Surface mount package size 201-1
The case size is standardized by the case numbers in mil as 0201 but the pad designs for the layout may different depending on IR reflow or glue and wave-solder to optimize solder low defect rates from surface tensions.

So the -1 is used for both the 0201 and 0402 parts which must use the same solder process and optimized pad geometry as recommended by IPC standards, as @Derstrom has reported on.  Although each company may choose deviations to IPC suggested by their partner CME assy shop to reduce costs associated with solder failures, the #1 test process failure. It is not just a just process failure but a design failure that must be collaborated with solder types preferred.

I know Apple likes to use no-clean flux process because it saves them a  buck, so they can sell more Apple products which void some warranties with the moisture detection indicators, because contrary to myth, no-clean flux is quite corrosive with moisture and will corrode a moist Mac or iPad in a couple days. I’ve been burnt a couple times.