The embodiments generate a new type of amble sequence for a wireless communication network with mixed nodes, by generating a first amble sequence invisible to a first node based upon an existing amble sequence for the first node and generating a second amble sequence having a low to zero cross-correlation with the first amble sequence, based upon the first amble sequence. The first and second amble sequences can be broadcast in alternating communication link frames.

1. Field
The embodiments discussed herein relate to wireless communication device/network amble sequence or synchronization symbols.
2. Description of the Related Art
Preambles are often used in wireless networks for network identification, time and frequency synchronization of wireless communication devices with the network, and/or channel estimation. In wireless cellular networks, preambles are symbols known by the wireless communication devices. A first device, like a wireless network infrastructure device (a base station in cellular network for example), broadcasts (transmits) well known to the device amble sequences periodically in a fixed location (often the beginning of the frame and called preamble) of every frame. A second wireless communication device looks for preambles to find nearby first devices and to get time synchronization and frequency synchronization with the wireless network.
Sometimes it is necessary to introduce new amble sequences into a wireless communication system for a new type of wireless communication device. A possible reason for having to introduce new amble sequence for new devices is that due to some limit of the system design, the new devices might have a need to receive amble sequences other than the legacy preamble. Both new devices and legacy devices can coexist in the same network, where legacy devices are designed to recognize only the old preambles. It is important that any new amble sequences designed to be recognizable to the new devices do not cause confusion to the legacy devices.

Legacy and new wireless communication device coexisting amble sequence


The present invention relates to an aqueous coating composition containing. a) an aqueous solution or dispersion of a polyol component containing at least one water-dilutable polyacrylate resin having hydroxyl groups and a molecular weight (M.sub.n) above 500, PA1 b) a polyisocyanate component which has a viscosity of 50 to 10,000 mPa.s at 23.degree. C. and is emulsified in component a), and PA1 c) 0.5 to 6% by weight, based on the weight of component a), of a water-soluble polyether polyol having a molecular weight of 300 to 1000,. wherein the coating composition has an NCO/OH equivalent ratio of 0.5:1 to 5:1, based on the isocyanate groups of component b) and the alcoholic hydroxyl groups of components a) and c).

1. Filed of the Invention
This invention relates to the use of certain water-soluble polyether polyols as additives for aqueous coating compositions wherein the binder is based on a combination of water-dilutable polyacrylate resins and organic polyisocyanates.
2. Description of the Prior Art
Ecological considerations play an important role in the coatings technology. One particularly urgent problem is the reduction in the quantities of organic solvents used for lacquers and coating materials.
For a long time it was to possible to dispense with organic solvents for chemically cross-linking polyurethane lacquers which play an important role in coatings technology due to their excellent properties. It appeared for a long time that it would not be possible to use water instead of organic solvents in two-component polyurethane lacquers based on polyisocyanates containing free isocyanate groups since it was known that isocyanate groups reacted not only with alcoholic hydroxyl groups but also with water. Moreover, the concentration of active hydrogen atoms in such systems due to the presence of water is much higher than the concentration of hydroxyl groups from the organic, isocyanate reactive component. It was therefore inevitably assumed that the main reaction in the ternary system of polyisocyanate/organic polyhydroxyl compounds/water would be a reaction between isocyanate and water with the formation of urea and carbon dioxide. This would result in the organic polyhydroxyl compounds remaining unreacted and would cause foaming of the reaction mixture due to the formation of carbon dioxide.
Aqueous two-component binders based on water-dilutable polyacrylate resins and organic polyisocyantes were first described in EP-A-O 358 979. The coating compositions described in this publication result in films which have excellent hardness after curing but insufficient gloss for many purposes. Further, the elasticity and abrasion resistance are insufficient for many applications. These properties are required, for example, for coating wood and furniture and for coating flexible substrates such as cork or synthetic resins.
It has now surprisingly been found that the addition of small quantities of water-soluble polyether polyols of the type described below to such aqueous coating compositions results in a marked improvement in the gloss, elasticity and abrasion resistance of coatings obtained from the coating compositions.

Polyurethane coating compositions containing polyether polyols as additives


Molecular signatures that function as very sensitive diagnostic biomarker for myocarditis, heart disease and disorders thereof, are identified.

The myocardites are inflammatory diseases of the heart that have variable clinical presentations and are caused by a range of underlying inflammatory variants. Of new onset heart failure, 10-30% may be caused by cardiac inflammation, and viral infection systemic or local inflammatory diseases, or genetic predisposition represent inciting factors. Myocarditis can be difficult to diagnose requiring multiple endomyocardial biopsies (EMBs). Even with multiple biopsies, consensus among pathologists has been difficult to attain. Inaccurate or uncertain diagnosis is of major concern, since emerging therapies specifically targeting inflammatory or viral heart disease, have the potential to reverse the disease process. In a previous decision analysis investigating the value of EMBs to improve clinical outcome with specific therapy, histological inaccuracy was a major limiting factor for efficacy of treatment. In addition, the important subtypes of myocarditis have highly distinct outcomes, require markedly different therapeutic strategies, and can be difficult to distinguish based on standard histopathology. Current attempts to improve diagnostic accuracy include screening for viral RNA in endomyocardial biopsies, serum anti-heart autoantibodies, and use of magnetic resonance imaging (MRI).

Diagnostic transcriptomic biomarkers in inflammatory cardiomyopathies


In an apparatus at a spinning room machine, especially a flat card, roller card, cleaner or the like, for drawing a clothing onto a roller using a drawing-on device, the spinning room machine has an electronic control and regulation device. In order to provide an apparatus that is simple in terms of equipment and that makes possible checking of the drawing-on procedure and/or of the measurement data, a measurement device for registering data ascertained during drawing-on is associated with the drawing-on device, and the measurement device co-operates with the electronic control and regulation device of the spinning room machine for permitting passage of data between the drawing-on device and the control and regulation device.

The invention relates to an apparatus at a spinning room machine, especially a flat card, roller card, cleaner or the like, for drawing a clothing onto a roller.
In the textile industry sector, especially in the carding sector, it is necessary for the clothings of the working apparatus, for example of a cylinder, to be replaced from time to time. The clothings are parts that are subject to wear.
In a known apparatus (DD 240 569 A1), there is provided a drive system for flat cards or roller cards having at least one speed-controlled three-phase current motor, with which there is associated a speed control device. The speed of rotation of each three-phase current motor can be controlled using a frequency converter, which can in turn be controlled, via a D/A converter, by a micro-computer. Stored in the RAM memory thereof are speed control program blocks for all-steel clothing drawing-on procedures. In the all-steel clothing drawing-on procedure, one of the speed-controlled three-phase current motors is arranged to be in mechanical drive connection with the licker-in, cylinder and/or doffer. In that arrangement, in accordance with the stored program and the speed program blocks stored in the RAM, the CPU in question, timed by means of a CTC, controls the output of actuation pulses to the frequency converters and, consequently, the speeds of the three-phase current motors, in accordance with operational requirements, during drawing-on of the all-steel clothing. The speed control program blocks for all-steel clothing drawing-on procedures serve exclusively for the purpose of controlling the speed of the three-phase current motors. Ascertaining data during the drawing-on of the clothings is dealt with under operator control. A disadvantage, amongst others, in the case of that apparatus is that checking of the drawing-on procedure is not removable as can be necessary, for example, in the event of changes in loading.
It is an aim of the invention, in contrast, to provide an apparatus of the kind mentioned at the beginning that avoids or mitigates the mentioned disadvantages, that especially is simple in terms of equipment, and that makes possible checking of the drawing-on procedure and/or of the measurement data.

Apparatus at a spinning room machine, especially a flat card, roller card, cleaner or the like, for drawing a clothing onto a roller


A wetsuit has a trunk portion having a pair of arm openings and a neck opening that fits about the torso of a wearer. The neck opening includes an area of reduced thickness that is folded to form a soft flexible edge. The neck opening is made by forming a channel of reduced thickness in a piece of material to surround the neck opening in the wetsuit, and folding the material along a centerline of the channel to form the soft flexible edge.

1. Field of the Invention
The invention relates to wetsuits and in particular to the neck opening of wetsuits and a method of making or forming the neck opening of a wetsuit.
2. Background Information
Wetsuits made from synthetic rubber, such as neoprene, of various thicknesses are well known. The top part of a wetsuit comprises a trunk portion that fits about the torso of a wearer. The trunk portion has a neck opening through which the head and neck of the wearer extend. The edge of the neck opening can be left as a plain or sealed neoprene edge, however this can be uncomfortable and produce skin chafing around the neck of a wearer. Alternatively, and as is common practice, the neck opening is folded over on itself and stitched or glued to provide a smooth rounded edge. However the double thickness of the edge is bulky and less flexible than the rest of the suit. Gluing and stitching the folded edge further reduces the flexibility and can add to the discomfort and chafing experienced by the wearer.
It is an object of the present invention to provide a wetsuit, wetsuit neck opening and a method of making same which overcomes or at least ameliorates problems with the neck opening of wetsuits known hitherto or, to at least provide the public with a useful alternative.

Wetsuit, neck opening for wetsuit and method of making same


Natural language controlled devices may be implemented in an environment where the devices are configured to operate with multiple different users. The techniques described herein implement security requirements for a device configured to operate in an environment where the multiple different users may request functionality. The security requirements may be implemented based on the whether the functionality requested is personal and/or secured.

Homes are becoming more wired and connected with the proliferation of computing devices such as desktops, tablets, entertainment systems, and portable communication devices. As these computing devices evolve, many different ways have been introduced to allow users to interact with computing devices, such as through mechanical devices (e.g., keyboards, mice, etc.), touch screens, motion, and gesture. Another way to interact with computing devices is through natural language input such as speech.
The use of natural language input to interact with computing devices presents many challenges. One challenge concerns recognizing and/or authenticating a user interacting with the computing device. For example, when the computing device is placed in an environment where it is configured to interact with a plurality of users, the computing device may need to know which particular user is requesting functionality to be performed by the computing device.
Accordingly, there is a need for techniques to recognize and/or authenticate one or more users that may interact with natural language control devices.


A method and system for high-order co-clustering of objects of heterogeneous types is provided. A clustering system co-clusters objects of heterogeneous types based on joint distributions for objects of non-central types and objects of a central type. The clustering system uses an iterative approach to co-clustering the objects of the various types. The clustering system divides the co-clustering into a sub-problem, for each non-central type (e.g., first type and second type), of co-clustering objects of that non-central type and objects of the central type based on the joint distribution for that non-central type. After the co-clustering is completed, the clustering system clusters objects of the central type based on the clusters of the objects of the non-central types identified during co-clustering. The clustering system repeats the iterations until the clusters of objects of the central type converge on a solution.

In many applications, it can be very useful to identify groups or clusters of objects such that objects in the same cluster are similar while objects in different clusters are dissimilar. Such identification of groups is referred to as "clustering." Clustering has been used extensively to identify similar web-based objects. Web-based objects may include web pages, images, scientific articles, queries, authors, news reports, and so on. For example, when a collection of images is identified by an image search engine, the search engine may want to identify clusters of related images. The search engine may use various well-known algorithms including K-means, maximum likelihood estimation, spectral clustering, and so on. These algorithms generate clusters of homogeneous objects, that is, objects of the same type (e.g., clusters of images only or clusters of web pages only).
Recently, attempts have been made to cluster highly interrelated heterogeneous objects such as images and their surrounding text; documents and terms; customers and their purchased items; articles, authors, and conferences; web users, issued queries, and click-through web pages; and so on. The goal of heterogeneous clustering is to identify clusters of each type of object that is in some way based on the clusters of the other type of object. The use of homogeneous clustering on objects of each type separately may not be an acceptable basis for heterogeneous clustering because the similarities among one type of objects sometimes can only be defined by the other type of objects. One attempt at co-clustering objects of two types tries to extend traditional spectral clustering algorithms using a bipartite spectral graph clustering algorithm to co-cluster documents and terms simultaneously. A similar attempt has been made at co-clustering heterogeneous objects in the field of biology and image processing.
Some attempts have been made at high-order co-clustering, that is, co-clustering objects of more than two data types. In the case of objects of three data types, the objects of a first type and the objects of a second type are each related to the objects of a third or central type. The relationship between objects of the first type and the objects of the central type and the relationship between objects of the second type and the objects of the central type are provided. The goal of the co-clustering is to provide a clustering of the objects of the first type, a clustering of objects of the second type, and a clustering of objects of the central type. One technique for such co-clustering is described in Gao, B., Liu, T., Zheng, X., Cheng, Q., and Ma, W., "Consistent Bipartite Graph Co-Partitioning for Star-Structured High-Order Heterogeneous Data Co-Clustering," Proc. ACM Special Interest Group on Knowledge Discovery and Data Mining (SIGKDD'05), 2005, pp. 41-50. Although this technique is very effective, it is computationally expensive, especially with large datasets.

Co-clustering objects of heterogeneous types


A removable storage module assembly configured for securement to the headliner in a passenger compartment of a vehicle. The headliner includes a storage module receiving area formed therein having a securement portion disposed proximate the receiving area. A storage module having a housing, a fastener associated with the housing configured to engage the securement portion and a storage area defined in the housing is removably positioned in the storage module receiving area.

1. Field of the Invention
The present invention relates to a storage module assembly removably secured to the headliner of a passenger compartment of a vehicle.
2. Background Art
Overhead consoles and storage modules are commonly provided in the headliner of a passenger compartment of a vehicle such as an automobile, boat or airplane. The headliner includes an upper surface mounted to the interior roof structure of the vehicle and a lower surface having an overlay applied thereon. The overhead console is mounted to the lower surface of the headliner to provide additional storage space for items such as sunglasses, garage door openers and compact discs.
One significant limitation of current overhead console assemblies is that the accessory storage modules cannot be removed from the console or headliner. Rather, stored items must be removed from the accessory compartments of the modules to transport the items between the vehicle and another location. It would be advantageous to provide a removable storage module configured for securement on the headliner of the vehicle allowing easy transportation of stored items between locations.
Another storage solution commonly used in automotive vehicles is an accessory pocket mounted to a sun visor. Sun visors are pivotally mounted to a headliner to shield the occupant's vision from light entering through the window or windshield of the vehicle. One problem associated with visor mounted storage solutions is that they are not easily removed from the visor once assembled. Further, the storage solutions may adversely affect the performance of the sun visor in the vehicle. Additionally, the storage solutions are not easily concealable, thereby creating a desirable target for thieves.
It would be advantageous to provide a modular storage solution cooperating with the headliner of a vehicle which is easily removable and transportable to a variety of locations. It would also be advantageous to provide a storage module removably secured to a visor assembly by magnets.

This patent is subject to a terminal disclaimer.

International Automotive Components Group North America, Inc.


A solid fiber is described, where the solid fiber is characterized by (a) a modification degree Do/Di, in a cross section of the solid fiber of 1.20 to 8.50 where the inscribed circle diameter is denoted by Di and the circumscribed circle diameter is denoted by Do; and (b) a porous specific surface area of not less than 30 m2/g.

Conventionally, porous beads are often used as the form of the adsorbent material to be used for the purification column which removes, by adsorption, a removal target substance in the fluid that is to be treated. Examples of the reasons for this include the fact that bead-shaped adsorbent has advantages of less unbalanced blood flow in a column and hence ease of a column design because the adsorbent can be uniformly packed into an adsorption column. On the other hand, examples of a means for improving adsorption capacity include increasing of a surface area per volume of the adsorbent. However, when the adsorbent is bead-like, a bead diameter is decreased in order to increase a surface area per volume of the adsorbent, a gap between the beads becomes narrow. Therefore, since resistance of a flow path becomes high to increase a pressure loss, it becomes difficult to pass the fluid that is to be treated. Further, the bead used as an adsorbent is usually spherical, and therefore it has a disadvantage that the surface area per volume is inherently small. That is, even though there is an adsorption reserve capacity inside the bead, an internal adsorption site cannot be effectively used.
Examples of the form of an adsorbent material other than the bead include a fiber, it is also thought to use a fiber having a common round cross section. Examples of the form of the fiber include one obtained by inserting a large number of fibers in the straight form in parallel to a lengthwise direction of a column case, or one obtained by forming a knitting fabric.
In the knitting fabric of these forms, it is difficult in production to make the fiber porous for providing adsorption holes for the fiber. Further, when the fluid that is to be treated includes many dissolved substances and viscosity is high, it is not so preferred since processing easily results in a pressure rise in a column.
On the other hand, the fiber of the form obtained by inserting a filament fiber such as a solid fiber or a hollow fiber in the straight form in parallel to a lengthwise direction of a column case, can secure a flow path of the fluid that is to be treated separately from the adsorbent material. Therefore, the fiber of this form can suppress resistance of the flow path, and is advantageous to the adhesion of a dissolved substance in the fluid that is to be treated.
Here, a method in which a shape other than a circular shape is used as a cross-section shape of the fiber, that is, a fiber with a modified cross section is used, is known. However, it is heretofore thought that since spinning stability deteriorates when the modification degree of the fiber is increased, an increase of the modification degree has been suppressed. Particularly, in the case of the porous fibers, there has been a fear that strength-elongation of the fiber is significantly reduced and unevenness of a fiber diameter referred to as draw resonance increases by a modified cross section, and in addition to this, there has been a fear that modification of a cross-section shape, particularly, agglutination between the protrusions within a single fiber cross section, occurs.
Hitherto, the inventions concerning a purification column into which hollow fibers or solid fibers are incorporated are disclosed (Patent Documents 1 and 2).
Here, a method in which a shape other than a circular shape is used as a cross-section shape of the fiber, that is, a fiber with a modified cross section is used, is known. However, it is heretofore thought that since spinning stability deteriorates when the modification degree of the fiber is increased, an increase of the modification degree is suppressed. Particularly, in the case of the porous fibers, there has been a fear that strength-elongation of the fiber is significantly reduced and unevenness of a fiber diameter referred to as draw resonance increases by a modified cross section, and in addition to this, there has been a fear that modification of a cross-section shape, particularly, agglutination between the protrusions within a single fiber cross section, occurs. However, heretofore, Patent Documents 3 to 5 describe the invention concerning the fibers with the modified cross section in which a shape other than a circular shape is used as a cross-section shape of a porous fiber.
In Patent Document 6, a separation membrane in which a modified cross section is formed is described. In Patent Document 7, a hollow fiber in which an oval cross section is formed is also described.
On the other hand, Patent Document 8 describes the invention concerning the fibers with the modified cross section which has no hollow portion, but pores on the surface.

Porous fiber, adsorbent material, and purification column


Abtides are provided. Abtides are peptides identified by a two-step process of screening random peptide libraries. In the first step, the target ligand is an antibody or receptor (or derivative thereof). The peptides identified in the first screening step are used as target ligands in the second screening step. The peptides identified in the second screening step are abtides. Abtides possess binding specificities that are similar to the binding specificities of the antibodies or receptors that are used in the first screening step. Abtides may be used in place of antibodies in many assays or therapeutic applications.. Abtides binding to polymorphic epithelial mucin (PEM) are provided.. Also provided are methods of obtaining abtides as well as diagnostic and therapeutic compounds containing abtides.

2.1. PEPTIDE LIBRARIES
The use of peptide libraries is well known in the art. Such peptide libraries have generally been constructed by one of two approaches. According to one approach, peptides have been chemically synthesized in vitro in several formats. For example, Fodor et al., 1991, Science 251: 767-773, describes use of complex instrumentation, photochemistry and computerized inventory control to synthesize a known array of short peptides on an individual microscopic slide. Houghten et al., 1991, Nature 354: 84-86, describes mixtures of free hexapeptides in which the first and second residues in each peptide were individually and specifically defined. Lam et al., 1991, Nature 354: 82-84, describes a "one bead, one peptide" approach in which a solid phase split synthesis scheme produced a library of peptides in which each bead in the collection had immobilized thereon a single, random sequence of amino acid residues. For the most part, the chemical synthetic systems have been directed to generation of arrays of short length peptides, generally fewer than about 10 amino acids or so, more particularly about 6-8 amino acids. Direct amino acid sequencing, alone or in combination with complex record keeping of the peptide synthesis schemes, is required to use these libraries.
According to a second approach using recombinant DNA techniques, peptides have been expressed in biological systems as either soluble fusion proteins or viral capsid fusion proteins.
A number of peptide libraries according to the second approach have used the M13 phage. M13 is a filamentous bacteriophage that has been a workhorse in molecular biology laboratories for the past 20 years. M13 viral particles consist of six different capsid proteins and one copy of the viral genome, as a single-stranded circular DNA molecule. Once the M13 DNA has been introduced into a host cell such as E. coli, it is converted into double-stranded, circular DNA. The viral DNA carries a second origin of replication that is used to generate the single-stranded DNA found in the viral particles. During viral morphogenesis, there is an ordered assembly of the single-stranded DNA and the viral proteins, and the viral particles are extruded from cells in a process much like secretion. The M13 virus is neither lysogenic nor lytic like other bacteriophage (e.g., .lambda.); cells, once infected, chronically release virus. This feature leads to high titers of virus in infected cultures, i.e., 10.sup.12 pfu/ml.
The genome of the M13 phage is .about.8000 nucleotides in length and has been completely sequenced. The viral capsid protein, protein III (pIII) is responsible for infection of bacteria. In E. coli, the pillin protein encoded by the F factor interacts with pIII protein and is responsible for phage uptake. Hence, all E. coli hosts for M13 virus are considered male because they carry the F factor. Several investigators have determined from mutational analysis that the 406 amino acid long pIII capsid protein has two domains. The C-terminus anchors the protein to the viral coat, while portions of the N-terminus of pIII are essential for interaction with the E. coli pillin protein (Crissman and Smith, 1984, Virology 132: 445-455). Although the N-terminus of the pIII protein has been shown to be necessary for viral infection, the extreme N-terminus of the mature protein does tolerate alterations. In 1985, George Smith published experiments reporting the use of the pIII protein of bacteriophage M13 as an experimental system for expressing a heterologous protein on the viral coat surface (Smith, 1985, Science 228: 1315-1317). It was later recognized, independently by two groups, that the M13 phage pIII gene display system could be a useful one for mapping antibody epitopes. De la Cruz et al., 1988, J. Biol. Chem. 263: 4318-4322 cloned and expressed segments of the cDNA encoding the Plasmodium falciparum surface coat protein into the pIII gene, and recombinant phage were tested for immunoreactivity with a polyclonal antibody. Parmley and Smith, 1988, Gene 73: 305-318 cloned and expressed segments of the E. coli .beta.-galactosidase gene in the pIII gene and identified recombinants carrying the epitope of an anti-.beta.-galactosidase monoclonal antibody. The latter authors also described a process termed "biopanning", in which mixtures of recombinant phage were incubated with biotinylated monoclonal antibodies, and phage-antibody complexes could be specifically recovered with streptavidin-coated plastic plates.
In 1989, Parmley and Smith, 1989, Adv. Exp. Med. Biol. 251:215-218 suggested that short, synthetic DNA segments cloned into the pIII gene might represent a library of epitopes. These authors reasoned that since linear epitopes were often .about.6 amino acids in length, it should be possible to use a random recombinant DNA library to express all possible hexapeptides to isolate epitopes that bind to antibodies.
Scott and Smith, 1990, Science 249:386-390 describe construction and expression of an "epitope library" of hexapeptides on the surface of M13. The library was made by inserting a 33 base pair Bgl I digested oligonucleotide sequence into an Sfi I digested phage fd-tet, i.e., fUSE5 RF. The 33 base pair fragment contains a random or "degenerate" coding sequence (NNK).sub.6 where N represents G, A, T or C and K represents G or T. The authors stated that the library consisted of 2.times.10.sup.8 recombinants expressing 4.times.10.sup.7 different hexapeptides; theoretically, this library expressed 69% of the 6.4.times.10.sup.7 possible peptides (20.sup.6). Cwirla et al., 1990, Proc. Natl. Acad. Sci. USA 87: 6378-6382 also described a somewhat similar library of hexapeptides expressed as pIII gene fusions of M13 fd phage. PCT publication WO 91/19818 dated Dec. 26, 1991 by Dower and Cwirla describes a similar library of pentameric to octameric random amino acid sequences.
Devlin et al., 1990, Science, 249:404-406, describes a peptide library of about 15 residues generated using an (NNS) coding scheme for oligonucleotide synthesis in which S is G or C.
Christian and colleagues have described a phage display library, expressing decapeptides (Christian et al., 1992, J. Mol. Biol. 227:711-718). The starting DNA was generated by means of an oligonucleotide comprising the degenerate codons NN(G/T)!.sub.10 with a self-complementary 3' terminus. This sequence, in forming a hairpin, creates a self-priming replication site which could be used by T4 DNA polymerase to generate the complementary strand. The double-stranded DNA was cleaved at the Sfi I sites at the 5' terminus and hairpin for cloning into the fUSE5 vector described by Scott and Smith, supra.
Other investigators have used other viral capsid proteins for expression of non-viral DNA on the surface of phage particles. The protein pVIII is a major M13 viral capsid protein and interacts with the single stranded DNA of M13 viral particles at its C-terminus. It is 50 amino acids long and exists in approximately 2,700 copies per particle. The N-terminus of the protein is exposed and will tolerate insertions, although large inserts have been reported to disrupt the assembly of pVIII fusion proteins into viral particles (Cesareni, 1992, FEBS Lett. 307:66-70). To minimize the negative effect of pVIII fusion proteins, a phagemid system has been utilized. Bacterial cells carrying the phagemid are infected with helper phage and secrete viral particles that have a mixture of both wild-type and pVIII fusion capsid molecules. pVIII has also served as a site for expressing peptides on the surface of M13 viral particles. Four and six amino acid sequences corresponding to different segments of the Plasmodium falciparum major surface antigen have been cloned and expressed in the comparable gene of the filamentous bacteriophage fd (Greenwood et al., 1991, J. Mol. Biol. 220:821-827).
Lenstra, 1992, J. Immunol. Meth. 152:149-157 described construction of a library by a laborious process encompassing annealing oligonucleotides of about 17 or 23 degenerate bases with an 8 nucleotide long palindromic sequence at their 3' ends. This resulted in the expression of random hexa- or octa-peptides as fusion proteins with the .beta.-galactosidase protein in a bacterial expression vector. The DNA was then converted into a double-stranded form with Klenow DNA polymerase, blunt-end ligated into a vector, and then released as Hind III fragments. These fragments were then cloned into an expression vector at the C-terminus of a truncated .beta.-galactosidase to generate 10.sup.7 recombinants. Colonies were then lysed, blotted on nitrocellulose filters (10.sup.4 /filter) and screened for immunoreactivity with several different monoclonal antibodies. A number of clones were isolated by repeated rounds of screening and were sequenced.
Cull et al., 1992, Proc. Natl. Acad. Sci. USA 89:1865-1869 described a system in which random peptides were fused to the carboxy terminus of the lac repressor. The fusion proteins contained an intact lac amino terminus (which is responsible for specific binding of the lac repressor to the DNA sequences constituting the lac operator sites). The nucleotide sequences encoding the fusion protein were cloned into a plasmid containing copies of the lac operator site. Thus, when the fusion protein was expressed in bacteria, it became bound to the operator sites of the plasmid encoding it. This provided a physical linkage between the fusion protein and the gene encoding it. When bacteria containing the plasmid were screened with ligands for which it was desired to isolate binding partners, the fusion proteins comprising peptides that specifically bound to the ligand were isolated, carrying along the genes that encoded those fusion proteins.
A comprehensive review of various types of peptide libraries can be found in Gallop et al., 1994, J. Med. Chem. 37:1233-1251.
2.2. LIGANDS USED TO SCREEN PEPTIDE LIBRARIES
Screening of peptide libraries has generally been confined to the use of a restricted number of ligands. Most commonly, the ligand has been an antibody (Parmley and Smith, 1989, Adv. Exp. Med. Biol. 251:215-218;Scott and Smith, 1990, Science 249:386-390). In many cases, the aim of the screening is to identify peptides from the library that mimic the epitopes to which the antibodies are directed. Thus, given an available antibody, peptide libraries are excellent sources for identifying epitopes or epitope-like molecules of that antibody (Yayon et al., 1993, Proc. Natl. Acad. Sci. USA 90:10643-10647).
While previous studies have succeeded in identifying epitopes and epitope-like molecules from peptide libraries, it has not been realized in the prior art that this approach could be extended by using the identified epitopes in a further round of screening of a peptide library to identify antibody-like molecules.
When it has been desired to obtain antibody-like molecules, the prior art has employed peptide libraries that contain naturally occurring antibody sequences. This has probably been due to the fact that specific binding by antibodies is known to depend upon a complex structure involving various complementarity determining regions (CDRs), often from both heavy and light antibody chains. Short peptides would not be expected to mimic such structures and longer peptides were thought to be unsuitable for display in the most commonly used libraries.
McCafferty et al., 1990, Nature 348:552-554 used PCR to amplify immunoglobulin variable (V) region genes and cloned those genes into phage expression vectors. The authors suggested that phage libraries of V, diversity (D), and joining (J) regions could be screened with antigen. The phage that bound to antigen could then be mutated in the antigen-binding loops of the antibody genes and rescreened. The process could be repeated several times, ultimately giving rise to phage which bind the antigen strongly.
Marks et al., 1991, J. Mol. Biol. 222:581-597 also used PCR to amplify immunoglobulin variable (V) region genes and cloned those genes into phage expression vectors.
Kang et al., 1991, Proc. Natl. Acad. Sci. USA 88:4363-4366 created a phagemid vector that could be used to express the V and constant (C) regions of the heavy and light chains of an antibody specific for an antigen. The heavy and light chain V-C regions were engineered to combine in the periplasm to produce an antibody-like molecule with a functional antigen binding site. Infection of cells harboring this phagemid with helper phage resulted in the incorporation of the antibody-like molecule on the surface of phage that carried the phagemid DNA. This allowed for identification and enrichment of these phage by screening with the antigen. It was suggested that the enriched phage could be subject to mutation and further rounds of screening, leading to the isolation of antibody-like molecules that were capable of even stronger binding to the antigen.
Hoogenboom et al., 1991, Nucleic Acids Res. 19:4133-4137 suggested that naive antibody genes might be cloned into phage display libraries. This would be followed by random mutation of the cloned antibody genes to generate high affinity variants.
In the prior art, peptide libraries have been screened with receptors to identify receptor ligand-like peptides, but peptide libraries have not been considered useful for identifying such ligand-binding peptides as those that mimic receptors.
Bass et al., 1990, Proteins: Struct. Func. Genet. 8:309-314 fused human growth hormone (hGH) to the carboxy terminus of the gene III protein of phage fd. This fusion protein was built into a phagemid vector. When cells carrying the phagemid were infected with a helper phage, about 10% of the phage particles produced displayed the fusion protein on their surfaces. These phage particles were enriched by screening with hGH receptor-coated beads. It was suggested that this system could be used to develop mutants of hGH with altered receptor binding characteristics.
Lowman et al., 1991, Biochemistry 30:10832-10838 used an improved version of the system of Bass et al. described above to select for mutant hGH proteins with exceptionally high affinity for the hGH receptor. The authors randomly mutagenized the hGH-pIII fusion proteins at sites near the vicinity of 12 amino acids of hGH that had previously been identified as being important in receptor binding.
Balass et al., 1993, Proc. Natl. Acad. Sci. USA 90:10638-10642 used a phage display library to isolate linear peptides that mimicked a conformationally dependent epitope of the nicotinic acetylcholine receptor. This was done by screening the library with a monoclonal antibody specific for the conformationally dependent epitope. The monoclonal antibody used was thought to be specific to the acetylcholine receptor's binding site for its natural ligand, acetylcholine.
Citation or identification of any reference herein shall not be construed as an admission that such reference is available as prior art to the present invention.

Antigen binding peptides (abtides) from peptide libraries


A capacitance detecting circuit includes a constant current source supplying a constant current to a voltage detection point, a time measuring unit measuring time of charge until the voltage of the voltage detection point reaches a prescribed voltage, a storage unit and an operation unit. The storage unit stores first data obtained in advance concerning the time of charge of a capacitance element having a known capacitance value, and second data obtained in advance concerning the time of charge of a capacitance component. The operation unit generates third data representing the time of charge of an object of detection from a difference between the first measurement value of the time measuring unit when the capacitance component is connected to the voltage detection point and the second data, and based on the ratio between the third data and the first data and the known capacitance value, calculates the capacitance value of the object of detection.

Devices for measuring electrostatic capacitance of a capacitor are disclosed, for example, in Japanese Patent Laying-Open Nos. 56-107170 (Patent Literature 1) and 2-271266 (Patent Literature 2). The device disclosed in Japanese Patent Laying-Open No. 56-107170 includes a power supply and a DC current measuring device. The power supply increases voltage with time at a known constant rate. The power supply and the DC current measuring device are connected in series to terminals of a capacitor. From the measured current value, electrostatic capacitance of the capacitor is calculated.
The device disclosed in Japanese Patent Laying-Open No. 2-271266 includes a DC power supply, a resistor connected between the DC power supply and a capacitor, a current detecting circuit for detecting a current flowing through the resistor, an integrating circuit for integrating charging current detected by the current detecting circuit, and an operation output unit. The operation output unit calculates electrostatic capacitance of the capacitor based on the integrated value obtained by the integrating circuit and the voltage across the capacitor terminals.


A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is heated such that the solder reflows, the cantilever springs toward its non-deflected position and is at least partially absorbed by the reflowing solder.

1. Field of the Invention
The present invention relates in general to integrated circuit packages and more particularly to ball grid array (BGA) packages.
2. Background
An increasing consideration in the design and use of integrated circuits is the package in which the integrated circuit (IC) resides. As ICs become more complex, and printed circuit boards become more crowded, IC packages continually need more leads or pins while their footprints consume smaller and smaller areas. In an effort to meet these demands, developers created the ball grid array (BGA) package.
A typical BGA package includes an IC affixed to a flexible polymide tape. A very thin conductor or wire bond connects a pad on the IC to a conductive trace on the polymide tape. The conductive trace is routed to a solder ball. The solder ball is one of an array of solder balls that connect to the opposite side of the polymide tape and protrude from the bottom of the BGA package. These solder balls interconnect with an array of pads located on a substrate, such as a printed circuit board. Accordingly, the typical BGA package electrically connects each pad on an IC to a pad on a printed circuit board.
Typical BGA packages have drawbacks arising from the different coefficients of thermal expansion for the IC and the polymide tape. In general, the coefficient of thermal expansion of a material corresponds to the degree in which the material will expand when heated and contract when cooled. As the IC and the polymide tape expand and contract at different rates, the wire bond experiences stress and tension. Such stress and tension may cause the wire bond to loosen or break, thereby disconnecting the IC from the printed circuit board.
To compensate for stress and tension caused by thermal expansion, designers have developed IC packages without wire bonds. One conventional package is a xe2x80x9cflip chipxe2x80x9d package. A flip chip package includes an IC affixed to a polymide tape with a thick adhesive such that the pads of the IC are positioned over a layer of conductive traces. Gaps in the adhesive provide room for a plurality of solder bumps that are used to connect the pads of the IC to the conductive traces. Similar to the typical BGA package, the conductive traces are routed to downward facing solder balls, which connect with pads of a substrate, such as a printed circuit board.
Accordingly, the solder bumps of the flip chip package provide an electrical connection from the pads of the IC to the layer of conductive traces. Unfortunately, several drawbacks of these packages can prevent a good electrical connection from happening. For example, the solder bump and adhesive dimensions need to be matched with a great deal of accuracy. When the solder bump diameter is small as compared to the thickness of the adhesive, the solder bump cannot connect the pads of the IC to the conductive traces. On the other hand, when the solder bump diameter is large as compared to the thickness of the adhesive, then the adhesive layer cannot sufficiently affix the IC to the tape. Furthermore, when the solder bumps are heated to cause the solder to reflow, air pockets or bubbles can form. These air pockets not only make for a poor electrical connection, but also further exacerbate the relatively narrow tolerances allowed for the solder bump and adhesive.
These drawbacks can cause the loss of an electrical connection between the IC pads and the conductive traces. Such loss lowers yield rates, which in turn increases the overall cost of package manufacture.
One aspect of the invention is to provide a package having an electrical connection between an IC and an interposer. The package comprises a solder bump, a solder ball, and an interconnect having a deflectable cantilever. When the IC is affixed to the interconnect, the solder bump applies surface tension to the deflectable cantilever, thereby causing the cantilever to deflect downward. When the solder bump is heated and the solder reflows, the reflowing solder releases the surface tension on the cantilever. According to one aspect of the invention, the cantilever then springs back toward its original position, within the reflowing solder. Thus, the reflowing solder partially absorbs the cantilever.
In one embodiment, use of a deflectable cantilever advantageously provides for greater absorption of the interconnect into the solder, thereby reducing the possible effects of air pockets. In another embodiment, use of a larger diameter solder bump advantageously provides more solder, thereby also reducing the possible effects of air pockets.
Another aspect of the invention relates to a ball grid array package for an integrated circuit. The ball grid array package interconnects a plurality of solder bumps-on an integrated circuit with a plurality of solder balls located on the exterior of the ball grid array package. The ball grid array package comprises at least one solder bump attached to an integrated circuit and at least one solder ball which is configured to interface with a printed circuit board. The ball grid array package further comprises an interposer with at least one pocket and at least one via, wherein the pocket is configured to receive the solder bump and wherein the via is configured to receive the solder ball.
The ball grid array package further comprises a conductive interconnect circuit which electrically interconnects the solder ball in the via with the solder bump in the pocket. The conductive interconnect circuit further comprises at least one deflectable cantilever which extends into the pocket such that the deflectable cantilever is partially absorbed by the solder bump the pocket.
One embodiment of the invention relates to an integrated circuit package that comprises at least one solder connection attached to an integrated circuit. The integrated circuit package further comprises a substrate with an opening which is configured to receive the solder connection attached to the integrated circuit. The integrated circuit package also comprises a resilient cantilever which extends into the opening such that the resilient cantilever applies pressure to the solder connection during reflow.
Another embodiment of the invention relates to an apparatus that comprises an interconnect layer with a first opening. The apparatus further comprises a conductor layered above the interconnect layer. The conductor comprising a deformable portion that extends into the first opening, wherein the deformable portion has resiliency that urges the deformable portion into a solder connection.
An additional embodiment relates to an integrated circuit package that comprises a first solder connection in communication with an integrated circuit. The integrated circuit package further comprises an interconnect layer having a first opening. The integrated circuit package also comprises a conductor layered above the interconnect layer. The conductor comprising a deflectable portion that extends into the first opening, wherein the deflectable portion has resiliency that urges the deflectable portion into the solder connection during reflow.
One embodiment of the invention relates to an apparatus comprising a substrate with an opening. The apparatus further comprising a conductive layer above the interconnect layer. The conductive layer comprising at least two malleable portions which extend into the opening. In another embodiment a package comprises an integrated circuit having a pad and a solder connection in communication with the pad. The package further comprises a partially deflected first conductor and a partially deflected second conductor. The partially deflected first and second conductors each at least partially absorbed by the solder connection.
In an additional embodiment, an apparatus comprises a substrate with an opening. The apparatus further comprises a conductive layer above the interconnect layer. The conductive layer comprising at least two flaps which extend into the opening. Yet another embodiment relates to a package that comprises an integrated circuit having a pad and a solder bump in communication with the pad. The package further comprises a deflectable conductor having partially deflected multiple flaps. The partially deflected multiple flaps are at least partially absorbed by the solder bump, wherein the absorption of the partially deflected multiple flaps is caused by the partially deflected multiple flaps moving from a deflected position toward a non-deflected position when the solder bump reflows.
One embodiment of the invention relates to a package for an integrated circuit that comprises an adhesive having a thickness and a solder bump having a diameter greater than the adhesive thickness. The package further comprises a conductive trace having a deflectable cantilever, wherein the deflectable cantilever deflects into a pocket when the adhesive layer affixes the integrated circuit to the conductive trace. The cantilever also springs toward its original position when the solder bump reflows. The package also comprises a solder ball and a tape attached between the conductive trace and the solder ball.
Another embodiment of the invention relates to a method for forming a package for an integrated circuit that comprises attaching a solder bump to an integrated circuit and forming a pocket in an interposer. The method further comprises tracing an interconnect over the interposer such that a deflectable portion of the interconnect extends over a portion of the pocket. The method also comprises affixing the integrated circuit to the interposer such that the solder bump deflects the deflectable portion of the interconnect into the pocket.
An additional embodiment relates to a method for forming a package for an integrated circuit. The method comprises heating a solder bump to at least partially melt the solder bump. The method further comprises allowing a deflectable portion of an interconnect to spring toward a non-deflected position of the deflectable portion. The method also comprises partially absorbing the deflectable portion into the solder of the solder bump.
Yet another embodiment of the invention relates to a method for forming a package for an integrated circuit. The method comprises forming an interconnect with at least two resilient conductors. The method further comprises deflecting the two resilient conductors with solder and heating the solder to at least partially melt the solder. The method also comprises allowing the two resilient conductors to spring into at least a portion of the solder.
One embodiment of the invention relates to a method for forming a package for an integrated circuit. The method comprises forming an interconnect with at least one deflectable flap and deflecting the flap with solder. The method further comprises heating the solder to at least partially melt the solder and allowing the flap to be absorbed by at least a portion of the solder bump.
Another embodiment of the invention relates to a method for forming an electrical connection between solder and a conductive material. The method comprises using solder to apply a surface tension on a deflectable portion of a conductive material, thereby deflecting the deflectable portion. The method further comprises heating the solder beyond a melting point, thereby substantially reducing the surface tension on the deflectable portion. The method also comprises partially absorbing the deflectable portion into the solder as the deflectable portion springs back toward its approximate original position.
An additional embodiment of the invention relates to a method for forming an electrical connection between solder and a conductive material. The method comprises using solder to deflect a cantilever and heating the solder beyond a melting point. The method further comprises partially absorbing the cantilever into the solder as the cantilever springs back toward a non-deflected position.
Yet another embodiment of the invention relates to a method for forming an electrical connection between solder and a conductive material. The method comprises using solder to deflect a cantilever from a first position to a second position and heating the solder beyond a melting point. The method further comprises at least partially absorbing the cantilever into the solder such that the cantilever moves from a second position to a third position.
One embodiment of the invention relates to a device that comprises means for affixing an integrated circuit to a conductive layer. The device further comprises means for deflecting the conductive layer and then partially absorbing the conductive layer, thereby electrically connecting the integrated circuit to the conductive layer.
For purposes of summarizing the invention, certain aspects, advantages and novel features of the invention have been described herein above. Of course, it is to be understood that not necessarily all such advantages may be achieved in accordance with any particular embodiment of the invention. Thus, the invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other advantages as may be taught or suggested herein. Furthermore, Other aspects and advantages of the invention will be apparent from the detailed description, the accompanying drawings and the appended claims.


The invention is embodied in an RF plasma reactor for processing a semiconductor workpiece, including wall structures for containing a plasma therein, a workpiece support, a coil antenna capable of receiving a source RF power signal and being juxtaposed near the chamber, the workpiece support including a bias electrode capable of receiving a bias RF power signal, and first and second magnet structures adjacent the wall structure and in spaced relationship, with one pole of the first magnet structure facing an opposite pole of the second magnet structure, the magnet structures providing a plasma-confining static magnetic field adjacent said wall structure. The invention is also embodied in an RF plasma reactor for processing a semiconductor workpiece, including one or more wall structures for containing a plasma therein, a workpiece support, the workpiece support comprising a lower electrode, an upper electrode facing the lower electrode and spaced across a plasma generation region of said chamber from said lower electrode, and first and second magnet structures adjacent the wall structure and in spaced relationship with one pole of the first magnet structure facing an opposite pole of the second magnet structure, the magnet structures providing a plasma-confining static magnetic field adjacent said wall structure.

1. Field of the Invention
The present invention relates to RF plasma processing reactors and, more particularly, to an inventive plasma reactor which uses a radio frequency (RF) energy source and a multiple coil antenna for inductively coupling the associated RF electromagnetic wave to the plasma.
2. Description of the Related Technology
The trend toward increasingly dense integrated geometries has resulted in components and devices of very small geometry which are electrically sensitive and susceptible to damage when subjected to wafer sheath voltages as small as approximately 200-300 volts due to energetic particle bombardment or radiation. Unfortunately, such voltages are of smaller magnitude than the voltages to which the circuit components are subjected during standard integrated circuit fabrication processes.
Structures such as MOS capacitors and transistors fabricated for advanced devices have very thin (thickness  less than 200 Angstroms) gate oxides. These devices may be damaged by charge-up, resulting in gate breakdown. This can occur in a plasma process when neutralization of surface charge does not occur, by non-uniform plasma potential/or density, or by large RF displacement currents. Conductors such as interconnect lines may be damaged for similar reasons as well.
RF Systems
Consider first prior art semiconductor processing systems such as CVD (chemical vapor deposition) and RIE (reactive ion etching) reactor systems. These systems may use radio frequency energy at low frequencies from about 10-500 KHz up to higher frequencies of about 13.56-40.68 MHz. Below about 1 MHz, ions and electrons can be accelerated by the oscillating electric field, and by any steady state electric field developed in the plasma. At such relatively low frequencies, the electrode sheath voltage produced at the wafers typically is up to one or more kilovolts peaks, which is much higher than the damage threshold of 200-300 volts. Above several MHz, electrons are still able to follow the changing electric field. More massive ions are not able to follow the changing field, but are accelerated by steady state electric fields. In this frequency range (and at practical gas pressures and power levels), steady state sheath voltages are in the range of several hundred volts to 1,000 volts or more.
Magnetic Field-Enhancement
A favorite approach for decreasing the bias voltage in RF systems involves applying a magnetic field to the plasma. This B field confines the electrons to the region near the surface of the wafer and increases the ion flux density and ion current and, thus, reduces the voltage and ion energy requirements. By way of comparison, an exemplary non-magnetic RIE process for etching silicon dioxide might use RF energy applied at 13.56 MHz, an asymmetrical system of 10-15 liters volume, 50 millitorr pressure and an anode area to wafer-support cathode area ratio of approximately (8-10) to 1, and develop wafer (cathode) sheath voltage of approximately 800 volts. The application of a magnetic field of 60 gauss may decrease the bias voltage approximately 25-30 percent, from 800 volts to about 500-600 volts, while increasing the etch rate by as much as about 50 percent.
However, the application of a stationary B field parallel to the wafer develops an Exc3x97B ion/electron drift and an associated plasma density gradient which is directed diametrically across the wafer. The plasma gradient causes non-uniform etching, deposition and other film properties across the wafer. The non-uniformities may be decreased by rotating the magnetic field around the wafer, typically either by mechanical movement of permanent magnets, or by using pairs of electromagnetic coils which are driven in quadrature, 90 degrees out of phase, or by instantaneously controlling the current in pairs of coils to step or otherwise move the magnetic field at a controlled rate. However, although rotating the field reduces the non-uniformity gradient, typically some degree of non-uniformity remains.
Furthermore, it is difficult to pack coils and, in particular, to pack two or more pairs of coils about a chamber and to achieve a compact system, especially when using a Helmholtz coil configuration and/or a multi-chamber system of individual magnetic-enhanced reactor chambers surrounding a common loadlock.
A unique reactor system which has the capability to instantaneously and selectively alter the magnetic field strength and direction, and which is designed for use in compact multi-chamber reactor systems, is disclosed in commonly assigned U.S. Pat. No. 4,842,683, issued Jun. 27, 1989, in the name of inventors Cheng et al.
Microwave/ECR Systems
Microwave and microwave ECR (electroncylotron resonance) systems use microwave energy of frequencies  greater than 800 MHz and, typically, frequencies of 2.45 GHz to excite the plasma. This technique produces a high density plasma, but low particle energies which may be below the minimum reaction threshold energy for many processes, such as the reactive ion etching of silicon dioxide. To compensate, energy-enhancing low frequency electrical power is coupled to the wafer support electrode and through the wafer to the plasma. Thus, the probability of wafer damage is decreased relative to previous systems.
Microwave and microwave ECR systems operated at practical power levels for semiconductor wafer processing such as etch or CVD require large waveguide for power transmission, and expensive tuners, directional couplers, circulators, and dummy loads for operation. Additionally, to satisfy the ECR condition for microwave ECR systems operated at the commercially available 2.45 GHz, a magnetic field of 875 gauss is necessitated, requiring large electromagnets, large power and cooling requirements.
Microwave and microwave ECR systems are not readily scalable. Hardware is available for 2.45 GHz, because this frequency is used for microwave ovens. 915 MHz systems are also available, although at higher cost. Hardware is not readily or economically available for other frequencies. As a consequence, to scale a 5-6 in. microwave system upward to accommodate larger semiconductor wafers requires the use of higher modes of operation. This scaling at a fixed frequency by operating at higher modes requires very tight process control to avoid so-called mode flipping to higher or lower order loads and resulting process changes. Alternatively, scaling can be accomplished, for example, for a 5-6 in. microwave cavity, by using a diverging magnetic field to spread out the plasma flux over a larger area. This method reduces effective power density and thus plasma density.
HF Transmission Line System
Previously mentioned, commonly assigned parent patent application U.S. Ser. No. 559,947, entitled VHF/UHF REACTOR SYSTEM, filed Jul. 31, 1990, in the name of the inventors Collins et al (AMAT File 151-1) is incorporated by reference. This incorporated application discloses a high frequency VHF/UHF reactor system in which the reactor chamber itself is configured in part as a transmission line structure for applying high frequency plasma generating energy to the chamber from a matching a network. The unique integral transmission line structure permits satisfaction of the requirements of a very short transmission line between the matching network and the load and permits the use of relatively high frequencies, 50 to 800 MHz. It enables the efficient, controllable application of RF plasma generating energy to the plasma electrodes for generating commercially acceptable etch and deposition rates at relatively low ion energies and low sheath voltages. The relatively low voltages reduce the probability of damage to electrically sensitive small geometry semiconductor devices. The VHF/UHF system avoids various other prior art shortcomings, such as the above-described scalability and power limitations.
The invention is embodied in an RF plasma reactor for processing a semiconductor workpiece, including wall structures for containing a plasma therein, a workpiece support, a coil antenna capable of receiving a source RF power signal and being juxtaposed near the chamber, the workpiece support including a bias electrode capable of receiving a bias RF power signal, and first and second magnet structures adjacent the wall structure and in spaced relationship, with one pole of the first magnet structure facing an opposite pole of the second magnet structure, the magnet structures providing a plasma-confining static magnetic field adjacent said wall structure.
The invention is also embodied in an RF plasma reactor for processing a semiconductor workpiece, including one or more wall structures for containing a plasma therein, a workpiece support, the workpiece support comprising a lower electrode, an upper electrode facing the lower electrode and spaced across a plasma generation region of said chamber from said lower electrode, and first and second magnet structures adjacent the wall structure and in spaced relationship with one pole of the first magnet structure facing an opposite pole of the second magnet structure, the magnet structures providing a plasma-confining static magnetic field adjacent said wall structure.

Magnetic confinement in a plasma reactor having an RF bias electrode


An image processing apparatus in the present disclosure includes a color conversion processing unit, a modulation candidate creating unit, a color value modulating unit, and an output unit. The color conversion processing unit performs color conversion from an input color value of a target image to a corresponding output color value to obtain a tentative output color value. The modulation candidate creating unit creates, as modulation candidates, combinations of integer values obtained by rounding up or down the decimal fraction of each color component of a tentative output color value. The color value modulating unit selects a modulation candidate at random and performs modulation by replacing the tentative output color value with the selected modulation candidate. The output unit outputs the target image according to the color value obtained after the modulation.

Unless otherwise indicated herein, the description in this section is not prior art to the claims in this application and is not admitted to be prior art by inclusion in this section.
Typical image forming apparatuses, such as printers and multi-function peripherals ("MFPs"), use a pulse-surface-area modulation method or a pseudo modulation method (e.g. ordered dithering method, error diffusion method, or the like), in which a multi-valued color is artificially represented with a set of dots, to perform an image process.
In this image process, however, if the number of gradation steps is limited, for example, to improve stabilization, a visual discontinuity may occur in the image. This visual discontinuity may cause so-called "contouring," significantly reducing image quality.
To solve this problem of contouring, various technologies have been proposed. For example, to perform correction mainly to improve gradation characteristics, noise is added to a portion at which continuity is lost in input/output characteristics or a reference value in an error diffusion method is changed.
However, contouring may appear when the same color value continues in a certain area. It is not possible to prevent this contouring efficiently with the above technology.
In other words, it has not been possible to solve the problem that contouring occurs when the same color value continues with the above technology.
If correction or process is performed more than necessary to prevent contouring, there has been a risk that image quality would be lowered.
The present disclosure relates to an image processing apparatus that prevents the occurrence of contouring by irregularly performing fine modulation on tentative output color values obtained by color conversion without impairing image quality.

Image processing apparatus that performs color conversion and image processing method


A hand-held token can be operated to generate an acoustic signal representing the digital signature generated by a private key of a public key/private key pair. Verifiers that might be located at, e.g., buildings, in vehicles, at bank ATMs, etc. receive the signal and retrieve the corresponding public key to selectively grant access authorization to components served by the verifiers. Methods and systems permit adding and removing a token from the access list of a verifier. Other methods and systems enable the token to be used with several verifiers that are nearby each other, such as might be the case with multiple vehicles owned by the same user and parked nearby each other, without more than one verifier being operated to grant access.

I. Field of the Invention
The present invention relates generally to authentication using audio tones.
II. Background of the Invention
As Internet use has grown, many types of convenient electronic commerce have been made possible, such as, for example, buying goods and services online, banking online, and using automatic teller machines (ATM) that are linked to remote banks. But the very convenience of electronic commerce has made it easier for thieves to steal valuable information and/or to pose as someone they are not to purchase goods, withdraw money from bank accounts, and so on.
Accordingly, affording security in electronic transactions is crucial. To this end, many electronic transactions are encrypted, to conceal private information being exchanged. But encryption is only one aspect of security, since it only provides confidentiality. Encryption does not authenticate the parties involved or ensure the integrity/authenticity of the information being exchanged.
With this in mind, it readily may be appreciated that authentication is an important aspect of security. In terms of electronic commerce, the person seeking authentication does so through a computer interface. Consequently, it normally is not feasible to resort to checking a biological feature of the person (appearance, handwritten signature, fingerprint, and so on) to verify that the person is who he says he is, absent the widespread installation of an infrastructure of bio-sensing computer accessories.
This leaves two authentication factors available, namely, authenticating a person based on something the person has, such as a credit card or key fob, or based on something the person knows, such as a password or personal identification number (PIN). For some particularly sensitive applications such as ATM money withdrawals, both factors might be desirable.
The above-identified patent applications disclose hand-held sonic-based "tokens" that a person can manipulate to transmit an acoustic signal to a device, referred to as an "authenticator" or "verifier", to authenticate the person based on the signal. As recognized in those applications, the advantage of sonic-based tokens is that a large installed infrastructure already exists to receive and transmit sound and electronic signals derived from sound. Specifically, the global telephone system exists to transmit data representative of acoustic information, and apart from telephones many computing devices that are now linked by this same system (as embodied in the Internet) have microphones and speakers (or can easily be modified to have them).
In the above-disclosed systems, a user can manipulate a token to send an acoustic signal to a verifier, with the acoustic signal representing a digital signature generated by using a private key known only to the user's token. The verifier receives the signal, converts it to electrical signals, and then uses a public key associated with the private key to verify the signature. Use of public key-private key principles facilitates robustness, in that a single token can be used for multiple purposes, such as for building access, vehicle access, ATM access, and so on, without the possibility that, for example, an unscrupulous security guard having access to a list of tokens authorized for building access could gain entrance to a vehicle or bank account that grants authorization to a token that happens to be on the building access list. Without the private key provided by the token, authorization cannot be granted by a verifier.
As recognized herein, the verifier can be controlled by a central computer that contains an access list used to verify a user's identity, based on the sonic signal received from a token. An example of such a verifier might be a building entrance verifier that allows entry into one or more buildings in a complex of buildings. To add or delete users from the access list, one need simply to modify the centrally-located list.
As also recognized herein, however, for certain other applications such as vehicle entry or home entry, verification is done at the location of the verifier, e.g., at the car or home. In these applications, adding or deleting a user from an access list can be more of a problem, because the verifier might not include a data entry device. Moreover, the present invention further recognizes that while it is desirable to enable a single token to be used to gain access to multiple verifiers, two closely located verifiers might receive the sonic activation signal and both grant access, when the user desires only access to one. For example, if a user has two vehicles parked in a driveway, both of which grant access based on a sonic token, it is desirable that the user be able to gain access to one of the vehicles without also unlocking the other vehicle, the front door of the house, etc. Having recognized these considerations, the invention described below is provided.

System and method for managing sonic token verifiers


An artificial intelligence apparatus for generating training data includes a memory configured to store a target artificial intelligence model, and a processor configured to receive sensor data, determine whether the received sensor data is irrelevant to a learning of the target artificial intelligence model, determine whether the received sensor data is useful for the learning if the received sensor data is determined to be relevant to the learning, extract a label from the received sensor data by using a label extractor if the received sensor data is determined to be useful for the learning, determine a confidence level of the extracted label, and generate training data including the received sensor data and the extracted label if the determined confidence level exceeds a first reference value.

The disclosure relates to an artificial intelligence apparatus for generating training data, an artificial intelligence server, and a method for the same. Specifically, the disclosure relates to an artificial intelligence apparatus for determining whether data is suitable for a learning of a target artificial intelligence model among data collected in a real environment and adding labeling data to the data suitable for the learning to generate training data, an artificial intelligence server, and a method for the same.
The research and application of artificial intelligence (AI) by using a deep learning algorithm has been actively conducted. AI models based on the deep learning algorithm are learned by using training data. The training data includes labeling data, and the labeling data serves as a correct answer to the result inferred from the AI model.
In order for the AI model to be accurately learned, the training data must include accurate labeling data. Currently, a person (e.g., an administrator, etc.) directly determines the labeling data to be included in the training data. Therefore, a large amount of human resources are required to generate training data from massive data, and there is a problem in that training data must be generated manually by human effort.

Artificial intelligence apparatus for generating training data, artificial intelligence server, and method for the same


A radiation detector attaching and detaching device, for a radiation detecting apparatus having a plurality of radiation detectors for detecting radiation and a radiation detector stand for respectively maintaining the radiation detectors in trenches arranged with a predetermined interval. The radiation detector attaching and detaching device has a pair of rotational jigs abutting against projections provided at both sides of each of the radiation detectors maintained in the radiation detector stand; and a pair of rotational members configured to be freely rotatable, the rotational members comprising the rotational jigs.

1. Field of the Invention
The present invention relates to a radiation detector attaching and detaching device, more particularly, to a radiation detector attaching and detaching device for a radiation detecting apparatus which detects radiations such as gamma ray (γ ray) and X ray.
2. Related Art
Various conventional radiation detectors have been known, and U.S. Pat. No. 6,236,051 discloses an example of such conventional radiation detectors. According to disclosure of U.S. Pat. No. 6,236,051, the radiation detector comprises a plurality of common electrode plates, a plurality of semiconductor cells, and a plurality of electrode plates. This radiation detector has a laminated body between two frames, one of the frames and the other one of the frames are fixed with each other by pins. Herein, the laminated body is formed by accumulating the common electrode plates, the semiconductor cells and the electrode plate, in which one common electrode plate, one semiconductor cell, one electrode plate, another semiconductor cell, another common electrode plate and the like are accumulated in this order.
According to the radiation detector disclosed by U.S. Pat. No. 6,236,051, because a pair of semiconductor cells adjacent in X-direction shares the common electrode plate, it is possible to decrease a dead zone where radiation cannot be detected, thereby improving a radiation detection efficiency.
However, in the conventional radiation detector such as the radiation detector disclosed by U.S. Pat. No. 6,236,051, a plurality of components such as common electrode plate and semiconductor cell are laminated to provide a radiation detecting apparatus. Therefore, when malfunction occurs in a part of the semiconductor cells, the entire radiation detector must be disassembled, and the semiconductor cells in which no malfunction occurs should be also detached from the radiation detector.

Radiation detector attaching and detaching device


A decision-making support system for a sewer maintenance that includes a graphic user interface that outputs a function selection means of a user and a decision-making support result through a GIS-based graphic screen, a sewage storing unit that stores sewer data including a sewage pipe network data, an aged pipe diagnosis evaluation factor data and a detailed item-based weight data, a sewer maintenance decision-making module that judges a preset object sewer-based aged degree and a sewer exchange priority based on the data stored in the sewage data storing unit and outputs a decision-making support result for the computed sewer maintenance to a user through the graphic user interface, and a sewer maintenance control module that controls the operations of the graphic user interface, the sewage data storing unit and the sewer maintenance decision-making module based on a preset control program.

Generally, when an aged and damaged sewage pipe is left alone, a lot of polluted water such as underground water is inputted into a sewage disposal plant, and the input of the polluted water significantly decreases a dilution and purification function of a sewage disposal plant. In addition, the sewage directly outputted from the damaged sewage pipe pollutes underground water and soil, thus becoming an important factor of environment pollution.
In the maintenance of a sewer, an exchange and maintenance of a facility are performed with respect to a sewer having a problem. The sewer judged to make a problem is previously exchanged and maintained. The above maintenance of the sewer is classified into an exchange, update, maintenance and maintenance management.
In the maintenance of a sewer, one of the important factors is to check status with respect to an aged sewer and to setup a maintenance plan. Therefore, it is urgently needed to develop a sewer management system that may be implemented in such a manner that the aged degree of pipes is computed based on a data accumulation of pipes, history management, and computation of aging factors, and the sewage pipe network is systematically maintained based on the computed aged degree.

Decision-making support system for sewer maintenance and control method thereof