Does the contact pad need to match the footprint shape of the SMD
In statistics as well in Contract Manufacturing DFM design for Manufacturability the probability of defects in soldering increases with the degree of mismatch to IPC footprints for the desired soldering method &lt; RElow vs Wave solder has different footprints and layout orientation recommendations.

In solder reflow, and contract manufacturing, 99% of the defects are related to poor solder and many or most of these are design related to board layout.

Without details on your actual part, and pad design , it is impossible to assess. 

I advise you to read about IPC solder pads and Mfg's recommendations and/or consult with EMS builder for DFM analysis or use your mentor and software to do the same.

DFM= Design for Manufacturability.
DFT= design for Testability
DFC= Design for Cost
DFX = Design for Excellence.    ( all of above)