How to avoid solder bridges between LGA-16 pads (paste applied manually)?
This should be doable without a stencil.


Using a flux pen, like TechSpray 2507-N, wipe the pads.
Using your soldering iron, carefully mound solder on the pads, being sure there are no bridges, and not too much solder.
Flux the IC and the mounded solder well.
Reflow.  Once the IC and board are to reflow temperature, poke the top with a tweezer or similar to make sure everything is floating properly, it should self center at this point.
If there are bridges, it would be common for the solder to bridge to the outside, so you can remove these with desoldering braid, and reflow again if necessary.


I do similar with dspic33fj12MC202 qfn-32 parts for fixing.