Increase of component's height due to soldering
I contacted my foundry (over e-mail and phone). 

They said:

1) They use stencils of four heights: 80 um, 100 um, 127 um and 150 um. Standard (typical) stencil is of 127 um height.

2) Height of solder paste after application of a stencil (before heating) cannot be greater than height of stencil.   

My comment: I don't remember for sure, but I think they meant, that average height of solder paste is equal (not just not greater) to height of stencil.

3) After heating (reflow) component descends.  



So, I conclude:   

The height of component after reflow soldering is smaller than nominal (datasheet) component's height plus height of stencil. Or, in other words, the  ceiling value for component's height after reflow soldering is component's nominal height before soldering + stencil height.  

PS1: I looked at several hand soldered capacitors. I do agree (with comments to the question) that the increase in case of hand soldering is uncontrollable. The additional height due to relatively large solder fillets under and above capacitors was as much as 0.5-0.6 mm (measured with eye).

PS2: Unfortunately, I don't have any reliable estimates how much the component descends after heating.

PS3: As soon as the PCB is produced and components are reflow mounted, I plan to update here about the resulting height and the socket.