), ▁a ▁process ▁that ▁enables ▁ult ra - th in , ▁high - dens ity ▁packages , ▁has ▁been ▁around ▁for ▁several ▁years , ▁and ▁the ▁fan - out ▁technology ▁is ▁becoming ▁an ▁industry ▁tr end ▁due ▁to ▁increasing ▁market ▁demand ▁for ▁smaller ▁and ▁th inner ▁mobile ▁products . ▁According ▁to ▁the ▁research ▁firm ▁Y ole ▁Dé vel opp ement , ▁the ▁fan - out ▁pack aging ▁market ▁is ▁predicted ▁to ▁reach ▁$ 2 . 4 ▁billion ▁by ▁ 2 0 2 0 , ▁increasing ▁from ▁$ 1 7 4 ▁million ▁in ▁ 2 0 1 4 . ▁ ▁Wa fer - level ▁chip - scale ▁pack aging ▁( W L - C SP ) ▁is ▁the ▁technology ▁that ▁enables ▁the ▁smallest ▁available ▁packages ▁in ▁the ▁market , ▁meeting ▁the ▁increasing ▁demand ▁for ▁smaller ▁and ▁faster ▁port able ▁consumer ▁devices . ▁This ▁ult ra - th in ▁package ▁type ▁has ▁integrated ▁into ▁mobile ▁devices ▁such ▁as ▁smart ph ones . ▁In ▁October ▁ 2 0 0 1 , ▁A SE ▁began ▁volume ▁production ▁of ▁wa fer - level ▁chip - scale ▁packages . ▁ ▁F lip ▁chip ▁is ▁a ▁method ▁of ▁f li pping ▁over ▁the ▁chip ▁to ▁connect ▁with ▁either ▁substr ate ▁or ▁lead frame . ▁According ▁to ▁the ▁research ▁firm ▁Y ole ▁Dé vel opp ement , ▁the ▁f lip ▁chip ▁technology ▁market ▁value ▁is ▁expected ▁to ▁reach ▁$ 2 5 ▁billion ▁in ▁ 2 0 2 0 . ▁This ▁market ▁tr end ▁is ▁mainly ▁driven ▁by ▁mobile ▁and ▁wireless ▁devices