lanning to launch LTE in 30 markets by 4Q'2010 (August 2009). European Union will invest 18m Euros to capture lead in LTE/LTE-Advanced to replicate the success it had with GSM (August 2009). AT&T is in no hurry to migrate from HSPA to LTE and it is not planning to have a EPS network before 2012 (May 2009). Vodafone, contrary to Verizon, don't have an urgency to launch LTE and still want to grow its HSPA network. Similar to AT&T, it is not planning to have a LTE network before 2012 (May 2009). Qualcomm supports dual carrier HSPA+ chipsets for handsets and data cards supporting up to 42 Mbps in downlink and 11 Mbps in uplink. The engineering samples will be available starting from mid 2009 (February 2009). LG announced first LTE chipset for handsets (December 2008). Huawei will provide network solutions for UMTS, CDMA and LTE technologies in 700 MHz band for the US market. Using software defined radios, the base station portfolio will support dual-mode operation for CDMA + LTE and UMTS + LTE technologies (April 2008). Alcatel-Lucent, Ericsson, NEC, NextWave Wireless, Nokia, Nokia Siemens Networks and Sony Ericsson announced a mutual commitment to a framework for establishing predictable and more transparent maximum aggregate costs for licensing intellectual property rights (IPR) that relate to EPS (April 2008). Motorola completed EV-DO to LTE handoff (March 2008). Summary Insights The focus of Chapter 3 was on LTE or E-UTRAN which was standardized as part of 3GPP Release 8. We have provided the high level overview of the features that are part of the various releases of 3GPP. LTE air interface and associated layers 1-3 were described in addition to the key attributes of E-UTRAN. The performance of LTE, EPS overall architecture and its roadmap was also presented in the chapter. Lastly, the status of LTE within the telecom industry was presentedin Section 3.8. However, only time will tell about the success or failure of LTE, though vast majority of the telecom industry is behind EPS. The support for EPS is unpreceden