A new transistor cell is disclosed in this invention which is formed in a semiconductor substrate with a drain region of a first conductivity type formed at a bottom surface of the substrate. The DMOS cell includes a polysilicon layer constituting a gate supported on a top surface of the substrate, the gate surrounding and defining an outer boundary of the transistor cell having a removed polysilicon opening disposed substantially in a central portion of the cell. The DMOS cell further includes a source region of the first conductivity disposed in the substrate near edges of the removed polysilicon opening with a portion extends underneath the gate. The DMOS cell further includes a body region of a second conductivity type disposed in the substrate occupying an entire region under the removed polysilicon opening thus encompassing the source region and having a portion extends underneath the gate. The body region defining substantially a merged-double-U-shaped region including a left-U-shaped implant region and a right-U-shaped implant region and a merged region disposed substantially at a central portion under the removed polysilicon opening. In a preferred embodiment, the merged double-U-shaped region constituting the body region further includes a deep high concentration body dopant region and a shallow high concentration body dopant region.

1. Field of the Invention
This invention relates generally to the structure and fabrication process of trenched DMOS transistors. More particularly, this invention relates to a novel and improved DMOS structure and fabrication process wherein reduced number of masks are employed such that the DMOS devices can be manufactured at lower cost and additionally, the device ruggedness is strengthened and the source contact resistance is reduced.
2. Description of the Prior Art
The fabrication cost of a semiconductor device is often adversely affected due to an increase in the number of masks required in the fabrication process. The fabrication cost for a double-diffusion metal oxide semiconductor (DMOS) device is kept at a relative high level when applying the conventional fabrication methods. The more rigid cost structure for DMOS fabrication is due to the technical difficulty that the number of masks required in device fabrication cannot be easily reduced. Cost reduction in DMOS fabrication is therefore not achievable when the required number of masks remains unchanged.
In addition to the consideration of fabrication costs, the production yield is increased when the number of masks employed in the fabrication process is reduced. A simplified fabrication process with less masks generally reduces the uncertainties and uncontrollable factors during fabrication and leads to yield rate improvement. Again, in the conventional DMOS fabrication techniques, simplified fabrication process with reduction of mask requirements is not easily achievable and yield improvement is still a goal beyond reach.
The number of masks required in DMOS fabrication is closely related to the structure of a DMOS transistor. Please refer to FIGS. 1A and 1B for a general device structure of a planar DMOS transistor 10 and 10' respectively where a cross-sectional views of typical DMOS cells 10 and 10' in the core cell region are shown. The DMOS transistor is supported on a N+ substrate 15 and an N-epi-taxial layer 20 formed on its top. The cell 10 includes a deep p.sup.+ -body region 25, a shallow p body 26, a source region 30 wherein the source region 30 and the p-body region 26 surround a gate 40 insulated by a gate oxide layer 35. The DMOS cell 10 is then covered with a PSG or BPSG protection layer 45. A contact 50 is then formed on top of the source region 30. The DMOS structures as shown for both the planar and trenched DMOS require that the source regions 30 be shorted to the body 25 where a channel is formed for conducting a source-to-drain current. This general structural feature imposes the following basic requirements on the fabrication processes:
(1) The deep p.sup.+ regions 25 and the p-body regions 26 are usually formed prior to the formation of the source regions 30; and PA1 (2) Subsequent to the formation of the p-body region 26, the source regions 30 are then formed within the p-body regions 26 wherein the source regions 30 are shallower and have a different cross-sectional profile than the p-body regions 26.
Due to the facts that the source regions 30 are formed with different cross sectional profile than that of the p-body region 26, in a conventional DMOS fabrication process, two separate masks are usually applied to form the deep p.sup.+ regions 25 and the source regions. Several technical approaches are applied in the prior art as described below with some of these techniques employed to reduce the number of masks required in DMOS fabrication by eliminating the requirement for a separate mask for source implant. However, as will be further explained below, these prior art techniques for DMOS fabrication, even with reduced number of masks, are still limited by other technical difficulties.
FIG. 2 depicts a typical prior art approach used to form the source regions 30 in a p-body region 26. A source mask is applied to form a plurality of photoresist blocks 55 above the source regions 30. A source implant with ion beam 60 is then carried out. Part of the ion beam is blocked by the photoresist blocks 55 in forming the source regions 30. Due to the fact that in this traditional fabrication process, a separate source mask is required to form the source block 55, many invention disclosed in several US Patents provide new approaches to eliminate the use of this separate source mask.
In a U.S. Pat. No. 4,443,931, entitled "Method of Fabricating a Semiconductor Device with a Base Region Having a Deep Portion" (issued on Apr. 24, 1984), Baliga et al. disclose a MOSFET device. The MOSFET device is fabricated by depositing a LPCVD nitride layer after the poly gate is etched. A p.sup.+ mask is applied to open a p.sup.+ -diffusion window. A p-type dopant is then diffused through the p.sup.+ diffusion window. A thick oxide layer is then thermally grown over the p.sup.+ diffusion window. An active mask is applied to selective etch the initial oxide layer. Because the oxide layer grown over the p.sup.+ diffusion window has a greater thickness, an oxide plug is left covering a portion of the p.sup.+ -diffusion window after the etching process. The oxide plug is then applied as a block for source implant. This method is limited by the difficulty that the transistor cannot be shrunk due to a consideration that the deep p.sup.+ region may encroach the channel when the core cells are fabricated with reduced dimension. The fabrication technique is also practically limited in its usefulness due to the more complicate processes.
In another patent, Baliga et al. in U.S. Pat. No. 4,567,641 entitled "Method of Fabricating Semiconductor Devices Having A Diffused Region of Reduced Length" disclose a method of fabricating a semiconductor device where the requirement of a source blocking mask is eliminated. The processing steps are shown in FIGS. 3A to 3D. (FIGS. 4A to 4D in Baliga's Patent). In FIG. 3A, a semiconductor body 200, e.g., a silicon wafer, includes a substrate 202 constituting an N.sup.+ -drain and a N-region 204. On the upper surface 205 of the body 200, an insulating layer 206 is formed followed by deposition of a layer 208 composed of a doped polysilicon material on the insulating layer 206. Another insulating layer of silicon oxide is grown on top of the polysilicon layer 208. Finally, a layer 211 composed of aluminum oxide is deposited on top of the oxide layer 210. A photolithography process is then employed to produce a mask 216 as that shown in FIG. 3B which defines a window 217 and serves as a diffusion barrier when a P-type diffusion through the window 217 is made to form the P base 218.
In FIG. 3C, A N+ diffusion is made through the window 217 to form a N+ source region 220 which extends laterally beneath the polysilicon layer 208 thus forming a region 222 with the lateral diffusion distance approximately the same distance diffused in the downward-vertical direction. The diffusion of the N+ region occurs at an elevated temperature in an oxidizing atmosphere. As a result, the exposed surface 219 (shown in FIG. 3B) becomes oxidized and forming an oxide layer 221. In FIG. 3D, an anisotropic etchant to the oxide layer 221 through the window 217 is applied. This etchant etches through the oxide layer 221 substantially all the way through the N+ region 220 while allows the shoulder 223 of the N+ source 220 to remain intact. Specifically, the anisotropic etchant can be a vertically collimated-beam of reactive ions or a planar plasma etchant and forms a generally U-shaped groove 224. Alternatively, a V-shaped groove could be formed. Thus the source regions 220 are formed in the P base region 218 without requiring the use of a source mask.
The semiconductor device disclosed by Baliga et al., in U.S. Pat. No. 4,567,641, is limited by the fact that the DMOS fabrication process as disclosed involves a more complicate procedure where anisotropic etch is to be performed to etch a silicon groove through the oxide layer. Such procedure is more difficult to perform and therefore more costly. The device by Baliga et al. has another technical limitation that the contact-resistance resistance is relative high due to a reduction of n.sup.+ contact area because only the N+ side-walls are in contact with metal when the U-shape groove is formed in the P region 218. For those reasons, even that the fabrication procedure disclosed by Baliga et al. is able to eliminated the mask used for source implant, does not provide an effective device fabrication method due to its higher contact-resistance and more complicated fabrication procedures.
Another difficulty faced by those engaged in power MOSFET manufacture in attempt to reduce the production cost by reducing the number of required number of masks is the concerns related to device ruggedness. A designer is faced with a constant challenge to increase the device ruggedness due to the fact that various internal parasitic components often impose design and performance limitations to a conventional power metal oxide silicon field effect transistor (MOSFET). Among these parasitic components in a MOSFET transistor, special care must be taken in dealing with a parasitic npn bipolar junction transistor (BJT) formed between the source, the body, and the drain. Under normal static conditions the base and emitter of the parasitic BJT are shorted, leaving only the body-drain diode effective. However, in a transient conditions and during an avalanche breakdown, the parasitic BJT may be activated incidentally which can seriously degrade the overall performance of the MOSFET. Under the circumstances when the parasitic bipolar junction transistor is incidentally activated, snap back may occur which can cause permanent damages to the device. For this reason, precaution must be taken to increase the ruggedness of the device by taking into account that an incidental activation of the parasitic BJT should be prevented in an avalanche breakdown condition when large amount of hole current is generated in the core cell area.
For the purpose of improving device ruggedness, more complicate manufacture processes are often applied which involve either the use of implant mask to form a buried body implant region under the source region or the formation of spacer. Either of these approaches leads to increase in production costs due to the more elaborate and complicate manufacture processes. Device reliability is often adversely affected due to the degradation of gate oxide when spacers are employed to form the self-aligned buried body regions. Because of these difficulties, those of ordinary skill in the art are still limited by the dilemma that the goal of cost reduction by simplifying manufacture processes with reduced number of masks appears to run against another design goal of improving the device ruggedness. Several prior art Patents disclose methods to increase device ruggedness, e.g., U.S. Pat. No. 5,119,153 by Korman et al., and U.S. Pat. No. 5,268,586 by Mukherjee et al., are clear illustrations of the technical difficulties faced by those engaged in DMOS design and manufacture today.
Therefore, there is still a need in the art of power device fabrication, particularly for DMOS design and fabrication, to provide a structure and fabrication process that would resolve these difficulties.

DMOS transistors with diffusion merged body regions manufactured with reduced number of masks and enhanced ruggedness


Disclosed are an electrode for a fuel cell that includes an electrode substrate and a surface-treatment layer disposed on the electrode substrate and including a hydrophilic layer and a hydrophobic layer partially disposed on the hydrophilic layer. Also disclosed are a method of fabricating an electrode for a fuel cell, a membrane-electrode assembly, and a fuel cell system including the membrane-electrode assembly.

1. Field of the Disclosure
This disclosure relates to an electrode for a fuel cell, a method of fabricating the same, and a membrane-electrode assembly for a fuel cell and a fuel cell system including the same.
2. Description of the Related Technology
A fuel cell is a power generation system for producing electrical energy through an electrochemical redox reaction between an oxidant and hydrogen from a hydrocarbon-based material such as methanol, ethanol, or a natural gas. Such a fuel cell includes a stack composed of unit cells, and which produces various ranges of power. Since the fuel cell has between about four and about ten times higher energy density than a small lithium battery, it may be used as a small portable power source. Representative examples of fuel cells include polymer electrolyte membrane fuel cell ("PEMFC") and direct oxidation fuel cell ("DOFC"). A direct oxidation fuel cell configured to use methanol as a fuel is called a direct methanol fuel cell ("DMFC"). The PEMFC has an advantage of high energy density, but it also has problems including a need to carefully handle hydrogen gas and a requirement of accessory facilities, such as a fuel reforming processor for reforming methane, methanol, natural gas, and the like, to produce hydrogen as the fuel gas. The DOFC has lower energy density than that of the PEMFC, but it has advantages of easy handling of a fuel, being capable of operating at room temperature due to its low operation temperature, and no need for additional fuel reforming processors.
In the above-mentioned fuel cell systems, the stack that generates electricity generally includes several unit cells stacked adjacent to one another. Each unit cell is formed of a membrane-electrode assembly ("MEA") and a separator (also referred to as a bipolar plate). The MEA is composed of an anode (also referred to as a "fuel electrode" or an "oxidation electrode") and a cathode (also referred to as an "air electrode" or a "reduction electrode") separated by a polymer electrolyte membrane. At least one of the anode and the cathode includes an electrode substrate and a catalyst layer. Further, the electrode substrate may be configured to transport gas or remove moisture. However, flooding and drying phenomena may occur in a MEA during driving under humidifying and non-humidifying conditions, so the water management balance is broken and may, therefore, cause performance deterioration of the fuel cell.

Electrode for fuel cell, method of fabricating the same, and membrane-electrode assembly for fuel cell and fuel cell system including the same


A magnetic socket holder includes a molded plastic tray with a center bar having laminated keeper plates and bar magnets positioned therein to define pole pieces which permit the forming of magnetic circuits that when closed enhance the holding action of sockets in the tray, as well as holding action of the tray on a magnetizable surface.

This invention relates to a magnetic socket holder and, more particularly, to a magnetic socket holder which utilizes a single closed loop magnetic circuit to hold each individual socket positioned in the holder and a plurality of such circuits to provide a means for mounting the socket holder on a magnetizable surface.
Heretofore, there have been various constructions combining a molded, non-magnetic material with magnets to thereby provide a holder for metal sockets. Pierce, U.S. Pat. No. 3,405,377, discloses such a construction which includes a series of parallel bores in a non-magnetic material. A magnet is positioned at the bottom of each bore and arranged so that a magnetic circuit is completed by insertion of a socket in the bore. Miller, in U.S. Pat. No. 4,591,817, discloses a socket holder which includes armatures or plates that laminate a magnetic material to thereby define an assembly for holding sockets. Anderson, in U.S. Pat. No. 4,802,580, discloses a similar construction wherein parallel plates sandwich a magnetic material. A third, parallel plate is positioned to facilitate alignment of the items being retained. Each of these references is incorporated herewith by reference.
While the above-identified constructions are quite useful and provide a means for storing metal sockets in a convenient and easily accessible fashion, there has remained a need for an improved apparatus for storing and maintaining sockets made of a magnetizable material.

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A circuit locks onto a frequency of data encoded on a medium, taking frequency variations in the physical travel of the medium into account. The circuit includes a disk locked clock (DLC) circuit having a synthesizer operating under digital control based on a feedback signal to produce a servo reference clock and a read reference clock that track frequency variations in the physical travel of the medium. A recovered clock signal is produced based on the servo reference clock and the read reference clock. A digital phase locked loop maintains a frequency lock of the recovered clock signal. An error measurement circuit is connected to the digital phase locked loop. The error measurement circuit produces the feedback signal for digitally controlling the digital logic circuit synthesizer to produce the servo reference clock and the read reference clock that track frequency variations in the physical travel of the medium.

The present invention relates to an electronic data storage and recovery system, and more particularly to a system for locking a clock onto the frequency of data recorded on a storage medium and tracking or rejecting any frequency variation on the media.
There is a continual desire in the electronic data storage industry to increase the amount of data that can be stored in a given form factor. In order to store a greater amount of data either the density of data storage must be increased or a better use of disk format must be achieved. Increased format efficiency can be achieved by reducing the amount of inter-sector gap (space between adjacent data sectors or space between data sectors and servo wedges). Traditionally, the inter-sector gap space was left on the media to allow for changes in rotational frequency over the life of the product. Typical rotational frequency changes come in the form of non-ideal disk eccentricity, disk slips, or mechanical shocks. Traditional systems do not modulate clocks to account for rotational frequency changes but instead employ a traditional clock recovery scheme, such as circuit 10 shown in FIG. 1.
PLL circuit 10 includes reference clock signal 12, generated by a crystal oscillator, for example, that is input to servo synthesizer/PLL 14 and read synthesizer/PLL 16. Servo synthesizer/PLL 14 receives reference clock signal 12 and is programmed to the nominal servo bit rate. Read synthesizer/PLL 16 receives reference clock signal 12 and is programmed to the nominal read bit rate. Servo synthesizer/PLL 14 produces servo clock signal 18, and read synthesizer/PLL 16 produces a read clock signal. Servo clock signal 18 and the read clock signal are multiplexed together by multiplexer 20, and mixer 22 operates to produce recovered clock signal 24. Digital phase locked loop (DPLL) circuit 26 receives recovered clock signal 24 and incoming data phase error signal 27 to modify mixer 22 to lock onto the incoming servo and read data.
PLL circuits such as circuit 10 shown in FIG. 1 have proved to be excellent circuits for maintaining an accurate data clock in current systems. For better format efficiencies with the written media and to decrease the amount of inter-sector gap required on the media, a system can no longer ignore the rotational frequency variations of the media. It is therefore necessary for a clock circuit with highly accurate "sub-T" error measurement resolution (within a fraction of a clock cycle, where T is a clock cycle period) to be developed for these systems. This allows tracking or rejecting of the rotational frequency variations of the media.

System for locking a clock onto the frequency of data recorded on a storage medium


The present invention relates to a process for determining harmonic oscillations of a fundamental component of an electrical signal, wherein the signal is sampled with a sampling frequency corresponding to a multiple of the fundamental component's frequency. The sampled values of the signal are subjected, after analog-to-digital conversion, to a discrete Fourier transformation to determine the harmonic oscillations. The sampling is performed with a non-integer multiple of the frequency of the fundamental component and the discrete Fourier transformation is performed while the frequency resolution is increased over several periods of the fundamental component to determine the harmonic oscillations.

The journal, "Elektronik" 2, 1/23/1987, pp. 89-96, in particular pp. 92-93, describes a process in which an electrical signal is sampled with a sampling rate corresponding to an integer multiple of the fundamental component's frequency after analog pre-filtering. According to an example given, sampling is performed at a sampling rate of 2.56 kHz, and the spectral lines up to the sixth harmonic oscillation are determined in addition to the spectral line of a 160 Hz fundamental frequency. The spectral lines of the higher harmonics are greater than half the sampling rate (Nyquist frequency) and for real input signals provide the same values as the first eight spectral lines due to mirroring on the Nyquist frequency. The spectral lines of the higher harmonics can not, therefore, be selected and determined with such a process for a sampling frequency of 2.56 kHz. If these spectral lines are also to be determined with this conventional method, a sampling frequency twice as high, i.e., a sampling frequency of 5.12 kHz, would be required.

Process for determining the harmonic oscillations of the fundamental component of an electrical signal


An electronic component, cooling apparatus comprises a so-called water-cooled heat sink, a radiator to be cooled by a motor-driven fan, first and second coolant paths for circulating a coolant between the heat sink and the radiator, and a motor-driven pump for giving a moving energy to the coolant. A plurality of engaging pieces of the motor-driven fan and a plurality of engaged portion of the radiator are engaged to connect the motor-driven fan and the radiator.

The present invention relates to an electronic component cooling apparatus for forcibly cooling electronic components such as microcomputers and to a motor-driven pump and a radiator used in the electronic component cooling apparatus.
Most of conventional electronic component cooling apparatuses, as disclosed in U.S. Pat. No. 5,519,574, have a combination of a heat sink having a plurality of radiation fins on a surface of a base plate and a motor-driven fan for forcibly cooling these fins and the surface of the base plate.
As an amount of heat generated by electronic components increases, however, a problem arises that simply air-cooling the heat sink cannot cool the electronic components down to a sufficient degree.


It is disclosed a fabric (10) comprising a main layer (1), at least one LED (2) and a supporting element (3), wherein said at least one LED (2) is arranged on a coupling surface (3a) of said supporting element (3), and wherein said coupling surface (3a) is coupled to the inner surface (1a) of said main layer (1), said supporting element (3) comprising a plurality of electrical connections (4) to electrically connect said at least one LED (2) to a logic control unit (6) configured to control said at least one LED (2) in function of a sensing signal coming from a sensing device (7), said main layer (1) being provided with at least one opening (5) arranged in correspondence of said at least one LED (2) for allowing the light emitted by said at least one LED (2) to pass therethrough. It is further disclosed an article comprising the above mentioned fabric (10) and a process for producing the fabric (10).

E-textiles and in particular smart garments are generally provided with electronic components (e.g. sensors, actuators, microcontrollers, etc.) for providing articles of clothing (e.g. T-shirts, shoes, gloves, pants, etc.) used for different purposes.
Garments having LEDs, such as shoes for kids having LEDs activated in response to the wearer's steps, T-shirts or jackets having LEDs coupled to the fabric, are known. These garments are used for example to obtain a flashy appearance or to signal the presence of the wearer (e.g. during jogging or during riding on a bike or a motorcycle on a dark road).
However, often the presence of LEDs may jeopardize the stylish appearance of a garment, especially when LEDs are turn off.

Fabric and article with led embedded therein and the related production process

SANKO TEKSTIL ISLETMELERI SAN. VETIC. A.S.


A holding assembly for maintaining a blade in an operative position on a movable support, which holding assembly has an elongate housing assembly having a first wall with a first pressure applying surface facing transversely to the length of the elongate housing assembly in a first direction, and a plate assembly having a second wall with a second pressure applying surface. With the elongate housing assembly and plate assembly in operative relationship, the first and second pressure applying surfaces face oppositely to each other so that there is a thickness between the first and second pressure applying surfaces. The first and second walls are repositionable selectively towards and away from each other with the elongate housing assembly and plate assembly in operative relationship to thereby vary the thickness between the first and second pressure applying surfaces. The holding assembly further includes a slide bar between a part of the elongate housing assembly and a part of the plate assembly that is guided by at least one of the elongate housing assembly and plate assembly in movement relative to the at least one of the elongate housing assembly and plate assembly lengthwise of the elongate housing assembly. The slide bar has first and second discrete cam surfaces spaced from each other lengthwise relative to the elongate housing assembly. Second and third cam surfaces are provided on at least one of the elongate housing assembly and plate assembly. The second and third cam surfaces cooperate one each with the first and second cam surfaces to cause the first and second walls to be wedged away from each other as the slide bar is moved in one direction lengthwise relative to the elongate housing assembly to thereby vary the thickness between the first and second pressure applying surfaces.

1. Field of the Invention
This invention relates to cutting blades, such as those used to perforate or sever a paper web and, more particularly, to an assembly for holding a blade on a carrier therefor in such a manner that assembly, disassembly and adjustment of the blade are facilitated.
2. Background Art
There are many environments in which cutting blades are used. In one exemplary system, cutting blades are used to perforate or sever a continuous paper web. In these types of systems, it is known to provide a rotary cylinder with at least one slot through a peripheral surface thereof that defines the blade mounting location. The slot typically has a circumferential dimension that is substantially greater than the thickness of the blade so that the slot will accommodate both the blade and a holding assembly for the blade.
A myriad of different blade holding assemblies have been devised and remain in use today. Most of these assemblies are designed to fit loosely within the slot together with the blade and are reconfigurable to be captively held, together with the blade, in the slot.
With the blade in an operative position on the cylinder, the blade projects radially beyond the peripheral cylinder surface. As the cylinder rotates, the cutting edge on the blade is brought repetitively into close proximity to an underlying anvil to penetrate a web moving between the blade and the anvil. The blade may be configured to make perforating cuts in the web or to cut fully through the web. The cylinder diameter and location of the blade(s) on the periphery of the cylinder are selected to produce a desired spacing between successive cuts as the cylinder rotates.
Specifications for many cutting operations demand that the size and depth of the cuts produced by the blade be precise. This may necessitate that the blade be sharp and consistently oriented on the cylinder at all times.
To maintain a sharp blade, regular sharpening or replacement may be required. In most cases, this will involve removal of the active blade for sharpening or replacement. To replace the active blade, the holding assembly is reconfigured to allow the blade to be released. The same reconfiguration of the holding assembly is required to adjust the blade, which must initially be loosened and then re-secured after the appropriate reorientation has been carried out.
The design of the blade holding assemblies is key to efficient overall system operation. Blade replacement and adjustment both require that the cylinder be stopped, in turn requiring that the entire system operating in conjunction with the cutting cylinder be shut down.
While minimizing down time is a key consideration in the design of a blade holding assembly, it is also important that a holding assembly be capable of positively holding a blade precisely in its intended orientation. Any compromise on the blade position may lead to faulty cutting and/or premature blade failure, both of which compromise overall system performance.
An overriding objective in the design of blade holding systems is that they be user friendly. Systems that are difficult to operate, or in which blade adjusting procedures are time consuming, will inevitably encourage users to avoid this task. As a result, improperly aligned blades and dull blades may be left in place longer than is practical.
One exemplary prior art system is shown in U.S. Pat. No. 4,131,047 (Schriber et al). In Schriber et al, the user is required to rotate a relatively large number of screws to reconfigure the blade holding apparatus to release the blade and to re-secure the blade. In the one embodiment, five such screws are shown which apparently must each be loosened and tightened to adjust and replace the blades. Aside from the inconvenience of having to turn that many screws, the system appears to be prone to blade misalignment. Since there is no practical way to place and maintain the blade and blade holding system in a desired orientation and simultaneously tighten the screws, the screws must be tightened one by one. If the first screw is tightened with the blade system misaligned, there may be no way to straighten the blade without loosening the first tightened screw. The user may tighten a large number of the screws and only then determine that there is a misalignment of the blade which may require that all of the tightened screws be loosened and re-tightened. Rather than loosen the screws to carry out the necessary alignment, the user may be tempted to proceed with a misaligned blade.
Other exemplary systems are shown in U.S. Pat. Nos. 3,527,123; 3,705,526; 3,935,774; 4,131,047; 4,475,425; 4,594,928; 5,224,408; 5,275,076; 5,282,409; and 5,357,836.


The vibrator system is for generating bone conduction vibrations. A magnet (8a) provides a static magnetic flux (Φ1) that follows a first path. A bobbin (4a) is disposed at a center a vibrator (2). A housing (10) encloses the bobbin and has a coil surrounding a center of the bobbin. The coil is powered by an alternating current for providing an alternating dynamic magnetic flux (Φ2) following the first path through a magnetic circuit. The housing has an upper end (116). The upper end and the bobbin have a first gap (14a) formed therebetween. The housing has a lower end (118) opposite the upper end. The lower end and the bobbin have a second gap (14b) formed therebetween. The magnet is positioned so that the static magnetic flux (Φ1) is passing through the first and second gaps in a direction substantially parallel with an axial direction (A) of the vibrator. Suspension means (16a, 16b) are provided for suspending the bobbin in a center of the housing.

Bone conduction is the principle of transmitting vibrations via the skull bone to the inner ear, i.e. the cochlea. Several different types of bone conduction hearing aids are available. The two most common types of such hearing aids are the traditional bone conductors and the direct bone conductors. The traditional bone conductor consists of a hearing aid with a vibrator that is pressed against the skull. The vibrations are then transmitted through the skin and the skull bone into the cochlea. The direct-bone conductors include an anchoring component that is attached to the skull bone and through which the vibrations are directly transmitted to the skull bone.
All of such devices require a vibrator where the electrical signal is converted and transferred into mechanical vibrations. Preferably, electromagnetic vibrators are used in these applications. There are several drawbacks with a traditional non-balanced variable reluctance vibrator. One drawback is that there is a static strong magnetic force biasing to collapse the air gap. The strong static magnetic flux is required as a biasing flux to get a sufficient linearity of the vibrator. To prevent the magnetic force from collapsing the air gap the suspension spring constantly has to counteract the magnetic force. Due to the constantly high load on the suspension spring there is a significant risk for a collapse of the air gap. If a stiffer spring is used, the low frequency response of the vibrator is reduced, which is not desirable. The low frequency response may in that case be improved by adding mass to the vibrator, however this makes it bigger which is not desirable. This design also presents a built-in distortion component that reduces the sound quality of the vibrator.
In some suggested designs, the armature is balanced so that the static force on the suspension elements is minimized and the static and the dynamic magnetic fluxes go partly separated through the magnetic circuit. This may lead to some advantages in the magnetic circuit, however it leads to a complex design that is expensive to manufacture.
In some designs more than two air gaps are required or there has to be at least two magnets in the design. Since each air gap need to be quite small to get an efficient design each air gap requires high precision of the mechanical and magnetic components, and it is therefore a significant drawback to have more air gaps than necessary. By using air gaps with magnetic forces perpendicular to the axial direction in the vibrator there is a risk of the air gap collapsing also in this direction in addition to the risk of the air gap collapsing in the axial direction. Small high precision magnets as those required for this kind of vibrators are costly both to purchase and to handle and makes the design complex. It is therefore desirable to keep down the number of magnets. Also the coils are difficult to handle and it is also desirable to keep down the number of coils.


An automatic labeling machine, for containers in the form of mesh bags or the like, includes a carriage 18 displaceable back and forth in a support plate 19, which incorporates a central, lengthwise channel 20, two lateral connecting rods 23 and 24 being articulated in the carriage, one with an external stud and the other with a lever 25, joined together at their free ends by means of a brace 26, in which is fixed a finger 27 carrying small catches 28, which can be introduced into the channel 20 with intercalation of the corresponding part of the label to be dragged toward the discharge from the machine; A push rod 32 temporarily retains the stud, provided with a plane 32a inclined to the inside in its free end and which can be freed by a bumper 36 joined to the corresponding connecting rod 24, and the lever 25 actuates a cutting device 16.

1. Field of the Invention
The present invention refers to an automatic labeling machine for containers in the form of bags formed of mesh or the like which, in the function for which it is intended, contributes greater advantages to the process than the other provisions inherent in normal organization and constitution.
2. Description of Related Art
Labeling machines which supply labels in pairs such as the machines which are the object of U.S. Pat. No. 399,558 and its Certificate of Addition No. 408,111, granted to Signors Agustin Dauder Guardiola and Francisco Martinez Martinez, are already known.
The machines which are already known supply labels, in pairs, to clamping devices arranged at the discharge from machines forming product containers in the form of mesh bags or the like, bags which are obtained from a continuous tube of said material, generally plastic material.
The labels are fed from a continuous strip, rolled up in the form of a bobbin and mounted revolving in a suitable support. The cited continuous strip of labels presents two transverse cuts, in the manner of lateral grooves in the strip, which penetrate into part of the width of the strip; Each pair of labels remains joined by means of a cord arranged at the side with each one of the cord's ends fastened to each one of the two labels of the corresponding pair. In the known machines, a guide means guides the cited strip that is unrolled from the bobbin, and means are also present for actuation of said strip to transfer it from the bobbin toward the discharge from the machine and means which cut each pair of labels in order to separate them from the strip supplying them. Regulation and control means are normally provided for the adjustment and operation of the machine.
For this purpose, two clamps are applied which are separated longitudinally at a certain distance from one another and preliminarily hold the cited machine supplying the pair of labels in its proper position. The supplied labels are cut in the separation zone between the two clamps. Each label however, remains joined by means of its cord, one in each end of the pair of bags which are thus closed, in such a manner that alternating and cyclical operations are realized while the successive containers are provided with labels. One label is provided on each side, at opposite ends of the containers.
In the machines supplying labels it is also known to provide them with devices for printing the labels with various informational markings (relative to characteristics of the product in the container, price, etc.), at the same time as the delivery of the labels is carried out, according to various solutions with regard to the printer devices. In the already known machines it is possible to print the labels just before their delivery, that is to say, during the operation of supplying the labels. This method requires a tampon-type device for impregnation of each strip brought up to be transferred for application of the printing to each label, with subsequent complications relating to such printing devices and with the consequential danger that, as a result of the neglect of the user of the machine, the corresponding device can sometimes be found without dye and the labels can be supplied without printing or else with defective printing.
Labeling machines are also known similar to those just described but which supply the labels one by one, each label being provided with an appendix, threaded through at the same time as the body of the label, in order to fix it to the corresponding bag. This operation is carried out during manufacture of such a strip of labels according to the conventional method used to obtain the smallest possible quantity of waste (generally by suitable arrangement of the strips, having an assembly of strips of labels obtained from a band of predetermined width and several times larger in size).
The same petitioner has been granted U.S. Pat. No. 554,613, which refers to a labeling machine of the described type which comprises a bobbin joined to a frame and a feeder of a continuous strip of labels, the labels being separated from one another by at least one transverse cut based on the width of the strip, with each pair of labels being joined by means of a cord or the like arranged laterally and with each one of the cord's two ends fastened, respectively, to each one of the two labels of each pair. The machine also includes a guide means and a means for actuation of said strip, and a cutting means to separate the labels from the strip and a means of regulation and control.
The machine according to U.S. Pat. No. 554,613 is characterized in that it presents an anti-slip surface roller, arranged transverse to the guide means of the strip of labels--which is heat-sensitive--and situated underneath this member, to drag it toward the discharge from the machine. The referenced roller is turned by motor-powered means and through corresponding means of transmission. A printer mechanism working heat selectively at predetermined and programmable points is therefore provided over the turning roller which is applied against the corresponding surface of the strip of labels by an elastic means, for which effect the printer mechanism is articulated on a transverse axis joined to the frame. The axis presents a transverse eccentric means, which revolves actuated by the power means and through the transmission means, which eccentric means periodically produces the swivelling of the printer mechanism, thus periodically elevating it or separating it with respect to the strip of labels. The strip is adapted to be dragged by a temporary transport means, essentially during execution of the separation between each two juxtaposed labels under the active zone of the printer mechanism and presenting to said [printer] mechanism an element for its support over the eccentric means. The temporary transport means are actuated by other eccentric transverses, synchronized with those of the printer mechanism and revolving by the power means through respective transmission means, with another longitudinal support element being applied elastically against said eccentric means, supported and prevented from slipping in the frame, and articulated by its opposite end and in closer proximity to the discharge from the machine to a swiveling transverse support provided with as many catches as transverse cuts exist between each two labels and which can be aligned with the same. The catches are also swiveling, arranged longitudinally, and able to be introduced into said cuts in the strip of labels, to cause the strip to be dragged forward periodically during the inactive phase of the printer mechanism, when it is in its position separated from the referenced strip.
The labeling machine object of U.S. Pat. No. 554,613, among other things, contributes the following advantages: the printer works in a manner which does not interfere with the displacement of the strip of labels; the programming of the points of selective heating of the printer mechanism, to obtain a certain printing on each label, is relatively simple and can be varied as required; the printing, which is executed by heating the heat-sensitive material of the strip of labels, is more precise and is produced with neither spots nor errors and without requiring the use of dyes or the like; and the drawbacks inherent in the use of such printing products, liquid or paste, including the total drying required, are eliminated.

Automatic labeling machine, for containers in the form of mesh bags or the like


A method, system, and program are provided for killing login-based sessions with a single action. In addition to issuing a session token to a client system upon login by a user to a network service, a personal token is issued to the client system. The personal token is executable at the client system to trigger accesses to a personal session controller and to automatically disallow the session token if the personal session controller indicates that the personal token is deactivated. The personal session controller enables an interface through which a user is enabled select to deactivate all active personal tokens with a single action, such that a user manages killing login-based sessions independent of the server system authorizing each login-based session and independent of the client system to which the login-based session was authorized.

1. Technical Field
The present invention relates in general to improved network security and in particular to enabling a user to kill login-based sessions at a local or remote system with a single action.
2. Description of the Related Art
Network users are often required to properly login to access data or services from another system via the network. Often, using a network based login, a particular user can login via multiple different systems connected to a network, to access a same set of data or services from a server system.
Each system providing the data or services may implement different levels of security in association with a login. Once the login data entered by a user is verified, the system providing access to data and services enables a session in which the client system at which the user logs in is enabled to access the data and services. To enable a session, some servers pass a session token, also termed a cookie, to the requesting client system to identify the session and set parameters for the session. Where the system provides a client system access to commercial transactions and data, the session token may specify that if no activity within a browser window opened to the commercial transaction is detected within a particular time period, then the session is to terminate.
With the number of logins that a user may perform in a particular day and the number of different client systems from which a user may login, a user may lose track of whether all opened session have been logged out of when the user leaves a particular system. While some servers passing a session token may include a time limit for inactivity after which a session automatically terminates, a user may still be concerned about whether another person could still be accessing the user login for secure access prior to termination. Further, even if a user logs out of a session at a particular client system, the user may not have closed all windows with data associated with the session, leaving that data accessible to a next person using the client session.
Therefore, in view of the foregoing, it would be advantageous to enable a user to kill all session tokens and all windows open in association with a login-based session, with a single action, whether the login-based sessions are all opened from one client system or multiple client systems. Further, it would be advantageous to enable a user to kill session tokens and open windows at one client system from another client system.

Killing login-based sessions with a single action

International Business Machines Corporation


A detecting and suppressing control method for milling tool chatter. Milling parameters are defined. A milling device is initiated using the milling parameters. Milling signals are extracted using a sensor installed on the milling device. It is determined whether chatter relating to the milling device occurs, comprising determining whether the milling signals are high frequency signals, and, if the milling signals are high frequency signals, determining whether signal points generated based on the milling signals are located in a stable area derived using a sliding function. When the signal points are located in the stable area, the milling signals are stable milling signals. When the signal points are located outside the stable area, rotational rates of a spindle of the milling device are adjusted.

The invention relates to system control, and more particularly, to detecting and suppressing control methods for milling tool chatter.
A ┌Machine Tool┘ used in facility manufacturing is driven by a power source, manufacturing metallic workpieces using physical, chemical, or other processes for formation. Manufacturing methods comprise milling or grinding metallic workpieces to desired shape, size, and surface precision. Manufacturing technologies for machine tools have rapidly developed, comprising high speed milling (HSC) and high speed feeding (HSF) methods.
HSC enhances metal removal rate to reduce process time and cost and result in higher surface precision. To harmonize with running efficiency of a machine tool, milling parameters can only be set within a fixed range, or the machine tool generates chatter during milling. When chatter occurs, workpieces may become unusable or damaged, and even the machine tool may experience damage. Current detecting and suppressing methods for chatter change structural features based on structural mode of a machine tool or utilize related controls.
In the Hualizhong Li and Xiaoping Li disclosure MODELING AND SIMULATION OF CHATTER IN MILLING USING A PREDICTIVE FORCE MODEL, simulating and predicting milling force degrees and chatter states creates a dynamic milling model.
In the S. K. KIM and S-Y. Lee disclosure CHATTER PREDICTION OF END MILLING IN A VERTICAL MACHINING CHATTER, a dynamic milling model is created according to geometrical characteristics of milling tools affecting milling force to predict whether chatter occurs in a vertical milling tool.
In the K. J. Lin and K. E. Routh disclosure OPTIMAL PASSIVE VIBRATION CONTROL OF CUTTING PROCESS STABILITY IN MILLING, dampening uses an optimum control method to suppress chatter, defining an objection function according to milling depth, milling width, and spindle rate to obtain optimum m, c, and k values of a dynamic structure of the damper.
In the Jingchuan Pan, Chun-Yi Su, and Yury Stepanenko disclosure MODELING AND ROBUST ADAPTIVE CONTROL OF METAL CUTTING MECHANICAL SYSTEM, a lathe tool seat uses a robust adaptive control method and regulates a feed amount of the lathe tool using an actuator to change milling thickness for chatter suppression.
As described, many other chatter suppression methods are provided. Current chatter suppression methods, however, cannot detect and suppress chatter occurring immediately, and are thus incapable of improving surface precision. Thus, an effective method for suppressing chatter is desirable.

Detecting and suppressing methods for milling tool chatter


Multi-microlens arrays for optimizing light collection efficiency in CCD/CMOS solid-state color image cameras with L-shaped or non-regular photodetector areas are disclosed. Microelectronic fabrication methods for forming planar array multi-microlenses comprised of elements consisting of lens-pairs, integrated with color-filters, and compatible with CMOS high-volume manufacturing are taught. Experimental results demonstrating the processes for fabrication of multi-microlenses for L-shaped and for non-regular sensing areas are given.

(1) Field of the Invention
The present invention relates to the optical design and microelectronic fabrication of microlens arrays for the optimization of spectral collection efficiency and related photodetector signal contrast in the color filter process of semiconductor imaging devices.
(2) Description of Prior Art
Image sensors for color digital still and analog or digital video cameras are typically charge-coupled device (CCD) or complementary metal-oxide semiconductor (CMOS) photodiode array structures which comprise a spectrally photosensitive layer below one or more layers comprised of an array of color filters and a plane-array of microlens elements. The elementary unit of the imager is defined as a pixel, characterized as an addressable area element with intensity and chroma attributes related to the spectral signal contrast derived from the photon collection efficiency of the microlens array, spectral transmission or reflection properties of the color filter array materials, and spectral response and electrical noise characteristics of the photodetectors and signal processing train.
The ability of a sensor to capture images in low-level irradiance conditions is critical in applications. The primary attributes of the sensor that determine its ability to capture low-level image light are the geometrical optics of the lens arrangement, fill-factors of lenses and photodiodes, and, the photoelectron quantum efficiency of the semiconductor in which the photodiodes are fabricated. The quantum efficiency is a measure of the photon-to-electron conversion ratio, and, for most CCD""s these quantum efficiencies are similar. But, the physical size of the photosensitive area, coupled with the geometry of the lenses for collecting light and imaging this light onto the useful photosensitive area, create superior or inferior solid-state imagers. Responsivity is a measure of the signal that each pixel can produce and is directly proportional to pixel area. Another benefit of increased responsivity is that less illumination is needed to achieve a desired signal- to-noise contrast. With low-level illumination, the image will appear less grainy, and, the imager""s frame rate can also be increased, providing increased video rates.
The optical performance of a solid-state imager is seen to depend on pixel size. Pixel size also affects the interaction of the camera lens with the microlens array. The microlens on top of each pixel focuses light rays onto the photosensitive zone of the pixel. The microlens significantly increases responsivity but it also limits the angular range of good responsivity. Typically, a 5-micron pixel has a severe drop in responsivity at 5 degrees from normal incidence. This leads to an optical effect whereby pixels near the edge of the camera lens field of view collect light less efficiently than at the center. This effect is reduced with larger 9-micron pixels, which have high responsivity at angles out to 15 degrees or more. Truncation of illuminance patterns falling outside the microlens aperture results in diffractive spreading and clipping or vignetting, producing nonuniformities and a dark ring around the image. Larger pixels use more silicon area which drives up the solid-state imager device manufacturing cost. The size of the active area can be set to optimize three factors: low light sensitivity, overall sensor size, and, the size of the optics necessary to project the desired image over the entire array. Instead of increasing the active area, some sensor manufacturers add extra steps to the manufacturing process to apply a microlens over each pixel. A microlens captures most of the incident light and focuses it onto the active area, which increases the effective fill ratio. The trade-off is, therefore, between the added cost of the microlens processing steps and the cost of the larger active areas. Typically, a pixel with a microlens requires a narrower incident light angle than a pixel that does not use a microlens, imposing additional optical design implications for the lens of the camera.
Associated with the microelectronic fabrication processes and materials used in forming solid-state array imagers, there often results gradients of spectral sensitivity and/or responsivity across the individual sensor elements comprising the imaging matrix, as well as related variations from sensor to sensor. The intrasensor variation and the intersensor variation are convolved with the imaging optics of the camera and the microlens arrays overlaying the photodiode arrays, such that the resultant contrast or modulation transfer function which manifests itself as an optoelectronic signal distribution mapping the illuminance distribution of the image formed across the imager-array surface, is an electronic signal contrast function which is fed into an electronic signal processing train which again further convolves noise and other contributions into the output of the imager. In particular, the regions within and between pixels which suffer significant variations ranging from peak sensitivity and responsivity to xe2x80x9cdead zonesxe2x80x9d of practically no photosensitivity, or, vignetted light from the optics which truncated and diffracted the original image light-intensity distribution function, direct the attention of solid-state imager designers to improve the geometrical optical configurations to optimize light collection to focus images onto active areas. More particularly, in cases where sensing areas are formed into non-regular or L-type geometries, conventional microlens designs typically yield relatively low light collection efficiencies and result in degraded optoelectronic signal contrast. Images formed may suffer from known types of classical lens aberrations, produce motional smearing, pixel gaps, or, have other significant undesirable effects on image quality. Practical, manufacturable imaging arrays must, therefore, be designed to increase flexibility in the layout of the imaging device. Central to this goal is the optimization of the design of the multi-microlens array configuration geometry and the formation process steps for the microelectronic fabrication of these optics overlaying the photodiode elements in the matrix comprising the solid-state imager. Variations in lens curvature, index of refraction, and, light-scattering centers in the materials which are caused to flow to form the microlens arrays will combine to determine the resultant image quality and signal strength. Unless the microlenses are ideally diffraction- limited, imager defects will always be introduced in practical situations.
The design and fabrication of the multi-microlens arrays over the microelectronic photosensors of the solid-state imager, with enhanced optical collection efficiency for non-regular and L-shaped sensing areas, is thus a goal to which the present invention is directed. In conventional configurations for the color-filter process, only one microlens covers one pixel, and, the center of the microlens is aligned to the center of the pixel. It is, therefore, another goal of the present invention to disclose multi-microlens structures and configurations suitable for L-shaped and non-regular sensing areas applicable to manufacturing CMOS and CCD image devices. Park et al in U.S. Pat. No. 5,877,040 shows a CCD with a convex microlens formed integrally on the planarization layer above a photodiode element of a CCD array such that the focal-distance of the lens may be positioned by adjustment of the microelectronic fabrication process of intervening film-layer thicknesses. By fixing the irradiance pattern comprising the image on only the photodiode, image smear caused by the photoelectric effect when diffracted peripheral light is incident on the interpixel regions is said to be minimized. The microlens formation process described is derived from the flow of a microlens material which flows thermally at 100 degrees to 200 degrees Centigrade. Following a dry-etch step of the substrate, the set of convex microlenses are formed in a second planarization layer above a first planarization layer containing color filters. The light receiving area of the photodiode is increased as compared with the conventional CCD because the photodiode is formed in an overlay with the microlens. However, rheological and surface physical processes, such as those taught by Park et al, wherein flow and surface tension are required to form a matrix of convex microlenses, are not consistent with the formation of irregular shapes to overlay to irregular or L-shaped photodiode geometries. Similarly, Song et al. in U.S. Pat. No. 5,672,519 teaches an image sensor device with a compound regular-shape microlens which extends conventional prior art from square to rectangular illuminance areas to account for CCD structures where the dimensions of a unit pixel or photodiode are different in the vertical and horizontal directions of the semiconductor. Song et al accomplish their extension of the prior art by two successive iterations of the conventional melt and flow process to cascade a contiguous upper lens of different curvature and/or refractive index on a first, lower lens to accommodate the dimensional mismatch of the pixel (photodiode). The fabrication method consists of forming lens shapes by carrying out patterning of transparent photoresist having a refractive index of 1.6 and melting it to cause flow which, under surface tension, results in a mosaic of hemispherical convex lense array elements. Simple convex and compound convex lens classes representative of Prior Art are shown in FIG. 1(a), FIG. 1(b). and FIG. 1(c). In FIG. 1(a), a first hemisherical lens element 1 of a two-dimensional array of microlenses is formed in the manner described above. A successive polymer, resin, or photoresist film coating is conformally applied, photolithographically patterned, thermally reflowed and/or dry-etched. The second-layer photomask and thermal and surface tension conditions of the first microlens 1 array-plane determine the curvature and thickness of the second tandem microlens array-elements 2. The compound lens in FIG. 1(a) is shown comprised of first lens 1, second lens 2, forming light-cone 3 converging to focal point or area 4. FIG. 1(b) shows a planarized first lens 5 with second lens 6 forming a compound lens converging image light-cone 7 to focal area 8. In FIG. 1(c) first microlens 9 is again planarized but also faceted by etching, and second lens 10 is conventionally formed to comprise the compound lens to converge image light-cone 11 to focal area 12. Curvature control is difficult even for a single fabrication step, and, all the determinents of variance that apply to the single step apply a fortiori to the iterated process forming the compound lens. The final structure achieved by Song et al produces parallel stripes of microlenses across a base mosaic of microlenses, which can be planarized to provide a flat surface for the second lens array-plane. In all cases of the Prior Art it is observed that single simple or single compound microlens arrays, with a mapping of the single microlens, simple or compound, to a single pixel or single photodiode sensing area in the imager. The limiting numerical aperture or f-stop of the imaging camera""s optical system is that of the smallest aperture element in the convolution train. Therefore, it is observed that the Prior Art represented in FIGS. 1(a) and (c) have in common the further limitation of the light collection capability of the larger numerical aperture first (lower) microlens element by the addition of the second tandem microlens element (upper) which preceeds it.
Spherical aberrations, coma, light scattering, numerical aperture variations, vignetting, reflective losses at interfaces, multibounce stray light, cross-talk and other optical defects described by the modulation transfer function of the upper lenses are convolved with the lower or base lenses modulation transfer functions having their own analogous set of defects. L-shaped and irregular-shaped pixels remain problems not solved by the methods taught by Song et al.
U.S. Pat. No. 5,336,367 to Nomura attempts to eliminate flicker and other image defects by constraining the color-filter layer distance to the light sensing element, avoid color filter cracks due to thermal impact and enhancing reliability by creating the color-filter using an etch-resistant layer as a mask, and, forming a mosaic array of microlenses on the etch-resistant layer. The manufacturing process described is limited to forming hemispherical convex lenses and, therefore, subject to the same set of limitations of the conventional structures and fabrication processes described herein.
FIG. 2(a) depicts conventional geometric relationships between a square pixel 13, aperture 14 of a microlens element orthogonally projected onto a pixel, active sensing area 15 of a photodiode, and an area of a circle 16 of a microlens focal xe2x80x9cpointxe2x80x9d for converging incident light to fall onto the center of a pixel in the plane of a photodiode. FIG. 2(b) illustrates the geometrical optics for incident image light 16 converged by microlens element 17 into focal cone 18 to the focal area 19 within a photoactive area 20 surrounded by a dead or non-photosensitive area 21. FIG. 3(a) and FIG. 3(b) illustrate the case where the photosensing area is a non-regular geometry. Shown in FIG. 3(a) is a square pixel 22 in which is inscribed the aperture stop 23 of the microlens which has focussed the incident image light into focal area 24 in the gap between the split non-regular sensing area 25. FIG. 3(b) exhibits the geometrical optics for incident image light 26 converged by microlens element 27 into focal cone 28 to the focal area 29 in proximity to a non-regular photoactive area 30. FIG. 4(a) and FIG. 4(b) illustrate the case where the photosensing area is L-shaped. Shown in FIG. 4(a) is a square pixel 31 in which is inscribed the aperture stop 32 of the microlens with focal cone cross-sectional area 33 in the L-shaped photodiode area 34. FIG. 4(b) shows the incident image irradiance 35 focussed by microlens 36 into focal cone 37 converging at focal area 38 onto or in proximity to the L-shaped photosensing area 39.
A principal object of the present invention is to provide classes of multi-microlens optical structures, configurations, arrangements, and combinations with spectral color-filters that maximize collection-efficiency of optical radiation patterns of images superimposed on the surface of semiconductor array imaging devices with non-regular and L-shaped sensing areas to achieve optimum color pixel resolution.
Another object of the present invention is to provide a manufacturable method and fabrication process which minimizes the number and task-times of the operational steps required in the production of semiconductor array color-imagers in accord with the principal object of the present invention.
Another object of the present invention is to provide multi-microlens design structures and fabrication methods that are practical for high reproducibility, reliability, and, consequently maximum yield and minimum production cost.
A further object of the present invention is to increase flexibility of the design and layout of color-imaging devices.
In accordance with the objects of this invention, classes of multi-microlens optical constructs which can be combined with either conventional or novel color-filter fabrication sequences for CCD,CID and CMOS array imaging devices are taught. To practice the method of the present invention, conventional microelectonic fabrication techniques using photolithograhic materials, masks and etch tools are employed: in succession the array of pn-junction photodiodes is patterened with impurity dopants diffused or ion-implanted, isolated, planarized over, and, typically three more layers are built up additively with primary red, green, blue color-filters formed by the addition of suitable dyes appropriate to the desired spectral transmissivity to be associated with specified photodiode coordinate addresses in the imager matrix.
Single chip color arrays typically use color filters that are aligned with individual columns of detector elements to generate a color video signal. In a typical stripe configuration, green filters are used on every other column with the intermediate columns alternatively selected for red or blue recording. Various combinations and permutations of color-filter sequences or color-filter xe2x80x9cmasksxe2x80x9d are possible, and, a number of microprocessor algorithms exist for balancing color components in the synthetic reconstruction of color images.

Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process

Taiwan Semiconductor Manufacturing Company


An agitator is provided for a surface cleaning apparatus, the agitator including a dowel. The dowel defines an axis of rotation. A plurality of disks extends radially from the dowel to a scalloped peripheral edge. The scalloped peripheral edge includes a series of curved recesses, the series of curved recesses extending inwardly toward the dowel.

Household pets, such as dogs and cats, tend to shed hair, which collects on carpets, furniture, and other areas of the home. A common complaint of pet owners is the seemingly never-ending battle to remove the pet hair. Pet hair and other similar debris can be relatively small and difficult to collect, even with conventional vacuum cleaners. Further, vacuum cleaners having rotating or otherwise moving agitators in the suction path to remove pet hair and other debris can collect hair and debris at the moving parts, thereby impeding the operation and effectiveness of the vacuum cleaner.
With a conventional agitator having a plurality of bristle tufts, hair tends to become wedged tightly between bristles in a conventional tufted bundle of bristles. The bundle of bristles in a tuft typically flare outwardly from the base of the tuft where the bristles are inserted into a dowel, to the outer trim diameter where the bristles spread out to some extent and are not packed as tightly together as they are at the base of the tuft. When a conventional tufted brush rotates, the outer portion of the tuft can contact hair on carpet fibers and the hair can become embedded between adjacent bristles. As the agitator rotates, the hair can be pulled toward the base of the tuft where adjacent bristles are more tightly packed together and ultimately wedged into the base of the tuft. As a result, the wedged hair is more difficult it is to remove from the tuft.

This patent is subject to a terminal disclaimer.


A terminal block (10) is for connecting terminals (T) connected to enameled wires extending from a motor and busbars (B) extending from an inverter and includes a plurality of nuts (20) arranged in a width direction and configured to fasten the terminals (T) and the busbars (B) together with bolts (BT), guides (54) are provided between adjacent nuts (20) and configured to guide bolt fastening portions (T1) of the terminals (T) to the upper surfaces of the nuts by coming into contact with lateral edge parts of the terminals (T), and posture correcting portions (55) provided at positions where the terminals (T) are pulled out backward from the nuts and configured to correct postures of barrel portions (T2) of the terminals (T) in the width direction by contacting the barrels (T2) in the width direction.

1. Field of the Invention
The invention relates to a terminal block.
2. Description of the Related Art
Japanese Unexamined Patent Publication No. 2012-151038 discloses a terminal block for connecting motor-side busbars extending from a motor and inverter-side busbars extending from an inverter. More particularly, the motor-side busbars and the inverter-side busbars are placed one over the other on a plurality of nuts arranged in a width direction and bolts are inserted through both types of busbars and tightened to connect the busbars electrically.
A conductive member, such as a busbar, in the above-described terminal block may be displaced in the width direction when being placed on the nut or may be displaced rotationally in the width direction following rotation of the bolt as the bolt is tightened. Thus, the conductive member may be fixed in an improper posture. As a result, an insulation distance at which discharge does not occur may not be ensured.
The invention was completed in view of the above situation and an object thereof is to enable bolt tightening while maintaining an insulation distance between conductive members.


The present disclosure relates to a BCH encoding, decoding, and multi-stage decoding circuits and method, and an error correction circuit of a flash memory device using the same. The concatenated BCH multi-stage decoding circuit includes: a first stage encoding unit that receives a part or all of data input to a flash memory device, performs BCH encoding, and outputs a first output BCH code or a parity bit thereof; an interleaving unit that receives a part or all of data input to the flash memory device, interleaves, and outputs the data, and a second stage encoding unit that performs BCH encoding of the BCH code or data that is the output of the interleaving unit, and outputs a second output BCH code or a parity bit thereof.

Recently, according to the increase of a speed of a processor and a main storage device such as a RAM used in various electronic products, a bottleneck phenomenon in which an operation processing speed of the electronic product is determined according to a speed of an auxiliary storage device has been deepened. A device storing magnetic field such as a hard disk drive (HDD), and an optical disc device (optic disc drive, ODD) such as a CD and a DVD have been mainly used as the existing auxiliary storage device. Among them, in the optical disc device, data input and output are not free, and a speed of the data output is extremely low. In addition, the device storing the magnetic field has a speed higher than that of the optical disc device, but still cause the bottleneck phenomenon, and data may be easily damaged or disappeared by impact.
Accordingly, a solid state drive (SSD) formed of a semiconductor element obtained by applying the existing MOSFET structure is magnified.
The SSD has a work processing speed higher than that of the HDD, and it is possible to input and output data at a high speed without searching time by random access to an element in which the data is stored. In addition, mechanical delay or failure rate is significantly low, and there is an advantage that the data is not damaged by outer impact. Further, in the SSD, power consumed in the semiconductor element is low, the SSD can be driven with low heat generation, low noise, and low power without a separate mechanical device, and a product including the SSD can have a small size and a light weight as compared with the HDD.
As the SSD, generally, there are a NOR flash memory configured in a NOR type and a NAND flash memory configured in a NAND type. Between them, the NAND flash memory has a high integration degree of a circuit in a serial connection type, and is easily made to have mass capacity, and a reading/writing speed is high. In addition, due to characteristics that data storage capability is excellent and it is easily made to have mass capacity, the NAND flash memory is used in most of mass capacity SSD.
However, the NAND flash memory element is tending to be minute and multi-valued according to the use of a minute process and the increase of the number of storage bits per cell. The increase of storage density increases a side effect such as deterioration of reliability of the element and decrease of life.
A problem according to the increase of the storage density of the NAND flash memory and necessity of error correction encoding will be described with reference to FIGS. 1(a) to 1(d).
Referring to FIGS. 1(a) to 1(d), a Single-Level Cell (SLC) flash memory (FIG. 1(a)) is a NAND element that stores 1-bit information, a Multi-Level Cell (MLC) flash memory (FIG. 1(b)) is a NAND element that stores 2-bit information, a Tri-Level Cell (TLC) flash memory (FIG. 1(c)) is a NAND element that stores 3-bit information, and a Quad-Level Cell (QLC) Flash Memory (FIG. 1(d)) is a NAND element that stores 4-bit information.
Referring to FIGS. 1(a) to 1(d), probability of occurrence based on inter-level interference is increased at the reading operation time according to the increase of the number of bits stored per cell, error occurrence probability is drastically increased as the reading/writing operation is repeated, and thus a problem of decreasing reliability of the product occurs. Therefore, the error correction circuit with low power and a high process amount is an essential element in design of stable NAND flash memories with reasonable price.
To solve such a problem, generally, error correction encoding is used, and the error correction encoding needs extra bits including information for detection of errors and correction of errors. Accordingly, an extra area of cells is required to store the extra bits. However, to maximize the storage capacity of the storage medium, the area of the cells necessary to store the extra bits is miniaturized, and thus it is necessary to miniaturize the extra bits.
In addition, due to the increase of storage data errors, new error correction encoding for substituting the existing BCH encoding and Reed-Solomon (RS) encoding requiring exponential complexity and a lot of extra bits in the number of errors is necessary.
As the error correction encoding has high performance, it has high complexity and long decoding delay time. In a case of the NAND flash memory, little errors occur at the initial stage, and the number of occurring errors is increased according to the increase of the use time. When only error correction encoding with simply high performance is used, it has a long decoding delay time when there are little errors, which is not efficient.

Encoding, decoding, and multi-stage decoding circuits for concatenated BCH, and error correction circuit of flash memory device using the same

KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY


Disclosed is an exposure apparatus for transferring a pattern formed on a mask to a substrate. The apparatus comprises: a support mechanism having three support legs, the three support legs being adapted to support the support mechanism at three points relative to an installation surface for the exposure apparatus. An illumination optical system is provided on the support mechanism to illuminate the mask having the pattern formed thereon. In the apparatus, as viewed in a vertical direction relative to the installation surface, the three support legs constitute three vertexes of a triangle and the illumination optical system is substantially symmetrical with respect to a straight line drawn from one vertex of the triangle toward the middle point in one side of the triangle opposite the one vertex.

The present invention relates to an exposure apparatus for use in producing semiconductor devices and liquid crystal displays.
In a photolithography process in the manufacture of semiconductor devices and liquid crystal displays, a projection exposure apparatus is used for forming a fine circuit pattern on a semiconductor layer or a metallic wiring layer. In the projection exposure apparatus, a reticle or a photomask (hereinafter, frequently referred to simply as "reticle") having formed thereon a circuit pattern is provided on a reticle stage, and a wafer stage having provided thereon a semiconductor wafer or a glass substrate (hereinafter, frequently referred to simply as "wafer") with a photoresist coating is moved relative to the reticle along an x-axis and a y-axis in a two-dimensional plane, to thereby transfer the circuit pattern formed on the reticle to a predetermined area on the wafer.
Types of exposure apparatuses can be roughly classified as a projection exposure apparatus of a step and repeat type in which a pattern on a reticle is projected through a projection optical system as a reduced pattern image and the reduced pattern image is formed on each exposure field on a wafer, and a scanning projection exposure apparatus of a so-called step and scan type in which a part of a pattern on a reticle is projected through a projection optical system on a wafer while moving the reticle and the wafer synchronously in predetermined scanning directions, to thereby transfer the pattern on the reticle to the wafer.
In conventional exposure apparatuses, such as mentioned above, main components of the exposure apparatus, i.e., an illumination optical system, a mask stage and a substrate stage, are supported relative to an installation surface for the exposure apparatus by four support legs. It is preferred that these components be maintained precisely horizontally. However, it is extremely difficult to maintain these components of the exposure apparatus on a horizontal plane by adjusting the lengths of four support legs, so that dynamic stability of the entire exposure apparatus is likely to be poor. Further, the area of the installation surface for the exposure apparatus, which is included within four support legs, is relatively large.


A hardware filter for controlling the detectability, highlighting and invisibility of graphics primitives. Each of the three display attributes (detectability, highlighting, and invisibility) being controlled has associated with it both an inclusion counter and an exclusion counter, for a total of six counters. Associated with each class name is a flag, indicating whether the class name is a member of the currently active set, as well as a 6-bit string indicating the effect of the class on each of the six filters. On traversal of the structure hierarchy, upon encountering an order for the addition of a class name to the set, and if the flag corresponding to the class name has not already been set, the flag is set and the corresponding filter counters are incremented in parallel by gating an incrementing signal with the 6-bit string. Similarly, upon encountering an order for the removal of a class name to the set, and the flag corresponding to the class name has not been reset, the flag is reset and the corresponding filter counters are decremented by gating a decrementing signal with the 6-bit string. Subsequently encountered primitives are considered as detectable, highlighted or invisible if the corresponding inclusion filter counter is greater than zero, indicating that the primitive belongs to at least one included class, and the corresponding exclusion filter counter is zero, indicating that the primitive does not belong to any excluded class.

1. Field of the Invention
This invention relates to an attribute filter for computer graphics applications and, more particularly, to a method and apparatus for filtering PHIGS attributes such as detectability, highlighting and invisibility.
2. Description of the Related Art
Programmer's Hierarchical Interactive Graphics System (PHIGS) is an applications programming interface (API) widely used in computer graphics applications. PHIGS primitives have various attributes, including the attributes of detectability (or pickability), highlighting, and visibility. Highlighting indicates whether the images of subsequent output primitives encountered during structure traversal are to be distinguished in a workstation-dependent manner. Visibility indicates whether output primitives are rasterized for display. Detectability (or pickability) indicates whether a primitive is eligible for a user selection operation known as picking.
Graphics applications written to the PHIGS standard use the filter operations to control detectability, highlighting and invisibility of such primitives as lines, surfaces, text and markers. A discussion of PHIGS filters may be found in the IBM publication The graPHIGS.TM. Programming Interface: Understanding Concepts, SC33-8102-2, pp. 6-9 to 6-10 (3d ed. 1988), as well as in Hempel et al. U.S. Pat. No. 4,870,599, entitled "Traversal Method for a Graphics Display System". (IBM and graPHIGS are trademarks of IBM Corporation.) Large applications may invoke filter operations with such frequency that the filter operation processing time becomes a major factor in the overall performance of a graphics processor.

Attribute filter for computer graphics applications

International Business Machines Corporation


The present invention relates to the field of devices and methods for improving testing of hearing devices, including soundbridges and direct drive middle ear implants. In particular, the present invention provides a microphone system utilizing reverse transfer function to assess the operability of implanted hearing improvement devices, including but not limited to soundbridges and direct drive middle ear implants.

The auditory system is generally comprised of an external ear, a middle ear and an internal ear. The external ear includes the auricle (i.e., the ear flap) and auditory canal, while the internal ear includes the oval window and the vestibule which is a passageway to the cochlea. The middle ear is positioned between the external ear and the middle ear, and includes the eustachian tube, the tympanic membrane or eardrum, and three bones called ossicles, and the middle ear space. The three ossicles (i.e., the malleus, incus, and stapes), are positioned between and connected to the tympanic membrane and the oval window.
In a person with normal hearing, sound enters the external ear, where it is slightly amplified by the resonant characteristics of the auditory canal of the external ear. The sound waves produce vibrations in the tympanic membrane. The force of these vibrations is magnified by the ossicles.
Upon vibration of the ossicles, the oval window conducts the vibrations to cochlear fluid in the inner ear, thereby stimulating receptor cells or hairs within the cochlea. In response to the stimulation, the hairs generate an electrochemical signal that is delivered to the brain via one of the cranial nerves, allowing the brain to perceive sound.
A number of auditory system defects impair or prevent hearing. Some patients have ossicles that lack the resiliency necessary to increase the force of vibrations to a level that will adequately stimulate the receptor cells in the cochlea. Other patients have ossicles that are broken, and which therefore do not conduct sound vibrations to the oval window. However, in most cases, sensorineural hearing loss is due to the lack of proper hair cell function within the cochlea.
Prostheses for ossicular reconstruction are sometimes implanted in patients who have partially or completely broken ossicles. These prostheses are normally cut to fit snugly between the tympanic membrane and the oval window or stapes. The close fit holds the implants in place, although gelfoam is sometimes packed into the middle ear to ensure against loosening. Two basic forms are available: total ossicle replacement prostheses (TORPs) which are connected between the tympanic membrane and the oval window; and partial ossicle replacement prostheses (PORPs) which are positioned between the tympanic membrane and the stapes or between the incus and stapes or between the incus and oval window.
Although these prostheses provide a mechanism by which vibrations may be conducted through the middle ear to the oval window of the inner ear, additional devices are frequently necessary to ensure that vibrations are delivered to the inner ear with sufficient force to produce high quality sound perception. Even when a prosthesis is not used, disease and the like can result in hearing impairment.
Various types of hearing aids have been developed to restore or improve hearing for the hearing impaired. With conventional hearing aids, sound is detected by a microphone, amplified using amplification circuitry, and transmitted in the form of acoustical energy by a speaker or transducer into the middle ear by way of the tympanic membrane. Often the acoustical energy delivered by the speaker is detected by the microphone, causing a high-pitched feedback whistle. Moreover, the amplified sound produced by conventional hearing aids normally includes a significant amount of distortion.
Attempts have been made to eliminate the feedback and distortion problems associated with conventional hearing aid systems. These attempts have yielded devices that convert sound waves into electromagnetic fields having the same frequencies as the sound waves. A microphone detects the sound waves, which are both amplified and converted to an electrical current. The current is delivered to a coil winding to generate an electromagnetic field which interacts with the magnetic field of a magnet positioned in the middle ear. The magnet vibrates in response to the interaction of the magnetic fields, causing vibration of the bones of the middle ear or the skull.
Existing electromagnetic transducers present several problems. Many are installed using complex surgical procedures which present the usual risks associated with major surgery and which also require disarticulating (disconnecting) one or more of the bones of the middle ear. Disarticulation deprives the patient of any residual hearing he or she may have had prior to surgery, placing the patient in a worsened position if the implanted device is later found ineffective in improving the patient's hearing. Thus, the sound produced by these devices includes significant distortion because the vibrations conducted to the inner ear do not precisely correspond to the sound waves detected by the microphone.
In addition to the problems described above with most hearing aids presently in use, methods to assess the functioning of such devices when worn by users are lacking. For example, some methods (e.g., commercially available test systems) used to measure hearing aid performance require very expensive equipment, are expensive to implement, and difficult to use. In addition, these systems can provide misleading results when improperly used. What is needed in the art is an easy to use device for assessment of hearing devices, suitable for use prior to, during and after installation of such devices. In this manner, the proper functioning of the hearing device can be readily assessed and alternative treatment methods considered, should the need arise.


A color photographic element is disclosed containing in its blue recording layer unit a blue light reflective layer positioned to receive light from a layer in the blue recording layer unit containing latent image forming silver halide grains of maximum sensitivity. The blue light reflective layer is free of blue absorbing dye and contains tabular silver halide grains having a thickness in the range of from 0.12 to 0.15 .mu.m, an average aspect ratio of greater than 15, and a coating coverage of 0.5 to 1.5 g/m.sup.2, and are formed of greater than 50 mole percent bromide, based on silver.

Photographic images that allow recreation or approximation of the natural hues of a subject are conventionally captured on photographic film mounted in a camera. Camera speed films typically employ high bromide silver halide emulsions. Separate images of each of blue, green and red exposures are captured in blue, green and red recording layer units within the film. The blue recording layer unit contains chemically sensitized high bromide grains that may rely on native blue sensitivity or be sensitized to the blue region of the spectrum with one or more blue absorbing spectral sensitizing dyes. The green recording layer unit contains chemically sensitized high bromide grains that are sensitized to the green region of the spectrum with one or more green absorbing spectral sensitizing dyes. The red recording layer unit contains chemically sensitized high bromide grains that are sensitized to the red region of the spectrum with one or more red absorbing spectral sensitizing dyes. Dye-forming couplers are typically included in the layer units to allow dye images of distinguishable hue to be formed upon color processing. When the photographic film is intended for reversal processing to produce a viewable color positive image or when the photographic film is intended for use in exposing a color paper, the blue, green and red recording layer units contain couplers that form blue absorbing (yellow), green absorbing (magenta), and red absorbing (cyan) image dyes, respectively. When the dye image information is intended to be retrieved from the photographic film by digital scanning, the dye images can be of any hue, provided they are distinguishable.
The components used to construct color photographic films are disclosed in Research Disclosure, Vol. 389, September 1996, Item 38957. Research Disclosure is published by Kenneth Mason Publications, Ltd., Dudley House, 12 North St., Emsworth, Hampshire P010 7DQ, England. The following topics of Item 38957 are particularly pertinent to the present invention:
I. Emulsion grains and their preparation (most particularly the last sentence of paragraph (1) of B. Grain morphology); PA1 II. Vehicles, vehicle extenders, vehicle-like addenda and vehicle related addenda; PA1 IV. Chemical sensitization; PA1 V. Spectral sensitization and desensitization PA1 X. Dye image formers and modifiers (except A. silver dye bleach); PA1 XI. Layers and layer arrangements; PA1 XII. Features applicable only to color negative; PA1 XIII. Features applicable only to color positive (except C. Color positives derived from color negatives); PA1 XV. Supports. PA1 Daubendiek et al U.S. Pat. No. 4,414,310; PA1 Abbott et al U.S. Pat. No. 4,425,426; PA1 Wilgus et al U.S. Pat. No. 4,434,226; PA1 Maskasky U.S. Pat. No. 4,435,501; PA1 Kofron et al U.S. Pat. No. 4,439,520; PA1 Solberg et al U.S. Pat. No. 4,433,048; PA1 Evans et al U.S. Pat. No. 4,504,570; PA1 Yamada et al U.S. Pat. No. 4,647,528; PA1 Daubendiek et al U.S. Pat. No. 4,672,027; PA1 Daubendiek et al U.S. Pat. No. 4,693,964; PA1 Sugimoto et al U.S. Pat. No. 4,665,012; PA1 Daubendiek et al U.S. Pat. No. 4,672,027; PA1 Yamada et al U.S. Pat. No. 4,679,745; PA1 Daubendiek et al U.S. Pat. No. 4,693,964; PA1 Maskasky U.S. Pat. No. 4,713,320; PA1 Nottorf U.S. Pat. No. 4,722,886; PA1 Sugimoto U.S. Pat. No. 4,755,456; PA1 Goda U.S. Pat. No. 4,775,617; PA1 Saitou et al U.S. Pat. No. 4,797,354; PA1 Ellis U.S. Pat. No. 4,801,522; PA1 Ikeda et al U.S. Pat. No. 4,806,461; PA1 Ohashi et al U.S. Pat. No. 4,835,095; PA1 Makino et al U.S. Pat. No. 4,835,322; PA1 Daubendick et al U.S. Pat. No. 4,914,014; PA1 Aida et al U.S. Pat. No. 4,962,015; PA1 Ikeda et al U.S. Pat. No. 4,985,350; PA1 Piggin et al U.S. Pat. No. 5,061,609; PA1 Piggin et al U.S. Pat. No. 5,061,616; PA1 Tsaur et al U.S. Pat. No. 5,147,771; PA1 Tsaur et al U.S. Pat. No. 5,147,772; PA1 Tsaur et al U.S. Pat. No. 5,147,773; PA1 Tsaur et al U.S. Pat. No. 5,171,659; PA1 Tsaur et al U.S. Pat. No. 5,210,013; PA1 Antoniades et al U.S. Pat. No. 5,250,403; PA1 Kim et al U.S. Pat. No. 5,272,048; PA1 Delton U.S. Pat. No. 5,310,644; PA1 Chang et al U.S. Pat. No. 5,314,793; PA1 Sutton et al U.S. Pat. No. 5,334,469; PA1 Black et al U.S. Pat. No. 5,334,495; PA1 Chaffee et at U.S. Pat. No. 5,358,840; PA1 Delton U.S. Pat. No. 5,372,927; PA1 Daubendiek et at U.S. Pat. No. 5,576,168; PA1 Olm et al U.S. Pat. No. 5,576,171; PA1 Deaton et al U.S. Pat. No. 5,582,965; PA1 Maskasky U.S. Pat. No. 5,604,085; PA1 Reed et al U.S. Pat. No. 5,604,086; PA1 Eshelman et at U.S. Pat. No. 5,612,175; PA1 Levy et at U.S. Pat. No. 5,612,177; PA1 Wilson et al U.S. Pat. No. 5,614,358; PA1 Eshelman et at U.S. Pat. No. 5,614,359; PA1 Maskasky U.S. Pat. No. 5,620,840; PA1 Wen et al U.S. Pat. No. 5,641,618; PA1 Irving et al U.S. Pat. No. 5,667,954; PA1 Maskasky U.S. Pat. No. 5,667,955; PA1 Maskasky U.S. Pat. No. 5,691,131; PA1 Maskasky U.S. Pat. No. 5,693,459; PA1 Black et al U.S. Pat. No. 5,709,988; PA1 Jagannathan et al U.S. Pat. No. 5,723,278; PA1 Deaton et al U.S. Pat. No. 5,726,007; PA1 Irving et al U.S. Pat. No. 5,728,515; PA1 Bryant et al U.S. Pat. No. 5,728,517; PA1 Maskasky U.S. Pat. No. 5,733,718; PA1 Jagannathan et al U.S. Pat. No. 5,736,312; PA1 Antoniades et at U.S. Pat. No. 5,750,326; PA1 Brust et at U.S. Pat. No. 5,763,151; and PA1 Maskasky et at U.S. Pat. No. 5,792,602.
A. Sensitizing dyes;
Sutton et al U.S. Pat. No. 5,300,413 discloses high bromide {111} tabular grain emulsions with grain dispersities and thicknesses controlled to facilitate blue light reflection.

Color photographic film exhibiting increased blue speed