The panel is eventually broken apart into individual PCBs; this is called depaneling. Separating the individual PCBs is frequently aided by drilling or routing perforations along the boundaries of the individual circuits, much like a sheet of postage stamps. Another method, which takes less space, is to cut V-shaped grooves across the full dimension of the panel. The individual PCBs can then be broken apart along this line of weakness. Today depaneling is often done by lasers which cut the board with no contact. Laser panelization reduces stress on the fragile circuits.
What is the process called whereby the individual PCBs are separated? What boundaries would you follow to separate PCBs on a panel? What technology has made depaneling possible without needing to physically interact with the board? What does the V-shaped groove method save? What delicate component is less likely to be damaged if laser depanelization is used?