 to parametric yield loss in the transceiver (or any of the other components), SIP integration faces a serious challenge in meeting cost targets [12]. SoC: An alternative approach to integrate the RF transceiver and the digital baseband processor is called SoC (System on Chip). SoC integration of the radio transceiver and BP is normally undertaken with monolithic6 integration in deep submicron CMOS. The monolithic integration in BiCMOS (or SiGe) is not a cost effective alternative as shown in [7, 12]. The deep submicron CMOS transistors on the other hand offer very good RF performance and easily meet the needs of integrated transceiver designs (low noise figures and high transition frequencies are possible). SoC integration reduces power consumption, board area and test costs and improves overall performance ,12]. Major players of the mobile processors market such as ARM, Intel, IBM, Texas Instruments, and SO on, are the pioneers of SoC. The outcome is lower processor prices, increased reliability through reduced number of system components, lower power consumption and increased performance. The AMBAR protocol is an open standard, on-chip bus specification that details a strategy for the interconnection and management of functional blocks that makes up a SoC. It facilitates "right-first-time" development of embedded processors with one or more CPU/signal processors and multiple peripherals. The AMBA protocol enhances a reusable design methodology by defining a common backbone for SoC modules. Although many RF CMOS SoCs have been made, the RF transceiver is still typically manufactured using a silicon germanium BiCMOS process. Additionally, without a CMOS-based transceiver, it is not possible to have a single chip (RF/BP) solution. In the end, the companies that are introducing a single-chip RF/BP solution will be better than the ones who are keeping the two components separate. 10.4.3 Mobile Phone Application Processors Application Processors manage application operation (excluding radio access functions) in a mo