Embodiments in accordance with the present invention relate to detecting a micro-relief that exists on surfaces of a magnetic disk. A phase or frequency of a read signal obtained when data written to a minute projection or a minute concavity on a recording surface of a magnetic disk is read out, differs from that of a read signal obtained when data written to a flat recording surface is read out. The phase progresses in the minute projection, whereas the phase is delayed in the minute concavity. A micro-relief is detected by measuring a deviation value of this frequency, and then defect registration is performed. Embodiments in accordance with the present invention are configured to detect a minute projection whose level does not cause TA. Embodiments in accordance with the present invention may also be configured to provide a highly reliable magnetic disk drive by controlling the flying height in response to a state of a minute projection and that of a minute concavity.

The present invention relates to a technology for detecting a micro-relief such as a minute projection and a minute concavity, which exist on recording surfaces of a magnetic disk, and more particularly to a technology for detecting a micro-relief on the basis of a deviation value of a frequency or phase of a read signal.
A magnetic head of a magnetic disk drive flies over a magnetic disk so as to write or read data with an extremely slight gap being kept between the magnetic head and a magnetic layer of the magnetic disk. The gap between the magnetic head and the magnetic layer is called "flying height". In order to increase the recording density, it is necessary to make the flying height as low as possible, and also to keep the flying height constant. For this purpose, it is desirable that surfaces of the magnetic disk be flat. However, because time and cost constraints are placed on a manufacturing process, it is difficult to make the surfaces of the magnetic disk completely flat as a surface finish. In actuality, a minute projection and a minute concavity inevitably remain.
In recent years, the flying height is reduced to about 10 nm, and accordingly an influence of a micro-relief exerted on write or read operation becomes larger. If a read head is a GMR head or a MR head, which uses a GMR (giant magnetoresistive effect) element or an MR (magnetoresistive effect) element respectively, data cannot be read when a collision of the read head with a minute projection causes the temperature of the GMR element or the MR element to increase, which is, what is called, a phenomenon of thermal asperity (hereinafter referred to as TA). On the minute concavity, the flying height substantially increases, and accordingly a degree of magnetic coupling between the magnetic head and the magnetic layer becomes weak. As a result, sufficient magnetization cannot be achieved.
In addition, a protective layer for preventing corrosion is formed on a surface of a magnetic head element. If the magnetic head collides with a minute projection on a surface of the magnetic disk, which causes the protective layer to be worn away, the magnetic head element becomes more subject to corrosion. Moreover, if a lubricating protective layer on the surface of the magnetic disk comes off as a result of the collision of the magnetic head with the minute projection, there is a case where the height of the minute projection increases, or a case where a fragment of the lubricating protective layer which has come off adheres to another part of the magnetic disk, and consequently a new minute projection is formed.
Japanese Patent Application Laid-Open No. Hei 9-251727 (Patent document 1) describes that when a MR head collides with a surface of a magnetic disk, a signal waveform whose signal amplitude (output level) suddenly fluctuates occurs in a read signal. Japanese Patent Application Laid-Open No. Hei 11-66709 (Patent document 2) discloses a technology in which before shipment of a magnetic disk drive, a MR head is caused to collide with a minute projection so as to detect the occurrence of TA, and then defect registration of sectors relating to a position of the projection is performed. Japanese Patent Application Laid-Open No. Hei 9-45009 (Patent document 3) discloses a PLL circuit for, even if an abnormal read signal caused by a defect of a disk is inputted, preventing an oscillation frequency of a synchronization pulse signal from greatly deviating from a specified value. The PLL circuit includes: a phase-locked loop circuit for detecting a phase error between a read signal and a synchronization pulse signal during data read operation, and for executing phase synchronization operation of the synchronization pulse signal so that this phase error is corrected; and a frequency pulling loop circuit for executing frequency pulling operation so that a frequency error with the synchronization pulse signal is corrected.
Japanese Patent Application Laid-Open No. Hei 10-233070 (Patent document 4) discloses a technology for directly detecting, by use of a gap detecting circuit, fluctuations in gap between a magnetic disk and a magnetic head as fluctuations in DC potential by amplifying a signal from the magnetic head using an amplifier, which is directly connected, without passing the signal through a coupling capacitor. In addition, according to the patent document 4, it is possible to keep the magnetic spacing constant by controlling the height of the magnetic head, more specifically, by controlling a gap between the magnetic disk and the magnetic head using a gap control circuit, so that the DC potential equivalent to the detected gap is kept at a constant value.
Heretofore, the MR head is actually caused to contact a minute projection so that TA occurs, and thereby the minute projection on a surface of a magnetic disk is detected before shipment. By use of this method, it is possible to detect a minute projection whose height is high enough to contact the MR head. However, after the use of a magnetic disk drive is started, there is a possibility that a minute projection whose height is not high enough to cause TA before shipment will become a kernel, and then particles generated as a result of the head/slider's contacting a surface of the magnetic disk, particles remaining inside, and the like, will gradually adhere to the kernel so that the kernel grows up to the size which will cause TA.
If the MR head collides with a minute projection after user data is written to a data sector, and consequently TA occurs, user data cannot be read out from the data sector. In addition, there is a possibility that a fragment which has come off from the surface of the magnetic disk as a result of the collision will adhere to another part of the magnetic disk, and will then become a kernel of a new minute projection. Moreover, there is also a possibility that the magnetic head will be damaged. Therefore, in order to avoid a collision, it is desirable that even if a minute projection before shipment is not so large that causes TA, such a minute projection be detected and eliminated. Additionally, after the shipment, it is desirable to avoid a collision of the magnetic head with a minute projection as much as possible.
Furthermore, in the past, even if a data sector contains a minute concavity, if the data sector passes a write/read test before shipment, the data sector was used just as it is. Since the flying height substantially increases on a minute concavity, in order to perform stable write and read operation, it is desirable disallow the use of the data sector beforehand if the depth thereof is greater than or equal to a specified value.
However, in the case of the conventional magnetic disk drives, it was difficult to detect a minute concavity, and a minute projection whose height is not high enough to cause TA. In addition, there was no effective method for, after the shipment of the magnetic disk drive, and after user data has been written, avoiding a situation in which a minute projection grows up, which eventually causes TA.
Embodiments in accordance with the present invention have been made to solve the above problems, and an object of embodiments of the present invention is to provide a magnetic disk drive that is capable of detecting a micro-relief formed on a surface of a magnetic disk. Another object of embodiments in accordance with the present invention is to provide a magnetic disk drive that is capable of detecting a micro-relief to perform stable read and write operation. Still another object of embodiments in accordance with the present invention is to provide a method for registering a defective sector, and for controlling the flying height, by measuring a deviation value of a frequency or phase to detect a micro-relief in a magnetic disk drive.

Magnetic disk drive, method for registering defective sector, and method for controlling flying height

Hitachi Global Storage Technologies Netherlands B.V.


The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention provides an electronic device workpiece including: a substrate having a surface; a temperature sensing device borne by the substrate; and an electrical interconnect formed upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. In another aspect, a method of sensing temperature of an electronic device workpiece includes: providing an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and sensing temperature of the electronic device workpiece using the temperature sensing device.

It is preferred in the semiconductor and related arts to utilize large wafers for fabrication of integrated circuits and other devices. Large wafers are preferred inasmuch as an increased number of chips can be fabricated from larger workpieces. As the size of the wafers continues to increase as processing techniques are improved, additional processing obstacles are presented.
For example, it is typically preferred to provide a substantially constant temperature across the surface of the wafers being processed because changes in temperature can influence device fabrication. Wafers of increased diameters and surface areas experience increased temperature fluctuations at various locations on the workpiece. In particular, a partial vacuum is typically used to pull small diameter wafers into direct thermal contact with a hot plate. Such processing methods facilitate substrate temperature control because the substrate temperature is closely associated to the temperature of the hot plate. Fabrication of small sub-micron devices upon larger diameter semiconductor wafers or workpieces requires minimal backside contamination. As such, contact of the workpiece with a hot plate is not typically not possible. Such workpieces are processed in conventional operations upon spacers or pins that position the workpiece approximately 0.1 millimeters above the hot plate heating surface. Such spacing intermediate a chuck or hot plate and the workpiece results in substrate temperatures which can be influenced by the environment above the substrate. Inconsistencies in temperature across the surface of the workpiece often result.
Absolute temperature and temperature uniformity of a workpiece are parameters which are closely monitored during wafer and workpiece fabrication to provide critical dimension (CD) control. Chemically amplified resists are utilized in deep ultraviolet (DUV) lithography in small micron geometries (eg., 0.25 microns and below). Chemically amplified resists are particularly temperature dependent further increasing the importance of temperature control and monitoring. Some thermal resist processing steps require process windows ranging from 1–2 degrees centigrade down to a few tenths of a degree centigrade. Meteorology that is four to ten times more precise than conventional process equipment may be required to provide thermal performance measurements to 0.1 degrees centigrade.
One approach has disclosed the use of temperature sensors across a surface of the wafer to provide temperature mapping of the workpiece during processing. Platinum foil leads and copper leads are utilized to electrically connect the temperature sensors. With the use of numerous temperatures sensors across an entire workpiece surface, numerous wires are required for coupling and monitoring. Such numerous wired connections can break and/or adversely impact processing of the workpiece or the temperature measurements taken of the surface of the workpiece. Some temperature sensors require four leads per sensor further impacting the processing and temperature monitoring of the workpieces.
Therefore, there exists a need to provide improved temperature monitoring of workpieces which overcomes the problems experienced in the prior art.

Methods of sensing temperature of an electronic device workpiece


A manual oral care implement comprises a handle, a connector and a head, the head being repeatedly attachable to and detachable from the handle via the connector. The handle has a distal end and a proximal end opposite to the distal end and adjacent to the head when the head is attached to the handle. The proximal end has an upper surface that is at least partially chamfered. The handle has a longitudinal axis and a cross-sectional area extending substantially perpendicular to the longitudinal axis. The chamfered surface and the cross-sectional area define therebetween an angle α from about 15° to about 30°.

Heads and handles for oral care implements, like manual toothbrushes, are well known in the art. Generally, tufts of bristles or other cleaning elements for cleaning teeth and soft tissue in the mouth are attached to a bristle carrier or mounting surface of the brush head intended for insertion into a user's oral cavity. The handle is usually attached to the head, which handle is held by a user during brushing. Usually, heads of manual toothbrushes are permanently connected to the handle, e.g. by injection molding the bristle carrier, the handle, a neck connecting the head and the handle, in one injection molding step. After the usual lifetime of a toothbrush, i.e. after about three months of usage, the toothbrush is discarded. In order to provide environmentally friendly/sustainable manual toothbrushes generating less waste when the brushes are discarded, manual toothbrushes are known comprising heads or head refills being exchangeable, i.e. repeatedly attachable to and detachable from the handle. Instead of buying a completely new toothbrush, consumers can re-use the handle and buy a new head refill only. Such refills are usually less expensive and generate less waste than a conventional manual toothbrush.
For example, manual toothbrushes are known comprising a handle to which a replaceable head is connected. The handle is provided with a cavity within which the head is insertable. To provide sufficiently strong connection between the head and the handle, the brush head is formed with a neck having a coupling anchor with a number of recesses for engaging in a complementary engaging mechanism within a collar of the handle.
However, such anchor/engaging mechanism has a relatively complex outer geometry which is not easy to clean after usage of the toothbrush. Toothpaste and slurry may accumulate in recesses of the anchor/engaging mechanism and may prevent the brush head to be accurately attachable to the handle. No guidance element is provided facilitating correct and precise adjustment of the head on the handle, in particular if recesses are blocked by accumulated slurry. Further, such engaging mechanism does not provide the toothbrush with sufficient anti-twist protection for the brush head on the handle during brushing.
If the head is not accurately attached/fixed on the handle, for example because the connector is not sufficiently clean as slurry and toothpaste accumulated in small recesses, and/or if the brush head twists away during brushing, the maneuverability of the oral care implement during brushing is poor, impeding the user reaching all areas in the oral cavity. Consequently, maneuverability of the overall brush may not be sufficient. However, in order to achieve and preserve good oral health, and to prevent gingivitis, it is important to clean teeth and gums thoroughly, in particular in hard to reach areas, e. g. in the region of the back molars. Further, gaps between teeth and periodontium, the so called gingival groove has to be thoroughly cleaned which requires a good and well-coordinated brushing technique, which may not be achievable by using the above-mentioned manual toothbrushes.
It is an object of the present disclosure to provide a manual oral care implement which overcomes at least one of the above-mentioned drawbacks, in particular an oral care implement which comprises an exchangeable brush head which is easily connectable to a handle and which does not rotate/twist aside during brushing.


A method of forming a hardmask pattern over a semiconductor device semiconductor device includes forming a first hardmask layer over a semiconductor substrate. First and second structures are formed over the first hardmask layer, the first and second structures formed of the same material, the first and second structures defining a first pitch. First and second overcoats are formed over the first and second structures, respectively, the first and second overcoats being conformal to the first and second structures, respectively. The first and second overcoats define a space therebetween and are configured to expose an underlying layer. A filling layer is formed to fill the space defined between the first and second overcoats. The first and second overcoats are removed to provide the first structure, the second structure, and a third structure provided between the first and second structures, the first and third structures defining a second pitch, the second and third structures defining a third pitch. The first hardmask layer is etched using the first, second, and third structures to obtain first, second, and third hardmask patterns, respectively.

The present invention relates to a method of manufacturing a semiconductor device and, more particularly, to a method of forming a hardmask pattern in which the pitch of a pattern is less than the resolution of the exposure equipment used.
The smallest pitch of a pattern formed in a photolithography process is varied depending on the wavelength of exposure light used in the exposure equipment. As the level of integration of semiconductor devices is accelerated, light with a wavelength shorter than what is being used now must be used to decrease the pitch of the pattern. To this end, X-ray or e-beam may be used, but this is still in the experimental stage due to technical problems, productivity, and so on. Accordingly, a Double Exposure and Etch Technology (DEET) has been proposed.
FIGS. 1A to 1C are views illustrating a conventional double exposure etch technique.
Referring to FIG. 1A, a first photoresist PR1 is coated over an etch target layer 11 and a semiconductor substrate 10. After the first photoresist PR1 is patterned by exposure and development processes, the etch target layer 11 is etched using the patterned first photoresist PR1 as a mask. At this point, the etched etch target layer 11 has a line width of 150 nm and a space width of 50 nm.
The first photoresist PR1 is removed. A second photoresist PR2 is coated over the entire surface. As illustrated in FIG. 1B, the second photoresist PR2 is patterned by exposure and development processes so that parts of the etch target layer 11 is exposed.
The etch target layer 11 is etched again by using the patterned second photoresist PR2 as a mask, thus forming a pattern having a line and space width of 50 nm, as illustrated in FIG. 1C. The second photoresist PR2 is then removed.
In the DEET, overlay accuracy during the exposure process of the second photoresist PR2 is directly connected to a Critical Dimension (CD) variation of the final pattern. In reality, overlay accuracy of the exposure equipment is difficult to control below 10 nm, thus making it difficult to decrease CD variation of the final pattern. Furthermore, there is a difficulty in controlling circuit separation through Optical Proximity Correction (OPC) over the double exposure.

Method of forming hardmask pattern of semiconductor device


A method for fabricating a semiconductor device employing a selectivity poly deposition is disclosed. The disclosed method comprises depositing selectivity poly on a gate poly and source/drain regions of the silicon substrate, and forming salicide regions on the gate and active regions from the deposited selectivity poly. Accordingly, the present invention employing selectivity poly deposition can reduce or minimize contact surface resistance and improve the electrical characteristics of the semiconductor device by reducing the surface resistance in a miniature semiconductor device. In addition, because the size of the gate electrode is getting small, the present invention can be used as an essential part of the future generations of nano-scale technology. Moreover, mass semiconductor production systems can promptly employ the present invention with existing equipment.

1. Field of the Invention
The present disclosure relates to a method of fabricating a semiconductor device employing selectivity poly deposition. More particularly, the present disclosure relates to a method of fabricating a high-integration semiconductor device that may reduce or minimize contact surface resistance resulting from a salicide process by employing selectivity poly deposition in forming a CMOS transistor in the semiconductor device.
2. Background of the Related Art
Referring to FIG. 1 and FIG. 2, a conventional method of fabricating a semiconductor device is illustrated. FIG. 1 shows a flow chart of one conventional method of fabricating a semiconductor device. FIG. 2 schematically illustrates, in a cross-sectional view, a semiconductor device according to the conventional method of fabricating a semiconductor device outlined in FIG. 1.
In accordance with the conventional method of fabricating a semiconductor device, a Shallow Trench Isolation structure (hereinafter referred to as "STI") 11 is formed over a semiconductor substrate.
A gate oxide layer is grown on the substrate in regions other than the location of the STI 11 (S102), and a polysilicon layer is deposited (S103) on the gate oxide layer. Thereafter, a patterning process is performed (S104) to form a gate poly 2 over a gate oxide 1. A low concentration of dopant ions are implanted into the silicon substrate (S105) to form lightly doped source/drain regions, as is known in the art.
Spacers 3 are formed on the sidewalls of the gate poly (S106). In addition, a high concentration of dopant ions for forming the source/drain regions are implanted (S107).
However, in the above-mentioned conventional process for fabricating a semiconductor device, one of the largest problems in a logic and analog device is the increased surface resistance of poly salicide. When the semiconductor device is minimized in order to form a high-integration circuit, and as the high-integration circuit requires a great miniaturization for gate electrodes and source/drain regions, a problem arises that the surface resistance of the gate poly increases due to the decrease of the semiconductor device in size.
U.S. Pat. No. 4,610,078, Matsukawa et al., discloses a method of manufacturing a semiconductor device in which the margin for the semiconductor wafer at the step of forming the contact hole is reduced, thereby increasing the packing density of elements in semiconductor wafer.
U.S. Pat. No. 5,006,911, Richard D. Sivan, discloses a transistor device having a gate centered in an active region in which the gate does not extend beyond the active region.
U.S. Pat. No. 6,080,661, Subhas Bothra, discloses methods for making reliable conductive vias in semiconductor devices that are fabricated over a semiconductor wafer by fabricating conductive contacts down to diffusion regions and transistor gates in self-aligned contact processes.

Method of fabricating semiconductor device employing selectivity poly deposition


The present invention provides a method, referred to as CpG retrieval, to overcome incomplete bisulfite modification of DNA recovered from formalin-fixed tissue samples. The method involves boiling deparaffinized tissue samples in citrate buffer, followed by DNA extraction for promoter methylation analysis. In general, the extracted DNA is further modified by sodium bisulfite and then subjected to a method of promoter methylation analysis. The present invention also reports that hypermethylation of ataxia-telangiectasia-mutated gene promoter is correlated with decreased overall survival in patient with head and neck squamous cell carcinoma.

1. Field of the Invention
The present invention relates generally to the study of promoter hypermethylation. More specifically, the present invention provides a method to overcome incomplete bisulfite modification of DNA recovered from formalin-fixed tissue samples.
2. Description of the Related Art
In higher order eukaryotic organisms, DNA is methylated only at cytosines located 5′ to guanosine in the CpG dinucleotide. CpG rich areas (CpG islands) comprise about 1% of vertebrate genomes and account for about 15% of the total number of CpG dinucleotides. CpG islands are typically between 0.2 to about 1 kb in length and are located upstream of many housekeeping and tissue-specific genes, but may also extend into gene coding regions.
Methylation of cytosine residues within CpG islands plays important role in gene inactivation, cell differentiation, tumorigenesis, X-chromosome inactivation, and genomic imprinting. Extensive methylation of CpG islands has been associated with transcriptional inactivation of selected imprinted genes and genes on the inactive X chromosome of females. CpG islands of constitutively-expressed housekeeping genes are normally unmethylated in the germline and in somatic tissues. Tissue-specific genes are usually unmethylated in the receptive target organs but are methylated in the germline and in non-expressing adult tissues.
Aberrant methylation of normally unmethylated CpG islands has been described as a frequent event in immortalized and transformed cells and has been frequently associated with transcriptional inactivation of tumor suppressor genes in human cancers. Increased methylation of CpG islands associated with tumor suppressor genes may lead to progressive reduction of normal gene expression resulting in the selection of a population of cells having a selective growth advantage (i.e., a malignancy). It is considered that an altered DNA methylation pattern, particularly methylation of cytosine residues, causes genome instability and is mutagenic.
In recent years, emerging evidence indicates that epigenetic alterations associated with promoter hypermethylation is one of the most common molecular events in human neoplasia and this epigenetic change works closely with genetic alterations (coding-region mutation) in human carcinogenesis. Loss of gene function due to promoter hypermethylation has characteristics that mimic the loss of tumor-suppressor gene function due to genetic alterations. Hypermethylation of one allele is frequently accompanied by deletion of the opposite allele, resulting in loss of heterozygosity of the gene. Gene inactivation associated with promoter hypermethylation is fully heritable and loss of gene function due to promoter hypermethylation leads to selective growth advantage in a manner identical to loss of tumor-suppressor gene function.
A number of housekeeping genes are inactivated primarily via promoter hypermethylation in human cancers. A housekeeping gene is a gene of general importance and expresses in a wide variety of organs and tissues. Characteristically, a housekeeping gene contains CpG islands and is devoid of TATA or CAAT boxes in its promoter. The expression of these CpG island-containing housekeeping genes is regulated frequently via promoter CpG island methylation. Genes involved in DNA repair are functionally very important as reflected by their expression in a wide variety of tissues. DNA repair genes, such as hOGG1, hMLH1, MGMT, a gene specific for repair of O6-methylguanine, and NTH1, a gene specific for repair of thymine glycol, all contain CpG islands in their promoter, indicating that these important DNA repair genes are subjected to regulation by promoter methylation.
Methylation-specific PCR (MSP) has recently been developed and used to analyze promoter methylation status of various genes (Herman et al., 1996). One fundamental element of the methylation-specific PCR is to modify DNA using sodium bisulfite before the PCR reaction. In this process, all cytosines not in the CpG sequence (non-CpG cytosines) will be converted to thymine because they are all inevitably free of methylation. On the other hand, cytosines in the CpG sequence (CpG cytosines) will remain as cytosine if the C is methylated but will be converted to thymine if the C is not methylated. This method is considered to be the most sensitive and specific method for promoter methylation determination.
Currently, the methylation-specific PCR method is primarily used with DNA samples extracted from fresh tissues or cells in culture and is only applied sporadically to formalin-fixed, paraffin-embedded tissues. DNA extracted from formalin-fixed tissues is of poor quality and may still contain formalin-induced DNA/DNA or DNA/protein crosslinks that survive the extraction processes. Thus, the prior art is deficient in a method of analyzing promoter methylation in DNA isolated from formalin-fixed, paraffin-embedded tissues. The present invention fulfills this long-standing need and desire in the art.

CpG retrieval of DNA from formalin-fixed pathology specimen for promoter methylation analysis


Processes for the production of a product by the enzymatic treatment of a soluble or particulate substrate with a particulate, immobilized enzyme, by treating a process liquor containing the substrate in a bioreactor to produce a slurry of effluent immobilized enzyme and the product in an effluent liquor. The slurry is subject to a non-immobilized enzyme damaging shear inducing effective separation process to provide effluent immobilized enzyme, and effluent liquor containing the product; and reusing the effluent immobilized enzyme in the enzymatic treatment. The process provides for the reclamation and reuse of the immobilized enzyme even when a further particulate solid is present in the effluent/product stream.

The industrial use of enzymes is often limited by their high cost and rapid inactivation. Soluble enzymes are lost with the product at the conclusion of a process, and must be replenished.
One means to improve the economic feasibility of enzymes for industrial processes is through enzyme immobilization onto a matrix, which may facilitate their re-use. Immobilization research has focused upon means to enhance the transfer of enzymes onto the support, and upon means to ensure that the immobilized enzymes remain active. Inactivation of enzymes during catalytic turnover is another key obstacle which limits the economic feasibility of enzyme-mediated processes. Enzymes may be inactivated by extremes of temperature, pH, shear, and also by free radicals and other reactive species present in the reaction medium. Immobilization technology has the potential to reduce such enzyme inactivation, and thus extend their useful lifespans.
Biochemical Engineering Journal, 4, (2000), 137-141, Ganesh K et al, teaches that during the production or downstream processing of an enzyme it is always subjected to shear stress, which may deactivate the enzyme. This susceptibility of enzymes to shear stress is a major concern as it leads to the loss of enzyme activity and is, therefore, a major consideration in the design of the processes involving enzyme production and its application. In this reference, cellulase enzyme was subjected to shear stress in a stirred reactor with an objective of investigating its deactivation under various conditions, such as different agitation speeds, concentrations of enzyme, concentrations of buffer, pH ranges, buffer systems and the presence of gas-liquid interface. It was found that the extent of deactivation depends upon the conditions under which the enzyme was subjected to shear.
For industrial use, it is generally not sufficient for only one of these obstacles to be overcome. For example, a stable, immobilized enzyme that cannot be easily recovered or reused offers few advantages. Similarly, an immobilized enzyme that is easily recovered and reused, but does not maintain its activity over an extended period offers few advantages over a process mediated by soluble enzymes, since, in both cases, the enzymes must be replenished at frequent intervals. The main goals are to produce a stable immobilized enzyme, which can also be efficiently and completely recovered, so that its useful lifespan is many times greater than the single use afforded by a soluble enzyme. An enzyme recovery system is therefore of paramount importance.
To date, immobilized enzyme/reactor technologies have focused on "in situ" enzyme preparations, in which the enzymes are retained within the reactors, while the process fluid is passed through. This prevents loss of the enzyme with the process fluid, and allows the enzyme to be used several times. Examples include, enzymes immobilized within gels which are used within a packed bed reactor, and enzymes attached to, or retained within, semi-permeable, hollow, fiber membranes. Enzymes have also been incorporated within monoliths, such as those used in an automobile catalytic converter, wherein the fluid containing the substrate passes through the monolith.
Unfortunately, enzymes "entrapped" within gels are subject to mass transfer limitations, which may dramatically reduce the performance of the immobilized enzymes, relative to soluble enzymes. The use of enzymes in packed beds is seemingly attractive in that the immobilized enzyme is retained within the reactor, while the process fluid containing substrate and product passes through. However, such an arrangement may be limited by mass transfer outside the particle, due to restriction of fluid flow around the tightly packed particles. To avoid extra-particle mass transfer limitations, relatively large particles are used for the immobilized enzyme. However, larger particles lead to greater mass transfer limitations within the particle, and consequently, it is necessary to choose a particle size that balances intraparticle and extraparticle mass transport. Furthermore, a packed-bed arrangement is only practical if the substrate is easily transported through the packed bed. Replacing the immobilized enzyme in such a reactor may also be time-consuming as to lead to significant process "down-time". Thus, the economic benefits are only realized if the enzyme is very stable, and it does not need frequent replacement.
Packed bed reactors and other types of "in situ" immobilized enzyme reactors, such as monoliths and hollow fibers, can be prone to plugging. Consequently, they may be inappropriate if the substrate is insoluble, for e.g., in a slurry. In all cases, in situ preparations rely on the transport of the substrate to the immobilized enzyme, either by convection or diffusion. If flow is "segregated", as in a slurry, or there is insufficient mixing, or if the substrates are bulky and have low diffusion rates, such substrate-enzyme contact may be hindered and lead to dramatically reduced efficiency and performance. Since some of the key industrial enzymatic processes involve slurries, e.g., starch hydrolysis and pulp processing, there is a need for an immobilized enzyme reactor process that differs from the traditional "in situ" immobilized enzyme reactor.
A particular example of an immobilized enzyme reactor is that which is used for isomerization of dextrose to fructose. A solution of soluble dextrose passes through a bed of immobilized glucose isomerase at such a rate as to ensure a specific product, namely, fructose, concentration at the bed outlet. Owing to continuous inactivation of the immobilized enzyme, the flow rate through the packed bed reactor must be continuously reduced, to ensure that the fructose concentration of the effluent is held constant. It is often necessary to reduce the feed flow rate by a factor of ten or more throughout the "useful" lifespan of the immobilized enzyme. However, such a reduction in flow rate also leads to a proportional reduction in the rate of production of fructose. Consequently, an array of generally 20 or more reactors is used, each of which reactor contains immobilized glucose isomerase of a different age, and each with a different, continuously changing flow rate (H. S. Olsen, Enzymatic Production of Glucose Syrups, in Handbook of Starch Hydrolysis Products and Their Derivatives, M. W. Kearsley and S. Z. Dziedzic, eds., Blackie Academic and Prof. Publishers (Chapman and Hall), Glasgow, 1995). By combining the effluent from each reactor, the average production rate of fructose is kept relatively constant. Once the immobilized enzyme reaches the end of its useful lifespan, that reactor in the array is taken out of service, and the immobilized enzyme is replaced with fresh enzyme.
Unfortunately, such a process arrangement is cumbersome and complex, and the capital cost is high due to the number of reactors required, and the need for complex valving and process control equipment to manage the adjustment of fluid flow rates to each reactor in the array. A further disadvantage of such an arrangement is the production of "color" and other "off-flavor" reversion byproducts, which are more likely to be generated at low flow rates and thus, high residence times. Thus, improvements in immobilized enzyme technology and enzyme recovery methods could dramatically simplify this process, and improve its economics.
U.S. Pat. No. 5,177,005, issued Jan. 5, 1993—Lloyd and Antrim, describes a continuous process for production of fructose involving glucose isomerase adsorbed onto a support such as a resin. The reactor was packed with excess resin as a support and, periodically, fresh, soluble glucose isomerase was added to compensate for the inevitable loss of activity of the previously immobilized enzyme. In trials, fresh glucose isomerase was added approximately every 3 weeks, on average, to keep the dextrose conversion between 40 and 44%. Over a 27 week trial, the quantity of soluble enzyme added represented approximately 4 times the quantity of enzyme originally present in the reactor. Unfortunately, such additions can only continue as long as there is binding capacity on the resin. Once the resin is fully loaded, additional soluble glucose isomerase may confer little benefit, unless the inactivated enzyme is somehow removed from the support. At this point, the process must either be shut down to replace the gel, or run in a "variable flow rate mode", similar to that with traditional immobilized glucose isomerase, described hereinbefore.
U.S. Pat. No. 4,033,820, issued Jul. 5, 1977—Brouillard R. E. describes another in situ immobilized enzyme preparation based on a highly porous, spongy starch gel, modified to act as a support for the enzymes. It was acknowledged that this approach is only suitable for substrates that are soluble in water and that slurries cannot be processed. Another challenge with this approach is the degradation of the starch support gel. Several exotic cross-linking treatments are required if the support is to be used for enzymes that degrade starch, e.g., amylase and glucoamylase. Bactericides, such as formaldehyde or chlorine, were used to regularly wash the column to prevent bacterial contamination.
U.S. Pat. No. 4,209,591, issued Jun. 24, 1980 to Hendriks P., describes a multistage fluidized bed process involving countercurrent flow of an immobilized enzyme and substrate solution. The system is designed such that nearly all of the activity of the immobilized enzyme has been lost by the time it reaches the outlet of the multistage unit. Thus, this operation also involves a "single use" of enzyme, since the enzyme is not recovered or reused. Sieve plates or mesh screens may be used between and within stages to regulate the transfer of immobilized enzyme and substrate from one compartment to the next. In principal, this process is amenable to the use of substrate slurries, however, the particle sizes of the substrate and immobilized enzyme must be small enough to pass through the sieve or mesh. Furthermore, an extremely narrow particle size distribution is required for the immobilized enzyme, to prevent its separation into various sized fractions during operation. It is well accepted that for proper fluidization, the flow rate of the substrate solution is determined in large part by the size and shape of particles and the particle density relative to that of the fluid.
Other examples aimed at multiple use of immobilized enzymes include U.S. Pat. No. 4,442,216, issued Apr. 10, 1984 to Harvey, D. G., U.S. Pat. No. 4,511,654, issued Apr. 16, 1985 to Rohrbach et al, and U.S. Pat. No. 4,594,322, issued Jun. 10, 1986 to Thompson G. J. The former describes a screw-type reactor that includes a screw-lift mechanism and conveyor to recover the immobilized enzyme, wash it and return it to the inlet of the reactor. U.S. Pat. No. 4,511,654 describes an immobilized glucoamylase packed bed reactor with subsequent substrate recycle via an ultrafiltration membrane. The enzyme in this process is, thus, in situ. This process is suitable for soluble sugar feedstocks only. Aforesaid U.S. Pat. No. 4,594,322 describes a similar process in which the hydrolysis products are separated into a glucose-rich stream and a polysaccharide-rich stream, the latter of which is recycled to pass again through the reactor containing immobilized enzyme.
U.S. Pat. No. 4,844,809, issued Jul. 4, 1989 to Yoshiro et al, describes the use of a hollow fiber membrane for removal of fine particles from a reaction solution. While the inventors cite this invention for other purposes, such as the removal of impurities, such a technique could also, conceivably, be used to retain enzymes immobilized to fine particles within a hollow fiber reactor, e.g. "Ultrafiltration Separation of Cellulase and Glucose for a Lignocellulosic Biomass to Ethanol Process", J. S. Knutsen and R. H. Davis, Conference Proceedings, Symposium on Biotechnology for Fuels and Chemicals, Breckenridge, Colo., May. 6-9, 2001.
Consequently, applications of immobilized enzymes have been essentially restricted to in situ preparations, usually within packed bed reactors. Such processes, although technically and, occasionally economically feasible, may be unnecessarily cumbersome. They may also be unsuitable for process streams in which the substrate is present as a slurry. An immobilized enzyme process capable of processing slurries, and/or which avoids the complexity required to account for enzyme inactivation within in situ preparations, e.g. production of HFCS, would be extremely advantageous.
Slurries cannot be processed using an in situ immobilized enzyme within a packed bed or monolith reactor, due to plugging of the bed or monolith, and mass transfer problems that limit immobilized enzyme-substrate contact. A design in which the immobilized enzyme is free to circulate within the reactor can overcome these limitations. However, a means to facilitate recovery and reuse of the immobilized enzyme is also required.
There is, therefore, a need for an immobilized enzyme recovery process which enables the immobilized enzyme to be reused and, preferably, recycled within a full enzymatic treatment plant, wherein substrate feedstock is enzymatically treated with particulate immobilized enzyme.

This patent is subject to a terminal disclaimer.

Recovery method for immobilized biocatalysts


Gather and scatter operations are used when elements of a vector which may be operated on in parallel are not located at successive addresses in memory. Prior data processing systems required complex address calculation hardware and other hardware to perform vector gather and scatter operations. By contrast, one embodiment of the present invention implements gather and scatter operations using a plurality of deposit and extract instructions. As a result, gather and scatter operations may be efficiently performed within a general purpose processing environment and without the need for dedicated gather/scatter hardware.

1. Field of the Invention
This invention relates generally to the field of processor operations. More particularly, the invention relates to an apparatus and method for performing vector gather and scatter operations using a computer processor.
2. Description of the Related Art
In order to perform vector computations on a computer, matrices such as that illustrated in FIG. 1 must frequently be loaded into memory. Once in memory, the matrix may be combined with other matrices (not shown) to perform complex, multidimensional computations (e.g., vector addition, vector multiplication).
One problem which exists, however, is that matrices can take up a substantial amount of memory, particularly when used to store certain types of data (e.g., scientific data pertaining to physical phenomenon). In addition, matrices may be sparsely populated with data elements. For example, only 4 data elements out of the 24 illustrated in FIG. 1 contain non-zero values, resulting in an inefficient use of memory.
To conserve memory when working such large, sparsely populated matrices, "gather" and "scatter" operations were developed. For example, the CRAY-1 computer system performed gather operations to collect the elements of a matrix from memory and store them in a highly compressed format (e.g., sorted contiguously in an ordered array). Conversely, when necessary to perform various matrix operations (e.g., matrix multiplication) the CRAY-1 performed scatter operations to reproduce the previously-gathered matrix in memory.
One problem which exists, however, is that these systems require complex dedicated hardware to perform the gather and scatter operations. For example, the CRAY-1 employed a vector processor which performed gather and scatter operations using dedicated registers to hold index vectors and dedicated address calculation hardware.
Accordingly, what is needed is a more efficient apparatus and method for storing and working with matrices in a computing environment. What is also needed is a system and method for performing gather and scatter operations on a general purpose processor.

Code sequence for vector gather and scatter


A method of reinforcing or retrofitting building roof structures against hurricane-force winds which does not require removal of part or all of the roof. The improved method includes directing a thin stream of a liquid polymer foam adhesive under pressure upwardly along the intersections of the rafters or support members and the roof panels, preferably on both sides of the support members. The foam adhesive then creams and foams, forming polymer foam adhesive gussets which firmly adhere to the adjacent surfaces of the support members and roof panels. This method increases the pull-off strength of a roof about seven fold and is able to withstand hurricane-force winds.

Hurricanes and other extreme weather conditions cause many millions of dollars of damage to property each year. The most common damage to buildings by such events is the "loss" of the roof, which exposes the building interior and contents to water and wind damage. Many attempts have been made over the years to limit the damage to the roofs of buildings due to hurricane-force winds, but such attempts have not proven successful or commercially feasible. For example, the roof could be removed or partially removed and reinforced using improved mechanical fastening systems. But such methods would cost each homeowner thousands of dollars and mechanical fasteners have not proven satisfactory. The urgent need for a solution to this serious problem therefore remains.
A typical roof construction generally includes equally spaced rafters or truss members which are supported and attached to the upper structure of the building, above the attic, for example, in a typical home construction. The rafters may pitch upwardly and be secured to a ridgeboard, forming a triangular or "peaked" roof, or the rafters may extend horizontally forming a flat roof. Alternatively, triangular or rectangular engineered trusses may be used as the roof support. Roof boards or panels are then attached to the transverse spaced support members, that is, the rafters or the upper chords of the engineered roof trusses, generally by driving nails through the roof panels into the support members. Roof boards may be used or panels, such as 4'.times.8' sheets of plywood sheathing, fiberboard or the like. For ease of description, the term panels will be used hereinafter to include roof boards or larger panels, such as the 4'.times.8' sheathing typically used in home constructions. The roofing, which generally includes roof tiles or shingles, is then secured on the roof panels.
A hurricane, for example, may create uplift forces or a vacuum in excess of 100 lbs./sq. ft., tearing the nailed roof panels from the support members. Nails or screws are not able to withstand such uplift forces. Glues and various adhesives and additional mechanical fasteners have also been tried without success under hurricane-force winds. It should also be noted that once one or a few roof panels are torn from the support members, the entire roof or a large portion of the roof may be torn from the structure. The exposed building interior and contents will then be subject to water and wind damage, which may exceed the cost of repairing or replacing the roof. There is, therefore, an urgent need for a method of reinforcing and securing the roof of a building against uplift forces such as encountered in hurricanes, particularly for existing building structures, preferably not requiring removal of the roof.

Method of reinforcing the roof of a building against hurricane-force winds


A table includes a vertical support column and a base. The base includes a first floor engaging portion disposed on a first side of a vertical axis and a second floor engaging portion disposed on an opposite second side of the vertical axis. The first and second floor engaging portions are weighted such that the base has a center of gravity spaced from the vertical axis on the second side of the vertical axis. A worksurface member is supported by the vertical support column and is vertically spaced from the base. The worksurface member is rotatable relative to the base. In one aspect, the worksurface member has an overall length greater than the overall length of the base. In another aspect, a stop limits rotation of the worksurface member.

Tables, such as overbed tables, are typically configured with a worksurface that is positionable over a bed or chair for use by the occupant thereof. Typically, an overbed table is configured with a base that is positionable beneath the bed or chair. The base counter-balances the cantilevered weight of the worksurface, and any load applied thereto. The base may be configured with wheels, often lockable, such that the table is portable and may be easily maneuvered under/over the bed or chair, around a patient room and/or within adjacent hallways. Typically, however, the base has a length and/or width substantially the same as the worksurface so as to provide adequate counter-balance. To provide the requisite stability, the base occupies a relatively large footprint, thereby limiting the space in which it may be disposed, both from a height and depth perspective. Due to its length, width and height, the base may also interfere with the feet and/or gait of a transporter moving the table from one location to the next.
In addition, the worksurface is typically not rotatable relative to the base, so as to prevent the overbed table from tipping over. Accordingly, the entire overbed table, including the base, must be moved away from the bed when the worksurface is not needed, or the base must be positioned along the side of the bed if the user desires to use the worksurface as a side table. Either way, the base occupies floor space and may interfere with an efficient use of the room and otherwise impede the flow of traffic. Conversely, other overbed tables configured with a rotatable top typically require large footprints, or large bulky base configurations, to accommodate the variable, off-center cantilevered worksurface and any loads applied thereto.


The present invention provides benzoxazole derivatives and nonlinear optical (NLO) materials obtained therefrom as a novel organic NLO material having following general formula (I), which can be used as optical devices such as electro-optic modulator, optical switch, or the like for treating optical signal in optical communication industry. In order to obtain more stable NLO material, benzoxazole group having high thermal resistance is substituted as a .pi. conjugated unit instead of conventional stilbene or azobenzene group. A variety of NLO materials can be prepared by the synthetic process according to the present invention. ##STR1## wherein D and Ar have the same meaning as defined in the aforementioned.

Nonlinear Optical (NLO) materials are used as media of second and third harmonic generator and optical devices such as electro-optic modulator, optical switch, or the like for treating optical signal in ultra-high speed optical communication, and are developed as an important element for the forthcoming information age.
The NLO materials can be divided into two groups of inorganic and organic NLO materials. As conventional inorganic NLO materials, LiNbO.sub.3 or GaAs crystals may be mentioned. Organic NLO materials, as described in Chemical Review vol.94, No.1, 31-76(1994) published by American Chemical Society, can make materials having higher electro-optic coefficient than that of inorganic NLO materials. In particular, they can be advantageously used in high-speed electro-optic modulator due to their low dielectric constant. Among them, non-crystalline organic NLO polymers have excellent optical properties and processibility so that optical devices may be prepared in low cost.
Organic compounds exhibiting NLO characteristics generally have a structure of electron donor--.pi. conjugatedunit--electron acceptor. In other words, a molecular structure having an electron donor (e.g. nitrogen, oxygen, sulfur) at one end, an electron acceptor (e.g. nitro group, cyano group, sulfone group, or the like) at the other end, and a long .pi. conjugation between them exhibits high optical nonlinearity. Thus, most of the organic compounds showing NLO characteristics as mentioned above are .pi. conjugation type compounds containing stilbene or azobenzene group. Representative examples are dyes such as 4-dimethylamino-4'-nitrostilbene (DANS), 4-N-ethyl-N-(2- hydroxyethyl)!amino-4'-nitroazobenzene (Disperse Red 1), or the like. These dyes have been frequently used in the field of organic NLO materials because they can be simply synthesized, however, they have thermally weak double bonded .pi. conjugation.
In the field of organic nonlinear optics, various molecular designs have been sought in order to prepare more effective and stable NLO materials cf. Angew. Chem. Int. Ed. Engl. vol.34, 155-173 (1995)!. For example, a development of novel NLO dye having higher dipole moment(p) and second-order hyperpolarization (.beta.; a process of cross-linking after electric field arrangement (poling) in order to minimize the relaxation of dipolar vector of NLO dye directed to one direction; and introduction of polymer matrix having high glass transition temperature have been attempted. In particular, intensive studies have been recently performed in order to improve thermal stability of organic NLO polymers, which is relatively lower than that of inorganic NLO materials.
In addition, the thermal resistance of dye itself having substantial NLO properties as well as that of polymer matrix have been accounted very much, as described in SPIE, vol.2042, 354-365(1994). In other words, a novel NLO dye which is stable at high temperature is requested in order to minimize thermal decomposition of dye under the poling condition and environment of manufacturing devices and operation at high temperature, and maximize the NLO properties.
The present inventors have noticed a design of a novel NLO material derived from polybenzoxazole which is well known as an aromatic polymer having high thermal resistance and high anti-oxidation stability cf. Macromolecules, vol.18, 616 (1985)!, and developed a novel NLO material having enhanced thermal resistance as compared to conventional NLO materials comprising stilbene or azobenzene group, by substituting the .pi. conjugation of basic skeleton of NLO dye with an aromatic benzoxazole group having more excellent thermal resistance, instead of conventional stilbene or azobenzene.

Benzoxazole based nonlinear optical derivatives and polymers obtained therefrom

Korea Institute Of Science And Technology


System for identification of a person (P, P') or an object with an informon carrier (1; G, 20), including at least one identification (IA, IB, IC; K) not perceptible with a human sense organ characteristic for a certain person (P, P') or an object (G), a device (2; 22, 23) for the inscription of the identification (IA, IB, IC; K) on to the information carrier (1; G, 20) and a device (8) to the read and evaluate the identification, wherein the information carrier (1; G, 20) carries a recording detectable only in ultraviolet light of a predestined range of wavelengths which is containing the identification (IA, IB, IC; K) and that the device for the inscription (2; 22, 23) includes means for the generation (7) and the device (8) for reading and evaluating includes means for reading the recording by means ultraviolet light.

The invention relates to a system for identification of a person or an object with an information carrier comprising at least one identification mark not perceptible with a human sense organ. Such a system for identification is known already from everyday life, especially in form of money cards of automatic banking systems, where a person uses an information carrier bearing an identification information, which is not perceptible by human sense organs (money card with magnetic coding). Cash may be taken from such automatic banking system, such device having provisions for reading and evaluation the identification information.
Within a station for the production of money cards a device is included for the (initial unique) inscribing of the identification information to the information carrier.
Such systems are furthermore to be found in credit and customer card systems as well as in buildings with respect to giving access to the building.
A fundamental disadvantage in most systems being used is the danger of misuse by persons, which are in unauthorized possession of a money, customer or identity card.
There is a certain amount of protection in the usual assignment of an individual code numbers (pin) to the authorized person when issuing the cards, but when these code numbers are not kept secret there will be no protection against misusing the card finally.
A known idea to prevent the misuse of identity, customer--e.g. cards by unauthorized persons is in checking the identity of the person presenting the card by external characteristics of the person or its signature.
This makes necessary the availability of a photo or a specimen signature at each possible place where the card might be presented.
Since no specimen copy can be positioned at any possible place of presentation in very large systems this might be placed directly on the card or might be accessible on-line from a central memory.
There is a considerable danger of falsification encountered in the first solution, the second one demands considerable effort in maintaining the data connection channels and are time-consuming because of the access, transmission and processing times not to be neglected.
The danger of falsification may be reduced--but not completely avoided--as it has been described in the German Offenlegungsschrift 2 845 567 by combining several identifications on a personal identity cards--and if necessary further reduced by using a complicated technical procedure of inscription.
In the German Offenlegungsschrift 41 25 198 it has been proposed to assign to any person authorized access a data system a portable device including a data chip and a reading device for the finger tip. This functional unit however is costly in manufacturing and by far bigger and not as handy as a credit card, thus being unsuited for distribution in large quantities.

Personal and property identification system

Borus Spezialverfahren und -gerate im Sondermaschinenbau GmbH


A keyed electrical connector (2) includes a diecast housing (4) having a front face (20). A keying structure (26) which is an integral part of the housing (4) upstands from the front face (20). The keying structure forms a cylindrical protrusion (28) extending to a distal end (30). The cylindrical protrusions (28) defines an exterior surface having a radially outwardly extending rib (32). The rib (32) extends along at least a portion of the exterior surface of the protrusion (28).

This invention relates to electrical connectors, and in particular to keying structures therefor.
Electrical connectors may be provided with keying structures to permit predetermined pairs of connectors to mate with each other and to prevent the mating of connectors which are not intended to be mated with each other. Keying structures are usually provided on connectors when a plurality of identical connectors are positioned in situ in close proximity to one another so that there is the risk of the wrong connectors being mated therewith. Keying structures do not interfere with the mating of connectors that are intended to be mated with each other but provide interference with the mating of connectors that are not intended to be mated with each other, so as to prevent such mismating.
The keying of connectors is to be distinguished from the polarization of connectors, in that polarization ensures that a first connector which is matable with a second connector is properly oriented relative to the second connector for mating; whereas keying provides a mechanism which permits the mating of connectors which are intended to be mated with each other but prevents the mating of connectors which are not intended to be mated with each other even if they are properly oriented with respect to each other.
U.S. Pat. Nos. 4,822,305 and 4,832,624 disclose keying systems in which a key member is secured to one of the pair of complimentary connectors and is adapted to cooperate with an opposing key member secured in the other connector of the pair.
Each key member is secured in its connector in a selected orientation with respect to its opposing key member so that when the connectors are intended to be mated, extended portions on the key members pass by each other during mating to allow the connectors to mate. If one of the key members is secured in an orientation that is not complimentary to its opposing key member, the extended portions on the key members will engage one another during mating to prevent the connectors from mating. U.S. Pat. No. 4,929,184 disclose a keying system comprising parts which are securable to metal flanges on an electrical connector.
There is disclosed in U.S. Pat. No. 4,934,950 an electrical connector having keying means which are securable in one of a plurality of different angular orientations in a plastic housing.
U.S. Pat. No. 3,491,330 discloses an electrical connector having keying members to each of which a bushing can be locked in one of several possible angular orientations.
According to U.S. Pat. Nos. 3,582,867 and 4,895,535 keying means are securable in one of several possible angularly orientation in a flange of a connector.
U.S. Pat. No. 4,181,391 discloses connectors having keying devices mounted to corresponding flanges of the connectors in one of a plurality of angular orientations. The connectors are securable together by means of jackscrews surrounded by keying structures.
U.S. Pat. No. 4,457,575 discloses a connector having an insulating housing provided with a metal shield. Keying means are formed integrally with the housing forwardly of the shield.
United Kingdom Patent 961,714 discloses a connector having a multi-part keying assembly removably received in a recess in an insulating housing of the connector. The keying assembly includes a rotatable pin having a hexagonal flange at one end and an axial keying spline at the opposite end of the pin.

Connector with diecast housing and integral keys


An information processing apparatus includes an application program; a power control unit configured to switch power modes so as to control ON/OFF of power supply to each piece of hardware; and a function execution unit configured to execute control of a specified function based on an instruction from the application program. The function execution unit is configured to inquire at the power control unit for the power modes in response to an instruction from the application program. The power control unit is configured to return a power mode to the function execution unit. The function execution unit is configured to notify the power control unit of a recovery request for powering ON the hardware that has been powered OFF in the power mode not supported.

1. Field of the Invention
The present invention relates to an information processing apparatus, a power control method, and a computer-readable storage medium.
2. Description of the Related Art
In image forming apparatuses, a power saving mode is set for reducing a power consumption amount in a standby state where no operation is performed. In the power saving mode, electric power is supplied to only parts that require it and is not supplied to other parts among the respective parts constituting the image forming apparatus so as to suppress the power consumption amount.
Furthermore, in the recent image forming apparatuses, provided is a development environment such as a software development kit (SDK) for development of application programs as disclosed in Japanese Patent Application Laid-open No. 2006-148876. The application programs are made to operate on a common middleware, so that cooperation among the application programs and the development speed are improved. In addition, application programs for controlling power saving as described above have been developed by the SDK.
In the case of the application program produced by the above-mentioned SDK, there is requirement that common functions are desired to be installed in all models. When a power saving mode that is not installed in the past application program becomes capable of being set to a new device, the device cannot respond to the power saving mode appropriately in some cases because the application program are not updated for individual devices. For example, there has been a possibility that troubles are generated on operations as follows. That is, a processing method is not figured out even if the power saving mode that is not supported by the application program is notified, or there arises a difference between a power state in the device and a power state grasped by the application program. The problem arises not only on the application program provided in the development environment of the SDK as the provision mode but also on application programs developed for being newly installed in image forming apparatuses and other devices. Furthermore, it can be said that the problem can arise on various devices other than the image forming apparatuses.
Therefore, there is a need to provide an information processing apparatus capable of operating the apparatus normally even in a power saving mode that is not installed in an application program.

Information processing apparatus, method and computer-readable storage medium for power control under a plurality of power modes including an unsupported power mode


Methods and apparatus are provided for generating a color profile for a color output device including a plurality of colorants, the methods and apparatus printing a plurality of color patches on an output medium, measuring a spectral or colorimetric response for each of the printed patches and for the output medium, calculating spectral or colorimetric responses for overprint combinations of the colorants based on the measured spectral or colorimetric responses, calculating colorimetric values in a profiling target based on the calculated and measured responses, and providing the calculated colorimetric values to profiling software for generation of the color profile.

This invention relates to color image processing. More particularly, this invention relates to methods and apparatus for profiling color output devices.
A profile for a color output device (referred to herein as a "color profile"), includes transformations between the color space of the color output device and a profile connection space, such as Commission Internationale de l'Eclairage ("CIE") XYZ, or other similar profile connection space. A color profile typically is produced in accordance with the profile specification of the International Color Consortium ("ICC"), and hence is referred to as an "ICC profile." A profile connection space derived from the XYZ color space is commonly known as the CIE LAB color space, which expresses color values in a rectangular coordinate system, with L, a, and b values each corresponding to one of the three dimensions in the system.
An ICC profile generally includes a transform from the profile connection space to the device space (the "forward transform"), and a transform from the device space to the profile connection space (the "backwards transform"). For example, if a color output device is a four-color printer that uses cyan, yellow, magenta and black ("CMYK") colorants, the forward transform may be used to convert device-independent LAB colorant values to equivalent device-dependent CMYK colorant values, and the backwards transform may be used to convert device-dependent CMYK colorant values to device-independent LAB colorant values.
To create a color profile for a color output device, such as a printer, copier, offset press, or other similar color output device, a test chart including numerous color patches is printed on media, such as paper, by the color output device. Exemplary test charts include IT8, ECI2002, and other similar test charts. Next, a measurement device, such as a calorimeter, spectrophotometer, spectrocolorimeter, or other similar device is used to obtain spectral or colorimetric data that describes each printed patch. The measured data are then provided to profile generation software, which calculates a color profile based on the spectral or colorimetric measurements. Profile generation software may be any conventional profile generation software, such as the EFI Color Profiler software, licensed by Electronics for Imaging, Inc., Foster City, Calif., U.S.A., or other similar profile generation software.
Previously known techniques for creating color profiles have several disadvantages. First, conventional test charts include a large number of color patches, and therefore are time-consuming to measure. Indeed, a conventional IT8 test chart includes more than 900 test patches, and a conventional ECI2002 test chart includes more than 1,400 color patches. In addition, because such a large number of measurements must be taken, the risk of measurement errors becomes significantly increased.
Second, conventional test charts use a relatively large amount of space on the output media, and therefore may require a special print run solely for purposes of printing the test charts. Indeed, a conventional IT8 test chart may be more than 600 cm2 and an ECI2002 test chart may be more than 1,200 cm2. Because such test charts often are too large to print alongside a print job, it may be very costly to print test charts on the color output device. For example, to print a conventional test chart on an offset printing press, the press typically must be taken offline, special plates must be installed on the press that include images of the test chart, the press must be restarted, and the test chart must be printed on several thousand sheets of output media. Such a process not only consumes valuable resources such as output media and ink, but also constitutes costly downtime during which the press is not being used for revenue-generating operations.
In view of the foregoing, it would be desirable to provide methods and apparatus for reducing the number of color samples that must be printed when profiling a color output device.
It further would be desirable to provide methods and apparatus for reducing the time required to profile a color output device.
It also would be desirable to provide methods and apparatus for reducing the risk of measurement error while profiling a color output device.
It additionally would be desirable to provide methods and apparatus for reducing the size of a test chart that must be printed while profiling a color output device.

Methods and apparatus for profiling color output devices


A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

1. Field of the Invention
The present invention is generally related to plating systems, and more in particular, continuous plating systems.
2. Description of the Related Art
Conventional approaches for plating metals onto portions of targeted parts can involve either a generally more precise step-and-repeat plating for plating selective locations or a generally faster continuous strip plating for plating portions of parts whose intended plating areas can be arranged in an uninterrupted path. Such targeted parts can be found joined together in a lead frame. A lead frame can be formed as a long continuous strip containing duplicate copies of a particular part. The lead frame can be fed through machines to perform various physical manipulations on each of the parts of the lead frame in an orderly stepwise fashion so that each of the parts has its turn to undergo each of the physical manipulations performed by the machines.
With the conventional step-and-repeat plating process, a precise mask of finite length is positioned over a section of a lead frame having a series of parts. The mask has various openings so that for each part of the masked lead frame section, those portions of the part that are to be plated remains unmasked. The unmasked portions of the parts of the masked lead frame section are subsequently exposed to a plating solution to accomplish their plating.
The lead frame is typically negatively charged to plate those exposed areas of the lead frame when they receive plating solution such as by pouring, spraying, or brushing the solution from a positively charged applicator, such as a nozzle. After the unmasked portions of the parts of the masked lead frame section have been plated, a new section of the lead frame is moved to be masked and to further repeat the step-and-repeat process.
Some implementations of the step-and-repeat process involve perforated tape masks that are each used for a portion of the lead frame and are subsequently removed and discarded after plating of the respective portion of the lead frame is accomplished. Although the step-and-repeat process can be used for precision plating so that relatively little plating material is wasted, the process can be inherently slow and labor intensive.
With a conventional continuous plating system, the lead frames can be run at constant velocity through the plating system therefore potentially reducing labor requirements and potentially increasing throughput. Conventional continuous plating systems include a de-reeler, welding apparatus, tanks, guide devices, masking belt and a re-reeler. The de-reeler feeds the lead frame from a first reel into the plating system. The welding apparatus includes a spot welder and a welding fixture to attach subsequent reels of lead frames to be fed into the plating system.
The tanks includes a series of cleaning, plating and washing tanks to electroplate nickel, gold or other precious metals on to portions of the parts of the lead frame. The guide devices are fashioned to direct the lead frame through the tanks while trapping the parts between the moving masking belts. The masking belt exposes one or more portions of each part of the lead frame through one or more openings in the masking belt to plating solution to be plated and covers other portions of each part to prevent those portions from being plated.
The re-reeler spools the plated parts onto a second reel as the parts emerge from the plating system. Within reason, the longer the portion of the lead frame that can be exposed to the plating solution at any one time, the faster the lead frame can be run through the continuous plating system and consequently, the faster the throughput of the continuous plating system.
Although conventional continuous plating systems can have relatively faster throughput than the conventional step-and-repeat plating systems, there is a price for this faster throughput with conventional continuous plating systems. Namely, conventional continuous plating systems tend to be more wasteful of the plating materials.
A problem exists with conventional continuous plating systems in that the masking belt typically shifts back and forth in position orthogonal to its direction of motion, also referred to as trans-linear motion. This trans-linear motion causes a shift back and forth in position of each of the openings in the masking belt relative to its associated lead frame part to be masked. The trans-linear back and forth shifting of position of the opening thus creates uncertainty as to where the opening will be positioned with respect to the particular lead frame part at the point when plating of the part occurs.
Consequently, if the opening was only as large as its corresponding desired portion of the part to receive plating, this desired portion of the part may not be fully plated. Through the trans-linear shifting, the opening may not be properly positioned over the part at the time of plating. Rather, the opening may be somewhat out of position and if the opening was only the size of the desired portion of the part to be plated, not all of the desired portion of the part would be exposed through the opening to receive the plating solution.
Thus, to compensate for this shifting due to the trans-linear motion, each of the openings are enlarged enough so that no matter where an opening is in its back and forth trans-linear motion, all of the desired portion of the part to be plated is still exposed through the opening to receive the plating solution. This compensation, however, has a price. Since the opening in the masking belt is larger than the desired portion of the part to be plated, areas of the part that do not require plating will be resident in the area of the opening and will be plated, which wastes the plating metal.
This enlargement of the opening larger than the desired portion of the part to be plated is referred to as over-plating. With some conventional implementations of continuous plating systems an over-plating of 0.06 inches on either side of the desired portion of the part to be plated is not an unusual value.
Some conventional implementations of the continuous plating system may try to use masking belts of relatively greater thickness to possibly reduce the amount of trans-linear motion. A drawback of increased masking belt thickness is a result referred to as a wall effect in which the mask thickness inhibits the thickness of the plating near the edge of the opening. The combination of an opening of the belt mask with one of the lead frame parts forms a sort of canyon with the part acting as sort of the floor of the canyon and the edges of the opening acting somewhat like vertical walls of the canyon.
As the lead frame part is pressed with the mask belt and is moved through the tank of plating solution, the plating solution enters the so called canyon, but interaction of the plating solution with the walls of the canyon somewhat hinders the plating solution from depositing plating material to as great an extent on the floor of the canyon (a portion of a part of the lead frame) near the walls of the canyon (edges of the opening) when compared to the amount of plating material deposited farther away from the walls.
As a result, the plating material on a plated portion of a part has an uneven thickness, being thinner near the edges of the plated portion and being thicker near the center of the plated portion. Generally speaking, the thicker the belt mask, the larger the difference in thickness is between the edges and the center of a given plated portion. Resultant uneven plating can also waste plating material because more plating material may need to be used in a center of a plated portion in order to have a sufficient amount of plating material near the edges of the plated portion.
The cost of plating precious metals is primarily determined by the amount of gold or other precious metal used and the throughput speed involved. The two conventional approaches discussed raise costs by either being relatively slow and labor intensive, or by being relatively wasteful of plating material.

Continuous plating system and method with mask registration


A high capacity food processing system, including for an elongated strand of food product such as hot dogs, sausage links, etc., has first and second loading stations with serial accumulators enabling intermittent stopping of the loading operation, which is a necessary and normal part of use, without disrupting a downstream thermal process, and enabling differential conveyor velocities through the loading stations, including a loading velocity for loading food product on the conveyor, a bypass velocity during intermittent non-loaded conveyor segments, and a transport velocity through the processing station, wherein the transport velocity is less than the bypass velocity and greater than the loading velocity, and where the transport velocity remains constant and the same during both of the loading and bypass velocities of the conveyor at the loading stations and also remains constant and the same during stopped movement of the conveyor at the loading stations.

The invention relates to food processing systems for processing a food product including an elongated strand of food product in a casing having tubular segments serially joined by pinched connection segments, e.g. hot dogs, sausage links, etc.
The invention arose during continuing development efforts directed toward subject matter such as shown in U.S. Pat. Nos. 6,056,636, 6,086,469, and 6,523,462, all incorporated herein by reference. In such systems, strands of sausage are made on high speed machines by extruding meat emulsion into an elongated casing. The meat-filled casing is then twisted to create sausage links. The link strand is then discharged from the sausage making machine. Loops of sausage comprising a plurality of links are deposited on moving hooks of a conveyor chain. The ultimate length of a given strand is determined by the length of the casing being filled. When a casing has been filled, the sausage making machine is stopped; the casing is tied off or closed to prevent any meat emulsion from exiting the rearmost end of the casing; a new casing is then placed in position to be filled; the machine is re-started and the cycle repeats itself. The linked and looped sausage strand or strands are periodically removed from the conveyor chain or otherwise transported to a food processing station which cooks, smokes, chills and/or otherwise treats the sausage strand before packaging for final delivery to the consumer. Any inefficiency in the process translates into increased cost of production which is reflected in the price of the products to the consumer.
The present invention is directed to improvements in the above noted system including providing higher capacity and other manufacturing efficiencies.
The above noted system is accomplished with a single sausage casing stuffing and linking machine and loading station for the conveyor. A first significant function of the loading apparatus is to properly present the sequence of conveyor chain hooks to the stuffing/linking machine so as to produce a stuffed and linked casing of finite length which is consistently and uniformly draped over the series of hooks, for example, as set forth in noted incorporated U.S. Pat. 6,523,462. A second significant function of the loading apparatus is to allow for constant velocity movement of the conveyor chain from the loading apparatus through the thermal processing portion of the system while permitting intermittent stopping of the conveyor chain at the stuffing/linking device at the loading station, for example as set forth in incorporated U.S. Pat. No. 6,086,469.
In one aspect of the present invention, both of the above noted functions of the loading apparatus are preserved, while incorporating a second sausage stuffing/linking machine and a second loading station. The addition of a second stuffing/linking machine increases the conveyor processing system production capacity. The conveyor travels at a higher speed proportional to the increased production rate. The present system allows for non-synchronized intermittent and differential conveyor chain velocity at the two stuffing/linking devices.
In one embodiment, the system provides first and second loading stations, and first and second buffers receiving the outputs of the first and second loading stations, respectively. The first buffer includes first and second, input and output, conveyor chain accumulators, and the second buffer includes third and fourth, input and output, conveyor chain accumulators. The exit of the third accumulator from the second buffer is not routed to the second loading station, but rather to the first accumulator of the first buffer. The conveyor chain travels serially from the thermal processing station to the third accumulator of the second buffer then to the first accumulator of the first buffer then to the first loading station then to the second accumulator of the first buffer then to the second loading station then to the fourth accumulator of the second buffer then returns to the thermal processing station. A first segment of the chain is loaded with food product at the first loading station, and then a second trailing segment of the chain is indexed past the first loading station at a high rate of speed without product loading. The second loading station loads the empty segments of the conveyor chain not loaded by the first loading station, and then advances the chain at a higher velocity past the segments already containing food product loaded from the first station. The accumulators allow for independent starting, stopping and differential chain velocities at the loading stations, while maintaining constant and uninterrupted chain velocity through the thermal processing station. Periodically stopping the stuffing/linking device at the loading station is a necessary and normal part of its use. Increased food product capacity per conveyor chain length is achieved because two stuffer/linker machines are simultaneously loading on a single conveyor chain. To enable higher speed indexing and advancement of the chain, the loading stations are equipped with retractable lift cams which lift the hooks to an upwardly pivoted position for food product loading, and which retract to allow the hooks to remain in a downwardly depending non-cammed position to facilitate faster movement through the loading station during high speed indexing of the chain.
In another embodiment, the accumulators of the first buffer are synchronized with the accumulators of the second buffer to allow loading from only one of the loading stations, where less capacity is needed, or where a single stuffing/linking machine can keep up the production rate for the particular product in the current run, or where one of the stuffing/linking machines is shut down for maintenance or the like. In the preferred embodiment, with both stuffing/lining machines operating, the production rate is greater than that of a single loader system.


The systems and methods described herein include, among other things, processes for providing low latency packet transport in ad hoc networks. To this end, the systems, in certain embodiments, employ an architecture for communication nodes in MANETs, in which the delay introduced in “routing” or “relaying” the packet is reduced. In these systems invention, the data plane of the OSI stack at relay nodes is collapsed so that bits entering the node are re-energized “on-the-fly”, with only a brief pause. A transit key in each packet, inserted by the originator of the packet, is used to index into a transit table to determine one of three actions to perform—drop, keep, or retransmit the packet. A control plane determines, for each packet, whether it should be re-energized or not. The control algorithm ensures that only nodes along the path from the source to the destination re-energize (relay) the packet.

An ad hoc wireless network is one in which a packet may travel multiple wireless hops to reach its destination. It consists of a set of nodes or stations that autonomously discover each other, self-organize, and establish peer-to-peer communications without the presence of a centralized controller or fixed infrastructure. In the most common form of ad hoc networks, each node is potentially a wireless router of packets originated by itself or other nodes. Ad hoc wireless networks may be mobile or stationary. Other terms commonly used for multi-hop wireless networks include multihop networks, packet radio networks, and mesh networks, the last term is typically used only for stationary networks.
Ad hoc networks require different technology and algorithms from conventional wireless networks, e.g., cellular telephony systems. In cellular systems, the base stations provide network access to the handsets, which only need to go over one wireless "hop," rather than the multiple hops used in ad hoc networks. Furthermore, the base stations themselves do not move in cellular systems, so they can have very reliable, long-term interconnections such as point-to-point microwave or fiber links. In ad hoc networks, by contrast, there is no fixed infrastructure and, in the most general case, everything is moving.
Data communications in today's Mobile Ad hoc Networks (MANETs) is almost universally architected based on the layering concept. As shown in FIG. 1, at each relay node, a packet goes "up" three layers and then "down" three layers, with a number of processing and queueing steps along the way. Crucially, the packet has to re-contend for access to the shared channel at every single node along the way to the destination. This operational regime fundamentally limits the performance, chiefly the latency, and energy efficiency, of current ad hoc networks. These limitations on performance impact the quality of service provided by ad hoc networks and therefore limits their application as solutions for communication problems. Moreover, this regime creates a bottleneck that prevents technological advances in protocols and waveforms from translating into bottom-line end-to-end performance.
Latency has been a data communication issue for decades. Circuit switched communication networks have grappled with this problem for years, particularly in the context of providing the necessary quality of service needed for voice communications. Latency has also been a problem for packet switched networks. To address packet latency issues, scientists and engineers have developed cut through forwarding techniques that can reduce latency and increase quality. Similarly, wormhole routing techniques have been developed that reduce the processing needed to forward a data packet and therefore reduce latency. However, these techniques for wireline networks do not require the medium access arbitration that is required in a wireless ad hoc network. Moreover, wireline techniques do not need to decode wireless signals during the forwarding process and therefore avoid, at least largely, the latency delays arising from wireless signal processing.
Latency is a particularly severe problem for wireless ad hoc networks, because all the nodes in the network must contend for access to a shared RF medium. To date most wireless ad hoc networks have used a form of channel access protocol similar to that mandated by the IEEE 802.11 standard, in which a transmitting node first sends a Request to Send (RTS) signal, an intended receiving node then replies with a Clear to Send (CTS) signal if the transmission may proceed, and if so, the transmitting node then sends a data frame, followed up by an acknowledgement (ACK) from the receiving node if it was correctly received. This channel access protocol has numerous defects when used in an ad hoc network, e.g., the guard times needed for the transmission propagation may take a significant fraction of the time used for actual communication (or even more), multiple RTS/CTS interactions may need to take place before a data frame can actually be transmitted, and so forth. As a result, the delay for sending a single packet across multiple hops may be both variable and unacceptably high.
These problems exist in both stationary ad hoc networks and mobile ad hoc networks. In stationary ad hoc networks, channel access can be an issue because traffic patterns may change across the network as users transmit files, cease for a few minutes, then inspect web pages, etc. In short, bursty and unpredictable user traffic causes channel access issues for stationary ad hoc networks, which in turn causes unacceptably high delay (latency) for delivering such traffic. The problems are even worse in mobile ad hoc networks, where the hop-by-hop paths through the network change unpredictably even as these bursty traffic flows must be accommodated.
There therefore exists a need in the art for a transport process that provides reduced latency for a wireless ad hoc network.

Ultra-low latency packet transport in ad hoc networks


A glass body manufacturing apparatus includes: a first heating furnace including a furnace core tube accommodating the soot and a first heater, to supply a dehydration gas into the furnace core tube and heat the soot at a first treatment temperature lower than a softening point of the porous portion by the first heater; a second heating furnace including a structural body accommodating the soot and a second heater, to heat the soot at a second treatment temperature equal to or higher than the softening point by the second heater; and a conveyance container, connectable to each of the first and second heating furnaces while keeping airtightness with respect to the atmosphere, to accommodate and hold the soot, and convey the soot between the first and second heating furnaces.

The present disclosure relates to a glass body manufacturing apparatus, a glass body manufacturing method, a soot conveying mechanism, and a soot heating mechanism.
Silica glass optical fibers are typically manufactured by drawing an optical fiber preform that is a glass body made of silica-based glass. To manufacture the optical fiber preform, for example, an outside vapor-phase deposition (OVD) method is used. When the OVD method is used, a soot is fabricated by depositing silica glass particles around the outer periphery of a target rod made of silica-based glass to form a porous portion in layers. The soot is then given a so-called dehydration treatment in which the soot is heated under a dehydration gas atmosphere in order to remove a hydroxyl group contained in the porous portion. The dehydration treatment is performed at a temperature lower than the softening point of the silica glass forming the soot. Subsequently, the soot is given a vitrification treatment in which the soot is heated at a temperature equal to or higher than the softening point. This removes holes existing within the porous portion, thereby converting the porous portion into transparent glass (appropriately referred to as transparent vitrification below).
The dehydration treatment and the vitrification treatment are performed in the same heating furnace or different heating furnaces. Additionally, the heating furnace typically includes a furnace core tube made of silica glass (see, for example, Japanese Laid-open Patent Publication No. 2004-345869 and Japanese Laid-open Patent Publication No. 2007-153708).

Glass body manufacturing apparatus, glass body manufacturing method, soot conveying mechanism, and soot heating mechanism