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Patent US7173322 - COF flexible printed wiring board and method of producing the wiring board - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inPatentsThe present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF flexible printed wiring board. The COF...http://www.google.com/patents/US7173322?utm_source=gb-gplus-sharePatent US7173322 - COF flexible printed wiring board and method of producing the wiring boardAdvanced Patent SearchPublication numberUS7173322 B2Publication typeGrantApplication numberUS 10/386,116Publication dateFeb 6, 2007Filing dateMar 12, 2003Priority dateMar 13, 2002Fee statusLapsedAlso published asCN1328784C, CN1444270A, US7198989, US20040004823, US20050181541, US20080251947Publication number10386116, 386116, US 7173322 B2, US 7173322B2, US-B2-7173322, US7173322 B2, US7173322B2InventorsKen Sakata, Katsuhiko HayashiOriginal AssigneeMitsui Mining & Smelting Co., Ltd.Export CitationBiBTeX, EndNote, RefManPatent Citations (53), Referenced by (9), Classifications (30), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetCOF flexible printed wiring board and method of producing the wiring board
In one embodiment of the production method of the present invention, the releasing layer is provided after the photolithographic process (pattering process) and before mounting of semiconductor elements. The reason for choosing the above timing is that the releasing layer is possibly dissolved by a photoresist remover or a similar material. Therefore, the releasing layer is preferably provided after etching of the conductor layer for removal of a resist mask for forming a wiring pattern. Specifically, the releasing layer is preferably provided, for example, after formation of a tin plating layer preceded by removal of a resist mask or after plating of a lead electrode preceded by removal of the resist mask and provision of a solder resist layer. Such a releasing layer may be formed by coating a solution containing a releasing agent and bringing the applied solution to dryness. However, in order to enhance bonding strength between the insulating layer and the releasing layer, the applied solution is preferably heated. The conditions under which the heating is performed are, for example, at 50 to 200� C., preferably 100 to 200� C. for one minute to 120 minutes, preferably 30 minutes to 120 minutes.
According to another embodiment of the method of the present invention, a releasing layer provided on a transfer film may be transferred on a surface of the insulating layer, which surface is opposite to the mounting side of the semiconductor chips (IC). Exemplary conditions under which the transfer is performed are, but are not limited to, a heating temperature of 15 to 200� C., a load for rolling or pressing of 5 to 50 kg/cm2, and a treatment time of 0.1 seconds to two hours. Bonding between the insulating layer and the releasing layer may be enhanced through, for example, heat treatment in order to prevent peeling of the releasing layer from the insulating layer. Exemplary conditions under which the heating is performed are, but are not limited to, at 50 to 200� C., preferably 100 to 200� C., preferably for one minute to 120 minutes, preferably 30 minutes to 120 minutes.
In use of the COF flexible printed wiring board of the present invention, a semiconductor chip is mounted thereon. No particular limitation is imposed on the mounting method. For example, semiconductor chips are mounted by positioning and disposing the COF flexible printed wiring board on semiconductor chips which are placed on a chip stage, and pressing a heating tool against the COF flexible printed wiring board. In this case, the heating tool is heated to at least 200� C., or in some cases, 350� C. or higher. However, since the COF flexible printed wiring board has a releasing layer formed on the insulating layer, melt adhesion between the heating tool and the insulating layer can be prevented.
The entirety of the thus-formed wiring pattern 21 is plated (e.g., plated with tin) in accordance with needs, and then a releasing layer 13 is formed, through the application method, on the insulating layer 12, as shown in FIG. 2F. Although the applied releasing layer 13 may be simply dried, heating of the layer is preferred, for enhancing a releasing effect; i.e., for preventing melt adhesion of a heating tool and the insulating layer. Exemplary conditions under which the heating is performed are, but are not limited to, at 50 to 200� C., preferably 100 to 200� C. for one minute to 120 minutes, preferably 30 minutes to 120 minutes. Subsequently, a solder resist layer 23 is formed through, for example, screen printing, as shown in FIG. 2G. An outer lead and an inner lead, which are not covered with the solder resist layer 23, are plated with a metal in accordance with needs. No particular limitation is imposed on the material of the metal plating layer, and tin plating, tin alloy plating, nickel plating, gold plating, gold alloy plating, etc. may appropriately be performed in accordance with the purpose of use.
The releasing layer may be formed through the transfer method. Specifically, the aforementioned COF film carrier tape may be produced from a laminate film 10A for producing a COF as shown in FIGS. 3A to 3E. The laminate film shown in FIGS. 3A to 3E is produced by coating to a conductor layer 11 (copper foil, FIG. 3A) a polyimide precursor resin composition containing a polyimide precursor and varnish, to thereby form a coating layer 12 a (FIG. 3B); removing the solvent by drying; winding the coating layer; and heating the wound coating layer in a curing furnace for imidization, to thereby form the insulating layer 12 (FIG. 3C). Subsequently, a releasing layer 13 a formed on a transfer film 14 serving as a transfer substrate is brought into firm contact with the surface of the insulating layer 12 opposite to the side of the conductor layer 11 (FIG. 3D) and heated. Then, the transfer film 14 is peeled, thereby forming the laminate film 10A for producing a COF and having a releasing layer 13A (FIG. 3E). Exemplary conditions under which the transfer is performed are, but are not limited to, a heating temperature of 15 to 200� C., a load for rolling or pressing of 5 to 50 kg/cm2, and a treatment time of 0.1 seconds to two hours. Exemplary conditions under which the heating is performed are, but are not limited to, at 50 to 200� C., preferably 100 to 200� C. for one minute to 120 minutes, preferably 30 minutes to 120 minutes. Needless to say, formation of the releasing layer 13A through transfer may be performed after the photolithography step or a similar step. Examples of the material of the transfer film 14 include PET (polyethylene terephthalate), PI (polyimide), and liquid crystal polymers. The thickness of such transfer film 14 is, for example, 15 to 100 μm, preferably 20 to 75 μm.
A variety of commercially available polyimide film substrates; i.e., S'PERFLEX (trade name: product of Sumitomo Metal Mining Co., Ltd.; Example 1a), ESPANEX (trade name: product of Nippon Steel Chemical Co., Ltd.; Example 1b), NEOFLEX (trade name: product of Mitsui Chemicals, Inc.; Example 1c), and UPISEL (trade name: product of Ube Industries, Ltd.; Example 1d) were used to provide laminate films for producing a COF. A conductor layer of each laminate film was patterned by use of a photoresist. The entirety of the resultant pattern was tin-plated, and a silicone series resin (containing a silane compound), SR2411 (trade name: product of Dow Corning Toray Silicone Co., Ltd.), was applied to the backside of the film substrate. The coating was heated at 125� C. for one hour, to thereby form a COF film carrier tape having a releasing layer.
A variety of commercially available polyimide film substrates similar to those employed in Examples 1a to 1d; i.e., S'PERFLEX (trade name: product of Sumitomo Metal Mining Co., Ltd.; Example 2a), ESPANEX (trade name: product of Nippon Steel Chemical Co., Ltd.; Example 2b), NEOFLEX (trade name: product of Mitsui Chemicals, Inc.; Example 2c), and UPISEL (trade name: product of Ube Industries, Ltd.; Example 2d) were used to provide laminate films for producing a COF. A conductor layer of each laminate film was patterned by use of a photoresist. The entirety of the resultant pattern was tin-plated, and a silicone series resin (containing silazane), SEPA-COAT (trade name: product of Shin-Etsu Chemical Co., Ltd.), was applied to the backside of the film substrate. The coating was heated at 125� C. for one hour, to thereby form a COF film carrier tape having a releasing layer.
A variety of commercially available polyimide film substrates similar to those employed in Examples 1a to 1d; i.e., S'PERFLEX (trade name: product of Sumitomo Metal Mining Co., Ltd.; Example 3a), ESPANEX (trade name: product of Nippon Steel Chemical Co., Ltd.; Example 3b), NEOFLEX (trade name: product of Mitsui Chemicals, Inc.; Example 3c), and UPISEL (trade name: product of Ube Industries, Ltd.; Example 3d) were used to provide laminate films for producing a COF. A conductor layer of each laminate film was patterned by use of a photolithographic process, to thereby form a wiring pattern. The entirety of the wiring pattern was tin-plated, and subsequently a silicone series oil, SRX310 (trade name: product of Dow Corning Toray Silicone Co., Ltd.), was applied to the backside of the film substrate. The coating was heated at 125� C. for one hour, to thereby form a COF film carrier tape having a releasing layer.
As is clear from Table 2, the film carrier tapes of Examples 3a to 3c exhibit remarkably high adhesion resistance as compared with those of Comparative Examples 3a to 3c. Although the film carrier tape of Example 3d exhibits an adhesion temperature higher than that of the film carrier tape of Comparative Example 3d, the difference in temperature was comparatively small. However, in view that the temperature at which semiconductor elements are mounted through melt adhesion varies depending on the type of heating tools, the type of semiconductor chips, use of the element-mounted products, etc., and is generally about 200� C. to about 350� C., such a small increase in adhesion temperature would suffice for purposes of the present invention.
The procedure of Example 1a was repeated, except that the timing of application of SEPA-COAT (trade name: product of Shin-Etsu Chemical Co., Ltd.) was varied, to thereby produce COF film carrier tapes. Specifically, the releasing layer was obtained by coating SEPA-COAT to a laminate film for producing a COF, followed by air-drying for three hours or longer (Example 4a); by heating the applied SEPA-COAT at 125� C. for one hour instead of air-drying (Example 4b); by coating SEPA-COAT at a cleaning step performed before patterning of the conductor layer, followed by air-drying for three hours or longer (Example 4c); by heating the thus-applied SEPA-COAT at 125� C. for one hour instead of air-drying (Example 4d); by coating SEPA-COAT after development of a photoresist for patterning the conductor layer, followed by air-drying for three hours or longer (Example 4e); by heating the thus-applied SEPA-COAT at 125� C. for one hour instead of air-drying (Example 4f); by coating SEPA-COAT after patterning of the conductor layer, removal of photoresist, and plating of tin, followed by air-drying for three hours or longer (Example 4g); or by heating the thus-applied SEPA-COAT at 125� C. for one hour instead of air-drying (Example 4h)
In a manner similar to that for producing the film carrier tapes of Examples 4a to 4h, patterning of the conductor layer, removal of photoresist, plating with tin, and application of a silicone series resin were performed, to thereby produce film carrier tapes. Formation of the releasing layer was performed by air-drying three hours or longer or heating for one hour at 125� C. In Examples 5a to 5e, the silicone series resin, SEPA-COAT (trade name: product of Shin-Etsu Chemical Co., Ltd.), was diluted with ethyl acetate at a variety of dilution factors: i.e., 1 (undiluted), 2, 3, 5, and 10 times. In each case, the thickness of the releasing layer was calculated.
Example 6 A polyimide layer (thickness: 40 μm) serving as an insulating layer 12 was formed through the application method on copper foil (thickness: 9 μm) of ultra-minute roughness serving as a conductor 11. On the other surface (opposite to the conductor 11) of the copper foil, a releasing layer 13 (thickness: 0.1 μm) formed of a silicone series compound was provided through the transfer method, thereby yielding a COF film carrier tape of Example 6. After completion of transferring of the releasing layer 13 formed from the silicone series compound, the film carrier tape was heated at 120� C.
Example 4. Test Example 5 The conductor 11 of each of COF film carrier tapes of Examples 6 to 8 and Comparative Example 4 was patterned. A heating tool was pressed against the releasing layer 13 of each film carrier tape. The temperature of the heating tool was varied within a range of 260� C. to 440� C. Under the heating conditions, semiconductor chips were mounted. Adhesion between the releasing layer and the heating tool was observed, and the temperature at which adhesion occurred was determined. The results are shown in Table 5.
As is clear from Table 5, the film carrier tape of Comparative Example 4 adheres to the heating tool when the temperature exceeds 300� C. The film carrier tape of Example 7 exhibits such an excellent adhesion resistance that the tape partially adheres to the heating tool when the temperature exceeds 320� C. The film carrier tapes of Examples 6 and 8 cause no adhesion when the temperature is 400� C. or lower. Although the film carrier tape of Example 7 exhibits an adhesion temperature higher than that of the film carrier tape of Comparative Example 4, the difference in temperature was comparatively small. However, in view that the temperature at which semiconductor elements are mounted through melt adhesion varies depending on the type of heating tools, the type of semiconductor chips, use of the element-mounted products, etc., and is generally about 200� C. to about 350� C. such a small increase in adhesion temperature would suffice for purposes of the present invention.
S'PERFLEX (trade name: product of Sumitomo Metal Mining Co., Ltd.) was employed as a film substrate, and, as a releasing agent, COLCOAT P (trade name: product of Colcoat Co., Ltd., silica sol-containing; Example 9a); COLCOAT N-103X (trade name: product of Colcoat Co., Ltd.; Example 9b); and COLCOAT SP-2014S (trade name: product of Colcoat Co., Ltd., containing silane compound; Example 9c) were used. The entirety of the provided wiring pattern was tin-plated, and subsequently, each releasing agent was applied to the backside of the film substrate. The coating was dried by heating at 120� C. for 60 minutes, to thereby form a COF film carrier tape having a releasing layer.
A heating tool was pressed against the releasing layer 13 of each of COF film carrier tapes produced in Examples 9a to 9c. The temperature of the heating tool was varied within a range of 440� C. to 480� C. Under the heating conditions, semiconductor chips were mounted, to thereby produce a printed circuit board.
Adhesion temperature (� C. )
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Ltd.Flexible circuit boardUS8910640Jan 30, 2013Dec 16, 2014R.J. Reynolds Tobacco CompanyWick suitable for use in an electronic smoking articleUS9277770Mar 14, 2013Mar 8, 2016R. J. Reynolds Tobacco CompanyAtomizer for an aerosol delivery device formed from a continuously extending wire and related input, cartridge, and methodUS20060065956 *Sep 27, 2005Mar 30, 2006Mitsui Mining & Smelting Co., Ltd.COF flexible printed wiring board and method of producing the wiring boardUS20060213684 *Mar 21, 2006Sep 28, 2006Mitsui Mining & Smelting Co., Ltd.Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor deviceUS20090114426 *Oct 9, 2008May 7, 2009Nitto Denko CorporationWired circuit boardUS20100012354 *Jul 13, 2009Jan 21, 2010Logan Brook HedinThermally conductive polymer based printed circuit board* Cited by examinerClassifications U.S. Classification257/678, 257/706, 257/791, 361/749, 257/713, 257/778, 257/703, 257/E23.065, 257/792, 257/668, 257/737International ClassificationH05K3/34, H01L23/02, H05K1/18, H01L23/498, H05K3/28Cooperative ClassificationH01L2924/01078, H05K2203/0195, H01L2924/01079, H05K3/3494, H01L23/4985, H05K2203/066, H01L2224/16, H05K3/28, H05K1/189, H05K2203/1581, H05K2201/10674European ClassificationH05K3/34H, H05K3/28, H01L23/498JLegal EventsDateCodeEventDescriptionJul 9, 2003ASAssignmentOwner name: MITSUI MINING & SMELTING CO., LTD., JAPANFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SAKATA, KEN;HAYASHI, KATSUHIKO;REEL/FRAME:014251/0549Effective date: 20030605Sep 13, 2010REMIMaintenance fee reminder mailedFeb 6, 2011LAPSLapse for failure to pay maintenance feesMar 29, 2011FPExpired due to failure to pay maintenance feeEffective date: 20110206RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services


text: Search results from Civil War Maps, English, Cultural Landscapes, Landowners, Fulton County | Library of Congress

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Aleyna FitzGerald replaces Kendall Jenner at Balmain | Daily Mail Online
Published: 11:53 EST, 28 August 2017 | Updated: 12:35 EST, 28 August 2017
She left high school to pursue a runway career after winning the 10th cycle of Australia's Next Top Model last year.
And the risk has paid off as Aleyna FitzGerald has been named the new face of top fashion house Balmain, knocking former star Kendall Jenner off the perch, reports The Daily Telegraph.
'As you can imagine, it was an incredible honour. It all happened super-quickly too so it was also a surprise,' the 17-year-old told Confidential.
Face first: Aleyna FitzGerald has been named the new face of top fashion house Balmain
Big strides: She is knocking former star Kendall Jenner off the perch, reports The Daily Telegraph
Aleyna walked in Balmain's Paris Fashion Week show in June, writing on Instagram at the time: 'STILL CAN'T BELIEVE THIS HAPPENED!!! Thank you so much'.
'We have to do so much more just to have equality': Nicole... Is this the moment Lee Elliott proposed to Georgia Love? The... 'There might be a girl!' The Block's Wombat reveals that... Overweight mum is left looking UNRECOGNISABLE after losing...
Last month the beauty, who a year ago worked for a construction company in Maitland, NSW, told The Daily Telegraph that her journey from reality TV star to a 'real model' hasn't exactly been smooth sailing.
Aleyna explained how dropping everything she knew to become a professional model was a daunting prospect to begin with.
'It was scary to go from a TV show into the real modelling world,' she confessed.
Aleyna walked in Balmain's Paris Fashion Week show in June, writing on Instagram at the time: 'STILL CAN'T BELIEVE THIS HAPPENED!!! Thank you so much'
'My life is so different from what it was': Only 12 months ago, Aleyna was answering phones in a forklift factory and still attending high school - but now she is a runway superstar
'(It was) so different to anything I had done before.'
Only 12 months ago, the leggy brunette was answering phones in a forklift factory and still attending high school.
Having just finished filming the show this time last year, the teenager described how much her life has changed.
New life: Only 12 months ago, the leggy brunette was answering phones in a forklift factory and still attending high school
Changes: 'One year on, I have been working over in Paris and New York,' she said. 'My life is so different from what it was'
'One year on, I have been working over in Paris and New York,' she said. 'My life is so different from what it was.'
She is signed with Sydney's Priscilla's Model Management and has been working overseas for Saint Laurent, Giambattista Valli, Valentino and Balmain.
Big things: She is signed with Sydney's Priscilla's Model Management and has been working overseas for Saint Laurent, Giambattista Valli, Valentino and Balmain
http://www.dailytelegraph.com.au/entertainment/sydney-confidential/australias-next-top-model-from-cold-calls-to-cat-walk-for-aleyna-fitzgerald/news-story/5e13265dd1f6132f2bc93b8d591c89cf
Aleyna FitzGerald replaces Kendall Jenner at Balmain

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Buffy Godfrey Condolences | Milwaukee Journal Sentinel
Thank you for signing the Guest Book for Buffy Godfrey.
Please take a moment to sign the Guest Book for Buffy Godfrey.
I was so sorry to hear that your Mom had passed onto the next life. We had many good times at Federated/Coldwell Banker.I always enjoyed her sense of humor and very caring ways. She will be missed by many. Mary McNamer(Hume)
Mary McNamer, Hot Springs Village, AR
We are sending our deepest sympathy. You are in our thoughts and prayers, and we hope you feel God's comfort and love.
Thom and Shari Brown
Thom & Shari Brown, Largo, FL
Our deepest sympathies to you Bill and your family. Rose and I will keep you in our thoughts and prayers.
Chuck & Rose Scaffidi, Dunbar, WI
Our deepest sympathy. Please know our prayers and thoughts are with you. She was blessed to have such a loving family. She will be missed.
Send me a daily email when updates are made to the obituary or Condolence page for Buffy Godfrey.

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Photo Gallery I: Gold - Blue GameKevin Kinder04/20/2013Photos from West Virginia's 2013 Gold-Blue spring football game
Head coach Dana Holgorsen (right) leads WVU Children's Hospital patients and families onto the field
Connor Arlia (left) took home both our Tommy Nickolich Memorial Award and an Iron Mountaineer Award
Tyler Orlosky (65) sets up to block Christian Brown (95)
K.J. Dillon (9) stops Kevin White (right) in his tracks
Under the watchful eye of Dana Holgorsen (left) Paul Millard (14) pitches the ball to Vernon Davis on a sweep
Nick Kwiatkoski (middle) brings down Wendell Smallwood (gold)
K.J. Dillon (left) knocks a pass away from Kevin White
K.J. Myers (19) tries to avoid the tackle of Shaq Petteway
Kevin White (11) highsteps into the end zone
Jordan Thompson (10) grabs a touchdown pass
All photos copyright BlueGoldNews.com Share on Facebook Share on TwitterTrending on ScoutWhat A Rush: Shell, Seider Talk WVU Run GameAwesome New Membership Benefit!WVU More Than Just ImpressiveDurante Catch Highlights WVU Receiving DayPhoto Gallery II: WVU - TCUShare & EmbedGibson Details WVU Defensive Showing vs. TCU Full StoryBlueGoldNews Top StoriesHoward's Scoring Strikes Help Power WVUMORGANTOWN, W. Va. - For the third time in this calendar year, Skyler Howard threw at least four touchdown passes to lead West Virginia to victory.by Kevin KinderBlueGoldNewsYesterday at 2:33 PMGibson Details WVU Defensive Showing vs. TCUMORGANTOWN, W.Va. - For the third week in a row West Virginia took on a Big 12 foe and held its opposition to 17 points or under. Tony Gibson, the Mountaineers defensive…by Brian McCrackenBlueGoldNewsYesterday at 6:32 AMPhoto Gallery II: WVU - TCUMORGANTOWN, W. Va -- Our unique, exclusive photos from West Virginia's 34-10 Big 12 football win over TCU.by Kevin KinderBlueGoldNewsYesterday at 6:00 AMDurante Catch Highlights WVU Receiving DayMORGANTOWN, W. Va. - West Virginia receivers had several outstanding catches in its 34-10 win over TCU on Saturday, but none were more spectacular than the grab Jovon Durante made.by BlueGoldNews.comBlueGoldNewsYesterday at 4:16 AMPhoto Gallery I: WVU - TCUMORGANTOWN, W. Va -- Our exclusive look at West Virginia's 34-10 throttling of TCU in Big 12 football actionby Kevin KinderBlueGoldNewsSaturday at 4:00 PMWVU More Than Just ImpressiveMORGANTOWN, W.Va. - Characterizing West Virginia's performance as impressive is an understatement.by Matt KellerBlueGoldNewsSaturday at 3:54 PMWhat A Rush: Shell, Seider Talk WVU Run GameMORGANTOWN, W.Va. - Rushel Shell has always been the epitome of a workhorse.by Matt KellerBlueGoldNewsSaturday at 12:02 PMGame Notes: WVU vs. TCUMORGANTOWN, W.Va. - Another strong performance from Tony Gibson's defense and the best performance of the year by WVU's special teams fueled Saturday's 34-10 win.by Brian McCrackenBlueGoldNewsSaturday at 8:14 AMHolgorsen Details WVU's 34-10 Drubbing of TCUMORGANTOWN, W.Va. - After his team dismantled one of the top offensive teams in the country for the second week in a row, West Virginia head coach Dana Holgorsen called the victory…by Brian McCrackenBlueGoldNewsSaturday at 8:12 AMWVU Defense Staying Focused On Task at HandMORGANTOWN, W.Va. - After making a statement and shutting down the country's No.1 offense, people are starting to take note of West Virginia's ever-improving, rebuilt defense. But…by Brian McCrackenBlueGoldNewsSaturday at 12:42 AMWVU 2017 Football Verbal Commit Update Oct 21Checking in on Thursday and Friday night's action involving West Virginia's 2017 football verbal commitmentsby Kevin KinderBlueGoldNewsSaturday at 12:54 AMBig 12 2016 Football Previews - Week EightTwo ranked teams look to protect their standing in a Saturday of Big 12 action that won’t draw a lot of buzz – unless either of those teams is upset.by BlueGoldNews.comBlueGoldNewsFriday at 10:40 AMLoad More

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One Hundred Monkeys by Cutler, Daniel Solomon / Marsha Winborn (illustrator): Simon & Schuster Books for Young Readers c.1991 9780671735647 Hardcover, 1st Edition - AbeBooks.com
Home Cutler, Daniel Solomon / Marsha Winborn (illustrator) One Hundred Monkeys
Cutler, Daniel Solomon / Marsha Winborn (illustrator)
Published by Simon & Schuster Books for Young Readers c.1991
ISBN 10: 0671735640 / ISBN 13: 9780671735647
First printing. Picorial hardcover. DJ in new mylar. 8 1/4 x 10 1/4. Unpaginated. Illustrated in color. One-inch closed tear on back panel of DJ. Fine/Near fine. Bookseller Inventory #
Synopsis: A young boy describes his adventures with the one hundred monkeys that live near his house.
From School Library Journal: PreSchool-- This fantasy lacks logic and cohesion. A little boy imagines that 100 wild and naughty monkeys live in a Pee-Wee Herman-esque house near him. He finds their troublemaking fascinating and joins them for mischievous play, eating, and merrymaking (much to his mother's dismay). He attends monkey school where the teacher notices he's not a monkey and banishes him with the help of two hefty apes. On his way home, the boy overhears his mother and grandmother talking and tricks his mother into making him pies and cakes to lure him home. Both text and watercolor-and-pen illustrations convey a jangling air of unreality. The plot is thin and overlong. The illustrations, although bright, make the monkeys appear slightly grotesque, adding to the unsettling look of this madcap adventure. Held up against the classic "wild child" story, Sendak's Where the Wild Things Are (HarperCollins, 1988), this book appears wordy and garish. For monkeyshines with more universal child appeal, nothing outshines Curious George (Houghton). --Marge Loch-Wouters, Menasha Public Library, WI
Title: One Hundred Monkeys
Publisher: Simon & Schuster Books for Young Readers c.1991
1. One Hundred Monkeys
ISBN 10: 0671735640 ISBN 13: 9780671735647
Book Description Simon & Schuster Children's Publishing. Hardcover. Condition: GOOD. Spine creases, wear to binding and pages from reading. May contain limited notes, underlining or highlighting that does affect the text. Possible ex library copy, thatâ€™ll have the markings and stickers associated from the library. Accessories such as CD, codes, toys, may not be included. Seller Inventory # 2808730831
2. One Hundred Monkeys
Book Description Simon & Schuster Children's Publishing. Hardcover. Condition: GOOD. Spine creases, wear to binding and pages from reading. May contain limited notes, underlining or highlighting that does affect the text. Possible ex library copy, thatâ€™ll have the markings and stickers associated from the library. Accessories such as CD, codes, toys, may not be included. Seller Inventory # 2895485253
3. One Hundred Monkeys
Book Description Simon & Schuster Children's Publishing. Condition: Very Good. . Good dust jacket. Seller Inventory # L05H-00194
4. One Hundred Monkeys
Book Description Simon & Schuster Children's Publishing. Hardcover. Condition: Good. 0671735640 Ex-library book with usual markings. Good Condition. Five star seller - Buy with confidence!. Seller Inventory # Z0671735640Z3
5. One Hundred Monkeys
Book Description Simon & Schuster Children's Publishing, 1991. Hardcover. Condition: Good. 0671735640 Cutler, Daniel Solomon. One Hundred Monkeys. Winborn (illustrator), Marsha. New York: Simon & Schuster, 1991. Illustrated. 4to. Hardcover. Book condition: Good with gently bumped edges, pen scribbles to rear cover, front endsheets,and one page, and a two inch tear in foot of another page. Seller Inventory # UCUTONE00MEL
6. One Hundred Monkeys
Book Description Simon & Schuster Children's Publishing, 1991. Hardcover. Condition: Used: Good. Seller Inventory # SONG0671735640
7. One Hundred Monkeys
Cutler, Daniel Solomon
Published by Cutler, Daniel Solomon., Simon & Schuster, nd, c1991, (1991)
Book Description Cutler, Daniel Solomon., Simon & Schuster, nd, c1991, 1991. Winborn, Martha (illustrator). 1st Edition, illus. boards, illus. end papers, name on obverse of ffep o/w fine w/dj, unpaginated, color illus. by Martha Winborn, Sm 4to, $37.50. Seller Inventory # 313311
8. One Hundred Monkeys
Book Description Simon & Schuster Children's Pu, 1991. Hardcover. Condition: New. Never used!. Seller Inventory # P110671735640
9. One Hundred Monkeys
Book Description Simon & Schuster Children's Publishing, 1991. Hardcover. Condition: Good. Ex-library. Ships with Tracking Number! INTERNATIONAL WORLDWIDE Shipping available. May not contain Access Codes or Supplements. May be ex-library. Shipping & Handling by region. Buy with confidence, excellent customer service!. Seller Inventory # 0671735640
10. One Hundred Monkeys
Book Description Simon & Schuster Children's Publishing, 1991. Condition: New. book. Seller Inventory # M0671735640

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Spell Decks - Mysteries of the Arcane (d20 Supplements (Paradigm Concepts)): Paradigm Concepts 9781931374095 - Noble Knight Games
Home Spell Decks - Mysteries of the Arcane (d20 Supplements (Paradigm...
Spell Decks - Mysteries of the Arcane (d20 Supplements (Paradigm Concepts))
ISBN 10: 1931374090 / ISBN 13: 9781931374095
Published by Paradigm Concepts, 1999
Paradigm Concepts d20 Supplements (Paradigm Concepts) Spell Decks - Mysteries of the Arcane (SW (MINT/New)) Manufacturer: Paradigm Concepts Product Line: d20 Supplements (Paradigm Concepts) Type: Box Set Code: S2PPCI1301 Copyright Date: 2002 Please review the condition and any condition notes for the exact condition of this item. All pictures are stock photos. The condition of the item you will receive is SW (MINT/New). Our grading system is explained in the terms of sale section of our bookseller page. Please feel free to contact us with any questions. Product Description: Tired of flipping through large books every time you want to cast a spell? Can't remember the range, duration or Save off the top of your head? Well help is on the way! Make your life easier and speed up game play as you place all your spells at your fingertips with Spell Decks! Now your storehouse of magical power will fit right in the palm of your hand with these easy to use, convenient spell cards. Each card contains the pertinent rules and description of a different Spellcaster's arsenal from the Player's Handbook, Psionic's Handbook and Codex Arcanis, over 300 in all!. Bookseller Inventory # 2148266530
Title: Spell Decks - Mysteries of the Arcane (d20 ...


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