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Patent US20050158911 - Process for producing circuit board having built-in electronic part - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign in<nobr>Advanced Patent Search</nobr>PatentsThe present invention provides a process for producing a circuit board having built-in electronic parts, which comprises the steps of: disposing two wiring circuit boards each having an electronic part mounted thereon so that the electronic-part-mounting sides of the respective circuit boards face each...http://www.google.com/patents/US20050158911?utm_source=gb-gplus-sharePatent US20050158911 - Process for producing circuit board having built-in electronic partAdvanced Patent SearchPublication numberUS20050158911 A1Publication typeApplicationApplication numberUS 11/037,018Publication dateJul 21, 2005Filing dateJan 19, 2005Priority dateJan 19, 2004Also published asEP1555862A2, EP1555862A3Publication number037018, 11037018, US 2005/0158911 A1, US 2005/158911 A1, US 20050158911 A1, US 20050158911A1, US 2005158911 A1, US 2005158911A1, US-A1-20050158911, US-A1-2005158911, US2005/0158911A1, US2005/158911A1, US20050158911 A1, US20050158911A1, US2005158911 A1, US2005158911A1InventorsKazuki Uwada, Yuji HottaOriginal AssigneeNitto Denko CorporationExport CitationBiBTeX, EndNote, RefManReferenced by (4), Classifications (25), Legal Events (1) External Links: USPTO, USPTO Assignment, EspacenetProcess for producing circuit board having built-in electronic partUS 20050158911 A1Abstract The present invention provides a process for producing a circuit board having built-in electronic parts, which comprises the steps of: disposing two wiring circuit boards each having an electronic part mounted thereon so that the electronic-part-mounting sides of the respective circuit boards face each other; disposing a resin layer between the circuit boards; and press-bonding the resin layer to the circuit boards. Images(3) Claims(4)
1. A process for producing a circuit board having built-in electronic parts, which comprises the steps of: disposing two wiring circuit boards each having an electronic part mounted thereon so that the electronic-part-mounting sides of the respective circuit boards face each other; disposing a resin layer between the circuit boards; and press-bonding the resin layer to the circuit boards. 2. A process for producing a circuit board having built-in electronic parts, which comprises the steps of: folding a wiring circuit board having two or more electronic parts mounted thereon; disposing a resin layer in the resultant space between sections of the folded circuit board where electronic-part-mounting sides have come to face each other; and press-bonding the resin layer to the folded sections of the circuit board. 3. The process for producing a circuit board having built-in electronic parts of claim 1 or 2, wherein the resin layer comprises a polycarbodiimide. 4. The process for producing a circuit board having built-in electronic parts of claim 3, wherein the polycarbodiimide comprises; n1 pieces of structural units represented by general formula I: wherein a, b and c each are an integer of 0 to 200, provided that at least one of a, b and c is not 0, and X represents a single bond or an alkylene group having 1 to 5 carbon atoms; n2 pieces of structural units represented by general formula II: wherein d, e and f each are an integer of 0 to 200, provided that at least one of d, e and f is not 0, and X represents a single bond or an alkylene group having 1 to 5 carbon atoms; and n3 pieces of structural units represented by general formula III: wherein R represents a bivalent organic group having 4 to 40 carbon atoms, and having terminal structural units obtained by reacting each end of the molecules with a monoisocyanate, wherein n1+n2 is an integer of 2 or larger, n3 is an integer of 1 or larger, n1+n2+n3 is 3 to 1,500, and n1+n2))/(n1+n2+n3) is from {fraction (1/100)} to ⅓. Description
FIELD OF THE INVENTION The present invention relates to a process for producing a circuit board having built-in electronic parts. BACKGROUND OF THE INVENTION With the recent trend toward size and weight reduction and performance advancement in electronic appliances, there is a growing desire for the higher-density mounting of electronic parts including semiconductor elements. In particular, the trend toward size and weight reduction in appliances represented by portable appliances or the like is thought to proceed further in the future. There is hence a desire for the development of a technique for mounting electronic parts in three-dimensional directions. A circuit board having electronic parts built in an interlayer dielectric layer has been proposed as a technique to meet that desire (see, for example, patent document 1). This circuit board having built-in electronic parts is a multilayer wiring board which has an insulating layer formed from a material comprising a thermosetting resin and constituted by disposing electronic parts in spaces formed in the insulating layer. Patent Document 1: JP 11-312868 A However, the step for forming spaces beforehand in those areas of an insulating layer on which parts are to be mounted is troublesome and results in an increased production cost. SUMMARY OF THE INVENTION Accordingly, an object of the invention is to provide a process by which a circuit board having built-in electronic parts can be easily produced. Other objects and effects of the invention will become apparent from the following description. Namely, the invention relates to: (1) A process for producing a circuit board having built-in electronic parts, which comprises the steps of: disposing two wiring circuit boards each having an electronic part mounted thereon so that the electronic-part-mounting sides of the respective circuit boards face each other; disposing a resin layer between the circuit boards; and press-bonding the resin layer to the circuit boards; (2) A process for producing a circuit board having built-in electronic parts, which comprises the step of: folding a wiring circuit board having two or more electronic parts mounted thereon; and disposing a resin layer in the resultant space between sections of the folded circuit board where electronic-part-mounting sides have come to face each other; and press-bonding the resin layer to the folded sections of the circuit board; (3) The process for producing a circuit board having built-in electronic parts as described in item (1) or (2) above, wherein the resin layer comprises a polycarbodiimide; and (4) The process for producing a circuit board having built-in electronic parts as described in item (3) above, wherein the polycarbodiimide comprises: n1 pieces of structural units represented by general formula I: wherein a, b and c each are an integer of 0 to 200, provided that at least one of a, b and c is not 0, and X represents a single bond or an alkylene group having 1 to 5 carbon atoms; n2 pieces of structural units represented by general formula II: wherein d, e and f each are an integer of 0 to 200, provided that at least one of d, e and f is not 0, and X represents a single bond or an alkylene group having 1 to 5 carbon atoms; and n3 pieces of structural units represented by general formula III: wherein R represents a bivalent organic group having 4 to 40 carbon atoms, and having terminal structural units obtained by reacting each end of the molecules with a monoisocyanate; wherein n1+n2 is an integer of 2 or larger, n3 is an integer of 1 or larger, n1+n2+n3 is 3 to 1,500, and (n1+n2)/(n1+n2+n3) is from {fraction (1/100)} to ⅓. According to the invention, a circuit board having built-in electronic parts can be easily produced.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of an example of a circuit board having built-in electronic parts produced by one embodiment of the process of the invention. FIG. 2 is a sectional view of an example of a circuit board having built-in electronic parts produced by another embodiment of the process of the invention. FIG. 3 is a sectional view of an example of a circuit board having built-in electronic parts produced by a still other embodiment of the process of the invention. The reference numerals used in the drawings denotes the followings, respectively. 1: Electronic part 2: Wiring circuit board 3: Resin layer 4: Insulating layer 5: Conductor layer 6: Conduction path 7: Circuit board having built-in electronic parts DETAILED DESCRIPTION OF THE INVENTION The process for producing a circuit board having built-in electron parts in one embodiment of the invention comprises the steps of disposing two wiring circuit boards each having an electronic part mounted thereon so that the electronic-part-mounting sides of the respective circuit boards face each other, disposing a resin layer between the circuit boards, and press-bonding the resin layer to the circuit boards. An example of the circuit board having built-in electronic parts which is produced by the process in this embodiment is shown in FIG. 1. This circuit board has a structure comprising two wiring circuit boards 2 each having an electronic part 1 mounted thereon and a resin layer 3 which is disposed between the circuit boards 2 and in which the electronic parts are embedded. The embedding of electronic parts in a resin layer disposed between two wiring circuit boards can eliminate the conventional step of forming spaces for electronic part mounting in an insulating layer of a wiring circuit board Simplification of steps can hence be attained. The wiring circuit boards 2 to be used in this embodiment are not limited as long as they comprise an insulating layer 4 and a conductor layer 5 superposed thereon directly or through an adhesive, and known circuit boards may be used. The insulating layer provided in the wiring circuit boards is not particularly limited. However, the insulating layer preferably is a film having a glass transition temperature higher than the curing temperature of the thermosetting resin to be used in the resin layer, which will be described later. Examples thereof include films of polyimide resins, aramid resins, fluororesins, and poly(ethylene terephthalate) resins. The conductor layer in the wiring circuit boards is not particularly limited as long as it is one in ordinary use as a conductor layer. However, a copper foil is preferred from the standpoints of ease of processing and cost reduction. Usually, the conductor layer has been formed so as to have a given wiring pattern including a signal wiring and an electrode, and may have been formed on one or each side of the insulating layer. The formation of the conductor layer so as to have a wiring pattern can be conducted by a known technique such as the subtractive method or additive method. Examples of the electronic part 1 include semiconductor elements, resistive elements, and capacitor elements. Such an electronic part can be mounted on the wiring circuit boards by using a known technique, such as flip chip bonding, to bond the electronic part onto the conductor layer formed by the method shown above. In the case where the wiring circuit board has a conductor layer on each side thereof, an electronic part may be mounted on each side of the wiring circuit board. The resin to be used for the resin layer 3 is preferably a thermosetting resin, more preferably a polycarbodiimide, from the standpoint of securing heat resistance. Especially preferred of polycarbodiimides, from the standpoint of high conformability to the recesses and protrusions of electronic parts, is a polycarbodiimide which comprises: n1 pieces of structural units represented by general formula I: wherein a, b and c each are an integer of 0 to 200, provided that at least one of a, b and c is not 0, and X represents a single bond or an alkylene group having 1 to 5 carbon atoms; n2 pieces of structural units represented by general formula II: wherein d, e and f each are an integer of 0 to 200, provided that at least one of d, e and f is not 0, and X represents a single bond or an alkylene group having 1 to 5 carbon atoms; n3 pieces of structural units represented by general formula III: wherein R represents a bivalent organic group having 4 to 40 carbon atoms, and having terminal structural units obtained by reacting each end of the molecules with a monoisocyanate, wherein n1+n2 is an integer of 2 or larger, n3 is an integer of 1 or larger, n1+n2+n3 is 3 to 1,500, and (n1+n2)/(n1+n2+n3) is from {fraction (1/100)} to ⅓. Symbols a, b, and c each are preferably 0 to 150, more preferably 0 to 100, from the standpoint of realizing high conformability to the recesses and protrusions of electronic parts. Symbols d, e, and f each are preferably 0 to 150, more preferably 0 to 100, from the standpoint of realizing high conformability to the recesses and protrusions of electronic parts. X preferably represents a single bond or an alkylene group having 1 to 5 carbon atoms. Examples of the alkylene group having 1 to 5 carbon atoms include ethylene and propylene. R preferably represents a divalent organic group having 4 to 40 carbon atoms, such as, e.g., an alkylene or arylene group having 4 to 40 carbon atoms. Examples of the alkylene group having 4 to 40 carbon atoms include hexamethylene, a 4,4′-dicyclohexylmethane diisocyanate residue group, and an isophorone diisocyanate residue group. Examples of the arylene group having 4 to 40 carbon atoms include tolylene and a 4,4′-diphenylmethane diisocyanate residue group. From the standpoint of realizing high conformability to the recesses and protrusions of electronic parts, n1, n2, and n3 are as follows. The value of n1+n2 is preferably an integer of 2 to 1,000, more preferably an integer of 2 to 100, especially preferably an integer of 2 to 10. Symbol n3 is preferably an integer of 1 to 500, more preferably an integer of 1 to 300, especially preferably an integer of 70 to 100. The value of n1+n2+n3 is preferably an integer of 70 to 100. The value of (n1+n2)/(n1+n2+n3) is preferably from {fraction (1/15)} to ⅓. Examples of the terminal structural unit obtained by reacting a monoisocyanate include substituted or unsubstituted aryl or alkyl groups. Examples of the substituted aryl groups include tolyl, isopropylphenyl, methoxyphenyl, and chlorophenyl. Examples of the unsubstituted aryl groups include phenyl and naphthyl. Examples of the substituted alkyl groups include 2,2,4-trimethylhexyl. Examples of the unsubstituted alkyl groups include alkyl groups having 1 to 10 carbon atoms, such as n-butyl, n-hexyl, and n-octyl. In the invention, the polycarbodiimide is obtained by subjecting one or more bifunctional liquid rubbers represented by general formula I′: (wherein a, b and c each are an integer of 0 to 200, provided that at least one of a, b and c is not 0, and X represents a single bond or an alkylene group having 1 to 5 carbon atoms) and/or formula II′: (wherein d, e and f each are an integer of 0 to 200, provided that at least one of d, e and f is not 0, and X represents a single bond or an alkylene group having 1 to 5 carbon atoms) (these rubbers may be referred to simply as �bifunctional liquid rubbers� in this specification) to a condensation reaction with one or more diisocyanates and then blocking the terminals of the resultant condensate with a monoisocyanate. Examples of the bifunctional liquid rubber represented by general formula I′ include liquid polybutadiene (e.g., Hycar CTB (trademark), manufactured by Ube Industries, Ltd., and C-1000, manufactured by Nippon Soda Co., Ltd.) and liquid polybutadiene/acrylonitrile copolymers (e.g., Hycar CTBN (trademark), manufactured by Ube Industries, Ltd.) . Examples of the bifunctional liquid rubber represented by general formula II′ include liquid hydrogenated polybutadiene (e.g., CI-1000, manufactured by Nippon Soda Co., Ltd.). Each bifunctional liquid rubber may be used singly or two or more bifunctional liquid rubbers may be used in combination. Examples of the diisocyanates to be used as a starting material include aromatic diisocyanates and aliphatic diisocyanates. These may be used singly or in a combination of two or more thereof. Examples of the aromatic diisocyanates include compounds represented by general formula IV; (wherein X1 represents an alkyl or alkoxyl group having 1 to 5 carbon atoms or a halogen atom), such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 6-methoxy-2,4-phenylene diisocyanate, and 5-bromo-2,4-tolylene diisocyanate, Examples of the aromatic diisocyanates further include compounds represented by general formula V: (wherein X2 represents a single bond, an alkylene group having 1 to 5 carbon atoms, an oxygen atom, a sulfur atom, or S (═O); and X3 and X4 each represent an alkyl or alkoxyl group having 1 to 5 carbon atoms or a halogen atom), such as 4,4′-diphenylmethane diisocyanate, 3,3′,5,5′-tetraethyl-4,4′-diphenylmethane diisocyanate, 4,4′-diphenylisopropylidene diisocyanate, 4,4′-diphenyl ether diisocyanate, 4,4′-diphenyl sulfide diisocyanate, 4,4′-diphenyl sulfoxide diisocyanate, 3,3′,5,5′-tetramethyl-4,4′-biphenyl diisocyanate, 3,3′-dimethoxy-4,4′-biphenyl diisocyanate, and 3,3′-dibromo-4,4′-biphenyl diisocyanate. Examples of the aliphatic diisocyanates include compounds represented by general formula VI; (wherein X5 and X6 each represent a single bond or an alkylene group having 1 to 5 carbon atoms and X7 represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms), such as 4,4′-dicyclohexylmethane diisocyanate, norbornane diisocyanate, 4,4′-cyclohexane diisocyanate, isophorone diisocyanate, methylcyclohexane 2,4-diisocyanate, and 2,4-bis(isocyanatomethyl)cyclohexane. Examples of the aliphatic diisocyanates further include compounds represented by general formula VII: OCN�X8�NCO (VII) (wherein X8 represents an alkylene group having 1 to 18 carbon atoms), such as hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, octamethylene diisocyanate, and dodecamethylene diisocyanate. Examples of the aliphatic diisocyanates furthermore include compounds represented by general formula VIII: (wherein X9 and X10 each represent a single bond or an alkylene group having 1 to 5 carbon atoms), such as xylylene diisocyanate, α,α,α′,α′-tetramethylxylylene diisocyanate, and 4-isocyanatomethylphenyl isocyanate. The bifunctional liquid rubbers respectively represented by general formulae I′ and II′ are used in such molar amounts as to be capable of satisfying the values of n1 and n2, respectively. In the case where the two rubbers are used in combination, the molar ratio between these, i.e., the ratio of n1 to n2 (n1/n2), is not particularly limited. The molar ratio of the bifunctional liquid rubbers to the diisocyanates (bifunctional liquid rubbers/diisocyanates) is preferably from {fraction (1/99)} to �, more preferably from {fraction (1/10)} to �. In the case where an aromatic diisocyanate and an aliphatic diisocyanate are used in combination as the diisocyanates, the molar ratio of the aromatic diisocyanate to the aliphatic diisocyanate (aromatic diisocyanate/aliphatic diisocyanate) is preferably from 3/2 to {fraction (99/1)}, more preferably from {fraction (4/1)} to {fraction (99/1)}. Examples of the monoisocyanate to be used as a starting material include isocyanates having a substituted or unsubstituted aryl group, such as phenyl isocyanate, naphthyl isocyanate, tolyl isocyanate, isopropylphenyl isocyanate, methoxyphenyl isocyanate, and chlorophenyl isocyanate; and alkyl isocyanates in which the alkyl has 1 to 10 carbon atoms, such as n-butyl isocyanate, n-hexyl isocyanate, and n-octyl isocyanate. These may be used singly or in a combination of two or more thereof. It is preferred that the monoisocyanate be used in an amount of 1 to 40 mol per 100 mol of the diisocyanate ingredient to be used. Use of the monoisocyanate ingredient in an amount of 1 mol or larger per 100 mol of the diisocyanate ingredient is preferred because the polycarbodiimide obtained neither has too high a molecular weight nor has undergone crosslinking reaction. Namely, for example, the polycarbodiimide solution obtained undergoes neither an increase in viscosity nor solidification nor a decrease in storage stability. On the other hand, use of the monoisocyanate ingredient in an amount of 40 mol or smaller per 100 mol of the diisocyanate ingredient is preferred because the resultant polycarbodiimide solution has an appropriate viscosity and, for example, film formation by the application and drying of the solution can be satisfactorily conducted. The polycarbodiimide solution obtained through terminal blocking with a monoisocyanate used in an amount within that range relative to the amount of the diisocyanate ingredient especially has excellent storage stability. By using the ingredients in the respective proportions described above, a polycarbodiimide in which the values of n1, n2, and n3 are within the respective ranges can be obtained. Specifically, the polycarbodiimide is produced by reacting the bifunctional liquid rubber(s) as a starting material with a diisocyanate as another starting material in an aprotic solvent, subsequently subjecting the reaction product to a condensation reaction in the presence of a catalyst for carbodiimide formation to form a carbodiimide, and then blocking the terminals of the carbodiimide with a monoisocyanate. The polycarbodiimide production described above is preferably conducted in the following manner. In toluene solvent, 70 parts by weight of the bifunctional liquid rubber is mixed with 30 parts by weight of tolylene diisocyanate. After this mixture is stirred at 50� C. for 1 hour, 1-naphthyl isocyanate is mixed therewith in an amount of 2 mol per 100 mol of the tolylene diisocyanate. A catalyst for carbodiimide formation is added to the mixture. The temperature of the resultant mixture is elevated to 100� C. and a carbodiimide-forming reaction is conducted at this temperature for about 2 hours to produce a polycarbodiimide. In selecting a reaction time, the end point of the carbodiimide-forming reaction can be determined, for example, by the method which will be described later. The temperature for the reaction between the bifunctional liquid rubber and the diisocyanate is preferably 10 to 50� C., more preferably 30 to 50� C., from the standpoints of reaction time reduction and the prevention of thermal deterioration of the liquid rubber. The reaction time may be about from 30 minutes to 2 hours, and is usually about 1 hour. The end point of the reaction is ascertained from the disappearance of absorption by the OH stretching vibration (3,000 cm−1) attributable to the terminal carboxyl groups of the bifunctional liquid rubber. The temperature for the carbodiimide-forming reaction is preferably 10 to 150� C., more preferably 40 to 110� C. Carbodiimide-forming reaction temperatures not lower than 10� C. are preferred because the reaction does not necessitate too long a time and gives a polycarbodiimide solution having no functional isocyanate groups remaining therein. This polycarbodiimide solution, for example, has improved storage stability. Reaction temperatures not higher than 150� C. are preferred because the reaction does not proceed too rapidly and side reactions do not cause gelation, and because this, for example, results in a polycarbodiimide solution having improved storage stability. Examples of the catalyst for carbodiimide formation include 3-methyl-1-phenyl-2-phospholene 1-oxide, 1-phenyl-2-phospholene 1-oxide, 1-phenyl-2-phospholene 1-sulfide, 1-ethyl-3-methyl-2-phospholene 1-oxide, 3-methyl-1-phenyl-1-phospha-3-cyclopentene 1-oxide, 2,5-dihydro-3-methyl-1-phenylphospholene 1-oxide, and the 3-phospholene isomers of these. Also usable are phosphine oxides such as triphenylphosphine oxide, tritolylphosphine oxide, and bis(oxadiphenylphosphino)ethane. These may be used singly or in a combination of two or more thereof. It is preferred that the catalyst for carbodiimide formation be used in an amount in the range of 0.001 to 5 mol per 100 mol of all isocyanate ingredients to be used. Amounts of the catalyst not smaller than 0.001 mol are preferred because the reaction does not necessitate too long a time. Amounts thereof not larger than 5 mol are preferred because the gelation causative of too high a reaction rate does not occur and this, for example, results in an improvement in the storage stability of the polycarbodiimide solution. The terminal blocking with a monoisocyanate can be accomplished by adding the monoisocyanate to the reaction mixture in an initial, middle, or final stage of carbodiimide formation or throughout the carbodiimide formation. Examples of the aprotic solvent to be used for producing the polycarbodiimide include toluene, xylene, alkyltoluenes in which the alkyl has 3 to 5 carbon atoms, benzene, alkylbenzenes in which the alkyl has 3 to 6 carbon atoms, naphthalene, tetrahydrofuran, dioxane, acetone, butanone, cyclohexanone, N-methylpyrrolidone, N,N-dimethylformamide, and N,N-dimethylacetamide. These may be used singly or in a combination of two or more thereof. It is preferred that the aprotic solvent be used in such an amount that the polycarbodiimide concentration in the resultant polycarbodiimide solution is in the range of 1 to 90% by weight. Polycarbodiimide concentrations not lower than 1% by weight are preferred because solvent removal in the molding of the polycarbodiimide obtained is easy. Polycarbodiimide concentrations not higher than 90% by weight are preferred because the polycarbodiimide solution has a moderate viscosity and improved storage stability. The end point of the carbodiimide-forming reaction can be ascertained by infrared spectroscopy (IR analysis) from the occurrence of absorption by the stretching vibration of the atomic group N═C═N (2,135 cm−1) in the polycarbodiimide yielded, the disappearance of absorption by the stretching vibration of the atomic group N═C═O (2,270 cm−1) in the isocyanates, and the occurrence of absorption by the stretching vibration of the C═O (1,695 cm−1) in the amide group at each linkage between the bifunctional liquid rubber and the diisocyanate. After completion of the carbodiimide-forming reaction, a polycarbodiimide is obtained usually in the form of a solution. However, the solution obtained may be poured into a poor solvent such as methanol, ethanol, isopropyl alcohol, or hexane to precipitate the polycarbodiimide and remove the unreacted monomers and the catalyst. In preparing a solution of the polycarbodiimide which has been recovered as a precipitate, the precipitate is washed and dried in a given manner and then dissolved again in an aprotic solvent. By performing this operation, the polycarbodiimide solution can have improved storage stability. In the case where the polycarbodiimide solution contains by-products, the solution may be purified, for example, by adsorptively removing the by-products with an appropriate adsorbent. Examples of the adsorbent include alumina gel, silica gel, activated carbon, zeolites, activated magnesium oxide, activated bauxite, Fuller's earth, activated clay, and molecular sieve carbon. These may be used singly or in a combination of two or more thereof. The resin thus obtained, which comprises a polycarbodiimide, has a curing temperature of preferably 120 to 250� C. and a glass transition temperature of preferably 150 to 250� C. The resin layer to be used in this embodiment comprises the thermosetting resin in an amount of generally 10 to 100% by weight, preferably 30 to 100% by weight. The resin layer in this embodiment is preferably used as a resin film, although the form of the resin to be used is not particularly limited. The film is obtained by dissolving the polycarbodiimide in any of the aprotic solvents enumerated above, such as toluene or cyclohexanone, applying the resultant solution to a substrate by a known technique, e.g., casting, spin coating, or roll coating, and drying the coating with heating. The application of the solution is preferably conducted in such an amount as to give a film having a thickness of 10 to 300 μm. The substrate may be any film having heat resistance and chemical resistance. Examples thereof include films of polyimides, polyesters, and poly(ethylene terephthalate) . These polymers may be used singly or in a combination of two or more thereof. The film to be used as the substrate preferably is one which has been treated with a release agent such as, e.g., a fluorinated silicone. The drying with heating of the polycarbodiimide solution applied to the substrate is preferably conducted under such temperature and time conditions that the solvent can be removed, for the purpose of drying the solution without causing the curing reaction of the polycarbodiimide to proceed excessively. Specifically, the drying temperature is preferably 30 to 200� C., more preferably 50 to 175� C., especially preferably 70 to 150� C. Drying temperatures not lower than 30� C. are preferred because the resultant resin film contains no residual solvent and has high reliability. Drying temperatures not higher than 200� C. are preferred because the resin film can be sufficiently dried while being inhibited from thermally curing. The time period of drying is preferably from 30 seconds to 30 minutes, more preferably 1 to 10 minutes, especially preferably 2 to 5 minutes. Drying times not shorter than 30 seconds are preferred because the resultant resin film contains no residual solvent and has high reliability. Drying times not longer than 30 minutes are preferred because the resin film can be sufficiently dried while being inhibited from thermally curing. In producing the resin film, various nonconductive inorganic powders, e.g., powders of ceramics such as alumina, silica, magnesia, and silicon nitride, may be incorporated according to need for the purpose of modulus regulation, etc. Such powders may be used singly or in a combination of two or more thereof. The resin film may suitably further contain an inorganic filler as long as this does not impair the processability and heat resistance of the layer. Furthermore, various additives such as a leveling agent or defoamer for obtaining surface smoothness, a silane coupling agent or titanate coupling agent for improving adhesion, a nonionic surfactant, a fluorochemical surfactant, and a silicone additive may have been added according to need. The amount of these additives to be added is preferably 0.1 to 100 parts by weight, more preferably 0.2 to 50 parts by weight, per 100 parts by weight of the polycarbodiimide. Conduction paths 6 may be formed in the resin film in order to electrically connect the wirings of the wiring circuit boards to each other. The conduction paths are formed, for example, by forming through-holes extending in the direction of the thickness of the resin film by means of a laser, punching, drilling, etc. and filling the through-holes with a paste containing metal particles, e.g., copper particles or silver particles, by means of a dispenser, suction, screen printing, etc. In this embodiment, the circuit board 7 having built-in electronic parts is produced by disposing two wiring circuit boards 2 each having an electronic part 1 mounted thereon so that the electronic-part-mounting sides of the respective circuit boards face each other, disposing a resin layer 3 between the circuit boards, and press-bonding the resin layer to the circuit boards, for example, by vacuum pressing. For the disposition of the resin layer between the wiring circuit boards, use may be made of a method in which through-holes for positioning are formed beforehand in the circuit boards and the resin film, and pins for positioning are used to dispose the resin film. The press-bonding of the resin layer to the circuit boards is conducted at a pressure of preferably 9.8�10−3 to 9.8�10−1 MPa, more preferably 9.8�10−2 to 4.9�10−1 MPa, with heating at preferably 100 to 200� C., more preferably 140 to 170� C., for preferably from 5 seconds to 10 minutes, more preferably from 10 seconds to 1 minute. In this press-bonding operation, the electronic parts are embedded in the resin layer and the wiring circuit boards are electrically connected to each other by the conduction paths in the direction of superposition. Thereafter, a wiring circuit board having an electronic part mounted thereon and a resin layer may be further superposed on the circuit board having built-in electronic parts produced above, as shown in FIG. 2. The number of circuit boards to be superposed may be adjusted according to the intended use. After the wiring circuit boards have been press-bonded to the resin layer in the manner described above, the resultant structure is preferably further heated at a temperature of about 120 to 200� C. for about 1 to 5 hours in order to completely cure the polycarbodiimide in the resin layer. The process for producing a circuit board having built-in electronic parts in another embodiment of the invention comprises the steps of: folding a wiring circuit board having two or more electronic parts mounted thereon; disposing a resin layer in the resultant space between sections of the folded circuit board where electronic-part-mounting sides have come to face each other; and press-bonding the resin layer to the folded sections of the circuit board. An example of the circuit board having built-in electronic parts which is produced by the process in this embodiment is shown in FIG. 3. This circuit board has a structure comprising: a wiring circuit board 2 which has two or more electronic parts 1 mounted thereon and has been folded; and a resin layer 3 which has been disposed between the folded sections of the circuit board and in which the electronic parts 1 have been embedded. The number of folds of the wiring circuit board may be determined according to the intended use. In this embodiment, the wiring circuit board, electronic parts, and resin layer to be used may be the same as those described for the above-described embodiments. However, unlike the process described above, this process does not necessitate the formation of a conduction path in a resin layer for electrically connecting the wirings of wiring circuit boards, because only one common wiring circuit board is used. In this embodiment, the circuit board 7 having built-in electronic parts is produced by preparing a wiring circuit board 2 having two or more electronic parts 1 mounted thereon, disposing a resin layer 3 in given positions on electronic-part-mounting sides, folding the wiring circuit board 2 so that the electronic-part-mounting sides face each other, and press-bonding the resin layer to the circuit board, for example, by vacuum pressing. As in the process described above, the disposition of the resin layer on the wiring circuit board may be conducted by a method in which through-holes for positioning are formed beforehand in the circuit board and the resin film, and pins for positioning are used to dispose the resin film. The press-bonding of the resin layer to the circuit board is conducted at a pressure of preferably 9.8�10−3 to 9.8�10−1 MPa, more preferably 9.8�10−2 to 4.9�10−1 MPa, with heating at preferably 100 to 200� C., more preferably 140 to 170� C., for preferably from 5 seconds to 10 minutes, more preferably from 10 seconds to 1 minute. In this press-bonding operation, the electronic parts are embedded in the resin layer. Another circuit board and a resin layer may be further superposed on the circuit board having built-in electronic parts produced in this embodiment. Such a circuit hoard having built-in electronic parts may be produced according to the intended use. After the wiring circuit board has been press-bonded to the resin layer in the manner described above, the resultant structure is preferably further heated at a temperature of about 120 to 200� C. for about 1 to 5 hours in order to completely cure the polycarbodiimide in the resin layer. EXAMPLE The present invention will be illustrated in greater detail with reference to the following Example, but the invention should not be construed as being limited thereto. In the following Example, all synthesis reactions were conducted in a nitrogen stream. IR analysis was made with FT/IR-230 (manufactured by JEOL Ltd.). Into a 500-mL four-necked flask equipped with a stirrer, dropping funnel, reflux condenser, and thermometer were introduced 70.57 g (282 mmol) of 4,4′-diphenylmethane diisocyanate, 27.34 g (5.70 mmol) of Hycar CTB2000X162 (manufactured by B.F. Goodrich), 54.68 g (39.06 mmol) of NISSO-Ps CI-1000 (manufactured by Nippon Soda Co., Ltd.), and 217.96 g of cyclohexanone. The contents were stirred at 40� C. for 1 hour. Thereto were further added 10.91 g (67.68 mmol) of p-isopropylphenyl isocyanate and 0.54 g (2.82 mmol) of 3-methyl-1-phenyl-2-phospholene 2-oxide. The resultant mixture was heated to 100� C. with stirring and held for 2 hours. The progress of the reactions was ascertained by IR analysis. Specifically, the decrease in absorption by the stretching vibration of the atomic group N═C═O in the isocyanates (2,270 cm−1) and the increase in absorption by the stretching vibration of the atomic group N═C═N in the polycarbodiimide (2,135 cm−1) were followed. Furthermore, absorption by the stretching vibration of the C═O in the amide group at each linkage between each bifunctional liquid rubber and the diisocyanate (1,695 cm−1) was observed. After the end point of the reactions was ascertained by IR analysis, the reaction mixture was cooled to room temperature. Thus, a polycarbodiimide solution was obtained. In the polycarbodiimide obtained, n1+n2 was 3 to 5, n3 was 71 to 91, n1+n2+n3 was 74 to 96, and (n1+n2)/(n1+n2+n3) was from 5/74 to 3/96. Subsequently, the polycarbodiimide solution obtained was applied with a roll coater on a separator (thickness, 50 μm; manufactured by Mitsubishi Polyester Film Corp.) consisting of a poly(ethylene terephthalate) film treated with a release agent (fluorinated silicone), in such an amount as to give a resin film having a thickness of 250 μm. This coating was heated at 130� C. for 1 minute and then at 150� C. for 1 minute to obtain a resin film adherent to the separator. Through-holes of 0.3 mm-diameter were formed by punching in the resin film obtained. These through-holes were filled with a paste containing copper particles by means of a dispenser to form conduction paths. A double-sided copper-clad substrate was prepared which comprised a polyimide resin as an insulating layer and a copper foil superposed as a conductor layer on each side of the insulating layer. The copper foils were etched to produce a wiring circuit board having a given wiring pattern on each side. Two such wiring circuit boards were prepared. A semiconductor element having a thickness of 100 μm was mounted with a flip chip bonder on one side of each of the two wiring circuit boards. Subsequently, the two wiring circuit boards were disposed respectively on both sides of the resin film so that the semiconductor elements faced each other. This assemblage was pressed with a vacuum pressing machine (VH1-572, manufactured by Kitagawa Seiki) under a vacuum of 2,660 Pa at a temperature of 150� C. and a pressure of 2.94�10−1 MPa for 30 seconds to conduct press bonding and embed the semiconductor elements. Thereafter, the resultant structure was heated at 175� C. for 5 hours to cure the polycarbodiimide in the resin layer. Thus, a circuit board having built-in electronic parts was produced. The process of the invention is usable in the production of electronic appliances which necessitate the high-density mounting of electronic parts such as semiconductor elements. While the present invention has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope thereof. The present application is based on Japanese Patent Application No. 2004-010372 filed on Jan. 19, 2004, the contents thereof being herein incorporated by reference. Referenced byCiting PatentFiling datePublication dateApplicantTitleUS7375421 *Jun 8, 2005May 20, 2008Matsushita Electric Industrial Co., Ltd.High density multilayer circuit moduleUS8058145 *Jul 23, 2010Nov 15, 2011Semiconductor Energy Laboratory Co., Ltd.Micro-electro-mechanical device and manufacturing method for the sameUS8552473Nov 2, 2011Oct 8, 2013Semiconductor Energy Laboratory Co., Ltd.Micro-electro-mechanical device and manufacturing method for the sameUS20110031628 *Jul 22, 2010Feb 10, 2011Fujitsu LimitedSemiconductor device module and method of manufacturing semiconductor device module* Cited by examinerClassifications U.S. Classification438/108, 257/E23.063, 257/E23.177International ClassificationC08G18/34, H01L21/48, H05K3/46, H05K3/28, H01L23/538, H01L23/498, C08G18/69, H05K1/18, H05K3/30Cooperative ClassificationH01L21/4857, H05K1/189, H01L2224/16227, H01L2224/73204, H05K3/4614, H01L23/49833, H05K3/284, H05K1/186, H01L23/5387European ClassificationH05K1/18C6B, H01L23/538J, H01L23/498F, H01L21/48C4DLegal EventsDateCodeEventDescriptionJan 19, 2005ASAssignmentOwner name: NITTO DENKO CORPORATION, JAPANFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:UWADA, KAZUKI;HOTTA, YUJI;REEL/FRAME:016199/0309Effective date: 20050114RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google


text:
Words that start with gaolbi | Words starting with gaolbi
Words that start with gaolbi | Words starting with gaolbi http://www.thefreedictionary.com/words-that-start-with-gaolbiPrinter Friendly
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Words that start with gaolbi
Found 2 words that start with gaolbi. Browse our Scrabble Word Finder, Words With Friends cheat dictionary, and WordHub word solver to find words starting with gaolbi. Or use our Unscramble word solver to find your best possible play! Related: Words containing gaolbi
9-letter words that start with gaolbi8-letter words that start with gaolbiSee also9-letter words that start with gaolbigaolbirds8-letter words that start with gaolbigaolbirdSee also:Q words without UWords that end in jWords that start with cWords with the letter qWords that start with nWords that start with yWords that start with gaolbWords that start with gaolbir

type: global

value: This website is an American online dictionary and encyclopedia that aggregates information from various sources.


text:
Swarovski Crystal Jewelry to make you feel by MariesJewelryshop
Swarovski Crystal Jewelry to make you feel Beautiful
Announcement SALE!!!! EVERYTHING IN MY SHOP IS ALMOST 50% LESS THAN THE ORIGINAL PRICE!
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If you are looking for unique and affordable jewelry to wear for formal or just for everyday, please check out my lovely Earrings,Lariat Necklaces, Bracelets and Anklets. My Stretch Ankle Bracelets for those in warmer climates make great affordable gifts and I can customize them for you at no extra charge.
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I try to add something new and unique to my shop on a daily basis. I'm always happy to discuss any ideas you may have, so please contact me any time! Thank you for taking the time to browse. Have a Great Day!!
SALE!!!! EVERYTHING IN MY SHOP IS ALMOST 50% LESS THAN THE ORIGINAL PRICE!
Handmade Swarovski Aquamarine and Pearl Necklace with Cosmic Crystal Drop
Ladies Stretch Ankle Bracelet made with Swarovski Crystal AB Heart Drop FREE U.S.A. SHIPPING
Karen Maguire on Feb 11, 2014
I love the two lariats sets that Marie made for me. Marie was very easy to work with & open to ideas. I would not hestiate to recommend Marie to anyone. Marie does fantastic work in making jewelry. Reserved For Karen
Everything I make, I guarantee for 1 month, I want my customers to be 100% satisfied. If anything breaks, I ask that you gather whatever you can and send it back to me. I will replace it at no extra cost. If you truly are unhappy with your purchase I will refund your payment only after I receive the item back within 7days of your receiving it.
Free U.S.A. Standard Shipping. There is a charge for shipping outside of the USA.
If anything should break, I will replace it within 3 months of purchase. My only request is that you send back the pieces of the item that broke. The I will send you a new one. If you are absolutely unhappy with a purchase, I will refund your payment within two weeks of your receiving it. Only after I receive the item you no longer want.

value: This website is an American e-commerce company focused on handmade or vintage items and craft supplies.


text:
The 14 worst myths about recovered mental patients : new publications from the National Institute of Mental Health. (Book, 1985) [WorldCat.org]
I thought you might be interested in this item at http://www.worldcat.org/oclc/15193478 Title: The 14 worst myths about recovered mental patients : new publications from the National Institute of Mental Health. Publisher: [Bethesda, Md.?] : U.S. Dept. of Health and Human Services, Public Health Service, Alcohol, Drug Abuse, and Mental Health Administration, National Institute of Mental Health, [1985?] OCLC:15193478
The 14 worst myths about recovered mental patients : new publications from the National Institute of Mental Health.
[Bethesda, Md.?] : U.S. Dept. of Health and Human Services, Public Health Service, Alcohol, Drug Abuse, and Mental Health Administration, National Institute of Mental Health, [1985?]
15193478
New publications from the National Institute of Mental Health
Add tags for "The 14 worst myths about recovered mental patients : new publications from the National Institute of Mental Health.". Be the first.
<http://www.worldcat.org/oclc/15193478> # The 14 worst myths about recovered mental patients : new publications from the National Institute of Mental Health.
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schema:publisher <http://experiment.worldcat.org/entity/work/data/9377936#Agent/u_s_dept_of_health_and_human_services_public_health_service_alcohol_drug_abuse_and_mental_health_administration_national_institute_of_mental_health> ; # U.S. Dept. of Health and Human Services, Public Health Service, Alcohol, Drug Abuse, and Mental Health Administration, National Institute of Mental Health
wdrs:describedby <http://www.worldcat.org/title/-/oclc/15193478> ;
<http://experiment.worldcat.org/entity/work/data/9377936#Agent/u_s_dept_of_health_and_human_services_public_health_service_alcohol_drug_abuse_and_mental_health_administration_national_institute_of_mental_health> # U.S. Dept. of Health and Human Services, Public Health Service, Alcohol, Drug Abuse, and Mental Health Administration, National Institute of Mental Health
<http://experiment.worldcat.org/entity/work/data/9377936#Organization/national_institute_of_mental_health_u_s> # National Institute of Mental Health (U.S.)
<http://experiment.worldcat.org/entity/work/data/9377936#Place/bethesda_md> # Bethesda, Md.?
<http://www.worldcat.org/title/-/oclc/15193478>
schema:about <http://www.worldcat.org/oclc/15193478> ; # The 14 worst myths about recovered mental patients : new publications from the National Institute of Mental Health.
<http://www.worldcat.org/title/-/oclc/15193478#PublicationEvent/bethesda_md_u_s_dept_of_health_and_human_services_public_health_service_alcohol_drug_abuse_and_mental_health_administration_national_institute_of_mental_health_1985>
schema:location <http://experiment.worldcat.org/entity/work/data/9377936#Place/bethesda_md> ; # Bethesda, Md.?
schema:organizer <http://experiment.worldcat.org/entity/work/data/9377936#Agent/u_s_dept_of_health_and_human_services_public_health_service_alcohol_drug_abuse_and_mental_health_administration_national_institute_of_mental_health> ; # U.S. Dept. of Health and Human Services, Public Health Service, Alcohol, Drug Abuse, and Mental Health Administration, National Institute of Mental Health
The 14 worst myths about recovered mental patients : new publications from the National Institute of Mental Health./National Institute of Mental Health (U.S.);; [Bethesda, Md.?] : U.S. Dept. of Health and Human Services, Public Health Service, Alcohol, Drug Abuse, and Mental Health Administration, National Institute of Mental Health, [1985?]

value: This website is a union catalog that itemizes the collections of 15,637 libraries in 107 countries that participate in the OCLC global cooperative. It is operated by OCLC, Inc.


text: Are you surprised that people are angry? That they are beating up cops? That they are opposing idiotic flyovers that will deface one of the world?s great cities? writes Vir Sanghvi.

value: This website is an Indian English-language daily newspaper introduced and founded in 1924 by Sunder Singh Lyallpuri, founder-father of the Akali movement and the Shiromani Akali Dal in the Punjab Province. It played integral roles in the Indian independence movement as a nationalist daily.


text:
If Obama is re-elected, how confident are you, if at all, that the country will get back on track economically in the next year or two? (Among registered voters) - The Washington Post
Washington Post Florida poll, Sept. 19-23, 2012Q: If Obama is re-elected, how confident are you, if at all, that the country will get back on track economically in the next year or two? (Among registered voters)

value: This website is an American daily newspaper published in Washington, D.C. It is the most-widely circulated newspaper within the Washington metropolitan area, and has a large national audience. Daily broadsheet editions are printed for D.C., Maryland, and Virginia.


text:
Apple Iphone Ipod Icons Ceramic Drink Coaster Set By Coaster Store - eclectic - accessories and decor - - by Etsy
added by At The Picket Fence to Guest Picks: An Apple a DayThese iPhone/iPod application icon ceramic drink coasters would make fun conversation pieces at a cocktail party. Packaged in a set of four of your choice, we might have to choose several sets to cover all of our favorite Apps!	What Houzzers are commenting on:
added by feiheli to feiheli's Favorites (5 weeks ago)I want!added by nonjere to nonjere's Favorites (2 months ago)Very cute.added by agunderman to agunderman's ideas (4 months ago)Totally cooladded by potatoes98 to potatoes98's Favorites (13 months ago)Also for my dad. added by tussy to etsy (13 months ago)Coastersadded by wjrkar85 to wjrkar85's Favorites (13 months ago)Giftadded by sylviame to sylviame's ideas (14 months ago)para los vasosadded by Debbie M to debbie_lickteig's ideas (14 months ago)cuteadded by aaroniemcwonley to aaroniemcwonley's ideas (14 months ago)App coastersadded by marwaramadan to looli (",) (14 months ago)Puzladded by tonytong01 to tonytong01's Favorites (14 months ago)Coasters!!added by specter to Misc... (14 months ago)Pricey but still kinda neat. added by katejump to katejump's Favorites (14 months ago)Love these coasters!added by Avantika Prabhakara to vanti's ideas (14 months ago)If only I could get some fanvibe coasters...	browse over 1,500,000 home design photos on houzz	Apple Iphone Ipod Icons Ceramic Drink Coaster Set By Coaster Store
These iPhone/iPod application icon ceramic drink coasters would make fun conversation pieces at a cocktail party. Packaged in a set of four of your choice, we might have to choose several sets to cover all of our favorite Apps!
— At The Picket Fence	Product Specifications:
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value: This website is an American website, online community and software for architecture; interior design and decorating; landscape design and home improvement. It was founded in 2009 and is based in Palo Alto, California.


text:
Department of Civil Engineering Pro...
by Nebraska Transpor...
Project Management PowerPoint PPT C...
94134 views
by Barun_agnihotri
A comprehensive training powerpoint that covers project management in the workplace ...
Note: Triple constraint is frequently represented by a triangle – because there are 3 sides in a triangle. Note: Good External and Internal working relationship as the project is being run is equally important, so that if there is a next version, people will want to continue working on it and funding the project. Triple Constraints are: Cost, Time, Scope/Quality – There must be a balance of all three that is appropriate for the project – yet one leads. For example: life saving medical device – quality and scope must be the leader. A competitor that wants to be first to market, time might be the leader. A small company with a limited budget doing version 8, might put the cost as the leader of the project. Sometime Quality is considered a fourth constraint and sometimes it is lumped in with Scope. These are all the people/groups/team that will help or hinder a projects success. All of these name/groups/teams are inputs into a communication plan. The joke here is that you can tell if someone is optimistic or pessimistic – with the “you” in the center red circle – do they see that as a target – bull’s eye or a center of helpful support? Project management
 Includes a start and end time.
 Creates something new or
fixes/improves something that
 Proposes and supports temporary
www.readysetpresent.com Page 2
 Performed by people and teams.
 Constrained by resources or
budget or schedule.
 Monitored and controlled.
 Initiated, planned, executed, and
www.readysetpresent.com Page 3
www.readysetpresent.com Page 4
Before developing a project,
4. What are the key elements of the
5. What is the timeframe?
6. Is there a budget?
7. Who is the sponsor?
www.readysetpresent.com Page 5
The Challenge of a Project
“The Triple Constraint”
www.readysetpresent.com Page 6
Time Scope/Quality
 Waterfall
 Circular
 Personal
www.readysetpresent.com Page 7
Stakeholders (3 of 4)
Sample Web of Influence
Download “Project Management”
at ReadySetPresent.com
Slides include: the 7 characteristics of a project, the
difference between projects, programs, and
processes, 10 communication tips, 9 project
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types of lifecycles, 7 points on stakeholders, 6 slides
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Department of Civil Engineering Project Management Specialization
Nebraska Transportation Center Project Management PowerPoint PPT Content Modern Sample
The Project Management Process - Week 1

value: This website is an American hosting service, now owned by Scribd, for professional content including presentations, infographics, documents, and videos. Users can upload files privately or publicly in PowerPoint, Word, PDF, or OpenDocument format.


text:
4 bedroom semi-detached house to rent in Muscroft Road, Prestbury, Cheltenham, GL52
www.rightmove.co.uk/property/76170548
Belvoir! are pleased to offer this spacious, immaculately presented 4 bedroom semi-detached home located within a quiet cul-de-sac in the sought after village of Prestbury. The property is within walking distance of Prestbury High Street and its amenieites as well as bus links to Cheltenham Town Centre.
The unfurnished accommodation comprises; entrance with downstairs cloakroom/ WC, good-size lounge with wood flooring which opens to a dining room with patio door to rear garden, modern kitchen/ breakfast room with a range of white gloss base and wall units with gas hob and electric oven, family/ store room within part-converted garage, 4 bedrooms and bathroom with shower over bath.
Externally, the property offers enclosed rear garden - laid to lawn with decked area and shed. There is driveway parking to front with garage which can be used for storage.
Sorry bu tno pets are allowed at this property.
Available November 2018 BOOK YOUR VIEWING TODAY!!
Belvoir! Fees:
This property is marketed by Belvoir, Cheltenham Lettings at £950 per month. Rightmove has calculated the price per week for comparison purposes only.
Property reference 78414. The information displayed about this property comprises a property advertisement. Rightmove.co.uk makes no warranty as to the accuracy or completeness of the advertisement or any linked or associated information, and Rightmove has no control over the content. This property advertisement does not constitute property particulars. The information is provided and maintained by Belvoir, Cheltenham Lettings.

value: This website is a UK-based company that runs rightmove.co.uk, the UK's largest online real estate portal and property website. It is listed on the London Stock Exchange and is a constituent of the FTSE 100 Index.


text:
Online Shopping | Online Shopping | Java Server Pages
Uploaded by Prasad Borole
Software Requirements Specification Kgce1
Version < 1.0>
< kgce1 >
Team Guide: Mr S.M.Patil Members: 1) Pallavi Jain 2) Mukeshkumar Choudhary 3) Prasad Borole College Name: Konkan Gyanpeeth College of Engineering, karjat Department: Computer Engineering State: Maharashtra
kgce1/ Konkan Gyanpeeth College of Engineering Page 1
Version <1.0> <date>
Date <date> Version 1.0 Description Synopsis Author Kgce1
4 Product Function 2.1 Purpose 1.2 Scope 1.6 Constraints 2.8 Use Case Model Description .5 User Characteristics 2. and Abbreviations 1.3 Definition.5 Technologies to be used 1. Acronyms.0 Introduction 1.kgce1/ Konkan Gyanpeeth College of Engineering Page 2 Online Shopping System Software Requirements Specification Kgce1 Version <1. 1.1 Product Perspective 2.3 Hardware Interface 2.0> <date> Table of Contents Description Page No.0 Overall Description 2.7 Architecture Design 2.2 Software Interface 2.4 References 1.6 Overview 2.
2 Schema 2.11.kgce1/ Konkan Gyanpeeth College of Engineering Page 3 Online Shopping System Software Requirements Specification Kgce1 Version <1.9 Class Diagram Sequence Diagrams 2.0> <date> 2.10 Database Design 2.0 Specific Requirements 3.1 ER Diagram 2.2 Supplementary Requirements kgce1/ Konkan Gyanpeeth College of Engineering Page 4 .1 Use Case Reports 3.11.12 Assumptions and Dependencies 3.
Provide Interactive interface through which a user can interact with different areas of application easily.0> <date> Software Requirements Specification 1.1 Purpose o o o o o To develop an easy to use web based interface where users can search for products. .0 Online Shopping System Software Requirements Specification Kgce1 Version <1. 1. Making the application AJAX enabled gets rid of these unnecessary delays letting the user to perform exhaustive search.Online Shopping System Version 1. The users of this application can easily feel the difference between the Ajax empowered user interfaces vs. The system will allow the customer to make the payment in local language. traditional user interfaces. The system would be easy to use and hence make the shopping experience pleasant for the users. The system will allow the customer to view complete specification of the product along with the images. Provide Drag and Drop feature thereby allowing the user to add products to or remove products from the shopping cart by dragging the products in to or out of the shopping cart. The system will provide drag and drop features which will allow the users to add a product to shopping cart or remove a product from a shopping cart.0 Introduction: The project is a simple online shopping portal. The system will allow more than one categories to be selected and different brands under the segment. A user can view the complete specification of the product along with various images and also view the customer reviews of the product. view a complete description of the products and order the products.
0 Online Shopping System Software Requirements Specification Kgce1 Version <1. o JSP (Java Server Pages): It is used to create dynamic web content o DB2 (IBM Database 2): It is a database management system that provides a flexible and efficient database platform to raise a strong "on demand" business applications. . It can be extended to have a easy to use check out process. belonging to the Java platform. o The current system is confined only to the shopping cart process. Acronyms and Abbreviations: o Ajax (Asynchronous Java Script and XML): It is a technique used in java script to create dynamic web pages.2 SCOPE: The Scope of online shopping portal includes: o The users could subscribe for price alerts which would enable them to receive messages when price for products fall below a particular level.0> <date> 1. o HTTP (Hyper Text Transfer Protocol): It is a transaction oriented client/ server protocol between a web browser and a web server. o HTML (Hyper Text Markup Language): It is used to create static web pages.kgce1/ Konkan Gyanpeeth College of Engineering Page 5 Online Shopping System Version 1. o J2EE (Java 2 Enterprise Edition): It is a programming platform. which is used for developing and running distributed java applications.3 Definitions. 1.
Ajax: Asynchronous Java Script and XML. Web 2.0: It is commonly associated with web applications which facilitate interactive information sharing. JAXP. DB2: IBM Database. o J2EE COMPLETE REFERENCE.0 Online Shopping System Software Requirements Specification Kgce1 Version <1. user-centered design and collaboration on the World Wide Web.0: RSS Feed 2. namely: .5 Technologies to be used: o o o o J2EE: (Servlet. kgce1/ Konkan Gyanpeeth College of Engineering Page 6 Online Shopping System Version 1. o Web 2. 1.0> <date> 1. 1. XML: Extension Markup Language. Java Beans) Application architecture.4 References: o AJAX-COMPLETE REFERENCE.0.o XML (Extensible Markup Language): It is a markup language that was designed to transport and store data.6 Overview: The SRS will include two sections. interoperability. JSP.
0> <date> -I. some general constraints while making the software and some assumptions and dependencies that are assumed. Customer: o o o o o Simplicity. 2.Specific Requirements: This system contains the following types of actors: 1.Overall Description: Project describes what level of proficiency is expected of the user. Administrator: o Track usage of services in language. Payment possibilities in local language.0 Online Shopping System Software Requirements Specification Kgce1 Version <1. o Ensure Simplicity and correctness correspondence of services purchased.-I. Printout of the bill. End to end functions. o Find approaches to simplify transactions. kgce1/ Konkan Gyanpeeth College of Engineering Page 7 Online Shopping System Version 1. . Simple interface for terms and condition.
1 Product Perspective: Online shopping project is aimed towards the vendors who want to reach out to the maximum cross-section of customer and common people who can be potential customer. This project envisages bridging the gap between the seller and the customer. kgce1/ Konkan Gyanpeeth College of Engineering Page 8 Online Shopping System Version 1.0 Overall Description: 2.o Ensure original information is perfectly localized to remove any duplication.2 Software Interface: • Front End Client: Web Browser. AJAX • Web Server: IBM Web Server • Database Server: IBM Database Server . Online shopping should be user-friendly. 2. ‘quick to learn’ and reliable software for the above purpose.0> <date> 2. This is intended to be a stand-alone product and should not depend on the availability of other software.0 Online Shopping System Software Requirements Specification Kgce1 Version <1.
Adding in the Cart. 8. Bill Generation. 7. Disk Space 1 GB RAM 512 MB 2.0> <date> 6. Search for a Product 4. Mozila and Firefox Processor Pentium II at 500 MHz. Disk Space 1 GB RAM 512 MB • Server Side: Browser Type IE. Login to the system. Selecting Products. . Mozila and Firefox Processor Pentium II at 500 MHz.3 Hardware Interface: • Client Side: Browser Type IE.0 Online Shopping System Software Requirements Specification Kgce1 Version <1.• Back End Client: DB2 2. kgce1/ Konkan Gyanpeeth College of Engineering Page 9 Online Shopping System Version 1. Payment of the Shopping done. Suggestion for a product. 9. 5. NN. 2. Creating an account.4 Product Functions: This System includes major functions like:1. Confirming the Cart Items. 3. NN.
2.NOTE: A user can only do the above operations (expect no. ♦ The user should be familiar with the Internet. selecting and adding the products to the cart and bill payment.7 Architecture Design: kgce1/ Konkan Gyanpeeth College of Engineering Page 10 Online Shopping System Version 1.5 User Characteristics: ♦ The user should be familiar with the Shopping related terminology like Shopping cart/Checking out/Transaction etc. 1&2) after creating an account. ♦ No multilingual support ♦ Pre Conditions: An account must be created before searching.8 Use Case Diagram: .6 Constraints: ♦ Real-life credit card validation and Banking system is not implemented.0 Online Shopping System Software Requirements Specification Kgce1 Version <1.0> <date> 2. selecting and adding the products to the cart ♦ Post Condition: After creation of a user account the user can perform the operations such as searching. 2. 2.
0 Online Shopping System Software Requirements Specification Kgce1 Version <1.0> <date> .(a) Use Case Diagram for the Admin: kgce1/ Konkan Gyanpeeth College of Engineering Page 11 Online Shopping System Version 1.
(b) Use Case Diagram for the Customer: kgce1/ Konkan Gyanpeeth College of Engineering Page 12 Online Shopping System Version 1.0 Online Shopping System Software Requirements Specification Kgce1 Version <1.0> <date> .
9 Class Diagram: 2.0 Online Shopping System Version <1.0> .2.10 Sequence Diagram: (a) Sequence Diagram for registering a New User kgce1/ Konkan Gyanpeeth College of Engineering Page 13 Online Shopping System Version 1.
Software Requirements Specification Kgce1 <date> (b) Sequence Diagram for Logging a User: kgce1/ Konkan Gyanpeeth College of Engineering Page 14 Online Shopping System Version 1.0 .
Online Shopping System Software Requirements Specification Kgce1 Version <1.0> <date> kgce1/ Konkan Gyanpeeth College of Engineering Page 15 .
0> <date> (c) Sequence Diagram for Adding a Product to the Cart: .Online Shopping System Version 1.0 Online Shopping System Software Requirements Specification Kgce1 Version <1.
11 Assumptions and Dependencies: Assumptions: ♦ The details related to the product.0> <date> 2. It shows us the direct relationships between the actors Admin and customer. ♦ Roles and tasks are predefined. ♦ Administrator is created in the system already. ♦ The registered user only will be getting the updates. payment and service transaction provided manually.0 Specific Requirements: 3.0 Online Shopping System Software Requirements Specification Kgce1 Version <1. 3. Use Case of Admin: Admin performs the following functions:    Adding a Segment Add a Brand Add a Product . Dependencies: ♦ User should get registered one to get the full utilization of the website. ♦ User should know the purpose of website.1 Use Case Reports: The use case diagram of Online Shopping System is very easy to understand. ♦ User should know how to ask the queries. customer.1 Database Design: 2. 1. ♦ Registration Steps will be known by the user.10.kgce1/ Konkan Gyanpeeth College of Engineering Page 16 Online Shopping System Version 1.
  Bill Generation Product Delivery kgce1/ Konkan Gyanpeeth College of Engineering Page 17 Online Shopping System Version 1. Use Case of Customer: Customer performs the following functions:        Registers Login Searches the Products Selects the Brand Selects the Product Adds Item to the Cart Payment 3.0> <date> 2.0 Online Shopping System Software Requirements Specification Kgce1 Version <1.2 Supplementary Requirements: These requirements are yet not there .
kgce1/ Konkan Gyanpeeth College of Engineering Page 18 .
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Autoimmune disease and subsequent risk of developing alimentary tra... - PubMed - NCBI
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See comment in PubMed Commons belowCancer. 2011 Mar 15;117(6):1163-71. doi: 10.1002/cncr.25524. Epub 2010 Nov 2.Autoimmune disease and subsequent risk of developing alimentary tract cancers among 4.5 million US male veterans.Landgren AM1, Landgren O, Gridley G, Dores GM, Linet MS, Morton LM.Author information 1Radiation Epidemiology Branch, Division of Cancer Epidemiology and Genetics, National Cancer Institute, National Institutes of Health, Department of Health and Human Services, Rockville, Maryland 20852, USA.AbstractBACKGROUND: Autoimmunity is clearly linked with hematologic malignancies, but less is known about autoimmunity and alimentary tract cancer risk, despite the specific targeting of alimentary organs and tissues by several autoimmune diseases. The authors therefore conducted the first systematic evaluation of a broad range of specific autoimmune diseases and risk for subsequent alimentary tract cancer.METHODS: On the basis of 4,501,578 US male veterans, the authors identified 96,277 men who developed alimentary tract cancer during up to 26.2 years of follow-up. By using Poisson regression methods, the authors calculated relative risks (RRs) and 95% confidence intervals.RESULTS: A history of autoimmune disease with localized alimentary tract effects generally increased cancer risks in the organ(s) affected by the autoimmune disease, such as primary biliary cirrhosis and liver cancer (RR, 6.01; 95% confidence interval [CI], 4.76-7.57); pernicious anemia and stomach cancer (RR, 3.17; 95% CI, 2.47-4.07); and ulcerative colitis and small intestine, colon, and rectal cancers (RR, 2.53; 95% CI, 1.05-6.11; RR, 2.06; 95% CI, 1.70-2.48; and RR, 2.07; 95% CI, 1.62-2.64, respectively). In addition, a history of celiac disease, reactive arthritis (Reiter disease), and systemic sclerosis all were associated significantly with increased risk of esophageal cancer (RR, 1.86-2.86). Autoimmune diseases without localized alimentary tract effects generally were not associated with alimentary tract cancer risk, with the exception of decreased risk for multiple alimentary tract cancers associated with a history of multiple sclerosis.CONCLUSIONS: These findings support the importance of localized inflammation in alimentary tract carcinogenesis. Future research is needed to confirm the findings and improve understanding of underlying mechanisms by which autoimmune diseases contribute to alimentary tract carcinogenesis.Published 2010 by the American Cancer Society.PMID: 21381009 [PubMed - indexed for MEDLINE] PMCID: PMC3052786 Free PMC ArticleSharePublication Types, MeSH Terms, Grant SupportPublication TypesResearch Support, N.I.H., IntramuralMeSH TermsAdolescentAdultAgedAged, 80 and overAutoimmune Diseases/complications*Autoimmune Diseases/epidemiology*Autoimmune Diseases/ethnologyCarcinoma/epidemiology*Carcinoma/ethnologyCarcinoma/etiology*Carcinoma/immunologyGastrointestinal Neoplasms/epidemiology*Gastrointestinal Neoplasms/ethnologyGastrointestinal Neoplasms/etiology*Gastrointestinal Neoplasms/immunologyGastrointestinal Tract/immunologyHumansInflammation/complicationsInflammation/ethnologyInflammation/immunologyMaleMiddle AgedRiskUnited States/epidemiologyVeterans/statistics & numerical data*Young AdultGrant SupportZ99 CA999999/CA/NCI NIH HHS/United StatesLinkOut - more resourcesFull Text SourcesJohn Wiley & Sons, Inc.Europe PubMed Central - Author ManuscriptOvid Technologies, Inc.PubMed Central - Author ManuscriptPubMed Central Canada - Author ManuscriptOther Literature SourcesCOS Scholar UniverseAccess more work from the authors - ResearchGateMedicalAutoimmune Diseases - MedlinePlus Health InformationPubMed Commons home

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