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P. 1La Innovación en el IslamLa Innovación en el IslamRatings: (0)|Views: 20
|Likes: 0Published by Jihad Jihad SoaresMore info:Published by: Jihad Jihad Soares on Aug 14, 2013Copyright:Attribution Non-commercialAvailability:Read on Scribd mobile: iPhone, iPad and Android.download as PDF, TXT or read online from ScribdFlag for inappropriate content|Add to collectionSee moreSee lesshttp://www.scribd.com/doc/160126329/La-Innovacion-en-el-Islam04/30/2014pdftextoriginal You're Reading a Free Preview
Added to My Library Click again to add to a collection Removed from your Library A Jahilia e a cultura árabe
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Brilliant location easy to access an useful having a parking space in front of. The house. - Review of COASTAL HOME WITH HOT-TUB AND WiFi, Lytham St Anne's, England - TripAdvisor
Brilliant location easy to access an... - COASTAL HOME WITH HOT-TUB AND WiFi
“Brilliant location easy to access an useful...”
NWlJXzczX2JENQ==
“Brilliant location easy to access an useful having a parking space in front of. The house.”
Liked best: huge bed
Liked least: so much room
Just back from two night stay.
Great location near to the beach and St Anne's square and the illuminations.
Very clean,comfortable and well equipped and spacious for a family.
Lovely warm welcome from Deborah when we arrived.
“clean, spacious, well equipped house, great location, bargain price”
Stayed here with family, the beds were large & so comfortable! Blackout blinds & quiet area ensured we all slept well. Kitchen had everything you could need & the welcome pack was a lovely additional touch. Bedding n towels plentiful n top quality. Living space of 2 lounges, & dining room meant even if weather not perfect, you aren't crowded. Garden was beautiful n had outdoor dining set if you are lucky with weather. Deborah has really thought of everything in this house, right down to toddler age toys n books & good WiFi, it really is a brilliant house to stay in for any family. The price is also great (we couldn't have got 3 rooms at a trashy B&B for what we paid to stay here with all the extra space & facilities). There were bus stops in easy walking distance (cant comment further as we had car), only a couple of miles to Starrgate tram stop (lots of free parking in nearby streets) where you can buy a family 24 hour tram ticket for £10 getting on & off as much as you like (can also use on buses). This allows you to enjoy Blackpool without having to experience the crowds, noise n General manic nature of the place 24/7, & see the lights without having a 3 mile tailback in the car. House is also well placed if calmer walks along sea front at lytham st Anne is more your thing. We will definitely be back, & thoroughly recommend to others, thanks for a great stay.
“Lovely holiday rental.”
Stayed for short break and house was spotlessly clean and well equipped. Bed was so comfortable and had really relaxing holiday. Deborah met us at the property and we were given a very generous welcome pack. Will hopefully stay there again in Spring of next year, if not fully booked up.

type: global

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Svetlana A. Semerikova - Semantic Scholar
Svetlana A. Semerikova
Svetlana A. Semerikova, Vladimir L. Semerikov
A phylogenetic study of firs (Abies Mill.) was conducted using nucleotide sequences of several chloroplast DNA regions with a total length of 5580 bp. The analysis included 37 taxa, which represented… (More)
While many species were confined to southern latitudes during the last glaciations, there has lately been mounting evidence that some of the most cold-tolerant species were actually able to survive… (More)
Svetlana A. Semerikova, Vladimir L. Semerikov, Martin Lascoux
Aim The main aim of the present study is to infer the post-glacial history of Abies species from north-east Asia and to test the hypotheses that coastal Abies populations suffered less from climatic… (More)
Genetic variation and population differentiation in Siberian fir Abies sibirica ledeb. inferred from allozyme markers
Genetic variation in 24 populations of Siberian fir Abies sibirica Ledeb. from the Urals, West Siberia, East Siberia, South Siberia, and the Baikal region were examined using allozyme markers. Three… (More)
Svetlana A. Semerikova, Martin Lascoux, Vladimir L. Semerikov
The genus Abies is one of the largest conifer genera and many of the marginal species remain poorly characterized. Abies semenovii B. Fedtsch. is a rare mountain fir species from central Asia, and… (More)
Mitochondrial DNA variation and reticulate evolution of the genus Abies
The sequences of three regions of mitochondrial DNA (mtDNA) of a total length of 5226 bp were used to study the phylogeography of the genus Abies. The mtDNA haplotype network, comprising 36 studied… (More)
Nucleotide diversity and linkage disequilibrium of adaptive significant genes in Larix (Pinaceae)
Vladimir L. Semerikov, Svetlana A. Semerikova, Maria A. Polezhaeva
Nucleotide polymorphism in genes potentially responsible for the adaptation to the latitudinal gradient of climate was investigated in the Siberian larch (Larix sibirica). The genes were selected… (More)
The diversity of chloroplast microsatellite loci in Siberian fir (Abies sibirica Ledeb.) and two Far East fir species A. nephrolepis (Trautv.) Maxim. and A. sachalinensis Fr. Schmidt
The genetic variability in 29 populations of Abies sibirica, three of A. nephrolepis, and seven of A. sachalinensis was studied using SSR markers of chloroplast DNA. Among ten primer pairs examined,… (More)

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Amazon.co.uk: Watch Parks and Recreation - Season 1 | Prime Video
(162)IMDb8.620097 SeasonsSuitable for ages 12 and overSubtitles and Closed CaptionsX-Ray
parks and recreation ron swanson gets better leslie knope parks and rec nick offerman amy phoeler amy poehler aziz ansari bang theory big bang chris pratt michael scott story line ever made well written like the office aubrey plaza david brent rashida jones
4.0 out of 5 starsA bit short but enjoyable

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The Cherokee Indians With Special Reference to Their Relations with the United States Government by Parker, Thomas Valentine: The Grafton Press, New York City Hardcover, First Edition; First Printing. - The Ridge Books
Home Parker, Thomas Valentine The Cherokee Indians With Special Reference to Their Relations ...
Published by The Grafton Press, New York City, 1907
VG+ - NF. Light wear and corner bumps. Square and securely bound with no parting or tears. Some pages are still uncut. ; The Grafton Historical Series; B & W Illustrations; 8vo 8" - 9" tall; 116 pages; Relatively scarce title on the Cherokee Indians. This copy is quite attractive. Bookseller Inventory # 7362
Title: The Cherokee Indians With Special Reference ...
Publisher: The Grafton Press, New York City

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SALE Crochet Baby Hat and Booties Set Knit Peach Pom-Pom | Etsy
SALE - Crochet Baby Hat and Booties Set - Knit Peach Pom-Pom Hat and Boots with Butterflies - Butterfly Girl Gift Infant Clothes
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SALE - Crochet Baby Hat and Booties Set - Knit Peach and White Pom-Pom Hat and Boots with Butterflies - Infant Gift Clothes
Cute pom-pom hat and booties set crocheted in peach baby wool and finished with little butterfly embellishments. The hat circumference is approximately 20 inches (52cm) and the booties have a sole length of approximately 4 inches (10cm) - these should fit a baby up to 9-12 months.
10% of the sale price of all items in my store is donated to Kiva, an NGO providing loans to people in developing countries.
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hat and shoes

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Reagan Got $1 Million for Speeches, Commentary in 2 Years - The Washington Post
Reagan Got $1 Million for Speeches, Commentary in 2 Years
By Brooks Jackson, Jerry L, auer; Reprinted permission of The Wall Street Journal; Copyright (c) 1980 and Dow Jones & Company Inc. All rights rese By Brooks Jackson, Jerry L, auer; Reprinted permission of The Wall Street Journal; Copyright (c) 1980 and Dow Jones & Company Inc. All rights rese July 1, 1980
Ronald Reagan's talk wasn't cheap.
He charged savings-and-loan executives $10,000 for one speech. Florida lumber dealers paid him $8,000 for another. The turkey industry, in turn, scratched up $7,500.
Even the Boy Scouts had to be prepared -- to pay a fee of $5,000.
In all, Reagan received about $1 million for his speeches and commentary during nearly two years of undeclared campaigning before his formal entry into the presidential race last Nov. 13.
Although he was already a wealthy man, Reagan toiled assiduously at his profitable enterprise, giving 128 paid speeches in 22 months. He spoke to bankers, chiropractors, surgical-instrument salesmen and dentists. He addressed egg producers, Taiwanese businessmen, insulation contractors, highway lobbyists and the National Association of Truck Stop Operators.
All this was entirely proper. And Reagan's fees weren't any larger than those commanded by such figures as Gerald Ford, Alexander Haig and Arthur Burns, whose speeches aren't half as entertaining as Reagan's.
Furthermore, nobody has contended that the business and professional groups that paid Reagan large fees were trying to influence his policy positions. Reagan's views have been unshakably pro-business since the 1950s; in speaking to these groups, he was preaching to the choir.
An examination of Reagan's speaking business reveals his as a man with a keen eye for the dollar. His basic fee doubled last year, jumping to $10,000 when his managers discovered that others were getting that much. Earlier Reagan charged $5,000 each for appearances at 12 GOP fund-raising events -- which left some Republicans miffed.
"He was running, for president and charging us for it," says H. G. Taylor, Republican chairman of Macon County, Ill. Taylor calls it the only time in his 30 years' experience in politics that a party figure wanted money to appear at such an affair. Richard Nixon and John Connally spoke without charge, he recalls.
Once, local Democrats raised a fuss when Reagan charged a fee to address a United Way charity fund-raising function in the Midwest. Michael Deaver, the veteran Reagan political adviser who arranged his speaking schedule, doesn't recall the size of the fee or the exact site. He does recall that Reagan gave a rebate, but of only half the fee. "He was in the business of giving speeches," he notes.
He adds that the ex-governor of California was "sensitive" about charging for charity affairs and gave about 20% of all his speeches gratis. Reagan nevertheless accepted two fees for Boy Scout fund-raising appearances in California last year, $2,500 to address a San Gabriel Valley group and $5,000 for a talk in Bakersfield.
Reagan's financial success put him in demand at numerous investment seminars where the well-to-do paid several hundred dollars each to hear economic experts advise them what to do with their money.
Morgan Maxfield, a seminar impresario from North St. Louis, Mo., says Reagan received standing ovations at seminars last year in Dallas, Miami and New York. Maxfield recalls that Reagan, the son of an Illinois shoe merchant, related how he raised money as a boy by gathering empty pop bottles and returning them for their deposits.
Reagan also told how he did well by buying and holding stocks in the 1950s and 1960s, but he advised his listeners that volatile conditions at the time of the seminars made it more prudent to build liquidity, Maxfield says.
Reagan did well at building his own liquidity. After deducting expenses for staff salaries and such, he netted $296,102 last year -- and about the same amount in 1978 -- from his speaking engagements and, to a far lesser extent, from his radio program and newspaper column.
This income, together with investments in stock and real estate, has helped push Reagan's net worth to probably more than $2 million, up from 1.5 million at the end of 1975.
Being so prosperous, Reagan is likely to find the issue of his taxes arising in the fall campaign, as it did during the 1976 Republican presidential primaries. Attention focused then on his entirely legal but nevertheless politically embarrassing avoidance of all California state income tax in 1970.
This time Reagan will be pressed to match President Carter's example by publishing his federal income-tax returns. Reagan hasn't done so yet because of distaste for "invasion of privacy," aides say.
What would such a disclosure show? "I can guarantee you he didn't pay any more taxes than he had to," says his personal attorney and financial adviser, William French Smith. But Smith say his client has paid "substantial" taxes and that, while he has been audited more than once by the Internal Revenue Service, the reviews were "quite normal."
Taxes aside, Mr. Reagan's financial triumphs on the speaking circuit could become political liabilities this fall. The Democrats are considering whether to make an issue of the Republican candidate's speech-making income from business groups. "It's a marriage made on Wall Street," says one Democratic Party official, trying out a possible campaign zinger.
Such a tactic could backfire, however. "A lot of our Senators do the same thing," the same Democrat says.
Reagan stopped charging for speeches when he formally entered the presidential contest, but he can count on several continuing sources of income. He still gets $17,714.04 a year as a pension from the state of California. He receives interest on aBeverly Hills bank account, an account that probably amounts to more than $500,000. And he gets more than $50,000 a year in interest on a mortgage he holds on a 771-acre ranch he sold a few years ago for over $750,000.
Though it pays no current cash returns, the real estate Reagan still owns is worth more than $1 million, and its value is apparently rising.
His 688-acre Rancho del Cielo in Santo Barbara County was purchased in 1974 for $526,000. It is difficult to estimate how much more the property is worth today because special taxing provisions prohibit its development for at least another 10 years. The ranch still carries a mortgage of more than $250,000 at an attractive 8% annual interest.
The Reagan home in Pacific Palisades, paid off several years ago, is easily worth $500,000. Neighboring houses fetch around $1 million.
But Reagan now holds little or no corporate stock. He sold almost all his holdings last year for more than $750,000. The money went into that Beverly Hills bank account, although some way have been withdrawn this year to pay capital-gains taxes on the sale.
Among the stocks sold were more than $250,000 in Continental Illinois Properties, $100,000 in First Union Bancorp., more than $100,000 in Western Bancorp. and lesser holdings in Archer-Daniels-Midland Co., Dart Industries Inc., Detroitbank Corp. and some other companies.
Did Reagan sell to eliminate possible conflicts of interest? He may have been just taking his own investment advice.
Maxfield, the investment adviser, says Reagan was predicting a collapse of auto sales as long ago as October 1978, well before the auto slump materialzed, and was predicting a sharp housing decline as early as last September, two weeks before the Federal Reserve Board began credit-tightening moves that sent home-mortgage rates skyrocketing to unaffordable levels. Reagan counseled that in such times "liquidity is an important thing," Maxfield recalls.
So the personal forecasting of Reagan, who once studied economics at Eureka College in Illinois, today sounds pretty good. He got big fees for talking, but he put his money where his mouth was.

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Overpriced & overrated - Review of Panorama Mesdag, The Hague, The Netherlands - TripAdvisor
Overpriced & overrated - Panorama Mesdag
Website Improve this listing Ranked #4 of 172 things to do in The Hague 1,390 Reviews
See the most recent reviews FloortjeNL
15 helpful votes “Overpriced & overrated”
You basicly pay 10 euro's to see one painting. I was done within a minute. I think The Hague has much nicer museums like the Escher museum. The painting is nice sure, but I don't think it was worth my visit. Won't go again, wouldn't recommend it.
Helpful? Thank FloortjeNL Report Ask FloortjeNL about Panorama Mesdag
Chinese (Traditional) first Chinese (Simplified) first Danish first Dutch first English first French first German first Greek first Hebrew first Indonesian first Italian first Japanese first Korean first Norwegian first Polish first Portuguese first Russian first Spanish first Swedish first Turkish first Any JuneP63
The first part of this gallery shows photographs taken at a 360 degree perspective - interesting but not 100% relevant to the area that you are visiting, although interesting if you like photography which we do. On the second floor is the panaramic painting of The Hague and area which you could quite happily pull up a deck chair and sit on the sand dunes (artificial but real sand) just to watch the painting as there is always something new to look at. Would be quite happy sititng for a couple of hours it is so well done.
Helpful? Thank JuneP63 Report Ask JuneP63 about Panorama Mesdag
61 helpful votes “An unbvelieveable panorama”
Having visited today's rather depressing, overbuilt and unattractive Scheveningen, it was a delight to "experience" this historic panorama, which is relay realistic. Well worth a visit.
Helpful? Thank oldmayor Report Ask oldmayor about Panorama Mesdag
30 helpful votes “Panorama Mesdag, my all time favourite Museum!”
Whenever I am in The Hague I love to go to Panorama Mesdag. I have been so many times to this museum and still can't get enough of it. It's so magical! The view is never the same. On a sunny day the colours of the painting are light and sunny and on a dark day the sky and the sea are greyish. Scheveningen, I spent a great deal of my youth there. For me Panorama Mesdag is like going back in time.
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128 helpful votes “Unique Historic Perspective”
The beautiful seaside landscape and historic perspective of Scheveningen and The Hague in this panorama from a-top a sand dune is probably what will impress most visitors. It is a fascinating look back in time when life on the coast was a lot quieter and the dependency on the ocean and sea farers was close and real. Well worth a visit.
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Hilton The Hague1,568 Reviews The Hague, South Holland Province0.0 miles from Panorama MesdagShow Prices Carlton Ambassador Hotel580 Reviews The Hague, South Holland Province0.1 miles from Panorama MesdagShow Prices Delta Hotel31 Reviews The Hague, South Holland Province0.2 miles from Panorama MesdagShow Prices easyHotel Den Haag City Centre248 Reviews The Hague, South Holland Province0.3 miles from Panorama MesdagShow Prices Hotel Des Indes, a Luxury Collection Hotel917 Reviews The Hague, South Holland Province0.4 miles from Panorama MesdagShow Prices Paleis Hotel439 Reviews The Hague, South Holland Province0.4 miles from Panorama MesdagShow Prices More Parkhotel Den Haag626 Reviews The Hague, South Holland Province0.4 miles from Panorama MesdagShow Prices Stadsvilla Hotel Mozaic Den Haag306 Reviews The Hague, South Holland Province0.4 miles from Panorama MesdagShow Prices Hotel Sebel128 Reviews The Hague, South Holland Province0.4 miles from Panorama MesdagShow Prices Less Hotels near Panorama Mesdag Browse nearby


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P. 1ReadmeReadmeRatings: (0)|Views: 0|Likes: 0Published by Roberto MartinezMore info:Published by: Roberto Martinez on Jan 04, 2012Copyright:Attribution Non-commercialAvailability:Read on Scribd mobile: iPhone, iPad and Android.download as TXT, PDF, TXT or read online from ScribdFlag for inappropriate content|Add to collectionSee moreSee lesshttps://www.scribd.com/doc/77093679/Readme01/04/2012pdftextoriginal Activity (0)FiltersAdd to collectionReviewAdd NoteLikeShowingAllMost RecentReviewsAll NotesLikesYou've already reviewed this. Edit your review.Rating 0/5Post notePost reviewPost replyPost note and likeNo activity yetLoad more
More From This UserPhenom IIX4 955Roberto Martinez


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DANCE ELEMENTAL - Ecstatic Dance Journey - 1st Saturdays Tickets, Sat, Nov 4, 2017 at 8:00 PM | Eventbrite
Bellydance for All Bodies
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Sign up early with a friend and get a sweet deal! TWO admitted for $25

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SSRIs, bone mineral density, and risk of fractures--a review. - PubMed - NCBI
AbstractFormatSummarySummary (text)AbstractAbstract (text)MEDLINEXMLPMID ListApplySend to:Choose DestinationFileClipboardCollectionsE-mailOrderMy BibliographyCitation managerFormatSummary (text)Abstract (text)MEDLINEXMLPMID ListCSVCreate File1 selected item: 19541458FormatSummarySummary (text)AbstractAbstract (text)MEDLINEXMLPMID ListMeSH and Other DataE-mailSubjectAdditional textE-mailDidn't get the message? Find out why...Add to ClipboardAdd to CollectionsOrder articlesAdd to My BibliographyGenerate a file for use with external citation management software.Create File
See comment in PubMed Commons belowEur Neuropsychopharmacol. 2009 Oct;19(10):683-92. doi: 10.1016/j.euroneuro.2009.05.001. Epub 2009 Jun 21.SSRIs, bone mineral density, and risk of fractures--a review.Schwan S1, Hallberg P.Author information1Uppsala County Council, Uppsala Drug Information Center, Sweden.AbstractA possibility for selective serotonin reuptake inhibitors (SSRIs) to increase the risk of bone fracture has been debated during recent years. Proposed causes include an ability for the drugs to reduce bone mineral density (BMD). Experimental data have identified a functional 5-HT system in bone, although its role is unclear. Results from numerous epidemiological studies are heterogeneous and several different associations have been suggested; between depression and low BMD, SSRIs and low BMD, depression and falls, SSRIs and falls, depression and fractures, and SSRIs and fractures. In this paper, we review the available data and discuss the various study results. Based on the current available data, we conclude that it is not possible to determine whether SSRIs may negatively influence bone regulation or are innocent bystanders. It is likely that only a large, prospective, long-term study designed to investigate changes in BMD will be able to answer the question.PMID: 19541458 [PubMed - indexed for MEDLINE] SharePublication Types, MeSH Terms, SubstancesPublication TypesReviewMeSH TermsAccidental Falls/statistics & numerical dataAnimalsBone Density/drug effects*Depression/complications*Depression/drug therapyDepression/epidemiologyFractures, Bone/chemically induced*Fractures, Bone/complicationsFractures, Bone/epidemiologyFractures, Bone/etiologyHumansIn Vitro TechniquesRiskSerotonin Uptake Inhibitors/adverse effects*Serotonin Uptake Inhibitors/therapeutic useSubstancesSerotonin Uptake InhibitorsLinkOut - more resourcesFull Text SourcesElsevier ScienceClinical KeyOther Literature SourcesAccess more work from the authors - ResearchGateMedicalClinicalTrials.govBone Density - MedlinePlus Health InformationDepression - MedlinePlus Health InformationFractures - MedlinePlus Health InformationPubMed Commons home

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X30 at mountains and coast: Fujifilm FinePix Talk Forum: Digital Photography Review
Took my X30 with me a couple of times recently...I'd almost forgotten how much I love those Fuji colors.
Coast above Bodega Bay, California.
simano • Forum Member • Posts: 50
In reply to CMCM • 7 months ago
Beautiful shots CMCM!!
TwoMetreBill • Senior Member • Posts: 1,491
Just FYI, a perfect lens will be sharpest wide open. In the view camera world and a few Leica lenses exhibited this characteristic. Of course perfect lenses don't actually exist but it is common for the lenses on the better point and shoot cameras to be designed for maximum sharpness at or close to wide open.
OP CMCM • Senior Member • Posts: 4,565
Papa48 • Senior Member • Posts: 1,386
Snapsh0t • Senior Member • Posts: 2,332
Any loss of sharpness beyond f4 is probably due to diffraction rather than the lens. It really becomes a severe problem with small sensor cameras, to the point where some superzooms are diffraction-limited wide open.
Sactojim • Veteran Member • Posts: 7,400
Very attractive photos and my favorite getaway when it's too hot here in Sacramento (like this week)! Headed back to N. Cal/S. Oregon soon along the 101 and Hwy 1.
Some Bodega Bay pics here from my various Kodak Pixpro cams. www.flickr.com/photos/125889350@N03
That's very good to know, Sactojim. It raises impressions of the PixPro line up a bit, seeing your comments. The prices sure are reasonable.

value: This website is a website about digital cameras and digital photography, established in November 1998. The website provides comprehensive reviews of digital cameras, lenses and accessories, buying guides, user reviews, and forums for individual cameras, as well as general photography forums.


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HEPA Pre & Post Replacement Filter For Dyson DC41 DC65 Animal Vacuum Cleaner 699943038135 | eBay
wanzichen1020 (1294 )
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Details about HEPA Pre & Post Replacement Filter For Dyson DC41 DC65 Animal Vacuum Cleaner
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Krud Kutter Gutter Cleaner,No GC32/6, Krud Kutter Inc
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Patent US8184692 - Distributed and automated video encoding and delivery system - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inAdvanced Patent SearchPatentsAt a user or client site, a user initially visits a website hosted by a partner, and following an initial interaction with the website, the user is provided with various software from an administrator website. The software enables the user to download information, such as a video file, to the partner...http://www.google.com/patents/US8184692?utm_source=gb-gplus-sharePatent US8184692 - Distributed and automated video encoding and delivery systemAdvanced Patent SearchPublication numberUS8184692 B2Publication typeGrantApplication numberUS 11/903,770Publication dateMay 22, 2012Filing dateSep 24, 2007Priority dateSep 25, 2006Also published asUS20080084926, US20130114666, WO2008039512A2, WO2008039512A3Publication number11903770, 903770, US 8184692 B2, US 8184692B2, US-B2-8184692, US8184692 B2, US8184692B2InventorsJaime Arturo Valenzuela, Hassan Hamid Wharton-AliOriginal AssigneeFramecaster, Inc.Export CitationBiBTeX, EndNote, RefManPatent Citations (25), Non-Patent Citations (2), Referenced by (2), Classifications (43), Legal Events (1) External Links: USPTO, USPTO Assignment, EspacenetDistributed and automated video encoding and delivery systemUS 8184692 B2Abstract At a user or client site, a user initially visits a website hosted by a partner, and following an initial interaction with the website, the user is provided with various software from an administrator website. The software enables the user to download information, such as a video file, to the partner website. The information is encoded in a format that was pre-selected by the partner so that the delivery process is streamlined for the partner. In addition, for further efficiency, the delivery process from the user to the partner is implemented substantially simultaneously with the encoding.
M = ζ Δ t ( 1 ) Thus, to ensure sustained video packet transmission while simultaneously encoding such packets in the data stream, a packet of compressed video data of size ζ or a multiple of size ζ should be produced in the time interval Δt or multiple time interval of Δt.
GOPSize = 1 I � M � Δ t ( 2 ) Where the GOP size in turn is the sum of the sizes of the P, B and I frames that make it. Calling the sum of the sizes of all of the P frames ρ and the sum of the sizes of all of the B frames β and the size of the I frame γ, we obtain:
ρ + β + γ = 1 I � M � Δ t ( 3 ) By the GOP definition it is known that there is only one I frame, whose size and resolution can vary, but it can be set to be constant or constrained, for example, to be no greater than half of the original frame size. Therefore it is to be a constant and thus a known parameter. Also, B and P frames are relatively close in size except that the quality of the B frames is generally better than P frames as they both use adjacent frame information in their creation. Therefore, the number of B frames included in a GOP, if any, can be incorporated into the quality coefficient I. These assumptions produce the simplified equation below:
ρ = 1 I � M � Δ t - γ ( 4 ) To produce a constant bit rate stream that is optimized for a given connection or file transfer rate, a GOP must contain a number of P (or a combination of B and P) frames whose sizes add up to ρ as shown in the above equation. The number of P (or a combination of B and P) frames can be pre-set by the user or it can be calculated by the system. Equation (4) can be simplified using (1) such that:
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS5146325 *Apr 29, 1991Sep 8, 1992Rca Thomson Licensing CorporationVideo signal decompression apparatus for independently compressed even and odd field dataUS5565920 *May 26, 1995Oct 15, 1996The Trustees Of Princeton UniversityMethod and apparatus for video data compression using temporally adaptive motion interpolationUS5818537 *Dec 2, 1996Oct 6, 1998Canon Kabushiki KaishaImage processing method and apparatus for converting between data coded in different formatsUS6339619 *Jul 29, 1999Jan 15, 2002Victor Company Of Japan, Ltd.Moving picture bitstream conversion apparatus and method thereofUS6680976 *Jul 28, 1998Jan 20, 2004The Board Of Trustees Of The University Of IllinoisRobust, reliable compression and packetization scheme for transmitting videoUS6847682 *Feb 1, 2002Jan 25, 2005Hughes Electronics CorporationMethod, system, device and computer program product for MPEG variable bit rate (VBR) video traffic classification using a nearest neighbor classifierUS6944221 *Jul 28, 1997Sep 13, 2005Koninklijke Philips Electronics N.V.Buffer management in variable bit-rate compression systemsUS6956901 *Apr 29, 2004Oct 18, 2005International Business Machines CorporationControl strategy for dynamically encoding multiple streams of video data in parallel for multiplexing onto a constant bit rate channelUS7047305Mar 30, 2000May 16, 2006Vidiator Enterprises Inc.Personal broadcasting system for audio and video data using a wide area networkUS7215384 *Mar 22, 1999May 8, 2007Intel CorporationMethod and apparatus for simplifying field prediction motion estimationUS7382796 *Feb 19, 2003Jun 3, 2008Visible World, Inc.System and method for seamless switching through bufferingUS7450182 *Feb 18, 2005Nov 11, 2008Hitachi, Ltd.Image display apparatus and picture quality correctionUS7505590 *Nov 14, 2003Mar 17, 2009Hewlett-Packard Development Company, L.P.Method and system for providing transcodability to frame coded streaming mediaUS7773581 *Mar 11, 2005Aug 10, 2010Ericsson AbMethod and apparatus for conferencing with bandwidth controlUS7912090 *Apr 10, 2008Mar 22, 2011Microsoft CorporationBi-level and full-color video combination for video communicationUS7965771 *Feb 27, 2006Jun 21, 2011Cisco Technology, Inc.Method and apparatus for immediate display of multicast IPTV over a bandwidth constrained networkUS20020172281 *Mar 30, 2001Nov 21, 2002Raymond MantchalaMPEG encoder control protocol for on-line encoding and MPEG data storageUS20030018978Mar 4, 2002Jan 23, 2003Singal Sanjay S.Transfer file format and system and method for distributing media contentUS20050089104 *Oct 28, 2004Apr 28, 2005Samsung Electronics Co., Ltd.Video decoding method and apparatus for providing error detectionUS20050111545 *Nov 25, 2003May 26, 2005Ram PrabhakarDynamic packet size control for MPEG-4 data partition modeUS20050248802 *Jun 30, 2003Nov 10, 2005Toshio NomuraImage data delivery system, image data transmitting device thereof, and image data receiving device thereofUS20060104366 *Nov 16, 2004May 18, 2006Ming-Yen HuangMPEG-4 streaming system with adaptive error concealmentUS20080084926 *Sep 24, 2007Apr 10, 2008Framecaster, Inc.Distributed and automated video encoding and delivery systemEP0961490A2May 11, 1999Dec 1, 1999International Business Machines CorporationInternet convolution audio/video serverEP1463323A1Mar 19, 2004Sep 29, 2004Broadcom CorporationMedia processing system supporting adaptive digital media parameters based on end-user viewing capabilities* Cited by examinerNon-Patent CitationsReference1International Search Report and Written Opinion in International Application No. PCT/US2007/020846, dated Oct. 25, 2010.2 *Pinnacle Systems, MPEG-2 White Paper, Feb. 29, 2000, v0.5, pp. 1-21.* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS8724846 *Jul 16, 2012May 13, 2014Apple Inc.Architecture for exporting digital imagesUS20120281917 *Jul 16, 2012Nov 8, 2012Apple Inc.Architecture for exporting digital images* Cited by examinerClassifications U.S. Classification375/240.02, 386/214, 709/231, 375/240.12, 375/240.03, 386/232, 386/343, 709/233, 386/263, 382/232, 375/240.16, 709/230International ClassificationH04N11/04Cooperative ClassificationH04N21/632, H04N21/443, H04N21/23614, H04N21/8166, H04N21/8586, H04N21/2383, H04N21/8453, H04N21/21, H04N21/25825, H04N21/4348, H04N19/00545, H04N21/23, H04N21/6125, H04N19/00472, H04L65/605, H04L67/306European ClassificationH04N21/21, H04N21/2383, H04N21/236W, H04N21/258C2, H04N21/845F, H04N21/434W, H04N21/23, H04N21/443, H04N21/858U, H04L29/08N29U, H04N7/26T, H04N21/81W, H04N21/63P, H04N21/61D3Legal EventsDateCodeEventDescriptionSep 24, 2007ASAssignmentOwner name: FRAMECASTER, INC., CALIFORNIAFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:VALENZUELA, JAMIE ARTURO;WHARTON-ALI, HASSAN HAMID;REEL/FRAME:019946/0289Effective date: 20070924RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services

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Electronic Brains Audiobook | Mike Hally Square Dog Radio | Audible.com
http%3A%2F%2Fsamples.audible.com%2Fbk%2Fbbcw%2F006774%2Fbk_bbcw_006774_sample.mp3+flashcontent1JMJ4YGSZ27JW73SY7ZT0
by Mike Hally Square Dog Radio Narrated by Mark Whitaker
A series of four programmes which tells the human stories of some of the computer pioneers in three countries, Britain, America and the Ukraine.Each is a little cameo of social history of the early post-war years half a century ago, from a time when, in the words of one of them, 'everything you did was new, no-one had ever done it before'. No anorak needed to enjoy these programmes!
The Lady Behind the Daily Service
Squatters' Paradise
Who Was Wenceslas, and Who Decided He Was Good?

value: This website is an American online audiobook and podcast service that allows users to purchase and stream audiobooks and other forms of spoken word content. This content can be purchased individually or under a subscription model where the user receives "credits" that can be redeemed for content monthly and receive access to a curated on-demand library of content.


text: Top 10 Hotels in Sinsheim, Germany | Hotels.comEnglish (United States)Book online or call 800-246-8357This call is free. 24 hours a day; 7 days a week.HotelsHotel DealsPackages & FlightsGroupsGift CardsHelpWebsite feedbackSign in & AccountSign inCreate an accountYour bookingsReview a hotelHotels.com® RewardsYour bookingsHotelsHotels in GermanySinsheim HotelsHotels in Sinsheim, GermanySearch & Compare Sinsheim HotelsCity, landmark, hotel name, address or zip codeCheck inCheck out I don’t know my datesRooms123456789+Room 1:Adults12345678Aged 18+Children01230-17Age at check in:Child 1:-?-<11234567891011121314151617Show dealsGet Secret Prices on select hotelsThese prices aren’t available to everyone.Unlock nowTrending now in SinsheimHotels in SinsheimMost bookedRatsstubeExcellent 4.2 / 5( 51 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 13 people looked at this hotel in the last hourMost recent review"Off the beaten path a typical German Gasthof with friendly service and family atmosphere. Street construction in front of the hotel made it a little bit difficult to find it with construction noise starting early. During our stay they had issues with the Internet, basically not available the enti..."A Traveller, Sep 2016, USWincent HotelExcellent 4.3 / 5( 36 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 12 people looked at this hotel in the last hourMost recent review"I chose this hotel because the price was reasonable and location was perfect for me for my travel plans. Two other things I was looking for was an included breakfast and free convenient parking. The breakfast was a standard European breakfast that included eggs, bacon and sausages."A Traveller, Oct 2016, USHotel ZehntscheuneExcellent 4.4 / 5( 17 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 6 people looked at this hotel in the last hourHotels within 5 miles of SinsheimOber's LandgasthofGood 3.3 / 5( 8 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 18 people looked at this hotel in the last hourMost recent review"We booked via Expedia based only on reviews and we were more than pleasantly surprised. Our initial concern that the hotel was directly by a railway crossing was quickly alleviated, the railway signals and trains were almost silent and we were not disturbed at all. "A Traveller, Sep 2016, AUHotels within 10 miles of SinsheimBest Western Hotel Bad RappenauExcellent 4.1 / 5( 32 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 57 people looked at this hotel in the last hourMost recent review"This hotel has an excellent breakfast. Staff was very courteous."A Traveller, Oct 2016, USHotel-Restaurant KreuzberghofGood 3.7 / 5( 79 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 15 people looked at this hotel in the last hourMost recent review"Stopped off for one night to visit Sinsheim Museum. Not the closest hotel but a great quiet and secluded lakeside location. "Individual" decor marks it as not belonging to a bland corporate chain. Plenty of on site parking and an excellent restaurant with plenty of choice for a vegetarian couple...."A Traveller, Aug 2015, GBHotel Villa MediciExcellent 4.3 / 5( 36 genuine reviews )Top-rated for business travelersHotels.com® RewardsFor every 10 nights, get 1 free! 12 people looked at this hotel in the last hourMost recent review"Excellent hotel. I wasn't expecting it to be that nice. Large room with a balcony. No air conditioning but they did provide a small fan (more hotels should do this in the summer months). Comfortable and clean. Quiet neighborhood within a few blocks of laid-back bars and restaurants. Park ac..."A Traveller, Aug 2016, USHotel Elsenztal MV GmbHGood 3.8 / 5( 50 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 12 people looked at this hotel in the last hourMost recent review"Fantastic reception, nothing was any trouble to the staff. Many thanks for a wonderful stay."A Traveller, Jul 2016, GBHotel IfenExcellent 4.2 / 5( 86 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 11 people looked at this hotel in the last hourMost recent review"All good - good location, spacious room, helpful staff. The perfect business traveler hotel for someone who doesn't need the overdone "luxury" of a major brand hotel. No gym, room service, though. But otherwise perfect"A Traveller, Nov 2016, USHotel Leo MühlhausenGood 3.5 / 5( 32 genuine reviews )Hotels.com® RewardsFor every 10 nights, get 1 free! 5 people looked at this hotel in the last hourMost recent review"I really enjoyed my stay here only though it was just for a night. The staff was super friendly and willing to help. They answered any questions. The rooms were clean and comfortable."A Traveller, Jul 2015, USSee more hotels in Sinsheim, GermanyRecently bookedHotel Villa Toskana4 starsfrom $99Ringhotel Winzerhof4 starsfrom $84Best Western Plus Palatin Kongresshotel4 starsfrom $75Gästehäuser Villa Verde3 starsfrom $79Hotel Restaurant Erbprinz Walldorf3 starsfrom $73Pay now or later on most roomsFree cancellation on most roomsPrice GuaranteeBest hotels in SinsheimWith hotels.com we help you find the best hotels in Sinsheim, Germany.

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text:
PULSE; Side Dish Now a Centerpiece - The New York Times
Archives|PULSE; Side Dish Now a Centerpiece
PULSE; Side Dish Now a Centerpiece
By KIMBERLY STEVENS NOV. 8, 1998
Cabbage, the mainstay of coleslaw and borscht, isn't known as fancy party fare but lately it's been turning up on elegant tables. Floral designers and party decorators around the city have been incorporating ornamental cabbage in bouquets and arrangements to freshen up the usual posies.
''The last thing you really expect to see in an arrangement is a vegetable,'' said David Stark of Avi Adler Flowers in Brooklyn, who uses cabbage in floral arrangements for benefits and weddings.
Hillary Offenberg, a partner at Fisher & Page, the flower wholesaler to Martha Stewart and many floral designers, gets requests for other vegetables, and fruits as well. ''It's not just cabbage,'' said Ms. Offenberg, adding that pomegranate and persimmon stems are popular, too.
Robert Isabell, the party and floral designer, says the cabbage is not a stand-in for the cabbage rose. ''Oh, it's very suburban,'' he said. ''I use it once in a while when it's appropriate. But I try to avoid it, because it smells like cabbage.''
A version of this article appears in print on November 8, 1998, on Page 9009003 of the National edition with the headline: PULSE; Side Dish Now a Centerpiece. Order Reprints| Today's Paper|Subscribe

value: This website is an American daily newspaper based in New York City with a worldwide readership. Founded in 1851, the Times has since won 132 Pulitzer Prizes, the most of any newspaper, and has long been regarded within the industry as a national "newspaper of record".


text:
Olia Karadjova - Semantic Scholar
Petr Py2
Sven Bacher2
Alain Roques2
Vladimir Krumov2
Gritta Schrader2
5Sergio A. Estay
5Fabio A. Labra
5Leonardo D Bacigalupe
5Roger D. Sepúlveda
3Gritta Schrader
Opinion on the request from the USA regarding export of Florida citrus fruit to the EU 1 EFSA Panel on Plant Health ( PLH )
R Baker, Thierry Candresse, +18 authors David Caffier
Following a request from the EU Commission, the EFSA PLH Panel conducted a scientific opinion on risk analysis and supporting documents provided by APHIS/USDA in support of the request to remove the… (More)
Olia Karadjova, Vladimir Krumov
The present checklist includes data on the species composition, geographic distribution and feeding preferences of thrips species in Bulgaria. In total, 155 species in 48 genera are listed. Of these,… (More)
Diane E. Ullman, James Moyer, +213 authors JR Nechols


text:
Ultimate Ears WONDERBOOM Portable Waterproof Bluetooth Speaker | eBay
Ultimate Ears UE Wonderboom Waterproof Portable Bluetooth Speaker Subzero Blue
Ultimate Ears UE Wonderboom Waterproof Portable Bluetooth Speaker
Ultimate Ears UE Wonderboom Waterproof Portable Bluetooth Speaker Concrete
Details about Ultimate Ears WONDERBOOM Portable Waterproof Bluetooth Speaker
wireless.canada (19054 )
273394638841
Last updated on Jan 09, 2019 12:52:30 EST View all revisions
MPN: 984-000843 UPC: 097855128522
GTIN 0097855128522
MPN 984-000843
UPC 097855128522
eBay Product ID (ePID) 25022835747
by liats33 Jan 16, 2019
UE Wanderboom
The sound quality is good, however there are some short interruptions while playing, because it only works through Bluetooth, and this connection does not always work well..
by temeshe0 Dec 17, 2018
Great sound and great design but no longer working
Upon delivery the product looked and sounded immaculate but after approximately 20 hours of use the device ceases to power on, without any mistreatment or mishandling the device just decided to stop working. Are there issues with other WonderBoom devices?


text:
Solar Robot Instructions - Make_ PDFcast
P. 1Solar Robot Instructions - Make_ PDFcastSolar Robot Instructions - Make_ PDFcastRatings: (0)|Views: 386|Likes: 18Published by SabrinaMeMore info:Categories:Types, Instruction manualsPublished by: SabrinaMe on Nov 17, 2009Copyright:Attribution Non-commercialAvailability:Read on Scribd mobile: iPhone, iPad and Android.download as PDF, TXT or read online from ScribdFlag for inappropriate content|Add to collectionSee moreSee lesshttps://www.scribd.com/doc/22642322/Solar-Robot-Instructions-Make-PDFcast12/07/2012pdftextoriginal Make Little Solar-Roller Robots!
This weekend you can make little teeny tiny robots that are powered by thesun! In the podcast, I made the solar-roller and the instructions for that areright here in this pdf. This pdf includes Gareth Branwyn’s article aboutbeambots from Make: Volume 6.Kits are always a good way to break into a genre of making. Bothsolarbotics.comandpagermotors.comhave some nice kits for you to get
started with includingthe onethat I bought.JunkBots, Bugbots, and Bots on Wheelsis a book worth reading if you get into making little teeny tinyrobots!One of the great things about these little bots is that you can make them fromscavenged materials! Use parts from broken electronics and bring themback to life as little robots!
Activity (13)FiltersAdd to collectionReviewAdd NoteLikeShowingAllMost RecentLikesYou've already reviewed this. Edit your review.Rating 0/5Post notePost reviewPost replyPost note and like1 thousand reads1 hundred readszhalim2001 liked thisQuincy Obioha liked thisPRITAM DEY liked thisLewin Wint liked thiswined liked thisayan28 liked thisdojodojo liked thisVasco Costa Reis liked thisLoad more
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Top 10 Hotels in Muskegon - Muskegon, Michigan | Hotels.comEnglish (United States)Book online or call 800-246-8357This call is free. 24 hours a day; 7 days a week.Hotel DealsPackages & FlightsGroupsGift CardsHelpWebsite feedbackSign in & AccountSign inCreate an accountYour bookingsTrip PlannerReview a hotelHotels.com® RewardsYour bookingsHotelsHotels in United States of AmericaHotels in MichiganMuskegon HotelsHotels near Muskegon, MuskegonHotels in MuskegonSearch all hotels in MuskegonCity, landmark, hotel name, address or zip codeCheck inCheck out Rooms123456789+Room 1:Adults12345678Aged 18+Children01230-17Age at check in:Child 1:-?-<11234567891011121314151617Show dealsGet Secret Prices on select hotelsThese prices aren’t available to everyone.Unlock nowRecently bookedFairfield Inn and Suites by Marriott Muskegon Norton Shores2.5 starsfrom $159Days Inn Whitehall2 starsfrom $85Travelodge Muskegon1.5 starsfrom $75Comfort Inn2.5 starsfrom $130Rodeway Inn2 starsfrom $99Pay now or later on most roomsFree cancellation on most roomsPrice GuaranteeMap of hotels in MuskegonWhat you should know about MuskegonMuskegon in the Muskegon area, Michigan
Are you looking for a cheap Muskegon hotel, a 5 star Muskegon hotel or a family friendly Muskegon hotel? You just landed in the best site to find the best deals and offers on the most amazing accommodations for your stay.
When you search for hotels near Muskegon with Hotels.com, you need to first check our online map and see the distance you will be from Muskegon, Michigan.
Our maps are based on hotel search and display areas and neighborhoods of each hotel so you can see how close you are from Muskegon and refine your search within Muskegon or Michigan based on closest public transportation, restaurants and entertainment so you can easily get around the city. All the hotels details page show an option for free or paid onsite parking.
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Patent US5728600 - Circuit encapsulation process - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign in<nobr>Advanced Patent Search</nobr>PatentsA method for encapsulating portions of a circuit formed on a substrate. The substrate has two faces and perimeter sides. Encapsulating surrounds, in molding compound, a portion of one of the faces of the substrate and a portion of the sides of the substrate, and during encapsulation a portion of the...http://www.google.com/patents/US5728600?utm_source=gb-gplus-sharePatent US5728600 - Circuit encapsulation processAdvanced Patent SearchPublication numberUS5728600 APublication typeGrantApplication numberUS 08/340,162Publication dateMar 17, 1998Filing dateNov 15, 1994Priority dateNov 15, 1994Fee statusPaidPublication number08340162, 340162, US 5728600 A, US 5728600A, US-A-5728600, US5728600 A, US5728600AInventorsJohn R. Saxelby, Jr., Walter R. Hedlund, IIIOriginal AssigneeVlt CorporationExport CitationBiBTeX, EndNote, RefManPatent Citations (55), Non-Patent Citations (4), Referenced by (43), Classifications (12), Legal Events (6) External Links: USPTO, USPTO Assignment, EspacenetCircuit encapsulation processUS 5728600 AAbstract A method for encapsulating portions of a circuit formed on a substrate. The substrate has two faces and perimeter sides. Encapsulating surrounds, in molding compound, a portion of one of the faces of the substrate and a portion of the sides of the substrate, and during encapsulation a portion of the one face of the substrate that bears conductive pads is left unencapsulated.
An encapsulated circuit including a substrate having two faces and perimeter sides around the faces and a circuit formed on the substrate. The substrate also includes conductive pads that are formed on a portion of one of the faces near one of the sides and are connected to the circuit. An integrally formed encapsulating mass encapsulates all of the one face except in the region of the pads, all of the other face except in a region opposite to the region of the pads, and all of the sides.
What is claimed is: 1. A method for encapsulating portions of a circuit formed on a substrate having two faces and perimeter sides, comprisinginserting the substrate into a mold, closing a top of the mold and a bottom of the mold against the substrate, pushing molding compound from a conduit having a top defined by the substrate into a chamber in the mold, and encapsulating, in the molding compound, a first portion of one of the faces of the substrate and a portion of the sides of the substrate, and, during encapsulation, leaving a second portion of the one face of the substrate unencapsulated, the second portion of the one face bearing conductive pads. 2. The method of claim 1, further comprising encapsulating a portion of the other of the faces of the substrate.
3. The method of claim 2, further comprisingleaving a second portion of the other of the faces of the substrate unencapsulated. 4. The method of claim 3, wherein the second portion of the other of the faces bears conductive pads.
5. The method of claim 1, wherein the conductive pads are electrically connected to electronic components, the electronic components being mounted on the substrate and encapsulated in the molding compound.
6. A method for encapsulating portions of a circuit formed on a substrate having two faces and perimeter sides, comprisinginserting the substrate into a mold, the substrate including an active portion on which the conductive pads and electronic components electrically connected to the conductive pads, are mounted, and a waste portion connected to the active portion by a segment in the area of the conductive pads, closing a top of the mold and a bottom of the mold against the waste portion and against the segment of the active portion in the area of the conductive pads, pushing molding compound from a conduit, having a top defined by the waste portion into a chamber in the mold, and encapsulating, in the molding compound, a first portion of one of the faces of the substrate and a portion of the sides of the substrate, and, during encapsulation, leaving a second portion of the one face of the substrate unencapsulated, the second portion of the one face bearing conductive pads. 7. The method of claim 6, wherein the segment includes segments.
8. The method of claim 6, wherein closing the mold comprisescausing a ridge on the top of the mold to extend down against the waste portion and the segment of the active portion in the area of the conductive pads, and causing a first ridge on the bottom of the mold to press up against the waste portion and the segment including the conductive pads. 9. The method of claim 8, further comprisingdefining an end of the conduit with a second ridge on the bottom of the mold. 10. The method of claim 8, further comprisingcausing the top of the mold to extend down against a second segment of the active portion, and causing the bottom of the mold to press up against the second segment. 11. The method of claim 10, wherein the second segment includes segments.
12. The method of claim 10, further comprisingdefining an end of the conduit with a second ridge on the bottom of the mold. 13. The method of claim 1, wherein the top of the mold and the bottom of the mold are separated by the substrate.
14. The method of claim 1, wherein the mold is connected to a compliance mechanism of a press, the press provides an even pressure distribution across the substrate through the compliance mechanism.
15. The method of claim 14, wherein the press includes molds and a compliance mechanism for attachment to each of the molds to enable the press to provide an even pressure distribution across substrates inserted in the molds.
16. The method of claim 14, wherein the compliance mechanism comprises a spring.
17. The method of claim 14, wherein the compliance mechanism comprises a pneumatic cylinder.
18. The method of claim 14, wherein the compliance mechanism comprises a hydraulic cylinder.
19. The method of claim 1, further comprisingcuring the molding compound, removing the substrate with exposed conductive pads from the mold, and cutting away the waste portion and waste molding compound. 20. The method of claim 1, wherein the conduit includes a pot and a runner.
21. The method of claim 20, wherein the pot and the runner are in the bottom of the mold.
22. A method for encapsulating a circuit, comprisinginserting a substrate into a mold, wherein the substrate includes an active portion bearing electronic components and conductive pads for connecting to the components and a waste portion connected to the active portion by a segment in the area of the conductive pads, closing the mold causing a ridge on a top of the mold to extend down against the waste portion and the segment including the conductive pads and causing a first ridge on a bottom of the mold to press up against the waste portion and the segment including the conductive pads, pushing molding compound from a conduit having a top defined by the waste portion and an end defined by a second ridge on the bottom of the mold, into a mold cavity to encapsulate a portion of the active area, leaving the conductive pads exposed. 23. A method for encapsulating circuits, comprisinginserting a substrate into a mold, wherein the substrate includes active portions bearing electronic components and conductive pads for connecting to the components and waste portions connected to the active portions by segments in the areas of the conductive pads, closing the mold causing ridges on a top of the mold to extend down against the waste portions and the segments including the conductive pads and causing first ridges on a bottom of the mold to press up against the waste portions and the segments including the conductive pads, pushing molding compound from conduits having tops defined by the waste portions and ends defined by second ridges on the bottom of the mold, into mold cavities to encapsulate portions of the active areas, leaving the conductive pads exposed. 24. The method of claim 23, wherein the mold is connected to a compliance mechanism of a press, the press provides an even pressure distribution across the substrate through the compliance mechanism.
25. A method for encapsulating portions of a circuit formed on a substrate, comprisinginserting the substrate into a mold, the substrate including an active portion on which conductive pads and electronic components electrically connected to the conductive pads are mounted and a waste portion connected to the active portion by a segment in the vicinity of the conductive pads, closing a top of the mold and a bottom of the mold against the waste portion and against the segment of the active portion in the vicinity of the conductive pads, and pushing molding compound from a conduit, having a top defined by the waste portion, into a chamber in the mold. Description
BACKGROUND This invention relates to circuit encapsulation.
The circuit 10, shown in FIGS. 1a and 1b, for example, has integrated circuit dies (i.e., semiconductor dies) 12, 14 and other electrical components 15, 16, 17, 18 connected by a printed circuit board (PCB) 20. Encapsulation of circuit 10 is done within a mold cavity 22 of a mold 24 (FIGS. 2a-2e) using a molding compound 35. Connections to PCB 20 are made available externally to the molding compound by soldering conductive leads 26a, 26b, 26c, 26d, 26e, and 26f (FIGS. 1a, 1b) of metal lead frame 26 to input/output (I/O) pads 30 of PCB 20.
I/O pads 30 are also connected through conductive leads to the electrical components of circuit 10. For clarity, only conductive leads 28 (FIG. 1a) and 29 (FIG. 1b) are shown. Metal lead 26b is connected to an I/O pad 30 which is connected to conductive lead 28. A conductive pad 12a on semiconductor die 12 may be connected through wire 12b to conductive lead 28 (FIG. 2b) or a conductive pad (not shown) on a bottom side of die 12 could be connected to conductive lead 28. Metal lead 26f is connected to an I/O pad 30 which is connected by a plated through hole 31 to conductive lead 29. A conductive pad (not shown) on a bottom side of electrical component 17 is directly connected to conductive lead 29.
Mold 24 has a top 24a and a bottom 24b that are closed on portions 26g and 26h (FIGS. 2a, 2d) and leads 26a, 26b, 26c, 26d, 26e, and 26f (FIGS. 2b, 2c, 2e) of lead frame 26. Once mold 24 is closed, transfer molding is done by pushing molding compound 35, at 1000 psi, from a pot 36 (in mold bottom 24b), using a piston 40, into a runner 38 (also in mold bottom 24b) and into mold cavity 22 to surround circuit 10. After molding, circuit 10, encapsulated in cured molding compound, is removed from mold 24, and lead frame 26 is cut along dashed line 42 (FIGS. 1a, 1b), and waste molding compound is trimmed away along dashed line 43.
In one example, lead frame 26 has a thickness of approximately 0.008 inches with a tolerance of +/-0.00025 inches. When lead frame 26 is at a minimum thickness (i.e., 0.008-0.00025=0.00775), top 24a closes against bottom 24b, as shown in FIGS. 2a, 2b, 2c (i.e., they touch). The pressure of mold 24 on lead frame 26 does not damage lead frame 26. When lead frame 26 is at a maximum thickness (i.e., 0.008+0.00025=0.00825), top 24a does not close against bottom 24b leaving a gap 44, as shown in FIGS. 2d, 2e. The maximum height of gap 44 is 0.0005 inches (i.e., maximum thickness variance, 0.00025+0.00025=0.0005). Typical molding compounds will not leak, indicated by arrow 45, through a gap 44 of 0.0005 inches or less due to the viscosity of the molding compound.
Referring to FIGS. 3a, 3b, 3c, metal lead frame 26 (FIGS. 1a, 1b) is not needed to make external connections to I/O pads 30 of a component 9 because only a portion of one side of PCB 20 is encapsulated in cured molding compound 50 leaving I/O pads 30 exposed. Electrical components are generally not mounted in the exposed areas.
The thickness of PCB 20 is approximately 0.020 inches and has a tolerance of +/-0.0025 inches. The maximum thickness variation of 0.005 inches (i.e., 0.0025+0.0025=0.005) makes it difficult to use conventional molds to fully encapsulate circuit 10 (i.e., top, bottom, and sides) with the exception of I/O pads 30 (component 9, FIGS. 4, 5a, and 5b).
SUMMARY In general, in one aspect, the invention features a method for encapsulating portions of a circuit formed on a substrate. The substrate has two faces and perimeter sides. Encapsulating surrounds, in molding compound, a portion of one of the faces of the substrate and a portion of the sides of the substrate, and during encapsulation a portion of the one face of the substrate that bears conductive pads is left unencapsulated.
Implementations of the invention include the following features. A portion of the other of the faces of the substrate may also be encapsulated in molding compound. The conductive pads may be electrically connected to electronic components mounted on the substrate and encapsulated in the molding compound. Encapsulating may include inserting the substrate into a mold, closing a top of the mold and a bottom of the mold against the substrate, and pushing molding compound from a conduit having a top defined by the substrate into a chamber in the mold. Encapsulating may also include inserting the substrate into a mold, the substrate including an active portion on which the conductive pads and electronic components are mounted and a waste portion connected to the active portion by a segment in the area of the conductive pads, closing a top of the mold and a bottom of the mold against the waste portion and the segment of the active portion in the area of the conductive pads, and pushing molding compound from a conduit, having a top defined by the waste portion into a chamber in the mold. There may be multiple segments including conductive pads. Closing the mold may include causing a ridge on the top of the mold to extend down against the waste portion and the segment of the active portion in the area of the conductive pads, and causing a first ridge on the bottom of the mold to press up against the waste portion and the segment including the conductive pads. Closing the mold may also include causing a ridge on the top of the mold to extend down against the waste portion, a first segment of the active portion in the area of the conductive pads, and a second segment of the active portion, and causing a first ridge on the bottom of the mold to press up against the waste portion, the first segment, and the second segment. There may be many second segments of the active portion. An end of the conduit may be defined by a second ridge on the bottom of the mold. The top of the mold and the bottom of the mold may be separated by the substrate. The mold may be connected to a compliance mechanism of a press that allows the press to provide an even pressure distribution across the substrate. The press may include many molds and a compliance mechanism for attachment to each of the molds. The compliance mechanism may be a spring, a pneumatic cylinder, or a hydraulic cylinder. Encapsulating may further include curing the molding compound, removing the substrate with exposed conductive pads from the mold, and cutting away the waste portion and waste molding compound. The conduit may be a pot and a runner both of which may be in the bottom of the mold. Encapsulating may encapsulate many circuits in one mold having many cavities.
In general, in another aspect, the invention features an encapsulated circuit including a substrate having two faces and perimeter sides around the faces and a circuit formed on the substrate. The substrate also includes conductive pads that are formed on a portion of one of the faces near one of the sides and are connected to the circuit. An integrally formed encapsulating mass encapsulates all of the one face except in the region of the pads, all of the other face except in a region opposite to the region of the pads, and all of the sides.
Implementations of the invention include the following features. The circuit may include electronic components mounted on both faces of the substrate and encapsulated in the encapsulating mass. The conductive pads may be formed on more than one portion of the one face near the sides, and the conductive pads may also be formed on a portion of the other face near one of the sides or on more than one portion of the other face near the sides. In each case, the encapsulating mass may encapsulates all of the faces except the regions of the pads.
Advantages of the invention include the following. Reducing the size of a circuit having components mounted on both sides of a substrate by partially encapsulating the substrate to leave input/output (I/O) pads exposed and available for external connections. The substrate is not damaged by the molding process, and the cured molding compound provides a high voltage breakdown allowing the component to be placed in close proximity to other components.
DESCRIPTION We first describe the drawings:
FIGS. 1a and 1b are plan views of a top and a bottom, respectively, of a circuit connected to a metal lead frame.
FIGS. 2a, 2b, 2c, 2d, and 2e are cross-sectional side views of the structure of FIGS. 1a and 1b inserted within a mold.
FIG. 3a is a cross-sectional side view of a circuit having a portion of one side of a substrate encapsulated in molding compound.
FIGS. 3b and 3c are plans of a top and a bottom, respectively, of the circuit of FIG. 3a.
FIG. 4 is a cross-sectional side view of a circuit having a portion of a top, a bottom, and sides of a substrate encapsulated in molding compound.
FIGS. 5a and 5b are cross-sectional side views of the structure of FIG. 4.
FIGS. 6a and 6b are plans of the unencapsulated circuit of FIG. 4.
FIGS. 7, 8a, 8b, and 9 are cross-sectional side views of the circuit of FIGS. 6a and 6b inserted in a mold.
FIG. 10 is an exploded perspective view of the circuit of FIGS. 6a and 6b and the mold of FIGS. 7, 8a, 8b, and 9.
FIGS. 11 and 12 are cross-sectional side views of a press.
FIGS. 13a, 13b, 13c are cross-sectional side views of presses including compliance mechanisms attached to molds.
FIG. 14 is a cross-sectional side view of the circuit of FIG. 15 within a mold.
FIG. 15 is plan showing a circuit.
FIG. 16 is a plan showing the circuit of FIG. 15 partially encapsulated.
FIG. 17 is a cross-sectional side view of the structure of FIG. 16.
FIG. 18 is a plan of a larger circuit including the circuit of FIG. 4.
FIG. 19 is a plan of a substrate including three unencapsulated circuits.
FIG. 20 is a cross-sectional side view of the substrate of FIG. 19 inserted within a mold.
FIGS. 21 and 22 are plans of a top and a bottom, respectively, of a substrate showing a circuit having four areas with conductive pads.
Referring to FIGS. 4, 5a, and 5b, a component 9 includes a circuit 10, having electrical components 12, 14, 15, 16, 17, and 18 mounted on both sides of printed circuit board (PCB) 20, that is only partially encapsulated in cured molding compound 50. Input/Output (I/O) pads 30, located on a portion 52 of PCB 20, are exposed (i.e., not encapsulated). This reduces the size of component 9 by allowing connections to be made directly with I/O pads 30 (i.e., without leads 26a, 26b, 26c, 26d, 26e, and 26f, FIGS. 1a, 1b). The size of component 9 is also reduced by having components mounted on both sides of PCB 20.
For clarity, only conductive leads 28 and 29 of PCB 20 are shown. Wire 12b connects conductive pad 12a of semiconductor die 12 to conductive lead 28 which is connected to an I/O pad 30 (FIGS. 5a, 6a, 8a). A conductive pad (not shown) on a bottom side of component 17 is connected to conductive lead 29 which is connected to an I/O pad 30 through a plated through hole 31 (FIGS. 5b, 6b, 8b).
In order to provide component 9 as shown in FIGS. 4, 5a, and 5b, unencapsulated circuit 10 is inserted into a mold 60, shown in FIGS. 7-10. Referring to FIGS. 6a, 6b, instead of a lead frame 26 (FIGS. 1a, 1b), unencapsulated circuit 10 has PCB waste portions 20a, 20b, 20c, and 20d.
As shown in FIGS. 7-10, a top 60a of a mold 60 has a ridge 62 that extends, in a direction Ttr (FIG. 10), approximately 0.001 inches, above a surface 64 of top 60a and surrounds a cavity 68a within top 60a (FIGS. 8a, 8b). When the top 60a and a bottom 60b of mold 60 are closed around circuit 10, ridge 62 pushes down (arrows 70, FIGS. 7, 8a, 8b) onto waste portions 20b, 20c, and 20d (along dashed line 72, FIG. 6a) and down (arrows 74, FIGS. 8a, 8b) onto the area between PCB 20 and waste portion 20a, including I/O pads 30 (between dashed lines 72, 76, FIG. 6a).
Bottom 60b of mold 60 has a ridge 78 that extends, in a direction Tbr (FIG. 10), approximately 0.001 inches, above a surface 80 of bottom 60b and around a first part of a cavity 68b within bottom 60b (FIGS. 8a, 8b). Bottom 60b also has a second ridge 82 that forms an end to a runner 84 within bottom 60b that is connected to a pot 86 also within bottom 60b (FIG. 9). Ridge 82 extends around a second part of bottom cavity 68b. When top 60a and bottom 60b of mold 60 are closed around circuit 10, cavities 68a and 68b form cavity 68 and ridge 78 pushes up (arrows 90, FIGS. 7, 8a, 8b) against waste portions 20a, 20c, and 20d (along dashed line 72, FIG. 6b).
Piston 90 (FIGS. 7, 9) is used to push liquid, uncured molding compound 35 from pot 86 into runner 84 and into mold cavity 68 at about 1000 psi.
Top 60a and bottom 60b of mold 60 close on printed circuit board on all sides of circuit 10 forming a seal around circuit 10 with the exception of I/O pads 30. A top of pot 86 and runner 84 is defined by PCB waste portion 20b (FIG. 9). As a result, variations in the thickness of the PCB do not cause a gap (gap 44, FIGS. 2d, 2e) through which molding compound 35 can leak.
Ridge 62 of mold top 60a and ridge 78 of mold bottom 60b extend up to a maximum of 0.002 inches into PCB 20 and waste portions 20a, 20b, 20c, and 20d. PCB 20 is compressible, and, in the area of I/O pads 30, PCB 20 is not crushed or otherwise permanently damaged by ridges 62 and 78. Ridges 62 and 78 also prevent molding compound from leaking in the direction indicated by arrows 92 (FIGS. 7, 8a, 8b) and "resin bleeding" (i.e., epoxy resin leakage) which can occur with a gap 44 (FIGS. 2d, 2e) of 0.0005 inches or less.
Mold 60 is part of a press 130, shown in FIG. 11. After PCB 20 is inserted into mold cavity 68, a top 130a of press 130 closes mold top 60a on PCB 20 and the waste portions. Press top 130a and bottom 130b hold the mold closed while the molding compound 35 is pushed into mold cavity 68.
Press 130 provides an even profile of pressure across PCB 20 (the edges of waste portions 20c are shown) through mold 60. If two molds 60 are inserted into press 130 and the thickness T1, T2 of each PCB is different (i.e., T1 is less than T2), press 130 will not provide an even profile of pressure across the thinner PCB (i.e., T1), as indicated in FIG. 12 by gap 132.
In order to accommodate multiple molds holding PCBs of different thicknesses, a press 134 is provided (FIG. 13a) with springs 136 attached to each mold top 60a. Springs 136 have a spring constant of approximately 100 Kg per 0.001 inch, and the compliance of the springs allows the press to apply an even pressure across each mold 60 even where the molds hold PCBs of different thicknesses. One or more springs may be attached to each mold top 60a, and instead of springs, hydraulic cylinders 150 filled with high pressure fluid 154 and having pistons 152 (FIG. 13b) or pneumatic cylinders 156 filled with high pressure gas 158 and having pistons 160 (FIG. 13c) can be used.
Referring to FIGS. 14 and 15, to stabilize (i.e., prevent movement of) PCB 20 within mold cavity 68 during encapsulation, the mold can be configured to close on a portion (i.e., in between dashed lines 142, 146 of FIG. 15) 140 of PCB 20 in an area of PCB 20 without pads 30. As a result, portion 140 will not be encapsulated in cured molding compound 50, shown in FIGS. 16 and 17. Ridges 62 and 78 can also be configured to close on multiple portions of PCB 20 in areas of PCB 20 without pads 30.
After molding, component 9 is removed from mold 60, and waste portions 20a, 20b, 20c, and 20d (along with waste, cured molding compound, i.e., cull) are removed by cutting along dashed line 94 (FIGS. 6a, 6b). As shown in FIG. 18, exposed conductive pads 30 of component 9 (cured molding compound 50 surrounds circuit 10) are then used to connect circuit 10 into a larger circuit 96 on a PCB 98. Cured molding compound 50 also serves as an electrical insulator providing a high voltage breakdown and, thus, allowing component 9 to be placed in close proximity to other electrical components.
Referring to FIG. 19, several circuits 110, 112, 114 (with similar electrical components 12, 14, 16, and 18 (15 and 17 are included but not shown) connected through similar PCBs 20) can be molded simultaneously. Each circuit has conductive pads 30 through which electrical connections can be made to the components 12, 14, 15, 16, 17, and 18 (only conductive lead 29 is shown for clarity). PCB waste portions 20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h, 20i, and 20j connect the circuits and are cut away along dashed lines 116, after molding, to provide encapsulated circuits with exposed conductive pads 30.
As shown in FIG. 20, mold 120 has a cavity 122 for each circuit. Ridges 124 of mold top 80a surround each circuit, by extending down against waste portions 20b, 20c, 20d, 20e, 20f, 20g, 20h, 20i, and 20j and by extending down against the areas between waste portions 20a, 20d, and 20g and PCB 20, including I/O pads 30. Similarly, ridges 126 of mold bottom 120b surround each circuit by extending up against waste portions 20b, 20c, 20d, 20e, 20f, 20g, 20h, 20i, and 20j and by extending up against the areas between waste portions 20a, 20d, and 20g and PCB 20, including I/O pads 30. As a result, ridges 124 and 126 form a seal around PCBs 20. The bottom side of waste portions 20b, 20f, and 20i define tops of runners and pots indicated by dashed lines 128 in FIG. 19. Molding is accomplished as described above with references to FIGS. 7-10 and 13.
A PCB's thickness can vary as much as 0.002 inches from waste portion 20a to waste portion 20j. Hence, conventionally molding several circuits simultaneously is difficult because although the mold may apply the proper pressure and not form a gap 44 (FIGS. 2d, 2e) at one end of the PCB, it may not apply the proper pressure or form a gap 44 at the opposite end of the PCB. The variation in the thickness of the PCB is accommodated for in mold 120 (FIG. 20) by ridges 62 and 78. In areas where the PCB is thickest, ridges 62 and 78 compress the PCB approximately 0.002 inches. In areas where the PCB is the thinnest, ridges 62 and 78 close against, but do not compress the PCB. As a result, no gap is created through which molding compound can leak out of mold 120.
Other embodiments are within the scope of the following claims. For example, many different circuit shapes can be molded in this way, and the printed circuit boards may have only one area where conductive pads are mounted or multiple areas (FIG. 21) where conductive I/O pads 30 are mounted. The conductive pads may also be mounted on both sides of the PCB (FIG. 22).
Similarly, a variety of compliant and non-compliant substrates can be used instead of PCB 20 and waste portions 20a, 20b, 20c, and 20d, shown in FIGS. 6a, 6b. A non-compliant substrate such as ceramic, for example, could be used. Where non-compliant substrates are used, mold top 60a and mold bottom 60b (FIGS. 7-10) would not include ridges 62, 78, respectively. Instead, surfaces 64 and 80 of mold top 60a and bottom 60b, respectively, would close flush against the non-compliant substrate.
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electronic modulesUSRE44372Jan 25, 2012Jul 16, 2013Vlt, Inc.System and apparatus for efficient heat removal from heat-generating electronic modules* Cited by examinerClassifications U.S. Classification264/272.11, 29/841, 425/116, 264/272.17, 438/126, 257/E21.504International ClassificationH01L21/56, H05K3/28Cooperative ClassificationH01L2224/48091, H05K3/284, H01L21/565European ClassificationH01L21/56MLegal EventsDateCodeEventDescriptionSep 17, 2009FPAYFee paymentYear of fee payment: 12Sep 19, 2005FPAYFee paymentYear of fee payment: 8Jun 22, 2004ASAssignmentOwner name: VLT, INC., CALIFORNIAFree format text: MERGER;ASSIGNOR:VLT CORPORATION;REEL/FRAME:014763/0124Effective date: 20000713Owner name: VLT, INC. 560 OAKMEAD PARKWAYSUNNYVALE, CALIFORNIAFree format text: MERGER;ASSIGNOR:VLT CORPORATION /AR;REEL/FRAME:014763/0124Sep 14, 2001FPAYFee paymentYear of fee payment: 4Mar 27, 2001CCCertificate of correctionFeb 13, 1995ASAssignmentOwner name: VLT CORPORATION, TEXASFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SAXELBY, JOHN R. JR.;HEDLUND, WALTER R., III;REEL/FRAME:007334/0044Effective date: 19950123RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google


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Words containing daiji | Words that contain daiji
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Found 5 words containing daiji. Browse our Scrabble Word Finder, Words With Friends cheat dictionary, and WordHub word solver to find words that contain daiji. Or use our Unscramble word solver to find your best possible play! Related: Words that start with daiji
9 letter words containing daiji8 letter words containing daiji7 letter words containing daijiSee also
9 letter words containing daiji
8 letter words containing daiji
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Words containing daijir
Words containing daijis

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Scarf Vintage Retro MENS 1960s 1970s WOOL NAVY BLACK RED | eBay
Details about Scarf Vintage Retro MENS 1960s 1970s WOOL NAVY BLACK RED
Scarf Vintage Retro MENS 1960s 1970s WOOL NAVY BLACK RED
05 Sep, 2019 09:26:43 BST
cosmoszero (21763 )
Scarf Vintage Retro MENS 1960s 1970s COLLEGE STRIPED
Scarf Vintage Retro MENS 1960s 1970s WOOL LINED
Scarf Vintage Retro MENS 1970s 1980s DUGGIE NAVY COPPER GOLD
Scarf Vintage Retro MENS 1960s 1970s CREAM BROWN BLACK
Scarf Vintage Retro MENS 1960s 1970s DARK RED GREEN MUSTARD YELLOW
VINTAGE 1960'S TOOTAL SCARF RED PAISLEY TIE TASSELS TOOA334
Scarf Vintage Retro MENS 1960s 1970s RED BLACK POLKA DOT by DUGGIE
Scarf Vintage Retro MENS 1960s 1970s SHIMMERY DARK RED NAVY
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Last updated on 02 May, 2019 02:14:49 BST View all revisions
Decade: 1970s MPN: Does Not Apply