A high power semiconductor package includes a substrate including a base metal layer, a base insulation layer formed on the base metal layer, and a plurality of conductive patterns formed on the base insulation layer. In one embodiment one or more high power semiconductor chips are mounted on the substrate, each including a plurality of bonding pads, one or more first package leads having end portions that are electrically connected to the corresponding conductive patterns, and a second lead having an end portion electrically which may be connected to either the base insulation layer or the base metal layer.

1. Field of the Invention
The present invention relates to a semiconductor package, and more particularly, to a high power semiconductor package generating a lot of heat.
2. Description of the Related Art
Electric power devices, for example, silicon-controlled rectifiers (SCRs), power transistors, insulated-gate bipolar transistors (IGBTs), MOS transistors, power rectifiers, electric power regulators, inverters, converters, or high power semiconductor chips combining the above listed devices are designed to operate within a voltage range of 30V through 1000V or higher. The high power semiconductor chips operate at high voltages unlike low power semiconductor chips such as logic devices or memory devices, and thus, generally are required to have a high heat dissipation efficiency for dissipating heat generated from the high power semiconductor chip and also to have a high electrical insulation property under high operational voltages.
FIG. 1 is a cross-sectional view of a conventional high power semiconductor package 100.
Referring to FIG. 1, a substrate 40 in the high power semiconductor package 100 can include a base metal layer 10 for transmitting the heat to a heat dissipation plate 80, a base electrical insulation layer 20 formed on the base metal layer 10, and a conductive pattern 30 formed on the base insulation layer 20. A high power semiconductor chip 50a and/or a low power semiconductor chip 50b can be mounted on the substrate 40. An insulation member 52 for insulating the conductive pattern 30 from the low power semiconductor chip 50b can be disposed between the conductive pattern 30 and the low power semiconductor chip 50b.
Wire bonding pads 51 that are electrically connected to corresponding conductive patterns 30 can be formed on the high power semiconductor chip 50a and the low power semiconductor chip 50b.
In general, the wire bonding pads 51 of the high power semiconductor chip 50a and the low power semiconductor chip 50b are electrically connected to the conductive patterns 30 by bonding wires 70. After the wire bonding process, the conductive patterns 30 are connected to leads 60 which form external terminals of the semiconductor package 100 and the high power semiconductor package 100 is completed by performing a transfer molding process using a molding material such as an epoxy molding compound (EMC).
In general, the high power semiconductor package 100 generates a lot of heat during operating, and thus, the heat dissipation plate 80 is attached onto the base metal layer 10. The heat dissipation plate 80 is generally formed of a metal having superior thermal conductivity. The heat dissipation plate 80 can be attached onto the base metal layer 10 using an attachment member 85 such as a heat-resistant grease.
FIG. 2 is a schematic side view illustrating a circuit for electrical insulation testing of the high power semiconductor package 100 of FIG. 1.
The high power semiconductor chip 50a operates at the high voltage, for example 600V or higher, in a normal operation mode, and the base electrical insulation layer 20 that insulates the conductive patterns 30 from the base metal layer 10 is required to have high voltage electrical insulating properties. In order to evaluate the insulation property of the base insulation layer 20, the high power semiconductor package 100 undergoes the electrical insulation tests.
When the heat dissipation plate 80 is attached to the high power semiconductor package 100, the electrical insulation test can be performed by checking whether an electric current flows between the heat dissipation plate 80 and the leads 60 while applying a high voltage between the heat dissipation plate 80 and all of the leads 60 that protrude from the semiconductor package 100. However, since usually the heat-resistant grease 85 is an electrical insulator, the above electrical insulation test cannot reflect the insulation property of the base insulation layer 20 exactly.
In addition, it may sometimes be desirable to electrically connect together the base metal layer 10 and the heat dissipation plate 80 and have the heat dissipation plate 80 grounded in order to provide the high power semiconductor package 100 with an external ground for attenuating electrical noise. However, for the package 100 shown in FIG. 1, it may be difficult to provide the base metal layer with the reliable external grounding if the heat-resistant grease 85 has electrical insulating properties.

High power semiconductor package and method of making the same


A system for housing secondarily contained flexible piping comprises a flexible conduit resistant to mechanical stresses, the conduit adapted to surround the secondarily contained flexible piping. The conduit comprises a metallic core and a thermoplastic jacket. The secondarily contained flexible piping comprises an inner supply pipe, wherein the inner pipe is comprised of a first, inner layer fabricated from nylon, a second, intermediate layer comprising a nylon reinforced wrap, and a third, outer layer comprising a polyethylene material, the nylon inner material, the nylon wrap and the polyethylene outer layer being extruded simultaneously to form the inner pipe. The secondarily contained flexible piping further comprises a flexible outer secondary containment pipe within which the inner supply pipe is carried, the outer pipe being fabricated from a fuel impervious material and having a plurality of radially projecting flanges disposed between the inner supply pipe and the outer secondary containment pipe, to provide a locking engagement of the pipes with respect to each other and to provide for a flow passage between the pipes.

The present invention relates to secondary containment systems and especially, although not exclusively to a piping construction and a system for housing secondarily contained piping above-ground and underwater for hydrocarbon storage and delivery systems.
A secondary containment system is one which functions to collect and contain the fluids leaking out of another (primary) containment system. For example, a primary containment system may store and deliver gasoline at a filling station. A secondary containment system would collect and contain the same gasoline if a primary delivery pipe should rupture or otherwise spill the gasoline. Secondary containment systems have been developed to overcome the environmental problems that have been encountered with respect to leakage of hazardous fluids from tanks and pipe lines. As indicated, this can be a particular problem with respect to underwater installations in which undetected leakage of hazardous fluids into the surrounding water over long periods of time can produce harmful conditions for both sea life and human beings, as well as extensive pollution which is difficult and expensive to clean.
Today there is also great public concern with above-ground piping, because chemicals are penetrating into underground water supplies, contaminating public drinking water and making some of the food supply unusable, among other things. The entire environment may be in the process of being degraded to a serious level which tends to cast doubt on the future availability of safe water. Therefore, many government agencies have enacted, and continue to enact laws which require a secondary containment system designed to capture and contain the spilled gasoline or other liquid materials in order to prevent them from leaking into the earth below any above-ground piping, or into the water surrounding underwater piping. The captured gasoline or other liquid material may then be pumped out of the secondary container for proper disposal. This eliminates the possibility of gasoline spillage to contaminate surrounding water or underground water supply.
Manufacturers of containment systems have responded by developing and producing a variety of secondary containment systems for conventional underground piping which are designed to contain and prevent any leakage from escaping into the environment. Many of these systems have proven to be effective containment systems but have been found to be difficult and costly to install.
In addition, these systems are not applicable for use in above-ground or underwater installations. These particular installations have special considerations which include, but are not limited to: piping flexible enough to bend around existing structures and/or sea terrain; both the primary and secondary piping should be removable for repairs and/or replacement; the primary and secondary piping should be protected from external damage, and from degradation from ultraviolet rays; the piping system should be waterproof; and the piping should be strong enough to be protected from external loads such as boat props and the like.
It can be very difficult and expensive to meet all of the many different environmental and safety standards at a reasonably acceptable cost, particularly in light of the many state and local governments writing individual laws that impose a wide variety of standards which the manufacturers of such systems must meet.
Accordingly, an object of the invention is to provide a new and improved secondary containment system which will draw all spilled fluids that may leak from a primary supply pipe to a preselected collecting point which may be monitored. It is a further object of the present invention to provide a system for housing such a secondary containment system. Still further, it is an object of the present invention to provide such a housing system which is flexible, yet provides rigidity and protection against fire. Yet still further, it is an object of the present invention to provide such a housing system which allows for both the primary and secondary piping to be removable for repairs and/or replacement. It is another object of the present invention to protect the primary and secondary piping from external damage, and from degradation from ultraviolet rays. It is yet another object of the present invention to provide such a housing system which is waterproof. Still further, it is another object of the present invention to provide a housing system which is strong enough to be protected from external loads such as boat props and the like.
A further object of the present invention is to provide a practical secondary containment system within a housing system which may be manufactured in a factory, shipped and installed at a reasonably low cost in a fully usable manner; and yet one which meets all requirements of the environment within which it must be used. It is a further object of the present invention to provide an economical, easily installed, highly durable and environmentally secure flexible piping system within a housing system.

System for housing secondarily contained flexible piping


A CML digital circuit includes a load coupled between a power supply node and at least one output node and a logic circuit component coupled to the output node. The logic circuit component has at least one data input node. The logic circuit component comprises a first circuit module and a second circuit module. A first tail current source is coupled to the first circuit module. A second tail current source is coupled to the second circuit module. A first switch is coupled between the power supply node and the first tail current source. A second switch is coupled between the power supply node and the second tail current source, wherein the first switch is triggered to deactivate the first circuit module when the second circuit module is operating and the second switch is triggered to deactivate the second circuit module when the first circuit module is operating.

When high-speed and low voltage swing data transfer is needed, differential signaling (also commonly referred to as double ended signaling) is perhaps the most robust and promising signaling concept. Differential signaling can add an additional measure of noise immunity due to the fact that the transmitted signal is carried on two conductors and is the difference of the two signals on the two conductors. Current mode logic (CML), a design technique commonly used in high speed signaling applications such as high-speed data communication systems, communications chips and routers, uses differential signaling.
Current-mode-logic (CML) circuits have been widely used in high-speed data communication systems due largely in part to improved switching speeds when compared with voltage-mode-logic circuits. CML circuits can operate with low signal voltage and higher operating frequency at lower supply voltage than static CMOS circuits. CML is also widely used in high-speed applications due to its relatively low power consumption and low supply voltage when compared to other types of logic designs, such as emitter coupled logic (ECL). CML is also considerably faster than CMOS due to its lower voltage swings.
CML has an additional advantage over other high-speed forms of logic such as logic using Gallium Arsenide (GaAs) in that CML can be fabricated using the same fabrication lines as the widely used CMOS circuits, thus allowing CML circuits to be created on high-technology fabrication lines without requiring a significant outlay of money to create a special fabrication line. Additionally, CML logic may cohabitate with CMOS logic on the same integrated circuit. Therefore, such hybrid circuits can combine the high-speed aspects of CML logic and the low power requirements of CMOS logic.
As those in the art will understand, the standard MOS CML structure, whether MUX circuit, AND2 gate, data latch, etc., comprises three main parts: the pull up resistors, the pull down network switch and the current source. The inputs to the pull down network are fully differential. The pull down network can implement any logic function (MUX, AND, OR, XOR, etc.) but must have a definite value for all possible input combinations. The pull down network is regulated by a constant current source referred to as the tail current source. The pull down network steers the current from the current source to one of the pull up resistors based upon the implemented logic function. The resistor connected to the current source through the pull down network will have current flowing therethrough, causing a voltage drop, whereas the other resistor will not have any current flowing through its output node and will be pulled up to VDD. The output swing is set exclusively by the amount of current and the value of the resistor load and is generally much smaller than VDD, in the order of a few hundred millivolts.
FIG. 1 is a circuit diagram of a prior art CML data latch 10, more specifically a falling edge triggered CML D flip-flop. The operation and structure of the data latch 10, as well as modification thereto, should be familiar to those in the art, but are briefly described hereafter. The CML data latch 10 includes a pair of differential outputs OUTP and OUTN coupled to load resistors R1 and R2; a tail current source 12 which may comprises a NMOS transistor; an input tracking stage including transistors M3 and M4, utilized to sense and track the data variation, e.g., the data signals data not (DN) and data (D); and a cross-coupled regenerative pair, transistors M5 and M6, for providing positive feedback to store the data. The track and latch modes are determined by the clock signal input to a second differential pair, transistors M1 and M2.
When signal clock not (CLKB) is high, selection transistor M1 is on, coupling tail current source 12 to the track transistors M3, M4. Selection transistor M2, coupled to latch transistors M5 and M6, receives low signal CLK and is off, disconnecting transistors M5 and M6 from current source 12. Transistors M5 and M6 are off. In this state, the track transistors M3, M4 essentially sense and transfer the data to the outputs OUTP and OUTN. If D is high, meaning DN is low, M4 is on and M3 is off. Node OUTP goes to VDD, as no current flows through resistor R1. Node OUTN goes to a lower voltage (VDD−R2*it), as the tail current flows through transistor M4 and R2.
When CLK is high, M1 is off, the tracking mode is disabled meaning that the tracking transistors M3 and M4 are disconnected from current source 12. Selection transistor M2 is on enabling the tail current it to flow through the regenerative pair consisting of transistors M5 and M6 which stores the logic state at the OUTP and OUTN nodes. Whatever data at nodes OUTN and OUTP at this transition time are latched. The outputs stay at this data state until the next clock transition, thereby isolating the output from the input.
In deep submicron CMOS technologies, such as 0.13 μm technology and below, the typical power supply is 1.0V. Often, a power supply has +5% to −10% tolerance variations. Therefore, with a 1.0V VDD, the worst case power supply can be 0.9V. In the circuit of FIG. 1, the output swing is set exclusively by the amount of tail current (it) and the value of the resistor load (R1, R2) and is generally much smaller than VDD, in the order of a few hundred millivolts. In most data communication applications, a single-ended-peak output swing of 0.2V (e.g., R*it/2) is often required. With a single-ended-peak output swing of 0.2V, the output common mode voltage of the latch circuit is 0.7V (e.g., VDD−0.2V). The CML latch circuit 10 suffers from severe headroom problems when designed in a 1.0V (worst case 0.9V) supply voltage. When CLKB is high, the common-mode voltage at the inputs (e.g., D and DN) needs to ensure that transistors M3, M4, M1 and the tail current transistor are operated in saturation mode. Similarly, when CLK is high, the common-mode voltage at the outputs (e.g., OUTP and OUTN) needs to drive transistors M5, M6, M2 and the tail current transistor into saturation mode. Therefore, the common-mode voltage at both the inputs and the outputs need to satisfy the following equation:VCM≧VTH-NMOS+2VDSAT-NMOS.  (1)In EQ. (1), VTH-NMOS is the threshold voltage of the NMOS transistor and is typically about 0.4 to 0.5V in a deep submicron technology; and VDSAT-NMOS is the saturation drain-to-source voltage of the NMOS transistor and is typically around 0.2V. As a result, a VCM larger than at least 0.8V (0.4V+2*0.2V) is required to operate the latch circuit properly. With a worst case VDD of 0.9V and a single-ended-peak output swing of 0.2V (and therefore an output common-mode voltage of 0.7V), the output common-mode voltage is insufficient to drive the transistors into saturation mode. The input nodes (e.g., D and DN) of the latch circuit is often connected to the output nodes of a previous stage CML circuit and therefore the input common-mode is set by the output common-mode voltage of the previous CML circuit. Therefore, it is also difficult to set the input common-mode voltage to be above 0.8V. The design therefore suffers severe headroom problems. The latch circuit cannot acquire a wide input common-mode range, and the output swing of the latch circuit is small reducing the robustness of the circuit. In addition, with the devices in the triode region, the power supply rejection (i.e., rejection of noise from the power supply) is poor resulting in noisy output waveforms.
Addressing these problems in deep submicron CMOS technology is particularly difficult because the threshold voltage VTH-NMOS and the saturation drain-to-source voltage VDSAT-NMOS do not shrink proportionately with reductions in the power supply. Removing the tail current source 12 is one possible method of addressing the headroom issue, thus relying on M1 and M2 to provide the tail current. With this proposed solution, however, the tail current would be inaccurate due to at least the uncertainty of the common-mode voltage and the voltage swing of the CLK and CLKB signals, etc., which results in an inaccurate output common-mode voltage as well as output swing. Also, with an inaccurate tail current, the transconductance of the track stage transistors M3, M4 can vary significantly, requiring oversized transistors M3, M4 for proper tracking operation. Another possible solution to address the headroom issue is to use low threshold voltage transistors. However, this requires extra mask steps in the manufacturing process that are not available in a typical CMOS process. The extra mask steps to lower the threshold voltage also make the manufacturing costs prohibitively expensive.
Therefore, there remains a need for CML circuits, particularly deep submicron CML circuits, with better headroom performance.

CML circuit devices having improved headroom


A two-step method for treating tooth hypersensitivity so as to prevent, reduce or eliminate the same, and a kit for use in the same, are disclosed.

Tooth hypersensitivity is a common problem which affects about 40 million adults in the United States, 10 million of which can be considered chronically affected (Kanapka, Dent. Clin. North Am., 34:54 (1990)). It is estimated that some 14% of adults in the U.S. have at least one or more sensitive teeth. The teeth may be sensitive to cold, heat, air or sugary foods.
The incidence of tooth hypersensitivity increases with age. The increased incidence is believed to be related to the general increase in exposed root surfaces of teeth as a result of periodontal disease, tooth brush abrasion or cyclic loading fatigue of the thin enamel near the dento-enamel junction.
The currently accepted theory for tooth hypersensitivity is called the hydrodynamic theory. This theory is based on the belief that open dentinal tubules allow fluid flow through the tubules. This flow excites the nerve endings in the dental pulp. Clinical replicas of sensitive teeth viewed in the scanning electron microscope (SEM) reveal varying numbers of open or partially open dentinal tubules.
Tubules generally are not seen at the tooth root surface because of the cementum covering the tooth root, or because of a smear layer of dentinal debris 2-5 microns in thickness that covers the tooth surface and masks the tubules. When the smear layer is present on the dentin, the fluid flow that can occur through the dentin is only a few percent of that possible following acid removal of the smear layer, which "opens" or uncovers the tubules.
There is a growing body of evidence that occlusion of the dentinal tubules of a sensitive tooth, whether by resin infiltration, varnish coat or more recently by crystallite precipitation, results in reduction or elimination of the hypersensitivity. The duration of relief, however, is highly variable. Hypersensitivity usually reappears because of tooth brush abrasion, presence of acid challenges in the mouth or aging of the coating material.
Various agents have been used to reduce tooth hypersensitivity, including potassium nitrate (Hodosh, J. Am. Dent. Assoc., 88:831 (1974), which is the active ingredient in the dentifrice AQUAFRESH SENSITIVE.TM.; strontium chloride, which is the active ingredient in the dentifrice SENSODYNE.TM.; and other reagents, such as sodium fluoride, which dentists may apply directly to the dentin to reduce sensitivity.
A two-step procedure involving application of a calcium nitrate solution and a potassium phosphate solution to the tooth has been found to produce numerous calcium phosphate crystals (Kaminske et al, J. Dent. Res., 69:68 (1990)).
Increasing concentrations of oxalic acid in the food bolus derived from dietary sources, up to 1.14 g/l, have also been found to yield precipitation of a deposit at the tooth surface. A maximal response was found to be obtained at a level of 0.1% (w/v) oxalic acid equivalents. Greater levels of oxalic acid did not yield greater protection of teeth. It has been postulated that the deposited material is calcium oxalate, resulting from interaction of the oxalic acid with calcium in the saliva (Gortner et al, J. Nutr., 32:121 (1946)). However, it is well-known that the level of calcium in saliva is very low, and thus the proposed mechanism may be incorrect.
Solutions of alkali metal or ammonium oxalates have also been used to reduce tooth hypersensitivity. The low pH of these solutions is believed to mobilize calcium and phosphate from the hard tissues (U.S. Pat. No. 4,057,621).
In addition, a 3.0% (w/v) monohydrogen monopotassium oxalate solution has been found to occlude dentinal tubules (Pashley et al, Arch. Oral. Biol., 23:1127 (1978)).
A variety of protein precipitants and tubule occluding agents have been evaluated by measuring the effect thereof on hydraulic conductance of human dentin. Potassium oxalate has been reported to yield a large reduction in conductance (Greenhill et al, J. Dent. Res., 60:686 (1981)).
Over-the-counter desensitizing dentifrices and an experimental 2.0% (w/v) potassium oxalate dentifrice for tubule occlusion have been found to be superior to the other known formulations (Pashley et al, J. Periodont., 55:522 (1984)). Potassium oxalate is thought to react with the smear layer, and is believed to reduce the permeability thereof, as well as increase resistance of the layer to acid attack. It is believed that the crystals produced when employing potassium oxalate are calcium oxalate crystals (Pashley et al, Arch. Oral Biol., 30:731 (1985)).
A two-component kit comprising a 1.0-30% (w/v) neutral oxalate solution, such as dipotassium oxalate, and a 0.5-3.0% (w/v) acidic oxalate solution, such as monopotassium-monohydrogen oxalate, has been described. It is asserted that the neutral oxalate forms large crystals all over the dentinal surface, and the acidic oxalate forms smaller crystals around and about the previously formed larger crystals, so as to form a combined uniform layer of microscopic crystals (U.S. Pat. No. 4,538,990).
The benefits of two potassium oxalate formulations, one comprising 30% (w/v) dipotassium oxalate, and the other 3.0% (w/v) monohydrogen-monopotassium oxalate have been evaluated. The results were varied, purportedly due to variations in the size and number of crystals generated by the two solutions, which in turn may depend on various factors, such as the pH of the solutions. The rate of crystal formation also was believed to be relevant. For example, the 30% (w/v) dipotassium oxalate reacts with ionized calcium in the dentinal fluid, and the acidic 3.0% (w/v) monohydrogen-monopotassium oxalate solution is reported to generate an extremely high local calcium ion concentration by etching the tooth, which results in greatly accelerated formation of abundant crystals to yield the desired reduction in hypersensitivity (Muzzin et al, J. Periodont., 60:151 (1989)). However, there has been no explanation as to the source of ionized calcium within the dentinal fluid; further, no definition has been provided as to what is meant by the phrase "extremely high local calcium ion concentration". In this context, it should be noted that dissolution of dentinal hydroxyapatite by the acidic oxalate solution, which releases Ca.sup.2+ ions, is limited by the amount of solution present on the dentin and by the pH at the dentin/solution interface. As the pH rises due to reaction between the acidic solution and the hydroxyapatite, the rate of hydroxyapatite dissolution will decrease, and there is an accompanying reduction in Ca.sup.2+ ion release. These physicochemical considerations clearly limit the amount of crystal formation on the dentin surface.
A commercial product, PROTECT.TM. (J. O. Butler Co., Chicago, Ill.) that is marketed for occluding dentinal tubules, utilizes an acidic potassium oxalate solution which is applied to the tooth surface. However, PROTECT.TM. has limited effectiveness as it leaves many tubules open (Kaminske et al, J. Dent. Res., 69:68 (1990)).
Accordingly, there has still been a need in the art to develop an effective treatment which will result is occlusion of substantially all of the tubules.

Method and kit for treating tooth hypersensitivity


The present invention is an apparatus and method for detecting an operating condition of an oil pump of the type utilized in an oil supply system for a internal combustion engine. The apparatus includes a sensor for detecting the movement of a piston and/or a check valve of an oil pump. The apparatus preferably includes an engine control for monitoring the sensor over a fixed time interval and determining whether a signal is indicative of a malfunction or abnormality. In accordance with the method, the pump is monitored with the sensor and in the event an abnormality is detected, a warning indicator is activated and/or the engine is shut off.

The supply of lubricating oil to an internal combustion engine is critical. In two-stroke engines, a mixture of oil and fuel is supplied to the combustion chambers of the engine. In some cases, the oil and fuel are premixed in a supply tank and the mixture is supplied to the engine via a delivery system.
In many other instances, oil is drawn from one source and fuel is drawn from another source. The oil is typically drawn from a tank through a delivery line by an oil pump. Similarly, the fuel is drawn from a tank by a fuel pump. The oil and fuel are mixed before delivery to the combustion chambers by routing oil pumped by the oil pump into the fuel system.
In the first case, oil is supplied to the engine as long as fuel is delivered to the engine. In the latter case, it is possible that the oil pump may fail and yet fuel is still delivered to the engine because the independent fuel pump is still operational. This may have detrimental consequences to the engine.
A system and method for detecting the operating condition of the lubricant delivery system, and more particularly, the operating condition of an oil pump of such a system, is desired.

Apparatus and method detecting operating condition of an oil pump


To enhance accuracy in correction of a defective pixel. An image of an object is captured using a digital camera, and stored in an image memory 14. A processor 16 detects a defect, using pixels located in the vertical and horizontal directions relative to, in lines of the same color as, and separated by one line from, the focused line. With any defect found, the presence or absence of line crawl is next determined. When it is determined that line crawl is present, the presence or absence of a diagonal edge is then determined. Subsequently, the surrounding pixels used to correct a defective pixel are selected in consideration of whether or not line crawl or a diagonal edge are present.

Conventional techniques for detecting a defective pixel in a two dimensional image capturing element such as a CCD, and correcting the defective pixel by utilizing the pixels around that pixel, are known.
Japanese Patent Laid-open Publication No. Hei 9-238355 discloses a technique for removing line crawl by outputting a Gb in a Bayer array after being multiplied by a line crawl correction, and outputting Gr intact.
"Line crawl" is a phenomena which may occur under the following conditions. That is, when a color filter comprising R, G, B small color filters in a Bayer array is provided on a light receiving filter, a long wavelength light which has passed through an R small color filter reaches a deeper site under the light receiving surface and generates electric charge therein. The charge then leaks into the adjacent pixels, becoming noise. With such noise, or electric charge invading into pixels having B or G small filters, the sensitivities of the respective pixels become inconsistent, even when an image of a uniformly colored object having no pattern is captured. Line crawl occurs not only in filters employing a Bayer array, but also in those employing any other color arrays.
Defective pixels of an image capturing element, such as a CCD, may inconsistently increase or decrease due to, for example, increased temperature, long time exposure, and so forth. To detect and correct such a defective pixel, pixels surrounding that pixel are utilized.
However, use of the pixels adjacent to the focused pixel cannot guarantee accurate detection and correction due to the influence of line crawl. In order to avoid the influence of line crawl, use of four pixels in the detection and correction, which are located in lines of the same color as, and separated by one line from, the focused pixel is contemplated.
FIG. 14 illustrates a method for detecting and correcting a defect in a focused pixel. Specifically, among pixels in a Bayer array, or, precisely, pixels having color filters in a Bayer array, (hereinafter simply referred to as pixels), four pixels, namely, pixels 102 (G1), 104 (G2), 106 (G3), 108 (G4), which are located in vertical and horizontal directions relative to, and in lines of the same color as, the focused pixel, namely Gorg, are used as defect detection pixels.
For example, when the pixel Gorg is a G pixel in a G (green)/B (blue) line, four pixels, namely, G1, G2, G3, G4, which are located in G/B lines each separated by one line from the G/B line of the focused line, are used as defect detection pixels. Based on these four pixels G1, 62, G3, G4, the pixel value at the position of the pixel Gorg is estimated, and the estimated pixel value is compared to the actual pixel value of the pixel Gorg.
When the difference between the estimated and actual pixel values of the pixel Gorg is significantly large such that it exceeds a predetermined threshold, it is assumed that an inappropriate value which cannot be estimated based on the values of the pixels around the focused pixel be included, and it is concluded that the pixel Gorg is defective.
When the pixel Gorg is determined to be defective, the same four pixels G1, G2, G3, G4, used for the defect detection, are used also for correction of the pixel Gorg as correction pixels 110, 112, 114, 116. That is, the pixel value of the pixel Gorg is replaced by the estimated value based on pixels G1 through G4.
Use of the pixels surrounding but separated by one line from the focused pixel can eliminate the influence of line crawl. However, this manner of correction suffers from deteriorated sharpness of an image as the pixels used for the correction are separated from the focused pixel by one line.
In addition, should the original image have an edge in a diagonal direction, or a diagonal edge, which includes a defective pixel, application of this correction method results in undesirable disappearance of the diagonal edge, which should be inherent to the original image.
FIG. 15 shows an example in which the original image includes an edge 120 in the diagonal direction which includes the pixel Gorg. The defective pixel Gorg is corrected based on the pixels G1 through G4 located in vertical and horizontal directions relative to the defective pixel Gorg. However, as these pixels G1 through G4 contains no pixel information of the edge 120, the corrected pixel Gorg naturally contains no edge information. Therefore, the edge 120, which is present before the correction, partly disappears after the correction, as shown in FIG. 15 (b).
The present invention advantageously provides a device for reliably correcting a defective pixel while eliminating the influence of line crawl and preserving diagonal edges.

Pixel defect correction device for line crawl


Photoreactive polymers are treated by exposure to microwave energy. A film of a photoreactive polymer (12), such as a photoresist, is applied to a substrate (10) and selectively exposed to ultraviolet light. The latent image produced is further cured or polymerized by treating the photoresist with microwave energy. Combinations of microwave and thermal energies are also used. The treated photoresist is then developed, producing a sidewall (17) that is vertical, and is improved by reduction of anomolies such as scum or a foot (16) at the base of the resist.

An initial step in the fabrication of a printed circuit board or other electronic substrates is the generation of a circuitry pattern from artwork or photographic film onto the substrate. In this method, the substrate containing a metal layer is coated with a protective resist material. The exact pattern desired to be printed in the metal layer is obtained by masking the resist with the desired pattern either mechanically or by use of a phototool. The resist is then exposed to a source of light which polymerizes the uncured resist. The masking or phototool is then removed and the uncured resist is dissolved away, thereby developing the desired image.
The protective resist possesses the ability to give definition and detail required in the circuit. Chemical resistance and dimensional stability are necessary requirements of the resist in order to withstand the subsequent processing steps. Dry film resists are frequently preferred over liquid resists because they offer good chemical resistance, thick plating capability, and cost savings due to less labor and fewer processing steps. Dry film resists find greatest application in the fabrication of printed circuit boards, whereas liquid resists find greatest application in fabrication of integrated circuits and similar applications.
Photosensitive resists are thin coatings produced from organic solutions which, when exposed to light of the proper wavelength, are chemically changed, altering their solubility in certain solvents. These solvents are known as developers. Two types of resists are available: negative acting and positive acting. Negative acting resists are initially soluble in the developer but after exposure to light, become polymerized and insoluble in the developer. Positive acting resists work in the opposite fashion, that is, exposure to light makes the polymer mixture more soluble in the developer. The resist material is frequently dyed to make it visible for inspection and retouching. The pattern that remains after development is insoluble and chemically resistant to cleaning, plating and etching solutions used in the production of the substrate.
The purpose of the developing process is to completely remove unwanted resist in areas to be subsequently etched or plated. Unfortunately, it is impossible in many instances to remove traces of resist during the developing step. This can occur with negative resists which tend to form a thin, cross-linked film at the resist-substrate interface. It is frequently observed that after developing, edges of the resist tend to be somewhat ragged and nonuniform as a result of swelling and deformation during developing. This problem can be overcome to some degree by using a mild plasma treatment after developing and prior to post baking. The purpose of the plasma treatment is to remove in a delicate, almost surgical manner, very tiny quantities of resist in unwanted areas. This procedure, known as plasma descumming, is a commonly practiced step in photolithography operations. The obvious side effects of this step are removal of desired resists and removal of other materials such as exposed metal plating. In thin film applications where the exposed metal plating may only be several hundred .ANG.ngstroms thick, plasma descumming can be detrimental and totally remove the metallization.
The formation of scum or a foot at the base of the resist wall is also thought to be caused by improper curing of the photoresist. After the polymeric resist has been exposed and the latent image has been generated, chemical reactions continue to occur. As a consequence, it is often necessary or advantageous to control the environment of the exposed polymer film in order to allow the desired reactions to continue to completion. Several post-exposure treatments have been reported in the literature, such as thermal treatment, flood exposure with other types of radiation, treatment with reactive gas, and vacuum treatment. Most vendors of photoresist do not encourage the use of any of these types of post-imaging treatments but suggest that the resists simply be held at ambient temperatures for fifteen-to-thirty minutes between the time of imaging and developing. None of the present commercially available photoresist systems utilize post-exposure treatment. One of the primary reasons that resist systems employing complex post-exposure reactions have not gained wide acceptance commercially is that, as a rule, these reactions are difficult to control and reproduce in a production environment. Although the reaction times of the active species are long compared to the exposure times, they are short when compared to the overall process cycle. The reactive sites created in a solid polymer also continue to decay via side reactions. If the exact extent of reaction in the latent image is to be precisely reproduced, it is necessary that the precise degree of chemical reaction be controlled across the substrate and from substrate to substrate.
In order to better illustrate problems obtained with poor definition of the photoresist sidewall, the reader is referred to FIG. 1. A substrate 10 is coated with a photoresist 12 and imaged and developed. Sidewall 14 of the photoresist 12 is not vertical but tapers off at an angle towards the substrate 10. This situation is undesirable. Another type of occurrence found using photoresist is a sidewall 15 that tapers in the opposite direction. This too is clearly undesirable. In FIG. 3, another instance of poorly developed photoresist, the sidewall is relatively vertical but a foot 16 at the base of the sidewall extends out from the photoresist 12 onto the substrate. The foot 16 must be subsequently removed by the plasma descumming operation, however, if the foot is large, descumming is not a viable option.
Clearly, an improved method of processing the photoresist is needed in order to provide the desired vertical sidewalls and to eliminate the foot at the base of the photoresist. At the present time, there are no commercially successful methods for dealing with this problem and secondary operations, such as plasma descumming, are required in order to compensate for this lack of precision. A method that would eliminate undesirable sidewall effects would also eliminate extraneous post-developing steps and be highly sought after by those in the art of photolithography.

Microwave treatment of photoresist on a substrate


It is an object of this invention to provide a high-accuracy inference method and an inference system. The input reads fact data into this system. Fact data is stored in a work area, and the inference is started. The inference cycle of the inference is as follows. First, the rule extraction processing module compares rules with data to extract an optimum rule. Then, the case extraction processing module extracts from the case storing a case which matches the extracted rule. Then, the selection processing module compares the condition of the extracted rule with that of the extracted case, and selects one of them which is more similar to the fact data. The execution processing module executes the procedure of the selected rule or case. The inference cycle is repeated unless the executed procedure stops processing.

1. Field of the Invention
This invention relates to a knowledge-base system (expert system) which solves problems in such fields as diagnosing, designing, and planning with the use of expert knowledge. More specifically, this invention relates to an inference system (inference method) suitable for acquiring control knowledge used to control knowledge operation according to the problem status.
2. Description of the Prior Art
One of the important tasks in building a knowledge base system is knowledge acquisition where the knowledge of a target field is defined and coded into a form processable by the inference engine. Traditionally, knowledge engineers collects knowledge primarily through an interview with experts and then codes collected knowledge into a form processable by the inference engine. However, because knowledge acquisition done by human beings requires much effort and time, it sometimes uses too much manpower during knowledge base system development. This is called a knowledge acquisition bottleneck.
Recently, a technology to support this knowledge acquisition has made a progress and, today, some tools to automate or support this knowledge acquisition process are available. And, depending upon the problem type (called a problem task) or target field type (called a target domain), the knowledge acquisition bottleneck has been reduced. However, many of these knowledge acquisition (support) tools, developed in order to acquire knowledge about the entity relation in some specific domain or about basic problem solving, are not practical.
When implementing a knowledge base system, it is important to control knowledge so that correct knowledge is used correctly according to the problem status. More often, the knowledge base system searches the knowledge base, containing a large amount of knowledge, for desired knowledge during the problem solving process. To do so, it requires search control that enables system, via a search method, to find solutions efficiently. Knowledge on this type of control (hereafter called control knowledge) is required regardless of whether the knowledge base system is of classification type or of structure type. However, it is very difficult to acquire this control knowledge because it usually consists of experience-based know-how.
The first reason for it is that, unlike knowledge on a problem task or a target domain which can be defined easily from the problem or target, control knowledge is acquired usually from the problem solving process in daily operation done by experts; it is in the expert's memory and is difficult to define.
The second reason is that not only this type of control knowledge, which controls knowledge operation or search, is related closely with a problem task or target domain but also acquisition and execution of new control knowledge greatly affects the execution of existing control knowledge. This means that, when acquiring new control knowledge, it is necessary to maintain compatibility with existing knowledge to prevent an inconsistency from being generated in the problem solving method.
One of the prior arts is HELLIC II (Reference: Nitta, et al: "HELLIC-II: A Legal Reasoning System on Parallel Inference Machine", Proceedings of the International Conference on Fifth Generation Computer System, ICOT, 1992.). HELLIC-II: is an integrated system using rule-based reasoning (RBR) and case-based reasoning (CBR) like the present invention.
In HELLIC-II, however, RBR and CBR modules interact by exchanging information through the central working memory.
Another existing method in tegrates RBR and CBR (Reference: Yasunobu, et al: "An integrated Method for Rule-Based Reasoning and Case-Based Reasoning", Journal of Japanese Society of AI, Vol. 7, No. 6, pp. 155-162, 1992). Unlike the present invention, this method (1) explicitly indexes cases to specific rules using a unified "If-Search-Then" syntax, and (2) lacks learning/knowledge acquisition modules to facilitate system growth during operation.
Another approach is to tune if-then rules temporarily by relevant cases (Reference: Nakatani, et al: "Tuning Rules by Cases", Topics in Case-Based Reasoning: Proceedings of the First European CBR Workshop, Lecture Notes in AI837, pp. 313-324, 1993). However, this approach is not to select among rules and cases done in the present invention.
So far, a number of knowledge acquisition (support) tools to acquire control knowledge have been proposed, as described above. However, the prior knowledge acquisition (support) tools have the following problems. First, they are less efficient to derive control knowledge potential in expert's memory. Second, they don't fully check the consistency with already-acquired knowledge. Third, acquired control knowledge cannot be matched efficiently.
The following explains this point more specifically using Rule-Based Reasoning (RBR) and Case-Based Reasoning (CBR) as examples:
The configuration and problems of a production system, a typical implementation of RBR, are as follows. FIG. 21 shows the configuration of a production system. It consists of the inference processing module 100, rule base 110, work memory 120, and input/output module 130. The inference processing module 100, in turn, consists of the rule matching module 101, conflict resolving module 102, execution processing module 103, and the inference controlling module 104 which controls these three modules. The input/output module 130 has the terminal 131 and keyboard/mouse 132.
The work memory 120, also called work storage or Working Memory (WM), is an area where input data or intermediate data is temporarily stored. This work memory 120 is usually allocated in main storage to allow modules to access data speedily. Data may be stored in the work memory 120 in any form; in the following discussion, typical production system data--class, attribute, and attribute value--is assumed. Each piece of data is called a WM element. FIG. 22 shows an example of work memory.
The rule base 110 contains "if . . . then" rules which are stored before problem solution starts. FIG. 23 shows an example of rules stored in the rule base 110. FIG. 24 shows the Venn diagram of the rule base 110. For simplicity, this figure shows only the fluid temperature (0 to 10) and fluid pressure (0 to 10). FIG. 25 is a diagram showing the problem classification tree of an example of rule base contents corresponding to those in the Venn Diagram in FIG. 24. In this figure, x corresponds to the fluid temperature, and y corresponds to the fluid pressure.
Next, by referring to the flowchart in FIG. 26, the following explains how the production system works. That is, the following explains how inference is performed using the rule base 110, shown in FIG. 23, and the work memory 120, shown in FIG. 22.
The rule matching module 101 first matches the conditional statements of the rules stored in the rule base 110 with the WM elements stored in the work memory 120, one at a time, and generates a set (called a conflict set) of pairs (called an instantiation which means a specific instance of a rule) of applicable rules and corresponding WM elements. FIG. 27 shows instantiations created in this step (step 140).
The conflict resolving module 102 selects only one of instantiations from the conflict set according to some specific rule (step 142). It selects a rule with the narrowest applicable range. As a result, rule A is selected from the conflict set shown in FIG. 27. The selection of an instantiation means the selection of a rule applicable at that point.
The execution processing module 103 executes the execution statement of the rule of the instantiation selected by the conflict processing module, using the matching data of the instantiation (step 143) Then, the system interacts with the user; that is, it displays information on the terminal 131 or reads data from the keyboard/mouse 132. At the same time, data is added to, changed in, or deleted from the work memory 120. In this example, a new WM element is created and added to the work memory 120. As a result, the contents of the work memory 120 are changed to those shown in FIG. 28.
Upon completion of execution processing, control goes back to the rule matching module 101 and, then, the inference cycle consisting of rule matching (step 141), conflict resolution (step 142), and rule execution (step 143) is repeated. This cycle is repeated until the inference stop instruction in the execution statement of a rule is executed (step 144) or until no matching rule is found in the matching processing (step 141). In this example, because there is no rule that matches added WM elements, the inference cycle is terminated.
The production system performs operation assuming that the conditional statement and execution statement of a rule are described correctly. So, if a rule contains descriptions unintended by the developer, problem solution generates an unintended result. For example, assume that stainless steel is intended as the material of a valve. The production system allows the user to change the rule base by adding a new rule or changing an existing rule. To do so, it is necessary to edit the contents of the rule base 110. There are some problems with this change; for example, the conditional statement of a rule must be reviewed, or consistency with exiting rules must be taken into consideration.
On the other hand, a system using CBR (Case-Based Reasoning) has a database (called a case base) which contains past problem solution cases. Upon receiving a new problem, the system retrieves a problem solution case similar to the received problem, modifies the result according to the problem, and generates a solution. This type of CBR consists typically of characteristic extraction, case retrieval, and case modification. Although excellent in acquiring knowledge, CBR has the problems when building an expert system.
First, it is difficult to build CBR support system. Second, it is too granular to be applied to the top-level problem solution. Third, it is not easy to include CBR into a production system widely used in inference applications.
It is an object of this invention to provide a system which acquires strategic and operational knowledge used to control knowledge usage and to solve the above-mentioned problems involved in prior systems having a similar object.
That is, to solve the problems with the prior arts described above, it is an object of this invention to provide an inference method and an inference system having a superior inference accuracy. It is another object of this invention to provide an inference method and an inference system capable of acquiring and using knowledge efficiently.


A cooking appliance includes a cooktop having a heating zone including an associated heating element, as well as a control element for setting a desired cooking temperature for the heating zone. When the control element is rotated from a home position across a temperature adjustment zone in a first direction, the heating element is operated at a low voltage setting and, when the control element is rotated from the home position in a second direction, the heating element is operated at a second, higher voltage setting. The control element includes a rotary shaft coupled to a voltage selector and an infinite control switch. With this arrangement, a consumer can cook delicate food items at infinitely adjustable low power cooking settings, as well as cook at a substantially infinite number of higher power settings, through the use of a single control element.

1. Field of the Invention
The present invention pertains to the art of cooking appliances and, more particularly, to a control element for a cooking appliance that selectively supplies power to a heating element at first and second voltage levels, said power being infinitely adjustable across a temperature selection zone.
2. Discussion of the Prior Art
Infinite temperature controls for controlling heating elements or zones arranged on cooktops of cooking appliances are known. Typically, a element or knob is rotated from an "off" position to a location across a temperature selection zone to establish a desired operating temperature for a heating element. The operating temperature can range from a low setting, typically positioned in a beginning portion of the rotation of the control knob, to a maximum setting, typically positioned adjacent an end portion of the rotation of the control knob. That is, the control knob provides infinite adjustment over an operational finite range so that the control knob actually rotates over a range of less than 360°.
In other arrangements, a control knob can actually rotate more than 360°. The control knob can either be rotated in a first direction to pass over the full temperature range, starting from a low setting and leading to a maximum setting, or the control knob can be rotated in a second direction to pass over the full temperature range, starting at the maximum setting and leading to the low setting. In many cases, the low setting is achieved by activating a single heating element, while the maximum setting is achieved by activating multiple heating elements.
In any event, an infinite switch typically includes a bimetal element coupled to a cycling contact and an internal heater. The internal heater causes the bimetal contact to deform when energy is applied to the internal heater and an internal resistive load. As the load and internal heater are heated, the bimetal contact deforms and the switch opens. When the switch opens, the bimetal contact cools and deforms back to its original, ambient position. At this point, a spring force causes the switch to close and the cycle can be repeated. In general, the infinite switch is employed in a 240 volt AC application and the internal heater is calibrated accordingly.
The cycling of the bimetal contact in a 240 volt system causes the heating element to exhibit significant instantaneous temperature changes. At medium and high temperature settings, these instantaneous temperature changes do not impact food items being heated to any significant degree. However, at lower temperature settings, the instantaneous temperature changes may cause adverse effects to certain food items. For example, melting chocolate and simmering sauces tend to burn even at the lowest temperature settings. To this end, such an infinite switch simply cannot establish the uniform low temperature required to melt or hold delicate food items.
In order to provide a greater degree of control at low temperatures, some manufacturers have proposed to activate the heating element with a lower supply voltage, such as 120 volts AC. The one-half reduction in voltage causes the heating element to operate at one-quarter the power. Operating at lower power enables the heating element to establish the uniform temperature required for cooking and/or holding delicate food items.
In order to achieve the voltage reduction, some manufacturers install a separate switch for toggling between high and low settings, while others provide a dual voltage infinite switch such as indicated at 2 in FIG. 1. Infinite switch 2 includes knob 4 that is rotated across an adjustment region 6 to establish a particular temperature for an associated heating element (not shown). The temperature adjustment region includes a first or low power portion 8 that operates the heating element at 120 volts AC and second or high power portion 10 that operates the heating element at 240 volts. While each of these arrangements provide good low temperature control, each arrangement possesses certain limitations. For instance, in the first example, either a separate toggle switch must be provided for each control or a single toggle can act as a master to all the controls. In the first case, the addition of multiple switches on the cooktop could detract from the overall aesthetics of the appliance, as well as increase the overall complexity of operation. In the second case, a master switch limits the flexibility of the controls. That is, when using a master switch, the consumer must either operate all of the heating elements in a high or low mode. In the second example, the dual voltage switch arrangement addresses this issue by incorporating the toggle switch into the control. While effective at eliminating clutter and the need for additional dedicated switches, the dual voltage infinite switch has a limited adjustment range. That is, only a small portion 8 of the overall adjustment region 6 is dedicated to the low setting.
Based on the above, there exists a need in the art for a control member for a cooking appliance that includes a voltage selector for activating a heating element with either a low voltage setting or a high voltage setting. More specifically, there exists a need for an integrated voltage selector/temperature control that provides a full adjustment zone for each of the low and high voltage settings.

Dual voltage infinite temperature control for an electric cooking appliance


Nucleotide fragments from caprine arthritis-encephalitis virus (CAEV) env gene, corresponding peptide fragments, and uses thereof in screening for viral caprine arthritis-encephalitis, are disclosed. Antibodies to peptide fragments and uses thereof for diagnosing viral arthritis-encephalitis are also enclosed. Said nucleic acid fragments code for a peptide fragment including at least one CAEV Env protein segment comprising at least one immunodominant epitope selected from the transmembrane region of said protein, and include 15-255 nucleotides.

1. Field of the Invention
The present invention relates to nucleotide fragments derived from the env gene of the caprine arthritis-encephalitis virus (CAEV) and to the corresponding peptide fragments and to their applications in the screening for caprine viral encephalitis and arthritis; the present invention also relates to anti-peptide fragment antibodies as well as to their applications in the diagnosis of viral encephalitis and arthritis.
2. Description of the Related Art
The caprine arthritis-encephalitis virus is a lentivirus which causes a leukoencephalitis in young goats and a chronic clinical arthritis in 20 to 30% of adult goats infected naturally. Arthritis is usually progressive and is particularly severe at the level of the synovial spaces of the carpal joints.
The nucleotide sequence of the CAEV-CO strain has been sequenced and described (M. SALTARELLI et al., Virol., 1990, 179, 347-364), using infectious clones obtained from HindIII fragments, transfected into goat synovial membrane cells. The genome comprises 9189 nucleotides and includes successively the sequence encoding LTR, the sequences encoding the different viral proteins: Gag protein, Pol protein, the regulatory protein Q, the Tat protein, the envelope proteins and the Rev proteins.
The organization of the env gene encoding the CAEV envelope glycoprotein is similar to that of the sheep viruses (VISNA virus) and comprises a sequence encoding a surface (SU) protein and a sequence encoding a transmembrane (TM) protein which form the envelope glycoprotein.
The CAEV envelope proteins are considered to be at the centre of the host-virus relationship; their study is therefore essential for understanding the interaction of the virus with the immune system (neutralizing epitopes, B and T epitopes) and with the target cells in the infection and for developing effective diagnostic reagents.
The seriousness of the disease in the infected animals is directly correlated with the level of anti-viral envelope (Env) protein antibody, and in particular with the level of anti-transmembrane (TM) protein antibody and/or with the level of anti-surface (SU) protein antibody of the said Env envelope protein (T. C. McGUIRE et al. J. Virol., 1992, H, 5, 3247-3250; D. P. KNOWLES et al., 1991, J. Virol., 1991, 65, 11, 5744-5750).
Indeed, the immune response to the viral antigen plays an important role in the inflammation of the joints (in particular, the inflammation of the synovial spaces of the carpal joints), especially because of a massive infiltration of the said joints by lymphocytes, plasmocytes and macrophages and by an accumulation of antibodies directed against the Env protein.
In particular, the serum having a high titer with respect to monomeric (38 kDa) and oligomeric TM glycoproteins are found in goats with progressive arthritis (D. P. KNOWLES et al., J. Virol., 1990, 64, 2396-2398).
Moreover, goats vaccinated with the inactivated caprine arthritis-encephalitis virus develop a more severe arthritis, after infection in the laboratory than the control animals (McGUIRE et al., J. Vet. Res., 1986, 47, 537-540).
It is therefore vital to establish a constant supervision of the herds in order to avoid propagation of the disease, in particular by excluding the diseased animals as rapidly as possible.
At present, CAEV arthritis is essentially diagnosed by means of serological tests based on a whole virus preparation; such tests have the disadvantage of being difficult to prepare and of being expensive; they also require a particularly delicate development (problem of standardization) and can, in addition, cause false-negative reactions and/or false-positive reactions.
Other tests (ELISA tests) also exist which use recombinant Gag proteins; such tests also have the disadvantage of causing false-negative and/or false-positive reactions and create, in addition, problems of background noise.
Now, in overview, it is absolutely vital to have a reliable and inexpensive test so as to be able to test the herds as a whole in order to avoid a massive infection (especially by milk) (programme of eradication).

Nucleic acid fragments and corresponding peptide fragments from the caprine arthritis-encephalitis virus (CAEV) genome, and uses thereof

Centre National de la Recherche Scientifique


An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

Conventionally, as an electronic device manufactured by mounting electronic components such as a connector on a printed circuit board, a device having an insertion-mounting structure is known. In this structure, a terminal of an electronic component is inserted in a through hole of a printed circuit board, and the terminal is solder-bonded to a land provided on a wall surface and a periphery of the opening of the through hole, for example, disclosed in JP-2005-327643A. Further, an electronic device having a surface mounting structure is known. In this structure, a terminal of an electronic component is solder-bonded to a land provided on the surface of a printed circuit board, for example, disclosed in JP-2006-256448A corresponding to U.S. Pat. No. 7,192,313, FIG. 12.
In the case of an electronic device having the insertion-mounting structure, it is necessary to perform flow soldering (including local flow) using molten solder jet flow. In the printed circuit board, on the rear surface of electronic component mounting surface, an area exposed to the molten solder and an area interfering with a nozzle to jet-flow the molten solder are not employed as an electronic component mounting area. That is, as the area in which electronic-component mounting is disabled is large, the electronic component packaging density cannot be improved without difficulty in the whole (both surfaces) of the printed circuit board.
In the case of the electronic device having the surface mounting structure, as flow soldering is not required, the electronic component packaging density can be improved. However, as reflow process is performed while a terminal is placed on a corresponding land, in a status before the solder is cooled and solidified (molten solder status), a positional shift often occurs between the terminal and the corresponding land. For example, upon reflow process, when deformation (warp or the like) occurs in the printed circuit board (housing of the electronic component) due to a difference between linear expansion coefficients of the printed circuit board and the electronic component, there is a probability of positional shift between a terminal and a land or falling of the terminal from the land. Further, in accordance with increase in the number of terminals, it becomes difficult to ensure co-planarity in connection portions between the terminals and the lands. Further, it is further difficult to ensure connection all the terminals and corresponding lands due to the influence of warp of the printed circuit board or the like. That is, this structure has a problem in the point of connection reliability.
On the other hand, JP-11-111407A corresponding to U.S. Pat. No. 6,081,998 (especially in FIGS. 14 to 17) discloses a connector which has a lead pin (branch terminal) having an end (insertion member) which can be inserted in a hole (through hole) in a printed circuit board and a soldering member (surface member) formed in a position away from the end by a predetermined distance. Further, JP-11-317265A discloses a print wiring board mounting structure integrally having a horizontal projection (surface member) bonded to the surface of a lead connecting land (surface land) of a printed wiring board (printed circuit board) and a vertical projection (insertion member) inserted in a through hole of the printed wiring board, at an end of a lead (branch terminal) of an electronic component. In these applications, reflowing on the insertion member is not required. The surface member is solder-bonded to the corresponding surface land while the insertion member is inserted in the through hole.
However, in JP-11-111407A and JP-11-317265A, in the terminal, an end area of a portion extended from the connector housing in approximately vertical state with respect to the printed circuit board is employed as the insertion member, and a portion extending from the portion approximately vertical to the printed circuit board, in approximately parallel to the flat surface of the printed circuit board is employed as the surface member. That is, the surface member forming the branch terminal and the insertion member form an L-shaped structure. In this L-shaped structure, a side fillet is formed only in one position of the end of the surface member. Further, the amount of positional shift with the insertion member as a rotational axis is large. To ensure connection reliability, the packaging density may be lowered.
Further, in JP-11-111407A, as the insertion member is not solder-bonded, to ensure desired connection reliability, it is necessary to increase the surface member to increase a contact area with respect to the solder. Accordingly, in the point of electronic component packaging density on the electronic component mounting side, by extension, in the point of entire (both surfaces) circuit board, the electronic component packaging density cannot be improved without difficulty.
Further, in JP-11-317265A, the inner surface of the through hole is coated with conductive material, and the insertion member is inserted in the through hole such that the end of the insertion member is exposed on the rear surface side of the connector mounting surface of the printed circuit board. In this structure, a large amount of solder on the surface land flows in the through hole by the capillary phenomenon. Accordingly, a fillet (side fillet) cannot be excellently formed on the surface member in accordance with size of the surface land. Further, voids (bubbles) might be formed in the solder flowed in the through hole. To avoid this problem (to ensure connection reliability), it is necessary to increase the surface land (surface member). Also, the electronic component packaging density cannot be improved without difficulty.
Thus, it is required for the electronic device capable of improvement in connection reliability and packaging density.
Further, an electronic device, in which electronic components such as a connector having plural terminals arrayed along the surface of a printed circuit board are reflow-mounted on the printed circuit board having lands with respect to a main body formed of insulating material, is known. As such electronic device, JP-11-317265A and JP-7-153508A (including FIG. 4) disclose an electronic device in which electronic components are reflow-mounted on a printed circuit board having plural lines of lands provided along an array direction of terminals. By using this structure, the main body can be downsized in the array direction of the terminals.
However, according to JP-11-317265A and JP-7-153508A, a terminal connected with a land positioned away from the main body disturbs supply of reflowing heat to a terminal connected with a land positioned closer to the main body (junction with the land) than the above land. For example, in the structure disclosed in JP-7-153508A, the terminal has a structure where a portion on the side connected with the land is extended approximately parallel to the printed circuit board from the main body, and the end of the parallel portion is bent to be vertical to the surface of the printed circuit board, and a portion mounted on the land is provided at the end of the vertical portion. Further, the height of the parallel portion of the terminal connected with the land positioned away from the main body is high from the surface of the printed circuit board, and the length of extension from the main body is long. Accordingly, upon reflowing, the terminal connected with the land positioned away from the main body blocks heat to the terminal connected with the land closer to the main body, and connection reliability may be lowered in the junction (soldering failure may occur). Especially, in the array direction of the terminals, as the interval between adjacent terminals is narrow, the connection reliability may be lowered. Thus, it is required to improve connection reliability.

Electronic device and manufacturing method of the same


Encoding and decoding devices (5, 105) influencing digital signals transmitted with encoded modulation. For the encoding a channel encoder (12) performs a code concatenation to distribute the protection redundancy bits over various symbol periods of the encoded modulation, for example, over two multiplexed 16 QAMs. A source encoder (11) may effect a reduction of the input bit rate. A differential encoder (31) may be used for the encoding so as to ensure the detection of the phase rotation invariance of the code. At the receiver end a decoding device (105) performs the corresponding operations in reverse. The invention may be used for digital signal transmission of: television, microwave, mobile radio signals, for storage on compact disc or on digital video recorder, for communication between computers.

The invention relates to a system for modulating/demodulating digital signals for transmitting these signals using encoded modulation via a transmission channel, the said system comprising an encoding device equipped with a modulator which is situated in a transmitting station and a decoding device equipped with a demodulator which is situated in a receiving station, the encoding device comprising a channel encoder which executes an encoding for protecting the digital signals by addition of binary redundancy distributed over several character-periods of the encoded modulation, the channel encoder comprising at least one internal encoder which executes an internal convolutive encoding with efficiency R.sub.2 and which is combined with the modulation encoded by a binary allocation module.
It relates more particularly to the encoding device and the decoding device of the said system.
Such encoding and decoding devices find their applications in the transmission of digital signals through a transmission channel.
This may involve transmitting for example high-definition digital television signals through a satellite channel or digital signals by radio beams. It may likewise involve transmitting sound by mobile radio, or digital data in order to store them for example in a compact disc or a digital video recorder. In these cases it is necessary on transmission to execute at the source a prior reduction in throughput through a source encoder and to reestablish the throughput on reception through a source decoder. In the cases where it is desired to transmit digital data between two digital processing units, for example between two processors, this throughput reduction through a source encoder does not arise.
Since the most representative application is that relating to high-definition television (HDTV) for which the problems are most widespread, the present patent application is presented for this application without this constituting any limitation whatsoever.
The digitising of High-Definition Television (HDTV) generates a total unprocessed throughput of the order of 800 Mbits/sec. Transmission of this information at such a throughput cannot be economically realised in existing transmission channels. Several encoding techniques have been developed for reducing the throughput (source encoding). The performance of these encoding algorithms is measured in terms of their throughput "reduction factor" and of the quality of the picture restored after decoding. The more the redundancy of the signal is reduced, the more significant is the information transmitted. Possible transmission errors, which may be fairly easily corrected if the information transmitted is redundant, have increasingly serious consequences when the reduction factor increases.
In consequence, the transmitting of digital HDTV signals requires judicious protection. So as not to notice the effects of transmission errors on the screen, the channel error rate must be less than 10.sup.-11.
The channel used for "Direct Broadcast by Satellite" (DBS) is characterised by:
a bandwidth of 27 MHz, PA1 low power (especially for the link coming from the satellite) and the presence of a strong noise signal, regarded as additive, white and Gaussian, PA1 and nonlinear distortions. PA1 a detection module which determines for each block received a point belonging to that subset of the multidimensional constellation which is closest to the said received block, PA1 and a Viterbi decoder which operates on the sequences of the said points.
The routing of the HDTV digital signals via such a channel demands a source encoding at a significant compression rate as well as a digital modulation with high spectral efficiency.
The techniques of source encoding, based for example on an orthogonal transformation, may reduce the throughput by a factor greater than 10 while ensuring good restored picture quality. This leads to transmitting a binary throughput of the order of 80 Mbits/s. However, the transmission of such signals on a satellite channel demands a digital modulation with spectral efficiency reaching 3 bits/s/Hz.
The conventional encoding and modulating techniques prove to be limited as regards fully meeting the demands of correct transmission. However, these techniques are substantially improved by using the encoding technique proposed by G. UNGERBOECK in the article entitled: "Channel coding with multilevel/phase signals" presented in IEEE Transactions on Information Theory vol. IT-28 No. 1, January 1982, pp. 55-67.

System for modulating/demodulating digital signals transmitted with encoded modulation


A dependability measurement system for use in a communications network includes several functional components which work together to measure, analyze and report the dependability parameters and metrics. A performance measurement function measures performance parameters between a first location and a second location in the communications network. A service-affecting event computation function analyzes performance parameters measured by the performance measurement function. An equipment event measurement function monitors network elements of the communications network for occurrence of network element events. A population calculator determines components within the communications network which are related to the dependability metrics to be reported upon and calculates in-service time information for the components. Finally, a dependability metric calculator calculates, analyzes and reports user requested dependability parameters and metrics using information output from the service-affecting event computation function, equipment event measurement function and population calculator.

Currently, dependability Service Level Agreements (SLAs) existing between service providers and service customers and between service providers and solution vendors are ambiguous, vague and difficult to measure. As enterprises become increasingly more dependent on networks for their critical business services, service dependability is becoming an important attribute for service providers to guarantee to service customers. Service dependability refers to aspects of reliability, availability, maintainability, and survivability of services, networks, and network elements. The ability of a service provider to set clear and meaningful dependability SLAs can be a significant market differentiator. However, meaningful SLAs must be able to be measured in a way that reflects the experience of the service end-user or end-devices.
It is important to be able to properly reflect what the end-user experiences. However, whether an end-user experiences a network event is not always important in determining how the network event is classified. For example, mission-critical service users do not have to experience an outage for it to be identified as a service outage. This is especially true for safety-based services as the service customer is paying for around-the-clock service for the comfort of knowing that the service is ready for use when it is needed. In contrast, for a non-critical service such as Web-browsing, an outage may be considered a service outage only when directly experienced by the customer.
Performance measurement features, which measure packet delay, jitter and integrity, are common in conventional networks today. It is critical that any performance measurement monitoring of a service experience of the customer does not adversely impact network performance. The measurement of packet parameters must be done at a sufficient granularity to detect network failure events that matter to the service type of the customer and provide a proper determination of an event from an end-user or end-device perspective.
From a perspective of the end-user or end-device, performance thresholds are different depending on the usage profile stage (e.g. service access vs. service use) and timeliness requirements for the service application type. For example, an event that causes a 30 second packet delay would be considered a service outage for telephony but not for email. A service failure for PSTN telephony is when a subscriber experiences dial tone delay greater than 5 seconds or ring back delay greater than 9 seconds when trying to access the service and greater than 5 second delay (or the subscriber being disconnected and having to re-dial) when in a talk state. At these thresholds the subscriber would conclude that a service denial or premature disconnect had occurred. However, if the impairment lasted long enough such that after three attempts (when the typical subscriber abandons the call attempt), the subscriber would consider that the service is unavailable. This threshold is considered to be 30 seconds.
Today's communications network measurement of failure event data has focused on improving the effectiveness and efficiency of operations personnel. Network elements generate warning alarms and data regarding failure events that enable operational personnel to diagnose and field-repair the equipment. Network products exist today that are capable of assigning timing information to these alarms and data to facilitate the automated reporting of reliability-related metrics. However, this is not sufficient to provide meaningful SLAs since the information does not reflect the impact from the service customers' perspective.
The next generation network is a multi-service network that provides a wide range of service applications each with their own threshold criteria for service failure and service outage. The application types are real-time interactive such as voice, video conferencing, e-gaming, and financial transactions, real-time non-interactive such as video and television and non-real-time such as email and downloading files.
Currently operational personnel need to capture, analyze and compute data in order to track service dependability performance so that it can be compared to objectives. This requires a significant amount of manual effort and usually only considers network element failure modes, though a considerable contributor to end-to-end service dependability issue may be network failures, such as cable cuts. Therefore it would be advantageous to have an autonomous system that can measure, analyze and report network failure events in terms of dependability parameters and statistical dependability metrics.

Dependability measurement schema for communication networks


A device with a display and a touch-sensitive keyboard with one or more character keys: displays a text entry area; detects a first input on the touch-sensitive keyboard; in accordance with a determination that the first input corresponds to activation of a character key, enters a first character corresponding to the character key into the text entry area; in accordance with a determination that the first input corresponds to a character drawn on the touch-sensitive keyboard: determines one or more candidate characters for the drawn character, and displays a candidate character selection interface that includes at least one of the candidate characters; while displaying the candidate character selection interface, detects a second input that selects a respective candidate character within the candidate character selection interface; and in response to detecting the second input, enters the selected respective candidate character into the text entry area.

Electronic devices typically need to enter many different types of characters. For example, devices may need to input Asian syllabic or logographic characters. A user may need to perform such character entry in a file management program (e.g., Finder from Apple Inc. of Cupertino, Calif.), an image management application (e.g., Aperture or iPhoto from Apple Inc. of Cupertino, Calif.), a digital content (e.g., videos and music) management application (e.g., iTunes from Apple Inc. of Cupertino, Calif.), a drawing application, a presentation application (e.g., Keynote from Apple Inc. of Cupertino, Calif.), a word processing application (e.g., Pages from Apple Inc. of Cupertino, Calif.), or a spreadsheet application (e.g., Numbers from Apple Inc. of Cupertino, Calif.).
But existing methods for entering syllabic or logographic characters are cumbersome and inefficient. For example, when the user uses a touch pad separate from the keyboard to draw a character, the user must move his hand back and forth between the keyboard and the touch pad. This going back and forth is tedious and creates a significant cognitive burden for the user. In addition, existing methods take longer than necessary, thereby wasting energy. This latter consideration is particularly important in battery operated devices.

Device, method, and graphical user interface for entering characters


A microwave is introduced into a process chamber through a waveguide (26) of the plasma process apparatus, thereby generating plasma. A reflection monitor (40) and an electric power monitor (42) monitor the electric power of a reflected wave reflected by the plasma that is generated in the process chamber. Moreover, an incidence monitor (36) and a frequency monitor (48) monitor the frequency of the microwave generated by a magnetron (24). An electric power supplied to the magnetron (24) is controlled based on the monitored electric power of the reflected wave and the monitored frequency. This method thus controls plasma density to a constant level.

In recent years, microwave plasma process apparatus has been attracting attention in the field of plasma process apparatus. The microwave plasma process apparatus has a plasma potential that is lower than that of other plasma process apparatuses such as parallel-plate-type plasma process apparatus or an ECR plasma process apparatus. Because of this, the microwave plasma process apparatus can generate plasma having relatively low electronic temperature and relatively low ion irradiation energy.
It follows that the microwave plasma process apparatus can prevent a substrate subjected to the plasma process from sustaining metal contamination or sustaining damage caused by ion irradiation, Moreover, since a plasma excitation space can be separated from a process space, a plasma process independent of a substrate material and patterns formed on the substrate can be accomplished.
The microwave plasma process apparatus has a slot antenna (electrode) for introducing microwave generated by a magnetron into a process chamber where the microwave may be 2.45 GHz, for example. The microwave generated by the magnetron is supplied to the slot antenna (electrode) through a waveguide and a coaxial pipe, and is introduced from the slot antenna into the process chamber.
Part of the microwave, when entering the slot antenna from the coaxial pipe, is reflected at a junction point, thereby returning to the waveguide. Moreover, when plasma is created directly under the slot antenna, the microwave will be reflected by the plasma to return to the waveguide through the coaxial pipe. In consideration of this, a matching device (tuner) is provided halfway through the waveguide so as to send back the returning microwave to the slot antenna. Between the magnetron and the matching device is provided an incidence monitor for detecting the incidence microwave. Control is engaged in such as to maintain a constant level of the incident wave detected by the incident monitor. This achieves such control that the microwave of a constant level is introduced into plasma-excited gas. Since the matching device is configured to send back the returning wave by calculating the load impedance in the process chamber, high precision may not be achieved to send back all the returning wave. In consideration of this, a filter is provided upstream relative to the incidence monitor to absorb the returning wave, thereby preventing the returning wave to reach the magnetron.
Such an incident and returning wave monitor is situated between the magnetron and the matching device, i.e., situated upstream relative to the matching device when the magnetron is regarded as an originating source. The incident monitor is thus able to monitor the reflected wave that is not sent back by the matching device. However, the electric power of the microwave reflected by plasma cannot be monitored.
The amount of a microwave reflected by plasma varies with the density of the generated plasma, so that the electric power of the reflected wave serves as an index indicative of plasma density. Since the conventional microwave plasma process apparatus cannot monitor the plasma-reflected microwave, however, it is not possible to control the introduction of a microwave based on the density of generated plasma.
Moreover, the frequency of a microwave generated by the magnetron has about a ±2% variation, and the density of generated plasma varies as the frequency of a microwave changes. That is, variation in microwave frequency is a factor that changes the density of plasma. The conventional microwave plasma process apparatus, however, does not monitor the frequency of a microwave that is actually supplied to the slot antenna. No measure is taken to prevent a change in plasma density caused by fluctuation of microwave frequency. Therefore, a change in the reflected wave caused by the variation of plasma density partly includes a change caused by the fluctuation of microwave frequency.

Device and control method for micro wave plasma processing


Method and apparatus for reproducing information by enlarging a magnetic domain on a medium by moving a magnetic wall. The apparatus includes a heating device for partially heating the medium in order to cause movement of the magnetic wall, and a magnetic head for detecting a leakage magnetic field generated in association with movement of the magnetic wall, wherein the information is reproduced on the basis of a detection result of the magnetic head. The medium is made up of a layer in which the magnetic wall moves, an intermediate layer, and a layer in which information is accumulated. The magnetic head is arranged on the layer side where the magnetic wall moves. The heating device is arranged on the side of the layer in which information is accumulated.

1. Field of the Invention
The invention relates to a reproducing method and apparatus for reproducing high density information utilizing movement of a magnetic wall.
2. Related Background Art
In JP-A-6-290496, the inventors have proposed a magneto-optical recording medium in which a signal at a period that is equal to or lower than a diffraction limit of a light can be reproduced at a high speed by moving a magnetic wall without reducing an amplitude of a reproduction signal by devising a construction of the recording medium and a reading method, and also have proposed a reproducing method and a reproducing apparatus of such a magneto-optical recording medium.

Information reproducing method and apparatus for reproducing information by moving magnetic wall


System and method for evaluating coating thickness variations along a turbine blade contour. In one embodiment, applied to a first region extending 360 degrees about the blade and to a second region including an exposed reference surface, the first region includes a first surface over which the coating is formed and a second surface formed by the coating. The system provides a source of structured light positionable to cast patterns suitable for determination of coordinate position information along the surfaces. One or more imaging cameras are positionable to acquire image data based on the light patterns. A computer system processes image information to (1) characterize the first and second surfaces with respect to a coordinate along the reference surface; (2) compare coordinate data corresponding to the first surface with coordinate data corresponding to the second surface; and (3) determine thickness of the coating as a function of position.

Many types of machinery, particularly but not only rotating machinery, include components which incur high levels of thermal stress and wear that limit the useful life of the component. This necessitates periodic shut down of equipment for inspection, maintenance and repair, often requiring that components be refurbished or replaced. Turbine blades are exemplary. In many instances the blades are multi-layer structures comprising a casting (a base metal alloy) over which various coatings are formed to extend the useful life by modifying the surface properties of the blade. In some instances, as in blade designs for the forward-most stages of steam and gas turbines, because the blades run at higher temperatures than blades positioned in later stages, it is desirable to coat the blades with a high temperature top coating. This top-most coating, often a metal ceramic material, is affixed to the base metal through an intermediate bond coat. Generally such coatings are applied with techniques such as High Velocity Oxi-Fuel (HVOF) spray coating processes or low pressure plasma sprays. The blades positioned in lower temperature stages may also include a coating for enhancing durability. The coating thickness influences life expectancy of the component. Quality and thickness of an intermediate bond coat can affect the integrity of an overlying thermal barrier.
During the manufacture of turbine blades it is very important to assure uniformity and consistency of coating thicknesses throughout the workpiece and among blades having the same design specification. Otherwise a blade may be subject to premature wear-out and spallation. Coating deposition processes must therefore be designed and characterized to assure that tolerance limits are met throughout each coating and that repeatability exists for the provision of uniformity within acceptable limits of variation from blade to blade. It is therefore also important to monitor processes in order to identify and limit process drift. The foregoing has required costly and time intensive monitoring which has only been effected on a limited basis with mechanical and acoustical techniques. Some techniques require destructive testing such as by forming cut-outs through component layers to measure coating thickness in cross section. Ultrasonic probe techniques have also been applied to measure thicknesses and determine variations but these have been based on a limited number of sample measurements along a coating surface. These measurements have been time intensive. Further, acoustical characterizations may at times be subject to relatively large, undesirable measurement errors when the coating is relatively this, e.g., less than 500 microns thick. Moreover, there remains question as to what kind of variation exists between probed points from which data samples are acquired.
Generally it is desirable to develop techniques which enable an increased level of data sampling to characterize variations in coating thicknesses, to characterize coating processes generally, and to monitor the processes so that trends are identified before deviations extend beyond process windows.