4 layers PCB stack - (signal, signal, power, ground)
A different PCB configuration will not matter if:

1) Changing the capacitance from ground to a given plane doesn't matter. (and also transmission line effects). It's 'handy' to have the ground plane in the middle because you are giving most of the planes a small parasitic capacitance to the ground layer. By sending the ground plane to the bottom layer, the capacitance to the ground plane is increased from the signal layers that are on the top. Inductance of the PCB trace is increased the further it is from ground which mainly affects high speed circuits.


Figure from Electromagnetic Compatibility Engineering by Henry W Ott

2) The return current is preserved, remember the ground plane carries the return current. If the planes are swapped, don't put slots in the ground plane if it is moved to the top layer. That will change the performance of the ground plane and could give you more EMI problems and common mode problems from the return currents having to run "around" the slots in the ground plane.


It doesn't sound like this would be a difficult thing to do in your case if you don't have high speed requirements or other sensitive analog circuits that have noise requirements. If you do have sensitive circuits it may take more creative layout.

Here is a good read on regular stackups

Realize that there are other options for thermal management, like switching to a higher weight of copper or heatsinks. Power planes can also be used for thermal management in some cases OR if you have the space on multiple layers, use as many layers as you can. I've used multiple layers in the past but I don't have stringent soldering requirements.