In the present invention there is formed a sheet-like board member 50 having conductive coating films, such as first pads 55 and die pads 59, formed thereon or a sheet-like board member 50 which has been half-etched by using conductive coating films such as first pads 55 and die pads 59. A hybrid IC can be manufactured by means of utilization of post-processing processes of a semiconductor manufacturer. Further, a hybrid IC can be manufactured without adoption of a support board, and hence there can be manufactured a hybrid IC which is of lower profile and has superior heat dissipation characteristics.

1. Field of the Invention
The present invention relates to a sheet-like board member and a method of manufacturing a semiconductor device and, more particularly, to solution of various problems inherent to a known hybrid IC.
2. Description of the Related Art
Since a circuit device to be mounted on an electronic appliance has conventionally been adopted by a portable cellular phone or a portable computer, demand exists for realization of a more compact circuit device of lower profile and lighter weight.
A hybrid IC has frequently been used as a circuit device. A ceramic board, a metal board, a printed board, or a flexible sheet board has predominantly been employed as a board for use with the hybrid IC.
FIG. 17 shows an example board for use with a hybrid IC. The structure of the board will be specifically described hereinbelow. A conductive pattern is formed from Cu on a board 1. The conductive pattern is a wiring 6 which is integrally formed with die pads 2, bonding pads 3, outer lead electrodes 4, and pads 5 on which passive elements 9, such as chip resistors or chip capacitors, are mounted. The wiring 6 is patterned into a desired geometry in accordance with the circuit of the hybrid IC.
A semiconductor element 7 is mounted on the die pad 2, and bonding electrodes provided on the semiconductor element 7 are electrically connected to the corresponding bonding pads 3 by using bonding wires 8. The passive element is mounted on each of the pads 5, by means of brazing material such as solder or Ag paste. An external lead 10 is fixedly connected to each of the outer lead electrodes 4 through use of brazing material or Ag paste. In consideration of environmental resistance, the hybrid IC is sealed by molding. More specifically, insulating resin 11 is formed over the entire surface of the board 1 through molding.
In another case, a hybrid IC is embodied through use of a lead frame 20. FIGS. 18A and 18B show an embodiment of the hybrid IC shown in FIG. 17 which is realized through use of the lead frame 20.
A semiconductor element 22 is mounted on an island 21, and bonding pads 23 provided in the vicinity of the island 21 are electrically connected to the semiconductor element 22 by using bonding wires 24.
Of the bonding pads 23, some bonding pads 23 may be integrally formed with a wiring 25. For example, one or more of the bonding pads 23 is electrically connected to a lead terminal 26. A plurality of lead terminals 26 are provided on the side of the lead frame 20. Reference numeral 27 designates a passive element, and reference numeral 28 designates a die pad on which the passive element 27 is mounted.
Since the hybrid IC shown in FIG. 17 employs the board 1, the thickness and weight of the hybrid IC are increased by the amounts corresponding to the board 1. Further, a limitation is imposed on a reduction in costs. Particularly, at the time of formation of conductive patterns 2 through 6 formed from Cu foil on the board 1, the manufacturing process is additionally provided a step of patterning the board 1 after adhesion of a Cu foil to the board 1. The board 1 having a Cu pattern formed thereon adds to the cost of a hybrid IC. Further, the board 1 is utilized as a support board for forming conductive patterns 2 through 6, and hence the board 1 is necessary.
Use of a board poses a problem in connection with the dissipation of heat from a semiconductor element or passive element mounted on the board. For example, a printed board, a ceramic board, and a flexible sheet are formed from insulating material. Even when an attempt is made to dissipate heat to a substrate by using a board, the heat developing in a sealed semiconductor element or passive element cannot be dissipated well to the outside, because of poor thermal conductivity of the board. Even in the case of a metal board having superior heat dissipation properties, the surface of the metal board is coated with insulating plastic in order to prevent occurrence of an electrical short circuit between conductive patterns and the metal board. The plastic coating induces thermal resistance. If the temperature of a semiconductor element is lowered, the drive performance of the semiconductor element can be improved further. In spite of this fact, the performance of a semiconductor element cannot be sufficiently utilized because of poor dissipation properties of the board.
In contrast with a packaged discrete element or packaged semiconductor chip, a hybrid IC is equipped with many active and passive elements. Further, wirings for electrically interconnecting semiconductor elements are used in great numbers. Depending on the number of elements to be mounted on a board, the board is large, and very long wirings are laid on the board. Therefore, deformation of a board, such as warpage of a board, must be taken into consideration. Even if miniaturization of a conductive pattern is achieved in accordance with a tendency toward a smaller and thinner pattern of lighter weight, a support board is required for supporting narrow and long wirings without involvement of deformation such as warpage.
Consideration is given to manufacturing processes. Data pertaining to a certain pattern are transmitted to a board manufacturer from a hybrid IC manufacturer. The board manufacturer manufactures a board by means of forming the pattern on a board. The hybrid IC manufacturer purchases the thus-finished board. Thus, a great amount of time is consumed before manufacture of a hybrid IC. Accordingly, the hybrid IC manufacturer cannot supply hybrid ICs to a user within a short period of time.
In addition to the problem described in connection with FIG. 17, the hybrid IC employing the lead frame 20 shown in FIG. 18 encounters the following problems.
Since the lead frame 20 is formed by means of selectively removing material from front to back through use of the pressing technique, or through use of the etching technique, measures are taken in order to prevent lead terminals 26 and an island 21 from coming apart. More specifically, the lead terminals 26 are provided with a tie bar 29, and the island 21 is provided with suspension leads 30. The tie bar 29 and the suspension leads 30 are not originally required. Hence, there is additionally required a step of removing the tie bar 29 and the suspension leads 30 after molding of the hybrid IC.
Since a wiring 25 is laid narrowly and lengthy, the wiring 25 also requires suspension leads 31 in order to prevent deformation of the wiring 25, such as warpage. Accordingly, as mentioned previously, there is additionally required a step of removing the suspension leads 31. Further, presence of the suspension leads 30 and 31 hinders formation of other wirings, pads, or islands. Particularly, in order to prevent occurrence of intersection between wirings, a complicated pattern is required.
Since the lead frame 20 is selectively removed from front to back so as to have a predetermined pattern by means of etching or pressing, a limitation is imposed on miniaturization of a lead pattern. This also applies to the conductive pattern shown in FIG. 17.
In a case where the lead frame 20 is formed by means of, for example, pressing, a pitch between leads to be punched is said to be limited to a width substantially equal to the thickness of the lead frame 20. In a case where the lead frame 20 is formed by means of etching, the lead frame 20 is etched to a depth corresponding to the thickness of the lead frame 20, in both the longitudinal and lateral directions. Therefore, the pitch between leads is said to be limited to the thickness of the lead frame 20.
When an attempt is made to miniaturize the pattern of the lead frame 20, the thickness thereof must be reduced. If the thickness of the lead frame 20 itself is reduced, the strength of the lead frame 20 is also reduced, which may in turn cause problems such as warpage of the lead frame 20 or deformation and misregistration of the lead terminals 26. Particularly, since the end of each of bonding pads 23 to be connected to a fine metal wiring 24 is unsupported, the end of the bonding pad 23 may be susceptible to warpage or deformation.
Further, arrows shown in FIG. 18A designate areas from which lead terminals 26 protrude from the side surfaces of a semiconductor package, and an upper metal mold 32 cannot be brought into contact with a lower metal mold 33 within a space defined between the lead terminals 26. This may cause generation of burrs in these areas.
As mentioned above, miniaturization of the lead frame 20 encounters limitation, thereby hindering further miniaturization of the overall semiconductor package. From the viewpoint of processes, there may be required a method of preventing warpage of the lead frame 20, a step of removing burrs, and a necessity of removing the suspension leads 7 and the tie bar 8, thereby complicating manufacturing processes. Further in a step of removing a tie bar 8, leads are easy to be bent or drawn out from the package. Therefore reliability is apt to be lowered.

Sheet-like board member and method of manufacturing a semiconductor device


A wireless-power receiver is disclosed including a first antenna configured to transmit first near-field radio frequency (RF) energy, a second antenna configured to receive second near-field RF energy, and a communications component configured to provide a communication signal including data indicating a location of the first wireless-power receiver. The wireless-power receiver is configured to, in accordance with a determination that the wireless-power receiver is in direct contact with a surface of another wireless-power receiver, transmit the first near-field RF energy, via the first antenna, to the other receiver. The wireless-power receiver is further configured to, in accordance with a determination, based on the data indicating the location of the wireless-power receiver, that the wireless-power receiver is within a non-zero threshold distance from the other receiver or a wireless-power transmitter, receive the second near-field RF energy, via the second antenna, from the other receiver or from the wireless-power transmitter.

Electronic devices, such as laptop computers, smartphones, portable gaming devices, tablets, or others, require power to operate. As generally understood, electronic equipment is often charged at least once a day, or in high-use or power-hungry electronic devices, more than once a day. Such activity may be tedious and may present a burden to some users. For example, a user may be required to carry chargers in case his electronic equipment is lacking power. In addition, some users have to find available power sources to connect to, which is time consuming. Lastly, some users must plug into a wall or some other power supply to be able to charge their electronic device. However, such activity may render electronic devices inoperable or not portable during charging.
Some conventional solutions include an inductive charging pad, which may employ magnetic induction or resonating coils. As understood in the art, such a solution still requires the electronic devices to: (i) be placed in a specific location on the inductive charging pad, and (ii) be particularly oriented for powering due to electromagnetic fields having a particular orientation. Furthermore, inductive charging units require large coils in both devices (i.e., the charger and the device being charged by the charger), which may not desirable due to size and cost, for example. Therefore, electronic devices may not sufficiently charge or may not receive a charge if not oriented properly on the inductive charging pad. And, users can be frustrated when an electronic device is not charged as expected after using a charging mat, thereby destroying the credibility of the charging mat.
Other conventional solutions use far field RF wave transmission to create pockets of energy at remote locations for charging a device. Such solutions, however, are better suited for particular uses and configurations as far field RF wave transmission solutions typically use numerous antenna arrays and circuitry for providing phase and amplitude control of the RF waves. Accordingly, there is a desire for an economical application of a charging surface that allows for low-power, wireless charging without requiring a particular orientation for providing a sufficient charge.

Near-field wireless power transmission techniques for a wireless-power receiver


This pressure-sensitive adhesive polymer is obtained by emulsion polymerization of the mixture of the following monomers, for a total of 100% by weight: (A) 40 to 95% by weight of at least one (meth)acrylic or vinyl monomer capable of resulting in a homopolymer which has a glass transition temperature lower than or equal to -40.degree. C.; (B) 2 to 50% by weight of at least one (meth)acrylic or vinyl monomer capable of resulting in a homopolymer which has a glass transition temperature higher than or equal to 0.degree. C.; (C) 0.5 to 6% by weight of at least one carboxylic (meth)acrylic monomer; (D) 0 to 5% by weight of at least one (meth)acrylic monomer ethoxylated with 1 to 20 moles of ethylene oxide; (E) 0.05 to 1% by weight of at least one (meth)acrylic or vinyl monomer containing a ureido group; and (F) 0 to 2% by weight of at least one acrylic or vinyl monomer carrying a sulphonate functional group, the said polymer having a glass transition temperature lower than or equal to -25.degree. C.

Pressure-sensitive adhesives in aqueous phase have experienced considerable development since the beginning of the 1970s, to replace the products in solution form, constrained by the new environmental regulations and increases in solvent prices.
Pressure-sensitive adhesives must have the following general characteristics:
be capable of deforming under low pressures to obtain immediate wetting of the surface; PA1 possess sufficient viscoelastic properties to retain a permanent position after removal of the applied force. PA1 (A) 40 to 95%, preferably 50 to 65%, by weight of at least one (meth)acrylic or vinyl monomer capable of producing a homopolymer which has a glass transition temperature lower than or equal to -40.degree. C.; PA1 (B) 2 to 50%, preferably 25 to 45%, by weight of at least one (meth)acrylic or vinyl monomer capable of producing a homopolymer which has a glass transition temperature higher than or equal to 0.degree. C.; PA1 (C) 0.5 to 6%, preferably 1 to 3%, by weight of at least one carboxylic (meth)acrylic monomer; PA1 (D) 0 to 5%, preferably 0 to 3%, by weight of at least one (meth)acrylic monomer ethoxylated with 1 to 20 moles, in particular 1 to 5 moles, of ethylene oxide; PA1 (E) 0.05 to 1%, preferably 0.1 to 0.5%, by weight of at least one (meth)acrylic or vinyl monomer containing a ureido group; and PA1 (F) 0 to 2%, preferably 0.5 to 1.5%, by weight of at least one acrylic or vinyl monomer carrying a sulphonate functional group, PA1 2-Ethylhexyl acrylate . . . 56 parts PA1 Methyl acrylate . . . 41.5 parts PA1 Acrylic acid . . . 2.5 parts PA1 Demineralized water . . . 37.8 parts PA1 n-Dodecyl mercaptan . . . 0.1 parts PA1 Nonylphenol polyoxyethylenated with 10 moles of ethylene oxide (Synthopon.RTM.) . . . 2.39 parts PA1 Sodium lauryl sulphate (Texapon.RTM.) . . . 0.81 parts PA1 Brookfield viscosity at 29.degree. C.: 480 mPa s PA1 Mean particle size: 214 nm PA1 Solids content: 55.2%. PA1 2-Ethylhexyl acrylate . . . 56 parts PA1 Methyl acrylate . . . 38.5 parts PA1 Acrylic acid . . . 2.5 parts PA1 Demineralized water . . . 37.8 parts PA1 n-Dodecyl mercaptan . . . 0.1 parts PA1 Nonylphenol polyoxyethylenated with 10 moles of ethylene oxide (Synthopon.RTM.) . . . 2.39 parts PA1 Sodium lauryl sulphate (Texapon.RTM.) . . . 0.81 parts PA1 Ethyltriglycol methacrylate . . . 3 parts PA1 Brookfield viscosity at 230.degree. C.: 930 mPa s PA1 Mean particle size: 130 nm PA1 Solids content: 56.1%. PA1 Brookfield viscosity at 23.degree. C.: 620 mPa s PA1 Mean particle size: 202 nm PA1 Solids content: 55.1%. PA1 Brookfield viscosity at 23.degree. C.: 475 mPa s PA1 Mean particle size: 200 nm PA1 Solids content: 55.7%. PA1 Brookfield viscosity at 23.degree. C.: 550 mPa s PA1 Mean particle size: 195 nm PA1 Solids content: 56.0%. PA1 2-Ethylhexyl acrylate . . . 75.7 parts PA1 Vinyl acetate . . . 18 parts PA1 Acrylic acid . . . 5.3 parts PA1 Sodium vinylsulphonate . . . 1 parts PA1 Demineralized water . . . 34.7 parts PA1 Anionic surfactant marketed by Rhone-Poulenc under the name "Adex 26 S" . . . 5.71 parts PA1 Nonylphenol ethoxylated with 25 moles of ethylene oxide, marketed by Witco under the name "Rewopal HV 25" . . . 2.50 parts PA1 Brookfield viscosity at 23.degree. C.: 1500 mPa s PA1 Mean particle size: 208 nm PA1 Solids content: 56.1% PA1 Brookfield viscosity at 23.degree. C.: 1640 mPa s PA1 Mean particle size: 205 nm PA1 Solids content: 55.7%.
The bonds formed by these adhesives with the substrate are of relatively low energy and many applications require a degree of cohesion which is greater than that of the adhesion (peel, tack) to obtain an adhesive failure of the surface.
The ability of a pressure-sensitive adhesive to wet a surface well can be correlated with its glass transition temperature (Tg) and with its molecular mass. In general, obtaining a Tg lower than -25.degree. C., or even than -40.degree. C., by copolymerization of acrylic and/or vinyl monomers in the presence of transfer agents allows the desired level of tack to be obtained.
However, the influence of the Tg and of the molecular mass on the adhesive properties run counter to their influence on cohesion.
To improve the cohesive strength of pressure-sensitive adhesives without impairing the adhesive properties, a very slight crosslinking is often employed by the use of multifunctional monomers, as described in "Recent developments in acrylic polymers for latex adhesives" RAPRA 1981, Volume 18, No. 5, Abst. 7761431c.
The incorporation of chelating monomers has also been described in international application WO 91/02759, in order to increase the cohesion of pressure-sensitive adhesives after formulation of the latter with aluminium acetate.
Post-addition of such additives (Zn(Ac).sub.2, Al(Ac).sub.3) is furthermore often employed to increase the degree of cohesion of polymers containing carboxylic functional groups. However, the use of highly carboxylated latices presents problems of synthesis and of application. In fact, copolymerization of acrylic and methacrylic acid monomers in a weight proportion of polymer higher than 6% gives rise to instability problems and entails a drop in the peel strength. Furthermore, the large difference in Tg between the acids and their salts makes the Tg of the resulting composition highly sensitive to pH variations.
The search for a good adhesion/cohesion compromise therefore continues to remain one of the preoccupations of the formulators. In this context any solution that makes it possible to improve the cohesion of a pressure-sensitive adhesive without resulting in a fall in the adhesive properties, and at a cost which is compatible with the application, offers an obvious advantage.


Partitioning execution of a program between a client device and a cloud of network resources, exploits the asymmetry between the computational and storage resources of the cloud and the resources and proximity of the client access device to a user. Programs may be decomposed into work units. Those work units may be profiled to determine execution characteristics, modeled based on current state information and the profile, and a model performance metric (MPM) generated. Based on the MPM, work units may be partitioned between the client and the cloud.

Explosive growth in the use of client devices such as mobile phones, personal digital assistants, laptop computers, netbooks, desktop computers, etc. and the increasingly rich application programs demanded by users on those devices has brought to light a significant issue. Even with the recent advances in storage capacity and processing ability, the memory and computational resources of these devices are insufficient to meet the needs of those rich applications.
More recently, data networks have begun to provide access to resources in the cloud. The cloud may be considered, among other things, the combination of networks, datacenters, and other interconnected devices which together comprise an accessible whole. Given the sheer scope of the capabilities available in the cloud, there is an inherent and dramatic asymmetry between the resources available on a client device and those of the cloud.

Program partitioning across client and cloud


Provided is an organosilane compound expressed by any one of the following general formulae (1) to (7):

1. Field of the Invention
The present invention relates to an organosilane compound and an organosilica obtained from the organosilane compound.
2. Related Background Art
Studies have been conducted on various organosilane compounds and organosilicas obtained from the organosilane compounds. For example, the Journal of Organic Chemistry, Vol. 67, pp. 5279 to 5283, 2002 (document 1) discloses an oligophenylene-based organosilane as an organosilane which can be utilized as a surface-treating agent. This document 1 also discloses a triallylsilylbenzene derivative having a halogen substituent or a boranyl substituent, as an organosilane compound for producing an oligophenylene-based organosilane.
Additionally, Japanese Unexamined Patent Application Publication No. 2006-89588 (document 2) discloses an organosilica obtained by hydrolysis and polycondensation of a certain organosilane compound, including an organosilane compound having an allylsilyl group, in a solvent.
However, it is difficult to use the organosilane compounds of the above-mentioned documents as a raw-material compound for producing an organosilica having various functions, such as a refractive-index controlling function, a light absorbing function, a light emitting function, and a charge transferring function.

Organosilane compound and organosilica obtained therefrom

Abstract: (wherein: Ar represents a phenylene group or the like; R1 represents a hydrogen atom or the like; R2 to R8 each represent a methyl group or the like; n represents an integer in a range from 0 to 2; m represents an integer of 1 or 2; L represents a single bond or the like; X represents a hydrogen atom or the like; and Y represents a hydrogen atom or the like).


A clip carrier for storing and dispensing semi-automatic cartridge clips which consists of a generally rectangular container having opposite sides, opposite edges and a bottom panel with upper edge flanges that define a longitudinal groove. A cartridge clip sized opening is formed in one edge panel for entry of a cartridge clip to be forced downward against a spring-loaded push plate. A plurality of such cartridge clips can be entered and forced downward until the carrier container reaches capacity.

1. Field of the Invention
The invention relates generally to an automatic weapon ammunition dispenser and, more particularly, but not by way of limitation, it relates to a spring-loaded automatic clip holder for rapid dispensing of ammunition clips.
2. Description of the Prior Art
The prior art includes numerous types of cartridge or bullet dispensers as exemplified by U.S. Pat. No. 2,902,196 wherein individual cartridges are loaded into a magazine and dispensed under the force from an internal spring. Another device of interest is the magazine holster as disclosed in U.S. Pat. No. 5,174,482 wherein one or more holster device may be carried on a user's belt to hold individual magazines as used by an automatic pistol or the like. No prior art was encountered for the dispensing of a plurality of automatic gun magazines as disclosed in the present application.


A chemical analysis apparatus comprises a motor, a holding disk that can be rotated by the motor, a plurality of examination cartridges arranged on the holding disk, a perforator that perforates the examination cartridges, a heating device, and a detection device. The examination cartridge comprises a substrate including a vessel and a flow channel, which are defined by recesses, and a cover that covers the vessel and the flow channel. A centrifugal force generated by rotation of the holding disk is made use of to move a solution from a vessel on an inner peripheral side relative to an axis of rotation to a vessel on an outer peripheral side relative to the axis of rotation through the flow channel.

The present invention relates to a chemical analysis apparatus that makes use of a centrifugal force to cause movement, mixing, etc. of a solution, and more particular, to a chemical analysis apparatus that uses a removable cartridge.
As a method of extracting DNA from a liquid specimen containing DNA, JP-A-2003-502656 describes an apparatus for and a method of conducting in vitro amplifying assay as miniaturized. In this apparatus, after a DNA mixing liquid is passed through a glass filter as an inorganic substrate, a washing liquid and an eluant are passed therethrough and only DNA is recovered. The glass filter is provided on a rotatable structure and reagents such as a washing liquid, an eluant, etc. are held in respective reagent reservoirs in the same structure. A centrifugal force generated upon rotation of the structure causes the respective reagents to flow, and valves provided in minute flow channels, which interconnect the respective reagent reservoirs and the glass filter, are opened whereby the reagents pass through the glass filter.
As a chemical analysis apparatus that extracts and analyzes a specific chemical substance, such as a nucleic acid, etc., from a specimen containing a plurality of chemical substances, JP-A-2001-527220 describes an integral type fluid operation cartridge. In this apparatus, an integral type cartridge comprises therein a trap component part that traps reagents such as a solution, a washing liquid, an eluant, etc., and a nucleic acid, and after a specimen containing a nucleic acid is injected into the cartridge, the specimen and the eluant are mixed with each other and passed through the trap component part, a washing liquid is further passed through the trap component part, an eluant is further passed through the trap component part, and the eluant having passed through the trap component part is brought into contact with a PCR reagent to make it flow to a reaction chamber.
However, the apparatus described in the JP-A-2003-502656 involves a possibility that the reagents having passed remain in the valve parts to contaminate the recovered DNA because wax, etc., melting when heated is used for the valves. That is, there is a possibility that a DNA mixing liquid and a washing liquid remain in the valve parts and the DNA mixing liquid and the washing liquid remaining in the valve parts flow into the glass filter during a process, in which a centrifugal force causes an eluant to pass through the glass filter.
Also, with the integral type fluid operation cartridge described in the JP-A-2001-527220, reagents are passed through the trap component part by opening valves, etc. provided in the minute flow channels, which interconnect the respective reagent chambers and the trap component part, when using a pump to feed the respective reagents. Further, valves or the like provided between the trap component part and the respective chambers switch so that, out of reagents having passed through the trap component part, the washing liquid flows to a waste-liquid chamber and the eluant flows to a reaction chamber. In case of feeding a plurality of reagents by means of the pump, the reagents may remain on flow channel walls, and liquids are liable to remain especially when there are present obstacles such as valves, etc. Once the liquids remain, they do not flow, and therefore, there is a possibility of contamination at those parts, at which the liquids join other reagents. Also, in the case where a washing liquid and an eluant, which have passed through the trap component part, are switched over by valves, etc. to make them flow to separate chambers, the washing liquid having earlier flowed to the waste-liquid chamber contaminates flow channels upstream of the valves, etc., for switchover to the reaction chamber, so that there is a fear of mixing of the washing liquid with the eluant.

Chemical analysis apparatus and chemical analysis cartridge


In a method for thermally managing a room with at least one air moving device having a temperature actuator and an airflow rate actuator, a temperature of airflow at a first location in the room is received and compared with a first predetermined temperature range and a second predetermined temperature range. In the method, one of the temperature actuator and the airflow rate actuator is varied when the received temperature of the airflow is outside of the first predetermined temperature range and the other of the temperature actuator and the airflow rate actuator is varied when the received temperature of the airflow is within the first predetermined temperature range and outside of the second predetermined temperature range.

A data center may be defined as a location, for instance, a room that houses computer systems arranged in a number of racks. These racks are configured to house a number of computer systems which typically include a number of printed circuit boards (PCBs), mass storage devices, power supplies, processors, micro-controllers, and semi-conductor devices, that dissipate relatively significant amounts of heat during their operation.
Air conditioning units are typically used to cool heated air and to supply the cooled air to the computer systems. The cooled air is typically supplied through a series of vent tiles positioned above a plenum that directs airflow from the air conditioning units to the vent tiles. Conventional cooling systems are typically provisioned and operated for worst-case or peak load scenarios. Since it is estimated that typical data center operations only utilize a fraction of their computer systems, provisioning for these types of scenarios often increases the inefficiencies found in conventional cooling systems.

Hewlett-Packard Development Company, L.P.


A first silicon single crystal substrate and a second silicon single crystal substrate are bonded together and the first silicon single crystal substrate is formed thin as an SOI layer. An insulation film is buried in portions of the bonding surface of one of the two silicon single crystal substrates, and in addition, a polycrystal silicon layer is formed on the bonding surface of the silicon single crystal substrate on the side into which the insulation film is buried.

1. Field of the Invention
The present invention relates to a Silicon On Insulating (SOI) substrate and its method of manufacture, and in particular, relates to an SOI substrate that is useful in a power IC, and its method of manufacture.
2. Description of the Related Art
When monolithically integrating high-voltage vertical power elements and control circuit elements having current routes from the front to rear surface of a silicon substrate, partial SOI substrates are used that have been treated so as to allow the formation of only the control circuit elements on the SOI layer. This type of partial SOI substrate is disclosed in Japanese patents laid-open No. 29353/92 and No. 82138/91.
FIG. 1 shows sectional views of the progression of steps in a manufacturing method of SOI substrates (to be referred to as "the first example of the prior art") disclosed in Japanese patent laid-open No. 29353/92.
First, as shown in FIG. 1a, a photoresist is formed by photolithography in a prescribed pattern on one main surface of an n.sup.+ -type silicon single crystal substrate 4. This photoresist is used as a mask to form a shallow step by, for example, an ion etching method, and an SiO.sub.2 insulation film 2 is formed by a method such as thermal oxidation or low-temperature chemical vapor deposition (CVD).
Next, as shown in FIG. 1b, the protruding step portion of the insulation film 2 is removed by means of grinding-polishing or etching, and the exposed surface of the n.sup.+ -type silicon single crystal substrate 4 and the insulation film 2 are leveled.
The level surface obtained by the above-described steps is bonded to one main surface of an n.sup.- -type silicon single crystal substrate 1 and subjected to heat treatment to obtain a single firmly bonded compound substrate (FIG. 1c). Next, the n.sup.- -type silicon single crystal substrate 1 is ground and polished as far as the Y--Y plane shown in FIG. 1c to make the silicon substrate 1 a desired thickness as well as to level its surface. Next, an insulation film is formed on this leveled surface, the insulation film is patterned by means of photoetching, and using this film as a mask, alkali etching is carried out to form isolation grooves for isolation, thereby both isolating a vertical power element formation zone 6 and a control circuit element formation zone 7 and dividing the silicon single crystal substrate 1 of control circuit element formation zones 7 into silicon single crystal islands 8.
Next, an insulation film 9 composed of, for example SiO.sub.2, is formed across the entire surface of the n.sup.- -type silicon single crystal substrate 1 by thermal oxidation or low-temperature CVD, following which a polycrystalline silicon layer 10 is formed by CVD. The polycrystalline silicon layer 10 and insulation film 9 on the substrate main surface are next removed by grinding-polishing or etching, leaving the isolation grooves covered by the insulation film 9 and polycrystalline silicon film 10 to produce an SOI substrate with insulated and isolated element formation zones (FIG. 1d).
Next, as another example of the prior art to be referred to hereinbelow as "the second prior art example," explanation is given with reference to FIG. 2 regarding the partial SOI substrate disclosed by Japanese patent laid-open No. 82138/91.
First, as shown in FIG. 2a, a prescribed portion of one main surface of an n.sup.- -type silicon single crystal substrate 1 is oxidized by a selective oxidation method to form a LOCOS oxide film 11. Next, as shown in FIG. 2b, on the side of the silicon substrate 1 on which the LOCOS oxide film has formed, epitaxial growth of silicon is carried out by CVD to form an n.sup.+ -type silicon single crystal layer 14 on the portion of the main surface of the n.sup.- -type silicon single crystal substrate 1 not covered by the LOCOS oxide film 11, and a polycrystalline silicon layer 3 is formed on the LOCOS oxide film 11. Next, a mechanochemical grinding method is employed to grind as far as the X--X plane to make the surfaces of the n.sup.+ -type silicon single crystal layer 14 and the polycrystalline silicon layer 3 a single level plane.
Next, as shown in FIG. 2c, an n.sup.+ -type silicon single crystal substrate 4 is bonded to the flat plane of the n.sup.+ -type silicon single crystal layer 14 and the polycrystalline silicon layer 3 formed on the main surface of the n.sup.- -type silicon single crystal substrate 1, and a heat process is carried out to obtain a single compound substrate.
Finally, as shown in FIG. 2d, the surface of the n.sup.- -type silicon single crystal substrate 1 is ground and polished as far as the Y--Y plane shown in FIG. 2c to produce a level surface, following which, by diffusing p-type impurities at high concentration at prescribed locations to form p.sup.+ -type diffusion layers 12, a vertical power element formation zone 6 and a control circuit element formation zone 7 are isolated and the silicon single crystal substrate 1 of the control circuit element formation zone 7 is divided into silicon single crystal islands 8.
In the first example of the prior art described hereinabove, silicon single crystal and silicon oxide film (or silicon nitride film) are mixed on the bonding surface of an SOI substrate, and in the second example of the prior art, silicon single crystal and polycrystalline silicon are mixed on the bonding side of an SOI substrate. When leveling a surface in which differing substances are mixed in this way, suppressing variations in surface level to less than 100 .ANG. is extremely difficult using current grinding or etching technology. For this reason, insufficient flatness in the bonding surface may give rise to voids in the bonded plane, and as a consequence, there is the problem that peeling may originate from the vicinity of these voids during subsequent heat treatments, thereby causing the vertical power elements to be inoperable.


The present disclosure provides a system and methods for intelligently optimizing search system resource usage and performance using multiple data store technologies. A search query optimization system may utilize multiple query processors, such as a general search engine and one or more specialized data stores, to efficiently and intelligently manage and route queries. The search query optimization system may be configured to evaluate the performance of the various query processors for various types of queries, and may use this information to intelligently route search queries to the query processors best suited to service them.

Databases continue to store increasingly large amounts of data. To reduce or eliminate data redundancies across large data sets, databases can be normalized, leading to more complex and abstract design and architecture. The large volume of data stored and the complexity in database system design have contributed to the growth of general search engines and systems as tools to access and use the stored data. General full featured search engines often utilize multiple search indexes in order to aid in answering any search query submitted to such data stores. Full featured search engines and systems designed to be robust and flexible can also lead to complex search engine architecture and performance concerns.

Optimizing search system resource usage and performance using multiple query processing systems


According to an aspect, there is provided a method for managing power demand of a plurality of passenger transport installations in at least one building. The method comprises obtaining first data on available time-dependent power consumption flexibility capacity from each passenger transport installation; obtaining second data from at least one external data source, the second data being independent from operation of the passenger transport installations; determining an activation order for power demand management of the plurality of passenger transport installations based on the obtained first data and second data; and transmitting a passenger transport installation specific activation signal for the power demand management to at least one passenger transport installation of the plurality of passenger transport installations in accordance with the activation order.

In the power grid, the supply and demand of electricity must be in balance at all times. The transformation of energy systems towards more renewable and distributed energy production poses major challenges for the electricity markets and participating parties. Large quantities of weather-dependent intermittent renewable generation combined to the global trend on increasing electricity consumption, hampers the task on maintaining the power grid balance. This has caused a shift towards more demand-based electricity tariffs, which penalize end-customers with highly volatile load profiles. At the same time, grid operators are forced to purchase more reserve for frequency regulation and demand response capacity to maintain the grid stability.
The power demand of existing passenger transport systems is extremely volatile. Short peaks in the power demand can be up to 30 times as high as the average demand resulting in significant transient peaks in the power demand of a building. On the other hand, the growing amount of renewable energy production and increasing overall grid demand put pressure on grid operators to have sufficient reserve capacity to maintain grid stability.
Therefore, new ways for maintaining the grid stability are constantly required. Thus, it would be beneficial to have a solution that would alleviate at least one of these drawbacks.

Managing power demand of a plurality of passenger transport installations


An apparatus for generating a high resolution image from an image sensor having a plurality of pixels with a preselected pitch with means for dithering the image sensor. The movement of the image sensor causes the pixels to map a new area of an image without overlap of a previously mapped area. The present invention provides a simple, economic, and reliable mechanism using cascaded levers for dithering the sensor or the input image.

In some conventional imagers, transparent images are sequentially scanned by projecting light through, or reflecting light from, the image and onto an image sensor, such as a CCD imaging array. The signal from the CCD array is conditioned so that an electronic output is generated from the scanned image. The input image may consist of a typical 35 mm slide or other forms of photographic sources. The CCD array typically consists of pixels disposed in rows and columns and producing an output formed as an array conforming to a standard format, for example, as video signals in the NTSC standard format or the PAL standard format. The array responds to the light from the light that is projected through or reflected from the image source that is focused onto the imager. The resulting electronic signal nay be stored for future use or it maybe employed to generate a new image.
One problem with prior art methods used to generate images is that the resolution has been limited by the resolution capable from the available image sensors, such as CCD arrays. Typically, a photographic image has several times the resolution of a CCD imager. What is actually on the original image may not be exactly what is seen by the CCD since the it only registers image data up to the ability of its resolution. Another problem is that only a fraction of the area of a CCD array is actually photoactive, i.e. the array is "sparse". To get a more accurate reproduction and thereby greater resolution, the CCD has to see more.
One method of providing the CCD with the ability to "see more" is disclosed in U.S. Pat. No. 4,638,371, entitled Multiple Exposure of Area Image Sensor Having A Sparse Array of Elements, which teaches that each sensor element is multiply exposed by different pixels of an image. The input image is scanned in such a pattern between element exposures that each digital image pixel has a nearest neighbor digital image pixel that was produced by a different sensor element. By this arrangement, a high quality image can be produced from the digital image even if a sensor becomes defective. A dithered sensor is disclosed that has a plurality of positions so as to create a sub-image. The system disclosed, however, does not disclose a simple, economic, and reliable mechanism for dithering the sensor or the input image. Dithering is the mechanical movement of the sensor or the input image in a predetermined pattern to change the image pixel elements that are sensed by the individual elements in an array of scanning elements.
Solid state image sensors generally have a linear or area organization. An area image sensor offers the advantage of increased integration time for each element. In some applications, a large number of image pixels have to be digitized. For example, to make a high quality color print of a photographic image, something on the order of about two million image pixels must be digitized for each color (red, green and blue) of input image to produce a high quality output signal. With existing technology, typical CCD area image sensors have about 300,000 elements. Thus, each element of an area image sensor must sample a plurality of image pixels. Thus, dithering is a technique to create an image of higher resolution than that which would ordinarily be produced with the sensor's normal capability. Accordingly, it will be appreciated that a simple, economic, and reliable mechanism for dithering the sensor or the input image would be highly desirable.

Dithering mechanism for a high resolution imaging system


A camera which includes a camera body, a rear cover, and a diopter adjusting mechanism having a diopter adjustment lens for a finder optical system, including: a diopter adjustment knob provided on the rear cover; a transmission member connected to the diopter adjustment knob so as to relatively move in the direction along the axis of rotation of the knob and not to relatively rotate thereto ; a biasing spring which biases the transmission member to project toward the camera body side; a lens association rotation member which is supported by the camera body so as to rotate about an axis identical to the axis of the knob and which moves the diopter adjustment lens in the optical axis direction, in accordance with the rotation of the lens association rotation member; and at least one rotation transmission projection and recess provided on one and the other of the transmission member and the lens association rotation member; the transmission member projects to a projected position close to the camera body when the rotation transmission projection engages with the rotation transmission recess, and is retracted to a retracted position in the rear cover when the rotation transmission projection does not engage with the rotation transmission recess.

1. Field of the Invention
The present invention relates to a camera having an apparatus for adjusting a diopter of a view finder and a diopter adjusting mechanism for a finder optical system of a camera.
2. Description of the Related Art
In general, a view window of a view finder in a camera is provided on a rear surface of a camera body and a diopter adjusting mechanism therefor is provided in the vicinity of the view window. In a water-proof or drip-proof camera in which the rear surface of the camera is almost entirely defined by an openable rear cover, a diopter adjusting operation member and a drive mechanism for a diopter adjustment lens are provided on the rear cover and in the camera body, respectively. However, in this arrangement in which the operation member is disconnected from the drive mechanism when the rear cover is opened, if the operation member is actuated when the operation member is disconnected from the drive mechanism, the phase of the operation member becomes different from the phase of the drive mechanism. Consequently, even if an operator tries to close the rear cover, the rear cover cannot be closed due to an interference between the operation member and the drive mechanism. This makes it difficult to incorporate the diopter adjusting mechanism in a camera in which the operation member and the drive mechanism for the diopter adjustment lens are respectively provided on the rear cover and in the camera body.

Camera having apparatus for adjusting diopter of view finder and diopter adjusting mechanism for finder optical system of camera


A technique for content redistribution. Digital content is packaged, and the package is associated with a first license that permits usage of the content on a first device. The first license also specifies the conditions upon which the content may be redistributed and licensed for use on a second device. When a content package is sent to the second device, the second device engages in a re-licensing transaction to obtain a second license that permits use of the content on the second device. Creation of the second license takes place according to conditions specified in the first license. For example, these conditions may specify a price for the second license, and/or a requirement that a portion of the purchase price be paid back to the owner of the first license, and/or a requirement that the first license be revoked upon creation of the second license.

The electronic distribution of information in digital form is becoming increasingly common. Since the invention of the printing press, mass distribution of textual information has generally occurred on paper. Due to the ease of distributing and using information in electronic form, print and paper as means for distribution of textual information are no longer the unchallenged standard, and many consumers (and distributors) prefer information to be in an electronic form. Likewise, much audio and video content is distributed in electronic digital form. However, the distribution of information in electronic form gives rise to various problems.
One problem that is well-documented is the fact that digital electronic information can be copied much more easily than its physical counterpart, which may violate the copyright of the content creator. A paper book can be copied using a photocopier, but doing so is inconvenient and expensive, and, a photocopy of a paperback book is likely to be larger, heavier, and of lower quality than the original. These problems deter copying of books and encourage those interested in receiving the information to purchase a new copy, or, at least, to purchase a "used" original. Similarly, audio and video have traditionally been distributed in a tangible analog format such as analog magnetic tape, vinyl disk, film, etc., which can be copied, but any copy is likely to be of lower quality. Commercial audio and video have, for some time, been available in digital format (e.g., Compact Disc (CD), Video LaserDisc, Digital Versatile Disk (DVD)), and the problem of copying is rapidly becoming evident.
The problem of copying digital content is exacerbated by the fact that digital content cannot easily be "re-sold." In the physical world, a book, analog videocassette, audio vinyl disk recording, etc., can be sold from its original owner to a secondhand purchaser. This may be an advantageous transaction for both parties: the secondhand purchaser acquires a used copy of a book, record, videocassette, etc. at a reduced price as compared with the cost of a new copy, and the seller may be able to get some money for an item that he or she no longer needs or wants. This situation has no analogue in the digital world. A first user of digital content generally transfers that content to a second user by making a copy of the content (e.g., by copying it to a floppy disk, or transmitting a copy over the Internet). Once the copy is made, the first user has no incentive to destroy the old copy, since both copies are equally good and equally usable. In other words, in contrast with the physical world, transfer of content in the digital world does not normally deprive the original owner of the content. Thus, a person who wants to acquire a copy of digital content must purchase it new or make an (often illegal) copy. In theory, the legal terms of a copyright license for the content may require payment to the owner of the content at the time the copy is made, but compliance with such terms is rare at best.
Various Digital Rights Management (DRM) systems have been developed to ensure that each user purchases a new copy of a given piece of content. For example, the Microsoft® eBooks system, in one embodiment, permits content to be licensed for use only on computing devices that are registered to a particular user, and denies usage of the same content on other computing devices. This essentially encourages anyone who wants a copy of the content to purchase it at full price. However, the content may not be of sufficient value to a given person to induce him or her to buy a new copy. Such a prospective purchaser is left with three choices: either (1) pay the new-copy price, (2) do without the content, or (3) illegally pirate the content. This cost of this choice is realized in the form of an enormous amount of illicit copying, as well as new-purchase transactions that never take place because the cost is too high. It would be advantageous if digital content could be "re-sold" on some terms that result in a reduced price for the purchaser, while still allowing the publisher or other copyright owner to receive compensation for every outstanding copy of the digital content. This would allow those who would normally buy used paper books, records, videos, etc., at a reduced price to engage in analogous transactions in the digital content world.
In view of the foregoing, there is a need for a system that overcomes the drawbacks of the prior art.

Redistribution of rights-managed content


A pool ball racking system for tightly and evenly racking a set of pool balls in preparation for a beginning player's break. The system comprises an equilateral triangular racking frame within which the set of pool balls are placed. The racking frame is placed upon a napped felt surface of a pool table, with the pool balls located therein. A vibrating device secured to the racking frame is activated and causes the pool balls to resonate and settle into the nap of the felt surface, thus firmly setting the pool balls in place.

To initiate play of the many versions of pool which are popular throughout the world, it is necessary to arrange the plurality of balls (often 15, but sometimes 9 for the popular game of nine-ball) into a triangular or diamond shaped pattern such that the apex of the triangle or diamond is positioned directly over a "spot" on the pool table surface. To accomplish this with the most simplicity, pool ball "racks" are almost always employed. These racks are shaped in a standard triangle or diamond to accept 15 or 9 balls as discussed above, and have upstanding walls to retain loaded balls therein. However, to readily accept these loaded balls, typical racks are oversized such that the balls consequently fit quite loosely within the rack.
Because of the loose fit which results from standard racks, it is usually required that the individual racking the balls use his fingers to force the balls forward towards the apex of the rack in order to achieve a tight and even formation of the balls. However, due to human error, the balls are often grouped irregularly in both shape and tightness. As a result, the first player to break the rack of balls is at a disadvantage in that the improperly racked balls do not respond as would be anticipated of a properly racked set of pool balls.
Various devices are found in the prior art which attempt to provide simplified means for properly racking a set of pool balls. Theses devices prove complex and expensive in construction, and fail to provide the desired results. While these prior art units may be suitable for the particular purpose employed, or for general use, they would not be as suitable for the purposes of the present invention as disclosed hereafter.


A method is used in managing alert thresholds. An integrated slider settings dialog is provided. An existing setting for the severity of an alert threshold is displayed by the dialog. A user is allowed to view and change the setting for the severity of the alert threshold by hovering over a slider thumb.

1. Field of the Invention
The present invention relates to managing alert thresholds.
2. Description of Prior Art
Information services and data processing industries in general have rapidly expanded as a result of the need for computer systems to manage and store large amounts of data. As an example, financial service companies such as banks, mutual fund companies and the like now, more than ever before, require access to many hundreds of gigabytes or even terabytes of data and files stored in high capacity data storage systems. Other types of service companies have similar needs for data storage.
Data storage system developers have responded to the increased need for storage by integrating high capacity data storage systems, data communications devices (e.g., switches), and computer systems (e.g., host computers or servers) into so-called "storage networks" or "Storage Area Networks" (SANs.)
In a typical storage environment comprising multiple servers coupled to one or more storage units (either physical storage units or logical storage units such as volumes), an administrator administering the environment has to perform several tasks to ensure availability and efficient accessibility of data. In particular, an administrator has to ensure that there are no outages due to lack of availability of storage space for any server, especially servers running critical applications. The administrator thus has to monitor space utilization for the various servers. Presently, this is done either manually or using software tools that generate alarms/alerts when certain capacity thresholds associated with the storage units are reached or exceeded.


An interface unit for interfacing a peripheral bus of a computer system with a dispensing system for dispensing a material, such as gasoline, and which includes a plurality of dispensers for controlling the dispensing of the material. The interface unit includes a controller and a first communication link for providing bidirectional communication between the controller and the material dispensers. A second communication link is connected with an internal bus on the interface unit and the peripheral bus of the computer system to provide bidirectional communication between the controller and the computer system. The second communication link includes a window memory for storing code and a bus interface. The bus interface includes an access control port for communicating access codes between the peripheral bus and the controller and a memory control for selectively connecting either the internal bus or the peripheral bus with the window memory in a manner that only one of the controllers and the peripheral bus may access the window memory at a time. A database of dispensing data collected from the plurality of dispensers is defined in a controller memory. Polling commands are sent from the controller to the dispensers and responses are collected over the first communication link. The controller is programmed to repetitively generate polling commands for the dispensers and to update the database with resulting responses. Inquiry commands are served from the computer system to the database for retrieving from the database data that is responsive to the inquiry commands.

This invention relates generally to fuel dispensing pumps, and more particularly to a control system for such pumps, especially to such a control system which utilizes a personal computer to exchange information with a smart fuel pump, including a dispenser and/or a user debit or credit card accepter device. More particularly, the invention relates to an interface unit to regulate the exchange of information between the personal computer and the smart fuel pump.
Smart fuel pumps have been developed which are capable of receiving commands from a remote control device, such as a computer. Such commands may include a limit on the amount of gas that may be dispensed, the limit relating to the prepaying of that amount by the customer, a price per unit volume of gasoline, and the like. Such fuel pump may additionally provide status information to the computer such as the amount of fuel dispensed, whether the pump is active or "down", or the like. In addition, to having a dispenser, such smart fuel pump may additionally include a card accepter which reads a magnetic strip on a user debit card, or credit card, to allow the user to prepay for the gasoline purchase from the location of the fuel pump, remote from the computer/cash register.
An interface unit is required to handle the communication from the computer/cash register to the fuel pumps. Because of the physical separation, a universal asynchronous receiver/transmitter (UART) is typically provided to transmit and receive information to/from the remote fuel pumps which are arranged in a current-loop with each fuel pump assigned a unique address. Data exchange between the computer and adaptor box is typically in serial fashion using a standard interface format, such as an RS-232 format. This arrangement has proved to be extremely slow because all data must be converted to serial format and communicated one word at a time. Furthermore, the multiple fuel pumps on the current loop may only be addressed one device at a time from the computer to the interface unit which, in turn processes the information prior to sending it to the fuel pumps, and visa versa. This arrangement is not only exceptionally slow, but is also unreliable. A fault in any one dispenser or card reader can shut down the entire current loop, which typically is the entire system. Furthermore, it is inflexible in that any modifications to the system must be installed by a field-service representative who must physically gain access to the adapter box.
One form of computer that is gaining universal acceptance is the personal computer, or PC. A PC is especially adapted to controlling a fuel dispensing terminal because the PC may additionally handle the cash register function, payroll and inventory for the associated convenience store. A PC typically includes an expansion bus and a plurality of edge card connecters for allowing peripheral devices to directly interface with the PC. Interface circuits engaging the PC bus typically utilize a dual-ported direct memory access (DMA) in which a single memory device is accessible from the PC through the first port or a microprocessor, residing on the interface board through the second port. The direct memory access (DMA) occupies a location in the memory map of the PC and is under the control of the PC, with access granted to the on-board microprocessor by the PC through interrupts generated by the on-board microprocessor. This arrangement has many drawbacks. Not only does the DMA occupy space in the PC memory map, but the supervision of the DMA by the PC is a considerable task, which slows multi-tasking functions within the PC. Furthermore, the on-board microprocessor is required to operate at the same clock speed as the PC, whether or not this is most efficient for the functions being performed by the microprocessor. On a practical level, the DMA chip-set is expensive. Furthermore, there is only a defacto standard for PC bus format. Because there are no true industry standards, there are risks that the caveats required for the DMA may not be completely satisfied by all PCs. Therefore, it cannot be ensured that a DMA-based interface unit is truly universally compatible with all PC's.

Direct interface between fuel pump and computer cash/register


In some embodiments, a command may be used by a host processor to access certain information from a non-volatile memory, together with a message authentication code. That information may be utilized to generate a message authentication code on the processor. Then, in any future accesses, the message authentication code generated by the host processor may be compared to the message authentication code from the non-volatile memory to determine the integrity of data or code that is received from the non-volatile memory.

This relates generally to enabling the authentication of information stored in non-volatile memory.
In many cases, during an initial booting of a processor-based system, the code that is available is limited. The code may be limited to information that is available on a boot read only memory (ROM). It may also be desirable to access information on a non-volatile memory, such as a flash memory, in association with the boot process. However, the host processor may know that it can trust what is in the boot ROM on board its own system, but may have no basis for having confidence in the integrity of information on an external memory.
As one possible application, a cellular telephone may have a host processor, a boot ROM, and a flash memory. The concern is that if the host, trusting data contained on the flash memory, uses that information to boot, the system could be corrupted. For example, the code in the flash might be altered by an unscrupulous user to obtain free phone service or to alter or copy the boot code.
Thus, authenticating the information on the external memory may be desirable. Generally, such authentication may take an amount of time. In the application of a phone, this may mean that, when the phone initially is turned on, it takes some amount of time for the phone to boot up and begin operating. In addition, every time it is necessary to access additional information from the non-volatile memory, an authentication protocol may be implemented which may be somewhat time consuming.

Accelerating integrity checks of code and data stored in non-volatile memory


A handheld contact applicator system comprising a handheld contact applicator assembly having a handle body having a proximate end, a distal end, an aperture, and a length, an inserter/remover assembly having a shaft, a release button, and a contact engager; wherein the handheld contact applicator system comprises the handheld contact applicator assembly. The handheld contact applicator assembly comprises the handle body and the inserter/remover assembly in cooperative and functional combination.

1. Field of the Invention
The present invention relates generally to the field of insertion and removal devices and more specifically relates to a handheld contact applicator specifically designed for the insertion and removal of contact lenses to provide contact lens wearers a simple and sanitary means of handling their lenses.
2. Description of the Related Art
Millions of Americans suffer from problems related to their vision. Whether one has a classic case of Myopia (nearsightedness), Hyperopia (farsightedness), Astigmatism (distorted vision), Presbyopia (the need for bifocals) or more than one of the above, not being able to see clearly can effect virtually every aspect of a person's life. Most people correct their vision by wearing eye glasses or contact lenses. In particular, contact lenses are an extremely popular solution to the problems associated with poor vision. Contacts are so popular in fact, that nearly 24 million Americans wear them. According to statistics compiled by the University of Michigan, Kellogg Eye Center, of these 24 million, nearly 75% opt for soft lenses, while others choose to wear hard, rigid gas permeable or extended wear contacts. Regardless of the variety of contacts an individual chooses to wear, a consistent regimen of care must be taken in order to ensure the optimal health of the eye. Contact lenses are tiny, curved plastic discs, which are designed to be placed directly over the cornea and are held in place by a thin film of tears, as well as by surface tension (capillary action.)
Traditionally, most people insert their contact lenses one at a time, by placing each lens on the tip of the index finger and directly setting it over the cornea. While a fresh, clean pair of contact lenses can vastly improve one's vision, a pair that is soiled can potentially damage one's eyesight. When lenses are not cleaned and handled properly, dirt, oil and bacteria are directly deposited into the eye, via the contact. Resulting in everything from irritation, a scratched cornea, eye infections and blurred vision, wearing a pair of contaminated contact lenses can result in permanent intolerance to contacts, and in some extreme cases can even cause blindness.
While most conscientious contact lens wearers wash their hands before inserting their contact lenses, many others do not. Overlooking the importance of freshly washed hands, many contact lens wearers simply do not realize the dangerous consequences of handling contacts and perhaps most importantly, touching the eye, with unclean hands. Additionally, many contact lens wearers experience difficulty inserting and removing their lenses. Because of their very size and shape, properly inserting or removing a contact lens can be a daunting task, especially considering that most contact lens wearers cannot see clearly during this process. A sanitary and convenient means for insertion and/or removal of contacts into eyes is desirable.
Various attempts have been made to solve the above-mentioned problems such as those found in U.S. Pat. No. 4,378,126 to Leonid Procenko; U.S. Pat. No. 4,093,291 to Herbert L. Schurgin; U.S. Pat. No. 4,026,591 to John A. Cleaveland; and U.S. Pat. No. 4,565,396 to John M. Larimer. This prior art is representative of contact lens accessories. None of the above inventions and patents, taken either singly or in combination, is seen to describe the invention as claimed.
Ideally, a handheld applicator specifically designed for the insertion and removal of contact lenses will provide contact lens wearers with a simple and sanitary means of handling their lenses and, yet would operate reliably and be manufactured at a modest expense. Thus, a need exists for a reliable handheld contact applicator system to avoid the above-mentioned problems.


A FinFET body contact structure and a method for creating the FinFET body contact structure are disclosed. The body contact structure comprises a wide fin portion of a semiconductor fin, the wide fin portion having a polysilicon polygon shape formed on a top surface of the wide fin portion. The polysilicon polygon shape has a center area having no polysilicon. FinFETs are formed on two vertical surfaces of the wide fin portion and gates of the FinFETs are coupled to the polysilicon polygon shape. Top surfaces of the wide fin portion and the polysilicon polygon shape are silicided. Silicide bridging is prevented by sidewall spacers. All convex angles on the polysilicon polygon shape are obtuse enough to prevent creation of bridging vertices. The center area is doped of an opposite type from a source and a drain of an associated FinFET.

1. Field of the Invention
The current invention generally relates to semiconductor products. More specifically, the present invention relates to making body contacts on FinFETs.
2. Description of the Related Art
Field Effect Transistors (FETs) have been the dominant semiconductor technology used to make Application Specific Integrated Circuit (ASIC) chips, microprocessor chips, Static Random Access Memory (SRAM) chips, and the like for many years. In particular, Complementary Metal Oxide Semiconductor (CMOS) technology has dominated the semiconductor process industry for a number of years.
Technology advances have scaled FETs on semiconductor chips to increasingly small dimensions, allowing power per logic gate to be dramatically reduced, and further allowing a very large number of FETs to be fabricated on a single semiconductor chip. Scaling of FETs is currently running into physical limits. Gate oxides have become thin enough that leakage occurs through the gate oxides. Further scaling of gate oxide thickness will bring an exponential increase in leakage. Power dissipated by leakage currents has become a significant portion of total chip power, and an exponential increase in leakage results in unacceptable power dissipation for many types of chips.
Silicon on Insulator (SOI) processes have reduced FET source and drain capacitances, resulting in an improved power/performance ratio for CMOS chips fabricated in an SOI process. However, conventional SOI processes are reaching fundamental limits, resulting in undesirable effects such as the leakage effects mentioned above. Therefore, innovative new ways to make CMOS devices are being created. A FinFET is a recently developed FET device that utilizes 3-D (three dimensional) techniques to pack a large number of FETs in a given area of a semiconductor chip while reducing some of the problems described above.
Prior art FIG. 1 shows an isometric view of a FinFET. A tall, thin semiconductor fin 2 of semiconductor material (typically silicon) suitable for doping as source and drain regions rises from an insulator 1. Polysilicon gate 5 is a polysilicon conductor that surrounds fin 2 on three sides in FIG. 1. In regions where the silicon material is doped P−, source 3 and drain 4 are subsequently doped to become N+ regions, with the P− region under gate 5 serving as a body (not shown in FIG. 1) of the FinFET. A thin gate oxide 6 separates polysilicon gate 5 from the body. FinFETs have significant advantages, being "three dimensional" FETs, the gate can induce conducting channels on three sides, increasing current flow through a conducting FET, and making it less necessary that the gate oxide 6 be as thin as the gate oxide of a conventional planar FET.
FIG. 2A is a prior art drawing showing a top view (i.e., looking "down" towards insulator 1) of a FinFET. Source 3 and drain 4 are doped N+ (for an N-channel FET, an NFET). To better illustrate the makeup of the FinFET, a cross sectional view at AA is shown in FIG. 2B, also prior art. A body 8 is the portion of fin 2 that is the body of the FinFET, and is P− for the NFET. (A P-channel FET (PFET) would begin with an N− doped fin, the source and drain regions of the PFET subsequently doped P+.) The thin gate oxide 6 is shown covering both sides and the top of body 8. Polysilicon gate 5 is the gate of the FinFET and surrounds body 8 on both vertical sides and the top, separated from body 8 by thin gate oxide 6. When polysilicon gate 5 turns on the FinFET (e.g., is a high voltage relative to source 3 for an NFET), carriers conduct from source 3 to drain 4 in a direction into (or out of) the page, in FIG. 2B, in portions of body 8 near thin oxide 6.
One will note in FIG. 2B that body 8 is totally surrounded by insulating material. Insulator 1 is at the bottom of body 8; thin gate oxide 6 surrounds the left, right, and top sides of body 8. Therefore, no electrical connection to body 8 can be made to control a voltage on body 8, other than the P−/N+ junctions (for an NFET) between body 8 and source 3 and drain 4. The body voltage, relative to a voltage on the source of the FET, tends to "float". For example, when the FET is "off", and source to drain voltage is relatively high, junction leakage from the drain charges the body. However, if the body voltage becomes more than a diode drop difference from the source voltage, the body/source junction will begin to forward bias, clamping the body voltage to be no more than a diode drop different than the source voltage. (For silicon, diode drops are approximately 0.7 volts). Actual body voltage relative to the source depends on a number of factors, including temperature and switching history of the FET. A threshold voltage of a FET is dependent in part on a voltage difference between the source and the body. Many digital applications (e.g., NAND gates, NOR gates, latches, and the like) are not greatly affected by threshold uncertainty caused by variation of body to source voltage variation that can occur. For example, small delay uncertainties may occur that are acceptable, and accounted for in delay calculations. However, a number of circuits rely on a known source to body voltage for proper operation. Examples of such circuits that rely on a known source to body voltage for proper operation include, but not limited to, differential receivers, operational amplifiers, and the like. Such circuits that rely on known source to body voltages require that the body be tied to a voltage. Often, NFET bodies are coupled to ground; PFET bodies are tied to a positive supply often referred to as Vdd. Often, FETs, used in a differential stage having gates coupled to a true and a complement signal, have bodies coupled together.
Therefore, there is a need for a method and apparatus that create a FinFET body contact so that the FinFET body can be coupled to a voltage supply, or to other FinFET bodies.

International Business Machines Corporation


A system for containment of a supercritical water oxidation reactor in the event of a rupture of the reactor. The system includes a containment for housing the reaction vessel and a communicating chamber for holding a volume of coolant, such as water. The coolant is recirculated and sprayed to entrain and cool any reactants that might have escaped from the reaction vessel. Baffles at the entrance to the chamber prevent the sprayed coolant from contacting the reaction vessel. An impact-absorbing layer is positioned between the vessel and the containment to at least partially absorb momentum of any fragments propelled by the rupturing vessel. Remote, quick-disconnecting fittings exterior to the containment, in cooperation with shut-off valves, enable the vessel to be isolated and the system safely taken off-line. Normally-closed orifices throughout the containment and chamber enable decontamination of interior surfaces when necessary.

1. Field of the Invention
The present invention relates to a containment system for a supercritical water oxidation reactor. In particular, the present invention contains the radioactive or hazardous reactants in the event of a catastrophic failure of the reactor.
2. Discussion of Background
Methods and apparatus for conducting chemical reactions at supercritical conditions are known. See the descriptions in U.S. Pat. Nos. 4,594,164 and 4,792,408 both issued to Titmas. Furthermore, there are reaction vessels that are surrounded by protective containments and those that are sunken into a material that can serve as a shield. Both Titmas patents show sunken reaction vessels.
In U.S. Pat. No. 4,668,493, Levin describes a process for producing, continuously and at almost 100% yield, molten, solar cell-grade, elemental silicon by thermal reaction of a gas such as silane (SiH4) in a cylindrical reactor mounted within a containment. The cylinder envelops the reactor apparatus in a inert gas and provides thermal insulation.
Santillie, et al., use a cylindrical reactor surrounded by a cylindrical jacket, in U.S. Pat. No. 4,618,479, for producing chlorine dioxide by reacting gaseous sulfur dioxide with a metal chlorate in aqueous solution. Heat generated in the reaction chamber is absorbed by water flowing through the annulus between the jacket and the reactor.
U.S. Pat. No. 3,852,192 issued to Fassell, et al describes the use of a reactor for the wet oxidation of organic matter. The reactor chamber is subdivided into a plurality of compartments with communicating passages throughout and surrounded by a roughly concentric containment vessel with inlet and outlet ports.
However, there remains a need for a containment system that will prevent the loss of reactants, especially toxic or radioactive reactants, in the event of a major rupture of a reaction vessel while it is operating at high pressure.

Containment system for supercritical water oxidation reactor


A lower extremity dryer which allows a person to dry his/her lower extremities without having to bend over is disclosed. The lower extremity dryer has a conduit with an interior which extends from first portion an elevated position to a second portion which lies along a bathroom floor or along some other surface. The second portion has a plurality of outlets allowing air flow from the interior of the conduit to travel out of the conduit. The travel of airflow out of the conduit dries a person's lower extremities. A displaceable cover on the second portion allows a user to select the side of the lower extremity dryer from which the air flows.

1. Technical Field
The present invention generally concerns the field of personal hygiene and proper drying of a person's lower extremities. Specifically, it concerns a lower extremity dryer which redirects airflow of a conventional hair dryer from an elevated position to a lower position and toward a user's lower extremities, thereby alleviating the need for bending over and towel drying these hard-to-reach areas.
2. Description of the Related Art
Good personal hygiene practices are a necessary component of maintaining one's health. Included within good hygiene practices is a need to properly dry one's lower extremities, especially areas of the foot and, in particular, in between one's toes. Failure to properly dry these areas may result in the development of fungal infections such as tinea pedis—commonly known as "Athlete's Foot—or other related infections.
Properly drying lower extremities can be challenging. Individuals with limited range of movement for example, older persons, those with disabilities, or simply those who are not flexible may have trouble bending over to towel dry their lower extremities. As alternative, such a person may lift his or her lower extremity closer toward his or her torso but doing so requires balance and still may not be possible for those with limited range of movement. Although, lower extremity dryers exists, many require the user to bend over to operate them or contain complicated components to enable operation without bending over. Thus, there is a need for a lower extremity dryer which does not require bending over during operation.


An electrical device includes a printed-circuit board which is fitted with heat-generating components, the printed-circuit board being disposed in a housing of the device, the housing having a housing part, particularly a cup-shaped housing part, and a cooling plate connected to the printed-circuit board being pressed by a wedge against the inner wall of the housing part, in particular, being pressed such that heat from at least one heat-generating component, especially a power module having power semiconductor switches, is able to be dissipated at a contact surface to the housing part.

It is known that converters as electrical devices have signal electronics and power electronics. A load such as an electric motor is powered by the power electronics. The heat, especially the heat from the power semiconductor switches of the power electronics, is dissipated to a heat sink and from there to the surrounding air or another surrounding cooling medium.
To improve heat transfers, it is well-known to introduce heat-transfer compound into the heat-transfer area.


The invention provides quality-of-service (QoS) delivery services over a computer bus having isochronous data transfer capabilities. A transmitting node on the bus transmits a message to an intended recipient indicating a requested bandwidth for a connection. If the intended recipient has sufficient resources, it allocates an isochronous data channel on the bus and notifies the transmitter of the allocated channel. Thereafter, the transmitter transmits the data on the allocated channel. If the recipient cannot allocate a channel, it does not respond, and the transmitter thereafter detects a time-out condition and begins transmitting using a “best efforts” scheme (i.e., non-guaranteed time delivery). In a second variation, a receiving node detects that it is receiving large quantities of data from a transmitting node. In response, the receiving node allocates an isochronous data channel on the bus and notifies the transmitter of the allocated channel. Thereafter, the transmitter transmits using the allocated isochronous channel. In a third variation, multiple receiving nodes that need to receive streaming data from a single transmitting node share a common isochronous data channel. In any of these variations, each receiver can periodically transmit a “deadman” timer message on a broadcast channel to indicate that it is still receiving on a given channel. If a transmitter detects that the deadman timer has expired, it reverts to transmitting data using a “best-efforts” scheme. A transmitter can transmit both to receivers that can handle QoS services and those that cannot explicitly support QoS services.

The well-known Transmission Control Protocol/Internet Protocol (TCP/IP) has been used for many years to transmit data between computers. With the advent of the Internet, increasing numbers of people are using TCP/IP to transmit video, audio, and other forms of digital information. Applications such as videoconferencing and remote downloading of music rely on TCP/IP to transmit large quantities of information by breaking it up into packets that are then routed through the Internet. Unfortunately, the Internet cannot guarantee delivery of the information within a specified time period. Because data packets can be routed through many different computers depending on network traffic conditions, some packets may be delayed, causing "jerky" audio or video data.
It is conventional to transmit Internet Protocol (IP) packets over local area networks (LANs) such as an Ethernet. In such a scheme, IP data packets are "encapsulated" in an Ethernet frame, transmitted over an Ethernet LAN, and "unwrapped" at the receiving node to restore the original IP packet. In such networks, even though the distance between computers is generally much shorter than the Internet, there is no way to guarantee delivery of a given data packet within a specified time period. If the local area network becomes temporarily congested due to network traffic, time-sensitive data such as video streams can be delayed for an indeterminate time period.
One scheme for mitigating the aforementioned problem requires that network users (e.g., application programs) request bandwidth from a "Subnet Manager," which acts as a central clearinghouse for bandwidth on the Ethernet. Each network user must register with and use the service to transmit data packets. If even one network user fails to register before making use of the network, the scheme can fail, since the one user can effectively make unfettered use of the bandwidth on the network. Existing application programs must typically be modified to conform to the new scheme. Moreover, because the physical bus topology is inherently non-deterministic (e.g., collisions can prevent a given packet from reaching its destination in a specified time period), packets can still arrive late, causing jitter and other effects.
Recently, a serial bus standard known as the IEEE 1394 bus has been developed. Implementations of this bus are based on the internationally adopted ISO/IEC 13213 (ANSI/IEE 1212) CSR Architecture Specification and the IEEE 1394-1995 Serial Bus Specification. A typical system conforming to the IEEE 1394 standard includes a plurality of nodes that are interconnected via point-to-point links, such as cables, that each connect a single node of the serial bus to another node of the serial bus. The nodes are addressable entities that can be independently reset and identified.
The 1394 bus provides both asynchronous and isochronous (time-guaranteed delivery) capabilities. Up to 64 isochronous channels are available on the bus. Nodes needing to send isochronous data must reserve bandwidth and a channel number on which to transmit. Bandwidth is measured as the percentage of a nominally 125-microsecond isochronous interval. Reservation of bandwidth and channel numbers is performed by manipulating registers on a well-known bus node, referred to as the isochronous resource manager (IRM).
The IEEE 1394 bus provides three primary types of bulk transfer:
(1) async-write (write to a specific address on a specific node). This is a point-to-point, best-effort, acknowledged service with no timeliness guarantees.
(2) async-stream (stream data on a specific channel). This is a multicast, best-effort, non-acknowledged service with no timeliness guarantees.
(3) isoch-stream (stream data on a specific channel with time guarantees). This is a multicast, isochronous (latency under 250 microseconds) non-acknowledged service that uses the same 64 channels available under async-stream.
Various implementations of the IEEE 1394 bus in computer systems typically include layered hardware and software support based on transaction, link, and physical layer protocols. The Internet Request for Comments (RFC) 2734, available at http://www.ietf.org/rfc/rfc2734.txt, describes a scheme for using the 1394 bus to transmit IP datagrams. The document generally describes a multicast channel allocation protocol (MCAP), which permits management of serial bus resources when used by IP multicast groups. However, it does not provide a generalized approach for providing quality-of-service facilities for applications using the bus.
Another document (http://search.ietf.org/internet-drafts-ietf-ip1394-ip-over-iso1394-00.txt) describes a proposal for using the isochronous channels on an IEEE 1394-compliant bus to guarantee bandwidth. The document generally suggests transmitting specific IP flows over a certain isochronous channel on the 1394 bus. However, it does not address various QoS requirements (e.g., point-to-point flows, such as a TCP connection), and does not support multicast.
Another document (IEC 61883-1) describes a protocol for the cooperative allocation and sharing of IEEE 1394 isochronous channels among audio/video devices. The protocol concerns itself purely with the reservation of channels and setting maximum transmission parameters for channels; it does not concern itself with the advertisement of the type of data transmitted over a particular channel.
Conventional approaches for allocating bandwidth to transmit data packets over a bus can incur various disadvantages, such as: (1) the possibility that bus resources can be locked up indefinitely if a resource requester crashes after allocation; (2) wasteful allocation where a transmitting node requests resources but the intended recipient is not available or able to use the resources; (3) an inability of applications that lack QoS capabilities to efficiently use bandwidth on the bus; and (4) no graceful degradation (i.e., failure to allocate isochronous facilities results in failure of communication, rather than degraded communication).
Consequently, there is a need to provide a decentralized quality-of-service facility that can be implemented over the IEEE 1394 bus, and that can adapt to changing conditions on the bus. Moreover, there is a need to provide quality-of-service features even for applications that do not directly support QoS services.

Method and apparatus for providing quality-of-service delivery facilities over a bus


A method for capturing hydrocarbons from a formation is provided. After a first hydraulic fracturing of a formation to produce a first conditioned formation, and while hydrocarbons are being produced from the first conditioned formation, a predetermined wellbore characteristic is monitored for. The predetermined wellbore characteristic is based on at least a pressure within the first conditioned formation. After detecting the predetermined wellbore characteristic, a second hydraulic fracturing of the formation is effected to produce a second conditioned formation.

In producing hydrocarbons from within a subterranean formation, a wellbore is drilled, penetrating the subterranean formation. This provides a partial flow path for hydrocarbon, received by the wellbore, to be conducted to the surface. In order to be received by the wellbore at a sufficiently desirable rate, there must exist a sufficiently unimpeded flow path from the hydrocarbon-bearing formation to the wellbore through which the hydrocarbon may be conducted to the wellbore.
In some cases, such as in low and ultra-low permeability formations, it is necessary to create new fractures or extend existing fractures within the subterranean formation in order to establish the flow path for conducting the hydrocarbon to the wellbore. Such fractures are more permeable to the flow of hydrocarbons than the formation. Examples of such low and ultra-low permeability formations include shale dry-gas reservoirs, shale gas-condensate reservoirs, shale oil reservoirs, tight oil reservoirs, and tight gas reservoirs.
To initiate new fractures, and/or extend and interconnect existing fractures, hydraulic fracturing fluid is injected through wellbore into the subterranean formation at sufficient rates and pressures for the purpose of hydrocarbon production stimulation. The fracturing fluid injection rate exceeds the filtration rate into the formation producing increasing hydraulic pressure at the sand face. When the pressure exceeds a formation fracturing pressure, the formation rock cracks and fractures. After this hydraulic fracturing stage, proppant may be flowed downhole within the wellbore and deposited in the fracture to prevent the fracture from closing once the fluid injection is suspended, thereby helping to preserve the integrity of the flow path.
Production from the formation can then be initiated. As hydrocarbons are produced from fractured formations, the pressure of the well decreases. In formations that are compressible, the decrease of pressure tends to increase the forces urging the fractures to close. After continuous production, the proppant may not be sufficient to counteract forces urging the fractures to close. Increasing compression forces may effect a reduction in porosity and permeability as well as the closure of natural micro fractures and slots. The closure of hydraulic fractures leads to reduction in well productivity.
The reduction in productivity can be reversed, at least in part, by re-fracturing the formation. Prior methods for the determination of when re-fracturing should be effected are based on well economics.
There exists a need for improved methods for re-fracturing formations in order to increase the recovery of the hydrocarbons in the formation.