text: _.Dj.prototype.mf=function(){var a=new Pi;this.H=a;var b=_.Ph.Eb();b.lb=!0;this.R();b.Oa=a;_.nfa(b);a.Za=b;b=_.ch("Im6cmf").Na()+"/jserror";sia(b);b=_.ab(_.ch("cfb2h").Na());Si.buildLabel=b;if(Cj)for(var b=Cj.H,c=0;c<_.Bj.length;c++)b.push(_.Bj[c]);var b=window,d,c=new rha,e=b||window,f=e.document.documentElement,g=new Fha(f);a:{for(var l=0;lXavier Antoviaque - Google+Press question mark to see available shortcut keysHomeCollectionsJoin Google+Send FeedbackHelpRegionPrivacy Policy - Terms of Service - Maps Terms©2017 GoogleSearchSign inAboutSearchSign inXavier Antoviaque3,883 followers - Community geekCommunity geek3,883 followersAboutXavier's posts Post has attachmentXavier AntoviaquePublic12w"Drawing on data from the European and World Values Surveys, the researchers found that the share of Americans who say that army rule would be a “good” or “very good” thing had risen to 1 in 6 in 2014, compared with 1 in 16 in 1995.That trend is particularly strong among young people. For instance, in a previously published paper, the researchers calculated that 43 percent of older Americans believed it was illegitimate for the military to take over if the government were incompetent or failing to do its job, but only 19 percent of millennials agreed. The same generational divide showed up in Europe, where 53 percent of older people thought a military takeover would be illegitimate, while only 36 percent of millennials agreed."How Stable Are Democracies? ‘Warning Signs Are Flashing Red’nytimes.com one plus one 1 no comments no shares Post has attachmentXavier AntoviaquePublic16w"In the United States, Britain and across the European Continent, people are convulsed with political frustration and anxiety about the future. Refugees and migrants clamor for the chance to live in these safe, prosperous countries, but those who already live in those promised lands report great uneasiness about their own futures that seems to border on hopelessness. Why?"Dalai Lama: Behind Our Anxiety, the Fear of Being Unneedednytimes.com one plus one 1 no comments no shares Post has attachmentXavier AntoviaquePublic27wHow Donald Trump Blew Up the ‘Gaffe’nytimes.com one plus one 1 no comments no shares Post has attachmentXavier AntoviaquePublic29w“Hear the Biography, not the ideology. ” How to Listen When You Disagree: A Lesson from the Republican National Conventionurbanconfessional.org no plus ones no comments no shares Post has attachmentXavier AntoviaquePublic31wEnglish version: http://www.nytimes.com/2016/07/20/opinion/jihad-and-the-french-exception.html"Si la France a intégré beaucoup d’étrangers et leurs descendants, ceux qu’elle a laissés en marge sont plus aigris que leurs congénères allemands ou anglais : Nombreux d’entre eux se sentent offensés dans leur identité arabe ou musulmane. La laïcité, si inflexible, semble dénier leur dignité. A cela s’ajoute une politique étrangère française musclée qui semble privilégier pour cibles des pays musulmans comme la Libye, la Syrie ou le Mali."Le système d’intégration français est généreux dans ses principes mais trop rigide dans sa pratique. Les réalités de la société française aujourd’hui exigent une approche plus pragmatique et plus souple, avec moins de diktats idéologiques et moins d’anxiété face à la pluralité. La France n’est plus ce qu’elle était et il est temps qu’elle se fasse à cette idée."TranslateShow original textLe djihad et l’exception française - NYTimes.commobile.nytimes.com one plus one 1 no comments no shares Post has attachmentXavier AntoviaquePublic33w"When you cross a busy intersection or pore over a spreadsheet, you are depleting finite reserves of voluntary, directed attention. The antidote is not, as one might first guess, to sit quietly in a darkened room.“The environment has to have some kind of stimulation to activate your involuntary attention—your fascination,” Berman said. Urban environments can certainly elicit involuntary attention (honking horns in Times Square), but they do so in a harsh, peremptory way that requires voluntary attention to override.Natural environments, on the other hand, provide what Berman calls “softly fascinating stimulation.” Your eye is captured by the shape of a branch, a ripple in the water; your mind follows."How Trees Calm Us Down - The New Yorkernewyorker.com one plus one 1 no comments no shares Post has attachmentXavier AntoviaquePublic36wRichard Feynman talking about the beauty science adds to the world. Beautiful!See https://www.youtube.com/playlist?list=PL92F9FC91BBE2210D for the rest of the series.THE FEYNMAN SERIES - Beauty 3 plus ones 3 no comments no shares Post has attachmentXavier AntoviaquePublic40w“Compare the response to Hurricane Katrina,” Harris suggested, with “the response to the 9/11 act of terrorism.” For many Americans, the men who hijacked those planes are the embodiment of criminals who freely choose to do evil. But if we give up our notion of free will, then their behavior must be viewed like any other natural phenomenon—and this, Harris believes, would make us much more rational in our response.Although the scale of the two catastrophes was similar, the reactions were wildly different. Nobody was striving to exact revenge on tropical storms or declare a War on Weather, so responses to Katrina could simply focus on rebuilding and preventing future disasters. The response to 9/11, Harris argues, was clouded by outrage and the desire for vengeance, and has led to the unnecessary loss of countless more lives. Harris is not saying that we shouldn’t have reacted at all to 9/11, only that a coolheaded response would have looked very different and likely been much less wasteful. “Hatred is toxic,” he told me, “and can destabilize individual lives and whole societies. Losing belief in free will undercuts the rationale for ever hating anyone.”There's No Such Thing as Free Will - The Atlantictheatlantic.com no plus ones no comments no shares Post has attachmentXavier AntoviaquePublic42w"Basic income is an idea that's been talked about for decades and is currently being hotly debated around the globe, but it's never actually been fully tried and tested. So we're going to do it and study it."GiveDirectly's Basic Income Guaranteegivedirectly.org one plus one 1 no comments no shares Post has attachmentXavier AntoviaquePublic44whttp://www.nytimes.com/2016/04/20/opinion/dilma-rousseffs-impeachment-isnt-a-coup-its-a-cover-up.html"An enormous corruption investigation, known as Operação Lava Jato, or Operation Car Wash, has exploded in the political system’s face. At first, when the investigation began in 2014, investigators accused members of Ms. Rousseff’s left-wing Workers Party of using Petrobras, the state-run oil company, to trade kickbacks for political favors.There is more and more evidence that this kind of practice was common among Brazilian political parties. The investigation has expanded to include a host of figures across the political spectrum, including roughly 50 politicians and a handful of business leaders.Unlike many Brazilian politicians, Ms. Rousseff isn’t accused of taking bribes or trading cash for favors.(...)The crisis brought on by the Operation Car Wash scandals should have been part of Brazil’s painful — and extraordinary — process of establishing a functioning judiciary and fighting corruption. But Ms. Rousseff’s fall is not the logical conclusion of that happy story. Far from being the dawn of a new era, it may very well turn out to be the way the old political class reasserts control over the country — and escapes jail."Dilma Rousseff’s Impeachment Isn’t a Coup, It’s a Cover-Upnytimes.com 6 plus ones 6 one comment 1 2 shares 2 Ricardo Jorge: What about Forum de São Paulo ? Some details are not exposed here for the public outside Brazil. What about Pasadena refiney : http://www.houstonchronicle.com/news/houston-texas/houston/article/Brazilian-scandal-centers-on-purchase-of-Pasadena-6618757.phpLooks like you've reached the endLooks like you've reached the endUnable to load more. RetryWait while more posts are being loaded

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Council Overrides Barry's Veto on People's Counsel - The Washington Post
Council Overrides Barry's Veto on People's Counsel
By Marcia Slacum Greene and Sharon LaFraniere December 5, 1984
The D.C. City Council yesterday voted 11 to 1 to override Mayor Marion Barry's veto of a bill that would increase the authority of the D.C. people's counsel and curtail Public Service Commission staff participation in rate cases.
The PSC's general counsel called the council's action "a defeat" that would "handicap" the PSC's ability to meet its regulatory responsibilities. But People's Counsel Frederick D. Dorsey said the legislation would "resolve many of the problems that have beset" his office.
Barry, who entered the council chambers several times during the meeting and sat in the hallway outside the chambers when the roll call began, left before the vote was completed and could not be interviewed.
"It was not a do-or-die situation," Barry said through a spokesman. "We win some and we lose some and the city was very concerned about the high rates and we will have to wait and see what happens."
Although Barry lost on the veto, he won at least a temporary victory on a bill he had opposed to overhaul the city's long-troubled purchasing and warehousing system. After intense negotiations with Barry and others, council member William Spaulding (D-Ward 5), the bill's sponsor, withdrew the measure, saying that changes had been proposed for the bill that need further study.
The vote to override the veto came during a 5 1/2-hour meeting in which the council considered a laundry list of legislative measures, including a bill to establish more stringent requirements for obtaining hackers' licenses, the final and most controversial element of the city's Comprehensive Plan and resolutions to give 24,000 District employes salary bonuses.
By the time the council met yesterday, consumer groups had lobbied for an override of the mayor's veto of the utility regulatory bill, which would increase the people's counsel's authority to assess utility companies for the costs of representing consumers in rate cases. Consumers and some City Council members who supported the bill argued that consumers would pay higher rates without the bill.
In vetoing the bill last Friday, Barry referred to the PSC's opposition to a provision in the bill that would prohibit the PSC's staff from continuing to take formal positions on rate increases. But City Council Chairman David A. Clarke said the veto was not justified and introduced a motion to override it.
Before the council voted, only two other members, City Council member John Ray (D-At Large) and council member Jerry A. Moore Jr.(R-At Large) -- the only member to vote against the override -- spoke.
Ray, who favored allowing the PSC staff to participate in rate hearings, said that claims that utility bills would increase without the bill were "scare tactics" and that objections to the bill had "nothing to do with the authority of the people's counsel."
Ray, however, said he would vote to override the veto because the special legislation under which the people's counsel has been operating expires in February and the council would not have sufficient time to adopt other legislation.
Howard Davenport, PSC general counsel, said that the PSC's only objection to the bill was the limitation placed on its staff. "The PSC believes that its staff provided helpful testimony on very complex issues and that only the PSC staff takes a position on what is in the public interest," he said.
Meanwhile, Spaulding's move to pull the bill to reorganize the city's purchasing system took most of the council by surprise.
Monday night, aides for Spaulding worked with Barry staff members and with council member Charlene Drew Jarvis (D-Ward 4) on half a dozen amendments to the year-old bill. Spaulding said he decided the proposals were too major to be debated before the full council and he would bring the bill up again in committee.
Jarvis, who wanted to include an amendment on minority contracting, agreed with Spaulding. "These are not the sort of things you work out midnight the night before," she said. But aides for other council members interpreted the bill's withdrawal as capitulation to political pressure from the mayor, who has strongly opposed a provision that would dictate how he should allocate purchasing authority.
"There was obviously enough time," said one aide, who asked not to be identified. "The amendments were only an excuse to withdraw it. It gave the mayor more time and Spaulding an out."
The bill marked the council's first legislative attempt to respond to numerous studies that called for centralization of the city's purchasing and warehousing operations to cut down on waste and mismanagement. The bill would put the Department of Administrative Services clearly in charge, transferring what may amount to hundreds of procurement officers now scattered throughout city government to that department.
Supporters of the bill said they believed the city would be able to save money and better guard against abuses if it had a strong central authority to combine and police purchases. However, Jarvis said she questioned whether the bill's requirement that all purchasing officials be under one roof was necessary.
In a six-month investigation of the purchasing system this year, The Washington Post reported that the city may be losing as much as $5 to $7 million dollars a year by allowing individual agencies to handle much of their own purchasing. The Post also found a widespread pattern of abuse of competitive bidding procedures at major city agencies.
Barry's amendments would have established a centralized purchasing system but would have let him choose which agency should operate it.
The mayor's amendments would also have given him more say over who sits on a contracts appeals board that hears complaints by contractors and would have increased the bill's leeway on purchases made through informal bidding procedures.
Pauline Schneider, the mayor's chief lobbyist on the bill, said the mayor "agrees with the thrust of the bill" and plans to work closely with Spaulding on it but was "very pleased" with its withdrawal from the agenda yesterday.
Though the council backed off from a full-scale revamping of the purchasing system, it tentatively passed a bill to deal with one long-standing criticism of the city's purchasing system -- late payments to vendors.
The bill, sponsored by council member Nadine Winter (D-Ward 6) and Betty Ann Kane (D-At Large), requires the city to pay its bills within 45 days or pay vendors interest of at least 1 percent a month.
* Tentatively adopted a substantially amended taxicab bill that establishes more stringent requirements for obtaining hackers' licenses.
The measure, introduced by City Council member H.R. Crawford (D-Ward 7) in response to a growing number of complaints about taxicab service, would expand the examination from 25 questions to 60, require new applicants to take a training course to learn the city and taxicab regulations and authorize the mayor to establish a point system that could be used to revoke or suspend licenses of drivers who violate taxicab or traffic laws.
* Revised and gave initial approval to a land-use plan that would chart commercial and residential development in the city. Adoption of the land-use segment will complete the city's Comprehensive Plan, which is a guide for the next 20 years for city policies in such areas as transportation, housing and human services.

type: global

value: This website is an American daily newspaper published in Washington, D.C. It is the most-widely circulated newspaper within the Washington metropolitan area, and has a large national audience. Daily broadsheet editions are printed for D.C., Maryland, and Virginia.


text:
Talk:Urdu literature - Wikipedia
A fact from Urdu literature appeared on Wikipedia's Main Page in the Did you know? column on 16 October 2004. The text of the entry was as follows: "Did you know
...that Urdu literature is dominated by poetry, often of the ghazal form?"
BTW, how did you get it to turn up on the Main Page's Did You Know? thing?--iFaqeer 03:32, Sep 16, 2004 (UTC)
Raikhtha ...[edit]
There is no mention of other names of the language anywhere. Especially the word raikhtha is a very useful name for the pre-Urdu dialects and the language itself. Its meaning (a mix, mixture, mongrel) captures the character of it's origins and nature.--iFaqeer 00:36, Sep 17, 2004 (UTC)
Needed major clean-up[edit]
This article needs major clean-up,there are many unrelevant category poets and not so much important for this kind of article.I will do that work any day.Justice007 (talk) 07:37, 18 April 2012 (UTC)
Retrieved from "https://en.wikipedia.org/w/index.php?title=Talk:Urdu_literature&oldid=607309943"
This page was last edited on 6 May 2014, at 11:06.

value: This website is the English-language edition of the free online encyclopedia Wikipedia. It was founded on 15 January 2001 as Wikipedia's first edition and, as of October 2021, has the most articles of any edition, at 6,412,521.


text:
Hot springs (Audiobook on CD, 2000) [WorldCat.org]
I thought you might be interested in this item at http://www.worldcat.org/oclc/52613533 Title: Hot springs Author: Stephen Hunter; Jay O Sanders Publisher: New York : Encore : Simon & Schuster Audio, ℗2000. ISBN/ISSN: 0743532686 9780743532686 OCLC:52613533
New York : Encore : Simon & Schuster Audio, ℗2000.
It is the summer of 1946, organized crime's garish golden age, when American justice seems to have gone to seed for good. Nowhere is this more true than in Hot Springs, Arkansas, the reigning capital of corruption.
0743532686 9780743532686
52613533
Add tags for "Hot springs". Be the first.
<http://www.worldcat.org/oclc/52613533> # Hot springs
library:oclcnum "52613533" ;
schema:description "It is the summer of 1946, organized crime's garish golden age, when American justice seems to have gone to seed for good. Nowhere is this more true than in Hot Springs, Arkansas, the reigning capital of corruption."@en ;
schema:isPartOf <http://experiment.worldcat.org/entity/work/data/292525611#Series/earl_swagger_novel> ; # Earl Swagger novel ;
schema:productID "52613533" ;
schema:publication <http://www.worldcat.org/title/-/oclc/52613533#PublicationEvent/new_york_encore_simon_&_schuster_audio_2000> ;
schema:publisher <http://experiment.worldcat.org/entity/work/data/292525611#Agent/encore> ; # Encore
schema:workExample <http://worldcat.org/isbn/9780743532686> ;
wdrs:describedby <http://www.worldcat.org/title/-/oclc/52613533> ;
<http://experiment.worldcat.org/entity/work/data/292525611#Agent/encore> # Encore
<http://experiment.worldcat.org/entity/work/data/292525611#Person/hunter_stephen_1946> # Stephen Hunter
<http://experiment.worldcat.org/entity/work/data/292525611#Series/earl_swagger_novel> # Earl Swagger novel ;
schema:creator <http://experiment.worldcat.org/entity/work/data/292525611#Person/hunter_stephen_1946> ; # Stephen Hunter
schema:hasPart <http://www.worldcat.org/oclc/52613533> ; # Hot springs
schema:name "Earl Swagger novel ;" ;
<http://worldcat.org/isbn/9780743532686>
schema:isbn "0743532686" ;
schema:isbn "9780743532686" ;
<http://www.worldcat.org/title/-/oclc/52613533>
schema:about <http://www.worldcat.org/oclc/52613533> ; # Hot springs
<http://www.worldcat.org/title/-/oclc/52613533#PublicationEvent/new_york_encore_simon_&_schuster_audio_2000>
schema:organizer <http://experiment.worldcat.org/entity/work/data/292525611#Agent/encore> ; # Encore
Hot springs/Stephen Hunter; Jay O Sanders; New York : Encore : Simon & Schuster Audio, ℗2000.

value: This website is a union catalog that itemizes the collections of 15,637 libraries in 107 countries that participate in the OCLC global cooperative. It is operated by OCLC, Inc.


text:
Revision as of 20:05, 18 August 2013 (view source)Gbo17 (talk | contribs) (added link)← Older edit
Revision as of 01:55, 19 August 2013 (view source) Gbo17 (talk | contribs) (moved topics)Newer edit →
''[[United States|United States]] [[Image:Gotoarrow.png]] [[Washington'' [[Image:Gotoarrow.png]] '''Thurston County'''
 ''[[United States|United States]] [[Image:Gotoarrow.png]] [[Washington'' [[Image:Gotoarrow.png]] '''Thurston County'''
 −Guide to '''Thurston County Washington genealogy.''' Birth records, marriage records, death records, census records, family history, and military records.
 [[Image:{{WAThurstonPercival}}]] +Guide to '''Thurston County Washington genealogy.''' Birth records, marriage records, death records, census records, family history, and military records.
 [[Image:{{WAThurstonPercival}}]]

{{DCWAmapbuttonleft}}

{{DCWAmapbuttonleft}}

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:::*[[{{PAGENAME}}#Death|Death]] :::*[[{{PAGENAME}}#Death|Death]]
−{{Infobox U.S. CountyfckLR| county = Thurston CountyfckLR| county_map = Wa-thurston.pngfckLR| state = WashingtonfckLR| state_map = Washington.pngfckLR| latd =fckLR| longd =fckLR| founded year = 1852fckLR| founded date = 12 JanuaryfckLR| seat = OlympiafckLR| building image = fckLR| building address = [http://www.co.thurston.wa.us/clerk/ Thurston County Courthouse|&amp;amp;amp;lt;br&amp;amp;amp;gt; 2000 Lakeridge Dr SW; Olympia, WA 98502&amp;amp;amp;lt;br&amp;amp;amp;gt; Phone: 360.786.5438&amp;amp;amp;lt;br&amp;amp;amp;gt;[http://www.Thurstoncounty.us/ '''Thurston County Website'''] }} +{{Infobox U.S. CountyfckLR| county = Thurston CountyfckLR| county_map = Wa-thurston.pngfckLR| state = WashingtonfckLR| state_map = Washington.pngfckLR| latd =fckLR| longd =fckLR| founded year = 1852fckLR| founded date = 12 JanuaryfckLR| seat = OlympiafckLR| building image = fckLR| building address = [http://www.co.thurston.wa.us/clerk/ Thurston County Courthouse|&amp;amp;amp;amp;lt;br&amp;amp;amp;amp;gt; 2000 Lakeridge Dr SW; Olympia, WA 98502&amp;amp;amp;amp;lt;br&amp;amp;amp;amp;gt; Phone: 360.786.5438&amp;amp;amp;amp;lt;br&amp;amp;amp;amp;gt;[http://www.Thurstoncounty.us/ '''Thurston County Website'''] }} === County Overview === === County Overview ===
Thurston County’s name came from Samuel R. Thurston (1816-1851), the first delegate to Congress in 1849 from the new Oregon Territory, who had made a name for himself during his brief tenure in office defending the territorial rights of the northern part of Oregon Territory against the claims of the Hudson’s Bay Company.<ref>HistoryLink.org - The Free Onlline Encyclopedia of Washington State History</ref> Thurston County’s name came from Samuel R. Thurston (1816-1851), the first delegate to Congress in 1849 from the new Oregon Territory, who had made a name for himself during his brief tenure in office defending the territorial rights of the northern part of Oregon Territory against the claims of the Hudson’s Bay Company.<ref>HistoryLink.org - The Free Onlline Encyclopedia of Washington State History</ref> −{| cellspacing="1" cellpadding="1" border="2" width="100%"+{| width="100%" cellspacing="1" cellpadding="1" border="2"
| width="16.6%" valign="middle" | '''[[Thurston County, Washington#Birth|Birth]]''' | width="16.6%" valign="middle" | '''[[Thurston County, Washington#Birth|Birth]]''' Line 41:
−| bgcolor="#99d6ff" width="100%" colspan="6" | '''* For earlier dates, try...''' '''[[Thurston County, Washington#Church_Records|Church]] | [[Thurston County, Washington#Obituaries|Obituaries]] | [[Thurston County, Washington#Cemeteries|Cemeteries]]'''+| width="100%" bgcolor="#99d6ff" colspan="6" | '''* For earlier dates, try...''' '''[[Thurston County, Washington#Church_Records|Church]] | [[Thurston County, Washington#Obituaries|Obituaries]] | [[Thurston County, Washington#Cemeteries|Cemeteries]]'''
−===== Courthouse ===== − −[http://www.co.thurston.wa.us/clerk/ Thurston County Courthouse]
 2000 Lakeridge Dr SW;
Olympia, WA 98502
 Phone: 360.786.5438

County Auditor has birth and death records 1891-1907
and marriage records from 1891.
County Clerk has divorce probate and court records. <ref name="HBG">''Handybook for Genealogists: United States of America'', 10th ed. (Draper, Utah: Everton Pub., 2002), Thurston County, Washington page 734, {{WorldCat|50140092|disp=At various libraries (WorldCat)}}; {{FHL|1049485|item|disp=FHL Book 973 D27e 2002}}.</ref> − −Many civil records have been digitized and are available through the Thurston County Clerk's Office: [http://www.co.thurston.wa.us/clerk/citizens%20guide.html http://www.co.thurston.wa.us/clerk/citizens%20guide.html] − −===== Family History Centers ===== − −*[[Introduction to LDS Family History Centers]] −*[[Olympia Washington Family History Center]] − −===== Libraries ===== − −*[http://www.trl.org/Pages/default.aspx Olympia Timberland Library] −*[[United States Archives and Libraries|United States Archives and Libraries]] −*[http://libraries.com/ Libraries.com] ~Lists public libraries by state/county~ −*[https://familysearch.org/locations Family History Centers]  −*[http://www.worldcat.org/ WorldCat Library Catalog] −*[http://www.acpl.lib.in.us/genealogy/stateres.html Allen County Public Library] Genealogy Center −*[[National Archives and Records Administration|Nathional Archives and Records Administration]] − −===== Museums ===== − −===== Societies ===== *[http://www.rootsweb.ancestry.com/~waogs/ http://www.rootsweb.ancestry.com/~waogs/ Olympia Genealogical Society] *[http://www.rootsweb.ancestry.com/~waogs/ http://www.rootsweb.ancestry.com/~waogs/ Olympia Genealogical Society] Line 320:
*Check websites and catalogs, such as items in {{FHL|Washington, Thurston|place|disp=FamilySearch Library}} (Utah) or [http://smartcat.acpl.lib.in.us/?q=thurston+county+Washington Allen County Public Library] (Indiana) for {{PAGENAME}}. {{GetACopy tip}} *Check websites and catalogs, such as items in {{FHL|Washington, Thurston|place|disp=FamilySearch Library}} (Utah) or [http://smartcat.acpl.lib.in.us/?q=thurston+county+Washington Allen County Public Library] (Indiana) for {{PAGENAME}}. {{GetACopy tip}}
+[http://www.co.thurston.wa.us/clerk/ Thurston County Courthouse]
 2000 Lakeridge Dr SW;
Olympia, WA 98502
 Phone: 360.786.5438

County Auditor has birth and death records 1891-1907
and marriage records from 1891.
County Clerk has divorce probate and court records. <ref name="HBG">''Handybook for Genealogists: United States of America'', 10th ed. (Draper, Utah: Everton Pub., 2002), Thurston County, Washington page 734, {{WorldCat|50140092|disp=At various libraries (WorldCat)}}; {{FHL|1049485|item|disp=FHL Book 973 D27e 2002}}.</ref> +
+Many civil records have been digitized and are available through the Thurston County Clerk's Office: [http://www.co.thurston.wa.us/clerk/citizens%20guide.html http://www.co.thurston.wa.us/clerk/citizens%20guide.html] +
+*[[Introduction to LDS Family History Centers]] +*[[Olympia Washington Family History Center]]
+*[http://www.trl.org/Pages/default.aspx Olympia Timberland Library] +*[[United States Archives and Libraries|United States Archives and Libraries]] +*[http://libraries.com/ Libraries.com] ~Lists public libraries by state/county~ +*[https://familysearch.org/locations Family History Centers]  +*[http://www.worldcat.org/ WorldCat Library Catalog] +*[http://www.acpl.lib.in.us/genealogy/stateres.html Allen County Public Library] Genealogy Center +*[[National Archives and Records Administration|Nathional Archives and Records Administration]]
−See a list of towns and communities in [http://en.wikipedia.org/wiki/Thurston_County,_Washington#Census-recognized_communities Thurston County] per Wikipedia.+See a list of towns and communities in [http://en.wikipedia.org/wiki/Thurston_County,_Washington#Census-recognized_communities Thurston County] per Wikipedia. −=== References ===+=== References ===
<references /> {{Washington|Washington}} <references /> {{Washington|Washington}} [[Category:Thurston_County,_Washington]] [[Category:Thurston_County,_Washington]]
Revision as of 01:55, 19 August 2013
United States [[Washington Thurston County Guide to Thurston County Washington genealogy. Birth records, marriage records, death records, census records, family history, and military records. [[Image:Template:WAThurstonPercival]] WashingtonOnline Records Quick start: Census Birth Marriage Death
Template:Infobox U.S. CountyfckLR Contents
In August 1848 Congress established Oregon Territory, which included the future state of Washington. By 1850 there were more than 300 non-Indian inhabitants north of the Columbia River, and as the new communities on and near the southern shores of Puget Sound began to grow, so grew the need for a local organized government and a new county. Simmons (in honor of Michael Simmons) was proposed as the name of the new county. Instead, Thurston was chosen as the new county’s name and Olympia was chosen as the county seat. The Oregon Territorial Legislature carved the new county out of Lewis County on January 12, 1852. The early Thurston County was considerably larger than it is today, covering territory from west of the Cascades to the coast and north to the Canadian border. However, other counties were quickly formed from parts of Thurston County and by 1877 it had been reduced to its present size. Thurston County’s name came from Samuel R. Thurston (1816-1851), the first delegate to Congress in 1849 from the new Oregon Territory, who had made a name for himself during his brief tenure in office defending the territorial rights of the northern part of Oregon Territory against the claims of the Hudson’s Bay Company.[1] Beginning dates for major county records
Parent County: created 12 January 1852 from Lewis County Seat: Olympia [2] Neighboring Counties: Grays Harbor | Lewis | Mason | Pierce
The types of records that follow are used for genealogy and family history. Most tell what you may learn and how to locate the records. Links to Internet sites usually go directly to Thurston County, Washington Genealogy entries with names, images, or information. Don't overlook Thurston County, Washington Genealogy items in the FamilySearch Library Catalog. For other libraries (local and national) or to gain access to items of interest, see Archives and Libraries. FamilySearch Catalog
Following is list of sites where you might find county-specific information that you could add to your county page, as well as general links you might wish to include as further research resources. United States Family History Library Catalog Google Wee Monster Genealogy Webpages Linkpendium ProGenealogist ~part of this site is free~ Cyndislist US GenWeb[1] Genealogy Links State Archives Genealogylinks.net The Online Books Page, Click on Books Online, click on Subjects at the bottom of the page. One Step ~ Stephen P. Morse Olive Tree Genealogy Internet Archive: Digital Library of Free Books ~ In the search widow type in a subject or surname. FamilyHistory 101 FamilySearch Ancestry.com ~pay for site~ free patron use in most Family History Centers Footnote.com ~pay for site~ free patron use in most Family History Centers Heritagequest.com ~pay for site~ free patron use in most Family History Centers
Thurston County, Washington Cemeteries - USGenWeb project. Thurston County, Washington Cemeteries. Ruddel Cemetery, Lacey, Thurston County, Washington. Cemetery records of Thurston County, Washington United States Cemeteries Tombstone Transcription Project ~ Partial transcription of cemetery tombstones ~ search on your county USGenWeb Interment.net ~ Cemetery listing and transcriptions ~ Search on your county African American Cemeteries Online ~ Partial index/transcriptions of African American cemeteries Find-A-Grave ~ search by locations About.com Genealogy ~ Cemeteries Online
The information church records provide depends upon the church practices and the record keepers. Records may include names, ages, and dates of events such as baptism, marriage, or burial. See Washington Church Records. United States Church Records Family History Library Catalog USGenWeb Church Records Project Search at Church Directory of the United States Search at Net Ministries Search at USA Church Yellowbook Business, People Search, Reverse lookup Google "church and your county name"
Thurston County Washington Genealogy & Family History Resources Newspaper genealogical abstracts, the Morning Daily Olympian, Thurston County, Washington, 1891-1907
Historical County Boundaries from Newberry Library[3] Emphasis for this timeline is on events that affected migration, records, or record-keeping. Unless otherwise mentioned, the events below were gleaned from Wilma, David. Okanogan County -- Thumbnail History, History Link.org Essay 7608. Land and Property
Declarations of Intent before 1906 often include the nation of origin, his* foreign and "Americanized" names, residence, and date of arrival. See Washington Naturalization and Citizenship for more information. (*Women were not naturalized until 1922 in the United States.) Indexes to naturalization records of the Thurston County Territorial and Superior Courts, 1850-1974 : National Archives microfilm publications pamphlet describing M1234 Naturalization index (Thurston County, Washington) Naturalization records (Thurston County, Washington) Thurston County naturalization records, 1834-1974; index, 1850-1974 Washington, Thurston County, naturalization records
Washington State Cemetery & Obituary Resources Thurston County, Washington Obituaries
Thurston County Courthouse 2000 Lakeridge Dr SW; Olympia, WA 98502 Phone: 360.786.5438County Auditor has birth and death records 1891-1907 and marriage records from 1891. County Clerk has divorce probate and court records. [4] Many civil records have been digitized and are available through the Thurston County Clerk's Office: http://www.co.thurston.wa.us/clerk/citizens%20guide.html Family History Centers
Olympia Timberland Library United States Archives and Libraries Libraries.com ~Lists public libraries by state/county~ Family History Centers WorldCat Library Catalog Allen County Public Library Genealogy Center Nathional Archives and Records Administration
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WASHINGTON, Aug. 29, 2016 /PRNewswire-USNewswire/ -- Students in Hyden, Kentucky, will have the opportunity to speak with two NASA astronauts currently living and working aboard the International Space Station at 1:10 p.m. EDT Wednesday, Aug. 31. The 20-minute, Earth-to-space call will air live on NASA Television and the agency's website.
Expedition 48 Commander Jeff Williams and Flight Engineer Kate Rubins will answer questions from students of Leslie County High School at the Hazard Community & Technical College's (HCTC) School of Bluegrass and Traditional Music in Hyden.
Rep. Hal Rogers of Kentucky will kick-off the event, joined by NASA astronaut Tim Kopra, who returned from the space station June 18.
Media interested in covering the event should contact Danielle Smoot at danielle.smoot@mail.house.gov or 606-679-8346. The HCTC School of Bluegrass and Traditional Music is located at 108 Maple St.
Williams launched to the space station March 18 and is scheduled to depart Sept. 6. Rubins launched July 6 and will return home in October.
This in-flight education downlink is an integral component of the NASA Office of Education's efforts to improve science, technology, engineering and mathematics (STEM) teaching and learning in the United States. Linking students directly to astronauts aboard the space station through the Education Office's STEM on Station activity provides authentic, live experiences in space exploration, space study and the scientific components of space travel, while introducing the possibilities of life in space.
To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/kentucky-students-talk-live-with-nasa-astronauts-on-space-station-300319342.html
Preview: NASA Holds Final Sample Return Robot Competition


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BLACK SOFT SILICONE CASE COVER FOR DELL STREAK + FILM: Amazon.co.uk: Electronics
ASIN: B0048777HK
#208500 in Electronics & Photo > Accessories > Mobile Phone Accessories > Cases & Covers
#381422 in Electronics & Photo > Phones > Mobile Phones & Communication
4.0 out of 5 starsA decent case for an exceptional price
At under £4 this case seriously cannot be faulted. The fit is brilliant, and it's not too chunky - you'd pay that price alone for the screen protector at some high street mobile phone shops.
It gives a good degree of scratch protection and encapsulates the phone very well, although the rubber isn't over thick and perhaps it would only be suitable for protection against short drops.
Best case ever, for the best tablet/phone ever which was assassinated by 3, they should be shot!
5.0 out of 5 starsIt actually fits...
For the price I was willing to cut it a little slack (pun intended). but it fits nicely. The screen protector is probably good too, but as has happened many times before, I made a complete mess of applying it. Needless to say (then why say it?) it's lying atop my wastebasket.
It hardly increases the size of the Streak (although it won't fit in it's little bag anymore), feels comfortable in the hand too.
items is as shown
5.0 out of 5 starscheap but solid feel
4.0 out of 5 starsDell Streak protector
4.0 out of 5 starsGreat case cover but where's the film
I bought this with not the highest expectations. I wasn't let down by the product. I received it very quickly, I ordered on a Friday and it arrived on a Monday.Read more
4.0 out of 5 starsDell cover
Purchased this item and it was received within 3 days. Unfortunately the company forgot to send out the film cover.Read more
Anthony D. Cairns
4.0 out of 5 starsCheap but alright!
It is a cheap-made case but it protect your mobile, the price is great and you should not expect something superb with this price but considering the price, it is a good...Read more
5.0 out of 5 starsSilicone case for Dell Streak
The image for this item is not exactly very detailed and does not show the products full features well, however after receiving this product it fits PERFECTLY on my Dell, provides...Read more

value: This website is an American multinational technology company which focuses on e-commerce, cloud computing, digital streaming, and artificial intelligence.


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Patent US5548482 - Semiconductor integrated circuit apparatus including clamped heat sink - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign in<nobr>Advanced Patent Search</nobr>PatentsThe present invention provides a semiconductor integrated circuit apparatus with a heat sink that can be changed in size, that accommodates a board and electronic parts having different sizes, and that increases heat radiation. The present invention includes a cooling member facing and connected to electronic...http://www.google.com/patents/US5548482?utm_source=gb-gplus-sharePatent US5548482 - Semiconductor integrated circuit apparatus including clamped heat sinkAdvanced Patent SearchPublication numberUS5548482 APublication typeGrantApplication numberUS 08/466,929Publication dateAug 20, 1996Filing dateJun 6, 1995Priority dateAug 26, 1994Fee statusLapsedPublication number08466929, 466929, US 5548482 A, US 5548482A, US-A-5548482, US5548482 A, US5548482AInventorsKazushi Hatauchi, Haruo ShimamotoOriginal AssigneeMitsubishi Denki Kabushiki KaishaExport CitationBiBTeX, EndNote, RefManPatent Citations (4), Referenced by (40), Classifications (20), Legal Events (5) External Links: USPTO, USPTO Assignment, EspacenetSemiconductor integrated circuit apparatus including clamped heat sinkUS 5548482 AAbstract The present invention provides a semiconductor integrated circuit apparatus with a heat sink that can be changed in size, that accommodates a board and electronic parts having different sizes, and that increases heat radiation. The present invention includes a cooling member facing and connected to electronic parts via a thermally conductive resin or thermally conductive fat and fatty oil and at least two thermally conductive clamps that are soldered to a board and that support portions of the perimeter of the cooling member.
What is claimed is: 1. A semiconductor integrated circuit apparatus having:a board and a plurality of electronic parts, such as semiconductor integrated circuit devices, mounted on said board; a cooling member disposed opposite said electronic parts; a thermally conductive material disposed between and contacting said electronic parts and said cooling member; and at least two thermally conductive clamps soldered to said board, clamping said cooling member at a periphery, and urging said cooling member against said thermally conductive material and toward said electronic parts wherein said board includes at least one thermal via and at least one of said clamps is soldered to said board at said at least one thermal via. 2. A semiconductor integrated circuit apparatus having:a board and a plurality of electronic parts, such as semiconductor integrated circuit devices, mounted on said board; a cooling member disposed opposite said electronic parts; a thermally conductive material disposed between and contacting said electronic parts and said cooling member; and at least two thermally conductive clamps soldered to said board, clamping said cooling member at a periphery, and urging said cooling member against said thermally conductive material and toward said electronic parts wherein said electronic parts have different heights relative to said board and said cooling member includes protrusions protruding toward said electronic parts and providing continuous mechanical connections between said electronic parts and said cooling member through said thermally conductive material. Description
The present invention relates to improvement of a semiconductor integrated circuit apparatus having electronic parts such as semiconductor integrated circuit devices and a cooling apparatus for the electronic parts on a board.
FIG. 11 is a cross-sectional view showing an example of a conventional semiconductor integrated circuit apparatus having an electronic part such as a semiconductor integrated circuit device and a cooling apparatus for the electronic part on a board. As shown in FIG. 11, heretofore, when a cooling member such as a heat sink fin 3 is attached to an electronic part 1 mounted on a board 2, an adhesive 8 is used for bonding. However, this method has a possibility that, if the heat sink fin 3 is detached from the electronic part 1, both parts may be broken. In addition, if the heat sink fin 3 is fixed on the board with screws (for example, Japanese Patent Laid-Open No. 5-243439), it is possible to detach the heat sink fin 3 from the electronic part 1 without damage by removing these screws. However, in case of using screws, tapped holes should be prepared in the board 2, and consequently this causes a problem that parts mounting density on the board is reduced by these tapped holes.
In order to solve these problems, recently, a constitution has been proposed in which a heat sink fin is attached through thermally-conductive fats and fatty oils such as a thermally-conductive grease or a thermally-conductive resin on the upper face of a semiconductor package, and this heat sink fin is compressed with springs that are attached under a fixed plate fixed on the board (for example, Japanese Patent Laid-Open No. 5-82688).
However, in the conventional semiconductor integrated circuit apparatus as described above, since a fixed plate supports a heat sink fin from four directions and an upper direction, a fixed plate can be used only for a heat sink fin having a size corresponding to the fixed plate. In general, the sizes of electronic parts such as a semiconductor package and heat sink fin corresponding to it, in particular, the sizes in the direction parallel to a board are various. Therefore, this causes problems that, if a heat sink fin is changed to a new one in different size, there may be no fixed plate suitable to the new heat sink fin, and, even if the suitable fixed plate is available, time is wasted in searching for and exchanging plates.
In addition, there are electronic parts and heat sink fins of various sizes not only parallel to but also perpendicular to a board. However, in a conventional semiconductor integrated circuit apparatus, it is very difficult flexiblely to respond to size changes of electronic parts in the these directions.
Further, in a conventional semiconductor integrated circuit apparatus, it is difficult to radiate sufficient heat from electronic parts efficiently.
Furthermore, in conventional semiconductor integrated circuit apparatus, it is not possible sufficiently to respond to a plurality of electronic parts having significantly different heights, with one cooling member.
SUMMARY OF THE INVENTION The present invention is intended as a solution to the aforesaid problems. The first object of the present invention is to provide a semiconductor integrated circuit apparatus having a cooling apparatus for electronic parts that can accommodate a change in a cooling member to a different size in a direction parallel to a board.
In addition, the second object is to provide a semiconductor integrated circuit apparatus having a cooling apparatus for electronic parts that can accommodate a change of a cooling member to a member having a different size in directions parallel and perpendicular to a board.
Further, the third object is to provide a semiconductor integrated circuit apparatus having a cooling apparatus for electronic parts that can increase heat radiation capability for the electronic parts.
Furthermore, the fourth object is to provide a semiconductor integrated circuit apparatus having a cooling apparatus for electronic parts that can sufficiently correspond to a plurality of electronic parts, whose heights are significantly different from each other, with one cooling member.
A semiconductor integrated circuit apparatus according to the present invention has electronic parts, such as semiconductor integrated circuit devices, and a cooling apparatus for the electronic parts on a board, the semiconductor integrated circuit apparatus including: a cooling member facing upper faces of the electronic parts through a thermally-conductive resin or thermally-conductive fats and fatty oils; and at least two thermally-conductive materials that are soldered on the board, and that support portions of a perimeter of the cooling member, respectively.
In a semiconductor integrated circuit apparatus having a cooling apparatus for electronic parts according to the present invention, the electronic parts and the cooling member are placed opposite to each other through a thermally-conductive resin or thermally-conductive fats and fatty oils. Therefore, unlike a conventional example, the electronic parts and the cooling member are not fixed with an adhesive. Accordingly, the cooling member can be easily detached from the electronic parts, there is no possibility of breaking the electronic parts in exchanging or inspecting them, and reclamation of the electronic parts and the cooling member becomes possible. In addition, portions of the perimeter of the above-described cooling member are supported with the above-described two thermally-conductive materials, respectively. Therefore, if the size parallel to the board of the cooling member is changed, this apparatus can flexiblly respond by changing soldered positions of the above-described thermally-conductive materials on the board.
Further, by inserting elastic members between the above-described thermally-conductive materials and the cooling member, if the heights, that is, sizes of the electronic parts in the direction perpendicular to the board are changed, the size change can be absorbed by deformation of the elastic members.
Furthermore, notches are formed in the above-described thermally-conductive materials, for moving the above-described cooling member toward a direction parallel to the board. Therefore, in case it becomes necessary to detach only the cooling member at the time of inspection or pattern revision of the board, it becomes possible to move only the cooling member through the notches for a detachment without melting the solder fixing the thermally-conductive materials to the board.
Moreover, at least one of the above-described thermally-conductive materials is soldered to a thermal via of the board. Then, since heat generated by the electronic parts is radiated not only from the cooling member but also from this thermal via through the thermally-conductive material, the heat radiation capability of the cooling apparatus can be further increased.
In addition, the above-described cooling member and a plurality of electronic parts, whose heights are different from each other, are placed opposite each other, and spacers are inserted between comparatively low electronic parts, and the cooling member. Thereby, this apparatus can sufficiently correspond to a plurality of electronic parts, different from each other, with one cooling member.
Further, the above-described cooling member and a plurality of electronic parts, having heights different from each other, are placed opposite each other. In addition, portions of the lower face of this cooling member which face the comparatively low electronic parts protrude toward those electronic parts. By means of this formation, this apparatus can sufficiently correspond to a plurality of electronic parts which have significantly different heights with one cooling member.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a semiconductor integrated circuit apparatus according to Embodiment 1 of the present invention;
FIG. 2 is a cross-sectional view showing a semiconductor integrated circuit apparatus according to Embodiment 1 of the present invention;
FIG. 3 is a perspective view showing a semiconductor integrated circuit apparatus according to Embodiment 2 of the present invention;
FIG. 4 is a perspective view showing a semiconductor integrated circuit apparatus according to Embodiment 3 of the present invention;
FIG. 5 is a cross-sectional view showing a semiconductor integrated circuit apparatus according to Embodiment 4 of the present invention;
FIG. 6 is a perspective view showing a semiconductor integrated circuit apparatus according to Embodiment 5 of the present invention;
FIG. 7 is a perspective view showing a semiconductor integrated circuit apparatus according to Embodiment 6 of the present invention;
FIG. 8 is a cross-sectional view showing a semiconductor integrated circuit apparatus according to Embodiment 7 of the present invention;
FIG. 9 is a cross-sectional view showing a semiconductor integrated circuit apparatus according to Embodiment 8 of the present invention;
FIG. 10 is a cross-sectional view showing a semiconductor integrated circuit apparatus according to Embodiment 9 of the present invention; and
FIG. 11 is a cross-sectional view showing a conventional semiconductor integrated circuit apparatus.
Hereinafter, Embodiment 1 of the present invention will be described with reference to drawings. FIG. 1 is a perspective view showing a semiconductor integrated circuit apparatus that is an embodiment of the present invention and has a cooling apparatus for electronic parts, and FIG. 2 is a cross-sectional view. In these drawings, electronic parts such as IC's and LSI's are mounted on a board 2, and a heat sink fin 3 is attached to electronic parts 1. Between the electronic parts 1 and the heat sink fin 3, a thermally-conductive resin or thermally-conductive fats and fatty oils 4 is inserted. The reference numeral 5a shows a thermally-conductive material, i.e., clamp or hold-down, pressing down and supporting edges of four edges of the heat sink fin 3, and 5b shows another thermally-conductive material, i.e., clamp, pressing down and supporting two other edges of the heat sink fin 3. These thermally-conductive clamps materials 5a and 5b are bonded to the board 2 with solder 6.
Next, in the above embodiment, the mechanism by which the thermally-conductive clamps materials 5a and 5b press the heat sink fin 3 will be described below. First, a thermally-conductive resin or thermally-conductive fats and fatty oils 4 is applied to the upper face of the electronic parts 1, and the heat sink fin 3 is attached thereon. Subsequently, the thermally-conductive clamps 5a and 5b are placed on both sides of the heat sink fin 3 so as to press all four edges of the heat sink fin 3. Then, the feet of the thermally-conductive clamps materials 5a and 5b, that is, portions contacting to the board 2, are bonded to the board 2 with solder 6.
In this embodiment, the thermally-conductive clamps materials 5a and 5b pressing the heat sink fin 3 are bonded to the board 2 with solder 6 as described above. Therefore, it is not necessary to drill holes in the board for placing the thermally-conductive clamps, and it is easy to detach the thermally-conductive clamps 5a and 5b from the board 2 by melting the solder 6. Further, these detached thermally-conductive clamps materials 5a and 5b and the heat sink fin 3 can be used again.
In addition, in this embodiment, since the heat sink fin 3 is attached to the electronic parts 1 such as IC's, LSI's, or the like through the thermally-conductive resin or thermally-conductive fats and fatty oils 4, not with an adhesive, it is easy to detach the heat sink fin 3 from the electronic parts 1. Therefore, it is not necessary to worry about damage accompanying the separation of the electronic parts 1 and the heat sink fin 3 at the time of exchanging or inspecting the electronic parts 1.
Further, in this embodiment, the thermally-conductive resin or thermally-conductive fats and fatty oils 4 is inserted between the electronic parts 1 and the heat sink fin 3. Therefore, by coated quantity of this thermally-conductive resin or thermally-conductive fats and fatty oils 4, horizontal errors among the electronic parts 1, heat sink fin 3, and thermally-conductive materials 5a and 5b depressing the heat sink fin 3 can be absorbed.
Furthermore, in this embodiment, the thermally-conductive materials 5a and 5b urge the heat sink fin 3 to contact the heat sink fin 3, and the thermally-conductive clamps 5a and 5b serve as heat sinks with the heat sink fin 3. Hence, the heat radiation capability of the entire cooling apparatus can be increased.
Moreover, in this embodiment, so as to clamp the heat sink fin 3, two thermally-conductive materials 5a and 5b depress respectively two sides facing each other and including two edges opposite to each other among four edges of the heat sink fin 3. Since these two thermally-conductive clamps materials 5a and 5b are soldered to the board 2 so as to face each other, the distance between them can be optionally adjustable in the direction opposite to each other, that is, the direction of a arrows A-B in FIG. 1. Accordingly, in this embodiment, this apparatus can accommodate a change in that the size of the heat sink fin 3 in a direction almost parallel to the board 2 (i.e., essentially the direction of the arrows A-B).
FIG. 3 shows Embodiment 2 of the present invention. In the embodiment of FIG. 3, a heat sink fin 3 is supported by four thermally-conductive materials, i.e., clamps or hold-downs, (in FIG. 3, three thermally-conductive materials shown by 15a, 15b, and 15c are illustrated). These four thermally-conductive clamps materials depress respective corners of the heat sink fin 3 and support the heat sink fin 3. Distances between these four thermally-conductive materials in the direction parallel to a board 2 can be optionally changed by changing mutual positional relations of the thermally-conductive materials. Therefore, according to this embodiment, this apparatus can accommodate a change in the size of the heat sink fin 3 in the direction parallel to the board 2 by changing mutual positional relations of the above-described four thermally-conductive clamps.
In addition, in this Embodiment 2, although four edges of the heat sink fin 3 are held down and supported by four thermally-conductive clamps, materials respectively, the present invention is not so limited. For example, four thermally-conductive materials can depress four respective sides of the heat sink fin 3. In the other aspect, four thermally-conductive materials can support only two sides facing each other of the four sides of the heat sink fin 3.
FIG. 4 shows Embodiment 3 of the present invention. In the embodiment of FIG. 4, coil springs 7 are attached to the lower faces of two thermally-conductive clamps 5a and 5b shown in FIG. 1, and depressing the heat sink fin 3, and are inserted between the heat sink fin 3 and the thermally-conductive clamps 5a and 5b. The attached positions of the coil springs 7 are lower faces of the thermally-conductive clamps 5a and 5b opposite four corners of the heat sink fin 3 or optional portions at which the coil springs can depress the heat sink fin 3.
In general, electronic parts such as IC's and LSI's have various heights, and the thicknesses of heat sink fins 3 are not constant. According to this embodiment, it is not necessary to use thermally-conductive having heights suitable to the electronic parts respectively, because the coil springs 7 attached to the thermally-conductive clamps can compensate for the height difference. In addition, because of the resilience of the coil springs 7, the coil springs can compensate for height error between the thermally-conductive clamps 5a and 5b depressing the heat sink fin 3. Further, by using thermally-conductive clamps for the coil springs 7, heat conduction from the heat sink fin 3 to the thermally-conductive can be increased, and hence the heat radiation of the entire cooling apparatus can be increased.
Furthermore, in this Embodiment 3, although coil springs 7 are attached to two thermally-conductive clamps 5a and 5b respectively, four coil springs, of course, can be attached to four thermally-conductive clamps respectively.
FIG. 5 shows Embodiment 4 of the present invention. In the embodiment of FIG. 5, S-shaped leaf springs 17 are attached to the lower faces of two thermally-conductive clamps 5a and 5b, the portions depressing the heat sink fin 3, and are inserted between the heat sink fin 3 and the thermally-conductive clamps 5a and 5b. These leaf springs are made of good thermally-conductive clamps. Therefore, according to Embodiment 4 also, the same effects as those in Embodiment 3 as described above can be obtained.
FIG. 6 shows Embodiment 5 of the present invention. In the embodiment of FIG. 6, notches 5c are formed in two edges of two thermally-conductive clamps 5a and 5b in a cooling apparatus for electronic parts shown in FIG. 1, the two edges facing each other. Owing to this formation, a heat sink fin 3 can be moved to the direction of the notches 5c (the direction of the arrow C in FIG. 6). Therefore, it becomes possible to move only the heat sink fin 3 in the direction of the arrow C independently from the electronic parts 1 and to remove the heat sink fin 3 at the time of inspecting or exchanging the heat sink fin 3.
FIG. 7 shows Embodiment 6 of the present invention. In the embodiment of FIG. 7, notches 15e in two edges of two thermally-conductive clamps 15a and 15b among four thermally-conductive materials in a cooling apparatus for electronic parts shown in FIG. 3 face each other. Owing to this formation, a heat sink fin 3 can be moved in the direction of the notches 15e (the direction of the arrow D in FIG. 7). Hence, it becomes possible to move only the heat sink fin 3 in the direction of the arrow D independently from electronic parts 1 and to remove the heat sink fin 3.
FIG. 8 shows Embodiment 7 of the present invention. In the embodiment of FIG. 8, the feet of two thermally-conductive clamps 5a and 5b in a cooling apparatus for electronic parts shown in FIG. 1 are soldered on thermal vias 2a. Owing to this formation, heat from the electronic parts 1 is radiated not only from a heat sink fin 3 but also from the thermal vias 2a through the thermally-conductive clamps 5a and 5b after passing through the heat sink fin 3. Thus, the heat radiation capacity of this embodiment is further increased.
FIG. 9 shows Embodiment 8 of the present invention. In the embodiment of FIG. 9, a heat sink fin 3 is bonded to a plurality of electronic parts 1, whose heights, i.e., thicknesses, are different from each other, through at least one spacer having good thermally-conductivity with thermally-conductive resin or thermally-conductive fats and fatty oils 4. Furthermore, two thermally-conductive materials 5a and 5b depressing the heat sink fin 3 are fixed to a board 2 with solder 6. That is, the size of the heat sink fin 3 is enlarged parallel to the board, the thermally-conductive resin or thermally-conductive fats and fatty oils 4 are applied to the upper face of the plurality of electronic parts 1 having different from each other and which are mounted on the board 2; and the heat sink fin 3 is bonded to the plurality of electronic parts 1.
In this manner, one heat sink fin 3 is commonly used to radiate heat from a plurality of electronic parts 1, it is possible to compensate for height difference of the plurality of electronic parts by adjusting the quantity of the thermally-conductive resin or thermally-conductive fats and fatty oils 4. However, if the height difference is large that, adjustment cannot compensate the difference in heights. For such cases, in this embodiment, spacers 9 are inserted between the heat sink fin 3 and the electronic parts 1 having comparatively low heights. Then, through these spacers and the thermally-conductive resin or thermally-conductive fats and fatty oils 4, the plurality of electronic parts 1 and the heat sink fin 3 are bonded. In this manner, owing to the spacers 9, it is to radiate heat from the plurality of electronic parts 1, having different heights from each other with one heat sink fin 3.
FIG. 10 shows Embodiment 9 of the present invention. In the embodiment of FIG. 10, at least one heat sink fin 3 is bonded to a plurality of electronic parts 1 having different heights from each other, through thermally-conductive resin or thermally-conductive fats and fatty oils 4. Furthermore, two thermally-conductive clamps 5a and 5b urge the heat sink fin 3 and are fixed to a board 2 with solder 6. That is, in this embodiment, portions of the lower face of the heat sink fin 3 facing the electronic parts 1 whose heights are comparatively low protrude toward the electronic parts 1. In this manner, the convex portions 3a and 3b perform almost the same functions as the spacers in Embodiment 8. Therefore, according to this Embodiment 9 also, the same effects as those in Embodiment 8 can be obtained.
In a semiconductor integrated circuit apparatus having a cooling apparatus for electronic parts that is constituted as described above, the electronic parts and the cooling member are placed opposite to each other and thermally-connected through a thermally-conductive resin or thermally-conductive fats and fatty oils. Therefore, unlike a conventional example, the electronic parts and the cooling member are not fixed with an adhesive. Accordingly, the cooling member can be easily detached from the electronic parts, there is no possibility of breaking the electronic parts when exchanging or inspecting them, and reclamation of the electronic parts and the cooling member becomes possible. In addition, portions of the perimeter of the above-described cooling member are supported with the above-described thermally-conductive clamps materials respectively. Therefore, if the size of the cooling member is changed, this apparatus can accommodate the changes by changing soldered positions of the above-described thermally-conductive clamps materials on the board.
Further, by inserting elastic members between the above-described thermally-conductive clamps and the cooling member, if the size of the electronic parts in the direction perpendicular to the board is changed, the change can be absorbed by deformation of the elastic members.
Furthermore, by forming notches in the above-described thermally-conductive clamps so as to move the above-described cooling member parallel to the board, in case it becomes necessary to detach only the cooling member at the time of inspection or pattern revision of the board, it is possible to move only the cooling member through the notches for a detachment without melting the solder fixing the thermally-conductive clamps to the board.
Moreover, by soldering the above-described thermally-conductive clamps to thermal vias of the board, heat generated by the electronic parts is radiated not only from the cooling member but also from these thermal vias through the thermally-conductive clamp. Therefore, heat radiation capacity of the cooling apparatus can be further increased.
In addition, the above-described cooling member and a plurality of electronic parts, having heights different from each other are placed opposite to each other and spacers are inserted between comparatively low electronic parts and the cooling member. Thereby, this apparatus can sufficiently accommodate a plurality of electronic parts having heights significantly different from each other with one cooling member.
Further, the above-described cooling member and a plurality of electronic parts having heights different from each other are placed opposite to each other. In addition, portions of the lower face of this cooling member protrude toward the electronic parts. Owing to this formation, this apparatus can sufficiently accommodate the plurality of electronic parts which has significant different heights with one cooling member.
Patent CitationsCited PatentFiling datePublication dateApplicantTitleJP3582688A * Title not availableJPH03208251A * Title not availableJPH04352391A * Title not availableJPH05243439A * Title not available* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS5699229 *Mar 28, 1996Dec 16, 1997Intel CorporationElectronic assemblyUS5891755 *Mar 27, 1997Apr 6, 1999International Business Machines CorporationProcess for flat plate cooling a semiconductor chip using a thermal paste retainerUS5898571 *Apr 28, 1997Apr 27, 1999Lsi Logic CorporationApparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packagesUS5917701 *Nov 5, 1997Jun 29, 1999Artesyn Technologies, Inc.Heat sink hold-down clipUS5930116 *Jun 12, 1998Jul 27, 1999Harman International Industries, IncorporatedIntegrated clamping mechanismUS5966290 *Sep 3, 1997Oct 12, 1999Internatioinal Business Machines CorporationElectronic packages and a method to improve thermal performance of electronic packagesUS5977622 *Apr 25, 1997Nov 2, 1999Lsi Logic CorporationStiffener with slots for clip-on heat sink attachmentUS6018460 *Jan 13, 1998Jan 25, 2000Lucent Technologies Inc.Flexible thermal conductor with electromagnetic interference shielding capability for electronic componentsUS6058015 *Jun 9, 1999May 2, 2000International Business Machines Corp.Electronic packages and a method to improve thermal performance of electronic packagesUS6064573 *Jul 31, 1998May 16, 2000Litton Systems, Inc.Method and apparatus for efficient conduction cooling of surface-mounted integrated circuitsUS6151221 *Jun 30, 1998Nov 21, 2000U.S. Philips CorporationPrinted circuit board having wire clamps for securing component leadsUS6223970 *May 11, 1999May 1, 2001Yang-Shiau ChenDie set for welding fins and a base plate of a heat sinkUS6280222 *Jul 25, 2000Aug 28, 2001Hon Hai Precision Ind. 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Co., Ltd.Retention module for securing heat sinkUS6526330Jan 26, 2001Feb 25, 2003Hitachi, Ltd.Vacuum processing apparatus and semiconductor manufacturing line using the sameUS6752579Sep 20, 2001Jun 22, 2004Hitachi, Ltd.Vacuum processing apparatus and semiconductor manufacturing line using the sameUS6752580Sep 20, 2001Jun 22, 2004Hitachi, Ltd.Vacuum processing apparatus and semiconductor manufacturing line using the sameUS6810746 *Mar 23, 2001Nov 2, 2004Robert Bosch GmbhSensor arrangement with pressure detector and sensor circuitUS6888722 *Nov 25, 2003May 3, 2005Intel CorporationThermal design for minimizing interface in a multi-site thermal contact conditionUS6895685Oct 21, 2003May 24, 2005Hitachi, Ltd.Vacuum processing apparatus and semiconductor manufacturing line using the sameUS6962472Sep 20, 2001Nov 8, 2005Hitachi, Ltd.Vacuum processing apparatus and semiconductor manufacturing line using the sameUS7201551Sep 20, 2001Apr 10, 2007Hitachi, Ltd.Vacuum processing apparatus and semiconductor manufacturing line using the sameUS7347656Mar 9, 2005Mar 25, 2008Hitachi, Ltd.Vacuum processing apparatus and semiconductor manufacturing line using the sameUS7349214 *Jan 13, 2006Mar 25, 2008Samsung Sdi Co., Ltd.Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power moduleUS7498673 *Nov 21, 2006Mar 3, 2009International Business Machines CorporationHeatplates for heatsink attachment for semiconductor chipsUS7595991Nov 21, 2007Sep 29, 2009Intel CorporationUsing the wave soldering process to attach motherboard chipset heat sinksUS7684190 *Dec 29, 2003Mar 23, 2010Fujitsu LimitedHeat sink with non-uniform fins and transverse protrusionUS7726385 *Feb 23, 2004Jun 1, 2010International Business Machines CorporationHeat dissipation interface for semiconductor chip structuresUS7834444Feb 26, 2009Nov 16, 2010International Business Machines CorporationHeatplates for heatsink attachment for semiconductor chipsUS7855889 *Apr 16, 2007Dec 21, 2010Foxconn Technology Co., Ltd.Resilient fastener and thermal module incorporating the sameUS8115303 *May 13, 2008Feb 14, 2012International Business Machines CorporationSemiconductor package structures having liquid coolers integrated with first level chip package modulesUS8558372 *Aug 13, 2012Oct 15, 2013Shinko Electric Industry Co., Ltd.Semiconductor deviceUS8693200Feb 7, 2012Apr 8, 2014International Business Machines CorporationSemiconductor device cooling moduleUS8772927 *Nov 7, 2011Jul 8, 2014International Business Machines CorporationSemiconductor package structures having liquid cooler integrated with first level chip package modulesUS20110155360 *Dec 29, 2009Jun 30, 2011Kechuan Kevin LiuSurface mount heat sink apparatusUS20120049341 *Nov 7, 2011Mar 1, 2012International Business Machines CorporationSemiconductor Package Structures Having Liquid Cooler Integrated with First Level Chip Package ModulesUS20130043581 *Aug 13, 2012Feb 21, 2013Shinko Electric Industries Co., Ltd.Semiconductor deviceEP1385206A2Jul 8, 2003Jan 28, 2004STMicroelectronics, Inc.Method and system for removing heat from an active area of an integrated circuit device* Cited by examinerClassifications U.S. Classification361/720, 257/726, 257/719, 361/704, 361/715, 257/E23.083, 257/727, 257/E23.086, 361/718, 257/707, 257/713International ClassificationH01L23/40, H01L23/36Cooperative ClassificationH01L23/4093, H01L23/40, H01L23/367, H01L25/105European ClassificationH01L23/40, H01L23/40S, H01L23/367Legal EventsDateCodeEventDescriptionOct 19, 2004FPExpired due to failure to pay maintenance feeEffective date: 20040820Aug 20, 2004LAPSLapse for failure to pay maintenance feesMar 10, 2004REMIMaintenance fee reminder mailedFeb 14, 2000FPAYFee paymentYear of fee payment: 4Jun 6, 1995ASAssignmentOwner name: MITSUBISHI DENKI KABUSHIKI KAISHA, JAPANFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HATAUCHI, KAZUSHI;SHIMAMOTO, HARUO;REEL/FRAME:007519/0140Effective date: 19950508RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google

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text:
The Role of HR in Reinventing Organ...
INSTRUCTIONS HOW TO PLAY : 1.- SELECT ONE CATEGORY YOU WANT. 2.- ACCORDING TO THE AMOUNT OF POINTS YOU WANT TO GET, SELECT ONE OF THE THE CATEGORIES DISPLAYED . 3.- CLICK ON THE AMOUNT YOU WANT AND ANSWER THE QUESTION ACCORDING TO THE IMAGE. 4.- IF THE QUESTION IS ANSWERED CORRECTLY TEACHER WILL CLICK ON THE RIGHT BOTTON TO SHOW THE ANSWER. IF THE QUESTION IS ANSWERED BADLY TEACHER WILL CLICK ON THE WRONG BOTTON TO SHOW THE CORRECT ANSWERBACK 2.
PROHIBITIONS OBLIGATIONS PERMISSIONS 3.
WHAT DOES THIS SIGN MEAN ? RIGHT WRONG 4.
THIS IS THE CORRECT ANSWERYOU CAN’T SMOKE HERE OR YOU AREN’T ALLOWED TO SMOKE HERE BACK 5.
THE ANSWER WAS:YOU CAN’T SMOKE HERE BACK 6.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG BACK 7.
THIS IS THE CORRECT ANSWERYOU HAVE TO FASTEN YOUR SEAT BELTS BACK 8.
THE ANSWER WAS:YOU HAVE TO FASTEN YOUR SEAT BELT BACK 9.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG BACK 10.
THIS IS THE CORRECT ANSWERYOU CAN CROSS THE STREET NOW 11.
THE ANSWER WAS:YOU CAN CROSS THE STREET NOW BACK 12.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG 13.
THIS IS THE CORRECT ANSWERYOU ARE NOT ALLOWED TO TAKE PHOTOGRAPHS OR YOU CANNOT TAKE PHOTOGRAPHS BACK 14.
THE ANSWER WAS:YOU ARE NOT ALLOWEDTO TAKE PHOTOGRAPHS OR YOU CANNOT TAKE PHOTOGRAPHS BACK 15.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG BACK 16.
THIS IS THE CORRECT ANSWERYOU HAVE TO DRIVE ON THE RIGHT SIDE BACK 17.
THE ANSWER WAS:YOU HAVE TO DRIVEON THE RIGHT SIDE BACK 18.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG BACK 19.
THIS IS THE CORRECT ANSWER YOU CAN PARK HERE BACK 20.
THE ANSWER WAS: YOU CAN PARK HERE BACK 21.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG 22.
THIS IS THE CORRECT ANSWERYOU ARE NOT ALLOWED TO USE CELLPHONES OR YOU CANNOT USE CELLPHONES 23.
THE ANSWER WAS:YOU ARE NOT ALLOWED TOUSE CELLPHONES OR YOUCANNOT USE CELLPHONES BACK 24.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG BACK 25.
THIS IS THE CORRECT ANSWER YOU HAVE TO TURN RIGHT 26.
THE ANSWER WAS:YOU HAVE TO TURN RIGHT BACK 27.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG BACK 28.
THIS IS THE CORRECT ANSWER YOU CAN GO DOWN BACK 29.
THE ANSWER WAS:YOU CAN GO DOWN BACK 30.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG BACK 31.
THIS IS THE CORRECT ANSWERYOU ARE NOT ALLOWED TO DROP LITTLER BACK 32.
THE ANSWER WAS:YOU ARE NOT ALLOWED TO DROP LITTLER BACK 33.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG BACK 34.
THIS IS THE CORRECT ANSWERYOU HAVE TO BE AWARE OF CROSS THE STREET BACK 35.
THE ANSWER WAS:YOU HAVE TO BE AWARE OF CROSS THE STREET BACK 36.
WHAT DOES THIS SIGN MEAN? RIGHT WRONG BACK 37.
THIS IS THE CORRECT ANSWERYOU CAN RECYCLE THIS ITEM BACK 38.
THE ANSWER WAS:YOU CAN RECYCLE THIS ITEM BACK Recommended

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