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Patent US5997983 - Rigid/flex printed circuit board using angled prepreg - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inPatentsA rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, the conductor layer containing at least one conductive pathway and the flexible insulator layer comprises fibers...http://www.google.com/patents/US5997983?utm_source=gb-gplus-sharePatent US5997983 - Rigid/flex printed circuit board using angled prepregAdvanced Patent SearchTry the new Google Patents, with machine-classified Google Scholar results, and Japanese and South Korean patents.Publication numberUS5997983 APublication typeGrantApplication numberUS 08/865,888Publication dateDec 7, 1999Filing dateMay 30, 1997Priority dateMay 30, 1997Fee statusLapsedAlso published asCA2289558A1, EP0985332A1, WO1998054936A1Publication number08865888, 865888, US 5997983 A, US 5997983A, US-A-5997983, US5997983 A, US5997983AInventorsA. Roland Caron, Sandra L. Jean, James E. Keating, Robert S. Larmouth, Lee J. MilletteOriginal AssigneeTeledyneindustries, Inc.Export CitationBiBTeX, EndNote, RefManPatent Citations (24), Non-Patent Citations (6), Referenced by (43), Classifications (23), Legal Events (7) External Links: USPTO, USPTO Assignment, EspacenetRigid/flex printed circuit board using angled prepreg
US 5997983 AAbstract
A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, the conductor layer containing at least one conductive pathway and the flexible insulator layer comprises fibers dispersed in a matrix polymer. The fibers are oriented with respect to the conductive pathway so that the conductive pathway is substantially non-aligned with said fibers, substantially along an entirety of the conductive pathway in the flex section so as to be flexible.
1. A rigid flex printed circuit board wherein the flex section of said board comprisesa basestock composite with edges, formed by laminating a conductive layer to a flexible insulator layer, said conductor layer containing at least one conductive pathway and said flexible insulator layer comprises woven fibers dispersed in a matrix polymer, said woven fibers oriented with respect to said at least one conductive pathway so that said at least one conductive pathway is non-aligned with said woven fibers, substantially along an entirety of said at least one conductive pathway in said flex section, so as to be flexible. 2. The rigid flex printed circuit board of claim 1 wherein said woven fiber orientation is non-aligned to said edge of said basestock composite.
3. The rigid flex printed circuit board of claim 1 wherein said fiber orientation is about 45 degrees relative to one of said edges.
4. The rigid flex printed circuit board of claim 1, wherein said conductive layer comprises a thickness of about 9 micron to 1 micron copper sheet and said flexible insulator layer comprises fiberglass impregnated with a thermoset adhesive.
5. The rigid flex printed circuit of claim 4, wherein said thermoset adhesive is an epoxy resin.
6. The rigid flex printed circuit board of claim 1, wherein said at least one conductive pathway is formed by imaging and etching.
7. The rigid flex printed circuit board of claim 1, wherein said rigid flex circuit board has a greater number of cycles to failure in the flex section as measured by IPC-TM-650, over that of a comparison flex section, said comparison flex section formed by laminating a conductive layer to a flexible insulator layer containing a conductive pathway, and said flexible insulating layer comprising fibers dispersed in a matrix polymer, said fibers oriented with respect to said conductive pathway so that said conductive pathway is substantially aligned with said fibers substantially along an entirety of said conductive pathway in said comparison flex section.
8. The rigid flex printed circuit board of claim 1, wherein said flex section includes a flexible insulating covercoat selected from the group consisting of polyimide polymers, or flexible photoimageable solder masks.
9. The rigid flex printed circuit board of claim 1, wherein said flex section includes a covercoat, said covercoat containing fibers dispersed in a matrix polymer, wherein said fibers in said covercoat are oriented with respect to said at least one conductive pathway so that said at least one conductive pathway is substantially aligned with said fibers of the covercoat.
10. The rigid flex printed circuit board of claim 9 wherein said fiber orientation of said covercoat is non-aligned with respect to said edge of said covercoat.
11. The rigid flex printed circuit board of claim 8 wherein said fiber orientation is about 45 degrees relative to one of said edges.
12. The rigid flex printed circuit board of claim 9 wherein the woven fibers of the basestock are oriented with respect to said at least one conductive pathway so that said at least one conductive pathway is non-aligned with said woven fibers of said basestock substantially along an entirety of said at least one conductive pathway in said flex section.
13. The rigid flex printed circuit board of claim 9, wherein said rigid flex circuit hoard has a greater number of cycles to failure in the flex section as measured by IPC-TM-650, over that of a comparison flex section of a printed circuit board containing a conductive pathway, said comparison flex section containing a covercoat layer comprising fibers dispersed in a matrix polymer, wherein the fibers of the matrix polymer are substantially aligned along an entirety of said conductive pathway in said comparison flex section.
14. A rigid flex printed circuit board wherein the flex section of the board comprises a basestock composite, formed by laminating a conductive layer to an insulating layer comprising woven fibers dispersed in a matrix polymer, said conductive layer containing at least one conductive pathway, said flex section further containing a covercoat layer with edges, said covercoat layer comprising fibers dispersed in a matrix polymer, wherein the fibers of said covercoat layer are oriented with respect to said at least one conductive pathway so that said at least one conductive pathway is non-aligned with said fibers of the covercoat substantially along an entirety of said at least one conductive pathway in said flex section, so as to be flexible.
The present invention relates to the fabrication of a rigid/flex printed circuit board wherein the construction technique involves the use of prepreg sheet in novel configuration wherein the weave fibers are positioned relative to the conductive pathways to increase the flexing characteristics of the flexible section during bending. Furthermore, the present invention relates to a method of fabrication which eliminates the need of additional process steps and/or materials to fabricate the flexible innerlayers as is required using prior art construction techniques.
A review of the prior art which is pertinent to the present invention considers two general areas. The first of these is that prior art which deals with the manufacture of rigid-flex circuit boards. This is followed by a review of the prior art relating to prepreg materials used in the manufacture of laminated structural components.
Techniques for making multilayer rigid flex printed circuit boards are well known in the field. One early example of the prior art is disclosed in U.S. Pat. No. 3,409,732 assigned to the assignee of the present application. Typically, a rigid flex stacked printed circuit board includes flexible printed circuit cables extending from the periphery of the rigid section or sections. The rigid portions of the flex cables are typically used as sites for electronic components or mechanical hardware. It is important to note that the copper conductor in each plane or layer is fabricated from one continuous sheet of copper foil.
Typically, and as disclosed in detail in U.S. Pat. No. 4,800,461, also assigned to the assignee of the present invention, in the construction of a multilayer rigid flex circuit board, the initial processing step includes formation of a basestock by laminating two copper sheets to an insulator layer comprising one or two fiberglass sheets impregnated with an adhesive such as an epoxy, commonly referred to as a prepreg. Following lamination, the copper layers can be imaged and etched to provide copper pads and conductors. The exposed copper conductor patterns are then treated to enhance bondability of an epoxy prepreg to the copper. Then, two additional insulator prepreg sheets having cutouts are positioned on both sides of the base stock. A flexible insulator of Kapton (polyimide) covered with a suitable adhesive which provides bonding to copper is positioned on both sides of the cutout section. In addition, the Kapton sheets are slightly longer than the cutout sections in the glass layers to overlap by, for example. 0.050 inch. The sandwich formed by the foregoing sheets is then laminated together to provide a rigid flex board, wherein the Kapton provides excellent flexibility and tear resistance characteristics to the flex section.
Of additional general background interest, attention is directed to U.S. Pat. No. 5,499,444, entitled "Method of Manufacturing a Rigid Flex Printed Circuit Board". In said patent, it is reported the fabrication of multilayer boards with the above referenced materials has led to some persistent problems. First, alignment of circuitry at different layers in the board is critical, and provisions must be made to prevent sliding of any layers in different planes with respect to other planes by more than a tolerance of a few thousandths of an inch. Maintaining registration of the flexible portion has also been a serious problem since the hard board must be cured or laminated by a heat-press process that is likely to cause interlayer slippage as well as thermal dimensional changes. Other problems are encountered due to the thermal expansion of the typically used insulator materials such as acrylic adhesive and the polyimide film utilized in the construction ol the rigid flex boards. Thus, failures occur when the board is subjected to elevated temperatures in thermal stress testing, hot oil solder reflow, and the like.
Another difficulty with the use of dielectric films such as Kapton film in the rigid board area is their absorption of excessive moisture, on the order of up to 3 percent by weight of water. Absorbed moisture in the circuitry with no means of escape, may cause unacceptable delamination in the rigid board area when it volatilizes during fabrication or during subsequent high temperature operation. This effect may be more destructive than simple mismatch of thermal coefficients.
The foregoing problems have in one form or another been addressed in the prior art, as shown for example in U.S. Pat. No. 4,800,641; U.S. Pat. No. 5,144,742 and U.S. Pat. No. 5,004,639. Approaches in addressing one or more of the problems involve such construction techniques as adding pads in non functional layers of the plated through holes, utilizing a curable liquid dielectric for certain layers orf layers; using temporary sheet patches of filler material surrounding(y flex regions during a heat pressing assembly stage to maintain alignment; adding glass fiber reinforcement of the flex layer for strengthening; and finally, a number of other changes or addition to the manufacturing process. However each of these solutions entails additional steps to address any one problem, and may have adverse consequences on another apparently unrelated problem. For example, the switch to acrylic cements and a polyimide flexible film has been largely responsible for moisture absorption and failure of plated through holes in multilayer boards at high temperatures. Reducing the size of the polyimide/acrylic components to limit thermal stress introduces boundary problems where flexible and rigid elements are patched together. Furthermore many of these improvements require more detailed manufacturing steps that can be costly as well as time consuming.
In U.S. Pat. No. 5,499,444, a rigid flex printed circuit board is prepared via a process wherein each circuit layer is punched in the peripheral regions with alignment slots and all layers are assembled without any acrylic bonding in a single hot press operation. More specifically, a central layer is formed of a sheet of epoxy/glass material with top and bottom copper foil layers. This central layer is cured and punched with slots at its edge, of which a portion thereof ultimately provides formation of the flexible portion of the finished board. The slots allow motion along only one of two orthogonal axis, and subsequently the punched layers (with windows for formation of the flexible region) and the central portion are assembled in a single press curing operation in which process-induced motions and realignments are constrained to occur with a small magnitude that varies with the radial position along an alignment rosette centered on the board. A top or final cover layer extends over both the flexible and rigid regions to further assure uniform alignment at all levels during pressure assembly. The '444 patent emphasizes that by using a glass/epoxy layer for the central flexible portion instead of some form of polyimide or other material, an all glass construction is achieved that is free of the major problem of z-axis thermal stresses of the conventional polyimide-glass construction. Furthermore, it is mentioned that on top of the copper layer in the flex section is a cover of insulating material which may be an adhesively bonded plastic film or a coated-on film, such as a conformal cover coat known in the art, suitable of which is a solder mask such as a UV curable flexible solder resist or a heat curable preparation both of which can be applied by a screening operation. This cover material is then described as being cured before assembly with subsequent layers.
In U.S. Pat. No. 5,144,742 there is disclosed a rigid flex printed circuit board fabricated by the steps of first forming circuitry components on a rigid flex subassembly including laminated conductive layers on opposite sides of a central insulating layer. This is followed by depositing a liquid precursor of flexible insulating layers over the circuitry components in portions of the printed circuit board subassembly corresponding to the flexible section in the final rigid flex board. The liquid precursor is then cured to form an insulating layer as a protective coating over the circuitry components in the flexible section, which is followed by finally laminating a plurality of components including at least one rigid flex subassembly and rigidizing insulating layers to form a rigid flex printed circuit board.
Attention is next directed to "High Resolution Photoimageable Covercoats for Flex Applications", a paper presented at "Flexcon 95" by W. J. Thatcher and P. M. Banks. As disclosed therein, the product sold under the tradename Imageflex™ has become available, and is characterized as a thermal hardening two/pack two component liquid photoimageable flexible soldermask that dries by evaporation to give an aqueous processable film with a gloss or matt finish. It is mentioned therein that Imageflex™ has proven suitable in a variety of flexible circuit application. The Imageflex™ is said to offer significant advantages for the product of many types of flexible printed circuits, and as an alternative to polyimide coverlay, Imageflex™ offers lower cost and higher feature resolution and alignment accuracy. In addition, a photoimageable solder mask is now available from Taiyo, Japan.
In U.S. patent application Ser. No. 08/800,844 filed Feb. 14, 1997, entitled "Multilayer Combined Rigid/Flex Printed Circuit Board", and which is assigned to the present assignee, whose teachings and prior art cited therein are incorporated by reference, there is disclosed a multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, along with a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, and a second conductive layer also having a cutout region proximate to the flexible core of the basestock composite. A photo-imageable soldermask is then applied to said exposed portion of said first conductive layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings upon the conductive layers upon which it is applied.
Finally, attention is also directed to U.S. application Ser. No. 08/702,729, filed Sep. 6, 1996, also assigned to the present assignee, whose teachings and prior art cited therein are incorporated by references which discloses a multilayer rigid flex printed circuit board, wherein the board laminate comprises a double-sided basestock composite, formed by laminating two conducting sheets to an insulating layer, said insulator layer containing a flexible core, a second insulator layer affixed to each side of the basestock. said insulator having a cutout region proximate to the flexible core of the basestock composite, a flexible layer affixed to said cutout regions with an adhesive, wherein said flexible layer contacts the conducting layers and abuts and overlaps a portion of the second insulator layer such that upon stacking of the board laminate a hollow region is produced as between the stacked laminate sections.
Accordingly, as can be seen from the above review of the prior art, in the case of manufacturing, a rigid flex printed circuit board, there has been an on-going effort to develop the most efficient and cost effective manufacturing process to address the various problems in the art, and in particular, the problem of combining dissimilar materials to provide rigid-flex characteristics. In other words, until now, prepreg material has been used almost exclusively for the manufacture of the rigid section, and something other than prepreg, e.g., a polyimide, has been employed for manufacture of the flex section. and as a consequence, a truly low cost rigid-flex circuit has not yet been available to the industry.
Of course, with regards to prepreg material itself, a fair amount of art has been established regarding the use of prepreg material for basic structural applications, well outside the scope of rigid flex circuitry. Nevertheless, and as noted at the outset, a review of such technology is still in order.
For example, in U.S. Pat. No. 4,927,581, there is disclosed a method of shaping elongated composite structures of a resin matrix reinforced with randomly broken fibers oriented in transverse and non-transverse directions with respect to the longitudinal axis of the structure. The formed structure is said to be characterized by the particular orientation of the fibers in the transverse and non-transverse direction after the structure is formed.
In U.S. Pat. No. 5,017,312 there is disclosed an apparatus for the manufacture of oriented chopped glass fiber mats from non-conductive fiber feed stock. A preferred embodiment includes the incorporation of a glass fiber mat into a composite by applying a matrix resin to the mat in sufficient quantity to ensure the integrity of the mats. The process for manufacturing non-woven oriented mats is also disclosed.
In U.S. Pat. No. 5,200,246 there is disclosed a low-cost, high web integrity fabric that can be economically produced and tailored to provide a variety of different combinations of characteristics and properties for different end uses. The fabric is described as containing continuous filaments, ranging from elastomeric to non-elastic. but elongatable to some minimum extent, for strength and elasticity.
In U.S. Pat. No. 5,273,819 there is disclosed an improved ram extruded composite product. A composite is said to be formed from a phenolic resin, containing carbon fibers of various lengths where each length of fibers are oriented in a pre-selected, pre-determined orientation.
In U.S. Pat. No. 5,275,877 there is disclosed a shaped reinforced thermoplastic composite. The composite is formed by forming a prepreg as a plurality of individual sheets or layers which comprises essentially unidirectionally oriented fibers. A lay-up is formed by curing each individual sheet or layer into pieces so that the direction of fiber orientation in each such piece is either parallel to one pair of edges or at angles of 45 degrees to all of the edges.
It is therefore an object of the present invention to advance further over the prior art reviewed above and provide what is considered to be one of the most cost effective routes for the preparation of a rigid flex circuit board containing prepreg, wherein the rigid flex circuit board is of homogenous construction, i.e. the prepreg therein serves as both the rigid and flex section thereof and wherein the prepreg operates in such novel manner as a consequence of selected prepreg fiber positioning and/or orientation with respect to the conductor patterns or pathways designed thereupon.
More specifically, it is an object of this invention to utilize either the positioning and/or orientation of the fibers in the prepreg with respect to the conductor patterns or pathways or to position the conductor patterns and pathways with respect to the fiber orientation in a manner which uniquely provides for the manufacture a rigid flex circuit board, wherein the flexibility of the flex section can itself be adjusted to a desired or targeted level are a consequence of such novel and alternative positioning techniques.
A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges, formed by laminating a conductive layer to a flexible insulator layer said conductor layer containing at least one conductive pathway and said flexible insulator layer comprises fibers dispersed in a matrix polymer. The fibers are oriented with respect to said at least one conductive pathways so that said at least one conductive pathway is substantially non-aligned with said fibers substantially along an entirety of said at least one conductive pathway in said flex section, so as to be flexible.
In method form, the present invention includes a process for preparing a rigid flex printed circuit board comprising first supplying a basestock composite with edges said basestock composite comprising fibers dispersed in a matrix polymer and bonding to said basestock composite a conductive layer followed by imaging and etching a conductive pathway in said conductive layer so that said conductive pathway is substantially non-aligned with said fibers substantially along an entirety of said conductive pathway.
Various features of the invention will be understood with reference to the figures below and the description thereof, wherein:
FIG. 1 illustrates the fibers of a prepreg orientated at right angles to an applied stress according to the prior art.
FIG. 2 illustrates the proposed development of cracking in the fiber bundles and in the copper traces when prepreg fibers are positioned in generally parallel relationship to the edge thereof, and is a side-view along line A--A' of FIG. 1.
FIG. 3 illustrates in preferred embodiment the orientation of fibers of the flex section of the present invention.
FIG. 4 illustrates a side-view of the angled prepreg which comprises the flex section of an inner layer.
FIG. 5 illustrates a side-view of a basic multilayer rigid flex circuit board.
FIG. 6 illustrates a side-view of a multilayer rigid flex with hardboard laminate outerlayers in the rigid areas only.
In one preferred embodiment, the basic construction technique herein involves the preparation of a rigid flex printed circuit board which comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, said flexible insulating layer comprising fibers dispersed in a matrix polymer, said fibers oriented so that said fiber orientation is essentially non-parallel to said edge of the basestock composite. This is followed by the design lay-out of a conductor pattern in non-aligned relationship to said non-parallel fiber orientation substantially along the entirety of said conductor pattern.
More specifically, in a particularly preferred embodiment, the basestock material is fabricated by first using a prepreg material that positions the weave fibers in non-parallel relationship to the edges thereof, wherein said fibers are preferably oriented at about a 45 degree angle to said edge. A copper conductive layer is then bonded to one or both sides of this prepreg to make a composite material that is suitable for imaging and etching using standard printed wiring board techniques.
After the basestock is formed the circuitry image is transferred and formed using photolithography (coat, image, etch, strip) and the layer is the preferably covercoated using an epoxy prepreg, which similar to the basestock, also preferably has the fibers positioned or oriented at a 45 degree angle with respect to the prepreg edge.
Accordingly, the process steps found suitable and most preferred for manufacturing product according to the present invention begins with fabrication of an inner layer(s) using conventional photolithography techniques and can be either single or double planes of copper. For construction consisting of single flex layers, it is preferred not to use a covercoating. For constructions consisting of multiple flex layers, the innerlayer would be covercoated at the layer stage using a prepreg that also has the fibers preferably oriented at a 45 degree angle to the edge thereof.
During final lamination a sheet of prepreg would be used as the covercoat across both the rigid and flexible sections. This prepreg would also have the fibers preferably oriented at a 45 degree angle to the edges thereof instead of the traditional orientation of 90 degrees.
The hardboard innerlayer(s) are also preferably fabricated herein using conventional photolithography techniques. The hardboard layers are those layers that do not traverse across the flexible section by design. Hardboard inner layer(s) can also be either single or double plane of copper. Prior to final lamination, the hardboard layers would be mechanically routed to define the flexible portion by the removal of the material from the intended flex region.
Layers are preferably bonded together in a laminating press where the flexible innerlayer would be sandwiched between hardboard materials to form rigidized and flexible areas. Multiple layers are preferably bonded together using a low flow or no-flow prepreg that has had the material mechanically removed from the intended flexible section allowing those layers to move and flex unencumbered from the other layers.
Following lamination, the substrate is then processed using conventional printed circuit board technology (i.e., drilling, through hole plating, etc.) to create an electrically functional multi-layer circuit board. The protective outer layer is mechanically removed from the flex areas to expose the inner layer's flexible circuitry traces.
The conductive layers of the present invention also preferably comprises about 9 micron to two ounce copper sheet, which is available in the following general form: rolled annealed, high tensile and elongation grade, and electrodeposited. The basestock layer preferably comprises fiberglass sheet impregnated with a thermo set adhesive, such as epoxy, and which is available from Allied Signal Inc.
Those skilled in the art will appreciate that there are several options to the above basic invention. One preferred option is that which is mentioned above where the fibers of both the basestock prepreg and the covercoat prepreg are angled at 45 degrees with respect to the edge thereof. Another preferred option is to only angle the fibers of the covercoat prepreg. Covercoating using fibers that are parallel to the edges thereof has been found to generally fail a single flexing test (see the Institute for Interconnecting and Packaging Electronic Circuits Test Method 650, Number 2.4.3.1 "Flexural Fatigue and Ductility, Flexible Printed Wiring", March 1991. Revision 3). Another preferred option is to fabricate the prepreg using the angled prepreg and then to overcoat the flexible section using a liquid flexible soldermask that is preferably photoimageable.
With reference now to the illustrations, shown at 10 in FIG. 1 is a prepreg positioned in a rigid flex circuit according to the teachings of the prior art. Specifically, prepreg fiber bundles 12 and 14 run generally parallel to edge 16 and fiber bundles 18, 20 and 22 are in parallel relationship with edge 24. In addition, conductive pathways are shown in bold at 26 which conductive pathways are aligned substantially along their length as the case may be with fiber bundles 18, 20 and 22.
Accordingly, when a stress is applied by bending or folding the prepreg 10 along bold axis 28, it has been observed that cracking will occur most prominently along fiber lengths 12 and 14. In other words, bending or folding along axis 28, provokes crack propagation that is generally parallel to the bend stress, and along the fibers 12 and 14 which are aligned in such parallel configuration. That being the case, the conductive pathways also are seen to crack, and for the purpose of illustrating cracking of the conductive pathways in better detail, attention is next directed to FIG. 2, which is a perspective view along line A--A' of FIG. 1.
As can be seen in FIG. 2 the prepreg 10 has on the surface thereof copper traces or pathways 26. At 28 is a line which illustrates the position of mandrel placement. At 12 and 14 the fiber bundles of FIG. 1 are shown in better cross-sectional detail, and at 30 are the fiber bundles which run parallel to the mandrel direction. Accordingly, when the prepreg 10 is placed so that the mandrel is positioned in contact with prepreg 10 along line 28, and flexing upwards and downward about the mandrel is made to occur, cracking is seen most prominently in the fiber bundles at 36 and 38, and the copper traces are also seen to break or deform at corresponding locations 40 and 42, thereby causing discontinuity and associated failure in conductivity.
Turning to FIG. 3, as illustrated therein, the fibers 46 and 48 of the prepreg are positioned in non-parallel relationship with the edges of the prepreg. By configuring the fibers in such non-parallel relationship, when a bend or flex is imposed along axis 50 or 52, it can be appreciated that the stresses which are developed do not generally coincide along any one fiber pathway, and increased flexibility is observed.
Without being bound by any particular theory, it is believed that when the fibers are so uniquely positioned, the fibers no longer serve as a coinciding crack propagation pathway, and therefore, flexibility is enhanced. In addition, it is believed that when the fiber bundles are located at the preferred angle of 45 degrees with respect to the conductive pathways, less bundles are stressed when the conductive pathways are stressed, thereby again providing a possible explanation for the observed increase in flexibility demonstrated herein.
The preferred manufacturing method comprises the preparation of a basestock material by using a prepreg, as shown in FIG. 3, wherein the weave fibers are orientated at the preferred 45 degree angle with respect to the edges thereof. However, in a much broader context, the fibers are to be positioned or oriented with respect to an associated conductive pathway so that said pathway is non-aligned with said fiber, substantially along the entirety of said conductive pathway, which therefore provides flexibility to said pathway as noted above. That being the case, any angle of the fibers which satisfies this flexibility criterion falls within the broad scope of this invention, and includes those angles which simply avoids having the fiber and conductive pathways coincide with one another substantially along their length.
In addition, those skilled in the art will recognized that the important consideration is the positioning or orientation of the conductive pathways relative to the fibers of the prepreg that is important. That being the case, one can arrange for basestock with fibers at the preferred non-aligned orientation to the conductive pathways, or one can cause their lay-out design for the conductive pathways to run in non-aligned orientation with respect to the fibers, to achieve the increased flexibility of this invention.
Attention is next directed to FIG. 4, which illustrates at 54 the present invention in a preferred double sided basestock configuration for a flex layer which contains copper foil at 56 and 58 and the epoxy prepreg basestock at 60 with the fibers oriented at the preferred angle of 45 degrees with respect to the conductive pathways thereon. In addition, angled epoxy prepreg also with fibers at the preferred 45 degree angle are shown at coverlayers 62 and 64.
Illustrated at FIG. 5 is a cross section of a preferred multilayer rigid flex printed circuit of the present invention. Specifically, the flex section of FIG. 4 is shown generally at 66, a low flow epoxy bondfilm is shown at 68, and additional copper foil layers at 70 and 72. At 74 is illustrated the flex section of this multilayer design. As noted above, in this section of the circuit board the copper layer covering the flex area must be removed thereby allowing the flexible section to move and flex unencumbered by the other layers.
Illustrated in FIG. 6 is yet another cross section of a multilayer circuit board in accordance with the present invention. Once again, at 66 is the flex section of FIG. 4, a low flow epoxy prepreg bondfilm at 68,and at 76 is the hardboard laminate outerlayer which spans the flexible layer as shown at 78, which layers, as noted above, are removed from the flex sections identified at 78.
In order to further illustrate the invention herein, a series of tests were conducted and compared to prior art designs. In Table I below. "Flex Endurance Testing" is reported, pursuant to IPC-TM-650 Test No. 2.4.3.1 "Flexural Fatigue and Ductility, Flexible Printed Wiring". This particular test measures the flexural fatigue behavior of the conductor metal pathway for any given bend radius. In this test, the number of cycles-to-failure is reported by continuous cycling of a test coupon (with conductive pathways laminated to a basestock composite) about a mandrel of selected size (i.e. diameter). An increase in the number of cycles to failure indicates greater resistance to flexing and increased conductor ductility:
TABLE I__________________________________________________________________________FLEX ENDURANCE TESTING                      90 Degree                            45 DegreePre-Preg     Copper Type               Mandril Size                      Weave WeaveManufacturer  Thickness        & Weight               & Con. Width                      Pattern                            Pattern__________________________________________________________________________Allied Signal  .003 in. thk        1 oz. H.T.E.               .125" Dia.1080 PP      (superflex)               .025 in. wide                       40 cycles                             154 Cycles               .010 in. wide                      Etch def.                            111 Cycles               .005 in. wide                       72 Cycles                             94 CyclesAllied Signal  .003 in. thk.        1 oz. H.T.E.               .250" Dia.1080 PP      (superflex)               .025 in. wide                      276 Cycles                             457 Cycles               .010 in. wide                      215 Cycles                             153 Cycles               .005 in. wide                      212 Cycles                             256 CyclesAllied Signal  .002 in. thk        1 oz. H.T.E.               .125" Dia.106 PP       (superflex)               .025 in. wide                      177 Cycles                             418 Cycles               .010 in. wide                      180 Cycles                             354 Cycles               .005 in. wide                      113 Cycles                             247 CyclesAllied Signal  .002 in. thk        1 oz. H.T.E.               .125" Dia.106 PP       (superflex)               .025 in. wide                      893 Cycles                            2134 Cycles               .010 in. wide                      586 Cycles                            1598 Cycles               .005 in. wide                      etch defect                             823 CyclesAllied Signal  .002 in. thk        1 oz. ED               .125" Dia.106 PP              .025 in. wide                       45 Cycles                             464 Cycles               .010 in. wide                      139 Cycles                             317 Cycles               .005 in. wide                      113 Cycles                             182 CyclesAllied Signal  .002 in. thk        1 oz. ED               .250" Dia.106 PP              .025 in. wide                      947 Cycles                            3340 Cycles               .010 in. wide                      623 Cycles                            1093 Cycles               .005 in. wide                      437 Cycles                             711 CyclesAllied Signal  .003 in. thk        2 oz. H.T.E.               .125" Dia.1080 PP             .025 in. wide                       10 Cycles                             173 Cycles               .010 in. wide                       58 Cycles                             81 Cycles               .005 in. wide                       33 Cycles                             26 CyclesAllied Signal  .003 in. thk        2 oz. H.T.E.               .250" Dia.                      213 Cycles1080 PP             .025 in. wide                      165 Cycles                            Sheet was               .010 in. wide                      137 Cycles                            damaged               .005 in. wideAllied Signal  .002 in. thk        2 oz. H.T.E.               .125" Dia.106 PP              .025 in. wide                       36 Cycles                             405 Cycles               .010 in. wide                       85 Cycles                             218 Cycles               .005 in. wide                       44 Cycles                             47 CyclesAllied Signal  .002 in. thk        2 oz H.T.E.               .250" Dia.106 PP              .025 in. wide                      595 Cycles                            1164 Cycles               .010 in. wide                      367 Cycles                             710 Cycles               .005 in. wide                      274 Cycles                             240 CyclesAllied Signal  .003 in. thk        2 oz. ED               .125" Dia.1080 PP             .025 in. wide                       6 Cycles                             65 Cycles               .010 in. wide                       19 Cycles                             23 Cycles               .005 in. wide                       16 Cycles                            Sample                      DamagedAllied Signal  .003 in. thk        2 oz ED               .250" Dia.1080 PP             .025 in. wide                       78 Cycles                             295 Cycles               .010 in. wide                       58 Cycles                            Sample               .005 in. wide                       38 Cycles                            DamagedAllied Signal  .002 in. thk        2 oz. ED               .125" Dia.106 PP              .025 in. wide                             199 Cycles               .010 in. wide                             104 Cycles               .005 in. wide                             23 CyclesAllied Signal  .002 in. thk        2 oz. ED               .250" Dia.106 PP              .025 in. wide                      209 Cycles                             682 Cycles               .010 in. wide                      151 Cycles                             319 Cycles               .005 in. wide                       65 Cycles                             63 Cycles__________________________________________________________________________ PP = prepreg. H.T.E . = high tensile and elongation E.D. = electrodeposited Two different mandrel sizes are noted, 0.125 and 0.250 inch diameter. All tests were run on a Universal Mfg. Co. Ductility Flex Tester, and the flex angle achieved is approximately 135 degrees. Conductor width is the width of the conductive pathways on a singlesided test coupon. No covercoats were employed for this data.
As can be seen from the above, a significant improvement in flexural characteristics are observed when the weave pattern is oriented at the preferred 45 degrees (conductive pathways non-aligned with the fibers of the prepreg) as opposed to the prior art 90 degree configuration (conductive pathway aligned with the fibers of the prepreg). That is, the number of cycles to failure increases in rather dramatic fashion.
A second set of samples were manufactured, and these were double sided circuits. However, in these samples, the effect of a covercoat was also considered. That is, the covercoat was positioned so that the fibers of the covercoat were either at the preferred angle of 45 decrees (non-aligned relationship to conductive pathways) or at a 90 degree or aligned relationship therewith. Furthermore, in this second set of samples, the test performed was "flex to install" which is a harsher test than the flex testing shown in Table I. That is, in "flex to install" the samples are subjected to a full 180 degree bend in two directions, using different mandrel sizes starting with 0.125 inches through 0.250 inches. Listed below are the results of this testing:
TABLE II__________________________________________________________________________FLEX TO INSTALL TESTINGMfg., Copper    .250" Dia. Mandril              .187" Dia. Mandril                        .125" Dia. MandrilGlass & Direction    .025 in. wide cond.              .025 in. wide cond.                        .025 in. wide cond.__________________________________________________________________________Allied Signal,    0 Cycles  Not Applicable                        Not Applicable1 oz. RA, 1080PP    Sample fractured90 Base & 90 C/C    during 1st bendAllied Signal,    26 Cycles 6 cycles to Failure -                        Not Applicable1 oz. RA, 1080PP    No Failure - PP show              PP show signs of90 Base & 45 C/C    signs of stress.              stress after 2 Cycles.Allied Signal,    0 Cycles  Not Applicable                        Not Applicable1 oz. RA, 1080PP    Sample fractured45 Base & 90 C/C    during 1st bendAllied Signal,    26 Cycles 15 Cycles to Failure1 oz. RA, 1080PP    No Failure - PP show              PP show signs of                        Not Applicable45 base & 45 C/C    signs of stress              stress after 5 Cycles.Allied Signal,    26 Cycles, No failure              4 Cycles to Failure                        Not Applicable1 oz RA, 1 06 PP    Stress cracks after 15              Stress cracks after 290 Base & 90 C/C    Cycles.   CyclesAllied Signal,    26 Cycles 26 Cycles 26 Cycles1 oz. RA, 106 PP    No Failure              No Failure                        No Failure90 Base & 45 C/C    Sample Clean              Sample Clean                        Stress cracks appearAllied Signal,    26 cycles 26 Cycles - No failure                        Not applicable1 oz. RA, 106 PP    No Failure              Stress cracks after 545 Base & 90 C/C    Sample Clean              CyclesAllied Signal,    26 Cycles 26 Cycles 26 Cycles1 oz. RA, 106 PP    No Failure              No Failure                        No Failure45 Base & 45 C/C             Stress cracks appear__________________________________________________________________________ RA = rolled annealed C/C = covercoat PP = prepreg
As can be seen from Table II, the prior art design of a 90 degree basestock and 90 degree covercoat on a 1 oz. rolled annealed copper foil, in the case of a 0.25 inch diameter mandrel, indicated sample fracture on the very first bend. When the covercoat fibers are then positioned at 45 degrees (i.e., in non-aligned relationship with the conductive pathways) the sample proceeds through 26 cycles without failure.
Finally, in Table III below, yet another set of double sided basestock (90 and 45 degrees) was manufactured from the Allied Signal 106 and 1080 prepreg. This time, however, a Kapton®/Acrylic was used at the covercoat instead of prepreg. The results of this test on both flex endurance and flex to install on a 0.125 inch mandrel appear below in Table III:
TABLE III__________________________________________________________________________        Flex to Install                     Flex EnduranceMfg.         Conductor Width - C.T.F.                     Conductor Width - C.T.F.__________________________________________________________________________Allied Signal 1080 PP @90        .025 in. wide 78 Cycles                     .025 in. wide 229 Cycles1 oz RA, double sided        .010 in. wide 71 Cycles                     .010 in. wide 248 CyclesRogers 110 C/C        .005 in. wide Etch defect                     .005 in. wide 194 CyclesAllied Signal 1080 PP @45        .025 in. wide 179 Cycles                     .025 in. wide 337 Cycles1 oz. RA, double sided        .010 in. wide 158 Cycles                     .010 in. wide 280 CyclesRogers 110 C/C        .005 in. wide 165 Cycles                     .005 in. wide 263 CyclesAllied Signal 106 PP @90        .025 in. wide 281 Cycles                     .025 in. wide 443 Cycles1 oz. RA, double sided        .010 in. wide 285 Cycles                     .010 in. wide 499 CyclesRogers 110 C/C        .005 in. wide 278 Cycles                     .005 in. wide 403 CyclesAllied Signal 106 PP @45        .025 in. wide 330 Cycles                     .025 in. wide 576 Cycles1 oz. RA, double sided        .010 in. wide 358 Cycles                     .010 in. wide 459 CyclesRogers 110 C/C        .005 in. wide etch defect                     .005 in. wide etch defect__________________________________________________________________________ CTF = cycles to failure Rogers 110 C/C = Kapton ® polymer covercoat available from Rogers Corporation
As can be seen from Table III, once again, when the fibers of the basestock prepreg are positioned in generally aligned or coinciding relationship with the conductive pathways, the number of cycles to failure in either the flex to install or flexural endurance test is at a minimum. By comparison, when the fibers of the basestock prepreg are positioned in substantially non-aligned relationship with the conductive pathways (the preferred angle of 45 degrees as shown in FIG. 3) a rather dramatic increase in the number of cycles to failure in either test is observed.
In addition, and with reference again to Table III, it will also be appreciated to those skilled in the art that in lieu of the polyimde or Kapton® brand covercoat employed in the flex section, a flexible photoimageable solder mask can be employed.
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ROLAND;JEAN, SANDRA L.;KEATING, JAMES E.;AND OTHERS;REEL/FRAME:008586/0304Effective date: 19970529Aug 20, 2002CCCertificate of correctionDec 23, 2002ASAssignmentOwner name: TELEDYNE TECHNOLOGIES INCORPORATED, CALIFORNIAFree format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TELEDYNE INDUSTRIES, INC.;REEL/FRAME:013599/0940Effective date: 19991129Jun 6, 2003FPAYFee paymentYear of fee payment: 4Jun 20, 2007REMIMaintenance fee reminder mailedDec 7, 2007LAPSLapse for failure to pay maintenance feesJan 29, 2008FPExpired due to failure to pay maintenance feeEffective date: 20071207RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services

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Patent US4658424 - Speech synthesis integrated circuit device having variable frame rate capability - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inPatentsAn integrated circuit device or chip digitally synthesizes human speech employing a linear predictive filter and a variable frame rate. The variable frame rate provides a more natural speech by slowing or speeding the frame rate for a particular application used in a system which constructs the speech...http://www.google.com/patents/US4658424?utm_source=gb-gplus-sharePatent US4658424 - Speech synthesis integrated circuit device having variable frame rate capabilityAdvanced Patent SearchTry the new Google Patents, with machine-classified Google Scholar results, and Japanese and South Korean patents.Publication numberUS4658424 APublication typeGrantApplication numberUS 06/240,685Publication dateApr 14, 1987Filing dateMar 5, 1981Priority dateMar 5, 1981Fee statusPaidAlso published asEP0059832A2, EP0059832A3Publication number06240685, 240685, US 4658424 A, US 4658424A, US-A-4658424, US4658424 A, US4658424AInventorsAlva E. HendersonOriginal AssigneeTexas Instruments IncorporatedExport CitationBiBTeX, EndNote, RefManPatent Citations (2), Non-Patent Citations (4), Referenced by (9), Classifications (8), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetSpeech synthesis integrated circuit device having variable frame rate capability
US 4658424 AAbstract
1. A speech synthesis system comprising:speech synthesizer means for receiving frames of digital speech data comprising binary representations of speech parameter data including pitch data, energy data and reflection coefficient data and converting said frames of digital speech data into analog signals representative of human speech; audio means coupled to said speech synthesizer means for converting said analog signals representative of human speech into audible synthesized human speech; means for varying the time interval during which respective frames of digital speech data are converted by said speech synthesizer means into analog signals representative of human speech, said frame rate-varying means comprising external control signal means for furnishing one of a plurality of possible control signals indicative of a corresponding plurality of different speech data frame rates; and circuit means operably coupled to said external control signal means and said speech synthesizer means for receiving said one of said plurality of control signals representative of a particular speech data frame rate from said external control signal means and adjusting the operation of said speech synthesizer means in accordance therewith for establishing the current speech data frame rate of said speech synthesizer means in accordance with said one control signal, said circuit means comprising data input means for receiving control signals from said external control signal means, decode and counter preset circuit means connected to said data input means for decoding the control signals received therefrom, a counter coupled to the output of said decode and counter preset circuit means, said counter being responsive to the decoded value of said control signals to be preset and having a plurality of bits for incrementing after the presetting thereof to provide count signal outputs, programmable logic array means for receiving said count signal outputs from said counter and providing a logic array signal output, and timing decode means connected to the output of said programmable logic array means for decoding the logic array signal output therefrom to generate a timing signal indicative of a selected one of said plurality of possible speech data frame rates utilized by said speech synthesizer means in converting said speech data frame associated with said timing signal into a corresponding analog signal representative of human speech, whereby said audio means produces audible synthesized human speech having an aural quality influenced by the respective frame rates of the speech data frames from which the audibly synthesized human speech is derived. Description
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS2771509 *May 25, 1953Nov 20, 1956Bell Telephone Labor IncSynthesis of speech from code signalsUS4209836 *Apr 28, 1978Jun 24, 1980Texas Instruments IncorporatedSpeech synthesis integrated circuit device* Cited by examinerNon-Patent CitationsReference1Cole et al, "A Real-Time . . . Vocoder", IEEE Conf. Record on Acoustics, etc., 1977, pp. 429-430.2 *Cole et al, A Real Time . . . Vocoder , IEEE Conf. Record on Acoustics, etc., 1977, pp. 429 430.3Viswanathan et al, "The Application of a Functional . . . Systems", IEEE Conf. Record on Acoustics, etc., 1977, pp. 219-222.4 *Viswanathan et al, The Application of a Functional . . . Systems , IEEE Conf. Record on Acoustics, etc., 1977, pp. 219 222.* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS5056143 *Jun 23, 1989Oct 8, 1991Nec CorporationSpeech processing systemUS5299282 *Jan 31, 1992Mar 29, 1994Nec CorporationRandom tone or voice message synthesizer circuitUS5630010 *Sep 29, 1995May 13, 1997Mitsubishi Denki Kabushiki KaishaMethods of efficiently recording an audio signal in semiconductor memoryUS5752221 *Sep 18, 1996May 12, 1998Mitsubishi Denki Kabushiki KaishaMethod of efficiently recording an audio signal in semiconductor memoryUS5774843 *Jun 28, 1996Jun 30, 1998Mitsubishi Denki Kabushiki KaishaMethods of efficiently recording an audio signal in semiconductor memoryUS5784501 *Apr 28, 1994Jul 21, 1998Canon Kabushiki KaishaImage processing method and apparatusUS5864801 *May 15, 1998Jan 26, 1999Mitsubishi Denki Kabushiki KaishaMethods of efficiently recording and reproducing an audio signal in a memory using hierarchical encodingDE4345252B4 *Apr 19, 1993May 27, 2004Mitsubishi Denki K.K.Audio signal recording using semiconductor memoryWO1989003573A1 *Oct 7, 1988Apr 20, 1989Sound Entertainment, Inc.Generating speech from digitally stored coarticulated speech segments* Cited by examinerClassifications U.S. Classification704/262, 704/E13.006International ClassificationG10L13/00, G10L21/04, G10L13/04, G10L11/00Cooperative ClassificationG10L13/047European ClassificationG10L13/047Legal EventsDateCodeEventDescriptionMar 5, 1981ASAssignmentOwner name: TEXAS INSTRUMENTS INCORPORATED, 13500 NORTH CENTRAFree format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:HENDERSON ALVA E.;REEL/FRAME:003870/0105Effective date: 19810220Sep 24, 1990FPAYFee paymentYear of fee payment: 4Sep 22, 1994FPAYFee paymentYear of fee payment: 8Oct 2, 1998FPAYFee paymentYear of fee payment: 12RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services

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Vanity must-haves for men and women | fashion and trends | Hindustan Times
Vanity must-haves for men and women
Apart from the conventional hand sanitiser, wet tissues and shampoo sachets, quick-solution vanity picks make for a smart traveller. Check out our five vital must-haves in your beauty box, for the ladies and for men, when in transit.
fashion and trends Updated: Mar 18, 2014 18:34 IST
If you have lived your life out of a suitcase, you are sure to have an enviable collection of miniature shampoos, soaps and toothbrush kits all packed and ready to take off. But, what makes a smart jet-setter is the ability to be prepared and armed with vanity must-haves when you are in an alien city. Apart from the conventional hand sanitiser, wet tissues and shampoo sachets, quick-solution vanity picks make for a smart traveller. Check out our five vital must-haves in your beauty box, for the ladies and for men, when in transit.
Balm solution: To turn up the confidence, keep a lip balm handy. If you are not comfortable with a lipstick-style applicator, invest in a mild-wax or salve balm, or just petroleum jelly. There are also balms in the market available solely dedicated to men.
Hair styler: A hair clipper or trimmer is an essential staple when travelling, as are the hair products that you essentially use at home. Go easy on wet-look gels and greasy products when handling unpredictable foreign climate.
Concealers: Pimples and dark circles are not only womanly concerns. When away from home, waking up to a bad skin day is a nightmare. Opt for a tried and tested concealer that goes with your skin texture and tone, or even a BB cream.
Lint solution: Do you get hassled as soon as you unpack and find unwanted fuzz stuck to your new jacket? Keep with you an angular make-up brush borrowed from your girlfriend or wife to get rid of lint.
Odour FIX: Carry pocket-sized perfume samplers to smell and feel good when on a trip. Also, remember you can just dab a little bit of the perfume on your pocket square to go that extra suave mile.
Make-up remover: Late night meetings in an alien city, or dancing away on a beach holiday. Whatever the reason might be, a full face of make-up deserves a fresh start after it hits the sack at night. Don’t sleep with you make-up on, and don’t rely on your hotel freebie moisturiser.
Ittar: For your high-flying days, opt for non-synthetic fragrance. Oil-based concoctions add instant freshness. Choose your ittar carefully — while a geranium rose can be overwhelming for certain occasions, saffron or kesar ittar can provide a mild, pretty touch.
Pin-solution: Apart from safety crunchies for travel, keep tic-tacs and bobby pins handy, not only for flyways, but because of their utility factor. From cinching a too-loose shirt with the pin to using the glittery versions as collar tips.
Beauty Quickies: Go from sleepyhead-on-the-plane to ready-to-take-over-the-world by being armed with three easy revamp essentials: BB cream, champagne eyeshadow and your favourite shade of red lipstick.
Dry shampoo: When you rush for a heady breakfast by the sea or an unplanned meeting, carry with you a dry shampoo. The usually powder-based product helps combat greasy hair.

value: This website is an Indian English-language daily newspaper introduced and founded in 1924 by Sunder Singh Lyallpuri, founder-father of the Akali movement and the Shiromani Akali Dal in the Punjab Province. It played integral roles in the Indian independence movement as a nationalist daily.


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LIFE INSURANCE UNDERWRITER GEORGE W. GRAVES JR. DIES - The Washington Post
LIFE INSURANCE UNDERWRITER GEORGE W. GRAVES JR. DIES
George W. Graves Jr., 62, a general agent for The New England, a life insurance company, and a partner in the Bethesda-based Graves Financial Group, died Sept. 29 at Suburban Hospital after a heart attack.
Mr. Graves had been in the insurance business in the Washington area since graduating from Georgetown University in 1949. He began with what then was New England Life Insurance Co., and he had been general agent since 1966. At the time of his death he was in a business partnership with a son, Robert A. Graves.
A resident of Bethesda, Mr. Graves was born in Washington, graduated from the old Western High School and served in the Army during World War II. He had a chartered life underwriter's degree from American College in Bryn Mawr, Pa.
He was a past president of the D.C. Life Underwriters Association, the Greater Washington General Agents and Managers Association and the Greater Washington chapter of Chartered Life Underwriters. He was a regional vice president of the American Society of Chartered Life Underwriters.
In 1971, Mr. Graves received the Bernard L. Wilner Award of the D.C. Life Underwriters Association for outstanding service to the life insurance industry. In 1967, 1971 and 1986 his company had received a President's Trophy from The New England for outstanding sales.
Mr. Graves was a member of Kenwood Golf and Country Club and a tennis enthusiast. He was a former baseball coach for the Bethesda Boys Club.
Survivors include his wife, Ruth E. Graves of Bethesda; three daughters, Barbara E. Graves of Los Angeles, Margaret G. Laniak of Germantown and Elizabeth G. Langlie of Kensington; two sons, Robert A. Graves of Potomac and George W. Graves III of Rockville, and eight grandchildren.
VIRGINIA HENRY SNOWDEN,
80, a retired teacher and principal with the Montgomery County public schools who later worked for Signet Bank, died of cancer Oct. 1 at Sibley Memorial Hospital. She lived in Washington.
Mrs. Snowden was born in Camden, N.J. She graduated from Glassboro State College in New Jersey and earned a master's degree in education at the University of Maryland.
In 1942 she moved to the Washington area and joined the Montgomery County public school system as a teacher. She became an elementary school principal in 1962 and retired in 1976.
In 1980, Mrs. Snowden became a bookkeeping supervisor with Security National Bank, which became part of the Signet Bank system. She retired for health reasons earlier this year.
She was a lay minister at Plymouth United Church of Christ in Washington, where she was active in the Plymouthites Senior Citizens Club.
Her husband, Dr. Lorenzo Snowden, died in 1979. Survivors include two sisters, Nellie Moore of Baltimore and Mable Sorrells of Philadelphia.
ROBERT JOHN BECKELMAN JR.,
52, a Washington native and a retired chief air traffic controller at the Philadelphia International Airport, died of respiratory arrest Sept. 23 at Peninsula General Hospital in Salisbury, Md.
Mr. Beckelman, who lived in Berlin, Md., graduated from Central High School in Suitland and attended Dowling College in New York. From about 1953 to 1957 he served in the Air Force.
In 1958 he joined the Federal Aviation Administration and became an air traffic controller. He was assigned to National Airport in Washington and later to John F. Kennedy International Airport in New York. In 1974, he became chief air traffic controller in Philadelphia. He retired for health reasons in 1981 and moved to Berlin.
Survivors include his wife, Mary N. Beckelman, and a son, Robert J. Beckelman III, both of Berlin; four daughters, Pamela Marquette of Downingtown, Pa., Brenda Robins Gray of Salisbury, Md., and Peggy Lynn Westwood and Mary Kim McCrudden, both of West Chester, Pa.; three brothers, William Beckelman of Los Altos Hills, Calif., Ronald Beckelman of California, and Carroll Beckelman of Roanoke Rapids, N.C.; a half-brother, Frank Martinelli of Carlisle, Pa., and seven grandchildren.
REMBERT GARY ALLEN,
89, a retired Air Force architect who designed housing for servicemen and their families at posts in the United States and Europe, died of pneumonia and heart ailments Sept. 29 at his home in Marco Island, Fla.
Mr. Allen was born in Lowndesville, S.C., and graduated from Clemson University. He also studied architecture at Cornell and received a diploma in architecture at L'Ecole des Beaux Arts at Fontainebleau in France.
Before moving to the Washington area in the mid-1930s, he was an architect in Boca Raton, Fla., and in New York City.
Mr. Allen worked for the Department of the Navy here and during World War II was official photographer for the Navy's Camouflage Workshop, a program to design and develop camouflage for naval ships and stations.
He became an Air Force architect after the war, and from 1952 to 1954 was assigned in Germany to design houses at bases in Europe. He returned here in 1954 and retired in 1968 as senior design architect for family housing at Air Force headquarters.
At retirement he received the Air Force Meritorious Civilian Service Award.
A former resident of McLean, Mr. Allen moved to Marco Island when he retired.
His marriage to the former Dorothy Sigman ended in divorce.
Survivors include his wife, Sylvia Spaulding Allen of Marco Island; a son by his first marriage, R. Gary Allen of Delmar, Calif.; two children by his second marriage, Bannister B. Allen of Greensboro, N.C., and Joy Allen Thornton of Arlington, and a grandchild.
LILLIAN CATHERINE McLAURIN,
72, a former law librarian who worked in the Office of the Judge Advocate General of the Navy, the U.S. Tax Court and the Treasury Department in Washington, died of cancer and pneumonia Sept. 22 in a hospital in Natchez, Miss.
Miss McLaurin was born in Natchez. She graduated from Vanderbilt University where she also took a law degree. She had a degree in library science from George Peabody College for Teachers in Nashville and a master's degree in law from George Washington University.
Before moving to this area during the early years of World War II, Miss McLaurin was a law librarian at Vanderbilt. She served in the WAVES during the war, and she remained in the Naval Reserve afterwards until she retired in 1974 as a lieutenant commander.
In the late 1940s, Miss McLaurin became a civilian law librarian in the office of the Judge Advocate General of the Navy. Later she worked at the U.S. Tax Court. She retired from the Treasury Department and returned to Natchez in 1973.
Miss McLaurin was a former resident of Washington and a Sunday school teacher at the New York Avenue Presbyterian Church.
Survivors include her mother, Leone Rauch McLaurin of Natchez.
74, a retired sales representative who sold data processing equipment for the Friden Business Machines company, now part of the Singer company, died Sept. 25 at Arlington Hospital. He had heart and lung ailments.
Mr. Kelly, a resident of Arlington, was born in Butte, Mont., and he attended the University of Montana. He moved to Washington in the 1930s and received a law degree from Columbus University.
During World War II he served in the Navy in the Pacific and he was recalled to active duty from the Reserves in the Korean war.
In the early 1950s Mr. Kelly went to work for the old Atomic Energy Commission. About 1960, he joined the Friden company. He retired in 1973.
He was a member of the Veterans of Foreign Wars, the American Legion and St. Agnes Catholic Church in Arlington.
His marriage to the former Mary A. MacDonald ended in divorce.
Survivors include a daughter, Dorothy Ann Kowaliw of Mathews, Va.; two brothers, Terrence and Coley Kelly, and a sister, Mary Shields, all of Butte, and a grandchild.
RICHARD MERLE HARBECK,
64, a retired research associate at the U.S. Office of Education and its National Institute of Education, died of cancer Sept. 25 at Montgomery General Hospital in Olney.
Mr. Harbeck, who lived in Silver Spring, was born in Olean, N.Y. During World War II he was a radio operator in the old Army Air Forces. While serving in the crew of a B-17 heavy bomber in the 8th Air Force in Britain, he was shot down over occupied Europe. He spent two years as a prisoner of war of the Germans.
After the war he graduated from Heidelberg College in Tiffin, Ohio, and earned a master's degree in mathematics at Bowling Green State University in Bowling Green, Ohio.
Mr. Harbeck was a school principal in Ohio and Michigan before moving to the Washington area in 1959 to work for the Office of Education. He later transferred to the National Institute of Education, and he retired in 1977 for reasons of health.
He was a fellow of the American Association for the Advancement of Science and a member of the National Science Teachers Association and the Silver Spring Presbyterian Church.
His first wife, the former Betty Rittenhouse, died in 1964.
Survivors include his wife, Mary B. Harbeck of Silver Spring; two children by his first marriage, Susan H. Cohen of Clarksville, Va., and Katherine Bibber of Batavia, Ill.; a stepdaughter, Marjorie Kolb of Rockville; two sisters, Janet Cornell of Buffalo and Florence Bartlett of Phoenix; a brother, Warren Harbeck of Edmonton, Alberta, and six grandchildren.
HOWARD J. KOPP,
87, a former Washington area resident and a retired machinist with the physics department at the University of Maryland, died Sept. 17 at a nursing home in Dallastown, Pa. He had leukemia.
Mr. Kopp was born in Hanover Junction, Pa. He worked as a machinist in Pennsylvania before moving to the Washington area in 1934 and joining the Washington Navy Yard, where he worked in the fuse factory.
He transferred to the Naval Ordnance Center in Silver Spring in about 1945 and went to work for the University of Maryland in the early 1950s. He retired in 1970 and lived in Florida and York, Pa., before moving to Dallastown in 1985.
Mr. Kopp was a member of Lodge 174 of the Grand Lodge International of the Association of Machinists and Aerospace Workers.
Survivors include his wife, Dora Warner Kopp of Dallastown; a son, the Rev. Lamar W. Kopp of Washington; three grandchildren, and a great-granddaughter.
LAWRENCE C. MERTHAN,
69, a lawyer who was a government relations counselor here for the Hill and Knowlton public relations firm, died of cancer Sept. 30 at his home in Washington.
Mr. Merthan had worked in Washington for the last 28 years, beginning in 1959 with his service on the legislative staff of former Sen. Eugene McCarthy (D-Minn.).
From 1965 to 1968 he was director of governmental relations here for Pfizer Inc., the pharmaceutical company. In 1968, he joined Hill and Knowlton as senior vice president and administrative officer in the firm's Washington office.
In 1974 Mr. Merthan was named executive vice president of the Carpet & Rug Institute in Washington. In 1978 he entered a private law practice here. Most recently he was with the firm of Zuckert, Scoutt, Rasenberger & Johnson. He rejoined Hill and Knowlton earlier this year.
Mr. Merthan was born in St. Paul, Minn., and he graduated from the College of St. Thomas there. He served in the old Army Air Forces during World War II and received a law degree from the University of Minnesota. He practiced law in St. Paul. In 1958 and 1959, he was in Germany as a member of the U.S. Education Commission.
His first wife, the former Rita Chapowicki, died in 1981.
Survivors include his wife, Claudia Boettcher Merthan of Washington; a daughter by his first marriage, Mary Elizabeth Merthan of Washington; two stepsons, E. Thurn Hoffman of New York City and Charles B. Hoffman of Eureka, S.D., and a brother, John Merthan, and a sister, Mary Elizabeth Burton, both of St. Paul.
THE REV. WILLIAM A. EMMANS,
85, a retired pastor of the First Baptist Church of New Carrollton, died of congestive heart failure Sept. 28 at a hospital in Pinellas Park, Fla. He moved to Redington Beach, Fla., in 1975.
Mr. Emmans was born in Paterson, N.J. He graduated from the Moody Bible Institute in Illinois and the Southern Baptist Seminary in Louisville, Ky.
He moved to the Washington area in 1928 and became the pastor of Maryland Avenue Baptist Church in Washington. When the church moved to New Carrollton in 1963, its name was changed to First Baptist Church. He remained pastor until he retired in 1973.
In the 1950s, Mr. Emmans taught at the Washington Bible College. He also was the founder and a past director of Camp Wabanna, a summer youth camp in Mayo, Md.
Survivors include his wife, Viola Emmans of Redington Beach; a son, Robert C. Emmans of Glenn Dale; a daughter, Mary Ryman of Mitchellville, and two grandchildren.

value: This website is an American daily newspaper published in Washington, D.C. It is the most-widely circulated newspaper within the Washington metropolitan area, and has a large national audience. Daily broadsheet editions are printed for D.C., Maryland, and Virginia.


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#29 of 724 Restaurants in Naples}
371 - 380 of 944 reviews
Whilst in Naples we've been working our way through some of the top restaurants on the Tripadvisor list (it's a safe and lazy way of making sure we get some nice meals). So far Chops is our favourite. We were served by a nice guy...More
2 Thank KandC_Crowthorne_UK
Culinary_Concepts, Public Relations Manager at Chops City Grill, responded to this reviewResponded June 15, 2015
Dear KandC_Crowthorne_UK, We’re really excited to hear that Naples is your favorite restaurant on your latest trip to Naples, Florida! That’s exactly what we strive to offer – awesome food, impeccable service, and great drinks! We love that you got a good feel for our...More
Best steak in Naples, by far
Steaks are pricey but well worth it. Probably one of the better steaks I have had in quite a while. You can expect to drop a pretty penny but the service is first rate, the food is very good and the atmosphere bustling and fun....More
Dear TOWestonCT, Thank you so much for coming in to dine with us at Chops! We love that you see the value in what we do. It takes many hands, a lot of time and high quality ingredients to serve the caliber of food that...More
Chops never disappoints the most excellent steaks and the side dishes are to kill for anyone of them. Super Caesar salad and great wine list. Dessert? We couldnt tell you we are always too full! Expect to spend $100 per person if you have a...More
Culinary_Concepts, Public Relations Manager at Chops City Grill, responded to this reviewResponded June 4, 2015
Dear Richard M, Thank you so much for your rave review! We’re so excited you had a fantastic time with us at Chops! We’re all about “Creating Incredible Memories… One Bite At A Time!” It’s actually our company motto! Consistency is king at Chops and...More
Superb choice for several couples or on your own
We joined several couples here for dinner & loved every aspect of this restaurant, including: wonderfully creative & tasty appetizers & meals; superb service; lively environment; & it is centrally located to all the shopping if that is on the plan. You can't go wrong...More
1 Thank Rickrichardson2568
Dear Rickricharson2568, We’re ecstatic you had such an amazing dinner with us at Chops! We pride ourselves on having a very innovative menu where every dish is a work of art on your plate, but also delivers incredible flavor. It takes a lot of planning,...More
We come here every year during spring break for our date nite! Food is always great and the service can not be beat. We split the tuna chop for an appetizer - awesome! Wife had a steak and I had the seared tuna. Both meals...More
1 Thank talton9
Dear Talton9, We’re thrilled to hear you always have a fantastic time with us at Chops! We work hard to make sure the entire experience at Chops, from the moment you’re greeted to the last bite of dessert, is exceptional. Our whole team is really...More
If we have visitors from out of town and want a great meal without questions then Chops in Naples or Bonita are the 'go to' places.More
Dear SkiptheBurgermaven, Thank you so much for coming into to dine with us! We’re thrilled to hear both our locations are your go to restaurants when you’re out for a night on the town for a great meal. Our team really delivers the full package...More
Solid steakhouse with inventive apps and sides.
Loved the tuna chop, the crab/lobster short stack appetizer, and the squash cooked in brown sugar and almonds! Stick to steak for the main dish though as the pork was overcooked.More
Dear Weloveziti, Thank you so much for coming in to dine with us! We’re thrilled you loved our food, but we’re upset to hear that your pork was overcooked. By any chance did you notify your server or make the manager aware of the issue?...More
We are regular visitors to Naples and have introduced many of our friends and family to Chops. I have tried many steak restaurants in Naples but for us Chops is the best. Rib eye on the bone is outstanding, can never finish the steak due...More
Dear Karen B., Thank you so much for your kind words and taking the time to write a review! We’re thrilled we’re you’re absolute favorite steakhouse in Naples and that our Prime grills always give you that “wow” factor when it comes to flavor. It...More
Our server, Jody
We went to Chop's City Grille 3 times in the past month and a half. Twice we had Jody for our server. She is very professional and personable and made our dining experience even better. The food at Chop's has always been good and we...More
Dear Deb H, Thank you so much for coming in regularly to dine with us at Chops! It’s our motto to create “Incredible Memories… One Bite At A Time!” We’re thrilled that’s the case for you! We like to say we’re the total package –...More
tinajj1111
amazing waiter and pretty good food
I think the wait staff makes a restaurant. I had a great waiter(George), right on with everything from drinks to food to making you feel special!!! A special thanks to you George..More
Thank tinajj1111
Culinary_Concepts, Public Relations Manager at Chops City Grill, responded to this reviewResponded May 7, 2015
Dear Tinajj1111, Thank you so much for coming in to dine at Chops! We love to hear from our customers and are so pleased George really made your visit with us that much more memorable. We love serving exquisite food, that’s pleasing for your eye...More

value: This website is an American online travel company that operates a website and mobile app with user-generated content and a comparison shopping website.


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Revision as of 21:58, 9 November 2011 by Joycebevans (talk | contribs)
Retrieved from "https://familysearch.org/wiki/en/index.php?title=Maine_Church_Records&oldid=803034"	Category: MaineHidden categories: All articles with unsourced statementsAll pages needing cleanup	Navigation menu

value: This website is a nonprofit organization and website offering genealogical records, education, and software. It is operated by The Church of Jesus Christ of Latter-day Saints , and is closely connected with the church's Family History Department.


text: _.zk=function(){this.R=[];this.H=[]};_.Tia=function(a){_.Gb(a.R)&&(a.R=a.H,a.R.reverse(),a.H=[])};_.Dk=function(a){_.Tia(a);return a.R.pop()};_.h=_.zk.prototype;_.h.Ee=function(){return this.R.length+this.H.length};_.h.Ed=function(){return _.Gb(this.R)&&_.Gb(this.H)};_.h.clear=function(){this.R=[];this.H=[]};_.h.contains=function(a){return _.Fb(this.R,a)||_.Fb(this.H,a)};_.h.remove=function(a){var b=this.R;var c=(0,_.vb)(b,a);0<=c?(_.Ib(b,c),b=!0):b=!1;return b||_.Jb(this.H,a)}; _.h.Id=function(){for(var a=[],b=this.R.length-1;0<=b;--b)a.push(this.R[b]);for(var c=this.H.length,b=0;bKel Fragata - Google+Press question mark to see available shortcut keysHomeCollectionsJoin Google+Send FeedbackHelpRegionPrivacy Policy - Terms of Service - Maps Terms©2017 GoogleSearchSign inAboutSearchSign inKel Fragata13 followers - Laid back family man that is always willing to help.Laid back family man that is always willing to help.13 followersAboutKel's posts Post has attachmentKel FragataPublicApr 1, 2015Play, Watch, and Browse in Style With This Superior Android Tabletdeals.androidauthority.com one plus one 1 no comments no shares Post has attachmentKel FragataPublicMar 5, 2015Play, Watch, and Browse in Style With This Superior Android Tabletdeals.androidauthority.com no plus ones no comments no shares Post has attachmentKel FragataPublicFeb 12, 2015Galaxy S6 vs. LG G Flex 2 vs. HTC One M9....Fate Rests In Your Handsdeals.androidauthority.com one plus one 1 no comments no shares Post has attachmentKel FragataPublicJan 30, 2015You Can Save Meplay.google.com one plus one 1 no comments no shares Post has attachmentKel FragataPublicDec 27, 2014Check out this Android characterandroidify.com no plus ones no comments no shares Post has shared contentKel FragataPublicMay 27, 2014Thank you for the chance to win an LG G3. Would be sweet to win it. Originally shared by Android CentralLeave up to THREE comments on this article for THREE chances to win an LG G3! In honor of LG's announcement of the LG G3, we're giving one lucky Android Central member the chance to get their hands on this BIG-screened phone as soon as it hits the market. If you're not up to speed, be sure to...Win an LG G3 from Android Central!!!androidcentral.com no plus ones no comments no shares Kel FragataPublicMay 15, 2014I feel cheated that it's not open to all states but still for a good cause. National Multiple Sclerosis Society Ford4MS Mustang Raffle￼WIN a One-of-a-Kind 2015 Ford Mustang 50 Years Convertible!*Tickets are $20 each.Drawing date: Saturday, August 16, 20145:00 pm - 5:30 pm at the Woodward Dream Cruise, Mustang AlleyNine Mile Rd. & Woodward Ave., Ferndale, MIWinner need not be present to winRaffle License #R24664http://ford4ms.com*Residents of the following states are prohibited from purchasing raffle tickets: Alabama, Arkansas, Florida, Hawaii, Idaho, Kansas, Utah.Raffle ticket sales are also prohibited in the Commonwealth of Puerto Rico.†If you are requesting tickets from a country other than those available, please selet "Other" from the drop down list.  no plus ones no comments no shares Post has attachmentKel FragataPublicFeb 23, 2014Thirty Seconds To Mars - End Of All Days (VEVO Presents)Download the new album LOVE LUST FAITH + DREAMS on iTunes: http://smarturl.it/LLFD Music video by Thirty Seconds To Mars performing End Of All Days (VEVO Pre...youtube.com no plus ones no comments no shares Post has attachmentKel FragataPublicFeb 15, 2014Dad Life (Father's Day Opening 2010)Buy the Dad Life MP3 on iTunes! http://itunes.apple.com/us/album/dad-life-single/id393406710 http://churchonthemove.com http://twitter.com/cotmtulsa Producer...youtube.com no plus ones no comments no shares Post has shared contentKel FragataPublicDec 13, 2013Originally shared by Abby A.G+ stratosphere, this is one of those rare times where someone - a family, a community of friends and loved ones - needs your help.A sister of mine is missing HER sister, Teleka Patrick; Teleka's been missing for over one week and was last seen in the Kalamazoo, MI area where she works. If you know ANYTHING, or have seen her, please call Indiana State Police at 219-696-6242 ASAP. #findteleka : thanks, everyone. no plus ones no comments no sharesLooks like you've reached the endLooks like you've reached the endUnable to load more. RetryWait while more posts are being loaded

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Patent US5572383 - Magnetic floppy disc drive receiving two discs having different sizes - Google PatentsSearch Images Maps Play YouTube News Gmail Drive More »Sign inAdvanced Patent SearchPatentsA disc drive device includes a base, a rotary member rotatably supported on the base and a first chucking mechanism for holding a first kind of disc-shaped recording medium while coinciding a rotational center of the first kind of recording medium with a rotational center of the rotary member. The first...http://www.google.com/patents/US5572383?utm_source=gb-gplus-sharePatent US5572383 - Magnetic floppy disc drive receiving two discs having different sizesAdvanced Patent SearchPublication numberUS5572383 APublication typeGrantApplication numberUS 08/247,116Publication dateNov 5, 1996Filing dateMay 20, 1994Priority dateDec 10, 1991Fee statusLapsedPublication number08247116, 247116, US 5572383 A, US 5572383A, US-A-5572383, US5572383 A, US5572383AInventorsAkio Hoshi, Toru Wakazawa, Nobuhiro AizawaOriginal AssigneeCanon Denshi Kabushiki KaishaExport CitationBiBTeX, EndNote, RefManPatent Citations (10), Referenced by (9), Classifications (21), Legal Events (4) External Links: USPTO, USPTO Assignment, EspacenetMagnetic floppy disc drive receiving two discs having different sizesUS 5572383 AAbstract A disc drive device includes a base, a rotary member rotatably supported on the base and a first chucking mechanism for holding a first kind of disc-shaped recording medium while coinciding a rotational center of the first kind of recording medium with a rotational center of the rotary member. The first chucking mechanism is arranged at one end of the rotary member. A second chucking mechanism holds a second kind of disc-shaped recording medium different from the first kind of recording medium with respect to size or disc formatting while coinciding a rotational center of the second kind of recording medium with a rotational center of the rotary member. The second chucking mechanism is arranged at the other end of the rotary member. A driving mechanism is mounted on the base for driving the rotary member.
What is claimed is: 1. A disc drive device having a front panel formed with a first slit and a second slit, comprising:a base; a first rotary member and a second rotary member each rotatably supported on said base, a first chucking mechanism for holding a first kind of disc-shaped recording medium while coinciding a rotational center of said first kind of recording medium with a rotational center of said first rotary member, said first chucking mechanism being arranged at one end of said first rotary member; a second chucking mechanism for holding another second kind of disc-shaped recording medium having a larger diameter and disc formatting different from that of the first kind of recording medium while coinciding a rotational center of the second kind of recording medium with a rotational center of said second rotary member, said second chucking mechanism being arranged at one end of said second rotary member; single driving motor for driving said first rotary member and said second rotary member; and said first rotary member and said second rotary member being spaced away from each other by a first distance substantially equal to a half of a difference in diameter between the first kind of recording medium and second kind of recording medium so that a second distance between said first kind of recording medium and the first slit of said front panel is substantially equal to a third distance between said second kind of recording medium and the second slit of said front panel. 2. The disc drive device as claimed in claim 1, wherein said single drive motor is provided with a single driving power supply source for directly or indirectly driving either of said first rotary member and said second rotary member and rotation transmitting means for transmitting rotation of one of said rotary members to the other one of the same.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS Now, the present invention will be described in detail hereinafter with reference to the accompanying drawings which illustrate preferred embodiments of the present invention.
Patent CitationsCited PatentFiling datePublication dateApplicantTitleUS999097 *Mar 23, 1909Jul 25, 1911Maurice CouadeArrangement for continuous phonograph renderings.US2335661 *Aug 16, 1940Nov 30, 1943Wilcox Gay CorpDouble turntableUS2908541 *Sep 19, 1955Oct 13, 1959Litton Industries IncMagnetic recording apparatusUS4339778 *Apr 11, 1980Jul 13, 1982Atari, Inc.Dual floppy disc machineUS4383283 *Sep 29, 1980May 10, 1983Digital Equipment Corp.Dual mini-disk driveUS4755978 *Feb 10, 1987Jul 5, 1988Sony CorporationDisc playerUS4773036 *Jul 13, 1984Sep 20, 1988Ibm CorporationDiskette drive and media type determinationUS4984149 *Mar 28, 1988Jan 8, 1991Kabushiki Kaisha ToshibaMemory access control apparatusJPH01150271A * Title not availableJPS58211376A * Title not available* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS6078482 *Oct 16, 1998Jun 20, 2000Imation Corp.Data storage cartridge with releasable shutter assemblyUS6094324 *Dec 30, 1998Jul 25, 2000Mitsumi Electric Co., Ltd.Disk drive with chassis opening for receiving disk mounting portion of motor drive coneUS6111726 *Apr 28, 1998Aug 29, 2000Imation Corp.Data storage cartridge with rotary shutterUS6490242Apr 28, 1998Dec 3, 2002Brian T. BonnDisk cartridge with dual housing structureUS6791936 *Aug 31, 2001Sep 14, 2004Koninklijke Philips Electronics N.V.Apparatus for playing storage discsUS8321884 *Mar 24, 2009Nov 27, 2012Nhk Spring Co., Ltd.Clamp for disk rotation driving device and method of manufacturing clampUS8522588Mar 2, 2012Sep 3, 2013Nhk Spring Co., Ltd.Clamp for disk rotation driving device and method of manufacturing clampUS20110093874 *Mar 24, 2009Apr 21, 2011Nhk Spring Co., Ltd.Clamp for disk rotation driving device and method of manufacturing clampWO2004013844A2 *Jul 8, 2003Feb 12, 2004Hendrik J GoossensDisc drive apparatus* Cited by examinerClassifications U.S. Classification360/99.05, 360/99.12, 360/99.04, G9B/25.003, G9B/17.006, G9B/5.024, 360/98.08, 360/98.07, 360/99.18International ClassificationG11B5/012, G11B17/028, G11B25/04, G11B17/04Cooperative ClassificationG11B25/043, G11B5/012, G11B17/043, G11B17/028European ClassificationG11B17/028, G11B25/04R, G11B5/012, G11B17/043Legal EventsDateCodeEventDescriptionJan 4, 2005FPExpired due to failure to pay maintenance feeEffective date: 20041105Nov 5, 2004LAPSLapse for failure to pay maintenance feesMay 26, 2004REMIMaintenance fee reminder mailedMay 3, 2000FPAYFee paymentYear of fee payment: 4RotateOriginal ImageGoogle Home - Sitemap - USPTO Bulk Downloads - Privacy Policy - Terms of Service - About Google Patents - Send FeedbackData provided by IFI CLAIMS Patent Services©2012 Google