Do you need to solder the center point in this type of BGA chip?
This style of package is QFN (Quad Flat No-leads package).  The specific instructions about connecting the pad would be found in the datasheet.  (@brhans have mentioned this already.)

The central pad is usually connected to GND, although GND is sometimes also wired to one of the pins on the periphery.  

The pad may also also serve for heat sinking the IC to the PCB.  For some ICs the heat sinking aspect is important (power ICs, for example).  For other ICs, it's not important.  Solder provides a better thermal path than lack thereof.