Data flow node validation and provisioning techniques are described. In one or more implementations, a system is described that supports visual design and deployment of data flow pipelines to process streaming data flows. The system may be configured to include nodes and connections between the nodes to represent an arbitrary execution graph of data science algorithms (as algorithm action components) that are used to process the streaming data flows. The system may also support validation techniques to verify that the data flow pipeline may operate as intended. Further, the system may also support implementation and provisioning techniques that involve estimation and adjustment of runtime resource provisioning of a deployed data flow pipeline without preemption or starvation occurring for nodes within the pipeline.

Vast amounts of data are being made accessible to users that may be processed by data flow pipelines to model the data, discover useful information, may suggest correspondence between different factors represented in the data, and so on. These techniques are commonly referred to as data analytics, "big data," data mining, and so forth.
Conventional techniques to design and implement data flow pipelines, however, required specialized knowledge of highly-trained technicians. Further, these conventional techniques may involve a significant amount of time to perform even by a technician having this specialized knowledge, which may be due to the complexity both in designing a data flow pipeline that may be functional as well as provisioning the data flow pipeline for actual implementation. Thus, these conventional techniques could hinder user access to this functionality, both in the knowledge needed to design the data flow pipeline as well as the time required to do so.


The present technology relates to techniques of preventing intrusion of moisture into a chip.

In recent years, imaging devices in which a plurality of charge coupled device (CCD) sensors or a plurality of complementary metal-oxide semiconductor (CMOS) sensors are arranged in a two-dimensional form have been used in digital video cameras, digital still cameras, or the like.
In a CMOS image sensor, a global shutter structure with a structure of temporarily holding signals in a memory is employed as one of methods of implementing simultaneous charge accumulation. The global shutter structure is configured such that a memory is arranged in a pixel, charges accumulated in light receiving units are collectively transferred to memories in all pixels, and the charges are held until a read operation is performed in units of rows, so that all pixels have the same light exposure time (see Patent Literatures 1 and 2).

Image sensor having improved dicing properties

Abstract: Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.


A wire spooling system for spooling and dispensing wire. The wire spooling system includes a first spool member, having a tubular member with a locking cap and first collar, and a second spool member, having an engagement aperture and second collar. The tubular member extends through the first spool member substantially transverse to the first spool member. The locking cap is positioned at the end of the tubular member opposite the first spool member. The first collar protrudes from the first spool member in the same plane and direction as the tubular member. The second collar protrudes from the second spool member and fits within the first collar. The spool members thereby form a spool shape. Upon fitting the second collar within the first collar, the engagement aperture receives the locking cap of the tubular member, securing the first spool member and second spool member in a locked position.

1. Field of the Invention
The present invention relates generally to wire dispensing spool devices and more specifically it relates to a wire spooling system for efficiently spooling and dispensing previously unspooled wire.
2. Description of the Related Art
Wire dispensing spool devices have been in use for years. Typically, wire spools were only sold in large sizes with gigantic amounts of wire wound around the spool. These types of spools of wire were only usable with large equipment and were difficult to effectively manage and transport.
More recently, wire spools came in smaller portions that were more manageable for smaller companies' needs for spooled wire. The smaller spools and lessened amounts of wire have proved a great help to smaller contractors and electricians. However, a main existing problem was that there were certain types of wire that still only came on a spool in gigantic quantities. These types of wire were still difficult to manage and required heavy machinery move around.
Additionally, unspooled wire that was sold in smaller quantities required a user to unravel the wire from the inside out. This caused twisting of the wire thereby reducing its quality.
In these respects, the wire spooling system according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in so doing provides an apparatus primarily developed for the purpose of efficiently spooling and dispensing previously unspooled wire.


Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a light emitting structure layer comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and an electrode comprising a pad part and a finger part on the light emitting structure layer. The pad part comprises a pattern in which at least one opening is defined, and the finger part comprises a pattern electrically connected to the pad part and linearly extending from the pad part.

Embodiments relate to a light emitting device, a light emitting device package, and a lighting system.
Light emitting diodes (LED) are semiconductor devices that convert current into light.
A wavelength of light emitted from the respective LEDs is varied according to a semiconductor material used for manufacturing the LED. This is done because a wavelength of the emitted light depends on a band-gap of semiconductor material. The respective band-gaps represent an energy difference between a valence band electrons and conduction band electrons.
As luminance of LEDs is increased recently, the LEDs are being used as light sources for displays, vehicles, and illuminations. Also, LEDs emitting highly efficient white light may be realized by using a fluorescent substance or combining LEDs having various colors.

Light emitting device, light emitting device and package, and lighting system


A device and method for testing a rock specimen in order to determine the fracture toughness (KIC) thereof. The device comprises: a frame; a hydraulic pressure testing rig supported by the frame and comprising a pressure gauge, a lever and a pressure diaphragm; a storage tank for storing hydraulic fluid and supported by the frame; and a pressure chamber supported by the frame, in which the test specimen is placed to be subjected to hydrostatic pressure through conduits that connect said pressure chamber with the storage tank in fluid communication.

Shale reservoirs are the most abundant of sedimentary rock types, making up 50% to 80% of sedimentary material worldwide, thus, they are extremely important in a variety of Earth-related topics, including hydrocarbon resources.
The exploration and production of shales steadily increased the quality, quantity and complexity of data used for evaluation and decision making. These considerations allowed for drilling and completion cost reduction, design optimization (e.g., vertical to horizontal wells), productivity enhancement, etc. This improved understanding of shale reservoirs, along with an extensive use of available data, provides a driving force for new experimental methods and associated data analyses.
The successful stimulation of shale reservoirs depends on the availability of important parameters and knowledge on how they affect the outcome of the fracturing treatment and ulterior productivity of drilled wells. The in-situ stress field, pore pressure, fracturing fluid pressure, and the mechanical properties of the rock are of primal importance.
Among the mechanical properties, quantification of the resistance to cracking is needed. From linear elastic fracture mechanics of brittle materials, it is known that the fracture toughness (KIC) is one such material property. Fracture toughness is an important parameter influencing hydraulic fracture propagation, in particular for low stress contrasts, low fluid viscosity, and small fractures.
The mechanical properties of a reservoir can be analyzed with different levels of complexity. Fracture properties are generally among the most difficult to determine, and often empirical, qualitative parameters are used to characterize them. Various "brittleness indexes" have been developed for this purpose. However, it is known that these parameters have great limitations to adequately evaluate fracture toughness (KIC).
Fracture toughness data on shales are sparse, and they show significant scatter. The microstructure of shales makes material recovery, preservation, and sample manufacture very difficult, while hindering consistent and reproducible experiments. Moreover, fracture toughness is a physically meaningful parameter, as opposed to the phenomenological frackability or brittleness indexes. These indexes are usually regarded as containing limited value, and they often provide opposite conclusions to each other.
It is well known that well conditions (pressure, temperature) have a significant effect on the rock resistance to failure. The combination of these factors leads to the importance of a comprehensive knowledge of fractomechanical behavior (e.g., in terms of fracture toughness) under reservoir and environmental conditions.
U.S. Pat. No. 4,152,941 A, in the name of Terra Tek Inc., describes a method for determining fracture toughness in a rock. The method and device used do not consider the use of controlled temperature.
Consequently, there is a need to provide a device and a method for testing a rock that has low permeability and requires hydraulic stimulation for its exploitation, wherein said test allows obtaining the fracture toughness of the rock in a simple way, as well as the effect of confinement on the toughness. The obtained value of fracture toughness allows to approach the value of fracture toughness under reservoir pressure.

Device and method for the determination of rock fracture toughness of a reservoir and the effect of confinement on the fracture toughness

CONSEJO NACIONAL DE INVESTIGACIONES CIENTÍFICAS Y TÉCNICAS (CONICET)


A disclosed gaming machine provides a thermal management system comprised of fans, vents and a particular configuration of thermal sources (e.g. CPU, power supply, monitor) and gaming machine components (e.g. printer, coin hopper, etc.). For a given component packaging scheme within the gaming machine cabinet, the thermal management system uses natural convention and a system of fans to cool the gaming machine cabinet by pulling air over the thermal sources and directing the air towards the top of the gaming machine. The pulling action of the fans helps to maintain laminar flow within the gaming machine cabinet which reduces heat transfer with the gaming machine cabinet. Additionally, the fans are configured to prevent dust accumulation on sensitive components such as the CPU and other electronics and to minimize the noise level outside of the gaming machine.

This invention relates to game playing methods for gaming machines such as slot machines and video poker machines. More particularly, the present invention relates to thermal management systems for gaming machines.
There are a wide variety of devices that can comprise a gaming machine such as a slot machine or video poker machine. Some examples of these devices are lights, slot reels, ticket printers, card readers, speakers, bill validators, coin acceptors, display panels, key pads, bonus wheels, and button pads. These devices provide many of the features which allow a gaming machine to present a game. Some of these devices are built into the gaming machine. Often, a number of devices are grouped together in a separate box that is placed on top of the gaming machine. Devices of this type are commonly called a top box.
Typically, utilizing a master gaming controller, the gaming machine controls various combinations of devices that allow a player to play a game on the gaming machine and also encourage game play on the gaming machine. For example, a game played on a gaming machine usually requires a player to input money or indicia of credit into the gaming machine, indicate a wager amount, and initiate a game play. These steps require the gaming machine to control input devices including bill validators and coin acceptors to accept money into the gaming machine and recognize user inputs from devices including key pads and button pads to determine the wager amount and initiate game play.
As technology in the gaming industry progresses, the traditional mechanically driven reel slot machines are being replaced with electronic counterparts having CRT, LCD video displays or the like. These video/electronic gaming advancements enable the operation of more complex games, which would not otherwise be possible on mechanical-driven gaming machines. For example, in addition to reel slot machines, it is now common to observe stand-alone or multiple platform video electronic games including Keno, Blackjack, Poker, Pai Gow, or slots in even the smallest gaming establishments.
Typically, video/electronic gaming machines utilize numerous internal electrical components including, for example, a power supply, a monitor, a communication board, a sound system, a printer and a CPU. During extensive use, and due to the fact that many of these game devices are always xe2x80x9conxe2x80x9d even when not being played, many of the internal electrical components require thermal management to prevent premature component failure. For example, CPUs typically generate a significant amount of heat but only operate properly within a specified temperature range. Thus, most CPUs require a thermal management system of some type to prevent the CPU from overheating and failing.
Within the gaming industry, the space occupied by a gaming machine is a critical commodity. While the functionality of gaming machines has increased via the introduction of new technology, the space and volume allotted to gaming machines has not increased. Thus, within the relatively constant volume offered by the gaming machine cabinet, newer electronic gaming devices such as printers, monitors and card readers must be packaged with older gaming devices such as coin hoppers, coin acceptors, and lock boxes which are still needed by the gaming machine.
With the limited space within the gaming machine cabinet and the addition of electronic components requiring thermal management, packaging to provide both functionality and thermal management is becoming an important issue within the gaming industry. Traditionally, thermal management within gaming machine cabinets has been provided by taking advantage of natural convection. With vents near the top and the bottom of the gaming machine cabinets, internally generated hot air is convected naturally towards the top of the gaming machine where it may be expelled out the top vent. Cool air is naturally drawn into to the gaming machine through the bottom vent. When necessary, this process may be aided by fans within the gaming machine. With mostly mechanical components that tend to be fairly heat tolerant, this simple process is adequate to provide thermal management for a gaming machine.
In modern gaming machines, natural convection is still utilized as part of the gaming machine thermal management system. However, with many heat sensitive electrical components, thermal management requires careful packaging and flow path analysis to ensure that local hot spots do not develop within the gaming machine cabinet that may cause an electrical component failure. For example, an electronic board is typically mounted to the back cabinet of the gaming machine. When a local hot spot develops in the back of the cabinet near the electronic board as the result of poor air circulation, the portion of the electronic board near the hot spot may fail. To improve circulation within the gaming machine cabinet and prevent local hot spots, fans are often placed within the gaming machine cabinet. Once a packaging scheme has been developed for the components within gaming machine cabinet, the fans must be carefully located to achieve the desired circulation patterns within the gaming machine cabinet. Often, the placement of fans and the development of a packaging scheme is an iterative process. Further, space limitations typically require the fans to be small and noise limitations require the fans to be quiet.
Another problem associated with gaming machine thermal management is that internal particulates and contaminates can often be passed from one internal component to another internal component due to the common circulation of the air. For example, within the gaming machine cabinet, there is often an accumulation of coin dust and other particulates generated from the action of coins with the coin hopper. This dust often consists of metallic particles such as nickel and copper from the coins, and carbon steel from the hopper. As a result, this conductive dust complicates the cooling of internal components. More particularly, fans may circulate the coin dust from within the gaming machine and then distribute and deposit it onto the components being cooled, as well as other internal components which do not require cooling. Such deposition of these conductive particulates may compromise the operation of sensitive components within the gaming machine, and may even cause shorting of circuitry. Thus, dust management is also considered in the thermal management system developmental process.
In view of the above, it would be desirable to provide thermal management systems for modern electronic gaming machines which overcome the limitations associated with electronic component heat and dust sensitivity in a gaming machine cabinet with significant space and volume restrictions.
This invention addresses the needs indicated above by providing a gaming machine with a thermal management system comprised of fans, vents and a particular configuration of thermal sources (e.g. CPU, power supply, monitor) and gaming machine components (e.g. printer, coin hopper, etc.). For a given component packaging scheme with the gaming machine cabinet, the thermal management system uses natural convection and a system of fans to cool the gaming machine cabinet by pulling air over the thermal sources and directing the air towards the top of the gaming machine. The pulling action of the fans helps to maintain laminar flow within the gaming machine cabinet which reduces heat build up within the gaming machine cabinet. Additionally, the fans are orientated to prevent dust accumulation on sensitive components such as the CPU and other electronics and to minimize the noise level outside of the gaming machine.
One aspect of the present invention provides a thermal management system for a gaming machine. The thermal management system can be generally characterized as including 1) a gaming machine cabinet with a front, a back opposite the front, a first side connecting the back and the front, a second side connecting the back and the front, a top and a bottom (there may be a sub-enclosure within the main cabinet), 2) one or more vents in the gaming machine cabinet where the one or more vents allow air from outside the gaming machine to enter the main cabinet enclosure and cool the gaming machine, 3) a monitor mounted within the gaming machine and viewable to a player facing the front of the gaming machine and allows a player to play a game on the gaming machine, 4) a power supply box connected to a motherboard mounted on the back of the gaming machine cabinet, 5) a CPU box connected to or containing the motherboard and a CPU and mounted to the cabinet via a CPU enclosure, 6) a first fan mounted to the power supply where the first fan pulls air through the power supply and thereby cools the power supply, 7) a second fan mounted to the CPU enclosure where the second fan pulls air through the CPU box and thereby cools the CPU box, and 8) a third fan mounted on the top of the gaming machine wherein the third fan pulls hot air rising from the monitor, the CPU and the power supply from the gaming machine cabinet and vents the hot air outside the gaming machine cabinet and thereby cools the gaming machine cabinet. The gaming machine may be a slant top gaming machine or upright gaming machine which provides one or more games such as a video slot game, a video poker game, video pai gow, video keno and video black jack. The fans may each pull a volume of air per unit of time within a specified range, may emit noise within a specified range and may have a diameter within a specified range. In a specific embodiment, the thermal management system may include a monitor shelf, which at least partially supports the monitor. When present, the monitor shelf defines a top side of the sub-assembly. The monitor shelf may contain one or more holes.
In preferred embodiments, the CPU box which is mounted on the CPU enclosure includes an inlet CPU box vent where the inlet CPU box vent is on a first side of the CPU box and an outlet CPU box vent where the outlet CPU box vent is on a second side of the CPU box opposite the first side of the CPU box. Typically, air is pulled into the CPU box inlet and across the CPU box to the outlet CPU box vent by the second fan. The air pulled through the CPU box cools a CPU mounted within the CPU box and prevents dust from within the main cabinet enclosure from entering the CPU box.
In preferred embodiments, air is typically drawn from outside the gaming machine cabinet through one or more of the main cabinet vents. The main cabinet vents may utilize louvered vent covers. One of the main cabinet vents may be near the inlet CPU box vent or near a power supply box inlet vent. The power supply box may additionally contain an outlet power supply vent on a second side opposite the side with the power supply box inlet vent. The first fan, which is mounted on the second side of the power supply box, pulls air into the power supply through the inlet power supply vent, through the power supply box and out the outlet power supply vent.
Another aspect of the invention provides a gaming machine where the gaming machine may be characterized as including 1) a gaming machine cabinet, 2) a monitor mounted within the gaming machine cabinet, 3) a CPU mounted near a first side of the gaming machine cabinet, 4) a power supply for the gaming machine mounted near the first side of the gaming machine cabinet, 5) a coin hopper mounted in the gaming machine cabinet, 6) a first fan mounted near the CPU and orientated to pull air over the CPU and push air toward the hopper and 7) a second fan mounted near the power supply and orientated to pull air over the power supply and toward the coin hopper. The power supply, the coin hopper and the CPU may be located below the monitor such that the orientations of the first and second fans with respect to one or more walls of the gaming machine cabinet cause air to flow upward within the gaming machine cabinet and cool the monitor.
In specific embodiments, one or more vents may be located on a first side of the gaming machine cabinet near the CPU and near the power supply. The gaming machine may include a power supply box having vents that encloses the power supply where the second fan is mounted on the power supply box. Also, the gaming machine may include a CPU enclosure having vents and supports a CPU box, which encloses the CPU where the first fan is mounted on the CPU enclosure.
Another aspect of the invention provides method of cooling a gaming machine having a monitor, a CPU and a power supply mounted in a gaming machine cabinet. The method may be characterized as including the following sequence: 1) drawing air into the gaming machine cabinet, 2) pulling air over the CPU, power supply and monitor; and 3) venting air out the top of the gaming machine cabinet. In this method, the air is drawn into the gaming machine through one or more vents on a side of the gaming machine cabinet that is near to one or both of the CPU and power supply. The air is drawn over the power supply and CPU and then upward by the monitor and then exits through the top of the gaming machine cabinet. The gaming machine may include a coin hopper that generates coin dust such that the air drawn into the cabinet directs coin dust away from the CPU.
These and other features of the present invention will be presented in more detail in the following detailed description of the invention and the associated figures.

Thermal management system for a gaming machine


A filtering technique which makes it possible to easily and appropriately eliminate a noise without increasing a scale of a circuit necessary for a filtering process even if a noise frequency is liable to be changed is provided. A filter coefficient calculator (6) of a weight measurement apparatus calculates filter coefficients using a predetermined arithmetic expression and outputs them to a signal processor (5). The signal processor (5) carries out a filtering process on a weighing signal (Ds) using the filter coefficients. The arithmetic expression includes a parameter specifying a band position of an attenuation band where attenuation must be locally enhanced. A user can input a value of the parameter via a data entry part (7). In this manner, the filter coefficients can be changed by using a parameter specifying the band position of the attenuation band which is physical and thus easy to grasp. Accordingly, it is possible to easily move the attenuation band, and thus noise can be eliminated easily and appropriately.

1. Field of the Invention
The present invention relates to a filtering technique carried out by using a digital filter.
2. Description of the Background Art
A weight measurement apparatus for measuring a weight of an article typically employs a weight sensor such as a strain gauge load cell or a force balance. The weight sensor has a natural frequency which is subject to a total weight of a weight of an article and a tare thereof. When external vibration at frequencies in a band including the natural frequency acts upon a weight measurement system, external vibration at a frequency close to the natural frequency is amplified, to work as a vibration noise, which then emerges in a weighing signal output from the weight sensor. It is noted that such a vibration noise will be hereinafter referred to as a "natural frequency noise" throughout the present specification.
Also, in measuring a load of a transfer system, a noise caused due to vibration of a rotation system such as a motor for driving a conveyor belt or a transfer roller, or an electrical noise associated with a commercial power supply, works as a vibration noise which is superimposed on a weighing signal.
A weight measurement apparatus developed in recent days has employed a digital filter for eliminating such a vibration noise as described above which is contained in a weighing signal. A digital filter is relatively impervious to influence of aging or an environment, and filtering characteristics thereof can be relatively easily altered. Among various types of digital filters, a finite impulse response (FIR) filter has been preferably employed in view of its excellent stability.
As described above, a natural frequency of a weight sensor is subject to an article weight and a tare. Thus, if an article weight or a tare is changed, it results in change in a frequency of a natural frequency noise associated with the weight sensor. Formerly, change in frequency of a natural frequency noise caused due to change in article weight was negligible because a tare, e.g., a weight of a conveyor, was dominant. However, in recent days, there has been arisen a demand for accurate measurement of a weight of a light article, which involves reduction of a tare. For this reason, such change in frequency of a natural frequency noise caused due to change in article weight has become too significant to neglect. On the other hand, a frequency of a vibration noise associated with a motor or a transfer roller is changed in accordance with specifications of a transfer system such as a transfer speed, for example. Hence, it is desired to achieve a digital filter which is capable of surely eliminating a vibration noise in spite of change in frequency of the vibration noise which occurs due to change in type or size of an article under measurement, or change in specifications of a transfer system.
In accordance with the conventional practices, a digital filter formed of multistage moving average filters is employed in order to surely eliminate a vibration noise contained in a weighing signal, as taught in Japanese Patent No. 6-21814 (hereinafter referred to as "JP 6-21814").
More specifically, JP 6-21814 teaches a method in which respective moving average values of the multistage moving average filters are differentiated from one another to provide a plurality of notches in a frequency range within which a frequency of a vibration noise would be changed, thereby surely eliminating the vibration noise.
Additionally, an example of a method of designing an FIR filter is described in "Design of FIR Transmitter and Receiver Filters for Data Communication System" by Naoyuki Aikawa et al. in Transaction of IEICE, Vol. J79-A, No. 3, Mar. 1996, pages 608-615, which shows a technique using successive projections method.
According to the method shown in JP 6-21814, a frequency range within which a frequency of a vibration noise would be changed is presumed and the number of stages of the moving average filters is determined in accordance with the frequency range as presumed, in a step of designing a digital filter. As such, in a situation where the frequency of the vibration noise falls outside the presumed frequency range for some reason such as addition of a specification after designing the digital filter, it is required to design a digital filter all over again.
In this regard, to initially design a digital filter which allows for addition of a specification in a weight measurement apparatus requires preparing numerous multistage moving average filters, which results in increase of a circuit scale of the digital filter.
On the other hand, as an alternative to the method taught in JP 6-21814, there has been proposed a method in which a plurality of filter coefficients representing different attenuation characteristics are previously stored. According to this method, each time a frequency of a vibration noise is changed due to change in specifications or the like, one of the stored filter coefficients is retrieved in accordance with a new frequency of the vibration noise after the change, to be used. However, this alternative requires previously storing numerous filter coefficients in order to surely eliminate a vibration noise at a wide range of frequencies, which results in increase of a circuit scale of a memory for storing the filter coefficients.

Weight measurement apparatus, method of eliminating noise and method of designing digital filter


This invention is a Titanium Aluminum alloy consisting essentially of the formula in atomic percent; Ti.sub.Bal. Al.sub.45-48 B.sub.0.01-0.75 Cr.sub.0-2 W .sub.0.25-2.25 Si.sub.0.1-0.7. The Boron is present in an atom. % of 0.01-0.75. The desired range is 0.1-0.5. The preferred range is 0.25+/-0.05. The optimum range is 0.25. The Chromium is present in an atom. % of 0-2. The desired range is 1.3-1.6. The preferred range is 1.5+/-0.1. The optimum range is 1.5. The Tungsten is present in an atom. % of 0.25-2.25. The desired range is 0.3-2.11. The preferred range is 0.75+/-0.05. The optimum range is 0.75. The Silicon is present in an atom. % of 0.1-0.7. The desired range is 0.4-0.6. The preferred range is 0.5+/-0.05. The optimum range is 0.5. The atom. % ratio of Cr/W is 0-5. The desired range is 1.33-2.69. The preferred range is 1.8-2.6. The optimum range is 1.85-2.5. The preferred alloy is a Titanium Aluminum alloy consisting essentially of the formula in atomic percent; Ti.sub.Bal. Al.sub.45.82 B.sub.0.25 Cr.sub.1.42 W.sub.0.70 Si.sub.0.45. The invention is also an article and method of forming said article of the above descibed alloy, for use as an engine component in high temperature and high stress situations. The process for forming the product includes investment casting and then thermomechanical treatment and/or homogenization.

1. Field of the Invention
This invention relates to high temperature alloys for thermal equipment based on intermetallic compounds which are suitable for ordered solidification and to supplement the conventional nickel-based superalloys.
The invention relates to the further development and improvement of the alloys based on an intermetallic compound of the titanium aluminide TiAl type with further additives which increase the strength, the toughness and the ductility.
In the narrower sense, the invention relates to a high temperature alloy for machine components based on doped TiAl.
2. Discussion of Background
Gamma titanium aluminide is an intermetallic compound based on the formula TiAl. Notwithstanding its excellent oxidation resistance, high modulus of elasticity and low density, this intermetallic compound has not seen widespread industrial use in structural applications, due to the relatively low tensile ductility. In general, a minimum of 0.5% elongation is considered marginally acceptable for handling purposes during manufacturing and for actual service conditions.
Intermetallic compounds of titanium with aluminum have some valuable properties which make them appear attractive as structural materials in the medium and higher temperature range. These include, inter alia, their density, which is low compared with superalloys and reaches only about half the value for Ni superalloys. However, their brittleness stands in the way of their industrial applicability in the present form. The former can be improved by additives, in which case higher strength values may also be achieved. Possible intermetallic compounds, some of which have already been introduced, which are known as structural materials are, inter alia, nickel aluminides, nickel silicides and titanium aluminides.
Attempts have already been made to improve the properties of pure TiAl by slight modifications of the Ti/Al atomic ratio and by alloying with other elements. Further elements proposed were, for example, alternatively Cr, B, V, Si, Ta as well as (Ni+Si) and (Ni+Si+B), and also Mn, W, Mo, Nb, Hf. The intention was, on the one hand, to reduce the brittleness, that is to say to increase the ductility and toughness of the material, and, on the other hand, to achieve as high a strength as possible in the temperature range of interest between room temperature and operating temperature. An additional aim was a sufficiently high resistance to oxidation. These aims were, however, only partially achieved.
The high temperature strength of the known aluminides in the meantime still leaves something to be desired. Corresponding to the comparatively low melting point of these materials, the strength, in particular the creep resistance in the upper temperature range, is inadequate, as can also be seen from relevant publications.
U.S. Pat. No. 3,203,794 discloses a TiAl high temperature alloy containing 37% by weight of Al, 1% by weight of Zr and remainder Ti. The comparatively small addition of Zr causes this alloy to have properties comparable to those of pure TiAl.
EP-A1-0,365,598 discloses a high temperature alloy based on TiAl with Si and Nb additives, whereas in EP-A1-0,405,134 a high temperature alloy based on TiAl with Si and Cr additives is proposed.
A series of divisional patents of NAZMY et al., namely U.S. Pat. No. 5,342,577, a division of U.S. Pat. No. 5,286,443, a division of U.S. Pat. No. 5,207,982, discloses three types of doped titanium aluminide alloys. U.S. Pat. No. 5,207,982 focuses on titanium aluminide doped with 0.1-1.5 atom. % Si and 1-8 atom. % W, without B or Cr. U.S. Pat. No. 5,286,443 focuses on titanium aluminide doped with 0.1-1 atom. % B and 1-8 atom. % W and/or Cr, without Si. U.S. Pat. No. 5,342,577 focuses on titanium aluminide doped with 0.1-2 atom. % Ge and 1-4 atom. % W and/or Cr, without B or Si. U.S. Pat. No. 5,207,982 and U.S. Pat. No. 5,286,443 describe various Titanium Aluminide alloys. However, neither patent descibes any alloy combinations of boron and silicon in titanium aluminides modified by chromium and tungsten. It should be noted that the above ranges are calculated from the values recited in the NAZMY claims.
The following documents are also cited in respect of the prior art: N. S. Stoloff, "Ordered alloys-physical metallurgy and structural applications", International Metals Review, Vol. 29, No. 3, 1984, pp. 123-135. G. Sauthoff, "Intermetallische Phasen" ("Intermetallic Phases"), Werkstoffe zwischen Metall und Keramik, Magazin neue Werkstoffe 1/89, p. 15-19. Young-Won Kim, "Intermetallic Alloys based on Gamma Titanium Aluminide", JOM, July 1989, pp. 24-30. This prior art reference has recognized that the mechanical properties (tensile yield strength, ultimate tensile strength, and ductility) of TiAl are affected by deviations from Ti/Al stoichiometric ratio, and small additions of dopants to a non-stoichiometric TiAl composition, even in the range of 0.1 to 1.0 atomic percent. Also relevant is "Ordered Intermetallic Alloys, Part III: Gamma Titanium Aluminides", Young-Won Kim, JOM, July 1994, pp. 30-39.
Often, prior art dopants which are present as ternary additions to a non-stoichiometric TiAl composition impart unpredictable effects on strength or ductility, or both, as taught by U.S. Pat. No. 4,842,820. This patent further teaches that the nature and the concentration of the dopant, as well as the processing (annealing or heat treatment) temperature have a strong bearing on strength and ductility.
Other prior art has shown that, in some instances, although some dopants may produce beneficial effects when added singly, the presence of the same dopants in combination thereof can produce detrimental effects on strength and ductility. For example, U.S. Pat. No. 5,304,344 cites three example alloys, Ti.sub.49 Al.sub.48 V.sub.3, Ti.sub.50 Al.sub.46 Nb.sub.4 and Ti.sub.48 Al.sub.48 Ta.sub.4 (gamma alloy no. 14, 40, and 60 respectively of Table III) which exhibit room temperature ductility greater than 1.0%. However, when the additives vanadium, niobium and tantalum are combined in alloy Ti.sub.49 Al.sub.45 V.sub.2 Nb.sub.2 Ta.sub.2, a very low ductility (about 0.1%) results. Clearly, the prior art has conclusively demonstrated the unpredictable response to a combination of dopants that may be beneficial when added as ternary dopants to a non-stoichiometric gamma titanium alloy composition. Those skilled in the art will recognize that the situation is more complex when polynary additives are considered, as is done by the present inventor in this patent application.
It is useful to cite several key patents whose salient features constitute the prior art regarding the beneficial effect of boron as a doping agent in gamma titanium aluminides. Boron has been used to refine the grain size of metallurgical structures, its effectiveness to achieve such refinement being dependent on its concentration and the presence of other dopants in the gamma titanium aluminide composition.
U.S. Pat. No. 4,842,820 teaches the use of boron as a ternary dopant in concentrations varying from 1 to 5 atom. % to effectively achieve high strength and improved ductility.
In U.S. Pat. No. 5,080,860 boron is taught to be in concentrations from 0.5 to 2 atom. % in a gamma titanium aluminide composition containing niobium and chromium. The '860 patent shows chromium has no refining effect on the crystal form of the solidified structure as the aluminum content varies from 46 to 50 atom. %, with the crystal form changing from a large equiaxed structure to a columnar-equiaxed one. Further, the '860 patent prescribes the optimum boron concentration to be between 0.5 and 2 atom. % to achieve a fine grain equiaxed microstructure and property improvements. The same range of boron concentration is specified in U.S. Pat. No. 5,204,058 and U.S. Pat. No. 5,264,054, again for titanium aluminide compositions modified by niobium and chromium. On the other hand, in U.S. Pat. No. 5,205,875 the range of boron concentration varies from 0.1 to 0.2 atom. % for the titanium aluminide alloy Ti.sub.Bal. --Al.sub.46-48 --Cr.sub.2 --Nb.sub.2 --B.sub.0.1-0.2.
U.S. Pat. No. 5,082,624 and U.S. Pat. No. 5,082,506 relate to doping a niobium containing titanium aluminide with boron additive in concentrations between 0.5 and 2 atom. % in cast, and cast and thermomechanically worked ('506 patent) samples.
The use of boron as a quinary dopant in a titanium aluminide composition modified by chromium and tantalum is taught by U.S. Pat. No. 5,098,653, U.S. Pat. No. 5,131,959, U.S. Pat. No. 5,228,931 and U.S. Pat. No. 5,324,367. The specified ranges of boron concentration (in atom. %) vary as follows: 0.5 to 2 ('653 and '959 patents), 0.1 to 0.3 ('931 patent), and 0.05 to 0.2 ('367 patent).
Other relevant patents are U.S. Pat. No. 4,842,819, U.S. Pat. No. 4,842,820, U.S. Pat. No. 4,857,268, U.S. Pat. No. 4,836,983, and EP-A-0,275,391.
The properties of the known modified intermetallic compounds in general do not yet meet the technical demands for the production of usable workpieces therefrom. This applies in particular with regard to high-temperature strength and ductility. There is therefore a need for further development and improvement of such materials.
These and other difficulties experienced with the prior art alloys and processes have been obviated in a novel manner by the present invention.
It is, therefore, an outstanding object of the present invention to provide a low density alloy which has adequate resistance to oxidation and corrosion at high temperatures and at the same time a high-temperature strength and sufficient toughness in the temperature range of 500 to 1,000 degree(s) C., which alloy is very suitable for ordered solidification and essentially consists of a high melting point intermetallic compound.
It is a further object of the present invention to provide gamma titanium aluminide compositions containing boron, chromium, tungsten and silicon, which are particularly suitable for the manufacture of net-shape components by casting.
Additionally, it is an object of this invention to provide an alloy composition which exhibits adequate room temperature tensile ductility, i.e. minimum 0.5%, to allow handling and finishing of cast components without loss of structural integrity.
Further, it is another object of this invention to provide a gamma titanium aluminide composition which exhibits room temperature tensile strength higher than 75 ksi.
With the foregoing and other objects in view, which will appear as the description proceeds, the invention resides in the combination and arrangement of steps and the details of the composition hereinafter described and claimed, it being understood that changes in the precise embodiment of the invention herein disclosed may be made within the scope of what is claimed without departing from the spirit of the invention.

Titanium Aluminide alloys containing Boron, Chromium, Silicon and Tungsten


Disclosed is a cooling device for a folder type portable wireless terminal including a main body and an openable folder coupled with the main body. In the cooling device, a cooling plate is installed in the folder with a predetermined size, and a heat transfer element has one end connected to the cooling plate and the other end connected to a predetermined portion of a mainboard of the main body to transfer heat generated from the mainboard to the cooling plate.

1. Field of the Invention
The present invention relates to a cooling device for a folder type portable wireless terminal, and more particularly, to a cooling device for a folder type portable wireless terminal that dissipates heat generated by the components in the terminal.
2. Background of the Prior Art
With the rapid development of the electronics and communications industry, portable wireless terminals such as cellular phones, personal digital assistants (PDA) and wireless notebook computers are being widely used all over the world. Recent portable wireless terminals provide convenient and various functions as well as the typical communications function. For this reason, the main circuit board, or mainboard, that houses the internal electrical components of the portable wireless terminal includes an increasing number of components.
To accommodate the increasing number of components, they are reduced in size while increasing functionality and capability, which, in turn, increases their complexity. These small-sized, complexly-interconnected components are mounted onto the mainboard for integration. However, the resulting complex mainboard produces much more heat. For example, high-performance components, such as a modem, a multimedia chip, and a Power Amplifier Module (PAM) for a Code Division Multiple Access (CDMA) terminal, are known as excessive heat generating components of the mainboard.
Since the conventional portable wireless terminal does not have a cooling means or has a cooling means only within its main body, long-time operation of the portable wireless terminal builds up heat inside the main body and increases the temperatures of case frame, mainboard and the main body, such that the portable wireless terminal may operate improperly. In addition, the temperature increase may cause discomfort for the terminal user. Therefore, there is a need for a cooling device capable of dissipating the heat of portable wireless terminals.

Cooling device for folder type portable wireless terminal


In one embodiment of the invention there is provided an electret microphone circuit including an electret microphone including a field effect transistor (FET) having a gate coupled to an electret element, a drain coupled to provide audio frequency output to an audio output node, and a source coupled to ground via a first resistor so as to reduce drain current swings; and an RLC circuit coupled to the drain for configuring the audio frequency output from the drain to desired characteristics. In an alternative embodiment there is provided a circuit coupled to said FET for operating said FET in a source follower mode so as to create low output impedance. In another embodiment of the invention there is provided a method of improving performance of an electret microphone, the microphone including a field effect transistor (FET) having a gate coupled to an electret element, a drain coupled to provide audio frequency output to an audio output node, and a source. The method includes coupling the source to ground via a first resistor so as to reduce drain current swings; and operating the FET in a source follower mode so as to create low output impedance. In another embodiment there is provided a step of configuring the audio frequency output from the drain to desired characteristics.

The invention relates to a circuitry which improves performance of a low cost electret microphone.
Electret microphones are preferred in many applications for their small size, light weight and high output. They are manufactured in numerous acoustic configurations, but generally fall in one of three categories in terms of electronic circuitry: two-terminal simple, three-terminal intermediate and three-terminal advanced. The electret element is enclosed in a housing together with a buffer amplifier, most commonly a JFET stage. A voltage bias source is therefore required for the JFET amplifier and is provided by the equipment the microphone is connected to.
The two-terminal simple electret mic is a modest, low cost device suitable for consumer electronic appliances and telephones, where any limitations in acoustic to electrical conversion are masked by bandwidth shaping (often mandated by FCC rules) or the ability of a human listener to comprehend speech with moderate distortion. The mic housing contains the absolute minimum necessary for operation, an electret diaphragm and a JFET. One side of the charged electret is grounded to the case, the opposite side is internally coupled to the JFET gate. The source is brought outside as one of the two terminals but is grounded to the case. The other terminal is the JFET drain. A typical two-terminal electret mic is the Panasonic WM-54BT.
The three-terminal advanced electret mic has additional circuitry, typically resistors and sometimes also capacitors mounted on a hybrid circuit board together with the electret and the FET. The greater complexity and cost are offset by higher performance, particularly greater intelligibility and lower distortion. Applications for these microphones are in speech recognition, hearing aids, military communications, and music. FIG. 1 is a schematic diagram of a three terminal electret mic 100. The mic 100 includes a grounded housing 102, an electret diaphragm element 104 and a JFET transistor 106. The mic has three terminals: ground 108, FET source 110 and drain 112 enclosed in the grounded housing. Most commonly, the drain is directly connected to the bias voltage source or battery and the JFET 106 is used as a source follower for low output impedance. Typical ranges for biasing resistors 114 and 116 are several megohms and several hundred ohms respectively. Gentex Model 3065 is a representative advanced electret microphone.
The intermediate three-terminal electret is simpler than the advanced by avoiding the hybrid circuit board but still brings out the JFET source connection separately. Primo EM-60P is such a microphone.

Circuitry for improving performance of electret microphone


Output performance of the engine may be maximized by a configuration in which air is supplied so as to maximize volumetric efficiency of the respective cylinders in a multi-cylinder engine including a plurality of cylinders.

Field of Invention
The present invention relates to an intake system for an engine, and more particularly, to a structure of an intake system capable of supplying air to each of a plurality of cylinders included in an engine.
Description of Related Art
An intake system for a multi-cylinder engine including a plurality of cylinders according to the related art generally has a configuration in which air may be supplied to the respective cylinders using an intake manifold.
The intake manifold has a configuration in which one pipe connected to the atmosphere is branched into a plurality of pipes connected to the respective cylinders so that air may be supplied to each of the plurality of cylinders by branching one inlet sucking the air from the atmosphere into the plurality of cylinders.
Meanwhile, in order to burn a larger amount of fuel in a limited volume to improve specific power of the engine, the cylinder of the engine should suck a maximum amount of air to maximize volumetric efficiency.
Therefore, the entire configuration of the intake system for an engine including the intake manifold supplying the air to the respective cylinders of the engine becomes a factor that has a very large effect on performance of the engine.
The information disclosed in this Background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.


A method of manufacturing a rubber coated fabric for a tire which includes a weft cutting step of cutting a weft of the rubber coated fabric base substance using a cutting device at a cut pitch Cp of two to five times an arrangement pitch P of a warp. The cut ductility of the weft is set between 5 and 20%. The cutting device utilizes first and second rollers in which the peripheral protrusions and the peripheral grooves are alternately formed. Groove widths W1 and W2 of the peripheral grooves of the first and second rollers are set between 2.0 and 5.0 mm, protruding widths T1 and T2 of the peripheral protrusions of the first and second rollers are set to 0.25 to 0.5 times the groove widths W1 and W2, and the insertion depths h1 and h2 of the peripheral protrusions to the peripheral grooves are set between 2.0 and 4.0 mm.

1. Field of the Invention
The present invention relates to a method of manufacturing a rubber coated fabric for a tire, which can improve the uniformity of a tire.
2. Description of the Related Art
As shown in FIG. 8, a long fabric "d", in which a tire woven fabric "c", obtained by tire weaving a warp constituted by a tire cord "a", with a narrow weft "b" is coated by a rubber, is generally employed in a carcass ply of a pneumatic tire.
At the time of manufacturing the tire, the rubber coated fabric "d" is evenly cut into a plurality of cut pieces "d1" at a desired angle θ (of the order of 75 to 90° in a radial tire) with respect to the tire cord "a". Thereafter, a ply material "e" is formed by sequentially connecting each of the cut pieces "d1" at the end portions on the non-cut sides. The ply material "e" is then wound around a forming drum and is thereafter expanded in a troidal shape.
At the time of the expansion in the troidal shape, in order to improve the uniformity of the tire, it is necessary to expand in the peripheral direction while maintaining the interval between the tire cords "a" uniform. However, if the weft "b" still intertwines with the tire cord "a", the uniform expansion is prevented.
In recent years, as disclosed in Japanese Unexamined Patent Publication No. 5-208458, there has been proposed that the weft "b" is previously cut prior to the molding of the tire. In this structure, after the rubber coated fabric is irradiated with an electron beam, as shown in FIG. 9, the rubber coated fabric "d" is passed between a pair of rollers "r1" and "r2" in which peripheral protrusions "f" and peripheral grooves "g" continuously provided in a peripheral direction are alternately formed. Thus, a tensile force is applied to the weft "b" and the weft "b" is cut.
The rubber coated fabric is irradiated for the following reason. If the fabric "d", coated with rubber, is passed through without irradiating with the electron beam, there is the case where the weft "b" is displaced and thus a sufficient tensile force cannot be applied, due to a soft topping rubber. Therefore, a cut length is widely scattered such that a portion which is not partially cut is generated, and accordingly uniformity cannot be sufficiently improved. On the contrary, in the case where the coated fabric is irradiated, the modulus of the topping rubber is moderately increased by the electron beam, so that it is possible to inhibit the weft "b" from being displaced and thus it is possible to make uniform the cut length of the weft "b".
However, the structure in which the weft "b" is cut after irradiating with the electron beam tends to become deteriorated in its outer appearance such that a concave-convex trace generated at a time of passing through the rollers remains on the surface of the fabric "d", whereby a wavy undulation is generated on the side surface of the tire.
As a result, it has been found that a cut length of the weft can be made uniform without irradiating with the electron beam by controlling, in the roller, the width of the peripheral groove, the width of the peripheral protrusion, or the like, within a predetermined range.

Method of manufacturing fabric with rubber for tire


A lithographic production process according to one embodiment comprises an input section, pre-imaging processes, measurement of a substrate, exposure of the substrate, post-imaging processes, and output. A controller controls the time spent processing in the scanner based on an input of the rate at which substrates arrive from the pre-imaging processes. This control allows the scanner to optimize the accuracy of devices produced by selectively varying the duration of processes in the scanner.

The term "patterning structure" as here employed should be broadly interpreted as referring to structure that can be used to endow an incoming radiation beam with a patterned cross-section, corresponding to a pattern that is to be created in a target portion of the substrate; the term "light valve" can also be used in this context. Generally, the said pattern will correspond to a particular functional layer in a device being created in the target portion, such as an integrated circuit or other device (see below). Examples of such patterning structure include:                A mask. The concept of a mask is well known in lithography, and it includes mask types such as binary, alternating phase-shift, and attenuated phase-shift, as well as various hybrid mask types. Placement of such a mask in the radiation beam causes selective transmission (in the case of a transmissive mask) or reflection (in the case of a reflective mask) of the radiation impinging on the mask, according to the pattern on the mask. In the case of a mask, the support structure will generally be a mask table, which ensures that the mask can be held at a desired position in the incoming radiation beam, and that it can be moved relative to the beam if so desired.        A programmable mirror array. One example of such a device is a matrix-addressable surface having a viscoelastic control layer and a reflective surface. The basic principle behind such an apparatus is that (for example) addressed areas of the reflective surface reflect incident light as diffracted light, whereas unaddressed areas reflect incident light as undiffracted light. Using an appropriate filter, the said undiffracted light can be filtered out of the reflected beam, leaving only the diffracted light behind; in this manner, the beam becomes patterned according to the addressing pattern of the matrix-addressable surface. An alternative embodiment of a programmable mirror array employs a matrix arrangement of tiny mirrors, each of which can be individually tilted about an axis by applying a suitable localized electric field, or by employing piezoelectric actuation means. Once again, the mirrors are matrix-addressable, such that addressed mirrors will reflect an incoming radiation beam in a different direction to unaddressed mirrors; in this manner, the reflected beam is patterned according to the addressing pattern of the matrix-addressable mirrors. The required matrix addressing can be performed using one or more suitable electronic devices. In both of the situations described hereabove, the patterning structure can comprise one or more programmable mirror arrays. More information on mirror arrays as here referred to can be gleaned, for example, from United States Patents U.S. Pat. No. 5,296,891 and U.S. Pat. No. 5,523,193, and PCT patent applications WO 98/38597 and WO 98/33096, which are incorporated herein by reference. In the case of a programmable mirror array, the said support structure may be embodied as a frame or table, for example, which may be fixed or movable as required.
A programmable LCD array. An example of such a construction is given in United States Patent U.S. Pat. No. 5,229,872, which is incorporated herein by reference. As above, the support structure in this case may be embodied as a frame or table, for example, which may be fixed or movable as required.
For purposes of simplicity, the rest of this text may, at certain locations, specifically direct itself to examples involving a mask and mask table; however, the general principles discussed in such instances should be seen in the broader context of the patterning structure as hereabove set forth.
Lithographic projection apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such a case, the patterning structure may generate a circuit pattern corresponding to an individual layer of the IC, and this pattern can be imaged onto a target portion (e.g. comprising one or more dies) on a substrate (silicon wafer) that has been coated with a layer of radiation-sensitive material (resist). In general, a single wafer will contain a whole network of adjacent target portions that are successively irradiated via the projection system, one at a time. In current apparatus, employing patterning by a mask on a mask table, a distinction can be made between two different types of machine. In one type of lithographic projection apparatus, each target portion is irradiated by exposing the entire mask pattern onto the target portion at; such an apparatus is commonly referred to as a wafer stepper. In an alternative apparatus—commonly referred to as a step-and-scan apparatus—each target portion is irradiated by progressively scanning the mask pattern under the projection beam in a given reference direction (the "scanning" direction) while synchronously scanning the substrate table parallel or anti-parallel to this direction; since, in general, the projection system will have a magnification factor M (generally<1), the speed V at which the substrate table is scanned will be a factor M times that at which the mask table is scanned. More information with regard to lithographic devices as here described can be gleaned, for example, from U.S. Pat. No. 6,046,792, incorporated herein by reference.
In a manufacturing process using a lithographic projection apparatus, a pattern (e.g. in a mask) is imaged onto a substrate that is at least partially covered by a layer of radiation-sensitive material (resist). Prior to this imaging operation, the substrate may undergo various procedures, such as priming, resist coating and a soft bake. After exposure, the substrate may be subjected to other procedures, such as a post-exposure bake (PEB), development, a hard bake and measurement/inspection of the imaged features. This array of procedures is used as a basis to pattern an individual layer of a device, e.g. an IC. Such a patterned layer may then undergo various processes such as etching, ion-implantation (doping), metallization, oxidation, chemo-mechanical polishing, etc., all intended to finish off an individual layer. If several layers are required, then the whole procedure, or a variant thereof, will have to be repeated for each new layer. Eventually, an array of devices will be present on the substrate (wafer). These devices are then separated from one another by a technique such as dicing or sawing, whence the individual devices can be mounted on a carrier, connected to pins, etc. Further information regarding such processes can be obtained, for example, from the book "Microchip Fabrication: A Practical Guide to Semiconductor Processing", Third Edition, by Peter van Zant, McGraw Hill Publishing Co., 1997, ISBN 0-07-067250-4, incorporated herein by reference.
For the sake of simplicity, the projection system may hereinafter be referred to as the "lens"; however, this term should be broadly interpreted as encompassing various types of projection system, including refractive optics, reflective optics, and catadioptric systems, for example. The radiation system may also include components operating according to any of these design types for directing, shaping or controlling the projection beam of radiation, and such components may also be referred to below, collectively or singularly, as a "lens". Further, the lithographic apparatus may be of a type having two or more substrate tables (and/or two or more mask tables). In such "multiple stage" devices the additional tables may be used in parallel, or preparatory operations may be carried out on one or more tables while one or more other tables are being used for exposures. Dual stage lithographic apparatus are described, for example, in U.S. Pat. No. 5,969,441 and WO 98/40791, incorporated herein by reference.
Although specific reference may be made in this text to the use of the apparatus according to the invention in the manufacture of ICs, it should be explicitly understood that such an apparatus has many other possible applications. For example, it may be employed in the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, liquid-crystal display panels, thin-film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms "reticle", "wafer" or "die" in this text should be considered as being replaced by the more general terms "mask", "substrate" and "target portion", respectively.
In the present document, the terms "radiation" and "beam" are used to encompass all types of electromagnetic radiation, including ultraviolet radiation (e.g. with a wavelength of 365, 248, 193, 157 or 126 nm) and EUV (extreme ultra-violet radiation, e.g. having a wavelength in the range 5–20 nm), as well as particle beams, such as ion beams or electron beams.
In a conventional lithographic apparatus, whether it is a wafer stepper or a step-and-scan apparatus, the imaging section processes each wafer in a fixed time. This time depends on the "recipe" for producing a device and also ensures that the exposure processing is completed before the next wafer arrives from the procedures prior to imaging. The imaging section spends some time waiting after it has finished exposing a wafer for the next wafer to arrive. This is an inefficient use of the projection system.

Lithographic apparatus, device manufacturing method, and computer program


A device is described for electrophoretic molecular separation. This device has a channel formed on a hydrophobic surface thereof. The interior surface of the channel is rendered hydrophilic through successive oxidation and protophilic reactions. A cover extends over the channel to form a conduit which is dimensioned to accept a molecular separation media. The conduit is also positioned for application of an electric current along the length of the interior of the conduit which drives a sample through the molecular separation media. Systems and methods are also described for electrophoretic molecular separation.

The present invention relates generally to the art of separating charged molecular species, and, in particular, to new devices, systems and methods for practicing same.
Capillary gel electrophoresis is one of the most widely used separation techniques in the biologically related sciences. Charged molecular species such as proteins, peptides, nucleic acids, amino acids and oligonucleotides are separated by causing the species to migrate in a buffer medium under the influence of an electric field. The buffer medium normally is used in conjunction with a low to moderate concentration of an appropriate gelling agent, such as for example, agarose or cross-linked polyacrylamide, to promote the separation and to minimize the occurrence of mixing of the species being separated.
Until recently, electrophoretic separations were conducted in gel slabs or open gel beds which were typically fabricated of agarose or cross-linked polyacrylamide material. More recently, capillary gel electrophoresis techniques combined with photometric detection methods have allowed the automation and rapid quantitative analysis of charged molecules. Furthermore, capillary gel electrophoresis can provide quantitative information about a sample using very small amounts of the sample, gel and buffer relative to traditional slab gel processes. Moreover, high resolution separation of molecules having different effective charges have been achieved by applying electrophoretic principles to polymer solution-filled or gel-filled narrow capillary tubes.
A problem encountered with such separation methods is the compatibility of a particular separation medium with the surface of the separation device. In particular, electro-osmotic flow of a sample to be separated between the separation medium and the inner surface of the separation device occurs when a separation medium is unable to adhere, i.e., adsorb, to the surface of the separation device. Such electro-osmotic flow provides unreliable separation results because the sample flows around the separation medium instead of through it.
Traditional methods aimed at preventing such electro-osmosis include introducing a compound which binds to the inner surface of a capillary tube wall, as well as, to the separation medium prior to injecting the separation medium into the tube. For example, U.S. Pat. No. 5,447,617 to Shieh describes covalently bonding polybutadiene to the inner surface of a capillary tube, introducing polyacrylamide therein and co-polymerizing the polyacrylamide with the polybutadiene. Such precoating techniques, however, are time consuming, inconvenient and costly.
A further problem of conventional capillary gel electrophoresis is encountered with the use of polyacrylamide-based separation media. Such media are injected into the capillary tube in unpolymerized form. Polymerization of the polyacrylamide is then induced within the capillary tube by any number of methods including ultraviolet radiation and chemical catalysts. Such methods are characterized by a lack of uniformity in the pore size distribution of the polymer network formed, and by incomplete polymerization.
Accordingly, attempts have been made to use nonpolymerized separation media for capillary gel electrophoresis. See for example, U.S. Pat. Nos. 5,126,021, 5,468,365 and 5,213,669 which describe separation media which form dynamic entanglements, associations, or cross-links for electrophoretically separating biological samples including protein, DNA and RNA. These separation media are not ideal for separating molecular samples because they are difficult to manipulate, require precoating of the surface of the separation device and/or are not universally compatible with the surface of such separation devices, i.e., do not have temperature-dependant hydrophobic and hydrophilic segments, respectively.
Glass and silica surfaces are most commonly used in conjunction with the separation media described above. For example, capillary columns used in capillary gel electrophoresis are fabricated from lengths of fused silica tubing having diameters on the order of 25 .mu.m to 200 .mu.m and lengths from about 30 cm to about 200 cm. The buffer and gel separation media are pumped directly into the column interiors and electrophoretic techniques are used to separate charged molecular species.
Similarly, such molecular separations have been attempted on the surface of silicon wafers. For example, U.S. Pat. No. 4,908,112 to Pace, hereby incorporated by reference, discloses an analytical separation device in which a capillary sized, i.e., micro-machined conduit is formed by a channel in a semiconductor device. The surface of such a device is conditioned to accept traditional separation media. In particular, the surface of the semiconductor device is thermally oxidized to form a SiO.sub.2 layer. The conduit is then filled with a traditional electrophoretic gel preparation fluid, such as for example, a monomer and a cross-linker of a polyacrylamide.
A major drawback to the use of such a device, however, is the inability of many separation media to adhere/adsorb to the inner wall of the conduit which, as set forth above, creates electro-osmotic flow of a sample between the surface of the gel and the wall of the conduit when an electric field is applied during electrophoresis. When such electro-osmotic flow of the sample occurs, a satisfactory separation of the constituent parts of the sample cannot be obtained.
Thus, attempts have been made to find separation media capable of high adsorbency onto, e.g., silica surfaces, and which are still able to electrophoretically separate molecular species. In particular, the adsorption of nonionic block copolymers of the Pluronic PE type, i.e., poly(oxyethylene)-poly(oxypropylene)-poly(oxyethylene), at hydrophobic silica surfaces have been investigated. See for example, Teberg, F.; Malmsten, M.; Linse, P.; Lindman, B. Langmuir, 1991, 7, 2723-2730 and Malmsten, M.; Linse, P.; Cosgrove, T. Macromolecules, 1992, 25, 2474-2481. The utility of such media, however, is limited by the requirement that the silica surfaces of the separation device be rendered hydrophilic for effective adsorbency thereon by the oxyethylene (E) block of the separation media.
Accordingly, it would be desirable to provide a device for electrophoretic molecular separation that is adapted to accept a molecular separation medium which efficiently and effectively separates molecular species without the problems associated with the above-referenced citations. It would also be desirable to provide a separation medium with the ability to adsorb to a variety of substrate surfaces and to change between liquid and gel-like states for efficient application and removal of the medium from such a molecular separation device. In particular, it would be desirable to provide a device for molecular separation which has a surface with hydrophobic properties which surface can be modified to accept such a molecular separation medium through successive oxidation and protophilic reactions. It would also be desirable to provide methods for rendering hydrophilic surfaces, such as silicon surfaces, competent to receive molecular separation media.

Effective surface treatment for a new separation medium in electrophoresis

The Research Foundation of State University of New York


A data access method, a routing apparatus, and a storage system are provided. The method is applied to a storage system including a first storage device, a second storage device, and a routing apparatus. A logical unit in each storage device includes at least one first-type logical block and at least one second-type logical block. According to the method, when sending access requests to the storage devices in the storage system according to a preset rule, the routing apparatus sends access requests corresponding to same target logical blocks to one of the storage devices according to a preset rule. This reduces network overheads between the storage system and the application server, and improves efficiency of processing the access requests by the storage system.

A multi-active storage system includes at least two storage devices. All the storage devices include a same quantity of logical units. Data stored in same logical units in different storage devices is the same. In other words, data stored on the storage devices has strong consistency. Therefore, the storage devices in the multi-active storage system can simultaneously provide an external service, so that data stored in the multi-active storage system has relatively high availability. At present, the multi-active storage system is widely used in application scenarios in which a plurality of application servers are included and high-concurrent access occurs, such as bank and communication scenarios.
In the prior art, to ensure consistency of data stored on the storage devices in the multi-active storage system, a quorum server is configured in the multi-active storage system. Before sending a write request to the storage device in the multi-active storage system, any application server needs to apply to the quorum server for permission. Only an application server that has gained the permission can send the write request to the storage device in the multi-active storage system. In this manner, the following case can be avoided: Inconsistency of data stored on a plurality of storage devices in the multi-active storage system is caused when a plurality of application servers simultaneously send write requests to same logical units in different storage devices in the multi-active storage system.
However, when the quorum server is used in the multi-active storage system to ensure consistency of data stored on the storage devices, network overheads are relatively high.

Data access method, routing apparatus, and storage system


A protein selected from the following (a) to (c), a gene encoding the protein, a transformant in which the gene is subjected to deletion, mutation or repression of gene expression, and a method of producing a glycolipid using the transformant are provided, wherein: (a) is a protein consisting of an amino acid sequence set forth in SEQ ID NO: 1; (b) is a protein consisting of an amino acid sequence having 50% or more identity with the amino acid sequence set forth in SEQ ID NO: 1, and having alcohol oxidase activity; and (c) is a protein consisting of an amino acid sequence in which one to several amino acids are subjected to deletion, substitution, insertion or addition in the amino acid sequence set forth in SEQ ID NO: 1, and having alcohol oxidase activity.

An alkyl glycoside and a sophorose lipid are glycolipids and are formulated with various kinds of detergents as a surfactant.
Industrial production of the alkyl glycoside or the sophorose lipid is mainly made by chemical synthesis using sugar and alcohol as raw materials, but has problems of needing a large amount of raw material alcohol and causing denaturation of raw material glucose because a reaction under a high temperature and a high pressure is carried out.
From such situations, technologies of producing glycolipids using microorganisms have been studied in pursuit of high production efficiency. For example, it has been reported that when Candida bombicola, one of yeast, is cultured in a medium containing sugar and alcohol, alkyl sophorosides or sophorose lipids are obtained as a product (Patent Literature 1 and Non-Patent Literature 1).


A substantial saving of material cost and weight is obtained in an induction motor by a rotor including two sets of differently punched laminations. The laminations in one of the two groups each weigh less than 95% of the laminations in the other one of the two groups. Such laminations can be automatically produced on a computer-controlled die press by providing a separate punch pattern that is capable of being programmed for selected laminations. The lighter laminations can be used to counterbalance a crank without requiring additional counterbalancing weight to be added outside the motor.

(1) Field of the Invention
This invention relates generally to the field of electric motors, and more specifically to reduced weight electric motors, such as inductive electric motors, in which the weight of the rotor has been reduced, and to the rotor so constructed to reduce the weight of such a motor.
(2) Description of the Prior Art
Reducing the weight of a rotor in some types of motors by reducing the amount of material therein is known. The advantages of such savings usually include a reduction in manufacturing cost of the motor. In the past, many of the advances made in reducing the weights of laminations in rotors have been developed for DC motors. However, many of the applications in which reduced-weight motors would be useful, such as washing machines, employ induction motors, to which the improvements developed for DC motors either do not apply or would be impractical to apply.
Recent developments have been set forth for reducing the weight of rotors in induction motors, but these weight reductions required that the rotors be redesigned, resulting in a smaller motor of different dimensions than the original. Thus, a manufacturer of such a motor would have to retool his manufacturing operation to accommodate the smaller-size rotor. Moreover, a manufacturer of a device, such as a washing machine, in which a standard motor is used may have to retool to accommodate a lower-weight motor having smaller external dimensions. The marketplace for improved lightweight motors may also be reduced if an existing consumer appliance needing repair cannot accommodate a smaller, reduced weight motor, and consumer hostility may be created if the cost of a repair is increased because a replacement motor requires an extra-cost adaptor.
There are also some applications of induction motors in which an axial imbalance (such as that created by attachment of the motor to a crank, as in a reciprocating compressor) must be counterbalanced. Presently, this counterbalance is created by the axially asymmetric addition of extra weight 102 on one, or perhaps both shorting end rings 100 of a motor, as shown in prior art FIG. 9A and 9B, or by the addition of counterweights external to the motor, since the prior art has taught that the rotor of a motor should be made as symmetrical as possible. Adding additional material in the form of counterbalancing weights adds to the cost of the motor or motor assembly. There has thus been a long-felt felt need to provide a reduced-weight, and thus reduced cost motor for such applications, and a method for reducing the weight and cost of such motors.
It would thus be advantageous to provide a rotor for an induction motor that can be practically constructed with existing manufacturing equipment, but which provides a substantial reduction in weight through reduction in lamination material. It would further be advantageous if the reduction in weight was not accompanied by a reduction in size, so that a replacement motor made with such a rotor could maintain the same external dimensions as the motor being replaced.
It would also be advantageous to provide a rotor for an induction motor, and a method of manufacturing such a rotor, that would permit the motor to be used in applications in which an axial asymmetry must be counterbalanced, without adding or attaching significant additional weight to the motor.


In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

1. Field of the Invention
This invention relates in general to the manufacture and structure of magnetic heads, and more particularly to a method for forming a coil with higher copper density in the magnetic head using a process combining damascene and non-damascene processes.
2. Description of the Prior Art
In the last decades, magnetic hard drives (or disc drives) have been in common use for storage of large groups of data. Improvements in manufacturing thereof have attracted popular attention particularly to reducing the size of the drive and/or its internal components to achieve both lower costs and wider applications.
Magnetic hard drives include magnetic recording head for reading and writing of data. As well known, a magnetic recording head generally includes two portions, a write head portion or head for writing or programming magnetically-encoded information on a magnetic media or disc and a reader portion for reading or retrieving the stored information from the media.
Data is written onto a disc by a write head that includes a magnetic yoke having a coil passing there through. When current flows through the coil, a magnetic flux is induced in the yoke, which causes a magnetic field to fringe out at a write gap in a pole tip region. It is this magnetic field that writes data, in the form of magnetic transitions, onto the disk. Currently, such heads are thin film magnetic heads, constructed using material deposition techniques such as sputtering and electroplating, along with photolithographic techniques, and wet and dry etching techniques.
Examples of such thin film heads include a first magnetic pole, formed of a material such as NiFe which might be plated onto a substrate after sputter depositing an electrically conductive seed layer. Opposite the pole tip region, at a back end of the magnetic pole, a magnetic back gap can be formed. A back gap is the term generally used to describe a magnetic structure that magnetically connects first and second poles to form a completed magnetic yoke.
One or more electrically conductive coils can be formed over the first pole, between the pedestal and the back gap and can be electrically isolated from the pole and yoke by an insulation layer (or insulator spacers or insulators), which could be alumina (Al2O3) or hard baked photoresist.
In operation, the disk (or disc) rotates on a spindle controlled by a drive motor and the magnetic read/write head is attached to a slider supported above the disk by an actuator arm. When the disk rotates at high speed a cushion of moving air is formed lifting the air bearing surface (ABS) of the magnetic read/write head above the surface of the disk.
As disk drive technology progresses, more data is compressed into smaller areas. Increasing data density is dependent upon read/write heads fabricated with smaller geometries capable of magnetizing or sensing the magnetization of correspondingly smaller areas on the magnetic disk. The advance in magnetic head technology has led to heads fabricated using processes similar to those used in the manufacture of semiconductor devices.
The read portion of the head is typically formed using a magnetoresistive (MR) element. This element is a layered structure with one or more layers of material exhibiting the magnetoresistive effect. The resistance of a magnetoresistive element changes when the element is in the presence of a magnetic field. Data bits are stored on the disk as small, magnetized region on the disk. As the disk passes by beneath the surface of the magnetoresistive material in the read head, the resistance of the material changes and this change is sensed by the disk drive control circuitry.
The write portion of a read/write head is typically fabricated using a coil embedded in an insulator between a top and bottom magnetic layer. The magnetic layers are arranged as a magnetic circuit, with pole tips forming a magnetic gap at the air bearing surface (ABS) of the head. When a data bit is to be written to the disk, the disk drive circuitry sends current through the coil creating a magnetic flux. The magnetic layers provide a path for the flux and a magnetic field generated at the pole tips magnetizes a small portion of the magnetic disk, thereby storing a data bit on the disk.
Stated differently, data is written onto a disk by a write head that includes a magnetic yoke having a coil passing therethrough. When current flows through the coil, a magnetic flux is induced in the yoke, which causes a magnetic field to fringe out at a write gap in a pole tip region. It is this magnetic field that writes data or data bits, in the form of magnetic transitions, onto the disk. Such heads are typically thin film magnetic heads, constructed using material deposition techniques such as sputtering and electroplating, along with photolithographic techniques and wet and dry etching techniques.
The read/write head is formed by deposition of magnetic, insulating and conductive layers using a variety of techniques. Fabrication of the write head coil requires a metallization step wherein the metallization is formed in the shape of a coil. The damascene process is one of the techniques used for forming metallization layers in integrated circuits. Generally, the damascene process involves forming grooves or trenches in a material, and then electroplating to fill the trenches with metal. After a trench is formed, however, a seed layer must first be deposited in the trench to provide an electrically conductive path for the ensuing electrodeposition process. Metal is then deposited over the entire area so that the trench is completely filled.
The damascene process used in semiconductor device fabrication requires fewer process steps compared to other metallization technologies. To achieve optimum adherence of the conductor to the sides of the trench, the seed layer deposited prior to deposition of the metal must be continuous and essentially uniform.
The increasing demand for higher data rate has correspondingly fueled the reduction of the yoke length, coil pitch and hence the overall head structure. This allows for higher speeds (rpm) disk drives having high performance. In addition to a compact design of the yoke (shorter yoke), low coil resistance is desirable for which damascene techniques are used to form a thick coil in a compact area. Additionally, more copper or coil is desirable to reduce coil resistance, which reduces write-induced protrusion. Write-induced protrusion occurs during writing to the disk because when temperature increases as a result of hotter coils, it causes the write head to expand and come in contact with the disk. Any such contact with the disk is clearly highly undesirable because of the damage caused to the disk. Thus, there is a need to decrease coil resistance.
In damascene techniques, hard baked photoresist is used as a medium, onto which coil is formed. However, fairly large spaces are present in between coil turns in current coil manufacturing techniques. The spaces are typically filled with baked photoresist and are basically thick insulator walls. For example, a typical thickness of the insulator wall is 300 nanometers. Since coil resistance for Damascene coils is determined by how thick the insulator walls are and how tall the coil turns are, thick insulator wall reduces copper density and causes higher coil resistance.
Briefly, in current manufacturing techniques, the photoresist material is baked and exposed to create holes and then when copper is plated in the holes to form coil(s) thereupon. The photoresist material is then either removed or left in. Damascene techniques allow for higher aspect ratio and therefore lower resistance, nevertheless, in current techniques, the fairly large spaces between the coil turns prevent attaining even lower resistance. In non-damascene techniques, the seed layer is deposited prior to the photoresist material but higher aspect ratios are again unattainable due to the presence of thick insulator walls.
Another advantage of reducing spaces that are other than copper is to lower write head expansion at an elevated temperature. That is, photoresist having a large coefficient of thermal expansion benefits from reduced volume because temperature-induced protrusion is then reduced.
By way of brief background, in FIG. 1, relevant portions of a prior art disk drive 10 is shown to include a photoresist 14 onto which a coil 12 is formed having a center tap 16. A P1 pedestal layer 20 is shown formed below the bottom of the photoresist 14 at the ABS 18. A back gap layer 22 is shown below the center tap 16 surrounded by the coil 12. In fact, the coil 12 is formed between the P1 pedestal layer 20 and the back gap layer 22 forming a yoke.
It is desirable to decrease the photoresist 14 and increase the coil 12 for the foregoing reasons, among others. In FIG. 2, a cross sectional view, at AA, of the disk drive 10 of FIG. 1, is shown at 90. Coil turns 86 form the coil 12 of FIG. 1 and the insulators (or spaces) 88 shown between the coil turns 86 form the photoresist 14 of FIG. 1. A first pole P1 is shown on top of which is disposed the back gap layer 22, the coil turns 86, which are relatively small in size, and the insulators 88, which are relatively large in size therefore causing disk drive performance issues, such as write-induced and temperature protrusion.
Thus, there is a need for forming a coil having more copper and less insulation space between coil turns in a compact area of a magnetic head using damascene and non-damascene processes.

Formation of low resistance damascene coils

Hitachi Global Storage Technologies Netherlands B.V.


An in-vehicle transponder communicates with roadside readers to transmit a data stream of information that has been previously presented to the transponder. The transponder accepts multiple data cards and the identification numbers of the vehicle occupants for transmission to roadside transceivers.

An increasing number of vehicles are traveling over progressively more congested transportation networks. In an effort to relieve such congestion, managed lanes, high occupancy vehicle (HOV) and high occupancy tolling (HOT) lanes are utilized where two or more occupants must be present in the vehicle. Although managed lanes decrease traffic and congestion, abuse of such lanes by vehicle operators is a continuing problem. Identification of vehicle occupancy is an important component of managed lane management and operation. Enforcement of multiple occupants in a vehicle traveling in a managed lane, typically requires law enforcement personnel to visually confirm two or more occupants in a vehicle. This monitoring is tedious and unreliable, costly and time consuming. Therefore, a need exists for an electronic monitoring system to verify vehicle occupancy to improve the use and benefit of managed lanes.


The present invention provides a thermoluminescent phosphor for obtaining a two-dimensional or three-dimensional dosimeter for measuring dose absorbed by biological tissues, which phosphor has superior handleability, superior biological tissue equivalence, and superior precision.

Today, radiation therapies for cancers are rapidly developing centering around various irradiation methods, and along with the development, the importance of measurement of three-dimensional absorbed dose is increasing. To evaluate radiation absorbed by the living body, it is necessary to use a dosimeter sensor having the same effective atomic number as that of biological tissues. Dose measured with a sensor having a different effective atomic number cannot be used to measure dose absorbed by biological tissues accurately.
A two-dimensional dose distribution is now obtained by Gafchromic film or imaging plate (IP) photoreceptor. However, since Gafchromic film can be used only once, in-plane sensitivity coefficient cannot be obtained, nor can disrupted images resulting from uneven coating of photoreceptors be corrected. Hence, Gafchromic film has problems in quantitative capability. Further, Gafchromic film has a small dynamic range and this problem imposes many restrictions on use of the film. Meanwhile, since IPs are not biological tissue equivalent, it is virtually impossible to apply IPs to three-dimensional measurement. A method of measuring three-dimensional dose distribution using a molded product of a polymer gel in which a biological tissue-equivalent fluorescent substance is dispersed is also being studied, but the method is highly burdensome in terms of facilities and labor and is not practical.
As a thermoluminescent substance, a copper-containing lithium triborate (Non-patent Document 1) is known. The non-patent document discloses that manganese-containing lithium triborate acts as a thermoluminescent substance, but the document does not refer to a specific synthetic method or characteristics and hence, manganese-containing lithium triborate cannot be produced based on the document. Further, it is reported that pure lithium triborate crystals containing no additives exhibit thermoluminescence (Non-patent Document 2), but the document does not refer to manganese-containing lithium triborate.

Manganese-containing lithium triborate thermoluminescent phosphor, and method for producing same

Abstract: It is produced by a method comprising (A1) mixing Li2B4O7, B2O3 and MnO2, (A2) firing the mixture at 770 to 840° C., and (A3) obtaining the thermoluminescent phosphor comprising lithium triborate as a base material and manganese as a luminescent center present in the base material by further adding and mixing Li2B4O7 into the fired product and then firing the mixture at 770 to 840° C., wherein the molar ratio of Li2B4O7:B2O3 in A1 is 1:X (1<X≦4), MnO2 is 0.02 to 1.0 mass % relative to the total mass of the B2O3 and the total amount of the Li2B4O7 added in A1 and A3, and Li2B4O7 in A3 is (X-1) mol relative to 1 mol of the B2O3.