Creating multiple identical outputs for a device and shorting between them
A pin or bump on an IC has a maximum current it can handle for thermal and electromigration reasons.  There's also potentially unwanted inductance and resistance in series with the pin due to bond wires.
For that reason, on higher current connections IC designers often use multiple pins in parallel to split the current between them and lower the associated parasitics and even the thermal impedance.
This will improve performance and reliability.