Provided is a manufacturing method of self-sustaining center-anchor microelectromechanical switch driven by an electrostatic force used for controlling a signal transmission in an electronic system, which can suppress deformation of a movement plane generated during manufacturing and operation process by inserting the self-sustaining center-anchor, and improve a ground line contact phenomenon of an upper electrode, thereby enhancing reliability and signal isolation feature while maintaining an existing insertion loss feature compared to the microelectromechanical switch of the prior art.

1. Field of the Invention
The present invention relates to a self-sustaining center-anchor microelectromechanical switch and a method of manufacturing the same and, more particularly, to a self-sustaining center-anchor microelectromechanical switch that driven by an electrostatic force used for controlling a RF signal in an electronic system for high frequency.
2. Discussion of Related Art
In order to control a signal in an electronic system with a high frequency bandwidth, an easily integratable semiconductor switch, such as a field effect transistor (FET) or a p-I-n diode, has been used, but since each semiconductor has problems, such as a high insertion loss, a low isolation loss, and a signal distortion, a research on the microelectromechanical switch has widely been progressed.
Generally, the microelectromechanical switch comprises a movement element that moves relative to a substrate, and a driving element that drives the movement element. The driving element has two electrodes that are located facing each other, and the movement element is configured to move in a horizontal direction or in a vertical direction to the substrate, or to rotate within a predetermined range of angle with respect to the substrate, and thus the movement element is driven according to the electrostatic force generated by the voltage applied to the driving element to perform a switching operation.
FIG. 1A is a plan view for illustrating an example of a cantilever type microelectromechanical switch of the prior art, and FIG. 1B is a cross-sectional view taken along line A1-A2 in the microelectromechanical switch of FIG. 1A. The cantilever type microelectromechanical switch of the prior art is disclosed in U.S. Pat. No. 5,578,976.
A lower electrode 2 and a signal line 3 are formed on a substrate 1, and a cantilever arm 5 supported by a anchor unit 4 fixed to the substrate is located over the lower electrode 2 and the signal line 3. An upper electrode 6 is formed on the cantilever arm 5, and at the lower of the end portion of the cantilever arm 5, a contact unit 7 is formed for connecting a disconnected portion of the signal line. In the cantilever arm 5 and the upper electrode 6, an intermediate portion is formed narrower than other portions, so that the end portion of the cantilever arm 5 has a constant elasticity.
When a predetermined driving voltage is applied to the upper electrode 6 and the lower electrode 2, the cantilever arm 5 is bended downward due to the electrostatic force generated in the portion of a capacitor structure 8 where the upper electrode 6 and the lower electrode 2 are overlapped with each other, and accordingly, the contact unit 7 connects the disconnected portion of the signal line 3 to perform a switching operation.
FIGS. 2A and 2B are cross-sectional views illustrating an operational state of a cantilever type microelectromechanical switch of the prior art.
The microelectromechanical switch shown in FIG. 1A operates in a single pole double throw (SPDT) scheme. In this microelectromechanical switch, since the signal line 3 and the contact unit 7, respectively connected to an input portion and an output portion, are placed perpendicular to each other and the cantilever arm 5 is supported at one side portion only, when the cantilever arm 5 or the upper electrode 6 is deformed due to thermal expansion during the manufacturing or operation process, the contact between the signal line 3 and the contact unit 7 becomes unstable since the switch cannot move in a vertical direction as shown in FIG. 2A, instead it moves in a bended state as shown in FIG. 2B. This contact degradation increases a contact resistance of the signal line 3 and causes a signal delivery to be unstable, thus reducing the reliability.
FIG. 3 is a perspective view for illustrating an example of a membrane type microelectromechanical switch of the prior art. This membrane type microelectromechanical switch according to the prior art is disclosed in Korean Patent Publication No. 10-0339394.
Two ground planes 41 are formed on a substrate 40 with a predetermined distance apart from each other, two lower electrodes 42 used for a signal line are formed between the ground planes 41. Hinges 44, 45 supported to have a constant elasticity by an anchor 43 are connected to each ground plane 41, and over the lower electrode 42, an upper electrode 46 is located. The upper electrode 46 is connected to be movable upward and downward by the hinge 44 and 45.
When driving voltages are applied to the lower electrode 42 and the ground plane 41, respectively, the upper electrode 46 moves downward by the electrostatic force generated between the lower electrode 42 and the upper electrode 46, and accordingly, lower electrode 42 is connected with each other through the upper electrode 46, to perform a switching operation.
In the membrane type microelectromechanical switch of FIG. 3, the upper electrode 46 serving as a movement plane moves downward by the electrostatic force with the ground plane 41 to connect the lower electrode 42 used for the signal line. Therefore, when the surface of the upper electrode 46 made of a metal during manufacturing process or operation process is deformed by thermal expansion, a problem occurs that the movement plane does not completely contact with the signal line so as to permanently remain open, and stiction occurs between the upper electrode 46 and the lower electrode 42 sustained in a narrow gap, thus reducing the stability and reliability of the switch.
A drawback of this membrane type microelectromechanical switch is the deformation of a membrane and the stiction problem. If the movement plane and the hinges are deformed by the thermal expansion, they cannot move in parallel with the substrate when the movement plane moves by the electrostatic force. This is caused by the fact that since the anchor is fixed to the substrate whose thermal expansion ratio is extremely smaller than the movement plane and the hinge, the movement plane and the hinge are greatly thermal-expanded, while the distance between anchors is not changed. Stress is generated by the thermal expansion in a connection portion between the movement plane and the hinge, in which a permanent deformation is taken place. Consequently, owing to the deformation of the movement plate, problems occur that a normal switching operation cannot be performed when the movement plane becomes abnormally apart from the substrate or is tilted toward one side, and when the movement plane is collapsed near the substrate, that the contact portion of the movement plane permanently contacts with the signal line.
Further, the gap between both electrodes for generating the electrostatic force maintains as close as several micrometers, so that the stiction problem that the driving element adheres to other fixing elements is easy to generate, which acts as significant drawbacks in the operation and reliability of the switch.
As illustrated above, since the conventional microelectromechanical switch is configured in the cantilever type or the membrane type, it has structural problems, such as the thermal deformation and stiction. Such problems have a significant influence on the reliability and the signal isolation feature of the microelectromechanical switch used for improving high insertion loss, low signal isolation, signal distortion, etc.

Method of manufacturing a self-sustaining center-anchor microelectromechanical switch

Electronics and Telecommunications Research Institute


Disclosed is a method and system for compensating for printer cross-process nonuniformity. The method and system provide a means to offset a cross-process uniformity profile associated with an image output device, such as a printer, where process direction noise is measured and the cross-process uniformity profile is adjusted accordingly to provide a better representation of the image output device cross-process uniformity profile.

Defects in the subsystems of a xerographic, electrophotographic or similar image forming system, such as a laser printer, digital copier or the like, may give rise to visible streaks in a printed image. Streaks are primarily one-dimensional defects in an image that run parallel to the process direction. Typical defects might arise from a non-uniform LED imager, contamination of the high voltage elements in a charger, scratches in the photoreceptor surface, etc. In a uniform patch of gray, streaks and bands may appear as a variation in the gray level. In general, "gray" refers to the intensity value of any single color separation layer, whether the toner is black, cyan, magenta, yellow or some other color.
One method of reducing such streaks is to design and manufacture the critical parameters of the marking engine subsystems to tight specifications. Often though, such precision manufacturing will prove to be cost prohibitive.
One technique to eliminate these streaks is to measure the cross process uniformity of a series of strips of different gray levels. Each strip is first averaged in the process direction to produce a profile for that gray level. A printer model is then constructed from the profiles, which is used to calculate a set of spatial tone reproduction curves (s-TRC's). The s-TRCs are a set of TRCs that capture variation in the cross-process direction and are used to compensate the streaking. If the printer has process direction banding, if the strip density depends on the photoreceptor position, or if the illumination of the sensor changes with time, then the mean strip profile will vary between strips. These errors are called process direction noise. This noise will lead to an imperfect measurement of the engine response curve (ERC), thus an error in the printer model and an imperfect compensation.
A tone reproduction curve (TRC) may be measured by printing patches of different bitmap area coverage. In some digital image processing applications, the reflectivity of a patch of gray is measured with a toner area coverage sensor. The manner of operation of the toner area coverage sensor is described in U.S. Pat. No. 4,553,033, which is incorporated herein by reference in its entirety. Toner area coverage sensors are typically designed with an illumination beam much larger than the halftone screen dimension. In addition, the toner area coverage sensors are typically designed to measure a fixed position and do not have the capability to move in the cross process direction. This large beam does not provide the resolution for the toner area coverage sensor to be useful as a sensor for the narrow streaks that may occur for poorly performing subsystems.
U.S. Pat. No. 6,760,056 by Klassen et al., incorporated herein by reference in its entirety, discloses one exemplary embodiment of a method for compensating for streaks by introducing a separate tone reproduction curve for each pixel column in the cross process direction. A compensation pattern is printed and then scanned to first measure the engine response curve at each spatial position and then detect and measure streaks. The tone reproduction curves for the pixel columns associated with the streak are then modified to compensate for the streak.

Measurement of engine response curve in the presence of process direction noise


A dental appliance is provided. The dental appliance includes a dental form configured to receive a portion of a dental arch of an individual, and an adhesive strip comprising a first side and a second side. The first side of the adhesive strip is attached to a portion of the dental form. The second side of the adhesive strip comprises a mucoadhesive configured to adhere the adhesive strip to a tongue of the individual such that the tongue of the individual can be selectively attached to the dental appliance.

Obstructive sleep apnea is a serious and potentially lethal disorder characterized by abnormal pauses in breathing or instances of abnormally low breathing. Each pause in breathing, called an apnea, can last from a few seconds to several minutes, and may occur 5 to 30 times or more per hour. Individuals with sleep apnea can experience daytime fatigue, impaired reaction time and vision problems. Other effects include difficulty with information processing, judgment, and short term memory, all of which can severely interrupt daytime cognition. Behavioral effects, such as decreased motivation, moodiness, and aggressiveness may also accompany sleep apnea. The behavioral and cognitive effects of sleep apnea can be dangerous in many occupations especially manual labor and machine operating.
Snoring is the vibration of respiratory structures and the resulting sound, due to obstructed air movement during breathing while sleeping. In some cases the sound may be soft, but in other cases, it can be loud and unpleasant. Snoring, like sleep apnea, can cause sleep deprivation to snorers and those around them, as well as daytime drowsiness, irritability, and lack of focus.
Some studies reveal that habitual snoring and sleep apnea are associated with other potentially serious medical conditions, such as hypertension, ischemic heart disease, and strokes. Accordingly, early diagnosis and treatment is recommended.
Snoring and obstructive sleep apnea are typically caused by partial or complete obstruction of an individual's pharyngeal airway. Airway obstruction often results from the apposition of the rear portion of the tongue with the posterior pharyngeal wall.
One approach for the treatment of sleep apnea and snoring is the performance of a surgery called uvulopalatopharyngoplasty, which is a procedure used to remove tissue in the throat. For example, a portion of the soft palate may be removed to prevent closure of the pharyngeal airway during sleep. However, the operation is not always successful and can result in complications.
Many non-surgical approaches for the treatment of sleep apnea and snoring have been developed, some of which involve the use of intraoral dental appliances. For example, it is recognized that movement of the lower jaw forward relative to the upper jaw can help to reduce sleep apnea and snoring by causing the pharyngeal airway to remain open. Dental appliances have been developed which can be worn at night to maintain the upper and lower jaws in desired locations. Such appliances generally include orthodontic retainers or mouthguards that are custom-fit to an individual's upper (superior) and lower (inferior) dental arches.
While such dental appliances have proven effective in maintaining the lower jaw in a protruded position relative to the lower jaw, this position often results in serious discomfort in many individuals. The appliances are often bulky, invasive and constructing, and can cause pain in the jaw muscles. Use of such appliances can cause temporomandibular joint disorder (TMJ), an acute or chronic inflammation of the temporomandibular joint, which connects the mandible to the skull.
Therefore, there is a need for an improved dental appliance for treating sleep apnea and snoring.


Disclosed is a battery with a light weight and a high energy density. The battery includes a anode 5, having a layer of an anode active material 9 formed on an anode substrate 8, a cathode 6, including a layer of a cathode active material 14 formed on a cathode substrate 13, and a non-aqueous liquid electrolyte 4. The anode substrate 8 includes an anode resin film 11 containing a polymer and an anode metal layer 12 containing an electrically conductive metal. Since the anode resin film 11 reduces the weight of the anode substrate 8 and the anode metal layer 12 imparts electron conductivity to the anode substrate 8, the battery may be reduced in weight without detracting from battery characteristics to increase the energy density.

1. Field of the Invention
This invention relates to a battery having an anode, a cathode and an electrolyte and which is appreciably improved in energy density.
This application claims the priority of the Japanese Patent Application No. 2002-265951 filed on Sep. 11, 2002, the entirety of which is incorporated by reference herein.
2. Description of Related Art
Recently, development in a lightweight secondary battery with a high energy density, as a power supply for electronic equipment such as a notebook personal computer, a portable telephone set and a VTR (video tape recorder) with a built-in camera, is progressing. Among the secondary batteries having the high energy density, there is a lithium secondary battery having an energy density larger than that of the aqueous electrolyte battery, exemplified by a lead battery, a nickel-cadmium battery or a nickel-hydrogen battery.
With the lithium secondary batteries, such inconveniences may arise that lithium tends to be precipitated on the anode during charging, while lithium precipitated by repetition of charging/discharging tends to grow in size in the form of dendrites, with the precipitated lithium being inactivated to lower the battery capacity.
Such a lithium ion secondary battery in which a carbonaceous material is used as an anode, is known as a secondary battery designed to overcome the problem. Specifically, the lithium ion secondary battery uses an anode obtained on compacting the carbonaceous material in a finely divided state along with a binder.
This lithium ion secondary battery exploits, as a battery reaction, such a reaction consisting in intercalating lithium between layers of a carbonaceous material used for an anode, such as graphite. For this reason, with the lithium ion secondary battery, a carbonaceous material, capable of doping/undoping lithium, is used as the anode active material. This prohibits lithium from becoming precipitated to the anode of the lithium ion secondary battery at the time of charging to achieve superior battery characteristics. With this lithium ion secondary battery, the carbonaceous material used for the anode is also stable in air, thus improving the yield in manufacturing the batteries.
With the above lithium ion secondary battery, in which the energy density can be larger than in the aqueous liquid electrolyte battery, it is requested to increase the energy density further in keeping up with the increasing power consumption in the electronic equipment of these days. In particular, with the lithium ion secondary battery, used in portable electronic equipment, it is requested to reduce the weight of the battery further and to increase its energy density, such that the weight reduction is a task of utmost importance.


A surge suppressor disconnect protection circuit is coupled to a first surge suppressor. The first surge suppressor is electrically coupled to phase and neutral line terminals of an AC source to protect the first surge suppressor from predetermined overvoltages. The circuit includes a relay switch with a relay contact and a relay drive coil. The relay contact is setable to one of a high and a low impedance state. The relay contact is electrically connected to the first surge suppressor and to one of the line terminals. A signal adjuster is electrically connected at its phase port to the AC phase terminal and to the AC neutral terminal for rectifying AC to generate a DC signal. The adjuster filters the DC signal and scales the filtered DC signal. An amplifier is electrically coupled to the adjuster at a non-inverting input port and to a first voltage reference at an inverting input port. The amplifier output port is electrically coupled back to the inverting input port to provide a feedback path therebetween. An integrator displaying a predefined integrator time constant is electrically connected at its input port to the amplifier means such that a signal is generated at the integrator output port which is proportional to a length of time the scaled DC signal is greater than said first voltage reference. A non-inverting input of a comparator is electrically connected to the integrator output port, and an inverting port of the comparator is electrically connected to a second voltage reference. The comparator output is electrically coupled to the first end of the relay coil such that a current is provided to the relay coil which drives the contact to a high impedance state when the integrator output signal exceeds the second voltage reference.

Most semiconductor devices are intolerant of excessive voltage; destructive breakdown or damage can occur in semiconductor devices when subjected to transient overvoltages that persist for only a few microseconds. Transient Voltage Surge Suppression (TVSS) devices, referred to interchangeably herein as surge suppressors and voltage-clamping devices, are commonly known for use in suppressing such overvoltage transients to protect voltage-surge intolerant circuitry. TVSS devices commonly include nonlinear, voltage-dependent resistive elements which display electrical behavior similar to that displayed by a pair of series-connected, back-to-back zener diodes. At normal voltages, below the TVSS clamping voltage level, TVSS devices display a high resistance with a small leakage current. When subjected to large transient voltages (above the TVSS device's clamping voltage), the TVSS device is forced by its characteristics to operate in a low resistance region which increases current flow through the device. The increased current produces an increased voltage drop across the source impedance, effectively clamping the transient voltage to a level determined acceptable (i.e., safe) for the protected circuit. The potentially destructive surge energy is thereby dissipated or passed through the voltage-clamping (TVSS) device and its operating current returns to its normal range after the surge.
Avalanche diode suppressors, metal oxide varistors (MOVs) and selenium surge suppressors may be utilized as TVSS devices with varying advantages and disadvantages, such as an MOV-based TVSS's inherently susceptibility to failure under certain conditions. More specifically, MOV components have a tendency to explode when overheated, often with sufficient explosive power to fracture plastic housings and sheet metal enclosures within which they reside. The explosion usually completely destroys everything within the TVSS housing and may possibly shoot hot black powder through any small openings in the housing. Various techniques have developed to protect MOVs from the causative factors leading to such explosive conditions.
One technique for protecting metal oxide varistors (MOVs) requires adding a current fuse in series with the MOV, which trips to an open state to protect the MOV when particular transient overvoltages are detected. Transients with I.sup.2 t ratings that are greater than the fuse rating, but just below the MOV rating will blow the fuse, electrically removing the MOV from the overvoltage condition. Under circumstances where the fuse displays an I.sup.2 t rating such that commonly occurring transients are insufficient to blow the fuse, i.e., from a few to 10,000 amperes, but of insufficient magnitude to force the MOV to its low impedance state, the MOV is subjected to overheating, possibly leading to thermal runaway. Steady state, abnormal overvoltage conditions below those at which the fuse will blow may also generate sufficiently high currents through the MOV leading to dangerous overheating.
A second common technique for protecting MOVs from overheating due to abnormal steady state or transient overvoltage conditions utilizes a thermal cutoff device (TCO) provided electrically in series with the MOV. TCOs sense the surface temperature of the MOV and trip to a high impedance state (open circuit) at a particular maximum rated temperature, cutting off voltage to the MOV. Thermal cutoff devices, however, like current fuses are not without problems when used within MOV-protected circuits. In particular, it is extremely difficult, and sometimes impossible to achieve good thermal contact between a surface of the MOV and a thermal cutoff device. Consequently, the MOV may overheat to a point of thermal runaway before the critical temperature is detected and the overvoltage is cut-off from the MOV by the TCO. Further, mismatch problems may also occur between the time constant of the thermal cutoff (i.e., time to blow) and heating/time characteristics of the MOV even when good temperature detection is possible, rendering accurate MOV protection unreliable. And in addition, both current fuses and temperature cut offs are permanently opened so that although explosions may be prevented, the transient voltage surge suppressor function is permanently lost.
It would therefore be desirable to have available an MOV overvoltage protection circuit which is effective in reliably cutting off voltage to the MOV to prevent damaging overheating in the MOV, after which the MOV is connected back into the circuit. Preferably, the MOV protection circuit would effectively protect the MOV whether the overvoltage conditions are continuous or temporary (i.e., transients). It would also be desirable to have available an MOV overvoltage protection circuit which cuts off voltage across the MOV in accordance with a length of time for which the MOV is subjected to a specific overvoltage level, and the MOV's thermal time constant. After a time period defined according thereto is run, the protection circuit would disconnect the MOV from the AC source. The time of cutoff would theoretically be just prior to the point in time at which the MOV would have failed. When the temperature of the MOV is detected to be at a safe MOV operating level, the MOV would be coupled back into the circuit thereby minimizing a time in which the MOV is electrically removed from the circuit it was meant to protect.

Automatic surge suppressor disconnect protection system


A liquid crystal display includes a first substrate and a second substrate facing each other; a switching element disposed on the first substrate; a pixel electrode connected to the switching element and supplied with a data voltage; an opposing electrode disposed on the second substrate; and a liquid crystal layer disposed between the first substrate and the second substrate and including liquid crystal molecules. The pixel electrode includes a cutout and a liquid crystal direction controller that are alternately disposed. The cutout and the liquid crystal direction controller divide the pixel electrode into a plurality of sub-regions, and inclination directions of the liquid crystal molecules are different according to the plurality of sub-regions when the pixel electrode is supplied with the data voltage. The liquid crystal direction controller is concave downward or convex upward with respect to a surface of the first substrate.

1. Field of the Invention
Exemplary embodiments of the present invention relate to a liquid crystal display.
2. Discussion of the Background
Liquid crystal displays are widely used as a type of flat panel display. A liquid crystal display has two display panels on which field generating electrodes such as pixel electrodes and a common electrode are formed, and a liquid crystal layer is interposed between the display panels. In the liquid crystal display, voltages are applied to the field generating electrodes to generate an electric field through the liquid crystal layer. The alignment of liquid crystal molecules in the liquid crystal layer is determined by the electric field strength experienced by the liquid crystal molecules. As light passes through the liquid crystal layer, the polarization of the incident light is controlled via interactions with the liquid crystal molecules, thereby creating an image display.
Among the LCDs, a vertical alignment (VA) mode LCD, which aligns LC molecules with their long axes perpendicular to the panels in the absence of an electric field, is highlighted because of its high contrast ratio and wide reference viewing angle.
In the vertical alignment (VA) mode LCD, the wide reference viewing angle may be realized by forming a plurality of domains including liquid crystal of different alignment directions in one pixel.
As one example of forming the plurality of domains in one pixel, a method of forming cutouts establishes minute slits in the field generating electrodes. In this method, the plurality of domains may be formed by aligning the liquid crystal molecules vertically with respect to a fringe field generated between the edges of the cutout and the field generating electrodes facing the edges.
The information in this section is for understanding of the background of the invention, and, therefore, it may contain information that is not part of the prior art.

Liquid crystal display having pixel electrode with concave downward or convex upward portions


Tracking at the local point of sale terminal level, changes in data associated with each terminal, such as a changed printer or POS register supporting a particular POS terminal, the identified cash drawer for the terminal, the particular changeable removable cash till in the cash drawer or the particular terminal operator. The POS terminal comprises a cash drawer including a drawer identifier, a cash till, including a till identifier, removably engagable with the drawer, as well as apparatus for reading the drawer identifier, apparatus for reading the till identifier when said till is engaged with the drawer and apparatus for transmitting the read drawer and till identifiers to the system administrator.

Point of sale (POS) terminal systems are used in restaurants, hotels, stadiums, casinos, as well as in retail establishments. The conventional application of the POS system and network is at the check-out counter on an aisle where people place items that are to be purchased from a supermarket or department store. The cashier or terminal operator rings up each item on the terminal and obtains a total. The charges for items are read by appropriate readers from the barcodes on the items. From original cash register terminals, these POS terminals have evolved to permit multiple applications (giftcard, credit card, driver's license verification, age verification, check verification, etc.). Despite these advances, most current POS terminals continue to operate with a two state cash drawer: open/close, with the opening of the cash drawer breaking a switch to thereby transmit all accumulated data for the transaction to the POS system administrator where all transaction and ancillary data are stored in a POS system database.
System administration for POS terminals is set up at many levels in the networked system. For a retail store, the system administration may be on a first level at a POS system controller that correlates all of the data accessed from a row of checkout terminals and has the correlated data stored in associated databases. The POS store controller may be at a node in a hierarchy of store system controllers that are correlated by an appropriate hierarchical next level business administrator or correlator. The business levels in the POS business hierarchy may, of course, include regional, national and even global levels.

Point of sale terminal network implementation for transmitting data indicative of terminal changes upon switching of open close state of cash drawer

International Business Machines Corporation


A charge transferring apparatus comprising, e.g., a buried type charge coupled device in which a pair of transfer electrodes located at the most downstream point of a charge transfer direction is driven by a drive pulse other than that for any other pair of transfer electrodes and a potential well formed at the pair of the transfer electrodes located at the most downstream point is made shallower than that at any other pair of transfer electrodes allowing the output dynamic range of a charge transfer device to be increased for improving the output quality.

(1) Field of the Invention
The present invention relates to an apparatus for transferring electric charges and, more particularly, relates to an apparatus for transferring electric charges in which the transferring electrodes are constituted by a plurality of transferring electrodes which are adjoined together in a charge transfer direction and a plurality of pairs of the electrodes are arranged along the transfer direction.
(2) Background of the art
Solid-state image sensing devices including charge coupled devices (CCDs) have been used for photographic elements in video cameras, still cameras, and so forth.
A structure of output ports for horizontal (output) register portions in these image sensing devices has been proposed.
It is necessary to enhance transferring efficiency in a transferring apparatus such as the horizontal register since the output dynamic range of the output register must be widened to some degree. It is not easy to achieve both enhanced transferring efficiency and widened output dynamic range.
In other words, to provide a sharp (clearly focused, high resolution) video image with high transferring efficiency, it is necessary to deepen a whole potential of a charge transferring channel to raise a potential relative to a zero potential). However, to deepen the whole potential is to narrow the dynamic range of a floating diffusion region. The floating diffusion region denotes an n.sup.++ type semiconductor region disposed at a position corresponding to a lower side of the output port of the output register downstream of an output port electrode.
That is to say, since the dynamic range of the floating diffusion region is determined according to a difference between the potentials of the dynamic range of the floating diffusion region and that of the output gate electrode, the potential difference becomes correspondingly smaller if the potential at the output gate electrode side is deepened. Hence, it is difficult to enhance the transferring efficiency without narrowing the dynamic range.
If the potential of the floating diffusion region is deepened, the output dynamic range can be widened. However, it becomes necessary to make higher the power supply voltage applied to a precharge drain region. The precharge drain region denotes an n.sup.++ type semiconductor region formed on a surface portion of the n type semiconductor region at a position slightly downstream and spaced apart from the floating diffusion region. If the power supply voltage (Vdd) is increased, an amplifier (the amplifier which detects and amplifies the potential of the floating diffusion electrode) would largely consume the power and would make the drain voltage applied to an MOS (Metal Oxide Semiconductor) transistor constituting the amplifier higher, to a value equal to or nearly equal to the breakdown voltage that the MOS transistor inherently provides.

Apparatus for transferring electric charges


A data storage device that performs a process of writing to a memory a plurality of measured data sets received in time series includes: a nonvolatile memory divided in a plurality of blocks to which the measured data is written; and a write control section that performs a processing including successively writing N sets of the measured data to a given block in the nonvolatile memory, and then successively writing next N sets of the measured data to another block, wherein the write control section judges whether or not the N sets of measured data lastly written to the given block of the nonvolatile memory and another N sets of measured data obtained after the N sets of measured data lastly written to the given block contain data with a value outside a predetermined range, writes new measured data to the given block such that the N sets of measured data lastly written to the given block are not overwritten when the data with a value outside the predetermined range is included, and writes new measured data to the given block such that at least one of the N sets of measured data lastly written to the given block is overwritten when the data with a value outside the predetermined range is not included.

1. Technical Field
The invention relates to data storage devices.
2. Related Art
Data storage devices (data log devices) that continuously obtain and record data on temperatures, vibrations, brightness, sounds, images and the like are known, and such data storage devices are used in, for example, temperature management of foods, drive recorders, flight recorders, voice recorders, seismometers, and the like.
In these data storage devices, when values of measured data exceed a predetermined range, it can be judged that a certain event has occurred on the subject being measured. By conducting an analysis processing on data obtained after the aforementioned data, the situation of the subject after the occurrence of the event can be learned. Also, by conducting an analysis processing on data for a certain period of time preceding the event, the situation of the subject before the occurrence of the event can be learned. Japanese laid-open patent application JP-A-2005-259041 may be an example of related art.
When the time interval for measuring (storing) data is made shorter in the data storage device, changes in the data can be accurately recorded. However, when the time interval for measuring data is shorter, the number of data increases, and a memory with a greater storage capacity is required for recording the data.
In contrast, when the time interval for measuring data is made longer, the number of data sets is reduced, and a memory with a smaller storage capacity can be used. However, the longer the time interval for measuring data, the more difficult it becomes to record minute changes in the data.
Also, in order to know the situation about the occurrence of the event, changes in the data before and after the occurrence of the event may preferably be analyzed. However, it is necessary to record data constantly to secure storage of measured data before and after the occurrence of the event, which requires a memory with a large storage capacity.


Provided is a sensor with nanowires in an aligned array. In one example, the heaviest doped region is not in the nanowire array, but in the bulk silicon substrate and the sensor is functionalized to be have modified electrical properties when proteins are present.

Millions of people are diagnosed with cancer, or related illness, each year. Unfortunately for many of the diagnosed, the survival rates are not high. Accordingly, billions of dollars in resources and capital are being expended each year to care for and provide health care services to those diagnosed with cancer related illnesses. In particular, the Agency for Healthcare Research and Quality (AHRQ) estimated that the sum of all health care costs for cancer in the United States in 2011 was approximately $88.7 billion.
Often, targeted therapy can be useful in targeting particular types of cancer. Targeted therapy typically includes application of specialized drugs to fight the responsive type of cancer. Targeted therapies are typically useful when a corresponding mutation is identified, and tend to provide better efficacy with less side effects when compared to generic cancer treatments.
Early detection can also lower the cost of treatment, and can increase the survival chances of a diagnosed patient. According to some estimates, treating a patient for cancer can average around a million dollars per patient. Various costs can be distributed among costs associated with hospital outpatient or doctor office visits, inpatient hospital stays, and prescription drugs, with the majority of expenses being associated with the outpatient or doctor office visits.
While various early detection methods do exist, existing approaches have inconsistent levels of accuracy and efficacy. In particular, conventional cancer detection approaches are generally not suitable for early detection. Currently, cancer is first detected by physical examination in combination with imaging studies, such as CT scans or MRIs. Routine blood tests may also reflect organ dysfunction, or other symptoms which are caused by cancer. However, such approaches generally are most effective after the cancer has significantly damaged the patient, at which point it may be too late for treatment. Moreover, existing approaches are unable to detect all types of cancer cells.
Accordingly, a low-cost early detection method for cancer is not only critical to relieve the economic burdens on the healthcare system, but to also save lives.
Nanowire arrays are seeing increasing use in a variety of applications. See, e.g., U.S. Published Patent Application No. 2009/256134 titled "PROCESS FOR FABRICATING NANOWIRE ARRAYS" offers one such example of a nanowire array, and is incorporated by reference herein in its entirety. A typical nanowire array might consist of a collection of silicon nanowires, on the order of 100-200 nm in diameter, and on the order of about a hundred nm to hundreds mm in height. Each nanowire may have an approximately cylindrical or frustoconical shape. In contrast to typical nanowire arrays which arrange each individual nanowire in a horizontal orientation relative to associated base surface, various examples of the nanowires discussed herein have an axis which may run approximately parallel to each other and in a vertical direction relative to the base surface (e.g., the substrate to which the nanowires are mounted). Accordingly, each nanowire may be attached at an end to the silicon substrate.
A silicon nanowire array on top of a silicon substrate can alter the opto-electrical properties of the bulk silicon substrate. For example, a silicon nanowire array may reduce the reflection of the silicon substrate, reduce the reflection at off-angles of incidence, and increase the absorption of the silicon in ways similar to traditional pyramids or light trapping mechanisms used in solar cells.
Nanowires can also be used to make biosensors. A nanowire can have a high surface area to volume ratio, and therefore has the characteristics to make a very sensitive detector. Each individual nanowire of the nanowire array may be defined by a longitudinal surface and a vertical surface. In certain examples, the longitudinal surface of each nanowire is at least two times longer than the vertical surface. Accordingly, the vertical arrangement of the nanowire allows the nanowire to have a significantly increased density of individual nanowires (e.g., at least 1000 nanowires per cm2) when compared to typical horizontal arrangements. Such an arrangement significantly improves the sensitivity of the biosensor.
Provisional US patent application US20170052182A1 teaches using vertically aligned silicon nanowire arrays for the detection of protein and DNA concentrations. This patent application differs from previous approaches to nanowire biomarker detection which only measure electrical measurements, such as conductance probing. For example, in one such approach distinct nanowires and surface receptors are incorporated into horizontal nanowire field-effect-transistor arrays. One challenge is that electrical detection for horizontal wires requires that each of the nanowires is electrically contacted on both sides. This requirement makes using many nanowires challenging at least because of the complex device fabrication steps to contact the wires. The vertically aligned nanowires taught in US20170052182A1 solves this contacting challenge. See FIG. 1 A) for horizontally aligned nanowires which need an electrical contact at both ends of the nanowires and FIG. 1 B) for vertically aligned nanowires. Thus, vertically aligned nanowires are much easier to scale and manufacture since the manufacturer is not required to electrically contact each individual nanowire. Instead, one can look at the effect of the change in the electrical properties of the nanowires when exposed to biomarkers on the underlying test chip, thus allowing many more nanowires to be measured.
A common method for making silicon nanowires is metal-enhanced etching of a silicon-containing substrate. See FIG. 2 for a cross sectional scanning electronic microscope image of nanowires arrays made with metal-enhanced etching. This process can be used to control the nanowire dimensions and is described in U.S. Pat. No. 8,143,143, titled "PROCESS FOR FABRICATING NANOWIRE ARRAYS", and U.S. Pat. No. 8,450,599, titled "NANOSTRUCTURED DEVICES", which are both incorporated by reference in their entirety. In metal-enhanced etching, a metal is deposited on top of a silicon substrate and placed in a solution in which the etch is enhanced wherever the silicon touches metal. Since the metal coverage is not uniform, parts of the silicon are not etched leaving a graded index silicon, cliffs, or nanowires. The metal used can be, for example, gold, platinum, or silver.
Other typical techniques for forming silicon nanowires may include reactive ion etching and VLS (Vapor-Liquid-Solid). During VLS processes, nanowires are grown on a substrate using a metal catalyst and silane.


An IDC terminal structure includes a plurality of terminal pairs and a terminal seat. Each of the terminal pairs has a first terminal and a second terminal. The terminal seat has a plurality of first and second insert slots. The first and second slots are equally spaced from one another in a staggered manner corresponding to the first and second terminal. At least two of the first terminal has a main extension on a middle portion extended towards the second terminal of the same pair and the first terminal of a neighboring pair. So that the first terminal is close to the second terminal of the same pair and the first terminal of the neighboring pair to generate an induction compensation effect. The first terminals of the neighboring pairs are also close to each other to generate an induction compensation effect.

1. Field of Invention
The invention relates to an Insulation Displacement Connection (IDC) terminal, and particularly to an IDC terminal that conforms to EIA/TIA Category 6 standards for transmitting high speed electronic signals and has simple structure.
2. Related Art
In recent years network communication systems have become very popular to transmit data, and widely adopted. As the demand grows for high transmission efficiency with network communication systems, not only higher quality connection lines are required, but also higher quality connectors are required with transmission speed increased. In general, a network communication path consists of a transmission medium and transmission connectors. The transmission medium may be a Twisted Pair, Coaxial Cable, Optical Fiber, etc. The network communication path mentioned above still has drawbacks. Signal quality often deteriorates as the frequency of the network communication system increases. For instance:
1. Near-End Cross Talk (NEXT) phenomenon: When two cables are close to each other and generate induction, interference occurs due to electromagnetism, and Cross Talk phenomenon takes place.
2. Impedance phenomenon: The impedance of the transmission medium has to match the system to transmit signals effectively.
3. Return Loss phenomenon: As the impedance of the transmission system is not continuous, reflections occur and power loss results.
4. Attenuation phenomenon: When the signals are transmitted via the transmission medium, signal intensity and power decay with signal traveling distance.
The standards announced by the Electronic Industries Association (EIA) and TIA are adopted by IEEE. EIA/TIA 568 standards have been included in 802.3u standards. Hence the parameters of transmission media and connectors require confirming these standards, and those conforming to the standards are categorized. At present, Category 6 standards have gradually become the basic requirements. Thus it is necessary to overcome the problems previously discussed.
The conventional IDC terminal assemblies, as shown in FIG. 1, includes IDC terminals 11 arranged in parallel to the longitudinal axis of a terminal seat 12. The IDC terminals 11 are equally spaced with one another. Each pair of IDC terminals 11 is interfered with by the neighboring IDC terminals 11. As a result, transmission quality is not desirable. To remedy this problem, many schemes have been proposed. For instance, Siemon Co. proposes to use a metal shield, as shown in FIG. 2A. It has four pairs of IDC terminals 11 that are spaced from one another at a greater interval, and each pair of IDC terminals 11 has a shielding blade 13. The shielding blade 13 of any two pairs of neighboring IDC terminals 11 reduces interference. However, the size of the IDC terminal assembly increases significantly. Material and production costs also are higher. Panduit Co. proposes a technique with IDC terminals of the same pair arranged staggered on two rows in a front side and rear side fashion. Hence any three neighboring IDC terminals 11 are spaced from one another at about the intervals. Such a design allows any two pairs of neighboring IDC terminals 11 to have TT compensation effect, as shown in FIG. 2B. However, the thickness T of the IDC terminal assembly increases, and the communication core lines cannot be installed by a general wiring machine. U.S. Pat. No. 6,648,670 discloses a design with IDC terminals spaced from one another at an unequal interval. The interval of one pair of terminals is smaller than the interval of the neighboring IDC terminals of different pair. A diagonal assembly and an extending blade are adopted to enhance the compensation effect between different pairs of terminals of the same line position attribute. Its diagonal assembly design can reduce the thickness of the total IDC terminal structure. However, the wiring machine has to be altered to wire the communication core to adopt the design of the diagonal assembly and unequal intervals. Moreover, the corresponding connectors also have to be changed. The connectors adopted in the conventional IDC terminal assembly cannot be used.


De-trenching apparatus (100) for extracting a buried line, such as a cable or pipeline, is disclosed. The de-trenching apparatus comprises a channel (112) configured to receive a buried line to be extracted, the channel comprising a first flared opening (114) at a front end of the de-trenching apparatus and a second flared opening (115) at the rear end of the de-trenching apparatus, the first and second flared openings each having a curved surface (111) configured to support the line during extraction, and material removal means for removing material from around the buried line ahead of the de-trenching apparatus.

Pipelines or cables, such as subsea or land-based power cables, telecommunications cables or umbilical cables, are often buried in the seabed or ground. The material surrounding a buried line, such as a cable or pipeline, affords a degree of mechanical protection. However, when a buried cable or pipeline does become damaged, it is necessary to recover the damaged section of the line in order to carry out repairs. The process of extracting a buried line from the ground or seabed can be referred to as 'de-trenching'For example, a cable de-trenching operation typically involves exposing a part of the cable where the fault is thought to have occurred, cutting the cable, and recovering and testing the cut end of the cable. The cable can then be repaired and re-buried.
When de-trenching a buried line it is important to ensure that any part of the line that is disturbed during the de-trenching operation does not have its handling parameters compromised at any time during the process. For example, if part of the line is bent by more than the minimum bend radius (MBR) specified for the line, that part of the line may be mechanically damaged or weakened, potentially leading to a failure of the cable or pipeline. Such failure might be immediate or might not occur until a certain time after the original repair operation has been completed, for example weeks, months or even years later.


A low-delay audio signal coding system, using analysis-by-synthesis techniques, has circuitry for adapting the spectral parameters and the prediction order of synthesis filters, and of perceptual weighting filters in the order at each frame, starting from the reconstructed signal relevant to the previous frame. In the case of a CELP coder, gain controls are also provided to adapt, starting from the reconstructed sinal, a factor, bound to the average power of the input signal, of the gain by which the innovation vectors are weighted.

The term "wideband" is used in the speech coding field to indicate that the signal to be coded has a bandwidth greater than the about 3 kHz bandwidth of the conventional telephone band, in particular a band between about 50 Hz and 7 kHz. The use of a wider band than the conventional telephone band allows a higher quality of the coded signals to be obtained, as required or desired for certain services offered by integrated service digital networks, such as audioconference, videophone, commentary channels, etc., and also for cordless telephones.
In cases in which the coded signal must be transmitted at relatively low bit rates (for example 16-32 kbits/s), the use of the analysis-by-synthesis coding technique has already been suggested. This technique gives the highest coding gains at these rates. In particular, the paper "Experiments on 7 kHz audio coding at 16 kbits/s", presented by R. Drogo de Iacovo et al. at ICASSP '89, Glasgow (UK), 23-26 May 1989, paper S4.19, and European Patent Application EP-A-0 396 121, disclose a system in which the signal to be coded is divided into two sub-bands whose signals are coded at the same time, and examples are supplied of coders in which a multipulse excitation or an excitation consisting of vectors selected in an appropriate codebook (CELP=Codebook Excited Linear Prediction technique) is exploited.
In this known system, the coders of the two sub-bands operate on sample groups or frames with a 15-20 ms duration, and this clearly implies a coding delay at least equal to the duration of the frames themselves. For certain applications, such as cordless telephones, audiographic conferences, etc., it is essential to have a low-coding delay, so as to reduce the effects of acoustical and electrical echoes. To obtain the low delay, in schemes such as that shown in this European Patent Application, one cannot resort only to the use of very short frames (a few ms), because this would necessitate frequent updating of coding parameters, with a consequent increase in information to be transmitted to the decoder and therefore in the bit rate.
To realize low-delay coders using short-duration frames, without increasing the bit rate, it has been suggested to use CELP techniques in which the spectral parameters are computed starting from the signal reconstructed at the transmitter ("backward" CELP technique). According to these techniques, for each frame, the prediction units receive the set of parameters determined in the previous frame, estimate at each new sample a possible updated value of parameters, and supply as actual values those estimated after receiving the last sample. An example of this type of low-delay coder is described in the CCITT draft Recommendation G728 "Coding of Speech at 16 kbit/s Using Low-Delay Code Excited Linear Prediction" and in the paper "High-quality 16 kb/s speech coding with a one-way delay less than 2 ms", presented by J. H. Chen at ICASSP '90, Albuquerque (USA), April 3-6, paper S9.1. In this coder, designed for coding audio signals with the conventional telephone band, backward adaptation techniques are used to update predictor coefficients in the synthesis filters (comprising only short-term predictors) and the gain with which excitation vectors are scaled In particular, predictor coefficients of the synthesis filters are updated by means of an LPC analysis of the previously quantized speech; the coefficients of the weighting filters are updated by means of an LPC analysis of the input signal; and the vector gain is updated by using the gain information incorporated in the previously quantized excitation. In this way only the index of the word in the codebook (structured in excitation gain and shape) must be transmitted, since the predictor coefficients of the synthesis filter and the backward adapted gain can be determined in the receiver by backward adaptation circuits similar to those used in the transmitter.
The quality loss which could occur as a result of dispensing with a long-term predictor is compensated for by the use of a relatively high prediction order for the short-term predictors, in particular a prediction order equal to 50. In any case, the short-term prediction order cannot be raised beyond a certain limit for reasons of computation complexity.
In the case of sub-band coding, the use of different prediction orders in the different sub-bands has been suggested. In particular, in the coder described in the said paper by R. Drogo de Iacovo et al. (in which long-term correlations are exploited) filters with prediction order 10 for the lower sub-band and order 4 for the upper sub-band are used. These prediction orders are fixed. Good results are obtained in this way for actual speech, but not for signals with highly variable characteristics, such as music.

Low-delay audio signal coder, using analysis-by-synthesis techniques

SIP--Societa Italiana per l'Esercizio delle Telecommunicazioni P.A.


A vacuum release device for assisting removal of plastic bags from containers is disclosed. The device is a channel made from non-porous materials. The channel has multiple segments and is capable of being attached to both the sidewall and the bottom wall of a container. As the channel is attached to the walls of the container, an air conduit is formed to provide air conduction in the container. The attachment methods comprises mechanical, chemical, and adhesive. The channel has openings at the container's bottom wall and at the corner between the container's sidewall and bottom wall. The unique structure of the channel protects the openings from being blocked by a plastic liner.

1. Field of the Invention
The present invention relates to a vacuum release device for assisting removal of plastic bags from containers.
2. Related Art
Removal of plastic bags from containers (e.g. removal of plastic liners from trash cans) is difficult due to vacuum conditions inside the containers. The vacuum conditions are created between the plastic bags and walls of the containers when the plastic bags are placed into the containers and filled. The vacuum conditions may cause rupture of the plastic bags when the filled bags are lifted from the containers. It is desired that the vacuum conditions in the containers can be eliminated or prevented.
In U.S. Pat. No. 4,294,379 (Bard, 1981), a trash receptacle with molded or attached hollow tubes is presented. In U.S. Pat. No. 5,170,906 (Kocheleck, 1992), a trash can with spaced vertical ribs on sidewalls is disclosed. In U.S. Pat. No. 5,375,732 (Bowers, et al., 1994), a garbage container including an air conduit molded in the sidewall is disclosed. U.S. Pat. No. 6,015,063 (Poliquin, 2000) discloses a trash can vent system, in which a vent assembly is positioned along the interior sidewall and attached on the can by a secure cap. U.S. Pat. No. 6,474,495 B1 (Frei, 2002) discloses a garbage can with apertures around both the open and closed ends of the can. In U.S. Pat. No. 6,594,876 B1 (Stastny, 2003), a method for modifying an existing trash can is disclosed. As described in this disclosure, one end of an air conduit is extruded outside of the trash can and tied onto the trash can, and the other end placed on the bottom of the trash can. U.S. Pat. No. 6,736,281 B2 (Joseph, 2004) provides a waste receptacle including air baffles formed on the inner sidewalls and the bottom wall of the receptacle. US Pat. Pub. No. 2007/0068947 A1 (Rush, 2007) discloses a molded half-moon-shaped air tube capable of being bonded to a trash can with a self-adhesive tape. U.S. Pat. No. 7,438,199 (Tidrick, 2008) discloses a vacuum release trash container. The sidewall of the vacuum release trash container has open columns between an inner wall and an outer wall. Vacuum release orifices, in communication with the columns, are made on the top rim and on the inner wall near the bottom of the container.
In summary, there are primarily two categories of methods for vacuum release in trash containers. In the first category, improvements of containers are proposed. The improvements include an air conduit built into sidewalls (U.S. Pat. Nos. 5,375,732 and 7,438,199), air baffles or vertical ribs built on inside surfaces of sidewalls (U.S. Pat. Nos. 5,170,906, 6,736,281 B2), and apertures made on sidewalls (U.S. Pat. No. 6,474,495 B1). These improvements have following disadvantages. (1) Complexity and cost of manufacturing these improved containers will increase. (2) These improvements can not solve the problem of vacuum release in currently used containers.
In the second category, methods of adding vent channels or air conduits on existing containers are developed. These methods are presented in four disclosures, U.S. Pat. Nos. 4,294,379, 6,015,063, and 6,594,876 B1, and US Pat. Pub. No. 2007/0068947 A1. Some disadvantages of these methods are as follows. In U.S. Pat. Nos. 4,294,379 and 6,015,063, and US Pat. Pub. No. 2007/0068947, the vent channels or the air conduits are only capable of being positioned along sidewalls in the containers. Because of the structures of the vent channels or the air conduits, it is impossible to position one assembly of the vent channels or the air conduits continuously along both the sidewall and the bottom wall in the containers. In U.S. Pat. No. 6,594,876 B1, an air conduit is positioned on the bottom of a container, but the air conduit has only one opening at the end of the air conduit on the bottom; therefore, the air conduit can not prevent vacuum in most contacting areas between a plastic trash liner and walls of the container. In U.S. Pat. Nos. 6,594,876 B1 and 6,015,063, one of advantages is that the air conduits or the vent channels are extruded outside of the containers. The most significant disadvantage in the four disclosures is that, due to structures of openings in the air conduits or the vent channels, plastic liners can easily block the openings. The blockage will consequently render the air conduits or the vent channels ineffective in preventing or eliminating vacuum in the containers.

Vacuum release device for assisting removal of plastic bags from containers


Apparatus for mounting a boat canvas to a boat including a tubular frame member adapted to be mounted on the boat. The hollow tubular frame member includes a plurality of angularly related walls having elongate edges. The elongate edges of at least one of the walls is coupled to the adjacent elongate edges of the two adjacent walls with a pair of U-shaped troughs which, together with the one wall, forms a track. A U-shaped, fastener mounting member is slidably received on the track and includes a base having a pair of legs extending therefrom and slidably received in the troughs. A male fastening member is coupled to one of the canopy and the slide and a cooperating, complementally shaped female fastening member is coupled to the other of the canopy and the slide. If desired, a similar trough may couple the elongate edges of each wall to the adjacent elongate edges of each adjacent wall and additional U-shaped slides may be slidably mounted on another of the walls.

1. Field of the Invention
This invention relates to apparatus for mounting a canopy to a boat and more particularly to a canvas mounting boat top frame for adjustably mounting snap fasteners detachably coupled to a boat canvas.
2. Description of the Prior Art and Objects
Boat canopies and mooring covers, which are typically formed of canvas, are detachably coupled to a boat with a plurality of fasteners each including a male fastening member attached to the boat surface and a complementally formed female fastener attached to the boat canopy or mooring cover. As the canvas ages, it shrinks and thus, it is difficult and time consuming to stretch the canvas so that the canvas mounted female fasteners will be properly aligned with the male fasteners mounted on the boat. Accordingly, it is an object of the present invention to provide new and novel mechanism for attaching a sheet of fabric, such as a boat cover, to an object, such as a boat.
It is another object of the present invention to provide a new and novel frame for mounting a cover on a boat.
Yet another object of the present invention to provide apparatus for attaching a cover to a boat including new and novel mechanism for slidably mounting a male snap fastener to a boat for receiving a complementally formed female snap fastener on a boat cover.
Traditionally, a canopy mounting framework includes a plurality of tubes forming the upper frame of the convertible top frame. If desired, the tubes may be articulately coupled together to provide a convertible top. The cover or canopy is draped over, but not attached to the frame and thus, sometimes, due to high winds, the cover can be detached from the boat and boat frame. Accordingly, it is a further object of the present invention to provide new and novel apparatus for securely attaching a canopy to a hollow tubular boat frame from the frame.
It is yet another object of the present invention to provide a new and novel boat cover mounting frame which will increase the force required to detach the cover.
It is another object of the present invention to provide a boat cover mounting frame which will better insure that the cover remains on the boat and is not inadvertently dislodged.
The U.S. Pat. No. 3,367,349 issued to Maurice H. O'Link on Feb. 6, 1968, discloses an aluminum extruded solid rail formed with grooves for receiving a slide which mounts a female snap fastener. This construction requires the installation of a separate rail and does not facilitate coupling the canvas to the hollow tubular fame work typically associated with many smaller boats. U.S. Pat. No. 5,343,824 issued to Richard S. Floyd on Sep. 6, 1994, similarly discloses a rail which is mounted on the surface of a canoe mounts a slide having a pair of T-shaped bars that clamp a canvas to a pair of complementally formed T-shaped slots provided in an outer rail to sandwich the edge of the cover therebetween. Accordingly, it is an object of the present invention to provide new and novel hollow boat cover framework for detachably coupling a boat cover to a hollow frame work mounted on a boat.
It is another object of the present invention to provide a new and novel hollow tubular frame work on which fastener mounting slides can be slidably mounted for movement to any selected one of a plurality of different positions to receive complementally formed fasteners attached to the boat cover.
U.S. Pat. No. 5,331,993 issued to Ronald R. Billbury on Jul. 26, 1994, discloses a cover fastening device including a U-shaped slide which surrounds three sides of a square shaped tubing that is fastened to the surface of the boat. This construction is limited in its use and versatility since the U-shaped slide includes inwardly offset terminal ends that extend along a portion of the fourth side of the tubular member and thus, interferes with utilizing multiple sides of the tubular frame for multiple purposes. It is sometimes is desirable to mount curtains, a coat hook or other paraphernalia on the inside of a canopy. With the Billbury construction, the fastening device encompasses three sides and extends into the fourth side of the square and thus restricts the use of the tubing. Accordingly, it is another object of the present invention to provide new and novel hollow, multi sided boat frame which utilizes only one of the sides to mount the cover.
It is another object of the present invention to provide a boat cover mounting frame which will enhance the mounting of various objects from different sides of the framework.
It is another object of the present invention to provide boat canopy mounting apparatus of the type described which will facilitate the mounting of multiple slides on multiple sides of a tubular frame work for mounting the canopy on one side of the tubular frame and another object on an opposite side of the tubular frame work.
Yet another object of the present invention is to provide a new and novel frame for mounting a cover on a boat including a hollow elongate tube having a plurality of angularly related wall panels each having elongate edges and a pair of elongate troughs integrally coupling the elongate edges of one of the panels to the adjacent elongate edges of the two adjacent panels to provide a track for slidably receiving a cover fastener mounting slide.
It is a further object of the present invention to provide a new and novel mechanism for coupling a portion of a convertible boat canopy to a convertible hollow tubular convertible top frame.
Another object of the present invention is to provide a new and novel frame for mounting a boat cover on a boat including a tubular member having a new and novel cross section.
Yet another object of the present invention is to provide a new and novel frame for mounting a cover on a boat including a track formed in one of the side walls of a hollow tubular member.
Still another object of the present invention to provide a new and novel frame of the type described including a pair of oppositely disposed elongate tracks formed on opposite sides of an elongate tubular frame member.
Other objects and advantages of the present invention will become apparent to those of ordinary skill in the art as the description thereof proceeds.


A vehicle headliner includes a preformed headliner substrate which can be of molded construction and which includes an upper surface facing the roof of a vehicle. Attached at a plurality of locations on the upper surface of the headliner are magnets bonded to the upper surface of the headliner and positioned for engaging contact with aligned metallic vehicle roof structure once installed. In one preferred embodiment, the magnets are flexible extruded magnetic strips positioned to at least partially surround a relatively large aperture formed in the headliner such as one defining a sunroof opening. In a preferred embodiment of the invention also, the magnetic strips are attached to the headliner using a cushioning material such as a foam to provide acoustical damping for the headliner.

The present invention pertains to a vehicle headliner and particularly to a structure for mounting the headliner to the roof of a vehicle.
Headliners have been attached to the roof of vehicles in a variety of manners. Some headliners are attached using screw or snap-in fasteners while others have employed adhesives. Hook and loop type fasteners such as VELCRO have also been recently employed. One difficulty with such fastening structures, including hook and loop fasteners, is that once attached the headliner locks into position and no longer can be shifted laterally thereby requiring that the alignment and attachment of the headliner to the vehicle roof be precise when it is initially made. This is difficult to achieve in an assemblyline environment.
A particular problem area for attaching a headliner to the roof of a vehicle has been in the area of a sunroof where relatively large rectangular openings for the sunroof are required The edge of such opening formed through the roof of a vehicle frequently has little supporting roof structure immediately adjacent the opening. It is difficult therefore to adequately support the edges of the correspondingly aligned opening in the headliner. While a variety of vehicle accessories such as grab handles, visors, overhead consoles and the like have been used to assist in mounting headliners to a vehicle, the area near the sunroof has posed a continuous problem in terms of providing a neat trim appearance to the edge of the headliner while holding it closely adjacent the vehicle sunroof opening.


A full-color light emitting device includes four leads and three light emitting diode chips which have different light emission wavelengths and can be individually controlled to realize emission of light beams of more diverse colors. The device has a simplified connection structure, so that it can be implemented even when a limited bonding area is provided.

1. Field of the Invention
The present invention relates to a full-color light emitting device capable of emitting light beams of three or more colors in which three light emitting diode chips thereof having different light emission wavelengths are individually adjusted in light emission density, so that it can emit light beams of three or more colors, and more particularly to a full-color light emitting device with four leads in which three light emitting diode chips thereof having different light emission wavelengths can be individually controlled to realize emission of light beams of more diverse colors, while having a simplified connection structure, so that the light emitting device can be implemented even in the case in which a limited bonding area is provided.
2. Description of the Related Art
Light emitting devices, which use semiconductor light emitting elements, are configured by arranging, for example, a plurality of light emitting diodes (LEDs) as light emitting semiconductor elements on a panel. In such a case, each LED emits red, green or blue light in accordance with the kind of its compound semiconductor.
In the case of a light emitting device adapted to emit monochrome light, using LEDs as semiconductor light emitting elements, each LED constitutes one pixel. In the case of a light emitting device adapted to emit full-color light composed of the three primary colors, that is, red (R), green (G), and blue (B), using LEDs, each light emitting element thereof consists of three LEDs of red, green, and blue, that is, the three primary colors. In the latter case, each full-color light emitting element constitutes one pixel.
FIG. 1 illustrates a conventional full-color light emitting device for one light emitting element thereof. As shown in FIG. 1, first through third LEDs 14 to 16 are mounted on a main lead 11. The first LED 14 has a first electrode electrically connected to the main lead 11 in accordance with a die-bonding method, and a second electrode electrically connected to a first sub-lead 12 at its second electrode in accordance with a wire-bonding method. The second LED 15 has first and second electrodes respectively electrically connected to the first sub-lead 12 and a second sub-lead 13 in accordance with a wire-bonding method. The third LED 16 has a first electrode electrically connected to the main lead 11 in accordance with a die-bonding method, and a second electrode electrically connected to the second sub-lead 13 in accordance with a wire-bonding method. The first and second electrodes of each LED may be an anode and a cathode, or vice versa, respectively.
In each of the first and third LEDs 14 and 16, one of its anode and cathode is arranged on the upper surface of its chip, whereas the remaining electrode is arranged on the lower surface of the chip. The electrode arranged on the lower chip surface is electrically connected to the main lead 11 in accordance with a die-bonding method, whereas the electrode arranged on the upper chip surface is electrically connected to an associated one of the first and second sub leads 12 and 13 in accordance with a wire-bonding method. On the other hand, in the case of the second LED 15, both electrodes thereof are arranged on the upper surface of its chip. In this case, the chip of the second LED 15 is mounted on the main lead 11 such that its lower surface is in contact with the main lead 11 via an insulating substrate. In this state, the electrodes on the upper chip surface are electrically connected to the first and second sub-leads 12 and 13 in accordance with a wire-bonding method, respectively.
The first LED 14 is an red (R) LED, the second LED 15 is a green (G) LED, and the third LED 16 is a blue (B) LED.
FIG. 2 illustrates an equivalent circuit of the full-color light emitting device implemented as shown in FIG. 1.
Now, operation of the full-color light emitting device will be described with reference to the equivalent circuit of FIG. 2. The color of light emitted from the light emitting device can be adjusted by controlling respective voltages applied to the three leads 11 to 13, thereby controlling respective operations of the first through third LEDs 14 to 16.
For instance, when a "+" voltage is applied to the main lead 11, and a "−" voltage is applied to the first sub-lead 12, the first LED 14 is activated. When the "+" voltage is applied to the main lead 11, and the "−" voltage is applied to the second sub-lead 12, the third LED 16 is activated. On the other hand, when the "+" voltage is applied to the first sub-lead 12, and the "−" voltage is applied to the second sub-lead 13, the second LED 15 is activated. When each LED of the full-color light emitting device is activated, it serves as a red, green or blue light source.
However, the above mentioned conventional full-color light emitting device has a high possibility of error generation because its operation condition is determined in accordance with the polarity of the control voltage applied to each of the first and second sub-lead 12 and 13.
Furthermore, the conventional full-color light emitting device has a complex electrical circuit configuration for implementation of full-color light emission, as shown in FIG. 2, because it uses a small number of lead frames.
In the above mentioned structure, there is also a problem in that it is difficult to configure a desired circuit where each of the LEDs 14 and 16, to which a die-bonding technique is to be applied, only has two or more wire bonding pads due to the substrate material of its chip.
FIG. 3 is a plan view illustrating another conventional full-color light emitting device with four leads. FIG. 4 illustrates an equivalent circuit of the full-color light emitting device shown in FIG. 3.
The full-color light emitting device shown in FIGS. 3 and 4 includes an R LED 35, a G LED 36, and a B LED 37 which have different light emission wavelengths, respectively. The R, G, and B LEDs 35 to 37 are bonded to a main lead frame 31 by means of an adhesive. The LEDs 35 to 37 are electrically connected to first through third sub-lead frames 32 to 34 for supply of electric power, respectively, while being electrically connected to the main lead frame 31 as a common electrode.
The electrical connection of each LED is achieved in accordance with a die-bonding method and a wire-bonding method using electrical connecting members (for example, conductive wires).
In this full-color light emitting device, as shown in FIG. 4, each of the three LEDs 35 to 37 is connected to the main lead frame 31 at one electrode thereof (anode) while being connected to an associated one of the first through third sub-lead frames 32 to 34 at the other electrode thereof (cathode). Each of the first through third LEDs 35 to 37 is turned on/off when the control voltage to be applied to an associated one of the first through third sub-lead frames 32 to 34 is switched on/off. Light beams emitted from the LEDs 35 to 37 in their ON state are mixed so that light of full color including red, green and blue, and mixed colors thereof is generated.
This conventional 4-lead full-color light emitting device can have a simple circuit configuration, as shown in FIG. 4. However, the main lead frame 31 must have a substantial area because the first through third LEDs 31 to 33 are commonly connected to the main lead frame 31 at their one-side ends. For this reason, where the full-color light emitting device has a limited size, an insufficient bonding area may be provided.
In other words, the above mentioned conventional 4-lead full-color light emitting device has a problem in that it cannot implement a full-color light emitting device including a main lead frame having a limited area.

Full-color light emitting device with four leads


A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit, where at least one of a trench and a via is defined under the graphene interconnection unit.

1. Field
The present disclosure relates to a high frequency circuit including graphene and a method of operating the high frequency circuit including graphene. More particularly, the present disclosure relates to a high frequency circuit including chemically synthesized graphene with improved productivity and reproducibility.
2. Description of the Related Art
Recently, research into graphene having high current density and long travel distance of free electrons has been conducted, as a replacement of silicon or metal that has been commonly used in electronic devices. Graphene is a material having improved characteristics compared to metal, which is widely used in electronic devices, e.g., copper or aluminum. Furthermore, three-dimensional displays using high-capacity signal transmission, next generation communication devices that operates at 3 gigahertz (GHz) or higher, and semiconductor devices using materials as replacements for silicon may use signal transmission at a high radio frequency field.

High frequency circuit comprising graphene and method of operating the same

INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY


An apparatus for planarizing semiconductor wafers in a chemical-mechanical planarization process comprises a polishing pad, a wafer carrier, and at least one acoustic sensor for receiving acoustic emissions produced during the chemical-mechanical planarization process. The wafer carrier is positioned adjacent the polishing pad and is adapted for carrying a wafer in a manner so that the wafer engages the polishing pad. The wafer carrier and the polishing pad are moveable relative to one another in a manner to planarize the wafer. The acoustic sensor is mounted to the wafer carrier in a manner so that the sensor is in contact with the wafer. The acoustic sensor receives acoustic emissions produced during a chemical-mechanical planarization process. The received acoustic emissions are then analyzed to identify and determine surface characteristics of the wafer.

This invention relates to semiconductor wafer manufacturing and, more particularly, to a novel method and apparatus for detecting defects and other surface characteristics of a semiconductor wafer during a planarization (polishing) process.
With ever increasing demand from customers, the semiconductor industry is developing processes for producing smaller, better, faster and more affordable microprocessing devices. One step in a conventional semiconductor wafer fabricating process is a polishing or xe2x80x9cplanarizingxe2x80x9d step to produce a flat, smooth and defect-free surface on one face of the semiconductor wafer. The condition of the wafer surface is critical because circuits embedded in the wafer may require resolution of as little as 0.01-0.05 microns. Uniformity of thickness of the wafer is also important, and total thickness variation in the wafer is a critical indicator of the quality of the wafer.
In recent years, chemical-mechanical planarization (CMP) has emerged as the primary technique for planarizing (polishing) semiconductor wafers. CMP is a process of smoothing and planing aided by chemical reactions and mechanical forces. In a typical CMP process, a semiconductor wafer is pressed against a polishing slurry on a polishing pad under controlled chemical, pressure, velocity, and temperature conditions. The polishing slurry solution typically contains small abrasive particles, such as silica or alumina, that mechanically remove the surface of the wafer, and also contains chemicals that react with the material of the wafer to enhance the removal of layers on the surface of the wafer. The polishing pad is a generally planar pad made from a relatively soft porous material, such as blown polyurethane. The polishing pad is typically held in a movable platen that rotates and/or reciprocates the polishing pad. One side of the wafer is typically bonded with a layer of wax (or another suitable bonding agent) to a wafer carrier, which holds the opposite side of the wafer against the polishing slurry on the polishing pad. The platen and the wafer carrier are then moved relative to one another under controlled conditions for a specified period of time to polish or planarize the wafer. Thus, under normal conditions, CMP is a combination of chemical reaction, which serves to loosen material on the wafer surface and help to dissolve them, and free abrasive grinding, in which the abrasives are moved in a rotating motion between the wafer surface and the polishing pad to remove the material on top layers of the wafer by fracturing pieces off the wafer surface (i.e., xe2x80x9cmicro indentationxe2x80x9d) into the slurry where they dissolve and are swept away.
The desire for improved yield (acceptance rate) in the semiconductor wafer fabricating process has created a need for improved techniques of in-situ CMP process monitoring and defect detection. One type of critical defect that can occur in a CMP process is xe2x80x9cmicro-scratching.xe2x80x9d Micro-scratches can occur during the CMP process when a particle (an unusually large particle in particular) is dragged across the wafer surface. This causes a depression in the top layers of the wafer surface (i.e., a xe2x80x9cmicro-scratchxe2x80x9d) that can have a variety of sizes and geometries, but are typically not visible to the naked eye. The particles may be the result of chained slurry abrasives or other foreign objects that find their way between the wafer surface and the polishing pad.
It is desirable that such micro-scratches and other surface defects be detected as early as possible during the CMP operation so that the process can be controlled to correct the problem before more micro-scratches are formed and more wafers irreparably damaged.
Among the several objects of the invention may be noted the provision of an improved apparatus and method for polishing or planarizing semiconductor wafers; the provision of an apparatus and method for detecting mirco-scratches and other surface defects in semiconductor wafers during the CMP process; the provision of an apparatus and method for analyzing acoustic emissions that result from the CMP process as a means for identifying mirco-scratches and other surface defects in semiconductor wafers; the provision of an apparatus and method employing sensors mounted adjacent to the semiconductor wafer for receiving acoustic emissions resulting from the CMP process; the provision of an apparatus and method for detecting mirco-scratches and other surface defects in semiconductor wafers early in the CMP process so that subsequent damage can be avoided; and the provision of an apparatus and method for analyzing acoustic emissions that result from the CMP process as a means for determining a thickness or end point of the wafer for in-process monitoring of the CMP process.
In general, a planarizing apparatus of the present invention for planarizing semiconductor wafers in a chemical-mechanical planarization process comprises a polishing pad, a wafer carrier, and at least one acoustic sensor for receiving acoustic emissions produced during the chemical-mechanical planarization process. The wafer carrier is positioned adjacent the polishing pad and is adapted for carrying a wafer in a manner so that the wafer engages the polishing pad. The wafer carrier and the polishing pad are moveable relative to one another in a manner to planarize the wafer. The acoustic sensor is mounted to the wafer carrier in a manner so that the sensor is in contact with the wafer.
In another aspect of the present invention, a method for determining surface characteristics of a semiconductor wafer during a chemical-mechanical planarization process comprises planarizing a semiconductor wafer, receiving acoustic emissions produced during the chemical-mechanical planarization process, and analyzing the received acoustic emissions to determine surface characteristics of the wafer.
In still another aspect of the present invention, a method of chemical-mechanical planarization comprises providing a planarizer including a polishing pad, a semiconductor wafer carrier, and at least one acoustic sensor, attaching a semiconductor wafer to the wafer carrier in a manner so that the wafer is engageable with the polishing pad, moving the polishing pad and the wafer carrier relative to one another to planarize the wafer, receiving acoustic emissions produced during the chemical-mechanical planarization process with said acoustic sensor, and analyzing the received acoustic emissions to determine surface characteristics of the wafer being planarized.
While the principal advantages and features of the present invention have been described above, a more complete and thorough understanding and appreciation for the invention may be attained by referring to the drawings and detailed description of the preferred embodiments, which follow.

Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process


A method for fabricating a flexible, blood pumping membrane for use within an artificial ventricle, involves the steps of selecting a mold configured to provide a dome shaped diaphragm biased in a static mode to a systolic configuration and suitable for use within a ventricular housing as a part of a blood pumping membrane. The specific steps include forming the dome shaped diaphragm on a surface of the mold to include (i) a perimeter comprising at least a portion of a diaphragm/housing interface which is configured to connect the dome shaped diaphragm with the ventricular housing to enclose a blood pumping chamber, and (ii) an intermediate annular section of the dome shaped diaphragm extending inward from the diaphragm/housing interface in a configuration corresponding to that portion of the diaphragm when the ventricle is substantially at full systole.

1. 1. Field of the Invention
This invention pertains to a blood contacting membrane which operates as part of a pumping mechanism for displacement of blood through an artificial ventricle. More particularly, the present invention relates to a single layer, pumping membrane wherein one side of the pumping membrane constitutes the blood contacting diaphragm surface within the blood chamber of the ventricle.
2. Prior Art
Despite the growing need for an effective artificial ventricle to replace damaged heart organs, a commercially acceptable artificial ventricle remains a subject of considerable research and development, rather than commercial production. Certainly, many various ventricle designs have been offered for patient use; however, the state of the art continues to be primarily exploratory.
Numerous obstacles remain with respect to achievement of an artificial ventricle which can take its place in the medical community as a standard commodity. One such obstacle is the high cost of such devices, often placing them beyond the reach of day to day economic reality. This high cost arises because of the difficulty in manufacturing an acceptable pumping diaphragm which has minimal stress as it displaces between extended positions at systole and diastole. This stress occurs at folding sections of the diaphragm as it moves from full blood chamber expansion at diastole, through intermediate folds and deformation, to full inverse extension in systole. If these folds and deformations become localized at specific areas of the diaphragm, such areas may weaken as the localized deformations continue for millions of repetitions.
Numerous designs have been attempted which generate broad folding patterns which will avoid localized stress. U.S. Pat. No. 4,974,729 teaches the advantages of using elliptical pumping and blood diaphragms to develop more favorable folding patterns. U.S. Pat. No. 4,981,484, by the same inventor, further developed the elliptical diaphragm with a unique modification to curvature by flattening sections of the diaphragm to program a large fold pattern. Each of these designs utilized multiple membranes for forming the pumping diaphragm, because such a thin membrane minimizes the stress arising as it goes through its deformation.
More importantly, these membranes were molded with a downward curvature, corresponding to the shape of the diaphragm at diastole. This technique and diastole pattern has been virtually universal with respect to membranes formed within a rigid ventricular housing wherein the membrane displaces into a pumping chamber in concave form and extends upward into the blood chamber in convex configuration.
Because the membranes are molded in the downward or diastolic configuration, the perimeter is typically formed with an inverted U-shaped edge, with the outside leg of the U being the point of attachment to the outer housing. In this diastole configuration the membrane has no stress arising, because its molded shape is in original form as originally molded. Upon deformation of the diaphragm upward toward systole, the polymer shape is modified and the natural resilience of the elastomer will tend to increase the stress load to return the membrane to its original, downward configuration. This repeated occurrence of stress within the membrane tends to weaken the polymer at the points of local stress, and will eventually result in diaphragm failure.
This traditional pattern of forming the pumping diaphragm in a downward or diastolic configuration was also adopted in U.S. Pat. No. 4,089,020. This invention disclosure shows a monoseptal, biventricular design wherein the separating wall between the ventricles serves as a rigid support to opposing pumping diaphragms. As is noted in FIG. 7, both diaphragms are biased to a collapsed configuration against the rigid wall in the diastolic position, and must be inflated to realize the systolic mode.
Accordingly, a major problem persists with respect to management of elastic stress associated with diaphragm displacement during the repeated pumping cycle of the artificial ventricle. The existence of this stress required the use of multiple diaphragms in larger ventricles to maintain a sufficiently thin dimension so that elastic stress was minimized. Manufacture of such membranes required repeated dip molding, taking many days to complete fabrication. The total process resulted in extreme high cost in the production of an acceptable membrane for use as a human prosthetic. This high membrane cost contributed to a cost of an artificial heart reaching in the hundreds of thousands of dollars.

Method of making a blood pumping membrance for artificial ventricles


A system, method and article of manufacture for automatically inserting transactional recoverability object service in binary classes in an information handling system employing object oriented technology, includes the steps of recognizing a constraint indicating that an object is not recoverable and generating a recoverable version of the object. One alternative for generating a recoverable version of the object includes the step of saving a first state of the object in a stream before execution of any method which might change the state of the object. Another alternative for the generating step includes the steps of creating a persistence synchronous class object, registering the persistence synchronous class object, and executing the persistence synchronous class object.

There is a need to automatically add various forms of transactional recoverability to a binary class. Sometimes the source code is not available to modify the class. Even when source code is available, a great deal of reprogramming is required to add these features.
The user should be able to add this feature in a way that does not increase the size of the user's class diagram with many variations on the original class.
The user should be able to specify this feature as constraints along with constraints that describe the function of the class (e.g., a speaker driver that can go to less than 10 CPS and costs less than $5) when searching for the class. This feature should include whether the object is persistent, whether its persistence can be controlled by the object's clients, how it is faulted into memory, and how it is synced with its datastore.

System, method, and article of manufacture for adding transactional recovery to a binary class in an object oriented system

International Business Machines Corporation


Methods and apparatuses for operating multiple antenna panels are provided. The wireless communication device includes a plurality of antenna panels and a processor coupled to the antenna panels. The processor is configured to maintain a plurality of leading time values. The plurality of leading time values may indicate a plurality of leading time durations. The processor is further configured to receive an indicator for antenna panel status information from a base station, and apply one of the plurality of leading time values to switch an antenna panel status of the plurality of antenna panels based on the indicator for antenna panel status information.

Various efforts have been made to improve different aspects of wireless communications (e.g., data rate, latency, reliability, mobility, etc.) for the next generation (e.g., 5G New Radio (NR)) wireless communication systems. Multi Input Multi Output (MIMO) is one of the key features in the next generation wireless communication systems. With the MIMO technology, a number of antenna panels at the transceiver/receiver can bring extra degrees of freedom to increase the data throughput, beamforming gain and coverage.
However, due to the lack of proper signaling mechanisms, the network may not know the current antenna panel status (e.g., how many and/or which of the antenna panels of the user device is turned on/off) at the UE side, resulting in a reduced scheduling performance.
Hence, there is a need in the art for an improved signaling mechanism for operating multiple antenna panels.