling

PCB fabrication tolerances
Component placement tolerances
thermal and mechanical aspects of the soldering process


So, if you're doing a board with a high-quality PCB manufacturer to be assembled by high-end pick and place machines and soldered with a well-calibrated reflow oven, then the pads will usually be minimally, if at all, wider than the pins, unless certain pads should be wider to allow for an all-around "solder taper" for more current or heat transfer capabilities.

If on the other you're sending this off to some unknown least-cost manufacturer and plan to assemble the board by hand, by all means, make the pads as wide as possible without risking solder bridges, and add a lot of exposed are outside the pad outline, where you can actively transfer heat into the solder paste.

Now, considering the free space between pins is but 0.25mm, I'd say: go for pads that are exactly as wide as your pins, and pray you get your manufacturing tolerances low enough!