▁of ▁a ▁therm oe lect ric ▁device ▁is ▁measured ▁by ▁the ▁heat ▁moved ▁( or ▁p ump ed ) ▁divided ▁by ▁the ▁amount ▁of ▁elect rical ▁power ▁supplied ▁to ▁move ▁this ▁heat . ▁This ▁ratio ▁is ▁term ed ▁the ▁coefficient ▁of ▁performance ▁or ▁C OP ▁and ▁is ▁a ▁measured ▁characteristic ▁of ▁a ▁therm oe lect ric ▁device . ▁The ▁C OP ▁is ▁in vers ely ▁related ▁to ▁the ▁temperature ▁difference ▁that ▁the ▁device ▁produces . ▁As ▁you ▁move ▁a ▁cool ing ▁device ▁further ▁away ▁from ▁the ▁heat ▁source , ▁par as it ic ▁losses ▁between ▁the ▁cool er ▁and ▁the ▁heat ▁source ▁necess itate ▁additional ▁cool ing ▁power : ▁ ▁the ▁further ▁the ▁distance ▁between ▁source ▁and ▁cool er , ▁the ▁more ▁cool ing ▁is ▁required . ▁ ▁For ▁this ▁reason , ▁the ▁cool ing ▁of ▁electronic ▁devices ▁is ▁most ▁efficient ▁when ▁it ▁occurs ▁closest ▁to ▁the ▁source ▁of ▁the ▁heat ▁generation . ▁ ▁Use ▁of ▁the ▁thermal ▁b ump ▁does ▁not ▁dis place ▁system ▁level ▁cool ing , ▁which ▁is ▁still ▁needed ▁to ▁move ▁heat ▁out ▁of ▁the ▁system ; ▁rather ▁it ▁introdu ces ▁a ▁fund ament ally ▁new ▁method ology ▁for ▁ach ieving ▁temperature ▁uniform ity ▁at ▁the ▁chip ▁and ▁board ▁level . ▁ ▁In ▁this ▁manner , ▁overall ▁thermal ▁management ▁of ▁the ▁system ▁becomes ▁more ▁efficient . ▁In ▁addition , ▁while ▁conventional ▁cool ing ▁solutions ▁scale ▁with ▁the ▁size ▁of ▁the ▁system ▁( b igger ▁fans ▁for ▁bigger ▁systems , ▁etc .), ▁the ▁thermal ▁b ump ▁can ▁scale ▁at ▁the