How can I use the TDR result to evaluate the effect of impedance discontinuity?
There are several elements of the TDR technique that should be considered. First one is the selection of rise time of the TDR instrument. Theoretically the faster is better, but not always. Faster TDR step allows to resolve impedance discontinuities to finer length, better identify design problems. 

But every communication signal tends to limit the edge rate, for EMI and other reasons. So too fine imperfections do not affect the actual signal propagation, and the rise time of step function in TDR instrument should be aligned with requirements of signal edges. Therefore for, say, the USB 2.0 TDR test specification dictates 400ps edge, which is achieved by imposing a sliding filter on data. For USB3.0 (5Gbps) the TDR edge is defined as 50ps. 

Since your data rate is 10Gbps, I would say that the instrument needs the edge rate at 25ps. Your instrument shows 35ps edge, which is a bit below of what is needed to evaluate the trace quality/uniformity. 

So, as you clarified, the 160-Ohm jump is due to some likely corrective passive resistor inside the IC, and the actual termination is unknown at this point. [usually an unpowered IC shows its impedance go to infinity, with some capacitance to ground]. So you can't blame the horrible 160-Ohm jump for the possible problems with your signal integrity (yet).

The discontinuity around the connector deserves some attention. First, as I explained above, 35ps is somewhat below the desired 25ps. So the trace would show larger excursions if faster edge will be applied. How much, I can't tell. The discontinuity is of L-C type, with L on outside part of the joint (bump), and some parasitic capacitor to ground (downward glitch) after that. For the 10Gbps rate the impedance inhomogeneity is not really horrible, but it is something that needs an attention and better modeling effort for the cable-connector-trace matching. 

It also could be that this blip/dip is due to poor design of your test coupon.

The most important part of TDR evaluation would be when you power-on the IC, and make it to finish impedance self-adjustment, set the port in receive-only mode, and then to see what is really reflected back from the chip/package itself. This will be really important.