Copper plating with electrolyte not working (Cu(OH)2 vs CuSO4)
If you are going to do anything differently than is normally done, you should understand what you are going to do and why it should work.(*)
The essential (but often not sufficient) conditions for successful electroplating by any metal are:

The used metal salts/compounds are soluble, so ions can migrate within the solution in applied electrostatic gradient. That is not the case of copper in copper hydroxide nor alkalic copper carbonates, which are insoluble.
The metal salt has sufficient concentration, so electrolytic current reacts primarily with this salt, at least on the cathode.
The current density on the plated electrode is low enough ( typically $\pu{10 mA/cm^2}$).

The solution composition for successful creation of shiny metal surface can be tricky, based on intensive empirical reasearch, involving solution modifiers like sugar or soluble polymers. The goal is mostly decreasing ion mobility and/or the rate of electrode reaction to support even metal deposition.

(*) It does not fully apply in the basic research, which uses often &quot;what if..&quot; approach, but this is not the case.