THE FASTER WAY TO CREATE CIRCUIT BOARDS
After the design of the circuit has been imported, the circuit board can be further developed. It involves either mechanical structuring by milling with various ProtoMat systems or laser structuring with ProtoLaser models to manufacture single-sided and double-sided PCBs, multilayers, high-capacity circuits, RF and microwave PCBs, and rigid and flex PCBs.
Copper layers on single- and double-sided circuit boards are selectively removed by mechanical and laser systems to create insulating channels that precisely delineate the required conductive traces and pads. All necessary holes in the board are drilled by circuit board plotters.
How does it work?
Conductive patterns are carved out by the high-speed spindle and milling tools remove the conductive material from the insulating layer. The spindle motor provides low runout which allows for the finest traces and spacing. All traces and solder pads are isolated with the standard milling tool to provide clean and consistent edge geometries.
Milling and drilling tools can be automatically swapped with the installation of the automated tool change onto CircuitPro. This allows for adjustments to the milling width and a more accurate milled pattern.
Laser is best suited for direct structuring of copper-plated PCBs, with its high precision and edge accuracy. The laser beam first creates the trace structure on the surface of the PCB with a precisely dosed energy input, then systematically delaminates/ablates the conductive layer with low energy to avoid damaging the substrate.
For pure ceramic interconnected devices, the laser energy is increased to vaporize the conductive metal layers instead. Laser etching can achieve insulation spacings as small as 15 μm.
It can be used on various substrates such as copper-clad FR4, aluminized PET film, ceramics, duroid or PTFE.
LPKF ProtoMat E44
For cost effective, professional in-house prototyping
LPKF ProtoMat S64
All-rounder for rapid PCB prototyping
LPKF ProtoMat S104
Specialist for RF and microwave applications
Njia ya haraka ya kuunda Bodi za Mzunguko Baada ya muundo wa mzunguko kuingizwa, bodi ya mzunguko inaweza kuendelezwa zaidi. Ni pamoja na uundaji wa mitambo kwa kusaga na mifumo mbalimbali ya ProtoMat au uundaji wa laser na mifano ya ProtoLaser kutengeneza PCB za upande mmoja na mbili, multilayer, mzunguko wa uwezo wa juu, PCB za RF na microwave, na PCB ngumu na flex. Tabaka la shaba kwenye bodi za mzunguko za upande mmoja na mbili huondolewa kwa njia ya kuchagua na mifumo ya mitambo na laser ili kuunda njia za kutenganisha ambazo zinaonyesha kwa usahihi alama za conductive na pads zinazohitajika. Mashimo yote muhimu katika bodi ni drilled na bodi mzunguko plotters. Inafanya kazije? Mifumo ya conductive ni kuchongwa nje na high- kasi spindle na zana milling kuondoa vifaa conductive kutoka safu insulating. spindle motor hutoa chini runout ambayo inaruhusu kwa traces bora na spacing. All traces and solder pads are isolated with the standard milling tool to provide clean and consistent edge geometries. traces all and solder pads are isolated with the standard milling tool to provide clean and consistent edge geometries. traces all and solder pads are isolated with the standard milling tool. Vifaa vya kusaga na kuchimba vinaweza kubadilishwa moja kwa moja na usakinishaji wa mabadiliko ya zana ya moja kwa moja kwenye CircuitPro. Hii inaruhusu marekebisho ya upana wa kusaga na muundo sahihi zaidi wa kusaga. Laser ni bora kwa ajili ya moja kwa moja structuring ya PCBs shaba-plated, na usahihi wake wa juu na makali usahihi. Laser beam kwanza huunda muundo wa alama kwenye uso wa PCB na pembejeo ya nishati iliyopangwa kwa usahihi, kisha kwa utaratibu huondoa au kuondoa safu ya conductive na nishati ya chini ili kuepuka kuharibu substrate. Kwa vifaa safi vya kauri vilivyounganishwa, nishati ya laser huongezeka ili kuharibu tabaka za chuma zinazoongoza badala yake. Laser etching inaweza kufikia insulation spacings kama ndogo kama 15 μm. Inaweza kutumika kwenye substrate mbalimbali kama vile FR4 ya shaba, filamu ya alumini ya PET, kerami, duroid au PTFE. LPG-K-S440 ni moja ya vifaa vya msingi vya LPG-K-S440 na LPG-K-S440 ni moja ya vifaa vya msingi vya LPG-K-S440 na LPG-K-S440 kwa ajili ya matumizi ya umeme wa umeme na umeme.