1

5G Cellular User Equipment:
From Theory to Practical Hardware Design

arXiv:1704.02540v3 [] 19 Jul 2017

Yiming Huo, Student Member, IEEE, Xiaodai Dong, Senior Member, IEEE, and Wei Xu, Senior Member, IEEE,

Abstract—Research and development on the next generation
wireless systems, namely 5G, has experienced explosive growth in
recent years. In the physical layer (PHY), the massive multipleinput-multiple-output (MIMO) technique and the use of high
GHz frequency bands are two promising trends for adoption.
Millimeter-wave (mmWave) bands such as 28 GHz, 38 GHz, 64
GHz, and 71 GHz, which were previously considered not suitable
for commercial cellular networks, will play an important role in
5G. Currently, most 5G research deals with the algorithms and
implementations of modulation and coding schemes, new spatial signal processing technologies, new spectrum opportunities,
channel modeling, 5G proof of concept (PoC) systems, and other
system-level enabling technologies. In this paper, we first investigate the contemporary wireless user equipment (UE) hardware
design, and unveil the critical 5G UE hardware design constraints
on circuits and systems. On top of the said investigation and
design trade-off analysis, a new, highly reconfigurable system
architecture for 5G cellular user equipment, namely distributed
phased arrays based MIMO (DPA-MIMO) is proposed. Finally,
the link budget calculation and data throughput numerical results
are presented for the evaluation of the proposed architecture.
Index Terms—5G, massive multiple-input-multiple-output
(MIMO), millimeter-wave (mmWave), user equipment (UE),
hardware.

I. I NTRODUCTION
In the cellular world, tremendous efforts have been devoted
to delivering higher quality of service (QoS) and quality of
experience (QoE) since the very first cell phone call was made
in 1973. In the 3rd Generation Partnership Project (3GPP)
roadmap, several representative techniques have marked the
milestones to further accelerate such trend, namely: device-todevice (D2D) communication for boosting geographic spectrum reusability [1]; heterogeneous and small-cell network
(HetSNet) targeting at deploying small cells in addition to
macro cells at the same or different carrier frequencies [2];
carrier aggregation (CA) for larger radio frequency (RF)
bandwidths; new carrier type (NCT) for increasing spectral
efficiency and spectrum flexibility, and reducing interference
and power consumption [3]; higher order modulation schemes
and more layers of spatial multiplexing (SM) for higher
spectral efficiency (SE). In 3GPP release 12, 8 × 8 multipleinput-multiple-output (MIMO) for downlink, 4 × 4 MIMO
for uplink, 5 carrier components (CCs) and 256 quadrature
amplitude modulation (QAM) are supported to satisfy the
increasing wireless capacity needs.
Y. Huo, and X. Dong are with the Department of Electrical and Computer Engineering, University of Victoria, Victoria, BC V8P 5C2, Canada
(ymhuo@uvic.ca, xdong@ece.uvic.ca).
W. Xu is with the National Mobile Communications Research Laboratory
(NCRL), Southeast University, Nanjing 210096, China (wxu@seu.edu.cn).

As part of the QoS requirement of 5G networks, the 5G peak
downlink throughput (PDLT) is expected to achieve 10 Gbps in
the dense urban environments [4]. Delivering such high speed
data to end-users is an essential prerequisite for a satisfying
QoE which is perceived subjectively. Furthermore, this high
PDLT can be translated into a very high SE requirement
of at least 100 bits/s/Hz based on the maximum 100 MHz
bandwidth (BW) that a mobile network operator currently can
support through enabling 5 CCs. If the RF bandwidth is fixed,
such high SE requirement leads to using either higher order
modulation scheme, more layers of SM, or both. The PDLT
is given by
PDLT ∝ (BRF × NQAM × NCA × NMIMO )

(1)

where BRF is the RF bandwidth for one single carrier, NQAM
represents the modulation order, NCA is the number of aggregated carriers, and NMIMO stands for the number of MIMO
spatial multiplexing layer. Therefore, the SE can be expressed
as
SE ∝ (NQAM × NCA × NMIMO ).

(2)

Nevertheless, from the implementation point of view, high
modulation order and wide RF bandwidth unavoidably require power-hungry, complicated and high-performance RF
and baseband circuits. On the other hand, high order of
MIMO is confronted with the limitation of antennas’ physical
dimension, spacing, and radiation efficiency (RE). Based on
emerging UE design techniques, a mobile phone handset
can accommodate at most 4 × 4 MIMO antennas with 256QAM modulation [5], which theoretically boosts PDLT up
to approximately 1960 Mbps when using 5 CCs. On the
other hand, such UE design already reaches the maximum
spatial multiplexing gain due to the limited hardware area for
embedding MIMO antennas of low GHz frequency bands. As
a result, at the UE end, the highest achievable SE is around 20
bits/s/Hz. With the said SE, achieving 10 Gbps PDLT would
require at least 500 MHz bandwidth, which is currently not
possible in terms of the limited spectrum holdings of service
providers.
Meanwhile, Wi-Fi technologies have been advancing
rapidly. The cutting-edge off-the-shelf IEEE 802.11ac compatible wireless products can support a 4 × 4 multi-user
MIMO (MU-MIMO) for downlink. By using unlicensed 60
GHz Millimeter-wave (mmWave) frequency bands, wireless
gigabit alliance (WiGig) IEEE 802.11ad products deliver even
higher data rate for short-range communications [5]. The yet
to be released IEEE 802.11ax and 802.11ay standards that are

2

deemed as the successors of 802.11ac and 802.11ad respectively, are expected to provide improved QoS such as better
communication coverage and reduced latency. Besides WiFi,
Bluetooth, near-field communication (NFC) and global navigation satellite system (GNSS) are also integrated in mobile
handset terminals. These wireless technologies will compete
with cellular for hardware resources and design budget on
an already highly compact, multi-functional, multi-standard
wireless handset terminal. For example, a huge challenge is to
integrate antenna systems for different wireless technologies
that occupy a very wide range of frequency (from 700 MHz
to almost 6 GHz), and implementing high order MIMO can
make it even more serious considering the limited dimension
of a mobile handset device.
In light of these challenging issues in sub-6 GHz, the high
GHz frequency bands used to be considered unsuitable for
commercial cellular networks are now attracting significant
attention. On July 14, 2016, the Federal Communications
Commission (FCC) voted to adopt a new Upper Microwave
Flexible Use service in the licensed bands, namely 28 GHz
(27.5-28.35 GHz), 37 GHz (37-38.6 GHz), 39 GHz (38.6-40
GHz), plus a new unlicensed band at 64-71 GHz [7]. This
initiative taken by the FCC helps mitigate the 5G UE design
challenges. First, larger continuous RF bandwidth enables
higher data rates. Second, using mmWave frequencies leads to
a significant reduction of antenna dimension, and as a result,
the form factor of the UE can be maintained while facilitating
beamforming (BF) and spatial multiplexing.
In this paper, we present a novel distributed phased array
MIMO (DPA-MIMO) architecture for 5G UE hardware design.
The remainder of this paper is organized as follows, Section II
investigates the contemporary wireless UE design and explains
the design constraints. Section III presents the details of 5G
UE hardware design challenges, and proposes a novel system
architecture to address these challenges. Section IV conducts
the performance evaluation of the proposed system based on
the link budget calculation and comparison with state-of-theart 5G works. Finally, Section V concludes this paper.
II. WIRELESS UE DESIGN OVERVIEW
Contemporary wireless UE design becomes more challenging and complicated than ever. In any mainstream mobile
phone, it does not only need to co-exist with several prevailing
wireless technologies, but also integrate the camera(s), audio,
battery, display, fingerprint scanner, vibrator, gyroscope, wireless charging, etc. In the near future, there will be a stronger
need to enable or enhance various functions and technologies,
such as virtual reality (VR), augmented reality (AR), internet
of vehicles (IoV) [8], and so on, all of which further increases
the difficulty level of UE design. In this section, the major
design methods and constraints are discussed from several aspects, namely battery, circuit and system, antenna and product
design, and other system design trade-offs.
A. Battery Design Constraints
As plotted in Fig. 1, the data rates of both WiFi and
cellular increase by around 10 folds for every five years.

Fig. 1. Increment of the wireless capacity versus the battery performance
improvement.

On the other hand, during the last 20 years, the battery
technique for mobile devices has been through three major
technical transitions, which starts with nickel-cadmium (NiCd)
battery, then the nickel-metal hydride (NiMH) battery, and
eventually the current mainstream lithium-ion (Li-ion) battery
[9]. From 1995 to 2014, the wireless capacity has increased
by around 10,000 times [10], while only 4-5 folds increment
of battery specific power have been achieved for the same
period. Apparently, this mismatch becomes one of the current
bottlenecks for mobile handset devices and affects the quality
of user experience. Despite the recent battery research on
new anode materials [11], before the advent of significant
breakthrough in battery performance and feasibility for mass
production, higher energy efficiency of the UE wireless system
will be critically relevant.
B. Circuit and System Design
The performance of a wireless system, from a hardware
perspective, depends on the evolution of design arts in systemon-chip (SoC), printed-circuit board (PCB), mechanical design, and antenna design. The SoCs of high energy efficiency,
small area, low cost and high yield, are always strongly
desired. For the current SoC design, a widespread fact is
that Moore’s law slows down when the process dimension
enters the deep-nanometer regime [12]. Consequently, the
speed of energy efficiency improvement is moderated. Before
any proven success with novel IC processes based on new materials, the contemporary silicon and III-IV compound based
semiconductor processes, such as complementary metal-oxidesemiconductor (CMOS), CMOS silicon on insulator (SOI),
fin field effect transistor (FinFET), silicon germanium (SiGe),
gallium arsenide (GaAs), gallium nitride (GaN) and indium
phosphide (InP), still play a dominant and critical role in the
future 5G SoC designs.
Likewise, the multi-layer board design of a 5G mobile handset will become more compact and integrated to accommodate
an increasing number of SoC chipsets for enabling various
functions, standards, and technologies. On the main logic
board (MLB) of a mobile handset as depicted in Fig. 2, there

3

connectors

SIM Card
Slot

Antenna
Connector
Application
Processor

Microwave
shield cover

SRAM
Memory

Baseband
Processor
Transceivers

LB
PAs

At the same time, there is requirement that high efficiency
and low specific absorption rate (SAR) are both fulfilled after
assembling antennas into the handset housing made of metallic
casing.
Therefore, the co-design of antennas, metal casing, and
handset housing is enormously challenging since the latter
two factors could generate substantial effects on antenna
performance [15]. Narrow frame and metallic casing are still
the unswerving trends currently and in the near future, because
they enable better protection, portability, heat dissipation and
aesthetic appearance. The slim form factor improves the user
experience, and can be seen in several recent mainstream
smartphones as shown in Table I.

HB
PAs

PA
Management

TABLE I
D IMENSION INFORMATION OF SMARTPHONES .
Model

Fig. 2. An example of main logic board in contemporary smartphones.

are cellular/WiFi RF transceivers, antenna switch modules,
power amplifier (PA) modules, baseband (BB) modem, NFC,
bluetooth, GNSS, application processor (AP), PA management
unit, static random-access memory (SRAM), power management unit (PMU), etc. Nowadays, these highly customized
chipsets are supplied by various vendors who design and
fabricate them with different processes.
Similar to the trend in IC design, the footprint of PCB
is continuously downsizing to smaller trace width and trace
spacing. As a result, more chipsets can be embedded on
one single main logic board, which results in less insertion
loss (IL) and easier impedance matching. Therefore the RF
front-end loss caused by IL and impedance mismatching are
reduced, and the receiver (RX) sensitivity and transmitter (TX)
power can be improved. On the other hand, signal integrity is
an issue in a more complicated MLB design. For example,
the clock signals and their harmonics, through complicated
signal path and modulation, can end up at the receiver end
in the form of spur. Therefore, a microwave shield cover
is normally used on MLB to improve the electromagnetic
compatibility/electromagnetic interference (EMC/EMI) performance. Another frequently seen issue is the degradation of
sensitivity, or ‘desense’, which is typically caused by TX
output leaked into the RX path due to insufficient isolation
between TX and RX ports. This issue is more serious in the
case of carrier aggregation, for example, when the harmonic
of a transmit signal falls in the receive band of a paired CA
band [13]. As can be predicted, these issues will become more
prevailing in a 5G terminal device.
C. Antenna and Product Design
Antenna design is another matter of importance in wireless
systems. Unlike any of its priors [14] in the 2G/3G era,
current mobile handset antennas are expected to support not
only multi-bands and multi-standards in a wide range of
frequency from 700 MHz to 6 GHz (with some uncovered
gaps), but also enable certain degrees of diversity and SM.

Samsung
S7 edge
Apple
iPhone 7 plus
Huawei
Mate 9
Google
Pixel XL

Dimension
( H × W × D, mm)

Display
Size (inch)

Weight
(g)

150.9 × 72.6 × 7.7

5.5

157

158.2 × 77.9 × 7.3

5.5

188

156.9 × 78.9 × 7.9

5.9

190

154.7 × 75.7 × 7.3

5.5

168

The antenna dimension is proportional to the effective
wavelength, and this relation can be approximated as
c0
λe = √
(3)
f εe
where c0 is the speed of light in vacuum, f is the frequency,
and εe is the effective dielectric constant that makes the effective wavelength shorter. Furthermore, the effective dielectric
constant can be derived using the following equations [16]
(
εr + 1 εr − 1
1
q
εe =
+

2
2
H
1 + 12 W

 2 )
(4)
W
+0.04 1 −
,
H
subject to W/H < 1
εe =

εr + 1
εr − 1
+ q
2
2 1 + 12

H
W



(5)

subject to W/H ≥ 1
where εr stands for the relative dielectric constant, W is the
width of antenna, and H is the thickness of the antenna
substrate. Therefore, the antenna dimension is mainly determined by the frequency and substrate material. Although
higher dielectric constant reduces the antenna dimension, it
degrades the antenna performance as more radiation energy
will be confined inside the substrate instead of being radiated.
In the 5G era, the handset antenna design faces more
challenges in order to cover the legacy 3GPP standards and
new 5G standards which regulate the use of higher GHz
frequency bands. From this point of view, implementing large
scale MIMO at low GHz frequencies becomes very difficult

4

form factor. The placements of camera, speaker, finger scanner,
battery, MLB, also require careful consideration as they can
change the electro-magnetic (EM) field and lead to undesired
effects. To summarize here, contemporary wireless UEs need
to provide high quality of user experience determined and
contributed by comprehensive factors which not only lie in the
wireless system design, but also mechanical design, product
design, operating system design, etc. Consequently, many
design trade-offs must be considered for a high-performance
5G UE. By taking the cellular standard as an example, the
figure-of-merit (FOM) of a cellular UE can be formulated as
FOMCellular,UE =
Pn,max PDLTBand,n
Non-CA
n=1

Beff,n Pn

+

Pm,max
m=2

PDLTBands
CC,m
Beff,m Pm

(6)

VUE · MUE
Fig. 3. Disassembly of a smartphone to front and back parts.

Rad
iatio
n

Patt

ern

Fig. 4. Talk mode using a specific anthropomorphic mannequin (SAM) head
phantom.

as it normally requires a minimum spacing to guarantee good
isolation. As for the mmWave antenna design, more antenna
elements can be accommodated thanks to downsizing, but the
metal casing can deteriorate the antenna performance.
D. System Design Trade-offs
In addition to the aforementioned three major design considerations, there are also high-level design constraints between
the wireless subsystem and other UE components. Besides
the power budget and hardware area allocation, one more
critical technical challenge originates from the interference
among different components. For example, the display screen
can cause the RF sensitivity degradation. Therefore, a sheet
of metallic microwave (MW) shield is normally put between
the display unit and hardware part to enhance the isolation as
shown in Fig. 3 which briefly depicts a cell phone opened from
middle. Moreover, this MW shield can minimize the SAR in
the common use cases when the screen side is held close to
the head of a smartphone user, as illustrated in Fig. 4.
In other words, antennas radiate minimal signal through
the screen, and therefore it can only propagate the signal in
the direction away from the human head. Nevertheless, the
shield increases the thickness of the handset and degrades the

PDLTBand,n
non-CA

where
is the PDLT of the 3GPP band n when
carrier aggregation is not enabled (non-CA). Beff,n and Pn
stand for the effective bandwidth and power consumption
respectively, when the wireless UE works in the non-CA mode.
Moreover, the effective bandwidth is the bandwidth of the
used band which has excluded the guard band. Accordingly,
PDLTBands
CC,m represents the PDLT of the carrier aggregation of m
CCs, and the superscript m, max is the maximum number of
CCs, defined to be up to 5 in 3GPP Release 13. Thus, the first
and second terms of the numerator add up the energy-spectral
efficiency of both non-CA and CA cases for all cellular bands
and CA combinations supported by the wireless UE, then we
divide the result by the volume VUE and weight MUE of the
wireless UE. The denominator reflects the ‘score’ of electricalmechanical co-design and the portability of the wireless UE.
Therefore the unit of FOMCellular,UE is bit/Hz/Joule/mm3 /gram.
It is obvious that more bands and CCs, higher SE, smaller
volume and weight, can result in a higher FOM of wireless
UE, which means a better comprehensive design. It is worth
mentioning that the material cost of the UE is not taken into
consideration in the equation for well-defined comparison.
III. 5G CELLULAR UE BASED ON A NOVEL
SYSTEM ARCHITECTURE
The foremost challenge of using high GHz frequency bands
comes from the propagation loss that is significantly higher
and more complicated than sub-6 GHz frequency bands. Based
on the most recently published 5G channel model [17], [18],
plus atmospheric absorption and rain attenuation models in
[19], [20], the path loss comparison for different propagation
scenarios are given in Table II for three frequency bands,
namely 2.6 GHz, 28 GHz, and 39 GHz.
A. Channel Model Analysis
As presented in Table II, the path loss of non-line-of-sight
(NLOS) is much larger than that of line-of-sight (LOS), and
LOS of the urban macro (UMa) scenario has similar path loss
to the LOS urban microcell (UMi) scenario. However, the path
loss in UMi Street Canyon NLOS is much more severe than
UMa NLOS or UMi Street Open. In addition, for all scenarios,
the path loss of 28 and 39 GHz are at least 20 dB larger than

5

TABLE II
C ALCULATION AND COMPARISON OF PATH LOSS .

Frequency/distance
LTE Band 41
2.6 GHz, d=100m
28 GHz, d=100m
39 GHz, d=100m
39 GHz, d=100m,
rain and oxygen loss1
LTE Band 41
2.6 GHz, d=1 km
28 GHz, d=1 km
39 GHz, d=1 km
39 GHz, d=1 km,
rain and oxygen loss1
1

UMa-LOS

Path loss of popular deployment scenarios (dB)
UMi-Street
UMi-Street
UMi-Street
UMa-NLOS
Canyon-LOS
Canyon-NLOS
Open-LOS

UMi-Street
Open-NLOS

84.8

107.5

83.4

112.7

81.9

105.6

105.5
108.4

128.2
131.1

104.1
107

133.4
136.3

102.6
105.5

126.3
129.2

109.4

132.1

108

137.3

106.5

139.2

104.9

137.5

103.2

144.6

100.4

134.5

125.5
128.4

158.2
161.1

123.9
126.8

165.3
168.2

121.1
124

155.2
158.1

136.5

169.2

134.9

176.3

132.1

166.2

Heavy rain of 25mm/h model is used

LTE band 41. In order to combat such large path loss, the FCC
regulation allows base station (BS) to transmit at 75 dBm per
100 MHz [7]. Moreover, the power loss caused by oxygen
absorption and rain attenuation are comparatively small.
Apart from the path loss and atmospheric or rain attenuation loss, the building penetration loss depends on different
materials. Particularly for the concrete wall, the penetration
loss significantly increases with frequency [18], and it can be
as high as 117 dB for 28 GHz. In light of these challenges,
beamforming is mandatory at both the BS and UE end.
B. Novel Distributed Phased Array Based MIMO Architecture
Implementing mmWave beamforming at the UE end is more
difficult than at the BS end since it is largely constrained by
high energy efficiency requirement, limitations in battery life
and hardware dimension which are key FOM contributors.
The conventional concept of BF is a method to increase the
signal-to-noise-ratio (SNR) and reduce channel interference of
a single data stream, but does not provide spatial multiplexing
gain by delivering multiple streams.
For the antenna array design of a BF module, the spacing
between antenna elements is critically important because it is
directly relevant to the grating lobe when the array operates
the beam steering. A grating lobe, or side lobe is undesired in
the antenna array because it degrades the gain and radiation
efficiency of an array [22]. Furthermore, for a given maximum
amount of beam steering θmax , the spacing d between two
neighboring antenna elements has to be maintained as [22]
d
1
≤
,
λ0
1 + cosθmax

(7)

where λ0 is the free space wavelength. Furthermore, a maximum spacing of λ0 /2 is normally used to avoid grating lobes.
On the other hand, in a MIMO system, enough separation
between two antenna elements needs to be maintained so that
a good spatial multiplexing gain can be obtained. The adjacent
element spacing depends on the specific antenna array design
and use case. In order to avoid significant capacity degradation,
adjacent element spacing should be larger than 1.5λ0 for the
uniform square array (USA) [23].

Therefore, the design principles for antenna arrays used
for beamforming and MIMO antennas used for spatial multiplexing are quite different. It is not feasible and practical
to make an M×N-element antenna array which is designed
and optimized for beamforming to be perfectly used as M×N
MIMO antennas and vice versa.
Consequently, at the UE end, a new system architecture
needs to be proposed to enable the functionality including both
beamforming and spatial multiplexing, for different application
scenarios.
Assuming the appearance of 5G mobile phone is similar to
the emerging 4G ones, for example, the anticipated volume is
around 160 × 80 × 8 mm, and the SIM card slot is removed
due to the use of embedded subscriber identity module (eSIM)
or virtual SIM that can be integrated into a chipset. To be
more specific, eSIM is designed and implemented by the UE
manufacturer, and it removes the need of physical SIM card
while easing the process of switching service provider [21]. It
makes the UE device neat and user-friendly by getting rid of
the physical SIM card tray, which is critical to not only the
5G UE but also the internet of things (IoT) devices such as
wearable devices.
A proposed 5G prototyping hardware design is illustrated
in Fig. 5 where eight identical 8-element phased array based
BF modules are distributed and placed in the back housing
of a mobile handset. This new architecture is referred to
as the distributed phased arrays based MIMO (DPA-MIMO)
architecture, several advantages can be observed as follows.
1) Each BF module, embedding one RF transceiver
chain, realizes an active phased array of NANT (=8
in this example) antenna elements. Now we can use
an example to estimate the effective isotropic radiated
power (EIRP). Assume that a PA has an output power
of PPA , and the output power is split into NANT equal
parts and fed into a NANT -element phased array. At the
phased array output, we can obtain an EIRP which is
10log10 (NANT ) (=9) dB higher than PPA . Furthermore,
if we remove that PA and place one PA in the front-end
path of each antenna element, and the output power
of all PAs is maintained at PPA (not scaled down with
the increased number of front-ends [6]), the EIRP can

6

80 mm
BF Module 1

d’ISOL

5G
IF Radio

dISOL

4 × 4 MIMO SM mode. Finally, in position (iv), all BF
modules can work simultaneously and support a 8 × 8
MIMO SM mode.

BF Module 2

Top
Corners
5G
IF Radio
BF Module 4

Coax cable

WLAN/BT/
GNSS

Application
Processor

BF Module 3

160 mm

SRAM
Memory
Coax cable

Baseband
Processor 1

BF Module 5

Central
Part

BB
Proc. 2

BF Module 6
5G
IF Radio

2G/3G/4G
TRX

5G
IF Radio

2G/3G
/4G
PAs

Coax cable

Bottom
Corners
BF Module 7

4) Based on the design methodologies and consideration
discussed above, placing BF modules at top two
corners, bottom two corners, and the central part of the
mobile device is mandatory in order to overcome the
human body (hand) blockage issue. Therefore, NBF is
flexible but has to be more than 5 as long as it satisfies
the minimum isolation spacing. It is worth mentioning
that, efficient adaptive beam tracking algorithms need
to be employed for both BS and UE ends so that the
two beams from BS and UE can be precisely aligned
with acceptable latency.

BF Module 8

Fig. 5. Proposed DPA-MIMO architecture in mobile phone handset from
back side transparent view.

be boosted to be 20log10 (NANT ) (=18) dB higher than
PPA . Therefore, in this scenario, NPA (=NANT ) PAs
contribute the extra 10log10 (NANT ) (=9) dB gain on
top of the first EIRP, but at the cost of higher power
consumption.
2) A total number of NBF (=8 in this example) BF
modules, with enough spacing and isolation, can also
cooperate as 8 MIMO antennas to process a maximum
number of 8 streams. Thus, the spatial multiplexing gain
can be obtained to further increase the link throughput
by multiple times.
3) The DPA-MIMO topology provides a solution to
human body blockage which could lead to severe
attenuation at mmWave frequencies [24]. For example,
the attenuation can be as high as 30 to 40 dB for
the 73 GHz band as given in [25]. According to the
study of mobile phone user habits [26], the mobile
handset is usually held in several popular positions as
depicted in Fig. 6. In position (i) and (ii), thanks to the
DPA-MIMO architecture, BF modules 1 and 2 can still
work normally, either independently or cooperatively
in a 2 × 2 MIMO SM mode; in case (iii), BF modules
3-6 can work either independently or cooperatively in a

5) From the wireless hardware design point of view, the
distributed phased arrays based architecture can help
heat dissipation which is largely contributed by the
PAs. In the state-of-the-art PA design for 5G phased
arrays, the power added efficiency (PAE) is below 20%
[27]. Therefore the majority of the DC power will be
converted into the thermal energy which increases the
inner temperature of a mobile handset and potentially
leads to a critical failure of the entire system. This issue
is more pronounced when multiple mmWave PAs are
integrated in the BF modules and the handset is operated
at cell edge or with heavy traffic load. By arranging
the mmWave BF modules in a distributed manner, it
can largely mitigate this self-heating issue. Otherwise a
cooling device is required [28], however it is difficult to
implement in a compact mobile handset.
C. Beamforming Module Hardware Design
The details of a BF module design are given in Fig. 7.
First, the antenna array top-down view is shown in Fig. 7(a).
Second, the layer on which the chipsets are mounted is shown
in Fig. 7(b). A type of material with low dielectric constant
and small loss tangent is desired. As a matter of fact, there
are several suitable integration technology candidates such
as low temperature co-fired ceramics (LTCC), hybrid LTCC
[29], multi-layer organics (MLO) [30], liquid crystal polymer
(LCP) [31], etc. Considering the cost, mass production and
industrial maturity [32], an MLO-like structure is adopted as
it has shown profound value on commercial mass production
in IEEE 802.11ad products [6].
In the cross section view of the BF module in Fig. 7(c),
Rogers RO4003C material is used for both antenna and PCB
substrate because it has a low loss tangent and a suitable
dielectric constant at the high GHz frequency. Accordingly,
the effective wavelength λe for the 28 GHz carrier can be
calculated using (3)-(5). Moreover, the spacing among antenna
elements is set to λ0 /2, thus W and L of the BF module
are calculated as 25 and 18 mm, respectively, with some
dimension margin.
Each BF module is connected with the MLB by coaxial
cables and coaxial connectors on PCBs, and BF modules

7

Fig. 6. Four popular positions of holding mobile phone handsets.

λ0/2

W

Switch &
Phase Shifter

SMD

LNAs

PAs

λe/2

Front End
LO
PMU &
LDO

TSSI
RSSI

Radio
Control

Dig. Mem.
Logic

Coax
Connector

L
(a)

(b)

Antenna Feed Line

Antenna

Substrate

Stud Bump
RFIC

PCB

Die

Die

Solder ball Through Package Via

SMD Component

Coax
Connector

(c)
Fig. 7. (a) Top-down view of the BF module. (b) Chipsets layer of the BF module. (c) Layout and cross-section view of the BF module stack-up.

are arranged in the back housing of the mobile devices.
There are several critical factors in BF module arrangements.
First, the spacing among BF modules, dISOL , should be kept
sufficiently large (≥ 1.5λ0 , or 16 mm). Second, as long
as a good spacing is guaranteed, more BF modules can be
embedded on the back housing of the mobile device thus
higher order MIMO can be obtained. However, this involves
trade-offs between wireless performance and limited hardware
area or resource on mobile devices. These constraints are
much alleviated on tablet computers. The mmWave front-end,
control and calibration circuits can be designed and fabricated
using various conventional IC processes according to different
design specifications and features. Connection between the
PAs, LNAs and antenna elements is built by the stud bumps
and the antenna feed lines routed inside the package. The
through package vias (TPVs) route the signals between the
dies and the PCB, and they also dissipate the heat which is
mainly generated from the PA dies in the BF module. The
thermal design and TPVs design are very critical because they
are directly relevant to the cooling performance. A 5G BF

module accommodates multiple PAs in a very small space,
and a poor thermal design may lead to its temperature rising
to a threshold value and cause a total failure of the BF module.
Moreover, an overheated BF module can result in a failure of
the entire UE system, and in some extreme cases, it can even
compromise the users’ safety.
Normally, more than one IC process is used to implement
the mmWave RF transceiver chipsets, and therefore, more than
one die is used and shown in Fig. 7(c). With the current
mainstream IC processes, based on the emerging commercial
products and the existing IC design experience, the total area
of chipsets can be well managed below 10 × 10 mm according
to mmWave IC designs in [6], [30] and [33]. Moreover, the
thickness of the BF module can be briefly calculated using the
equation as below
HBF = HANT + Hbump + Hdie + HPCB + Hconnector

(8)

where HANT is the thickness of the mmWave patch antenna
with an estimated thickness of 0.4 mm, Hbump stands for
the stand bump thickness with a typical value of 50µm, the
die thickness Hdie is usually 254µm, the thickness of PCB,

8

× NBF

× NBF

2G/3G/4G TRx
WLAN/BT/GNSS
ADC/DAC

PMU LDO
Temp Sensor

TSSI

Quadplexer

RSSI

5G Beamforming Module

Quadplexer

PMU

Control Radio

Digital RF Interface

Baseband Processing

Power / DC/Ref.

AGC

2nd Stage
Conversion

Phase
Shifter <1>

LDO

× NBF

Radio Control

IF-Radio
Amplifier

TX-IF

PA <1>

SPDT<1>

Antenna Array

ET

LNA <1>

1st Stage
Conversion

DAC

Coaxial cable

fLO1=
23.2~23.8 GHz

DC, Reference, Control, IF

Quadrature
LOs

RX-IF

AGC

IF-Radio
Amplifier

ADC

Temp
Control

Control

TSSI

RSSI

LO

Phase
Shifter <8>

PA <8>

SPDT<8>

ET

LNA <8>

5G IF-Radio

Fig. 8. Block diagram of 5G user equipment wireless system architecture.

DC
Control

IF-Radio

Ref.

3rd harmonic
5th harmonic

2nd harmonic

0.6

1.2

1.8

3.0

4.4

Freq. (GHz)

Fig. 9. 5G user equipment wireless system frequency plan.

HPCB , is less than 0.4 mm, and the flat coaxial connector
(widely used in commercial products) has a thickness of only
0.4 mm. Therefore, the total thickness including the surface
mounted coaxial connector can be made below 1.5 mm, and
consequently, a good form factor of 5G UE can be well
maintained.
Moreover, the patch antenna design can be flexible and
tailored to specific requirement. For example, it can be a
rectangular/circular microstrip patch, slot loop, Yagi-Uda, planar inverted-F, substrate integrated waveguide (SIW), etc. As
long as they fit into the BF module to construct a phased
array, they can be used in our DPA-MIMO architecture. The
frequency band can be 28, 37, or 39 GHz for licensed 5G
cellular networks.
D. RF Circuit Design of 5G Cellular UE
Another important feature in the proposed RF circuit design
is a split-IF architecture whose block diagram is depicted in
Fig. 8. The BF module not only integrates the active antenna
array to realize beamforming, but also enables frequency
conversion for both uplink and downlink. As shown in Fig. 8
the BF module down-converts a high GHz 5G band signal to
a low GHz intermediate frequency (IF) signal in the downlink
path, and up-converts an IF signal to a 5G band signal in the
uplink path. The local oscillator (LO) signal fLO1 can be tuned
and realize the frequency conversion for a 28 GHz frequency
band 5G TDD signal. Furthermore, this RF architecture can
apply to 37 GHz, 39 GHz, and other 5G frequency bands
after changing the LO frequency and corresponding hardware
characteristics.

The motivation and benefits of utilizing this RF architecture
lie in several aspects:
•

First, the challenging requirement for the slim form
factor of a contemporary handset design strictly limits
the hardware dimension, and therefore it is not feasible
to embed all BF modules on a larger MLB.

•

Second, the high-performance mmWave circuits design
necessitates mmWave-enabled PCB such as Rogers
RO4003C which is more costly but electrically less lossy
than the FR-4 laminate widely used for the MLB design
in contemporary smartphones. Therefore, separating
BF modules and MLB design leads to cost effective
manufacturing for mass production.

•

Third, converting the mmWave frequency to the IF
frequency directly and immediately on a BF module
minimizes the front-end insertion loss. Moreover, better
signal integrity can be achieved since the connection is
through coaxial cables instead of routing traces on the
MLB.

•

Fourth, it offers the flexibility to handle various
applications and scenarios without the need to
reconfigure the entire wireless system design. For
example, the placement and number of BF modules
in the handset can be adjusted according to different
system specifications and use cases, which makes it
cost-effective.

9

5G Beamforming Module (FDD)

Quadplexer

PMU

Power / DC/Ref.

Phase
Shifter <1>

LDO

Radio Control

Diplexer <1>

PA <1>

Antenna Array

ET

LNA <1>

1st Stage

TX-IF Conversion

fLO1=
23.2~23.8 GHz
RX-IF
Temp
Control

Control

TSSI

RSSI

LO

Phase
Shifter <8>

PA <8>

Diplexer <8>

ET

LNA <8>

Fig. 10. Block diagram of 5G beamforming module supporting FDD duplex
scheme.

Last, low GHz IF radio is less challenging to implement
than its mmWave counterpart and therefore can be codesigned and manufactured in the same IC processes and
SoCs for legacy cellular standards such as 3G and 4G.
In addition, it can facilitate the test in mass production
for both BF modules and IF radio plus baseband modules
[6].
Furthermore, a frequency plan is proposed as follows. Take
the 28 GHz frequency band as an example. As shown in
Fig. 9, the IF frequency is set to 4.4 GHz, the radio control
signal is at 600 MHz, the reference clock signal is set to
below 100 MHz, and power supply is a DC signal. These
signals are all supplied over the coaxial cable, and separated
or combined using quadplexers on both the BF modules and
IF radio ends. The IF frequency is chosen at 4.4 GHz due to
several reasons. First, it does not fall in any LTE band of 3GPP
Rel. 14, neither any WiFi/GNSS frequency so that the desense
issue of LTE/WiFi can be mitigated; second, when conducting
frequency up-conversion, its image frequency can be easily
filtered out since the image frequency is separated from the
desired frequency by 8.8 GHz; third, the IF frequency is in
the low GHz range and therefore using cost-effective coaxial
cables can satisfy the performance requirement.
In addition, the control signal is chosen to be operated at
600 MHz. As shown in Fig. 9, the harmonics of the control
signal do not interfere with the IF radio signal, and hence the
desense issue can be mitigated. A control interface provides
supervision and operation of BF modules through read-write
to the registers using radio control signals such as RF frontend (RFFE) control interface signals. The RFFE signals carry
the information of transmitter signal strength indicator (TSSI),
receiver signal strength indicator (RSSI), and it executes the
calibration and temperature control of a BF module.
Assume the 28 GHz band contains four sub-bands with
each one occupying a bandwidth of 200 MHz and some
guard bands. The BF module can support a wide bandwidth
up to 800 MHz which is equivalent to four intra sub-bands
aggregated. The local oscillator in the BF module should cover
a frequency range at least from 23.2 to 23.9 GHz. Therefore, a
4.4 GHz IF radio signal can be obtained after doing frequency
down-conversion, and a 28 GHz 5G mmWave signal can be
generated after conducting frequency up-conversion. Totally,
NBF BF modules and NBF IF radios are integrated to support
•

a maximum of NBF streams communicating simultaneously.
As to the detailed BF module implementations, PMUs
and low drop-out regulators (LDOs) in each 5G BF module
transform the DC voltage of the coax cable to different power
supplies for different dies. At the RF front-end, each antenna
element is connected to one single port double throw (SPDT)
which is controlled by a radio control signal to enable time
domain duplexing. PAs and low noise amplifiers (LNAs) are
respectively placed in the uplink and downlink paths followed
by digitally controlled phase shifters (DCPS) which determine
the step resolution of beam steering. For the IF radio module
design, the direct conversion RF architecture is employed.
Moreover, the differential to single-ended (D-to-S) amplifier and the single-ended to differential (S-to-D) converter
are situated in the uplink and downlink paths respectively.
The variable gain amplifier (VGA) realizes the function of
automatic gain control (AGC) so that the dynamic range
(DR) requirement of the analog-to-digital converter (ADC)
can be mitigated. On the other hand, for a FDD based 5G
beamforming module, the SPDT and filters in the TDD mode
are replaced with the diplexers as depicted in Fig. 10.
E. Advancement of Data Converter Techniques
With respect to the ADCs and digital-to-analog converters
(DACs), they should support a wide RF bandwidth with
high resolution which depends on the actual application, for
example the order of digital modulation and the performance
of VGA. In this proposed 5G cellular UE, 256-QAM is
supported, which needs a resolution of 12 bits or above.
Furthermore, a high spur free dynamic range of ADC needs to
be maintained considering that the input signal at the receiver
end can range from around -25 dBm to -110 dBm [34]. The
high dynamic range requirement of the wideband VGA can
be alleviated by using high-performance data converters.
There has been a concern of the high power consumption
and poor cost effectiveness of ADC for 5G applications
[35]. In fact, several state-of-the-art designs have recently
demonstrated satisfying performance such as low power consumption and small chip area. In [36], a 12-bit, 1.6 GS/s
time interleaved ADC only consumes 37.7 mW with 0.9 mm2
chip area, and it achieves 17.8 fJ/conversion. In other words,
such ADC can enable a theoretical absolute physical data
throughput of 10.8 Gb/s for an ideal 256-QAM demodulation.
Moreover, [37]- [39] have presented high-performance, energy
and area efficient ADC and DAC which can be considered as
good prototype candidates for future 5G UE data converters.
Schreier figure of merit (FOMS ) and Walden figure of merit
(FOMW ) [40] are commonly used to evaluate the data converters performance, as expressed below
FOMS = SNDR + 10log10 (B/P )
FOMW = P/(2

ENOB

× min(2B, fs )),

(9)
(10)

where SNDR is the signal-to-noise-and-distortion ratio, ENOB
stands for the effective number of bits, B is the analog
bandwidth, P is the power consumption, and fS is the
sampling rate. According to the data collected [41] which
has summarized the performance of state-of-the-art ADCs

10

published in the International Solid-State Circuits Conference
(ISSCC) and the Symposia on VLSI Technology and Circuits
(VLSI Symposia) in recent 20 years, there are a couple of
designs suitable for 200 MHz wide or even 800 MHz wide
analog frequency, with a FOMW smaller than 50 fJ/conversion.
Moreover, the FOM of data converters keeps improving at a
steady pace which will further facilitate the 5G UE hardware
design.

[46], NF is 7.1 dB and 8 dB, respectively. For the design using
more advanced IC process such as SiGe, BiCMOS, NF of a
receiver can achieve 6.8 dB [30] and 5.5 dB [47]. Considering
the superior cost-effectiveness of the CMOS process and its
widespread use, it is reasonable to assume that 5G receiver
NF is around 7 dB. Furthermore, the calculated antenna gain
of one single patch antenna element can achieve 5 to 7 dBi in
state-of-the-art designs [28], [29]. Therefore in the following
tables, single antenna element gain is set to 5 dBi.

80 mm
BF Module 2

BF Module 1

A. Downlink Budget and Data Throughput Analysis

d’ISOL16

5G
IF Radio

5G
IF Radio

dISOL,16
WLAN/BT/
GNSS

Application
Processor

160 mm

BF Module 3

BF Module 4

Coax cable

SRAM
Memory
Baseband
Processor 1

BB
Proc. 2

BF Module 6

Coax cable

BF Module 5

5G
IF Radio

2G/3G/4G
TRX

5G
IF Radio

2G/3G
/4G
PAs

Coax cable

BF Module 7

BF Module 8

Fig. 11. DPA-MIMO system in a mobile phone handset when NANT =16.

IV. LINK BUDGET CALCULATION AND WIRELESS
PERFORMANCE EVALUATION
In this section, link budget analysis and throughput estimation are conducted for the downlink and uplink of the proposed
DPA-MIMO UE design. The 5G channel model in [17] is
used, and the numbers used for insertion loss, noise figure
(NF) and antenna gain are explained first. The performance
of a mmWave antenna switch in [42] shows that IL can be
well managed below 1.9 dB with a TX-RX isolation better
than 38 dB. On the other hand, according to the state-of-theart band pass filter (BPF) design [43], the IL is below 1.5 dB.
Therefore, in Table III and Table IV, the RX front-end loss
before the LNA is set to 4.0 dB including extra loss due to
the interface between the LNA and the antenna elements. The
noise figure of the mmWave receiver varies with different IC
processes, and for the state-of-the-art CMOS designs in [6] and

The downlink budget calculation under several popular
deployment scenarios is given in Table III, also with the results
from numerical analysis for the data throughput. The UMi
Street Canyon NLOS and UMa NLOS scenarios in the new
5G channel model [17] have been chosen for their larger path
loss and shadowing coefficients as the worst-case calculation.
Typically, the maximum radius of a microcell is 200 meters,
and a macrocell BS can cover up to more than 1 km. Therefore,
the UMa NLOS model is used to represent communication
distance more than 200 meters.
As can be analyzed from the results in Table III, in some
cases, SE becomes smaller as the SNR decreases because
when the SNR goes down below some threshold value, a
lower digital modulation order is enabled. Furthermore, two
sets of data are given in Table III based on 8 and 16 antenna
elements per BF module respectively. The 16 antenna elements
based UE architecture is drawn in Fig. 11 which shows that
a sufficiently large physical separation (> 2λ0 in Fig. 11)
is well maintained. By using more antenna elements, it can
increase the receiver gain, boost the SNR and EIRP so that the
mobile handset can operate in a more challenging environment
and handle larger path loss and penetration loss of buildings,
particularly for mmWave frequency bands.
In Fig. 12, the PDLT under several deployment scenarios
is given for 28 GHz and 39 GHz respectively. The number
of antenna elements in one UE, denoted as Nue (equals
NANT × NBF ), is set to 8 × 8 (=64). The bandwidth is set
to 200 MHz, and the UE is configured in MIMO with a
maximum of NBF (equals 8 in Fig. 12) layers. The penetration
loss models of regular glass and infrared reflective (IRR)
glass presented in [18] are also added into the propagation
loss models for analysis. Note that, the results under UMi
scenarios are not drawn because they are all above 10 Gbps
or around it. As can be observed, IRR glass that is widely used
in energy-saving buildings can significantly lower the PDLT
and shorten communication distance. Moreover, if the human
body blockage model is taken into consideration, the SNR will
decrease by 30 to 40 dB and thus PDLT will be significantly
lowered. As explained and illustrated in the previous sections,
the DPA-MIMO architecture can mitigate the human body
blockage issue by enabling the BF modules not blocked in
working modes.
B. Uplink Budget and Data Throughput Analysis
For the uplink, the link budget calculation is given in
Table IV. The maximum EIRP is regulated to be 43 dBm

11

TABLE III
C ALCULATION AND COMPARISON OF DOWNLINK BUDGET AT 28 GH Z .
5G cellular
service link
budget
Bandwidth
(MHz)
Max EIRP
(dBm)
Path loss (dB)
Received
power (dBm)
Thermal
noise (dBm)
SNR before
BF (dB)
Rx front
end loss1(dB)
Single antenna
element gain (dB)
NANT , number of antenna
elements in each BF
Total antenna
array gain (dB)
Noise figure
(dB)
SNR after
BF (dB)
Spectral efficiency
SISO2(bits/s/Hz)
BW=200 MHz
SISO3
throughput (Mbps)
BW=200 MHz
8 × 8 MIMO
throughput (Mbps)
BW=800 MHz
SISO
throughput (Mbps)
BW=800 MHz
8 × 8 MIMO
throughput (Mbps)
1
2
3

UMi-street
open-NLOS
d=100 m

UMi-street
open-NLOS
d=200 m

UMi-street
canyon-NLOS
d=100 m

200

200

200

Popular deployment scenarios
UMi-street
UMa-NLOS
canyon-NLOS
d=200 m
d=200 m
200

UMa-NLOS
d=500 m

UMa-NLOS
d=1000 m

UMa-NLOS
d=2000 m

200

200

200

200

78

78

78

78

78

78

78

78

126.3

135.0

133.4

143.0

137.2

149.2

158.2

167.2

-48.3

-57.0

-55.4

-65.0

-59.2

-71.2

-80.2

-89.2

-91.0

-91.0

-91.0

-91.0

-91.0

-91.0

-91.0

-91.0

42.7

34.0

35.6

20.0

31.8

19.8

10.8

1.8

4.0

4.0

4.0

4.0

4.0

4.0

4.0

4.0

5.0

5.0

5.0

5.0

5.0

5.0

5.0

5.0

8

16

8

16

8

16

8

16

8

16

8

16

8

16

8

16

14

17

14

17

14

17

14

17

14

17

14

17

14

17

14

17

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

45.7

48.7

37.0

40.0

38.6

41.6

29.0

32.0

34.8

37.8

22.8

25.8

13.8

16.8

4.8

7.8

8

8

8

7.98

8

8

7.11

7.76

4.35

5.18

1.69

1.94

1280

1280

1280

1280

1280

1280

1138

1242

696

828

270

310

10240

10240

10240

10240

10240

10240

9104

9936

5568

6624

2160

2480

5120

5120

5120

5120

5120

5120

4552

4968

2784

3312

1080

1240

40960

40960

40960

40960

40960

40960

36416

39744

22272

26496

8640

9920

Before the LNA stage of the BF, the front-end loss includes insertion loss of signal traces, switches and filters
Based on 256-QAM modulation
Based on 20% system overhead which is a typical case in LTE [44], [45]

Fig. 12. 8 × 8 MIMO, BW=200 MHz, Nue =8 × 8, peak downlink throughput versus various deployment scenarios.

for mobile stations (MSs) by the FCC [7]. Such level of
transmission power is translated to a substantial challenge for
long distance transmission at 5G mmWave frequency bands.

Therefore there is necessity for the BS to enable the use of
large antenna arrays at the receiver end to compensate for the
propagation loss. Since the UE can operate with NBF × NBF

12

TABLE IV
C ALCULATION AND COMPARISON OF UPLINK BUDGET AT 28 GH Z .
5G cellular
service link
budget
Bandwidth
(MHz)
Max EIRP
(dBm)
Path loss (dB)
Received
power (dBm)
Thermal
noise (dBm)
SNR before
BF (dB)
Rx front
end loss (dB)
Single antenna
element gain (dB)
Narray
Total antenna
array gain (dB)
Noise figure
(dB)
SNR after
BF (dB)
Spectral efficiency
SISO (bits/s/Hz)
BW=200 MHz
SISO
throughput (Mbps)
Total antenna
elements of BS
BW=200 MHz
8 × 8 MIMO
throughput (Mbps)
BW=800 MHz
SISO
throughput (Mbps)
BW=800 MHz
8 × 8 MIMO
throughput (Mbps)

UMi-street
open-NLOS
d=100 m

UMi-street
open-NLOS
d=200 m

UMi-street
canyon-NLOS
d=100 m

200

200

200

Popular deployment scenarios
UMi-street
UMa-NLOS
canyon-NLOS
d=200 m
d=200 m
200

UMa-NLOS
d=500 m

UMa-NLOS
d=1000 m

UMa-NLOS
d=2000 m

200

200

200

200

43

43

43

43

43

43

43

43

126.3

135.0

133.4

143.0

137.2

149.2

158.2

167.2

-83.3

-92.0

-90.4

-100.0

-94.2

-106.2

-115.2

-124.2

-91.0

-91.0

-91.0

-91.0

-91.0

-91.0

-91.0

-91.0

7.7

-1.0

0.6

-9.0

-3.2

-15.2

-24.2

-33.2

4.0

4.0

4.0

4.0

4.0

4.0

4.0

4.0

5.0

5.0

5.0

5.0

5.0

5.0

5.0

5.0

64

256

64

256

64

256

64

256

64

256

64

256

64

256

64

256

23

29

23

29

23

29

23

29

23

29

23

29

23

29

23

29

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

7.0

19.8

25.8

11.1

17.1

12.6

18.6

3.0

9.0

8.8

14.8

-3.2

2.8

-12.2

-6.2

-21.2

-15.2

6.19

7.75

3.56

5.25

4.01

5.6

1.55

2.95

2.90

4.64

0.57

1.52

0.08

0.31

0.01

0.04

989

1240

570

839

642

896

248

472

464

742

92

244

13.7

50

1.7

7

512

2048

512

2048

512

2048

512

2048

512

2048

512

2048

512

2048

512

2048

7912

9920

4560

6952

5136

7168

1984

3776

3712

5936

736

1952

109.6

400

13.6

56

3956

4960

2280

3476

2568

3584

992

1888

1856

2968

368

976

54.86

200

6.8

28

31648

39680

18240

27808

20544

28672

7936

15104

14848

23744

2944

7808

438.4

1600

54.4

224

Base station unit

Base Station

100 mm

Narray (=256)
Antenna
Elements

User Equipment

One beam for
one stream

Fig. 13. Communication between user equipment and base station in 8 × 8
MIMO mode.

MIMO to receive NBF streams simultaneously, the BS needs
to enable NBF arrays of antenna elements as well, where each
array of antenna elements is referred to as a base station

unit. The number of antenna elements in each base station
unit, Narray , is determined by the link budget calculation and
constrained by the hardware resource and implementation
feasibility on the BS end. Thus, the total number of antenna
elements on the base station, Nbs is equal to NBF × Narray .
Assuming NBF is 8, two sets of data are given in Table IV,
based on 64 and 256 antenna elements in one antenna array
of the BS respectively.
Fig. 13 illustrates the communication between the DPAMIMO architecture based UE and the BS in 8 × 8 MIMO
to deliver 8 streams simultaneously. When Narray is 256 and
the carrier frequency is 28 GHz, the dimension of the 256antenna elements array is approximately 100 × 100 mm. In
the given example, there are totally 8 such BS units. It is
feasible to embed 8 or even more groups of such mmWave
antenna arrays for practical hardware design of microcells and
macrocells. As a matter of fact, the antenna array dimension
can be further expanded to 200 × 200 mm so as to embed a
1024-antenna elements array, thereby increasing the SNR by
an additional 6 dB.
Furthermore, Fig. 14 plots the peak uplink throughput
(PULT) versus distance for various deployment scenarios and
different numbers of antenna units on the BS end. It shows
that, a large number of receiver antenna elements in the
antenna array need to be enabled at the BS to compensate for

13

Fig. 14. 28 GHz, 8 × 8 MIMO, BW=200 MHz, peak uplink throughput versus various deployment scenarios.

Fig. 15. Regular glass, UMa NLOS, 8 × 8 MIMO, BW=200 MHz, peak data throughput versus distance for various number of antenna elements on BS and
UE ends.

the large propagation loss. Again, the IRR glass induced attenuation largely degrades the uplink performance, and therefore
more antenna elements should be used at the base station to
enable stronger beamforming gain. Also, at the mobile station,
a maximum output of 43 dBm EIRP will limit the maximum
output power of one single PA in the phased array, and the
relation can be expressed in the equation below:
EIRPUE,max = PPA,out + 20log10 (NANT )

(11)

where PPA,out is the output power of one single PA, and NANT
stands for the number of antenna elements in the BF module.
This equation is valid only when each antenna element is
connected to one PA. Therefore, when NANT equals 16, the
maximum PPA,out is limited to 19 dBm, and the maximum
PPA,out will increase to 25 dBm if NANT is set to 8. The
specification of 19 dBm output power is less challenging and
more implementable according to the current state-of-the-art
mmWave PA designs [48], [49].

C. Analysis with Attenuation Models
As previously mentioned, the IRR glass can cause very
serious degradation to the uplink performance. More numerical
results of data throughput under various deployment scenarios
are plotted for both downlink and uplink modes with two types
of penetration loss in Fig. 15 and Fig. 16, respectively. It is
observed that the strong attenuation caused by IRR glass can
be overcome at the cost of embedding more antennas at both
the UE and BS ends. Moreover, the deployment of ultra-dense
small cells is considered a necessary mechanism in mmWave
communications to deal with strong path loss and attenuation
[50].
On the other hand, the inter-bands carrier aggregation (InterCA) may be needed for 5G mmWave frequency bands. For
example, 28 GHz, 37/39 GHz band, 64-71 GHz band, etc.,
are aggregated to provide even larger bandwidths. In that
situation, the DPA-MIMO architecture can still be adopted
for a practical multi-band, multi-mode 5G UE design. As a

14

Fig. 16. IRR glass, UMa NLOS, 8 × 8 MIMO, BW=200 MHz, peak data throughput versus distance for various number of antenna elements on BS and UE
ends.

D. Performance Comparison with State-of-the-art
Table V summarizes and compares the performance of
5G state-of-the-art works from both industry and academics
in recent years. We can observe that most of the previous

180 mm

5G
IF Radio

5G
IF Radio

WLAN/BT/
GNSS

Application
Processor

240 mm
SRAM
Memory

Coax cable
BF Module 6

matter of fact, some multi-band 5G hardware components
have been presented in the literature and can be used in
the DPA-MIMO architecture. Two dual-band 5G mmWave
antenna prototypes are demonstrated in [51], [52], and a linear
Doherty PA supporting 28 GH, 37 GHz and 39 GHz bands
is designed and verified using SiGe process with high PAE
demonstrated in [53].
In order to further improve the efficiency and overcome
the high peak-to-average power ratio (PAPR) issue, the power
supply modulation techniques such as envelope tracking (ET)
will continue to play a critical role in 5G UE design. One
of the major challenges lies in the stringent signal bandwidth
requirement of the ET modulator, because the supply generally
tracks the signal envelope continuously, which can be many
times the bandwidth of the I/Q signal components [54]. With
respect to the new 5G mmWave band occupying hundreds
of MHz bandwidth, this challenge can be more pronounced.
Nevertheless, some recently published work [55] has shown
a 70% efficient envelope modulator for an X-band PA with
100-MHz signal bandwidth, which can be considered as a
candidate ET technique for 5G applications.
Finally, in the system-level design, the choice of NANT
and NBF can be very flexible according to the practical
specification, performance target, and design constraints so
that the user equipment can handle different environments and
situations. For example, in Fig. 5 and Fig. 11, NANT is 8 and 16
respectively while NBF is fixed as 8, and the resulted wireless
performance is summarized in Table III. On the other hand, for
a specific UE design case where longer battery life and more
space are available, such as in a tablet computer as shown
in Fig. 17, both NANT and NBF can be increased (to 16 in
Fig. 17) to enable better wireless performance.

Baseband
Processor 1

5G
IF Radio
5G
IF Radio

BB
Proc. 2

2G/3G/4G
TRX
2G/3G
/4G
PAs

Fig. 17. An example of DPA-MIMO system used in tablet computer when
NANT =16 and NBF =16.

works have used conventional beamforming, MIMO, MassiveMIMO, and MU-MIMO as the air interface technology. According to the numerical analysis, the novel DPA-MIMO
architecture not only provides the highest downlink throughput
at long distances, but also is able to address the human body
blockage issue which is not mentioned or dealt with in the
previous 5G state-of-the-art research works.

15

TABLE V
5G STATE - OF - THE - ART WORKS PERFORMANCE SUMMARY AND COMPARISON

Item

Announce/
Release
Date

5G
Equipment
Type

Samsung
[56], [57]

Oct. 2014

BS,
UE

NTT-DOCOMO
[58]

Sep. 2016

BS,
UE

Qualcomm
[59] - [61]

Oct. 2016

UE

Intel
[62], [63]

Jan. 2017

UE

IBM
[64]

Feb. 2017

BS

UCSD
[65]

Feb. 2017

N.A.

Nov. 2016

Huawei,
NTT-DOCOMO
[66]
Ericsson,
T-Mobile
[67]
Nokia,
SK Telecom
[68], [69]
NI,
Verizon
[70]
This work

Hardware
Implementation
Solution and
Method
Modem board,
analog FE board
BS:49-element
array,
UE:4-element
array

Data
Resource

Air Interface
Technology

Carrier
Frequency
(GHz)

Bandwidth
(MHz) and
Modulation

DL Throughput
and Distance

Outdoor
test

BF,
2×2 MIMO

28

800,
64 QAM

3.77 Gbps@20m
7.5 Gbps@20m(2MSs)

Outdoor
test

BF,
2×2 MIMO

27.92

800,
64 QAM

3.77 Gbps@120m

Modem SoC,
mmWave RFIC

IC test

BF,
MIMO

28

Modem SoC,
mmWave RFIC

IC test

BF,
MIMO

28,
sub-6

Chipsets,
antennas in package,
single module
32-element
BF module,
single module
on PCB

IC test,
antenna
chamber test

BF

28

IC test

BF

28

Bandwidth
(N.A.),
64 QAM

12 Gbps,
distance (N.A.)

BS
(macrocell),
UE

N.A.

Field test

MassiveMIMO

4.5

200,
modulation
(N.A.)

11.29 Gbps,
distance (N.A.)

Sep. 2016

BS,
UE

N.A.

Lab test,
field trials

BF,
MU-MIMO

28

N.A.

12 Gbps,
distance (N.A.)

Oct. 2015

BS,
UE

N.A.

PoC test

8×8 MIMO

15

4×100,
256 QAM

19.1 Gbps,
distance (N.A.)

Mar. 2017

BS,
UE

NI USRP

Demo,
prototype test

2×2 MU-MIMO

28

8×100,
modulation
(N.A.)

5 Gbps,
20 Gbps (scalable),
distance (N.A.)

Apr. 2017

UE

Multiple BF
modules arranged
on UE

Numerical

BF,
8×8 DPA-MIMO

28

800,
256 QAM

40.96 Gbps@100m
26.49 Gbps@1000m

V. CONCLUSION
In this paper, a system architecture and method for next
generation wireless user equipment, or 5G cellular user equipment design has been provided. By analyzing the challenges
of contemporary wireless UE designs and emerging 5G
mmWave techniques, a novel DPA-MIMO architecture and
design method has been presented to overcome the limitations
of conventional MIMO structures. This work has provided
a solution to the technical constraints and challenges of the
mobile handset design, such as human blockage, high path
loss, self-heating issues, which are more pronounced for future
5G cellular user equipment but cannot be solved using the
existing system architectures and methods. Moreover, through
numerical analysis, the proposed architecture has been shown
to increase the wireless link budget and enhance the data
throughput under different use cases and various BS deployment scenarios with highly flexible reconfigurability. Furthermore, the DPA-MIMO based wireless UE can be implemented
using the state-of-the-art technologies of circuits, antennas and
systems. As a result, this architecture can facilitate a peak
throughput of more than 10 Gb/s while maintaining a slim
form factor of mobile terminal devices.
VI. ACKNOWLEDGEMENT
The authors would like to acknowledge Natural Sciences
and Engineering Research Council of Canada, and National
Natural Science Foundation of China for support of this

800,
modulation
(N.A.)
800,
modulation
(N.A.)
Bandwidth
(N.A.),
256 QAM

5 Gbps,
distance (N.A.)
5 Gbps,
distance (N.A.)
3.5 Gbps@1.84 m

project, Dr. Song Hu from Georgia Institute of Technology and
Dr. Adrian Tang from NASA JPL for valuable discussions.
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Yiming Huo (S’08) received B.Eng degree in information engineering from Southeast University,
China, in 2006, and MSc. degree in System-on-Chip
(SoC) from Lund University, Sweden, in 2010. He is
PLACE
currently pursuing the Ph.D. in electrical engineering
PHOTO
at University of Victoria, Canada. From 2009 to
HERE
2010, he stayed in Ericsson and ST-Ericsson where
he accomplished his master thesis on multi-mode,
wideband CMOS VCOs for cellular systems. Since
his Ph.D. study, Mr. Huo has been working on the
a wide range of cross-disciplinary topics of next
generation wireless communication systems design, and his current research
interests are in the physical layer design of 5G cellular user equipment, and
millimeter-wave circuits and systems.
Between 2010 and 2011, Mr. Huo worked in Chinese Academy of Sciences
(CAS) as research associate. From 2011 to 2012, he worked in STMicroelectronics as RF engineer for developing digital video broadcasting (DVB)
systems. From 2015 to 2016, he spent a year conducting RF hardware and
cellular design for various projects in Apple Inc., Cupertino, California, as a
Ph.D intern.
Mr. Huo is the recipient of the Best Student Paper Award of the 2016
IEEE ICUWB, the Excellent Student Paper Award of the 2014 IEEE ICSICT,
and the Bronze Leaf certificate of the 2010 IEEE PrimeAsia. He also received
University of Victoria Fellowship from 2012 to 2013, and ISSCC-STGA from
IEEE Solid-State Circuits Society (SSCS) in 2017.
Mr. Huo is a member of IEEE, SSCS, CAS, MTT-S, and ComSoc.
He has been serving as the program committee of IEEE ICUWB 2017,
technical reviewer for several IEEE conferences and journals including
IEEE T RANSACTIONS ON V EHICULAR T ECHNOLOGY (TVT), and C HINA
C OMMUNICATIONS.

Xiaodai Dong (S’97-M’00-SM’09) received the
B.Sc. degree in information and control engineering
from Xi’an Jiaotong University, Xi’an, China, the
M.Sc. degree in electrical engineering from National
PLACE
University of Singapore, Singapore, and the Ph.D.
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degree in electrical and computer engineering from
HERE
Queen’s University, Kingston, ON, Canada, in 1992,
1995, and 2000, respectively. Since January 2005,
she has been with the University of Victoria, Victoria, BC, Canada, where she is currently a Professor
and a Canada Research Chair (Tier II) with the
Department of Electrical and Computer Engineering. From 2002 to 2004, she
was an Assistant Professor with the Department of Electrical and Computer
Engineering, University of Alberta, Edmonton, AB, Canada. From 1999 to
2002, she was with Nortel Networks, Ottawa, ON, Canada, and worked on
the base transceiver design of the third-generation (3G) mobile communication
systems. Her research interests include mobile communications, radio propagation, ultra-wideband radio, machine to machine communications, wireless
security, ehealth, smart grid, nano-communications and signal processing for
communication applications. She is an Editor for the IEEE T RANSACTIONS
ON V EHICULAR T ECHNOLOGY .

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Wei Xu (S’07-M’09-SM’15) received his B.Sc. degree in Electrical Engineering in 2003 and his M.S.
and Ph.D. degrees in Communication and Information Engineering in 2006 and 2009, respectively, all
PLACE
from Southeast University, Nanjing, China. He is
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currently a Full Professor at the National Mobile
HERE
Communications Research Lab (NCRL), Southeast
University. Between 2009 and 2010, he was a postdoctoral research fellow with the Department of
Electrical and Computer Engineering, University of
Victoria, Canada.
Dr. Xu is an Editor of the IEEE C OMMUNICATIONS L ETTERS. He has been
involved in technical program committees for many international conferences
including IEEE Globecom, IEEE ICC, IEEE WCNC, etc. He has published
over 100 refereed journal and conference papers in addition to 6 granted
patents. He received the best paper awards of IEEE MAPE in 2013, IEEE/CIC
ICCC in 2014, and IEEE Globecom in 2014. He was elected core team
member of the Jiangsu Innovation Team in 2012. He is the co-recipient of
the First Prize Award of Jiangsu Science and Technology Award in 2014. His
research interests include cooperative communications, information theory and
signal processing for wireless communications.

