is there any problem with these via-pads?
Seems many of the comments to Anonymous's answer hit the nail on the head.

"Via-in-pad" is indeed a technology that is used but is generally not preferred for a number of reasons. The only benefit I can think of would be shorter signal paths which would help improve signal integrity in high-speed circuits, but its downsides are significant. 1) Solder can wick into the via so more solder would be required than usual. 2) If you use a reflow process, your stencil would need to reflect this, which would require either multiple processes (involving multiple stencils) or additional paste on other pads (not recommended if they don't have vias in them -- That could lead to solder bridges). 3) This would also increase the cost of the overall PCB (most board houses prefer to avoid via-in-pad technology if possible, because it's added time and resources to the build process. 4) Also, if the component pins are not properly soldered (solder is wicked down into the via) then it would take away from the solder on the pad and would leave a poorly-soldered joint that could cause intermittent failures. 

There are a number of reasons I would avoid this unless you're sure it's absolutely necessary. I recommend not putting vias in the footprint at all, but place them during the board layout process. If you MUST put them in the footprint (I have no idea why you'd want or need to) then connect them to the pads using traces that are slightly narrower than the pads themselves (to prevent the traces from making the pads larger than intended) to connect to the vias (which are not placed on top of the pads).

That would be my recommendation.