Which is easier to solder: TSSOP or QFN?
For hand soldering I'd go with TSSOP.  QFN pretty much requires hot air, whereas you might be able to get away with a soldering iron with a TSSOP.  The pitch of QFN can be smaller too, which is more difficult with home-made PCBs, but TSSOP can be small too.  Sometimes they have a exposed pad in the center that needs to be grounded, which makes routing more difficult.

One issue with QFN is you have to consider the package lying flat against the board without any gap under the package or between pins.  This means you can't use conductive flux since you can't guarantee the flux will be rinsed away under the package.  I know this because it actually happened to me.  A local manufacturer that specializes in small quantity hand-built boards was new to QFN and didn't think about this.  The boards we got back didn't work for various reasons.  Eventually I figured out that pins were being shorted together under the package.  The resistance was surpringly low, like only a few 100 Ohms in some cases.  What a mess.  Letting the boards sit in clean water for a few hours helped, but ultimately we had to remove all the QFN packages with our hot air station, clean the mess, then re-solder them with rosin flux.  Then the boards worked as expected.

For real professionally fabbed and built boards, there is no issue with QFNs, but for do it yourself situations they can be tricky.