Books on Bypassing, decoupling and Grounding
"Electromagnetic Compatibility Engineering" by Henry Ott, chapter 11.

Many chip makers have app-notes &amp; other design resources dealing with decoupling caps, for example this from TI related specifically to BGA packages (decoupling techniques can get fairly specific to the ic package type - what works for thru-hole DIP is very different to what works for high density SMT):
http://processors.wiki.ti.com/index.php/General_hardware_design/BGA_PCB_design/BGA_decoupling

http://www.interfacebus.com/Design_Capacitors.html (&amp; related pages)

The other 2 links commented under your OP are also very useful.