In a hydrogen generator comprising a reforming unit having a material supply unit and a water supply unit, and a burner for heating the reforming unit, having a fuel supply unit and an air supply unit, a control unit is arranged for controlling the amount of air to be supplied from the air supply unit to the burner, based on the temperature of the reforming unit and the amount of a raw material supplied to the reforming unit, in order to make the combustion state of the burner stable so as to improves the operation and convenience thereof.

A method for activating a conventional hydrogen generator used for supplying hydrogen to a fuel cell will be described, referring to FIG. 8. FIG. 8 is a schematic view showing a configuration of the conventional hydrogen generator.
The hydrogen generator shown in FIG. 8 comprises a material supply unit 1 and a water supply unit 2, each being connected to a reforming unit 3 filled with a reforming catalyst. A raw material supplied from the material supply unit 1 is reformed in the reforming unit 3; the resultant reformed gas flows into a shifting unit 4 filled with a shifting catalyst to be shifted; and the resultant shifted gas flows out of the shifting unit 4 and into a purifying unit 5 filled with a CO removing (purifying) catalyst to be purified The resultant purified gas flows out of the purifying unit 5 and, as a generated gas, passes along through a three-way valve 6 to be supplied to a fuel cell 7, or, in some cases, is led to a burner 8 arranged in the vicinity of the reforming unit 3. The hydrogen generator shown in FIG. 8 comprises the reforming unit 3, the shifting unit 4 and the purifying unit 5, but in some cases, the hydrogen generator may comprise only the reforming unit, or may comprise only the reforming unit 3 and the shifting unit 4. The burner 8 comprises a combustion chamber 8′, and a fuel supply unit 9 and an air supply unit 10 for supplying air for combustion are further arranged. A combustion gas that generates in the burner 8 is discharged from out of an outlet 11 arranged on the reforming unit 3.
At the time of start-up of the hydrogen generator having the configuration as thus described, the generated gas left in the purifying unit 5 and air for combustion from the air supply unit 10 are supplied to the burner 8, and, while an igniting operation is being conducted with an ignition device (not shown), a fuel is supplied from the fuel supply unit 9 to the burner 8, to form a fire. After confirming that the fire is in a stable state, the raw material is supplied from the material supply unit 1 to the reforming unit 3 and passes along through the reforming unit 3, the shifting unit 4 and the purifying unit 5 to give a generated gas, which combusts with the fuel supplied from the fuel supply unit 9 in the burner 8, to heat the reforming unit 3.
Subsequently, the amount of the fuel supplied from the fuel supply unit 9 was gradually reduced and the supply was eventually discontinued, making the generated gas, obtained from the raw material supplied from the material supply unit 1, singly form the fire, which increases temperatures of the reforming unit 3, the shifting unit 4 and the purifying unit 5 to become the optimum temperature conditions thereof, so that the hydrogen generator is activated.
At that time, the amount of air supplied from the air supply unit 10 is adjusted corresponding to the amount of the raw material supplied from the material supply unit 1. In this case, however, because the amount of air corresponds only with the amount of the raw material and thus does not sufficiently correspond with the amount of the combustible gas in the generated gas which actually combusts in the burner 8, the air becomes excess or deficient, which may cause deterioration of characteristic of a combustion exhaust gas and an unstable state of combustion.
The composition of the generated gas and the flow rate of each constituent thereof are determined by the states of the reactions of the catalysts contained in the reaction units such as the reforming unit 3, the shifting unit 4 and the purifying unit 5, which are, for example, the temperatures of the catalysts. In a case where methane is used as the raw material gas, for example, reforming reactions in the reforming unit are primarily represented by the formula (1) and the formula (2) below:CH4+2H2O→4H2+CO2  (1)CH4+H2O→3H2+CO  (2)
When a temperature of the reforming catalyst is too low to induce the reforming reaction, the generated gas supplied from the hydrogen generator to the burner 8 is methane which was supplied as the raw material. If the temperature of the reforming catalyst rises to the extent that the reforming reaction sufficiently occurs, however, the reformed gas sent out of the reforming unit 3 are mainly hydrogen and carbon dioxide or carbon monoxide, according to the formula (1) and the formula (2) above, and the total flow rate of the reformed gas is four to five times as high as the flow rate of the supplied methane. Until the temperature of the reforming catalyst rises sufficiently, the composition of the generated gas and the flow rate of each constituent thereof have intermediate values, and with occurrence of subsequent reactions in the shifting unit 4 and the purifying unit 5, the composition of the generated gas and the flow rate of each constituent thereof further change depending on the temperatures of these reaction units.
As thus described, changes in the composition of the generated gas and the like depending on the temperature of each reaction unit brings a change in the amount of the combustible gas in the generated gas. This has raised a problem that adjustment of the amount of air by corresponding to the amount of the supplied raw material causes excess or deficiency of air, making it difficult to consistently maintain a favorable state of combustion in the burner 8. Particularly in a case where the temperature of the reforming catalyst is around 400° C., a reaction rate goes up by several tens of percent per a temperature rise of 10° C., leading to a sudden increase in the flow rate of the gas sent out of the reforming unit 3, which pushes a large amount of the combustible gas present in the shifting unit 4 and the purifying unit 5 into the burner 8. Determination of the amount of air by corresponding to the amount of the supplied raw material may, therefore, cause a shortage of air to a considerable degree, making the fire in the burner 8 prone to be unstable and possibly leading to extinguishment.
It is an object of the present invention, then, to solve the above problems and provide a hydrogen generator, where a generated gas therefrom stably combusts in a burner and which is thereby excellent in operation and high in convenience.
Next, a conventional fuel cell system using the above-mentioned hydrogen generator and a fuel cell will be described: FIG. 9 is a schematic view showing a configuration of the conventional fuel cell system. In a fuel cell 101 in the fuel cell system shown in FIG. 9, an air electrode 102 and a fuel electrode 103 are arranged with a polymer electrolyte membrane 104 interposed therebetween, and the upstream side of the air electrode 102 is connected to a blower (an air supply unit) 105 for supplying air.
A hydrogen generator 106 is provided with a raw material X such as natural gas or methanol and water Y required for a steam reforming reaction, and generates a hydrogen-rich generated gas (a reformed gas) G. It is to be noted that the hydrogen generator 106 in FIG. 9 comprises only a reforming unit.
The generated gas G is supplied to the fuel electrode 103 in the fuel cell 101 via a switching valve 107 and flows through a predetermined flow path, which is in contact with the fuel electrode 103, toward the downstream side. At that time, just the required amount of hydrogen in the generated gas G is consumed due to an electrode reaction and the remaining, unreacted gas in the fuel cell 101 flows through a gas flow path 123′ to be supplied to the burner 109 as an off-gas G′. When the generated gas G is not supplied to the fuel electrode 103, the gas passes through the switching valve 107 and flows through a gas flow path 123 to be supplied to the burner 109.
The generated gas G or the off-gas G′, supplied to the burner 109, combusts after being mixed with air supplied from a fan (an air supply unit) 110, and forms a fire 111 in a combustion chamber 108, to heat the hydrogen generator 106 with a combustion gas.
A state of the fire 111 in the combustion chamber 108 is detected by an ion-current which flows when a predetermined voltage is applied to the fire 111. A fire detecting unit 112 is constituted of a heat-resistant conductor 113 arranged such that it comes in contact with the fire 111, a direct current power source 114 for applying a predetermined voltage to the conductor 113 and to the burner 109 via the fire 111, an electric resistance 115 for converting a current flowing in the fire 111 into a voltage and a voltage detecting unit 116 for detecting a voltage across the electric resistance 115. This fire detecting unit 112 can detect a combustion state of the fire 111 such as ignition or extinguishment.
In such a conventional fuel cell system, concentrations of hydrocarbon in the generated gas G and the off-gas G′ are significantly low since hydrocarbon in the raw material X has been converted into hydrogen due to a steam reforming reaction. The low concentration of hydrocarbon lowers a concentration of ions in the fire 111, which also decreases the value of the current flowing in the fire 111 and thereby lowers the voltage across the electric resistance 115. That is to say, a voltage to be detected by the fire detecting unit 112 is lowered, raising the problem of difficulty in determining the combustion state at the time of ignition and fire extinguishment.
It is an object of the present invention, accordingly, to solve the above problem and provide a hydrogen generator which ensures determination of ignition and fire extinguishment of a burner for heating the hydrogen generator and can be safely operated, and a fuel cell system comprising the above-mentioned hydrogen generator.

Matsushita Electric Industrial Co., Ltd.


Rebond polyurethane foams can be prepared by coating shredded polyurethane foam with a prepolymer binder formulation which includes toluene diisocyanate distillation bottoms, compressing the binder coated foam, and the curing the binder with steam. The toluene diisocyanate distillation bottoms can be used in place of more expensive prepolymer formulation components such as toluene diisocyanate or methylene diphenyldiisocyanate. The toluene diisocyanate distillation bottoms can also improve elongation and tear resistance properties of the resultant rebond foams prepared therewith.

The present invention relates to compositions of rebond foam. The present invention particularly relates to flexible polyurethane rebond foam compositions.
Polymer foams, particularly flexible polymer foams, can be fabricated into objects having useful shapes. For example, flexible foams can be molded or machined into shapes useful for preparing automobile seats, bedding, and the like. Flexible foams can be used in carpet and furniture production as well as in the manufacture of toys and the like.
However, in processes for preparing shaped polymer foams, waste foam can be produced. The waste foam can be from the fabricating process and represent the area/volume of the foam removed from the starting block stock to form the shaped foam object. Or, the waste foam can be just the off-specification products which are occasionally produced in some fabricating processes.
Whatever its source, waste foam production is usually undesirable. The waste foam can represent materials which must be discarded and not sold. In some areas, landfill space has become scarce and the cost of disposing of waste foam has become very high.
There have been efforts to re-use waste foam production, particularly waste and scrap from the production of flexible foams. Flexible polyurethane foam scrap can be chopped and then coated with a binder consisting of a polyisocyanate prepolymer having isocyanate functionality, and a catalyst. The coated, chopped foam is compressed and then treated with steam to cure the binder to form a rebond foam sheet or other shape.
In another process for using flexible polyurethane foam waste, the flexible foam waste is cryogenically ground and blended back into the formulation used to prepare it. The ground flexible foam can be used at a level of about 20 percent within the polyol component of the polyurethane foam formulation.
However, preparing materials including waste foam is not always trouble free. The resultant materials may have inferior physical properties. Or the materials so produced can have imperfect finishes which will not permit its use in external and visible applications.

Flexible polyurethane rebond foam having improved tear resistance and method for the preparation thereof


A pivoting device such as a MEMS mirror provides improved coupling between a permanent magnet on the device and an adjacent electrical coil that may provide a drive force or position sensing. The improved coupling is obtained by forming a cavity in the coil structure. The cavity receives the permanent magnet such that the spacing between the magnet and the electrical windings or coil is at a minimum.

Torsional hinged mirrors are now being used as scanning mirrors in laser printers to provide a beam sweep or scan of the image of a modulated light source across a photoresist medium, and as pointing mirrors for redirecting a light beam to one or more specific locations. Devices supported by torsional hinges, other than mirrors may also benefit from this invention. Torsional hinged devices that use silicon for the hinges provide excellent performance at a very advantageous cost and with a very long life, since material fatigue is almost non-existent in torsional hinge devices made of silicon. Magnetic coupling between a permanent magnet on a torsional hinged structure and an electrical coil positioned close to the permanent magnet may be used to provide a drive force to pivot or oscillate the device, or the electrical coil may generate an output signal as the magnet moves with respect to the coil. The output signal will be indicative of the rotational position of the torsional hinged device.
However, as will be appreciated by those skilled in the art, the drive force resulting from electrical signals applied to the electrical coil, or the sensed electrical signals generated as the permanent magnet moves with respect to the electrical coil diminishes as a function of the square of the distance between the magnet and the electrical coil.
Therefore, methods and structures that reduce this distance without a corresponding decrease in structural strength or an increase in complexity or cost would be advantageous.

Torsional hinged device with improved coupling between a magnet mounted to said device and an electrical coil


A clutch mechanism includes first and second shafts having a drive system disposed therebetween, wherein the first shaft is coupled to a drive mechanism. A fixed clutch plate is disposed on the second shaft and includes a plurality of ramped members disposed thereon. An attachment shaft includes a slip clutch plate disposed on a first end and having a plurality of ramped members adapted to releasably couple with the plurality of ramped members disposed on the fixed clutch plate. The slip clutch plate is operable between engaged and disengaged positions relative to the fixed clutch plate and a biasing mechanism is disposed on the attachment shaft and configured to bias the slip clutch plate towards the engaged position. The biasing mechanism is further configured to be overcome when a torque force of a predetermined load is realized on the attachment shaft.

A typical household juicing device generally requires pre-processing of the food prior to introduction into the juicer to reduce the size and shape of the food to be juiced. These juicing devices generally do not lend themselves to processing whole or uncut foods (such as a kiwi fruit) due to the smaller mouth feed chutes and a lack of torque to handle tougher foods. Additionally, existing household juicing devices often come with multiple juicing baskets that require manual interchanging in order to provide for a selected pulp size. Lastly, food overloading of these juicers, due to too much pulp or fibrous material, can cause internal rotating assembly mechanisms (such as wiper arms and crushing heads or augers) to seize, or housing parts (such as lids) to come off or become damaged, causing leakage due to the high juicing pressure.
Therefore, there is a need in the small appliance art for an efficient and compact high performance adjustable juicer configured to process small whole foods (such as, but not limited to, kiwi or small apple) without the need to pre-cut them into smaller chunks, while reducing or preventing an overload condition on the drive motor.

High performance adjustable juicer with whole foods feed chute and clutch mechanism


A transactional shared memory system has a plurality of discrete application nodes; a plurality of discrete memory nodes; a network interconnecting the application nodes and the memory nodes, and a controller for directing transactions in a distributed system utilizing the shared memory. The memory nodes collectively provide an address space of shared memory that is provided to the application nodes via the network. The controller has instructions to transfer a batched transaction instruction set from an application node to at least one memory node. This instruction set includes one or more write, compare and read instruction subsets, and/or combinations thereof. At least one subset has a valid non null memory node identifier and memory address range. The memory node identifier may be indicated by the memory address range. The controller controls the memory node responsive to receipt of the batched transaction instruction set, to safeguard the associated memory address range during execution of the transaction instruction set. The batched transaction instruction set is collectively executed atomically. A notification instruction set may also be used to establish a notification, triggered upon a subsequent write event upon at least a portion of a specified address range.

Networked computer systems are becoming increasingly popular as they permit different computers to share information. Very often in a network, some systems and their resources are not as highly utilized as other systems on the network, and so there has been interest in developing distributed applications to better utilize the available resources within a network.
Designing distributed applications such as, for example, memory systems, file systems and lock managers is difficult for a variety of reasons. These, for example, include issues of consistency of the distributed state, the reliability and availability of data in the face of node, link or other component failure, and scalability. A node is generally a device that is connected as part of a computer network. Not to the exclusion of other devices, as used herein a node is generally understood and appreciated to be a computer.
With respect to memory, memory for a computer system is technically any form of electronic, magnetic or optical storage; however it is generally divided up into different categories based in part upon speed and functionality. One category is mass storage—typically permanent, non-volatile memory stores which are generally understood to be cheap, slow, and large capacity devices such as hard drives, tape drives, optical media and other mass storage devices. The primary object of mass storage devices is to store an application or data until it is required for execution. With low cost and a non-volatile nature, mass storage devices typically provide a computer system with memory stores ranging to the hundreds of gigabytes. These mass storage devices operate with access times generally in excess of one millisecond.
A second general category is application memory and it is intended to permit quick access for processing, and is connected by a memory bus directly to the computer's processor. In contrast to the relatively slow storage memory, the main memory is generally comprised of fast, expensive volatile random access memory (RAM) with access times generally less than one hundred nanoseconds. Due to high cost and the volatile nature requiring continuous power, main memory RAM is typically provided in a size range from a few tens of megabytes to several gigabytes.
With distributed systems, the distinction between mass storage memory and main memory can be, and often is, blurred in the effort to capitalize on unused resources in the network environment. A number of different systems and methods are known and currently implemented in a variety of forms, in efforts to provide distributed systems.
For example, databases systems are well known and widely employed as a means to centralize and coordinate the storage of information. However, databases are not commonly used for applications that would traditionally be executed in main memory as they are slow and access commands are orders of magnitude less efficient. As their primary function is data storage, databases provide broad sets of functions, which in turn impose additional overhead for operation and interaction. As an example case in point, relational databases require data to be stored in tables and then manipulated by relational algebra operators. This is very different from traditional interactions with memory in which the application processing is actually occurring, and as such, database systems are not truly applicable for use as application memory.
Another example is a network file system, which again is primarily oriented towards providing network storage systems. A network file system typically involves a centralized server to control all access transactions between application nodes and the data stored in the file system. With a single point of access, a network file system can and often does succumb to issues of overload and forced latency as the centralized server attempts to respond to more requests than it can manage at any one point. The centralized server is also a single point of failure which, upon failing, renders the entire network file system unusable.
A distributed file system provides better scalability and access control than a network file system, but again is primarily focused upon providing the storage and retrieval of data from mass storage devices for use in application memory. Disk arrays and storage area networks are also increasing in their frequency of use within networks, but again their principle function is as mass storage, not application memory. In addition, there is typically little if any support for simultaneous write operations performed by multiple nodes to the same data.
Shared memory systems provide an abstraction of reading and writing to a location in a shared memory environment, e.g., a shared application memory environment. Specifically, multiple processors utilize a shared memory environment as a way to communicate and maintain synchronization. Typically, such a system is limited to a small set of nodes and enjoys short physical distances between the nodes.
Distributed shared memory systems are yet another example. Typically, in a distributed shared memory system the nodes communicate with messages. The nodes are not differentiated such that a node being used for the processing of an application may also provide memory resources to other nodes in the network. This has the negative impact that if the processor is busy processing an application task, its shared memory access time will slow until the processor becomes free from the application task.
In addition, in a shared memory environment it is often extremely important to control write operations in such a way that other nodes do not inadvertently receive partial data or data believed to be current when in fact it is being rewritten. Methods to impose such control and conditionality are frequently quite complex, thus imposing additional overhead resources and latency issues upon the system.
Hence, there is a need for a networked transactional memory system and method for directing transactions in such a distributed system that overcomes one or more of the drawbacks identified above.

Transactional shared memory system and method of control

Hewlett-Packard Development Company, L.P.


The claimed invention discloses an ESD protection circuit that is applied to an IC with power-down-mode operation. When the IC goes into power-down-mode operation, leakage current and charging from the I/O pad to the VDD power line could be prevented by applying the present invention. Therefore, the malfunction of the IC can be avoided. There still have two ESD clamp circuits respectively connected between the VDD power line and the VSS power line and between ESD bus line and VSS power line, so as to achieve the whole chip ESD protection scheme. The present invention can prevent ESD protection circuit from resulting in leakage current or malfunction under power-down-mode operation, and moreover achieve whole chip ESD protection scheme.

1. Field of the Invention
The present invention relates to an electrostatic discharge protection (ESD) circuit, and more particularly, to an ESD protection circuit applied to an IC with power-down-mode operation.
2. Description of the Prior Art
For power consumption consideration, an IC with power-down-mode operation becomes more and more attractive especially in the SOC (System on a Chip) design for the portable and mobile devices. FIG. 1 shows an example of two chips connected in a system 10, wherein a first chip 12 is biased by the VDD1 power line 14 and a second chip 16 is biased by the VDD2 power line 18. Besides, the output pad 20 of the first chip 12 is connected to the input pad 22 of the second chip 16. When the second chip 16 goes into the power-down-mode operation and the output voltage level of the first chip 12 is high, two situations are explained as follows. First, if VDD2 power line 18 is grounded, large leakage current may be induced from the output pad 20 to the VDD2 power line 18 through the input pad 22 and the parasitic diode 24 of PMOS that is connected between the input pad 22 and VDD2 power line 18. Second, if the VDD2 power line 18 is floating, the high level voltage of the output pad 20 will charge the VDD2 power line 18 through the input pad 22 and the parasitic diode 24 of PMOS, and then the internal circuit 26 of the second chip 16 may be triggered and results in malfunction. Therefore, the parasitic diode 24 of PMOS connected between the input pad and VDD2 power line need to be removed to avoid the problems described above.
To avoid unexpected ESD damage in the integrated circuits, the ESD design is needed for most ICs. FIG. 2 is a scheme showing the traditional ESD protection circuit. According to FIG. 2, when the ESD protection circuit is under the positive-to-VSS ESD mode, the VSS power line 34 is grounded. Then the positive electrostatic charge at the I/O pad 30, 32 can be discharged through the parasitic diode 36 of PMOS, the VDD power line 38 and the power-rail ESD clamp circuit 40 to the VSS power line 34. When the ESD protection circuit is under the positive-to-VDD ESD mode, the VDD power line 38 is grounded and the positive electrostatic charge at the I/O pad 30, 32 can be discharged through the parasitic diode 36 of PMOS to VDD power line 38. In addition, when the ESD protection circuits are under the negative-to-VSS ESD mode, the VSS power line 34 is grounded and then the negative electrostatic charge at the I/O pad 30, 32 can be discharged through the parasitic diode 42 of NMOS to VSS power line 34. Furthermore, when the ESD protection circuits are under the negative-to-VDD ESD mode, the VSS power line 34 is grounded and thus the negative electrostatic charge at the I/O pad 30, 32 can be discharged through the parasitic diode 42 of NMOS, VSS power line 34, and power-rail ESD clamp circuit 40 to the VDD power line 38.
According to the description in the first paragraph, the parasitic diode of PMOS must be removed under the power-down-mode operation. However, if the ESD protection circuit stated in the second paragraph applies to the IC with power-down-mode operation, the electrostatic charge at the I/O pad under positive-to-VSS mode can't be discharged through the parasitic of the PMOS, the VDD power line, and the power-rail ESD clamp circuit to VSS power line. Hence, the positive-to-VSS voltage on the I/O pad is discharged to the VSS power line merely by the snapback breakdown of the GGNMOS (Gate-Grounded NMOS). Due to the junction breakdown voltage is close to the oxide breakdown voltage as the device shrinks, the GGNMOS could not provide efficient ESD protection. At the same time, the non-uniform turn-on issue often lowers the ESD level of the GGNMOS and the positive-to-VDD ESD voltage zapping on the I/O pad cannot be discharged from the I/O pad to VDD power line without causing the PMOS breakdown. Therefore, such positive-to-VDD ESD voltage on the I/O pad will also be discharged through the GGNMOS by snapback breakdown to the VSS line, and then through the power-rail ESD clamp circuit to the grounded VDD power line. For the reasons stated above, the disappearance of the parasitic diode of PMOS may severely degrade the ESD performance.
In order to solve the above problems, someone replaces the parasitic diode of the PMOS with GGNMOS as disclosed in USA patent "ESD protection circuit and method for power-down application" (U.S. Pat. No. 5,229,635). However, the GGNMOS that discharges electrostatic charge with snapback breakdown will turn on irregularly and result in a poor ESD protection effect. Besides, someone teaches the design for improving the ESD robustness of the ESD protection circuit connected between the I/O pad and VSS power line as reported in "Tech. Dig. Of IEDM, 2002, pp. 349–352". According to this design, all electrostatic charge discharges via the ESD protection circuit connected between the I/O pad and the VSS power line. However, this ESD protection circuit is too complicated and the consumption for ESD protection is much higher.


The present invention provides a portable greenhouse structure comprising a base in the shape of a right-polygonal cylinder having a top and a bottom, wherein the base comprises a plurality of wall panels connected along abutting edges; a hemispherical roof attached to the top of the base, wherein the hemispherical roof has a polygonal hole in the apex thereof; and a polygonal panel having the same shape as the polygonal hole, wherein the polygonal panel is moveable between an open position and a closed position, and wherein the polygonal panel sealably covers the polygonal hole when in the closed position. The present invention also provides an apparatus for joining a first panel to a second panel along abutting edges thereof, the apparatus comprising a first extrusion attached to the abutting edge of the first panel, wherein the first extrusion comprises a stem which projects away from a plane of the panel and has a panel side and a mating side; a second extrusion attached to the abutting edge of the second panel, wherein the second extrusion comprises a stem which projects away from a plane of the panel and has a panel side and a mating side; and a clamp which holds the stem of the first extrusion and the stem of the second extrusion together such that the mating side of the first extrusion is in contact with the mating side of the second extrusion.

The present invention relates to greenhouses, and in particular to greenhouses that are portable, structurally efficient, and easy to assemble and disassemble.
Greenhouses enable both commercial growers and serious hobbyists to produce an artificial environment in which plants can grow all year long. Commercial growers and hobbyists alike can use their greenhouses for a variety of purposes, including growing decorative plants such as flowers and shrubs, or growing vegetables for consumption. Most existing greenhouses are permanent structures which vary in size according to their applicationxe2x80x94commercial growers use enormous greenhouses with elaborate heating and humidifying systems, while hobbyists have smaller ones without the elaborate systems, usually in the back yard of their house.
The permanent nature of most greenhouses means that a substantial investment is required to install and operate one. Before installing a greenhouse, an architect and engineer must be hired to design and properly situate the greenhouse to obtain the proper amount of light, the land for the greenhouse must be allocated and prepared, and a contractor must be hired to build the structure. Once built, the costs of operating a traditional greenhouse are high as well. Depending on the climate, substantial heating may be necessary to maintain the proper temperature in the greenhouse. Special and expensive equipment may be necessary to ensure the right humidity inside.
For commercial growers, who derive revenue from the use of their greenhouses, a large investment in a greenhouse is less problematic. But for hobbyists the high investment involved in building a permanent greenhouse can deter all but the most serious and dedicated. Most hobbyists don""t have room in their yards for such a structure, much less the money to pay for the construction and operation of one. Moreover, even if they have the room for a greenhouse, most hobbyists are constrained in the amount of freedom they have to place the greenhouse in its optimal geographic orientation for growing plants. There is therefore a need in the art for an inexpensive, small-scale greenhouse structure that can easily be set up by a hobbyist or other non-professional user.
The present invention provides a portable greenhouse structure comprising a base in the shape of a right-polygonal cylinder having a top and a bottom, wherein the base comprises a plurality of wall panels connected along abutting edges; a hemispherical roof attached to the top of the base, wherein the hemispherical roof has a polygonal hole in the apex thereof; and a polygonal panel having the same shape as the polygonal hole, wherein the polygonal panel is moveable between an open position and a closed position, and wherein the polygonal panel sealably covers the polygonal hole when in the closed position.
The present invention also provides an apparatus for joining a first panel to a second panel along abutting edges thereof, the apparatus comprising a first extrusion attached to the abutting edge of the first panel, wherein the first extrusion comprises a stem which projects away from a plane of the panel and has a panel side and a mating side; a second extrusion attached to the abutting edge of the second panel, wherein the second extrusion comprises a stem which projects away from a plane of the panel and has a panel side and a mating side; and a clamp which holds the stem of the first extrusion and the stem of the second extrusion together such that the mating side of the first extrusion is in contact with the mating side of the second extrusion.

Portable greenhouse structure and method and apparatus for assembling same


A process for automatic detection of the assessable areas within an image of a mechanical component comprises a first phase during which different areas of at least one reference image are detected by means of manual segmentation, a second phase during which marking parameters for the areas of the reference images are defined and fixed, these marking parameters being simplifying transformations and thresholding intervals for the reference images making it possible to obtain optimal quality of separation of the areas, and a fully automatic third phase during which the area-marking parameters defined and fixed during the first two phases are used to mark the assessable areas of new images, and the exact outline of said areas is determined using the watershed line method.

1. Field of the Invention
The invention relates to a process for automatic detection of the assessable areas in an image of a mechanical component, and is applicable in particular to the X-ray inspection of mechanical components.
2. Summary of the Prior Art
The X-ray inspection of a component is generally carried out from several views making it possible to look at different regions of the component. The images obtained for the various views often exhibit several areas. Certain areas are referred to as non-assessable when they are saturated by very bright or very dark gray levels, or when the contrast therein is not sufficient to allow the detection of defects, or when they do not represent the component; the remaining areas are referred to as assessable and are used to search for any possible defects.
The known methods for determining the assessable areas in an image of a mechanical component generally involve marking the different areas of the image and in then determining the exact outline of the areas by using the so-called watershed line method, WSL for short. The problem with these methods is that they are not fully automatic and require an operator to perform the marking of the areas of the image. The determination of the markers is a tricky operation and must be carried out by an operator skilled in image analysis. The manual methods are particularly lengthy and irksome in the frequent cases in which they are applied to the inspection of mass-produced mechanical components and in which the same processing is to be applied to a series of images depicting the same scene together with objects which may be situated at different locations and/or have variable shapes. Furthermore, the absence of any systematic method for performing the marking of the areas may lead to erroneous interpretations of the images and call into question the reliability of the inspection of the components.

Process for automatic detection of the assessable areas in images of mechanical components

Societe Nationale D'Etude et de Construction de Moteurs D'Aviation "Snecma"

Prejean-Lefevre; Veronique Helene Marie Pierre


A semiconductor memory device includes a first nonvolatile memory which has a first external interface and is capable of recording 1-bit data in one memory cell, a second nonvolatile memory which has a test terminal interface and is capable of recording a plurality of data in one memory cell, and a control unit which has a second external interface and is configured to control a physical state of an inside of the second nonvolatile memory.

1. Field of the Invention
The present invention relates to a semiconductor memory device, which is used, for example, in a semiconductor chip on which a NAND type flash memory is mounted.
2. Description of the Related Art
Conventionally, nonvolatile memories, which are called "NAND type flash memories", have been used and marketed (see, for instance, Jpn. Pat. Appln. KOKAI Publication No. 2002-016154 and Jpn. Pat. Appln. KOKAI Publication No. 2004-228323).
NAND type flash memories include a two-Level Cell NAND type flash memory, in which 1-bit data can be recorded in one memory cell. Further, NAND type flash memories include a Multi-Level Cell NAND type flash memory, in which a plurality of data can be recorded in one memory cell. Since the Multi-Level Cell NAND type flash memory can record a plurality of data in an area of one memory cell, it is possible to realize double or more the capacity of the two-Level Cell NAND type flash memory having the same area. Thus, with a recent increase in capacity of flash memories, attention has been paid to the Multi-Level Cell NAND type flash memory from the standpoint of reduction in chip area and cost.
However, the Multi-Level Cell NAND type flash memory, compared to the two-Level Cell NAND type flash memory, has the following restrictions 1 to 3 in use:
1. The data write time and data erase time are longer.
There is the following problem. At present, in the Multi-Level Cell NAND type flash memory, the time for writing data in cells is about three times longer than the time for writing data in cells in the two-Level Cell NAND type flash memory. In addition, at present, in the Multi-Level Cell NAND type flash memory, the time for erasing data in cells is about two times longer than the time for erasing data in cells in the two-Level Cell NAND type flash memory.
2. A higher data error correction performance is required.
The two-Level Cell NAND type flash memory is required to have a performance of correcting a 1-bit data error per 512-byte data. On the other hand, the Multi-Level Cell NAND type flash memory is required to have a performance of correcting 4-bit data errors per 512-byte data.
3. The number of executable rewrite operations decreases.
In the two-Level Cell NAND type flash memory, about 100,000 rewrite operations can be executed. In the Multi-Level Cell NAND type flash memory, about 10,000 rewrite operations are possible.
In the NAND type flash memory, in order to avoid concentration of data write in a given memory cell, a technique for dispersing write operations among cells ("Wear Leveling") has been adopted. However, compared to the two-Level Cell NAND type flash memory, higher-level technology is needed to use the Multi-Level Cell NAND type flash memory. Hence, a greater deal of time and cost is required in developing programs, etc. therefor.
In the case where the NAND type flash memory is used as a memory medium, control means needs to be provided for adding an error correction code (ECC) at the time of data input/output control, data management and data write, and for analyzing/processing the error correction code (ECC) at the time of reading out data. In the ordinary Multi-Level Cell NAND type flash memory, such control means is not mounted in the same package. Thus, the user is required to prepare the control means separately.
On the other hand, since there are the above-described restrictions 1, 2 and 3 in use of the Multi-Level Cell NAND type flash memory, a certain level of technology, which can avoid the restrictions 1, 2 and 3 in use, is needed in order to provide the control means.

Semiconductor memory device including control means and memory system


This invention provides polynucleotide probes, sequences and methods for speciating and phenotyping organisms, for example, using probes based on the Mycobacterium tuberculosis rpoB gene. The groups or species to which an organism belongs may be determined by comparing hybridization patterns of target nucleic acid from the organism to hybridization patterns in a database.

1. Field of the Invention
This invention is directed to polymorphisms in rpoB genes of mycobacteria and use of the same in the identification and characterization of microorganisms.
2. Background of the Invention
Multidrug resistance and human immunodeficiency virus (HIV-1) infections are factors which have had a profound impact on the tuberculosis problem. An increase in the frequency of Mycobacterium tuberculosis strains resistant to one or more anti-mycobacterial agents has been reported, Block, et al., (1994) JAMA 271:665–671. Immunocompromised HIV-1 infected patients not infected with M. tuberculosis are frequently infected with M. avium complex (MAC) or M. avium-M. intracellulare (MAI) complex. These mycobacteria species are often resistant to the drugs used to treat M. tuberculosis. These factors have re-emphasized the importance for the accurate determination of drug sensitivities and mycobacteria species identification.
In HIV-1 infected patients, the correct diagnosis of the mycobacterial disease is essential since treatment of M. tuberculosis infections differs from that called for by other mycobacteria infections, Hoffner, S. E. (1994) Eur. J. Clin. Microbiol. Inf. Dis. 13:937–941. Non-tuberculosis mycobacteria commonly associated with HIV-1 infections include M. kansasii, M. xenopi, M. fortuitum, M. avium and M. intracellulare, Wolinsky, E., (1992) Clin. Infect. Dis. 15:1–12, Shafer, R. W. and Sierra, M. F. 1992 Clin. Infect. Dis. 15:161–162. Additionally, 13% of new cases (HIV-1 infected and non-infected) of M. tuberculosis are resistant to one of the primary anti-tuberculosis drugs (isoniazid [INH], rifampin [RIF], streptomycin [STR], ethambutol [EMB] and pyrazinamide [PZA] and 3.2% are resistant to both RIF and INH, Block, et al., JAMA 271:665–671, (1994). Consequently, mycobacterial species identification and the determination of drug resistance have become central concerns during the diagnosis of mycobacterial diseases.
Methods used to detect, and to identify Mycobacterium species vary considerably. For detection of Mycobacterium tuberculosis, microscopic examination of acid-fast stained smears and cultures are still the methods of choice in most microbiological clinical laboratories. However, culture of clinical samples is hampered by the slow growth of mycobacteria. A mean time of four weeks is required before sufficient growth is obtained to enable detection and possible identification. Recently, two more rapid methods for culture have been developed involving a radiometric, Stager, C. E. et al., (1991) J. Clin. Microbiol. 29:154–157, and a biphasic (broth/agar) system Sewell, et al., (1993) J. Clin. Microbiol. 29:2689–2472. Once grown, cultured mycobacteria can be analyzed by lipid composition, the use of species specific antibodies, species specific DNA or RNA probes and PCR-based sequence analysis of 16S rRNA gene (Schirm, et al. (1995) J. Clin. Microbiol. 33:3221–3224; Kox, et al. (1995) J. Clin. Microbiol. 33:3225–3233) and IS6110 specific repetitive sequence analysis (For a review see, e.g., Small et al., P. M. and van Embden, J. D. A. (1994) Am. Society for Microbiology, pp. 569–582). The analysis of 16S rRNA sequences (RNA and DNA) has been the most informative molecular approach to identify Mycobacteria species (Jonas, et al., J. Clin. Microbiol. 31:2410–2416 (1993)). However, to obtain drug sensitivity information for the same isolate, additional protocols (culture) or alternative gene analysis is necessary.
To determine drug sensitivity information, culture methods are still the protocols of choice. Mycobacteria are judged to be resistant to particular drugs by use of either the standard proportional plate method or minimal inhibitory concentration (MIC) method. However, given the inherent lengthy times required by culture methods, approaches to determine drug sensitivity based on molecular genetics have been recently developed.
Because resistance to RIF in E. coli strains was observed to arise as a result of mutations in the rpoB gene, Telenti, et al., id., identified a 69 base pair (bp) region of the M. tuberculosis rpoB gene as the locus where RIF resistant mutations were focused. Kapur, et al., (1995) Arch. Pathol. Lab. Med. 119:131–138, identified additional novel mutations in the M. tuberculosis rpoB gene which extended this core region to 81 bp. In a detailed review on antimicrobial agent resistance in mycobacteria, Musser (Clin. Microbiol. Rev., 8:496–514 (1995)), summarized all the characterized mutations and their relative frequency of occurrence in this 81 bp region of rpoB. Missense mutations comprise 88% of all known mutations while insertions (3 or 6 bp) and deletions (3, 6 and 9 bp) account for 4% and 8% of the remaining mutations, respectively. Approximately 90% of all RIF resistant tuberculosis isolates have been shown to have mutations in this 81 bp region. The remaining 10% are thought possibly to involve genes other than rpoB.
For the above reasons, it would be desirable to have simpler methods which identify and characterize microorganisms, such as Mycobacteria, both at the phenotypic and genotypic level. This invention fulfills that and related needs.


An apparatus in which an electrostatic latent image is developed with toner. A donor belt is adapted to provide toner to develop the image. The donor belt includes a lower layer and a thermoplastic layer. The lower layer can include materials to regulate conductive properties. The thermoplastic layer joins the ends of the donor belt together using an overlapping butt seam. A layer of electrodes is spaced across the width of the donor belt.

Illustrated herein in embodiments are development apparatuses for ionographic or electrophotographic imaging and printing, and more particularly, endless seamed electrostatic development belts comprised of at least two layers and joined by an overlapping seam. When electrodes are incorporated, the belt can be used to charge and transport toner on the surface thereof and to form a toner cloud in the development zone for the development of a latent electrostatic image.
In this regard, the process of electrophotographic imaging and printing includes charging a photoconductive member to a substantially uniform potential so as to sensitize the surface thereof. The charged portion of the photoconductive surface is exposed to alight image of an original document being reproduced. This records an electrostatic latent image on the photoconductive surface. After the electrostatic latent image is recorded on the photoconductive surface, the latent image is developed by bringing a developer material into contact with the image.
Two-component and single-component developer materials are commonly used in the development process. A typical two-component developer material comprises magnetic carrier granules having toner particles adhering triboelectrically thereto. A single-component developer material typically comprises only toner particles. In either type of material, the toner particles are attracted to the latent image and form a toner powder image in the vicinity of the photoconductive surface. Under the influence of the image field, the toner is developed onto the photoconductor. The toner powder image is subsequently transferred to a substrate such as a copy sheet. The toner powder image is then heated to permanently fuse it to the substrate.
The electrophotographic development process noted above can also be modified to produce color images. One color electrophotographic development/marking process, called image-on-image processing, superimposes toner powder images of different color toners onto the photoreceptor prior to the transfer of the composite toner powder image onto the substrate. While the image-on-image process is beneficial, it has several problems. For example, when recharging the photoreceptor in preparation for creating another color toner powder image it is important to level the voltages between the previously toned and the untoned areas of the photoreceptor. This requires an additional process step that can affect subsequent development steps as well as the print quality of the resultant print.
Single-component development systems typically use a donor member for transporting charged toner to the development nip defined by the donor member and a photoconductive member. The toner is developed on the latent image recorded on the photoconductive member by a combination of mechanical and/or electrical forces.
Scavengeless development and jumping development are two types of single-component development. A scavengeless development system uses a donor member with a plurality of electrodes closely spaced therefrom in the development zone. An AC voltage is applied to the electrodes forming a toner cloud in the development zone. The electrostatic fields generated by the latent image attract toner from the toner cloud to develop the latent image.
In jumping development, an AC voltage is applied to the donor member, detaching toner from the donor member and projecting the toner toward the photoconductive member so that the electrostatic fields generated by the latent image attract the toner to develop the latent image. Single-component development systems offer advantages in low cost and design simplicity, but the achievement of high reliability and simple economic manufacturability continue to present problems.
Additionally, the donor member is frequently in the form of a flexible electrostatic development or donor belt. These belts can be formed by cutting a rectangular, a square, or a parallelogram shape sheet from a web containing at least one layer of thermoplastic polymeric material. Opposite ends of the sheet are then overlapped and joined together by compression and ultrasonic, adhesive, or thermal bonding to form a seam. When compression is combined with thermal bonding, the process for securing the seam is referred to as molding. When compression is combined with an adhesive(s) to secure the seam this process is referred to as adhesive bonding. The seam typically extends from one edge of the belt to the opposite edge.
Generally, these donor belts comprise at least a supporting substrate layer and at least one layer comprising a thermoplastic polymeric material. However, it has been found that, during extensive cycling, the seam area may break down due to fatigue, etc., thereby shortening the service life of the donor belt.
Therefore, there is a need to provide seamed flexible donor belts with an improved seam morphology which can withstand greater dynamic fatigue conditions thereby extending belt service life. Furthermore, there is also a need for donor belts having improved seam designs that are thin in seam profile, resistant to seam cracking/delamination, substantially free of seam protrusions, and have improved seam region physical and electrical continuity.


First FET switches control supply of electricity from an external power supply to a primary winding of a transformer. A condenser is connected, in series, to a secondary winding of the transformer. A second FET switch is connected, in parallel, to the secondary winding and the condenser. The diode is connected, in parallel, to the second FET switch. A switch control unit acquires a value obtained by measuring a current flowing through the first FET switches and the second FET switch and controls, on the basis of the measurement result of the current, conduction of the first FET switches and the second FET switch.

In power supply devices, there may be a case in which direct current to direct current (DC-DC) converters are used to decrease a voltage. For example, with battery chargers for mobile phones or alternating current (AC) adapters for notebook computers, an input alternating voltage of 100 V is converted to a DC voltage and, then, the DC voltage is decreased by the DC-DC converter and electrical power is supplied.
In particular, in power supply devices, such as battery chargers for mobile phones or AC adapters for personal computers, in which an input voltage is high and an output voltage is low, isolated forward converters may sometimes be used as DC-DC converters.
However, in circuits of single ended forward converters, because winding wires for releasing energy are provided, a great loss occurs in transformers. Accordingly, to reduce a loss of the transformers, double ended forward circuits in which two Field Effect Transistors (FETs) functioning as switching devices are arranged in the main transformers may sometimes be used. When the double ended forward circuits are used, because the winding wires for releasing energy are not provided, the loss of transformers can be reduced. Furthermore, with the power supply devices that use the double ended forward circuits, in order to improve the efficiency, synchronous rectifiers are connected, in parallel, to a secondary side diode.
FIG. 17 is a schematic diagram illustrating an example of a double ended forward circuit. In the following, a description will be given of the transition of the flow of electricity after the state in which switches 901 to 903 are turned on and the FET switch 904 is turned off.
When the FET switches 901 to 903 are turned on and the FET switch 904 is turned off, as illustrated by a dotted line 921, electricity flows via the switch 901 and the switch 902. Consequently, an induced current is generated and, as illustrated by a dotted line 923, electricity flows via the FET switch 903. The electricity is accumulated in a condenser and is output outside.
Then, by turning off the FET switches 901 to 903, electricity flows via a diode 911 and a diode 912 due to the energy accumulated in a primary coil, as illustrated by a dashed line 922. At this time, due to the energy accumulated in a secondary side choke coil, electricity flows via a diode 914 and the condenser. At this time, because the FET switch 904 is still in the off state, on the secondary side, electricity flows via the diode 914 as illustrated by a two-dot chain line 924. Furthermore, an induced current is generated due to the electricity flowing in the primary side coil and thus electricity flows. Because the flow direction of this electricity is the same direction as that illustrated by the two-dot chain line 924, which does not prevent the electricity flowing on the secondary side. However, in this state, a loss of electricity occurs when electricity flows via the diode 914. Accordingly, by turning on the FET switch 904 and electricity is made to flow via the FET switch 904. By doing so, because the electricity flows without passing through the diode 914, a loss is reduced.
At this point, if the FET switch 904 is turned on when the switch 901 and the switch 902 are in the on state, the drain current flows through both switches and thus a short circuit occurs. Accordingly, the FET switch 904 needs to be turned on after the switch 901 and the FET switch 902 are turned off.
Then, the switch 901 and the FET switch 902 are to be turned on; however, when the FET switches 901 and 902 and the FET switch 904 are simultaneously turned on, i.e., when drain current simultaneously flows in the FET switches 901 902 and the FET switch 904, a short circuit occurs. Accordingly, to prevent the short circuit, the FET switch 904 is turned off before the switch 901 and the FET switch 902 are turned on and then the FET switches 901 to 903 are turned on. In this case, if the FET switch 904 is turned off, electricity flows as illustrated by the two-dot chain line 924. Thereafter, because the FET switches 901 to 903 are turned on, electricity flows as illustrated by the dotted line 923.
Here, in FIG. 17, in order to easy to understand, a diode 913 and the diode 914 are arranged independent of the FET switch 903 and the FET switch 904. However, in general, a parasitic diode is installed inside each of the FET switch 903 and the FET switch 904 that are FET switches and, in practice, there may be a case in which the diode 913 and the diode 914 are not installed.
With the DC-DC converter that uses the double ended forward circuit illustrated in FIG. 17, if all of the FET switches 901 to 904 are in the off state, electricity flows via the diode 914 as illustrated by the two-dot chain line 924. If electricity flows via the diode 914 in this way, a loss of electricity occurs in the diode 914. For example, an electricity loss of 1 V occurs in both ends of the diode 914. Accordingly, it is preferable to shorten the time during which electricity flows into the diode 914. However, as described above, because a short circuit occurs when the FET switches 901 and 902 and the FET switch 904 are simultaneously turned on, a switch timing between the FET switch 904 and the FET switches 901 and 902 needs to differ. In this way, the time during which the drain current does not flow both the FET switch 904 and the FET switches 901 and 902 is referred to as a dead time. Because electricity flows via the diode during the dead time, a loss occurs. Furthermore, the dead time becomes the longest when no load is applied to a power supply. Accordingly, with the conventional power supply device, in order to reduce a loss as much as possible, a dead time at the time of no load is set to the minimum.
Furthermore, for DC-DC converters, a conventional technology that suppresses, when an output voltage becomes large, a rise in an output voltage by extending conduction period of a body diode is proposed. Furthermore, for DC-DC converters that alternately turn switches connected in series, a conventional technology that adjusts, in order to prevent through current, the switch timing when switches are turned on is adjusted in accordance with the property of the switches is proposed.
Patent Document 1: Japanese Laid-open Patent Publication No. 2007-151271
Patent Document 2: Japanese Laid-open Patent Publication No. 2011-199972
However, if a load current of a power supply becomes large, a drain current applied to each of FET switches that function as switching devices is increased and the interval of the FET switches to be turned on or off is increased. Accordingly, as with the conventional technology, if a dead time at the time of no load is set to the minimum, the dead time becomes long at the time of high current and thus a loss of electricity is increased.
FIG. 18 is a schematic diagram illustrating expansion of dead time when a high current flows. A graph 961 is a graph that represents a gate voltage of the FET switch 901 illustrated in FIG. 17. A graph 962 is a graph that represents a drain voltage of the FET switch 901. A graph 963 is a graph that represents a gate voltage of the FET switch 904 illustrated in FIG. 17. A graph 964 is a graph that represents a drain voltage of the FET switch 904. It is assumed that the FET switches 901 to 903 are simultaneously turned on or off. Furthermore, for the graphs 961 and 962, when an output is High, the state becomes in the on state, whereas, when an output is Low, the state becomes in the off state. Furthermore, it is assumed that, for the FET switches 901 to 904, if a drain voltage drops, a drain current flows.
At this time, the DC-DC converter is adjusted such that a dead time becomes the minimum when no load is applied and, as indicated by the solid lines illustrated in graphs 962 and 964, at a timing 941, the drain current of the FET switch 904 does not flow and the drain current of the FET switch 901 starts to flow. Furthermore, at a timing 942, the drain current of the FET switch 901 does not flow and the drain current of the FET switch 904 starts to flow.
However, if the drain current becomes large, the interval of the FET switches 901 and 904 to be turned on or off is increased as indicated by a dotted lines 931 to 934. Consequently, at a timing 943, the drain current of the FET switch 904 does not flow and a dead time is expanded as illustrated by a time period 951. Furthermore, at a timing 944, the drain current of the FET switch 901 does not flow and a dead time is expanded as illustrated by a time period 952.
Furthermore, with the conventional technology that changes conduction period of a body diode, shortening of a dead time is not considered; therefore, it is difficult to suppress a loss of electricity. Furthermore, with the conventional technology that adjusts the timing of a switch to be turned on in accordance with the property of the switch, a change in a dead time due to an increase in a current is not considered; therefore, it is also difficult to suppress a loss of electricity.

Power supply device and control method of power supply device


A seal assembly capable of low temperature service is disclosed. It features upper and lower metallic backup rings that are specially shaped to act as a spring to keep the sidewalls of such rings in contact with the inside and outside surfaces to be sealed to prevent extrusion of the seal material even in low temperature situations. Inner and outer grooves are provided. O-ring seals, used for the ID of the seal, are manufactured to have a slightly greater diameter than the groove into which they will be installed. The greater length provides stored energy to promote sealing functionality in cold temperature situations. The O-rings used for the OD of the seal are manufactured to have a slightly smaller diameter than the groove into which they will be installed. The shorter length provides stored energy to promote sealing functionality in cold temperature situations.

Seals for annular spaces in downhole applications have to respond to a variety of changing conditions. During production, the produced fluids can raise operating temperatures to 350° F. or more. On the other hand, particularly in frigid climates and during shut in periods of no production, the surrounding temperature around a wellbore seal can plunge to 35° F. or even less. Traditional annular non-metallic seal designs employ anti-extrusion barriers on the top and the bottom. These devices or rings often follow the generally rectangular shape of the seal, when viewed in section. The backup rings have a generally U-shape and feature slight interference on the inside diameter and more significant interference on the outside diameter, as installed. An example of the generally U-shaped design for the anti-extrusion ring in an annular seal can be seen in U.S. Pat. No. 4,496,162. In a variation of this design, additional seal material has been added to the inside dimension of the seal assembly to make a portion of the seal protrude beyond the backup rings on the inside diameter dimension. Even though an increase in the inside diameter interference reduced failures at low temperatures, the prior design proved unreliable in exposure to even colder temperatures as experienced in shut in conditions in the harshest cold climates. Additionally, the increase in inside diameter interference made the seal significantly more difficult to install. Compression packer seals are generally illustrated in U.S. Pat. Nos. 1,350,553; 3,229,767; 3,554,280 and 4,326,588.
In the present invention, installation interference that activates the seal is generated by the relaxed OD of the seal being larger than the OD of the annular gap the seal is being installed in and the relaxed ID of the seal being smaller than the ID of the annular gap the seal is being installed in. The seal does not rely of any external axial load to function. The seal is assisted by pressure during normal functionality.
Accordingly, the present invention presents improvements to seal design to handle the colder environments. In one feature, the backup ring design has been revised to allow it to act as a spring to promote its ability to act as an extrusion barrier. In another development, resilient ring seals have been placed in the seal body and dimensionally configured to be installed in their respective grooves with a residual stored force to promote the operation of the seal assembly in reduced temperature environments. These and other features of the present invention will be more apparent to those skilled in the art from a review of the description of the preferred embodiment and the claims, which appear below.


An apparatus and method for testing components of a joint replacement device in desired articulation relative to one another under a load, include: a first unit or step operable to impart undulating orientations of a first member of the joint replacement device; and a second unit or step operable to locate a second member of the joint replacement device proximate to the first member of the joint replacement device such that an articulation surface of the second member engages an articulation surface of the first member for movement in response to the undulating orientations of the first member, wherein at least one of: (i) the second unit is operable to automatically adjust the location of the second member of the joint replacement device in response to lateral forces exerted by the first member on the second member, and (ii) the apparatus and method include a third unit or step operable to impart rotational displacement to the first member of the joint replacement device such that the articulation surface of the first member will be engaged with the articulation surface of the second member for the desired articulation of the first and second members.

The present invention relates generally to apparatus and method for testing a joint replacement device and pertains, more specifically, to testing the respective components of a joint replacement device in articulation relative to one another under a load.
Artificial or prosthetic devices for replacing defective joints in humans have been the subject of extensive research and development efforts for many years, particularly with regard to hip and knee joints, and more recently with spinal joints. In the design of such devices, it is advisable to subject the components of each new design to static and dynamic testing. Such testing is prudent in that it ensures that a particular design will not fail prematurely. Thus, a need exists within the medical equipment industry to assess the endurance properties of components of joint replacements.
While machines suitable for testing artificial or prosthetic hip and knee joints are known and are available to provide a variety of loading and articulation combinations, such machines have several shortcomings, including large size, significant cost (both of purchase and maintenance), and slow speed. Moreover, many joint testing devices have been developed specifically for use with hip and knee joints, and in that respect are unsuitable for use with the growing number of spinal implants. The need to retrofit or completely redesign such machines for use with spinal implants increases the cost and, in some cases, the size of the machines.
There are some devices that purport to address some of the above-described shortcomings. For example, Enduratec (Minnetonka, Minn.) manufactures at least one Spinal Disc Implant Wear Testing System, the respective capabilities and features of which are summarized at http://www.enduratec.com/testapp.cfm/tid/29 and http://www.enduratec.com/testapp.cfm/tid/27. While utilizing newer technologies to increase speed and minimize size, these devices are nevertheless costly and complicated in function for many uses.
Therefore, there is a need in the field for new approaches to provide a joint replacement device testing machine and method that efficiently effect articulation of replacement joint components under a load.

Method and apparatus for testing a joint replacement device


A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.

1. Field of the Invention
The present invention generally relates to chip scale packaging and more particularly to a chip scale power converter package having an inductor substrate.
2. Description of Related Art
It is well known to include a discrete inductor on the printed circuit board when implementing a power converter circuit. For example, the Analogic™TECH 1 MHz 400 mA Step-Down Converter (AAT1143) requires the use of a discreet inductor. Power converters implemented in this way suffer the disadvantages of having higher component cost and of requiring more printed circuit board space.
Discrete inductors co-packaged with power ICs and other components are also well known. For example, the LTM®4600 DC/DC power converter available from Linear Technology Corporation of Milpitas, Calif., includes a built-in inductor in a 15 mm×15 mm×2.8 mm package. The package disadvantageously uses valuable printed circuit board space.
It is further known to dispose an inductor on top of an integrated circuit die such as a power converter integrated circuit die. For example, power converters available from Enpirion of Bridgewater, N.J., include a MEMS-based inductor having a thick electroplated copper spiral coil sandwiched between two planar magnetic layers and disposed over an integrated DC-DC converter. To achieve high inductance, a large die is required resulting in a high cost and a large package. Furthermore, complex processing is necessary in order to fabricate the planar magnetic layers.
There is therefore a need in the art for a chip scale power converter that overcomes the disadvantages of the prior art. There is a need for a low cost chip scale power converter that does not require an external inductor. There is a further need for a chip scale power converter having an optimized interconnection between the power IC and the inductor for minimized parasitics, improved performance and high reliability.

Chip scale power converter package having an inductor substrate

Alpha and Omega Semiconductor Incorporated


A magnetic memory device includes first to n-th MTJ devices recording data and first to n-th transistors connected to the first to n-th MTJ devices, respectively. The word line generates a magnetic field to be applied to the first to n-th MTJ devices during a write operation. A read word line is connected to gates of the first to n-th transistors and applies a voltage for turning on the first to n-th transistors during a read operation. A first word line driver is connected to a first end or a second end of the write word line and drives the write word line. A second word line driver is connected to a first end of the read word line and drives the read word line. A second switching circuit selectively connects the second end of the read word line and the second end of the write word line.

1. Field of the Invention
The present invention relates to a magnetic memory device, and more particularly, to a magnetic memory device having write word lines, which indicate word lines to be used during a write operation, and read word lines, which indicate word lines to be used during a read operation.
2. Description of the Related Art
As a magnetic memory device, a magnetic random access memory (MRAM) is known. In a memory cell of an MRAM, a device having a magnetic tunnel junction (MTJ) is used. An MTJ device is formed of two ferromagnetic films (one serving as a pinned layer (fixed layer); the other as a recording layer (free layer)) and a single dielectric film (serving as a tunnel barrier layer) sandwiched between the two ferromagnetic films.
FIG. 21 is a cross sectional view of a typical memory cell (MC) of an MRAM. To write data, current is passed through a write word line (Write Word Line) WW and crossing a bit line B at right angles, thereby producing a magnetic field at the intersection between the bit line B and the write word line WW. This magnetic field reverses the direction of magnetization of the recording layer of the MTJ device MTJ. Depending on the relative orientation (either parallel or nonparallel) of the magnetization of the recording layer with respect to the pinned layer, binary 0 or binary 1 is written.
The data is read by using the tunneling magnetoresistive (TMR) effect, a phenomenon in which the electric resistance of the MTJ device MTJ changes with the relative angle between the direction of magnetization of the ferromagnetic film forming the MTJ device MTJ and the current direction. Specifically, first the read word line (Read-Word-Line) RW is driven to turn on a memory cell transistor TR, so that current flows from the bit line B to a ground GND via the MTJ device MTJ, and then the signal current is detected by a sense amplifier (not shown) connected to the bit line B, the resistance mentioned above can be detected.
FIG. 22 is a circuit diagram of the memory cell shown in FIG. 21. FIG. 23 is a conventional circuit diagram showing a memory cell array including memory cells of the type shown in FIG. 22 and the peripheral portion. As shown in FIG. 23, memory cells MC [0,0] to MC [m, n] are arranged at the intersections of a set of write word lines WW [0] to WW [m] and read word lines RW [0] to RW [m], and bit lines B [0] to [n]. Bit line drivers BDU [0] to BDU [n], which are positioned above the memory cell array MCA, and bit line drivers BDL [0] to BDL [n], which are positioned below the memory cell array MCA, drive bit lines B [0] to B [n], respectively. The two ends of each of corresponding write word lines WW [0] to WW [n] are connected to the corresponding write word line drivers WWD [0] to WWD [n] and current sinkers WS [0] to WS [n], respectively. During a write operation, a write current flows by activating one of the pairs of the write word line driver WWD [i] and the current sing circuit WS [i], where i=0, 1, . . . , n.
A large current is supplied to the write word lines WW (WW [0] to [m]) to generate magnetic fields in the memory cells MC (MC [0,0] to MC [m, n]). Therefore, the write word lines are generally formed of a low-resistance metal. On the other hand, it is not necessary to supply such a large current to the read word lines RW (RW [0] to RW [m]). For this reason, the read word lines RW are formed of a relatively high-resistance material (e.g., polysilicon), which is usually used in the gate electrode of a memory cell transistor TR.
As described above, a read word line RW has a resistance about 10 to 100 times larger than that of a write word line WW. In addition, since the read word line RW is the gate electrode of a memory cell transistor TR, it has a large capacitance. As a result, the product of resistance and capacitance (RC) of the read word line RW becomes large, which degrades an operation speed. The problem of read-speed reduction becomes severe in a large-scale memory cell array (MCA). To avoid this problem, the memory cell array MCA must be limited in size.
To overcome the above problems, a second conventional circuit design is proposed in FIG. 24 in which a single read word line RW and a single write word line WW are shown. As shown in FIG. 24, a word line control circuit WCTR is connected to both ends of the write word line WW. The write word line WW and the read word line RW are connected by a shunt ST. One end of a memory cell transistor TR is connected to the common node CN, which is grounded via a connection transistor S. Since the read word line RW is connected to the write word line WW, the effective resistance value of the read word line RW becomes lower than that in the first conventional circuit. To prevent the transistor TR from being turned on by the current flowing through the read word line RW during the write operation, the common node CN is isolated from the ground by the connection transistor S.
However, in the second conventional circuit design, since the read word line RW and the write word line WW are connected via the shunt ST, the following problems may occur. First, since the shunt ST takes up space, the area occupied by the memory cell array MCA increases. Second, the periodical layout pattern of the memory cell array MCA breaks by the presence of the shunt ST. This collapse of the periodicity makes submicron lithography more difficult.


A one-piece office chair in three dimensions made of composite plastic materials with an adjusting apparatus comprises a middle axle seat, a seat frame, a back frame, and two armrests, all of which are formed in one-piece to complete the entire chair frame. Also, an adjusting apparatus is applied to provide supports and elasticity for the chair frame, enabling the back frame to adjust the angle in accordance with users' movements. With the dynamic design and the resilience of the materials, the present invention further allows sideway movements in three-dimensional angles by having the back frame and the seat frame adjusting the angle from a middle axle seat thereof; meanwhile, the back frame thereof also allows lying back movement, featuring the present invention a comfortable seating in every angle.

1. Field of the Invention
The present invention relates to an office chair in three dimensions, particularly to one that is formed in one-piece structure of composite plastic materials with an adjusting apparatus.
2. Description of the Related Art
A conventional office chair 10 as shown in FIGS. 1A and 1B comprises an underframe portion 11, a seat portion 12, a back portion 13 and two armrests 14, among which the seat portion 12 is the key to be composed with other components. The seat portion 12 of a conventional office chair 10 includes a metal plate 121 combining with a seat pad 122, and the bottom thereof combines a supporting device 123 to mount on a middle column 111 of the underframe portion 11. Besides, the metal plate 121 links up two connection seats 124 on both left and right sides to fix on the armrests 14. With such structure of multi components combination, a conventional office chair 10 is constructed in a complicated method whereby the finished product lacks unity and firmness, plus the heavy weight of metal materials; there is still room for improvements.
On the other hand, a conventional chair made of plastic has a lightweight advantage but the simple structure is more suitable for outdoor activities than offices.
FIGS. 2A and 2B illustrated a one-piece structure of a conventional office chair disclosed in the U.S. Pat. No. 7,887,138. The seat base 10a of the invention is made of one-piece plastic material and mainly comprises a middle axle seat 101, a claw member 102 with a plurality of arched supporting arms 103 extending upwards from the rim of the middle axle seat 101 in the shape of claws, and a base frame 104 formed at the top of the supporting arms 103 of the claw member 102. Such structure features the invention an easy and rapid assembly with stable structure and light weight. However, the arched supporting arms 103 are arranged all over under the base frame 104, resulting the invention in a rigid status without ant flexibility.
Also, the U.S. Pat. No. 7,637,570 disclosed a chair invented by Wilkhahn that has a seat and a seat mechanism, where the seat mechanism includes two supporting arms arranged on both sides of the chair and functioning individually, and the seat is fixed on the supporting arms so that when the seat is tilting sideways, the other side would not be influenced and lose balance. However, the invention includes a plurality of rigid supporting arms and ball joints to achieve the sideway function, therefore leading to a much more complex structure.

One-piece office chair in three dimensions


The present invention is directed to a machine for closing and sealing an article, such as a box or carton, as it is driven through the machine. Specifically, upper and lower taping heads are provided for applying lengths of tape to the bottoms and tops of the boxes. The upper box flaps are also preferably folded by the machine of the present invention by a folding mechanism including a ski for folding the leading minor flap, a kicker for folding the trailing minor flap, and shaped rods for folding the major side flaps after the minor flaps are folded. In accordance with the present invention, the upper head assembly is advantageously adjustably connected to the machine so that proper leveling of the upper taping head and the folding mechanism can be assured. Moreover, such adjustment can be redone at any time thereafter as needed as affected by working conditions over time. Additionally, the subject machine includes a control system which uses only a minimum number of control sensors, namely two control valves, to control both the kicker and a gating mechanism effectively while permitting easy operator adjustment and machine versatility.

Box sealing machines including upper and lower taping heads for applying lengths of pressure-sensitive adhesive tape to a box or carton driven through the machine are generally well known. Moreover, the provision of means for folding the box flaps so as to close such a box in combination with the taping heads of box sealing machines is also well known. Such means for folding the top box flaps typically include a ski which is supported from an upper cross member assembly so as to engage and fold a leading minor flap of a box, major side flap folding guides or rods which engage the major side flaps as the box moves forwardly so as to urge them downwardly to their closed position, and a trailing minor flap folding assembly which folds the trailing minor flap prior to the closing of the major side flaps. After the folding is completed, an upper taping head seals the top of the box by a length of tape applied to the upper major side flaps. Normally, at the same time a lower taping head applies a length of tape to the lower major side flaps.
The trailing minor flap folding assembly is known to comprise what is hereinafter referred to as a kicker which is pivotally supported from the upper cross member assembly and which is driven by a means, such as a pneumatic cylinder, to engage with and to fold the trailing minor flap before the major side flaps are folded by the major flap folding guides or rods. In order to accomplish this, the kicker must be timed with respect to the position of the box along the machine and the major flap folding guides or rods. Typically, a means which senses the relative position of a box for actuating the kicker drive means is used. Such means may detect either the front edge or the rear edge of the box. Known sensing means include the use of photocells, limit switches, and levers which are actuated by engagement with or disengagement from either the box front edge or rear edge. Furthermore, the kicker must be repositioned in its raised position after the box has passed through at least the folding portion of the machine in preparation for the next box to be driven through the machine. This reposition may occur as a result of the box moving from and deactivating such a limit switch or photocell, or by activating yet another such sensor provided farther downstream. The addition of more sensors disadvanteously increases the complexity of the machine control system; however, the use of the same sensor to control raising and lowering has heretofore been inadequate in that the machine lacks versatility.
In order to control feeding of subsequent boxes into the box sealing machine, it is further known to provide a mechanism for preventing entry of the next box into the box sealing machine until after a first box is sufficiently driven through the box sealing machine and the folding mechanism is reconfigured back to its ready position for receiving the next box. Such a mechanism is known to include devices which block entry of subsequent boxes into the box sealing machine that engage with the next box and which permits passage at an appropriate time. One known device comprises a gate pivotally mounted to the machine bed which is movable between a blocking position above the plane of the bed and an open position below the plane of the bed. Such gates can be conventionally movable between the blocking and open positions by a pneumatic cylinder, and can be controlled in a similar manner as the kicker assembly, discussed above, by the provision of sensors, such as photocells, limit switches, or levers, to permit passage of the next box into the machine only after the previous box passes a certain point along the machine. Moreover, in order to initiate both the blocking and open gate positions, either a plurality of sensors are required, one for defining each position, or the gate positions must be determined by the actuation or not of a single sensor. Since it is important that the gating device be timed with respect to the other operations of the box sealing machine, including any kicker mechanism or other flap folding device, it is difficult to control the necessary machine configurations without a multiplicity of sensors for each such operational mechanism while permitting versatility to adjust the machine to provide optimum setting for a particular box. The use of so many sensors greatly increase the complexity of the control system, such as a pneumatic circuit, for such a box sealing machine. In particular, each sensor is typically associated with a valve of a pneumatic circuit thus rendering the pneumatic circuit more complex and costly. Any compromise as to the number of sensors needed results in a less efficient and less versatile machine due to problems in coordinating the related activities of the machine or by slowing down the number of boxes which can pass through the machine for a given time period.
Another problem common to prior art box sealing machines involves the provision of the upper taping head and any upper box flap folding mechanisms, such as a ski and/or kicker, supported from an upper cross member. Typically, such an upper cross member is vertically adjustably supported from the machine base so as to position the upper taping head and any box flap folding mechanisms at the appropriate level for a specific box driven through the machine. Such adjustment may be automatic or manual. The problem is that it is difficult to ensure that the upper taping head and/or the box flap folding mechanism are properly level to adequately perform their related functions. Moreover, such problem is worsened over time and usage of the machine. The taping head and box folding mechanism are typically rigidly cantilever mounted to the upper cross member. Thus, it is imperative that at original construction, the upper taping head and box flap folding mechanism be accurately aligned and connected to the upper cross member. Moreover, the pressures exerted on such connection during usage of the machine over time may tend to cause slight deformation at the connection, thereby unleveling the upper taping head, the box flap folding mechanism, or both.
Examples of box sealing machines including upper taping heads supported by an upper cross member are described in: U.S. Pat. No. 4,633,642 to Lissoni, U.S. Pat. No. 4,238,269 to Deering, Jr., U.S. Pat. No. 4,028,865 to Loveland et al, and U.S. Pat. Nos. 4,748,794, 4,653,247, 4,643,707, 4,585,504, and 4,541,888 and the British Patent Specification No. 1,585,335 to Marchetti.

Minnesota Mining and Manufacturing Company


The comprehensive anti-vandalism shielded facility system for injection systems, includes the construction of a security shielded facility, which is a thick and solid structure built with steel rods and reinforced concrete of considerable thicknesses which have as a purpose to prevent access to third-parties that could conduct acts of vandalism. The shielded facility is built with highly resistant concrete that is able to withstand the impact caused by common tools used for acts of vandalism.

A corrosion inhibitor fluid can be defined as a product that acts by forming a film over a metal surface or by delivering electrons to the medium. The use of inhibitor fluids is recommended in cases that require better control of the so called interior corrosion on hydrocarbon transport systems. The storage and application of these inhibitors is conducted through the inhibitor fluid injection system.
A chemical injection system generally consists of one or more chemical or inhibitor fluid storage tanks, a mixing container (if needed), a pump and an injection pipe. The storage tanks must be under constant monitoring in order to check content levels, preventing either overflow of the inhibitor fluid or the chemical running out.
These systems may be applied to various processes that range from the oil industry to water treatment. These systems inject large amounts of chemical compounds into these processes. Some of these may be biocides, corrosion inhibitors, methanol, additives, etc. The injection points for the inhibitor fluid must be placed at the origin of the pipeline. This is the reason why many injection systems are located in unpopulated or remote locations, making them easy targets for vandalism.
There are other chemicals that are used in the pipeline hydrocarbon transport industry. Among them are the surfactants, which improve the flow of the hydrocarbon as it circulates the pipeline. These chemicals are introduced using an injection system, therefore they also often become victims of vandalism.
Vandalism problems related to injection systems for inhibitor fluids and other chemicals, have increased in these past years. This is mostly due to the price increase of the materials and components of the injection system, along with poverty and social issues.
This security system resolves the problem above by protecting the inhibitor fluid and other associated chemicals injection system, as well as its solar power source by building a security shielded facility for safekeeping and protection, that houses a reinforced steel structure and highly impact-resistant materials, making it impenetrable by rudimentary tools, turning it completely impregnable; third-party access is automatically restricted by its opening system, as well as by including acrylic materials and electric shutters to protect the solar panels, providing extra protection for the injection system.
Other patents have been found, for example, a watering nozzle anti-vandalism System (ES1030934U, ES1030935U) as well as one for public pay phones (BRMU8103399U); however these inventions cannot be applied to the protection of an inhibitor fluid injection system, given that they are designed for the protection of other specific pieces of equipment. Other patents have been found for protection of cathodic protection systems (U.S. Pat. No. 4,515,669, U.S. Pat. No. 4,504,375, U.S. Pat. No. 6,193,443B1, U.S. Pat. No. 6,461,082, U.S. Pat. No. 4,089,767, U.S. Pat. No. 6,331,242B1, U.S. Pat. No. 6,214,203B1, U.S. Pat. No. 4,175,021, U.S. Pat. No. 6,744,265B2 U.S. Pat. No. 3,868,313, U.S. Pat. No. 4,169,028, U.S. Pat. No. 5,305,631) however, these patents are not applicable to an inhibitor fluid injection system.
Therefore, a review of the literature and intellectual property databases does not reveal the existence of inventions that provide integrated protection for an inhibitor fluid and other chemicals injection system with a solar power source.

Anti-vandalism shielded facility for the injection of inhibitor fluids and other chemicals associated to pipeline transport of hydrocarbon and other valuable fluids