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Janice Chef Joey make your experience one of a... - Review of Brandywine River Hotel - TripAdvisor
Hotels near Brandywine River Hotel
“Brandywine River Hotel”
“Parking was adequate, the afternoon tea and...”
“There are several restaurants nearer to the...”
“The room was well cleaned and the breakfast was...”
“Near to some nice winery's and of course the...”
“Close to the Brandywine battleground, and just a...”
“Hotel has definitely had its day”
“Two excellent restaurants and some interesting...”
“While it is fairly modern, it lacks in room...”
“There is no in-room coffee service, though I had...”
Janice Chef Joey make your experience one of a... - Review of Brandywine River Hotel
“A superior splendid outstanding breakfast staff, oh yes and hotel”
A superior splendid outstanding breakfast staff, oh yes and hotel
Ask patty m about Brandywine River Hotel
All reviews longwood gardens cookies prime restaurant quaint hotel jacuzzi tub hard boiled eggs wyeth museum gas fireplace hank's place waffle iron continental breakfast waffles bit dated nice breakfast very nice place to stay large bathroom kennett square
315 - 321 of 395 reviews
Lovely little hotel — shambolic breakfast
Breakfast was included, but it was like being on a treasure hunt. Hopefully this was a bad week and not the norm. There was one waffle-maker and a shelf with a few bagels and some cake. The bagels ran out very quickly so waffles were the only choice; hence a long line-up for everyone to wait to make waffles on one very slow wafflemaker. But then, no cutlery. No napkins.
No coffee cups - finally some paper ones appeared. The pot was almost empty. Cream and sugar? Of course - across the room next to the cereal.
Through all of this the staff, who seemed to be the desk staff, wandered about telling everyone that the cups, cutlery etc was 'in the dishwasher'. No more bagels or toast appeared. The coffee pot was refilled. Boiled eggs one morning, but not the next.
You might want to go down the road to the diner.
Ask Carol A about Brandywine River Hotel
Disappointed...Used to be our FAVORITE : (
First of all, the place needs an update. The furniture, bedspreads, carpets are old and shabby. The wi-fi is so bad in the rooms it may as well not exist. The afternoon tea that used to be so much of the hotel's charm no longer offers the anisette cookies that made it extra-special. The fish tank in the hall which used to be so lovely is now dirty with 2 fish, one of which looked like it was about to die. And when we tried to order room service the restaurant informed us that the menu we were ordering from (even though it clearly said "brandywine prime") was for the bistro, which closed MONTHS ago
But the worst part was the lack of service. Like all hotels, there are cards in the bathroom that explain that to help the environment they will only replace towels that are left on the floor. We didn't need new towels so we left ours on the sink and shower handle. To our shock they not only weren't hung back up...they weren't even folded! In fact, I don't think the maid even entered the bathroom! And speaking of the shower......scalding hot....icy cold....scalding hot.....icy cold. Back and forth for the entire 3 minutes I could endure before getting out with shampoo in my hair to rinse it in the sink. Finally, there was breakfast. It's always been continental but it used to be just great, with cereals, fresh fruit, hot coffee, and home made waffles. Not anymore, apparently. When we came down for breakfast 40 MINUTES before it was supposed to end, there was NO coffee, NO waffle mix, and NO fruit. When we asked the front desk about coffee and waffles the girl said, I can definitely get more coffee; not sure about the waffles". To her credit she managed to find both but the "bad taste" was already in our mouths!
It really hurts me to give this place a review like this....7 or 8 years ago I couldn't stop raving about it on this same site! I hope they get it together and fix their problems because someday I would love to return to th OLD Brandywine River Hotel!
Ask remrah about Brandywine River Hotel
2 Thank remrah
Ask lakecleelum about Brandywine River Hotel
Room Tip: Hotel is L shaped. Ask for outside of L. Inside all face parking lot.
Ask georgeandjeannie about Brandywine River Hotel
1 Thank georgeandjeannie
We chose this hotel because of the positive reviews and we were not disappointed. It is located across the street from the Brandywine River Museum, hence very convenient. The hotel was very clean and had a more personal touch than many chain hotels can offer. Service was "over the top" friendly and helpful. The breakfast room was roomy with variety of options. We would definitely stay again.
Ask rosemarym481 about Brandywine River Hotel
1 Thank rosemarym481
Charming hotel in a pastoral setting
This charming quaint hotel is set back in a peaceful pastoral setting and has the ambiance of a quiet country inn. I spent eight nights in a lovely room that was so nice to return to after a day of work. Each morning they offer an adequate breakfast selection and fresh baked cookies every afternoon. If you're hungry, I recommend Hanks which is within walking distance.
The receptionists could be friendlier and more personable.
This was my third visit and I plan to return.
Room Tip: I like the rooms that overlook the hillside in the back of the hotel.
Ask mec534 about Brandywine River Hotel
Thank mec534
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Booking.com: Hotels near Coneysthorpe. Book your hotel now!
Coneysthorpe: 760 properties found
Browse the results for Coneysthorpe
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Malton – Show on map
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(7 miles from Coneysthorpe)
Ivy Cottage is a vacation home is located in Flaxton in North Yorkshire and and is 7 miles from York. It provides free private parking. A TV is featured.
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Excellent 685 reviews 8.8 Opens in new window Opens in new window
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(4.2 miles from Coneysthorpe)
Highfield Barn is a vacation home is located in Hovingham in North Yorkshire and and is 13 miles from York. The property is 24 miles from Harrogate and free private parking is available.
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Pine Lodge is a vacation home located in Wilberfoss just 9 miles from York. It provides free private parking. A TV and DVD player are featured.
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(8.6 miles from Coneysthorpe)
(11.2 miles from Coneysthorpe)
This hotel is ideally located in a serene and peaceful setting in York, just 2.5 miles from the center of the city with free parking and free breakfast.
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471297,475637,465657,480777,418135,463407,483537,475337,338860|1,462617,490307,484527,458617,483677,483907,478767,476327,467767,447047,485127,488937,485177,488307,476407,473607|1,446757,467577,487687,475637|1,481507,469127,453837,439667,461337,487047|1,479057,481557,484207,485467,479747,467827,482367,487267,481917,487047,465277,459697,477327,483477|2,446757|1,486217,475687,478567,479147,338860,474797,470107,484157,419952,486207,483477|1,472457,348514,471187,485737,471517,415995,471317,473357

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Customer Service Loan Representative Jobs, Employment in Davenport, IA
Customer Service Loan Representative jobs in Davenport, IA
Customer Service Loan Representative jobs nationwide
AMERICAN BANK & TRUST (3)
World Acceptance Corporation (2)
J.D. Byrider (1)
Have the backing of a Service Department that ensures customer satisfaction to allow for continued installment loan payments....
Contacting customers regarding their loan status. World Acceptance Corporation is a consumer lending company that offers loans, credit insurance products,...
View all J.D. Byrider jobs in Davenport, IA - Davenport jobsSalary Search: Collection Representative salaries in Davenport, IALearn more about working at J.d. ByriderAutomotive Technician review: "Good. Repair cars from the auction to get ready for sale and repair customers vehicle as needed. Everyday is a learning experience. Good management, and we were a team...."Related forums: Davenport, Iowa - Collections Representative
Customer Support Representative - Phone
Analyzes customer inquiries; To ensure continued career development, customer service representatives are offered job level progression and compensation...
View all Royal Neighbors of America jobs in Rock Island, IL - Rock Island jobsSalary Search: Customer Support Representative salaries in Rock Island, ILLearn more about working at Royal Neighbors of AmericaMid-Level Manager review: "This is a good place to work. I have worked here for 5 years and have experience working in other industries. This is a good place to work. My work is challenging and I am..."Related forums: royal neighbors of america - Rock Island, Illinois
View all World Acceptance Corporation jobs in Moline, IL - Moline jobsSalary Search: Branch Service Representative salaries in Moline, ILLearn more about working at World Acceptance CorporationRelated forums: Moline, Illinois - World Acceptance Corporation
View all Cash Store jobs in Moline, IL - Moline jobsSalary Search: Assistant Store Manager salaries in Moline, ILLearn more about working at Cash StoreStore Manager review: "Fired for no reason. Don't get too comfy. They will work you until you might get your life back with vacation or a pay raise. Management comes and goes. Was promoted then fired..."Related forums: Cash Store - Assistant Store Manager - Moline, Illinois
Ability to communicate abstract and concrete concepts to individuals I both written and oral form always remembering the philosophy of customer service....
View all Brown Mackie College jobs in Bettendorf, IA - Bettendorf jobsSalary Search: Learning Support Specialist salaries in Bettendorf, IALearn more about working at Brown Mackie CollegeStudent Accounting Advisor review: "Fun place to work. A good foot in the door company. The work life balance was great. The job was not very challenging. I would tell someone out of school to work..."Related forums: Bettendorf, Iowa - Brown Mackie College
Works with the Mortgage Loan Assistants as necessary to prepare and/or gather all loan documents necessary for closing....
View all Great Southern Bank jobs in Davenport, IA - Davenport jobsSalary Search: Residential Lender salaries in Davenport, IALearn more about working at Great Southern BankPart Time Bank Teller review: "Productive and fun work place. Working for Great Southern Bank has been a great experience. The working environment is great and the management is wonderful. All of the..."Related forums: Davenport, Iowa - Great Southern Bank
Contact customers for any other documents necessary to close their loans and to work through any irregularities within their loan file....
View all AMERICAN BANK & TRUST jobs in Rock Island, IL - Rock Island jobsSalary Search: Mortgage Loan Processor salaries in Rock Island, ILLearn more about working at American Bank & TrustNew Accounts Representative review: "Fabulous place to work!. Couldn't wait to get to work each morning. The best management team! Wonderful coworkers, everything was upbeat. We would all meet after..."Related forums: Rock Island, Illinois - AMERICAN BANK & TRUST - Mortgage Loan Processor
Teller / Personal Banker
Demonstrate excellent customer service by achieving both customer satisfaction and retention. Minimum 2 year face-to-face customer service required....
View all AMERICAN BANK & TRUST jobs in Moline, IL - Moline jobsSalary Search: Teller salaries in Moline, ILLearn more about working at American Bank & TrustNew Accounts Representative review: "Fabulous place to work!. Couldn't wait to get to work each morning. The best management team! Wonderful coworkers, everything was upbeat. We would all meet after..."Related forums: AMERICAN BANK & TRUST - Moline, Illinois
Conduct credit investigations and analyze financial statements for new and existing customers, regularly communicate with loan officers, and assist in the...
View all AMERICAN BANK & TRUST jobs in Davenport, IA - Davenport jobsSalary Search: Credit Analyst salaries in Davenport, IALearn more about working at American Bank & TrustNew Accounts Representative review: "Fabulous place to work!. Couldn't wait to get to work each morning. The best management team! Wonderful coworkers, everything was upbeat. We would all meet after..."Related forums: AMERICAN BANK & TRUST - Credit Analyst - Davenport, Iowa
Get email updates for the latest Customer Service Loan Representative jobs in Davenport, IA
Customer Service Representative salaries in Davenport, IA$11.91 per hour$23,829 per year$1,986 per month$477 per week$95.32 per day1.5% lower than national average$9.21$15.41CommonEstimated salary from 110 employees and 461 jobs

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The David Suzuki Reader by David Suzuki | 9781553650225 | Paperback | Barnes & Noble®
by David Suzuki, Bill McKibbenDavid Suzuki
ISBN-10: 1553650220
ISBN-13: 9781553650225
David Suzuki’s collected writings on science, nature, technology, economics, politics, and the connectedness of all things.The David Suzuki Reader brings together for the first time the scientific and philosophical thought of North America’s leading environmentalist.Drawing from Suzuki’s published and unpublished writings, this collection
David Suzuki’s collected writings on science, nature, technology, economics, politics, and the connectedness of all things.The David Suzuki Reader brings together for the first time the scientific and philosophical thought of North America’s leading environmentalist.Drawing from Suzuki’s published and unpublished writings, this collection reveals the underlying themes that have informed his work for over four decades. In these incisive and provocative essays, Suzuki explores the limits of knowledge and the connectedness of all things; looks unflinchingly at the destructive forces of globalization, political shortsightedness, and greed; cautions against blind faith in science, technology, politics, and economics; and provides inspiring examples of how and where to make those changes that will matter to all of us and to future generations. He also offers a vision of hope based on our love of children and nature.In this time of global unrest and uncertainty, Suzuki provides an important reminder of how we are all connected and of what really matters. Written with clarity, passion, and wisdom, this book is essential reading for anyone who is an admirer of David Suzuki, who wants to understand what science can and can’t do, or who wants to make a difference.
9781553650225
David Suzuki Children's Titles Series
ForewordixPrefacexiiInterconnections1Catching an Epiphany3What Can I Do?10Arrival of an Alien12London in My Life14Galapagos18Human Borders and Nature21There's a Lot to Learn27Elephants of the Sea31The Thrill of Seeing Ants for What They Are34The Case for Keeping Wild Tigers37How Little We Know40The Power of Diversity45Owning Up to Our Ignorance48A Walk in a Rain Forest51Megadams57Global Warming60Why We Must Act on Global Warming66Ecological Footprints70A Boost for Biodiversity75Learning from Nature78Near the End of Life84Learning to Slow Down87Economics and Politics89The Hubris of Global Economics91The Ecosystem as Capital94Ecologists and Economists Unite!98Economic Fallacy101A Progress Indicator That's Real104Endless Growth--An Impossible Dream107Three Economists112Economics and the Third World119Consumption as a Deliberate Goal123Assigning a Value to Nature125Toward More National Economies128The Wall Street Journal's Insane Criteria132Following a Different Path135The True Price of a Tree138Plundering the Seas141Shifting Political Perspectives145Lessons from Humanity's Birthplace149True Wealth152Science, Technology, and Information155Science and Technology Are Still in Their Infancy157Biotechnology: A Geneticist's Personal Perspective160It Always Costs181The Illusory Oil Change184Nuclear Menus (Or, Eating in the Nuclear Age)187The Prostitution of Academia190Live by the Box, Perish by the Box195A Humbling Message of Ants and Men198Infoglut and Its Consequences204Misusing Language209The Really Real212Television's Real Message219Virtual Reality225The Hidden Messages227Are These Two Reporters on the Same Planet?232Why a Warmer World Won't Be a Better World236Science and Ethics239Genetics after Auschwitz241The Final Dance on Racism's Grave253Through Different Eyes256The Temptation to Tamper259The Pain of Animals262Are There No Limits?269A Biocentric View275Why the Bravest Position Is Biocentrism277Borrowing from Children280Making Waves290Teaching the Wrong Lessons293Losing Interest in Science296A Buddhist Way to Teach Kids Ecology301The System and the Ecosystem304Why Sterile School Yards Are a Waste306The Invisible Civilization309Haida Gwaii and My Home314Reflections While Backpacking317Leaders, Role Models, and Success Stories319The New Leaders321Village Power Wins Victories in India324A Heroic Shepherd327Grass-Roots Groups330A Woman in Science335Young People338Monteverde and Children341Child Power344Germany--An Inspiring Example351Water and a Canadian Scientist354One Logger and His Forest357Philosopher-King360A New Kind of Political Leader363Fisheries That Flourish367One Farmer Really Close to the Soil371Epilogue376References378Index383Credits387

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DST Paddle on the Hooch - ATL SUP - Atlanta Stand Up Paddle (Atlanta, GA)
DST Paddle on the Hooch
Lets have a fun paddle to celebrate the longer days. Meeting at Morgan Falls on Sunday March 9th for a leisurely paddle. All levels welcome. Come Meet your fellow SUPers. After we get off the water, grab drinks and a bite to eat ... location TBD
Jeff N. PICTURES ON FB AT SUPERTIMEATLANTA 0 · March 9, 2014 Franz H. Hey, any reason why this meetup is so late in the afternoon? 0 · March 7, 2014 Heather F. It's Daylight Savings Time ... It's really more like 2:30 so letting the temps get warmed up. We have daylight later so taking advantage of it. 0 · March 8, 2014 Adriane I. Looking forward to it. 0 · March 7, 2014 Brad Is there a place to rent by the water? I don't have a rack or trailer for a huge paddleboard. Any suggestions? 0 · February 24, 2014 Heather F. Check out High Country Outfitters ... I'm not sure if they are doing their rentals yet but they usually deliver boards when they start rental season. 0 · February 24, 2014 Jeff N. Let me know and I can bring a rental 0 · March 7, 2014 Jeff N. Hey, I have 5 BIC 11' 6" boards that I could bring and rent out for this if anybody is interested but I don't want to step on anybody's toes if someone is already lined up to do this and I don't want to interfere with an organizer but if I can be of help Mr. Organizer, please let me know. 0 · March 6, 2014 John h. Please organize more of these on the hooch. Unfortunately I will be travelling this Sunday 1 · March 4, 2014 Eric I. Sorry, wish I could. Enjoy 0 · March 4, 2014 A former member don't have a board yet, still relatively new to the sport. are there rentals nearby or an available one to use within the group? 0 · March 4, 2014 Phyllis Ok what do you guys wear when paddling when water is frigid cold? I can almost guarantee I will fall in at some point! 0 · February 25, 2014 View all 4 replies
Thomas P. I cant speak for everyone but in the many years I have paddled various vehicles i have found I like a pair of neoprene pants and a neoprene vest with fleece layers on top of the vest. This keeps me warm without overheating and drains out quickly if wet. i must also say that I draw a line about 40deg or so and I don't paddle below that. 0 · February 26, 2014 Heather F. I wear running clothes (usually dryfit) ... neoprene can get pretty warm depending on how hard you are paddling. When it's expected to be really cold or windy, I usually throw on some nylon pants and a water resistant jacket over my typical running clothes. Booties with wool socks have done a great job helping me to keep feeling in my toes. Take it easy and have the confidence that you aren't going for a swim, the river is usually pretty calm even if there is a current :) 0 · February 28, 2014 Thomas P. Wow, thanks for making me look like a wus! :-) 0 · February 28, 2014 Heather F. no intention of making you look like a wus! just pointing out that there are other options and falling in when temps are not completely ideal is not inveitable ;-) 0 · February 28, 2014 Thomas P. Ill be there. 1 · February 24, 2014 17 went
Adriane I.
Matthew "Kai Nalu" A.
1,486 No-more-homebodies
1,705 Geek Friends
650 Skiers and Snowboarders

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The Saccharomyces cerevisiae Set1 complex includes an... [EMBO J. 2001] - PubMed - NCBI
Display Settings:AbstractFormatSummarySummary (text)AbstractAbstract (text)MEDLINEXMLPMID ListApplySend to:Choose DestinationFileClipboardCollectionsE-mailOrderMy BibliographyCitation managerFormatSummary (text)Abstract (text)MEDLINEXMLPMID ListCSVCreate File1 selected item: 11742990FormatSummarySummary (text)AbstractAbstract (text)MEDLINEXMLPMID ListMeSH and Other DataE-mailSubjectAdditional textE-mail"SPAM" filtering software noticeAdd to ClipboardAdd to CollectionsOrder articlesAdd to My BibliographyGenerate a file for use with external citation management software.Create File
EMBO J. 2001 Dec 17;20(24):7137-48.The Saccharomyces cerevisiae Set1 complex includes an Ash2 homologue and methylates histone 3 lysine 4.Roguev A, Schaft D, Shevchenko A, Pijnappel WW, Wilm M, Aasland R, Stewart AF.SourceEMBL, Meyerhofstrasse 1, D-69117 Heidelberg, Germany.AbstractThe SET domain proteins, SUV39 and G9a have recently been shown to be histone methyltransferases specific for lysines 9 and 27 (G9a only) of histone 3 (H3). The SET domains of the Saccharomyces cerevisiae Set1 and Drosophila trithorax proteins are closely related to each other but distinct from SUV39 and G9a. We characterized the complex associated with Set1 and Set1C and found that it is comprised of eight members, one of which, Bre2, is homologous to the trithorax-group (trxG) protein, Ash2. Set1C requires Set1 for complex integrity and mutation of Set1 and Set1C components shortens telomeres. One Set1C member, Swd2/Cpf10 is also present in cleavage polyadenylation factor (CPF). Set1C methylates lysine 4 of H3, thus adding a new specificity and a new subclass of SET domain proteins known to methyltransferases. Since methylation of H3 lysine 4 is widespread in eukaryotes, we screened the databases and found other Set1 homologues. We propose that eukaryotic Set1Cs are H3 lysine 4 methyltransferases and are related to trxG action through association with Ash2 homologues.PMID: 11742990 [PubMed - indexed for MEDLINE] PMCID: PMC125774 Free PMC ArticleImages from this publication.See all images (7)Free textFig. 1. The composition of the Set1 complex. The affinity-purified Set1-TAP complex was separated on 7–25% SDS–PAGE and visualized by staining with Coomassie Blue. Molecular weight markers indicated on the left in kilodaltons. All bands present in this gel were identified and those subsequently determined to be specific to Set1C by repetition and further affinity purification exercises are depicted to the right. Each protein is depicted with identifiable protein domains and motifs as indicated in the key below. The thickened grey lines in Set1 and Spp1 indicate regions of further conservation to S.pombe proteins, Set1 and SPBC13G1.08c, respectively and the thickened grey line in Bre2 indicates the extent of further homology to Ash2 either side of the SPRY domain (see Figure 3C). The length of each polypeptide (aa) is noted on the right. The domains indicated are: PHD finger (Pfam:PF00628); n-SET (N-terminal SET associated domain in SET1 family; see Figure 3A); SET domain (Pfam:PF00856); postSET, C-terminal SET-associated peptide (SMART:00508); WD domain (Pfam:PF00400); RIIa, protein kinase A regulatory subunit dimerization domain (Pfam:PF02197); RRM, RNA recognition motif (Pfam:PF00076) and SPRY, domain in SPlA kinase and the ryanodine receptor (Pfam:PF00622). The SPRY domain in Bre2 is interrupted by three insertions (see Figure 3C). WD40 domains showing significant alignment scores are shown in light green, inferred alignments in white (data not shown).The Saccharomyces cerevisiae Set1 complex includes an Ash2 homologue and methylates histone 3 lysine 4EMBO J. 2001 December 17;20(24):7137-7148.Fig. 2. Sequential affinity purification of Set1C. Each of the other seven members of Set1C was TAP-tagged and the purified complexes visualized by Coomassie Blue staining as indicated above each panel. The identity of each protein was established by mass spectroscopy and is indicated by numbers (see key to the right). Many unlabelled bands were also identified and were found to be highly abundant proteins (see Material and methods). The presence of the tag, after TEV cleavage, increases the size of the tagged protein by ∼10 kDa.The Saccharomyces cerevisiae Set1 complex includes an Ash2 homologue and methylates histone 3 lysine 4EMBO J. 2001 December 17;20(24):7137-7148.Fig. 3. Sequence analyses of the Set1C. (A) Multiple sequence alignment of Set1 family members showing the RRM region (upper) and n-SET/SET/postSET region (lower). The alignment is colour coded in order to highlight the conserved features according to Gibson et al. (1994). The amino acid co-ordinates in each sequence are indicated after each of the two sequence blocks. The RRM domain (also called RNP) is highlighted with an orange bar. Four RRMs from human U2AF and RNPA are included for comparison. Assignment of secondary structure elements (H, helix; E, strand) is based on the known RRM structure (Burd and Dreyfuss, 1994). Below, the n-SET region is denoted by a light green bar, the SET domain by a dark green bar and the postSET motif by a yellow bar. The conserved residues characteristic for the methyltransferase catalytic core of the SET domain (Rea et al., 2000) are indicated with red dots. The position of stop codons is indicated by ‘<’. (B) Multiple alignments of selected preSET regions are shown. At the top, the preSET regions found in SUV39 and G9a families, termed preSET-s, is shown. At the bottom, the preSET region found in E(Z) and ASH1 families, preSET-e, is shown. (C) Multiple alignment of the SPRY region of Bre2 with the Ash2 family. The region of homology shown extends further N- and C-terminally than the defined SPRY domain, which, in this alignment, starts at residue 61 and ends at 283. Three insertions in Bre2 of 32, 46 and 42 residues are indicated. (D) Multiple alignment of a region in Sdc1 with Dpy30 and other sequences, including four human protein kinase A factors for reference. This region contains a motif that is related to the dimerization domain (here called RIIa) of protein kinase A regulatory subunits. The position of two α-helices in the RIIa structure (pdb:1r2a) is shown. The database sources of all proteins used in this figure and elsewhere in this paper are given in Table II.The Saccharomyces cerevisiae Set1 complex includes an Ash2 homologue and methylates histone 3 lysine 4EMBO J. 2001 December 17;20(24):7137-7148.Fig. 4. Dissection of interactions within Set1C. The structure of Set1C was examined in set1 strains carrying TAP-tagged Set1C members, as indicated above each panel, by affinity purification. All protein identities, including many unlabelled unspecific bands were established by mass spectroscopy. Numbers are the same as in Figure 2 and are 2, Bre2; 3, Swd1; 4, Spp1; 6, Swd3; 7, Sdc1; 8, Shg1.The Saccharomyces cerevisiae Set1 complex includes an Ash2 homologue and methylates histone 3 lysine 4EMBO J. 2001 December 17;20(24):7137-7148.Fig. 5. Set1C specifically methylates lysine 4 of H3. Histone methyltransferase activity was assayed by incubation of an H3 tail peptide (A) or free histones (B), with affinity purified extracts prepared from yeast strains carrying the TAP tag fused to Clr4 or Set1C components as indicated above each lane. The extracts were prepared from either wild-type or set1 strains as indicated. The TAP-Clr4 extract was prepared from the wild-type strain carrying a TAP-Clr4 CEN plasmid. (A) Extracts were incubated with an H3 N-terminal peptide in the presence of S-adenosyl-L-[methyl-3H]methionine and incorporated radioactivity determined by filter binding. Buffer, incubation of all reagents without any added extract. (B) Extracts were incubated with free histones in the presence of S-adenosyl-L-[methyl-3H]methionine, followed by gel electrophoresis and Coomassie Blue staining (left) and fluorography (right). (C) Set1C, isolated from a wild-type strain including Bre2-TAP, was incubated with H3 N-terminal peptides carrying either a lysine 4 to leucine (K4L) or lysine 9 to leucine (K9L) mutation.The Saccharomyces cerevisiae Set1 complex includes an Ash2 homologue and methylates histone 3 lysine 4EMBO J. 2001 December 17;20(24):7137-7148.Fig. 6. Set1C activity is required for maintenance of telomere lengths. Telomeres were visualized by a Southern blotting strategy using a telomere specific probe. Genomic DNAs were isolated from the following strains: set1 (lane 1); wild type (lane 2); Set1-TAP (lane 3); TAP-Set1 (lane 4); bre2 (lane 5); swd1 (lane 6); swd3 (lane 7).The Saccharomyces cerevisiae Set1 complex includes an Ash2 homologue and methylates histone 3 lysine 4EMBO J. 2001 December 17;20(24):7137-7148.Fig. 7. Classification of SET domains by two different criterion yields the same groupings. At the left, a non-rooted tree of the SET domains, based on multiple sequence alignment of the SET domain, without inclusion of preSET and postSET regions, is shown. Four major groups are evident [SUV39, ASH1, SET1/TRX, E(Z)]. To the right, the distribution of flanking sequence elements is depicted. Known methyltransferases, present in three of the four major branches, are boxed.The Saccharomyces cerevisiae Set1 complex includes an Ash2 homologue and methylates histone 3 lysine 4EMBO J. 2001 December 17;20(24):7137-7148.MeSH Terms, SubstancesMeSH TermsAmino Acid SequenceBase SequenceBlotting, SouthernDNA PrimersDNA-Binding Proteins/chemistryDNA-Binding Proteins/metabolism*Histone-Lysine N-MethyltransferaseHistones/chemistryHistones/metabolism*Lysine/metabolism*MethylationMolecular Sequence DataSaccharomyces cerevisiae/metabolism*Saccharomyces cerevisiae Proteins/chemistrySaccharomyces cerevisiae Proteins/metabolism*Sequence Homology, Amino AcidTranscription Factors/chemistryTranscription Factors/metabolism*SubstancesDNA PrimersDNA-Binding ProteinsHistonesSaccharomyces cerevisiae ProteinsTranscription FactorsLysineHistone-Lysine N-MethyltransferaseSET1 protein, S cerevisiaeLinkOut - more resourcesFull Text SourcesNature Publishing GroupEBSCOEurope PubMed CentralOvid Technologies, Inc.ProQuestPubMed CentralMolecular Biology DatabasesL-LYSINE - HSDBSaccharomyces Genome DatabaseResearch Materialsonline strain list - StrainInfoMiscellaneousBioGRID: Data: Pathways - (NIF)

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Applications of Grammar 5 Teacher's Manual, Grade 11: Annie Lee Sloan: 9781930367326 - Christianbook.com
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This teacher's key accompanies Applications ofGrammar Book 5: Developing Communication Skills. Student exercises are reproduced with the correct answers overlaid and filled in. Teacher notes clarify any confusing concepts or answers. Stapled Binding. Grade 11.
Format: PaperbackVendor: Christian Liberty PressPublication Date: 1998Dimensions: 11 X 8.5 (inches)ISBN: 1930367325ISBN-13: 9781930367326Availability: In StockSeries: Christian Liberty Grammar and Speech
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Patent US6381350 - Intravascular ultrasonic analysis using active contour method and system - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inPatentsAn intravascular ultrasound (IVUS) analysis system and method is provided which determines luminal and medial-adventitial boundaries of a blood vessel. Ultrasonic data is acquired by a rotating transducer mounted to a tip of a catheter which is inserted into the blood vessel. An intravascular image is...http://www.google.com/patents/US6381350?utm_source=gb-gplus-sharePatent US6381350 - Intravascular ultrasonic analysis using active contour method and systemAdvanced Patent SearchPublication numberUS6381350 B1Publication typeGrantApplication numberUS 09/347,209Publication dateApr 30, 2002Filing dateJul 2, 1999Priority dateJul 2, 1999Fee statusPaidAlso published asDE60038382D1, DE60038382T2, EP1198200A1, EP1198200A4, EP1198200B1, WO2001001864A1Publication number09347209, 347209, US 6381350 B1, US 6381350B1, US-B1-6381350, US6381350 B1, US6381350B1InventorsJon D. Klingensmith, David Geoffrey Vince, Raj ShekharOriginal AssigneeThe Cleveland Clinic FoundationExport CitationBiBTeX, EndNote, RefManPatent Citations (11), Non-Patent Citations (4), Referenced by (107), Classifications (32), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetIntravascular ultrasonic analysis using active contour method and system
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2011The Cleveland Clinic FoundationSystem and Method for Identifying a Vascular BorderUS20130166011 *Dec 10, 2012Jun 27, 2013Gera StrommerSystem and method for delivering a stent to a selected position within a lumenUS20130330009 *Jun 7, 2013Dec 12, 2013Fujitsu LimitedApparatus, method for extracting boundary of object in image, and electronic device thereofUS20140270429 *Mar 13, 2014Sep 18, 2014Volcano CorporationParallelized Tree-Based Pattern Recognition for Tissue CharacterizationEP1534137A2 *Aug 26, 2003Jun 1, 2005The Cleveland Clinic FoundationSystem and method for identifying a vascular borderEP1534137A4 *Aug 26, 2003May 5, 2010Cleveland Clinic FoundationSystem and method for identifying a vascular borderEP1609423A2 *Jun 22, 2005Dec 28, 2005Terumo Kabushiki KaishaUltrasonic diagnostic apparatusEP1732461A2 *Feb 25, 2005Dec 20, 2006The Cleveland Clinic FoundationSystem and method for vascular border detectionWO2004017823A2 *Aug 26, 2003Mar 4, 2004The Cleveland Clinic 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in-stent restenosis predictionWO2016092390A1Nov 18, 2015Jun 16, 2016Koninklijke Philips N.V.Interactive physiologic data and intravascular imaging data and associated devices, systems, and methods* Cited by examinerClassifications U.S. Classification382/128, 600/485International ClassificationA61B8/08, G06K9/64, G06T5/00, G06T1/00, A61B5/107, A61B8/12, G06T7/60Cooperative ClassificationA61B8/12, A61B5/02007, A61B8/0833, A61B5/1076, G06T7/0089, G06T7/0083, G06T2207/30101, A61B8/463, G06K9/6207, G06T2207/20101, A61B8/4461, G06T2207/10132, A61B8/0858European ClassificationA61B8/12, A61B8/44N6, A61B5/02D, G06K9/62A1A2L, A61B8/46B4, A61B8/08H, A61B5/107J, A61B8/08J, G06T7/00S5, G06T7/00S2Legal EventsDateCodeEventDescriptionJul 2, 1999ASAssignmentOwner name: CLEVELAND CLINIC FOUNDATION, OHIOFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KLINGENSMITH, JON D.;VINCE, DAVID GEOFFREY;SHEKHAR, RAJ;REEL/FRAME:010088/0521Effective date: 19990630Oct 31, 2005FPAYFee paymentYear of fee payment: 4Oct 30, 2009FPAYFee paymentYear of fee payment: 8Oct 30, 2013FPAYFee paymentYear of fee payment: 12RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services

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Sarah Hamilton Koenig (Hamilton) Guest Book: sign their guest book, share your condolences, or read their obituary at Radney Funeral Home Mobile in partnership with the Dignity Memorial network
Sarah Hamilton Koenig (Hamilton)
This Guest Book has been kept online until 6/13/2013 by Radney Funeral Home Mobile.
Norman, All of your friends in SWARM join in expressing our condolences. We appreciate both of you and all you did for the model railroading community in Mobile, and know you will miss your life partner very much.
Norm: All of us in the Radiation Oncology Department send our prayers for Sarah. She will be missed.
NORMAN, Louise and I are so sorry for the loss of Sarah. You were so faithful to take care of her during her illness. We are praying for you. Marian and Louise Pierce
~ Marian Pierce,
Norman, we are deeply sorry for your loss. Soon all suffering will end, and the foretold resurrection will begin.

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Padilla Gets 17 Years in Conspiracy Case - The New York Times
U.S.|Padilla Gets 17 Years in Conspiracy Case
By KIRK SEMPLE JAN. 23, 2008
A version of this article appears in print on , on Page A14 of the New York edition with the headline: Padilla Gets 17-Year Term For Role in Conspiracy. Order Reprints| Today's Paper|Subscribe

value: This website is an American daily newspaper based in New York City with a worldwide readership. Founded in 1851, the Times has since won 132 Pulitzer Prizes, the most of any newspaper, and has long been regarded within the industry as a national "newspaper of record".


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Dr-Sommer comments on What are the most addictive games for Android in your opinion?jump to contentmy subredditsannouncementsArtAskRedditaskscienceawwblogbookscreepydataisbeautifulDIYDocumentariesEarthPornexplainlikeimfiveFitnessfoodfunnyFuturologygadgetsgamingGetMotivatedgifshistoryIAmAInternetIsBeautifulJokesLifeProTipslistentothismildlyinterestingmoviesMusicnewsnosleepnottheonionOldSchoolCoolpersonalfinancephilosophyphotoshopbattlespicsscienceShowerthoughtsspacesportstelevisiontifutodayilearnedTwoXChromosomesUpliftingNewsvideosworldnewsWritingPromptsedit subscriptionsfront-all-random | gadgets-sports-gaming-pics-worldnews-videos-AskReddit-aww-Music-funny-news-movies-books-history-food-philosophy-television-Jokes-Art-DIY-space-Documentaries-Fitness-askscience-nottheonion-todayilearned-personalfinance-gifs-listentothis-IAmA-TwoXChromosomes-creepy-nosleep-GetMotivated-WritingPrompts-LifeProTips-EarthPorn-explainlikeimfive-Showerthoughts-Futurology-photoshopbattles-mildlyinteresting-dataisbeautiful-tifu-OldSchoolCool-UpliftingNews-InternetIsBeautiful-sciencemore » Androidcommentsrelatedwant to join? sign in or create an account in seconds|Englishlimit my search to /r/Androiduse the following search parameters to narrow your results:subreddit:subredditfind submissions in "subreddit"author:usernamefind submissions by "username"site:example.comfind submissions from "example.com"url:textsearch for "text" in urlselftext:textsearch for "text" in self post contentsself:yes (or self:no)include (or exclude) self postsnsfw:yes (or nsfw:no)include (or exclude) results marked as NSFWe.g. subreddit:aww site:imgur.com dogsee the search faq for details.advanced search: by author, subreddit...this post was submitted on 11 Jun 201492 points (86% upvoted)shortlink: remember mereset passwordloginSubmit a new postSubmit a new text postAndroidsubscribeunsubscribe548,077 readers2,741 users here nowChat on our IRC channel!
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Patent US7214326 - Increased capacity leadframe and semiconductor package using the same - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inAdvanced Patent SearchPatentsIn accordance with the present invention, there is provided a method for manufacturing a semiconductor package. The method comprises the initial step of applying first and second photoresist layers to respective ones of opposed first and second surfaces of a metal plate which includes a die paddle and...http://www.google.com/patents/US7214326?utm_source=gb-gplus-sharePatent US7214326 - Increased capacity leadframe and semiconductor package using the sameAdvanced Patent SearchPublication numberUS7214326 B1Publication typeGrantApplication numberUS 11/039,434Publication dateMay 8, 2007Filing dateJan 19, 2005Priority dateNov 7, 2003Fee statusPaidAlso published asUS7144517Publication number039434, 11039434, US 7214326 B1, US 7214326B1, US-B1-7214326, US7214326 B1, US7214326B1InventorsSung Jin Yang, Doo Hwan Moon, Won Dai ShinOriginal AssigneeAmkor Technology, Inc.Export CitationBiBTeX, EndNote, RefManPatent Citations (104), Non-Patent Citations (3), Referenced by (11), Classifications (22), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetIncreased capacity leadframe and semiconductor package using the same
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS2596993Jan 13, 1949May 20, 1952United Shoe Machinery CorpMethod and mold for covering of eyelets by plastic injectionUS3435815Jul 15, 1966Apr 1, 1969Micro Tech Mfg IncWafer dicerUS3734660Jun 17, 1971May 22, 1973Tuthill Pump CoApparatus for fabricating a bearing deviceUS3838984Apr 16, 1973Oct 1, 1974Sperry Rand CorpFlexible carrier and interconnect for uncased ic chipsUS4054238Mar 23, 1976Oct 18, 1977Western Electric Company, Inc.Method, apparatus and lead frame for assembling leads with terminals on a substrateUS4189342Jun 22, 1977Feb 19, 1980U.S. Philips CorporationSemiconductor device comprising projecting contact layersUS4258381Dec 6, 1978Mar 24, 1981Steag, Kernergie GmbhLead frame for a semiconductor device suitable for mass productionUS4289922Sep 4, 1979Sep 15, 1981Plessey IncorporatedIntegrated circuit package and lead frameUS4301464Jul 5, 1979Nov 17, 1981Hitachi, Ltd.Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting memberUS4332537Jul 17, 1978Jun 1, 1982Dusan SlepcevicEncapsulation mold with removable cavity platesUS4417266Aug 14, 1981Nov 22, 1983Amp IncorporatedPower and ground plane structure for chip carrierUS4451224Mar 25, 1982May 29, 1984General Electric CompanyMold device for making plastic articles from resinUS4530152Apr 1, 1983Jul 23, 1985Compagnie Industrielle Des Telecommunications Cit-AlcatelMethod for encapsulating semiconductor components using temporary substratesUS4541003Jun 14, 1982Sep 10, 1985Hitachi, Ltd.Semiconductor device including an alpha-particle shieldUS4646710May 5, 1983Mar 3, 1987Crystal Systems, Inc.Multi-wafer slicing with a fixed abrasiveUS4707724Jan 2, 1987Nov 17, 1987Hitachi, Ltd.Semiconductor device and method of manufacturing thereofUS4727633Sep 22, 1986Mar 1, 1988Tektronix, Inc.Method of securing metallic members togetherUS4737839Mar 11, 1986Apr 12, 1988Trilogy Computer Development Partners, Ltd.Semiconductor chip mounting systemUS4756080Jan 27, 1986Jul 12, 1988American Microsystems, Inc.Metal foil semiconductor interconnection methodUS4812896Nov 13, 1986Mar 14, 1989Olin CorporationMetal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidantUS4862245Feb 19, 1988Aug 29, 1989International Business Machines CorporationPackage semiconductor chipUS4862246Feb 24, 1988Aug 29, 1989Hitachi, Ltd.Semiconductor device lead frame with etched through holesUS4907067May 11, 1988Mar 6, 1990Texas Instruments IncorporatedThermally efficient power device packageUS4920074Feb 25, 1988Apr 24, 1990Hitachi, Ltd.Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereofUS4935803Sep 9, 1988Jun 19, 1990Motorola, Inc.Self-centering electrode for power devicesUS4942454Aug 2, 1988Jul 17, 1990Mitsubishi Denki Kabushiki KaishaResin sealed semiconductor deviceUS4987475Dec 5, 1989Jan 22, 1991Digital Equipment CorporationAlignment of leads for ceramic integrated circuit packagesUS5018003Aug 21, 1990May 21, 1991Mitsubishi Denki Kabushiki KaishaLead frame and semiconductor deviceUS5029386Sep 17, 1990Jul 9, 1991Hewlett-Packard CompanyHierarchical tape automated bonding methodUS5041902Dec 14, 1989Aug 20, 1991Motorola, Inc.Molded electronic package with compression structuresUS5057900Oct 5, 1989Oct 15, 1991Semiconductor Energy Laboratory Co., Ltd.Electronic device and a manufacturing method for the sameUS5059379Dec 8, 1989Oct 22, 1991Mitsubishi Denki Kabushiki KaishaMethod of resin sealing semiconductor devicesUS5065223May 31, 1990Nov 12, 1991Fujitsu Vlsi LimitedPackaged semiconductor deviceUS5070039Apr 13, 1989Dec 3, 1991Texas Instruments IncorporatedMethod of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removalUS5087961Feb 20, 1990Feb 11, 1992Lsi Logic CorporationSemiconductor device packageUS5091341May 17, 1990Feb 25, 1992Kabushiki Kaisha ToshibaMethod of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure memberUS5096852Feb 7, 1990Mar 17, 1992Burr-Brown CorporationMethod of making plastic encapsulated multichip hybrid integrated circuitsUS5118298Apr 4, 1991Jun 2, 1992Advanced Interconnections CorporationThrough hole mounting of integrated circuit adapter leadsUS5122860Aug 25, 1988Jun 16, 1992Matsushita Electric Industrial Co., Ltd.Integrated circuit device and manufacturing method thereofUS5134773May 22, 1990Aug 4, 1992Gerard LemaireMethod for making a credit card containing a microprocessor chipUS5151039Apr 29, 1991Sep 29, 1992Advanced Interconnections CorporationIntegrated circuit adapter having gullwing-shaped leadsUS5157475Jul 6, 1989Oct 20, 1992Oki Electric Industry Co., Ltd.Semiconductor device having a particular conductive lead structureUS5157480Feb 6, 1991Oct 20, 1992Motorola, Inc.Semiconductor device having dual electrical contact sitesUS5168368May 9, 1991Dec 1, 1992International Business Machines CorporationLead frame-chip package with improved configurationUS5172213May 23, 1991Dec 15, 1992At&T Bell LaboratoriesMolded circuit package having heat dissipating postUS5172214Apr 10, 1992Dec 15, 1992Motorola, Inc.Leadless semiconductor device and method for making the sameUS5175060Jun 29, 1990Dec 29, 1992Ibiden Co., Ltd.Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the sameUS5200362Sep 9, 1991Apr 6, 1993Motorola, Inc.Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer filmUS5200809Sep 27, 1991Apr 6, 1993Vlsi Technology, Inc.Exposed die-attach heatsink packageUS5214845May 11, 1992Jun 1, 1993Micron Technology, Inc.Method for producing high speed integrated circuitsUS5216278Mar 2, 1992Jun 1, 1993Motorola, Inc.Semiconductor device having a pad array carrier packageUS5218231Aug 24, 1990Jun 8, 1993Kabushiki Kaisha ToshibaMold-type semiconductor deviceUS5221642Aug 15, 1991Jun 22, 1993Staktek CorporationLead-on-chip integrated circuit fabrication methodUS5250841Jan 21, 1993Oct 5, 1993Motorola, Inc.Semiconductor device with test-only leadsUS5252853Sep 14, 1992Oct 12, 1993Mitsubishi Denki Kabushiki KaishaPackaged semiconductor device having tab tape and particular power distribution lead structureUS5258094Sep 9, 1992Nov 2, 1993Nec CorporationMethod for producing multilayer printed wiring boardsUS5266834Jul 21, 1992Nov 30, 1993Hitachi Ltd.Semiconductor device and an electronic device with the semiconductor devices mounted thereonUS5273938Apr 30, 1992Dec 28, 1993Motorola, Inc.Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer filmUS5277972Dec 23, 1991Jan 11, 1994Tomoegawa Paper Co., Ltd.Adhesive tapesUS5278446Jul 6, 1992Jan 11, 1994Motorola, Inc.Reduced stress plastic packageUS5279029May 11, 1993Jan 18, 1994Staktek CorporationUltra high density integrated circuit packages methodUS5281849May 7, 1991Jan 25, 1994Singh Deo Narendra NSemiconductor package with segmented lead frameUS5294897Dec 24, 1992Mar 15, 1994Mitsubishi Denki Kabushiki KaishaMicrowave IC packageUS5327008Mar 22, 1993Jul 5, 1994Motorola Inc.Semiconductor device having universal low-stress die support and method for making the sameUS5332864Dec 27, 1991Jul 26, 1994Vlsi Technology, Inc.Integrated circuit package having an interposerUS5335771Apr 14, 1993Aug 9, 1994R. H. Murphy Company, Inc.Spacer trays for stacking storage trays with integrated circuitsUS5336931Sep 3, 1993Aug 9, 1994Motorola, Inc.Anchoring method for flow formed integrated circuit coversUS5343076Nov 22, 1993Aug 30, 1994Mitsui Petrochemical Industries, Ltd.Semiconductor device with an airtight space formed internally within a hollow packageUS5358905Apr 2, 1993Oct 25, 1994Texas Instruments IncorporatedSemiconductor device having die pad locking to substantially reduce package crackingUS5365106Sep 27, 1993Nov 15, 1994Kabushiki Kaisha ToshibaResin mold semiconductor deviceUS5381042Apr 19, 1994Jan 10, 1995Amkor Electronics, Inc.Packaged integrated circuit including heat slug having an exposed surfaceUS5391439Feb 4, 1994Feb 21, 1995Dai Nippon Printing Co., Ltd.Leadframe adapted to support semiconductor elementsUS5406124Nov 29, 1993Apr 11, 1995Mitsui Toatsu Chemicals, Inc.Insulating adhesive tape, and lead frame and semiconductor device employing the tapeUS5410180Jul 26, 1993Apr 25, 1995Shinko Electric Industries Co., Ltd.Metal plane support for multi-layer lead frames and a process for manufacturing such framesUS5414299Sep 24, 1993May 9, 1995Vlsi Technology, Inc.Semi-conductor device interconnect package assembly for improved package performanceUS5417905Jun 10, 1992May 23, 1995Esec (Far East) LimitedMethod of making a card having decorations on both facesUS5424576Oct 12, 1993Jun 13, 1995Motorola, Inc.Semiconductor device having x-shaped die support member and method for making the sameUS5428248Aug 15, 1994Jun 27, 1995Goldstar Electron Co., Ltd.Resin molded semiconductor packageUS5435057Feb 14, 1994Jul 25, 1995International Business Machines CorporationInterconnection method and structure for organic circuit boardsUS5444301Jun 16, 1994Aug 22, 1995Goldstar Electron Co. Ltd.Semiconductor package and method for manufacturing the sameUS5452511Nov 4, 1993Sep 26, 1995Chang; Alexander H. C.Composite lead frame manufacturing methodUS5454905Aug 9, 1994Oct 3, 1995National Semiconductor CorporationMethod for manufacturing fine pitch lead frameUS5474958May 4, 1993Dec 12, 1995Motorola, Inc.Method for making semiconductor device having no die supporting surfaceUS5484274Nov 10, 1994Jan 16, 1996Neu Dynamics Corp.Encapsulation molding equipmentUS5493151Jun 7, 1995Feb 20, 1996Kabushiki Kaisha ToshibaSemiconductor device, lead frame and method for manufacturing semiconductor devicesUS5508556Sep 2, 1994Apr 16, 1996Motorola, Inc.Leaded semiconductor device having accessible power supply pad terminalsUS5517056Sep 30, 1993May 14, 1996Motorola, Inc.Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the sameUS5521429Nov 23, 1994May 28, 1996Sanyo Electric Co., Ltd.Surface-mount flat package semiconductor deviceUS5528076Feb 1, 1995Jun 18, 1996Motorola, Inc.Leadframe having metal impregnated silicon carbide mounting areaUS5534467Aug 22, 1994Jul 9, 1996Lsi Logic CorporationSemiconductor packages for high I/O semiconductor diesUS5539251Feb 17, 1995Jul 23, 1996Micron Technology, Inc.Tie bar over chip lead frame designUS5543657Oct 7, 1994Aug 6, 1996International Business Machines CorporationSingle layer leadframe design with groundplane capabilityUS5544412May 24, 1994Aug 13, 1996Motorola, Inc.Method for coupling a power lead to a bond pad in an electronic moduleUS5545923Feb 28, 1995Aug 13, 1996Lsi Logic CorporationSemiconductor device assembly with minimized bond finger connectionsUS5581122Oct 25, 1994Dec 3, 1996Industrial Technology Research InstitutePackaging assembly with consolidated common voltage connections for integrated circuitsUS5592019Apr 4, 1995Jan 7, 1997Mitsubishi Denki Kabushiki KaishaSemiconductor device and moduleUS5592025Dec 5, 1994Jan 7, 1997Motorola, Inc.Pad array semiconductor deviceUS5594274Jan 11, 1996Jan 14, 1997Nec CorporationLead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the sameUS5595934Jul 24, 1995Jan 21, 1997Samsung Electronics Co., Ltd.Method for forming oxide protective film on bonding pads of semiconductor chips by UV/O3 treatmentUS5683943 *Jun 12, 1995Nov 4, 1997Dai Nippon Printing Co., Ltd.Process for etching a semiconductor lead frameUS6475646 *Dec 8, 2000Nov 5, 2002Samsung Techwin Co., Ltd.Lead frame and method of manufacturing the lead frameUS7053469 *Mar 30, 2004May 30, 2006Advanced Semiconductor Engineering, Inc.Leadless semiconductor package and manufacturing method thereofUS20030164554 *Aug 20, 2001Sep 4, 2003Fee Setho SingQuad flat no lead (QFN) grid array package, method of making and memory module and computer system including sameUS20040080025 *Sep 15, 2003Apr 29, 2004Shinko Electric Industries Co., Ltd.Lead frame, method of manufacturing the same, and semiconductor device manufactured with the same* Cited by examinerNon-Patent CitationsReference1National Semiconductor Corporation, "Leadless Leadframe Package," Informational Pamphlet from webpage, 21 pages, Oct. 2002, www.national.com.2Patrick Mannion, "MOSFETs Break out of the Shackles of Wire Bonding," Informational Packet, 5 pages, Electronic Design, Mar. 22, 1999 vol. 47, No. 6, www.elecdesign.com/1999/mar2299/ti/0322ti1.shtml.3Vishay, "4 Milliohms in the So-8: Vishay Siliconix Sets New Record for Power MOSFET On-Resistance," Press Release from webpage, 3 pages, www.vishay.com/news/releases, Nov. 7, 2002.Referenced byCiting PatentFiling datePublication dateApplicantTitleUS7667303 *Sep 18, 2007Feb 23, 2010Advanced Semiconductor Engineering, Inc.Multi-chip packageUS7842550Dec 11, 2008Nov 30, 2010Chipmos Technologies Inc.Method of fabricating quad flat non-leaded packageUS8230591 *Apr 17, 2008Jul 31, 2012Hitachi Cable, Ltd.Method for fabricating an electronic device substrateUS8274797 *Feb 18, 2009Sep 25, 2012Omron CorporationElectronic componentUS8519518 *Sep 24, 2010Aug 27, 2013Stats Chippac Ltd.Integrated circuit packaging system with lead encapsulation and method of manufacture thereofUS20110044017 *Feb 18, 2009Feb 24, 2011Omron CorporationElectronic componentUS20120074547 *Sep 24, 2010Mar 29, 2012Byung Tai DoIntegrated circuit packaging system with lead encapsulation and method of manufacture thereofUS20120217627 *Aug 30, 2012Unimicron Technology CorporationPackage structure and method of fabricating the sameWO2013037184A1 *Aug 28, 2012Mar 21, 2013Jiangsu Changjiang Electronics Technology Co. LtdIslandless pre-encapsulated etching-then-plating lead frame structures and manufacturing methodWO2013037186A1 *Aug 28, 2012Mar 21, 2013Jiangsu Changjiang Electronics Technology Co. LtdIslandless pre-encapsulated plating-then-etching lead frame structures and manufacturing methodWO2013037188A1 *Aug 28, 2012Mar 21, 2013Jiangsu Changjiang Electronics Technology Co. LtdPre-encapsulated islandless lead frame structures and manufacturing method* Cited by examinerClassifications U.S. Classification216/13, 216/33, 216/36, 216/41, 438/106International ClassificationH01B13/00, C23F1/00Cooperative ClassificationH01L2224/45124, H01L2224/45144, H01L2224/45147, H01L2224/48091, H01L21/6835, H01L21/568, H01L2924/01079, H01L2924/01078, H01L2924/01046, H01L2224/48247, H01L24/45, H01L2224/73265, H01L2224/92247European ClassificationH01L21/683T, H01L21/56TLegal EventsDateCodeEventDescriptionJan 19, 2005ASAssignmentOwner name: AMKOR TECHNOLOGY, INC., ARIZONAFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, SUNG JIN;MOON, DOO HWAN;SHIN, WON DAI;REEL/FRAME:016202/0578Effective date: 20050118Jun 3, 2009ASAssignmentOwner name: BANK OF AMERICA, N.A.,TEXASFree format text: PATENT SECURITY AGREEMENT;ASSIGNOR:AMKOR TECHNOLOGY, INC.;REEL/FRAME:022764/0864Effective date: 20090416Nov 8, 2010FPAYFee paymentYear of fee payment: 4Nov 10, 2014FPAYFee paymentYear of fee payment: 8RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services


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Words containing genepatte | Words that contain genepatte
Words containing genepatte | Words that contain genepatte http://www.thefreedictionary.com/words-containing-genepattePrinter Friendly
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Found 1 words containing genepatte. Browse our Scrabble Word Finder, Words With Friends cheat dictionary, and WordHub word solver to find words that contain genepatte. Or use our Unscramble word solver to find your best possible play! Related: Words that start with genepatte
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Allistair Short - Semantic Scholar
Allistair Short
Joel G. Hardman5
G. W. Liddle5
Earl W. Sutherland5
Arthur E. Broadus5
N I Kaminsky5
6Mb Chb Phd A. G. Brown Bsc
5Julie A Ressler
5George Sperling
5Charles Chubb
Decremental and incremental visual thresholds.
1. Extrafoveal decremental and incremental visual thresholds have been measured with a circular test-object of 57' diameter, an exposure time of 0.1 sec and background luminance ranging from 2.5 to… (More)
Effects from the somatic sensory cortex on transmission through the spinocervical tract.
Alan G Brown, Allistair Short
Proceedings: Direct measurement of human shape using a computer.
Allistair Short, M G Mutch, Jean T. Anderson, Rajiv Grover
Interaction of cerebral cortical potentials evoked by stimulating the periphery and the contralateral cortex in the rat.
O D Holmes, Allistair Short
Proceedings: Inhibition of transmission through the spinocervical tract from localized areas of the sensorimotor cortex.
Alan G Brown, Joe D. Coulter, Philippa Rose, Allistair Short, Peter J. Snow
Interaction of cortical potentials evoked by stimulation of the periphery and the corpus callosum in the rat.
Margaret C. Carter, O D Holmes, Allistair Short
Variations in plasma levels of adenosine 3',5'-monophosphate during clinical sepsis.
William J Bill Sibbald, Vishwanath M Sardesai, Allistair Short, Robert F. Wilson
Plasma levels of adenosine 3',5'-monophosphate were measured in 43 patients with bacterial infections of varying degrees of severity. The most severely ill patients, who died within 48 hours of… (More)
Letter: Should doctors strike again?
Allistair Short, A S Aldis, Richard C. Cook, David M. Jackson, C G Scorer, Robert J Walker
Correlation between evoked potentials and spontaneous activity in the cortex cerebri of rats.

value: This website is an artificial-intelligence backed search engine for academic publications developed at the Allen Institute for AI and publicly released in November 2015. It uses advances in natural language processing to provide summaries for scholarly papers.


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9780443051487: Therapeutic Drugs: 2-Volume Set - AbeBooks - Colin Dollery II: 0443051488
Colin Dollery II Therapeutic Drugs: 2-Volume Set
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