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Pregnant Russian mother is thrown from a bus after her kids made too much noise | Daily Mail Online
Shocking moment pregnant mother is thrown off a bus onto the road - because her children were making too much noise The mother began brawling with another mum in Vladivostok, Russia, after her screaming children annoyed other passengersShe is thrown off the bus by a man, and then attempts to re-enter before being pushed to the pavementThe two young mothers are now at the centre of a criminal probe By
07:57 EST, 6 January 2016
09:41 EST, 6 January 2016
A shocking video has emerged of a pregnant mother being violently thrown off a bus and pushed to the pavement in the Russian city of Vladivostok because her noisy children were annoying other passengers.The unidentified mother, wearing a black coat, was asleep on the bus while her three children terrorised other members of the public.According to reports, another mother on the bus had to wake her up to tell her to sort out her children before the two women started fighting and chaos ensued.
The pregnant mother leads her young child down the steps to get off the bus after brawling with another mother who had woken her to comment on the behaviour of her kidsAt the start of the film the mother can be seen shouting at the woman who made remarks about her children.A man called Kirill who witnessed the incident, said: 'All of a sudden the woman woke up and started shouting at the girl who commented on her children.'The mother started throwing things at her and tried to hit her.'
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A man trying to defend the woman was also hit. He stands between the two and all the while the children are wailing away.The pregnant mother is then seen leaving the bus at the next stop escorting her children down the steps.But as she is about to get off a man from behind grabs her and drops her on the pavement. In a rage she spins around and tries to re-enter the bus.As the children watch on in horror their mother is then pushed or possibly kicked to the icy pavement below. But after being picked up and thrown off she is pushed to the icy pavement below as she attempts to re-boardYet this does not deter her and again she tries to re-enter the vehicle. She latches on to the handle by the steps before the bus is able to move away.Another man then attempts to pull her back to the pavement.After the video footage stops the police turned up and took her away, according to reports.Both the pregnant mother and the woman who woke her up to discuss the behaviour of her children are under investigation by the police for disturbing the peace and violence. The video of the fight in Vladivostok, in the Far Eastern Primorsky Krai region, has now become the main piece of evidence in the police investigation against them. Despite the knockdown the mother again tries to re-enter the bus as a man from the pavement tries to pull her back off. Her children can be seen screaming below Share or comment on this article

value: This website is the website of the Daily Mail, a newspaper in the United Kingdom, and of its sister paper The Mail on Sunday. MailOnline is a division of dmg media, which is owned by Daily Mail and General Trust plc.


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 Best Price on Lavender Hotel in Ho Chi Minh City + Reviews
See all 5,072 properties in Ho Chi Minh City
47-49-51 Le Anh Xuan Street, Ben Thanh Ward, District 1, District 1, Ho Chi Minh City, Vietnam, 70000 - View on map
Located in the heart of Ho Chi Minh City, Lavender Hotel is an ideal location for leisure and business travelers. A brilliant location, guests can visit a plethora of dining venues, shopping centers, entertainment centers, and popular attractions surrounding the area. A well-furnished hotel, a stay here offers elegantly designed rooms that are suitable for both business and leisure stays, and guests can make use of facilities like broadband Internet access, cable TV, a fully appointed conference room, and a gymnasium. One of the best choice in Ho Chi Minh City, Lavender Hotel is definitely worth your stay.
20 mAsian, Malaysian, Singaporean
70 mCafe, French
Agoda Reviews (382)Booking.com Reviews (127)
All guests (382)Business travelers (106)Couples (91)Solo travelers (81)Families with young children (23)Families with teens (30)Groups (51)
EverNita from Philippines
Place is good staff ok room good food is not very good and wifi is very bad told staff but nothing was done
central , value for money”
near to eateries .. benh tanh market and others. but it's better to have a distinct name (understand hotel was called xuanloc) too many lavender hotel there ! :-)
The beddings were dirty. They dont even change it after someone check out. And its so hard to take a shower as the shower head is on the side and its too low. Their hot water depends on the solar according to them so im mostly showering with cold water. It seems they have a time for hot shower, i tried taking a shower during morning around 6am and night time around 830pm. Both doesnt have hot water. They have two elevator, but the other one doesnt go to the lobby so you have to wait for the other elevator every time. And their wifi is too slow. I cant even search using their wifi.
Should have halal breakfast options
Convinient to night market and Shop at Nguyen Trai ”
Walking distance to cho ben thanh nights market ”
Staff members very helpful!! Excellent service We will come back
2nd time stay and decided to not come back”
1st time I stayed 2 nights at this hotel, I booked Superior Double Room and I was happy with my choice. When I booked the 2nd time to stay there, I booked Deluxe Double Room and I hope that is better room but finally I was disappointed, the room is smaller than last time and the Double bed is really "double beds" - 2 small beds were bonded to become one bed. I complained with Hotel Reception in case they confused my booking and they replied that my room is Deluxe Room. So I requested to change another room with a real double bed and they changed for me. A new room also small but I have no choice. Anyways, staffs are nice and location of hotel is good, but I won't come back next time.
nice stay at this hotel ,room is good big and clean ,near from shopping and restaurants

type: global

value: This website is a Singaporean online travel agency and metasearch engine for hotels, vacation rentals, flights, and airport transfer. It is owned by Agoda Company Pte.


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P. 1Menghitung Dosis ObatMenghitung Dosis ObatRatings: (0)|Views: 1,641
|Likes: 17Published by Febryan Darma Putra IIMore info:Published by: Febryan Darma Putra II on Jun 03, 2012Copyright:Attribution Non-commercialAvailability:Read on Scribd mobile: iPhone, iPad and Android.download as DOC, PDF, TXT or read online from ScribdFlag for inappropriate content|Add to collectionSee moreSee lesshttp://www.scribd.com/doc/95759879/Menghitung-Dosis-Obat08/22/2013pdftextoriginal You're Reading a Free Preview
Activity (20)FiltersAdd to collectionReview Add NoteLikeShowingAllMost RecentReviewsAll NotesLikesYou've already reviewed this. Edit your review.Rating 0/5Post notePost reviewPost replyPost note and like1 thousand reads1 hundred readsDahlia Hanum Manggiasih liked thisYustisi Windy S liked thisIntan Fuji Lestari liked thisAlfiana Nur S liked thisDarus Mustafa liked thisPaksi Suryo Bawono liked thisMarselya Gani liked thisEos Arbie liked thisLoad more
Added to My Library Click again to add to a collection Removed from your Library Tugas Paper Uji Biokimia Pada Bakteri

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New VOCALOID-Hatsune Miku Blue Anime Cosplay Wavy Wig + 2 Clip On Ponytail | eBay
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value: This website is an American multinational e-commerce corporation based in San Jose, California, that facilitates consumer-to-consumer and business-to-consumer sales through its website.


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The staff were friendly and courteous, special... - Review of De Zeekoe Guest Farm - TripAdvisor
The staff were friendly and courteous, special... - Review of De Zeekoe Guest Farm
“Wonderful stay at De Zeekoe!”
Wonderful stay at De Zeekoe!
Ask Meerkat44 about De Zeekoe Guest Farm
670 - 676 of 986 reviews
TripAdvisor is proud to partner with Booking.com, Expedia, Hotels.com, Agoda, Orbitz, Travelocity, Hotwire, Priceline, Cheap Tickets, HotelQuickly and TripOnline SA so you can book your De Zeekoe Guest Farm reservations with confidence. We help millions of travelers each month to find the perfect hotel for both vacation and business trips, always with the best discounts and special offers.

value: This website is an American online travel company that operates a website and mobile app with user-generated content and a comparison shopping website.


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: that was president obama at the connect toy factory factory. he was warning congress they might end up on the naughty list. and he asked republicans to extend the bush era tax cuts for those making less than $250,000, but not for those making more. echoing the holiday theme with this grinch like association. >> let's not kid ourselves. i'm not trying to make this more difficult. >> jennifer: stalemate. didn't we just start talking? oh wait, he's just posturing right? to sort out the latest tough talk from the posture is michelle bernard founder of the bernard center center for women public policy. welcome back inside "the war room," michelle. >> thank you. >> jennifer: so, how serious is the stalemate that speaker boehner announceed today? >> i was listening to that sound bite a second ago, and i don't know if i want to cry or if i want to laugh. i don't know how we get to a stalemate when number one the negotiations just began. number two the president has presented congress with his proposal and we have not heard anything from the republicans with a counter parolees counter proposal ×
there was no breakthrough on that central point of tax rates. as you know, president obama insists there is no deal unless the gop agrees to raise rates on the top 2% of earners. the gop says that's a nonstarter and the two men have not moved from that basic position. now, all of this quomz comes at the same time treasury secretary geithner also said for the first time the administration would be willing to go over the fiscal cliff if the gop does not agree to raise those rates. this was treasury secretary geithner earlier today on cnbc. >> is the administration prepared to go over the fiscal cliff? >> oh, absolutely. there's no prospect to an agreement that doesn't involve those rates going up on the top 2% of the wealthiest. all americans get a tax cut on the first $250,000 of their income. so, in some sense it's a tax cut for all americans. >> reporter: bottom line, anderson, we're talking today but still at stalemate. >> yeah, i mean, it's a sign, jessica and dana, of just how lack -- how little progress there's been that a phone call is big news between these two. dana, we're hearing hints of some mo Search Results 0 to 49 of about 85 (some duplicates have been removed)First<12 >Last

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Jaipur residents turn hoteliers | jaipur | Hindustan Times
Jaipur residents turn hoteliers
Forty private residences have turned into mini-hospitality centres offering graded boarding and lodging facilities on the lines of the star hotels in the pink city, reports M Chatterjee.
jaipur Updated: Aug 19, 2007 02:53 IST
Welcome to Hotel Jaipur, the city of pink palaces which has opened its homes to the footloose itinerant.
Forty private residences have turned into mini-hospitality centres offering graded boarding and lodging facilities on the lines of the star hotels in the city, inspired by 11 homestays running in Jungpura and Defence Colony in Delhi.
Promoted by the Hotel Clarks-Amer, the Jaipur Pride, with its 51-odd properties, is the first branded, standardised homestay in the country.
The entire city is chipping in. Bureaucrats, doctors, the local royalty, professionals, activists, artists and socialites have gathered to give the tourists a feel of homely Rajasthan by making them comfortable in their guestrooms and on the dining table.
The facilities are standardised, set to guidelines laid down by the Clarks and the rooms and menu are graded into ‘A’ or the base rooms, ‘B’ or the standard rooms and ‘C’ the luxury rooms according to their prices.
“The idea is to sell India through its people and create more affordable tourism infrastructure with additional inventories in an age when hotel tariffs are so steep. Each home has been carefully profiled and evaluated to ensure maximum comfort,” says Apurv Kumar, executive director, Clarks-Amer, the man behind the project.
The rooms and baths come with personalised services like traditional breakfasts, meals with the household, cook-ins and informal chat sessions with the hosts. The retro rooms are an extension of the households, but are accessorised and maintained by the Clarks.
The end result is unique. You have the princess of Pancher, a kingdom near Ratlam in Madhya Pradesh, Smriti Singh and husband, a prince from the estate of Sarmatra near Dholpur, taking in guests in their spare bedrooms.
The Singhs whip up exotic meals for their house-guests, mostly foreigners, take them on a guided tour of their villa and let them try their hands at the large collection of old muskets, swords and hunting knives that they have at home.
Bureaucrat Manjit Singh, their neighbour in the Palm Court Colony, has let out three rooms in his duplex home to Jaipur Pride. Mahesh Tikku, a former banker, has seven Pride rooms in his sprawling home at the bustling Sawai Madho Singh Square, and simple vegetarian fare for the single and budget traveller.
“We love entertaining guests. It is our city and the visitor must feel at home,” says Smriti, also a bridal-line exporter.
First Published: Aug 19, 2007 02:32 IST

value: This website is an Indian English-language daily newspaper introduced and founded in 1924 by Sunder Singh Lyallpuri, founder-father of the Akali movement and the Shiromani Akali Dal in the Punjab Province. It played integral roles in the Indian independence movement as a nationalist daily.


text:
Patent US20020163015 - Plastic semiconductor package - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inPatentsA lead frame for a surface mount semiconductor chip package includes a die attach paddle and leads, the die attach paddle having down bond attachment sites on an upper surface of the paddle near a peripheral margin of the paddle, and having a central die attach region on an upper surface of the paddle,...http://www.google.com/patents/US20020163015?utm_source=gb-gplus-sharePatent US20020163015 - Plastic semiconductor packageAdvanced Patent SearchTry the new Google Patents, with machine-classified Google Scholar results, and Japanese and South Korean patents.Publication numberUS20020163015 A1Publication typeApplicationApplication numberUS 10/081,490Publication dateNov 7, 2002Filing dateFeb 22, 2002Priority dateFeb 27, 2001Also published asEP1378007A1, EP1378007A4, US6661083, WO2002069400A1Publication number081490, 10081490, US 2002/0163015 A1, US 2002/163015 A1, US 20020163015 A1, US 20020163015A1, US 2002163015 A1, US 2002163015A1, US-A1-20020163015, US-A1-2002163015, US2002/0163015A1, US2002/163015A1, US20020163015 A1, US20020163015A1, US2002163015 A1, US2002163015A1InventorsSang Lee, Flynn Carson, Ki Ryu, Koo LeeOriginal AssigneeChippac, Inc.Export CitationBiBTeX, EndNote, RefManReferenced by (141), Classifications (47), Legal Events (6) External Links: USPTO, USPTO Assignment, EspacenetPlastic semiconductor package
DETAILED DESCRIPTION [0043] Referring now to the Figures, FIG. 1 and FIG. 2 are diagrammatic sketches in a sectional view showing two types of conventional non-leaded package, as described above in Background. [0044] [0044]FIG. 3A is a diagrammatic sketch showing a package 320 according to an embodiment of the invention, in which the die 340 is mounted using a die attach material 350 such as an epoxy on a recessed die attach region 370 in the lead frame 330 die paddle 334, and in which down bonds 362 are attached at down bond attachment sites 337 on a nonrecessed peripheral portion 372 of the die paddle 334. Wire bonds 360 are additionally shown leading to leads 332, and enclosed by plastic encapsulation 370. The nonrecessed portion 372 of the die paddle provides a barrier for outward creep of the die attach epoxy onto the down bond attachment sites 337 during the die attachment process. [0045] [0045]FIG. 3B is a diagrammatic sketch in a plan view showing a die paddle 334 as in FIG. 3A, prior to attachment of the die; and FIG. 3C is a diagrammatic sketch in a sectional view at C-C in FIG. 3B thru a die paddle 334 as in FIG. 3A. The recess 371 in the die paddle 334 can be formed by any of a variety of techniques, including particularly a chemical etch. The recess 371 is made sufficiently deep that the nonrecessed portions 372 can provide a barrier to flow of the die attachment material up onto the surface on the nonrecessed portions 372 where the down bond attachment sites are located 337. In addition to providing a barrier for epoxy bleed out, the recess entails a thinning of the die paddle beneath the die, and thereby contributes to extent to which the overall package thickness can be reduced using a die of a given thickness. [0046] [0046]FIG. 4A is a diagrammatic sketch in a sectional view showing a package 420 according to another embodiment of the invention, in which a slot or groove 474 is formed near the periphery 472 of the die paddle 434 between the die attach region 471 and the attachment sites 437 for the down bonds 462. The die attach region of the die paddle in this embodiment is not recessed; here the groove 474 serves as a moat to collect any die attach epoxy 450 that may bleed away from the die attach region during the die attach process, and thereby to prevent the die attach epoxy from contaminating down bond attachment sites 437 on the peripheral surface of the margin 472 of the die paddle. In this respect, at least, the groove 474, situated between the down bond attachment sites and the die attach region isolates the down bond attachment sites from the die attach region. [0047] [0047]FIG. 4B is a diagrammatic sketch in a plan view showing a die paddle 434 as in FIG. 4A, prior to attachment of the die; and FIG. 4C is a diagrammatic sketch in a sectional view at C-C in FIG. 4B thru a die paddle 434 as in FIG. 4A. Groove 474 near the die paddle periphery 472 can be formed by any of a variety of techniques, including particularly a chemical etch. The groove 474 can be formed using any of variety of techniques; a chemical etch process may be particularly useful. The groove 474 is shown by way of example in FIG. 4C as having a generally U-shaped cross section, which can be readily formed by chemical etch; however, any of a variety of other cross sectional shapes (triangular, rectangular, for example) can be entirely acceptable according to the invention, although some shapes may be more difficult to form than others. No particular dimensions are required for groove 474; the groove need only be sufficiently wide and define a sufficient volume so that it can effectively collect and contain any creeping die attach material that might otherwise reach and contaminate the down bond attachment regions 437. In some configurations, by way of example, the grooves may have a width in the range about 0.15 to 0.25 mm and a depth about half the thickness of the lead frame. The groove 474 may, in fact, take the form of a slot passing entirely through the die paddle, as described for example with reference to FIG. 10 below. However, because a very deep groove or a slot passing entirely through the die paddle can contribute to comprising the mechanical integrity of the die paddle, it may be preferable in some embodiments, depending upon the kinds and degrees of stresses that are likely to be imposed upon the package, to limit the dimensions of the groove to approximately a minimum that would be required to contain any escaping die epoxy. [0048] [0048]FIG. 5A is a diagrammatic sketch in a plan view showing a die paddle 534 prior to die attachment according to another embodiment of the invention; and 5B and 5C are sectional views thru the paddle 534 as indicated at, respectively, B-B and C-C in FIG. 5A. The die paddle 534 has marginal recesses 575 formed at intervals in and generally perpendicularly to the die paddle margin 572 to reduce stresses and to provide interlock of the die paddle and the encapsulation material. In some configurations the recesses 575 are arranged to alternate with nonrecessed surface portions, which may serve as down bond sites, for example 537. The marginal recesses are filled with encapsulation material during the encapsulation process, so that the recesses and nonrecessed portions provide for a robust interlock of the die paddle and the encapsulation. This can reduce cracking and delamination near the down bond attachment sites, and can thereby improve the integrity of the package. Additionally, while the recesses may be formed with other shapes than that shown in FIGS. 5A and 5B, whatever the shape the edges of the recesses are preferably not acute, to reduce the likelihood that cracking or delamination may be initiated at the edges. [0049] In the configuration of FIGS. 5A, 5B and 5C, the recesses are not situated between the die attach region 571 and the down bond sites 537, and so they do not work as an isolating moat as do, for example, the grooves in the embodiments of FIGS. 4A-4C. Nevertheless, they can provide traps for creeping die attach material, helping to prevent contamination of the down bond attachment sites during the die attach process. This trapping function can be made more effective by forming the marginal recesses (576) so that they extend further inward toward the die attach region 571, as illustrated for example in FIGS. 5D, 5E and 5F. The inwardmost extent of the recessed portions 576 can be formed very close to the edge of the die attach region, to more effectively trap creeping die attach material. Thus although, as in the configuration of FIGS. 5A, 5B and 5C, the recesses in this configuration are not situated between the die attach region and the down bond attach sites, and so they cannot isolate the down bond attach sites, they can effectively protect the sites 537 from contamination by creeping die attach material, because the sites 537 are located on the marginal ends of nonrecessed surface peninsulas between the recesses. [0050] Protection of the down bond attachment sites by locating the sites away from the die attach region on the marginal ends of peninsulas between marginal recesses can alternatively (or additionally) be provided by a configuration as shown in FIGS. 6A and 6B. FIG. 6A is a diagrammatic sketch in a plan view showing a die paddle 634 according to another embodiment of the invention, and FIG. 6B is a diagrammatic sketch in a sectional view thru a die paddle at B-B in FIG. 6A. Here marginal recesses, for example 677, are formed alternating with peninsulas in the surface of the die paddle near the margin, and the down bond attachment sites 637 are located on cantilevers 678 that extend beyond the bulk margin 677 of the paddle 634. [0051] [0051]FIG. 7A is a diagrammatic composite sketch in a plan view showing a die paddle 734 prior to die attachment, having examples of various alternative configurations for grooves 780, 781, 782, 783 each serving to effectively isolate down bond sites 737 according to the invention, as described generally above. FIGS. 7B and 7C are sketches in sectional view thru portions of the die paddle at B-B and at C-C, respectively, in FIG. 7A. Here, as discussed with reference to FIG. 4A, 4B, the groove may have any of a variety of cross-sectional shapes, and may have dimensions selected to effectively collect any creeping die attach material that may approach the down bond attachment sites during the die attachment process. [0052] FIGS. 8-10 illustrate various further embodiments of assembled packages according to the invention, in which various sculptural features are provided on the lead frame (on the die paddle or the leads or on both leads and paddle) to trap die attach materials and thereby prevent contamination of down bond attachment sites; or to provide improved interlock between lead frame elements and the encapsulation material and thereby improve package integrity; or both for protection and improvement of package integrity. [0053] [0053]FIG. 8 is a diagrammatic sketch in a sectional view thru a package 820 according to another embodiment of the invention, having a groove 874 running generally parallel to the margin 872 of the die paddle 834, between the die attachment region 871 and the down bond attachment sites 837, and additionally having recesses 884 in the upper surface of the leads 832. The groove 874 in this embodiment serves to isolate the down bond sites 837 from the die attach region 871 and additionally to provide improved interlock between the die paddle and the encapsulation 870. [0054] [0054]FIG. 9 is a diagrammatic sketch in a sectional view thru a package 920 according to another embodiment of the invention, having a recessed die attach region 971 on the paddle 934 generally as in FIG. 3A, and additionally having a groove 986 in the upper surface of the lead portion 932 of the lead frame. The groove 986 in this embodiment serves to provide improved interlock between the leads and the encapsulation 970. [0055] [0055]FIG. 10 is a diagrammatic sketch in a sectional view thru a package 1020 according to another embodiment of the invention having a slot 1088 through the die paddle 1034 running generally parallel to the die paddle edge 1072, between the die attachment region 1071 and the down bonds attachment sites 1037. The slot serves both as a moat for trapping die attach epoxy during the die attach process, and to provide improved interlock between the die paddle 1034 and the encapsulation 1070. [0056] [0056]FIG. 11 is a diagrammatic sketch in a sectional view thru a stacked die package 1120 according to an embodiment of the invention. In this configuration a first die 1140 is attached in a recessed die attach region 1171, generally as shown and described for die 340 in FIG. 3A, and a second die 1190 is stacked upon the first die 1140. Both of the dies and their respective wire bonds to the leads and down bonds to the paddle margin are enclosed in encapsulation 1170. [0057] [0057]FIG. 12 is a diagrammatic sketch in a sectional view thru a stacked die package 1220 according to another embodiment of the invention. A first die 1240 is mounted generally as shown and described for die 340 in FIG. 3A, and a second die 1290 is placed upon a silicon spacer 1292 imposed between the first die and the second die. [0058] As will be appreciated, a stacked die arrangement may be constructed by stacking a second die on a first die attached to a die attachment surface on any of the various die paddle configurations according to the invention, or on a conventional paddle. [0059] Other embodiments are within the following claims. Referenced byCiting PatentFiling datePublication dateApplicantTitleUS6818973 *Sep 9, 2002Nov 16, 2004Amkor Technology, Inc.Exposed lead QFP package fabricated through the use of a partial saw processUS6838751 *Mar 6, 2002Jan 4, 2005Freescale Semiconductor Inc.Multi-row leadframeUS7638860Apr 12, 2006Dec 29, 2009Rohm Co., Ltd.Semiconductor device and lead frameUS7687893Dec 27, 2006Mar 30, 2010Amkor Technology, Inc.Semiconductor package having leadframe with exposed anchor padsUS7687899Aug 7, 2007Mar 30, 2010Amkor Technology, Inc.Dual laminate package structure with embedded elementsUS7692286Aug 5, 2008Apr 6, 2010Amkor Technology, Inc.Two-sided fan-out wafer escape packageUS7714431Nov 28, 2006May 11, 2010Amkor Technology, Inc.Electronic component package comprising fan-out and fan-in tracesUS7723210Jun 6, 2007May 25, 2010Amkor Technology, Inc.Direct-write wafer level chip scale packageUS7723852Jan 21, 2008May 25, 2010Amkor Technology, Inc.Stacked semiconductor package and method of making sameUS7732899Feb 4, 2009Jun 8, 2010Amkor Technology, Inc.Etch singulated semiconductor packageUS7768135Apr 17, 2008Aug 3, 2010Amkor Technology, Inc.Semiconductor package with fast power-up cycle and method of making sameUS7777351Oct 1, 2007Aug 17, 2010Amkor Technology, Inc.Thin stacked interposer packageUS7808084May 6, 2008Oct 5, 2010Amkor Technology, Inc.Semiconductor package with half-etched locking featuresUS7812431 *Jun 5, 2008Oct 12, 2010Advanced Semiconductor Engineering, Inc.Leadframe with die pad and leads corresponding theretoUS7812432 *Nov 11, 2008Oct 12, 2010Chipmos Technologies Inc.Chip package with a dam structure on a die padUS7829379Oct 17, 2007Nov 9, 2010Analog Devices, Inc.Wafer level stacked die packagingUS7829990Jan 18, 2007Nov 9, 2010Amkor Technology, Inc.Stackable semiconductor package including laminate interposerUS7834431 *Apr 8, 2008Nov 16, 2010Freescale Semiconductor, Inc.Leadframe for packaged electronic device with enhanced mold locking capabilityUS7847386Nov 5, 2007Dec 7, 2010Amkor Technology, Inc.Reduced size stacked semiconductor package and method of making the sameUS7847392Sep 30, 2008Dec 7, 2010Amkor Technology, Inc.Semiconductor device including leadframe with increased I/OUS7872343Feb 3, 2010Jan 18, 2011Amkor Technology, Inc.Dual laminate package structure with embedded elementsUS7875963Nov 21, 2008Jan 25, 2011Amkor Technology, Inc.Semiconductor device including leadframe having power bars and increased I/OUS7902649 *Nov 2, 2007Mar 8, 2011Chipmos Technologies Inc.Leadframe for leadless package, structure and manufacturing method using the sameUS7902660May 24, 2006Mar 8, 2011Amkor Technology, Inc.Substrate for semiconductor device and manufacturing method thereofUS7906855Apr 12, 2010Mar 15, 2011Amkor Technology, Inc.Stacked semiconductor package and method of making sameUS7919848 *Aug 3, 2007Apr 5, 2011Stats Chippac Ltd.Integrated circuit package system with multiple devicesUS7928542Mar 6, 2009Apr 19, 2011Amkor Technology, Inc.Lead 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2013奥斯兰姆奥普托半导体有限责任公司Lead frame for optoelectronic components and method for producing optoelectronic componentsCN103489832A *Jun 21, 2012Jan 1, 2014矽品精密工业股份有限公司Package substrate plate structure for package, package substrate, semiconductor package and fabrication method thereofWO2006014418A2 *Jul 6, 2005Feb 9, 2006Texas Instruments IncorporatedEncapsulated semiconductor device with reliable down bondsWO2012119813A1 *Jan 31, 2012Sep 13, 2012Osram Opto Semiconductors GmbhLead frame for optoelectronic components and method for producing optoelectronic componentsWO2015197386A1 *Jun 15, 2015Dec 30, 2015Heraeus Deutschland GmbhStrip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate* Cited by examinerClassifications U.S. Classification257/200, 257/E23.046, 257/E23.124, 257/E23.037, 257/E23.052International ClassificationH01L23/495, H01L23/50, H01L23/31Cooperative ClassificationH01L2924/181, H01L24/73, H01L24/48, H01L2224/32257, H01L2224/48257, H01L2924/14, H01L2224/48091, H01L2224/27013, H01L2224/45144, H01L2224/48465, H01L23/49575, H01L2924/014, H01L2924/01033, H01L2924/01079, H01L2224/49, H01L2924/01006, H01L24/32, H01L2224/73265, H01L23/49548, H01L2224/32245, H01L2924/01014, H01L2924/01013, H01L24/49, H01L2924/01082, H01L24/45, H01L2224/48247, H01L23/3107, H01L2924/01004, H01L2224/83051, H01L2924/01005, H01L23/49503, H01L2224/32145, H01L2224/83385European ClassificationH01L24/49, H01L24/32, H01L23/495G4, H01L23/495A, H01L23/31H, H01L23/495LLegal EventsDateCodeEventDescriptionJun 11, 2002ASAssignmentOwner name: CHIPPAC, INC., CALIFORNIAFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, SANG D.;CARSON, FLYNN;RYU, KI T.;AND OTHERS;REEL/FRAME:012982/0732;SIGNING DATES FROM 20020409 TO 20020521Jun 11, 2007FPAYFee paymentYear of fee payment: 4Jun 9, 2011FPAYFee paymentYear of fee payment: 8Jun 9, 2015FPAYFee paymentYear of fee payment: 12Aug 6, 2015ASAssignmentOwner name: STATS CHIPPAC, INC., DELAWAREFree format text: MERGER AND CHANGE OF NAME;ASSIGNORS:CHIPPAC, INC.;STATS CHIPPAC, INC.;REEL/FRAME:036286/0612Effective date: 20050120Owner name: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITYFree format text: SECURITY INTEREST;ASSIGNORS:STATS CHIPPAC, INC.;STATS CHIPPAC LTD.;REEL/FRAME:036288/0748Effective date: 20150806Apr 7, 2016ASAssignmentOwner name: STATS CHIPPAC PTE. LTE, SINGAPOREFree format text: CHANGE OF NAME;ASSIGNOR:STATS CHIPPAC LTD;REEL/FRAME:038378/0200Effective date: 20160329RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services

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Motiva Norco Said to Conduct Repairs on Fluid Catalytic Cracker - Bloomberg Business Bloomberg the Company & Its Products Bloomberg Anywhere Remote Login Bloomberg Terminal Demo Request Bloomberg Connecting decision makers to a dynamic network of information, people and ideas, Bloomberg quickly and accurately delivers business and financial information, news and insight around the world. Company Careers Diversity & Inclusion Philanthropy & Engagement Sustainability Technology History & Facts Financial Products Bloomberg Terminal Bloomberg Tradebook Bloomberg Briefs Bloomberg Indices Bloomberg SEF Bloomberg Institute Enterprise Products Enterprise Solutions Trading Solutions Bloomberg Vault Bloomberg PolarLake Media Bloomberg Business Bloomberg Politics Bloomberg View Bloomberg Gadfly Bloomberg Television Bloomberg Radio Bloomberg Mobile Apps News Bureaus Customer Support Americas +1 212 318 2000 Europe, Middle East, & Africa +44 20 7330 7500 Asia Pacific +65 6212 1000 Communications Press Announcements Press Contacts Industry Products Bloomberg Government Bloomberg Law/BNA Bloomberg Big Law Bloomberg New Energy Finance Media Services Advertising Bloomberg Content Service Bloomberg Live Conferences Follow Us Facebook Twitter LinkedIn Instagram Bloomberg Customers Bloomberg Anywhere Remote Login Download Software Service Center Menu News Markets Insights Video Now Reading: Search Americas Europe Asia Watch Listen Latest World Industries Science+Energy Technology Design Culture Graphics Pursuits View Gadfly U.S. Politics Businessweek Stocks Currencies Commodities Rates+Bonds Magazine Benchmark Watchlist Economic Calendar Latest Game Plan Business Schools Small Business Personal Finance Profiles Sponsored: Board Directors' Forum Watch Now Video Schedule + Shows Audio Events Motiva Norco Said to Conduct Repairs on Fluid Catalytic Cracker Barbara Powell October 7, 2013 — 10:40 AM EDT Share on FacebookShare on TwitterShare on WhatsApp Share on LinkedInShare on RedditShare on Google+E-mailShare on TwitterShare on WhatsApp Share on FacebookShare on TwitterShare on WhatsApp Share on LinkedInShare on RedditShare on Google+E-mailShare on TwitterShare on WhatsApp Motiva Enterprises LLC’s Norco, Louisiana, refinery is conducting planned repairs on a fluid catalytic cracker, a person familiar with operations said.
The unit was shut in the third week of September for approximately 50 days of scheduled maintenance, said the person, who asked not to be identified because the information isn’t public.
A community notice on Sept. 19 from St. Charles Parish, where the refinery is located, said that Motiva would begin planned maintenance on several units the week of Sept. 28. The 250,000-barrel-a-day Norco refinery is about 13 miles (21 kilometers) west of New Orleans.
Destin Singleton, a spokeswoman for Shell in Houston, did not immediately respond to an e-mail seeking comment.
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