Do I need to Reduce the Width of a Power Trace for Thermal Relief When it's Passing Through a Pin on the Chip?
The traces do not connect to a large plane of copper nearby to the connection to the pin so it should not impact reliability. Think of it like if you double the thickness the trace should be twice as long to not be a larger heatsink

In your case the ground trace ends up going through a small trace to plane so the thermal relief is there. And while I cannot tell where the 1.8V trace is going. If its connection to plane is more than about 8mm away from the pin. For that thickness trace it should not effect things.