A method of generating a handoff candidate list (490) to provide to a mobile station (302) may include providing the mobile station in a multi-sector handoff state (360) with a unique combination of a plurality of sectors (362, 363, 364), and recording at least one target sector (371, 372, 373) selected from a plurality of available sectors (366) that is added to the unique combination of the plurality of sectors. The recording step may be iteratively performed whenever the mobile station is in the multi-sector handoff state with the unique combination of the plurality of sectors thereby defining the at least one target sector that has actually been used by the mobile station in the multi-sector handoff state with the unique combination of the plurality of sectors. Upon the mobile station entering the multi-sector handoff state with the unique combination of the plurality of sectors, providing the handoff candidate list to the mobile station, wherein the handoff candidate list comprises the at least one target sector.

Propagation conditions from cellular base stations to mobile stations can change rapidly given terrain, weather, the location of the mobile station, etc. If a mobile station cannot detect and establish contact with a new base station before the signal from the existing base station fades away, the call may get dropped. The current method of recognizing and establishing communication with a new base station uses a handoff list for each base station sector, where each handoff list contains handoff target sectors in all directions. When the mobile station has more than one handoff leg, the list from each sector is combined using a round-robin selection process to arrive at a handoff list usually containing 20 handoff candidates. The time required for this process is not trivial and the results can include handoff candidates that have an extremely low probability of ever being used given the current handoff state of the mobile station.
There is a need, not met in the prior art, for a method of generating and providing a handoff candidate list to a mobile station that minimizes the number of handoff candidates. For example, there is a need, not met in the prior art, of decreasing the number of handoff candidates from the current maximum number handoff candidates. Accordingly, there is a significant need for an apparatus and method that overcomes the deficiencies of the prior art outlined above.
Elements in the Figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the Figures may be exaggerated relative to other elements to help improve understanding of various embodiments of the present invention. Furthermore, the terms "first", "second", and the like herein, if any, are used inter alia for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. Moreover, the terms "front", "back", "top", "bottom", "over", "under", and the like in the Description and/or in the Claims, if any, are generally employed for descriptive purposes and not necessarily for comprehensively describing exclusive relative position. Any of the preceding terms so used may be interchanged under appropriate circumstances such that various embodiments of the invention described herein may be capable of operation in other configurations and/or orientations than those explicitly illustrated or otherwise described.

Method of generating a handoff candidate list


A negative-acting photolithographic printing plate precursor has a unique negative-acting photosensitive composition on a surface. The photosensitive composition contains an acetal polymer, an infrared absorbing dye or pigment, a crosslinking agent for the acetal resin and a photosensitive chemical acid progenitor, and the acetal polymer has within its backbone a structure comprising a particular polymeric moiety derived from a polyvinyl alcohol backbone.

1. Field of the Invention
The present invention relates to the field of reproducing images in large numbers, particularly image production by printing technology, and more particularly to the field of negative-acting photolithographic printing plates and methods of their use.
2. Background of the Art
The art of lithographic printing is based on the immiscibility of oil and water and the relative oleophilic and oleophobic properties of materials that undergo chemical changes, particularly polymerization and depolymerization. In one lithographic printing format, the oily material or ink is preferentially retained by the image area and the water or fountain solution is preferentially retained by the non-image area. When a suitably prepared surface is moistened with water and an ink is then applied, the background or non-image area retains the water while the image area accepts ink and repels the water. The ink on the image area is then transferred to the surface of a material upon which the image is to be reproduced, such as paper, cloth and the like. In the transfer printing process, commonly the ink is transferred to an intermediate material called the blanket which in turn transfers the ink to the surface of the material upon which the image is reproduced.
A generally used type of lithographic printing form precursor has a light sensitive coating applied to a substrate. In most commercial environments an aluminum base support is used. In flexographic printing, a polymeric substrate, such as polyester film is used. Negative working lithographic printing form precursors have a radiation sensitive coating which, when image-wise exposed to light, hardens in the exposed areas. On development the non-exposed areas of the coated composition are removed leaving the image. Positive working lithographic printing form precursors have a radiation sensitive coating which, when image-wise exposed to light, decomposes and/or loses oleophilic properties in the exposed areas. On development the exposed areas of the coated composition are removed leaving the image.
Polyvinyl acetals polymers, especially polyvinyl butyrals are used in a very wide range of products as binders and oleophilic enhancers, primarily due to their excellent film forming, outstanding mechanical characteristics and their ability to contribute to the oleophilic properties of the imaged lithographic layer. These polymers are also known as materials with very good resistance to chemical attack. The polyvinyl butyrals or polyvinyl formals belong to the classes of materials that are not soluble in aqueous developers used in the preparation of printing plates or printing circuit boards. Many different polymers have been proposed for use as binders in conventional analogue negative-working UV-sensitive compositions that provide the required aqueous solubility. Particular advantages have been achieved for polymers containing hydroxyl groups or carboxyl groups in the acetal moieties. These binder polymers are described, by way of non-limiting examples, in U.S. Pat. Nos. 4,665,124; 4,940,646; 5,169,898; 5,169,897; 5,700,619 and 6,808,858. A photosensitive material containing a resin binder, including a vinylic or ethylenic polymer having phenolic hydroxyl groups and aromatic diazonium salt having only a single diazo group was disclosed in U.S. Pat. No. 4,374,193. and (cf. for example H. Baumann and H.-J. Timpe: "Chemical Aspects of Offset Printing" in J. prakt. Chem. Chemiker-Zeitung 336 (1994), pages 377-389). In all the above cases, the acetal containing resins are used in combination with diazonium salt compositions and only in conventional analog imaging and printing applications, as opposed to digital applications.
More recent developments in the field of lithographic printing form precursors have provided radiation-sensitive compositions useful for the preparation of direct laser addressable printing form precursors. Digital imaging information can be used to image the printing form precursor without the need to utilize an imaging master such as a photographic transparency, template or mask.
Today, many imaging processes use infra-red or near infra-red radiation from semiconductor diode lasers to image printing plates. Semiconductor diode lasers have the advantage of being much less expensive than ultraviolet lasers of the same power. They are also well adapted for the production of high resolution images and for digital imaging processes (i.e., for producing hard copies of images stored on computers in digital form). The cost per exposure unit intensity is less for an infrared producing high-resolution addressable source than for a comparable ultraviolet radiation producing source. The above fore-mentioned patents utilizing diazonium salt compositions do not have good natural sensitivity to near infra-red or infra-red laser irradiation.
U.S. Pat. No. 4,708,925 describes a negative working plate system with additional process steps performed after imaging and pre-development. In this disclosed process, the decomposition by-products are subsequently used to catalyze a cross-linking reaction between resins that insolubilize in the imaged areas prior to provide the development step in the formation of the printing plate. However, the process of this patent requires two exposure steps to be utilized as a negative-working plate, i.e., an image-wise exposure and a subsequent overall exposure.
U.S. Pat. No. 5,705,322 has a similar two step exposure process with a diazonaphthoquinone containing composition, except in this case the image-wise exposure is carried out with a near infra-red laser. The additional process step requirements add greatly to the cost and complexity of the process. The resins described in both patents are novolaks of phenol and formaldehyde.
U.S. Pat. Nos. 5,340,699; 5,372,907; 5,372,915; and 5,663,037 describe near infra-red laser imageable negative working systems that utilize a latent Bronsted acid or triazine with an infrared light absorbing dye. The resin system that is used is a combination of novolak and resol resins. U.S. Pat. Nos. 5,763,134, 6,605,416 and RE38,251 describe a negative working infra-red laser imageable composition in which specific squarylium dyes are used. The binder system that is described is again a novolak polymer.
The above described printing form precursors of the prior art which can be employed as direct imaged negative working printing form precursors are lacking in one or more desirable features. Moreover, these printing form precursor systems have constraints on their components which create difficulties in optimizing plate properties to provide optimum performance across the wide range of demanding lithographic plate performance parameters, including pre-heat temperature, developer solubility, solvent resistance, runlength and adhesion.
U.S. Pat. No. 6,541,181 describes acetal binder materials for use in a positive working system utilizing thermal lasers. In this format of process, the exposed areas are washed away during the development process rather than become the ink-retaining image to be printed onto the blanket or ink-receiving surface.
Photosensitive lithographic printing plates and those used for (Computer to Plate) CtP imaging is used in extremely demanding circumstances. Therefore, the coating compositions that are used for creating the image must meet exacting performance standards.
The properties of the photosensitive composition can be improved by several commercial and literature-disclosed methods. One method is to find new ingredients such as initiators, colorants, crosslinking agents, additives, etc. Another method is to optimize the amounts of each ingredient. Still another method is to optimize the conditions and equipment used to expose and develop the lithographic printing plates. The approach used in this disclosure to improve the plate coating composition characteristics and hence the plate performance is to provide novel polymer systems that enhance the physical properties and the reaction performance properties of the coating. This approach is likely to afford greater benefits than the other approaches because the polymer system represents the largest single element of any plate coating and the composition performance tends to be the limiting parameter with respect to image quality. Particularly, this approach is of decisive importance for lithographic printing plates since the behavior in the development of the image, both in exposure and development and the printing process, such as, for example, ink acceptance, scratch resistance and press life, is critically influenced by the polymeric binders.

Negative-acting photolithographic printing plate with improved pre-burn performance


Techniques of client-side measurement of computer network conditions without application control are disclosed herein. One example technique includes instructing a web browser on a client device to submit status report to a server of a computer system currently not providing content to the client device. The example technique can then include identifying multiple packets containing the status report from the web browser received at the server corresponding, determining a condition of the computer network between the server and the client device based on transmission/reception measurements of the received multiple packets at the server, and selectively directing the server of the computer system to provide the content requested by the web server based on the determined condition of the computer network.

A web application or web app is a piece of software executed on a web server in order to provide a web or "cloud" service. Users can access cloud services provided by such web applications using a client device via a computer network such as the Internet. For example, a web server in a remote datacenter can execute a web application to provide a web-based email client for managing user emails. A user can access the web-based email client using a web browser on a client device instead of using a standalone email application executed on the client device.

Client-side measurement of computer network conditions


A semiconductor structure includes of a plurality of semiconductor fins overlying an insulator layer, a gate dielectric overlying a portion of said semiconductor fin, and a gate electrode overlying the gate dielectric. Each of the semiconductor fins has a top surface, a first sidewall surface, and a second sidewall surface. Dopant ions are implanted at a first angle (e.g., greater than about 7°) with respect to the normal of the top surface of the semiconductor fin to dope the first sidewall surface and the top surface. Further dopant ions are implanted with respect to the normal of the top surface of the semiconductor fin to dope the second sidewall surface and the top surface.

The dominant semiconductor technology used for the manufacture of ultra-large scale integrated (ULSI) circuits is the metal-oxide-semiconductor field effect transistor (MOSFET) technology. Reduction in the size of MOSFETs has provided continued improvement in speed performance, circuit density, and cost per unit function over the past few decades. As the gate length of the conventional bulk MOSFET is reduced, the source and drain increasingly interact with the channel and gain influence on the channel potential. Consequently, a transistor with a short gate length suffers from problems related to the inability of the gate to substantially control the on and off states of the channel.
Phenomena such as reduced gate control associated with transistors with short channel lengths are termed short-channel effects. Increased body doping concentration, reduced gate oxide thickness, and ultra-shallow source/drain junctions are ways to suppress short-channel effects. However, for device scaling well into the sub-50 nm regime, the requirements for body-doping concentration, gate oxide thickness, and source/drain (S/D) doping profiles become increasingly difficult to meet when conventional device structures based on bulk silicon (Si) substrates are employed. Innovations in front-end process technologies or the introduction of alternative device structures may be needed to sustain the historical pace of device scaling.
For device scaling well into the sub-30-nm regime, a promising approach to controlling short-channel effects is to use an alternative transistor structure with more than one gate, i.e., multiple-gates. An example of the alternative transistor structure is the multiple-gate transistor. Examples of the multiple-gate transistor include the double-gate transistor, triple-gate transistor, omega field-effect transistor (FET), and the surround-gate or wrap-around gate transistor. A multiple-gate transistor structure is expected to extend the scalability of CMOS technology beyond the limitations of the conventional bulk MOSFET and realize the ultimate limit of silicon MOSFETs. The introduction of additional gates improves the capacitance coupling between the gates and the channel, increases the control of the channel potential by the gate, helps suppress short channel effects, and prolongs the scalability of the MOS transistor.
The simplest example of a multiple-gate transistor is the double-gate transistor, as described in U.S. Pat. No. 6,413,802 ('802) issued to Hu, et al. and incorporated herein by reference. In the '802 patent, the transistor channel comprises a thin silicon fin defined using an etchant mask and formed on an insulator layer, e.g., silicon oxide. Gate oxidation is performed, followed by gate deposition and gate patterning to form a double-gate structure overlying the sides of the fin. Both the source-to-drain direction and the gate-to-gate direction are in the plane of the substrate surface.

Taiwan Semiconductor Manufacturing Company, Ltd.


A barrier system includes a plurality of elongated barriers each having longitudinally spaced ends, each configured with a connector having a pair of laterally spaced openings. The barriers are arranged in an end-to-end configuration, wherein at least two adjacent barriers are arranged with both of the pairs of openings of adjacent connectors being aligned. In one embodiment, at least two other adjacent barriers may be arranged with only one of the openings in each pair of adjacent connectors being aligned. A barrier and methods of assembling a barrier system are also provided.

Water filled barriers are commonly used on roadways as crashworthy protection devices. Although these barriers may be used to separate traffic and even in some instances to act as crashworthy end terminals to protect the ends of barriers, they are typically used as temporary barriers to protect workers in roadway work zones. Water filled barriers are well suited to this role as they are lightweight and easy to move when empty, making them easy to install quickly, without forklifts, cranes, or other heavy equipment.
In a typical work zone installation, the water filled barriers are offloaded from a transport truck and then placed end to end, allowing them to be pinned together. Some barrier designs have joints with a small amount of compliance, allowing the barriers to conform to curves in the roadway or to conform to the shape of the work zone. Once the barriers have been located and pinned together, a water truck drives from barrier to barrier and a road worker fills each barrier with water, giving it the necessary mass.
Crash testing is used to qualify the performance of water filled barriers before they are able to be used as protection devices. Typically a crash test standard, such as NCHRP 350, or MASH is used to determine the speeds and angles of the crash test vehicles. These test standards also contain pass/fail criteria and many governmental agencies allow the use of water filled barriers based on successfully passing crash tests called out by these standards.
The test standards also allow vehicles to be tested at various speeds, depending upon the anticipated use of the products being tested. For instance, a water filled barrier may be used in low speed applications, such as a parking garage, where it is unlikely to be impacted at greater than 50 kph (31 mph). Under the NCHRP 350 test standard, this speed would correspond to Test Level 1. Likewise, a water filled barrier may be used in a work zone inside the city limits, where posted speeds are closer to 70 kph (48 mph). Under the NCHRP 350 test standard, this speed would correspond to Test Level 2.
One measurement that is taken during the crash testing of water filled barriers is the maximum lateral deflection. This value provides a guideline as to how much room must be left behind the barrier in case of a lateral impact into the barrier. For instance, the Triton® Water filled Barrier, disclosed in U.S. Pat. No. 5,425,594 to Krage, the entire disclosure of which is hereby incorporated herein by reference, exhibited a deflection of 3.8 m (12.8 ft.) during a NCHRP 350 test. The deflection of the Triton barrier may be reduced or increased if impacted by vehicles with different weights, speeds, or impact angles. In addition to the parameters of the impact, listed above, the deflection of a water filled barrier is also dependent upon the design of the barrier itself.
The deflections listed above for the Triton Barrier may be sufficient for many applications, however there may be some work zones where lower values of deflection are desired. Since one of the factors affecting the deflection of a water filled barrier is the stiffness of its joints, one way of reducing a water filled barrier's deflection is to increase the joint stiffness. For instance James in US 2010/0215427 discloses a barrier that uses two joining pins instead of one, stiffening the joint between the barriers significantly. James also discloses a method of decreasing the joint stiffness in key barriers by only engaging one of the pin holes in a barrier. This allows the barriers to follow a radius, for instance to follow a curve in the roadway. Although the James design provides a way of stiffening the barriers by providing two pins, both of these pins are located on the centerline of the barrier. This means that to provide increased joint stiffness, the pins would need to be spaced further apart, increasing the length of the joint. The pins of the James design also do not provide a way of ensuring a stiff joint when the joint is in a curved orientation.


A furniture system has a frame portion that may be set in one configuration to operate as a chair and can be readily reconfigured into a table. A frame portion provides support for an operating surface. In the table configuration, the frame is positioned in a first orientation with a working surface supported by the top of the frame. To change the configuration, the working surface is temporarily removed and the frame turned on its side (i.e., rotated 90°) such that a portion of the frame that was previously a leg now becomes part of the frame on the floor while a portion of the frame that was previously on the floor now becomes legs for a chair configuration. Following rotation of the frame, the working surface is reinstalled in a new orientation to complete the change and configuration.

1. Field of the Invention
The present invention is directed generally to and, more particularly, to reconfigurable furniture that serves multiple functions.
2. Description of the Related Art
The utilitarian function of furniture is unquestioned. Furniture is typically constructed in different physical arrangements to serve different utilitarian functions. In addition, furniture may have certain aesthetic aspects that work cooperatively with utilitarian functions. Other aesthetic aspects may serve no utilitarian function.
In certain situations, such as where space is limited, it may be desirable to have a piece of furniture function in multiple configurations to perform multiple tasks. One known device operates as a one-person seat or as a one-person work table. The seat back and seat bottom are formed of a unitary piece of material or formed as separate components that are bolted together. When used as a single-person chair configuration, the seat back/bottom attaches to a two-piece frame at pre-determined points. For operation as a one-person work table, the seat back/bottom is reversed and attached to the two-piece frame to function as a table.
Unfortunately, the drawback of this device is the lack of strengthening and rigidity in the frame, which limits the width of the chair and its ability to support the weight of one or more individuals.
Therefore, it can be appreciated that there is a need for a device that allows reconfiguration of furniture to operate in multiple functional modes. The present invention provides this, and other advantages as will be apparent from the following detailed description and accompanying figures.


A switch device includes a housing, a circuit board is disposed in the housing for being coupled between an electric power source and an electric appliance, a remote detecting device includes a light emitting and receiving device for generating lights to detect whether users are going toward the housing of the switch device or not, the remote detecting device includes an indicating light member to indicate whether an electric power energy has been supplied to the remote detecting device or not, and another indicating light member to indicate whether the light emitting and receiving device is working or not. A control device may control the electric appliance, when the light emitting and receiving device has detected that a user is going toward or close to the housing of the switch device.

1. Field of the Invention
The present invention relates to a switch device, and more particularly to an automatically actuatable switch device which is actuatable by users automatically without being depressed or switched or contacted by the users.
2. Description of the Prior Art
Typically, electric appliances or facilities, such as light devices, fan devices, elevators, etc., are normally coupled to an electric power source via a switch device, and arranged to be actuated or operated by the switch device. Normally, the typical switch devices comprise a switch button depressible by users, or arranged to be pulled by the users.
For example, U.S. Pat. No. 6,765,149 to Ku discloses one of the typical wall boxes having one or more switches disposed in a housing, and arranged to be depressed or actuated or operated by the users.
However, when the typical wall boxes or the typical switch devices are used in public places, such as hospitals, malls, department stores, book stores, restaurants, etc., the typical wall boxes or the typical switch devices will be depressed or contacted by many people, such that germs or bacteria will be easily spread out in the public places via the typical wall boxes or the typical switch devices. It is particularly dangerous when the typical depressing type wall boxes or the switch devices are used in hospitals.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages of the conventional manually actuated or operated switch devices.


Photographic elements containing at least one layer containing polymeric particles surrounded by a layer of colloidal inorganic particles and separate particles of colloidal silica.

1. Field of the Invention
This invention relates to silver halide photographic light-sensitive elements and more particularly to a method of forming images wherein the silver halide photographic light-sensitive element contains matting agents.
Finely divided materials with a mean particle size of from about 1 to about 10 micrometers are commonly used as matting agents to provide a rough surface to photographic elements. See, for example, U.S. Pat. Nos. 4,885,219 and 4,022,622. Further, U.S. Pat. Nos. 4,396,706 and 5,057,407 provide matte particles and techniques in order to increase the adhesion of the particles to the photographic element during processing of the element. In addition to the problems expressed in the previously recited references, printer dusting is also an objectionable problem associated with inadequate matte adhesion.
It has been heretofore known to use silica particles having a average particle size of 1 to 10 micrometers as mattes for use in photographic elements. In this regard, note U.S. Pat. Nos. 4,022,622; 2,976,250; 3,920,456; 4,409,322; and 4,396,706. The use of silica particles as matting agents in photographic films suffer from a number of disadvantages: they produce an objectionable, slightly milky appearance, their average grain size cannot be closely controlled, they adhere to wall surfaces and therefore give rise to extensive cleaning of equipment and increased labor costs and they settle out in the coating device and supply pipes, thus rendering impossible the precise metering of given quantities to the coating formulation. In addition to the above, the use of colloidal silica in conjunction with matte is disclosed in U.S. Pat. Nos. 4,975,363; 4,914,012; and 4,232,117.
U.S. Pat. No. 4,235,959 suggests the use of matte particles prepared by condensing in an aqueous medium urea and formaldehyde while vigorously stirring the mixture until particles comprising urea-formaldehyde resin and silica are formed wherein the silica is embedded within the resin matrix.


In a linear guide bearing apparatus in which a lubricant feeding member 20 attached to an axial end of a slider 2 and making sliding contact with the rolling body rolling grooves 3 of a guide rail 1 to feed a lubricant thereto is of a porous material containing the lubricant and is pressed outwardly along the width of the slider 2 by a pressing member 31 fitted in the lubricant feeding member 20 at an upper portion thereof to have its sliding contact portions 21 pressed against the rolling body rolling grooves 3 of the guide rail 1, the lubricant feeding member 20 is housed in the casing 30 formed integrally with the pressing member 31.

1. Field of the Invention
The present invention relates to a linear guide bearing apparatus used in any of various kinds of machines and apparatus, such as a machine tool, robot or measuring instrument.
2. Description of the Background Art
A known linear guide bearing apparatus of this type is shown in, for example, FIG. 12. This linear guide bearing apparatus has an axially extending guide rail 1 and a slider 2 mounted about the guide rail 1 axially movably relative to the guide rail 1.
The guide rail 1 has an axially extending rolling body rolling groove 3 formed in each of two sidewalls thereof. The slider 2 has a rolling body rolling groove 7 formed in the inner surface of each of two legs 4 of a main slider part 2A and facing one of the rolling body rolling grooves 3. A multiplicity of balls B as examples of rolling bodies are placed rollably between the rolling body rolling grooves 3 and 7 facing each other so that the slider 2 may be axially movable on the guide rail 1 relative to it by the rolling of the balls B.
As the slider 2 moves such that, the balls B between the guide rail 1 and the slider 2 roll toward an end of the slider 2. In this situation, in order to continue the axial movement of the slider, there is required a infinite circulation of the balls B.
Therefore, a rolling body passage 8 is so formed as to extend axially through each legs 4 of the main slider part 2A and a substantially U-shaped end cap 5 is secured to each end of the main slider part 2A by a securing member, such as a screw 12, and has a semi-circular curved turning passage 6 connecting the rolling body rolling grooves 3 and 7 and the rolling body passage 8 to thereby form a rolling body infinite circulation raceway.
A lubricant feeding member 15 for feeding a lubricant to the rolling body rolling groove 3 of the guide rail 1 in sliding contact therewith is situated on the outer surface of each end cap 5 and secured to the end of the main slider part 2A with the end cap 5 by e.g. the screw 12.
The lubricant feeding member 15 is of e.g. a porous resin containing the lubricant, has a substantially U-shaped form like the end cap 5 and has a fixing ring 16 fitted in the outer surface of each of its U-shaped end portions to have the screw 12 pass therethrough and a sliding contact portion 17 projecting from the inner surface of each of its U-shaped end portions to make sliding contact with the adjacent rolling body rolling groove 3 of the guide rail 1 to feed the lubricant thereto, as shown in FIG. 13.
The lubricant feeding member 15 has a recess 19 formed approximately in the center of an upper side thereof so that a ring-like shaped pressing member 18 is adopted to be fitted therein. When the pressing member 18 is fitted in the recess 19 and exerts pressure on the top portion of the lubricant feeding member 15 to deform it outwardly along the width of the slider 2, the U-shaped end portions of the lubricant feeding member 15 situated toward its bottom may be deformed inwardly along the width of the slider 2 so that the sliding contact portions 17 presses against the rolling body rolling grooves 3 of the guide rail 1.
In FIG. 12, each symbol 11 denotes a side seal attached to the outer surface of the lubricant feeding member 15 and secured to the end surface of the main slider part 2A with the lubricant feeding member 15 and the end cap 5 via the screws 12. A symbol 10 denotes a tapped hole formed in the end surface of the main slider part 2A for each screw 12, a symbol 13 denotes a grease nipple, and a symbol 14 denotes a hole for inserting each bolt for securing the guide rail 1.
According to the known linear guide bearing apparatus as described, since the thickness A of the pressing member 18 and the fixing ring 16 are larger than the thickness B of the lubricant feeding member 15 (see FIG. 14), in a case that a plurality of lubricant feeding members 15 are put together as shown in FIG. 15, a clearance C is formed between every two adjoining lubricant feeding members 15 and are undesirably likely to allow fine dust, etc to enter the slider 2 therethrough.
Moreover, as the lubricant feeding member 15 is open to its outside and has an exposed outer periphery, there have been occurred undesirably problems that the lubricant on its outer periphery may easily be deteriorated or vaporize, and that the lubricant may not be fed to the rolling body rolling grooves 3 efficiently, and the lubricant may be lost or deteriorated in an accelerated way under the influence of any coolant, organic solvent, etc used when the apparatus is in operation.
Moreover, since the pressing member 18 and the fixing ring 16 for the lubricant feeding member 15 are made of steel or a resin, it is undesirably likely that the pressing member 18 and the fixing ring 16 may be deteriorated by chemicals, coolant, etc. Further, for each one of the lubricant feeding member 15, one pressing member 18 and one fixing ring 16 are required, which lead to increase number of parts, and make complicate to assemble the apparatus.
Further, according to the known linear guide bearing apparatus as described, the side seals 11 sealing the ends of the slider 2 are rubber seals and present difficulty in the complete removal of finely divided foreign matter. Moreover, the heat generated by sliding friction between the side seals 11 and the guide rail 1 and the sliding wear of their lips lower their sealing performance and disable them to exhibit any satisfactory dust-proofing result.


The present invention provides a compound of formula I:

The search for new therapeutic agents has been greatly aided in recent years by a better understanding of the structure of enzymes and other biomolecules associated with diseases. One important class of enzymes that has been the subject of extensive study is protein kinases.
Protein kinases constitute a large family of structurally related enzymes that are responsible for the control of a variety of signal transduction processes within the cell. (See, Hardie, G. and Hanks, S. The Protein Kinase Facts Book, I and II, Academic Press, San Diego, Calif.: 1995). Protein kinases are thought to have evolved from a common ancestral gene due to the conservation of their structure and catalytic function. Almost all kinases contain a similar 250–300 amino acid catalytic domain. The kinases may be categorized into families by the substrates they phosphorylate (e.g., protein-tyrosine, protein-serine/threonine, lipids, etc.). Sequence motifs have been identified that generally correspond to each of these kinase families (See, for example, Hanks, S. K., Hunter, T., FASEB J. 1995, 9, 576–596; Knighton et al., Science 1991, 253, 407–414; Hiles et al., Cell 1992, 70, 419–429; Kunz et al., Cell 1993, 73, 585–596; Garcia-Bustos et al., EMBO J. 1994, 13, 2352–2361).
In general, protein kinases mediate intracellular signaling by effecting a phosphoryl transfer from a nucleoside triphosphate to a protein acceptor that is involved in a signaling pathway. These phosphorylation events act as molecular on/off switches that can modulate or regulate the target protein biological function. These phosphorylation events are ultimately triggered in response to a variety of extracellular and other stimuli. Examples of such stimuli include environmental and chemical stress signals (e.g., osmotic shock, heat shock, ultraviolet radiation, bacterial endotoxin, and H2O2), cytokines (e.g., interleukin-1 (IL-1) and tumor necrosis factor α (TNF-α)), and growth factors (e.g., granulocyte macrophage-colony-stimulating factor (GM-CSF), and fibroblast growth factor (FGF)). An extracellular stimulus may affect one or more cellular responses related to cell growth, migration, differentiation, secretion of hormones, activation of transcription factors, muscle contraction, glucose metabolism, control of protein synthesis, and regulation of the cell cycle.
Many diseases are associated with abnormal cellular responses triggered by protein kinase-mediated events as described above. These diseases include, but are not limited to, autoimmune diseases, inflammatory diseases, bone diseases, metabolic diseases, neurological and neurodegenerative diseases, cancer, cardiovascular diseases, allergies and asthma, Alzheimer's disease, and hormone-related diseases. Accordingly, there has been a substantial effort in medicinal chemistry to find protein kinase inhibitors that are effective as therapeutic agents.
The Janus kinases (JAK) are a family of tyrosine kinases consisting of JAK1, JAK2, JAK3 and TYK2. The JAKs play a critical role in cytokine signaling. The down-stream substrates of the JAK family of kinases include the signal transducer and activator of transcription (STAT) proteins. JAK/STAT signaling has been implicated in the mediation of many abnormal immune responses such as allergies, asthma, autoimmune diseases such as transplant rejection, rheumatoid arthritis, amyotrophic lateral sclerosis and multiple sclerosis as well as in solid and hematologic malignancies such as leukemias and lymphomas. The pharmaceutical intervention in the JAK/STAT pathway has been reviewed [Frank Mol. Med. 5: 432–456 (1999) & Seidel, et al, Oncogene 19: 2645–2656 (2000)].
JAK1, JAK2, and TYK2 are ubiquitously expressed, while JAK3 is predominantly expressed in hematopoietic cells. JAK3 binds exclusively to the common cytokine receptor gamma chain (γc) and is activated by IL-2, IL-4, IL-7, IL-9, and IL-15. The proliferation and survival of murine mast cells induced by IL-4 and IL-9 have, in fact, been shown to be dependent on JAK3- and γc-signaling [Suzuki et al, Blood 96: 2172–2180 (2000)].
Cross-linking of the high-affinity immunoglobulin (Ig) E receptors of sensitized mast cells leads to a release of proinflammatory mediators, including a number of vasoactive cytokines resulting in acute allergic, or immediate (type I) hypersensitivity reactions [Gordon et al, Nature 346: 274–276 (1990) & Galli, N. Engl. J. Med., 328: 257–265 (1993)]. A crucial role for JAK3 in IgE receptor-mediated mast cell responses in vitro and in vivo has been established [Malaviya, et al, Biochem. Biophys. Res. Commun. 257: 807–813 (1999)]. In addition, the prevention of type I hypersensitivity reactions, including anaphylaxis, mediated by mast cell-activation through inhibition of JAK3 has also been reported [Malaviya et al, J. Biol. Chem. 274:27028–27038 (1999)]. Targeting mast cells with JAK3 inhibitors modulated mast cell degranulation in vitro and prevented IgE receptor/antigen-mediated anaphylactic reactions in vivo.
A recent study described the successful targeting of JAK3 for immune suppression and allograft acceptance. The study demonstrated a dose-dependent survival of Buffalo heart allograft in Wistar Furth recipients upon administration of inhibitors of JAK3 indicating the possibility of regulating unwanted immune responses in graft versus host disease [Kirken, transpl. proc. 33: 3268–3270 (2001)].
IL-4-mediated STAT-phosphorylation has been implicated as the mechanism involved in early and late stages of rheumatoid arthritis (RA). Up-regulation of proinflammatory cytokines in RA synovium and synovial fluid is a characteristic of the disease. It has been demostrated that IL-4-mediated activation of IL-4/STAT pathway is mediated through the Janus Kinases (JAK 1 & 3) and that IL-4-associated JAK kinases are expressed in the RA synovium [Muller-Ladner, et al, J. Immunol. 164: 3894–3901 (2000)].
Familial amyotrophic lateral sclerosis (FALS) is a fatal neurodegenerative disorder affecting about 10% of ALS patients. The survival rates of FALS mice were increased upon treatment with a JAK3 specific inhibitor. This suggested that JAK3 plays a role in FALS [Trieu, et al, Biochem. Biophys. Res. Commun. 267: 22–25 (2000)].
Signal transducer and activator of transcription (STAT) proteins are activated by, among others, the JAK family kinases. Results form a recent study suggested the possibility of intervention in the JAK/STAT signaling pathway by targeting JAK family kinases with specific inhibitors for the treatment of leukemia [Sudbeck, et al, Clin. Cancer Res. 5: 1569–1582 (1999)]. JAK3 specific compounds were shown to inhibit the clonogenic growth of JAK3-expressing cell lines DAUDI, RAMOS, LC1; 19, NALM-6, MOLT-3 and HL-60.
In animal models, TEL/JAK2 fusion proteins have induced myeloproliferative disorders and in hematopoietic cell lines, introduction of TEL/JAK2 resulted in activation of STAT1, STAT3, STAT5, and cytokine-independent growth [Schwaller, et al, EMBO J. 17: 5321–5333 (1998)].
Inhibition of JAK 3 and TYK 2 abrogated tyrosine phosphorylation of STAT3, and inhibited cell growth of mycosis fungoides, a form of cutaneous T cell lymphoma. These results implicated JAK family kinases in the constitutively activated JAK/STAT pathway that is present in mycosis fungoides [Nielsen, et al, Proc. Nat. Acad. Sci. U.S.A. 94: 6764–6769 (1997)]. Similarly, STAT3, STAT5, JAK1 and JAK2 were demonstrated to be constitutively activated in mouse T cell lymphoma characterized initially by LCK over-expression, thus further implicating the JAK/STAT pathway in abnormal cell growth [Yu, et al, J. Immunol. 159: 5206–5210 (1997)]. In addition, IL-6-mediated STAT3 activation was blocked by an inhibitor of JAK, leading to sensitization of myeloma cells to apoptosis [Catlett-Falcone, et al, Immunity 10:105–115 (1999)].
Cyclin-dependent kinases (CDKs) are serine/threonine protein kinases consisting of a β-sheet rich amino-terminal lobe and a larger carboxy-terminal lobe that is largely α-helical. The CDKs display the 11 subdomains shared by all protein kinases and range in molecular mass from 33 to 44 kD. This family of kinases, which includes CDK1, CKD2, CDK4, and CDK6, requires phosphorylation at the residue corresponding to CDK2 Thr160 in order to be fully active [Meijer, L., Drug Resistance Updates, 3, 83–88 (2000)].
Each CDK complex is formed from a regulatory cyclin subunit (e.g., cyclin A, B1, B2, D1, D2, D3, and E) and a catalytic kinase subunit (e.g., CDK1, CDK2, CDK4, CDK5, and CDK6). Each different kinase/cyclin pair functions to regulate the different and specific phases of the cell cycle known as the G1, S, G2, and M phases [Nigg, E., Nature Reviews, 2, 21–32 (2001); Flatt, P., Pietenpol, J., Drug Metabolism Reviews, 32, 283–305 (2000)].
The CDKs have been implicated in cell proliferation disorders, particularly in cancer. Cell proliferation is a result of the direct or indirect deregulation of the cell division cycle and the CDKs play a critical role in the regulation of the various phases of this cycle. For example, the over-expression of cyclin D1 is commonly associated with numerous human cancers including breast, colon, hepatocellular carcinomas and gliomas [Flatt, P., Pietenpol, J., Drug Metabolism Reviews, 32, 283–305 (2000)]. The CDK2/cyclin E complex plays a key role in the progression from the early G1 to S phases of the cell cycle and the over-expression of cyclin E has been associated with various solid tumors. Therefore, inhibitors of cyclins D1, E, or their associated CDKs are useful targets for cancer therapy [Kaubisch, A., Schwartz, G., The Cancer Journal, 6, 192–212 (2000)].
CDKs, especially CDK2, also play a role in apoptosis and T-cell development. CDK2 has been identified as a key regulator of thymocyte apoptosis [Williams, O., et al, European Journal of Immunology, 709–713 (2000)]. Stimulation of CDK2 kinase activity is associated with the progression of apoptosis in thymocytes, in response to specific stimuli. Inhibition of CDK2 kinase activity blocks this apoptosis resulting in the protection of thymocytes.
In addition to regulating the cell cycle and apoptosis, the CDKs are directly involved in the process of transcription. Numerous viruses require CDKs for their replication process. Examples where CDK inhibitors restrain viral replication include human cytomegakovirus, herpes virus, and varicella-zoster virus [Meijer, L., Drug Resistance Updates, 3, 83–88 (2000)].
Inhibition of CDK is also useful for the treatment of neurodegenerative disorders such as Alzheimer's disease. The appearance of Paired Helical Filaments (PHF), associated with Alzheimer's disease, is caused by the hyperphosphorylation of Tau protein by CDK5/p25 [Meijer, L., Drug Resistance Updates, 3, 83–88 (2000)].
Accordingly, there is a great need to develop inhibitors of JAK and CKD2 protein kinases that are useful in treating various diseases or conditions associated with JAK and CDK2 activation, particularly given the inadequate treatments currently available for the majority of these disorders.

Inhibitors of JAK and CDK2 protein kinases

Abstract: or a pharmaceutically acceptable salt thereof. These compounds are inhibitors of protein kinases, particularly inhibitors of JAK and CDK2 mammalian protein kinases. The invention also provides pharmaceutically acceptable compositions comprising the compounds of the invention and methods of utilizing those compounds and compositions in the treatment of various protein kinase mediated disorders.


A resistance weld shielding control system includes a computer that is executed to control a fixture to receive and hold at least one part to be welded. The computer also controls one or more electrodes to apply electrical energy to the part for welding the at least one part, and controls a gas delivery system to direct an inert gas onto the part for shielding the part from the ambient atmosphere via a nozzle. The nozzle is configured in the fixture such that the fixture holds the nozzle in a fixed physical relationship to the part.

Typical resistance weld applications such as flat surface to flat surface geometry can be performed in atmosphere because the joining materials' geometry prevents air from interacting with the weld nugget during formation. Medical devices, however, commonly have a more complex geometry that does not protect the weld nugget during formation. Furthermore, material sets used in medical devices may often consist of mixed metallurgy and oxygen sensitive materials such as titanium, molybdenum (Moly), and nickel that may be deformed during the welding process. Therefore, there is a need in the art for improved welding methods and apparatuses.

Weld shielding apparatus and method of use by controlling shielding gas timing relative to welding


A memory device has a plurality of bit cells, each of which includes an SRAM cell having a storage node selectively connectable to a first bit line in response to a control signal received on a first word line. Each bit cell further includes an MRAM cell selectively connectable to the storage node of the SRAM cell in response to a control signal received on a second word line.

A common type of integrated circuit memory is a static random access memory (SRAM) device. A typical SRAM memory device has an array of memory cells. In some examples, each memory cell uses six transistors connected between an upper reference potential and a lower reference potential (typically ground) such that one of two storage nodes can be occupied by the information to be stored, with the complementary information stored at the other storage node. Each bit in the SRAM cell is stored on four of the transistors, which form two cross-coupled inverters. The other two transistors are connected to the memory cell word line to control access to the memory cell during read and write operations by selectively connecting the cell to its bit lines.
Due to its high speed operation, SRAM memory is often used for computing applications, such as implementing a cache memory. A central processing unit (CPU) cache is a hardware cache used by the CPU. CPUs access data from a main memory location, but this operation is time consuming and inefficient. A cache is used to provide faster access to frequently used data by storing that data locally. While SRAM maintains data in the memory array without the need to be refreshed when powered, it is volatile in that data is eventually lost when the memory is not powered.

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.


A rosin composition includes a gum rosin, an emulsifier, and a randomizing additive. The rosin composition may be applied to circuit cards for protection of the circuit card during storage. The rosin composition is solderable and is also easily removed for the soldering of components.

The shelf life of a circuit card (cc) assembly prior to manufacturing is about 6 months in normal processing environments. Considering that the world's electronic suppliers have expanded globally to include locations such as China and India, it is likely that a printed wiring board (PWB) may sit in transit for up to 4 months prior to reaching the circuit assembly manufacturer. Since environmental restrictions regarding use of hazardous materials have been implemented in the U.S. and Europe, lead-based paints and lead-based surface finishing of electronic devices have been replaced with lead-free versions. However, lead-free surface finishes contain high levels of tin which form tin whisker protrusions in the presence of corrosion or high levels of oxidation. These metal protrusions can transmit high levels of electrical current when bridging to adjacent circuit traces.
Printed wiring board (PWB) surface finishes require a well-defined environment and/or a long shelf life to allow for reliable solder joints. The surface finish degradation due to airborne contaminants and oxide surface formation are both significant factors in determining PWB soldering shelf life. Electroless nickel over immersion gold (ENIG) has been used in the past for military application. Commercially robust surface finishes such as immersion tin, immersion silver, Organic Solderability Preservative (OSP), and other imidazole coatings are used to form a barrier and extend the shelf life on the surface finishes to be soldered. The degree to which the soldering process is impeded depends on the degradation thickness and surface area of the OSP and the imidazole coatings. As time passes, a "worse than" condition can occur using these standard organic coatings. For OSP-coated PWBs, the plastic can be contaminated with finger oils and other manufacturing support materials that deteriorate the solderability of the coating. For non-coated PWBs, the oxide which forms on the metallized surface raises the melting point of the solder when reflow occurs. If high enough concentrations of oxide permeate the unprotected PWB, a cold solder joint will be formed and will fail prematurely. This becomes critical for fine pitch, high density components in electronic designs.
Accordingly, a protective coating to preserve the solderability of a circuit card during storage is desired to improve the manufacturing of circuit card assemblies and printed wiring boards.

This patent is subject to a terminal disclaimer.

Gum rosin protective coating and methods of use


The method for setting up a communication connection in a universal personal telecommunication (UPT) system between a first party and a second party who can be called, often by a wire-free system, offers the possibility of setting up the communication connection without an internal network telephone number having to be transmitted concomitantly in a call signal by storing, in a memory, a relationship between the two parties and at least a section of a link situated between the first party and an exchange and by first reading out the memory in response to a code signal originating from the second party which is detected via a terminal and then to carrying out routing on the basis of the relationship read out.

The invention relates to a method for setting up a communication connection between a first party and a callable second party, which method comprises the following steps of
the reception by the first party of an identification signal for identifying the second party via an exchange, PA1 the activation of a call transmitter for transmitting a call signal to the second party, PA1 the reception by the second party of a code signal via a terminal, and PA1 the setting-up of a connection between the terminal and the exchange in response to the code signal. PA1 the storage of a relationship between the second party and at least a section of a link situated between the first party and the exchange at a location in a memory in response to at least a section of the identification signal, PA1 the reading-out of the location in the memory in response to the code signal, and PA1 the setting-up of the connection between the terminal and the exchange in response to the relationship. PA1 detecting a code signal originating from the second party via the terminal, and PA1 setting up a connection between the terminal and the exchange in response to at least a section of the code signal. PA1 the storage of a relationship between the second party and at least a section of the link situated between the first party and the exchange at a location in the memory in response to at least a section of the identification signal, the telecommunication system being provided with further means for consecutively PA1 reading out the location in the memory in response to the detection of the code signal, and PA1 setting up the connection between the terminal and the exchange in response to the relationship. PA1 the generation of an indication signal, associated with the call signal, of one type in the case of a detected identification signal of one type, and PA1 the generation of an indication signal, associated with the call signal, of another type in the case of a detected identification signal of another type.
Such a method is generally known. A first party (for example a user having a fixed telephone connection) generates an identification signal for identifying a second party (a user who can be called, often by wire-free means, and who can be reached, such as, for example, in the case of universal personal telecommunication or UPT, via one terminal after having identified himself at said terminal and can call from said terminal at his own expense), which identification signal is received by an exchange (possibly via one or more other exchanges) connected to the first party. Said exchange detects the identification signal and looks up (possibly via one or more other exchanges) in a table the number of the terminal at which the second party associated with the identification signal last identified himself. If no terminal at all is known at which the second party last identified himself or if the second party does not respond to the warning signal via such a known terminal, a call transmitter, such as, for example, a paging transmitter is activated, often by wire-free means, for example by a particular action of the first party, for the transmission of a call signal, such as, for example, a paging signal, to the second party. In response thereto, the second party replies at the nearest terminal by feeding a code signal to said terminal, which code signal comprises identification information of the second party and the number of the first party. For this purpose, either the number of the first party has to be known to the second party or said number of the first party has to be communicated to the second party via the call signal, such as, for example, a paging signal. On the basis of the number of the first party, the connection is then set up between the terminal and the first party, who has himself replaced the receiver in the meantime, after which the first and the second party are able to communicate mutually, for example at the expense of the second party.
Said known method has, inter alia, the disadvantage that the communication connection can be set up only if the second party has knowledge of the number of the first party, which number is transmitted to the first party, for example, via the call signal, such as a paging signal. For reasons of privacy, this concomitant transmission of the number is sometimes undesirable.

Method for setting up a communication connection between a first party and a callable second party, a telecommunication system for applying the method, and a receiving device for receiving a call signal of a call transmitter therefor


A system includes a display, an input device, and a processor. The processor is configured to present to a user, on the display, a GUI that illustrates multiple electrodes disposed on an expandable frame of a multi-electrode catheter, and indicates which of the electrodes is active and which of the electrodes is inactive. The processor is further configured to (a) receive, via the input device first user input that chooses between a single-electrode-selection mode and a fan-selection mode, (b) when in the single-electrode-selection mode, receive via the input device second user input that specifies for activation or deactivation individual ones of the electrodes, and (c) when in the fan-selection mode, receive via the input device third user input that specifies for activation or deactivation an angular sector including two or more of the electrodes, and activate and deactivate the electrodes responsively to the first, second and third user inputs.

Controlling a tissue ablation process by a probe using a user-interface was previously proposed in the patent literature. For example, U.S. Patent Application Publication 2018/0368927 describes a computer-implemented method for generating and displaying a graphical user interface (GUI). The method includes displaying, via the GUI, a real-time video received from a camera disposed within an ablation catheter. The method further includes displaying, via the GUI, a graphical representation of a plurality of electrodes of the ablation catheter. In an embodiment, one or more controllers in communication with an RF generator and configured to (i) generate a real-time video from the ablation catheter for displaying via the GUI, (ii) generate a graphical representation including electrode icons corresponding to a plurality of electrodes of the ablation catheter for displaying via the GUI, (iii) receive input, via the graphical representation, (iv) selecting at least some of the electrode icons, and (v) cause an RF generator to transmit RF energy to the plurality of electrodes of the ablation catheter corresponding to the selected electrode icons.
As another example, U.S. Pat. No. 6,625,482 describes a GUI for assisting medical personnel in interpreting data collected by a multiple electrode catheter deployed within the body. The GUI generates and displays an image of the multiple electrode catheter. By manipulating appropriate controls, the medical personnel are able to change the orientation of the displayed image until it matches the orientation of the actual multiple electrode catheter as seen on a fluoroscope. Afterwards, the medical personnel can determine the relative position and orientation of the catheter by reference to the GUI generated image. To aid in interpreting data recovered by the catheter, the individual electrodes and splines are highlighted and labeled. Electrodes recovering particular types of physiological waveforms can be automatically identified and highlighted.
U.S. Patent Application Publication 2007/0083193 describes devices, systems and methods for the ablation of tissue. Embodiments include an ablation catheter that has an array of ablation elements including electrodes attached to a deployable carrier assembly, which are configured to ablate tissue at low power. The systems include an interface unit with a visual display that provides a visual representation of the geometry of the ablation elements and/or provides selection means for selecting an icon provided on the display. The user interface may be used to perform numerous functions including but not limited to: selecting electrodes to receive energy, setting power levels, types (bipolar and monopolar) and durations; setting catheter and other system threshold levels, setting mapping and other system parameters, initiating and ceasing power delivery, deactivating an alarm condition, and performing other functions common to electronic medical devices.

GUI for selective operation of multi-electrode catheters


A method (100) for depassivation of a battery (BATT) of a cash and valuables container (10) includes at least one electronically controllable component (14) and an associated control circuit (18) being supplied by the battery (BATT). The control circuit (18) executes at least one control procedure for the at least one electronically controllable component (14). The valuables container can be transportable, e.g. a cash box (10), and includes an invalidation unit, in particular an ink dyeing system (14). The control circuit (18) then also executes the depassivation (120) of the battery (BATT) each time before activating or deactivating the at least one control procedure (130) or a sub-routine thereof, such as the sub-routine for controlling and driving the ink dyeing system. Specifically, the depassivation of the battery (BATT) is performed before each first/initial execution of the least one control procedure (130).

1. Field of the Invention
The invention relates to a method for the depassivation of a battery of a valuables container which is equipped with a battery and comprises at least one electronically controllable component. The invention particularly relates to a portable container for cash and valuables, which is equipped with a invalidation unit for the valuables, such as bank notes, vouchers or the like, being transported by said container. Moreover, the invention relates to such a kind of valuables container which comprise a control unit/circuit that is configured to execute one or more control procedures for the at least one electronically controllable component, in particular control procedures for activation and deactivating of operating modes of the at least one component or of the invalidation unit.
2. Description of the Related Art
In the field of cash and valuables containers, especially of portable cash and valuables containers, such as cash boxes, it is known to equip them with battery-powered components which ensure, inter alia, a proper use of the respective cash and valuables containers and which prevent or hinder from manipulation and/or from attempted theft. For example, cash boxes are known which are equipped with invalidation means for the transported bank notes, vouchers or security documents, in particular with so-called ink dyeing systems or kits which dye the bank notes, if a manipulation of the cash box occurs, by using distinctive and not removable colored ink. Already by that the cash boxes are equipped with such ink dyeing kits, it can be achieved to impede manipulation and theft in a very efficient way.
EP 2 736 023 A1 discloses a cash box with means for monitoring its operating mode. The cashbox contains a receiving area or compartment for receiving bank notes or vouchers, a sensor unit for detecting tampering attempts, a memory element for storing data on information about attempted manipulation and a control unit for controlling the invalidation unit to possibly invalidate the bank notes irreversibly. In an activated operating mode of the cashbox, when a manipulation attempt has been detected, the control unit stores data with information about the manipulation attempt and also triggers the invalidation unit. In a deactivated operating mode of the cash box, however, the control unit does not trigger the invalidation and also does not store any data with information, even if a manipulation attempt occurs. The control unit, the invalidation unit and optionally further components are electrically powered by a battery, preferably by a lithium battery.
Due to the chemical structure of certain battery types, especially of lithium batteries, there may happen a passivation during the non-use/storage of the battery. This means that in a stored and unused battery a passivation film is formed which causes the clamp voltage of the battery to decrease under load and not to reach the nominal value, unless the passivation film in the battery will be removed by making more use of the battery. As long as a passivation film exists, the battery and thus the supplied device are both not fully operational. Usually, a depassivation of the battery is carried out manually by connecting a certain load (auxiliary load) to the battery terminals/clamps, in order to remove the passivation film before the battery is put into normal operation. However, this method is cumbersome and often takes a few minutes, what cannot be tolerated for many applications, such as the operation of cash boxes and valuables containers, because they should be ready to use at any time.
In the field of so-called back-up batteries, which are used for emergency power supply of larger facilities being connected to the electric supply network, methods for depassivation are known as those being disclosed in EP 0 948 828 B1.
The object of the invention is to provide a method for the depassivation of a battery of a cash and valuables container; the method shall overcome the above problems and in particular shall avoid the need to perform a manual, time-consuming and elaborate depassivation. In addition, a cash and valuables container shall be provided, the container comprising at least one electronically controllable and battery-operated component, and a control circuit which is configured to execute the depassivation method.

Method and device for depassivation of a battery of a cash and valuables container


A semiconductor device comprises a frame provided on a substrate to form a semiconductor-chip accommodating part on the substrate. A semiconductor chip is provided in the semiconductor-chip accommodating part. An organic insulating layer is provided to cover the semiconductor chip and the frame. A wiring layer is provided on the organic insulating layer. In the semiconductor device, the frame comprises gaps which are arranged in a longitudinal direction of the frame.

1. Field of the Invention
The present invention generally relates to a semiconductor device and method of manufacturing the same, and more particularly to a semiconductor device and method of manufacturing the same wherein one or more semiconductor chips are mounted on a substrate with high mounting density.
2. Description of the Related Art
In recent years, advanced features and miniaturization of electronic equipment are demanded, and, therefore, advanced features and miniaturization of semiconductor devices mounted on the electronic equipment are also needed simultaneously. For this reason, the technique in which many functions are given to a single semiconductor chip and one or more semiconductor chips having different functions are mounted on a carrier substrate or package is performed in order to attain multiple functions of the semiconductor chips.
The applicant of this invention has proposed in the following Japanese Patent Applications some techniques concerning semiconductor devices and manufacture methods thereof which attain multiple functions with two or more semiconductor chips mounted.
As one of them, Japanese Laid-Open Patent Application No. 2001-217381 discloses a semiconductor device and its manufacture method in which two or more semiconductor chips having different functions and arranged in proximity are provided, the reflow wiring layer which covers the semiconductor chips in common and connects the semiconductor chips mutually is formed thereon, and the electrode posts (copper) are formed on the reflow wiring layer.
Disclosed in Japanese Laid-Open Patent Application No. 2001-217381 are that the plural semiconductor chips interconnected by the reflow wiring layer are made into the integral structure, the back surfaces of the semiconductor chips are fixed onto the common carrier substrate (metal plate, etc.) to strengthen the integral structure, and the semiconductor chips with different sizes are laminated and the reflow wiring layer is formed to cover such semiconductor chips in common.
Moreover, disclosed is that the semiconductor chips and the electrode posts are mutually insulated with the resin respectively.
Moreover, FIG. 1A through FIG. 8B show a conventional semiconductor device and its manufacture method disclosed in Japanese Laid-Open Patent Application No. 2004-056093, in which two or more semiconductor chips the different functions are mounted on the substrate, and another semiconductor chip is further mounted on the semiconductor chips via the insulating layer.
In addition, each of FIGS. 1A, 2A, 3A, 4A, 5A, 6A, 7A and 8A is a plan view of the conventional semiconductor device, and each of FIGS. 1B, 2B, 3B, 4B, 5B, 6B, 7B and 8B is a cross-sectional view of the conventional semiconductor device taken along the line A-A indicated in the corresponding one of FIGS. 1A, 2A, 3A, 4A, 5A, 6A, 7A and 8A.
As shown in FIG. 1A, the first resin layer 2 is formed on the wafer 1 which is used as the carrier substrate. The first resin layer 2 is subjected to patterning in the shape of a frame and arranged so that the first component accommodating parts 3 are formed.
As shown in FIG. 2A, the first semiconductor chips 4 are respectively held in the first component accommodating parts 3.
The first semiconductor chips 4 are fixed to the wafer 1 using the adhesive agent 5. Subsequently, the first organic insulating layer 7 is formed to cover the first resin layer 2 and the first semiconductor chips 4. This state is shown in FIG. 3A. This first organic insulating layer 7 is arranged to cover both the top surface of the first resin layer 2 and the top surfaces of the first semiconductor chips 4 in common.
Subsequently, in the first organic insulating layer 7 of the 1st, the interlayer connections (vias) are formed at the positions corresponding to the pads 6 of the first semiconductor chips 4, and the first reflow wiring layer 8 is formed on the top surface of the first organic insulating layer 7. FIG. 4A shows the state where the reflow wiring layer 8 is formed.
Subsequently, as shown in FIG. 5A, the second resin layer 9 is formed on the first organic insulating layer 7 and the reflow wiring layer 8. There is provided almost in the center of the second resin layer 9 the second component accommodating part 11, and the vias 10 are formed in two rows near the second component accommodating part 11. A part of the first reflow wiring 8 formed on the first organic insulating layer 7 is exposed to the inside of the second component accommodating part 11, and the first reflow wiring 8 is exposed also to the bottom of the vias 10.
Subsequently, as shown in FIG. 6A, the second semiconductor chip 12 is held in the second component accommodating part 11. The second semiconductor chip 12 is fixed to the top surface of the first organic insulating layer 7 by the adhesive agent 5.
Subsequently, the second organic insulating layer 14 is arranged to cover the second resin layer 9 and the second semiconductor chip 12, and the second reflow wiring 15 is formed on the front surface of the second organic insulating layer 14 so that it is electrically connected to the first reflow wiring layer 8 through the vias 16 formed inside the vias 10. FIG. 7A shows the state where the second organic insulating layer 14 and the second reflow wiring 15 are arranged.
Subsequently, the covering film 17 which is made of the solder resist is formed on the second organic insulating layer 14, and the vias for arranging the external terminals 18 are formed on the covering film 17. The external terminals 18 and the second reflow wiring 15 are electrically connected together through these vias.
As shown in FIG. 8A, the semiconductor device is thus produced in which the plural semiconductor chips are accommodated in one package.
However, in the technique disclosed in Japanese Laid-Open Patent Application No. 2001-217381, the transfer molding method is used to encapsulate the two or more semiconductor chips in the resin. For this reason, a warpage may occur in the substrate (silicone) supporting the semiconductor chips at the time of curing of the resin for the encapsulation, and the occurrence of this warpage is seen more frequently when the two or more semiconductor chips are laminated on the substrate.
On the other hand, in the technique disclosed in Japanese Laid-Open Patent Application No. 2004-056093, the frame including the first resin layer 2 is arranged on the silicon wafer 1, and the semiconductor-chip accommodating part is formed.
However, when forming the first resin layer 2 selectively on the wafer 1, thermal shrinkage may arise in the first resin layer 2. This is shown in FIG. 9A, and the warpage arises at the corners A1 of the first resin layer 2, which may reduce the opening dimension at the corners.
For this reason, it is necessary to set up the opening dimension by taking into consideration the deformation of such corner parts.
Moreover, the first resin layer 2 is formed in the shape of a closed frame, and, when forming the first organic insulating layer 7, the air included between the first component accommodating parts 3 and the first semiconductor chip 4 may not be discharged appropriately. As shown in FIG. 10, there is a possibility that the voids 19 be formed in the lower part of the first organic insulating layer 7.
On the other hand, the vias 10 are formed in the second resin layer 9, and, if thermal shrinkage arises in the second resin layer 9, there is a possibility that the vias 10 are deformed in the direction X as shown in FIG. 11 or in the direction Y as shown in FIG. 12. Reference numeral 10a in FIG. 11 and FIG. 12 indicates the deformed vias.
Moreover, when forming the via opening 10 in the second resin layer 9, the bottom edges B1 of the via opening 10 may be sharp edges as shown in FIG. 13, and the difficulty in forming the seed layer (for example, copper) at the bottom edges B1 may arise.

Semiconductor device and method of manufacturing the same


A method of producing a powder metal material includes providing a metallurgical powder including at least one low alloy steel powder and 0.3 up to 1.0 weight percent carbon. At least portions of the powder are molded to provide compacts, and the compacts are then sintered at 1800xc2x0 F. to 2400xc2x0 F. The sintered compacts are hot formed and are subsequently heated to 1000xc2x0 F. to 2300xc2x0 F. and held at temperature for a predetermined time period. Material produced by the method may have tensile strength greater than 100 ksi, yield strength greater than 80 ksi, Rockwell C hardness of at least 20, and elongation greater than 2%, properties that are similar to ductile cast iron. Accordingly, parts produced by the method may be used in applications in which ductile cast iron parts are conventional. Such applications include, for example, parts for automotive engines and transmissions.

Not applicable.
Not applicable.
The present invention is directed to methods of producing materials from metallurgical powders and the materials provided by those methods. More particularly, the present invention is directed to methods of producing materials from metallurgical powders wherein the materials exhibit tensile strength greater than 100 ksi, yield strength greater than 80 ksi, Rockwell C (RC) hardness of at least 20, and elongation greater than 2%. Wrought materials commonly referred to as xe2x80x9cductile cast ironxe2x80x9d generally exhibit those properties and are commonly used in applications such as engine and transmission parts. Certain engine and transmission parts, such as ring gears and other transmission gears, require a combination of high tensile and yield strength to withstand the forces encountered in such applications, RC hardness of 20 or greater to provide suitable wear resistance with acceptable machinablity, and elongation greater than about 2% to ensure adequate resistance to impact loading. Powder metal materials may be prepared by methods within the present invention with ductile iron-like properties and may be used in certain applications as substitutes for conventional ductile cast iron parts. More particularly, materials may be prepared by methods within the present invention having tensile strength greater than 100 ksi, yield strength greater than 80 ksi, Rockwell C (RC) hardness of at least 20, and elongation greater than 2%
Ductile cast iron, also known as nodular iron or spheroidal-graphite cast iron, is cast iron that includes graphite in the form of tiny spheres or nodules. Because of additives introduced into the molten iron before casting, the graphite grows as spheres rather than as the flakes characteristic of gray iron. Ductile cast iron is much stronger and has higher elongation than gray iron, and it may be considered a natural composite in which the spheroidal graphite imparts unique properties to the material. Typical properties of ductile cast iron include tensile strength greater than 100 ksi, yield strength greater than 80 ksi, RC hardness of about 20, and elongation greater than 2%.
The relatively high strength and toughness of ductile cast iron provide advantages over gray in many structural applications. Such applications include, for example, automotive engine and transmission parts. Ductile cast iron can be produced to X-ray standards because porosity typically stays in the thermal center of the material.
Production of parts from ductile cast iron has many attendant difficulties. Greater metallurgical and process control is required in producing parts of ductile cast iron than in producing parts of other cast irons. Repeated chemical, mechanical, and metallurgical testing is needed to ensure that the required quality is maintained and that specifications are met. Producing ductile cast iron also requires carefull selection of charge materials, which must be free of undesirable residual elements. For example, carbon, manganese, silicon, phosphorous, and sulfur must be held at specified levels. Levels of magnesium, cerium, and certain other elements also must be controlled in order to attain the desired generally spherical graphite shape and to prevent the deleterious effects resulting from the presence of elements such as antimony, lead, titanium, tellurium, bismuth, and zirconium. The latter elements interfere with the graphite nodulizing process, and they must be either eliminated or restricted to very low concentrations.
An inherent limitation of ductile cast iron is that parts are produced of the material by casting. The casting of parts having intricate shapes is difficult, and significant machining or other finishing operations typically are required to prepare ductile cast iron parts in final form. Thus, although ductile cast iron provides significant advantages, primarily in terms of strength and elongation, it is difficult and time-consuming to prepare parts from the material on a commercial scale.
Accordingly, the need exists for methods of advantageously producing material and parts on a commercial scale having properties similar to ductile cast iron. A need also exists for materials having properties similar to ductile cast iron and which are produced by methods other than the casting of molten materials.
In order to address the above-described needs, the present invention provides a novel method for producing a material from metallurgical powder. The method may be adapted to provide materials having tensile strength greater than 100 ksi, yield strength greater than 80 ksi, Rockwell C (RC) hardness of at least 20, and elongation greater than 2%, properties typically exhibited by ductile cast iron. The method includes the step of providing a metallurgical powder that includes at least one low alloy steel powder and 0.3 up to 1.0, preferably 0.4 up to 0.65, weight percent carbon in elemental, alloyed, or another form. At least a portion of the metallurgical powder is molded under pressure to provide a compact, and the compact is sintered at a temperature in the range of 1800xc2x0 F. to 2400xc2x0 F. and below the melting temperature of the compact, preferably for 10-60 minutes, to bond together the powder particles and provide a sintered compact. The sintered compact is subsequently hot formed. The hot formed compact is heated to a temperature in the range of 1000xc2x0 F. to 2300xc2x0 F. and below the melting temperature of the compact to re-sinter the compact. The hot forming and the subsequent re-sintering steps may work in conjunction to provide the material with the ductile iron-like properties.
According to another aspect of the invention, the invention is directed to a method for providing a material from metallurgical powder wherein the method includes providing metallurgical powder that includes at least one low alloy steel powder and 0.4 up to 0.65 weight percent carbon in elemental, alloyed, or another form. A compact is formed by pressing at least a portion of the powder in a mold at 20 to 70 tsi. The compact is heated to a temperature greater than 1800xc2x0 F. and less than the melting temperature of the metallurgical powder to bond the metallurgical powder and form a sintered compact. The sintered compact is further compressed in a heated die at 20 to 80 tsi while the compact is at a temperature of 1400xc2x0 F. to 2000xc2x0 F., and the compact may then be cooled. The compact is subsequently heated to a temperature of 1000xc2x0 F. to 2300xc2x0 F. and below the melting temperature of the compact. The compact is then cooled to ambient temperature.
Additional aspects of the present invention are directed to materials produced by a method of the invention and articles of manufacture composed of or including such materials. Materials of the present invention find broad application and, as an example, may be used to form automotive engine and transmission parts such as, for example, ring gears and other gears, pinions, rollers, slides, valves, output shaft hubs, and reaction hubs.
As used herein, xe2x80x9cmetallurgical powderxe2x80x9d refers to a particulate material including one or a combination of several particulate metal-containing materials. Thus, a metallurgical powder as used herein may include constituents including, for example, pure iron powder, other pure metal powders, and/or iron alloy or other alloyed powders, and also may include additive powders such as graphite, lubricants, additives enhancing wear resistance, and other additives enhancing one or more properties of the final material. As used herein, xe2x80x9csinteringxe2x80x9d has the meaning generally ascribed to that term by those of ordinary skill in the art and generally refers to heating a material composed of powder particles at a temperature of at least 70% of and lower than the melting temperature of the material, typically in a protective atmosphere, for a time so as to bond the powder particles. In the case of iron-base powder metal parts, for example, sintering typically involves heating the parts at temperatures within the range of 1800-2400xc2x0 F. for 10-60 minutes. xe2x80x9cRe-sinteringxe2x80x9d conventionally refers to subjecting a powder metal part which has already been sintered to a second thermal cycle, typically, but not necessarily at for times and temperatures within the ranges of the earlier sinter. As used herein, a xe2x80x9clow alloy steel powderxe2x80x9d refers to particulate material composed predominantly of iron and including one or more alloying ingredient in individual amounts less than about 10% by weight of the particulate material
Material may be produced by a method of the present invention having properties similar to ductieast iron, but without a number of the attendant difficulties of producing the cast material. Powder metal material provided by the method of the present invention may have, for example, high tensile strength (greater than 100 ksi), yield strength in excess of 80 ksi, RC hardness of at least 20, and elongation greater than 2%. Thus, material produced by a method of the present invention may be used in many applications formerly filled by conventional ductile cast iron material or by other materials having the foregoing properties. Powder metallurgy production techniques utilized in the present method obviate many of the difficulties encountered with casting techniques. Also, because the properties of material produced by a method of the present invention do not depend on the presence of spherical graphite generated during freezing from the melt, the close control of material chemistry is not so critical.
The reader will appreciate the foregoing details and advantages of the present invention, as well as others, upon consideration of the following detailed description of embodiments of the invention. The reader also may comprehend additional advantages and details of the present invention upon carrying out or using the invention.

Method for producing powder metal materials


The present invention provides a transmitter conforming to the EER method in a wide frequency band at high efficiency. For this purpose, the amplitude component of a modulated signal is input to the power supply terminal of a high-frequency power amplifier 130, the I and Q quadrature signals thereof are input to the high-frequency input terminal of the high-frequency power amplifier 130, and the original modulated signal is obtained from the output of the high-frequency power amplifier 130. A collector voltage is supplied from DC—DC converter group 615 having output voltages being different sequentially to an emitter follower 729 via a switch group 621. One of the outputs of the DC—DC converters 616 to 620 is selected depending on the level of the amplitude component as the collector voltage and supplied to the emitter follower, whereby the difference between the emitter voltage of he emitter follower 729 and the collector voltage of the emitter follower 729 is made smaller and the efficiency of the emitter follower 729 is raised; furthermore, the power supply voltage of the high-frequency power amplifier 130 is voltage-converted by the emitter follower 729, whereby operation in a wide frequency band is made possible.

In a modulated signal subjected to voltage conversion, in particular, a modulated signal subjected to multi-level modulation, such as QAM (Quadrature Amplitude Modulation), linear operation is required in a high-frequency power amplifier for transmitting power to an antenna. Hence, class A or class AB has been used as the operation class of the high-frequency power amplifier.
However, as broadband communication is promoted, a communication system that uses subcarriers, such as OFDM (Orthogonal Frequency Division Multiplex), has begun to be used; hence the conventional class-A or class-AB high-frequency power amplifier cannot be expected to attain high efficiency. In other words, in OFDM, subcarriers are overlapping, whereby high power is generated instantaneously at random. That is to say, the ratio PAPR (Peak to Average Power Ratio) of the instantaneous maximum power to average power is high. Hence, in order that a high-frequency signal having this kind of high power can also be amplified linearly, it is necessary to hold high DC power at all times. The power efficiency of the class-A operation is only 50% at the maximum; in particular, in the case of OFDM, since PAPR is high, the power efficiency is only about 10%.
For this reason, in the case of a portable wireless transmitter wherein batteries are used as a power supply, its operable time is short, thereby causing a problem in practical use.
In order to solve this kind of problem, the conventional EER (Envelope Elimination and Restoration) method has been proposed, which is known as Kahn's method (for example, see U.S. Pat. No. 6,256,482B1 (FIG. 6 on page 3 of the drawings)).
FIG. 6 is a block diagram showing the schematic configuration of the EER method. In FIG. 6, a high-frequency modulated signal 46, such as a QAM signal, input to a terminal 40, is divided into two branches; in one of the branches, the modulated wave 46 is subjected to envelope detection by a detector 41, whereby an amplitude component signal is generated. A power supply voltage Vdd is voltage-converted by a voltage converter (an amplifier for amplifying the amplitude component) 42. At this time, a class-S amplifier (a switching regulator or the like) capable of operating at high efficiency (up to 95%) is used as the voltage converter 42. In the other branch, the amplitude of the modulated wave 46 is controlled by an amplitude control amplifier (limiter 43), whereby a modulated wave having only phase information is obtained. The modulated wave having the phase information is input to the RF input terminal of a switch-type amplifier 44, whereby, for example, the gate voltage of a field-effect transistor, an element of the switch-type amplifier 44, is modulated.
The switch-type amplifier is herein a class-F amplifier wherein harmonics are controlled so that the waveform of the drain voltage becomes rectangular, or a class-E or class-D amplifier wherein load conditions are optimized so that the waveform of the drain voltage and the waveform of the drain current do not overlap each other.
The conventional class-A amplifier has a period in which the drain voltage and the drain current are generated simultaneously, thereby consuming power. On the other hand, in the switch-type amplifier 44, such a period in which the drain voltage and the drain current are generated simultaneously is made as short as possible, whereby power consumption can be reduced.
When a DC power of 200 mA and 3 V is supplied, for example, the DC power is 600 mW. When the switch-type amplifier 44 is OFF, no current flows and only the voltage Vdd is applied; hence DC power consumption is zero. On the other hand, when ON, a current of 200 mA flows; however, since the transistor conducts completely, the voltage VDS between the drain and the source can be assumed to be about 0.3 V at most. In this case, a DC power of 0.3×0.2=0.06 W, that is, 60 mW, is consumed inside the transistor. The power efficiency reaches a very high value of (600 −60)/600=90%. This effect is significant since the power efficiency of the class-A amplifier is only 50% at the maximum.
In other words, high power efficiency is attained by using the switch-type amplifier. However, since the switch-type amplifier is a nonlinear amplifier, the switch-type amplifier cannot be used because a modulated signal, such as the QAM signal, in which the amplitude level of the modulated wave changes, is required to be amplified linearly.
In order to solve this problem, the EER method separates a signal including amplitude information into an amplitude component and a phase component, and only the phase component is amplified by the switch-type amplifier. When the amplitude component is input to the power supply terminal of the switch-type amplifier, output power proportionate to the amplitude component is obtained; hence, a signal including the original amplitude information is reproduced eventually.
With this configuration, a highly efficient amplifier, such as the switch-type amplifier, although nonlinear, can be used, whereby high efficiency can be attained.
However, since the frequency band of the voltage converter 42 (for example, a switching regulator) for modulating the amplitude component is 5 MHz at most, the conventional EER method cannot be used in the modulated wave frequency band width of 20 MHz stipulated in the IEEE802.11a Standard, a wireless LAN standard.
In order that the frequency band is widened, it is necessary to decrease the inductance of the low-pass filter incorporated in the output of the voltage converter 42. However, since the Q value of the inductance is lowered, the amount of heat consumed by the inductance becomes unignorable, and the efficiency of the voltage converter 42 lowers. In addition, noise increases.
Furthermore, in the case when a series regulator is used as the voltage converter 42, the product of the amount of voltage conversion (the difference between the power supply voltage and the voltage of the amplitude component) of the series regulator and the drain current of the high-frequency power amplifier is power consumption. In OFDM, the average voltage value of the amplitude component is not more than a half of the power supply voltage; hence, high efficiency is not attained even in this case.

Matsushita Electric Industrial Co., Ltd.


The present invention relates to a remote monitoring method comprises the steps of                monitoring an occurrence of an event, providing a signal to a wireless module in response to the occurrence of the event,        sending a wireless application protocol request being indicative of the occurrence of the event to a first gateway, converting the wireless application protocol request to a first hypertext transfer protocol request, sending of the first hypertext transfer protocol request to a server, determining at least one receiver address for the first hypertext transfer protocol request by the server,        sending of a second hypertext transfer protocol request from the server to a second gateway, sending of a wireless application protocol service loading message to the at least one receiver from the gateway.

Various remote premise-monitoring alarm systems are known from the prior art. For example, U.S. Pat. No. 5,745,849 shows a combination of a cordless telephone and a premise-monitoring alarm system which has a base unit, a cordless handset and one or more remote alarm detectors.
The alarm detectors can be generally either smoke detectors, motion detectors, or open-entry detectors. The base unit includes at least one interface for the public telephone network, and another interface for radio communication with the cordless handset. The base unit preferably also communicates with the remote alarm sensors across the same radio interface. The base unit includes telephone call circuitry to relay telephone calls between the public telephone network and the handset. The base unit also includes alarm processing circuitry to send an alarm warning to a central alarm-monitoring station in response to an alarm signal from a remote detector. The base unit has control circuitry that is configured such that if, during a telephone call, the base unit is given an alarm signal, the base unit will either (i) hang up the telephone call and call up the central alarm-monitoring station to give warning, or (ii) call up the central alarm-monitoring station on a second telephone line.
U.S. Pat. No. 6,271,752 shows a multi-access remote monitoring system for monitoring of a security surveillance area. The security surveillance area comprises a local computer system, a network interface, and a camera having a motion sensor. The local computer system is electronically connected via a camera adapter to the video camera so that video, sound, and motion sensor data can be transmitted from the camera to the local computer system, and instructions or other data can be transmitted from the local computer system to the camera. The local computer system is additionally connected to a computer network interface, which may be a modem, network card, or other communications hardware, used to connect to the communications network. The local computer system includes various components, including an audio/video coder/decoder, fixed storage means, operating system software, communications software, compression software, and application programming interface (API) software.
It is a common disadvantage of prior art remote monitoring systems that special, dedicated hardware is required at the site which is monitored. The present invention therefore aims to provide an improved remote monitoring method and system which enables to limit the hardware expenditure for the surveillance zone.