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Patent US7456929 - Exposure apparatus and device manufacturing method - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign in<nobr>Advanced Patent Search</nobr>PatentsAn exposure apparatus which prevents damages due to leaked out liquid from expanding and can maintain exposure accuracy and measuring accuracy. The exposure apparatus includes first and second stages (ST1, ST2) which can independently move within an XY-plane on an image plane side of a projection optical...http://www.google.com/patents/US7456929?utm_source=gb-gplus-sharePatent US7456929 - Exposure apparatus and device manufacturing methodAdvanced Patent SearchPublication numberUS7456929 B2Publication typeGrantApplication numberUS 11/665,273Publication dateNov 25, 2008Filing dateOct 12, 2005Priority dateOct 15, 2004Fee statusPaidAlso published asEP1806772A1, EP1806772A4, EP1806772B1, EP2426700A2, US8456609, US20080111978, US20090066923, WO2006041100A1Publication number11665273, 665273, US 7456929 B2, US 7456929B2, US-B2-7456929, US7456929 B2, US7456929B2InventorsMakoto ShibutaOriginal AssigneeNikon CorporationExport CitationBiBTeX, EndNote, RefManPatent Citations (61), Referenced by (6), Classifications (14), Legal Events (2) External Links: USPTO, USPTO Assignment, EspacenetExposure apparatus and device manufacturing methodUS 7456929 B2Abstract An exposure apparatus which prevents damages due to leaked out liquid from expanding and can maintain exposure accuracy and measuring accuracy. The exposure apparatus includes first and second stages (ST1, ST2) which can independently move within an XY-plane on an image plane side of a projection optical system (PL); a drive mechanism (SD) which moves the first stage and the second stage together with the stage being close to or in contact with each other; a liquid immersion mechanism (1) which forms a liquid immersion area on an upper plane of at least one of the stages of the first stage and the second stage; and a detecting device (60) which detects liquid leaked out from between the first stage and the second stage.
1. An exposure apparatus that exposes a substrate via a projection optical system, comprising:
a first stage and a second stage that are movable, on an image plane side of the projection optical system, independently of each other in a two-dimensional plane substantially parallel to the image plane,
a driving system that moves the first stage and the second stage together within a predetermined region including a position directly beneath the projection optical system with the first stage and the second stage being close to or in contact with each other,
a liquid immersion system that forms a liquid immersion region of a liquid on an upper surface of at least one of the stages of the first and second stages,
a controller that, by moving the first and second stages together, moves the liquid immersion region between the upper surface of the first stage and the upper surface of the second stage with the liquid being retained between the projection optical system and the upper surface of the at least one of the stages, and
a detecting device that detects the liquid having leaked from between the first and second stages when the liquid immersion region is moved from the upper surface of one of the stages of the first and second stages to the upper surface of the other stage of the first and second stages.
2. The exposure apparatus according to claim 1, wherein the detecting device detects the liquid in a non-contact manner.
3. The exposure apparatus according to claim 1, wherein the detecting device includes a light projecting portion that emits a detecting light and a light receiving portion which is disposed in a predetermined position relative to the detecting light.
the second stage has a second side surface that faces a first side surface of the first stage, and
the light projecting portion is provided on either one of the first side surface and the second side surface, and the light receiving portion is provided on the other of the first side surface and the second side surface.
5. The exposure apparatus according to claim 3, further comprising a base member that movably supports each of the first and second stages, and wherein
the detecting light proceeds in a vicinity of the base member.
6. The exposure apparatus according to claim 5, further comprising gas bearings that are provided on the first and second stages, respectively, and support in a non-contact manner the first and second stages relative to an upper surface of the base member, and wherein
the light projecting portion and the light receiving portion are provided adjacent to the gas bearings.
7. The exposure apparatus according to claim 1, wherein one of the stages of the first and second stages moves while holding the substrate, and the other stage of the first and second stages moves, with a measuring device that performs a measurement related to the exposure process being mounted on the other stage.
8. The exposure apparatus according to claim 1, wherein each of the first and second stages moves while holding a substrate.
9. The exposure apparatus according to claim 1, wherein the liquid immersion system stops supplying the liquid when leakage of the liquid is detected.
10. The exposure apparatus according to claim 9, wherein the liquid immersion system continues recovering the liquid which forms the liquid immersion region when leakage of the liquid is detected by the detecting device.
loading a substrate on one of the first and second stages of the exposure apparatus according to claim 1; and
projecting an image of a pattern onto the substrate held by the one stage.
12. The exposure apparatus according to claim 7, wherein the other stage has no substrate holder for holding a substrate.
13. A control method of an immersion lithography apparatus that exposes a pattern image onto a substrate via a projection optical system and an immersion liquid supplied between the projection optical system and an upper surface of the substrate, the immersion lithography apparatus including a first stage and a second stage that are movable, on an image plane side of the projection optical system, independently of each other in a two-dimensional plane substantially parallel to the image plane, the method comprising:
moving the first and second stages together within a predetermined region including a position directly beneath the projection optical system with the first and second stages being close to or in contact with each other,
forming a liquid immersion region of the immersion liquid on an upper surface of at least one of the stages of the first and second stages,
moving the first and second stages together so as to move the liquid immersion region between the upper surface of the first stage and the upper surface of the second stage with the immersion liquid being retained between the projection optical system and the upper surface of the at least one of the stages, and
detecting whether the immersion liquid has leaked from between the first and second stages when the liquid immersion region is moved from the upper surface of one of the stages of the first and second stages to the upper surface of the other stage of the first and second stages.
14. The method according to claim 13, wherein the detecting is performed by a detecting device that detects the liquid in a non-contact manner.
15. The method according to claim 13, wherein the detecting is performed by emitting a detecting light from a light projecting portion and by receiving the detecting light with a light receiving portion which is disposed in a predetermined position relative to the detecting light.
17. The method according to claim 15, wherein the immersion lithography apparatus includes a base member that movably supports each of the first and second stages, and wherein
18. The method according to claim 17, wherein the immersion lithography apparatus includes gas bearings that are provided on the first and second stages, respectively, and support in a non-contact manner the first and second stages relative to an upper surface of the base member, and wherein
19. The method according to claim 13, further comprising moving one of the stages of the first and second stages while holding the substrate, and moving the other stage of the first and second stages, with a measuring device that performs a measurement related to the exposure process being mounted on the other stage.
20. The method according to claim 13, further comprising moving each of the first and second stages while holding a substrate.
21. The method according to claim 13, further comprising stopping a supplying of the liquid to the immersion region when leakage of the liquid is detected.
22. The method according to claim 21, further comprising recovering the liquid which forms the liquid immersion region when leakage of the liquid is detected.
loading a substrate on one of first and second stages of the immersion lithography apparatus controlled according to claim 13; and
TECHNICAL FIELD The present invention relates to an exposure apparatus that exposes a substrate via an optical system and to a device manufacturing method.
The present application claims priority to Japanese Patent Application No. 2004-301639, filed on Oct. 15, 2004, and its content is incorporated herein by reference.
BACKGROUND ART In the photolithography process, which is one of the processes for manufacturing micro-devices such as semiconductor devices or liquid crystal display devices, an exposure apparatus that projects a pattern formed on a mask onto a photosensitive substrate is used. Such an exposure apparatus has a mask stage that supports a mask and a substrate stage that supports a substrate and, while successively moving the mask stage and the substrate stage, projects an image of the pattern of the mask onto the substrate via a projection optical system. By the way, some of such exposure apparatuses include two stages that are movable independently of each other on the image plane side of the projection optical system. Further, in manufacturing micro-devices, miniaturization of the pattern formed on a substrate is required in order to make such micro-devices high-density ones. To address this requirement, it is desired that the exposure apparatus have a still higher resolution. As a means for realizing such a still higher resolution, such a liquid immersion exposure apparatus as disclosed in the patent document 1, below, in which the space between the projection optical system and the substrate is filled with a liquid to form a liquid immersion region, and an exposure process on the substrate is performed via the liquid of the liquid immersion region. Patent Document 1: International Publication WO 99149504 pamphlet.
The present invention has been made in consideration of such situations, and its object is to provide an exposure apparatus which prevents the damage due to the liquid having leaked out from sealing and by which the exposure accuracy and the measurement accuracy can be min ed and to provide a device m in method.
Means for Solving Problem In accordance with a first aspect of the present invention, there is provided an exposure apparatus that exposes a substrate via a projection optical system, comprising: a first stage and a second stage that are movable, on the image plane side of the projection optical system, independently of each other in a two-dimensional plane substantially parallel to the image plane, a driving mechanism that moves the first stage and the second stage together within a predetermined region including the position directly beneath the projection optical system with the first stage and the second stage being close to or in contact with each other, a liquid immersion mechanism that forms a liquid immersion region of a liquid on the upper surface of at least one of the stages of the first stage and the second stage, a controller that by moving the first stage and the second stage together, moves the liquid immersion region between the upper surface of the first stage and the upper surface of the second stage with the liquid being retained between the projection optical system and the upper surface of at least one of the stages, and a detecting device that detects the liquid having leaked from between the first stage and the second stage when moving the liquid immersion region from the upper surface of one of the stages of the first stage and the second stage to the upper surface of the other stage.
In accordance with a second aspect of the present invention, there is provided a device manufacturing method that uses an exposure apparatus (EX) of the above-described mode.
Effect of the Invention In accordance with the present invention, since the damage due to the liquid having leaked out can be prevented from spreading, the exposure accuracy and the measurement accuracy can be maintained.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing an exposure apparatus in accordance with a first embodiment.
FIG. 3A is a drawing for illustrating the operations of the substrate stage and the measurement stage.
FIG. 3B is a drawing for illustrating the operations of the substrate stage and the measurement stage.
FIG. 5 is a drawing for illustrating a condition in which a detecting device is detecting a liquid.
FIG; 6 is an enlarged view of a main portion of an exposure apparatus in accordance with a second embodiment.
FIG. 7 is a schematic diagram showing an exposure apparatus in accordance with a third embodiment.
FIG. 8 is a flowchart showing an example of a micro-device manufacturing process.
BEST MODE FOR CARRYING OUT THE INVENTION In the following, although embodiments of the present invention will be described referring to the drawings, the present invention is not limited to those embodiments.
First Embodiment FIG. 1 is a schematic diagram showing an exposure apparatus in accordance with a first embodiment. In FIG. 1, exposure apparatus EX includes mask stage MST that is movable while holding mask M, with substrate stage ST1 that is movable while holding substrate P, with measurement stage ST2 that is movable while measuring devices related to the exposure process being mounted thereon, with illumination optical system IL that illuminates mask M held by mask stage MST with exposure light EL, with projection optical system PL that projects a pattern image of mask M illuminated with exposure light EL onto substrate P held by substrate stage ST1, and with controller CONT that controls the overall operation of exposure apparatus EX. Substrate stage ST1 and measure stage ST2 are each movably supported on base member BP and are movable independently of each other. On undersurface U1 of substrate stage ST1 are provided gas bearings 41 for supporting substrate stage ST1 in a non-contact manner relative to upper surface BT of base member BP. Similarly, also on undersurface U2 of measurement stage ST2 are provided gas bearings 42 for supporting measurement stage ST2 in a non-contact manner relative to upper surface BT of base member BP. Substrate stage ST1 and measurement stage ST2 are movable respectively on the image plane side of the projection optical system PL, independently of each other in a two-dimensional plane (in the XY-plane) substantially parallel to the image plane.
Exposure apparatus EX of this embodiment is a liquid immersion exposure apparatus to which a liquid immersion method is applied, with the exposure wavelength being shortened in effect, to improve the resolution and, at the same time, to widen the depth of focus. Further, exposure apparatus EX includes liquid immersion mechanism 1 for forming liquid LQ's liquid immersion region LR on the image plane side of projection optical system PL. Liquid immersion mechanism 1 includes nozzle member 70 that is provided on the image plane side vicinity of projection optical system PL and has supply ports 12 for supplying liquid LQ and recovery ports 22 for recovering liquid LQ, with liquid supply mechanism 10 that supplies liquid LQ to the image plane side of projection optical system PL via supply ports 12 provided to nozzle member 70, and with liquid recovery mechanism 20 that recovers liquid LQ on the image plane side of projection optical system PL via recovery ports 22 provided to nozzle member 70. Nozzle member 70 is formed in a ring-shaped manner so as to surround the end portion of projection optical system PL on the image plane side. At least while transferring the pattern image of mask M onto substrate P, exposure apparatus EX locally forms, by liquid LQ having been supplied from liquid supply mechanism 10, liquid LQ's liquid immersion region LR that is larger than projection area AR of projection optical system PL and is smaller than substrate P on a portion of substrate P that includes projection area AR. More specifically, exposure apparatus EX adopts a local liquid immersion system in which the optical path space between first optical element LS1 located closest to the image plane of projection optical system PL and a portion of the surface of substrate P placed on the image plane side of projection optical system PL is filled with liquid LQ and by irradiating, via liquid LQ between projection optical system PL and substrate P and via projection optical system PL, exposure light EL having passed through mask M onto substrate P, projects the pattern of mask M onto substrate P to expose substrate P.
The embodiment will be described by assuming, as an example, a case where as exposure apparatus EX, a scan type exposure apparatus (the so-called scanning stepper) in which while synchronously moving mask M and substrate P in their respective scanning directions direction different from each other (diverse directions), the pattern formed on mask M is exposed onto substrate P is used. In the following description, it is assumed that the synchronous movement direction (scanning direction), in a horizontal plane, of mask M and substrate P is referred to as the X-axis direction, that the direction, in the horizontal plane, perpendicular to the X-axis direction is referred to as the Y-axis direction (non-scanning direction), and that the direction that is perpendicular to the X-axis direction and the Y-axis direction and coincides with optical axis AX of projection optical system PL is referred to as the Z-axis direction. Further, it is assumed that the direction around the X-axis, the direction around the Y-axis, and the direction around the Z-axis are respectively referred to as the θX-direction, the θY-direction, and the θZ-direction. It should be noted that a �substrate� referred to herein comprehends a base material, e.g., a semiconductor wafer, over which a photosensitive material (resist) is applied, and a �mask� comprehends a reticle on which a device pattern to be reduction-projected onto the substrate is formed.
By opting driving mechanism SD that includes linear motors etc, substrate stage ST1 and measurement stage ST2 are movable, respectively. By controlling driving mechanism SD, controller CONT can move substrate stage ST1 and measurement stage ST2 together, in the XY-plane, within a predetermined region including the position directly beneath projection optical system PL in a state that substrate stage ST1 and measurement stage ST2 are close to or in contact with each other. By moving substrate stage ST1 and measurement stage ST2 together, controller CONT can move liquid immersion region LR between upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2 in a state that liquid LQ is retained between projection optical system PL and at least one of upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2.
In the embodiment, on the upper portion of the side face of substrate stage ST1 is provided overhang portion H1 that protrudes outwardly from the center portion of upper surface F1 of substrate stage ST1. The upper surface of overhang portion H1 is also a portion of upper surface F1 of substrate stage ST1. Similarly, on the upper portion of the side face of measurement stage ST2 is provided overhang portion H2 that protrudes outwardly from the center portion of upper surface F2 of measurement stage ST2. The upper surface of overhang portion H2 is also a portion of upper surface F2 of measurement stage ST2. When, for example, liquid immersion region LR being moved from one of the stages to the other stage, the +Y side region of upper surface F1 of substrate stage ST1 and the −Y side region of upper surface F2 of measurement stage ST2 come close to or into contact with each other.
Here, the �state that substrate stage ST1 and measurement stage ST2 are close to each other� means a state in which, when liquid LQ between upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2 being moved, substrate stage ST1 and measurement stage ST2 are close to each other to such a degree that liquid LQ does not leak out from between substrate stage ST1 and measurement stage ST2. The allowable value of the space between both stages ST1 and ST2 depends upon, e.g., the materials, surface treatments of both stages, the kind of liquid LQ or the like.
Further, exposure apparatus EX includes detecting device 60 that detects liquid LQ having leaked from between substrate stage ST1 and measurement stage ST2 when liquid immersion region LR from upper surface F1 (F2) of one of the stages of substrate stage ST1 and measurement stage ST2 to upper surface F2 (F1) of the other stage being moved. As described above, substrate stage ST1 and measurement stage ST2 are controlled such that their relative positional relationship is minimal so as to prevent liquid LQ from leaking, and they are moved together in a state that they are close to or in contact with each other. However, even if liquid LQ has leaked out, detecting device 60 is capable of detecting the liquid LQ having leaked.
Detecting device 60 includes light projecting portion 61 that emits detecting light La and with light receiving portion 62 that is disposed in a predetermined position relative to detecting light La. Light projecting portion 61 is provided on second side surface 12 of measurement stage ST2. On the other hand, light receiving portion 62 is provided on first side surface T1 of substrate stage ST1. First side surface T1 of substrate stage ST1 constitutes a region under overhang portion H1 and is a surface facing toward the +Y side. Further, second side surface T2 of measurement stage ST2 constitutes a region under overhang portion H2 and is a surface facing toward the −Y side. Thus, first side surface T1 of substrate stage ST1 and second side T2 of measurement stage ST2 face each other. Further, also on side face 42T of gas bearing 42, which supports measurement stage ST2 in a non-contact manner relative to base member BP, is provided light projecting portion 63 that emits detecting light Lb. On side face 41T of gas bearing 41, which supports substrate stage ST1 in a non-contact manner relative to base member BP, is provided light receiving portion 64 that corresponds to light projecting portion 63. Side face 41T of gas bearing 41 is a surface facing toward the +Y side; side face 42T of gas bearing 42 is a surface facing toward the −Y side; side face 41T of gas bearing 41 and side face 42T of gas bearing 42 face each other.
Substrate stage ST1 and measurement stage ST2 include overhang portion H1 and overhang portion H2, respectively. Thus, even when upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2 are made close to or in contact with each other, second side surface T2, on which light projecting portion 61 is provided, and first side surface T1, on which light receiving portion 62 is provided, are mutually separated by a predetermined distance, and, at the same time, side face 42T, on which light projecting portion 63 is provided, and side face 41T, on which light receiving portion 64 is provided, are mutually separated by a predetermined distance. In other words, when upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2 are made close to or in contact with each other, a space is formed under the portion where upper surface F1 and upper surface F2 are close to (or in contact with) each other.
Illumination optical system IL includes an exposure light source, an optical integrator for uniforming the illuminance of the light flux emitted from the exposure light source, a condenser lens for condensing exposure light EL from the optical inflator, a relay lens system, a field stop for setting an illumination area formed by exposure light EL on mask M, etc. A specified illumination area on mask M is illuminated, by illumination optical system IL, with exposure light EL having a uniform illuminance distribution. As exposure light EL emitted from illumination optical system IL, for example, a bright line (g-line, h-line, i-line) emitted from a mercury lamp, a deep ultraviolet light (DUV light) such as a KrF excimer laser light (wavelength of 248 nm), or a vacuum ultraviolet light (VUV light) such as an ArF excimer laser light (wavelength of 193 nm) or an F2 excimer laser light (wavelength of 157 nm) may be used. In the embodiment, an ArF excimer laser light is used.
In the embodiment, purified or pure water is used as liquid LQ. Purified water can transmit not only an ArF excimer laser light however also, for example, a bright line (g-line, h-line, or i-line) emitted from a mercury lamp and a deep ultraviolet light (DUV light) such as a KrF excimer laser light (wavelength of 248 mm).
Projection optical system PL is for projecting the pattern image of mask M onto substrate P at a predetermined projection magnification of β and is constituted by a plurality of optical elements, these optical elements are held by lens barrel PK. In the embodiment, projection optical system PL is a reduction system of which projection magnification β is, e.g., �, ⅕, or ⅛. It should be noted that projection optical system PL may also be either a unit magnification system or a magnifying system Among plurality of optical elements constituting projection optical system PL, first optical element LS1 located closest to the image plane of projection optical system PL protrudes from lens barrel PK.
By operating driving mechanism SD which includes linear motors etc. and is controlled by controller CONT, substrate stage ST1, in the state of holding substrate P via substrate holder PH, is two-dimensionally movable in the XY-plane substantially parallel to the image plane of projection optical system PL and is finely rotatable in the θ-Z direction, on the image plane side of projection optical system PL. Further, substrate stage ST1 is also movable in the Z-axis-direction, in the θX-direction, and in the θY-direction. Thus, the upper surface of P supported by substrate stage ST1 is movable in the six-degree-of-freedom directions, i.e., in the X-axis-direction, in the Y-axis-direction, in the Z-axis-direction, in the θX-direction, in the θY-direction, and in the θZ-direction. On the side face of substrate stage ST1 is provided moving mirror 33. Further, laser interferometer 34 is positioned at a position facing moving mirror 33. The two-dimensional position and the rotation angle of substrate P on substrate stage ST1 are measured by laser interferometer 34 in real time. In addition, exposure apparatus EX includes such an oblique-incidence type focus-leveling detection system (not shown) as disclosed in, e.g., Japanese Unexamined Patent Publication Hei 8-37149 that detects the surface position information of the surface of substrate P supported by substrate stage ST1. The focus-leveling detection system detects the surface position information of the surface of substrate P(position information in the Z-axis-direction and inclination information in the θX- and θY-directions of substrate P). It is to be noted that as the focus-leveling detection system, a system that uses an electric capacitance type sensor may be adopted. The measurement results from laser interferometer 34 are outputted to controller CONT. The detection results from the focus-leveling detection system are also outputted to controller CONT. By operating driving mechanism SD based on the detection results from the focus-leveling detection system, controller CONT controls the focus position (Z-position) and inclination angles (θX, θY) of substrate P to adjust the surface of substrate P to the image plane of projection optical system PL and, at the same time, performs, based on the measurement results from laser interferometer 34, the position control of substrate P in the X-axis-direction, in the Y-axis-direction, and in the θ-Z direction.
Measurement stage ST2 is movable on the image plane side of projection optical system PL while various kinds of measuring devices (including members for measurement) that perform measurements related to the exposure process being mounted thereon. As those measuring devices, there can be listed such a fiducial mark plate on which a plurality of fiducial marks are formed as disclosed in, e.g., Japanese Unexamined Patent Publication Hei 5-21314, such a uniformity sensor for measuring the illumination intensity uniformity as disclosed in, e.g., Japanese Unnamed Patent Publication Sho 57-117238 or for measuring the variation amount of transmissivity of projection optical system PL for exposure light EL as disclosed in, e.g., Japanese Patent Application Publication No. 2001-267239, such an aerial image measuring sensor as disclosed in, e.g., Japanese Patent Application Publication No. 2002-14005, and such a dose sensor (illumination intensity sensor) as disclosed in Japanese Unexamined Patent Publication Hei 11-16816. Uppers sure F2 of measurement stage ST2 is made a flat surface (flat portion) so that it is substantially equal in height to (co-planer with) upper surface F1 of substrate stage ST1.
By operating driving mechanism SD which includes linear motors etc. and is controlled by controller CONT, measurement stage ST2, in the state that the measuring devices are mounted thereon, is two-dimensionally movable in the XY-plane substantially parallel to the image plane of projection optical system PL and is finely rotatable in the θZ-direction, on the image plane side of projection optical system PL. Further, measurement stage ST2 is also movable in the Z-axis-direction, in the θX-direction, and in the θY-direction. In other words, as with substrate stage ST1, measurement stage ST2 is also movable in the six-degree-of-freedom directions, i.e., in the X-axis-direction, in the Y-axis-direction, in the Z-axis-direction, in the θX-direction, in the θY-direction, and in the θZ direction. On the side face of measurement stage ST2 is provided moving mirror 37. Further, laser interferometer 38 is positioned at a position facing moving mirror 37. The two-dimensional position and the rotation angle of measurement stage 52 are measured by laser interferometer 38 in real time.
It should be noted that while, in FIG.1, moving mirror 33 and moving mirror 37 are respectively provided on overhang portion H1 of the stage ST1 and overhang portion H2 of the stage ST2, those moving mirrors may be respectively provided on the side face under the overhang portions. By doing so, even when liquid LQ leaks out from upper surface F1 or upper surface F2, overhang portion H1 or overhang portion H2 can prevent liquid LQ from adhering to moving mirror 33 or moving mirror 37.
In the vicinity of the end portion of projection optical system PL is provided an off-axis type alignment system ALG that detects an alignment mark on substrate P and fiducial mark on the fiducial mark plate. In the alignment system ALG of the embodiment, there is adopted such an FIA (Field Image Alignment) type system as disclosed in, e.g., Japanese Unexamined Patent Publication Hei 4-65603, in which a broad-band detecting light beam which does not expose the photosensitive material on substrate P is irradiated onto the target mark, the target marks' image imaged, by the reflected lights from the target mark, on the light receiving surface and the image of fiducial mark (fiducial mark pattern on a fiducial mark plate provided in alignment system ALG), not shown, are imaged by using an image pick-up device (e.g., a CCD), and then by applying an image processing on the image signals obtained the marks' position is measured.
Further, in the vicinity of mask stage MST are provided a pair of mask alignment systems RAa and RAb, with those mask alignment systems being mutually separated in the Y-axis-direction by a predetermined distance, each of which constitutes a TTR type alignment system, using a light having the same wavelength as the exposure light, for simultaneously observing via projection optical system PL the alignment marks on mask M and the corresponding fiducial marks on the fiducial mark plate. In the mask alignment system of the embodiment, there is adopted such a VRA (Visual Reticle Alignment) system as disclosed in, e.g., Japanese Unexamined Patent Publication Hei 7-176468, in which a light is irradiated onto the marks, and by applying an image processing on the image data of the marks imaged by, e.g., a CCD, the marks' positions are detected.
Next liquid supply mechanism 10 and liquid recovery mechanism 20 of liquid immersion mechanism 1 will be described. Liquid supply mechanism 10 is for supplying liquid LQ to the image plane side of projection optical system PL and includes liquid supply portion 11 capable of delivering liquid LQ and with supply pipe 13 of which one end portion is connected to liquid supply portion 11. The other end portion of supply pipe 13 is connected to nozzle member 70. Inside nozzle member 70 is formed an inner flow path (supply flow path) that connects the other end portion of supply pipe 13 to supply ports 12. Liquid supply portion 11 includes a tank that stores liquid LQ, a pressurizing pump, a filter unit that removes foreign particles in liquid LQ, etc. The liquid supply operation of liquid supply device 11 is controlled by controller CONT.
Supply ports 12 that supplies liquid LQ and recovery port 22 that recovers liquid LQ are formed on undersurface 70A of nozzle member 70. Undersurface 70A of nozzle member 70 is disposed in a position facing the surface of substrate P, upper surface F1 of the stage ST1, and upper surface F2 of the stage ST2. Nozzle member 70 is a ring-shaped member that is provided so as to surround the side face of first optical element LS1. A plurality of supply ports 12 are provided so as to surround, in undersurface 70A of nozzle member 70, first optical element LS1 of projection optical system PL (optical axis AX of projection optical system PL). Further, recovery port 22 is provided, in undersurface 70A of nozzle member 70, outside supply ports 12 relative to first optical element LS1 and thus is provided so as to surround first optical element LS1 and supply ports 12.
FIG. 2 is a drawing of substrate stage ST1 and measurement stage ST2, as viewed from above. In FIG. 2, driving mechanism SD for driving substrate stage ST1 and measurement stage ST2 includes linear motors 80, 81, 82, 83, 84, and 85. Driving mechanism SD includes a pair of Y-axis linear guides 91 and 93 extending in the Y-axis direction. Each of Y-axis linear guides 91 and 93 is disposed such that they are mutually separated, in the X-axis-direction, by a predetermined distance. Each of Y-axis linear guides 91 and 93 is constituted by a magnet unit in which a permanent magnet group constituted by multiple pairs of an N-pole met and an S-pole magnet disposed at predetermined intervals and alternately along, e.g., the Y-axis on is embedded. On Y-axis linear guide 91, which is one of the Y-axis linear guides are supported two sliders 90 and 94 movably in the Y-axis direction in a non-contact state. Similarly, on Y-axis linear guide 93, which is the other one of the Y-axis linear guides, are supported two sliders 92 and 95 movably in the Y-axis-direction in a non-contact state. Each of sliders 90, 92, 94, and 95 is constituted by a coil unit in which armature coils disposed at intervals along, e.g., the Y-axis direction are embedded. In other words, in the embodiment, each of the moving coil type Y-axis linear motors 82 and 84 is constituted by slider 90 constituted by the coil unit and Y-axis linear guide 91 and by slider 94 constituted by the coil unit and Y-axis linear guide 91, respectively. Similarly, each of the moving coil type Y-axis linear motors 83 and 85 is constituted by slider 92 and Y-axis linear guide 93 and by slider 95 and Y-axis linear guide 93, respectively.
Slider 90 constituting Y-axis linear motor 82 and slider 92 constituting Y-axis linear motor 83 are respectively fixed to one end portion and the other end portion located in the longitudinal direction of X-axis linear guide 87 extending in the X-axis on Further, slider 94 constituting Y-axis linear motor 84 and slider 95 constituting Y-axis linear motor 85 are respectively fixed to one end portion and the other end portion located in the longitudinal direction of X-axis linear guide 89 extending in the X-axis-direction. Thus, X-axis linear guide 87 can be moved in the Y-axis direction by Y-axis linear motors 82 and 83; X-axis linear guide 89 can be moved in the Y-axis-direction by Y-axis linear motors 84 and 85.
Each of X-axis linear guides 87 and 89 is constituted by a coil unit in which armature coils disposed at predetermined intervals along, e.g., the X-axis-direction are embedded. X-axis linear guide 89 is provided, in an inserted state, to an opening portion formed in substrate stage ST1. Inside the opening portion of substrate stage ST1 is provided magnet unit 88 having a permanent magnet group constituted by multiple pairs of an N-pole magnet and an S-pole magnet disposed at predetermined intervals and alternately along, e.g, the X-axis direction. A moving magnet type X-axis liner motor 81 that drives substrate stage ST1 in the X-axis-direction is constituted by magnet unit 88 and X-axis linear guide 89. Similarly, X-axis linear guide 87 is provided, in an inserted state, to an opening portion formed in measurement stage ST2. In the opening portion of measurement stage ST2 is provided magnet unit 86. A moving magnet type X-axis linear motor 80 that drives measurement ST2 in the X-axis-direction is constituted by magnet unit 86 and X-axis linear guide 87.
Further, by making the driving forces generated by the pair of Y-axis linear motors 84 and 85 (or 82 and 83) slightly different from each other, control in the θZ-direction of substrate stage ST1 (or measurement stage ST2) can be implemented Further, in the drawing, each of sure stage ST1 and measurement stage ST2 is illustrated as a single stage, however, actually, each of the stages includes an XY stage driven by the Y-axis linear motors and with a Z-tilt stage that is mounted over the XY stage via a Z-leveling driving mechanism (e.g., voice coil motors) and is finely moved relative to the XY stage in the Z-axis-direction, in the θX-direction, and in the θY-direction. Further, substrate holder PH (see FIG. 1), which holds substrate P, is supported by the Z-tilt stage.
As shown in FIG. 2, during a liquid immersion exposure of substrate P, controller CONT makes measurement stage S12 wait at a predetermined waiting position where measurement stage ST2 does not collide with substrate stage ST1. Further, in the state that substrate stage ST1 and measurement stage ST2 are mutually separated, controller CONT performs a step-and-scan type liquid immersion exposure on substrate P supported by substrate stage ST1. When substrate P is subjected to a liquid immersion exposure, controller CONT forms liquid immersion region LR of liquid LQ on substrate stage ST1 by using liquid immersion mechanism 1.
Next, while maintaining the relative positional relationship in the Y-axis-direction between substrate stage ST1 and measurement stage ST2, controller CONT moves substrate stage ST1 and measurement stage ST2 simultaneously in the-Y direction by using driving mechanism SD. More specifically, controller CONT moves substrate stage ST1 and measurement stage ST2 together in the -Y direction within a predetermined region including the position directly beneath projection optical system PL in a state that substrate stage ST1 and measurement stage ST2 are in contact with (or close to) each other.
By moving substrate stage ST1 and measurement stage ST2 together, controller CONT moves liquid immersion region LR of liquid LQ retained between first optical element LS1 of projection optical system PL and substrate P, by way of upper surface F1 of substrate stage ST1, to upper surface F2 of measurement stage S2. In accordance with the movement in the -Y direction of substrate stage ST1 and measurement stage ST2, liquid LQ's liquid immersion region LR that was formed between first optical element LS1 of projection optical system and substrate P moves to the surface of substrate P, to upper surface F1 of substrate stage ST1, and to upper surface F2 of measurement stage ST2, in this order. In this regard, along the way when liquid immersion region LR of liquid LQ moves from upper surface F1 of substrate stage ST1 to upper surface F2 of measurement stage ST2, liquid immersion region LR is disposed such that it straddles the boundary region between upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2, as shown in FIG. 3B.
Next, controller CONT moves substrate stage ST1 to a predetermined substrate exchange position by using driving mechanism SD to exchange substrate P and, in parallel to this process, performs predetermined measurement processes using measurement stage ST2, as required. As an example of such measurement process, there is the baseline measurement of alignment system ALG. Specifically, controller CONT simultaneously detects a pair of first fiducial marks on fiducial mark plate FM provided on measurement stage ST2 and mask alignment marks on mask M corresponding to the first fiducial marks by using the above-described mask alignment systems RAa and RAb and detects the positional relationship between the first fiducial marks and the mask alignment marks corresponding thereto. Further, by detecting a second fiducial mark on fiducial mark plate FM by use of alignment system ALG, controller CONT detects the positional relationship between the detection reference position of alignment system ALG and the second fiducial mark. Further, based upon the detected positional relationship between the above-described first fiducial marks and the mask alignment marks corresponding thereto, the detected positional relationship between the detection reference position of alignment system ALG and the second fiducial mar, and a known positional relationship between the first fiducial marks and the second fiducial mark, controller CONT determines the distance between the projection center of the mask pattern formed by projection optical system PL and the detection reference position of alignment system ALG, i.e., the baseline of alignment system ALG. FIG. 4B shows the state at this time.
Thereafter, in reverse to the former process, by moving substrate stage ST1 and measurement stage ST2 together in the +Y direction while maintaining the relative positional relationship in the Y-axis-direction between both stages ST1 and ST2, controller CONT moves substrate stage ST1 (substrate P) under projection optical system PL and then moves measurement stage ST2 to a predetermined position. By this, liquid immersion region LR is disposed on upper surface F1 of substrate stage ST1. Also along the way when liquid immersion region LR of liquid LQ is moved from upper surface of measurement stage ST2 to upper surface F1 of substrate stage ST1, liquid immersion region LR is disposed such that it straddles the boundary region between upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2.
Thereafter, controller CONT performs a step-and-scan type liquid immersion exposure process on substrate P to sequentially transfer the pattern of mask M onto each of the plurality of shot areas on substrate P. It is to be noted that the movement (position) of substrate stage ST1 for the purpose of exposing each shot area on substrate P is controlled based upon the position coordinates of the plurality of shot areas on substrate P obtained through the above described substrate alignment and upon the baseline measured just before.
It is to be noted that the measurement operation should not be limited to the above described baseline measurement; it may also be configured such that an illumination intensity measurement, an illumination intensity uniformity measurement, an aerial image measurement, etc. are performed in parallel to, e.g., the substrate exchange process, by using measurement stage ST2, and such measurements are reflected in the exposure of substrate P performed thereafter, by performing, e.g., a calibration process of projection optical system PL based upon the measurement results from such measurements.
FIG. 5 is a drawing showing the state in which liquid immersion region LR straddles the boundary region between upper spice F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2. In this state, liquid LQ of liquid immersion region LR may leak from between substrate stage ST1 and measurement stage ST2. When liquid LQ leaks from gap G between upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2, the liquid LQ having leaked drops from the upper surfaces F1 and F2 by the action of gravitation. Detecting device 60 detects in a non-contact manner the liquid LQ having leaked.
Substrate stage ST1 and measurement stage ST2 have overhang portion H1 and overhang portion H2, respectively. Thus, even when upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2 are made to come close to or into contact with each other, it is configured such that space H is formed under the portion where upper surface F1 and upper surface F2 are close to or in contact with each other, i.e., under gap G. Thus, liquid LQ having leaked from gap G drops, after passing through space H, onto base member BP. Further, even when upper surface F1 of substrate stage ST1 and upper surface F2 of measurement stage ST2 are made to come close to or into contact with each other, the optical path spaces of detecting light La and detecting light Lb are secured by space H. Here, detecting light La emitted from light projecting portion 61 and detecting light Lb emitted from light projecting portion 63 proceed substantially in parallel to the XY-plane. In particular, detecting light Lb emitted from light projecting portion 63 proceeds, in the vicinity of base member BP, substantially in parallel to upper surface BT of base member BP.
Light projecting portion 61 and light receiving portion 62 face each other, detecting light La emitted from light projecting portion 61 reaches light receiving portion 62; and it is configured such that detecting light La is received by light receiving portion 62 at a predetermined level of light amount (fight intensity). In this regard, when, as shown in, e.g., FIG. 5, liquid LQ having leaked from gap G drops and passes through the optical path of detecting light La, detecting light La is refracted, scattered, or absorbed by liquid LQ. Accordingly, when there is liquid LQ on the optical path of detecting light La, the light amount (light intensity) received by light receiving portion 62 decreases, or detecting light La does not reach light receiving portion 62. Thus, based on the light reception results (light-reception amount) from light receiving portion 62, detecting device 60 can detect whether there is liquid LQ on the optical path of detecting light La. And thus, by detecting whether there is liquid LQ on the optical path of detecting light La, detecting device 60 can detect whether liquid LQ has leaked from gap G.
Each of detecting lights La and detecting lights Lb proceeds side by side along the X-axis-direction. Thus, detecting device 60 can detect leakage of liquid LQ over a wide range of space H and base member BP. Further, when controller CONT judges based on the detection results from detecting device 60 that liquid LQ has leaked, controller CONT, for example, decreases the per-unit-time liquid supply amount by liquid supply mechanism 10 or stops supplying liquid LQ by liquid supply mechanism 10. Alternatively, based on the detection results from detecting device 60, controller CONT increases the per-unit-time liquid recovery amount by liquid recovery mechanism 20. Alternatively, based on the detection results from detecting device 60, controller CONT stops the exposure operation on substrate P or the movement of the stages ST1 and ST2. In this way, when leakage of liquid LQ is detected, controller CONT can, by taking an appropriate action, prevent liquid LQ from flowing out onto, e.g., the floor on which exposure apparatus EX, spreading the damage. Additionally, gas bearings 41 and 42 provide with gas suction ports. When there is liquid LQ on base member BP, liquid LQ may flow into the gas suction ports of gas be 41 and 42. Thus, when controller CONT judges based on the light reception results from light receiving portion 64 that there is liquid LQ on base member BP, controller CONT may stop the sucking operation through gas suction ports of gas bearings 41 and 42. Further, by setting the optical path of detecting light Lb to be located near gas bearings 41 and 42, liquid LQ can be detected by using detecting light Lb before liquid LQ on base member BP flows into gas suction ports of gas bearings 41 and 42; thus, by taking an appropriate action depending on the detection results, it can be precluded that liquid LQ having flowed out onto base member BP flows into gas suction ports of gas bearings 41 and 42. Further, when liquid LQ penetrates between the undersurfaces (bearing surfaces) of gas beatings 41 and 42 and upper surface BT of base member BP, the Z-direction positions of the stages ST1 and ST2 may vary due to the liquid LQ. However, an appropriate action can be taken based on the detection results from detecting device 60. Further, when controller CONT judges based on the detection results from detecting device 60 that liquid LQ has leaked, controller CONT may raise an alarm by operating an alarm device, not shown. Since, by this, an operator, for example, can recognize that liquid LQ has leaked, he or she can take an appropriate action. The alarm device may raise an alarm by using a warning light, a warning sound, a display, or the like.
Second Embodiment FIG. 6 is a drawing showing a second embodiment. In the following description, with respect to the same or equivalent constituent elements as those in the above-described embodiment, their descriptions will be abridged or omitted. Detecting device 60′ shown in FIG. 6 has both of a function of a light projecting portion emitting detecting light La′ and a function of a light receiving portion receiving the light. Detecting device 60′ is provided on overhang portion H2 of measurement stage ST2. On the other hand, reflecting member 66 having reflecting surface 65 is provided on a position that is located on overhang portion H1 of substrate stage ST1 and faces detecting device 60′. Detecting device 60′ illuminates reflecting surface 65 with detecting light La, receives, at the same time, the reflected light from reflecting surface 65, and detects, based upon the light reception results, whether liquid LQ has leaked from gap G. When liquid LQ does not exist on the optical path of detecting light La′, the reflected light of detecting light La′ emitted from detecting device 60′ is received by detecting device 60′ at a predetermined level of light intensity. In contrast, since when liquid LQ exists on the optical path of detecting light La′, detecting light La′ is scattered or absorbed by liquid LQ, the reflected light thereof is received by detecting device 60′ at a level of light intensity lower than the above-mentioned predetermined level of light intensity. Based upon the light reception results of the reflected light, detecting device 60′ can detect whether there is liquid LQ on the optical path of detecting light La′ and, thus, whether liquid LQ has leaked. With reflecting surface 65 being provided, the received light intensity difference between the case when liquid LQ exists on the optical path of detecting light La′ and the case when liquid LQ does not exist thereon becomes large; thus, detecting device 60′ can detect with high accuracy whether there is liquid LQ on the optical path of detecting light La′.
In addition, in this embodiment, the optical path of detecting light La′ emitted from detecting device 60′ exists within gap G between upper surface F1 and upper surface F2. By adopting such configuration, liquid LQ having leaked into gap G can be immediately detected by using detecting light La′.
It should be noted that it may also be configured such that detecting device 60′ having both functions of a light projecting portion and a light receiving portion is provided on first side surface T1 (second side surface T2) that has been described referring to FIG. 5, and reflecting member 66 is provided on second side surface T2 (first side surface T1). Similarly, it may also be configured such that detecting device 60′ is provided on gas bearing 41 (as bearing 42) that has been described referring to FIG. 5, and reflecting member 66 is provided on gas bearing 42 (gas bearing 41). Conversely, it may also be configured such that light projecting portion 61 that has been described referring to FIG. 5 is provided on overhang portion H1 (or H2), and light receiving portion 62 is provided on overhang portion H2 (or H1).
Third Embodiment FIG. 7 is a drawing exposure apparatus EX′ in accordance with a third embodiment. Exposure apparatus EX′ shown in FIG. 7 is such a so-called twin-stage type exposure apparatus as disclosed in, e.g., Japanese Unexamined Patent Publication Hei 10-163099, Japanese Unexamined Patent Publication Hei 10-214783, and Published Japanese Transition 2000-505958, in which two substrate stages ST1′ and ST2′ that are movable while holding a substrate are provided. Also in exposure apparatus EX′ shown in FIG. 7, liquid immersion region LR can be moved between upper surface F1′ of first sure stage ST1′ and upper surface F2′ of second substrate stage ST2′. Further, by providing detecting device 60 (60′) as in the case of the above-described embodiments, liquid LQ having leaked from between first substrate stage ST1′ and second substrate stage ST2′ when moving liquid immersion region LR from the surface of one of the stages of first substrate stage ST1′ and second substrate stage ST2′ to the upper surface of the other stage can be detected.
As described above, in the embodiments, liquid LQ is purified water. Purified water has the advantage that it is easily available in bulk in, e.g, semiconductor manufacturing factories and also the advantage that it does not adversely affect photoresist on substrate P, optical elements (lenses), etc. Further, purified water does not adversely affect the environment and contains scarcely any impurities; thus, the effect that it cleans the surface of substrate P and the surface of the optical element provided at the end portion of projection optical system PL can be expected. It should be noted that when the purity of the purified water supplied from, e.g., the factory, it may be configured such that the exposure apparatus itself has an ultrapure water system.
The refractive index n of purified water (water) relative to exposure light EL having a wavelength of about 193 mm is said to be approximately 1.44, and when ArF excimer laser light (having 193 nm wavelength) is used as the light source of exposure light EL, the wavelength is effectively shortened, on substrate P, as if multiplied by 1/n, i.e., effectively becomes approximately 134 mn, and thus, a high resolution can be obtained. Further, since the depth of focus increases by approximately n times, i.e., approximately by 1.44 times, compared with that in the air, when securing of the depth of focus on par with the depth of focus realized when the projection optical system is used in the air suffices, the numerical aperture of the projection optical system PL can be further increases which also improves the resolution.
It should be noted that while, in the embodiments, liquid LQ is water (purified water), liquid LQ may be a liquid other than was For example, when the light source of exposure light EL is an F2 laser, the F2 laser light does not transmit through water, and thus, as liquid LQ, a fluorofluid that can transit the F2 laser light, such as perfluorcpolyether (PFPE) or fluorochemical oil, may be used. In this case, the portions that come into contact with liquid LQ are applied with lyophilic treatment, by forming a thin film of a substance which includes, e.g., fluorine and has a molecular structure of a small polarity. Further, as liquid LQ, a material (e.g., cedar oil) that can transmit exposure light EL, has a high refractive index as high as practicable, and does not affect projection optical system PL and the photoresist applied to the surface of substrate P can also be used. Also in this case, the surface treatment is applied in accordance with the polarity of liquid LQ to be used.
Further, while the exposure apparatus, to which the above-described immersion liquid method is applied, is configured such that with the optical path space on the exit side of fit optical element LS1 of projection optical system PL being filled with a liquid (purified water), substrate P is exposed, the optical path space on the incidence side of firs optical element LS1 of projection optical system PL may also be filled with the liquid (purified water), as disclosed in the International Publication WO 2004/019128.
It is to be noted that regarding substrate P of each of the above described embodiments, not only a semiconductor wafer for many a semiconductor device, but also a glass for a display device, a ceramic wafer for a thin film magnetic head, a master mask or reticle (synthetic quartz or silicon wafer), etc. can be used.
Regarding exposure apparatus EX, in addition to a scan type exposure apparatus (scanning stepper) in which while synchronously moving mask M and substrate P, the patter of mask M is scan-exposed, a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of mask M is exposed at one time in the condition that mask M and substrate P are stationary, and substrate P is successively moved stepwise can be used.
Further, regaining exposure apparatus EX, the present invention can be applied to an exposure apparatus in which in the state that a first pattern and substrate P are substantially stationary, the reduction image of the first pattern is exposed at one time by using a projection optical system (e.g., a refraction type projection optical system that has a reduction magnification of ⅛ and includes no reflecting element). In this case, the present invention can be applied to a stitch type one-shot exposure apparatus in which thereafter, in the state that a second pattern and substrate P are substantially stationary, the reduction image of the second pattern is exposed at one time onto substage P by using the projection optical system in a manner that the first pattern image and the second pattern image partially overlap with each other. Further, in conjunction with the stitch, type exposure apparatus, the present invention can also be applied to a step and stitch type exposure apparatus in which at least two patterns are transferred onto substrate P in a partially overlapping manner, and substrate P is successively moved.
In the above-described embodiments, a light transmission type mask on which a predetermined light-shielding pattern (or a phase pattern/light decreasing pattern) is formed on a light transmissive substrate is used, however, instead of such mask, an electronic mask that forms, based upon the electronic data of a pattern to be exposed, a transmission pattern, a reflection pattern, or a light emitting pattern may also be used, as disclosed in, e.g., U.S. Pat. No. 6,778,257.
Further, while, in the above-described embodiments, the exposure apparatus, in which the liquid locally fills the space between projection optical system PL and substrate P, is adopted, the present invention can also be applied to a liquid immersion exposure apparatus in which the entire surface of a substrate to be exposed is covered by a liquid. The structure and exposure operation of an exposure apparatus in which the entire surface of a subdue to be exposed is covered by a liquid are described in, e.g., Japanese Unexamined Patent Publication Hei 6-124873, Japanese Unexamined Patent Publication Hei 10-303114, or U.S. Pat. No. 5,825,043.
Regarding the type of expo apparatus EX, the present invention is not limited to an exposure apparatus, which exposes a semiconductor pattern onto substrate P, for manufacturing semiconductor devices, however can also be applied to a variety of exposure apparatuses, e.g., an exposure apparatus for manufacturing liquid crystal display devices or a displays, an exposure apparatus for manufacturing thin film magnetic heads, an exposure apparatus for manufacturing image pickup devices (CCDs), and an exposure apparatus for manufacturing reticles or masks.
Exposure apparatus EX according to the embodiments of the present application is built by assembling various subsystems, including each element listed in the claims of the present application, in such a manner that prescribed mechanical accuracy, electrical accuracy, and optical accuracy are maintained. In order to ensure the various accuracies, prior to and after the assembly, every optical system is adjusted to achieve its optical accuracy, every mechanical system is adjusted to achieve its mechanical accuracy, and every electrical system is adjusted to achieve its electrical accuracy. The process of assembling each subsystem into the exposure apparatus includes mechanical interfaces, electrical circuit wiring connections, and air pressure plumbing connections between each subsystem. Needless to say, there is also a process where each subsystem is assembled prior to the assembling of the exposure apparatus from the various spasms. On completion of the process of assembling the various subsystems in the exposure apparat, overall adjustment is performed to make sure that every accuracy is maintained in the complete exposure apparatus. Additionally, it is desirable to manufacture the exposure apparatus in a clean room, in which the temperature, purity, etc. are controlled.
As shown in FIG. 8, micro devices such as semiconductor devices are manufactured by a series of steps, including: step 201 in which the micro device's function and performance design is performed; step 202 in which a mask (reticle) is mama based on the design step; step 203 in which a substrate, the device's base material, is manufactured; substrate processing step 204 including a process in which the mask pattern is exposed onto the substrate by exposure apparatus EX according to the above-described embodiments; device assembly step 205 (including a dicing process, a bonding process, and a packaging process); inspection step 206.
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and exposure apparatus and method using sameWO2004090577A2Mar 17, 2004Oct 21, 2004Nippon Kogaku KkMaintaining immersion fluid under a lithographic projection lensWO2004114380A1Jun 18, 2004Dec 29, 2004Nippon Kogaku KkExposure device and device producing methodWO2005010962A1Jul 26, 2004Feb 3, 2005Nippon Kogaku KkExposure apparatus, device producing method, and exposure apparatus controlling methodWO2005074014A1Jan 27, 2005Aug 11, 2005Nippon Kogaku KkStage drive method and stage drive apparatus, exposure apparatus, and device producing methodWO2005076321A1Jan 28, 2005Aug 18, 2005Nippon Kogaku KkExposure apparatus and method of producing device* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS8547522 *Dec 9, 2009Oct 1, 2013Asml Netherlands B.V.Dedicated metrology stage for lithography applicationsUS8587762 *Sep 25, 2008Nov 19, 2013Asml Netherlands B.V.Methods relating to immersion lithography and an immersion lithographic apparatusUS20090086175 *Sep 25, 2008Apr 2, 2009Asml Netherlands B.V.Methods relating to immersion lithography and an immersion lithographic apparatusUS20100149507 *Dec 9, 2009Jun 17, 2010Asml Netherlands B.V.Dedicated Metrology Stage for Lithography ApplicationsUSRE43576Jan 8, 2009Aug 14, 2012Asml Netherlands B.V.Dual stage lithographic apparatus and device manufacturing methodUSRE44446Aug 13, 2012Aug 20, 2013Asml Netherlands B.V.Dual stage lithographic apparatus and device manufacturing method* Cited by examinerClassifications U.S. Classification355/53, 355/30International ClassificationG03B27/52, G03B27/42Cooperative ClassificationG03F7/70716, G03F7/70525, G03F7/70991, G03F7/70733, G03F7/70341European ClassificationG03F7/70L2H, G03F7/70N6, G03F7/70P16, G03F7/70F24, G03F7/70N4Legal EventsDateCodeEventDescriptionApr 25, 2012FPAYFee paymentYear of fee payment: 4Apr 12, 2007ASAssignmentOwner name: NIKON CORPORATION, JAPANFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHIBUTA, MAKOTO;REEL/FRAME:019203/0042Effective date: 20070125RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google


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Previous Close 842.09 52Wk Range 783.91 - 860.97 1 Yr Return -0.73% YTD Return 2.01% Fund Type Open-End Fund Objective Growth Broad Market Asset Class Focus Equity Geographic Focus South Korea NAV (on 01/17/2017) 836.98 Total Assets (b KRW) (on 01/17/2017) 14.389 Inception Date 07/13/2011 Last Dividend (on 03/17/2016) - Dividend Indicated Gross Yield - Fund Managers HEO PIL SEOK Front Load Fee 0.00% Back Load Fee 0.00% Redemption Fee 0.00% 12b-1 Fee - Current Mgmt Fee 0.65% Expense Ratio 1.74% Top Fund Holdings Name Position Value % of Fund 005930:KS Samsung Electronics Co Ltd 849.00 1.39 b 0.00 035420:KS NAVER Corp 265.00 227.11 m 0.00 005380:KS Hyundai Motor Co 1.53 k 214.76 m 0.00 012330:KS Hyundai Mobis Co Ltd 748.00 204.95 m 0.00 028260:KS Samsung C&T Corp 1.23 k 198.48 m 0.00 005490:KS POSCO 827.00 196.00 m 0.00 096770:KS SK Innovation Co Ltd 1.18 k 178.92 m 0.00 000660:KS SK Hynix Inc 4.17 k 171.09 m 0.00 034730:KS SK Holdings Co Ltd 753.00 168.30 m 0.00 105560:KS KB Financial Group Inc 3.79 k 160.44 m 0.00 Profile Midas Covered Call Securities Investment Trust (Equity) is an open-end fund incorporated in South Korea. The objective of the fund is to achieve capital gains and dividend by investing mainly in stocks. The Fund invests 60% or more in stocks, 40% or less bonds, CPs, and ABSs, respectively. Address Midas Asset Management Co. Ltd.Hana Securities Bldg 8 FYoido Dong 23-3, Youngdeungpo GuSeoul, 150-709Korea Phone 82-2-3787-3500 Website www.midasasset.co.kr Terms of Service Trademarks Privacy Policy ©2017 Bloomberg L.P. All Rights Reserved Careers Made in NYC Advertise Ad Choices Website Feedback Help

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Patent US6752961 - Modified siphons for improving metering precision - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign in<nobr>Advanced Patent Search</nobr>PatentsThe present invention provides centrifugal rotors for delivering a premeasured volume of liquid to a chamber in the rotor. In particular the rotors comprise siphons for delivering a premeasured volume of liquid between a first and a second chamber in the rotor. The siphons of the invention are designed...http://www.google.com/patents/US6752961?utm_source=gb-gplus-sharePatent US6752961 - Modified siphons for improving metering precisionAdvanced Patent SearchPublication numberUS6752961 B2Publication typeGrantApplication numberUS 09/834,300Publication dateJun 22, 2004Filing dateApr 12, 2001Priority dateSep 1, 1993Fee statusPaidAlso published asUS6235531, US7998411, US20030207457, US20040209374Publication number09834300, 834300, US 6752961 B2, US 6752961B2, US-B2-6752961, US6752961 B2, US6752961B2InventorsAnne R. Kopf-Sill, Carol T. SchembriOriginal AssigneeAbaxis, Inc.Export CitationBiBTeX, EndNote, RefManPatent Citations (23), Non-Patent Citations (3), Referenced by (16), Classifications (13), Legal Events (3) External Links: USPTO, USPTO Assignment, EspacenetModified siphons for improving metering precisionUS 6752961 B2Abstract The present invention provides centrifugal rotors for delivering a premeasured volume of liquid to a chamber in the rotor. In particular the rotors comprise siphons for delivering a premeasured volume of liquid between a first and a second chamber in the rotor. The siphons of the invention are designed such that the inlet of the siphon on the first chamber is radially outward of the siphon outlet on the second chamber. The first chamber is emptied to a level equivalent to the radial position of the siphon outlet.
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS4244916Feb 5, 1979Jan 13, 1981Jean GuiganDevice for conditioning a sample of liquid for analyzing with internal filterUS4314968Oct 20, 1980Feb 9, 1982Jean GuiganSimultaneous analysis apparatusUS4623519Jul 2, 1984Nov 18, 1986Societe Nationale Elf AquitaineCell for analysis device, to collect a fraction of a liquid sample for reaction and analysisUS4689203Jan 11, 1985Aug 25, 1987Fluilogic Systems OyCentrifugeUS4743558Oct 22, 1985May 10, 1988Jean GuiganCentrifugingUS4761268Apr 12, 1984Aug 2, 1988Fisher Scientific CompanyLiquid handlingUS4876203Oct 22, 1985Oct 24, 1989Jean GuiganMethod of performing medical analysis on a liquid sample using at least one dry reagent, and apparatus for the methodUS4894204Dec 9, 1988Jan 16, 1990InovelfRotor with dynamic pipeting for a centrifuge analysis deviceUS4902479Nov 7, 1983Feb 20, 1990Fisher Scientific CompanyCircumferential array of elongated radial extending cuvettes; prebention of mixing due to wickingUS4963498Jan 15, 1988Oct 16, 1990BiotrackDetection of analyte by flow change after interaction with reagentUS4999304Dec 28, 1987Mar 12, 1991Miles Inc.Analyzing blood and other body fluidsUS5061381Jun 4, 1990Oct 29, 1991Abaxis, Inc.Distribution of separated plasma into differnt test wells with in centrifugal rotor for testing without transferringUS5071625Jan 20, 1988Dec 10, 1991Fisher Scientific CompanyRotor; circumferential array; interlock structure; aligned orientation; air circulation; centrifugal analyzersUS5077013Jul 18, 1989Dec 31, 1991Jean GuiganMiniature laboratory for performing biological analyses by chemical reaction on a sample of bloodUS5104813Apr 13, 1989Apr 14, 1992Biotrack, Inc.For automatically measuring then supplying samples of controlled concentration using only forces of gravity or capillary pressureUS5122284Apr 1, 1991Jun 16, 1992Abaxis, Inc.Apparatus and method for optically analyzing biological fluidsUS5160702Jan 17, 1989Nov 3, 1992Molecular Devices CorporationAnalyzer with improved rotor structureUS5173193Apr 1, 1991Dec 22, 1992Schembri Carol TCentrifugal rotor having flow partitionUS5173262May 30, 1989Dec 22, 1992Martin Marietta Energy Systems, Inc.For use in analyzing blood, immunoassaysUS5186844Apr 1, 1991Feb 16, 1993Abaxis, Inc.Separation chamber located radially outward from sample chamber and connected by flow restrictive channelUS5256376Sep 12, 1991Oct 26, 1993Medical Laboratory Automation, Inc.Photooptical detection, centrifugingUS5457053 *Apr 13, 1994Oct 10, 1995Abaxis, Inc.Reagent container for analytical rotorUS5693233 *Dec 4, 1995Dec 2, 1997AbaxisMethods of transporting fluids within an analytical rotor* Cited by examinerNon-Patent CitationsReference1Marketing Brochure, Abaxis, Inc., Aug. 1993.2Schembri, C. Abstract, "Centrifugation and Capillary Integrated into a Multiple Analyte Whole Blood Analyzer, " Abaxis, Inc., Feb. 1993.3Tech Update, "Blood Rotor Test Magic," Popular Mechanics, Feb. 1993.Referenced byCiting PatentFiling datePublication dateApplicantTitleUS7332049Dec 22, 2004Feb 19, 2008General Electric CompanyMethod for fabricating reinforced composite materialsUS7335012Dec 22, 2004Feb 26, 2008General Electric CompanyApparatus for fabricating reinforced composite materialsUS7431978Dec 22, 2004Oct 7, 2008General Electric CompanyReinforced matrix composite containment ductUS7854893 *Mar 28, 2008Dec 21, 2010Panasonic Corporationfor collecting a plasma component or a blood cell component in blood; high-concentration solid component solution which is obtained by performing the centrifugal separation can be transferred by a required amount; enhancement of the measurement precision; siphon effectUS7867566Oct 26, 2007Jan 11, 2011General Electric CompanyMethod for fabricating reinforced composite materialsUS8534319Mar 3, 2008Sep 17, 2013Universite LavalSerial siphon valves for fluidic or microfluidic devicesUS8562911Feb 5, 2010Oct 22, 2013Medi Medical Engineering Corp.Centrifugal rotor and method for using the same for delivering biological sampleUS8709346Nov 12, 2010Apr 29, 2014Panasonic CorporationAnalysis device and an analysis apparatus using the analysis deviceUS8734734Sep 12, 2012May 27, 2014LaMotte Chemical Products CompanyLiquid analysis cartridgeCN101522916BAug 2, 2007Sep 5, 2012三星电子株式会社Thin film chemical analysis apparatus and analysis method using the sameDE102008003979B3 *Jan 11, 2008Jun 10, 2009Hahn-Schickard-Gesellschaft f�r angewandte Forschung e.V.Fluidikvorrichtung, Fluidikmodul und Verfahren zum Handhaben einer Fl�ssigkeitDE102011083920A1Sep 30, 2011Apr 4, 2013Albert-Ludwigs-Universit�t FreiburgVerfahren und vorrichtung zum erzeugen von fluidisch voneinander separierten teilvolumina einer fl�ssigkeitDE102012213044B3 *Jul 25, 2012Jan 23, 2014Hahn-Schickard-Gesellschaft f�r angewandte Forschung e.V.Device for forming combination of buffer- and screening liquids for formation of fully automatic dilutions, has structures connecting four dosing chambers, where ratio of first to second chamber differs from ratio of third to fourth chamberWO2008016271A1 *Aug 2, 2007Feb 7, 2008Jae Chern YooThin film chemical analysis apparatus and analysis method using the sameWO2008106782A1 *Mar 3, 2008Sep 12, 2008Univ LavalSerial siphon valves for fluidic or microfluidic devicesWO2013045631A1Sep 28, 2012Apr 4, 2013Albert-Ludwigs-Universit�t FreiburgMethod and device for producing fluidically separated sub-volumes of a liquid* Cited by examinerClassifications U.S. Classification422/72, 436/45, 436/180, 422/549International ClassificationG01N21/07Cooperative ClassificationB01L2300/0867, B01L2300/087, B01L2300/0806, G01N21/07, B01L2400/0409, B01L3/502738European ClassificationB01L3/5027E, G01N21/07Legal EventsDateCodeEventDescriptionDec 22, 2011FPAYFee paymentYear of fee payment: 8Jan 16, 2008ASAssignmentOwner name: ABAXIS, INC., CALIFORNIAFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KOPF-SILL, ANNE R.;SCHEMBRI, CAROL T.;REEL/FRAME:020371/0068Effective date: 19940725Sep 24, 2007FPAYFee paymentYear of fee payment: 4RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google

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To curb climate risks, we must cut emissions and deploy low-carbon energy sources like wind
Thu 10 Dec 2015 06.00 EST Last modified on Wed 14 Feb 2018 13.15 EST
Wind turbines seen from a beach. Photograph: Peter Byrne/PA
When we think about climate change, it’s easy to focus on reducing emissions in order to maintain a healthy global temperature. But any real progress has to be complemented by a significant increase in clean and renewable energy. Fortunately, businesses have plans to build on recent successes and supply the world with the energy we need to grow economies.
A great example is Vestas, a major renewable energy company. I had the pleasure of communicating with the Vestas CEO Mr. Anders Runevad. He has served as CEO since 2013 and prior to that he worked at Ericsson and Sony Mobile. Mr. Runevad combines a technical background and education with business training to chart out pathways for companies to build capacity in the rapidly evolving energy market.
Vestas is a company very familiar to people like me who work in the wind power industry. They are the largest manufacturer of wind turbines in the world. Just this year, they have reached 7 GW of announced orders; their turbines can supply energy to supply the needs of 75 million Europeans.
But providing energy to the developing world is only part of the energy solution. Solving the climate change problem means we also need to revolutionize the power grids in the developing world. Companies like Vestas are working on that problem too.
Mr. Runevad recently met with India’s Prime Minister Modi and presented a plan to build blades at a new factory in India. They also have plans to increase the renewable energy supply in that country. As of now, Vestas has installed nearly 5,000 turbines in India and employs approximately 900 people there. Vestas has also committed to investments in Kenya by participating in the development of a wind park. The goal is to supply 15% of the electrical needs of Kenya, a country that is plagued by expensive and unreliable energy sources.
I asked Mr. Runevad a few questions related to recent wind power developments and to the future outlook on the industry. I asked him what has happened to costs of wind power around the world and in the USA in particular. He told me that in the past 20 years, the cost of wind is down approximately 80%. In the past 5 years, the cost is down 15%. In the USA, the cost has decreased more than 50% since 2009. So, the cost decrease is significant and sustained.
One concern people have about wind power is that they perceive it isn’t reliable. When the wind does not blow, power is not produced. But Mr. Runevad told me that the newer wind turbines are better at creating wind power in variable wind speeds. They have bigger rotors, higher towers, and lighter blades. The resulting grid is more stable. Importantly, there is better interconnection with neighboring countries and linking with storage or hydropower sources, which also increases reliability and efficiency.
I asked how effectively wind can compete with fossil fuel sources, and learned that wind has become extremely cost effective. In areas where energy consumption is increasing so that new power sources have to be built, there is a basic parity and in many cases, wind wins on cost alone. In mature markets where existing coal, nuclear, or gas power generation infrastructure is already built (often with years of subsidies), it is more challenging to build wind because new infrastructure would have to be created. There, new-build wind has to compete with the costs of maintenance of the existing energy source. However, even then, wind is an attractive option, aside from the fact it creates energy without greenhouse gas emissions.
With renewable energy technology changing so rapidly, I wanted to know what was in store in the near-term future. He told me that the cost reductions will continue into the future. There are three reasons for the cost reductions. First, turbines are becoming larger, with taller towers, and lighter construction. Second, increased efficiency in the supply chain and manufacturing systems are lowering cost. Finally, as the scale of wind installations increase, there are cost savings from the economies of scale that are realized.
Companies like Vestas want to not only create products that can be profitable, but they are motivated by making a positive difference in the world. That is one of the reasons why they are interested in climate change and the impacts it can have on people and systems around the globe. I asked Mr. Runevad what he hoped to see out of the Paris climate conference. He told me that he hopes the talks result in increased funding for green development with a mechanism to review and revise emissions targets and renewable energy targets. These two mechanisms (reducing emissions and increasing renewable energy) are the tools we will have to employ simultaneously to lower our risk of climate change.
As we get close to the end of the hottest year on record, it is encouraging that companies have clearly articulated plans to help us collectively emerge into the new energy economy. It’s apparent that smart planning now will not only help us solve the global warming problem, but will also create jobs and diversify our energy supply.

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text: How to fill hierarchical data into a TreeView using base classes and data providers. - CodeProject 10,948,286 members (70,437 online)

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Suspect in Anthrax Scare Ordered Freed
A National Institutes of Health employee who allegedly threatened Florida tax officials with anthrax has been released from jail by a federal judge in Greenbelt.
Michelle Ledgister, 43, of Rockville is charged with spreading false information and making a hoax under the Terrorism Prevention Act.
During a hearing yesterday, Ledgister was required to post her Florida home as collateral and was ordered not to have contact with the Broward County tax assessor's office.
Prosecutors say Ledgister threatened a tax assessor after her claim for tax relief on property she owns in Parkland, Fla., was rejected.
She allegedly left a voice mail at the Broward County Property Appraiser's Office claiming that the office had anthrax.
Farmers Offer Ideas on Farm Policy
Maryland farmers want fewer land-use restrictions and assurances that their way of life will endure, speakers told the Maryland Agriculture Commission at the first in a series of "listening sessions" scheduled across the state.
Monday's meeting in Frederick and others scheduled this month in Calvert, Garrett, Harford, Queen Anne's, Washington and Wicomico counties are aimed at helping the Ehrlich administration learn what farmers need to stay in business. The advisory panel will present its findings Feb. 13 at the Governor's Agricultural Forum, which has been asked to develop policy recommendations.
The Frederick meeting drew more than 100 participants and produced plenty of comments about land use and farm profitability -- two of the four topics the commission had identified beforehand as key areas of concern. But the participants from Frederick, Montgomery, Carroll and Howard counties virtually ignored the panel's two other chosen topics -- alternative enterprises and biosecurity -- and instead focused on market access and the next generation of farmers.
Sales Tax Takes Back-to-School Holiday
The District has declared a sales tax holiday for back-to-school shoppers starting Saturday and extending through the following weekend, ending Aug. 14, Mayor Anthony A. Williams announced yesterday.
During that period, shoppers in D.C. stores will be able to buy clothes, shoes and school supplies worth $100 or less without paying the District's 5.75 percent sales tax.
This marks the second year the District has scheduled two tax holidays in an effort to boost sales. The second will target Christmas shoppers and is scheduled for Nov. 25 to Dec. 4.
Some Work Detoured From DMV
The D.C. Department of Motor Vehicles will offer only limited services at its 65 K St. NE facility this week because its second-floor cooling system is not working. Some of those services will move to a new location next week, and spokeswoman Janis Hazel said the department is scheduled to leave the K Street building in October.
The department will not operate its call center today or tomorrow, and emergency DMV calls should go to the mayor's call center, at 202-727-1000. The department's insurance operations office, where drivers can show proof of insurance, also will be closed the rest of the week. Driver record and permit control services will be limited to reinstatements.
Other adjudication business, such as scheduled and walk-in hearings, moving and parking ticket payments, and boot and tow operations, will continue as usual on the main level of 65 K St. NE.
Next week, the insurance and driver record services will be offered at a new location, 301 C St. NW, Room 1157, where they will be available from 8:15 a.m. to 4 p.m. weekdays.
Closed Hearing Considers Boy's Custody
Fairfax County authorities had a closed 31/2-hour hearing yesterday to make a preliminary determination on who should take custody of a 4-year-old boy allegedly abandoned by his mother on the Capital Beltway last week, but neither the participants nor family members would say what decisions were reached.
Fairfax County Child Protective Services filed a civil case in Fairfax juvenile court claiming that Channoah A. Green, 22, of Newport News was abusive and neglectful after she allegedly pushed her son out of the car in the Falls Church area the night of July 26, then bumped him as she drove away. The custody case is separate from felony criminal charges of child neglect and hit-and-run, which are pending. The boy is with Child Protective Services.
Substitute Juvenile Court Judge Beth A. Bittel barred reporters, three of Green's family members and one of Green's criminal attorneys, Deputy Fairfax Public Defender Todd G. Petit, from the courtroom. Participants in the hearing said afterward that Bittel had placed a gag order on them to prevent them from discussing the boy's situation.
Attorney Patrick H. Stiehm, who represented Green, said the hearing was only a preliminary step in determining whether Green should retain custody of her son. Green's family declined to comment.
Scouts Strike Camp at Fort A.P. Hill
The National Boy Scout Jamboree ended yesterday, leaving Fort A.P. Hill tentless for the first time in nearly 10 days.
The quadrennial event made headlines when four Scout leaders from Alaska were electrocuted as they tried to erect a dining tent. Two days later, about 300 people suffered heat exhaustion as they waited for President Bush to arrive for a speech. The president's visit was twice canceled before he spoke to the Scouts on Sunday.
The next Jamboree will take place in 2010, the centennial of the Scouting organization.
The Boy Scouts of America has used the military base 70 miles south of the nation's capital for its summer event since 1981.
Questions have been raised about whether the location and time of year of the event are the right combination for the Scouts' convention.
But Scouts spokeswoman Renee Fairrer said there are no plans to change the location for the next event. Organizers will pay "special attention" to reduce the possibility of accidents and other incidents.
"I'm going to tell her her mother was one of the toughest women I've ever met, that she was absolutely determined in what she did."
-- Justin Torres, on what he one day will tell his niece Susan Ann Catherine Torres about her mother, who gave birth to her three months after being left brain-dead by cancer. -- A1
Compiled from reports by staff writers Tom Jackman and Lori Montgomery and the Associated Press.

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text: CD ( E , F , { X } ) = ∑ u , v U , V C w ; uv x w u y w v + ∑ i , j I , J C a ; ij CH E i CH F j . ( 6 ) According to the an embodiment it is recognized that printed CD is responsive to both pre- and post-exposure process characteristics and lithographic exposure apparatus characteristics. The latter characteristics include, for example, physical properties of the apparatus, apparatus-manufacturing tolerances and variability, and apparatus settings for running a lithographic exposure process. It shall be appreciated that a response to pre- and post-exposure process characteristics is dominated by a resulting spatial variability of printed CD with respect to the substrate. Therefore, in contrast to the model parameters Ca;ij, which by definition relate to apparatus characteristics, the model parameters Cw;uv primarily relate to an impact on printed CD which usually is not attributable to the lithographic apparatus as such, but instead to sources of CD deviation outside the lithographic apparatus. The latter impact is, for simplicity, referred to as process-impact hereinafter, whereas the impact on printed CD of lithographic exposure apparatus characteristics is referred to as apparatus-impact.


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Dictionary of Film Terms: The Aesthetic Companion to Film Art / Edition 4 by Frank Eugene Beaver | 2901433104533 | Paperback | Barnes & Noble®
by Frank Eugene BeaverFrank Eugene Beaver
ISBN-13: 2901433104533
For more than twenty years Frank Eugene Beaver’s Dictionary of Film Terms has been a standard reference for the study of films and filmmaking. This updated, expanded edition includes descriptions of the latest developments in such areas as animation, special effects, and sound aesthetics and includes numerous stills from classic and contemporary films. A
For more than twenty years Frank Eugene Beaver’s Dictionary of Film Terms has been a standard reference for the study of films and filmmaking. This updated, expanded edition includes descriptions of the latest developments in such areas as animation, special effects, and sound aesthetics and includes numerous stills from classic and contemporary films. A trusted, practical handbook, Dictionary of Film Terms clearly and concisely defines the essential terms of film analysis, appreciation, and production, with a special focus on the aesthetic values of filmmaking. Extensive cross-referencing among individual definitions ensures easy access to specific terms, and a comprehensive topical index relates to larger concepts of film art by grouping them under such wide-ranging categories as editing, cinematography, composition, and lighting.Dictionary of Film Terms is a valuable compendium of definitions of aesthetic techniques (ambient sound, camera angle, process shot), theoretical concepts (auteur criticism, film acting), styles (Hitchcockian, naturalist, neorealist), and genres (film noir, screwball comedy) that together comprise the language of motion-picture expression. Students of film and weekend movie buffs will find it a useful companion for better understanding the art of film.
2901433104533

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