Pastemask. Manufacturing PCBs
I believe that the IPC recommendation is to make the stencil apertures the same size as the pads. 

Altium, for example, allows you to set the paste expansion via rules or individually, but the default is 0.0mm. 

You don't generally want solder paste on through-hole pads. 

Usually paste with stencil apertures the same as the pads is also recommended for BGA, but it's said to be possible to just use flux.