article_snippet: Apple’s patent would instead involve coating individual components inside a phone, and within an already assembled circuit board.
article_snippet: In the case of the fully-assembled circuit board and The plasma electromagnetic interference (EMI) shields, Apple proposes perforating
article_snippet: In the case of the fully-assembled circuit boards and electromagnetic interference (EMI) shields, Apple proposes perforating
highlights_snippet: Apple proposes perforating circuit boards and applying a thin film inside .
  
highlights_snippet: The technology could form part of the Apple’s iPhone 7 range .
  