Better Techniques/Equipment for BGA Soldering
As you'll see if you link through to the possible dup, there are ways to do this.  My own humble opinion is that they're not very amenable to prototyping using hobbyist methods-- at least for my purposes.

I don't say this because I think it's impossible, I say this because I think the yield will be enough under 100% that not knowing whether your mount is good or not will be a substantial obstacle to my process.

I wouldn't take this on with less than a pro-style smd rework station with a board preheater and a hot air gun -- and preferably, access to a board inspection xray machine (though if I had an xray machine I would probably have a good reflow oven nearby!)

If I absolutely needed something done, I would probably pay the $40/hour plus setup fees to have it done at a board house, or I might try to have proto-advantage mount it for me -- http://www.proto-advantage.com/store/index.php?cPath=4000&amp;osCsid=iucsgr96i98id45oln486h40g0  --  you give them a digikey part number and they order and mount it for you on a breakout board for a fee.  The first  time I used this service for BGA, I would probably have an email conversation first to assess their comfort level with BGA.

The reason why your pads don't look soldered, by the way, might have to do with different melting points for the solder on the ball and your Chipquik -- especially if your BGA uses silver solder.  I thought you shouldn't need additional solder if your chip is already balled.  That's the point.