A heat resistant austenitic stainless steel with high strength at elevated temperatures, good steam oxidation resistance, good fire side corrosion resistance, and a sufficient structural stability, suitable for use in boilers operating at high temperatures has a composition (by weight) of. 0.04 to 0.10% carbon (C), not more than 0.4% silicon (Si), not more than 0.6% manganese (MN), 20 to 27% chromium (Cr), 22.5 to 32% nickel (Ni), not more than 0.5% molybdenum (Mo), 0,20 to 0.60% niobium (Nb), 0.4 to 4.0% tungsten (W), 0.10 to 0.30% nitrogen (N), 0.002 to 0.008% boron (B), less than 0.05% aluminium (Al), at least one of the elements Mg and Ca in amounts less than 0.010% Mg and less than 0.010% Ca, and the balance being iron and inevitable impuities.

The object of this invention is to provide a heat resistant austenitic stainless steel with high strength at elevated temperatures, good steam oxidation resistance, good fire side corrosion resistazce and a sufficient structural stability.
This invention also relates to a structural member of a boiler made of such heat resistant austenitic stainless steel with high strength at elevated temperatures, good steam oxidation resistance, good fire side corrosion resistance, and sufficient structural stability. Such a structural member could for instance be in the shape of an extruded seamless tube.
Austenitic stainless steels have been widely used for example as superheater and reheater tubes in power plants. In order to increase efficiency and meet environmental requirements, power plants will be required to operate at higher temperatures and under higher pressures. As a result, the material used in this type of installations requires improved properties regarding creep strength and corrosion resistance, since the conventional austenitic stainless steels such as AISI 347, AMSI 316 and AISI 310 will not be able to meet these higher demands. Various development efforts have been and are being performed in order to meet these tendencies towards more severe operation conditions in the power plant.
In general the precipitation of carbonides and solid solution hardering through addition of molybdenum and tungsten is effective for improving the strength of austenitic stainless steels at elevated temperatures. In addition there have also been improvements of the strength by adding considerable amount of copper to austenitic stainless steel. Chromium is the essential element used for improving the oxidation and corrosion resistance in high temperature alloys. Furthermore, the nickel content required for ensuring a structurally stable austenitic structure has been reduced in some previously developed alloys, due to substituting with nitrogen.
Generally it is difficult to obtain a corrosion resistant material with a high creep rupture strength that also has an acceptable structural stability, even when nitrogen is added as substitute for some of the expensive nickel. A rather high amount of nickel is needed in this material, with high levels of ferrite forming elements such as chromium, tungsten and niobium in order to suppress the formation of brittle phases such as the sigma phase after long term exposure. Chromium is added for big corrosion resistance and tungsten and niobium for high creep rupture strength. Other sigma phase promoting elements such as silicon and molybdenum have been held low while some elements, other than nickel have been added for the purpose of improving the structural stability.
The present invention provides an alloy with high creep rupture strength at elevated temperatures for long periods of time, a good steam oxidation resistance and fire side corrosion resistance and a sufficient structural stability.
An austenitic stainless steel according to the present invention comprises (by weight) 0.04 to 0.10% carbon (C), not more than 0.4% silicon (Si), not more than 0.6% manganese (Mn), 20 to 27% chromium (Cr), 22.5 to 32% nickel (Ni), not more than 0.5% molybdenum (Mo), 0.20 to 0.60% niobium b), 0.4 to 4.0% tungsten (W), 0.10 to 0.30% nitrogen (N), 0.002 to 0.008% boron (B), less than 0.05% aluminium (Al), at least one of the elements magnesium (g) and calcium (Ca) in amounts less than 0.010% Mg and less than 0.010% Ca, the balance being iron and inevitable impurities. Optionally, 2.0-3.5% copper (Cu) and/or 0.5% to 3% cobalt (Co) and/or 0.02-0.1% titanium (Ti) could be included.
In one embodiment of the present invention, the austenitic stainless steel has a composition that consists essentially of the above-listed constituent elements.
In further embodiment of the present invention, the austenitic stainless steel has a composition that consists of the above-listed constituent elements.

Heat resistant austenitic stainless steel


The invention concerns a magnet system (1) for charging of a superconducting magnet coil (3). The magnet system (1) is characterized by control means (4) for reading-in and controlling which read-in data of a storage medium (7) associated with the superconducting magnet (3) into a power supply (2) and which control the charging of the superconducting magnet coil (3) by the power supply (2) using the read-in data. The magnet system (1) facilitates a fully automatic, safe and rapid charging of a superconducting magnet coil (3) and guarantees better reproduceability and an optimal charging process.

The invention concerns a magnet system having a power supply for charging a superconducting magnet coil.
Superconducting magnet coils, in particular for nuclear magnetic resonance experiments, are usually operated in persistent current mode. A power supply is connected to the magnet coil in preparation for operation of such a magnet system in order to charge the magnet coil with current. Subsequent thereto the power supply is separated and removed (see e.g. M. H. Wilson, Superconducting Magnets, Oxford, 1983, pages 272-274). The charging process of a superconducting magnet coil requires experience and technical skill. In particular, it is important to charge carefully in order to prevent a quench, i.e. a break-down of the superconducting state into the normally conducting state. Such a quench can lead to substantial coolant losses and costs time since the coolant must be refilled prior to newly charging.
In order to prevent a quench it is important to follow a particular charging program in order to charge the coil in a reliable but nevertheless rapid fashion. In addition the properties of a particular coil, in particular its field homogeneity and field stability, can be influenced by the charging procedure. In order to obtain as homogeneous a field for a particular coil as possible, the charging is to be carried out in accordance with a procedure individually tailored to this coil. This is usually done with the assistance of charging instructions. The individualized charging process is carried out by hand by, for example, a technician. Depending on the experience and reliability of the technician it is possible for the power supply to be operated in such a fashion that the magnet is not optimally charged or such that the charging process requires a significantly longer amount of time. In addition the reproduceability of the charging is not guaranteed completely and quenching of the magnet system is possible through improper charging of the coil.
It is consequently the purpose of the present invention to further improve a power supply of the above mentioned kind in such a fashion that the safety, quality, and speed of charging of the magnet coil is improved.


A method of manufacturing a semiconductor device made up of a Bi-CMOS integrated circuit with the performance of MOS and bipolar elements enhanced. A semiconductor substrate surface is selectively oxidized to divide surface into a bipolar element forming area and a MOS element forming area. Next, the entire substrate surface is oxidized to form an oxide film 9, after which high-density ions are implanted into a collector leading area. Then, driving-in of the collector leading area is performed by performing heat treatment in an oxidizing atmosphere while forming an oxide film 9b on the collector leading area and another oxide film 9a on the MOS element forming area. Subsequently, the oxide film is etched all over the semiconductor substrate surface by the thickness of the oxide film 9a to expose the semiconductor substrate surface of the MOS element forming area. Lastly, the substrate surface is entirely oxidized to form a gate insulation film thinner than the oxide film 9.

1. Field of the Invention
The present invention relates to a method of manufacturing a semiconductor device made up of a Bi-CMOS (Complementary Metal Oxide Semiconductor) integrated circuit composed of a bipolar element and a MOS (Metal Oxide Semiconductor) element in a mixed manner.
2. Description of the Related Art
Generally, the Bi-CMOS requires to fabricate bipolar elements, which are vertically arranged elements, and CMOS elements, which are horizontally arranged element, on a same substrate. This, however, makes the fabrication process complicated and therefore increases the number of fabrication steps.
To overcome this problem, a method was proposed in which, for example, the LDD (Lightly Doped Drain) of a MOS element and the base of a bipolar element are formed at the same time in addition to the well and isolation region-common to these elements such that the advantages of both the elements are preserved, thereby forming the bipolar elements in as small number of fabrication steps as possible by matching the fabrication process to the standard CMOS element forming process.
One example of this will be described with reference to the technology disclosed in Japanese Non-examined Patent Publication No. Hei 6-52778.
The following describes the related-art method of manufacturing a semiconductor device made up of a Bi-CMOS integrated circuit with reference to FIGS. 13 through 19.
Now, referring to FIG. 13, a p-type silicon substrate 101 is formed with an n.sup.+ buried layer 102 and a p.sup.+ buried layer 103, on which an n-type epitaxial layer 104 is formed. Next, a p-type well 105 is formed in an n-channel MOS area and an isolation area. Then, by selective oxidization, a p-type channel stopper 107 and a field oxide film 108 are formed.
Referring to FIG. 14, an element forming area is exposed, on which an oxide film 109 as a gate insulation film is grown by thermal oxidization. Then, a polycrystalline silicon layer 110 is grown all over the oxide film 109 by CVD (Chemical Vapor Deposition), all over which a WSi (Tungsten Silicide) layer 111 is grown by sputtering. Next, patterning is performed and an gate electrode 112 of the MOS element is formed.
Referring to FIG. 15, with a photo resist 106 used as a mask, an impurity such as phosphorus is ion-implanted into a collector leading area of the bipolar element.
Referring to FIG. 16, the ion-implanted impurity is diffused by the thermal treatment in nitrogen atmosphere to form an n.sup.+ diffusion layer 113.
Referring to FIG. 17, with a photo resist used as a mask, an n.sup.- diffusion layer 114 that provides the LDD of an n-channel MOS element and an p.sup.- diffusion layer 115 that provides the LDD of a p-channel MOS element are formed in a self aligning manner. At this moment, a p.sup.- diffusion layer 116 as an intrinsic base of the bipolar element is also formed. Next, an oxide film is grown on all over the surface, then an sidewall oxide film 117 is formed on the side of the gate electrode 112 by reactive ion etching. Then, with a photo resist used as a mask, an n.sup.+ diffusion layer 118 that provides the source and drain of the n-channel MOS element and a p.sup.+ diffusion layer 119 that provides the source and drain of the p-channel MOS element are formed by ion-implantation in a self aligning manner. At this moment, a p.sup.+ diffusion layer 120 as a external base of the bipolar element is also formed.
Referring to FIG. 18, after growing an oxide film 121 on all over the surface by CVD, selective etching is performed to form a window 122 over the intrinsic p.sup.- diffusion base layer 116. Next, a polycrystalline silicon layer is formed on the all over surface by CVD, then an impurity such as arsenic is ion-implanted into the polycrystalline, and thermal treatment is performed.
At this moment, due to diffusion of the impurity from the polycrystalline silicon layer, an n.sup.+ diffusion layer 123 that provides a shallow emitter is formed on the p.sup.- diffusion layer 116. Then, patterning is performed to form an emitter electrode 124.
Referring to FIG. 19, after growing an interlayer insulation film 125 on the main surface, selective etching is performed on the interlayer insulation film 125 to form a contact window 126. Finally, an aluminum layer is formed on the main surface by sputtering and then patterning is performed to form an aluminum electrode 127, completing the Bi-CMOS integrated circuit.
The above-mentioned semiconductor device manufacturing method simplifies the manufacturing process by forming the bipolar element and the MOS element on the same semiconductor substrate as the small number of manufacturing steps as possible.
Conventionally, after forming of the gate insulation film and the gate electrode, phosphorus is implanted into the collector leading area and impurity drive-in step by heat treatment is performed. This is done to prevent as far as possible the ion implantation through the insulation film 109 from causing crystalline defect on the substrate surface and the implanted phosphorus from being diffused out into the gas atmosphere.
However, in the conventional manufacturing method, implanting high-density phosphorus and performing impurity diffusion at high temperatures to further lower the resistance of the collector leading area of the bipolar element hinder the increase in the operation speed and integration of the MOS element.
To be more specific, when high-density phosphorus is implanted into the collector leading area, the oxide film 109 needs to be comparatively thick to prevent crystalline defect from occurring on the substrate surface. However, in the conventional technology, this oxide film and the oxide film that provides the gate insulation film of the MOS element are formed in a same step, thereby making the gate insulation film as thick as the oxide film 109. Consequently, only a dose as small as about 5.times.10.sup.15 atoms/cm.sup.2 can be ion-implanted into the area that provides the collector leading area. This prevents the collector leading area of relatively low resistance from being realized.


A battery of the present invention is provided with positive and negative terminals led out of the battery and one or more sealing members filled between the positive and negative terminals and the battery. Each of the sealing members is provided with one or more resin layers, each of which is provided with one or more non-molecular-oriented resin layers.

1. Field of the Invention
The present invention relates to a battery which is resistant to deformation and an automobile provided therewith.
2. Description of the Related Art
To gain an energy density in terms of volume, compact batteries are intently under development. A battery formed in a thin shape is proposed, in which one or more pairs of film-like cathodic electrodes and film-like anodic electrodes are alternately accumulated with separators put therebetween and the electrodes and electrolyte are water-tightly cased. To supply electric power to an outside, terminals need to be led out of the case of the battery with sealing means so that the electrolyte is prevented from leaking out.

Deformation resistant battery, group-battery, multiple group-battery and automobile therewith


A user interface having a plurality of user interface elements for marking, finding, organizing, and processing data stored in a computer system. Each element typically has an appearance which is related to the data or function the element is designed to represent or perform. The elements may simply mark data within the document, or may be programmed to cause the computer to perform some function in association with the marked data. Methods of marking data and searching the memory for marked data by use of switches or buttons is disclosed. Further, useful elements for systems such as computerized camera systems, portable multimedia systems, and remote controls are also described. Some of the user interface elements of the present invention may have an appearance and/or functionality dependent upon the context in which the element is used, and/or dependent upon the user's identity. Methods for arranging the elements in stacks, and for providing for automatic application of elements to captured image data are also disclosed.

1. Field of the Invention
The present invention relates generally to software techniques for marking, decorating and organizing data within a computer system, and more particularly, to a user interface system having a collection of different user interface elements, each having a unique identity and programmed functional characteristic that allows each element to be used to mark, find, organize, and process data in documents within a computer system.
2. Brief Description of the Prior Art
A user interface is something which bridges the gap between a user who seeks to control a device and the software and/or hardware that actually controls that device. A user interface for a phone may be a set of keys. The user interface for a computer is typically a software program running on the computers central processing unit (CPU) which responds to certain user-typed commands. As computers have increased in popularity and availability amongst less computer educated users, the quality of the user interlace has become an ever more important consideration in the development of a computer, since many of these users are not familiar with and/or comfortable with many of the typed commands that are required to operate the computer. One popular type of user interface, which simplifies the operation of a computer, is available on Macintosh computers sold by Apple Computer, Inc., of Cupertino, Calif.
The Macintosh computer user interface employs what is referred to as a desktop metaphor for the basis of its user interface. Through use of a mouse or trackball in communication with the computer, the user can select and/or move certain conic objects on the screen of the computer to control its operation. The desktop metaphor refers to the fact that: (1) the screen of the Macintosh computer often looks somewhat like the blotter of a desktop, with a menu bar across the top of the blotter from which the user can select various control features; (2) there is a trash can icon in the lower right hand corner of the blotter which can be used to remove items from the computer; and (3) programs and documents created with the programs are represented by iconic images of pages which can be placed in iconic images of folders and arranged on the blotter for easy access and organization, like the files of a filing cabinet in an office. These icons can be arranged- on the screen in a number of different manners, such as according to their type, size and color, and the user can search for files by searching for words listed in the title bar associated with each icon, but the user cannot search for a specific iconic image itself.
Another popular portion of the Macintosh user interface is the window feature. When a user selects an icon of a floppy disk or hard disk in a certain manner, a window (a rectangular shaped box which allows the user to "see" the information stored in the drive) appears on the screen of the computer. This window typically contains a number of folder, program and document icons and other images which represent the information stored in the drive. If a user selects a folder icon in a certain manner, the folder will "open" into another window representing the information within that folder. As previously stated, document and program icons can be placed in folder icons, but not vice versa, and no icon can be placed directly on a document. Iconic images have become an important feature of many user interfaces because they can be used to represent different types of data in a form which is readily understandable to the user. Icons, however, have had little functionality associated with them because they are typically only used to represent stored information that a user can access fairly directly, i.e., by selecting the icon. But some icon-like images have had some functionality associated with them, such as the button-like images that can be created with the HyperCard software application sold by Claris Corporation of Mountain View, Calif. The HyperCrad application allows users to create card-like images that can have various images and features associated with them.
One of these features is the button, which can, to a limited extent, be created by the user and given a specific function defined by the user. Each button has an image and a small program or script associated with it which is run each time the button is selected by a user. These scripts can be written by the user using a special language called HyperTalk, which can only be used with the HyperCard program. Buttons are typically only used for mundane tasks, i.e., an image of an arrow may be used to cause the application to flip from one card to another card in response to the arrow being selected by the user. Some buttons are also used to perform some action which is associated with the informational content of the card on which the button appears, i.e., a button on a card displaying a number of musical notes may cause the computer to make sounds representing those notes when the button is selected. A button is limited to representing a task which is to be performed while viewing an associated card in the HyperCard application, and not at some later point in time as directed by the user. For example, a user could not create a "To be printed" button and have the computer latter print every card which contained a "To be printed" button. In addition, buttons are not designed to be used to mark the cards or the data on the cards in any meaningful way to the user.
Another type of functional image is the "Post-it" note used in the FullWrite Professional word processing application by Ashton-Tate Corporation. By choosing the "note" option from the menu bar while writing a document, a small window can be created within which a small amount of text can be entered. When the user closes the window, the window is reduced to a small, generic, symbol which appears at the left-hand margin of the document. The position of the "note" symbol on the page is based on and corresponds to the position of an invisible command, which is entered into the text of the primary document when the user closes the note window. A "note" symbol cannot be moved to a different position along the left margin without moving the position of the invisible command in the text. "Note" symbols can be given names and dates like icons to identify the creator of the note so that notes can be passed to different users and still maintain some level of identity. The name attached to each note, however, cannot be easily customized because the name is taken from the registration information used when the FullWrite application is run the first time. This name can be changed by selecting the "preferences" menu and typing a new name in, but this would not be a desirable manner in which to separately identify each note.
The HyperCard application also allows users to decorate various cards and other documents with special graphic images that can be cut from a card in the HyperCard application and pasted to a different card or a document in a different application. These images, however, are only fanciful bit-mapped designs which have no functionality associated with them. A similar concept is utilized in the KidsPix drawing application for children by Broderbund Software, Inc. of San Rafael, Calif., which provides a palette of different colored "stamps" (bit-mapped graphic designs), which can be selected by a user and stamped (pasted) all over an open document to enhance a picture or drawing. When a stamp is a applied to a document, a noise is issued by the computer to help make the application more entertaining. The same noise is generated for each different stamp. In fact, noises are generally associated with every action performed in the KidsPix application, whether a stamp is selected or a line is drawn. The user cannot program the desired noise the stamp will make when utilized.
One final type of application image which is associated with the same type of function, is the macro program that is often attached to a spreadsheet cell (a bordered area within an electronic document). Spreadsheet applications, such as Microsoft's Excel application, allow the user to create rows and columns of cells within which information can be entered. Separate macro programs can be written to perform certain calculations using the spreadsheet's macro programming language and then associated with a cell so that a series of calculations will be performed and the result will be entered into the cell when that cell is selected. Neither icons, cells, stamps, buttons, nor other types of known graphic images can be used to mark, find, organize and process data in documents within a computer system.
3. Reservation of Copyright
A portion of the disclosure of this patent document contains material to which a claim of copyright protection is made. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent file or records, but reserves all other rights whatsoever.

User interface system having programmable user interface elements


The present invention relates to a method of identifying a compound (agent) which modulates apoptosis in transformed cells. In one embodiment, the invention is a method of identifying a compound which selectively activates apoptosis in transformed cells. In an alternative embodiment, the present invention can be used as a method of identifying a compound which inhibits apoptosis in cells. The invention also relates to a method of selectively killing transformed cells, wherein the transformed cell is contacted with a compound which selectively activates apoptosis in transformed cells, as described herein. The invention also relates to methods of treating diseases associated with defective apoptotic machinery (e.g., cancer, neurodegenerative disease). The methods of the present invention are useful for defining the biochemical mechanisms of apoptosis. In addition, the invention provides an assay to identify compounds which modulate (inhibit, activate) apoptosis, supplying new drugs which target defective apoptotic machinery associated with disease (e.g., cancer, neurodegenerative diseases such as Huntington's Disease and Alzheimers Disease).

Apoptosis is a form of cell death that is carried out by a specialized intrinsic machinery. Although the knowledge about the biochemical mechanisms of apoptosis is fragmentary, it appears that signalling pathways that regulate apoptosis converge on a conserved machinery that disassembles a cell. An essential part of this machinery is a family of proteases related to interleukin-1B-converting enzyme (ICE) (Lazebnik, Y. A., et al., Proc. Natl. Acad. Sci. USA, 92:9042-9046 (1995); (Lazebnik, Y. A., et al ., Nature, 371:346-347 (1994); Nicholson, D. W., et al., Nature, 376:37-43 (1995); Yuan, J., et al., Cell, 641-652:641-652 (1993)). ICE-like proteases (ILPS) are expressed as inactive pro-enzymes that have to be activated to cleave their substrates and to contribute to apoptosis (Horvitz, H. R., et al., Cold Spring Harb. Symp. Quant. Biol., 59:377-385 (1994); Oltvai, Z. N. and Korsmeyer, S. J., Cell, 79:189-192 (1994)).
Cancer chemotherapy kills cells by induction of apoptosis (Lowe, S. W., et al., Cell, 74:957-967 (1993); Fisher, D. E., Cell, 78:539-542 (1994)). Defects of apoptosis common in cancer cells contribute to tumor regression and appear to be responsible for the failure of current cancer chemotherapy. Alternatively excess apoptosis can lead to neurodegenerative diseases (e.g., Huntington's Disease, Alzheimers Disease).
Therefore, more effective chemotherapeutic agents are needed.

Cell-free assay using oncogene-induced apoptosis in drug-resistant cells


A cooling member for a mobile ice rink includes a plurality of pipes for transporting a coolant, wherein the pipes comprise at least two sections coupled by a connector. Cooling elements are provided at the locations of the connectors.

The discussion below is merely provided for general background information and is not intended to be used as an aid in determining the scope of the claimed subject matter.
Aspects of the invention relate to a cooling member for a mobile ice rink comprising a plurality of pipes, typically at least substantially parallel pipes, for transporting a coolant, in particular a cooling liquid, such as glycol, wherein the pipes comprise at least two sections coupled by a connector.
Higher temperatures, direct sunlight, rain, and wind may bring about weak spots and/or irregularities in the ice of the rink near the connectors. Common measures to reduce or prevent such spots and/or irregularities from forming in the ice include increasing the flow of coolant or lowering the temperature of the coolant. These measures significantly reduce energy efficient.


A system on-board an unmanned aerial vehicle for controlling a lateral maneuver to avoid a loss of separation between the unmanned aerial vehicle and an intruder into its airspace. The system receives as inputs the desired miss distance, desired bank angle, state vectors for the unmanned aerial vehicle, wind, and an intruder, and a target vector; and outputs a lateral route change which will achieve the desired miss distance and return the unmanned aerial vehicle back to path. In one embodiment, the system comprises a computer programmed with software that runs automatically and guides the unmanned aerial vehicle to perform a lateral maneuver that avoids loss of separation. In another embodiment, the software runs automatically and advises a pilot on the ground (who is flying the drone by remote control) that a maneuver is about to happen, which maneuver the pilot can either accept or reject.

This invention generally relates to systems and methods for re-routing an airborne vehicle when a potential loss of separation from another airborne vehicle has been determined.
Loss of separation between aircraft occurs whenever specified separation minima are breached. Minimum separation standards for airspace are specified by Air Traffic Services (ATS) authorities, based on FAA (Federal Aviation Administration) standards.
The problem to be solved is to assure separation for a single aerial vehicle against one other aerial vehicle, where both vehicles are en-route and a potential loss of separation (LOS) has been calculated.
The existing solutions are as follows: (1) human intervention, e.g., a traffic controller predicts a loss of separation and directs the vehicle controller how to prevent it; (2) Traffic Alert-Collision Avoidance System (TCAS), which predicts an unsafe separation and generates either an alert or avoidance instruction to the vehicle controller to change altitude.
In the case of human intervention, neither a traffic controller nor a remote pilot provide an on-board capability to avoid other aircraft, which is important when data links fail. TCAS uses altitude changes instead of a lateral maneuver. Air traffic rules dictate that unmanned systems will follow right-of-way rules that not only prescribe a lateral maneuver, but disallow altitude changes for separation. FAA CFR 91.113 (b) states: "When a rule of this section gives another aircraft the right-of-way, the pilot shall give way to that aircraft and may not pass over, under, or ahead of it unless well clear." Also altitude changes have a weakness for a see and avoid capability when the sensor meets the minimum field of regard requirements set forth in F2411-07, Standard Specification for Design and Performance of an Airborne Sense-and-Avoid System. The required field of regard does make all potential threat aircraft vehicles visible. A simple example would be two aircraft following the same ground track at separate altitudes. Also TCAS does not return the vehicle to its original vector as required by F2411-07, Section 188.8.131.52.
There is a need for a solution that avoids the disadvantages of the foregoing existing solutions.


Method and arrangement in a user equipment for adjusting signals transmitted in uplink to a network node based on a feedback value received from the network node. The method includes transmitting a signal, to be received by the network node. A feedback signal is received from the network node, providing feedback on the transmitted signal. A value of a time delay of the received feedback signal is obtained. Signals transmitted in the uplink are adjusted according to the received feedback signal to compensate for the obtained time delay value of the received feedback signal. Related methods and arrangements in a network node are presented.

User equipment (UE), also known as mobile stations, wireless terminals and/or mobile terminals are enabled to communicate wirelessly in a wireless communication system, sometimes also referred to as a cellular radio system. The communication may be made e.g. between two user equipment units, between a user equipment and a regular telephone and/or between a user equipment and a server via a Radio Access Network (RAN) and possibly one or more core networks.
The user equipment units may further be referred to as mobile telephones, cellular telephones, laptops with wireless capability. The user equipment units in the present context may be, for example, portable, pocket-storable, hand-held, computer-comprised, or vehicle-mounted mobile devices, enabled to communicate voice and/or data, via the radio access network, with another entity, such as another user equipment or a server.
The wireless communication system covers a geographical area which is divided into cell areas, with each cell area being served by a network node, or base station e.g. a Radio Base Station (RBS), which in some networks may be referred to as "eNB", "eNodeB", "NodeB" or "B node", depending on the technology and terminology used. The network nodes may be of different classes such as e.g. macro eNodeB, home eNodeB or pico base station, based on transmission power and thereby also cell size. A cell is the geographical area where radio coverage is provided by the network node/base station at a base station site. One base station, situated on the base station site, may serve one or several cells. The network nodes communicate over the air interface operating on radio frequencies with the user equipment units within range of the respective network node.
In some radio access networks, several network nodes may be connected, e.g. by landlines or microwave, to a Radio Network Controller (RNC) e.g. in Universal Mobile Telecommunications System (UMTS). The RNC, also sometimes termed a Base Station Controller (BSC) e.g. in GSM, may supervise and coordinate various activities of the plural network nodes connected thereto. GSM is an abbreviation for Global System for Mobile Communications (originally: Groupe Spécial Mobile).
In 3rd Generation Partnership Project (3GPP) Long Term Evolution (LTE), network nodes, or base stations, which may be referred to as eNodeBs or even eNBs, may be connected to a gateway e.g. a radio access gateway. The radio network controllers may be connected to one or more core networks.
UMTS is a third generation mobile communication system, which evolved from the GSM, and is intended to provide improved mobile communication services based on Wideband Code Division Multiple Access (WCDMA) access technology. UMTS Terrestrial Radio Access Network (UTRAN) is essentially a radio access network using wideband code division multiple access for user equipment units. The 3GPP has undertaken to evolve further the UTRAN and GSM based radio access network technologies.
The 3GPP is responsible for the standardization of UMTS and LTE. LTE is a technology for realizing high-speed packet-based communication that may reach high data rates both in the downlink and in the uplink, and is thought of as a next generation mobile communication system relative UMTS.
In the present context, the expression downlink is used for the transmission path from the network node to the user equipment. The expression uplink is used for the transmission path in the opposite direction i.e. from the user equipment to the network node.
Currently, within the 3GPP, the potential benefits of uplink transmit diversity in the context of High-Speed Uplink Packet Access (HSUPA) is evaluated. With uplink transmit diversity, user equipment that are equipped with two or more transmit antennas are capable of utilizing some or all of them. In the initial phase of standardization of the Uplink Transmit Diversity (ULTD), only Open Loop Transmit Diversity (OLTD) is considered. In OLTD the user equipment autonomously decides the antenna weights. The user equipment selects the precoding vector with the assistance of the existing feedback from the network node, such as uplink Transmit Power Control (TPC) commands, Hybrid Automatic Repeat Request (HARQ) feedback, etc. In WCDMA the uplink TPC commands are sent on the downlink by the Node B via Dedicated Physical Control Channel (DPCCH) or Fractional Dedicated Physical Control Channel (F-DPCH) to control the uplink transmit power of the user equipment. The HARQ feedback information contains information such as ACK/NACK bits. The ACK/NACK is sent by Node B in response to the received data packet from the user equipment. In WCDMA the data packets are sent using Enhanced Uplink (EUL) mechanism via uplink data channel called as Enhanced Dedicated Channel (E-DCH). In WCDMA the ACK/NACK information is sent to the user equipment by the Node B via downlink control channel called as Enhanced HARQ Indication Channel (E-HICH). OLTD includes Open Loop Antenna Switching (OLAS) and Open Loop Beam Forming (OLBF). For WCDMA, the OLTD has been studied. The user equipment does the transmit adaptation of the at least two transmit antennas based on the available existing information. The OLTD according to the uplink TPC statistics is more of interest compared to other metrics such as HARQ feedback due to small delay, high frequency, and good availability.
The functionality of OLAS for WCDMA—High Speed Packet Access (HSPA) will now be explained. There may be at least two transmission antennas and at least one full-power power amplifier comprised in a user equipment capable of OLAS for HSPA. The user equipment may select the transmission antenna, among the at least two available transmission antennas, according to TPC statistics, e.g. following the algorithm:
Action A
Let TPC command DOWN be represented by −1 and TPC command UP by +1. Then let the user equipment accumulate all received TPC commands.
Action B
At each frame border the accumulated TPC sum is compared with 0. If the sum is larger than 0 the transmit antenna is switched.
Action C
If the same transmit antenna has been used for x consecutive frames the user equipment automatically switches antenna. x may be referred as the forced switch circle and determined according to the radio environments.
Action D
Every time an antenna switch occurs the accumulated TPC sum is reset to 0.
When performing OLBF, the situation is somewhat different. The user equipment comprises at least two transmit antennas and e.g. two power amplifiers in the user equipment capable of OLBF for HSPA. With e.g. the herein described algorithm, the user equipment may adjust the beam by adjusting the phase bias between two transmit antennas based on the received TPCs:
1. The phase offset, δ, may be set to e.g. 48 degrees, while ε may be set to e.g. 12 degrees.
2. Let TPC command DOWN be represented by −1 and TPC command UP by +1.                a. Initial relative phase between two transmitters Δφ=−δ/2 for the first slot (#1 slot). ε may be set to zero until two TPC commands become available to the user equipment.        b. Apply relative phase for the next slot Δφ=Δφ+δ        c. Determine new relative phase:                    1. if TPC1>TPC2, Δφ=Δφ+ε            2. if TPC2>TPC1, Δφ=Δφ−ε            3. otherwise, no change            Note that TPC1 and TPC2 correspond to slot (1,2), (3,4), . . . , (i*2−1, i*2), where i=1 to n.                        d. Apply relative phase for the next slot Δφ=Δφ−δ        e. Go to step b.The measurement of propagation delay (PD) within a network may be calculated:PD=(RTT−UERx-Tx)/2  Equation 1Where PD is the propagation delay; UERx-Tx is the time difference between receiving and transmitting at the user equipment while RTT is the Round Trip Time, which is measured by the UTRAN (i.e. by the network node/Node B). Thus the UERx-Tx may be defined as the difference in time between the user equipment uplink Dedicated Physical Control Channel (DPCCH) frame transmission and the first detected path (in time), of the downlink Dedicated Physical Channel (DPCH) or Fractional-DPCH (F-DPCH) frame from the measured radio link. There are two defined methods to measure the UERx-Tx time difference: Type 1 and Type 2.
For Type 1, the reference reception path may be the first detected path (in time) amongst the paths (from the measured radio link) used in the demodulation process.
For Type 2, the reference reception path may be the first detected path (in time) amongst all paths (from the measured radio link) detected by the user equipment. The reference path used for the measurement may therefore be different for Type 1 and Type 2. The reference point for the UERx-Tx time difference may be the antenna connector of the user equipment. Measurement may be made for each cell included in the active set.
The Round Trip Time (RTT) may be defined as:RTT=TRX−TTX  Equation 2where TTX is the time of transmission of the beginning of a downlink DPCH or F-DPCH frame to the user equipment and the reference point for TTX may be the transmission antenna connector; TRX is the time of reception of the beginning (the first detected path, in time) of the corresponding uplink DPCCH frame from the user equipment and the reference point for TRX may be the reception antenna connector.
In addition the Physical Random Access Channel (PRACH) propagation delay which is measured by the network node/Node B may also be specified as a separate measurement in WCDMA/HSPA. The measurement enables the network node/Node B to measure one way propagation delay between the user equipment and the network node/Node B during the PRACH transmission by the user equipment.
The TPC delay comprises the signal processing delay in the network node, D-NB, the propagation delay in the air interface D-P and the signal processing delay in the user equipment, D-UE:
D-NB may be defined as the time between the start of receiving the uplink DPCCH slot and the time the uplink TPC is generated and prepared for downlink transmission. D-NB is thus known to the network node.
D-P is the propagation delay which depends on the distance from the user equipment to the network node. D-P may be estimated by the network node by applying Equation 1 and/or Equation 2.
D-UE may be defined as the time between the start of the receiving of the downlink slot which carries the uplink TPC and the time the uplink TPC is decoded. D-UE is known to the user equipment.TPC delay=D-NB+D-P+D-UE  Equation 3The TPC delay may comprise 2 to several slots depending on the mentioned delay components above. For instance, the TPC delay may increase several slots dependent on the type of uplink receivers.
Concerning the previously discussed OLAS scheme, the user equipment selects antenna based on the received uplink TPC commands in the period when the antenna is used. FIG. 1A shows the timing relationship between the time when the antenna is being used and the time when the generated TPCs based on the uplink DPCCH quality during this period is received at the user equipment. The decision to continue using antenna 1 is taken based on the TPC command received in period T1 and the decision to continue using antenna 2 is taken based on the TPC command received in period T2. As seen when studying FIG. 1A, the decision made based on the TPC command received in the periods T1 and T2 respectively, due to the TPC time delay, may be erroneous, as the decision may be based on transmissions in fact made by the other antenna.
FIG. 1B illustrates the corresponding situation of interaction between TPC delay and OLBF. By comparing the received TPC commands corresponding to the two opposite beam directions, the user equipment determines which direction is correct for beam adjustment and the uplink precoding vector is determined accordingly. FIG. 1B shows the timing of TPC commands for channel sounding. However, a mismatch due to the TPC delay may be critical for finding the correct beam direction.
The problem e.g. in the scenarios discussed in conjunction with OLAS in FIG. 1A and/or OLBF in FIG. 1B is that the user equipment does not know the TPC delay. This may degrade the performance of OLTD and the system performance in uplink.
For OLAS, the ignorance of TPC delay may have following consequence. All the uplink TPC commands received by the user equipment during its time window of statistics may not be generated by the network node, based on the uplink DPCCH quality when the same transmit antenna is used by the user equipment. This decreases the reliability of selecting the antenna based on the uplink TPC statistics. This means the probability to select the poor antenna is increased.
For OLBF, the ignorance of TPC delay may result in that the user equipment may compare the wrong TPC commands during channel sounding phase. This means that the uplink beam may be generated in the wrong directions and consequently the uplink performance of the user equipment is seriously degraded. This also degrades the uplink received signal quality at the network nodes/base stations which receive the misdirected beam.
The high error probability of antenna selection for OLAS or precoding vector selection for OLBF degrades the perceived uplink quality for the user equipment, which in turn also increases uplink power consumption of the user equipment. Furthermore this also causes large variation of the uplink load/interference/Rise-over-Thermal (RoT) in the system and even overall increase in the uplink load/interference/RoT.

Methods and arrangements in a wireless communication system


A sealing device includes an inner race, an outer race capped on and rotatable relatively to the inner race, a rubber oil seal mounted between the inner race and the outer race, a lubricating oil received between the inner race and the outer race, radiation holes formed in the outer race, and a spoiler provided between the inner race and the outer race for causing convection of the lubricating oil to lower the temperature of the lubricating oil upon rotation of the outer race relatively to the inner race.

1. Field of the Invention
The present invention relates to a sealing device for mechanical parts, and more particularly to a sealing device, which is comprised of an inner race, an outer race capped on and rotatable relatively to the inner race, and a rubber oil seal mounted in between the inner race and the outer race.
2. Description of the Related Art
In machinery, sealing devices are used in parts of transmission (rotary) mechanisms, such as rotary shafts, for protection against outside dust and prevention of leakage of internal lubricating oil. To achieve a satisfactory sealing effect, elastic rubber is commonly used as the major part of the sealing device. The functioning of the elastic rubber determines the sealing effect of the sealing device. It is known that temperature is one of the major factors that cause the deterioration of the elastic rubber. A high working temperature accelerates aging of the elastic rubber. Friction between the parts, radiation of sunlight, and temperature change of lubricating oil cause the elastic rubber to deteriorate. Therefore, the ambient temperature has a great concern with the service life of the elastic rubber. It is a practical way to prolong the service life of a sealing device by preventing increase of the working temperature.


A technique includes detecting a presence of a hardware security module in a computer. The hardware security module performs trusted computing base measurements in response to the boot of the computer. The technique includes detecting an intention to change firmware of the computer and regulating providing a message warning about an impact of the change based on the determination. The regulation includes determining whether an operating system of the computer binds operations to the trusted computing base measurements and allowing communication of the message based on the determination.

A computer system may be subject to a security attack in which an external entity seeks to access information that is stored on the computer system or harm components of the computer system. For purposes of preventing or at least inhibiting such security attacks, the computer system may have various mechanisms to limit access, such as firewalls, passwords, keys, and so forth. The computer system may have a hardware security device, such as a trusted platform module (TPM), which may perform various cryptographic services for the computer system.

Regulating messages warning about impacts of firmware changes

Hewlett Packard Enterprise Development LP


The present invention is a latching mechanism and a container employing that latching mechanism, where the container has a lid that is attached to the rear of the container and can be rotated upward from the front. The latch includes an arm that attaches to the walls of the container with a protrusion extending above and abutting a portion of the top of the lid to latch it in place. The latch includes an arm abutment attached to the container above the arm attachment point so that when inward force is applied to the container below the arm, the arm rotates about the arm abutment causing the protrusion to no longer abut the lid, so that the lid can be opened. Such pressure may be applied by lifting arms attached to a garbage truck.

Containers formed from injection molded plastic are widely used for storage and disposal of solid and liquid materials. Such containers generally have a body having a base portion and a set of walls, together defining an interior space for storage of material, with an opening defined by the top edges of the walls. The base may be flat or curved. The walls may have various configurations. The walls generally extend vertically upward from the base, sometimes at an angle so that the horizontal cross-sectional area increases from the base to the top. The horizontal cross-section may be circular or oval, or may be closer to rectangular or square, although generally with the corners being smoothed.
In order to prevent animals from getting at the material stored in the interior region, such containers generally have a lid that is configured to cover and seal the opening. A simple lid may use a friction fit to attach it to the upper edges of the walls. In some cases the lid may be attached to the rear of the walls by a mechanism that allows the lid to rotate about the attachment point so it can move from a closed position in which the opening is sealed to an open position in which the lid is detached from the walls and the lid is substantially spaced apart from the front portion of the walls.
In many areas, a friction fit lid is not sufficient to protect the contents from animals, such as raccoons. Various latching mechanisms have been disclosed to provide a better solution. However, most require a concerted effort by a person in order to unlock the lid. While this is fine for the person putting trash into the container, in some cases it is desirable to use automated systems to pick up the material in the container. Such systems typically employ a pair of lifting arms that extend from a garbage truck and partially surround and squeeze the walls of the container on opposing sides. By squeezing with sufficient force, the arms can hold the container firmly, and the system can automatically lift the container, turning it over and dumping the contents into the truck—as long as the lid is not latched or otherwise held closed. When normal latched containers are used, the driver, or a second person, must get out of the truck and unlatch the lid before the lifting arms grab the container, thus increasing the time and cost for garbage pickup.
Some approaches to addressing this problem have been disclosed but they are complex and expensive and are generally only feasible for industrial scale waste management. For example, locks that automatically unlock due to the force of gravity when the container has been inverted have been disclosed. These are expensive, and also tend to be difficult for a person to use manually when putting trash into the container. Another approach uses a customized container and lifting arms, where the container has a latch on the front side, and the lifting arm has a special mechanism that moves in a pre-defined manner while the container is being picked up specifically in order to open the latch. This is an expensive approach. It would be much preferable to provide a design that allows existing lifting arms to automatically unlatch the lid.


Novel hydroxamic acid compounds, e.g., of formula I,

This invention relates to novel hydroxamic acid compounds which are useful as pharmaceuticals, e.g., in inhibiting matrix metalloproteinases such as collagenase, and in inhibiting TNF production, particularly for treatment of diseases or conditions mediated by over-production of or over-responsiveness to TNFxcex1.
Tumor necrosis factor (TNF) is a cytokine which is produced initially as a membrane-bound 28 kD precursor. It is then cleaved by an enzyme (TNF convertase) and released as a soluble, active 17 kD form. Soluble TNF exists in at least two forms, TNFxcex1 and TNFxcex2, of which TNFxcex1 appears to be the more significant clinically. TNFxcex1 is believed to mediate inflammation and other conditions associated with septic shock or acute infections. Long term overstimulation by TNFxcex1 is believed to play a role in autoimmune and chronic inflammatory conditions, such as arthritis, multiple sclerosis, and the like.
It has been shown that certain matrix metalloproteinase inhibitors of the hydroxamic acid class, in particular 3-imino-4-oxo-heptane-1,7-dioic acid (7-N-hydroxy) diamides (which are optionally further 1-N-, 2-, 5-, and 6-substituted) are capable of mediating TFNxcex1 production, possibly by inhibiting TNF convertase. Known representatives of this class of compounds are summarized and described, e.g., in WO 94/10990.
It has now surprisingly been discovered that a new class of hydroxamic acid derivatives (xe2x80x9cNovel Compoundsxe2x80x9d) are potent TNFxcex1 suppressors and have advantageous pharmaceutical properties, in particular, oral bioavailability.
The Novel Compounds are 3-imino-4-oxo-6-(oxymethyl)-heptane-1,7-dioic acid (7-N-hydroxy) diamides. Suitably, the 6-oxymethyl substituent is of formula II below, e.g., hydroxymethyl or mono- or polyalkoxymethyl. The Novel Compounds may have further substitutions at the 1-N-, 2-, and 5-positions as known in the art, e.g., as described in WO 94/10990, or as further described herein. For example, the Novel Compounds may be 1-N substituted with methyl, pyridyl, or a substituent of formula Xxe2x80x94Yxe2x80x94 or Xxe2x80x2xe2x80x94Yxe2x80x94 as described below, e.g., 3-imino-4-oxo-6-(oxymethyl)-heptane-1,7-dioic acid (1-N-morpholinocarbonylalkyl, 7-N-hydroxy) diamide, and may be in free or pharmaceutically acceptable salt form.
A particularly preferred class of Novel Compounds are 3-imino-4-oxo-5-aryl-6-(oxymethyl)-heptane-1,7-dioic acid (7-N-hydroxy) diamides. The 5-aryl substituent may be as further described herein, e.g. wherein the 5-aryl substituent is phenyl optionally substituted, conveniently at the 4-position, e.g. by hydroxy-, C1-6 alkyl-, C1-6 alkoxy-, amino-, halo- or cyano-. Such 5-aryl substituted Novel Compounds may be in free or pharmaceutically acceptable salt form.
Preferably, the Novel Compounds are of Formula I
wherein
R1 is a substituent of Formula II:
Axe2x80x94(Oxe2x80x94(CR5H)n)mxe2x80x94Oxe2x80x94CH2xe2x80x94xe2x80x83xe2x80x83Formula II
xe2x80x83wherein
n is 1, 2, 3 or 4, preferably 2;
m is 0, 1, 2 or 3;
each R5 is
independently H, C1-6 (optionally hydroxy-, C1-6 alkoxy-, amino-, C1-6 alkylamino-, thiol-, C1-6 alkylmercapto- or protected hydroxy, amino or thiol substituted) alkyl, C2-6 alkenyl, C6-14(optionally hydroxy-, C1-6 alkoxy-, amino-, C1-6 alkylamino-, halo- or cyano- substituted) aryl, or C6-14 (aryl) C1-6 alkyl; preferably H, phenyl, benzyl or C1-5 alkyl;
A is hydrogen, C1-10 alkyl, C6-14 aryl, C6-14 aryl, (C1-6 alkyl), (C6-14 aryl)carbonyl, or (C1-10 alkyl)carbonyl; preferably hydrogen, C1-6 alkyl (e.g., methyl or cyclohexyl), phenyl or benzyl;
R2 is C2-12 alkyl, C3-12 alkenyl, C3-7(optionally hydroxy-, C1-6 alkoxy-, amino-, or C1-6 alkylamino- substituted) cycloalkyl, C5-14 aryl, or C5-14 aryl(C1-6 alkyl), wherein aryl groups are optionally substituted by hydroxy-, C1-6 alkyl-, C1-6 alkoxy-, amino-, halo- or cyano-; preferably phenyl, 4-methylphenyl, 4-methoxyphenyl, cyclohexyl or isobutyl;
R3 is C1-10 (optionally hydroxy- or C1-6 alkoxy- amino-, C1-6 alkylamino-, thiol-, C1-6 alkylmercapto- or protected hydroxy-, amino- or thiol- substituted) alkyl (e.g., t-butyl, or cyclohexylmethyl), C6-14 (optionally hydroxy-, C6-14 aryloxy-, or C1-6 alkoxy-, amino-, C1-6 alkylamino-, halo-, or cyano- substituted) aryl (e.g., benzyl, p-methoxybenzyl, p-benzyloxybenzyl), or indolylmethyl (e.g., 2-indolylmethyl); preferably benzyl or t-butyl;
R4 is methyl, pyridyl, or a substituent of formula Xxe2x80x94Yxe2x80x94 wherein X is morpholino, pyridyl or aryl (preferably morpholino), and Y is C1-12 alkylene in which up to four of the methylene (xe2x80x94CH2xe2x80x94) units are optionally replaced with xe2x80x94COxe2x80x94, xe2x80x94NHxe2x80x94, xe2x80x94SO2xe2x80x94 or xe2x80x94Oxe2x80x94; for example methyl, 2-pyridyl, morpholinocarbonylmethyl, 5-morpholino)pentyl, or 5-(morpholinocarbonyl)pentyl.
xe2x80x9calkylxe2x80x9d includes linear, cyclic, or branched alkyl; and
xe2x80x9carylxe2x80x9d refers to an monovalent aromatic radical containing one or two aromatic rings, e.g., phenyl, benzyl, or tolyl, and includes heteroaryl containing one or more hetero atoms, e.g. N, O or S.
Halo or halogen as used herein refers to F, Cl, Br or I unless otherwise indicated.
Conveniently R1 is a substituent of formula IIxe2x80x2
Axe2x80x94(Oxe2x80x94(CH2)n)mxe2x80x94Oxe2x80x94CH2xe2x80x94xe2x80x83xe2x80x83Formula IIxe2x80x2
wherein A, n and m are as defined above.
In an alternative particular embodiment R1 is a substituent of formula IIxe2x80x3
Axe2x80x94Oxe2x80x94(CHR5xe2x80x94(CH2)n)mxe2x80x2xe2x80x94Oxe2x80x94CH2xe2x80x94xe2x80x83xe2x80x83Formula IIxe2x80x3
wherein A, n and R5 are as defined above and mxe2x80x2 is 0, 1 or 2.
When R4 of formula I is a substituent of formula Xxe2x80x94Yxe2x80x94, it is preferably a substituent of formula Xxe2x80x2xe2x80x94Yxe2x80x94 wherein Xxe2x80x2 is morpholino and Y is as defined above.
In particular embodiments the invention provides Novel Compounds of formula I in which independently:
n of Formula II is 3 or 4; or
R5 of Formula II is not H; or
R2 is C7-12 alkyl, C3-12 alkenyl, C3-7(optionally hydroxy-, C1-6 alkoxy-, amino-, or C1-6 alkylamino- substituted) cycloalkyl, C5-14 aryl, or C5-14 aryl(C1-6 alkyl), wherein aryl groups are optionally substituted by hydroxy-, C1-6 alkyl-, C1-6 alkoxy-, amino-, halo- or cyano-; preferably phenyl, 4-methylphenyl, 4-methoxyphenyl or cyclohexyl; or R3 is C1-10(amino-, C1-6 alkylamino-, thiol-, C1-6 alkylmercapto- or protected hydroxy-, amino- or thiol- substituted)alkyl, C6-14(amino-, C1-6 alkylamino-, halo-, or cyano- substituted)aryl; or
any aryl group thereof is heteroaryl containing one or more hetero atoms, e.g. N, O or S.
In further particular embodiments the invention provides Novel Compounds of formula Ixe2x80x2
in which
R1xe2x80x2 is a substituent of Formula IIxe2x80x2xe2x80x3:
Axe2x80x2xe2x80x94(Oxe2x80x94(CH2)nxe2x80x2)mxe2x80x2xe2x80x94Oxe2x80x94CH2xe2x80x94xe2x80x83xe2x80x83Formula IIxe2x80x2xe2x80x3
xe2x80x83such that
nxe2x80x2 is an integer one or two, preferably two;
mxe2x80x2 is an integer zero, one, two, or three;
Axe2x80x2 is hydrogen, C6-14 aryl, C1-10 alkyl, (C6-14 aryl)carbonyl, or (C1-10 alkyl)carbonyl, (preferably C1-6 alkyl, e.g., methyl or cyclohexyl);
R2xe2x80x2 is C2-6 alkyl, preferably isobutyl;
R3xe2x80x2 is C1-10 (optionally hydroxy- or C1-6 alkoxy-substituted) alkyl (e.g., t-butyl, or cyclohexylmethyl), C6-14 (optionally hydroxy-, C6-14 aryloxy-, or C1-6 alkoxy-substituted) aryl (e.g., benzyl, p-methoxybenzyl, p-benzyloxybenzyl), or indolylmethyl (e.g., 2-indolylmethyl); preferably benzyl or t-butyl;
R4xe2x80x2 is methyl, pyridyl, or a substituent of formula Xxe2x80x94Yxe2x80x94 wherein X is morpholino, pyridyl or aryl (preferably morpholino), and Y is C1-12 alkylene in which up to four of the methylene (xe2x80x94CH2xe2x80x94) units are optionally replaced with xe2x80x94COxe2x80x94, xe2x80x94NHxe2x80x94, xe2x80x94SO2xe2x80x94 or xe2x80x94Oxe2x80x94; for example methyl, 2-pyridyl, morpholinocarbonylmethyl, 5-(morpholino)pentyl, or 5-(morpholinocarbonyl)pentyl;
Preferred Novel Compounds in which R2 is aryl are compounds in which R1 is of formula IIxe2x80x2 as defined above and R2 is phenyl, 4-methylphenyl or 4-methoxyphenyl.
An especially preferred group of compounds of Formula I are compounds wherein:
(i) R1 is of formula IIxe2x80x2 or IIxe2x80x3 (preferably formula IIxe2x80x2) and A of formula II is hydrogen, C1-6 alkyl, e.g., methyl or cyclohexyl (e.g., so that R1 of formula I is for example hydroxymethyl, cyclohexyloxyethoxymethyl, methoxyethoxyethoxymethyl, or hydroxyethyloxymethyl) or (C6-14 aryl)carbonyl, e.g. benzoyl (e.g. so that R1 of formula I is for example benzoyloxymethyl, benzoyloxyethoxyethyl or benzoyloxyethoxyethoxymethyl);
(ii) R2 of formula I is cyclohexyl, phenyl, 4-methylphenyl, 4-methoxyphenyl or isobutyl;
(iii) R3 of formula I is benzyl or t-butyl; and
(iv) R4 of formula I is methyl or morpholinocarbonyl(C1-6)alkyl.
The Novel Compounds may exist in free or salt forms, and salt forms are intended to be encompassed by the scope of the invention. For example, certain of the Novel Compounds may exist as physiologically acceptable acid or base addition salts, e.g. as chlorhydrates, oxalates or fumarates.
The configuration of the Novel Compounds is preferably that of Formula Ia:
or of Formula Ib:
most preferably that of Formula Ia.
Thus the invention includes Novel Compounds when in the form of mixtures of enantiomers, e.g. as racemic mixtures, though preferably when in pure or substantially pure enantiomeric form, e.g. in a form in which the Novel Compound content comprises at least 90%, preferably at least 95%, and especially at least 98%, of a single isomer (i.e. comprises less than 10%, preferably less than 5%, and especially less than 2%, of other Novel Compound isomers.
In further aspects, the invention provides novel processes for the preparation of a compound of formula I or an intermediate of formulae III, IV, or V below, comprising:
a) for preparation of a compound of formula I as defined above, reacting a compound of Formula III:
xe2x80x83wherein R1, R2, R3 and R4 are as defined above, with hydroxylamine (optionally in salt or Oxe2x80x94 substituted form, e.g., hydroxylamine hydrochloride), recovering the product of formula I, and optionally deprotecting the product or separating the desired diastereoisomer if required;
b) for preparation of a compound of Formula III as defined above, oxidizing the olefin bond of a compound of formula IV:
xe2x80x83wherein R1, R2, R3 and R4 are as defined above, e.g., using an oxidation catalyst such as ruthenium(III)chloride hydrate, to obtain the acid of Formula III, and optionally separating the desired diastereoisomer if required;
c) for preparation of a compound of formula IV, reacting a carboxylic acid of formula V
CH2xe2x95x90CHxe2x80x94CH(R1)xe2x80x94CH(R2)xe2x80x94COOHxe2x80x83xe2x80x83Formula V
xe2x80x83wherein R1 and R2 are as defined above, with an amino acid amide of formula VI
NH2xe2x80x94CH(R3)xe2x80x94COxe2x80x94NHR4)xe2x80x83xe2x80x83Formula VI
xe2x80x83wherein R3 and R4 are as defined above, to yield an amide corresponding to formula IV, and optionally separating the desired diastereoisorner if required, and
d) for preparation of a compound of formula V, reacting an alcohol of formula IIIV
xe2x80x83Axe2x80x3xe2x80x94(Oxe2x80x94(CR5H)n)mxe2x80x94OHxe2x80x83xe2x80x83Formula IIIV
wherein Axe2x80x3 is as defined above for A of formula II, except that when A is H, Axe2x80x3 is an O-protecting group (for example a group capable of forming a readily cleavable ether, e.g., benzyl), and wherein R5, n and m are as defined for Formula II above, with a dihalogenated alkene (trans), e.g., 1,4-dibromobut-2-ene, to obtain the disubstituted R1, halo-alkene, e.g., R1xe2x80x94CHxe2x95x90CHxe2x80x94CH2xe2x80x94W (trans), where W is halogen, e.g., bromine, which is then reacted with a carboxylic acid corresponding to R2, i.e. R2xe2x80x94CH2COOH, to yield the ester, which is then rearranged, e.g., in the presence of an organic base such as lithium diisopropyl amide, to give the compound of formula V.
Optionally, protecting and deprotecting steps may be included in the above described processes as necessary to preserve the integrity of the intermediates and the final product.
The invention further includes per se the novel intermediates of formulae III and IV as defined above.
As discussed in the test examples below, the Novel Compounds are potent inhibitors of TNFxcex1 release, are orally active, and are not cytotoxic at their effective doses. The Novel Compounds also inhibit collagenase and stromelysin at concentrations of from 0.3 to 10 nM. The Novel Compounds tested further show oral activity in vivo at dosages of less than 10 mg/kg in LPS induced TNFxcex1 release in the rat, and appear to be well tolerated at such dosages. Accordingly, the Novel Compounds have pharmaceutical utility as follows:
The Novel Compounds are useful for the prophylaxis and treatment of diseases or pathological conditions mediated by TNF, especially TNFxcex1, e.g., inflammatory conditions, autoimmune diseases, severe infections, and organ or tissue transplant rejection, e.g. for the treatment of recipients of heart, lung, combined heart-lung, liver, kidney, pancreatic, skin or corneal transplants and for the prevention of graft-versus-host disease, such as following bone marrow transplants.
The Novel Compounds are particularly useful for the treatment, prevention, or amelioration of autoimmune disease and of inflammatory conditions, in particular inflammatory conditions with an aetiology including an autoimmune component such as arthritis (for example rheumatoid arthritis, arthritis chronica progrediente and arthritis deformans) and rheumatic diseases. Specific auto-immune diseases for which the Novel Compounds may be employed include autoimmune haematological disorders (including e.g. hemolytic anaemia, aplastic anaemia, pure red cell anaemia and idiopathic thrombocytopenia), systemic lupus erythematosus, polychondritis, sclerodoma, Wegener granulamatosis, dermatomyositis, chronic active hepatitis, myasthenia gravis, psoriasis, Steven-Johnson syndrome, idiopathic sprue, autoimmune inflammatory bowel disease (including e.g. ulcerative colitis and Crohn""s disease), endocrine ophthalmopathy, Graves disease, sarcoidosis, multiple sclerosis, primary biliary cirrhosis, juvenile diabetes (diabetes mellitus type I), uveitis (anterior and posterior), keratoconjunctivitis sicca and vernal keratoconjunctivitis, interstitial lung fibrosis, psoriatic arthritis and glomerulonephritis (with and without nephrotic syndrome, e.g. including idiopathic nephrotic syndrome or minimal change nephropathy).
The Novel Compounds are also useful for the treatment, prevention, or amelioration of asthma, bronchitis, pneumoconiosis, pulmonary emphysema, and other obstructive or inflammatory diseases of the airways.
The Novel Compounds are useful for treating undesirable acute and hyperacute inflammatory reactions which are mediated by TNF, especially by TNFxcex1, e.g., acute infections, for example septic shock (e.g., endotoxic shock and adult respiratory distress syndrome), meningitis, pneumonia; and severe burns; and for the treatment of cachexia or wasting syndrome associated with morbid TNF release, consequent to infection, cancer, or organ dysfunction, especially AIDS -related cachexia, e.g., associated with or consequential to HIV infection.
In addition to inhibiting the release of TNF, especially TNFxcex1 through the suppression of TNF convertase, the Novel Compounds are also inhibitors of matrix metalloproteinases, e.g., collagenase, stromelysin and gelatinases, and hence useful for the indications known for collagenase inhibitors or other matrix metalloproteinase inhibitors, e.g., treatment of various pathological conditions of the skin, bones, and connective tissues, e.g., rheumatoid arthritis, psoriasis, psoriatic arthritis, osteoporosis, osteoarthritis, periodontitis, gingivitis, and corneal ulceration; for the treatment of cardiovascular disease, e.g., atherosclerosis, and coronary angioplasty; for the prevention of tumor cell metastasis and invasion and in inducing fibrosis of tumors, e.g., in the treatment of cancer; and for the prevention of neurodegenerative disorders, e.g., Alzheimer""s disease.
For the above indications the appropriate dosage will, of course, vary depending, for example, on the particular Novel Compound employed, the subject to be treated, the mode of administration and the nature and severity of the condition being treated. However, in general, satisfactory results in animals are obtained at daily dosages of from about 1 to about 10 mg/kg/day p.o. In larger mammals, for example humans, an indicated daily dosage is in the range of from about 50 to about 750 mg of Novel Compound administered orally once or, more suitably, in divided dosages two to four times/day.
The Novel Compounds may be administered by any conventional route, e.g. orally, for example in the form of solutions for drinking, tablets or capsules or parenterally, for example in the form of injectable solutions or suspensions. Normally for systemic administration oral dosage forms are preferred, although for some indications the Novel Compounds may also be administered topically or dermally, e.g. in the form of a dermal cream or gel or like preparation or, for the purposes of application to the eye, in the form of an ocular cream, gel or eye-drop preparation; or may be administered by inhalation, e.g., for treating asthma. Suitable unit dosage forms for oral administration comprise e.g. from 25 to 250 mg Novel Compound per unit dosage.
In accordance with the foregoing the present invention also provides in a further series of embodiments:
A. A method of inhibiting production of soluble TNF, especially TNFxcex1, or of reducing inflammation in a subject (i.e., a mammal, especially a human) in need of such treatment which method comprises administering to said subject an effective amount of a Novel Compound, or a method of treating any of the above mentioned conditions, particularly a method of treating an inflammatory or autoimmune disease or condition, e.g., multiple sclerosis or rheumatoid arthritis, or alleviating one or more symptoms of any of the above mentioned conditions.
B. A Novel Compound for use as a pharmaceutical, e.g. for use as an immunosuppressant or antiinflammatory agent or for use in the prevention, amelioration or treatment of any disease or condition as described above, e.g., an autoimmune or inflammatory disease or condition.
C. A pharmaceutical composition comprising a Novel Compound in association with a pharmaceutically acceptable diluent or carrier, e.g., for use as an immunosuppressant or antiinflammatory agent or for use in the prevention, amelioration or treatment of any disease or condition as described above, e.g., an autoimmune or inflammatory disease or condition.
D. Use of a Novel Compound in the manufacture of a medicament for use as an immunosuppressant or anti-inflammatory agent or for use in the prevention, amelioration or treatment of any disease or condition as described above, e.g., an autoimmune of inflammatory disease or condition.

Abstract: wherein R1, R2, R3 and R4 are as defined, are found to be useful as pharmaceuticals, e.g., for the suppression of TNF release and the treatment of autoimmune and inflammatory diseases, e.g., multiple sclerosis and rheumatoid arthritis. Methods of making the compounds, novel intermediates, and pharmaceutical compositions comprising the compounds are provided.


A vented cover includes a pair of cross-flow ventilation ducts each including an acoustic noise reduction lining. The ducts are “cross-flow” in that they cross and bypass one another. The cover is affixed to an enclosure containing components of a computer system and abuts against a panel of the enclosure having an airflow aperture. An air moving device (AMD) passes air through the enclosure from the ducts if the cover is an intake cover, and/or into the ducts if the cover is an exhaust cover. The ducts increase the air path length, and the acoustic absorbing surface, thereby increasing acoustic attenuation. Airflow resistance is reduced by reducing surfaces perpendicular and close to the area where air enters and by reducing sharp turns in the ducts. The cover has a relatively thin depth because the ducts cross and bypass each other in a very space efficient manner.

1. Field of Invention
The present invention relates in general to housings for enclosing computer systems and in particular to vented covers with acoustic attenuation for use with such housings. Still more particularly, the present invention relates to a computer system which includes a vented cover having cross-flow ventilation ducts with an acoustic noise reduction lining.
2. Background Art
Computer systems are using larger amounts of energy, and are generating more heat. Increased heat generation is driven by factors such as increases in processor performance and clock speed, and increases in the number of devices per integrated circuit. Electronic components, such as microprocessors and integrated circuits, must operate within certain specific temperature ranges to perform efficiently. Excessive heat degrades electronic component performance, reliability, life expectancy, and can even cause failure. Air moving devices (AMDs), such as fans and blowers, are widely used for controlling excessive heat. AMDs are often used in combination with heat sinks thermally connected to electronic components to be cooled. Typically, heat sinks are formed with fins to increase the surface area of the heat sink and thereby enhance heat dissipation as air moved by an AMD passes over the heat sink.
In many large server applications, the processors of a computer system along with their associated electronics (e.g., memory, disk drives, power supplies, etc.) are packaged in removable drawer configurations stacked within a rack or frame. In other cases, the processors of a computer system along with their associated electronics may be in fixed locations within the rack or frame. Typically, the components are cooled by air moving in parallel air flow paths, usually front-to-back, impelled by one or more AMDs.
With the advent of the increased heat generated by computer systems, increased ventilation is required to move cooling air through the computer system. A failure to provide adequate ventilation through a computer system may increase the probability of computer failure due to overheating and may result in damage to the electronic components. Due to the great expense of these electronic components and the concomitant loss of processing time associated with such failures, it is desirable that adequate ventilation be maintained for computer systems. Increased air flow rates are needed to provide adequate ventilation. However, the acoustic noise associated with the increased air flow rates required to provide adequate ventilation, as well as acoustic noise generated by the various components within the computer system, represents a problem that must be overcome. There are limits on the acoustic output of computer systems (e.g., servers and storage products) set by vendors, governments, standards setting bodies, and the like.
In order to reduce acoustic noise, it is known to utilize an acoustic noise reduction lining in vented covers of computer systems. An example of such an arrangement is found in U.S. Pat. No. 5,526,228, issued Jun. 11, 1996 to Dickson et al., entitled "COMPUTER SYSTEM UNIT WITH ACOUSTIC DAMPENING COOLING FAN SHROUD PANEL", which is assigned to the assignee of the present application. As shown in FIG. 1, a cooling fan shroud panel 101 includes an acoustic noise reduction lining comprising a side acoustic foam panel 102 and a top acoustic foam panel 104. The acoustic dampening cooling fan shroud panel 101 is mounted to an intermediate rear panel 106 of a computer system unit 100. Two cooling fans 108 are mounted within fan mounting apertures of the intermediate rear panel 106. The cooling fans 108 draw air through computer system unit 100 from an intake ventilation grill (not shown) of a front panel 110 in the direction indicated by the arrows designated with reference numeral 111. Mounted within computer system unit 100 are a power supply 112 and an electronic component package 114, which are cooled by the air drawn through computer system unit 100. Air is directed out an exiting ventilation aperture 116 of cooling fan shroud panel 101 in the direction indicated by the arrow designated with reference numeral 117. The exiting ventilation aperture 116 is displaced from the mounting position of the cooling fans 108 such that acoustic noise resultant from the cooling fan operation is diminished. Even though acoustic dampening cooling fan shroud 101 is effective in diminishing acoustic noise, it exhibits a number of disadvantages. First, the relatively substantial depth of acoustic dampening cooling fan shroud panel 101 significantly increases the footprint of computer system unit 100. Second, the small area of exiting ventilation aperture 116 relative to intermediate rear panel 106 reduces the cooling efficiency.
FIGS. 2 and 3 show other examples of the utilization of acoustic noise reduction lining in vented covers found in the IBM eServer zSeries 900 server. As shown in FIG. 2 (Top View), an inlet cover 210 includes an acoustic noise reduction lining comprising two outer acoustic foam panels 212 and central acoustic foam block 214. An inlet ventilation aperture 216 is defined between outer acoustic foam panels 212. Similarly, an exhaust cover 220 includes an acoustic noise reduction lining comprising two outer acoustic foam panels 222 and central acoustic foam block 224. An exhaust ventilation aperture 226 is defined between outer acoustic foam panels 222. The inlet cover 210 and the exhaust cover 220 are mounted to a computer system frame or rack 200 using hinges (not shown) so that removable drawers (not shown) stacked within computer system frame 200 may be accessed when inlet cover 210 and/or exhaust cover 220 is/are swung open via the hinges. AMDs (not shown) draw air through computer system frame 200 from inlet ventilation aperture 216 and exhaust the air through exhaust ventilation aperture 226. The air moves in the direction indicated by arrows designated by reference numeral 230. The removable drawers, which contain processors and their associated electronics, are cooled by the air drawn through computer system frame 200, as are electronic components fixed within computer system frame 200. Acoustic noise resultant from the AMD operation is effectively diminished by inlet cover 210 and exhaust cover 220 which have three main attributes: a large amount of acoustic absorbing material; an air/noise path that curves or angles to force sound to impact the acoustic lining; and minimum sharp bends in the air path to minimize airflow resistance. Even though inlet cover 210 and exhaust cover 220 are effective in diminishing acoustic noise, they exhibit a number of disadvantages. First, the relatively substantial depth of inlet cover 210 and exhaust cover 220 significantly increase the footprint of computer system frame 200. Second, the central acoustic foam block 224 in the exhaust cover 220 reduces cooling efficiency because it acts as a roadblock to exiting air. Third, inlet cover 210 and exhaust cover 220 cannot be made much more efficient without increasing airflow resistance, or increasing the cover depth (i.e., there are practical limits on how deep inlet cover 210 and exhaust cover 220 can be while still allowing the hinges to open).
FIG. 3 shows a modification of the configuration of inlet and outlet covers shown in FIG. 2 to reduce increase in the footprint of the computer system frame. As shown in FIG. 3, an inlet cover 310 includes an acoustic noise reduction lining comprising two angled outer acoustic foam panels 312 and central acoustic foam panel 314. An inlet ventilation aperture 316 is defined between angled outer acoustic foam panels 312. Similarly, an exhaust cover 320 includes an acoustic noise reduction lining comprising two angled outer acoustic foam panels 322 and central acoustic foam panel 324. An exhaust ventilation aperture 326 is defined between angled outer acoustic foam panels 322. The inlet cover 310 and the exhaust cover 320 are mounted to a computer system frame or rack 300 using hinges (not shown) so that removable drawers (not shown) stacked within computer system frame 300 may be accessed when inlet cover 310 and/or exhaust cover 320 is/are swung open via the hinges. AMDs (not shown) draw air through computer system frame 300 from inlet ventilation aperture 316 and exhaust the air through exhaust ventilation aperture 326. The air moves in the direction indicated by arrows designated by reference numeral 330. The removable drawers, which contain processors and their associated electronics, are cooled by the air drawn through computer system frame 300, as are electronic components fixed within computer system frame 300. As with the configuration shown in FIG. 2, acoustic noise resultant from the AMD operation is effectively diminished by inlet cover 310 and exhaust cover 320, but with a reduced footprint relative to the configuration shown in FIG. 2. Even though inlet cover 310 and exhaust cover 320 are effective in diminishing acoustic noise with a reduced footprint, these covers exhibit all of the other of disadvantages of the configuration shown in FIG. 2.
It should therefore be apparent that a need exists for a computer system enclosure which can both adequately ventilate a computer system housed therein and reduce the amount of acoustic noise, while addressing the disadvantages of the prior art.

Method and apparatus for acoustic noise reduction in a computer system having a vented cover

International Business Machines Corporation


A high purity copper-manganese alloy sputtering target containing 0.05 to 20 wt % of Mn and, excluding additive elements, remainder being Cu and unavoidable impurities, wherein the target contains 0.001 to 0.06 wtppm of P and 0.005 to 5 wtppm of S, and further contains Ca and Si, and a total content of P, S, Ca, and Si is 0.01 to 20 wtppm. The incorporation of appropriate amounts of Mn as well as Ca, P, Si, and S in copper improves the machinability that is required in the stage of producing a target to facilitate the manufacture (workability) of the target, improves the smoothness of the target surface, and inhibits the generation of particles during sputtering. Thus, provided is a high purity copper-manganese alloy sputtering target which is particularly useful for improving the yield and reliability of semiconductor products that progress toward miniaturization and integration.

An Al alloy (specific resistance of roughly 3.0 μΩ·cm) has conventionally been used as the wiring material for a semiconductor device. However, pursuant to the miniaturization of wirings, a copper wiring with lower resistance (specific resistance of roughly 2.0 μΩ·cm) has been put into practical application. As the process for forming a copper wiring, generally adopted is the method of forming a diffusion barrier layer made of Ta or TaN on a wiring or a wiring groove, and thereafter subjecting copper to sputter deposition. High purity copper of 5N to 6N is normally produced by performing wet or dry purification to electrolytic copper having a purity level of 4N (excluding gas components) as the crude metal, and this has been used as a sputtering target.
As described above, while copper is extremely effective as a wiring for semiconductors, copper itself is an extremely active metal and diffuses easily, and there is a problem in that copper contaminates the Si substrate or its periphery through the semiconductor Si substrate or the insulator film formed thereon. In particular, pursuant to the miniaturization of wirings, it is no longer sufficient to merely form a conventional Ta or TaN diffusion barrier layer, and improvements in the copper wiring material itself are demanded. Thus, previously, proposed as the copper wiring material was a copper alloy comprising a self-diffusion suppression function which is realized by adding manganese (Mn) to copper (Cu), and reacting the Mn in the Cu—Mn alloy with the oxygen of the insulator film to self-form a barrier layer.
Examples of a Cu—Mn alloy sputtering target are listed below.
Patent Document 1 describes a sputtering target containing 0.1 to 20.0 at % of Mn and remainder being Cu, wherein concentration of unavoidable impurity elements of which the diffusion coefficient is smaller than the self-diffusion coefficient of Cu is 0.05 at % or less.
Patent Document 2 describes a sputtering target containing 0.1 to 1.0 atomic percent of B as an additive element, further containing 0.1 to 2.0 atomic percent of Mn and/or Ni, and remainder being Cu and unavoidable impurities.
Patent Document 3 describes a sputtering target containing 0.1 to 1.0 atomic percent of B as an additive element, further containing 0.1 to 2.0 atomic percent of elements (including Mn) that develop a compound with B, and the remainder being Cu and unavoidable impurities.
Patent Document 4 describes a sputtering target containing one or more components selected from a group of V, Nb, Fe, Co, Ni, Zn, and Mg and one or more components selected from a group of Sc, Al, Y, and Cr so that the total content thereof becomes 0.005 to 0.5 mass percent, further containing 0.1 to 5 ppm of oxygen, and the remainder being Cu and unavoidable impurities.
Patent Document 5 describes a sputtering target containing more than 6 to 20 mole percent of oxygen, further containing one or more types among Mo, Mn, Ca, Zn, Ni, Ti, Al, Mg and Fe in a total amount of 0.2 to 5 mole percent, and the remainder being Cu and unavoidable impurities.
Patent Document 6 describes a sintered sputtering target material formed from metal powder of Mn, B, Bi or Ge and alloy powder or sintered metal containing X (including Cu) and Y, wherein the material contains 50% or more of crystal grains having an average grain size of 0.1 to 300 μm, and the gas content is 600 ppm or less.
Patent Document 7 describes a sputtering target for inhibiting the generation of particles, wherein the sputtering target contains 0.6 to 30 mass percent of Mn, 40 ppm or less of metal-based impurities, 10 ppm or less of oxygen, 5 ppm or less of nitrogen, 5 ppm or less of hydrogen, 10 ppm or less of carbon, and the remainder being Cu.
In addition, as a wiring material for semiconductor devices proposed by the present Applicant, described is a sputtering target for forming a copper alloy wiring for semiconductors, wherein the material contains 0.05 to 5 wt % of Mn, the total content of one or more elements selected from Sb, Zr, Ti, Cr, Ag, Au, Cd, In, and As is 10 wtppm or less, and the remainder is Cu (refer to Patent Document 8).
Moreover, the present Applicant has previously disclosed a copper alloy wiring material for semiconductors made from a Cu—Mn alloy (refer to Patent Document 9), and in particular proposed a sputtering target, wherein the target contains 0.05 to 20 wt % of Mn, the total content of Be, B, Mg, Al, Si, Ca, Ba, La, and Ce is 500 wtppm or less, and the remainder is Cu and unavoidable impurities.
A copper-manganese alloy sputtering target for use in the foregoing copper alloy wiring and the like for semiconductors aims to improve the performance of the thin film mainly with additive elements.
Generally speaking, upon preparing a target, a copper-manganese alloy ingot obtained through melting and casting is processed into a target shape of a predetermined size, and the surface is thereafter cut to obtain the target. In the foregoing case, the machinability of the target material is an important factor. This is because, since the target is cut and subsequently polished to obtain the ultimate surface form, if the cutting is insufficient, cutting marks will remain on the surface, and it is not possible to obtain the smoothness of the target surface.
When the smoothness of the target surface is improved, it is possible to inhibit the generation of particles during sputtering, and form a thin film with superior uniformity. Nevertheless, the conventional technologies did not develop the target material from this kind of perspective.
Patent Document 1: Japanese Patent No. 4065959
Patent Document 2: JP-A-2009-97085
Patent Document 3: JP-A-2010-248619
Patent Document 4: JP-A-2002-294437
Patent Document 5: JP-A-2008-311283
Patent Document 6: JP-A-2009-74127
Patent Document 7: JP-A-2007-51351
Patent Document 8: JP-A-2006-73863
Patent Document 9: International Publication No. 2008/041535

High purity copper—manganese alloy sputtering target


An optical correlator includes at least one electrically addressable liquid crystal array, at least one LED array for generating a reference image which is modulated by changing the transmissivity of the liquid crystals in the liquid crystal array, and at least one two-dimensional large size photodiode, the photodiode receiving a modulated image from the liquid crystal array. LED and liquid crystal array are stacked together with a photodiode or an array of photodiodes with no space between, for an exceptionally simple, compact and inexpensive optical correlator structure.

1. Field of the Invention
This invention relates to an optical correlator.
2. Description of Related Art
Optical correlators are devices which automatically recognize or identify the contents of an image by combining an incoming image with a reference image, the degree of correlation after combining the images determining the intensity of an output light beam, which is detected by a CCD device for subsequent electronic processing. Such correlators currently find application in, or have been proposed for use in, such diverse fields as target recognition and tracking (including drug interdiction by aircraft type recognition), friend/foe determination, machine vision and robotics, pattern recognition (including face and fingerprint recognition), quality control and inspection, statistics collection by item recognition, inventory control, and image deblurring.
The classical Van der Lugt type of optical correlator uses a lens to perform a fourier transform on an incoming two-dimensional image, after which the light beam carrying the transform is caused to pass through an optical matched filter effectively multiplying the transform with a complex conjugate of the transform of a two-dimensional reference image. An inverse transform lens brings the resulting beam to a point or points of focus on a back focal plane of a CCD device for display or further processing, the intensity of the beam at the focal point or points indicating the degree of correlation. Correlators of this type are described in U.S. Pat. No. 3,779,492 to Grumet, and in the article entitled "Digital Analysis of the Effects of Terrain Clutter on the Performance of Matched Filters for Target Identification and Location", published in SPIE Vol. 186 and Digital Processing of Aerial Images (1979). Additional discussions concerning matched filtering and related techniques are found in U.S. Pat. No. 4,471,445 to Pernick, U.S. Pat. No. 4,490,849 to Grumet et al., and U.S. Pat. No. 4,838,644 to Ochoa et al.
The Van der Lugt type of optical correlator uses spatial light modulators to impress the incoming image on a coherent light beam for subsequent optical transformation. The electrical output of a camera is impressed upon the coherent light beam by changing the shape of a crystal through which the coherent light passes in response to the electrical output of the camera. The light beam is then transmitted through the transform and matched filter lenses. Conventional spatial light modulators are, however, in general very expensive, slow, and have insufficient image size and/or resolution.
Another category of prior optical correlator, in which the reference image is modulated by the incoming image rather than being applied to a spatial light modulator, is the acousto-optic image correlator. In this type of device, the incoming image is captured by a camera and the electrical output of the camera is used to drive an acousto-optic modulator, also known as a Bragg cell. Two-dimensional reference images in digital electronic memory are used to drive one-dimensional laser diode arrays, and the light from the laser diode arrays is imaged at the Bragg cell and then re-imaged onto a charge-coupled detector (CCD) array.
Both types of prior optical correlators use CCD arrays to capture the correlated or combined image. The CCD arrays need to have thousands of pixels. After attempted correlation, all of the pixel information must be clocked in serial fashion for subsequent electronic processing. This creates a major bottleneck and limits the number of correlations/second to a presently insufficient number, generally in the tens and in a few cases the hundreds of correlations per second. For many applications, correlation rates in the thousands per second are necessary.
In addition, both types of prior optical correlator suffer from large size and lack of mechanical stability, resulting from stringent alignment requirements, the need for focusing lenses and other light guiding elements, and the size and complexity of the respective image combining or light modulating elements used to impress information in electronic form onto a light beam.
The present invention, in contrast, does not require either the Bragg cell, laser diode array, and CCD device of the acousto-optic correlator, nor does it require the spatial light modulator, lenses, and filters of the classical Van der Lugt correlator.

Space integrating sliding image optical correlator