A trailer or towed vehicle braking system incorporates a master hydraulic cylinder, the piston of which is biased to apply pressure to the slave cylinders in the braking system and wherein an electric high torque mechanism, when operated at high electric power, overcomes the biasing force to apply no pressure to the slave cylinders. When the electric power to the high torque system is reduced, the pressure applied by the master cylinder is increased. The amount of electric power applied to the high torque motor is preferably controlled based on the braking pressure being applied in the towing vehicle.

Generally, braking systems for a recreational towed vehicle such as a travel trailer or the like operate based on electric signal derived from a towing vehicle that controls the electric power of electro-motive force (EMF) applied to a solenoid or the like to adjust the braking pressure applied by the solenoid to the brake pad of the trailer brake.
It is also common practice to use what is known as a surge brake which mounts on the tongue and applies braking pressure based on the pressure exerted between the towed vehicle and the towing vehicle to apply the appropriate braking pressure to the hydraulic brake cylinders in the towed vehicle.
In larger trailers such as semi-trailers or the like, the interconnection between the towing vehicle and the towed vehicle is generally pneumatic and the pneumatic pressure is used to apply the appropriate braking forces to the trailer wheels. These systems generally include some form of fail safe provision, for example, if a pneumatic pressure falls below a specific level, a mechanical braking system on the trailer is released and locks on.
Electric braking systems are weak in that the maximum braking pressure that may be applied to the brake pads is limited. This type of brake requires an electric input e.g. an EMF or the brakes cannot be applied, thus, they are not fail safe (cannot apply braking force if the power is cut off) unless a suitable source of power is available on the towed vehicle and is activated when the EMF from the towing vehicle is cut-off or disconnected.
U.S. Pat. No. 3,768,870 issued Oct. 30, 1973 to Howard describes an electrically controlled hydraulic braking system for a towed vehicle. In this system a pump is used to generate the hydraulic braking pressure in the towed vehicle and the applied brake pressure in the towed vehicle is compared with the brake pressure in the tractor or towing vehicle and the pressure in the towed vehicle is modulated to correspond with that in the towing vehicle. This system is relatively complex and has no fail safe feature.
U.S. Pat. No. 5,129,712 issued Jul. 14, 1992 the inventors Feldmann et al. discloses a braking system wherein the braking pressure applied in the towing vehicle is transformed into an electrical signal and the electric signal is used to modulate the pressure applied in the braking system on the towed vehicle. This system is also not a fail safe system.


A camera module package comprises a housing having a lens section mounted therein; a circuit board having a window through which light transmitted through the lens section of the housing passes; an image sensor that is flip-chip bonded to a lower surface of the circuit board; and an impact absorbing member attached to an upper surface of the circuit board, of which the side surface serves as a coupling guide which is coupled to an inner periphery of the housing.

1. Field of the Invention
The present invention relates to a camera module package including an image sensor module which is used in digital cameras, mobile equipments or various monitoring devices, and more specifically, to an ultra-small-sized camera module package which can obtain an excellent result at a falling test even when an ultra-slim image sensor is used.
2. Description of the Related Art
As the information communication technology rapidly develops, data communication speed is improved, and an amount of data communication is expanded. Further, an imaging device such as a CCD image sensor or CMOS image sensor is mounted on mobile electronic equipments such as mobile phones or notebooks, and thus image data as well as text data can be transmitted in real-time, the image data being taken by a camera module.
Recently, as mobile terminals tend to be miniaturized, it is urgently required to reduce the size of each part. Based on that, the mobile communication technology and the technique for electrical parts have been continuously developed. Particularly, as mobile phones having cameras mounted thereon tends to be reduced in size and thinned, a camera module package is also required to be reduced in size and thinned.
Elements determining the height of such a camera module package include a height from the upper surface of an image sensor to the upper surface of a lens and a thickness from the upper surface of the image sensor to the lower surface of an image sensor module. The height from the upper surface of the image sensor to the upper surface of the lens is determined by an applied sensor and lens design, and the thickness from the upper surface of the image sensor to the lower surface of the image sensor module is largely determined by a packaging method applied at the time of an assembling process.
As a method of packaging an image sensor for camera, there are provided a flip-chip COF (Chip On Film) method, a wire-bonding COB (Chip On Board) method, and a CSP (Chip Scale Package) method, among which the COF method and the COB method are widely used.
The COB method is a similar process to that of an existing semiconductor production line and has higher productivity than other packaging methods. However, since wire should be used for the connection with a PCB, the size of the entire module increases and an additional process is needed. Further, the thickness of the wire-bonded PCB is included in the thickness of an image sensor corresponding to the height from the upper surface of the image sensor to the lower surface thereof. Therefore, it is unfavorable in terms of the height of the image sensor module.
In the COF method, a space for attaching wire is not needed. Therefore, the area of a package and the height of a lens barrel can be reduced. Further, since a thin film or flexible printed circuit board (FPCB) is used in the COF method, a reliable package which endures an external impact can be manufactured and the process thereof is relatively simplified. Moreover, the COF method satisfies such a tendency that signals are processed at high speed, high density is required, and multiple pins are needed.
Hereinafter, a conventional camera module package manufactured by using the COF method will be described, and the problems thereof will be examined.
FIG. 1 is a front view of a camera module according to the COF packaging method.
In the COF packaging method, an image sensor is attached on one surface (lower surface) of an FPCB 300 provided with a window through which light transmitted through a lens section can pass, as shown in FIG. 1. Then, an IR filter 330 processed to have a predetermined size is attached on the surface (upper surface) opposite to the lower surface of the FPCB 330 on which the image sensor 320 is attached. After that, coupling and bonding is performed so that the outer periphery of the IR filter 330 attached to the FPCB 300 is closely attached to the inner periphery of a lower opening of the housing 200 including the lens section 100, with the outer periphery being set to a guide surface.
In general, the thickness of an image sensor used in such a COF packaging method is about 675 μm. Recently, as a semiconductor technology develops, an ultra-slim image sensor having a height of about 200 μm is used. However, when the thickness of an image sensor is drastically reduced in order to make an image sensor module ultra-slim, a chip can be damaged by stress which is applied to the image sensor at reliability evaluation such as a falling test.
In relation to the durability of a camera module package, Japanese Unexamined Patent Application Publication No. 2001-128072 and Korean Laid-Open Patent Publication No. 2003-003887 have disclosed that, when an image sensor is flip-chip bonded to an FPCB, a reinforcing member is bonded to the FPCB by an adhesive or the like so as to secure the strength of the board.
In such a technique for securing the strength of the board itself, however, the flip-chip bonded image sensor is directly exposed outside. Therefore, reliability problems such as damage of a chip still remain.
Further, in a conventional COF packing method, such elements as multilayer ceramic capacitors (MLCC) cannot be mounted so as to be positioned inside the housing of the camera module because of the IR filter attached to the FPCB, but are inevitably mounted so as to be positioned on the same surface as the surface, on which the image sensor is attached, or outside the housing. As a result, the required FPCB increases in size, thereby increasing the size of the entire image sensor module.


A temperature sensing and indicating device, comprising a housing, a microprocessor and an arm. The arm is retractable and extendible into and out of the housing, such that the length of the arm external to the housing can be varied in a predetermined manner. A probe having a temperature sensor therewithin is enclosed by the arm such that varying the external length of the arm exposes varying lengths of the probe whereby the exposed length of the probe is designed to be inserted into a medium such that the temperature sensor senses the temperature of the medium and converts the temperature sensed into a signal. Through the utilization of a programmable microprocessor, the signal is conditioned and converted and drives a display causing the display to provide a visual indication of the temperature sensed. The visual indication is comprised of a digital numeric display and an analog display.

The present invention relates, generally, to temperature sensing and indicating devices and, more specifically, to a temperature sensing and indicating device which is inserted into a particular medium in order to sense and indicate the temperature of the particular medium.
The accurate and instantaneous sensing and indicating of a medium's temperature is critically important in many industries. These industries may be industrial and chemical processes and food preparation, to name just a few. The most accurate and expedient manner in which to measure the temperature of a medium is by inserting a temperature sensing device into the medium. The basic thermometer is such a device.
The processes involved with the above-mentioned industries require very accurate and very immediate temperature sensing and indicating. The basic thermometer with its mercury bulb and tube does not provide such accuracy and immediacy. Because of this other means of sensing temperature have been developed, such as thermocouples, thermistors and diodes. These devices typically convert temperature sensed into a signal which is then sent to an instrument which converts the signal into a readable temperature display.
Although those devices are well-known in the art, they do not, by themselves provide for the accuracy and ease of use necessary for many applications. Internal variables, such as calibration requirements, or external variables, such as shock from impact, must not compromise the integrity of the accuracy of a temperature sensing and indicating device when it is being inserted into a medium. The temperature so sensed must be easily and quickly, virtually instantaneously, readable or, in some manner, indicated to the user. This is especially true in food preparation.
Traditionally, in the preparation of food substances, especially meat, such as beef, individual taste preferences dictate the cooking status. Some meat, like pork, requires cooking to a certain temperature for health and safety reasons. Recently, a deadly outbreak of E-colibacteria in hamburgers has accentuated the safety aspects involved with cooking beef, especially ground beef. The ability to check temperatures of "doneness" and critical temperatures in bacteria-control areas, such as bone joints, will help to insure proper food preparation. This will, also, help to preclude the seriously detrimental and disastrous outbreaks of the bacteria related illnesses and, correspondingly, limit the liability exposure of restaurants or private food preparers.
A device for use in food preparation is taught by U.S. Pat. No. 3,504,544 to J. Tymkewicz, a co-inventor of the present invention. The device taught in the '544 patent was an insertion type temperature sensing and indicating device. It employed a movable probe with a similarly moveable temperature sensor therewithin. This device is limited in that the movable probe resulted in stress on the wire connections of the temperature sensor, and was sensitive to physical shock if dropped or severely impacted. Also, it did not provide a means for retaining the visual indication when the device was withdrawn from the medium. Accordingly, for the user to be able to see the temperature the temperature sensor had to be kept in the medium requiring the user to be in very close proximity to the medium being sensed.
A need exists, therefore, for an insertion temperature sensing and indicating device which has a temperature sensor which safely senses the temperature of a medium, can withstand a physical shock from dropping or a severe impact and has the ability to hold the visual indication when the temperature sensor is removed from the medium.

Temperature sensing and indicating device


A knee protection airbag apparatus includes an airbag and a front panel. The front panel includes a lower panel portion and an upper panel portion. When the airbag inflates, the airbag causes the upper panel portion to move to the front, and deploys in a space on a rear surface-side of the moving upper panel portion. The upper panel portion includes a general portion of an upper portion and a ceiling wall portion of a lower portion. The lower panel portion is separate from the upper panel portion, and covers a rear side of the folded airbag. The upper panel portion includes a pressure receiving portion facing the folded airbag. The upper panel portion has the vicinity of the fixation portion of the general portion as a bending deformation portion that bends when the upper panel portion moves to the front along with the inflation of the airbag.

1. Field of the Invention
The present invention relates to a vehicle mounted knee protection airbag apparatus that can protect the knees of an occupant sitting in a vehicle.
2. Description of Related Art
As illustrated in FIGS. 1 to 4 and FIG. 7 disclosed in JP-A-8-80797, a knee protection airbag apparatus of the related art has a space for deployment and inflation of an airbag formed in front of the knees of an occupant during an operation of the airbag. The airbag apparatus includes the airbag and a front panel. The airbag is accommodated in a folded state in front of the lower limbs of the sitting occupant. The front panel is provided in front of the lower limbs of the occupant along a substantially vertical direction. The front panel includes a lower panel portion and an upper panel portion. The lower panel portion is disposed on a rear side of an accommodation portion for the airbag. The upper panel portion extends upwardly from the lower panel portion. In the airbag apparatus, when the airbag inflates, the upper panel portion of the front panel moves to the front. In the airbag apparatus, the airbag deploys and inflates in the space formed on a rear surface-side of the moving upper panel portion.
More specifically, in the airbag apparatus, the upper panel portion includes a ceiling wall portion (an upper cover) and a general portion (a movable lower cover). The ceiling wall portion is disposed above the folded airbag along a horizontal direction. The general portion extends upwardly from a rear end of the ceiling wall portion. Furthermore, a front end of the ceiling wall portion is joined to an integral hinge that is provided on an upper surface of the accommodation portion for the airbag. A notched groove is provided in the rear end of the ceiling wall portion, and the rear end of the ceiling wall portion is joined to a lower end of the general portion. A notch-grooved portion of the ceiling wall portion can be bent and inverted. A hinge portion is provided in an upper end of the general portion, and the upper end of the general portion is joined to the vehicle body via the hinge portion. In the airbag apparatus, when the airbag inflates, first, the ceiling wall portion is pushed by the airbag, and turns upwardly to the front, having the hinge portion of the front end as a turning center. The notch-grooved portion is inverted by the turning, and the general portion connected to the rear end of the ceiling wall portion also moves in a state of being connected to the ceiling wall portion. That is, the general portion moves to the front, while turning with the hinge portion of the upper end as the turning center. For this reason, a space for the deployment and inflation of the airbag is formed on a rear side of the general portion that moves to the front.
JP-A-8-80797 (refer to FIG. 6 in JP-A-8-80797) also discloses a configuration in which a locking portion is provided in the rear end of the ceiling wall portion so as to be separable from the lower end of the general portion. In the airbag apparatus having this configuration, when the airbag operates, the general portion separates from the rear end of the ceiling wall portion, and moves to the front. For this reason, the space for the deployment and inflation of the airbag is formed on the rear side of the general portion.


With a display device using a pixel which includes a sub-pixel, the display device with improved viewing angle and quality of moving image display is provided without increase in power consumption by driving of the sub-pixel. A circuit which can change conducting states by a plurality of switches is provided, and charge in a plurality of sub-pixels and a capacitor element is transported mutually, so that desired voltage is applied to the plurality of sub-pixels without applying voltage in plural times from external. Moreover, a period in which each sub-pixel displays black is provided in accordance with transfer of charge.

A liquid crystal display device has some advantages such as thin, light weight, low power consumption, or the like, compared to a display device using a cathode-ray tube. Further, since a liquid crystal display device can be widely applied to from the small-sized display device having a few inches of diagonal of a display portion to the large-sized display device having more than 100 inches, the liquid crystal display device is widely used as a display device of various electronic devices such as a mobile phone, a still camera, a video camera, a television receiver, and the like.
While the liquid crystal display device has excellent general versatility, there is a problem in that image quality is low compared to other display devices such as CRT and the like. The causes include: decrease of image quality when it is watched from an oblique angle due to large viewing angle dependence of display; low contrast because of leakage of the light from the backlight; low quality of moving image because of slow response speed, or the like.
However, image quality has been improved by development of a new liquid crystal mode in recent years. Instead of twisted nematic (TN) mode which has been conventionally used, the following various liquid crystal modes are developed and are put into practical use: an in-plane-switching (IPS) mode and an fringe field switching (FFS) mode which has excellent viewing angle characteristics, a vertical alignment (VA) mode which have high contrast ratio, an optical compensated birefringence (OCB) mode of which response speed is fast and quality of moving display is high, and the like.
Here, while the VA mode liquid crystal display device is easy to increase contrast ratio, there has been a problem that viewing angle dependence of display is still large. Therefore, multi-domain VA (MVA) mode and patterned VA (PVA) mode are developed by which a pixel is divided into a plurality of domains, and orientation of liquid crystal is changed in each domain so that wider viewing angle is realized. However, even if such a multi-domain method is used, enough viewing angle characteristics are not obtained.
Thus, patent document 1 (Japanese Published Patent Application No. 2003-295160) proposes to divide a pixel into a plurality of sub-pixels, and different signal voltages are applied to each sub-pixel, so that viewing angle dependence of display is averaged to increase viewing angle.

Display device and driving method thereof

Semiconductor Energy Laboratory Co., Ltd.


A thermoform packaging machine comprising, as work stations, a forming station for thermoforming troughs in a packaging film, at least one sealing station for sealing the troughs with a cover film, and a cutting station as well as a feeding device for causing a feed of the packaging film. A method for using such a thermoform packaging machine wherein a controller determines for two or more work stations, prior to a process step, which required feed length each of these work stations has, the required feed length indicating the distance by which the packaging film will have to be conveyed for the next process step of the respective work station, before a feed length specification is ascertained from the required feed lengths determined and the feeding device is controlled accordingly.

A thermoform packaging machine of the generic kind is disclosed e.g. by DE 10 2015 211 622 A1. Such packaging machines are characterized by a forming station for thermoforming troughs in a packaging film and comprise normally a sealing station for sealing the thermoformed troughs with a cover film as well as a cutting station for separating the produced packages from one another. In addition, these machines comprise a feed unit for causing a feed of the packaging film.
In most cases, such a thermoform packaging machine is operated intermittently or cyclically. In each work cycle, the packaging film is advanced using the feed unit by a constant, fixedly predetermined feed length. In this case, the feed length is also referred to as "unwinding length". It indicates which length each packaging format produced in a single work cycle has in the production direction of the thermoform packaging machine.
In order to be able to actually keep the feed length exactly constant from one work cycle to the next, enormous efforts are sometimes made. DE 42 16 209 C2, for example, describes a thermoform packaging machine in which the packaging film is provided with so-called print marks at regular intervals. After these print marks have been detected using a suitable print mark sensor, the position of various work stations in the packaging machine according to DE 42 16 209 C2 can be changed in the longitudinal direction of the packaging machine, so that the work stations will be set to the ideal position relative to the print marks. The feed length of the packaging film can thus remain constant in each work cycle. In the machine according to EP 2 860 119, however, the length of a film feed with respect to an exact target position is controlled in the sealing station alone.

Thermoform packaging machine and method of operating a thermoform packaging machine


A working machine control device for construction machinery provided with a plurality of joined working arms, an attachment mounted to the leading end of the working arms and a plurality of actuators for driving the working arms and the attachment, includes a function to adjust a pushing force between the attachment and a working plane by automatically controlling at least one of the actuators. The control device also includes a load detecting unit for detecting a load applied from the working plane to the attachment, working machine posture detecting devices for detecting postures of the working arms and the attachment and a computing unit for computing the pushing force between the attachment and the working plane on the basis of output values from the load detecting unit and the working machine posture detecting devices. The computing unit outputs a component of the pushing force in a direction perpendicular to the working plane. A target value setting unit is also provided for setting a target of a component of a pushing force suitable for working in the direction perpendicular to the working plane. A drive control unit automatically controls at least one of the plurality of actuators so that the computed result of the computing unit agrees with the target value set by the target value setting unit.

1. Field of the Invention
The invention relates to a working machine control device for construction machinery such as a power shovel, by which a pushing force between a working plane and a working attachment can be varied as required and a working plane profiling function is realized to let the working attachment automatically follow along the working plane.
2. Description of the Related Art
Where construction machinery such as a power shovel is used to perform dusting to remove dust and trash from the ground surface or rolling compaction to compact the soft ground, the working plane profiling function is generally performed to let the working attachment automatically follow along a working plane.
The working plane profiling function is generally performed by having a boom (and an arm) in so-called floated state to passively move a working machine depending on a load.
However, the profiling control utilizing the floated state is not effective to apply a relatively large pushing force to the working plane, and the pushing force cannot be set to an arbitrary value.
The power shovel is often provided with a horizontal excavating function to level the ground. The horizontal excavating function drives the boom automatically so as to keep the arm end point or the bucket blade end point at a predetermined height in correspondence with manual operation of the arm and the bucket. Specifically, the horizontal excavating function controls to always keep the arm end point or the bucket blade end point at the same absolute height regardless of irregularities of the ground. Therefore, the horizontal excavating function cannot be used for the dusting work to remove dust and trash from the uneven ground or for the rolling compaction work.
The invention was achieved in view of the above circumstances and aims to provide a working machine control device for construction machinery, which enables to achieve working by an arbitrary pushing force.
The invention also aims to provide a working machine control device for construction machinery, which enables to achieve profiling work by an arbitrary pushing force with a relatively simple configuration without requiring delicate manipulation by an operator.

Working machine control device for construction machinery


A seal assembly for an overhead-storing door seals the horizontal joints between adjacent panels of the door. The panels are pivotally interconnected at the joints to allow the door to open and close by traveling along a set of lateral tracks that curve between horizontal and vertical. The door closes in the vertical position, and stores horizontally overhead. The seal assembly can also be used for sealing the leading edge of the door panel that closes against the floor. The seal assembly includes a seal holder with a T-shaped anchor that engages a complimental T-shaped seal-receiving opening in a foam core of at least one of the door panels. The seal holder includes shaped grooves for attaching a flexible U-shaped seal member and, if desired, for inserting a reinforcing bar that increases the rigidity of the seal holder. In attaching the seal member to the seal holder, the T-shaped anchor slides in a first direction into the mating seal-receiving opening in the foam core. The sliding fit in a first direction provides a positive connection in another direction perpendicular to the first. This ensures that the seal holder is held firmly in place when in use, yet is readily installed or replaced.

1. Field of the Invention
The subject invention generally pertains to sectional doors and more specifically to a seal for such a door.
2. Description of Related Art
A sectional door typically includes a series of panels that are pivotally interconnected at horizontal joints. As the door opens or closes, the door panels travel along two lateral tracks that, in one configuration, curve between horizontal and vertical. To close the door, the tracks guide the panels to a vertical position, and seals are often disposed between the panels to help close any gaps that may exist along the horizontal joints. When the door opens, the pivotal joints allow the panels to curve around onto the horizontal section of the tracks, where the door panels store horizontally overhead. However, in some cases, the door panels store above the doorway in a generally vertical position or at a slight angle to the wall. Such doors can be powered up or down, or can be manually operated. To ease the operation of the door, a torsion spring is often used to offset the weight of the door panels. Overhead-storing doors are commonly used as a residential garage door; however, they are also often used in warehouses and other industrial buildings.
When used in high-traffic industrial applications, overhead-storing doors are very susceptible to being struck by large trucks, trailers, forklifts and other vehicles passing through the doorway. Sometimes, an upper edge of a vehicle may catch the lowest panel of the door, which often damages that panel. This tends to occur when the door""s torsion spring becomes weak with age or is not properly preloaded. A weak or loose spring allows the door to droop or not open fully. Ideally all the panels, but especially the lowest one, have sufficient flexibility and resilience to recover from the impact of a vehicle. Unfortunately, the very features that make a door panel flexible can also make it difficult to firmly attach a seal along the panel""s horizontal edges.
For example, some door panels have a lightweight foam core bonded between two tough outer sheets. Such a construction offers great thermal insulation, excellent impact resistance, and minimizes the weight of the panel. Although seals can be firmly anchored to the inside of the two outer sheets, as disclosed in U.S. Pat. No. 4,676,293, it would be easier and simpler to attach the seal directly to the core of the panel if possible. Moreover, in some cases it may be desirable to have a seal that is readily replaceable. However, foam by itself is relatively weak structurally and does not lend itself well to conventional seal anchoring means, such as those disclosed in U.S. Pat. No. 5,365,993. A press fit connection, as shown in FIG. 35 of the ""993 patent, or intermittent anchors, such as the screws shown in FIG. 36 of the ""993 patent, may be acceptable for a solid wood door; however, such anchoring means might easily release when used on a foam door panel.
In order to provide a readily replaceable seal for a door panel having a foam core, a door seal assembly includes an extruded seal holder that slidingly engages the foam core. An anchor portion of the seal holder slides in a first direction into a mating seal-receiving opening in the foam. The sliding fit in a first direction provides a positive connection in another direction perpendicular to the first. This ensures that the seal holder is held firmly in place when in use, yet is readily installed or replaced.
In some embodiments, a door seal assembly includes a unitary seal holder that is readily manufactured using a plastic extrusion process.
In some embodiments, the door seal assembly includes a seal that slidingly engages a seal holder.
In some embodiments, a metal bar is attached to the seal holder to increase the rigidity of the seal holder.
In some embodiments the door panel includes a foam core bonded between two face panels.


An overflow preventer comprising a plug receivable in a drain hole and provided with a valve movable between a first closed position and a second open position, the valve being resiliently biased to the first position while the pressure on the valve is less than a predetermined value.

This invention relates to an overflow preventer primarily but not exclusively for baths and sinks.
Baths and sinks may be provided with overflows which direct excess water to a drain. The overflow may however not be able to cope with the flow of water and spillage may still occur.
GB 2 261 600 (Lewis) describes an overflow preventer in which passage of water through a conduit attached to the overflow causes the plug to be displaced from the overflow. The arrangement is very expensive to make and fit. Furthermore when the preventer is actuated its action is irreversible. This means that if a bath is filled rather full and a bather displaces water so that some passes through the overflow the device will be actuated and unless reset all the water will drain from the bath leaving the bather high and dry.
According to some embodiments of the invention there is provided an overflow preventer comprising a plug receivable in a drain hole and provided with a valve movable between a first closed position and a second open position, the valve being resiliently biased to the first position while the pressure on the valve is less than a predetermined value.
The valve may be resiliently biased for example by a spring such as a compression spring or a tension spring.
The valve may be a annular valve. A circumferential valve seat may be provided in the plug. The valve may be provided with an O-ring for sealing on the seat of the valve body. The plug may comprise resilient plastics material. The outer circumference may be provided with an O-ring to engage sealingly with the plug hole.


A bootstrap circuit suitable for use in driving the word line of a FRAM.RTM. memory circuit is energized by a VDD power supply voltage. The bootstrap circuit includes a first N-channel MOS transistor wherein the source/drain forms the input of the circuit. A second N-channel MOS transistor is included wherein one of the source/drains receives a clock signal, and the other source/drain forms the output, which drives the word line. The gate of the second transistor is coupled to the other source/drain of the first transistor. The bootstrap circuit includes further circuitry for generating a voltage greater tan the VDD power supply voltage that is coupled to the gate of the first transistor. A capacitor or capacitor-connected transistor is coupled between the input and the gate of the first transistor, and a third transistor has one source/drain coupled to the gate of the first transistor, and the other source/drain receives a control signal, and the gate is coupled to the VDD power supply. The bootstrap circuit is operational even for VDD power supply voltages less than or equal to 3.3 volts.

This invention relates generally to integrated circuit memories, and, more particularly, to a bootstrapped word line decoder circuit for providing voltages at or above a full VDD potential to a word line load.
This application is related to a copending application assigned to the assignee of the present application entitled "Bootstrapping Circuit Utilizing a Ferroelectric Capacitor", Ser. No. 08/620,799, filed on Mar. 28, 1996, which is hereby incorporated by reference.
There are many bootstrapping circuits in existence, which are generally known to include capacitive coupling for the purpose of increasing the voltage on a gate of an NMOS transistor so that one source/drain node of the NMOS transistor can deliver the full voltage on the other source/drain node, usually a VDD power supply voltage. Some prior art bootstrapping circuits rely on a large chargestorage element to supply the necessary charge during the bootstrapping operation. These circuits therefore do not lend themselves to being used in "pitched" circuitry, which is necessary for a compact layout configuration. Another problem in prior art bootstrapping circuits is that they become inoperable under low power supply voltage conditions, i.e. power supply voltages less than or equal to 3.3 volts. This is especially true for situations wherein the threshold voltage, V.sub.TH, of the MOS transistors used becomes equal to 50% of the operating power supply voltage VDD.
Turning now to FIG. 1, a portion of a typical memory architecture 10 is shown. Memory architecture 10 includes an address buffer 16 for receiving a control signal designated CNTRL SIG on line 12 and an external address bus designated EXT ADD on bus 14. Address buffer 16 generates internal address signals designated INT ADD on bus 18, which is received by an address decoder 20. Address decoder 20 generates decoded word line address signals designated AI, AJ, and AK, on lines 22, 24, and 26, respectively. The decoded word line address signals are received by multiple word line decoders, one for every row of memory cells in memory array 44. Four representative word line decoders 28, 30, 32, and 34 are shown in FIG. 1, designated WL DECODER 1, WL DECODER 2, WL DECODER N-1, and WL DECODER N, respectively. The outputs of the word line decoders are designated WL1, WL2, WLN-1, and WLN on word lines 36, 38, 40, and 42, respectively. Word lines 36-42 are coupled to a memory array 44. The rows and columns of memory cells in memory array 44 are not shown. Two control signals designated CTL and WLCLK are generated by a control and timing logic block 46. The CTL signal is a control signal on line 50, and the WLCLK signal is a clock signal on line 52.
Turning now to FIG. 2, the schematic diagram for a typical prior art word line decoder 28 is shown. Word line decoder 28 is suitable for in-pitch layout, but has low voltage performance problems as is further described below. Address signals AI, AJ, and AK are received at nodes 22, 24, and 26 by a three-input NAND gate 60. The output of NAND gate 60 is coupled to one input of a two-input NOR gate 62. The other input of NOR gate 62 receives the CTL control signal at node 50. The output of NOR gate 62 is coupled to a source/drain (current node) of transistor 66 through line 64. The signal on line 64 is designated WLEN. The gate (control node) of transistor 66 is coupled to the VDD power supply voltage. The other source/drain of transistor 66 is coupled to the gate of transistor 70 through line 68. The signal on line 68 is designated WL'. One source/drain of transistor 70 receives the WLCLK signal at node 52 and the other source/drain of transistor 70 is the output of word line decoder 28 coupled to a word line at node 36.
In operation, a word line is selected when all three address signals are high. Some time after the word line is selected the CTL signal is activated, which isolates transistor 66. Some time after the CTL signal is activated, the WLCLK signal is activated, which bootstraps the WL' voltage to a voltage greater than the VDD power supply voltage, assuring that the full pulsed value of the WLCLK signal (the VDD power supply voltage, typically five volts) appears at the output on node 36.
While the prior art word line decoder described above will provide the full VDD power supply voltage to the selected word line when a five volt power supply is used, performance becomes compromised when the power supply voltage is dropped to 3.3 volts or less. At these low voltages, which can actually be specified to as low as about 2.5 volts, the body-affected threshold voltage, V.sub.TH, of the transistors used in the design can become a significant portion of the available voltage. When V.sub.TH is about 50% of VDD, word line decoder 28 becomes inoperable. Since the gate of transistor 66 is coupled to VDD, the voltage WL' on line 68 will be VDD--V.sub.TH, which is approximately equal to V.sub.TH under low voltage conditions. Since the output at node 36 is also required to be driven above ground (preferably to VDD volts), there is no voltage to turn on transistor 70 and word line decoder 28 becomes inoperable.
What is desired, therefore, is a word line decoder that maintains the useful qualities of the prior art word line decoder circuit described above, such as all N-channel transistors in the main signal path, and an in-pitch layout configuration, but that is able to operate at very low VDD voltage conditions less than or equal to 3.3 volts.


A semiconductor package includes a substrate, a chip, and at least one capacitor. The chip adheres to the substrate and has an active surface, a grounding area disposed on the active surface and at least one power pad mounted on the active surface. The capacitor is disposed on the grounding area of the chip and has a power end and a grounding end electrically connected to the grounding area. At least one bonding wire electrically connects the power end of the capacitor to the power pad.

1. Field of the Invention
The present invention generally relates to a semiconductor package, and more particularly to a semiconductor package including at least one chip capacitor directly mounted on a grounding area of a chip.
2. Description of the Related Art
According to either a single-chip package or a multi-chip package, passive components, such as inductance, resistance and capacitor, are generally integrated with the packaged chip on a substrate or a leadframe, such that the integrated circuit of the package meets the specific electrical requirement. The above-mentioned passive component is mounted on the peripheral area of the substrate or the leadframe outside the chip. For example, the object of installation of a chip capacitor is to connect a power end and a grounding end of a circuit system so as to stabilize the circuit system by means of the decoupling function of the chip capacitor.
Referring to FIG. 1, a conventional semiconductor package 2 includes a chip 10 and a leadframe 20. The leadframe 20 has an unoccupied area 22 which is not occupied by the chip 10. A plurality of chip capacitors 30 are mounted on the unoccupied area 22 of the leadframe 20. A plurality of first bonding wires 12 are used for electrically connecting a plurality of power pads 14 of the chip 10 to power ends 32 of the chip capacitor 30, and a plurality of second bonding wires 34 are used for electrically connecting the power ends 32 of the chip capacitor 30 to a plurality of first leads 24 of the leadframe 20. A plurality of grounding pads (not shown) of the chip 10 are electrically connected to grounding ends 36 of the chip capacitors 30, and the grounding ends 36 of the chip capacitors 30 are electrically connected to a plurality of second leads 26 of the leadframe 20. Referring to FIG. 2, another conventional semiconductor package 50 includes a chip 60 and a substrate 70. The substrate 70 has an unoccupied area 72 which is not occupied by the chip 60. The substrate 70 further has a power ring 74 and a grounding ring 76, wherein the power ring 74 and the grounding ring 76 both are disposed on the unoccupied area 72. A plurality of chip capacitors 80 are mounted on the unoccupied area 72 of the substrate 70 and have power ends 82 and grounding ends 86, wherein the power ends 82 and grounding ends 86 are electrically connected to the power ring 74 and the grounding ring 76, respectively. A plurality of first bonding wires 62 are used for electrically connecting a plurality of power pads 64 of the chip 60 to the power ends 82 of the chip capacitor 80, and a plurality of second bonding wires 66 are used for electrically connecting a plurality of grounding pads 68 of the chip 60 to the grounding ends 86 of the chip capacitors 80. However, the arrangement of above-mentioned conventional semiconductor packages 2, 50 enlarges the size of the whole semiconductor package.
U.S. Pat. No. 5,633,785, entitled "Integrated Circuit Component Package with Integral Passive Component", discloses an interconnect substrate which is used and a plurality of passive components which are integrally formed therein, incorporated herein by reference. However, it is necessary to have an extra area of substrate for the structure which includes integrated circuit (IC) components integrated with the passive components, wherein the extra area is used for accommodating the passive components, such that the above-mentioned structure is enlarged or more complex, and further the packaging process is more difficult and has a higher cost.
U.S. Pat. No. 6,611,434, entitled "Stacked Multi-Chip Package Structure With On-Chip Integration Of Passive Component", discloses a stacked multi-chip package, incorporated herein by reference. Passive components of the stacked multi-chip package are mounted on an unoccupied area of the underlying semiconductor chip which is unoccupied by the overlying semiconductor chip, and thus the structure of the whole semiconductor package is tighter in size. However, according to the high density of semiconductor package, the unoccupied area still results in the limit of space.
U.S. Pat. No. 6,005,778, entitled "Chip Stacking And Capacitor Mounting Arrangement Including Spacer", discloses a multi-chip package, incorporated herein by reference. The multi-chip package includes a first chip, a second chip and a spacer which separates the first chip and second chip. The spacer provides for the first chip grounding in one application and provides for capacitors mounting in another application. The spacer has a top surface and a tiered surface which is electrically connected to the top surface. The passive component is mounted on the top surface of the spacer and has a conductive end and a grounding end which is electrically connected to the top surface. The conductive end and the tiered surface are electrically connected to a grounding pad and a power pad by means of bonding wires, respectively. The grounding pad and power pad are disposed on the first chip and are electrically connected to an external grounding pad and an external power pad by means of bonding wires, respectively. Also, the external grounding pad and external power pad are disposed on the area outside the first chip, such as on a substrate. However, the structure of the above-mentioned multi-chip package is complex and further the packaging process is more difficult and has a higher cost.
Accordingly, there exists a need for a semiconductor package capable of solving the above-mention disadvantages, and the semiconductor package includes at least one chip capacitor directly mounted on a grounding area of a chip and further has a compact structure.


A camera wherein the photographed picture size can be switched and is formed mostly of a magnification variable finder optical system, a photographed picture size switching mechanism and a finder visual field frame switching mechanism. When the picture size is switched by operating the photographed picture size switching mechanism, the finder magnification will be altered to a magnification corresponding to the picture size through a finder cam as operatively connected with the operation and at the same time the finder visual field frame will be also altered in conformity with the finder magnification and picture size. According to this camera, for example, even if the picture frame becomes narrow, the finder magnification will be elevated by switching the picture size and further the image will be made easy to observe by expanding the finder visual field frame.

1. Field of the Invention
This invention relates to cameras and more particularly to a magnification variable camera which has a photographed picture size switching mechanism so that the size of the photographed picture may be variable.
2. Related Art Statement
Recently the functions of cameras are multiple and switching a photographed picture size is one of them. Such switching of a photographed picture size relates to switching, for example, a normal size to a half size or to a panorama size. In such camera, the visual field of the finder must be switched as operatively connected with the switching of the photographed picture size. Numerous suggestions have been made on these switching mechanisms.
The disclosure in the publication, for example, of Japanese patent application laid open No. 207731/1989 relates to a technique of a zooming driving system of a photographing lens and a zooming driving system of a finder operatively connected with it. According to these systems, it is possible to operatively connect a finder visual field frame with the switching of the above mentioned photographed picture size by adding a photographed picture size switching mechanism.
However, in the disclosure in this publication, only the finder visual field frame is merely driven as operatively connected with the switching of the photographed picture size and the picture of the finder becomes so small as not to be desirable in use. FIG. 43 shows a finder visual field frame Fn at the time of the normal photographing with the camera, that is, at the time of photographing a normal size picture. FIG. 44 shows a finder visual field frame Fp1 showing that, when a photographed picture size is switched to a half size use, the finder visual field frame will be also switched as operatively connected. This visual field frame Fp1 is of a picture in which the finder magnification is not varied but is merely made narrow and therefore has a disadvantage that the observation with it is difficult.
The disclosure in the publication of another Japanese patent application laid open No. 107240/1989 relates to a means for switching a finder visual field and finder magnification at the time of trimming, that is, at the time of switching a photographed picture size. However, the means for switching the finder magnification is to switch the magnification of the finder eyepiece.
However, in the disclosure in this publication, when the photographed picture size is switched, simultaneously with switching the finder visual field, the magnification of the finder eyepiece will be made large. However, in order to enlarge the magnification of the finder eyepiece, the structure of the eyepiece will inevitably become complicated and large. Usually, such eyepiece is arranged in the upper part of the back surface of the camera. If this part becomes large, it will be disadvantageous in utilizing and carrying the camera. If the finder magnification is made extremely large, the strain and dust on the image forming surface of the finder will be observed as magnified, the precision in making the finder will have to be further improved. the dust will have to be more carefully prevented in assembling and therefore the problem of the high cost will be produced.
The photographing area converting apparatus in a camera disclosed in the publication of Japanese utility model application publication No. 25058/1960 relates to a full size and half size photographed picture switching mechanism switching by operatively connecting a real picture mask and finder mask by a manual operation.
In the apparatus disclosed in this publication, the size is switched by a manual operation and therefore can not be switched by one touch by the user and, in case the required operation amount of the operating member is large, a large operating member space will have to be provided in the outer appearance part of the camera body and there will be such disadvantage that a restriction will be produced to the design. Further, in the apparatus disclosed in the publication, when the picture size is switched from the full size to a half size, the finder visual field will be covered on both sides so as to be for a half size. In such case, the finder visual field will be so small as to be disadvantageous to finder observation.
In the camera aiming at a pseudo telescopic effect disclosed in U.S. Pat. No. 743,470, when the telescopy with the full size is exceeded, the real picture will be switched to a trimming mode and, at the same time, the finder will be elevated in the magnification with the visual field frame constant as it is to set it on the narrow telescopy side. However, in the disclosure in this publication, the zooming region of the finder system can be set as expanded to be larger than the zooming region of the photographing optical system and its effect can be developed only in the trimming region exceeding the telescopy limit of the photographing optical system. Therefore, there is no effect on setting the picture size within the zooming region of the photographing optical system.


A laparoscopic surgical technique for performing an anastomosis comprises the steps of disposing a laparoscopic trocar sleeve in a patient's abdominal wall, inserting a distal end of a laparoscopic instrument into an abdominal cavity of the patient through the trocar sleeve, and manipulating the instrument from outside the patient to loop a purse-string-type suture through a free end of a first severed intestinal segment of the patient. In other steps of the laparoscopic surgical technique, a flexible anastomosis-forming device is inserted through the patient's rectum so that an end cap at a distal end of the anastomosis device protrudes from a free end of a second severed intestinal segment of the patient. The anastomosis-forming device is shifted further through the patient's rectum so that the end cap is inserted into the first severed intestinal segment through the free end thereof. During the shifting of the end cap, the first severed intestinal segment is held with a laparoscopic tool from outside the patient to facilitate insertion of the end cap into the first severed intestinal segment. Upon insertion of the end cap into the first severed intestinal segment, the purse-string-type suture is drawn via a laparoscopic member to close the free end of the first severed intestinal segment about the end cap. The anastomosis-forming device is operated from outside the patient to connect the intestinal segments to one another in an anastomosis.

Anastomosis staplers generally include multiple rows of staples, with a cutting blade disposed between adjacent rows. The blade is actuated subsequently to the firing of the staples.
There are at least two kinds of anastomosis operations. Linear gastro-intestinal anastomoses involve the use of linear multiple-fire surgical staplers which can sever, for example, an intestine while applying rows of staples to the severed organ on opposite sides of the cut. End-to-end or intra-luminal anastomoses involve the insertion into a tubular organ (e.g., an intestine) of staplers with circular arrays of staples fired in an axial direction.
Linear anastomoses staplers have multiple staples in linear arrays. The staples are fired between jaws which are maintained in a closed configuration during the firing of the staples. The staples are fired sequentially by an ejector rod with a camming surface at a distal end. As the rod is pushed in the distal direction, the staples are pushed in sequence from one jaw against the other jaw, which serves to close the staples in a conventional process.
During an end-to-end or intra-luminal anastomosis operation for connecting ressected bowel sections, a stapling member at the distal end of a rigid metal tube is inserted through a patient's rectum so that the stapling member is flush against a closed free end of an intestinal segment. Through an open-abdomen incision, an anvil member is inserted into another intestinal segment which is then closed at the free end, e.g., by a purse string suture which has been sewn around the mouth of the organ. The anvil member is then connected to the stapling member through the closed ends of the intestinal segments. The anvil member and the stapling member are brought close to one another via a screw mechanism in the metal tube, thereby clamping the closed ends of the intestinal segments to one another between the anvil and the stapling member. Subsequently, staples are ejected from the stapling member in a circular array, while the closed ends of the intestinal segments are cut along the array of staples, thereby forming an internal opening between the connected segments of intestine.
The above-described operation is open abdominal surgery and involves all of the procedures and safeguards necessary for such surgery. For example, because of extensive blood loss, the patient may have have to be provided with a transfusion.

Laparoscopic or endoscopic anastomosis technique and associated instruments


A method of producing a nanobasket and the applications or uses thereof. The method includes the steps of providing a substrate with at least one (1) pore having diameters of about one (1) nanometer to about ten (10) micrometers. Material is deposited by sputter-coating techniques along continuous edges of the pores to form a capped or partially capped nanotube or microtube structure, termed a nanobasket. Either a single material may be used to form nanobaskets over the pores or, alternately, a layered structure may be created wherein an initial material is deposited followed by one or more other materials to form nanobaskets over the pores.

1. Field of the Invention
The present invention is directed to fabrication of nanotube structures iii the form of nanobaskets by sputter deposition on porous substrates and their uses in various applications.
2. Prior Art
The potential of nanotechnology to provide new technological breakthroughs is the object of much current attention. Nanostructured materials have the potential for enhanced properties and efficiency improvements in virtually every area of science and technology through enhanced surface areas and quantum-scale reactions. This disclosure deals with the formation of novel nanoscale structures that have numerous potentially important applications.
An example of an application for nanotube structures is found in Assignee's U.S. Pat. No. 6,586,133 for "Nano-Battery Systems" issued Jul. 1, 2003. The patented disclosure is directed to nano-batteries and micro-batteries as well as their manufacture and use. Porous substrate technology is utilized wherein the substrate has a plurality of holes or pores that range in diameter between ten (10) micrometers to one (1) nanometer (nm).
Nanoscale or microscale deposition of particles by a sputtering process is also known. The process of sputtering may be defined as the ejection of particles from a condensed-matter target due to the impingement of energetic projectile particles. Operatively, the source of coating material, referred to as the target, is mounted opposite to the sample, in this case a porous substrate in a vacuum chamber. The most common method of generating ion bombardment is to backfill the evacuated chamber with a continual flow of gas and establish a glow discharge, indicating that ionization is occurring. A negative potential applied to the target causes it to be bombarded with positive-ions while the substrate is kept grounded. Impingement of the positive ion projectile results in ejection of target atoms or molecules and their deposition on the substrate.
One of the most useful characteristics of the sputtering process is its universality: virtually any material is a coating candidate. Sputtering systems assume an almost unlimited variety of configurations, depending on the desired application. DC discharge methods are often used for sputtering metals, while an RF potential is used for nonconducting materials. Ion-beam sources can also be used. Targets may be elements, alloys, or compounds, in either doped or undoped forms, and can be employed simultaneously or sequentially. The substrate may be electrically biased so that it too undergoes ion bombardment. A reactive gas may be used to introduce one of the coating constituents into the chamber, i.e. oxygen to combine with sputtered tin to form tin oxide (reactive sputtering). (Bunshah, Rointan F., "Handbook of Deposition Technologies for Films and Coatings: Science Technology and Applications", 2nd Ed., Noyes Publications, 1994.)
A recent study of nanostructures fabricated by RF sputtering of barium strontium titanate (BST) on porous alumina substrates suggests that the sputtered material does not penetrate into pores. It has been observed that the deposited material preferentially gathers along the continuous circular edge of pore openings. (Elena D. Mishina et al., "Ferroelectric Nanostructures Sputtered On Alumina Membranes", Physica E., 25 (2004) 35-41.
Another, similar study refers to this type of sputtered metal structure as "antidots." (Vovk, A., et al, "Preparation, structural characterization, and dynamic properties investigation of permalloy antidot arrays.", J. Appl. Phys., 97, 10.1506 (2005)) These differ from the structures claimed in this patent, in that the structures are not partially or complete capped, nor are they layered, and they are formed only from metals. Nor were the "antidots" used to assemble any sort of device.
Nanotubes and other nanostructures may be formed as large arrays, and in this form are often referred to as nanoporous or mesoporous structures. "Meso-porous" tin oxide structures have been created using surfactant templating techniques. (Qui, Limin, Ma, Jiming, et. Al., "Sythesis and Characterization of Mesostructured Tin Oxide with Crystalline Walls", Langmuir, 14(9) 2579-2581, (1998)) The resultant material, however, consists of material containing irregular nanopores averaging about two (2) nm in size, without long-range order. It is markedly different from the invention claimed in this patent, which can be formed in large arrays of tunable pore sizes, which develops wall height as well as porosity, and which can be partially or completely capped to form the basket structure.
An additional unique aspect of the present invention is that it has been found to have a substructure of very small nanoparticles, i.e., the walls and caps of the basket are themselves composed of nanoparticles ten (10) nm and less in size. (P. Johnson and D. Teeters, Solid State Ionics (2006), in press) Numerous scientific studies attest to the importance of nanoparticulate grain size in performance characteristics of electronic, optical, and catalytic devices.
The use of sputter techniques to create partially or completely capped and/or layered nanotube structures is believed to be unique and opens a wide range of potential applications.
Accordingly, it would be desirable to produce a nanotube structure wherein at least one end of a nanotube is partially or completely closed or covered over so that the nanotube forms a nanobasket.
It would also be desirable to form a nanobasket by sputter deposition.
It would be desirable to form a large array of nanobaskets as a nanoporous architecture.
It would also be desirable to fabricate nanobaskets as a component of photovoltaic devices.
It would also be desirable to provide nanobaskets for use in battery systems.
It would also be desirable to provide nanobaskets for use as a catalytic device.
It would also be desirable to provide nanobaskets for use in optoelectronic devices.
It would also be desirable to provide nanobaskets for use in fuel cell assemblies.
It would also be desirable to provide nanobaskets for use as human bone mimics and tissue scaffolding.

Fabrication of nanobaskets by sputter deposition on porous substrates and uses thereof


A barbecue grill apparatus is provided for cooking food items, including a housing having a housing bottom wall and a housing side wall, an upright grill support member extending centrally within the housing, and at least two food supporting grid sections mounted one above the other on the grill support member, at least one of the food supporting grid sections being mounted rotatably relative to the other food supporting grid section, so that one of the grid sections is rotatable to a position underneath another of the food supporting grid sections. The apparatus preferably additionally includes a fuel supporting grid mounted to the grill support member below the at least two food supporting grid sections and spaced above the housing bottom wall. The apparatus preferably further includes lid and grid section elevation structures for raising and lowering the support member within the housing to any one of several discrete support member elevational positions and for releasibly retaining the support member and lid at a given the elevational position. A method of cooking a food item with the barbecue grill includes the steps of placing the food item on one of the food supporting grid sections, and rotating the food supporting grid sections so that the other food supporting grid section extends at least partially directly over the one food supporting grid section, so that the food item extends between and abuts both of the one and the other food supporting grid section.

1. Field of the Invention
The present invention relates generally to the field of outdoor cooking equipment. More specifically the present invention relates to a barbecue grill apparatus including a housing having bottom and side walls and containing one, and preferably two food supporting grid sections rotatably mounted one above the other on an upright central grill support member, and a fuel supporting grid encircling the support member below the food supporting grid sections and spaced above the housing bottom wall. One food supporting grid section is rotatable underneath another such grid section to provide the user with access to the fuel supporting grid for placement and retrieval of fuel items. The rotatability of the grid sections also permits indirect cooking by concentrating the fuel on one region of the fuel supporting grid and by rotating the grid section supporting the food items to a position within the housing opposite the concentrated fuel. A drip pan can be placed under the grill section supporting the food items. Intermittent cooking can also be achieved by periodically rotating the grid sections over and away from the concentrated fuel. The free-spinning grill virtually eliminates uneven cooking to safely reduce harmful toxins released with overcooked meat and controls flare-ups while cooking, increases fuel efficiency.
A housing lid having a central tubular fitting is mounted onto the grill support member and the support member is elevatable within the tubular axle wall to selected levels to provide varying degrees of lateral venting during cooking. The housing lid is also lowerable to a closing position in which the lid makes sufficient sealing contact with the housing side wall to obstruct the flow of oxygen into the housing and thereby extinguish the fuel fire.
2. Description of the Prior Art
There have long been outdoor grills for cooking various food items to produce the widely appreciate, fresh barbecue taste. The present applicant has contributed to this art with the disclosures in following patents.
Ceravolo, U.S. Pat. No. 5,456,163, issued on Oct. 10, 1995, teaches a juice and gravy drippings collector system for barbecue grills. A grill housing is provided in which an inclined surface or separate chamber within the housing collects gravy and juices. The grill apparatus includes a free-spinning half grid for enhancing even cooking. Despite its benefits, a problem with this grill design is that only a half-grid region is provided for supporting food during cooking, limiting productivity. Other problems are that no provision is made for limited venting of the interior of the housing and no provision is made for safely extinguishing the fuel fire.
Ceravolo, U.S. Pat. No. 5,099,821, issued on Mar. 31, 1992, discloses a multi-chambered barbecue grill. This grill apparatus includes a main chamber, a cooking grill located in the main chamber, a fire source located in the main chamber below the cooking grill, and an ash chamber integral with or attached to the main chamber below the fire source for catching ashes. Also included is a reversible top chamber located above the main chamber, which is adapted for receiving the cooking grill in its reversed position. A problem with this design is that access to the lower, fuel supporting grid is not as convenient as it might be.
Ceravolo, U.S. Pat. No. 4,932,390, issued on Jun. 12, 1990, reveals an adjustable barbecue grill. This grill apparatus includes a food-support grid that is adjustable both vertically and rotatively on a vertical threaded rod. The vertical adjustment determines the spacing of the food being cooked above the other heat source. The rotative adjustment enables the food to be positioned to one side of the heat source to provide a keep-warm mode for already cooked food and a thawing mode for food yet to be cooked. The problems of the design described immediately above are generally again presented.
It is thus an object of the present invention to provide a cooking grill apparatus which provides the user with access to fuel items without removal of the food supporting grid.
It is another object of the present invention to provide such an apparatus which permits indirect cooking for defrosting and reheating and permits intermittent heating to eliminate uneven cooking to safely reduce harmful toxins released with overcooked meat and which controls flare-ups while cooking.
It is a further object of the present invention to provide such an apparatus which permits selection and placement of the specific quantity of fuel needed for cooking a given amount of food.
It is still another object of the present invention to provide such an apparatus which permits adjustment of the grill housing lid height to selected levels to provide varying degrees of lateral venting during cooking, and to a closed level in which the lid makes sufficient sealing contact with housing to obstruct the flow of oxygen into the housing and thereby extinguish the fuel fire, safely preventing sparks from falling out of the housing and starting a house or forest fire.
It is finally an object of the present invention to provide such an apparatus which increases fuel efficiency, is sturdy, inexpensive to manufacture, safe and reliable.


An exploratory shaft-making apparatus creates a vertical hole down into a geological formation while sending a payload into the vertical hole. The apparatus includes a metallic cylindrical casing; a hollow, conical head section; a payload body; and shaped charges of high explosive below the payload body. The shaped charges are adapted to sequentially detonate starting with the bottom-most shaped charge. The detonation of each shaped charge is configured to create a void space in the geological formation below the casing. The void space permits gravity to move the remaining shaped charges and the payload body atop them to slide downward so that the next shaped charge to detonate is positioned below the bottom end of the metallic cylindrical casing. A shock absorbing material may be included in the head section. The payload body optionally has a removable cap. A lift fitting may be attached to the payload body.

A primary and important source of energy in the world today is oil. It is the backbone of our economy. It heats our homes, and propels our cars, trucks, ships, airplanes, and makes sure we have a job to work at. Because oil is so valuable, it represents great wealth and that is why it is referred to as black gold.
Near-surface petroleum deposits are well known phenomena mostly observed by petroleum exuding or seeping from the ground. Petroleum seeps are common in many areas of the world. The occurrence of surface petroleum was often memorialized in location names associated with early oil and gas exploitation as well as scientific and technological developments. As early as 1753, the surface oil springs of Pennsylvania were identified. While today's oil wells can be miles deep, there is still opportunity to develop petroleum from near surface deposits, provided that they can be discovered.
There are still countless undiscovered large and small pools of oil reserves that lay below the surface we walk on. The problem with trying to discover new oil is that it is very expensive to have all the heavy drilling equipment transported and set up at a site to try and drill a test hole. Many times the uneven topography of the terrain makes it almost impossible to get this drilling equipment to the site. Even if you do have vast amounts of money to spend on drilling a test hole, the chances of finding oil are very low.
America is a large country from sea to shining sea. If one flies across the country in an airplane, it is plain to see that most of the country is undeveloped small parcels of rural and farm land. People refer to this as "Fly Over Country." There are still vast oil reserves waiting to be discovered on this rural and farm property. Most of the owners of these small farm parcels are just typical families that have very little money to spend. They are unlikely to ever have enough money for a professional drilling company to come to their property and set up all the equipment to drill a test well hole. They may be just making ends meet on a limited fixed income and they may be walking over top of a fortune in oil that lies below their feet. Such people are often referred to as "land rich and cash poor," because they have a small family farm that has been passed down for generations, and they may live close to or below the poverty line.
Near-surface water aquifers are also highly sought by farmers needing water for crops. Water wells have a very long history for human activity. One of the world's oldest known water wells is located in Cyprus, dated to 7000-8500 BC. Until recent time, all artificial wells were pumpless, hand-dug wells of varying degrees of formality, and they remain a very important source of potable water in some rural developing areas where they are routinely dug and used today. Such wells have been successfully excavated to about 60 meters (200 ft).

OEP Associates, Trustee for Oil exploration probe CRT Trust


The present disclosure is directed to an oil burning system, capable of burning various waste oils with high efficiency burn, reduced emissions, and without producing sludge within the system. Generally, the system operates by pressurizing liquid fuel to a high pressure and delivering the fuel through a two-stage filtration system, pre-heating the fuel, dispensing the fuel through a nozzle and igniting the fuel.

The present disclosure generally relates to an oil burning system, and more particularly to a system that is capable of maintaining high-pressure while reducing fuel usage to generate an equivalent quantity of heat as prior systems, while minimizing volume requirements of fuel and pollutants.
With rising oil prices, consumers have become more cost and efficiency conscious. Homeowners who choose to heat their home with oil can opt to use waste oils as fuel for the heating system. However, existing waste-oil burning systems are relatively inefficient and generate a high level of pollution as these systems burn only about 75-85% of the fuel, while 15% (or more) of the fuel is not burned and is exhausted as soot plus carbon monoxide. Further, existing systems require the fuel to be heated to about 190-250° F., the heating process creates sludge in the system; this, in turn, requires disassembly of the system for cleaning, and disposal of the sludge.


The present disclosure relates to a method for manufacturing a bipolar transistor. The method forms a trench to isolate a first region from a second region in a semiconductor wafer, and to isolate these regions from the rest of the wafer. The method forms first P-doped well in the second region and produces a collector region of second and third wells by a P doping in the first region. The second well is in contact with the first well below the trench. The method also produces an N-doped base well on the collector region and, at the wafer surface, and forms a CMOS transistor gate on the first region and delimiting a third region and a fourth region. The method also forms a P+-doped collector contact region in the first well, forms a P+ doped emitter region in the third region, and forms an N+-doped base contact region in the fourth region.

1. Technical Field
The present disclosure relates to the manufacturing of integrated circuits on a semiconductor wafer, and more particularly to a method for manufacturing a bipolar transistor compatible with CMOS (Complementary Metal Oxide Semiconductor) manufacturing methods.
2. Description of the Related Art
Generally, the formation of vertical bipolar transistors in a CMOS circuit employs a significant number of resists and additional manufacturing steps. These additional steps relate in particular to forming doped zones to produce the emitter, the base and the collector of the bipolar transistor at different depths in the semiconductor wafer. These steps are generally not useful to form CMOS transistors that are usually produced on the surface of the wafer.
Certain techniques of forming a bipolar transistor use the formation of isolated wells that are produced for the CMOS transistors. The bipolar transistors obtained using these techniques generally have insufficient performances, in particular in terms of gain and frequency resistance, for most applications. The steps of forming these wells are indeed optimized for the formation of CMOS transistors, but not for the formation of bipolar transistors.
One well-known method also involves producing in CMOS circuits bipolar transistors which can achieve a higher gain, in the order of 100, and a frequency resistance of a few tens of GHz. FIG. 1 thus represents a cross-section of an example of a PNP-type bipolar transistor formed in a semiconductor wafer. The bipolar transistor comprises a base BW formed by an N-doped well, an N-doped isolating well NISO, produced deep down, and a collector produced by several layers of different types of doping, formed between the base well BW and the isolating well. In this example, the collector comprises a P+-doped well PPW, formed above the well NISO, and another P-doped well PW, formed between the wells PPW and BW. The emitter of the bipolar transistor is formed by a P-doped layer of polysilicon ET, deposited on the base well BW. The sides of the emitter ET are protected by isolating spacers SP. A base contact is produced by an N+-doped zone BD formed in the base well BW around the emitter ET, and topped by a connecting metal layer. A collector contact CPD is formed by a P+-doped region, isolated from the base well BW by means of an isolating trench STI. The collector contact CPD is formed in a P-doped well CLW, ensuring the electrical link between the collector contact CPD and the well PPW. The well NISO is biased by means of a well contact formed by an N+-doped zone SPD, electrically linked to the layer NISO by two N+-doped wells SLW and SNW.
Unlike CMOS transistors, the manufacturing of this transistor forms a significant number of doped wells, and thus employs a large number of resists and doping steps. In addition, this transistor also occupies a significant wafer surface area.

Method for manufacturing a vertical bipolar transistor compatible with CMOS manufacturing methods


A wireless power supply system that detects communications in the input power to the switching circuit. In this aspect of the invention, the wireless power supply includes a detector for generating a signal indicative of the current in the input to the switching circuitry, a band-pass filter for filtering the detected signal, an amplifier for amplifying the filtered signal, a filter for filtering the amplified signal and a comparator for converting the final signal into a stream of high and low signals that can be passed to a controller for processing as binary data stream. In a second aspect, the wireless power supply system includes a detector for generating a signal that varies in dependence on changes in the phase relationship between the current and the voltage in the primary-side tank circuit, a band-pass filter for filtering the signal, an amplifier for amplifying the filtered signal, a filter for filtering the amplified signal and a comparator for converting the final signal into a stream of high and low signals that can be passed to a controller for processing as binary data stream.

The present invention relates to wireless power supplies, and more particularly to wireless power supplies with integrated data communications.
There is an increased effort in the market to develop wireless power supply systems capable of charging and/or powering a wide variety of electronic devices. Wireless power supply systems allow power to be delivered to an electronic device without the need for direct-wired connections. This eliminates a variety of problems associated with direct electrical connections, such as the mess and clutter associated with cords as well as the inconvenience associated with repeatedly plugging in and disconnecting charging cords from portable electronic devices.
Many conventional wireless power supply systems rely on inductive power transfer (i.e. the transfer of power using electromagnetic fields) to convey electrical power without wires. A typical inductive power transfer system includes an inductive power supply that uses a primary coil to wirelessly transfer energy in the form of a varying electromagnetic field and a remote device that uses a secondary coil to convert the energy in the electromagnetic field into electrical power. Recognizing the potential benefits, some developers have focused on producing wireless power supply systems with adaptive control systems capable of adapting to maximize efficiency and provide appropriate operation to a variety of different types of devices under a wide range of circumstances. Adaptive control systems may vary operating parameters, such as resonant frequency, operating frequency, rail voltage or duty cycle, to supply the appropriate amount of power and to adjust to various operating conditions. For example, it may be desirable to vary the operating parameters of the wireless power supply based on the number of electronic device(s), the general power requirements of the electronic device(s) and the instantaneous power needs of the electronic device(s). As another example, the distance, location and orientation of the electronic device(s) with respect to the primary coil may affect the efficiency of the power transfer, and variations in operating parameters may be used to optimize operation. In a further example, the presence of parasitic metal in range of the wireless power supply may affect performance or present other undesirable issues. The adaptive control system may respond to the presence of parasitic metal by adjusting operating parameters or shutting down the power supply. In addition to these examples, those skilled in the field will recognize additional benefits from the use of an adaptive control system.
A number of adaptive control systems rely on data communication between the adaptive control system (sometimes referred to as the "primary-side") and the portable electronic device (sometimes referred to as the "secondary-side"). For example, the adaptive control system and the portable electronic device may perform a handshake or otherwise communicate to establish that the portable device is compatible with the wireless power supply. The portable device may also communicate its general power requirements, as well as information representative of the amount of power it is receiving from the wireless power supply. This information may allow the adaptive control system to adjust its operating parameters to supply the appropriate amount of power at optimum efficiency. These and other benefits may result from the existence of a communication channel from the electronic device to the wireless power supply.
To avoid the need for additional communications systems, some existing inductive power supply systems transmit data communications over the existing inductive coupling. For example, the electronic device may include a secondary-side controller that sends communications to the adaptive control system using "backscatter modulation," which places the communications onto the power signal. In this type of system, the secondary-side controller modulates the amount of power that the electronic device draws from the wireless power supply, thereby establishing communications using amplitude modulation of the power signal. In some applications, modulation of the amount of power drawn by the electronic device is achieved by toggling a load on the secondary-side, such as a dedicated load resistor.
At least one existing wireless power supply system uses a current sensor in the primary-side tank circuit to monitor current in the power signal to extract the data communications from the power signal. Although this technique works well and is highly reliable, it may be possible to provide improved reliability in some circumstances. For example, the signal-to-noise ratio inherent in this existing technique may be relatively low in some applications, thereby making it more difficult to discriminate between data and noise.

Systems and methods for detecting data communication over a wireless power link


A method of processing a sound segment is used in a hearing aid. If the sound segment is a high-frequency type, the high-frequency portion of the sound segment will be processed with a frequency lowering process. If the sound segment is a mixed-frequency type (between high-frequency and low-frequency), the energy of at least some portion of the high-frequency portion of the sound segment will be decreased and then processed with a frequency lowering process.

1. Field of the Invention
The present invention relates to a method of and a computer product for processing sound segments, and a hearing aid, for improving the sound accuracy heard by a hearing-impaired listener.
2. Description of the Related Art
Because most hearing-impaired listeners (including older adults) have more problems hearing high-frequency sounds, a hearing aid is often used for applying a frequency-lowering process on high-frequency sounds.
U.S. Pat. No. 6,577,739 discloses an "apparatus and methods for proportional audio compression and frequency shifting", which provides an understandable audio signal to listeners who have hearing loss in particular frequency ranges by proportionally compressing the audio signal. However, this known prior art compresses all audio signals, which may result in serious sound distortion.
U.S. Pat. No. 7,609,841 discloses a "frequency shifter for use in adaptive feedback cancellers for hearing aids", which improves a conventional frequency shifting method by means of applying frequency shifting only to the high-frequency portion of the signal (which is shifted alternately upward and/or downward), wherein the frequency shifting ratio is less than 6%.
U.S. Pat. No. 7,580,536 discloses a "sound enhancement for hearing-impaired listeners", which applies frequency shifting to the high-frequency portion of the signal.
U.S. Pat. No. 8,582,792 discloses a "method and hearing aid for enhancing the accuracy of sounds heard by a hearing-impaired listener", which determines which portion of the high-frequency audio requires a frequency lowering process.
While processing an input sound in real time, a known technique will first divide the input sound into sound segments, and then determine whether to apply a frequency lowering process on each sound segment. In a common case, such as a vowel followed by a high-frequency consonant (e.g., "at"), a conventional technique applies nothing to all sound segments belonging to "a", and applies the frequency lowering process on all sound segments belonging to "t"; however, the sound between "a" and "t" is usually neither a high-frequency sound nor a low-frequency sound. In this case, if the hearing aid determines that the sound is a high-frequency sound, it will apply the frequency lowering process; otherwise, if the hearing aid determines that the sound is a low-frequency sound, it will not apply the frequency lowering process. However, sometimes it is difficult to classify this kind of intermediate mixed sound, resulting in a rough sound between "a" and "t" while processing "at". None of the abovementioned known prior art references disclose a solution to this problem.
Therefore, there is a need to provide a method and a computer program product of processing sound segments, and a hearing aid, to mitigate and/or obviate the aforementioned problems.

Method and computer program product of processing sound segment and hearing aid


A semiconductor device includes a substrate having a field area that defines active areas, gate trenches in the substrate and extending in a first direction, a buried gate in a respective gate trench, gate capping fences in a respective gate trench over a respective buried gate, the gate capping fences protruding from top surfaces of the active areas and extending in the first direction, bit line trenches in the gate capping fences, a respective bit line trench crossing the gate capping fences and extending in a second direction perpendicular to the first direction, an insulator structure on inner walls of a respective bit line trench, bit lines and bit line capping patterns stacked on the insulator structures in a respective bit line trench, contact pads self-aligned with the gate capping fences and on the substrate between the adjacent bit lines, and a lower electrode of a capacitor on a respective contact pad.

1. Field
Various embodiments described herein relate to semiconductor devices, methods of manufacturing semiconductor devices, and electronic devices and electronic systems adopting the same.
2. Description of Related Art
With an increase in the degree of integration of semiconductor devices, a design rule of components of the semiconductor devices is being reduced. It is difficult to stably separate a bit line and a lower electrode of a capacitor, and parasitic capacitance between the bit line and the lower electrode of the capacitor may increase. A contact margin between an active area and the lower electrode of the capacitor also may be insufficient, which can increase the difficulty of a bit line forming process.

Methods of manufacturing semiconductor devices having self-aligned contact pads


A flat plate drive system for controlling the axial rotational motion of a drive shaft for raising and lowering a load, that optimizes frictional engagement while maximizing heat dissipation away from the moving parts of the drive system. The drive system can be generally used for raising and lowering many types of heavy loads, and is particularly suited for loads that are supported by a cable attached to one end of the drive shaft, with the cable extending through a cradle beam which supports a heavy object, such as a boat. The drive system comprises a worm connected to a source of rotational power. The worm frictionally engages a worm gear wheel that axially rotates a drive shaft. The worm and worm gear wheel are connected to a backplate support. The system maximizes the friction between the worm and worm gear wheel. The system also maximizes the transfer of heat generated by the frictional engagement of the worm and worm gear wheel away from the worm and worm gear wheel to other parts of the drive system, particularly the backplate which is composed of a high thermal conductivity material.

The invention relates generally to a drive system and, more particularly, to a flat plate drive for controlling the axial rotational motion of a drive shaft for raising and lowering a load, that optimizes frictional engagement while maximizing heat dissipation away from the moving parts of the drive system. The drive system can be generally used for raising and lowering many types of heavy loads, and is particularly suited for loads that are supported by one or more cables attached to the drive shaft, with the cable extending through a cradle beam which supports a heavy object, such as a boat.
In normal operation, drive systems for lifting boats are usually attached to pilings. The drive system is connected to a drive shaft which runs between the pilings. The cables are attached to the drive shaft, extend through a cradle beam which supports the load, such as the hull of the boat, and are connected on the other end to the lift frame. The drive system allows for the drive shaft to be rotated in either a clockwise or counterclockwise position so as to be able to raise or lower the load.
Existing flat plate drives use an electric motor with a drive belt. The drive belt usually drives a pulley mounted on a thin shaft which carries a worm. The worm drives a toothed cast steel worm gear wheel, which in turn drives a drive shaft. These components are mounted on a backplate which is bolted into place to counteract the torque action of the drive. The load is raised, lowered and held in place by the frictional contact of the worm against the worm gear wheel and the worm bearings. This frictional contact between the worm and the worm gear wheel and the worm bearings causes excessive heat to build up in this area, which increases the temperature. This increase in temperature can cause the worm, worm gear wheel and bearings to wear excessively and to warp and bend as well.
Other drive manufacturers have attempted to solve the problem of excessive heat buildup and gear wear by using anti-friction thrust bearings at the worm and using lubricants retained at the worm. However, the heat buildup often causes the lubricant to break down and no longer be effective. Others have experimented with the use of high temperature lubricants. However, in addition to decreasing friction, the lubricant can act as a heat insulator, limiting the transfer of heat away from the worm and worm gear wheel. These attempts have concentrated on solving the excessive heat build up and wear of the gears by reducing friction. All of these attempted solutions reduce friction and lessen the contact between the worm gear and the drive gear wheel. So when the motor is stopped and the load is in the desired place, the system experiences what is called running back, or overrunning, so that the load continues to be lowered beyond its desired position. Several tries are often necessary to finally get the load in its desired position. This is especially a problem when trying to stop the drive during the lowering of the load and can also create safety problems.
For the foregoing reasons, there is a need, therefore, for a drive system that operates on the principle of friction, yet does not experience running back when raising and lowering a load, does not result in warping and bending of components due to excessive temperature generated as a byproduct of friction and does not require excessive lubricating that can limit the transfer of heat away from the components.