A plurality of sub word lines each have a length equivalent to the division of a main word line along the extension direction thereof, arranged along a bit line crossing said main word line, and are connected with a plurality of memory cells. A first sub word select line arranged in parallel to the main word line is extended to a plurality of sub arrays arranged in the extension direction of the word line. A second sub word select line is connected to the corresponding one of said first sub word select line to be extended orthogonally to a word line driving circuit area of an adjacent sub array. In the sub word line driving circuit provided for each sub array, a sub word line is selected and deselected by signals supplied from said main word line and said second sub word select line.

The present invention generally relates to a dynamic RAM (Random Access Memory) and, more particularly, to a technique which is effective for use in a dynamic RAM based on divided word line design having a main word line and a sub word line for example.
A divided word line design has been proposed in which a plurality of sub word lines, to which memory cells are connected, for a main word line, are arranged to operate only a memory block in which a memory cell to be selected is arranged, to minimize the memory area to be operated, so as to achieve reduced power consumption and increased speed in a selecting operation of the sub word lines to which memory cells are connected. One example of this divided word line design is disclosed in Japanese Unexamined Patent Publication No. Hei 2-158995. A method of arranging a signal line for sub word selection is disclosed in U.S. Pat. No. 5,359,572.


The disclosed invention is a novel method for constructing an Arcuate Common Vertex Spring Damper System, that can either be used as a single spring for a torsional vibration application or be used in pairs as a Dual Arcuate Common Vertex Spring Dampers System. Both these constructions yield significant improvements over the conventional Common Vertex and Dual Common Vertex seen in prior art, such as promoting a radially tighter packaging envelop, allowing the resulting device to be tuned across a greater torsional frequency range, and improving the modal decoupling response of the resulting device.

Vibrating shafts have torsional vibrations inherent due to their non-uniform construction (e.g. crankshafts, and camshafts), or the nature of the driving mechanism employed (e.g. firing order of an internal combustion engine, or type of gearing), or the method employed for their connection to another shaft (e.g. through a universal, or a constant-velocity joint). These torsional vibrations if left unattended, reach a peak amplitude when their exciting frequency coincides with the natural torsional frequency of the shaft. This phenomenon known as resonance can cause premature fatigue failure of the shaft or can be felt as undesirable noise or vibration by a vehicle or machine operator.
Torsional Vibration Dampers (TVDs) are commonly employed to attenuate such undesirable vibrations. The objective of a TVD is to break the vibratory amplitude peak at resonance to two (or more) smaller peaks which have sufficiently reduced amplitudes that can be sustained by the shaft.
Most often, a TVD consists of a metallic bracket called the hub that rigidly attaches to the vibrating shaft. An active metallic inertial component called the ring that provides the inertial system, and an elastomeric member that connects the hub and the ring and provides the requisite spring-damper system. The TVD is tuned (by adjusting inertia, and spring-stiffness) such that the TVD attenuates the torsional vibrations of the shaft at resonance by vibrating at the same frequency but exactly out of phase with the vibrating shaft, thereby essentially cancelling the vibration.
Most commonly, two elastomer geometric configurations are utilized in TVDs: (1) when the elastomer is oriented parallel to the Axial Center Line (ACL) of the TVD (axial construction); and (2) when the elastomer is oriented orthogonal to the ACL of the TVD (radial construction). In radial constructions, a bonded Common Vertex (CV) design is generally used for three main reasons: (1) it enables the first mode-shape of the TVD to be torsional; (2) it enables the TVD to be have adequate modal decoupling (separation of the torsional mode from the non-torsional modes); and (3) it enables a relatively consistent strain profile through the cross-section of elastomer during the application. For the remainder of the disclosure, only the radial construction will be discussed as the invention falls into this design category.
FIG. 1 illustrates a conventional radially constructed TVD that is employed in the industry today. Such a TVD has three components: a hub 1a that is usually a cast-and-machined, stamped, or a spun metallic component, an inertia ring 2a that is usually a cast-and-machined component that may have a poly-vee, v-groove, or any other feature, on its outermost radial periphery to receive a belt, and a bonded elastomer ring 3a that holds hub 1a and ring 2a mutually in place while simultaneously providing the spring-damper system for the TVD. The elastomer member 3a, is mold-bonded by applying a primer-adhesive combination to the corresponding mating surfaces of hub 1a and ring 2a and either injection or transfer-molding the elastomer 3a between hub 1a and ring 2a.
The reason the device illustrated in FIG. 1 is known to employ a CV design is because by linearly extending the two axially bounding surfaces of elastomer 3a (i.e. the surfaces that are bonded to the hub and the ring) a CV is obtained at ACL 4a. This subtle but key feature is essential for the TVD to function properly as explained above.
FIG. 2 illustrates another conventional radially constructed TVD that uses a set of a pre-molded Dual-CV (DCV) elastomer members. Here, the compound ring is constructed using two mating pieces 21b and 22b that are connected by a plurality of shoulder bolts 5b. Elastomer members 3b and 3b′ axially bound the centrally located hub 1b on either side and are compressed by the preload exerted due to tightening the shoulder bolts 5b and bringing the two pieces 21b and 22b of the compound ring in rigid mutual contact. The elastomer surfaces 31b, 32b, 31b′, and 32b′ are offset axially outward to their corresponding mating surfaces on the hub 1b and compound ring comprising of pieces 21b and 22b, before assembly. Thus, allowing the elastomer members 3b and 3b′ to be axially compressed by a uniform amount through their radial lengths (usually between 10% to 40%) after assembly.
Linearly extending the axially bounding surfaces 31b and 32b of elastomer member 3b produces a CV 33b at ACL 4b. Similarly, linearly extending the axially bounding surfaces 31b′ and 32b′ of elastomer member 3b′ produces a CV 33b′ at ACL 4b. This construction allows the TVD to be held together mechanically without necessitating bonding between elastomer members 3b and 3b′ with hub 1b or with the two pieces 21b and 22b of the compound ring. The working of the DCV design is essentially the same as utilizing two CV springs in parallel.
Prior art exists where the ring and the hub exchange positions. There the hub has a compound structure comprising of 2 pieces that axially compresses the elastomer while the ring comprises of a one-piece structure and is centrally located between the two elastomer members. This essentially yields the same DCV configuration as illustrated in FIG. 2 with the positions of the hub and ring interchanged. Furthermore, prior art exists that teaches different methods of compressing the elastomer apart from shoulder bolts, including but not limited to press-fitting, roll-forming, using standard fasteners etc. These also, essentially yield the same DCV configuration as illustrated in FIG. 2.
FIG. 3 illustrates a cross-section of a conventional TVD using the most common CV construction, where surface 31c, and surface 32c of elastomer member 3c form a CV 33c at ACL 4c. Here surface 31c that is bonded to hub 1c is orthogonal to ACL 33c while surface 32c that is bonded to ring 2c is inclined to ACL 33c. This construction may be reversed where surface 31c is inclined to ACL 33c while surface 32c is orthogonal to the ACL 4c.
FIG. 4 illustrates the cross-section of a conventional TVD using an alternate CV construction, where surface 31d, and surface 32d of elastomer member 3d form a CV 33d at ACL 4d. Here surface 31d that is bonded to hub 1d and surface 32d that is bonded to ring 2d are both inclined to ACL 4d. This construction may be such where the angles of inclination are symmetric (both angles are equal) or where the angles of inclination are asymmetric (both angles are different).
In all the prior-art that has been discussed up to this point, it can be appreciated that there is essentially one resulting geometric feature: the radial cross-cross-sectional area of the elastomer spring increases linearly proportionately with its radial distance from the ACL. This is because, when the TVD works a vibratory application, the ring angularly deflects with respect the hub. Elastomer at the outermost radial periphery undergoes larger strain than the elastomer at the innermost radial periphery for the same angular deflection. Therefore, to ensure a uniform strain buildup through the elastomer section and enhance the fatigue life of the elastomer such a proportionality is desired. This is the essence of a CV construction.
The rigid geometric constraints of CV or DCV constructions make them cumbersome to package in a radially limited envelope. Both these constructions yield a very limited range for tuning the TVD to a torsional frequency, generally making them suitable only for low frequency applications. Furthermore, modal-decoupling of such TVDs is complicated as the torsional and radial modes of vibration are difficult to mutually separate. This is because they are both concerned with the shear stiffness of the elastomer spring and tend to overlap in frequency.
A radially constructed design that can fit in a radially smaller packaging envelope, that allows a greater torsional tuning range, and improves modal decoupling is needed.

Arcuate common vertex and dual arcuate common vertex spring damper systems


In a CMOS image sensor manufacturing process, heavily doped p type impurity ions (for example, B) are implanted in a dummy moat region when the heavily doped p type impurity ions is implanted in a PMOS transistor region, so that metal ion contamination is removed. Accordingly, a CMOS image sensor capable of reducing a leakage current by gettering metal ion contamination is provided.

1. Field of the Invention
The present invention relates to an image sensor, and more particularly, to a CMOS image sensor capable of reducing a leakage current by gettering metal ion contamination by implanting p type impurity ions in a dummy moat region and a method of manufacturing the CMOS image sensor.
2. Description of the Related Art
In general, image sensors are a semiconductor device for converting an optical image to an electrical signal. Among the image sensors, a charge coupled device (CCD) is a device in which individual MOS (Metal-Oxide-Silicon) capacitors are closely disposed to each other, and charge carriers are stored in the capacitors.
A CMOS image sensor is a switching type device in which MOS transistors corresponding to the number of pixels are formed by using a CMOS technique employing a control circuit and a signal processing circuit as peripheral circuits and outputs are sequentially detected.
In the CCD device the driving mechanism is complicated and power consumption is large. In addition, since the number of mask process steps is large, the process to fabricate it is complicated. Since a signal processing circuit cannot be disposed in the CCD chip, it is also difficult to form the CCD device in form of one Chip. Recently, in order to solve the aforementioned problems, a CMOS image sensor using a sub-micron CMOS manufacturing technique has been researched and developed.
The CMOS image sensor is constructed by disposing a photodiode and a MOS transistor in each of unit pixels and sequentially detects signals in the switching scheme to form an image. Since the CMOS manufacturing technique is used, power consumption is small. In addition, since the number of masks is about 20, the process is very simple in comparison to the CCD process requiring 30 to 40 masks. Various signal processing circuits can be constructed on one chip. Therefore, attention has been paid to the CMOS image sensor as a next-generation image senor. The CMOS image sensor has been widely used in many applications such as DSCs (Digital Still Cameras), PC cameras, and mobile cameras.
A conventional method of a CMOS image sensor will now be described in detail with reference to the accompanying drawings.
FIGS. 1A to 1G are cross sectional views of a semiconductor device showing a conventional method manufacturing a CMOS image sensor.
As shown in FIG. 1A, element isolation films 32 are formed in a field region of a semiconductor substrate 31 having an active region, the field region, and a dummy moat region.
Here, the element isolation film 32 is formed by using an STI (Shallow Trench Isolation) process for etching the field region of the semiconductor substrate 31 in a predetermined depth to form a trench and burying an insulating material in an inner portion of the trench.
The active region includes a PMOS transistor region and a NMOS transistor region, and a photodiode region is defined in the NMOS transistor region.
Next, a photodiode 33 is formed by implanting impurity ions having a conductivity type opposite to that of the semiconductor substrate 31 in the photodiode region of the semiconductor substrate 31.
Next, after a first photosensitive film 34 is applied on the entire surface of the semiconductor substrate 31, the first photosensitive film 34 is patterned so as to mask the PMOS transistor region excluding the NMOS transistor region the dummy moat region by using exposing and developing processes.
Subsequently, by using the patterned first photosensitive film 34 as a mask, p type impurity ions are implanted in the entire surface of the semiconductor substrate 31 to form a P-well region 35 in the NMOS transistor region and the dummy moat region.
As shown in FIG. 1B, the first photosensitive film 34 is removed, and after a second photosensitive film 36 is applied to the entire surface of the semiconductor substrate 31, the second photosensitive film 36 are selectively patterned so as to open the PMOS transistor region by using exposing and developing processes.
Next, by using the patterned second photosensitive film 36 as a mask, n type impurity ions are implanted in the PMOS transistor region to form the N-well region 37.
As shown in FIG. 1C, after the second photosensitive film 36 is removed, a gate insulating film 38 and a gate-electrode polysilicon film are sequentially formed on the semiconductor substrate 31.
Next, the poly silicon film and the gate insulating film 38 are selectively etched to form a gate electrode 39 in the semiconductor substrate 31 in the PMOS transistor region and the NMOS transistor region.
Next, after a third photosensitive film 40 is applied on the semiconductor substrate 31, the third photosensitive film 40 are selectively patterned so as to open the NMOS transistor region and the dummy moat region by using exposing and developing processes.
Next, by using the patterned third photosensitive film 40 as a mask, n type impurity ions are implanted in the P-well region 35 and the dummy moat region to form a lightly doped n type impurity region 41.
As shown in FIG. 1D, the third photosensitive film 40 is removed, and after a fourth photosensitive film 42 is applied to the entire surface of the semiconductor substrate 31, the fourth photosensitive film 42 is selectively patterned so as to open the PMOS transistor region by using exposing and developing processes.
Next, by using the patterned fourth photosensitive film 42 as a mask, lightly doped p type impurity ions are implanted in the N-well region 37 to form a lightly doped p type impurity region 43.
As shown in FIG. 4E, the fourth photosensitive film 42 is removed, and after an insulating film is deposited on the entire surface of the semiconductor substrate 31, an etchback process is performed to form insulating film sidewalls 44 on both sides of the gate electrode 39.
Next, after a fifth photosensitive film 45 is applied to the entire surface of the semiconductor substrate 31, the fifth photosensitive film 45 is selectively patterned so as to open the NMOS transistor region by using exposing and developing processes.
Subsequently, by using the patterned fifth photosensitive film 45 as a mask, heavily doped n type impurity ions (for example, As) are implanted in the P-well region 35 and the dummy moat region to form the heavily doped n type impurity region 46 and an N+ region 47 simultaneously.
As shown in FIG. 1F, the fifth photosensitive film 45 is removed, and after a sixth photosensitive film 48 is applied to the entire surface of the semiconductor substrate 31, the sixth photosensitive film 48 is selectively patterned so as to open the PMOS transistor region and the dummy moat region by using exposing and developing processes.
Next, by using the patterned sixth photosensitive film 48 as a mask, heavily doped p type impurity ions are implanted in the N-well region 37 to form the heavily doped p type impurity region 49.
As shown in FIG. 1G, after the sixth photosensitive film 48 is removed, a thermal treatment process is performed on the semiconductor substrate 301 to activate the impurity ions implanted in the semiconductor substrate 31.
In the following processes (not shown), a plurality of interlayer insulating films, metal wire lines, color filter layers, and micro lenses are formed on the semiconductor substrate 31, so that an image sensor is manufactured.
In the method of manufacturing the CMOS image sensor in the aforementioned conventional technique, there is the following problem.
Since the heavily doped n type impurity ions are implanted in the dummy moat region, gettering effect for the metal ions is too small to reduce the leakage current.

CMOS image sensor and method of manufacturing the same


A rolling apparatus has a frame and a first eccentric journal sleeve mounted on the frame, defining a first axis, and having axially inner and outer ends. A first shaft journaled in the sleeve has respective inner and outer ends at the first-sleeve inner and outer ends. The first-shaft outer end projects axially from the frame and carries a workpiece-deforming first roller. A rocker is displaceable transversely of the axis on the frame and carries a second eccentric journal sleeve defining a second axis generally parallel to the first axis and having axially inner and outer ends. A second shaft journaled in the second sleeve has respective inner and outer ends at the second-sleeve inner and outer ends. The second-shaft outer end also projects axially from the frame and carries a workpiece deforming second roller forming with the first roller a workpiece-receiving nip. Respective first and second drive gears engaging the respective first and second shafts between the respective ends rotate same about the respective axes. an actuator having a radially displaceable element urges the rocker radially toward the first axis and for holding the first and second axes at a predetermined spacing from each other at the outer ends.

A standard rolling stand, for instance for reducing rod or bar stock, has a frame and first and second journal sleeves or chocks mounted on the frame, defining respective axes, and having axially inner and outer ends. Respective first and second shafts journaled in the sleeve have respective inner and outer ends at the sleeve inner and outer ends with both of the outer ends projecting axially from the frame. Workpiece-deforming first and second rollers are mounted cantilevered from the frame on the shaft outer ends. Respective first and second drive gears engage toothed portions of the first and second shafts between the respective ends for rotating same about the respective axes.
The advantage of this system is that the cantilevered workpiece-deforming rollers are highly accessible, making it easy to use the apparatus. Normally these rollers are of small diameter and are made of very hard material. Thus they can be rotated at high speed to deform the workpiece while using a relatively low pressure.
The main disadvantage of this system is that, since the rollers are only supported to one side of the nip, their relative positions are hard to control accurately. Thus such a rolling apparatus is good for roughing, but cannot normally be used to produce a workpiece of a caliber within a tight tolerance range.

Eccentric-journal mount for rolling-frame support shafts


The invention encompasses a fabric book with high resolution sublimation printed images and a method of making such a fabric book. The fabric book of the invention has a plurality of fabric pages. The fabric pages are made of a synthetic material with an original softness corresponding to the synthetic material. At least one fabric page has a high resolution sublimation printed image imprinted using the method of the invention. The fabric page with the high resolution image substantially retains the original softness, even after printing.

It is well known that in the first few months of life a baby will respond to high contrast images (which are images where there is significant tonal gradation between the highlights, midtones, and shadows) and then, as the baby matures, to full front views of actual faces of people and anthropomorphic animals. As the baby matures from an infant to a toddler, the baby will rapidly learn to recognize familiar views of humans, animals, and everyday objects. The developmental response to realistic images, particularly photographic images, has been shown to be linked in the first few weeks and months of life to the maturation of the eye and brain, and then, thereafter, to the baby's general overall cognitive skills. Images also stimulate infants' and toddlers' emotional responses and hand-eye coordination. Images used for such visual stimulation include graphics, but as the babies age beyond three months they can recognize lower contrast images and higher definition photographs. Thus, these types of images are preferred for older babies.
Such images many times are presented in a book format. The book format offers convenience (i.e., numerous images compiled together in a flat and easy to see format), and potential educational benefits (i.e., an introduction to books, which may foster a desire to read in the future).
Children's books come in board (paper), soft plastic, wood, or fabric. Board books generally offer higher resolution graphics than the other types of books but, many times, the graphics are presented in a way that does not effectively stimulate a response from babies. For example, many photographs are too complex, taken from unfamiliar angles, do not have sufficiently high contrasts, or do not have sufficiently high resolution. Even when the board books contain photographs that are effectively stimulating, board books are not ideal for infants and toddlers because they have sharp corners, are not easily disinfected, and are generally heavy. In addition, babies have a tendency to grab and chew anything they can get their hands on, or their mouths to. This includes books. When a baby chews a board book, the edges of the board will start to disintegrate, and once the board breaks down, it will become a choking hazard.
Wood books comprise thin wooden pages with printed images. Wood books typically have holes in them such that the individual pages may be bound with string or plastic. Wood books are heavy and can be dangerous. Image quality on wood books is limited to silk-screen printing techniques or heat transfers where the transferred images do not sublimate into the wood. Because the ink does not sublimate into the wood, it can be scratched off, creating potential a choking hazard.
Plastic books comprise sheets of thin polyvinyl or similar plastic, and are typically used as "bath books." The sheets may be printed and heat sealed around a foam filling. Plastic books, as with board books, tear and degrade into small parts. The plastic material is not soft. The image resolution on the plastic sheets is limited to silk screen mass production resolutions in the order of 120 dots per inch (dpi), although they can run higher (e.g., 300 dpi) at slower mass production speeds. However, there is significant dot gain, which reduces image contrast. Images can be applied through heat transfer, but not sublimation. To ensure that transferred images are not scratched off, the images are typically printed on the inside of the plastic. The result is that the plastic "clouds" the contrast of the image.
In contrast to the above-mentioned books, typical fabric books are lightweight, soft, disinfect easily by washing, and substantially maintain their integrity after repeated handling. As a result, fabric books are ideal for babies. However, attempts to provide high resolution graphics in fabric books using current technology encounter significant drawbacks. The main drawback is that current printing technology used for printing on fabrics, i.e., photo transfer, silk screening, and offset printing, causes the ink material to lie on top of the fabric and/or stiffen the printed fabric surface. A fabric book made by one of those processes may contain high resolution printed images, but the resulting book loses the benefit of having the soft fabric, is more difficult to wash, and presents an additional hazard to a baby from the flaking of the ink over time.
Another current printing technology for fabric books, sublimation printing, overcomes these drawbacks and keeps the fabric soft but has other drawbacks, including significant alteration of the color balance of the original art, and significant degradation of the resolution and color balance of the printed image due to the woven texture and light reflectance of printed fabrics. The fabric of a fabric book made by this process substantially maintains its original softness after printing, but the printed images are not high resolution images.
Therefore, there is a need for a fabric book with high resolution printed images that substantially maintains its original softness after printing. There is also a need for a method of printing high resolution images in fabric (particularly fabric used in fabric books) that allows the printed fabric to substantially retain its pre-printed softness and be safely handled and manipulated.

Soft fabric book with high resolution images and method of making same

Abstract: The preferred method of creating the high resolution images in the fabric books begins with selecting an appropriate original object. A digital rendition of the original object is created. The digital rendition is edited to create an edited image with optimum print resolution. A color separation is performed on the edited image to create a color separated image. Optimal sublimation inks are prepared and suitable sublimation paper is selected. Using the optimal sublimation inks, the color separated image is printed onto film or directly onto a plate. The image is then offset printed onto the suitable sublimation paper. The image is sublimated from the sublimation paper to a fabric sheet creating a fabric sheet with a high resolution image. To create the high resolution on the fabric sheet, the imprinted portion of the fabric sheet may be polyester, nylon, and polyester/cotton blend fabrics (no more than 5% cotton), and the like, but not cotton or other naturally occurring fabrics. The fabric sheet with the high resolution image may then be combined with other fabric sheets (with or without high resolution images) to form a fabric book.


After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the insulating resin 50 as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths 51 and the circuit elements 52 are supported by the insulating resin 50, without the use of the support substrate. And the interconnects L1 to L3 requisite for the circuit are formed, and can be prevented from slipping because of the curved structure 59 and a visor 58.

1. Field of the Invention
The present invention relates to a circuit device and a method for manufacturing the circuit device and a semiconductor module, and more particularly to a thin-type circuit device and a method of manufacturing the thin-type circuit device without the need of providing a support substrate, and a semiconductor module with the circuit device.
2. Description of the Related Art
Conventionally, it has been demanded that a circuit device which is set in an electronic apparatus is reduced in size, thickness and weight, because the circuit device is used for a portable telephone, a portable computer and so on.
For example, a semiconductor device as a circuit device is typically a package type semiconductor device which is conventionally sealed by normal transfer molding. This semiconductor device 1 is mounted on a printed circuit board PS as shown in FIG. 24.
This package type semiconductor device 1 has a semiconductor chip 2 covered with a resin layer 3, with a lead terminal 4 for external connection derived from the side of this resin layer 3.
However, this package type semiconductor device 1 had the lead terminal 4 out of the resin layer 3, and was too large in total size to meet smaller, thinner and lighter requirements.
Therefore, various companies have competed to develop a wide variety of structures which are reduced in size, thickness and weight. Recently, a wafer scale CSP which is as large as a chip size, called a CSP (Chip Size Package), or a CSP which is slightly larger than the chip size, has been developed.
FIG. 25 shows a CSP 6 which adopts a glass epoxy substrate 5 as a support substrate and which is slightly larger than a chip size. Herein, a transistor chip T is mounted on the glass epoxy substrate 5.
On the surface of this glass epoxy substrate 5, a first electrode 7, a second electrode 8 and a die pad 9 are formed, and on the back face, a first back electrode 10 and a second back electrode 11 are formed. Via a through hole TH, the first electrode 7 and the first back electrode 10, as well as the second electrode 8 and the second back electrode 11, are electrically connected. On the die pad 9, the bare transistor chip T is fixed. An emitter electrode of transistor and the first electrode 7 are connected via a bonding wire 12, and a base electrode of transistor and the second electrode 8 are connected via the bonding wire 12. Further, a resin layer 13 is provided on the glass epoxy substrate 5 to cover the transistor chip T.
The CSP 6 adopts the glass epoxy substrate 5, which has the merits of a simpler structure extending from the chip T to the back electrodes 10, 11 for external connection, and a less expensive cost of manufacture, than the wafer scale CSP.
The CSP 6 is mounted on the printed circuit board PS, as shown in FIG. 24. The printed circuit board PS is provided with the electrodes and wires making up an electric circuit, and has the CSP 6, the package type semiconductor device 1, a chip resistor CR and a chip capacitor CC fixed for the electrical connection.
A circuit on this printed circuit board is packaged in various sets.
Referring to FIGS. 26 and 27, a method for manufacturing this CSP will be described below. In FIG. 27, reference is made to a flow diagram entitled as a Glass epoxy/flexible substrate, listed in the middle.
Firstly, the glass epoxy substrate 5 is prepared as a base material (support substrate). On both sides of the glass epoxy substrate 5, the Cu foils 20, 21 are applied via an insulating adhesive (see FIG. 26A).
Subsequently, the Cu foils 20, 21 corresponding to the first electrode 7, the second electrode 8, the die pad 9, the first back electrode 10 and the second back electrode 11 are coated with an etching resist 22 and patterned. Note that the patterning may be made separately on the front face and the back face (see FIG. 26B)
Then, using a drill or a laser, a bore for the through hole TH is opened in the glass epoxy substrate. This bore is plated to form the through hole TH. Via this through hole TH, the electrical connection between the first electrode 7 and the first back electrode 10 and between the second electrode 8 and the second back electrode 10 is made (see FIG. 26C).
Further, though being not shown in the figure, the first electrode 7 and the second electrode 8 which become the bonding posts are subjected to Ni plating or Au plating, and the die pad 9 which becomes a die bonding post is subjected to Au plating to effect die bonding of the transistor chip T.
Lastly, the emitter electrode of the transistor chip T and the first electrode 7, and the base electrode of the transistor chip T and the second electrode 8 are connected via the bonding wire 12, and covered with the resin layer 13 (see FIG. 26D).
As required, individual electrical elements are formed by dicing. In FIG. 26, only one transistor chip T is provided on the glass epoxy substrate 5, but in practice, a matrix of transistor chips T are provided. Accordingly, a dicing apparatus separates them into individual elements.
In accordance with the above manufacturing method, a CSP type electrical element using the support substrate 5 can be completed. This manufacturing method is also effected with the use of a flexible sheet as the support substrate.
On the other hand, a manufacturing method adopting a ceramic substrate is shown in a flow diagram to the left in FIG. 27. After the ceramic substrate which is the support substrate is prepared, the throughholes are formed. Then using a conductive paste, the electrodes are printed and sintered on the front face and the back face. Thereafter, the same manufacturing method of FIG. 26, up to coating the resin layer is followed, but since the ceramic substrate is very fragile, and is likely to break off, unlike a flexible sheet or the glass epoxy substrate, there is a problem with the difficulty of molding using die. Therefore, a sealing resin is potted and cured, then polished for the uniform treatment of the face of the sealing resin. Lastly, using the dicing apparatus, individual devices are made.
In FIG. 25, the transistor chip T, connecting means 7 to 12, and the resin layer 13 are requisite components for the electrical connection with the outside, and the protection of transistor. However, only these components were difficult to provide an electrical circuit device reduced in size, thickness and weight.
Essentially, there is no need of having the glass epoxy substrate 5 which becomes the support substrate, as described before. However, since the manufacturing method involves pasting the electrode on the substrate, the support substrate is required, and this glass epoxy substrate 5 could not be dispensed with.
Accordingly, the use of this glass epoxy substrate 5 raised the cost. Further, since the glass epoxy substrate 5 was thick, the circuit device was thick, limiting the possibility to reduce the size, thickness and weight of the device.
Further, the glass epoxy substrate or the ceramic substrate necessarily requires a through hole forming process for connecting the electrodes on both sides. Hence, there was a problem with the long manufacturing process.
FIG. 28 shows a pattern diagram on the glass epoxy substrate, the ceramic substrate or a metal substrate. On this pattern, an IC circuit is typically made, with a transistor chip 21, an IC chip 22, a chip capacitor 23 and/or a chip resistor 24 mounted. Around this transistor chip 21 or the IC chip 22, a bonding pad 26 integral with a wire 25 is formed to electrically connect the chips 21, 22 via a bonding wire 28. A wire 29 is made integrally with an external lead pad 30. These wires 25, 29 are bent through the substrate, and made slender in the IC circuit, as necessary. Accordingly, this slender wire has smaller contact area with the substrate, leading to exfoliation or curvature of the wire. The bonding pad 26 is classified into a bonding pad for power and a bonding pad for small signal. Particularly, the bonding pad for small signal has a small bonding area, which caused a film exfoliation.
Further, an external lead is fixed to an external lead pad 30. There was a problem that the external lead pad 30 might be exfoliated due to an external force applied to the external lead.

Circuit device and manufacturing method of circuit device and semiconductor module


A chuck device has a pair of grippers pivotally supported in a recess defined in an end of a body for angular movement about a predetermined angle, a joint member connected to a piston reciprocally movably disposed in a cylinder chamber defined in the body, and a pair of rollers engaging respectively in grooves in the grippers and angularly movably mounted on the joint member. Linear movement of the piston can be transmitted as angular movement to the grippers through the rollers while the rollers are angularly moving with respect to the joint member. A cover is mounted on the end of the body in closing relation to the recess.

1. Field of the Invention
The present invention relates to a chuck device having a pair of grippers that are angularly movable under the pressure of a fluid respectively into substantially parallel positions for gripping a workpiece.
2. Description of the Related Art
Heretofore, chuck devices have been used to grip workpieces. FIG. 5 of the accompanying drawings shows a conventional chuck device 1. As shown in FIG. 5, the conventional chuck device 1 comprises a body 2 having a cylinder chamber 3 defined therein and a. piston mechanism 5 having a piston 4 reciprocally movable axially in the cylinder chamber 3. The piston mechanism 5 also has a piston rod 6 with an outer end thereof projecting out of the body 2, and a plate 7 is fixed to the outer end of the piston rod 6. A pair of grippers 10a, 10b is connected to respective opposite ends of the plate 7 by respective joint plates 9a, 9b that are pivotally supported on the plate 7 by pins 8a, 8b. The grippers 10a, 10b are angularly movably supported in a recess 12 defined in the body 2 by respective pins 11a, 11b.
When the grippers 10a, 10b are angularly moved 90.degree. toward each other, as indicated by the solid lines, about the pins 11a, 11b by the piston rod 6 which is retracted into the body 2. the grippers 10a, 10b grip a workpiece (not shown). When the grippers 10a, 10b are angularly moved 90.degree. away from each other, as indicated by the two-dot-and-dash lines, about the pins 11a, 11b by the piston rod 6 which projects out of the body 2, the grippers 10a, 10b releases the workpiece.
With the conventional chuck device 1, linear movement of the piston rod 6 is converted into angular movement of the grippers 10a, 10b by the joint plates 9a, 9b.
The pins 8a, 8b and the pins 11a, 11b are spaced from each other by respective interaxial distances A.sub.1, A.sub.2. These interaxial distances A.sub.1, A.sub.2 may be different from each other due to dimensional errors. If the interaxial distances A.sub.1, A.sub.2 are different from each other, then the grippers 10a, 10b may not extend parallel to each other when they are angularly moved toward each other. Accordingly, the grippers 10a, 10b may fail to provide a required level of accuracy about parallelism therebetween when angularly moved toward each other.
Dust or dirt particles that find their way into the opening 12 tend to be attached to the pins 8a, 8b, 11a, 11b and unduly wear them to the point where the grippers 10a, 10b cannot smoothly be angularly moved about these pins.
When the grippers 10a, 10b are angularly moved a certain angle, gaps 13 are created between the body 2 and the grippers 10a, 10b, allowing dust or dirt particles to enter the opening 12.


A rotor is provided which includes a first rotor portion, a second rotor portion which is arranged at a position deviated from the first rotor portion by a predetermined skew angle so as to contact the first rotor portion, first magnets each of which is provided in a magnetic pole of the first rotor portion, and second magnets each of which is provided in a magnetic pole of the second rotor portion and is arranged at a position deviated from the first magnet of the first rotor portion by the predetermined skew angle. Coercive field strengths of the first magnets and coercive field strengths of the second magnets are different from each other.

Technical Field
The present invention relates to a rotor having a first rotor portion and a second rotor portion, and to an electric rotating machine having the rotor.
Related Art
In order to reduce magnetic sound, the rotor of an IPM (Interior Permanent Magnet Motor) is divided into two stages in the axial direction, and the divided two stages are arranged being relatively deviated by ½ slot pitch angle. According to this configuration, pulsating components are offset in the torque waveforms generated in the first rotor portion and the second rotor portion.
In this regard, a patent document JP-B-4269953, for example, discloses an example of a technique related to an electric rotating machine which aims to more smoothly offset the pulsating components in the torque waveforms. In this electric rotating machine, the rotor is divided into three stages in the axial direction. Of the three stages (three rotor portions), a first rotor portion whose stack thickness is half of that of a second rotor portion is arranged at both ends, and the second rotor portion is arranged in between the first rotor portions, with the second rotor portion being deviated from the first rotor portions by ½ slot pitch angle.
However, application of the stage skew described in the patent document JP-B-4269953 raises the following problem. Specifically, when a magnetic field based on a predetermined current is applied to the rotor from the stator to generate torque, a magnetic field vector from the stator is generated at a position deviated from an optimum control lead angle by ½ slot pitch angle. In this case, the rotor arranged rearward with respect to the rotation direction is controlled on the basis of a lead angle advanced by ½ slot pitch. In a rotor having magnets and used for an IPM or an SPM (Surface Permanent Magnet Motor), the amount of demagnetizing field acting on the magnets is increased when the lead angle is advanced. As a result, the magnets are demagnetized, disabling generation of predetermined torque.


The integrated microelectronics component comprises an electric conductor forming a transmission line element for a radio frequency electromagnetic wave. This electric conductor is surrounded at least partially by a preferably closed magnetic circuit, formed at least by superposition of a layer of ferromagnetic material having a saturation magnetization value greater than or equal to 800 kA/m and of a layer of magnetic material. The layer of magnetic material then generates a uniaxial magnetic anisotropy in the adjacent ferromagnetic layer. A high magnetization can then be combined with a high anisotropy, thus enabling operation in high frequency ranges, for example about 5 to 20 GHz.

The invention relates to an integrated microelectronics component comprising an electric conductor forming a transmission line element for a radio frequency electromagnetic wave, and means for filtering electromagnetic noise, in particular by magnetic resonance, said means for filtering electromagnetic noise comprising a layer of ferromagnetic material. It also relates to a radio frequency transmission circuit comprising such a component.

Integrated microelectronics component for filtering electromagnetic noise and radio frequency transmission circuit comprising same


A short arc lamp which has a lamp body in which a concave space is formed, a base plate which is located in a rear part of this body, a transparent part which is located in a front opening of the lamp body, with a frame part in its vicinity, and which hermetically encloses the concave space, and a pair of electrodes forming an arc gap in the concave space. The frame part is connected to a circular conductive ring which is provided with the roughly square cross section and is connected to the lamp body. At least a front side of the circular conductive ring is exposed to the ambient environment. A gap is formed between the frame part and the circular conductive ring. The frame part extends more to the front than the circular conductive ring, and on the exposed surface of the circular conductive ring and on a side of the projecting part of the frame part, step-like projections are formed.

1. Field of the Invention
The invention relates to a short arc lamp, especially a lamp in which the body of the main part of the lamp is made of an opaque ceramic and only a front opening is made of a transparent part.
2. Description of the Related Art
Generally, a short arc lamp is formed of quartz glass or the like. However, a special lamp is also used in which the main part of the lamp is made of an opaque ceramic for a special purpose, such as for a medical endoscope.
One such lamp has the advantage that it is extremely durable and easy to handle. For example, such lamps are known from U.S. Pat. Nos. 4,599,540; 4,633,128 and 3,731,133. Specifically, within the ceramic body, a concave space is formed in which gas with increased air pressure is encapsulated, and into the front opening of which a transparent part is installed. In the middle of this concave space are a cathode and anode which form an arc gap. By means of a discharge which is formed in this arc gap, lamp emission is accomplished. In this case, the anode is held on a back end of the body, and the cathode is secured by means of a conductive part which extends from one side of a front end of the body. On the other hand, the transparent part in its vicinity has a U-shaped flange and is attached in the front opening of the above-described body.
Within the lamp, not only this flange, but also a spacer and the like are located. These parts hermetically enclose the inside of the lamp and at the same time have the function of a conductive part for generating the arc.
A lamp of this type does have the advantage of durability and easy handling, as is described above. However, it has the disadvantage that the heat formed in the concave space of the lamp cannot be advantageously dissipated to the outside. In particular, only on the cathode side is there an arrangement in which the main part of the cathode is secured by means of the conductive part. It is difficult to completely transfer the heat by means of this conductive part. Furthermore, the efficiency of heat emission is seriously impaired when the transparent part, the flange, the body and the like are not in complete contact with one another.
If this heat emission is not adequate, a resultant temperature increase of the above-described parts which form the lamp can lead to deformation thereof. In particular, the U-shaped flange, due to its special shape, is easily deformed. If these parts deform and complete contact with the body and the transparent part is destroyed, the hermetically sealed state is destroyed, and furthermore, conductivity is impaired.

Short arc lamp having a thermally conductive ring


A pen-based computer system device includes a digitizer and utilizes a passive stylus as an input device. The system emulates standard two-button mouse functions by generating data packets corresponding to the x-y coordinates of the stylus for each pen-down event. In order to prevent malfunction of the system, a plurality of packets are generated for each pen-up event to prevent maloperation of the system in the event a data packet for a pen-up event is lost or garbled.

1. Field of the Invention
The present invention relates to a pen-based computer system and more particularly to a pen-based wireless interface device that can emulate a standard mouse function with a passive stylus which generates a plurality of mouse data packets for each pen up event to prevent maloperation of the system in the event the data packet for the pen up event is lost or garbled.
2. Description of the Prior Art
Pen-based portable personal computer systems are generally known in the art. Such systems typically include a digitizer panel and a pen controller and utilize a stylus as an input device. The pen controller normally generates a series of interrupts and, in turn, a series of packets whenever the stylus touches or is lifted from the digitizer panel. The x-y coordinates of each pen down event are generated as a series of four 8-bit packets (p1, p2, p3, p4). Pen up data is generated as a single packet p5. In certain conditions, the interrupts are disabled in order to enable the pen packets to be processed. During the time when the interrupts are disabled, the x-y coordinate packets (p1, p2, p3, p4), as well as the pen up packet p5, are not processed and thus can become garbled or lost. Since mouse emulation is based on both pen-down and pen-up events, lost pen-up packets p5 can result in the mouse emulation being hampered, possibly resulting in the system being stuck in the state preceding the pen-up event.


Methods for integrating heterogeneous channel material into a semiconductor device, and semiconductor devices that integrate heterogeneous channel material. A method for fabricating a semiconductor device includes processing a first substrate of a first material at a first thermal budget to fabricate a p-type device. The method further includes coupling a second substrate of a second material to the first substrate. The method also includes processing the second substrate to fabricate an n-type device at a second thermal budget that is less than the first thermal budget. The p-type device and the n-type device may cooperate to form a complementary device.

1. Field
Aspects of the present disclosure relate to semiconductor devices, and more particularly to heterogeneous channel material integration for materials that have different thermal budgets.
2. Background
Semiconductor chip level bonded devices are used in several consumer and commercial applications. Semiconductor devices are often made from a single type of material. Semiconductor devices may also be made of different types of material grown onto a substrate based on lattice matching and compatible crystalline structures. Semiconductor devices manufactured from compound materials (i.e., where the semiconductor structure is more than one material), such as III-V materials, are typically grown on gallium arsenide or other compound semiconductor substrates. These devices are difficult to integrate with electronic devices fabricated on silicon because of lattice mismatches between the crystalline structures of silicon and compound semiconductor materials.

Heterogeneous channel material integration into wafer


The present invention relates to an injector comprising a housing (10); a medicament container (12) disposed within the housing, wherein the container has at least one chamber, a front opening with or for an injection needle for delivering the medicament therethrough, and at least one movable stopper; a drive unit (22) slidable arranged within the housing, and capable of acting on said container for expelling medicament through said needle; and a scroll wheel member (24) operatively connected to said housing via a transmission and wherein said scroll wheel member comprises friction enhancing means such that it is capable of being maneuverable with a finger of a user for performing a function.

Many injectors have been developed during the years with different degrees of functions such as automatic penetration and/or injection, setting of different doses to be injected, retractable and lockable needle shields, means for performing mixing and priming, to mention a few.
Automatic functions may have their advantages in that they reduce the actions that the user needs to perform. On the other hand an increased degree of automation and/or number of functions by necessity entails an increased number of components that need to interact with each other in reliable and repeatable ways without the risk of malfunction or break-down of the device, which otherwise could jeopardize the health of the patient. Further, the increased number of components also increases the cost of the device.
For most injectors, and for most patients, a number of actions of the injector may be performed manually, such as penetration and/or injection. However, for many drugs and administering schemes it is an advantage that the dose to be delivered may be set before injection.
One such injector is disclosed in patent application No. WO 0110484. It describes an injector having a dose setting means whereby the rear end of the injector is turned until the desired dose is displayed. The turning causes the rear part of the injector to protrude more and more out of the housing of the injector due to threads between the rear part and the housing. When the patient is to inject the medicament, he/she presses on the protruding part, whereby it is pushed back into the housing. This movement causes the protruding part to rotate back during injection.
For most patients, the force required to perform the injection is manageable where the force depends inter alia on the pitch of the threads, the resistance of the stopper inside the medicament container and the diameter of the needle channel. In that respect there is an increased demand from patients to use as small needles as possible in order to reduce the pain induced by the penetrating needle.
However, for patients/users with weak hands and fingers, with reduced manual dexterity, the force required for the injection is too high, so that they cannot operate the injector. The problem becomes more severe the longer the rear part is rotated out of the housing. Also for patients that self-inject on places on the body where they cannot see, such as in the buttock or the rear waist, having a push button on the rear of the injector is not optimal.
There is thus a demand for an injector having manual injection features that can be handled in an easy and reliable way also by patients with reduced manual dexterity as well as when the injector is held in positions where pushing on the rear end of the injector is not optimal.

Injector with thumb operable scroll wheel


A semiconductor apparatus comprises a resistor formed in a driver to connect a driving device to a transmission line connecting the driver to a receiver. The resistor has resistance considerably larger than on-state resistance of the driving device on condition that the resistor matches output impedance of the driver with impedance of the transmission line. The transmission line has length decided so that a reflected wave from a receiver-side end of the transmission line reaches the driver while a driving signal supplied to the driver has a logical high or low level.

This invention relates to a semiconductor apparatus, in particular, to a semiconductor apparatus comprising a driving device and a driven device which are connected with a transmission line.
A related semiconductor apparatus comprises a driver (or a driving device), a receiver (or a driven device) and a transmission line (or a bus) connected between the driver and the receiver. The driver has output impedance Zout while the transmission line has impedance Z0.
If the driver, the receiver and the transmission line are ideal, an output signal of the driver travels to the receiver on the transmission line without being damped. Then, the signal is totally reflected by the receiver (or at a receiver-side end of the transmission line) and returns to the driver without being damped. If the output impedance Zout is equal to the impedance Z0, the reflected signal is terminated (or absorbed) at a driver-side end of the transmission line (or at a connection point between the transmission line and the driver).
However, the output impedance Zout actually depends on a voltage of the output signal because the driver is not ideal. Accordingly, part of the reflected signal is further reflected by the driver (or at the driver-side end of the transmission line) and travels for the receiver again. Thus, the output signal of the driver is repeatedly reflected by the receiver and the driver.
To suppress the above mentioned multiple reflection between the driver and the receiver, another related semiconductor apparatus has a terminating resistor connected to the receiver-side end of the transmission line.
However, the terminating resistance uselessly consumes electric power. That is, the semiconductor apparatus including the terminating resistor has high electricity consumption. Furthermore, the terminating resistance increases manufacturing steps of the semiconductor apparatus and thereby increases the production cost of the semiconductor apparatus.

Semiconductor apparatus capable of preventing occurrence of multiple reflection, driving method, and setting method thereof


An improved water quality monitoring system and method. The system utilizes reflectance radiometers to provide multiple wavelength measurement of downwelling irradiance and/or upwelling radiance. The method calculates attenuation coefficients from the downwelling irradiance or upwelling radiance to derive chlorophyll concentration in the water.

1. Field of the Invention
The present invention generally relates to the field of water quality monitoring devices. More particularly, the present invention relates to the field of water quality monitoring devices utilizing the remote electro-optical sensor (REOS) system.
2. Description of the Prior Art
The general acronym REOS (Remote Electro-Optical Sensor) refers to moored in-reservoir water quality monitoring systems. REOS systems provided the first continuous in-reservoir monitoring of nuisance phytoplankton populations in drinking water reservoirs. Prior to the development of REOS technology, laboratory inspection of reservoir water samples was needed to track algal population dynamics.
A prototype system (REOS-1) and a subsequent developmental system (REOS-2) were deployed by the Los Angeles Department of Water and Power (LADWP) in 1989 and 1992, respectively, as described in White, B. N., Kiefer, D. A., Morrow, J. H. and G. F. Stolarik (1991), Remote Biological Monitoring in an Open Finished-Water Reservoir, American Water Works Association Journal, 83:107-111.
REOS-1 and REOS-2 systems were designed specifically to monitor nuisance algal populations by making accurate measurements of the red fluoresced light, stimulated by ambient sunlight, which radiates from all eukaryotic (higher plant) phytoplankton during photosynthesis. Research primarily on marine phytoplankton has shown that the fluorescent flux can be related both to chlorophyll concentration and to instantaneous rates of photosynthesis.
The REOS-1 and REOS-2 systems utilized specialized instruments, including profiling natural fluorometers (PNF), to measure both photosynthetically active radiation (PAR) between 400-700 nm as well as the red fluorescence emitted from the phytoplankton crop. The fluorescence signal is measured directly as the upwelling (nadir) radiance over the relatively broad bandwidth of chlorophyll fluorescence. The measurement is different from chlorophyll fluorescence measured using a strobe fluorometer in that the fluorescence signal results from the same source as that driving photosynthesis in situ.
The prototype REOS-1 system used a single PNF to monitor the phytoplankton crop. Since the PNF measures upwelling radiance directly below the sensor and samples a volume approximately 5 meters below the instrument in clear waters, the developmental REOS-2 system incorporated additional PNF's to increase optical coverage of the water column. In addition to the optical measurements, the REOS-2 system measures pH, dissolved oxygen (DO), oxidation/reduction potential (ORP) and conductivity. The REOS-2 system also utilized a dedicated 80486-microprocessor based remote access workstation (RAW) to control the system, acquire the data from each instrument, and perform functions for remote telemetry of the data.
It is desirable to develop a fully automated REOS system utilizing multiple regions of the spectrum which records and reports the status of a wider variety of water quality variables in open drinking water reservoirs, and thereby provides reservoir managers with the means to detect and intercept impending phytoplankton blooms before taste, odor, and appearance problems arise and to optimize the algicidal treatments needed to maintain control of phytoplanktonic growth.

Remote electro-optical sensor system for water quality monitoring

Department of Water and Power City of Los Angeles


A charger includes a main body and a keyboard module received in the main body. The main body includes a case, a printed circuit board and a fastening member received in the housing. The fastening member includes two fastening frames formed on two opposite sides of the housing. The keyboard module includes a supporting member, a keyboard assembly, and a flexible circuit board electrically connected with the printed circuit board. The keyboard assembly is disposed on the supporting member. Two opposite sides of one of the two fastening frames and the supporting member respectively define a guiding slot, and two opposite sides of another one of the two fastening frames and the supporting member respectively form a track. The two tracks are separately received in the corresponding guiding slots. The supporting member and the keyboard assembly can slide out from the housing along the tracks.

1. Technical Field
The present disclosure relates to a charger, and more particularly to a charger with a keyboard.
2. Description of Related Art
A hand-held electronic device needs to be equipped with a charger and a wireless keyboard. One solution to this dilemma has been to carry a separate charger and a wireless keyboard. That means carrying three things.


The present invention relates to methods for the diagnosis and treatment of a urological disorder or urological disorders. Specifically, the present invention identifies the differential expression of Carboxypeptidase Z, identified as “8263” gene in tissues relating to urological disorder, relative to their expression in normal, or non-urological disorder disease states, and/or in response to manipulations relevant to a urological disorder. The present invention describes methods for the diagnostic evaluation and prognosis of various urological diseases, and for the identification of subjects exhibiting a predisposition to such conditions. The invention also provides methods for identifying a compound capable of modulating a urological disorder or urological disorders. The present invention also provides methods for the identification and therapeutic use of compounds as treatments of urological disorders.

There are several types of urinary incontinence (UI), the two most common ones being stress urinary incontinence (SUI) and urge urinary incontinence (UUI). SUI can co-exist with UUI and is then referred to as mixed urinary incontinence. UUI is part of a complex known as overactive or oversensitive bladder, which include symptoms of frequency and/or urgency with or without UUI. 75% of patients with incontinence are elderly females.
Bladder overactivity may result from detrusor instability or hyperreflexia. Triggers may include increased activity of afferent peripheral nerve terminals in the bladder or decreased inhibitory control in the central nervous system (CNS) and/or in peripheral ganglia. Changes in detrusor muscle structure or function, such as increased muscle cell excitability due to denervation, may also play a role in the pathogenesis of this filling disorder.
Benign prostatic hyperplasia (BPH) is a common age-related pathological condition that affects men worldwide. At 60 years of age, at least 25% have symptoms of BPH. The symptoms of BPH are currently referred to as lower urinary tract symptoms (LUTS). LUTS are traditionally divided into obstructive (weak stream, intermittency, straining, etc.) and irritative (frequency, nocturia, urgency, etc.) symptoms. They are caused by at least three pathophysiological components, i.e., static, dynamic and bladder detrusor-related. Prostate enlargement, or more specifically benign prostatic nodular enlargement, accounts for much of the static obstructive element and in the elderly male is mainly confined to the transition zone and periurethral glandular tissue. By contrast the dynamic component is a reflection of smooth muscle tone in the prostate and the bladder neck. Variations in muscle tone cause corresponding changes in the degree of outlet obstruction. Bladder and detrusor-related components are believed to predominate in those with principally irritative symptoms. They reflect an increase in the incidence of uninhibited detrusor contractions and at the same time a loss of contractile ability of the bladder, both of which are a response to existing obstruction.
There is an unmet medical need for therapeutics useful for Ul and BPH.

Methods and compositions for treating urological disorders using carboxypeptidase Z identified as 8263


A microcomputer capable of solving a problem in that the load of software is heavy for setting a watchdog timer in a conventional microcomputer. It includes a switching circuit which supplies a central processing unit with the output of the watchdog timer as an interrupt signal unless a memory data write mode for writing data to a memory is not designated from the outside of the microcomputer, and which inhibits an overflow signal of the watchdog timer from being supplied to the central processing unit when the memory data write mode is designated from the outside of the microcomputer.

1. Field of the Invention
The present invention relates to a microcomputer embedding an electrically erasable, CPU writable flash memory.
2. Description of Related Art
FIG. 8 is a block diagram showing a configuration of a conventional microcomputer. In this figure, the reference numeral 100 designates a microcomputer, 200 designates a personal computer for transferring programs to the microcomputer 100, and 300 designates an interface circuit for connecting the microcomputer 100 with the personal computer 200. The microcomputer 100 includes a central processing unit (called CPU from now on) 110 for controlling the microcomputer 100 in its entirety, a flash memory 120 for storing programs and the like, a flash memory controller 130 for controlling reading and writing of the flash memory 120, a clock generator 140 for generating internal clock signals of the microcomputer 100, a watchdog timer 150 for detecting runaway of the microcomputer 100, peripheral circuits 160 such as A/D converters or a timer, an interrupt controller 170 for controlling priority of interrupts and the like, and a RAM 180 for temporarily storing the data. The internal circuits of the microcomputer 100 are electrically interconnected by a bus 190. Outside the microcomputer 100, there is connected an oscillator 141 for generating a fundamental oscillation signal of the clock generator 140.
The flash memory controller 130 includes a write/erasing controller 131 for controlling writing and erasing of the flash memory 120, a control register 132 for storing data used for controlling the flash memory, and a command register 133 for storing commands transferred from the CPU to instruct writing/erasing.
Next, the operation will be described.
The clock generator 140 supplies the CPU 110, watchdog timer 150 and peripheral circuits 160 with clock signals CL1, CL2 and CL3, respectively, on the basis of the oscillation frequency of the oscillator 141. The CPU 110 controls the peripheral circuits 160 and others in accordance with the programs stored in the flash memory 120. The watchdog timer 150 always counts the clock signal CL2 generated by the clock generator 140, and outputs an overflow signal OF at every fixed interval T1. Normally, since the CPU 110 sets the watchdog timer 150 at intervals shorter than the fixed interval T1, the overflow signal OF is not output. On the contrary, if the CPU 110 does not set the watchdog timer 150 within an interval shorter than the fixed interval T1 because of an abnormal operation of the CPU 110 or the like, the interrupt controller 170 carries out the interrupt priority processing so that an interrupt signal INT is sent to the CPU 110 to cause an interrupt to the CPU 110, and the CPU 110 executes an abnormal processing program.
Next, the operation of writing data, which is transferred from the personal computer 200, to the flash memory 120 in the microcomputer 100 will be described. The flash memory 120 stores a program for writing the externally supplied data into the flash memory 120 itself. FIG. 9 is a flowchart illustrating the operation of the CPU 110 in the write operation.
When the CPU 110 is started in a CPU rewrite mode set by external dip switches or the like, the CPU 110 transfers a data rewrite program stored in the flash memory 120 to the RAM 180 at step ST901 so that the CPU 110 operates in accordance with the program transferred to the RAM 180. Next, the CPU 110 designates the CPU rewrite mode at step ST902 by writing "1" into a bit in the control register 132, which bit specifies the CPU rewrite mode. Then, the CPU rewrite mode specifying signal M from the control register 132 is fed to the write/erasing controller 131. This causes the write/erasing controller 131 to wait for a command to be written into the command register 133 by the CPU 110 to execute it.
When the CPU 110 writes the write command into the command register 133, the write/erasing controller 131 decodes the command, and identifies that it is the write command into the flash memory 120. Subsequently, the CPU 110 receives the data to be written into the flash memory 120 from the personal computer 200 through the interface circuit 300, and transfers the data to the flash memory 120 at step ST903. The write/erasing controller 131 generates a write pulse WP to carry out writing of the data into the flash memory 120. The writing is implemented when the write pulse WP is "1" which is turned off to "0" when the writing has been completed. Erasing of the data can be implemented by generating similar pulses.
The CPU 110 reads through the control register 132 the busy signal BSY indicating that the write processing is in progress at step ST504, and when the busy signal falls to "0" at step ST905, it checks at step ST906 whether the data are written correctly into the flash memory 120 or not. If it is found at step ST907 as a result of the check that the data transfer includes some error, the CPU 110 retransmits the same data at step ST908. On the contrary, if it is decided at step ST907 that the data transfer has been completed correctly, the CPU 110 sets watchdog timer 150 at step ST909, and checks at step ST910 whether an intended amount of data has been written. If it has been written, the CPU 110 clears the CPU rewrite mode at step ST911, and completes the operation.
The erasure of the flash memory 120 can also be implemented in a manner similar to the write operation described above by writing "1" into a bit in the control register 132, which indicates the CPU rewrite mode, and then by writing the erasing command in the command register 133.
In the conventional microcomputer there are following problems: First, since a time period taken by the write/erasing operation is usually longer than a normal microcomputer operation time, the watchdog timer 150 often overflows during the write/erasing operation, which causes an abnormal interrupt. Second, the software is overloaded to carry out time management for setting the watchdog timer 150 so that the watchdog timer 150 does not overflow even if the write/erasing operation takes a long time.
Thus, the conventional microcomputer including a flash memory has a problem in that the software is overloaded when the CPU controls the set of the watchdog timer 150.

Microcomputer with watchdog timer settings suppressing interrupt request processing over memory data write operation to flash memory


The present exemplary embodiments provide a hybrid sensor, a Lidar sensor, and a moving object which generate composite data by mapping distance information on an obstacle obtained through the Lidar sensor to image information on an obstacle obtained through an image sensor and predict distance information of composite data based on intensity information of a pixel, to generate precise composite data.

The contents described in this section merely provide background information on the components included in the present exemplary embodiment, but do not constitute a detailed description of the related art.
Recently, in following the development of robot technology, mobile robots which determine a route and move by themselves have also been implemented. In order to efficiently determine a position in a space and to move in such a space accordingly, the mobile robot needs to recognize its position within the space by generating a map for the space wherein the robot is moving.
The mobile robot travels by dead reckoning using a gyroscope and an encoder provided in a driving motor, and either analyzes the distance information obtained using a Lidar sensor provided at an upper portion or an image obtained using a camera to generate a map.
The mobile robot corrects errors accumulated in the driving information from the gyroscope and the encoder using point cloud information relating to the surrounding environments which is obtained by a Lidar sensor. A time of flight based Lidar measures the time it takes for a light signal which is emitted to then be reflected, and then uses the speed of light to calculate the distance from a reflector. The mobile robot may employ a camera to obtain image information on the surrounding environment.
However, since the type of data obtained from the Lidar sensor and the type of data obtained from the camera are different, it is difficult to converge the data.
A three-dimensional distance measuring system measures a distance in a space using various sensors such as a charge coupled device (CCD) image sensor, a complementary metal oxide semiconductor (CMOS) image sensor, an ultrasound sensor, and/or a laser sensor.
A general three-dimensional distance measuring system is implemented by rotating a two-dimensional distance sensor which scans a plane including the center of the sensor to scan a space. However, devices employing such a two-dimensional distance sensor have limitation to achieve certain cost, size, and sampling rate to produce such device for a commercial product rather than for research product.
A device to which a two-dimensional photo diode array is applied measures a distance using a structured light or time of flight method. When the structured light method is used, a unique pattern is projected and a corresponding point is detected to calculate the depth, while time of flight involves measurement of a time difference or a phase difference to be converted into a distance. When a device to which a two-dimensional photo diode array is applied is used, it is difficult to increase the angle of view. Further, each pixel contains so much three-dimensional information that it is difficult to measure a pin point.
A distance measuring device to which a one-dimensional photo diode array is applied includes a photo diode array and a laser diode array (or a laser diode and a diffuser). The photo diode array has a structure in which hundreds to several thousands of photo diodes are linearly disposed on a silicon crystal. However, a distance measuring device to which a one-dimensional photo diode array is applied has problems in that it is difficult to increase the angle of view, and it is expensive to produce the distance measuring device as a commercial product due to the expensive modules required for implementation, such as a high efficiency diffuser, a sensor array, or an MEMS mirror.
For easy implementation, the Lidar sensor of the related art employs a specific tube for a transmitter, or is implemented to have a structure which secures a long distance from a transmitter and a receiver to a mirror. The two-dimensional Lidar sensor of the related art has a laser light tube formed from an emitter to the mirror, while a three-dimensional Lidar sensor of the related art employs a beam adjustment method which forms a long distance using a specific tube or employs a multiple mirror configuration, generating a long distance in a restricted area.
The Lidar sensor of the related art has excellent performance, but has disadvantages in terms of cost and size. In order to form an efficient beam path, the three-dimensional Lidar sensor of the related art requires a plurality of mirrors having a high reflectance, making it expensive to implement. Further, a compact Lidar has a limited size, so that a tube or long distance method of the related art cannot be applied.
When a moving object such as a robot or a vehicle moves within an unknown environment, there is no information on the surrounding environment. Therefore, a map for the environment needs to be generated using sensor information, and the current position of the moving object needs to be predicted from the generated map. A method of recognizing the position and generating a map of the surrounding environment as described above is referred to as a simultaneous localization and mapping (SLAM) technique. There are various SLAM techniques such as filter based SLAM or graph based SLAM.
The graph based SLAM method represents the position and the motion of the robot using a node and an edge of a graph. A node is a position of a robot or an artificial landmark at a specific timing. The edge is a relationship between two nodes, and refers to a constraint on the space between two nodes. The measured edge includes errors. Therefore, when a traveling distance of the robot is increased and the number of nodes is increased, errors may be accumulated during the process of predicting the position.


A process for applying a barrier layer of ethylene/vinyl alcohol copolymer (EVOH) to a substrate, such as a plastic film, by coating the substrate with a solution of EVOH in a solvent of tetrahydrofuran and water, followed by removing the solvent. Multilayer structures having an EVOH barrier layer coated on a plastic substrate from solution in aqueous tetrahydrofuran solvent have excellent oxygen barrier properties.

The present invention relates to solution coating barrier layers on plastic films.
The gas permeability of certain plastic articles, such as films, can be reduced by coating the article with a barrier material. Ethylene/vinyl alcohol copolymer (EVOH) is recognized as a barrier material which is especially good for reducing the permeability to oxygen. By coating plastic with an EVOH layer it is possible to make clear, strong film which is well suited for packaging oxygen-sensitive products such as food and chemicals.
One of many methods to apply polymer coatings to substrates is solution coating. Typically in such process, the coating material is dissolved in a convenient solvent, the solution is deposited on the film surface and thereafter the solvent is removed. Solution coating is advantageous for placing very thin coatings on sheets, films and substrates which have complex shapes such as containers. Generally, alcohols, and mixtures of alcohols with water, are preferred solvents for solution coating substrates with EVOH because they are inexpensive and have moderately low toxicity. Solutions of EVOH in alcohols, however, tend to gel or precipitate after short-term aging. Consequently, they have only limited shelf life. Furthermore, alcohol-based solutions of EVOH have high solution viscosities. Dilute solutions must be used in order to attain sufficiently low solution viscosity for proper coating process operation. Dilute solutions, however, are costly because of the large amount of solvent consumed and long drying time needed to remove the solvent. Use of dilute solutions is also environmentally unattractive because of the need to recover large quantities of spent solvent.

Solution coating process for packaging film


A measuring device is provided for measuring intermodulation distortion of a measuring object. The measuring device includes a first signal generator which produces a first signal that is supplied to an input of a measuring object, a signal combining device having a first input which is connected to the output of the measuring object, and a signal analyzing device which is connected to the output of the signal combining device. According to the disclosure, a second signal generator which is synchronized with the first signal generator is provided, and second signal generator producing a second signal that is supplied to a second input of the signal combining device.

1. Field of the Disclosure
The disclosure relates to a method and a device for measuring intermodulation distortions.
2. Related Technology
Intermodulation distortions (d3-intermodulation), especially in the form of adjacent-channel power (ACPR) represent an important specification especially for power amplifiers, which are used in mobile telephone base stations. This also applies in particular to power amplifiers, which are driven with several carrier signals. Nonlinearities in the power amplifier lead to crosstalk from one channel into the adjacent channels, causing an interference effect. To measure the intermodulation distortions of a power amplifier, the amplifier is therefore supplied with a measuring signal in the useful channel, and the power components in the adjacent channels are measured.
A method and a device for measuring intermodulation distortions in a device under test, such as a power amplifier, are already known from U.S. Pat. No. 6,263,289. With the method according to U.S. Pat. No. 6,263,289, a signal generator is connected to the input of the device under test (DUT). The device under test may, for example, be a power amplifier, which is terminated with a terminal resistance. A directional coupler is provided at each input and output of the device under test. The signal of the coupler at the output of the device under test is supplied directly to a signal combiner (power combiner), while the signal picked up via the coupler at the input of the device under test is supplied to the signal combiner through a network for modifying the level and the phase. The network for modifying the level and phase subjects the signal picked up at the input of the device under test to the same level and phase changes experienced by the signal in the device under test, but this signal pathway is subjected to an additional phase displacement of 180° relative to the signal pathway leading through the device under test. When measuring the adjacent-channel power (ACPR), adjacent-channel power components which are already contained in the input signal of the device under test are therefore compensated.
The method known from U.S. Pat. No. 6,263,289 has the disadvantage that a delay compensation is possible only within the range of a few 100 ns, because a larger delay compensation cannot be achieved by the network for modifying level and phase. Devices under test with longer delays cannot therefore be measured using the known methods. It is also disadvantageous that a network for modifying the level and phase, which operates with sufficient accuracy, is structured in a relatively expensive manner, as shown in FIG. 6 of U.S. Pat. No. 6,263,289. The known method is therefore associated with a relatively high realization costs.

Method and device for measuring intermodulation distortion


A desynchronized fingerprinting method and system for identifying collaborators in the making of illegal copies of digital multimedia products. The desynchronized fingerprinting system and method can be used for both audio and video applications. The method and system include an embedding feature and a detection and extraction feature. A different and unique key is assigned to each buyer of a copy of the digital data. The embedding feature includes applying a pseudo-random transformation to selected embedding regions. The key for the pseudo-random transform is user-specific. These regions are chosen by using a secure multimedia hash function. The detection and extraction feature includes a brute-force search in the key space of the buyers. If one of the keys is likely enough, then it can be said that that user was been involved in the production of an illegal copy.

The illegal copying of digital multimedia data products (such as movies and audio recordings) is a widespread problem. The problem only seems to be growing, despite technical advancements in copy protection and mounting efforts to enforce intellectual property rights. This infringement of intellectual property rights can cause great financial harm to the owner.
The upward trend in illegal copying seems to be tied to the expanding use of digital media and equipment for storing and distributing digital multimedia data. The enormous growth of Internet technology and digitally stored data has made it possible to easily and inexpensively produce high-quality identical copies of an original. In addition, it is possible to make the copies available to the entire Internet community. This process has become further easier with the usage of peer-to-peer (P2P) networks. With the increasing availability of copying devices and increased bandwidth for digital data, the need to restrain illegal redistribution of digital multimedia data (such as images,. videos and music) has become an important issue.
One way to deter illegal copying is to increase the risk of being caught after the piracy has occurred. Storing a unique, invisible mark in each copy (in other words, embedding the mark in the perceptual content of the digital media signal securely and robustly) is a way to increase that risk. In this manner, if an illegal copy is found somewhere, it is possible to find the owner of the copy and to take legal action. This type of enforcement scheme is called fingerprinting (also known as "mark embedding" for forensics in some communities).
The idea of fingerprinting is to uniquely mark each copy. This makes each copy bit-wise different from every other copy, and yet otherwise perceptually approximately the same. In this way, it is possible to distinguish between all legal copies. The marking can be used to identify the copy, and thereby the user if his identity is linked to the fingerprint in some way. For example, if the fingerprinted copies are only distributed to those persons who identify themselves, it may be possible, if an illegal copy is found, to identify the owner of the legal copy from which the illegal copy was made.
By way of example, assume the owner of a movie on digital video disk (DVD) makes copies of the movie for sale. Each of the copies is fingerprinted. The owner only sells a copy to a user after having individually and uniquely marked each user's copy with a fingerprint and associated each fingerprint uniquely with a buyer. Later, a number of buyers, called pirates, collude in creating an illegal copy that they redistribute (in this situation the pirates are also called colluders). The owner of the movie can analyze an illegal copy and attempt to find out which of the buyers took part in the creation of the illegal copy.
The fingerprinting technique includes inserting fingerprints in each copy of a digital product using a watermarking (also termed "mark embedding") scheme. A watermarking scheme imperceptibly embeds the fingerprint in the perceptual content in a way that it can only be recovered using a secure key. It should be noted that this type of scheme is completely different from conventional Digital Rights Management (DRM) techniques for content protection. There are two important differences between watermarks (for screening purposes to prevent illegal copying or recording) and fingerprints (for forensics purposes to trace the leakage). First, while in watermarking the hidden message (mark) is the same for all buyers (and this mark often represents the identity of the content owner), in fingerprinting the mark depends on the buyer's identity. Second, buyer collusion is not an issue in watermarking (the marked copies for a single content being the same for all buyers). However, in fingerprinting the mark is different for every buyer, and it makes sense for a collusion of buyers to collude by comparing their copies and try to locate and delete some mark bits. Thus, in a collusion attack on fingerprinted digital products, a group of dishonest users colludes to create an illegal copy that hides their identities by putting together different parts of their copies. The attack seeks to eliminate the hidden embedded fingerprints.
One problem with current fingerprinting techniques is that they are limited in the number of collaborators that can be identified. For example, several traditional current fingerprinting techniques can only identify between four and eight collaborators. Some newer fingerprinting techniques use fingerprinting codes to enable the detection of an order of magnitude better that traditional fingerprinting techniques. However, there are frequently a large number of collaborators involved in the production of an illegal copy. This means that current fingerprinting techniques cannot accurately detect and identify collaborators greater than one-hundred. This severely limits the deterrent effect of fingerprinting, since collaborators know that all they have to do is collaborate with a large number of other copy owners to avoid detection.
Another problem with current fingerprinting techniques is that they are susceptible to estimation attacks. Estimation attacks occur when attackers take all of the frames of the scene and compute an average of all the frames, thereby forming an estimate of the original unmarked content. Alternatively, different techniques may also be used to estimate the fingerprint of each client using the inherent redundancy that is present in the media signal. This tends to greatly weaken or eliminate all of the fingerprints. Therefore, what is needed is a fingerprinting system and method that is capable of accurately identifying at least an order of magnitude greater number of collaborators than current fingerprinting techniques. What is also needed is a fingerprinting system and method that is (cryptographically) secure and resistant to estimation attacks.

Desynchronized fingerprinting method and system for digital multimedia data


The manufacturing method of a rotor holder according to the present invention includes a step in which a top plate portion having a substantially discoid shape substantially centered about a central axis, and a side wall portion extending from an outer circumferential edge of the top plate portion are formed simultaneously by feeding a metal plate in a predetermined direction and pressing the metal plate by a die. Also, the present manufacturing method includes a step in which a punched portion is formed at the side wall portion.

Conventionally, a fan which includes an impeller having a plurality of blades powered by a motor is arranged inside an electronic device so as to cool heated components therein and to let out the heated air of the electronic device. In recent years, due to an increase in the amount of heat generated by the electronic device, the rotation speed of the impeller is increased.
When the rotation of the impeller is increased, a significant amount noise may be generated if a weight balance of a rotor assembly including a rotor portion (including the impeller) of the motor with respect to a rotational axis thereof is compromised. Also, when the rotation of the impeller is increased, the motor may be vibrated generating noise. In particular, the rotor holder of the rotor portion retaining thereat a field magnet is often made of a metal material, which is usually heavier than the material used to manufacture other elements of the motor, and therefore, the rotational balance of the rotor holder is a critical element of the operation of the motor.


A zinc-blende nitride semiconductor free-standing substrate has a front surface and a back surface opposite the front surface. The distance between the front and back surfaces is not less than 200 μm. The area ratio of the zinc-blende nitride semiconductor to the front surface is not less than 95%.

1. Field of the Invention
This invention relates to a zinc-blende nitride semiconductor free-standing substrate, a method for fabricating the same, and a light-emitting device employing the same.
2. Description of the Related Art
Conventionally, nitride semiconductors applied as blue, green and ultraviolet light-emitting device materials, or high power electronic device materials have wurtzite structure that belongs to hexagonal systems. The nitride semiconductors having wurtzite structure are formed by being grown on a hexagonal substrate, such as sapphire, 4H—SiC, etc. via a low-temperature GaN buffer layer, AlN buffer layer, or high-temperature AlN buffer layer. Using such wurtzite nitride semiconductors, blue violet laser diodes (LDs), blue light-emitting diodes (LEDs), green LEDs, high electron mobility transistors (HEMTs), etc. are put into practical use.
Here, the light emission power of the green LEDs formed from the nitride semiconductors with wurtzite structure is on the order of half the light emission power of the blue LEDs with the same structure. This is because the crystal quality of an active layer of the green LEDs formed from the nitride semiconductors with wurtzite structure is poor compared to the crystal quality of an active layer of the blue LEDs (emitted light wavelength: approximately 460 nm). The reason for the poor crystal quality of the active layer of the green LEDs formed from the nitride semiconductors with wurtzite structure is because the active layer of the green LEDs formed from the nitride semiconductors with wurtzite structure requires that it is formed from an InGaN layer (typically, In composition=0.25) containing more In than the blue LEDs (typically, In composition=0.15), so that the growth temperature of the active layer of the green LEDs formed from the nitride semiconductors with wurtzite structure has to be lower than that of the blue LEDs, and because of large lattice mismatch between an underlying GaN layer and the active layer. Similarly, it is difficult to produce the practical nitride semiconductor green LDs.
As one promising candidate for solving these problems, use of a zinc-blende nitride semiconductor is considered. The band gap energy of a zinc-blende GaN crystal is 3.22 eV, which is lower than the band gap energy (3.42 eV) of a wurtzite GaN crystal by 0.2 eV. Accordingly, by using the zinc-blende nitride semiconductor, enhancement of light emission efficiency of a light-emitting device can be expected. This is because when LEDs or LDs with an InGaN active layer having the same In composition are produced using wurtzite and zinc-blende nitride semiconductors, the zinc-blende structure can emit light with longer wavelength than that of the wurtzite structure because of the band gap energy difference between both.
For example, to obtain 525 nm which is a typical emitted light wavelength of the green LEDs, the In composition is required to be on the order of 0.25 for wurtzite InGaN, but may be not more than 0.2 for zinc-blende InGaN. For this reason, because a high quality InGaN layer can, when using the zinc-blende structure, be formed at higher growth temperatures and with less lattice mismatch as the active layer than when using the wurtzite structure, enhancement of light emission efficiency of the green LEDs can be expected. Further, the possibility of being able to realize the green LDs which was difficult with the wurtzite structure is high.
As a semiconductor light-emitting device using such a zinc-blende nitride semiconductor, for example, a semiconductor light-emitting device is known having a plurality of zinc-blende nitride semiconductor layers formed on a zinc-blende GaAs substrate (see, e.g., JP-A-8-181386). This semiconductor light-emitting device comprises an n-type GaAs substrate, a surface nitride layer formed on the n-type GaAs substrate, an n-type AlGaN layer formed on the surface nitride layer, a GaN/AlGaN multi-quantum well layer formed on the n-type AlGaN layer, a p-type AlGaN cladding layer formed on the GaN/AlGaN multi-quantum well layer, and a p-type GaN contact layer formed on the p-type AlGaN cladding layer. All the layers from the GaAs substrate to the p-type GaN contact layer of this semiconductor light-emitting device are constructed by the zinc-blende crystals.
However, the inventor has found that the conventional zinc-blende nitride semiconductor layers that include the nitride semiconductors forming the semiconductor light-emitting device disclosed by JP-A-8-181386 often include the wurtzite GaN layers at a proportion of not less than a few 10%. When the light-emitting device structure is grown on the GaN layers with a mixture of the zinc-blende and wurtzite structures, the nitride semiconductor active layers grown in the zinc-blende and wurtzite portions emit light with their respective different wavelengths. For this reason, even when producing a green LED, monochromatic green light cannot be emitted, but blue green light is emitted. Also, even when producing a green LD, the monochromatic property of light emitted is poor, so high gain cannot be obtained, and therefore threshold current increases to cause a problem of no laser oscillation at room temperature.

Zinc-blende nitride semiconductor free-standing substrate, method for fabricating same, and light-emitting device employing same