A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.

This invention relates to plating of copper-refractory metal substrates, such as copper-tungsten substrates with a nickel/gold plating.
Material made of copper and a refractory metal such as tungsten or molybdenum is used as the carrier substrate for gallium arsenide microelectronic chips. The copper-refractory metal material has a relatively high thermal conductivity, which permits the rapid removal of heat from the chips. It also has a coefficient of thermal expansion that is closely matched to that of the gallium arsenide chip, so that thermal mismatch strains are small.
The substrate is plated with a nickel/gold coating prior to attachment of the microelectronic chips. The nickel/gold coating includes one or more nickel layers adjacent to the surface of the substrate, and a gold layer overlying the nickel layer(s). The gold coating allows the chip to be soldered to the surface of the substrate, and protects the surface of the substrate against oxidation or corrosion damage. The nickel layer(s) improve the adherence of the gold layer to the substrate and act as a diffusion barrier of copper to the gold layer.
In the conventional plating approach, the substrate is prefired at elevated temperature, typically about 850.degree. C., in hydrogen to remove surface metal oxides. It is next chemically activated by dipping into concentrated hydrochloric acid to remove additional metal oxides. The substrate is thereafter plated with a nickel strike layer and furnace sintered in hydrogen at about 850.degree. C. to improve the adherence of the nickel strike layer to the substrate. The strike-plated-and-sintered substrate is again chemically activated by dipping into concentrated hydrochloric acid. A nickel plating is plated over the activated nickel strike layer, and the gold layer is plated over the nickel layer.
The conventional approach is operable, but has drawbacks. Blisters are sometimes observed to form on the plated surface during processing. These blisters are believed to result from the rapid formation of tenacious oxides on the surface of the substrate that prevent the adherence of the overlying layers. The resulting substrate having a blistered nickel/gold coating is not acceptable for use in the carrier application, inasmuch as the coating may spall away, the gallium arsenide chip may not adhere properly to the substrate, and the blistered surface may cause the chip to be cracked.
There is a need for an improved approach to the coating of copper-refractory metal materials, such as those used in microelectronic applications as chip carriers. The present invention fulfills this need, and further provides related advantages.

Nickel/gold plating of a copper-refractory metal material


A method for making an elastomeric material containing an antimicrobial composition such as a dispersion of silver oxide that is suitable for implantation within the body. The elastomer made in accordance with this method extends the amount of work-time available for processing the elastomer into an article as compared with the work-time available when using prior art compounding methods.

1. Field of the Invention
The present invention relates to a method for making an antimicrobial elastomeric material containing an antimicrobial composition such as a dispersion of silver oxide that is suitable for implantation within the body
2. Prior Art
Medical devices, particularly implantable elastomeric prostheses which are used in environments where micro-organisms are actively growing, can become covered with a biofilm comprising a colonized layer of microorganisms such that the function of the prosthesis is impaired. After growth of the biofilm microbial layer, filaments can grow and descend into the body or wall of the prosthesis and detrimentally affect its physical properties until the device no longer functions. The fouled device must be cleaned or discarded.
Whenever a prosthesis is in contact with moisture in a warm, nutrient rich environment, the surfaces of the prosthesis may support microbial growth which may include, inter alia, bacteria. The microbial growth can interfere with the functioning of the prosthesis, requiring removal of the prosthesis for disposal or cleaning. The microbial growth is a persistent problem in the management and care of patients who have had their larynx removed and utilize a voice prosthesis since the prosthesis is exposed to a non-sterile, humid, warm, nutrient rich environment.
Various methods for preventing microbial growth on an indwelling device have been proposed. One approach for reducing bacterial infection encountered with the use of medical devices inserted into body cavities has been to apply an antimicrobial coating to the surface of the medical device. For example, U.S. Pat. No. 4,592,920 to Murtfeldt; U.S. Pat. No. 4,603,152 to Laurin et al and U.S. Pat. No. 4,677,143 to Laurin et al. each teach applying a coating containing an antimicrobial agent such as silver oxide to the outer surfaces of medical devices such as catheters, enteral feeding tubes, endotracheal tubes and other hollow tubular devices. The '920 patent to Murtfeldt is primarily concerned with providing a surface coating of an antimicrobial metal compound on a medical device such as a catheter, but also discloses that the metal compound can be "imbedded" within the entire catheter. However, the Murtfeldt patent teaches that the imbedded construction is less desirable since the antimicrobial metal compound imbedded within the side wall of the catheter has less likelihood of encountering migrating microbes and, by inference, is less effective than a surface coating.
Seder et al., in pending U.S. patent application Ser. No. 09/833,961, the content of which is incorporated herein by reference thereto, teach that antimicrobial agents can be compounded (i.e., embedded) into those portions of a prosthesis that are not in contact with tissue. The antimicrobial portions remain free of microbial growth for an extended period which contributes to longer use of the prosthesis in vivo. For example, the valve in most voice prostheses is not in contact with tissue. It is only in intermittent contact with body fluids. The same is true of the inside surface of the tubular prosthesis and/or the facial and inside surfaces of rings or cartridges that are present to reinforce the soft body of a prosthesis. By adding an amount of microbial agent effective to resist growth onto (or into) the valve, ring or cartridge, it is found that microbial growth is delayed for a significant period without any evidence of irritation or toxicity to the tissue. Seder et al. further teach that the antimicrobial agent-bearing elastomer can be compounded by dispersion of the antimicrobial agent into the raw elastomer material. For example, silicone elastomer can contain at least 10 percent of an antimicrobial agent such as silver, or silver compounds such as silver oxide. Other suitable antimicrobial compounds such as, for example, gold, platinum, copper, zinc metal powder or oxides and salts thereof, can be used in the non-tissue contacting portions of the prosthesis. A more complete discussion of prior art methods for incorporating antimicrobial agents into, or upon, a prosthesis is also presented in Seder et al.
A problem with prior art methods of dispersing an antimicrobial agent such as Ag2O into an elastomer prior to forming a prosthetic article therefrom is the short work-time available for forming the elastomer into a prosthesis, or a portion thereof, after compounding; sometimes the work-time being as short as a minute or two. It is, therefore, desirable to provide a method for incorporating an antimicrobial agent such as, for example, silver oxide, into an elastomer such as silicone that provides a longer work-time for fabricating an article therefrom.

Antimicrobial elastomer composition and method for making


A susceptor device comprises a base body, an electrostatic absorbing inner electrode which is disposed on a bottom surface of the base body, a power supplying terminal, an insulating sprayed layer which coats the electrostatic absorbing inner electrode and a connecting section for the power supplying terminal and the electrostatic absorbing inner electrode, and a temperature controlling section. The insulating sprayed layer and the temperature controlling section are attached together unitarily via the bonding agent layer. The flange of the base body fits to a notched section of the temperature controlling section such that the electrostatic absorbing inner electrode, insulating sprayed layer, and the bonding agent layer should be sealed from thereoutside. It is possible to form a thin supporting plate and improve controllability for temperature on the plate sample and transparency for the plasma.

1. Field of the Invention
The present invention relates to a susceptor device which is used for fixing a plate sample such as a silicon wafer preferably in a semiconductor manufacturing device for manufacturing a semiconductor device such as an IC (Integrated Circuit), an LSI (Large Scale Integration), and a VLSI (Very Large-Scale Integration). In particular, the present invention relates to a susceptor device which fixes the plate sample by an electrostatic force while supporting the plate sample efficiently in a constant temperature so as to perform various operations such as a plasma-operation.
2. Description of Related Art
Conventionally, in manufacturing processes for manufacturing a semiconductor device such as an IC, an LSI, and a VLSI, the plate sample such as a silicon wafer is fixed on a sample mount which is called a susceptor body such that predetermined operations may be performed thereto.
For example, operations such as an etching operation are performed to the plate sample under a plasma atmosphere condition, temperature on a surface of the plate sample increase due to a heat which is caused in the plasma; thus, there may be a problem that a resist layer on the surface thereon may burst. For dealing with such a problem, a susceptor device has been proposed in which a temperature controlling section having a flow path for a medium for controlling the temperature of the medium thereinside is attached unitarily to a bottom surface of a susceptor base body on which the plate sample is fixed. A cooling medium is circulated in the flow path in the temperature controlling section so as to exchange a heat therein. Consequently, the plate sample is absorbed by an electrostatic force while the temperature of the plate sample is maintained at a preferable constant temperature such that various plasma operations may be performed to the plate sample.
FIG. 3 is a cross section for showing an example for such a susceptor device. Here, a susceptor device 1 comprises a ceramic mounting plate 2 of which upper surface 2a serves for mounting a plate sample thereon, a ceramic supporting plate 3 for supporting the mounting plate 2 from therebeneath, an electrostatic absorbing inner electrode 4 and a ring insulating member 5 which are disposed between the mounting plate 2 and the supporting plate 3, an electricity supplying terminal 7 which is disposed in a fixing hole 6 formed on the supporting plate 3 so as to contact the electrostatic absorbing inner electrode 4, and a temperature controlling section 8 which is disposed beneath the supporting plate 3 and has a flow path 8a thereinside for circulating a cooling medium. Here, the supporting plate 3 and the temperature controlling section 8 are attached unitarily via a bonding agent layer 9 which is formed by a bonding agent which contains a soft brazing member such as an Indium (In) or an Indium alloy. Also, an outer periphery of the electricity supplying terminal 7 is surrounded by an insulating member 10. The electricity supplying terminal 7 is connected to an external direct current power supply 11. A body of the temperature controlling section 8 is formed by a conductive member so as to serve as an inner electrode for generating a plasma compatibly so as to be connected to an external high frequency power supply 12.
However, in the conventional susceptor device 1 as explained above, thickness of a ceramic supporting plate 3 is at least 3 mm; therefore, a heat is not sufficiently efficiently exchanged between the plate sample and the temperature controlling section 8. Thus, there has been a problem in that it is difficult to maintain the plate sample at a constant preferable temperature. Thus, it has been desired that an operability for controlling the temperature in the conventional susceptor device 1 be improved further.
Also, in the susceptor device 1, the thickness of the supporting plate 3 is at least 3 mm; therefore, there has been a problem in that it is difficult to generate a plasma stably because there is not a sufficient transparency for the plasma.
Also, in the susceptor device 1, there has been a concern that a heavy metal component in a bonding agent layer 9 may be volatile because the bonding agent layer 9 is not durable enough to a corrosive gas and a plasma. Therefore, such a volatile heavy metal component may cause a contamination on the plate sample or become a source for generating a particle.
Furthermore, the bonding agent layer 9 is a conductive member; therefore, there has been a concern that there may occur an abnormal electric discharge on the bonding agent layer 9 when the bonding agent layer 9 is exposed to a plasma; thus there may occur a dielectric breakdown on the bonded surface. Therefore, there has been a problem in that the susceptor device 1 does not work stably due to a frequent interruption by a safety device and a susceptor device 1 is not durable enough even if the susceptor device 1 works stably.


NO.sub.X conversion of exhaust gases from lean mixture engines such as Diesel engines is improved by providing a catalytic converter having three zones, the first zone containing an NO.sub.X storage material on a .gamma.-aluminum oxide layer, the second zone having a layer with a noble metal, and the third zone containing an oxygen storage layer.

This invention relates to methods and arrangements for NO.sub.X exhaust emission control for internal combustion engines.
As used herein in connection with gas storage catalysts, the term "absorb" includes the chemical process for storing gases such as, for example, by conversion of barium oxide to barium nitrate for storage of nitrogen oxide.
British Patent No. 2,290,488 describes a spark-ignited internal combustion engine having an emission control arrangement with a main catalytic converter and an upstream catalytic converter. The main catalytic converter is a conventional three-way catalytic converter with a washcoat containing cerium which serves as an oxygen accumulator. The upstream catalytic converter has an upstream zone with a washcoat that contains The upstream catalytic converter has an upstream zone with a washcoat that contains palladium but no cerium. The upstream zone is followed by a conventional three-way catalyst with a platinum and rhodium coating. The internal combustion engine is operated with a stoichiometric mixture, i.e. at .lambda.=1. This catalytic coating arrangement makes the catalytic converter more stable as compared to arrangements subjected to rich and lean exhaust gas conditions rapidly fluctuating about .lambda.=1. This exhaust emission control arrangement, however, is not useful in lean-bum internal combustion engines, such as lean mix Otto engines and Diesel engines, since such exhaust emission control devices are only stable with respect to aging at a theoretical air/fuel ratio .lambda.=1.
Moreover, there are conventional NO.sub.X storage catalytic converters for lean-burn Otto engines which during lean operation initially store the nitrogen oxides up to a load limit which is dependent on the catalytic converter design. This is followed by a brief stoichiometric or slightly rich operation for regeneration of the NO.sub.X storage catalytic converter, after which lean burn operation is restored. The degree of NO.sub.X retention in these NO.sub.X storage catalytic converters is very high, i.e. the overall NO.sub.X reduction with accumulator discharge and NO.sub.X conversion at .lambda..ltoreq.1 is >90% for lean-burn Otto engines in new condition. In principle, such NO.sub.X storage catalytic converters can also be used with Diesel engines, wherein a certain increase in the catalyst dimensioning is advantageous to allow for SO.sub.X storage. In contrast to Otto engines, however, Diesel engines always operate with excess air so that .lambda.>1 during all operating states. Loading of the NO.sub.X storage catalytic converter is possible without any difficulty, but regeneration by enriching the exhaust gases, for example by injecting fuel into the exhaust line, would lead on the one hand to an intolerable increase in fuel consumption and on the other hand to a high oxidation heat due to the high oxygen content of the diesel exhaust since the injected fuel would be oxidized prior to the conversion of the stored NO.sub.X. This results in the risk of destruction of the catalytic converter.
U.S. Pat. No. 5,406,790 discloses an exhaust emission control device for Diesel engines in which the NO.sub.X accumulator is shut off from the exhaust gas stream for regeneration. This takes place whenever the accumulator has reached its capacity. In order to avoid NO.sub.X emissions, the exhaust gas stream is directed to a second NO.sub.X accumulator during regeneration. Alternatively, the exhaust gas stream is throttled and a complicated regeneration algorithm is initiated. Functional reliability is problematic in this context. Moreover, duplication of the NO.sub.X accumulator involves considerable expense and good exhaust emission control is achieved only under certain conditions despite the cost.
In U.S. Pat. No. 4,755,499 reversible storage of nitrogen oxides and sulfur oxides, for instance from motor vehicle exhaust emissions, is described, wherein the absorbent is regenerated by heating in a reducing atmosphere. At the same time, a reduction of the nitrogen oxides occurs.
A storage catalyst of that type for use in motor vehicles is described in more detail in U.S. Pat. No. 5,402,641, in which high temperatures above 500.degree. C. are necessary to regenerate the absorber. Consequently, use of the storage catalyst is possible only for motor vehicles having a high exhaust-gas temperature, in particular for motor vehicles with an Otto engine.
In this case, however, the possibility of use is limited since, under certain operating conditions of internal combustion engines, such as occur for example in city traffic, the acceleration phases cause a large emission of nitrogen oxide, but no long-lasting high temperature condition such as is required to regenerate the absorber, especially with respect to oxides of sulfur, is attained.
U.S. Pat. No. 5,473,887 discloses an Otto engine with an NO.sub.X storage catalyst as well as one three-way catalytic converter upstream and another three-way catalytic converter downstream from the storage catalyst. Due to the proximity of the upstream three-way converter to the engine, that converter heats up very quickly after a cold start so that it starts its catalytic activity promptly. After starting its catalytic activity, the upstream three-way catalytic converter converts the increasing quantities of HC and CO produced during the warming-up phase of the engine while reducing NO.sub.X at the same time. As a result, the NO.sub.X in the exhaust gas is reduced during a warming-up phase of the engine, even though the NO.sub.X accumulator has not yet achieved the temperature necessary for storage of NO.sub.X. This arrangement and method make sense only for Otto engines since Diesel engines do not emit enough CO and HC to sufficiently reduce the NO.sub.X portion of the exhaust gases even during the warming-up phase. Except for the improved exhaust emission control during the warming-up phase, an Otto engine with an upstream catalytic converter does not demonstrate any better NO.sub.X reduction.
U.S. Pat. No. 5,473,887 also discloses two methods for NO.sub.X reduction in Diesel internal combustion engines, one based on throttling of the air supply to the engine and the other based on control of the fuel injection. Diesel internal combustion engines that are equipped with NO.sub.X accumulators as described above, however, show a definite reduction in NO.sub.X storage in the NO.sub.X accumulator at higher exhaust gas temperatures.
Common to all these methods and arrangements is that running a rich mixture in an internal combustion engine for regeneration of the NO.sub.X is often problematic, especially in direct-injection internal combustion engines and/or Diesel engines. Thus, in this context, the temperature of the exhaust gases can be too high on the one hand, or, on the other hand, the resultant reduction in output power can be too large.
Moreover, depending on the size of the NO.sub.X accumulator, flow-through can occur, that is some NO.sub.X flowing into the NO.sub.X accumulator is not absorbed even though sufficient storage capacity is available or some of the hydrocarbons that flow into the NO.sub.X accumulator for regeneration thereof exit from the NO.sub.X accumulator again.

No exhaust emission control method and arrangement


A balloon is connected to a cylindrical tube, and the resulting assembly is mounted on a container to serve as a decorative balloon display system.

1. Field of the Invention
The present invention generally relates to balloons, especially non-latex, foil balloons that are inflated with air and used in display systems as centerpieces and decorations for adornment purposes.
2. Description of the Related Art
Balloons are popular decorations and are widely sold, either collapsed or inflated, in two widely available forms, namely those made of a stretchable latex, and those made of non-stretchable, metallized films commonly known as "foil" balloons. Foil balloons are usually inflated with helium or air introduced into a relatively long neck or stem, and then sealed, for example, by tying the neck off with a tether, by clipping or crimping the neck, by heat sealing the neck closed, or by using a self-sealing valve. The sealed, inflated balloon is often supported or held by a funnel-shaped plastic cup provided at one end of a stick or plastic shaft, or is connected to a holder in order to attract attention. Patents representative of this art are exemplified by U.S. Pat. No. 4,661,081; No. 4,798,554; No. 5,306,194; No. 2,882,645; No. 5,036,985; No. 4,881,916; No. D-376,101; No. 3,892,081; and No. 5,989,093.
Experience has shown, however, that inflating foil balloons of large size, typically about eighteen inches and larger in diameter, with helium is not altogether satisfactory, because many retailers are unwilling to handle helium and to devote the labor required to fill the balloons. Some municipalities restrict sales of helium balloons over concern of damage to overhead power lines and communication systems. Even when such large balloons are filled with air, it is difficult to readily secure and hold the inflated balloon on the above-described funnel-shaped cup on a stick, not to mention the unaesthetic appearance of such a holder, or its restriction to hand-held usage.


A device is provided for dampening compressor-induced vibration in an air conditioning system of the type having an indoor unit, an outdoor unit and a refrigerant conduit therebetween. The outdoor unit includes a compressor that is operable to circulate a vapor compression refrigerant through the conduit between the indoor and outdoor units. The device is comprised of a support member containing a section of refrigerant line. The support member is located beneath the outdoor unit and the refrigerant line section is interposed in a portion of the refrigerant conduit between said compressor and said indoor unit, such that the refrigerant flowing between the indoor unit and the compressor is routed through the line section in the outdoor unit support member.

In central air conditioning systems typically used in residences, a compressor is operable to circulate a vapor compression refrigerant between an indoor heat exchanger and an outdoor heat exchanger. In recent years, scroll-type compressors for the most part have replaced reciprocating-type compressors in residential air conditioning systems. For cost reasons, such scroll-type compressors typically do not include vibration-dampening springs to isolate the motor and compressor mechanism from the outer housing of the compressor. The refrigerant lines on the suction and discharge sides of the compressor are rigidly attached to this outer housing. Therefore, there is a direct vibration transmission path from the motor and compressor to these refrigerant lines.
In particular the refrigerant line between the indoor heat exchanger and the compressor is susceptible to such vibrations because the line is relatively rigid due its relatively large diameter (e.g., ⅞ inch). In a non-heat pump air conditioning system, where the indoor heat exchanger operates as an evaporator, this refrigerant line corresponds to the compressor suction line, through which vapor refrigerant is drawn from the evaporator to the compressor. The length of this suction line may be about 40 feet, with most of the line being inside the building that is serviced by the air conditioning system. In a heat pump system, this refrigerant line corresponds to the compressor suction line when the system is operated in a cooling mode and to the compressor discharge line when the system is operated in a heating mode.
Such vibrations in the refrigerant line between the compressor and indoor heat exchanger may cause a droning noise that is readily detectable by occupants of the building. This droning noise results when a vibration typically associated with electric motor noise (e.g., approximately 60 Hz and/or one or more harmonic frequencies thereof) is modulated by a low frequency (2 Hz or less) standing wave in the refrigerant line, which varies the intensity of the vibration. The standing wave causes displacement of the refrigerant line, such that contact between the line and a wall, floor or other structural component results in points of noise transmission inside the building.
One solution that has been proposed to inhibit such vibrations is to strap one or more strips of rubber around the refrigerant line, which reduces vibration by adding mass to the line and by frictional damping. This solution typically is used as a "field fix" after the system installer has received a complaint about noise from a customer. The number of rubber strips needed is determined in the field, largely by trial and error.


A tool for automatically generating a reduced size circuit model including inductive interaction properties is provided. Such inclusion of inductive properties in the reduced size circuit model allows for a more complete and accurate circuit model than those created by conventional methods. Further, a technique for automatically generating a reduced size circuit model including inductive properties that uses less memory space and operates faster than conventional methods is provided.

During chip design, computer simulators such as circuit simulators, field simulators, and hierarchical field simulators are used to model electrical, magnetic, and physical behavior of circuit models. Circuit simulators verify circuit designs and predict general circuit behavior. As shown in FIG. 1, a circuit simulator uses a predefined circuit model (10) (a listing of components, attachments, and known properties of the circuit) to run a circuit simulation (12). The circuit simulation (12) calculates electrical, magnetic, and physical aspects of the circuit design not defined in the circuit model (10), and then produces an output file (14) containing properties given in the circuit model (10) and properties calculated during the circuit simulation (14).
An example of a circuit simulator well known in the art is HSPICE (produced by Avant!). Field simulators and hierarchical field simulators are used primarily to simulate electromagnetic interaction in a circuit (one aspect of circuit behavior). A hierarchical field simulator simulates electromagnetic interaction in hierarchical circuit models (circuit models that have been abstracted into layers). Two examples of hierarchical field simulators are IES3 (produced by Bell Labs) and FastHenry (produced by Massachusetts Institute of Technology).
A circuit printed on an IC is made up of electrical devices such as transistors, i.e., nonlinear elements and wires which connect the electrical devices (known as connecting wires). Wire delay, i.e., the amount of time a signal takes to travel through a connecting wire, is a type of circuit behavior that is approximated with a computer simulator. It is important to know wire delay in a circuit because large amounts of wire delay can adversely affect the operation of the circuit. In order for a computer simulator to approximate wire delay, a connecting wire must be translated into some type of circuit model. In many cases, the connecting wire is translated into a circuit model having resistors and capacitors.
FIGS. 2a and 2b depict the steps of a typical process by which a connecting wire is translated into a resistor and capacitor circuit model. In FIG. 2a, a connecting wire having an "in" node (62) and an "out" node (64) has been split into three conductor segments by inserting two nodes (66, 68) onto the connecting wire. In FIG. 2b, the capacitance and resistance associated with each conductor segment is then modeled by inserting capacitors (72) and resistors (70) into the connecting wire. A capacitor (72) is attached to each node (62, 64, 66, 68) and a resistor (70) is inserted between each pair of nodes (62 and 66, 66 and 68, and 68 and 64). The values of the capacitors (72) and the resistors (70) are ascertained either from a lookup table or from a field simulator, after which, the circuit behavior is modeled using a circuit simulator.
Due to increasing operation frequency within electronic devices, the simple capacitor and resistor circuit model given in FIG. 2b is no longer an accurate model of the wire delay in a connecting wire. For example, the contribution that inductive interaction, i.e., electromagnetic interference, between the conductor segments makes to the wire delay must now be accounted for in the circuit model. Inductive interaction is caused by electromagnetic fields that are produced by current flowing through conductor segments in close proximity with one another. As shown by the circuit model in FIG. 2c, the wire delay caused by inductive interaction between conductor segments is modeled by inserting inductors (74) into the capacitor and resistor circuit model shown in FIG. 2b. An inductor (74) is inserted between each pair of nodes (62 and 66, 66 and 68, and 68 and 64) in series with the resistor (70) located in the same conductor segment. The values of the inductors (74) are ascertained either from a lookup table or from a field simulator.
In addition to the wire delay contributed by inductive interaction between the conductor segments, inductive interaction between the inductors in the conductor segments (known as coupling inductances) contributes wire delay to the circuit model. In a connecting wire represented by "N" conductor segments, there are N(N−1)/2 inductive couplings. For example, the connecting wire represented by the circuit model in FIG. 2c has three conductor segments, and, therefore, has 3(3−1)/2, or three, inductive couplings. The values of these inductive couplings, i.e., the coupling inductances, are calculated using a lookup table or a field simulator, after which, the circuit behavior is modeled using a circuit simulator. In circuit models having a large value for "N," heuristic assumptions, i.e., only large coupling inductances taken into account, are used to eliminate some or all of the inductive couplings from the circuit model. However, simply neglecting some or all of the inductive couplings may lead to an unstable circuit model whose wire delay may no longer correspond to the actual wire delay of the connecting wire being modeled.
Normally, a circuit simulator is not used to calculate coupling inductances because a lookup table or a field simulator takes less time to calculate inductive interaction. However, it is important to note that, although coupling inductances are often calculated using a lookup table or a field simulator, coupling inductances can also be calculated using a circuit simulator. Usually, a lookup table, a field simulator, and a circuit simulator store coupling inductances for a particular circuit model as a square matrix having a row and column dimension of "N." For example, in a circuit model having "N" conductor segments, the coupling inductances ("K") are stored in a square matrix as such:
  K  =      [                                        K            11                                                K            12                                    ⋯                                      K                          1                            N                                                                        K            21                                    ⋯                          ⋯                          ⋯                                      ⋯                          ⋯                          ⋯                          ⋯                                                  K            N1                                    ⋯                          ⋯                                      K                          N                                                                                N                                            ]  In a circuit model with a large value for "N," i.e., several conductor segments, the square matrix used to store the coupling inductances requires a large amount of storage space in memory.
In hierarchical field simulators, coupling inductances are represented as the product of two matrices, where one of the matrices represents electrical effects that contribute to inductance and the other matrix represents magnetic effects that contribute to inductance. The matrix representing the electrical effects, an "electrical matrix," shows the voltage present in the conductor segments. The matrix representing the magnetic effects, a "magnetic matrix," shows the current present in the conductor segments. The longer dimension (row or column) in the electrical matrix and the magnetic matrix indicates the conductor segments in each of the two matrices. If the longer dimension is a row, then each row in the matrix represents a conductor segment, however, if the longer dimension is a column, then each column in the matrix represents a conductor segment.
If "K" is used to represent a matrix of coupling inductances, and "A" and "B" are used to represent an electrical matrix and a magnetic matrix, then:K=A*B, where
      A    =          [                                                  A              11                                            ⋯                                              A                              1                                P                                                                          ⋯                                ⋯                                ⋯                                                ⋯                                ⋯                                ⋯                                                              A              N1                                            ⋯                                              A                              N                                                                                P                                                        ]        ,      B    =          [                                                  B              11                                            ⋯                                              B                              1                                P                                                                          ⋯                                ⋯                                ⋯                                                ⋯                                ⋯                                ⋯                                                              B              N1                                            ⋯                                              B                              N                                                                                P                                                        ]        ,                and P<<N and also several entries in A,B=0.Because the total number of elements in "A" and "B" is less than the total number of elements that would be present in "K," the amount of time/memory space required to compute/store "A" and "B" is much smaller than the time/memory space required to compute/store "K." Thus, a hierarchical simulator uses less time/memory space to calculate coupling inductances than a lookup table, a field simulator, or a circuit simulator because a hierarchical simulator represents coupling inductances as matrices "A" and "B," while the lookup table, the field simulator, and the circuit simulator represent coupling inductances as a matrix "K." This implies that there is an advantage in using a hierarchical simulator to calculate coupling inductances over using a lookup table, a field simulator, or a circuit simulator.
Because a circuit simulator is typically used during chip design (where a hierarchical field simulator may not be used), it would be advantageous to be able to calculate coupling inductances for connecting wires using a hierarchical field simulator, and then include these values in the circuit model used by the circuit simulator. Unfortunately, the hierarchical algorithm for calculating coupling inductances is hidden inside the hierarchical simulator. This means that the electrical and magnetic matrices cannot be accessed by a circuit simulator. As a result, there is a need for a hierarchical algorithm capable of inclusion in a circuit simulator. This will allow a chip designer to take advantage of the speed and storage capabilities of a hierarchical simulator, while retaining the flexibility of a circuit simulator.

Automatic generation of reduced-size circuit models including inductive interaction


A modular controller for a lamp allows for the easy addition of remote control to multiple lamp fixture designs. The controller housing protects circuitry from shorts and has a window included for receiving remote control signals. The window is detachable and can be re-oriented relative to the controller housing to accommodate different lamp fixture designs. The position of the sensors within the controller housing can also be reconfigured, and it is also possible to connect external sensors to the controller for situations where sensors must be placed in a tight space. In some embodiments, the lamp power supply is incorporated within the modular controller, saving space and cost, and allowing for dimming of individual lamps.

Remote controlled lighting systems used to control lamp position and/or brightness have wide application including use in entertainment settings, surgical settings, and retail settings. Some remote-controlled light fixtures may include a lamp secured to a track via a light fixture housing. The fixture housing may contain a lamp power supply, motors for positioning the lamp, and control electronics. A hand-held remote makes it convenient to control the lamp without the need for ladders.
However, the mechanisms and control required to enable remote control are not standard features of most light fixtures, and most manufacturers are not prepared to add remote control to their lamps. In some cases, barriers to manufacturers making such an addition include the need to invest in the re-design of light fixtures to include the control electronics and mechanisms required for remote control.


There is disclosed a method for forming a TiSiN thin film on a substrate according to ALD including a first process of preheating a substrate while supplying Ar or N2 containing inert gas to a chamber, after disposing a substrate in a chamber; a second process of forming a TiN film on the substrate by repeating at least one time a process of purging over-supplied Ti containing gas after supplying Ti containing gas and inert gas after that and a process of purging residual product after supplying N containing gas and inert gas after that; a third process of forming a SiN film by repeating at least one time a process of purging over-supplied Si containing gas after supplying Si containing gas on the TiN film and supplying inert gas after that and a process of purging residual product after supplying N containing gas and supplying inert gas after that; and a fourth process of forming a TiSiN film having a desired thickness by repeating the second and third processes at least one time, a partial pressure range of the gas used in forming the TiSiN thin film is Ti containing gas: 9×10−3 Torr or less, Si containing gas: 1×10−3˜3×10−1 Torr and N containing gas: 7×10−3˜6×10−1 Torr, and a pressure range of the gas is 500 mTorr˜5 Torr and the Si content of the formed TiSiN thin film is 20 atom % or less.

Generally, membrane and pattern etching are repeatedly performed on a substrate such as a semiconductor wafer, and a plurality of desired devices are manufactured to manufacture a semiconductor integrated circuit.
To prevent interdiffusion between a material of a wire for connecting devices with each other and silicon diffused from a substrate such as a bottom layer or a Si-containing layer, barrier metal is typically disposed between a bottom layer and a wire. Such barrier metal has to be a metallic material having low electric resistance and high anticorrosion. A barrier metallic material capable of meeting such requirements mentioned above, such as an aluminum or tungsten wire that is currently used as a wire material, may be a high melting point metallic nitride, for example, Ti, W and Mo. A Ti or TiN film having electric and anticorrosive characteristics has been used as the barrier metallic material.
The Ti film or TiN film as the barrier metal is typically formed in a high temperature range of 500° C.˜700° C. according to chemical vapor deposition (CVD). The Ti or TiN may be effectively embedded in a contact hole or via-hole having a high aspect ratio and it has a good character with respect to aluminum or tungsten that is a wire material.
Recent demands on high integration and high microstructure of the integrated circuit have made the line width of wires get narrower. High operation efficiency as well as the high integration mentioned above is required. Under such situation, copper (Cu) with low resistivity and economic feasibility has been attracting attention as the wire material that can replace the aluminum. However, as mentioned above, the copper is vulnerable to migration with silicon like aluminum and to being diffused at a relatively low temperature. Accordingly, the copper (Cu) has an inadequate barrier capacity as the metal used in the Ti or TiN film.
Korean Patent No. 10-2009-0048523 discloses a method for using a TiSiN film deposited according to plasma CVD or thermal CVD to solve the disadvantage of the conventional Ti or TiN film. However, the concentration of chlorine and oxygen that are impurities contained in the TiSiN film deposited according to the chemical deposition method is high as shown in FIG. 1. Accordingly, a leakage current characteristic of a thin film manufactured might be deteriorated by the impurities.
As a result, there have been studied a method for forming a film having a reduced content of impurities contained in a manufactured TiSiN thin film.

Method for forming TiSiN thin film layer by using atomic layer deposition


A computer-implemented method includes receiving, by an electronic device, a two-dimensional code generation request from a user operating the electronic device, the electronic device comprising secure element; obtaining, by the electronic device, two-dimensional code generation data, wherein the two-dimensional code generation data comprises account data of the user and timestamp data of the electronic device; obtaining, by the electronic device, signature data based on a predetermined signature algorithm stored in the secure element; and generating, by the electronic device, a target two-dimensional code based on the two-dimensional code generation data and the signature data.

A two-dimensional code records data symbol information by using black and white geometric figures formed on a plane based on a specific rule. With the development of science and technology, the two-dimensional code has been widely applied. For example, a payment and collection transaction can be completed by scanning a two-dimensional code for collecting a payment and a two-dimensional code for making a payment. However, two-dimensional code data is stored in plaintext, and is easily tampered with and attacked by attackers.

Two-dimensional code generation method, apparatus, data processing method, apparatus, and server


Disclosed are an RF signal of karaoke data receiving pack and karaoke system using thereof. The RF Karaoke data receiving pack includes an RF receiver for receiving a voice signal and key data signal radio-transmitted from a wireless microphone device via a receiving antenna; an audio/key data signal separator for separating the voice signal and key data signal from the signal demodulated by the demodulator, a receiver MCU controlling the internal operation of the RF karaoke data signal receiving pack while transmitting the digital voice signal and key data signal to the external computing device; and an extension pack in which additional songs are recorded, the extension pack being connected to an extension pack slot to transmit data of the additional songs under the control of the receiver MCU.

1. Field of the Invention
The present invention relates to a Radio-Frequency (RF) signal of karaoke data receiving pack and karaoke system using thereof. More specifically, the invention relates to an RF signal of karaoke data receiving pack and karaoke system using thereof, in which an extension pack is combined with an extension pack slot such that songs are easily added and a main body has a computing function and a wired or a wireless serial communication function and is easily connected to an external computing device so that a user can enjoy Karaoke using the computing function of the external computing device.
2. Description of the Related Art
A Karaoke system known as a popular entertainment apparatus has been developed into a potable Karaoke device constructed in such a manner that a microphone and the main body of the system are integrated into each other owing to a demand for space saving and a development of semiconductor integrated circuit technology. The portable Karaoke device has an outer appearance similar to a microphone and includes a microphone grill placed on the top of the main body and various circuit components arranged inside the main body. In addition, numeral keys required for selecting a song number are located on the front face of the main body, and a Liquid Crystal Display (LCD) for displaying a selected song number is disposed above the numeral keys. A video signal output from the portable Karaoke device is provided to a video input port of an Audio-Video (AV) system such as a TeleVision (TV) receiver through a cable and an audio signal output from the portable Karaoke device is transmitted to an audio input port of the TV receiver through a wire to be reproduced.
However, the conventional portable Karaoke device is large, heavy and expensive because all of the components are mounted in the main body.
In the meantime, a variety of electronic game devices, which can be easily connected to a TV receiver having a screen larger than that of a computer monitor and audio processing performance superior to that of a computer such that users can enjoy games, are put on the market. PLAYSTATION® of Sony Co. and XBOX® of Microsoft are typical game devices. Furthermore, a high-performance Central Processing Unit (CPU), a large-capacity memory and various peripherals as powerful as those of a personal computer are mounted in the game devices because a CPU processing speed and memory capacity are remarkably increased. However, these game devices are used only for games, but not used for other purposes in spite of their high performances.
Moreover, a game program is installed in a personal computer such that a desired game or a desired song can be downloaded to enjoy. However, the lyric of a selected song cannot be displayed using the personal computer.


Methods and systems are provided for diagnosing the presence or absence of a catalyst substrate within a catalyst can or housing. The methods and systems described a persistence of excitation metric that is a basis for judging whether or not the catalyst can is empty. If it is determined that the catalyst can or housing is empty, mitigating control actions may be performed via a controller.

A catalyst may be incorporated into an exhaust system of an internal combustion engine to convert hydrocarbons and NOx into CO2, N2, and H2O. The catalyst may be comprised of a substrate and a washcoat that is affixed to the substrate. Exhaust gases that flow through the substrate may be converted to CO2, N2, and H2O after the catalyst reaches a threshold temperature. The efficiency of the catalyst to convert exhaust gases may also depend on a past history of exhaust gases that have flowed through the catalyst and the present chemical state within the catalyst. While many vehicle owners view conversion of exhaust gases into CO2, N2, and H2O as a useful process and wish to comply with governmental regulations, some vehicle owners may believe that converting exhaust gases to CO2, N2, and H2O provides less benefit than an increase in vehicle performance that may be achieved via removing the catalyst substrate from the vehicle exhaust system. In particular, these vehicle owners may wish to reduce exhaust backpressure so that higher air and fuel flow rates through the engine may be achieved, thereby increasing engine output. However, removing the catalyst substrate and washcoat may violate governmental regulations and increase emissions of less desirable exhaust gases. Therefore, it may be desirable to provide a way of determining whether or not a catalyst substrate has been removed from a catalyst housing so that the vehicle owner and other interested parties may be prompted to take mitigating actions. In addition, it may be desirable to adjust engine operation if an empty catalyst housing is detected so that tailpipe emissions may be reduced and so that removing the catalyst substrate does not improve engine performance.
The inventors herein have recognized that there may be particular benefits of diagnosing the presence or absence of an empty catalyst can and have developed an engine operating method, comprising: sampling output of an oxygen sensor that is positioned in an exhaust system downstream of a catalyst via a controller; and distinguishing an empty catalyst can from a catalyst can that includes a functioning catalyst (e.g., a catalyst that has capacity to oxidize or reduce at least a portion of exhaust gasses passing through the catalyst after the catalyst reaches a threshold temperature) via the sampled output of the oxygen sensor.
By distinguishing an empty catalyst can from a catalyst can that includes a functioning catalyst, it may be possible to provide the technical result of improving mitigating actions that may be performed in the presence of catalyst degradation. Specifically, in one example, engine performance may be constrained to a level that is equivalent to conditions when the catalyst can holds a substrate so that an engine performance benefit is not gained via removing a catalyst substrate. Further, control actions to reduce engine NOx production at higher engine loads may be adjusted responsive to the extent of catalyst degradation. For example, if it is determined that a catalyst can is empty, spark timing may be retarded to a greater extent than if it is determined that catalyst performance is degraded based on aggregation of portions of a washcoat while the catalyst can includes a substrate and washcoat.
The present description may provide several advantages. Specifically, the approach may improve catalyst degradation assessments. Further, the approach may improve the robustness of a catalyst monitor. In addition, the approach may increase in-use monitor performance rates.
It should be understood that the summary above is provided to introduce in simplified form a selection of concepts that are further described in the detailed description. It is not meant to identify key or essential features of the claimed subject matter, the scope of which is defined uniquely by the claims that follow the detailed description. Furthermore, the claimed subject matter is not limited to implementations that solve any disadvantages noted above or in any part of this disclosure.

Method and system for improving detecting an empty catalyst housing


When a lock detector detects a locked state of a DC motor in a starting stage, a torque increasing circuit immediately selects a starting sequence pattern of an output torque that is greater in magnitude by one preselected step, and outputs the selected output torque to a starting sequence controller, so that a compressor can be restarted speedily without repeating starting failures. A compressor, driven by a DC motor, has a shell of an internal pressure approximately equal to the pressure of an inhalation gas. An inverter is provided to make the speed of the DC motor variable. A rotational frequency setting circuit sets the rotational frequency of the DC motor to a frequency that is not greater than the frequency of a commercial power source when the internal temperature of a refrigerator is stabilized. By this construction, the power consumption can be remarkably reduced.

There have been proposed a large number of refrigerators aimed at saving energy and improving the refrigerator's ability to refrigerate quickly by making the rotational frequency or speed of the compressor variable. For example, as disclosed in Japanese Laid-Open Patent Publication (unexamined) No. 2-140577, there is a trial of producing an effect by making the rotational frequency of a compressor of a refrigerator variable by means of an inverter.
A rotary compressor, as disclosed in the aforementioned prior art document, has generally been used as a compressor whose rotational frequency is made variable by an inverter. The rotary compressor has been so used because its refrigerating ability varies approximately linearly according to the chance of the rotational frequency and because it has had an excellent capability in that its lubricating ability depends less on the rotational frequency.
However, according to the conventional construction, there has been the following problems in using the rotary compressor.
In general, the rotary compressor has a high pressure inside its shell. That is, an inhalation gas having a low pressure is directly inhaled into a cylinder of its compressing section. The gas is then discharged once into the shell after compression. Thereafter, the gas is transferred into a cooling system through a discharge pipe. Thus, since the shell has a high internal pressure, it has been widely known that the gas having a high pressure and a high temperature leaks causing the gas to intrude into a cylinder inside the compression section. This leakage and intrusion is a factor in the reduction of the compression efficiency of the compressor (leakage heat loss).
However, the leakage heat loss has no relation to the rotational frequency, and depends on the magnitude of the high pressure and the magnitude of the low pressure. That is, there has been such a phenomenon that, when the rotational frequency has been lowered to reduce the refrigerating ability of the compressor itself, the rate of the leakage heat loss has increased, consequently reducing the efficiency of the compressor.
When the internal temperature of the refrigerator is stabilized, the need for great refrigerating ability is not present. In such a case, where energy saving is attempted by lowering the rotational frequency by an inverter to reduce the refrigerating ability, there has been a problem in that the energy saving effect cannot be obtained due to the reduction of the efficiency of the compressor.
Furthermore, in the case of a reciprocating compressor, the oil supplying ability depends on the rotational frequency. This dependence has caused a problem in that the reliability is degraded particularly at a low rotational frequency. Also, because the reciprocating compressor requires a large starting torque, smooth starting has not been able to be achieved.
Also, there has been proposed a method of starting a compressor motor control device wherein the position of rotor magnetic poles of a DC brushless motor, whose rotational frequency is controlled by an inverter, is detected by utilizing an induction voltage at the stator winding in a sensor-less system. This method, however, cannot effect the position detection when the motor is stopped, because no induction voltage is generated in such a state. Therefore, it has been a general practice to execute the starting according to a predetermined starting sequence pattern up to a specified rotational frequency at which the position detection is enabled, and thereafter to switch the pattern to the sensor-less system. Such a prior art starting method for the compressor motor control device is disclosed, for example, in Japanese Laid-Open Patent Publication (unexamined) No. 1-54960.
Because a transient DC component in a filter circuit employed in a sensor-less circuit is not sufficiently attenuated at the starting of the DC motor, the above method has been devised to prevent the possible failure of the switching as a consequence of an unstable switching to the sensor-less system. According to this method, the switching to the sensor-less system is effected after the transient DC component is sufficiently attenuated in order to reduce starting failures of the compressor motor control device.
This method, however, uses only one starting sequence pattern, which has caused a problem in that, when a load torque of the DC motor is great at the time of starting, the compressor is occasionally brought into a locked state during the starting sequence pattern operation before the switching to the sensor-less system is effected.
On the other hand, brushless motors have been widely used since they have high efficiencies and permit a rotational frequency control under voltage control. Particularly, since the method of detecting the rotational position from a reverse induction voltage generated at the winding voltage of the motor was proposed lately as a technique for obviating the need of a position detection element for detecting the rotational position of the brushless motor, brushless motors have been extensively used even in very bad operational environments such as with compressors and the like where the temperature is high and refrigerant and oil exist inside.
Generally, in order to eliminate the influence of a voltage waveform due to PWM (Pulse Width Modulation) in detecting the reverse induction voltage, filter circuits are often used. Such use of filter circuits however, has caused a problem in that the position detection becomes unstable in a transient state such as the motor starting stage. A method for eliminating the above disadvantage has been also proposed, for example, in Japanese Patent Laid-Open Publication (unexamined) No. 58-190287. The prior art brushless motor starting method will be described below with reference to FIG. 19.
FIG. 19 is an explanatory view of a prior art brushless motor starting method.
Referring to FIG. 19, when a stopped motor is started, the motor is operated as a synchronous motor because no reverse induction voltage is generated (low-frequency synchronous starting). In this stage, a drive frequency is accelerated so that the rotational frequency gradually increases. With this operation, the rotational frequency also increases.
When the rotational frequency of the motor reaches a specified rotational frequency, it is allowed to execute position detection from the reverse induction voltage, and the motor comes to operate as a brushless motor by switching. Thereafter, acceleration, deceleration and maintaining of the rotational frequency can be achieved by controlling the voltage.
By providing time intervals (t4 and t5) in which no acceleration is effected for a specified time in the switching stage and effecting the switching after waiting for a sufficient attenuation of the transient DC component in the filter circuit, or by starting acceleration after the transient phenomenon in the switching operation is completed, a stability in the switching stage has been assured.
However, the prior art construction has had the following problems.
In the brushless motor in which the position detection is executed based on the reverse induction voltage, the motor starts its operation as a synchronous motor according to the low-frequency synchronous starting in the motor starting stage. In this stage, a voltage and a frequency are applied to the motor so that a specified torque is generated. In this stage, since noise and vibration are caused when the torque is made excessively high and step-out may be incurred when the torque is insufficient, there is a scheme of applying the voltage and frequency in the most appropriate state as far as possible.
Furthermore, in the position detection operation based on the reverse induction voltage, the filter circuit is originally designed so as to become optimum in a region where the motor operates normally, and therefore, the motor tends to step out when a high torque is applied at a low speed.
Accordingly, the prior art method has been effective for a motor that has a small load in the starting stage or at a low rotational frequency (e.g., fan motor).
However, in compressors for use in refrigerators and air conditioners or the like, there may be a case where a high load is applied several seconds after the starting stage. Generally, in a compressor, a difference in pressure of compression gas takes place and the load torque increases immediately after the starting. Particularly, it is well known that a great amount of torque is applied several seconds after the starting stage.
When the conventional method is used in such a case, since the acceleration stop interval is provided when a high load torque is applied, there has been such a problem that a step-out is caused by the high load torque in either the low-frequency synchronous starting operation or the operation based on the reverse induction voltage detection.
Particularly, at the time of turning on the power, capacitors of the filter circuit are totally completely discharged and, therefore, a considerable duration of the acceleration stop interval has been required until the motor is put into its stable state. Accordingly there has been a problem in that the motor tends to step out in the acceleration stop interval.
The present invention has been devised in view of the aforementioned problems inherent in the prior art techniques. It is, accordingly, an object of the present invention to provide a refrigerating apparatus which fails little at the time of starting. When a locked state of the compressor is detected during a starting sequence pattern operation in the refrigerating apparatus of the present invention, the compressor is restarted according to a starting sequence pattern of an output torque that is greater by one step.
Another object of the present invention is to provide a refrigerating apparatus which fails less at the time of starting by detecting a load torque of a DC motor based on the ambient temperature of a refrigerating system, a cooler temperature or an inhalation pressure, and by starting the motor according to a starting sequence pattern corresponding to the load torque from the beginning of operation.
A further object of the present invention is to provide a refrigerator control device capable of preventing the possible reduction in efficiency of the compressor due to the leakage heat loss, assuring a high efficiency even at a low rotational frequency, and remarkably reducing the amount of power consumption.
A still further object of the present invention is to provide a refrigerator control device capable of stably starting the compressor by generating a specified torque and executing a stable operation without incurring step-out just after the starting.
Another object of the present invention is to provide a refrigerator control device having an improved reliability by speedily executing oil supply at the time of starting and assuring a sufficient amount of lubricating oil when oil shortage occurs due to the occurrence of an unforeseen accident such as mixture of gas in the stage of slow rotation.
A further object of the present invention is to provide a brushless motor starter capable of operating the motor without step-out even when a high load torque is required after the starting by sufficiently reducing the transient DC component without providing any acceleration stop interval.
A still further object of the present invention is to provide a brushless motor starter capable of stably starting the motor by speedily completing a position detection process even at the time of closing the power during which the position detection is likely to be unstable, or by compulsorily terminating the process even when the process is not completed by decision.

Refrigerating apparatus and refrigerator control and brushless motor starter used in same


A luggage cover and wheel well assembly for transporting luggage. The luggage cover includes a generally rigid base and wheel well assembly positioned within the protective base. The wheel well assembly includes a base support and a pair of expandable members. The expandable members cooperate with the base support to move between a retracted position to an expanded position to secure luggage of various sizes within the luggage cover.

Shipping luggage has become an attractive option for travelers, either for convenience, necessity or economic reasons. As more and more airlines charge travelers to check a first or second bag on flights, and charge even more for bags over certain weight limits, luggage shipping is an attractive alternative. This is particularly true considering that even when a passenger pays a bag fee, excess bag fee, or an overweight bag fee, the airlines make no guarantees that the bag will make it to your destination, on time, or in good condition. And, of course, the baggage security policies are also to be considered. Airlines no longer permit locked suitcases (at least, not ones that cannot be opened with a master key for inspection). Incidences of lost, mishandled, or damaged luggage are well-known. From a convenience standpoint, a passenger traveling without luggage does not have to wait in line to check the bags before the initial flight and does not wait again at the baggage carousel at the destination. Nor must the traveler have to physically transport luggage to and from the airport.
Hence, shipping luggage has become a viable alternative. One solution is to purchase a corrugated suitcase box formed of cardboard to enclose a suitcase for shipping. These boxes are, generally, not reusable, must be purchased each time, and do not offer sufficient protection to the suitcase during shipping. Moreover, cardboard is not weather resistant, durable, or uniquely designed to protect the wheels, particularly, of the suitcase. Another solution is to place the luggage in a plastic tote. A rectangular standard size tote also is not uniquely designed to conform to the luggage and the luggage or suitcase is free to move within the container. No protection is provided for the easily damaged wheels of the suitcase as it moves freely within the container which may experience turbulence during transport.

Luggage cover and wheel well assembly for transporting luggage


The flat/round connecting device provides connection between conductors of a flat-ribbon, flat-conductor cable having at least two flat conductors and the round conductors of a round cable having at least two round conductors. The device comprises a plurality of individual connectors, each having two portions extending along a straight line or disposed at an angle of 90.degree. relative to each other. One of the portions has a flat conductor crimping zone with crimping tongues arranged at a mutual spacing for crimping to the flat conductors and the other portion has a round-conductor crimping zone with crimping tongues arranged at a mutual spacing for crimping to the round conductors and to the insulation of the round conductors.

There are a number of procedures for connecting the individual wires or conductors of electric cables. In accordance with one procedure the conductors are soldered together while another procedure provides that they are crimped together. Metal connectors essentially comprise two portions which are connected together by a transition and of which one portion has a flat-conductor crimping zone and the other portion has a round-conductor crimping zone. In one embodiment the transition is of such a shape that the two crimping zones include an angle to each other, preferably 90.degree.. At least two crimping tongues are disposed in each crimping zone. The crimping tongues are pressed onto the conductors, pushed through them and/or crimped around them. Increasingly smaller or thinner flat and round conductors are used in the course of miniaturization or because an increasing number of electric conductors have to be disposed in the same space. Therefore, when multi-conductor cables are being connected, the dimensions of the connectors also decrease therewith. Accordingly, when using the crimping procedure, the spacing between the individual connectors is also more and more reduced. There is a corresponding reduction also in the distance between the crimping zones of the connectors used for connecting the various conductors. Finally, the crimping zones with their crimping tongues are so close together that the air gaps or clearances between them become too small and leakage currents begin to flow.


According to one embodiment, a semiconductor device including a base, an emitter, and an emitter contact on top of the emitter is disclosed. For example, the semiconductor device can be a silicon-germanium heterojunction bipolar transistor, in which the base is formed from epitaxially deposited silicon-germanium, the emitter is formed from polycrystalline silicon, and the emitter contact is formed as a borderless contact on top of the emitter. The base includes a link base region, an extrinsic base region, and an intrinsic base region. For example, the intrinsic base region can be the region of the base in which the base-emitter junction is formed by out-diffusion of dopants from the emitter. The extrinsic base can be a low resistance region formed by implantation doping to provide a low resistance electrical path from a base contact to the intrinsic base region through the extrinsic base and link base regions. A disclosed structure also includes a link spacer. For example, the link spacer can be composed of silicon nitride. The link spacer can be formed by conformal deposition of dielectric material over the emitter followed by an etch back. The link spacer determines the length of the link base region situated directly below the link spacer and between the intrinsic and extrinsic base regions. The link spacer dielectric also provides electrical isolation for the base and emitter, allowing the use of a low resistance borderless emitter contact directly on top of the emitter.

1. Field of the Invention
The present invention relates to the field of fabrication of semiconductor devices. More specifically, the invention relates to the fabrication of silicon-germanium semiconductor devices.
2. Background Art
In a heterojunction bipolar transistor, or HBT, a thin silicon-germanium layer is grown as the base of a bipolar transistor on a silicon wafer. The silicon-germanium HBT has significant advantages in speed, frequency response, and gain when compared to a conventional silicon bipolar transistor. Speed and frequency response can be compared by the cutoff frequency which, simply stated, is the frequency where the gain of a transistor is drastically reduced. Cutoff frequencies in excess of 100 GHz have been achieved for the HBT, which are comparable to the more expensive GaAs. Previously, silicon-only devices have not been competitive for use where very high speed and frequency response are required.
The higher gain, speeds, and frequency response of the HBT have been achieved as a result of certain advantages of silicon-germanium not available with pure silicon, for example, narrower band gap, and reduced resistivity. Silicon-germanium may be epitaxially grown, however, on silicon wafers using conventional silicon processing and tools, and allows one to engineer device properties such as the band gap, energy band structure, and mobilities. For example, it is known in the art that grading the concentration of germanium in the silicon-germanium base builds into the HBT device an electric field, which accelerates the carriers across the base, thereby increasing the speed of the HBT device compared to a silicon-only device. One method for fabricating silicon and silicon-germanium devices is by chemical vapor deposition (xe2x80x9cCVDxe2x80x9d). A reduced pressure chemical vapor deposition technique, or RPCVD, used to fabricate the HBT device allows for a controlled grading of germanium concentration across the base layer. As already noted, speeds in the range of approximately 100 GHz have been demonstrated for silicon-germanium devices, such as the HBT.
Because the benefits of a high gain and high speed silicon-germanium HBT device can be either partially or completely negated by high base and emitter contact resistance, it is important that the resistance of the base and emitter contacts be kept low. In addition to the contact resistances, the geometry of the base and emitter regions may also affect the base and emitter resistance. For example, contact to the emitter has previously been made in a manner known in the art by designing an emitter which is xe2x80x9crouted outxe2x80x9d and whose width is increased to provide a satisfactory area in which to form an emitter contact. The geometry of the base region may necessitate providing a low resistance electrical pathway through a portion of the base itself between the base contact and the base-emitter junction. In order to provide lower resistance from the base contact to the base-emitter junction, the extrinsic base region is heavily doped by implantation (also called extrinsic doping). The heavily doped extrinsic base region has a reduced resistance.
The region in the base between the edge of the heavily doped extrinsic base region and the edge of the base-emitter junction is referred to as the link base region. The link base region adds a significant amount of resistance between the base contact and the base-emitter junction. It is, therefore, important for the reasons stated above that resistance of the link base region also be kept low. The resistance of the link base region is affected by the length of the link base region from the heavily doped extrinsic base region to the edge of the base-emitter junction. Since the base-emitter junction is substantially coterminous with an xe2x80x9cintrinsic base region,xe2x80x9d the link base region spans a distance between the intrinsic base region and the extrinsic base region. In other words, the link base region xe2x80x9clinksxe2x80x9d the extrinsic base region to the intrinsic base region.
The length of the link base region spanning from the heavily doped extrinsic base region to the intrinsic base region must be no smaller than a certain minimum separation distance in order to provide separation between the heavily doped region of the extrinsic base and the heavily doped region of the emitter near the base-emitter junction. The link base region itself is relatively lightly doped. If the separation between the heavily doped region of the extrinsic base and the heavily doped region of the emitter near the base-emitter junction is not greater than a minimum separation distance, the two heavily doped regions can form a high electric field junction and increase the leakage current between the emitter and the base, thereby degrading the performance characteristics of the HBT device.
Depending on the alignment of the sequence of steps in the fabrication process used to form the link base region, the intrinsic base region, the base-emitter junction, and to implant the heavily doped extrinsic base region, the distance across the link base region to the intrinsic base region can vary, often unpredictably. The distance across the link base region to the intrinsic base region is also referred to as the length of the link base region in the present application.
With perfect alignment of the sequence of steps in the fabrication process, the distance across the link base region can be minimized to the minimum separation distance just discussed. In that case, the link base resistance would also be minimized. In a fabrication process which uses two separate photomasks, for example, to form the link base region, the intrinsic base region, the base-emitter junction, and to implant the heavily doped extrinsic base region, there is always a margin of error in the alignment of the two photomask steps. Accounting for the misalignment of the two photomask steps in the fabrication process forces the fabrication of a much greater distance across the link base region than the minimum separation distance. Thus, the link base resistance is greater than the minimum possible link base resistance.
It is important to provide low resistances in the base and emitter contacts, the heavily doped extrinsic base region, and the link base region in order to improve the performance and operating characteristics of the HBT or other similar device such as a conventional bipolar transistor. Because the resistances of the base contact, the heavily doped extrinsic base region, and the link base region are in series, the reduction of any one of them will provide an improvement in the resistance of the conduction path from the base contact to the intrinsic base region of the HBT or base of other similar device. Moreover, high resistance of the long xe2x80x9crouted outxe2x80x9d emitter is not satisfactory for application to the HBT; it is desirable to contact the emitter directly from the top of the emitter.
Thus, there is need in the art to reduce the link base resistance while maintaining low emitter contact resistance. There is further need in the art to reduce the link base resistance by providing a fabrication process which does not rely on the alignment of separate photomasks to form the link base region, the intrinsic base region, the base-emitter junction, and to implant the heavily doped extrinsic base region. There is also need in the art for fabrication of a low link base resistance structure which allows contact to the emitter directly on the top of the emitter.
The present invention is directed to structure for reduction of base and emitter resistance and related method. The invention overcomes the need in the art to reduce the link base resistance while maintaining low emitter contact resistance in semiconductor devices.
In one embodiment, the invention provides a method for fabrication of a low link base resistance structure which allows contact to the emitter directly on the top of the emitter. The invention reduces link base resistance by a fabrication process which does not rely on the alignment of separate photomasks to form the link base region, the intrinsic base region, the base-emitter junction, and to implant the heavily doped extrinsic base region.
According to the invention the structure of a semiconductor device includes a base, an emitter, and an emitter contact on top of the emitter. For example, the semiconductor device can be a silicon-germanium heterojunction bipolar transistor, in which the base is formed from epitaxially deposited silicon-germanium, the emitter is formed from polycrystalline silicon, and the emitter contact is formed as a borderless contact on top of the emitter. The base includes a link base region, an extrinsic base region, and an intrinsic base region. For example, the intrinsic base region can be the region of the base in which the base-emitter junction is formed by out-diffusion of dopants from the emitter. The extrinsic base can be a low resistance region formed by implantation doping to provide a low resistance electrical path from a base contact to the intrinsic base region through the extrinsic base and link base regions.
The structure of the invention also includes a link spacer. For example, the link spacer can be composed of silicon nitride. The link spacer can be formed by conformal deposition of dielectric material over the emitter followed by an etch back. The link spacer determines the length of the link base region situated directly below the link spacer and between the intrinsic and extrinsic base regions. The link spacer dielectric also provides electrical isolation for the base and emitter, allowing the use of a low resistance borderless emitter contact directly on top of the emitter.
Moreover, the invention provides a method for fabricating a structure of low link base resistance with emitter contact directly on the top of the emitter using only a single photomask to form the link spacer, the link base region, the intrinsic base region, the base-emitter junction, and to implant the heavily doped extrinsic base region. Thus, the fabrication process of the invention does not rely on the alignment of separate photomasks.

Structure for reduction of base and emitter resistance and related method


The present invention relates to a liquid detergent composition comprising a surfactant, a subtilisin and a protease stabilizer that is 3-chlorobenzoic acid, 4-chlorobenzoic acid, 3-chlorophenylacetic acid, 3,5-dichlorobenzoic acid, 3-(3-chlorophenyl)propionic acid or their corresponding salts. The composition can further comprise a another enzyme that is a lipase, an amylase, a cellulase or mixtures thereof. The stabilizer can be present at a concentration of 0.001 to 20% w/w. The concentration of the subtilisin can be at least 1.5 g/L.

Storage stability problems are well known with liquids containing enzyme(s). Especially in enzyme-containing liquid detergents a major problem, in particular if the detergent contains protease, is that of ensuring enzyme activity over time.
The prior art has dealt extensively with improving the storage stability, for example by adding a protease inhibitor.
Boric acid and boronic acids are known to reversibly inhibit proteolytic enzymes. A discussion of the inhibition of one serine protease, subtilisin, by boronic acid is provided in Molecular & Cellular Biochemistry 51, 1983, pp. 5-32.
Boronic acids have very different capacities as subtilisin inhibitors. Boronic acids containing only alkyl groups such as methyl, butyl or 2-cyclohexylethyl are poor inhibitors with methylboronic acid as the poorest inhibitor, whereas boronic acids bearing aromatic groups such as phenyl, 4-methoxyphenyl or 3,5-dichlorophenyl are good inhibitors with 3,5-dichlorophenylboronic acid as a particularly effective one (see Keller et al, Biochem. Biophys. Res. Com. 176, 1991, pp. 401-405).
It is also claimed that aryl boronic acids which have a substitution at the 3-position relative to boron are unexpectedly good reversible protease inhibitors. Especially, acetamidophenyl boronic acid is claimed to be a superior inhibitor of proteolytic enzymes (see WO 92/19707).
In WO 96/41859 substituted phenyl boronic acids are disclosed as suitable enzyme stabilizers.
It has been found that borates are reprotoxic in animals and therefore there is a demand to find alternatives which can be used to stabilize the enzymes in liquid compositions. In a particular embodiment of the present invention the liquid composition does not comprise borate or boric acid.
In EP 0 378 261 S1 an enzyme stabilization system comprising carboxylic acids for aqueous liquid detergent compositions is disclosed.


A gap and height difference measurement module may include a mounting frame with a flange mounted on a first end thereof and a connecting frame mounted on a second end of the mounting frame, first and second housings mounted on both sides of the connecting frame respectively, a first light source mounted on a lower end of the first housing and emitting light onto the panels, a second light source mounted on a lower end of the second housing and emitting light onto the panels, first and second sensors respectively mounted on front ends of the first and second housings, and first and second filters that are respectively mounted to the first and second sensors so as to allow the first and second sensors to each extract straight-line elements from cross sections formed as the lights emitted from the first and second light are irradiated onto the panels.

1. Field of the Invention
The present invention relates to a gap/height difference measurement module for a vehicle and a control method thereof, which detect cross-section data on hemming edges of panels by measuring light sources, even when light, irradiated through the light sources onto vehicle body panels with different colors or with chrome molding, is scattered over the panels, and therefore accurately measure the gap/height difference between the panels of the vehicle body.
2. Description of Related Art
In general, various kinds of panels, such as the roof, hood, doors, and trunk lid, are attached to the body of a vehicle to form the outer appearance of the vehicle body.
Each panel to be attached to the vehicle body should be mounted in such a way as not to produce gaps or height differences with a neighboring panel or the vehicle body. To this end, workers conventionally had to check how well various kinds of panels were mounted, either with a gauge or with the naked eye.
Since the manual gauge check and naked-eye inspection made by workers are dependent upon workers' criteria of quality assessment and their ways of working, it is hard to check accurately whether various kinds of panels are mounted, either correctly or with an error. This leads to low reliability and makes it difficult to provide uniform quality control over vehicle bodies.
To prevent this, automated gap/height difference measurement systems for vehicles are used these days through the method of measuring gaps/height differences between a vehicle body and various kinds of panels with the use of a robot equipped with a camera or sensor.
A gap/height difference measurement module using sensors and light sources is applied to these gap/height difference measurement systems. when light emitted from each light source is irradiated between the panels, the sensors detect straight-line elements from cross sections formed by light through the panels and output them to a controller.
The controller measures the gap/height difference between the panels, based on the horizontal and vertical differences between cross points at curved hemming edges by offsetting the linear axes formed by the straight-line elements output by the sensors.
However, the conventional gap/height difference measurement module as described above has the drawback that, when two panels whose height difference is to be measured have different colors, or one of the panels has chrome molding, the measurement cannot be done with light with the same brightness irradiated from each light source.
As such, while conventional measurement of gaps/height differences between panels having different colors or having chrome molding was done by emitting light of difference brightness from each light source, it has the problems of low measurement accuracy and low measurement reliability, because the light of difference brightness from the panels with different colors or with chrome molding is scattered over the surfaces of the panels, thus making it difficult for the sensors to detect straight-line elements from cross sections formed through the panels by the light of different brightness.
The information disclosed in this Background of the Invention section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Gap/height difference measurement module for vehicle and control method thereof


The present disclosure relates to a radial and axial flux motor using integrated windings, which includes a rotor which includes a rotor core having a shape of a hollow cylindrical case, and permanent magnets for an inner lateral surface and permanent magnets for a ceiling surface that are coupled to the inner lateral surface and the ceiling surface of the rotor core respectively, and which is rotated about a shaft, and a stator which includes a stator core and windings coupled to the stator core and which is installed in the rotor. Therefore, a radial flux motor and an axial flux motor are integrated into one motor to be able to increase both efficiency and output.

A motor refers to an apparatus that uses a principle that a force is produced in a direction perpendicular to magnetic flux produced from a permanent magnet and electric current flowing through a conductor when the magnetic flux is perpendicular to a direction of the electric current, and converts this force into a rotational force.
This motor generally includes windings that are conductors conducting electricity, a stator including permanent magnets, a rotor converting electric energy supplied to the stator into mechanical energy, a shaft serving to support the rotor, and a bearing allowing the rotor and the shaft to be smoothly and constantly rotated.
This motor may be classified as a radial flux motor or an axial flux motor on the basis of a direction of the magnetic flux emitted from the permanent magnets.
The radial flux motor is configured so that permanent magnets mounted in a radial direction serves as the rotor, and windings for producing a magnetic field in a radial direction and a core to which a magnetic force from the permanent magnets is applied serve as the stator. With this configuration, the magnetic field produced by interaction of the permanent magnets and the windings is transmitted to the core so as to be able to generate a rotational force. This radial flux motor may be provided with a pulling plate in order to produce a preload for supporting the shaft on the bearing.
In contrast, the axial flux motor is configured so that windings producing a magnetic force in an axial direction are fixed to the stator and permanent magnets mounted in the axial direction are fixed to the rotor. A rotational force can be produced by interaction of the windings and the permanent magnets.
In the case of the aforementioned radial flux motor, since the permanent magnets are mounted so as to produce the magnetic field only in the radial direction, there is a limitation that an axial magnetic force is weak, and thus an axial preload is required for the bearing in order to axially support the rotor that is rotated. In contrast, in the axial flux motor, there is a disadvantage in that a greater axial magnetic force than needed is produced due to the permanent magnets mounted in the axial direction.

Radial and axial flux motor using integrated windings


An electric motor communication system for use with a fluid moving system and using at least one wireless sensor network is provided. The electric motor communication system includes an electric motor that includes a motor management device configured to transmit and receive input signals via the wireless sensor network, and a processing device coupled to said motor management device and configured to control said electric motor based at least in part on input signals received at said motor management device. The electric motor communication system also includes at least one external device configured to collect data and to transmit said input signals, via the wireless sensor network, to said electric motor.

The field of the disclosure relates generally to electric motor control systems, and more particularly, to wireless communications between electric motors and other devices using a wireless sensor network.
At least some known motor control systems include power switches for generating a motor control signal for an electric motor. The motor control systems may further include a wireless communication interface to facilitate remote control of the motor control system and thereby the electric motor. Some motor control systems may include both the power switches and the wireless communication interface within one package, printed circuit board (PCB), or other enclosure.
At least some known electric motors are coupled to a power control system by one or more wireless network (e.g., Wi-Fi™). Electric motors may also be connected to other external devices. These wireless networks require additional hardware that enables the transmission of wireless signals between the electric motors and other devices. Furthermore, the transmission of the wireless signals is subject to the additional hardware functioning properly and a wireless network provider delivering the wireless signals.

This patent is subject to a terminal disclaimer.

Systems and methods for wirelessly communicating within electric motor systems


The identification of a data storage device detected on a touch-sensitive display surface of a display device is described. In one embodiment, the presence and location of the data storage device is detected on the display surface and the data storage device is detected on a wireless communications channel. It is then confirmed that the data storage device detected on the wireless communications channel is the data storage device detected on the surface of the display device by communicating with the data storage device over a second communications channel.

The sharing of photographic and other data stored on mobile data storage devices, such as cell phones, cameras, personal digital assistants, etc., currently poses various difficulties. For example, currently a mobile device user may share such data by first transferring the data to a computer and then sharing the data by email, by uploading to a network server, etc. However, such sharing processes may take many user steps, and may be difficult to perform while a user is away from a home computer, for example, when on vacation, while at a restaurant, etc. Therefore, in these settings, photos are often shared by passing the mobile data storage device from person to person to view the photos on the device display. Due to the small size of such displays, it may be difficult for more than one or two people to simultaneously view a photograph.
Some mobile devices, such as cellular phones, may be equipped to send photographs and other such data to other devices over a cellular network. However, per transaction costs may be high for sending such data. Additionally, each transaction may involve multiple user steps. Further, the generally small sizes of mobile device displays may limit the number of persons who can view the data on the receiving device, and therefore may reduce user satisfaction with the sharing experience.
Likewise, some mobile data storage devices equipped with wireless communications technologies such as Bluetooth (IEEE 802.15.1) and WiFi (IEEE 802.11x) may be configured to allow the sharing of data with other similarly-equipped devices. However, sharing content via such technology also may involve many user steps to connect to and transfer content between devices. Eliminating steps to improve the user experience may pose problems where more than one data storage device is detected within communication range, as it may be difficult for each device to identify which device of the detected devices data is to be transferred to or from without user input steps.

Identification of devices on touch-sensitive surface