An air conditioning device and a control method of the same are provided. The air conditioning device may include a controller configured to control the air conditioning device based on a control signal input at an input device, in accordance with at least one sleep mode to provide heating or cooling to a designated room at a first operation temperature and a second operation temperature that is higher than the first operation temperature, the first and second operation temperatures being alternately applied multiple times. This may provide a user with an air conditioning function which corresponds to the user's sleeping patterns and provide for a more pleasant sleeping environment.

1. Field
This relates to an air conditioning device and a control method of such an air conditioning device.
2. Background
The human sleep state may include a REM (rapid eye movement) sleep state and a Non-REM sleep state which are alternately. The REM sleep state may be observed three to five times in one night at regular intervals. Physical changes observed in the REM sleep state may include decline of temperature control in addition to rapid eye movement. It may be difficult to precisely define the REM sleep state medically or scientifically. When classifying or analyzing the human sleep state, human brainwave analysis may be used.
The REM sleep state may be a state in which physiological loss of consciousness is repeated periodically. REM sleep in infants typically occupies up to 50% of total sleep. As humans age, the amount of REM sleep tends to decrease gradually. The Non-REM sleep period may be related to physical recovery, while the REM sleep period may be related to mental recovery, or a period for recovery of brain cells. If REM sleep is insufficient or interfered with repeatedly, side effects may include, for example, memory loss and cognitive power loss.
As mentioned above, the REM sleep state does not seem to respond to environment or to have declined sensory or reflex function. If heating of a room is required during the sleep period in which the REM sleep and the Non-REM sleep alternate with each other, sensory, reflex and temperature control functions may decline. If air conditioning which targets either of the sleep periods is performed, response to physiological requirements may not be appropriate, resulting in fatigue after sleep, memory loss, and loss of cognitive power.

Air conditioning device and control method of the same


An applicator tool (40) for repairing damage (26) to a wind turbine blade (20) includes a spatula (42) including a flexible extrusion plate (44) and one or more spacers (60, 106) positioned proximate an inner surface (58) of the extrusion plate (44). The one or more spacers (60, 106) are configured to define a gap between an outer surface (34) of the wind turbine blade (20) and the inner surface (58) of the extrusion plate (44). A feed tube (86) is provided for supplying a coating material to the spatula (42), wherein the spatula (42) is configured to shape the coating material into a coating (30) over a damaged area (26) of the wind turbine blade (20).

Wind turbines are used to produce electrical energy using a renewable resource and without combusting a fossil fuel. Generally, a wind turbine converts kinetic energy from the wind into electrical power. A conventional wind turbine installation includes a foundation, a tower supported by the foundation, and an energy generating unit positioned atop of the tower. The energy generating unit typically includes one or more nacelles to house several mechanical and electrical components, such as a generator, gearbox, and main bearing, and the wind turbine also includes a rotor operatively coupled to the components in the nacelle through a main shaft extending from the nacelle. Single rotor wind turbines and multi-rotor wind turbines (which may have multiple nacelles) are known, but for the sake of efficiency, the following description refers primarily to single rotor designs. The rotor, in turn, includes a central hub and a plurality of blades extending radially therefrom and configured to interact with the wind to cause rotation of the rotor. The rotor is supported on the main shaft, which is either directly or indirectly operatively coupled with the generator which is housed inside the nacelle. Consequently, as wind forces the blades to rotate, electrical energy is produced by the generator. Wind power has seen significant growth over the last few decades, with many wind turbine installations being located both on land and offshore.
As noted above, blades interact with the wind to generate mechanical rotation of the rotor, which can then be converted into electrical energy. A wind turbine blade is a complex structure that must be constructed to withstand long-term service in an abusive environment, while also maximizing lift and minimizing drag forces. The blades move at varying speeds through the ambient environment surrounding the wind turbine, but often this movement is at high speed, especially near the tip of the blades. Consequently, the blades will typically experience erosion and damage over time in operation as a result of friction from the air as well as potential impacts from particulate matter, debris, or other items in the air, especially along the leading edge facing the direction of movement through the wind. The erosion or damage along the leading edge of the blade adversely affects the aerodynamic qualities of the blade over time, resulting in lower power production for given incoming wind speeds. Such erosion and damage on the blades can be corrected by routine maintenance and repair procedures.
The blades are typically formed from a shell of layered fibre composite, aluminium, or similar material with an outer skin defined by a series of layers of coatings (polymeric elastomers, paint, etc.) surrounding and covering an outer surface of the shell. The shell encloses internal components of the blade and isolates the internal components from the environment, including shear webs and spar caps, for example. The outer skin may be defined by several different layers of material, including at least an outermost topcoat, a second layer underneath the outermost topcoat, and a third layer underneath the second layer. Other layers are typically present underneath the third layer as well, including base materials typically made from fibre composites and the like. Damage to the blade outer skin can be categorized into several different levels of severity based on which layer the damage extends to, e.g., an erosion to the third layer would be a "category 2" level of severity, which would be higher than a cut to the second layer, which would be a "category 1" level of severity. For low levels of damage or erosion, such damage can be repaired by depositing a coating onto the area to fill in the damage and restore the blade to the original condition along the leading edge thereof.
These types of repairs of the wind turbine blades have typically been conducted in three manners conventionally. First, the blade can be disassembled from the remainder of the wind turbine and lowered to the ground for the repair to be completed. Such a repair process is time-consuming and costly as a result of needing to disassemble, move, and reassemble the blade relative to the top of the tower. Thus, this approach is generally not favoured. In a second approach, a human operator with rope access can rappel along the wind turbine blade while still attached to the rotor hub to evaluate and make repairs as needed to the blade. In a third approach, a repair action can be taken by an operator on a platform hoisted into position adjacent the blade on the wind turbine, either extending from the nacelle or hub of the wind turbine or extending from a cherry picker or boom-style lift. Although the blade may remain attached to the wind turbine in the latter two approaches, a significant amount of skill and time are required to apply and shape the coating to the damaged area of the wind turbine blade properly. If the coating is not properly applied or misshapen, the aerodynamic performance of the blade may be adversely affected, requiring the wind turbine to be taken back out of service and a further maintenance and repair process performed on the blade.
In recent years, a desire has emerged to allow for some automated maintenance of wind turbine blades, to improve the speed and/or precision of such a process. However, such automated maintenance devices are not always designed for reliable use on a wind turbine blade still connected to the rotor and hub of a wind turbine, and such systems are very slow in operation. Furthermore, such systems may be prone to uneven or misshapen coatings similar to that of manual processes. Thus, further improvements for automated maintenance and repair systems are desired.
Accordingly, wind turbine manufacturers and operators continue to seek improved options for conducting maintenance and repair on the wind turbine blades of modern wind turbine designs.

Coating applicator tool and method for repairing leading edge damage on a wind turbine blade


The present invention improves the performance of a storage device by utilizing the special features of different types of volumes. The control part of the storage device constructs a virtual volume in the memory. The virtual volume is constructed by a low-speed volume and a high-speed volume, and has the same size capacity as the low-speed volume. When the application program of the host requests the updating of data, the write data is respectively written into low-speed and high-speed volumes, and a life tag that indicates the storage period is set beforehand in the virtual volume. When the storage period has elapsed, the data is erased from the high-speed volume. The data in the low-speed volume is maintained “as is”. While the data is held in the high-speed volume, access from the host is processed utilizing the data in the high-speed volume.

1. Field of the Invention
The present invention relates to a storage device and a storage device data life cycle control method.
2. Description of the Related Art
In storage devices, for example, storage regions based on an RAID (redundant array of independent disks) are constructed using storage devices such as hard disk drives, semiconductor memory drives or the like. For example, such physical storage regions (logical volumes) are provided to host computers (hereafter referred to as "hosts") such as server machines or the like. Application programs operating in the hosts provide information processing services to client terminals connected to the hosts by writing data into the logical volumes or reading out data from the logical volumes.
The quantities of data that must be stored by storage systems are continually increasing; furthermore, depending on the type of data, there are also cases in which long-term storage is required. Accordingly, in order to meet this increasing demand, replacement with large-capacity disk drives, or the introduction of new type high-performance storage devices, has been seen.
Furthermore, a technique which is devised so that virtual volumes can be constructed by virtualizing logical volumes respectively possessed by respective storage devices, and these virtual volumes can be provided to respective hosts, is also known (Japanese Patent Application Laid-Open No. 2002-91706).
In conventional storage systems, new types of disk drives and new types of storage devices are introduced as necessary in order to increase the storage capacity and improve the response characteristics. However, the utilization value (utilization frequency) of data is not fixed, but drops as time passes according to the type of application program and the like. For example, in the case of a data base, data groups that constitute a monthly tabulation for a certain month are frequently utilized only during the period for which the monthly tabulation is created; after this monthly tabulation is completed, these data groups are hardly used at all until the deadline for the creation of a yearly tabulation arrives, and are merely stored "as is". Furthermore, for example, in the case of email serving program, reference is made to email data only within a relatively short period following the receipt of this email; after a reply to the email is completed, the data is stored for a long period of time without being used.
Accordingly, even in cases where a high-speed volume constructed by a disk drive with good response characteristics is introduced, this high-speed volume becomes filled with data groups whose utilization rate has dropped as operation is continued. Meanwhile, in cases where data stored in a low-speed volume is referred to or updated, time is required for the reading and writing of such data, so that the response characteristics drop.
In cases where all of the volumes are constructed by high-speed volumes, the cost is increased; accordingly, it is necessary to operate using a mixture of high-speed volumes and low-speed volumes. However, as was described above, since high-speed volumes also eventually become filled with unnecessary non-urgent data, the high-speed characteristics cannot be utilized over a long period of time.
Meanwhile, a technique called data migration is also known. In the case of this data migration, for example, unnecessary non-urgent data is moved from the main volume to another volume, so that the empty capacity of the main volume is maintained. In this case, for example, since the question of which data corresponds to which file, the question of which files have a low frequency of use and the like cannot be grasped on the side of the storage device, data migration is performed on the basis of instructions from the side of the host.
Accordingly, it is necessary to grasp the frequency of use of the respective files on the side of the host, and to move these files from the current volume to another volume, so that the operating burden on the host side is increased, and the convenience of the system is poor. For example, the user must specify the file that is the object of movement, and must give instructions for the movement of this data. Furthermore, for example, the host must read out the file that is the object of movement from the current volume, and write this read-out file into another volume, so that the burden of data input-output on the network is increased.

Storage device and storage device data life cycle control method


The invention is wiper arm for a device for the cleaning of a windshield on a vehicle with a retaining element attached to a drive shaft to which a wiper arm part is articulated such that it can be tilted onto and away from the windshield and which is pressed down in the direction of the windshield with a force at least during the operation of the windshield washing device, and with the free end of which a wiper can be connected and with a separate trim that is attached to the wiper arm and extends in a longitudinal direction over the greater part of the length of the entire wiper arm part, and over all of the length of the wiper that is connected to the wiper arm. In order to guarantee a simple and problem-free handling for tilting the wiper arm part up away from the windshield or for exchanging wipers, the trim is connected to the wiper arm part in the area of an end that faces the retaining element such that the trim can be swiveled relative to the wiper arm part about an axis that runs perpendicular to the wiper arm.

1. Field of the Invention
The invention concerns a wiper arm for a device for the cleaning of a windshield on a vehicle.
2. Description of the Art
It is already known that wipers that link to a wiper arm are equipped with a variety of attachments or spoiler elements. It is also known that the wiper arms are equipped with a variety of attachments and spoiler elements. From EP 0 538 093 Al a wiper arm is known which has a conventional structure, i.e., a wiper arm component that consists of a linking element made out of sheet metal and of a wiper bar attached to it that is linked to a retaining element allowing it to pivot. A conventional wiper is snap-linked on to the hooked end of the wiper arm by means of a connecting piece. The wiper is formed by a bow-shaped wiper blade retainer and an elastic wiper blade retained by it. A one-piece trim that is clipped onto the top of the wiper arm and held in place by a snap-lock connection has a U-like cross-sectional shape that is open toward the windshield. This rigid trim extends over the full length of the entire wiper arm and the wiper blade that is connected to it. Except for the side that faces the windshield, the wiper arm is completely wrapped into the trim. In the area of the wiper blade, the longitudinal edges of the trim that face each other extend downward over a large part of the height of the bow construction of the wiper blade retainer, whereas lower edges end at a distance above the upper edge of the wiper blade. Between the upper side of the wiper blade and the lower edges of the trim, a clearance of several millimeters height remains. A disadvantage of this type of wiper arm is that the trim prevents the tilting up of the wiper arm from the windshield that may become necessary from time to time, and also this design is a strong impediment to exchanging the wiper that is connected to the wiper arm. The consequence of this design is that the wiper arm trim must be removed before tilting the wiper up from the windshield and exchanging the wiper, and that the trim must be re-installed after the wiper exchange or after tilting the wiper back down on the windshield. The snap-on fastening parts of the trim are difficult to access, and the trim is therefore difficult to remove. There is also the risk that the snap-on fastening elements might break off from the trim rendering the entire trim useless. Because the lower edges of the trim end in the area of the wiper at a distance above the upper side of the wiper blade, an opening is formed through which the wind blast pushes, and across which the lower parts of the bow construction of the wiper blade retainer extend. This opening has negative effects on the aerodynamics and aero-acoustic characteristics at high speeds.
It is the purpose of the invention to improve a wiper arm of the type described above such that the wiper arm can be easily tilted upward or the wiper can be easily exchanged.
According to the invention, the task is solved, by a wiper arm wherein the desired simple handling is guaranteed because the trim that is manufactured as a separate part is attached, with its end that faces an adapter piece, to the wiper arm part in a manner that permits it to pivot around an axis that extends perpendicularly to the wiper arm part, relative to the wiper arm part or relative to the wiper arm. Due to this configuration, the wiper arm part that is linked to the retaining element to the free end of which the wiper is linked can be tilted up and away from the windshield in the same simple manner as is known from conventional wiper arms, e.g., if the windshield needs to be cleaned manually. For the execution of a wiper exchange, the trim can also remain connected to the wiper armxe2x80x94it just needs to be tilted in an upward direction from its closed position around the axis that extends perpendicularly to the wiper arm part into an open position. This exposes the linkage area of the wiper to the wiper arm, and the wiper exchange can be made in the usual easy fashion. After the exchange of the wiper has been completed, the trim is tilted back into its closed position. The tilting of the trim from the closed into the open position can be conducted in any of the positions the wiper arm part might assume in relation to the retaining element of the wiper arm.
An advantageous configuration of the invention, with the trim is connected to the wiper arm via two trunnions that engage in bearing bores or recesses, makes a simple and cost-efficient production of a wiper arm that is equipped with the trim possible according to the invention. The trunnions can be located on the trim and protrude inward from two side walls of the trim that face each other. In this case, corresponding bearing bores or bearing recesses are located on the opposite longitudinal sides of the wiper arm part into which the trunnions engage. If necessary, the bearing bores or bearing recesses can also be located on the walls of the trim that are facing each other. The trunnions are located on the wiper arm part in this case, and extend in an outward direction from its opposite outsides. If the dimensions are sized accordingly in consideration of the elasticity of the trim, this linked connection can be configured as a friendly snap-on connection.
One configuration of the invention provides that the trim can be locked into its closed position, and possibly, also into its open position on the wiper arm part, by means of a reversible locking device. Locking the trim in its closed position guarantees safe operation of the windshield cleaning device; while locking it in its open position facilitates easy handling when changing wipers. The locking device can be configured in a simple manner by one or several snap ons in combination with one or several snap grooves that are located alternatingly on the trim and on the wiper arm part near the pivoting axis that is located between the wiper arm part and the trim, and that interact with each other making use of the elasticity of the trim. In the simplest form, a snap on can be configured at an appropriate distance from the pivoting axis on the inside of the side wall of the trim that, in the closed position, snaps in behind the lower edge, and in the open position behind the upper edge of the wiper arm part.
Another advantageous configuration of the invention provides that a springy snap element that is attached to the trim or molded into it and that can be swiveled, interacts with the wiper arm part as a locking element, preferably with the free end of the wiper arm part. This locking element can be configured in such a manner that the locking or the unlocking of the trim in relation to the wiper arm part is effected as a result of tilting the trim into the open position or the other way around. For ease of handling, this would be particularly advantageous. However, if, by comparison, inadvertent unlocking, in particular caused by the force of the wind blast at high driving speeds, is to be positively precluded, the locking element needs to be configured with an accordingly strong undercut, or the locking element must be configured to require appropriately high disengagement forces for it to unlock. In this case the greater advantage of operational safety requires a manual operation of the locking element as an additional operational measure that, in view of the achievable advantage, must be accepted as appropriate.
A configuration is preferred that provides the trim as a spoiler, preferably as an integral spoiler. With such a spoiler or integral spoiler, shapes can be realized that can decisively influence the high speed behavior of a wiper arm equipped with a wiper with regard to aerodynamics and aero-acoustics. According to the invention, there is no need for spoilers on the wiper itself so that in connecting to the wiper arm, low cost wipers without spoilers can be used. The trim, in particular the trim shaped as integral spoiler, can also be understood as an additional design detail that makes it possible to adapt the essentially conventional wiper harmonically to differing vehicle concepts. Exposed edges are covered by the integral spoiler.
In this context, an advantageous configuration of the invention is recommended in which the integral spoiler over most of the length of the wiper arm part and over all of the length of the wiper covers the upper side of the wiper arm part and the wiper completely, and, starting with its top side, extends toward the windshield of the vehicle at the longitudinal side that is exposed to the wind blast. This configuration makes certain that edges located in sequential order on the wiper arm and the wiper that could produce wind noises when driving are covered.
In an advantageous configuration, the noise production that is caused by the wind blast blowing into open edges of the wiper arm and the wiper can be further reduced if, in the operating position of the wiper arm that is connected to a wiper, the lower edge of the trim, or of the integral spoiler at its longitudinal side that is exposed to the wind blast, extends close to the windshield of the vehicle without touching it. In this configuration, essentially all edges of the wiper arms and the wiper that are exposed to the wind blast are completely covered.
In order to prevent damage to the windshield or its surface in the event that a wiper inadvertently hits the windshield or, in the event that the lower edge of the trim or the integral spoiler makes inadvertent contact with the windshield, an advantageous configuration provides that the lower edge of the trim, or the integral spoiler is made from a soft and, in particular a rubber-like material, or is formed by a lip out of such softer, in particular, a rubber-like material that is attached to the trim or the integral spoiler.
In order to achieve economic and targeted application of washing fluid to the windshield to be cleaned, it is already known to attach to the wiper or to the wiper arm a spraying tube with lateral jet openings that are distributed along the length of the wiper. The cleaning fluid is transported to the spraying tube via a hose that can be connected to the spraying tube. If the spraying tube is located on the wiper, the hose connection must be disconnected and reconnected for every wiper exchange. If the spraying tube is located on the wiper arm, it protrudes over the free end of the wiper arm in a longitudinal direction which is counterproductive in regard to aerodynamics, aero-acoustics, and styling. Therefore, a preferred configuration of the invention is particularly advantageous in that it provides that a jet device for the application of the washing fluid on the windshield to be cleaned is configured and retained on the trim, or on the integral spoiler. When changing the wiper, the jet device is simply tilted into the open and then again into the closed position together with the trim, or the integral spoiler. No further handling is needed.
Advantageous in this context is a configuration of the invention in which the jet device covered from the oncoming wind blast is located under or behind the trim, or the integrated spoiler, preferably on the rearward part of the trim or the integral spoiler that is facing away from the oncoming wind blast. In this manner, the jet device cannot negatively influence the aerodynamic or aero-acoustic behavior of the wiper arm. By the same token, a negative impact on the styling because of the jet device can also be excluded. In addition, it is guaranteed that the fluid would be applied from the jet device problem-free, and aimed onto the windshield in the direction of motion of the wiper that started moving from its housed position.
Advantageous for an effective application of the washer fluid on the windshield in this context is a configuration that provides that the jet device contains a fluid channel that can be connected to a hose and extends along the trim or along the integral spoiler up to the end of the wiper that faces away from the retaining element, or at least into the vicinity of this end, and is connected to several spraying jets that are distributed along the length of the wiper. If, in addition, the jet device is configured as a separate, oblong, rigid or flexible hollow-profile body with lateral spraying jets, that is, preferably snap-locked, retained by a retaining device of the trim, or the integral spoiler, the possibility results that a clogged jet may be exchanged for a new one. In the event that the jet device is configured to form one piece with the trim, or with the integrated spoiler, the complete trim or the complete integrated spoiler would have to be exchanged. A flexible configuration of the hollow-body profile that constitutes the jet device would have the additional advantage that identical jet devices could be used for the differently shaped integral spoilers or trims since the jet device can be flexibly adjusted to follow the contour of the spoiler.
The particular advantage of a configuration in which the trim, or the integral spoiler, made out of plastic material and, in particular, by use of injection molding, is, above all, to be seen in the manifold shaping options that could be realized at a reasonable cost.


The method of forming a tamper-evident plastic bag or similar container includes providing a zipper with interlocking first and second profiles with respective first and second flanges. The second flange is longer than the first flange. A distal portion (with respect to the interlocking elements of the profiles) of the second flange is sealed to the web thereby forming a transport seal to carry the zipper with the web through a form, fill and seal machine. At the form fill and seal machine hard seals are formed between the web and the first flange and a proximal portion of the second flange. The transport seal is a peel seal or alternatively the second flange is formed with a frangible section between the distal and proximal portions and the transport seal is a hard seal. In both cases the second flange provides tamper evidence and/or a hermetic barrier for the completed bag.

1. Field of the Invention
This invention relates to the manufacture of reclosable packaging and, in particular to a method of sealing a zipper to a bag making film to permit simultaneous transport of the zipper and film to a bag making machine such that the transport seal provides tamper evidence and/or hermetic sealing for the final bag.
2. Description of the Prior Art
Reclosable plastic bags are growing increasingly popular both for storage purposes and as primary packaging for cheese and various other food stuffs and other products. Such bags are formed with plastic zipper having profiles with mating interengageable elements. Where the bag is to be used as primary packaging for foods, it is often necessary to seal the product hermetically. While zipper elements can provide a secure closure, they cannot provide a hermetic closure. Accordingly, a separate hermetic seal is necessary. Even where a hermetic seal is not required, it is common-place to provide a separate, one-time seal on reclosable packaging for foods and other products that provides evidence of tampering. That is, the consumer looks to the unopened seal as evidence that the package has not been tampered with.

Method for manufacturing tamper evident reclosable plastic bags


The present invention relates to a chemical feeder that includes a housing (11) having a housing chamber (20) therein, a support plate (35) within the housing chamber that includes a plurality of support plate apertures (44), and a plurality of nozzles (69, 72) that each have a distributor head (78) that extends up through the support plate. Each distributor head distributes a feed liquid horizontally above the upper surface (38) of the support plate. The chemical feeder, with some embodiments, further includes a diverter plate (122) that extends upward from the support plate at an angle (125) of less than 90°. The diverter plate divides an upper housing chamber (146) into a first upper housing chamber (152) that includes solid chemical material, and a second upper housing chamber (155) that is free of solid chemical material.

Chemical feeders can be used to produce various mixtures, such as aqueous solutions of water treating agents that can be used for the disinfection of effluent from sewage treatment plants, for the chlorination of water in swimming pools and hot tubs, and for the delivery of other water soluble chemicals, such as pH control agents, to aqueous streams and water systems. In some instances, a solid treatment chemical is placed within the chemical feeder, where it comes into contact with a liquid, such as water, introduced therein so as to form a treated liquid composition, such as a treated aqueous composition. It is typically desirable that the chemical feeder produce treated liquid compositions that contain a controllable and reproducible level of treatment chemical therein. Variability in the rate at which a solid treatment chemical dissolves in the liquid that is introduced into the chemical feeder can result in an undesirable variation in the concentration of treatment chemical in the treated liquid that is removed from the chemical feeder during operation thereof. In the case of pH control agents, for example, such variability in the concentration of the pH control agent(s) can result in undesirable variability in the pH of the treated liquid. In some instances, pH control agents are used to adjust the pH of a liquid stream containing sanitizing agent(s) for purposes of optimizing the performance of the sanitizing agent(s). If the concentration of pH control agent(s) drops below or above a predetermined operating range, the performance of the sanitizing agent can be undesirably reduced.
In some situations, the solid treatment chemical charged to a chemical feeder is exposed to excess liquid, which results in the solid treatment dissolving too quickly, and/or the formation of a treated liquid having an undesirably high level of treatment chemical. The solid treatment chemical dissolving too quickly can result in the need to frequently charge the chemical feeder with new or replacement solid treatment chemical.
To reduce the frequency of charging a chemical feeder with new or replacement solid treatment chemical, the dimensions of the chemical feeder can be increased, so it can hold a larger amount of solid treatment chemical. Chemical feeders having larger dimensions can undesirably provide a treated liquid output having an undesirably variable amount of dissolved solid chemical therein.
It would be desirable to develop new chemical feeders that can be used to produce treated liquid compositions from solid treatment chemicals. It would be further desirable that such newly developed chemical feeders provide a desirable rate at which the solid treatment chemical dissolves, and a controllable, reliable, and reproducible level of treatment chemical in the treated liquid compositions that are removed from the chemical feeder. It would be further desirable that such newly developed chemical feeders can be scaled up to larger dimensions without compromising desirable performance properties, such as providing a controllable, reliable, and reproducible level of treatment chemical in the treated liquid compositions that are removed from the chemical feeder.


An organic light-emitting diode (OLED) display is disclosed. In one aspect, the OLED display includes a thin film transistor including an active layer, a gate electrode, a source electrode, and a drain electrode, a first insulating layer arranged between the active layer and the gate electrode, and a second insulating layer arranged between the gate, source, and drain electrodes. The OLED display also includes a third insulating layer covering the source and drain electrodes, wherein an opening is defined in each of the second and third insulating layers and wherein the openings substantially overlap. The OLED display further includes a pixel electrode formed in the openings defined in the second and third insulating layers and including a semi-permeable metal layer.

1. Field
The described technology generally relates to an organic light-emitting diode (OLED) display.
2. Description of the Related Technology
The standard OLED display includes a hole injection electrode, an electrode injection electrode, and an organic light-emitting layer formed between the hole injection electrode and the electron injection electrode. OLED displays are self-emissive displays. In an OLED display, holes injected from the hole injection electrode and electrons injected from the electron injection electrode are recombined and emit light during decay. OLED displays have high-quality features such as low power consumption, high brightness, and fast response speeds, thereby gaining attention as a next-generation display.

Organic light-emitting diode (OLED) display


Organic semiconductor layers (2, 4) are laminated sandwiching an insulator thin layer (3), and translucent electrodes (1, 5) are formed on the surfaces of the organic semiconductor layers (2, 4), respectively. While a voltage is applied so that the electrode (1) is positive with respect to the electrode (5) and the opposite surfaces of the device are irradiated with two lights (6, 7) simultaneously, photocurrent multiplication is occurred to allow a photocurrent to flow in the device. However, no photocurrent multiplication occurs to allow no flow of photocurrent when the device is irradiated with one of the lights (6, 7).

1. Field of the Invention
The present invention relates to optoelectronic devices, and more particularly, relates to organic photocurrent multiplication devices using organic semiconductors.
2. Background Art
Conventional photocurrent multiplication devices normally have a structure of a single-layer organic thin film sandwiched by two metal electrodes, in which the device is irradiated with a single light on one side to cause photocurrent multiplication (see M. Hiramoto, T. Imahigashi, M. Yokoyama, Applied Physics Letters, 64, 187 (1994), for example).
There is also known a "light to light" conversion device in which the photocurrent multiplication device described above and an organic electroluminescent device are layered on each other integrally (see M. Hiramoto, T. Katsume, M. Yokoyama, Oyo Buturi, 64, 1036 (1995), for example).
The conventional photocurrent multiplication device including a single-layer organic thin film described above only has a simple function of permitting photocurrent multiplication to occur when the device is irradiated with one light. Therefore, to apply the photocurrent multiplication device to an advanced optical device that controls light by use of two lights, such as an optical operator, a new function must be added. For example, to be provided with an AND function, the photocurrent multiplication device must be configured so that multiplication occurs only by irradiating the device with two lights simultaneously. It is, however, impossible for the conventional photocurrent multiplication device to be provided with such a function.
In view of the above, an object of the present invention is to provide an organic photocurrent multiplication device having an AND function of permitting photocurrent multiplication to occur only when the device is irradiated with two lights.

Organic photocurrent multiplication device

Japan Science and Technology Corporation


In an optical pickup, light, emitted from a light-emitting element, is transmitted through a first beam splitter film with polarization selectivity, and a zero-order diffraction beam and two (.+-.) first order diffraction beams are produced. These beams are applied in a condensed manner to an optical disk through a condensing element, and the return light beam from the optical disk is fed to a photodetector through a second beam splitter film with polarization selectivity, thereby effecting the recording and reproduction of information, the tracking and the focusing. A diffusion angle conversion hologram is provided between the light-emitting element and the first beam splitter film, and with respect to the diffusion angle conversion hologram, the relation between the diffusion angle of the incident beam and the diffusion angle of the outgoing beam is specified. With this arrangement, the light to be incident on the condensing element can have an ideal spherical wave free from a wave aberration, so that an image spot on the optical disk can be condensed into a diffraction limit, and besides by correcting the phase of the beam, a RF signal with a high C/N ratio, a stable focus error signal and a stable track signal are detected.

This invention relates to an optical pickup for recording and reproducing information relative to an optical element or an optical disk, and also relates to a method of producing the optical pickup.
It has heretofore been desired to achieve a compact design of an optical disk unit capable of recording and reproducing information using a laser beam, and attempts have been made to achieve a compact and lightweight design of an optical pickup by reducing the number of optical parts. The compact and lightweight design of the optical pickup contributes not only to a reduced overall size of the optical disk unit, but also to an enhanced performance such as a shortened access time. Recently, a hologram optical pickup has been proposed in order to provide a compact and lightweight design, and some of such proposals have been put into practical use.
A conventional hologram optical pickup will now be described with reference to FIGS. 35a to 38. FIG. 35a is a plan view of the conventional optical pickup, and FIG. 35b is a side-elevational view of the conventional optical pickup.
Reference is first made to an outward optical path from a semiconductor laser (light-emitting device) to an optical disk. In FIG. 35b, a laser beam, emitted horizontally from a semiconductor laser chip 2 mounted horizontally on a sensor base plate 1, is caused by a trapezoidal prism 4 (which is mounted on the sensor base plate 1 with its reflecting surface opposed to the semiconductor laser chip 2) to enter the interior of a transparent optical guide member 5 through an incident window 6 on a second surface 5b of the optical guide member 5, so that the laser beam is turned into diffused light 7 in the optical guide member 5. A hologram 8 is formed on a first surface 5a of the optical guide member 5, and the diffused light 7, going out of the optical guide member 5, passes through the hologram 8, and is turned into diffused light 9. The diffused light 9 is incident on an objective lens 10, and is converted into outward convergent light 13 which is then condensed into a spot 12 on an information recording layer 11a of the optical disk 11.
Next, reference is made to a return optical path from the optical disk to light-receiving sensors. Reflected light 14 from the information recording layer 11 of the optical disk passes through the objective lens 10, and is converted into return convergent light 15, and then is incident on the hologram 8.
As shown in FIG. 36, the hologram 8 is divided into two regions having an equal area by a division line (boundary) extending in the same direction as that of a track of the optical disk 11, the two regions having different patterns, respectively. The hologram 8 converts the return convergent light 15 into first diffraction light 16 and second diffraction light 17 diffracting in different directions at an angle of (2n+1) .pi./4, such as 45.degree. and 135.degree., relative to the polarization direction of the semiconductor laser chip 2.
A first return polarized light splitting portion 18 and a second return polarized light splitting portion 19 are formed on the second surface 5b of the optical guide member 5, and each of the two splitting portions 18 and 19 is formed of a return polarization separation film coated on the second surface 5b, and transmits a P polarization component of the diffraction light 16, 17 therethrough, but reflects an S polarization component thereof.
If the condition of polarization of the diffused light 7 incident on the hologram 8 is represented by linearly-polarized light 23 as indicated by an arrow in FIG. 35a, the P polarization component and S polarization component of each of the two diffraction light beams 16 and 17 become about a half relative to a respective one of the two return polarized light splitting portions 18 and 19, since the direction of diffraction of the two diffraction light beams 16 and 17 is set to (2n+1) .pi./4 relative to the polarization direction of the linearly-polarized light 23. Therefore, the light amount of each of first and second transmitted light beams 24 and 25, emerging respectively from the two return polarized light splitting portions 18 and 19, is about a half of the light amount of a respective one of the first and second diffraction light beams 16 and 17. The two transmitted light beams 24 and 25 are applied respectively to first and second light-receiving sensors 26 and 27 formed on the sensor base plate 1. First and second reflected light beams 28 and 29 (which are the remainder or the other halves of the two diffraction light beams 16 and 17, respectively), reflected respectively by the two return polarized light splitting portions 18 and 19, are further reflected respectively by first and second reflecting portions 30 and 31 on the first surface 5a to respectively form third and fourth reflected light beams 32 and 33 directed toward the second surface 5b. The third and fourth reflected light beams 32 and 33 pass respectively through first and second transmission windows 34 and 35 on the second surface 5b to form third and fourth transmitted light beams 36 and 37, respectively, which are applied to third and fourth light-receiving sensors 38 and 39, respectively. The focus of the diffraction light 16 is located between the return polarized light splitting portion 18 and the third light-receiving sensor 38 while the focus of the diffraction light 17 is located between the return polarized light splitting portion 19 and the fourth light-receiving sensor 39.
Next, an opto-magnetic signal detection principle will now be described in detail. In FIG. 37, reference numeral 23 denotes the direction of polarization of the linearly-polarized light 23 incident on the hologram 8 as described above. The hologram 8 does not exert any influence on the polarization plane, and therefore if any information is not stored on the information recording surface 11a of the optical disk 11 (that is, the information recording surface 11a is not magnetized), the two diffraction light beams 16 and 17, which are the reflected light of the spot 12, have the same polarization direction as that of the linearly-polarized light 23. With respect to the polarization direction of the two diffraction light beams 16 and 17 in this condition, the directions of diffraction of the two diffraction light beams 16 and 17 are set respectively to 45.degree. and 135.degree. with respect to the polarization direction of the linearly-polarized light 23 so that the diffraction light beams 16 and 17 can be incident respectively on the two return polarized light splitting portions 18 and 19 (which transmit substantially 100% of the P polarization component therethrough, and reflect substantially 100% of the S polarization component) with respective bearings of 45.degree. and 135.degree. as shown in FIG. 37. The direction of rotation of the linearly-polarized light 23, when reflected by a magnetized information pit in the optical disk 11, varies in the range of .+-..theta.k depending on the polarity and magnitude of the magnetization (Kerr effect).
Here, let's assume that linearly-polarized light 40 is obtained by rotating the linearly-polarized light 23 by an angle of .theta.k, and that linearly-polarized light 41 is obtained by rotating the linearly-polarized light 23 by an angle -.theta.k. Here, let's consider the case where the optical signal, modulated from the linearly-polarized light 40 to the linearly-polarized light 41 by the recording magnetic field of the optical disk 11, is incident on the polarized light splitting films of the two polarized light splitting portions 18 and 19.
When the polarization condition of the return convergent light 15 is rotated .theta.k from the condition of the linearly-polarized light 23, the polarization condition of the first diffraction light 16 is modulated into the linearly-polarized light 40 while the polarization condition of the second diffraction light 17 is modulated into the linearly-polarized light 41. When the polarization condition of the return convergent light 15 is rotated -.theta.k from the condition of the linearly-polarized light 23, the polarization condition of the first diffraction light 16 is modulated into the linearly-polarized light 41 while the polarization condition of the second diffraction light 17 is modulated into the linearly-polarized light 40. Therefore, the P polarization component of the second diffraction light 17 is equal to the S polarization component of the first diffraction light 16, and the S polarization component of the second diffraction light 17 is equal to the P polarization component of the first diffraction light 16. An RF reproducing signal is doubled in its signal component because of the differential (expressed by formula (1) described later) between the sum of the signal of the P polarization component of the first diffraction light 16 and the signal of the S polarization component of the second diffraction light 17 and the sum of the signal of the S polarization component of the first diffraction light 16 and the signal of the P polarization component of the second diffraction light 17, and noises in the components of the same phase are canceled, so that the signal with a high C/N ratio can be obtained.
Signals are inputted to and outputted from the sensor base plate 1, having the semiconductor laser chip 2 and the group of light-receiving sensors, through a lead frame 44.
Next, the configuration of the first, second, third and fourth light-receiving sensors 26, 27, 38 and 39, as well as a signal detection principle, will be described with reference to FIG. 38.
The second light-receiving sensor 27 and the fourth light-receiving sensor 39 are a three-division type, that is, the former is divided into three sections 27a, 27b and 27c while the latter is divided into three sections 39a, 39b and 39c. Here, outputs of the first and third light-receiving sensors 26 and 38 are represented by I26 and I38, respectively, outputs of the three sections 27a, 27b and 27c of the second light-receiving sensor 27 are represented by I27a, I27b and I27c, respectively, and outputs of the three sections 39a, 39b and 39c of the fourth light-receiving sensor 39 are represented by I39a, I39b and I39c, respectively.
The RF reproduction signal (R. F.) among the various signals will first be described. As described above, the RF reproduction signal is obtained by the differential between the sum signal representative of the sum of the P polarization component of the diffraction light 16 and the S polarization component of the diffraction light 17 and the sum signal representative of the sum of the S polarization component of the diffraction light 16 and the P polarization component of the diffraction light 17, and therefore R. F. is obtained from the following formula as will be appreciated from a circuit diagram of FIG. 38: EQU R. F.=[I26-(I27a+I27b+I27c)]-[I38-(I39a+I39b+I39c)]
Next, a focus error signal (F. E.) will be described. F. E. is obtained from the following formula as will be appreciated from the circuit diagram of FIG. 38: EQU F. E.=[(I27a+I27c)+I39b]-[(I39a+I39c)+I27b]
Here, let's assume that the spot 12 formed by the objective lens 10 is accurately in focus on the information recording layer 11a of the optical disk 11, and that in this focused condition, the configuration of irradiation of the laser beam on the second light-receiving sensor 27 is represented by 45a while the configuration of irradiation of the laser beam on the fourth light-receiving sensor 39 is represented by 46a. Then, the laser beam-irradiating intensity distribution and the positions of the light-receiving sensors are so adjusted that the following formula can be established: EQU F. E.=0
Next, when the distance between the optical disk 11 and the objective lens 10 decreased from that in the above-mentioned focal distance condition, the configuration of irradiation of the laser beam on the second light-receiving sensor 27 is represented by 45c while the configuration of irradiation of the laser beam on the fourth light-receiving sensor 39 is represented by 46c, and F. E. is varied as indicated in the following formula: EQU F. E.>0
In contrast, when the distance between the optical disk 11 and the objective lens 10 increases from the above-mentioned focal distance condition, the configuration of irradiation of the laser beam on the second light-receiving sensor 27 is represented by 45b while the configuration of irradiation of the laser beam on the fourth light-receiving sensor 39 is represented by 46b, and F. E. is varied as indicated in the following formula: EQU F. E.<0
This focus error detection method is known as a spot-size method.
Next, a tracking error signal (T. E.) will be described. The boundary between the two regions of the hologram 8, having the same area and the different patterns, is extended in the same direction as that of the track of the optical disk, and therefore track information, contained in the reflected light from the optical disk 11, is divided by the hologram 8 into two (right and left) track informations divided by the centerline of the spot 12 extending in the direction of the track. The two track informations are divided into the first and second diffraction light beams 16 and 17. The hologram 8 is so designed that the two regions for the first and second diffraction light beams 16 and 17 have the same diffraction efficiency. Therefore, T. E. is obtained from the following formula as will be appreciated from the circuit diagram of FIG. 38: EQU T. E.=[(I27a+I27b+I27c)+(I39a+I39b+I39c)]-(I26+I38)
When the spot 12 is applied to the centerline of the track, the two regions of the hologram 8 receive the return convergent light 15 in an equal amount, and therefore the two diffraction light beams 16 and 17 are equal in light amount to each other, and the sum signal representative of the sum of the signal of the first light-receiving sensor 26 and the signal of the third light-receiving sensor 38 (which are representative of the light amount of the first diffraction light 16) is equal to the sum signal representative of the sum of the signal of the second light-receiving sensor 27 and the signal of the fourth light-receiving sensor 39 (which are representative of the light amount of the second diffraction light 17). Therefore, T. E. is expressed by the following formula: EQU T. E.=0
When the spot 12 is displaced from the centerline of the track in a direction at 90.degree. with respect to the track, the two regions of the hologram 8 receive the return convergent light 15 in different amounts, respectively, and the sum signal representative of the sum of the signal of the first light-receiving sensor 26 and the signal of the third light-receiving sensor 38 (which are representative of the light amount of the first diffraction light 16) is not equal to the sum signal representative of the sum of the signal of the second light-receiving sensor 27 and the signal of the fourth light-receiving sensor 39 (which are representative of the light amount of the second diffraction light 17). Therefore, T. E. is expressed by either of the following formulas: EQU T. E.>0 EQU T. E.<0
This tracking error detection method is known as a push-pull method.
Thus, the hologram 8 is divided into the two regions of the same area (which have the respective different patterns) by the division line (boundary) extending in the same direction as that of the track of the optical disk 11, and the two regions for the two diffraction light beams 16 and 17 have the same diffraction efficiency. With this design, the tracking error signal can be obtained.
In the manufacture of an optical pickup as disclosed in Japanese Patent Unexamined Publication Nos. 5-258382 and 5-258386, optical guide elements having optical elements provided at boundary surfaces, are laminated or bonded together to form an assembly block and then inclined surfaces are formed. Thereafter, polarization films are formed, and then the assembly block is cut into a predetermined size to thereby provide an optical pickup element.
In the above conventional construction, however, the following problems are encountered, so that the C/N ratio of the RF signal is adversely affected:
Although a hologram is used for separating outward light and return light from each other, zero-order diffraction light is used in the outward path while first order light is used in the return path, and because of a limited angle of incidence on a polarized light splitting portion, the blazing pitch of the hologram is small, and the suppression of the first order diffraction light by blazing is difficult, and besides the first order diffraction efficiency of the S polarization component is lower than the first order diffraction efficiency of the P polarization component. Therefore, the improvement of the efficiency of use of the outward and return light beams (the zero-order diffraction efficiency of the outward light x the first order diffraction efficiency of the return light) is limited, and a loss of the light amount at the hologram is large.
Since the RF signal is also detected by light-receiving sensors of the divided type which detects a focus error, a loss of the light amount occurs at a dead zone of the division portion.
Since a beam splitter film having polarization selectivity is not used, an enhancing effect for increasing the apparent Kerr rotation angle is not obtained.
In addition, the following problems are encountered, so that the focus error signal and the tracking error signal are adversely affected:
The focus error signal is detected by the size of a P polarized-light spot on the light-receiving sensor and the size of a S polarized-light spot on the light-receiving sensor, and therefore when the light amount ratio of the P polarized-light to the S polarized-light of the diffraction light is varied by birefringence, the Kerr rotation and so on, the focus error signal is subjected to offset.
Since the tracking error signal is detected by a push-pull method, this detection is likely to be affected by the depth of pits and grooves in the optical disk.
In the case where the tracking error signal is detected by a 3-beam method using a diffraction grating, crosstalk between a main beam and side beams occurs since the size of the spot on the light-receiving sensor is large.
In the manufacture of the optical pickup as disclosed in Japanese Patent Unexamined Publication Nos. 5-258382 and 5-258386, the number of the optical pickup elements produced from one assembly block is determined by the length of the optical guide members, and besides, since the assembly block has the inclined surfaces, it is difficult to arrange the pickup elements of the same configuration in the direction of the width of the assembly block, which results in a low productivity.
U.S. Pat. No. 5,095,476 and Japanese Patent Unexamined Publication No. 62-117150 are other prior art publications.

Method of manufacturing integrated optical pick-up

Matsushita Electric Industrial Co., Ltd.


A conveyor comprises an endless belt and a belt return device. The endless belt comprises an upper run and a lower run and is configured to convey conveying material in a conveying direction. An intermediate space is defined between the upper run and the lower run. The belt return device facilitates transitioning of the endless belt between the lower run and the upper run. The endless belt defines at least one passage opening which allows the exit of at least a portion of an intermediate space material which is formed by a portion of the conveying material which has reached the intermediate space. At least a portion of the endless belt comprises a conveyor track and a passage track. The passage track defines the at least one passage opening. The conveyor track and the passage track are arranged side by side in the conveying direction.

Conveyors can enable removal of pourable conveying material (e.g., bulk materials) that accumulate when machining materials, such as metallic materials such as steel, aluminum, brass, especially chips. In this case, the resulting material—often together with a liquid coolant and/or lubricant—is supplied from the conveyor for disposal or recycling. The conveyor may at the same time have a filter function with which the liquid coolant and/or lubricant is separated from the solid material and fed to a further use or to a collective supply. The endless belt may have different configurations and, for example, be designed strap-, band- or belt-shaped, or be designed as a hinge.
In conveyors with endless belts, the endless belt is guided between at least two deflecting apparatuses and passes through an upper path, referred to below as the upper run, and a lower path, referred to below as the lower run. Generally, the upper run serves to convey the material to be conveyed from a loading area to an unloading area, while the lower run represents the return run.
It cannot be ruled out that parts of the material to be conveyed reach the area between the upper run and the lower run, referred to below as the intermediate space, and following gravity end up on an intermediate space side of the endless belt in the lower run, said intermediate space side facing the upper run. If the pourable conveying material consists of chips from material processing, these generally have a length from under about 1 mm to about 10 mm and more. The material which has reached the intermediate space side of the endless belt in the lower run is referred to below as the intermediate space material. Lying on the driven endless belt, the intermediate space material gets into the area of the belt return, where it can contaminate parts of the belt return device, such as gears or pulleys, or pile up on it. The intermediate space material, which does not adhere to the belt return device, in turn falls on the intermediate space side of the endless belt in the lower run and can thus again reach the belt return device. With additional material which passes through the upper run or past it into the intermediate space, the intermediate space material continuously accumulates in the area of the belt return device. In particular, chips tend to snag and form larger clew-like structures. It may cause malfunction or damage in the area of the belt return device, which may require expensive cleaning, repair or maintenance.
From JP 3466983 B2 a conveyor for chips from metal machining is known, which proposes to use fixed pulleys for the band return device instead of gears, on which pulleys guide chains of the endless belt can roll. The absence of gear teeth is intended to prevent or at least complicate a settling of the intermediate space material at the band return device. A similar solution is known from U.S. Pat. No. 10,427,261 B2, in which annular deflecting elements serve as a band return device for the endless belt. Material that has arrived in the intermediate space between the lateral guide chains of the endless belt is to be pressed by the contact with the deflecting element into the outer area, where it is taken away by cross struts and fed to the unloading area. This solution only affects the material accumulating in the guide chains. A solution for intermediate space material, which accumulates in the area between the guide chains, is not offered.
US 2016/0263500 A1 discloses a conveyor of the type concerned here, in which a filter box is arranged between the upper run and the lower run. Chips that have entered the intermediate space between the upper run and the lower run do not enter the interior of the filter box, while filtered liquid is supplied via outlet openings to a tank for the filtrate. Inside the filter box at least one brush is arranged, which sweeps over the filter surfaces of the filter box and frees them from deposited chips. The chips thus remain in the intermediate space and can lead to the disadvantages described above.
From EP 1 256 417 B1 a conveyor for chips from metal machining is known, in which the endless belt being a hinge runs between a lower band return device and an upper band return device, wherein the upper band return device is at the same time a chip removal end, at which the transported chips fall from the conveyor into a collecting tank. To avoid the problems with the intermediate space material, a separating plate is to be provided in the intermediate space of the conveyor, which plate extends from the lower belt return device into the vicinity of the chip removal end. Material parts that reach the intermediate space and the lower run are to be guided by means of cross bars that are arranged on the intermediate space side of the endless belt, via the belt return device onto the separating plate and along the separating plate to a discharge mechanism. The discharge mechanism includes an opening in the separation plate and a chute or auger which laterally removes the material falling through the opening. The disadvantage here is the need to ensure a separating plate extending almost over the entire length of the conveyor with a corresponding cost of materials and a reliable transport along this separation plate over its entire extent. Finally, a separate discharge mechanism for the intermediate space material must be provided.
US 2016/0016271 A1 discloses a conveyor for removing chips arising during metal machining, in which the endless belt, which is designed as a hinge, has members which can open or close depending on the position. In the upper run of the conveyor intended for the transport of the chips in the direction of a deposit point, the members are closed and thus contribute to the transport of the chips. In the lower run, however, the members open automatically, following gravity, so chips that have arrived in the intermediate space between lower run and upper run, can fall through the open members from out of the intermediate space onto a housing bottom of the conveyor. From there, the chips can be transported to the upper run by means of outer strips arranged on the outside of the endless belt and supplied for disposal. The automatically opening members extend over the entire width of the surface of the endless belt intended for transport in the upper run. The opening members mean additional expense in manufacturing the endless belt and a further risk of mechanical failure of the system.

Inner cleaning system for endless belt conveyor


An optical controller includes: a transparent lower substrate with a first electrode pattern; a transparent upper substrate with a transparent electrode; a plurality of divided regions separated by partitions on the transparent lower substrate; a medium containing charged particles at less than 5 wt % is in the plurality of divided regions and between the first electrode pattern and the transparent electrode; and a seal surrounding the plurality of divided regions and bonded to the first and second substrates.

1. Field of the Invention
This application claims the benefit of Korean Patent Application No. 10-2013-0001623, filed on Jan. 7, 2013, which is hereby incorporated by reference as if fully set forth herein. The embodiments of the invention relate to an optical controller, and more particularly, an optical controller containing electrophoretic fluid. Although embodiments of the invention are suitable for a wide scope of applications, it is particularly suitable for an electrophoretic display device having a partition structure.
2. Discussion of the Related Art
In general, an electrophoretic fluid has pigment particles suspended in a clear dielectric fluid or a colored transmissive dielectric fluid. Each of the pigment particles has a permanent charge. An electrophoretic device typically includes the electrophoretic fluid between spaced-apart plate-like electrodes. One of the electrodes is typically transparent. The other electrode may have a smaller width than the transparent electrode and be disposed on a lower substrate. When a voltage is applied across the two electrodes, the pigment particles collect at the electrode of polarity opposite that of the charge on the pigment particles. The pigment particles are typically collected at the electrode with a smaller width or at the bottom of a shallow reservoir. Thus, a color of light passing through the electrophoretic device will be the color of the dielectric fluid through which the light passes. A subsequent reversal of the voltage polarity on the electrodes causes the particles to disperse back into the dielectric fluid such that the color is like that of the pigment particles plate.
An electrophoretic display is flat panel display device that can include thousands of electrophoretic devices. Each of the electrophoretic devices should have the same amount of pigment particles and dielectric fluid such that each of the electrophoretic devices have the same performance in response to voltages on the electrodes of the electrophoretic devices. Because the pigment particles are in a fluid, the pigment particles may undesirably move within a display due to gravity such that some electrophoretic devices have significantly more pigment particles than other electrophoretic devices in the display. To prevent undesired movement, such as sedimentation, of the pigment particles within a display, partitions divide the display into cells containing electrophoretic fluid for one or more electrophoretic devices. However, there are difficulties in forming electrophoretic displays with partition structures.
FIG. 1 shows a flow chart for a method of forming an electrophoretic display by continuously dispersing electrophoretic fluid and sealant according to the prior art. As shown in FIG. 1, a method 1 of forming an electrophoretic display according to the prior art includes forming a lower electrode on a lower substrate 2. Then, the method 1 continues by forming a plurality of divided regions on the lower substrate 3. Subsequently, an electrophoretic fluid is continuously dispensed into the divided regions 4.
FIG. 2a illustrates an apparatus and method for continuously dispersing electrophoretic fluid prior to bonding substrates for an electrophoretic display according to the prior art. As shown in FIG. 2a, lower electrodes 11 are formed on a lower substrate 10. The lower substrate 10 is divided into regions by partitions 12. An electrophoretic fluid dispenser 13 moves in a direction D and continuously dispenses electrophoretic fluid 14 onto the lower substrate between the partitions 12 and onto the partitions 12.
As shown in FIG. 1, the method 1 includes continuously dispensing a sealing layer onto electrophoretic fluid 5. Then, the sealing layer is cured on the electrophoretic fluid 6. The curing can be done using ultraviolet light.
FIG. 2b illustrates an apparatus and method for continuously dispersing sealant prior to bonding substrates for an electrophoretic display according to the prior art. As shown in FIG. 2b, a sealing dispenser 15 moves in a direction D and continuously dispenses a sealing layer 16 onto electrophoretic fluid 14. The sealing layer 16 is on the electrophoretic fluid 14 between the partitions 12 as well as the electrophoretic fluid 14 on top of the partitions 12. The sealing layer 16 seals the electrophoretic fluid 14 between the partitions 12 and prevents migration of both the pigment particles and dielectric fluid of the electrophoretic fluid 14.
As shown in FIG. 1, the method 1 includes forming an upper electrode on an upper substrate 7. The upper electrode can be a sputter deposited indium tin oxide. Then, the method 1 includes forming an adhesive layer on the upper substrate 8. The adhesive layer can be an applied double-sided adhesive or a sprayed on adhesive. After the upper and lower substrates are formed, the method 1 includes positioning the adhesive layer of the upper substrate onto the cured sealing layer of the lower substrate to bond the upper and lower substrates together 9.
FIG. 2c illustrates a cross-sectional view of bonding substrates for an electrophoretic display according to the prior art. As shown in FIG. 2c, an upper electrode 18 is formed on an upper substrate 17. The upper substrate 18 is transparent. An adhesive layer 19 is provided on the upper electrode 18. The adhesive layer 19 is positioned to be lowered onto the cured sealing layer 16 to bond the upper substrate 17 and lower substrate 10 together using the adhesive layer 19.
FIG. 2d illustrates a cross-sectional view of an electrophoretic display according to the prior art. As shown in FIG. 2d, the divided regions between the partitions 12 an electrophoretic display according to the prior art may not be uniformly filled with electrophoretic fluid 14. Non-uniformity in filling along with varying sizes of air gaps between the partitions can cause variations in performance amongst an array of pixels in an electrophoretic display device. The ultraviolet curing of sealant on the electrophoretic fluid can cause a chemical reaction between the sealing layer and the pigments particles, which randomly degrades the individual performance characteristics of pigment particles for electrophoresis amongst the array of pixels in an electrophoretic display device. Further, the presence of the sealing layer together with the electrophoretic fluid on top of the partitions can cause the appearance of point defects on the display due varying thicknesses of combinations of sealing layer together with the electrophoretic fluid.

Optical controller containing dispensable electrophoretic fluid and method of dispersing same


In a simplified portable telephone system having a small radius of a radio zone, a channel switching failure during high-speed movement or an instantaneous disconnection at the time of switching often occurs. Judgment is made upon whether a mobile station moves at high speed or low speed based on a degree of reduction in an electric field intensity of a channel currently used for a telephone call, and a radio base station having an electric field intensity, which is above a specified value and shows a largest increases is selected froze surrounding radio base stations which can be a target of channel switching during high-speed movement, thereby performing channel switching.

1. Field of the Invention
The present invention relates to a channel switching system for mobile communication, and more particularly to a channel switching system in the case where a simplified portable telephone terminal moves at high speed.
2. Description of the Related Art
In a mobile communication system in which a radio base station is arranged in each of a plurality of radio zones, a channel switching system for maintaining communication by switching a channel to a radio base station in a remote site is generally effected according to the following procedures when a mobile station moves between the radio base stations.
In the first place, it is detected that the mobile station has moved from, an area of the radio base station with which communication is currently carried out to an area of another radio base station. The radio base station to which the mobile station has moved is then determined to reserve an idle channel in the determined radio base station. A communication channel of the radio base station is finally switched to that of the radio base station to which the mobile station has moved so that communication is directed with a new channel being allocated to the mobile station.
The trigger of channel switching is judged based on intensity of the electric field of the channels.
As an example to which the above-mentioned channel switching technique is applied, there are techniques disclosed in Japanese patent laid-open publication No. 4-70095 and 4-290098.
FIG. 9 is a block diagram for explaining the technique disclosed in Japanese patent laid-open publication No. 4-70095. As shown in the drawing, a service area for mobile communication is constituted by a plurality of radio zones, wherein radio base stations 1a to 1e are provided in the respective radio zones and these radio base stations are connected with a control base station 4. A mobile station 2 communicates with one of these radio base stations and a currently-used channel is switched to another channel of a radio base station in a remote site as the mobile station 2 moves during communication. The channel switching control is performed in the following manner.
The radio base station currently communicating with the mobile station forecasts a radio base station to which the mobile station may subsequently move and informs the mobile station of information about that radio base station. The mobile station which has received the information monitors a receiving level of a control channel of the predicted radio base station to which the mobile station may subsequently move. When the receiving level of the channel from the currently-used radio base station is lowered whereas the receiving level of the channel of the predicted next radio base station which has been monitored increases above a predetermined value, the mobile station requests the radio base station to carry out channel switching and continues communication with the new radio base station.
Further, FIG. 10 is a black diagram for explaining the technique disclosed in Japanese patent laid-open publication No. 4-290098. This technique is such that a plurality of base stations 1 to N are connected with a central station 15 and channel switching is appropriately effected to maintain communication when a mobile device moves between cells formed by the respective base stations. The central station 15 previously stores the receiving electric field intensities at boundaries between the respective cells. A plurality of the base stations measure an electric field intensity of the mobile device to calculate a position of the device, and hence a time taken by the mobile device to reach a boundary between the cells can be calculated to judge a degree of urgency for performing channel switching. The channels are then sequentially switched by determining their priority according to the degree of urgency.
As described above, although various techniques in regard of channel switching system in the mobile communication system have been disclosed, all of them premise to switch to a channel of the radio base station having the strongest electric field intensity.
A transmitting output of a simplified portable telephone typified by a Personal Handy phone System(PHS) is extremely smaller than that of a general portable telephone, and the service area of the radio base station for the simplified portable telephone is so narrow as 150 to 300 meter. In case of adopting a system for changing over to a radio base station having a strongest electric wave at the time of channel switching, if the mobile station moves at high speed, the mobile station has already passed that radio base station when channel switching is performed and channel switching is thereby failed, which may result in disconnection of a phone call. In such a case, even if channel switching is succeeded, since the mobile station passes multiple radio base stations in a short time and channel switching is therefore performed every time the mobile station passes each radio base station, instantaneous disconnection of a phone call due to channel switching often occurs, thereby disabling a satisfactory phone call.

Channel switching system for mobile communication


Presented herein are systems and methods for computing the product of a constant and a mixed number power of two. A circuit comprises a first register, a second register, a memory, a third register, and a multiplier circuit. The first register stores the constant. The second register stores the integer portion and the fraction portion. The memory stores a plurality of values, each of said plurality of values corresponding to a particular one of a corresponding plurality of fractions, wherein each one of said plurality of values is two to the exponential fraction corresponding to the one of said plurality of values. The third register stores a particular one of the plurality of values, said particular one of the plurality of values corresponding to the fraction portion. The multiplier circuit multiplies the contents of the third register by the contents of the first register, thereby resulting in a product. The product is shifted a certain number of times, the certain number of times equal to the integer portion.

An MPEG audio decoder decodes compressed audio data by performing a number of different functions and computations. Among the functions and computations is resealing of frequency coefficients. The resealing of frequency coefficients comprises the multiplication of constants, C, by a power of 2, 2X, where X comprises the sum of an integer and a fraction.
Computation of 2f in hardware is complex where f is a non-integer. Although the computation of 2f is less complex in software, speed considerations involved in decompressing audio data in real time makes a software solution less desirable.
Further limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art through comparison of such systems with embodiments presented in the remainder of the present application with reference to the drawings.

System, and method for calculating product of constant and mixed number power of two


An inspection head for an air gap inspection device. The inspection head may include a pair of expandable shoes, an inspection device attached to the pair of shoes, and a transducer assembly attached to one of the pair of shoes.

The visual inspection of a generator field and stator should be performed on a periodic basis. Conventional generator/stator inspection and testing procedures typically require the complete disassembly of the stator and the removal of the generator field from the stator before any inspections or tests can be performed on the unit. The cost of the disassembly and the removal of the field, the time it takes for this process, and the dangers of field removal have led to the occasional omission of the generator and stator examinations from outage schedules.
In-situ inspections of generators have been performed employing poles, trolleys, and field turning techniques. These procedures have not accomplished the inspection task in a satisfactory manner.
Miniature air gap inspection crawlers are disclosed in commonly owned U.S. Pat. Nos. 5,650,579 and 6,100,711, the contents of which are hereby incorporated by reference. These crawlers are designed to pass through the radial air gap between the core iron and the retaining ring for in-situ inspection of the field and stator core.
Video cameras and other inspection tools attached to the crawler may be used to perform generator field and stator core inspections. For example, a high-resolution video camera provides the operator with a clear view of the stator core laminations, stator wedges, field wedges, and the in-board ends of the retaining rings. The device thus provides detection capability for loose stator wedges, vibration bar sparking, core lamination damage due to foreign objects, motoring and hot spots, field wedge arcing, and surface heating damage. Through the generator in-situ inspection, information is gathered on the condition of the generator that can help determine if field removal is necessary.
Although these known devices are adequate for visual inspection, these visual systems cannot detect internal defects such as cracks or pits in the field teeth. Rather, such cracks can only be found by ultrasonic inspection. Currently, however, the rotor must be pulled out of the stator before an ultrasonic inspection can be performed.
There is a desire therefore for a device and method to perform in-situ ultrasonic inspection of a generator stator and field. The device preferably should be sized to pass through the radial air gap.

Junior ultrasonic miniature air gap inspection crawler


A system for semiconductor wafer testing, a tangent probe card and a probe head assembly thereof. The system has a tangent probe card and a tester. Testing ends of the probe card are flat, hence the allowable alignment budget will always be more generous for the tangent probe card. The probes are held on the probe head assembly, and once the alignment is achieved accurately during manufacture, the alignment will remain stable throughout the whole life cycle. The probe has a greater CCC due to its larger cross section. The throughput of the tangent probes is higher than that of the conventional probe card since there is no need to move the pointed pin/structure. No pointed pin/structure needs to be repaired, and the flat bottom surface of the probe head assembly is easier to clean and maintain.

It is traditional, in the technical field of semiconductor wafer testing, to utilize a probe card as an interface between a tester and a semiconductor wafer. As shown in FIG. 1, traditional probe cards, such as cantilever-type probe cards, vertical probe cards, or MEMS (micro-electro-mechanical system) probe cards, usually contact the surface of a wafer 40 via a pointed pin/structure (as a pointed probe 110′ in FIG. 1). In testing semiconductor wafer, the contact surface of the wafer may be solder bump, Cu pillar, and Si through-holes. With the development of the treatment technologies of wafer, the wafer contact surface will become smaller and smaller. For example, the diameter of the Cu pillar will decrease from 70 μm or so to 30 μm. Therefore, the size of the probe should be decreased accordingly. This confronts the traditional testing methods with many challenges, such as:                alignment of the probe tip with the test target. During probing, it is crucial to align the probe tip with the test target. For example, if the probe tip 111′ fails to reach the top center of the Cu pillar 400 during touchdown, the resulting shear force applied onto the stress point may create fracture to the pillar. With the development of the technologies, the allowable alignment budget between the probe tip and the contact surface will decrease as the probe pitch and the diameter thereof shrunk.        alignment stability of the probe tip. When the diameter of the probe is decreased, the probe will be weakened and become more subjected to deform during probing. A poor alignment will directly affect the performance of the probe card.        current carrying capability of the probe. The transient current may be significantly higher in the case of a finer pitch.        throughput of probe card assemblies. Generally, it is more laborious to handle a finer probe tip and may be likely to increase the manufacturing time.        maintenance and repair of the probe. A finer probe is more prone to breakdown during handling and probing, such that the frequency of maintenance and repair will be increased.

System, a tangent probe card and a probe head assembly for testing semiconductor wafer


A circuit substrate including a silicon substrate with through-holes formed therein, conducting films formed on the inside walls of the through-holes, and an organic resin film formed on the surface of at least one side of the silicon substrate and covering at least parts of the through-holes. Accordingly, even in a case where the through-holes formed, micronized at a small pitch, the substrate does not lower the mechanical strength. Thus, a circuit substrate which is applicable to high-density packaging can be provided.

1. Field of the Invention
The present invention relates to a circuit substrate and a method for fabricating the circuit substrate, more specifically to a circuit substrate and a method for fabricating the circuit substrate which are adaptable to higher density and higher speed.
2. Description of the Related Art
Recently, semiconductor parts used in computers, etc. are rapidly made increasingly adaptable to higher density and higher speed. Circuit substrates as well are accordingly required to be adaptable to the higher density and the higher speed.
One example of the conventional circuit substrates will be explained with reference to FIGS. 7A and 7B. FIG. 7A is a sectional view of the mounted conventional circuit substrate, which shows the structure of the circuit substrate. FIG. 7B is a perspective view of the circuit substrate, which shows the structure of the circuit substrate.
As shown in FIG. 7A, the circuit substrate 100 is mounted on a packaging substrate 106. The circuit substrate 100 and the packaging substrate 106 are electrically connected to each other via solder balls 104a, etc. A decoupling capacitor 108 is formed on the upper surface of the circuit substrate 100. An LSI substrate 110 is mounted on the circuit substrate 100 mounted on the packaging substrate 106. The circuit substrate 100 and the LSI substrate 110 are electrically connected to each other via solder balls 104b, etc.
As shown in FIG. 7B, through-holes 114 are formed in the circuit substrate 100 at a certain pitch. Vias 116 of a metal are buried in the through-holes 114. Usually, passive elements, active elements, etc., such as decoupling capacitors, etc., are formed on the circuit substrate 100 mounted on a packaging substrate 106. In FIG. 7B, these elements, etc. are omitted.
Prescribed interconnections of the LSI substrate 110 and prescribed interconnections of the packaging substrate 106 are electrically connected via the vias 116, electrode pads 102a, 102b and solder balls 104a, 104b.
The above-described circuit substrate generally comprises a resinous substrate, ceramic substrate, as of alumina ceramics, glass ceramics, or other substrates.
The resinous substrate is formed in the following way. First, copper foil internal plates which function as the interconnections, and sheets of carbon fibers impregnated with a thermosetting resin, which is called a prepreg are laid alternately the former on the latter. Then, the laid cooper foil internal layers plates and the prepregs are pressed and sintered to form the resinous substrate. Then the through-holes are formed by mechanical processing using a drill. Next, the surface is plated with copper.
The ceramic substrate is fabricated in the following way. First, a ceramic sheet before sintered, which is called a green sheet is punched to form openings. Then, the surface is plated with copper. Next, a plurality of the green sheets are laid one on another, and pressed and sintered.
Metal is buried by plating in the through-holes formed in the respective substrates to electrically connect the surface of the substrate and the backside of the substrate.
For higher density packaging, the through-holes formed in the substrate are required to have a smaller diameter and a smaller pitch. However, the circuit substrate formed of the resinous substrate or the sintered ceramic substrate has a limit to a smaller diameter of the through-holes and a pitch of the through-holes.
For the ceramic substrate, the through-holes are formed by mechanical processing using a punch, which makes it difficult to form the through-holes at a pitch smaller than a feed pitch of the punch.
For the resinous substrate, the through-holes are formed by mechanical processing using a drill, which makes it difficult to form the through-holes at a pitch smaller than a feed pitch of the drill. In a case where a thin drill is used to make the through-holes micronizsed, there is a risk that the drill may be broken when the through-holes are formed or the substrate itself may be broken. The risk that the substrate itself may be broken is higher when the through-holes are formed of a high aspect ratio are formed at a small pitch.
To bury a metal in the through-holes by plating, the growing velocity of the metal film is low. Accordingly, a long plating time is required. For example, when a metal is buried in the through-holes of a 50 μm-diameter and a 300 μm-depth, about 3 day of the plating are required.
In the case where the through-holes have a high aspect ratio, burying metal by the plating has the following disadvantage. That is, as an aspect ratio of the through-holes is higher, it is more difficult for a plating liquid to intrude into the through-holes, and part of the inside walls of the through-holes are not plated. Resultantly, the electric conductivity is less reliable.
For the resinous substrate, thermal processing of high temperatures generates contaminative gases from the substrate, and melts the substrate itself, which makes it difficult to form passive elements, such as capacitors, etc., on the resinous substrate. The ceramic substrate is formed by sintering, which causes disadvantages of inferior dimensional stability due to variable shrinkages, etc., voids formed in the meal interconnections, and other disadvantages. Such disadvantages make it difficult to apply the ceramic substrate to the micronized devices.
Here, it is considered to use a silicon substrate or a glass substrate in place of the above-described resinous substrate and ceramic substrate. For the silicon substrates, etc., micronized processing by photolithography can be used. Accordingly, more micronized through-holes can be formed in the silicon substrate, etc. than in the resinous substrate, etc. Furthermore, the silicon substrate and the glass substrate are the same material as the LSI chips, or the coefficients of linear expansion of the former are approximate to a linear expansion coefficient of the LSI chips, whereby the generation of stresses due to temperature changes are depressed. Advantageously, the reliability can be improved.
However, to bury metal by plating into the micronized through-holes formed in the silicon substrate, etc. it takes a long time, as does it in the case of the resinous substrates. There is a risk that simply forming the micronized through-holes at a small pitch may break the substrates themselves. Burying metal in the through-holes formed simply at a small pitch will damage the substrates due to stresses applied to the substrates due to the difference of thermal expansion coefficients.

Circuit substrate and method for fabricating the same


Disclosed are modified PET polymer compositions and process for making modified PET polymer compositions by reacting purified terephthalic acid and non-hydrogenated isophthalic acid with ethylene glycol. Compositions with acceptable visual appearance, such as clarity and color, can be made at typical modification levels for many packaging application. Disclosed are also shaped articles and the process for making shaped articles of the modified PET polymer composition.

Polyethylene terephthalate (PET) is a well-known plastic used in great quantities around the world to make products such as bottles, fibers, and packaging. PET is a polyester of terephthalic acid (TPA) and ethylene glycol. Often PET is modified with a carboxylic acid other than TPA and/or a diol other than ethylene glycol to enhance particular physical properties. For example, isophthalic acid is added as a partial replacement to terephthalic acid in commercial polyester production processes to change the morphology of the resultant polyester product. Typical modification levels are 0-5 mole % replacement of primary terephthalic acid, resulting in more desirable properties of the polyester produced. These improved properties include, for example, reduced crystallization rate and improved barrier properties for packaging resins.
As the business of manufacturing polyesters becomes more competitive, alternative manufacturing processes have become highly desirable. Manufacturing costs can be removed from the production of the polyester itself or the production of the raw materials used to make the polyester.
Commercial isophthalic acid (IPA) typically is produced using the same basic process steps as terephthalic acid, but starting with a meta-xylene feed. Commercial isophthalic acid contains low levels of impurities. Like commercial terephthalic acid, this is important for most applications where isophthalic acid is used in significant quantities. It can be appreciated that the importance of absolute purity of the isophthalic acid diminishes as the amount of isophthalic acid used is a lower overall fraction of the monomer mix for making the polyester.
The isophthalic acid production process can be divided into the oxidation zone and the hydrogenation zone. Crude isophthalic acid is produced in the oxidation zone. The crude (or non-hydrogenated) IPA is purified (or hydrogenated) in the hydrogenation zone. The hydrogenation zone typically includes the following steps: (1) replacing the mother liquor of the crude IPA-containing slurry with water, (2) heating the crude IPA/water slurry to dissolve the crude IPA in water, (3) catalytically hydrogenating the crude IPA/water solution to convert impurities to more desirable and/or easily-separable compounds, (4) precipitating the resulting purified IPA from the hydrogenated solution via multiple crystallization steps, and (5) separating the crystallized purified IPA from the remaining liquids. Although effective, this type of conventional purification process can be very expensive. Individual factors contributing to the high cost of conventional crude IPA purification methods include, for example, the heat energy required to promote dissolution of the crude IPA in water, the catalyst required for hydrogenation, the hydrogen stream required for hydrogenation, the yield loss caused by hydrogenation of some isophthalic acid, and the multiple vessels required for multi-step crystallization.
There is a need in the polyester business to decrease the costs of manufacturing PET. This invention relates to production of isophthalic acid of suitable quality without hydrogenation (i.e., non-hydrogenated IPA) for commercial use in polyester processes. Eliminating the hydrogenation zone of the IPA process significantly reduces the capital and operating costs of this PET modifier.

Simplified isophthalic acid process for modifying PET