A discoid lower blade and a discoid upper blade, having a sharper knife angle compared with that of the lower blade, are arranged such that rotational axes thereof are parallel to each other, and portions of the blades overlap one another in the direction that the rotational axes extend. A sheet with a coating layer on one side is fed through and shear-cut between the upper and lower blades in the direction perpendicular to the rotational axes, with the surface of the sheet opposite the coating layer in contact with a periphery of the lower blade while the blades are rotated. When the sheet is shear-cut, a contact start position, where contact between the sheet and the upper blade starts, is positioned upstream in the feed direction of the sheet but outside a contacting area of the sheet, where the sheet contacts the periphery of the lower cutting blade.

1. Field of the Invention
The present invention relates to a method and apparatus for cutting coated sheets. Specifically, the present invention relates to a method and apparatus for cutting coated sheets by passing the coated sheets between opposing discoid cutting blades.
2. Description of the Related Art
Conventionally, there has been known a coated sheet that comprises a sheet substrate such as of paper, film, or resin-coated paper; and a coating layer formed on the sheet substrate, wherein the coating layer is filled with fine particles of silica or the like held together by a resin binder. Such a coated sheet is formed as a web through the steps of applying a liquid coating material to a long substrate, drying the coated substrate, and winding the dried substrate in a roll form. The web so obtained is then cut to a desired size by cutting the web in the web feed direction and/or cutting it in the cross web direction, i.e., the direction perpendicular to the web feed direction, while being unwound from the rolled web. After that, these cut sheets are brought to market as a final manufactured product such as information recording paper or the like. Typically, shear-cutting techniques are used for cutting such a web in its feed direction. In a shear cutting technique, the web of coated sheet is shear-cut by rotating a disk-shaped upper cutting blade having a keen or sharp knife angle and a disk-shaped lower cutting blade having a substantially right knife angle, while the coated sheet is passed through between the upper and lower cutting blade (for example, see Japanese Patent Publication No. 2001-260077).
However, as a variety of materials have been used upon request for manufacturing coated sheets in various manners, it becomes more difficult to select appropriate cutting conditions for shear-cutting the coated sheet while pulling out the coated sheet wound in a roll form, in the feed direction. If the cutting conditions are not properly selected, there arises a problem that cracks and/or flaws may be produced in the coating layer near the cut edges of the sheet. Especially, when the coating layer is hard and fragile, the aforementioned cracks and/or flaws could be conspicuously produced in the coating layer.

Coated sheet cutting method and apparatus


A socket connector (100) for an electronic package includes an insulative housing (1) having a pair of keys (16) formed at a forward end (12) thereof, a plurality of terminals (3) received in the insulative housing (1) and a retention plate (2) rotatably coupled to the insulative housing (1) at a rearward end (11) thereof. The retention plate (2) has a pair of latches (22) formed at a pair of corners of the retention plate (2). Each latch (22) includes a locking portion (221) extending along the forward end to lock to the key (16) and a pressing portion (222) bent from the locking portion (221).

1. Field of the Invention
The present invention relates to a socket connector, and more particularly to a socket connector incorporated with a retention plate actuated by a pair of horizontally triggered locking tabs.
2. Description of the Prior Art
A conventional socket connector for an electronic package disclosed in U.S. Pat. No. 7,179,092 issued to Ma on Feb. 20, 2007 includes an insulative housing, a number of terminals received in the insulative housing and a retaining assembly surrounding the insulative housing. The insulative housing is provided with a receiving portion accommodating the electronic package therein. The retaining assembly includes a stiffener disposed around the insulative housing, a load plate pivotably coupled to one end of the stiffener and a lever assembled to opposite end of the stiffener. The load plate presses the electronic package disposed in the insulative housing, and finally the lever presses is rotated to press the load plate. The dimension of the retaining assembly is larger than that of the insulative housing so that it occupies comparably larger space on a circuit board and needs much more metal material. Accordingly, it cannot meet the trend of low cost. The load plate of the retaining assembly is retained on the insulative housing via being pressed by the lever, and the lever is locked to the stiffener. Thereby, it has to provide a space for rotation of the lever therefore the retaining means is complicated.
In view of the above, an improved socket connector that overcomes the above-mentioned disadvantages is desired.

Socket connector having retaining plate with horizontally actuated locking tabs


In a case in which an operation is alternately carried out by apparatus-1 and the apparatus-2 in cooperation with a robot, an operator carries out operation within an operation range of each of the apparatuses during the interruption of power supply to the apparatus-1 and the apparatus-2. Even if the operator approaches or enters the apparatus-1 or the apparatus-2, an emergency stop unit is not informed of a notice of such approach or entry as far as the interruption of power to the apparatus is confirmed. In a state in which the interruption of power is not confirmed, on the other hand, the emergency stop unit is informed of the notice of operator's approach or entry, and the robot system is emergency stopped.

1. Field of the Invention
The present invention relates to a robot system, and more particularly to a technique for securing operator's safety in a robot system comprising a robot which is controlled by a robot controller, and at least one apparatus which is driven by a servomotor and carries out operation in cooperation with the robot.
2. Description of the Related Art
A robot controlled by a robot controller is driven by a servomotor, and the robot is used in a form of a robot system in which the robot is combined with another apparatus which carries out operation in cooperation with the robot in many cases. The number of apparatuses which cooperates with the robot is not limited to one, and a plurality of apparatuses are used in some cases.
In such a robot system, there exist an operation region such as a work stage which is driven by the servomotor, and a region (hereinafter referred to as "off-limits region") where an operator is prohibited from entering for his or her own safety during the operation of the apparatus. Therefore, a technique for securing operator's safety is conventionally employed for an operator who approaches a dangerous apparatus or who enters the off-limits region.
FIG. 1 is a diagram for explaining the technique for securing safety which has conventionally been employed generally. In the example shown in FIG. 1, the robot system includes one robot, and apparatus-1 and apparatus-2 which are driven by servomotors, respectively. Power is supplied to the servomotors of the apparatus-1 and apparatus-2 by servo amplifiers provided in the apparatus-1 and apparatus-2, respectively. The robot is provided with a servo amplifier for a robot which supplies power to the servomotor. The operation of these servo amplifiers are controlled (including ON and OFF of power supply) by a robot controller.
Here, power to the servomotors of the apparatus-1 and the apparatus-2 are supplied through connection/interruption units provided in the apparatuses which are driven by the servomotors. The connection/interruption of power supply by each the connection/interruption unit is different from the connection/interruption control by means of the robot controller. The connection/interruption units are connected to the operator approach/entry detection units provided for the apparatus-1 and the apparatus-2, and when a notice that an operator approaches or enters is received from the approach/enter detection unit, the power supply to the servomotor is immediately interrupted.
As a unit for interrupting the power, a unit shown in FIG. 2 has already been established. As shown in FIG. 2, an essential portion of this unit comprises relays (their contacts are indicated as KA1, KA2, KA3) called safety relays or forcibly guiding type relays, and contactors (their contacts are indicated as KM1, KM2). A reference symbol M represents a servomotor of the apparatus-1 or apparatus-2. The open and close state of each contact in the drawings indicates that no operator's invasion is detected and power supply to the servomotor is being interrupted.
When the servomotor is being operating in a state in which operator's entry is not detected, the contacts of the relays KA1 and KA2 are closed, and the contacts of the relay KA3 maintains the illustrated state. With this operation, the contactors KM1 and KM2 are energized, and contacts of the contactors KM1 and KM2 provided in the power supply circuit to the servomotor are closed.
Here, if operator's entry is detected, the contacts of the relays KA1 and KA2 are opened, and electricity to the contactors KM1 and KM2 is interrupted. As a result, power supply to the servomotor is interrupted, and operator's safety is secured.
As illustrated in the drawings, all of the contacts of the relays KA1 and KA2 and the contactors KM1 and KM2 are made duplex, and even if a single contact breaks down, safety is secure. That is, even if one of the relays KA1 and KA2 breaks down, the power supply-interrupting function is not lost. It is possible to detect a single one of the relays KA1 and KA2 using the relay KA3. It is also possible to detect failure of the relay KA3 as far as the relays KA1 and KA2 are in normal states.
The related art is described in Japanese Patent Application Laid-open No. 59-159498. In this publication, there is described a technique that a doorway for access to a machine such as a robot is provided with photoelectric switches doubly, these double photoelectric switches detect that an operator approaches the machine from the doorway, and in accordance with the detection, the machine is automatically stopped.
In this conventional technique, a circuit structure for reliably interrupting power as described above is required. More specifically, the circuit in which a safety relay (forcibly guiding type relay) and a plurality of contactors are incorporated is required, as explained above. In this case, since special parts such as the safety relay are required, the number of parts is increased and thus, there is a problem concerning costs and reliability.


An apparatus for winding a fiber strand onto a bobbin having a longitudinal axis has a support holding the bobbin for rotation about the axis, a supply for feeding the fiber strand in a travel direction generally radially or tangentially to the bobbin, and a drive for rotating the bobbin about the longitudinal axis and for, when a fiber strand is engaged with the bobbin, winding the fiber strand onto the bobbin. A handling device is rotatable about the axis adjacent the bobbin and carries a strand layer for at a start of a winding operation moving into a predetermined angular position and pressing a leading end of the fiber strand against the bobbin. The handler also carries a cutter on the handling device for at an end of a winding operation cutting the fiber strand and thereby forming a trailing end attached to the bobbin and a new leading end.

Variously designed apparatuses of the above-described type are known from practice. With such an apparatus, one tries to wind a fiber strand onto a bobbin as rapidly as possible. However, increasing winding rates frequently require sacrificing the reliability of winding operations. Many of the known apparatuses thus leave much to be desired, in terms of both winding rates and the reliability of winding operations. Special problems arise when winding fiber strands that have been impregnated with a fusible thermoplastic, in which case, both the problem of reliably winding the ends of fiber strands onto bobbins and the problem of handling the ends of fiber strands remaining on bobbins following termination of winding operations and conduct of cutting operations arise, where the hardened ends of fiber strands will have to be remelted and subsequently ironed either onto bobbins or fiber strands that have been wound onto them, using elaborate ironing devices, is known. Cutting off and removing the ends of fiber strands is also known. However, cutting off waste and disposal thereof are also complex matters. Many disadvantages of the known apparatuses are also due to the belief that fiber strands must be continuously fed, without interruption, when winding them onto several bobbins in succession. The apparatuses known from actual practice are thus in need of improvement.

Method of and apparatus for winding a fiber strand onto a bobbin


The shelf life of polyurethane polyol pre-blends containing halogenated olefins is extended by encapsulation of active components such as catalysts and/or surfactants. The active component is encapsulated in a crystallizable or thermoplastic polymer. The encapsulated particles have a size of 2,800 microns or less and the active components are not significantly leaked out, particularly in the presence of halogenated olefins.

The Montreal Protocol for the protection of the ozone layer, signed in October 1987, mandated the phase out of the use of chlorofluorocarbons (CFCs). Materials more "friendly" to the ozone layer, such as hydrofluorocarbons (HFCs) eg HFC-134a replaced chlorofluorocarbons. The latter compounds have proven to be green house gases, causing global warming and were regulated by the Kyoto Protocol on Climate Change, signed in 1998. The emerging replacement materials, hydrofluoropropenes, were shown to be environmentally acceptable i.e. has zero ozone depletion potential (ODP) and acceptable low global warming potential (GWP).
Currently used blowing agents for thermoset forms include HFC-134a, HFC-245fa, HFC-365mfc that have relatively high global warming potential, and hydrocarbons such as pentane isomers which are flammable and have low energy efficiency. Therefore, new alternative blowing agents are being sought. Halogenated hydroolefinic materials such as hydrofluoropropenes and/or hydrochlorofluoropropenes have generated interest as replacements for HFCs. The inherent chemical instability of these materials in the lower atmosphere provides the low global warming potential and zero or near zero ozone depletion properties desired.
It is convenient in many applications to provide the components for polyurethane or polyisocyanurate foams in pre-blended formulations. Most typically, the foam formulation is pre-blended into two components. The polyisocyanate and optional isocyanate compatible raw materials comprise the first component, commonly referred to as the "A-" side component. A polyol or mixture of polyols, surfactant, catalyst, blowing agent, and other isocyanate reactive and non-reactive components comprise the second component, commonly referred to as the "B-" side component. Accordingly, polyurethane or polyisocyanurate foams are readily prepared by bringing together the A- and B-side components either by hand mix for small preparations and, preferably, machine mix techniques to form blocks, slabs, laminates, pour-in-place panels and other items, spray applied foams, froths, and the like.
It has been found that the B-side composition of two-component systems have reduced shelf-life, especially those systems which use certain hydrohaloolefins such as HFO-1234ze and HCFO-1233zd. Normally when foam is produced by bringing together the A and B side components, good foam is obtained. However, if the polyol pre-mix composition (B-side) containing hydrohaloolefins is aged prior to treatment with the polyisocyanate (A-side), the foams are of lower quality and may even collapse during the formation of the foam. The poor foam structure is believed to be attributed to the reaction of certain catalysts with certain hydrohaloolefins, including HFO-1234ze and HCFO-1233zd, which results in the partial decomposition of the blowing agent and, subsequently, the undesirable modification of the polymeric silicone surfactants.
One way to overcome this problem, is by separating the blowing agent, surfactant, and catalyst, and introducing them using as separate streams from the "A-" or "B-" side components, a three stream/component methodology. However, a solution that would not require such reformulation or process change would be preferred. A more favorable method may be to utilize a technology to protect active components such as catalysts and surfactants from their reaction with the blowing agent in the B-side during storage, such as encapsulation using a polymer that its crystallization properties can be thermally tailored to the system.
The commonly used catalysts for polyurethane chemistry can be classified into two broad categories: amine and metallic compounds Amine catalysts are generally selected based on whether they drive the gel catalysis (or polymerization) reaction, in which polyfunctional isocyanates react with polyols to form polyurethane, or the blow catalysis (or gas-producing) reaction in which the isocyanate reacts with water to form polyurea and carbon dioxide Amine catalysts can also drive the isocyanate trimerization reaction. Since some amine catalysts will drive all three reactions to some extent, they are often selected based on how much they favor one reaction over another.
U.S. Patent Application Publication No. 2009/0099274 discloses the use of sterically hindered amines that have low reactivity with hydrohaloolefins in foaming systems. Sterically hindered amines are known to be gelling catalysts. Gelling catalysts are typically tertiary amines characterized in that they have higher selectivity for catalyzing the gelling or urethane reaction over the blowing or urea reaction. These catalysts are expected to perform poorly in systems containing high concentrations of water because of their inability to activate water towards isocyanate.
US Patent Application Publication No. 2009/0099273 discloses that . . . "A shortcoming of two-component systems, especially those using certain hydrohaloolefins, including, HFO-1234ze and HFCO-1233zd is the shelf-life of the B-side composition. Normally when foam is produced by bringing together the A and B component, good foam is obtained. However, if the polyol premix composition is aged, prior to treatment with the polyisocyanate, the foam are of lower quality and may even collapse during the formation of foam", and discloses the use of non-silicone surfactants to stabilize the B-side.
U.S. Pat. No. 6,224,793 discloses the encapsulation of active agents such as catalysts curing agents or accelerators useful in preparing polyurethane to provide for one-part curable compositions which do not require shipment in two parts, an A-side and a B-side. The encapsulated active agents can be designed to release the active agent at a desired temperature. The encapsulated active agents disclosed demonstrate stability for greater than 3 days when exposed to ambient conditions (about 23° C. and about 50 percent relative humidity) and even more preferably for 5 days or greater.
The object of the present invention is to provide novel method of stabilizing polyol blends in presence of low GWP blowing agents by encapsulating of active components such as catalysts and surfactants.

Shelf life of polyol blends containing halogenated olefins by encapsulation of active components


A semiconductor laser diode having a graded interlayer is provided. The semiconductor laser diode has the graded interlayer between an active layer composed of InGaN and an electron blocking layer (EBL) composed of AlGaN. The graded interlayer is composed of InxAlyGa1-x-yN(0≦x≦0.2, 0≦y≦0.5) and is formed by grading a composition of group III materials. Accordingly, the active layer and the p-EBL have a reduced difference in rigidities and lattice parameters, and an abrupt gradient of an energy band and generation of a strain can be avoided in an interface between the active layer and the p-EBL. Since a crack can be prevented from being generated along the interface between the active layer and the p-EBL when a cleavage facet is formed, characteristics of the semiconductor laser diode can be improved.

The present invention relates generally to a semiconductor device, and in particular, to a semiconductor laser diode having a graded interlayer.
Semiconductor laser diodes have lately been put to practical use in various fields, such as optical communication, multiplex communication, and space communication for the reason that light emitted from the semiconductor laser diodes has a narrow frequency width and a sharp directivity. In addition, the semiconductor laser diodes are widely used in a high-speed laser printer and an optical storage device such as a compact disk player (CDP) and a CDP/recorder.
In particular, a nitride semiconductor laser diode has been noticed as a light source of the optical storage device because the nitride semiconductor laser diode has a direct transition type that ensures a high probability of laser oscillation. For another reason, the nitride semiconductor laser diode provides a short oscillation wavelength which covers from an ultra violet region to a green region due to a wide band gap energy.
In addition, the nitride semiconductor laser diode is increasingly popular in terms of environmental friendliness since arsenic (As) is not used as a main component.
The semiconductor laser diode used as the light source of the optical storage device has to satisfy a single mode and a high-output characteristic. For this, the semiconductor laser diode has a ridge waveguide to limit an injected current, so that a threshold current is reduced and a gain is achieved only when in the single mode.
The nitride semiconductor laser diode emits light when holes injected vertically through a ridge are combined with electrons in an active layer. At this time, when the electrons, which are relatively light in weight, pass intactly through the active layer, a problem arises in that the electrons cannot participate in radiative recombination in the active layer.
In order to address such a problem, an electron blocking layer (EBL) has been introduced. That is, by forming the EBL on an upper portion of the active layer, the number of electrons which cannot participate in the radiative recombination is reduced when the electors intactly pass through the active layer.
FIG. 1 is an energy band diagram for explaining a role of an EBL of a conventional semiconductor laser diode.
Referring to FIG. 1, in order to prevent electrons provided from an n-clad layer from passing a quantum well and then jumping to a p-clad layer, a p-EBL is formed between an active layer and the p-clad layer.
The p-EBL acts as a sort of an energy barrier and thus prevents overflow of electrons. By confining the electrons provided from the n-clad layer within the quantum well active layer, the p-EBL enables the electrons to participate in the radiative recombination.
To function as an effective energy barrier, the p-EBL is composed of AlGaN with a high aluminum (Al) composition (e.g., above 20%).
The quantum well active layer is composed of InGaN. In comparison with the p-EBL composed of AlGaN, the quantum well active layer shows a significant difference in rigidities and lattice parameters. As a result, an energy band has an abrupt gradation, and a strain is generated in an interface between the quantum well active layer and the p-EBL.
Meanwhile, light generated by hole-electron recombination in the active layer of the semiconductor laser diode is amplified while reciprocating between a front cleavage facet and a back cleavage facet. The light is emitted when an oscillation requirement is satisfied.
Since the semiconductor laser diode operates according to the aforementioned principle, important features (e.g., threshold current, reliability, optical efficiency, etc.) of the semiconductor laser diode are dependent on the quality (e.g., roughness, angle, crack, etc.) of the cleavage facet.
The cleavage facet of the semiconductor laser diode is formed through a scribing and breaking process in which a physical strength is applied. Therefore, the quality of the cleavage facet is sensitive to a material's rigidity, a strain, etc.
However, in the conventional semiconductor laser diode, the active layer and the p-EBL have significantly different rigidities and lattice parameters from each other. Therefore, while forming the cleavage facet, as shown in FIG. 1, a crack-shaped defect is formed in the cleavage facet along the interface between the active layer and the p-EBL.

Semiconductor laser diode having graded interlayer


After a first wafer on which mirrors and terminals are formed and a second wafer for sealing are stacked and bonded together, the first wafer and the second wafer are diced to manufacture electro-optical devices. In doing so, in a second surface of the second wafer, recesses overlapping the mirrors in a plan view are previously formed, and also grooves overlapping the terminals in the plan view are previously formed. For this reason, when the second wafer is diced along the grooves by advancing a dicing blade for second wafer from a third surface of the second wafer, the dicing blade for second wafer can be prevented from coming into contact with the terminal.

1. Technical Field
The present invention relates to a method for manufacturing an electro-optical device including a mirror, an electro-optical device, and an electronic apparatus.
2. Related Art
As an electronic apparatus, for example, a projection type display device or the like is known. The projection type display device or the like modulates light emitted from a light source with a plurality of mirrors (micromirrors) of an electro-optical device called a DMD (digital mirror device), and then enlarges and projects the modulated light with a projection optical system to thereby display an image onto a screen. The electro-optical device used for the projection type display device or the like includes an element substrate 1 as shown in FIG. 11D. The element substrate 1 includes, on one surface 1s side, mirrors 50 and terminals 17 provided at positions next to the mirrors 50 in a plan view. Moreover, the element substrate 1 is sealed by a spacer 61 and a plate-like light-transmitting cover 71. The spacer 61 is bonded on the one surface 1s side of the element substrate 1 so as to surround the mirrors 50 and the terminals 17 in the plan view. The light-transmitting cover 71 is supported to an edge of the spacer 61 on the side opposite to the element substrate 1.
To manufacture the electro-optical device shown in FIG. 11D, for example, a manufacturing method described below is proposed (see U.S. Pat. No. 6,856,014 B1). First, as shown in FIG. 11A, a first wafer 10 including the mirrors 50 and the terminals 17 on one surface 10s side is formed, while a wafer 60 for spacer in which through-holes 66 are formed and a light-transmitting wafer 70 are stacked and bonded together to form a second wafer 20. As a result, the through-holes 66 serve as bottomed recesses 21. Next, as shown in FIG. 11B, the first wafer 10 and the second wafer 20 are bonded together in a manner such that the recesses 21 overlap the mirrors 50 in a plan view. Next, as shown in FIG. 11C, a dicing blade 82 for second wafer is advanced to the second wafer 20 from the side opposite to the first wafer 10 to dice the second wafer 20 and expose the terminals 17. Next, as shown in FIG. 11D, the first wafer 10 is diced with a dicing blade 81 for first wafer to obtain a plurality of electro-optical devices 100.
In the manufacturing method shown in FIGS. 11A to 11D, however, the second wafer 20 is stacked in a state of being in contact with the terminals 17 as shown in FIG. 11B. Accordingly, when the second wafer 20 is diced in the step shown in FIG. 11C, there is a problem in that the dicing blade 82 for second wafer may come in contact with the terminal 17 and cause damage to the terminal 17.

Method for manufacturing electro-optical device, electro-optical device, and electronic apparatus


A method for minimizing unwanted ancillary reactions in a vacuum furnace used to process a material, such as growing a crystal. The process is conducted in a furnace chamber environment in which helium is admitted to the furnace chamber at a flow rate to flush out impurities and at a predetermined pressure to achieve thermal stability in a heat zone, to minimize heat flow variations and to minimize temperature gradients in the heat zone. During cooldown helium pressure is used to reduce thermal gradients in order to increase cooldown rates.

Field of the Invention
This invention generally relates to the processing of materials in a high-temperature operating environment. More specifically this invention relates to the production of crystalline material in high-temperature vacuum furnaces.
Description of Related Art
Although the following discussion relates to the production of crystals in a high-temperature vacuum furnace, it will be apparent that the methods and apparatus disclosed herein are applicable to any high-temperature operating environment used for the production of various products including, but not limited to, the production of various glasses, amorphous materials, multi-crystalline ingots, such as silicon ingots, and thin films.
A process for producing crystals in an environment, such as found in a high-temperature vacuum furnace, can produce any or all of three general categories of unwanted ancillary or secondary reactions that can affect the final crystal quality. They are: (1) high-temperature chemical reactions, (2) a decomposition of unstable compounds and (3) sublimation or vaporization of certain elements.
High-temperature chemical reactions typically involve carbon or refractory metals such as molybdenum and tungsten, which are often used in the construction of high temperature furnaces. If such reactions occur, they can degrade the furnace. Examples of reactions involving graphite-containing furnaces include:C(s)+2Mo(s)→Mo2C  (1)andH2O(g)+C(s)→CO+H2(g)  (2)The carbon monoxide can then react with any refractory metals and thereby form carbides and volatile species.
Molybdenum crucibles also react with Al2O3 at high temperatures in vacuum to form:Al2O3(s)+Mo(s)→MoO2(g)+AlO(g)+Al(g)  (3)and other compounds as well through similar reactions.
Silicon in a silica crucible operating at a melt temperature of 1412° C. and at a pressure below 10 Torr reacts to form gaseous SiO by the reaction:SiO2(s)+Si(s)→2SiO(g)  (4)
At about 1400° C. gaseous SiO reacts with carbon at pressures below 10 Torr to produce highly reactive carbon monoxide (CO) and SiC. That is:2C(s)+SiO(g)→SiC(s)+CO(g)  (5)Silicon carbide can seriously degrade the quality of silicon grown from the melt.
Also, CO reacts with silicon below 10 Torr to form carbon and silicon monoxide according to:CO(s)+Si(s)→C(s)+SiO(g)  (6)Such a reaction can lead to an unwanted deposition of SiO gas onto surfaces in the colder regions of the furnace. In addition, silicon carbide can seriously degrade the quality of silicon grown from the melt.
At elevated operating temperatures certain compounds become unstable and decompose. For example:2MgO(g)→2Mg(s)+O2(g)  (7)whereby free oxygen can react with both the materials used in the furnace itself and with the material being processed in the furnace to form oxides.
As another example, spinel decomposes to magnesium oxide and aluminum oxide according to:MgAl2O4(s)→MgO(g)+Al2O3(s)  (8)where MgO reacts as described above.
Sublimation, or vaporization, occurs when certain elements or compounds are elevated to high temperatures. As known, all metals and some refractory materials are prone to vaporize or sublime at high temperatures. Graphite will sublime at a high temperature into carbon vapor. For example, graphite will sublime into carbon vapor above 2200° C. The carbon vapor can react with a crucible and contaminate the crucible contents.
In crystal manufacturing processes, ancillary reactions, such as reaction (1) above and sublimation, can produce gaseous species. As known, such gas can be captured in the material being processed causing a crystal, for example, to have imperfections, such as inclusion or bubbles, which produces undesirable light scatter.
In high-temperature environments, heating elements are also susceptible to the existence of "hot spots," which are due to variations in resistivity in the heating element or power source variations, or "cold spots," which are caused, for example, by leaky insulation. During processing, hot and cold spots can result in non-uniform or non-symmetrical crystal growth. During crystal growth and cooldown, hot spots and/or cold spots produce thermal stress gradients in the crystal that can cause stress defects including dislocations that cause lattice distortion and/or cracking. As known, the existence of fine particles of previous reaction products or of furnace construction materials, such as graphite felt or moisture, that react inside a heat zone can degrade furnace performance and even obscure viewing through viewports.
What is needed is a process and control thereof that minimizes unwanted ancillary reactions and unwanted temperature gradients during processing in high-temperature environments.

High-temperature process improvements using helium under regulated pressure


A semiconductor laser device is one of AlGaInAs semiconductor laser devices, and has a multi-layer structure with a n-GaAs substrate on which a n-Al0.3Ga0.7As buffer layer, a n-Al0.47Ga0.53As clad layer, active layer portion, p-Al0.47Ga0.53As clad layer and p-GaAs cap layer are formed. The active layer portion is configured as a multi-layer structure including (Al0.37Ga0.63)0.97In0.03As light guide layer, Al0.1Ga0.9As active layer and (Al0.37Ga0.63)0.97In0.03As light guide layer. By using the AlGaInAs layer to which In is added is used as the light guide layers, the active layer is under compressive strain. Accordingly, the lattice constant of the active layer at the laser emitting edge becomes smaller due to a force from the adjacent light guide layers. The band gap energy of the active layer near the laser emitting edge becomes larger than the inside of laser device, thereby forming the window structure.

1. Field of the Invention
The present invention relates to a semiconductor laser device. Specifically, the present invention relates to a highly reliable semiconductor laser device capable of long and stable operation with a high output power.
2. Description of the Related Art
In many of recent applications of semiconductor laser devices, there is need for both higher power output and higher reliability in operation than currently available. One of reasons preventing such higher power output of the semiconductor laser device is catastrophic optical damage (COD) caused by light absorption occurred near a laser emitting edge of an active layer.
It is suspected that the COD is caused by lowering of a band gap due to relaxation of lattice strains near the laser emitting edge or surface levels existed in the laser emitting edge.
To countermeasure such COD phenomenon, various methods are proposed to suppress the light absorption near the laser emitting edge by enlarging band gap energy of the active layer region near the laser emitting edge so as that the active layer region becomes transparent to an oscillation wavelength of the laser device.
Such construction of the semiconductor laser device is referred to as, in general, a window structure laser or non absorbing mirror (NAM) structure laser. Such a structure is known to be suitable for a semiconductor laser device for generating a higher power output.
Various methods are proposed for fabricating the window structure. For example, the methods may includes a method in which semiconductor material that is transparent to an emission wavelength is epitaxially grown at the laser emitting edge, or a method in which impurities such as Zn, Si and the like are intentionally diffused in the active layer near the laser emitting edge for disordering.


A parting and grooving tool includes a toolholder and a cutting insert. The toolholder has a toolholder body including a main body portion and an elastic clamping arm that define an insert-receiving pocket. The pocket has a top surface formed by the clamping arm and a bottom surface formed by the main body portion for contacting a top and a bottom surface of a cutting insert. The toolholder body includes a second arm, the second arm and the clamping arm defining a slot. A threaded hole extends through the second arm to the slot. The toolholder has a screw having threads that mate with threads in the threaded hole so that the clamping arm is movable into and out of contact with the top surface of the insert. An axis of the threaded hole is substantially perpendicular to a longitudinal axis of the insert-receiving pocket and intersects the cutting insert.

The present invention relates to parting and grooving tool with clamping arrangements.
Certain machining operations, such as cut-off and grooving operations, typically involve the use of a thin toolholder having a pocket formed therein in which an insert is received. Ordinarily, the insert is held in the pocket between an elastic arm of the toolholder and the rest of the toolholder body. The insert is received in the pocket by some form of tool that pries the elastic arm to open the pocket wider, and then the insert is clamped in the pocket when the tool is removed. The tools for opening the insert-receiving pockets tend to be complex and difficult to position, making the task of indexing or replacing inserts in a toolholder difficult. An example of a conventional tool is shown in U.S. Pat. No. 5,207,537, or U.S. Pat. No. 4,580,930; the preamble of claim 1 being based the latter.
It is desirable to provide a toolholder that provides a simple structure to facilitate and improve clamping of inserts in a pocket of the toolholder.

Parting and grooving tool with clamping arrangements


A hose connector is disclosed that provides a magnetized connection of hoses, tubes, cables, ducts, pipes, chains, straps, wires, twine, cord and/or rope creating a continuation in length for versatile and extended flow for, but not limited to, watering needs eliminating conventional connector threads currently requiring multiple turns to release or attach or existing pronged coupling requiring a degree of hand agility and strength. Thereby the disclosed matter provides the means for a fast, single motion attachment or twisting detachment of, but not limited to hose, tube, cable, duct, pipe, chain, strap, wire, twine, cord and/or rope ends without requiring the hand strength or precision that some conventional hose, tube, cable, duct, twine, cord, and/or rope connectors may require. There may be any combination of connecting the ends of hoses, tubes, cables, ducts, pipes, chains, straps, wires, twines, cords, and/or ropes. In some scenarios, flow is not required.

When connecting some conventional hoses, tubes, cables, ducts, pipes, chains, straps, wires, twines, cords, ropes, or the like it is often useful to join the end of any combination of the above to an end attachment or a source of fluid and/or to extend the length and reach. Some conventional hoses, and/or tubes, often present difficulty when attempting to establish a solid connection and/or a fluid-tight seal through twisting existing threaded or pronged hose and tube connectors. This may be difficult for some people lacking hand strength, wearing gloves, or with gripping limitations such as arthritis. A need exists to connect hoses, tubes, cables, ducts, pipes, chains, straps, wires, twines, cords and/or rope, etc. . . . with less effort and more ease.
Thus, there may be a need in the conventional art for, including but not limited to a hose, tube, cable, duct, pipe, chain, straps, wires, twine, cord and/or rope connector that may be easier to operate even while wearing gloves, or with limited dexterity or hand strength, to provide an effective, fast, efficient, safe, simple, easy-to-use, time saving, experience. The disclosed subject matter was conceived in light of the above-mentioned problems and/or limitations.

Magnetic hose connector and integrated magnetic connectors


A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.

Embodiments of the inventive concept described herein relate to an apparatus and method for treating a substrate, and more particularly, relate to a substrate treating apparatus and method for cleaning a processing vessel.
Various processes, such as photolithography, etching, ashing, thin-film deposition, cleaning, and the like, are performed to manufacture semiconductor devices or flat display panels. Among these processes, the photolithography, etching, ashing, and cleaning processes include a process of treating a substrate with a treating liquid by dispensing the treating liquid onto the substrate.
The photolithography process includes a coating step, an exposing step, and a developing step. The coating step is a coating process of coating a substrate with a light-sensitive liquid such as photoresist, and part of the light-sensitive liquid used is recovered through a processing vessel.
Referring to FIG. 1, a substrate coating apparatus in the related art includes a liquid dispensing member 2, a housing 3, a substrate support member 4, and a processing vessel 5. The substrate support member 4 supports and rotates a substrate W, and the processing vessel 5 surrounds the substrate support member 4. A light-sensitive liquid is dispensed onto the substrate W, and the light-sensitive liquid used is recovered through a recovery line of the processing vessel 5. The light-sensitive liquid, which is a chemical with viscosity, adheres to the inner side of the processing vessel 5 in the recovery process. Due to this, a cleaning process for cleaning the inner side of the processing vessel 5 has to be performed after the performance of the coating process on the substrate W.
The cleaning process is performed by dispensing a cleaning solution toward the center of a rotating substrate W and allowing the dispensed cleaning solution to collide with the processing vessel 5 while being scattered outside the substrate W. However, it is difficult to clean an upper part 6 of the processing vessel 5 by the cleaning process. Furthermore, cleaning efficiency is deteriorated because the cleaning solution applies a collision force to the inner side of the processing vessel 5 only in the horizontal direction.

Apparatus and method for treating substrate


Systems and methods for processing instant messenger messages are described. In one embodiment, an instant messenger event is captured by compiling event data associated with at least one instant messenger message, the instant messenger event is associated with a conversation, and at least some of the event data associated with the instant messenger event is indexed.

Users generate and access a large number of articles, such as emails, web pages, word processing documents, spreadsheet documents, instant messenger messages, and presentation documents, using a client device, such as a personal computer, personal digital assistant, or mobile phone. Some articles are stored on one or more storage devices coupled to, accessible by, or otherwise associated with the client device(s). Users sometimes wish to search the storage device(s) for articles.
Conventional client-device search applications may significantly degrade the performance of the client device. For example, certain conventional client-device search applications typically use batch processing to index all articles, which can result in noticeably slower performance of the client device during the batch processing. Additionally, batch processing occurs only periodically. Therefore, when a user performs a search, the most recent articles are sometimes not included in the results. Moreover, if the batch processing is scheduled for a time when the client device is not operational and is thus not performed for an extended period of time, the index of articles associated with the client device can become outdated. Conventional client-device search applications can also need to rebuild the index at each batch processing or build new partial indexes and perform a merge operation that can use a lot of client-device resources. Conventional client-device search applications also sometimes use a great deal of system resources when operational, resulting in slower performance of the client device.
Generally, conventional search engines do not index instant messenger messages and/or allow a user to search instant messenger messages. Some applications exist that store and/or log a user's instant messages, but these applications generally do not index the user's instant messenger messages.
Additionally, conventional client-device search applications can require an explicit search query from a user to generate results, and may be limited to file names or the contents of a particular application's files.

Methods and systems for processing instant messenger messages


A method and apparatus for detecting muscular status in which electrodes are connected to the body muscles being investigated for producing analog myoelectric signals which are amplified in an amplifier and fed to an A/D converter connected to a signal processing unit. A signal device is connected to the signal processing unit. The analog signals from the electrodes are converted, after amplification, into binary signals which are frequency-analyzed in the signal processing unit by comparing the appearance and/or position of a frequency spectrum in relation to a predetermined initial position at commencement of the detection. Signals relating to the shift of the frequency spectrum in relation to its initial position are emitted by the signal device or stored in a storage device.

In many contexts, there is a manifest interest in establishing muscular status, by which is taken to mean both the status of muscle at rest and the status of muscle at work. It is of particular interest to be able to follow the change in the status of the muscle during work and, in such instance, preferably to obtain a continuous and/or immediate information on status with the possibility of recording this for subsequent follow-up.
Such establishment of muscular status is, of course, interesting in purely scientific contexts and in the event of illnesses, but is also of considerable value in many practical applications, for example of people carrying out industrial assembly work or certain types of office work (e.g. terminal work at computers). By establishing muscular status, the possibility will be created, for example, for studying the effect of the design and layout of the workplace and the working position, respectively, on muscle loading, and for analyzing the consequences of prolonged monotonous muscle loading. This latter working situation occurs in both the assembly industry and in office work.
A correct establishment of muscular status in lengthy loading would make it possible, at best, to wholly avoid the risk of chronic muscular disorder or could be used to identify those stages of labor, which, for a given individual, cause, for instance chronic pain. The information would make it possible to modify the design of tools or the workplace in order to avoid such resulting or injuries. In particular, real time knowledge of the state of fatigue of the muscles could be essential in evaluating the effect of the work involved on the muscles.
It is obvious that there is also a need in this art for a technique for continuous recording of muscular status. Such a technique would, thus, make it possible to establish how muscular fatigue changes during a work shift or a series of work shifts, at the same time as such recording would make it possible to objectively analyze and identify how changes in the design of the workplace, for example the design of auxiliary aids, tools etc influence the degree of muscular fatigue and its development in prolonged work. It should be observed that, at low muscular loading which is continuous for a lengthy time, the individual himself does not observe that the muscle becomes fatigued. There are firm grounds for assuming that, when such situations exist, there is a risk of chronic muscular injury.
Also desirable is a technique which permits direct feedback to the individual of information concerning current muscular condition in order thereby to gain the possibility of warning, while work is in progress, of muscle loadings and stresses which risk resulting in injury.

Method and an apparatus in electromyography


The present invention relates to an apparatus for adjusting a slew rate of a data signal outputted by a signal from an external circuit in a semiconductor memory device and a method therefor. The apparatus includes: a slew rate control signal generation block for outputting a plurality of slew rate control signals through combining control codes inputted from the external circuit in response to a command signal; and a data buffer for adjusting a slew rate of a data signal inputted by using the slew rate control signals.

1. Field of the Invention
The present invention relates in general to semiconductor memories, and more particularly, to improved output buffer circuitry for semiconductor memories.
2. Description of Related Arts
Today's semiconductor memory devices include more than hundreds of millions of memory cells. A basic function of the semiconductor memory device is to input and output data for the purpose of writing the data on such memory cells and reading the written data. To increase speed of operation, a class of semiconductor memory device has evolved from a synchronous dynamic random access memory (SDRAM) device to a double data rate (DDR) RAM device to a DDR II RAM device. Despite this evolution, there has not been a great change in the basic operation of the semiconductor memory device such as a refresh operation for refreshing each memory cell, or data input and output (I/O) operation for transmitting data between an external circuit and an internal circuit.
The above basic and unique function will be maintained even in a next generation semiconductor memory technology aimed to write or read data in high-speed and reduce manufacturing costs.
FIG. 1 is a block diagram showing a conventional semiconductor memory device.
The semiconductor memory device includes: a command and address control circuit 102, a row decoder 103, a column decoder 104, a memory array or cell area 105, an input/output driver 106, a data input buffer 107, a data input register 108, a data output register 109, and a data output buffer 110.
The command and address control circuit 102 receives a command COMM and an address ADDR from an external circuit such as a microprocessor and transmits the address ADDR to the row decoder 103 and to the column decoder 104. Also, the command and address control circuit 102 controls the row decoder 103, the column decoder 104, the data input buffer 107, the data input register 108, the data output register 109, and the data output buffer 110 in response to the inputted command COMM.
The cell area 105 includes a plurality of memory cells for storing a data and sense amplifiers for amplifying stored data. The row decoder 103 and the column decoder 104 select a memory cell to be read and written corresponding to the command COMM and the address ADDR inputted from the external circuit. Herein, the command COMM includes a plurality of instructions responsible for a row access and a column access in operation of the DRAM device. A row address strobe (RAS) signal, a column address strobe (CAS) signal and a write enable (WE) signal are examples of such instructions. Likewise, the address ADDR includes a row address and a column address for accessing a memory cell.
Hereinafter, operation of the semiconductor memory device will be described in detail. Once the RAS signal is activated, the row address is inputted. The row decoder 103 decodes the row address, and then, a number of the memory cells corresponding to the decoded address are activated. A data having a low potential stored within the activated memory cells is amplified by the sense amplifiers of the cell area 105. The sense amplifier is ready for a write operation or a read operation after amplifying the accessed data, i.e., the data stored within the activated memory cells. That is, the sense amplifiers can serve as a data cache for temporarily storing data.
In case of a read operation, once the CAS signal is activated, the column address is decoded and the data stored into a part of the sense amplifiers serving as the data cache is outputted to an internal data bus. The outputted data is stored into the data output register 109. The data stored into the data output register 109 is outputted after a predetermined time through the data output buffer 110.
FIG. 2 is a schematic circuit diagram describing the data output buffer 110. When a data clock signal DCLK is inputted under a state that an output enable signal OE is activated, a phase of a data signal DATA is determined and then, the data signal DATA is outputted to the input/output driver 106 shown in FIG. 1. At this time, a slope of the outputted signal is called a slew rate. The slew rate is expressed with a specific unit, for instance, 3V/ns, meaning that a voltage level of a signal is activated from about 0 V to about 3 V for about 1 nanosecond. If a logic low level is about 0 V and a logic high level is about 3 V in the semiconductor memory device, it is easy to understand how long a data signal is changed from a logic low level to a logic high level.
Herein, a first resistor R1 and a second resistor R2 are a kind of passive devices for determining the slew rate. Although the slew rate can be determined by various types of devices, particularly the slew rate determined by resistors will be described in this drawing.
In a conventional design of a DRAM device, the slew rate is generally provided as a fixed value. Thus, if the slew rate is high, a quality of a signal is reduced by bounce noises, and if the slew rate is low, an access time is greatly variable, thereby resulting in the signal quality reduction. Herein, the signal quality can be regarded as a signal integrity. The signal is outputted for a predetermined period including a data generating period and a data setting period. Herein, the data generating period generally called a data window is a period for generating a voltage level of an inputted or outputted signal to be stably sensed or transmitted. The data storing period circuit a period for determining a voltage level of the inputted or outputted signal, e.g., the voltage level from a logic high to a logic low or a logic low to a logic high. Thus, a good signal integrity indicates that the data guaranteeing period is relatively longer.
FIG. 3A is a diagram showing a waveform of a data output signal in case of an unsuitable slew rate. As shown, the data output signal has large amounts of noises. On the other hand, FIG. 3B is a diagram showing a waveform of a data output signal in case of a preferable slew rate. As shown, the data output signal has a sufficient data window.
However, since the slew rate is provided as the fixed value when a DRAM device is designed and manufactured, it is impossible to adjust the slew rate in the DRAM device according to a generation speed, a power level and so on.

Apparatus for adjusting slew rate in semiconductor memory device and method therefor


The embodiments of the present invention relate to a method for forming a magnetic read head with pinned layers extending to the ABS of the read head and magnetically coupled with an antiferromagnetic layer that is recessed in relation to the ABS of the read head. Portions of the antiferromagnetic layer and a magnetic layer that are extending to the ABS are removed, exposing a shield. A shielding material is formed on the exposed shield and a seed layer is formed on the shield and on or over a portion of the remaining antiferromagnetic layer. A pinned layer structure is formed on the seed layer and the magnetic layer.

1. Field
Embodiments of the present invention generally relate to a magnetic read head for use in a hard disk drive.
2. Description of the Related Art
The heart of a computer is a magnetic disk drive which typically includes a rotating magnetic disk, a slider that has read and write heads, a suspension arm above the rotating disk and an actuator arm that swings the suspension arm to place the read and/or write heads over selected circular tracks on the rotating disk. The suspension arm biases the slider towards the surface of the disk when the disk is not rotating but, when the disk rotates, air is swirled by the rotating disk adjacent an air bearing surface (ABS) of the slider causing the slider to ride on an air bearing a slight distance from the surface of the rotating disk. When the slider rides on the air bearing, the write and read heads are employed for writing magnetic impressions to and reading magnetic signal fields from the rotating disk. The read and write heads are connected to processing circuitry that operates according to a computer program to implement the writing and reading functions.
The read head typically utilizes a spin valve sensor, also referred to as a giant magnetoresistive (GMR) sensor. The sensor at the ABS typically includes a barrier layer sandwiched between a pinned layer and a free layer, and an antiferromagnetic layer for pinning the magnetization of the pinned layer. The magnetization of the pinned layer is pinned perpendicular to the ABS and the magnetic moment of the free layer is located parallel to the ABS, but free to rotate in response to external magnetic fields.
The need for ever increased data density is pushing researchers to develop data recording systems that can read and record ever smaller bit lengths in order to increase the density of data recorded on a magnetic medium. This has led to a push to decrease the gap thickness of a read head such as a GMR head. However, the amount by which such gap thickness can be decreased has been limited by physical limitations of sensors and also by the limitations of currently available manufacturing methods.
A self-pinned sensor in which the antiferromagnetic layer is reduced in thickness or removed completely so as to not provide a pinning field for the pinned layer structure provides a method to reduce the read gap. The self-pinned sensor is, however, sensitive to magnetic disturbances caused, for instance, by a head-media impact, which may flip the polarity of the amplitude of the output signal from the read head. Such a failure would reduce the reliability of the recording system.
Therefore, there is a need for an improved magnetic head and method of manufacture that can reduce the read gap thickness while still preserving the reliability of the magnetic head.


A sample introduction device 100 includes a heating unit 102, an ultraviolet irradiation unit 103, and a sample supply part 106. The heating unit 102 vaporizes a sample 22 by heating externally a container 2 in which the sample 22 is enclosed. The ultraviolet irradiation unit 103 causes ultraviolet rays to pass through the container 2 and irradiates the sample 22 with the ultraviolet rays. The sample supply part 106 supplies the sample vaporized in the container 2 to a gas chromatograph 1 side.

As an example of a sample introduction device for introducing a sample into a gas chromatograph, a sample introduction device adopting a thermal desorption system is known (for example, see Patent Document 1 below). In this type of sample introduction device, by heating a sample tube in which a sample is trapped to desorb sample components, the sample components are once trapped in a trap column. Then, by heating the sample components in the trap column, the sample components are desorbed. Thus, the sample components can be introduced into a gas chromatograph.
In the case of trapping a sample in the sample tube, for example, a chamber is used. Specifically, by heating the inside of the chamber and vaporizing the sample in a state where the sample is contained in the chamber, the vaporized sample is trapped in the sample tube. By setting the sample tube in which the sample is trapped in this manner in the sample introduction device adopting the thermal desorption system, the sample in the sample tube is desorbed and is introduced into the gas chromatograph.
When the sample is vaporized in the chamber, if the sample is irradiated with ultraviolet rays, the sample may be changed in quality. That is, by heating the sample while irradiating the sample with ultraviolet rays, it is possible to trap a gas generated at a time when the sample is changed in quality in the sample tube and to analyze the gas.
FIG. 10 is a schematic cross-sectional view for explaining an aspect for trapping a sample in a sample tube 500. As illustrated in FIG. 10, a sample 501 is contained in a chamber 502 and is heated. An ultraviolet lamp 503 emits ultraviolet rays into the chamber 502. In addition, an inert gas such as a nitrogen gas or a helium gas is supplied into the chamber 502. The sample tube 500 is detachable from the chamber 502.
In the case of trapping the sample 501 in the sample tube 500, as illustrated in FIG. 10, the sample 501 is heated while being irradiated with ultraviolet rays from the ultraviolet lamp 503 in a state where the sample tube 500 is attached to the chamber 502. Thus, the sample 501 is vaporized and gas is generated. Then, the inert gas is supplied into the chamber 502, and therefore the vaporized sample is introduced into the sample tube 500 together with the inert gas.
An adsorbent 504 is provided in the sample tube 500. The vaporized sample is adsorbed and trapped by the adsorbent while passing through the sample tube 500. After the sample is trapped in the sample tube 500 in this manner, the sample tube 500 is detached from the chamber 502 and set in a sample introduction device adopting a thermal desorption system.

Sample introduction device for gas chromatograph


Disclosed is a refrigerator having a dispenser comprising: a dispenser case mounted at one side of a refrigerator door; a cold water faucet and a hot water faucet provided in the dispenser case and from which cold water and hot water are supplied; and a dispenser door for opening and closing the dispenser case. In this construction, a hot water button is prevented from being pressed by a child by mistake and thus a child is prevented from getting burned by hot water from the hot water faucet, thereby enhancing a stability. Also, when a cup or a container becomes hot while or after the user gets hot water from the hot water faucet in the cup or the container, the cup or the container can be placed on the dispenser door thereby to enhance the user's convenience.

1. Field of the Invention
The present invention relates to a refrigerator, and more particularly, to a refrigerator having a dispenser capable of enhancing a stability of the dispenser for supplying cold water or hot water and capable of utilizing the dispenser more conveniently.
2. Description of the Conventional Art
Generally, a refrigerator is provided with a refrigerating cycle system therein. A freezing chamber and a chilling chamber of the refrigerator are maintained as a cold state as cool air is generated from an evaporator constituting the refrigerating cycle system and the generated cool air circulates in the freezing chamber, the chilling chamber, etc. Food is stored in the freezing chamber, the chilling chamber, etc.
The refrigerator is classified as various types according to a method for circulating cool air, a position of the freezing chamber and the chilling chamber, and a construction of the evaporator.
In order to satisfy a consumer's various demands, the refrigerator is provided with various equipments. One of them is a dispenser by which a user can enjoy cold water or hot water from outside without opening a refrigerator door.
FIG. 1 is a perspective view showing one embodiment of a refrigerator having a dispenser in accordance with the conventional art, and FIG. 2 is a perspective view showing the dispenser of the refrigerator in accordance with the conventional art.
As shown, the refrigerator having a dispenser comprises: a refrigerator body 100 having a freezing chamber (not shown) and a chilling chamber (not shown) therein; and a refrigerator door 200 rotatably mounted at one side of the refrigerator body 100, for opening and closing the freezing chamber and the chilling chamber.
The refrigerator body 100 is provided with not only a refrigerating cycle system, but also a cool air circulating passage for circulating cool air generated at the refrigerating cycle system into the freezing chamber or the chilling chamber, etc.
A dispenser is provided at one side of the refrigerator door 200. The dispenser includes: a dispenser case 310 having a certain area and depth and insertion-coupled to one side of the refrigerator door; a cold water faucet 320 mounted in the dispenser for supplying cold water; a cold water button 330 for opening and closing the cold water faucet 320 in order to supply cold water through the cold water faucet 320; a hot water faucet 340 mounted in the dispenser for supplying hot water; a hot water button 350 for opening and closing the hot water faucet 340; and a dispenser control box 360 mounted at the dispenser case 310.
A front surface of the dispenser case 310 is opened, and a remaining water accommodating portion 311 for temporarily storing water leaked from the cold water faucet 320 and the hot water faucet 340 or dropped by a user is provided at a lower surface of the dispenser case 310.
The cold water faucet 320 and the hot water faucet 340 are respectively formed as a pipe shape having a certain length, and are arranged in parallel each other. The cold water button 330 and the hot water button 350 are respectively installed at a rear side of the cold water faucet 320 and the hot water faucet 340.
Function keys and a display portion are provided at the front surface of the dispenser control box 360.
A water tank (not shown) is provided in the refrigerator body 100, and the water tank is connected to an external water supplying source such as a tap by a connection hose 400. The water tank is connected to the dispenser by a water supplying hose (not shown), and the water supplying hose is arranged in the refrigerator door 200.
In the refrigerator having the dispenser, a user stores food in the freezing chamber or the chilling chamber with opening the refrigerator door 200.
In case of requiring cold water or hot water, the user uses the dispenser provided at the outside of the refrigerator door 200 without opening the refrigerator door 200. That is, in case of requiring cold water, the user positions a cup or a container at a lower portion of the cold water faucet 320 and then presses the cold water button 330 thus to contain cold water from the cold water faucet 320 in the cup or the container. Also, in case of requiring hot water, the user positions a cup or a container at a lower portion of the hot water faucet 340 and then presses the hot water button 350 thus to contain hot water from the hot water faucet 340 in the cup or the container.
However, according to the refrigerator having the dispenser, the dispenser is installed at the front surface of the refrigerator door 200 as an opened state.
Therefore, in case that a child presses the hot water button 350 by mistake, the child gets a burn by the hot water from the hot water faucet 340.
Also, since an installation space of the dispenser for supplying hot water or cold water is narrow, the user has to hold a hot cup continuously in case of getting hot water thereby to cause an inconvenience.


An object sensing system (10) employs a resonant sensor (20) that receives drive energy coupled from an oscillator (12) operating at a frequency equal or close to the resonant frequency of the resonant sensor. The resonant sensor preferably includes an planar winding (60) that maximizes its distributed inductive and capacitive components, which are sensitive to a proximal conductive, nonconductive, magnetic, or nonmagnetic object (22). The resonant sensor is electrically connected in one leg of a voltage divider that produces a changing output signal voltage in response to resonant frequency changes caused by the object in proximity to the resonant sensor. The signal voltage is amplified, filtered, and processed to extract relevant data indicative of the presence, distance, movement, or proximity of the object.

There are various types of prior proximity sensors employing ultrasonic, infrared ("IR"), or electrical measurement techniques. Ultrasonic and IR sensors make proximity measurements based on reflections of ultrasonic and IR radiation. Such sensors are, however, disadvantageous in some applications because of their relatively high cost and directionality.
Electrical sensors are of various types including inductive and capacitive proximity sensors, which make measurements based on sensing a frequency change, operating regime change, or absorbed current change of an oscillator having a feedback circuit that includes the sensor. However, such electrical sensors may have at least one of the following disadvantages:
They do not provide a direct analog measurement, such as a voltage or current level, at their outputs; PA1 they are highly susceptible to external electromagnetic fields; PA1 they have limited sensitivity, particularly to nonmetallic objects; PA1 they operate poorly in the vicinity of objects that have magnetic properties and/or are good electrical conductors; and PA1 they have poor high-frequency response that limits their ability to sense rapid movements and are, therefore, not useful in many biomedical, virtual reality, multimedia, and industrial applications.
What is needed, therefore, is a low-cost position and movement sensor capable of sensitively detecting metallic and nonmetallic objects and providing a direct output representing the movement, presence, or proximity of such objects.


Embodiments of the presently-disclosed subject matter include a first laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed is formed on a supporting substrate, and a core substrate is formed so as to come into contact with the conductor layer which is the uppermost layer of the first laminated structure. Then, laser light is emitted to the core substrate to form a through hole and a metal layer is formed in the through hole. Then, a second laminated structure including at least one conductor layer and at least one resin insulating layer is formed on the core substrate. At that time, the thickness of the conductor layer which is the uppermost layer of the first laminated structure is greater than that of the other conductor layers.

1. Field of the Invention
The present invention relates to a method of manufacturing a multi-layer wiring board.
2. Description of Relate Art
In general, as a package having electronic components mounted thereon, a multi-layer wiring board has been used in which resin insulating layers and conductor layers are alternately formed on both sides of a core substrate to form buildup layers (JP-A-11-233937). In the multi-layer wiring board the core substrate is made of a resin including, for example, a glass fiber, that has high rigidity and reinforces the buildup layers. However, since the core substrate has a large thickness, it hinders a reduction in the size of the multi-layer wiring board. Therefore, in recent years, the thickness of the core substrate has been reduced to reduce the size of the multi-layer wiring board.
However, when the thickness of the core substrate is reduced, the strength of an assembly including the core substrate is reduced during a manufacturing process and it is difficult to horizontally convey the core substrate or the assembly. During conveyance, the core substrate or the assembly (substrate which is being manufactured and will be the multi-layer wiring board) comes into contact with a conveyance mechanism and is damaged. In addition, the core substrate or the assembly is fixed in each manufacturing process. When the core substrate or the assembly is provided to a predetermined manufacturing process, it is bent, which makes it difficult to perform, for example, a plating process with high accuracy. As a result, in the multi-layer wiring board including the core substrate, when the thickness of the core substrate is reduced, the manufacturing yield of the multi-layer wiring board is reduced.
From this point of view, a so-called coreless multi-layer wiring board has been proposed which does not include a core substrate, is suitable to reduce the size, and is capable of improving the transmission performance of a high-frequency signal (JP-A-2009-289848 and JP-A-2007-214427). For example, the coreless multi-layer wiring board is formed as follows. A buildup layer is formed on a supporting substrate on which a release sheet, which is a laminate of two separable metal films, is formed and the release sheet peels off at the peeling interface between the two metal films to separate the buildup layer from the supporting substrate. In this way, a desired multi-layer wiring board is obtained.
However, since no core layer is provided in the coreless multi-layer wiring board, the strength of the coreless multi-layer wiring board is weak and the coreless multi-layer wiring board requires careful handling. In addition, the purpose of the coreless multi-layer wiring board is limited.

Method of manufacturing multi-layer wiring board


A current sensor includes: a current path; a semiconductor substrate; and a Hall element on the substrate. The Hall element detects a magnetic flux in a magnetic field caused by a detection object current. The Hall element generates a Hall voltage corresponding to the magnetic flux when a driving current flowing in a direction perpendicular to the semiconductor substrate is supplied to the Hall element, and when the magnetic flux having a component parallel to the semiconductor substrate affects the Hall element. The current path is disposed on the semiconductor substrate. The current path is electrically isolated from the Hall element.

Conventionally, a current sensor having a lateral type Hall element for detecting current flowing through a current path is well known. The lateral type Hall element is formed on a semiconductor substrate, and the Hall element detects a magnetic flux in a vertical direction of the substrate. The current sensor detects the magnetic flux by using the Hall element in a case where the magnetic flux is generated in a magnetic field when the current as a detecting object flowing though the current path. In the current sensor, the current path passes through a magnetic field concentration core having a C-shape, and a sensor chip including the Hall element is mounted between two ends of the C-shape of the core. Thus, the magnetic flux generated between two ends of the core in the vertical direction is detected by the Hall element. In this case, the concentration core is necessary for the current sensor. Accordingly, the dimensions of the current sensor become larger.
In JP-A-2003-262650, a current sensor including a magnetic sensor has a magnetic field concentration plate. The magnetic sensor includes a lateral type Hall element, and the magnetic field concentration plate is mounted on a top of the magnetic sensor. The concentration plate made from soft magnetic material concentrates a magnetic flux. The Hall element is mounted between two ends of the concentration plate so that the Hall element detects the magnetic flux in the vertical direction of a substrate surface. Thus, the current sensor detects a current. In this case, the current sensor has no magnetic field concentration core; and therefore, the dimensions of the current sensor become smaller.
However, although the dimensions of the current sensor are small, the magnetic field concentration plate is necessary for the current sensor. Thus, since a magnetic field concentration member such as the concentration core and the concentration plate is required for the current sensor, minimization of the dimensions of the current sensor is limited by the dimensions of the concentration member.
Further, in order to detect the magnetic flux caused by the detection object of the current accurately, the positioning among the current path, the Hall element and the concentration member is required to be more accurate. If the positioning among these three elements is deviated, the detection accuracy is varied. Thus, the detection accuracy of the current sensor is reduced.


A plating processing device comprises: a plating bath, on which an object to be plated is mounted; and a sparger provided with plating nozzle and washing nozzle for jetting plating solution and washing solution, respectively, toward the object in such a manner that the used plating solution and washing solution are accumulated and collected in the plating bath. Plating solution is supplied to the plating nozzle from a plating solution tank. Washing solution is supplied to the washing nozzle from a washing solution tank. The used plating solution and washing solution are accumulated in the plating bath, are recovered to the plating solution tank and used again as a plating solution.

1. Field of the Invention
The present invention relates to a plating processing device. More particularly, the present invention relates to a plating processing device used for manufacturing electronic parts such as lead frames, semiconductor wafers and so forth.
2. Description of the Related Art
There is provided a plating process such as a gold plating process in which an inner lead of a lead frame or a terminal of a wiring board is plated with gold in the process of manufacturing a semiconductor device. Various plating methods are used in the plating process. For example, in the case of partially plating an object to be plated such as a lead frame, the lead frame is interposed between masks used for plating, and a plating solution is jetted out into a plating region of the object that is exposed from the masks so as to conduct plating on the object to be plated.
After the completion of plating, the object which has been plated is dipped in a recovery tank to recover plating components so that a plating solution adhering to the object can be removed. Next, the plating solution adhering to the surface of the object is washed away in a washing tank.
In the plating process in which electronic parts such as lead frames are plated, an expensive plating solution such as a gold plating solution is used in some cases. Therefore, it is effective to recover and recycle the plating solution. Further, it is necessary to wash the object after the completion of plating in order to prevent the plating solution remaining on the object from exerting a bad influence on a product.
Concerning the method of washing the object to be plated, the following methods are used. One method is described as follows. After a plating solution has been jetted out to a semiconductor wafer in the process of manufacturing the semiconductor wafer, pure water is jetted out from the plating solution jetting nozzle to the semiconductor wafer so as to wash the semiconductor wafer. Another method is described as follows. Nozzles for jetting pure water are arranged in the outer plating bath so as to wash the object to be plated. After washing, a waste solution is made to flow into the inner bathing bath or the outer plating bath. These methods are disclosed in the official gazettes of Japanese Unexamined Patent Publication Nos. 11-92949 and 2001-316878.
However, according to the above method in which the plating solution is recovered into the recovery tank, the cost for recovery is increased. The reasons are described as follows. In order to easily remove the plating solution from the object, pure water is stored in the recovery tank so as to recover the plating solution. Therefore, in order to recycle the solution in the recovery tank as a plating solution, it is necessary to concentrate the solution to a predetermined concentration. Therefore, it is necessary to provide a device for concentrating the solution, and the manufacturing cost for concentration is required. Further, when the recovery tank is continuously used, the concentration of the solution in the recovery tank is increased, and the recovering capacity is lowered. Accordingly, it is necessary to periodically adjust the concentration of the solution in the recovery tank.


The present invention relates to lipopeptide-based compounds for use in the diagnosis, prevention and/or treatment of a liver disease or condition, preferably liver involved metabolic diseases, as well as in the control or modification of the cholesterol level or cholesterol uptake and, thus, diagnosis, prevention and/or treatment of a cardiovascular disease. The present invention furthermore relates to an in vitro or in vivo assay or method for testing or measuring the NTCP-mediated transport of test compound(s). The present invention furthermore relates to a method for the diagnosis, prevention and/or treatment of a liver disease or condition, comprising administering a therapeutically effective amount of a lipopeptide-based compound to a patient. The present invention furthermore relates to a method for the diagnosis, prevention and/or treatment of a cardiovascular disease.

The human hepatitis B virus (HBV) is a member of the hepadnaviridae. Hepadnaviruses are the smallest enveloped DNA viruses which replicate via reverse transcription of a pgRNA intermediate. During assembly the nucleocapsid acquires three viral envelope proteins termed large (L), middle (M) and small (S). They are encoded in one open reading frame and share the S-domain which is required for membrane anchoring. In addition to the S-domain, M contains an N-terminal hydrophilic extension of 55 amino acids (preS2), while L is further extended by 107, 117 or 118 amino acids (genotype-dependent) termed preS1 (Urban 2008). The hepatitis D virus (HDV) is a satellite virusoid utilizing the HBV envelope proteins for entry into hepatocytes. The myristoylated preS1-domain of L is known to play the key role in HBV and HDV infectivity.
The inventors have previously identified HBV L-protein derived lipopeptides that block HBV and HDV infection of PHH and HepaRG cells (Gripon et al., 2005, Schulze et al., 2010, WO 2009/092611 A1). They represent the N-terminal 47 amino acids of the preS1-domain of HBV (HBVpreS/2-48myr) and include the naturally occurring modification with myristic acid.
In WO 2009/092612 and WO 2012/107579, whose contents are incorporated herewith by reference in its entirety, the inventors describe hydrophobic modified preS-derived peptides of HBV and their use as vehicles for the specific delivery of compounds to the liver.
The inventors have furthermore previously identified the receptor responsible for the binding of these HBV L-protein derived lipopeptides, namely sodium taurocholate co-transporting polypeptide (NTCP/SLC10A1). (U.S. Provisional application 61/725,144, filed Nov. 12, 2012). NTCP is an integral transmembrane protein, not expressed in HepG2, HuH7, induced in HepaRG cells after DMSO treatment (Kotani et al., 2012) and down-modulated in primary hepatocytes during de-differentiation (Doring et al., 2012).
In particular, the inventors have identified a novel HBV preS1-specific receptor playing a key role in Hepatitis B virus (HBV) and/or Hepatitis D virus (HDV) infection, the human sodium taurocholate cotransporter polypeptide NTCP/SLC10A1. Expression of this receptor or of certain non-human counterparts allows to transform cells that were previously unable to bind HBV and/or HDV and/or non-susceptible to HBV and/or HDV infection into cells that are HBV and/or HDV binding-competent and/or susceptible to HBV and/or HDV infection. Cells that are already susceptible to HBV and/or HDV infection (HepaRG cells) show a significantly increased susceptibility upon expression of NTCP.
Also Yan et al. (2012) identified NTCP/SLC10A1 as a preS-specific receptor in primary Tupaia hepatocytes (PTH) and demonstrate that human (h) NTCP promotes HBV/HDV entry into hepatoma cells.
The liver plays a predominant role in drug biotransformation and disposition from the body. In view of its barrier function between the gastrointestinal tract and systemic blood, it is constantly exposed to ingested xenobiotics entering the portal circulation. Drug-induced liver injury accounts for up to 7% of all reports of adverse drug effects voluntarily reported to pharmacovigilance registries. Drugs cause direct damage to hepatocytes, bile ducts or vascular structures or may interfere with bile flow. The phenotypes commonly encountered thus include hepatitis, cholestasis, steatosis, cirrhosis, vascular and neoplastic lesions and even fulminant hepatic failure. Almost every drug has the potential to cause hepatic injury, be it through direct toxicity of the agent or through an idiosyncratic response of the individual. The susceptibility of the liver to injury by drugs is influenced by various factors such as age, sex, pregnancy, comedication, renal function and genetic factors (Kullak-Ublick, 2000).
Drug induced cholestatic liver disease is a subtype of liver injury that is characterized by predominant elevations of alkaline phosphatase and bilirubin secondary to the administration of a hepatotoxic agent. It can manifest itself as a cholestatic hepatitis or as bland cholestasis, depending upon the causative agent and the mechanism of injury. Drugs that typically cause cholestasis with hepatitis include psychotropic agents, antibiotics and nonsteroidal antiinflammatory drugs (NSAIDs). The mechanism is immunoallergic and results from hypersensitivity. Pure cholestasis without hepatitis is observed most frequently with contraceptive and 17α-alkylated androgenic steroids and the mechanism most likely involves interference with hepatocyte canalicular efflux systems for bile salts, organic anions and phospholipids. The rate-limiting step in bile formation is considered to be the bile salt export pump (BSEP) mediated translocation of bile salts across the canalicular hepatocyte membrane. Inhibition of BSEP function by metabolites of cyclosporine A, troglitazone, bosentan, rifampicin and sex steroids is an important cause of drug induced cholestasis (Kullak-Ublick, 2000).
There is a need in the art for improved means and methods for treating liver involved metabolic diseases, drug induced toxicity and cholestatic liver diseases, as well as cardiovascular diseases.

Lipopeptides for use in treating liver diseases and cardiovascular diseases


An apparatus and method for expediting the processing of requests in a multiprocessor shared memory system. In a multiprocessor shared memory system, requests can be processed in any order provided two rules are followed. First, no request that grants access rights to a processor can be processed before an older request that revokes access rights from the processor. Second, all requests that reference the same cache line are processed in the order in which they arrive. In this manner, requests can be processed out-of-order to allow cache-to-cache transfers to be accelerated. In particular, foreign requests that require a processor to provide data can be processed by that processor before older local requests that are awaiting data. In addition, newer local requests can be processed before older local requests. As a result, the apparatus and method described herein may advantageously increase performance in multiprocessor shared memory systems by reducing latencies associated with a cache consistency protocol.

1. Field of the Invention
This invention relates generally to the field of computer systems and, more particularly, to accelerating cache-to-cache transfers in computer systems with multiple processors.
2. Description of the Related Art
Data processing systems often include multiple processors that share a common system memory. As used herein, the term processor can be used to refer to an active device that uses a system memory. Processors can include microprocessors, input-output bridges, graphics devices, peripheral devices, or other devices that read or write to a system memory. Processors in data processing systems often include a cache to improve performance. Caches in a multiple processor system can include cache tags for each cache line. The cache tags can specify the access rights and ownership responsibilities for a corresponding processor.
Caches in a multiprocessor shared memory system need to be maintained in a consistent and coherent manner. A set of cache protocol rules can be employed to ensure that data stored in a system memory appears the same to all processors despite being stored in various caches. One approach to cache consistency is the use of a standard snooping protocol. In a standard snooping protocol, each processor broadcasts all of its requests for cache lines to all of the other processors on an address bus. Each processor, in turn, xe2x80x9csnoopsxe2x80x9d the requests from other processors and responds, as needed, by updating its cache tags and/or conveying the data corresponding to the cache line to the other processor. In a standard snooping protocol, requests arrive at all processors in the same order, and each processor processes the requests in the order that they arrive. A processor can be said to xe2x80x98processxe2x80x99 a request when the request affects the internal state of the processor. In a standard snooping protocol, requests include local requests and foreign requests. Local requests include requests generated by the processor itself while foreign requests include requests from other processors. Requests can also be referred to as address packets since requests typically specify a cache line by its address. Address packets can also be referred to as address broadcasts. The terms request, address packet, and address broadcast will be used interchangeably herein.
The requirement that requests be processed in the order in which they arrive can be considered a performance drawback of a standard snooping protocol. In particular, this requirement can delay the transfer of data from one cache to another cache. The requirement can also delay the processing of data received by a processor if the data corresponds to a local request and it arrives before data that correspond to an earlier local request. In processing a local request, a processor waits for the data corresponding to the local request to arrive before processing other requests. Potentially, multiple processors can be waiting for a single processor to receive its data. This situation can create an undesirable latency in the system. If a processor is allowed to process other requests prior to the data corresponding to a local request arriving, however, starvation can result if a subsequent request revokes the processor""s access rights to the cache line of the local request before the processor receives the data. A system for reducing the latency of a standard cache consistency protocol is needed without introducing starvation problems into the system.
The problems outlined above are in large part solved by the use the apparatus and method described herein. Generally speaking, an apparatus and method for expediting the processing of requests in a multiprocessor shared memory system is provided. In a multiprocessor shared memory system, requests can be processed in any order provided two rules are followed. First, no request that grants access rights to a processor can be processed before an older request that revokes access rights from the processor. Second, all requests that reference the same cache line are processed in the order in which they arrive. In this manner, requests can be processed out-of-order to allow cache-to-cache transfers to be accelerated. In particular, foreign requests that require a processor to provide data can be processed by that processor before older local requests that are awaiting data. In addition, newer local requests can be processed before older local requests. As a result, the apparatus and method described herein may advantageously increase performance in multiprocessor shared memory systems by reducing latencies associated with a cache consistency protocol.
In one embodiment, a processor can include a first queue and a second queue to implement the above rules. The first and second queue can be operated in a first-in-first-out (FIFO) manner. The processor can store address packets that grant access rights to the processor in the first queue. The processor can also store in the first queue address packets that reference the same cache line as an address packet in the first queue. The processor can store all other address packets in the second queue. Address packets that require data can remain at the head of a queue until the data arrives. The processor can be configured to process address packets from the head of either queue in any order. In this manner, foreign packets that require data can be handled before older local packets that are awaiting data.

Mechanism for reordering transactions in computer systems with snoop-based cache consistency protocols