Method and apparatus for interfacing audio equipment and a computer system. Compressed parallel digital audio data originating on a system bus associated with the computer system is transmitted to a first data interface where the compressed parallel digital audio data is converted into compressed serial digital audio data. The compressed serial digital audio data is then transmitted to a second data interface associated with a digital signal processor. The second data interface routes the compressed serial digital audio data from the first data interface to the digital signal processor where the data is expanded and then returned to the second data interface. The second data interface then routes the processed serial digital audio data to a digital-to-analog converter where the processed serial digital audio data is converted to analog audio data and transmitted to the audio equipment for output. Analog audio data produced by the audio equipment is transmitted to a analog-to-digital converter for conversion into serial digital data. The analog-to-digital converter then transmits the serial digital audio data to the second data interface which routes the data to the digital signal processor. The digital signal processor compresses the serial digital audio data and returns the data to the second data interface. The second data interface then routes the compressed serial digital audio data to the first data interface where the data is converted into compressed parallel digital audio data and transmitted to the computer system bus.

1. Field of the Invention
The invention relates to computer systems having audio equipment associated therewith and, more particularly, to an audio coder/decoder having a digital signal processor interface.
2. Description of Related Art
In the past, interfaces between a computer system and audio equipment associated therewith were not configured to provide signal processing capability. For example, a typical prior art interface between a computer system and audio equipment may be seen by reference to FIG. 1. Here, an audio coder/decoder 10 which includes a data memory access (or "DMA") interface 12, a digital-to-analog (or "D/A") converter 14 and an analog-to-digital (or "A/D") converter 16 provides the interface between an industry standard architecture (or "ISA") bus 18 of a computer system (not shown) and audio equipment which includes a speaker 20 and an analog input 22, for example, a microphone.
Digital audio signals which, for example, may be propagated by a memory subsystem (not shown) associated with the computer system onto the ISA bus 18, are transmitted from the ISA bus 18 to the DMA interface 12 via an audio data bus 24, most commonly a parallel bus for simultaneously transferring multiple data bits. Digital data input the DMA interface is converted from parallel to serial by a parallel to serial converter (not shown) and transferred to the D/A converter 14. There, the digital serial data is converted into analog and then transmitted to the speaker 20 for audio transmission. Analog audio signal are transmitted by the microphone or other analog input 22 to the A/D converter 16. Here, the analog audio signals are converted into serial digital audio data and transmitted to the DMA interface 12. The DMA interface 12 converts the serial digital audio data into parallel data and transmits the parallel digital audio data to the ISA bus 18 via the data bus 24.
Interfaces between a computer system and associated audio equipment such as the interface illustrated in FIG. 1 are not configured to process the data being output to or input from the audio equipment For example, various data compression techniques have been utilized to compress information encoded in the form of digital data to an abbreviated or shorthand form so that the number of data bits which must be utilized in order to store the encoded information in memory or transmit the encoded information to a selected destination is reduced Typically, a data compression algorithm involves identifying redundant or unnecessary information and substituting an abbreviation or shorthand symbol for that information and the use of such data compression algorithms to reduce the number of bits required to store or transmit data are common.
In order to provide signal processing capability for input and/or output audio signals for an audio interface such as that illustrated in FIG. 1, a digital signal processor would be connected directly to the ISA bus 18. Digital audio signals being transmitted to the DMA interface 12 would first be routed by the ISA bus 18 to the DSP for processing and then returned to the ISA bus 18 for routing to its final destination. As such a configuration would add two bus exchanges for every data transfers to the DMA interface 12, traffic on the ISA bus 18 would increase dramatically. Furthermore, the additional glue logic required in order to permit the DSP to interface with the ISA bus 18 would increase the cost of such a computer system.

Digital signal processor interface for computer system


The present application discloses a method of interpolating an image including a pixel array formed of multiple pixels. The method includes: determining a position of an interpolation point relative to the pixel array; determining weights of an edge direction of the pixel array at the position of the interpolation point in a plurality of preset edge directions based on pixel values of a plurality of pixels adjacent to the interpolation point; selecting, for each preset edge direction, one or more corresponding pixel sub-arrays covering the interpolation point from the pixel array to calculate an interpolation pixel value of the interpolation point; calculating a weighted interpolation pixel value of the interpolation point based on the weights of the edge direction of the pixel array at the position of the interpolation point in the preset edge directions and the interpolation pixel value of the interpolation point corresponding to each preset edge direction.

In displays of mobile phones, tablet computers, computers or digital televisions, image scaling algorithms are often used to process images. For example, in the process of enlarging an image, an interpolation algorithm is needed to calculate missing pixels of the enlarged image.
The interpolation algorithms widely used in the prior art include nearest neighbor algorithm, bilinear interpolation algorithm, cubic interpolation algorithm, etc., but images enlarged with these algorithms have obvious jaggies.

Method and device for interpolating image

MONTAGE LZ TECHNOLOGIES (CHENGDU) CO., LTD.


Detection unit is disclosed for arrangement inside a cylindrical patient receptacle of a magnetic resonance apparatus. In at least one embodiment, the detection unit includes an annular PET detector arrangement with PET detector blocks, and a radiofrequency coil arrangement, arranged coaxially inside the PET detector arrangement and including longitudinal conductors, the longitudinal conductors being guided at least in sections along interspaces between mutually spaced apart detector blocks.

Both magnetic resonance tomography (MRT) and positron emission tomography (PET) are imaging methods that are suitable for displaying the interior of the human body and, particularly in the case of PET, for displaying biochemical processes. There has recently been interest in combining MRT and PET with one another in a unit in order to be able to apply both imaging modalities to the same patient simultaneously or shortly after one another.
It is proposed to this end to provide a possibly removable PET detector additionally inside the magnet arrangement, customary in a magnetic resonance apparatus, composed of basic field magnet and gradient coils. A radiofrequency coil arrangement is to be arranged coaxially for the MRT pictures inside this PET detector arrangement, which is mostly surrounded by a radiofrequency shield.
Both imaging methods, and thus both arrangements share the same isocentric region, that is to say both the PET detector arrangement and the radiofrequency coil arrangement require the same isocentric space in the plane perpendicular to the longitudinal axis of the magnetic resonance apparatus, which is frequently also denoted as the Z-axis, the isocenter being located at Z=0.
To this end, it has been proposed to arrange the PET detector arrangement inside the patient receptacle of the magnet of the magnetic resonance apparatus, the radiofrequency coil arrangement, in turn, being inserted into the annular PET detector arrangement. However, a few problems arise in this case. Firstly, the radiofrequency coils and the PET detectors interfere mutually with one another, since the currents generate inside the PET detector arrangement interference fields that can be captured by the radiofrequency coil and possibly lead to interference signals. In order to avoid this interference, it is proposed to provide a radiofrequency shield at least between the radiofrequency coil arrangement and the PET detector arrangement, such that the respective interference fields are shielded against one another. In this case, the entire PET detector arrangement can also be surrounded by such a radiofrequency shield in the manner of a Faraday cage.
A further problem is that the patient receptacle is extremely reduced in the case of such a design of onion-skin type. The inside diameter of the radiofrequency coil arrangement remaining for the patient is then very small, and so psychological effects such as, for example, claustrophobia, and problems based on a high body volume can greatly stress the patient by reducing comfort.
If such a radiofrequency shield is provided, the problem is additional rendered more acute by virtue of the fact that the conductors of the radiofrequency coil arrangement can no longer be arranged directly in the vicinity of this radiofrequency shield, since a certain reverse field flux space is required for the field lines of the radiofrequency field to be able to close. Consequently, the conductors of the radiofrequency coil arrangement should exhibit a certain distance from a radiofrequency shield, and this leads to a further constriction of the space that remains for the patient.

Detection unit for arrangement inside a cylindrical patient receptacle of a magnetic resonance apparatus


A system and method for supplying power to a peripheral device where the voltage supplied by a host device may be the voltage required for operation of the peripheral, or a higher voltage. A memory system includes a voltage regulator including an input, and output and a bypass shorting the input to the output. A voltage detector communicates with the regulator. A Bypass enable signal operable responsive to a signal generated by the host device indicating that the power up of the host is complete is coupled to the bypass element. A method for operating a voltage regulator in a memory system includes the steps of: providing a voltage regulator having an input and an output, and including a bypass shorting the input to the output; setting the bypass to off prior to power up of a host device; responsive to a power up completion signal from a host device, determining the power supplied by the host; and if the power supplied by the host is below a threshold operating voltage, enabling the bypass.

1. Field of the Invention
The present invention is directed to voltage regulation in multivoltage supply applications, and in particular, for peripheral devices such as memory systems.
2. Description of the Related Art
Non-volatile semiconductor memory is popular for a number of uses, including cellular telephones, digital cameras, personal digital assistants, mobile computing devices, non-mobile computing devices, audio and video players and other appliances. Electrical Erasable Programmable Read Only Memory (EEPROM) and flash memory are among the most popular non-volatile semiconductor memory types.
Typical applications include the provision of one more arrays of storage elements in a memory card system, such as a memory card, which is then inserted in a host device. Both EEPROM and flash memory utilize arrays of storage elements to store one or more bits of data per element. Each element generally includes a floating gate that is positioned above and insulated from a channel region and a semiconductor substrate. The floating gate is positioned between source and drain regions. A control gate may be provided over and insulated from a floating gate. The threshold voltage of each memory transistor is controlled by the amount of charge that has retained on the floating gate. That is, the minimum amount of voltage that must be applied to the control gate before a transistor is turned on to permit conduction between its source entering is controlled by the level of charge on the floating gate. Many EEPROMs and flash memories have a floating gate that is used to store two ranges of charges and, therefore, the memory cell can be programmed/erased between two states. Such memory cells store one byte of data. Other EEPROMs and flash memory cells store multiple ranges of charge and, therefore, such memory cells can be programmed to store multiple states. Such memory cells store multiple bytes of data.
Improvements in processing technology have led to smaller transistor device sizes. This in turn has led to lower power supply requirements in each successive generation of transistor technology. For example, a 0.25 micron process device operates on a voltage of approximately 2.5 volts, a 0.18 micron process uses a 1.8 v (+/−10%) supply, a 0.15 micron process will use a 1.5 (+/−10%) volt supply, 0.13 micron technology a 1.2 v (+/−10%) supply, and so on.
Unfortunately, not all host devices supply the requisite power required by such technology. For example, older hosts may supply 3 volts to a memory system requiring only 1.8 volts. Thus, memory devices constructed with newer technologies must allow for the possibility that the host device in which they are used will supply a higher voltage used with legacy products. Hence power level detection and voltage regulation techniques are used to provide the correct voltage to the memory device.
Another consideration is that most regulators impose a significant voltage drop when a substantial current is drawn from the device. A voltage regulator designed to step down a legacy voltage will experience a current drop if a lower than expected voltage is supplied at the input. For example, in a conventional voltage regulator, a 3 volt host has sufficient head room to supply high current to a 1.8 volt device, but a 1.8 volt host can not supply high current with low drop to a 1.8 volt device; the output would be too low.

Voltage regulator with bypass for multi-voltage storage system


A method for performing information monitoring control and an associated apparatus and an associated monitoring system are provided, where the method is applied to an electronic device, and the apparatus includes at least one portion of an electronic device. The method includes: detecting at least one target division block of at least one web page according to user gesture input information and determining subscription information corresponding to the target division block, wherein the web page including the target division block is provided by at least one web server; and sending the subscription information to at least one monitoring control server to subscribe to a monitored version of the target division block, for being displayed/output by utilizing the electronic device.

1. Field of the Invention
The present invention relates to a monitoring control service provided through an electronic device, and more particularly, to a method for performing information monitoring control, and to an associated apparatus and an associated monitoring system.
2. Description of the Prior Art
A conventional portable electronic device such as a multifunctional mobile phone or a personal digital assistant (PDA) can be very helpful to an end user, and more particularly, can be utilized for viewing web pages when needed. According to the related art, a browser can be triggered to run on the conventional portable electronic device for the purpose of viewing web pages. Some problems may occur when such a browser is utilized. For example, in a situation where multiple programs are running on the conventional portable electronic device, the additional loading due to the browser may cause the conventional portable electronic device to operate abnormally since the hardware resources of the conventional portable electronic device are typically limited. In another example, in a situation where the end user is utilizing a specific program to do something and still cares about the latest status of a topic, the end user may be forced to switch between the browser and the specific program since the size of the screen implemented within the conventional portable electronic device is limited. As the related art does not serve the end user well, a novel method is required for providing a monitoring control service through an electronic device.

Method for performing information monitoring control of at least one target division block of at least one web page with aid of at least one monitoring control server, and associated apparatus and associated monitoring system


A device and a method for automatically setting a status of a dynamic random access memory through the control of a clock enable signal. The device comprises a frequency amplification circuit for amplifying a main clock signal by a desired number of times in response to a frequency amplification enable signal and outputting the amplified signal as an internal clock signal, a clock enable detection/control circuit for detecting the clock enable signal, combining the detected clock enable signal with the internal clock signal from the frequency amplification circuit to generate the frequency amplification enable signal, a memory status setting signal and a clock enable latch signal and outputting the frequency amplification enable signal to the frequency amplification circuit, and a status setting signal output circuit for generating a plurality of command signals in response to the memory status setting signal and clock enable latch signal from the clock enable detection/control circuit and outputting the generated command signals to the dynamic random access memory. According to the present invention, a mode of the memory can automatically be changed through the control of only the clock enable signal. This is convenient to the user.

1. Field of the Invention
The present invention relates in general to automatically setting a status of a dynamic random access memory (referred to hereinafter as DRAM), and more particularly to a device and a method for automatically setting a status of a DRAM through the control of a clock enable signal, in which the clock enable signal is controlled and analyzed to automatically set a mode of the DRAM.
2. Description of the Prior Art
Generally, in order to control the operations of an SDRAM and a DRAM, a main processing unit MPU processes control signals such as a chip select signal /CS, a row address strobe signal /RAS, a column address strobe signal /CAS, a write enable signal /WE and a clock enable signal CKE.
For example, an operation mode of the DRAM is changed according to a state of the clock enable signal. The clock enable signal remains at its high logic state while a normal operation is performed, and then goes low in logic when a mode change operation is performed.
However, the mode change operation is not performed only by changing the state of the clock enable signal but by combining it with the other signals.
Usually, in the case where the clock enable signal becomes low in logic, the current operation mode is changed to a power down mode in which a self-refresh operation may be performed.
Another mode operable by the low logic state of the clock enable signal is a clock suspend mode. However, the clock suspend mode can be performed by combining the clock enable signal of low logic with the row and column address strobe signals.
For this reason, set levels of pins for inputting the above-mentioned signals must be known thoroughly. Further, the levels of the signal input pins must be changed whenever a function is changed. These are inconvenient to the user.

Device and method for automatically setting status of dynamic random access memory through control of clock enable signal

Hyundai Electronics Industries Co., Ltd.


A vehicle side airbag device that is capable of reducing the number of panels for configuring a side airbag. A side airbag of the present side airbag device is configured with bag shaped airbag main body section formed by double folding a single-sheet panel, and stitching together around an outer peripheral edge portion. Moreover a tether section that segments the interior of the airbag main body section into a chest chamber and a hip chamber is also formed by partially folding over, superimposing and stitching the single-sheet panel.

An airbag cut body disclosed in Patent Document 1 below is configured with plural cloth members (panels) that are upper/lower segmented and sewn together, and with a gas generation device holder made from two separate sheet cloth members. The multi-chamber airbag (side airbag) formed from the airbag cut body has a wall (tether section) formed so as to partition the interior of the side airbag into plural chambers (chambers) by stitching a portion of the plural panels mentioned above.    Patent Document 1: 2005-531451


A plug (100) is configured for latching engagement with a cage (200). The plug has a housing (10) and a release mechanism (12) mounted on the housing. The housing has a nose portion (11) configured for latching engagement with a latch tab (21) formed on the cage. The release mechanism includes a rotatable lever (123) and a movable actuator arm (124). The lever has a front portion (1231), a rear portion (1232) and a middle portion (1234) adapted to be hinged with the housing. A front portion (1241) of the actuator arm could lift the front portion of the lever for releasing the nose from the latch tab when the actuator arm is moved forwardly, and a rear portion (1243) of the actuator arm could lift the rear portion of the lever when the actuator arm is moved backwardly.

1. Field of the Invention
The present invention relates to a plug having an improved releasing mechanism.
2. Description of Related Art
U.S. Pat. No. 7,204,712, issued to Schwiebert et al. on Apr. 17, 2007, discloses a module plugged into a cage. The module has a housing including a top wall, and a release mechanism assembled to the top wall. The cage has a resilient latch tab adapted to receive a post formed on the housing top wall. The release mechanism includes an integrated structure having a wedge-shaped front adapted to lift the latch tab for releasing the module from the cage. The top wall needs to have a thickness sufficient to form a pocket for receiving the wedge-shaped front of the integrated structure. The need for increased thickness adjacent the post is detrimental to changing the module into a smaller and thinner style.
U.S. Pat. No. 6,926,551, issued to Schulz et al. on Aug. 9, 2005, discloses a pluggable transceiver having a housing and a release mechanism mounted thereon. The transceiver is inserted into a cage having a latch tab with a receiving hole. The housing has a cam configured to be latched with the receiving hole of the latch tab. The release mechanism is attached to the housing and selectively movable between a first position and a second position to release the cam from the receiving hole. The release mechanism has a chamfered, guiding surface to release the latching tab from the cam of the housing. Thus, the release mechanism needs a space sufficient for permitting a sliding movement from the first position to the second position. The need for a large space is not beneficial to designing the transceiver into a smaller and thinner style either.
Hence, a plug having an improved release mechanism for obtaining a thinner and smaller profile is desired.


A wiring box for arranging the cables is buried under the ground after the cables are arranged and after the box is hermetically sealed with mortar in the construction site. It is therefore desirable that the wiring box is easily assembled at the construction site. The adapter for wiring of the invention is consists of a box and partitioning walls that divide the interior of the box into a plurality of areas. Namely, insertion holes are formed in the adapter, cables are inserted in the insertion holes, and paste is charged into the areas partitioned by the partitioning walls, enabling the cables to be easily arranged.

1. Field of the Invention
The present invention relates to an adapter for wiring, and more specifically to the structure of an adapter for wiring which enables insertion holes for cables and cable tubes to be easily perforated and further to be easily closed hermetically.
2. Prior Art
A wiring box in which underground cables are arranged is usually made of a concrete. Prior to burying it under the ground, insertion holes are perforated in the side walls of the wiring box using a drill or the like and cable tubes are inserted in the insertion holes. When the cables are to be passed through the walls of a building insertion holes are perforated in the walls using a drill or the like.
However, the wiring boxes and walls of a building have been so rigidly constructed using concrete that extended periods of time and laborious work are needed to perforate the insertion holes. After the cable tubes and cables are inserted in the insertion holes the insertion holes are hermetically closed by applying mortar or the like often resulting in defective construction work in that the mortar is applied in varying amounts.


A magnetically recorded data reproduction apparatus that reproduces magnetically recorded data using a magnetoresistive head and method thereof. The recorded data are reproduced by a magnetoresistive head and supplied to a reproduction amplifier. A signal from an AGC amplifier is supplied to an A/D converter and a digital PLL circuit. A digitized signal is then supplied to, for example, a Viterbi decoder 13 and the decoded signal is obtained at an output terminal 14. Thus, the effect of noise due to the so-called thermal asperity (TA noise) is removed, thereby preventing increases in the error rate of the reproduction signals due to the effect of TA noise and the occurrence of problems in equipment.

The configuration, for example, shown in FIG. 5 has been used in an apparatus for reproducing magnetically recorded data using magneto-resistive heads.
Specifically, in FIG. 5 data recorded on, for example, magnetic tape 51 are reproduced by a magnetoresistive head (hereinafter referred to as MR head) 52. The reproduction signal is extracted to the outside of, for example, a rotating drum (not shown in the figure) through a rotary transformer 53 and then supplied to a reproduction amplifier 54.
Hereupon, a low-frequency component of the extracted signal has been cut off through the rotary transformer 53, and a low-frequency component correction circuit 55 is provided on the output side of the reproduction amplifier 54 to correct the low-frequency component cut off. The signal from the low-frequency component correction circuit 55 is supplied to an integrating equalizer 56 having characteristics approximately reverse to the characteristics of magnetic recording and reproduction. Further, the signal from the integrating equalizer 56 is supplied to a phase equalizer 57 which compensates in the magnetic recording the phase rotation due to the orientation of the medium such as tape.
Then, the signal from the phase equalizer 57 is supplied to an analog cosine equalizer 58 which is to absorb changes in frequency characteristics based on a state of the magnetic recording and reproduction system. Accordingly, through the operation of these three equalizers, the magnetic recording and reproduction system can realize almost reverse characteristics, thereby enabling a signal equivalent to that at the recording to be extracted. This signal is then extracted through an automatic gain control amplifier (hereinafter referred to as an AGC amplifier) 59 for the purpose of removing amplitude variation.
The signal from the AGC amplifier 59 is further supplied to an A/D converter 60. Also, the signal from the AGC amplifier 59 is supplied to a digital PLL circuit 61 to extract a clock signal contained in the supplied signal. Then, the extracted clock signal is supplied to the A/D converter 60 and the signal from the AGC amplifier 59 is digitized. The digitized signal is then supplied to a decoder 62 using, for example, a Viterbi algorithm (Viterbi decoder), and the decoded signal is obtained at an output terminal 63.
In this manner the reproduction of data recorded on, for example, the magnetic tape 51 is performed using the MR head 52. When, however, this type of MR head is used to reproduce data recorded on, for example, magnetic tape, a problem of the so-called thermal asperity noise (hereinafter referred to as TA noise) occurs. Namely, TA noise is a specific problem when using the MR head to reproduce recorded data.
Hereupon, the MR head is a device which detects changes in resistance values of an element due to the rotation of the magnetization angle inside the magneto resistive element caused by an external magnetic field. In this case, the external magnetic field represents a magnetic field generated by the magnetization pattern recorded on tape or a disk. Also, in the MR head this change in resistance is obtained as the change in voltage. Therefore, based on Ohm's law voltage of the output signal from the MR head is equal to the value in which a measured current is multiplied by the resistance change as expressed [σV=IσR].
However, when the MR head is collided with projecting material such as dust occurred on media, for example, tape, disk or the like, such a phenomenon occurs that resistance values suddenly (in 1 μsec. or less) change due to frictional heat generated by the collision and then slowly return (in a few μsec.) due to thermal diffusion. In other words, the resistance value of the magnetoresistive element is also changed by such heat, and fluctuations in the resistance value caused by the heat are greater than changes due to the above-mentioned external magnetic field.
When fluctuations in the resistance value due to the heat occur, changes will also occur in the voltage of output signal from the MR head in which the above described resistance change is obtained as changes in the voltage. Specifically, as shown on the left side of FIG. 6, for example, the reproduction signal held at a constant amplitude by the AGC amplifier 59 suddenly changes immediately after a collision and then slowly changes as returning. This change is called thermal asperity (TA), and noise caused by TA is called TA noise.
Moreover, experimentation verified that the above TA noise caused effects as described below. Specifically, FIG. 7 shows the configuration of an apparatus used for the experimentation, in which a signal obtained by convoluting, for example, a Lorentz 7th order M-sequence signal shown at the lower left of the figure with pseudo TA noise as shown above is used as an input signal. Such an input signal is supplied to an AGC amplifier 704 through an integrating equalizer 701, a phase equalizer 702 and a cosine equalizer 703.
In this experimental circuit, when the input signals shown in FIGS. 8B, 9B and 10B are each supplied to the integrating equalizer 701, the output signals shown in FIGS. 8A, 9A and 10A are obtained at the AGC amplifier 704, respectively. FIGS. 8A and 8B show an example in which the lower frequency component of the input signal is not cut off, and therefore in this case, TA noise of, for example, approximately 5 μsec. has a lasting effect for about 70 to 80 μsec.
Compared with this, when the lower frequency component of the input signal is cut off at, for example, 285 kHz, the effect of TA noise lasts 30 to 40 μsec. as shown in FIG. 9. Further, when the lower frequency component of the input signal is cut off at 595 kHz, the effect of TA noise lasts 10 to 20 μsec. as shown in FIG. 10. Consequently, it was verified experimentally from these results that by cutting off, for example, the lower frequency component of the input signal the length of the TA noise effect is shortened.
Through these experiments, the cause of the above-mentioned lasting TA noise effect is judged to be the fact that the dynamic range of the internal circuit is saturated with respect to an input signal having a large DC component such as TA noise, thereby generating a surge in the output signal from the AGC amplifier 704. As a result, when such a surge occurs, the error rate of the reproduction signal will increase and therefore problems such as picture freezing, audio discontinuity or others will occur in equipment such as a digital VTR.

Magnetically recorded data reproduction apparatus and method thereof


In an ISDN communications system, a remote station power detector circuit comprises a capacitor connected between center taps of transformers on the receive and transmit pairs of conductors. The capacitor stores energy delivered from a central DC power source. Two serially-connected opto-couplers form a discharge path for the capacitor. The first opto-coupler is periodically driven on to partially complete the discharge path. If the capacitor charge exceeds a predetermined minimum, the second opto-coupler will then be driven on, providing a logic level output usable by the remote station. Power consumption is minimized by the use of large resistors in series with the capacitor while reliable power detection is achieved by detecting accumulated charge on the capacitor. Dielectric isolation is provided through the use of opto-coupler circuits.

I. Field of the Invention
The present invention relates to ISDN communications systems and, more particularly, to a power detection circuit located at a remote station which consumes little power while providing good isolation between the remote station logic and the transmission lines.
II. Prior Art
A major step in the evolution of common carrier facilities from an analog environment to a completely digital environment lies in the implementation of an integrated services digital network (ISDN) wherein a digital channel is provided directly to the end user. In such a network, the equipment on the user's premises, such as a digital telephone or data terminal, generates a digital signal for being transmitted directly to the common carrier's switching office over local loops that are engineered to carry digital signals. The interface network is documented in the form of standards composed by the International Telegraph and Telephone Consultative Committee (CCITT) for international standards and by the American National Standards Institute (ANSI) for U.S. standards.
Similar to a standard analog telephone system, ISDN provides power to remote stations (on the user's premises) for powering the user's equipment. As can be seen in the simplified block diagram in FIG. 1, an ISDN network 10 utilizes two transmission line pairs to each remote station: a transmit pair 16 for conveying data to the remote station 12, such as a data terminal equipment (DTE), from a central office 14 and a receive pair 18 for conveying data from the remote station 12 to the central office 14. Because both the transmit pair 16 and the receive pair 18 are terminated by transformers 20, DC power is provided by a power source 24 in the central office 14 to the remote station 12 via the center terminal 22 of each transformer 20. In this way, the differential current (and voltage) across each pair is zero.
In order to implement the full potential of ISDN, the CCITT and ANSI standards define an elaborate state machine. This state machine integrates the physical world (i.e., wires, voltages, currents) into an abstract world of virtual communication links and networks. To fully pass through all the required and optional states, the hardware must be aware that it is currently connected to a functioning ISDN line, and must be capable of detecting when a connection has been physically interrupted. The required method of doing this is to use a power sensor 26 to determine if power is being supplied over the transmission lines. This method is particularly practical when the user's equipment does not use the power provided over the ISDN lines but rather consumes the user's own power. A problem arises, however, in that the user is severely limited by the international and U.S. standards as to the amount of power which can be consumed by the power sensor 26 in assessing the availability of a functioning ISDN network. Typically, the power sensor circuit 26 cannot consume more than 3 milliwatts (mW), the power consumption limit varying slightly depending upon which standard is referenced.
In addition, because of the threat of lightning striking the ISDN lines or the possibility of ISDN and high power lines crossing, the power sensor circuit 26 must provide a high degree of voltage isolation between the ISDN lines and the remote station logic. Requirements for isolation range from 1500 to 3500 Volts (V), again depending upon which standard is referenced.
In the past, transformers have been used as a means of providing a high degree of isolation for data signals, but are not suitable for DC applications.
Electrical devices such as opto-couplers have been used to meet the required dielectric isolation requirements but typically consume more than 3 mw. To operate effectively and consistently, opto-couplers require at least 1 milliams (mA) of drive current, preferably 10 mA, if detection over temperature extremes and over the life of the opto-coupler is desired. As voltage of the central office power supply 24 ranges from 24V to 56.5V, the maximum current that is allowed to flow through the detection circuit without exceeding the power consumption limit ranges from 22.6 to 56.5 micro-amperes, respectively. As a result, the use of opto-couplers in such a remote station application requires much more than the 3 milliwatts of power consumption that ISDN standards allow.
Therefore, it is desirable to have a method for detecting power at an ISDN remote station that consumes little power (<3mW) and provides a high degree of isolation (>3000V).

International Business Machines Corporation


An adhesion structure of a motor that adheres a rotor having a first linear expansion coefficient and a magnet having a second linear expansion coefficient, which differs from the first linear expansion coefficient, with an adhesive agent. The adhesion structure includes a thickness determining groove extending parallel to the axis of the rotor and arranged on the rotor in order to determine the thickness of an adhesive agent layer, which is formed from the adhesive agent. The thickness determining groove absorbs shearing stress produced by the difference between the first and second linear expansion coefficients at a surface adhered to the magnet. This effectively suppresses exfoliation of the adhesive agent layer.

The present invention relates to an adhesion structure for a motor, and more particularly, to an adhesion structure that adheres a magnet and a rotor with an adhesive agent.
In the prior art, a brushless DC motor is used in an electric power steering apparatus. The DC motor includes an adhesion structure that adheres a magnet formed from neodymium, which is a rare earth, to the outer surface of a steel rotor with an adhesive agent.
The thickness of the adhesive agent between the rotor and the neodymium magnet is about 0.03 mm. The neodymium magnet has a linear expansion coefficient of about zero, which is less than that of the steel rotor. The adhesive agent has a linear expansion coefficient that is greater than that of the rotor.
A motor used in an automobile must be capable of withstanding temperatures of a wide range so that the motor can be used under any temperature that the automobile would encounter. In other words, the motor must function normally even when the automobile is driven in arctic or tropical regions. The adhesion structure undergoes performance tests by repeatedly changing the temperature in a range of, for example, minus 40° C. to positive 120° C. to confirm that the motor has the required durability under various temperatures or in environments in which the temperature changes significantly.
In the performance tests, the expansion and contraction of the neodymium magnet is subtle when the temperature changes. However, a change in temperature expands and contracts the rotor and the adhesive agent. As a result, shearing stress is applied to the interface (adhering surface) between the neodymium magnet and the solidified adhesive agent layer. This may lead to exfoliation of the adhesive agent layer.
Accordingly, Japanese Laid-Open Patent Publication No. 60-102854 proposes the application of a resin mold around the neodymium magnet after the neodymium magnet is adhered to the rotor with an adhesive agent. However, the processing of the resin mold takes time and increases the manufacturing cost.
Further, Japanese Laid-Open Patent Publication Nos. 11-89141 and 14-234449 describes filling a groove in a rotor with an adhesive agent to minimize exfoliation. However, exfoliation of the adhesive agent layer may still occur even when using the groove.
It is an object of the present invention to provide an adhesion structure that effectively suppresses exfoliation of an adhesive agent layer.

Adhesion structure for motor, having thickness determining means


Certain diacylglycerol-polyethyleneglycol (DAG-PEG) lipids are especially useful for forming thermodynamically stable liposomes. Such liposomes are useful for a variety of purposes, including the delivery of therapeutic agents.

Liposomes are self-closed colloidal particles in which membranes composed of one or more lipid bilayer(s) encapsulate a fraction of the aqueous solution in which they are suspended. The surfaces of bilayers are hydrophilic while the interior of bilayers, which contain hydrocarbon chains, are hydrophobic. Because of the different microenvironments in their structure, liposomes can encapsulate hydrophilic molecules, bind molecules on the bilayer surfaces or dissolve hydrophobic molecules into the middle of the bilayer. Their ability to incorporate many types of molecules has resulted in applications for drug delivery, diagnostics, cosmetics, cosmeceuticals and nutraceuticals.
Liposomes are manufactured by several different methods. Typically, the process begins when a lipid or combination of lipids are dissolved in an organic solvent. Upon removal of organic solvents and hydration, large multilamellar vesicles (MLVs) are formed. For some applications, small unilamellar vesicles (SUVs) may be desired. SUVs can be produced from MLVs by several techniques including sonication, extrusion through membranes with well-defined pores, French press extrusion and homogenization.
Problems associated with liposomes include colloidal instability, difficulty in scale-up sterilization, and variability between batches in manufacturing. Liposome preparation and manufacturing typically involves removal of organic solvents followed by extrusion or homogenization. These processes may expose liposomal components to extreme conditions such as elevated pressures, elevated temperatures and high shear conditions which can degrade lipids and other molecules incorporated into the liposomes.
Liposome preparations are often characterized by very heterogeneous distributions of sizes and number of bilayers. Conditions optimized on a small scale normally do not scale up well and preparation of large-scale batches is cumbersome and labor intensive.
Another issue associated with liposomes for medical uses is sterilization. Among heat sterilization, ethanol oxide exposure, gamma irradiation and sterile filtration, only the last technique is suitable for liposomes and then only for liposomes smaller than about 100 nanometers (nm). Filtration of liposomes poses many difficulties.
Another problem for liposome applications is colloidal stability. Liposomes in suspension can aggregate and fuse upon storage, heating and addition of various additives. Because of these stability problems, liposomes are often lyophilized. Lyophilization is costly and time consuming. Upon reconstitution, size distributions often increase and encapsulated materials may leak out from the liposomes.
It is therefore desirable to develop new methods and materials which address these problems with current liposome formulations.

This patent is subject to a terminal disclaimer.

Self forming, thermodynamically stable liposomes and their applications


An apparatus for bending a glass sheet includes a final hearth bed. This final hearth bed has a top surface that is upwardly convexly curved along a plane perpendicular to an axis of the glass sheet. The top surface has an upstream end, a downstream end that is at a level lower than that of the upstream end, and an intermediate point defined therebetween. The top surface has (a) a first section that extends from the upstream end to the intermediate point and that is parallel with the axis or upwardly inclined relative to the axis and (b) a second section that extends from the intermediate point to the downstream end and that is downwardly inclined relative to the axis. The final hearth bed has a bottom surface that is along the first direction or inclined downwardly relative to the first direction.

The present invention relates to an apparatus and a method for bending a glass sheet so that the glass sheet has a compound curvature for use in, e.g., an automobile window.
There are several methods for bending a glass sheet such as an automotive window glass. In one method, a glass sheet is heated to become soft and bent by making the heated glass sheet sag by gravitation in a mold. In another method, a glass sheet is heated and then pressed by press molds. In still another method, a glass sheet is heated and bent while floatingly conveyed over hearth beds in a furnace. More specifically, while the glass sheet is conveyed over a series of hearth beds in a conveyance direction (hereinafter "first direction"), hot gas is ejected toward the glass sheet so that the glass sheet is floated over the hearth beds. The hearth beds have upper surfaces curved along a plane perpendicular to the first direction. The glass sheet is thus heated with the hot gas, gradually sags by gravitation and is bent according to the curvature of the upper surfaces of the hearth beds. In a subsequent stage, the bent glass sheet is quenched in a quenching unit. Alternatively, the glass sheet may be conveyed by a series of rollers in the furnace and bent according to the curvature of the rollers. A decision as to which method should be used is made depending on the size and curvature of bent glass sheets to be fabricated.
Among the above methods, the method using the hearth beds in the furnace (hereinafter referred to as a hearth bed bending method) has the advantage in its productivity for bending the glass sheet along the plane perpendicular to the first direction. Thus, the glass sheets having a simple curvature can be fabricated at low cost by the heath bed bending method. To fabricate the glass sheets having a compound curvature in such a hearth bed bending method, it has been proposed to heat, bend and quench the glass sheets while conveying the glass sheets either upwardly or downwardly relative to the first direction in order to also bend the glass sheets relative to the first direction with a curvature radius of tens of thousand of millimeters. However, it is not easy to bend the glass sheet relative to the first direction while conveying the heated glass sheets because of the furnace structure.
U.S. Pat. No. 3,409,422, corresponding to Japanese Patent Examined Publication JP-B-49-10331, discloses an apparatus in which some hearth beds situated most downstream in a furnace and the lower air blower of a quenching unit are inclined downwardly relative to a first direction to form a curvature curved relative to both of the first direction and a direction (hereinafter "second direction) perpendicular to the first direction, thereby fabricating glass sheets having a compound curvature.
Furthermore, U.S. Pat. No. 6,014,873, corresponding to Japanese Patent Unexamined Publication JP-A-5-9037, discloses an apparatus in which some hearth beds situated most downstream in a furnace are inclined upwardly relative to the first direction so that the final hearth bed and the lower air blower of a quenching unit form an upwardly convex curvature, thereby fabricating glass sheets having a compound curvature. U.S. Pat. No. 5,522,912, corresponding to Japanese Patent Unexamined Publication JP-A-6-191867, discloses an apparatus in which the final hearth bed has a top surface of which at least a downstream part is curved relative to the first direction and is inclined upwardly, for fabricating glass sheets having a compound curvature.
In each of the above conventional apparatuses, the equipment thereof (especially, the final hearth bed) needs to be replaced and adjusted, when different kinds of products are to be fabricated. More specifically, in the U.S. Pat. Nos. 3,409,422 and 6,014,873, the above-mentioned downstream hearth beds and quenching unit need to be replaced with new ones. Then, the newly equipped hearth beds and quenching unit have to be positioned in place by adjusting their respective supports so as to be properly inclined and connected with each other. In U.S. Pat. No. 5,522,912, the final hearth bed has to be replaced with a new one. The newly equipped bed needs to be inclined upwardly by adjusting its support properly. Such replacement and adjustment require much time and labor, whereby the profitable merit of the hearth bed bending method (i.e., high productivity) cannot be maintained. In addition, there arises a problem that the position to take out the bent glass sheets from the apparatus may become too low, when the glass sheets are conveyed downwardly relative to the first direction through the apparatus.
In view of the foregoing, an apparatus has been developed as disclosed in Japanese Patent No. 2809596 (corresponding to Japanese Patent Unexamined Publication JP-A-8-151221) and Japanese Patent Unexamined Publication JP-A-7-237928, in order to save time and labor required to replace and adjust the equipment of the apparatus for fabrication of different kinds of products.
In an apparatus disclosed in Japanese Patent No. 2809596, the final hearth bed is arranged in alignment with other hearth beds for bending glass sheets to have a simple curvature. For bending glass sheets to have a compound curvature, the final hearth bed is rotated about a vertical axis of rotation, without being inclined, so that the upstream end surface of the final hearth bed forms a slight angle with the downstream end surface of a hearth bed next to the final hearth bed, and at the same time, the lower air blower of a quenching unit is inclined downwardly relative to the first direction. In this state, the top surface of the final hearth bed is curved upwardly relative to both the first and second directions, whereby the flat glass sheet is bent into a shape having a compound curvature. Thus, different kinds of products can be fabricated with ease, i.e., a glass sheet can be bent to have a simple curvature or to have a compound curvature with ease because the production line can be modified only by rotating the final hearth bed without replacing it with another one. It is also beneficial that the final hearth bed can be shared even in fabricating different kinds of products. However, when the glass sheet is to be bent with a smaller radius of curvature relative to the first direction, the final hearth bed has to be rotated further so that the top surface of the final hearth bed is curved with a smaller radius of curvature relative to the first direction. In such a case, the space between the final hearth bed and the hearth bed next to the final hearth bed becomes larger, which causes a pressure drop of gas ejection due to gas leak through the space. Buoyancy to float the glass sheet becomes weaker owing to the pressure drop. The glass sheet may be caused to rub against the hearth beds, thereby being formed with flaws and cracks.
Furthermore, in an apparatus disclosed in Japanese Patent Unexamined Publication JP-A-7-237928, one side of a bent glass sheet is quenched, and then, both sides of the bent glass sheet are quenched in order to modify a curvature of the bent glass sheet. It is however necessary to provide additional equipment, such as a gas blowing system for previously quenching one side of the bent glass sheet.
The copending and commonly assigned U.S. patent application Ser. No. 10/119,705, filed on Apr. 11, 2002, discloses an apparatus and a method for bending different kinds of glass sheets, using a final hearth bed having an axis extending between its upstream through its downstream end. This final hearth bed has (a) a top surface curved along a plane perpendicular to the axis with a predetermined curvature radius and (b) an upstream end surface including a first surface section tilted toward a downstream end surface of the final hearth bed so as to form an angle θ to the second direction. The final hearth bed is arranged in a furnace such that the first surface section of the final hearth bed is located adjacent to and substantially parallel to a downstream end surface of the adjacent (penultimate) hearth bed. The above U.S. Patent application discloses another final hearth bed having a top surface curved relative to both the first and second directions so as to be upwardly convex.

Apparatus and method for bending glass sheets


A monolith for liquid chromatography is disclosed that involves a reaction product of; a (1) crosslinker having at least three adjacent groups, selected from ethylene oxide, polyethylene oxide, and mixtures thereof, and two or more pendent vinyl groups, and (2) monomer having the formula, CH2═CR—Y—Z, where R is H or CH3, where Z is a functional group selected to impart a desired interaction property to the monolith, and where Y is nothing, or any group that will not materially affect or compete with the function of the functional group (Z) in the monolith, or the reactivity of vinyl groups in the crosslinker or monomer.

Minimal interaction of support matrix and analytes is often desirable for separations such as gel electrophoresis and size exclusion chromatography of proteins. Proteins are well known to exhibit hydrophobic and/or ionic interactions with a variety of surfaces. Therefore, an inert material, which can significantly reduce or eliminate adsorption of proteins, would be very useful.
Known materials that resist protein adsorption include polysaccharide and polyacrylamide polymers; these enjoy wide application in gel electrophoresis and size exclusion separation of proteins1. An efficient method to address adsorption problems in capillary electrophoresis is to coat the capillary surface with such polymers2,3. In addition to polysaccharide and polyacrylamide, other neutral hydrophilic polymers have been investigated and found useful in capillary electrophoresis, such as polyvinyl alcohol4, polyethylene oxide5,6, polyvinylpyrrolidinone7 and a copolymer of polyethylene glycol and polypropylene glycol8. All of these polymers are neutral and hydrophilic. A systematic study of protein adsorption with a variety of surface structures resulted in the conclusion that materials are protein compatible if they are neutral, hydrophilic, proton acceptors and not proton donors9-11.
Other materials used in gel electrophoresis reported in 1992 by Zewert and Harrington are polyhydroxy methacrylate, polyhydroxy acrylate, polyethylene glycol methacrylate and polyethylene glycol acrylate12,13. To avoid the toxicities of acrylamide and bisacrylamide, and the difficulties associated with polyacrylamide gel electrophoresis of very hydrophobic proteins, such as bovine serum albumin or zein, polyethylene glycol methacrylate 200 in hydroorganic solvents was evaluated. Although there was no direct evidence to show the inertness of this material, successful electrophoresis of proteins demonstrated the protein compatibility of such polymers.
The inert polymers mentioned above are polymer gels that are soft in nature. These polymers can only be used in their swollen states because such polymers lose their permeabilities upon drying. Attempts have been made to prepare rigid beads with permanent porous structures from such polymers. Among these hydrophilic polymers, polyacrylamide is the only one that can form rigid beads by inverse suspension techniques using a high content of bisacrylamide as a crosslinker14. The use of a higher level of crosslinker accounts for the formation of rigid beads instead of soft particles.
Monolithic materials offer an alternative to columns packed with small particles or beads. A monolith (originally called a continuous bed or continuous polymer bed15) is a continuous rod with canal-like large through-pores and nanometer-sized pores in the skeletal structure. Preparation of a monolith is typically performed in a mold, such as in a tube or capillary where only one phase of the monomer mixture is used. Two types of monolithic materials have been developed to date. The first type is based on a silica backbone16,17 in which a continuous sol-gel network can be created by the gelation of a sol solution within a mold. Silica monoliths are mainly used for the separation of small molecules because of their hydrophobic characteristics after derivatization.
The second category includes polymer monoliths15,18 normally prepared by in-situ polymerization of monomer solutions, which are composed of a monomer, crosslinker, porogen and initiator. They can be initiated either by a redox system, e.g., TEMED and APS, or by a free radical initiator. For free radical initiation, both thermally and, more importantly, UV-initiated polymerization can be used. By the use of UV-initiated polymerization, a spatially defined monolith in a capillary or microchip can be prepared using a suitable mask. Furthermore, UV-initiated polymerization is typically much faster than thermally-initiated polymerization.
The first demonstration of a polyacrylamide monolith was performed in 1989 by Hjertén's group15. Acrylic acid and N,N′-methylenebisacrylamide were used as monomer and crosslinker, respectively, to prepare a macroporous gel plug for cation-exchange chromatography of proteins. Favorable chromatographic behavior (i.e., high efficiency at high mobile phase flow rate) was observed although the polymer monolith was compressible.
The preparation of a rigid polyacrylamide-co-bisacrylamide monolith was performed in 1997 by Svec's group19. Several variables were studied to prepare a flow-through monolith with a mean pore diameter of ˜1 μm. The porogens used for preparing the acrylamide-co-bisacrylamide monolith were dimethyl sulfoxide and a long chain alcohol, such as heptanol or dodecanol. The concentration of initiator was also investigated to adjust the medium pore diameter of the monolith; a lower concentration of initiator increased the permeability of the resulting monolith as expected. Unfortunately, thermally initiated polymerization was used to prepare the monolith. As a result, 24 h was required to complete the polymerization at 1% initiator concentration.
TABLE ACited References1.C. J. R. Morris, P. Morris, Separation Methods in Biochemistry. Wiley, New York,1976, p. 413-470.2.S. Hjerten, M. J. Zhu, J. Chromatogr. 346 (1985) 265.3.S. Hjerten, J. Chromatogr. 347 (1985) 191.4.N. J. Clarke, A. J. Tomlinson, G. Schomburg, S. Naylor, Anal. Chem. 69(1997) 2786.5.N. Iki, E. S. Yeung, J. Chromatogr A 731 (1996) 273.6.J. Preisler, E. S. Yeung, Anal. Chem. 68 (1996) 2885.7.R. McCormick, Anal. Chem. 60 (1988) 2322.8.Z. Zhao, A. Malik, M. L. Lee, Anal. Chem. 65 (1993) 2747.9.R. G. Chapman, E. Ostuni, M. N. Liang, G. Meluleni, E. Kim, L. Yan, G. Pier,H. S. Warren, G. M. Whitesides, Langmuir 17 (2001) 1225.10.E. Ostuni, R. G. Chapman, R. E., Holmlin, S. Takayama, G. M. Whitesides,Langmuir 17 (2001) 5605.11.E. Ostuni, R. G. Chapman, M. N. Liang, G. Meluleni, G. Pier, D. E. Ingber,G. M. Whitesides, Langmuir 17 (2001) 6336.12.T. Zewert, M. Harrington, Electrophoresis 13 (1992) 817.13.T. Zewert, M. Harrington, Electrophoresis 13 (1992) 824.14.J. V. Darkins, N. P. Gabbott, Polymer 22 (1981) 291.15.S. Hjertén, J. L. Liao, R. Zhang, J. Chromatogr. 473 (1989) 273.16.S. M. Fields, Anal. Chem. 68 (1996) 2709.17.H. Minakuchi, K. Nakanishi, N. Soga, N. Ishizuka, N. Tanaka, Anal.Chem. 68 (1996) 3498.18.F. Svec, J. M. J. Fréchet, Anal. Chem. 54 (1992) 820.19.S, Xie, F. Svec, J. M. J, Fréchet, J. Polym. Sci. A: Polym. Chem. 35 (1997)1013.20.C. Yu, M. H. Davey, F. Svec, J. M. J. Fréchet, Anal. Chem. 73 (2001) 508821.P. H. Humble, R. T. Kelly, A. T. Woolley, H. D. Tolley, M. L. Lee, Anal.Chem. 76 (2004) 5641.22.C. Yu, M. Xu, F. Svec, J. M. J. Fréchet, J. Polym. Sci. A: Polym. Chem. 40(2002) 755.23.D. S. Peterson, T. Rohr, F. Svec, J. M. J. Fréchet, Anal. Chem. 74 (2002) 4081.24.J. J. Meyers, A. I. Liapis, J. Chromatogr. A 852 (1999) 3.25.A. I. Liapis, J. J. Meyers, O. K. Crosser, J. Chromatogr. A 865 (1999) 13.26.F. Nevejans, M. Verzele, J. Chromatogr. 350 (1985) 145.27.C. T. Mant, R. S. Hodges (Editors), High-Performance LiquidChromatography of Peptides and Proteins: Separation, Analysis, andConformation. CRC Press, Boca Raton, FL, 1991, p. 139-142.28.G. Szabo, K. Offenmuller, E. Csato, Anal. Chem. 60 (1988) 213.29.S. Lubbad, M. R. Buchmeiser, Macromol. Rapid Commun. 23 (2002) 617.30.I. Halasz, K. Martin, Angwew. Chem. (Int. Ed. Engl.) 17 (1978) 901.31.M. Al-Bokari, D. Cherrak, G. Guiochon, J. Chromatogr. A 975 (2002) 275.32.D. E. Schmidt, R. Glese, D. Conron, B. Karger, Anal. Chem. 52 (1980) 177.33.J. K. Towns, F. E. Regnier, Anal. Chem. 63 (1991) 1126.34.K. K. C. Yeung, C. A. Lucy, Anal. Chem. 69 (1997) 3435.35.J. Cunliffe, N. E. Baryla, C. A. Lucy, Anal. Chem. 74 (2002) 776.36.C. T. Culbertson, J. W. Jorgensen, Anal. Chem. 66 (1994) 955.37.D. G. McLaren, D. D. Chen, Electrophoresis, 24 (2003) 2887.38.Kimura, H.; Tanigawi, T.; Morisaka, H.; Ikegami, T.; Hosoya, K.; Ishizuka,N.; Minakuchi, H.; Nakanishi, K.; Ueda, M.; Cabrera, K.; Tanaka, N. J. Sep. Sci. 2004,27, 897-904.39.Gu, B; Armenta, J. M.; Lee, M. L. J. Chromatogr. A 2005, 1079, 382-391.40.Guyot, A.; Bartholin, M. Prog. Polym. Sci. 1982, 8, 277-332.41.Sederel, W. L.; Jong, G. J. J. Appl. Polym. Sci. 1973, 17, 2835-2846.42.Kun, K. A.; Kunin, R. J. Polym. Sci.: Part A1 1968, 6, 2689-2701.43.Svec, F. LC-GC, Europe 2003, 16(6a), 24-28.44.Svec, F. J. Sep. Sci. 2004, 27, 747-766.45.Svec, F. J. Sep. Sci. 2004, 27, 1419-1430.46.Burke, T. W. L.; Mant, C. T.; Black, J. A.; Hodges, R. S. J. Chromatogr.1989, 476, 377-389.47.Mant, C. T.; Hodges, R. S. In High-Performance Liquid Chromatographyof Peptides and Proteins: Separation, Analysis, and Conformation; Mant, C. T.;Hodges, R. S., Ed.; CRC Press: Boca Raton, 1991; pp 171-185.48.Alpert, A. J.; Andrews, P. C. J. Chromatogr. 1988, 443, 85-96.49.Imamura, T.; Sugihara, J.; Yokata, E.; Kagimoto, M.; Naito, Y.; Yanase,T. J. Chromatogr. 1984, 305, 456-460.50.Kawasaki, H.; Imajoh, S.; Suzuki, K. J. Biochem. 1987, 102, 393-400.51.Stadalius, A. A.; Quarry, M. A.; Snyder, L. R. J. Chromatogr. 1985, 327, 93-113.52.Mant, C. T.; Hodges, R. S. In High-Performance Liquid Chromatographyof Biological Macromolecules: Methods and Applications; Gooding, K.;Regnier, F., Eds.; Marcel Dekker: New York, 1990; pp 301-332.53.Mant, C. T.; Hodges, R. S. J. Chromatogr. 1985, 326, 349-356.54.Mant, C. T.; Hodges, R. S. J. Chromatogr. 1985, 327, 147-155.55.Crimmins, D. L.; Thoma, R. S.; McCourt, D. W.; Schwartz, B. D. Anal.Biochem. 1989, 176, 255-260.56.Crimmins, D. L.; Gorka, J.; Thoma, R. S.; Schwartz, B. D. J. Chromatogr.1988, 443, 63-71.57.Viklund, C.; Svec, F.; Fréchet, J. M. J. Biotechnol. Prog. 1997, 13, 597-600.58.Ueki, Y.; Umemura, T.; Li, J.; Odake, T.; Tsunoda, K. Anal. Chem. 2004,76, 7007-7012.59.Zakaria, P.; Hutchinson, J. P.; Avdalovic, N.; Liu, Y.; Haddad, P. R. Anal.Chem. 2005, 77, 417-423.60.Hilder, E. F.; Svec, F.; Fréchet, J. M. J. J. Chromatogr. A 2004, 1053,101-106.61.Righetti, P. G. in Immobilized pH Gradients. Theory and Methodology;Burdon, R. H.; van Knippenberg, P. H., Eds.; Elsevier: New York, 1990; pp 17.62.Issa, R. M.; El-Sonbati, A. Z.; El-Bindary, A. A.; Kera, H. M. J. Inorg.Organomet. Polym. 2003, 13, 269-283.63.Rivas, B.; Martinez, E.; Pereira, E.; Geckeler, K. E. Polym. Int., 2001, 50, 456-462.64.Haddad, P. R.; Jackson, P. E. Ion Chromatography: Principles andApplications; Elsevier: New York; 1990.65.Viklund, C.; Irgum, K. Macromolecules 2000, 33, 2539-2544.66.Paull, B.; Riordain, C. O.; Nesterenko, P. N. Chem. Commun. 2005, 2, 215-217.67.Guo, D.; Mant, C. T.; Taneja, A. K.; Parker, J. M. R.; Hodges, R. S. J.Chromatogr. 1986, 359, 499-517.

Monolithic column technology for liquid chromatography


A movable seating arrangement includes a seat pan, a back support rigidly connected with the seat pan, and a seat member slidably mounted to the seat pan. The seat member can be moved from a retracted position proximate the back support to an extended position displaced forward of the upright position, without movement of the back support. In certain embodiments, a lumbar support is mounted to the back support, and motion of the seat member to its extended position causes a mid portion of the lumbar support to flex forward from a flattened position.

1. Technical Field
The present invention relates to vehicular seating furniture.
2. Discussion of Art
In multi-passenger vehicles such as buses or airplanes, seating space is scarce and it is desirable to minimize the volume occupied by each passenger. Yet such vehicles tend to travel long distances between embarkations, which means that passenger comfort is key. It is known that allowing a seat occupant to move or change position can result in them feeling more comfortable. This is particularly true in transportation situations such as in passenger aircraft where the occupant is seated for extended periods while confined within a limited space.
One way to allow the occupant to change position is to make the seat back movable relative to the remainder of the seat. This has been typically achieved by incorporating mechanisms into the seat structure that create an articulation between the bottom and back structural elements. Some articulating seats only change the included angle between the seat back and seat bottom, while some articulating seats also position the seat bottom more forward of the seat back as the articulation takes place.
Articulating seats can provide the occupant more postural options but there are limitations and disadvantages to the foregoing methods of articulation. A limitation of that type of articulation arrangement is that the components are specific to certain seat designs and are not readily added to existing seats of a different design. Another disadvantage is a lack of lumbar support adjustment in accordance with the position of the seat bottom. Additionally, the main structural parts of articulating seats typically need to be more complex and robust than those of non-articulating seats, adding significantly to the cost of the seat.
One particular challenge is to provide for movement of a passenger seat between upright and reclined positions, without intruding the passenger seat into another passenger's space. Such variation of posture is very helpful in maintaining passenger comfort during a long distance trip. Yet a fully reclined seat occupies much greater horizontal space than does a fully upright seat. It would be advantageous to provide a seat that can provide the benefits of a reclined position, within a smaller horizontal space than previously achievable.


Methods, systems, and devices for wireless communication are described to support allocation of a group-based configured uplink resource for idle mode uplink transmissions. User equipments (UEs) may be grouped geographically and/or functionally and may have sidelink communications among themselves, and may be in an inactive mode or an idle mode. A base station may allocation one or multiple configured uplink resources to the group of UEs, where the base station may be aware of the group based on signaling from a UE of the group. The group of UEs may determine which UE of the group may use the allocated resources, and in which occasions. Based on the determination, one or more UEs of the group may transmit an uplink message to the base station using the configured uplink resource assigned to the group.

Wireless communications systems are widely deployed to provide various types of communication content such as voice, video, packet data, messaging, broadcast, and so on. These systems may be capable of supporting communication with multiple users by sharing the available system resources (e.g., time, frequency, and power). Examples of such multiple-access systems include fourth generation (4G) systems such as Long Term Evolution (LTE) systems, LTE-Advanced (LTE-A) systems, or LTE-A Pro systems, and fifth generation (5G) systems which may be referred to as New Radio (NR) systems. These systems may employ technologies such as code division multiple access (CDMA), time division multiple access (TDMA), frequency division multiple access (FDMA), orthogonal frequency division multiple access (OFDMA), or discrete Fourier transform spread orthogonal frequency division multiplexing (DFT-S-OFDM). A wireless multiple-access communications system may include one or more base stations or one or more network access nodes, each simultaneously supporting communication for multiple communication devices, which may be otherwise known as user equipment (UE).
Some UEs may enter an idle mode to save power, where entering the idle mode may include ending a connection with the base station. In some cases, however, a UE may occasionally generate and transmit uplink data to the base station while in the idle mode.

Uplink resource sharing for sidelink devices


In an air duct selector, a supporting member has a grid shape, and is formed with four penetration holes. Since a film member is affixed to two fitting portions which are arranged on two ends of the supporting member, the film member is fixed on the supporting member. The supporting member and the film member are arranged in a duct to move in a vertical direction. When air flow is blown against the inside surface of the film member through the penetration holes 24a.about.24d, the film member is bent to swell against the film member, and presses against a peripheral portion of a cool air bypass opening portion to entirely cover the cool air bypass opening portion.

1. Field of the Invention
The present invention relates to a compact automotive air conditioner and, more particularly, to an air duct selector used in such a device.
2. Description of the Related Art
Conventional temperature controlling methods of an automotive air conditioner can be roughly classified into two groups; that is, a reheat system and an air mix system. Firstly, in the reheat system, an evaporator and a heater core are arranged in an air duct to completely close the air passage in the duct. By adjusting a heating power of the heater core, a desired air temperature is achieved. In the other system, i.e., in the air mix system, a bypass passage in which air passing through an evaporator detours around a heater core is installed, and the ratio of air passing through the bypass passage to that passing through the heater core is adjusted by the air mix door to provide a desired air temperature.
Incidentally, the reheat system and the air mix system have both good points and bad points. In the reheat system, because a space accommodating the air mix door is not needed, the size of the air conditioner becomes smaller. However, in the reheat system, because the air passing through the evaporator always passes through the heater core, air resistance is increased, and a required amount of mixed air cannot be obtained when the heating power of the heater core is zero, for example.
In the other system, i.e., in the air mix system, in a maximum cooling mode, because the air is not sent to the heater core, the air resistance can be decreased. However, in the air mix system, because space is needed for rotating the air mix door, there is a problem in that the size of the air conditioner becomes larger.
A conventional system has been disclosed in which the air resistance is not increased and the size of the air conditioner itself is not increased to control the air temperature, for example, in Japanese Patent Publication Laid-Open No. Hei 4-257720. In that system, opening and closing of an air passage and mixing of the warm air and the cool air are controlled by a thin film member, and miniaturization of the air conditioner is achieved.
However, in such a conventional air conditioner, because a drive shaft is needed for doing storage and rewind at the end of the film (similar to a film canister), there are problems in that the air conditioner needs a large number of components and the cost becomes very high.
Further, an air conditioner is disclosed in Japanese Utility Model Laid-Open Publication No. Hei 6-71222 in which the air mix door is not a rotating system, but instead is a sliding door which vertically slides relative to a direction of air flow, and thereby a ratio of cool air to warm air is controlled.
However, in the above-described sliding door of the air conditioner, though a mixing ratio of cool air to warm air is controlled by the sliding door, for example, in the maximum cooling mode, there is a problem in that cooling power is decreased when a space between the sliding door and the casing of the air conditioner is not entirely sealed as the air is leaked through the slide door to the heater core. Besides, in Japanese Utility Model Laid-Open Publication No. Hei 6-71222, a sealing structure is not installed between the sliding door and the air conditioning case, and the structure cannot be sealed for practical use.
Thus, it is conceivable that the space between the sliding door and the air conditioning case may be sealed by a seal on the sliding door, for example. However, when such a seal is put on the sliding door and the sliding door simply moves in a straight line, because the seal is pressed against the air conditioning case, there is a problem in that the amount of force required to control the sliding door becomes larger. Further, the seal may come off by repeated actuation of the sliding door; therefore the sliding door air does not adequately seal the air passage.


During formation of an ad hoc group, the transmit power level of a user device within a wireless communication network is reduced. Potential group members are thus identified within an immediate vicinity of the user device.

Bluetooth and other wireless network technologies enable users to create small network groups, known as ad hoc groups, that allow users to exchange data/contact information during, for example, meetings and informal encounters. A user device having wireless network capabilities will typically maintain a list of all other active network devices that are within range of the device. To establish an ad hoc group, a user must typically go through the list of active devices to select the individual devices that he wishes to include in the group. Unfortunately, such lists are often very long, sometimes including one hundred or more devices. In addition, these lists often identify individual devices using identifiers (e.g., medium access control (MAC) address, machine name, etc.) that do not necessarily identify the corresponding users of the devices. Therefore, the process of forming an ad hoc group can be difficult and time consuming.

Method and apparatus for establishing ad hoc groups in a wireless communication network


A process for fabricating a pad frame for an integrated circuit package includes building up metal on selective portions of a first side of a substrate to define a plurality of contact pads disposed in a first layer of dielectric material, depositing a metal seed layer on an exposed side of the contact pads and the dielectric material, applying a second metal layer on the metal seed layer, selectively etching the second metal layer and the metal seed layer to provide pad frame circuitry, and building up metal on selective portions of the pad frame circuitry to define a plurality of die connect pads separated by a second layer of dielectric material, the die connect pads being electrically connected to the contact pads by the pad frame circuitry.

An etch back process for fabricating a frame for an integrated circuit package is disclosed in U.S. Pat. No. 6,498,099, assigned to the assignee of the present application, the entire contents of which are incorporated herein by reference. According to this process, a copper substrate strip is first subjected to a partial etch on one or both of the top and bottom surfaces to create a pattern of contact leads (pads) and a die attach pad (paddle). After wire bonding the contacts to a singulated semiconductor die, followed by overmolding and curing of the mold, the leadframe strip is exposed to a second immersion etch for exposing the contact pads in an array pattern (i.e. multi-row) or perimeter pattern (i.e. single row), as well as the die attach pad. In the case of a package with multi-row I/O leads, this etch back step eliminates the previously required two additional saw singulation operations (i.e. to sever the inner leads from the outer leads), and in both the single-row and multi-row configurations, the etch back step eliminates the previously required post mold processing steps (e.g. mold deflashing) and ensures superior device yield over prior processing techniques. Additionally, this technique allows for higher I/O pad density and pad standoff from the package bottom compared to prior art techniques, thereby reducing stress in the solder joint during PCB temp cycling. Further, the technique allows for the use of a pre-singulation strip testing technique since the electrical I/O pads are isolated from each other. This feature greatly increases the handling and throughput of the test operation as compared to prior processes.
According to co-pending U.S. patent application Ser. No. 09/802,678 for a Leadless Plastic Chip Carrier With Etch Back Pad Singulation, assigned to the assignee of the present application, the entire contents of which are incorporated herein by reference, a build up fabrication process is provided. The build up process is carried out on a copper substrate strip. Metal layers are selectively plated up on the copper substrate strip to provide built-up die attach pads, each circumscribed by at least one row of contact pads (I/O pads) on the copper strip. After the build up process, semiconductor dice are fixed to respective die attach pads and gold wires are bonded between pads of the semiconductor dice and respective contact pads. The packages are then molded by placing the substrate strip in a mold. Following molding of the packages, the copper substrate strip is etched away to expose the die attach pad and the contact pads of each package.
Flip chip packages have become possible with advances in package fabrication including forming and placing of solder balls. Such packages are desirable due to increased electrical and mechanical performance. Direct connection of the semiconductor die to a pad frame surface in a flip-chip orientation, using solder ball connections provides low impedance packages relative to the use of wire-bond connections and provides reduced package space. Popularity of flip chip, thin array plastic packages has been limited by fabrication and cost of manufacture of pad frames, however.
Further developments in packaging technology are therefore driven by demand for improved reliability, electrical performance, decreased size and cost of manufacture.

Process for fabricating pad frame and integrated circuit package


A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

1. Field of the Invention
The present invention relates to a process and an apparatus for forming ball bumps on the inner leads of a film carrier, the electrode pads of a semiconductor chip, the electrode pads of a printed circuit board, the electrode pads of a flexible circuit board, and the like.
The present invention also relates to a process and an apparatus for removing excess balls from an arrangement plate on which small balls for forming the bumps are held and arranged.
2. Description of the Related Art
The known bumps formed on the electrode pads of an semiconductor chip include wafer bumps and stud bumps.
The wafer bumps are formed on the electrode pads of semiconductor devices fabricated on a semiconductor wafer and not yet cut into chips, by first forming a barrier metal coating on the electrode pads, and then forming a gold or other metal bump on the barrier metal by plating.
The wafer bump has the problems of an increase in the number of the process steps, a reduction in the production yield of the semiconductor devices, and an unacceptable cost particularly when producing many types in small amounts.
The stud bumps are formed on the electrode pads of semiconductor chips by first ball-bonding the pads in the same manner as in the first step of the wire bonding process, and then cutting the bonded wire in its neck to leave a bump on the pad.
The stud bumps have problems in that the cut bumps have pointed tops with uneven heights causing poor reliability and that much process time is required because the bumps are formed pin by pin.
Another known process forms a transferred bump by first growing bumps on a substrate by plating, and then transferring the bumps onto the inner leads of a film carrier. The bumps formed by plating have a semispherical shape providing a bump width greater than a required bump height, and is not suitable for bonding at a small pitch of less than 100 .mu.m.
To solve the above-mentioned problems, a process was proposed to form bumps by transferring small metal balls onto the inner leads.
This process has also a problem in that much time is required in arranging balls one by one on a bonding stage in positions corresponding to positions of the inner leads.
There is also a problem in that, during arranging small metal balls on an arrangement baseplate, excess balls are undesirably adhered to the baseplate or other balls due to electrostatic interaction, etc. Although such excess balls must be thoroughly removed from the baseplate, this is very difficult because the metal balls are very small in size (100 .mu.m or less) and great in number.
U.S. Pat. Nos. 4,332,341 and 5,284,287 disclose a method of attracting small balls to positions corresponding to positions of electrode pads of a semiconductor chip. These patents do not disclose the use of vibration for causing the balls to jump up or removing excess balls. These patents use a small solder ball only.
U.S. Pat. No. 4,462,534 disclose a method of attracting small balls to positions corresponding to positions of electrode pads of a semiconductor chip and a method of causing small balls to jump up for the attraction thereof. This patent does not disclose the use of vibration to remove excess balls. The disclosed small balls are solder balls and are bonded to the head of a connector pin.

Process and apparatus for forming ball bumps


The present disclosure relates to diagnostic test devices that provide increased comfort and ease of use. The diagnostic test device can include a test member, such as a lateral flow assay test strip. The test device can further comprise a housing that comprises a substantially arch shaped handle. The housing of the test device can comprise a base member that is attached to a curved lower surface of the housing and that can improve stability of the device in an upward facing position as well as enable angled positioning of the device relative to a flat, horizontal surface. The curvature of the test device in particular can provide secure handling of the device while also improving ease and comfort of use thereof. The disclosure further relates to methods of determining the presence of an analyte in a fluid sample and methods for evaluating a test result of a personal use diagnostic test device.

Many types of ligand-receptor assays have been used to detect the presence of various substances in body fluids, such as urine, saliva, or blood. Some commercially available assays are designed to make a quantitative determination, but in many circumstances all that is required is a qualitative positive/negative indication. Examples of such qualitative assays include blood typing, pregnancy testing, and many types of urinalysis.
U.S. Pat. No. 6,485,982, which is incorporated herein by reference in its entirety, describes a diagnostic test cell or device formed of an elongated outer casing which houses an interior permeable material (such as glass fiber) capable of transporting an aqueous solution by capillary action, wicking, or simple wetting. The casing defines a sample inlet, and interior regions, which are designated as a test volume and a reservoir volume. The reservoir volume is disposed in a section of the test cell spaced apart from the inlet and is filled with sorbent material. The reservoir acts to receive a fluid sample transported along a flow path defined by the permeable material and extending from the inlet and through the test volume. In the test volume is a test site comprising a first protein having a binding site specific to a first epitope of the ligand immobilized in fluid communication with the flow path (e.g., bound to the permeable material or to latex particles entrapped in or bonded to the permeable material). A window, such as a hole or transparent section of the casing, permits observations of the test site through the casing wall. The use of the test cell requires a conjugate comprising a second protein bound to colored particles, such as a metal sol or colloid, preferably gold. The conjugate can take two distinct forms, depending on whether the assay is designed to exploit the "sandwich" or "competitive" technique.
U.S. Pat. No. 7,045,342, which is incorporated herein by reference in its entirety, describes a diagnostic test device including a biphasic chromatographic medium. The biphasic substrate is formed of a release medium joined to a capture medium located downstream of the release medium. The release and capture media preferably comprise two different materials, or phases, having different specific characteristics. The two phases are joined together to form a single fluid path such that a solvent front can travel unimpeded from the proximal (upstream) end of the release medium to the distal (downstream) end of the capture medium.
For tests such as those described above, visually observable indicia can be preferred. Such indicia typically have included the presence of agglutination or a color change at a defined site on the assay. More recent efforts have included providing electronic (i.e., digital) signals as the observable indicia. For example, U.S. Pat. No. 7,763,454, which is incorporated herein by reference in its entirety, describes an electronic analyte assaying device that includes an electronic processing system and a liquid crystal display (LCD). The device includes a chromatographic medium and utilizes electronic components for evaluation of the test as well as display of the test results. Nevertheless, user interface with diagnostic test devices remain limited.
In particular, known point of care or over the counter diagnostic test devices lack an ergonomically favorable structure. As such, it is often difficult for a user to handle the device during application of the test fluid, such as from a urine stream, which can lead to either insufficient fluid application or device flooding. Because of these and other reasons, it would be beneficial to provide a personal use test device with improved ergonomic structure for ease of grip and use.

Diagnostic test device with improved structure


A voltage controlled oscillator that can rapidly change frequencies over a wide range is disclosed. The voltage controlled oscillator has a transistor having a base, an emitter and a collector. An output port and a power supply port are connected to the collector. A high pass filter is connected between ground and the base of the transistor. A tuning element is connected between the high pass filter and ground. The tuning element includes a pair of varactor diodes. The varactor diodes have their cathodes connected together at a first node. A series combination of a resistor and inductor are connected between a tuning port and the first node. A capacitor is connected between the first node and the emitter.

1. Field of the Invention
This invention relates to oscillators in general and more particularly to a voltage controlled oscillator that can rapidly change frequencies over a wide range.
2. Description of Related Art
Voltage controlled oscillators are used in many electronic applications such as telecommunications. A voltage-controlled oscillator (VCO) is a circuit that generates an oscillating signal at a frequency proportional to an externally applied control voltage. Modern electronics often require a VCO to operate over large frequency ranges. Some applications require the voltage controlled oscillator to rapidly change the carrier frequency. These types of oscillators are referred to as agile voltage controlled oscillators.
The ability of a voltage controlled oscillator to change frequencies can be measured by 3 dB modulation bandwidth and tuning time. Normally, the 3 dB modulation bandwidth is determined at a low modulation index. This means that the deviation of the carrier frequency is significantly less than the carrier frequency itself or the amplitude of the modulating signal is small.
There are applications where the carrier frequency must change significantly in a short period of time. In these applications, the frequency deviation is large and the amplitude of the modulating signal applied to the tuning port has a large value. In some cases, the amplitude may cover the entire tuning voltage range. Tuning the frequency fast requires the modulating signal applied to the tuning port to have a large rise time or dv/dt, which is measured in volts per second.
For example, the modulating signal applied to the tuning port of a VCO could increase from 1 volt to 11 volts in 2 nanoseconds. This gives a rise time of 5 volts per nanosecond. This sharp or large rise time signal applied to the tuning port penetrates beyond the tuning components (typically varactor diodes) and can completely disrupt the normal operation of the VCO. Voltage controlled oscillators that are designed with a wide 3 dB modulation bandwidth such as 10 MHz cannot handle a 5 volt per nanosecond tuning signal.
Referring to FIG. 1, a schematic diagram of a typical Clapp voltage controlled oscillator 20 is shown. The typical frequency tuning range of the Clapp oscillator is approximately a 2:1 ratio. For a wide frequency tuning range capacitors C1 and C2 should be large. When a large rise time signal is applied to the tuning port Vtune, capacitor C1 will start to charge. The charge time is determined by the capacitance value of C1 and the total resistance. The total resistance is equal to Rtune+R4+R2, where R tune is the tuning port source impedance and R4, R2 are the resistances of resistors R4 and R2.
Referring to FIG. 2, a graph of the frequency response of the Clapp oscillator of FIG. 1 when a sharp step-up voltage is applied to the tuning port is shown. If capacitor C1 has a value of 1000 picofarads, R4 is 4000 ohms and R2 is 4000 ohms, the time constant will be 8 microseconds. The 3 dB modulation bandwidth is 60 KHz. The fast rise time of this signal appears almost without attenuation at the base of transistor Q1. The fast signal causes the DC operation point of transistor Q1 to move, stopping or interrupting oscillation. The oscillation resumes as capacitor C1 charges and the transistor base voltage comes back to a normal steady state value.
FIG. 3 shows a graph of the frequency response of the Clapp oscillator of FIG. 1 when a sharp step-down or decreasing voltage is applied to the tuning port. The effect is similar for a decreasing voltage. If the modulating signal applied to the tuning port of a VCO decreases from 11 volts to 1 volt in 2 nanoseconds, the negative pulse on the base of transistor Q1 results in the transistor turning off, stopping oscillation. The transistor may even enter an operating condition where it can sustain damage during the positive or negative pulse.
Turning to FIG. 4, a schematic diagram of a typical Colpitts voltage controlled oscillator 30 is shown. The Colpitts oscillator handles a narrower frequency range than the Clapp oscillator circuit. Also, the 3 dB modulation bandwidth and tuning speed are better in a Colpitts oscillator than a Clapp oscillator. The frequency limitations for the Colpitts oscillator are capacitors C1 and C2. In the Colpitts oscillator, capacitor C1 has a lower value and charges faster. The frequency tuning range of a Colpitts oscillator is a 5 to 10 percent change in frequency. A sharp step up voltage applied to the tuning port of the Colpitts oscillator has less effect because the resonator inductor L1 is a low shunt impedance to ground and capacitor C1 has a high series impedance to the base of transistor Q1. Colpitts oscillators typically do not have a problem with oscillation interruption during fast tuning. Unfortunately, they are limited to being able to tune frequencies in only a narrow frequency range.
While various oscillators have been used, a continuing need exists for a voltage controlled oscillator that has improved electrical performance. In particular, a voltage controlled oscillator that can rapidly change frequencies over a wide frequency range without an interruption in oscillation is needed.

Wide frequency range agile voltage controlled oscillator


An optical system including an array of photonic devices that convert light signals to electrical signals or electrical signals to light signals are coupled together and optically coupled to an array of optic fibers of an information channel. A lens couples optical beams generated to at least one array of photonic devices and the array of optic fibers for an optical communication there-between. The array of photonic devices and the array of optic fibers are respectively arranged in a honeycomb configuration.

Advances in technology have made communication using electromagnetic waves are the most reliable and fastest ways of communicating information between points. In general, electromagnetic communication systems generate information at a source (e.g., transmitter). Information is transmit as a signal through a channel, such as free space in radio applications, electronic lines in telephone and internet applications, or optic fibers in fiber optic applications. During transmission, a channel propagating information usually induces loss in a signal and/or distorts the signal. Likewise, various other mechanics may introduce noise in a signal. A signal is typically received by a receiver which can utilize and/or decode the signal.
An optic engine or transmitter utilizes a laser diode (LD) or light-emitting diode (LED) to encode data through modulation, such as amplitude modulation (AM), frequency modulation (FM), and digital modulation. LD and LED sources commonly generate signals with wavelengths in a range from 660 nanometers (nm) to 1,550 nm. Encoded data is propagated through an optic fiber (e.g., silicon). Optic fibers, couple to an optical receiver which detects, amplifies, and decodes (demodulates) the encoded data.
The above-described deficiencies are merely intended to provide an overview of some of the problems of conventional systems, and are not intended to be exhaustive. Other problems with conventional systems and corresponding benefits of the various non-limiting embodiments described herein may become further apparent upon review of the following description.

High-density fiber coupling and emission/detection system