An apparatus and method calculate a round-trip delay (RTD) between first and second endpoints within a network, where an intermediate point is selected between the first and second endpoints within the network. A network analyzer determines a first data transmission time from the intermediate point to the first endpoint and back to the intermediate point, determines a second data transmission time from the intermediate point to the second endpoint and back to the intermediate point, and adds the first and second data transmission times to determine therefrom the round trip delay between the first and second endpoints within the network.

A real-time protocol (RTP) provides end-to-end network transport functions suitable for applications transmitting real-time data, such as audio, video or simulation data, over multicast or unicast network services. An RTP stream includes RTP data packets, which includes encoded audio or video information, and a control protocol (RTCP control packets), which carry control information. The RTP stream does not address resource reservation and does not guarantee quality-of-service for real-time services. The data transport is augmented by the RTCP control packets to allow monitoring of the data delivery in a manner scalable to large multicast networks, and to provide minimal control and identification functionality.
The RTP and RTCP data packets are designed to be independent of the underlying transport and network layers. However, the RTP stream itself does not provide any mechanism to ensure timely delivery or provide other quality-of-service guarantees, does not guarantee delivery or prevent out-of-order delivery, nor does the RTP stream assume that an underlying network is reliable and delivers packets in sequence. An increase in the amount of delay between the time when a message signal is sent out and when the message is transmitted back is objectionable as this delay creates, for instance, echo of the message.
A telephone base station provides communication services between telephone users, land or mobile telephones. A method that can be used to estimate a delay introduced by a network involves a use of time stamps in an Internet Control Message Protocol (ICMP). A message is time stamped with an "Originate Time stamp" and sent by a local user to a far-end user. The message, upon arrival at the far-end user, is time-stamped with a "Receive Time stamp" representing a time, with respect to a timing reference, that the message was received at the far-end user. A difference between the "Originate Time stamp" and the "Receive Time stamp" represents a network delay from the local user to the far-end user. The same message is then returned from the far-end user to the local user with a "Transmit Time stamp" indicating a time, with respect to a timing reference, that the message was transmitted from the far-end user. A difference between the time the message is received at the local user and the time indicated by the "Transmit Time stamp" represents a network delay from the far-end user to the local user.
Another method to determine the network delay uses a round trip delay (RTD), which uses a prescribed message transmitted from the local user to the phone and measures the time it takes to complete a round-trip for the prescribed message to return back to the local user. However, in this case, radio waves of the message are subjected to various microwave obstructions, such as buildings, thus the RTD inherently includes a delay resulting from reflection by such obstructions. This type of delay degrades the accuracy of locating an exact position of a mobile phone and degrades message transmission in real time. Furthermore, for the methods described above and for other existing methods to determine RTD, the determination of the RTD must be made at endpoints of the network where the local user and the far-end user are connected.

System and method to calculate round trip delay for real time protocol packet streams


Patients susceptible to or suffering from conditions and disorders, such as central nervous system disorders, are treated by administering to a patient in need thereof compositions that are hydroxybenzoate salts of E-metanicotine-type compounds. The formation of hydroxybenzoate salts of the E-metanicotine compounds is also useful in purifying the E-metanicotine compounds, as the hydroxybenzoate salts tend to crystallize out, leaving impurities such as Z-metanicotine compounds, and compounds where the double bond has migrated, in solution. If desired, the hydroxybenzoate salts can be converted to either the free base (the E-metanicotine) or to another pharmaceutically acceptable salt form.

Nicotine has been proposed to have a number of pharmacological effects. See, for example, Pullan et al., N. Engl. J. Med. 330:811-815 (1994). Certain of those effects can be related to effects upon neurotransmitter release. Release of acetylcholine, dopamine, norepinephrine, serotonin, and glutamate upon administration of nicotine has been reported (Rowell et al., J. Neurochem. 43:1593 (1984); Rapier et al., J. Neurochem. 50:1123 (1988); Sandor et al., Brain Res. 567:313 (1991); Vizi, Br. J. Pharmacol. 47:765 (1973); Hall et al., Biochem. Pharmacol. 21:1829 (1972); Hery et al., Arch. Int. Pharmacodyn. Ther. 296:91 (1977); and Toth et al., Neurochem Res. 17:265 (1992)). Confirmatory reports and additional recent studies have included the modulation in the Central Nervous System (CNS) of glutamate, nitric oxide, GABA, takykinins, cytokines, and peptides (reviewed in Brioni et al., Adv. Pharmacol. 37:153 (1997)). In addition, nicotine reportedly potentiates the pharmacological behavior of certain pharmaceutical compositions used to treat certain disorders. See, for example, Sanberg et al., Pharmacol. Biochem. & Behavior 46:303 (1993); Harsing et al., J. Neurochem. 59:48 (1993); and Hughes, Proceedings from Intl. Symp. Nic. S40 (1994). Furthermore, the neuroprotective effects of nicotine have been proposed, see, for example, Sjak-shie et al., Brain Res. 624:295 (1993). Various other beneficial pharmacological effects have also been proposed. See, for example, Decina et al., Biol. Psychiatry 28:502 (1990); Wagner et al., Pharmacopsychiatry 21:301 (1988); Pomerleau et al., Addictive Behaviors 9:265 (1984); Onaivi et al., Life Sci. 54(3):193 (1994); Tripathi et al., J. Pharmacol. Exp. Ther. 221:91 (1982); and Hamon, Trends in Pharmacol. Res. 15:36 (1994).
Various compounds that target nAChRs have been reported as being useful for treating a wide variety of conditions and disorders. See, for example, Williams et al., DN&P 7(4):205 (1994); Arneric et al., CNS Drug Rev. 1(1):1 (1995); Arneric et al., Exp. Opin. Invest. Drugs 5(1):79 (1996); Bencherif et al., J. Pharmacol. Exp. Ther. 279:1413 (1996); Lippiello et al., J. Pharmacol. Exp. Ther. 279:1422 (1996); Damaj et al., J. Pharmacol. Exp. Ther. 291:390 (1999); Chiari et al., Anesthesiology 91:1447 (1999); Lavand'homme and Eisenbach, Anesthesiology 91:1455 (1999); Holladay et al., J. Med. Chem. 40(28): 4169 (1997); Bannon et al., Science 279: 77 (1998); PCT WO 94/08992; PCT WO 96/31475; PCT WO 96/40682; and U.S. Pat. No. 5,583,140 to Bencherif et al.; U.S. Pat. No. 5,597,919 to Dull et al.; U.S. Pat. No. 5,604,231 to Smith et al.; and U.S. Pat. No. 5,852,041 to Cosford et al. Nicotinic compounds are reported as being particularly useful for treating a wide variety of CNS disorders. Indeed, a wide variety of nicotinic compounds have been reported to have therapeutic properties. See, for example, Bencherif and Schmitt, Current Drug Targets: CNS and Neurological Disorders 1(4): 349-357 (2002), Levin and Rezvani, Current Drug Targets: CNS and Neurological Disorders 1(4): 423-431 (2002), O'Neill, et al., Current Drug Targets: CNS and Neurological Disorders 1(4): 399-411 (2002), U.S. Pat. No. 5,1871,166 to Kikuchi et al., U.S. Pat. No. 5,672,601 to Cignarella, PCT WO 99/21834 and PCT WO 97/40049, UK Patent Application GB 2295387 and European Patent Application 297,858.
CNS disorders are a type of neurological disorder. CNS disorders can be drug-induced; can be attributed to genetic predisposition, infection or trauma; or can be of unknown etiology. CNS disorders comprise neuropsychiatric disorders, neurological diseases, and mental illnesses, and include neurodegenerative diseases, behavioral disorders, cognitive disorders, and cognitive affective disorders. There are several CNS disorders whose clinical manifestations have been attributed to CNS dysfunction (i.e., disorders resulting from inappropriate levels of neurotransmitter release, inappropriate properties of neurotransmitter receptors, and/or inappropriate interaction between neurotransmitters and neurotransmitter receptors). Several CNS disorders can be attributed to a deficiency of acetylcholine, dopamine, norepinephrine, and/or serotonin.
Relatively common CNS disorders include pre-senile dementia (early-onset Alzheimer's disease), senile dementia (dementia of the Alzheimer's type), micro-infarct dementia, AIDS-related dementia, vascular dementia, Creutzfeld-Jakob disease, Pick's disease, Parkinsonism including Parkinson's disease, Lewy body dementia, progressive supranuclear palsy, Huntington's chorea, tardive dyskinesia, hyperkinesia, epilepsy, mania, attention deficit disorder, anxiety, dyslexia, schizophrenia, depression, obsessive-compulsive disorders, and Tourette's syndrome.
Subtypes of nAChRs are present in both the central and peripheral nervous systems, but the distribution of subtypes is heterogeneous. For instance, the subtypes which are predominant in vertebrate brain are α4β2, α7, and α3β2, whereas those which predominate at the autonomic ganglia are α3β4 and those of neuromuscular junction are α1β1δγ and α1β1δε (see for instance Dwoskin et al., Exp. Opin. Ther. Patents 10: 1561 (2000); and Schmitt and Bencherif, Annual Reports in Med. Chem. 35: 41 (2000)).
A limitation of some nicotinic compounds is that they elicit various undesirable pharmacological effects because of their interaction with nAChRs in peripheral tissues (for example, by stimulating muscle and ganglionic nAChR subtypes). It is therefore desirable to have compounds, compositions, and methods for preventing and/or treating various conditions or disorders (e.g., CNS disorders), including alleviating the symptoms of these disorders, where the compounds exhibit nicotinic pharmacology with a beneficial effect on the CNS nAChRs (e.g., upon the functioning of the CNS), but without significant associated effects on the peripheral nAChRs (compounds specific for CNS nAChRs). It is also highly desirable to have compounds, compositions, and methods that affect CNS function without significantly affecting those receptor subtypes which have the potential to induce undesirable side effects (e.g., appreciable activity at cardiovascular and skeletal muscle sites).
Methods for treating and/or preventing the above-described conditions and disorders by administering E-metanicotine compounds, particularly those which maximize the effect on CNS function without significantly affecting those receptor subtypes which have the potential to induce undesirable side effects, have been described in the art. Representative E-metanicotine compounds for use in treating and/or preventing the above-described disorders are disclosed, for example, in U.S. Pat. No. 5,212,188 to Caldwell et al., U.S. Pat. No. 5,604,231 to Smith et al., U.S. Pat. No. 5,616,707 to Crooks et al.; U.S. Pat. No. 5,616,716 to Dull et al., U.S. Pat. No. 5,663,356 to Ruecroft et al., U.S. Pat. No. 5,726,316 to Crooks et al., U.S. Pat. No. 5,811,442 to Bencherif et al., U.S. Pat. No. 5,861,423 to Caldwell et al., PCT WO 97/40011; PCT WO 99/65876 PCT WO 00/007600; and U.S. patent application Ser. No. 09/391,747, filed on Sep. 8, 1999, the contents of each of which are hereby incorporated by reference.
The syntheses described in the art for forming E-metanicotines typically involve performing a Heck reaction between a halogenated heteroaryl ring, such as a halo-pyridine or halo-pyrimidine, and a double bond-containing compound. The double bond-containing compound typically includes either a hydroxy group, which is converted to an amine group to form the E-metanicotine, or includes a protected amine group, which is deprotected following the Heck reaction to form the E-metanicotine. A limitation of the Heck coupling chemistry is that, while the major reaction product is the desired E-metanicotine, there are minor reaction products, including the Z-metanicotine, a metanicotine compound where the double bond has migrated from the position adjacent to the heteroaryl (such as pyridine or pyrimidine) ring (i.e., a non-conjugated double bond), and a compound in which the heteroaryl group is attached at the secondary (as opposed to primary) alkene carbon (i.e., a methylene compound or "exo" double bond). It can be difficult to remove these minor reaction products, particularly on scale-up.
It would be advantageous to provide new methods of preparing purified E-metanicotine compounds substantially free from the above-described minor reaction products. It would also be advantageous to provide new salt forms of these drugs to improve their bioavailability, and/or to assist in preparing large quantities of these compounds in a commercially reasonable manner. The present invention provides such new synthesis methods and new salt forms.

Hydroxybenzoate salts of metanicotine compounds


A motorcycle is provided with a rear fork attached to a body frame so as to swing up and down freely. A rear wheel is attached to the rear end portion of the rear fork, a gear case is attached to a side of the rear wheel, and a drive shaft is provided between the gear case and an output shaft of a power unit. The output of the power unit is transmitted to the rear wheel via the drive shaft and the gear case. In the motorcycle, the gear case is supported by a rear-wheel axle provided in the rear end portion of the rear fork. A torque rod, which links an outer periphery portion of the gear case with the rear fork, serves as a stopper for rotation of the gear case. The resulting configuration provides a shaft-drive system that reduces the assembling time of the torque rod, and improves the productivity of the main line.

1. Field of the Invention
The present invention relates to a motorcycle equipped with a shaft-drive system for transmitting the output of a power unit to a rear wheel.
2. Description of Background Art
A motorcycle equipped with a shaft-drive system for transmitting the output of a power unit to a rear wheel via a drive shaft and a gear case is known by the disclosure of, for example, Japanese Unexamined Patent Application Publication No. Sho 62-43388 (FIG. 1 and FIG. 2).
A motorcycle 1 shown in FIG. 1 and FIG. 2 of the above-mentioned document (the reference numerals used in this and the next paragraphs are of the cited document) is a vehicle that includes: a frame 2; a rear fork 10 attached to the frame 2 so as to swing up and down freely; a rear wheel 11 attached to the rear end portion of the rear fork 10 so as to rotate freely; a gear case 15 provided at a side of the rear wheel 11; a propeller shaft 28 (hereinafter referred to as drive shaft 28) provided between the gear case 15 and a shaft 24 of an engine; and a torque rod 32 provided between the gear case 15 and the frame 2. The driving power is transmitted from the engine to the rear wheel 11 via the drive shaft 28 and the gear case 15.
In the motorcycle 1 of the above-mentioned document, an end 32b of the torque rod 32 is joined to the frame 2, so that the assembling work of the torque rod 32 to the frame 2 has to be done in the main line. As a result, the more time the assembling work of the torque rod 32 takes, the lower the productivity of the main line becomes.


A MEMS electrostatic actuator includes a bottom plate affixed to a substrate and a top plate suspended above the bottom plate. The top plate has a parallel plate center section and two rotating members electrically connected to the center section. Each rotating member is attached centrally of the rotating member for rotation about an axis of rotation to a set of anchor posts. The attachment includes at least one pair of torsional springs attached along each axis, each spring comprising a rectangular metal square that twists as the rotational members rotate. Electrostatic pull-down electrodes are underneath each rotational member.

As shown schematically in FIG. 1, a MEMS electrostatic actuator 10 (also known as a capacitive actuator) generally comprises two parallel electrodes, one electrode (the "bottom plate") 12 of which is typically fixed to a substrate 14 and the other electrode (the "top plate") 16 of which is suspended with a spring suspension 18 spaced by an air gap 20 above the bottom plate. A thin solid dielectric film 22 is deposited on the surface of the bottom plate 12 to prevent shorting. A voltage is applied between the two electrodes, creating an electric field that produces an attractive force between the two electrodes 12, 16. This force causes displacement of the top plate 16, until the top plate 16 makes contact with the dielectric 22 on the bottom plate 12. Once the voltage is removed, the top plate 16 returns to its original position under the restorative force of spring suspension 18.
A parallel plate actuator with a torsional architecture is described in P. Famelli, et al., "A Wide Tuning Range MEMS Varactor Based on a Toggle Push-Pull Mechanism," Microwave Integrated Circuit Conference, 474-477 (2008), and in F. Solazzi, et al., "Active Recovering Mechanism for High Performance RF MEMS Redundancy Switches," Proceedings of the 40th European Microwave Conference, 93-96 (September 2010), both of which are hereby incorporated herein by reference.
One problem that arises in connection with MEMS capacitive actuators is stiction—static friction associated with adhesion of contacting surfaces. Stiction occurs when Van der Waals forces and the like cause the top plate to stick down on the dielectric on the bottom plate, even after the actuation voltage is removed.
A second problem arises when the top plate is landed on the bottom plate. At this point, the electric field across the thin solid dielectric that separates the two plates is very high. This causes electrostatic charge to be injected into the dielectric, a phenomenon known as dielectric charging. The charged dielectric has its own contribution to the electric field between the two plates, and it can cause undesirable effects: It can change the release voltage, the voltage at which the top plate returns to its original position. It can change the land voltage, the voltage at which the top plate lands on the bottom plate. It can shift the voltage that produces minimum capacitance away from OV. These issues are problems for repeatability and reliability, and they can cause early device failure.
A third problem that arises when the device is used as a variable capacitor for RF applications is self-actuation. When RF energy is applied to the plates, the RMS voltage of the RF signal can cause the top plate to move and potentially even land on the bottom plate, even if there is no DC actuation voltage present. This is especially a problem in high power RF applications, as it limits the power-handling specification for the device.
A fourth problem, similar to self-actuation, is self-latching. In RF applications, when the top plate is landed on the bottom plate, the RMS voltage on the RF signal on the bottom plate can hold the top plate down and prevent it from releasing, even when the DC actuation voltage is removed. This effectively prevents hot-switching, and presents a significant problem if the device is used in CDMA systems. The self-latching voltage is usually much lower than the self-actuation voltage.
A fifth problem is related to the flatness of the suspended top plate. Since the device is a parallel plate capacitor, both plates should ideally be flat and parallel. However, residual stresses from manufacturing can cause the top plate to curl. When the top plate is landed on the bottom plate, this curling creates an air gap between the two plates, greatly reducing on-state capacitance. This is illustrated in FIG. 2 which shows top plate 16 landed on solid dielectric layer 22 above bottom plate 12 on substrate 14. Top plate 16 is curled downward making contact peripherally with dielectric 22 over bottom plate 12 and leaving an air gap 20′ centrally between the regions of contact.
Other problems are slow switching speed and slow actuator settling time upon release. When the DC actuation voltage is removed, the top plate moves upward due to the restoring force of its spring suspension. Generally, this mass-spring system is underdamped, causing oscillation. The problem arises when the settling time for the oscillation is longer than the maximum switching time of the system, for example in transmit/receive switching application for GSM mobile handsets.
Another problem is one of system integration. In a typical RF handset application, there is no high voltage power supply available. Adding an off-chip supply is highly undesirable due to cost and board real estate. Therefore, the DC actuation voltage must be supplied by on-chip circuitry. It is a manufacturing challenge to co-locate MEMS and CMOS components. RF CMOS processes may provide good RF performance, but may be cost prohibitive. Also, they may not have the right component set required to generate an on-chip electrostatic supply. On the other hand, standard mixed signal processes provide poor RF performance. Moreover, there is a limit to the magnitude of the voltage that can be generated on the chip. As such, the actuation voltage of the MEMS structure must be below that limit.


Embodiments of the invention provide a method, system and computer program product for content caching with remote filtering services in a radio access network (RAN). In an embodiment of the invention, a method for content caching with remote filtering services in a RAN can include receiving a response to a request from an end user device wirelessly coupled to a base station of the RAN, marking the response as uncacheable, and routing the response to the base station over a data communications network. In one aspect of the embodiment, the response can be received in an RNC of the RAN. Of note, the process of marking the response as uncacheable can depend upon the evaluation of a policy with respect to the response.

Field of the Invention
The present invention relates to content retrieval services provided in a radio access network and more particularly to the caching of retrieved content in a radio access network.
Description of the Related Art
The radio access network (RAN) provides for the foundation of modern cellular telephony. The RAN functions to join different end user mobile devices to a core network (CN) such that individuals can enjoy telephonic and data communications wirelessly within a geographic area covered by the various base stations of the radio access network. Generally speaking, the RAN provides the requisite infrastructure to pass both voice and data traffic from the over-the-air medium to both the terrestrial circuit switched communication network and the packet switched data communications network inclusive of the global Internet.
At present, several standards have been implemented in connection with the RAN. Examples include the global system for mobile communications (GSM), the universal mobile telecommunications system (UMTS) and the GSM "Edge" RAN (GERAN). The RAN generally includes multiple different radio network controllers (RNC) each managing a set of base stations providing wireless connectivity to a geographic cell. The entirety of the different RNCs of the RAN are linked to what is known as the cellular data core or CN through a gateway known as the serving generalized radio packet service node (SGSN). The CN provides various services to customers who are connected by the RAN. One of the main functions is to route calls across the public switched telephone network (PSTN). Another is to route data packets onto an Internet protocol (IP) network such as the global Internet so that end users of the RAN can access services provided by a content delivery network (CDN). To that end, the CN includes a gateway known as the gateway GPRS service node (GGSN).
The typical CDN can provide for advanced content delivery services such as content caching and content filtering. Content caching refers to the intermediate temporary storage of previously retrieved content under the assumption that a temporally proximate subsequent request for the content can be satisfied from temporary storage rather than repeating a more time consuming request for content in the CDN. In contrast, content filtering refers to the restriction of the delivery of requested content when the content meets a particular profile such as being published by a particular source or incorporating particular subject matter. In both instances, the packet processing requisite to performing advanced content services often demand that those services are provided within the CN where the communications protocol utilized in the CN is consistent with that of the global Internet—namely the transport control protocol (TCP) over IP.
Even still, some have suggested placing support for content services such as content caching and content filtering within the RAN. In this regard, United States Patent Application Publication No. 20100034089 by Kovvali et al. suggests the placement of content caching services within the RAN and the extraction of TCP/IP payloads from the RAN protocol specific to the RAN. Notwithstanding, placing content services like caching and filtering even closer to the end user within the various base stations is not desirable in as much as to do so requires hardening of computing devices supporting the content services due to the physical environment of the base station. As such, when content services are performed at the base station, only a minimal computing device is provided to handle only the most basic content services. However, oftentimes it is desirable to perform more than just the most basic content services. For instance, in many instances it is desirable to perform charging services for the content services delivered to end users. To the extent that charging services require more than the most basic computational device, charging services along with the corresponding content services are provided together in the RAN as a matter of convenience.

Ensuring content filtering through a specialized tier of proxy caches at the base station

International Business Machines Corporation


Demanufacturing workload is forecast based on anticipated volumes of equipment to be disassembled and/or salvaged, as well as equipment complexity factors determined by disassembly prototyping. Staffing requirements are unique for each customer and are based on the number of pounds needed to be worked during each month and the associated complexity (work content multiplier) for that customer's typical or expected returns.

1. Technical Field of the Invention
This invention pertains to workload forecasting. More particularly, it relates to workload planning for demanufacturing operations such as dismantle and salvage.
2. Background Art
As the life cycle of computers and other complex electrical equipment continues to decrease due to new technology and improved processing performance, the useful life span of equipment has become correspondingly shorter. Dismantling this equipment and salvaging useful components and materials has become imperative from both an economic and environmental standpoint. As a result, dismantle and salvage companies are faced with an increasing volume and diversity of returned end of life equipment. That is, given the varying complexity of obsolete equipment, planning workload and staffing related to dismantle and salvage operations presents a significant challenge. Dynamic changes are required by such companies to meet the required capacity in people, space, and capital equipment—all costly investments. Therefore, the performance of demanufacturing operations becomes critical to not only ensuring proper environmental disposal options, but also improving process efficiency and minimizing expense.
It is an object of the invention to provide an improved system and method for forecasting staffing and equipment requirements.
It is a further object of the invention to provide a system and method for forecasting staffing and equipment requirements for a demanufacturing enterprise.
It is a further object of the invention to provide a system and method for forecasting staffing and equipment requirements based on customer disposal plans and historical data.

System and method for forecasting demanufacturing requirements


An apparatus to detect interference in wireless signals, comprising an antenna for receiving a wireless signal; and wherein the apparatus is operable to identify a dominant waveform in the received signal; subtract the dominant waveform from the received signal to create a modified received signal; and repeat the above steps, recursively substituting the modified received signal for the received signal, until all adjusted reference waveforms have been subtracted.

Technical Field
The present invention relates to apparatus for detecting interference in wireless signals
Related Art
Signal interference is the inevitable result of the proliferation of wireless systems. Home networking, Bluetooth enabled devices, broadcast digital television, or even a microwave oven, can all contribute potential interference. Regulatory and environmental restrictions further compound these problems by limiting the distribution of new transmitter sites, forcing base station transceivers to share towers.
There are several apparatus on the market today designed to detect interference which may affect the quality of wireless signals. These apparatus include, for example, the Anritsu MT8222A Base Station Analyzer and the MS272xB line of Spectrum Analyzers, all available from Anritsu Company, Morgan Hill, Calif. These apparatus, among others, implement several methods of measuring and analyzing interference including measuring signal strength, received signal strength indication (RSSI), spectrograms, real-time scanning, and Error Vector Spectrum (EVS). However, when interference is weak enough to be buried under the spectrum of the desired signal and when the desired signal is present during the entire period of time that interference is present, current apparatus' ability to detect interference is weakened.
Thus, it is desirable to provide an apparatus for detecting interference in wireless signals.

Apparatus to detect interference in wireless signals


A method and system provide a magnetic junction usable in a magnetic device. The magnetic junction includes a plurality of magnetic layers including a nonmagnetic spacer layer. The magnetic junction also includes at least one diffusionless transformation layer. The magnetic junction is configured to be switchable between a plurality of stable magnetic states when a write current is passed through the magnetic junction.

Magnetic memories, particularly magnetic random access memories (MRAMs), have drawn increasing interest due to their potential for high read/write speed, excellent endurance, non-volatility and low power consumption during operation. An MRAM can store information utilizing magnetic materials as an information recording medium. One type of MRAM is a spin transfer torque random access memory (STT-MRAM). STT-MRAM utilizes magnetic junctions written at least in part by a current driven through the magnetic junction. A spin polarized current driven through the magnetic junction exerts a spin torque on the magnetic moments in the magnetic junction. As a result, layer(s) having magnetic moments that are responsive to the spin torque may be switched to a desired state.
For example, FIG. 1 depicts a conventional magnetic tunneling junction (MTJ) 10 as it may be used in a conventional STT-MRAM. The conventional MTJ 10 typically resides on a bottom contact 11, uses conventional seed layer(s) 12 and includes a conventional antiferromagnetic (AFM) layer 14, a conventional reference layer 16, a conventional tunneling barrier layer 18, a conventional free layer 20, and a conventional capping layer 22. Also shown is top contact 24.
The conventional seed layer(s) 12 are typically utilized to aid in the growth of subsequent layers, such as the AFM layer 14, having a desired crystal structure. The conventional tunneling barrier layer 18 is nonmagnetic and is, for example, a thin insulator. For a higher signal, the conventional tunneling barrier 18 is typically crystalline MgO.
The conventional reference layer 16 and the conventional free layer 20 are magnetic. The magnetization 17 of the conventional reference layer 16 is fixed, or pinned, in a particular direction, typically by an exchange-bias interaction with the magnetization of AFM layer 14. Further, other versions of the conventional MTJ 10 might include an additional reference layer (not shown) separated from the free layer 20 by an additional nonmagnetic barrier or conductive layer (not shown). The conventional free layer 20 has a changeable magnetic moment 21. Although depicted as a simple layer, the conventional free layer 20 may also include multiple layers. Typically, materials such as CoFeB are used in the conventional free layer 16 and/or reference layer 20.
To switch the magnetic moment 21 of the conventional free layer 20, a current is driven perpendicular to plane (in the z-direction). When a sufficient current is driven from the top contact 24 to the bottom contact 11, the magnetic moment 21 of the conventional free layer 20 may switch to be parallel to the magnetic moment 17 of the conventional reference layer 16. When a sufficient current is driven from the bottom contact 11 to the top contact 24, the magnetic moment 21 of the free layer may switch to be antiparallel to that of the reference layer 16. The differences in magnetic configurations correspond to different magnetoresistances and thus different logical states (e.g. a logical "0" and a logical "1") of the conventional MTJ 10. Thus, by reading the tunneling magnetoresistance (TMR) of the conventional MTJ 10 the state of the conventional MTJ can be determined.
FIG. 2 is a high level flow chart depicting a conventional method 50 for fabricating the conventional magnetic junction 10. The layers 12, 14, 16, 18, 20 and 22 for the magnetic junction 10 are deposited, via step 52. Typically a full film deposition is used. The conventional magnetic junction 10 is defined, via step 54. For example, the conventional magnetic junction 10 may be covered by a mask and exposed portions of the layers 12, 14, 16, 18, 20 and 22 removed via ion milling.
As part of fabrication, the conventional magnetic junction 10 is also annealed, via step 56. The annealing may be used to ensure that the layers of the conventional MTJ 10 have the desired crystal structure. For example, the MgO in the conventional tunneling barrier layer 18 is typically amorphous as deposited. In addition, the reference layer 16 and/or free layer 20 typically include a CoFeB layer, with up to twenty percent of B. These layers 16 and/or 20 may also be amorphous as-deposited. In order for the layers 16, 18 and 20 in the conventional MTJ 10 to have the desired crystal structure and crystallographic orientation, the conventional MTJ 10 is annealed in step 56. The annealing of the conventional MTJ 10 is typically carried out at a temperature of approximately three hundred degrees Celsius.
Although the conventional MTJ 10 may function, there are drawbacks to incorporating the conventional MTJ 10 in a memory. For example, even with the annealing carried out in step 56, the conventional MgO tunneling barrier layer 18 may not have the desired crystal structure. For example, the conventional MgO tunneling barrier 18 may not have the desired texture. Similarly, the reference layer 16 and free layer 20 may not be fully crystallized as desired. As a result, the TMR for the conventional MTJ 10 may be reduced.
In addition, as discussed above, the free layer 20 and/or reference layer 16 may include CoFeB. The presence of B in the free layer 20 and/or reference layer 16 aids in crystallization of the conventional tunneling barrier 20. It is believed that the mobility of B in the CoFeB allows the freedom in the lattice of the layers 16, 18 and/or 20 for rearrangement of the amorphous layers into ordered crystal structures. However, the mobility of the B also allows the B to interdiffuse into the MgO tunneling barrier 20. The B may also diffuse to other layers in the stack of the conventional MTJ 10. The presence B in the conventional tunneling barrier 18 and other layers may be detrimental to properties of the conventional MTJ, such as the TMR. Thus, the signal from the conventional MTJ is, again, reduced.
Other characteristics of the conventional MTJ 10 may also be desired to be improved. For example, the critical current is the write current required to be driven through the conventional MTJ 10 to switch the magnetic state of the free layer 16. The critical current of the conventional MTJ 10 may be too high for use in a spin transfer torque magnetic random access memory (STT-MRAM). For example, for use in an STT-MRAM, the critical switching current density may be desired to be less than 1 MA/cm2. Further, although the magnetic moments 17 and 21 of the conventional reference layer 16 and conventional free layer 20 are shown as in plane, these moments may be desired to be perpendicular to plane. Thus, the free layer 20 and/or reference layer 16 may be desired to have a high perpendicular magnetic anisotropy (PMA). A high PMA occurs when the perpendicular anisotropy energy exceeds the out-of-plane demagnetization energy. This results in a magnetic moment that has a component perpendicular to plane and may be fully perpendicular to plane. Although such conventional high PMA junctions do exist, the PMA may be reduced by various factors. For example, PMA may be reduced by Co inclusions into Fe in a CoFe free layer 20, by the presence of B in the conventional free layer 20, as well as other factors. Further, the thermal stability of the conventional free layer 20 may be difficult to maintain using conventional high PMA materials. As a result, performance of the conventional MTJ may suffer. Consequently, mechanisms for tailoring the PMA may also be desired.
Accordingly, what is needed is a method and system that may improve the performance of the spin transfer torque based memories. The method and system described herein address such a need.

Diffusionless transformations in MTJ stacks


The present invention provides a method of fabricating a hinge. First, a wafer is provided, and a hinge region and at least two through regions are defined on the wafer. The wafer in the hinge region is partially removed from a bottom surface of the wafer. Subsequently, the wafer in the through regions is completely removed from a top surface of the wafer, and the hinge is formed. Thereafter, a wafer level test is performed on the hinge of the wafer. Next, an etching process is performed to adjust the shape of the hinge. According to the method of the present invention, the thickness of the hinge is no longer limited by the thickness of the wafer, and the hinge can accept the wafer level test.

1. Field of the Invention
The present invention pertains to a method of fabricating a hinge, and more specifically, to a method of performing a wafer level test in situ and adjusting the characteristic of a hinge according to the wafer level test.
2. Description of the Prior Art
Micro-electromechanical system (MEMS) technology is an emerging technology which highly integrates electronics and mechanics, and has been broadly adopted to fabricate various devices having electro and mechanical characteristics, such as micro sensors, micro actuators, micro motors, photosensitive switches, etc. MEMS devices generally have mechanical structures more complicated than semiconductor devices, and thus cannot be directly fabricated by standard semiconductor processes. Take the micro hinge, one of the most common structures in MEMS devices, for example, accurate shape and smooth surface conditions are strictly required for ensuring reliability and stress-bearing capability.
Please refer to FIG. 1 to FIG. 3. FIG. 1 and FIG. 2 are schematic diagrams illustrating a prior art method of forming a micro hinge 10, and FIG. 3 is a schematic diagram of a single-axis micro hinge 10 made by the prior art method. As shown in FIG. 1, a wafer 20 is first provided. An etching stop layer 22 and a photo resist pattern 24 are respectively formed on the bottom surface and the top surface of the wafer 20. As shown in FIG. 2, the bottom surface of the wafer 20 is fixed on a carrier 32 by a bonding layer 28, and an etching process is followed. Portions of the wafer 20, which are not covered by the photo resist pattern 24, are etched through until the etching stop layer 22 is reached.
As shown in FIG. 3, the micro hinge 10 is a suspension structure capable of being driven by a voltage, light beams, or a magnetic field, and thereby rotates in the direction as the arrow indicates shown in FIG. 3. Therefore, the micro hinge 10 must have an accurate shape, a smooth surface, and a uniform axis so as to guarantee reliability and stress-bearing capability.
According to the prior art method, however, equilibrium of the etching process and the thickness uniformity of the wafer 20 are not taken into consideration. Thus, the yield of the etching process cannot be controlled well because etching rates in different regions of the wafer 20 are not equal. For example, on the occasion of etching through the wafer 20, the overall area being etched varies dramatically, and leads to unexpected changes during the etching process. In addition, when the etching process is performed down to the etching stop layer 22, side-etching effect tends to occur and therefore results in an undercut 26 as shown in FIG. 2. As mentioned earlier, if the shape accuracy of the micro hinge degrades, reliability of the micro hinge will be seriously affected.
On other hand, according to the prior art method of forming the micro hinge 10, the thickness of the wafer 20 is exactly the thickness of the micro hinge 10. This leads to a great limitation in changing the thickness of the micro hinge 10. Furthermore, because the bottom surface of the micro hinge 10 is fixed on the etching stop layer 22, the micro hinge 10 cannot accept a wafer level test in situ, and be adjusted immediately. The step of removing the etching stop layer 22 might even damage the micro hinge 10.


A spark electrode assembly has an elongate electrode with an inner insulator arranged for operable attachment to a support structure. The inner insulator surrounds the electrode with one end of the electrode positioned adjacent a ground element across a spark gap and another end of the electrode extending relative to the support structure for attachment to a source of electrical power. An outer insulator is spaced radially outwardly from the inner insulator and surrounds the inner insulator generally adjacent the end of the electrode adjacent the ground element. The inner and outer insulators cooperate to inhibit the formation of a continuous lubrication layer thereon, thereby establishing an area generally free from the lubrication layer between the end of the electrode adjacent the ground element and the support structure.

It is known to lubricate a glassware forming mold by igniting a carbonaceous gas with a spark electrode to deposit a thin layer of carbon soot in the mold. To ignite the gas, the spark electrode creates a spark across a gap between an electrode and a ground element. In use, the carbon soot builds up along the electrode, and particularly on an insulative coating around the electrode. Over time, an electrical path created by the carbon build up along the insulative coating establishes a path of least resistance through which electrical energy passes preventing the generation of a spark at the spark gap. Ultimately, this results in a failure to ignite the combustible gas and hence, failure to lubricate the glass contacting surface of the glass mold with the carbon soot.


A hybrid mesh belt having a mesh portion with side edges attached to modular plastic chains. The chains are provided with cavities on the bottom side. The cavities are suitable for engaging with driving sprockets that engage with the chains.

Mesh belts made from woven plastic fibers are widely used for wet transport in the vegetable industry and particularly for salads. The mesh belts are typically provided with sealed belt edges. Coated drums are usually used to drive these belts. One significant problem in the application of such belts is the tracking on the driving and idling drums. This problem is particularly relevant in the case of short belts, but long belts also suffer from tracking problems. As a result of these problems, the belt edges may be damaged and may require process interruptions and expensive maintenance work. Also, belts with these type of drives need to be longitudinally tensioned to allow driving by drums. Since mesh fabrics are geometrically not totally homogeneous over the width of the belt, equal tensioning over the full belt width can be difficult to achieve.
Accordingly, there is a need for a mesh belt that offers a positive belt drive without any tracking problems thereby avoiding damage to the belt and increasing production efficiency and belt life.


One embodiment of the invention provides a system that facilitates designing an integrated circuit using a mask-programmable fabric, which contains both mask-programmable logic and a mask-programmable interconnect. During operation, the system receives a description of a mask-programmable cell, wherein instances of the mask-programmable cell are repeated to form the mask-programmable fabric. The system uses this description of the mask-programmable cell to generate a derived library containing cells that can be obtained by programming the mask-programmable cell. Next, the system receives a high-level design for the integrated circuit. The system then performs a synthesis operation on the high-level design to generate a preliminary netlist for the high-level design, wherein the preliminary netlist contains references to cells in the derived library. Finally, the system converts the preliminary netlist into a netlist that contains references to the mask-programmable cell with the logic appropriately programmed. The netlist is then placed and routed with the mask programmable constraints on the mask programmable fabric. The design, thus implemented on the programmable fabric, can be changed to accommodate logic revisions and bug fixes by changing only a few masks required for its fabrication.

1. Field of the Invention
The invention relates to the process of designing an integrated circuit. More specifically, the invention relates to a method and an apparatus for designing an integrated circuit using a mask-programmable fabric, which contains both mask-programmable logic and a mask-programmable interconnect.
2. Related Art
The dramatic improvements in semiconductor integration densities in recent years have largely been achieved through corresponding improvements in process technologies involved in manufacturing the semiconductor chips. As semiconductor feature sizes continue to decrease, the cost of producing a set of masks used to manufacture a semiconductor chip has increased considerably. For example, industry analysts predict that the cost of generating a set of masks (˜30 or more masks are typically required) for a single design in a 90 nm process will exceed one million dollars.
Note that mask re-spins are frequently required to correct logic bugs after first silicon, or to deal with changing requirements. Note that requirements frequently change because over the lifetime of a product; various derivatives of a semiconductor chip are required to accommodate changing formats or interfaces.
In order to avoid costly mask re-spins to deal with changing requirements, many designers use field-programmable gate arrays (FPGAs) to implement portions of a design that are likely to change. In this way, it is possible to make changes to a system by simply reprogramming the FPGA without incurring the cost of an additional mask re-spin.
However, there are a number of problems with using FPGAs. Although FPGAs provide a great amount of flexibility, FPGAs are relatively expensive in terms of area, power and delay. For example, implementing a function using an FPGA can consume up to ten times the area and 500 times the power of a standard cell implementation. Furthermore, FPGAs are typically located off-chip, so a considerable delay is typically involved in communicating with the FPGA.
Some developers have considered integrating FPGA circuitry into conventional semiconductor chips along with other types of circuitry. However, a number of interconnection issues still remain. The interconnect architecture in an FPGA depends on the underlying technology used to achieve programmability. In the case of anti-fuse based technologies, programmability is achieved by selectively blowing the anti-fuses. Hence, such an architecture is field-programmable only once and requires programming hardware. In the case of SRAM-based FPGA technologies, the routing programmability needs access to active silicon, which gives rise to additional complications.
Hence, what is needed is a method and an apparatus for designing an integrated circuit in a manner that avoids re-spins of the full mask set and without the above-described problems of using an FPGA. (Note that our invention enables the re-spins of only a subset of masks to configure the circuitry.)

Method and apparatus for designing an integrated circuit using a mask-programmable fabric


A method of forming a film cooling hole in a component having an internal surface and an external surface is disclosed herein that includes forming the component with a first feature on the external surface, measuring a geometry of the external surface to determine a first placement of the first feature, and drilling the film cooling hole through the component at the first placement.

In components subject to high temperatures, such as components in a gas turbine engine, cooling holes may be necessary to provide cooling air to various surfaces. The effectiveness of the cooling holes depends on the amount, placement, and shape of the holes. The amount, placement, and shape of the holes have grown in complexity. A number of methods of forming the holes are utilized, each with their own drawbacks. The holes can be drilled with a laser or conventional drill. However, the shape of the hole is limited to a round cross-sectional shape. Electric discharge machining ("EDM") can be used, but hole shape is limited to the plunge volume of the tool, and EDM can only be used for components that are electrically conductive. The cooling holes can be cast into the component during manufacture of the component, which allows for complex geometries. However, the cast-in process utilizes additional components (a core insert as well as an outer shell) and is labor intensive and expensive because of the need to create the core insert and shell.
A method combining drilling (whether EDM, laser, or another type of drilling) with the cast-in process is less expensive than utilizing only the cast-in process and also allows for complex geometries of the cooling holes. That method includes casting features into the component on one or both sides with these features forming a shaped inlet or outlet of the cooling hole. Then, the cooling holes are drilled (using a laser, conventional drill, EDM or another system/machine) through the component between corresponding features to form a shaped cooling hole. However, drilling the holes to connect the corresponding features is difficult because the holes are often drilled at an angle and the component is usually small and opaque so viewing the features on both sides of the component simultaneously is not possible.


A method for generating a unique device ID for each addressable device in a stack of multiple addressable devices by encoding a device ID for one device in the stack and determining a device ID for each of the other devices based on the device ID of an adjacent device in the stack.

1. Field of the Invention
The present invention relates to the field of stacked semiconductor devices, and more specifically to generating a unique device identifier for addressing each stacked device.
2. Discussion of Related Art
Addressable devices typically require some way by which each device can be addressed independently from other devices residing on the same bus. Addressable devices used in conventionally bonded stacked configurations may provide this capability by assigning each device a unique device identifier (ID). The device ID may be configured in the assembly process by bonding several device ID bondpads to power (Vcc) or ground (Vss), thereby encoding a unique device ID.
FIG. 1 illustrates an exemplary approach of the current art for generating a device ID for a stacked memory device. FIG. 1 illustrates a cross-section of a package 100. The package 100 contains a package substrate 102 and two stacked memory devices 104 and 106 stacked on top of the package substrate. Memory devices 104 and 106 are bonded to substrate 102 by bond wires 116. The bond wires electrically connect the bondpads of each device to the package substrate 102. Device ID signal bond pads 107 and 108 are each connected to ground (Vss) in the package substrate. This generates a device ID of 00 for memory device 104. Device ID signal bond pad 109 is connected to ground (Vss) in the package substrate. Device ID signal bond pad 110 is connected to power (Vcc) in the package substrate. This generates a device ID of 01 for memory device 106. When two signals on each addressable device are used to generate a device ID using this conventional method, four unique device IDs can be generated, supporting four addressable devices on a bus.
Alternatively, the device ID of a device is encoded in the printed circuit board substrate, rather than in the package substrate, as shown in FIG. 2. FIG. 2 illustrates a cross-section of a package 100 on a printed circuit board 120. Package 100 contains a package substrate 102 and two stacked memory devices 104 and 106. Memory devices 104 and 106 are bonded to substrate 102 by bond wires 116. The bond wires electrically connect the bondpads of each device to the package substrate 102. Each device ID signal is routed from the bond wire 116 through the package substrate 102 as a conductive trace 118. The package 100 is connected to the printed circuit board through interconnects 124. Device ID signal bond pads 107 and 108 are each connected to ground (Vss) in the printed circuit board through the bond wires 116, conductive traces 118, and interconnects 124. This generates a device ID of 00 for memory device 104. Device ID signal bond pad 109 is connected to ground (Vss) in the printed circuit board through the bond wires 116, conductive traces 118, and electrical connections 124. Device ID signal bond pad 110 is connected to power (Vcc) in the printed circuit board through the bond wires 116, conductive traces 118, and electrical connections 124. This generates a device ID of 01 for memory device 106.
Future memory devices may utilize new technologies in packaging stacked devices, such as through-silicon vias or optical technology. The conventional method of bonding out a unique device ID for each stacked device, as described above, may not be practical for future device stacking technologies.

Method and apparatus for generating a device ID for stacked devices


A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer frame section, a die pad displaced from the outer frame section, and a suspending lead connecting the die pad to the outer frame section with the die pad disposed inside the outer frame section; and a frame for leads including an outer frame portion and leads extending from opposite sides of the outer frame portion, connected to the frame for a die pad, the die pad being connected to the frame for leads at the suspending lead, wherein one of the frame for a die pad and the frame for leads includes a projection and the other of the frame for a die pad and the frame for leads includes a hole, the hole receiving the projection, the projection being disposed parallel to the frame for leads, connecting the frame for a die pad to the frame for leads.

1. Field of the Invention
The present invention relates to a semiconductor device having a lead-on-chip (LOC) structure with leads extending over a surface of a semiconductor chip and relates to a method for producing it. The present invention also relates to a leadframe for use in such a device or in production of such a device.
2. Description of the Related Art
FIG. 35 is a cross sectional view of a conventional semiconductor device having a lead-on-chip structure (hereafter referred to as LOC-structure). Such a device is disclosed, for example in Japanese Patent Application Laid-Open No.2-45969. As shown in FIG. 35 the device comprises a die pad 1, a semiconductor chip 2, and a plurality of leads 3 extending toward the semiconductor chip from its both sides, each of the plurality of leads 3 comprising an inner lead portion 3a and an outer lead portion 3b. The device further comprises thin metal wires 5, molding resin 6, and a plurality of electrodes 4 along both sides of a primary surface of the semiconductor chip 2.
An integrated circuit (not shown) and electrodes 4 are formed by photolithography or the like on the upper primary surface of the semiconductor chip 2. The semiconductor chip 2 is fixed on the die pad 1 by bonding the back primary surface of the semiconductor chip 2 to the die pad 1 with a conductive adhesive such as a conductive resin. The inner lead portions 3a are each electrically connected to the electrodes 4 on the semiconductor chip 2 via the thin metal wires 5. These elements described above are sealed with molding resin 6 except for the outer lead portions 3b so that each outer lead portion 3b of leads 3 is exposed to the outside. The outer lead portions 3b of the leads 3 are each formed into a desired shape such as a straight type, gull wing type, J-type etc.
Japanese Patent Application Laid-Open No.2-45969 also discloses a method for producing such a device described above. In accordance with this method, two frames are used: a first frame comprising an outer frame and a die pad disposed inside the outer frame, the die pad being connected to the outer frame via a suspending lead; and a second frame comprising an outer frame and a plurality of leads extending inward from the outer frame. The die pad of the first frame is sunk (depressed) downward by an amount larger than the thickness of the semiconductor chip. After a semiconductor chip is die-bonded on the die pad of the first frame, the second frame is connected to the first frame so that each lead extends over the semiconductor chip with a predetermined constant spacing between each lead and the upper surface of the chip. Then, wire-bonding and resin-molding are performed. The unnecessary portions of frames such as outer frames are removed to obtain a separate semiconductor device. Finally, each outer lead portion of the leads is bent; thus a completed semiconductor device is obtained.
In a conventional semiconductor device with the LOC-structure described above, a semiconductor chip is die-bonded onto a die pad with a conductive resin or the like. However, resin materials exhibit moisture absorption, thus moisture absorbed in resin may cause degradation in the adhesive strength, and/or may corrode the semiconductor chip or leads in contact with the resin. To mount a semiconductor device on a circuit board or the like, the semiconductor device is put on the circuit board, then the circuit board with the chip are placed in a hot environment to heat it. Thus, the outer lead portions are soldered to the circuit board. The moisture absorbed in the die-bonding resin confined in the molding resin is evaporated during the soldering process, which may result in separation of the semiconductor chip from the die pad, and/or result in cracks in a package.
In the conventional production method using two frames described above, the outer parts of two frames remain connected to each other until the molding process is completed. As a result, these outer frames act as obstacles, and difficulty occurs in handling. Therefore, during the succeeding processes after the two frames are connected, failures often occur in transferring frames, and/or liquid used for processing penetrates between the outer frames, leaking later to cause contamination. In particular, in the case of a production process including a step for plating the outer lead portions of the semiconductor device before separating the semiconductor device from the frames, serious problems occur because plating solution can penetrate between two outer frames and may leak some time later.
In another method known in the art, a single frame is used to produce a semiconductor device having LOC-structure, the single frame comprising a die pad and leads formed in an integral fashion. In such a type of leadframe, a die pad is disposed between the leads extending from both sides of the leadframe, and the die pad extends in the directions perpendicular to these leads. However, the width of the die pad cannot be enlarged to exceed the lead area. As a result, only narrow die pads are available. Japanese Patent Application Laid-Open No.64-69041 discloses a leadframe having a die pad with a large width extending beyond the area of the leads. In this case, however, the length of leads, in turn, should be shortened, or otherwise, the leads may be deformed. As a result, longer thin metal wires are required for wire-bonding and/or the choice of locations of the electrodes on the semiconductor chip is limited.
In the case where a semiconductor device is produced using a leadframe having a die pad as well as leads formed in an integral fashion, the die pad is sunk by the amount corresponding to the thickness of a semiconductor chip, and the semiconductor chip is inserted between the leads and the die pad, then the semiconductor chip is die-bonded on the die pad. However, in the case where the die pad extends perpendicular to the direction in which the leadframe is transferred during the production processes of the semiconductor device, the semiconductor chip must be inserted between the leads and the sunk die pad in the same direction as that of the leadframe-transfer path. This insertion process is difficult to perform, and complicated and troublesome operations are required. Furthermore, it also requires complicated and troublesome operations to die-bond a semiconductor chip onto the die pad with hard solder after the semiconductor chip is inserted. There are such problems in conventional semiconductor devices and methods for producing them.

Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame


A device for inputting the title of a recording medium readily. When a capturing key of a tuner unit (1) is depressed, a first system controller (7) stores the text information, received currently by an FM multiplexed text broadcasting receiving tuner (3), in a capturing buffer region (5B) of a memory (5). When the disc title of an MD-MO (11) is to be inputted, a title inputting mode is established, and the disc is selected as an input target unit. Thereafter, when a call key and an ENTER key are depressed, the first system controller (7) stores the captured text information in a title inputting region (5C) of the memory (5) in such a way that the information corresponds to the disc which is the input target unit. Thereafter, when the ENTER key and a title inputting key are depressed, the first system controller (7) sends the contents of the title inputting region (5C) to an MD recorder unit (10) and a second system controller (17) records the contents in a UTOC area of the MD-MO (11) before the ejection.

MD-MO (Magnet Optical) is one type of MD and can record and reproduce data. MD-MO can record musical tone signals in each track of a program area. In addition, a disc title name (one name per one MD-MO) and a track title name of each track are recorded in a UTOC (User's Table of Contents) area. During a reproduction suspension, a disc title name is displayed in order for a user to confirm whether the disc is a desired one, and during a reproduction of a track recorded with musical tone signals, the track title name is displayed in order for the user to confirm whether a reproduced music program is a desired one. The disc title name and track title name are not limited to an album name, an album name manufacture name and an artist name, but may be arbitrary character information which can identify a disc or a track at a glance, such as a movie title name, a portion of a music text, an explanation of music, and the name of a person, a district name and a book title respectively not directly related to music.
An MD recorder unit for recording/reproducing data tofrom an MD-MO has a text display and a key operating unit for entering a disc title name and a track title name. The key operating unit includes a title input key, character keys (including alphabet, katakana, symbol, numeral, kanji, hiragana), a one-character delete key, a cursor key and an ENTER key. When a disc title name is to be input, the title input key is depressed to enter a title input mode. Thereafter, a track number "000" is entered with numeral keys to indicate that a title input target unit is a disc (the track number 000 indicates a selection of a disc title input). Then, "DISC TITLE" is displayed on the text display in a text header row at the upper side thereof (refer to FIG. 20A), and a cursor (refer to K in FIG. 20A) is displayed at the character start position in the first row of main text rows under the text header row.
If a title name "BEST HIT OLDIES/DAIICHI" is to be input, first a character key "B" is depressed so that "B" is displayed at the character start position in the first row of the main text rows of the text display and the cursor moves to the second character position. Thereafter, characters "E", "S", "T", " " (space), "H", "I", "T", ""(space), "O", "L", "D", "I", "E", "S", "/", "D", "A", "I", "I", "C", "H", "I", and " " (space) are entered so that "BEST HIT OLDIES/DAIICHI" is displayed from the second character position in the first row of the main text rows of the text display to the second main text row and the cursor moves to the tenth character position in the second row of the main text rows (refer to FIG. 20B).
If the character "Q" is erroneously entered instead of the correct character "O", the cursor is returned to the tenth character "Q" in the first row of the main text rows by using the cursor key (refer to FIG. 20C), and the one-character deletion key is depressed so that the characters after "Q" are moved forward by one character and the character "L" is displayed at the position where the character "Q" was deleted (the cursor stays at the tenth character position. Refer to FIG. 20D). Then, the character "O" is entered so that it is displayed between "L" and the " " (space) one character before and the character "L" and following characters are moved backward by one character (the cursor moves to the eleventh character position. Refer to FIG. 21A). If characters "LL" are erroneously entered instead of the correct character "L" (refer to FIG. 21B), the cursor is moved to the eleventh character position in the first row of the main text rows by using the cursor key, and the one-character deletion key is depressed so that the eleventh character "L" is deleted and the twelfth character and following characters are moved forward by one character (the cursor stays at the eleventh character position. Refer to FIG. 21D). If the symbol "/" was not entered (refer to FIG. 21D), the cursor is moved to the character position "D" in the second row of the main text rows and the symbol "/" is entered so that "/" is displayed before "D" and the character "D" and following characters are moved backward by one character (the cursor moves to the second character position in the second row of the main text rows. Refer to FIG. 22A).
After all the characters are correctly entered, the ENTER key is depressed so that the disc title name is settled and the disc title name "BEST HIT OLDIES/DAIICHI is registered in a buffer memory.
If a track title name "" is desired for a music program at the track number 001, then "001" is entered by using numeral keys in the title input mode to select the first track with recorded musical tone signals as the title input target unit, so that "TNO 001 TITLE" is displayed in the text header row of the text display and the cursor is displayed at the start character in the first row of the main text rows. Then, katakana characters "", "", "", "", "−", "•", "", "−", "/", "", "", "", "−", "", and " " (space) are entered by using character keys so that "" is displayed in the first row of the main text rows of the text display and the cursor moves to the fourteenth character position (refer to FIG. 22B).
After all the characters are correctly entered, the ENTER key is depressed so that "" is registered in the buffer memory as the track title name of the track number "001".
After the track title names for all track numbers or desired track numbers of MD-MO are entered in the manner described above, the title input key is again depressed so that the title input mode is released and the contents of the buffer memory are written in a UTOC memory built in a system controller (not shown) of the MD recorder unit. Thereafter, when the power is turned off or an ejection operation is performed, the system controller of the MD recorder unit operates to record the contents of the UTOC memory in the UTOC area of MD-MO before it controls the power-off operation or ejection operation.
When a power-on operation or loading operation is thereafter performed, the power-on operation control or a loading operation control is performed and thereafter UTOC information is read from the UTOC area of MD-MO and written in the UTOC memory. In accordance with the information in the UTOC memory, the disc title name "BEST HIT OLDIES/DAIICHI" is displayed on the text display during the reproduction suspension. During the reproduction of the music program at the track number 001, the track title name "" is displayed on the text display. Therefore, a user can confirm at a glance whether the disc is a desired one and whether the music program is a desired one.
With a conventional MD recorder unit, however, it is required to enter each character correctly by using character key in order to enter a desired disc title name or a track title name. This work is very cumbersome.
An object of the invention is to solve the above-described problem of conventional techniques and provide a title inputting device for a recording medium capable of easily entering character information of a title name.

Device for inputting title of recording medium


A method of providing a user access to data files distributed in a plurality of different types of user devices is described. According to the method, a copy of data files stored locally at each user device is received at a server via a respective network communication link. Index information is generated based on the received data files. The index information facilitates performing a search operation using user-provided search information to select any of the data files. If a selected data file from the search operation is not stored locally at a desired user device, a copy of the selected data file is sent from the server via the respective network communication link to provide the user access to the selected data file at the desired user device.

1. Field of the Invention
Embodiments of the present invention generally relate to data file management. More particularly, embodiments of the present invention relate to providing a user access to data files distributed in a plurality of different types of user devices.
2. Related Art
The marketplace offers a user a variety of user devices. Examples of these user devices include a computer, a digital camera, a portable digital music player, a digital video recorder, a digital television, a cell phone, a game player, etc. A user is able to create various types of data files by using these user devices. Text files, photo files, video files, music files, graphic files, email message files, etc. are some examples of the different types of data files that can be created by the user.
Moreover, these user devices provide the user access to data files from numerous sources. For example, some data files may be imported from legacy devices. Other data files may be received via a wired or a wireless network. Still, other data files may be purchased for use on these user devices.
For various reasons, the user may transfer data files to a high storage capacity user device (e.g., a computer) or to portable storage media (e.g., DVD, CD, memory card, portable hard drive, etc.). Typically, the user creates a hierarchy of folders to store the data files in a meaningful manner for easy access. Moreover, the portable storage media may be placed in numerous places (e.g., desk, bookshelf, closet, briefcase, pocket of clothes, etc.).
In the end, the user's data files are scattered in multiple user devices and portable storage media. This prevents the user from easily accessing the data files because of several reasons. The user may not know or remember where a specific data file is stored. Moreover, the user may not know what data files are available in the multiple user devices and portable storage media. Management of these data files gets worse as the user creates new data files and obtains additional user devices and portable storage media.

Providing a user access to data files distributed in a plurality of different types of user devices


A method is disclosed for directly synthesizing nanoscale structures, particularly in defined locations. The method overcomes problems in nanoscale manufacturing by enabling the direct fabrication of composites useful for constructing electronic devices. In one aspect of the method, nanotubes and arrays of nanotubes are synthesized directly at defined locations useful for constructing electronic devices.

Since their discovery in 1991 by microscopist Sumio Iijima, carbon nanotubes have intrigued researchers with their structures and the applications enabled by their unique physical properties. Iijima, S. Nature, 1991, 354, 56. Nanotubes exhibit high chemical resistance and mechanical strength, among other desirable physical properties. Ongoing challenges to exploiting these desirable properties include difficulties associated with isolating and manipulating nanotubes for use as discrete device elements.

Method for synthesizing nanoscale structures in defined locations

State of Oregon acting by and through the State Board of Higher Education on behalf of Portland State University


In a storage device applying PCIe to a back-end network connection, in order to be capable of allocating bus numbers and making a PCIe switch expanded afterwards usable, it is necessary to once reset all PCIe switches. To dissolve this necessity, PCIe switches of the back-end network of the storage device are connected in series, a range of continuous bus numbers that are managed and stored in bus number management table is allocated for the back-end network connection, and when expanding the PCIe switch, the bus numbers are allocated in ascending order from a minimum value of the allocatable bus numbers to each of a link between the PCIe switches and to a virtual PCI bus within the PCIe switch, and the bus numbers are allocated in descending order from a maximum value of the allocatable bus numbers to the link between the PCIe switch and a drive.

A storage device is generally configured to have random accessible non-volatile medium. The random accessible non-volatile medium is, for example, a magnetic disk drive, an optical disk drive and the like. Further, currently major storage device is configured to have a plurality of hard disk drives (HDD).
Further, accompanying a progress in semiconductor technology, a non-volatile semiconductor memory capable of being used as a memory medium of the storage device is being developed. As a drive using such non-volatile semiconductor memory as the memory medium, for example, a solid state drive (SSD) may be given. The storage device provided with the SSD is superior in duration life, electric power saving, and access time and the like, compared to the storage device provided with HDD only.
In the conventional storage device, a back-end interface and a plurality of the HDDs are, for example, connected by a Serial Attached SCSI (SAS) protocol. Further, an SSD provided with an SAS interface (SAS-SSD) is connected to the back-end interface.
Further, recently, a PCIe-connected SSD capable of performing faster data transfer is starting to appear.
In order to join the plurality of the PCIe-connected SSDs to the storage device, there is a form of connecting the PCIe-connected SSDs using a PCIe switch.
Since there is a limit to the number of PCIe-connected SSDs that could be joined with one PCIe switch, a large-scale system may adopt a configuration of connecting a number of PCIe switches in multiple stages.
In order to use the PCIe switches connected in multiple stages, and the PCIe-connected SSDs joined to the PCIe switches, an initialization of PCIe is necessary. An allocation of bus numbers is one of the initialization. The bus number is used, for example to specify a destination of data in an ID routing. The ID routing is one method of transferring data by determining a route to the designated destination, and transferring the data along the route.
For example, in Patent Document 1, there is disclosed a method of allocating bus numbers preliminarily to unconnected PCIe devices.

Information system capable of expanding drive and bus number allocation method of the information system


A stereoscopic image display device and a driving method thereof, which correct the viewing position of a viewer in initial driving of a 3D display mode, are discussed. The stereoscopic image display device includes a display module, a barrier module, a position detector, and a position detector. The display module separates a left-eye image and a right-eye image to display a stereoscopic image. The barrier module is disposed in correspondence with the display module, and forms a light transmitting area for transmitting the left-eye image and right-eye image and a light blocking area for blocking the left-eye image and right-eye image. The position detector detects position information on a viewer which views the stereoscopic image displayed on the display module. The position detector corrects positions of the light transmitting area and light blocking area on the basis of viewing position information on the viewer.

1. Field of the Invention
The present invention relates to a stereoscopic image display device, and more particularly, to a stereoscopic image display device and a driving method thereof, which correct the viewing position of a viewer in initial driving of a Three-Dimensional (3D) display mode.
2. Discussion of the Related Art
Generally, stereoscopic (or 3D) image display devices are devices that respectively provide different images to the left eye and right eye of a viewer, and thus enable the viewer to view the stereoscopic image with a binocular parallax between the left eye and right eye thereof.
Recently, research is being actively conducted on a non-glasses type where a viewer does not wear 3D glasses. As the non-glasses type, there are a lenticular type where a left-eye image and a right-eye image are separated from each other by a cylindrical lens array, and a barrier type where a left-eye image and a right-eye image are separated from each other by a barrier.
FIG. 1 is a view for schematically describing a typical barrier type stereoscopic image display device.
Referring to FIG. 1, the typical barrier type stereoscopic image display device includes a display panel 10 that separates and displays a left-eye image LI and a right-eye image RI, and a barrier panel 20 that is formed to have a light transmitting area 22 and a light blocking area 24 which are arranged alternately and disposed at the front of the display panel 10.
A viewer views an image displayed on the display panel 10 through the light transmitting area 22 of the barrier panel 20, in which case a left-eye LE and right-eye RE of the viewer look at different areas of the display panel 10 through the same light transmitting area 22. Therefore, a viewer views the left-eye image LI and right-eye image RI, which are displayed adjacently to each other, through the light transmitting area 22 and thus feels three-dimensional.
The typical barrier type stereoscopic image display devices are capable of changing a display mode to a Two-Dimensional (2D) display mode or a 3D display mode according to states of the light transmitting area 22 and light blocking area 24 that are formed in the barrier panel 20. Accordingly, the typical barrier type stereoscopic image display device is being recently applied to televisions (TVs), monitors, notebook computers, net book computers, tablet computers, mobile devices, etc.
However, in the typical barrier type stereoscopic image display devices, since the light transmitting area 22 and light blocking area 24 formed in the barrier panel 20 are fixed in position, when the viewing position of a viewer is changed, the viewer cannot view a stereoscopic image or feels dizzy.

Stereoscopic image display device and driving method thereof


A pivot mechanism for a vehicle external rear view mirror assembly is disclosed. The mechanism includes: a base frame portion and a case frame portion mounted to the base frame portion for rotation about a pivot axis. A detent operable between the base frame portion and the case frame portion is provided. The detent has an engaged position and a disengaged position, the disengaged position allowing the rotation about the pivot axis. A spring mechanism clamps the case frame portion to the base frame portion and a first set of detent features to a second set of detent features. A support arm having an attachment end and a floating end is provided. An attachment end is fixed to, and is fixed against rotation with respect to the case frame portion, and the second set of detent features is fixed against rotation with respect to the base frame portion.

This invention relates in general to vehicle review view mirrors. In a particular form the present invention relates to vehicle review view side mirrors that are pivotably movable with respect to a mounting point on a vehicle.
Vehicle mirrors, in particular vehicle rear view side mirrors, commonly include a mirror head that is pivotally attached to a mounting bracket. The mounting bracket is secured to the vehicle body (for instance, the door or front fender). The pivot enables the mirror head to rotate with respect to the bracket to either allow movement of the mirror head in response to an impact while the vehicle is moving or stationary (referred to as "mirror breakaway"), or to move to a parked position under the action of a drive means to ensure that the mirror head is moved to a position where it is as close to the vehicle body as possible.
A detent is typically included in a pivot mechanism within the vehicle mirror described above. The detent provides a positive location and holding force for the mirror in at least a deployed or drive position as it is rotated about the pivot. The detent resists initial movement of the pivot and requires a minimum force in order to overcome the detent holding force.
Commonly, detent mechanisms include a detent feature on the mounting bracket or mirror base and a further detent feature on the mirror head or mirror case frame. With such an arrangement, typically the mirror head is displaced upwards as it rotates out of detent.
In some applications, it is desirable to provide a pivot mechanism whereby there is no axial lifting of the mirror head with respect to the base during rotation or pivoting.
The invention to provides a pivot mechanism that provides swivel or rotary motion of the mirror head without an axial movement component or to at least provide the public with a useful choice.

Pivot mechanism for a vehicle external rear view mirror assembly


A transportation refrigeration system including: a transportation refrigeration unit comprising a motor; a power conversion unit configured convert an amplitude, a frequency and a phase of an input electrical power signal, wherein the power conversion unit comprises a first power bridge, a DC link and a second power bridge; an energy storage device configured to supply electrical power to the motor via the power conversion unit during a road mode; a first switch configured to selectively connect the first power bridge to the energy storage device or the motor; and a second switch configured to selectively connect the second power bridge to the motor or a power grid; wherein the first switch and second switch are positioned to connect the first power bridge and second power bridge to specified sources and outputs during each of the road mode and the standby mode.

The embodiments herein generally relate to transport refrigeration systems and more specifically, the energy management of such transport refrigeration systems.
Typically, cold chain distribution systems are used to transport and distribute cargo, or more specifically perishable goods and environmentally sensitive goods (herein referred to as perishable goods) that may be susceptible to temperature, humidity, and other environmental factors. Perishable goods may include but are not limited to fruits, vegetables, grains, beans, nuts, eggs, dairy, seed, flowers, meat, poultry, fish, ice, and pharmaceuticals. Advantageously, cold chain distribution systems allow perishable goods to be effectively transported and distributed without damage or other undesirable effects.
Refrigerated vehicles and trailers are commonly used to transport perishable goods in a cold chain distribution system. A transport refrigeration system is mounted to the vehicles or to the trailer in operative association with a cargo space defined within the vehicles or trailer for maintaining a controlled temperature environment within the cargo space.
Conventionally, transport refrigeration systems used in connection with refrigerated vehicles and refrigerated trailers include a transportation refrigeration unit having a refrigerant compressor, a condenser with one or more associated condenser fans, an expansion device, and an evaporator with one or more associated evaporator fans, which are connected via appropriate refrigerant lines in a closed refrigerant flow circuit. Air or an air/gas mixture is drawn from the interior volume of the cargo space by means of the evaporator fan(s) associated with the evaporator, passed through the airside of the evaporator in heat exchange relationship with refrigerant whereby the refrigerant absorbs heat from the air, thereby cooling the air. The cooled air is then supplied back to the cargo space.
On commercially available transport refrigeration systems used in connection with refrigerated vehicles and refrigerated trailers, the compressor, and typically other components of the transportation refrigeration unit, must be powered during transit by a prime mover. In mechanically driven transport refrigeration systems the compressor is driven by the prime mover, either through a direct mechanical coupling or a belt drive, and other components, such as the condenser and evaporator fans are belt driven.
Transport refrigeration systems may also be electrically driven. In an electrically driven transport refrigeration system, components of the transportation refrigeration unit (such as a compressor) can be powered by an electric current supplied by a battery during a "road mode" and an electric current supplied by a power grid during a "standby mode." A "road mode" refers to a mode of operation in which the transport refrigeration system is unconnected to a power grid, such as when a refrigerated vehicle is in transit. Conventionally, when in road mode, the transportation refrigeration system has one source (e.g., a battery) and one load (e.g., the compressor motor), which requires the use of two power bridges and a DC link to convert the electrical characteristics (e.g., amplitude, phase, frequency) of the power between them. A "standby mode" refers to a mode of operation in which the transport refrigeration system is connected to a power grid, such as when a refrigerated vehicle is parked and plugged in to a charging station. Conventionally, when in standby mode, the transportation refrigeration system has an additional source (e.g., the power grid), which requires the use of a third power bridge and an additional DC link. Each power bridge includes a converter or inverter, which is typically an expensive component. Therefore it is desirable to provide the functionalities of a conventional road mode and standby mode using less power bridges.

Time sharing control of transport refrigeration system


A method and apparatus for managing network profiles and/or access to a network. Network profiles stored in a computer may be deleted and/or a connection to a wireless network may be disabled when a corresponding access period for the network has been exhausted. The access period may define an amount of time, a number of connections, a number of bits or packets of information, or other measure of connectivity to a network and/or maintenance of profile information related to the network that may be limited in some fashion.

1. Field of Invention
This invention relates to controlling access to a network and/or controlling stored network profiling information, e.g., information used to establish a connection with a wireless network.
2. Related Art
When connecting to a wireless network, such as a wireless network operating according to the IEEE 802.11 standard, client machines need certain parameters regarding the configuration settings of the network. A client machine may obtain this information in the process of establishing a connection with the network, and save the information for later use when reconnecting to the same network. These settings are commonly referred to as network profiles and are usually stored on the client machine indefinitely.


A business card holder having the shape of a lady's high heel shoe includes a rigid, elongated sole having a rigid toe portion, a rigid inclined heel portion, and a rigid intermediate portion between the toe portion and inclined heel portion. A rigid heel extends downwardly from the inclined heel portion and supports the inclined heel portion when the business card holder is in an operative position. A rigid shoe upper extends over the toe portion and includes a free edge portion. The shoe upper free edge portion, sole intermediate portion, and inclined heel portion define a pocket that is configured to hold a plurality of business cards for distribution therefrom.

Desk organizers for holding various office accessories, such as pens, pencils, memo pads, papers, documents and envelopes, clips, scissors, business cards, and the like, are known. These organizers are advantageous in that the can help eliminate desk clutter. Unfortunately, many such organizers lack distinctiveness and are not aesthetically pleasing. Thus, there is a need for desk organizers that are distinctive and more aesthetically pleasing from a visual point of view.


A method of dividing deep-frozen food blocks comprising forming a succession of spaced parallel blade rows each row having a plurality of spaced parallel coaxial freely rotatable discoid blades and advancing successive food blocks past the successive blade rows so that the blades in the successive blade rows rotate with a peripheral speed which more or less matches the speed of the block advance so that there is minimal relative linear motion of the blade edges and the blocks whereby the blades groove the blocks by displacing block material to the sides of the grooves and selecting a number of blade rows such that while the grooves made by any blade row are quite shallow, the grooves made by all of the blade rows divide each of the blocks into a plurality of parts. Apparatus for practicing the method is also disclosed.

Frozen fish is usually caught, cleaned and deep frozen on board factory ships and brought ashore in an international standard 16.5 pound block or slab which measures 19.times.10.times.2.5 inches. The standard block is delivered at a temperature of -5.degree. to +5.degree. F. to a fish processing plant where it is subjected to a series of cutting steps to produce fish sticks or other portions of suitable size and shape for the retail and food service markets. All of the commonly available stick and portion sizes are direct derivatives of the above block dimensions and are usually produced in three cutting steps. The steps are commonly referred to in the industry as logging, slabbing and portioning, which terms describe the shape and size of the product resulting from each step. In the case of a block that is divided into fish sticks, the resulting pieces are usually about 3-4 inches long and 1/2-3/4 inch in rectangular cross section.
There are three common techniques used in the industry to make these cuts. In the most common technique, the fish blocks are advanced by a conveyor into a band saw or multiple-band band saw which divides the block into a plurality of portions. This procedure allows for production flexibility, but, it creates a considerable yield loss in the form of sawdust. Another common technique is to advance the blocks past a rotary saw blade in a machine similar to a table saw. Here again, sawdust losses can be substantial.
There have also been developed cutting apparatus which utilize driven rotary knife blades, in lieu of saw blades, which are able to slice through the frozen fish blocks in such a way as to minimize product wastage. Examples of such apparatus are disclosed in U.S. Pat. Nos. 2,941,560 and 4,934,237. However such cutting machines whose cutting blades rotate at relatively high speed invariably require that the blades be relatively thick in order to have the lateral stability necessary to withstand the opposing forces that are developed during the cutting process. Thus the blades produce a relatively wide cutting swath through the block which can cause chipping of the product material at the cut. Also, the blades tend to be relatively expensive particularly when the blades are provided with a specially formed cutting edge or a diamond-tipped cutting edge as described in the latter patent above.
We are also aware that some high volume producers use a slicing technique which does not create any sawdust, but which requires that the fish blocks be warmed to 20.degree. F. or more prior to cutting. This tempering step is accomplished by loading the blocks into a holding room and subjecting them to microwave energy which adds significantly to the processing cost.
Thus, until now, producers have been unable to effectively and economically divide deep-frozen fish blocks because of the hardness of the blocks.

Apparatus for dividing frozen fish slabs