text:
Sweets for Your Sweetie
R.E. Campbell of Staunton
¾ cup chopped pecans
1 cup butter
1 cup dark brown sugar
½ cup chocolate chips
DIRECTIONS: Sprinkle the pecans in a well-buttered 9" x 13" dish. Melt the butter in a deep, heavy saucepan. Add the brown sugar and bring to a boil over medium heat, stirring constantly. Maintain the boil and stir for six minutes, then pour over the pecans. Sprinkle the chocolate chips on top, allow them to melt and then spread to make a chocolate layer. Cool in refrigerator or freezer until firm.
Carol Boyer of Fort Valley
3 bags chocolate drops (such as "Old Fashioned Cream Drops" in 7.5-oz. bags)
¾ stick margarine
3 cups chopped pecans
3 cups coconut
DIRECTIONS: Melt chocolate drops and margarine in microwave. Stir in pecans and coconut and reheat slightly before pouring into buttered 11" x 13" pan. Cool and cut.
Mary Barrack of Tappahannock
3 cups sugar
1 cup water
1 cup white corn syrup
3 cups raw peanuts
2 T butter
¼ t salt
1 t vanilla
1 T baking soda
DIRECTIONS: Combine sugar, water and corn syrup in a heavy four-quart saucepan. Cook to 250 degrees with a candy thermometer. Add peanuts and cook to 300 degrees. Remove from heat and add butter, salt and vanilla. Mix until butter melts. Add soda and stir until foamy and creamy in color. Pour quickly into two 11" x 14" pans lined with foil and greased with butter. When cool, break into pieces.
Lisa Mills of Locust Grove
48 pretzel rings
8-oz. package of Hershey Kisses
¼ cup M&Ms candy
DIRECTIONS: Place pretzels on a greased baking sheet and put a chocolate kiss in the center of each ring. Bake at 275 degrees for 2-3 minutes until chocolate is softened. Remove from oven. Place an M&M on each, pressing down slightly so chocolate fills each ring. Refrigerate 5-10 minutes or until chocolate is firm; store at room temperature.
Yvonne Burnette of Sutherland
Two 3-oz. bags of microwave natural popcorn or 20 cups of popped corn
12-oz. jar salted dry roasted peanuts
1 cup granulated sugar
1 cup packed light brown sugar
½ cup light corn syrup
½ t baking soda
DIRECTIONS: Preheat oven to 250 degrees. Lightly grease two 15½" x 10½" pans. Put popped corn in a very large bowl. Discard any unpopped kernels. Add peanuts; toss to combine. In a 3-quart saucepan, heat butter, sugars and corn syrup on medium until butter melts and sugars dissolve, about five minutes, stirring frequently. Increase heat to medium-high and heat to boiling, about three minutes. Boil three minutes longer. Remove saucepan from heat. Stir in baking soda (mixture will bubble vigorously) and pour over popcorn mixture in bowl. Stir immediately and continue stirring until all popcorn is evenly coated. Divide mixture between the two pans, spreading evenly. Place on two oven racks and bake for 45 minutes, rotating pans between upper and lower racks halfway through and stirring occasionally. Cool completely in pans about one hour. Break apart any large clusters of popcorn when cool. Store in a tightly sealed container at room temperature for up to two weeks.
Patricia Harbin of Louisa
2 lbs. pecan halves
2 egg whites
Pinch of salt
1 cup sugar
½ cup melted butter
DIRECTIONS: Spray two 9" x 13" pans with cooking spray. Put half the pecans in
each pan. Toast in a 325-degree oven for five minutes. Beat the egg whites with salt until stiff peaks form. Fold in the sugar and then the pecans. Pour half the melted butter in each pan. Put half the nut mixture into each pan. Fold the nut mixture with the melted butter, using a wooden spoon or spatula. Bake uncovered for 10 minutes. Stir and repeat two more times. Remove pans from the oven and spread the pecans on wax paper. Let them cool slightly and then separate them. Cool completely before storing.


text:
May 5th, 2005 | #1 |
we need a word...
The foremost rhetorical problem of our time is to come up with a word for jewish hatred of non-jews. I think, rather than try to reverse apply kiken creations, we should create one from scratch, and all agree to use it. And as we use it, its use will spread, until one day the entire world is forced to recognize the phenomenon. This problem has troubled me for years. It is a stumbling block of major proportions. There is no solution with existing terms because they are too identified with The Agenda to be flipped. "Racism" only has the definition jews use for it. anti-gentilism isn't strong enough, and 3/4 have no idea what a gentile is anyway.
The word we're looking for needn't be grammatically correct, it must be rhetorically right. The idea is a parallel to 'racist.' Two syllables, possibly even rhyming with racist, such as jacist, and STRONG. And then we do the jew: we obstinately refuse to use any other word, and refuse not to use it. We use words to create new realities and force the dirty jews to respond. So let's hear your suggestions. |
May 5th, 2005 | #2 |
Posts: n/a
Judaicism? Semiticism?
Shemism? Chosenism? |
May 5th, 2005 | #3 | |
Join Date: Apr 2005
Posts: 2,063
May 5th, 2005 | #4 | |
Posts: n/a
Alex said-
"Jabassist"? The "J" sound for Jew, though it avoids the 'fraught with worry for Whites' "Jew" root, while keeping the "Jah" sound intact...together with "bassist"- in this case meaning "someone who is committing a 'base' ", genocidal act- namely, the constant, never-ending debasement, villification, and homicide of the White race via literary, teaching, and myth-makings, e.g. (celluloid, academic etc.)= a "Jabassist", one practicing or dealing in "Jabassism". Possible alternate spelling ( a better spelling, actually) could be "Jabaseism" and "Jabaseist". In this case, and I prefer this spelling, the pronunication could be" "Ja BASE ee ism" and "Ja BASE ee ist". Thus, the "baseness" of the act is emphasized. Emphasizing the "BASE" syllable also sounds the perfect rhyme to the "RACE" syllable emphasis in "racist". "Racist" is frequently so spewed in contempt. A Ja BASE ee ist would be one who is systematically, chronically enagaged in the debasement of White people, their histories, attempts to organize in their own interests etc. As with the current definitions of "Jew", you would not, in the most technical sense, have to be a Jew to be a Jabaseist. (That is, as dictionaries now define one who is "Jew-like" to be a Jew- the same would go for being a Jabaseist). But certainly, almost all Jooz, or absolutely all, would be Jabaseists. Note that "Jabaseist" is about the closest "perfect" rhyme one can come up with to "racist". Drop "racist" into online rhyming dictionaries, and you'll see what I mean. http://www.rhymezone.com/ http://www.rhymer.com/ Of course, in that we are coining a word- we still have a lot more leeway. But I do like the essential nature of their low act being forthrightly incorporated via "base" and "baseness". Plus, if one speaks it rapidly, it can quickly come out "Jewbaseist". In fact, "Jewbaseist" could proove to evolve as a more direct, harsh version of "Jabaseist", used only by plain speakers- the hard core. LOL I prefer Ja BASE ee ist with the long "ee" rather than just Ja BASE ist with no elongated extra syllable "ee". I think the extra "ceeist" (pronunced "seeist") sound nicely wraps up the fact that Jews "see" the debasement of Whites as an understood cultural goal- a literal "way of seeing" out from their Jew eyes and Jewdevil brains. Whatever word we decide upon, it will be great fun, and a learning, broadcasting exercise to watch it enter the English language via the internet over the course of a few years. |
May 5th, 2005 | #5 |
Join Date: Dec 2003
Location: Upper midwest around cattle.
Posts: 3,457
Anti-Aryanist(s) |
May 5th, 2005 | #6 |
Join Date: Feb 2004
Posts: 5,391
Jewfear nationalism!
May 5th, 2005 | #7 | |
Posts: n/a
How about something that suggests fear of natural competition? |
May 5th, 2005 | #8 | |
Join Date: Apr 2005
Posts: 2,063
In ancient times an agoraphobic was one that feared the competative world, be it commerce or sports, or any other form of natural competition, however, over time the old defenition became redundant and the defenition, an abnormal fear of open or public places, replaced it. So there is no natural, ancient word, like there is with Europhobia, meaning a fear of Europe, or Europeans. I think if we tried to reappropriate agoraphobia we would be fighting an uphill struggle, as people to readily identify it with it's more modern meaning. |
May 5th, 2005 | #9 | |
Join Date: Dec 2003
Location: Tennessee
Posts: 1,603
Who will decide WN's uniform language?
How odd of god to choose the Jews. I think it's vitally important that Whites have uniformity of beliefs -- a common, ethnocentric religion, if you will, but, unfortunately, we're all over the board with our beliefs, and some think that religion doesn't matter much. Judaism is the glue which makes Jewry so cohesive and strong way beyond their numbers against the goyim, the stupid cattle, as they refer to us. We could and should recognize this and learn from it, even apply it, as Klassen and Pierce did. It's also important, or, as you say, itz important, that we have uniformity of agitprop language. An example is the word Jew. Both of my primary mentors, both of whom rejected Xianity as Jew poison, and, independent of each other, went about founding new religions for Whites only, the previously mentioned Bernhardt Klassen and William Pierce, capitalized the word Jew, as they also capitalized the words White and Black when used to describe the respective races. I accepted this as the correct course and in the interest of uniformity have always capitalized these words, also, and plan to continue the practice unless I hear a very good reason not to. It noticeably jumped out at me that you changed "Jew" to "jew" whenever I used that word in the article I wrote for TAA #2. I thought that was peculiar, but I'm sure you made the change because you have your own policy to uniformly spell the word using only lower case. You've probably made the case for choosing to do that, but I've never seen it. Some folks never use the word Jew at all, but substitute Zionist, or, perhaps, Jewish, so as not to offend the enemy. I prefer offense over defense, so I don't use ZOG, but prefer JOG as I feel it better describes those who have occupied "our" government, and especially "our" mass media which control virtually all politicians in the U.S. today. I don't know whether or not the Jews around Bush, and Clinton before him, or, more importantly, the multi-national media moguls who shape mass opinion are Zionists or Communists or Democrats or Republicans or Libertarians, or capitalists, or "dampened" Marranos, or Jews for Jesus, or Episcopaleans -- and I don't really care under what cover they operate -- but I know one thing: they are all eligible to become Israeli citizens under 'aliya,' the Jew law of return. In other words they all, at some level, consider themselves racial Jews. Jews see the racial struggle as strictly biological, as did Klassen and Pierce -- thus JOG. DO NOT GIVE KIKES AN EASY OUT BY ALLOWING THEM TO SIMPLY CONVERT TO XIANIY (wink, wink!) OR TO BECOME SO-CALLED "ANTI-ZIONIST" JEWS. The Whites who collaborate with Jews for Jew interests, and against the interests of our own people, are sometimes referred to by WNs as Zionists, but are NOT eligible for Israeli citizenship. They are mere shabbos goyim, or better still, RACE-TRAITORS, so I prefer to use these terms to make my points to the unwashed. |
May 5th, 2005 | #10 | |
Ἀντίοχος Ἐπιφανὴς
Join Date: Dec 2003
Location: flyover
Posts: 13,175
Whenever I talk about the Jewish gutter religion I call it Judism. You might call Jewish racism, Jewism. Simple, Jews wont like it, accomplishes the same idea as "jewish supremacism" but it's shorter and pithier. Also, it contains a familiar root- Jew-- so people outside the loop wont have to guess at the meaning for more than a second.; Jews hate Gentiles. What is that called? JEWISM. |
May 5th, 2005 | #11 |
Junior Member
Join Date: Apr 2004
Location: collective unconscious
Posts: 52
def. Dual personality, hidden man, sociopath, schizo |
May 5th, 2005 | #12 | |
Ἀντίοχος Ἐπιφανὴς
Join Date: Dec 2003
Location: flyover
Posts: 13,175
Such as, JEWISM. |
May 5th, 2005 | #13 |
Posts: n/a
How about "Judeocrit"?
May 5th, 2005 | #14 | |
Ἀντίοχος Ἐπιφανὴς
Join Date: Dec 2003
Location: flyover
Posts: 13,175
Short, pithy, understandable, and Jews will definitely not like it. What keeps Gentiles off tenured law schooled faculty positions? JEWISM. What ties the Diaspora Jews and the Israelis together and unites their foreign policy interests? JEWISM. What allows the Jewish oligarchs in Russia to coordinate their plunder of Russian economy? JEWISM. What explains why Sumner Redstone pushes porn and filth on MTV to subvert Gentile families and society? JEWISM. What explains why Jew Paul Wolfowitz has moved from a belligerent position in the Department of Defense to an exploitative position at World Bank? JEWISM. Why dares Israel to not have an extradition treaty with its biggest foreign benefactor the USA, so that convicted murderers like Fischbein who skip US jurisdiction cant be shipped back? JEWISM. What unites the Marxist Jew in academe, the rich Jew on Wall St, the filthy poor Orthodox zealot Jewish settler in the West bank? JEWISM. |
May 5th, 2005 | #15 |
Join Date: Jan 2004
Location: orlando, fl
Posts: 3,683
Most white americans don't relate to being Europeans and won't identify with the term, albeit apropos. The suffix Phobe is perfect because it defines the pure emotion the jew has when an Aryan walks into a room full of them... especially the Khazar ones. A vowel is not necessary when using a prefix... imvho. The term that bonds whites the most is... White... so...
Whitephobe!!! |
May 5th, 2005 | #16 | |
Join Date: Apr 2005
Posts: 2,063
In early 18th century England you may well have talked of the jew and his religion of jewism. |
May 5th, 2005 | #17 |
Join Date: Jan 2004
Location: orlando, fl
Posts: 3,683
Jews aren't afraid of niggers and spics. Only whites. We have kicked them out of our courntries and are smarter than non whites. So phobia of non jews doesn't exist... it's only phobia of whites. That's why jews are trying to breed the white people out of existence. They don't care if niggers breed in fact the jew world order is one of niggers and other non whites working in a commie pig pen for Zion. Therefore Whitephobe is the term most appropritate. |
May 5th, 2005 | #18 | |
Posts: n/a
Whitephobacist? Whitephobacism? |
May 5th, 2005 | #19 | |
Join Date: Jan 2004
Location: orlando, fl
Posts: 3,683
Jews hate whites. Jews hate xtians only because they are white. They love nigger xtians. Jews hate capitalism because it's a white thing that Hitler was using to push the jew back to the ghetto. Jews love communism for the masses...unless they have to work side-by-side w/ niggers. Jews hate Mel Gibson because he is white and pointed out the descrepancy jews in the Bible and many whites rallied to see his movie and he didn't even spend a dime in advertising. Jews hate white solidarity... jews love nigger solidarity. Jews hate whites. |
May 5th, 2005 | #20 |
Senior Member
Join Date: Dec 2003
Posts: 3,630
This is where the difficulty lies. We are literally dealing with a "shape shifter" which is why we haven't been able to narrow it down to just one word.
The best source to inquire on this would probably be Dr. Kevin MacDonald's research, as he is a Psychologist and most of the "buzzwords" used against us have come from the Jewish psychiatric arena. Most of the Jews most ingenious buzzwords to date have focused on thought and behavior and not race. Using this formula we would come up with a word like Semeticist or Goyphobic. Just my two cents.
. Tolerance is how far a mechanical part can deviate from the norm before it screws up the entire machine. Any Mechanic The Jews hate us because of our FREEDOM! Holocaust® is a registered trademark of "G-d's chosen" predestined to "Rule the Earth". ALL RIGHTS RESERVED |
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US 5076974 A Abstract An improved stereolithography system and method for curing a stereolithographically-produced part, including at least some material that is no more than partially transformed, by exposing the part to off-peak-absorptive wavelengths of synergistic stimulation to achieve a more uniform cure.
Claims(14) 1. A method for curing a stereolithographically-produced, partially polymerized part comprising a material that absorbs reactive electromagnetic radiation most strongly at peak-absorptive wavelengths and less strongly at off-peak absorptive wavelengths, comprising the steps of:
providing a source of electromagnetic radiation, including both peak-absorptive and off-peak absorptive wavelengths, for curing said part; and exposing said part to electromagnetic radiation while substantially screening the electromagnetic radiation at the peak-absorptive wavelengths, thereby curing the part with primarily off-peak absorptive wavelengths. 2. The method of claim 1 further comprising the step of immersing the part in water, wherein the screening is carried out by adding photoinitiator to the water.
3. The method of claim 1 further comprising the steps of immersing the part in water and maintaining the water in a substantially pure state.
4. The method of claim 1 further comprising providing an electromagnetic screen between the source of electromagnetic radiation and the part.
5. The method of claim 3 further comprising maintaining the water at a preselected temperature.
6. The method of claim 1 wherein said providing step comprises providing said source of electromagnetic radiation which is ultraviolet radiation, and said screening step comprises substantially screening the ultraviolet radiation at the peak-absorptive wavelengths.
7. The method of claim 6 further comprising the step of immersing the part in water, wherein the screening step comprises adding photoinitiator to the water.
8. The method of claim 7 further comprising the step of maintaining the water in a substantially pure state.
9. The method of claim 6 wherein the screening step comprises providing an electromagnetic screen between said source and the part.
10. The method of claim 7 further comprising the step of substantially maintaining the water at a preselected temperature.
11. A method for curing a stereolithographically-produced, partially polymerized part comprising a material that absorbs reactive electromagnetic radiation most strongly at peak-absorptive wavelengths and less strongly at off-peak absorptive wavelengths to further polymerize said part, comprising the steps of:
submerging the part in a liquid medium; adding an absorbing substance, which absorbs electromagnetic radiation at peak-absorptive wavelengths more strongly than at off-peak absorptive wavelengths, to the liquid medium; and exposing said part to electromagnetic radiation while said part is still submerged in said liquid medium, thereby curing the part with primarily off-peak absorptive wavelengths. 12. The method of claim 11 wherein said adding step comprises adding photoinitiator to the liquid medium.
13. The method of claim 11 wherein said adding step comprises adding said substance which is said photoinitiator to the liquid medium.
14. A method for curing a stereolithographically-produced, partially polymerized part comprising a material that absorbs reactive electromagnetic radiation most strongly at peak-absorptive wavelengths and less strongly at off-peak absorptive wavelengths to further polymerize said part, comprising the steps of:
exposing said part to electromagnetic radiation from a source; and placing a screen, which filters peak-absorptive wavelengths more strongly than off-peak absorptive wavelengths from the electromagnetic radiation, between the part and said source of electromagnetic radiation, thereby curing the part primarily with off-peak absorptive wavelengths. Description This application is a continuation-in-part of U.S. patent application Ser. No. 183,016, filed Apr. 18, 1988, now U.S. Pat. No. 4,996,010. Related applications filed concurrently on that date are U.S. patent application Ser. Nos. 182,823; 182,830; 183,015; 182,801; 183,014; and 183,012, all of which are hereby fully incorporated herein by reference. Continuations-in-part of U.S. patent application Ser. Nos. 182,830; 183,014; and 183,012, are being concurrently filed herewith, all of which are hereby fully incorporated herein by reference. The U.S. patent application Ser. Nos. for the aforementioned continuations-in-part are 268,816, 268,837, 268,907, and 269,801 (all for Ser. No. 182,830). This invention relates generally to improvements in methods and apparatus for forming three-dimensional objects from a fluid medium and, more particularly, to new and improved stereolithography systems involving the application of enhanced data manipulation and lithographic techniques to production of three-dimensional objects, whereby such objects can be formed more rapidly, reliably, accurately and economically. It is common practice in the production of plastic parts and the like to first design such a part and then painstakingly produce a prototype of the part, all involving considerable time, effort and expense. The design is then reviewed and, often times, the laborious process is again and again repeated until the design has been optimized. After design optimization, the next step is production. Most production plastic parts are injection molded. Since the design time and tooling costs are very high, plastic parts are usually only practical in high volume production. While other processes are available for the production of plastic parts, including direct machine work, vacuum-forming and direct forming, such methods are typically only cost effective for short run production, and the parts produced are usually inferior in quality to molded parts. Very sophisticated techniques have been developed in the past for generating three-dimensional objects within a fluid medium which is selectively cured by beams of radiation brought to selective focus at prescribed intersection points within the three-dimensional volume of the fluid medium. Typical of such three-dimensional systems are those described in U.S. Pat. Nos. 4,041,476; 4,078,229; 4,238,840 and 4,288,861. All of these systems rely upon the buildup of synergistic energization at selected points deep within the fluid volume, to the exclusion of all other points in the fluid volume. Unfortunately, however, such three-dimensional forming systems face a number of problems with regard to resolution and exposure control. The loss of radiation intensity and image forming resolution of the focused spots as the intersections move deeper into the fluid medium create rather obvious complex control situations. Absorption, diffusion, dispersion and diffraction all contribute to the difficulties of working deep within the fluid medium on an economical and reliable basis. In recent years, "stereolithography" systems, such as those described in U.S. Pat. No. 4,575,330 entitled "Apparatus For Production of Three-Dimensional Objects by Stereolithography," have come into use. Basically, stereolithography is a method for automatically building complex plastic parts by successively printing cross-sections of photopolymer (such as liquid plastic) on top of each other until all of the thin layers are joined together to form a whole part. With this technology, the parts are literally grown in a vat of liquid plastic. This method of fabrication is extremely powerful for quickly reducing design ideas to physical form and for making prototypes. Photocurable polymers change from liquid to solid in the presence of light and their photospeed with ultraviolet light (UV) is fast enough to make them practical model building materials. The material that is not polymerized when a part is made is still usable and remains in the vat as successive parts are made. An ultraviolet laser generates a small intense spot of UV. This spot is moved across the liquid surface with a galvanometer mirror X-Y scanner. The scanner is driven by computer generated vectors or the like. After each successive surface is contacted by the laser, an elevator causes another layer of fresh liquid surface to be presented thereto for polymerization. Precise complex patterns can be rapidly produced with this technique. The laser, scanner, photopolymer vat and elevator, along with a controlling computer, combine together to form a stereolithography apparatus, referred to as "SLA". An SLA is programmed to automatically make a plastic part by drawing its cross section one layer at a time, and building it up layer by layer. Stereolithography represents an unprecedented way to quickly make complex or simple parts without tooling. Since this technology depends on using a computer to generate its cross sectional patterns, there is a natural data link to CAD/CAM. However, such systems have encountered difficulties relating to shrinkage, curl and other distortions, as well as resolution, accuracy and difficulties in producing certain object shapes. When objects come out of the vat of resin, after being drawn, they are in the "green state," partially polymerized. Objects are then post cured to complete the polymerization process. This post curing can be done in two ways: 1) by thermal curing, or 2) by flood UV curing. This invention reduces the distortion of objects when they are post cured using a UV flood exposure. It also reduces the required UV exposure level and/or cure time. In a first approach, the part is flood UV cured only. The disadvantage of this procedure is that objects may distort. In a second approach an effort is made to control parameters involved in the flood UV curing process, to control UV intensity and part temperature. The disadvantage of this approach is that, in general, parts have a wide variety of differing shapes, such that maintaining an ideal particular temperature and exposure level is difficult. This procedure is also time consuming. Hence, there continues to be long existing need in the design and production arts for enhanced capability in rapidly and reliably moving from the design stage to the prototype stage and to ultimate production, particularly moving directly from the computer designs for such plastic parts to virtually immediate prototypes and the facility for large scale production on an economical and automatic basis. Accordingly, those concerned with the development and production of three-dimensional plastic objects and the like have long recognized the desirability for further improvement in more rapid, reliable, economical and automatic means which would facilitate quickly moving from a design stage to the prototype stage and to production, while avoiding the complicated post processing problems of the prior art three-dimensional production systems. The present invention clearly fulfills all of these needs. The present invention is directed to a method for curing a partially polymerized, stereolithographically produced part, comprising the steps of immersing the part in a liquid medium, and providing means for curing said part while it is immersed in said liquid medium. An important object of this invention is to provide a means for curing a partially polymerized, stereolithographically produced part which removes heat from the part as it cures and thereby reduces risk of part warpage or distortion. Another important object of this invention is to provide a means for curing a partially polymerized, stereolithographically produced part which displaces oxygen from the surface of said part, thereby providing a more complete, high quality and efficient cure at the surface. The above and other objects and advantages of this invention will be apparent from the following more detailed description when taken in conjunction with the accompanying drawings of illustrative embodiments. FIG. 1 is an overall block diagram of a stereolithography system for the practice of the present invention; FIGS. 2 and 3 are flow charts illustrating the basic concepts employed in practicing the method of stereolithography of the present invention; FIG. 4 is a combined block diagram schematic and elevational sectional view of a system suitable for practicing the invention; FIG. 5 is an elevational sectional view of a second embodiment of a stereolithography system for the practice of the invention; FIG. 6 is a flow chart illustrating post processing steps in practicing the method of stereolithography of the present invention; FIGS. 7, 8 and 9 are graphs depicting a screening technique of the present invention, that helps to provide uniform curing; and FIG. 10 is a schematic illustration of a preferred manner in which to carry out the flood UV curing step of the present invention. Briefly, and in general terms, the present invention relates to aspects of a new and improved stereolithography system for generating a three-dimensional object by forming successive, adjacent, cross-sectional laminae of that object at the face of a fluid medium capable of altering its physical state in response to appropriate synergistic stimulation. More specifically, this invention is particularly directed to improved post processing techniques for fully curing a partially polymerized part produced by stereolithographic techniques. The present invention is directed to a technology that harnesses the principles of computer generated graphics in combination with stereolithography, i.e., the application of lithographic techniques to the production of three-dimensional objects, to simultaneously execute computer aided design (CAD) and computer aided manufacturing (CAM) in producing three-dimensional objects directly from computer instructions. Post processing of such objects, in accordance with the invention, includes flood curing with the object immersed in water. The invention can be applied for the purposes of sculpturing models and prototypes in a design phase of product development, or as a manufacturing system, or even as a pure art form. The new and improved stereolithographic system of the present invention has many advantages over currently used apparatus for producing plastic objects. The methods and apparatus of the present invention avoid the need of producing design layouts and drawings, and of producing tooling drawings and tooling. The designer can work directly with the computer and a stereolithographic device, and when he is satisfied with the design as displayed on the output screen of the computer, he can fabricate a part for direct examination. If the design has to be modified, it can be easily done through the computer, and then another part can be made to verify that the change was correct. If the design calls for several parts with interacting design parameters, the method of the invention becomes even more useful because all of the part designs can be quickly changed and made again so that the total assembly can be made and examined, repeatedly if necessary. Moreover, the data manipulation techniques of the present invention enable production of objects with reduced stress, curl and distortion, and increased resolution, strength, accuracy, speed and economy of production, even for difficult and complex object shapes. After the design is complete, part production can begin immediately, so that the weeks and months between design and production are avoided. Stereolithography is particularly useful for short run production because the need for tooling is eliminated and production set-up time is minimal. Likewise, design changes and custom parts are easily provided using the technique. Because of the ease of making parts, stereolithography can allow plastic parts to be used in many places where metal or other material parts are now used. Moreover, it allows plastic models of objects to be quickly and economically provided, prior to the decision to make more expensive metal or other material parts. Hence, the new and improved stereolithographic methods and apparatus of the present invention satisfy a long existing need for an improved CAD and CAM system capable of rapidly, reliably, accurately and economically designing and fabricating three-dimensional parts and the like, including improved post processing of such parts. Referring now to the drawings, and particularly to FIG. 1 thereof, there is shown a block diagram of an overall stereolithography system suitable for practicing the present invention. A CAD generator 2 and appropriate interface 3 provide a data description of the object to be formed, typically in PHIGS format, via network communication such as ETHERNET or the like to an interface computer 4 where the object data is manipulated to optimize the data and provide output vectors which reduce stress, curl and distortion, and increase resolution, strength, accuracy, speed and economy of reproduction, even for rather difficult and complex object shapes. The interface computer 4 generates layer data by slicing, varying layer thickness, rounding polygon vertices, filling, generating flat skins, near-flat skins, up-facing and down-facing skins, scaling, cross-hatching, offsetting vectors and ordering of vectors. The vector data and parameters from the computer 4 are directed to a controller subsystem 5 for operating the system stereolithography laser, mirrors, elevator and the like. FIGS. 2 and 3 are flow charts illustrating the basic system of the present invention for generating three-dimensional objects by means of stereolithography. Many liquid state chemicals are known which can be induced to change to solid state polymer plastic by irradiation with ultraviolet light (UV) or other forms of synergistic stimulation such as electron beams, visible or invisible light, reactive chemicals applied by ink jet or via a suitable mask. UV curable chemicals are currently used as ink for high speed printing, in processes of coating or paper and other materials, as adhesives, and in other specialty areas. Lithography is the art of reproducing graphic objects, using various techniques. Modern examples include photographic reproduction, xerography, and microlithography, as is used in the production of microelectronics. Computer generated graphics displayed on a plotter or a cathode ray tube are also forms of lithography, where the image is a picture of a computer coded object. Computer aided design (CAD) and computer aided manufacturing (CAM) are techniques that apply the abilities of computers to the processes of designing and manufacturing. A typical example of CAD is in the area of electronic printed circuit design, where a computer and plotter draw the design of a printed circuit board, given the design parameters as computer data input. A typical example of CAM is a numerically controlled milling machine, where a computer and a milling machine produce metal parts, given the proper programming instructions. Both CAD and CAM are important and are rapidly growing technologies. A prime object of the technology relating to the present invention is to harness the principles of computer generated graphics, combined with UV curable plastic and the like, to simultaneously execute CAD and CAM, and to produce three-dimensional objects directly from computer instructions. This technology, referred to as stereolithography, can be used to sculpture models and prototypes in a design phase of products development, or as a manufacturing a device, or even as an art form. The present invention enhances the developments in stereolithography set forth in U.S. Pat. No. 4,575,330 issued Mar. 11, 1986, to Charles W. Hull, and which is fully incorporated by reference herein. Referring now more specifically to FIG. 2 of the drawing, the stereolithographic method is broadly outlined. Step 8 calls for generation of CAD or other data, typically in digital form, representing a three-dimensional object to be formed by the system. This CAD data usually defines surfaces in polygon format, triangles, and normals perpendicular to the planes of those triangles, e.g., for slope indications, being presently preferred, and in a presently preferred embodiment of the invention conforms to the Programmer's Hierarchial Interactive Graphics System (PHIGS) now adopted as an ANSI standard. This standard is described, by way of example in the publication "Understanding PHIGS", published by Template, Megatek Corp., San Diego, Calif. In Step 9, the PHIGS data or its equivalent is converted, in accordance with the invention, by a unique conversion system to a modified data base for driving the stereolithography output system in forming three-dimensional objects. In this regard, information defining the object is specially processed to reduce stress, curl and distortion, and increase resolution, strength and accuracy of reproduction. Step 10 in FIG. 2 calls for the generation of individual solid laminae representing cross-sections of a three-dimensional object to be formed. Step 11 combines the successively formed adjacent laminae to form the desired three-dimensional object which has been programmed into the system for selective curing. Hence, the stereolithographic system described herein generates three-dimensional objects by creating a cross-sectional pattern of the object to be formed at a selected surface of a fluid medium, e.g., a UV curable liquid or the like, capable of altering its physical state in response to appropriate synergistic stimulation such as impinging radiation, electron beam or other particle bombardment, or applied chemicals (as by ink jet or spraying over a mask adjacent the fluid surface), successive adjacent laminae, representing corresponding successive adjacent cross-sections of the object, being automatically formed and integrated together to provide a step-wise laminar or thin layer buildup of the object, whereby a three-dimensional object is formed and drawn from a substantially planar or sheet-like surface of the fluid medium during the forming process. The aforedescribed technique illustrated in FIG. 2 is more specifically outlined in the flowchart of FIG. 3, where again Step 8 calls for generation of CAD or other data, typically in digital form, representing a three-dimensional object to be formed by the system. Again, in Step 9, the PHIGS data is converted by a unique conversion system to a modified data base for driving the stereolithography output system in forming three-dimensional objects. Step 12 calls for containing a fluid medium capable of solidification in response to prescribed reactive stimulation. Step 13 calls for application of that stimulation as a graphic pattern, in response to data output from the computer 4 in FIG. 1, at a designated fluid surface to form thin, solid, individual layers at that surface, each layer representing an adjacent cross-section of a three-dimensional object to be produced. In the practical application of the invention, each lamina will be a thin lamina, but thick enough to be adequately cohesive in forming the cross-section and adhering to the adjacent laminae defining other cross-sections of the object being formed. Step 14 in FIG. 3 calls for superimposing successive adjacent layers or laminae on each other as they are formed, to integrate the various layers and define the desired three-dimensional object. In the normal practice of the invention, as the fluid medium cures and solid material forms to define one lamina, that lamina is moved away from the working surface of the fluid medium and the next lamina is formed in the new liquid which replaces the previously formed lamina, so that each successive lamina is superimposed and integral with (by virtue of the natural adhesive properties of the cured fluid medium) all of the other cross-sectional laminae. Of course, as previously indicated, the present invention also deals with the problems posed in transitioning between vertical and horizontal. The process of producing such cross-sectional laminae is repeated over and over again until the entire three-dimensional object has been formed. The object is then removed and the system is ready to produce another object which may be identical to the previous object or may be an entirely new object formed by changing the program controlling, or the data supplied to, the stereolithographic system. FIGS. 4 and 5 of the drawings illustrate various apparatus suitable for implementing the stereolithographic methods illustrated and described by the systems and flow charts of FIGS. 1 through 3. As previously indicated, "stereolithography" is a method and apparatus for making solid objects by successively "printing" thin layers of a curable material, e.g., a UV curable material, one on top of the other. A programmable movable spot beam of UV light shining on a surface or layer of UV curable liquid is used to form a solid cross-section of a given thickness of the object at the surface of the liquid. The object is then moved, in a programmed manner, away from the liquid surface by the thickness of one layer and the next cross-section is then formed and adhered to the immediately preceding layer defining the object. This process is continued until the entire object is formed. Essentially all types of object forms can be created with the technique of the present invention. Complex forms are more easily created by using the functions of a computer to help generate the programmed commands and to then send the program signals to the stereolithographic object forming subsystem. The data base of a CAD system can take several forms. One form, as previously indicated, consists of representing the surface of an object as a mesh of triangles (PHIGS). These triangles completely form the inner and outer surfaces of the object. This CAD representation also includes a unit length normal vector for each triangle. The normal points away from the solid which the triangle is bounding. This invention provides a means of processing such CAD data into the layer-by-layer vector data that is necessary for forming objects through stereolithography. For stereolithography to successfully work, there must be good adhesion from one layer to the next. Hence, plastic from one layer must overlay plastic that was formed when the previous layer was built. In building models that are made of vertical segments, plastic that is formed on one layer will fall exactly on previously formed plastic from the preceding layer, and thereby provide good adhesion. As one starts to make a transition from vertical to horizontal features, using finite jumps in layer thickness, a point will eventually be reached where the plastic formed on one layer does not make contact with the plastic formed on the previous layer, and this causes severe adhesion problems. Horizontal surfaces themselves do not present adhesion problems because by being horizontal the whole section is built on one layer with side-to-side adhesion maintaining structural integrity. Therefore, means are provided for insuring adhesion between layers when making transitions from vertical to horizontal or horizontal to vertical sections, as well as providing a way to completely bound a surface, and ways to reduce or eliminate stress and strain in formed parts. A presently-preferred embodiment of a new and improved stereolithographic system is shown in elevational cross-section in FIG. 4. A container 21 is filled with a UV curable liquid 22 or the like, to provide a designated working surface 23. A programmable source of ultraviolet light 26 or the like produces a spot of ultraviolet light 27 in the plane of surface 23. The spot 27 is movable across the surface 23 by the motion of mirrors or other optical or mechanical elements (not shown in FIG. 4) used with the light source 26. The position of the spot 27 on surface 23 is controlled by a computer control system 28. As previously indicated, the system 28 may be under control of CAD data produced by a generator 20 in a CAD design system or the like and directed in PHIGS format or its equivalent to a computerized conversion system 25 where information defining the object is specially processed to reduce stress, curl and distortion, and increase resolution, strength and accuracy of reproduction. A movable elevator platform 29 inside container 21 can be moved up and down selectively, the position of the platform being controlled by the system 28. As the device operates, it produces a three-dimensional object 30 by step-wise build-up of integrated laminae such as 30a, 30b, 30c. The surface of the UV curable liquid 22 is maintained at a constant level in the container 21, and the spot of UV light 27, or other suitable form of reactive stimulation, of sufficient intensity to partially polymerize the liquid resin, such that it is converted to a solid material, is moved across the working surface 23 in a programmed manner. As the liquid 22 cures and solid material forms, the elevator platform 29 that was initially just below surface 23 is moved down from the surface in a programmed manner by any suitable actuator. In this way, the solid material that was initially formed is taken below surface 23 and new liquid 22 flows across the surface 23. A portion of this new liquid is, in turn, converted to solid material by the programmed UV light spot 27, and the new material adhesively connects to the material below it. This process is continued until the entire three-dimensional object 30 is formed. The object 30 is then removed from the container 21, and the apparatus is ready to produce another object. Another object can then be produced, or some new object can be made by changing the program for, or the data supplied to, the computer 28. The curable liquid 22, e.g., the UV curable resin, should have several important properties. First, it must cure fast enough with the available UV light source to allow practical object formation times. Additionally, it should be adhesive, so that successive layers will adhere to each other. Further, its viscosity should be low enough so that fresh liquid material will quickly flow across the surface when the elevator moves the object. Moreover, it should absorb UV so that the film formed will be reasonably thin. It will preferably also be reasonably insoluble in solid state, so that the object can be washed free of excess resin after the object has been formed. Finally, it should be as non-toxic and non-irritating as possible. The cured material should also have properties that will depend on the application involved, as in the conventional use of other plastic materials. Such parameters as color, texture, strength, electrical properties, flammability, and flexibility are among the properties to be considered. In addition, the cost of the material will be important in many cases. The UV curable material used in the presently preferred embodiment of a working stereolithography (e.g., FIG. 3) is DeSoto SLR 800 stereolithography resin, made by DeSoto, Inc., of Des Plaines, Ill. Other low distortion resins are available or becoming available from other major chemical companies, such as Ciba-Geigy. Acrylate and methacrylate resins are generally useful. Typical such resins comprise a photoinitiator (e.g., about 4%), as well as, for example, one or more of a urethane acrylate oligomer (e.g., about 25%), an epoxy resin diacrylate (e.g., about 25%), a trimethacrylate ester (e.g., about 15%), a propoxylated diacrylate ester (e.g., about 15%), and a diluent acrylate monomer (e.g., about 20%). The foregoing percentages are given by way of illustration only, to exemplify a typical resin, but are not intended as limiting. Other optional ingredients include various oligomers and an ethoxylated diacrylate ester. Typical viscosities at 25 degrees C. range from about 100 to about 3,500 centipoises. The light source 26 produces the spot 27 of UV light small enough to allow the desired object detail to be formed, and intense enough to cure the UV curable liquid being used quickly enough to be practical. The source 26 is arranged so it can be programmed to be turned off and on, and to move, such that the focused spot 27 moves across the surface 23 of the liquid 22. Thus, as the spot 27 moves, it cures the liquid 22 into a solid, and "draws" a solid pattern on the surface in much the same way a chart recorder or plotter uses a pen to draw a pattern on paper. The light source 26 for the presently-preferred embodiment of a stereolithography apparatus is typically a helium-cadmium ultraviolet laser such as the Model 4240N HeCd Multimode Laser, made by Liconix of Sunnyvale, Calif. In the system of FIG. 4, means may be provided to keep the surface 23 at a constant level and to replenish this material after an object has been removed so that the focused spot 27 will remain sharply in focus on a fixed focus plane, thus insuring maximum resolution in forming a layer on this plane. This makes it possible to provide a region of high intensity right at the working surface 23, rapidly diverging to low intensity and thereby limiting the depth of the curing process to provide the thinnest appropriate cross-sectional laminae for the object being formed. Other reasons for maintaining the surface 23 at a constant level may include the ability to maintain a constant layer thickness and the ability to maintain accuracy in the stereolithographic process. The elevator platform 29 is used to support and hold the object 30 being formed, and to move it up and down as required. Typically, after a layer is formed, the object 30 is moved beyond the level of the next layer to allow the liquid 22 to flow into the momentary void at surface 23 left where the solid was formed, and then it is moved back to the correct level for the next layer. The requirements for the elevator platform 29 are that it can be moved in a programmed fashion at appropriate speeds, with adequate precision, and that it is powerful enough to handle the weight of the object 30 being formed. In addition, a manual fine adjustment of the elevator platform position is useful during the set-up phase and when the object is being removed. The elevator platform 29 can have mechanical, pneumatic, hydraulic, or electrical and may also be optical or electronic feedback to precisely control its position. The elevator platform 29 is typically fabricated of either glass or aluminum, but any material to which the cured plastic material will adhere is suitable. A computer controlled pump (not shown) may be used to maintain a constant level of the liquid 22 at the working surface 23. Appropriate level detection system and feedback networks, well known in the art, can be used to drive a fluid pump or a liquid displacement device, such as a solid rod (not shown) which is moved out of the fluid medium as the elevator platform is moved further into the fluid medium, to offset changes in fluid volume and maintain constant fluid level at the surface 23. Alternatively, the source 26 can be moved relative to the sensed level 23 to maintain the same distance between the source 26 and the surface 23. All of these alternatives can be readily achieved by appropriate data operating in conjunction with the computer control system 28. Another method of controlling liquid level is to use a spillway over which resin can flow if the liquid level rises. After the three-dimensional object 30 has been formed, the elevator platform 29 is raised and the object is removed from the platform for post processing. In addition, there may be several containers 21 used in the practice of the invention, each container having a different type of curable material that can be automatically selected by the stereolithographic system, in this regard, the various materials might provide plastics of different colors, or have both insulating and conducting material available for the various layers of electronic products. As will be apparent from FIG. 5 of the drawings, there is shown an alternate configuration of a stereolithographic apparatus wherein the UV curable liquid 22 or the like floats on a heavier UV transparent liquid 32 which is non-miscible and non-wetting with the curable liquid 22. By way of example, ethylene glycol or heavy water are suitable for the intermediate liquid layer 32. In the system of FIG. 5, the three-dimensional object 30 is pulled up from the liquid 22, rather than down and further into the liquid medium, as shown in the system of FIG. 4. The UV light source 26 in FIG. 5 focuses the spot 27 at the interface between the liquid 22 and the non-miscible intermediate liquid layer 32, the UV radiation passing through a suitable UV transparent window 33, of quartz or the like, supported at the bottom of the container 21. The curable liquid 22 is provided in a very thin layer over the non-miscible layer 32 and thereby has the advantage of limiting layer thickness directly rather than relying solely upon absorption and the like to limit the depth of curing since ideally an ultrathin lamina is to be provided. Hence, the region of formation will be more sharply defined and some surfaces will be formed smoother with the system of FIG. 5 than with that of FIG. 4. In addition a smaller volume of UV curable liquid 22 is required, and the substitution of one curable material for another is easier. A commercial stereolithography system will have additional components and subsystems besides those previously shown in connection with the schematically depicted systems of FIGS. 1-5. For example, the commercial system would also have a frame and housing, and a control panel. It should have means to shield the operator from excess UV and visible light, and it may also have means to allow viewing of the object 30 while it is being formed. Commercial units will provide safety means for controlling ozone and noxious fumes, as well as conventional high voltage safety protection and interlocks. Such commercial units will also have means to effectively shield the sensitive electronics from electronic noise sources. A key feature of the present invention, in improving the quality of parts produced stereolithography, resides in the post processing of such parts and, more particularly, in irradiating such parts with ultraviolet radiation (UV) or the like while the part is immersed in water. For the purposes of this invention, a "part" is to be broadly construed as any object or item that can be post processed according to the methods described herein, irrespective of whether the part is a whole article or a portion of an article. A typical post processing procedure includes the following steps: 1) Raising the part out of the vat of resin. 2) Allowing the part to drain into the vat (e.g., from about 10 minutes to about an hour). 3) Removing the part (and platform, if desired) from the stereolithography unit (SLA) and placing it on an absorbent pad. 4) Optionally placing the part/platform in a low temperature oven (heated to a temperature between room temperature and a temperature effective for thermally curing the resin, e.g., from room temperature to about 100 degrees C., and preferably from about 60 to about 90 degrees C.). 5) Optionally removing excess resin with cotton swabs. 6) Optionally coating the part surface with resin to give good surface finish. 7) Optionally giving the part a quick exposure of flood UV (or other radiation as appropriate for the photoinitiator) to set the surface. 8) In accordance with the invention, immersing the part in cool water, such that the water fills all cavities in the part, if possible. 9) Applying flood UV (or other radiation as appropriate for the photoinitiator) to the part, while it is under water (or another appropriate liquid medium). 10) Optionally rotating the part as necessary to provide a uniform cure. 11) Removing the part from the platform, if necessary. 12) Repeating steps 6-10, if necessary. The post processing steps are set forth in more detail in FIG. 6, along with process arrows indicating various options for selection and ordering of the steps. Step 8 is of particular interest herein. By this point in the process, the partially polymerized part was drained and optionally further polymerized at the surface--flash flooded with UV light or otherwise irradiated, such as with other forms of electromagnetic radiation (e.g., visible light), or with particle beams, such as electron beams, depending upon the nature of the photoinitiator and the resin; or otherwise chemically reacted or catalyzed--to set the surface to the extent that it is impervious to water. According to Step 8, the part is immersed in water, or another liquid medium such as a salt solution, a fluorocarbon such as trichlorotrifluoroethane, an organic solvent, such as polyethylene glycol telomers or ethanol, etc., during a flood UV exposure (or exposure to other radiation, chemical reaction, or catalysis as described above, depending upon the nature of the photoinitiator, the resin, and the liquid medium) of sufficient duration to completely cure the part. The liquid medium preferably has a similar specific gravity to the partially polymerized part, to provide an optimum level of buoyancy, such that distortion risks due to gravity are minimized; preferably absorbs heat away from the part that is generated during the polymerization reaction; and preferably acts as a heat exchanger by transmitting the heat from the part without a pronounced increase in the temperature of the liquid medium itself. Preferably, the water and the part are at ambient temperature when the part is immersed in the water, e.g., the water is generally between about 15 and about 35 degrees C., although it can vary depending upon the nature of the resin, and is preferably about 20 to about 30 degrees C., and most preferably about 25 degrees C. Ideally, the water temperature is maintained at a selected level, typically within plus or minus about 5 degrees C., preferably within plus or minus about 3 degrees C., and most preferably maintained within about a degree C. There needs to be sufficient water to constitute a large enough thermal mass such that its temperature does not change dramatically during exposure to radiation from the lamps during the curing process. Optionally, the water can be recycled through a heat exchanger to maintain it substantially at room temperature and to reduce the quantity of water required. In one embodiment of the invention, the water is filtered to remove substantially all impurities that would affect UV absorption (or absorption of whatever other form of radiation is used to cure the part), and preferably the water is maintained in a substantially pure state. Any of several standard filtering techniques are acceptable for this purpose, such as, for example, deionization, passage over charcoal, distillation, or pumping through a fine screen. Alternatively, the water can be changed between curing successive parts, or as often as necessary. In another embodiment, the UV light (or other radiation) is screened to remove particular UV (or other) wavelengths or to alter the distribution of UV (or other) wavelengths by screening means such as, for example, chemical absorbers (including but not limited to photoabsorbers or photoinitiators), glass filters, and/or diffraction apparatus such as gratings or prisms. This screening can change the polymerization characteristics of the part during the curing process, and can reduce or eliminate warpage due to differential curing through the part. More specifically, if radiation at peak absorption wavelengths can be removed or diminished, then radiation absorbed at nearby wavelengths (i.e., radiation that is absorbed, but less readily absorbed by the photoinitiator in the resin than at peak wavelengths), can lead to more uniform curing. For example, a second initiator--having the same or an overlapping absorption spectrum (shifted towards shorter wavelengths) to the first initiator used for catalyzing the photopolymerization reaction in the part being cured--can be added to the water to absorb a portion of light at the absorbance peak of the first initiator. If desired, the same initiator can be used in the resin and in the water. In this manner, the polymerization reaction is largely catalyzed by light off the peak wavelengths, such that the polymerization reaction occurs in a more diffuse manner in the part being cured, rather than occurring preponderantly at the surface. FIGS. 7, 8 and 9 illustrate the principle of screening some or all of the peak absorbance wavelengths of the photoinitiator to obtain a more uniform cure through the part. This principle can be applied to almost any means for activating the photoinitiator, although here the principle is illustrated with reference to absorption of light. Based on their absorbance spectra, photoinitiators respond to different wavelengths of light by allowing some to penetrate more deeply into the part before being absorbed. In general, light at the peak wavelengths of the spectra will tend to be absorbed rapidly and therefore rapidly activate the photoinitiator at or near the surface of the part, while light off the peak wavelengths will tend to penetrate more deeply before being absorbed and therefore activating the photoinitiator. In FIG. 7, curve 40 represents the percent absorbance spectrum for a typical photoinitiator in a resin. If the photoinitiator responds, for example, to light in the ultraviolet region, and if the liquid medium surrounding the part is water, it can be assumed that the absorption of light by the photoinitiator in the part substantially matches the absorbance spectrum of the photoinitiator, since little or no light is attenuated by the passage through water. Assuming, for example, that an approximately equal continuum of energy is supplied at each wavelength by the irradiating source, the majority of the cure will be catalyzed by photoinitiator responding to the radiation at the peak wavelength of its absorbance curve. The result will tend to be a relatively shallow cure, and as the cure progresses it will tend to do so in a shallow, layer-by-layer fashion, such that warpage of the part could result. In FIG. 8, curve 41 represents the percent absorbance spectrum for a typical photoinitiator suspended in a liquid medium such as water, and curve 42 represents the percent transmission of light through the suspended photoinitiator. Accordingly, curve 43 represents the percent absorption of light by the photoinitiator in resin, based on the availability of light that was transmitted through the water containing suspended photoinitiator. In this example, the photoinitiator in the resin is the same one as in the water, although their concentrations may differ. As can be seen from the Figure, more absorption, and therefore, more polymerization, occurs at wavelengths displaced from the peak of the absorbance of the initiator. This results in a cure that extends more deeply into the part, such that a more uniform cure is obtained than would be obtained in the absence of the suspended photoinitiator. In FIG. 9, curve 44 represents the percent absorbance spectrum for a first typical photoinitiator suspended in a liquid medium such as water, curve 45 represents the percent transmission of light to the part through the suspended photoinitiator, curve 46 represents the percent absorbance spectrum for a second typical photoinitiator, suspended in a resin, and curve 47 represents the percent absorption of light by the second typical photoinitiator in the part, in the presence of the suspended first photoinitiator, based upon the available light transmitted to the part. Accordingly, this Figure depicts different photoinitiators in the water and in the resin, such that the available light for curing the resin (partially polymerized part) is shifted towards longer wavelengths, resulting in a deeper and more uniform cure of the part. Curing is carried out in a vessel transparent to UV light, such as a quartz or pyrex container, and should be carried out with the UV light striking the entire surface of the part as uniformly as possible. This can be accomplished, for example, by using multiple lamps simultaneously from different angles, by using high quality reflectors to distribute the light around the object, by rotating the object or the lamps, or the like. The foregoing techniques can be used individually or in combination. FIG. 10 illustrates a typical arrangement for flood curing. Most preferably, the vessel is placed in a 3D Systems PCA (Post Cure Apparatus), obtainable from 3D Systems, Inc., Sylmar, Calif. This is an oven-like chamber having a plurality of ultraviolet lamps disposed therein, reflecting panels on all inside surfaces, and a rotatable base disposed on the bottom inside surface. Of course, other suitable means for curing the part may be used. Preferably, in generating the UV light for curing, a high pressure mercury discharge lamp or a metal halide lamp, such as, for example, Philips' (Belgium) HPA 400S "Mercury Vapor Burner," is used. The UV lamp used to flood the surface is typically of mixed wavelengths in the 250 to 750 nm range, with the majority of the output being in peaks and continuum in the range of 300 to 400 nm, i.e., the long-ultraviolet range. This lamp is suitable for use with the photoinitiator in the preferred SLR 800 resin obtained from DeSoto, Inc., Des Plaines, Ill., as the radiation emitted by the lamp encompasses the absorption spectrum of said photoinitiator. Preferably, using the SLR 800 resin or other resins curable in the long UV range, the intensity of the light striking the surface of the part is about 20 mW per square cm to about 100 mW per square cm in the 300 to 400 nm range. The cure time will typically range from about 7 to about 15 minutes, although one of ordinary skill in the art will routinely be able to vary it as needed depending upon the conditions required by the nature of the photoinitiator, the activating irradiation, the resin, and the liquid medium. Although these conditions are typically useful for the initiator in the preferred SLR 800 resin, it will be apparent to one of ordinary skill in the art that other resins may be suited to cure at other wavelengths and conditions. These exemplary conditions are suitable for use with the lamp stabilized at maximum power, and, accordingly, the times required for curing will need to be increased if the lamps have not attained maximum power before flooding. Preferred resins are acrylate and methacrylate resins containing a small percentage of photoinitiator (e.g., less than about 5% and typically about 4% photoinitiator) having an absorption spectrum in the long ultraviolet range, such as the SLR 800 resin. Curing the part while it is immersed in water provides several important advantages. First, the part is maintained at a relatively uniform temperature during the polymerization process. It has been found that temperature changes of a part during post processing steps can lead to distortion of the part. The water conducts the heat away from the part as the exothermic chemical polymerization reaction progresses. Water also absorbs the infrared radiation emitted by the UV lamps, thereby keeping it from being absorbed by the part with attendant risks of heat-induced deformation. Moreover, oxygen inhibits the polymerization process, which effect is particularly pronounced at the surfaces of the part being cured, such that the surfaces tend to retain a certain tackiness. Curing the part under water displaces the oxygen from the surface, improves the surface characteristics, and provides a more efficient surface cure. Yet another advantage provided by the present invention is that the water supports the weight of the part, and accordingly minimizes risk of distortion due to gravitational forces. The new and improved stereolithographic method and apparatus has many advantages over currently used methods for producing plastic objects. The method avoids the need of producing tooling and tooling drawings. The designer can work directly with the computer and a stereolithographic device. When the designer is satisfied with the design as displayed on the output screen of the computer, the designer can fabricate a part for direct examination, with information defining the object being specially processed to reduce curl and distortion, to increase resolution, and strength and accuracy of reproduction. If the design has to be modified as determined by examination of the plastic, three-dimensional part, it can be easily done through the computer, and then another part can be made to verify that the change was correct. If the design calls for several parts with interacting design parameters, the method becomes even more useful because all of the part designs can be quickly changed and made again so that the total assembly can be made and examined, repeatedly if necessary. After the design is complete, part production can begin immediately, so that the usual weeks and months between design and production are avoided. Ultimate production rates and parts costs should be similar to current injection molding costs for short run production, with even lower labor costs than those associated with injection molding. Injection molding is typically economical only when large numbers of identical parts are required. Stereolithography is particularly useful for short run production because the need for tooling is eliminated and production set-up time is minimal. Likewise, design changes and custom parts are easily provided using the technique. Because of the ease of making parts, stereolithography can allow plastic parts to be used in many places where metal or other material parts are now used. Moreover, it allows plastic models of objects to be quickly and economically provided, prior to the decision to make more expensive metal or other material parts. The present invention satisfies a long existing need in the art for a CAD and CAM system capable of rapidly, reliably, accurately and economically designing and fabricating three-dimensional plastic parts and the like and in providing enhanced post curing. It will be apparent from the foregoing that, while particular forms of the invention have been illustrated and described, various modifications can be made without departing from the spirit and scope of the invention. Accordingly, it is not intended that the invention be limited, except as by the appended claims. Patent Citations
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HSA Version 1.0 arrived today
Subject: General Tech | March 17, 2015 - 01:18 PM | Jeremy Hellstrom
Tagged: hsa foundation, hsa, amd, arm, Samsung, Imagination Technologies, HSAIL
We have been talking about the HSA foundation since 2013, a cooperative effort by AMD, ARM, Imagination, Samsung, Qualcomm, MediaTek and TI to design a heterogeneous memory architecture to allow GPUs, DSPs and CPUs to all directly access the same physical memory. The release of the official specifications today are a huge step forward for these companies, especially for garnering future mobile market share as physical hardware apart from Carrizo becomes available.
Programmers will be able to use C, C++, Fortran, Java, and Python to write HSA-compliant code which is then compiled into HSAIL (Heterogeneous System Architecture Intermediate Language) and from there to the actual binary executables which will run on your devices. HSA currently supports x86 and x64 and there are Linux kernel patches available for those who develop on that OS. Intel and NVIDIA are not involved in this project at all, they have chosen their own solutions for mobile devices and while Intel certainly has pockets deep enough to experiment NVIDIA might not. We shall soon see if Pascal and improvements Maxwell's performance and efficiency through future generations can compete with the benefits of HSA.
The current problem is of course hardware, Bald Eagle and Carrizo are scheduled to arrive on the market soon but currently they are not available. Sea Islands GPUs and Kaveri have some HSA enhancements but with limited hardware to work with it will be hard to convince developers to focus on programming HSA optimized applications. The release of the official specs today is a great first step; if you prefer an overview to reading through the official documents The Register has a good article right here.
"The HSA Foundation today officially published version 1.0 of its Heterogeneous System Architecture specification, which (if we were being flippant) describes how GPUs, DSPs and CPUs can share the same physical memory and pass pointers between each other. (A provisional 1.0 version went live in August 2014.)"
Here is some more Tech News from around the web:
- Droidberry dangles: Why the BlackBerry-Samsung alliance is big potatoes @ The Register
- BlackBerry: FREAK SSL bug affects BES, BBM and BlackBerry smartphones @ The Inquirer
- Apple will pay you to ditch your Android or BlackBerry smartphone @ The Inquirer
- Ext4 Filesystem Improvements to Address Scaling Challenges @ Linux.com
- Microsoft gives EMET divine powers to repel God Mode attack @ The Register
- Microsoft RE-BORKS Windows 7 patch after reboot loop horror @ The Register
- Fujitsu Could Help Smartphone Chips Run Cooler @ Slashdot
- Gigabyte announces financial results for 2014 @ DigiTimes
- 3D Audio Standard Released @ Slashdot
- NikKTech And Nanoxia Spring Break EU Giveaway
Filling the Product Gaps
In the first several years of my PCPer employment, I typically handled most of the AMD CPU refreshes. These were rather standard affairs that involved small jumps in clockspeed and performance. These happened every 6 to 8 months, with the bigger architectural shifts happening some years apart. We are finally seeing a new refresh of the AMD APU parts after the initial release of Kaveri to the world at the beginning of this year. This update is different. Unlike previous years, there are no faster parts than the already available A10-7850K.
This refresh deals with fleshing out the rest of the Kaveri lineup with products that address different TDPs, markets, and prices. The A10-7850K is still the king when it comes to performance on the FM2+ socket (as long as users do not pay attention to the faster CPU performance of the A10-6800K). The initial launch in January also featured another part that never became available until now; the A8-7600 was supposed to be available some months ago, but is only making it to market now. The 7600 part was unique in that it had a configurable TDP that went from 65 watts down to 45 watts. The 7850K on the other hand was configurable from 95 watts down to 65 watts.
So what are we seeing today? AMD is releasing three parts to address the lower power markets that AMD hopes to expand their reach into. The A8-7600 was again detailed back in January, but never released until recently. The other two parts are brand new. The A10-7800 is a 65 watt TDP part with a cTDP that goes down to 45 watts. The other new chip is the A6-7600K which is unlocked, has a configurable TDP, and looks to compete directly with Intel's recently released 20 year Anniversary Pentium G3258.
HSA on Linux
Subject: General Tech | July 11, 2014 - 02:36 PM | Jeremy Hellstrom
Tagged: linux, hsa, amd, open source
Open source HSA has arrived for the Linux kernel with a newly released set of patches which will allow Sea Islands and newer GPUs to share hardware resources. These patches are both for a sample driver for any HSA-compatible hardware and the river for Radeon GPUs. As the debut of the Linux 3.16 kernel is so close you shouldn't expect to see these patches included until 3.17 which should be released in the not too distant future. Phoronix and Linux users everywhere give a big shout of thanks to AMD's John Bridgman for his work on this project.
"AMD has just published a massive patch-set for the Linux kernel that finally implements a HSA (Heterogeneous System Architecture) in open-source. The set of 83 patches implement a Linux HSA driver for Radeon family GPUs and serves too as a sample driver for other HSA-compatible devices. This big driver in part is what well known Phoronix contributor John Bridgman has been working on at AMD."
Here is some more Tech News from around the web:
- Things that make you go hmm: GlobalFoundries hires ex-IBM chip fabber @ The Register
- Microsoft uncovers bogus SSL certificates, urges users to beware of cyber attacks @ The Inquirer
- Gameover Zeus malware returns stronger than ever @ The Inquirer
- How to Operate Linux Spycams With Motion @ Linux.com
- PAPAGO! Dashcam P2PRO 1080p Review @ OCC
Fully Enabling the A10-7850K while Utilizing a Standalone GPU
Subject: Processors | July 9, 2014 - 05:42 PM | Josh Walrath
Tagged: nvidia, msi, Luxmark, Lightning, hsa, GTX 580, GCN, APU, amd, A88X, A10-7850K
When I first read many of the initial AMD A10 7850K reviews, my primary question was how would the APU act if there was a different GPU installed on the system and did not utilize the CrossFire X functionality that AMD talked about. Typically when a user installs a standalone graphics card on the AMD FM2/FM2+ platform, they disable the graphics portion of the APU. They also have to uninstall the AMD Catalyst driver suite. So this then leaves the APU as a CPU only, and all of that graphics silicon is left silent and dark.
Who in their right mind would pair a high end graphics card with the A10-7850K? This guy!
Does this need to be the case? Absolutely not! The GCN based graphics unit on the latest Kaveri APUs is pretty powerful when used in GPGPU/OpenCL applications. The 4 cores/2 modules and 8 GCN cores can push out around 856 GFlops when fully utilized. We also must consider that the APU is the first fully compliant HSA (Heterogeneous System Architecture) chip, and it handles memory accesses much more efficiently than standalone GPUs. The shared memory space with the CPU gets rid of a lot of the workarounds typically needed for GPGPU type applications. It makes sense that users would want to leverage the performance potential of a fully functioning APU while upgrading their overall graphics performance with a higher end standalone GPU.
To get this to work is very simple. Assuming that the user has been using the APU as their primary graphics controller, they should update to the latest Catalyst drivers. If the user is going to use an AMD card, then it would behoove them to totally uninstall the Catalyst driver and re-install only after the new card is installed. After this is completed restart the machine, go into the UEFI, and change the primary video boot device to PEG (PCI-Express Graphics) from the integrated unit. Save the setting and shut down the machine. Insert the new video card and attach the monitor cable(s) to it. Boot the machine and either re-install the Catalyst suite if an AMD card is used, or install the latest NVIDIA drivers if that is the graphics choice.
Windows 7 and Windows 8 allow users to install multiple graphics drivers from different vendors. In my case I utilized a last generation GTX 580 (the MSI N580GTX Lightning) along with the AMD A10 7850K. These products coexist happily together on the MSI A88X-G45 Gaming motherboard. The monitor is attached to the NVIDIA card and all games are routed through that since it is the primary graphics adapter. Performance seems unaffected with both drivers active.
I find it interesting that the GPU portion of the APU is named "Spectre". Who owns those 3dfx trademarks anymore?
When I load up Luxmark I see three entries: the APU (CPU and GPU portions), the GPU portion of the APU, and then the GTX 580. Luxmark defaults to the GPUs. We see these GPUs listed as "Spectre", which is the GCN portion of the APU, and the NVIDIA GTX 580. Spectre supports OpenCL 1.2 while the GTX 580 is an OpenCL 1.1 compliant part.
With both GPUs active I can successfully run the Luxmark "Sala" test. The two units perform better together than when they are run separately. Adding in the CPU does increase the score, but not by very much (my guess here is that the APU is going to be very memory bandwidth bound in such a situation). Below we can see the results of the different units separate and together.
These results make me hopeful about the potential of AMD's latest APU. It can run side by side with a standalone card, and applications can leverage the performance of this unit. Now all we need is more HSA aware software. More time and more testing is needed for setups such as this, and we need to see if HSA enabled software really does see a boost from using the GPU portion of the APU as compared to a pure CPU piece of software or code that will run on the standalone GPU.
Personally I find the idea of a heterogeneous solution such as this appealing. The standalone graphics card handles the actual graphics portions, the CPU handles that code, and the HSA software can then fully utilize the graphics portion of the APU in a very efficient manner. Unfortunately, we do not have hard numbers on the handful of HSA aware applications out there, especially when used in conjunction with standalone graphics. We know in theory that this can work (and should work), but until developers get out there and really optimize their code for such a solution, we simply do not know if having an APU will really net the user big gains as compared to something like the i7 4770 or 4790 running pure x86 code.
In the meantime, at least we know that these products work together without issue. The mixed mode OpenCL results make a nice case for improving overall performance in such a system. I would imagine with more time and more effort from developers, we could see some really interesting implementations that will fully utilize a system such as this one. Until then, happy experimenting!
AMD's Bald Eagle; 4K casino games anyone?
Subject: General Tech | May 21, 2014 - 03:06 PM | Jeremy Hellstrom
Tagged: amd, Bald Eagle, embedded, hsa
AMD has just introduced their powerful new embedded chip called Bald Eagle. Depending on the model of processor you purchase you get two or four Steamroller CPU cores, and up to eight GCN GPU cores based on the HD 9000 series. That gives the higher end chips enough juice to power up to four independent 3D, 4K, or HD displays which you can bump up to nine if you include an embedded Radeon E8860 discrete GPU in your system. The cores are all fully HSA compliant and will support ECC and non-ECC DDR3 at speeds of up to 2133MHz as well as support for PCIe Gen3 x16, PCIe Gen2 2x4 and USB and SATA as well. Check out more at The Inquirer.
"Bald Eagle also enables heterogeneous system architecture (HSA), which first appeared in AMD chippery in its desktop Kaveri APUs this January, and which allows the CPU and GPU to share the same system memory, vastly simpifying the programming challenge of getting GPUs to shoulder the parallel-processing chores that they excel at far better then CPUs."
Here is some more Tech News from around the web:
- Windows Phone Live: Microsoft's plans for enterprise on mobile @ The Register
- NVIDIA On Ubuntu 14.04 Has Some New Advantages Over Windows 8.1 @ Phoronix
- Antec EU Joint Giveaway @ NikKTech
Berlin invades San Francisco; meet the new HSA enabled Opteron
Subject: General Tech | April 17, 2014 - 01:07 PM | Jeremy Hellstrom
Tagged: amd, hsa, berlin, Opteron X-series, Red Hat
Next Wednesday we will get our first look at the HSA enabled Opteron X Series, otherwise known as Berlin. AMD will be unveiling the processor at the Red Hat Summit in San Francisco with an X2100 Opteron running on a Linux environment that is based on the Fedora Project. We have very recently had a chance to see the desktop equivalent, Kaveri, in action but this will be the first example of AMD's heterogeneous computing on a server. Keep your eyes peeled for our coverage, in the mean time you can get a preview at The Register.
"AMD will give the first public demo of its second-generation Opteron X-Series server processor, code-named "Berlin", at the Red Hat Summit in San Francisco on Wednesday."
Here is some more Tech News from around the web:
- Microsoft reissues Windows 8.1 Update for enterprise customers @ The Register
- Learn How to Contribute to the Linux Kernel, Take the Eudyptula Challenge @ Linux.com
- Delays in OLED TV shipments impede growth of OLED material market, says DisplaySearch @ DigiTimes
- Samsung Galaxy S5 fingerprint scanner hacked in just 4 DAYS @ The Register
- Steam vulnerability allows hackers to bypass security and swipe account data @ The Inquirer
AMD announces Garlic and Onion flavours on their first HSA chips
Subject: Processors | January 14, 2014 - 02:52 PM | Jeremy Hellstrom
Tagged: a10-6700, a8-6500, a8-7600, amd, APU, hsa, i3-4330, Kaveri
Not only are the first Kaveri reviews arriving today, the A10-7850K is up for sale on both NewEgg and Amazon and the A10-7700K is available on NewEgg. This new part, at 45W competes favourably with the previous 100W Trinity APU in most tests and when Ryan boosted it to 65W it gained a little more. The Steamroller cores have been updated but not in a way that has a huge effect on CPU performance, on the other hand the 384 SIMD units composing the GPU portion of this chip are quite impressive, 1080p gaming of current generation titles is possible on this chip and we haven't seen it's big brother with 512 SIMD units yet. In the Tech Report's review you can see that BF4 is playable on this chip and this is not the Mantle version optimized for AMD's new architecture. It is also a pity that Thief was unavailable to see just what TrueAudio is capable of. Unfortunately this chip will not find its home in gamers dream machines, that is simply not where AMD is targeting its CPUs. However, for SFF systems that need to be energy efficient and where a discrete GPU is to big to fit Kaveri will usher in a new level of performance.
"AMD's next-generation APU packs in a ton of innovation, including updated "Steamroller" CPU cores, GCN graphics, and advanced HSA features. But is it enough to restore AMD's competitiveness in desktop processors?"
Here are some more Processor articles from around the web:
- AMD A10-7850K Kaveri: Windows 8.1 vs. Ubuntu Linux @ Phoronix
- AMD A10-7850K Kaveri: The Linux Introduction @ Phoronix
- AMD Kaveri APU Architecture Overview @ Benchmark Reviews
- AMD Kaveri A10 7850K & A8 7600 Review @ Hardware Canucks
The AMD Kaveri Architecture
Kaveri: AMD's New Flagship Processor
How big is Kaveri? We already know the die size of it, but what kind of impact will it have on the marketplace? Has AMD chosen the right path by focusing on power consumption and HSA? Starting out an article with three questions in a row is a questionable tactic for any writer, but these are the things that first come to mind when considering a product the likes of Kaveri. I am hoping we can answer a few of these questions by the end of this article, but alas it seems as though the market will have the final say as to how successful this new architecture is.
AMD has been pursuing the "Future is Fusion" line for several years, but it can be argued that Kaveri is truly the first "Fusion" product that completes the overall vision for where AMD wants to go. The previous several generations of APUs were initially not all that integrated in a functional sense, but the complexity and completeness of that integration has been improved upon with each iteration. Kaveri takes this integration to the next step, and one which fulfills the promise of a truly heterogeneous computing solution. While AMD has the hardware available, we have yet to see if the software companies are willing to leverage the compute power afforded by a robust and programmable graphics unit powered by AMD's GCN architecture.
(Editor's Note: The following two pages were written by our own Josh Walrath, dicsussing the technology and architecture of AMD Kaveri. Testing and performance analysis by Ryan Shrout starts on page 3.)
Process Decisions
The first step in understanding Kaveri is taking a look at the process technology that AMD is using for this particular product. Since AMD divested itself of their manufacturing arm, they have had to rely on GLOBALFOUNDRIES to produce nearly all of their current CPUs and APUs. Bulldozer, Piledriver, Llano, Trinity, and Richland based parts were all produced on GF's 32 nm PD-SOI process. The lower power APUs such as Brazos and Kabini have been produced by TSMC on their 40 nm and 28 nm processes respectively.
Kaveri will take a slightly different approach here. It will be produced by GLOBALFOUNDRIES, but it will forego the SOI and utilize a bulk silicon process. 28 nm HKMG is very common around the industry, but few pure play foundries were willing to tailor their process to the direct needs of AMD and the Kaveri product. GF was able to do such a thing. APUs are a different kind of animal when it comes to fabrication, primarily because the two disparate units require different characteristics to perform at the highest efficiency. As such, compromises had to be made.
Continue reading our review of the new AMD Kaveri A8-7600 APU!!
AMD CES 2014 Presentation: Kaveri Goes Official
Subject: Processors | January 7, 2014 - 04:52 AM | Josh Walrath
Tagged: amd, CES, 2014, Kaveri, A10 7850K, A10 7700K, APU, firepro, hsa
This year's AMD CES was actually more interesting than I was expecting. The details of the event were well known, as most Kaveri details have been revealed over the past few months. I was unsure what Lisa Su and the gang would go over, but it was actually more interesting than I was expecting.
This past year has been a big one for AMD. They seem to be doing a lot better than others expected them to, especially with all of the delayed product launches on the CPU side for quite a few years. This year saw the APU take a pretty prominent place in the industry with the launch of the latest generation consoles from Sony and Microsoft. AMD made inroads with mobile form factors with a variety of APUs. The HSA Foundation members have grown and HSA members ship two out of every three connected, smart devices. Apple also includes Firepro graphics cards with all of their new Mac Pros.
Kaveri is of course the big news here. AMD feels that this is the best APU yet. The combination of Steamroller CPU cores, GCN graphics compute cores, HSA, hUMA, HQ, TrueAudio, Mantle support, PCI-E 3.0 support, and a configurable TDP makes for a pretty compelling product. AMD has shuffled some nomenclature about by saying that Kaveri, at the top end, is comprised of 12 compute cores. These include 4 Steamroller cores and 8 GCN compute clusters. Each compute cluster matches the historical definition of a core, but of course it looks quite a bit different than a traditional x86 core.
We have gone over Kaveri pretty extensively in the past. The CPU is clocked at 3.7 GHz with a 4 GHz boost. The graphics portion clocks in at 720 MHz. It can support up to DDR-3 2400 MHz memory, which is really needed to extract as much performance out of this new APU. Benchmarks provided by AMD show this product to be a big jump from the previous Richland, and in these particular benchmarks are quite a bit faster than the competing i5 4670K.
Gaming performance is also improved. This APU can run most current applications at 1080P resolutions with low to medium quality settings. Older titles can be run at 1080P with Medium to High/Extreme settings. While this processor is rated at around 867 GFLOPS, which is around 110 GFLOPS greater than the previous top end Richland, it is more efficient at delivering that theoretical performance. It looks to be a significant improvement all around.
Software support is improving with applications from companies like Adobe, The Document Foundation, and Nuance. These cover HSA applications and in Nuance's case, using the TrueAudio portion to clean up and accelerate voice recognition. TrueAudio is also being supported in five upcoming games. This is not a huge amount, but it is a decent start for this new technology.
Mantle is gaining a lot more momentum with support from 3 engines, 5 developers, and 20+ games in development. They showed off Battlefied 4 running Mantle on a Kaveri APU for the first time publicly. They mentioned that it ran 45% faster than Direct3D at the same quality levels on the same hardware. The display showed frame rates up in the low 50 fps area.
AMD is continuing to move forward on their low power offerings based on Beema and Mullins. Lisa claims that these parts are outperforming the Intel Baytrail offerings in both CPU performance and graphics. Unfortunately, she mentioned noting about the power consumption associated with these results. They showed off the Discovery tablet as well as a fully functional PC that was the size of a large cellphone.
They closed up the even by talking about the Surround House 2. This demo looks significantly better than the previous iteration we saw last year. This features something like a 34.2 speaker setup in a projected dome. It is much more complex than the House from last year, but the hardware running it all is rather common. A single high end Firepro card running on a single A10 7850K. The demo is also one of the first shows of a 360 degree gesture recognition setup.
AMD has come a long way since hitting rock bottom a few years back. They continue to claw their way back to relevance, and they hope that Kaveri will help them regain a foothold in the computing market. They are certainly doing well in the graphics market, but the introduction of Kaveri should help them gain more momentum in the CPU/APU market. We have yet to test Kaveri on our own, but initial results look promising. It is a better APU, but we just don't know how much better so far.
PC Perspective's CES 2014 coverage is sponsored by AMD.
Follow all of our coverage of the show at http://pcper.com/ces!
Valve, Cloudius, and HSA Join Linux Foundation (Separately).
Subject: General Tech | December 5, 2013 - 03:03 AM | Scott Michaud
Tagged: linux, valve, SteamOS, hsa foundation, hsa
Valve may very well produce one of the near future's most popular non-mobile, consumer, Linux distributions. SteamOS will be marketed for gaming PCs (some very compelling ones at that) starting next year. CES will definitely be interesting. With such a popular distribution, and as an existing member of the Khronos Group, it makes sense for Valve to join the Linux Foundation... and they just did.
It is still unknown to what extent Valve joined Linux (members are classified by level of contribution from Platinum to Silver) and we likely will not know until their list is updated. While they probably will not be hanging out with Intel and others in the platinum category, Silver is not the most noteworthy of statuses... alongside Barnes and Noble (likely because of the Nook) and Twitter.
Another addition is the HSA Foundation. AMD is already a Gold member (y'know... HSA's faja) and ARM is Silver so I cannot see HSA being much more than that. Still, Linux will be an important focus for the heterogeneous computing architectures to endorse: both in terms of back-end server optimization and customer-facing devices.
Of course I am not belittling any contribution. Still, there is that desire to see Valve lead the pack. Ultimately, though, it is not the size of the badge: it is how you wear it.
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Shawn Chrystopher - Do It For You
Artist: Shawn Chrystopher
Producer: Wyldfyer
Album: IWG 2 Mixtape
Avg Rating: 4.0 ( 14 votes )
The 19th entry in our exclusive freestyle series comes courtesy of Shawn Chrystopher, the up-and-coming emcee who brought us Booth-approved cuts Me and Not Really Here, as well as appearing on R&B singer Mateo's recently-featured mixtape single, Underneath the Sky. The Inglewood, California rapper, who spits over an industry instrumental by Wyldfyer (originally from Luda's I Do It For Hip-Hop) on his brand new Do It For You freestyle, is currently preparing for the May 5th release of his I.W.G. (I Wear Glasses) 2 mixtape, and plans to drop his yet-untitled, independent debut LP sometime this summer.
Shawn Chrystopher DownloadsDJ Booth Freestyle
Written by richard on 03/17/09


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Generally favorable reviews - based on 14 Critics
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Description: What Alice Found movie trailer - starring Judith Ivey, Bill Raymond, Emily Grace, Michael C. Maronna, Jane Lincoln Taylor, Justin Parkinson. Directed by A. Dean Bell. Genre: Drama Rating: R
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