A process for producing air bearing sliders for thin film magnetic heads, one at a time from a strip of material having the thin film heads aligned in a column. The thin film heads are aligned within the column such that the slider processing is performed in a direction substantially parallel to the orientation of the column. In one embodiment, a mechanical backing, fixture or substrate provides structural rigidity to the strip of material having the sliders while undergoing mechanical processing, such as lapping.

1. Field of the Invention
This invention relates to process for the manufacturer of air bearing sliders including transducers, and more particularly to a process for producing air bearing sliders from a wafer which includes a plurality of transducers.
2. Description of the Prior Art
In the prior art, methods of producing sliders with thin film read/write heads have followed a technique such as that illustrated in U.S. Pat. No. 5,095,613 to Hussinger et al., issued Mar. 17, 1992. The process in Hussinger begins, in one embodiment with a wafer on which a plurality of read/write transducers have been manufactured. From the wafer a row of transducers are sliced and the row is glued to a fixture. Or alternatively, the wafer is glued to a fixture, such as illustrated in the embodiment disclosed in FIG. 7, leaving a row of transducers exposed and available for processing. The row of transducers are all simultaneously lapped to provide the appropriate throat height for the transducers. In a prior art process described and illustrated in Hussinger et al., and more particularly the process of FIGS. 6, 6a and 6b in Hussinger et al., a row of transducers is removed from a wafer and the row of transducers is processes simultaneously. One of the problems with the foregoing processes which utilize a row-processing technique is that because of a bowing of the row of transducers, a non-uniform throat height from end-to-end of the row results. This phenomenon is referred to as row bow. The resulting heads across the row have varying throat heights, which results in magnetic transducers having non-uniform electrical characteristics. The read/write electrical characteristics of a magnetic transducer varies substantially as a result of a variation of throat height and accordingly with a non-uniform throat height of the devices the electrical characteristics of magnetic heads produced by the row processing technique can widely vary. If read/write transducers having a small margin of error from transducer-to-transducer in regard to their electrical characteristics are required, then the variations in the characteristics from transducer-to-transducer produced by the row process may require that a high percentage of the devices be discarded, resulting in unacceptably low yield.
Conventional, row-oriented slider fabrication processes separate by a row at a time sliders which have been formed on the surface of a wafer. For example, referring to FIG. 1, wafer 1 includes a plurality of rows 2 in which heads (not shown) are formed in a alignment across the row. All heads on the row must be colinear, that is oriented in a straight line in order for them to have equal throat heights when the row of heads are processed in a method such as that illustrated in the Hussinger et al. patent. The requirement that all heads in a row be colinear places a constraint on the wafer layout. More particularly, all heads must be arranged in rectangular arrays such that all rows are of equal length for batch processing. If a square wafer is utilized, then the layout is straight forward since the rows may be made the width of the wafer. However, it is preferable to use a round wafer since it is easier to coat evenly with photoresist. As will be appreciated from reference to FIG. 1, the rectangular array constraint results in a significant loss of usable are of the wafer since those areas indicated at 3 will not include heads. Thus this loss of area reduces the number of sliders which may be manufactured per processed wafer, hence increasing the cost of the heads. The unusable area may be as much as 50% of the wafers, total area, resulting in considerable waste. Additionally, this colinearity requirement also places constraints on the wafer-level element fabrication process, especially the photolithography process. When the sliders which are being manufactured utilize thin film heads, 1.times. projection and lithography, and step and repeat lithography are commonly used. Both are affected by the colinearity requirements. For 1.times. projection processes, the mask must be precisely made so that each rows' elements line up within hundredths of a micron, which increases the cost of the mask. Additionally, the distortion of the exposure process must also be tightly controlled.
If a step-and-repeat process is used to define the transducer elements, additional colinearity implications are encountered which are more onerous than those encountered with the precision required for the mask. Alignment between stepped fields is typically only achievable within tenths of a micron. Thus splitting a row across two or more fields can result in a shift in throat height. This is illustrated in FIG. 2 where a highly magnified view of portion 4 of wafer 1 is illustrated. In FIG. 2, in field "n" transducer elements are indicated by circles and the centerline of those elements is indicated by dashed line 5. Similarly, the transducer elements in field n+1 are indicated by circles and the centerline of those elements indicated by dashed line 6. As will be appreciated by reference to FIG. 2, the difference in distance between lines 5 and 6 illustrate the misalignment and lack of colinearity. When the row containing these misaligned portions is processed on the row-basis, an unacceptable variation in throat height will result. One possible solution to this misalignment where a plurality of fields are used in a row is to avoid this by having an entire row contained in a single field. This however limits the size of the row since stepper lithographic fields are limited in size, and therefore limiting the row lengths to the field size can limit the utilization to the wafer. For example, referring to FIG. 3, wafer 7 is illustrated, with the wafer having a plurality of fields indicated at 8. The width of the field (and accordingly the length or the row) is limited by the field size and therefore further inefficiency results since unusable areas 9 are left. The layout in FIG. 3 is not optimum because it requires may more fields to be printed.
An optimum layout would be one such as that illustrated in FIG. 4 in which four fields are utilized to more efficiently cover the surface of wafer 10. The fields in FIG. 4 are denoted by F1, F2, F3 and F4. From the above, it will be appreciated that the processing on a row by row basis makes the stepper lithography less efficient and more expensive.


A method and system for indirect tire pressure monitoring of tires of a vehicle is described. The method may include providing a tire classification database indicating at least one classified tire type. The method may also include determining a vehicle tire type for the vehicle on the basis of vehicle data in including information on at least one tire currently used with the vehicle, and determining whether the vehicle tire type can be associated to one of the at least one classified tire type. The method may also include, in the case an association is determined, monitoring tire pressure according to the associated classified tire type.

Monitoring of tire pressure can be assumed to become a standard functionality in vehicles, at least in cars and trucks, not only due to governmental and legal regulations but also in view of a general demand for enhanced vehicle safety.
The importance of having correct tire inflation pressure is well known. The inflation pressure directly affects, e.g., the vehicle handling, the load capacity, and the fuel consumption. There are studies that indicate that tire related problems are the third most common reason for breakdown of passenger vehicles. Furthermore, it has been shown that a majority of all tire flat-outs is preceded by under-inflation or slow air leakage. With tire pressure monitoring that detects the presence of air leakages, severe accidents can thus be avoided.
Besides these well known facts about the importance of having a correct inflation pressure, tire pressure monitoring has become even more important since legal regulations in some countries require all new motor vehicles to be equipped with a system that monitors the tire pressure.
There are two alternative approaches to monitor the tire pressure. One way is to mount a pressure sensor inside the tire and transfer the pressure sensor value wireless to an on-board tire pressure system of the vehicle. This approach is referred to as "direct tire pressure monitoring". The other alternative, called "indirect tire pressure monitoring", uses existing sensors (e.g. control and/or detection devices of vehicles, ECUs (electronic control unit), antilock braking systems, dynamic stability systems, anti-spin systems and traction control systems, in form of digital and/or analog data and/or signals) to compute quantities related to the tire pressure. Indirect tire pressure monitoring is not directly measuring the air/gas pressure in a tire. Rather, parameters correlated with tire pressure are calculated using data available from the vehicle (e.g. from brake system or the electronic stability control system) and, on the basis of such parameters, tire pressure is indicated.
Vehicle data commonly used in tire pressure monitoring is data indicating an effective roll radius of wheel/tire. For the sake of illustration, it will be referred to such wheel radius data in the following.
However, there are several effects possibly influencing actual tire pressure and, thus, relation(s) between actual tire pressure and data from which actual tire pressure, an estimation thereof or tire pressure deviation is to be derived.
For example, current driving situations (e.g. acceleration, deceleration; driving on smooth road surfaces vs. rough road surfaces; driving in curves etc.), temperature(s) affecting tire pressure and the like may influence actual tire pressure and should be therefore take into account in indirect tire pressure monitoring.
Further, different tire types will have different properties that may be also taken into account in indirect tire pressure monitoring. For example, different tires (brand, dimension, winter/summer, etc.) to some extent respond differently to changes in inflation pressure, e.g., for a given amount of tire pressure loss, a corresponding change in e.g. effective roll radius will differ between different tires. To ensure a reliable indirect tire pressure monitoring a consistent behavior in general, it would be helpful to specify the behavior of the pressure related parameters of tire(s).
To this end, an approach may be performing in-vehicle tests where a vehicle equipped with a tire type of interest is actually driven, wherein, e.g., pressure related tire behavior may be specified. However, such an approach will be time-consuming and expensive.

Tire pressure classification based tire pressure monitoring


A blankmask and a photomask using the same are provided. The blankmask can be useful in preventing the loss in thickness of lateral, top and bottom surfaces of a pattern of a light shielding film or a phase shifting film after the manufacture of the photomask by forming protective film, which has an etch selectivity with respect to a pattern of a hard film or the light shielding film, on the light shielding film or the phase shifting film so that the loss of the phase shifting film formed under the light shielding film or the phase shifting film can be prevented when a process of removing the light shielding film disposed under the hard film or a pattern of the light shielding film is performed during a washing process and a process of removing a pattern of the hard film in a method of manufacturing a photomask, thereby securing uniformity in thickness.

1. Field of the Invention
The present invention relates to a blankmask and a photomask using the same, and more particularly, to a blankmask having a hard film formed therein for realizing a pattern having a half-pitch of 32 nm or less, particularly 20 nm or less, and a photomask using the same.
2. Discussion of Related Art
Today, ultrafine processing technology for semiconductors has emerged as a very important factor to meet the need for fine circuit patterns accompanied by high integration of large-scale integrated circuits (ICs). In the case of highly integrated circuits, circuit wires become finer for the purpose of low power consumption and high-speed operations, and there are growing technical demands for contact hole patterns for interlayer connections, circuit arrangement for high integration, etc. Therefore, in the manufacture of the photomask on which an original circuit pattern is recorded, lithography technology capable of forming finer circuit patterns and recording more precise circuit patterns on the photomask is required so as to meet such demands.
Binary blankmasks using a light shielding film, and phase shifting blankmasks using a phase shifting film and a light shielding film are commercially available as raw materials for photomasks manufactured using the lithography technology. Further, blankmasks further including a hard film have been developed in recent years.
In the case of the blankmasks including the hard film among the above-described blankmasks, the structures of binary blankmasks using a molybdenum silicide (MoSi) compound as a light screening film, and the structures of phase shifting blankmasks using a molybdenum silicide (MoSi) compound as a phase shifting film and a chromium (Cr) compound as the light screening film have been generally developed.
Meanwhile, a method of manufacturing a photomask using the blankmask including the hard film is performed by patterning a hard film using a resist film disposed on the hard film as an etching mask, etching a metal film disposed below the hard film using a pattern of the hard film as the etching mask, and removing the pattern of the hard film.
In the method of manufacturing a photomask, however, the processes of patterning the lower metal film using the hard film and removing the hard film have the following problems.
Specifically, in the method of manufacturing a photomask, a washing process using chemicals, for example, Standard Cleaning-1 (SC-1), sulfuric acid (H2SO4), ozone water (O3), and the like is carried out. The washing process has a problem in that a difference in optical density (OD) and critical dimension (CD) uniformity between a central region and an outer region, or a main pattern region and a non-main pattern region occurs as the regions are exposed to a washing material for different times due to a loading effect according to a difference in pattern density between the regions. The difference in optical density and critical dimension on such a photomask affects the critical dimension uniformity of a pattern printed on a wafer due to image contrast enhancement problems during a process of printing a wafer using a photomask.
Also, problems regarding the loading effect occur in a process of removing a pattern of the hard film in the method of manufacturing a photomask. Specifically, after a pattern of a metal film disposed below the hard film using the pattern of the hard film is completely formed, a loading effect in which a time required to remove the hard film is different due to the difference in density between a central region and an outer region, or a main pattern region and a non-main pattern region of the pattern of the hard film occurs during the process of removing the pattern of the hard film. Therefore, a difference in optical density and critical dimension between the regions occurs since a time for which the pattern of the metal film formed below the hard film is exposed to the etching material is different due to the difference in density of the pattern of the metal film. Finally, the difference in optical density and critical dimension on such a photomask results in critical dimension ununiformity at a wafer level and a process margin problem during a process of printing a wafer using a photomask.
The same problems occur in the phase shifting photomask as well as the binary photomask formed using the hard film. Particularly, the problems are increasingly issued as the size of the pattern becomes finer.


A system and method for pre-charging the DC bus of a utility connected power converter. In one embodiment, a full-wave rectifier circuit is coupled to the utility grid through an isolation transformer and circuit protector. The rectifier circuit output is connected to the DC bus of the power converter to provide a pre-charging current to the DC bus capacitors. The output from the rectifier circuit also supplies power to the control circuit power supply for the converter. When the control circuit closes the contactor of the converter system and activates the converter, the voltage across the DC bus capacitors is increased above the level of the rectified power grid voltage provided at the output of the pre-charge circuit. This reverse-biases the rectifier diodes, placing the pre-charge circuit into an inactive state. The impedance of the isolation transformer limits the in-rush current into the DC bus capacitors during the pre-charge.

Power converters are used to convert AC utility power for use by load devices requiring a reduced or boosted AC or DC supply voltage and/or by load devices that require an AC supply voltage at frequencies that are different from the conventional 50/60 Hz utility grid supply. Conventional utility power converters often include a utility-side converter connected to the utility grid through a contactor and filter circuits. The output of the utility-side converter is typically rectified, boosted, and supplied to a DC bus, including charging one or more DC bus capacitors. The DC bus is then linked to the inputs of one or more load-side converters, the outputs of which are connected to a load device such as an AC or DC motor/generator or a battery or other energy storage system.
The power converter usually includes a control circuit containing control logic that initiates and regulates operation of the converter. The control circuit requires its own control power supply so that the control circuit can perform its start-up and initial control functions independent of the operation of the converter. In conventional utility grid power converters, a source of external power therefore must be connected to the converter to energize the internal control circuit power supply. This is often accomplished through the use of a battery or other power source that is separate from the utility grid.
In addition, a utility power converter includes a pre-charge circuit to pre-charge the DC bus capacitor(s) before the converter is activated. A conventional pre-charge circuit often uses a resistor network connected in parallel with the power line contactor, utilizing the diodes inherent in the utility-side converter to rectify the grid power into the DC bus. Although the resistors are effective in limiting the in-rush current to the DC bus capacitor(s), they introduce energy losses from resistive heating. The resistors are subject to overheating and failure in the event of an electrical fault in the contactor circuit, and/or a fault in a converter on the DC bus. Also, because the resistor network electrically connects the contactor to the DC bus, there is no galvanic isolation between the power grid and the output of the converter.
What is needed is a pre-charge system and method for a power converter without the disadvantages described above.

System and method for pre-charging the DC bus of a utility connected power converter


According to a first aspect of the present invention there is provided an apparatus configured to classifying user traffic flows carried by a network, each user traffic flow being associated with one of a plurality of users. The apparatus comprises a classification unit 7 for classifying each user traffic flow into one of a plurality of traffic classes, a pattern generation unit 13 for generating a user pattern for each user, a grouping unit 14 for grouping the plurality of users into one or more user groups, and for identifying a user pattern within each user group that is representative of all user patterns within the user group, and an optimized classification unit 8 for identifying a user associated with a subsequent user traffic flow, determining the user group to which the user belongs, retrieving the representative user pattern of said user group, and using the traffic classes included in the representative user pattern to classify the subsequent user traffic flow.

A packet is a formatted unit of data carried by a packet switched network. When data has to be transmitted, it is broken down into segments and formatted into packets for transmission over the network. When the packets reach their destination the segments of data encapsulated within the packets can be retrieved and reassembled into the original data. The exact format of the packets depends upon the protocol used by the network. However, a packet typically has a header and a payload. The header usually contains information required to route the packet to its intended destination, and possibly information identifying the source of the packet. The payload or content of the packet contains the data segment carried by the packet. A packet flow or traffic flow is a sequence of packets sent from a particular source to a particular destination.
Packet filtering involves parsing a packet header, and applying a pre-defined set of rules to the information contained within the header in an attempt to classify the type of network traffic to which the packet belongs. Traditionally, packet filtering has been used by firewalls to prevent unauthorized access to or from a particular network or computer, whilst permitting authorized communications. However, packet filters are stateless, as they examine packets on an individual basis and have no memory of previous packets, which makes them vulnerable to spoofing attacks. Spoofing involves an attacker gaining unauthorized access to a computer or network by making it appear that a malicious message has come from a trusted machine by faking the address of that machine in the packet header.
As an advance on packet filtering, stateful packet inspection can be used to determine which network packets to allow through the firewall. Stateful packet inspection involves examining packet headers and remembering something about them. This information can then be used when processing later packets. For example, both incoming and outgoing packets can be examined over a period of time and outgoing packets that request specific types of incoming packets are tracked, with only those incoming packets constituting a proper response to an outgoing packet being allowed through the firewall.
Packet filtering and stateful packet inspection are known as Shallow Packet Inspection (SPI) techniques, as they rely solely on the information contained in the header of the packets to determine how a packet should be dealt with. For example, in an IP network, SPI involves inspecting IP packets up to layer 4 (TCP/UDP layer) of the OSI model, typically extracting a "5-tuple" consisting of the source IP address, destination IP address, source transport layer address (e.g. TCP/UDP port), destination transport layer address (e.g. TCP/UDP port), and the next level protocol used in the data portion of packet (e.g. TCP, UDP, ICMP etc). However, by only examining the information contained with the packet headers, these SPI techniques have their limitations.
In order to overcome some of the shortcomings of SPI, Deep Packet Inspection (DPI) involves looking beyond the header information, and inspecting the content or payload of packets, up to layer 7 of the OSI model. This thorough analysis of packets can be used for a variety of purposes, including, among others, network security, network management, traffic profiling and statistics collection, copyright enforcement, content regulation, and surveillance.
A DPI system analyzes the header and payload of packets flowing through it, and applies a set of packet classification rules or criterion to the information in the header and payload of packets in an attempt to identify the class of traffic and user session to which a traffic flow belongs. For example, a DPI system will parse the packets in a flow to determine the type of protocols (HTTP, SMTP, etc) that the packets relate to, the metrics of the packets (size, ports, etc), the packet or octet transfer rates, and the sequence(s) of exchanged packets etc. A DPI system will then apply the packet classification rules to all of this information in an attempt to determine the class of traffic. These packet classification rules can make use a variety of techniques such as port analysis, string matching, statistical analysis, heuristic analysis, protocol header analysis, packet payload analysis etc. As such, systems that implement DPI are required to thoroughly analyse packets in real-time and, in general, will be required to analyse at least a minimum number of packets at the beginning of almost every traffic flow sent and/or received by a user. DPI systems are therefore required to be capable of providing a significant amount of computing power.
Due to the highly demanding task performed by DPI systems when used to perform packet classification, and to the ever increasing amount of network traffic, the amount of data to be analyzed by DPI systems has reached a point at which optimisation mechanisms are mandatory. Currently, optimisation for DPI systems is achieved using either horizontal or vertical scaling. Horizontal scaling makes use of an increasing number of machines to perform the DPI analysis in parallel, whereas vertical scaling involves delegating individual steps of the DPI analysis to specialised hardware. However, both increasing the number of machines and the use of specialized hardware can be expensive such that it may well be unfeasible, from a business perspective, to acquire and maintain the systems required to perform DPI. For example, DPI is likely to be unfeasible for the traffic flows generated by or for the users of a flat-fee mobile broadband service.
In addition, both horizontal scaling and vertical scaling are only capable of achieving a linear increase in performance. For example, in order to double the rate at which a DPI system can classify traffic flows, the system would require double the number of machines, or double the amount of resources. Given that all forecasts of Internet traffic, both mobile and fixed, predict an exponential increase in the amount of traffic consumed by users, this linear increase in DPI throughput will not be sufficient, at a reasonable cost, to keep up with the traffic that will have to be analyzed. It is therefore desirable to provide a mechanism for optimising the traffic classification performance of DPI systems to sufficiently increase their throughput at a minimal cost.


Apparatuses, systems, and methods of manufacturing are described that provide a drop link and associated conveying system for item transport. An example conveying system includes a telescopic side guide that includes one or more sections and a plurality of drop links each supported by respective sections. Each drop link includes an extension mechanism that movably attaches the drop link to the section. Each extension mechanism allows translation of the drop link relative the respective section of the telescopic side guide between a retracted position and an extended position in which a portion of the drop link extends at least partially beyond an outer edge of the respective section of the telescopic side guide.

Warehouses, distribution centers, and other material handling environments often rely on a number of components, systems, and the like for transporting items to and from various locations within these environments. During movement of the items, various systems (e.g., conveyors, robotic arms, or the like) may be used to reorient, position, and/or redirect these items. However, the inventors have identified numerous deficiencies with these existing technologies in the field, the remedies for which are the subject of the embodiments described herein.

Conveying systems and drop link components


A package for securing a PCB to a heatsink includes mounts with over-torque protection features. The PCB is seated in an open end of the package. Each mount includes a threaded opening for securing the package to the heatsink such that the base layer of the PCB is thermally coupled to the heat sink. The over-torque protection features are connected between the threaded opening and a sidewall of the package. The over-torque protection features may be designed to structurally fail and/or deform in response to over-torqueing of the fasteners, thereby inhibiting flexure of the PCB.

Electronic devices typically include various components mounted on a PCB (Printed Circuit Board). If any of the components generate significant amounts of heat, then the device may be thermally coupled to a heat dissipation object. For example, the PCB may be bolted or clamped to a heat sink with a thermally conductive paste, gel, or pad placed therebetween to fill potential air gaps between contact surfaces, and provide a thermal transfer path.
Aluminum PCBs are particularly well suited for electronic devices that generate significant heat. Aluminum PCBs have an aluminum base layer, a dielectric layer and a copper circuit layer. The dielectric and copper circuit layers may be similar or identical to the dielectric and copper circuit layers of common FR4 PCBs. However, the aluminum base layer has better thermal transmittance characteristics than FR4. An aluminum PCB with a 1.5 mm thick base layer has a thermal resistance of about 1-2 degrees per watt, whereas an FR4 PCB with a 1.5 mm thick base layer has a thermal resistance of about 20-22 degrees per watt. Consequently, aluminum PCBs may be preferred for electronic devices for which a heat sink is required.
A problem that may be encountered with electronic devices that are fastened to another object is that surface-mounted components may be damaged by flexure of the PCB. For example, an aluminum PCB that is secured to a heat sink with multiple machine screws that exert enough force to assure contact, and thus thermal coupling, between a flat surface of the heat sink and the entire lower surface of the aluminum PCB may flex during installation if torqueing of the fasteners is not accurately controlled. If either the aluminum base layer or the mounting surface of the heat sink is non-planar, then the aluminum base layer may flex if the fasteners are over-tightened. Even if both the aluminum base layer and the mounting surface of the heat sink are planar, foreign matter located between the surfaces being mated may cause the aluminum base layer to flex if the fasteners are over-tightened. Further, the conductive paste, gel, or pad that is intentionally placed between the surfaces being mated may cause the aluminum base layer to flex if the fasteners are over-tightened. In general, the thickness of the material is proportional or inversely proportional to the likelihood that flexing will occur. Many types of electronic components are relatively tolerant to flexing of the aluminum base layer. However, certain types of components such as surface-mounted ceramic capacitors are more susceptible to damage caused by flexing of the aluminum base layer.

Over-torque protection features for mounting an electronic device to a heat dissipation object


Inkjet head comprising a substrate having pressure chambers, which contain ink, communicate with respective nozzles from which the ink is ejected in a predetermined direction. A spacer substrate is disposed on an opposite side of a diaphragm from the predetermined direction. The diaphragm forms one surface of each of the pressure chambers, which is on an opposite side of the each of the pressure chambers from the predetermined direction. A wiring substrate is disposed on an opposite side of the spacer substrate from the predetermined direction. Actuators are in contact with the diaphragm in a space formed by the spacer substrate between the wiring substrate and the diaphragm, the actuators being electrically connected to respective wires of the wiring substrate. Differences in coefficients of thermal expansion between the pressure-chamber substrate, the diaphragm, the spacer substrate, and the wiring substrate are equal to or less than a predetermined value.

An inkjet head includes multiple nozzles to eject ink, multiple pressure chambers to apply pressures for the ink to be ejected from the nozzles, and flow paths to supply ink to the pressure chambers etc. If these components of the inkjet head are arranged along a plane (e.g. horizontal plane) perpendicular to the ink ejection direction (e.g. vertical direction), the intervals between the nozzles have to be large, making it impossible to increase the density of ejected ink. An inkjet head has been known where pressure chambers are disposed above nozzles and where a common flow path to supply ink to the pressure chambers is disposed further above the pressure chambers to increase the density (see, for example, Patent Literature 1). Such an inkjet head actuates actuators that are externally in contact with the wall surfaces of the pressure chambers and applies pressures to the interiors of the pressure chambers to eject ink from the nozzles.
FIG. 9 is a cross-sectional view of the configuration, around a nozzle, of a conventional inkjet head.
As shown in FIG. 9, an actuator 203 and a wiring substrate 204 are electrically connected to each other through a bump 205 and a solder 206. The actuator 203 is externally in contact with each pressure chamber 201 through a diaphragm 202 disposed on the upper surface of the pressure chamber 201. The wiring substrate 204 is made of silicon and is disposed above the actuator 203. The bump 205 is formed on an electrode 203a of the actuator 203. The solder 206 is formed on the wiring substrate 204 side. In order to form a space for the bump 205 and the solder 206 between the wiring substrate 204 and the actuator 203, a photopolymer spacer substrate 207 is disposed between a pressure-chamber substrate 201a, which forms the pressure chamber 201, and the wiring substrate 204.


The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month−initial solution viscosity)/initial solution viscosity), expressed as an absolute value, of not greater than 3.0, and the resin having a moisture absorption (25° C., 90% RH, 24 hours) of not greater than 2.0%; a flexible metal-clad laminates using such a resin; and a flexible printed wiring board prepared from such a flexible metal-clad laminate by circuit formation. The flexible metal-clad laminate of the invention does not curl under any conditions, including humid conditions, and exhibits excellent dimensional stability since the heat resistant resin used as an insulation material has low moisture absorption and low thermal expansion coefficient and there is less internal stress in the flexible metal-clad laminate. Moreover, since the solder heat resistance and the insulation properties are not impaired even after humidification and since the heat resistant resin is soluble in organic solvents with high solution stability, the flexible metal-clad laminate of the invention can be inexpensively produced.

Conventional flexible metal-clad laminates for flexible printed wiring boards comprise a polyimide film and a metal foil bonded by an epoxy resin, acrylic resin or like thermosetting adhesives. Flexible printed wiring boards formed from a flexible metal-clad laminate bonded by such a thermosetting adhesive have the problems that they have a substrate (resin film layer) having an increased thermal expansion coefficient due to the adhesive and therefore have inferior thermal dimensional stability, and that they are inferior in moisture resistance and therefore have impaired insulation properties and solder thermal resistance after humidifying treatment. Moreover, there are other problems that, due to the inferior thermal dimensional stability, the flexible metal-clad laminates or flexible printed wiring boards prepared by forming a circuit using the flexible metal-clad laminate are curled during various heating processes, and due to the inferior moisture resistance, the printed wiring board curls or is distorted during etching and like wet processing, resulting in impaired yields during circuit formation and/or during mounting on the resulting flexible printed wiring boards.
To solve such problems, techniques to form a metal foil directly on an insulating substrate without using an adhesive (i.e., two-layer flexible metal-clad laminates) have been developed. For example, Japanese Unexamined Patent Publication No. 1990-98994 discloses sputtering, Japanese Unexamined Patent Publication No. 1987-181488 discloses vacuum evaporation and Japanese Unexamined Patent Publication No. 1982-18357 discloses ion plating, for the formation of a metal layer (seed layer) over a polyimide film and the subsequent formation of conductive layers is performed by plating. However, all of these methods have problems, such as high production costs, pinhole creation during seed layer formation, and insufficient adhesion between the polyimide film and the conductor.
In an attempt to inexpensively provide high performance flexible printed wiring boards that are not furnished with an adhesive layer, publications such as Japanese Unexamined Patent Publication No. 1982-50670 propose a method for forming a flexible metal-clad laminate wherein a solution of a polyamic acid, i.e., a precursor of a polyimide resin, is directly applied to a metal foil and subjected to dehydration/polyimidization reaction on the metal foil. However, flexible metal-clad laminates obtained by such a method are problematic because their insulation properties after humidification are poor due to the high moisture absorption of the resin, resulting in poor reliability (migration resistance) in applications where high voltage is applied (such as flexible printed wiring boards used at display edges. Furthermore, there are other problems that the solder heat resistance is also decreased after humidification and therefore the application to lead-free soldering (Ag—Sn—Bi-based, Ag—Sn—Cu-based, etc.) is limited, and the printed wiring board curls or is distorted, especially during wet processing or in a highly humid atmosphere, resulting in impaired yields in circuit formation and mounting on flexible printed wiring boards. In addition, after laminate formation (after coating) with the use of the precursor polyamic acid, a heat treatment has to be carried out at high temperatures. Therefore, the use of such a resin for the continuous production of two-layer flexible metal-clad laminates has the problem that productivity is reduced, expensive equipment is necessary, and production costs are increased.
To solve such problems, Japanese Unexamined Patent Publication No. 1993-59174 discloses a resin having excellent heat resistance and small thermal expansion, in which polyamide-imide structures having a trimellitic acid skeleton are randomly copolymerized with polyimide structures, as well as the use of said resin as a base material or a covering material for flexible printed circuit boards. However, there is a problem that once a varnish in which this polyamide-imide resin is dissolved is stored, the viscosity of the solution gradually increases, and in about a month, the solution solidifies and looked like a pudding.
As described above, prior art techniques have not developed flexible metal-clad laminates for producing two-layer-type flexible printed wiring boards, with excellent polyamide-imide resin varnish stability, the flexible printed wiring boards being excellent in dimensional stability and heat resistance, devoid of decrease in solder heat resistance or insulation properties even under humidifying conditions, and free of warpage or distortion in any environment (under humidifying or heating conditions).
An object of the present invention is to solve the problems described above. In particular, an object of the invention is to inexpensively provide a flexible metal-clad laminate for flexible printed wiring boards that are usable even at display edges for which high reliability is required. Specifically, an object of the invention is to inexpensively provide, by directly applying a heat resistant resin solution to a metal foil, a flexible metal-clad laminate for flexible printed wiring boards that have excellent heat resistance, dimensional stability, adhesion, etc., allowing no loss of insulation properties and solder heat resistance and does not curl or dimensionally change, even under humidifying conditions.

Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board


The instant invention contemplates a process for manufacturing jewelry including the steps of: (a) creating a photographic negative from a computer-generated image; (b) exposing the back side of a polyester backed soft photopolymerizable resin sheet to ultra-violet radiation thereby causing photopolymerization to a predetermined depth corresponding the exposure duration; (c) masking the negative over a "soft" photopolymerizable resin; (d) irradiating the unmasked resin with ultraviolet radiation; (e) chemically removing the non-photoset resin from the photopolymer resulting in a positive three-dimensional likeness of the object to be cast; and (f) creating a final negative mold using the positive three-dimensional likeness via a "lost-wax" type process.

1. Field of the Invention
This invention relates to a process and apparatus for inexpensively manufacturing individual items such as pieces of jewelry having a personalized message as part of the jewelry in either prominently embossed or in sharply sunken features. More particularly, this invention relates to a jewelry manufacturing process and apparatus utilizing photopolymerizable resin and "lost wax" type casting to produce multi-dimensional jewelry from computer generated images.
2. Description of the Prior Art
Personalized jewelry bearing the wearer's name or other message are popular products. An example of such a jewelry item may be a high school class ring identifying a social affiliation and the name of the high school mascot. Other such jewelry items could include pendants, charms, name tag bracelets and the like. Although such jewelry items have been available in the past, they have been available with only a limited selection in style, or letter font, and in many cases long names or unusual names were not possible in an attractive form. These limitations on the availability of personalized jewelry are mainly due to the lack of a convenient and inexpensive method of manufacturing such jewelry. The methods of manufacturing personalized jewelry which are presently available have limited flexibility, are labor intensive, and produce results with limited eye appeal.
Among these prior methods were hand and machine engraving. Hand engraving, of course, required a skilled artisan and the results were limited by his or her ability. Although machines are commonly available to engrave letters, these machines frequently included a pantograph arrangement that operated off of preformed letters on a die. Only the simplest letter styles were possible, and the selection of letter designs was extremely limited. The letters frequently had to be spaced and arranged individually by hand on the jewelry item. In addition, in both hand and machine engraved jewelry, only a very shallow message is possible without great expense and the shallow message is not as appealing to the eye or as durable as the personalized jewelry which can be manufactured using the method of my invention.
Die striking is another method of providing personalized messages on jewelry. In this method, the letters are impressed into the jewelry item by striking the jewelry with a hardened steel die to form the letters. This method either requires a specific die to be made for each name or requires the message to be reproduced letter by letter. Because of the expense of making special dies for specific names, this method is reasonably applicable with only common first names. In addition, with this method, only a limited selection of letter styles is available. As with the engraving method only a shallow recessed message is available and the method does not provide the deeply sunken and attractive name or message available with my invention.
Another method used currently is the injection molding of individual letters in plastic which are placed individually by hand in a specific slot in the wax pattern that is used to make the mold for casting the jewelry item by the lost wax process. This method requires the message to be assembled by hand on each individual wax pattern from the letters available and does not permit a collection of patterns for common names to be reused a multiplicity of times, which would reduce the cost of manufacture of subsequent jewelry items. Furthermore, this method requires costly molds for use in injection molding machines to form the individual letters.
Canadian Patent No. 1,102,092 introduces into the investment casting or lost wax process of manufacturing jewelry the manufacture of inserts for a master die or wax pattern with multi-level alphabet messages using the output of a conventional typewriter to photo-etch names, messages and designs.
The Canadian patent discloses preparing a plurality of personal messages to be included on individual pieces of jewelry, photographing the plurality of personal messages and making a photographic negative of the photographic image of the messages, using the photographic negative and a source of radiation to polymerize a photopolymerizable resin carried on a rigid substrate and removing the unpolymerized photopolymerizable resin from the substrate to form the plurality of personalized messages, placing a plurality of insert forming rings about each personalized message, filling the rings with a fluid casting material, curing the fluid casting material within the rings to form a plurality of solid inserts, placing each insert in a master die and injecting the master die with wax to make a wax likeness of the jewelry bearing the personalized message, and using the wax likeness to form the cavity of a mold in which the personalized jewelry is to be cast by the lost wax process. The use of photopolymerizable resin carried on a rigid substrate, however, is problematic since the underlying substrate, which is often comprised of metal, must be cut or machined away, which presents a significant problem when producing certain intricate designs in which, for example, an aperture or void is desired.
U.S. Pat. No. 4,444,607 issued to Lash et al. discloses a process for molding a three dimensional decorative article which includes electronically generating a line drawing of an article and electronically displaying the drawing, photographing the drawing thereby creating a transparency, positioning the transparency over a layer of liquid photopolymer, exposing the photopolymer through the transparency to a burst of radiation to set the unmasked photopolymer, and removing the remaining liquid so as to leave behind a three dimensional article. Using a liquid photopolymer in jewelry manufacturing, however, is not practical due to the unique machinery and manufacturing methods employed in this highly specialized industry.
U.S. Pat. No. 4,889,666, issued to Kawasaki, discloses a method for producing concrete products provided with inlaid patterns whereby a reusable mold with recessed patterns is produced by radiating ultraviolet rays on opposing surfaces of an ultraviolet setting masked resin, and using the resulting three-dimensional form in a "lost-wax" type casting operation. However, this disclosure requires the extra steps of irradiating the photopolymer from both sides to produce a reusable mold, and creating a "waste" mold from the reusable mold.
U.S. Pat. No. 3,659,327, issued to Beverick et al., teaches the manufacture of jewelry which depicts various scenes or figures by creating a negative of an image, placing the negative on a zinc plate by photoengraving, creating an impression in a conventional rubber-based impression material thereby producing a reverse or negative impression of the image, filling the impression with wax to form a likeness of the finished casting, investing the wax likeness into a casting ring filled with high heat plaster, and heating the plaster whereby the wax is burned off leaving a plaster mold into which a gold article may be cast. Beverick, however, requires the additional step of manufacturing a wax mold in lieu of using the initial photoengraved material to create a final mold.
Thus there exists a need for a jewelry manufacturing process whereby a photographic negative is produced from a computer-generated image, the negative is used to mask "soft" photopolymerizable resin which is exposed to ultraviolet radiation thereby producing a positive three-dimensional likeness of the object to be cast, and creating a negative mold using the positive three-dimensional likeness via the "lost-wax" process.

Process for making jewelry utilizing a soft photopolymer


A fuel injector includes a tip member having a further member establishing an interference fit about an outer surface thereof at an injection end to minimize the possibility of fracture or other failure.

Current fuel injectors include a tip member carried in a jacket or case. A barrel is threaded into or otherwise secured to an upper end of the case. A check along with other components are disposed within the case and the check is movable into engagement with a check seat formed on an inside surface of the tip member. In the past, a two-piece tip member was utilized wherein a lower member containing the seat and injection orifices was mounted in an elongate upper member through which the check extended.
Recently, fuel injector designs have been developed wherein improved response times are obtained through the use of a valve which directs high pressure fuel onto the top of the check. The application of the high pressure fuel to the top of the check results in very high check velocities. While these high check velocities enable a quick end of injection, which is beneficial from an emissions standpoint, the momentum built up by the check is in excess of the design limits of the two piece tip member of prior fuel injector designs. That is, if the two piece design were utilized, the lower member could be pushed out of contact with the elongate upper member thereby leading to damage not only to the injector but possibly engine components. Accordingly, a single or integral tip design must be utilized. However, tip failures have occurred, indicating the difficulty of designing a tip member which will withstand simultaneous check impact and the high pressures that are encountered in current fuel injectors.

Apparatus for strengthening a fuel injector tip member


Induction heat-seal liner that allows a visual inspection of the product in the container to be made through the seal, and/or an aroma from the product to be detected through the seal, while the seal remains secured to the container to protect against leakage or contamination. In one embodiment, the liner has an intermediate metal-foil layer having a central opening, and a central liner portion, aligned in a thickness direction with a central opening of a metal-foil layer, comprises one or more materials or spaces that provide visibility into and/or aroma penetration from the open mouth of the container. In another embodiment, a dual heat-seal liner having a dispensing aperture is provided that heat seal bonds to both the cap and container to form a non-removable closure assembly that protects the metal-foil layer from degradation by the product being dispensed.

Seals have been used on containers for many years, to prevent leakage or contamination of the substance within the container and to increase the shelf life of the product. For example, seals are used on containers for cosmetics, foods, drinks, medicines and other items in the form of creams, gels, powders, or liquids. Seals used for this purpose are typically placed over the opening of the container or, in some instances, within the cap on the container.
However, consumers often want to smell items having a fragrance or aroma, such as lotions, creams, body washes, shampoos, deodorants, perfumes, laundry detergents, air fresheners, coffee and spices, before purchasing the items. As a result, many products are sold today without seals because there is no commercially viable seal on the market that allows consumers to smell the scent of the product within the container. Specifically, prior art seals are essentially hermetic seals intended to prevent leakage of the product from the container and to limit air flow into and out of the container to preserve the product and maximize the product's shelf life. In so doing, they trap the scent or aroma of the product within the container.
As a result, scented products are often sold in containers without seals, so that consumers can remove the cap and smell the scent prior to purchase. The fact that many scented products are still sold in containers without seals today is evidence that the prior art seals do not allow adequate scent permeation and prevent leakage in a cost effective manner.
The absence of a seal increases the possibility of spillage during transportation and the chances that a product may be tampered with or tainted prior to sale to the consumer. It is not uncommon for consumers to go beyond simply removing the cap and smelling the item, by actually applying some of the product onto their body to sample the product and its fragrance. In so doing, the consumer may stick their fingers into the substance or on the opening where the substance comes out. Oftentimes, after sampling the product, the consumer closes the cap and returns the container to the shelf in the store.
This sampling of the product causes several problems. From the consumer's perspective, by placing their fingers into the substance and/or coming in contact with the opening where the substance comes out, the sampler may be contaminating the substance and spreading germs/bacteria. Additionally, each time a consumer samples the product and then returns it to the shelf, the volume of the substance within the container decreases. As a result, the consumer that eventually purchases the product is unknowingly purchasing less than a full container of a product that may have been contaminated and/or contain germs/bacteria.
From the retailer's perspective, consumers that sample products and then return them to the shelf sometimes do not place the cap on tightly, which may result in spillage if the container is tilted or falls on its side. Additionally, the shelf life of the substance within the container may be reduced or altered by the absence of a seal on the container or having been opened and exposed to the surrounding environmental conditions by a sampling consumer prior to sale. Also, the absence of a seal on a container may result in the substance contacting and/or accumulating within the cap on the container, which may cause spillage when the cap is removed and a less appealing presentation to the consumer. These situations may result in the retailer being unable to sell the product or generating product returns or charge-backs, which may have an adverse effect on the retailer's, product manufacturer's or distributor's reputation and financial performance. Additionally, the retailer, manufacturer and/or distributor may incur liability if a consumer is harmed by the contaminated product.

Induction heat seal liner and method of manufacture


A semiconductor element module includes a package, a semiconductor element arranged on the package, and a plurality of leads provided on sides of the package so that an opening end of each the lead is oriented to the side of a package attaching plane, and serving to connect the semiconductor element to an external circuit; wherein a level differences is provided on the side of the package attaching plane of each of package sides so that a space is formed from each the plurality of leads.

1. Field of the Invention
The present invention relates to a semiconductor element module and a semiconductor device.
2. Description of the Related Art
An explanation will be given of the case where a semiconductor element is an optical element (light emitting element, light receiving element). FIG. 7A is a side view of a conventional semiconductor element module; FIG. 7B is a side view of FIG. 7A; and FIG. 7C is a front view taken in line A--A' in FIG. 7A.
In these figures, reference numeral 1 denotes an optical element for converting an electric signal into an optical signal and vice versa; 2 an optical fiber for transmitting the optical signal; 3 a mount for adjusting/fixing the optical axes of the optical element 1 and optical fiber 2; 4 a package for hermetically sealing the optical element; 5 one of wires for connecting the optical element 1 and package 4; 6 one of leads, provided on both sides of the package 4 so that an opening end is oriented to the a package attaching plane, for connecting the optical element and external circuit; and 7 one of brazing materials for connecting the package and the leads 6. The wire 5 and leads 6 are electrically connected to each other through the package 4. FIG. 8A is a side view of a semiconductor device in which a conventional semiconductor element module is mounted on a substrate through through-holes formed in a substrate. FIG. 8B is a front view of FIG. 8A. In these figures, reference numeral 8 denotes a substrate on which a semiconductor element module is mounted; 9 a solder for mounting; and 10 one of through-holes made in the substrate 8. FIG. 9A is a side view of a semiconductor device in which a conventional semiconductor element module is mounted on a substrate through conductor patterns formed on a mounting surface of the substrate.
The conventional semiconductor element module and semiconductor device configured as described above has the following problems. When the semiconductor element module is mounted on the substrate 8 through the through-holes 10 made therein, the solder used for mounting (solder material used to solder the leads 6 through the through-holes 10) is molten owing to heating so that a part of the molten solder flows into a slight gap formed between a package bottom and substrate 8 by a capillary phenomemon, thus short-circuiting the leads 6 to each other. Further, when the semiconductor module is mounted on the substrate through the conductor patterns 11 mounted on the mounting surface of the substrate 8, the leads 6 must be shaped at a portion apart from the brazing materials 7 in order to maintain the connecting strength between the package 4 and leads 6. Since the brazing materials 7 are located at a position near the bottom of the package, in order to satisfy the above requirement, the leads 6 will be shaped (outward bending) at a portion thereof apart from the package bottom. This increases the height of the semiconductor device after mounting.

Semiconductor element module and semiconductor device which prevents short circuiting


A controller in a computer communicates with multiple data acquisition nodes over a network connection. The controller plugs into a personal computer device that processes received data and generates commands over a network cable extending from the controller to a first data acquisition node. The first data acquisition node couples, via a network cable, to a second data acquisition node. The second data acquisition node optionally couples to yet other data acquisition nodes, and so on in a daisy-chain fashion. Each data acquisition node includes one or more interfaces to corresponding input/output devices associated with the data acquisition node. Based on the interconnection of the controller and the data acquisition nodes, the controller accesses data collected by the data acquisition nodes from corresponding input devices and additionally controls output devices coupled to the data acquisition nodes.

Many conventional automation control and data acquisition systems include remotely located controllers that receive information from, for example, corresponding remotely located sensor devices that monitor parameters such as temperature, pressure, light intensity, etc. In general, the controller typically collects and processes the acquired data to perform some further action. For example, in the context of a simple application such as a process of bottling soda, a sensor device may be employed at a remote location with respect to the controller to detect when a bottle of soda has been filled to a proper level. To start the filling process, the central controller may activate a dispenser to begin filling the empty bottle. Upon detecting when the bottle becomes filled to a predetermined capacity, the sensor device sends a "full bottle" signal to the central controller. In response to receiving the "full bottle" signal, the central controller sends a "shut-off" command to the dispenser to discontinue filling the bottle so that the soda bottle is not filled beyond capacity.
Conventional data acquisition and control systems may be much more complex than the bottling process as described above. For example, processes associated with semiconductor fabrication are typically quite complex. Such processes normally include i) controlling a complex arrangement of heating and cooling machinery, ii) controlling semiconductor wafer conveyance systems, iii) controlling chemical vapor deposition system hardware (e.g., valves, gas and pressure measurement devices, thermocouples, and the like), iv) controlling wafer handling machines, etc. Each element (i.e., each temperature sensing device, valve, mechanical manipulator, pressure sensor, thermocouple, etc.) in the semiconductor fabrication system typically includes an attached sensing and/or control device capable of reading and writing data (e.g., analog and/or digital control signals) to and from the element. A central controller precisely controls the operation of various elements in the system to allow the elements to work together in a prescribed manner to support fabrication of semiconductor devices.
In certain conventional data acquisition systems such as those discussed above as well as many other applications, the sensor and control devices are remotely located with respect to a central controller. The central controller typically communicates with the sensor and control devices via a network link such as that provided by a wire or wireless network. For example, the central controller typically exchanges data with the sensing and control devices using a standardized network protocol such as the Transmission Control Protocol (TCP) and Internet Protocol (IP) or TCP/IP. TCP/IP provides a reliable mechanism to exchange packets of data between the processing unit and control devices without having to worry about loss of data packets or networking transmission errors.

Methods and apparatus to support acquisition of data


An image-printing device includes a connection bay that accepts an insertable consumable resource. The consumable resource includes an option key that identifies at least one mode of operation associated with the consumable resource. The connection bay outputs at least one signal associated with the mode of operation when the consumable resource is inserted. A controller receives the signal associated with the mode of operation and in response outputs display information suitable for use by a display to indicate a selectable availability of the at least one mode of operation.

Image-forming systems, such as printers and copiers, typically form images by depositing ink or toner upon a print medium, such as paper. Many systems offer a multitude of printing techniques or modes of operation from which the user must choose to form the image. Faced with such a large number of choices, an uninformed user may select an image forming mode that is not optimum for the user's printing objectives or those objectives of a vendor supplying the system to the user.

This patent is subject to a terminal disclaimer.

Hewlett-Packard Development Company, L.P.


An image forming device includes a charging power supply used in applying, to a charging unit, a charging voltage for the purpose of electrostatic latent image formation and a charging bias voltage during a cleaning operation; a developing power supply that is capable of outputting a developing bias voltage of positive polarity and negative polarity to a developing unit; a constant-voltage generating-holding unit that is used in generating and holding a constant potential difference between the charging unit and the developing unit; a developing power control unit that performs output control of a developing bias voltage with respect to the developing unit; and a charging power control unit that, when the developing power control unit performs control to output a developing bias voltage of reverse polarity to the charging unit, performs output control of the charging bias voltage of a predetermined level with respect to the charging power supply.

1. Field of the Invention
The present invention relates to an image forming device, a bias voltage control method for the image forming device, and a computer program product.
2. Description of the Related Art
In an image forming device, with the aim of achieving reduction in the cost of a high-voltage power supply board, a technology is known in which an imaging sequence and an output constraint are set and a common transformer is used for charging and developing purposes; or a technology is known in which a constant-voltage element is configured in between outputs, and the output bias potential difference is maintained at a constant level so as to reduce the terminals of a high-voltage output unit.
For example, in Japanese Patent Application Laid-open No. 2012-53350, a technology is disclosed in which, with the aim of achieving reduction in the cost of a high-voltage power supply, a common transformer is used for a charging grid and a developing output. Moreover, a technology is disclosed in which constant-voltage elements are connected in between a regulation output and a developing output of a developing device, and the potential; difference between those outputs is maintained at a constant level. With that, in a high-voltage output unit, it becomes possible to use the same terminal for the regulation output and the developing output without making the circuitry complex (for example, see Japanese Patent No. 3507571).
However, in the conventional technologies mentioned above, in the case in which developing of reverse polarity to the polarity of charging is to be output for the purpose of cleaning a photosensitive member, it is not possible to obtain the desired potential difference between the constant-voltage elements. Hence, it is not possible to perform photosensitive member cleaning in a stable manner.
In view of the issues mentioned above, there is a need to enable cleaning of a photosensitive member in a stable manner without making the circuitry complex.

Image forming device, bias voltage control method for image forming device, and computer program product


A water filtration technique is designed to maximize the efficient performance of a variety of granular filtration media. The technique maintains the granular filtration media in a compacted state between a perforated outer media container and a perforated inner media container, where the perforated inner media container is a smaller similitude of the perforated outer media container. In the preferred embodiment of the filtration device of the present invention, the perforated outer and inner media containers are substantially spherical. By maintaining the granular filtration media in a static-state throughout filtration, highly efficient filtration is achieved. In contrast, during the backwash function, the normal inward flow is reversed to outward radial flow and granular filtration media is agitated, fluidized and quickly and vigorously cleaned. A plurality of high-velocity centrally-located water jets create the outward radial flow during backwashing.

Many water filtration devices utilize granular water filtration media contained in a pressure vessel through which unfiltered water is treated. As shown in FIGS. 1a, 1b, 2 and 3, such conventional water filtration devices include an exterior pressure vessel in which a water distributor is positioned near the top of the pressure vessel. Water to be filtered is introduced into the vessel through the water distributor. The water to be filtered then flows through granular media resting in the bottom of the pressure vessel. Initially, the granular media presents a generally flat, circular upper surface to the unfiltered water. An underdrain is positioned at the bottom of the pressure vessel to collect the filtered water after it passes through the granular media and suspended and dissolved material in the water collects on the granular media. The water flow during filtration is typically downward, as in shown in FIG. 1a.
It is desirable for such water filtration devices to achieve fast flow rates while maintaining a high capacity for removing contaminants. Flow rates are dependent, in part, on the exterior surface area of the granular media exposed to the flow of unfiltered water and the length of the flow path. The length of the flow path is typically the depth of the granular media, commonly called the bed depth. Unfortunately, both the exterior surface area of the granular media and the flow path length are relatively fixed in conventional filtration devices like that shown in FIG. 1a.
Moreover, the flow path in many conventional water filtration devices is not widely distributed throughout the filter media, but rather quickly forms into one or a few arbitrary flow paths during the filtration process. When arbitrary flow paths form, the filter media adjacent the flow path becomes overused and prematurely exhausted, with the rest of the filter media underused. One such arbitrary flow path is shown in FIG. 3, where the path of least resistance to the water is a shortened path directly under the water distributor to the underdrain.
To compensate for the anticipated inefficient use of only a part of a media bed resulting from formation of arbitrary flow paths, the bed depth and volume is increased. Extra media is thus required, increasing the overall weight of the filtration device undesireably.
Another inherent problem with many conventional water filtration systems is the movement of the granular media during filtration. Most granular media work best if their individual grains are in a static state and are not allowed to move about during the normal filtration processes. In an effort to obtain high through put, however, individual grains of the granular media are often disturbed. Buildup of contaminants on the exterior surface of the media bed can also disturb the individual grains when high flow rates are used, as is shown in FIG. 2 where a channel along the vessel wall is temporarily dug and a mound is temporarily formed on the surface.
Conventional water filtration systems employing granular media typically require some type of media recharging after a period of use because the granular media gradually becomes covered with the waste material and efficiency is reduced. To periodically regenerate the granular media, a backwash cycle is invoked. As is shown in FIG. 1b, the normally downward flow from the distributor to the undedrain is temporarily reversed. In the backwash cycle, water is transmitted through the underdrain, up through the granular media, and out the water distributor, carrying with it the waste materials. During this process, the granular media becomes fluidized.
Naturally, an efficient backwash cyle is desireable. However, with conventional systems, when then backwash rate is speeded up to maximize backwash rates and minimize filter downtime, excessive flow rates can cause the granular media to flow out of the filter out the water distributor. Filter media which is lost must then be replaced. In addition, backwashing of conventional systems often takes an excessive amount of time, typically 5-30 minutes, when water filtration operations must be suspended.
It is against this background that the significant improvements and advancements of the present invention have taken place in the field of granular media water filtration.

Water filtration technique using granular media


A pulse width modulation (PWM) modulator includes an integrator generating an integrated signal based on an input signal and an output signal, a low pass filter (LPF) receiving the integrated signal and performing low pass filtering, a comparator receiving an output signal of the LPF and a predetermined reference signal, comparing the received signals, and outputting a PWM signal, a dead time setup block outputting a first signal and a second signal having a predetermined phase difference therebetween based on the PWM signal, and a power stage buffering the first and second signals and generating the output signal based on a result of buffering. In the PWM modulator and a class-D amplifier having the PWM modulator, EMI can be reduced.

1. Technical Field
The present disclosure relates to a pulse width modulation (PWM) modulator and a class-D amplifier having the same, and more particularly, to a pulse width modulation (PWM) modulator that can reduce electromagnetic interference (EMI), and a class-D amplifier having the same.
2. Discussion of the Related Art
Typically, amplifiers are classified into analog amplifiers and digital amplifiers. The analog amplifiers include class-A amplifiers, class-B amplifiers, and class-AB amplifiers while the digital amplifiers include class-D amplifiers. The efficiency of the analog amplifiers, for example, the class-A amplifier, the class-B amplifier, and the class-AB amplifier, is not good, and the power loss of the analog amplifier is very high. Thus, a lot of heat is generated in the analog amplifier, so that the temperature of the analog amplifier increases.
In the analog amplifier, since a large heat sink or cooling fan is needed to forcibly dissipate the heat generated from the analog amplifier, the size of the analog amplifier is increased. Also, when the temperature of an audio apparatus including the analog amplifier increases, the analog amplifier may be damaged. Furthermore, in the analog amplifier using a vacuum tube or a transistor, distortion of the signal may be unavoidable and is caused by thermal noise due to thermal motion of electrons and the instable linearity of an amplification device, for example, a vacuum tube or a transistor.
In contrast, the class-D amplifier has a high efficiency and is small and light, thus providing portability. Also, since the power consumed that results in heat in the class-D amplifier itself is small, the class-D amplifier is widely used.
FIG. 1 is a functional block diagram of a general class-D amplifier. Referring to FIG. 1, a class-D amplifier 5 includes an input gain stage 10, a PWM modulator 20, and two power stages 30 and 40.
An audio signal input to the input gain stage 10 is an analog signal and may be an input signal of an audio apparatus that is commonly used. The input gain stage 10 receives and amplifies the analog signal. The PWM modulator 20 includes a circuit (not shown) in the form of a comparator, and compares the input analog signal with a predetermined reference and generates a PWM signal according to the result of comparison.
For example, when the level of the input analog signal is greater than that of the reference, the PWM modulator 20 outputs a high level or "1". When the level of the input analog signal is less than that of the reference, the PWM modulator 20 outputs a low level or "0". That is, the PWM modulator 20 generates a PWM signal based on the input analog signal and the reference.
Each of the power stages 30 and 40 receives the PWM signal output from the PWM modulator 20, buffers, and outputs the buffered signal to an inductive load, for example, a speaker. The class-D amplifier 5 is a full bridge type amplifier having the two power stages 30 and 40. The full bridge type amplifier 5 may generate a large output power. Meanwhile, a class-D amplifier using one only power stage is a half bridge type amplifier.
FIG. 2 is a block diagram of a conventional PWM modulator having a ramp generator. As shown in FIG. 2, in a PWM modulator 20 having a ramp generator 23, which is disclosed in U.S. Pat. No. 6,262,632, comparators 40 and 42 respectively receive ramp signals 36 and 38 generated from the ramp generator 23 and output signals of integrators 24 and 26 and respectively generate PWM signals based on the integrated signals and the respective ramp signals 36 and 38.
Since the PWM modulator 20 requires the ramp generator 23 shown in FIG. 2, the structure of the PWM modulator 20 is complicated and difficult to realize. Also, since switching noise of each of the output bridges 28 and 30 can be included in the output signals of the integrators 24 and 26, distortion may be generated in the output signals of the integrators 24 and 26.
FIG. 3 is a block diagram showing a conventional self-oscillation PWM modulator. As shown in FIG. 3, the self-oscillation PWM modulator, which is disclosed in U.S. Pat. No. 6,362,702, does not include the ramp generator unlike the PWM modulator shown in FIG. 2, although it uses two integrators 11 and 12. Since the switching noise at an output terminal 6 of the self-oscillation PWM modulator can be introduced to the integrator 12, an output signal Vb of the integrator 12 can be distorted.
FIG. 4 is a circuit diagram of a conventional power stage of the class-D amplifier. Referring to FIGS. 1 and 4, the power stage 30 of FIG. 4 is a half-bridge type constituting anyone of the power stages 30 and 40 of FIG. 1.
The power stage 30 receives a PMOS input signal PMOS_IN and an NMOS input signal NMOS_IN generated in response to a signal output from the PWM modulator 20. Since a plurality of transistors 31-37 are operated in response to the received input signals PMOS_IN and NMOS_IN, the power stage 30 outputs a high power output signal to a speaker. The conventional power stage 30 includes a power source 39, a plurality of inverters IN1 and IN2, a pull-up transistor 36, and a pull-down transistor 37.
The power stage 30 obtains a high output power by increasing the output current per unit time using the pull-up transistor 36 and the pull-down transistor 37, which have a high ratio of length to width of a channel, hereinafter referred to as the "W/L". Due to this rapid change in the output current, EMI is considerably increased in the power stage 30.
Also, since the switching peak voltage caused by the switching operation of the power stage 30 is high, the power stage 30 generates a lot of harmonic components. The harmonic wave components cause EMI in a surrounding circuit, so that a malfunction of the surrounding circuit may occur.

PWM modulator and class-D amplifier having the same


Method and structures for making a highly reliable metal interlock structure with continuous via and line structures. The absence of barrier layers between vias and lines or absence of interlevel dielectric layer is used to enhance chip performance.

The present invention relates to a structure and a process for plating vias and lines and is particularly concerned with significantly reducing, if not entirely eliminating, void formation in the plating in the vias and lines. The present invention finds particular applicability in filling undercut features in interconnect and packaging structures.
AlCu and its related alloy are currently the predominately used conductors for forming interconnection from electronic devices such as integrated circuits. The amount of Cu in AlCu is typically in the range from about 0.3 to 4%.
Replacement of AlCu by Cu and Cu alloys as a chip interconnection material results in advantages of improved chip performance. Performances improved because the resistivity of Cu in certain copper alloys is less than the resistivity of AlCu. Besides performance, high chip yield count and higher circuit wiring density are also realized.
The advantages of copper metallization has been recognized by the entire semiconductor industry Copper metallization has been the subject of extensive research documented by two entire issues of the Materials Research Society (MRS) Bulletin when dedicated to academic research on this subject is MRS Bulletin, Vol. XVIII, No. 6 (June 1993) and the other dedicated to industrial research in MRS Bulletin, Vol. XIX, No. 8 (August 1994). A 1993 paper by Luther et al., Planar Copper-Polyamide Back End of the Line Interconnection for ULSI Devices, in Proc IEEE VLSI Multi-Level Interconnections Conference, Santa Clara, Calif., Jun. 8-9, 1993, page 15, describes the fabrication of copper chip interconnections with four levels of metallization.
Processes such as chemical vapor deposition (CVD) and electroless plating are popular methods for depositing copper. Both methods of deposition normally produce at best conformal deposits and inevitably lead to defects (voids or seams) in wiring especially when trenches have a cross section narrower at the top then at the bottom. Other problems of CVD have been described by Li et al., copper-based metallization in ULSI structuresxe2x80x94Part II; Is Cu Ahead of its Time as an On-Chip Material?, MRSBULL., XIX, Vol. 15 (1994). In electroless plating, while offering the advantage of low cost, the evolution of hydrogen during metal deposition tends to lead to blistering and other defects that are viewed as weaknesses for industry-wide implementation.
Although, continuing work is being done to provide coating processes for fabricating low cost, highly reliable copper interconnect structures for wiring an integrated circuit chips with void-free seamless conductors of sub-micron dimensions, room for improvements still exists especially for filling vias that have an undercut feature.
The use of an undercut feature which may not be desirable; however, is desirable since it provides for a metal lock-in structure.
The present invention relates to a process for filling or plating vias and especially relates to significantly reducing, if not entirely eliminating, void formation in the filling in the vias. The present invention makes it possible to fabricate a low cost, highly reliable copper interconnect structure for wiring in integrated circuit chips with void-free seamless conductors of sub-micron dimension even in vias that include an undercut feature.
More particularly, the present invention includes providing a substrate having interconnect structures therein into which the conductor will be deposited to ultimately form lines or conductive vias. A electrically conductive seed layer or plating base layer is deposited in the vias. The electrically conductive interconnect in the vias is provided by electroplating from a bath containing an aliphatic amine alkoxylate surface active agent. The aliphatic amine alkoxylate is present in an amount sufficient to reduce void formation. The resulting structure can then be planarized or polished by chemical-mechanical polishing to thereby form individual lines and/or electrically conductive vias, electrically insulated from each other.
According to a further aspect of the present invention, an interconnect structure is provided on an electronic device by providing a substrate having interconnect structures therein, forming a conductive layer serving as a seed layer or plating base in the interconnect features, forming a patterned resist layer on the plating base, depositing the electrically conductor material by electroplating from a bath containing an aliphatic amine alkoxylate surface active agent in an amount sufficient to reduce void formation, and then removing the patterned photoresist. The bath also typically includes brightness and leveling agents.

Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies

International Business Machines Corporation


Systems and methods for automated makeup application allow a user to select and apply desired makeup styles to the user's face. The systems and methods include a computer application with a graphical user interface which allows selection of a look from a plurality of preconfigured looks. A camera coupled with a robotic arm records a face map and color coding and sends that data to be stored on a virtual server database. The application calculates formula quantity and a pump extracts desired formula amounts from appropriate formula cartridges which it releases into reservoirs on the robotic arm's head. An airbrush compressor mixes the formula and plug triggers release one of several airbrush nozzles to start spraying the user's face with formula. A cleaning mechanism is provided between makeup applications and after the final application.

Applying makeup can be very time consuming, often taking several hours a week. It may also be unhygienic since makeup and brushes are often not cleaned properly after each use, which can lead to acne and infections. Makeup can also be very expensive as a user may purchase multiple products from many different makeup brands, colors and styles to achieve a desired look. Whether a user is applying makeup to oneself or is getting a makeover in a salon, poor color matching often results from the lack of available foundation shades. Despite the identification of over 100 skin colors, most makeup companies only offer less than 40 foundation shades, and even fewer options for women of color. Therefore, imperfect or off-color foundation is a frequent occurrence, and unintentionally discriminates against women of color.
Traditional makeup application methods, products, and implements are relied upon by a cosmetics industry worth many billions of dollars in sales every year. However, there is still a demand for new products and methods to help consumers save time and money and improve their hygiene when applying makeup.


Methods and systems for operating a driveline that includes one or more electric machine providing torque to one or more axles are described. In one example, a requested vehicle speed is adjusted responsive to at least one of vehicle yaw, vehicle roll, and vehicle pitch so that vehicle speed may be maintained at a requested value.

A vehicle may be driven off-road from time to time for customer enjoyment or to perform a task or function. Rock crawling is one such off-road activity where a vehicle is driven over small and large rocks to scale a hill or to descend into a valley. The vehicle's speed may be difficult to command and control while the vehicle is traveling over rocks because the vehicle may pitch and roll as the vehicle's wheels travel over the rocks. In addition, it may not be desirable to reduce vehicle speed to zero during some conditions when driving over rocks because it may be difficult to maintain the vehicle's position when vehicle speed is reduced to zero. Consequently, it may be desirable to maintain at least a slow vehicle speed when a vehicle is crawling over rocks. However, because the rocks may be of various sizes and oriented in various ways, it may be difficult to maintain a requested vehicle speed while crawling over the rocks. As a result, it may require significant effort by a driver of the vehicle to successfully negotiate the rocks that are in the vehicle's path of travel.
The inventors herein have recognized the above-mentioned issues and have developed a driveline operating method, comprising: operating a vehicle at a requested speed in a speed control mode via a controller; and adjusting the requested speed via the controller according to a value of vehicle pitch.
By adjusting a requested speed of a vehicle according to a value vehicle pitch, it may be possible to provide the technical result of improving vehicle speed control when a vehicle is traveling over rocks or roads that have high gradients. In one example, a vehicle speed command is reduced when gravity acting on the vehicle in the vehicle's present orientation tends to increase vehicle speed in a forward direction of vehicle travel. The vehicle speed command may be increased when gravity acting on the vehicle in the vehicle's present orientation tends to decrease vehicle speed. The adjustment to the requested vehicle speed may help to maintain vehicle speed at a speed that is requested by a human driver of the vehicle.
The present description may provide several advantages. In particular, the approach may improve vehicle speed control. Further, the approach may improve a vehicle's ability to negotiate difficult terrain. In addition, other aspects of the approach may improve the vehicle's ability to exit stuck conditions when negotiating rocks or other driving surfaces that may cause the vehicle to get stuck.
It should be understood that the summary above is provided to introduce in simplified form a selection of concepts that are further described in the detailed description. It is not meant to identify key or essential features of the claimed subject matter, the scope of which is defined uniquely by the claims that follow the detailed description. Furthermore, the claimed subject matter is not limited to implementations that solve any disadvantages noted above or in any part of this disclosure.

Methods and system for operating a vehicle