A paging system (100) includes a transmitter (104) for transmitting first information including a transmitted page, a receiver (108) for receiving second information, and a diagnostic controller (106) coupled to the transmitter (104) and the receiver (108) for monitoring the first and second information to determine whether the transmitted page was correctly received by the receiver (108).

A major concern for modern paging systems is the ever increasing customer demand for continuous, efficient, and reliable paging service. Customers typically expect their pages to be forwarded efficiently (minimal amount of delay) and reliably (no missed pages) over a paging coverage area that may sometimes span a wide geographic area.
To meet the aforementioned customer demands, and also due to the increasing structural and logistic complexities of modern paging systems, the amount of time and effort spent in performing system maintenance and diagnosing reported problems has increased significantly. For conventional paging systems, unfortunately, service personnel routinely perform many maintenance items, including diagnosing reported problems such as missed pages, by taking the entire paging system (or major portions thereof) off-line for a time interval. Since this discontinues normal paging service to the paging system's customers, incoming revenues are reduced and customers are temporarily inconvenienced.
Diagnosing paging system problems, i.e., performing paging system diagnostics, normally involves determining why pages are not being received or correctly received by one or more selective call receivers in a predetermined paging coverage area or areas. Further, these paging system diagnostics can involve monitoring specified paging system parameters and determining if tolerances of the paging system parameters are within specified limits, or if specific maintenance actions are needed. Particularly important are those paging system parameters that affect the characteristics of paging transmissions for correct reception of pages. Typically, this diagnostic process comprises a repetitive sequence: measure specified parameter(s), make any necessary adjustment or repair, and measure the parameter(s) again to verify correct operation. In known paging systems, this paging system diagnostic process is normally performed by service technicians with the paging system (or a major portion thereof) being off-line to perform the test or measurement.
For example, one particularly laborious and time consuming procedure involves testing the integrity of the paging system (e.g., was a page accepted by the paging terminal actually transmitted by the paging system and correctly received by a pager?). In one scenario, service personnel test system integrity by sending repeated test pages via the paging system to a reserved test pager, which is typically carried on the person of a service technician. The service technician then travels to many different test locations in the paging coverage area to determine the reliability of reception of the test pages. This procedure can be very time consuming. Making matters worse, this test procedure usually involves taking the conventional paging system (or a major portion thereof) off-line, because under normal on-line operation the varying incoming paging traffic loads combined with variable latencies within the paging system's internal queues can significantly reduce the efficiency of the aforementioned integrity testing procedure. Hence, this time consuming test procedure being performed with the paging system off-line can seriously inconvenience customers during testing. Furthermore, since paging system integrity testing is many times a reactive service procedure (e.g., performed in response to a customer reporting that a page was missed, and sometimes after many customers have complained of missing pages), the time spent diagnosing the problem with the paging system off-line further aggravates customers that are already aggravated by previously missed pages.
In addition, unfortunately, there may not always be a clear and direct correspondence between the successful reception of the test pages by the reserved test pager and the successful reception of the normal on-line pages by customers. Testing the paging system under relatively simplistic off-line conditions rarely replicates the actual paging system conditions during on-line operation. Therefore, testing the integrity of the paging system as described above can significantly inconvenience customers and may not always be effective in diagnosing and quickly solving the missing pages problem.
For efficient and reliable operation, many paging system parameters must also be monitored periodically to maintain the paging system operating within specified limits. These critical paging system parameters, some of which tend to vary over time, can affect the reliable transmission and reception of pages. For example, in a conventional simulcast paging system the synchronization of a plurality of paging transmitters is critical for effective communication to occur. It is necessary that the simulcast page being transmitted from the plurality of paging transmitters arrive at the paging receiver essentially at the same time from all sources. Hence, the relative delays of the different transmission paths taken by the simulcast page must be synchronized, and the synchronization maintained over time, to assure reliable reception of simulcast pages. This test procedure normally involves verifying and adjusting the relative delays of the transmission paths from the paging terminal to the plurality of transmitter basestations. Other exemplary paging system parameters that may be critical for proper system performance include the distortion of the transmitted signal from each transmitter basestation, the effective transmitted power of each paging transmitter, the frequency of the transmitted carrier signal from each paging transmitter, and any other interference or noise signals that may be present with the transmissions.
Many of these types of parametric measurements are performed by service technicians often using esoteric techniques that are applied in less than standard fashion from technician to technician, and usually with little if any assistance from the paging system equipment. This can significantly increase the time necessary for parametric system testing and can also reduce the reliability of diagnostic inference from any results. Further, these measurements are typically performed with the paging system (or a major portion thereof) being off-line, and sometimes in response to customer complaints of missed pages, which additionally frustrates customers.
Therefore, this diagnostic process determines whether a number of paging system parameters are within specified limits, and optionally adjusts the paging system parameters as necessary for maintaining proper operation. Regrettably, in conventional paging systems, the PG,5 implementation of this diagnostic process can significantly inconvenience customers and may offer marginal reliability in diagnosing the paging system problem.
Due to the extreme competition in today's marketplace, the consequences of not adapting the modern paging system to meet the ever increasing demand for continuous, efficient, and reliable paging service to customers may include loss of potential revenue due to extended periods of system down-time, loss of customer satisfaction, and ultimately loss of competitiveness leading to business failure. Moreover, in a governmental or medical paging system the loss of communication may prove grave and devastating for a community.
Thus what is needed is a more efficient and reliable paging system capable of self-diagnostic monitoring.


Mechanisms are disclosed herein for storing various records. Numerous keys and parties can access online repositories. These repositories contain a plurality of lockboxes, structured hierarchically and otherwise, providing public and private areas with varying levels of access. Some content of such lockboxes can be sharable. These lockboxes can be used not only to store diverse content, ranging from birth certificates to deeds and social security numbers, but they can also be accessed in a variety of ways. For example, keys to lockboxes can be made available by such events as the issuing of death certificates or birth certificates. Alternatively, keys can be issued according to various rules and heuristics stipulated by lockbox users. In either case, the plurality of lockboxes residing in repositories can be configured to provide centralized storage facilities that are secure and readily accessible from various computing devices.

Storage of important and/or personal records is often times desirable and needed. Safety deposit boxes, file cabinets, and so forth, have been used in the past to address this need. However, these storage mechanisms, especially in a digital context, fall short of providing centralized, personal, and secure document storage facilities, which result in something more than simple share-drive spaces. Thus, it would be advantageous to provide systems, methods, and other mechanisms for storing various records.

This patent is subject to a terminal disclaimer.

Systems and methods for secure online repositories

United Services Automobile Association (USAA)


This invention relates to liquid rinse-off compositions for personal care comprising trimethylsilylalkylsilsesquioxanes, particularly trimethylsilyl-n-octylsilsesquioxanes (Caprylyl Trimethicones). Preferably the rinse-off compositions are shampoos containing pearlescent and/or opacifying agents.

This invention relates to liquid rinse-off compositions for personal care comprising high purity trimethylsilyl-alkylsilsesquioxanes, particularly trimethylsilyl-n-octylsilsesquioxanes (caprylyl trimethicones). Said rinse-off compositions provide excellent rinse feel and skin mildness. They are suitable for simultanously cleansing and conditioning of the skin and/or the hair and can be used in the form of foam bath preparations, shower products, skin cleansers, hand cleansers, face cleansers and body cleansers, shampoos etc.
In recent years there has been a fast development in the field of skin and hair care. Improved products, according to the actual trends, were offered to the customers. The development is focused on rinse-off formulations which guarantee effective cleansing together with other supplemental benefits such as improved sensory, conditioning, gloss and sheen properties. The patent literature describes several ways to achieve the above-mentioned goals. Among others, silicones are found in many personal care products including topical skincare products, 2-in-1 hair shampoo-conditioners, color cosmetics (mascara, lipstick), anti-perspirants and deodorants. Dimethylsilicones, both linear and cyclic, are proposed to improve the sensory properties. Unfortunately said dimethylsilicones are generally not compatible with water. Also they show little compatibility with many organic materials used in cosmetic formulations. Phenyl trimethicones are another class of silicones often used in cosmetic industry.
In recent years considerable research concerning the ultimate fate of organosilicones (atmosphere, lakes and rivers rivers) has been carried out. For example phenyl substituents are oxidized and/or homolytically cleaved off to form benzene and/or phenol. Both are pollutants of the environment.
We have now found that trimethylsilylalkylsilsesquioxanes are particularly suitable for use in formulating liquid rinse-off compositions for personal care.
Surprisingly it has been found that said trimethylsilyl-alkylsilsesquioxanes are particularly useful for formulating shampoos additionally containing insoluble components, preferably peariescing and/or opacifying agents. Trimethylsilyl-octylsilsesquioxanes (caprylyl trimethicones) can be stabilized over a long period of time and over broad temperature ranges in the presence of pearlizing or opacifying agents. Said trimethylsilyl-alkylsilsesquioxanes considerably increase the gloss and sheen of the hair and also considerably increase the emolliency and water repellency of the skin. During the application they provide enhanced spreadability, lubricity and reduced tackiness. Advantageously said trimethylsilyl-alkylsilsesquioxanes are environmentally friendly and show excellent compatibility with many organic materials used in cosmetic formulations.
Therefore, the present invention provides liquid rinse-off compositions for personal care comprising
at least 0.1% by weight of at least one trimethyl-silylalkylsilsesquioxane of formula (1)
Me3SiOxe2x80x94[Si(R)(OSiMe3)O]xxe2x80x94SiMe3xe2x80x83xe2x80x83(1)
wherein Me is methyl, R is a straight or branched alkyl group having from 6 to 18 carbon atoms and x is a number from 1 to 10,
at least 2% by weight of water-soluble surfactants and,
at least 50% by weight of water.
R in formula (1) has preferably from 6 to 14 carbon atoms. Particularly preferred as trimethyl-silylalkylsilsesquioxanes of formula (1) are trimethylsilyl-n-octylsilsequioxanes (caprylyl trimethicones) wherein R is an n-octyl group xe2x80x94C8H17. Preferably the trimethyl-silylalkylsilsesquioxanes are compounds according to formula (1) wherein x is a number from 1 to 6. More preferred x is equal to 1, 2, 3 and/or 4.
Surprisingly it has been found that trimethylsilylalkyl-silsesquioxane of formula (1), which are substantially free of alkoxysilanes, chlorosilanes, silanol functionalities and organic and/or inorganic compounds, are particularly useful for the present invention. More preferred the trimethylsilylalkyl-silsesquioxanes of formula (1) contain less than 3% by weight, more preferred less than 1% by weight, of alkoxysilanes, chlorosilanes, silanol functionalities and organic and/or inorganic compounds. Such high purity trimethylsilylalkyl-silsesquioxanes of formula (1) can be prepared according to the process described in U.S. Pat. No. 5,932,231 by hydrolyzing a mixture of pure trimethylchlorosilane and pure alkyltrichlorosilane having from 6 to 18, preferably 6 to 14, carbon atoms with distilled water in an amount sufficient to produce an aqueous layer of less than about 25 weight percent hydrochloric acid, maintaining the temperature of the hydrolysis reaction mixture below about 90xc2x0 C., to form a silicone intermediate; washing residual acid from the silicone reaction intermediate; and azeotropicallay removing water from the washed silicone intermediate to produce a dried silicone reaction intermediate; and trimethylsilylating the silanol groups in the dried silicone reaction intermediate with at least a stoichiometric amount of hexamethyldisiloxane in the presence of an acid catalyst.
All the embodiments of the process described in U.S. Pat. No. 5,932,231 are hereby incorporated by reference into the description of the present application.
Preferably the rinse-off compositions comprise from 0.1 to 5% by weight, more referred from 0.2 to 2.5% by weight, particularly preferred from 0.5 to 1.5% by weight, of trimethyl-silylalkylsilsesquioxanes of formula (1). It is an essential feature of the invention that the the rinse-off compositions comprise at least 2% by weight of water-soluble surfactants.
Preferably the rinse-off compositions comprise from 2 to 40% by weight, more preferred from 3 to 20% by weight, particularly preferred from 5 to 15% by weight, of water-soluble surfactants.
Said water-soluble surfactants can be selected from anionic, cationic, amphoteric, zwitterionic and/or nonionic surfactants. Preferably the rinse-off compositions contain mixtures of surfactants. Anionic surfactants are preferably present at levels from 0.1 to 20% by weight, more preferred from 0.1 to 15% by weight, particularly preferred from 1 to 10% by weight.
Cationic surfactants are preferably present at levels from 0.1 to 20% by weight, more preferred from 0.1 to 15% by weight, particularly preferred from 1 to 10% by weight.
Amphoteric surfactants are preferably present at levels from 0,1 to 20% by weight, more preferred from 1 to 8% by weight.
Zwitterionic surfactants are preferably present at levels from 0,1 to 20% by weight, more preferred from 0,1 to 10% by weight, particularly preferred from 1 to 8% by weight.
Nonionic surfactants are preferably present at levels from 0,1 to 20% by weight, more preferred from 1 to 8% by weight.
In a preferred embodiment the rinse-off compositions contain a mixture of anionic and zwitterionic and/or amphoteric surfactants.
The weight ratio of anionic surfactants to zwitterionic and/or amphoteric surfactants is preferably from 1:10 to 10:1, more prefered from 1:5 to 5:1, particularly preferred from 1:3 to 3:1.
In another preferred embodiment the rinse-off compositions contain anionic, zwitterionic and/or amphoteric surfactants together with at least one nonionic surfactant.
Preferred anionic surfactants are alkyl sulfates; ethoxylated alkyl sulfates, such as laureth-2-sulfate; sodium laureth-3 sulfate; ammonium laureth-3 sulfate, magnesium laureth-3,6 sulfate; salts of sulfuric acid esters; alkyl ethoxy carboxylates; alkyl glyceryl ether sulfonates; ethoxy ether sulfonates; methyl acyl taurates; fatty acyl glycinates; N-acyl glutamates; acyl isethionates; alkyl sulfosuccinates; alkyl ethoxysulphosuccinates; alpha-sulfonated fatty acids and salts and/or esters thereof; alkyl phosphate esters; ethoxylated alkyl phosphate esters; acyl sarcosinates; fatty acid/protein condensates; soaps (e.g. ammonium-, magnesium-, potassium-, sodium salts of lauric acid, myristic acid, palmitic acid); acyl aspartates; alkoxy cocamides; carboxylates; (ethoxylated)alkanolamide sulphosuccinates; ethoxylated alkyl citrate; sulphosuccinate; acyl ethylene diamine triacetates; alkylhydroxyethyl isethionates; acyl amide alkoxy sulfates; linear alkyl benzene sulfonates; paraffin sulfonates; alpha-olefin sulfonates; alkyl alkoxy sulfates; and mixtures thereof. Preferably the alkyl and acyl chain of such surfactants has from 6 to 22, more preferred from 12 to 18, particularly preferred from 12 to 14, carbon atoms.
Preferred amphoteric surfactants are R1CON(R3)CH2CH2N(R2)CH2CO2M, wherein R1 is (C5-C22)-alkyl or -alkenyl, R2 is CH2CH2OH or CH2CO2M and M is H, an alkali metal, an alkaline earth metal, an ammonium- or alkanolammonium ion and R3 is CH2CH2OH or H; aminoalkanoates; iminodialkanoates; and/or iminopolyalkanoates.
More preferred are cocoamphocarboxypropionate, cocoamphocarboxy propionic acid, cocoamphoacetate, cocoamphodiacetate(cocoamphocarboxyglycinate), sodium lauroamphoacetate (lauroamphocarboxyglycinate), N-alkyl polytrimethylene, and carboxymethylamines.
Preferred zwitterionic surfactants are alkyl betaines of the formula R5R6R7N+(CH2)nCO2M, and amido betaines of the formula R5CON(CH2)mNR6R7(CH2)nCO2M, wherein R5 is (C5-C22)-alkyl or -alkenyl, R6 and R7 are independently (C1-C3)-alkyl, M is H, an alkali metal, a alkaline earth metal, an ammonium- or an alkanolammonium ion and n and m are each numbers from 1 to 4. Preferred as betaine surfactant is cocoamidopropyl-dimethyl-carboxymethyl-betaine.
Preferred nonionic surfactants are sucrose polyester surfactants, (C10-C18)-alkyl polyglycosides and polyhydroxy fatty acid amides.
The rinse-of compositions may also comprise so-called additional surfactants. Preferred additional surfactants are alkylamido sultaines and amine oxides.
The rinse-off compositions comprise at least 50% by weight of water. Preferably they contain from 50 to 90% by weight, more preferred from 60 to 90% by weight of water.
Preferably the rinse-off compositions additionally comprise one or more polymeric cationic conditioning agents which are useful to provide desirable skin feel attributes.
Said conditioning agents are preferably present at levels from 0.01 to 5% by weight, more preferred from 0.01 to 3% by weight, particularly preferred from 0.01 to 2% by weight.
Suitable conditioning agents are guar gums, cationic polysaccharides, cationic homopolymers and copolymers derived from acrylic and/or methacrylic acid, cationic cellulose resins, quaternized ethyl cellulose ethers, cationic copolymers of dimethyldiallylammonium chloride and acrylamide and/or acrylic acid, cationic homopolymers of dimethyldiallylammonium chloride, copolymers of dimethyl aminoethylmethacrylate and acrylamide, acrylic acid/dimethyidiallylammonium chloride/acrylamide copolymers, quaternized vinyl pyrrolidone acrylate or methacrylate copolymers of amino alcohols, quaternized copolymers of vinyl pyrrolidone and dimethylaminoethylmethacrylamide, vinyl pyrrolidone/vinyl imidazolium methochloride copolymers and polyalkylene and ethoxypolyalkylene imines, terpolymers of acrylic acid, methacrylamidipropyl trimethyl ammonium chloride and methyl acrylate and mixtures thereof.
The rinse-off compositions may also comprise from 0.1% to 20% by weight, preferably from 1% to about 15% by weight, more preferred from 2% to 10% by weight, of oil derived nonionic surfactants or mixtures thereof.
Said oil derived nonionic surfactants are beneficial for the skin feel properties both during and after use. Suitable oil derived nonionic surfactants include water soluble vegetable and animal-derived emollients such as triglycerides with an inserted polyethylenglycol chain, ethoxylated mono- and di-glycerides, polyethoxylated lanolins and ethoxylated butter derivatives. Suitable ethoxylated oils and fats include polyethylenglycols, derivatives of glyceryl cocoate, glyceryl caproate, glyceryl caprylate, glyceryl tallowate, glyceryl plamate, glyceryl stearate, glyceryl laurate, glyceryl oleate, glyceryl ricinoleate and glyceryl fatty esters derived from triglycerides, such as palm oil, almond oil and corn oil, preferably glyceryl tallowate and glyceryl cocoate. Other suitable oil-derived nonionic surfactants include ethoxylated derivatives of almond oil, peanut oil, rice bran oil, wheat germ oil, linseed oil, jojobaoil, oil of apricot pits, walnuts, palm nuts, pstachio nuts, sesame seeds, rapeseed, cade oil, corn oil, peach pit oil, poppyseed oil, pine oil, castor oil, soybean oil, avocado oil, safflower oil, coconut oil, hazelnut oil, olive oil, grapseed oil, and sunflower seed oil.
The rinse-off compositions may additionally comprise lipophilic emulsifiers as skin care actives. Suitable lipohilic skin care actives include anionic food grade emulsifiers which comprise mixtures of diacids and monoglycerides (e.g. succinylated monoglycerides, monostearyl citrate, glyceryl monostearate diacetyl tartrate and mixtures thereof).
The rinse-off compositions may additionally comprise water-insoluble poly-alpha-olefin oils (e.g. polymers of butene, isoprene, terpene, styrene or isobutene).
The rinse-off compositions may additionally comprise hydrophobically modified silicones according to formula (2)
(R1)3SiOxe2x80x94[Si(R2)(R3)O]xxe2x80x94[Si(R2)(R2)O]yxe2x80x94OSi(R1)3xe2x80x83xe2x80x83(2)
wherein R1 is a (C1-C20)-alkyl or phenyl group, R2 is a (C1-C4)-alkyl or phenyl group, R3 is a (C2-C25)-alkyl or phenyl group, x is a number from 20 to 400, y is a number from 0 to 10 and x+y is a number from 30 to 400.
It should be noted that x and y are average polymerisation degrees and therefore the compositions generally contain silicones of different individual x and y values.
Other water-insoluble skin/hair care ingredients suitable for foaming compositions are liquid polyol carboxylic acid esters. Preferred liquid polyol polyesters comprise polyols (e.g. erythritol, xylitol, sorbitol, glucose, sucrose, particularly sugars or sugar alcohols, monosaccharides, e.g. xylose, arabinose, disaccharides) esterfied with at least four fatty acid groups.
The rinse-off compositions may additionally comprise auxiliary nonionic or anionic polymeric thickeners, particularly water-soluble polymeric materials having a molecular weight greater than about 20,000 g/mol. Preferred water-soluble polymeric materials form a substantially clear aqueous solution at concentrations of 1% by weight at 25xc2x0 C. Examples of preferred water-soluble polymers are hydroxyethylcellulose, hydroxypropylcellulose, hydroxypropyl methylcellulose, polyethylene glycols, polyacrylamide, polyacrylic acid, polyvinyl alcohol, polyvinyl pyrrolidone and polysaccharide, such as guar gum, locust bean gum and xantham gum.
The rinse-off compositions optionally comprise so-called hydrotropes. Hydrotropes are materials capable to modify the viscosity and rheology profile of a non-dilute, water-soluble surfactant system. Suitable as hydrotropes are those well known in the art, including sodium xylene sulphonate, ammonium xylene sulphonate, sodium cumene sulphonate, short chain alkyl sulphate and mixtures thereof.
The hydrotrope may be present at levels from 0.01% to 5% by weight, preferably from 0.1% to 4% by weight, more preferred from 0.5% to 3% by weight.
Additionally the rinse-off compositions may comprise an insoluble perfume or cosmetic oil or wax or a mixture thereof at levels up to 10% by weight, preferably up to 3% by weight. Insoluble oil or wax means insoluble in the product matrix at a temperature of 25xc2x0 C.
Suitable insoluble cosmetic oils and waxes can be selected from water-insoluble silicones including non-volatile polyalkyl and polyaryl siloxane gums and fluids, volatile cyclic polydimethylsiloxanes, polyalkoxylated silicones, amino and quaternary ammonium modified silcones, rigid cross-linked and reinforced silcones and mixtures thereof, (C1-C24)-esters of (C8-C30)-fatty acids such as isopropyl myristate, myristyl myristate and cetyl ricinoleate, (C8-C30) esters of benzoic acid, beeswax, saturated and unsaturated fatty alcohols such as behenyl alcohol, hydrocarbons such as mineral oils, petrolatum, squalane and squalene, fatty sorbitan esters, lanolin and oil-like lanolin derivatives, animal and vegetable triglycerides such as almond oil, peanut oil, wheat germ oil, rice bran oil, linseed oil, jojoba oil, oil of apricot pits, walnuts, palm nuts, pistachio nuts, sesame seeds, rapeseed, cade oil, corn oil, peach pit oil, poppyseed oil, pine oil, castor oil, soyabean oil, avocado oil, safflower oil, coconut oil, hazelnut oil, olive oil, grapeseed oil, sunflower seed oil, (C1-C24) esters of dimer and trimer acids such as diisopropyl dimerate, diisostearylmalate, diisostearyldimerate and triisostearyltrimerate.
The rinse-off compositions preferably have a viscosity of at least 500 cps, more preferred from 1,000 to 50,000 cps, particularly preferred from 1,000 to 30,000 cps, highly preferred from 1,000 to 15,000 cps.
The rinse-off compositions optionally include other hair or skin moisturizers which are soluble in the composition matrix. The preferred level of such moisturizers is from 0.5% to 20% by weight. Preferred moisturizer are selected from essential amino acid compounds naturally occurring in the stratum corneum of the skin and water-soluble nonpolyol nonocclusives and mixtures thereof.
More preferred nonocclusive moisturizers are squalane, sodium pyrrolidone carboxylic acid, D-panthenol, lactic acid, L-proline, guanidine, pyrrolidone, hydrolyzed protein and other collagen-derived proteins, aloe vera gel, acetamide MEA and lactamide MEA and mixtures thereof.
The rinse-off compositions may also comprise suspendind agents. The suspending agents serve to assist in suspending the water-insoluble oil and may give pearlescence to the product.
Suitable suspending agents include any long chain acyl derivative materials or mixtures thereof. Preferred suspending agents are ethylene glycol esters of fatty acids having from 16 to 22 carbon atoms. More preferred are ethylene glycol stearates, both mono- and distearate. Particularly preferred are distearates containing less than 7% by weight of monostearate.
Other suitable suspending agents are alkanol amides of fatty acids having from 16 to 22 carbon atoms, preferably from 16 to 18 carbon atoms. Preferred alkanol amides are stearic monoethanolamide, stearic diethanolamide, stearic monoisopropanolamide and stearic monoethanolamide stearate.
Also suitable suspending agents are alkyl-(C16-C22)-dimethyl amine oxides such as stearyl dimethyl amino oxide and trihydroxystearin; copolymers based on acryl alkyl sulfonic acids and cyclic N-vinyl carboxylic acid amides respectively cyclic and linear N-vinyl carboxylic acid amides; comb-like, optionally grafted, acryloyl dimethyl taurate containing copolymers which may contain cationic charges, Si-, F- and/or P-atoms in their backbone or side chains.
Other suitable suspending agents include xantham gum, preferably in combination with long chain acyl derivatives, also carboxyvinyl polymers. Preferred among these polymers are copolymers of acrylic acid crosslinked with polyallylsucrose, carbomers, which are homopolymers of acrylic acid crossliked with an allyl ether of pentaerythrotol, an allyl ether of sucrose, or an allyl ether of propylene.
Other suitable suspending agents can be used in the shampoo compositions, including those that can impart a gel-like viscosity to the composition, such as a water soluble or colloidally water soluble polymers like cellulose ethers such as hydroxyethyl cellulose, and materials such as guar gum, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxypropyl guar gum, starch and starch derivatives, and other thickeners, viscosity modifiers, gelling agents etc. Mixtures of these materials can also be used.
Other suitable suspending agents include N,N-dihydrocarbyl amido benzoic acid and soluble salts therof (e.g. Na, and K salts), particularly N,N-di(hydrogenated) (C16-C18) and tallow amido benzoic acid species of this family.
The suspending agents are preferably present at levels of from 0.5% to 5% by weight, more preferred from 0.5% to 3% by weight.
A number of other materials may optionally be added to the rinse-off compositions. Preferably they are present at levels from 0.1% to 2% by weight. Such materials include proteins and polypeptides and derivatives thereof; water-soluble or solubilizable preservatives such as DMDM Hydantoin(copyright), Germall 115(copyright), methyl-, ethyl-, propyl- and butyl esters of hydroxybenzoic acid, EDTA, Euxyl (RTM) K400; natural preservatives such as benzyl alcohol, potassium sorbate and bisabolol; sodium benzoate and 2-phenoxyethanol; moisturizing agents such as hyaluronic acid, chitin and starch-grafted sodium polyacrylates such as Sanwet(copyright) (RTM) IM-1000, IM-1500 and IM-2500 (Celanese Superabsorbent Materials, Portsmith, Va., USA, also described in U.S. Pat. No. 4,076,663); solvents; suitable anti-bacterial agents such as Oxeco (phenoxy isopropanol), Trichlorocarbanilide (TCC) and Triclosan, low temperature phase modifiers such as ammonium ion sources (e.g. NH4Cl); viscosity control agents such as magnesium sulfate and other electrolytes; colouring agents; TiO2 and TiO2-coated mica; perfumes and perfume solubilizers; zeolites such as Valfour BV400 and derivatives thereof and Ca2+/Mg2+ sequestrants such as polycarboxylates, amino polycarboxylates, polyphosphonates, amino polyphosphonates and EDTA; water softening agents such as sodium citrate and insoluble particulates such as zinc stearate and fumed silica.
The rinse-off compositions preferably have a pH from 3 to 10, more preferred from 5 to 9, particularly preferred from 5 to 8, highly preferred from 5 to 7.
The rinse-off compositions can be used in a wide variety of skin and hair care compositions. Preferred compositions are shampoos, hair shampoos, conditioning shampoos, shower gels and body washes.
Surprisingly it has been found that the trimethyl-silylalkylsilsesquioxane of formula (1) are particulary useful for formulating rinse-off compositions, preferably shampoos, which additionally contain insoluble components, preferably pearlescent and/or opacifying agents. Preferably the opacifier/pearlescer is present in the form of crystals. Compositions containing trimethylsilyloctylsilsesquioxanes (caprylyltrimethicones) and pearlizing or opacifying agents are stable over a long period of time and broad temperature ranges.
Preferred opacifiers and pearlescers include titanium dioxide; EUPERLAN 810(copyright) (RTM); TEGO-PEARL(copyright) (RTM); long chain (C16-C22) acyl derivatives such as glycol or polyethylene glycol esters of fatty acids having from 16 to 22 carbon atoms and up to 7 ethyleneoxide units; alkanolamides of fatty acids having from 16 to 22 carbon atoms, preferably from 16 to 18 carbon atoms, such as stearic monoethanolamide, stearic diethanolamide, stearic monoisopropanolamide, stearic monoethanolamide; alkyl-(C16-C22) dimethyl oxides such as stearyl dimethyl amine oxide; polystyrene dispersions having a particle size from about 0.05 microns to about 0.45 microns, preferably from about 0.17 microns to about 0.3 microns (such dispersions are preferred in respect of the rheology and shear-thinning behaviour); styrene acrylate copolymers and OPACFIER 680(copyright) (RTM) (Morton International).
Preferred perlescent and opacifying agents are ethylene glycol esters of fatty acids having from 16 to 22 carbon atoms. More preferred are ethylene glycol stearates, both mono- and distearate.
Preferably the perlescent and opacifying agents are present at levels from 0.01% to 5% by weight, more preferred from 0.2% to 1.3% by weight.
In a preferred embodiment of the invention the compositions comprising perlescent and/or opacifying agents additionally comprise one or more suspending agents. Preferred suspending agents are those already described in the present application.
The rinse-off compositions of the present invention provide excellent rinse, feel and mildness benefits together with excellent rheological attributes in storage, in dispensing and in use. Moreover said products show good efficacy benefits, skin conditioning, skin moisturising, product stability, cleansing and lathering.
Subject-matter of the present invention is also a process for increasing the gloss and sheen of hair, wherein said process comprises applying an effective amount of a rinse-off composition comprising at least 0.1% by weight of at least one trimethyl-silylalkylsilsesquioxane of formula (1)
Me3SiOxe2x80x94[Si(R)(OSiMe3)O]xxe2x80x94SiMe3xe2x80x83xe2x80x83(1)
wherein Me is methyl, R is a straight or branched alkyl group having from 6 to 18 carbon atoms and x is a number from 1 to 10, and
at least 2% by weight of water-soluble surfactants, and
at least 50% by weight of water to said hair.
In a further aspect the present invention provides processes for increasing the emolliency and increasing the water repellency of the skin, wherein said processes comprise applying an effective amount of a rinse-off composition comprising
at least 0.1% by weight of at least one trimethyl-silylalkylsilsesquioxane of formula (1)
Me3SiOxe2x80x94[Si(R)(OSiMe3)O]xxe2x80x94SiMe3xe2x80x83xe2x80x83(1)
wherein Me is methyl, R is a straight or branched alkyl group having from 6 to 18 carbon atoms and x is a number from 1 to 4, and wherein the the trimethyl-silylalkylsilsesquioxane is substantially free of alkoxysilanes, chlorosilanes, silanol functionalities and organic and/or inorganic compounds, at least 2% by weight of water-soluble surfactants
and at least 50% by weight of water to said skin.
Trimethylsilylalkylsilsesquioxane of formula (1) which are preferred for use in the above three processes are those already described in the present application.

Liquid rinse-off compositions for personal care comprising a trimethyl-silylalkylsilsesquioxane


Described herein are additive manufacturing systems and methods for printing 3D objects.

Conventional additive manufacturing processes typically print 3D objects by depositing layers of material one on top of the other on a build stage until the final printed object is formed. Fused deposition and micro-precision extrusion are additive manufacturing processes that create 3D product architectures by depositing molten polymer strands in desired layered patterns to create the target object. Examples of conventional additive manufacturing processes are disclosed in U.S. Published Application No. 2018/0056584 to Wittner and U.S. Published Application No. 2017/0217088 to Boyd, I V et al., the subject matter of both of which is herein incorporated by reference.
Such conventional processes, however, do not allow for customization of the material properties of the final printed object, which limits applications of the final object. For example, due to the inherent layering technique used in conventional additive manufacturing, the strength of the fabricated products is typically inferior to those manufactured via injection molding.
Therefore, a need exists for an additive manufacturing system and method that produces printed 3D objects with highly customizable material properties.

Additive manufacturing system with tunable material properties


A discharge head for an electrical submersible pump allows the pump assembly to be supported on coiled tubing. The discharge head has a cable passage through which the power cable passes. A motor lead extends from the motor alongside the pump and to the discharge head. The discharge head has flow passages that are offset relative to the longitudinal axis of the discharge head. An annulus seal mounted to the discharge head seals the annulus surrounding the discharge head. A power cable extends through the coiled tubing in one embodiment and is strapped to the coiled tubing in another embodiment.

1. Field of the Invention
This invention relates in general to electrical submersible pumps for wells, and in particular to a discharge head for use with an electrical submersible pump suspended on coiled tubing within the well.
2. Description of the Prior Art
A conventional electrical submersible pump installation for oil wells supports the downhole pump assembly on production tubing. The production tubing is made up of sections of metal pipe secured together by threaded couplings. The submersible pump assembly includes at least one electrical motor, and at least one centrifugal pump. The pump normally locates above the motor and has a discharge head that secures to the production tubing. The production tubing supports the weight of the pump assembly as it is lowered into the well. The well fluid drawn into the intake of the submersible pump will be pumped through the tubing to the surface.
The electrical submersible pump must be maintained from time to time. This requires a workover rig which can pull the sections of tubing from the well to retrieve the pump, then lower a repaired or replaced pump back into the well. This is time consuming and expensive.
One proposal has been to support the pump on the power cable that extends to the electrical motor. This would eliminate the need for tubing and the need for a workover rig to pull the tubing for pump maintenance. Conventional power cable, however, does not have sufficient strength to support the weight of the pump assembly in the well. Consequently, a special cable must be utilized that has sufficient strength to support the weight of the pump in the well. While some of these units have been installed, the expense of the cable has been too high to make this type of assembly common.
It has also been proposed to support an electrical submersible pump on coiled tubing. Coiled tubing is a continuous metal pipe of smaller diameter than typical production tubing. Coiled tubing will coil onto a large reel and can be unrolled into the well. The coiled tubing would have the strength to support the pump assembly in the well. While it requires a unit to uncoil and coil the tubing, the pulling and running back in procedure should be less time consuming than the process of pulling conventional production tubing from the well with a workover rig. Also, coiled tubing would allow the pump to be installed in a live well through a stripper. While the concept of a coiled tubing suspended pump is feasible, this assembly is not commercially available at this time.

Electrical submersible pump discharge head


In the present embodiments, offering credits for gaming machine play in excess of the cash used to purchase the credits may incentivize various player behaviors. Such behaviors may include remote enrollment in the player-tracking system—and payment for the credits—via a web browser; wagering a minimum amount; and wagering within a predefined time period.

This disclosure relates generally to gaming devices and more particularly to incentives offered by a proprietor of a gaming establishment to induce enrolment in a player-tracking system and play of the gaming devices.
Use of a web browser to permit off-site enrollment of players in a player-tracking system via a web browser is known in the prior art. Manual promotions in which players pay, e.g., $20 cash for $40 credit are also known.
In these prior art promotions an attendant oversees a desk associated with a bank of gaming machines dedicated to the promotion. The attendant receives cash from the player, and, using controls at the desk, applies those credits to a specified machine, which the player must play until the session ends—typically either as a result of playing all the credits or hitting a large jackpot. This is so because the $40 credit cannot be cashed out, and can be used only to play the specified gaming machine. In addition, only the top 3 awards can be cashed out; all smaller awards are applied to the gaming machine as non-cashable credits that can only be wagered.

Discounted credits as incentive to play gaming devices


In an embodiment, a processor includes a first domain with at least one core to execute instructions and a second domain coupled to the first domain and including at least one non-core circuit. These domains can operate at independent frequencies, and a power control unit coupled to the domains may include a thermal logic to cause a reduction in a frequency of the first domain responsive to occurrence of a thermal event in the second domain. Other embodiments are described and claimed.

As technology advances in the semiconductor field, devices such as processors incorporate ever-increasing amounts of circuitry. Over time, processor designs have evolved from a collection of independent integrated circuits (ICs), to a single integrated circuit, to multicore processors that include multiple processor cores within a single IC package. As time goes on, ever greater numbers of cores and related circuitry are being incorporated into processors and other semiconductors.
Multicore processors are being extended to include additional functionality by incorporation of other functional units within the processor. Typically, a multicore processor has a global power budget and a global thermal budget. The power budget is set so that a specified power level, at least as averaged over time, is not exceeded. The thermal budget is set such that a thermal throttle point, which is a highest allowable temperature at which the processor can safely operate, is not exceeded. Although these common budgets exist, mechanisms to adaptively share the budgets across the wide variety of circuitry present in a processor does not exist.

Performing cross-domain thermal control in a processor


Briefly, a transmitter that includes first and second fractional N synthesizers that may generate outphased modulated signals. First and second sigma-delta modulators may control the modulation of the first and second fractional N synthesizers.

Mobile stations (MS), handheld devices, base stations (BS), access points (AP) and other devices of wireless communication system may include transmitters to transmit radio frequency (RF) signals. The transmitters may be linear transmitter, outphasing transmitters, and the like. Transmitters that are used to transmit a continuous phase modulation signals, such as, for example, Continuous Phase Frequency Shift Keying (CPFSK) signals, Gaussian Minimum Shift Keying (GMSK) signals, and the like, may include a fractional-N synthesizer with a built-in data modulator. However, in these transmitters, the quantization noise power spectral density may grow with frequency.
Thus, there is a need for better ways to mitigate the disadvantages described above.
It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Further, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements.


An audio decoding apparatus for decoding and reproducing a plurality of compressed audio streams simultaneously without sound interruption, even when the number of samples per frame is different. The audio decoding apparatus includes: a first and second audio decoder which decode two inputted compressed audio streams, and output audio data; a first and second intermediate buffer which temporarily hold the outputted audio data; a first and second audio output unit which convert the audio data into audio signals and output such audio signals; an output control unit which reads the audio data from the first and second intermediate buffer, and transmits the audio data to the first and second audio output unit. The output control unit repeats the reading and transmission of either the same number of samples of audio data or the number of samples of audio data for the same amount of transmission time.

(1) Field of the Invention
The present invention relates to an audio decoding apparatus which decodes a compressed audio stream, and particularly to an audio decoding apparatus which simultaneously decodes a plurality of audio streams and outputs the decoded audio streams as audio signals.
(2) Description of the Related Art
With the advancement of communication technology and the diversification of audio/video devices in recent years, various types of decoder LSI which decode compressed video and audio signals are being provided.
For example, a high-performance LSI which simultaneously decodes the high-vision video signals for two channels is provided (see non-patent document 1: NEC Electronics, "System LSI μPD61160 for Digital Hi-Vision Television", Internet <URL:http:// www.necel.com/digital_av/japanese/mpegdec/d61160.html>, Aug. 30, 2004 search). With this LSI, it is possible to view the video of one television program and simultaneously record the video of another television program.
However, although the aforementioned conventional LSI includes two video decoders, with respect to audio decoders, only one is included. As such, with regard to video, streams for two channels can be decoded simultaneously. However, with respect to audio, there is no guarantee that streams for two channels can be decoded simultaneously at all times. In other words, depending on the content and timing of audio streams received, situations arise in which simultaneous decoding is not possible, and as such, problems such as sound interruption and noise, for example, can occur.
Here, it is possible to presume that problems such as sound interruption, and the like, can easily be avoided by adopting a structure in which two audio decoders are included in one LSI. However, in performing a transmission control in which two output processing units are simply made to output Pulse Code Modulation (PCM) data from two decoders on a per frame basis to implement the simultaneous decoding of audio streams of two completely independent channels, sound interruption, and the like, may still occur as there are cases where the number of samples per frame are different for the two audio streams.
FIG. 1 is a timing chart explaining the mechanism for the occurrence of sound interruption that may arise in the case where two audio streams having a different number of samples per frame, are decoded using two audio decoders. ADEC1 and ADEC2 are first and second audio decoders, respectively, which decode separate compressed audio streams and output PCM data. AOUT1 and AOUT2 are first and second output processing units, respectively, which perform digital/analog (D/A) conversion, and so on, on the PCM data and output the result as audio signals. APCM is an output control unit which transmits, on a per frame basis, the respective PCM data outputted from ADEC1 and ADEC2, to AOUT1 and AOUT2, respectively. In the diagram, the vertical axes indicate the processing time and processing order of the frame-units of data, with the passage of time shown moving in the downward direction. Rectangular blocks 1a to 1f, and 2a to 2f, in the temporal axis direction, respectively correspond to one frame of data (the same marking being given to the same frame).
As shown in FIG. 1, sound interruption occurs between the outputting of audio for frame 2c and 2d by AOUT2. This is because, although under normal circumstances, the APCM should receive frame 2d outputted by ADEC2 and transmit this to AOUT2 (output request 2 should be given) immediately upon receiving an output completion notification 2 from AOUT2 which has finished the audio output of frame 2b, frame 2d could not be transmitted to AOUT2 as the decoding by ADEC2 is not yet completed (frame 2d still being decoded). Moreover, the reason why the APCM is unable to standby for the completion of the decoding of frame 2d by ADEC2 is because PCM data for MIX sound, such as earthquake warnings and the sound effects emitted during remote control operation, which require real-time performance, need to be outputted to AOUT2, together with the audio frame, in a regular cycle.
The reason why the APCM is unable to output the frame 2d to AOUT2 in the usual (normal) timing can be traced back to the late timing at which the APCM issues a decoding request (DEC request 2) to ADEC2, and further traced back to the excessively long time spent by the APCM in the transmission of frame 1c from ADEC1 to AOUT1. This is because, as the number of samples per frame of the audio stream inputted to ADEC1 is greater than that of the audio stream inputted to ADEC2, the transmission from ADEC1 of frame data having the greater number of samples, requires a longer time, and the processing with respect to ADEC2 (decoding request, and so on) is delayed.

Simultaneous audio decoding apparatus for plural compressed audio streams


An information handling system (“IHS”) including an enclosure is provided. A dust detection circuit, located inside the enclosure, is also provided. The dust detection circuit determines whether an amount of dust present inside the enclosure is greater than a predetermined amount.

The description herein relates generally to information handling systems ("IHSs") and more particularly to detecting dust within an IHS.
As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option is an information handling system ("IHS"). An IHS generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements may vary between different applications, IHSs may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in IHSs allow for IHSs to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, IHSs may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
An IHS generally includes various components (e.g., a processor, a memory, a chipset, and other micro devices) located on its system board. While the IHS is operating, its components are capable of generating heat. For such components, capacity for heat transfer (e.g., heat dissipation) is important. In one example, a processor's heat sink with reduced capacity for heat transfer may cause various problems, such as reduced reliability and/or performance associated with processor throttling and increased fan speed.
Heat transfer capacity for a component of an IHS is a function of the convective heat transfer coefficient of the component's heat transfer surface. For example, heat generated by a component is removed via it's heat transfer surface to heat transfer media (e.g., air). Dust, capable of accumulating in the IHS' enclosure, is an insulator between the component's heat transfer surface and the air. Accordingly, dust inside the IHS' enclosure may reduce the component's heat transfer coefficient and, thus, its heat transfer capacity.
What is needed is an IHS that detects dust, without the disadvantages discussed above.

Information handling system including dust detection


A new cultivar of Zantedeschia plant named ‘Captain Cupido’ that is characterized by green leaves and yellow-green colored flowers.

The present invention relates to a new and distinct cultivar of Zantedeschia plant botanically known as Zantedeschia sp. and herein after referred to by the cultivar name 'Captain Cupido'.
'Captain Cupido' is a hybrid that originated from the induced hybridization of the female or seed parent Zantedeschia sp. Zaailing 60 (not patented) and the male or pollen parent Zantedeschia sp. Zaailing 05 (not patented). The cultivar 'Captain Cupido' was selected by the inventor in June of 2000 as a single plant within the progeny of the stated cross in Breezand, The Netherlands.
Asexual reproduction by tissue culture of the new cultivar 'Captain Cupido' was first performed in January of 2001 in De Goorn, The Netherlands. Since that time, under careful observation, the unique characteristics of the new cultivar have been uniform, stable and reproduced true to type in successive generations of asexual reproduction.


Disclosed is a ceramic composite which comprises particles of at least one inorganic compound selected from the group consisting of a carbide, a nitride, an oxide, a boride, a silicide and an oxy-nitride and particles and whiskers of Si.sub.3 N.sub.4, Si.sub.2 N.sub.2 O or SiO.sub.2. This ceramic composite is small in volume change on sintering, and provides heat resistance. In addition, the composite can absorb thermal shock by its voids. It can be used in association with ceramic heaters, current collectors, commutators for starter motors and alternators, and in other areas.

1. FIELD OF The INVENTION
This invention relates to a ceramic composite comprising particles of an inorganic compound and particles and whiskers of silicon nitride, silicon oxynitride and silicon oxide, and to a process for producing the ceramic composite. Further, this invention relates to an electric conductor, heater and sliding material comprising the ceramic composite.
2. Description of Related Art
Ceramics to be used as a conducting material, structural material or other material have recently been required to have properties of high strength at high temperatures, high toughness, high thermal shock resistance and high accuracy of dimension. Such ceramics are known to include inorganic compounds such as carbides, nitrides, oxides, borides, silicides and oxynitrides. For example, silicon nitride, silicon carbide, alumina anci zirconia are known inorganic compounds used in making ceramics. Each of these ceramic materials is rarely used by itself in order to achieve the excellent properties mentioned above. Therefore, many proposals have been made to achieve such properties by selecting combinations of the ceramic materials, and changing the design of the structure.
Hitherto, heaters have been comprised of metal or ceramic. The metal neater includes nichrome or tantalum. This heater has poor heat resistance and degrades at a temperature of 1000.degree. C. or higher.
Ceramic heaters are generally comprised of materials including silicon carbide, stabilized zirconia, lanthanchromite, molybdenum silicide and the like. These ceramic materials have a relatively high electric resistance, and thermorunaway easily occurs. It is difficult to control the temperature in such heaters since the ceramic materials from which they are made have a negative resistance-temperature coefficient. Furthermore, these ceramic materials are defective in that they are poor in mechanical strength and thermal shock resistance. Therefore, attempts have been made to substitute new electrically conductive ceramics for the above-mentioned ceramic materials.
For example, Japanese Patent KOKAI (Laid-open) No. 57-41796 describes that SiC or Si.sub.3 N.sub.4 is mixed with an electrically conductive compound and subjected to hot press sintering to eliminate the problems or defects mentioned above. The hot press sintering method, however, makes it possible to densify sintered bodies. The problem with such a method is that, since a great amount of energy is required for production, production costs are high.
As described In Japanese Patent KOKAI (Laid Open) No. 60-44990, an electrically conductive ceramic enveloped with an electrically insulating ceramic is sintered by hot pressing. A great amount of energy is required. Further, the hot pressing makes it impossible to mold and sinter products having a complicated shape. Generally, to integrate and sinter two or more ceramics having electric resistances which differ from one another, their coefficients of thermal expansion must be adjusted. Hot pressing, however, is carried out at such high temperatures that a small difference in the coefficient of thermal expansion makes it easy for cracks to form.
Furthermore, Japanese Patent KOKAI (Laid-open) No. 60-60983 discloses a process in which an electrically conductive material is mixed with Si.sub.3 N.sub.4 particles. The mixture is sintered by pressureless sintering. In this process, a sintering aid is used and hence softening or deformation takes place inconveniently at high temperatures. Further, a volume shrinkage of about 40 to 60% is brought about on sintering to induce deformation of sintered bodies. On the other hand, the sintering of the conductive material and Si.sub.3 N.sub.3 particles in the absence of any sintering aid do not improve the density of the sintered bodies and, therefore, the specific resistance of the bodies is inconveniently high. Thus, the electrically conductive product according to this Patent KOKAI has unsatisfactory performance.
The Japanese Patent KOKAI references above do not take any account of shrinkage of molded bodies on sintering. Therefore, shrinkage is brought about in these references.
Generally, SiC, Si.sub.3 N.sub.4 or the like are known as engineering ceramics suitable for a structural material for engines or turbines. These ceramics are excellent in heat resistance, and they are sintered by pressureless sintering, pressure sintering or reaction sintering. With the pressureless sintering and pressure sintering, a rate of dimensional change before and after sintering is 15 to 20%. Thus, these sintering techniques provide deformation and poor accuracy of dimension. On the other hand, it is known that the reaction sintering technique provides a lower rate of dimensional change than that of the other sintering techniques. Nevertheless, the rate is as high as about 1 to 1.5%, as shown Japanese Patent KOKAI (Laid-Open) No. 58-140375.
As a material having a low rate of dimensional change, a bonded Si.sub.3 N.sub.4 product has been used as a refractory material. Such material has a mechanical strength of only about 50 MN/m2, as shown in Japanese Patent KOKAI (Laid-open) go. 58-88169, and is not suitable as a structural material.
Furthermore, Japanese Patent KOKAI (Laid-open) No. 61-201662, which has been filed by the present applicant, discloses that a fully satisfactory rate of dimensional change on sintering can be obtained, but a body having a complicated shape is not obtained due to poor flowability of starting mixture. Further, the resultant sintered body has an insufficient mechanical strength.
Some of the reasons for the lack of popularity of engineering ceramics are that the rate of dimensional change on sintering is high and sintered bodies are hardly workable due to their high hardness and brittleness. There has never been a practical process for producing a ceramic material having a high strength, low rate of dimensional change and high accuracy of dimension.
On the other hand, ceramic material has been used as a sliding material for sealing because it has an excellent resistance to thermal shock.
Generally, the working of a machine is always accompanied with sliding. Reduction of friction and wear will induce energy savings and will increase the life of a sliding material. For example, a floating seal comprising O-ring 4 and sealing elements 5 and 6 as shown in FIG. 17, has been used as a sealing meals for cars or construction machines. In this means, one of these sealing elements is fixed, and the other is rotated in contact with the fixed element at the sliding surface 7 thereof and set through a lubricant 8 in a floating state with respect to an axis 9, thereby keeping the sealing property of the means. Therefore, this means is most quitable for sealing or protecting from earth and sand. However, since it is made of a cast iron material, this floating seal performs poorly with respect to both heat resistance and wear resistance. Another sealing means exists wherein one of the sealing elements 10 is made of Cr cast iron and the other 11 is made by injection molding. This sealing means also has the same defect as mentioned above.
On the other hand, a ceramic-made sliding means has recently been introduced. Typical examples of the ceramics used for the sliding means include SiC, Si.sub.3 N.sub.4, Al.sub.2 O.sub.3 or ZrO.sub.2. Practically, it is required that the sliding material have the following properties (see "Kogyo Zairyo", Vol. 31, No. 12, pp. 139-146, particularly 140):
(1) a high hardness and an excellent resistance to wearness and seizing;
(2) a good affinity to a sliding partner (a low coefficient of friction and a small amount of the partner worn);
(3) a good corrosion resistance;
(4) a high strength, toughness and resistance to thermal shock;
(5) a small amount of deformation by stress and/or heat at sliding surfaces to keep a good lubrication state on the sliding surfaces (i.e., a high Young's modulus and a small coefficient of thermal expansion);
(6) a high thermal conductivity (The increase of the coefficient of friction and thermal deformation on the sliding surfaces are prevented by increasing the resistance to thermal shock and inhibiting the accumulation of frictional heat.); and
(7) a low specific gravity (centrifugal stress is reduced).
These required properties are not all satisfied by known materials. For example, a metallic material is questionable with respect to resistance to seizing. Al.sub.2 O.sub.3 itself tins a low resistance to thermal shock, and since it has a high coefficient of thermal expansion, it is easily deformed by heat on the gliding surfaces thereof. ZrO.sub.2 itself also has a low resistance to thermal shock and a high coefficient of thermal expansion. Si.sub.3 N.sub.4 itself has a low thermal conductivity. SiC alone has a high hardness and high thermal conductivity but has a poor resistance to thermal shock. A sliding material having both excellent wear and corrosion resistance, as well as conspicuously improved resistance to thermal shock, has been demanded by the industry.
Among these sliding materials, SiC is widely used in a sintered form. For example, Japanese Patent KOKAI (Laid-Open) No. 61-163174 discloses "a sliding material comprising an SiC sintered porous body having an excellent sliding property under wet conditions". Also, Japanese Patent KOKAI (Laid-Open) No. 55-100421 discloses "a sliding means comprising a fixed part and rotating part, any one of the parts being made of Si.sub.3 N.sub.4 and the other made of SiC".
However, none of these Japanese Patent KOKAI references direct any attention to thermal shock resistance and one-side contact.
Thus, the prior art materials have no combination of good wear resistance and thermal shock resistance. Further, prior art materials have drawbacks such as cracks that are generated due to a rapid change of temperatures. Finally, the prior art materials can be worn.

Ceramic composite and process for production thereof


Method and apparatus for obtaining a tailored heat transfer profile in a chamber housing a microprocessor manufacturing process, including estimating heat transfer properties of the chamber; estimating heat absorptive properties of a wafer; adjusting the physical characteristics of the chamber to correct the heat transfer properties; and utilizing the chamber for manufacturing microprocessors.

1. Field of the Invention
The present invention relates generally to the field of semiconductor processing and, more specifically, to thermal annealing during semiconductor device fabrication.
2. Description of the Related Art
Rapid thermal processing (RTP) is a process for annealing wafers during semiconductor fabrication. During this process, thermal radiation is used to rapidly heat a wafer in a controlled environment to a maximum temperature of over nine hundred degrees above room temperature. This maximum temperature is maintained for a specific amount of time ranging from less than one second to several minutes, depending on the process. The wafer is then cooled to room temperature for further processing. High intensity tungsten or halogen lamps are commonly used as the source of thermal radiation. Conductively coupling the wafer to a heated susceptor provides additional heat.
The semiconductor fabrication process has several applications of RTP. Such applications include thermal oxidation (a wafer is heated in oxygen or a combination of oxygen and hydrogen which causes the silicon substrate to oxidize to form silicon dioxide); high temperature soak anneal (different gas mixtures such as nitrogen, ammonia, or oxygen are used); low temperature soak anneal (typically to anneal wafers deposited with metals); and spike anneal (primarily used in processes where the wafer needs to be exposed to high temperatures for a very short time). During a spike anneal, the wafer is rapidly heated to a maximum temperature sufficient to activate a dopant and cooled rapidly to end the activation process prior to substantial diffusion of the dopant.
A method and apparatus for spike anneal is described in U.S. patent application Ser. No. 2003/0183611, published Oct. 2, 2003, which disclosure is incorporated by reference. During a spike anneal, the wafer is heated using thermal radiation from an array of lamps. Typically, the wafer is heated at a ramp rate of up to 250° C./sec to temperatures greater than 1000° C. The wafer is then cooled by conductively coupling the hot wafer to the cold reflector plate using a blanket of inert gas such as helium gas. This forced cooling facilitates a faster cooling rate, achieving ramp down rates of up to 80° C./sec.
The object of spike annealing is typically a substantially uniform temperature profile across the wafer. This is achieved by controlling an array of lamps or other heat sources which uniformly heat the wafer on the front side while a reflective surface on the back side of the wafer uniformly reflects heat back to the wafer. Emissivity measurement and compensation methodology have been used to improve the uniform temperature gradient across the substrate. However, uniform control of a spike anneal chamber often does not provide substantially uniform temperature profiles across the diameter of the wafer because the chamber components do not behave uniformly at all operating conditions. Thus, apparatus and methods to improve uniformity remain of interest.


A percussion musical instrument comprising a set of clave blocks each comprising a body having an open cavity therewithin. The bodies of the clave blocks have substantially equal exterior dimensions and assorted volumes of the open cavities therewithin provided to generate musical tones of assorted pitches, such as low pitch, medium pitch and high pitch. A volume of the open cavity of the low pitch clave block of the set is larger than a volume of the open cavity of the medium pitch clave block, while the volume of the open cavity of the medium pitch clave block is larger than a volume of the open cavity of the high pitch clave block. Each of the clave blocks of the set further includes a mounting rings.

1. Field of the Invention
The present invention relates to percussion musical instruments in general, and more particularly to a percussion musical instrument comprising a set of clave blocks.
2. Description of the Prior Art
It known to those skilled in the art of music that clave is a five-note, two-bar rhythm pattern, or the beat arrangement, which generates rhythmic measurement and is the foundation and backbone of Salsa (and all Afro-Cuban based music) that makes the sound unique and which makes the dance styling different from American/European popular dances. There are 4 common rhythms, the Rumba and Son clave and a 6/8 (or "Afro") variation of each. In "Salsa," the Son Clave is prevalent. Clave rhythm is the basis of Afro-Latin musical styles and is considered the key, the identity, the root, and the "soul" of the music.
Correspondingly, the musical instrument generating that sound is known in the art as a clave instrument. The clave instrument typically comprises a clave block and a striking bar used to strike the clave block to generate the clave rhythm.


A high precision stepping aligner includes a stage for carrying thereon an object and drivable to move the object stepwise relative to an exposing position so as to align a plurality of portions of the object in succession with the exposing position, where each of the portions is exposed to exposure light. The stage is moved stepwise first in the X-direction and then in the Y-direction. Thereafter, the stepping movement in the X-direction and the stepping movement in the Y-direction are repeated one after another so that the stage traces a substantially spiral stepping pattern. A mirror for reflecting a beam of light for positioning the stage is disposed on the stage with a heat insulating material interposed therebetween.

1. Field of the Invention
The present invention relates generally to stepping aligners, and more particularly to a stepping aligner of the type having a stage movable to displace an object stepwise relative to an exposing position for exposing a plurality of portions of the object in succession to exposure light. The stepping aligner of this invention can be used in various fields of art for exposing various objects, for example, in a pattern lithography performed in the manufacture of electronic components such as semiconductor devices.
2. Description of the Prior Art
Conventionally, an object to be exposed is moved relative to an exposing position so that a plurality of portions of the object are exposed successively. For example, in the case of semiconductor devices, a plurality of portions of an object (wafer) to be exposed are arranged in rows in the X-direction and columns in the Y-direction. For exposing the object, one of these portions is aligned with an exposing position and then exposed to a shot of exposure light. Subsequently, the object is moved relative to the exposing position until the next portion is aligned with the exposing position. The next portion thus aligned is subsequently exposed to the exposure light. The foregoing cycle is repeated to expose the portions of the object in succession. In the specification and claims, such a relative movement between the object and the exposing position, which is performed stepwise, is referred to as a "stepping movement." A typical example of the prior art is disclosed in Japanese Patent Laid-open Publication No. 62-102523. When the exposure process is performed using a mask larger in size than a pattern to be formed, reduction projection alignment is needed. Such a reduction projection alignment is performed by a reduction projection aligner which is generally called as a "stepper." The term "stepping aligner" as used herein is, however, intended to include all the stepping aligners, such as reduction projection aligners, 1:1 projection aligners, etc., regardless of the magnification of a projection optics system used.
FIG. 5 shows the general construction of the reduction projection aligner. In this figure, numeral 6 is exposure light, 10 is an object to be exposed to the exposure light, 31 is an X-stage, 32 is a Y-stage, 41 is a ball screw for moving the X-stage 32 in the X-direction indicated by the arrow 51, and 42 is a ball screw for moving the Y-stage in the Y-direction indicated by the arrow 52.
There has been an increasing tendency to promote microminiaturization and integration of patterns to be formed on an object using the stepping aligner. In the manufacture of semiconductor integrated circuits, the minimum workable dimension of circuit patterns has been reduced to half-micron or even to the level of 0.35 .mu.m. For a semiconductor device (64MDRAM, for example) having a pattern size of less than half-micron, the pattern exposure process must be performed with a very high alignment accuracy. In practice, the necessary overlay accuracy is on the order of 0.1 .mu.m.
In the exposure technology requiring a very high precision alignment, the alignment accuracy can be deteriorated even by a trifling matter. For instance, in a KrF excimer laser stepper which is one of the effective apparatus for the high precision micromachining, the alignment accuracy in each of the X-direction and the Y-direction is not constant but varies with the individual objects (wafers) to be exposed. In addition, the dispersion of alignment accuracy in the X-direction has a different tendency from the dispersion of the alignment accuracy in the Y-direction.
FIGS. 8(A) and 8(B) are graphs showing the relationship between the alignment accuracy and the number of objects (wafers) to be exposed. FIG. 8(A) illustrates the data taken with respect to the X-direction, while FIG. 8(B) shows the data taken with respect to the Y-direction. As is apparent from the comparison between FIGS. 8(A) and 8(B), the alignment accuracy in the X-direction has a greater dispersion than the alignment accuracy in the Y-direction. In addition, FIG. 8(A) indicates that the alignment accuracy in the X-direction increases with an increase in number of the objects (wafers) and hence has a regular tendency. On the other hand, the alignment accuracy in the Y-direction varies at random regardless of the number of objects (wafers) as shown in FIG. 8(B) and, hence, has no regular tendency.
In the conventional stepping aligner, the stepping movement in the X and Y directions is generally performed in the pattern B shown in FIG. 3. More specifically, the object to be exposed is moved stepwise in the X-direction to expose a row of portions of the object in succession. Then, the object is moved in the Y-direction by a distance equal to the width of the row of portions of the object, and a next row of portions of the object are exposed successively in timed relation to the stepwise movement of the object in the X-direction. This stepping pattern B is adopted in order to improve the throughput of the exposure process. The data of the alignment accuracy shown in FIGS. 8(A) and 8(B) are taken when the exposure process is performed using the stepping pattern B shown in FIG. 3. In general, stepping of an object 10 to be exposed is carried out by using a stage 3 driven by means of an X axis ball screw 41 and a Y axis ball screw 42, as shown in FIG. 4. When the stepping is performed using the conventional stepping pattern B shown in FIG. 3, the amount of stepping movement (stepping length) in the X-direction is greater than that of the Y-direction.
It seems provably that the difference in dispersion distribution tendency between the alignment accuracy in the X-direction and the alignment accuracy in the Y-direction is caused by the stepping movement made in the pattern B shown in FIG. 3. Since the amount of stepping movement in the X-direction is greater than the amount of stepping movement in the Y-direction, the dispersion of the alignment accuracy becomes greater in the X-direction than in the Y-direction. In addition, during the stepping movement, movable components generate heat due to mechanical factors such as friction acting between the movable components. The heat thus generated seems to have direct effects upon the dispersion of alignment accuracy. Consequently, the stepping movement in the X-direction, which is greater in amount than that of the Y-direction, generates a greater amount of heat than the stepping movement in the Y-direction. In addition to the heat generated during the stepping movement of the stage in the X and Y directions, heat is also generated during shot (exposure of a portion of the object with exposure light) in the exposure process. In the stepping aligners, such as excimer laser steppers of the type wherein the TTL (through the lens) alignment system cannot be used, an alignment base line may be displaced due to the heat generated during the exposure process.
In order to perform a high precision alignment to obtain the above-mentioned minimum workable dimension of circuit patterns, the aligner must has a high precision X-Y-.theta.-Z stage. Conventionally, the X-Y-.theta.-Z stage is positioned by using interferometers. However, since the interferometers are susceptible to heat, the alignment accuracy tends to decrease when the interferometers are subjected to heat. FIG. 6 illustrates a manner in which the X-Y-.theta.-Z stage is positioned by a pair of interferometers 81, 82. A laser beam emitted from each of the interferometers 81, 82 returns to the interferometer 81, 82 after it is reflected by a corresponding one of two bar mirrors la, lb disposed on the stage. In this instance, the positioning accuracy is determined by the fluctuation of temperature of air surrounding the path of the laser beam, and the flatness of the bar mirrors la, lb. On the other hand, when the exposure process performed in the stepping aligner for forming patterns on a single object (wafer), the stage is moved a plurality of times equal to the number of shots. While the stage is moving, heat is generated from movable parts. A study made by the present inventor indicated that the heat generated during the movement of the stage raises the temperature by about 1.degree. C. at maximum. When the heat is transmitted to the bar mirrors la, lb, the bar mirrors la, lb are thermally deformed with the result that the stage is misaligned within a range of about 0.1 .mu. m. This misalignment results in a misalignment between a portion of the object (wafer) to be exposed and the exposing position where exposure light is projected. Thus, the alignment accuracy is lowered by heat.
As shown in FIG. 6, the stage is composed of an X-stage 31, a Y-stage 32, and a .theta.-Z stage 33. The X-stage 31 is movable in the direction of the arrow 51 in the same figure, while the Y-stage 32 is movable in the direction of the arrow 52. The X-stage 31 is driven by a motor 71 via a ball screw 41. The Y-stage 32 is driven by a motor 72 via a ball screw 42.

High precision stepping aligner having a spiral stepping pattern


A binding processing apparatus 1 is provided with a punch mechanism 2 and a binding processing mechanism 3 for executing a binding processing by a binder. When a sheet P is fed from a printing apparatus 50 of a copier or the like, the sheet is butted to a stopper plate 9 of the punch mechanism, sheet aligning sliders 10 push both left and right sides thereof to position and punch holes are formed by a punch block 7 and a die 8. Thereafter, the sheet is fed to a sheet tray 15 of the binding processing mechanism, one set of the sheets are aligned and a ring shape binder is pinched by a pusher 17 to fit the ring shape binder to the punch holes of the sheets, and a brochure subjected to a binding processing is discharged to a stack tray 4. A binder cartridge 16 can contain a number of the binders and the binding processing can be executed continuously.

There has been diffused a copier incorporating an electric stapler and a post processing function of subjecting each set of sheets successively fed from a copy mechanism to book binding by binding a set by a staple. Further, as a book binding by binding means other than a staple, there is also known book binding means of a coil binder, a comb binder comprising a series of rings in a comb-like shape or the like as means having a further excellent outlook and facilitating to handle and leaf pages. As the apparatus with an object of a binding processing connected to a copier as a post processing apparatus for binding sheets by the binding means, there is known a processing apparatus of successively receiving sheets which are copied or printed with images, forming punch holes at the sheets by a punching device and aligning the sheets (for example, JP-A-2003-231092, JP-B2-3437511), or a coil binding apparatus of fitting a coil binder to punch holes of sheets which are formed with the punch holes and aligned while rotating the coil binder (for example, JP-A-2002-337474).
Further, there has also been proposed a sheet post processing apparatus for successively receiving sheets which are copied or printed with images, forming punch holes by a punching device and adhering respective pages to each other by injecting a glue to the punch holes to bind (for example, JP-A-2003-266968).
Although according to the processing method of binding sheets by a coil binder, or a binder of a type of a series of rings, in comparison with the method of binding sheets by a staple or the method of binding sheets by a glue, there is achieved an advantage that an excellent outlook is provided and handling of sheets as a document is also facilitated, automation of a binder mounting operation is not easy, and there is not present a processing apparatus automating a series of binding processings from forming punch holes to fitting a binder.
Although according to the coil binding apparatus of JP-A-2002-337474, an object of automating to fit the coil is achieved, at each time of binding a copy of brochure, a single piece of coil needs to be mounted to the apparatus, which is not applicable to a use requesting an automatic continuous processing function (a use as a post processing apparatus of a copier or the like). Further, it is not easy to contain a number of coils in a cartridge or the like owing to the shape or constitute a continuous automatic feeding mechanism therefor and it is difficult to constitute a binding processing apparatus operated in cooperation with a copier or the like.


A thermistor positioned within a tubular probe adjacent its closed distal end has lead wires connected with terminals by both crimp and weld connections that are independent of one another. A non-rigid heat transfer medium fills the distal end portion of the probe in surrounding relationship to the thermistor. An opening in the sensor housing leads to the interior of the probe and receives a dielectric sleeve in which tail end portions of the terminals are positioned.

This application relates to the art of sensors and, more particularly, to sensors of the type having a thermistor positioned within a tubular probe. The invention is particularly applicable to temperature sensors for sensing the temperature of a fluid and will be described with specific reference thereto. However, it will be appreciated that the invention has broader aspects and can be used for other purposes such as sensing liquid levels by supplying sufficient current to the thermistor to cause self-heating.
Temperature sensors commonly include a thermistor positioned within a tubular probe. It is common to pot the thermistor in a rigid heat transfer medium such as epoxy. Damage to the thermistor, and to the lead wires and their connections to plug-in terminals, may occur due to thermal expansion and contraction during use of the device or by curing of the potting medium. It would be desirable to improve the integrity of the connections between the lead wires and the terminals, and to minimize damage or failure caused by expansion and contraction during use of the device.


A server computer toggles between a protected mode and an unprotected mode. In the protected mode, users are unable to access configuration information due to a Base Address Register (BAR) being cleared. However, a service provider can access a Trusted Platform Module (TPM) through an Application Program Interface (API) request. In an unprotected mode, the BAR is programmed so that users can access the configuration information, but the TPM is blocked. Blocking of the TPM is achieved by changing a configuration file, which changes an overall image of the card. With the modified image not matching an original image, the TPM blocks access to data, such as encryption keys. Separate interfaces can be used for user access (PCIe) and service provider access (Ethernet) to the server computer. The server computer can then be toggled back to the protected mode by switching the configuration file to the original configuration file.

Cloud computing is the use of computing resources (hardware and software) which are available in a remote location and accessible over a network, such as the Internet. Users are often able to buy these computing resources (including storage and computing power) as a utility on demand.
A cloud computing environment typically includes a plurality of server computers, each of which executes a hypervisor. The hypervisor includes management software executing on the server computers that creates and runs virtual machines. The hypervisor typically divides access to hardware on a server computer between the different virtual machines. The hypervisor also provides a layer of protection to block access to hardware on the server computer, if desired. However, in some applications, protections provided by the hypervisor are removed. In such a case, alternative types of protections should be implemented to prevent unwanted access to hardware on the server computer.

Controlling access by a network interface


A work station includes a work surface and a panel with a notch formed therein and a channel formed therethrough. A panel support base is positioned within the notch of the panel, a sliding member is positioned within the channel of the panel and extends through the work surface, a support member is positioned at an end portion of the sliding member extending through the work surface, and an arm rotatably coupled between the panel support base and the sliding member. The arm is rotatable to move the sliding member and adjust the position of the support member relative to the work surface.

The advent of computers as an integral element of modern day society has meant that many people are using a computer on a fairly regular basis, either at home as a hobby, or at work, where the computer is used as a business tool. Currently, such computers consist of a number of discrete elements which make up a work station, and which typically include a video display monitor, a CPU/disk-drive cabinet, (also referred to herein as a computer) which typically has a disk drive located at one end, and also usually houses the central processing unit (or CPU), and a keyboard.
Many attempts have been made to design an efficient desk or cabinet to house the computer work station. In most such prior attempts, the video display monitor is mounted on top of the CPU/disk-drive cabinet, which in turn is mounted upon a horizontal shelf surface, such as a desk top. Typically, the depth of the CPU/disk-drive cabinet, together with the space required for the electrical plugs at the rear of the cabinet, is such that there is little room left in front of the cabinet on conventional desks. Consequently, a lower outwardly extending shelf is sometimes provided, to support the keyboard.
However, the foregoing arrangement is inefficient, and awkward to use. For example, in the airline industry, in which computer podiums and kiosks are frequently used for purposes of checking passengers and baggage, it may be difficult to adjust components of the podium or kiosk to account for the variety of users that are expected to interact with the computer at the podium or kiosk. Accordingly, it remains a priority to increase the flexibility of these systems to be more user-friendly.


Disclosed are compaction resistant thin film composite membranes having a porous polymeric support; a semi-permeable polymer film polymerized on the porous polymeric support; and particles, of a size in the range of microparticles and nanoparticles, dispersed in the porous polymeric support. Also disclosed are methods of making compaction resistant membranes by polymerizing a polymer film on a porous polymeric support with particles of a size in the range of microparticles and nanoparticles dispersed therein, the particles having been selected to improve flux flow characteristics over time of the semi-permeable membrane. Also disclosed are methods of purifying water using the disclosed membranes. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

At elevated feed water pressures, polymeric filtration membranes can be damaged internally by what can be referred to as "internal fouling." Elevated pressures can become necessary for reverse osmosis (RO) membrane processes to overcome the effects of internal fouling in order to maintain water flux flow rates. Further increases of applied pressure can be required with time due to fouling for example by contaminants which occur on the membrane surface and may be considered "external" or surface fouling. Surface fouling, and the resulting higher operating pressures required to maintain a desired flux may lead to additional internal fouling, of the membrane. Such increased internal fouling, in turn, can require even higher operating pressures to achieve a desired flux. Although surface deposits that lead to elevated operating pressure can be removed by physical and chemical cleaning methods, internal fouling due to high pressure physical compaction cannot be reversed. Such irreversible fouling of RO membranes can also lead to higher long-term operating cost and energy consumption.
For example, conventional RO membranes typically exhibit a first or initial permeate flow rate at a first applied pressure which decreases with time as internal fouling occurs, typically in a matter of days or hours, to a lower permeate flow rate at the same applied pressure until a generally steady state permeate flow is achieved. After the steady state permeate flow rate is achieved, the flux flow rate may further decline as a result of external fouling. Most or all of the reduced flux flow may be resulting from external fouling may be recovered by various cleaning processes which typically remove the surface contaminants. As a result, whether applied pressure is increased to maintain a desired permeate flow in light of internal and external fouling, or the applied pressure is maintained constant and the permeate flow rate allowed to decrease from an initial state to a steady state due to irreversible internal fouling and further due to reversible, or at least partially reversible external fouling, fouling is a major operating problem for conventional membranes such as RO membranes.
Therefore, there remains a need for methods and compositions that overcome these deficiencies and that effectively provide for membranes having improved membrane resistance to internal and/or external fouling and improved or reduced water flux decline over time from initial to steady state conditions, while maintaining satisfactory water permeability and solute rejection.

Micro-and nanocomposite support structures for reverse osmosis thin film membranes

The Regents of the University of California


A high throughput deposition apparatus includes a process chamber, a plurality of targets that form a first closed loop in the process chamber, wherein the first closed loop includes a long dimension defined by at least a first pair of targets and a short dimension defined by at least a second pair of targets, a first substrate carrier assembly that can hold one or more substrates and configured to receive a deposition material from the plurality of targets in the first closed loop, and a transport mechanism that can move the first substrate carrier assembly along an axial direction through the first closed loop in the first process chamber.

The present application relates to material deposition technologies, and more specifically to high throughput deposition apparatus.
Material deposition in vacuum is widely used in photovoltaic cells and panels, window glass coating, flat panel display manufacturing, coating on flexible substrates, hard disk coating, industrial surface coating, semiconductor wafer processing, and other applications.
High volume production systems used for these applications typically comprise of interconnected box-shaped chambers that accept one or two rows of substrates where one or two sets of deposition sources are mounted on each sides of the vacuum chamber. The deposition sources include chemical vapor deposition (CVD) and sputtering deposition. Sputtering typically has a material usage rates ranging from 20 percent for low cost planar targets to 80% for high cost rotary targets for sputtering deposition.
In some conventional sputtering deposition systems, the sputtering sources need to be larger than the substrate to achieve good uniformity across the whole substrate, causing wasted deposition material outside the substrate and excess material deposition on either the deposition chamber or deposition shields. The need to change deposition shields to avoid particulate formation is one of the major causes for preventive maintenance (PM) and loss of production time. To compensate for finite size of a sputtering target, more materials must come out from edge of the target to achieve good thickness uniformity, causing deeper erosion near target edge and low target utilization. The plasma density and angular distribution of atoms of the target material arriving at the substrate are intrinsically non-uniform. Magnets mounted behind the target are used to enhance the plasma density. The magnets consist of alternating north and south poles, which produce magnetic fluxes lines spanning from target surface to reach the substrate. Electrons from the target or near the target gain energy due to the electric potential established by the target voltage, follow these magnetic flux lines, and bombard the substrate. The energetic electrons can damage the substrate and are non-uniform across substrate surface.
In some conventional plasma enhanced chemical vapor deposition systems (PECVD), gas distribution plate with perforated holes are placed in parallel next to the substrate. Radio frequency (RF) power is connected to the gas distribution plate to create plasma to enhance the deposition rate. The typical vacuum pressure is kept in a range between 0.1 to 10 Torr in order to sustain plasma, and the plasma density is typically low. The low plasma density limits the deposition rate and requires high voltage on gas distribution plate. The high operating pressure causes excessive gas phase reaction and reduced material utilization.
There is therefore a need for higher throughput deposition systems that can provide uniform deposition, reduce plasma damage, widen process window, increase throughput, provide higher productivity, provide higher material utilization, reduce material deposition outside substrate, increase time between maintenance, lower target cost, and lower equipment cost.

High throughput vacuum deposition sources and system