Altium Designer IPC Footprint wizard error for chip components
IPC generally has three different variants for every component footprint - L, N, and M, which stand for Least, Nominal, and Most. If you use the Least option the component pads take up the least amount  of space, which is great for high-density boards. Nominal is slightly larger, and if you use the Most option the component pads take up the most space. This is ideal for low-density boards which you plan to hand-solder.

The first image you show appears to be either Least or Nominal (I'm guessing Nominal), whereas the second image you show looks more like the Most option. There will often be minute differences between the manufacturer's suggested footprint and the IPC versions, but they will almost always be close to either the L, N, or M options.

Any one of the footprints will work provided it was created for the package size you are using. Like I said before some footprints will work better for high-density, and others will work better for low-density. Similarly some work better for hand-soldering and some work better for reflow soldering. As the designer you need to pick the option that works best for you.

Personally I use the IPC-compliant footprints. I have 0805_L, 0805_N, and 0805_M footprints for use in different  situations.

For more details on the IPC-compliant footprints, how the pad sizes are calculated, etc. see IPC-7351A.