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Patent US4755392 - Dry particulate three-component food coating containing high and low density ... - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inAdvanced Patent SearchPatentsFrozen food products are coated with a novel coating composition which permits the food product to be reconstituted for consumption by the application of microwave energy and obtain the desired combination of textural properties, both of moistness of food substrate and crispness of coating. The coating...http://www.google.com/patents/US4755392?utm_source=gb-gplus-sharePatent US4755392 - Dry particulate three-component food coating containing high and low density breadcrumbs, batter ingredientsAdvanced Patent SearchPublication numberUS4755392 APublication typeGrantApplication numberUS 07/001,957Publication dateJul 5, 1988Filing dateJan 9, 1987Priority dateFeb 13, 1984Fee statusPaidAlso published asCA1219763A1, DE3563676D1, EP0155760A1, EP0155760B1, US4675197Publication number001957, 07001957, US 4755392 A, US 4755392A, US-A-4755392, US4755392 A, US4755392AInventorsBeatrice A. Banner, Lucy V. Richardson, Kenneth S. DarleyOriginal AssigneeThe Griffith Laboratories, LimitedExport CitationBiBTeX, EndNote, RefManPatent Citations (4), Referenced by (13), Classifications (8), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetDry particulate three-component food coating containing high and low density breadcrumbs, batter ingredients
US 4755392 AAbstract
1. A three component food coating composition provided in dry form, consisting essentially of:(a) a first particulate component sized so that none of the particles is coarser than 16 mesh and up to 40% pass an 80-mesh screen and comprising about 1 to about 10 wt.% of powdered egg albumen, up to about 60 wt.% of flour, and substantially of particulated high density breadcrumbs having a bulk density of about 0.5 to about 0.75 g/cc, a total absorption of about 375 to about 500, an absorption rate of about 15 to about 60 seconds and a moisture content of about 6 to about 10 wt.%; (b) a second particulate component suitable for constitution with water as a batter by the utilization of about 85 to about 125 parts by weight of water for each 100 parts by weight of said second particulate component and comprising flour, corn starch, about 1 to about 5 wt.% of chemical leavening agents and plastic fat in an amount to provide about 4 to about 10 wt.% therein in the batter, said plastic fat being in particulated form and having a sold fat index as follows:at 10� C.--up to about 75% at 27� C.--about 15 to about 75% at 40� C.--about 5 to about 45%; and (c) a third particulate component comprising low density oriental-style breadcrumbs sized at least 15 wt.% coarser than 8 mesh and having a density of about 0.20 to about 0.40 g/cc. 2. The coating composition of claim 1 wherein each component is packaged separately and the three components are supplied together.
3. The coating composition of claim 1 wherein(i) in component (a), the flour is soft wheat flour and the high density breadcrumbs have a bulk density of about 0.55 to about 0.66 g/cc, a total absorption of about 425 to about 475 and a moisture content of about 7 to about 9 wt.%; and (ii) in component (c), the oriental-style breadcrumbs have a bulk density of about 0.23 to about 0.36 g/cc, a particle size distribution as follows: ______________________________________Mesh Size           %______________________________________ +3                 0 +5                 0 to about 15 +8                 about 20 to 40+14                 about 25 to 40+20                 about 10 to 30+40                 0 to about 5-40                 max. 10,______________________________________ an amylograph having the following characteristics: ______________________________________               Brabender Units______________________________________Initial Cold Viscosity                 10 to 50Peak viscosity at 95� C.                  600 to 1000Minimum viscosity after 15 min. hold                 500 to 800Final Cold viscosity   1800 to 2500,______________________________________ and contains 0 to 0.1 wt.% of colouring agent, 0 to about 2 wt.% dextrose and 0 to 5 wt.% of salt. Description
This is a continuation of application Ser. No. 701,162 filed Feb. 13, 1985, now U.S. Pat. No. 4,675,197.
The "Total Absorption" for the breadcrumbs also is determined by a standard procedure wherein 30 g of sample are added to 300 mls of water at room temperature, the mixture is allowed to stand for 6 hours, the excess water is poured off and the total absorption is determined from the relationship: W ##EQU1##
The components of the coating composition are chosen to provide an overall controlled degree of porosity in order to retain some moistness but to release the excess generated during reheating. The proportions of the three components of the coating composition required to achieve this result may vary widely, depending on the identity of the food substrate. Typical food substrates to which the compositions of the invention may be applied include fish, seafood, poultry, red meat and vegetables. Usually, the food substrate comprises about 50 to about 75 wt% of the overall composition with the coating compositions comprising the balance of about 25 to about 50 wt% of the composition.
______________________________________Ingredient        wt. %______________________________________Ground white pepper             0.125Egg albumen       8.00Biscrum fine.sup.(1)             40.00Flour, PF-43.sup.(2)             41.875Flour, Pastry type S.sup.(3)             10.00             100.00______________________________________Notes:.sup.(1) Biscrum fine is a finely-divided dense breading crumb which hasthe following typical characteristics:Screen Specification:U.S. mesh  Wt. %+10        0+20        5 to 15+40        30 to 40+60        20 to 30-60        25 to 35Absorption rate:      35 secondsTotal Absorption:      425 to 475Salt:      noneMoisture:  7 to 9 wt. %Bulk density:      0.55 to 0.66 g/cc.sup.(2) Flour PF-43 is a soft wheat flour with 0.44% ash maximum and8.0 to 9.0% protein based on 14% moisture.sup.(3) Flour, Pastry Type S is a soft wheat flour with 0.55 to 0.60%ash and 8.5 to 9.5% protein based on 14% moisture
______________________________________Screen Specification:  Mesh  Wt. %______________________________________   +5   max. 1.0   +8   25 to 35  +14   25 to 35  +20   20 to 30  +40    5 to 15  -40   max 10______________________________________Absorption rate:    65 secsTotal Absorption:   613Salt:               0.8 to 1.2 wt. %Moisture:           7 to 9 wt. %Bulk density:       0.33 to 0.36 g/cc______________________________________
The coated product was blanch fried for 45 seconds at 390� F. (200� C.) using a general purpose vegetable oil shortening in a restaurant-style fryer. The product was weighed to determine the amount of pick-up, i.e. ##EQU2## which was 33.6 wt.%, before being frozen on trays in an upright home freezer run at 2� to 5� F. (-16� to -15� C.). Once frozen, the coated portions were packed in a lidded aluminum foil tray and were held in an upright or chest-style home freezer at 2� F. to 5� F. (-16� to -15� C.).
______________________________________Screen Specification:  Mesh  Wt. %______________________________________   +5   max. 1   +8   20 to 30  +14   30 to 40  +20   20 to 30  +40    5 to 15  -40   max. 10______________________________________Salt:              0.8 to 1.2 wt. %Moisture:          7 to 9 wt. %Bulk density:      0.23 to 0.26 g/cc______________________________________
______________________________________Screen Specification:  Mesh  Wt. %______________________________________   +5   max. 1   +8   20 to 30  +14   30 to 40  +20   20 to 30  +40    5 to 15  -40   max. 10______________________________________Absorption rate:    35 secsTotal Absorption:   733Salt:               0.8 to 1.2 wt. %Moisture:           7 to 9 wt. %Bulk density:       0.25 to 0.30 g/cc______________________________________
______________________________________Ingredient            wt. %______________________________________Ground pepper         0.60Liquid pepper on salt carrier                 0.45Ground celery seed    0.45Onion powder          0.60Savory powder         0.28LevnLite.sup.(1)      1.80Monosodium glutamate  1.20Granulated sodium bicarbonate                 1.80Egg albumen           2.70Fine cane sugar       0.90Salt                  4.45Defatted soya flour   1.42Flour PF-43           27.00Corn starch           22.30Flour HW 80           23.35Powdered hydrogenated vegetable                 10.70shortening.sup.(2)                 100.00______________________________________Notes:.sup.(1) LevnLite is an acidic sodium aluminum phosphate;.sup.(2) The powdered hydrogenated vegetable shortening was an cryo-genically crystallized powdered shortening having the followingcharacteristics:Free fatty acids         0.1% max.Peroxide Value (me/kg)         0.5 max.Iodine value  50 to 66Melting point 46� to 56� C.Moisture      0.1% max.Solid Fat Index:at 10� C.         68 to 70at 27� C.         62 to 68at 40� C.         34 to 38
______________________________________Screen Specification:  Mesh  Wt. %______________________________________   +5   max. 1   +8   20 to 30  +14   30 to 40  +20   20 to 30  +40    5 to 15  -40   max. 10______________________________________Absorption rate:    not knownTotal Absorption:   not knownSalt:               0.8 to 1.2 wt. %Moisture:           7 to 9 wt. %Bulk density:       0.25 to 0.28 g/cc______________________________________
The coated chicken patties were blanch fried for 31 seconds at temperatures varying from 378� to 390� F. (190� to 200� C.) using a general purpose vegetable oil shortening in a plant-style fryer. The product was weighed after frying to determine the amount of pick-up, which was 39.5 wt.%, before being frozen in a nitrogen freezing tunnel to provide a thin, soft and unfrozen layer in the centre of the patties and then placed in an upright or chest-style home freezer at 2� to 5� F. (-16� to -15� C.).
______________________________________Ingredient           wt. %______________________________________Powdered lemon juice 0.45LevnLite             1.80Granulated sodium bicarbonate                1.80Egg albumen          2.70Fine cane sugar      2.70Salt                 5.35Defatted soya flour  1.45Velvet Flour         50.65Crisp Film Starch    25.00Powdered hydrogenated                10.70vegetable shortening.sup.(1)                100.00______________________________________ Note: .sup.(1) The vegetable shortening used was that described in Example 4.
______________________________________Screen Specification:  Mesh  Wt. %______________________________________   +3   0   +5    5 to 15   +8   30 to 40  +14   25 to 40  +20   10 to 20  -20   max. 15______________________________________Absorption rate:    35 secsTotal Absorption:   667Salt:               0.8 to 1.2 wt. %Moisture:           7 to 9 wt. %Bulk density:       0.25 to 0.28 g/cc______________________________________
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS3656969 *Nov 3, 1969Apr 18, 1972Horn S Poultry IncBreaded vegetable methodUS4423078 *Apr 14, 1982Dec 27, 1983The Griffith Laboratories, LimitedProduction of oriental-style breading crumbsUS4529607 *Jun 28, 1984Jul 16, 1985National Starch And Chemical CorporationProcess for coating foodstuff with batter containing high amylose flour for microwave cookingUS4675197 *Feb 13, 1985Jun 23, 1987The Griffith Laboratories LimitedMoist and crisp bread or batter coating; microwaving, reconst itution or frozen porduct* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS4943438 *Feb 21, 1989Jul 24, 1990Conagra, Inc.Bread crumb coating composition and process for imparting fried-like texture and flavor to food productsUS5073392 *Nov 8, 1990Dec 17, 1991The Pillsbury CompanyProcess of forming a microwaveable food product having a selected colorUS5194271 *Sep 5, 1991Mar 16, 1993The Pillsbury CompanyMicrowaveable batter-coated, dough-enrobed foodstuffUS5223289 *Feb 18, 1992Jun 29, 1993The Pillsbury CompanyProcess for forming a microwave browning compositionUS5266339 *Feb 19, 1993Nov 30, 1993Campbell Soup CompanyProcess for preparing batter-coated, heated food productsUS5266340 *Feb 25, 1993Nov 30, 1993Campbell Soup CompanyFish, chickenUS5281432 *Jun 2, 1992Jan 25, 1994National Starch And Chemical Investment Holding CorporationMethod of making foods containing soluble high amylose starchUS5368877 *Nov 4, 1992Nov 29, 1994Pillsbury CompanyMethod of producing film shelf stable food productsUS5441757 *Dec 5, 1994Aug 15, 1995The Pillsbury Co.Sauces for retortable food productsUS5576036 *Jan 13, 1995Nov 19, 1996The Pillsbury CompanyPre-baked microwaveable pastry systemsUS5798132 *Jun 17, 1996Aug 25, 1998Recot, Inc.Applying and then drying a starch based coating to provide a smooth flavorDE4027077A1 *Aug 27, 1990Mar 14, 1991House Food Industrial CoZubereitete, abgepackte nahrungsmittel zum kochen mittels mikrowelle und verfahren zur herstellung eines nahrungsmittelerzeugnissesWO2001008513A1 *Jul 28, 2000Feb 8, 2001Goodman Fielder Milling & BakiMicrowaveable food coating* Cited by examinerClassifications U.S. Classification426/555, 426/128International ClassificationA23L1/00, A23L1/01, A23L1/176Cooperative ClassificationA23L1/005, A23P2001/088European ClassificationA23L1/00P8B4Legal EventsDateCodeEventDescriptionJan 3, 2000FPAYFee paymentYear of fee payment: 12Jan 4, 1996FPAYFee paymentYear of fee payment: 8Feb 11, 1992REMIMaintenance fee reminder mailedJan 6, 1992FPAYFee paymentYear of fee payment: 4RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services

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Patent US20060012943 - Method and apparatus for connecting electrodes having apertures - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inPatentsIn various embodiments, the present subject matter includes a capacitor stack having a first substantially planar electrode having a first unetched portion, and a first aperture extending through the first substantially planar electrode and defined by material at least partially including the unetched...http://www.google.com/patents/US20060012943?utm_source=gb-gplus-sharePatent US20060012943 - Method and apparatus for connecting electrodes having aperturesAdvanced Patent SearchTry the new Google Patents, with machine-classified Google Scholar results, and Japanese and South Korean patents.Publication numberUS20060012943 A1Publication typeApplicationApplication numberUS 11/112,656Publication dateJan 19, 2006Filing dateApr 22, 2005Priority dateJul 16, 2004Also published asUS7092241Publication number11112656, 112656, US 2006/0012943 A1, US 2006/012943 A1, US 20060012943 A1, US 20060012943A1, US 2006012943 A1, US 2006012943A1, US-A1-20060012943, US-A1-2006012943, US2006/0012943A1, US2006/012943A1, US20060012943 A1, US20060012943A1, US2006012943 A1, US2006012943A1InventorsGregory SherwoodOriginal AssigneeCardiac Pacemakers, Inc.Export CitationBiBTeX, EndNote, RefManPatent Citations (33), Referenced by (10), Classifications (10), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetMethod and apparatus for connecting electrodes having apertures
US 20060012943 A1Abstract
In various embodiments, the present subject matter includes a capacitor stack having a first substantially planar electrode having a first unetched portion, and a first aperture extending through the first substantially planar electrode and defined by material at least partially including the unetched portion. Also, the present subject matter includes a second substantially planar electrode having a second unetched portion. The present subject matter includes embodiments wherein the first substantially planar electrode and the second substantially planar electrode are in alignment such that an unetched portion of the first aperture is at least partially adjacent an unetched portion of the second electrode defining a connection surface. The present subject matter additionally includes embodiments wherein the first electrode and the second electrode are connected along the connection surface. Images(7) Claims(24)
1. An apparatus, comprising: a capacitor stack having a first substantially planar electrode having a first etched portion and a first unetched portion, and a first aperture extending through the first substantially planar electrode and defined by material at least partially including the unetched portion, with a second substantially planar electrode having a second etched portion and a second unetched portion, the first substantially planar electrode and the second substantially planar electrode in alignment such that the first unetched portion and the second unetched portion overlap, and a first weld at least partially disposed through the aperture and electrically connecting the first substantially planar electrode and the second substantially planar electrode; a capacitor case, the capacitor stack disposed in the capacitor case; and electrolyte disposed in the capacitor case. 2. The capacitor stack of claim 1, wherein the first aperture abuts the second substantially planar electrode. 3. The capacitor stack of claim 1, wherein the first aperture is circular. 4. The capacitor stack of claim 1, further comprising a connection member through which the first aperture is disposed. 5. The capacitor stack of claim 1, further comprising: a first element including the first substantially planar electrode and the second substantially planar electrode; a second element including a third substantially planar electrode, and a fourth electrode; wherein the first element and the second element are in stacked alignment. 6. The capacitor stack of claim 5, wherein the second substantially planar electrode and the third substantially planar electrode are in alignment, and a second weld at least partially disposed through a second aperture disposed through the third substantially planar electrode, the weld connected to the second substantially planar electrode and the third substantially planar electrode. 7. The capacitor stack of claim 1, wherein the first weld is metallic. 8. The capacitor stack of claim 7, wherein the first weld electrically connects the first substantially planar electrode and the second substantially planar electrode. 9. The capacitor stack of claim 8, wherein the first weld is a laser weld. 10. The capacitor stack of claim 8, wherein the first weld is a solid state weld. 11. An apparatus, comprising: a capacitor stack with a first substantially planar electrode with a first aperture passing through the first substantially planar electrode, and a second substantially planar electrode in overlapping alignment with the first substantially planar electrode, with a weld at least partially disposed through the first aperture, the weld connecting the first and second substantially planar electrodes; a capacitor case, the capacitor stack disposed in the capacitor case; and electrolyte disposed in the capacitor case. 12. The capacitor stack of claim 11, wherein material defining the first aperture at least partially abuts the second substantially planar electrode. 13. The capacitor stack of claim 11, wherein the first substantially planar electrode includes material comprising a cathode, and the second substantially planar electrode including material comprising an anode, wherein the anode can be electrically separated from the cathode by cutting only the anode. 14. The capacitor stack of claim 11, with the first substantially planar electrode including material comprising a cathode, and the second substantially planar electrode including material comprising an anode, wherein the anode can be electrically separated from the cathode by cutting only the cathode. 15. The capacitor stack of claim 11, wherein the first substantially planar electrode includes a connection member defining the first aperture, the connection member having an unetched portion at least partially defining the first aperture. 16. An electrolytic capacitor stack having at least a first substantially planar electrode with an unetched portion, the unetched portion at least partially defining a first aperture passing through the first substantially planar electrode; at least a second substantially planar electrode in overlapping alignment with the first substantially planar electrode, and a first weld at least partially disposed through the first aperture and connecting the first and second substantially planar electrodes, wherein the unetched portion is produced by a process comprising: depositing a curable resin mask onto the electrode; curing the curable resin mask to the electrode; etching the electrode, the cured mask restricting the etch; removing the cured mask from the electrode; and anodizing the electrode. 17. The capacitor stack of claim 16, wherein the first weld is created by directing laser energy at the first substantially planar electrode proximal the first aperture. 18. The capacitor stack of claim 16, wherein the first weld is created by directing a spray of at least partially molten metal at the first substantially planar electrode proximal the first aperture. 19. The capacitor stack of claim 16, further comprising: a first element including the first substantially planar electrode and the second substantially planar electrode; a second element including a third substantially planar electrode, and a fourth electrode; wherein the first element and the second element are in stacked alignment. 20. The capacitor stack of claim 19, wherein the second substantially planar electrode and the third substantially planar electrode are in alignment, with a second weld at least partially disposed through a second aperture extending through the third substantially planar electrode, the second weld connected to the second electrode and the third electrode. 21. An apparatus, comprising: a capacitor stack having a first substantially planar electrode having a first connection means for connection of the first substantially planar electrode to an electrode and a second substantially planar electrode having a second connection means for connection of the second substantially planar electrode to the first substantially planar electrode, wherein the first connection means and the second connection means are electrically connected. 22. The capacitor stack of claim 21, wherein the first connection means is for welded interconnection and the second connection means is for welded interconnection. 23. The capacitor stack of claim 22, wherein the first connection means is for forming an interconnection with the second connection means, the interconnection substantially free from titanium. 24. The capacitor stack of claim 22, wherein the first substantially planar electrode includes a substrate and an oxide layer partially coating the substrate, and the first connection means is for forming an interconnection with the second connection means, the interconnection substantially free of oxide of the oxide layer.
CROSS REFERENCE TO RELATED APPLICATIONS [0001] The following commonly assigned U.S. patents are related to the present application and are incorporated herein by reference in their entirety: “High-Energy Capacitors for Implantable Defibrillators,” U.S. Pat. No. 6,556,863, filed Oct. 2, 1998, issued Apr. 29, 2003; “Flat Capacitor Having Staked Foils and Edge-Connected Connection Members,” U.S. Pat. No. 6,687,118, filed Nov. 3, 2000, issued Feb. 3, 2004; “Flat Capacitor for an Implantable Medical Device,” U.S. Pat. No. 6,699,265, filed Nov. 3, 2000, issued Mar. 2, 2004. Additionally, the following commonly assigned Provisional U.S. patent application is related to the present application and is incorporated herein by reference in its entirety: “Method and Apparatus for Single High Voltage Aluminum Capacitor Design,” Ser. No. 60/588,905, filed on Jul. 16, 2004.
TECHNICAL FIELD [0002] This disclosure relates generally to energy storage devices, and more particularly, to method and apparatus for connecting electrodes having apertures. BACKGROUND [0003] There is an ever-increasing interest in making electronic devices physically smaller. Consequently, electrical components become more compact as technologies are improved. However, such advances in technology also bring about additional problems. One such problem involves interconnects between various components and interconnects within components. [0004] Interconnects are especially problematic with devices incorporating multiple layers. One such component is the capacitor. Capacitors provide improved charge storage and energy density using multiple conductive layers and advanced dielectrics. As the layers become more complex and smaller in dimensions, problems arise with interconnections. [0005] Thus, there is a need in the art for improved technologies for interconnects between layered devices. The systems used to interconnect the multiple layers should be readily adapted for manufacturing. The interconnects should form robust connections without damaging the multiple layers and without sacrificing substantial performance of the component. SUMMARY [0006] The above-mentioned problems and others not expressly discussed herein are addressed by the present subject matter and will be understood by reading and studying this specification. [0007] One embodiment of the present subject matter includes an apparatus, comprising: a capacitor stack having a first substantially planar electrode having a first etched portion and a first unetched portion, and a first aperture extending through the first substantially planar electrode and defined by material at least partially including the unetched portion, with a second substantially planar electrode having a second etched portion and a second unetched portion, the first substantially planar electrode and the second substantially planar electrode in alignment such that the first unetched portion and the second unetched portion overlap, and a first weld at least partially disposed through the aperture and connected to the first unetched portion and the second unetched portion; a capacitor case, the capacitor stack disposed in the capacitor case; and electrolyte disposed in the capacitor case. [0008] Additionally, one embodiment of the present subject matter includes an apparatus, comprising: a capacitor stack with a first substantially planar electrode with a first aperture passing through the first substantially planar electrode, and a second substantially planar electrode in overlapping alignment with the first substantially planar electrode, with a weld at least partially disposed through the first aperture, the weld connecting the first and second substantially planar electrodes; a capacitor case, the capacitor stack disposed in the capacitor case; and electrolyte disposed in the capacitor case. [0009] One embodiment of the present subject matter includes an electrolytic capacitor stack having at least a first substantially planar electrode with an unetched portion, the unetched portion at least partially defining a first aperture passing through the first substantially planar electrode; at least a second substantially planar electrode in overlapping alignment with the first substantially planar electrode, and a first weld at least partially disposed through the first aperture and connecting the first and second substantially planar electrodes, wherein the unetched portion is produced by a process comprising: depositing a curable resin mask onto the electrode; curing the curable resin mask to the electrode; etching the electrode, the cured mask restricting the etch; removing the cured mask from the electrode; and anodizing the electrode. [0010] Additionally, one embodiment of the present subject matter includes an apparatus, comprising: a capacitor stack having a first substantially planar electrode having a first connection means for connection of the first substantially planar electrode to an electrode and a second substantially planar electrode having a second connection means for connection of the second substantially planar electrode to the first substantially planar electrode, wherein the first connection means and the second connection means are electrically connected. [0011] This Summary is an overview of some of the teachings of the present application and not intended to be an exclusive or exhaustive treatment of the present subject matter. Further details about the present subject matter are found in the detailed description and appended claims. Other aspects will be apparent to persons skilled in the art upon reading and understanding the following detailed description and viewing the drawings that form a part thereof, each of which are not to be taken in a limiting sense. The scope of the present invention is defined by the appended claims and their legal equivalents. BRIEF DESCRIPTION OF THE DRAWINGS [0012] FIG. 1 is a perspective view of a flat capacitor according to one embodiment of the present subject matter. [0013] FIG. 2A is a top view of an anode for use in constructing a capacitor according to one embodiment of the present subject matter. [0014] FIG. 2B is a top view of a cathode for use in constructing a capacitor according to one embodiment of the present subject matter. [0015] FIG. 3A is a top view of an anode for use in constructing a capacitor according to one embodiment of the present subject matter. [0016] FIG. 3B is a top view of a cathode for use in constructing a capacitor according to one embodiment of the present subject matter. [0017] FIG. 4 is an exploded partial perspective view of capacitor stack layers, according to one embodiment of the present subject matter. [0018] FIG. 5 is a partial cross section view of connection members in a stack, according to one embodiment of the present subject matter. [0019] FIG. 6 is a partial perspective view of capacitor stack connection members, according to one embodiment of the present subject matter. [0020] FIG. 7 is a partial perspective view of cut capacitor stack connection members, according to one embodiment of the present subject matter.
DETAILED DESCRIPTION [0021] The following detailed description of the present subject matter refers to subject matter in the accompanying drawings which show, by way of illustration, specific aspects and embodiments in which the present subject matter may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present subject matter. References to “an”, “one”, or “various” embodiments in this disclosure are not necessarily to the same embodiment, and such references contemplate more than one embodiment. The following detailed description is demonstrative and not to be taken in a limiting sense. The scope of the present subject matter is defined by the appended claims, along with the full scope of legal equivalents to which such claims are entitled. [0022] Power sources with stacked planar or substantially planar electrodes are used to power electronic devices. For example, flat electrolytic capacitors having stacked foils are used in implantable medical devices such as implantable cardioverter defibrillators. Capacitors include anodes and cathodes, and in various embodiments, the anodes and cathodes are divided into interconnected foil shaped subcomponents. [0023] The anodes, cathodes, and separator subcomponents are stacked in alignment, in various embodiments. Some embodiments include layered subcomponents with connection members used for interconnecting multiple layers. In some of these embodiments, a connection member protrudes from the main body of the capacitor stack for interconnection to other connection members and/or to terminals and other components. For example, a number of anode connection members extend away from a capacitor stack for interconnection of multiple capacitor anode subcomponent layers. Connection members are additionally used for cathode subcomponents, in some embodiments. [0024] Some capacitor layers of the present subject matter are organized into elements. Elements simplify manufacturing, in various embodiments. Various examples of an element include at least one anode layer and at least one cathode layer. A number of elements may be interconnected to form a capacitor stack. Elements are used during capacitor construction to customize capacitor parameters, such as size, shape, power, and voltage, in various embodiments. For example, elements of a standard size, having a selected thickness, can be used to create multiple capacitors of varying thicknesses. [0025] FIG. 1 shows a flat capacitor 100 constructed according to one embodiment of the present subject matter. Although capacitor 100 is a D-shaped capacitor, in various embodiments, the capacitor is another shape, including, but not limited to, rectangular, circular, oval or other symmetrical or asymmetrical shapes. In various embodiments, capacitor 100 includes a case 101 which contains a capacitor stack 102. In one embodiment, case 101 is manufactured from a conductive material, such as aluminum or titanium. In various embodiments, the case is manufactured using a nonconductive material, such as ceramic or plastic. [0026] Capacitor 100 includes a first terminal 103 and a second terminal 104 for connecting capacitor stack 102 to an outside electrical component. In some embodiments, the capacitor is connected to cardiac rhythm management circuitry, including defibrillator, cardioverter, and pacemaker circuitry. In some embodiments, terminal 103 is a feedthrough assembly insulated from case 101. In some embodiments, terminal 104 is directly connected to case 101. In various embodiments, the capacitor incorporates additional connection structures and methods. The present subject matter incorporates by reference, but is not limited to, additional connection structures and methods illustrated on or around pages 12-13, 59-60, 63-82 of related and commonly assigned Provisional U.S. patent application “Method and Apparatus for Single High Voltage Aluminum Capacitor Design,” Ser. No. 60/588,905, filed on Jul. 16, 2004, incorporated herein by reference. [0027] Capacitor stack 102 includes at least one cathode, at least one separator, and at least one anode. The capacitor is electrolytic, in various embodiments. Some capacitor components are illustrated through break lines 164, 166 for explanation. In various embodiments, the components occupy a stack of layered subcomponents. In some embodiments, these components are organized into capacitor elements 105A, 105B, 105C, . . . , 105N, illustrated through break line 166. In various embodiments, capacitor stack 102 is formed in two steps, including a first step of stacking capacitor components into two or more elements 105A, 105B, 105C, . . . , 105N, and a second step of stacking elements into a capacitor stack 102. Additional embodiments include forming a capacitor stack in a single step, or three or more steps. [0028] In various embodiments, the cathode includes at least one substantially planar electrode. Various cathode embodiments are metallic. Some cathode examples include a plurality of substantially planar layer subcomponents which are interconnected. Some of these interconnected groups are organized into elements. [0029] In various embodiments, the cathode is coupled to conductive case 101. In some of these embodiments, terminal 104 is attached to conductive case 101, providing a connection between the cathode and outside components such as circuitry. In some embodiments, the cathode is coupled to a feedthrough conductor extending through one or more feedthrough assemblies. [0030] In various embodiments, a separator is used for insulating anodic subcomponents from cathodic subcomponents. Insulation can be provided with an air gap. However, in additional embodiments, one or more sheets of insulative material, such as kraft paper, isolate the anode from the cathode. In some of these embodiments, separator papers provide various functions, such as wicking electrolyte for deposition around the anode and the cathode. Separators can also assist in shaping electrical fields to reduce instances of breakdown. [0031] In various embodiments, capacitor stack 102 includes at least one substantially planar anode. Varying examples include a plurality of substantially planar layer subcomponents interconnected using a variety of methods and structures, including welding. Some embodiments are organized into elements. In various embodiments, an anode includes aluminum, tantalum, hafnium, niobium, titanium, zirconium, and combinations of these metals. In one embodiment, at least portions of a major surface of each anode is roughened and/or etched to increase its effective surface area. This increases the capacitive effect of the anode on a volumetric basis. [0032] In various embodiments, an anode component may include several anode subcomponents which are electrically connected. In some of these embodiments, the anode subcomponents are physically interconnected and fixed together. [0033] One or more interconnected electrodes comprising the anode are coupled to feedthrough assembly 103 for electrically connecting the anode to circuitry outside the case, in various embodiments. In some embodiments, multiple anode feedthrough assemblies are used. In some embodiments, the anode is coupled to conductive case 101. In anodic case embodiments, the cathode is coupled to a feedthrough assembly and isolated from case 101. Some anodic case embodiments can use terminal 103, which is attached to conductive case 101, to providing a connection between the anode and outside components such as circuitry. In other embodiments, both the anode and the cathode are connected to components through one or more feedthrough assemblies which are isolated from case 101. [0034] Various capacitor stack configurations are within the scope of the present subject matter. Some embodiments include nine cathode subcomponent layers, twenty separator subcomponents, and twenty-eight anode subcomponents. One of these embodiments includes a combination of nine elements, with two additional separators and two additional anode layers. One way to form such a combination includes stacking eight elements including three anode layers and one element including two anode layers. The number of layers, and the number of elements, is selectable by a capacitor stack design and manufacturing process to achieve a desired capacitor power and thickness, in various embodiments. [0035] Additional capacitor stack embodiments include eighteen cathodes, twenty-two separators, and fifty-eight anodes. Some of these embodiments include a combination of nineteen elements, with two additional separators and two additional anode layers. One way to form such a combination includes stacking eighteen elements including three anode layers and one element including two anode layers. [0036] Additional embodiments, which do not feature these exact numbers of anodes, cathodes, and separators, fall within the scope of the present subject matter. In various additional embodiments, a separator disposed between electrode layers may include one, two, or more sheets of a separator material, such as kraft paper, in various embodiments. The number of layers, and the number of elements, are selectable by capacitor stack design and manufacturing processes to achieve a desired capacitor power and thickness, in various embodiments. [0037] In various embodiments, the electrodes of the present subject matter are adapted to deliver improved energy levels. Various embodiments include a capacitor stack adapted to deliver between 7.0 Joules per cubic centimeter of capacitor stack volume and 8.5 Joules per cubic centimeter of capacitor stack volume. Some embodiments are adapted to deliver about 7.7 Joules per cubic centimeter of capacitor stack volume. In some embodiments, the anode has a capacitance of between approximately 0.70 and 0.85 microfarads per square centimeter when charged at approximately 550 volts. In various embodiments, these ranges are available at a voltage of between about 410 volts to about 610 volts. [0038] In various embodiments, the stack is disposed in a case, and linked with other components, a state which affects some of these values. For example, in one packaged embodiment, including a case and terminals, the energy density available ranges from about 5.3 Joules per cubic centimeter of capacitor stack volume to about 6.3 Joules per cubic centimeter of capacitor stack volume. Some embodiments are adapted to deliver about 5.8 Joules per cubic centimeter of capacitor stack volume. In various embodiments, these ranges are available at a voltage of between about 410 volts to about 610 volts. The present subject matter additionally includes, but is not limited to, embodiments disclosed on or around pages 30-34 of related and commonly assigned Provisional U.S. patent application “Method and Apparatus for Single High Voltage Aluminum Capacitor Design,” Ser. No. 60/588,905, filed on Jul. 16, 2004, incorporated herein by reference. [0039] FIG. 2A shows an anode 202 according to one embodiment of the present subject matter. Anode 202 is shown before it is assembled into a capacitor stack, such as capacitor stack 102, illustrated in example FIG. 1A. Anode 202 includes a main body portion 204 having one or more connection members 206. In one embodiment, connection member 206 includes one or more distinct members attached to the anode by welding, staking, or by using another connection method and/or structure. [0040] In various embodiments, connection member defined by an excise performed on anode. In some of these embodiments, connection member protrudes from anode 202, defining a protruding connection member 206. It is understood that the shape of connection member may be achieved with additional shaping operations, such as casting or forging, without departing from the scope of the present subject matter. It is additionally understood that connection member maybe be comprised of a secondary structure which is attached to anode 202 using welding, in various embodiments. Additional embodiments employ other fixating methods and to attached a secondary structure to a main anode body without departing from the scope of the present subject matter. [0041] In various embodiments, anode 202 is processed to increase its surface area. In some embodiments, anode 202 is exposed to an etchant. In some of these embodiments, portions of anode 202 are etched, and portions of connection member 206 are not etched along with the rest of anode 202. In one of these embodiments, a resin mask is put on portions of connection member 206 to keep those masked portions from becoming etched during the etching process. As is discussed herein, this provides for unetched, non-porous sections which improve the weldability of anode edges with respect to each other. The present subject matter additionally includes, but is not limited to, embodiments disclosed on or around pages 102-106-, 115-119 of related and commonly assigned Provisional U.S. patent application “Method and Apparatus for Single High Voltage Aluminum Capacitor Design,” Ser. No. 60/588,905, filed on Jul. 16, 2004, incorporated herein by reference. [0042] In one embodiment, the present subject matter includes capacitor stack having at least a first substantially planar electrode having a first connection member with an unetched portion. In the embodiment, the unetched portion at least partially defines a first aperture passing through the first connection member. The embodiment also includes at least a second substantially planar electrode having a second connection member in alignment with the first connection member defining a first connection surface. In the embodiment, the first and second connection members are connected, with the first aperture at least partially adjacent the second connection member, and where the unetched portion is produced by a process comprising: depositing a curable resin mask onto the electrode; curing the curable resin mask to the electrode; etching the electrode, the cured mask restricting the etch; removing the cured mask from the electrode; and anodizing the electrode. The present subject matter incorporates by reference, but is not limited to, additional connection structures and methods illustrated on or around pages 102-106, 115-119 of related and commonly assigned Provisional U.S. patent application “Method and Apparatus for Single High Voltage Aluminum Capacitor Design,” Ser. No. 60/588,905, filed on Jul. 16, 2004, incorporated herein by reference. [0043] Protruding connection member 206 includes a proximal section 208 and distal section 210. In the embodiment of FIG. 2A, connection member 206 is an L-shaped member. However, it can have other shapes. In one embodiment, a portion of a distal section 210 along its outer edge is unetched, as discussed above. [0044] In one embodiment, proximal section 208 is connected to main body 204 and is defined in part by a pair of cut-out portions 212 and 214 located on opposing sides of proximal section 208. Distal section 210 is connected to a portion of proximal section 208, in various embodiments. In some embodiments, it is integral with proximal section 208. Distal section 210 is attached as a separate member, in some embodiments. In one embodiment, distal section 210 is defined in part by a cut-out portion 216 which is located between main body 204 and distal section 210, and a cut-out portion 218 which separates distal section 210 from main body 204. In this embodiment, connection member 206 is positioned within the overall D-shape of anode 202. In various embodiments, connection member 206 extends outside the D-shape of anode 202. The exact size of the connection member, and its placement with regards to the main body, is provided here for demonstration only, and it is understood that additionally embodiments, employing additional ratios of connection member size to main body size, and employing additional positioning schemes, are possible, without departing from the scope of the present subject matter. [0045] Additionally pictured are apertures 252, 254. In various embodiments, apertures are circular. Apertures shaped otherwise are possible without departing from the scope of the present subject matter. In various embodiments, the apertures have an interior surface or face which is substantially orthogonal to the material through which the aperture pass. In some embodiments, apertures range from about 0.010 inches in diameter to about 0.025 inches in diameter. Some embodiments are larger than 0.025 inches. Various embodiments range from about 0.010 inches in diameter to about 0.012 inches in diameter. Aperture diameters are tied, in part, to the capability of manufacturing equipment, in various embodiments. Apertures, in various embodiments, are punched or drilled. In some embodiments, apertures are manufactured with processes producing a diameter within +/−0.001 inches of an intended diameter. Apertures, in various embodiments, are cylindrical or barrel shaped. In some additional embodiments, apertures are shaped like a partial cone. [0046] Layers having apertures can be joined to other layers at the aperture in a number of ways. For example, in one embodiment the aperture, or rather the material defining the aperture, is welded to an adjacent layer. For example, in one embodiment welding is provided by a Lumonics JK702 Nd-YAG laser welder using settings of approximately 1.4 Joules at a frequency of 100 hertz. The laser power is approximately 110 Watts, the pulse height is approximately 22%, and the pulse width is approximately 1.4 msec. In various embodiments, the pulse width ranges from about 1.0 ms to about 2.5 ms and the energy level ranges from about 0.8 J to about 2.0 J. Some processes use a laser beam diameter which is from about 0.008 inches to about 0.011 inches. The laser beam is applied around the aperture and a layer adjacent the aperture. Additional embodiments are joined otherwise. Some embodiments are joined with a solid state welding process, such as a spot weld. [0047] Some embodiments include apertures which have an occluding skin in an unwelded state, and which are apertures in a welded state. For example, in some embodiments, occluded apertures are formed with a punching or pressing process such that a skin remains and extends along a face of the layer with the skin occluding what would otherwise be an aperture. The skin, in various embodiments, melts during a welding operation, and defines an aperture. [0048] Various processes join multiple layers using apertures. For example, in one embodiment, a stack of multiple anode layers are interconnected at apertures 252, 254. IN additional embodiments anode layers and cathode layers are interconnected at apertures. In one embodiment, a number of anodes and cathodes are first interconnected, and then these interconnected layers are separated into electrically isolated. Various examples of separation, including cutting, are disclosed in this application. It should be noted that while two apertures are illustrated, one is possible. In additional embodiments, more than two are used. [0049] In some embodiments, each anode in capacitor stack 102 includes a connection member such as connection member 206. But other configurations are possible. For example, in one embodiment, one anode layer in stack of multiple abutting and interconnected anodes has a connection member 206, while the remaining anode layers in the stack do not have connection members. To illustrate, one embodiment includes a three-layer anode stack having one layer with a connection member 206 and two layers without connection members. The two layers without connection members are welded, staked, or otherwise interconnected to the layer having the connection member. Apertures can be used for this interconnection. In embodiments having apertures, welding occurs proximal the material defining the aperture and adjacent layer. In various embodiments, a weld is drawn along this connection surface. [0050] FIG. 2B shows a cathode 302 according to one embodiment of the present subject matter. Cathode 302 is shown before it is assembled into capacitor stack, such as the capacitor stack 102 shown in FIG. 1. Cathode 302 includes a main body portion 304 having one or more connection members 306. In various embodiment, connection member 306 is an integral portion of cathode 302, and is punched, laser-cut, or otherwise shaped from the cathode. In additional embodiments, connection member 306 includes one or more separate members attached to the cathode by welding, staking, or through other methods. The present subject matter additionally includes, but is not limited to, embodiments disclosed on or around pages 13-29 of related and commonly assigned Provisional U.S. patent application “Method and Apparatus for Single High Voltage Aluminum Capacitor Design,” Ser. No. 60/588,905, filed on Jul. 16, 2004 on or around pages, incorporated herein by reference. In various embodiments, portions of connection member 306 are not coated in a titanium coating. [0051] In one embodiment, connection member 306 includes a proximal section 308 and a distal section 310. In various embodiments, connection member 306 is an L-shaped member. However, additional embodiments have other shapes. In one embodiment, proximal section 308 is connected to main body 304 and is defined in part by a pair of cut-out portions 312 and 314 located on opposing sides of proximal section 308. Distal section 310 is connected to a portion of proximal section 308. In one embodiment, it is integrated with proximal section 308. In some embodiments, distal section 310 is attached as a separate member. In one embodiment, distal section 310 is defined in part by a cut-out portion 316 which is located between main body 304 and distal section 310, and a cut-out portion 318 which separates distal section 310 from main body 304. In this embodiment, connection member 306 is located within the general shape or outline of cathode 302. In various embodiments, connection member 306 extends further from the main body of cathode 302 or connection member 306 is more internal within the main body of cathode 302. [0052] For instance, in various embodiments, connection members 206 and 306 may be in different positions along the edges or even within the main body portions of the capacitor layers 202 and 302. For instance, in some embodiments connection members 206 and 306 are located along edges 220 and 320 of the respective electrodes 202 and 302. In some embodiments, the portions are located along curved edges 222 and 322 of the respective electrodes 202 and 302. In various embodiments, the portions may be cut-out within main bodies 204 and 304. [0053] In one embodiment, proximal section 308 of cathode 302 and proximal section 208 of anode 202 are located in different positions (relative to each other) on their respective electrodes, while distal sections 210 and 310 are generally commonly positioned. For instance, in one embodiment connection members 206 and 306 of the anode 202 and the cathode 302, respectively, are mirror images of each other. In some embodiments, connection members 206 and 306 have generally reverse images of each other. In some embodiments, connection members 206 and 306 can have different shapes or sizes relative to each other. For example, the distal portions on either the anode or the cathode can be longer or shorter than its opposing distal portion. [0054] FIGS. 3A and 3B show an anode 202′ and a cathode 302′ according to one embodiment of the present subject matter. Anode 202′ and cathode 302′ are shown before being assembled into capacitor stack 102 as shown in FIG. 1. Anode 202′ and cathode 302′ are generally similar to anode 202 and cathode 302, respectively, except connection member 206′ does not include a cut-out such as cut-out 212 of anode 202 and connection member 306′ does not include a cut-out such as cut-out 318 of cathode 302. Various embodiments utilize other shapes and locations for connection members such as connection members 206, 206′, 306, and 306′. [0055] FIG. 4 is an exploded partial perspective view of capacitor stack layers, according to one embodiment of the present subject matter. The example illustrates one cathode layer 302A disposed between anode layers 202A, 202B. Additionally, the illustration depicts an anode group comprising anode layers 202B, 202C, and 202D. A capacitor stack of the present subject matter is not limited to this arrangement and configuration of anodes and cathodes; these illustrations are provided for discussion of one variant. For example, the exploded view excludes separator papers, which are disposed between anode layers and cathode layers in some embodiments. [0056] Various capacitor embodiments include connection members 206A-D. In some of these embodiments, connection members are used to create an anode connection surface. In the example illustration, the connection members include an unetched portion 402A-D, and a gradient 420A-D between etched areas and unetched areas is visible. In various embodiments, creating an unetched portion 402A-D includes applying a mask to an anode layer during various production steps, or applying an etchant. The present subject matter additionally includes, but is not limited to, embodiments disclosed on or around pages 32-34 of related and commonly assigned Provisional U.S. patent application “Method and Apparatus for Single High Voltage Aluminum Capacitor Design,” Ser. No. 60/588,905, filed on Jul. 16, 2004, incorporated herein by reference. Also, various embodiments include cathodes with titanium substantially absent, as is discussed above. [0057] In varying embodiments apertures 406, 408, 410, 412, 414 are selectively distributed with respect to each other. In one embodiment, the apertures are circular. It is understood that other embodiments may have other shapes without departing from the scope of the present subject matter. In various embodiments, the apertures are positioned so as to not overlap while the layers are stacked in alignment. Using this method, a stack of electrode layers can be formed by moving a laser welding apparatus along a first axis and welding each layer to another layer placed on the stack. If the process employs only the first axis, cycle time required to weld the adjacent layers to one another can be reduced. [0058] Welded layers, in various embodiments, create a physical and electrical connection. Selectively distributing apertures and connecting layers at the apertures provides a method for maintaining precision layer alignment. An added benefit is that the layers are electrically interconnected. Component size is reduced because of the high accuracy of welding operations, and the small size of apertures. Additionally, manufacturing efficiency benefits as the process does not require filler metal. Although filler metal is not required, the present subject matter is additionally compatible with processes using filler metal. [0059] FIG. 5 is a partial cross section view of connection members in a stack, according to one embodiment of the present subject matter. The capacitor stack includes anode layers 202A-D, and cathode layer 302A. In various embodiments, the stack includes apertures 506, 508, 510, 512, 514, which, in various embodiments, are used for interconnecting additional components. In some embodiments, these capacitor stack layers are interconnected with laser welds 502A-N. [0060] In various embodiments, two apertures can be located in a single layer, such as apertures 506 and 510. In additional embodiments, a layer has a single aperture, such as layer 202B. The arrangement of apertures is arbitrary, in that an aperture can be placed in any location and in any number within a layer. However, the selection is chosen, in various embodiments, to accomplish various objectives. One objective is to physically connect one layer to another in alignment. By welding the layers together, the layers are physically connected. By welding the layers as they are stacked, they maintain alignment during the stacking process. Dimensional accuracy in stacking is realized using this stacking method. Another objective is to electrically interconnect multiple layers. For example, in various embodiments, anode layers 202A-D can be electrically connected. Other objectives include enabling the creation of an anode connection surface by putting a series of edge faces into alignment for attachment of a terminal. [0061] The following method is one way to create a capacitor stack. The method includes placing a first layer 202D on a working surface. The method then places a second layer 202C in alignment with the first layer 202D, and welds the second layer 202C to the first layer 202D along a connection surface. In various embodiments, a connection surface is defined by contacting portions in the vicinity of aperture 514 and first layer 202D. The weld can include filler material, or consume portions of one or both of the first layer 202D and the second layer 202C. This method of stacking and welding can be repeatedly used to form a capacitor of any desired thickness. [0062] Interconnection options are increased by selecting various aperture configurations. This is illustrated, in various embodiments, by the distances D1, D2, and D3. By selecting D1 to be smaller than D2, the process allows that the second layer 202C can be welded to the first layer 202D along a connection surface at aperture 514. By selecting distance D2 to be less than distance D3, the process ensures that layer 202D′ is stackable onto layer 202A in a manner which enables attachment. Other layers can be stacked onto the pictured stack and attached to the layers using apertures so long as the distances between the apertures of respective layers are selected such that material defining an aperture of one layer is adjacent material of another layer. [0063] Additionally, various methods to create a capacitor stack include disposing a third layer 202B onto connected layers 202C and 202D. The third layer 202B, in various embodiments, is connected to the second layer 202C at the connection surface defined by the contact between aperture 508 and second layer 202C. A connection between layers 202B and 202C is created which physically constrains them and connects them electrically. [0064] In various additional embodiments, a separator layer may be disposed between the third layer 202B and a cathode layer 302A. A separator layer may comprise one or more layers of kraft paper. The cathode layer 302A may be stacked onto an existing stack, such as stack 202B-D. A separator layer can then be disposed between cathode layer 302A and anode 202A. [0065] It should be noted that in some embodiments, a separator layer does not extend to a connection surface. For example, an area for connection may extend away from a main capacitor stack portion. In these embodiments, connection members may be overlaid upon each other without separator. The connection members may all be interconnected, by a process such as edge welding. This includes connecting anodes to cathodes. The connection members are then separated with a cut, isolating the anodes from the cathodes, a process which, in some embodiments, leaves cathode portions which have been cut away from the main cathode connected to anode connection members. This is true also for embodiments in which portions of anode are cut away from the main anode and are interspersed among cathode connection members. In any of these embodiments, it is possible to create a connection surface without separator layers. [0066] The illustration demonstrates weld 502A connecting cathode 302A to layer 202A. Additionally, weld 502B connects layer 202A to layer 202B. In various embodiments, one or more layers are deformed to achieve connection, in various embodiments. For example, in one embodiment, layer 202A is deformed toward layer 202B to compensate for the presence of cathode layer 302A. [0067] In some embodiments, the connection of layers 202A-D and 302 defines an element. In various embodiments, the element is electrically connected, and physically constrained in an alignment. In various embodiments, a cut may be made be made along line 520 to isolate anodes from cathodes. [0068] Layer 202D′ is included to demonstrate that additional capacitor subcomponents can be stacked onto the existing element. Additional components also benefit from apertures used for interconnection. For example, layer 202D′ can be interconnected to an element including layers 202A-D at aperture 512′ with weld 502N′. [0069] FIG. 6 shows a stack 700 of one or more alternating anodes 202 and cathodes 302. Connection members 206 and 306 are overlaying and underlying each other. As used herein, overlay and underlay refer to the position or location of portions of the layers which are commonly positioned from a top view. In various embodiments, connection members 206 and 306 have some commonly positioned portions relative to each other and some portions which are exclusively positioned relative to each other. [0070] For instance, proximal sections 208 of anodes 202 are exclusively positioned or located. This means that at least a portion of proximal sections 208 do not overlay or underlay a portion of cathodes 302. Likewise, proximal sections 308 of cathodes 302 are exclusive portions and include at least a portion not overlaying or underlaying a portion of anode 202. Conversely, distal sections 210 and 310 are commonly positioned and each includes at least a portion overlaying or underlaying each another. Cut-out portions 214 and 314 are also commonly positioned. Cut-out 218 is commonly positioned with cut-out 312 while cut-out 212 is commonly positioned with cut-out 318. [0071] When stacked as shown, the edges of distal sections 210 and 310 form a surface 610. In this embodiment, surface 610 can generally be described as having a first portion 410A which fronts the proximal sections 208 of anodes 202, a second portion 410B which fronts common cut-portions 214 and 314, and third portion 410C which fronts the proximal sections 308 of cathodes 302. [0072] In this embodiment, distal sections 210 and 310 of anode connection member 206 and cathode connection member 306 are fully overlaying one another. Fully overlaying means that there are generally no gaps along surface 610 of stack 602 when the anodes and cathodes are stacked as in FIG. 6. The fully overlaid structure of stack 602 provides a complete surface 610 which provides for ease of edge-welding or otherwise connecting connection members 206 and 306 together. Additionally, various embodiments leave one or more gaps in surface 610 when the anodes and cathodes are stacked. For instance, in some embodiments, one or more of distal sections 210 or 310 may not reach all the way across front surface 610. [0073] After being stacked, in various embodiments, at least portions of connection members 206 and 306 are connected to each other. For instance, in some embodiments, portions of distal sections 210 and 310 are connected to each other. In additional embodiments, distal sections 210 and 310 are edge-welded along surface 610. Additional embodiments include configuration where distal sections 210 and 310 are only connected along portion 410A and 410C of surface 610. Some embodiments also include configuration where distal sections 210 and 310 are soldered along surface 610. In various embodiments, portions of distal sections 310 and 210 are staked, swaged, laser-welded, or connected by an electrically conductive adhesive. Various embodiments include capacitor stacks where portions of proximal sections 208 are connected to each other and/or portions of proximal sections 308 are connected to each other. [0074] In additional embodiments, apertures 650, 652 are used for interconnection anodes 202 and cathodes 302. One or more apertures may be used. The material defining the apertures in layer 202 is joined to layer 302 along a connection surface in the vicinity of the aperture. Various methods of joining are included in the present subject matter, including laser welding. It should be noted that various configurations of apertures are possible, in part, to ensure adjacent materials are positioned for connection. One embodiment staggers the apertures so that a process can include a repeating cycle of placing a layer and welding a layer, resulting in a stack which includes multiple interconnected anode layers and multiple interconnected cathode layers. [0075] In various embodiment, after connection, portions of connection members 206 and 306 are removed or separated so that proximal sections 208 and 308 are electrically isolated from each other. As used herein, electrically isolated means that sections 208 and 308 are electrically insulated from each other at least up to a surge voltage of capacitor 100. [0076] FIG. 7 shows stack 700 after portions of distal sections 210 and 310 (pictured in FIG. 6) have been removed from the stack, forming a cleave 702 between anode connection members 206, which together comprise anode connection surface 708, and cathode connection members 306, which together comprise cathode connection section or surface 710. Cleave 702 in the present embodiment electrically isolates surface 708 from surface 710. Cathodes in surface 710 are connected to anode portions with welds disposed along a connection surface inside apertures such as aperture 652. Additionally, anodes are connected to cathode portions in surface 708 along a connection surface inside apertures such as aperture 650. [0077] Portions of cathodes remaining on anode connection section or surface 708 have the titanium substantially absent from the aluminum substrate, enabling a weld which is substantially free of titanium. Welds which are substantially free of titanium develop improved oxides, which decreases leakage current in various examples. [0078] Proximal sections 308 are still electrically coupled to each other as are proximal sections 208. In some embodiments, cleave 702 is a thin slice. In some embodiments, cleave 702 is as wide as cut-outs 214 and 314, as shown in FIG. 6. In some embodiments, an electrically insulative material is inserted in cleave 702. In various embodiments, cleave 702 is formed by laser cutting, punching, and/or tool or machine cutting. [0079] One benefit of stacking anodes and cathodes as such as that the formation of anode connection surface 708 does not require excessive bending of anodes. For example, if portions of cathodes did not separate anodes, the anodes would have to be pressed together to deform into an anode connection surface. By allowing cathodes portions which are electrically isolated from the cathode of the capacitor to occupy the spaces between anode connection members, the need for these compressive forces is reduced, resulting in less bending stress on anodes, which can reduce instances of anode breakage. [0080] Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement which is calculated to achieve the same purpose may be substituted for the specific embodiment shown. This application is intended to cover adaptations or variations of the present subject matter. It is to be understood that the above description is intended to be illustrative, and not restrictive. Combinations of the above embodiments, and various embodiments, will be apparent to those of skill in the art upon reviewing the above description. The scope of the present subject matter should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. 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21, 2006Nov 16, 2006Poplett James MMethod and apparatus for connecting capacitor electrodesUS20090044404 *Oct 14, 2008Feb 19, 2009Cardiac Pacemakers, Inc.Method for connecting electrodes having aperturesUS20090059472 *Nov 11, 2008Mar 5, 2009Cardiac Pacemakers, Inc.Method for interconnecting anodes and cathodes in a flat capacitorUS20100134955 *Mar 4, 2009Jun 3, 2010Greatbatch Ltd.Electrically connecting multiple cathodes in a case negative multi- anode capacitor* Cited by examinerClassifications U.S. Classification361/301.4International ClassificationH01G4/30Cooperative ClassificationA61N1/3975, A61N1/375, H01G9/055, H01G9/008, H01G9/14European ClassificationH01G9/008, H01G9/14, H01G9/055Legal EventsDateCodeEventDescriptionApr 22, 2005ASAssignmentOwner name: CARDIAC PACEMAKERS, INC., MINNESOTAFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHERWOOD, GREGORY J.;REEL/FRAME:016503/0887Effective date: 20050421Jan 14, 2010FPAYFee paymentYear of fee payment: 4Mar 30, 2010CCCertificate of correctionJan 15, 2014FPAYFee paymentYear of fee payment: 8RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services

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Old school dieting - Kindle edition by Aidas Sungaila. Health, Fitness & Dieting Kindle eBooks @ Amazon.com.
Old school dieting [Print Replica] Kindle Edition
by Aidas Sungaila (Author)
Ever wondered what exactly "old school bodybuilders" diet looked like? Every gym has a bro with training routine which belongs to the Golden Era. Yet nobody questions what type of diet they followed to get into stage shape.
This book is written in an easy-to-understand way. That's why it doesn't matter if you are an experienced coach or average Joe. Both parties can extract value from this book equally. Those methods might be boring yet they are bulletproof.
ASIN: B075BV3DFH
Amazon Best Sellers Rank: #604,565 Paid in Kindle Store (See Top 100 Paid in Kindle Store)
#2264 in Kindle Store > Kindle eBooks > Health, Fitness & Dieting > Diets & Weight Loss > Diets > Weight Maintenance
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This item: Old school dieting

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Search results for Country Studies, Sudan, Available Online, 2000/2099, Worden, Robert L., Online Text, Federal Research Division | Library of Congress
Results: 1-2 of 2 | Refined by: Part of: Country Studies Remove Available Online Remove Date: 2000 to 2099 Remove Contributor: Worden, Robert L. Remove Online Format: Online Text Remove Part of: Federal Research Division Remove

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Raider fan looking at the Huskers - Nebraska - Scout
Raider fan looking at the HuskersSteve Ryan06/27/2006Nebraska head coach Bill Callahan has probably heard over the last few years, that kids followed him when he was with the Raiders. Of course, much of that has to do with the fact that Nebraska has invaded California for a lot of its recent prep talent. Well, the old gig is still getting the third year coach recognized and one running back wouldn't mind seeing his west coast style work in Nebraska.You'd think that Bill Callahan's last season with the Raiders might have left a slightly bad impression with fans, especially those of the Raiders. You know, that whole dumbest team in America comment, which seemed to precipitate the eventual departure of the current Husker head coach.Stockton, California running back Curtis Shaw remembers Callahan's stint with the Raiders, remembering quite fondly the year before that, when he led the Raiders to the Super Bowl. And he did it with an offense Shaw instantly liked. "That's the kind of offense I would like to play in, because you don't pass to much that the running game isn't that big of a deal, and you don't run too much, that is all teams prepare for," Shaw said. "There's good balance and that's the kind of offense I like."A good balance of offense for a very balanced back, Shaw coming off a 1,600+ yard rushing performance as a junior, where he 21 touchdowns, and he threw in 102 yards receiving as well. The balance really comes in, though, when you look at his versatility physically, Shaw standing 6 foot and around 190 pounds, running a reported 4.5/40, but he's also got a mammoth 35 inch vertical. Just looking at that, you can see how much more balanced he could be, from both a running and receiving standpoint. What Shaw believes is his biggest asset, though, isn't so much what he can do, but more with what he can see, which he would tell you is a lot. "My vision is definitely my strength," he said. "I think I am very aware of the entire field, so I can make my adjustments really quickly during a play."The numbers Curtis put up last year are pretty darn good, no matter what grade you are and no matter your size. For Shaw, however, he thinks he's just scratched the surface. With a good team back this year, and a lot more experience under his belt, Curtis is ready to turn his game up a few notches for his final year of prep ball. "I'm going for over 2,000 yards and 40 touchdowns," Shaw said. "The more I have gained experience, the more natural the game has become for me. I don't even think about running anymore. I just do it and I am ready to have a big year."If Shaw does accomplish his goals, he'll become more popular than he already is. Sporting double-digit offers, Shaw's name has been rising up the charts steadily, of the more coveted backs on the west coast. Of course, with recruiting nowadays, Shaw sees that you don't need a whole lot of offers in order to get a whole lot of attention. "Washington text messages me like almost every single day," Curtis said of the Huskies. "Michigan has been picking things up too. The recruiting is fun and I am enjoying it, but it makes you wonder just what it's going to be like later on."That has been a trend of sorts this year, as many recruits, some of the best in the country, have opted to make an early decision, not wanting to extend this recruiting circus any longer than they have to. For Curtis, though, it's not the attention which will make him figure out his school anytime soon. It's about knowing where you want to go, of course, something he says he isn't even close to figuring out. He just knows what he's looking for from a school."Good schooling and a good opportunity to play early – those are the biggest things on my list," Curtis said. "I want to see a place where I fit in, but they have to have great academics and it has to be a team I like and I feel I fit well in what they do."Nebraska is one of those teams Shaw is looking at, but he'll be straightforward as to why. No, sorry Husker fans, it's not the five national titles, the 60-3 record in a five year period during the 90s and it has nothing to do with the stadium sellouts since 1962. It has to do with the Raiders and their former coach."I like coach Callahan. I have actually talked to him a couple of times," Shaw said. "I really liked his offense, but he's a nice guy and I really like what he's doing over there at Nebraska."That basically summarizes what Shaw knows about Nebraska, stating that about the only other thing he knew about it was that it was in the central part of the country. But that's what the off-season is for, and out of the many schools he's trying to learn about, Nebraska does make the list. "It's going to be a long process for me, because I need to know a lot about where I might go," Curtis said. "Nebraska will be one of those places I will look into and figure out for myself how it might fit me and what I do.""I'm looking at everyone like that right now and location doesn't mean a thing. I am just looking at the best place for me."
Share on Facebook Share on TwitterTrending on ScoutTop 100 Stadium Experiences of 2016Four-Star ATH Moves Around VisitsCoach Speak: Chris WalkerBig Commitments From the WeekendCali Four-Star DB Checks out SECNebraska visitor primer (1-13-17) Full StoryBig Red Report Top StoriesCoach Speak: Chris WalkerLincoln East head coach John Gingery talks about the newest Husker Chris Walker.by Josh HarveyBig Red Report9:17 AMFour-Star ATH Moves Around VisitsLos Angeles (Calif.) Salesian athlete Deommodore Lenoir was scheduled to take an official visit to North Carolina over the weekend but decided to take an unofficial trip to North…by Greg BigginsScout FootballYesterday at 7:29 PMCali Four-Star DB Checks out SECPasadena (Calif.) Muir defensive back Elijah Blades has been committed to Florida for some time now and took his official visit over the weekend.by Greg BigginsScout FootballYesterday at 5:23 PMCommitment Analysis: Tyjon LindseyScout takes a look at what Nebraska is getting with their new WR commit, Las Vegas (Nev.) Bishop Gorman standout Tyjon Lindsey…by Greg BigginsScout FootballYesterday at 3:20 PMHawkins sees Nebraska with Cal trip loomingBuena Park (California) high school wide receiver Jeremiah Hawkins visited Nebraska for the second time.by Josh HarveyBig Red ReportYesterday at 2:44 PMWilliams sees Curl Sunday nightMuskogee (Oklahoma) defensive back Kamren Curl is making his announcement this week and got to meet new Nebraska defensive backs coach Donte' Williams for the first time on Sunday…by Josh HarveyBig Red ReportYesterday at 9:51 AMWalker is Huskers No. 17Nebraska prep Chris Walker is taking time to talk over his commitment status with family.by Josh HarveyBig Red ReportYesterday at 8:09 AMNebraska Lands a Huge CommitmentAfter de-committing from Ohio State last week, Las Vegas (Nev.) Bishop Gorman wide out Tyjon Lindsey will stay in the Big 10 and has decided to play for Nebraska.by Greg BigginsScout FootballSaturday at 9:21 AMHuskers hire DiacoNebraska to name former UCONN head coach Bob Diaco their newest defensive coordinator.by Josh HarveyBig Red ReportFriday at 3:06 PMNebraska visitor primer (1-13-17)A look at Nebraska's visitors this weekend.by Josh HarveyBig Red ReportFriday at 8:01 AMGrimes hits social mediaNebraska wide receiver prospect Randal Grimes was on periscope during his trip home from Lincoln.by Josh HarveyBig Red ReportYesterday at 1:44 PMBig Commitments From the WeekendScout takes a look at some of the bigger commitments around the country on the first official visit weekend after the dead period...by Brandon HuffmanScout FootballYesterday at 11:00 AMLoad More

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2007 Bowman Orange Conor Jackson 51 250 DIAMONDBACKS | eBay Please enable JavaScript Our new search experience requires JavaScript to be enabled. Please enable JavaScript on your browser, then try again.
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Talk Liberty: Broward Libertarian Open Mic - Libertarian Party of Broward County Florida (Fort Lauderdale, FL)
Talk Liberty: Broward Libertarian Open Mic
The Church of Perpetual Life It's an exciting time to be Libertarian. Please share this event and invite your friends! All our meetings are open to the public. Snacks & Refreshments provided. Let's Talk Liberty! More info: www.lpbroward.org
Like our Facebook Page: http://fb.com/LPBroward
Join our Facebook Group: http://facebook.com/groups/browardlibertarians
Follow our Tweets: http://twitter.com/lpbroward * As part of our new and ongoing charity food drive, please be encouraged to bring with you a can of food or any non-perishable food item, to help feed the poor and hungry in our community. * Join or login to comment.
tyler d. I would like to contribute. Does it bother anyone if I bring the beer to this one? If no objections expect that I'm bringing it. 2 · May 26, 2014 Omar The more beer the better. 1 · June 7, 2014 Alex V. We all thank you Tyler for providing the beer even though you were unable to attend. Very generous of you! Thanks so much bro. Until next time, cheers. 0 · June 20, 2014 bill w. I AM GOING! 1 · June 19, 2014 Omar I'm going to be late, I have another meeting to attend. 0 · June 18, 2014 Alex V. Free Drinks & Snacks Tomorrow! Also, as part of our new and ongoing charity food drive, please be encouraged to bring with you a can of food or any non-perishable food item, to help feed the poor and hungry in our community. 1 · June 18, 2014 Ben B. It looks like I will be also be attending a Bitcoin event on that day: http://www.meetup.com/Bitcoin-of-South-Florida/events/188069242/ 0 · June 9, 2014 6 went
HardcoreFTW
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