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Patent US5674785 - Method of producing a single piece package for semiconductor die - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inPatentsA method for packaging a bare semiconductor die using a one piece package body with a pattern of external conductors is provided. The package body includes a die mounting location and an interconnect opening that aligns with the bond pads on the die. Electrical interconnects, such as wire bonds, are...http://www.google.com/patents/US5674785?utm_source=gb-gplus-sharePatent US5674785 - Method of producing a single piece package for semiconductor dieAdvanced Patent SearchPublication numberUS5674785 APublication typeGrantApplication numberUS 08/563,191Publication dateOct 7, 1997Filing dateNov 27, 1995Priority dateNov 27, 1995Fee statusPaidAlso published asUS5739585Publication number08563191, 563191, US 5674785 A, US 5674785A, US-A-5674785, US5674785 A, US5674785AInventorsSalman Akram, Alan G. Wood, Warren M. FarnworthOriginal AssigneeMicron Technology, Inc.Export CitationBiBTeX, EndNote, RefManPatent Citations (26), Referenced by (460), Classifications (57), Legal Events (5) External Links: USPTO, USPTO Assignment, EspacenetMethod of producing a single piece package for semiconductor die
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1998Micron Technology IncTemporary semiconductor package having hard-metal, dense-array ball contacts and method of fabricationWO1999018609A1 *Feb 4, 1998Apr 15, 1999Minnesota Mining & MfgChip scale ball grid array for integrated circuit packageWO2000048444A2 *Jan 28, 2000Aug 24, 2000Wichmann Workx Ag InformationPackaging for a semiconductor chipWO2003100829A2 *May 20, 2003Dec 4, 2003ImagerlabsForming a multi segment integrated circuit with isolated substrates* Cited by examinerClassifications U.S. Classification438/15, 257/E23.004, 438/108, 438/113, 257/E23.069, 29/834, 257/E23.075, 29/832, 257/E25.023, 257/E23.008International ClassificationH01L23/14, H01L23/31, H01L25/10, H01L23/13, H01L23/498Cooperative ClassificationH01L24/45, H01L2924/00014, H01L2224/451, H01L2224/16235, H01L2224/1624, Y10T29/4913, Y10T29/49133, H01L2924/15153, H01L2924/18165, H01L2224/06135, H01L2224/06136, H01L24/48, H01L2224/32225, H01L2924/01074, H01L2924/01042, H01L2224/97, H01L2924/01027, H01L2924/01049, H01L2224/48091, H01L2924/01024, H01L2924/01047, H01L2924/01079, H01L2924/15311, H01L2224/48465, H01L2924/01082, H01L23/49883, H01L23/49816, H01L24/97, H01L2924/01029, H01L2224/4824, H01L2224/73215, H01L2924/01073, H01L23/147, H01L2924/01078, H01L2924/01087, H01L23/13, H01L23/3114, H01L2924/01013, H01L2924/01033, H01L2924/01077, H01L2924/01006, H01L2924/10253Legal EventsDateCodeEventDescriptionNov 27, 1995ASAssignmentOwner name: MICRON TECHNOLOGY, INC., IDAHOFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:AKRAM, SALMAN;WOOD, ALAN G.;FARNWORTH, WARREN M.;REEL/FRAME:007801/0802Effective date: 19951113Mar 15, 2001FPAYFee paymentYear of fee payment: 4Mar 9, 2005FPAYFee paymentYear of fee payment: 8Mar 11, 2009FPAYFee paymentYear of fee payment: 12Jan 4, 2010ASAssignmentOwner name: ROUND ROCK RESEARCH, LLC,NEW YORKFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:023786/0416Effective date: 20091223Owner name: ROUND ROCK RESEARCH, LLC, 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Best Web Sites of 2013 To Be Named By Web Marketing Association -- HARTFORD, Conn., March 18, 2013 /PRNewswire/ --
See more news releases in Internet Technology | Multimedia & Internet | Web Site | Advertising | Publishing & Information Services | Awards Best Web Sites of 2013 To Be Named By Web Marketing Association	Download image
The competition's highest honor, the 2013 WebAward "Best of Show," will be given to the one site that the judges believe represents the pinnacle of outstanding achievement in Web development. Last year's Best of Show winner was UrbanDaddy for their work on "UrbanDaddy + Herradura Mixology Battle Royale" website. The site was also recognized as Best Marketing Website.
The Web Marketing Association will also recognize the interactive agency winning the most awards in the competition with the "Top Interactive Agency" WebAward. For the third time, the Top Agency award was awarded to Biggs|Gilmore taking home 39 WebAwards.
Interactive and advertising agencies that win a 2013 WebAward will automatically be included in the Award Winning Agency Database with a free premium listing.
SOURCE The Web Marketing Association RELATED LINKS
Web Marketing Association Now Accepting Entries for 18th Annual WebAward Competition to Recognize Best Websites of 2014

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text: Bonded in Hope [Warlock Mating Chronicles 3] (Siren Publishing Menage Amour) by Suzanne Rock, Paperback | Barnes & Noble® B&N Top 100 NY Times Bestsellers

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P. 1Savage World of SlaineSavage World of SlaineRatings: (0)|Views: 69|Likes: 2Published by superc0ntraMore info:Published by: superc0ntra on Sep 30, 2010Copyright:Attribution Non-commercialAvailability:Read on Scribd mobile: iPhone, iPad and Android.download as PDF, TXT or read online from ScribdFlag for inappropriate content|Add to collectionSee moreSee lesshttps://www.scribd.com/doc/38457092/Savage-World-of-Slaine05/12/2013pdftextoriginal You're Reading a Free Preview
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