ale ▁Pack ages ▁( C SP ). ▁ ▁There ▁were ▁a ▁number ▁of ▁companies ▁developing ▁products ▁in ▁this ▁area . ▁ ▁These ▁products ▁could ▁usually ▁be ▁put ▁into ▁one ▁of ▁two ▁cam ps : ▁either ▁they ▁were ▁scale d ▁down ▁versions ▁of ▁the ▁multi - ch ip ▁on ▁cer am ic ▁package ▁( of ▁which ▁the ▁T ess era ▁package ▁would ▁be ▁one ▁example ); ▁or ▁they ▁were ▁the ▁stream lined ▁versions ▁developed ▁by ▁Un itive ▁Electron ics , ▁et ▁al . ▁( where ▁the ▁package ▁w iring ▁had ▁been ▁transferred ▁to ▁the ▁chip , ▁and ▁after ▁b ump ing , ▁they ▁were ▁ready ▁to ▁be ▁placed ). ▁ ▁One ▁of ▁the ▁issues ▁with ▁the ▁C SP ▁type ▁of ▁package ▁( which ▁was ▁intended ▁to ▁be ▁sol der ed ▁directly ▁to ▁an ▁FR 4 ▁or ▁flex ▁circuit ) ▁was ▁that ▁for ▁high - dens ity ▁inter connect s , ▁the ▁soft ▁sol der ▁b ump ▁provided ▁less ▁of ▁a ▁stand - off ▁as ▁the ▁sol der ▁b ump ▁diameter ▁and ▁pitch ▁were ▁decre ased . ▁ ▁D ifferent ▁solutions ▁were ▁employed ▁including ▁one ▁developed ▁by ▁F ocus ▁Inter connect ▁Technology ▁( former ▁A PT OS ▁engine ers ), ▁which ▁used ▁a ▁high ▁aspect ▁ratio ▁pl ated ▁co pper ▁post ▁to ▁provide ▁a ▁larger ▁fixed ▁st ando ff ▁than ▁was ▁possible ▁for ▁a ▁soft ▁sol der ▁collapse ▁joint . ▁ ▁Today , ▁f lip ▁chip ▁is ▁a ▁well ▁established ▁technology ▁and ▁col lapsed ▁soft ▁sol der ▁connections ▁are ▁used ▁in ▁the ▁vast ▁majority ▁of