TSMC Ramps Up CoWoS Expansion Efforts: Production Capacity to Double from 35,000 to 70,000 by End of Next Year
• TSMC is going all-in to establish advanced packaging lines at four locations: Zhunan, Zhubei, Taichung, and Tainan.
• Progress at Each Site:
• Zhunan AP6B Fab: Received operating permit on December 3.
• Zhubei Fab: Construction began in May this year, with structural work now complete.
• Taichung AP5B Fab: Scheduled to start operations in the first half of next year.
• Tainan Innolux Plant 4 (Internal Codename: AP8): Planned to begin small-scale mass production by the end of 2025.
• TSMC’s monthly CoWoS production capacity for this year stands at 35,000 wafers (accounting for 7-9% of total revenue). By the end of 2025, this capacity is expected to increase to 70,000 wafers, with the revenue share rising into the 10% range.
• TSMC aims for a 50% compound annual growth rate (CAGR) in CoWoS production capacity from 2022 to 2026 and plans to continue expanding CoWoS capacity through 2026.