Combining CPU and RAM on stacked silicon
why doesn't Intel, for example, use a similar technique to combine the CPU and the RAM in one package?


They (will) do?


  Intel's Rajeeb Hazra, a VP and general manager of its data centre group, said Intel would customise high-end Xeon processors and Xeon Phi co-processors by closely integrating memory, both by adding memory dies to a processor package and, at a later date, integrating layers of memory dies into the processor





  The amount of in-package memory would be limited by real-estate limits, the physical space inside the package, and we shouldn't expect such Near Memory to replace or substitute for Far Memory.