article_snippet: ‘Methods for shielding electronic components from moisture’
article_snippet: a waterproof coating inside the headphone jack would be applied using a method called plasma-assisted chemical vapour deposition (PACVD), which desposits thin films from gas, or vapour, states to solid states.
article_snippet: ‘portions of the shields that overlay water sensitive electronics.’
article_snippet: a waterproof coating inside the headphone jack would be applied through these perforations, and the board-to-board connectors would be covered by a silicone seal.
article_snippet: ‘portions of the shields that overlay water sensitive electronics.’
article_snippet: a hydrophobic coating would be applied through these perforations, and the board-to-board connectors would be covered by a silicone seal .
article_snippet: Meanwhile the board-to-board connectors inside the phones (components illustrated left) would be covered by a silicone seal.
highlights_snippet: Files detail a system of adding ‘hydrophobic coating to components’
  