A method and apparatus for estimating coverage of a computer program from traces, the method comprising: receiving trace data generated by an execution of an executable unit; and estimating coverage of the executable unit from the trace data, wherein estimating coverage comprises estimating trace coverage.

Computerized devices control almost every aspect of our life—from writing documents to controlling traffic lights. However, computerized devices are bug-prone, and thus require a testing phase in which the bugs should be discovered. The testing phase is considered one of the most difficult tasks in devote a significant portion, such as 70%, of the development cycle to discover erroneous behaviors of the software employing the computerized device.
In order to determine that a testing phase is of a relatively high quality, coverage analysis may be utilized. By analyzing coverage of tests, a developer or any other user interested in testing the software, such as for example a member of a Quality Assurance (QA) team, may be informed which aspects or parts of the software have been sufficiently tested by the executed tests, and which aspects or parts have not.
Various different coverage metrics may be employed, such as but not limited to code coverage metrics, functional coverage metrics and data coverage metrics.
Code coverage describes the degree to which the source code of a program has been tested. Code coverage metrics are associated with portions of the software, and are indicative of whether specific portions of the code have been executed and tested. Code coverage may refer to execution of a statement, line, a function, code within a file, code of files in a directory, code associated with an object, code associated with a method of an object or the like.

International Business Machines Corporation


A black matrix having an opening at pixels of a matrix array in a display area, a common wire including common pads and common signal lines, and gate pads in a peripheral area, and an alignment key in outer area to align interlayer thin films are formed on an insulating substrate. Red, blue and green color filters the edge of which overlap the black matrix are formed at the pixels on the insulating substrate, and an organic insulating layer covering the black matrix and the color filters and having a contact hole exposing the gate pad is formed thereon. A gate wire including a gate line connected to the gate pad through the contact hole and a gate electrode connected to the gate line is formed on the organic insulating layer, and a gate insulating layer covering the gate wire is formed on the organic insulating layer. A semiconductor pattern and ohmic contact layers are sequentially formed on the gate insulating layer of the gate electrode. A data wire including a source electrode and a drain electrode that are made of a same layer on the ohmic contact layers and separated from each other, and a data line connected to the source electrode and defining the pixels of a matrix array by crossing the gate line is formed on the gate insulating layer. A passivation layer covering the data wire and having contact holes exposing the gate pad and the data pad is formed, and a pixel wire including a pixel electrode, a redundant gate pad, a redundant data pad that are respectively connected to the drain electrode, the gate pad and the data pad through the contact holes.

(a) Field of the Invention
The present invention relates to thin film transistor array panels for a liquid crystal display and the methods for manufacturing the same.
(b) Description of the Related Art
A liquid crystal display (LCD) is one of the most popular flat panel displays (FPDs). The liquid crystal display has two panels having electrodes for generating electric fields and a liquid crystal layer interposed therebetween.
The transmittance of incident light is controlled by realigning the liquid crystal molecules of the LCD, as the intensity of the electric field applied to the liquid crystal layer changes.
In the most widely used liquid crystal display, the field-generating electrodes are provided at both panels, with one of the panels having switching elements such as thin film transistors and pixel electrodes, and the other panel having color filters and black matrix.
In general, a thin film transistor array panel is manufactured by a photolithography process using photoresist pattern as an etch mask. However, the misalignment of interlayes in fabricating a multi-layered structure negatively affects display characteristics of the LCD. To solve this problem, it is desirable that an alignment key of an opaque material is formed of the same layer as the lowest layer of the thin film patterns.
On the other hand, it is important to increase an aperture ratio of the thin film transistor panels of LCD to improve a brightness of LCD. However, the LCD has several obstacles in reducing the aperture ratio of the thin film transistor. Firstly, a certain distance between the pixel electrode and the data line must be maintained in order to avoid the parasitic capacitance generated therebetween by coupling effects. Secondly, a black matrix must be wide enough to cover a possible misalignment of the two panels. To solve these problems, several methods have been suggested. One suggests an insulating layer interposed between the pixel electrode and the data line and made of organic material having a low dielectric constant. The other suggests color filters formed on the same panel having thin film transistors.
However, the latter case is economically unsound. Because the color filters are formed after more expensive processes of forming thin film transistor, the failure in the color filter formation process wastes a lot of resources and increases the manufacturing costs. On the other hand, the former method cannot generate enough storage capacitance between the gate line and the pixel electrode.

This patent is subject to a terminal disclaimer.

Thin film transistor array panel for liquid crystal display


Methods are provided for determining a depositional environment of a sample of a subterranean environment. An example method includes measuring intensities for a crystallographic plane (CP) 100 peak and a CP 101 peak for quartz in a diffractogram, calculating a ratio of the intensities of the CP 100 peak to the CP 101 peak, and identifying a depositional environment for the sample from the ratio.

The production of crude oil and other hydrocarbons starts with the drilling of a wellbore into a hydrocarbon reservoir. In many cases, the hydrocarbon reservoir is a narrow layer of material in the subterranean environment, making efficient targeting of the wellbore important for productivity. Accordingly, identifying the reservoir layer is important for determining the wellbore location, and drilling the wellbore to that location, for example, by directional drilling.
A depositional environment in which the rock of the reservoir layer, and surrounding layers, formed is helpful for identifying the reservoir layer and locating a reservoir within the reservoir layer. The depositional environment is the environment in which the material forming the sedimentary rock and sand of the layers of the subterranean environment formed, such as in a river bed, a shoreline, or a lake, among others.

Determination of depositional environments


Dish washing machine including a steam generator. The dish washing machine also includes a tub that defines a dish washing space therein. A water supply supplies water to the steam generator, and a steam flow conduit guides steam, generated by the steam generator, to the dish washing space. An over-pressure prevention conduit having one end connected to the water supply conduit and the other end connected to either the steam flow conduit or the tub. The over-pressure prevention conduit prevents water in the steam generator from flowing backward into the water conduit and/or the public water supply when a reverse water pressure condition occurs.

1. Field of the Invention
The present invention relates to a dish washing machine that includes a steam generator. More specifically, the present invention relates to a dish washing machine that is capable of preventing over-pressure conditions in the steam generator due, for example, to a clog or blockage in the steam conduit.
2. Discussion of the Related Art
Generally, dish washing machines are well known as devices that automatically wash dishes in the washing compartment of the dish washing machine by spraying wash water, under high pressure, on the dishes, thus, removing foreign matter such as food particles and food residues attached to the surface of the dishes. It is understood that dish washing machine's wash items other than dishes, such as glassware, pots, pans, utensils and the like. However, for ease of discussion, the following disclosure will refer only to dishes.
One important factor associated with dish washing machines is how effectively the machine removes food particles and food residues on or attached to the surface of dishes. In order to improve washing capability, dish washing machines increase the force (i.e., the spray pressure) of the wash water to more effectively remove foreign matter form the surface of the dishes. However, if the spray pressure of the wash water is too high, the dishes may break or otherwise become damaged. Further, when washing dishes with increased spray pressure, the dish washing operation is less efficient because the amount of wash water required increases.

Dish washing machine having a steam generator and an over-pressure prevention feature


This invention relates to a new and useful color pigmented moisture curing polyurethane coating that has an adjustable drying time, as well as methods of producing the coating. The coating is suitable for use as a protective and/or decorative coating. The coating comprises one or more specified color pigments, polyisocyanates, polyols, tertiary amines, and blocked amines. The blocked amines, in conjunction with the tertiary amines, allow the coating to dry slowly once the coating has been applied, resulting in a defect free surface. Furthermore, an additional catalyst, comprising a metal catalyst may optionally be added to the coating immediately prior to use in order to speed up the rate of drying of the coating, allowing for very precise control of the drying speed of the coating. Additional optional ingredients may be added to the coating composition, including ultraviolet light stabilizers, wetting agents, solvents, and agents to increase slip and flow.

There are many commercial and industrial protective and/or decorative coatings for use on walls, machines, and other such objects requiring protective coatings. Polyurethane coatings are known in the industry as one of the toughest coatings available. There are many polyisocyanates that react with atmospheric water at room temperatures and form useful films that are used in a limited form as moisture curing polyurethane coatings. This type of coating is one of the finest coatings available that can be produced without the use of heat or other external sources of energy being applied. They are very useful for objects that cannot be heated such as prefabricated metal building, plastics, large machinery, airplanes, ships, etc. However, due to certain problems, there is a reluctance to use such coatings.
One such problem is that the color pigments contain adsorbed moisture on their surfaces that cause the polyurethane formula to gel within a few days, becoming hard and unfit for commercial use. To overcome the problems of combining color pigments and isocyanate polymers to create a moisture curing polyurethane, the industry, for the most part, has resorted to a two package system. In preparing a polyurethane coating using the two package method, a polyol is chosen that will chemically combine with a suitable polyisocyanate. The polyol portion is pigmented to achieve the desired color, opacity, etc. The pigmented polyol portion and the polyisocyanate are supplied in separate containers to the ultimate user or consumer. The consumer mixes the two portions in accordance with the ratio specified by the manufacturer just prior to use. This admixture has a limited life and must be used up within a relatively short period of time or it will harden and become unusable.
This approach is not only cumbersome but expensive in that it results in a quantity of hardened and wasted material if the entire admixture is not used up. There is also a risk in that the pigmented polyol portion and the polyisocyanate portion will not be mixed in the correct ratio causing serious damage to the performance of the resulting polyurethane coating. In addition, atmospheric moisture is a significant factor in using the two package method in that water also cures isocyanates. On a hot, humid day, a large portion of the polyisocyanate can be cured by atmospheric moisture, leaving a portion of the polyol with nothing to cross link itself with, and resulting in a coating less desirable than if the polyol was completely cross linked. Likewise, on a cold, dry day more of the polyol will cross link with the polyisocyanates. It is apparent that the two package polyurethane coating method will produce a quality of coating dependent upon atmospheric conditions, said conditions being almost always impossible to control, and if so, very expensive.
Also, these conventional two component polyurethane coating systems suffer from an inability to produce a satisfactory high gloss finish, as compared to a matte finish, due to the release of carbon dioxide in the coating film which forms blemishes and microblisters upon drying, due to a side reaction of the polyisocyanate within the film coating, which reacts with atmospheric moisture. These blemishes and microblisters mar the high gloss finish and result in an unacceptable high gloss film being produced. Even where a matte finish is desired, these blemishes can be conspicuous enough to make the finish cosmetically unacceptable.
Moisture curing polyurethane coatings can be made in a single package method eliminating some of the above mentioned problems of the two package types. One such moisture curing polyurethane coating is taught by Urs, U.S. Pat. No. 4,304,706, which is hereby incorporated by reference. MPEP .sctn. 608.01(p). This moisture curing coating comprises a color pigment dispersion, an isocyanate prepolymer, an organometallic catalyst and, typically, a solvent to produce a useful coating. However, this technology has been unsuccessful in producing a high gloss coating finish, rather than a matte coating finish. During the moisture curing process, which entails the reaction of the isocyanate with atmospheric moisture, carbon dioxide is generated within the coating. The carbon dioxide escapes from the coating, leaving unsightly and cosmetically unacceptable microblisters in the coating.
One method to control the escape of carbon dioxide from the polyurethane coating is to combine the moisture curing polyurethane compound with a class of "blocked" primary and secondary amines, such as aldimines or ketimines, just prior to the application of the coating during use. The use of these blocked amines in conjunction with moisture curing polyurethanes is well known to those of ordinary skill in the art. However, when moisture curing polyurethane coatings known in the art are combined with such blocked amines, the resulting coating has a very short "pot" life, i.e., once the blocked amine is added to the coating composition, the coating must be used within a few hours, as the viscosity of the coating increases such that application of the coating will become impractical. It is impossible to coat large objects, such as airplanes or motor vehicles, with such compositions as overspray mist of the coating falls onto parts which have already been coated and have dried, thus marring the cosmetic appearance of the overall coating with overmisting which falls onto a surface where the coating has already dried. Moreover, the cure time of the polyurethane coating prepared according to this technology is determined by its components and cannot be adjusted or customized by the end user of the coating.
There remains a need for a pigmented moisture curing polyurethane coating which may be easily, efficiently and inexpensively produced on a commercial basis which will dry slowly when compared to previously known compositions, will prevent the formation of microblisters within the dried coating, and will be free of overspraying blemishes, while having an improved pot life. There also remains a need for a pigmented moisture curing polyurethane coating which can be easily used to create an unblemished, high gloss finish. Additionally, there is a need for a pigmented moisture curing polyurethane coating having a drying time that can be customized by the end user for each individual application.

Color pigmented moisture curing polyurethane coating having an adjustable cure time and method for preparing same


A method for affecting a scheduled defrost operation for a refrigeration system includes the steps of: (a) after an extant the scheduled defrost operation commences, evaluating at least one predetermined parameter relating to operation of the refrigeration system; (b) if the at least one predetermined parameter manifests a behavior of at least one first predetermined nature over at least one first time interval, continuing the extant scheduled defrost operation; and (c) if the at least one predetermined parameter manifests a behavior of at least one second predetermined nature over at least one second time interval, discontinuing the extant scheduled defrost operation.

The present invention is directed to control of defrost operations for refrigeration systems, including electrically operated heat pump systems, and especially to controlling scheduled defrost operations for a refrigeration system or an electrically operated heat pump system.
Many commercial refrigeration systems employ electro-mechanical relay timed control devices to schedule the start and control the termination of evaporator coil defrost operations. Many electrically operated heat pumps use similar timed control devices to defrost a heat exchanger outside of an air conditioned space when the heat pump is in a heating mode. For purposes of this disclosure the term "refrigeration systems" also is intended to include electrically operated heat pumps which use electric resistance heaters, microwave energy, or another electrically generated heat source to defrost a heat exchanger outside of an air conditioned space when operating in a heating mode. The timed control devices may be configured to be programmed to initiate a defrost operation at varied and multiple times throughout a day. The timing for defrost operations is typically specified by the needs of the application in which the particular refrigeration system is employed and by knowledge of the manufacturer or installer of the refrigeration system. The timed control devices may control the termination of a defrost process either upon receiving a signal from a temperature or pressure sensing device or upon lapsing of a maximum allowed time that may be pre-programmed in the timed control device. Once programmed, the timed control devices will typically activate the defrost operation in a consistent and repeating manner, regardless of the actual condition of the evaporator coil.
The manufacturer or installer must choose the appropriate number of defrosts, and the maximum allowed time for each defrost based upon knowledge of the application and type of equipment being used. Such design choices are sometimes based upon a worst-case scenario that the refrigeration system may be expected to encounter on a day-to-day basis. As a result of such a loose predictive selection method, the refrigeration system may defrost itself more times than is necessary on days not presenting the predicted worst-case scenario. Resulting additional defrosts in such environments are typically a waste of energy, and thus a waste of money. In addition, such additional defrost operations may put refrigerated products at risk of spoilage.
Redesigning a defrost control device for a refrigeration system may be expensive, especially in the case of already installed refrigeration systems.
There is a need for a defrost control method and apparatus that can be added to an existing refrigeration system to achieve control of defrost operations for a refrigeration system that is responsive to contemporaneous conditions rather than responsive to predicted environmental conditions.
There is a need for a method and apparatus for affecting defrost operations for a refrigeration system that is capable of analysis of performance of a refrigeration system and using results of the analysis to truncate a scheduled defrost operation when the method or apparatus determines that the defrost cycle is not required.

Method and apparatus for affecting defrost operations for a refrigeration system

Heatcraft Refrigeration Products, L.L.C.


The present invention provides a biochip image-forming system including a case having a cavity, an optical assembly, a chip-holding assembly and an electricity storage assembly. The cavity communicates with a chip inlet for a biochip to be inserted into the cavity through the chip inlet and an image outlet for an image of the biochip to be outputted from the cavity via the image outlet. The optical assembly is received in the cavity and aligned with the image outlet for forming the image of the biochip. The chip-holding assembly is received in the cavity and arranged between the optical assembly and a heating component. The chip-holding assembly aligns with the chip inlet for the biochip to be placed thereon. The electricity storage assembly is electrically connected with the optical assembly and the heating component. As such, a biochip can be analyzed conveniently using said biochip image-forming system.

1. Field of the Invention
The present invention generally relates to an image-forming system and, more particularly, to a biochip image-forming system.
2. Description of the Related Art
As the wealth of society has gradually improved, "diseases of affluence," such as chronic diseases (e.g. diabetes and hypertension), are thus resulted. These diseases do not cause immediate death; however, they cannot be cured right away. Consequently, controlling progression of disease has become an important issue in patients' daily life.
For helping patients to manage disease progression, convenient medical devices are developed, such as sphygmomanometer, glucose meter and blood analyzer. With the development of bioengineering, biochip has been produced for fast genetic test or disease diagnosis. Proteins, nucleotides, antigens or antibodies of a testee can be dropped on a thumb-sized biochip, and can be analyzed using corresponding devices. An example of such biochip and analyzing device can be seen in Taiwan Patent No. 1335429.
However, the conventional analyzing device needs external magnetic force during analysis process, hence may not be suitable for a patient wearing a pacemaker. Besides, the conventional analyzing device has large size and cannot be easily carried, thus being inconvenient for patients to manage disease progression through biochips.
In light of the above, it is required to provide a solution which overcomes the above disadvantages and fulfills the needs of patients, thus improving its application convenience.

NATIONAL PINGTUNG UNIVERSITY OF SCIENCE & TECHNOLOGY


A single chirality single walled carbon nanotubes (SWNT), and combinations thereof, can be used to detect trace levels of chemical compounds in vivo with high selectivity.

Single walled carbon nanotubes (SWNT) are promising platforms for sensing applications in photosynthetic organisms. They photoluminesce in the near infrared (NIR) in which plant tissues are relatively transparent, do not photobleach, and allow detection at the single particle level. See, Giraldo, J. et al. Plant nanobionics approach to augment photosynthesis and biochemical sensing. Nat. Mater. 13, 400-408 (2014), and Zhang, J. et al. Single molecule detection of nitric oxide enabled by d(AT)15 DNA adsorbed to near infrared fluorescent single-walled carbon nanotubes. J. Am. Chem. Soc. 133, 567-581 (2011), each of which is incorporated by reference in its entirety. SWNT are well suited for the detection of trace levels of chemical compounds with short lifetimes within plants and the environment such as hydrogen peroxide (H2O2) and nitric oxide (NO). Dyes with intrinsic fluorescence in visible wavelengths have been traditionally used for imaging H2O23 and NO4. See, Rhee, S. G., Chang, T.-S., Jeong, W. & Kang, D. Methods for detection and measurement of hydrogen peroxide inside and outside of cells. Mol. Cells 29, 539-49 (2010), and Foissner, I., Wendehenne, D., Langebartels, C. & Durner, J. In vivo imaging of an elicitor-induced nitric oxide burst in tobacco. The Plant journal 23, 817-24 (2000), each of which is incorporated by reference in its entirety. Although these fluorophores enable imaging with cellular resolution, in real time, they present a set of complex problems for in vivo visualization in plant tissues. See, Swanson, S. J., Choi, W.-G., Chanoca, A. & Gilroy, S. In vivo imaging of Ca2+, pH, and reactive oxygen species using fluorescent probes in plants. Annu. Rev. Plant Biol. 62, 273-97 (2011), which is incorporated by reference in its entirety. Amplex red is widely used for imaging low concentrations of hydrogen peroxide but has been rarely used in plants due to its photodegradation. See, Driever, S. M., Fryer, M. J., Mullineaux, P. M. & Baker, N. R. in Plant signal Transduct. (Pfannschmidt, T.) 479, 109-116 (Humana Press, 2009), which is incorporated by reference in its entirety. The membrane permeable H2DCF-DA dye has been commonly used in plants despite its relatively non-selectivity to reactive oxygen species (ROS) and susceptibility to photo-oxidation and photobleaching. Imaging of NO in living plant cells has been performed with diamionofluoresceins with the disadvantage that their fluorescein chromophore is responsive to changes in pH. See, Vitecek, J., Reinohl, V. & Jones, R. L. Measuring NO production by plant tissues and suspension cultured cells. Mol. Plant 1,270-84 (2008), which is incorporated by reference in its entirety. In contrast, SWNT do not exhibit photodegradation and can be excited with light sources off-resonance of photosynthetic pigments. Furthermore, recent advances enable simple and fast delivery of SWNT to leaf living tissues, which has the potential to expand free radical imaging to any plant species. However, lack of specificity of SWNT NIR fluorescence response to biochemicals impairs their applications as highly selective photostable fluorescence sensors in vivo.

Ratiometric and multiplexed sensors from single chirality carbon nanotubes


Embodiments described herein provide an implant for rigid intramedullary fixation of the hindfoot complex with the midfoot and/or forefoot and methods of implanting the same. Embodiments described herein can allow for the implant to be adapted to the patient based upon the extent of bone loss and instability. Embodiments herein also provide a jig system to facilitate the shaping of the foot and/or the implantation of the described internal fixation systems.

Ankle fusion typically involves using various fasteners (e.g., nails, pins, screws, etc.) to hold the bones together. In a typical fusion surgery, the ankle joint is fused, allowing the tibia (shinbone) to grow together or fuse with the talus bone, the bone of the ankle that would normally articulate with the tibia and fibula, and the calcaneus, the bone that forms the ankle joint. A long ankle arthrodesis "nail" may be inserted through the heel and fixed into place with screws or pins. Often, one or more screws or pins are inserted into the calcaneus, the bone at the lower back part of the foot forming the heel, which provides more stability.
This type of surgical correction and fixation can be required in instances of complex deformities and instabilities of the foot and ankle that are associated with loss of bone stock (e.g. after extended injuries, failed primary reconstruction, failed ankle prostheses), neuropathic bone disruption (e.g. Charcot neuroarthropathy), neurogenic disorders (e.g. irreducible muscular contractures, not managing deformation forces, not manageable muscular palsy), and soft tissue deficiencies (e.g. loss of soft tissues, unstable scars). For such conditions, one goal of treatment is to obtain a stable foot in neutral position that allows the patient to fully weight-bear his or her foot without fear of further damage to the plantar skin (e.g. avoidance of ulceration).
Achieving such a goal with internal fixation is challenging because current devices do not provide adequate support in a transverse/axial plane (e.g., in the midfoot or forefoot region), nor in the sagittal and coronal plane (e.g., in the hindfoot or ankle region). In particular, plate and screw fixation often fail because of inadequate bone healing, loss of fixation, or fatigue. Alternatively, intramedullary fixation that utilizes a tibial rod, may withstand some of the forces, but these solutions fail to achieve stability in the midfoot and forefoot.
For this reason, many clinicians continue to use an external fixator. However, this treatment modality is time consuming for the surgeon and the surrounding paramedical staff and is often associated with additional problems, such as pin tract infections. Patients do not generally like this treatment because of long-time impairment and the very demanding daily care.
Another issue with complex reconstructions or stabilizations of the foot and ankle encountered by surgeons is the ability to obtain a foot in neutral position in all three planes and to restore the longitudinal arch 52 to avoid or relieve pain and ulceration beneath the midfoot. Part of the difficulty derives from being unable to observe the foot in a loaded condition.

Internal ankle fixation systems, foot securement and jig devices, and related methods


An electronic circuit comprising is provided with a current sense amplifier. The amplifier comprises a reference current input terminal, a sense current input terminal, and a first output terminal. The electronic circuit includes a reference current source. The reference current source includes two reference n-FET stacks connected in series, and the reference current input terminal is coupled to a ground terminal via the two reference n-FET stacks. The electronic circuit includes a plurality of memory cells each coupled in parallel via a respective sense n-FET stack to the sense current input terminal. The amplifier is configured to generate a first logical value at the first output terminal of the amplifier in response to a sense current of the sense current input terminal being lower than a reference current of the reference current input terminal. The amplifier is further configured to generate a second logical value at the first output terminal of the amplifier in response to the sense current being higher than the reference current.

Technical Field
The present embodiments relate to integrated circuits. More specifically, the present embodiments relate to an improved current sense amplifier equipped with an advanced reference current generator.
Description of the Prior Art
Several techniques may be implemented to read data in a memory cell. For instance a current sense amplifier may be used for reading data stored in a memory cell. In this regard, the current sense amplifier may compare cell current to a reference current. The reference current may be a current of a reference memory cell. When the memory cell is coupled to the current sense amplifier via a bit line it causes two different currents flowing in the bit line depending on a logical value ("0" or "1") stored in the memory cell. Based on comparison of the current in the bit line against the reference current, the current sense amplifier determines the logical value stored in the memory cell. The choice of current sense amplifiers for reading data stored in the memory cells is determined by the fact that the bit lines have high capacitance. Thus, evaluation of currents flowing in the bit lines enables faster operation of digital circuitry in comparison with the case when evaluation of voltages is used for reading of data stored in the memory cells.

Current-mode sense amplifier and reference current circuitry


A semiconductor device which includes a field effect transistor having a gate electrode on the upper side of a semiconductor substrate, with a gate insulation film therebetween, wherein at least the gate insulation film side of the gate electrode includes a film containing hafnium and silicon.

The present invention relates to a semiconductor device and a method of manufacturing the same such that the leakage current can be restrained and the gate insulation film can be made thinner.
Enhancement of the degree of integration and the operating speed of transistors has been realized by miniaturizing the transistors based on the scaling rule. Thinning of the gate insulation film has progressed, and, for example, in transistors with a gate length of 0.1 μm or less, it may be necessary to reduce the thickness of the gate insulation film to or below 2 nm. Ordinarily, polycrystalline silicon (hereinafter referred to as poly-Si) has been used as a gate electrode material. The reason lies in that when poly-Si is thus used, the interface between the gate electrode and the gate insulation film therebeneath is stable, and it is easy to introduce an impurity into poly-Si by techniques such as implantation, diffusion, etc., so that it is possible, by selecting the element and concentration of the impurity, to provide each of N-channel MOS field effect transistors (hereinafter referred to as NMOSFET) and P-channel MOS field effect transistors (hereinafter referred to as PMOSFET) with a gate electrode having an optimum work function and to obtain an optimum threshold value.
However, attendant on the progress of miniaturization of transistors, the problem of depletion of the gate electrode has come to be conspicuous. The depletion of the gate electrode is a phenomenon which is difficult to restrain, since poly-Si is a semiconductor. To cope with this problem, it has been widely reported that the depletion of the gate electrode can be restrained by forming a metallic film, in place of poly-Si film, directly on the gate insulation film, and attention has been paid to the development of a metal gate.
However, in the case where the metal gate is formed of a single metal, the work function of the gate electrode is the same for both the NMOSFET and the PMOSFET; therefore, unlike the case of the conventional poly-Si gate, it is difficult to control the work functions of the gate electrodes of the NMOSFET and the PMOSFET, and it may be impossible to obtain an appropriate threshold value. To overcome this problem, there has been proposed a dual-metal gate, in which metallic materials are so selected that the metal gate electrode of the NMOSFET has a work function similar to that of the N-type poly-Si whereas the metal gate electrode of the PMOSFET has a work function similar to that of the P-type poly-Si (see, for example, Chang Seo Park, Byung Jin Cho, Dim-Lee Kwong "Thermally Stable Fully Silicided Hf-Silicide Metal-Gate Electrode," IEEE ELECTRON DEVICE LETTERS, Vol 25, No. 6, June 2004).
For obtaining a threshold suited to an NMOSFET, a metallic material having a work function around 4.0 eV is suitable. Though hafnium (Hf), zirconium (Zr) and the like have work functions suitable for NMOSFET, they are high in reactivity and, hence, would cause reduction of the underlying gate insulation film (see, for example, Y. Akasaka et al. "Material Selection for the Metal Gate/High-K Transistors," Ext. Abst. SSDM 2004, p. 196). Besides, in this case, reactivity between the gate insulation film and the gate electrode is so high that the gate insulation film would become thinner, which may increase the leakage current.
The leakage characteristics in the case where hafnium (Hf) is used for the gate electrode and silicon oxide (SiO2) is used for the gate insulation film were evaluated. The results will be described referring to FIG. 9 which is a diagram showing the relationship between gate voltage and leakage current. As shown in FIG. 9, it was found that a rise in gate electrode increases leakage current. This indicates that hafnium (Hf), which is high in reactivity with silicon oxide, breaks the gate insulation film formed of silicon oxide (SiO2), thereby increasing the leakage current.

Semiconductor device and method of manufacturing the same


A full-automatic detecting system and method for a transformer. The system comprises a material delivery line; a feed device; a detection delivery line; insulating test devices; error detecting devices; a laser marking device; a discharge device; and a detection management system. The insulating test devices, the error detecting devices, and the laser marking device are sequentially arranged beside the detection delivery line. The material delivery line, the detection delivery line, and the devices work in coordination, to realize full-automatic detection of the transformer, avoid manual detection errors and improve the sorting accuracy.

Currently, current transformers used in a power grid proportionally reduce a large current in the primary circuit to a small current required in a secondary measurement circuit, mainly achieving electric isolation between the high voltage end and low voltage end and proportional measurement. The metering current transformer is one of main metering instruments for trade settlement in the power grid, and falls into scope prescribed in the mandatory test specifications of China. Each metering current transformer can only be put into normal use after being verified to be qualified by passing the initial examination and the periodic examinations. With rapid development of economy, both the increment and the holding of the metering current transformers have grown sharply. The traditional manual examining method, due to problems such as low working efficiency, labor-intensive and intervening to examining results by manual wire connecting, can not fulfill the increasing demand for examining transformers any more, thus it is necessary to develop a system for examining current transformers full-automatically.
In a conventional device for examining transformers, a semi-automatic working mode is adopted, wire connecting and disconnecting are performed manually, and the examining device performs the basic error examinations automatically. However, insulation tests, such as the insulation resistance test, the withstand voltage test, the inter-turn insulation test and the magnetic saturation margin test, are all required to be performed manually, so the working efficiency is rather low, and some examinations even can not be performed owing to the limitation of the capacity of the examining devices.
Low-voltage current transformers are divided into two types: bus-type (bus mode) current transformers and multi-turn-type (multi-turn mode) current transformers. The primary winding connecting methods for the two types of current transformers are different and external dimensions, diameters and positions of center-holes for bus-type current transformers of different transformation ratios are different, thus the system for examining current transformers needs to meet the requirement of different wire connecting modes and different dimensions from bus-type current transformers and multi-turn-type current transformers. A single conventional device for examining current transformers full-automatically can not fulfill the demand for examining huge numbers of transformers, and do not have the advantages of automatic production line, hence integration of multiple devices for examining current transformers is required in the system for examining transformers.
To sum up, it is significant to develop a system for examining current transformers full-automatically, which is adapted for bus-type current transformers and multi-turn-type current transformers, and is an integration of multiple examining devices and a conveying line.

Full-automatic detecting system and method for transformer


Provided herein is a port apparatus and method for inserting a tube device, in particular peritoneal dialysis catheters, into an organism. Access to the peritoneal cavity for dialysis is established by creating a controlled cutaneoperitoneal fistula with a catheter device that bridges the abdominal wall. The apparatus is designed to minimize the occurrence of mechanical complications associated with traditional catheter implantation techniques, such as catheter obstruction from the omentum, catheter displacement to a position of poor drainage function, leaks and hernias. The device is capable of performing its functions in a simple, safe, accurate, reproducible, and expeditious fashion.

Peritoneal dialysis as a modality of renal replacement therapy for end-stage renal disease depends upon functional long-term access to the peritoneal cavity. Access is established by creating a controlled cutaneoperitoneal fistula with a catheter device that bridges the abdominal wall. After infectious complications, mechanical problems are the most common difficulties that threaten the functionality of the catheter. Mechanical problems include flow obstruction from blockage of the catheter tip by omentum, displacement of the intraperitoneal catheter segment to a position of poor drainage function, pericannular leakage of dialysate fluid through the abdominal wall, and hernia formation produced by abdominal wall weakening at the catheter insertion site.
Flow dysfunction produced by catheter obstruction or displacement generally follows 7–31% of catheter implantation procedures. Pericannular leaks and hernias complicate 5–27% of catheter insertions. The consequences of mechanical complications include additional operative procedures to remedy the problem, replacement of the catheter, or loss of the option of peritoneal dialysis as renal replacement therapy with permanent transfer to hemodialysis.
Shifting the catheter insertion site away from the abdominal midline to lateral placement through the body of the rectus muscle has reduced the incidence of pericannular leaks and hernias. Improved results for lateral placement are related to the physical characteristics of the abdominal wall in that lateral location: (i) two thick fascial layers, (ii) the thick body of the rectus muscle, and (iii) propensity for strong tissue ingrowth of anchoring polyester catheter cuffs from the rich muscle blood supply. Although generally improved with lateral placement, the incidence of pericannular leaks continues to range from 0–18%.
Varying degrees of oblique passage of the dialysis catheter through the abdominal wall in a craniocaudad direction have been recommended to maintain pelvic orientation of the catheter thereby reducing the risk of omental entrapment and catheter tip migration. Shorter abdominal wall tunneling was associated with a 9–11% incidence of catheter flow dysfunction while longer tunnels had an incidence rate of 0–3%. My own data revealed a 12.8% incidence of flow obstruction utilizing approximately a 45° oblique passage through the abdominal wall compared to 0.7% incidence associated with a 4–6 cm tunnel through the rectus muscle sheath (Crabtree, unpublished data).
The use of laparoscopically directed percutaneous methods of catheter insertion compared to the more invasive implantation by an open laparotomy incision is generally reported to reduce the incidence of flow dysfunction and pericannular leaks although, exceptions to these findings exist. Using visual guidance, the laparoscopic approach provides more precise intraperitoneal placement of the catheter and less tissue disruption from the standpoint that it constitutes a percutaneous puncture technique (see, for example, "A Laparoscopic Approach Under Local Anesthesia for Peritoneal Dialysis Access", Crabtree, J. H. and Fishman, A., in Peritoneal Dialysis International, vol. 20 pp.757–765, incorporated herein by reference in its entirety).
Despite the general improvements associated with lateral placement, oblique abdominal wall tunneling, and laparoscopically directed percutaneous insertion, the outcomes remain extremely variable. The wide range of reported outcomes stems from a lack of uniformity in implantation tools and methodology. Devices generally used to perform percutaneous insertion and muscular tunneling are borrowed laparoscopic port cannulas that are oversized, possess dangerous trocar blades, and often require considerable modification that departs from the manner of intended use. The variety of available port devices leaves too much variability in application and thus reduces reproducibility and impedes establishing standard methodology for peritoneal dialysis catheter implantation. Abdominal wall tunneling by open dissection is not practical due to the considerable disruption of tissues required to create a passage of sufficient length. The identified problems with existing tools and methods include excessive tissue dissection that may result from open dissection, which increase the risk for pericannular leaks and hernias and limits the length of an abdominal wall tunnel. Additionally, there is an increase in the risk of hemorrhage, leaks, and hernias associated with utilizing trocar-tipped laparoscopic ports with cutting blades and/or oversized laparoscopic ports. Furthermore, laparoscopic ports utilizing an overlying plastic sleeve for radial expansion limit the length of the abdominal wall tunnel. The unsupported plastic sleeve tends to kink in the tissue tract when a guideneedle is removed and prevents safe insertion of a port cannula.
Presently, approximately 12% of the end-stage renal disease population are on peritoneal dialysis. It is projected that this percentage will increase to 20–30% if proper utilization of cannula insertion and placement is practiced.
Clearly, there is a need for a dedicated apparatus specifically designed to provide improved and safe access to internal area/cavities/lumens, etc. of an organism, particularly the peritoneal cavity for implantation of peritoneal dialysis catheters. In particular applications, the apparatus should allow creation of a long oblique tunnel through the muscular abdominal wall without causing significant tissue disruption or risk of hemorrhage. For laparoscopic use, the apparatus should be capable of preserving pneumatic competence of a pneumoperitoneum created by gas insufflation. Desirable physical characteristics of an apparatus for creating access through an abdominal wall, include having minimal dimensions so as to provide passage of a catheter, for example. When utilized for access to the peritoneal cavity, the apparatus should have pneumatic competence for compatibility with laparoscopic techniques. Provided herein is an apparatus and associated methods of use capable of performing intended functions in a simple, accurate, reproducible, and expeditious fashion.


The present invention relates to the formulation and process for preparation of a fried egg product which may be frozen for future heating within a microwave or other oven for consumption by an individual. Various ingredients are added and mixed to each of the liquid egg white and liquid yolk portions. The liquid egg white portion is preheated and then deposited within a mold for slow cooking under controlled temperature and humidity conditions. The liquid yolk portion is preheated and then is added to the mold for placement on the egg white portion. Following a short period of cooking the mold containing the formulated fried eggs is transported to a freezer unit for freezing, packaging, and storage. At a future time the frozen formulated fried egg product may be retrieved for thawing and cooking for consumption by an individual.

The present invention is directed to a formulation for a fried egg product and process to prepare a premium formulated fried egg for consumption by an individual. It is anticipated that the formulated fried egg product will be refrigerated and/or frozen for future heating within a microwave, convection oven or griddle for consumption as a stand alone food item or as a portion of a composite food article. The formulated fried egg has a texture and other sensory perceptions similar to a naturally fried egg.
In the past, formulated fried eggs have been formed by the filling of a mold with a liquid egg mixture and then cooking the liquid egg mixture within the mold. Many problems have arisen through the implementation of this processing methodology. Formulated fried eggs produced according to the above identified methods unfortunately have the appearance and taste of commercial processing. Frequently these food articles after cooking are extremely dense having poor viscosity. Formulated fried eggs cooked within a mold generally exhibit undesirable sensory perceptions related to the appearance, taste and texture as compared to a freshly fried egg. A need therefore exists to eliminate the dense commercial processing appearance and taste associated with a formulated fried egg product as cooked within a mold.
In the past procedures have generally not been implemented to rigorously control the processing and cooking parameters utilized to yield a formulated fried egg. A need exists to develop a formulated fried egg which is more appealing in appearance and taste and which is susceptible to freezing and reheating within a conventional or microwave heating prior to consumption by an individual.
In the past the freezing and/or extended refrigeration of a formulated fried egg has lead to a loss of a cohesive texture and the degradation of other sensory perceptions such as mouth feel, taste, elasticity, and/or the food product not being tender or appealing to an individual.
Another common problem encountered during delayed consumption, extended refrigeration and/or freezing of a formulated fried egg is that the food product exhibits syneresis, or the loss of water when frozen and reheated, or when stored for an extended period of time.
In the past, temperature variations during the cooking procedure for the formulated fried eggs have caused a degradation in the viscosity, loss of elasticity, and have resulted is a non-smooth, non-cohesive texture. In addition, temperature variations have caused the formulated fried egg to be not tender and fail to easily fracture and break during attempts to rupture the egg yolk portion of the formulated fried egg. The cooking of the formulated fried egg at an elevated temperature, to minimize the duration of the cooking time, frequently results in the burning and degradation of the texture of the formulated fried egg. Also, during rapid cooking the formulated fried eggs easily dehydrate and form a crust which is unappealing to an individual.
The rate of cooking of the formulated fried eggs and the temperature of the oven, or other cooking vessel, also frequently cause the formation of an excessive volume of air bubbles, which in turn, interrupt the structure of the formulated fried egg destroying the smooth, cohesive texture. The loss of a smooth cohesive texture causes an undesirable mouth feel when consumed by an individual. The existence of undesirable and/or excessive air bubbles may also occur when the pH of the formulated fried eggs is at an improper level, preventing the egg whites from retaining carbon dioxide as carbonic acid. The reduction in the amount of carbon dioxide and/or carbonic acid causes the mixing and/or shearing of the egg whites during processing due to undesirable gas entrapment.
In the past the cooking of formulated fried eggs has frequently caused an iron-sulfide greening reaction resulting in undesirable coloration and a degradation in the taste for the egg product.
It is also desirable to provide a formulated fried egg which is natural in appearance. In the past formulated fried eggs have included a symmetrically located egg yolk portion as centrally positioned within a substantially round egg white portion. These types of formulated fried eggs do not appear to be natural. Natural fried eggs experience random yolk positioning and non-symmetrical egg white portions.
The known formulated fried egg processing techniques frequently cause freezing and/or thawing damage to frozen eggs and fail to retain the egg yolk portions in a semi-liquid state after freezing and subsequent thawing and heating. As a result the egg yolk portions of the known formulated fried eggs have not readily fractured, have not provided a semi-liquid state, nor have provided a desired elastic texture.


A battery tray apparatus for receiving and retaining a plurality of batteries includes a body portion having a length and a width. The body portion includes a plurality of first ridge portions extending along the length of the body portion and a plurality of second ridge portions extending along the width of the body portion. The plurality of second ridge portions intersects the plurality of first ridge portions. The plurality of first ridge portions and the plurality of second ridge portions define a plurality of recessed portions for receiving the plurality of batteries and preventing movement of the plurality of batteries relative to the body portion.

Electric/hybrid vehicles typically include a plurality of batteries to provide a source of energy for the vehicle. These batteries are tightly grouped together in order to save space within the vehicle, and are typically secured to a mounting structure that in turn is mounted to the vehicle.
Conventional mounting structures typically consist of a number of piece parts, each of which are formed from advanced composite materials in order to save weight, which is an important design requirement with electric/hybrid vehicles. However, there are several disadvantages to these conventional multi-piece advanced composite structures. For example, the fabrication of each of the parts from composite materials is a complicated, time-consuming and costly process, which adds a considerable amount of cost to the vehicle. Moreover, the assembly of the various piece parts is also a complicated and time-consuming process, which also increases the overall cost of the vehicle. In addition, there is a much higher probability of failure of the mounting structure due to separation at the joints where various composite parts are fastened together. Finally, the large number of holes that are typically required in the composite piece parts reduces the strength of the overall structure.
Accordingly, it would be desirable to have a system and method of retaining a plurality of batteries for an electric/hybrid vehicle that overcomes the disadvantages described.

System of retaining a plurality of batteries for an electric/hybrid vehicle


Some embodiments include a method disposing an integrated circuit die within a housing, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry including first transponder circuitry configured to transmit and receive radio frequency signals, wherein the integrated circuit die is void of external electrical connections for anything except power supply external connections; and disposing second transponder circuitry, discrete from the first transponder circuitry, within the housing, the second transponder circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transponder circuitry are configured to establish wireless communication between one another within the housing, the second transponder circuitry being disposed within 24 inches of the first transponder circuitry within the housing.

As semiconductor integrated circuit (IC) devices continue to shrink in dimension, challenges are posed with respect to packaging the integrated circuitry into microelectronic devices. In some prior art integrated circuitry device, individual IC chips (die) are connected to inner leads of a lead frame by wire bonds. The chip, wire bonds, and inner leads are completely encapsulated for protection with a substance such as plastic or ceramic. Outer leads communicate with the inner leads of the lead frame, but the outer leads typically remain exposed for mounting of the packaged device to external circuitry, such as a printed circuit board. Exemplary constructions are disclosed in U.S. Pat. Nos. 5,734,198, 5,736,783, 5,763,945, 5,818,105 5,117,068, and 5,692,298, the disclosures of which are incorporated by reference herein.
In a conventional construction, a semiconductor die is placed on and bonded to a center die paddle of a lead frame for support. Inner lead fingers of the lead frame are disposed proximate the paddle but do not contact or communicate with the paddle. Rather, wire bonds communicate between contact pads (terminals) on the die and the inner lead fingers of the lead frame by spanning a gap between the die and the fingers. The wire bonds allow for the transmission of electrical signals between the die and the lead frame. The lead fingers allow the chip or die to be electrically connected with other chips or die for providing an operable microelectronic device.
Wire bonds can be problematic for a number of different reasons. First, additional processing steps are needed to ensure that the wire bonds are adequately formed between the lead frame and bond pads on the integrated circuit die. Such processing requires precise placement of the wire bonds or the operation of the integrated circuit die can be compromised. Additionally, because wire bonds are typically very thin electrical connections they can become disconnected and cause operational failure of the finished device.
Accordingly, this invention arose out of concerns associated with providing improved microelectronic devices and methods of forming the same which reduce processing complexities and provide for improved performance.

Methods of operating electronic devices, and methods of providing electronic devices


A compound body has a first body part (15) made of glass and a mechanical connection (20, 60) which is melted on the first body part (15) and contains aluminum.

FIG. 1 shows different known compound bodies and implicitly the production processes thereof. FIG. 1a shows the vacuum-tight passage of a wire 10 through a glass wall 15. Here, the wire is preglazed as indicated by the dashed outline 16. Thereafter, it is melted into a glass tube end (FIG. 1a) or in a glass plate (FIG. 1b). In this case, glass and metal are chosen such that the courses of their coefficients of thermal expansion are as similar as possible from melting point to cooling ("fully adapted"). However, if this full adaptation is not possible, tension cracks may occur in the glass or the wire can separate from the glass. If for directly melting the metal into the glass the misadaptation therebetween is excessively great, the tension can be compensated for stepwise by intermediate glasses 17a to 17c and/or by a dome geometry 17d, as shown in FIG. 1c.
FIG. 1d shows what is called a "cutting edge glassing", FIG. 1e shows "foil squeezing". Here, each metal partner 11, 13 is thin enough to compensate for the optionally occurring deformations so that no dangerous tensions occur in the glass.
FIG. 1f shows the principle of "pressure glassing". Wire 10 and metal plate 12 have a coefficient of expansion somewhat higher than that of the melting glass 15. However, no tension cracks occur in the glass part 15 because following melting-in the metal 12 is shrunk onto the glass 15, thus producing a compressive stress.
FIG. 1g shows an embodiment in which a metallic cap 11 is stuck on a glass tube 15 by means of an epoxy adhesive 18.
FIG. 1h shows the connection of two glass s 15, 14 by means of indium 19.
The compound bodies shown in FIG. 1 have one or more of the following drawbacks:                The classical melting-in metals tungsten, molybdenum, iron/nickel alloys, iron/cobalt/nickel alloys and copper-clad wires are relatively expensive since they have to be drawn without any defects and be provided with special coatings so as to obtain a successful glass/metal connection.        Glasses have to be used which, e.g. as regards their strain properties, are adapted as accurately as possible to the melted-in metals. This limits the selection of the glass.        The use of intermediate glasses (FIG. 1c) often calls for glass-blowing handicraft and is otherwise time-consuming and expensive.        The production of thin, deep-drawn parts (FIG. 1d) or the use of pin/sheet/pin (FIG. 1e) is expensive.        Indium-containing solders (FIG. 1h) are expensive and not temperature-resistant.        Alloys made of iron/cobalt/nickel have a high specific electric resistance.        Adhesions (FIG. 1g) are not durable and water-permeable.
DE-AS 2150092 discloses a process for connecting glass or ceramics with metals. The metal used is an aluminum-containing copper alloy having an aluminum oxide-containing surface layer. The drawback of this approach is the little ductility and thus poor resistance to thermal shocks and the insufficient connection between glass and metal resulting from the aluminum oxide.
DE-AS 2018752 discloses a process for the gas-tight connection of metal and glass surfaces. The process operates within temperature ranges below the melting point of the metal and forces the surfaces to be connected against each other at high pressure. The drawback of this process is that the resulting connections are insufficient and that it can only be used with rather simple geometries. There is only little resistance to thermal shocks.
DE 3827318A1 discloses a seal between ceramic and metallic articles. Here, a metallic compound sealing element having aluminum as the main constituent is provided with a coating consisting of another metal. The metal is then contacted with the other components and heated above the melting point. The drawback is the elaborate production, the insufficient deformability and the little ductility on the contact surface, which results in a deteriorated resistance to thermal shocks.
It is the object of this invention to provide a compound body which has a firm, durable and vacuum-tight connection resistant to thermal shocks and can be produced at a low price, and a process for the production of a mechanical connection with which a compound body having the above properties can be produced.
This object is achieved by the features of the independent claims. Dependent claims are directed to preferred embodiments of the invention.

Compound body and a process for the production of a mechanical connection

PerkinElmer Optoelectronics GmbH & Co. KG


One or more digital representations of single- (101) and/or few-layer (102) thin-film material are automatically identified robustly and reliably in a digital image (100), the digital image (100) having a predetermined number of color components, by—determining (304) a background color component of the digital image (100) for each color component, and—determining or estimating (306) a color component of thin-film material to be identified in the digital image (100) for each color component by obtaining a pre-determined contrast value (CR; CG; CB) for each color component and multiplying the respective background color component with a numerical difference between the pre-determined contrast value (CR; CG; CB) for a given color component and about 1,—identifying points or parts of the image with all color components being within a predetermined range of the determined or estimated color component.

Graphene is a two dimensional material comprising a single layer of carbon atoms arranged in a honeycomb grid. It has many advantageous room temperature properties like almost twice the electrical conductivity of copper, more than ten times the thermal conductivity of silver, almost thirty times the electron mobility of silicon, about 5 times the tensile or Young's modulus of steel, and more than 45 times the tensile strength of diamond.
These properties enable many uses and improvements when using graphene.
High quality graphene may e.g. be obtained by a technique usually referred to as micro-cleaving or micro-mechanically cleaving or various exfoliation methods.
Alternatively, graphene can be 'grown' using chemical vapour deposition (CVD) methods. However, a drawback of CVD is that graphene typically is 'grown' on copper or nickel and then need to be moved to another usable substrate using a so-called transfer technique. Furthermore, each coherent area of graphene obtained in this way is relatively small, i.e. CVD graphene can be seen as comprising a larger number of much smaller adjacent graphene areas.
Graphene has a thickness of only 0.335 nm whereby characterization tools involving equipment such as atomic force microscope (AFM), scanning tunneling microscope (STM), or scanning electron microscope (SEM) often is used to properly and reliably identify graphene. However, using these techniques is time consuming and the equipment is also relatively costly.
Furthermore, given that coverage of research or similar grade single-layer micro-cleaved graphene is typically only some few thousand μm2 on a 4″ wafer or similar, such time consuming identification methods are not practical for large-scale production or research use.
Alternatively, manual identification of graphene—which is still used—is slow, tedious and/or error-prone, especially for fragmented samples. Typical time spent on manual identification of graphene is e.g. about 5 seconds pr. digital image and about 6-7 hours for a 4″ wafer when digitised at an appropriate resolution needed to properly identify graphene.
Patent application US 2011/0299720 discloses to an automated approach for determining a number of atomic planes in layered material samples. According to one aspect, calibration is carried out for a thin film material under specific illumination conditions where a correlation is determined between the number of layers of the layered thin film material and a range of colour component values. The correlation is then used to determine the number of layers in a selected region of an image for another sample comprising the same material as used during the calibration. For accurate results, the image needs to be captured under the same illumination conditions as used during the calibration.
Calibration is carried out e.g. using micro-Raman spectroscopy and atomic force microscopy (AFM).
Once the calibration is carried out, it may be used for layer detection for other samples as long as the sample material and the calibration material is the same, the substrate for the calibration material and for the sample material is the same, and the illumination conditions stay the same.
However, it is not practically simple ensuring that illumination conditions truly stay the same and a given sample material will always have small variations e.g. in thickness, even across the sample material.
Thus, there is a need for an automated simple, reliable, robust, and/or efficient way of identifying graphene and/or other thin-film materials in a digital image.

Automatic identification of single- and/or few-layer thin-film material


A method for manufacturing a solid electrolytic capacitor has the steps of: mixing valve metal powders with organic binder for granulation, press-molding granulated powders embedded with a valve metal lead, sintering a press-molded compact in vacuum to produce a sintered body, and anodizing the sintered body to form a dielectric oxide film layer. The method further has a step of performing a cathode electrolytic cleaning to the sintered body before the step of forming the dielectric oxide film layer. The cathode electrolytic cleaning is performed in an acid solution, which is a mixed acid solution of hydrofluoric acid, nitric acid, and sulfuric acid.

1. Field of the Invention
The present invention relates to a solid electrolytic capacitor, and particularly to a method for manufacturing a solid electrolytic capacitor using a sintered body of valve metal.
2. Description of the Related Art
Solid electrolytic capacitors employ, as an anode, valve metal such as tantalum, niobium, and aluminum. Solid electrolytic capacitors represented by tantalum capacitors, niobium capacitors use a high melting point material as a valve metal. In these capacitors, anode members are fabricated by sintering a pressed compact of valve metal powders
FIG. 4 is typical example of such capacitors. In FIG. 4, a solid electrolytic capacitor 100 has an anode body 1 in which an anode lead 2 is embedded, a solid electrolyte layer 4 formed on an oxide film layer 3 on the surface of the anode body 1, a graphite layer 5, and a silver layer 6, formed over the surface of the solid electrolyte layer 4. The anode lead 2 is connected with an anode terminal 9, and the silver layer 6 is fixed, through a silver adhesive layer 7, to a cathode terminal 10. The entire body is covered with a resin mold 8 with the anode and cathode terminals 9, 10 exposed to the bottom the capacitor.
An anode body used in such a solid electrolytic capacitor is formed through various steps. Referring to a process flow diagram in FIG. 3, valve metal powders are mixed and granulated with organic binder in order to improve fluidity of the powders in press-molding valve metal powders and adhesiveness among the powders after press-molding (at S1). Next, the granulated powders are press-molded to produce a pressed compact thereof (at S2). The compact is sintered in vacuum to form a sintered body (at S3), and then a dielectric oxide film layer is formed through anodization to provide the anode body (at S4). Further, to complete a solid electrolytic capacitor, a solid electrolyte is formed on the dielectric oxide film layer of the anode body (at S5). Subsequently, a graphite layer is formed on the solid electrolyte (at S6) and a silver layer is formed on the graphite layer (at S7). Then, electrical connections are made between the silver layer and a cathode terminal and between an anode lead and an anode terminal (at S8), and an overmolding process follows (at S9).
Organic binder used in the granulation step is generally removed by thermal decomposition and flying in all directions in the sintering step in vacuum. However, in this removal process, residuals of the organic binder are easy to remain on the sintered body. In the case where binder residuals remain on the sintered body of valve metal, impurities such as charred metals are formed in an oxide film formed thereafter, and a problem arises that such impurities cause leakage current in a completed capacitor.
Typically, solid electrolytic capacitors having, for example, a rated voltage of 10V and a capacitance of 10 μF show a leakage current of 10 μA or less. However, further reduction in leakage current is required. Typically, 1 μA or less is preferred.
Japanese Unexamined Patent Application Publication (JP-A) No. 2004-335630 discloses a method for manufacturing a solid electrolytic capacitor in which the binder residual concentration of the sintered body is reduced to suppress leakage current. According to the method, water soluble solid binder and organic solvent soluble binder are used as binders for the granulation process. In order to remove the binders from a shaped form, two dissolution cleaning processes of organic solvent immersion and warm pure water immersion are performed in series between the press-molding and the sintering.

Method for manufacturing a solid electrolytic capacitor


A power slip that utilizes modified SDXL slips and regular drilling bowls that fits to the pin drive master bushings of the rotary table and utilizes the depth of the drive pin holes as part of the actuators, thus allowing the power slip to set lower for added clearance and safety during drilling operations. Cables are anchored to a base plate and slip linkages and slip connectors are pivotally mounted to the slips and to the top plate so that, when the lift cylinders are actuated, the slips are moved to the released position. This two-stage linkage and cable design maximizes the movement of the slip assemblies while minimizing vertical movement of the power slip's housing. The base plate of the power slip is provided with a plurality of tubular pins adapted for mounting the base plate to the pin master bushing of a rotary table, and a portion of the lift cylinder is positioned in the interior hollow pins to maximize the movement of the slip assemblies upon actuation of the lift cylinders while minimizing the vertical dimension of the power slip.

The present invention relates to an improved slip for gripping tubulars in a rotary table to support the tubular from the table. In more detail, the present invention relates to a power slip that provides full retraction of the slip segments that is of minimal vertical dimension for added safety and ease of use. The present invention is particularly useful for running drill pipe into and out of a well bore and for running casing pipe into a well bore.
There are various situations in which it is necessary or desirable to temporarily support the weight of a drill or casing string with tapered slips received within a tapered slip bowl while an upper joint or stand of pipe, or other structure, is being connected to or disconnected from the string. To speed the set and release of such slips, a number of power slips are available that act to move the slip segments upwardly and downwardly (relative to a co-acting slip bowl) into and out of engagement with the tapering camming surface of the bowl, and therefore into and out of engagement with the drill pipe or casing joint. Examples of such slips include the VARCO PS-15 and PS-16 (National Oilwell Varco, Houston, Tex.) power slips as well as those available from Den-Con Tool Co. (Oklahoma City, Okla.).
Although these prior power slips are in current use and function for their intended purpose, there are a number of opportunities for improvements, particularly in connection with their ease of use. One such opportunity for improvement relates to the vertical height of the power slip, and therefore its size, weight, and ease of installation. More importantly, however, a short power slip provides advantages in safety and clearance.
These advantages of safety and clearance are provided by using pins that sit down into the holes in the pin drive master bushing to provide additional vertical stroke for the cylinders that lift the slips to the raised position up and away from the drill pipe or casing, thereby providing sufficient retraction of the slips while minimizing the vertical dimension of the power slip.
The power slip of the present invention also provides an advantage over known prior art slips (such as the Varco power slip) in that it utilizes a dual linkage and independent slip assemblies. The dual linkage provides for additional stroke length in retracting the slips by folding upwardly upon itself. Independent slip assemblies (as compared to the slip assemblies in known prior art power slips, which are linked with a hinged pin connection, and retract and set the same distance at the same time) allow the power slip of the present invention to accommodate off-center drill pipe and/or casing.
Known prior art power slips utilize gravity to cause the slips to fall back into the retracted position. The Varco PS-15 and PS-16 power slips, for instance, are provided with steps on the back of the slip segments for the purpose of facilitating the falling of the slips back from the pipe. The power slip of the present invention, however, utilizes a cable to pull the slips up and back away from the drill pipe and/or casing, thus providing a positive clearance between the tubular and the opening through the power slip, all while minimizing the vertical height of the power slip and maintaining sufficient stroke to fully retract the slip segments.
It is, therefore, an object of the present invention to provide a power slip with minimal vertical height that also provides sufficient retraction of the slips to insure that the slips are raised far enough from drill pipe or casing positioned between the slips to provide sufficient clearance when in the retracted position while providing the advantages of safety and clearance off a power slip of minimal height.
Another object of the present invention is to provide a power slip that uses a modified set of SDXL slip segments (so-called "extra long slips" as known in the art), eliminating the need for a guide ring and allowing for regular drilling bowls to be used as a back-up for the slips.
Another object of the present invention is to provide a power slip that directly engages the pin drive master bushings of the rotary table, utilizing the depth of the drive pin holes as part of the actuators, thus allowing the power slip to set at a lower height.
Another object of the present invention is to provide a power slip that fits directly over the master bushing, with no panels or other equipment extending over the rotary table, reducing the likelihood of possible injury and facilitating movement by rig personnel.
Other objects, and the many advantages of the present invention, will be made clear to those skilled in the art in the following detailed description of several preferred embodiments of the present invention and the drawings appended hereto. Those skilled in the art will recognize, however, that the embodiments of the invention described herein are only examples provided for the purpose of describing the making and using of the present invention and that they are not the only embodiments of power slips that are constructed in accordance with the teachings of the present invention.


A rotary drive includes: a support structure; and a linear actuator supported by the support structure. The linear actuator includes: a first member; a second member that moves in a linear direction relative to the first member when a drive signal is applied to the linear actuator; and a bearing arrangement supporting the first and second members within the support structure and enabling independent movement of the first member and the second member relative to the support structure. The rotary drive also includes a linear-to-rotary converter to which the second member of the linear actuator is coupled. The linear-to-rotary converter includes an output member having a rotational axis. During operation, the linear-to-rotary converter converts linear reciprocating movement of the second member of the linear actuator to rotary movement of the output member about the rotational axis.

There is a class of electric motors that produce rotary motion from linear motion. They do this by using a linear-to-rotary converter, one example of which is a cam. One such type of motor is described in U.S. Patent Pub. No. 2011/0108339. The embodiments described herein are other examples of such motors.

Actuator configuration for a rotary drive


Bisphosphoramidates such as N,N'-bis[di-(2,6-xylenoxy)phosphinyl]piperazine are effective flame retardant agents for thermoplastic polymers and blends thereof. In addition, the blends containing such bisphosphoramidates have excellent high temperature properties, as demonstrated by high heat deflection temperatures and a low tendency to decrease glass transition temperature.

This invention relates to flame retardation, and more particularly to the use of a specific class of compounds as flame retardants for polymers.
Improvement of the fire resistant properties of polymers has long been a goal of polymer compounders. Fire resistance is typically evaluated by the UL-94 test of Underwriters Laboratories (ASTM procedure D3801). In this test, the desirable V-0 rating is given to polymers of which specimens do not burn with flaming combustion for more than 10 seconds after application of a test flame, and specimens do not burn with flaming combustion for a time exceeding 50 seconds upon 2 flame applications to each of 5 specimens; i.e., the total "flame-out time" (FOT) for said samples is not greater than 50 seconds.
Various types of chemical compounds may be employed as flame retardancy additives. They include halogenated and especially brominated compounds and phosphate-based compounds. Such additives are often employed in combination with anti-drip agents such as fluorocarbon polymers, and synergists such as antimony halides.
It is desirable in some instances to employ exclusively phosphate-based compounds. Among the compounds known to be useful for this purpose are the bis(diaryl phosphate) esters of dihydroxyaromatic compounds, as illustrated by resorcinol bis(diphenyl phosphate), hydroquinone bis(diphenyl phosphate) and bisphenol A bis(diphenyl phosphate). These compounds, however, frequently also have undesirable effects on the high temperature properties of the polymer substrates, as demonstrated by a pronounced decrease in heat deflection temperature (HDT) and/or glass transition temperature (Tg).
It is of interest, therefore, to develop resinous blends containing phosphate-based flame retardant additives having a minimum effect on the high temperature properties of the blends.

Resinous compositions containing aromatic bisphosphoramidates as flame retardants


An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; stacking a first device over the support structure; stacking a second device over the first device; connecting the first device and the second device to the lead-finger system; stacking a dummy device over the second device; and exposing a support structure bottom side and a dummy device top side for thermal dissipation.

Integrated circuits are what power many of today's consumer electronics. Integrated circuits can be found in cellphones, video cameras, portable music players, computers, and even automobiles. As customer demand improves integrated circuit (IC) performance, faster, more reliable, and higher-density circuits, need to be produced. Various techniques, such as, ball grid array (BGA), flip-chip, and multi-chip modules (MCM), have been developed to meet the continued demands for improving system performance and hardware capabilities, while the space in which to provide these improved hardware capabilities continues to decrease.
MCM may include two or more chips stacked one on top of another (i.e.—vertically stacked). This mounting technique permits a higher density of chips or integrated circuits on the MCM substrate. The MCM substrate may include one or more layers of electrically conductive material separated by dielectric materials.
Although vertically stacked MCM's may increase the effective density of chips, over that of horizontally placed MCM components, it has the disadvantage in that the MCM's must usually be assembled before the component chips and chip connections can be tested. These extra manufacturing steps can lead to increased cost and decreased product yield if the chips are defective.
Another common problem associated with vertically stacked MCM's is that the bottom chip must be larger than the top chip to accommodate the plurality of bond pads located on the bottom chip. Due to the constraint of limited space available for mounting individual chips on a substrate, the larger configuration of the bottom chip decreases the number of chips per semiconductor wafer, and correspondingly, increases the cost of manufacturing. Additionally, since the top chip must be made smaller than the bottom chip, the top chip possesses less space for electronic components and circuits, which is counter to the goal of developing higher density integrated circuits.
Another problem of vertically stacked MCM's is the lack of sufficient thermal dissipation. Insufficient thermal dissipation can lead to package over heating and chip bonding problems. Chip bonding problems arise when high temperatures trigger thermal expansion differences between disparate materials within a package. These differences in thermal expansion rates can lead to warpage, delamination and chip cracking problems.
Thus, a need still remains for a reliable integrated circuit package system and method of fabrication, wherein the integrated circuit package system possesses a high-density of integrated circuits while preventing warpage and delamination problems. In view of the ever-increasing commercial competitive pressures, increasing consumer expectations, and diminishing opportunities for meaningful product differentiation in the marketplace, it is increasingly critical that answers be found to these problems. Moreover, the ever-increasing need to save costs, improve efficiencies, and meet such competitive pressures adds even greater urgency to the critical necessity that answers be found to these problems.
Solutions to these problems have been long sought but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art.

Integrated circuit package system employing structural support


In a communications network where cross-connect nodes are organized according to geographic domains, a domain connectivity table indicates intra-domain connectivity of each domain and a domain routing table indicates a route specifying those nodes whose intra-domain connectivity is indicated in the domain connectivity table. Each node uses its domain routing table to establish a path between edge nodes. In another embodiment, the domain routing table indicates routes containing no intra-domain virtual link that terminates at an edge node and no consecutively concatenated intra-domain virtual links. A backbone routing table indicates inter-domain routes and unreachability indications between border nodes of each domain and border nodes of every other domain. The inter-domain routes contain at least one of the inter-domain physical links but contain no consecutively concatenated intra-domain virtual links.

1. Field of the Invention
The present invention relates generally to communications networks in which cross-connect nodes are organized into a plurality of groups corresponding to geographic domains and in which constraints are imposed on intra-domain node-to-node connectivity. More specifically, the present invention relates to a path finding technique for avoiding unreachable nodes which would otherwise be encountered due to connectivity constraints.
2. Description of the Related Art
In an optical communications network, a number of optical cross-connect nodes are interconnected by optical links and wavelength division multiplexers are provided between neighbor nodes to support a number of parallel wavelength channels. Different network providers and administrators organize the optical communications network into a number of groups corresponding to geographic domains for efficient network management and administration. For establishing a path across the network, use is made of a distance vector algorithm known as the BGP (border gateway protocol) routing protocol (RFC 1771) that operates on TCP/IP. According to the BGP routing protocol, neighbor domain nodes use the BGP open message and the BGP keepalives message during a neighbor discovery process and create a routing table from BGP update messages advertised from neighbor domains. Based on the routing table, each domain perform route calculations and then advertise its calculated routes and updates its routing table. As the advertisement process is repeated, the contents of each routing table tend to converge to a set of invariable values.
On the other hand, the optical cross-connect node has the ability to perform its switching function on optical signals of any transmission rate or any data format. However, if signals are "transparently" propagated through a large number of optical nodes or transmitted over long distances, they would suffer from serious distortion due to noise and attenuation with a result that their bit error rate becomes higher than the prescribed acceptable level. Additionally, optical cross-connect nodes may also be configured with an optical add-drop multiplexer (OADM) which is only capable of performing its add-drop function on a particular wavelength. Such cross-connect nodes do not have non-blocking feature. Hence, connectivity may be constrained within a domain to such an extent that no accessibility exists between particular nodes within that domain. Connectivity constraint may arise on a particular intra-domain route. Due to this intra-domain connectivity constraint, attempts to set up a path using the BGP routing protocol may encounter a failure.
One solution is to have all network nodes share connectivity constraints information in common. However, the amount of such information each network node could hold in its memory would be significantly large, which could lead to the loss of network scalability.

Communications network with routing tables for establishing a path without failure by avoiding unreachable nodes