xpected to Transciever Next Gen of Downloada- have a expected to & BP into a Mobile Smaller size bel Uls higher increase single SoC Gaming & market Pilot & their market Graphics ISIM of IMS share Traffic IC share Transciver via SiGe BiCMOS Multiple Touch process EEPROM screen ARM 32-bit MDM highly Pilot implementa- processor 8-16 bit Symbian is Built-in proprietary Interference dominant ion in processor Camera Cancellation advanced process techs Mobile Mobile RF & Baseband Application Mobile Device User Interface Performance Software Processor Processor Management Enhancement Platform Figure 10.17 Device components near-term outlook University of St Andrews, UK announced improvements to battery technology that could see 10-fold increases in capacity using an air-fueled design, while a separate group has laid the groundwork for a lithium battery that can store and deliver more than three times the power of conventional lithium ion batteries (May 2009). High Dielectric Antenna (HDA) embedded antennas for mobile handset and portable device appli- cations - Antenova launched a number of multi-band phone antennas in 2008. Four layered (4+n+4) HDI (High Density Interconnect) boards are expected in 2011. 10.13 Summary Insights The key components of devices are described to provide readers' insights into their everyday com- munication tools. The capabilities of various Mobile Software Platforms and Operating Systems were discussed. Currently, Symbian is the dominant MSP and will likely remain one in the coming years, but the likes of Andriod, iPhone and Blackberrys are continuously working to reduce its share. The advance of CMOS will expedite the integration of RF Transceivers and Baseband Processors. ARM will continue to dominate the Application Processor market and it also recently announced its support for the next generation of gaming and graphics. The high capacity UICC will also have higher market share with the advent of EPS (LTE) and HSPA+. We also expect that handset vendors will adopt OMA DM and allow download