The flexible screw of the invention comprises a flexible rod and a cord helically set on the rod, and can be installed along straight and curved paths of transport. It ensures smooth transport of containers and provides container transport apparatus of simplified construction at reduced cost. Moreover, abrasion of pipe during transport of powder and granular material can be reduced. The container transport apparatus of the present invention is equipped with the screw mentioned above and a guide, or two screws, the members of each pair being positioned in parallel at a given distance, and transfers containers held by the screw and the guide, or the two screws by rotating the screw(s). The container transport apparatus of the present invention enables smooth transport of containers even through a curved path, reduces maintenance cost of the screw(s) during operation, and inhibits abrasion of the rail to a considerable degree. Further, the powder and granular material transport apparatus of the present invention reduces abrasion of pipe.

To give containers of the above-mentioned type and having increased capacities, vertically elongated and lightweight containers (e.g., polyethylene terephthalate (PET) bottles) have found wide use in recent years, so that when transported on belt conveyors or roller conveyors which are usually used, these containers are liable to tumble and transport is difficult. Conveyors further have the problems, for example, of necessitating accurate positioning, occupying a large space as fixed equipment and requiring a high equipment cost.
Container transport apparatus are therefore already in use which comprise two screws made of resin or the like and arranged in parallel at a specified distance from each other and which are adapted to transport containers by rotating the screws, with the neck of each container held between the screws (usually with a flange at the neck of the container in engagement with the screws to hold the container therebetween in suspension).
The apparatus transports containers by a principle entirely different from that of conventional conveyors, i.e., by the frictional contact of the screws with the neck of the container, and permits accurate container position, facilitated automation of production lines, its simple and compact construction and low equipment cost.
Generally, the screws for use in the apparatus comprise a rigid rod prepared from resin or the like by solidification and are formed with a helical continuous groove. However, due to their rigidness, such screws cannot be employed for curved paths of transport although they are usable for straight transport paths. Accordingly, the curved transport path requires another transport device, which renders the overall container transport apparatus complex in construction and more costly as equipment and is likely to impede smooth transport.
On the other hand, coiled wires are available which are similar in construction to the screws described above. Wires of this type are conventionally used for transporting powder and granular materials, and many of them are made of a metal such as steel. Apparatus for transporting powder and granular materials comprise such a coiled wire inserted in and extending through a metal or resin pipe, and are so adapted that the powder and granular materials placed into an inlet formed in one end of the pipe are transported to an outlet formed in the other end thereof by rotating the wire.
However, since the wire is made of a metal material, the pipe undergoes marked abrasion. Especially when the apparatus is initiated into operation, the wire is very likely to come into contact with the pipe inner wall, which in turn is ground by the wire and easily wears away. It is therefore important to avoid the abrasion of the pipe inner wall to the greatest possible extent to reduce the cost of maintenance.
Accordingly, an object of the present invention is to provide a screw most suited for use in apparatus for transporting powder and granular materials as well as in container transport apparatus to thereby overcome the foregoing problems.
Another object of the present invention is to provide a novel apparatus for transporting containers or powder and granular materials with use of the screw fulfilling the above object.

Flexible screw and transport apparatus comprising same


A holder (20) for a cutting insert (12), which includes a head (22) with a pocket (24) for holding the cutting insert and a bar device (26) for supporting the head, allows the use of a removable head for a miniature head and bar device that fits into a small hole in a workpiece, and allows rapid and easy replacement of the head. The head has a front part (42) of small height for holding the cutting insert and has a taller rear part (40) of the same height as the bar device. The head rear part has a screw-receiving hole (56) that extends at a downward-rearward incline (A) into a corresponding threaded hole (62) at the front of the bar device. The head and bar device respectively have a recess (70) and a projection (74) that lie around the screw-receiving holes and that align the head and bar device. A coolant passageway system (92) in the bar device provides coolant for both right and left hand heads.

Small holes drilled into a workpiece can be machined to form a precision finished surface on the hole walls, by rotating the workpiece on a lathe while a cutting insert is advanced within the hole. The cutting insert is mounted in a pocket of a holder head. It is often desirable to detachably mount the holder head on a holder bar device so the head can be replaced. In prior systems, holder heads on bar devices of ⅝th inch and larger diameters are held by a multiple screw/multiple serration system. In that system, precision mounting of the head on the bar device is achieved by miniature screws and multiple serrations on each part that interfit. For bar diameters of under ⅝th inch the cost to manufacture a screw and serration configuration makes such system impractical. In prior art systems for bar diameters under ⅝th inch the holder device is simply brazed to the bar device in a one piece construction.
It would be desirable if a machining apparatus were available that could be practically built on smaller shanks such as those of ⅜ths inch diameter, and that was of simpler and lower cost construction. If the holder head could be easily replaced on the bar device, a holder head could be used that had an insert-holding pocket that could receive a particular type of cutting insert, and a damaged head could be replaced on a holder device without removal from the machine tool.


The presently disclosed inventive concepts are directed in certain embodiments to a method of producing protoporphyrin IX by (1) cultivating a strain of Shewanella bacteria in a culture medium under conditions suitable for growth thereof, and (2) recovering the protoporphyrin IX from the culture medium. The strain of Shewanella bacteria comprises at least one mutant hemH gene which is incapable of normal expression, thereby causing an accumulation of protoporphyrin IX. In certain embodiments of the method, the strain of Shewanella bacteria is a strain of S. loihica, and more specifically may be S. loihica PV-4. In certain embodiments, the mutant hemH gene of the strain of Shewanella bacteria may be a mutant of shew_2229 and/or of shew_1140. In other embodiments, the presently disclosed inventive concepts are directed to mutant strains of Shewanella bacteria having at least one mutant hemH gene which is incapable of normal expression, thereby causing an accumulation of protoporphyrin IX during cultivation of the bacteria. In certain embodiments the strain of Shewanella bacteria is a strain of S. loihica, and more specifically may be S. loihica PV-4. In certain embodiments, the mutant hemH gene of the strain of Shewanella bacteria may be a mutant of shew_2229 and/or shew_1140.

Protoporphyrin IX (7,12-diethenyl 3,8,13,17-tetramethyl-21II,23II-porphine 2,18 dipropanoic acid) is the direct precursor of heme B (Fe-protoporphyrin IX), hemin (heme B with a chloride ligand), and hematin (hemin with a hydroxide ligand in place of the chloride). Heme is the prosthetic group for hemoproteins including hemoglobin and catalases, which are crucial for respiration and detoxification in humans and animals. The photosensitivity of protoporphyrin IX has been utilized in photodynamic therapy (PDT), a therapy against different forms of cancer. Protoporphyrin IX has been used as a therapeutic supplement for patients with infective hepatitis and chronic liver diseases. The biological heme synthesis pathway is very conservative among prokaryotes (e.g. bacteria) and eukaryotes (e.g., human). Ferrochelatase (EC 22.214.171.124) is the terminal enzyme in the heme biosynthesis pathway and catalyzes the insertion of Fe2+ into protoporphyrin IX. In the best-studied laboratory model bacterium Escherichia coli K12 strain, a hemH mutant is sensitive to visible light due to the accumulation of protoporphyrin IX. This is similar to the defect observed in human protoporphyria (Miyamoto et al. J Mol Biol. 1991, 219(3):393-398; Miyamoto et al. FEBS Lett. 1992, 310(3):246-248; Miyamoto et al. J Biochem. 1994, 115(3):545-551; Nakahigashi et al. Proc Natl Acad Sci USA. 1991, 88(23):10520-10524).
The price of protoporphyrin IX is about 36,000 $US/kg in the world market, and the products are usually extracted from livestock blood. It is known that such blood-based production processes are high cost, may cause contamination to the environment (e.g., due to use of large amounts of chemicals), and may present health risks to humans and animals (e.g., due to viruses and prions). The chemical synthesis of protoporphyrin has been proposed, but has not been commercially feasible due to high cost and possible contamination.

Methods of producing protoporphyrin IX and bacterial mutants therefor

The Board of Regents of the University of Oklahoma


An electronic device including a multi-chip die and a substrate member, said multi-chip die includes a plurality of integrated circuit chips which are integrally formed on the multi-chip die as a unitary member, each the integrated chip includes a plurality of electrodes for making external electrical contacts, the substrate member includes a circuit of a pre-determined pattern and a plurality of electric contacts disposed for making corresponding electrical connections with the electrodes of the integrated chips of the multi-chip die, the plurality of integrated circuit chips of the multi-chip die being connected as a unitary member to the substrate member.

The use of semiconductor integrated circuits, especially in electronic devices, have greatly proliferated since their invention in early 1960's. Traditionally, semiconductor integrated circuits are provided and used in packaged forms with a semiconductor chip bonded to a lead-frame header or other package or substrate by find gold or aluminum wires that loop from contact pads disposed around the periphery of the circuitry surface of the semiconductor chips.
In order to alleviate the adverse parasitic effects as well as fulfilling the industry-wide demand for high lead counts and small foot prints, the "flip-chip" method or technology for bonding a semiconductor integrated circuit chip to a substrate was introduced. The flip-chip bonding technology has been described in many publications such as, for example, U.S. Pat. No. 3,429,040 issued to L. F. Miller in 1969 and many other subsequently published U.S. patent specifications. The conventional way to bond a semiconductor integrated circuit chip onto a substrate is by firstly flipping the semiconductor chip over so that the contact pads disposed on the top peripheral surface of the semiconductor chip is directly opposite the surface of a substrate member on which there are formed a corresponding set of contact pads for making interconnections between the semiconductor chip and the substrate member. The corresponding contact pads on the integrated circuit chip and the substrate member are then aligned and subsequently connected together to complete the electrical connection. Typically, the external electrodes or contact pads on an integrated circuit chip are provided with solder balls or bumps to ensure reliable connection and the components are connected by appropriate connection methods or means such as, for example, reflow soldering.
However, with the ever increasing demand for additional and improved performance from electric devices, more and more integrated circuits are required on an electronic device and the cost-effectiveness or benefits of the conventional flip-chip bonding technology begin to decline.
For example, in the early versions of mobile telephones or hand-held games, a single integrated circuit display driver chip may be sufficient to drive the entire display screen. However, to fulfill the ever increasing demand for additional features to be available for display and the ever increasing demand for higher resolution of such display features, a plurality of integrated circuit display drivers may be required for a single display means which is typically, but not limited to, an LCD display screen.
Likewise, with the ever increasing demand for further miniaturization of hand-held electronic devices such as, for example, mobile phones or hand-held computers, coupled with the ever increasing operating speed or frequencies of such devices, it is a clear trend that more and more integrated circuit chips connected by non-wire bonding means will be required by such electronic devices. On the other hand, it is noted that the yielding rate or productivity of electronic devices, modules or sub-assemblies declines significantly with the increasing number of "flip-chip" bonded integrated circuit chips. Hence, it will be highly desirable if there can be provided electronic devices, modules or sub-assemblies containing a plurality of integrated circuitry chips connected by the non-wire bonding means while alleviating the adverse consequences associated with the conventional flip-chip bonding technologies or methods. Similarly, it will be highly desirable if there can be made available electronic devices, modules including a plurality of integrated circuit chips connected by non-bonding wire means while alleviating the known adverse consequences of conventional flip-chip technology and method.

Flip-chip sub-assembly, methods of making same and device including same


A keypad includes an elastic layer for providing a restoring force to the keypad and an electric paper on the elastic layer, in which a plurality of key button regions for providing symbols in the form of images are defined. A keypad assembly includes a keypad, which has an elastic layer for providing a restoring force to the keypad and an electric paper on the elastic layer, in which a plurality of key button regions for providing symbols in the form of images are defined, and a switch board under the keypad for converting a pressure applied by a user to the key button region into an electric contact.

1. Field of the Invention
The present invention generally relates to a keypad, and in particular, to a keypad and a keypad assembly for a portable communication terminal.
2. Description of the Related Art
Portable communication terminals are evolving into complex multi-functional devices capable of providing various functions. Thus, a keypad of the portable communication terminal has to support characters and special characters in addition to numbers, and their size has to be fit accordingly due to the characteristic of a portable device.
A general qwerty-type keypad can be mounted in a portable communication terminal to input characters, but its large volume may become an issue due. These days, the keypad mounted in the portable communication terminal needs to provide a plurality of characters, numbers and special characters in a single key button.
A general keypad mounted in the portable terminal usually serves as a number input means for selecting a phone number. A character coining method in which characters, numbers, and special characters on a display device are selected with a single key may be used. In addition, the portable communication terminal may include a touch screen as an input means. However, in a touch screen type input device, a user cannot feel the activation of a key during operation.
If the user cannot feel the press of a key or cannot accurately press the desired key, the user may press adjacent another key, causing inaccurate manipulation of the keypad. Moreover, in a keypad supporting a plurality of characters with a single key, the user has to select the desired character from small-size characters printed in each key. As a result, a user who is not accustomed to use this type of keypad has to spend much time and effort in learning to manipulate the keypad accurately.


A saw blade clamping mechanism includes a holder connectable to a reciprocating shaft of a power sawing tool. The holder has a sliding way, a receiving slot for insertion of a saw blade, and a through hole in communication between the sliding way and the receiving slot. A steel ball is movably installed in the through hole. A sliding block is mounted in the sliding way and moveable between a first position for receiving the steel ball for removal of the saw blade out of the receiving slot and a second position to force the steel ball into the receiving slot to lock the saw blade. A spring member supports the sliding block in the second position. A control knob is connected to the sliding block for operation by the user to move the sliding block from the second position to the first position.

1. Field of the Invention
The present invention relates to a power sawing tool having a reciprocating shaft connected to a saw blade, and more specifically to a saw blade clamping mechanism for the power sawing tool.
2. Description of the Related Art
The saw blade clamping mechanism, which is so-called saw blade connector, for a sawing tool is adapted to secure a saw blade to a reciprocating shaft for allowing the saw blade to be reciprocated by the reciprocating shaft. During cutting working, the saw blade may break, and the operator must detach the broken saw blade from the sawing tool for a replacement. Therefore, it is important to design a saw blade clamping mechanism, which allows quick replacement of the saw blade.
U.S. Pat. No. 6,009,627 discloses a saw blade clamping arrangement for a power tool. According to this design, the saw blade clamping arrangement comprises a biasing member interconnected with the drive shaft and operative for providing a biasing force to retain the saw blade in operative connection with the drive shaft, and an actuation member selectively moveable between a first position and a second position. The first position permits the biasing force of the biasing member to retain the operating connection between the saw blade and the drive shaft. The second position causes the actuation member to overcome the biasing force, thereby permitting removal of the saw blade from the drive shaft. This design of saw blade clamping arrangement is functional. However, because this arrangement uses a number of complicated parts, the installation procedure is complicated, and the manufacturing cost is high. Further, the complicated parts may fail easily during working of the power tool.

Saw blade clamping mechanism for a power tool


An electric motor adjustable support device for supporting padding of seating and/or lounging furniture. In particular, padding of seating and/or lounging furniture, such as the mattress of a bed. The support device has a base part and a support part that is connected to the base part, so as to be swivelable about a first swivel axis. In the region of the first swivel axis, at least one first wedge-like lifting guide element is situated at the base part. Further, at least one second wedge-like lifting guide element, opposite from the first wedge-like lifting guide element, is situated at the support part.

These types of support devices in the form of slatted frames, for example, are generally known.
An electric motor-driven adjustable support device of the type in question is known from EP 3 009 052 A2, having a base part, and a support part that is connected to the base part so as to be swivelable about a first swivel axis. The support device also includes an electric motor-driven drive device that is in operative connection with the base part and the support part in order to adjust the swiveling of the support part relative to the base part, the base part and the support part being designed and operatively connected to the drive device in such a way that the support part is adjustable between an unadjusted starting position, in which the support part lies flat on the base part, and an end position of the adjustment movement in which the support part is situated at an angle relative to the base part. The support device known from the cited publication is designed as a retrofit kit, by means of which a nonmotorized support device may be retrofitted with the functionality of an electric motor-driven adjustment. For this purpose, the retrofit kit is inserted, for example, in the region of a head part of a slatted frame, between the slatted frame and the mattress. By electric motor-driven adjustment of the support part relative to the base part of the retrofit kit, the mattress may then be adjusted by electric motor in the region of the head part of the slatted frame, so that the slatted frame is retrofitted with the functionality of an electric motor-driven adjustment.

Electric motor adjustable support device


Provided are an information processing apparatus, an information processing method, an information processing program, and a recording medium having stored therein the information processing program, which can reduce time and effort necessary for a user to find his desired review information. The information processing apparatus searches transaction targets, based on a search condition used for searching transaction targets designated by a user, and acquires review information regarding each of the searched transaction targets. The information processing apparatus determines a display priority order of the review information regarding the transaction targets with respect to each of the searched transaction targets, based on the search condition, and displays at least one piece of the review information regarding each of the transaction targets on a display screen, based on the display priority order.

In the past, there have been known shopping sites that allow a user of a terminal device to purchase desired products via Internet, or facility reservation sites that allow a user of a terminal device to reserve the use of desired accommodation. A user of a terminal device accessing such sites can browse review information regarding products or accommodations, which is contributed by purchasers or users. Such review information is displayed on a terminal device in a list form in predetermined display order. For example, Patent Literature 1 (FIG. 9) illustrates a list page that displays review information regarding a particular product in descending order of date. Also, the display order of the review information may be sorted by other keys such as descending order of product evaluation.

Information processing apparatus, information processing method, information processing program, recording medium having stored therein information processing program


The present invention relates to an adaptable user interface. The adaptable user interface provides a more error free input function as well as greater ease of use when being used during certain events such as while moving. A user interface in accordance with the principles of the present invention comprises a user input, at least one sensor, and a display unit functionally in communication with the at least one sensor and adapted to change its user interface input mode. The user interface is capable of adapting its user interface input in response to a stimulus sensed by the sensor.

Conventional information and communication systems can include for example a user input device for facilitating user input, a display device for displaying information, and a processor for receiving, managing, and processing the user input and information. Many modern applications have merged the functions of the input device and the display device to create an intuitive, easy-to-use user interface.
Graphical user interfaces have been developed in which the display device displays a series of icons or menus which a user selects or manipulates with the user input device to provide user input. For example, in some systems the user input device comprises a pointing mechanism such as a mouse or joystick that can be used to manipulate a pointer over the icons or menu items displayed on the display device. The user can select an icon or menu item by positioning the pointer over the input area associated with the icon or menu item and hitting a select key.
Another example of a graphical user interface are those that comprise a "touch screen" in which the user provides input by tapping or writing directly on the display device. Touch screens can display icons or menus or can display other input metaphors such as a keyboards or response buttons. The user can select a menu item, icon, keyboard key, or response button, for example, by tapping on the display device in the input area associated with the desired item, icon, key, or button. The displayed keyboard or button can enable the user to enter various pieces of information such as but not limited to telephone numbers, response to display commands, and menu selections.
Other devices can be equipped with handwriting recognition software which enables the user to write alphanumeric characters onto an input area with a stylus. Handwriting recognition software within the device then attempts to interpret and recognize alphanumeric characters drawn by the user with the stylus on the input area. Generally, the information that is input may be displayed on a graphical display, such as but not limited to a liquid crystal display (LCD). In addition, the graphical display may be used to display menus or various command prompts as well as other pieces of information, such as but not limited to numbers, names, messages, menu functions, settings, and other application information such as timers or altimeters. As such, the system may be used to interact with various pieces of information displayed on the graphical display.
Touch screen user interfaces can themselves be used to display graphical user interfaces. For example, such touch screens may take the form of a virtual keyboard displayed on a graphical display wherein a discrete input area of the display corresponds to each key of a keyboard functions via a touch screen mechanism. These touch screen user interfaces are designed to be more intuitive and easier to use in comparison to hardware input user interfaces.
One characteristic all of these input/display devices share is that the user interface input metaphor and means can be reconfigured to meet specific applications. Often times these user interfaces are employed in mobile devices such as mobile telephones or personal digital assistants. The display devices associated with mobile devices are typically relatively small in size, particularly when compared with the display devices of less mobile systems such as a personal computer. Due at least in part to this small size, however, in some situations the graphical display and/or touch interfaces can be difficult to use. Certain environmental conditions, such as motion or trembling, can further increase the ease-of-use and accuracy problems. Unfortunately, it has been difficult to combat the problems associated with a smaller size input device and the typical movement and environmental conditions often present when a mobile device, such as a mobile telephone or personal digital assistant is used. Although data and commands may be entered via the virtual keyboard, icon, menu, or handwriting recognition system, the entry speed is reduced, the discomfort level is increased, and the error rate greatly increased relative to having used a full sized keyboard or to operation of the keyboard or input device under normal conditions, i.e. no movement.
One such situation where graphical display touch interfaces are often difficult to use is where the user is in motion, such as where the user is walking and thus the graphical display itself is in motion. Another situation where the graphical display touch interface is difficult to utilize is where the user is sitting in a vehicle and thus the graphical display touch interface is vibrating or trembling. In such situations, the user often is unable to focus on the moving graphical display touch interface or is unable to actuate the graphical display touch interface for example via a stylus or the user's finger.
Thus, there is a need in the art for a user interface that combines display and input devices in an adaptable manner to address the problems associated with theses devices to achieve added benefits such as comfort and ease-of-use.


A method for optimizing focus of an optical system passively includes the following steps: discretizing optical positions with respect to precision requirements; initializing an idle counter to zero, going to the initial optical position, initializing a best position to current position, clearing a sharpness array; calculating correspondence; adding a sharpness value to a sharpness array; calculating a longest increasing subsequence on the sharpness array; checking if the longest increasing subsequence length increases; clearing the idle counter; setting the best position to the current position; incrementing the idle counter; checking if the termination threshold is reached; checking if the current position corresponds to the end of discrete optical positions if the termination threshold is not reached; driving motors to the next position; optionally improving the best position; going to the best position and terminating the method.

It is known that there are methods and models to achieve automatic focus for an optical system and improve the quality of captured image(s) either in single or continuous manner. These kind of focus systems are used for example in digital cameras in commercial systems and, surveillance systems, etc. Once focus on the desired scene is obtained automatically, high quality image(s) can be obtained without user intervention. These kinds of automatic focusing system are crucially important when application at hand obstructs user intervention or target user profile is untrained to make such intervention possible. Setting the optical motor to an improper value creates overly blurred representation of a scene.
There are different methods to achieve focus for optical systems using active, passive or hybrid means. For an active focusing system, distance to the subject (target of focus) is measured, without using the optical system, through some other range finding sensor. Then focus of the optical system is adjusted with this new range information. Because, these kinds of focusing systems use an additional sensor, cost of such systems are expected to be higher.
A passive focusing system, works by analysing the captured image acquired through the optical system. For many passive focusing systems, a plurality of images are captured using different focuses of the optical system. These images are analysed by the system to determine the best fitting focus distance for the scene. Because, these systems do not direct energy to the environment, they are preferable in many surveillance applications since these systems do not reveal its position and do not trigger any counter measure systems.
Hybrid focusing systems, both use a separate sensor to find range to the subject in the scene and perform passive image analysis. Since they have multiple sources of information regarding how best focus should be achieved, fusing multiple sources of information is required. However they are expected to have higher quality than their counterparts.
Currently, passive, active and hybrid methods can be used to find best possible focus for an optical system. This invention relates specifically to the camera-based (day-tv, thermal, IR, Time of Flight etc.) passive focusing systems.
An optical system with passive focusing capability has at least three components: a sensor, a control system and a motor with adjustable optical elements. A sensor is required since image (captured by the sensor) analysis is necessary for a passive focusing system. A control system is required since motor drivers needs to be implemented that dynamically focuses the optical system to a system specified distance. A motor with adjustable optical elements is also required for tuning the optical system to be focussed at a certain distance with the commands of the control system.
An optical system with passive focusing capability has to analyse sharpness values of plurality of images (captured by focusing system for multiple distances). Computing a sharpness indicator for an image is therefore, well known in the state of the art. Throughout the document, whenever a sharpness indicating value is mentioned, it should be understood that as a quality indicator of focus performance.
Determining the best focusing distance (passively) is called the passive focusing problem and it can be explained as follows: Given a system with capability of optical focus to different distances, we can calculate a number of (N—this number is variable and it is not known prior to completion) correspondences between focus distance of the optical system and sharpness value of the captured image. Passive focusing problem requires calculating the best focus for the optical system using N correspondences obtained iteratively. The objective (along with common objective of finding the best focus for the optical system) may vary depending on the application, such as achieving best focus in shortest time possible or achieving best focus using smallest number of correspondences etc. A solution to the passive focusing problem has to determine the order of correspondences to be processed (in other words, has to determine the focus distance to be processed for each iteration) and has to specify a termination condition to avoid traversing whole search space (in other words, to avoid calculating all possible correspondences).
The United States patent document US20080151097 A1 discloses an autofocus searching method includes the following procedures. First, focus values of images, which are acquired during the movement of the object lens, are calculated, in which the focus value includes at least the intensity value of the image derived from the intensities of the pixels of the image. Next, focus searching is based on a first focus-searching step constant and a first focus-searching direction, in which the first focus-searching step constant is a function, e.g., the multiplication, of the focus value and a focus-searching step. If the focus searching position moves across a peak of the focus values, it is then amended to be based on a second focus-searching direction and a second focus-searching step constant, in which the second focus-searching step constant is smaller than the first focus-searching step constant, and the second focus-searching direction is opposite to the first focus-searching direction.
The current methods are not offering an effective way of achieving best focus performance for an optical system while considering side objectives. To provide a solution to this problem, a new methodology should be introduced which avoids traversing whole search space and considers mechanic/optic/motor related constraints.

System and method for optimizing focus of optical system passively

ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI


The invention relates to a process for compensating a phase and amplitude response between a multiphase setpoint and actual value (i.sub.Rw, i.sub.Sw, i.sub.Tw and i.sub.Rx, i.sub.Sx, i.sub.Tx), the first step being to determine the modulus setpoint value (.vertline.i.sub.w .vertline.) or modulus actual value (.vertline.i.sub.x .vertline.) and the angular setpoint value (.epsilon..sub.w) or angular actual value (.epsilon..sub.x) of the setpoint or actual value vector (i.sup.w or i.sup.x), a modulus manipulative variable (.vertline.i.sub.wxy .vertline.) and an angular manipulative variable (.epsilon..sub.wxy) then being generated by modulus and phase from a modulus deviation (.vertline.i.sub.w .vertline.-.vertline.i.sub.x .vertline.) and an angular deviation (.epsilon..sub.w -.epsilon..sub.x) which are added by modulus and phase to the output quantities (.vertline.i.sub.w .vertline., .epsilon..sub.w) of the setpoint value vector computer (26), these modulus and phase sums (.vertline.i.sub.Kw .vertline.,.epsilon..sub.Kw) being transformed into a multiphase, compensated setpoint value (i.sub.RKw, i.sub. SKw, i.sub.TKw), and to a circuit arrangement for implementing the process. It is possible in this way for the phase and amplitude response to be compensated between a multiphase setpoint and actual value (i.sub.Rw, i.sub.Sw, i.sub.Tw and i.sub.Rx, i.sub.Sx, i.sub.Tx) although a phase and amplitude response depends on the response characteristic of a controlled system which is dependent on a disturbance variable (M.sub.z).

The invention relates to a process for compensating a phase and amplitude response between a multiphase setpoint and actual value and circuit for implementing the process.
Specifying a command variable W, for example in accordance with a timing function W(t)=W sin (.alpha.t) on a known control loop consisting of setpoint adjuster, comparator, controller, controlled system and measuring transducer produces in the controlled variable a phase and amplitude shift in relation to the command variable W. With increasing frequency of the command variable W, the phase and amplitude response varies between setpoint and actual value. An undesired phase and amplitude response between setpoint and actual value is also produced in the case of multiphase control loops. A multiphase control loop represents, for example, a conventional current control for a three-phase current drive with voltage-controlled convertor. The amplitude and phase of actual value can be measured or determined without distortion in this multiphase control loop.
The phase and amplitude response is determined by the response characteristic of the control loop. If this response characteristic is known, the phase and amplitude response of the control loop can be compensated by a correction device in the command channel. If, by contrast, the response characteristic of the controlled system is a function of the disturbance variable or dependent on controlled variables which are not known or cannot be measured, the said type of phase and amplitude response can be compensated only insufficiently by means of a correction device in the command channel.
The textbook "Stromrichter zur Drehzahlsteuerung von Drehfeldmaschinen" (Static convertors for speed control of polyphase machines), Part III, Convertors, by Erich Eder, 1975, pages 102 to 111 discloses resolvers by means of which a two-phase system having two orthogonal currents is formed from a three-phase system. A current vector which rotates can be formed from these two orthogonal currents. The modulus of this current vector and the rotary angle are formed by means of a C/P transformer (Cartesian/polar).

Process for compensating a phase and amplitude response between a multiphase setpoint and actual value and circuit for implementing the process


A water toy device utilizing elongated body having first and second surfaces and first and second ends. A pair of wings extend from the elongated body and are bendable to determine the path of travel of the device in a body of water. An elongated fin projects from the first surface from the elongated body to stabilize the movement of the device.

The present invention relates to a novel and useful water toy device.
In the past, devices and toys have been used in conjunction with bodies of water in order to increase the enjoyments of the occupants of the body of water by the playing of games and the like using such devices. For example, floatable balls, discs and such have been employed to play variations of well known games such as baseball, football, basketball, and others. In addition, certain toys have been devised which are capable of submerging within the body of water and rising again to the top, such as toys in the shape of submarines and diving bells.
A water toy device which is durable and is capable of moving through the body of water and rising again to the top of the body of water in a pre-determined path or trajectory would be a notable advance in the field of toys and games.


Prior to starting the use of an apparatus, an isolated waveform writing section writes a predetermined isolated waveform into a predetermined region of each track of a disk medium by designating a head number and a track number. The isolated waveform is subsequently read out by an isolated waveform reading section and is quantized by an analog/digital converter. Tap coefficients of a transversal filter are calculated by a tap coefficient calculating section. The tap coefficients calculated by the tap coefficient calculating section are stored in a memory on the basis of the track number and head number used when the isolated waveform is written. Upon reproduction during the use of the apparatus, a tap coefficient setting section reads out the corresponding tap coefficients from the memory on the basis of the track number and head number designated by a seek command and sets to the transversal filter.

The invention relates to a magnetic disk apparatus and a read waveform equalizing method in which after a read waveform from a disk medium was equalized by using a transversal filter, bit data is detected in accordance with a Viterbi algorithm and, more particularly, to a magnetic disk apparatus and a read waveform equalizing method in which a transversal filter is controlled to an optimum state in accordance with a state of a disk medium.
In magnetic disk apparatuses, there are requests to realize a high density and a high speed. Such requests will be more and more increased in future. To satisfy the request to realize a high density, an improvement of a magnetic recording medium, an improvement of a magnetic head, a decrease in circuit noises, and the like are performed. In a magnetic disk apparatus of a type in which the magnetic head is floating from a disk, a floating amount of the magnetic head from the disk is also an important factor for realization of a high density. That is, when the floating amount of the head is decreased, an output and a resolution rise in accordance with the decreased floating amount. On the contrary, however, when a dust or the like enters between the head and the disk, a probability of the occurrence of a damage of the head is large and there is inevitably a limitation in the minimum value of the floating amount.
Therefore, in future, there is a limitation in the improvement of the output and resolution in the magnetic head--medium system. It is demanded to optimize a performance of an equalizer for equalizing a read waveform so that it can cope with a low S/N ratio and a low resolution.
Hitherto, in the magnetic disk apparatus, a waveform read out from a disk is analog differentiated and its zero-cross point is detected as a peak position. However, in a system of a low resolution, namely, a system in which isolated waves in a reproduction signal are neighboring, a peak shift such that the peak of a reproduction waveform is deviated from an actual peak of the isolated waveform appears in the reproduction waveform due to a waveform interference of the adjacent isolated waves. Thus, the reproduction waveform is erroneously seen as if information was written to the adjacent bits.
To prevent such a problem, as a method of improving such a drawback when data is read, a cosine equalizing circuit (pulse slimming circuit) is used to emphasize a high frequency component of a signal and improve a resolution. As a cosine equalizing circuit, there are a method of equalizing a waveform on a time domain and a method of equalizing a waveform on a frequency domain. The former method is generally used.
A cosine equalizing circuit for approximately performing a cosine equalization on a time base is constructed by a delay line of a delay time .tau., a voltage divider, and a differential amplifier. When a read voltage is given to an input terminal, the voltage which was delayed by only the time t is applied to a (+) input of the amplifier. A voltage of a peak value (K) and a voltage of the peak value (K) having a delay of 2.tau. which was transmitted through the delay line and reflected by the differential amplifier and inputted are supplied to a (-) input, so that an addition synthesized output is obtained. Therefore, an output voltage of the cosine equalizing circuit is a voltage obtained by slimming the read waveform. By using such a cosine equalizing circuit, frequency characteristics in which a high frequency component is emphasized are obtained. However, when the high frequency component of the signal is emphasized, a wide band component of noises are also simultaneously emphasized, so that a jitter increases.
As a method of improving when data is written, there is also performed a write compensation such that a peak shift amount is predicted from the beginning and, at a time point when data is written to a medium, the data is alternately delayed or advanced, thereby narrowing a data interval than the actual waveform. However, a process to narrow the data interval is substantially the same as a process such that a recording density on the medium is raised and the data is written, resulting in decrease in S/N ratio and resolution.
Even in a system of a reduced resolution, therefore, a circuit or a method which can accurately read out the signal is necessary. A system in which a waveform interference exerts an influence on the adjacent bits can be regarded as a kind of convolution code. A Viterbi decoding method known as a maximum likelihood detecting method for the convolution code is used in the field of the magnetic recording.
Although the Viterbi decoding method is fundamentally advantageous in the system of a low resolution, in case of actually applying the Viterbi decoding method to the magnetic disk apparatus, there is a problem about how to fetch the value of the isolated waveform at a sampling point. Generally, recording densities at the inner and outer rims of the magnetic disk apparatus differ and shapes of isolated waveforms also differ. Therefore, in order to accurately perform the Viterbi detection, it is necessary to accurately fetch at a high speed the data of the isolated waveform on each track from the innermost rim to the outermost rim. The above problem is solved by providing a transversal filter as an equalizer for eliminating an intercede interference at the front stage of the Viterbi decoder.
Hitherto, as a magnetic disk apparatus using the Viterbi decoding method, for example, there is an apparatus disclosed in JP-A-5-314654. According to such an apparatus, an automatic equalizer is provided at the front stage of a Viterbi decoder, thereby performing an optimum equalization of the read waveform. The automatic equalizer has a transversal filter and optimizes tap coefficients by a learning function. When the tap coefficients are set, an output error of the automatic equalizer is obtained by using an equalization target pattern stored in a memory and the tap coefficients are controlled so as to minimize such an error.
As initial values of the tap coefficients which are set to the automatic equalizer, preset information is recorded every track or sector of a disk at the time of a shipping or a turn-on of a power source, and the preset information is read out and, in a manner similar to the case of the reproduction, tap coefficients which minimize an error with the equalization target pattern are obtained and stored in the memory. Just before the reproduction, the memory is accessed and the initial values of the tap coefficients are set to the automatic equalizer.
Such a method whereby the automatic equalizer and Viterbi decoder are combined is nothing but the technique of the communication field is applied as it is. In the communication field, for example, there is a time-dependent fluctuation of transmission path characteristics such as a frequency selective fading in a radio transmission. To eliminate an intercode interference which follows such a fluctuation, there is used an automatic equalizer to automatically realize equalization characteristics by using a training signal which is sent prior to the data transmission.
In case of the magnetic disk apparatus, however, transmission path characteristics which are obtained by a path comprising a disk medium, a head, a head IC, and a read amplifier are fairly stable as compared with those of a communication system. Particularly, there is no need to consider a time-dependent fluctuation of the transmission path characteristics in a short time such as a frequency selective fading. There is a temperature change of the apparatus as a factor of the time-dependent fluctuation of the transmission path characteristics. Although such a temperature change causes a physical fluctuation of a head positioning control or the like, the transmission path characteristics are not so largely influenced.
Therefore, in the automatic equalization such that an error between an equalization output during the reproduction and an equalization target pattern is obtained and tap coefficients of a transversal filter are feedback controlled so as to minimize such an error, since there is no special fluctuation factor in the transmission path comprising the disk medium, head, head IC, and read amplifier, so long as the initial set tap coefficients are proper, no error eventually occurs. A necessity of the automatic equalization is low. There is, consequently, a problem such that in case of the magnetic disk apparatus, the use of the automatic equalizer causes a complication of a circuit construction and a complication of the control due to the automatic equalization.
The automatic equalizer of the conventional apparatus always controls the tap coefficients so as to minimize the equalization error by using the equalization target pattern of the memory even during the reproduction. However, there is a problem such that when the tap coefficients are controlled during the reproduction, the control of the tap coefficients traces a large noise mixture when a shock or vibration is applied, abnormal tap coefficients are set, and the equalization cannot be performed.

Magnetic disk apparatus and read waveform equalizing method using stored tap coefficients for a transversal filter


Gesture-based association of multiple devices may be facilitated, which may effectuate presentation of content related to associated devices. Gesture detection may reduce or completely eliminate any ambiguity of whether the association is wanted or not. Some implementations may be employed in a theme park in which park guests wear an RFID wristband. During a park visit, when merchandise goods with embedded RFIDs are purchased (e.g., toys and/or other merchandise), the merchandise may be associated with the wristband and, therefore, the park guest wearing the wristband. Such association may give the theme park environment and/or the toy itself a mechanism to adapt their behavior depending on which toy the park guest is carrying. This may contribute to richer storytelling and personalized experiences, which may be realized by using location information, knowledge about the park guest's preferences or previous park visits, favorite attractions, age, language-specific information, and/or other information.

Associating devices using radio-frequency identification (RFID) technology is known. Typically, this is done by using an RFID reader to detect two RFID enabled devices one after the other, or together at the same time. The association of the two devices may be stored in a database. These and other existing approaches may be prone to unwanted associations because any two devices detected by the reader within a short predetermined period of time may be associated with each other.

Facilitating gesture-based association of multiple devices


A magnetic memory structure that includes a two-terminal resistive memory element electrically connected with a selector structure. The selector structure includes a semiconductor pillar structure formed on a semiconductor substrate. The selector structure is surrounded by a gate dielectric layer, and the semiconductor pillar structure and gate dielectric layer are surrounded by an electrically conductive gate structure. The semiconductor pillar has first and second dimensions in a plane parallel with the surface of the semiconductor substrate that are unequal with one another. The semiconductor pillar structure can have a cross-section parallel with the semiconductor substrate surface that is in the shape of a: rectangle; oval elongated polygon, etc. The length of the longer dimension can be adjusted to provide a desired amount of current though the semiconductor pillar structure to drive the two-terminal resistive memory element.

The ever-increasing demand for data storage has led a push for the development of new and improved memory structures. Traditionally data has been stored in an array of transistors which can be employed as switches to store data as a one (1) and zero (0) memory states. Ideally, data storage systems can operate quickly, at low energy consumption and can maintain stored data over a long period of time without compromise of data integrity. Recently, researchers have looked to memory storage employing memory cells other than pure transistor storage, such as through the use of two terminal resistive switches.
Various types of two terminal resistive switches can be used to store data. One type of two terminal resistive switching technology that can be used to store data is Magnetic Random-Access Memory (MRAM). Magnetic Random-Access Memory (MRAM) is a non-volatile data memory technology that stores data using magnetoresistive cells such as Magnetoresistive Tunnel Junction (MTJ) cells. At their most basic level, such MTJ elements include first and second magnetic layers that are separated by a thin, non-magnetic layer such as a tunnel barrier layer, which can be constructed of a material such as Mg—O. The first magnetic layer, which can be referred to as a reference layer, has a magnetization that is fixed in a direction that is perpendicular to that plane of the layer. The second magnetic layer, which can be referred to as a magnetic free layer, has a magnetization that is free to move so that it can be oriented in either of two directions that are both generally perpendicular to the plane of the magnetic free layer. Therefore, the magnetization of the free layer can be either parallel with the magnetization of the reference layer or anti-parallel with the direction of the reference layer (i.e. opposite to the direction of the reference layer).
The electrical resistance through the MTJ element in a direction perpendicular to the planes of the layers changes with the relative orientations of the magnetizations of the magnetic reference layer and magnetic free layer. When the magnetization of the magnetic free layer is oriented in the same direction as the magnetization of the magnetic reference layer, the electrical resistance through the MTJ element is at its lowest electrical resistance state. Conversely, when the magnetization of the magnetic free layer is in a direction that is opposite to that of the magnetic reference layer, the electrical resistance across the MTJ element is at its highest electrical resistance state.
The switching of the MTJ element between high and low resistance states results from electron spin transfer. An electron has a spin orientation. Generally, electrons flowing through a conductive material have random spin orientations with no net spin orientation. However, when electrons flow through a magnetized layer, the spin orientations of the electrons become aligned so that there is a net aligned orientation of electrons flowing through the magnetic layer, and the orientation of this alignment is dependent on the orientation of the magnetization of the magnetic layer through which they travel. When the orientations of the magnetizations of the free and reference layer are oriented in the same direction, the majority spin of the electrons in the free layer is in the same direction as the orientation of the majority spin of the electrons in the reference layer. Because these electron spins are in generally the same direction, the electrons can pass relatively easily through the tunnel barrier layer. However, if the orientations of the magnetizations of the free and reference layers are opposite to one another, the spin of majority electrons in the free layer will be generally opposite to the majority spin of electrons in the reference layer. In this case, electrons cannot easily pass through the barrier layer, resulting in a higher electrical resistance through the MTJ stack.
Because the MTJ element can be switched between low and high electrical resistance states, it can be used as a memory element to store a bit of data. For example, the low resistance state can be read as a "0", whereas the high resistance state can be read as a "1". In addition, because the magnetic orientation of the magnetic free layer remains in its switched orientation without any electrical power to the element, it provides a robust, non-volatile data memory bit.
To write a bit of data to the MTJ cell, the magnetic orientation of the magnetic free layer can be switched from a first direction to a second direction that is 180 degrees from the first direction. This can be accomplished, for example, by applying a current through the MTJ element in a direction that is perpendicular to the planes of the layers of the MTJ element. An electrical current applied in one direction will switch the magnetization of the free layer to a first orientation, whereas switching the direction of the current such that it is applied in a second direction will switch the magnetization of the free layer to a second, opposite orientation. Once the magnetization of the free layer has been switched by the current, the state of the MTJ element can be read by reading a voltage across the MTJ element, thereby determining whether the MTJ element is in a "1" or "0" bit state. Advantageously, once the switching electrical current has been removed, the magnetic state of the free layer will remain in the switched orientation until such time as another electrical current is applied to again switch the MTJ element. Therefore, the recorded data bit is non-volatile in that it remains intact in the absence of any electrical power.
The magnetic memory elements can be arranged in an array of memory elements that are connected with word lines and bit lines. A source-line can provide read and write currents to the memory elements, with the individual memory elements being selected by the word line and bit line. In addition to MRAM memory systems, other types of two terminal resistive switching elements can be used in a similar manner being connected with word and bit lines to both switch the memory state of the element and to read a memory state of the element.

Selector transistor with continuously variable current drive

Integrated Silicon Solution, (Cayman) Inc.


A laser stimulated atom probe for atom probe imaging of dielectric and low conductivity semiconductor materials is disclosed. The laser stimulated atom probe comprises a conventional atom probe providing a field emission tip and ion detector arrangement, a laser system providing a laser short laser pulse and synchronous electronic timing signal to the atom probe, and an optical system for delivery of the laser beam onto the field emitting tip apex. Due to enhanced absorption, it is also possible to realize a photo ionization mechanism, wherein the laser stimulates electronic transitions from the more extended surface atoms, thereby ionizing the surface atom.

Atom probe microscopes provide atomic scale structural resolution and species analysis of material surfaces. The atom probe consists of a field ion microscope used in conjunction with a time of flight mass spectrometer. Atom probes provide an atom by atom decomposition of a sharp sample "tip," of approximately 100 nanometers in diameter. A positive voltage is applied across the sharp tip apex, to an electrode, resulting in a very strong electric field at the surface of the tip. Atoms at the surface of the tip become extended and evaporate from the surface through a physical process known as "field evaporation." This process produces an ion near the tip which then travels toward the negative electrode. The onset of field evaporation occurs at electric fields on the order of 1–5 volts per angstrom (V/A) for all known materials (Miller, 1989). Near the field evaporation threshold, if the field is increased by a few percent, for example 20%, the field evaporation rate increases by several orders of magnitude. By pulsing the tip apex field during a short time interval, typically several nanoseconds, field evaporation is activated during a short time window. Time of flight mass spectroscopy is then performed on the evaporated atoms, thereby determining the atomic species. The width of the voltage pulse may limit the mass resolution of the atom probe (Tsong, 1982; Kellogg, 1980). The three dimensional atom probe (3DAP), or imaging atom probe, is an atom probe wherein i) the x-y position of the ion at the tip surface is mapped by projection of the field evaporated ion onto a position sensitive detector such as a microchannel plate detector or wedge and strip anode (Cerezo, 1988; Holzman, 1994), ii) the "z" position of the ion is determined by the sequence of the field evaporation event and the evaporation rate as in typical atom probes, and iii) the ion mass resolution is again provided by time of flight mass spectrometry of the ion. The application of atom probe techniques to metals and high conductivity semiconductor materials has been discussed extensively in the literature (Cerezo, 1998; King, 1994; Miller, 1989; Tsong, 1984). Further improvements in atom probe microanalysis have been facilitated by the addition of a funnel-shaped extraction electrode placed near the tip (Nishikawa, et al, 1995; Kelly, 1995). This allows atom probe analysis of individual tips in a field of tips and scanning of the atom probe over larger areas.
The main problem with conventional electrically pulsed atom probes is that they cannot be used to investigate samples with resistivity greater than approximately 10 Ohm-centimeter. As noted, the field evaporation mechanism required for atom probe operation will occur at electric fields on the order of several volts per angstrom for all materials—metals, semiconductors, or dielectrics. However, dielectrics and common semiconductors do not possess the conductivity required to support the short voltage pulsing needed to attain acceptable time of flight resolution, thus the atomic species cannot be resolved for dielectrics and common semiconductors using conventional voltage pulsed atom probes. For this reason conventional voltage pulsed atom probes are limited to "high-conductivity" applications such as metals or low resistivity semiconductor materials. Electrically pulsed atom probes also typically encounter difficulty in operation on samples of resistivity approximately 1 Ohm-centimeter or greater. For n-type silicon, 1 Ohm-centimeter resistivity corresponds to a dopant concentration of approximately 5×1015 atoms per cubic centimeter, while 10 Ohm-centimeter resistivity corresponds to a dopant concentration of approximately 5×1014 atoms per cubic centimeter. Thus, atom probe imaging of silicon samples with dopant levels below 5×1015 atoms per cubic centimeter (cm3) becomes difficult, and imaging of silicon samples with dopant levels below 5×1014 atoms per cm3 is impossible. This "conductivity limit" is the principle impediment to the application of atom probe techniques to the dielectric and semiconductor materials commonly used in microelectronic and optoelectronic devices.
The inability to transmit short, high voltage pulses through semiconductor and dielectric tips has been overcome in a number of experiments by using laser pulsing to deposit thermal energy into the tip, thereby activating the field evaporation mechanism through an increase in temperature (King et al., 1994; Tsong et al., 1982). However, a substantial problem with conventional pulsed laser atom probes is that they fail to use an ultraviolet (UV) or visible wavelength laser wherein efficient thermal pumping of field evaporation in semiconductor materials is attained. Generally, optical absorption in semiconductor materials is peaked toward the ultraviolet. Thus, the efficiency of thermal pulsing of semiconductor and dielectric materials is improved by using UV laser wavelengths where the optical absorption is strong. However, prior studies of thermally pumped field evaporation in semiconductors have utilized laser wavelengths in the near-infrared, where the optical absorption is weak (King, 1995). Another problem with conventional electrically pulsed atom probes is that the use of high voltage pulsing on low conductivity samples induces ion energy dispersion (Cerezo, 1998) and tip mechanical stress failure. The pulsed laser approach also minimizes energy dispersion and mechanical stress. Thus, the pulsed laser atom probe also has advantages with respect to mass resolution and reliability. Also, although there have been a number of pulsed laser atom probe studies on metals (Kellogg, 1980), no significant advantage is conferred by using a pulsed laser on metal samples since metals may be analyzed using the conventional voltage pulsed atom probe technique.
An additional problem with conventional pulsed laser atom probes is they fail to utilize a laser wavelength located near an optical absorption edge. In this case the optical absorption coefficient will depend strongly on the static field, as the absorption coefficient undergoes a substantial redshift in strong electric fields (Keldysh, 1958). Thus, the optical absorption coefficient may be enhanced through an electric field induced redshift of the optical absorption, provided the laser wavelength is chosen nearby to strong absorption features. This dependence of the optical absorption on electric field has never been utilized in the prior art pulsed laser atom probe technique.
However, despite the aforementioned deficiencies in the prior art, the most significant problem with the conventional pulsed laser atom probe technique is that it does not utilize photo-ionization for atom probe imaging of semiconductor and dielectric materials. The ability to directly photo-ionize atoms from the surface of an emission tip provides a major advance in the atom probe microanalysis technique. For example, photo-ionization allows the accurate imaging of molecular complexes such as viruses, proteins and organic molecules embedded in a sample tip. This is facilitated by the reduced distortion of surface atoms when using photo-ionization for atom probe imaging of such complexes. Although prior studies have failed to realize this photo-ionization mechanism, it is anticipated in semiconductors and dielectrics due to the much slower neutralization of surface ions than found in metals (Kellogg, 1980; Tsong, 1976).
Thus, while these devices may be suitable for the particular purpose to which they address, they are not as suitable for atom probe imaging of dielectric and low conductivity semiconductor materials. In these respects, the laser stimulated atom probe technique according to the present disclosure substantially departs from the conventional concepts and designs of the prior art, and in so doing provides a technique primarily developed for the purpose of atom probe imaging of semiconductor and dielectric materials.

Laser stimulated atom probe characterization of semiconductor and dielectric structures


The invention provides well drilling and servicing fluids, and methods of drilling, completing, or working over a well therewith, preferred fluids comprise an aqueous liquid, a water soluble polymer viscosifier (preferably xanthan gum), a polymeric fluid loss control additive (preferably a partially depolymerized partially crosslinked hydroxyalkyl ether derivative of starch or a hydroxyalkyl ether derivative of a partially crosslinked and partially depolymerized starch), a bridging agent comprising a particulate calcined magnesia that has an Activity Index greater than about 800 seconds, and an additive selected from the group consisting of citric acid, alkali metal salts of citric acid, ammonium citrate, and mixtures thereof in an amount sufficient to increase the low shear rate viscosity of the fluids, preferably from about 0.05–5 ppb, most preferably from about 0.15–3 ppb. The invention further provides a method of increasing the low shear rate viscosity of fluids which contain a water soluble polymer and a calcined magnesia bridging agent which has an Activity Index greater than about 800 seconds.

The present invention relates to clay-free aqueous well drilling and servicing fluids, methods of preparation thereof, and methods of drilling or servicing a well therewith.
The use of fluids for conducting various operations in the boreholes of oil and gas wells which contact a hydrocarbon-containing subterranean formation are well known. Thus, drill-in fluids are utilized when initially drilling into potential hydrocarbon producing formations. Completion fluids are utilized when conducting various completion operations in the hydrocarbon-containing formations. Workover fluids are utilized when conducting workover operations of previously completed wells.
It is important that the fluids which contact hydrocarbon-containing formations are formulated such that there is a minimum penetration of fluid, both the aqueous phase and the solid phase, into the formation. Thus, the present state-of-the-art fluids generally comprise a "water soluble" polymer, preferably a biopolymer such as xanthan gum or scleroglucan gum, starch derivatives for fluid loss control, and water soluble or acid soluble bridging agents to form a thin filter cake which forms a protective seal of the formation. See for example the following U.S. Patents, incorporated herein by reference: Mondshine U.S. Pat. No. 4,620,596; Dobson, Jr. et al. U.S. Pat. No. 4,822,500; Dobson, Jr. et al. U.S. Pat. No. 5,629,271; Dobson, Jr. et al. U.S. Pat. No. 5,641,728; Dobson, Jr. et al. U.S. Pat. No. 5,728,652; and Dobson, Jr. et al. U.S. Pat. No. 5,804,535. A recent development is a biopolymer-free fluid which utilizes a unique amylopectin starch derivative for both viscosity development and fluid loss control as set forth in Dobson, Jr. et al. U.S. Pat. No. 6,391,830.
After the well has been drilled and completed, it is necessary to remove the filter cake from the surface of the formation allowing the hydrocarbons therein to flow to the wellbore for production. This is generally aided by contacting the filter cake with various washes/soak solutions in which the components of the filter cake are soluble, most generally acidic aqueous fluids. See, for example, the following U.S. patents, incorporated herein by reference: Mondshine et al. U.S. Pat. No. 5,238,065; Dobson, Jr. et al. U.S. Pat. No. 5,607,905; Dobson, Jr. et al. U.S. Pat. No. 5,783,527; and Dobson, Jr. et al. U.S. Pat. No. 5,783,526.
As indicated in Mondshine U.S. Pat. No. 4,620,596, sparingly soluble borates have been utilized as bridging agents in well drilling and servicing fluids. However, one problem with their use in biopolymer-containing fluids is the crosslinking of the biopolymers that occurs when the borate anion reacts with the biopolymers. Thus, there is a need for another bridging agent that is sparingly soluble in water/aqueous systems and is soluble in acidic solutions.
Magnesium oxide and other particulate solids which are substantially insoluble in water but which are substantially soluble in aqueous ammonium salt solutions are disclosed for use as bridging agents in Todd et al. U.S. Pat. No. 6,422,314. Also disclosed therein in the well drilling and servicing fluids containing the magnesium oxide bridging agent is the use of certain water soluble salts, including sodium citrate, to increase the density of the fluids.
Powdered magnesium oxide is utilized in the art as an alkalinity control additive for biopolymer-containing fluids as exemplified by the U.S. patents referenced hereinbefore.
The magnesium oxide as referenced in Dobson, Jr. et al. U.S. Pat. No. 5,514,644, incorporated herein by reference, has an Activity Index less than about 100 seconds, most preferably less than about 50 seconds.
Disclosed in International patent application Serial No. PCT/US04/33237 filed Oct. 8, 2004 is the use of calcined magnesia which has an Activity Index greater than about 800 seconds as a bridging agent in polymer-containing well drilling and servicing fluids.
The calcined magnesia provides biopolymer-containing well drilling and servicing fluids which do not gel on thermal aging at temperatures at which the biopolymer does not decompose and which utilizes the particulate, sized magnesia particles as a bridging agent to form the required thin filter cake to limit fluid invasion into the hydrocarbon-containing formation contacted by the fluid.
The present invention pertains to stable well drilling and servicing fluids which provide a filter cake that is partially water soluble, soluble in ammonium salt solutions, and substantially acid soluble for improved removal from the sides of the borehole/face of the hydrocarbon-containing formations on which the filter cake is deposited, and a method of increasing the low shear rate viscosity thereof.

This patent is subject to a terminal disclaimer.

Method of increasing the low shear rate viscosity of well drilling and servicing fluids containing calcined magnesia bridging solids, the fluids and methods of use


Metallic testing of a subscriber loop that provides voice and DSL services is provided by a voice switch and DSL services, each of which includes a metallic test unit. A voice line card has a connection to a first metallic test bus connected to the voice switch metallic test unit via a first relay set configured to connect the metallic test bus to the subscriber loop and to disconnect the subscriber loop from the line card during testing. The DSL line card has a connection to a second metallic test bus, which is also connected to the DSLAM metallic test unit, and to the subscriber loop. A second set of relays control the connection of the metallic test bus to the line card to the subscriber loop. A signal is sent from either metallic test unit to cause the relays to change to provide a clear path for metallic testing from DC to light.

This invention relates to the field of telephone subscriber loops that provide high speed data service and voice service, and, more particularly, to metallic testing of such loops.
A relatively new technology uses the embedded voice telephone infrastructure to provide high speed data service. This service, generally referred to as xe2x80x9cDigital Subscriber Linexe2x80x9d(DSL) service, is available in many markets. DSL is implemented in several different ways, such as asymmetrical DSL (ADSL where upstream and downstream have different bandwidths), symmetrical DSL (SDSL where upstream and downstream have the same bandwidth) and other varieties of services (herein xe2x80x9cXDSLxe2x80x9d or xe2x80x9cDSLxe2x80x9d). Many XDSL technologies provide high speed data service over the current tip-ring pairs by encoding high speed data signals into frequency ranges well above the frequency range that carries both plain old telephone service (xe2x80x9cPOTSxe2x80x9d) or integrated services digital network (ISDN) service. Thus, one subscriber loop comprising a tip-ring pair can provide both voice service and high speed data service.
One problem facing service providers in this fast growing market is loop maintenance. Specifically, most regulatory bodies require that each subscriber loop is tested for power cross, over-voltage, etc. as is known in the art. However, because incumbent voice service providers may be a different entity from the DSL service provider, testing the loop over the entire frequency spectrum (known in the art as xe2x80x9cD.C. to lightxe2x80x9d) requires new and relatively sophisticated and expensive equipment.
Turning now to FIG. 1, a current metallic test system is illustrated in the context of metallic testing of a subscriber loop 5. Subscriber loop 5 subscribes to both voice and DSL services. In a switching office 10, there is a voice switch 12 and a digital subscriber line access multiplexer (DSLAM) 14, which provide voice and data service for subscriber loop 5, respectively. Voice switch 12 is connected to subscriber loop 5 by line card 16 as is known in the art. Line card 16 includes processing unit 18 which sends and receives analog signals over subscriber loop 5 and processes the signals to/from pulse code modulated (PCM) data, as used in the switching network as is known in the art. DSLAM 14 includes a line card 20 which sends and receives data from loop 5 to and from the data network via transceiver 22.
Voice switch 12 and, more specifically, processing unit 18 supports analog signals in the 0-4 kHz band over subscriber loop 5. Generally, DSLAM 14, and more specifically transceiver 22 on line card 20, supports signals in the 32-1,100 kHz range over subscriber loop 5.
DSL introduces frequency and, more importantly, power characteristics that are incompatible with most current art voice service line cards. Conversely, voice service uses DC power with characteristics that interfere with DSL data. Therefore, a splitter 24 is provided in order to filter unwanted characteristics from the subscriber loop 5 for processing at processor 18 on voice line card 16 and DSL line card 20. To enhance the voice signal, splitter 24 includes low-pass filter 26, which attenuates the high voltage of DSL and generally filters out the high frequency DSL signal. To enhance the DSL signal, the DC component of signals on subscriber loop 5 are filtered by a capacitor 28 on line card 20 and a further capacitor 30 in splitter 24.
It is known in the art that voice switches include a voice switch metallic test unit 32 that tests loop 5 for various faults. Metallic test unit 32 is connected to line card 16 via metallic test bus 34. Metallic test bus 34 is connected through a set of relays 36 comprising a normally closed relay 38 and a normally open relay 40. This set of relays 30 is reversed when voice switch metallic test unit 32 tests loop 5 to protect the circuitry of processing unit 18 on line card 16. Likewise, DSLAM 14 includes DSLAM metallic test unit 42 which is connected to line card 20 via metallic test bus 44 to relays 46 including normally closed relay 48 and normally opened relay 50.
In order to effect a usable path through splitter 24 for either metallic test unit 32 or 42, several additional components must be included in splitter 24. For example, in order to test loop 5 from voice switch metallic unit 32, a signature 52 must be present in order to alert voice switch metallic unit 32 of the voltage loss that will occur because of the presence of splitter 24. If signature 52 were not present, then any estimates of broken cable etc. would be incorrect.
Further, a detector 54 needs to be added to splitter 24 in order to detect whether the voice path is currently in use. An additional detector 56 is needed to detect signals from DSLAM metallic test unit 42 which will inform processor 58 that metallic test unit 42 is going to test loop 5. When this occurs, processor 58 closes normally open relay 60 and opens normally closed relay 62 in order to permit testing from DSLAM metallic test unit 42 without interfering with line card 16 on voice switch 12. All of these additional units not only are costly but also require a power supply 64 in order to operate. All of these units also then need to be diagnosed, fused, maintained, alarmed, etc. as is known in the art.
This problem is solved and a technical advance is achieved in the art by a system and method for metallic testing of a subscriber loop that provides voice and DSL services. Voice services are provided by a voice switch and DSL services are provided by a digital subscriber line access multiplexer (DSLAM); each of which includes a metallic test unit. A voice line card in the voice switch has a connection to a first metallic test bus connected to the voice switch metallic test unit via a first set of relays configured to connect the metallic test bus to the subscriber loop and to disconnect the subscriber loop from voice on the line card when testing is performed. A DSL line in the DSLAM card has a connection to a second metallic test bus, which is connected between the DSLAM metallic test unit and the subscriber loop. A second set of relays control the connection of the metallic test bus to the subscriber loop.
In this environment, the voice switch metallic test system is configured to send signals to control the second set of relays to disconnect the DSL line card and to provide metallic tests over the entire wireline spectrum (DC to light). The DSL metallic test unit connected to the second metallic test bus is configured to send signals to control the first set of relays to disconnect the DSL line card and to provide metallic tests from DC to light. Advantageously, a determination is made whether there is traffic on either the voice line or the DSL line prior to metallic testing. The metallic test may then be run and then, for example, a timer may cause the relays to reset to their original state. Further, a detector on each of the line cards may receive out-of-band signaling from the metallic test units and cause the relays to operate.

Metallic testing of a subscriber loop that provides both voice and digital subscriber line services


A device to fix a substrate for a thin film sputter, includes a mask, a mask pressing plate, a magnetic body, and a driving unit. The mask having patterns is positioned under the substrate so as to form the patterns on the substrate. The mask pressing plate is positioned over the substrate and moves toward and contacts a back surface of the substrate at a predetermined pressure. The magnetic body is placed over the mask pressing plate and moves toward the mask pressing plate so as to have the mask adhere closely to the substrate by a magnetic force of the magnetic body. The driving unit applies a driving force to move the magnetic body. Where the mask pressing plate descends, the mask pressing plate adheres closely to the substrate. Thereafter, the magnetic body descends toward the back surface of the substrate which is supported by the mask pressing plate. The mask underneath the substrate adheres closely to a front surface of the substrate by the magnetic force of the magnetic body. Accordingly, since the substrate is multi-step supported, the alignment of the mask underneath the substrate is not dislocated.

1. Field of the Invention
The present invention relates to a device which fixes a substrate, and more particularly, to a device, which fixes a substrate for a thin film sputter, having an improved structure so as to uniformly deposit thin films on the substrate, and a method of fixing the substrate using the same.
2. Description of the Related Art
Organic electroluminesence displays are spontaneous luminescence type displays, which electrically excite a fluorescent organic compound to emit light. The organic electroluminesence displays have advantages in that they can be driven at a low voltage and manufactured with a narrow thickness. The organic electroluminesence displays are viewed by many as next generation displays which can solve many of the disadvantages associated with, for example, liquid crystal displays (LCDs), by having, for example, a wide view angle (WVA) and a fast response time.
Where power is supplied, a current flows with the movement of electrons in the organic electroluminescence displays. In other words, in a cathode, electrons move to a light-emitting layer via the assistance of an electron transport layer, while in an anode, holes move to the light-emitting layer via the assistance of a hole transport layer. The electrons and holes in the light-emitting layer made of an organic material create an exciton having a high energy. Here, a drop in energy of the exciton causes light to be emitted. Light of full color can be realized depending on the kind of an organic material of the light-emitting layer.
Generally, an organic electroluminescence display having the above-described structure is formed by a vacuum deposition method to form organic thin films, such as an electron transport layer, a hole transport layer, a light-emitting layer, or the like. In this vacuum deposition method, a substrate, on which organic thin films will be formed, is mounted inside a vacuum chamber in which a pressure is controlled to be within a range of 10−6–10−7 torr. Next, an organic material contained in a furnace is sublimated so that the organic material is deposited on the substrate. U.S. Pat. Nos. 5,833,823, 6,132,575 and 6,251,233B1 disclose such a vaccum deposition method.
FIGS. 1A and 1B show a portion of a conventional sputter which fixes a substrate so as to form thin films on the substrate. As shown in FIG. 1A, a substrate 11 is mounted over a frame 13. A mask 12, which has predetermined patterns to be formed on the substrate 11, is positioned between the substrate 11 and the frame 13. A fixture 100 is disposed over the substrate 11 to support the substrate 11. The fixture 100 includes a magnet plate 101 and a rubber magnet 102 which is attached onto a backside of the magnet plate 101.
The fixture 100 is positioned over the substrate 11 via a robot carrier (not shown) to support the substrate 11, and the mask 12 is aligned underneath the substrate 11.
As shown in FIG. 1B, the fixture 100 descends to the substrate 11. Then, the mask 12, which is made of a metallic material and is positioned underneath the substrate 11, is deformed toward the fixture 100 having a magnetic force and adheres closely to the substrate 11.
The rubber magnet 102 of the fixture 100 is placed on a back surface of the substrate 11 so as to support the substrate 11. In this manner, where the mask 12 is closely adhered to the substrate 11, a sputtering operation is performed.
However, where a distance between the mask 12 and the fixture 100 is narrow, a central portion of the mask 12 ascends first. In this case, while the central portion of the mask 12 may satisfactorily adhere closely to the substrate 11, both margins of the mask 12 do not properly adhere closely to the substrate 11.
As a result, patterns are not formed in right positions of the substrate 11 and are spread to other portions. Also, where the central portion of the mask 12 ascends prior to other portions of the mask 12, as the mask 12 adheres closely to the substrate 11, the mask 12 slips underneath the substrate 11. Therefore, the substrate 11 may be scratched by the mask 12.
To solve these problems, a conventional fixture 200 shown in FIGS. 2A through 2C has been suggested. The fixture 200 includes a rubber magnet 201 and a mask pressing plate 202 which is adhered onto a lower surface of the rubber magnet 201. A process of fixing the substrate 11 using the fixture 200 will be now described.
First, the fixture 200 is transferred over the substrate 11 via a robot carrier, (not shown) and a mask 12 is aligned underneath the substrate 11. Thereafter, as shown in FIG. 2B, the fixture 200 descends while the mask 12, which is made of a metallic material and is positioned underneath the substrate 11, ascends by a magnetic force of the rubber magnet 201. Here, the mask pressing plate 202 contacts the back surface of the substrate 11.
Next, as shown in FIG. 2C, the mask pressing plate 202 may completely press the substrate 11 so that the mask 12 adheres closely to and is fixed to the substrate 11. Thereafter, a sputtering operation is performed.
However, it is difficult for the mask 12 to completely adhere closely to the substrate 11 since a contact surface of a frame 13 with the mask 12 has the flatness of about 50 micrometers.
Accordingly, in order to improve a close adhesiveness between the substrate 11 and the mask 12, a magnetic force which is stronger than a magnetic force of the rubber magnet 201 has to be used, or a pressing force has to be increased/strengthened. However, where a magnetic body having a magnetic force stronger than the magnetic force of the rubber magnet 201 is used, the mask 12 slips underneath the substrate 11. As a result, an alignment of the mask 12 underneath the substrate 11 may be dislocated, or a leakage current may flow over a completed product. Furthermore, a method of strengthening an adhesive force between the substrate 11 and the mask 12 may crack or scratch the substrate 11.

Device for fixing substrate for thin film sputter and method of fixing substrate using the same


An integrated circuit includes a signal generating unit, a signal monitoring unit and a processing unit. The signal generating unit is configured to generate a control signal. The signal monitoring unit is configured to receive the control signal and accordingly output a monitor signal. The processing unit is configured to receive the monitor signal. The control signal is adjusted until the monitor signal is located within a preset range. A signal monitoring method used with the integrated circuit and a signal monitoring method used with a plurality of transistors are also provided.

With the progress of semiconductor manufacturing technology, the area or dimensional sizes of components and circuits have been substantially reduced and therefore the operating voltage for driving the components and circuits is also reduced. However, at the meantime when the operating voltage is reduced, the variation range of the threshold voltage which is closely related to the ON/OFF of components is not correspondingly reduced. As a result, the conduction efficiency of some components may not reach to the expectation and consequentially the operating performance of the whole circuit may be affected. Thus, it is quite important to develop a means to control and adjust the threshold voltage of components within a proper range more efficiently.

Integrated circuit and signal monitoring method thereof