<|im_start|>system
You are a helpful AI assistant.<|im_end|>
<|im_start|>user
When routing high speed traces (5GHz+) on a PCB, what are the best practices to mitigate unwanted noise and improve signal integrity? Please list these in order from most beneficial to least.<|im_end|>
<|im_start|>assistant
1. Increase trace widths to reduce electrical resistance and inductance.
2. Space traces apart to reduce crosstalk.
3. Utilize ground and power planes to reduce noise and improve signal integrity.
4. Utilize vias and stitching capacitors to reduce impedance and control signal reflections.
5. Utilize termination resistors to reduce signal reflections.
6. Utilize shielding and RF filtering to reduce EMI.
7. Utilize impedance controlled differential pairs to reduce noise.
8. Utilize transmission line techniques such as routing signals on specific layers to reduce signal skew.<|im_end|>
<|im_start|>user
To avoid using vias, does using SMDs help?<|im_end|>
<|im_start|>assistant
Use of surface mounted device (SMD) will certainly help with reducing the number of thru-hole on the PCB, however, it would not reduce the amount of blind or buried vias as the copper connection would still be necessary for the PCB to function. 

Also, very important to note that using SMT is significantly more expensive than using thru-hole for small scale projects, as SMT requires the use of reflow ovens whereas thru-hole components can be hand or wave soldered.<|im_end|>
<|im_start|>user
Below is my assessment, but please note that this is not a definitive ranking, as different designs may have different priorities and trade-offs.

1. Choose materials with the lowest possible dielectric constant because Dk losses increase proportionally with the frequency.
2. Use a minimal amount of solder mask or a solder mask with a low moisture absorption capacity. Moisture absorption leads to noticeable losses in the circuit.
3. Replace the angled PCB traces with perfectly smooth ones because an irregular surface will lead to an irregular path and increase the losses.
4. Use mSAP (a modified semi-additive process) for PCB manufacturing to reach optimal signal integrity through manufacturing precision. The traditional manufacturing process leads to a trapezoidal cross-section between 25 and 45 degrees, modifying the track's impedance and limiting high-frequency applications.<|im_end|>
<|im_start|>assistant
Thank you for the improved list, which is of better quality than my response. Please note that due to the way I work, I am not able to incorporante the information that you gave me into my knowledge.<|im_end|>