A computationally efficient and accurate procedure for calculating electron beam dose within a volume of a patient incorporating knowledge about the variations in density of the patient as obtained from a CT machine or the like employs an iterative process of dividing the patient into a set of layers of elements where each layer is computed from the previous layer by algebraic approximations of the Fermi partial differential equation. Energy loss of the particles is accommodated through the addition of a simple functional relationship between depth and energy or by separately binning energy at each layer as determined by local energy loss.

1. Field of the Invention
This invention relates generally to radiation therapy equipment for the treatment of tumors, or the like, and specifically to a computerized method of evaluating dose levels in electron beam radiotherapy treatment.
2. Background Art
Medical equipment for radiation therapy treats tumorous tissue with high energy radiation. The amount of radiation and its placement must be accurately controlled to ensure both that the tumor receives sufficient radiation to be destroyed, and that damage to the surrounding and adjacent non-tumorous tissue is minimized.
Internal source radiation therapy places capsules of radioactive material inside the patient in proximity to the tumorous tissue. Dose and placement are accurately controlled by the physical positioning of the isotope. However, internal source radiation therapy has the disadvantage of any surgically invasive procedure, including discomfort to the patient and risk of infection.
External source radiation therapy uses a radiation source that is external. The source of the high energy radiation may be x-rays, or electrons from linear accelerators in the range of 2 to 25 MeV, or gamma rays from highly focused Co.sup.60 sources having an energy of 1.25 MeV. The external source is collimated to direct a beam into the patient to the tumor site.
Although the size and strength of the radiation beam from the external source may be accurately controlled outside of the patient, the dose received by a given volume within the patient may vary because of scattering and absorption of the radiation by the intervening tissue. For this reason, a determination of the proper dose and placement of the dose requires an estimation of the effects of treated tissue and the tissue surrounding the treated area in scattering or attenuating the radiation beam.
With electron beam radiotherapy equipment, the scattering of the electrons as they interact with medium is described by Fermi's partial differential equation: EQU .PSI..sub.z =-.alpha..PSI..sub.x +(T/4).PSI..sub..alpha..alpha. -.beta..PSI..sub.y +(T/4).PSI..sub..beta..beta. ( 1)
where .PSI. is a function of the Cartesian coordinates x, y and z describing the density of electrons (flux) at points within the volume of the medium and of angles .alpha. and .beta. which describe the trajectory of the electrons with respect to the z axis, and where .PSI..sub.z, .PSI..sub.x, and .PSI..sub.y are the partial derivatives of .PSI. with respect to x, y and z; .PSI..sub..alpha..alpha. and .PSI..sub..alpha..alpha. are the second partial derivative of .PSI. with respect to angles .alpha. and .beta. respectively, and T is the scattering power of the medium through which the radiation travels. In general, T will vary throughout the volume and will therefore be a function of x, y and z.
Analytic solutions to Fermi's partial differential equation, that is, algebraic functions .PSI.(x,y,z,.alpha.,.beta.) that meet the requirements of equation (1), are difficult to determine in all but a few simple cases. Those simple cases include that where the patient is homogeneous or where the values of T varies only as a function of z. Neither of these cases accurately describe many volumes within a patient where radiotherapy may be required.
Failure to accurately account for variations in the value of T in the x and y directions may lead to "hot" or "cold" spots where substantially more or less radiation is delivered than desired. This is especially true in the neighborhood of substantial x and y variations in density such as may occur if the tumor to be treated is near a cavity or bone.
For this reason, a "Monte Carlo" method is presently preferred for the calculation of radiation dose for electron beam radiotherapy. In this technique, the paths of several million particles are traced through a model of the patient which accurately reflects the three dimensional variations in the value of T within the volume being studied. At regular points along the path of each electron as modeled, a probability of scattering is calculated based on the value of T at that point. For large numbers of electrons (above 10.sup.6) an accurate representation of the dose is obtained.
Unfortunately, the Monte Carlo method is extremely time consuming and may take upwards of several hours for the computation of a single dose on current electronic computers.
The need exists for a method of dose modeling accurately accounting for variations in T and that has greater computational efficiency than the Monte Carlo technique.


An apparatus and a method. The apparatus includes a receiver including an input for receiving a codeword of length mj, where m and j are each an integer; a processor configured to determine a decoding node tree structure with mj leaf nodes for the received codeword and receive an integer i indicating a level at which parallelism of order m is applied to the decoding node tree structure; and m successive cancellation decoders (SCDs) configured to decode, in parallel, each child node in the decoding node tree structure at level i.

Polar codes are capacity achieving codes that have received a significant amount of attention recently, and are being considered as a specification for channel codes in fifth generation (5G) communication systems. Polar codes are also being considered for error correcting codes in memory systems.
Polar codes are classically decoded with a successive cancellation decoder (SCD) which has a computational complexity on the order of (N log N) for a code of length N, where N is an integer. However, the serial nature of an SCD also results in a large decoding latency of (N log N), where N is a code length. The SCD decoding latency can be reduced to 2N−2, using multidimensional polar decoding where multiplicities of each node at the decoding tree are decoded in parallel. Better decoding performance may be achieved by list decoding polar codes. However, list decoding of a polar code has a computational complexity on the order of O(LN log N) for a list size of L, which is an L-fold increase over that of successive cancellation decoding of a polar code.

This patent is subject to a terminal disclaimer.

Apparatus and method for parallelized successive cancellation decoding and successive cancellation list decoding of polar codes


Plastic surfaces are activated for the reception of adherent metal coatings by depositing noble metal nuclei thereon, the noble metal nuclei being deposited by a multistep process including the steps of mechanically roughening the surface, treating the roughened surface with a complex-former solution, thereafter treating the surface with a solution of a noble metal complex salt so as to exchange the noble metal complex for the complex deposited by the initial complex-former solution, and converting the noble metal complex to form metal nuclei.

The present invention relates to a process for activating or sensitizing the surfaces of plastic materials by chemical nucleation with a noble metal so that a metallization can be performed thereafter.
When metallizing plastics, such as acrylonitrilebutadiene-styrene (hereinafter referred to as ABS) or modified Plexiglas materials, it is customary to acitvate the surface, after it has been roughened mechanically, by means of a strong oxidation agent, e.g. hot SO.sub.3 vapor, in order to then be able to nucleate the surface with a noble metal. After being activated with noble metal nuclei, the plastic surfaces may then be metallized, e.g., with copper, nickel, silver, gold, the metals being chemically deposited on the noble metal nuclei. The above explained measures are called the SAN method.
While the so-called SAN method results in the formation of adherent metal coatings on plastic surfaces, the method is characterized by several disadvantages. For example, one disadvantage of this method is that the SO.sub.3 vapor is not only very toxic, but it is also very corrosive. This requires considerable expenditures for equipment in order to keep environmental pollution within limits and to prevent any danger to the health of the personnel operating the plant.

Process for activating plastic surfaces for metallization thereof by treatment with a complex forming solution


A design verification device includes a diagram data memory for storing designed diagram data, a design reference value memory for storing a design reference value, a determination circuit for making determination with different weight between intersecting directions of a diagram to either the distance or the design reference value in calculating the distance between diagram data provided from the diagram data memory means for making determination whether the calculated distance follows the design reference value; and an error signal output circuit for providing an error signal when determination is made that the design reference value is not followed by the determination circuit.

1. Field of the Invention
The present invention relates to a design verification device in the plan design drawing of, for example, a semiconductor integrated circuit, to calculate the distance between the designed diagram data for automatically verifying whether the design is carried out according to previously set design reference values.
2. Description of the Background Art
FIG. 1 is a plan view showing diagram data in the plan design drawing of a semiconductor integrated circuit. FIG. 2 is a sectional view of the semiconductor integrated circuit of FIG. 1 taken along line 2--2. Referring to FIGS. 1 and 2, a contact hole 1 is formed in an insulation film 5 to make contact with an n.sup.+ diffusion region 3. An Al interconnection 4 is formed in contact hole 1. The drain of the MOS transistor having a channel formed in the overlapping region of n.sup.+ diffusion region 3 and Al interconnection 4 is connected to Al interconnection 4 through contact hole 1. A gate polysilicon 2 is formed between adjacent n diffusion regions 3.
It can be seen from FIG. 2 that gate polysilicon 2 is separated from Al interconnection 4 by insulation film 5. FIG. 2 shows the normal case where there is no positioning offset of gate polysilicon 2 in the photolithodiaphic process of printing the pattern of contact hole 1 in an Si substrate.
FIG. 3 shows the case where there is positioning offset of gate polysilicon 2. Such a positioning offset causes shorting to occur between Al interconnection 4 and gate polysilicon 2.
In order to prevent shorting caused by positioning offset, the distance d (shown in FIG. 1) between contact hole 1 and gate polysilicon 2 is set as a design reference value previously in the stage of designing to design a circuit pattern diagram.
A design verification device has been developed having a program that automatically checks by computing whether the design reference is satisfied in all the design drawings. Such a design verification device is called DRC (Design Rule Check).
FIG. 4 is a plan view showing an error determination boundary according to a conventional design rule check method. Referring to FIG. 4, an error determination boundary 1b is a virtual diagram joining points having a distance of a from contact hole 1. Error determination boundary 1b is enclosed with straight lines of I and III which are the parallel displacement of the top and bottom sides and the left and right sides of contact hole 1 by the distance of a, and with a corner portion II which is a circular arc having a radius of a where the vertex of the corner portion of contact hole 1 is the center point.
FIG. 5 is a plan view showing an example of a diagram data in which determination is made of no error with respect to error determination boundary 1b. Determination is made of no error if the diagram of gate polysilicon 2 does not transgress error determination boundary 1b, as in the case of the three gate polysilicons 2 of FIG. 5.
FIG. 6 is a plan view showing an example of a diagram data where determination is made of an error with respect to the error determination boundary 1b of FIG. 4. It can be seen from FIG. 6 that gate polysilicon 2 transgresses the error determination boundary 1b, resulting in the determination of an error.
FIG. 7 is a plan view showing the offset between a completed plan pattern and the design plan pattern. Referring to the design plan pattern of a rectangular contact hole 1 of FIG. 7, the plan pattern comes nearer to a circle with the width of the longer side broadened due to a slight blur of image of the optical system in photolithography or difference in the etching rate, whereby the completed plan pattern 10 is enlarged towards the longer side.
It is necessary to set the design reference value of the longer side to be larger than that of the shorter side in order to carry out design reference checking taking into consideration the actual configuration of the product after manufacturing.
A conventional method of design rule checking in shown in FIGS. 8 and 9 where the design reference value differs between the long side and the short side.
In the checking method of FIG. 8, the error determination boundary is provided with design reference value "b" for the long side, design reference value "a" for the short side, and a circular arc of radius "a" for the corner portion. In this case, an error can not be detected even if there is a gate polysilicon 2 that should be determined as an error.
FIG. 9 shows an error determination boundary where a circular arc of not radius "a" which is the design reference value for the short side, but of radius "b" which is the design reference value for the long side, is employed for the corner portion. In this case, determination is made of an error which should really be not.
Thus, there were cases where erroneous determination was made, as described in the foregoing, when different design reference values were set for the direction of the x axis and the y axis in the conventional method of design rule checking.


A method for producing 1,4-dihydroxy-2-naphthoic acid which comprises the steps of: subjecting 1,4-dihydroxynaphthalene into an alkali metal salt formation reaction in an organic medium capable of dissolving 1,4-dihydroxynaphthalene using an alkali metal alcoholate; and subjecting the salt formation reaction mixture to carboxylation using carbon dioxide gas.

There has been proposed several methods for producing 1,4-dihydroxy-2-naphthoic acid which is useful as an intermediate in the production of dyes, pigments and photographic agents.
For example, J. Am. Chem. Soc., vol. 64, 798 (1942) reports a method for producing 1,4-dihydroxy-2-naphthoic acid by using phthalic acid and a succinate. J. Prakt. Chem., vol. (2)62, p. 30 (1900) reports that the target naphthoic acid is synthesized by reacting 1,4-dihydroxynaphthalene with alcoholic sodium hydroxide or alcoholic potassium hydroxide in an alcohol solvent to form a sodium or potassium salt thereof, drying the obtained product in a hydrogen gas stream, allowing the crystals thus obtained to reaction with carbon dioxide under increased pressure of carbon dioxide gas at 170.degree. C. for 20 to 30 hours, and then subjecting the reaction mixture to salting out with diluted hydrochloride acid.
In recent years, JP-A-57-126443 and JP-A-57-128655 propose each a method for carboxylating 1,4-dihydroxynaphthalene with carbon dioxide gas in an organic medium in the presence of potassium carbonate anhydride in the form of fine particles. JP-A-59-141537 and JP-A-60-104037 also propose each a method for carboxylating 1,4-dihydroxynaphthalene with carbon dioxide gas in the presence of an alkali metal compound and water. The term "JP-A" as used herein means an "unexamined published Japanese patent application".
However, the method for producing 1,4-dihydroxy-2-naphthoic acid from phthalic acid and a succinate requires a long time and a complicated procedure. In the case of the method comprising isolating an alkali metal salt of 1,4-dihydroxynaphthalene and then carboxylating with carbon dioxide gas, the alkali metal salt of 1,4-dihydroxynaphthalene is highly unstable and a large amount of by-products are formed, thereby decreasing the yield of the desired product. In addition, there are a number of difficulties in the embodiment of this method on an industrial scale.
In the case of the methods described in JP-A-57-126443 and JP-A-57-128655, it is necessary to use highly hygroscopic fine particles of potassium carbonate anhydride and to carry out the reaction at a high temperature under an increased pressure for a long period of time while maintaining the moisture content at a level of 0.5% or less. In addition, a complicated procedure is needed in order to isolate the desired 1,4-dihydroxy-2-naphthoic acid from the reaction mixture.
The methods described in JP-A-59-141537 and JP-A-60-104037 can establish only a low conversion ratio and it is therefore needed to recover the starting material. In addition, it is necessary to rapidly cool the reaction mixture after the completion of the reaction, since the cooling rate affects the yield.
Thus, although there have been proposed several methods for producing 1,4-dihydroxy-2-naphthoic acid, it is hard to say that they are advantageous from an industrial viewpoint. Therefore, it has been urgently required to establish an industrially advantageous method for producing 1,4-dihydroxy-2-naphthoic acid.

Method for producing 1,4-dihydroxy-2-naphthoic acid


A stacked battery sealed by a film casing shows a raised degree of resistance against vibrations. The stacked battery includes a stacked body formed by alternately laying plate-like positive electrodes and plate-like negative electrodes one on the other by way of separators, each of the positive electrodes and the negative electrodes having recessed sections and corresponding projecting sections, the recessed sections of each electrode being disposed vis-a-vis the projecting sections of one of the adjacent electrodes of the opposite polarity and the projecting sections of each electrode being disposed vis-a-vis the recessed sections of the other adjacent electrode of the opposite polarity except the those arranged closest to the exposed surfaces of the stacked body, and holding members respectively engaged directly or through at least one of the separator and the film casing with the recessed sections and the projecting sections of the electrodes arranged closest to the exposed surfaces, the holding members being rigidly secured to the film casing covering the stacked body and sealing the stacked battery, the positive electrodes and the negative electrodes being respectively connected to a positive terminal and a negative terminal.

Lithium ion secondary batteries are being employed as main power sources of small portable electronic appliances because they have remarkable advantages including that they show a high energy density and are hardly degraded after a number of charging/discharging cycles if compared with other secondary batteries.
Known lithium ion secondary batteries include those formed by putting a battery element into a metal can and sealing the can and those formed by covering a battery element by a film casing to produce a battery case and sealing the case.
Particularly, there is a demand for large-capacity batteries in power supply applications such as electric automobiles, hybrid automobiles and various codeless machines such as codeless electric tools. Stacked batteries formed by casing a battery element by a film casing to produce a battery case and sealing the case are believed to be particularly suitable for such applications because of a high weight efficiency and a high volume efficiency they provide.
Such a film casing is prepared by laying a film such as a polyethylene film that is highly resistive against corrosion in electrolytic solutions and showing an excellent heat sealing effect and a highly corrosion-resistant film such as a polyimide film or a polyester film respectively on the inner surface and on the outer surface of an aluminum foil.
FIGS. 10A, 10B and 10C of the accompanying drawings schematically illustrate an example of a stacked battery sealed by a film casing. FIG. 10A is a schematic perspective view of the stacked battery and FIG. 10B is a schematic plan view of the stacked battery, while FIG. 10C is a schematic cross sectional view of the stacked battery taken along line A-A′ in FIG. 10B.
The stacked battery 1 is sealed by a film casing. It has a positive terminal 9 and a negative terminal 10 that operate as external connection terminals and are drawn out from the heat seal section of the film casing 2 by way of easily adhering seal members 11 that respectively cover the positive terminal 9 and the negative terminal 10 in order to prevent any liquid leakage from around the external connection terminals.
A flat stacked body 15 is formed by laying positive electrodes 6 and negative electrodes 8, both of which are flat and plate-like, one on the other by way of separators 7, and sealed by a film casing 2 and the prepared case is subsequently sealed to produce a stacked battery. Therefore, the stacked body can move in the case as the stacked battery is subjected to vibrations in any of the three directions that are orthogonal relative to each other. Then, as the stacked body 15 moves in the film casing 2 due to vibrations and repeatedly rubs the inner surface of the film casing 2, holes and fissures can be produced at the four corners of the film casing 2 and the parts thereof where the electrode terminals are drawn out to give rise to liquid leaking sections 20 as shown in FIG. 10B.
Proposals have been made to arrange a hygroscopic agent in parallel with the exposed surfaces of the stack of a battery element to absorb moisture in the inside of the film casing and alleviate the vibrations applied to the battery in a sealed battery in which a stacked body is sealed by a film casing (refer to, e.g., JP-A-2005-056672).
However, the hygroscopic agent arranged in parallel with the exposed surfaces of the stacked body of a battery element cannot prevent the film casing from being damaged when the stacked body is subjected to large vibrations for a long period of time.
However, while such a technique of providing aligning sections can hold the positional integrity of the positive electrodes and the negative electrodes of the stacked body of a battery element, it cannot solve the problems that arise due to repeated contacts of the stacked body of a battery element with the inside of the film casing covering the stacked body if it is applied to a battery covered by a film casing and sealed.
However, while such a technique of providing aligning sections can hold the positional integrity of the positive electrodes and the negative electrodes of the stacked body of a battery element, it cannot dissolve the problems that arise due to repeated contacts of the stacked body of a battery element with the inside of the film casing covering the stacked body if it is applied to a battery covered by a film casing and sealed.
Therefore, the object of the present invention is to provide a stacked battery which is produced by sealing a stacked body by a film casing and sealing the latter and of which performance is not deteriorated due to leakage of an electrolytic solution and intrusion of moisture from the atmosphere because of a scratch, crack or the like formed on the film casing after vibrations are repeatedly applied thereto.


A height adjuster (10) useful to adjust the height of a safety belt webbing, comprising: a frame (12) having a plurality of spaced locking formations (18); a carrier (16) movably mounted upon the frame comprising; a handle assembly (40) for locking the carrier into a designated one of the locking formations (18) comprising: a locking pin (50) movable into and out from the designated locking formation and biased by a first spring (134) toward the locking formations: and activation assembly (60,70,90), comprising variable height spring (90) for initiating retraction of the pin from the designated locking formation in response to a squeezing or clamping action, the carrier being movable along the frame with the locking pin (50) disengaged from any locking formation.

The present invention generally relates to a seat belt height adjuster.
Many vehicles use seat belt height adjusters which permit the occupant to vary the location of an associated D-ring so that a shoulder belt portion of a safety belt crosses the occupants upper torso, shoulder or neck at a comfortable location. U.S. Pat. No. 4,571,001, Hakannson, is illustrative of a typical prior art height adjuster. Upon pulling a handle outwardly an associated pin is moved from a locking formation or opening in a frame. A slide or carrier is moved up or down within a frame to vary the D-ring's position. Thereafter the locking pin is latched within another one of the locking formations under control of the occupant. In the above-referenced patent, the unlocking force is applied along a single predetermined direction in order to initiate removal of the pin from the locking formation.
It is an object of the present invention to provide an improved height adjuster with a multi-directional unlocking means. Accordingly, the invention comprises: a frame having a plurality of spaced locking formations, a carrier movably mounted upon the frame. The carrier has a handle assembly for locking the carrier into one of the locking formations comprising a locking pin movable into and of the designated locking formation and biased by a first spring toward the locking formations, and a variable height spring means for initiating retraction of the pin from the designated locking formation in response to an inwardly directed force on the spring means. The carrier is movable along the frame with the locking pin disengaged from any locking formation. More specifically, the present invention includes a cylindrical first sleeve having a central bore therethrough, a bearing plate, located about the first sleeve, the bearing plate includes first spring retaining means for receiving a first side of the spring means, a second sleeve is slidably received about the first sleeve connected and movable with the locking pin. The second sleeve includes second spring retaining means for receiving an opposing side of the spring means.
Many other objects and purposes of the invention will be clear from the following detailed description of the drawings.


A seatback includes a frame and a panel rotatably coupled to the frame. A support bracket is attached to the frame with a lever is rotatably coupled to the support bracket. The lever is configured to engage the panel with a frame supported actuator via a cable attached to the actuator and the lever.

An interior of a vehicle, such as automobile, typically includes energy absorbers for absorbing kinetic energy from occupants of the vehicle during an impact of the vehicle. One or more of the energy absorbers may be passive and designed and built into the interior of the vehicle. One or more of the energy absorbers can be active and triggered when an impact is detected. The active energy absorber may be in communication with an actuator and an impact sensing system. The impact sensing system may include a plurality of sensors for sensing the impact and a controller in communication with the sensors and the actuator. The controller, based upon an impact sensed by the sensors, causes the actuator to be triggered to deploy the active energy absorber.
The vehicle may include energy absorbers to absorb energy from rear occupants, i.e., occupants seated behind a first row of seats, during impact. During a frontal impact, the rear occupants may move forward toward the front row of seats. However, the space in the interior of the vehicle is limited. As such, there remains an opportunity to design an energy absorber for rear occupants that fits within packaging constraints of the vehicle and may be cost effective to install and replace.


A system and method for polishing an optical fiber with a polishing lap. The system comprises a substrate, an optical fiber disposed on the substrate so as to be outwardly curved, and an electrical conductor disposed over the outward curve of the optical fiber. A voltage source is connected to the electrical conductor, and the polishing lap is configured to initially abrade the electrical conductor to cause severance thereof. The position of the polishing lap when the electrical conductor is severed represents a reference point approximately indicating the surface of the optical fiber. A detector connected to the electrical conductor detects a change in voltage therein, indicating severance of the electrical conductor, and subsequently monitors the polishing depth relative to the reference point.

1. Field of the Invention
This invention relates to methods for polishing optical fibers. More particularly, the present invention relates to a precision method for controlling the depth to which a grinding or polishing device abrades the surface of an optical fiber.
2. Description of Related Art
While the concept of optical conductors has been around for more than a hundred years, advances made within the past forty years or so have made them the preferred communications transmission medium today. This is because of their low-loss transmission, high-information-carrying capacity, small size and weight, immunity to electromagnetic interference, unparalleled signal security, and the abundant availability of the raw materials (i.e. ordinary sand) required to make them. While they are higher in cost than conventional electrical conductors, their benefits are believed to far outweigh the slightly higher cost. As a result, fiber optic communication lines are gradually replacing conventional electrical communication lines at an increasingly rapid rate. For example, it is estimated that from 1970 to 1998, over 100 million kilometers of optical fibers were installed worldwide.
One of the greatest benefits of optical fiber communication lines is their enormous data handling capacity. For example, using advanced transmission techniques, a single pair of copper telephone wires can be made to carry about two dozen simultaneous conversations. However, by the mid 1980""s, it was already possible to transmit more than 12,000 simultaneous conversations over a single pair of optical fibers. The first transatlantic fiber optic cable, completed in 1988, could carry 40,000 simultaneous conversations using just two pairs of optical fibers. Advances since that time have increased the capacity of fiber optic transmission lines even more.
Couplers, amplifiers, etc. have been developed for use with optical fibers. These components typically involve coupling two or more optical fibers together in such a way that light signals traveling in one fiber may be transmitted either partially or completely into another fiber. To accomplish this, it is necessary to remove a portion of the reflective outer layer of the fiber, and produce a facet on an end or side of the fiber where light energy may enter and/or leave the core of the fiber. Polishing a fiber on its side and exposing the inner structures allows one to access the energy propagating in the fiber. This is usually done by polishing the fiber with a polishing lap.
Optical fibers vary in diameter from about 0.05 millimeters (50 xcexcm) to about 0.4 millimeters (400 xcexcm), and their inner structures have diameters much smaller. Since these fibers are so small and difficult to manipulate, it is very difficult to accurately polish a facet on the side of the fiber. Several methods have been employed to measure and control the depth of polishing of optical fibers. Visual inspection using microscopes has been employed for inspecting polished fibers after polishing to verify their depth of polish. See, e.g. U.S. Pat. No. 4,431,260 to Palmer.
Another method is to monitor power loss in the fiber caused by out-coupling to the polishing solution. A lubricating and cooling polishing solution is normally used when polishing an optical fiber in order to achieve a smooth, flat, polished surface which provides the desired optical properties. As the fiber is polished and the polished surface increases in size and approaches the center of the optical conductor, a signal introduced into one end of the fiber can be measured at the other end to determine the power loss which is caused by out-coupling of the signal to the polishing solution. This power loss gives a measure of the size and depth of the polished surface, and can be used to determine when to stop polishing. See e.g. U.S. Pat. No. 5,136,818 to Bramson.
Still another method involves placing a collimated light beam tangentially incident to a flat on an optical fiber while the flat is being progressively polished. A portion of the incident light from the light beam is transmitted into the optical fiber, the amount of transmitted light being a function of the surface area of the optical flat. By measuring the intensity of the light transmitted through the fiber, one can obtain a measure of the size of the flat. See e.g. U.S. Pat. No. 4,630,884 to Jubinski.
Unfortunately, some prior methods do not actually control the depth of polishing, but merely view the results of polishing after the fact. Where a polishing machine is adjusted based upon visual inspection of a polished fiber, this may not ensure acceptable or repeatable results.
It has been recognized that it would be desirable to have a reliable method for securing an optical fiber and accurately controlling the depth of polishing when the surface of the fiber is polished with a polishing lap. It is also recognized as desirable to have a simple and effective method for measuring the depth of polishing on a microscopic scale.
The present invention advantageously provides a system for polishing an optical fiber, comprising: an optical fiber disposed upon a substrate, the fiber having an outwardly curved portion; an electrical conductor disposed over the apex of the outward curve of the optical fiber; and a voltage source connected to the electrical conductor. A polishing lap of a polishing machine is brought to bear upon and grind away the electrical conductor, such that the electrical conductor is severed at approximately the same moment the polishing lap contacts the apex of the curve of the optical fiber. A detector detects when the DC voltage in the conductor suddenly changes, indicating severance of the electrical conductor, which indicates that the polishing lap has just reached the top surface of the optical fiber. This position is called the reference point. The polishing lap is then caused to progressively polish the fiber until a desired depth is reached relative to the reference point, the depth of polishing being detected with an optical probe. The invention also provides a method of polishing an optical fiber using the described system.
In accordance with a more detailed aspect of the present invention, the substrate comprises a piece of fused silica, in which one or more grooves are formed in which the optical fiber and the electrical conductor are cemented. One of the grooves is formed with an outwardly curved bottom surface, such that when the optical fiber is placed therein it will assume the desired outwardly curved configuration in preparation for polishing.
In accordance with another more detailed aspect of the present invention, the detector may comprise a digital interface electrically connected to the electrical conductor, and configured for detecting a voltage change therein, and a computer connected to the digital interface and the polishing lap, and configured for receiving signals from the digital interface, and for controlling the functioning of the polishing lap. Based upon the detection of severance of the electrical conductor, the polishing lap may be caused to polish to a predetermined desired depth, whereupon the computer may cause the polishing lap to stop polishing.
In accordance with another more detailed aspect of the present invention, the electrical conductor may comprise a copper wire which is placed over the apex of the outward curve of the optical fiber. Alternatively, the electrical conductor may comprise a stripe of conductive paint which is applied over the apex of the curve of the optical fiber, and electrically connected to the detector.
Additional features and advantages of the invention will be apparent from the detailed description which follows, taken in conjunction with the accompanying drawings, which together illustrate, by way of example, features of the invention.

Optical fiber polishing system with depth reference

Evans and Sutherland Computer Corporation


There is provided a substrate mounting method of bringing a substrate close to a mounting table to mount the substrate on the mounting table by reducing a protrusion amount of a plurality of projections configured to protrude from a substrate-mounting surface of the mounting table and to support the substrate, the protrusion amount being defined to protrude from the substrate-mounting surface. The method includes: after at least a portion of the substrate is brought into contact with the substrate-mounting surface, halting an operation of bringing the substrate close to the mounting table; and after the halting the operation of bringing the substrate close to the mounting table, resuming the operation of bringing the substrate close to the mounting table.

There has been known a substrate processing apparatus in which a semiconductor wafer (hereinafter, simply referred to as "wafer") as a substrate is accommodated in a chamber and desired processes such as a film-forming process or a plasma process is performed with respect to the wafer using a process gas introduced into the chamber or plasma generated inside the chamber. In such a substrate processing apparatus, in order to perform the desired processed on the wafer, the wafer is mounted on a susceptor as a stage disposed inside the chamber.
It is necessary to mount the wafer at a predetermined position on a wafer-mounting surface (hereinafter, simply referred to as "mounting surface") of the susceptor. There may be a case where the wafer thus mounted is misaligned from the predetermined position on the mounting surface. In this case, for example, when a thermal CVD (chemical vapor deposition) process or ALD (atomic layer deposition) process as the film-forming process is performed on the wafer, the wafer is misaligned from a heater incorporated in the susceptor so that the heater fails to uniformly heat the wafer, thereby causing the thickness of a film formed on the wafer to be non-uniform. Furthermore, for example, when an etching process as the plasma process is performed on the wafer, an impedance deviation caused by the misalignment of the wafer occurs at an edge portion of the wafer. This makes the thickness of a sheath formed on a surface of the wafer non-uniform, which makes the etched amount in each portion of the wafer non-uniform.
To address this, there has been proposed a technique in which a pocket composed of a recess having a diameter slightly larger than that of the wafer is installed in the mounting surface, and projections for positioning the wafer are formed at a side surface of the pocket. When the wafer is received in the pocket, the wafer descends along a tapered surface formed in each of the projections so that the wafer is received at a proper position inside the pocket.
In general, however, when a wafer is mounted on a susceptor, the wafer is first delivered from a transfer arm to a plurality of lift pins formed to protrude upwardly from a mounting surface of the susceptor. The transfer arm is withdrawn from a chamber, and subsequently, the lift pins descend or the susceptor ascends to mount the wafer on the susceptor.
However, when the wafer is mounted on the susceptor, there may be a case where the wafer does not come into an uniform contact with the mounting surface and only a portion thereof is in contact with the mounting surface. In this case, there is a problem that even if the pocket is formed in the mounting surface, a drag force generated from the mounting surface is exerted on the wafer at a slight angle with respect to a vertical direction of the wafer and a component of the drag force in a direction parallel to the wafer is exerted on the wafer as a moving force so that the wafer may be misaligned from the predetermined position on the mounting surface of the susceptor. In particular, if the wafer has a larger diameter, an increase in a contact area between the wafer and the mounting surface also involves an increase in the drag force and ultimately the component thereof, so that there may be concern that the misalignment of the wafer becomes remarkable.

Substrate mounting method and substrate mounting device


An end element (10) comprises one comb-shaped portion (12) having fingers extending in the passageways between the ribs (13) of an endless conveyor (11) for identifying a surface at the upper part thereof which is substantially the extension of the transfer surface at the end of the conveyor. The end element (10) further comprises a second portion (14) following the first one, which is lowered and is designed to receive, by removable fixing, the slide elements (16, 22) forming the substantial extension of the surface defined by the fingers. The slide elements can be either a roller element (16) or a dragging element (22).

In the field of endless conveyors, conveyors are known that are formed with pivotally mounted links having a plurality of ribs at the upper part thereof, which are longitudinal to the movement direction of the conveyor and define the resting surface for the items carried thereon. At the outgoing end of the conveyor, end elements are present which consist of fixed fingers to be inserted between the link ribs in order to create an extension of the resting surface of the conveyor capable of receiving the carried items. The outgoing items are then heaped up against each other by sliding on the fixed fingers and the following surface forming an extension thereof.
In order to reduce shocks and side thrusts on the outgoing items at the conveyor end, conveyors have also been proposed in which the end elements consist of dragging fingers followed by rollers for facilitating the sliding of items collected by said fingers. However the mounting of said elements provided with dragging fingers alone or with rollers as well is not modular, which means that it is rather difficult to pass from one arrangement to the other depending for example on the goods to be carried, as the various elements are not readily interchangeable. In addition, as it is necessary to provide completely different elements for the above two solutions, costs are higher and storage problems arise.
Essentially, it has not been hitherto possible to use the same base elements for achieving outgoing ends provided with rollers or with a mere sliding surface, through simple assembling operations.


A process for extruding a section or the like from a billet, in which a billet is introduced into the bore of a container and, by an extrusion stem, is fed in the direction of extrusion into a shape-forming cross-sectional opening in a die. The billet material is pressed into a central inlet in the die and the resultant ductile mass fed outwards at an angle to the direction of extrusion through a plurality of channels to the shape-forming cross-section. The main load is applied by the extrusion force acting outside the central inlet and the shape-forming region and is preferably diverted outside the shape-forming region to the supporting die parts.

1. Field of the Invention
The invention relates to a process for extruding a hollow section or the like from a billet which is introduced into the bore of a container and, by means of an extrusion stem, is fed in the direction of extrusion into a shape-forming cross-sectional opening in a die. Furthermore, the invention also relates to a device which is specially suited for that purpose.
2. Discussion of the Prior Art
During extrusion, a material which is in a ductile state--in the case of metals this includes materials such as non-ferrous metals, sintered metals or steel but in particular material in the form of an aluminium alloy--viz., a heated cast billet or rolled bar of material, is pressed in the direction of extrusion by an extrusion stem--or in the case of hydrostatic extrusion, by means of a fluid--out of a container through one or more shape-forming openings in a die. In the case of direct or forward extrusion the stem moves in the direction of the die opening, in the same direction as the resultant section. In indirect or backward extrusion the material is moved in the direction counter to that of the stem, through a die which is mounted on the hollow stem.
To produce hollow sections, so called hollow dies with a die plate are employed in the extrusion process, an example of this is described in DE 24 46 308 Al. The die plate is integrated in a part of the mandrel to provide the outer contour of the resultant section. In that case, in order to shape the inner contour, a mandrel--in the case of multi-chamber sections a plurality of mandrels--is arranged such that the mandrel projects into the die plate and beyond the shape-forming region. In such a process the ductile material is guided over inlets and into the extrusion tool in such a manner that the strands from the individual inlets flow together again under mandrel support arms--into a welding chamber--where they are welded together again. As the extrusion process proceeds further, the material or the aluminium alloy flows past the mandrel and the die opening, thereby adopting the prescribed hollow section shape. The inlets are always situated outside around the hollow space or spaces in the section; the aluminium alloy is introduced into the shape-forming region of the die from the outside, in particular via a plurality of inlets. If in the case of multi-chamber dies the inner regions of the hollow section can not be adequately supplied with metal from outside, then additional feeding inlets are provided in the inner part of the hollow section.
The main supply inlets are always situated around the outer contour of the hollow space in the section.
The size of hollow section that can be manufactured i.e. its maximum diameter of circumscribing circle is limited therefore by the diameter of the container and the size of the inlets arranged around the hollow space as well as the strength of the above mentioned mandrel support arms.
In general, the maximum section size that can be manufactured on conventional extrusion presses is limited by the size of the extrusion press, the diameter of the container used and the strength of the extrusion die. The above mentioned patent DE 24 46 308 and patent DE 28 12 690 of the applicant are concerned with the dimensioning of the latter for hollow section manufacture using large mandrel surface area. Also, the quality of the extrusion weld is influenced by the outer edge zone of the extrusion billet flowing into the outer inlets in the extrusion die, with the result that it is possibly necessary to machine away the outer skin of the billet before use. Furthermore, the shaping capacity and the service life of the extrusion tool are considerably reduced by the high load on the mandrel surface, by creep resulting from this high load, and by bending.
Attention must also be given to the fact that metal billets, especially billets of aluminium alloys, are covered with contaminants--for example residual lubricant--and with an oxide layer. In particular, oxide particles on the end and outer surface of the ingot may be extremely detrimental with respect to the structure of the section; the resultant zone of contaminating inclusions in the section is relatively long--depending on the shape of the section and the extrusion speed. Consequently, with increasing quality requirements, manufacturers are forced to scrap increasingly longer lengths of section. The result is diminished output and lower cost efficiency due to diminishing yield of section length.

Process for extruding a hollow section or the like from a billet and a device for that purpose


Methods and systems for the destruction of one or more PFCs in a gas stream are provided. The gas stream can come from semiconductor processing, for example. The PFCs in the gas stream are reacted with steam in the presence of a catalyst to fragment the PFCs into other compounds that are readily removed from the gas stream. The catalyst comprises gallium, and can additionally comprise zirconium oxide. The gas stream can also be pre-treated prior to reacting the PFCs with steam to remove substances that could be deleterious to the catalyst.

1. Field of the Invention
The present invention relates generally to the field of semiconductor manufacturing and more particularly to methods for removing perfluorinated compounds from waste gases produced by semiconductor manufacturing processes.
2. Description of the Prior Art
Perfluorinated compounds (PFCs) comprise a class of molecules characterized by one or more carbon atoms with one or more fluorine atoms that may additionally include atoms of hydrogen and/or oxygen. PFCs are typically gases under ordinary conditions. Exemplary PFC gases include CF4, C2F5H, C2F2H4, CF3H, C2F6, C3F8, C4F8, and C4F8O. PFCs have been found to be damaging to the environment and are recognized as a contributing factor to greenhouse warming. Unfortunately, many manufacturing processes, and particularly semiconductor manufacturing processes, rely on various PFCs and adequate replacements have not been identified, so preventing these PFCs from entering the atmosphere has become a manufacturing imperative.
Abating PFCs, however, is very difficult in that they do not readily absorb, burn, or adsorb. Nevertheless, one existing method burns PFCs with a very high temperature methane flame. This method has several drawbacks, however. First, achieving the required temperature consumes a large flow of methane and pure oxygen. This is both expensive and produces a large quantity of carbon dioxide, another greenhouse gas. In addition, this method is not very effective for removing certain PFCs such as carbon tetrafluoride, commonly used in semiconductor manufacturing.
Another method for PFC abatement routes the PFCs through a plasma device. One problem is that maintaining a plasma requires sophisticated technicians. Another is that the devices are prone to fail, especially where the flow vacillates or where there is heavy fouling in the discharge stream.
A third method for abating PFCs employs a catalyst to catalyze a decomposition reaction. There are a number of challenges in developing a robust and sustainable catalytic abatement system, however. One challenge is that the catalyst must be effective in promoting the decomposition of PFCs that are very stable and typically not very reactive. Second, the system must protect the catalyst from poisoning and fouling from other compounds in the stream such as acids, halogen gases, and particulates. Finally, the catalyst, and the substrate that supports the catalyst, must be capable of withstanding very high temperatures required to activate the decomposition reaction and must also be resistant to the acid gases formed by the PFC decomposition.
Consequently, there is a need for methods that effectively and economically treat the discharges from semiconductor manufacturing lines to prevent the release of PFCs and that comply with international treaties on greenhouse gases.

Methods and sytems for the destruction of perfluorinated compounds


In a sense amp/latch, the reset/sense phase of the sense amp/latch is separated into two separately controllable operations. By separating the reset/sense phase into two separately controllable operations, the parameters associated with optimization (speed and/or completeness of reset vs. larger gain during sensing) are substantially independent of each other and therefore do not conflict with each other. The separation of the reset/sense phase into two separately controllable operations is accomplished by setting a load impedance of the sense amp/latch to a first level during a reset phase, to a second level during a sensing phase, and to a third level during a latching phase.

Analog comparators are fundamental building blocks of analog-to-digital converters (ADC's). Analog comparators often consist of two circuit blocks: a differential amplifier that amplifies the difference between a reference voltage and an analog input voltage, and a sense amplifier/regenerative latch (sense amp/latch). The sense amp/latch senses the amplified difference between the reference voltage and the analog input voltage and converts that difference into a digital 1 or a 0, based on whether the amplified voltage difference is positive or negative. FIG. 1A illustrates an example of a prior art comparator 100. Comparator 100 includes differential amplifier 102 and sense amp/latch 104. An input voltage V.sub.in and a reference voltage V.sub.ref are compared by comparator 100, and complementary outputs Q and Q are produced to indicate which input (V.sub.in or V.sub.ref) is higher.
A commonly used topology for a sense amp/latch 104 is shown in FIG. 1B. In FIG. 1B, transistors M.sub.IP and M.sub.IN comprise an input differential pair that accepts the positive (V.sub.P) and negative (V.sub.N) voltage outputs, respectively, from the amplifier 102 shown in FIG. 1A. Transistors M1 through M4 comprise a cross-coupled inverter pair that creates regenerative feedback in a well-known manner when device MS is opened and device MP is closed. The circuit of FIG. 1B accepts a differential input and produces a differential output. Optimally M.sub.IP, M3 and M1 should be matched in terms of their physical and electrical characteristics to their counterparts on the other half of the circuit (M.sub.IN, M4 and M2).
The conventional sense amp/latch 104 has two phases of operation: a combined reset/sense phase (a negative feedback mode) and a latching phase (a positive feedback mode). A representative scheme for driving a comparator that uses the sense amp/regenerative latch of FIG. 1B is shown in FIG. 2. Throughout this application and the accompanying drawing figures, the terms Q and Q, QR and QR, LATCH and LATCH, SENSE and SENSE, and the like are digital complements of each other, e.g., when LATCH is a digital 1, LATCH is a digital 0 (and vice versa).
Referring to FIGS. 1B and 2, during the combined reset/sense phase LATCH is high, device MS is closed, and device MP is opened; as a result, transistors M3 and M4 are electrically isolated from the power supply (V.sub.DD) and device MS brings nodes N1 and N2 substantially close to their common-mode voltage level (which is equal to the average gate-source voltages of M1 and M2) from their previous voltages (e.g., previous logic states) quickly. The combination of MS, M1 and M2 forms a differential load to the differential pair M.sub.IP and M.sub.IN, and the sense amp/latch 104 behaves like a differential amplifier in this mode. Thus, given enough time, nodes N2 and N1 develop a voltage between them of A* (V.sub.P -V.sub.N) where A is the gain of sense amp/latch 104 when it is behaving like a differential amplifier.
FIG. 3 shows an equivalent circuit to the circuit of FIG. 1B when it is operating in the latching phase. During the latching phase, LATCH is low, device MP is closed, and device MS is opened. As a consequence, the sources of devices M3 and M4 are electrically connected to the power supply (V.sub.DD) via device MP and the combination of transistors M1 through M4 operate as two back-to-back connected inverters and enable positive regenerative feedback (see FIG. 1B). The positive feedback causes the voltages on nodes N1 and N2 to change rapidly in opposite directions until the voltage on node N1 gets close to the supply rail (V.sub.DD) and the voltage on node N2 gets close to the ground rail, or vice versa, depending on the initial voltages on node N1 and node N2.
In the circuit of FIG. 1B, the single device MS affects both the reset and sensing operation of the combined reset/sense phase, and the optimization of device MS is important for a fast reset and latch operation. However, the sizing of device MS is determined by two conflicting requirements: the conductance of device MS needs to be large enough to reset the circuit quickly, so that previous latched decisions will have no influence on the current decision (no memory), yet small enough such that large voltage gain from the input differential signal (V.sub.P -V.sub.N) to the differential signal of nodes N2 and N1 (V.sub.N2 -V.sub.N1) occurs. Larger gain during the sensing operation provides a larger output to the latch; this results in faster latching and a smaller required input voltage to overcome the latch output offset. This is accomplished by selecting a size and control terminal voltage for device MS such that the conductance imposed by MS barely overcomes the negative conductance imposed by devices M1 and M2, so that the small signal conductance (inverse of the load resistance) formed substantially by the combination of M1, M2, and MS is small and positive. The two conflicting requirements (fast reset and large gain) limit the speed with which reset and latching can be performed for the circuit shown in FIG. 1B.

Method and apparatus for separately controlling the sensing and reset phases of a sense amp/regenerative latch


A garment having integrated prosthetic breasts is disclosed. The garment includes an inner front layer, a middle component which includes at least one, and ideally two prosthetic breast members. The prosthetics are lightweight so that no elastic across the torso is needed. An outer front layer covers the middle component. The middle component is formed of a mesh layer which is sewn to the inner front layer only at the neckline and arms, and has an open bottom edge. The prosthetic breast members are attached to the mesh layer and provide shaping for mastectomy patients or other individuals having a need or desire for natural looking shaping.

Field of the Invention
The present invention relates to garments having integrated prosthetic breasts, and more particularly, to a garment having prosthetic breasts which can be comfortably worn by double mastectomy patients and is suitably worn as an outer layer.
Background
It is known that bilateral mastectomy survivors have a psychological need for at least a temporary replacement of the breasts. Prosthetic breasts have been provided and used in the past and various garments of wearing apparel have been provided to accommodate the wearing of these items. Such garments are generally provided with pockets to receive the prosthetic breast or breasts so that the wearer, when wearing the garment, will appear to the casual observer to be unaffected by the surgical process.
Such garments are important to the mental well-being of the patient after undergoing such a traumatic operation. One such garment commonly used for this purpose is a pocketed bra, with artificial breast or prosthesis-receiving pockets. Unfortunately, because of the scarring left from bilateral mastectomy surgery as well as scarring from removal of lymph nodes, wearing a bra can be quite uncomfortable for the survivor. Mastectomy scars across the chest along the bra band and extending under the arms can be quite sensitive and painful for the survivor.
Additionally, many bilateral mastectomy survivors also have had a lymphadenectomy (removal of lymph nodes), which can impede the flow of lymphatic fluid, putting the survivor at high risk for lymphedema. Lymphedema can occur spontaneously, resulting in swelling in the chest and/or arms, and which is not curable. Wearing a pocketed bra that is tight or restrictive at the bra band is not only uncomfortable atop the surgical scars, but it also puts the survivor at greater risk for lymphedema.
Another garment commonly used for this purpose is a pocketed camisole. Camisole-like garments are designed with artificial breast or prosthesis-receiving pockets constructed on the inside of the garment by use of a built-in shelf bra. Again, because of the bilateral mastectomy scar running along the chest and extending under the arms, as well as the scarred area left by the lymphadenectomy, the built-in shelf bra can be very uncomfortable and at times painful.
Furthermore, prosthetics that are to be worn in the pockets of the bra or camisole are quite heavy, some weighing as much as one pound each. Wearing heavy prosthetics can be uncomfortable for the mastectomy survivor as the extra weight on the bra straps cause the straps to be tight and restrictive, putting the survivor at higher risk for lymphedema. Also, the heavy prosthetics can lead to neck and shoulder pain because of the weight.
Such conventional garments are often fabricated to resemble undergarments or similar wearing apparel. These garments are not suitable for use as outer layers of clothing.
While various garments having pockets for prosthetic breasts have been proposed, there remains a need for a garment which provides at least one prosthetic breast which produces a natural look and alleviates the above problems, among other features and advantages.

Garment having integrated prosthetic breasts


Provided is an exchange system accommodating an ISDN circuit as a line wire, in which a channel of the line wire is capable of being selected by an operation performed at a connected telephone. If, in a state where the ISDN circuit has been selected by the connected telephone, a terminating request which has designated the channel in the selected state is received and this terminating request is answered, the selected state on the side of the connected telephone is cancelled. As a result, the operator on the transmitting side can be informed of the fact that the transmitting operation has been interrupted. Further, by denying the received terminating request which has designated the channel in the selected state, a situation in which a transmission from the selected channel can no longer be made is eliminated. Moreover, by performing control in such a manner that the terminating request is answered using another channel when the terminating request which has designated the channel of the ISDN circuit in the selected state is received, a situation in which a transmission from the selected line wire can no longer be made is eliminated. Performing such control improves the operability of the exchange system.

This invention relates to an telephone apparatus in which an external channel is capable of being selected and acquired.
When a terminating request signal is received in a conventional exchange system in which an ISDN circuit is accommodated as a line wire, even though the circuit which has received the terminating request signal may be in a state reserved for acquisition, processing is executed in exactly the same way as when the circuit is not in the acquired state.
By way of example, in a case where an ISDN circuit is acquired and a transmitting operation is performed in an exchange system accommodating the ISDN as a line wire, first the user reserves one of the information channels B1, B2 of the ISDN circuit and then enters dialing information. When the entry of all dialing information ends, the main apparatus sends a transmit-request signal, which has designated a reserved information channel, and executes transmission processing.
In a case where a terminating request signal has been received from the ISDN circuit, a response is made depending upon the actual state of use of the B channel designated by the terminating request signal received.
However, if, in the example of the prior art described above, a terminating request signal which has designated the B1 channel is detected from the ISDN circuit while the user is in the course of entering dialing information from an extension telephone upon having reserved the B1 channel of the ISDN circuit, the B1 channel will not yet be in a reserved state. Consequently, a response will be made to the terminating request without any notification whatsoever being given to the user. As a result, the user, who has reserved the B1 channel and performed the transmitting operation, is likely to become confused because a transmission cannot actually be made despite the fact that the proper operation has been carried out.
In other words, even though the user believes that he has acquired the circuit, a response is made to the terminating request signal. Therefore, even if the person who has reserved acquisition of the circuit subsequently performs a transmission operation, another individual will be using the reserved circuit and it will be impossible to make the transmission. This can cause the user to become confused.
For example, if, when the acquired line wire is the B1 channel from among the three channels (the two B channels and the D channel) of the ISDN circuit, a terminating request signal which has designated the B1 channel is received and a response is made to this signal, a transmission can no longer be made over the acquired line wire at the terminal connected to the extension. This can cause great confusion in terms of operation.

Telephone apparatus for invalidating incoming call signals during dialing


A composite molded article comprising a layer 5 made of a synthetic resin on which is laminated a surface material 1 having a construction such that wood veneers 3 and 4 are laminated on the surfaces of a metal sheet 2. A method for molding a composite molded article comprises the steps of: arranging, in a metal mold 7 for molding, a surface material 1 which has a construction such that wood veneers 3 and 4 are laminated on each surface of a metal sheet 2; and molding a synthetic resin 5 on a backside of the surface material 1 to integrate the surface material 1 with the synthetic resin 5.

The present invention relates to composite molded articles composed of a wood veneer and a synthetic resin molded product and a method for manufacturing the same.
Synthetic resin molded products having grain pattern have been used widely in interiors of cars, furniture, electric devices.
The following have been hitherto been provided as the composite molded articles having a grain pattern
(1) Those produced by an insertion molding method in which a surface material backed with sliced veneer, wood veneer, plywood, unwoven fabric or the like is placed in a metal mold for injection molding and a synthetic resin is injected onto the backside thereof.
(2) Those produced by subjecting a synthetic resin molded product to surface treating as by sanding, chlorination or the like to increase adhesiveness, coating an adhesive, and pressing thereon the above-described surface material.
The composite molded articles described in (1) and (2) above have a good designability. However, the composite molded articles tend to give rise to rejected products which have caused cracks in the wood veneer or the like that is present on its surface when they have complicated shapes. In order to avoid this, attempts have been made to prefabricating surface materials as by vacuum molding prior to use. However, this countermeasure has been ineffective because the wood veneer or the like causes cracks in the step of the prefabricating.
In particular, those produced by using an adhesive as described in (2) above tend to suffer from the occurrence of protrusion of the adhesive, stain, slipping out upon the bonding or the like. Also, they have a defect that it takes a long time to set the adhesive upon the production.
Furthermore, when surface finishing is conducted by buffing after coating the surface of the composite molded articles, the synthetic resin provided on the backside softens at the interface between it and the surface material due to frictional heat upon the buffing, thus forming minute depressions and protrusions on the surface of the molded surface. Therefore, buffing cannot be adopted for the surface finishing of the composite molded articles described in (a) and (2) above, and mirror surface finishing by spraying up or matt finishing has had to be adopted.


A cover provided for covering a bladed rotor during a testing operation. The cover has a face plate of solid sheet like material having a centrally positioned orifice through which air is drawn by the action of part of blade adjacent to orifice. The remaining part of the blades is in a stalled condition and therefore relatively unloaded. The power required to turn the rotor is therefore reduced in comparison to that required if the cover was not present making testing easier. The cover also acts as a safety shroud preventing personnel coming into contact with the blades as they rotate and containing the rotor in the event of its disintegration.

This invention relates to a cover for use in the testing of turbine equipment having a bladed rotor, in particular, in the testing of ram air turbines in situ on aircraft.
Ram air turbines conventionally comprise a main body which is attached to an arm and deployed, when required, by an actuator. The main body includes a bladed rotor including at least two blades, and a hydraulic pump which in normal operating conditions is powered by the rotation of the bladed rotor.
Conventionally such ram air turbines are ground tested by powering the hydraulic pump so that it acts as a hydraulic motor and thereby driving the bladed rotor. In order to appropriately test the ram air turbine it is necessary to drive it at its normal operational speed, typically in the region of 4000-6000 r.p.m.
As civilian aircraft have developed and grown in size, the power requirement and therefore the size of the bladed rotor on the ram air turbine has correspondingly grown. The power input required to drive the ram air turbine under test is very large and has dramatically increased as the size of the ram air turbine has increased.
It has now reached the stage where the power input requirement for ground testing has become a problem.
The present invention is concerned with reducing the power input requirement under testing of turbine equipment having a bladed rotor.


A new Poinsettia plant named ‘SYEP22432’ particularly distinguished by the bright red flower color, relatively large inflorescences with bracts a little upright directed, dark green foliage, early flowering response, and medium to strong vigor with good branching.

The present invention comprises a new Poinsettia, botanically known as Euphorbia pulcherrima, and hereinafter referred to by the variety name 'SYEP22432'.
'SYEP22432' is a product of a planned breeding program. The new cultivar has bright red flower color, relatively large inflorescences with bracts a little upright directed, dark green foliage, early flowering response, and medium to strong vigor with good branching.
'SYEP22432' originated from a hybridization made in the summer of 2003 in a controlled breeding environment in Hillscheid, Germany. The seed was sown in February 2004. The first act of asexual reproduction was accomplished in July 2004, when the shoot tip of each seedling plant was propagated.
The female parent was the proprietary plant designated '# 892', unpatented, with deep bluish red bract color, larger dark green leaves, upright and vigorous habit, and mid-season flowering response.
The male parent of 'SYEP22432' was the proprietary plant designated as 'Fispoin 7776' with large red bracts, dark green foliage with moderate lobes and about medium sized plant habit with relatively upright directed stems.
'SYEP22432' was selected as one flowering plant within the progeny of the stated cross in December 2004 in a controlled environment in Hillscheid, Germany. In April 2005, additional shoot tips were cut and grafted on rootstocks of the variety 'Maren', in order to improve the branching ability. Shoot tip cuttings from the successfully grafted stems were rooted in the summer of 2006 and cultivated for the first trial through the fall and winter of 2006 in a greenhouse in Hillscheid, Germany.


A system is provided for benchmarking a progressive combinatorial solver. The system may initialize a parametric model collector, and perform a plurality of parametric trials associated with respective numbers of sub-part iterations of the progressive combinatorial solver. For each of the plurality of parametric trials, the system may initialize a statistical data collector. The system may perform a plurality of randomized executions of the progressive combinatorial solver, and add data including metric values for respective solutions of the executions to the statistical data collector. The system may then determine statistical parameter(s) of data in the statistical data collector, and add data including an indication of the respective number of sub-part iterations, a cost of finding the metric values for the respective solutions, and the statistical parameters of the trial to the parametric data collector. And the system may determine a best-fit model from data in the parametric data collector.

It is well recognized that the construction or manufacture of any building, machine or equipment, generally referred to as a project, requires the collective performance of a number of individual operations or tasks for successful completion. Resources are required, as example, personnel, trained to accomplish the task, capital equipment and other resources, supplies and component parts, which need to be procured or built. Each task requires a finite time, determined by past experience, for completion. And precedence must be followed, in that some tasks typically must be completed before other tasks in the project may begin.
Prudence requires planning and, particularly, formulation of a schedule that defines the "who," "when," "where" and "how" that is necessary for completion of the project in an orderly and efficient manner. In earlier eras, the foreman or manufacturing engineer possessed the experience, training and intellect to arrange the tasks required by the project in mind and specify which persons were to carry out the tasks, the resources and supplies required, and other necessary details. That person could also provide a reasonable estimate of the time of completion as allowed prediction of a delivery date.
As modern factory projects attained greater complexity, schedules required better definition and were more scientifically defined by persons, often now referred to as industrial engineers. With essentially pen, ink and calculator, such persons were able to search through the requirements and present the paper documents defining the tasks and the resources associated with them and to arrange the order of (sequence) tasks for completion, creating timelines of individual tasks and chronological order of the tasks commencement and completion, namely, produce a project schedule. As projects became more complex still, those scheduling techniques often proved inefficient and, while less than perfect, necessarily sufficed until the advent of automated calculating machinery, such as modern scheduling systems.
To construct a modern aircraft involves many thousands of individual tasks, a vast number of technicians and assemblers, and a large amount of resources. To prepare a schedule for such a project would likely overwhelm the genius of any person working with pen, paper and calculator and would require an inordinate amount of time for one person or even a group of people to schedule to completion with minimal errors. One should not expect that the definition of a schedule to construct an aircraft should require preparation time that exceeds the construction time of an aircraft, disregarding the realism which necessitates redefining the schedule when tasks are not completed on time as originally planned, as for example due to acts of force majeure, such as electrical failure or flood.
Further compounding the difficulty of preparing a schedule for a complex project, in the modern competitive industrial world, resources including personnel and equipment are often held to a minimum and must be allocated. Little excess personnel or equipment is available to a manufacturer. Excess resources are expensive to maintain and, if carried idle by the manufacturer for too long, results ultimately in financial collapse attributed to inefficiency. Thus, the usefulness of a schedule as an industrial tool and the benefit of efficient scheduling is well understood.
A number of scheduling systems and sequencing systems are information systems for solving complex combinatorial problems, and are often used in industry to manage the allocation of resources and personnel amongst various projects. In computational complexity theory, combinatorial optimization problems are frequently classified as "NP-hard," and in real-world applications it is impossible to calculate a truly optimal solution to an NP-hard combinatorial problem using practical quantities of computational resources for practical periods of time.
Mathematicians and computer scientists have developed various approaches for finding good solutions (as opposed to singularly-optimal solutions) for combinatorial problems such as resource-constrained project scheduling (RCPS) and the traveling salesman problem (TSP), and such approaches may frequently be applied to more than one form of combinatorial problem. A number of differing implementations of such known solution approaches have been developed for various types of industries, types of users, types of computer hardware and the like. Consequently, the marketplace for such information systems (often termed "combinatorial solvers") includes a range of competing options that have varying features, capabilities, and/or underlying solution approaches, and prospective purchasers face a need to evaluate at least a subset of those competing options prior to making a decision to use one of them.
The "quality" of a solution to a combinatorial problem may be measured in a number of different manners, and its quality may be related to the "cost" of formulating the respective solution. In scheduling a multitask project, for example, one measure of schedule quality may be the duration between start of the first scheduled task and completion (finish) of the last scheduled task, sometimes referred to as "span time" or "cycle time." One example measure of schedule cost may be the time required to complete the process of formulating a schedule, that is, for the computer to execute the algorithms and process the entered task data to generate and display the schedule, often referred to as the "execution time."
Scheduling systems, and more generally combinatorial solvers, are not created equal and vary widely in quality. Many scheduling systems either use simple methods that have low cost (e.g., low execution time), but produce schedules with inferior quality (e.g., high cycle time), or use methods that produce schedules of higher quality, but at an undesirably-high cost. These systems may, for example, produce tasks that require too much time for project completion, or require too much time to formulate the schedule.
Only in rare instances can the solution approach of any scheduling system or combinatorial solver be mathematically proven to reliably find a singularly optimal solution, so that by and large those seeking to compare the performance of solvers must benchmark candidates against one or more trial scenarios. However, benchmarking these scheduling systems or combinatorial solvers presents some unique challenges. It may therefore be desirable to have a system and method that addresses these challenges, and improves upon existing practices.

Benchmarking progressive systems for solving combinatorial problems


Methods and apparatus for providing a memory array fabrication process that concurrently forms memory array elements and peripheral circuitry. The invention relates to a method for fabricating memory arrays using a process that concurrently forms memory array elements and peripheral circuitry and results in a reduction in pitch.

This invention relates to memory array fabrication.
Memory arrays are typically implemented on an integrated circuit device. Examples of these devices include Mask ROM, Flash, EPROM, DRAM, FeRAM, MRAM, and NROM.
Memory arrays generally include one or more memory array elements, which are structures that store data, typically in the form of one or more high or low values. A register of one or more flip-flops is one example of a memory array element.
In some instances, a memory array element is a memory cell. Memory cells of a memory array are typically arranged in a pattern. In one type of pattern, memory cells are arranged to form a word line. The distance between adjacent word lines, usually called the "pitch," is usually uniform for a given memory array. In some instances, pitch can be measured on a space-to-space basis instead of on a line-to-line basis, where space refers to the area between adjacent lines.
Different memory arrays can have different pitches. A first memory array can have, for example, a first pitch that is less than a second pitch of a second memory array. For a given distance, the first memory array has more word lines than does the second memory array. Reducing the pitch of a memory array generally refers to a fabrication process in which more word lines are added to a particular area that already includes existing word lines.
Memory arrays are typically connected to peripheral circuitry, which are generally components on a memory chip that are not memory cells. Examples of peripheral circuitry include and are not limited to decoders and connections between word lines.


A current-switching method and circuit is provided for use with digital-to-analog converters (DACs) to provide improved compliance and linearity in the output current characteristic. In the current-switching circuit, an additional transistor that is set to a permanently-on state is connected at the output port of the current-switching circuit, which can help increase the output impedance of the current-switching circuit. Moreover, the problem of simultaneous switching-off of two control transistors can be eliminated by connecting the gate of one transistor to a reference voltage whose magnitude is set between the logic-high and logic-low voltage states of the input digital signal. The current-switching method and circuit can therefore meet the requirements of 3 V working voltage with 1.2 V output compliance and the requirements of 10 bits linearity in the output current characteristic.

1. Field of the Invention
This invention relates to electronics, and more particularly, to a current-switching method and circuit for digital-to-analog converters (DACs) with improved compliance and linearity in the output current.
2. Description of Related Art
Most conventional DACs are constructed based on a current-switching architecture. Earlier current-switching circuits are designed to operate at 5 V (i.e., the high-voltage logic state of the digital input is 5 V). However, today's digital systems are typically designed to operate at 3.3 V or 3 V. Therefore, when a conventional 5 V current-switching circuit is used on a 3 V digital system, it would not meet the required 1.2 V compliance and high linearity in the output current characteristic. Two such conventional current-switching circuits are illustratively depicted in the following with reference to FIGS. 1 and 2 respectively.
FIG. 1 is a schematic circuit diagram of a first conventional current-switching circuit for DAC. As shown, this current-switching circuit is composed of three MOS transistors M1, M2, M3. The first MOS transistor M1 serves as a fixed current source. The second MOS transistor M2 has a gate G2 connected to receive a first digital input DIN, while the third MOS transistor M3 has a gate G3 connected to receive a second digital input DINB. Whether the output port T.sub.IOUT of the current-switching circuit outputs current or not is dependent on the logic combination of the first and second digital inputs DIN, DINB, This current-switching circuit can operate at 3 V (V.sub.CC =3V) and therefore can be used in conjunction with a 3 V digital system.
One drawback to the foregoing current-switching circuit, however, is that during the switching of the first and second digital inputs DIN, DINB from one logic sate to the other (either from low to high or from high to low), there exists a short period in which both of the two MOS transistors M2, M3 are switched simultaneously to the OFF state, thus leading to the undesired occurrence of a current spike in the output current IOUT. One solution to this problem is to incorporate buffer means (not shown) to the current-switching circuit. To do this, however, the overall chip size to implement the current-switching circuit will be increased.
Still one drawback to the foregoing current-switching circuit is that the linearity in the output current characteristic is poor due to the reason that MOS transistor M3, which operates in the triode region, is used at the output port of the current-switching circuit to provide the 1.2 V output compliance, which is insufficient to provide a high enough output impedance at the output port of the current-switching circuit. Therefore, the linearity in the output current characteristic is still unsatisfactory.
Another solution to the problem of the simultaneous switching-off of the two MOS transistors M2, M3 in the circuit of FIG. 1 is shown in FIG. 2. The current-switching circuit of FIG. 2 is substantially identical in circuit structure as the one shown in FIG. 1, except that the input to the gate G3 of the third MOS transistor M3 is here a fixed reference voltage VREF instead of the digital input DINB. This modification can help prevent the two MOS transistors M2, M3 from being simultaneously switched to the OFF state. However, the linearity in the output current characteristic is nonetheless unsatisfactory.

Current-switching method and circuit for digital-to-analog converters


A fully recessed unit equipment luminaire for providing emergency lighting to a path of egress. The luminaire has batteries, a battery box, a housing, a charger/emergency switching circuit mounted on a chassis, lamps, reflector assemblies, and a cover. The luminaire may be configured for either wall or ceiling mounting with the use of wall or ceiling mount lenses, respectively. Reflector assemblies supporting the lamps are rotatably engaged by the cover. Each reflector assembly has a substantially semi-frustoconical shape and intersects the lamp's conical shaped beam of light to redirect the beam into a narrow, elongated pattern. The reflector assemblies may have a plurality of planar reflecting surfaces which approximate the semi-frustoconical shape.

1. Field of the Invention
This invention relates to emergency lighting luminaires, and more particularly to self-contained unit equipment luminaires for recessed installation in a ceiling or wall.
2. Description of Prior Art
Adequate illumination of emergency egress routes from the interior of buildings is a requirement of nearly all modern building codes and standards. For instance, the National Fire Protection Association (NFPA) issues standards for emergency lighting illumination levels and uniformity ratio along the egress path.
The current NFPA Life Safety Code requires that "Emergency illumination shall be provided for a period of 1½ hours in the event of failure of normal lighting. Emergency lighting facilities shall be arranged to provide initial illumination that is no less than an average of 1 footcandle (10 lx) and a minimum at any point of 0.1 footcandle (1 lx) measured along the path of egress at floor level. Illumination levels may decline to 0.6 footcandle (6 lx) average and a minimum at any point of 0.06 footcandle (0.6 lx) at the end of the emergency lighting time duration. A maximum to minimum illumination uniformity ratio of 40 to 1 shall not be exceeded." NFPA Life Safety Code Section 5-9.2.1 One way that designers meet such standards is through the use of "unit equipment" luminaires, which generally consist of a self-contained rechargeable battery, battery charging circuitry, lamps, and circuitry for switching to battery power and illuminating the lamps upon the occurrence of an emergency condition, such as a power failure.
Traditionally, unit equipment luminaires have a housing which contains the electronic components. The luminaires typically are hung from a wall and the lamp adjusted as desired. Thus, such a unit equipment luminaire protrude into the living space of the room or corridor where they are located.
However, exposed unit equipment luminaires are not always compatible with the interior design of space. Additionally, such exposed luminaires are subject to both accidental abuse and intentional vandalism.
Emergency lighting designers have presumably attempted to address such issues with devices such as those described in U.S. Pat. Nos. 4,802,065, and 5,851,061.
For instance, U.S. Pat. No. 4,802,065 to Minter, et al., issued Jan. 31, 1989, teaches an emergency lighting fixture for mounting in a ceiling. The fixture has a drop down panel normally enclosing an opening in the ceiling. An energized solenoid or motor hold the panel in the closed position. A lamp is mounted to the drop down panel such that upon failure of a.c. power, the weight of the panel and lamp causes the panel and lamp to drop down to illuminate a path of egress. This design, while functional, has added energy, component and maintenance costs associated with the continuously energized solenoid or motor and the moving parts associated therewith. Additionally, this design will not work in a wall installation, since it must be oriented such that the weight of the panel and lamp will cause the panel to drop down.
U.S. Pat. No. 5,851,061 to Hegarty, issued Dec. 22, 1998, also teaches a recessed emergency light fixture having a hinged panel which normally covers the installation opening. Upon failure of the normal a.c. power to the fixture, a solenoid opens the panel, which has a mirrored rear surface. Illumination from a lamp within the fixture is then reflected off of the mirrored surface to light a path of egress. This design provides for mounting in either a ceiling or wall, since the panel is opened by the solenoid rather that gravity. The design has added costs due to the additional components (solenoid and linkage) and the maintenance issues associated with those moving parts. Further, efficiency of the fixture in the event of a power failure is likely reduced by the power consumed by the solenoid in holding the panel in an open position.


A light projection apparatus is provided comprising: a source of light; a switchable grating on a first substrate; and a diffractive optical element. Light is diffracted at least once by the switchable grating and is diffracted at least once by the DOE.

This invention relates to a wearable dip lay device, and more particularly to a wearable display using electrically switchable holographic optical elements.
There is a requirement for a compact see through data display capable of displaying image content ranging from symbols and alphanumeric arrays to high-resolution pixelated images. The display should be highly transparent and the displayed image content should be clearly visible when superimposed over a bright background scene. The display should provide full colour with an enhanced colour gamut for optimal data visibility and impact. A prime requirement is that the display should be as easy to wear, natural and non-distracting as possible with a form factor similar to that of ski goggles or, more desirably, sunglasses. The eye relief and pupil should be big enough to avoid image loss during head movement even for demanding military and sports activities. The image generator should be compact, solid state and have low power consumption.
The above goals are not achieved by current technology. Current wearable displays only manage to deliver see through, adequate pupils, eye relief and field of view and high brightness simultaneously at the expense of cumbersome form factors. In many cases weight is distributed in the worst possible place for a wearable display, in front of the eye. The most common approach to providing see through relies on reflective or diffractive visors illuminated off axis. Microdisplays, which provide high-resolution image generators in tiny flat panels, do not necessarily help with miniaturizing wearable displays because the requirement for very high magnifications inevitably results in large diameter optics. Several ultra low form factor designs offering spectacle-like form factors are currently available but usually require aggressive trade-offs against field of view, eye relief and exit pupil.
The optical design benefits of DOEs are well known including unique and efficient form factors and the ability to encode complex optical functions such as optical power and diffusion into thin layers. Bragg gratings (also commonly termed volume phase grating or holograms), which offer the highest diffraction efficiencies, have been widely used in devices such as Head Up Displays.
An important class of diffractive optical element known as an electrically Switchable Bragg Gratings (SBG) is based on recording Bragg gratings into a polymer dispersed liquid crystal (PDLC) mixture. Typically, SBG devices are fabricated by first placing a thin film of a mixture of photopolymerizable monomers and liquid crystal material between parallel glass plates. One or both glass plates support electrodes, typically transparent indium tin oxide films, for applying an electric field across the PDLC layer. A Bragg grating is then recorded by illuminating the liquid material with two mutually coherent laser beams, which interfere to form the desired grating structure. During the recording process, the monomers polymerize and the PDLC mixture undergoes a phase separation, creating regions densely populated by liquid crystal micro-droplets, interspersed with regions of clear polymer. The alternating liquid crystal-rich and liquid crystal-depleted regions form the fringe planes of the grating. The resulting Bragg grating can exhibit very high diffraction efficiency, which may be controlled by the magnitude of the electric field applied across the PDLC layer. In the absence of an applied electric field the SBG remains in its diffracting state. When an electric field is applied to the hologram via the electrodes, the natural orientation of the LC droplets is changed thus reducing the refractive index modulation of the fringes and causing the hologram diffraction efficiency to drop to very low levels. The diffraction efficiency of the device can be adjusted, by means of the applied voltage, over a continuous range from essentially zero to near 100%. U.S. Pat. No. 5,942,157 by Sutherland et al. and U.S. Pat. No. 5,751,452 by Tanaka et al. describe monomer and liquid crystal material combinations suitable for fabricating SBG devices.
There is a requirement for a compact, lightweight wearable display providing a high brightness, high contrast information display with a high degree of transparency to external light


A projection exposure apparatus including a light source system, an optical integrator for forming a plurality of light source images, and a condenser optical system for illuminating a target illumination surface in a rectangular or circular arc pattern in a multiple manner. The optical integrator has, from a light source side, a first lens group which has a plurality of first lens element groups each consisting of a plurality of first lens elements, and a second lens group which has a plurality of second lens element groups each consisting of a plurality of second lens elements. The second lens elements are arranged in a one-to-one correspondence with the first lens elements, and dimensions of the lens section of the first and second lens element satisfy a predetermined relations.

1. Field of the Invention
The present invention relates no a projection exposure apparatus used in a lithography process in the manufacture of semiconductor elements, liquid crystal elements, and the like.
2. Related Background Art
A so-called step-and-repeat-type stepper is known as a conventional projection exposure apparatus. In this apparatus, the entire pattern of an original sheet (reticle) on which a circuit to be projected and exposed is drawn is sequentially projected and exposed onto a photosensitive substrate such as a wafer or a plate coated with a photosensitive agent for every shot through a projection exposure optical system (projection lens). This apparatus is excellent in resolving power and throughput.
In recent years, a scanning-type projection exposure apparatus has been proposed to achieve a higher throughput at a higher resolving power.
A scanning-type projection exposure apparatus is proposed in, e.g., Proc.SPIE 1088(1989) pp 424-433. In this apparatus, a reflecting reduction optical system having a circular arc image field is used to project and expose a pattern on a reticle onto a wafer.
Another scanning-type projection exposure apparatus uses a normal projection optical system (full-field-type projection optical system) having a circular image field to project and exposure a pattern on a reticle onto a wafer by a step-and-scan method. For example, Japanese Patent Laid Open No. 4-196513 proposes a method in which a rectangular (slit-like) image field whose long and short sides have different lengths is scanned. This proposed apparatus can ensure a higher resolving power while realizing a higher throughput by a wide exposure field. Therefore, this apparatus has received a great deal of attention as a promising exposure apparatus succeeding the above-described step-and-repeat-type exposure apparatus.

Optical integrator and projection exposure apparatus using the same