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Browse all 1,983 Nairobi topics » anyone visited Karura Forest Nairobi
posts: 61 reviews: 25 Save this Post anyone visited Karura Forest Nairobi
posts: 3,801 reviews: 4 Save this Post 1.
Re: anyone visited Karura Forest Nairobi Nov 24, 2012, 8:27 AM
Karura is wonderful - no big wildife, but a safe and enchanting place to experience Nairobi's highland forests as they were 100 years ago (well, discounting the gum tree area!). Very close to Village Market (shopping and entertainent centre) too. Richard
Re: anyone visited Karura Forest Nairobi Nov 24, 2012, 9:24 AM
I think it's worth going to the Karura Forest. The focal point of the forest are the waterfalls & caves. It's best accessed from the main entrance on Limuru Rd just after the Belgian Embassy. To the waterfalls, it's apprx 2 hrs walk from the entrance.
There's a car park there too.
jambonairobi.co.ke/activities/…
Re: anyone visited Karura Forest Nairobi Nov 24, 2012, 12:31 PM
Certainly not 2hrs. You could do it easily in 30 minutes. Richard
posts: 61 reviews: 25 Save this Post 4.
Re: anyone visited Karura Forest Nairobi Nov 24, 2012, 12:51 PM
Thanks guys. Do you have a better hike in the area you'd suggest?
posts: 2,200 reviews: 2 Save this Post 5.
Re: anyone visited Karura Forest Nairobi Nov 24, 2012, 1:35 PM
Richard - Just curious, did you run like Kipchoge Keino ?
posts: 3,801 reviews: 4 Save this Post 6.
Re: anyone visited Karura Forest Nairobi Nov 25, 2012, 3:46 AM
Just walking at normal speed. It's about 2.5km:
friendsofkarura.org/wp-content/uploads/2012/…
gdrvasc: a better hike in what sense? You could make an 8–10km walk easily enough and spend several hours in the Karura forest, with breaks, if you wanted. Also check out the smaller Ngong Road forest and Oloolua forest.
posts: 3,771 reviews: 3 Save this Post 7.
Re: anyone visited Karura Forest Nairobi Nov 25, 2012, 12:35 PM
"Also check out the smaller Ngong Road forest and Oloolua forest."
Please don't check these out unless you want to be mugged and/or murdered. They are very, very dangerous. None of us locals - white or black - will venture into them - or even drive through them on the bypass. Karura is much, much safer; fenced and guarded. Neither Ngong Rd nor Ololua Forest are. Stick with Karura and enjoy your hike.
Edited: 12:36 pm, November 25, 2012 Report inappropriate content Yankari
Re: anyone visited Karura Forest Nairobi Nov 27, 2012, 5:59 PM
Are you sure FL? When were you last in either of these forests? I visited Ngong Road forest a year ago, and the place has been transformed. They have rangers, riding trails… I was escorted round, had a good chat with Simon Nganga the project coordinator at the HQ office by the seedling nursery, and was not given any grounds for worrying about being there. Quite the opposite, he was delighted that someone was writing about it. There was a brilliant crowned eagle nest and wonderful butterflies, aardvark burrows, various small antelope. ngongforest.org/index.php/…forest-fun-run
I drove into Oloolua on my own earlier this year. Had a chat at the gate, no problem. It's a beautiful forest.
http://www.primateresearch.org/
But…please give a few more details about the risks as you see them. After all, your description of what might happen is roughly what you'd be told by a large proportion of the population in Europe or the US if you told them you were thinking of even visiting Kenya. And it matters a lot to me in my work that I'm not giving people unsafe advice. Richard
posts: 3,771 reviews: 3 Save this Post 9.
Re: anyone visited Karura Forest Nairobi Nov 28, 2012, 2:28 AM
Yes, I'm sure Richard. They're right on my doorstep - walking distance - and they're absolutely notorious. It's not a question of risks "as I see them". The two forests are very, very dangerous, there are constant robberies, muggings and carjackings in there - fact. When we take our horses in to exercise them, we make sure that there are at least four of us on any given ride. My own syce (groom) was attacked in Ngong Forest just three months ago - whilst on my horse - for his mobile phone and anything else they could take from him. Naively, he thought he would be fine going in there alone during morning hours (8am) as there were plenty of people about. He was wrong, and he ended up in hospital. We only found out what had happened when the horses turned up at home, riderless. Speak to the local police about what goes on in these forests. Ask them for their weekly reports - if they're willing to provide them to you, as a journalist (they usually won't). Karura, in comparison, is an absolute haven and I love my (albeit infrequent) walks over there with my dogs.
I understand you need to get your facts right but your constant questioning of my knowledge, as a local and as someone who works in private security and so *sees* everything that goes on here, on a daily basis, is getting rather tiresome. I don't post it for kicks or for the good of my health. I post this stuff because I don't want visitors to my country being put in dangerous and, sometimes, life-threatening situations. Nairobi is, in general, a pretty unsecure place. A dear friend of ours was robbed and carjacked just this last Friday as she stood, at lunchtime, loading her car, in Lavington Green shopping centre. This will never make the press. But people need to know, so that they can be aware of what is going on around them. Unawareness is the number one killer here. Not scaremongering, just the truth.
Edited: 2:32 am, November 28, 2012 Report inappropriate content Yankari
posts: 3,801 reviews: 4 Save this Post 10.
Re: anyone visited Karura Forest Nairobi Dec 04, 2012, 5:49 PM
Thanks for clarifying FL that you do in fact still visit the Ngong Road Forest, and I'm very sorry to hear about your syce's experience, which must have been terrifying, and I guess I'm surprised you've been back at all after that. I'm sorry also to hear about your friend at Lavington Green. Surely the car park is gated there, isn't it?
FL, I don't think you and I are going to reach a consensus about these two forests (incidentally, I don't see how Ngong Road Forest and Oloolua Forest can both be on your doorstep since the entrance gates are 8km apart - you have been to Oloolua?), but I think it's helpful for TA users to see the spread of opinion. You're in the security business, which depends on a certain level of perceived risks to survive, and I'm in travel, which depends on people putting those risks to one side, so it's fair to say we are both probably biased to some degree. As for questioning the knowledge of posters on TA, I think you should expect to be challenged if you use social media - I certainly expect it, and I think it's a good thing. Anyway, I'll drop an email to Simon at the Ngong Road Forest and see if I can get any mores instances of attacks from him - going accompanied with one of their rangers is obviously a good idea, but if it's as insecure as you say, then the various family fun runs, bike rides etc that they hold there would be a bit odd…
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CAT35642_XTROGladiators-1
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Florindo Esteves Esperancinha - Semantic Scholar
Florindo Esteves Esperancinha
J E Pederson10
D R Anderson10
Ali S. Raza4
Carlos Gustavo V De Moraes4
Donald C. Hood4
2Fernando T Vaz
2Paulo Kaku
2Mafalda Mota
2Mário Ramalho
2Maria Lisboa
Mafalda Mota, Fernando Trancoso Vaz, +4 authors Florindo Esteves Esperancinha
AIM To determine the relationship between macular thickness (MT) and visual field (VF) parameters, as well as with changes in the retinal nerve fiber layer (RNFL) thickness in patients with glaucoma… (More)
Antonio Travassos, Susana Teixeira, +8 authors Maria do Céu Machado
The anatomic response to intravitreal bevacizumab injection in three patients with aggressive, posterior retinopathy of prematurity is described. In all cases, the worse eye was treated with a single… (More)
MATERIALS AND METHODS Observational and cross-sectional study of 70 eyes of 54 patients diagnosed with glaucoma or OH
Aim: To determine the relationship between macular thickness (MT) and visual field (VF) parameters, as well as with changes in the retinal nerve fiber layer (RNFL) thickness in patients with glaucoma… (More)

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Woodcrest, CA Staircases & Railings
Staircases near Woodcrest	Jurupa Valley
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Shafer teleconference news & notes - Syracuse - Scout
Shafer teleconference news & notesMike McAllister08/26/2014Scott Shafer addressed the media during his game-week teleconference on Tuesday.
Syracuse head coach Scott Shafer held his first teleconference of the 2014 season on Tuesday. He discussed a variety of topics including the backup quarterback battle, the defense, freshmen and more. Notes are below.
- Shafer said the team sat down with Adrian Flemming after his injury and determined he would he good to go after some rest. They decided to bring him back and have been pleased with where he's at. Looking for a strong season from him.
- Shafer hopes the fans and community comes out Friday night to support the team. Looking forward to putting a good product on the field for them to enjoy.
- Shafer says the team is ready to go. He's using the call before the storm and minimalist mentality. Plans to clean his office this afternoon.
- Likes the growth of Terrel Hunt from last season until now. The proof will be in the pudding Friday night. Staff doesn't want Hunt to think he has to win the game by himself. - Shafer is proud of Ivan Foy and the progress he has made since the spring. He has slimmed down and gotten back in good standing academically. Impressed with his maturation as a man.
- Shafer looking for Adonis Ameen-Moore to fill the big back role that Jerome Smith had last season. He worked very hard during the offseason and is looking for a strong season from him.
- Shafer looking for his defense to play sound football against Villanova even if they do something wacky. If they "get one on us" he wants the defense to move on. Says coach Bullough will have them ready to go.
- He is not concerned about the lack of experience among his backup quarterbacks. He thinks he has three capable guys. Austin Wilson has had a strong week of practice. A.J. Long is still learning but can make plays. Mitch Kimble is improving every day.
- No difference in the approach of the defensive tackles against Villanova. Wants them to explode off the ball and make plays in the backfield. - The freshmen defensive players in the two-deep, Zaire Franklin, Parris Bennett and Juwan Dowels earned their spots by beating out guys ahead of them. Playing time will depend on game situations.

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3 bedroom cottage for sale in Brill, Near Constantine, TR11
www.rightmove.co.uk/property/66883708
ENHANCED BY STUNNING ENCLOSED 'PLANTSMANS' GARDENS TO THE REAR
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To view this media, please visit the on-line version of this page at www.rightmove.co.uk/property-for-sale/property-66883708.html
Disclaimer - Property reference 28103394. The information displayed about this property comprises a property advertisement. Rightmove.co.uk makes no warranty as to the accuracy or completeness of the advertisement or any linked or associated information, and Rightmove has no control over the content. This property advertisement does not constitute property particulars. The information is provided and maintained by Mather Partnership, Helston. Please contact the selling agent or developer directly to obtain any information which may be available under the terms of The Energy Performance of Buildings (Certificates and Inspections) (England and Wales) Regulations 2007 or the Home Report if in relation to a residential property in Scotland.
19 Jun 2017 Brill Farm House Brill, TR11 £550,000
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Where?My current locationSearchSign In•JoinWrite a ReviewHomeMortgages near Whitman, MAMutual BankIn mybook® : Services Collection (edit)Added to your services collection.Removed from mybook!We took this business out of your services collection.Mutual BankWrite a ReviewAdd a PhotoBe the first to review!570 Washington St, Whitman, MA 02382(781) 447-4488CLOSED NOWToday: 9:00 am - 5:00 pmTomorrow: 9:00 am - 5:00 pm213YEARS IN BUSINESSAdd to mybookThis listing has been added to mybook.This listing has been removed from mybook.ShareFACEBOOKGOOGLE +TWITTERemailsend to phoneSend to PhoneMutual Bank570 Washington St, Whitman, MA 02382(781) 447-4488Send this business listing as a text message to a mobile phone.I agree to the Terms and ConditionsCancelSendYour text message was sent.To opt out at anytime, send the word STOP to YP411.To get a help message, send the word HELP to YP411.There was an error sending your text.Please try again.Terms: The recipient of this text message may incur charges depending on their wireless carrier. Not all carriers are currently supported.E-MailMutual Bank570 Washington St, Whitman, MA 02382(781) 447-4488Send this business details to yourself or up to 5 friends.Up to 5 email addresses, separate addresses with a commaSend Yourself a CopyCancelSendVisit WebsiteEmail BusinessSuggest an EditIs this your business? Customize this page.Claim this businessBusiness DetailsCouponsGalleryReviewsSponsored LinksBusiness DescriptionMutual Bank is an independent, mutually owned savings bank that serves the community's personal and small business banking needs through full-service offices in Whitman, Hanson, Halifax and Carver, Mass. The bank has operated continuously as an independent, local institution since 1889. It offers products and services, such as checking accounts, savings accounts, home equity loans, home mortgages, personal and automobile loans, individual retirement accounts and check cards. Mutual Bank is headquartered in Whitman.HoursRegular HoursMon - Fri9:00 am - 5:00 pmExtra PhonesPhone: (508) 540-2520Phone: (781) 294-0500AKAMutual Bank ATMOther Linkhttp://mymutualbank.comCategoriesMortgages, Banks, Commercial & Savings Banks, Real Estate Loans, Loans CouponsNo deals available. Claim this business to add deals.Claim this businessGalleryBe the first to add a photo!Add a PhotoReviewsHi there!Be the first to review!5First-class4Better than most3About what I expected2Not the worst...1DisappointingClick to RateShare ReviewLike this review? Share it on your social network to get the word out!ShareTweetShareWant to just link to it instead? Copy URL above and paste away!Sponsored LinksMap & DirectionsPeople Also ViewedRemax Prime Real Estate24 Surrey Ln, East Bridgewater, MAColdwell Banker149 Center St, Hanover, MACentury 21484 Bedford St, Abington, MALive Oaks Village680 Union St, Rockland, MANoble Properties1471 Main St, South Weymouth, MAPaid AdvertisementRelated ArticlesWhich Home Security System Is Right for Me?Home security comprises a number of different technologies, tools and techniques. Choose one that fits your needs and your budget.more related articles »AboutAbout UsSite FeedbackContact UsAdvertise with UsCareers - We're HiringCorporate BlogEngineering BlogLegal

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INTEREST;ASSIGNOR:PAVILION TECHNOLOGIES, INC.;REEL/FRAME:010321/0843Effective date: 19990924Apr 23, 1998ASAssignmentOwner name: PAVILION TECHNOLOGIES, INC., TEXASFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PICHE, STEPHEN;KEELER, JAMES D.;HARTMAN, ERIC;AND OTHERS;REEL/FRAME:009134/0855Effective date: 19980312RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services

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BBB Business Profile | United Martial Arts Centers
> United Martial Arts Centers
(845) 225-9703
umacnews@aol.com
Mr. Paul Melella, President
United Martial Arts Centers has received 0 out of 5 stars based on 0 Customer Reviews and a BBB Rating of A+.

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Christy Johnson Gonzales Obituary - Alamogordo, NM | Alamogordo Daily News
More Obituaries for Christy Johnson Gonzales
Christy Keith Johnson Gonzales
1972 - 2010 Obituary Condolences
Christy Keith Johnson Gonzales lost her brave battle against breast cancer Thursday, April 29, 2010. Christy Keith was born Feb. 19, 1972, in Alamogordo to Clark and Mary Keith. She attended schools in Alamogordo and graduated from Alamogordo High School in 1991. This was followed by a tour of duty in the United States Navy during Desert Storm.
Christy returned to New Mexico and continued her education at New Mexico State University. She was employed by Memorial Medical Center as the academic coordinator of the Family Practice Medical Residency program at the time of her death.
Christy loved her children and was known as their No. 1 advocate. She was her husband's soul mate and they enjoyed what time they had to the fullest. She was also a loyal sister and a loving daughter. Christy's work brought her a sense of accomplishment as she helped guide physicians through the residency program at Memorial Medical Center.
She leaves behind her husband, Greg Gonzales; her children Brittany and Lauren Johnson, and Jordan and Jacob Gonzales; her parents Clark and Mary Keith; her sister and brother-in-law, Serena and Al Shoop; her nieces Caryn and Erin Daly, and Chelsie Shoop; her maternal grandparents Candelario and Ramona Sanchez; and aunts, uncles and many good friends.
Christy was a fighter to the end. Her courage and strength live on in her children. She touched many lives, bringing joy and laughter to all who knew her. She will be greatly missed.
A viewing will be held from 6 to 8 p.m. Wednesday, May 5, 2010, in Baca's Funeral Chapels, 300 E. Boutz Road, Las Cruces. Her memorial service will be held at 10 a.m. Saturday, May 8, 2010, at First Assembly of God, 5605 Bataan Memorial Highway, Las Cruces, with the Rev. David Vistine officiating.
In honor of her courageous battle, her daughters request that people wear breast cancer pink to the memorial service.
Arrangements are entrusted to Baca's Funeral Chapels of Las Cruces. To send condolences online, visit www.bacasfuneralchapelslascruces.com.
Published in Alamogordo Daily News from May 4 to May 6, 2010
The Guest Book is Expired Please restore the Guest Book to share in the life story for CHRISTY KEITH JOHNSON GONZALES
"Our love and prayers go out to all of Christy's family. Clark, Mary, and Serena, please know you are..."
-Lori Sillmann

value: This website is a United States-based website founded in 1998, the world's largest commercial provider of online memorials. The Web site hosts obituaries and memorials for more than 70 percent of all U.S. deaths.


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Patent US5079598 - Image forming apparatus that feeds a specific sheet after a predetermined ... - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inAdvanced Patent SearchPatentsAn image forming apparatus includes: an original circulation unit for feeding originals placed on an original mounting unit one by one to an exposure site and after the exposure, returning the original to the original mounting unit; a copying unit for copying an original image to a recording sheet through...http://www.google.com/patents/US5079598?utm_source=gb-gplus-sharePatent US5079598 - Image forming apparatus that feeds a specific sheet after a predetermined number of imagesAdvanced Patent SearchPublication numberUS5079598 APublication typeGrantApplication numberUS 07/321,840Publication dateJan 7, 1992Filing dateMar 10, 1989Priority dateMar 14, 1988Fee statusPaidAlso published asDE68915828D1, DE68915828T2, DE68927187D1, DE68927187T2, EP0333112A1, EP0333112B1, EP0508499A2, EP0508499A3, EP0508499B1Publication number07321840, 321840, US 5079598 A, US 5079598A, US-A-5079598, US5079598 A, US5079598AInventorsTokuharu Kaneko, Miho Nakayama, Masanori Miyata, Takeshi Honjo, Hideki Adachi, Toshiya KanazawaOriginal AssigneeCanon Kabushiki KaishaExport CitationBiBTeX, EndNote, RefManPatent Citations (7), Non-Patent Citations (1), Referenced by (14), Classifications (18), Legal Events (5) External Links: USPTO, USPTO Assignment, EspacenetImage forming apparatus that feeds a specific sheet after a predetermined number of images
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS4330197 *Jul 28, 1980May 18, 1982Xerox CorporationRecirculating documents duplex copierUS4494861 *Dec 10, 1980Jan 22, 1985Canon Kabushiki KaishaCopying apparatusUS4536078 *May 25, 1983Aug 20, 1985Xerox CorporationRecirculative document duplex copyingUS4640607 *Dec 12, 1984Feb 3, 1987Eastman Kodak CompanySimplex to duplex copier apparatusUS4712908 *Sep 17, 1986Dec 15, 1987Canon Kabushiki KaishaImage forming apparatusUS4763161 *Aug 21, 1986Aug 9, 1988Eastman Kodak CompanyCopier operable in an insert modeJPS57191658A * Title not available* Cited by examinerNon-Patent CitationsReference1 *European Search Report dated Jun. 14, 1989.* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS5192977 *Oct 15, 1991Mar 9, 1993Canon Kabushiki KaishaMulti-color image forming apparatusUS5220394 *Jun 3, 1991Jun 15, 1993Minolta Camera Kabushiki KaishaCopying apparatus having controller for producing book-type copiesUS5237382 *Dec 6, 1991Aug 17, 1993Ricoh Company, Ltd.Sorting means with plurality of binsUS5257081 *Mar 27, 1992Oct 26, 1993Minolta Camera Kabushiki KaishaImage forming drive having two cover modes and a stapler for stapling a group of content pages and a cover pageUS5296907 *Jun 23, 1992Mar 22, 1994Minolta Camera Kabushiki KaishaImage forming apparatus that permits the setting of separated copy modes for at least one original document of a plurality of original documents to be copiedUS5316279 *Jan 4, 1993May 31, 1994Xerox CorporationCopier/printer job stacking with discrete cover sheets with extending printed bannersUS5493367 *Dec 23, 1994Feb 20, 1996Eastman Kodak CompanyReproduction apparatus and method for correctly orienting principal copies and supplemental copiesUS5671463 *Dec 23, 1994Sep 23, 1997Minolta Co., Ltd.Image forming apparatus capable of forming a plurality of images from different originals on a single copy sheetUS5839019 *Mar 28, 1996Nov 17, 1998Minolta Co., Ltd.Image forming apparatus for copying different groups of documentUS6011936 *May 14, 1996Jan 4, 2000Canon Kabushiki KaishaImage forming apparatus having recovery process for jammed sheetsUS6064464 *Mar 11, 1998May 16, 2000Copyer Co., Ltd.Copying machineUS6137563 *Aug 21, 1998Oct 24, 2000Fuji Photo Film Co., Ltd.Apparatus for recording imagesUS6608990 *Oct 19, 2000Aug 19, 2003Heidelberger Druckmaschinen AgJob ordering system for an image-forming machineUS7376382 *Dec 16, 2004May 20, 2008Kabushiki Kaisha ToshibaImage forming apparatus and image forming method* Cited by examinerClassifications U.S. Classification399/364International ClassificationG03G15/01, G03G15/00Cooperative ClassificationG03G2215/00329, G03G2215/00827, G03G2215/00426, G03G15/01, G03G2215/00869, G03G2215/00877, G03G15/50, G03G2215/00556, G03G15/6582, G03G2215/00805, G03G15/5029, G03G15/5025European ClassificationG03G15/65N, G03G15/50, G03G15/01Legal EventsDateCodeEventDescriptionJun 17, 2003FPAYFee paymentYear of fee payment: 12May 28, 1999FPAYFee paymentYear of fee payment: 8May 26, 1995FPAYFee paymentYear of fee payment: 4Nov 29, 1994CCCertificate of correctionMar 10, 1989ASAssignmentOwner name: CANON KABUSHIKI KAISHA,, JAPANFree format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:KANEKO, TOKUHARU;NAKAYAMA, MIHO;MIYATA, MASANORI;AND OTHERS;REEL/FRAME:005053/0799Effective date: 19890307RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services


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CARDI B Poster Wall Print 24" x 36" (inch) 10 | eBay
Details about CARDI B Poster Wall Print 24" x 36" (inch) 10
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Originality: Reproduction Date of Creation: 2000-Now


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Patent US5445308 - Thermally conductive connection with matrix material and randomly dispersed ... - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inPatentsA method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions...http://www.google.com/patents/US5445308?utm_source=gb-gplus-sharePatent US5445308 - Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metalAdvanced Patent SearchTry the new Google Patents, with machine-classified Google Scholar results, and Japanese and South Korean patents.Publication numberUS5445308 APublication typeGrantApplication numberUS 08/263,623Publication dateAug 29, 1995Filing dateJun 22, 1994Priority dateMar 29, 1993Fee statusLapsedPublication number08263623, 263623, US 5445308 A, US 5445308A, US-A-5445308, US5445308 A, US5445308AInventorsRichard D. Nelson, Thomas P. Dolbear, Robert W. FroehlichOriginal AssigneeNelson; Richard D., Dolbear; Thomas P., Froehlich; Robert W.Export CitationBiBTeX, EndNote, RefManPatent Citations (47), Non-Patent Citations (32), Referenced by (119), Classifications (62), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetThermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
25. The method of claim 21 further comprising, in sequence:dispersing spacer particles into said unhardened matrix material; contacting at least one of said plurality of regions to both of said surfaces without contacting any one of said spacer particles to both of said surfaces; moving said surfaces closer together; and then contacting at least one of said spacer particles to both of said surfaces thereby assuring a spacing between said surfaces. 26. The method of claim 1 wherein during step (b) a temperature of said filler is at most 160° C.
27. The method of claim 26 wherein said temperature of said filler is at most 100° C.
28. The method of claim 27 wherein said temperature of said filler is at most 40° C.
Increased power consumption generates increased heat. Thermal expansion caused by heating up the components, however, is not uniform. Thermal expansion varies with temperature gradients and mismatches between coefficients of thermal expansion. Mechanical stresses result from these differences which contribute to the finite lifetime and failure rate of the components. Moreover, the components have limited temperature tolerance. For instance, integrated circuit chip temperatures must often be below 100° C. to assure proper and reliable electrical performance. As a result, heat transfer and heat removal techniques have become critical.
Gallium (30° C.)
Gallium/Tin (16° C.)
Gallium/Indium (15° C.)
Gallium/Indium/Tin (5° C.)
Mercury (-39° C.)
Mercury/Zinc (-41.6° C.)
Referring now to FIG. 4, separate spaced regions of the dispersed filler in a non-solidified state are now be brought in contact with (and preferably wet) the surfaces without contacting any other of such filler regions. In this embodiment, surfaces 20 and 22 are brought closer together until separated by a length L2 less than or equal to (preferably slightly less than) distance D. This smears mixture 16 across the surfaces and forms regions 28 of gallium 14. Regions 28 are separate from one another and provide a continuous path of gallium 14 between and in contact with surfaces 20 and 22. Gallium 14 must be in liquid state at least temporarily during contact with surfaces 20 and 22 to make proper electrical and thermal contact. Preferably, gallium 14 wets surfaces 20 and 22 thereby enhancing the contact. In addition, gallium 14 should be compatible with (not attack) surfaces 20 and 22. Finally, it is noted that after contacting surfaces 20 and 22 it is no longer essential that gallium 14 remain non-solidified. It should be noted that gallium 14 in each region 28 provides a separate continuous thermally and electrically conductive path between and in contact with surfaces 20 and 22. Advantageously, the paths can be formed at a relatively low temperature, preferably at most 160° C., more preferably between 40° C. to 100° C., and most preferably at room temperature.
Similar to Example 1 except the mixture was used to bond glass slides together and the one year period between forming and inspecting the bond was omitted. After mixing and forming a dispersion of very tiny gallium droplets within the liquid adhesive, a dollop of the gallium/adhesive was placed on the surface of a glass slide. Another glass slide, smaller than the first, was pressed against the adhesive on the larger glass slide, forcing adhesive to flow from between the two glass surfaces leaving a very thin bond of approximately 2 mils thick. This process was performed with the gallium filler in a liquid state. Thereafter the Devcon epoxy was cured by chemical reaction of the two-part adhesive mixture. FIG. 19 is a photomicrograph showing 100 × magnification of the interface between the adhesive bonding material and a glass slide as seen through the slide. The liquid gallium is seen as lightly shaded regions; the epoxy appears dark. As may be seen, the liquid gallium bridged across the cured adhesive bondline and wet the glass. FIG. 20 is the same at 200 × magnification.
Two copper blocks were attached with the Devcon 5 minute epoxy containing a liquid gallium filler. The amount of gallium was weighed to be approximately 20% by volume of the bond. For comparison, two other copper blocks were also attached with the Devcon 5 minute epoxy only. Both samples were prepared by pressing the respective copper blocks together to form the thinnest bondline achievable. The unfilled and filled attachments were approximately 1-2 mils thick. The thermal resistance of each sample was then measured using the test method described by Thomas P. Dolbear in "Liquid Metal Paste for Thermal Connections", Proceedings of the International Electronic Packaging Society (IEPS), September, 1992, pp. 475-485. The thermal resistance for the attachment with the unfilled epoxy was 0.75° C.-sqcm/W whereas the thermal resistance of the attachment using the liquid gallium filled epoxy was 0.11° C. sqcm/W. Thus, the liquid metal filler substantially reduced the thermal resistance of the attachment. Moreover, the thermal resistance of the liquid metal filled attachment was both lower and less sensitive to bondline thickness than that obtainable with conventional solid filled adhesive attachments.
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R. Grace & Co.Low temperature single step curing polyimide adhesiveUS4744850 *Dec 9, 1985May 17, 1988Sharp Kabushiki KaishaMethod for bonding an LSI chip on a wiring baseUS4749120 *Dec 18, 1986Jun 7, 1988Matsushita Electric Industrial Co., Ltd.Method of connecting a semiconductor device to a wiring boardUS4769525 *Sep 2, 1986Sep 6, 1988Hughes Aircraft CompanyCircuit package attachment apparatus and methodUS4769690 *Apr 24, 1986Sep 6, 1988Hitachi, Ltd.Metallizing paste for silicon carbide sintered body and a semiconductor device including the sameUS4796157 *Jan 4, 1988Jan 3, 1989Motorola, Inc.Substrate mounting assemblyUS4804132 *Aug 28, 1987Feb 14, 1989Difrancesco LouisMethod for cold bondingUS4875617 *Jul 14, 1988Oct 24, 1989Citowsky Elya LGold-tin eutectic lead bonding method and structureUS4915167 *Aug 5, 1988Apr 10, 1990Westinghouse Electric Corp.Thermal coupling to enhance heat transferUS4929597 *Mar 27, 1989May 29, 1990Mitsubishi Metal CorporationSuperconductor containing internal stress absorberUS4949220 *Feb 23, 1989Aug 14, 1990Nec CorporationHybrid IC with heat sinkUS4995546 *Oct 18, 1989Feb 26, 1991Bt&D Technologies LimitedDevice mountingUS5012858 *Apr 10, 1989May 7, 1991Fujitsu LimitedMethod of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unitUS5019201 *Feb 21, 1990May 28, 1991Canon Kabushiki KaishaExternal-circuit connecting method and packaging structureUS5024264 *May 8, 1989Jun 18, 1991Fujitsu LimitedMethod of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unitUS5031308 *Dec 26, 1989Jul 16, 1991Japan Radio Co., Ltd.Method of manufacturing multilayered printed-wiring-boardUS5053195 *Jul 19, 1989Oct 1, 1991Microelectronics And Computer Technology Corp.Bonding amalgam and method of makingUS5056706 *Nov 20, 1989Oct 15, 1991Microelectronics And Computer Technology CorporationLiquid metal paste for thermal and electrical connectionsUS5062896 *Mar 30, 1990Nov 5, 1991International Business Machines CorporationSolder/polymer composite paste and methodUS5123986 *Oct 24, 1990Jun 23, 1992Casio Computer Co., Ltd.Conductive connecting methodUS5147210 *Oct 1, 1991Sep 15, 1992Western Digital CorporationPolymer film interconnectUS5170930 *Nov 14, 1991Dec 15, 1992Microelectronics And Computer Technology CorporationLiquid metal paste for thermal and electrical connectionsUS5183969 *Oct 1, 1991Feb 2, 1993Shin-Etsu Polymer Co., Ltd.Anisotropically electroconductive adhesive and adhesively bonded structure therewithUS5225157 *May 16, 1991Jul 6, 1993Microelectronics And Computer Technology CorporationAmalgam composition for room temperature bondingUS5235741 *Aug 11, 1992Aug 17, 1993Semiconductor Energy Laboratory Co., Ltd.Electrical connection and method for making the sameUS5258577 *Nov 22, 1991Nov 2, 1993Clements James RDie mounting with uniaxial conductive adhesiveUS5323294 *Mar 31, 1993Jun 21, 1994Unisys CorporationLiquid metal heat conducting member and integrated circuit package incorporating sameUS5328087 *Mar 29, 1993Jul 12, 1994Microelectronics And Computer Technology CorporationThermally and electrically conductive adhesive material and method of bonding with same* Cited by examinerNon-Patent CitationsReference1"IBM Technical Disclosure Bulletin" vol. 31, No. 5, Oct. 1988, p. 34.2Darveaux et al., "Thermal/Stress Analysis of a Multichip Package Design," Proceedings of the 39th Electronic Components Conference, 1989, pp. 668-671.3 *Darveaux et al., Thermal/Stress Analysis of a Multichip Package Design, Proceedings of the 39th Electronic Components Conference , 1989, pp. 668 671.4Glushkova et al, "Gallium-Copper and Gallium-Nickel Paste Solders," Svar. Proiz., No. 11, 1968, pp. 36-37.5 *Glushkova et al, Gallium Copper and Gallium Nickel Paste Solders, Svar. Proiz. , No. 11, 1968, pp. 36 37.6 *Hansen, Constitution of Binary Alloys, McGraw Hill, 1958, pp. 22 & 96.7Hansen, Constitution of Binary Alloys, McGraw-Hill, 1958, pp. 22 & 96.8Harman, "Hard Gallium Alloys for Use as Low Contact Resistance Electrodes and for Bonding Thermocouples into Samples," The Review of Scientific Instruments, vol. 31, No. 7, Jul. 1960, pp. 717-720.9 *Harman, Hard Gallium Alloys for Use as Low Contact Resistance Electrodes and for Bonding Thermocouples into Samples, The Review of Scientific Instruments , vol. 31, No. 7, Jul. 1960, pp. 717 720.10Hwang et al, "A Thermal Module Design for Advanced Packaging," Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 347-355.11 *Hwang et al, A Thermal Module Design for Advanced Packaging, Journal of Electronic Materials , vol. 16, No. 5, 1987, pp. 347 355.12 *IBM Technical Disclosure Bulletin vol. 31, No. 5, Oct. 1988, p. 34.13Keeler, "Liquid Interconnects For Fine Pitch Assembly?" Electronic Packaging & Production, vol. 14, Jun. 1989.14 *Keeler, Liquid Interconnects For Fine Pitch Assembly Electronic Packaging & Production , vol. 14, Jun. 1989.15Nayak et al, "A High Performance Thermal Module for Computer Packaging," Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 357-364.16 *Nayak et al, A High Performance Thermal Module for Computer Packaging, Journal of Electronic Materials , vol. 16, No. 5, 1987, pp. 357 364.17P. Bujard, "Thermal Conductivity of Boron Nitride Filled Epoxy Resins: Temperature Dependence Influence of Sample Penetration", Intersociety Conference on Thermal Performance in the Fabrication and Operation of Electronic Components 1988, Los Angeles, Calif., May 11-13, 1988, pp. 41-49.18 *P. Bujard, Thermal Conductivity of Boron Nitride Filled Epoxy Resins: Temperature Dependence Influence of Sample Penetration , Intersociety Conference on Thermal Performance in the Fabrication and Operation of Electronic Components 1988 , Los Angeles, Calif., May 11 13, 1988, pp. 41 49.19Product Brochure entitled "High Performance Electronic Materials Manufactured by A. I. Technology, Inc." by A. I. Technology, Inc., Princeton, N.J. (date unknown) pp. 1-5.20Product Brochure entitled "Indalloy™ Fusible Alloys Available" by Indium Corporation of America, Utica, N.Y. (date unknown) pp. 1-5.21 *Product Brochure entitled High Performance Electronic Materials Manufactured by A. I. Technology, Inc. by A. I. Technology, Inc., Princeton, N.J. (date unknown) pp. 1 5.22 *Product Brochure entitled Indalloy Fusible Alloys Available by Indium Corporation of America, Utica, N.Y. (date unknown) pp. 1 5.23Product Brochure entittle "Z link™ Multilayer Technology" by Sheldahl, Inc., Northfield, Minn., (date unknown) pp. 1-8.24 *Product Brochure entittle Z link Multilayer Technology by Sheldahl, Inc., Northfield, Minn., (date unknown) pp. 1 8.25Technical Bulletin entitled "DieGlas™ Die Attach Material Processing Recommendations" by Alphametals, Jersey City, N.J., Feb. 1992, pp. 1-2.26 *Technical Bulletin entitled DieGlas Die Attach Material Processing Recommendations by Alphametals, Jersey City, N.J., Feb. 1992, pp. 1 2.27Thomas Dolbear, "Liquid Metal Paste for Thermal Connections", Proceedings of the International Electronic Packaging Society (IEPS), Sep., 1992, pp. 475-485.28 *Thomas Dolbear, Liquid Metal Paste for Thermal Connections , Proceedings of the International Electronic Packaging Society (IEPS) , Sep., 1992, pp. 475 485.29Tikhomirova, et al., "Effect of the Particle Shape and Size of a Second Component on the Properties of the Gallium Solders," Poroshkovaya Matallurgiya, No. 12(84), Dec. 1969, pp. 51-56.30Tikhomirova, et al., "Soldering Copper with Copper-Gallium Solders," Svar. Proiz., No. 10, 1967, pp. 16-18.31 *Tikhomirova, et al., Effect of the Particle Shape and Size of a Second Component on the Properties of the Gallium Solders, Poroshkovaya Matallurgiya , No. 12(84), Dec. 1969, pp. 51 56.32 *Tikhomirova, et al., Soldering Copper with Copper Gallium Solders, Svar. 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