I need to create pad on the copper zone like as shown on the picture in Orcad PCB Editor 16.6
More than likely you will create this using a copper pour function. You draw a shape, place the shape on the appropriate layer and attach to it a net name (the signal name of the track it is replacing). Then OrCAD will fill in the copper inside the shape. You can also use the copper-fill feature in OrCAD (if I remember the name properly).
The difference between pour and fill is how it handles through plated holes that are located within the shape and connected to the same net. A pour will apply thermal spokes whereas a fill will merge the pad of the through plated hole to the copper. It will also run across non-connected pads creating a short so be aware of the difference. The pour feature avoids connections that are illegal.
So you need to decide which you use to suit the connectivity of the pad you want.