text: #include "configs17To21_June2018.hh"
  
  void defineConfigs17To21_June2018(std::vector<std::pair<std::string, G4double> > &dz_map, G4double &viewpoint) {
  	viewpoint = 1.8 * m;
  
  	dz_map.push_back(std::make_pair("DWC", 0.0 * m));
  	dz_map.push_back(std::make_pair("DWC", 2.0 * m));
  	dz_map.push_back(std::make_pair("DWC", 0.3 * m));
  	dz_map.push_back(std::make_pair("Scintillator", 1.5 * m));
  	dz_map.push_back(std::make_pair("DWC", 0.3 * m));
  	dz_map.push_back(std::make_pair("DWC", 13. * m));
  	dz_map.push_back(std::make_pair("DWC", 2. * m));
  
  	dz_map.push_back(std::make_pair("Scintillator", 0.3 * m));
  	dz_map.push_back(std::make_pair("Scintillator", 2.0 * m));
  
  	dz_map.push_back(std::make_pair("Al_case", 8. * cm));
  
  	//EE1
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 12 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.3 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	dz_map.push_back(std::make_pair("Al_case", 0.6 * cm));
  
  	//EE2
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 0.5 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE3
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.1 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE4
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.2 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE5
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.2 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE6
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.2 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE7
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.0 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE8
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.0 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE9
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.0 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE10
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.0 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE11
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.0 * cm));
  	dz_map.push_back(std::make_pair("PCB", 1.0 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE12
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.4 * cm));
  	dz_map.push_back(std::make_pair("PCB", 1.0 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE13
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.4 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	//EE14
  	dz_map.push_back(std::make_pair("Pb_absorber_EE", 1.4 * cm));
  	dz_map.push_back(std::make_pair("PCB", 0.7 * cm));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Cu_absorber_EE", 0.));
  	dz_map.push_back(std::make_pair("CuW_baseplate", 0.));
  	dz_map.push_back(std::make_pair("Kapton_layer", 0.));
  	dz_map.push_back(std::make_pair("Si_wafer", 0.));
  	dz_map.push_back(std::make_pair("PCB", 0));
  
  	dz_map.push_back(std::make_pair("Al_case", 8.4 * cm));
  
  
  }