Mount SMD component raised 45 degree from board
You do not want to mount the SMD component in any manner except for flat on its pads as the package was intended to be mounted. This is especially true of the TMP007 device since it is in a mini BGA package. 

If you need unique mounting orientations of the component then you should be considering how to orient the circuit medium upon which the component is mounted. There are known - production feasible - methods for joining two PC boards at right angles. One method interposes the two boards using a connector of some sort. Another method has the main board slotted with the sensor board inserted into the slot and then adjacent copper lands are hand soldered together. Yet another method would have the sensor mounted on a flex circuit and then the flex joined to the main board via an FFC type connector.

The FFC flex circuit is likely to give you the overall best solution. You mount the component on one end of the FFC and a small board to flex connector on the other end. This gives you a solution that can be built up as a subassembly without having to do soldering at final assembly.

  

I could even envision that you make your device package have a fold out arm that has the flex inside with the sensor captured at the end of the arm. The user would hinge the arm out to place the sensor at a suitable position to make useful measurements.