A multilayered reflective body which is thermoformable and capable of being fabricated into films, sheets and a variety of parts while maintaining a uniform reflective appearance is provided. The reflective polymeric body includes at least first and second diverse polymeric materials of a sufficient number of alternating layers of the first and second polymeric materials such that at least 30% of the light incident on the body is reflected. A substantial majority of the individual layers of the body have an optical thickness of not more than 0.09 micrometers or not less than 0.45 micrometers, and adjacent layers of the first and second polymeric materials differ from each other in refractive index by at least about 0.1. The reflective body may be fabricated into sheets, mirrors, noncorroding metallic appearing articles and parts, reflectors, reflective lenses, and the like.

The present invention relates to a multilayered polymeric body which reflects light and which can be fabricated to have a silvery or hued (i.e., copper, gold, etc.) metallic or nonconventional hued (i.e., blue, green, etc.) appearance, and to articles produced therefrom which may find use as mirrors, reflectors, lenses, polarizers, and the like.
Highly reflective articles (i.e., articles having a reflectance of 70-85% or greater) are generally sought by industry for a number of uses. Conventional methods for fabricating reflective surfaces include forming such surfaces of highly polished metals. Because of the high costs and fabricating problems involved in using metals, more recently fabricators have used plastic surfaces which contain thin coatings of metal thereon. Thus, metal coated plastic articles are now commonly found as both decorative and functional items in a number of industries. Such articles are used as bright work for consumer appliances such as refrigerators, dishwashers, washers, dryers, radios, and the like. These types of articles are also used by the automotive industry as head lamp reflectors, bezels, radio knobs, automotive trim, and the like.
Typically, such metal coated plastic articles are formed by electroplating or by the vacuum, vapor, or chemical deposition of a thin metal layer on the surface of the article. Such coatings are subject to the chipping and flaking of the metal coatings as well as corrosion of the metal over time. If additional protective layers must be applied over the metal coating to protect it, additional labor and materials costs are involved. Further, there may be environmental disposal problems with some metal deposition processes.
Multilayer articles of polymers are known, as are methods and apparatuses for making such articles. For example, such multilayered articles may be prepared utilizing multilayer coextrusion devices as described in commonly-assigned U.S. Pat. Nos. 3,773,882 and 3,884,606 to Schrenk. Such devices are capable of simultaneously extruding diverse thermoplastic polymeric materials in substantially uniform layer thicknesses. The number of layers may be multiplied by the use of a device as described in commonly-assigned U.S. Pat. No. 3,759,647 to Schrenk et al.
Im et al, U.S. Pat. No. 4,540,623, teach a multilayer laminated article which includes a polycarbonate as one of the alternating layers. The articles of Im et al, however, are intended to be transparent rather than reflective and to exhibit optical properties comparable to a pure polycarbonate polymer.
Alfrey, Jr. et al, U.S. Pat. No 3,711,176, teach a multilayered highly reflective thermoplastic body fabricated using thin film techniques. That is, the reflective thin film layers of Alfrey, Jr. et al relied on the constructive interference of light to produce reflected visible, ultraviolet, or infrared portions of the electromagnetic spectrum. Such reflective thin films have found use in decorative items because of the iridescent reflective qualities of the film.
However, the films of Alfrey, Jr. et al are extremely sensitive to thickness changes, and it is characteristic of such films to exhibit streaks and spots of nonuniform color. Further, color reflected by such films is dependent on the angle of incidence of light impinging on the film. Thus, such films are not practical for uses which require uniformity of reflectivity. Moreover, such films are not practical to thermoform into articles as localized thinning of the layers during thermoforming causes alterations in the reflective characteristics of the films.
In addition to the problems discussed above, many reflective articles such as those used in the automotive industry are exposed to extreme environmental conditions and do not exhibit good weatherability or resistance to solvents. Further, many of the films used in the production of reflective articles exhibit poor ductility and are thus difficult to thermoform into articles.
Accordingly, there remains a need in the art for a polymeric reflective sheet or body which can be fabricated into relatively thick parts without alteration of the uniform reflective appearance of the material over a range of processing conditions and part geometry. Further, there is a need for a highly reflective polymeric sheet or body which can be post formed without alteration of the uniform reflective appearance of the material. Still further, there is a need for silvery or metallic appearing articles which do not use metal and which exhibit good ductility, good weatherability, and resistance to solvents.

Optically dissimilar composition for polymeric reflective bodies


A product dispenser for compelling a flowable product from a container comprising a frame assembly having first and second opposed frame assembly ends, first and second opposed dispensing notches respectively on the first and second frame assembly ends, at least one elongate drive member substantially extending between the first and second assembly ends and having first and second drive member ends. The dispenser may also have first and second drive trains each comprising a plurality of interconnected gears and each respectively operatively coupled to the first and second drive member ends, a driven member threadably coupled to the elongate drive member and adapted to travel between the first and second frame assembly ends, and a crank assembly adapted to be selectively operatively coupled to one of the drive trains. Actuation of the crank assembly may cause travel of the driven member between the first and second frame assembly ends.

Product dispensers for compelling a flowable product from a deformable container are known in the art. Some of them are described in U.S. Pat. No. 4,125,206 issued to Wilson on a toothpaste dispenser; U.S. Pat. No. 4,508,242 issued to Wolfe on a toothpaste extractor and U.S. Pat. No. 6,318,596 issued to Wiesner on a product dispenser.
Certain prior art product dispensers may include a screw or worm gear retained within a frame having a squeezing member received upon the screw to travel from a first end of the screw to a second end of the screw to compel a flowable product from a container. Once the squeezing member has reached the end of its travel at the second end of the screw, a user must actuate the squeezing member and, therefore, the screw in a reverse direction so that the squeezing member travels along the screw back towards the first end.
Some of these prior art product dispensers require the squeezing member to travel along the length of the screw first to dispense product from a container and then reverse its direction along the screw without any work performed other than to return the squeezing member back to its origin. This requires unproductive time on the part of the user to reconfigure the dispenser for subsequent use. Further, this type of mechanism is inefficient and causes undue fatigue upon a user's fingers with manually actuated product dispensers and undue stress upon mechanical and electrical parts in an automatically actuated product dispenser, leading to accelerated mechanical and/or electrical failure of prior art product dispensers. In addition, these prior art product dispensers are generally complex in order to accommodate both forward and reverse travel of the squeezing member retained within the frame. These product dispensers have many moving parts and are not economical to manufacture or repair.
Other prior art products that include a squeezing member mounted on a screw may not require reversal in the direction of travel of the squeezing member to return it to its origin. These products, however, may include an actuating member in the form of a rotatable knob that controls travel of the squeezing member. A problem with this type of configuration, however, may lie in the relatively large magnitude of the force required to rotate the knob and cause travel of the squeezing member against the surface of the container holding the flowable product being dispensed. This problem is accentuated when the user of the product is a small child or a person with limited hand strength.
A product dispenser that does not require reversal of travel of a squeezing member while requiring a relatively low magnitude of force to be applied to an actuating member controlling travel of the squeezing member is therefore desirable.

Product dispenser with crankable assembly


A novel food server and method of producing a food server is disclosed. The novel method includes moving a web of paper at a constant rate of speed, rotary perforating a plurality of lines on the moving web, using rotary timing belts to score at least two fold lines on the moving web, where the two fold lines define two glue flaps, rotary die-cutting the moving web to cut away portions of the paper adjacent the glue flaps, plow folding the moving web along the two fold lines defining the glue flaps, and applying glue to the moving web. After plow folding along the fold lines and applying the glue, the moving web is cross cut to form a blank having the glue flaps. Then, the blank is vacuum folded to cause portions of the blank to contact and adhere to the glue flaps, thereby forming the food server from the blank. The novel food server includes a first panel having two side flaps each defined by a score line, and a second panel having two side flaps each defined by a score line. Each of the side flaps on the second panel has an outside portion and an inside portion defined by a score line. There is adhesive between each of the outside portions and each of the side flaps on the first panel, thereby providing that the first panel is adhered to the second panel to form the food server.

Presently, food servers, such as containers for serving french fries in a fast food restaurant, are manufactured using a two stage process. The first stage of the process consists of several steps each of which is performed to a web of paper board in order to produce a stack of identical blanks therefrom. Shown in FIG. 1 is the typical blank 10 formed by the first stage of the process. To form the blanks from the web of paper board, the web is first unwound from a roll and sent to one or more printing stations where indicia such as a logo and an associated design is printed thereon. After the printing, the paper board is forwarded to a punch die-cutting station where the paper board is die cut, creased and perforated using a flat steel rule die to form several fold lines 12, 14 and 16 onto the paper board and to define a front panel 18, a back panel 20, glue flaps 22, bottom panels 24 and side panels 26 thereon. After being die cut, the die cut web, which has several blanks 10 nicked together, is forwarded through a rotary stripping station which automatically removes the die cut trim away from the die cut and creased paper board blanks. The nicked together, die cut blanks are then forwarded to a set of speed up rolls which break the nicks and then feed the separated blanks onto a slow down belt in a shingled fashion. The blanks are then manually removed from the shingle belt onto a pellet where they are stored awaiting the ensuing operation of folding, gluing and packing.
The punch press die cutting step requires that the paper board being cut and creased be of sufficient stiffness to allow for stopping the web in the punch press, die cutting the paper board with a minimum number of nicks and accelerating the cut web into the rotary stripper. The above-described first stage of the process will not work on light weight paper.
The second stage of the process consists of folding and gluing the glue flaps 22 of each blank 10. The folding and gluing is performed in a way that will only provide glue flaps 22 adhered to the outside surface 28 of the back panel 20. The process does not provide that the glue flaps 22 can be adhered to the inside surface of the back panel 20. The second stage of the process provides that a person folds the die cut blanks into a folder/gluer. The person selects a small stack of blanks 10 and hand folds the small stack along score line 12 so that the flat stack becomes an angled stack. This pre-bent stack is then placed into the feeder section of the folder/gluer where blanks 10 are fed off the bottom of the pre-bent stack and each blank 10 is first folded along fold line 12. Glue is applied to glue flaps 22, and then the blank 10 is folded with flat twisted belts along fold lines 14 which completes the folding. The paper board containers are then fed into a pressure belt system that sets the glue. After glue is applied to the glue flaps 22, food server 30 is formed, the rear 32 of which is shown in FIG. 2. As shown, the rear 32 of the food server 30 is defined by two side panels 26, a bottom panel 24, and two glue flaps 22 each of which is adhered to the outside surface 28 of the back panel 20. After gluing, the food servers 30 are ready for packing.
The above-described two stage process requires that a paper board having a high stiffness be used in order to achieve efficient high speed non-parallel fold lines (for example, fold lines 14). Additionally, the folder/gluer requires that a very stiff paper board be used (for example, 0.012 to 0.014 inches thick) in order to be able to feed a single blank at a time into the folder/gluer. Even if one were to adapt the abovedescribed two stage process to run lighter weight paper board, a significant cost savings would not be realized because paper board mills normally sell their paper board with calipers below twelve to thirteen for about the same price per square foot.
After the food server 30 is manufactured, the food server 30 is shipped to the food vendor, such as to a fast food restaurant. When food, such as french fries, is to be placed in the food server 30 and served by the food vendor, the sides 34 of the food server are urged toward each other to cause the bottom panels 24 to shift upward thereby locking the food server 24 into a position which provides an opening for the food. The glue flaps 22 essentially render the rear 32 of the food server 30 less practical for printing any attention-grabbing graphics thereon. Preferably, a folder carton (paper board) product is formed and glued with the glue flaps on the inside so that one can better use the full panel for graphics.
Because the first stage of the two stage process described above consists of stopping a moving web of paper board to perform certain steps (for example, punch die-cutting scrap therefrom), the first stage of the process severely limits the speed at which food servers can be produced. Additionally, the fact that one must hand fold small stacks of blanks prior to placing them in the folder/gluer infeed station adds substantial extra labor to the process.
Additionally, as mentioned, one of the steps performed to the web of paper board during the first stage of the above-described process includes punch die-cutting scrap from the paper board. Because the paper board is punch die-cut, it is imperative that a relatively heavy paper board, such as one hundred thirty pound paper board, be used so that the paper board does not jam during the punch die-cutting step. Of course, the heavier the paper board used, the higher the cost of producing a food server therefrom. Additionally, using heavier paper board is presently undesirable in light of recent worldwide efforts to conserve materials and limit the amount of material dumped into landfills.
Still further, as shown in FIG. 1, the blank 10 formed during the first stage of the above-described process includes four side panels 26 and two glue flaps 22 located adjacent the front panel 18. Therefore, to provide that scrap is kept to a minimum, the blanks must be "reverse nested" side-by-side on the web. In other words, the layout of the individual blanks on the web must be such that several blanks are aligned and staggered side-by-side on a single web rather than merely aligned front to back in a single file line. As a result of having to provide that the blanks are reverse nested, not only must the web of paper be relatively wide, but the gluing and folding steps of the process must be performed after the individual blanks are cut from the web, as a secondary operation, thus necessitating using the two stage process described above rather than utilizing a single stage process as is provided by the present invention.
The present invention provides a novel food server and a novel method of producing a food server, each directed to solve the problems discussed hereinabove.

Apparatus and method of producing a food server with pre-fold of glue panels


Embodiments relate to a deposition device that operates in two modes: a deposition mode, and a cleaning mode. In the deposition mode, modular injectors inject materials onto a substrate to form a layer. In the cleaning mode, the deposition device is cleaned without disassembly by injecting a cleaning gas. The injector module assembly may be cleaned in the cleaning mode by injecting cleaning gas through an exhaust for removing reactant precursor and routing the cleaning gas from the exhaust to another exhaust for removing source precursor. Alternatively, the injector module assembly is cleaned by injecting cleaning gas into a passage between an injector for injecting a source precursor and another injector for injecting a reactant precursor, and routing the cleaning gas to one of the exhausts in the cleaning mode.

1. Field of Art
The present disclosure relates to a method of cleaning a deposition device in an injection assembly for injecting materials onto a substrate to deposit a layer of material on the substrate.
2. Description of the Related Art
A deposition such as an atomic layer deposition (ALD) or a chemical vapor deposition (CVD) is a process for depositing one or more layers of material on a substrate. Depositing one or more layers involve injecting different types of chemicals on the substrate using a deposition device. ALD involves injecting two types of chemicals: a source precursor and a reactant precursor. After sequentially applying the chemicals, a layer is formed on the substrate.
During or after the deposition process, the deposition device is exposed to chemicals, and a parasitic layer can be deposited on the deposition device. The thickness of the parasitic layer on the deposition device increases as deposition processes are repeated. As a result, injectors of the deposition device for injecting chemicals or the exhausts of the deposition device for discharging chemicals become congested, and the efficiency of the deposition decreases. Additionally, as the parasitic layer on the deposition device becomes thicker, stress of the parasitic layer increases, causing the parasitic layer to be peeled off or particles to be scraped off onto the substrate, thereby degrading the quality of the layer deposited on the substrate.

Cleaning of deposition device by injecting cleaning gas into deposition device


Each pixel of an image sensor array includes a capacitive load that is selectively coupled to or decoupled from the usual sensor capacitance to facilitate dual mode operation. During a first operating mode (e.g., a high-power operating mode such as radiography), a global enable signal is asserted to turn on a mode control transistor of each pixel that couples the selectable capacitive load to the sensor, thereby increasing the total capacitance of the pixels. During a second operating mode (e.g., a low-power operating mode such as fluoroscopy), the global enable signal is de-asserted, thereby decoupling the optional capacitive load from the sensor to minimize pixel capacitance. An amorphous silicon sensor includes an additional metal plate located below the lower sensor plate to provide the optional capacitive load. The additional metal plate is formed from the same metal layer that is used to fabricate the gate lines of the array.

This invention relates to the field of imaging devices, and in particular to those devices containing a sensor array. The invention is most particularly applicable to an amorphous silicon X-ray image sensor array usable for both fluoroscopic and radiographic imaging operations.
Two-dimensional sensor arrays are well-known devices for real time imaging of incident high energy radiation (see R. A. Street et al., xe2x80x9cLarge Area Image Sensor Arraysxe2x80x9d, in Technology and Applications of Amorphous Silicon, Editor R. A. Street, Springer Series in Materials Science 37, Springer-Verlag , Berlin, 2000, chapter 4, p. 147, for a general description of the structure of the arrays). Such sensor arrays are particularly advantageous for X-ray imaging because they present a relatively large size image sensor array. Each sensor operates on the principal of integrating a charge representative of the quantities of ionizing radiation incident on the sensor. In the direct detection approach, incident high-energy radiation (e.g., X-ray photons) is directly converted to a charge by the sensor. In the indirect detection approach, a phosphor converter absorbs high energy radiation (e.g., X-ray photons) and generates a proportional amount of visible light that is then converted to a charge by the sensor.
Despite the development of recent medical imaging modalities, such as computed tomography (CT), ultrasound, nuclear medicine and magnetic resonance imaging (MRI), all of which are digital, X-ray imaging systems remain an important tool for medical diagnosis. Although the majority of X-ray imaging systems in current use are of analog design, digital radiology is an area of considerable recent growth. Digital radiology provides significant advantages over its analog counterpart, such as easy comparison of radiological images with those obtained from other imaging modalities, the ability to provide image networking within a hospital for remote access and archiving, facilitating computer aided diagnosis by radiologists, and facilitating teleradiology (i.e., remote diagnostic service to poorly populated regions from a central facility).
Digital radiology provides two dominant modes of imaging that have different operational characteristics. In radiography, a single image frame is acquired under conditions of a large signal (e.g., using a relatively high X-ray dose). In fluoroscopy, frames are acquired at typically 30 or 60 frames per second and the signal (e.g., X-ray dose) is small, at least 10-100 times lower than that used in radiography.
It is highly desirable for an imaging device to perform both radiography and fluoroscopy functions. Apart from the cost benefits associated with a single imager that performs both radiography and fluoroscopy functions, such an imager is needed by the radiologist to rapidly switch between the low contrast, low dose fluoroscopic mode and a radiographic mode to obtain high contrast images. It is also highly desirable to perform various fluoroscopy operations using various intermediate intensities (i.e., between the conventional fluoroscopic and radiographic intensities).
While image sensors utilized to perform fluoroscopic and radiographic operations are generally reasonably compatible, there are some conflicts in the design approach, particularly concerning the pixel capacitance that stores the image charge and also generates electronic noise. The saturation signal for an image sensor pixel is given by CSVMAX, where CS is the capacitance of the pixel and VMAX is the maximum voltage to which the capacitance can be charged. For a typical sensor array that uses an amorphous silicon (a-Si:H) photodiode as the pixel sensor, the capacitance is 1-2 pF for a pixel size in the 100-200 micron range using a 5 V bias voltage. The maximum pixel charge of 5-10 pC is comfortably enough for radiography but greatly exceeds the requirements for fluoroscopy.
Large pixel capacitance would not be a problem for fluoroscopy except that it contributes to electronic noise. There are many contributions to the noise of an imager, but the one that is ultimately impossible to overcome with present array designs is the kTC noise of the pixel, which arises from the thermal noise of the resistance of the switching transistor, and whose magnitude is entirely determined by the pixel capacitance. Therefore, it is not possible to efficiently utilize a conventional pixel for both fluoroscopic and radiographic imaging because the large capacitance needed to perform radiography produces too much noise when the same pixel is utilized for fluoroscopy.
What is needed is a single image sensor that can be optimized for both fluoroscopic and radiographic operating modes.
The present invention is directed to an imaging apparatus in which each pixel of a sensor array includes one or more capacitor loads that are selectively coupled to or decoupled from the usual sensor capacitance to facilitate multi-mode operation. This selectable capacitor load arrangement provides a method for reducing the electronic noise in, for example, a-Si:H medical imagers during fluoroscopy operation, while maintaining the high dynamic range required for radiography.
Each pixel circuit of the imaging apparatus includes a sensor connected between a bias voltage and a first transistor, which is controlled by a gate line to pass collected image data to a data line, and one or more capacitor circuits that include the selectable capacitor load and mode control transistor connected in series between the sensor and ground. The mode control transistors are controlled by a global enable signal that determines the operating mode of image sensor array. When a global enable signal is asserted (e.g., during a radiographic operating mode), a selected mode control transistor of each pixel is turned on, thereby coupling the associated additional capacitor load to the sensor (i.e., effectively increasing the total capacitance) of each pixel. When the selected global enable signal is subsequently de-asserted (e.g., during a fluoroscopic operating mode), the associated mode control transistor of each pixel is turned off, thereby isolating the additional capacitor load from the sensor (i.e., effectively decreasing electronic noise). Accordingly, a single sensor array is provided that is selectively optimized for multi-mode operations.
In accordance with an embodiment of the present invention, an a-Si:H sensor is modified to include the selectable capacitor load by providing a third plate below the lower (second) plate of the sensor. The third plate is etched from the same metal layer used to form the gate line for accessing the select transistor of the pixel, thereby minimizing the number of additional process steps required to provide the selectable capacitor load. The third plate is selectively coupled to a ground line during high-capacitance operations (e.g., radiography) by a thin film transistor (TFT).

Pixel circuit with selectable capacitor load for multi-mode X-ray imaging


An acoustical method of determining the spherical, or vuggy, porosity in carbonate rock formations, as a function of shear modulus. Total porosity and shear modulus of the formation is measured. Then the intrinsic granular porosity, dry bulk modulus, and spherical porosity are calculated. The carbonate rock is modeled, consisting of a primary host medium composed of carbonate grains with intergranular porosity between them. The model is easily modified to account for the case of intercrystalline microporosity existing within the grains, in addition to the intergranular porosity between them.

Interpreting carbonate rock data in well logging is a complex task. Spherical pores in these carbonate formations influence certain parameters (e.g., acoustic moduli, resistivity, and permeability) differently than do typical intergranular porosity. The quantification of spherical porosity (e.g., vuggy, oomoldic, etc.) is essential in order to interpret the facies type of the carbonate rock.sup.1.
A technique developed by Brie et al.sup.2 has been used to determine the extent of spherical porosity in carbonates. The present invention seeks to interpret carbonate hydrocarbon formations using a generalization of the Brie et al method. The current invention comprises a method wherein the shear modulus can be used to isolate the amount of spherical porosity in this type of rock, without the requirement of first obtaining prior knowledge of the pore fluid properties.
It is known that compressional slowness of the carbonate rock can be measured in order to qualitatively estimate spherical porosity. However, currently no quantitative estimate can be made in carbonate rock in the presence of a mixture of unknown pore fluids, such as water, gas, oil, etc.
This invention uses the shear modulus to estimate spherical porosity without the need to know the pore fluid composition. The shear modulus is computed from: a) the shear speed measured by an appropriate sonic logging device, such as a Dipole Shear Sonic Imager (DSI); and b) the formation bulk density as measured, for example, by a Litho-Density Tool (LDT).
The invention relies on a mathematical analysis of the shear acoustic response of carbonate rock formations with a mixture of spherical porosity and conventional intergranular porosity. It provides both a forward model for the theoretical response of the rock having a known mixture of the two pore types, and an inverse model that uses the measured response of the rock to evaluate the constituent volumes of each pore type in the total porosity. It is assumed that the total porosity of the formation is known from a combination of nuclear logs such as a Compensated Neutron Log (CNL) and a Litho-Density Log (LDL) and/or the Nuclear Magnetic Resonance (NMR) log. The Dipole Shear Sonic Imager (DSI), Compensated Neutron Log (CNL), Litho-Density Log (LDL), and the Nuclear Magnetic Resonance (NMR) Log are all commercial well logging services provided by Schlumberger Technology Corporation, the assignee of the present invention. These services and the corresponding tools are described, for example, in U.S. Pat. Nos. 5,036,945 to Hoyle et al (DSI), 3,483,376 to Locke et al. (CNL), 3,864,569 to Tittman (LDL), and 5,055,787 to Kleinberg et al. (NMR/CMR).

Porosity estimation method in carbonate rock


A display control apparatus includes a display control unit that controls a display of a condition setting screen for setting a condition for a device on a screen, wherein the display control unit displays a list screen in which setting items for conditions for a device are grouped and displays, according to an instruction, an item plate overlapping the list screen, in which one or more setting items in the list screen are displayed.

Field of the Invention
The present invention relates to a technology of a user interface for changing a set value for a device condition.
Description of the Related Art
A touch panel is mounted in many portable information devices such as a multifunctional phone or a digital camera, and a necessary condition setting is made by a touch manipulation performed on various setting screens displayed on the touch panel. In such a small-sized touch panel, conditions for setting a device are often configured hierarchically because there are plenty of functions mounted in an information device. As an example, Japanese Laid-open Patent Publication No. 2011-159166 has been proposed.

Display control apparatus and methods for generating and displaying a related-item plate which includes setting items whose functions are related to a designated setting item


The present invention addresses a problem of providing a grease composition that uses hydrophilic nanofibers but still has excellent water resistance and does not readily experience oil separation. The grease composition contains a base oil, hydrophilic nanofibers having a thickness (d) of 1 to 500 nm, and an organic bentonite.

A grease composition is chiefly constituted of a base oil and a thickener. As the thickener, for example, a fatty acid metal salt such as lithium soap, and a diurea compound are widely used.
Recently, a greases composition using a biodegradable thickener has been proposed for providing a grease composition having a low environmental load. For example, PTL 1 proposes a grease composition using cellulose nanofibers (hereinafter also referred to as "CNF") as a thickener.

Grease composition, mechanism component, and production method for grease composition


The present invention provides a method of controlling the sexuality of a plant comprising treating the plant with a composition comprising a compound selected from the group consisting of jasmonic acid, a jasmonic acid derivative, and a salt thereof.

Most flowering plants produce perfect flowers containing both the male organs (stamens) and female organs (pistils). In maize, which has physically separated male and female inflorescences, floral meristems become unisexual through sex determination (Dellaporta & Calderon-Urrea, 1994, Science 266:1501; Irish, 1996, Bioessays 18:363). The basic unit of the maize inflorescence, called a spikelet, contains one upper and one lower flower (known as florets in grasses). Each floret initiates a series of floral organs including three stamen primordia and a central pistil primordium (Bonnet, 1940, J. Agric. Res. 60:25; Kiesselbach, "The Structure and Reproduction of Corn," Univ. of Nebraska Press, Lincoln, Nebr., 1949). These initially bisexual florets become exclusively staminate in the tassel (by abortion of pistil primordia) and exclusively pistillate in the ear (by arrest of developing stamens) (Bonnet, 1940, J. Agric. Res. 60:25; Cheng et al., 1983, Am. Bot. 70:450). Each ear spikelet produces a solitary functional pistil in the upper floret due to abortion of the pistil in the lower floret (Bonnet, 1940, J. Agric. Res. 60:25; Kiesselbach, "The Structure and Reproduction of Corn," Univ. of Nebraska Press, Lincoln, Nebr., 1949; Cheng et al., 1983, Am. Bot. 70:450).
Mutations altering the sexual fate of florets in maize indicate that sex determination is under genetic control. The non-homeotic tasselseed (ts) mutations ts1 and ts2 result in the conversion of the tassel inflorescence from staminate to pistillate (Emerson, 1920, J. Hered. 11:65; Nickerson & Dale, 1955, Ann. Mo. Bot. Gard. 42:195). Both ts1 and ts2 are required to eliminate pistil primordia through cell death (Calderon-Urrea & Dellaporta, 1999, Development 126:435; Kim et al., 2007, Genetics 177:2547). The ts2 gene encodes a short-chain dehydrogenase/reductase (DeLong et al., 1993, Cell 74:757) with broad activity, which has complicated the discovery of its natural substrate (Wu et al., 2007, FEBS J. 274:1172). It is unknown how is genes mediate pistil cell death, although it has been suggested that the dehydrogenase/reductase activity of ts2 may produce a pro-apoptotic signal or metabolize a substrate required for cell viability (Calderon-Urrea & Dellaporta, 1999, Development 126:435; Wu et al., 2007, FEBS J. 274:1172). Even less is known about the ts1 gene. TS2 transcripts are low or undetectable in ts1 mutant tassels, which suggests that ts1 may act upstream of ts2 by regulating ts2 RNA levels and possibly other sex determination genes (Calderon-Urrea & Dellaporta, 1999, Development 126:435).
Chemicals have been used to modulate and modify sexual differentiation in plants. The plant hormone ethylene has been observed to promote feminization in cucumber (Yamasaki et al., 2005, Vitam. Bonn. 72:79). Recent genetic and biochemical evidence has confirmed the role of ethylene in sex determination of melon, a related species (Boualem et al., 2008, Science 321:836). Conversely, gibberellin has masculinizing effects in cucumber but promotes feminization in maize (Bensen et al., 1995, Plant Cell 7:75), and auxin also has opposing effects in cucumber and Mercurialis annua (Yamasaki et al., 2005, Vitam. Horm. 72:79). However, little is known at this point about the role that chemicals play in sexual development and maturation of plants.
There is thus a great interest in identifying chemical compounds that modulate sexual differentiation in plants. Such compounds would be useful in suppressing or enhancing specific sexual phenotypes in plants, allowing the control of vast groups of plants without the need for time-consuming mechanical manipulation of the plants. The present invention fulfills these needs.

Methods for controlling flower development in plants


The invention relates to a breathing film constituting a mixture including:. (a) at least one thermoplastic elastomer which has polyether blocks;. (b) at least one copolymer including ethylene and at least one alkyl (meth)acrylate.. They can be used in combination with fabrics or with nonwovens.

European Patent Application EP 378 015 describes breathable waterproof films that are made of polyetheresteramides which may be adhesively bonded by heating or with the aid of an adhesive onto fabric, leather, or plastic.
European Patent Application EP 0 560 630 breathable waterproof materials that consist (Example 6) of two coextruded films (1) and (2). To each face of the film thus obtained, a nonwoven is adhesively bonded with the aid of a polyurethane-based adhesive in solution in trichloroethylene. The film (1) is a mixture of polyetheresteramide, of polyamide 6, and of polyethylene grafted with maleic anhydride. The film (2) consists of another polyetheresteramide. A polyamide-based nonwoven is adhesively bonded on the side of the film (1). A polyester nonwoven is adhesively bonded on the side of the film (2).
Example 7 of the same prior art describes the same two-layer material consisting of coextruded films (1) and (2), but a nonwoven made of polyester/polyethylene is adhesively bonded on the side of the film (1) and a nonwoven made of polyester is adhesively bonded on the side of the film (2).
This material is employed for making garments by arranging the polyester/polyethylene nonwoven on the inside of the garment and the polyester nonwoven towards the outside of the garment. The material makes the garment permeable to water vapour and impervious to water and to blood splashed from the outside towards the garment, thus protecting the person wearing the garment.
European Patent Application EP 459 862 describes films that consist of a mixture of polyetheresteramide and of a modified polyolefin chosen from: copolymers of ethylene and of vinyl acetate, optionally maleinized; copolymers of ethylene and of (meth)acrylic acid; copolymers of ethylene, of vinyl acetate, and optionally of alkyl (meth)acrylate; and copolymers of ethylene, of alkyl (meth)acrylate, and optionally of maleic anhydride.
These films may be adhesively bonded onto fabrics and nonwovens.
Example 8-1 shows a film that consists of a mixture of a polyetheresteramide and of a maleinized EVA adhesively bonded onto a textile.
The thickness of the films described in EP 459 862 is from 100 to 500 .mu.m. They are not breathable waterproof films.
The breathable waterproof films of the prior art that are based upon polyetheresteramides have the disadvantage, when they are very permeable, of having a high moisture uptake which results in their swelling and makes them fragile.
Films made of blend of polyetheresteramides and polyamides are not supple enough and adhesively bond with difficulty to nonwovens.


An image file structure that supports and selectively maintains extensions is disclosed incorporating, a header, image data, non-image data and extension portions. Each extension portion includes extension data and an extension persistence value that is selected to indicate if extension data is to be maintained as part of the image file when modifications have been made to the image data portions of the image file or not.

A number of existing image formats include a method for extending the capabilities of the format (from hereafter known as an extension). For example, TIFF (Tag Image File Format) allows new tags to be added to store new data (such as a digitized audio recording) inside a TIFF image file. This can be accomplished by requesting a new TIFF tag number from Adobe Corporation, the developer of TIFF. Existing TIFF applications are able to open and view images containing such extension tags because the TIFF standard instructs applications to ignore any tag numbers they are not familiar with. In this case, the application would allow the image to be viewed, but would not play back the audio information. Unfortunately, if the image file is modified in any way by the application, for example, by cropping, or adjusting the color or brightness of the image, or by adding copyright information to the non-image data contained in the image, the extension data (such as an audio clip) is deleted when the modified file is saved by the TIFF application. The TIFF specification requires that unfamiliar tags be deleted, since the application does not know whether this new tag contains data that is still valid (such as an audio clip), or data which is no longer valid (such as a histogram of the number of pixels at each code value in the image).
What is needed is a mechanism for the particular extension to tell the application whether the ancillary data, which belongs to the extension, should be maintained if the baseline data in the image file is altered. In the newly developed FlashPix image format, a mechanism is specified, that enables an application to determine the validity of ancillary data in the file which belongs to a particular extension (for example, an audio extension which may contain an audio stream and other related data). This mechanism is not available in other image formats. Applications writing other formats could choose to always maintain all extension data; however, this data might be needlessly transported with the image whenever the image is copied, either from one file to another on a system or across a network. This results in wasted disk space and may decrease network performance. It may also result in the end applications using invalid extension data. The application can also choose to delete all ancillary data; however, this data may have provided important functionality which was not invalidated. The result is an image that may be much less useful than originally intended.

Extension persistence mechanism for a digital image format


A cell controller is provided that analyzes each unit machining schedule, which is referred to for manufacturing products, prior to the start of the assigned unit machining schedule. The data items in the schedule are analyzed include identification numbers of machining programs, the use or non-use of such identification numbers, the number of workpieces to be machined, and a presence or absence of predetermined procedures (e.g., for exchanging metal molds, etc.) that are referred to for manufacturing the products. An operator is notified of any foreseeable schedule alarm condition, that will force the operation of the line of manufacturing products of a specific item to be suspended, so that the operator may be informed of the situation in advance. The foreseeable schedule alarm condition may arise for reasons such as an insufficient number of available workpieces and/or preparatory work to be done (e.g., an exchange of metal molds, etc.).

1. Field of the Invention
This invention generally relates to a method of controlling a sheet metal machining line for producing desired products by cutting, drilling, bending and/or otherwise machining flat workpieces according to a machining schedule prepared on the basis of a given production plan. More particularly, the invention relates to a method of controlling a sheet metal machining line designed to foresee an unfavorable situation that can force the operation of the line of manufacturing products of a specific item to be suspended for reasons, such as no available workpieces and/or a preparatory work to be done such as an exchange of metal molds, that can arise before or during the machining operation for the products. The control method includes analyzing the unit machining schedule or schedules for the products including the data items described in the schedule or schedules, such as the identification numbers of the machining programs involved, the use or non-use of such identification numbers, the number of workpieces to be machined and the presence or absence of the predetermined procedures for exchanging metal molds to be referred to for manufacturing the products, and informing the operator of the foreseen situation or the non-existence of such a foreseen unfavorable situation in order to make the operator prepared for a possible suspension of the operation of the line.
The present invention also relates to an apparatus for controlling a sheet metal machining line by using such a control method.
2. Background Information
Automated power saving manufacturing systems such as flexible manufacturing system (FMS) have been known and in popular use in sheet metal machining lines for cutting, drilling, bending and otherwise treating sheet metals into intended products.
An apparatus for controlling a sheet metal machining line utilizing an FMS system will be summarily described. A sheet metal machining line typically comprises an NC machining center including one or more punch presses adapted to selectively use a plurality of metal molds and tools, a CNC control apparatus for controlling the operation of the NC machining center according to a machining program, a workpiece holding/releasing unit for holding one or more workpieces to be machined in position relative to the NC and releasing them for delivery, an automatic warehouse for sorting a large number of workpieces into groups of same materials and sizes and storing them for future machining, peripheral equipment including one or more cranes and other devices for feeding workpieces to the workpiece holding/releasing unit from the automatic warehouse, and a line control board connected to the NC machining center, the CNC control apparatus and the peripheral equipment for controlling the sequence of operations of the sheet metal machining line. The sheet metal machining line is additionally connected to a cell controller for transferring machining programs to the CNC control apparatus and also transferring ladder-sequence programs to the line control board in order to control the entire operation of the sheet metal machining line in a coordinated manner.
The cell controller is connected to a hard disc memory device having a predetermined capacity typically for storing machining schedules prepared according to a given production plan describing the operating procedures of the NC machining center and the peripheral equipment for sequentially producing products according to the production plan. The cell controller sequentially issues commands for operation according to the machining schedule and the issued operational commands are then sent to the CNC control apparatus and the line control board. Upon receiving the commands, the sheet metal machining line sequentially carries out the specified machining operations including cutting, drilling and bending on the delivered flat workpieces.
A machining schedule typically comprises one or more unit machining schedules designed for each specific product item and arranged, if more than one unit machining schedule is used, in the order of the machining operations to be carried out.
The machining schedule describes data items such as the identification numbers of the machining programs involved, the use or non-use of such identification numbers, the number of workpieces to be machined the presence or absence of the predetermined procedures for exchanging metal molds, and completion codes for indicating the completion of the operations specified in the unit machining schedule. The cell controller causes the predetermined machining operations to be carried out in the order defined by the machining schedule by referring to the machining schedule whenever necessary so that groups of products may be produced according to the machining schedule.
However, a known apparatus for controlling a sheet metal machining line having a configuration as described above can inevitably be brought into a situation that can arise before or during the machining operation conducted according to a unit machining schedule to force the operation of the line of manufacturing products of a specific item to be suspended. Such a situation may be that the number of available workpieces is short of the number of workpieces to be machined, that the machining operations for the current unit machining schedule are over but the machining program required for carrying out the next unit machining schedule is not at hand or that there is preparatory work to be done by the operator such as an exchange of metal molds. A very skilled operation may not be able to foresee the time when the line is suspended due to such a situation. Therefore, there is a need for technological development that can solve this problem.
Thus, the operator is currently required to constantly watch the sheet metal machining line and also respond to unusual conditions that may require the preparation of an additional machining program, an additional supply of workpieces and/or the performance of preparatory work for exchanging metal molds. Constantly watching the sheet metal machining line and concurrently carrying out a preparatory work at the same time can constitute an extraordinary heavy workload for the operator both physically and mentally. In view of the above circumstances, it has been desired to provide a novel technological development that can foresee an unfavorably situation that can force the operation of the sheet metal machining line to be suspended and to notify the operator of the foreseen situation well before the start of the operation.

Method of controlling a sheet metal machining line and apparatus for controlling the same


A method of controlling an analog-to-digital (A/D) converter for converting an input voltage into digital data. The conversion process includes charging a capacitor with the input voltage to be converted into a digital data, and disconnecting the input voltage from the capacitor. A reference voltage, generated according to digital data, is furnished by a control circuit to a digital-to-analog (D/A) converting unit. The reference voltage is applied to the capacitor by turning on a switch connected between the D/A converting unit and the capacitor. New digital data to be furnished by the control circuit is determined according to a charged voltage on the capacitor. The D/A converting unit causes the reference voltage to be delivered to the capacitor to change to a new value according to the new digital data from the control circuit. Before the reference voltage begins a transition to a new value, the switch is turned off and kept off until the reference voltage from the D/A converting unit becomes stable at the new value.

1. Field of the Invention
The present invention pertains to a method of controlling an analog-to-digital (AD) converter. More particularly, it relates to a method of controlling an AD converter formed on a semiconductor substrate and implemented in a semiconductor integrated circuit.
2. Description of the Prior Art
Referring now to FIG. 18, there is illustrated a block diagram showing the structure of a successive approximation 4-bit AD converter having a sample-and-hold function, to which a prior art AD converter controlling method as disclosed in, for example, Japanese Patent Application Laying Open No. 1-321728, is applicable. In the figure, reference numeral 1 denotes a control circuit, 2 denotes a successive approximation register holding digital data furnished by the control circuit 1, 3 denotes a resistor ladder, 4 and 5 denote power supply terminals for applying a basic voltage V, which is equal to a maximum of voltages which can be converted by the AD converter, across the resistor ladder 3, and 6 denotes a switch group comprised of switches for selecting, as a reference voltage Vref, one from among a plurality of voltages generated by the resistor ladder 3 according to a data furnished by the successive approximation register 2. The resistor ladder 3 and the switch group 6 serve as a digital-to-analog (DA) converter for digital-to-analog converting a digital data furnished by the control circuit 1 into the reference voltage Vref.
Furthermore, reference numeral 7 denotes an input terminal to which an input voltage Vin is applied, 8 denotes a capacitor, and 9 denotes an inverter. The capacitor 8 and the inverter 9 form a chopper comparator for comparing the input voltage Vin to the reference voltage Vref in cooperation with each other. Reference numeral 10 denotes a first switch, 11 denotes a second switch, 12 denotes a third switch, and 13 denotes a timing generator for generating a timing pulse to turn on or off each of the switches 10 to 12, and a timing pulse to trigger the successive approximation register 2 to furnish a data stored therein to the switch group 6.
Referring next to FIG. 20, there is illustrated a timing diagram for explaining the operation of the prior art method of controlling the AD converter shown in FIG. 18. FIG. 20 shows the case where a voltage of 0.63 volts which is 0.63 times the basic voltage V, as the input voltage Vin, is applied to the input terminal 7. The timing generator 13 generates a timing pulse to turn on the first switch 10 first, and, after that, the timing generator 13 further generates a timing pulse to trigger the successive approximation register 2 to furnish data held therein to the switch group 6. A hexadecimal number such as "8h" is delivered to the switch group first by the successive approximation register 2. According to the data, the switch group 6 furnishes the reference voltage Vref of 1/2 V which is generated by the resistor ladder 3. The resistor ladder 3 divides the basic voltage V into a plurality of voltages Vi (i=1 to n). Thus, the switch group 6 selects, as the reference voltage, one from among the plurality of voltages Vi generated by the resistor ladder 3 according to the digital data from the successive approximation register 2.
Then the timing generator 13 generates a timing pulse to turn on the third switch 12 so as to raise a condition in which the capacitor 8 can become charged. Furthermore, the timing generator 13 generates a timing pulse to turn on the second switch 11 so as to charge the capacitor 8 with the input voltage Vin applied to the input terminal 7. When the capacitor 8 becomes charged, the second and third switches 11 and 12 are turned off sequentially, and the first switch 10 is further turned on. When the first switch 10 is switched on, the reference voltage Vref furnished by the switch group 6 is applied to the capacitor 8 and is compared with the input voltage Vin. In this case, since the input voltage Vin is 0.63 V and the reference voltage is 1/2 V, the inverter 9 outputs a signal having a value of zero.
When the control circuit 1 receives the signal at a logical state 0 from the inverter 9, it changes the digital data delivered to the successive approximation register to a hexadecimal number "Ch". The new digital data is furnished to the switch group 6 by way of the successive approximation register 2. Then the switch group 6 selects and furnishes the new reference voltage Vref of (3/4) V according to the digital data applied thereto. As shown in FIG. 20, since the first switch 10 had been already turned on and the second and third switches 11 and 12 had been already turned off when the capacitor 8 became charged with the reference voltage at the first time, it is not necessary to repeat the turning-on/off operation on the first, second, and third switches 10 to 12 after the first reference voltage Vref has been applied to the capacitor. Thus, the first switch 10 remains in the on state and the second and third switches 11 and 12 remain in the off state, and therefore the selected reference voltage Vref of 3/4 V is applied to the capacitor 8 by way of the first switch 10 and is compared with the input voltage of 0.63 V. As a result, the inverter 9 outputs a signal at a logical state 1. After that, the AD converter repeats a similar control operation, and, finally, furnishes a hexadecimal number "Ah" as a conversion result.
When the control circuit 1 determines a new digital data to be furnished to the switch group 6 by way of the successive approximation register 2, one switch of the switch group 6 changes from the on state to the off state and another switch of the switch group 6 changes from the off state to the on state. This switching operation causes the reference voltage Vref furnished by the switch group 6 to make a transition to a new value under the control of the switch group 6, as shown in FIG. 20. That is, the reference voltage Vref remains in an unstable state during the transition. Thus, when obtaining a second or later bit of the digital data, since the output of the successive approximation register 2 changes while the first switch 10 is held in the on state and the second and third switches 11 and 12 are held in the off state, there is a possibility that a comparison between the input voltage Vin and the reference voltage Vref which remains in an unstable state is performed. Such a change in the reference voltage Vref which is making a transition to a new value, which has been caused by the tap changing of the resistor ladder 3, under the control of the switch group exerts a bad influence upon the conversion accuracy of the AD converter.
A capacitance-coupled AD converter has been controlled by using a controlling method similar to the aforementioned prior art AD converter controlling method for use in a successive approximation AD converter having a sample-and-hold function. Next, the description will be directed to the prior art method of controlling a capacitance-coupled AD converter.
Referring next to FIG. 19, there is illustrated a block diagram showing the structure of an 8-bit capacitance-coupled AD converter to which the prior art AD converter controlling method is applicable. In the figure, the same components as the AD converter shown in FIG. 18 are designated by the same reference numerals, and therefore the description about the components will be omitted hereinafter. In FIG. 19, reference numeral 14 denotes a second capacitor, 15 denotes a base terminal to which a basic potential such as an analog basic potential AVSS is applied, and 16 denotes a switch group comprised of a plurality of switches, which is different from the switch group 6 shown in FIG. 18 in that the switch group 16 can furnish a first reference voltage Vref used for a comparison to be performed for obtaining the five uppermost bits of a conversion result and a second reference voltage Vref used for a comparison to be performed for obtaining the three lowermost bits of the conversion result, separately. Furthermore, reference numeral 17 denotes a fourth switch, and 18 denotes a fifth switch. A semiconductor switch such as a field-effect transistor analog switch can be used as each of the switches, which can be turned on or off in response to a timing pulse generated by the timing generator 13.
Referring next to FIG. 21, there is illustrated a timing diagram for explaining the operation of the prior art method of controlling the capacitance-coupled AD converter shown in FIG. 19. Such the capacitance-coupled AD converter has been developed as a technique for improving the conversion accuracy when it is used in the case where the number of bits of a digital data to be obtained is relatively large. The 8-bit capacitance-coupled AD converter shown in FIG. 19 can separately perform AD conversions for the five uppermost bits and three lowermost bits of the conversion result. When charging the first capacitor 8 and the second capacitor 14, the first switch 10, second switch 11, third switch 12, fourth switch 17, and fifth switch 18 are sequentially turned on and off with timing as will be mentioned below. After that, these switches do not repeat the turning on/off operation. To be more specific, when converting the input voltage Vin into digital data, the first and fourth switches 10 and 17 are turned off first. Then the third, second, and fifth switches 12, 11, and 18 are turned on. As a result, the first and second capacitors 8 and 14 become charged. When the charging is completed, the second, third, and fifth switches 11, 12, and 18 are turned off and, after that, the first and fourth switches 10 and 17 are turned on. Then an AD conversion is started.
When comparisons for obtaining the uppermost bits of the conversion result are started, the reference voltage Vref furnished by the switch group 16 is applied to the first capacitor 8 by way of the first switch 10 which remains in the on state. Furthermore, during the comparison carried out to obtain each of the uppermost bits of the conversion result, the switch group 16 constantly supplies a constant voltage of 0 V to the second capacitor 14 by way of the fourth switch 17 which remains in the on state. The inverter 9 compares the reference voltage Vref with the sum of the charged voltages across the first and second capacitors 8 and 14, and then furnishes its output having a value which depends on the comparison result to the control circuit 1. The control circuit 1 determines new digital data to be delivered to the successive approximation register according to the value of the output of the inverter. The reference voltage Vref to be furnished to the first switch 10 by the switch group 16 is thus changed according to the new digital data from the successive approximation register. At that time, since the first switch 10 is held in the on state, the reference voltage Vref is applied to the first capacitor 8 and therefore the inverter 9 furnishes its output having a value which depends on the comparison between the reference voltage Vref and the sum of the charged voltages across the capacitors 8 and 14 to the control circuit 1. After that, a further AD conversion operation is similarly carried out to obtain the remainder of the five uppermost bits of the conversion result.
When the comparisons for obtaining the five uppermost bits are completed, the AD converter shifts to comparisons for obtaining the three lowermost bits of the conversion result. After the comparisons for the lowermost bits are started, the reference voltage Vref furnished by the switch group 16 is applied to the second capacitor 14 by way of the fourth switch 17 which remains in the off state. During the comparison for obtaining each of the lowermost bits, a voltage having a value which corresponds to binary data comprised of the five uppermost bits fixed as mentioned above and the three lowermost bits each set to 0, which will be referred to as a final value, is constantly applied to the first capacitor 8 by way of the first switch 10 which remains in the on state. The inverter 9 compares the sum of the voltage having the final value and the reference voltage Vref with the sum of the charged voltages across the first and second capacitors 8 and 14. Then the inverter furnishes its output having a value which depends on the comparison result to the control circuit 1. The control circuit 1 determines new digital data to be delivered to the successive approximation register according to the value of the output of the inverter. The reference voltage Vref to be furnished to the fourth switch 17 by the switch group 16 is thus changed according to the new digital data from the successive approximation register. At that time, since the fourth switch 17 is held in the on state, the reference voltage Vref is applied to the second capacitor 14 and therefore the inverter 9 furnishes its output having a value which depends on the comparison between the sum of the voltage having the final value and the reference voltage Vref and the sum of the charged voltages across the capacitors 8 and 14 to the control circuit 1. After that, a further AD conversion operation is similarly carried out to obtain the remainder of the three lowermost bits of the conversion result.
The reference voltage Vref which is generated by the resistor ladder 3 and is selected by the switch group 6 is thus injected to the inverter 9 during the comparison for the uppermost and lowermost bits. Therefore, in either case, since the first and fourth switches 10 and 17 remain in the on state, the unstable reference voltage Vref which is making a transition from the previous value to a new value under the control of the switch group 16, is applied, by way of either the first switch 10 or the fourth switch 17, to the first capacitor 8 or the second capacitor 14 and hence to the input of the inverter 9. Thus, the unstable reference voltage Vref which is changing to a new value under the control of the switch group 16 exerts a bad influence upon the conversion accuracy of the AD converter.
Thus, a problem with the prior art method of controlling an AD converter which is so implemented as mentioned above is that in the case where the method is used for a successive approximation AD converter having a sample-and-hold function, since the AD converter controls the switch group 16 which selects, as the reference voltage Vref, one from among a plurality of voltages into which the voltage V between the terminals 4 and 5 is divided by the resistor ladder 3, with the first switch 10 held in the closed state, the conversion accuracy of the AD converter is decreased due to the unstable reference voltage furnished by the switch group 16 which is making a transition to a new value under the control of the switch group. As previously explained, when starting an AD conversion, the first to third switches 10 to 12 operate sequentially with predetermined timing so that the capacitor 8 is charged with the input voltage Vin. Then, the AD converter turns off the second and third switches 11 and 12 sequentially, and further turns on the first switch 10. After that, the AD converter does not repeat such the turning on/off operation. The unrepeatable switching operation has made it difficult to fix the above problem.
Similarly, in the case of controlling a capacitance-coupled AD converter, the prior method suffers from the same drawback that since both the first and fourth switches 10 and 17 are held in the closed state when conducting comparisons for the uppermost and lowermost bits, the conversion accuracy of the AD converter is decreased due to the unstable reference voltage Vref furnished by the switch group 16 which is changing to a new value under the control of the switch group 16.

Method of controlling analog-to-digital converter

Mitsubishi Electric Engineering Co., Ltd.


A system is disclosed that controls the power flow to Linear Synchronous Motor (LSM) stators for a vehicle transport system. This invention allows multiple vehicles to operate in close proximity in a guideway without requiring an excessive number of separate controllers. It can be used in conjunction with schemes now in use and is particularly useful in elevator hoistways or for automated people movers near stations.

The invention pertains to guideway operated vehicular systems and, more particularly, to improved methods and apparatus for controlling and propelling vehicles utilizing linear synchronous motors. The invention has application in people movers and materials transport systems, to name but a few.
A Linear Synchronous Motor (LSM) can be used to propel vehicles in a wide variety of systems for transporting people and goods. The type of LSM most appropriate for these missions is the "long stator" version in which the stator, or primary, runs the entire length of the guideway and the vehicle, or secondary, is much shorter and moves in close proximity to the stator. In order to handle multiple vehicles it is necessary to divide the guideway into regions that are typically referred to as "blocks" and to provide a separate power control system for each block. Such a power control system typically includes a power source (in the case of an LSM, a variable frequency, variable voltage, multi-phase source) and a controller (microprocessor-based or otherwise) with position sensing, e.g., to adjust the inverter to insure proper vehicle operation. Throughout this application, the power control system of an LSM is referred to as an "inverter."
A common prior art configuration of the power control system of an LSM is to have a separate inverter for each block. An example of an implementation of this power control scheme is shown in U.S. Pat. No. 3,158,765, Magnetic system of transportation. That patent shows a power control scheme that is similar to FIG. 1 hereof. As a vehicle enters each block, the inverter for that block is activated (e.g., by the associated controller) for powering the moving vehicle while it is within that block. Simple block switching of this type is satisfactory if the vehicles are not too close and the power dissipation in the stator is not too large.
In the case of transportation systems where the vehicles travel long distances with considerable distance between vehicles and especially when the force is relatively large, the prior art teaches the use of "sub-block switching". Examples of this are illustrated in U.S. Pat. No. 4,068,152, Power Supply System for a Linear Motor, and U.S. Pat. No. 5,361,707, Multiple feeder system of feeder sections for feeding ground coils of superconductive magnetically levitated railway. These patents show a power control scheme as generally shown in FIG. 2 hereof wherein each block is be divided into multiple sections, each of which is coupled to one of a bank of inverters for that block by an associated switch. As a vehicle enters each block, the appropriate inverter for that block is activated and the associated switches are used to couple power from it to those sections of the block in which the moving vehicle is located.
Prior art sub-block switching schemes take advantage of the fact that a switch is considerably less expensive than an inverter. There are many ways to implement sub-block switching and some of these are described in U.S. Pat. No. 4,454,457, Power supply system for a linear motor, and U.S. Pat. No. 4,955,303, Linear motor feeder system.
A problem with sub-block switching is that it does not permit propulsion and control of multiple vehicles which are closely spaced. As an example, it is not suitable for elevator applications of the LSM where two or more cabs operate in the same hoistway and have to move independently, even stopping on adjacent floors anywhere in a building. Nor, by way of further example, is it suitable for transit system applications, where it is desirable to have short spacing between vehicles in and near stations. In instances such as these, it is not necessary to have close spacing everywhere along the guideway, however, such need does exist at specific locations.
An object of the invention is to provide improved linear synchronous control systems and methods. A further object of the invention is to provide such systems and methods for use in guideway operated vehicles.
A still further object of the invention is to provide such systems and methods as permit independent powering and/or control of closely spaced vehicles—even in instances where multiple vehicles are in a single block.
A related object of the invention is to provide such systems and methods as can also be used where vehicles are not so closely spaced.

Linear synchronous motor power control system and methods


A process for making a composite substrate with cover utilizes heated dies of a forming tool to deform and heat the substrate. The heated substrate is then placed in a marriage tool having a room temperature lower die for receiving the substrate, and a heated upper die. A cover material layer is placed over the substrate and the marriage tool is closed. The cover material includes a heat activatable adhesive and with the marriage tool closed, the heat from the upper die adheres the cover material layer to the substrate while the room temperature die cools the substrate. In this way, when the marriage tool is opened, the composite structure can be removed without deformation.

The present invention relates, in general, to composite substrate such as headliners of motor vehicles, and in particular, to a new and useful process for bonding a cover and the substrate together.
U.S. Pat. Nos. 5,022,943 and 5,134,014, which are both incorporated here by reference, disclose methods, structures and materials for composite substrates of the type to which the present application relates.
FIG. 1 illustrates a corrugated fiberboard and thermoplastic composite substrate of the type which can be covered according to the process of the present invention.
The substrate generally designated 10 includes an upper kraft paper layer 12, and intermediate thermoplastic film layer 14 (e.g. PE), an inner kraft liner 16, an inner thermoplastic layer 18, and a corrugated fiberboard medium 20, with a similar construction opposite the corrugated medium.
FIG. 1 illustrates a single facer product while FIG. 2, where the same reference numerals are utilized to designate the same or similar elements, illustrates a single wall product. The combination of different paperweights with thermoplastic gives the substrate unique properties. When heat is applied, the films melt, releasing the liners and allowing the corrugated medium to slip into shape by using molding dies. After removing the heat, the thermoplastic films weld the materials together, rigidly in their new shape and configuration. The substrate is extremely versatile in its uses and the product can be laminated with different liner weights, PET, aluminum, non-woven or other materials bonded to the substrate for various applications. A vehicle headliner having various qualities of rigidity, noise absorption and other advantages is one example of a use for the substrate.
Two processes are currently known for manufacturing this type of composite substrate. FIG. 3 illustrates one of these processes in which one compression molding tool is used to both form and cover the substrate.
In an initial step 30, the substrate 10 is placed between an upper heated die 22 and a lower heated die 24, both heated to approximately 130.degree. C. In a subsequent pressure step 32, the dies are moved toward each other to heat and compress the substrate 10 for about 25-30 seconds.
In a subsequent step 34, the tool is opened by separating the dies 22, 24 from each other and a layer of cover material 40 is placed over the now formed substrate 10, between the dies.
Cover 40 may be any desired layer which is meant to be attached to either surface of the substrate 10, for an example, a decorative layer, with or without additional layers such as foam backings and the like. Examples of the types of cover layers which can be used are illustrated in U.S. Pat. No. 5,134,014. It is necessary that the cover layer 40 have a layer of heat activated adhesive or an adhesive quality or be capable of adhering under heating, to the substrate 10.
In subsequent step 36, the tool is closed by moving the dies 22, 24 toward each other to heat and apply pressure to the substrate 10 with cover 40, for an additional dwell time of approximately 25-30 seconds. Steps 32 and 36 represent first and second strokes for the tool. The second stroke 36 melts the adhesive on the cover material 40, bonding it to the substrate 10. The tool is then opened in step 38 and the molded substrate 10, 40, in the form of a vehicle headliner in the illustration of FIG. 3, is removed.
In a further step 42, the headliner 10, 40 is placed on a cooling nest 26. The cooled part may then be placed in a rack for later trimming or can be trimmed immediately in a subsequent trimming step. The process is then repeated for manufacturing additional products.
The advantages of this process are low cost since only one hydraulic press is required to open and close the tool. Good bonding is also achieved between the cover 40 and the substrate 10 because of the use of both upper and lower heated dies in the tool. In this field, the closing stroke 36 is referred to as a "heated marriage" step.
Disadvantages of the process illustrated in FIG. 3 include slow cycle time since two strokes are required in the same tool.
Since the substrate and perhaps even the cover have thermoplastic components, there is also the danger of deforming the product when it is removed from the heated tool. Care must be exercised, thus, in removing the product and this also involves additional time penalties.
Referring to FIG. 4, another known process for manufacturing the covered substrate, was developed to reduce cycle time and to yield a cool, easily handled part after the heated marriage of the cover material. In an initial step 50, substrate 10 is placed between heated dies of a first heated forming tool, heated to approximately 200.degree.-220.degree. C. In a second step 52 of the process, the tool is closed in a first stroke for approximately 25-30 seconds. In step 54 the tool is opened and the hot formed substrate 10 is placed between the cold dies 62 and 64 of a cold marriage tool. Cover material 40 is placed over the heated substrate 10 and the cold tool is closed in step 56.
The residual heat in the substrate 10 melts the adhesive of the cover material 40, thus bonding the cover to the substrate. While the marriage tool is cycling for approximately 25-30 seconds in its closed condition, another substrate can be molded in the hot forming tool 22, 24 thus increasing throughput, output or productivity.
In step 58, the cold marriage tool is opened and the cooled headliner 10, 40 can be removed for trimming or storage on a rack.
The advantage of the process of FIG. 4 is reduced cycle time. While the first substrate is in the cold marriage tool, another substrate can be running through the forming cycle. The thermoplastic is set, coming out of the cold marriage tool, allowing for immediate handling without the risk of deforming the product.
Disadvantages are that further reductions in cycle time are limited due to temperature requirements of the substrate when it is placed in the cold marriage tool. Occasional cover material de-lamination has also occurred when the substrate is too cool when it enters the cold marriage tool. Also, at forming temperatures over 220.degree. C. a noticable increase in odor occurs.
A need remains for further improvements in the manufacturing techniques of this type of covered composite substrate.

Process for bonding a cover to a substrate


A clock recovery circuit has a boundary detection/discrimination circuit to detect and discriminate a boundary in an input signal in accordance with a first signal. The clock recovery circuit performs clock recovery by controlling the timing of the first signal in accordance with the detected boundary, wherein boundary detection timing in the boundary detection/discrimination circuit is varied by controlling the first signal.

1. Field of the Invention
The present invention relates to a technology for enabling high-speed transmission of signals between a plurality of LSI chips or a plurality of devices or circuit blocks within a single chip, or between a plurality of boards or a plurality of cabinets, and more particularly, to a receiver circuit and a clock recovery circuit that uses a feedback loop type clock signal generating circuit.
2. Description of the Related Art
Recently, the performance of components used in computers and other information processing apparatuses has been greatly improved. In particular, dramatic improvements have been made, for example, in the performance of processors and semiconductor memory devices such as DRAMs (Dynamic Random Access Memories). The improvements in the performance of semiconductor memory devices, processors, and the like have reached the point where system performance cannot be improved further unless the speed of signal transmission between components or elements is increased.
Specifically, the speed of signal transmission between a main storage device such as a DRAM and a processor (i.e., between LSIs), for example, is becoming a bottleneck impeding performance improvement for a computer as a whole. Furthermore, the need for the improvement of signal transmission speed is increasing not only for signal transmission between cabinets or boards (printed wiring boards), such as between a server and a main storage device or between servers connected via a network, but also for signal transmission between chips or between devices or circuit blocks within a chip because of increasing integration and increasing size of semiconductor chips, decreasing supply voltage levels (low-voltage-swing signals), etc.
In order to address the increase in the amount of data transmission between LSIs or between boards or cabinets, signal transmission speed per pin must be increased. This is also necessary to avoid the increase in package cost, etc. due to an increased pin count. Consequently, inter-LSI signal transmission speeds exceeding 1 Gbps have been achieved in recent years, and it is expected that extremely high signal transmission speeds, such as 4 Gbps or even 10 Gbps, will be achieved in the future (three to eight years from now ).
In order to speed up the signal transmission between LSIs, for example, it is required that the receiver circuit operate with accurate timing for each incoming signal (for data detection and discrimination). It is known in the prior art to provide the signal receiver circuit with a clock recovery circuit that uses a feedback loop type clock signal generating circuit in order to generate a clock (internal clock) of such accurate timing. Here, the value of a phase adjusting weight for clock recovery is generated using, for example, a phase comparator which compares the phase of an external input clock with that of the internal clock.
In order to achieve high-speed signal transmission, it is desired to provide a clock recovery circuit and a receiver circuit wherein limit cycle signal amplitude is small and the jitter dependence and signal level dependence of feedback loop characteristics is reduced (to facilitate prediction of the circuit characteristics). Further, in such high-speed signal transmission, the transmitted signal waveform does not arrive as an ideal rectangular wave due to the characteristics of the transmission line, etc. making accurate signal reproduction difficult.
The prior art and its associated problems will be described in detail later with reference to drawings.

Clock recovery circuit and receiver circuit for improving the error rate of signal reproduction


A system and method for enabling a wireless communication device to register a temporary public IP address assigned to the device by a network access translation module, when the device is initially informed only of a private, non-routable IP address that has been assigned to it. In one embodiment, the device sends a “blind” registration message to an SIP server, with the private IP address of the device being translated to the public IP address by the NAT and with the SIP server registering the “originator” address in the header. In another embodiment, a registration server detects a message indicating the public IP address and sends the public IP address back to the device, so that the device can conventionally register the address with the SIP server.

Wireless communication devices, such as but not limited to wireless telephones that communicate using Code Division Multiple Access (CDMA) spread spectrum modulation techniques, communicate over the air with system infrastructure using wireless telephone over-the-air communication protocols, e.g., the CDMA protocols known as IS-95A and IS-2000. The system infrastructure, which can include base stations (BTS), base station controllers (BSC), and other components, connects the wireless telephone to another communication device, such as a through land line or another wireless communication system.
In the case of CDMA, voice data is sent over the air in packets that are collected by the infrastructure and assembled into a voice stream, transparently to the speakers who are talking to each other. As might be expected, the over-the-air protocol is tailored to optimize wireless communication. For instance, to maximize over-the-air capacity, the over-the-air protocol contains a minimum of signalling information, and the size of a voice data packet is relatively small.
With the growth of the Internet, computer-to-computer communication using Internet Protocols (IP) has become ubiquitous. Furthermore, it has become desirable not only to facilitate computer data communication using IP, but to facilitate voice communication using IP as well. As but one advantage afforded by using IP in a telephony infrastructure, much hardware such as switches can be eliminated, and existing computers and software can be used instead, reducing cost. To this end, so-called voice over IP (VOIP) has been introduced.
To support VOIP, a communication device must have, among other requirements, an IP address, so that the IP-based infrastructure knows where to send data and voice packets intended for the device. Typically, the IP address for a wireless device is not static, but rather one is assigned to a device upon power-up by a local network carrier from a pool of IP addresses assigned to the carrier. According to current protocol, the device registers its temporary IP address by sending a registration message through the Internet to an SIP server that is not necessarily associated with the local network carrier.
The present invention understands that for several reasons, many local networks assign internal IP addresses to their devices, with the internal IP addresses being routable only within the local network and not outside the system through the rest of the Internet. This might be done, e.g., because a system might be allocated a block that contains only a limited number of routable IP addresses, whereas it can define an almost unlimited number of internal IP addresses to allocate to its various devices for internal communication-only purposes.
To preserve system security by preventing non-system devices from learning about the local network's internal topology, which might otherwise be possible, and to provide a means by which a wireless communication device can communicate outside the local network (as is typically required to complete a VOIP communication path through the Internet), many local networks that employ internal-only addresses include an interface to the Internet referred to as a network access translation (NAT) component. Among other things, the NAT translates a device's internal IP address, sometimes referred to herein as a "private" IP address, to an Internet-routable IP address, sometimes referred to herein as a "public" IP address. It is to a device's public IP address that IP packets must be sent, and from a device's public IP address from which IP packets must appear to have originated.
However, as critically observed by the present invention, it is the public IP address—the one that is assigned by the NAT and that consequently is unknown to the device—that a device must register with the external SIP server. The present invention accordingly recognizes that a method must be provided for wireless communication devices in local networks such as described above to register their public, NAT-assigned IP addresses with an SIP server that is external to the local network. Moreover, the present invention understands that in preferred non-limiting embodiments the registration procedure should not necessarily require an additional proxy server located at the NAT interface, since this would be expensive and/or impractical in many cases and potentially not under the user's control.

System and method for registering IP address of wireless communication device


The disclosure is directed to an improved circuit and method which utilizes a plurality of generally planar diamond substrate layers. Electronic circuit elements are mounted on each of the substrate layers, and the substrate layers are disposed in a stack. Heat exchange means can be coupled generally at the edges of the substrate layers. In a disclosed embodiment, a multiplicity of generally planar diamond substrate layers and a multiplicity of generally planar spacer boards are provided. Each of the substrate layers has mounted thereon a multiplicity of electronic elements and conductive means for coupling between electronic elements. In general, at least some of the electronic elements on the substrate layers comprise integrated circuit chips. The substrate layers and spacer boards are stacked in alternating fashion so that spacer boards are interleaved between adjacent substrate layers. Each of the spacer boards has a multiplicity of electrical conductors extending through its planar thickness to effect coupling between electronic components on the substrate layers on its opposing sides. The extremely high thermal conductivity of diamond permits adequate heat removal from the defined three-dimensional circuit structure by heat exchange means that do not substantially interfere with electronic element density, with vertical interconnect density, or with the desire for small physical size.

The VLSI (very large scale integration) circuits used in computers and other electronic systems or subsystems typically employ a large number of circuit elements. [As used herein, "circuit elements" is intended to generically include active as well as passive devices or components of any kind used in electronic or electro-optical applications.] VLSI circuits may at present have many thousands to over a million transistors on a single die, the semiconductor chip from which the circuit is fabricated, and a computer system may have large numbers of such chips. The technology continues to move in the direction of increasing device density for primarily two interrelated reasons. One is the need to reduce the size of the circuits in order to permit increased complexity for a given machine size with reduced manufacturing cost and power requirements. The other is the need to increase the operating speeds. The electromagnetic propagation delay or transit time of signals traveling within the machine between circuit elements, and particularly between different integrated circuits, is a significant factor in limiting the operating speed. Therefore, it is desirable that integrated circuit chips of a machine which communicate with one another be placed as closely together as possible.
A serious constraint in the increase of packing density of integrated circuits is their thermal management; i.e., the ability to effectively carry away the heat generated by the electronic components. The density of heat generating devices and their operating frequency (since the power dissipation of some types of circuits increases with frequency) both contribute to the problem of heat generation. In the 2-dimensional case, to make the interconnect propagation delays a constant fraction of a clock cycle, the power density tends to increase as the cube of the operating clock frequency. If the high power densities are not counterbalanced by improved heat removal, higher device operating temperatures will result which will drastically increase the failure rate of electronic integrated circuits or, if high enough, cause the circuits to be inoperative, or even cause permanent destruction of the circuit. In general, the build-up of heat can be controlled by incorporating a high thermal conductance, called a heat sink, between the integrated circuit chips and some cooling medium suited to the demands of the particular application. The cooling medium may be air, water, a common refrigerant, or even liquid nitrogen. It is possible to incorporate the heat sink within the circuit board or substrate material on which the circuit chips are mounted in some applications, providing the heat sink material is good enough to effectively support the lateral heat flow through the substrate. The effectiveness of the heat sink is a function of the thermal conductivity of the heat sink material, so materials of high thermal conductivity are preferred for use as heat sinks. Diamond has the highest thermal conductivity (k=2000 W/m degree K. at 300 degrees K.) of any known material. Silver, copper and aluminum (with k=430, 400 and 240, respectively at 300 degrees K.) are among the best cheaper alternative heat sink materials, but are electrical conductors, requiring special electrical insulating steps if isolated conductors must be passed through the material, compromising the thermal conductance. Also, silver and copper (which are better thermal conductors than aluminum) are much heavier per unit volume than diamond. A further advantage of diamond is that its thermal expansion coefficient is a better match to that of silicon than most other heat sinking materials. Diamond has been suggested and used as a heat sink material for electronic devices and circuits because of its superior thermal conductivity and insulating properties, but its practical use has been limited by its cost/benefit ratio in circuit applications where alternative heat sinking materials may be more readily provided in the necessary sizes and shapes, and where such alternate materials are operationally adequate.
In recent years it has been demonstrated that there can be great advantages in a 3-dimensional interconnected packaging approach, wherein a number of 2-dimensional circuit boards (each typically containing many chips) are stacked vertically and wherein, instead of being edge connected, vertical interconnects between the boards are provided and are distributed over the area of the boards. Such an approach has the advantage of reducing the maximum path lengths and electromagnetic propagation delays of the signal interconnection lines in the overall circuit and in greatly reducing the critical path delays for signals among smaller groups of chips implementing key functions, as well as generally making available much higher levels of system connectivity. Notwithstanding these advantages, a serious problem of the 3-dimensional interconnect packaging approach is the amount of heat that builds up as a consequence of the high density of devices and the smaller external surface area per unit volume or per integrated circuit of the 3-dimensional package. Sophisticated heat removal techniques, including the pumping of cooling fluid through a number of paths in the structure and/or immersion of the structure in a refrigerant which may be pumped through the structure, are expensive and/or inconvenient, particularly due to the presence of the conductive vertical interconnects between boards which tends to block the spaces between the boards that would otherwise be available as flow paths for the cooling fluid (e.g., air, fluorinert, etc.).
It is among the objects of the present invention to provide improved electronic circuit fabrication, interconnection, packaging, and thermal management which is responsive to the described problems and limitations of the prior art.

Electronic circuit and method with thermal management