A method and apparatus identifies a region of interest of transient vibration data needing analysis and provides context and construction for analytical plots. The method provides transient data, determines a region of interest of the transient data, specifies a construction mode corresponding to a derived graphical display of the transient data, and specifies one or more construction parameters corresponding to the specified construction mode. The method also processes the transient data to produce at least one derived plot based on the transient data, the region of interest, the specified construction mode, and the specified construction parameters. This method may be performed by a graphical tool having a hardware module and a software module. The hardware module including a processor, a memory, a display, and a communicator, and the software module including a plotting module and a plot control module.

Historically, vibration data analysis in evaluating machinery health is a daunting task. First, only relevant sections of the vibration data require analysis. It may be desirable in some limited cases to analyze steady-state vibration data in order to confirm a minimal level of vibration. However, the relevant sections generally are the transient vibration data sections. Unfortunately, the volume of transient vibration data available for analysis may be unmanageable. For example. one transient analysis system can collect 32 channels of vibration data 5,120 times per second for over 48 hours. An effective analysis of data collected from such a system may necessitate analysis of a single, continuous time waveform containing over 800 million data points.
In order for such a data waveform to be analyzed sufficiently, it must be broken into smaller components or regions. Several different processing methods for sections of vibration data may be used in order to provide diagnostic benefits beyond viewing conventional waveforms and trend data (spectral-based parameter data plotted against time). Also, the different processing methods provide several display opportunities not available with plotted waveforms and trends. The processing and display methods available for vibration analysis include cascade/waterfall plots, average shaft centerline plots and Bode/Nyquist plots.
In order to effectively use the vibration analysis plotting tools discussed above, a user must be able to provide a data context for these alternative displays—that is, to identify the portion of the data to be processed. Additionally, parameters used to construct the plots must also be specified. For these reasons, a method and graphical tool to help users identify the portion of the transient data requiring analysis is needed. Also, construction parameters associated with the graphical tool are needed to help determine how the portion of transient data is sampled in order to populate any derived analysis plots including cascade/waterfall plots, average shaft centerline plots and Bode/Nyquist plots.
A method and apparatus for identifying a region of interest of transient vibration data requiring analysis solves the aforementioned and other problems. In one method for processing and displaying data, transient data is provided and a region of interest leading edge and trailing edge are determined, which together define the portion of transient data requiring analysis. A construction mode is specified corresponding to a derived graphical display of the transient data, and a construction parameter is also specified corresponding to the specified construction mode. The transient data is processed to produce at least one derived plot. The construction mode may be selected from; delta time construction mode, delta rpm construction mode, and fixed number construction mode. The derived plot may be selected from; cascade plots, average shaft centerline plots, and Bode/Nyquist plots.
In one embodiment, a graphical tool is provided for identifying a region of interest representing transient data chosen by a user. The graphical tool also derives and displays an analytical plot from the region of interest. The transient data is collected by a vibration sensing instrument and represents the vibration of a machine, and the transient data is communicated to the graphical tool by the vibration sensing instrument. The graphical tool may include a hardware module and a software module. The hardware module has a processor, a memory, a display, and a communicator. The memory is connected to the processor and stores the software module. The display is also connected to the processor and displays the transient data, the region of interest, and the analytical plots. The communicator is connected to the processor and communicates with the vibration sensing instrument. The software module has a plotting module and a plotcontrol module having a tools module containing tools used by the plotting module.

Method and apparatus for identifying a region of interest of transient vibration data requiring analysis


A giant magnetoresistive stack (10) for use in a magnetic read head includes a NiFeCr seed layer (12), a ferromagnetic free layer (14), a nonmagnetic spacer layer (16), a ferromagnetic pinned layer (18), and a CrMnPt pinning layer (20). The ferromagnetic free layer (14) has a rotatable magnetic moment and is positioned adjacent to the NiFeCr seed layer (12). The ferromagnetic pinned layer (18) has a fixed magnetic moment and is positioned adjacent to the CrMnPt pinning layer (20). The nonmagnetic spacer layer (16) is positioned between the free layer (14) and the pinned layer (18). The combination of layers with their respective atomic percentage compositions and thicknesses results in a GMR ratio of at least 12%.

The present invention relates generally to a giant magnetoresistive sensor for use in a magnetic read head. In particular, the present invention relates to a giant magnetoresistive read sensor having enhanced giant magnetoresistive responses and improved magnetic stability.
Giant magnetoresistive (GMR) read sensors are used in magnetic data storage systems to detect magnetically-encoded information stored on a magnetic data storage medium such as a magnetic disc. A time-dependent magnetic field from a magnetic medium directly modulates the resistivity of the GMR read sensor. A change in resistance of the GMR read sensor can be detected by passing a sense current through the GMR read sensor and measuring the voltage across the GMR read sensor. The resulting signal can be used to recover the encoded information from the magnetic medium.
A typical GMR read sensor configuration is the GMR spin valve, in which the GMR read sensor is a multi-layered structure formed of a nonmagnetic spacer layer positioned between a ferromagnetic pinned layer and a ferromagnetic free layer. The magnetization of the pinned layer is fixed in a predetermined direction, typically normal to an air bearing surface of the GMR read sensor, while the magnetization of the free layer rotates freely in response to an external magnetic field. The resistance of the GMR read sensor varies as a function of an angle formed between the magnetization direction of the free layer and the magnetization direction of the pinned layer. This multi-layered spin valve configuration allows for a more pronounced magnetoresistive effect, i.e. greater sensitivity and higher total change in resistance, than is possible with anisotropic magnetoresistive (AMR) read sensors, which generally consist of a single ferromagnetic layer.
A pinning layer is typically exchange coupled to the pinned layer to fix the magnetization of the pinned layer in a predetermined direction. The pinning layer is typically formed of an antiferromagnetic material. In antiferromagnetic materials, the magnetic moments of adjacent atoms point in opposite directions and, thus, there is no net magnetic moment in the material. It is desirable for the pinning layer material to have a high blocking temperature, the temperature at which the exchange coupling disappears. It is also desirable for the pinning layer material to have a low annealing temperature, the temperature at which the pinning and pinned layers are exchange coupled during manufacturing, to control magnetic behavior and prevent diffusion between thin layers in the GMR spin valve.
A seed layer is typically used to promote the texture and enhance the grain growth of the free layer consequently grown on top of it. The seed layer material is chosen such that its atomic structure, or arrangement, corresponds with the preferred crystallographic direction of the magnetization of the free layer material.
One principal concern in the performance of GMR read sensors is the maximum absolute change in resistance of the GMR read sensor, which directly affects the GMR ratio. GMR ratio (the maximum absolute change in resistance of the GMR read sensor divided by the resistance of the GMR read sensor multiplied by 100%) determines the magnetoresistive effect of the GMR read sensor. Ultimately, a higher GMR ratio yields a GMR read sensor with a greater magnetoresistive effect which is capable of detecting information from a magnetic medium with a higher linear density of data.
Key determinants of the GMR ratio are the materials used as the pinning layer and as the seed layer in the GMR read sensor. A pinning layer material with a low annealing temperature makes it possible to use a thinner free layer which decreases the resistance of the GMR read sensor which in turn increases the GMR ratio. Also, a seed layer material that causes specular scattering and spin filter effect at the seed layer and free layer interface increases the change in resistance of the GMR read sensor which increases the GMR ratio.
Accordingly, there is a need for a GMR read sensor with a higher GMR ratio and for an antiferromagnetic material with a high blocking temperature and a low annealing temperature for use as a pinning layer.
The present invention is a giant magnetoresistive stack for use in a magnetic read head. The giant magnetoresistive stack includes a NiFeCr seed layer, a ferromagnetic free layer, a nonmagnetic spacer layer, a ferromagnetic pinned layer, and a CrMnPt pinning layer. The free layer has a rotatable magnetic moment and is positioned adjacent to the NiFeCr seed layer. The pinned layer has a fixed magnetic moment and is positioned adjacent to the CrMnPt pinning layer. The spacer layer is positioned between the free layer and the pinned layer. In a first preferred embodiment, the free layer is a NiFe/CoFe bilayer, the spacer layer is formed of copper, and the pinned layer is formed of CoFe. In a second preferred embodiment, the free layer is a NiFe/CoFe bilayer, the spacer layer is formed of copper, and the pinned layer is a CoFe/Ru/CoFe synthetic antiferromagnet.

Giant magnetoresistive sensor with a CrMnPt pinning layer and a NiFeCr seed layer


A device for enhancing the performance of a real time executive kernel associated with a multiprocessor structure possibly comprising a large number of processors comprises a real time operator behaving, as seen from the processor of the structure, like a memory area. The real time operator sends and receives data to be processed, generates communication control signals and manages the real time context of the processors of the structure. It comprises a plurality of identical hardwired real time operator circuits accessible simultaneously by the processors of the structure but each associated with one only of said processors. The device can be used even if the structure comprises a large number of processors.

1. Field of the Invention
The present invention concerns a device for optimizing the performance of real time primitives of a real time executive kernel in multiprocessor structures, especially, but not exclusively, multiprocessor structures on board an aircraft.
2. Description of the prior art
The execution of a job by a computer uses processors operating in highly disparate time scales. As a result a single complex job cannot use efficiently all the elements of a configuration. It is possible to increase efficiency if the job is broken down into a plurality of simpler jobs ready to be executed.
The fundamental role of the kernel is therefore to create a plurality of virtual machines that are almost independent of each other. This involves organizing how the different elements of the configuration (or resources) are shared between the jobs in progress. The kernel handles input-output management, firstly because the respective units are part of the resources that it monitors and secondly because events associated with input-output usually modify the status of jobs being executed. Finally, the kernel handles auxiliary functions such as date and time management.
To go into more detail, the kernel generates one or more virtual machines which usually have the following properties:
the virtual machine is a multiprocessor capable of executing a plurality of programs apparently simultaneously: to this end the operating system distributes processor time and main memory between entities called "tasks" and may also provide intertask communication mechanisms; PA0 the kernel handles the details of input-output operations: scheduling, error correction and synthesis of complex operations. The programming language of the kernel virtual machine is in the form of an extension of the machine language of the host computer, a special mechanism enabling new instructions called primitives to be created, the role of these primitives being to request intervention of the kernel to execute complex operations. It is at this level that are found the so-called "real time" functions enabling use of devices reserved to the system. PA0 active if it is executing on one of the processors of the configuration; PA0 waiting otherwise; it may be awaiting an event if it has subcontracted an operation to another element of the configuration and is waiting for this to finish; it may equally well be awaiting a resource if it requires a unit that is not available to continue working. PA0 shorter execution times for real time primitives in multiprocessor architectures, PA0 machine (processor type) independence, PA0 a hardware implementation suitable for use on board aircraft (compact overall dimensions, low power consumption), PA0 processing of external events in minimum time, PA0 easy implementation of various kernels, PA0 easy interfacing to high-level language compilers. PA0 a) a first state in which it processes a primitive requested by one of the processors of the structure, PA0 b) a second state in which it processes a local request internal to the circuit concerning only tasks for which it is responsible (expiry of a timer or occurrence of a hardware event), PA0 c) a third state in which it is awaiting processing. PA0 request for access to the real time operator by the structure to process a primitive, this mode comprising verification beforehand by the structure of free access to the real time operator and subsequent hardware response to said verification from the real time operator to the structure, PA0 if the real time operator is free, sending of the code and of the parameters of the primitive to the real time operator merely by writing the real time operator addressing area, PA0 execution by the real time operator after acquisition of said codes and of said parameters of an operational sequence relating to the primitive, PA0 the decision by the real time operator, on the basis of said primitive and of the real time context: PA0 reading of the real time operator response by the processor which requested the primitive and by the processors which have received an interrupt, at the real time operator address. PA0 priority number, PA0 time protection, PA0 etc. PA0 a local event known only to the associated processor (only tasks of the associated processor can manipulate or await this event), PA0 a global event (any task of the multiprocessor structure can manipulate or await this event). PA0 active resources or processors, PA0 clock resource, PA0 passive resources (system element, subroutine or non-sharable hardware). PA0 the passive resource constitutes the mechanism for controlled sharing of possession of a hardware or software element, PA0 the clock resource and the active resources are managed by the RTO but they cannot be manipulated directly by primitives. PA0 a timer, PA0 a resource, PA0 an event, PA0 a cycle. PA0 a) The primitives associated with tasks which use the processor to communicate with the RTO are indicated hereinafter with the associated objects in parentheses: PA0 b) The primitives associated with resources (not sharable by the processors) comprise at least: PA0 c) The primitives associated with events comprise at least: PA0 local primitives which are requested by a processor Pi and concern only the processor Pi (example: processor Pi requests activation of a task Tj on processor Pi), PA0 global primitives which are requested by a processor Pi and concern all the processors Pj of the multiprocessor structure (example: processor Pi requests that the status of the global event "EVK" is changed to "occurred", which may activate tasks on any processor of the structure), PA0 remote primitives which are requested by a processor Pi and concern only another processor Pj (i not equal to j) of the multiprocessor structure (example: processor Pi requests activation of a task TK on processor Pj).
The kernel virtual machine is accessible from higher level machines and, through the latter, from tasks submitted by users.
Above the kernel are subsystems which create tasks and submit them to the kernel for execution.
From the point of view of the kernel a task represents a job to be executed, that is to say the combination of a program and data to which it applies. The context of a task is the set of all information accessible to it, that it modifies or which may condition its execution. The program of a task cannot distinguish between two identical contexts. A task can therefore be interrupted at any point and restarted later without affecting the processing that it performs, provided that its context is restored to the state in which it was interrupted.
From the point of view of the kernel a task can be in either of the following two fundamental states:
A resource is a component of a data processing system that can be individually allocated to a task; a resource is said to be preemptible if it is released under the control of the system or non-preemptible if it is released under the control of the user task.
In multiprocessor architectures, and especially in multimicroprocessor architectures, implementing the kernel virtual machine by programming a machine language of the system has a number of drawbacks associated in particular with the power (lack of power) of the microprocessors which yields mediocer performance (excessively long execution times, for example) incompatible with some applications and in particular with real time applications of the kind used by systems on board aircraft, for example, in particular as aids to aircraft control and navigation.
It should be borne in mind that the recent rapid developments in aircraft performance are due in no small part to the proliferation of digital electronics.
Digital electronics implies a severe real time context and attempts to implement the real time kernal at the software level are not a good match to the requirements of an avionics type real time environment.
This is the case, for example, with the device described in the patent DE-A-3 105 527 which implements a real time executive kernel using a dedicated machine adapted to perform algorithms executed in the primitives of said kernel.
With a view to eliminating these drawbacks there have already been proposals, for example in the French patent publication No 2,604,543, to implement a real time executive kernel using a microprogrammed and hard wired logic machine dedicated to the algorithms executed in the primitives of the kernel. This machine is similar to a coprocessor associated with the system and in which the objects managed, which may comprise tasks, hardware and software events, resources and time, are associated with a series of basic primitives which can be combined to obtain the primitives of the kernel implemented on the system for a given application, these primitives constituting the kernel that the processors use to enable the machine to manage the tasks for carrying out the functions.
This system has the advantages that it responds specifically to the requirements of onboard data processing in an appropriate real time environment and that it provides:
However, this solution is limited in terms of performance because it employs a single machine to be used by all the processors of the multiprocessor structure.
A particular object of the invention is to circumvent this problem in such a way as to enhance the performance of the system.

Device for enhancing the performance of a real time executive kernel associated with a multiprocessor structure that can include a large number of processors


A constant-voltage power supply circuit includes a first output device provided in a first power feed line from a dc power supply to a first load. The first output device includes a first voltage control element for controlling an output voltage to the first load. A first control device operates for detecting the output voltage from the first output device to the first load, and controlling the first voltage control element to equalize the output voltage from the first output device with a first predetermined constant voltage. A second power feed line is connected to the first power feed line for feeding electric power to a second load. A second output device provided in the second power feed line includes a second voltage control element for controlling an output voltage to the second load. A second control device operates for detecting the output voltage from the second output device to the second load, and controlling the second voltage control element to equalize the output voltage from the second output device with a second predetermined constant voltage.

1. Field of the Invention
This invention relates to a constant-voltage power supply circuit which is able to feed constant voltages to plural loads respectively.
2. Description of the Related Art
It is known to use a plurality of constant-voltage power supply circuits in the case where different constant-voltages are required to be fed to separate loads respectively. This combination of the constant-voltage power supply circuits serves as a composite power supply circuit of a multiple-output type which is able to feed constant voltages to plural loads respectively. It tends to be difficult to make such a multiple-output constant-voltage power supply circuit into a single IC chip for some reasons. Accordingly, the reduction in size of the multiple-output constant-voltage power supply circuit is considerably limited.


A substrate processing method includes the step of removing carbon from a silicon substrate surface and planarizing the silicon substrate surface from which carbon has been removed.

In the technology of recent advanced high-speed semiconductor devices, use of the gate length of 0.1 μm or less is becoming possible with the progress in the art of ultrafine semiconductor fabrication processes. Generally, operational speed of a semiconductor device is improved with device miniaturization, while there is a need, in such extremely miniaturized semiconductor devices, to reduce the thickness of the gate insulation film thereof with the decrease of the gate length achieved as a result of the device miniaturization.
When the gate length has been reduced to 0.1 μm or less, on the other hand, the thickness of the gate insulation film has to be reduced to 1–2 nm or less when a conventional thermal oxide film is used for the gate insulation film. In such an extremely thin gate insulation film, however, there inevitably arises a problem of increased tunneling current, while such an increased tunneling current causes the problem of large gate leakage current.
In view of the situation noted above, there has been a proposal of using a high-dielectric material (so-called high-K dielectric material) having a much larger specific dielectric constant as compared with a thermal oxide film and thus capable of achieving a small SiO2-equivalent thickness while maintaining a large physical thickness, for the gate insulation film. Such a high-K material includes Ta2O5, Al2O3, ZrO2, HfO2, ZrSiO4, HfSiO4, and the like. By using such a high-K dielectric material, it becomes possible to use the physical thickness of about 4 nm in ultra high-speed semiconductor devices having a gate length of 0.1 μm or less. Thereby, the gate leakage current caused by tunneling effect is successfully suppressed.
In a semiconductor device that uses such a high-K dielectric film for the gate insulation film, it is preferable to form the high-K dielectric film directly on a Si substrate for reducing the SiO2 equivalent thickness of the insulation film. However, in the case the high-K dielectric film is formed directly on the Si substrate, the metal elements in the high-K dielectric film tend to cause diffusion into the Si substrate, and there arises the problem of carrier scattering in the channel region.
From the viewpoint of improving carrier mobility in the channel region, it is preferable to interpose an extremely thin base oxide film having a thickness of 1 nm or less, preferably 0.8 nm or less, most preferably 0.4 nm or less, between the high-K dielectric gate oxide film and the Si substrate. It should be noted that this base oxide film has to be extremely thin. Otherwise, the effect of using the high-K dielectric film for the gate insulation film would be canceled out. Further, such an extremely thin base oxide film has to cover the surface of the Si substrate uniformly, without forming defects such as interface states.
FIG. 1 shows the schematic construction of a high-speed semiconductor device 1 having a high-K dielectric gate insulation film.
Referring to FIG. 1, the semiconductor device 1 is constructed on a silicon substrate 2 and includes a high-K dielectric gate insulation film 4 such as Ta2O5, Al2O3, ZrO2, HfO2, ZrSiO4, HfSiO4, and the like, formed on the silicon substrate 2 via a thin base oxide film 3. Further, a gate electrode 5 is formed on the high-K dielectric gate insulation film 4.
In the semiconductor device 1 of FIG. 1, there is conducted nitrogen (N) doping in the base oxide film 3 within the range that interface flatness is maintained between the silicon substrate 2 and the base oxide film 3, and because of this, the base oxide film 3 has a larger specific dielectric constant as compared with a pure silicon oxide film. Thereby, it becomes possible to reduce the oxide-equivalent thickness of the base oxide film 3 further. By introducing nitrogen into such an extremely thin base oxide film 3 with a thickness of about 1 atomic layer, it becomes possible to improve the mechanical stability at the interface to the high-K dielectric gate insulation film 4 (Lucovisky, G., et al., Appl. Phys. Lett. 74, 2005, 1999).
As explained before, it is preferable that the base oxide film 3 has as small thickness as possible in such a high-speed semiconductor device 1.
In the case of forming such an extremely thin oxide film on a silicon substrate surface, it is not only necessary to remove the native oxide film but also other impurity element, particularly carbon originating from the organic materials in the atmosphere, from the surface of the silicon substrate. When the film formation process is conducted in the state carbon is remaining on the silicon substrate surface, the carbon atoms cause a reaction with the silicon atoms in the silicon substrate and there is formed SiC on the substrate surface. Such Sic forms defect in the oxide film. Further, the silicon substrate surface thus cleaned has to be planarized before the formation of the thin insulation film. Further, in view of the fact that such a cleaned silicon substrate easily undergoes formation of native oxide film or absorbing of organic materials in the air when the substrate is left in the air, it is necessary that such a substrate pre-processing has to be conducted immediately before the substrate processing by way of a single-wafer process.
Conventionally, several technologies are known for planarizing the silicon substrate surface.
For example, there is a known technology of manufacturing a substrate in which the planarization of the substrate surface is achieved by causing to flow a current in an ultra-high vacuum environment. However, such a planarization process requires ultra-high vacuum environment of 10−9–10−10 Torr, and thus, it is difficult to use such a process for a substrate preprocessing process conducted in a mass production line of semiconductor devices. Further, it is difficult to construct a cluster-type semiconductor production apparatus that conducts a single-wafer process by combining the foregoing planarization process in combination with other semiconductor fabrication processes.
Further, there is a known substrate manufacturing technology that conducts so-called denuded-zone (Dz) annealing for a silicon substrate formed by a Czochralski (Cz) growth method or MCz (magnetic-field-applied Czochralski) growth method and containing large amount of interstitial oxygen at the temperature of about 1100° C. and form an intrinsic gettering layer in the silicon substrate (Matsushita Y., et al., Extended Abstracts of the 18th (1986 International) Conference on Solid State Devices and Materials, Tokyo, 1986, pp. 529–532). However, this substrate manufacturing process is, while effective for reducing the defect density of the substrate, not effective for achieving the planarity, particularly the planarity of atomic-layer grade, on the substrate surface. Further, this process requires a high-temperature treatment in an electric furnace and is not suitable for constructing a cluster-type semiconductor production apparatus that conducts a single-wafer process in combination with other semiconductor manufacturing processes.
Further, there is a known substrate manufacturing technology known as Hi-wafer in which a silicon substrate formed by a Czochralski (Cz) process is held for a long time in a hydrogen ambient at a high temperature of 1100–1200° C. for improvement of the quality of the silicon substrate (NIKKEI MICRODEVICES, May, 1993, pp. 63–64). According to this Hi-wafer technology, it becomes possible to reduce the defect density at the silicon substrate surface further as compared with the case of the Cz substrate subjected to the intrinsic gettering process. Further, there is a known technology of planarizing the silicon substrate surface to the degree that atomic layer steps become observable by conducing a thermal annealing process in the hydrogen ambient at the high temperature of about 1100° C. (Yanase, Y., et al., Electro-Chemical Society, Abstract No. 296, 1993, pp. 486). However, this method, also requiring a high-temperature thermal annealing process in an electric furnace, is not suitable for constructing a cluster-type semiconductor production apparatus that conducts a single-wafer processing in combination with other semiconductor manufacturing processes.
Further, there is proposed a so-called RTH process that achieves planarization by treating a silicon substrate in a low-pressure hydrogen ambient (Ono, A., et al., 2001 Symposium on VL SI Technology Digest of Technical Papers, 7A-2, pp. 79–80). However, this substrate preprocessing process, requiring a high-vacuum environment and hydrogen ambient, is not suitable for constructing a cluster-type semiconductor production apparatus in combination with other semiconductor processes.
Thus, while there have been available processes of planarizing a silicon substrate surface to the degree that atomic layer steps become observable, such conventional processes require ultrahigh vacuum environment for thermal annealing process or thermal annealing process in a hydrogen ambient, and it has been difficult to construct a cluster-type semiconductor manufacturing process that conducts a single-wafer process of large-diameter wafers in combination with other semiconductor processes.
As explained previously, such a nearly complete planarization of silicon surface is essential in the fabrication process of ultrahigh-speed semiconductor devices as the preprocessing process when forming a base oxide film with the thickness of 2–3 atomic layers, in advance to the step of forming the high-K dielectric gate insulation film.

Method and device for processing substrate, and apparatus for manufacturing semiconductor device


A locking mechanism is provided for securing a plug with a cable to an electronic device. The locking mechanism includes a base portion configured to abut against a side of the plug, a pressing portion slantingly extending from an end of the base portion, at least one tab protruding from the pressing portion near the base portion, and a clamping portion extending from the other end of the base portion and configured to engage with the cable.

1. Technical Field
The present invention relates to locking mechanisms and, more particularly, to a locking mechanism for a plug
2. Description of Related Art
Referring to FIG. 4, a traditional plug 10 (such as an RJ45 plug or an RJ11 plug) is arranged at one end of a cable 20 to connect to an electronic device (such as a telephone or a computer). Typically, the plug 10 includes an integral retaining tab 11 extending therefrom for retaining the plug 10 in a socket of the electronic device. The retaining tab 11 of the plug 10 is fragile and prone to breaking during attachment and detachment of the plug 10. When this happens, it is inconvenient to replace the plug 10 with a new one.


A device for conditioning the tip of a pool cue includes a hand-held housing containing a motor and two or more separate tip conditioning mechanisms separately powered by the motor. The pool cue can be inserted into one opening in the housing for subjecting the cue tip to a scuffing action. The pool cue can be inserted into a second opening in the housing in order to apply chalk to the cue tip surface. Preferably the housing contains a powder dispenser for supplying moisture-absorbing powder to the hands of the pool player.

This invention relates to a device for conditioning (or reconditioning) the tip of a pool cue. The conditioning activity can involve scuffing or grinding the cue tip, or adding chalk to the cue tip. The conditioning device is a portable hand-held implement having an internal battery-powered motor and several separate rotary tip conditioning mechanisms selectively connectable to the motor when contacting the tip of a pool cue.
The concept of mechanically adding chalk to the tip of a pool cue is known in the prior art. U.S. Pat. No. 798,914 issued to C. Michaelson on Sep. 5, 1905, shows a chalking device that includes a chalk holder attached to the drive shaft of an electric motor. When the motor is energized and a pool cue is inserted into the device, the rotating block of chalk rubs against the cue tip surface to rechalk the tip.
U.S. Pat. No. 3,781,008, issued to C. Espinoza on Dec. 25, 1973 introduces a timing feature to the mechanical chalking apparatus. A timing mechanism de-energizes the motor after a predetermined time, typically ten seconds. The object is to avoid unnecessary energization of the motor and chalk waste caused by prolonged insertion of the pool cue into the chalking device.
U.S. Pat. No. 3,894,735, to R. Dickens discloses a chalking apparatus wherein the chalk holder is slidable on the motor shaft so as to engage a motor control switch when a pool cue is inserted into the apparatus. The motor is energized only when a pool cue contacts the chalk.
The present invention relates to a hand-held implement having a spherical housing, an electric motor within the housing, at least two separate cue tip conditioning mechanisms within the housing, and clutch means for selectively transmitting a drive force from the motor to either tip conditioning mechanism when a cue tip is brought into pressure contact with the respective conditioning mechanism.
One of the tip conditioning mechanisms includes means for scuffing or abrading the surface of the cue tip. Another tip conditioning mechanism includes a block of chalk for adding chalk to the cue tip surface. Depending on the apparatus construction, up to four separate tip conditioning mechanisms can be incorporated into the housing.
In the preferred practice of the invention, a powder dispenser is included in the housing. Persons playing pool or billiards can recondition the pool cue tips and at the same time add moisture-absorbing powder to their hands, using a single apparatus.
Further features of the invention will be apparent from the attached drawing and description of an illustrative embodiment of the invention.


A static antenna tuning and antenna voltage measurement circuit (40) includes antenna voltage conversion circuitry (44) for converting a voltage signal (42) to a measurement signal representative of transmitter/receiver antenna (16) operation. Voltage signal (42) arises from transmitter/receiver antenna (16) transmitting or receiving a recognition signal (S1, S2). Comparator circuitry (48, 50, 52) compares the measurement signal to a predetermined optimal transmitter/receiver antenna operation signal. Control circuitry (54, 56) controls the tuning of transmitter/receiver antenna (16) such that (a) in the event that the measurement signal indicates optimal performance of transmitter/receiver antenna (16) relative to the predetermined optimal transmitter/receiver antenna operation signal, storing the measurement signal as the predetermined optimal transmitter/receiver antenna operation signal; (b) in the event that the measurement signal indicates less than optimal performance of transmitter/receiver antenna (16), generating a tuning signal to antenna tuning circuitry (56) associated with transmitter/receiver antenna (16); and (c) repeating steps (a) and (b) until an optimal transmitter/receiver antenna performance condition exists.

Various types of recognition systems are taught by the following commonly assigned U.S. Patents and Applications: U.S. Pat. Nos. 5,287,112; 5,270,717; 5,196,735; 5,170,493; 5,168,282; 5,126,745; 5,073,781; 5,053,774; 5,025,492; U.S. Ser. No. 08/021,123, filed Feb. 23, 1993 TI-17529!; Ser. No. 08/065,286, filed May 21, 1993 TI-16981!; and Ser. No. 08/086,786, filed Jul. 2, 1993 TI-17507!. Systems conforming to the teachings of the foregoing documents are marketed under the name TIRIS ("Texas Instruments Register and Identification System"). A recognition system similar in result to, but structurally and functionally specifically different from, TIRIS is disclosed in U.S. Pat. No. 4,918,955. Other types of recognition systems include systems known as AVI (for "Automatic Vehicular Identification"), as taught, for example, by commonly assigned U.S. Pat. No. 5,287,112 and commonly assigned U.S. application Ser. No. 08/021,123, filed Feb. 23, 1993.
In one type of TIRIS recognition system of interest, a transmitter/receiver (also referred to herein, in the claims hereof and elsewhere as an "interrogator" or a "reader") selectively radiates energy via an associated first antenna. The energy is radiated from the vicinity of a key-operated lock, such as a vehicle ignition switch. The radiated energy is often referred to as an "interrogation signal." The radiated energy is received by a second antenna present on or in a key. The key also includes facilities, such as circuitry (sometimes called a "transponder" or "tag"), connected to the second antenna. An electrical signal produced or induced in the key's circuitry by the received energy either is affected (e.g., increased or decreased) by the circuitry or effects the generation of a stored, uniquely coded signal by the circuitry. The affected or coded signal is often referred to as a "recognition signal."
Depending on the constituents of the key's circuitry, either the recognition signal is transmitted or reflected back to the transmitter/receiver via the second and first inductors or antennas. A key "matching" the particular ignition switch transmits or causes a predetermined recognition signal. Other keys which operate other ignition switches associated with similar recognition systems may similarly respond to the interrogation signal but transmit recognition signals different from the predetermined recognition signal.
The transmitter/receiver includes facilities which analyze the recognition signals received thereat to determine if the analyzed signal is the predetermined recognition signal produced by the matching key. If the analyzed signal is the predetermined recognition signal, the concurrence of such predetermined recognition signal and the operation of the ignition switch by the matching key starts the engine of the vehicle. If the analyzed signal is not the predetermined recognition signal, either the ignition switch cannot be operated by the key, or, if it can be operated, such operation is ineffective to start the engine.
Portability and/or space limitations usually result in the transmitter/receiver of a TIRIS-type of recognition system being not very powerful. Also, the recognition signals, that is the signals transmitted or reflected back to the transmitter/receiver from the key-included circuitry, may be derived from the limited energy radiated from the transmitter/receiver, not from energy derived from a key-contained power source, such as a battery, as is typical in systems of the AVI type. While the use of a battery with key-included circuitry of a TIRIS system is technically possible, the large size and resulting unwieldiness of the resulting key would probably lead to rejection by users. As a consequence of the foregoing, it is critical that circuit efficiencies be as high as possible.
One type of recognition circuitry of the subject type includes active and passive components, which in response to the receipt of energy from the transmitter/receiver produce a coded signal. See the above-noted commonly assigned U.S Patents and Applications. The coded signal, which may be produced by data stored in memory, is transmitted back to the transmitter/receiver, where comparison with the stored "matching" signal is carried out. The coded signal may be produced by modulating a carrier with the stored code, and the carrier may be, or may be derived from, the energy received by the key-included facilities from the transmitter/receiver. In this latter event, the system may be of the TIRIS variety, and the key and its circuitry require no on-board power source and may be said to be "batteryless." This third type of system may also be of the AVI variety, in which case the transponder is typically powered by a self-contained power source.
Recognition systems of the above type may be the full-duplex variety. Specifically, the transmitter/receiver may simultaneously operate as both a transmitter and a receiver, that is, it may simultaneously radiate energy to the key-included circuitry and receive for analysis the corresponding signal produced by such circuitry. Typically, in full-duplex operation, the frequency of the modulated carrier radiated by the transmitter/receiver to the key-included circuitry is different from the frequency of the modulated carrier produced by the key-included circuitry and thereafter received and analyzed by the receiver/transmitter. See above-noted commonly assigned application Ser. No. 08/012,123 TI-17529!.
In both the full-duplex and half-duplex recognition systems, an important consideration is proper operation of the transmitter/receiver antenna. For proper operation, it is important that the antenna be properly tuned. Conventional antenna tuning mechanisms and methods require that the antenna be manually tuned. This can be a laborious and sometimes impractical process.
In addition, with conventional recognition systems, there is the need for a measuring device that measures the antenna voltage to maintain and control the resonance circuit voltage for proper operation of the transmit/receive antenna. This measurement is subject to its own limitations, such as inaccuracies and the basic difficulty of taking the antenna voltage measurement.

Static antenna tuning and antenna voltage measurement


A method and system for proving a solenoid drive circuit. An exemplary solenoid drive circuit comprises a solenoid drive circuit input coupled to a primary switch. The primary switch comprises a first set of contacts residing in a first stable position. A remote control switch is coupled to an output of the primary switch and the remote control switch comprises a solenoid drive circuit having a predetermined delay. The predetermined delay energizes a solenoid after the primary switch contact transitions from a first stable position to a second stable position.

1. Field of the Invention
The present invention is generally directed to remote control switches. More particularly, the present invention is directed to remote control switches, such as lighting contactors that are electromagnetically-operated, mechanically held switch. One such remote control switch is disclosed in U.S. Pat. No. 4,430,579 which is herein entirely incorporated by reference and to which the reader is directed for further information. Such switches may be utilized in a wide range of different applications and are typically used for controlling lighting, heating and other like or similar type loads. A conventional remote control switch comprises essentially a circuit disconnect device that may be operated from one and/or a plurality of separate or interrelated control stations. Such control stations may be spread out over an area such as locally dispersed within a room, across a building, or some other remotely located area. However, aspects of the invention may be equally applicable in other scenarios as well.
2. Description of Related Art
A general diagram of a conventional remote control electromechanical switch circuit 10 is illustrated in FIG. 1. As can be seen from FIG. 1, remote control electromechanical switch circuit 10 comprises a primary switch 12 coupled to a remote control switch 14. Primary switch 12 comprises mechanical contacts 40. Primary switch 12 is coupled to AC line 28 and to an input of remote control switch 14. Mechanical contacts 40 of primary switch 12 may be switched or positioned in either an up position 30 or a down position 32. FIG. 1 illustrates the mechanical contacts 40 of switch 12 in an up position 30. Primary switch 12 is utilized to provide AC power from AC line 28 to remote control switch 14. AC line 28 may comprise a conventional industrial AC line having 115/220 VAC, 50/60 Hz, however, the primary switch 12 may be utilized with other power grids as well.
Remote control switch 14 comprises a first set of contacts 16, a diode 20, a solenoid 24, and a second set of contacts 26. The first set of contacts 16 is coupled to an output of primary switch 12 whereas the second set of contacts 26 powers a load 27.
Both solenoid control switch 36 and power load switch 38 are physically linked to solenoid 24. Solenoid control switch 36 and a power load switch 38 have certain stable, mechanically locked positions and certain of these positions are illustrated in FIG. 1. For example, solenoid control switch 36 is illustrated in a down stable position 34 while power load switch 38 is illustrated in an up or open stable position 26a. In this up or open position 26a, load 27 remains unconnected
AC line is continuously coupled to the primary switch 12. When primary switch contact 40 moves from the up position 30 to the down position 32, the solenoid 24 energizes and thereby moves both of the physically linked contacts 16 and contacts 26 until a closed solenoid position 26b is reached. In this closed solenoid position 26b, the solenoid 24 is disconnected from the line 28 via open contacts 16 in position 36. Operation and control of remote control switch 14 may be explained in detail with reference to the various timing diagrams illustrated in FIGS. 2(a-e).
For example, FIG. 2a illustrates an exemplary AC line voltage 28 that may be applied to primary switch 12 and that is eventually applied at node 18 of mechanical remote control circuit 10. Node 18 resides after contact 16 but before diode 20 in FIG. 1. Once AC line voltage 28 appears at diode 20 (such as at point 28a in FIG. 2c diode 20 conducts only a positive half wave of the applied AC power to solenoid 24. Consequently, this half wave voltage of AC voltage 28 will be applied to solenoid control switch 36 and is input to diode 20. In one arrangement of such a remote control switch 14, a one complete half wave of incoming AC voltage 28 (FIG. 2a) is sufficient to complete a switch transition. Such a switch transition may typically occur on the order of approximately from about 5-7 milliseconds to about 10 milliseconds. A customer load 27 will be connected via power load switch 38 once the second set of contacts 26 of remote control switch 14 are completed or made.
In a first stable position, the contacts 40 of primary switch 12 reside in the upper position 30 and the contacts 26 of the solenoid control switch 38 also resides in the upper position 26a as illustrated in FIG. 1. When primary switch 12 is first activated (i.e., when the contacts 40 of switch 12 are switched from the upper position 30 to lower position 32), a first positive half wave of AC input voltage 28 (such as at point 28a in FIG. 2a) passes diode 20 and energizes the solenoid 24. The energized solenoid 24 pulls in both sets of mechanical contacts 26 and 16, contacts 26 then move to a second stable position 26b and thereby provides power to the coupled load 27.
The first positive half wave at point 28c of AC power 28 (FIG. 2a) toggles both groups of contacts (i.e., solenoid control switch 16, optional auxiliary contacts (not shown) and power load switch 26). When solenoid control switch 16 is first toggled, solenoid 24 is mechanically disconnected from AC input voltage 28. Remote control switch 14 has now moved into its second stable position 26b and remains in this second stable position 26b until primary switch 12 is again actuated.
There are certain concerns that may arise with conventional mechanical switching circuits, such as the conventional circuit 10 illustrated in FIG. 1. For example, one concern relates to certain mechanical contact bounce, or contact "chattering" that may occur with the contacts 40 of primary switch 12. For example, because moving contacts 40 of primary switch 12 has a certain mass associated with its structure as well as a certain spring rate with low damping, contacts 40 tend to bounce as they make and break a completed circuit. That is, when these normally open pair of contacts 40 are closed, these contacts 40 often tend to initially come together ("make") and then tend to bounce/chatter off one another several times ("break") before the contacts finally come to rest or remain in a desired (i.e., closed) stable position. Such contact bounce may result in unwanted contact arcing and this may unduly limit the operational lifetime of the contacts of primary switch. For example, certain consequences of this making and breaking of the primary switch contacts 40 may be illustrated in the timing diagram in FIGS. 2b-2e, and importantly the timing diagram 50 illustrated in FIG. 2b.
As shown in timing diagram 50 illustrated in FIG. 2b, when the contacts 40 of the primary switch 12 are in the first up position 30 and then when the contacts 40 are switched to closed or down position 32, contacts 40 of primary switch 12 have a tendency to remain in an un-stable position, somewhere between the contact open position 30 and the contact closed position 32. The contacts will eventually, however, reside in the down position 32 but only after a certain period of time t1 44. Depending on certain aspects of switch construction, mechanics, and design, such mechanical contact bounce can last up to approximately 15 milliseconds to 20 milliseconds. That is, as illustrated in FIGS. 2b and 2c, contact bounce Tcb 43 may last from t0 42 to t1 44. For further information on such mechanical bounce and its related issues, the reader is directed to http://www.elexp.com/t_bounc.htm which is herein entirely incorporated by reference and to which the reader is directed for further information.
Such contact bounce is normally undesired. For example, such contact bouncing often tends to interrupt current flow, as such current flow is eventually applied to energize a solenoid of a remote control switch, such as solenoid 24 illustrated in FIG. 1. For example, a timing diagram 56 of such a potentially problematic current flow is illustrated in FIG. 2c. FIG. 2c illustrates a timing diagram 56 that represents the current available at node 18 directly before diode 20 as contacts 40 go through a bouncing state, transitioning between the up position 30 and the closed positions 32 illustrated in FIG. 2b. As can be seen from timing diagram 56, contact bounce results in intermittent power or intermittent energy 52 during the one period from t0 42 to t1 44. The intermittent power or energy 52 is available at diode 20 and before solenoid 24. Contact bounce/chatter can adversely affect current flow and can also cause undesired contact arcing.
Consequently, as the timing diagram 58 of FIG. 2d illustrates, there is limited or insufficient energy 60 available at node 18 for solenoid 24 to make a complete mechanical transition from its initially open stable state 26a to a desired closed stable state 26b. Sufficient energy 62 to make such a transition will be available only once the electrical bounce or chatter of contacts 40 of switch 12 has subsided. FIG. 2d illustrates a timing diagram of the varying energy that will be present after the diode 20 at node 22 but before solenoid 24. Therefore, as illustrated in FIGS. 2d-e, prior to time t2 70, there is insufficient energy to complete a mechanical transition of second set of contacts 26. As illustrated in FIG. 2e, during contact bounce as illustrated in FIGS. 2b and 2c, there is incomplete mechanical transition 66 that occurs during switch bounce illustrated in FIG. 2b. It is only after a certain period of time that takes into account contact bounce that there is a sufficient amount of energy available so that a complete mechanical transition 68 can occur. Consequently, the control of remote control switch 14 illustrated in FIG. 1 tends to be inconsistent. This is true in part since the primary switch 12 may be switched at any time during the line voltage 28. For example, under certain ordinary operating conditions, the remote switch completes its transition within a half of period of the line voltage such as within about 8.33 ms for 60 Hz AC line voltage and about 10 ms for 50 Hz AC line voltage.
Therefore, when a duration of contact bounce or chatter is critical to a switch transition time, remote control switch 14 will not have enough stored energy to make a reliable transition between an initial open state and a desired closed state. Therefore, as contacts 40 are loaded, contacts 40 will have a tendency to experience electrical chatter. This chatter may occur because solenoid 24 is not able to solidly transition from its open state to a closed state during this switch transition time.
One technique that has been utilized in an attempt to reduce or eliminate such mechanical contract bounce is to provide a circuit that introduces a solid state switch between the primary switch 12 and the remote control switch 14. For example, FIG. 3 illustrates such a solid state based solenoid control circuit 13.
However, even such typical electronic solid state switch designs present certain operating and control limitations. For example, a solid state switch 48 coupled between a mechanical primary switch 12 and remote control switch 14 eliminates contact bouncing. However, one such concern with such an electronic solid state switch construction relates to what occurs if AC power is applied after solenoid 24. That is, if AC power is applied to solenoid 24 after the beginning of a positive half wave of input AC voltage. As with the use of an electromechanical primary switch 12, there may be insufficient energy to complete a switch transition. This concern regarding insufficient switch transition energy and the resulting synchronization issues with utilizing a solid state based switch raised by these concerns may be generally illustrated in the various timing diagrams presented as FIGS. 4(a-e).
Returning to FIG. 3, FIG. 3 illustrates a solid state switch 48 coupled to a primary switch 12 and remote control switch 14. Such a solid state switch 48 may comprise different solid state semiconductors such as triacs, MOSFETs, IGBTs, SCRs, as well as other like solid state components. In this exemplary arrangement, solid state switch 48 comprises a first triac 46 and a second triac 54 however other alternative arrangement may also be utilized. Also in this exemplary arrangement, a mechanical primary switch 12 (with potential contact bounce limitations) is utilized for solenoid control. In an up position 30 of a primary switch 12, the first triac 46 will be in an ON state while the second triac 54 will be in an OFF state. FIGS. 4(a-e) illustrate various timing diagrams for the solid state based switch circuit 13. For example, FIG. 4a illustrates a timing diagram of the AC line voltage 28 and FIG. 4b illustrates a timing diagram 80. FIG. 4c illustrates a timing diagram 88 that represents a voltage available at node 18 directly before diode 20 as solid state switch 48 transitions from an OFF state to an ON state. Transitioning between the OFF state and the ON state illustrated in FIG. 4b. As can be seen from the timing diagram 88 in FIG. 4c, even for the solenoid control circuit 13 utilizing a solid state switch 48, depending on where during the AC line cycle 28 that the solid state switch 48 transitions between its ON and OFF state (and where the primary switch 12 transitions between its up and down position (as shown in this example, transition occurs at point 28d in FIG. 4a), there may still be insufficient or intermittent power or energy 102 available at diode 20. Therefore, there will be insufficient energy to drive solenoid 24. Consequently, as the timing diagram 104 of FIG. 4d illustrates, even when utilizing a solid state switch 48, there will often be insufficient energy available at node 18 for solenoid 24 to make a complete mechanical transition 111 from its closed state to the desired open state. Sufficient energy to make such a complete mechanical transition will be available only once the electrical bounce or chatter of contacts 40 of switch 12 has subsided. FIG. 4d provides a timing diagram illustrating the varying amount of energy that will be present after the diode 20 at node 22 but before solenoid 24.
Therefore as can be illustrated in the various timing diagrams illustrated in FIGS. 4d-e, prior to time t1 71, there is insufficient energy 102 to complete a mechanical transition of second set of contacts 26. As can be seen from FIG. 4e, it is only after time t1 71 that a complete mechanical transition 111 can occur. Consequently, as with the mechanical control switch illustrated in FIG. 1, control of the remote control switch 14 illustrated in FIG. 3 even utilizing solid state switch 48 will tend to be inconsistent.
There is, therefore, a general need for a solenoid control circuit that provides for a controlled solenoid circuit that can consistently provide a sufficient amount of energy for contact closure. Also, there is a general need for a controlled solenoid circuit that reduces or even eliminates contact bounce or chatter. There is also, therefore, a general need for a control circuit that reduces certain undesired contact heating, contact arcing, and/or contact wear that can oftentimes occur during unwanted contact bounce.


A page designated by a page designation instruction of those included in an electronic book is displayed. When a voice output instruction is input, a page displayed at that input timing is set as a voice output page, and voices corresponding to respective characters in the voice output page are sequentially output in accordance with an arrangement order of the characters. A start character from which a voice output operation is started is determined based on characters in the voice output page, and voices corresponding to characters, which include the start character and subsequent characters, are controlled to be sequentially output in accordance with the arrangement order.

1. Field of the Invention
The present invention relates to a technique required to attain display and voice output operations of an electronic book.
2. Description of the Related Art
Conventionally, a technique for controlling a voice output operation of an electronic book content having page information is known. Also, a technique for making a voice output operation from a predetermined position (from a start sentence of a page) when an electronic book content undergoes page transition is known (Japanese Patent Laid-Open No. 5-313565).
However, a voice output position desired by the user varies depending on a page after a page transition.

Information processing for outputting voice


A PAR bulb visor includes an accessory visor with a plurality of spaced apart spring clips which is adapted to removably attach to the lip of a PAR bulb. The visor is retrofittable to virtually any existing PAR bulb fixture where the lip of the bulb is exposed. The visor is inexpensive to manufacture. It does not require casting and can be made from inexpensive sheet metal. Since the visor can be easily installed and removed from the lip of an existing PAR bulb, it does not interfere with the installation/replacement of the bulb.

1. Field of the Invention
The invention relates to exterior lighting fixtures. More particularly, the invention relates to a visor which is retrofittable to an existing PAR bulb to thereby reduce glare, increase lighting efficiency, control light output, and minimize light trespass and light pollution.
2. State of the Art
For many years astronomers complained that the nighttime light from large cities interfered with their ability to detect far off faint stars. It is for this reason that most astronomical observatories are located far away from densely populated cities.
More recently, other groups have concerned themselves with the adverse effects of uncontrolled exterior lighting. These groups include the New England Light Pollution Advisory Group (NELPAG), the International Dark-Sky Association (IDA), the Illuminating Engineering Society of North America (IESNA), the Commission Internationale de l""Eclairage (CIE), the Electric Power Research Institute (EPRI), and the UK Institution of Lighting Engineers, (ILE).
The adverse effects of uncontrolled exterior lighting include xe2x80x9clight trespassxe2x80x9d, light that strays from its intended purpose and becomes an annoyance or nuisance, and xe2x80x9clight pollutionxe2x80x9d, night-sky brightness (sky glow) caused by light illuminating particulate matter in the atmosphere. The sources of light pollution and light trespass typically include light projected above a horizontal plane or light reflected from illuminated surfaces such as roadways.
An increasing number of states and municipalities have been involved in the alteration of the use of exterior lighting by instituting laws and ordinances. One solution has been the establishment of a xe2x80x9clighting curfewxe2x80x9d, an established time frame within which lighting must be maintained according to predetermined levels. Other solutions include restrictions on the type of exterior lighting fixtures which may be used.
One of the most common exterior lighting fixtures is the simple PAR bulb flood (or spot) light 10 which is illustrated in prior art FIG. 1. The fixture 10 includes a mounting plate 12, a weather resistant bulb socket 14 and a replaceable PAR bulb 16. The familiar PAR bulb 16 has a frustroconical portion terminating in a lip 18. These fixtures 10 may not pose a serious problem if the axis of the bulb is aimed thirty or forty degrees below horizontal. They are almost always a problem when aimed above horizontal as shown in FIG. 1. These fixtures are often used to illuminate signs, buildings, monuments, and the like and are either aimed up from the ground as illustrated, or mounted on the side of a building. When so used, these ubiquitous fixtures contribute substantially to light trespass and light pollution.
Prior art FIGS. 2-4 illustrate products available from RAB Electric Manufacturing, Inc., 170 Ludlow Avenue, Northvale, N.J. 07647. These fixtures are often referred to as xe2x80x9cdark skyxe2x80x9d or xe2x80x9cfriendlyxe2x80x9d lighting fixtures. The fixtures 20 and 30 shown in prior art FIGS. 2 and 3, respectively, include a die cast aluminum housing 22, 32, respectively, which covers the sides of a standard PAR bulb 16 and extends approximately one inch beyond the bulb to provide a shade to reduce glare. An optional visor 40 shown in prior art FIG. 4 is provided with an engaging end 42 so that it securely mates with either fixture 20 or 30.
The fixtures shown in prior art FIGS. 2-4 are highly effective in controlling light pollution and light trespass. However, they have three significant disadvantages. First, they are expensive compared to the common fixtures shown in prior art FIG. 1. Second, in order to obtain their benefits, existing fixtures must be replaced, which includes re-wiring by a licensed electrician. Third, unless they are properly dimensioned, it is difficult to install and remove bulbs in these fixtures. Those skilled in the art will appreciate that the space between the circumference of the bulb 16 and the hood 22, 32 is often too small to allow thumb and fingers to grip the bulb during installation/removal. Thus, a special tool is often required for this purpose.
It is therefore an object of the invention to provide a dark sky/friendly lighting fixture which overcomes the disadvantages of the prior art.
It is also an object of the invention to provide a dark sky/friendly lighting fixture which is relatively inexpensive.
It is another object of the invention to provide a dark sky/friendly lighting fixture which does not require the replacement of existing fixtures.
It is still another object of the invention to provide a dark sky/friendly lighting fixture which does not inhibit the installation or removal of bulbs.
In accord with these objects which will be discussed in detail below, the PAR bulb visor of the present invention includes an accessory visor with a plurality of spaced apart spring clips which is adapted to removably attach to the lip of a PAR bulb. The visor of the present invention is retrofittable to virtually any existing PAR bulb fixture where the lip of the bulb is exposed. The visor of the invention is inexpensive to manufacture. It does not require casting and can be made from inexpensive sheet metal. Since the visor of the invention can be easily installed and removed from the lip of an existing PAR bulb, it does not interfere with the installation/replacement of the bulb.

Glare reducing visor for existing PAR bulb exterior lighting fixtures


A reciprocating drive system and apparatus for scanning a workpiece through an ion beam are provided, wherein a motor comprising a rotor and stator operable to individually rotate about a first axis is operable to reciprocally translate the workpiece with respect to the ion beam. A shaft rotatably driven by the rotor extends along the first axis, and a scan arm is operably coupled to the shaft, wherein the scan arm is operable to support the workpiece thereon. Cyclical counter rotations of the shaft by the motor are operable to rotate the scan arm, therein scanning the workpiece through the ion beam along a first scan path, wherein the stator acts as a reaction mass to the rotation of the rotor. A controller is further operable to control an electromagnetic force between the rotor and the stator, therein generally determining a rotational position of the rotor and the stator.

In the semiconductor industry, various manufacturing processes are typically carried out on a workpiece (e.g., a semiconductor wafer) in order to achieve various results thereon. Processes such as ion implantation, for example, can be performed in order to obtain a particular characteristic on or within the workpiece, such as limiting a diffusivity of a dielectric layer on the workpiece by implanting a specific type of ion. Conventionally, ion implantation processes are performed in either a batch process, wherein multiple workpieces are processed concurrently, or in a serial process, wherein a single workpiece is individually processed. Traditional high-energy or high-current batch ion implanters, for example, are operable to achieve an ion beam-line, wherein a large number of wafers may be placed on a wheel or disk, and the wheel is spun and radially translated through the ion beam, thus exposing all of the surface area of the workpieces to the beam at various times throughout the process. Processing batches of workpieces in such a manner, however, generally increases the cost of the system, makes the ion implanter substantially large in size, and reduces system flexibility.
In a typical serial process, on the other hand, an ion beam is either scanned two-dimensionally across a stationary wafer, or the wafer is translated in one direction with respect to a generally stationary fan-shaped ion beam. The process of scanning or shaping a uniform ion beam, however, generally requires a complex beam-line, which is generally undesirable at low energies. Furthermore, uniform translation or scanning of either the ion beam or the wafer is generally required in order to provide a uniform ion implantation across the wafer. However, such a uniform translation and/or rotation can be difficult to achieve, due, at least in part, to substantial inertial forces associated with moving the conventional devices and scan mechanisms during processing.
Alternatively, in one known scanning apparatus, as disclosed in U.S. Patent Application Publication No. 2003/0192474, the wafer is scanned in two orthogonal dimensions with respect to a stationary "spot" ion beam, wherein the wafer is quickly scanned in a so-called "fast scan" direction and then slowly scanned in an orthogonal "slow scan" direction, thereby "painting" the wafer via a generally zigzag pattern. This two-dimensional scanning apparatus, however, utilizes direct drive actuators to linearly translate the wafer in the fast scan direction, wherein the transport velocity of the wafer in the fast scan direction is substantially limited due, at least in part, to significant inertial forces encountered during acceleration and deceleration of the wafer as the direction of fast scan transport is periodically reversed. Large inertial forces in the conventional apparatus are accordingly associated with a large reaction force at the direct drive actuator, wherein the large reaction force can ultimately lead to significant vibration of the apparatus, thus having a deleterious impact on the ion implantation process. Vibration may also pose a problem for nearby equipment, such as lithography equipment that is typically vulnerable to vibration. Furthermore, when the speed of the translation in the fast scan direction is limited in order to avoid vibration issues, process throughput can be deleteriously impacted.
Therefore, a need exists for a system and apparatus for reciprocally scanning a workpiece in two dimensions relative to an ion beam at substantially high speeds, wherein vibration from large inertial forces is mitigated, and wherein the scanning of the workpiece is controlled in order to uniformly process the workpiece.

Reciprocating drive for scanning a workpiece through an ion beam


A tire reinforcement structure having parallel threads is made by providing a substantially toroidal rotatable form and a reinforcement-constructing an apparatus disposed adjacent the form. At a forming section of the apparatus a group of multiple parallel threads is formed. The group of threads is fed to a joining section where the threads are embedded in an elastomeric composition to form a strip which is fed to a cutting section where the strip is successively cut into portions. The strip portions are successively fed to a depositing section which successively deposits the portions of the strip along a predetermined trajectory onto the surface of the rotating form. The strip portions are formed in situ at the form and are deposited directly onto the form from the depositing section.

In this technical field, methods and apparatuses are already known which make it possible to integrate the fabrication of tire reinforcement structures in the assembly of the tire itself. This means that, rather than using semi finished products, such as reinforcement plies, one or more reinforcement structures are produced in situ, at the time of manufacture of the tire, and using a single coil of thread.
Amongst these methods and apparatuses, the solution described in the patent U.S. Pat. No. 4,804,436 proposes to produce reinforcement structures from a single thread. This solution in particular allows the production of a reinforcement structure under the tread.
It is also well known how to produce a reinforcement structure for a tire from a strip comprising reinforcement threads parallel to each other and embedded in an elastomeric composition such as a rubber composition. Such a strip is cut into portions and the portions are deposited adjacent to each other on a fabrication support, where the architecture so requires, in order to produce the tire reinforcement structure desired by the tire designer. Amongst the various variants of a method of fabrication from strips, the patent U.S. Pat. No. 1,728,957 can be cited, which describes fabricating strips and then cutting portions and arranging strips on a substantially toroidal fabrication form, ensuring that a pitch which is as constant as possible is kept between the adjacent threads in the portion.
The technique of fabricating reinforcement structures from a strip has however not found many industrial applications since on the one hand it does not have the productivity of fabrication from plies and on the other hand it does not have the flexibility and precision of a technique of fabrication from an individual thread. When it is wished to fabricate a tire according to a technique affording little or absolutely no conformation of the uncured product during its manufacture, it is of prime importance to be able to deposit the reinforcement structures and the uncured rubber products constituting the future tire with very great precision with regard to both their positioning and the quantity of material deposited on the fabrication form.

System for producing a reinforcing structure for a tire with volumetric control


An orthopedic device having a support structure provided with at least an orifice for a fixing screw associated with a nut; the head of the screw to be pressed on one side of the support, and the nut adapted to be pressed on the other side of the support, in a housing enabling its being integrated at least partly, so as to enable the support structure to be clamped between the screw head and the nut when the screw body has been completely screwed in the receiving bone material. The implantable device includes elements for maintaining the nut in its housing opposite the orifice, and elements for locking the nut in rotation. The contours of the housing and of the nut are dimensioned to provide at least one degree of freedom to the nut in the housing enabling self-centering of the screw and nut.

1. Summary of the Invention
The present invention relates to a new orthopaedic implant system of the type formed of a supporting structure fitted with at least one orifice to let through a fastening screw associated with a nut.
2. Description of the Related Art
Generally speaking, orthopaedic implants, in particular osteosynthesis implants, include a supporting structure in the form of a plate, a shell or other, fitted with one or of several orifices intended to let through fastening screw able of being anchored in the receiving bone material.
The general shape and the dimensions of this supporting structure are adapted to the implantation constraints.
There exist a very large number of types of implants which differ in particular by the presence or not of an interconnection between the screw head and the supporting structure, to optimise retention of the screw over a long period of time, and/or the presence of means conferring to the fastening screw a possibility of angular orientation relative to the axis of its reception orifice, to enable the practician position at best said screw relative to the site of implantation and to the corresponding spatial constraints.
Good holding quality of the implant is obtained when the supporting structure is sandwiched between the screw head and a nut, as known from the document WO-A-99/09903. But in such a case, the particular interconnection of the nut with the supporting structure requires accurate introduction of the fastening screw so as not to damage the thread of the nut during the screwing operation; and the practician has no possibility of orienting the screws spatially.

Orthopedic implant consisting of a support structure provided with at least an orifice for passing through a fixing screw associated with a nut


A non-linear optical device is provided. The device comprises an optical disk or ring microresonator fabricated from a material that exhibits an optical nonlinearity able to produce degenerate four-wave mixing (FWM) in response to a pump beam having a pump frequency in a specified effective range. The microresonator is conformed to exhibit an angular group velocity minimum at a pump frequency within the specified effective range such that there is zero angular group velocity dispersion at the pump frequency. We refer to such a pump frequency as the “zero dispersion frequency”. In embodiments, excitation of the resonator by a pump beam of sufficient intensity at the zero-dispersion frequency causes the resonator to emit a frequency comb of entangled photon pairs wherein the respective frequencies in each pair are symmetrically placed about the zero-dispersion frequency.

The generation of entangled photons is an essential element in current approaches to quantum information processing and quantum communication. In particular, it is often desirable to generate entangled photons having narrow spectral bandwidths to facilitate coupling to long-lived quantum memories or repeaters.
Various physical mechanisms have been considered for generating entangled photons. One such mechanism is four-wave mixing (FWM). In particular, FWM in chip-scale microresonators has been proposed as potentially advantageous means for producing narrowband entangled photons.
FWM in microresonators is usually performed in systems, such as disk and ring resonators, that have azimuthal symmetry (also referred to herein as "cylindrical" symmetry). Such systems are advantageous because, among other reasons, they readily permit near-equal mode spacing, small mode volumes, and high optical quality factors.
For entangled photon production, an underlying electronic nonlinearity is utilized to produce spontaneous degenerate FWM. (Driven FWM has also been considered. In particular, it has been shown that driving above the parametric oscillation threshold can produce frequency combs.) More specifically, if the resonant disk or ring is composed of a material with a third-order nonlinear suceptiblity χ(3) (ρ, z), then upon pumping the resonator with a strong pump beam of frequency ωp selected to couple into mode m of the ring, a process may occur by spontaneous FWM in which two pump photons are annihilated to produce an entangled pair of signal and idler photons of respective frequencies ωs and ωi. However, the process must conserve both energy and momentum. The conservation of energy requires that ωs+ωi=2ωp.
The conservation of momentum requires that ms+mi=2mp, in which ms, mi, and mp are the respective mode numbers for the signal, idler, and pump waves.
Various investigators have attempted to theoretically model the spectrum resulting from spontaneous and driven FWM in azimuthally symmetric systems. Although it has been more common in these efforts to approximate the cylindrical resonator as an unfolded straight waveguide, several investigators have employed a representation in cylindrical coordinates, which is more naturally suited to systems with azimuthal symmetry.
For example, a fully vectorial treatment of cascaded FWM in a spherical resonator, taking into account all components of the electric field, spatial mode overlaps, and resonator dispersion profiles was reported in Y. K. Chembo and N. Yu, "Modal expansion approach to optical-frequency-comb generation with monolithic whispering-gallery-mode resonators," Phys. Rev. A 82, 033801 (2010) and in Y. K. Chembo, D. V. Strekalov, and N. Yu, "Spectrum and dynamics of optical frequency combs generated with monolithic whispering gallery mode resonators," Phys. Rev. Lett. 104, 103902 (2010). Although those results apply only to spherical resonators and neglect material dispersion, they successfully track the spectral evolution resulting from the FWM interaction.
A theoretical study of the quantum correlations resulting from spontaneous FWM in azimuthally symmetric ring resonators was presented in J. Chen, Z. H. Levine, J. Fan, and A. L. Migdall, "Frequency-bin entangled comb of photon pairs from a Silicon-on-Insulator micro-resonator," Opt. Express 19, 1470-1483 (2011). That work predicted that FWM in an azimuthally symmetric ring resonator could be used to generate a frequency-bin entangled comb of photon pairs. However, that work included certain implicit assumptions based on rectilinear rather than cylindrical resonator geometries.
More specifically, in their quantum formalism the authors enforced a phase-matching condition that involved integrating an effective linear group velocity and linear wavevector (i.e., k-vector) over an unfolded cavity of specified linear length. In a cylindrical system, however, the linear momentum is zero and the linear wavevector and group velocities are poorly defined, particularly for small resonator radii, such as radii approaching ten or fewer times the resonant wavelength. Moreover, because cylindrical resonator systems lack translational symmetry, the accuracy with which optical wave propagation can be modeled using a linear wavevector is limited. Greater accuracy would be achieved using the angular wavevector and angular group velocities.
One thing that has been lacking, until now, is a fully vectorial quantum model in cylindrical coordinates to describe spontaneous FWM in axially symmetric systems, which might facilitate new design approaches and even lead to new optical devices based on properties revealed by the use of such a model.

Methods and apparatus of entangled photon generation using four-wave mixing


A method and apparatus for dealing with undesired deviations of servo burst component magnitudes, as compared with nominal magnitudes, is provided. Inaccurate servo burst magnitudes can arise from components which are misplaced, often from an inaccuracy in a trimming operation. In one aspect, a value indicative of the shift of a component null point is measured and used to calculate a burst amplitude correction factor. Knowledge of system dynamics can be used to calculate a track shape that can be used in calculating the correction factor. Values indicative of track shape can be related to transfer functions of the disk drive controller and plant. In one embodiment, information indicative of repeatable runout is convolved with a function of the transfer function of the controller and plant, and the result is used for calculating a burst component amplitude correction value.

In a disk-based data storage device, such as a hard disk drive, data is typically recorded to and read from a plurality of data tracks. Generally, the "nominal" (i.e., desired or ideal) track shape is circular, and "nominal" tracks are concentric about the disk axis of rotation.
Typically, as part of a manufacturing or setup procedure (prior to normal use for data read/write), a hard disk drive is provided with a plurality of servo "bursts." The purpose of these bursts is to provide location information to components of the head-positioning system, typically a servo-type control system, which can allow the servo system to maintain the read/write head at a desired radial position as the disk rotates, i.e., to "follow" a desired data track. Although the present invention can be used in connection with any of a number of servo burst systems, those with skill in the art will understand how to use the present invention using any of a number of servo burst systems based on a description of a particular servo burst configuration. In this configuration, a plurality of servo bursts is positioned around the track. Typically, the bursts are circumferentially aligned, from one track to the next, defining a plurality of radial "spokes."
In one particular servo burst configuration, for each track, or group of tracks, each spoke contains four bursts (plus other information such as track number, etc). For purposes of the present disclosure, these four bursts will be referred to as A, B, C and D burst components. Each component has a nominal radial width of one track width, with the components being configured such that two of the components (e.g., the "A" and "B") components have their "radial" midlines aligned with the nominal track centers and the other components (e.g., "C" and "D") have their nominal edges aligned with the track centers. As the servo bursts pass under the read head, each component will result in a detected signal with a magnitude between minimum and maximum values and, accordingly, four signal amplitudes A, B, C, and D will be obtained. If the servo burst components are positioned substantially so as to define concentric and equidistant tracks, and have substantially their nominal sizes and shapes, the relative magnitudes of the servo burst signals A, B, C, and D will be indicative of whether the read head is at the nominal track center and, if not, the four magnitudes can be used to compute a position error signal (PES). In practice, the position of the burst components has repeatable and nonrepeatable components. Non-repeatability of the burst positioning results in irregular burst shapes and sizes. If all bursts are the same size and shape but their positions are such that all tracks are concentric and equidistant although non-circular then there will be repeatable run out but no instability. The position error signal, typically with, some correction or manipulation, including as described below, can be used as an input to the tracking servo system in a manner so as to drive the read head toward the desired radial position and, thus, achieve the desired tracking.
When the servo bursts are written on the disk, typically using a servo writing apparatus and procedure, it is possible that the servo burst components may sometimes have a size, shape or position which departs from the desired concentric, equidistant configuration. If the deviations are relatively small (e.g., typically no more than about +/−0.07 of the track width), it is possible, in general, to use the PES signal to provide a feed forward control input to the servo system that can reduce or eliminate (typically higher-frequency) recurring tracking deviations (repeatable run out) to achieve a certain degree of improvement in track positioning. Theoretically, all frequency harmonics of the repeatable run out can be eliminated but various environmental changes like temperature and disk slip make the first few harmonics change so that one-time correction for these is not effective. However, for larger-magnitude deviations of burst component shape, size or position, non-linearalities are introduced during track position detection (TPD) which become significant enough that instability is created in the servo loop which may render the track unusable for reading and writing. When a track of this type is detected, it is typically mapped out from the drive format (tagged as unusable). If there are more than a threshold number of tracks which are mapped out (typically a few tenths of a percent), the entire drive may be considered unusable.
Although previous methods did not adequately deal with seriously-distorted servo burst components, it is believed that it was often a sufficiently infrequent occurrence and that it was not considered a substantial problem in the industry. The present invention, however, addresses this issue of burst component distortion at least partially because of a recognition that as data density increases, and track width decreases, the percentage of track width that a given absolute amount of burst component distortion represents will also increase. Accordingly, it would be useful to provide a method and apparatus which can effectively deal with burst component distortions that might otherwise cause servo instability, or, in some other way, contribute to undesired mapping out of data tracks or unusability of disk drives. It would be particularly useful to provide a method and apparatus for dealing with distorted servo burst components which can be implemented in a relatively straightforward fashion, preferably being capable of implementation substantially by changes in software.

Data tracking method and apparatus for disk-based data storage


A glass run includes at least one of: an exterior sub-lip formed so as to project obliquely from an interior side of the exterior side wall that is closer to the bottom wall than a base portion of the exterior seal lip; an interior sub-lip formed so as to project obliquely in a direction toward a base portion of the interior seal lip from an exterior side of the interior side wall that is closer to the bottom wall than the base portion of the interior seal lip, the interior sub-lip formed with a thick portion on a base portion on a side of the interior seal lip; a thick portion formed on a base portion of the exterior seal lip; or a thick portion formed on a side of the interior seal lip that is not in contact with the door glass.

On a door of a vehicle, a door frame is provided on an upper portion of a door body, a channel-shaped glass run is fitted and locked into a groove portion formed on an inner peripheral edge of the door frame, and lifting and lowering of a door glass is guided by glass seal portions inside and outside the vehicle of the glass run, so as to seal an inside and an outside of a compartment from each other.
The glass run includes a basic frame (body portion) configured with: a bottom wall, an exterior side wall located on an exterior side of the bottom wall, and an interior side wall located on an interior side of the bottom wall. The glass run further includes an exterior seal lip and an interior seal lip that respectively extend from tip ends of the side wall portions or the vicinity thereof toward an inner side of the body portion. Further, the glass run is attached to an attachment portion provided along an inner periphery of the door frame, and is sealed by the two seal lips so that peripheral edge portions of inner and outer surfaces of the door glass to be lifted and lowered are sandwiched. The glass run also functions to support the peripheral edge portion of the door glass so as to guide the lifting and lowering of the door glass and to prevent rattling of the door glass.
In a state where the door glass is positioned slightly below a fully closed position, the door glass is likely to be displaced in an interior direction. When an automobile travels on a rough road in this state and the door glass vibrates in interior and exterior directions, the door glass and the seal lips may be instantaneously separated from one another, and when the door glass and the seal lips are brought into contact again from the separated state and are separated and brought into contact repeatedly, the contact may cause abnormal noise (tapping noise). In particular, when the seal lips deteriorate with time and an elastic force thereof decreases, a problem becomes significant that when the door glass vibrates, the seal lips are likely to be separated from the door glass, which causes abnormal noise.
As a technique for solving the above problem, for example, a technology described in Patent Document 1 described below is available. A structure of the glass run of Patent Document 1 will be described with reference to FIGS. 1 and 11. FIG. 1 is a front view of a left front door 100 of an automobile as viewed from the exterior side. A door frame 320 is attached to an upper portion of a door body 210 constituting the front door 100. A window opening is formed by the door frame 320 and an upper end edge of the door body 210. A glass run 110 is mounted on an inner peripheral edge of the window opening and inside the door body 210 so as to guide lifting and lowering operation of a door glass 600.
FIG. 11 shows a vertical cross section (a Y-Y cross section in FIG. 1) of a vertical frame portion of the door frame 320. The glass run 110 is formed into a channel shape (a U-shaped cross section) with a bottom wall 200, an exterior side wall 300, and an interior side wall 400 as a basic frame. The exterior side wall 300 is formed with an exterior seal lip 310 that is in contact with an outer surface (exterior side) of the door glass 600, and a tip end of the interior side wall 400 is integrally formed with an interior seal lip 410 that is in contact with an inner surface (interior side) of the door glass 600. A sub-lip 430 projected in a direction opposite to the interior seal lip 410 is formed between the interior seal lip 410 and the bottom wall 200 toward the exterior side.
The interior seal lip 410 includes the protrusion 440 on the inner surface thereof thereby including a projection surface 450 at a position projecting from a general surface of the inner surface. The door glass 600 is configured to be able to, when the door glass 600 is displaced from a reference position to the interior side, change a state between a first support state where the tip end portion of the sub-lip 430 extending from the interior side wall 400 and the projection surface 450 are in contact and slide against each other, and a second support state where the tip end portion of the sub-lip 430 is detached from the projection surface 450 and a portion of the sub-lip 430 that is closer to a base side than the tip end portion in contact with the protrusion 440.
As a result, the protrusion 440 is provided on the inner surface side of the interior seal lip 410, the interior seal lip 410 at that portion is thick, and the sub-lip 430 that extends from the interior side wall 400 and is contactable with the projection surface 450 of the protrusion 440 is provided. Therefore, a force pressing the interior seal lip 410 against the door glass 600 is increased, and even when the door glass 600 vibrates, it is possible to prevent a situation that the interior seal lip 410 is instantaneously separated from the door glass 600, and for example, when the interior seal lip 410 and the door glass 600 are brought in contact with each other from the separated state, it is possible to prevent a situation that abnormal noise (tapping noise) is caused by the contact.
Patent Document 1: JP-A-2018-149984
In the technique disclosed in Patent Document 1 described above, due to the contact between the protrusion 440 having the projection surface 450 and the sub-lip 430 on the inner surface of the interior seal lip 410, the interior seal lip 410 is prevented from being separated from the door glass 600 when the door glass 600 vibrates, whereas the deterioration over time occurs not only to the interior seal lip 410 but also to the sub-lip 430. Therefore, there is a concern that due to a decrease in a reaction force (pressing force) toward the inner surface side of the interior seal lip 410 caused by the deterioration of the sub-lip 430, the interior seal lip 410 is separated from the door glass 600, which causes abnormal noise again.
On the other hand, in a state where the door glass 600 is positioned slightly below the fully closed position, the door glass 600 is likely to be displaced in an interior direction, so that the force that the exterior seal lip 310 presses the door glass 600 is weakened. Therefore, when the door glass 600 vibrates, the door glass 600 and the exterior seal lip 310 may be instantaneously separated from one another, and when the door glass 600 and the exterior seal lip 310 are brought into contact again from the separated state and are separated and brought into contact repeatedly, the contact may cause abnormal noise (tapping noise). However, this problem cannot be solved in Patent Document 1.
Further, since a vehicle includes various forms such as a size of the vehicle and shape and size of the door glass, a solution to the abnormal sound generated between the door glass and the seal lips of the glass run must be considered from the aspects of both the exterior seal lip and the interior seal lip. Moreover, the consideration must involve the cost without affecting other functions of the glass run.