A liquid ejection device of the invention is constructed to eject a liquid to an ejection object. The liquid ejection device has a dot data generator configured to generate dot data from given image data, where the dot data represents a dot creation state in each pixel set on the ejection object. The liquid ejection device also has a liquid ejector equipped with a nozzle array including multiple nozzles aligned in a specific direction substantially perpendicular to a scanning direction. The liquid ejector makes multiple scans of the nozzle array in the scanning direction in a common printing area according to the generated dot data and ejects the liquid to the ejection object to create dots. The dot data generator has a specific print mode that generates corrective dot data by skipping a virtual dot array created by one scan from a group of dot arrays to be created by the multiple scans of the nozzle array, in order to prevent a potential contact with a dot array to be created by another scan. This arrangement desirably prevents unevenness of liquid ejection caused by a meandering scan of at least either the liquid ejector or the ejection object.

1. Field of the Invention
The present invention relates to a technique of ejecting a liquid to a liquid ejection object while scanning at least one of a liquid ejection head and the liquid ejection object.
2. Description of the Related Art
Printing devices have widely been used as an output device of images generated by computers and images taken with digital cameras. The printing device creates ink dots during scans on a printing medium to complete a printed image on the printing medium. The printing device generally creates dots and prints an image on the printing medium, while scanning at least one of a print head and the printing medium. In the line printer designed to complete a printed image by one scan, degradation of the printed image is ascribed to a meandering scan. A technique has been proposed to control the meandering of a paper feed scan (scan of the printing medium) and thereby prevent such image degradation (see, for example, Japanese Patent Laid-Open No. H08-217302).
There has, however, been no specific consideration about dot creation control with a view to preventing such image degradation. The inventors of the present application have found image degradation due to a meandering scan not only in the line printer but in the serial printer designed to complete a printed image by multiple scans. Such image degradation is not restrictive in printing devices but is commonly found in various liquid ejection devices as the problem of uneven liquid ejection.

Ejection device and ejection method with uneven liquid ejection control effect


Various methods and systems are provided for flowing fluid through a passageway block. In one embodiment, a passageway block comprises a first passage and a second passage, each of the first passage and the second passage including inlets and outlets to the passageway block, none of the inlets and outlets being concentric with one another; but within the passageway block, for at least a portion, a third passage concentrically surrounds the second passage.

Engines may utilize recirculation of exhaust gas from an engine exhaust system to an engine intake system, a process referred to as exhaust gas recirculation (EGR), to reduce regulated emissions. Additionally, engines may utilize one or more turbochargers to increase the power provided by the engine. Turbochargers function by compressing intake air in a compressor via a turbine operated by exhaust gas flow. In one example, various flow passages may connect the EGR system, a high pressure turbocharger, and a low pressure turbocharger. As such, a large number of components and joints may be required in such an engine system. The large number of components may increase engine system costs, along with increasing the potential for exhaust leaks.

Method and systems for a passageway block


A method for use when retrofitting a panel of a storage compartment having a mechanical latch assembly with an electric latch assembly includes removing the mechanical latch assembly from the panel of the storage compartment; and preparing the panel of the storage compartment to receive a potted insert. The preparation may include defining and marking a location to receive the potted insert. The method may include removing a portion of the panel to define a potted insert cavity and inserting the potted insert through the potted insert cavity of the panel. The method may also include applying at least one of a potting compound and an adhesive to bond the potted insert to the panel and coupling a portion of the electric latch assembly to the potted insert.

Technical Field
The present disclosure is generally related to potted inserts, and more particularly, to installation of potted inserts having a latch mechanism.
Description of the Related Art
Storage compartments used on various transportation vehicles, such as automobiles, buses, and aircraft, may be operable between an open and closed position. Shifting between the open and closed positions may be achieved through a mechanical latch system connected to a mechanical release component, such as, for example, a handle. Such mechanical latch systems, however, are expensive to maintain, as the mechanical latch system may comprise of multiple moving parts wherein each moving part would have to be sufficiently maintained, thus adding to maintenance costs. Further, having multiple moving parts would add avoidable payload to the transportation vehicles, thereby increasing fuel consumption. Still further, mechanical latch systems may not be aesthetically pleasing to passengers traveling on such transportation vehicles. As such, electric latch mechanisms provide a pleasing and less costly alternative to mechanical latch mechanisms.

Methods for installation of potted inserts having a latch mechanism


The invention provides an adapter for electrically connecting an electronic probe to an electronic device. A pair of jaws are slidably mounted on rails. Teeth protrude from the jaws in a position to engage the gaps between the leads of a fine pitch integrated circuit chip. A flex circuit has traces connecting exposed contacts on one end, which exposed contacts are located between the teeth. The contacts have the same pitch as the chip leads. A wire-filled elastomer is located over the exposed contacts. A screw passing through threaded bores in the jaws, draws the jaws toward each other, urging the teeth into the gaps to self-align the adapter, and compressing the elastomer, so that the wires in it connect each chip lead to one of the exposed contacts. A probe may be connected to a selected lead by connecting it to the appropriate through-hole.

1. Field of the Invention
The invention in general relates to electronic probe adapters, and more particularly to a probe adapter that adjusts to fit a variety of integrated circuit chips.
2. Statement of the Problem
To test electronic parts, such as integrated circuits, an electronic probe must be electrically connected to their leads. One common way of making the electrical connection is by manual probing. In manual probing the user holds a narrow-tipped electronic probe by hand and attempts to put the tip of the probe on the lead which carries the signal to be examined. As leads have become narrower and the spaces between them very small, holding a single point probe by hand accurately and steady enough to make an electronic measurement has become difficult. With current surface mount technology having leads less than 0.01 inches wide and having a pitch of less than 0.05 inches, manual probing is nearly impossible.
One solution to the problem of manual probing of fine pitch surface mount components has been to develop a probe adapter for each surface mount component package on the market. That is, an adapter is created which is of the precise size and shape to receive the leads of a specific integrated circuit package, and which provides terminals electrically connected to each lead, which terminals are relatively widely spaced and accessible to a probe. These package-specific adapters work well, but a user that is not able to anticipate the specific surface mount package that he or she will need to probe either has to wait days, weeks, or even months while the appropriate adapter is ordered and delivered, devise a jury-rigged adapter, or must resort to manual methods. A user could take the approach of purchasing every adapter he or she is likely to need. However, since a single adapter can cost $200 or more, this can become expensive. This solution also can be confusing to use, and bulky to carry for remote applications.
Another solution has been the use of a miniature hook or set of hooks which wrap around a lead and can be pulled up tight to make electrical contact. This solution was originally designed for through-hole components, but has been extended to other leads, particularly in emergencies. However, the requirement of hooking and wrapping around each lead has also become difficult as pitches of leads on chips has become finer. Typically the spaces for the probe to hook and wrap around a lead are less than 0.015 inches on fine pitch surface mount components. This small gap requires the hook material to be thin and fragile. Further, there is a danger of shorting the lead to be tested to the adjacent lead.
Another method that is not commercially sold but is certainly practiced is to solder a conductor to the lead or trace to be tested, then hook an existing probe to the soldered-in conductor. This procedure requires a soldering iron to be available and is very time consuming. Further, soldering near fine pitch surface mount components is risky since leads can be unknowingly shorted together.
None of the solutions to connecting to fine pitch leads is satisfactory for the typical electronics specialist who must routinely test a variety of electronic components. Thus there is a need for a fine pitch probe adapter that permits accurate, reliable, and quick connection of a probe to a wide variety of integrated circuit components having fine pitch leads.
3. Solution to the Problem
The invention solves the above problems by providing a probe adapter that adjusts to many, if not all, surface mount integrated circuit packages as well as many other integrated circuit devices.
The invention provides an adapter that easily connects the leads on an integrated circuit package of any width to a set of connecting terminals to which a probe is easily attached. The connections are made via an elastomer pad in which thousands of tiny wires are embedded.
The invention provides a device for clamping the elastomer pad between the leads of the electronic device and a set of contacts that connect to the connecting terminals. The set of contacts is preferably a set of exposed traces on one end a flex circuit. The other end of the flex circuit extends from the clamping device and contains the connecting terminals. The flex circuit is chosen so the exposed traces have the same pitch as the leads on the electronic device. Flex circuits of different pitches may be inserted into the clamping device.
The clamping device is preferably a vise-like framework having a pair of jaws that are screwed, ratcheted, or otherwise urged toward each other to clamp the adapter to the electronic device. Each of the jaws has one or more teeth that fit in the gaps between the leads of the electronic device to align the exposed traces on the flex circuit with the leads. The teeth are tapered so that as the jaws are urged toward each other, the teeth self-align between the leads, thereby aligning the exposed traces and the leads.
Each of the jaws has a pocket for locating and holding the elastomer so that as the adapter is clamped to the electronic device, the elastomer is compressed and the wires embedded in it make contact between the leads and the contacts of the flex circuit.
As indicated above, each of the contacts of the flex circuit connects to an electrical terminal. The terminals are preferably conductive through-holes into which the pin of a probe may be inserted, but may be any suitable connector.
The probe adapter is used by opening the jaws wider than the fine pitch electronic device to be tested. The jaws are aligned over the leads to be tested, with the teeth roughly in gaps between the leads, then forced toward each other to urge the teeth into the gaps between the leads and compress the wire-containing elastomer between the leads and the flex circuit contacts. When the adapter is clamped to the electronic device, a test instrument probe is connected to the terminals of the flex circuit.


A flash memory system comprises a logic block interface operable to receive a write command to store data from a host computer, a flash memory device operable to store the data in response to the write command, and a non-volatile memory communicatively coupled to the flash memory device and the logic block interface operable to temporarily store the data, and to provide the stored data to be written to the flash memory device in the event of a disruption during execution of the write command.

Flash memory devices have been recognized as an attractive non-volatile data storage option for mobile computers and smartphone devices because of their small size, light-weight, shock resistance, fast access speed, and low power consumption. It is anticipated that with further advances in flash memory technology, its popularity may rival or even outpace hard disks. However, due to the different construction of flash memory as compared with a hard disk device, there are special considerations that have to be addressed in order to take advantage of the flash memory device.
In a flash memory device, a write operation has to be preceded by an erase operation, which takes much longer than the write operation itself. Further, the smallest addressable unit for read and write operations is a page, but the smallest erasable unit is a block. This means that to even write a single byte of data into a flash memory requires the erase and restoration of a block of data. In the unexpected event of power loss after the data is erased but before the data is restored and written into the flash memory, data would be lost if no precaution has been taken to address this issue.
In some conventional flash memory devices, capacitive devices have been used to keep supplying power to the flash memory so that the write operation may be completed. Such implementations not only have large component costs, but may be inadequate as the completion time for the write operation is unpredictable. The power in the capacitive device may still be insufficient to complete the write.


A hanger support comprises a base comprising a vertical projection having a pivotal member at an upper end, a plurality of hanging grooves, a plurality of arc members each alternate with one of the hanging grooves, an upwardly raised tab at one end of the projection, and a lower flat abutted the tab. A pivotal engagement mechanism hinges to the other end of the projection of the base. The engagement mechanism comprises an opening at the free end and a slope on one edge of the opening; and a pair of parallel pad members on the bottom of the engagement mechanism; wherein the engagement mechanism is rotatable to cause the flat to contact the bottom of the engagement mechanism with the tab fastened in the opening by engaging the tab with the slope so that a plurality of hangers hung on the hanging grooves are clamped by the pad members in a locked state of the hanger support device. The fastening/unfastening of a hanger is by simply pivoting the engagement mechanism. Further, garments are neat while stored in a garment bag incorporating the hanger support.

1. Field of the Invention
The present invention relates to hanger supports and more particularly to a hanger support with vertically disposed garment hanging grooves.
2. Description of Related Art
Hanger supports have been widely used for fastening one or more hangers having hung garment(s). However, the conventional designs suffered from several disadvantages. For example, the fastening is not reliable, the structural strength is not sufficient, and the quality is poor. Hence, supported garments are messy in most commercially available hanger supports. Thus, improvement exists.
It is an object of the present invention to provide a hanger support device comprising a base, a pivotal engagement mechanism, a pin, and a pair of parallel pad members on the bottom of the engagement mechanism wherein the engagement mechanism is rotatable to secure to the base for causing the pad members to clamp on a plurality of hangers hung on the hanging grooves in a locked state of the hanger support device.
It is another object of the present invention to provide a hanger support device wherein the base comprises a plurality of hanging grooves and a plurality of arc members each alternate with one of the hanging grooves so that two adjacent hangers are suitably spaced apart.
It is still another object of the present invention to provide a hanger support device wherein a variety of hangers may be hung on the hanger grooves and clamped by pad members formed of elastomeric material so as to enhance the adaptability of the base.
It is still another object of the present invention to provide a hanger support device wherein the base further comprises an upwardly raised tab and the engagement mechanism comprises an opening at the free end so that the engagement mechanism is rotatable to cause the tab to fasten in the opening in a locked state of the hanger support device.
It is a further object of the present invention to provide a hanger support device further comprising a latching means wherein after the engagement mechanism is covered on the base, the latching means is pivotable to be secured in the locked state of the hanger support device.
To achieve the above and other objects, the present invention provide a hanger support device comprising a base comprising a vertical projection having a pivotal member at an upper end, a plurality of hanging grooves, a plurality of arc members each alternate with one of the hanging grooves, an upwardly raised tab at one end of the projection, a lower flat abutted the tab, and an elongate transverse slot abutted the other end of the projection; a pivotal engagement mechanism hinged to the other end of the projection, the engagement mechanism comprising an opening at the free end and a slope on one edge of the opening; and a pair of parallel pad members on the bottom of the engagement mechanism; wherein the engagement mechanism is rotatable to cause the flat to contact the bottom of the engagement mechanism with the tab fastened in the opening by engaging the tab with the slope so that a plurality of hangers hung on the hanging grooves are clamped by the pad members in a locked state of the hanger support device. By utilizing this hanger support, the fastening/unfastening of a hanger is by simply pivoting the engagement mechanism. Further, garments are neat while stored in a garment bag incorporating the hanger support.
The above and other objects, features and advantages of the present invention will become apparent from the following detailed description taken with the accompanying drawings.

Hanger support with vertically disposed garment hanging groves

7 Fl. Block B, No. 58, Sec. 1, Min Sheng E. Road


A coated cutting tool comprising a substrate and a coating layer formed on a surface of the substrate, wherein: the coating layer comprises a lower layer, an intermediate layer and an upper layer, the lower layer, the intermediate layer and the upper layer being laminated in order from the substrate side toward a surface side of the coating layer; the lower layer comprises a Ti compound layer; the intermediate layer contains α-Al2O3; the upper layer contains TiCN; an average thickness of each of the lower layer, the intermediate layer, and the upper layer is within a specific range; a ratio of a length of Σ3 grain boundaries to a total 100% length of all grain boundaries in a specific region of the upper layer is from 20% or more to 60% or less; and a ratio of (111)-oriented grains in the upper layer is 30 area % or more.

It is well known that a conventional coated cutting tool used for the cutting of steel, cast iron, etc., is a coated cutting tool which is obtained by depositing, via chemical vapor deposition, a coating layer with a total thickness of from 3 μm or more to 20 μm or less on a surface of a substrate consisting of a cemented carbide. A known example of the above coating layer is a coating layer consisting of a single layer of one kind selected from the group consisting of a Ti carbide, a Ti nitride, a Ti carbonitride, a Ti carboxide, a Ti oxycarbonitride, and aluminum oxide, or consisting of multiple layers of two or more kinds selected therefrom.
For example, JP2017-530019 T discloses a coated cutting tool consisting of a substrate of a cemented carbide, cermet, ceramic, steel or cubic boron nitride and a multi-layered wear resistant coating having a total coating thickness of from 5 μm or more to 25 μm or less and comprising at least two refractory coating layers deposited by chemical vapor deposition (CVD) or moderate temperature chemical vapor deposition (MT-CVD), the at least two refractory coating layers including a first coating layer and a second coating layer being deposited on top of each other, wherein the first coating layer consists of titanium aluminum nitride or titanium aluminum carbonitride Ti1-uAluCvNw, with 0.2≤u≤1.0, 0≤v≤0.25 and 0.7≤w≤1.15, and is deposited by CVD at a reaction temperature ranging from 600° C. or higher to 900° C. or lower, the second coating layer consists of titanium carbonitride TixCyN1-y, with 0.85≤x≤1.1 and 0.4≤y≤0.85, and is deposited on top of the first coating layer by MT-CVD at a reaction temperature ranging from 600° C. or higher to 900° C. or lower, wherein the second TixCyN1-y coating layer has a columnar grain morphology and the overall fiber texture of the TixCyN1-y coating layer is characterized by a texture coefficient TC (111)>2.


Systems, apparatuses and methods are described for assembling items made of fabric and other sheet materials such as plastics, fur, artificial fur, canvas, etc. In particular, the invention relates to forming plush replicas of plants, artificial plants, animals, mythical creatures, mascots and the like. For example, squares or other shapes are assembled into square pillows; pillows are assembled into triplets or other groupings; and the groupings are assembled into a larger item. A Grouping or assembly of pockets can be installed or mounted onto a stem or post. Replicas may include forms of Cannabis sativa, Cannabis indica, Christmas trees, wreaths, poinsettias, foxes, owls, whales, and the like.

1. Field
The present invention relates to systems, apparatuses and methods for assembling items made of fabric or other sheet-based materials such as plastics, fur, artificial fur, canvas, etc. In particular, the invention relates to forming plush replicas of plants, artificial plants, animals, mythical creatures, mascots and the like.
2. Related Art
Various fuzzy, plush, stuffed and fabric-based items have been created for many decades. One popular item in the early twentieth century was the teddy bear: a soft and stuffed toy sewn with fabric with a thick pile and formed to look like a bear. It was named after U.S. President Theodore "Teddy" Roosevelt, Jr. The teddy bear has been the subject of story, song and film. Further, teddy bears and other plush animals and other forms have become popular gifts for children and adults alike. Teddy bears and other cute creatures are often given to signify love, congratulations or sympathy. These plush creations have become part of the American culture and can be found in many online and brick-and-mortar retail outlets throughout the world.
American culture also has come to embrace aspects of the Cannabis sub-culture. A significant minority of America celebrates a small genre of films known as stoner films and is responsible for introducing pot paraphernalia and slang into the mainstream lexicography. In the U.S., the Cannabis sub-culture has its own celebrities, magazines, holidays and the like. Even in some states, Cannabis possession has become legalized.
It is at the intersection of the plush toy and Cannabis culture that the instant invention has its genesis. Improved systems, apparatuses and methods are described herein for creating and assembling plush items. One item illustrated is a replica of a Cannabis plant, an item familiar to those of the Cannabis culture. However, the teachings are not so limited, and the teachings from the invention described herein may be used in a variety of arts.


An inflatable medical dilation balloon and methods for forming the same wherein the balloon member is comprised of a polymer bled including a predominant amount of a crystalline polymer, e.g. a polyester, and a compliance enhancing additive polymer, e.g. a polyolefin, in amount sufficient to interrupt the crystalline structure of the crystalline polymer. The amount is about 20% or less of the polymer blend. The balloon member formed of the polymer blend is inflatable for medical dilation, e.g. of the prostrate.

Medical Balloons are intended to be collapsed about their long supporting devices. In the case of balloon catheters for, for example, prostate dilatation, a small size catheter is necessary to enable advancement of the catheter through the urethra and into the prostate where the balloon is to be inflated to sufficient pressure and without bursting so that the dilatation procedure may be accomplished. After use, the balloon must be deflated and withdrawn.


Lead frames supplied from a first supply unit are intermittently conveyed in a non-oxidizing atmosphere. An adhesive is supplied from a second supply unit onto islands of the lead frames, and also semiconductor chips are supplied from a third supply unit onto the islands. When one of different kinds of semiconductor chips supplied from the third supply unit is selected, the selected semiconductor chip is held by a holder having a configuration adapted to the selected semiconductor chip. Therefore, transfer means for semiconductor chips includes at least two kinds of holders.

1. Field of the Invention
The present invention relates to an apparatus for automatically assembling a plurality of semiconductor chips to provide a semiconductor device.
2. Description of the Related Art
FIG. 5 shows a general structure of a resin molded semiconductor device which includes a plurality of semiconductor chips. Reference numeral 51 denotes a lead frame, 52 an IC chip, 53 a transistor chip, 54 metal wire, 55 an adhesive, and 56 molded resin.
The semiconductor device, unlike a hybrid IC, employs lead frame 51 of a monolithic IC. A plurality of different or similar semiconductor chips, such as IC chip 52 and transistor chip 53, are bonded to an island of the lead frame 51. The electrodes of the semiconductor chips are connected to inner leads of the lead frame 51 by means of metal wires 54, thus providing the semiconductor device with a number of functions. This type of semiconductor device has been widely used because of the advantages: automatic fabrication is easily carried out, a good thermal conductivity is attained, efficient use of space is possible, and various kinds of packages are available.
The semiconductor chips are mounted on the island of the lead frame 51, typically, by means of adhesive 55. The adhesive 55 is, for example, electrically conductive paste, solder, gold foil (generally, an opposite surface of a semiconductor chip is plated with gold, and gold foil is rarely used).
FIG. 6 shows a conventional apparatus for automatically assembling the aforementioned semiconductor chips to provide a semiconductor device.
In a lead frame feed unit 61, lead frames are stocked in a magazine or stocked under a stacked state. The stocked lead frames are fed to a lead frame preheating unit 62 one by one and heated to a predetermined temperature. Subsequently, the lead frame is conveyed onto an XY-table 63. A semiconductor chip is fed from a semiconductor chip feed unit 64. The semiconductor chip is then aligned by an aligning unit 65. The chip is bonded to the island of the lead frame disposed on the XY-table. Prior to the bonding, an adhesive is applied to the mounting area of the island of the lead frame by means of an adhesive supply unit 66. A chuck transfer unit 67 is movable along a Y-axis, and transfers semiconductor chips from the semiconductor chip feed unit 64 through the aligning unit 65 onto the island of the lead frame disposed on the XY-table 63, thereby supplying the adhesive from the adhesive supply unit 66 to the island. The semiconductor chip feed unit 64 is so designed as to be able to feed a desired one of different or similar semiconductor chips arranged in the form of a chip tray or a wafer. The semiconductor chips are bonded, for example, in such a manner that similar chips are first bonded to all islands and then different chips are bonded. After bonding the chips to one lead frame, the XY-table 63 approaches a lead frame cooling unit 68 (63' denotes a range of movement of the XY-table 63), and the lead frame is transferred to the cooling unit 68. After the lead frame is cooled to a predetermined temperature, it is stored in a lead frame storing unit (e.g. a magazine) 69. A series of these operations are controlled by a control unit 70.
In general, however, as the adhesives employed to bond the semiconductor chip to the island, an electrically conductive paste or liquid solder has been used. When the conductive paste is used, it is subjected to a normal-temperature treatment and, subsequently, it is subjected to a curing treatment, thereby increasing a bonding strength. In the adhesive supply unit 66, the adhesive is put in a petri dish-like container. The adhesive is transferred from the container to a chuck 71 provided at the top of the chuck transfer unit 67 and then applied to the island of the lead frame. Thus, the range of movement of the XY-table must be wide, and a large space is disadvantageously required. On the other hand, the distance between both ends of the lead frame stage on the XY-table 63 is so short that an atmosphere necessary for manufacture or a non-oxidizing atmosphere cannot be satisfied. Consequently, surface oxidation of solder proceeds, and the wettability required at the time of bonding the chip is degraded, resulting in a low yield of manufactured products. Besides, regarding the productivity, if the XY-table 63 is not situated near the lead frame cooling unit 68 when the bonding of the semiconductor chip is completed, time is wasted to move the XY-table 63 to the vicinity of the lead frame cooling unit 68. Regarding the characteristics of the products, if one lead frame is mounted on the XY-table and a reducing or non-oxidizing atmosphere needs to be created, the structure of the entire apparatus becomes complex owing to the inadequate space. Unless this atmosphere is maintained, the characteristics are degraded due to bad wettability of solder and oxidation of lead frame. As a result, a step of removing the surface oxide must be provided in the subsequent mounting process. On the other hand, in the case where a reducing or non-oxidizing atmosphere is created, the semiconductor chip is exposed to a mixed gas (e.g. a mixture of hydrogen gas and nitrogen gas in a ratio of 1:9) of the reducing or non-oxidizing atmosphere until the bonding of the chips to one lead frame is completed. Some of the chips may be degraded in characteristic by the influence of hydrogen.
FIG. 7 shows in detail the semiconductor chip feed unit 64, aligning unit 65 and chuck transfer unit 67 in the conventional apparatus shown in FIG. 6.
The chuck transfer unit 67 is movable in the Y-direction by means of a ball screw 72. The amount of movement is controlled by the number of rotations (angle) of the ball screw 72. In the top of the chuck transfer unit 67, the chuck 71 is connected to a vacuum line. In the semiconductor chip feed unit 64, predetermined semiconductor chips 74, such as IC chips or transistor chips, are attached to a predetermined sheet 73. Though not shown, the semiconductor chip 74 to be picked up is detected by a TV camera, and the position of the chip 74 is corrected by an XY-table 75 so as to be picked up by the chuck 71. Thereafter, a pin 77 of a pushing unit 76 pushes one of the semiconductor chips, and the chuck 71 holds the pushed chip. The pushed chip is then transferred to the aligning unit 65. The chip is placed on an aligning table of the aligning unit 65. In order to bond the chip 74 to the island of the lead frame with high precision, the chip 74 is aligned with an aligning member 78.
It is difficult, however, to change the chuck 71 at the time of assembling the semiconductor chips. Therefore, it is necessary to treat semiconductor chips having different outer sizes by use of a single kind of chuck 71. If the chuck 71 is designed to hold the semiconductor chip having a small outer size, it cannot surely hold the semiconductor chip having a large outer size. In other words, deficient chucking occurs to provide a semiconductor device without the large mounted chip. As a result, the yield of products may be reduced. Although it is possible to detect the presence/absence of the semiconductor chip and to stop the operation of the apparatus if the chuck does not hold the chip, this decreases the operational efficiency of the apparatus and deteriorates the productivity. In addition, since the top of the chuck 71 is in contact with the electrode wiring layers of the semiconductor chip, the wiring surface is contaminated. In particular, a fine wiring pattern is damaged by contamination, resulting in a decrease in yield. It is also possible to use a recessed chuck so as not to contact the surface of the semiconductor chip. However, a plurality of semiconductor chips having different outer sizes must be treated by the single kind of chuck 71.
As has been described above, in the conventional semiconductor manufacturing apparatus, electrically conductive paste or liquid solder has been used as an adhesive. The adhesive is transferred by a chuck and supplied onto an island of a lead frame. In addition, the range of movement of the XY-table is wide, and efficient use of space is difficult. Thus, a reducing or non-oxidizing atmosphere is difficult to create, and the wettability of the semiconductor chip at the time of bonding is degraded. Consequently, the yield of products decreases and the quality of products deteriorates. On the other hand, if the reducing or non-oxidizing atmosphere is created, the structure of the apparatus is complicated.
Furthermore, the conventional semiconductor manufacturing apparatus is provided with only a single kind of chuck. If the chuck is designed to treat the semiconductor chip with a small outer size, it hardly holds or transfers the chip with a large outer size. If the apparatus is provided with a function of detecting the presence/absence of the semiconductor chip, the operational efficiency of the apparatus is lowered and the productivity is deteriorated.

Apparatus for automatically mounting a plurality of semiconductor chips on a lead frame


A method for transferring an element of binary information of the differential type present on two first bit lines to two second bit lines through a differential amplifier. The method includes a precharging phase followed by an evaluation phase of the first bit lines. The precharging phase consists of short-circuiting the first bit lines to each other and short-circuiting at least one of the second bit lines to the first bit lines. Such a differential amplifier may be utilized in an electronic circuit and assembly such as a carry select adder circuit.

Problems arise in the making of electrical assemblies including circuits that create logic signals whose value is defined by the sign of the potential difference between two output lines of these circuits.
These signals are generally applied to the inputs of other circuits in the assembly, and these circuits can themselves furnish differential signals intended for other circuits located downstream.
These output signals are created by an output stage able to furnish sufficient power to supply the input stages of the downstream circuits. In the case of differential binary signals, differential amplifiers are often used as the output stage.
For performance reasons, particularly in MOS or CMOS technology, "precharging" circuits are commonly used. During a first "precharging" phase the differential lines are charged with a given voltage then, during a second "evaluation" phase the lines are charged to voltages defining a logic state which is a function of the input signals applied to the circuit. Thus, in the case of differential signals, when one of the lines is evaluated at a first voltage, the supply voltage for example, the other line is charged to a second voltage, the ground voltage for example. In this case, the attempt is made to precharge the lines to a voltage close to half the supply voltage in order to reduce the line switching time. Precharging is then generally accomplished by means of a precharging circuit which, under the control of a precharging signal, places the lines in communication with an auxiliary supply supplying a voltage which is half the supply voltage. Usually, the precharging circuit has an equalizing circuit to short-circuit the two lines to ensure that the precharging voltages of these lines are equal.
However, this classic solution has the drawback of requiring an auxiliary power supply whose voltage is difficult to adjust precisely, particularly in the case of integrated circuits. This is because integrated circuits have wide manufacturing differences and it is not easy to modify the characteristics of some of their subassemblies after manufacture.

Method and circuit for transferring differential binary signals


The present technology relates to an image processing device, an image processing method, an image sensor, an information processing device, and a program that facilitate cancellation of a locked state. An image processing device includes: a detection unit that detects a predetermined state, using data from a plurality of sensors; and an imaging unit that captures an image of a predetermined object, in a case where the predetermined state is detected by the detection unit. The image processing device further includes a plurality of input interfaces that input the data from the plurality of sensors. When an application processor switches from an activated state to a non-activated state, detection by the detection unit is started. The present technology can be applied to a smartphone, for example.

Information processing devices such as smartphones that have a touch sensor or the like mounted thereon and perform an input operation in accordance with the position of an operating member with respect to the display screen are widely used these days. In such an information processing device, an unintended input operation is prevented by the use of a lock function that restricts input operations (Patent Document 1, for example). To use the functions of an application in a locked state, the user performs an unlocking operation and an application starting operation.

Image processing device, image processing method, image sensor, and information processing device

SONY SEMICONDUCTOR SOLUTIONS CORPORATION


A visor system includes a visor panel and guide for movably mounting the visor panel above the headliner of a vehicle. The guide includes an exit through which the visor panel extends when moved from a stored position above the headliner to a use position. The visor assembly further includes a pivot rod mounted near the exit for selectively engaging pivot rod engaging structure on the visor panel only when the visor panel is extended. One of the visor pivot rod engaging structure or pivot rod includes a torque control for providing a controlled torque for pivoting and holding the visor between selected use positions once extended. The pivot rod engaging structure decouples from the pivot rod as the visor is again retracted into the stored position.

The present invention relates to vehicle visors and particularly to a visor which extends from a concealed storage position to a use position and while doing so couples to a pivot control mechanism.
In the design of visor systems, and particularly those for use in modern vehicles, it is desirable to provide a visor which is concealed behind the vehicle headliner so that, when in a stored position, the visor is essentially hidden from view. This provides a more aesthetically appearing vehicle interior as well as eliminates the visor as a potential safety problem in the event of an accident.
A variety of slide-out visors have been proposed, including those shown in U.S. Pat. Nos. 4,989,910 and 4,929,014, both of which are assigned to the present assignee. These visors provide, in the first instance, a slide-out visor which includes a pivot control mechanism which is attached to and moves with the visor panel as it travels from a stored position behind the vehicle headliner to an extended use position. Although such visors perform their desired design goals, the movement of the pivot control mechanism for the visor, together with the visor panel, is somewhat difficult to achieve requiring close manufacturing tolerances to assure ease of control of the visor in its movement between stored and use positions.


A scan-load-based (SLB) dynamic scan configuration reconfigures scan structures via scan-load operation, thereby eliminating interconnect network distributing configuration signals, and employs common scan circuitry identical for designs at mask level and is suitable for ASIC implementations. The architecture includes reconfigurable scan cells, apparatus for distributing configuration data to the reconfigurable scan cells and for determining desired reconfiguration data for each of the reconfigurable scan cells, and a configuration-set (CS) signal. Each of the reconfigurable scan cells has a pass-through (PT) mode in which data input, either a scan-in (SI) or a system-data (SD) of the scan cell, is transparently passed to a scan-out (SO) terminal of the scan cell without requiring a pulse on a shift clock (SC). The configuration-set (CS) signal communicates with each of the reconfigurable scan cells. A pulse on the configuration-set (CS) signal triggers PT Hold latches to capture configuration data from corresponding slave latches, which in turn set configurations of each of the reconfigurable scan cells.

A. The Field of the Invention
The embodiments of the present invention relate to a scan configuration, and more particularly, the embodiments of the present invention relate to a scan-load-based dynamic scan configuration.
B. The Description of the Prior Art
Various scan design methodologies1 have been successfully used in digital systems and credited with improved testability, reduced cost of test and diagnosis, reduced time for process and system debugging, better system maintenance and serviceability, etc., among many manufacturing-critical and system develop metrics.2 Scan structures provide access points for controllability and observability to internal circuits, and are also essential to many test and test data compression techniques, such as STUMPS,3 the Illinois Scan Architecture,4 and SmartBIST,5 and many other well-known scan methods.6 Scan structures are typically customized on silicon for individual designs. With these techniques, scan configurations—once the circuit structures are placed on silicon—cannot be changed in post-silicon processes, such as test, diagnosis, and debug, limiting the space for optimal efficiency and effectiveness of these applications. 1 E. B. Eichelberger and T. W. Williams, "A Logic Design Structure for LSI Testing," in the Proceedings of the 14th Design Automation Conference, pp. 462-468, June, 1977; E. B. Eichelberger and T. W. Williams, "A Logic Design Structure for LSI Testability," Journal of Design Automation & Fault-Tolerance Computing, Vol. 2, No. 2, pp. 165-178, May, 1978; E. B. Eichelberger, T. W. Williams, E. I. Muehldorf, and R. G. Walther, "A Logic Design Structure for Testing Internal Array," in the Proceedings of the 3rd USA-JAPAN Computer Conference, pp. 266-272, October, 1978; A. Kobayashi, S. Matsue and H. Shiba, "Flipflop Circuit with FLT (Fault-Location-Technique) Capability," (in Japanese) in the Proceedings of IECEO Conference, pp. 962, 1968; Y. Miyagi, A. Kobayashi, and K. Kitano, "Hardware System of NEAC Series 2200 Model 700," (in Japanese) Paper Technology Group, IECE, Japan, TGOEC71-3, April 1971.2 S. DasGupta, R. G. Walther, and T. W. Williams, "An Enhancement to LSSD and Some Applications of LSSD in Reliability, Availability, and Serviceability," in the Digest of Papers of the 11th Annual International Symposium on Fault-Tolerant Computing, pp. 32-34, June 1981; W. C. Carter, H. C. Montgomery, R. J. Presis and H. J. Reinheimer, "Design of Serviceability Features for the IBM System/360," IBM Journal of Research & Development, pp. 115-126, 1964; K. Maling and E. L. Allen, "A Computer Organization and Programming System for Automated Maintenance," IEEET-EC: 63, pp. 887-895; J. H. Stewart, "Application of Scan/Set for Error Detection and Diagnostics," in the Digest of Papers of Semiconductor Test Conference, pp. 152-158, 1978.3 P. H. Bardell and W. H. McAnney, "Self-Testing of Multiple Logic Modules," in the Digest of Papers of International Test Conference, pp. 200-204, November 1982; P. H. Bardell and W. H. McAnney, "Parallel Pseudorandom Sequences for Built-in Test," in the Proceedings of International Test Conference, pp. 302-308, October 1984; P. H. Bardell and W. H. McAnney, "Simultaneous Self-Testing System," U.S. Pat. No. 4,513,418, Apr. 23, 1985.4 I. Hamzaoglu and J. H. Patel, "Reducing Test Application Time for Full Scan Embedded Cores," in the Proceedings of IEEE International Symposium on Fault Tolerant Computing, 1999, pp. 260-267; I. Hamzaoglu and J. H. Patel, "Reducing Test Application Time for Built-in Self-Test Test Pattern Generators," in the Proceedings of IEEE VLSI Test Symposium, pp. 369-375, 2000.5 B. Koenemann et al., "Logic DFT and Test Resource Partitioning for 100M Gate ASICs," presentation at the Test Resource Partitioning Workshop (TRP), 2000; B. Koenemann, C. Barnhart, B. Keller, T. Snethen, O. Farnsworth, and D. Wheater, "A SmartBIST Variant with Guaranteed Encoding," in the Proceedings of the 10th Asian Test Symposium, pp. 325-332, 2001.6 M. S. Abadir and M. A. Breuer, "Scan Path with Look Ahead Shifting," in the Proceedings of International Test Conference, pp. 165-170, June, 1985; M. S. Abadir, "Efficient Scan Path Testing Using Sliding Parity Response Compaction," in the Proceedings of International Conference on Computer Aided Design, pp. 332-335, November, 1987; K. T. Cheng and V. D. Agrawal, "An Economical Scan Design for Sequential Logic Test Generation," in the Proceedings of 19th International Symposium on Fault-Tolerant Computing, pp. 28-35, June 1989; S. DasGupta, P. Goel, R. G. Walther, and T. W. Williams, "A Variation of LSSD and Its Implications on Design and Test Pattern Generation in VLSI," in the Proceedings of International Test Conference, pp. 63-66, November 1982; S. P. Morley and R. A. Malett, "Selectable Length Partial Scan: A Method to Reduce Vector Length," in the Proceedings of the International Test Conference, pp. 385-392, 1991; C. Barnhart, V. Brunkhorst, F. Distler, O. Farnsworth, B. Keller, and B. Koenemann, "OPMISR: The Foundation for Compressed ATPG Vectors," in the Proceedings of the International Test Conference, pp. 748-757, October 2001; C. Barnhart, V. Brunkhorst, F. Distler, O. Farnsworth, A. Ferko, B. Keller, D. Scott, B. Koenemann, and T. Onodera, "Extending OPMISR beyond 10× Scan Test Efficiency," IEEE Design & Test of Computers, pp. 65-72, Vol. 19, No. 5, September/October 2002.
Dynamically reconfigurable scan chains7 can effectively reduce the cost of test. With dynamic scan, a MUX is placed at the output of a scan cell. When selected, the MUX can direct the scan-in to by-pass the scan cell. To reduce the use of the MUX blocks, a MUX may be used to by-pass a segment of a scan chain. Dynamic scan can also be applied to parallel scan chains. Random access scan (RAS) methods8 reduce test time and power consumption, as well as overcoming many other disadvantages associated with the classic serial scan, by enabling each scan cell to be uniquely and randomly addressable. The outputs of selected scan cells can also be directed to primary outputs for observation. These methods use large amount of interconnect resources to distribute many configuration or decoded address signals. Other MUX-based scan configuration techniques, such as the CircularScan9 and Virtual Scan Chains,10 have also been described to reduce test cost. 7 S. Narayanan and M. Breuer, "Optimal Configuring of Multiple Scan Chains," IEEE Transactions on Computers, Vol. 42, No. 9, pp. 1121-1131, September 1993; S. Narayanan and M. Breuer, "Reconfiguration Techniques for a Single Scan Chain," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 14, No. 6, pp. 750-765, 1995; A. R. Pandey and J. H. Patel, "Reconfiguration Techniques for Reducing Test Time and Test Data Volume in Illinois Scan Structure Based Designs," in the Proceedings of IEEE VLSI Test Symposium, pp. 9-15, 2002; S. Samaranayake, N. Sitchinava, R. Kapur, M. B. Amin, and T. W. Williams, "Dynamic Scan: Driving Down the Cost of Test," IEEE Computer, pp. 63-68, October 2002; S. Samaranayake, E. Gizdarski, N. Sitchinava, F. Neuveux, R. Kapur, M. B. Amin, and T. W. Williams, "A Reconfigurable Shared Scan-in Architecture," in the Proceedings of IEEE VLSI Test Symposium, 00. 9-14, 2003.8 H. Ando, "Testing VLSI with Random Access Scan," in the Proceedings of the COMPCON, pp. 50-52, February 1980; K. D. Wagner, "Design for Testability in the AMDAHL 580," in the Proceedings of the COMPCON, pp. 384-388, 1983; D. H. Baik, K. K. Saluja, and S. Kajihara, "Random Access Scan: A Solution to Test Power, Test Data Volume and Test Time," in the Proceedings of the 17th International Conference on VLSI Design, pp. 883-888, January 2004; A. S. Mudlapur, V. D. Agrawal and A. D. Singh, "A Random Access Scan Architecture to Reduce Hardware Overhead," in the Proceedings of International Test Conference, Paper 15.1, November 2005.9 B. Arslan and A. Orailoglu, "Test Cost Reducation through a Reconfigurable Scan Architecture," in the Proceedings of the International Test Conference, pp. 945-952, October 2004; B. Arslan and A. Orailoglu, "CircularScan: A Scan Architecture for Test Cost Reduction," in the Proceedings of the Design Automation and Test in Europe Conference and Exhibition, pp. 1290-1295, 2004.10 A. Jas, B. Pouya and N. A. Touba, "Virtual Scan Chains: A Means for Reducing Scan Length in Cores," in the Proceedings of the IEEE VLSI Test Symposium, pp. 73-78, April 2000.
Pre-structured, such as standard-cell, and pre-manufactured, such as FPGA, platforms, have been the main implementation vehicles for ASIC designs. Integration of design-for-test (DFT) circuit structures, such as scan circuits, is often executed based on individual designs, requiring DFT engineer(s) to insert and configure scan structures into each design. As large designs often contain more than 250 k scan cells, this DFT effort adds additional design development time and sometimes interferes with timing and other design issues, such as interconnect routing contention. It is important to point out that, with current practices, manufacturing test related circuitry is implemented as part of a design and during the design development process.
It is desirable to share a large number of manufacturing masks between individual ASIC designs. This is not only to reduce manufacturing cost, but also to maintain the quality and predictability of manufacturing process. Therefore, it seems to make every sense to embed all manufacturing test related circuit structures in implementation platforms, so that scan configuration is no longer a design issue and masks containing manufacturing test circuitry are fixed in each platform. This requires a scan-load-based dynamic scan configuration that reconfigures scan structures via scan-load operation, to thereby eliminate interconnect network distributing configuration signals that can be later reconfigured for individual designs in after-silicon applications, such as test, diagnosis and design debug. The above mentioned various MUX-based dynamic scan methods are not good candidates for this scan-load-based dynamic scan configuration that reconfigures scan structures via scan-load operation, to thereby eliminate interconnect network distributing configuration signals because more or less these methods use interconnect, and hence additional routing space, to distribute configuration signals.
Thus, there exists a need for a scan-load-based dynamic scan configuration that reconfigures scan structures via scan-load operation, to thereby eliminate interconnect network distributing configuration signals having minimum hardware and reconfiguration operation overhead.
Some of the concerns with the above mentioned MUX-based approaches are centered with the use of potentially large interconnect network to distribute dynamic configuration signals to each and every scan cells or segments. This direct-control via PIs provides the most flexibility to reconfigure and/or manipulate scan data, with the cost of using considerable interconnect routing space. Other concerns are related to signal integrity that may be affected by the distribution network which is likely to contain many long interconnects.
On the other hand, scan-load (a.k.a. scan-in) operation is used to shift data into scan cells. Therefore, it can be used to distribute reconfiguration signals to the scan cells. This would eliminate the distribution network used by MUX-based methods. To use scan-load operation to distribute reconfiguration signals reconfigurable scan cells or segments must be able to hold configuration data and maintain the reconfigured scan configuration for normal scan load and unload (a.k.a. scan-out) operations. This hold function can be implemented by integrating existing scan cell designs with a small hold block.
The following three United States Patents were cited in the International Search Report of applicant's corresponding PCT International Patent Application number PCT/US2007/016088:
(1) The U.S. Pat. No. 4,493,077 to Agrawal et al.
The U.S. Pat. No. 4,493,077 issued to Agrawal et al. on Jan. 8, 1985 in U.S. class 714 and subclass 731 teaches a large scale sequential integrated circuit made amenable to scan design testing by inclusion of special multiplexing and storage circuits that respond to a pair of test control pulses to reconfigure the circuit to include one or more shift registers and to step the scan test data through the shift registers. In particular, the pair of test control pulses are applied to the two terminals to which, in normal operation, are applied to the clock pulses that are used to control the storage elements and which, in this operation, are never both simultaneously high. To initiate the scan test operation, these test control pulses are made simultaneously high and the circuitry responds to the conditions.
(2) The U.S. Pat. No. 6,265,894 to Reblewski et al.
The U.S. Pat. No. 6,265,894 issued to Reblewski et al. on Jul. 24, 2001 in U.S. class 326 and subclasss 39 teaches an integrated circuit including a plurality of logic elements (LEs), each of which having a plurality of outputs, and a partial scan register. The plurality of LEs are operative to generate a plurality of output signals in response to a plurality of input signals correspondingly applied to the LEs. The partial scan register is reconfigurably coupled to select ones of the LEs so that, when enabled, the partial scan register is operative to capture and output on a scan bus a record of signal state values circuit elements emulated by the selected LEs in a particular clock cycle of an operating clock. The partial scan register is enabled with application of a scan clock appropriately scaled to the operating clock.
(3) The U.S. Pat. No. 7,191,373 to Wang et al.
The U.S. Pat. No. 7,191,373 issued to Wang et al. on Mar. 13, 2007 in U.S. class 714 and subclass 729 teaches a method and apparatus for inserting design-for-debug (DFD) circuitries in an integrated circuit to debug or diagnose DFT modules, which includes scan cores, memory BIST (built-in self-test) cores, logic BIST cores, and functional cores. A DFD controller is used for executing a plurality of DFD commands to debug or diagnosis the DFT modules embedded with the DFD circuitries. When used alone or combined together, these DFD commands will detect or locate physical failures in the DFT modules in the integrated circuit on an evaluation board or system using a low-cost DFT debugger. A computer-aided design (CAD) method is further developed to synthesize the DFD controller and DFD circuitries according to the IEEE 1149.1 Boundary-scan Std. The DFD controller supports, but is not limited to, the following DFD commands: RUN_SCAN, RUN_MBIST, RUN_LBIST, DBG_SCAN, DBG_MBIST, DBG_LBIST, DBG_FUNCTION, SELECT, SHIFT, SHIFT_CHAIN, CAPTURE, RESET, BREAK, RUN, STEP, and STOP.

Scan-load-based dynamic scan configuration


The present invention provides a highly reliable method of measuring an analyte in a sample using a redox reaction. In this method, a formazan compound is added to a sample prior to a redox reaction so as to eliminate the influence of any reducing substance in the sample. Thereafter, a reducing substance or an oxidizing substance derived from the analyte is formed, and the amount of the formed substance is measured by the redox reaction. The amount of the analyte is determined from the amount of the formed substance thus measured. As the formazan compound, for example, 1-(4-iodophenyl)-3-(2,4-disulfophenyl)-5-(2,4-dinitrophenyl) formazan can be used.

Conventionally, the measurement of the amount of an analyte in a sample using a redox reaction has been utilized for a wide range of applications. For example, such measurement has been utilized for measuring glycated proteins in applications such as biochemical analyses, clinical tests, and the like.
For instance, glycated proteins in blood, particularly glycated hemoglobin (HbA1c) in erythrocytes, are significant indicators in the diagnosis, therapy, and the like of diabetes, because they reflect the patient's past history of blood glucose levels. Glycated proteins in erythrocytes are measured using a redox reaction, for example, in the following manner.
First, erythrocytes are hemolyzed to prepare a sample. This hemolyzed sample is treated with a suitable protease or the like, and then treated with a fructosyl amino acid oxidase (hereinafter referred to as FAOD) so as to form hydrogen peroxide. The amount of the hydrogen peroxide formed corresponds to the amount of a glycated protein in erythrocytes. Then, a peroxidase (hereinafter referred to as POD) and a reducing agent further are added to the reaction solution, so that a redox reaction occurs between the hydrogen peroxide and the reducing agent with the POD as a catalyst. At this time, when a reducing agent that develops color when it is oxidized is used, the amount of the hydrogen peroxide can be determined by measuring the color developed. As a result, the amount of the glycated protein in erythrocytes can be determined.
However, various types of reducing substances, such as ascorbic acid (AsA) and bilirubin, usually are present in blood. Moreover, various types of reducing substances such as glutathione (GSH) are present in erythrocytes. These reducing substances may reduce the hydrogen peroxide, may inhibit the redox reaction, or may reduce the reducing agent after it develops color, so as to degrade the color. Therefore, there has been a problem that it is difficult to determine the amount of the glycated protein in erythrocytes accurately.
Also, there has been another problem that the accuracy of the measurement may deteriorate because the concentrations of the reducing substances contained in samples are not constant.
In order to avoid these problems, for example, various types of oxidizing agents have been added to samples. For example, JP 56(1981)-151358 A discloses a method of using halogen oxides, such as iodic acid or periodic acid, as oxidizing agents. JP 57(1982)-13357 A, JP 57(1982)-161650 A, JP 59(1984)-193354 A, JP 62(1987)-169053 A, and JP 3(1991)-30697 A also disclose methods of using complexes of metals such as cobalt, iron, cerium, etc. as oxidizing agents.
However, the influence of the reducing substances on the measurements cannot be avoided sufficiently even with the use of these oxidizing agents. In particular, these oxidizing agents performed poorly when the analyte is a component in erythrocytes.

Method of assay by oxidation-reduction reaction with formazan


A method of estimating an orthogonal frequency division multiplexing (OFDM) integer frequency offset is disclosed. The method includes generating N combined sub-carrier components by superposing G received sub-carrier components of N received sub-carrier components constituting received symbol, outputting a primary estimated integer frequency offset value from a candidate value, which makes primary correlated values, obtained with respect to primary integer frequency offset candidate values, to be largest, and outputting a secondary estimated integer frequency offset value from a secondary candidate value, which makes secondary correlated values, obtained with respect to secondary integer frequency offset candidate values based on primary estimated integer frequency offset value, to be largest.

1. Technical Field
The present invention relates generally to orthogonal frequency division multiplexing (OFDM) demodulation technology and, more particularly, to technology for estimating an OFDM integer frequency offset.
2. Description of the Related Art
OFDM signals have been widely used as physical layer standard technology in high-speed wireless communication standards, such as WiFi, Long Term Evolution (LTE), IEEE 802.16, etc. due to their advantages of being robust to multipath fading and achieving high frequency efficiency.
OFDM signals perform modulation and demodulation in the frequency domain, and particularly transmit information on their sub-carriers.
Due to the instability of an oscillator on a reception side or the Doppler effect, a frequency offset occurring in a carrier is indispensible. This frequency offset becomes an absolute cause of error during the demodulation of an OFDM signal because the OFDM signal encodes information in the frequency. Unless a frequency offset is accurately estimated and compensated for, an OFDM symbol is shifted by the frequency offset in the frequency domain, so that the orthogonality of a carrier is destructed, thereby making demodulation impossible or resulting in demodulation into a symbol having completely different information.
A frequency offset is classified as an integer frequency offset that is represented by an integer multiple of a sub-carrier spacing, or a fractional frequency offset that is represented by a value within a sub-carrier spacing. An integer frequency offset and a fractional frequency offset are independently estimated because they have different influences on an OFDM signal and are estimated using different estimation methods. Generally, a fractional frequency offset is estimated first, and then an integer frequency offset is estimated by compensating for the fractional frequency offset.
In general, the estimation of and compensation for an OFDM frequency offset are performed using training symbols that have been made known to both a transmission side and a reception side in advance.
A transmission side generates an OFDM training symbol via an inverse fast Fourier transform (IFFY) and transmits it. If it is assumed that a fractional frequency offset has been completely estimated and compensated for using a well-known method, a reception side estimates an integer frequency offset based on a frequency offset candidate value related to the acquisition of the largest correction result by performing a correlation operation on previously known local training symbols and local symbols shifted using a plurality of frequency offset candidate values, with respect to a received OFDM symbol.
In this case, the conventional technology of the following non-patent document [1] is problematic in that it cannot correctly estimate an integer frequency offset when there is a time offset. Although the conventional technology of non-patent document [2] can overcome the influence of a time offset, it is problematic in that it requires highly complex operations.
Accordingly, there is a need for a new method of estimating an integer frequency offset, which is capable of eliminating high complexity, i.e., the problem of conventional frequency offset estimation schemes, while overcoming the influence of a time offset.

Method for estimating OFDM integer frequency offset, OFDM integer frequency offset estimator and OFDM receiver system

Research & Business Foundation Sungkyunkwan University


The present invention is directed to novel G protein-coupled receptors that are found predominantly in the dorsal root ganglia. The invention encompasses both the receptor proteins as well as nucleic acids encoding the proteins. In addition, the present invention is directed to methods and compositions which utilize the receptors.

G protein-coupled receptors (GPCRs) constitute a family of proteins sharing a common structural organization characterized by an extracellular N-terminal end, seven hydrophobic alpha helices putatively constituting transmembrane domains and an intracellular C-terminal domain. GPCRs bind a wide variety of ligands that trigger intracellular signals through the activation of transducing G proteins (Caron, et al., Rec. Prog. Horm. Res. 48:277–290 (1993); Freedman et al., Rec. Prog. Horm. Res. 51:319–353 (1996)).
More than 300 GPCRs have been cloned thus far and it is generally assumed that there exist well over 1000 such receptors. Mechanistically, approximately 50–60% of all clinically relevant drugs act by modulating the functions of various GPCRs (Cudermann, et al., J. Mol. Med. 73:51–63 (1995)). Of particular interest are receptors located in dorsal root ganglia. This region of the central nervous system is densely innervated with primary or afferent sensory neurons involved in the transmission, modulation and sensation of pain. Thus, receptors from this region may be used in assays for the identification of new agents for anesthesia and analgesia

Human G protein-coupled receptor expressed in the dorsal root ganglia


A device for producing spherical silica grains includes a cylinder having its axis inclined to the horizontal and an inside wall made from a material that is significantly softer than silica. The cylinder has an entry chute for non-spherical silica grains and an exit chute for spherical cylinder grains. A rotary member is rotated at high speed by a drive shaft having its axis coincident with the axis of the cylinder. The rotary member includes at least one paddle vertically aligned with the entry chute so that silica grains entering via the entry chute are thrown by the paddle against the inside wall of the cylinder and follow a path most of which is against the wall before leaving via the exit chute.

1. Field of the Invention
The present invention concerns the manufacture of silica powder and in particular a method of manufacturing silica powder with spherical grains specifically intended to be used in the fabrication of optical fiber preforms.
2. Description of the Prior Art
The fabrication of an optical fiber preform is well known in this art. One fabrication method described in U.S. patent application Ser. No. 08/087,060 of Jul. 7, 1993 consists in forming a suspension in water of synthetic silica soot having a specific area of less than 80 m.sup.2 /g and containing 50% to 75% by weight silica, gelling the suspension, drying the gel obtained using microwaves, fractioning the dried gel into silica grains having a diameter between 10 .mu.m and 1 mm and screening between 100 .mu.m and 500 .mu.m. The silica grains obtained in this way are then densified in a furnace at a temperature of approximately 1 300.degree. C. before they are deposited by plasma spraying and melting onto a primary preform, as described, for example, in the article by Le Sergent et al "Preform Technologies for Optical Fibers" in Electrical Communication, Vol. 62, N.sup.o 314, 1988. The object of densifying the grains before making the preform is to increase the rate of deposition of the grains onto the primary preform.
Known as the sol-gel method, this fabrication method unfortunately has the drawback that the grains obtained do not have the required spherical shape; they are usually rectangular or ovoid in shape. This is a problem when the grains are used to make a preform. The preform obtained contains bubbles of gas trapped between the grains. These bubbles make the preform and the resulting optical fiber fragile by creating microstresses that can cause the optical fiber to break. Furthermore, if the grains are not spherical they do not flow well into the plasma flame during fabrication of the preform.
For this reason a primary object of the invention is to provide a device for producing spheroidal grains for application to optical fibers.
Another object of the invention is to provide a method of producing spherical silica grains to be used to make optical fiber preforms.

Apparatus for manufacturing silica powder with spherical grains


A CPR machine (100) is configured to perform, on a patient's (182) chest, compressions that alternate with releases. The CPR machine includes a compression mechanism (148), and a driver system (141) configured to drive the compression mechanism. A force sensing system (149) may sense a compression force, and the driving can be adjusted accordingly if there is a surprise. For instance, driving may have been automatic according to a motion-time profile, which is adjusted if the compression force is not as expected (850). An optional chest-lifting device (152) may lift the chest between the compressions, to assist actively the decompression of the chest. A lifting force may be sensed, and the motion-time profile can be adjusted if the compression force or the lifting force is not as expected.

In certain types of medical emergencies a patient's heart stops working, which stops the blood from flowing. Without the blood flowing, organs like the brain will start being damaged, and the patient will soon die. Cardio Pulmonary Resuscitation (CPR) can forestall these risks. CPR includes performing repeated chest compressions to the chest of the patient, so as to cause the patient's blood to circulate some. CPR also includes delivering rescue breaths to the patient, so as to create air circulation in the lungs. CPR is intended to merely maintain the patient until a more definite therapy is made available, such as defibrillation. Defibrillation is an electrical shock deliberately delivered to a person in the hope of restoring their heart rhythm.
For making CPR circulate blood effectively, guidelines by medical experts such as the American Heart Association provide parameters for the chest compressions. The parameters include the frequency, the depth reached, fully releasing after a compression, and so on. Frequently the depth is to exceed 5 cm (2 in.). The parameters also include instructions for the rescue breaths.
Traditionally, CPR has been performed manually. A number of people have been trained in CPR, including some who are not in the medical professions, just in case they are bystanders in an emergency event. Manual CPR might be ineffective, however. Indeed, the rescuer might not be able to recall their training, especially under the stress of the moment. And even the best trained rescuer can become fatigued from performing the chest compressions for a long time, at which point their performance might be degraded. In the end, chest compressions that are not frequent enough, not deep enough, or not followed by a full release may fail to maintain the blood circulation required to forestall organ damage and death.
The risk of ineffective chest compressions has been addressed with CPR chest compression machines. Such machines have been known by a number of names, for example CPR chest compression machines, CPR machines, mechanical CPR devices, cardiac compressors and so on.
CPR chest compression machines hold the patient supine, which means lying on his or her back. Such machines then repeatedly compress and release the chest of the patient. In fact, they can be programmed so that they will automatically compress and release at the recommended rate or frequency, and can reach a specific depth within the range recommended by the guidelines.
The repeated chest compressions of CPR are actually compressions alternating with releases. The compressions cause the chest to be compressed from its original shape. During the releases the chest is decompressing, which means that the chest is undergoing the process of returning to its original shape. This process is not immediate upon release, and it might not be completed by the time the next compression is due. In addition, the chest may start collapsing due to the repeated compressions, which means that it might not fully return to its original height even if it had the opportunity.
Some CPR chest compression machines compress the chest by a piston. Some may even have a suction cup at the end of the piston, with which they lift the chest at least during the releases. This lifting may actively assist the chest in decompressing faster than the chest would accomplish by itself. This type of lifting is sometimes called active decompression.
Active decompression may improve air circulation in the patient, which is a component of CPR. The improved air circulation may be especially critical, given that the chest could be collapsing due to the repeated compressions, and would thus be unable by itself to intake the necessary air.

CPR chest compression machine adjusting motion-time profile in view of detected force


Para-polyphenylene sulfide, a non-composite, ultrahigh-temperature-resist, thermoplastic resin, is employed for the manufacture of interceptor motor cases. The thermoplastic resin, para-polyphenylene sulfide, has a combination of properties which are of particular interest in the fabrication of interceptor rocket motor cases. Para-polyphenylene sulfide in ribbonized form is wound directly onto the required mandrel and then fused into a solid mass. The fused, solid mass has the properties which enables it to serve as both insulator and motor case material. The manufacture of a combination insulated motor case is achieved by the following method: The equipment, first, involves the fabrication of a breakout mandrel by one of several methods. The para-polyphenylene sulfide is ribbonized by extrusion and wound down on the breakout mandrel to the required thickness and fused into a solid mass by heating to its melt temperature of about 285.degree. C. The breakout mandrel is removed to release the interceptor rocket motor case which functions as both insulator and interceptor rocket motor case material.

Insulation is generally required to protect a rocket motor case from the hot corrosive gases resulting from the combustion of the solid rocket motor propellant contained within the rocket motor case.
In one conventional process for fabricating and installing the insulator in an interceptor/missile motor, if required, the steps described below are employed. The function of the insulator is to provide thermal protection to the motor case. The process is time consuming and costly because the insulator is prepared in three segments, namely, the forward dome insulator, the aft dome insulator, and the motor case side wall insulator. The forward and aft dome insulators are laid up in female molds using calendered sheets of insulator to obtain the required thickness. Several different thicknesses are required to provide the insulative requirements, and are predominantly influenced by the combustion flame temperature of the propellant and its internal grain configuration. The insulation segments are cured, then the forward and aft dome insulators are bonded into the motor case using an adhesive. The center section of the insulator is next laid up. A bladder is inserted into the motor case and inflated. The bladder pushes the insulation up tightly against the interior of the motor case. The center insulation is then cured, and the bladder is removed. The propellant casting mandrel is inserted, and the propellant cast into the insulated motor.
U.S. Pat. No. 4,596,619, which was issued to John D. Marks on Jun. 24, 1986, discloses apparatus and another method of making an elastomer lined composite vessel having a dome-like shape. This method employs a thin, tacky ribbon comprising elastomer which an applicator moving relative to the rotational axis of a rotating mandrel causes integral segments of ribbon to adjacently position and tack together on the surface of the mandrel thereby covering the mandrel, including the dome-like shaped portion. Filament winding a casing comprising filaments and thermosettable resin around the elastomer layer is next completed, and the thermosettable resin and elastomer layer is cured to yield a composite vessel.
Thus, composite vessels and composite rocket motor cases as presently constructed require resin preparation, fiber impregnation, or debulking and compaction of wound structures when filament is employed. In most structures requirements for external and internal motor case insulation exist. Thermosetting resins, such as epoxy resins, are employed in various processes. When the thermosetting resins are polymerized during curing, they cannot be softened, recovered, and recycled. Therefore, the presently used materials are not attractive for recycling as they must be scrapped. Because of environmental restrictions any materials which are presently scrapped have to be disposed of in an acceptable manner. Disposing of these materials in an acceptable manner whether it be by approved burning or disposing to landfills adds considerable cost to waste disposals since environmental laws place restrictions on disposal operations to guard against polluting the environment.
The desirability of providing a recyclable thermoplastic resin for use in the fabrication of high temperature-resistant rocket motor cases is recognized.
An object of this invention is to provide non-composite, thermoplastic, high temperature-resistant rocket motor cases.
A further object of this invention is the employment of a thermoplastic resin in the fabrication of interceptor rocket motor cases.
Still a further object of this invention is the employment of a thermoplastic resin which serves as both an insulator and an interceptor rocket motor case material.

Method of preparing non-composite, thermoplastic, high-temperature-resistant rocket motor cases

The United States of America as represented by the Secretary of the Army


A surge protector is provided for a multi-phase watthour meter. The surge protector allows all three phases to be protected using a single resistive block and ground strap. Separate first electrodes are connected to each phase of the circuit and each electrode is disposed adjacent one end of a different hole formed in the meter base. A second electrode is disposed at the opposite end of the holes and forms a tip at each hole, thereby forming separate spark gaps with each of the first electrodes. A resistive block mounted on the outboard side of the meter base is in surface contact with the second electrode and a single ground strap is in contact with the resistive block so as to ground the meter to its socket when arcing occurs in the spark gaps.

There is shown in FIG. 1 an example of a watthour meter 1 according to the prior art. Although such meters come in various styles, they are generally comprised of a meter body 32 which mates with a socket 29 which may be attached to a conventional meter box (not shown). The meter body 32 has a base portion 2 to which a cover 41 is attached using lugs 40, shown in FIG. 2. The cover encloses a metering element for sensing the power consumed in a load circuit. Traditionally, the metering element was a mechanical register having a number of dials for indicating the power consumed. More recently, electronic meters have been developed in which the metering element is an electronic register 34 which, using techniques well known in the art, electronically performs the watthour accumulating function of a traditional mechanical register, as well as other specialized function, such time of day use and peak demand.
As shown in FIG. 1, the socket 29 is connected to ground via conductor 33. In addition, the socket 29 has two openings 31 through which the incoming and outgoing conductors of a three phase load circuit (not shown) are fed. Each phase of the load circuit is connected to one of three pairs of jaws 30 formed in the socket 29. A additional jaw 30 is connected to the ground wire of the load circuit. The meter body 32 has three pairs of blades 3 extending from the outboard side 38 of the meter base 2, each of which connects with one of the jaws 30 in the socket 29. Referring to FIG. 2, in this example, blade pairs 3.sup.1, 3.sup.2, and 3.sup.3 are connected via the jaws 30 to the first, second and third phases of the load circuit. Blade 3.sup.4 is connected via a jaw 30 to the ground wire of the load circuit.
As shown in FIG. 1, a conductor 43 connects each blade 3 to the other blade in the pair so that the circuit is not interrupted, thereby allowing the current flowing in the load circuit to pass through the meter 1. A current transducer 35 and a voltage transducer 42 are provided for each of the blade pairs 3.sup.1, 3.sup.2 and 3.sup.3 shown in FIG. 2. The current and voltage transducers 35 and 42, respectively, are connected to the metering element and step down the current and voltage in the load circuit to values suitable for metering. As shown in FIG. 2, a vent 12 is formed in the meter base.
In order to protect the meter from transient surges in either the utility service or user circuits connected to the meter, surge protectors, sometimes referred to as "lightening arrestors," are conventionally provided. As shown in FIGS. 2-4, according to the prior art, a three phase meter such as that shown in FIG. 1 is provided with three surge protectors, one for each phase. Each surge protector is comprised of an electrode 6, conductor 5, resistive block 8, ground strap 7 and spark gap 14. The electrodes 6 are connected by conductors 5 to one of the voltage input blades 3 in each blade pair in this example. A post 9 protruding from the meter base 2 secures each electrode 6 to the inboard side 36--that is, the side enclosed by the cover 41--of the meter base. As shown in FIG. 4, each resistive block 8 is disposed in a hole 15 formed in the meter base. A dimple 13 formed in the end of the electrode 6 presses the electrode against the resistive block 8. A hole 10 extends from the bottom of hole 15 and a ground strap 7 lies over the hole 10. Posts 9 secure the ground straps 7 to the outboard side 38 of the meter base 2. The end 44 of the ground strap 7 extends from the outboard side 38 so that it is spring loaded against the socket 29 when the meter body 32 is attached thereto. A dimple 13 formed in the ground strap 7 forms a spark gap 14 between it and the resistive block 8.
A voltage potential is created across the spark gap 14. During normal operation this potential is too small to cause arcing. However, a transient surge in any phase will increase the voltage developed across the spark gap 14 of the surge protector connected to that phase. If the voltage potential becomes great enough, the air within the spark gap 14 will ionize, thereby creating an arc across the gap which diverts the surge to ground via the ground strap 7, socket 29 and conductor 33. Since ionization creates gases in the spark gap 14 which are highly conductive, the resistive block 8 is placed in series between the electrode 6 and ground strap 7 to prevent the arcing from causing excessive current to flow and to ensure that this current flow extinguishes at the zero crossing of that current.
Although the surge protector arrangement according to the prior art, as described above, works well for its intended purpose, it requires a large number of components for a three phase meter. Specifically, the resistive blocks 8 and ground straps 7 must be duplicated for each phase. Moreover, since the paint on the socket 29 must be manually scrapped away in the vicinity of the ground strap 7 to ensure good electrical contact, the labor required to install a meter employing prior art surge protectors is significantly increased. In addition, since the resistive block 8 is mounted on the inboard side 36 of the meter base 2, the meter cover 41 must be removed to replace the resistive block. This increases the labor associated with maintaining the meter.
Accordingly, it would be desirable to provide a surge protector arrangement for a multi-phase watthour meter which did not require the multiplicity of components necessary under the prior art approach and which allowed the resistive block to be replaced without removing the meter cover.


An oxygen absorption composition without requiring moisture in oxygen absorption which comprises an oxygen absorbent comprising, as a principal component, an oligomer in liquid form having an unsaturated group, a number-average molecular weight in the range of 150 to 4,000 and a viscosity in the range of 100 to 4,000 cP such as butadiene oligomer in liquid form and an oxygen absorption-accelerating substance, being supported on a carrier; and an other gas absorbent. The principal component may be replaced with an oligomer in liquid form having an unsaturated group and being incorporated with an oxygen-unabsorptive diluent to adjust the viscosity of the mixture to 10 to 4,000 cP. The composition is enhanced in oxygen absorption capability in every preservation atmosphere from a low humidity to an intermediate and high humidity, easily producible, minimized in gas generation after oxygen absorption and almost free from odor.

1. Field of the Invention
The present invention relates to an oxygen abosorption composition which has functions of absorbing oxygen, inorganic gases, organic gases, moisture in some case and the like without requiring moisture in absorbing oxygen, and which is used for the preservation of metallic part items, electronic part items, electric part items, precision part items, magnetic/optical part items, ornamental jewellery, weapons, aircrafts, automobiles, glass, rubber products, photographic films, foods, pharmaceuticals pressed dried flowers, paintings, antique documents, unearthed articles from ruins, and the like items and matters. In addition, the present invention pertains to an oxygen absorption composition which is suppressed in heat generation accompanying the reaction with oxygen and also is enhanced in safety in the case of its disposal or transportation.
2. Description of Ralated Arts
There have heretofore been known, as an oxygen absorbent, a metallic powder, catechol, ascorbic acid and the like each as a principal component. However, since the above-mentioned oxygen absorbents require moisture in absorbing oxygen, the oxygen absorption system needs to be highly humid, thereby limiting the object of preservation in the oxygen absorption system. On the other hand, there is proposed in Japanese Patent Application Laid-Open No. 29741/1992 (Heisei-4), a composition as an oxygen absorption composition which does not require moisture in the case of oxygen absorption. There is disclosed therein that an unsaturated aliphatic hydrocarbon and/or an unsaturated aliphatic compound are used as principal components. According to the working examples disclosed therein, there are used unsaturated fatty acids or fats and oils comprising unsaturated fatty acids as unsaturated aliphatic compounds, and polymers in liquid form of hydrocarbons having unsaturated groups as unsaturated aliphatic hydrocarbon. However, the unsaturated fatty acids or fats and oils comprising unsaturated fatty acids involve the problems in practical application that a large amount of gases are generated after the absorption of oxygen and that the gases are malodorous. On the other hand, the polymers in liquid form of hydrocarbons having unsaturated groups involve the problems that the liquid hydrocarbons are difficult to be supported on a carrier at the time of production because of their usually high viscosity. There is described that the polymers in liquid form of hydrocarbons having unsaturated groups are mixed with unsaturated fatty acids or fats and oils comprising unsaturated fatty acids to bring the resultant mixture to a low-viscosity principal component. Nevertheless, the problem still remains unsolved in practical application thereof in that a large amount of gases are generated causing marked malodor because of the unsaturated fatty acids or fats and oils comprising the unsaturated fatty acids that are contained in the resultant mixture, thus necessitating a large amount of a gas absorbent to absorb the generated gas. In addition, there is proposed in Japanese Patent Application Laid-Open NO. 115776/1993 (Heisei-5), a deoxidizing film comprising an ethylenically unsaturated hydrocarbon and a transition metal as a catalyst. In general, however, the above-proposed deoxidizing film involves the problem that a considerably long time is required for completing deoxidization.
In general, many oxygen absorbents are accompanied by heat generation at the time of deoxidization (oxygen absorption). Thus, when such an oxygen absorbent is allowed to stand in the atmosphere, the temperature thereof is suddenly raised as the case may be, whereby delicate care is often made necessary in storage or disposal thereof, especially in the case of accumulation of large amount of oxygen absorbents.


Embodiments relate to a software-defined networking (SDN) interface between multiple platform managers. An aspect is a computer-implemented method for receiving, at an SDN controller of a network, provisioning data from a first network provisioning application associated with a first platform manager of a first computing platform. Provisioning data are received at the SDN controller from a second network provisioning application associated with a second platform manager of a second computing platform. The SDN controller compares the provisioning data from the first network provisioning application to the provisioning data from the second network provisioning application to identify provisioning issues. The SDN controller determines a modified provisioning that resolves the provisioning issues. The SDN controller configures the network to comply with the modified provisioning. The modified provisioning is reported to the first and second network provisioning applications.

The present invention relates generally to software-defined networking, and more specifically, to a software-defined networking interface between multiple platform managers.
Cloud computing distributes processing across multiple computing resources in a network. Cloud computing typically provides on-demand network access to a shared pool of configurable computing resources (e.g., networks, network bandwidth, servers, processing, memory, storage, applications, virtual machines, and services) that can be rapidly provisioned and released. The computing resources can include a variety of different computing platforms. Computing platforms include server-specific platform managers that locally control provisioning of computing and network resources. Each platform manager typically is customized for the particular hardware and software resources of the computing platform upon which it resides. Platform managers can define allocations for virtual machines, processing resources, memory, input/output flows, bandwidth requirements, and the like.
Platform managers for different computing platforms can include a number of similar functions but are not typically capable of being directly ported across computing platforms. Certain interfacing functions of the platform managers can conflict relative to other platform managers, making computing platform integration difficult particularly in a cloud computing environment.

Software-defined networking interface between multiple platform managers

International Business Machines Corporation


In order, to transmit differential signals between two printed boards, there is provided a printed board connector comprising an insulating connector housing and disk-shaped modules that contain electric contact elements and are arranged in the connector housing, wherein modules featuring signaling contacts and modules featuring shielding contacts are alternately arranged adjacent to one another. In this case, the shielding module is realized in such a way that signaling contact pairs arranged on top of one another are also at least regionally shielded relative to one another.

A printed board connector of this type is required for transmitting differential signal voltages from one printed board to another printed board by means of a large number of electric contacts, wherein contacts that are shielded in pairs are provided in order to ensure a low feedover between the line pairs.

Printed board connector for differential signal transmission