▁las er ▁trim ming . ▁Many ▁chip ▁resist ors ▁are ▁made ▁using ▁thick - film ▁technology . ▁Lar ge ▁substr ates ▁are ▁printed ▁with ▁resist ors ▁fired , ▁divided ▁into ▁small ▁ch ips ▁and ▁these ▁are ▁then ▁terminated , ▁so ▁they ▁can ▁be ▁sol der ed ▁on ▁the ▁PC B ▁board . ▁With ▁las er ▁trim ming ▁two ▁modes ▁are ▁used ; ▁either ▁pass ive ▁trim ming , ▁where ▁each ▁res istor ▁is ▁trim med ▁to ▁a ▁specific ▁value ▁and ▁toler ance , ▁or ▁active ▁trim ming , ▁where ▁the ▁feedback ▁is ▁used ▁to ▁adjust ▁to ▁a ▁specific ▁voltage , ▁frequency ▁or ▁response ▁by ▁las er ▁trim ming ▁the ▁resist ors ▁on ▁the ▁circuit ▁while ▁power ed ▁up . ▁ ▁Mount ing ▁of ▁capac itors ▁sem icon duct ors ▁The ▁development ▁of ▁the ▁S MD ▁process ▁actually ▁evol ves ▁from ▁the ▁thick ▁film ▁process . ▁Also ▁mount ing ▁of ▁n aked ▁dies ▁( the ▁actual ▁sil icon ▁chip ▁without ▁enc aps ulation ) ▁and ▁wire ▁bond ing ▁is ▁a ▁standard ▁process , ▁this ▁provides ▁the ▁basis ▁for ▁min itu ar ization ▁of ▁the ▁circ uits ▁as ▁all ▁the ▁extra ▁enc aps ulation ▁is ▁not ▁necessary . ▁ ▁Se par ation ▁of ▁elements ▁This ▁step ▁is ▁often ▁necessary ▁because ▁many ▁components ▁are ▁produced ▁on ▁one ▁substr ate ▁at ▁the ▁same ▁time . ▁Thus , ▁some ▁means ▁of ▁separ ating ▁the ▁components ▁from ▁each ▁other ▁is ▁required . ▁This ▁step ▁may ▁be ▁achieved ▁by ▁wa fer ▁dic ing . ▁ ▁Integr ation ▁of ▁devices ▁At