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What's inside? Here are the questions answered in today's reader mailbag, boiled down to five word summaries. Click on the number to jump straight down to the question.
1. Employee Stock Purchase Program help
2. Divorce mess (and follow up)
3. Unsure about next steps
4. Understanding tax brackets
5. A big mess of debt
6. Student loans or mortgage
7. Retirement path
8. A Game of Thrones
9. Self-employment questions
10. College student with some debt
Many people seem to think I have a thing against television. I don't. In fact, I think that a well-constructed television series is one of the best forms of entertainment for telling a complex story with well-defined characters.
There are two things I dislike about television, though. One is the advertising, not just during the commercial breaks, but during the programs in the form of product placement. The second is the convenience of using television channel surfing to fill downtime in our lives with nothing valuable or productive. Those two things add up to enough to keep me from turning on the television without clear purpose.
I'm all in favor of scheduling a date night once or twice a week and watching a few episodes of a great television series without commercial interruption off of a DVD or off of a streaming service. That can be fulfilling in a lot of ways.
Q1: Employee Stock Purchase Program help
For the past 3 or 4 years I have been working through the debt snowball method of debt elimination. I am now free of all debts other than my mortgage, have about 3 months of emergency savings (working on getting that to 6), and am funding my company-provided 401(k) at 6% (working on getting that to 10 or moving to a Roth IRA). For the 401(k) the company match is 2%. I feel like I finally turned a corner on my financial situation and have gone from being a slave to the banking industry to slowly starting to build wealth and plan for my retirement.
I am now debating on whether it makes sense to participate in my employer's Employee Stock Purchase Program (ESPP). It works like this: there are two enrollment periods per year, and during an enrollment period I can elect to have a percentage of my gross income deducted from my paycheck (on a post-tax basis, of course) to buy company stock. At the end of each 6-month period they add up the payroll contributions made during that period and buy the appropriate amount of shares at the price at which the stock traded on the first day of the period or the last day of the period (whichever is lower). Shares are purchased at a 15% discount and are fully vested.
Every piece of investment advice I've read so far (including your blog) generally suggests that the beginning investor stick to index funds, and/or highly-diversified holdings. So my question is this: as a beginning investor, does it make sense for me to take advantage of the discount the ESPP provides and contribute aggressively to buying company stock, or would I be better suited to putting that money in an index fund or other diversified holding? In other words, does the discount provided by the ESPP outweigh the risk of holding one specific stock in my portfolio? I am fairly young (34), unmarried, and currently own a home that will meet my needs for at least 10 years, so I have no immediate goals other than to continue to build wealth. I have a fairly high tolerance for risk, so seeing the value of company shares fluctuate day to day wouldn't bother me too much as long as they were generally trending upward. Also, I'm not sure if this should factor in, but my company is very successful in its market, and has an earnings growth projection of 22.5% for the next five years.
- Brian
If the stocks are purchased at a discount and you're fully vested, you could theoretically immediately sell the stocks and earn a profit each time, which seems like a good move.
The question you're really asking, I think, is whether it makes sense to buy and hold the stocks of a company that you work for. Because you work for that company, you have some intimate knowledge about how the company is doing. If you feel good about that company, by all means, hold the stock.
When should you diversify? I would just sit on your investment until the amount of stocks you hold reach a point where you would feel devastated if those stocks were suddenly worthless. At that point, sell off some portion of your holdings and diversify widely with them, probably through an index fund.
Your intimate knowledge of this company means that you have good reason to invest in them. It makes sense to maintain stocks in that company as a significant part of your portfolio. It's just foolish, though, to have all of your investments (or even the majority of them) tied up in the stock of one company.
Q2: Divorce mess (and follow up)
A while back I asked you how to get my husband on board with cleaning up our finances. He was refusing to talk about anything and you suggested counseling ASAP. Well, he refused to go to counseling. Then I found where he had taken out title loans on one of our vehicles and that same month he spent our entire emergency fund ($1,000) on one dinner out with his friends and a new TV. When I asked him about the title loans, he said it was none of my business what he did with "his" money and he left…for good. My hours have been cut at work and I do not meet my basic living expenses without child support.
Fast forward a month or so. I am in the process of filing for divorce. Two cars are in my name and that brings me to my question. They are both older cars (a 2000 Nissan Maxima and a 2001 Dodge Caravan) and have substantial mileage on them (90,000 and 120,000). The insurance on them isn't too bad, under $100 per month for both. I have a teenage daughter who will have her driver's license before the end of the year and wants to get a job. Should I keep both cars so she will have one to drive and we will have a spare in the event one breaks down, or should I sell one (my mechanic says to sell the Nissan – higher upkeep costs)? The Kelly Blue Book value on the Nissan in its present condition is between $4,000 and $4,500, which could fund my emergency fund, plus pay some upcoming expenses.
- Jill
That sounds like a relationship that it was good for you to get out of now rather than later on. Eventually, the situation would have collapsed, and it might have collapsed with you in a much worse financial state.
As for the cars, you should absolutely sell one of them, and I'd likely sell the one your mechanic recommends that you sell. Upkeep costs are a major factor in this decision, and if you're minimizing costs, losing the vehicle with higher upkeep costs is the best move.
Take the money you earn and bank it. You'll be glad you did.
Q3: Unsure about next steps
After our credit cards are done being paid off estimated at the end of this year here is what we have left to tackle (numbers are very close guesses to the balance in January of 2012):
Mortgage: Approx. $282,500 – Payment is rounded up to $2,280 – 5%
Car Loan: Approx. $22,000 – Payment is $507 – 2.89%
Student Loans: Approx. $38,000 – Payment is $305 – rates vary from 2.75% to 4.25%
The question I have is, what do I tackle next? I see from the math, the Mortgage is the highest interest rate and should be next. I guess the issue I have is that since it is so underwater, is that still my best bet? Or do I really start contributing the max to my Roth IRA and open one in my husband's name too?
We were hoping to be moving out of NJ to NC next year, but it's not realistic with the housing market (the house across the street, with one less bath, just sold for $216,000 – or about $60,000 less than what we paid, not to mentioned what we've put into the house). We are hoping to be moving in 3 years, and I'm not sure I want to buy another house after what we've experienced with this one and the market being what it is. I'm not sure I'm willing to tie my money to an asset (depreciated asset in my case) again. IF that is the case, I understand that I am liable for the difference between my mortgage and what my home eventually sells for. Does it make sense to mitigate any potential loss there, or am I missing something?
- Diane
You're correct in that if you sell your house, you'll be responsible for the difference between what you owe and what you sell the house for (assuming you're underwater).
You can discuss a short sale with your lender, but they'll generally only be interested in your request if it looks like you're heading toward foreclosure.
Assuming you're not looking at just walking away from the house, your best bet is to just start paying down that mortgage as fast as you can. At some point, you'll no longer be underwater and can sell it if you so choose.
Q4: Understanding tax brackets
Can you help me understand tax brackets? According to bankrate.com, the 2011 tax rate for my gross income ($43,260) as HOH should be 15%. Today, I asked my payroll dept for a tax deduction breakdown for what the company deducts from my salary. This is the breakdown I received:
8.7% – Federal
4.2% – State
4.2% – Social Security
1.45% – Medicare
Along with my 3 exemptions, how does this align with the 15% tax bracket I supposedly fall into? I do have a 6% pre-tax contribution & $1000 pre-tax deduction for my medical flex spending account.
- Lacey
If your gross income is $43,260 and you're filing as head of household, you'll be paying 5% of your income for all income you earn between $0 and $12,150, and 15% of your income between $12,150 and $46,250. So, for the first $12,150 of your income, you'll pay $607.50 (that's 5%), and then for the next $31,110 of your income ($12,150 up to $43,260), you'll pay $4,666.50. Your total tax will be $5,274.
Now, that amount changes depending on how many dependents you've stated on your W-2. If you listed, say, four dependents, they'll subtract $3,750 times 4 from your initial salary, changing how much is taken from your paycheck. In this case, you'd pay $607.50 on the first portion of your income and $2,416.50 on the second portion. This adds up to $3,024, which is right around 7%.
I'm guessing that you have three dependents or so – you, your spouse, and a child. That'd get you pretty close to the 8.7% you see here.
Q5: A big mess of debt
I graduated from college in 2007. My student loan payments started in late 2007. I could not find a full time job until March 2008, although I was paying the minimum on my student loans, which is all I could afford. In March 2008 I got a full time job, but still could barely afford to pay all my bills (about 1,100 a month which includes cell phone, rent, student loans, 2 credit cards (one is now completely paid off), car insurance, but does not include gas/car maintenance, or food, or clothing, or entertainment of any sort). I was making about $1,400/month (after taxes, health insurance, and at the time, a 401k), so after necessary expenses, food and gas, etc. I never made it to the end of the month with any money in my bank account. Needless to say, I couldn't save anything, and couldn't afford to pay more than the minimum on my student loans (which looks like it's JUST interest). I should mention that I only get paid once a month
I stopped paying into my 401k in the beginning of 2010 because of furlough days, and haven't contributed to it since (which I REALLY want to start again since my employer matches up to 4%). In May of 2010 I got a raise, so that I was bringing home about $1,600 a month (after taxes and health insurance and furlough days). At the time I had just purchased a high end camera (about $1,500) which I used financing for through Best Buy (photography is my favorite hobby, so I felt justified in using financing to buy the camera). That was paid off in February 2011, after which I then decided to go after my other credit card (which I describe below) and I'm sure was the wrong decision, but I don't have a choice now.
I have one credit card paid off leaving about $1,900 on another that I am working on (I recently transferred the balance of this card from my oldest credit card (which I kept open for my credits sake) and put it on a 0%-interest-for-12-months card so that I could aggressively pay it off without wasting money on interest. That should be paid off by January 2012 and I plan on cancelling that card, unless I can talk them into giving me as good of an interest rate as my current oldest card which is about 9%.
Anyways, my big problem are these student loans. Here is a breakdown:
Private loan (not able to consolidate with any other loan) from Sallie Mae (9.25% interest rate):
– Original loan amount= $10,500/Outstanding principal= $10,326.17.
Consolidated loan from Sallie Mae (5.625% interest rate):
– Original (combined) Loan amount = $23,096.91/ Outstanding principal (combined) = $22,337.76.
These numbers make me want to cry since I have been putting so much money from my tiny salary toward these payments for almost 4 years and they've only gone down by a tiny tiny bit! I've been keeping up with your blog about loan situations and I know that I should save a small emergency fund (which I have about $430 in so far) then throw everything extra at the highest interest loan and only pay minimums on everything else until I pay that one off, then move onto the next highest interest loan etc.
My problem is I barely have enough money to get me through the end of the month let alone throw more at this student loan, which is also hard to think about since it seems I am getting NOWHERE even though $300/mo of my paycheck gets thrown at Sallie Mae just to cover the MINIMUM payment. I feel like I have no ability whatsoever to get ahead on these student loans. I think I should have avoided transferring my credit card balance to a 0% interest rate credit card because now I am spending about $90/mo more on that payment just to avoid pay interest on that amount.
I guess I'm wondering what you would do in my situation? Come January when my credit card is paid off and I will have an extra $190/mo, should I put it ALL toward the high interest student loan (which still won't make that much of a difference in my mind), or should I put that money into my 401k? Or should I save it? Or should I split it somehow?
- Lisa
If I were you, I'd keep doing what you're doing for the time being. In January, I'd get your emergency fund up to a point that's equal to two months of living expenses, then I would start retirement contributions and focus on that higher interest loan with what's left.
When you've got so much of your monthly income accounted for, you don't have much room for an emergency. An emergency fund is a must-have, even if it feels like it's keeping you from really knocking down the debts.
Yes, this is a frustrating path to follow. Yes, it feels like you'll never get out of it. The things in life worth having are never, ever easy.
Q6: Student loans or mortgage
My wife and I do ok with managing our money. We don't carry consumer debt but never seem to do much better than breaking even each month. Lately we've decided to try to really get in to good financial shape. We're establishing an emergency fund and are hoping to start saving more towards retirement and general savings (I currently contribute to a 401k at work for the matching benefits, but that is it.)
My wife and I bought our house two years ago. When we bought it we figured that if we made one extra house payment a year we would knock ~7 years off of our mortgage. Now we're trying to decide if it is better to do that or to pay down our student loans. We know that we aren't going to be in this house more than another year or two. We will probably sell it when we move, but we have considered renting it out instead.
My wife's loans are about $11k and mine are about $21k. Our only other debt is a personal loan I'm paying off at the end of this month. We use our credit card to pay bills (so we can build rewards points), but never carry a balance. We always pay it off every month.
Do you think it makes more sense to make the extra house payment each year, or to use that money to pay down the student loans?
- Aaron
I would look first and foremost at interest rates. What has the highest interest rate among your student loans and your mortgage? That's the debt I would focus on.
If you pay down your mortgage fast, when you sell it, you'll have more proceeds than you would have otherwise, which you can then apply to the other loans. If the mortgage interest rate is higher, you'll save more over the year or two you still have the mortgage than you would by putting that money into a lower interest student loan.
Of course, another vital question to ask is whether you're underwater on the mortgage. If you are, I would strongly suggest hitting the mortgage as hard as you can.
Q7: Retirement path
I am a married attorney in Seattle. We have a home with about $250,000 in equity. We have 22 years left on the mortgage. I am 37. I've been at a company with great retirement for the past 5 years: 4.5% match for my 6% in the 401k and 4.0% cash balance plan. I only contribute 6% and have been doing so for 5 years. Would you make any changes?
- Chris
The first thing I'd do is run all my numbers through a retirement planning calculator and see what it suggests. Assume that investment returns will be the worst they possibly can – don't get optimistic with your projections.
I can't tell for sure if you'll be all right. If I were to guess based on the information you've provided here, I'd say you're on the low end of being all right, but you're not in devastating shape.
Run the numbers.
Q8: A Game of Thrones
I saw that you really liked the novel A Game of Thrones by George R. R. Martin. Have you read the rest of the books in the series? Are you watching the T.V. series?
- Roger
I've read all of the books in the series. I've read A Game of Thrones three times, and I'm currently reading it a fourth time with the intent of re-reading the entire series.
I watched the first episode of the series and it seemed to duplicate the first ten chapters or so of the book with only minor changes. The characters didn't look quite like I envisioned them but the heartbeat of a very strong story was still there.
The series is fantastic. The only thing I'd say about it is that it can get bogged down in too many characters, especially later on.
Q9: Self-employment questions
My husband just started his own trucking company. He's the only employee as an owner-operator of an 18 wheeler. We are both co-owners of the business. I have a full time job making about $32,000 a year. We expect our company to gross about $90,000 a year. That would put us in the 25% tax bracket. How much money should we be putting aside for taxes? I know we have to pay them quarterly, but do not want to end up owing a lot of money next year when we file. We do not have any children together, but he has two kids with his ex-wife. The divorce decree says she gets to claim them, but may let us claim them like we did last year beacuse she doesn't work, isn't married and doesn't file taxes. I have been put 30% of his check aside to pay the quarterly taxes. As a small business, I know we can claim a lot of business expsenses. Do you think I am putting emough aside? We both contribute to Roth IRAs so that will not bring our taxable income down like a traditional IRA would.
- Rebecca
My strong suggestion to you is to use IRS form 1040-ES and run the numbers with the attached worksheet. I think that 30% will be plenty for what you describe, but you're better off running the numbers.
I will say that I find the methods for tax collection and calculation to be particularly burdensome for the self-employed and people who run very small businesses. The IRS seems designed to discourage self-employment and encourage just working for an employer, sadly enough.
Where's the entrepreneurial spirit that made America great?
Q10: College student with some debt
I am a senior in college graduating next month with my BS in civil engineering. This summer, I will continue with my education in pursuit of an MEng in civil engineering. After graduation, I expect to have a starting salary anywhere from 45k to 60k (depends on market and field). However, during my time at school I made a few bad decisions. I opted to focus on my grades and extracurricular activities while working as little as possible. In doing so, I will graduate with a 3.8 GPA and numerous awards and leadership roles for my resume, but at a cost. So far I have accumulated 12k in student loans and around 6k in credit card debt (APR > 20% on each). This summer I will try to find a part time job since I will only have 6 credit hours divided into 2 days. As well, I secured a teaching assistant position this coming fall. My projected income from teaching assistantships and scholarships for the fall is $2000/mo and spring is $800/mo (without considering additional student loans and possible additional part time jobs).
I am having a hard time deciding what set of actions will put me in the best position after college. I could either continue to pay the credit card payments at roughly 300.00/mo (currently, I pay more than the minimum) or I could consider taking out a non-federal loan at an interest rate below 12% and using that to pay off the credit card bills. This will also give me a little more wiggle room with my monthly expenses. Both options will have me finding part time jobs for the summer and spring (since I have a job lined up for the spring). Do you think applying for a loan just to pay off my credit cards for good is a good idea since my interest rates are so high?
- Adam
I would never consolidate credit card debt into a student loan. Student loans exist under different regulations than credit cards and can follow you no matter what happens in your life. It is much easier to resolve a credit card debt than it is to resolve a student loan debt.
I would seek out other methods of reducing the rate on that credit card debt. You may want to consider a 0% balance transfer offer to another card if you're eligible. You may also want to try directly contacting the credit card issuer and requesting a rate reduction, though there is a risk that they may reduce your line of credit.
I wouldn't panic about it, though. Just make sure that it doesn't get worse and keep your credit report in the best shape possible.
Got any questions? Email them to me or leave them in the comments and I'll attempt to answer them in a future mailbag (which, by way of full disclosure, may also get re-posted on other websites that pick up my blog). However, I do receive hundreds of questions per week, so I may not necessarily be able to answer yours.
Add/view comments on this post.
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It was unknown to the world that Edward and Wallis had had a child in June of 1934, and that child was taken from them.
It was not until December of 1995, that their daughter learned her true parents' identity.
In the months that followed resemblances became apparent. Their daughter & her immediate family, spanning three generations, had inherited features from Wallis and Edward, and their families, as can be seen in the accompanying pictures. These likenesses together with the discovery of many hidden clues are evidence that divine intervention was necessary to expose past deeds which have altered the course of history.
Wallis and Edward on vacation in August and September, 1934, shortly after the loss of their child. This photo, and others taken during this vacation depict a somber mood.
All of the proof presented on these pages is true and verifiable. The pictures are unretouched, and depict the typical appearance of each subject at that time. Decide for yourself the validity of this claim.
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Is this function still active? I looked in my profile, but can't find any mention of a map.the plod wrote:New Member Map added...
The uilleannforum.com worldwide member map has been upgraded and now fully supports the Googlemaps interface. This is a much more functional map system, you can zoom in, zoom out, pan around, change to satellite views, see the whole world or just your town. It's cool. When you click a member's marker, it will take you to their profile
Unfortunately this map is not compatible with the old map and thus you will have to add your information again. The good news is, this is much easier now. Just log in to the forum, go to your profile, scroll down to the Map section, and enter your coordinates or use the "find your coordinates" link in the map section of your profile. This will bring up a new google map that you can then zoom in to (as close as you want) using the widget in the upper left corner of the map. You can zoom in all the way to your street in some cases or you could decide to be a little more vague if you want, click the map then to set your marker.
Currently, you must be logged in to the forum in order to see the members' markers (the map will look empty if you are not logged in). This limitation will most likely be fixed in future versions of the map.
Let me know if you have any problems.


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Astral Angel
Posted by allan in
Gift Card
A gift card is the perfect solution to not knowing what print to buy someone!
And what's better, you can set the limit of the Gift Card, give as much or as little as you like and they get to chose the print that's perfect for them.
If the gift card is over $30 we'll send you store credit for $10 as a thank you!
Now it really does pay to be a good friend!
Phil's Tweets
Todays Vision is The Abbey Road Moondance collection....never before see....
02/04/2019 16:33:35
So Last night we saw the Legendary Piff.......The Magic Dragon, and he was presented with a Vision...
04/03/2019 15:04:45
So here's a Vision of Randy Bachman of The Guess Who & BTO....and here's me Presenting Randy Bachman last night wit… https://t.co/MvtYxi7Jo1
21/01/2019 15:08:37
Today's Vision features the Genius of David Byrne...I had the pleasure of giving this to him last May when he came through Madison.
04/01/2019 15:38:12
Happy Holidays everyone, so starting in 2019, I'm gonna take on a huge undertaking...I'm gonna post a new Vision ev… https://t.co/QaQN6XfyOe
26/12/2018 21:01:32


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Touch the Revolution with MSP MCUs featuring CapTIvate™ technology
TI's Precision SAR ADCs in Wearable Devices
Nuances in ultra-low power designs for wearable products
Overview of the ADS7042 Ultra-Low Power Data Acquisition BoosterPack
DLP® 4K Ultra HD Now for Home Theater, Enterprise, and Education
Plug, Play, and Display - TI DLP® LightCrafter™ Display 2000 EVM
The Active Clamp Flyback: Part 1
The Active Clamp Flyback: Part 2
Wireless Multi-parameter Patient Monitor Demo
DLP® Pico™ DLP2000 EVM
Design considerations for USB type-C power delivery Part 2
Battery Protection 101
Wearables display applications
How TI DLP Pico technology fits within wearable display systems
Audio THD+N measurements
MSP430 Capacitive Touch MCUs featuring CapTIvate™ Technology Training Series
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This training series details the key features of MSP430 MCUs featuring CapTIvate technology, enabling you to get started on your next great capacitive touch design and get to market more quickly.
Mobile Smart TV training
Mobile Smart TV is a growing category that can extend the AV personal electronics category. This training includes all the information you will want to know about the mobile Smart TV category. Introduction, value proposition, benefits, and design considerations of the mobile smart TV category are included in the training. The last section, covers the benefits of DLP Pico technology for this application.
High Resolution 4K UHD Digital Display Solutions using DLP® Technology
This series highlights the high-resolution DLP 4K UHD digital display solution for laser tv and digital signage applications. The DLP 4K UHD chipset, featuring the DLP660TE digital micromirror device (DMD), enables bright and large images for projection systems. The series includes:
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- Getting started resources
Capacitive Touch Basics with MSP430 MCUs featuring CapTIvate Technology
Fundamental PCB Layout and Design Guidelines of MSP430 MCUs with CapTIvate Technology
This training covers the fundamental design techniques required to implement a successful capacitive sensing hardware design. This series will explore a number of design topics, including: Basic layout guidelines overlays, back lighting; Dealing with moisture; Self capacitance sensors; Mutual capacitance sensors; and Proximity sensors.


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We can recondition, reface or replace any woodwork in your bathroom. A few simple changes can make your bathroom look like new! We also offer a range of products to make your bathroom more stylish and functional.More about Bathroom Remodeling
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7 years or up to 100,000 miles from original sale date WARRANTY INCLUDED !! Our Sale price includes all Acura Certified fees! We do not charge extra for Certification! Buyer beware of dealers trying to CHARGE YOU EXTRA FOR CERTIFICATION! Some cars qualify for 7 years*/100,000 miles* based on original in-service date.Minimum 2 years or 100k! Recent Arrival! 2018 Acura MDX Sport Hybrid 3.0L SH-AWD w/Advance Package Black V6
Clean CARFAX. READ OUR REVIEWS!! We have also been voted the best dealer in Naperville the last 5 years in a row! We are part of the Continental Motors Group, a family owned and operated dealer group serving Naperville, Aurora, Batavia, St. Charles, Downers Grove Oak Brook, Lombard, Elmhurst, Addison, Itasca, Hoffman Estates, DuPage co., Will co., Kendall co., Cook co., And the entire greater Chicago Area for over 50 years! Please review all pictures for actual vehicle condition and equipment. Please call or email to confirm availability and actual mileage. CALL US TODAY! 26/27 City/Highway MPG
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Hypnotherapy can help you overcome blushing
Almost everybody experiences facial blushing at some point, and it is a very normal, bodily reaction. Blushing is an unconscious, physical response that our bodies have to certain situations and is most often the result of feeling embarrassed, 'on the spot' or just feeling judged by other people.
However, blushing becomes a problem when the sufferer becomes intensely aware of themselves blushing - resulting in feeling even more aware of themselves. Plus, the fact that the sufferer thinks that others can see them blushing only serves to make them feel even more self-conscious. They may then come to dread or avoid social situations or interactions due to a fear of blushing. Many people contact me for help with blushing with Hypnotherapy - it is a very common problem.
It is often one of the symptoms of social anxiety or social phobia, which is a fear of any situation where the sufferer is likely to feel embarrassed, humiliated or judged - for example; talking during meetings at work, dinner parties, public speaking, interviews etc.
Associated symptoms:
sensitivity to criticism
negative self-image
fear of rejection
difficulty in being assertive
feelings of inferiority.
Basically, any situation in life where you might feel embarrassed, on the spot, judged, silly out of control etc.
Help for blushing with Hypnotherapy In Leicester, with Alexia Elliott a Leicestershire based Hypnotherapist.
Blushing responds really well to hypnotherapy and you can be fairly certain of a resolution after just a few Hypnotherapy sessions.


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In the last couple of years, there has been a noticeable increase in articles on digital saturation, the need for digital detox, and the impact that being constantly connected has on both individuals and organizations. We've heard the statistics -- - 68% of us taking a device to bed, 84% of us not being able to go a day without our smartphones, and stress-related illness costing our economies in excess of £100 billion per year.
Other research shows that those who take the time to slow down, take daily walks outside or spend at least a third of their week on self-reflection are more effective leaders, more capable of dealing with the stress that life throws at them.
As a self-diagnosed overachiever, I have to ensure that I create space for reflection and rejuvenation, to maintain my resilience and perform at my best in all aspects of my life, including the job. Spending time outdoors, pushing my perceived limits by setting myself adventurous challenges, and coaching others allows me to find the optimum life balance between action and reflection.
In 2012, I combined all of these passions to create the Back to Basics Experience, which started as a very personal journey of looking for my own solitude and sanctuary. We invite other successful overachievers, once a year, to disconnect from their busy lives and reconnect with their surroundings and themselves. We take 15-20 people to the South African Bushveld and immerse them in nature (with no fences, no electricity, no running water, and, most importantly, no Wi-Fi).
The Back to Basics Foundation benefits those who attend, but also, as a social enterprise, the foundation supports the local communities we visit by investing profits gained back into the communities, supporting local conservation efforts, local schools and hospitals. The Foundation also allows me to meet my values of contribution, community, connection and growth.
Being able to run this wellness project and pursue my adventurous interests, in parallel to helping organizations improve the way they do business through my job as a consultant at Accenture, makes me more likely to succeed on challenging projects. It also makes me better equipped to deal with the unexpected, to drive engagement across diverse personalities, and to be a more effective leader. Constantly challenging my own boundaries means I am more flexible to change, accepting of others when they turn up on their worst day, and always looking to learn from my journey and fail forward or lean in.
One of my favorite quotes is Mahatma Gandhi's "be the change that you want to see in the world." This is what I aspire to every day, both in and outside of the office.


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Day 6: Wednesday, 24th July
After a restful night's sleep in Utrecht, Holland, we awoke a little later than normal before we started our final day of travel to Star Wars Celebration Europe onboard the Caravan of the Force, in association with Toys"R"Us. We all enjoyed a good breakfast and the hotel management ensured we had provisions for our journey in the form of mini muffins.
We loaded Boba Fett, a.k.a. Jeremy Bulloch, into the cargo hold and once the rest of us were ready and the satellite navigation systems were programmed with the address of Messe Essen, we started the drive. Along the route we found a great Italian restaurant where we all enjoyed rather large pizzas and big bowls of pasta.
The goal for day six was to arrive at Messe Essen, outside the Atlantic hotel, for 5:01 p.m. where we were met by a few members of the press along with members of the German Garrison. As we approached the area, we soon realized we were a few minutes early and waited nearby for a couple of minutes. At exactly 5:01 p.m. we drove around the corner, passed Messe Essen and arrived directly in front of the Atlantic hotel. What greeted us was approximately 200 people, including some 40 German Garrison members in costume and many folks from Lucasfilm without whom the Caravan would not have been possible — Mary Franklin, Barbara Gamlen and Lynne Hale. To say that we were overwhelmed would be an understatement and we were so grateful to all that turned out to welcome us. What followed was around 30 minutes of photos with Jeremy, the Caravan of the Force team, and two of the Celebration Europe stage hosts, David Collins and Pablo Hildago.
After the excitement of our arrival we were all able to finally check into our hotels knowing that we'd be staying in one place for the next five nights. Caravan of the Force isn't finished yet as we have to make our journey home after Celebration Europe on Monday — more of that to come next week!
Caravan of the Force, in association with Toys"R"Us, is raising money for Make-A-Wish Foundation. Please dig deep and we ask everybody to donate just £2, €2.50 or $3 to such a worthy cause at http://www.justgiving.com/caravan-of-the-force – thank you!


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Raspberry Coconut Cake
Total TimePrep: 20 min. Bake: 25 min. + cooling
Makes12 servings
- 1 package white cake mix (regular size)
- 3 cups sweetened shredded coconut, divided
- 6 ounces white baking chocolate, chopped
- 1/4 cup heavy whipping cream
- 3/4 cup seedless raspberry jam
- 1 cup butter, softened
- 1 cup confectioners' sugar
- Prepare cake batter according to package directions; fold in 2/3 cup coconut. Pour into two greased and floured 9-in. round baking pans. Bake at 350° for 25-30 minutes or until a toothpick inserted in the center comes out clean. Cool for 10 minutes before removing from pans to wire racks to cool completely.
- In a microwave, melt white chocolate and cream at 70% power for 1 minute; stir. Microwave at additional 10- to 20-second intervals, stirring until smooth.Cool to room temperature.
- In a small bowl, combine jam and 1 cup coconut. Spread over one cake layer; top with second layer.
- In a small bowl, beat butter until fluffy. Add confectioners' sugar; beat until smooth. gradually beat in white chocolate mixture. Spread over top and sides of cake. Toast remaining coconut; press over top and sides of cake.
Editor's NoteThis recipe was tested in a 1,100-watt microwave.
Nutrition Facts1 piece: 610 calories, 36g fat (20g saturated fat), 48mg cholesterol, 507mg sodium, 70g carbohydrate (49g sugars, 2g fiber), 4g protein.
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Jan 23, 2016
I made this for my mother's birthday and everyone loved it. I used a Duncan Hines mix and did not have any problems with crumbling like someone else mentioned.
Aug 9, 2014
This cake is delicious and easy to make. The only problem was cutting it. It literally crumbled when trying to slice it. I used a Betty Crocker Super Moist cake mix. Maybe it was b/c of adding the coconut to it, not sure. After the white chocolate/whipping cream cooled it was pretty funny so I set it in the fridge for 30+ minutes to firm it up a bit before adding to the icing mixture and it worked well. I will try this again using a different cake mix b/c it's worth another try!
Dec 13, 2013
Delicious and very simple. I agree with a previous poster, it reminded me of Zingers.
Dec 25, 2011
We made this for the first time on Christmas day and and brought it to Christmas dinner with friends - it was very much enjoyed by everyone - adults and kids! It was suggested that we take this to every pot-luck we attend. AND, my husband asked for this for his birthday cake - and his birthday's not until July. The only challenge - the icing was somewhat runny and dripped off of the sides of the cake, but time in the refrigerator took care of the problem. The recipe's a definite keeper!
Dec 16, 2011
I asked my son what kind of cake he wanted for his birthday, he said coconut. Online we went, and this we found! AMAZING cake! My MIL that doesn't care for coconut even liked it.
Jul 18, 2011
Easy to make and tastes great!
Feb 9, 2011
Excellant cake easy to make, very beautiful very delicious any time of the year!
May 18, 2010
One of the best cakes I have ever tasted. Reminds me of the Zingers I used to eat as a child.
Mar 29, 2010
Truly a awsome cake, If you love coconut. yummy!


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Students Present Research at Hackensack University Medical Center Research Day
Stevens undergraduate students Tushar Patel '15, Juan Sebastian Castrillon '15 and Naiya Patel '17, each aspiring medical doctors, were invited to present research projects related to regenerative medicine, cardiology and neurology at the First Annual Research Day at Hackensack University Medical Center (HackensackUMC) on June 7, 2013.
The students are Research Associates (RAs) at HackensackUMC, which is part of the National Alliance of Research Associates Programs (NARAP), a consortium of emergency departments and colleges that collaborate to conduct research in hospital emergency departments. As RAs, they gain research experience related to tobacco cessation in a clinical setting, and were also invited to conduct their own research projects to supplement their clinical research.
At Research Day, selected undergraduate and medical students presented research in a range of medical fields in front of prestigious physicians, researchers and other medical professionals. Tushar Patel, Juan Sebastian Castrillon and Naiya Patel were the only student representatives from Stevens.
Tushar Patel and Juan Sebastian Castrillon, both chemical biology majors, presented a comprehensive study on three dimensional bio-printing technology which can rapidly manufacture biomaterials to advance regenerative medicine, enabling more customization, improving patient recovery, and increasing affordability. Dr. Arthur Ritter, Stevens professor of biomedical engineering, advised on the research project.
Naiya Patel, a biomedical engineering major, presented extensive research which assessed various minimally invasive coronary artery bypass graphing procedures –to understand their relationship to cognitive functioning and neurological complications. She worked with a research partner, a student from Rutgers University, and was advised by Dr. Philip Leopold, Stevens professor of chemistry, chemical biology and biomedical engineering.
"We are all happy that we're helping our future profession at this current stage," said Tushar Patel. "We were able to research something we are passionate about and enjoy learning about."


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Mar 11, 2003 | ISBN 9780812966800
"A tremendous book." —Newsweek
"It is not just that Micklethwait and Wooldridge . . . write gloriously. . . . The book's substance is what really makes it stand out. . . . Judged in its entirety, with all its ambition and achievement, the book is a spectacular success." —Foreign Affairs
"[A] compelling, witty discourse . . . To explain how globalization works, and how it came to pass, Micklethwait and Wooldridge take us on an extended world tour."—Fast Company
"[The authors'] style is familiar to readers of The Economist: smooth, witty, erudite. . . . Their book merits an A."—USA Today


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We're overstocked. Save big on our deeply discounted clearance items. Limited quantities available. These are brand new factory-sealed products with full manufacturer's warranty. No code required. Not valid for prior purchases. Cannot be combined with any other offer, discount or promotion.
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Hiyee dear readers! Sorry (again!) for the lack of updates...as usual, my work has been taking so much of my time that I haven't had the chance to post. I have pictures to share but you know the works..editing, resizing and all that also take time. But hopefully I'll be able to get back to my usual blogging soon. Let's keep our fingers crossed, shall we!? ^_^
Anyways, Halloween is just around the corner. I've been wanting to post a Halloween look like what i did here, but again...yadah yadah yadah. I would have to wait til work's not too toxic, but probably that would be around Christmas time already, LOL!
Good thing our friends from Bactidol came up with iconic scenes taken from popular horror films to get us into the Halloween spirit:


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A Shibori Juban: Hand Spun Cotton and Botanical Indigo
May 24, 2011
With the weeks of rain we've been experiencing this spring here in New York, I had to show a shibori juban that's all about rain, birds and a spring-like feeling.
A juban is a garment worn under a kimono; in the past they were often piece-constructed from "flashy" or contrasting textiles, many of which were "recycled." The bodice of this juban is of hand spun, hand woven cotton that has been shibori dyed in botanical indigo. The particular passage, shown below, feels like spring: new blossoms, a soaring bird–and tendrils of what may be weeping cherry branches suggest rain.The indigo color of this juban is beautifully rich and clear–and the toothy, hand spun cotton is the perfect vehicle to accentuate the rich, blue color of the dye.And the rustically rendered umbrella, below, which is set in a gloomy patch of dark indigo, really matches the wet, cold, brooding weather of the east coast.
The sleeves and the eri, or collar, of this juban are made of commercially produced cotton; very often juban were made of a mixture of cloth, and, that said, very often the sleeves and collars of garments in old Japan were repeatedly taken off and replaced due to wear.On the hem of the garment, above, seen on the lower left just next to the umbrella image, you'll see an image from Genji ko, or an incense naming game that dates back to the 11th century. Even the partial lining of the juban, seen below, has a wonderful fragment of old shibori. The bodice of this juban probably dates to the late nineteenth or early twentieth century–the sleeves and the collar are younger.
In: Tags: shibori, yose juban - Comments closed


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Patent application title: LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES
Gareth G. Hougham (Ossining, NY, US)
Brian S. Beaman (Cary, NC, US)
Evan G. Colgan (Chestnut Ridge, NY, US)
Paul W. Coteus (Yorktown Heights, NY, US)
Stefano S. Oggioni (Besana In Brianza (milano), IT)
Enrique Vargas (Bronx, NY, US)
International Business Machines Corporation
IPC8 Class: AH01R1200FI
USPC Class:
439 66
Class name: Preformed panel circuit arrangement, e.g., pcb, icm, dip, chip, wafer, etc. with provision to conduct electricity from panel circuit to another panel circuit conductor is compressible and to be sandwiched between panel circuits
Publication date: 2010-11-04
Patent application number: 20100279521
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Patent application title: LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES
Paul W. Coteus
Evan G. Colgan
Gareth G. Hougham
Brian S. Beaman
Stefano S. Oggioni
Enrique Vargas
Origin: GARDEN CITY, NY US
IPC8 Class: AH01R1200FI
USPC Class:
Publication date: 11/04/2010
Patent application number: 20100279521
A method of producing a land grid array (LGA) interposer structure,
including an electrically insulating carrier plane, and at least one
interposer mounted on a first surface of said carrier plane. The
interposer possesses a hemi-toroidal configuration in transverse
cross-section and is constituted of a dielectric elastomeric material. A
plurality of electrically conductive elements are arranged about the
surface of the at least one hemi-toroidal interposer and extend radically
inwardly and downwardly from an uppermost end thereof into electrical
contact with at least one component located on an opposite side of the
electrically insulating carrier plane.
1-38. (canceled)
39. A method of producing a land grid array (LGA) interposer structure, comprising an electrically insulating carrier plane, at least one interposer mounted on a first surface of said carrier plane, said interposer selectively having a hemi-toroidal, conical, dome-shaped conic section, generally cylindrical or hemi-spherical configuration in transverse cross-section and being constituted of a dielectric elastomeric material; a plurality of electrically-conductive elements being arranged about the surface of said at least one hemi-toroidal interposer and extending radially inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of said electrically insulating carrier plane, said electrically-insulating carrier plane having at least one through-extending via formed therein; an electrically-conductive pad extending through said at least one via and having portions extending in surface contact with upper and lower surfaces of said insulating carrier plane, said electrically-conductive elements comprising metallic strips extending into contact with the pad portion the upper surface of said pad, and the at least one component on the opposite side of said insulating carrier plane being in contact with the pad portion on the upper surface of said pad, the at least one component on the opposite side of said insulating carrier plane being in electrically-conductive contact with the solder pad portion on the lower surface of said insulating carrier plane, said at least one hemi-toroidal interposer having a circular configuration, said at least one toroidal interposer having an inner wall surface configured to form a nest for snap-fitting engagement with a solder ball, said insulating carrier plane having a through-extending via communicating with a hollow center of said interposer, and at least one slit being formed in the sidewall of said interposer to facilitate the venting of gases and pressure therethrough.
40. A method of producing an interposer structure as claimed in claim 39, wherein the at least one component in contact with said pad portion which extends in contact with the lower surface of said insulating carrier plane comprises a solder ball.
41. A method of producing an interposer structure as claimed in claim 40, wherein a plurality of said slits are formed spaced about the perimeter of said at least one interposer and dividing said at least one interposer into discrete segments.
42. A method producing an interposer structure as claimed in claim 41, wherein said electrically-conductive elements comprise metallic strips located intermediate each of said slits.
43. A method of producing an interposer structure as claimed in claim 39, wherein said at least one interposer is constituted of a dielectric elastomeric material.
44. A method of producing an interposer structure as claimed in claim 43, wherein said elastomeric material comprises a moldable polymer having rubber-like resilient characteristics.
45. A method of producing an interposer structure as claimed in claim 44, wherein said polymer is selected from the group of materials consisting of silicon rubber, siloxane, PDMS, polyurethane, polybutadiene and copolymers thereof, polystyrene and copolymers thereof, acrylonitrile and copolymers thereof, and epoxides and copolymers thereof.
[0001]The present application claims the benefit under 35 U.S.C. §119(e) of the filing date of U.S. Provisional Patent Application No. 60/715,261; filed Sep. 8, 2005; the disclosure of which is incorporated herein by reference in its entirety.
[0003]1. Field of the Invention
[0004]The present invention relates to the provision of novel and unique Land Grid Array (LGA) interposers, which incorporate the structure of metal-on-elastomer hemi-torus and other geometrically configured electric contacts to facilitate an array of interconnections between diverse electrical components. The invention is further concerned with a method of producing the inventive LGA interposers.
[0005]Land Grid Array (LGA) interposers, by way of example, provide an array of interconnections between a printed wiring board (PWB) and a chip module, such as a Multi-Chip Module (MCM), among other kinds of electrical or electronic devices. LGA interposers allow connections to be made in a way which is reversible and do not require soldering as, for instance, in ball grid arrays and column grid arrays. Ball grid arrays are deemed to be somewhat unreliable on larger areas because the lateral thermal coefficients of expansion driven stresses that develop exceed the ball grid array strength. Column grid arrays hold together despite the stresses but are soldered solutions and, thus, do not allow for field replaceability, which is important because it saves the customer or user significant costs in the maintenance and upgrading of high-end computers for which LGAs are typically used.
[0006]2. Discussion of the Prior Art
[0007]The basic concept of utilizing LGA interposers to provide an array of electrical connections is well known in the technology. In this connection, reference may be made in particular to Hougham, et al., U.S. Patent Publication No. 2005/0106902 A1, which is commonly assigned to the assignee of this application, and the disclosure of which is incorporated herein by reference in its entirety. This publication describes LGA interposers which define structure consisting of metal-on-elastomer type electrical contacts, wherein a compliant contact consists of an elastomeric material structural element partially coated with an electrically conductive material, preferably such as a metal, so as to form the intended electrical contact. However, there is no disclosure nor suggestion of a compliant contact of an LGA interposer type providing multiple points of electrical contact for each gridpoint in a configuration, such as is uniquely provided by the present invention.
[0008]Johnescu, et al., U.S. Patent Publication No. 2005/0124189 A1 discloses an LGA-BGA (Land Grid Array-Ball Grid Array) connector housing and electrical contacts which, however, do not in any manner disclose the novel and inventive LGA interposer metal-on-elastomer structure as provided for herein.
[0009]Similarly, DelPrete, et al., U.S. Pat. Nos. 6,790,057 B2 and 6,796,810 B2; and Goodwin, et al., U.S. Pat. No. 6,293,810 B2, describe various types of elastomeric electrical contact systems and devices which, however, do not at all disclose the features and concept of the present inventive metal-on-elastomer LGA interposers and arrays pursuant to the present invention.
[0010]Metal-on-elastomer type LGA contacts, as described hereinabove, have been previously described in Hougham, et al. in which a compliant contact consists of a structural element of a non-conductive elastomer that is coated on a part of its surface with electrically conductive material, which resultingly forms the electrical connection. However, a compliant contact with multiple points of electrical contact for each gridpoint is only disclosed by the present invention, wherein several specific geometries and variants are also described. Among these, a hemi-torus shaped element, such as being similar in shape to one-half of a sliced donut in transverse cross-section) may be oriented concentrically with respect to a via (or proximate thereto), the latter of which passes through an insulating carrier plane to the other side thereof. Metal is deposited onto the external portions of the hemi-toroidal elastomer element in order to form a multiplicity of electrically conductive contacts.
[0011]There are two general instances of LGA interconnects made with hemi-toroidally shaped, or other kinds of structural contact elements constituted of elastomeric materials. In the first instance, holes or vias in an insulating carrier plane would first be filled with metal to form solid electrically conducting vias with a surrounding pad or dogbone pad. Onto these pads would be molded both top and bottom elastomeric LGA bodies possessing various shapes, for example, hemi-toroidal. Then in a final step, metal strips would be deposited from the via pad on each side up and over the apex or uppermost ridge of the elastomeric hemi-torus. As illustrated in the drawings, this would then form a continuous electrical path from the highest point on the top hemi-torus shape to the lowest point on the bottom hemi-torus shape at several points for an individual I/O.
[0012]In the second instance, the insulating carrier is initially unmetallized with open holes on the desired grid pitch. Then, the top and bottom elastomeric bodies, for instance, hemi-toruses are molded and metallization follows to form the electrically conducting path, as illustrated hereinbelow. In case that during molding, the open hole in the insulator were inadvertently (or purposely) filled with elastomer, (e.g. siloxane), this can be removed in a controlled fashion by a coring or punch step to open a continuous pathway from the top surface to the bottom surface. Metallization can then be deposited on the exposed surface, which is produced thereby in a desired pattern so as to form the electrically conductive pathway.
[0013]In addition to the standard two-sided LGA interposer, i.e., on both sides of an insulating carrier phone, a one-sided compliant contact is also generally known in the art, and referred to as a "hybrid" LGA in which the contacts are soldered (ball-grid-array or BGA) to the circuit board but form a compression connection with the module, as in Johnescu, et al., this frequently being referred to as a "hybrid BGA/LGA" or a "hybrid LGA/BGA" interposer.
[0014]There are several types of hybrid BGA/LGA's commercially available; however, the present invention describes a new type of hybrid BGA/LGA combining a metal-on-elastomer hemi-toroidally shaped top or upper contact with a solderable (BGA) bottom or lower contact. This provides significant advantages over existing technologies, and examples thereof are presented hereinbelow.
[0015]In one preferred embodiment, an insulating carrier plane with regularly spaced through-holes is treated to create a metal pad on top to fill the holes with electrically conducting metal for a through via, and a bottom surface, for example, by electroplating followed by photolithography. This produces a bottom surface with a pad for a BGA connecting to a circuit board. Then molded onto the top surface is a hemi-toroidal shape of an elastomeric material, such as siloxane rubber. The hemi-torus is located concentric to the metal via pad and surrounds it either fully or partly so that the elastomeric inside edge of the hemi-torus either touches the metal via and pad or lies outside the boundary of the via and pad. Then, metal is deposited to form a path of a continuous electrical connection leading from the top of the elastomer hemi-torus to the pad, which connects to the electrically conducting via to the bottom side of the insulating carrier plane creating a continuous conductive pathway from top to bottom. The metal on the elastomer may be distributed over the entire surface, or fabricated to consist of one or more strips connecting the top of the hemi-torus to the via pad. In a preferred embodiment there can be employed three strips, separated by 60 degrees from one another, although other quantities and spacing are shown herein. All of the strips start at the top of the torus, or slightly on the outside edge, and terminate on the pad in the center, this then providing multiple contact points, which is deemed electrically desirable.
[0016]Entrapment of air in the center of the hemi-torus is of concern as it could interfere with reliable seating of the electrical contact in compression. This potential concern can be mitigated by forming an opening or venting slit in the side of the torus during or after molding. Alternatively, any concern about entrapped air can be overcome by making the metal strips which extend over the top of the hemi-torus thick enough to extend over the elastomer surface, so that the gap produced between the uncoated area of the hemi-torus and the module bottom when the metal is in contact with the module bottom provides sufficient venting to allow a facile escape of air from the center of the hemi-torus upon actuation.
[0017]Another advantage to having multiple discontinuities in the hemi-torus shape resides in that each segment with its metal strip contact can move independently and better accommodate or compensate for non-uniformities in the mating surfaces.
[0018]The hemi-toroidal shape or the interposer can be molded from a compliant (rubbery) material onto each I/O position in an array, and metal strips are fabricated on the top surface of this shape so that they will provide multiple electrical pathways from a single chip module pad to a single printed circuit board pad. When this compliant hemi-torus is thus metalized, and preferably provided with discontinuities in the donut wall so that air would not be trapped preventing good contact, and provided that the compliant button stays well adhered to the insulating substrate or plane by virtue of anchoring holes, surface roughening, or surface treatments or coatings, then a uniquely functioning LGA is readily produced.
[0019]A structure pursuant to the invention possesses another advantage. For modules or PCBs that have solder balls or other protruding conductive structures, the LGA interposer array can be actuated into the module/PCB sandwich without the need for any separate alignment step or alignment structures. The ball will nest in the hemi-torus structure and center and stabilize itself with respect to any lateral motion in the x-y directions.
[0020]This provides another advantage which may sometimes be invoked, in that a module, which has had solder balls attached thereto, it in preparation for an ordinary BGA solder reflow step could instead be redirected on the assembly line for utilization in an LGA socket. Thus, a single product number part (balled module) could be used in two separate applications: 1) BGA soldering and 2) LGA socketing.
[0021]Such torus structures could be made by molding where the molds are made by drilling or machining with a router-like bit. Alternatively, it could be made by chemically or photoetching of the mold material utilizing a mask in the shape of a torus structure. The mask could be made by photolithography directly on the mold die or could consist of a premade physical mask (such as from molybdenum sheet metal) that was separately formed by photolithography and then applied to the mold die.
[0022]Another embodiment of this invention utilizes a hemi-torus that has been divided into three or four sections, each of which have been metalized to provide separate electrical paths, and whereby each section can respond mechanically independently when contacted with a pad or solder ball and can thus more reliably form a joint. Moreover, preferably a small space between these sections is created to allow gas to escape freely.
[0023]Pursuant to yet another embodiment, a number of the divided sections of a single hemi-torus can be made taller to provide a lateral stop for the case when a balled module is loaded preferably from one side thereof.
[0024]According to another embodiment, a wall shape of the sectionally-divided hemi-torus curves back in and under to form a nest so that when a solder ball is brought into contact therewith, it can be pressed down into the nest and snapped into place, or the shape could be curved simply to best nest a solder ball held in place there against.
[0025]As described in another embodiment, the I/O consists of multiple hemi-toroidal conic sections or domes that are fabricated into a group to service a single I/O. Each of these domes is metalized separately so that when contact is made with a module pad, redundant electrical paths are formed. The different contacts can also act independently mechanically thus being better able to accommodate local non-uniformities. A further modification would be to make a portion of the hemi-toroidal domes in such a group higher in the z-direction, thus providing a mechanical stop for cases where a balled module is loaded in part from one side, and thus able to constitute an alignment feature.
[0026]In the above embodiments, the structures and methods described can be applied to either single sided compliant LGAs (aka hybrid LGA), i.e., on one side of the carrier plane only, or to double sided LGAs. Further, they can be applied to hybrid cases where the corresponding metal pad is either directly in line with the center axis of the upper contact or may be offset therefrom:
[0027]As shown in another embodiment, the compliant structures are in a linear form rather than based on a torus or groups of domes. From a linear compliant bar, or alternatively a sectioned bar, multiple contact strips can be formed for each I/O. Further, the multiple metal contact strips could be located on different linear bars for a given I/O. Various arrangements could include multiple metal strips on the same linear section of compliant material, or on different adjacent linear bars in a line, or on different linear bars on either side of the central I/O via.
[0028]Reference may now be made to the following detailed description of preferred embodiments of the invention, taken in conjunction with the accompanying drawings; in which:
[0029]FIG. 1 illustrates generally diagrammatically, a metal-on-elastomer LGA interposer array, shown in a transverse sectional view, pursuant to a first embodiment of the invention;
[0030]FIG. 2A illustrates a modified embodiment of the metal-on-elastomer LGA interposers, shown in a transverse enlarged sectional view;
[0031]FIG. 2B illustrates a perspective view of the LGA interposer array of FIG. 2A;
[0032]FIG. 3 illustrates a perspective view of metal-on-elastomer LGA interposers;
[0033]FIG. 4 illustrates a transverse enlarged cross-sectional view of the LGA interposers of FIG. 3;
[0034]FIG. 5 illustrates a perspective view of a further embodiment of an LGA interposer array;
[0035]FIG. 6 illustrates a transverse enlarged cross-sectional view of the interposer array of FIG. 5;
[0036]FIG. 7 illustrates a perspective view of a further embodiment of a metal-on-elastomer LGA interposer array;
[0037]FIG. 8 illustrates a transverse enlarged cross-sectional view of the LGA interposer array of FIG. 7;
[0038]FIG. 9 illustrates a perspective view of a still further embodiment of a metal-on-elastomer LGA interposer array;
[0039]FIG. 10 illustrates a perspective view of a further embodiment of an LGA interposer array, which is similar to that illustrated in FIG. 7;
[0040]FIG. 11 illustrates a further embodiment in a perspective view of an LGA interposer array showing a modification relative to that shown in FIG. 10;
[0041]FIG. 12 illustrates a perspective representation of a further LGA interposer array, which is somewhat similar to that of FIG. 10;
[0042]FIG. 13 illustrates a transverse enlarged cross-sectional view of the LGA interposer array of FIG. 12;
[0043]FIG. 14 illustrates a perspective view of a further embodiment of an LGA interposer array;
[0044]FIG. 15 illustrates a transverse enlarged cross-sectional view of a portion of the LGA interposer array of FIG. 14;
[0045]FIG. 16 illustrates a transverse enlarged cross-sectional view of an embodiment which is somewhat similar to that of FIG. 14;
[0046]FIG. 17 illustrates a perspective view of a further embodiment of an LGA interposer array;
[0047]FIG. 18 illustrates a transverse enlarged cross-sectional view of the LGA interposer array of FIG. 17;
[0048]FIG. 19 illustrates a perspective view of a modified embodiment of the LGA interposer array, relative to that shown in FIG. 17;
[0049]FIG. 20 illustrates a transverse enlarged cross-sectional view of a portion of the LGA intexposer array of FIG. 19;
[0050]FIG. 21 illustrates a modified arrangement consisting of linear bars of metal-on-elastomer contacts shown in a perspective representation;
[0051]FIG. 22 illustrates a transverse enlarged cross-sectional view of a portion of the LGA interposer arrangement of FIG. 21; and
[0052]FIGS. 23-25 illustrate, respectively, alternative-processing concepts for providing the LGA interposer arrays in accordance with various of the embodiments described hereinabove.
[0053]In the detailed description of the various embodiments, elements or components, which are substantially similar or identical, are designated with the same reference numerals.
[0054]Referring to the embodiment of the metal-on-elastomer LGA interposer array 10, as illustrated in FIG. 1 of the drawings, there are shown a plurality of the interposers 12 in the form of hemi-toroidally shaped elements or so called buttons (generally simulating the shape of a transversely sliced donut). Each of the LGA interposer buttons 12 includes a plurality of circumferentially spaced flexible strip-like metal elements 14 forming electrical contacts which reach from the topmost surface 16 of each respective LGA button 12 to the via 18 which extends through an insulating carrier pad 20 on which the LGA interposer buttons are mounted, and down through the center of the LGA buttons so as to connect to a conductive pad 22 which surrounds through the through via on both sides of the carrier 20, and extends out along the insulating carrier surface beneath the LGA so as to make electrical contact at the other side or the lowermost end surface 24 of the inversely positioned lower LGA interposer buttons 26. The electrically-conductive flexible metal elements are primarily strips 14 which extend from the uppermost end of the respective upper LGA interposer buttons 12 inwardly into an essentially cup shaped portion extending to the hole or via 18 formed in the pad 22.
[0055]Consequently, by means of the pads 22, which are constituted of electrically conductive material or metal and which surround each of the through vias 18 formed in the dielectric material insulating carrier plane 20, these contact the ends of each of the metal strips 14, which extend along the external elastomeric material surface of each respective LGA hemi-toroidally shaped interposer structure or button 12. Accordingly, electrical contact is made from the uppermost or top end of each respective LGA interposer button to the lowermost end 24 of each of the opposite sided LGA interposer buttons 26 at the opposite or lower side of the insulating carrier plane 20.
[0056]With regard to the embodiment illustrated in FIG. 2A of the drawings, wherein the electrical elements 30 consisting of the strips positioned on the top surface 16 of the respective LGA interposer buttons 12 extend towards the through via 18, in this instance, there is no electrically conductive pad present as in FIG. 1, but rather the metallic or electrically conductive strips 30 forming the flexible metal contacts extend from the uppermost end 16 of the upper LGA interposer buttons 12 down through the via 18, the insulating carrier plane 20 to the lowermost ends or apices 24 of the lower inverted LGA buttons 26 on the opposite or bottom side of the structure 10.
[0057]In essence, in both embodiments, in FIGS. 1 and 2A, both the upper and lower LGA interposer buttons 12, 26 are mirror images and are symmetrical relative to each other on opposite sides of the insulating carrier plane 20. With regard to FIG. 2B of the drawings, this illustrates primarily a perspective representation of the array of the upper LGA interposer buttons 12 positioned on the insulating carrier plane 20.
[0058]Reverting to the embodiment of FIG. 3 of the drawings, in this instance, the flexible metal electrical contacts 34, which are positioned so as to extend from the upper ends 16 of each of the respective LGA interposer buttons 12 through the via 18 in the insulating carrier plane 20, as also represented in the cross-sectional view of FIG. 4, are designed to have the electrical metal contacts forming a plurality of flexible strips 34, which extend each unitarily from the upper ends 16 to the lower ends 24 of the hemi-torus shaped buttons 12, 26 from above and below the insulating carrier plane 20 in a mirror-image arrangement. Hereby, the multiple, circumferentially spaced metal electrical contact strips 34 extend from the uppermost point on one side of the insulating plane to the lowermost point on the opposite side so as to form electrical through-connections at both upper and lower ends and, in effect, forming a reversible structure 10.
[0059]As shown in FIG. 5 of the drawings, in that instance, each of the hemi-toroidally shaped interposer buttons 12, 26, which are essentially identical in construction with those shown in FIGS. 3 and 4 of the drawings, have the metal contacts 40 formed so that they extend in a common annular conductive sleeve structure 42 prior to continuing through the via 18, which is formed in the insulating carrier plane 20 to the upper and lower ends 16, 26 of the LGA interposer buttons 24. In FIG. 6 of the drawings, these contacts 40 separate only into separated strip-like portions 42 at the extreme uppermost and lowermost ends of the LGA interposer buttons 12, 26 and then join together into the essentially annular structure 44 extending through the via 18 formed in the insulating carrier plane 20.
[0060]Referring to the embodiment of FIGS. 7 and 8 of the drawings, these illustrate essentially a structure 50 wherein LGA interposer buttons 12 are arranged only on the upper surface 52 of the insulating carrier plane 20 in a manner similar to FIG. 1 of the drawings, and wherein the conductive strips 14 contact metallic or electrically-conductive pads 54 extending respectively through each of the through vias 18 formed in the insulating carrier plane 20. The lower surface of each metal pad 54, in turn, may have a solder ball 56 attached thereto in preparation for a subsequent joining, as is known in the technology.
[0061]As shown in the perspective representation of FIG. 9 of the drawings, in that instance, the LGA interposer array structure 60, which is mounted on the insulating carrier plane 20, is similar to that shown in FIGS. 7 and 8 of the drawings; however, a slit 62 is formed in the elastomeric material of each LGA interposer button 12, communicating with the interior 64 thereof, and with the through via 18, which is formed in the insulating carrier plane 20, so as to enable any gasses or pressure generated to vent from the interior thereof to the surroundings.
[0062]FIG. 10 of the drawings is also similar to the structure shown in FIG. 7, however, in this instance, each elastomeric interposer button 12 has a plurality of slits 62 or discontinuities formed in the annular toroidally-shaped walls thereof, preferably intermediate respective flexible metal strips 14, which are located on the upper and inward downwardly extending surface of each elastomer buttons, so as to enable each separate segment 68 to be able to resiliently or flexibly respond to changes or irregularities in the topography of elements contacting the LGA interposer buttons 12. Also, each segment 68 between each of respective metal contact strips 14 may respond mechanically or independently, so as not to only accommodate differences in topography with a mating surface or differences in the shape of mating solder balls, but in cases where a solder ball will be pressed against the toroidal contacts to produce an electrical connection. In effect, this will enable a mechanical or physical compensation for encountered differences in contact surfaces.
[0063]With regard to the embodiment of FIG. 11 of the drawings, which is somewhat similar to FIG. 10, in that instance, at least one or more of the segments 68, which are separated by the intermediate slits extending through the LGA interposer buttons are different in height, so as to have some of the segments 70 higher than others in a z- or vertical direction relative to the plane of the insulating carrier plane 20. In this instance, two segments 68 of the four independent segments of each respective LGA interposer button 12 are shown to be lower in height than the other segments 70.
[0064]With regard to FIG. 12 of the drawings, in this instance, the array structure 74 of the hemi-toroidal LGA interposer buttons 76, which are mounted on the insulating carrier plane 20, the opposite or lower side 78 of which has solder balls 80 connected to electrically-conductive pads 82 extending through the vias 18, has the centers 84 of the respective LGA interposer buttons 76, which have electrical strip-like contacts 88 extending downwardly, as shown in FIG. 13, have a contoured inner wall configuration 90, which allows for nesting or a snap-fit with a solder ball (not shown), which may be brought into engagement therewith. In this instance, FIG. 13 showing the cross-sectional representation of FIG. 12, illustrates the knob-shaped interior sidewall profile 90 of the compliant interposer button with the separate metal contact strips 88 extending upwardly along the interior of wall 90 to the topmost end 92 of each respective LGA interposer button 76.
[0065]As illustrated in the embodiment of FIG. 14 of the drawings, in this instance, as also shown in cross-section in FIG. 15; multiple metal strip contacts 88 extend from the top surfaces of the compliant LGA button structure 100, passing over the top surfaces 102 and extending down into the center part of the hole 104 provided in each interposer button 106, and meeting with a common pad-shaped metal conductor 108, which extends along the upper surface 110 of the insulating carrier plane 20 under the button in contact with strips 88 and outwardly until reaching a via 112, which extends the metal pad downwardly through the insulating carrier plane 20 and along the lower surface 114 thereof, so as to contact solder balls 116. This is illustrated in the cross-sectional representation of FIG. 15 of the drawings, which also shows a filled injection tube 120 extending through the insulating carrier plane 20 and a residue break off point 122, where an elastomer portion was separated from an injection port on a mold forming the entire LGA button structure. This embodiment, showing the filled injection tube for the plastic material, is adapted for the method in which the injection molding of elastomeric material is implemented from the bottom side of the insulating carrier plane 20.
[0066]As shown in FIG. 16 of the drawings, which is essentially similar to the embodiment of FIG. 15, in that instance, this illustrates a filler injection tube, the mold (not shown) forming the LGA button structure is implemented by injection molding from the top side of the mold, and a residual mass of elastomer 132 can be ascertained extending from the side 134 of the elastic LGA button structure 100 from which it was separated at the injection port of a mold.
[0067]Also indicated in FIG. 16 are two types of anchoring holes in the insulating carrier plane 20, wherein one hole 136 extends all the way through to the other side thereof, and wherein a blob 138 of residual excess molding material penetrates slightly beyond the bottom surface of the insulating carrier plane 20. Another type of anchoring hole or cavity 140 does not extend fully through the insulating carrier plane 20, but is formed as a depression in the top surface of the latter, so as to mechanically anchor the elastomeric material of each WA interposer button to the structure or plane 20.
[0068]Reverting to the embodiment of FIGS. 17 and 18 of the drawings, these show another aspect of providing an LGA interposer array 150 on an insulating carrier plane 20, wherein a multiple of LGA interposer buttons 152 of essentially conical configurations and their electrical metallic strip contacts 154, which extend over the topmost ends 156 thereof, service a common I/O electrical contact 158 in the form of a pad on the upper surface of plane 20. In this instance, the structure incorporates an electrically conductive via 160 extending through the insulating carrier plane 20, shown in a center of a group of four LGA interposer buttons 102, as a common meeting point of the metal contact strips 154 on pad 158, which extend from respectively one each of the top of each LGA button down the side thereof and into the via metallurgy of the structure, towards the bottom of plane 20, as shown in cross-section in FIG. 18 of the drawings.
[0069]Reverting to the embodiment of FIGS. 19 and 20 of the drawings, which is quite similar to the embodiment of FIGS. 17 and 18, in that instance, the primary distinction resides in that at least one or two of the LGA interposer buttons 152 of a respective group thereof has or have a height which differs from the remaining interposer buttons of that group. For example, two or more buttons 152 of each group may be taller than the remaining buttons 164 of that group (of four buttons) in order to essentially create a lateral stop mechanism for a side loading of a module, through such groupings of LGA interposer buttons in respective arrays. In essence, the different heights in the LGA interposer button groups enable a module with an associated solder ball to be brought into contact and aligned by means of lateral insertion, rather than only vertical insertion, wherein the higher LGA interposer buttons provide stops for the solder balls in order to register with the essentially hemi-toroidally shaped elastomeric contacts.
[0070]Reverting to the embodiment of FIGS. 21 and 22 of the drawings, in this instance, there is provided an LGA interposer array 170 arranged on an insulating carrier plane 20, wherein multiple points of contact for each I/O are provided by means of linear bars of elastomeric LGA interposers 172. This provides a compliant structure on which a plurality of spaced metallic electrical contact strip elements 174 may be positioned so as to extend from the top 176 of each respective interposer bar 172 both above and below the insulating carrier plane 20, as shown in FIG. 22, into electrically sleeve-like conductive vias 178 formed extending through the insulating carrier plane 20 in contact with respective metal strip contacts 180 above and below the insulating carrier plane 20. In that instance, the metal contact strips 180 may be formed with different shapes, such as one typical contact joining from two separate ships 182 into a single common strip 184 near the top, as clearly illustrated in FIG. 21, or joining further down near the via extending through the carrier plane to the other side. Furthermore, three or more contact points for each I/O may be provided and different types of contact elements may be utilized along the bar whereby some types may be more suitable for conduction of signals and others for high amperage power feeds.
[0071]As illustrated in FIGS. 23-25, there are shown alternate process flows for a balled module, wherein a balled module zoo, as shown in FIG. 23, can be directed either towards a solder reflow line for normal BGA connection to a PWB, as illustrated in FIG. 24, or alternatively, to an LGA interposer assembly 210 where it is assembled by means of a hemi-toroidal LGA and PWB (wiring board) under pressure to make a field replaceable unit, as shown in FIG. 25 of the drawings.
[0072]With regard to the configurations of the LGA interposer buttons, these may be of elastic structural members, which are conical, dome-shaped conic sections or other positive release shapes, such as roughly cylindrical or hemispherical, hemi-toroids, and wherein the metal coating forming the electrically conductive contact members or strips terminate at the apices of each of the multiple buttons.
[0073]Moreover, the elastomeric material, which is utilized for each of the LGA interposer buttons or for the linear shaped elastic structural member (as shown in FIGS. 21 and 22) may be constituted of any suitable molded polymer from any rubber-like moldable composition, which, for example, among others, may consist of silicon rubber, also known as siloxane or PDMS, polyurethane, polybutadiene and its copolymers, polystyrene and its copolymers, acrylonitrile and its copolymers and epoxides and its copolymers.
[0074]The connectors of the inventive LGA structure may be injection molded or transfer molded onto an insulating carrier plane 20, and may serve the purpose of mechanically anchoring the contact to the insulating carrier plane and in instances can provide a conduit for the electrical connections which pass from the top surface of the connector to the bottom surface thereof.
[0075]In addition to connecting chip modules to printed circuit boards, the arrays of the LGA interposer buttons or linear structure may be employed for chip-to-chip connection in chip stacking or for board to board connections, the contacts may be of any shape and produced by injecting the elastomer in the same side as where the elastomer contact will be anchored to the insulating carrier by a hole or holes or vias, which extend through the insulating carrier or by any cavity edge formed into the surface of the insulating carrier.
[0076]In essence, the molding of the elastomeric material component or components, such as the hemi-toroidal interposer or interposers may be implemented in that the elastomeric polymer material is ejected from the same side at which the interposer will be positioned on the insulating carrier plane, and will be anchored to the insulating carrier plane by means of a hole or holes, as illustrated in the drawings, which either extend completely through to the opposite side of the insulating carrier plane, or through the intermediary of a cavity which is etched or formed into the surface of the insulating carrier plane, which does not extend all the way through the thickness thereof, and wherein any cavity may have flared undercut sidewalls from maximum anchoring ability or by simple surface roughening of the insulating carrier plane. This is clearly illustrated in the embodiments represented in FIGS. 15 and 16 of the drawings.
[0077]While the present invention has been particularly shown and described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing and other changes in forms and details may be made without departing from the scope and spirit of the present invention. It is therefore intended that the present invention not be limited to the exact forms and details described and illustrated, but fall within the scope of the appended claims.
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Gregory Williams is a long-time database administrator.
I firmly believe that most Oracle database shops should have both a Test and a Production database. Of course, this also means that you also need to keep them in sync by refreshing your Test data on a regular basis -- a process which begs for automation.
When I decided to automate refreshing my Test database with data from Production data, I started by googling the Internet and discovered that most of the information I found suggested doing a full export/import of the Production database into Test database, or creating a clone of the Production database and recreating the Test database. These procedures assumed that you have at least the same amount of space on your test server as you do on your production server. In my case, I have a lot less space on my test server then I have on my production server; therefore, neither one of these procedures will work for me. Thanks to Oracle's Data Pump technology, I can export only the data that I need from Production into my Test database. For instance, I have videos stored in my Production database, which takes up a lot space, which I do not need in my Test database. The other feature that Data Pump has that's not in the old export/import technology is that it lets you export from a remote server. This is the main reason that I can automate my refresh test data process.
A new Oracle technology that I used is DBMS_SCHEDULER which let me create scheduled chains and scheduled programs. These technologies are all put together and run within Oracle's database using PLSQL packages and a lot of "execute immediate" functions. In this article, I show how to automate the refreshing of Test database with data from their Production database using the following Oracle technologies:
- Data Pump
- API -- export
- API -- import
- scheduled chains
- scheduled programs
- scheduled jobs
- Dynamic SQL (execute immediate)
In this article, I first list the steps involved, then explain each of the steps, and finally show how DBMS_SCHEDULER is used to execute each step as a chain.
The following steps automatically execute the Refresh Test Data procedure. All of these steps are accessed from within a PLSQL package -- SCHEMA_REFRESH -- except the last one which is run directly from the DBMS_SCHEDULER package. This PLSQL package is located in the Test database on the Test server:
- Export Prod Database
- Clear Schemas
- Import Prod Dump File
- Cleanup Test Database
- Send email