nm ▁ 7 - series ▁F PG As , ▁X il inx ▁said ▁that ▁several ▁of ▁the ▁highest - dens ity ▁parts ▁in ▁those ▁F P GA ▁product ▁lines ▁will ▁be ▁constructed ▁using ▁multiple ▁dies ▁in ▁one ▁package , ▁employ ing ▁technology ▁developed ▁for ▁ 3 D ▁construction ▁and ▁stack ed - die ▁assemb lies . ▁ ▁X il inx ' s ▁approach ▁stack s ▁several ▁( three ▁or ▁four ) ▁active ▁F P GA ▁dies ▁side ▁by ▁side ▁on ▁a ▁sil icon ▁inter pos er   – ▁a ▁single ▁piece ▁of ▁sil icon ▁that ▁car ries ▁pass ive ▁inter connect . ▁The ▁multi - die ▁construction ▁also ▁allows ▁different ▁parts ▁of ▁the ▁F P GA ▁to ▁be ▁created ▁with ▁different ▁process ▁techn ologies , ▁as ▁the ▁process ▁requirements ▁are ▁different ▁between ▁the ▁F P GA ▁fabric ▁itself ▁and ▁the ▁very ▁high ▁speed ▁ 2 8 ▁G bit / s ▁serial ▁trans ce ivers . ▁An ▁F P GA ▁built ▁in ▁this ▁way ▁is ▁called ▁a ▁heter ogeneous ▁F P GA . ▁ ▁Al tera ' s ▁heter ogeneous ▁approach ▁involves ▁using ▁a ▁single ▁mon ol ith ic ▁F P GA ▁die ▁and ▁connecting ▁other ▁die / techn ologies ▁to ▁the ▁F P GA ▁using ▁Intel ' s ▁embedded ▁multi - die ▁inter connect ▁bridge ▁( EM IB ) ▁technology . ▁ ▁Design ▁and ▁programming ▁▁ ▁To ▁define ▁the ▁behavior ▁of ▁the ▁F P GA , ▁the ▁user ▁provides ▁a ▁design ▁in ▁a ▁hardware ▁description ▁language ▁( H DL ) ▁or ▁as ▁a