SSOP package differences
From the ti.com 74cbt3251 datasheet
There are package drawings at the end of the datasheet. TI has their own set of package codes, but they do also make reference to the JEDEC industry standard package codes as well. The most important parameters from the package drawings are pitch and body width.
Page 20 package drawing for SSOP (ti.com suffix DB, package code DB)
JEDEC MO-150-AC
pitch e=0.65mm, width=5.3mm
Page 22 package drawing for SSOP (ti.com suffix DBQ, package code DBQ0016A)
JEDEC MO-137 AB
pitch e=0.635mm (which is unusual), width=3.85mm
Page 17 package drawing for TSSOP (ti.com suffix PW, package code PW0016A)
JEDEC MO-153-AB
pitch e=0.65mm, width=4.4mm
The sparkfun breakout board in the photo looks like it may be designed to accommodate a range of body widths, but requires the correct pitch. The most common SSOP pitch is 0.65mm, but I have also seen 0.5mm and even in rare cases 0.8mm. A pitch of 0.635mm is probably not what you want, if you're using a standard breakout board.