In accordance with one aspect of the invention, a cavity back iron type club head is provided with an insert at the striking face of the head with the insert being made of a material different than the material that makes up the remainder of the head body. The head body is formed of metallic material and is provided with a cavity at a rear portion of the head. The head body is perimeter weighted substantially completely around the perimeter at both the rear and a front of the head.

1. Field of the Invention
This invention relates to the head of a golf club used for striking the golf ball between the teeing ground and the putting green, generally referred to as a "golf club".
The principal skill in accurate striking of the golf ball is to correctly contact the ball on that point on the striking face of the club, generally referred to as the "sweet spot".
2. Description of the Prior Art
A presently known golf club head is of the common blade shape having an elongated striking face and a thickness of only about half an inch consistent throughout its length. The thickness of said striking face may vary from the top to the bottom or sole of the club head.
Such a golf club head has the mass, or general overall head weight, evenly distributed over the elongated length of the portion located directly behind the striking face.
Alternatively, there have been developments in iron golf head technology which have provided peripheral weighting of the head mass by constructing the head in such a way as locating the major part of the head material, usually stainless steel, around the perimeter of the head shape. One such design is shown in U.S. Pat. No. D276644.
It has generally been tested and agreed that it is desirable for the club head to strike the ball at the "sweet spot", which is accepted by technologists in the industry as having a larger area if the peripheral weighting head design is used. The design of iron head shown in U.S. Pat. No. D276644 is considered to be the most improved design yet devised to provide an iron golf head with an enlarged "sweet spot".
It will be appreciated that considerable skill is required to accurately make contact with the golf ball at the "sweet spot", or centre of the mass of the club head at the forward portion, generally referred to as the "striking face", since the mass, or general overall headweight is spread throughout the length, or back portion of the striking face.
The golf club head with the perimeter weighted cavity back head shape such as that shown in U.S. Pat. No. D276644 has a cavity located behind the striking face at that point where the club head is required to make contact with the golf ball. In this case, the actual mass or head weight is generally located around the rear edge or perimeter of the golf head forming what is generally referred to as a "cavity back" golf club head.
It will be appreciated that the cavity back design of golf club head provides a larger sweet spot than would normally be provided in the case of the conventional blade shaped golf club head. However, it will be realised that because of the cavity back design, the thickness of the golf head in the area directly behind the contact point on the striking face where contact is made with the golf ball will be thinner than the striking point of the alternative blade shaped head.
It is an object of the invention to provide a golf club with a head so designed as to assist the player, generally referred to as the "golfer", to strike the ball at a point on the striking face which has a large sweet spot and also provides a better chance to "work" the golf ball.


A memory controller, system, and methods are disclosed. The system comprises a memory controller interconnected to a plurality of memory chips. Each memory chip stores data at a plurality of locations. The memory controller performs a sparing transaction comprising reading data from a given location of one or more of the memory chips including a first memory chip, writing the data to a given location of one or more of the memory chips including a second memory chip, wherein during writing, data from the first memory chip is written to the second memory chip, and allowing additional memory transactions directed to the memory chips between the start of reading and the end of writing unless the additional memory transaction is targeted to the given location. In a further embodiment, the sparing transaction comprises correcting errors in the data before writing the data.

1. Field of the Invention
This invention relates to computer memory systems and, more particularly, to techniques for avoiding data corruption during sparing of memory chips.
2. Description of the Related Art
Evolving standards of reliability, availability, and serviceability for computer memory systems have led to systems that include one or more redundant memory chips. In such systems, when failures from a particular memory chip exceed a threshold, a spare chip may be employed to take the place of the failed chip. This strategy, referred to as chip sparing, allows a multi-chip system to tolerate more than one failed memory chip by sparing out one known bad chip with a high number of failures and using error-correcting code (ECC) checking and correction to carry on without interruption when failures occur on other chips.
A sparing operation typically includes sequentially reading the contents of a failed chip, applying error correction, and writing the corrected values to the spare chip. A simple approach to preventing data corruption is to stop other memory transactions during a sparing operation. However, stopping other memory transactions during a sparing operation may adversely affect system performance since chip sparing may take a significant amount of time to write-back the corrected contents of an entire chip. For example, to spare a DDR-533 512 Mb DRAM may take approximately 4 seconds. On the other hand, allowing a mixture of chip sparing transactions and other memory transactions could lead to data corruption. For example, when a non-sparing memory write to a given location occurs in between a read and a write of a chip sparing read/write pair to the same location (i.e. after the read but before the write), the data in the given location may be corrupted because the chip sparing write operation may overwrite the data written by the non-sparing write operation. Also, when a non-sparing memory write is issued to a given location that has been spared, data may be written to both the given location and to a corresponding spared location. In addition, a non-sparing memory read operation that takes place during a chip sparing operation to the same location may return different data depending on whether the read takes place before or after the chip sparing write-back. Accordingly, a system and method are needed that avoid data corruption during chip sparing operations while maintaining adequate system performance.

Data corruption avoidance in DRAM chip sparing


The present invention relates to a Huffman decoding method. Firstly, a Huffman table including multiple Huffman codes and multiple corresponding size/symbol codes is extracted. Each Huffman code comprises a codeword and each size/symbol code comprises a size code and a symbol code. Then, multiple mask codes are generated according to the size codes. Then, masking operations are performed on successive 16 bits of the compression bit stream and the mask codes, thereby outputting multiple masking results. Subsequently, logic operations on the masking results and the Huffman codes, thereby generating multiple are performed on the new Huffman codes, wherein each new Huffman code includes the codeword. It is discriminated whether the 16 bits of the compression bit stream complies with a specific one of new Huffman codes, thereby outputting the size/symbol code corresponding to the codeword.

Huffman encoding algorithm is widely used in compression of video and image data, for example in JPEG and MPEG compression. As known, identical symbols (e.g. A, B, C, etc.) included in a file to be compressed may be repeatedly occurred. Based on the frequency of occurrence of the symbols in the file that is being compressed, Huffman encoding algorithm encodes symbols by assigning thereto respective codewords having lengths corresponding to probabilities of occurrence of the symbols. In a case that the occurrence of a symbol is more frequent, the length of the encoded symbol is shorter. Take a file having data ABCBCDCDDD for example. The frequency of occurrence for the symbol A is 1, for the symbol B is 2, for the symbol C is 3 and for the symbol D is 4. Since the symbol D has the most probable occurrence, the symbol D is assigned with a codeword having the shortest code length or bit-size. In contrast, since the symbol A has the least probable occurrence, the symbol A is assigned with a codeword having the longest code length or bit-size. For example, the symbol A is assigned with a codeword "11111111", the symbol B is assigned with a codeword "00000", the symbol C is assigned with a codeword "111" and the symbol D is assigned with a codeword "00". By assigning smaller codes to more frequently used symbols and larger codes for less frequently used symbols, Huffman compression is a variable-length encoding system of reducing the size of files being compressed.
For reading the contents of the original file, the compressed file should be decompressed and then decoded by using a Huffman table as shown in FIG. 1. Referring to FIG. 1, the Huffman table includes several columns such as an address column, a symbol column, a size column and a codeword column. The address column denotes the address of the codeword stored in the memory. The size column denotes the bit-size of the codeword. The codeword column denotes the Huffman code of the encoded symbol. For example, the symbol J shown in FIG. 1 is assigned with a codeword "0110110" having a bit size of 7 (i.e. 7 bits). In other words, the input data "0110110" are encoded by the Huffman decoder into a corresponding symbol J and the bit-size is 7.
Nowadays, a nice way of visualizing the process of decoding a file compressed with Huffman encoding is to use a binary tree. A Huffman decoding method of using a binary tree-based search was disclosed in U.S. Pat. No. 6,621,429. According to the binary tree-based search, the Huffman table describes a binary tree corresponding to the Huffman code. Starting from the uppermost node, each node has two branches connected thereto so as to construct the binary tree.
Please refer to FIG. 2, which is a schematic view showing a binary tree created from the Huffman table of FIG. 1. Generally, if the Huffman table is changed, the configurations of the binary tree are varied. The binary tree of FIG. 2 stores each data (symbol) in a corresponding leaf node. By a Huffman decoder, a symbol search begins at the root of a binary tree and ends at any of the leaves. One bit for each node is extracted from bit-stream while traversing the binary tree. The code for a symbol is obtained by following the path from the root to the leaf node containing that symbol. The low-level bit 0 of the input data is assigned to a left branch, and the high-level bit 1 is assigned to a right branch. After a symbol corresponding to the bit is searched, a next bit of the input data is extracted and then decoded as described above.
For example, an input data stream "011101" to be decoded is illustrated with reference to FIG. 2. As to the node 11, the first bit data "0" is assigned to the left branch to the node 12. As to the node 12, the second bit data "1" is assigned to the right branch to the node 13. As to the node 13, the third bit data "1" is assigned to the right branch to the node 14. As to the node 14, the fourth bit data "1" is assigned to the right branch to the node 19. As to the node 19, the fifth bit data "0" is assigned to the left branch to the node 20. As to the node 20, the sixth bit data "1" is assigned to the right branch to the leaf node storing that symbol F. That is, the input data stream "011101" may be decoded into the symbol F. After the leaf node is searched, a new input data stream is continuously read and a symbol search begins at the root node 11 again. The binary tree search procedures are repeated until all input data streams are recoded.
Since the bits of the input data stream are decoded one by one, the processing speed of such binary tree search method is very slow and is not suitable to decode abundant compressed files. Therefore, there is a need to provide a Huffman decoding method for decoding Huffman codes at a high speed.


An object of the present invention is to provide a method of forming fine particles on a substrate in which reoxidization of reduced fine particles is suppressed. Reduced fine particles (FeO fine particles) are formed by embedding metal oxide fine particles (Fe2O3 fine particles) fixed on a p type silicon semiconductor substrate into a silicon oxidized film, and carrying out a heat treatment in a reducing gas atmosphere. Presence of the silicon oxidized film enables suppression of reoxidization of the reduced fine particles (FeO fine particles) due to exposure to the ambient air.

1. Field of the Invention
The present invention relates a method of forming a fine particle array on a substrate utilizing a hollow protein. Further, the present invention relates to a semiconductor element utilizing the fine particle array.
2. Description of the Related Art
There were conventional methods of forming fine particles which comprise fixing a protein complex, which can include a fine particle therein, on a substrate; removing the protein by a heat treatment or the like; and reducing in a reducing atmosphere to produce a metal atom aggregate (for example, see, Japanese Patent Provisional Publications No. 2002-223016, No. H11-45990 and No. H11-233752).
FIG. 2 shows a conventional method of forming fine particles described in Japanese Patent Provisional Publications No. 2002-223016 and No. H11-233752; FIG. 3 shows a conventional method of forming fine particles described in Japanese Patent Provisional Publication No. H11-45990; and FIG. 4 shows a conventional method of forming fine particles described in Japanese Patent Provisional Publication No. H11-233752, respectively.
In FIG. 2A and FIG. 3A, protein complexes (ferritin) 4 including a fine particle therein are dispersed in an aqueous solution in a water bath 3. Next, when a polypeptide film (PBLH) 5 is formed on the surface of water, the aforementioned protein complexes 4 are adsorbed onto the polypeptide film 5 to form a high density monolayer film on surface of the aqueous solution (FIG. 2B and FIG. 3B). Next, by bringing a substrate 6 into contact with this surface of water, the monolayer film of the protein complexes 4 is transferred to the substrate 6 (FIG. 2C and FIG. 3C), thereby allowing high density fine particles to be fixed on the substrate (FIG. 2D and FIG. 3D).
In Japanese Patent Provisional Publications No. 2002-223016 and No. H11-233752, protein components are thereafter eliminated by subjecting the substrate to a heat treatment in an inert gas (nitrogen) atmosphere. In Japanese Patent Provisional Publication No. H11-45990, the protein components are eliminated by subjecting the substrate 6 to an ozone treatment at 100° C. to 150° C. as shown in FIG. 3E to form iron oxide fine particles 8 on the substrate (FIG. 3F).
Although not shown in the Figure, in Japanese Patent Provisional Publications No. 2002-223016, No. H11-45990 and No. H11-233752, reduction is thereafter executed by subjecting to a heat treatment in hydrogen at 300 to 500° C. to form iron atom aggregates (metal fine particles).
In the method of manufacturing a semiconductor element disclosed in Japanese Patent Provisional Publication No. H11-233752, metal oxide fine particles, and protein complexes 204 comprising a hollow protein including a metal oxide fine particle therein (hereinafter, referred to as "protein complex") are first arranged on a gate oxidized film 203, as shown in FIG. 4A. Next, the hollow protein is removed, and then the metal oxide fine particles are subjected to a reduction treatment. Thereafter, as shown in FIG. 4B, a silicon oxidized film is further formed with a CVD method, and a semiconductor element having metal fine particles is formed by embedding the reduced metal fine particles into the silicon oxidized film.

Method of forming fine particle array on substrate and semiconductor element

Matsushita Electric Industrial Co., Ltd.


A rotary grinder having a cylindrical drum that includes a cylindrical surface. The cylindrical surface defines two holes. The drum receives opposite ends of a through-member at the two holes such that the opposite ends of the through-member comprise hammers when the cylindrical drum is rotated. A single retaining member is used to secure all of the through-members to the drum.

Grinders for grinding waste material such as trees, brush, stumps, pallets, railroad ties, peat moss, paper, wet organic materials and the like are well known. An example of one such prior art grinder, known as a tub grinder, is shown in commonly assigned U.S. Pat. No. 5,507,441 dated Apr. 16, 1996. Another example is shown in U.S. Pat. No. 5,419,502 dated May 30, 1995. Another type of grinder is known as a horizontal grinder, examples can be found disclosed in U.S. Pat. No. 5,975,443, U.S. Pat. No. 5,947,395, U.S. Pat. No. 6,299,082.
There are 4 different types of grinders that can be identified as defined in U.S. Pat. No. 6,299,082 including chippers, hammer mills, hogs and shredders: Each including a type of a rotary grinding device.
Tub grinders typically include a rotary grinding devices such as a hammermill or hog that is mounted on a frame for rotation about a horizontal axis. The hammermill or hog function in cooperation with a shear bar or anvil and typically a screen; the assembly including the hammermill or hog, anvil and screen forming a grinding device. A rotating tub surrounds the grinding device. The tub rotates about a generally vertical axis. Debris is deposited in the rotating tub and the grinding device grinds the debris.
FIG. 1 illustrates one type of prior art hammermill 20 commonly used with conventional tub grinders. The hammermill 20 includes a plurality of hammers 22 secured to a plurality of rotor plates 24. The rotor plates 24 are rotatably driven about a generally horizontal axis of rotation 26. Cutters 25 (e.g., cutter blocks, cutter teeth, etc.) are mounted on the hammers 22 (e.g., with nuts 30 and bolts 28). The hammers 22 are secured between the rotor plates 24 by shafts or rods 31 aligned generally parallel to the horizontal axis of rotation 26. For example, each hammer defines two holes 32 and 34 each positioned to receive a different shaft 31 (only one shown). Shims 36 are mounted between the hammers 22 and the rotor plates 24. When the rotor plates 24 are rotated about the axis of rotation 26, the hammers 22 are carried by the rotor plates 24 in a generally circular path. Material desired to be ground is fed into the circular path such that the material is impacted and reduced in size by the cutters 25 of the hammers 22. The grinding device of a conventional tub grinder also typically includes a sizing screen that curves along a lower half of the hammermill. FIG. 15 illustrates a grinding device typical of the prior art including a rotary grinder 20, anvil 100 and screen 102. In this particular embodiment the screen 102 is comprised of 2 portions to aid removal and replacement. They are made to be replaceable, as different screens are installed to achieve differing ground material sizes.
The screens 102 are supported in alignment with the rotary grinder by plates 104 that are located on the sides of opening 45 in the floor 44 corresponding to the ends of the rotary grinder 20, and in the vicinity of the rotary grinder support bearings. They are supported by frame 48. Anvil 100 is supported by the frame 48 and by the screen 102. The screens 102 are available in the prior art in a variety of configurations. One variety include round holes, another includes square or rectangular holes. The size of the holes varies, and effects the maximum size material that is allowed to pass through. Other variations of the screens include varying circumferential coverage wherein the length of screen is reduced, thereby increasing the gap 106 between the screens. It is known to significantly increase the gap 106 to allow material to exit the grinding device to reduce drag and power requirements. This is typically done in applications wherein the size of the ground material is not critical.
A grinding chamber is formed between the screen and the hammermill. The screen performs a sizing function and defines a plurality of openings having a predetermined size. In use, material desired to be ground is repeatedly impacted by the hammers 22 against the screen, or crushed between the hammers 22 and the screen, causing the material to be reduced in size. When the material is reduced to a size smaller than the predetermined size of the openings defined by the screen, the material moves radially through the screen. Upon passing through the screen, the reduced material commonly falls by gravity to a discharge system located beneath the hammermill 20.
The grinding device of a horizontal grinder typically includes an anvil and a screen. Many different configurations for horizontal grinders have been developed, but the basic grinding actions are similar to those found in tub grinders.
The typical prior art hammermills or hogs generally utilize block-shaped cutters mounted such that the effective cutting edge is parallel to the axis of rotation. This results in a surface of rotation for each cutter describing a cylinder, having a single effective cutting diameter that cooperates with the straight edge of the anvil.
Many other techniques have been developed to improve the cutting efficiency including U.S. Pat. No. 4,066,216 disclosing relatively narrow cutters with plates that project into the space between cutters and U.S. Pat. No. 3,580,517 disclosing sharp-pointed cutters with an anvil that matched the profile of the surface of rotation defined by the cutters. In both of these examples the cutters are not as robust as a standard block-type cutter, resulting in concerns related to durability. Hammer wear is a significant concern relating to hammermills. For example, hammer wear results in loss of hammer integrity, out-of-balance conditions, reductions in grinding efficiency, and increases in maintenance and service costs. With a conventional hammermill, it is difficult to replace the hammers because the hammermill must be disassembled. Disassembling a hammermill can be particularly labor intensive and time consuming because the rods used to connect the hammers to the hammermill are quite heavy. There are typically several rods per hammermill and frequently two rods must be removed to replace a single hammer. Furthermore, rods can be corroded in place or deformed thereby making it even more time consuming and costly to disassemble a hammermill.
Power requirements and resulting fuel consumption is also affected by the interaction of the screens and the hammers. The crushing characteristic is known to result in a significant amount of frictional drag. This drag results from to the tendency to trap the material between the stationary screen surface and the moving cutters or hammers while under significant load. This condition results in either the material moving with the cutters and sliding against the screen or the material being retained by the screen and the cutters sliding past the material or some combination. Any of these result in significant drag, thus grinders typically require significant power.


A circuit of a detection switch for generating an output signal for driving a load device in accordance with the detection result by a detector is composed with a reduced number of components externally attached to an IC substrate which mounts integrally main circuit units such as a power source circuit unit, a detection circuit unit and an output circuit unit. The output circuit unit comprises a comparator which compares a judgment signal from the detection circuit unit with a reference signal when the load device is driven by DC power, or compares the voltage of an external DC power source with a predetermined voltage when the device driven by AC power, and an output driver which generates a driving signal for the load device in response to the output signal from the comparator. The detection circuit unit produces the judgment signal only when either the output circuit unit or the power source circuit unit is active. Further, the output circuit unit comprises an NPN output circuit with a protection function for load short-circuit breaks its current path based on the judgment signal and a switching output circuit operating in engagement with the NPN output circuit. A limiter and a switching circuit are provided between the NPN output circuit and the load device. The limiter supplies the NPN output circuit with an excess current exceeding a predetermined value flowing through the load device and the switching circuit controls the limiter in accordance with the output from the switching output circuit. Further, the detection switch circuit is connected with a display lamp for displaying the operation of the switch, and the output circuit unit has a selector for selecting the judgment signal or the output signal for display according to the connection of an external jumper.

1. Field of the Invention
The present invention relates to a detection switch circuit for generating an output signal in accordance with the detection result of a detector such as a photo-electric switch a proximity switch or the like, and more particularly to a detection switch circuit the main circuit parts of which are formed integrally on an integrated circuit (IC) substrate.
2. Description of the Related Art
Conventionally, a small-sized detection switch has been integrated as dense as possible to be incorporated in a smaller number of smaller-sized IC substrate(s). One example of typical detection switches formed on the IC substrate will be explained with reference to FIG. 1.
In FIG. 1, a detection switch 1 serves to drive a load device 2 connected therewith in accordance with a detection result, and comprises an IC substrate 3, a detector 4, a display lamp 5 and a delay circuit 6.
The load device 2 may be selected from various kinds of manupulators or displays including a valve solenoid, a magnetic relay, a lamp and a motor in accordance with a control purpose.
The detector 4 which generates a detecting signal based on a detected object or state may be incorporated in the detection switch circuit 1. Also, in accordance with the object to be detected, the detector 4 may be a primary switch such as a limit switch, a magnetic detector, a photo-detector comprising a projector and a receiver and a vibration sensor, or may be a composite sensor such as a moisture sensor, a smoke sensor and an acceleration sensor.
The IC substrate 3 which is the main circuit part of the detection switch 1 comprises a detecting circuit unit 7, an output circuit unit 8 and a power supply circuit 9 formed on a sheet of IC substrate. The IC substrate 3 is also incorporated in the detection switch.
The detecting circuit unit 7 serves to generate a judgment signal relative to the detection object in response to a detection output, and comprises an amplifying circuit 11 and an integrating circuit 12. The amplifying circuit 11 generates a stable output in response to a faint detection output from the detector 4. The integrating circuit 12 processes the stable signal to generate a judgment signal indicative of the judgment result of e.g. the presence of the detection object, the status thereof. If the detecting circuit unit 7 is simple, the above functions may not be separated.
The output circuit unit 8 is provided for insufficiency of the current capacitance of the output from the integrating circuit 12. In response to the judgment signal from the integrating circuit 12, the output circuit unit 8 produces a driving signal for the load device 2 and a display signal for the display lamp 5. The output circuit unit 8 is composed of an output signal generating circuit 13, an output driver 14 and a display circuit 15.
The output signal generating circuit 13 produces an output signal for controlling the load device 2 in accordance with the judgment signal from the integrating circuit 12. In response to the output signal from the circuit 13, the output driver 14 produces a driving signal having a large current capacitance for driving the load device 2. The output driver 14 is designed to have a function of short-circuit protection.
The output driver 14, which is incorporated in the IC substrate, includes an NPN output type and/or a PNP output type. The NPN output type driver comprises an NPN power transistor incorporated on the IC substrate, the output of which is supplied to an external terminal to be directly connected with the load device 2. On the other hand, the PNP output type driver usually comprises an NPN transistor incorporated on the IC substrate and an additional PNP power transistor provided externally. The reason is that the NPN power transistor can be easily designed with a relatively small size and large capacitance, and also the demand therefor is great. On the other hand, the PNP power transistor will be too large considering its current capacitance and also the demand therefor is relatively low. Therefore, it is preferable to externally attach it in accordance with capacity requirement rather than to prepare a large size IC substrate for a low demand. This applies to the detection switch in which both drivers of NPN output type and PNP output type are integrally incorporated on the same IC substrate in view of its versatility as shown in FIGS. 2 and 3. Specifically, the NPN output circuit 43 in the output driver 14 includes an NPN power transistor Q41 the output terminal of which is directly connected with a load device 45 whereas the PNP output circuit 44 includes an NPN transistor the output of which is connected with a load device 46 through a PNP power transistor Q42 externally attached to the IC substrate.
Incidentally, the output circuits 43 and 44 have known short-circuit protecting functions, respectively which are usually linked so that when one operates, the other also operates. A short-circuit protecting circuit suited for this function which requires no capacitor is suited for IC was proposed in JP-A-61-199416 to Tanigawa et al.
Since the NPN output circuit 43 is formed on the IC substrate 3, the output NPN power transistor Q41 is desired to be as small as possible, and so such an NPN power transistor as is not so large and can pass the driving current up to e.g. 100 mA is selected. In order to provide the driving current exceeding the 100 mA using such an NPN power transistor having a relatively small current capacity, the output therefrom is amplified by a transistor Q43 and a power transistor Q44 as shown in FIG. 3. Thus, the current permitted for the power transistor Q44 can be supplied to the load device 45. However, in the case of providing a large driving current in the above manner, the driving current flowing through the load device 45 flows in its most through the power transistor Q44 and almost does not flow through the NPN output circuit 43. Therefore, the short-circuit protection function of the NPN output circuit 43 does not work. In this case, in order to prevent the short-circuiting in the load device 45, a circuit having the short-circuit protection function externally attached to the IC substrate is separately used.
The display device 15 produces a lighting signal causing the display lamp 5 to flash on and off to indicate the detection state using the above output signal, or the operating state of the load device 2 using the driving signal.
The power supply circuit unit 9 transforms DC voltages between (Vcc and G) externally supplied through terminals 21 and 22 to supply the DC voltages required for the respective circuit units of the switch 1. The power supply circuit unit 9 is composed of a voltage regulating circuit 16 and a power supply resetting circuit 17. The voltage regulating circuit 16 serves to provide a stable DC voltage. The power supply resetting circuit 17 serves to monitor the output from the voltage regulating circuit 16 and to limit power supply until a stabilized voltage at a necessary level is obtained, thereby assuring a stabilized power supply. The power supply resetting circuit 17 recognizes the stability of the power supply to supply to the output driver 14 a signal permitting the driving signal to be output.
Meanwhile, in the case where the detection switch 1 is used for a two-wired AC circuit, a relatively large leakage current flows through the detection switch 1 when the load device 2 such as a relay is off so that as the case may be the load device 2 will not be completely turned off. In order to obviate such a phenomenon, the detection switch 1 is required to be operated by a small current. To this end, without using a power supply circuit unit 9 incorporated in the switch body, power may be supplied from an external constant voltage source for making a constant voltage on the basis of the AC power. For preparation of necessity of directly accepting an external DC power for driving the load device by the AC power like this case, terminals 27 and 28 for a jumper are provided on the IC substrate 3. The terminals 27 and 28 permit power to be supplied from the external power source when the power supply lines in the IC substrate are disconnected from the inner power supply circuit unit 9. Usually, terminals 27 and 28 are short-circuited by the jumper to use the power from the power supply circuit unit 9. On the other hand, in the case where power is to be supplied form the external power source, the jumper is removed to connect the terminal 27 with the external DC power source. In this case, the output driver 14 in the output circuit unit 8 is not used but the output from the integrating circuit 12 is used as a driving signal as it is.
Further, for the detection switch 1 to operate in low power consumption, the start-up speed of the switch 1 becomes low. The power supply resetting circuit 17 is not operable during the case, then a timer circuit is required to be separately attached to the above external constant power source in order to realize a long power supply resetting time.
The display lamp 5 which indicates the detection state or the operating state in response to the lighting signal is located at a position where it can be seen from the exterior of the detection switch 1. The display lamp 5 may be a light-emitting diode, a neon tube, an incandescent lamp, or the like.
The display manner of the display lamp 5, i.e. ON or OFF according to the detection signal, and indication according to the driving signal should be suitably selected in accordance with the purpose of using the detection switch 1 and the respective properties of the object to be detected and the load device. The display lamp which flashes on and off in accordance with the detecting signal is useful to monitor the presence of the object to be detected. The display lamp which flashes on and off in accordance with the driving signal is useful to monitor ON/OFF of the output circuit. For example, it is assumed that objects on a conveyer are classified using a photo-optical switch. In this case, in a system of detecting the object in terms of the light reflected from the object, as shown in FIG. 4, when the detector 4 receives the light reflected from the object, the detection circuit 7 generates a judgment signal and the output circuit unit 8 generates a driving signal based on the judgment signal. The detection signal and the driving signal are generated with the same timing so that the display lamp 5 displays both detection signal and driving signal. On the other hand, in a system of generating a detection signal when incident light is shaded by the object to be detected from the object, as shown in FIG. 5, the detection circuit 7 generates a judgment signal when the incident light on the detector 4 is shaded by the object to be detected, and the output circuit unit 8 generates a driving signal according to the judgment signal. The display lamp 5 displays either of the detection signal and the driving signal which are in an opposite phase to each other. Furthermore, in the case of using a sequencer with a low speed response time, as shown in FIG. 6, a suitable delay may inevitably be provided between the detection signal and the output signal.
The detection switch will be fabricated in accordance with individual purposes. If the type of the detection switch is one designed individually for a selected object to be monitored, a detection switch adaptive to monitor one object cannot be easily changed to one for another object. The detection switch has many applications under the various conditions of application and so must be changed in its design in accordance with the display manners as required.
The delay circuit 6 serves to delay the output signal from the detection switch 1 in order to cause the high speed response of the detector 4 to coincide with the low speed response in a drived device like a program controller, etc. The delay circuit 6 receives the judgment signal from the detection circuit unit 7 through a terminal 25 and sends a delayed judgment signal delayed within the circuit to the output circuit unit 8 through a terminal 26. Incidentally, if the terminal 25 and the terminal 26 are short-circuited by a jumper, the judgment signal relative to the object to be detected can be directly supplied to the output circuit unit 8. If the switch 1 is used with a driving device having a signal amplifying function, the output from the integrating circuit 12 can be directly used as a driving signal by connecting the terminal 25 with the driving device.
One concrete example of the delay circuit 6 is shown in FIG. 7. If the input side terminal 31 and output side terminal 32 in the delay circuit 6 in FIG. 7 are connected with the terminals 25 and 26 in FIG. 1, respectively, the detection switch 1 may have an off delay function. A resistor R1 and a capacitor C1 of the delay circuit (6) are used to set the off delay time. Resistors R3, R4 and R5 are used to provide a comparator 33 with hysteresis. Thus, chattering of the detection switch 1 can be prevented. Although the delay circuit 6 is incorporated within the detection switch 1, it is difficult to incorporate the delay circuit in the IC substrate 3 because the components such as capacitors required for the circuit arrangement are bulky. Also, it is not preferable to incorporate the delay circuit in the IC substrate for the convenience in design of setting different delay times. For these reasons, it is desired to attach the delay circuit outside the IC substrate 3.
Meanwhile, the detection switch described above is desired to be compact and inexpensive, and also the demand for supply of such a detection switch by mass-production is very great. However, the prior art requires components externally attached at various positions in order to assure the versatility in design so that the structure of the entire detection switch is made complicated and large scaled, therefore it was difficult to reduce the production cost.
In order to restrain the production cost, it is desired to integrate as many components as possible on an IC substrate. Therefore, it is preferable that a bulky component such as a reactance element is not used in the circuit and also no component is externally provided. However, the detection switch satisfying such conditions lost its essential switch function, or was burdened with many detection conditions. As a result, in many cases, the product value of the detection switch was lost.

Circuit for driving a load by using selectively one of two different DC power sources


An insulator for a subsurface signal transmitting apparatus. The insulator includes a housing, a mandrel axially disposed inside the housing, a first insulating material disposed between the housing and the mandrel, a first sleeve formed of a second insulating material disposed between the housing and a first tubular member and the first tubular member coupled to the mandrel.

In the oil industry, it is necessary to obtain and analyze down-hole conditions, such as pressures and temperatures at various elevations. This has been done most commonly in the past by lowering electrically or mechanically operated gauge devices into the well, these gauges being either suspended on a wire line or fastened to available oil well tubular sections. By utilizing conductor wire lines, the information can be transmitted to the surface on a "real-time" bases. When non-conductor lines are employed, the gauge must be withdrawn to the surface so that the data can be either down-loaded to a plotter or read directly from an internally scribed chart, thus providing the operator with the desired information. In this process, whether the wire line is used as a suspension member or is strapped to the outside of tubular sections forming a string in the bore hole, damaging of the wire line is not uncommon. The damage or destruction of the wire line can occur when the string of tubular sections sticks within the bore hole, or when the wire line and/or tubing string is being run in or out of the hole. Not only is there the cost of the lost equipment, but such damage adds significantly to the cost of the operation because of the time involved in repairing the equipment and in fishing the equipment from the hole. The process of having to fish also includes the risk of endangering the well itself.
Other techniques have been developed for transmitting signals which are produced by apparatus located down-hole to the surface, including devices which develop and transmit signals electromagnetically to the surface. Such signals having been received by a receiving apparatus provide instantaneously information on the conditions sensed down-hole. This telemetry technique involves locating down-hole relatively complex equipment and providing a source of power. Structures have been developed for containing such equipment and power source. These structures enable the use of a portion of the tubing string to function as an antenna in the transmission of the signals to the surface. The process of using the tubing string, such as the upper portion of the string, as the antenna involves the provision of a connection which electrically isolates the upper portion from a lower portion of the tubing string so that the output voltage of the down-hole electromagnetic transmitters can be connected across terminals which are electrically isolated from each other.
The approach of using a telemetry technique for transmitting the information to the surface provides instantaneous readings at a set location of the down-hole sensing equipment and also avoids the use of a wire line. While having significant advantages over other techniques, problems due to the conditions which exist in the bore hole have in many respects hindered successful development in this process. For example, although there exists insulation couplers for use in an arrangement where the upper portion of the tubing is used as an antenna, such couplers have not always functioned satisfactory when the lower portion of the tubular string becomes jammed in the bore hole. This is not uncommon particularly where the lower part of the bore hole deviates from the vertical. Present insulation couplers have not been known to withstand the application of a high torque used in attempting to force the string when jammed, and a severing of the tubing string at the insulation connector results in the lower portion of the tubular string, which houses the expensive telemetry sensing and telemetry equipment, becoming completely disconnected at its down-hole position. Not only is the cost of the equipment involved, but there is the expense involved in reopening the hole and potential damage to the well.
Moreover, due to the nature of the sensing, power source and transmitting equipment utilized in the telemetry process and the extreme conditions to which th down-hole end of the tubing string is subjected, known methods of mounting such equipment has not always proved satisfactory. While the equipment must be protected, the manner in which it is carried and its connection to the insulation connector must be such that it is readily available for exchanging and servicing.
Yet another characteristic of some known structures incorporating an insulation coupler is that they are not capable of coping with particular conditions which can develope either above or below the test equipment when located down-hole. The down-hole test equipment is frequently used in conjunction with annular sealing packers, and in the known structures the insulation connector and/or the test equipment and mounting elements, together with the sealing packers in effect form a complete seal or blockage in the bore hole. Accordingly, in the event a pressure build-up develops either above or below the sealing packers, the tubing string can be sucked into or blown out of the bore hole. This can happen with sufficient force to cause severe injury to personnel and damage to equipment.

This patent is subject to a terminal disclaimer.

Subsurface signal transmitting apparatus


A vacuum micropump for use in a sealed package includes at least one pumping cell and a magnetic field proximate to the pumping cell. The pumping cell has at least one anode, at least one dielectric in contact with the at least one anode, at least one titanium cathode in contact with the dielectric and an electric field between the at least one anode and the at least one cathode. The dielectric defines a space between the at least one anode and the at least one cathode. The vacuum micropump may be used to gauge pressure within the sealed package. An appropriate method of use is also provided.

In micro-electromechanical systems (MEMS) (e.g., atomic resolution storage devices, vacuum microelectronic devices, miniature x-ray sources, and other such), it is desirable to hermetically encapsulate devices within a near vacuum. Micro-optical electromechanical systems (MOEMS) require a vacuum for reliable operation. Typically, the operational life of a device is reduced when the vacuum is not maintained. Thus, it is desirable to maintain the vacuum within the device.
Semiconductor, other electronic and mechanic devices, such as MEMS, MOEMS and other similar devices, are often hermetically encapsulated as a package in such a way as to provide a near vacuum within the device. Although these packages are hermetically sealed, outgassing (release of gasses from a solid as a result of heating or reduced pressure) from a number of sources within the package releases moisture and gasses that decrease the operational life of the encapsulated devices by reducing the internal vacuum. Encapsulated packages also allow gasses to diffuse through their encapsulation materials and/or may have micro-leaks that, over time, allow gases to enter the encapsulation.
One solution to this problem is to include a getter material that absorbs and traps any outgased substances. For example, MOEMS devices often include getters that selectively attract undesirable substances within the hermetic encapsulation, thereby prolonging the operational life of the device.
Evaporated getters and activated getters are typically based on barium (Ba), titanium (Ti), zirconium (Zr), vanadium (V), iron (Fe) and aluminum (Al) alloys that react with gas molecules to trap them. Typically, such getters require high outgassing and activating temperatures. More specifically, a getter may require heating (typically=400° C.) using a certain heating method for a certain period of time under a near vacuum to achieve optimum activation. Evaporated deters are typically used due to their simplicity. They are sputtered after sealing and generally require a lot of mirror surfaces for the gas absorption. In addition, they may leak out, diffuse into the device or in other ways fail to perform as expected. For small package environments, especially micro-package environments, evaporated getters are usually inappropriate. Activated getters are typically must valuable when used for small vacuum shells.
Typically, the vacuum must be maintained during the cooling off period of the getter, prior to sealing the encapsulation. Additionally, some getter types have a certain operating temperature, and may thus require additional heating during operation in order to be affective. This temperature activation, particularly during operation, causes additional stress to the encapsulated device, and is inappropriate for small volumes desired to be at a near vacuum. Further, once activated, getter materials have a limited life, absorbing only limited amounts of gasses chemically active gasses such as O2, H2O, CO, CO2, and etc.
In one example, a micro-resonator device requires a controlled, low-pressure or vacuum environment for high Q factor operation (Q factor is a measure of the "quality" of a resonant system and is defined as the resonant frequency divided by the bandwidth). A typical mass for a very high frequency (VHF) micro-resonator is approximately 10−13 kilograms, and thus small amounts of mass-loading (e.g., from gas molecules) cause significant resonance frequency shifts and induce phase noise. It is thus desirable to maintain and measure gas pressure within the micro-resonator's environment to ensure correct operation. There is currently no method of measuring pressure in volumes less than 0.5 cm3.
Ion pumps are typically used to create a near vacuum and operate by ionizing gas within a magnetically confined, cold cathode discharge. Electrons, produced by the cold cathode discharge, are entrapped within a magnetic field and collide with gas molecules to form ions. Typically, the cathode of an ion pump is comprised of titanium. These ions are accelerated towards a titanium cathode, where they sputter titanium. The sputtered titanium chemically reacts with, and traps, active gasses, and the sputtered titanium buries other noble gasses on impact with the pump walls.
For example, an ion pump may be used to create a vacuum during getter activation prior to device encapsulation, where the entire encapsulation process is being performed within the vacuum.
To increase the longevity and operational life expectancy of a vacuum-dependent device, it is desirable to provide continued evacuation after original encapsulation. In addition, a measurement of internal pressure may be used to predict operational performance.
As stated above, although the encapsulated environment is initially created with a vacuum, the vacuum typically degrades with time. It is generally impractical to re-evacuate the package environment by performing a re-encapsulation or by connecting the package to an external vacuum pump.
Hence, there is a need for a vacuum micropump and gauge that overcomes one or more of the drawbacks identified above.

Hewlett-Packard Development Company, L.P.


Provided are tape feeding and recovering modules for a tape feeder, and a tape feeder including the tape feeding module and the recovering module. The tape feeding module feeds a tape storing a plurality of electronic components in a predetermined pitch by driving a sprocket which inserts its teeth into the tape. And the recovering module exposes the plurality of electrical components by removing a top cover from a top surface of the tape and discharges the top cover from the tape feeder.

1. Field of the Invention
The present invention relates to tape feeding and recovering modules for use in a tape feeder of an electronic component mounting apparatus, and a tape feeder including the tape feeding and recovering modules.
2. Description of the Related Art
Electronic component mounting apparatuses automatically mount electronic components on a circuit substrate. Electronic component mounting apparatuses carry out a series of mounting operations by picking up electronic components from a component supplying unit, moving the electronic components above a circuit substrate and mounting the electronic components on top of the circuit substrate. The component supplying unit includes a plurality of tape feeders mounted on a feeder base at predetermined intervals. As is known in the surface mount technology (SMT) art, such tape feeders remove a top cover from a tape that stores electronic components (e.g., integrated circuit chips), thereby allowing a mounting head (e.g., a vacuum nozzle) to pick up the exposed electronic components from the tape and deposit the picked-up electronic components on a circuit substrate (e.g., PCB).
FIG. 1 is a view of a tape feeder disclosed in Korean Patent Laid-Open No. 2004-35396. The tape feeder includes a frame 10, a tape transporter 50 that is mounted on one part of the frame 10, a top cover recovering element 70 that is mounted on another part of the frame 10, and a power element 80 that provides power to the tape transporter 50 and the top cover recovering element 70. As shown in FIG. 1, the tape transporter 50 drives a sprocket 30 that feeds a tape 1 to a location where an electronic component 4 is to be picked up (i.e., a location proximate a mounting head 200). Further, the top cover recovering element 70 drives a first recovering gear 61 to output a top cover 3, which is removed from the top surface of the tape 1.
Transporting holes (i.e., where teeth of the sprocket 30 are inserted) are formed on both of the right and left sides of the tape 1. The tape transporter 50 drives the sprocket 30 to transport the tape 1 to the location where an electronic component 4 on the tape 1 (e.g., in a pocket of the tape 1) is to be picked up via a mounting head 200. The tape transporter 50 includes a feeding worm wheel 51 fixed to the sprocket 30 and a feeding power transmitter 52 having a feeding worm gear 52a formed on one end thereof. The feeding worm gear 52a is meshed with the feeding worm wheel 51 to turn the sprocket 30. A first driving gear 52b meshed with a power gear of the power element 80 is formed on the opposite end of the feeding power transmitter 52. That is, feeding worm gear 52a and first driving gear 52b are disposed on opposing ends of the feeding power transmitter 52.
The top cover 3, which is attached to the top surface of the tape 1, is peeled from the tape 1 via the first recovering gear 61 and a second recovering gear 62 before the electronic component 4 reaches the pickup location. The top cover 3 is held between the first and second recovering gears 61, 62, which are formed on another part of the frame 10 distal from the tape transporter 50, so that the top cover 3 is discharged from the tape feeder by rotating the first and second recovering gears 61, 62. As can be appreciated from FIG. 1, the tape 1 is fed from a storage location (not shown) and moved first upwards and counterclockwise toward a shutter 20 by the tape transporter 50 driving sprocket 30 such that as the tape 1 moves along the shutter 20 the top cover 3 is separated from the tape 1 (e.g., by a direction conversion slot or the like) and fed away from the pick up location via the recovering element 70 and recovering gears 61, 62. Thus, the electronic components 4 stored on the tape 1 are transported to the pickup location with the top cover 3 removed from the tape 1 and are picked up at the pickup location by the mounting head 200. The first recovering gear 61 receives power from first and second recovering power transmitters 71 and 72 that are coupled to each other. In more detail, a second driving gear 71a that is coupled with a power gear of the power element 80 through a first driving gear 52b is formed on one end of the first recovering power transmitter 71, and a second worm gear 71b that is coupled with the second recovering power transmitter 72 is formed on the opposite end of the first recovering power transmitter 71. The second recovering power transmitter 72 includes a worm wheel 72a that is meshed with the worm gear 71b and an intermediary gear 72b to which the worm wheel 72a is fixed. Thus, in response to the worm gear 71b and worm wheel 72a, the intermediary gear 72b drives the first receiving gear 61. As shown, the tape feeder further includes a rotation speed detector 90 mounted on the same axis as the feeding power transmitter 52 to detect the rotation speed of the power element 80. The tape feeder also includes a shutter 20 that exposes one of the electronic components 4, thereby allowing the mounting head 200 to picks up the electronic component 4.
However, since the conventional tape feeder has a complex driving mechanism as described-above, designing and manufacturing a tape feeder is difficult. Particularly, by having a tape feeder structure in which a plurality of components are assembled, individually mounted on a frame, aligned and tested, the number of manhours required to assemble the tape feeder is great thereby increasing the cost of the finished tape feeder.
The width of a tape supplied to a tape feeder varies according to the type of electronic components stored on the tape. Therefore, a tape feeder needs to be selected according to the width of the tape to be fed. However, in conventional tape feeders, components are manufactured with different specifications according to the widths of the tape feeders even if the functions of the components do no change from tape feeder to tape feeder, and the arrangements of the components are also different according to the type of the tape feeders. This results in an increase in the number of types of components that are used in the tape feeders, and causes a waste of resources and manhours.
Moreover, since the conventional tape feeder is assembled from a plurality of interconnected components, man-hours and costs required for the maintenance and repair of the tape feeder are increased. For example, one can appreciate that it may be easier or more efficient to replace the entire tape feeder instead of repairing it since the tape transporter 50 and the top cover recovering element 70 are coupled together and commonly driven by the power source 80. Also, when repair of the tape feeder is delayed, the efficiency of the SMT operation is decreased.
Therefore, in view of the foregoing, a tape feeder wherein the tape transporter and the recovering element are modular would be desirable.

Tape feeder and tape feeding and recovering modules therefor


A bicycle power generation device includes a seat tube unit to which a power generation unit is connected. Two rails are clamped between a press plate and a top plate. The top plate has a pressing face in which a recess is defined. A bottom plate has a contact face located corresponding to the pressing face. A protrusion protrudes from the contact face and is located corresponding to the recess. The power generation unit has at least one power generation plate and an output member. The at least one power generation plate is located on the contact face of the bottom plate and electrically connected to the output member. The vibration from the seat activates at least one power generation plate to generate electric power.

1. Fields of the Invention
The present invention relates to a power generation device, and more particularly, to a power generation device installed to the seat tube unit.
2. Descriptions of Related Art
There more electronic devices are equipped to bicycles to provide safety and more information to the riders, such as headlight, turn lights, or even cardinal information. These electronic devices are powered by electric power, and generally, the power is supplied by a battery pack which can be installed to the bicycle frames. However, the conventional battery packs contaminate environment when they are discarded. Although some battery packs are chargeable, the riders difficult to find proper electric power source to charge the battery packs. The chargeable battery packs cannot last for a long period of time.
The present invention intends to provide a bicycle power generation device to eliminate the shortcomings mentioned above.


Core rods or other glass components associated with optical fiber preforms are cleaned by loading them into a number of first sleeves, and partially obstructing entrance and exit ends of the sleeves to retain the components. The sleeves are contained inside a second sleeve so that the entrance ends of the first sleeves face an entrance end of the second sleeve. A fluid delivery system supplies cleaning fluids to the entrance end of the second sleeve, so that the fluids enter the first sleeves and contact exposed surfaces of the loaded components. The fluids leave the exit ends of the first sleeves and purge from an exit end of the second sleeve. Separators may be placed between the components in the first sleeves to enhance cleaning action and to cushion adjacent end faces of the components. Cleaned components may be unloaded from the first sleeves without risk of contamination.

1. Field of the Invention
This invention concerns the production of glass preforms for optical fibers, particularly preforms of the rod-in-tube (RIT) variety.
2. Discussion of the Known Art
Initial stages of RIT fiber preform manufacture include inserting one or more core rods axially inside of a glass overclad tube. Typically, a core rod has a handle extending from one end so that it can be transported manually without risk of contaminating the rod's core material. The rod handle may also be used for product identification and tracking purposes.
In conventional RIT processes, a single core rod is inserted in an axial passage in the overclad tube with the aid of the rod's attached handle. A sacrificial glass spacer may also be inserted to fill the entire length of the axial passage in the tube. The handle remains attached to the core rod until a final overcladding process step, at which time the handle is removed.
It is also known to use multiple core rods by welding them end to end to form a continuous length of core material. This is a costly additional step, however, and may have a negative effect on the quality of fiber drawn from the preform at locations corresponding to the welds, due to an added hydroxyl (OH) concentration induced by the weld heat source.
Process improvements such as placing multiple core rods inside a single overclad tube or the use of a mechanical assembly, require that the handle of the core rod be removed before inserting the core material of the rod inside one or more overclad tubes. For additional cost reduction and to maintain zero water peak quality in optical fibers such as, for example, AllWave® fibers available from OFS Fitel USA, the core rods must be deeply etched with HF acid to remove residual surface water from the VAD process before the rods are inserted in an overclad tube.
A technique that allows core rods without handles to be cleaned, etched, and inserted in an overclad tube without having to contact the rod material directly by hand, is disclosed in co-pending U.S. patent application Ser. No. 11/088,076 filed Mar. 23, 2005, entitled "Optical Fiber Preform with Overclad Tubes" and assigned to the assignee of the present application. In the disclosed technique, a glass spacer, a number of core rod segments, and a tube plug are loaded into an elongated tubular holder or sleeve. Plastics ball spacers are disposed between confronting end faces of the segments, between the glass spacer and an uppermost rod segment, and between the plug and a lowermost rod segment. The technique allows the glass spacer, the rod segments and the tube plug to be washed clean by flowing an acid solution between open front and rear ends of the tubular holder, followed by a rinse with deionized water. Once cleaned, an open front end of the holder is aligned with the axial passage in an overclad tube, and the core rod segments are urged successively into the tube passage by inserting a push rod through the open rear end of the holder.
A procedure that enables many core rods (or rod segments) to be cleaned simultaneously while loaded in multiple holders, would therefore significantly reduce the time and cost required to manufacture RIT preforms in volume.

Method of preparing core rods for optical fiber preforms


A substrate transfer apparatus 100 includes a substrate transport means 4 having a transport base 5 and a plurality of retention arms 41a-41e for retaining substrates W, an optical sensor 62 that is used to define a horizontal optical axis L, an elevator means 52 for moving the transport base 5 up and down, and a height detection means 54 for detecting the height of the transport base 5 relative to the optical axis L. In accordance with a light-reception/no-light-reception detection result fed from the optical sensor 62 and the height of the transport base 5, a judgment means 72a of a control section 7 judges whether the postures of the retention arms 41a-41e relative to the horizontal plane are normal. When the judgment means 72a judges that the postures of the retention arms 41a-41e relative to the horizontal plane are abnormal, the control section 7 exercises control to stop the substrate transport means 4.

1. Field of the Invention
The present invention relates to a substrate transfer apparatus that is capable of properly preventing a retention arm from coming into contact with a substrate when the retention arm removes the substrate from a holder, which holds a plurality of semiconductor wafers or other substrates in a shelf form. The present invention also relates to a substrate transfer method and a storage medium for use with the substrate transfer method.
2. Description of the Related Art
A thermal treatment apparatus is used as a part of semiconductor manufacturing equipment to provide batch thermal treatment for a large number of semiconductor wafers (hereinafter referred to as "wafers"). As shown, for instance, in FIG. 16, the thermal treatment apparatus has a loading/unloading area Sa, which is used when a carrier 10 containing a plurality of wafers 1 is loaded from or unloaded to the outside. An automatic transport robot or operator loads the carrier 10 into the loading/unloading area Sa. A transfer apparatus 11 then transfers the wafers 1 in the carrier 10 to a wafer boat 12, which retains a large number of wafers 1 in a shelf form, and loads the wafer boat 12 into a thermal treatment furnace (not shown). A predetermined thermal treatment is then simultaneously provided for a large number of wafers 1.
The transfer apparatus 11 includes a base 14, which freely moves up and down, rotates around a substantially vertical axis, and moves in a substantially horizontal direction, and a plurality of forks 13, which freely move forward and backward along the base 14 and retain a large number of wafers 1 (e.g., five wafers 1). For example, five forks 13 simultaneously transport five wafers 1 between the carrier 10 and wafer boat 12 for transfer purposes. In this instance, the rim of each wafer 1 in the carrier 10 or wafer boat 12 is retained by a retainer (not shown) while a predetermined clearance is provided between the upper and lower neighboring wafers. Each of the five forks 13 is then inserted into a space beneath a wafer 1 retained by the carrier 10 or wafer boat 12. Next, each fork 13 is raised to lift the wafer 1 off the retainer to place the wafer 1 on each fork 13. Each fork 13 is then retracted to move the wafer 1 away from the carrier 10 or wafer boat 12. Subsequently, the transfer apparatus 11 transports the wafer 1 to its transfer destination.
The base end of each fork 13 is screwed down on an advance/retraction section 15. However, if, for instance, a fork 13 has been used for a long period of time or is improperly screwed down, it may look like the fourth fork 13 from the top (see FIG. 17). More specifically, the fork 13 may not be parallel to the horizontal plane or may become warped so that the leading end of the fork 13 is displaced upward or downward from its reference position.
The distance between the wafers 1 placed in the carrier 10 or wafer boat 12 is approximately 6 mm to 12 mm. Therefore, if the leading end of a fork 13 is inclined upward or downward as described above, a wafer 1 comes into contact with the fork 13 when the wafer 1 is received from the carrier 10 or wafer boat 12. Consequently, the surface of the wafer 1 may be scratched or abraded due to the contact with the fork 13. This may lead to the generation of particles.
Under the above circumstances, the wafers 1 are subjected to a surface defect inspection in which the surface of a wafer is checked, for instance, for damage or particle attachment. However, a conventional inspection apparatus for checking wafers 1 for surface defects is installed in an area apart from the thermal treatment furnace. Therefore, the wafers 1 are subjected to a predetermined thermal treatment and transported back into the carrier 10. The carrier 10 is then transported to the inspection apparatus to inspect target wafers in the carrier 10 in a predetermined manner.
If any particle, damage, or other defect is found on the surface of a wafer 1 in the above inspection process, the thermal treatment apparatus is brought to an emergency stop. The next step is performed to check whether the encountered defect is caused by the contact between a fork 13 and wafer, which is a result of upward/downward inclination of the fork 13. If so, appropriate maintenance tasks are performed, for instance, to adjust the position of the fork 13.
However, even if any surface defect is found in a situation where wafers 1 are inspected as described above after thermal treatment, the thermal treatment furnace performs a process not only on an already inspected wafer lot but also on the next wafer lot. Therefore, even if appropriate maintenance tasks are performed, for instance, to adjust the position of a fork 13 with the thermal treatment apparatus brought to an emergency stop, surface defects may be found on a large number of previously processed wafers to decrease the yield. Further, if any maintenance is performed on the fork 13 with the thermal treatment apparatus brought to an emergency stop, the apparatus cannot be operated during a period of time required for maintenance. This reduces equipment availability, thereby causing a decrease in productivity.
In recent years, the intervals at which the wafers on the wafer boat 12 are positioned tend to decrease in order to increase the number of wafers to be processed per batch with a view toward processing efficiency enhancement. In addition, the wafers tend to further increase in diameter. This increases the distance between the base end and leading end of a fork 13. Thus, it is anticipated that the inclination of the fork 13 from the horizontal plane may increase. As a result, the aforementioned problem has become evident.
As such being the case, the inventors of the present invention have conducted studies to work out a method of inspecting a fork 13 for up-down inclination before receiving a wafer 1 from the carrier 10, adjusting the position of the fork 13 to control the contact between the fork 13 and the wafer 1 in the carrier 10, and preventing the surface of the wafer 1 from being damaged. A technology for detecting the up-down inclination of a fork is proposed in JP-A-2005-51171.
The technology proposed in JP-A-2005-51171 is such that an optical sensor is mounted on a lower wall of a load lock chamber to measure the vertical distance to a blade of a wafer transport robot and measure the forward sag of the blade. However, the configuration disclosed in JP-A-2005-51171 can measure only one fork because the optical axis of the optical sensor is formed in vertical direction. Therefore, when, for instance, the employed transfer apparatus advances or retracts five forks simultaneously, the configuration disclosed in JP-A-2005-51171 cannot solve the aforementioned problem because it cannot inspect each fork for up-down inclination.
Meanwhile, the technology proposed in JP-A-2000-124290 detects the positional displacement of a wafer in a wafer cassette with a reflective photosensor and controls a robot hand in accordance with a value detected by the photosensor to prevent the robot hand from coming into contact with a wafer in the wafer cassette. However, this technology relates to the positional displacement of a wafer in a wafer cassette, and does not solve the aforementioned problem because it does not inspect a fork for up-down inclination before receiving a wafer from a carrier and adjust the position of the fork.

Substrate transfer apparatus, substrate transfer method, and storage medium


A test socket comprises a test socket body with a central opening configured to receive a device under test (DUT) including at least one arm opening in the test socket body; and at least one rotating arm disposed in the arm opening.

Electrical testing of semiconductor die has become an integral part of the semiconductor manufacturing process. Semiconductor die may be tested during various stages of manufacturing, for instance prior to plastic assembly, and just prior to shipment to customers. One goal of this testing is to identify defective parts before they are shipped to customers. However, falsely identifying good parts as defective parts can be very costly for the semiconductor manufacturer. Consequently, the reliability and accuracy of the equipment associated with the testing process is very important.
For electrical testing, the semiconductor packages are typically loaded into a test socket by a handler. The test socket and handler align the package so that electrical contacts on the package can be connected to a test board using electrical conductors such as pogo pins. The pogo pins are maintained in fixed positions in the plane of the test socket, but are capable of compressing perpendicular to the plane of the test socket to allow good contact with the electrical contacts of the semiconductor package. However, since the pogo pins can't move horizontally, the alignment of the semiconductor package with the pogo pins is critical. Conventional test sockets have a central cutout into which the semiconductor package fits. This cutout aligns the package along its edges, but can allow for some misalignment when the package dimensions are slightly smaller than expected. This misalignment can lead to bad contact (open connections) between the pogo pins and the electrical contacts on the package. A test socket that aligns the package using the corners of the package would therefore provide for more precise alignment and prevent open connections due to package misalignment.
In recent years, advancements in circuit design and semiconductor manufacturing have drastically reduced the size of semiconductor packages. As an example, chip-scale packages are commonly manufactured where the size of the overall package is approximately the same size as the semiconductor die. The decreasing size of the semiconductor packages means that the electrical contacts of the smaller packages are spaced closer together and in some cases are smaller. This presents challenges for the testing process because the testing equipment must be able to reliably contact all of the electrical contacts of the semiconductor package.
The semiconductor packages are typically manufactured in groups (either in wafer form or on substrate strips) and then singulated. As the packages become smaller, slight variations in the singulation process can lead to significant differences in final package dimensions. These slight variations in the singulation process may be caused by the type of singulation blade used, the amount of wear the blade has, and alignment tolerances of the singulation equipment. The variation in package dimensions can lead to misalignment in the test socket, as described above.
When combined together, the small package size, the tightly-packed electrical contacts, and the package dimension variation can lead to significant problems in the testing process. These problems can lead to good packages being falsely identified as failing the electrical tests, which can cause significant losses to the semiconductor manufacturer. Consequently, a test socket that is capable of precisely aligning small semiconductor packages, despite variations in package dimensions, is desired.
The invention addresses these and other disadvantages of the conventional art.


The present invention relates to an apparatus for use in an assay comprising: (a) at least one first receptacle comprising a fluid inlet and a fluid outlet, (b) a porous membrane, and (c) at least one analyte-specific binding agent, characterised in that said at least one analyte-specific binding agent is immobilised on the underside of said porous membrane relative to the fluid inlet; and to methods of performing said assay.

Numerous apparatus and methods for use in detecting and/or quantifying the presence of analytes in a sample have been developed. Such tests can be used, for example, to define the exact composition of a sample (qualitative assay) or to determine the precise amount or concentration of any given analyte in that sample (quantitative assay). Practical applications of such tests include environmental monitoring, medical research and analysis.
Common methods in the field of medical research and analysis include polypeptide and polynucleotide assays.
Examples of polypeptide assays include immunoassays, ELISA and Western blotting, all of which are based on the principle of antibody/antigen interaction. Immunoassays, for example, are usually carried out in multi-well plates. However, using such apparatus means that only a single analyte can be tested in each well. Assays for testing large numbers of compounds simultaneously have been developed. However, to date, these have mostly been limited to polynucleotide assays.
Polynucleotide assays, which are based on hybridisation between complementary nucleic acid sequences, include Northern and Southern blots, PCR and, more recently, micro-arrays. While micro-arrays allow up to several thousand compounds to be tested simultaneously, they have the disadvantage of generally requiring all analytes to be tested against a single sample.
Current polypeptide and polynucleotide assays are therefore restrictive in terms of the actual number of individual binding assays that can be performed at any one time. In addition, current methods are often not capable of detecting small amounts of a test substance. The most recognised explanation for this is the problem of background staining whereby irrelevant analytes bind non-specifically and particulate matter prevents analyte-specific binding and, after completion of an assay, often remains on the test surface thereby interfering with specific signalling and the clarity and reliability of any readouts.
There is therefore a need to develop improved methods for performing such assays. The present invention seeks to overcome at least some of the aforementioned problems, and seeks to provide an assay method, and apparatus for use therein, which is precise, reproducible, accurate, sensitive and specific.


A liquid crystal display (LCD) panel and inspection method thereof. The LCD panel includes a first substrate having a reflective material layer formed on a first side of the first substrate; a second substrate having a black matrix formed on a first side of the second substrate, the first side of the second substrate face on to the first side of the first substrate; and a liquid crystal layer sandwiched between the first substrate and the second substrate; wherein the second substrate has at least one inspection area allowing light to pass to the first side of the first substrate. The inspection method includes: passing light through the inspection area to the first side of the first substrate; and inspecting cell process parameters of the LCD panel through light reflected from the first side of the first substrate.

1. Field of the Invention
The present invention relates to a method for inspecting liquid crystal display (LCD) panels, and more particularly, to a method for inspecting the cell process of LCD panels.
2. Description of the Prior Art
Liquid crystal display (LCD) devices are widely employed in various applications such as portable information electronics (e.g., laptop computers and personal digital assistants), home consumer electronics (e.g., LCD TVs), aerospace apparatus, and medical electronic devices due to their merits of light weight, low power consumption, and no radiation.
An LCD panel is one of the most important components of the LCD device. The LCD panel typically comprises a color filter (CF) substrate, a thin-film transistor (TFT) substrate (or referred to as array substrate), and liquid crystal material layer sandwiched between the CF substrate and the TFT substrate.
Generally, the LCD fabrication process can be divided into three processes: an array process, a cell process, and a module assembly process. Briefly, the array process forms a TFT array on a glass substrate to produce a TFT substrate. The cell process bonds a CF substrate with the TFT substrate, and then fills liquid crystal material between the CF substrate and the TFT substrate to produce a panel module. The module assembly process combines the panel module with a backlight module, driving circuits, an outer case, and other components. In practice, the yield rates of the array process and the module assembly process are higher than that of the cell process, so that the cell process becomes a critical process of the LCD fabrication.
In the cell process, a conventional inspection method of the LCD panel is to emit a light from outside the TFT substrate to pass the TFT substrate and the LC layer so as to illuminate the CF substrate. Since the CF substrate has a black matrix (BM) formed with high reflectance metal material such as chromium (Cr), the incident light will be reflected back to the TFT substrate. Thus, in the cell process, an inspection apparatus (or an inspection staff) can observe the inside pattern of the LCD panel through the reflected light and inspect the associated parameters of the cell process such as the seal width, inhaled volume of UV-epoxy in the LC slit, etc.
In order to conform to environmental protection rules such as the European Commission Directive on Waste Electrical and Electronic Equipment (WEEE), the metal material of the black matrix formed on the CF substrate will be progressively replaced with organic materials such as resin. However, when the resin BM is adopted in the CF substrate, the aforementioned inspection method becomes unable to be put into practice. This is because the resin BM is low reflectance material and may absorb the incident light. Consequently, the inspection apparatus or staff has difficulty inspecting the inside pattern of the LCD panel through the reflected light so that it is unable to measure the associated parameters of the cell process.

Liquid crystal display device and inspection method thereof


The present invention is to provide a mask blank enabling fabrication of a photomask having a structure where electrostatic breakdown is effectively prevented. To accomplish the object, the invention discloses a mask blank comprising a mask substrate, an electrostatic breakdown prevention film fully covering one side of the mask substrate, and a shading film formed on the electrostatic breakdown prevention film. The electrostatic breakdown prevention film is made of titanium, tantalum, titanium compound or tantalum compound. The transparent rate of the electrostatic breakdown prevention film is not less than 75%, for the wavelength of light in an exposure. The sheet resistance of the electrostatic discharge prevention film is not more than 100KΩ/□.

The art of photolithography forming a fine pattern on a substrate is often utilized in manufacturing kinds of semiconductor devices and display devices. In photolithography, photoresist is coated on a substrate, which is hereinafter called "circuit substrate". The photoresist is exposed to light of a circuit pattern. Then the circuit pattern is transferred by carrying out development of the photoresist and etching through the developed photoresist.
The photomask as master piece has the structure where the circuit pattern is formed on a transparent substrate, hereinafter called "mask substrate" for discrimination from circuit substrates. Photomasks are fabricated from products called "mask blanks". A mask blank is fabricated by fully covering one side of a mask substrate with a shading film.
In photolithography, the problem of the photomask charge-up has been arising. Although the shading film, which may be chrome film or chrome compound film, in a photomask is conductive, the mask substrate is made of glass, i.e., dielectric, which can be easily charged up. Especially, when a photomask is used for so-called contact exposure, it can be charged up easily because it is contacted onto a circuit substrate. The charge up can happen when the photomask is detached from the circuit substrate after the exposure, i.e., so-called "contact-and-separation charge-up".
When too much static electricity is induced on a photomask, discharge, i.e., insulation breakdown, would take place by any cause. For example, the shading film pattern on the mask substrate may have a part of "island", that is, a part completely isolated from other parts. Potential at this island part could be much different form the other parts as result of that the photomask is charged up. When the potential difference is enlarged, a discharge may take place along the surface of the mask substrate. Otherwise, a discharge may take place between the mask substrate and an element located nearby or during maintenance.
One of problems caused by the photomask gaining charge is deformation of the shading film pattern. For example, the shading film pattern could be chipped off by impact of a discharge. Deformation of the pattern could cause decrease of the yield rate, because it is transferred to a circuit substrate.
A discharge by an excessive charge-up tends to take place at a keen part of a shading film (conductive film) pattern, e.g., right angle corner. Rounding the corner helps to prevent the discharge and could be the solution for this. However, such transformation (rounding) of the pattern is in many cases prohibited because it is the master fine pattern to be transferred to a circuit substrate.
As a structure preventing the photomask charge-up, it is considered that an ITO (indium tin oxide) film, which is the transparent conductive film, is formed on a mask substrate, and a shading film is patterned thereon. This structure is disclosed in JP2008-241921-A1. However, ITO films have only low tolerances against etchant liquids in patterning shading films. This brings the problem that an ITO film is made thinner through etching by the etchant. Otherwise, the tolerance against the cleaner liquid in a cleaning step could be questioned. When an ITO film is made thinner by chemicals, the sheet resistance thereof increases because of the volume reduction, and then could lose the required grounding function.


A battery holder includes restriction members protruded from a holding base plate in an axial direction of batteries to be located in spaces between the batteries. Each of the restriction members has: a tapered surface which is inclined to the axial direction and is in line contact with an outer periphery of the end face of the battery when the restriction member is inserted into the space, so as to apply a force to move the battery in a radial direction of the battery; and a support surface which supports a side face of the battery that is not in contact with the tapered surface, by surface contact. The support surface receives a moving force in the radial direction from the tapered surface and supports the side face of the battery by a reactive force.

1. Technical Field
The present invention relates to a battery device.
2. Related Art
A known configuration of a battery device having a battery holder to hold a plurality of batteries fills a potting resin between batteries for modularization (see JP 2012-28244A). Another known technique attaches elastic deformable members made of an elastic material to a frame body and holds edges of batteries by the elastic deformable members (see JP 2010-9798A).
The battery holder according to the disclosure of JP 2012-28244A, however, has problems that the operation of filling a resin between batteries is troublesome and reduces the productivity. In the battery holder according to the disclosure of JP 2010-9798A, on the other hand, a variation in dimension of the batteries and dimensions of the respective elastic deformable members affect other elastic deformable members via the batteries. This may apply a large force to part of the batteries and cause deformation or may fail to provide a sufficient force for holding part of the batteries.


A rod anchoring system including a bone anchor and a connector is provided. The connector of the rod anchoring system is configured to be inserted in one orientation and then transitioned to a second orientation to connect the rod to the anchor. The bone anchor includes a detachable extension shaft that acts as a guide for inserting the connector. In use, once the bone anchor has been implanted at a target site on a vertebra, the connector is placed onto the extension shaft and slid along its length in a first orientation to insert the connector. Once the connector is at the implant site, it is transitioned from the first orientation to the second orientation to connect the rod to the anchor.

Spinal fixation systems may be used in surgery to align, adjust and/or fix portions of a spinal column, i.e., vertebrae, in a desired spatial relationship relative to each other. Many spinal fixation systems employ a spinal rod for supporting the spine and for properly positioning components of the spine for various treatment purposes. Vertebral bone anchors, comprising pins, bolts, screws, and hooks, engage the vertebrae and connect the supporting spinal rod to different vertebrae. Spinal rods can be anchored to specific portions of the vertebra. Since each vertebra varies in shape and size, a variety of anchoring devices have been developed to facilitate engagement of a particular portion of the bone.
Pedicle screw assemblies, for example, have a shape and size that is configured to engage pedicle bone. Such screws typically include a threaded shank that is adapted to be threaded into a vertebra, and a head portion having a spinal fixation element-receiving portion, which, in spinal rod applications, is usually in the form of a U-shaped slot formed in the head portion for receiving the rod. A set-screw, plug, cap or similar type of closure mechanism is used to lock the rod into the rod-receiving portion of the pedicle screw.
In conventional spinal surgery, first, anchoring devices are attached to vertebra, then a spinal rod is aligned with the anchoring devices and secured. For example, for conventional pedicle screw assemblies, first the engagement portion of each pedicle screw is threaded into a vertebra. Once the pedicle screw assembly is properly positioned, a spinal fixation rod is seated in the rod-receiving portion of each pedicle screw head. The rod is locked into place by tightening a cap or similar type of closure mechanism to securely interconnect each pedicle screw to the fixation rod. This type of conventional spinal surgical technique usually involves making a surgical access opening in the back of the patient that is almost as long as the length of the spinal rod to be implanted. Because exact placement of the screw assemblies depends on a patient's particular bone structure and bone quality, the exact position of all screw assemblies cannot be known until after all the assemblies are positioned. Adjustments, such as bending, are made to the spinal rod to ensure that it aligns with each screw assembly.
Recently, the trend in spinal surgery has been moving toward providing minimally invasive surgical (MIS) devices and methods for implanting spinal fixation devices. An example of a minimally invasive method is a rod-first method that includes inserting a spinal rod through a first incision and positioning the spinal rod along a patient's spinal column adjacent to one or more vertebra. After the spinal rod is inserted, one or more bone anchors are inserted adjacent to the spinal rod, each through a separate incision. After a spinal bone anchor is inserted and anchored in bone it is connected to the spinal rod. The rod-first method is a minimally invasive technique in which the bone anchors are inserted adjacent to the rod, after rod insertion, then connected with the rod, as opposed to a conventional surgical technique in which the anchors are inserted first, then the rod is placed such that it lies over the anchors.
Thus there is a need to be able to insert bone anchors, and more particularly connectors for connecting the bone anchors to the rod using minimally invasive techniques. Accordingly, what is needed is a rod anchoring system that can be delivered percutaneously to an implant site though a small access port such as a cannula.

Method and system for securing a rod to a bone anchor with a connector