According to certain embodiments, a method for laser cutting treatment of a human eye comprises: determining position information of a pupil center of the eye in relation to a point of minimal corneal thickness in an undeformed state of the eye; locating the point of minimal corneal thickness in a flattened state of the eye, in which the eye is deformed by contact with a patient adapter of a laser device; and aligning a pulse firing pattern for laser radiation pulses of the laser device, based on a position of the located point of minimal corneal thickness and the determined position information. In embodiments, the pulse firing pattern represents, for example, a lenticular or doughnut-shaped intracorneal tissue volume which is to be removed from the cornea of the eye.

The present disclosure relates in general to the field of machining of an eye using pulsed laser radiation, and relates in particular to a technique for aligning a pulse firing pattern relative to an eye of a patient.
Methods for laser-assisted surgery on the human eye include many different types of surgery, and have the objective of improving vision, treating eye disease, or both. Conventional known types of surgery include, for example, laser-assisted in situ keratomileusis (LASIK), corneal transplantation (keratoplasty), intracorneal lenticule extraction, implantation of intracorneal ring segments, implantation of corneal inlays, and the like, to name only a few. In certain forms of laser-assisted ophthalmic surgery, it is necessary to make one or more incisions in the eye to be treated. Such incisions may be made in human eye tissue using ultrashort pulsed laser radiation, wherein a beam focus of the laser radiation is guided in time and space according to a pulse firing pattern, so that the radiation pulses arrive at the eye at appropriate locations for achieving a desired cutting geometry in the eye which is represented by the pulse firing pattern.
For the success of a surgical procedure, it must be ensured that each incision is made at the correct location in the tissue of the eye. The pulse firing pattern should therefore be defined with reference to the position of one or more eye features, which may be located at the time of the surgical procedure by means of suitable imaging technology. Examples of eye features include a pupil center, an iris structure, the limbus, and a sclera structure (such as a blood vessel) of the eye.
Conventional cutting laser systems which are used for making an incision in a human eye are typically equipped with a patient adapter (patient interface) which is used for immobilizing the eye to be treated opposite from an opening at which the laser radiation is output from the laser radiation system. This radiation output opening may be situated, for example, on an output side of a focusing objective of the laser system. The patient adapter includes an applanation plate or some other contact element that provides a contact surface for the eye. When the eye is pressed against the contact element and the outer surface of the eye fits closely against the contact surface of the contact element, the cornea of the eye undergoes deformation. When the patient adapter has, for example, an applanation plate with a planar contact surface, the cornea is deformed in a flattened state.

Centering technique for a cutting laser for refractive ophthalmic surgery


A device for repairing a heart valve comprises a medical device (10). The medical device (10) comprises an element in order to downsize the annulus upon insertion and allow the leaflets to open and close properly. The medical device (10) provides a temporary or permanent downsizing of the heart valve. An annuloplasty implant and/or heart valve prosthesis is in embodiments releasably attached to the medical device for insertion to the annulus and permanent fixation of the latter in a desired shape.

Diseased mitral and tricuspid valves frequently need replacement or repair of various reasons. The mitral and tricuspid valve leaflets or supporting chordae may degenerate and weaken or the annulus may dilate leading to valve leak (valve insufficiency). The chordae tendinae, or heart strings, in short called the chordae, are cord-like tendons that connect the papillary muscles to the tricuspid valve and the mitral valve in the heart. The leaflets and chordae may become calcified and thickened rendering them stenotic (obstructing forward flow). Finally, the valve relies on insertion of the chordae inside the ventricle. If the ventricle changes in shape, the valve support may become non-functional and the valve may leak.
During heart valve replacement, sutures are spaced around the annulus (the point where the valve leaflet attaches to the heart) and then the sutures are attached to a prosthetic valve, see FIG. 3. The valve is lowered into position and when the sutures are tied, the valve is fastened to the annulus. The surgeon may remove all or part of the valve leaflets before inserting the prosthetic valve.
In heart valve repair, a defective valve is left in situ and surgical procedures are performed to restore its function. Mitral and tricuspid valve repair is traditionally performed with a suture technique, e.g. by performing the so-called Parachute procedure, see FIG. 2.
Heart valve repair and heart valve replacement may be performed in combination, e.g. a dilated leaflet may be partially surgically removed (e.g. leaving the chordae intact) and a heart valve replacement prosthetic valve may be affixed to the surgically modified anatomical heart valve in order to restore heart valve function.
Frequently an annuloplasty ring is used to fixate an altered size of the annulus and/or support the annulus. The annuloplasty ring serves to keep the annulus in a reduced diameter and to allow the existing leaflets to oppose each other normally again, in order to restore correct valve function. Sutures are used to attach the prosthetic annuloplasty ring to the annulus of the heart valve and to assist in plicating the annulus. Before permanently attaching the annulosplasty ring to the annulus, the latter is prepared to the desired shape by other means than the annulosplasty ring. This preparation of the valve in order to achieve a correct geometrical arrangement of the anatomical entities of a heart valve, and a restored correct function thereof, is hitherto performed manually by a surgeon. This part of the procedure is also called downsizing, which is explained in more detail below. Furthermore, manual downsizing may be dependent on a line of sight or suitable imaging modalities.
In addition, the form of the valve leaflets may be corrected by surgical techniques, e.g. tiny sutures, during the same surgical procedure. In general, the annuloplasty ring must be sutured to the valve annulus at the same time as a desired form of the latter is obtained at the end of the procedure. This simultaneous downsizing of the valve annulus and, which is time consuming and tedious. This means that two highly integrated processes are involved in the Parachute procedure, namely a) downsizing, perhaps including reshaping, of a dilated valve and b) a subsequent fixation of an annuloplasty ring. Thus, the Parachute procedure is highly dependent on the experience of the performing surgeon, who has to be able to think sterically, as it is necessary to firstly place the sutures on the annulus and then through the support ring.
A result of such a procedure may differ greatly and even provide a non-desired result, very much depending on the skills of the surgeon performing the procedure. If the ring is severely malpositioned, then the stitches must be removed and the ring repositioned relative to the valve annulus during restitching. In other cases, a less than optimum annuloplasty may be tolerated by the surgeon rather than lengthening the time of the surgery to restitch the ring.
During heart surgery, a premium is placed on reducing the amount of time used to replace or repair valves as the heart is frequently arrested and without perfusion. It would therefore be very useful to have a device and method to efficiently facilitate repair of heart valves or to facilitate attachment of a valve prosthesis into the mitral or tricuspid valve position.
There is a need of improving this downsizing. It would be advantageous to be less dependent on the human factor. Moreover, the surgeons would welcome a device and method facilitating this crucial operation.
In WO2006/054930, which is hereby incorporated by reference in its entirety for all purposes, a device for repairing a heart valve is disclosed that comprises an implantation instrument. The implantation instrument comprises a first support ring, and a second support ring connected to the first support ring to form a coiled configuration. The first support ring is configured to abut one side of the valve and the second support ring is configured to abut an opposite side of the valve to thereby trap a portion of the valve tissue there between. The device further comprises an annuloplasty implant adapted to be attached to the heart valve annulus in order to reshape the annulus and allow the leaflets to open and close properly. The annuloplasty implant is connected to the implantation instrument for insertion to the annulus. The implantation instrument disclosed in WO2006/054930 provides already a major improvement of the previously known devices and methods. However, the devices and methods as disclosed in WO2006/054930 may further be improved as a primary re-shaping for defining a working position of the insertion tool still has to be performed by the surgeon using a forceps instrument. Similar devices, suffering from analogous drawbacks are disclosed in e.g. US 2004/0167620, US 2005/0149178, and WO 2007/030063.
US2007/0038293 discloses methods, devices, and systems for performing endovascular repair of atrioventricular and other cardiac valves in the heart. Regurgitation of an atrioventricular valve, particularly a mitral valve, can be repaired by modifying a tissue structure selected from the valve leaflets, the valve annulus, the valve chordae, and the papillary muscles. These structures may be modified by suturing, stapling, snaring, or shortening, using interventional tools which are introduced to a heart chamber. The tissue structures can be temporarily modified prior to permanent modification. For example, opposed valve leaflets may be temporarily grasped and held into position prior to permanent attachment. However, the disclosure of US2007/0038293 does only provide local modification of certain portions of a heart valve, e.g. by grasping one or more leaflets for bringing these into a position suitable for fixation of a clip to the leaflets. Hence, the motion of the valve leaflets is only partly and temporary immobilized.
In WO 2006/093656 devices and methods are disclosed for aiding valve annulosplasty. The disclosed devices comprise a radiopaque deformable reference ring facilitating imaging based navigation of an annulosplasty procedure. However, the devices are not providing an active downsizing. Downsizing still has to be performed in a separate manner.
Therefore, there is a need to for devices and/or methods that further facilitate heart valve repair and/or replacement, e.g. by providing a suitable annuloplasty preparation of a cardiac valve area.
Thus, there is a need to provide a tool, medical device, or method that provides for a reliable and more easily accomplished valve repair or replacement. Facilitated, or less surgically demanding insertion of an annuloplasty implant and/or artificial heart valve would be advantageous. Hence, an improved tool, medical device or method would be advantageous and in particular a tool or method allowing for increased flexibility, user-friendliness, cost-effectiveness, and/or patient safety would be advantageous.

Cardiac valve downsizing device and method


In an image sensing apparatus such as a digital camera, digital video camera, or the like, if a photography mode which requires photography with priority on precision is selected, photography is executed in accordance with precision priority setting even when the photography setting is so made as to put a higher priority on speed. This makes it possible to prevent the user's intention from disagreeing with setting as to whether a higher priority is put on speed or precision in photography.

Conventionally, there is commercially available an image sensing apparatus such as an electronic camera which records, plays back, and communicates still images or moving images using a memory card with a memory device as a recording medium. Such an apparatus reads out a charge signal from an image sensing element, A/D converts the signal, and executes image processing, thereby implementing distance measurement/photometry processing.
Instantaneity (strong in grabbing shutter chances, i.e., ready for photography whenever the user wants) and high quality photographed images (high exposure accuracy and focusing accuracy) are generally demanded for photography.
In a conventional image sensing apparatus, when the shutter is to be depressed (fully pressed) in photography, AF exposure control, AF control, exposure control, white balance control, and the like are executed after the shutter is pressed halfway. Then, the shutter is opened to execute photography. This causes a release time lag and causes a problem with instantaneity in photography.
A pre-emission operation in red-eye-effect relaxation processing is also known to impair the instantaneity. For example, Japanese Patent Laid Open No. 6 265987 proposes a camera which executes red-eye-effect relaxation processing in normal photography and skips red-eye-effect relaxation processing if the shutter depression speed is higher than a predetermined value.
There is also proposed a method of simplifying an arithmetic operation to increase the instantaneity and an image sensing apparatus in which the user can selectively set a speed (instantaneity) priority photography mode and a precision priority photography mode. This apparatus is manually set, and is not always set to a photography mode which meets the photography needs when the user actually executes photography. For this reason, in some cases, the user's intention does not coincide with the set photography mode. The mode needs to be confirmed before each photography operation, and this is cumbersome.

Image sensing apparatus and control method therefor


A communication apparatus (1) is a primary station for communicating with a secondary station, and includes: a first protocol control section (111) for transmitting, at a time when communication connection is to be established with the secondary station, (i) a station discovery command with which to confirm a presence of the secondary station, and (ii) a first connect request command, after the station discovery command is transmitted, so as to carry out connection processing; second protocol control means (112) for transmitting, at a time when communication connection is to be established with the secondary station, a second connect request command so as to carry out connection processing; and a protocol switching section (113) for (i) causing the first protocol control section (111) to initially transmit the station discovery command, and in a case where a response to the station discovery command has not been received after an elapse of a predetermined time since the station discovery command was transmitted, (ii) causing the second protocol control section (112) to transmit the second connect request command.

Infrared methods such as IrDA (Infrared Data Association) are available as an interface for connecting a mobile phone with a television, a printer, or a PC (Personal Computer) (see Non Patent Literature 1 through 5).
IrDA and like infrared communications schemes are directional; if there is an obstacle between the communication apparatuses, data cannot be transferred. With a line of sight between the apparatuses, however, a high speed data transfer is possible. IrDA standards include Very Fast IR (VFIR) with a maximum transfer rate of 16 Mbps, Fast IR (FIR) with a maximum transfer rate of 4 Mbps, and Serial IR (SIR) with a transfer rate of up to 115.2 (inclusive of 115.2 kbps). Currently available IrDA standards on the market are those with a maximum transfer rate of up to 4 Mbps.
An IrDA connection routine for the IrLAP layer will be described in reference to FIG. 6 illustrates a signal sequence for the establishment of an IrLAP layer connection as specified by IrDA.
A primary station, or device, is a station which initiates a discovery of an opposite station, that is, which requests an establishment of a data transfer state, and is a station which transmits a station discovery command (XID (exchange station identification) command). A secondary station, or device, is a station which receives the request, and is a station which transmits a station discovery response (XID response) to the station discovery command. A request or instruction transmitted from the primary station to the secondary station is termed as a command. A reply to the command, transmitted the other way from the secondary station to the primary station, is termed as a response.
The XID command is a command with which to discover a secondary station candidate within the communications range of the primary station. The numbers in parentheses are SlotNumbers in hexadecimal notation. The Slotnumbers indicate the transmission sequence of commands.
Upon receiving an XID command, the secondary station returns an XID response, informing the primary station of its presence. The primary station transmits a specified number of XID commands. The primary station then sets the SlotNumber of the last XID command to 0xFF, a number indicating that the command is the last one (XID-End).
The primary station forwards, in an SNRM (set normal response mode) command, its maximum transfer rate, maximum incoming data length, and other necessary parameters for communications to the secondary station. Receiving the command, the secondary station compares the parameters to its own settings and informs the primary station of acceptable settings in a UA response.
After establishing an IrLAP connection using IrLAP command packets, IrLMP, TinyTP, and OBEX connections are negotiated using IrLAP data packets.
An IrLMP connect request is forwarded via IrLAP data packets from the primary station to the secondary station. An IrLMP connect response is returned via IrLAP data packets from the secondary station to the primary station, establishing an IrLMP connection.
Next, a TinyTP connect request is forwarded to the secondary station via the IrLAP data packets. A TinyTP connect response is returned from the secondary station is transferred to the primary station via the IrLAP data packets, establishing a TinyTP connection.
Furthermore, an OBEX connect request is forwarded via IrLAP data packets from the primary station to the secondary station. An OBEX connect response is returned from the secondary station to the primary station, establishing an OBEX connection. That renders the stations ready for user data transfer.
For disconnection, an OBEX disconnect request and response, a TinyTP disconnect request and response, and an IrLMP disconnect request and response are exchanged via IrLAP data packets. A DISC command (IrLAP disconnect request command packet) and a UA response (IrLAP respond command packet) are then exchanged. The exchanges disconnect the primary station from the secondary station.
The IrDA connection routine above takes an extended period of time before the stations are ready for user data transfer, lowering transfer efficiency. Specifically, IrDA specifies that station discovery through sensing and using XID commands, and negotiation parameter exchange using an SNRM command and a UA response are needed before the establishing of a connection. IrDA stipulates that the transfer rate be limited to 9,600 bps during the XID-based station discovery. The rate is far lower than the user data transfer rate (4 Mbps). In addition, as mentioned above, after the IrLAP layer has been connected, the IrLMP, TinyTP, and OBEX layers need to be sequentially connected so that the stations are ready for data transfer. As such, an overhead for carrying out data transmission becomes great. Hence, the IrDA is not suitable for efficiently transmitting and receiving a large volume of data.
Accordingly, as a measure for improvement in convenience in infrared communications, a communication protocol "IrSimple" was standardized in the year 2005. This "IrSimple" reduces the time taken to establish a connection to achieve high efficiency in communications, from the issuing of a connect request to disconnecting (see Non Patent Literature 6 through 8, and Patent Literature 1). Although the IrSimple is developed from IrDA with improvements in some functionality, the IrSimple involves no communications in relation to station discovery, taking less time to establish a connection than conventional IrDA. IrSimple reduces communications time by a factor of 4 to 10 over conventional IrDA for the same volume of data.
"IrSimple" provides for two communication modes: unidirectional communications and bidirectional communications. In unidirectional communications, the connect and disconnection routines are so simplified as to be complete by carrying out just one pair of packet exchange, to reduce connect and disconnect times. The retransmission routine upon error detection in data transfer is also simplified to achieve high transfer rates.
An IrSimple connection routine for the IrLAP layer in unidirectional communications will be described in reference to FIG. 7 illustrates an IrSimple-compliant signal sequence for the establishment of an IrLAP layer connection in unidirectional communications. As shown in FIG. 7, a primary station sends an SNRM command (connect request command) without sending a station discovery command with which to confirm the presence of a secondary station. The primary station, having sent the SNRM command, starts a data transfer without waiting for a UA response (response command packet) from the secondary station. Meanwhile, having received the SNRM command, the secondary station waits for the data transfer from the primary station without returning a UA response. If the incoming SNRM command includes no data for upper layers, the secondary station may dismiss it as an illegal connect request and not enter a data transfer standby state.
Next, an IrSimple connection routine for the IrLAP layer in bidirectional communications will be described in reference to FIG. 8 illustrates an IrSimple-compliant signal sequence for the establishment of an IrLAP layer connection in bidirectional communications.
As shown in FIG. 8, the primary station sends an SNRM command (connect request command) without sending a station discovery command with which to confirm the presence of a secondary station. Having received the SNRM command, the secondary station sends a UA response (response command packet). As the primary station receives the UA response, the connecting of the LAP, LMP, SMP, and OBEX layers are all completed. That is to say, the LMP, SMP, and OBEX layers do not need to be sequentially connected after the LAP layer is connected.
The following description explains the SNRM command specified in the IrSimple protocols, with reference to FIG. 9. FIG. 9 is an explanatory view illustrating a frame containing the SNRM command.
The "A (Address) field" is a field to be used to negotiate a connection and contains a 7-bit connection address and a 1-bit C/R (Command/Response) identifier. In FIG. 8 where a pre-connection SNRM command is shown, since the connection is not established yet, the connection address is "0x7F" which indicates a broadcast address. The C/R bit is set as "1", indicating that this packet is a command. The A field in the SNRM command in FIG. 8, a combination of the address and the C/R bit, is "0xFF".
The "C (Control) field" is a control field for the packet. Since the packet is an SNRM command, the C field value is either "0x93" for bidirectional communication or "0x83" for unidirectional communication, both indicating an SNRM in unnumbered format (U format). FIG. 8 shows a sequence in bidirectional communication; therefore the C field value is "0x93".
The "Source Address" is a field indicating the address of the source device (primary station), and assumes a value other than "0" and "0xFFFFFFFF".
The "Destination device Address" is a field indicating the address of the destination device (secondary station). In FIG. 8 where a pre-connection SNRM command is shown, since the connection is not established yet, the destination device address is equal to "0xFFFFFFFF" which indicates a broadcast address.
The "Connection device Address" contains a new 7-bit connection address used after successfully establishing a connection and a 1-bit C/R bit which is always set to "0". The connection address is set to any value by the primary station.
The "Requested-QoS Parameters" is a field indicating QoS (Quality of Service) parameter values, including the transfer rate and a maximum turnaround time supported by the primary station.
The "Upper User Data" is a field describe the data used by the layers above the IrLAP layer. For example, the Upper User Data describes an SMP parameter, a CONNECT command (OBEX connect request), and the like.
The following description explains the UA response specified in the IrSimple protocols, with reference to FIG. 10. FIG. 10 is an explanatory view illustrating a UA response frame.
The "A (Address) field" contains the 7-bit address specified in the "Connection device Address" of the corresponding SNRM command. The "A field" also contains a 1-bit C/R bit which is set to "0", indicating that this packet is a response.
The "C (Control) field" is set to "0x73", an indication of a UA response in unnumbered format (U format), because this packet is a UA response packet.
The "Source device Address" is the 32-bit address determined by the secondary station and assumes a value other than "0" and "0xFFFFFFFF".
The "Destination device Address" is a field indicating the address of the destination device (primary station) which is equal to the address of the primary station communicated in the Source device Address of the corresponding SNRM command packet.
"Responsed-QoS Parameters" is a field containing QoS parameters determined from the Requested-QoS Parameters given by the primary station and the QoS parameters of the secondary station.
"Upper User Data" is a field to describe the data used by the layers above the IrLAP layer. For example, the "Upper User Data" includes SMP (upper layer) parameters and a Success response to the OBEX connect request.
A communication apparatus which strictly adheres to both the IrDA and IrSimple protocol specifics, when a connection between a communication apparatus of the secondary station is attempted, automatically switches between the protocols (see Non Patent Literature 6) in accordance with a reaction from the secondary station. That is to say, the communication apparatus connects to the secondary station based on the IrDA protocols when the secondary station responds to the IrDA protocols, and when the secondary station responds to IrSimple bidirectional communications, the secondary station connects based on the IrSimple bidirectional communications.
The following description explains a routine for the communication apparatus to switch between the IrSimple protocol and the IrDA protocol with reference to FIG. 11. FIG. 11 is a signal sequence followed when the communication apparatus switches between IrSimple and IrDA.
The primary station attempts to connect to the secondary station by repeating the routines (1) to (3) described below. The SNRM command and the XID command below are transmitted at 9,600 bps.
(1) The primary station attempts to connect based on the IrSimple protocol. Thus, the primary station transmits the SNRM command as specified in the IrSimple protocols.
(2) If the secondary station does not respond, the primary station attempts to connect based on the IrDA protocol. Thus, the primary station transmits a 1-slot XID command to discover the secondary station.
(3) If the secondary station does not respond, the primary station terminates the station discovery by transmitting an XID-End command and makes another attempt to connect based on the IrSimple protocols. Thus, the primary station transmits an SNRM command as specified in the IrSimple protocols.
A frame arrangement of the SNRM command which is transmitted in the routines (1) to (3) is the same as FIG. 9.
The secondary station which receives the packets that are successively sent thereto responds to this packet if the packet received is a legal packet specified by a protocol supported by the secondary station. That is to say, if the secondary station supports the IrSimple protocol, a UA response is returned to an SNRM command of the routine (1) or (3), and if the secondary station supports the IrDA protocol, an XID response is returned to an XID command of the routine (2). Further, if the secondary station supports both the IrSimple and IrDA protocol specifics, a stipulation in the IrSimple protocol is applied in how to respond. The IrSimple protocol stipulates that the secondary station returns no XID response frame unless it receives two XID command (SlotNumber 0x00)s (see Non Patent Literature 6). Due to this stipulation, the XID response packet is not returned straight away even if the packet of the routine (1) is missed and the packets from the routine (2) are received. As a result, such secondary station returns the UA response to the IrSimple SNRM command of the routine (3), and as a result establishes a connection based on the IrSimple protocol.
The following description explains the XID command (IrDA station discovery command) with reference to FIG. 12. FIG. 12 is an explanatory view illustrating a frame of the XID command issued in the routine (2).
The "A field" is the same as the one described above; its value is "0xFF".
The "C field" is the same as the one described above; its value is "0x3F", indicating an XID command frame.
The "format Identifier" is an extension identifier, typically equal to "0x01".
The "Source device Address" field is the same as the one described above.
The "Destination device Address" field is the same as the one described above.
The "Discovery Flags" is a field indicating the number of slots of an XID command (a number of opposite stations simultaneously searched for). In the example shown in FIG. 11, the XID command has 1 slot; the discovery flags field contains a value "0x00".
The "Slot Number" is a field indicating the current slot number. The numbers are assigned sequentially. The Slot Number of the first XID command packet in FIG. 11 is "0x00". For the XID-End command packet which is the last XID command packet, the Slot Number is "0xFF", which indicates that this packet is the last packet.
The "Version Number" is a field indicating the version number of the IrLAP. For version 1.1, the Version Number is "0x00".
The "Discovery Info" is a field that is appended only to the XID-End command packet which is the last command. This field contains any information obtained in the station discovery, including station information such as the device name of the primary station.
A signal sequence followed when the secondary station strictly adhering to the IrSimple bidirectional communications connects to the primary station strictly adhering to both the IrDA and IrSimple protocol specifics, is as similar to FIG. 8. That is to say, the primary station sends the SNRM command (connect request command) without sending a station discovery command with which to confirm the presence of the secondary station. Having received the SNRM command, the secondary station sends a UA response (response command packet). As the primary station receives the UA response, the connecting of the LAP, LMP, SMP and OBEX layers are all completed.
The SNRM command is transmitted at 9600 bps, and the UA response is transmitted at 115.2 kbps. Therefore, the primary station waits for the UA response, ready to inbound frames at 115.2 kbps, after transmitting the SNRM command.
The following description explains a connection routine for a communication apparatus which strictly adheres to both the IrDA and IrSimple protocol specifics and another communication apparatus which strictly adheres only to the IrDA protocol specifics with reference to FIG. 13. FIG. 13 is a signal sequence followed when the primary station strictly adhering to both the IrDA and IrSimple protocol specifics connects to the secondary station which strictly adheres to only the IrDA protocol specifics.
As illustrated in FIG. 13, the primary station transmits an SNRM command (connect request). The secondary station however does not respond to this packet for the following reason. A packet in which both the "A field" and the "Destination device Address" contain a broadcast address (hereinafter referred to as "broadcast packet") is not a legal packet specified in the IrDA protocol. The IrDA protocol stipulates that a device return no response to such an illegal packet (see Non Patent Literature 1).
The SNRM command issued by the primary station in FIG. 13 is a broadcast frame; the secondary station, strictly adhering to the IrDA protocol specifics, does not respond to the SNRM command.
Receiving no response to the SNRM command issued, the primary station switches to the IrDA protocols to negotiate a connection and transmits an XID (0x00) command (IrDA station discovery packet). The secondary station responds to the XID (0x00) command, and transmits an XID response.
The following description explains the XID response (IrDA station discovery response) with reference to FIG. 14. FIG. 14 is an explanatory view illustrating a frame of a XID response packet.
The "A field" is the same as the one described above. The A field is "0xFE", indicating a response packet.
The "C field" is the same as the one described above. The C field is "0x3F", indicating an XID response packet.
The "format Identifier" field is the same as the one described above; its value is "0x01".
The "Source device Address" is a field indicating the address of the source device (secondary station), and assumes a value other than "0" and "0xFFFFFFFF".
The "Destination device Address" is a field indicating the address of the destination device (primary station). In this case, the Destination device Address is equal to the address of the primary station communicated in the Source device Address of the XID command packet.
The "Discovery Flags" is a field as same as the one described above and contains the same value as the Discovery Flags in the XID command packet. For example, if the Discovery Flags of the XID command packet is "0x00", the Discovery Flags of the XID response are also "0x00".
The "Slot Number" is a field as the same as the one described above and contains the same value as the Slot Number of the corresponding XID command packet. For example, if the Slot Number of the XID command is "0x00", the response has a slot number of "0x00".
The "Version Number" is a field as same as the one described above.
The "Discovery Info" is a field as same as the one described above and contains, for example, station information such as the device name of the secondary station.
After receiving the XID response, the primary station transmits an XID-End command, thereby terminating the station discovery.
Next, the primary station transmits an SNRM command (IrDA connect request). The following description explains an IrDA SNRM command in reference to FIG. 15 is an explanatory view illustrating a frame of the SNRM command packet.
The frame arrangement is substantially the same as the one shown in FIG. 9, except that its Destination device address has the same value as the Source Device Address in the XID response packet during the station discovery. Moreover, no Upper User Data is contained.
In the SNRM command, neither the A field nor the Destination device Address contain a broadcast address. Thus, the secondary station receives this SNRM command as a legal packet specified in the IrDA protocol, and transmits a UA response.
The following description describes the UA response in reference to FIG. 16 is an explanatory view illustrating a frame of a UA response packet. The frame arrangement is substantially the same as the one shown in FIG. 10, except that no Upper User Data is contained.
The primary station receives the UA response, thereby successfully establishing an IrLAP layer connection. Subsequently, connection in the layers above the LAP layer is negotiated.
The XID command packet, XID response packet, SNRM command packet, and UA response packet are all transmitted at 9,600 bps in the station discovery and connecting based on the IrDA protocol. Therefore, after transmitting an XID command packet or an SNRM command packet, the primary station waits for an XID response packet or a UA response packet, ready to inbound packets at 9,600 bps.
As explained above, the communication apparatus which strictly adheres to both the IrDA and IrSimple protocol specifics is capable of connecting to and communicating with a secondary station which strictly adheres to the IrDA protocol specifics or the IrSimple protocol specifics.
Nevertheless, some communication apparatuses do not strictly adhere to the IrDA protocol specifics; they return an IrDA UA response when they receive a broadcast packet. Such a device will be hereinafter referred to as an illegal response sender device. The communication apparatus which strictly adheres to both the IrDA and IrSimple protocol specifics cannot communicate with the illegal response sender device.
The following description explains how a communication apparatus which strictly adheres to both the IrDA and IrSimple protocol specifics attempts to connect to an illegal response sender device with reference to FIG. 17 is signal sequence followed when a primary station, or a communication apparatus which strictly adheres to both the IrDA and IrSimple protocol specifics, attempts to connect to another station, or an illegal response sender device.
As described in FIG. 13, the primary station first sends an SNRM command (IrSimple connect request) and then waits for a UA response from the secondary station at 115.2 kbps.
The A field and the Destination device Address of the SNRM command both contain a broadcast address. Again as described earlier, secondary stations which strictly adhere to the IrDA protocol specifics regard the SNRM command as a broadcast packet and do not return a UA response. The illegal response sender device however recognizes the SNRM command as an IrDA SNRM packet in the violation of the protocols and returns a UA response at 9600 bps.
Meanwhile, the primary station is waiting for a UA response packet at 115.2 kbps, and thus fails to detect the UA response that is transmitted at 9600 bps. Due to lack of a response from the secondary station, the primary station transmits an XID command at 9600 bps as shown in FIG. 11.
On the other hand, the secondary station completed its part of the connection routine upon transmission of the UA response. Therefore, the secondary station is waiting for a next packet (i.e., a connect request packet from the layer above the LAP layer) at the negotiated rate. Therefore, the secondary station cannot detect the XID command transmitted by the primary station at 9600 bps and continues to wait for a packet.
Due to the lack of response to the XID command, the primary station transmits another SNRM command (IrSimple connect request) as shown in FIG. 11, to which the secondary station cannot respond because it is still waiting for a connect request packet from the layer above the LAP layer.
Hence, neither the primary station nor the secondary station can receive a packet transmitted from the opposite station. In due course, a timeout occurs in the stations. The connection attempt thus fails and terminates.
As described above, the communication apparatus which strictly adheres to both the IrDA and IrSimple protocol specifics may fail to communicate with the illegal response sender device.
Citation List
Non Patent Literature 1
Infrared Data Association Serial Infrared Link Access Protocol (IrLAP) Version 1.1 (Jun. 16, 1996)
Non Patent Literature 2
Infrared Data Association Serial Infrared Link Management Protocol (IrLMP) Version 1.1 (Jan. 23, 1996)
Non Patent Literature 3
Infrared Data Association 'Tiny TP': A Flow-Control Mechanism for use with IrLMP Version 1.1 (Oct. 20, 1996)
Non Patent Literature 4
Infrared Data Association Object Exchange Protocol Version 1.3 (Jan. 3, 2003)
Non Patent Literature 5
Infrared Data Association IrLAP Fast Connect (Application Note) Version 1.0 (Nov. 27, 2002)
Non Patent Literature 6
IrDA Serial Infrared Link Access Protocol Specification for IrSimple Addition Version 1.0 (Oct. 14, 2005)
Non Patent Literature 7
IrDA Serial Infrared Link Management Protocol Specification for IrSimple Addition Version 1.0 (Oct. 14, 2005)
Non Patent Literature 8
IrDA Serial Infrared Sequence Management Protocol for IrSimple Version 1.0 (Oct. 14, 2005)
Patent Literature 1
International Publication No. 2006/080330 pamphlet (published on Aug. 3, 2006)

Communication apparatus, communication method, communication circuit, mobile phone, program, and computer readable recording medium with program recorded therein


Methods are provided for studying protein-protein interactions which require posttranslational modification of one of the proteins. The interaction is detected by reconstituting the activity of a transcriptional activator. This activity is dependent on the interactions between three different proteins. These include two chimeric proteins, one of which must be posttranslationally modified by the activity of the third protein in order for the chimeric proteins to interact. One of the chimeric proteins contains a transcriptional activation domain fused to a test protein. The second chimeric protein contains a DNA-binding domain of a transcriptional activator fused to the other test protein.

Protein-protein interactions are responsible for key biological functions such as cell division and enzyme regulation and are involved, for example, in the assembly of enzyme subunits; in antigen-antibody reactions; in forming the supramolecular structures of ribosomes, filaments, and viruses; in molecular transport; and in the interaction of receptors on cell surfaces with growth factors and hormones. It is also through protein-protein interactions that oncogene expression results in neoplastic transformation. For example, some oncogenes encode protein kinases whose enzymatic activity on cellular target proteins leads to the cancerous state.
In addition to using well known biochemical techniques to study protein-protein interactions, a method for detecting protein-protein interactions using a genetic system is described in U.S. Pat. No. 5,283,173. This two hybrid genetic system is capable of detecting proteins that interact with a known protein, determining which domains of the proteins interact, and providing the genes for newly identified interacting proteins. The two hybrid system of the '173 patent detects protein-protein interactions using transcriptional activation of a reporter gene as an assay mechanism.
Transcription can be activated through the use of two functional domains of a transcription activation moiety: a domain or sequence of amino acids that recognizes and binds to a specific site or sequence of nucleotides on a target DNA, i.e. a reporter gene; and a domain (sequence of amino acids) that is capable of activating transcription of the DNA when physically associated with the DNA-binding domain and is necessary for activation of the target gene. See Keegan, et al., Science, 231, 669-704 (1986); Ma and Ptashne, Cell, 48, 847-853 (1987). The two functional domains may be derived from a single transcription activation protein. Alternatively, it has been shown that these two functions can also reside on separate proteins (McKnight et al. Proc. Natl. Acad. Sci. USA 89, 7061-7065 (1987); Curran et al. 55, 395-397 (1988). The transcription activation domains may also be derived from synthetic DNA-binding and transcription activation proteins.
Transcriptional activation has been studied, for example, using the Ga14 protein of the yeast Saccharomyces cerevisiae. The Ga14 protein is a single transcriptional activation protein required for the expression of genes encoding enzymes of galactose utilization (Johnston, Microbiol. Rev., 51,458-476 (1987). Such a system is well known. See U.S. Pat. No. 5,283,173.
A disadvantage of studying protein-protein interactions using certain host cells, such as yeast, for the two hybrid system is that interactions mediated by post-translational modifications, such as tyrosine phosphorylation, cannot be detected. Especially limiting has been the inability of such a two hybrid system to detect interactions which are dependent on specific post-translational modifications which are not employed by the host cell into which the hybrid genes have been introduced.
Accordingly, it is an object of the present invention to provide an improved genetic method for the detection of protein-protein interactions, especially those protein interactions requiring specific post-translational modifications, such as the phosphorylation of tyrosine residues which is a critical step in the signal transduction pathways of activated cell-surface receptors.
Another object of the invention is to provide the regulated expression of proteins involved in protein-protein interactions as it relates to this system.
It is a further object of the present invention to provide a method for identifying amino acid residues which are critical for protein-protein interactions to occur.
Another object of the present invention is to provide a method for the identification of novel proteins which can be post-translationally modified.
It is a further object of the present invention to provide a method for the identification of novel proteins which bind to post-translationally modified proteins.
Another object of the present invention is to provide a method of identifying novel proteins that can post-translationally modify other proteins.
It is a further object of the invention to provide a method for the identification of molecules which inhibit protein-protein interactions, as directed by proteins capable of post-translationally modifying other proteins, proteins capable of being post-translationally modified by other proteins or proteins capable of binding to post-translationally modified proteins.

Method to detect protein-protein interactions


A novel method for the measurement of the Thiele-Small small-signal parameters of a moving-coil electromagnetic transducer driver is disclosed. The technique is based on a time domain analysis of the transient response of a loudspeaker voice coil circuit to a current step of excitation. By sampling the damped sinusoidal transient generated by such an excitation, the loud-speaker parameters can be calculated from a linear predictive analysis of the recorded data.

1. Field of the Invention
The present invention relates in general to a novel method for the measurement of the Thiele-Small small signal parameters of a moving-coil electromagnetic transducer. The measurement method is based on a time domain analysis of the transient response of the loudspeaker voice coil circuit to a current step of excitation. The damped sinusoidal transient generated by such an excitation is sampled and recorded. The loudspeaker parameters are then calculated from a linear predictive analysis of the recorded data.
2. Description of the Prior Art
Fundamental to the successful low frequency design of any loudspeaker system which employs a moving-coil electromagnetic transducer is a knowledge of its Thiele-Small small-signal electroacoustic parameters. In multiway systems, such as two-way and three-way loudspeakers, the low frequency response of the upper frequency drivers (e.g., the mid-range and tweeter units) is not as important a design consideration as that of the woofer. This is because the upper frequency drivers are always crossed over to a lower frequency driver. In the case of the woofer, however, its performance determines the ultimate low frequency response of the system. Therefore, it demands a more careful electroacoustic design.
The system enclosure or box interacts with the woofer to play an important role in the low frequency performance of the system. The proper design of the enclosure for a given driver requires a knowledge of the driver small-signal parameters. With these parameters, the enclosure parameters such as volume, vent tuning frequency in the case of a vented box system, passive radiator design in the case of passive radiator system, etc., can be determined in such a way that the low frequency system response can be accurately controlled for optimum performance. The driver small-signal parameters which must be known are the free-air frequency of resonance, the electrical quality factor, the mechanical quality factor, and the equivalent volume of air which when compressed has the same mechanical spring constant as the driver suspension.
Conventional techniques for the measurement of the small-signal parameters of a driver are based on sinusoidal steady-state measurements. The equipment required to make these measurements includes an impedance bridge, oscillator, frequency counter, voltmeter, and oscilloscope. Measurements are made at three different frequencies, both in free air and with the driver mounted on a sealed box with a known volume. The parameters are calculated from the data obtained. Because the calculations can involve differences between frequencies that are closely spaced, discrepancies can result. In addition, the accuracy of the measurements can be perturbed by the voice-coil inductance which is neglected in the theory but is present in the measurements. There are accurate sinusoidal techniques which can be used to circumvent the effects of the voice-coil inductance that use series-parallel coupled coils in the voice-coil circuit and AC bridge techniques. These tests using advanced methods are difficult and time consuming and as a result are very costly to perform. Additionally, these advanced methods are difficult to automate.

Time doman measurement of moving coil loudspeaker driver parameters


A semiconductor device includes a plurality of memory cells including a first transistor and a second transistor, a reading circuit including an amplifier circuit and a switch element, and a refresh control circuit. A first channel formation region and a second channel formation region contain different materials as their respective main components. A first gate electrode is electrically connected to one of a second source electrode and a second drain electrode. The other of the second source electrode and the second drain electrode is electrically connected to one of input terminals of the amplifier circuit. An output terminal of the amplifier circuit is connected to the other of the second source electrode and the second drain electrode through the switch element. The refresh control circuit is configured to control whether the switch element is turned on or off.

1. Field of the Invention
An embodiment of the invention disclosed herein relates to a semiconductor device including a semiconductor element and a manufacturing method of the semiconductor device.
2. Description of the Related Art
Memory devices including semiconductor elements are broadly classified into two categories: volatile memory devices that lose stored data when not powered, and nonvolatile memory devices that hold stored data even when not powered.
A typical example of volatile memory devices is a dynamic random access memory (DRAM). A DRAM stores data in such a manner that a transistor included in a storage element is selected and electric charge is stored in a capacitor.
When data is read from a DRAM, electric charge in a capacitor is lost according to the above-described principle; thus, another write operation is necessary every time data is read out. Moreover, a transistor included in a memory element has leakage current (off-state current) between a source and a drain in an off state or the like and electric charge flows into or out of the transistor even if the transistor is not selected, which makes a data holding period short. For that reason, write operation (refresh operation) is necessary at short intervals, and it is difficult to sufficiently reduce power consumption. Furthermore, since stored data is lost when power supply stops, another memory device utilizing a magnetic material or an optical material is needed in order to hold the data for a long time.
Another example of volatile memory devices is a static random access memory (SRAM). An SRAM holds stored data by using a circuit such as a flip-flop and thus does not need refresh operation, which is an advantage over a DRAM. However, cost per storage capacity is high because a circuit such as a flip-flop is used. Moreover, as in a DRAM, stored data in an SRAM is lost when power supply stops.
A typical example of nonvolatile memory devices is a flash memory. A flash memory includes a floating gate between a gate electrode and a channel formation region in a transistor and stores data by holding charge in the floating gate. Therefore, a flash memory has advantages in that the data holding period is extremely long (semi-permanent) and refresh operation which is necessary to volatile memory devices is not needed (e.g., see Patent Document 1).
However, in a flash memory, there is a problem in that a memory element becomes unable to function after a large number of repeated write operations because a gate insulating layer included in the memory element deteriorates due to tunneling current generated in the write operations. In order to alleviate this problem, a method in which the number of write operations is equalized among memory elements can be employed, for example, but a complex peripheral circuit is needed to realize this method. Moreover, even when such a method is employed, the fundamental problem of lifetime cannot be resolved. In other words, a flash memory is not suitable for applications in which data is frequently rewritten.
In addition, high voltage is necessary in order to inject charge into the floating gate or removing the charge. Furthermore, a circuit for that purpose is required. Moreover, it takes a relatively long time to inject or remove electric charge, and it is not easy to increase the speed of writing or erasing data.

Semiconductor Energy Laboratory Co., Ltd.


A method of making a three-dimensional object from fibers includes attaching a mold made at least in part of elastomeric material to a porous support. The mold comprises a first mold member defining at least one channel in fluid communication with the porous support. Each channel has within it at least one second mold member. A mixture of fibers and fluid carrier is poured onto the mold. Thereafter, a pressure differential is created across the mold to create a flow of the mixture toward the porous support via the second mold members. This flow causes the fluid carrier to pass through the porous support, thus depositing the fibers within the recessed parts of the second mold members in the mold. Thereafter, the mold is compressed sufficiently to deform the mold and to provide uniform, normal pressure to the fibers which have been deposited in the second mold members.

Generally, fiber structures of the kind used for cushioning and packaging (for example, pulp packaging, peanuts, egg crates and the like) are formed from cellulose fibers using a wet forming process. The product is formed on a solid, rigid mold that is covered with a screen material on all of its surfaces. The strength of the resultant structure is due to entanglement of the fibers and hydrogen bonding. Some strength-enhancing chemical or resin may also be added.
The strength resulting from fiber entanglement depends upon the type and length of the fibers used. Bonding of cellulosic fibers depends on fiber-to-fiber contact, which is increased with increased compression of the fiber mat. Current industry use of compression of pulp-molded articles ranges from no compression to compression by mating male and female rigid molds that have close tolerances for higher consolidation of the fibers.
If the structure has any three-dimensional parts, the sides of the structure must have a draft angle, so that the compression force of the mating molds has a component force on the sides of the mold normal to the structure being formed. If the sides of the mold are substantially vertical, the mating part is not able to apply a compression force component normal to sides of the structure.
The structural performance of a pulp-molded article can be enhanced by fiber addition or by increased bonding. Increased bonding may allow for a reduction of fiber content for a given performance need. U.S. Pat. No. 4,702,870, issued to Setterholm et al. for a "Method and Apparatus for Forming Three Dimensional Structural Components from Wood Fiber" and U.S. Pat. No. 5,277,584, issued to Hunt for "Methods and Apparatus for Making Grids from Fibers" illustrate several methods and devices for forming products from the materials herein addressed.
It is an object of the invention to provide a method and apparatus for making three-dimensional structures from fibers for various structural uses.
It is another object of the invention to provide a method and apparatus for making three-dimensional structures from fibers which utilizes compressive forces normal to the surfaces of the object being formed as a result of the composition of the mold.
It is still another object of the invention to provide a method and apparatus for molding three-dimensional objects from fibers which permits the fabrication of such objects in a wide variety of structural configurations.
It is still another object of the invention to provide a method and apparatus for manufacturing three-dimensional objects from fibers where the objects consist of a plurality of interconnected ribs without integral surfaces covering the ribs.
It is a further object of the invention to provide three-dimensional objects manufactured from fibers where the objects consist of a plurality of interconnected ribs without integral surfaces covering the ribs.
It is a still further object of the invention to provide a method and apparatus for making a three-dimensional object from fibers permitting the cost effective use of both cellulosic and non-cellulosic fibers to create such three-dimensional objects.

Apparatus for molding three-dimensional objects

The United States of America as represented by the Secretary of Agriculture


A vehicle includes a continuously-variable transmission (CVT) that is supplied with power from an input. The CVT also includes a pair of pulleys, at least one of which having a variator that is configured to translate linearly along an axis of the input. A mechanical lock is configured to selectively lock the input with the variator such that the input and the variator rotate in unison. This allows the hydraulic pressure supplied to the CVT to reduce while the variator and the input remain locked.

Continuously-variable transmissions (CVTs) are known in the art. CVTs include a primary pulley that provides a driving force to a belt, which transfers power to a secondary pulley, which drives an output of the transmission. Each pulley includes a pair of plates with a variable distance therebetween. When the distance increases and decreases, the operational characteristics (e.g., speed) of the belt changes, thereby altering the effective input-to-output gear ratio of the CVT. Movement of these plates is possible due to a supply of hydraulic pressure.

Continuous variable transmission with mechanical lock


In accordance with one embodiment, a display strap for displaying a first article of clothing (e.g., a tie) with a second article of clothing (e.g., a hanky, etc.) includes an elongated strap body having a first end and an opposing second end along with a top edge and an opposing bottom edge. The body has a plurality of score lines to permit the elongated body to be folded and the first end be drawn toward the second end. The body further has a locking slit formed therein proximate the first end and a locking tab formed at the second end for reception within the locking slit to form a continuous, folded strap body that captures the first and second articles of clothing for holding thereof at a first location. The display strap has a flag portion that extends upwardly from the top edge of the body and includes an opening formed therein for receiving a fastener that couples the first and second articles of clothing together at a second location that is spaced from the first location.

Retailers are discovering that combinations of articles of clothing packaged together better meet the needs of a certain class of shoppers. When displaying and selling complementary articles of clothing, retailers assist their clients with a fashion choice that can be time consuming. Furthermore, when suitably coordinated, a combination of complementary articles of clothing can make a more attractive display item for sale than if displayed individually.
For example, besides a shirt and tie combination, complementary articles of clothing can include a tie and hanky or pocketsquare; a tie and jewelry accessories, such as cufflinks, etc.
It would therefore be desirable to provide a display article that assists the retailer in the display of two complementary articles of clothing and permits a single purchase at the retail site and likewise prevents a consumer from freely separating articles of clothing meant to be combined.

Retail display strap for attaching and displaying two articles of clothing


Disclosed is an ethylene polymer foam structure having enhanced processing and physical properties. The foam structure comprises an ethylenic polymer material and a blowing agent of isobutane and 1,1-difluoroethane. Further disclosed is a process for making the foam structure.

This invention relates to an ethylene polymer foam structure having enhanced processability and physical properties. The invention further relates to a process for making the foam structure.
Isobutane has become a preferred blowing agent for making ethylene polymer foam structures because of its zero ozone depletion potential and relatively high degree of processability and foamability, which can result in end products having generally desirable physical properties. A concern with using isobutane is that it is a volatile organic compound, which may be subject to environmental regulation. Another concern is that under some conditions, sometimes incomplete or inconsistent compressive recovery can be encountered in end product foam structures at certain critical points in time in the product life cycle.
A means of reducing the volatile organic content of a blowing agent containing isobutane is to replace part of the isobutane with a hydrofluorocarbon, which may not cause the same measure of environmental concern. A suitable hydrofluorocarbon is 1,1-difluoroethane (HFC-152a).
Replacing isobutane with HFC-152a can present processing and extrusion problems because of the relatively low solubility of HFC-152a in melts of ethylene polymers. The processing and extrusion problems would be expected to take the form of a relatively narrow range or "window" of foaming temperatures or less than desirable physical properties in the end product. Undesirable physical properties can include poor skin quality, small cell size, high foam density, and small cross-section.
Foam structures blown with a blowing agent comprised entirely of isobutane sometimes do-not fully recover after compression, which the foam structures are often subjected to during die cutting. After compression and release from compression, foam structures blown entirely with isobutane recover a substantial proportion (i.e. about 88-95 percent by volume or thickness) of their initial volume prior to compression, but may then shrink to some degree (i.e. about 3-10 percent by volume or thickness) for an extended period of time before expanding and re-gaining a substantial proportion of the initial volume. This temporary shrinkage is a problem for cushion packaging end users or customers because the shrinkage typically occurs while the foam structure is being used as cushion packaging. The shrinkage results in an undesirable loose fit between the packaging material and the article or articles being packaged.
It would be desirable to have an ethylene polymer foam structure and process for making wherein the use of isobutane as a blowing agent is reduced. It would further be desirable to make such a foam structure under a relatively wide range of processing conditions with desirable foam physical properties. It would further be desirable to make such a foam structure with improved compressive recovery.

Ethylene polymer foams blown with isobutane and 1,1-difluoroethane and a process for making


Methods and apparatus are provided for designing and laying out multi-layer circuit substrates, such as multi-layer PCBs. Dynamic vias are provided on intermediate PCB layers. Each dynamic via has features that adjust based on the trace layout of the corresponding intermediate layer. In particular, each dynamic via has a second radius R2 if the via is not connected to any trace on the corresponding intermediate layer. If a trace is connected to a dynamic via, the via radius changes from the second radius R2 to a first radius R1, where R1 is greater than R2.

This invention pertains to apparatus and methods for designing and laying out multi-layer circuit substrates, such as multi-layer printed circuit boards ("PCBs").
PCBs are widely used as circuit substrates for mechanically mounting electrical components and for electrically interconnecting the mounted electrical components. PCBs typically include one or more layers of an insulating substrate (such as fiberglass). During PCB manufacture, a metal layer is deposited on a surface of a substrate layer, and the metal layer is then chemically etched to form a pattern of conductors (or "traces") on the substrate surface. Multiple substrate/metal layers may be sandwiched together to form a multi-layer PCB.
To interconnect traces between the layers, and to provide a means for attaching electrical components to the PCB, "vias" are formed by drilling holes through the various metal and substrate layers. The holes are typically cylindrically shaped channels formed perpendicular to the PCB substrate surface. The holes are subsequently filled with an electrically conducting material (e.g., solder) to form a low resistance electrical connection between the various layers along the length of the via. A via typically includes a cylindrically-shaped pad on each of the PCB's top and bottom layers and one or more intermediate layers.
PCBs typically are designed using specialized computer aided design ("CAD") software programs, such as Allegro PCB Design, by Cadence Design Systems, San Jose, Calif. PCB CAD software programs typically include layout tools for specifying the placement and routing of the various traces, electrical  components and vias on a PCB. The layout tools typically perform design rule verification functions to assure that the layout complies with design rules specifying various parameters such as minimum trace-to-trace separations and other parameters. Once a PCB board layout is complete, the PCB CAD software program may be used to generate a "Gerber file" that defines the PCB layout definition. A PCB manufacturer may then use the Gerber file to fabricate PCBs in accordance with the design specified in the Gerber file.
PCB CAD software programs typically include a "via definition" that defines the physical dimensions of the vias that are used in the PCB design. The programs typically utilize a single static via definition for each PCB design—that is, all vias have the exact same geometrical dimensions. Further, the via definition typically includes a pad on each layer of the PCB, including each intermediate layer. Thus, PCB CAD software programs typically generate PCB designs that specify vias having pads on the top and bottom layers and on all intermediate layers.
PCB board manufacturers, however, prefer to remove intermediate pads that are not connected to any traces. In particular, removing such unused intermediate pads minimizes cost and increases reliability by decreasing stray capacitance and reducing manufacturing defects such as short circuits. Some manufacturers use software that scans Gerber files to identify such unused intermediate pads, and then modifies the files to eliminate the unused intermediate pads. Also, some PCB CAD software programs include an option that removes unused intermediate pads during the process used to generate the Gerber file.
Such "pad stripping" techniques, however, occur only after PCB design is complete. Thus, during the design process, the PCB layout is implemented assuming that all vias include pads on all layers, including all intermediate layers. In this regard, the design rule verification functions enforce design rules (such as the minimum separation between a trace and an adjacent via) based on a pre-pad-stripping geometry. Thus, even if a designer knows that a particular via pad on a particular intermediate layer will be subsequently stripped away during the manufacturing process (and thus a larger area could be used for laying out traces), the PCB CAD software programs prohibit the designer from utilizing such unused real estate. As a result, previously known PCB CAD software programs do not permit efficient PCB layout.

Methods and apparatus for layout of multi-layer circuit substrates


In a semiconductor laser comprising an active layer epitaxially formed on a semiconductor substrate and at least a current limiting layer which defines a current injection region of a stripe shape,. the improvement is that said substrate has a terrace part on its principal face, PA1 said active layer has two parallel bending parts defining a stripe shape active region facing said current injection region inbetween and PA1 said stripe shape active region is disposed with a specified angle to said principal face.

1. Field of Technology
The present invention relates to an improvement in a semiconductor laser and method of making the same. Especially the present invention relates to a semiconductor laser made by epitaxial growth method.
2. Prior Art
Hitherto various proposals on configuration and methods of making are made concerning semiconductor lasers for stable fundamental transverse mode operation. In general, the fundamental transverse operation can be obtained by making width of stripe shaped active region narrow thereby confining only a lowest mode light in the narrow stripe shaped active region.
A most typical example of conventional fundamental transverse mode operation has a buried stripe layers structure as shown in FIG. 1. Making of the conventional laser of FIG. 1 is as follows:
Firstly, the following layers are subsequently formed by epitaxial growth method
on a substrate 1 of n.sup.+ -GaAs: PA0 on a substrate 8 of n.sup.+ -GaAs: PA0 on a substrate 15 of n.sup.+ -GaAs:
a first clad layer 2 of n-Ga.sub.1-x Al.sub.x As, PA1 an active layer 3 of n-GaAs, PA1 a second clad layer 4 of p-Ga.sub.1-x Al.sub.x As and PA1 an electrode contacting layer 5 of p.sup.+ -GaAs. PA1 a specially shaped first clad layer 9 of n-Ga.sub.1-x Al.sub.x As, PA1 an active layer 10 of n-GaAs, PA1 a second clad layer 11 of p-Ga.sub.1-x Al.sub.x As, and PA1 an electrode contacting layer 12 of p.sup.+ -GaAs. The shape of the first clad layer 9 is, as shown in FIG. 2, has a stripe shaped thicker part 9' at the central part and a thinner part 9", 9" on both sides of the thicker part 9'. PA1 a first clad layer 16 of N-Ga.sub.1-x Al.sub.x As, and PA1 an active layer 17 of non-doped GaAs. PA1 a second clad layer 18 of p-Ga.sub.1-x Al.sub.x As and PA1 an electrode contacting layer 19 of p.sup.+ -GaAs.
Secondly, an SiO.sub.2 film (not shown) is formed on all the face of the electrode contacting layer 5, then the SiO.sub.2 film is etched by known photo-etching method retaining a stripe shape part, and then by utilizing the stripe shape SiO.sub.2 film as an etching mask, the abovementioned epitaxial growth layers 2 to 5 are mesa-etched to form stripe shaped part.
Thirdly, into the mesa-etched spaces on both sides of the stripe shaped part are formed filled-in layers 6,6 having a high specific resistance and wider energy gap than those of layers 2 to 5 of the stripe shape part.
Then on the electrode contacting layer 5 and the filled-in layers 6,6 is formed an ohmic electrode 7, and another ohmic electrode 7 is formed on the bottom face of the substrate 1.
The abovementioned conventional laser of FIG. 1 has the following shortcomings.
A first shortcoming is that there is a possibility of contamination and/or oxidation of side faces of the stripe part during the while between the step of mesa-etching to form the stripe part and the subsequent step of forming filled-in layers 6,6. Especially, since the side faces of the active layer 3 serves as side faces of a cavity of laser, such contamination and/or oxidation of the side faces of the stripe part is likely to form dark spots of the laser and causes a deterioration of the laser.
Second shortcoming is that, since the SiO.sub.2 film is retained on the stripe part during a high temperature processing step for the forming of the filled-in layers 6, a difference of thermal coefficient between the SiO.sub.2 film and the p.sup.+ -GaAs layer 5 produces a stress of the active layer 3, thereby forming a cause of deterioration.
Third shortcoming is that such an impurity as Fe or Cr contained in the filled-in layers 6,6 for giving the layer a deep energy level is likely to diffuse into the side faces of the active layer 3, thereby deteriorating the characteristics.
Fourth shortcoming is poor heat radiation due to filling of high resistivity layer 6,6 which has poor heat conductivity.
Recently, some improvements are proposed in order to eliminate the abovementioned shortcomings of the conventional semiconductor laser of buried-in stripe shape active region. One example of such improved structure is shown in FIG. 2. The conventional device of FIG. 2 is made as follows:
Firstly, the following layers are sequentially formed by epitaxial growth method
Secondly, an SiO.sub.2 film 13 is formed on all the face of the electrode contacting layer 12, and then the SiO.sub.2 film 13 is etched by known photo-etching method to form a stripe shape opening 13' over the position on the stripe shape thicker part 9', thereby exposing a stripe shape part of the surface of the electrode contacting layer 12.
Thirdly, an ohmic electrode 14 is formed on the face of the SiO.sub.2 film 13 and on the exposed surface of the electrode contacting layer 12.
The conventional laser of FIG. 2 can operate a fundamental mode lasing in the part of the active layer 10 which is on the thicker part 9', since lights leaking from the side parts of the active layer 10 passes through the thinner parts 9", 9" and are absorbed in the substrate 8.
However, the abovementioned conventional laser of FIG. 2 has the shortcoming that the active region is flat, and hence, the light lased at the central part of the active layer 10 is likely to diverge in the horizontal direction of FIG. 2. Therefore, the lasing mode is distorted widthwise. Furthermore, the device of FIG. 2 has a poor heat radiation since in almost area the SiO.sub.2 film 13 is inserted between the electrode contacting layer 12 and the ohmic electrode 14.
Another prior art of FIG. 3 has been known. The device of FIG. 3 has a rib shape active layer 17 having a stripe pattern thicker part 171 at the central part and thinner parts 17',17' on both sides thereof. The conventional semiconductor laser with rib shape active layer 17 is made as follows:
Firstly, the following layers are subsequently formed by epitaxial growth method
Secondly, the thinner parts 17',17' are formed by slightly etching the active layer 17 by utilizing a stripe shape mask of known material, thereby forming the rib shape active layer 17.
Thirdly, again by the epitaxial growth method, the following layers are subsequently formed on the rib shape active layer 17:
Fourthly, an SiO.sub.2 film 20 is formed on all the face of the electrode contacting layer 19, and then, the SiO.sub.2 film 20 is etched by known photo-etching method to form a stripe shape opening 201 over the position on the stripe shape thicker part 171, thereby exposing a stripe shape part of the surface of the electrode contacting layer 19.
Fifthly, an ohmic electrode 21 is formed on the face of the SiO.sub.2 film 10 and on the exposed surface of the electrode contacting layer 19.
The conventional laser of FIG. 3 has the advantage that by means of partly thickened active layer 17, the thicker part 171 and the thinner parts 17',17' has different values of effective refractive index. Therefore, the lased light can be effectively confined in the thicker part 171, and therefore, a stable transverse mode lasing is possible.
However, the conventional laser of FIG. 3 has the shortcomings that, since the etching of the active layer 17 is made to form the thinner parts 17',17', two sequences of epitaxial growths and delicate controlling of the etching are necessary, and further that there is a considerable possibility of introducing a number of non radiative center to the interface between the surface of the active layer 17 and the second clad layer 18 during exposing and etching of the active layer 17.

Matsushita Electric Industrial Co., Ltd.


The present disclosure provides a display panel and an encapsulation component. The display panel comprises a substrate component, a display assembly, and an encapsulation component. The encapsulation component comprises a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer. The second encapsulation layer is sandwiched between the first encapsulation layer and the third encapsulation layer. The first encapsulation layer and the third encapsulation layer are made of an inorganic material. The second encapsulation layer is made of an organic material, and the second encapsulation layer comprises a plurality of organic nanoparticles in the second encapsulation layer. According to the present disclosure, water and oxygen outside of display panels are prevented from entering display panels.

Conventional organic light emitting diode (OLED) display panels include organic light-emitting materials therein, where organic light-emitting materials have to be isolated from water and oxygen.
To isolate organic light-emitting materials from water and oxygen, conventional OLED display panels are generally provided with an encapsulation component. The encapsulation component covers display assemblies of OLED display panels, and thus prevents water and oxygen outside of OLED display panels from permeating into OLED display panels and contacting organic light-emitting materials of display assemblies.
However, inventors of present patent application find that there are still some problems existing in the prior art, as described below.
Encapsulation components of conventional OLED display panels cannot satisfactorily seal display assemblies. Therefore, water and oxygen outside of OLED display panels are prone to pass through encapsulation components and enter OLED display panel, and contact organic light-emitting materials of display assemblies. This reduces lifetime of OLED display panels.
Therefore, there is a need to provide a display panel and an encapsulation component to solve the above-said problems.

Display panel and encapsulation component

WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO. LTD.


A vessel able to deploy V/STOL aircraft includes: a hull, a main deck with forward and aft exposed sections and an intermediate section comprising a tenth to half the main deck; on the forward, intermediate and perhaps aft sections a take-off runway with a ski jump; a hangar straddling the intermediate section and its runway portion and having walls supporting an upper deck on which functional items are located; pads on the forward and/or aft sections; and an aft section area where aircraft park when others launch through the hangar.

Known CTOL and STOL carriers share a common configuration: a hangar enclosed within a hull, a large flight deck on the hangar roof, take-off runway/s, landing runway/s and pad/s on that flight deck, lifts connecting the hangar and flight decks, and a superstructure off to one side of the flight deck. CTOL carriers such as the USS Nimitz have catapults, arresters and, usually, several runways, some angled. STOL carriers such as HMS Invincible usually have a single through runway serving as take-off runway, landing runway and pad; they usually also have a ski jump because in practice they only operate STOVL and VTOL aircraft. Some 1930s carriers also had an additional take-off runway located on the hangar deck before the hangar, the rear portion of this runway being enclosed under the forward part of the main flight deck. A modern version of this type up-dated with catapults, ski jumps, arresters, etc. for use by newer aircraft and an "assembly line" system within a large hangar for fast landing, servicing and relaunching of large numbers of aircraft has been disclosed in U.S. Pat. No. 4,325,317. Apart from the above vessels, another carrier is known, this being a STOVL vessel without a landing runway: a large container ship on which containers stacked before the superstructure form a flight deck with a take-off runway, a pad and a ski jump. A STOVL vessel is an adequate carrier because even STOL vessels in practice only deploy STOVL and VTOL aircraft. VTOL carriers are also known: some such as the French Jeanne d'Arc configured with a large hangar aft, a large pad atop it, and lifts connecting those decks; a carrier for V/STOL-as-VTOL aircraft with no pad but using a device developed by British Aerospace to release and recover hovering V/STOL-as-VTOL aircraft has also been proposed. Most VTOL vessels are not carriers but are other-role ships, usually small, configured in one of two ways: with a hangar on the main deck abaft the superstructure and a pad abaft the hangar; with only an aft pad. In contrast, CTOL, STOL and STOVL vessels are all large and, effectively, all carriers; this because all built or proposed have at least one of the following: a fore and aft flight deck with a superstructure beside it and therefore a wide beam; a heavy flight deck on the hangar roof and therefore a hangar of a construction sturdy enough to support it and a large hull to offset the resulting top-heaviness; a hangar enclosed in the hull and therefore a hull of wide beam; a hangar-deck with a take-off runway, that deck therefore being high above the waves; an in-line take-off runway and hangar or in-line take-off runway and superstructure and therefore a long hull; complex and/or heavy machinery like catapults, arresters and, especially, lifts. Being large and expensive, these ships have to justify their purchase by having one or more of the following that make them even larger and/or more expensive: permanent air groups as large as the ships can carry and which, because the ships are large, are quite large; full and comprehensive servicing and maintenance facilities; large fuel and weapons storage capacity; an all-weather capability and therefore a high-profile but still stable and thus large hull. This overall expense means a number of other-role ships are not built. Carriers justify their expense and this forgoing of other ships with their air groups' potency; their expense, the forgoing of other ships and this potency in turn means carriers are both unriskable and a prime target to an enemy and therefore they are either or both: armed and/or armoured and therefore even larger and more costly; provided permanently with heavily-armed escorts--making them more attractive as targets as elimination of a carrier leaves its escorts without air cover. Carriers being unriskable, such weapons, whether fitted to carriers or to escorts, are largely restricted to defense as carriers must stay as far as possible from an enemy; their air groups effectively being the sole offensive weapon. All this in effect means carriers are single-role vessels: even if as heavily armed as a cruiser, they will not undertake tasks a more expendable cruiser can undertake. A balanced carrier navy, unless it is certain it will only go to war accompanied by allies, will have at least two of these expensive ships, their expensive air groups, their escorts, and other ships for independent operations. Such a navy with CTOL carriers can overwhelm any non-carrier navy and most land-based air forces. STOL or STOVL carrier navies are superior to navies not so equipped. These are the advantages of carriers; the disadvantage is expense, an expense that cannot be reduced because vessels with a runway above a hangar or a runway before a hangar, as noted, must be large. STOL and STOVL carriers have another disadvantage: because they are small, their air groups are too small to ensure protection against land-based CTOL aircraft. Few nations can afford the balanced two-carrier navies described so most rely on fighting ship navies comprising destroyers, frigates, light frigates, corvettes and/or fast attack craft and any requisite support and assault ships. Unlike a carrier navy, such navies have no minimum size or expense. The larger ones comprise destroyers, frigates, assault and support ships, these today generally being (helicopter-deploying) VTOL vessels with a hangar and pad on the main desk as described above. The combination can be fitted to them because it is compact and unintrusive: the pad is small: the size of the air group determines the hangar's size and air groups being small, so is the hangar; the hangar supports no flight deck on its roof so the hangar is of light construction; the hangar roof, the decks below, most of the main deck and most of the air space around the ship are not intruded upon by aircraft facilities or operations so the equipment for the ships' other roles is easily fitted. Among these ships' advantages are: there is no minimum size for their air groups, indeed air groups can even be not deployed as ships with the hangar and pad are hardly more costly than ones without them; the VTOL capability need not be an all-weather or full-maintenance one so savings in vessel size and equipment are possible; fleets of VTOL destroyers and frigates can be dispersed or concentrated at will, when dispersed each vessel has its own air group, when concentrated the force has no prime target at its core and its VTOL capability is not eliminated till the last ship is sunk; no ship is unriskable and so they can be deployed forward where all their weapons can be used. The deficiency of such navies is their lack of fixed-wing aircraft. V/STOL-as-VTOL aircraft can be deployed on larger VTOL ships but the aircraft's limited range means they are not sufficiently superior to ship-launched missiles to persuade many navies to purchase them.

888 Pavee Court, 6 Soi Chumnarn-auksorn, Phahol Yothin Soi 9, Phahol Yothin Road


A reusable, sanitary and folding container includes a base, two folding sidewalls, two folding end walls and latches and hinges. The base includes slots that receive the hinge pins that allow the sidewalls and end walls to fold up and down. These hinge slots are open and provide for water or spray through them during the cleaning process of a container after it has been used. The container is formed of a resilient, but light polyurethane/fiber composite material.

At present, the food industry uses large shipping containers to move a broad range of food products across the country and around the world. These containers are large enough to hold hundreds and even thousands of pounds. The most common type of food shipping container is a single-use corrugated paper container that is moved around on a heavy wooden pallet. These containers and pallets are relatively heavy, and they are expensive and inefficient in that they may only be used a single time before disposal is required. The corrugated paper structure of these containers is not heavy-duty enough for reuse. Furthermore, the corrugated material cannot be reused for hygienic reasons because the container cannot be thoroughly washed and cleaned for reuse. Furthermore, they put a greater burden on landfills because contaminated corrugated boxes are very difficult to recycle (no one wants them because they have bacteria, E. coli, salmonella, campylobacter, etc. and they smell bad). The amount of contaminated corrugated boxes could be as high as 20% of the total volume used.
Reusable, plastic containers are known for use. However, existing containers may be too heavy for commercially economical reuse. Also, existing plastic containers have nooks and crevices and other engineering details that make them very difficult, if not virtually impossible, to reliably clean and inspect for cleanliness. Additionally, most existing plastic boxes are made of inexpensive polypropylene or polyethylene and therefore periodically plastic parts break off during use and contaminate the food product.

Folding, lightweight, hygienic, heavy-duty food shipping container


A semiconductor memory circuit comprises a plurality of memory cells each connected to a corresponding word line and a corresponding pair of digit lines. The pair of digit lines are pulled up through a pair of load transistors, respectively, and connected through a pair of gate transistors to a corresponding pair of data bus lines, respectively, which are in turn connected to a sense amplifier and pulled down through a pair of driving transistors, respectively. A voltage supply circuit is provided which includes a voltage divider circuit composed of series-connected dummy transistors having the same characteristics as those of the load, gate and driving transistors which cooperate to determine a potential on the pair of data bus lines when the pair of digit lines and the pair of data bus lines are selected. On the basis of a reference voltage generated by the voltage divider circuit, the voltage supply circuit operates to generate a voltage to be supplied to the pair of data bus lines when the pair of digit lines and the pair of data bus lines are not selected. The voltage generated by the voltage supply circuit is supplied to the pair of digit lines or the pair of data bus lines through a switch circuit which is turned on when the pair of digit lines and the pair of data bus lines are not selected.

1. Field of the invention
The present invention relates to a semiconductor memory circuit, and more specifically to a semiconductor memory circuit configured so that information stored in a memory cell connected to a selected word line and a selected pair of digit lines is transferred to a sense amplifier through a switch circuit connected to the selected pair of digit lines, and through one or several stages of data bus lines for collecting information on a plurality of digit line pairs.
2. Description of related art
In conventional semiconductor memory circuits, each memory cell is connected to a pair of digit lines respectively pulled up by a pair of load transistors. The pair of digit lines are respectively connected through a pair of gate transistors to a pair of data bus lines, which are in turn connected to a sense amplifier and are also connected to a pair of driving transistors, respectively.
When a memory cell is selected, the pair of gate transistors connected to the digit line pair connected to the selected memory cell are turned on, and the pair of driving transistors connected to the data bus lines connected to the turned-on gate transistors are also turned on. In this condition, data is read out of the selected memory cell.
When data is read out of the memory cell, a data bus line potential, namely an input potential of the sense amplifier is determined by a conductivity ratio of the load transistors, the gate transistors, and the driving transistors. On the other hand, when the memory cell is in a non-selected condition, the corresponding gate transistors and the corresponding driving transistors are turned off, so that the data bus line potential is determined by auxiliary transistors which are provided for each of data bus line pair and which are ceaselessly maintained in an on condition. In other words, a standby current is flowed by these auxiliary transistors.
With this arrangement, data can be read out from a selected memory cell at a high speed by previously setting the data bus potential of the non-selection time at the same level as that of the selection time, by means of the auxiliary transistors. In an actual operation, however, off-timings of the gate transistors and the driving transistors after the reading of the memory cell has been completed are liable to deviate from each other. If the deviation of the off-timing between the gate transistors and the driving transistors becomes large, the data bus potential in a half-selected condition will transiently and rapidly change toward a voltage supply voltage. A a result, a long time becomes required for restoring an appropriate voltage after it becomes a complete non-selected condition, since a driving power of the permanent-on auxiliary transistors is small. On the other hand, if the data bus is selected in a condition in which the data bus potential of the non-selection time is greatly deviated from that of the selection time, a time for restoring the selection potential is required. As a result, a time required until it enters a normal sense amplifier operation will decrease an access speed.
In order to rapidly bring the potential of the non-selected data bus line to the set level, it is considered to increase a current driving capacity of the permanent-on auxiliary transistors. However, this is not preferable, since it results in increase of consumption power of the memory circuit.
In addition, since the circuit for setting the potential of the selected data bus and the circuit for setting the potential of the non-selected data bus are respectively formed of transistors having different shapes and powers, a difference between the selection time potential and the non-selection time potential is liable to occur due to variations in characteristics attributable to a manufacturing process.

Semiconductor memory circuit having switched voltage supply for data bus lines