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Apparatus for wafer processing with in situ rinse
A wafer processing apparatus including a head defining an etching chamber, the sidewall of the head being slidable along the base so that the sidewall and base will normally define an etch chamber; and the sidewall may be moved upwardly to open a discharge passage for rinsing water, and a deflecting surface for deflecting the rinsing water downwardly and draining the rinsing water from the passage. The housing is separable above the deflector ring to provide access to the wafer for inserting the wafer and replacing it.
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This invention relates to the rinsing of silicon wafers after completion of etching steps in the processing of such wafers.BACKGROUND OF THE INVENTION
In the processing of silicon wafers for the production of integrated circuit chips, numerous steps are involved, some of which involve etching of the oxide films from the wafers. Etching may be accomplished in various ways, but in many instances it is desirable to utilize gas phase etchants which may include hydrogen fluoride gas or other hydrogen halide gases, in many cases diluted with an inert gas such as nitrogen. The etchant gas may include water vapor necessary to start the etching process.
When the actual etching is completed to the degree desired, it is necessary to rinse the etched surface with deionized water for the removal of any by-products of the rinsing process, i.e., any residiual contamination of phosphorous or particulate.
A standard wet or immersion process of rinsing has several disadvantages. For instance, such prior rinsing processes have the disadvantage of uncontrolled particle levels remaining after the rinse, contamination of the surface by electroplation, or by organic contamination. Of course, rinsing by immersion requires additional space in the production areas which is always a matter of importance in manufacturing operations.SUMMARY OF THE INVENTION
An object of the present invention is to provide for rinsing of a wafer after the completion of etching in a manner to minimize the existence of contamination remaining on the etched surface of the wafer.
A feature of the invention is the performing of the etching and rinsing steps in a single chamber and without handling or moving the wafer between the etch and rinse steps. The chamber requires the gas phase etchant to pass through a membrane to be uniformly applied to the wafer and when the etching is completed, the chamber-defining housing is moved with respect to the wafer to accommodate application of deionized rinse water onto the wafer and simultaneous disposal of the spent rinse water. The wafer remains on its spinning chuck through the rinse.
Subsequently the sequential etch and rinse cycle may be repeated to remove any small amounts of native oxide that may have regrown on the exposed polysilicon surface.
The integrated etch-rinse process, or insitu rinse capability, provides numerous advantages. This rinse process does not add particles to hydrophobic or oxide free wafers. Thick oxide films are removed, ending with very low particle levels; and thin or native oxide layers are removed without adding particles to the remaining surface. The rinse provides removal of device-destroying mobile ion contamination such as sodium, calcium and potassium. Also, the rinse provides for the removal from the wafer surface of electrical lifetime killing metals such as copper, iron, nickel and aluminum. The combination of this rinse is desirable with the use of gas phase etchant which is free of the electroplating properties of aqueous etchant solutions. It is important that the method allows for the application of a final oxide removal process after the rinse, thus providing an ultimate oxide free surface on the wafer.
Of course, integration of the gas phase etching and rinsing without handling the wafer between the etching and rinsing, will save overall process time for the wafer by eliminating transfer time to other operations. Such integration also saves on clean room space for wafer processing due to reduced equipment requirements.BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a section view through the processing apparatus taken substantially at 1--1 of FIG. 2 and having portions broken away for clarity of detail.
FIG. 2 is a section view through the processing apparatus taken approximately at 2--2 of FIG. 1 and having portions broken away for clarity of detail.
FIG. 3 is an enlarged detailed section view taken approximately at 3--3 in FIG. 1.
FIG. 4 is a detailed section view taken along a broken line as indicated substantially at 4--4 in FIG. 2.DETAILED SPECIFICATION
One form of the invention is illustrated in the drawings and is described herein.
The processing apparatus is indicated in general by numeral 10 and includes a head means 11 defining an etching chamber 12, a support means 13 to carry a wafer W being processed; a means 14 for flowing etchant gases into and through the etching chamber; a source 15 of rinsing liquid to be controllably flowed into the etching chamber 12 and across portions of the wafer W after the etching is completed; and also a means 16 for collecting the rinsing liquid which has been flowed over the wafer to carry away any contaminants that may be present.
More specifically, the head means 10 is defined by a housing 17 carried on a support plate 18 on which a superstructure or frame 19 in also affixed. The housing 17 includes a base 20 affixed to the baseplate 18 which has a substantially cylindrical periphery or cylindrical outer wall surface 21. The base 20 has a central opening 22 which receives a drive shaft which is a portion of the support means for the wafer W. The drive shaft has a wafer support or vacuum chuck 24 affixed on its upper end and in the lower portion of the etch chamber 12. The shaft 23 is supported in and driven by a variable speed motor 25 so that the wafer W may be rotated at a wide variety of speeds during the processing of the wafer. For instance, the wafer will be rotated at a low speed of approximately 20 rpm during etching of the wafer; will be rotated at a speed of approximately 500 to 1,500 rpm after the etching is completed and during the rinsing of the wafer; and finally the wafer will be rotated at speeds in the range of 3,000 to 5,000 rpm as the rinsing is completed and while the wafer is being subsequently dried as hereinafter more fully described.
A sealing device 26 receives the drive shaft 23 so as to very tightly seal the exterior of the drive shaft so as to completely isolate the etch chamber 12 and the opening 22 through which the shaft extends, from the ambient at the exterior of the processing apparatus 10.
The drive shaft 23 is hollow to provide a duct or passageway 27 which communicates with the duct or passageway 28 extending through the vacuum chuck 13. The lower or outer end of drive shaft 23 is connected through a rotary union 29 to a supply tube or duct 30. The tube 30 is connected through a valve 31 to alternate sources of vacuum and nitrogen which are connected to the valve by tubes or ducts 32 and 33, respectively. Accordingly, nitrogen may be supplied into the passageway 28 through the wafer support 13; or alternately a vacuum may be drawn on the passageway 28.
The wafer support 13 has a flat round disc 34 on which the wafer W lies during processing of the wafer. The wafer support 13 incorporates a unidirectional check valve 35 so as to close the upper end of passageway 28 when nitrogen gas is supplied under pressure into the passageway 28, at which time the valve element or ball 36 is raised by the flow of nitrogen gas upwardly against a valve seat formed by an O-ring 37 in the passage. Normally, the flow passage 38 through the check valve is open and unobstructed because the valve element 36 is away from the valve seat 37, and the valve element rests upon support surfaces 39 adjacent bypass grooves 40 which allow a vacuum to be drawn through the passages 38 on the wafer W when the vacuum is applied in the passageway 28, thereby holding the wafer stationary on the support 13.
Normally, while etchant gases, including gaseous hydrogen fluoride, water vapor and a diluent such as nitrogen, are in the etch chamber 12, nitrogen will be flowed upwardly through the shaft 27 and passageway 28 and through the check valve 35 at a slow rate of speed so that there is no possibility of the etchant gas flowing downwardly through the passageway 28 and into the source of vacuum. Later during rinsing and high-speed spinning of the wafer, the vacuum is drawn in the passageway 28 and 38 to tightly secure the wafer on the support or wafer chuck 13 to prevent any damage to the wafer during the high-speed rotating.
The opening 22 in the base 20 is supplied with an inert gas such as nitrogen through passages 41 which are connected to a source of nitrogen supplied by the tube 42.
As a part of the head means 11, the housing 17 includes a sidewall 43 which is defined in several segments or portions 44, 45 and 46.
The upper portion 44 of the sidewall is formed integrally with the top wall 47 of the housing and cooperates with the top surface 48 of the base 20 in defining the etching chamber 12 when the housing is entirely closed as illustrated in FIG. 1. The sidewall 44 provides a port 49 through which the etchant gas is supplied into the etch chamber 12. The port 49 is connected by a fitting 50 and supply tube 51 to valving and flow controllers 52, 53 and 54 which are connected with sources of anhydrous hydrogen fluoride gas or other anhydrous hydrogen halide gas, a source of nitrogen or other inert gas, and a source of water vapor which provides the necessary components for the etchant gas for etching the oxides of the wafer W.
The top wall 47 is affixed as by mechanical fasteners to a mounting plate 55 which is fastened to the vertically extendable and rectractable piston rod 56 of a pneumatic cylinder 57 which is secured to the frame 19. The pneumatic cylinder is suitably connected to sources of air under pressure with the capability of raising and lowering the upper portion of the housing 17, including the sidwall 44 and top wall 47.
The sidewall 44 also mounts a diffuser panel 58 which entirely traverses the etch chamber 12 and confronts the wafer W below the level of port 49 for passing the etchant gas therethrough and evenly distributing the gas over the entire surface area of the wafer W. The diffuser 58 may in one form be a plastic membrane with pores in the range of 20 to 50 microns in size, uniformly dispersed across the membrane for passing the etchant gas therethrough. The membrane may be formed of various materials such as polyethylene, or in some cases, polyvinylidene difluoride, also known as PVDF. Alternately, the membrane may be made of polytetrafluoroethylene, also known PTFE and by its trademark Teflon, owned by DuPont. Of course, other forms of diffusers may be used to uniformly spread the etchant gas across the face of the wafer W.
The wall portion 44 has a groove 59 formed therein, beneath the level of the diffuser 58 and extending around the entire periphery of wall 44. The groove 59 serves as a manifold to collect all of the spent etchant gases and discharge the spent etchant gases through a port 60 which is connected to a fitting 61 and discharge tube 62 through which the etchant gases are flowed after they have been passed over the face of the wafer W. The entire periphery of groove 59 is covered by a membrane 63, of material similar to that in the diffuser 58 so that the spent etchant gases will flow outwardly to all peripheral portions of the groove 59, thereby contributing to the uniformity of flow of the etchant gases over the face of the wafer W.
The lower face 64 of the wall portion 44 confronts and seals against the top face 65 of the intermediate wall portion 45 which is also referred to as a deflector ring. The wall portions 44 and 45 are separable, as hereinafter more fully explained, to provide an access port for inserting and subsequently replacing the wafer W prior to and after the end of the etch-rinse processing accomplished by the apparatus 10. In FIG. 1, the upwardly shifted position of the side and top wall portions 44, 47 and of the mounting plate 55 is illustrated in dotted lines; and the upwardly shifted position of the bottom face 64 of the wall portion 44 is illustrated by the dotted line 64'. The space between the dotted line 64' and the face 65 of the deflector ring 45 defines the access opening through which wafers may be inserted and replaced.
The deflector ring 45 has an inner peripheral cylindrical surface 66 which is aligned with and is slidable onto the outer cylindrical surface 21 of the base 20. A peripheral ledge 67 or deflector 45, adjacent the inner periphery of deflector ring 45 normally confronts the rib 68 which is rigid with the base 20 and is sealed thereto by an O-ring seal to prevent the passage of any fluids, either in gaseous or liquid form, when the housing is entirely closed as illustrated in FIG. 1.
Deflector ring 45 also has a downwardly facing and peripheral oblique conical surface 69 which normally cooperates with the lower portion 46 of the sidewall 43 to define the means for collecting spent rinsing liquid indicated in general at numeral 16 and more specifically, in defining the peripheral passage 70 which collects the spent rinsing water as hereinafter more fully described.
The deflector ring 45 also has a rinsing water supply port 71 therethrough and oriented to direct a stream of rinsing liquid or deionized water onto the face of wafer W at the end of the etch cycle. The rinse water port 71 is connected by a tube 72 and a valve 73 to a source of deionized water at tube 74. Valve 73 alternately connects the port 71 and tube 72 to a source of vacuum provided by the duct 75 so as to evacuate the port 71 and tube 72 and remove all of the moisture therefrom at the end of a rinsing and drying cycle and prior to the beginning of another etch cycle.
Wall portion 46, which may be otherwise known as a collecting cup, is affixed at its upper edge portion 76 to the deflector ring 45; and the cup 46 also defines a peripheral groove 77 around its entire circumference as a portion of the collecting passage 70 for receiving rinsing water spilled off the periphery of the wafer W and deflected from the deflector surface 69. A drain port 78 is provided in the cup 46 and is connected by a fitting to a drain tube 79 which extends downwardly from the cup 46 and through a notch 80 formed in the baseplate 18.
A pair of pneumatic cylinders 81 and 82 are mounted on the baseplate 18 and have their piston rods 83 extending through suitable access ports in the baseplate 18 and affixed to the cup 46 by fittings 84. The cup 46 also has a cylindrical inner peripheral surface 85 to receive and slide along the outer cylindrical surface 21 of the base 20. The cylinders 81 and 82 are suitably connected to sources of air for extending and retracting the piston rods, to raise and lower the cup ring 46.
The processing apparatus is also to be used with suitable robotic water handling devices for inserting and removing the wafer W into and from the chamber 12. A positioning arm or fork 86 operated by a rodless cylinder 87 is also attached to the baseplate 18 and arranged to accurately position the wafer W on the wafer support or chuck 24 in order to accommodate high-speed spinning of the wafer without any likelihood of damaging the wafer.OPERATION
Assuming that a wafer W has been placed on the support or wafer chuck 24, the processing apparatus is operated substantially as follows. The housing 17 is in closed condition, substantially as illustrated in FIG. 1, wherein the edge of the wafer is opposite the groove 59, and the inner periphery of the deflector ring 45 is sealed against the rim 68 of the base, and the faces 64 and 65 of the wall portion 44 and the deflector ring 45 are sealed against each other. The chamber will be purged of all air as the cycle is started by flowing nitrogen into the chamber which also flows through the membrane or diffuser 58, across the diaphragm and out through the groove 59 and discharge port 60. At this time, nitrogen is also flowing inwardly through the ports 41 and the opening 22 in base 20 so that nitrogen flows around the lower side of the wafer, thereby purging all of the air from the chamber. The rinsing port or duct 71 is empty and closed and the entire interior of the head is completey dry.
When purging is complete a presribed etchant gas, preferably comprising a portion of anhydrous hydrogen fluoride gas, a diluent inert gas preferably nitrogen, and a small portion of water vapor is flowed into the etch chamber for a prescribed length of time, depending upon the amount of etching of the oxide film on the wafer which is to be accomplished. During the etching process, the wafer chuck 24 is revolved by the motor at a slow speed, in the range of 20 rpm, and no vacuum is applied for purpose of holding the wafer on the wafer chuck; but on the other hand, during the etching process, nitrogen is supplied through the passage 27 in the shaft 23, and through the opening 28 in the wafer chuck so that a rather small flow of nitrogen continues all during the etching so as to specifically prevent the migration of any of the etchant gas downwardly through the shaft 28 which might otherwise occur had the nitrogen not been flowing. During the etching phase of the cycle, nitrogen continues to flow from the ports 41 through the central opening 22 of the base and around the bottom face of the wafer, thereby preventing or minimizing any etching of the bottom face of the wafer. As the etchant gas is diffused by the diffuser 58, it passes through the membrane 58 and is uniformly applied across the entire face of the wafer W. As the etchant gas flows across the face of the wafer, it will pass outwardly through the membrane 63 and into the peripheral groove 59 and be discharged outwardly through the port 60 and tube 62.
When the necessary time has elapsed during the etching phase of the cycle, the flow of the etchant gas is terminated, and the flow of nitrogen from the source controller 53 will continue to flow, and the continued flow of nitrogen, but without the hydrogen fluoride gas, will purge the etch chamber of the etchant gas.
When purging of the chamber 12 has been completed after the etching phase of the cycle, the pneumatic cylinders 81 and 82 are operated to raise the entire housing from the position illustrated in FIG. 1 to the position illustrated in FIG. 2. In this position of the housing, the wafer chuck 24 and the edge of the wafer W is directly opposite the entrance to the port 70 and directly opposite the deflection surface 69. The drain tube 79 is open and unobstructed to allow drainage of any collected rinsing liquid which is to be applied during a rinsing phase of the cycle. In preparation for rinsing, the valve 31 is operated to apply vacuum pressure to the wafer chuck 24 as to hold the wafer securely on the wafer chuck; and when the vacuum has been applied, the motor accelerates the wafer to rotate the wafer in the range of 500 to 1,500 rpm. At this time, rinsing liquid, preferably deionized water, is supplied from the source 74 through the valve 73 and port 71 into the chamber 12, and the deionized water is directed onto the upper face of the wafer to be flowed entirely across the upper face of the wafer. The high speed of rotation of the wafer causes the rinsing liquid to be slung by centrifugal force outwardly into the passage 70 and onto the deflector face 69 so that the rinsing liquid is collected at the bottom of the passage and will be immediately drained off through the drain port 78 and tube 79.
After completion of the rinse step in the cycle, flow of the rinsing water through duct 71 is terminated, and the valve 73 is operated to draw a vacuum onto the duct 71, thereby sucking out all of the moisture that may remain in the line. At this same time, the nitrogen from the source and controller 53 is continued so as to supply drying nitrogen into the chamber 12 and cause flow of the drying nitrogen through the chamber and out through the passage 70. During this flow of the nitrogen and after the completion of the rinsing phase of the cycle, the motor 25 is again accelerated to rotate the wafer W at speeds in the range of 3,000 to 4,000 rpm. During this drying phase of the cycle, the cylinders 81 and 82 continue to hold the sidewalls of the housing in the upwardly shifted position as illustrated in FIG. 2; and of course nitrogen continues to flow through the ducts 41 and through the opening 22 in the base 20 so that drying nitrogen will flow through all portions of the chamber.
Subsequent to the drying, it may be desirable to repeat the etching phase of the cycle to remove small portions of native oxide that may have regrown on the face of the wafer. Accordingly, the cyliners 81 and 82, in preparation for renewing the etching phase of the cycle, will withdraw their piston rods to lower the sidewalls and upper portion of the housing into the position of FIG. 1 again wherein the ledge 67 of the deflector ring is sealed against the external rib 68 of the base, and then the entire etch chamber will again be sealed. The chamber will be purged with continued flow of nitrogen from the controller 53 and the etching phase of the cycle will be repeated as hereinbefore described. Of course, after the etching phase is completed, the rinsing phase is again repeated as previously described.
After the end of the rinsing phase and drying phase of the cycle, it may be determined that processing of the wafer is completed, so that the wafer should be removed from the processing apparatus. The pneumatic cylinder 57 is then operated so as to hold the wall portion 44 and the upper wall 47 in the position illustrated in the FIG. 2. The deflector ring 45 and cup ring 46, being at that time in the upwardly shifted position illustrated in FIG. 2, will be lowered by operation of the cylinders 81 and 82 so that the rings 45 and 46 assume the position illustrated in FIG. 1. The upper portion of the housing remains in the upwardly shifted position illustrated by the dotted lines in FIG. 1 so that the confronting faces 64 and 65 of the wall portions 44 and deflector ring 45 are thereby separated to open an access port therebetween through which access to the wafer can be had for removal of the wafer and replacing of the wafer with another.
Finally, when the wafer has been replaced and its position adjusted by the arm or fork 86, the air cylinder 57 is again operated to lower the wall portion 44 onto the deflector ring 45, as to close the etch chamber again in preparation for the etching phase of another cycle.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. Therefore, the illustrated embodiments should be considered in all respects as illustrative and not restrictive, reference being made to the appended claims rather than to the foregoing description to indicate the scope of the invention.
1. Apparatus for etching and rinsing a single semiconductor wafer, comprising
- head means defining an etching chamber capable of being opened and closed to permit a wafer to be loaded into and removed from the chamber,
- support means mounting a wafer in the chamber, said support means being capable of rotating the wafer,
- means flowing and interrupting flow of etchant gas and other gas through the chamber and across at least a portion of the wafer,
- a source of rinsing liquid comprising a duct into the etching chamber to direct the rinsing liquid onto and across the wafer,
- and means collecting the rinsing liquid from the chamber.
2. Apparatus according the claim 1 wherein the head means comprises
- base means and wall means defining the etching chamber, the wall means having a peripheral rinsing liquid receiving passage opposite the support means for collecting the rinsing liquid slung from the rotating wafer.
3. Apparatus according o claim 1 wherein the head means comprises a peripheral wall with open passage means opposite the support means and extending around at least a portion of the wall to receive rinsing liquid slung from the rotating wafer, and means restricting flow of gases from the chamber and through the passage.
4. Apparatus according to claim 1 wherein the head means comprises a peripheral wall with open passage means opposite the support means and extending around at least a portion of the wall to receive rinsing liquid slung from the rotating wafer, and means closing said passage with respect to the etching chamber.
5. Apparatus according to claim 1 wherein the head means comprises a peripheral wall with open passage means around at least a portion of the wall adjacent the support means to receive rinsing liquid slung from the rotating wafer, the support means and peripheral wall being relatively movable with respect to each other whereby the wafer may be alternately located opposite the open passage and away from the passage.
6. Apparatus according to claim 2 wherein the base means and wall means are relatively movable with respect to each other whereby the base means alternately closes and opens flow communication between the chamber and the passage.
7. Apparatus according to claim 2 wherein said wall means further comprises a peripheral deflector surface obliquely oriented adjacent the support means and wafer to deflect rinsing liquid away from the wafer.
8. Apparatus according to claim 5 and the peripheral wall comprises upper and lower portions separable from each other to define an access port into the chamber for accessing the wafer.
9. Apparatus according to claim 8 and the support means and peripheral wall being relatively movable to position the wafer at various locations along the wall whereby the wafer may be alternately located opposite the open passage and opposite the access port.
10. Apparatus for etching and rinsing a semiconductor wafer comprising
- a housing comprising a closed etching chamber and a peripheral sidewall enclosing the chamber,
- rotatable support means in the etching chamber suitable for mounting and rotating such a wafer,
- means flowing and interrupting flow of etchant gas and other gas through the chamber and across at least a portion of the wafer,
- means directing rinsing liquid into the etching chamber and onto and across the wafer on the support means, and
- the peripheral sidewall comprising open passage means around at least a portion of the sidewall and opposite the rotatable support means and wafer to receive rinsing liquid slung from the rotating wafer.
11. Apparatus according to claim 10 wherein the housing also comprises a base portion relatively slidable along the peripheral sidewall to open and close the open passage means.
12. Apparatus according to claim 10 wherein the peripheral sidewall also comprises a deflector surface portion in said open passage means, the deflector surface portion being oriented obliquely to the peripheral sidewall to obliquely deflect liquid particles slung from the rotating wafer.
13. Apparatus according to claim 11 wherein said rotatable support means is on the base portion, the wafer and support means having an alternate position relative to the peripheral sidewall when relative movement between the base and sidewall closes the passage means, and the peripheral sidewall also comprising a gas outlet manifold portion extending around at least a portion of the sidewall and located opposite said alternate position of the support means to receive the gases after the gases have flowed across the portions of the wafer.
14. Apparatus according to claim 13 wherein the housing sidewall comprises an upper portion separable from adjacent portions of the sidewall at a joint adjacent the manifold portion, the sidewall defining an access opening at said joint when the upper portion is separated from the adjacent portions of the sidewall to facilitate moving a wafer into and out of the etching chamber.
|April 1973
|November 1973
|November 9, 1976
|April 8, 1980
|October 28, 1980
|October 1, 1985
|May 20, 1986
|July 28, 1987
|July 28, 1987
|September 8, 1987
|June 14, 1988
|Inuta et al
|December 20, 1988
|January 31, 1989
|June 13, 1989
|Nishisa et al.
|August 15, 1989
- Then, W., "Apparatus For Cleaning & Drying Wafers", IBM Technical Disc. Bulletin, vol. 25, No. 6, Nov. 1982, pp. 2735. Skidmore, K., "Cleaning Techniques For Wafer Surfaces", Semiconductor International, Aug. 1987 pp. 80-85.
Type: Grant
Filed: Jan 26, 1990
Date of Patent: Dec 8, 1992
Assignee: FSI International, Inc. (Chaska, MN)
Inventors: Rex L. Biggerstaff (Lubbock, TX), Charles W. Skinner (Lubbock, TX), Daniel J. Syverson (Robbinsdale, MN), Mark L. Jenson (Princeton, MN), James G. Kegley (St. Paul, MN)
Primary Examiner: Olik Chaudhuri
Assistant Examiner: G. Fourson
Law Firm: Palmatier & Sjoquist
Application Number: 7/470,871
International Classification: B08B 302; B08B 500; B21F 4100;


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3 Weight Loss Tricks That Don't Work!
While there are many fad diets out there designed to help you lose weight 'fast', there are also certain 'tricks' that have been floating around for years that apparently help with weight loss. While there are many opinions out there on how to lose weight, as I have always said the best way to do so is sustainably. This is through eating a healthy diet and exercising regularly.
If you are trying to lose weight, here are three things you definitely should NOT do:
Cut Out All Carbs
Cutting out carbs, or any food groups for that matter, is not a sustainable goal for your body and may not actually help you lose weight. When we cut out entire food groups we lack certain nutrients that allow our bodies to function at their best. In addition, by doing this we may be depriving ourselves and eventually may result in binging because we can't sustain this type of diet. The only way to lose weight successfully is to follow a healthy balanced diet that keeps you satisfied and not feel like you are missing out!
Skipping Meals
Another popular 'trick' that many people think will help them lose weight fast is skipping meals. This is probably one of the most common things people do, thinking it will help drop that kilo or two for the weekend. However what many people are not aware of, is the effects skipping meals has on your body other than potential weight loss. These include slowing down your metabolism and overeating, which may lead to weight gain. On top of this you will probably feel lethargic and cranky as your body has no source of energy to run on.
Focusing On Only Exercise
This is also a big one that many people think will achieve them great results. While exercise is a crucial part of a sustainable way to lose weight, it is not the ONLY part. You can exercise all you like, but if you are eating a bad diet full of fat, sugar and processed foods — it will only take you so far. There are many people out there with the mentality that it is okay to eat 7 donuts in one sitting because they will go for a run straight after. While the intention is good, this isn't a great way to lose weight and achieve the results you really want. The key to weight loss is moderation and balance. If you feel like a donut, go ahead and have one without depriving yourself — but don't get into the bad habit of eating anything you like thinking you can out-exercise yourself. This may leave you feeling dejected and upset with the results you aren't likely to see.
Remember girls, weight loss isn't a quick or easy process. It requires patience, effort and dedication. It may take a while, but if done correctly can be sustainable for your entire life. Don't make yourselves miserable all for a quick fix — it really isn't worth it!
* Results may vary. Strict adherence to the nutrition and exercise guide are required for best results.

subset: commoncrawl


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Monthly Archives: October 2014
Christmas Survival Kit – October Bonus Project for Craft Project Central
Christmas is fast approaching and there are always those last minute cards you forget to send or gifts you need to give and you're out of time! Oh no! Well this Christmas Survival Kit includes five cards with envelopes, four gift bags, 10 gift tags, and 8 gift card holders as well as space to … Continue reading
Stampin' Up Weekly Deals & Monthly Specials!
Weekly Deals Prices good October 28 – November 3, 2014. Click on the picture below to take advantage of these great deals! (Of course the Autumn Traditions Kit I bought last week is on sale!) Project Life by Stampin' Up! Giveaway! Stampin' Up is doing a Project Life by Stampin' Up! Giveaway and one lucky … Continue reading
Holiday Cheer Tag
Tammy has a fun sketch for us over at Nacho Average Challenges this week. Don't you just love the little tag in the corner? I thought this would be a great sketch to use one of the specialty sheets that comes with the All is Calm Designer Series Paper. I think the silver and Lost … Continue reading
Pudding Eating Contest Scrapbook Page
Jeanna has her first challenge up over at MDS Monday this week and it's really fun! It has several blocks for photos and paper that could work for any occasion. I had three great pictures from the Pudding Eating Contest at the Harvest Festival last weekend (before, during, and after) that I knew would work … Continue reading
Autumn Wreath for Craft Project Central
It's time to create something fun for your autumn home décor! This wreath screams fall with its warm colors, feathers and touches of raffia. The great thing about this design, you can easily use other Designer Series Paper for summer, spring or winter! It's a versatile design. Happy Crafting! This lovely project comes to you designed by Jen … Continue reading
Thankful for Fall Leaves
Nance has a really fun sketch for us over at The Paper Players this week. I ended up making my card horizontal instead of vertical though, because of the stamp I wanted to use. I had a thought when I first got this Nuts About You set that it would make a great fall tree, … Continue reading
Falling Leaves Thanksgiving Card
I had time last night to make a quick card for this week's Freshly Made Sketches challenge. This is exactly the type of clean sketch that I love. I realized after I made it that this great Tags 4 You set is retired. I'm not sure why I still had it on the shelf, but … Continue reading
Fall Banner & Candle for Craft Project Central
This banner & candle would be wonderful Fall décor for your home. The banner is made with coaster board, and the matching candle is stamped, along with other embellishments. Make one set to keep as your own, and make another set to give as a gift. This would also make a great Fall-themed class. This … Continue reading
Box of Tissues Card
My friend Debbi is hosting today's Hope You Can Cling to Challenge over at Splitcoast Stampers today, and I promised her that I would play along. Her challenge is to use to tissue paper on your card, and she has some great technique ideas. I decided to take the challenge a little more literally, and … Continue reading
New Stampin' Up Holiday Supplement, Weekly Deals, & Monthly Specials!
Holiday Supplement Click to view the PDF, or shop online now. Weekly Deals Prices good October 21-27, 2014. Click on the picture below to take advantage of these great deals! Earn your free Good Greetings Stamp Set now! Now until Oct. 31, you will be able to earn an exclusive Good Greetings Stamp Set when … Continue reading


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The countdown to school is upon us, which means we have limited days to something memorable this Summer!! Checkout the list below! You might make a memory that lasts a lifetime!
1 - Go geocaching
2- Roadtrip with your besties!
3 - Have an all-day Netflix movie marathon
4 - Jam out to a music festival or outdoor concert
5- Organize a scavenger hunt with your friends
6- Sign up for a race
7 - Volunteer
8 - Dare to be amazing! Try something you've never done before.
9 - Do a photo shoot on vaca
10 - Eat a meal with a total stranger
For thousands of other summer bucket list ideas check out these Pinterest article: https://www.pinterest.com/explore/summer-bucket-lists/
Have fun and make a ton of memories!!


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Everybody Desires To Go Home During Further Innings — Perhaps Even The Umps
Enter every day, once at and once at , to your probability to win HGTV Smart Home 2018, a beautiful Lowcountry home in Palmetto Bluff. Tour of the enjoyable out of doors spaces at HGTV Smart Home 2018. f. Subordinate Court – In this possibility, you may search the Caveat utilizing Subordinate Court Identify as search standards. If any of the lively Caveats match the search criteria then the related details are displayed on the display. The relevant Caveat is selected, in order that it may be tagged with the Case. This tab is displayed only if the consumer belongs to an Appellate Institution. iii. On clicking the Advocate Name choice button, enter the Identify of the Advocate within the box, partly (minimum three characters) or full – e.g. for looking out the identify of the advocate as Suresh Mahohar Singh" either Suresh, Manohar, Singh, Sur, Sin etc., can be given.
A house is a building that capabilities as a home for humans four starting from easy dwellings similar to rudimentary huts of nomadic tribes to complex, fixed structures of wooden, brick, or different materials containing plumbing, air flow and electrical systems. 5 6 Most conventional modern houses will at the very least comprise a bed room , toilet , kitchen or cooking space, and a front room In traditional agriculture-oriented societies, home animals resembling chickens or bigger livestock (like cattle) might share a part of the home with people. The social unit that lives in a house is called a household Mostly, a household is a household unit of some form, though households may additionally be other social teams or individuals. The design and structure of homes can also be subject to change as a consequence of globalization, urbanization and other social, financial, demographic, and technological reasons. Various different … Read More


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The September 19, 2012 meeting of the United Port of San Diego's Board of Port Commissioners was packed with the San Diego region's civic leadership, including the Mayor of San Diego, Jerry Sanders. They were at the meeting to see and celebrate the Port taking the next steps in approving the proposed $520 million San Diego Convention Center expansion, as well as an expansion of the adjacent Hilton San Diego Bayfront Hotel. Representatives were there from numerous major business groups in the region, including the San Diego Regional Chamber of Commerce.
Also there was Kevin Dayton, President & CEO of Labor Issues Solutions, LLC. No one there knew or cared, and I finally found a seat in the back corner. I suspected that the law firm of Adams Broadwell Joseph & Cardozo was going to pull a stunt at the meeting on behalf of the San Diego County Building and Construction Trades Council and UNITE HERE Local Union No. 30. Knowing their modus operendi, I figured a lawyer was going to make a huge last-minute document dump at the meeting under the authority of the California Environmental Quality Act (CEQA). I was right!
The party-poopers promptly rained on the parade when the commissioners opened the agenda item to public comment. An official of the UNITE HERE Local Union No. 30 led off the attack by declaring that the 1400-page final Environmental Impact Report required under CEQA was deficient and needed to be withdrawn for revisions. Then someone from the law firm of Adams Broadwell Joseph & Cardozo submitted to the commissioners a 42 page letter (with 197 footnotes) on behalf of the phony union front group called "The San Diego Coalition for A Better Convention Center" with 250 pages of referenced exhibits. She was given extra time to speak because Tom Lemmon – head of the San Diego County Building and Construction Trades Council – submitted a speaker card and then transferred his speaking time to her.
Never to be left out of a militant union action in San Diego, Lorena Gonzalez, head of the San Diego County Central Labor Council, rushed into the meeting late to announce there were problems with the Environmental Impact Report for the convention center. She proposed that the Port Commissioners approve a "tolling agreement" that would extend the statute of limitations for the unions to file a lawsuit. This would give unions more time to squeeze their demands out of the developers and the convention center's public and private partners.
A representative of the leftist San Diego-based Center for Policy Initiatives attended the meeting but did not speak. This group has not been involved in CEQA issues, but it is very involved in labor issues.
I also spoke, as a representative of Labor Issues Solutions, LLC. I noted there was an underlying story and then revealed the whole scheme. Of course, most people in the room knew about it already but do not want to acknowledge it in public.
After these antics, the Port Commissioners recessed the meeting for about 20 minutes so Port staff could scan the document dump by Adams Broadwell Joseph & Cardozo and make a preliminary determination of whether or not the unions introduced new and valid CEQA objections to the proposed convention center and hotel expansion. If the comments were serious threats, the Port Commissioners would need to table the approval of the Environmental Impact Report.
Staff ultimately identified four potential areas vulnerable to lawsuits or appeals, but also indicated how the issues would be addressed. In the end, the Port Commissioners voted unanimously to approve the Environmental Impact Report, while noting that they expected litigation and appeals unless relevant parties were able to make a deal with the unions.
What is the San Diego County Building and Construction Trades Council seeking with its CEQA objections? As I documented in my March 11, 2011 www.thetruthaboutPLAs.com article entitled It's Out in the Open: Project Labor Agreement a Costly Possibility for San Diego Convention Center Expansion, construction union officials want a requirement for construction contractors to sign a Project Labor Agreement as a condition of working on the projects. Presumably UNITE HERE wants some sort of neutrality agreement for union organizing.
It's nothing new in California and nothing new in San Diego. It's "greenmail."
Convention Center Project Takes a Major Step Forward – San Diego Union-Tribune – September 20, 2012
Port Approves Environmental Report For Convention Center Expansion – KPBS – September 19, 2012


text: On Friday at 3:00pm I headed back from Shoreline to Seattle. I had scheduled a 4:00pm meeting with my friend Genessa in Columbia City and a 5:00pm meeting with my friend Molly in Mount Baker. I'm never late, and often have to force myself not to be early. At 3:45pm I had only gotten about…Read more


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Music Web International – http://www.musicweb-international.com/comp-idx/dunhill.htm
Web forum extensively used to review and comment on composers, recordings, events etc. Includes articles: Review of CD: Dunhill Sonata in F (Opus 50), by Stephen Matthews, plus articles on Dunhill by Rob Barnet and Phillip Scowcroft.
The John Ireland Trust – www.johnirelandtrust.org
Holds archive of composer and organist John Ireland, promotes his music, and offers support to associated music events. In June 2012 put on John Ireland in Chelsea, a festival of music by Ireland, Stanford and Ireland's pupils, commemorating 50 years since the composer's death. Dunhill was a lifelong friend of Ireland, ever since they joined the RCM as its then youngest pupils in 1893.
The Associated Board of the Royal Schools of Music (ABRSM) – http://www.abrsm.org/en/home
Dunhill was an early international examiner for the ABRSM from 1906, later going on to selecting the piano syllabus. He wrote numerous pieces to be used for exams, not just for piano, but also for singing and other instruments at levels below Grade 5. Some are still used, including A Song of Erin – possibly the most played piece of music in history . . . ABRSM publishes several collections of music which include Dunhill pieces.
The Royal College of Music – http://www.rcm.ac.uk/
Dunhill became a student of the RCM in 1893, studying piano and composition. He was there as a student until 1899, having gained a scholarship, which enabled him to continue composition under Stanford. He was the (joint) first to be awarded the prestigious Tagore Gold Medal, given to 'the most generally promising student'. After 6 years teaching at Eton, he returned to the RCM as a teacher, and remained connected to the College for the rest of his life, becoming a Fellow eventually. The RCM holds many pieces of Dunhill music, manuscripts and other materials, including his diaries (1893 – 1946).
Stainer & Bell – http://www.stainer.co.uk/index.html
Music publishers, including publishers of Dunhill's song-setting The Cloths of Heaven
New London Chamber Ensemble - www.newlondonchamberensemble.co.uk
London-based chamber ensemble, whose members include Dunhill music in their repertoire: Robert Manasse, flute; Melanie Ragge, oboe, Neyire Ashworth, clarinet, Stephen Stirling, horn; Adam Mackenzie, bassoon
Phoenix Piano Trio – www.phoenixpianotrio.com
Sholto Kynoch, piano; Marie Macleod, cello; Joanathan Stone, violin. Currently include in touring repertoire Dunhill's Piano Trio (single movement) of 1900. The Trio first performed this in a programme including Ireland and Beethoven at the Wigmore Hall, London, April 2012
Review of CD by Cantabile Vocal Quartet , including Dunhill's four Songs of the River (Opus 44, published in 1916)
Appleby, Lincolnshire – www.appleby-lincolnshire.co.uk/Dunhill.html
Website for village where Dunhill is buried. Members of the village have kindly looked after his gravestone, and posted an article about him on the website. The gravestone has the inscription 'Maker of Music'
Lyric Suite (for bassoon), Opus 96 (c1942)
Philip Sears plays A Summer Lullaby (Opus 41, no.2)
Phil Sears plays Two Fairy Pieces: The Elfin Cobbler & Moonlight Fairies (1936?)
Charlotte Slocum plays 1st Year Pieces (1935)
Ian Bostridge/Julius Drake: The Cloths of Heaven (from The Wind Among the Reeds) c.1911


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Welcome to our website! As we have the ability to list over one million items on our website (our selection changes all of the time), it is not feasible for a company our size to record and playback the descriptions on every item on our website. However, if you have a disability we are here to help you. Please call our disability services phone line at (508) 528-0501 during regular business hours and one of our kind and friendly personal shoppers will help you navigate through our website, help conduct advanced searches, help you choose the item you are looking for with the specifications you are seeking, read you the specifications of any item and consult with you about the products themselves. There is no charge for the help of this personal shopper for anyone with a disability. Finally, your personal shopper will explain our Privacy Policy and Terms of Service, and help you place an order if you so desire.
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Fern Smith
Fern Smith an experienced, skilled and unique visual Melbourne artist has exhibited since 1985 in Victoria, ACT, NSW, WA and NT, is well published since 1989 and artworks are held in private collections in Australia, England America.
Fern works mainly works in four mediums. Limited edition digital art prints. These works are created with the use of a drawing tablet, Photoshop program and are printed on archival museum quality cotton rag. Opaque water colour on cotton. This is a northern Indian technique adopted from Persia from about the fourteenth century AD and Fern has reconfigured it with a contemporary twist. Oil painting often from hand ground pigments and self-made paint and lastly drawing Ferns first creative love.
She is a stylized figurative artist and her work is often patterned, layered, and is influenced by current issues, mythology and herstory. Fern develops a body of works from exploring, reflecting and synthesizing media, literature and academic papers on a topic she is currently focused on. The creative process for Fern is inspired by her responses to social change.
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How University Helped Me Become A Game Developer
To study or not to study… that is the question!
Whilst at college I worked in a supermarket; first as a retail assistant and then as a tech advisor, selling tv's, laptops and mobile phones. By 18, I'd opened and ran our stores first phone shop and shortly after I was leading a small team of tech specialists. Just 2 months later I applied to Plymouth University through clearing, I was on my way to Plymouth – having never left London, never visited Plymouth, not checking my accommodation and gambling that the course would match my aspirations. I had the option to transfer to the same supermarket in Plymouth, but I gave it all up – I started fresh.
The Real Value Of University
When most people look back at university they always value its worth in how much they learned in terms of knowledge about their particular subject. However, I think it's more valuable to assess how much you grew as an individual. Let's face it, many 18-year-old's sign up and go to university, not really knowing what they want to do and end up hating what they studied. But if you became more confident, developed networking skills and discovered a new part of the country that you love, then you probably won! The trouble is, without being self-aware, it's hard to notice how much you've changed, and I think university is therefore undervalued by many.
The Doing Is Easy
I believe with 100% certainty that in any field, the actual job doing is easy. Do you want to learn Unity? There's a video for that. Do you want to learn C#? There's a series of articles on that. Do you want to become an expert 3D artist? You can put the hours in and practise that. You don't need to go to university to develop these skills. If you want to become the best in any of these things, the university won't go into that much depth and it will be up to you.
A book can teach you basically anything!
You'll Never Be This Safe Again
The most important thing University offers is a safety net. Do you want to get a bunch of friends together, build a game and get it to market? Good luck fitting that in around your 9-5, family commitment's, personal finances and just general life stuff. What university offers is a low-risk environment to experiment, fail, try new things, figure out how people work and what it is that really makes you tick. This is what so many people miss out on. It's an incredibly unique opportunity in your life to give you a head start that you will NEVER get ever again. If things go wrong, you probably haven't spent any real money and you might just end up with a lower grade.
Resources You'll Never Have Access To Again
Next up it's the resources around you. The people that are teaching you are some of the best in their field, so why not go out of your way to tap into their knowledge and have that 2-3 hour conversation. With one lecturer, I must have spent about 50 hours 1 on 1 with in my final year. I can only imagine what they could charge for a consultation. These experts not only have incredible knowledge but perhaps even more important is their network of professionals and ex-grads that can give you an unbelievable advantage. It's important to note that you won't have access to any of this if you're a bad student in terms of effort. My key tip would be to figure out what the people you talk to love and offer them value first, give up your Saturday for an open day or participate in a research experiment they've organised. All of this applies to your approach with peers too, you never know if the future CEO of Ubisoft is sat next to you.
Make The Most Of It
The final thing that University does excellently is getting you started. I learnt more in my first one hour lecture than the previous 50+ hours dabbling with Python each night at college. I was provided with genuinely useful information about how to get started, what people are using, where the industry is heading and what skills will be useful to learn for the future. I was taught the basics of web design, database, apps as well as games, providing me with well-rounded knowledge. As the content became more complex it might not have been taught in the most optimal way, but at least if I was stuck I had immediate support available.
Fun Fact: Hat throwing is really frowned upon by the gown people!
To Recap
So how did University help me become a game developer? It offered me that safety net which allowed me to experiment, make mistakes and figure out how I fit into the industry. It gave me access to resources that, through relationships I can still tap into in order to further my career. It proved to me that being a game developer wasn't just a dream. It is, in fact, something that people do and can be very successful at; and most importantly, it gave me the confidence to try to emulate the success of others too. In fact, the best parts of university were everything except everything except the 'how to make games' part.
Keep Moving Forward
In the four years since I left London, the phone shop I started became an actual shop and not just a stand, the tech department is no more and many of my friends have since moved on and yet just as many have not. If I hadn't have gone to university, game development would still just be a dream and I would be back to replenishing stock. Where are you heading? Believe you can achieve your goals and go do it!
Later this month BrainyBeard will have its first birthday! In that time, we've released a tool on the Unity Asset Store as well as two free tools on Itch.io amongst several game jam entries. We've helped organise two game jams down here in Plymouth as well as monthly meetup events. We're also incredibly active on Twitter so why not say hi to us over there? You can also keep up to date with the latest BrainyBeard & Game AI news by subscribing to our newsletter below.


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Bridgestone's new air-free concept shows major design improvements
Bridgestone Corporation has taken another step forward in its efforts to commercially launch aire free tyres by presenting the second generation "Air Free Concept (Non-Pneumatic) Tyre" with improved load-bearing capabilities, environmental design and driving performance. The spokes stretch along the inner sides of the tyres supporting the weight of the vehicle. There is no need to periodically refill the tyres with air, which means there will be no punctures.
The spoke structure is made from thermoplastic resin and, along with the rubber in the tread portion, the materials used in the tyres are recyclable, contributing to the efficient use of resources. Further, by pursuing extremely low rolling resistance and contributing to reductions in CO2 emissions through use of proprietary technologies, Bridgestone believes it is possible to achieve even higher levels of environmental friendliness and safety.


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X-Men: The Hidden Years; Worlds Within Worlds by John Byrne and Tom Palmer
In a world where mutants try to co-exist with normal humans, there are always those who can rise to become better men and women and Charles Xavier takes them into his school for the gifted mutant and helps them realise their true potential. He thinks that together they can become an excellent fighting team, but there are others who do not share his vision.
This is the last volume of the classic X-Men Tales; previous volumes are; X-Men: The Hidden Years: The Ghost and the Darkness, and X-Men: The Hidden Years: Destroy All Mutants. Here John Byrne and Tom Palmer bring us more tales of the X-Men and their foes; Dazzler, Yeti, Kraven the Hunter and Magneto. Without Xavier's united front helping them they would be vulnerable, yet they have more enemies than they could think of.
In Death Be Not Proud, Angel is reminded of the fact he's a mutant and his mother takes ill. Angel thinks she might die unless he can find someone who can help him out, but there is someone who has not been as friendly as he should be. Hank is going up against Kraven the Hunter in Hunter and Hunted. Hank could be beaten by Kraven who has heard all about his having the strength of several men. He thinks he is vastly superior in skills and puts Hank to the test. Magneto makes his return in Let Loose The Dogs of War. Here the X-Men could be defeated, and Professor X has to help them out once again. Magneto plans an assault on the Fantastic Four where he makes them do his bidding, though he is unaware of their team's strength as well. Magneto thinks he has the upper hand by kidnapping Invisible Girl, but all he will succeed in doing is encourage Reed Richards to come and rescue her.
The stories are a mixed bag and some of them are in several parts. X-Men: The Hidden Years: Worlds Within Worlds has the X-Men put to the test at the one time where they are the most vulnerable. The stories are inventive and at times emotional, but the team have each other to keep them strong in the face of adversity. It is interesting to see one of the best comic series to come out of Marvel come so far.
This X-Men: The Hidden Years; Worlds Within Worlds book review was written by Sandra Scholes
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