How much physical damage does dropping electronic devices cause?
Fortunately, fall damage is almost always visible (i.e. cracks on the case, broken displays etc). Since typical fall distance is about 1m, the shock is not even nearly enough to break PCB traces (that would actually require a hammer) or dislodge a typical IC component.

Sometimes components do get dislodged in particularly bad PCB designs - often with surface-mountable components with small pads and important mass (like coils). Good designs tend to use bigger pads, pins going through the PCB and/or glue to avoid such issues.

If several PCBs are connected inside a device with rigid connectors, those will be the first to go as well. This is often the case with cameras, but you usually won't notice it since the optics will not survive the fall anyway. Flexible connectors like ribbon cables will, oh well, flex, so little stress will be applied to the connector itself.

Another weak point is moving elements located in corners or beyond device's outline (volume wheels, buttons etc.) If such elements are the first to hit the floor, they will absorb most of the shock and won't survive.

BGA packages rarely get damaged by falls. They are usually quite lightweight, and the stress from the shock is distributed to hundreds of pins. BGA soldering does get damaged quite often though, because of thermal deformation, as such components tend to dissipate a fair amount of power.