▁like ▁table ts , ▁computing ▁applications ▁such ▁as ▁servers , ▁and ▁consumer ▁applications ▁like ▁smart ▁TV s . ▁▁ 2 . 5 D ▁pack aging ▁can ▁enable ▁hundreds ▁of ▁thousands ▁of ▁inter connect s ▁within ▁a ▁small ▁package ▁space . ▁This ▁pack aging ▁technology ▁is ▁used ▁in ▁applications ▁such ▁as ▁high ▁memory ▁band width , ▁network ▁switch es , ▁router ▁ch ips ▁and ▁graphics ▁cards ▁for ▁the ▁g aming ▁market . ▁Since ▁ 2 0 0 7 , ▁A SE ▁has ▁been ▁working ▁with ▁A MD ▁to ▁bring ▁ 2 . 5 D ▁pack aging ▁technology ▁to ▁market . ▁The ▁two ▁companies ▁collabor ated ▁on ▁F iji , ▁a ▁ 2 . 5 D - based ▁GPU ▁processor ▁designed ▁for ▁extreme ▁gam ers , ▁which ▁is ▁small ▁enough ▁to ▁fit ▁a ▁ 6 - inch ▁PC B ▁and ▁connect s ▁ 2 4 0 , 0 0 0 ▁b umps . ▁In ▁June ▁ 2 0 1 5 , ▁F iji ▁was ▁officially ▁launched ▁at ▁the ▁E 3 ▁g aming ▁conference . ▁ ▁System ▁in ▁Package ▁( Si P ) ▁is ▁the ▁technology ▁for ▁bund ling ▁multiple ▁IC s ▁to ▁work ▁together ▁inside ▁a ▁single ▁package . ▁Si P ▁technology ▁is ▁being ▁driven ▁by ▁market ▁application ▁tr ends ▁in ▁wear ables , ▁mobile ▁devices ▁and ▁Internet ▁of ▁Things ▁( I o T ). ▁In ▁ 2 0 0 4 , ▁A SE ▁was ▁one ▁of ▁the ▁first ▁companies ▁to ▁begin ▁mass ▁production ▁of ▁Si P ▁technology . ▁In ▁April ▁ 2 0 1