The NovaSensor P1905 Backside Absolute Pressure Sensor Die is a piezoresistive sensor die designed for absolute pressure measurements in aggressive (harsh) media. The die has a reference vacuum chamber formed by hermetic low-stress bonding of silicon cap to the top side of device wafer. By applying pressure from backside of the die, P1905 sensor die eliminates the direct contact of sensor circuitry on top side with the applied media, which allows the P1905 die to measure pressure in aggressive liquids and gases. With NovaSensor's SenStable® process, P1905 die features excellent long-term stability and repeatability (< 0.1% / year typ.).
All values measured at 25ºC and 5 V excitation, unless otherwise noted. Samples from each wafer are used to verify bridge resistance, offset, span, linearity and die performance in the temperature range between 0ºC and 70ºC.
Backside burst pressure and operating temperature for sensor utilizing P1905 die can be lower than corresponding parameters for the die.
Typical span is equal to 160 mV at 300 psi.