TLV1117 Regulator Thermal Issue
The thermal resistance of SMT packages is highly dependent on layout and other factors. I suggest you read relevant sections of this application note (AN-1028 Maximum Power Enhancement Techniques for
Power Packages) from TI on their SOT-223 package's thermal characteristics. Pay attention to the thickness of copper (2 oz, for example, is much thicker than typical prototype board thickness- might be 1oz or less). 

2.1W is not likely practical in that tiny package unless you can heat sink the tab with a big copper area. 

Even in a TO-220 case, you should have a heatsink to be able to safely dissipate that amount of power.