ins ▁of ▁ 0 . 1 " ▁pitch ▁D IL ▁chip ▁allowing ▁connections ▁to ▁be ▁wrapped ▁and ▁the ▁wire ▁to ▁be ▁led ▁across ▁the ▁circuit ▁board ▁to ▁the ▁next ▁point ▁it ' s ▁needed . ▁ ▁The ▁wire ▁is ▁co ated ▁with ▁a ▁polym er ▁lac quer ▁( comm only ▁referred ▁to ▁as ▁en am el , ▁but ▁not ▁glass ▁based ). ▁Once ▁wrapped ▁the ▁connections ▁are ▁sol der ed , ▁the ▁heat ▁of ▁this ▁burning ▁the ▁lac quer ▁away ▁and ▁comple ting ▁the ▁joint . ▁Ins ulated ▁wire ▁is ▁normally ▁ 3 8 ▁SW G ▁( 0 . 1 5 mm ), ▁ground ▁connections ▁are ▁sometimes ▁made ▁with ▁un ins ulated ▁wire ▁which ▁is ▁slightly ▁heav ier ▁( 3 3 ▁SW G , ▁ 0 . 2 5 mm ). ▁ ▁A ▁well ▁vent il ated ▁area ▁and / or ▁f ume ▁extra ction ▁are ▁very ▁important ▁when ▁carrying ▁out ▁this ▁process ▁due ▁to ▁the ▁to xic ▁f umes . ▁Sometimes , ▁where ▁there ▁are ▁many ▁w ires , ▁pl astic ▁comb - like ▁structures ▁are ▁used ▁for ▁wire ▁management . ▁ ▁References ▁ ▁See ▁also ▁ ▁W ire ▁wrap ▁S older able ▁en am el ▁wire ▁ ▁External ▁links ▁http :// www . inst ruct ables . com / id / Me chan ical - Pro tot yp ing - P enc il / ▁ ▁Category : E lect ron ics ▁work ▁tools ▁Category : W ire <0x0A> </s> ▁A man cio ▁Jac into ▁Alc ort a ▁( August ▁ 1