PCB trace width can't meet the rated current
Some considerations:


pins and solder have a much larger sectional area than a PCB trace. So the pin and pad can handle much more current than a trace of the same width (even if they are made of lower conductivity materials). 
The estimated temperature rise assumes a relatively long trace. A short trace segment, that is sandwiched between large metal areas will dissipate heat much faster. 
A 10ºC temperature rise is rather conservative. 
You can rearrange adjacent traces to maximize the wide trace run to within a few millimeters of the pad. 


But, is there any reason why you didn’t use the datasheet’s suggested layout as a guidance?