▁printed ▁circuit ▁bo ards , ▁elect rical ▁enc aps ulation , ▁ad hes ives ▁and ▁coat ings ▁for ▁metal . ▁ ▁Ben z ox az ines , ▁used ▁alone ▁or ▁hy brid ised ▁with ▁epo xy ▁and ▁phen ol ic ▁res ins , ▁for ▁struct ural ▁pre pre gs , ▁liquid ▁m old ing ▁and ▁film ▁ad hes ives ▁for ▁composite ▁construction , ▁bond ing ▁and ▁repair . ▁ ▁Poly im ides ▁and ▁Bis male im ides ▁used ▁in ▁printed ▁circuit ▁bo ards ▁and ▁in ▁body ▁parts ▁of ▁modern ▁aircraft , ▁a eros pace ▁composite ▁structures , ▁as ▁a ▁co ating ▁material ▁and ▁for ▁glass ▁rein for ced ▁pip es . ▁ ▁Cy an ate ▁est ers ▁or ▁poly cy an ur ates ▁for ▁electron ics ▁applications ▁with ▁need ▁for ▁die lect ric ▁properties ▁and ▁high ▁glass ▁temperature ▁requirements ▁in ▁a eros pace ▁struct ural ▁composite ▁components . ▁ ▁Mold ▁or ▁m old ▁run ners ▁( the ▁black ▁pl astic ▁part ▁in ▁integrated ▁circ uits ▁or ▁sem icon duct ors ). ▁ ▁Fur an ▁res ins ▁used ▁in ▁the ▁manufact ure ▁of ▁sust ain able ▁bio compos ite ▁construction , ▁c ements , ▁ad hes ives , ▁coat ings ▁and ▁casting / found ry ▁res ins . ▁▁ ▁Sil ic one ▁res ins ▁used ▁for ▁therm os et ▁polym er ▁matrix ▁compos ites ▁and ▁as ▁cer am ic ▁matrix ▁composite ▁prec urs ors . ▁ ▁Th i oly te , ▁an ▁elect rical ▁ins ulating ▁therm os et ▁phen ol ic ▁l amin