An electrical connector (60) includes a holder (40) for detachably holding modules (50a, 50b) fitted therein transversely to the axis of engagement with the holder/module subassembly pluggable into the connector (60) along such axis. Embodiments include holders (40) that latch through latching arms (48a, 48b) into connectors (60), holders (100) that are frictionally held interiorly within connectors (130) and holders (200) that have short latches (240) that latch to the connector (230) and modules (220a, 220b); all of the embodiments incorporating single row connector modules (50a, 50b-120a, 120b-220a, 220b) pluggable into connectors (60-130-230) holders (40-100-240), respectively.

To facilitate high volume production in harness making for connectors utilized with respect to consumer electronics it has proven to be advantageous to provide connectors having a single row of terminated contacts, such construction facilitating mass termination, mass loading and handling.
Japanese laid open UM Patent Application No. 106,688/'90, illustrated in part in FIG. 5 of this application shows an example of such prior art practice. One problem encountered with the use of connectors as described in the forgoing mentioned Japanese UM Patent Application is that loads applied to the connectors through wires caused by a variety of uses can result in the connectors becoming disengaged and being displaced from engagement with mating connectors on printed circuit boards and the like. Another problem has to do with the displacement of holders carrying modules with respect to the contacts of a printed circuit or the like.
Accordingly, an object of the present invention is to provide an improvement with respect to the prior art that features a connector housing that includes a holder carrying contact modules with surfaces arranged to latch and hold the modules to the holder and the holder to the housing in such a way as to preclude or minimize accidental displacement of elements to result in failure of connection. It is a further object to provide a single row connector module adapted to be fitted within a holder in turn plugged into a connector housing in such a way as to hold the various elements reliably together.


Plant glycogen is a polysaccharide derived from rice and contains a high molecular weight group whose weight average molecular weight is 5.00 to 7.60 million and a low molecular weight group whose weight average molecular weight is 0.30 to 1.10 million, the glycogen is a glucose polymer, being easily dissolved in cold water and hot water, and being rendered viscous at the time of degree of water addition of 25 to 200%. The process for producing plant glycogen, includes immersing finely ground rice in water or a water-containing solvent, subjecting it to solid-liquid separation to give an extract, heating it to remove thermally precipitated solids and proteins, adding the resulting liquid layer to an organic solvent, and recovering the resulting white precipitates, followed by purification, if necessary.

Conventionally, a large number of studies have been made of saccharides from cereals. Particularly with respect to starch, there are an overwhelming number of reports relating to its major components i.e., amylose and amylopectin after the epoch-making results of the study on starch made by K. H. Meyer in 1940. According to Jiro Nikuni ("Denpun Kagaku Handbook" (Starch Science Handbook), compiled by Jiro Nikuni and published in 1977 by Asakura Shoten K. K., Japan), starch manufacturing industry developed thereafter is also an industry which has been developed basically following their results.
Meanwhile, it has been revealed that a substance called glycogen, which is similar to starch amylopectin, is present in an animal body and serves as an important energy source, as described in a method for experiment on starch-related saccharides ("Seikagaku Jikkenho" (Experimental Method in Biochemistry), vol. 19, page 22, published in 1986 by Gakkai Shuppan Center, Japan). However, as is also reported by Nakamura Y. et al. (PHYSIOLOGIA PLANTARUM, 97, 491-498 (1996), Denmark), the presence of a plant glycogen-like substance is suggested by using special experimental products such as corn (unmatured seeds), corn starch mutant species (e.g. sugary species and amylose extender species), and rice starch mutant species (the same mutant species as above). However, the presence of such a substance for rice serving as a usual common food is not known so far, and as a matter of fact, the industrial application of such a substance has not been made.

Director General of Chugoku National Agricultural Experiment Station, Ministry of Agriculture, Forestry and Fisheries


A linear voltage regulator comprises a transistor for converting a supply voltage to an output voltage. By directly monitoring the supply voltage and thereby rapidly responding when the supply voltage suffers a ripple, the linear voltage regulator enhances the stability of the output voltage.

To convert a supply voltage Vin to an output voltage Vout, as shown in FIG. 1, a typical linear voltage regulator 10 comprises a transistor 16 coupled between the power input node Vin and the power output node Vout, and being controlled to regulate the output voltage Vout. In addition, a bypass capacitor C is coupled between the output Vref of a reference voltage generator 12 and ground GND to stabilize the reference voltage Vref, voltage divider resistors R1 and R2 coupled between the power output node Vout and ground GND divides the output voltage Vout to produce a feedback signal VFB, and an error amplifier 14 compares the feedback signal VFB with the reference voltage Vref to determine an error signal VEA which is coupled to the gate of the transistor 16 to adjust the channel width of the transistor 16. In this circuit configuration, the Power Supply Reject Ratio (PSRR) of the output voltage Vout is contributed from the PSRR of the reference voltage Vref and the PSRR of the error signal VEA. Particularly, in high frequency applications, ranged from several tens of KHz to hundreds of KHz, such as wireless communications, the output voltage Vout is required to be highly stable. Ideally, both the reference voltage Vref and the supply voltage Vin are constant, however, it is not the case actually. Ripple may occur on the reference voltage Vref, and thereby results in perturbation on the output voltage Vout. For this reason, it is a simple and common resolution to use the bypass capacitor C to reduce the ripple on the reference voltage Vref, to thereby improve the PSRR of the output voltage Vout. Not only the reference voltage Vref, the supply voltage Vin may also have a ripple, which would also cause a perturbation on the output voltage Vout. When the supply voltage Vin suffers a ripple, it causes the output voltage Vout varying, and this information will be reflected on the feedback voltage VFB. Through the error amplifier 14 feedback loop, the channel width of the transistor 16 will be adjusted to stable the output voltage Vout. When the bypass capacitor C is maximized, the total loop PSRR is still limited by the error amplifier 14 and transistor 16 feedback loop response. In addition, sensing the output response to improve the PSRR always lags since the output voltage Vout has already dropped or raised. Therefore, the linear voltage regulator 10 cannot respond rapidly to the input transient when the supply voltage Vin suffers a ripple. To solve this problem, conventionally, circuit designers focus on improving the response time of the error amplifier 14 or the feedback loop. However, no matter how fast the response time of the error amplifier 14 or the feedback loop is improved, it is still established through the feedback loop based on the output voltage Vout, and the linear voltage regulator 10 always responds after the output voltage Vout suffers the perturbation resulted from the ripple on the supply voltage Vin. More severely, altering the response time of the error amplifier 14 or the feedback loop may also change the original stability range and compensation of the linear voltage regulator 10.
Therefore, it is desired a linear voltage regulator which can eliminate the influence of the supply voltage ripple before it causes a perturbation on the output voltage.

High PSRR linear voltage regulator and control method thereof


A work station for an electrical discharge machining apparatus, including a first mechanism for retaining a workpiece in a predetermined position, at least one electrode for forming a feature on the workpiece, and a second mechanism for positioning the electrode in a manner that is movable into and out of engagement with a designated portion of the workpiece. A portion of the second mechanism is connected to the first mechanism so as to automatically align the electrode with the designated portion of the workpiece. The second mechanism is configured so that the electrode is electrically insulated from the workpiece.

The present invention relates generally to an apparatus and method for electrical discharge machining and, in particular, to an apparatus and method for electrical discharge machining which includes an improved work station that provides automatic alignment of the electrode to the workpiece.
Electrical discharge machining (EDM) is a well known process for forming features, such as holes, slots and notches of various shapes and configurations, in an electrically conductive workpiece. Conventional EDM apparatuses typically employ an electrode having the desired shape that is advanced toward the workpiece. A suitable power supply is applied to create an electrical potential between the workpiece and electrode for forming a controlled spark which melts and vaporizes the workpiece material to form the desired feature. The cutting pattern of the electrode is usually computer numerically controlled (CNC) whereby servomotors control the relative positions of the electrode and workpiece. During machining, the electrode and workpiece are immersed in a dielectric fluid, which provides insulation against premature spark discharge, cools the machined area, and flushes away the removed material.
One drawback to electrical discharge machining is that it is a relatively slow process, especially when several distinct features need to be machined into a workpiece. This is particularly so in the aircraft engine industry where electrical discharge machining is widely used for machining various features into aircraft engine parts. To increase the manufacturing output of such parts, it is common to use an EDM apparatus that machines a number of parts at one time. Such an apparatus has a plurality of work stations, each of which has a workpiece fixture located in a single dielectric tank. The work stations are all typically connected to a common power supply. Thus, machining takes place in series one part at a time. That is, a spark will be created in the first work station and then the next work station and so on until each station has a spark supplied. This sequence is repeated until the machining operation is completed for each workpiece.
A problem with this type of apparatus is that whenever one station gets hung up (i.e., fails to discharge for some reason such as electrode misalignment or a EDM particle remaining in the electrode-workpiece gap) all of the stations will become hung up. Since all stations are stopped, it is not evident which station is causing the stoppage. Furthermore, each station must use the same electrode material and polarity because of the series power connection. Thus, each station machines the same feature into the parts. Parts requiring additional features must then be moved to another machine. This means that multiple machines, fixtures and part handling are required before a part is completed Another inefficiency with these conventional EDM apparatuses is that the dielectric tank must be drained and refilled between each cycle to load and unload the parts because the workpiece fixtures are all located and submerged in the tank.
Various approaches to solving such problems are disclosed in U.S. Pat. No. 6,326,576 to Krenz et al., U.S. Pat. No. 6,369,343 to Krenz et al., and U.S. Pat. No. 6,563,071 to Krenz. While each EDM apparatus disclosed in such patents is useful for its intended purpose, it will be appreciated that the slide mechanism which houses the electrode is indirectly connected to a base supporting the workpiece. Accordingly, the slide mechanism moves along a plurality of ceramic rods into position with respect to a workpiece. In this way, the electrode is electrically insulated from the fixtures retaining the workpiece. Not only do such ceramic rods and its related components increase the bulkiness of the slide mechanism, this type of configuration also produces stack-up errors which require manual alignment of the electrode to each workpiece by the machine operator. This introduces a window of error if the electrode is incorrectly aligned, as well as a measure of inefficiency to the process.
Accordingly, it would be desirable for an electrical discharge machining apparatus to be developed which includes a work station which automatically aligns an electrode with a workpiece so as to form a desired feature. It would also be desirable for the work station of such EDM apparatus to be greatly reduced in size and complexity so that multiple features can more easily be formed in a workpiece.

Apparatus and method for electrical discharge machining


A postage sheet includes a face sheet adhesively bonded to a release liner. The face sheet includes a removable internet stamp having a diecut perimeter. A visible security indicium is disposed on the front side of the stamp and has a different color than the face sheet, and is not reproducible by photocopying.

The present invention relates generally to mailing services, and, more specifically, to postage therefor.
The United States Postal Service (USPS) requires suitable prepaid postage visibly attached to various forms of mailers such as envelopes and packages for delivery thereof. The ubiquitous postage stamp is issued in various monetary denominations and is simply adhesively bonded to the mailer in accordance with the total weight thereof.
High volume commercial senders typically use a postage meter for imprinting or stamping the required postage on the individual mailed pieces. The postage meter permits easy printing of the exact postage required for a given weight, but requires the additional expense of the postage meter itself and subscription to a service for replenishing the monetary value therein.
In order to bring self-service postage capability to the typical consumer, the USPS has been developing with the industry improved postage media. For example, various forms of internet postage approved for use by the USPS have been available for purchase by typical consumers for well over a year. The consumer purchases from a stationery supplier a sheet of pressure sensitive mailing labels and corresponding postage labels. The consumer uses a personal computer to access the USPS through the common internet for electronically purchasing postage.
In this way, the consumer may print at home using the typical personal printer, such as inkjet or laser printer, both the mailing label and corresponding postage label for one or more pieces to be mailed.
However, downloading of internet postage requires suitable security to prevent fraudulent use or copying of the postage labels which would deprive the USPS of due compensation. Accordingly, the USPS requires suitable security measures for the internet postage to minimize or prevent the likelihood of fraudulent use.
For example, the conventional internet postage label presently approved by the USPS must be used in conjunction with a corresponding mailing label of authorized configuration and design. The postage label itself may not be used without the corresponding mailing label or it will not be accepted for delivery.
Two forms of authorized internet postage include a generally L-shaped postage label and corresponding rectangular return label. The second version introduces a third mailing label for the recipient. The two-part label or the three-part label must all be used in a typical internet transaction for downloading suitable postage for the intended mailer.
The postage label itself must conform with many specifications required by the USPS for permitting its convenient use in automated handling in the postal service. Security features for the L-shaped postage label include its shape and a printed two dimensional barcode containing data encoded therein for identifying the transaction. Furthermore, the postage label once printed must typically be delivered to the USPS within 24 hours of printing, again for security reasons.
Although the present internet postage media permits the typical consumer to prepare postage at home using a personal computer, the multi-part label and procedure increases the complexity and cost thereof.
Recognizing these shortcomings, the USPS is actively cooperating with the industry to further develop the efficiency of internet postage.
Accordingly, it is desired to provide an improved internet postage media having improved security features for permitting its use alone on a mailer.


A method of arbitrating access to a storage medium that is shared by M first computers operating on a Windows™ operating comprising (1) determining if the SCSI PR-flag has been set; (2) if yes, preventing the N second computers from writing to the storage medium; and (3) setting the SCSI MC-flag for each of said M first computers after one of the second computers writes to the storage medium to notify the M first computers that the contents of the storage medium may have changed.

KVM devices are well known. An example KVM device is shown in published U.S. patent application number 2005/0246433 ("Carrigan et al."). KVM devices are used, inter alia, for maintenance applications, and specifically, for maintaining large banks of servers. KVM devices are configured so as to permit one or more local maintenance computer to receive the video of remote servers, and to transmit the keyboard and mouse inputs of a local maintenance computer to a remote server to permit control of the remote server. Preferably, the KVM device is also switchable between remote servers. As a result, a person doing maintenance can sit at a local computer and do maintenance on many remote servers without having to physically move from one remote server to the other.
Sometimes, it is desired to use the local computer to load software or data onto one or more of the remote servers. One method of accomplishing this task, as described in Carrigan et al., is to make use of a storage medium to which both the remote server and local computer have access. The problem then becomes finding a way to arbitrate read and write access to the shared storage medium between the local computer and the remote server, and it will be appreciated by those skilled in the art that the problem of effectively arbitrating access to a shared storage medium is a general problem not limited to the KVM context.
In Carrigan et al., the issue was resolved by creating a virtual disk drive. When the local computer wants to load the software or data, it mounts the virtual disk to itself, making the virtual disk drive available to it and inaccessible to the remote server. Once the software or data is copied to the virtual disk drive, the local computer unmounts the virtual disk drive, making it available to be mounted to the local computer or remote server. When it is desired to have the remote server acquire the software or data from the virtual disk drive, the user, controlling the remote server via the local computer and KVM, causes the remote server to mount the virtual disk drive to the remote server. The virtual disk drive is then inaccessible to the local computer. Once the acquisition is complete, the user causes the remote server to unmount the virtual disk drive.
It will be appreciated that this system for arbitrating storage medium access presents certain problems. First, it is cumbersome, in that it requires either the server or computer to take the step of mounting the virtual disk drive prior to reading and writing. Second, mounting the drive to either of the computers renders it completely inaccessible to the other. Thus, the arbitration between the two computers is very coarse, presenting the user with only two options, which options exclude any genuine shared access to the shared storage medium.
It will also be appreciated that both the local computers and servers are often Windows™ computers. The Windows™ operating system is not designed to deal with situations in which the storage contents can be changed as the Windows™ operating system is reading the storage contents. Thus, methods of arbitrating access to shared storage must account for this characteristic of the Windows™ operating system.

Method and system for arbitrating computer access to a shared storage medium using SCSI protocol


A fluid pit safety system is disclosed to prevent drowning incidents in a fluid pit filled with a fluid. The system comprises a plurality of sensors spatially disposed adjacent the fluid pit, a perimeter detection sub-system defining a perimeter arranged around an edge of the fluid pit, and a rescue device arranged in the fluid pit. The plurality of sensors are configured to detect a change in fluid height in the fluid pit. The perimeter detection sub-system is configured to detect a disruption in the perimeter. The rescue device is configured to move towards a surface of the fluid in the fluid pit in response to the plurality of sensors detecting the change in the fluid height in the fluid pit and the perimeter detection sub-system detecting the disruption in the perimeter.

A wellbore is formed by drilling a subterranean zone (for example, a formation, a portion of a formation or multiple formations) using a drilling assembly that includes a drill bit. The drill bit is attached to an end of a drill string. The drill string is rotated, thereby rotating the drill bit. The drill bit is driven through the subterranean zone to form the wellbore. Drilling fluid (also called drilling mud) is flowed from the surface of the formation through the drill string. The drilling fluid flows out of ports in the drill bit and into an annulus formed between an outer surface of the drill string and the inner wall of the wellbore. The drilling mud flows in an uphole direction towards the surface. When doing so, the drilling fluid carries with it, debris that results from the drilling operation. At the surface, the debris is filtered from the drilling fluid (for example, using shale shakers), and the drilling fluid is collected in a mud pit. Pumps connected to the mud pump then pump the drilling fluid back through the drill string, and the flow process is repeated. The mud pits in which the drilling mud is collected can have dimensions large enough for a person or object to accidentally fall into the pit.


A mobile instrument includes two housings that each incorporate circuit substrates, a hinge portion that joins the two housings such that they can rotate, and a flexible printed wiring board that is passed through a cavity formed inside the hinge portion, and that electrically connects together the circuit substrates in the two housings. The flexible printed wiring board is curled inside the cavity and an elastic body is placed on an inner side of the curled flexible printed wiring board.

Typically, a folding type of mobile terminal device has a first housing that is provided with operation keys and a second housing that is provided with a display device. The housings are joined such that they are able to be opened and closed via a hinge portion and comprise a type of mobile terminal device (i.e., a mobile instrument). In this mobile terminal device, a flexible printed wiring board is provided via a cavity located in the hinge portion in order to electrically connect together circuit substrates built into each housing.
As is disclosed, for example, in Japanese Patent No. 3093727, a portion of a conventional flexible printed wiring board that is wound in a spiral configuration is positioned inside a cavity of a hinge portion. In addition, as is disclosed, for example, in Japanese Patent Application Laid-Open (JP-A) No. 06-311216, wires such as antenna wiring are passed through the inner diameter resulting when the flexible printed wiring board is wound in a spiral configuration in order to electrically connect a transmitting/receiving unit located in one housing with an antenna located in another housing.
However, in order to wind a flexible printed wiring board in a spiral configuration so as to position it inside a hinge cavity during the assembly of a mobile telephone, each flexible printed wiring board has to be wound individually by hand. Accordingly, this is time consuming and gives rise to poor work efficiency. Moreover, because the wind radius of a spirally wound flexible printed wiring board varies due to the tensile force imparted thereto when the housings are opened and closed, it is necessary to ensure that excessive force does not act on localized areas of the flexible printed wiring board. Furthermore, if excessive force does not act on localized areas of the flexible printed wiring board due to some particular cause when the flexible printed wiring board is simply wound in a spiral configuration inside the cavity in a conventional manner, there is a possibility that the soundness of the flexible printed wiring board will be impaired, such as bends and the like occurring in the flexible printed wiring board.
The entire cavity of the hinge portion is formed as one cylinder by placing curved surface portions of circular arc shaped plates that are provided at end portions of both housings alternating in the transverse direction of the housings. Because adjacent curved surface portions are moved relative to each other by the opening or closing of the casings, a slight gap is provided between the adjacent curved surface portions. Therefore, moisture may penetrate inside the housings from this gap. If moisture penetrates into the hinge portion, there is a possibility that this moisture will travel over the flexible printed wiring board located inside the hinge portion and will reach a circuit substrate built into the housing.
In cases where moisture penetrates to the circuit substrate, the proper operation of circuits and electronic components on the substrate is compromised. In order to solve this problem, as is disclosed, for example, in JP-A No. 2002-124779, a structure is known in which this spirally wound flexible printed wiring board is sandwiched between nipping members provided in each of the two housings. The nipping members prevent moisture from traveling along the flexible printed wiring board from the gap in the hinge portion and penetrating the hinge portion, and prevent shorts and corrosion of electronic components on a substrate on the housing side. These nipping members are formed by members having elasticity such as urethane, rubber, or sponge bodies.
However, this structure is not sufficient to prevent moisture from penetrating into the interior of the housing because the structure still allows the actual penetration of moisture into the cavity.

Mobile instrument with flexible printed wiring board


The present invention is directed to topical compositions for regulating the oil and/or shiny appearance of mammalian skin which comprise: a) from about 1% to about 10% of an active for regulating the oil and/or shiny appearance of mammalian skin which consists essentially of one or more compounds selected from the group consisting of niacinamide, panthenol, and pantothenic acid; and b) a cosmetically acceptable carrier for the active.

In the field of skin care compositions, the population is often classified by skin type, e.g., dry, normal, oily, combined dry/normal, combined dry/oily, or combined normal/oily skin (the latter two classes hereinafter alternatively referred to as "combined skin").
Persons with an oily skin type or combined skin type typically manifest an oily and/or shiny skin appearance between cleansings. This oily or shiny appearance generally increases as the day progresses following cleansing of the skin. In order to avoid such appearance, individuals must throughout the day either cleanse the skin, blot the skin, apply oil absorbing powders to the skin, or take some other measure to minimize the appearance of oil or shine.
Therefore, it has been desired in the art to provide topical compositions which minimize the appearance of oil and/or shine on the skin, especially oily or combined skin. Several topical compositions which are said to be designed for controlling oily and/or shiny skin are known in the art. For example, facial moisturizers and make-up said to have such property are known.
An oily or combined skin type presents a particular challenge to the formulation of make-up intended for facial use, including foundations. This is because as oil accumulates on the facial skin of such individuals, oil breakthrough occurs (the oil is not masked by the make-up such that an oily or shiny skin appearance results), and the coverage and wear resistance of the make-up tends to be reduced. It would be desirable to provide a make-up that maintains a high degree of coverage and wear resistance after application to all skin types, including oily and combined skin, preferably substantially as originally applied.
While certain formulations have been designed in an attempt to control the oily and/or shiny appearance of skin, there remains a need to provide improved topical compositions for minimizing the appearance of skin oil and/or shine. In addition to minimizing oil and/or shine, such compositions should not unacceptably discolor the skin. There is a particular need to provide improved facial make-up which minimizes the appearance of skin oil and/or shine, provides and maintains an even (i.e., uniform coverage) complexion and acceptable skin tone for extended periods after application, and/or which has extended wear resistance after application.
The B vitamins or vitamin B complex have heretofore been used to treat a number of conditions. For example, the following compounds have had the respective applications: riboflavin (acne, diabetes, anti-oxidant therapy, anemia, skin disorders, stress); nicotinic acid (atherosclerosis, pellegra, high cholesterol, high blood pressure, skin inflammation, antioxidant therapy); nicotinamide (pellegra, skin inflammation, anti-oxidant therapy); pantothenic acid (acne, anemia, arthritis, high cholesterol, atherosclerosis, alcohol detoxification, infections, hair loss); pyridoxine (acne, anemia, high cholesterol, skin inflammation, immune disorders, antioxidant therapy, carpal tunnel syndrome, premenstrual syndrome). These utilities and those of other B vitamin (complex) compounds are further described, along with a discussion of their contraindications and deficiency symptoms, in The Doctor's Vitamin and Mineral Encyclopedia, Hendler, S. S., pp. 49-82 (Simon & Schuster, New York 1990) and Nutrients Catalog, Newstrom, H., pp. 11-90 (McFarland & Co. 1993).
It has now been found that certain B vitamins are useful when topically applied for regulating the appearance of oily and/or shiny skin, including oily and combined skin, without unacceptably discoloring the skin, e.g., by unacceptable skin flushing or reddening. It has surprisingly been found that topical compositions containing these compounds in the form of a facial make-up composition minimize the appearance of skin oil and/or shine, provide and maintain substantially uniform coverage and an acceptable skin tone for extended periods after application, and/or have extended wear resistance after application.
It is an object of the present invention to provide topical compositions for regulating the oily and/or shiny appearance of mammalian skin, especially facial skin. It is a further object of this invention to provide such topical compositions which regulate the appearance of oily and/or shiny mammalian skin, provide and maintain substantially uniform coverage for extended periods after application to the skin, provide and maintain an acceptable skin tone for extended periods after application to the skin, and/or have extended wear resistance after application to the skin. Another object of the present invention is to provide methods of regulating the appearance of oily and/or shiny mammalian skin.
Other objects of the subject invention will be apparent from the disclosure which follows.

Topical compositions for regulating the oily/shiny appearance of skin


An intercoupled stator core is separated from a non-vertically oriented (including horizontal) generator frame by decoupling the stator core and frame coupling members and interposing a slidable member between them. Thereafter they are separated relative to each other on the sliding member. The sliding or slidable member may comprise a rail, or alternatively a roller adapted for rolling contact with one of the opposed stator core or generator structures and an engagement surface in contact with the other structure. A system for separating the stator core from a non-vertically oriented generator frame includes first and second raising end plates adapted coupled to axial ends of the stator core. The end plates project outwardly from the generator frame ends, for coupling to a raise mechanism. After the raise mechanism raises the stator core the slidable member is interposed between the stator core and generator frame.

1. Field of the Invention
The invention relates to generator stator core removal, and more particularly to field removal and reinstallation of assembled stator cores from non-vertically oriented generator frames, including horizontally-oriented generator frames.
2. Description of the Prior Art
During a generator major overhaul stator cores are removed from the generator frame. Old core windings and insulation are stripped from the stator core lamina stack and replaced with new ones. The replacement stator core is assembled within the generator frame. Generally the overhaul is performed at the power generation site, rather than transporting the entire generator to an offsite repair facility.
Some generator designs facilitate removal of their entire stator core assembly as a module by orienting the core axis in a vertical position and lifting the core module with a crane or other hoisting device that is coupled to a lifting plate affixed to an axial end of the stator core. When vertically lifting an entire stator core module care must be taken to avoid damaging either the core or the generator frame by inadvertent contact during lifting. Given the relatively large diameter, axial length and weight of a stator core, and the relatively small radial clearance with the generator frame a small yaw of the stator core during the hoisting operation may cause inadvertent impacts. Cranes, hoists and similar heavy moving equipment are expensive to purchase or lease, require logistic planning to have them available on a job site and skilled operating engineers, thus often necessitating retention of specialized subcontractors to complete the generator refurbishment. It is desirable to minimize the number of subcontractors needed to refurbish a generator, as well as minimize likelihood of generator damage that might result from impacts incurred during vertical stator core hoisting.
Other generator designs are not suitable for vertically lifting stator cores prior to their refurbishment. In those generator designs the stator core is disassembled in place by hand. Service personnel serially and repetitively remove layers of core windings, insulation and individual core lamina (often up to 75000 individual laminations) in the lamina stack with hand-held tools while the generator frame is oriented with its rotor rotational axis in a vertical or horizontal position (analogous to an archaeological excavation). Such hand labor is time consuming and expensive. A typical in-place rotor core disassembly within the generator frame requires 3-8 days' work by a service crew to remove layers of lamina, windings and insulation. Core disassembly external to the generator consumes less service time, and allows quicker generator service resumption.

Method and apparatus for generator stator core separation


In a connector adapted to be selectively connected to two types of cards inserted towards an insertion direction and different from each other in width thereof, a housing defines a guide space and has a guide portion for guiding an insertion of a selected one of the cards. The guide portion extends in the guide space in a particular direction intersecting the insertion direction. An eject mechanism is provided for moving the selected one towards a removing direction opposite to the first direction. The eject mechanism includes an eject member to be engaged with the selected one and moved together with the selected one, an operating member for moving the eject member towards the removing direction, and a rotary member having a rotation center and rotatable around the rotation center to transmit operation of the operating member to the eject member. The rotation center is disposed in the guide space.

This invention relates to a connector connectable selectively to two types of cards different in width.
For example; a card called an express card is used as an object to be connected to the connector. The express card is produced in accordance with a card standard defined by PCMCIA (Personal Computer Memory Card International Association) and has two types including a narrow card/34 module and a wide card/54 module. Therefore, a connector used for connection of the express card is desired to be connectable to both of the two types of cards.
For example, a connector of the type is disclosed in Japanese Unexamined Patent Application Publication (JP-A) No. 2004-318511 and has a housing adapted to receive a card to be inserted therein. The housing has a left insertion space and a right insertion space. Between the left and the right insertion spaces, a particular mechanism is disposed for guiding the narrow card to the left insertion space or the right insertion space. The mechanism has a rotary member rotated when it is pushed by the card. Thus, the narrow card is guided by the mechanism to one of the left and the right insertion spaces to be inserted therein. On the other hand, the wide card is inserted into a wide space as a combination of the left and the right insertion spaces.
As described above, the above-mentioned connector is adapted to connect each of two types of cards different in width. However, since the narrow card is guided by the particular mechanism having the rotary member to the left or the right insertion space, the card may not smoothly be guided to a predetermined connecting portion.

Connector in which even a narrow card is smoothly guided to a connecting position

Japan Aviation Electronics Industry, Limited


To eliminate from non-fermented or fermented fruit juices obtained from fruit or grapes, in particular wine, the undesirable odors and/or taste caused by sulphur or sulphur compounds, called "Bockser", it is proposed according to the invention to add hardly soluble or insoluble organic Cu-compounds to the liquid, which, by reacting with the sulphur or sulphur compounds, form insoluble sulphides that can easily be separated from the liquid by precipitation. Particularly suitable for this are copper salts of citric acid, tartaric acid, malic acid or stearic acid or mixtures of these salts.

1. The Technical Field
The invention relates to a process for eliminating from non-fermented or fermented fruit juices obtained from fruit or grapes, in particular wine, fruit wine or fruit distillates, undesirable odors and/or tastes which are caused by the formation of sulphur compounds, in particular hydrogen sulphide.
2. The Prior Art
During the reductive fermenting of fruit juices, hydrogen sulphide and other sulphur compounds occur. The resultant adverse effect on the aroma and taste of the fermentation products, called "Bockser" ("Bockser"=the German term for the unpleasant odor and taste caused by hydrogen sulphide), is unpleasant and persistent.
Various treatment methods and cellar measures are known to remove the "Bockser", such as adsorption on bentonites or activated charcoal, aeration, filtration. However, these processes have the disadvantage that their use has a considerable adverse effect on the quality of the wine.
Also known is the use of copper sulphate, which is allowed as a food additive, to remove the "Bockser". The excess copper must then be removed by precipitation with potassium hexacyanoferrate-II. Such a treatment is environmentally harmful, extremely labor intensive and outmoded.
To remove the "Bockser", it is also known to mix the fermentation products with electrolytically precipitated metal ions, preferably Ag-ions which, with the substances in the liquid that cause the undesirable odors and taste, form insoluble salts. This method, known as the catadyn process, results in harmful Ag-ions in the wine. This process is at best suitable for alcohol distillates.
It is the object of the invention to eliminate the aforementioned disadvantages that occur during the removal of the "Bockser" and to indicate an environmentally friendly process.

Process for eliminating smell defects and/or off-flavors in fermented or non-fermented fruit juices, in particular wine, fruit wine or fruit distillate products

Erbslohr-Getranke-Technologie GmbH & Co. KG


The present invention provides photodiodes exhibiting photoconductive gain. It is shown that photodiodes may exhibit photoconductive gain under certain conditions, and traditional photoconductive gain theory has been extended to describe these cases. Particularly, there is introduced the basic principles of photoconductive gain in p-i-n diodes, and there is described several approaches to designing photodiodes with photoconductive gain. In one approach, photogenerated carrier delay is used to obtain photoconductive gain in a photodiode. Delay structures inserted into the intrinsic region preferentially impede the flow of one of the carriers relative to the other to obtain the gain. Another method of obtaining photoconductive gain in a photodiode is to increase the rate at which electron-hole pairs are generated in the p-region or n-region, so as to decrease the times xcfx84p or xcfx84n. One way of decreasing xcfx84p or xcfx84n is to include a region of xe2x80x9cultra-fastxe2x80x9d high B-coefficient material in or near either the p-region or n-region, which has a much lower value of xcfx84p or xcfx84n for a given doping level.

The present invention relates to photodiode devices exhibiting photoconductive gain enhancement.
Photodiodes are one of the most basic building blocks of photonic systems, and the physics of p-i-n diodes is an area considered by many to be well understood. Conventional treatment of a pi-n diode assumes a maximum photoconductive gain of unity, g=1. This assumption has proven so reliable for bulk photodiodes that it has become accepted as a fundamental property of photodiodes, although the mechanisms preventing greater than unity photoconductive gains have not been well described in the literature. More recently, p-i-n photodiodes have been designed with heterojunction structures (such as multiple quantum well structures) in the intrinsic region, and to date these devices have been modeled using the same assumption of unity photoconductive gain (for example see M. K. Chin and W. S. C. Chang, xe2x80x9cInGaAs/InAIAs Quantum-Well Electroabsorption Waveguide Modulators With Large-Core Waveguide Structure: Design And Characterizationxe2x80x9d, Appl. Opt., 34:1544-1553, 1995; A. M. Fox, D. A. B. Miller, G. Livescu, J. E. Cunningham, and W. Y. Jan, xe2x80x9cQuantum Well Carrier Sweep Out: Relation To Electroabsorption And Exciton Saturationxe2x80x9d, IEEE J. Quantum Electron., 27:2281-2295, 1991).
The ability to produce photodiodes with controlled photoconductive gain would be of great benefit for use in photodetector devices and the like. For example, any application requiring detection of very low light intensity levels would benefit significantly with the use of photodiodes having photoconductive gain. Therefore, it would be advantageous to provide semiconductor photodiodes exhibiting photoconductive gain.
It is an object of the present invention to provide photodiode devices exhibiting photoconductive gain.
The inventor has demonstrated that photodiodes may exhibit photoconductive gain under certain conditions, and that these gains may be described to first order by a simple extension of photoconductive gain theory. In the present application there is introduced the basic principles of photoconductive gain in p-i-n diodes, and there is described several approaches to designing photodiodes with photoconductive gain.
In one aspect of the invention there is provided a photodiode with photoconductive gain, comprising:
a semiconductor including at least one p-type region, at least one n-type region, and electrical contacts attached to said n-type region and to said p-type region, whereby illuminating said semiconductor generates electron-hole pairs in at least one depletion region formed at a p-n junction; and
means for enhancing an electron-hole pair generation rate in at least a portion of said semiconductor outside said at least one depletion region,
In this aspect of the invention the means for enhancing an electron-hole pair generation rate may comprise the at least a portion of the semiconductor including an effective semiconductor material having a minority carrier lifetime shorter than or on an order of a difference between the average times for an electron and a hole photogenerated within a specific depletion region to escape the specific depletion region.
In this aspect of the invention the means for enhancing an electron-hole pair generation rate in at least a portion of the semiconductor outside the at least one depletion region may be by optical stimulation of the at least a portion of the semiconductor.
In another aspect of the invention there is provided a photodiode with photoconductive gain, comprising:
a semiconductor including at least one p-type region, at least one n-type region, at least one intrinsic region, and electrical contacts attached to said n-type region and to said p-type region, whereby illuminating said semiconductor generates electron-hole pairs in at least one depletion region formed at a p-n junction and/or at an intrinsic region; and
means for enhancing an electron-hole pair generation rate in at least a portion of said semiconductor outside said at least one depletion region.

Photodiodes with photoconductive gain enhancement


An ion implanter may include an ion source, arranged to generate a continuous ion beam, a DC acceleration system, to accelerate the continuous ion beam, as well as an AC linear accelerator to receive the continuous ion beam and to output a bunched ion beam. The ion implanter may also include an energy spreading electrode assembly, to receive the bunched ion beam and to apply an RF voltage between a plurality of electrodes of the energy spreading electrode assembly, along a local direction of propagation of the bunched ion beam.

In the present day, certain devices such as Insulated Gate Bipolar Transistors (IGBTs), CMOS image sensors, and other semiconductor devices, are fabricated using multiple ion implants. The use of multiple ion implants facilitates the generation of smooth dopant profiles having a targeted shape as a function of depth within the semiconductor substrate, which approach is especially useful for relatively deep ion implantation profiles. In current practice, this targeted shape may be achieved by implanting relatively small doses of ions at many different ion energies. The current state of the art for CMOS Image Sensors (CIS) devices, for example, may employ 20 discrete energies ranging from 500 keV to more than 10 MeV, with doses ranging from 1E10 to 1E12/cm2, while for shorter wavelength sensing needed for automotive and other applications, the number of implantation steps may double or be even higher.
Rather than employ multiple implants, the use of a sawtooth absorbing filter has been proposed to generate a spread of ion energies within a given ion implantation operation. However, this approach has attendant risks of contamination, particles and filter life that may limit such an approach for a practical production environment.
With respect to these and other considerations, the present disclosure is provided.

Apparatus, system and method for energy spread ion beam


Systems and methods are provided for repairing system files. For example, a list of system files including file information of one or more first repairable system files are updated in real time; file information of a target file sent from a terminal is received; whether the target file is in need of repair is detected based on at least information associated with the list of system files; in response to the target file being in need of repair, a first repair strategy for the target file is determined based on at least information associated with a predetermined database of repair strategies and a file type of the target file; and the target file is repaired based on at least information associated with the first repair strategy.

The present invention is directed to computer technology. More particularly, the invention provides systems and methods for data processing. Merely by way of example, the invention has been applied to computer software. But it would be recognized that the invention has a much broader range of applicability.
Computers have gradually become an indispensable tool in people's daily life and work. An operating system is a program for managing computer hardware and software resources and also is a kernel and a cornerstone of a computer system. The operating system plays an important role in the interactions between a user and a computer. System files are often stored in one or more system folders of the operating system. Generally, during an installation process of the operating system, multiple system folders may be automatically created and different system files are placed into the corresponding system folders. The system files may directly affect the normal operations of the operating system. Most system files are not allowed to be altered without authorization. The integrity and safety of system files are important for maintaining the stability of a computer system.
It is sometimes inevitable that errors will occur in the system files during the operations of a computer. For example, improper user operations, intrusion of Trojan viruses, or attacks by a hacker may result in the errors in the system files. Currently, the system files that contain errors may be repaired to maintain the integrity of the system files. Specifically, the computer acquires a list of repairable system files from a server and stores the list locally. The computer then scans the local system files according to the list. If certain local system files that are included in the list of repairable system files are determined to contain errors, some files corresponding to the local system files that contain errors are downloaded from the server to replace such local system files. The operating system is rebooted after the file replacement to complete the repair of the system files.
However, there are certain problems related to the conventional technology for repairing system files. For example, the computer is often required to acquire the list of system files from the server and store it locally. The update and maintenance of the locally stored list of system files are often complex and cumbersome. In addition, the operating system is often required to be rebooted after the file replacement, which may result in interruption of certain operations of the computer.
Hence it is highly desirable to improve the techniques for repairing system files.

Systems and methods for repairing system files with remotely determined repair strategy

Tencent Technology (Shenzhen) Company Limited


Stopper pins are arranged on a path of movement of respective reaction-force receiving cam plates and are urged by urging forces of compression coil springs in a direction in which the stopper pins project from circular holes. As a solenoid is energized, the stopper pins are accommodated into the circular holes. The solenoid is operated by means of a stopper switch, and the solenoid in an energized state allows each combination socket to be fitted over a corresponding wheel-mounting nut. With the combination sockets fitted over all of the wheel-mounting nuts, the operation of the stopper switch causes the stopper pins to move to a projected position to prevent rotation of the reaction-force receiving cam plates, so that high torque is imparted to transmission shafts, allowing four wheel-mounting nuts to be simultaneously tightened or loosened.

1. Field of the Invention
The present invention relates to a multi-shaft electrically-operated automatic nut runner in which a plurality of driving shafts rotate by being electrically operated, and a plurality of transmission shafts are coupled with the driving shafts via torque-changing means, wherein an arrangement is provided such that a pitch circle diameter of sockets fixed to the transmission shafts is equal to a pitch circle diameter of wheel-mounting nuts of a vehicle, and the sockets are rotated to loosen or tighten the wheel-mounting nuts simultaneously.
2. Description of the Related Art
When the operation of removing and fitting a tire is performed for repairing a punctured tire of a vehicle, particularly a truck or a bus, for changing the tire with a new one, or for effecting the rotation of tires, the operator performs the operation by holding a pneumatic impact wrench with the vehicle jacked up. Since the impact wrench is heavy, the impact wrench is sometimes carried by being suspended from a crawler-type impact-wrench suspending machine.
Since an ordinary impact wrench has a single shaft, the operator consecutively loosens a plurality of (usually 8 to 10) wheel nuts by using the impact wrench to allow the tire to be removed.
However, the pneumatic impact wrench produces loud sounds and constitutes a source of noise. In addition, since the vibration is intense, the pneumatic impact wrench imposes a large burden (such as numbness of the hand) on the operator who holds it. Furthermore, there are cases where the pneumatic impact wrench undergoes fluctuations in the air pressure, which can cause variations in the value of tightening torque and, hence, variations in the tightening torque of each wheel nut.
To overcome the noises, vibrations, and torque fluctuations which are the drawbacks of the pneumatic impact wrench, it suffices to employ an electrically-operated automatic nut runner. With the electrically-operated automatic nut runner, however, since the number of revolutions of a driving source is reduced to obtain high torque, the operation time increases substantially, and the operating efficiency deteriorates.
To solve these problems, a multi-shaft automatic nut runner has been proposed which is provided with a multiplicity of shafts and is capable of simultaneously tightening a plurality of wheel nuts (refer to Japanese Utility-Model Application Publication No. 17787/1986, for example). The automatic nut runner disclosed in this publication has a variable pitch circle diameter and can therefore be made to correspond to pitch circle diameters of different vehicle types.
Consequently, the aforementioned automatic nut runner is capable of controlling the noises, vibrations, and torque fluctuations while maintaining an operating time equivalent to that of the pneumatic impact wrench.
The aforementioned automatic nut runner is used in the process of assembling vehicles. Namely, since the wheel nut enters the socket in a state in which the wheel nut is loosened with respect to an inner nut, the wheel nut can be rotated (tightened) with a relatively low torque at the beginning of fitting in. Even if the sockets are fitted over the respective wheel nuts with time lags, the operation is not affected much.
However, in the process of loosening the wheel nuts, i.e., in a process such as the operation of changing the tire, since a maximum torque is required from the outset when the sockets are fitted over the respective wheel nuts, if even one socket is fitted over the wheel nut, a force for rotating the entire automatic runner is generated centering around that fitted shaft, so that the other sockets fail to be fitted over the other wheel nuts.

Multi-shaft electrically-operated automatic nut runner


Disclosed herein is a rotor assembly for a steam turbine including a stacked rotor section having rotor plates. The rotor plates include a main body portion having a plate shape and a first axial face and a second axial face opposite to the first axial face. The rotor plates also include an airfoil base surface at an outer radial edge of the main body portion. The rotor plates further include buckets which extend radially outward from the airfoil base surface. And the rotor plates yet further include a seal disposed to prevent steam exposure to the first and second axial faces.

The present invention relates to axial and circumferential seals for a reaction steam turbine and, more particularly, to axial and circumferential seals between plates of a rotor and/or stator assembly of the reaction steam turbine.
Reaction steam turbines typically include multiple stator stages and corresponding rotor stages. Each of the stator stages is disposed proximate to the corresponding rotor stages to direct steam flow toward the rotor stages. The stator stages include nozzle stages that direct the steam flow. The rotor stages include buckets that receive the steam flow from the nozzle stages. The steam flow exerts a force upon the buckets of the rotor stages and causes rotation of a rotor assembly, which is converted to, for example, useful work or electrical energy.
Current integral-cover reaction nozzle stages include large quantities of individual reaction nozzles that are assembled into a machined stator inner casing using individual radial loading pins. Such a construction method increases time and cost of casting a stator assembly. Similarly, current integral-cover reaction bucket stages include large quantities of individual reaction buckets that are assembled into a machined rotor assembly using individual radial loading pins. Such a construction method increases time and cost of casting the machined rotor assembly.
To reduce time and cost of construction, individual plates may be fit together to form either a rotor or stator assembly. However, steam may leak between axial faces of the individual plates.

Axial and circumferential seal for stacked rotor and/or stator assembly


A connector for electrically connecting to a conductor comprises a pair of conductive terminals, each including a U-shaped fixing portion and an elastic contact arm extending from the U-shaped fixing portion. The connector further includes a pair of pressing members, each having a U-shaped holding portion and an elastic support arm extending from the U-shaped holding portion. Each of the pressing members is fit within the U-shaped fixing portion of the respective conductive terminal by the U-shaped holding portion, and at least a portion of the elastic support arm is abutted against the elastic contact arm.

In the related art, a power connector generally includes a pair of conductive terminals and an insulation partition member. The insulation partition member includes a partition body portion disposed between the pair of conductive terminals and a pair of elastic arms clamped on outer sides of the pair of conductive terminals, respectively. In addition, in the related art, an elastic clip is often disposed outside the insulation partition member. The elastic clip has a pair of elastic clamping arms clamped on the pair of elastic arms of the insulation partition member. However, the insulation partition member and the elastic clip both surround the conductive terminals, which increases the overall size of the power connector, particularly in a width direction. This increase in general size and/or width cannot meet the size requirements in many current miniaturized applications.

Connector and conductive terminal module


For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.

Semiconductor packages or encapsulations are typically formed of one or more of metal, plastic, glass, or ceramic materials which are arranged to house one or more semiconductor dies. Such packages may provide protection against impact and corrosion and dissipate heat produced in the die.
In the field of Radio Frequency (RF) electronic devices, such as for example RF power amplifier devices, RF isolation is necessary to reduce the cross-talk of signals from between channels and also RF return currents which may be induced in metal device features. RF isolation also maintains the integrity of amplified signal, and reduces system measurement uncertainties.
RF technologies device packages such as ceramic brazed package constructions or Liquid Crystal Polymer package constructions are known to provide good RF isolation and EM conduction. However these package constructions are expensive to produce.
In general it is known that plastic compound cavity moulded packages provide more cost effective alternatives to ceramics and LCP packages. However, there are a number of challenges in applying plastic mould compound encapsulations to semiconductor devices, most notably minimising and controlling so-called mould flashing (also known as mould creep or bleeding) to keep metallic floating leads, where additional electrical connections such as wire bond will be made free from mould compound. In addition RF semiconductor devices and high voltage MOSFET devices, for example, are known to be high heat dissipating devices which may therefore limit the type of plastic mould compound encapsulations and moulding techniques available. This is due to the potential for damage caused to the encapsulation caused by melting.
With reference to FIG. 1, the leads 10 of the lead frame are said to be floating. The term "floating lead" refers to the situation where prior to moulding the lead 10 is held (or floats) over a base 12 of the device package. The lead is said to "float" because it is not in direct contact with, nor supported by the base 12. During the moulding process the lead will be held at one end by clamping in the mounting machine at a dambar (not illustrated) end of the lead. Following the moulding process it will be mechanically supported by the cured mould compound, as discussed below.
The base 12 of the package is typically formed of a metallic material which functions to mount the semiconductor die (not illustrated in FIG. 1) thereon. The base 12 may also function as a heat sink for the semiconductor device die and may also allow for additional electrical connections by way of appropriate conductive contacts to the semiconductor die, such as for example back contacts on the device die connecting to the base 12.
As illustrated in FIG. 2, following encapsulation injected mould compound 16 separates the base 12 from the lead 10, and as mentioned above when cured provides mechanical support for the lead 10 on the base 12. As also mentioned, moulding techniques may result is some mould flashing occurring. Minimising mould flashing may keep a section of the leads (shown by 13) free from mould compound 16 and as such may allow the leads 10 to be wire bonded by appropriate wire bonding techniques to the semiconductor dies 14 mounted on the base 10, at a later stage of the device packaging process.
A known technique for moulding or encapsulating devices is known as Film (or Foil) Assisted Moulding (FAM). FAM is a so-called transfer moulding technique which uses plastic films in the mould in an attempt prevent liquefied mould compound from reaching certain areas of the device, such as portions of the leads to be wire bonded, during the moulding process. Other known methods for moulding include thermo-compression techniques but they do not involve the use of a film to protect against liquefied mould compound from reaching certain areas of the device.
FIGS. 3 and 4 illustrate, in general terms, a known exemplary arrangement for FAM, where the films 34, 36 is placed over the leads 10, base 12 and one or more semiconductor dies 14 which may be mounted on the base 12. In this example, two films are illustrated, a first film 34 for a top portion of the mould 30, and second film 36 for a bottom portion of the mould 32. During the FAM process the top 30 and bottom 32 portions of the mould are closed around the base 12, leads 10 and device dies 14. Pressure and heat are then applied to the films so that they are sealed around the base 12, leads 10 and device dies 14.
By sealing the films in this way a first void 38 (or cavity) is created around the device dies 14 and by the application of pressure and heat the film is sealed to the base 12 such that the dies 14 are protected from moulding compound which will be introduced later in the moulding process. In FIG. 3, for the purposes clearer illustration the relative size of the first cavity 38, compared to the other features shown has been exaggerated. A second set of cavities (also known as mould cavities) 37 are created at the top and bottom of the leads 10, where the leads overlap the base, and between the leads and the base 12. Later in the moulding process, moulding compound will be injected into the mold cavities 37, thus electrically isolating the leads 10 from the base 12. Once the mould compound has cured, it mechanically supports the leads 10 on the base 12, and the device can be released from the moulding machine.
Once the film is in place the transfer molding process takes place. Generally speaking the moulding process involves liquefied moulding material being forced into closed mould cavities 37 and held under heat and pressure by the top and bottom heat sink clamps 35, 39, as shown in FIG. 4, until the mould material is solidified and cured. The mould is then opened and the encapsulated devices are unloaded, for further device processing, such as mould flash removal and wire bonding.
Film-Assisted Molding offers a number of advantages over other transfer molding techniques and known thermo-compression techniques. These advantages include the easy release of the encapsulated products from the mold, and protection or isolation of surfaces (such as the semiconductor device die and/or leads for later wire bonding) from moulding compound.
However, for this process to be effective the film must be compressed such that it seals to prevent mould flashing of the compound escaping from the mould cavity, especially onto floating leads. Sealing is typically achieved by pressing the film onto the surfaces to be protected by the heat sink clamps 35, 39 from the top and bottom of the device as shown in FIG. 4. Also during the moulding process with the dies already in place it is necessary to keep the device dies isolated from the moulding process and the moulding compound such that the die does not get encapsulated thereby allowing the die to be wire bonded to the leads post-molding.
Due to the nature of the floating leads it can difficult to apply sufficient sealing pressure using heat sink clamps during the moulding process because the leads are floating and not supported by the base 12. The leads are not supported by the base because it is necessary that the leads are electrically isolated from the base. During FAM it is desirable to apply pressure to the film to prevent compound from bleeding. However, if the pressure applied is too great this will deform the lead downwards, resulting in an downward angled (towards the base 12) lead frame surface. The downward deformation makes it difficult to wirebond the leadframe to the device die after the moulding process is complete.
Mould flashing (or polymer bleeds) on semiconductor device leads are a major problem for device manufacturers because they significantly degrade the solderability of the leads and specifically for surface mount devices bleeds can cause misalignments between the printed circuit board (PCB) and can result in the device being tilted on the PCB. Furthermore, the flashes may fall-off during the process of mounting devices on to PCBs due to vibrations occurring during the device mounting process. The loose flash material can fall onto the solderable area of the PCB also causing the device to be partially or not to be soldered which can also result to package tilting on the PCB.
A known solution to the problem of mould flashing (or polymer bleeds) is simply to remove the unwanted polymer material from the leads after the moulding process has been completed. Removal method for polymer bleeds from the leads can be chemical such as a chemical etch, or by mechanically etching. However, such removal methods introduce a further processing step which can in turn add to the time and cost of producing devices.


Arrays are provided for multiplexed evanescent scanning by allowing for high-contrast Surface Plasmon Resonance images thereof. The arrays target features are typically biopolymeric in nature, though they may be any sort of chemical or ligand. The type of scanning is such that there is no need for probe labeling. As no labeling is required, a broader range of applications than otherwise possible is facilitated. In the subject arrays, target features are set upon a noble metal film deposited on a substrate. Interfeature areas are adapted to trap, divert and/or bleed-away light so that light directed through the substrate will not be reflected by those areas and interfere with evanescent scanning of the reflective areas upon which intended target features are provided. Geometric and materials-based light attenuating features are contemplated. Arrays as described, hardware and software as required for reading such arrays, and associated methodology are covered.

Pharmaceutical, biotechnology, or genomics companies use DNA analysis systems for target identification and drug screening in pharmaceutical drug discovery. In many of these systems, biomolecules (e.g., DNA, RNA, cDNA, proteins) labeled with various dyes bind to chips that offer different molecular probe counterparts for binding in different locations of the chip. An optical scanner is then used to read the fluorescence of these resultant surface bound molecules under illumination with suitable (most often laser) light. Another type of detection for arrays involves the use of multiple electrode elements patterned with various biological molecules on the surface to detect analytes labeled with electrochemically active probes. A third array method operates by optical detection of semiconductor nanopartices attached to biological molecules.
Another mode of scanning is presented in U.S. Pat. No. 5,633,724. As with the other modes of detection noted above, the method taught in the patent requires that probes be attached to the biological molecules of interest. In the case of the '724 patent, fluorescent labeling is used. In contrast to the aforementioned fluorescence-based detection technique, however, this approach employs evanescent excitation of tags or labels instead of direct illumination of the same.
Evanescence involves a situation where incident light is totally reflected off of a surface, but the electromagnetic field component penetrates a short distance (tens of nanometers) into an adjacent medium
While many array-based studies of bioaffinity interactions employ fluorescently labeled biopolymers, there is a recognized need for the continued development of sensitive analytical methods that can be used to detect bioaffinity interactions in biological samples without the need of molecular labels or tags. This is especially true for the case of protein-protein interactions, where labeling is difficult and can interfere with protein function.
SPR imaging is used today to detect the presence of a biopolymer on a chemically modified gold surface by the change in the local index of refraction that occurs upon adsorption. Conventional implementations of SPR analysis involve only one element (one region over which detection is measured) or 3–5 elements in a parallel arrangement at most. However, such systems are not amenable to carrying out high-throughput methodologies.

Arrays for multiplexed surface plasmon resonance detection of biological molecules


An internally illuminated enclosure for a walkway or driveway is provided. The internally illuminated enclosure includes solar panel converting sunlight to electricity which is stored in a rechargeable battery. When a low-light situation is detected by an ambient light sensor, a control circuit provides power from the rechargeable batters to LEDs. Additionally, the internally illuminated enclosure includes a two-part placesetting system having a permanently installed portion and a removable portion.

The present invention generally relates to lighting for walkways or driveways. More particularly, the present invention relates to a solar-powered illuminated system for walkways or driveways.
Currently, many walking and driving surfaces are constructed of stone or brick, commonly called Pavers or Paver stones. In many situations a property owner or architect, or independent Do-it-Yourself homeowner, might chose a Paver construction for the visual attributes it affords, or as a material decision based on climate and terrain, or as based on cost. This type of surface is also known as a cobblestone surface, a term used many years ago. Like a common brick or stone wall might be made be stacking multiple bricks and affixing them together integrally in a vertical plane, with mortar, or a sand aggregate material, a Paver surface is constructed in a similar manner in a horizontal plane by abutting multiple bricks or stones on a base foundation in a level or sloped fashion. This type of surface is typically considered a permanent construction as evidenced by the longevity of many cobblestone roadways still in existence decades after their construction. In Northern climates where low temperatures and ground frost exists, Paver installations are typically made using loose sand products that may retain grade and stone interlock, while enduring terrain movement through freeze and thaw cycles. In southern temperature zones with little or no frost concerns, Pavers may be installed using concrete and mortar type products. For either method of construction it is difficult and not advised to attempt to remove and replace an individual brick within the matrix. And as these constructions are considered to be permanent, due to the materials used, it is not common to remove and/or replace individual brick elements unless there is damage and repair is necessary.
The typical Paver construction comprises individual bricks that are either cut natural rock and stone, or kiln prepared terra cotta material in the form of a brick, or man made fabricated concrete bricks and stones. Some standard sizes exist in the category, however many custom styles and shapes are also readily available.

System and method for integrally illuminated paving enclosure construction and use


A bowling center system includes first and second pinsetters each associated with a respective corresponding one of first and second bowling lanes. A communication device communicates data to bowlers and a lane pair control system is configured to control the pinsetters, to receive pin data from said pinsetters during current bowling, to generate current scoring data based on the received pin data, and to supply signals corresponding to the generated current scoring data to the communication device, whereby the current scoring data is communicated to the bowlers. The lane pair control system is further configured to access stored game data corresponding to previous bowling and to supply signals corresponding to the accessed stored game data to the communication device, whereby the accessed stored game data is communicated to the bowlers.

The present invention generally relates to bowling center systems and, more particularly, to a bowling center system which provides for the use of previously stored game data.
As described in U.S. Pat. No. 5,101,354, bowling center systems generally include a plurality of pairs of bowling lanes, with each lane including an automatic pinsetter. The automatic pinsetter is operable to automatically control pinsetter cycles within a bowling game. Under automatic control, the pinsetter at the beginning of each frame sets ten pins on the deck. The bowler is permitted to roll a maximum of two balls to attempt to knock down all of the pins. The frame ends after all of the pins are knocked down or after two balls are rolled, whichever occurs first. The game consists of ten such frames.
These systems generally include automatic scoring systems which are coupled to both pinsetters in a lane pair for automatically processing pin fall information for the two lanes and displaying bowler""s scores on scoring system monitors and on overhead displays such as CRT displays. Suitable interconnections are provided between the scoring system and pinsetter so that pin fall information can be transmitted from pin fall sensing devices associated with the pinsetter to the scoring system.
Bowling center systems also generally include a manager""s control system in electrical communication with the scoring systems. The function of the manager""s control system is to provide administrative control over the operation of the automatic pinsetters and the scoring systems. For example, the manager""s control system is utilized to provide lane status report information, to upload the video score display from any scoring system and to provide score correction for a particular scoring system. The manager""s control console also includes provision for causing messages to be displayed at a preselected scoring system, to transfer lane scoring information from one scoring system to another, and provide for tournament display by displaying a pair of lane scores on any selected number of overhead CRT""s.
While bowling is a popular participation sport, it is nonetheless desirable to develop new enhancements in order to maintain and expand the sport""s popularity.
In accordance with the present invention, a bowling center system includes first and second pinsetters each associated with a respective corresponding one of first and second bowling lanes. A communication device communicates data to bowlers and a lane pair control system is configured to control the pinsetters, to receive pin data from said pinsetters during current bowling, to generate current scoring data based on the received pin data, and to supply signals corresponding to the generated current scoring data to the communication device, whereby the current scoring data is communicated to the bowlers. The lane pair control system is further configured to access stored game data corresponding to previous bowling and to supply signals corresponding to the accessed stored game data to the communication device, whereby the accessed stored game data is communicated to the bowlers.
The features and advantages of the present invention will be better understood from a reading of the following detailed description in conjunction with the accompanying drawings.