▁b umps ▁is ▁applied ▁only ▁where ▁needed , ▁thereby ▁reducing ▁the ▁added ▁power ▁necessary ▁to ▁drive ▁the ▁cool ing ▁and ▁reducing ▁the ▁general ▁thermal ▁overhead ▁on ▁the ▁system . ▁ ▁Power ▁generation ▁In ▁addition ▁to ▁chip ▁cool ing , ▁thermal ▁b umps ▁can ▁also ▁be ▁applied ▁to ▁high ▁heat - fl ux ▁inter connect s ▁to ▁provide ▁a ▁constant , ▁steady ▁source ▁of ▁power ▁for ▁energy ▁sc av eng ing ▁applications . ▁Such ▁a ▁source ▁of ▁power , ▁typically ▁in ▁the ▁m W ▁range , ▁can ▁trick le ▁charge ▁batter ies ▁for ▁wireless ▁sensor ▁networks ▁and ▁other ▁battery ▁operated ▁systems . ▁ ▁References ▁ ▁External ▁links ▁K ul ic ke ▁& ▁So ff a ▁M CN C ▁A pt os ▁Technology ▁Next reme ▁Th erm al ▁Sol utions ▁Am kor ▁Technology ▁Inc . ▁ ▁White ▁Pap ers , ▁Articles ▁and ▁Application ▁Notes ▁▁ ▁" F lip ▁Ch ip ▁B ump ▁Elect rom igration ▁R eli ability ▁A ▁comparison ▁of ▁Cu ▁P ill ar , ▁High ▁P b , ▁Sn Ag ▁and ▁Sn P b ▁B ump ▁Struct ures ", ▁White ▁P aper ▁ ▁Category : E lect ron ics ▁manufact uring ▁Category : Sem icon duct ors ▁Category : Th erm od ynam ics ▁Category : E mer ging ▁techn ologies <0x0A> </s> ▁A ▁Wilhelm ▁S cre am , ▁released ▁on ▁November ▁ 2 0 , ▁ 2 0 0 9 ▁through ▁P aper ▁+ ▁Pl ast ick , ▁is ▁the ▁second ▁EP ▁and ▁in ▁all ▁the ▁fifth ▁release ▁from ▁the ▁Massachusetts -