What manufacturing process produces resin coated chips in consumer toys?
As you commented, it's called COB (Chip-on-board). The layout can be done with a conventional PCB layout program such as Altium, 



but the mounting process is done with a different set of equipment from the rest of the assembly (a die bonder and a wire bonder). 



Then a glop of epoxy is added over the chip and bonding wires. 

The COB process shown in your photos is mostly a high-volume Asian thing, though anybody with the appropriate equipment could do one-offs (if they could source the bare dice, a huge if). The advantage is that you're saving a few pennies on the chip package (and often the chip testing), at the expense of lower reliability. 

Often the chips used in this sort of assembly are sold only as bare dice, and are not available in small quantities, nor are they available through conventional distribution. Testing is often not 100%, the assumption being that the testing will take place later, and defective assemblies are cheap enough that they can be discarded (usually there's very little of value on the COB assemblies beyond the chips). 

A cousin of COB is COG (Chip-on-Glass), which is used in most color LCD displays. The drivers are on chips that are designed (only) to be directly bonded to the glass. They have extreme physical aspect ratios so you'll not find them in a package.