pl ating ▁ ▁Screen ▁printing ▁ ▁W ax / P ary l ene ▁bond ing ▁ ▁Iss ues ▁with ▁magnetic ▁actu ation ▁ ▁High - power ▁diss ip ation . ▁This ▁is ▁a ▁major ▁problem ▁for ▁magnetic ▁ME MS , ▁but ▁work ▁is ▁under way ▁to ▁circum vent ▁this . ▁ ▁Fab ric ation ▁of ▁the ▁co il ▁ ▁Integr ation ▁of ▁the ▁mic romagnet ▁into ▁the ▁ME MS ▁device ▁ ▁Process - material ▁compatibility ▁ ▁Integr at ability ▁into ▁the ▁overall ▁micro fab ric ation ▁process ▁( m aint ain ▁cost ▁and ▁through put ) ▁ ▁So ▁that ▁pre ex isting ▁processes ▁in ▁the ▁fabric ation ▁of ▁the ▁ME MS ▁device ▁will ▁not ▁be ▁tam per ed ▁with , ▁de position ▁temper atures ▁and ▁post - de position ▁treatment / cond itions ▁must ▁be ▁toler able . ▁Also , ▁the ▁mic romagnet ▁must ▁be ▁able ▁to ▁with stand ▁any ▁chemical ▁treatment ▁that ▁will ▁come ▁after ▁its ▁de position ▁ ▁Iss ues ▁with ▁magnet ization ▁( One ▁may ▁want ▁to ▁have ▁more ▁than ▁one ▁direction ▁of ▁magnet ization ; ▁this ▁creates ▁a ▁problem ) ▁ ▁Each ▁of ▁these ▁challeng es ▁can ▁be ▁mit ig ated ▁or ▁less ened ▁by ▁the ▁right ▁choice ▁of ▁material , ▁choice ▁of ▁m old ing ▁or ▁fabric ation ▁method , ▁and ▁the ▁type ▁of ▁device ▁that ▁is ▁to ▁be ▁constructed . ▁App lications ▁of ▁the ▁magnetic ▁actu ator ▁include : ▁the ▁synth etic ▁jet ▁actu ator , ▁micro - p umps ▁and ▁micro - rel ays . ▁