Soldering 0.5mm pitch ICs using stencil and reflow oven
I have been building boards for a long time and can tell you that the best approach here is usually to use solder wick and a soldering iron to suck up the excess solder. Then if needed, retouch the component by heating it up with a soldering iron and gently move it. It will self align and will look great.

Also, just taking the soldering iron and moving it against the solder towards you does it as well.

I have also found that using a hot air gun, heat up the place where there's excess solder paste and using tweezers just move them between the pins. Because solder paste has metallic balls, it tends to ball up and you can pick it up.