costs and risks of aggressive integration. The development time and development cost for a retuned integrated receiver rises nonlin- early with integration level. The mask costs are higher; typically about 1 million dollars for a 0.13-micrometre process and increased with integration level as the industry transitioned to 90 and 65 nm. 'Single-chip' phones do not make it easier, but rather make it harder to support nonstan- dard frequency allocations. To realise a truly frequency agile single-chip device requires the integration of diplexing and duplexing onto the die. MEMS-based tuneable filters provide an opportunity to integrate these remaining front-end components on to the RFIC. This pro- vides the basis for a software-defined radio but such products are not presently available at mass-market volumes or mass-market prices. Integration of these functions onto a device with significant temperature variations will be a particular challenge and it is likely that most if not all vendor solutions will continue to Making Telecoms Work support off-chip RF power amplification in order to ensure device reliability and performance consistency. Even as and when these RF PA and RF MEMS integration challenges are resolved, there will still be frequency-specific components that have to be added to the device, for example the antenna and passive components to match the antenna to the RFIC. Although MEMS-based functions integrated onto/within an IC potentially offer an ability to have tuneable functionality across a wide range of frequency and band allocations, there will be optimisation limitations. For example, a highly integrated RFIC would be optimised to tune across specific frequency bands with specific channel spacing with specific RF signal characteristics. Additional frequency bands may require hardware optimisation of the IC. At this point, an approximately $6 million 'entry cost' is incurred. Hence, our contention in 2007 was that the volume threshold for nonstandard band support would increase rather than decrease