A plurality of pieces of process data are acquired from a semiconductor production apparatus while it is in operation, and then, a multivariate analysis model is created using at least a portion of the plurality of pieces of process data.

The present invention relates to a monitoring technique for ascertaining the operation status of an apparatus for producing a semiconductor device on the real time basis.
In recent years, production processes of semiconductor devices have become complicated along with miniaturization of the semiconductor devices. Thus, when a defective semiconductor device is produced or when the production yield of a semiconductor device is decreased, it requires a long time to track down the cause of the problem, e.g., to find whether the cause is in a production process or in a production apparatus. Moreover, the process margin in the production of a semiconductor device has been decreasing along with an increase in the integration density of the semiconductor device. As a result, a variation in the production yield of the semiconductor device, which occurs due to an internal error of a production apparatus (process variation among chambers of a multi-chambered production apparatus) or a difference among production apparatuses (process variation among production apparatuses of the same type), has become a great problem. Therefore, in a production process of a highly integrated semiconductor device, a technique for measuring the operation status of a production apparatus on the real time basis, i.e., a technique for monitoring the operation status of a production apparatus, is very important.
Now, a conventional monitoring technique for a semiconductor production apparatus is described while exemplifying a plasma etching apparatus, which is one of typical semiconductor production apparatuses.
FIG. 14 illustrates monitoring of the operation status of the plasma etching apparatus with a conventional monitoring apparatus.
As shown in FIG. 14, the plasma etching apparatus 100 includes a reaction chamber 103 having a lower electrode 102 on which a substrate 101 to be processed is placed. At one side of the reaction chamber 103, a flowmeter (mass flow controller) 104 through which a process gas is supplied into the reaction chamber 103 and a pressure sensor 105 (such as Baratron, or the like) for measuring the gas pressure in the reaction chamber 103 are connected. On the other side of the reaction chamber 103, a vacuum pump 106 for discharging the process gas is connected through a conductance valve (ACP valve) 107. The conductance valve 107 adjusts the amount of the process gas to be discharged. At the bottom of the reaction chamber 103, a high frequency power supply 108 for supplying a high frequency power to the lower electrode 102 is connected through a matcher 109 and an additional sensor 110. Further, a chiller 111 is connected to the bottom of the reaction chamber 103.
Further, the plasma etching apparatus 100 includes a controller computer 112 which is connected through signal lines to the control devices, i.e., the flowmeter 104, the pressure chamber 105, the conductance valve 107, the high frequency power supply 108, the matcher 109, and the chiller 111. The controller computer 112 retains a plurality of pieces of process data acquired from the control devices, such as gas flow rate, gas pressure, degree of valve opening, plasma content value, etc., i.e., the values of a plurality of process parameters which represent the operation status of the plasma etching apparatus 100, in the form of digital data for a certain time period. The controller computer 112 is connected via network to a host computer 10 which manages a plurality of semiconductor production apparatuses including the plasma etching apparatus 100 and a monitoring apparatus (monitoring tool) 20 for ascertaining the operation status of the plasma etching apparatus 100. The monitoring tool 20 acquires a plurality of pieces of process data from the controller computer 112. Note that the sampling rate for the process data in the controller computer 112 is about one second, and thus, a transient variation cannot be observed in parameters of certain types. In order to avoid such inconvenience, the monitoring tool 20 is directly connected through signal lines to the control devices of the plasma etching apparatus 100 (specifically, the flowmeter 104, the pressure chamber 105, the matcher 109, and the additional sensor 110), whereby the monitoring tool 20 can acquire the process data directly from these control devices in the form of analog data.
Next, a conventional monitoring method for a semiconductor production apparatus is described with an example where process data is acquired in the form of analog data directly from the respective control devices of the plasma etching apparatus 100 using the monitoring tool 20 shown in FIG. 14.
FIG. 15 is a flowchart of the conventional monitoring method.
In the first process P1, a plurality of pieces of process data are acquired in the form of analog data directly from the respective control devices of the plasma etching apparatus 100 using the monitoring tool 20, and the acquired process data are retained in a recording medium of the monitoring tool 20.
In the second process P2, the plurality of pieces of process data retained in the recording medium of the monitoring tool 20 are transferred to a recording medium of another computer using a flexible disk, or the like.
In the third process P3, the plurality of pieces of process data are plotted on the time series in the another computer, whereby the trend management of the operation status of the plasma etching apparatus 100 is performed.
In the conventional monitoring method for a semiconductor production apparatus, a variation in each of the process parameter values in the semiconductor production apparatus can be monitored. However, it is necessary for determining whether the operation status of the semiconductor production apparatus is normal or abnormal to observe all of the process parameter values and employ a human (operator) in evaluating the operation status of the semiconductor production apparatus based on the observation result, i.e., all of the process data. That is, in the conventional monitoring technique, evaluation of the operation status of the semiconductor production apparatus cannot be automated. In other words, evaluation of the operation status of the semiconductor production apparatus cannot be performed both objectively and quickly.
In the conventional monitoring method, even when a process recipe consists of a plurality of steps, a statistical value of the process data is not calculated at every step. FIG. 16 shows a monitoring result of the power of a progressive wave of the high frequency power applied to the lower electrode in the etching apparatus shown in FIG. 14. As shown in FIG. 16, one process recipe for the etching apparatus consists of 5 steps, Steps S1 to S5, and the value of the power of the progressive wave is different among the steps. However, in the conventional monitoring method for the semiconductor production apparatus, the statistical value of the process data is not calculated at every step, and therefore, the operation status of the semiconductor production apparatus cannot be accurately ascertained.

System and method for monitoring semiconductor production apparatus

Matsushita Electric Industrial Co., Ltd.


In a system for monitoring each of compressors distant from each other through at least one of internet communication, optical communication line, electric communication line and wireless communication, a server computer obtains actual condition data of the each of the compressors through the at least one of internet communication, optical communication line, electric communication line and wireless communication, and stores therein the obtained actual condition data and predetermined database to be compared with the obtained actual condition data to find a remarkable technical point in the compressor, and a service center computer outputs the remarkable technical point to at least one of a service person and the compressor so that the at least one of the service person, the compressor and the user of the compressor can handle appropriately the remarkable technical point in the compressor.

The present invention relates to a system for monitoring each of compressors distant from each other through at least one of internet communication, optical communication line, electric communication line and wireless communication.
In a monitoring device for air conditioner as disclosed by JP-A-2001-141290, operation data of refrigerating cycle and maintenance data of the refrigerating system stored in a control device and an alarm signal generated by the control device are edited along a predetermined format and subsequently converted to HTML file data to be transmitted out of the monitoring device through telephone line.


A humidity controlling cap device utilizing a base member forming a recess and being detachable to a container. A carrier element having moisture regulating material lies in the recess and an air circulating cover encloses the carrier element within the recess.

The present application relates to a novel and useful humidity controlling cap device for use on a container. Control of humidity has been found to be important for use with stored items such as foodstuffs, tobacco products, jewelry, and other fine art items.
In the past, humidors have been devised to store cigars, cigarettes, cannabis, or pipe tobacco since it is important to maintain humidity at a steady level to prevent harm to such products. Certain humidors have been coupled with hygrometers in order to monitor the humidity level within the humidor case.
Reference is made to U.S. Pat. No. 5,936,178, which describes a humidity control device that employs a protective case in combination with a water vapor permeable pouch and a thickened saturated solution. The combination described in U.S. Pat. No. 5,936,178 is intended to maintain a steady level of humidity within the protective case. Although the apparatus of U.S. Pat. No. 5,936,289 successfully achieves this result, it is often necessary to control humidity in smaller and compact containers such as jars and tubes.
In accordance with the present application, a novel and useful humidity controlling cap is revealed which is capable of controlling the humidity level within a relatively small container.


Methods of co-curing aligned annular supports in a tubular region of a composite structure, such as a rotor blade, are disclosed. Methods include assembling an uncured composite structure by positioning an inboard annular support and an outboard annular support around an arbor, forming reinforcement fiber into a tubular region in contact with the supports, and applying a matrix material to the reinforcement fiber. The inboard and outboard annular supports are substantially composed of metal. Methods also include concentrically aligning the arbor and the supports along a common axis by applying heat to cause differential expansion of the arbor with respect to the supports, wherein the differential expansion causes an interference fit of the supports against the arbor. Methods also include curing the uncured composite structure to form the composite structure.

Rotorcraft, such as helicopters, tiltrotors, and autogyros, have at least one rotor for providing lift force. These rotors typically have an engine that rotates a mast coupled to a hub, and at least two airfoil rotor blades coupled to the hub. Rotor blades may be detachably coupled, allowing a rotor blade to be removed for service and storage.
A helicopter typically has a main rotor, rotating substantially horizontally, that provides lift and thrust. The torque created by the rotation of the main rotor causes the fuselage of the helicopter to turn in the opposite direction. The most common mechanism to control undesired fuselage rotation is a tail rotor that provides sideways thrust to counteract the torque of the main rotor.
Rotor assemblies come in multiple varieties including fully-articulated, semi-rigid, and rigid types. These types differ in which blade motions may be controlled by the pilot of the rotorcraft. Blade flap motion is deflection perpendicular to the plane of rotation. Blade lag motion (also called lead-lag motion, drag motion and hunting) is deflection within the plane of rotation. Blade feather motion is a change of blade pitch with respect to the plane of rotation (blades may rotate about their longitudinal axis). Fully-articulated rotor assemblies allow each blade to independently flap, lag, and feather. Semi-rigid rotor assemblies (also called semi-articulated rotors) lack independent flap and lag hinges, allowing only coordinated flap motion and independent feathering motion. In a semi-rigid rotor assembly, the blades are rigidly attached to each other. The assembly flaps as a unit; when one blade flaps up, another flaps down. A two-bladed semi-rigid rotor may be referred to as a teetering rotor or a see-saw rotor. If a semi-rigid rotor has three or more blades, it may be referred to as a gimbaled rotor. Rigid rotor assemblies lack any flap or lag hinges (and are sometimes called hingeless rotors). The blades, hub, and mast are rigidly attached to each other. Though other components are rigidly connected, rigid rotors may include feathering control of the rotor blades.
Feathering occurs by changing the pitch of the blades relative to the plane of rotation. A pitch bearing is typically incorporated into the rotor assembly to ease the blade feather motion. Feather may be collective (all blades set to the same pitch), allowing modulation of the magnitude of the rotor thrust, or may be cyclic (blade pitch depends on azimuth position), allowing modulation of the direction of the rotor thrust. A pilot can control the pitch and roll of a rotorcraft by appropriate cyclic feathering of the main rotor blades. When a tail rotor is employed, a pilot can control the yaw of a rotorcraft by appropriate collective feathering of the tail rotor blades.
Rotor blades experience substantial dynamic forces. Therefore, the blades and any hinges, bearings or couplings must be precisely engineered to provide acceptable stability, control, and performance.

Rotor assemblies and other composite structures with aligned bearing supports and methods of manufacture


A machine tool comprises a working space in which workpieces are to be machined and which is closed off against the outside by a case. The case comprises an opening, that can be closed by at least one sliding door and that gives access to the working space. The sliding door comprises vertically arranged slat elements that are connected one with the other by hinge connections.

1. Field of the Invention
The present invention relates to a machine tool having a working space in which workpieces are to be machined and which is closed off against the outside by a case in which an opening, that can be closed by at least one sliding door, is provided to give access to the working space.
2. Related Prior Art
Machine tools of this kind are known from the prior art.
The working space of such machine tools serves for machining workpieces that are, as a rule, mounted in a receptacle on a worktable. The machine tools comprise a spindle in which a tool can be selectively fitted for machining the workpieces.
The working space is closed off from the outside by a case in order to protect the environment and the operators from chips flying around in the working space and from splashing diluted soluble oil and coolant during machining of the workpieces. The case has an opening through which setting-up operations can be carried out and workpieces can be exchanged. This opening is normally closed by a door which is opened by an operator who wishes to carry out setting-up or tool-changing operations.
An operator door of that kind must meet quite a number of requirements; to begin with, opening of such a door must be possible very quickly and in a simple way. In addition, it must be ensured that the door mechanism cannot be soiled by chips flying around and splashing diluted soluble oil and coolant to such an extent that the door will get jammed and finally be blocked altogether.
Another requirement that must be met by such operator doors is that they must close off the opening very reliably so that the door area does not present a weak point in the case.
Another requirement to be met by such machine tools is that the opening must be very large to permit setting-up work and tool changes to be effected with the greatest possible ease. For, the smaller the operator door and, thus, the resulting opening, the greater the difficulties for the operator in carrying out the necessary operations inside the working space.
Another requirement, which is in opposition to the last-mentioned requirement, is that the outer dimensions of the machine tools should be as small as possible, and that the space requirements for the operator in front of the machine should also be as small as possible. This is to be seen against the background that machine tools of that kind are often part of numerically controlled machining centers where a great number of machine tools have to be arranged one beside the other and one opposite to the other, on the least possible floor space.
The operator doors known in the art are, for example, folding and hinged doors that are opened by folding or swinging them toward the top or the side. On the other hand, there have also been known sliding doors of the before-mentioned kind, which require that a corresponding space be available beside the sliding door for receiving the door elements when they are slid to the side. In the case of such sliding doors, the space available as operator opening is often less than half the total width of the machine tool. As frequently additional operating elements, etc., are to be arranged at the front of the machine tool, the remaining width of the operator opening is often as small as 1/3 of the overall width of the machine tool.
Especially in cases where telescoping, multi-layer doors or sliding doors are used, it is of disadvantage that on the one hand important mechanical input is required, while on the other hand the protection of the door mechanism from the working space is frequently so inefficient that the door mechanism may get soiled and, thus, jammed.
It is, therefore, a disadvantage of the known machine tools and the known operator doors that on the one hand the machine tools present a great width and/or the opening to be closed by the operator door is relatively narrow and in many cases has a limited height. Such machine tools are, consequently, not operator-friendly.
The before-mentioned hinged doors provide the disadvantage that their design is often very complex and that in addition such hinged doors swing into the working space where they create a risk of collision with the spindle.
If, in contrast, hinged doors are swung open to the outside, then much space is required in front of the machine tool, which is likewise regarded as a disadvantage.
Generally, it is another disadvantage of known operator doors that they frequently do not provide efficient sealing of the working space and that because of their mechanically very complex design they cannot be operated quickly and easily.


An patterned Si substrate-based LED epitaxial wafer and a preparation method therefor, the LED epitaxial wafer comprising: a patterned Si substrate (1) and an Al2O3 coating (2) growing on the patterned Si substrate (1); sequentially growing on the Al2O3 coating (2) are a nucleating layer (3), a first buffer layer (4), a first insertion layer (5), a second buffer layer (6), a second insertion layer (7), an n-GaN layer (8), a quantum well layer (9), a p-GaN layer (10), an n-electrode (14) electrically connected to the n-GaN layer and a p-electrode (13) electrically connected to the p-GaN layer. The present invention is suitable for the preparation of large-sized LED epitaxial wafers. Furthermore, the crystal quality is improved, and the light extraction efficiency of the LED die is improved.

Band gap of GaN-based III-V compound semiconductor materials (AlN, GaN, InN, and ternary or quaternary alloy materials composed of them) can be continuously adjustable from 0.7 eV to 6.2 eV at room temperature, and the color covers the entire visible light band and a part of infrared, ultraviolet band, which has a wide range of applications and developments in optoelectronic devices such as lasers (LDs), light-emitting diodes (LEDs), full-spectrum solar cells and detectors. In 1989, Akasaki and Amono successfully produced p-n junction GaN blue light-emitting diodes for the first time. By 1994, Nakamura et al. from Nichia Corporation, Japan, realized the industrialization of InGaN/GaN heterojunction blue LEDs, and since then, GaN-based LED optoelectronic devices have been widely used in backlight, illumination, display and other fields.
In the past 20 years, researchers have continuously explored and improved the GaN epitaxial growth technology, but it is difficult to prepare the GaN bulk material which is the most ideal homogenous substrate for growing GaN epitaxial layer (because GaN has a high melting point (2800° C.) and equilibrium vapor pressure (4.5 GPa) is large); therefore, epitaxial growth of GaN is mostly performed on a heterogeneous substrate. The substrates most commonly used to grow GaN-based device materials are sapphire, SiC, and Si. Among these three substrates, the sapphire substrate has become the mainstream technology in the LED industry, due to its low price and stable quality, as well as the greatly improved the light extraction efficiency due to the use of patterned sapphire substrates. However, the sapphire has a low thermal conductivity so that making it difficult to dissipate heat, which also seriously restricts the development of high-power LEDs using sapphire substrates. SiC substrate has excellent thermal conductivity (4.49 W/cm·K), and its lattice mismatch with GaN is only 3.5%, however due to its high price and small substrate size, it is difficult to reduce the cost, and can only be used in high-end applications. The Si substrate has the advantages of low price, large size, high crystal quality, high thermal conductivity, etc., and the Si-based device technology is very mature. The Si device process can maturely perform the steps of shear-thinning, flip-chipping, and packaging for the device to improve the operational stability of the device. However, the main problem with epitaxially growing GaN on a Si substrate is the presence of large stress in the GaN-on-Si epitaxial film, which causes surface cracking problems. In addition, when a GaN epitaxial material is grown on a Si substrate, if not treated, the Si substrate may react with Ga atoms in the atmosphere of ammonia (NH3) (referred to as a "melt-back reaction"), causing a large amount of surface defects, unable to produce the device. To solve this problem, the MOCVD reaction chamber needs to be carefully cleaned to remove the background of the Ga atoms, and it is necessary to first grow an AlN nucleation layer before growing the GaN material, thereby avoiding the melt-back reaction.
In addition to improving the crystal quality of the grown GaN epitaxial film and improving the internal quantum effect, the improvement of LED efficiency requires optimization of the light extraction efficiency. There are two main ways to improve the LED light extraction efficiency, one is the surface roughening technology of the LED epitaxial wafer, which increases the amount of light emitted from the surface; and the other is to prepare the LED epitaxial wafer on the patterned Sapphire Substrate (PSS), so that to increase the light reflected from the bottom by using the bottom of the patterned substrate. For LEDs on conventional Si substrates, it is necessary to perform a flip-chipping process, and to completely strip the Si substrate, because Si material is completely opaque at a blue wavelength. After the Si substrate is stripped off, it is necessary to roughen the AlN nucleation layer on the back surface, so that the light extraction efficiency can be improved. Surface roughening on N surfaces of AlN nucleation layers can be carried out by a dry or wet process, but each of the fabrication process is relatively difficult, the rate of dry etching for AlN is slow, and wet etching requires a higher temperature.
The preparation of a pattern structure on the Si substrate is relatively mature and simpler. However, when preparing a GaN LED structure directly on a patterned Si substrate, it is usually necessary to use an AlN nucleation layer to avoid the meltback etching between Si and Ga atoms. When AlN is deposited on a Si substrate, it can be attached to various directions of the patterned Si substrate, and it is impossible to prepare a single crystal GaN epitaxial material.

Patterned Si substrate-based LED epitaxial wafer and preparation method therefor


This invention relates to monoamine oxidase-B (MAO-B) inhibitory 5-substituted 2,4-thiazolidinediones, such as Formula I, to pharmaceutical compositions thereof, process of preparation, and methods of use in mammals to treat cognitive disorders, neurological dysfunction, and/or mood disturbances such as, but not limited to degenerative nervous system diseases. ##STR1##

1. Field of Invention
This invention relates to monoamine oxidase-B (MAO-B) inhibitory 5-substituted 2,4-thiazolidinediones, pharmaceutical compositions thereof, process of preparation, and methods of use in mammals to treat cognitive disorders, neurological dysfunction, and/or mood disturbances such as, but not limited to degenerative nervous system diseases.
2. Background
Increasingly there is a need for effective treatments for nervous system disorders and neurological deficiencies. Many of these diseases correlate with increasing age due mainly to degenerative changes in the nervous systems. Although in early stages of some diseases, certain systems are rather specifically affected (e.g., cholinergic systems in Alzheimer's Disease and Myasthenia Gravis, the dopaminergic system in Parkinson's Disease, etc.), multiple neurotransmitter system deficiencies (acetylcholine, dopamine, norepinephrine, serotonin) are generally found at later stages of diseases such as senile dementia, multi-infarct dementia, Huntington's Disease, mental retardation, etc. This explains the generally observed multiple symptomatology that includes cognitive, neurological, and effective/psychotic components (see Gottfries, Psychopharmacol., 86:245 (1985)).
Monoamine oxidase (MAO, EC 188.8.131.52) is an enzyme responsible for the oxidative deamination of a variety of exogenous and endogenous amines such as phenylethylamine, dopamine, serotonin, adrenaline, noradrenaline. Johnson, Biochem. Pharmacol., 17, 1285-1297 (1968) disclosed that the enzyme exist in two forms, MAO-A and MAO-B, differing in tissue distribution, structure, and substrate specificity. Some of the natural substrates for MAO-A are serotonin, octopamine, adrenaline, and noradrenaline; and some of the substrates for MAO-B are dopamine, phenylethylamine, and tyramine. MAO-B is found primarily in the platelets and the brain, and appears to increase with age. Additionally, MAO-B is significantly higher in the brains of patients with Alzheimer's Disease associated dementia (Dostert, et al., Biochem. Pharmacol., 38:555-561 (1989)). Because MAO-B is primarily responsible for the degradation of the needed neurotransmitter, dopamine, Dostert suggests that there is a rationale for the use of selective MAO-B inhibitors for the treatment of dementia and Parkinson's disease (see Strolin and Dostert in "New Directions in Effective Disorders", Eds B. Lerer and S. Gershon, Springer, New York, 262-267; and GOttfries, CG, Psychopharacol., 86:245-252 (1985)).
The most pertinent literature citations and patent references related to this invention can be found in:
Gates, KS and Silverman, RB, "5-(Aminomethyl)-3-aryl-2-oxazolidione. A Novel Class of Mechanism-Based Inactivators of Monoamine Odidase", J. Am Chem Soc., 112:9364-9372 (1990); ##STR2##
Tipton, KF, et al., "The Enzyme-Activated Irreversible Inhibition of Type-B Monoamine Oxidase by 3-{4-[(3-Chlorophenyl)methoxy]phenyl}-5-[(methylamino)methyl]-2-Oxazolidin one Methanesulphonate (Compound MD 780236) and the Enzyme-Catalysed Oxidation of this Compound as Competing Reactions", Biochem J., 209:235-242 (1983);
Dostert, et al., "Different Stereoselective Inhibition of Monoamine Oxidase-B by the R- and S-Enantiomers of MD 780236", J. Pharm. Pharmacol., 35:161-165 (1983); Drugs of the Future, 9(8):585-586 (1984); ##STR3##
"New benzyl-thiazolidine-dione derivatives for prevention and treatment of hyperglycemia, diabetes II, hyperlipidemia, hypertension, cardiovascular disease, and eating disorders", Beecham Group PLC, EP 419-035-A, (Aug. 25, 1989). ##STR4## where A.sub.1 =optionally substituted aromatic heterocyclic group;
A.sub.2 =benzene ring with up to 5 substitutions; PA1 X=O, S, or NR.sub.1 ; PA1 R.sub.1 =H, alkyl, acyl optionally substituted, aryl or optionally substituted aryl and aralkyl; PA1 Y=0 or S; PA1 R.sub.2 =alkyl, aralkyl, or aryl; PA1 n=2 to 6 PA1 R.sup.3 =H, alkyl; PA1 R.sup.4, R.sup.5 =H; PA1 R.sup.4 R.sup.5 =bond; PA1 R.sup.5, R.sup.6 =H, or one of R.sup.6,R.sup.7 =H, the other=OH, SMe; PA1 R.sup.5 R.sup.6 =S, O; PA1 X=SO.sub.n ; PA1 n=0-2. PA1 Y=O or if X=O; may be S; PA1 R.sub.1 =H, Cl, Br, CF.sub.3, CN, or NMe.sub.2 ; and PA1 R.sub.2 =H or Cl. PA1 R.sup.2 =H, or 1-4C alkyl; PA1 R.sup.3 =H or 1-2C alkyl; and PA1 n=0-3. PA1 R.sup.1 is H, halo, C.sub.1 to C.sub.10 alkyl, alkenyl, alkynyl, bicycloalkyl, aryl optionally substituted with 1-2 substituents independently selected from the group within the definition for R.sup.2, --C(.dbd.O)NR.sup.2, --C(.dbd.O)OR.sup.2, --CHO, --CN, --NO.sub.2, --N(R.sup.2).sub.2, NR.sup.2 C(.dbd.O)R.sup.2, --NR.sup.2 C(.dbd.O)OR.sup.2, --NR.sup.2 C(.dbd.O)N(R.sup.2).sub.2, --NR.sup.2 SO.sub.2 R.sup.2, --OR.sup.2, --OC(.dbd.O)OR.sup.2, --OC(.dbd.O)N(R.sup.2).sub.2, --SO.sub.2 N(R.sup.2).sub.2 ; PA1 n is 1 to 6; PA1 X is --CHR.sup.2, --NR.sup.2, O, or --S(O)p; PA1 p is 0, 1, or 2; PA1 a is a double bond; PA1 m is 1 to 6; PA1 Y is --OR.sup.2, --NHR.sup.2, --NR.sup.2 R.sup.3, --CN, --COR.sup.2, --C0.sub.2 R.sup.2, --S(O)pR.sup.2, or --SCN; PA1 R.sup.2 and R.sup.3 are independently H, alkyl of 1 to 6 carbon atoms, aryl, acyl or alkaryl of 1 to 10 carbon atoms; with the proviso that when m is 1, then Y is not OH, and when m is 2, and Y is NR.sup.2 R.sup.3, then R.sup.2 and R.sup.3 cannot simultaneously be alkyl. PA1 A is a straight or branched alkyl chain of 1 to 10 carbon atoms, phenyl optionally substituted with 1-3 substituents independently selected from the group within the definition for R.sup.1, pyridyl, or naphthyl; PA1 X is O; and PA1 Y is --CN, --COR.sup.2, --CO.sub.2 R.sup.2, --S(O)pR.sup.2, or --SCN. PA1 A is phenyl or 2-, 3-, or 4-chlorophenyl; 2-, 3-, or 4-pyridyl; PA1 X is O; PA1 Y is CN, SCN, or C0.sub.2 R.sup.2 where R.sup.2 is alkyl of 1 to 4 carbon atoms. PA1 a. 2,4-Dioxo-5-[3-(phenylmethoxy)-phenylmethylene]-4- thiazolidinebutanenitrile b. 2,4-Dioxo-5-[3-(phenylmethoxy)-phenylmethylene]-4-thiazolidinepentanenitri le PA1 R.sup.1 is halo, C.sub.1 to C.sub.10 alkyl, alkenyl, alkynyl, bicycloalkyl, aryl optionally substituted with 1-2 substituents independently selected from the group within the definition for R.sup.2, --C(.dbd.O)NR.sup.2, --C(.dbd.O)OR.sup.2, --CHO, --CN, --NO.sub.2, --N(R.sup.2).sub.2, --NR.sup.2 C(.dbd.O)R.sup.2, --NR.sup.2 C(.dbd.O)OR.sup.2, --NR.sup.2 C(.dbd.O)N(R.sup.2).sub.2, --NR.sup.2 SO.sub.2 R.sup.2, --OR.sup.2, --OC(.dbd.O)OR.sup.2, --OC(.dbd.O)N(R.sup.2).sub.2, --SO.sub.2 N(R.sup.2).sub.2, --S(O)R.sup.2, and --SO.sub.2 R.sup.2 ; PA1 X is --CHR.sup.2, --NR.sup.2, O, or --S(O)p; PA1 p is 0, 1, or 2; PA1 a is a single or double bond; PA1 m is 0 to 6; PA1 Y is H, --OR.sup.2, --NHR.sup.2, --NR.sup.2 R.sup.3, --CN, --COR.sup.2, --CO.sub.2 R.sup.2, --S(O)pR.sup.2, or --SCN; and PA1 R.sup.2 and R.sup.3 are independently H, alkyl of 1 to 6 carbons, aryl, acyl or alkaryl of 1 to 10 carbon atoms; Preferred methods utilize those compounds of Formula I wherein: PA1 A is a straight or branched alkyl chain of 1 to 10 carbons, phenyl optionally substituted with 1-3 substituents independently selected from the group within the definition for R.sup.1, pyridyl, or naphthyl; PA1 X is O; and PA1 Y is H, --CN, --COR.sup.2 --CO.sub.2 R.sup.2, --S(O)pR.sup.2, or --SCN, with the proviso that PA1 A is phenyl or 2-, 3-, or 4-chlorophenyl; 2-, 3-, or 4-pyridyl; PA1 X is O; PA1 Y is H, --CN, --SCN, or --CO.sub.2 R.sup.2 where R.sup.2 is alkyl of 1 to 4 carbons; with the proviso that
Sohda, T., et al., "Studies on Antidiabetic Agents. Synthesis and Biological Activities of Pioglitazone and Related Compounds", Chem. Pharm. Bull., 39(6):1440-1445 (1991). ##STR5##
Sohda, T., et al., Chem Pharm. Bull., 30:3580 (1982). ##STR6##
Panetta in EP 391644 disclosed 5-(4-hydroxyphenyl)-2-thioxo-4-thiazolidinones as antiinflammatories. ##STR7## where R.sup.1, R.sup.2 =H, alkyl, alkoxy, alkylcarbonyloxyalkyl;
Patent NL-7300982-Q teaches that 3-hydroxymethyl-5-benzylidene-azolidinones are anti-arthritics, anti-rheumatics, and immunosuppressants, and can be represented by the following formula: ##STR8## where X=O or S;
Patent JA 3077-875-A described a series of 3-carboxalkyl-thiazolidine-2,4-dione derivatives as aldose reductase inhibitors for treating diabetic complications, that can be represented by the formula: ##STR9## where R.sup.1 =1-8C alkyl or 3-6C cycloalkyl;
None of these references teach or suggest the compounds act as MAO-B inhibitors or that they are useful for treating memory disorders.

Monoamine oxidase-B (MAO-B) inhibitory 5-substituted 2,4-thiazolidinediones useful in treating memory disorders of mammals

The Du Pont Merck Pharmaceutical Company


A portable hand-held data terminal of modular structure includes a base module with a keyboard and a display screen. A data and communications module may be selected from a number of different data and communications modules, each having different types of data communications transceivers, or including in addition data collection devices, such as shelf label readers or bar code readers. The base module includes a microprocessor-controlled data communications and control interface having a predetermined protocol. To adapt the various types of data and communications modules for selection of any one thereof to become attached to the base module and function therewith, each of the data and communications modules includes a microprocessor operable to function as an emulator to interact with the microprocessor of the base module and communicate with the microprocessor of the base module in accordance with the protocol of the data communications and control interface of the base module.

This invention relates generally to data systems and more particularly to data collection and processing systems using portable, hand-held data terminals for collecting, selectively processing and for communicating collected data to other system elements. Typical collection processes may include reading data and manually keying in such read data. Typical automated processes may include scanning indicia of information with a scanner, for example a bar code reader. Data collected by such terminals may become part of the data base of the system. Real time use of data collected by the data terminals may be implemented by communication interfaces within such data terminals.
Though host computers which as central processing stations of such data systems may control data bases and data flow, the hand-held data terminals are key elements for operating the data systems efficiently. Current data systems using hand-held data terminals have shown a correlation between the functionality of the hand-held data terminals and the overall effectiveness of the systems. While progress has already been made in improving efficiency and functionality of hand-held data terminals, there is nevertheless a need to provide hand-held data terminals which are readily adaptable to perform various functions and communicate with a variety of communications equipment.

Hand-held data capture system with interchangeable modules


A method of manufacturing a semiconductor device, comprises the steps of, preparing a silicon substrate having a source region, a drain region, a gate electrode and an SiO.sub.2 film formed on one surface, depositing titanium on the one surface of the silicon substrate by CVD using a high frequency plasma of a low density to form a TiSi.sub.2 layer having a C54 crystal phase, so that the TiSi.sub.2 layer covers the source and drain regions and gate electrode, and a Ti layer covers the SiO.sub.2 film. The Ti layer formed on the SiO.sub.2 film is removed by a selective etching.

The present invention relates to a method of manufacturing a semiconductor device such as an integrated circuit, particularly, to a technique useful for forming an electrode.
In the manufacture of a semiconductor device such as a semiconductor integrated circuit, various treatments such as a film-forming treatment, an etching treatment, and a doping treatment are performed repeatedly to form desired circuit elements on a substrate. When it comes to, for example, an MOS type semiconductor device, source and drain regions are formed by applying a doping treatment to desired surface regions of a silicon substrate to form diffusion layers. Further, for electrically connecting these diffusion layers to wiring layers, an interlayer insulating film covering these source and drain regions are selectively etched to form contact holes, followed by embedding a metal in these contact holes by a film-forming technique.
For improving the characteristics of a semiconductor integrated circuit, it is necessary to lower the sheet resistance of each of the diffusion layers forming the source and drain regions and the gate electrode. A so-called silicide technique, which is intended to lower the sheet resistance, is disclosed in, for example, Japanese Patent Disclosure (Kokai) No. 58-58766. It is disclosed that, after formation of the gate, source and drain regions, the entire surface of a silicon semiconductor substrate is covered with a metal layer having a high melting point, followed by applying an annealing treatment to convert only those portions of the metal layer which cover the gate, source and drain regions into silicide layers. Then, the unreacted metal layer is removed by a selective etching.
The silicide technique includes, for example, a titanium silicide technique in which a TiSi.sub.2 film is formed by self-alignment on the source and drain regions and on the gate electrode in order to lower the sheet resistance on any of the gate electrode and source and drain regions. In the titanium silicide technique, a Ti layer is formed first to cover the entire substrate surface by a sputtering method, followed by annealing the Ti layer at about 650.degree. C. under a nitrogen gas atmosphere. In this step, the part of the Ti layer in direct contact with silicon, i.e., in direct contact with each of the source and drain regions and the gate electrode, carries out reaction with silicon to form a TiSi.sub.2 layer. What should be noted, however, is that the TiSi.sub.2 layer thus formed has a C49 crystal phase having a relatively high resistivity, not a C54 crystal phase having a low resistivity.
In the next step, the unreacted Ti layer is removed by a selective etching, followed by applying a second annealing treatment to the substrate at a high temperature of about 800.degree. C. so as to convert the C49 crystal phase of TiSi.sub.2 into the C54 crystal phase having a low resistivity. If a Ti layer formed on an SiO.sub.2 insulating film is heated to 800.degree. C. or more, the metal Ti reacts with SiO.sub.2, making it difficult to remove the unreacted metal Ti in the subsequent step by a selective etching. To avoid this difficulty, the second annealing treatment is applied after removal of the metal Ti by the selective etching.
The conventional titanium silicide technique outlined above necessitates complex treatments and, thus, involves as many as 4 steps including the final step of the second annealing treatment, leading to a high manufacturing cost of the semiconductor device.
Measures for overcoming the above-noted difficulties are proposed in, for example, Japanese Patent Disclosures Nos. 8-97294 and 7-29713. It is proposed to form a Ti layer by a plasma CVD utilizing an electron cyclotron resonance (ECR), which uses a micro wave, or by a plasma CVD utilizing a helicon wave. This technique permits a Ti layer in direct contact with silicon to perform reaction with silicon so as to form directly a TiSi.sub.2 layer of the C54 crystal phase having a low resistivity without requiring an annealing treatment. However, it is necessary to use a plasma film-forming apparatus of complex structure. In addition, the TiSi.sub.2 layer formed by reaction of the deposited Ti with a silicon layer including a polycrystalline silicon layer is very thin relative to a Ti layer formed on an insulating film such as an SiO.sub.2 film, though the TiSi.sub.2 layer is certainly thicker than the Ti layer. Specifically, a ratio in thickness of the TiSi.sub.2 layer to the Ti layer is only about 2. As a result, a considerably large proportion of the TiSi.sub.2 layer is etched away in the subsequent step of removing the Ti layer by a selective etching. The etching of the TiSi.sub.2 layer results in failure to lower sufficiently the sheet resistance of the diffusion layer, though the particular technique certainly permits decreasing the number of process steps. Since it is required nowadays to achieve further miniaturization by improving the density and degree of integration of a semiconductor integrated circuit, it is strongly required to develop a technique which permits forming a diffusion layer of a low resistivity while decreasing the number of required process steps and, thus, suppressing the manufacturing cost.

Method of manufacturing semiconductor device


A method of manufacturing a patient aid device, such as a walker (W), includes the steps of molding a polymer or plastic connector (60) over first and second metal structural members (22, CB) to maintain the structural members in a first geometrical relationship. After the plastic has cured, the method includes the step of rotating the first structural member or front leg (22) relative to the plastic connector (60) to form an integral hinge without any seam in the plastic. The resultant walker includes front legs (22) hinged via the connectors (60) at opposite ends of the front cross brace (CB). The front leg (22) and rear leg (24) of each side frame (SF1, SF2) of the walker are interconnected by a lower cross brace (40) that has plastic preferably molded about the entire periphery of each leg.

This invention relates generally to a durable product, and more particularly to a foldable product, and finds particular application as a patient aid device such as a walker, and a method of forming same. The invention is particularly applicable to a composite assembly for construction and use with foldable products of this type.
Walkers, in general are well known and are used to assist ambulation and provide additional stability for persons who are, for example, elderly, infirm, have a disability, or are in rehabilitation. Conventional walker designs have four legs in contact with the ground to provide stability, and yet are sufficiently light-weight for ease of use.
Traditionally, these walkers have been fabricated from light-weight hollow or tubular material such as steel, aluminum, etc. It is common to fabricate each side frame so that the first and second legs and a handle portion are formed from a single, unitary bent tubular member, i.e., the inverted U-shaped structure, where the terminal ends define first (front) and second (rear) legs of the structure and the bight portion defines the handle portion. Likewise, it is common to incorporate a handgrip, such as a PVC or closed cell foam pad, that is slid over and provided on a horizontal portion of the side frame assembly. Generally, the first and second side frame assemblies are joined by a front cross brace member(s).
It is also common to employ adjustable height legs that allow the height of the walker to be selectively increased or decreased for customized use. For example, each leg receives a sleeve member formed with a series of longitudinally spaced openings adapted to selectively register with similarly spaced openings formed in the lower ends of the legs. A spring-biased pin is mounted within the lower ends of the legs and biased outwardly through aligned openings in the legs and leg extensions to select the desired height of the adjustable leg. It is also common to mount rubber tips to the ends of the leg extensions to resist slipping and undesired movement.
Collapsible or folding walkers are also generally well-known in the art and fold in a compact manner so that the walker is easily stored or transported during travel. As previously noted, a front cross brace assembly typically spans and interconnects the first and second side frame assemblies. Again, it is common to use a light-weight metal tubular structure because of the desired strength and minimum weight as a cross brace member. Interconnection of the front cross brace member with the side frame assemblies, particularly in a foldable or selectively hinged arrangement, usually requires a large number of components. There is also an attendant cost associated with the labor-intensive steps to manufacture and assemble the foldable walker. For example, one or more metal tubes are bent along their length, and secured to first and second sleeves at opposite ends. Usually the ends of the tubes are notched and bell-mouthed to conform the ends to the sleeves. The sleeves are received over the front legs of respective side frame assemblies. It is necessary to rigidly and securely interconnect the cross brace to the sleeves, for example, through a welding or brazing operation.
A number of latch or locking mechanisms have been developed in the art to allow the side frame assemblies to pivot or rotate into a collapsed or storage position, and likewise to deploy into an open, locked position for use. The following list of patents is not intended to be exhaustive, but is representative of various locking mechanisms: U.S. Pat. Nos. 2,796,911; 3,658,079; 3,688,789; 3,690,652; 3,783,886; 3,993,088; 4,298,016; 4,518,002; 5,188,139; 5,201,333; 5,433,235; 5,529,425; and 5,853,219. As is evident in the prior art, the latching/locking mechanisms are formed from multiple components and thus are also expensive to manufacture and assemble the various components together.
More recently, foldable or collapsible walkers have been developed that incorporate plastic molded components into the assembly. For example, some have developed a plastic front cross brace member, while others additionally include molded side frame assemblies in conjunction with the front cross brace member. Representative patents include D373,555; U.S. Pat. Nos. 5,579,793; 5,862,825; and 6,014,981.
Even with these various designs, a trade-off exists among strength, weight, and cost to manufacture and assemble. Moreover, maintaining the features and benefits available in existing commercially available designs while trying to enhance the product design in one of the other areas is also a particular challenge. Accordingly, a need exists to develop a walker that requires fewer components to manufacture, sub-assemble, and assemble to yield a final product that can be produced at a much lower total cost, while still maintaining the benefits and features of known arrangements.

Foldable durable product, such as a patient aid device or walker, and method of forming same


Triglyceride and other polyol ester PVC plasticizers can be produced by recovery of branched C6 to C9 aldehydes from a hydroformylation product, optional hydrogenation to the alcohol, oxidation to the acid with oxygen and/or air, recovery of the resulting acid, and esterification with glycerol, ethylene glycol, propylene glycol or mixtures thereof. The branched alkyl chains comprise at least 10% methyl branching. Special triglycerides are derived from branched aliphatic acids having alkyl chains with average carbon numbers from 6 to 9 and at least 10% methyl branching. These triglycerides are fast fusing plasticizers if before esterification with glycerol, an aryl acid is introduced together with the aliphatic acids.

Plasticizers are incorporated into a resin (usually a plastic or elastomer) to increase the flexibility, workability, or distensibility of the resin. The largest use of plasticizers is in the production of "plasticized" or flexible polyvinyl chloride (PVC) products. Typical uses of plasticized PVC include films, sheets, tubing, coated fabrics, wire and cable insulation and jacketing, toys, flooring materials such as vinyl sheet flooring or vinyl floor tiles, adhesives, sealants, inks, and medical products such as blood bags and tubing, and the like.
Other polymer systems that use small amounts of plasticizers include polyvinyl butyral, acrylic polymers, poly(vinylidene chloride), nylon, polyolefins, polyurethanes, and certain fluoroplastics. Plasticizers can also be used with rubber (although often these materials fall under the definition of extenders for rubber rather than plasticizers). A listing of the major plasticizers and their compatibilities with different polymer systems is provided in "Plasticizers," A. D. Godwin, in Applied Polymer Science 21st Century, edited by C. D. Craver and C. E. Carraher, Elsevier (2000); pp. 157-175.
Plasticizers can be characterized on the basis of their chemical structure. The most important chemical class of plasticizers is (ortho-)phthalic acid esters, which accounted for about 85% worldwide of PVC plasticizer usage in 2002. However, in the recent past there as been an effort to decrease the use of phthalate esters as plasticizers in PVC, particularly in end uses where the product contacts food, such as bottle cap liners and sealants, medical and food films, or for medical examination gloves, blood bags, and IV delivery systems, flexible tubing, or for toys, and the like. For these and most other uses of plasticized polymer systems, however, a widely accepted substitute for phthalate esters has heretofore not materialized.
One such suggested substitute for phthalates are esters based on cyclohexanoic acid. In the late 1990's and early 2000's, various compositions based on cyclohexanoate, cyclohexanedioates, and cyclohexanepolyoate esters were said to be useful for a range of goods from semi-rigid to highly flexible materials. See, for instance, WO 99/32427, WO 2004/046078, WO 2003/029339, WO 2004/046078, U.S. Application No. 2006-0247461, and U.S. Pat. No. 7,297,738.
However, one of the problems with plasticizers based on esters of cyclohexanoic acid is processability, particularly the fusion characteristics. When a plasticized product is produced, such as a PVC product, the product should reach a temperature at some point during fabrication at which the polymer crystallites are melted. This is called the fusion temperature. In the case of PVC, depending upon the plasticizer, this temperature generally ranges from 160 to 180° C. Plasticizers which are better solvents for a given polymer will fuse at lower temperatures than those that are poorer solvents. Since many plasticized polymer products, such as flexible PVC products, are produced through continuous processes, those faster or stronger solvating plasticizers will arrive at this fusion temperature faster; hence the development of the descriptor "fast fusing" or "faster fusing". These same plasticizers are also known as strong solvating plasticizers. For most applications, the plasticizer reference standard is di-2-ethylhexyl phthalate (DEHP) as this plasticizer has been the most widely used plasticizer world wide since it was commercialized in the late 1930's. Plasticizers which fuse at lower temperatures than that required for DEHP, at the same concentration in a given polymer system, are considered fast fusing plasticizers. Likewise, plasticizers that fuse at higher temperatures than that required for DEHP, at the same concentration in a given polymer system, are considered "slow fusing" plasticizers.
It has been proven to be particularly difficult to identify, develop and commercialize a widely accepted fast fusing plasticizer substitute for phthalate esters. Fast fusing plasticizers are defined in more detail further in this document.
Fast fusing plasticizers are valued in the production of many flexible articles, particularly flexible PVC articles. See, for instance, U.S. Pat. No. 7,297,728. Fast fusing plasticizers based on non-phthalates are also known. For instance, the present inventors have recently described, along with others, fast fusing plasticizers based on cyclohexanoic acid esters of C4-C7 secondary alcohols (see copending application PCT/US2008/080891, filed Oct. 23, 2008), plasticizers based on cyclohexanoic acid esters of C7-C12 secondary alcohols (see copending application PCT/US2008/080893, filed Oct. 23, 2008), and also coplasticizer systems based on cyclohexanoic acid esters and non-phthalate fast fusing plasticizers. See also U.S. Pat. No. 7,323,588.
Other suggested substitutes for phthalates as plasticisers include esters based on benzoic acid (see, for instance, U.S. Pat. No. 6,740,254 or WO 2006/077131) and polyketones, such as described in U.S. Pat. No. 6,777,514; and also in WO 2008/121847. Epoxidized soybean oil, which has much longer alkyl groups (C16 to C18) has been tried as a plasticizer, but is generally used as a PVC stabilizer. Stabilizers are used in much lower concentrations than plasticizers.
Typically, the best that has been achieved with substitution of the phthalate ester with an alternative material is a flexible PVC article having either reduced performance or poorer processability. Thus, heretofore efforts to make phthalate-free plasticizer systems for PVC have not proven to be entirely satisfactory, and this is still an area of intense research.
Triglycerides produced from branched C6 to C9 acids have been studied in the past, but primarily in other technical fields and the studies have been rather limited in scope. W. Keil, in "Zur Kenntnis der Fette aus Fettsäuren mit ungerader Kohlenstoffatomzahl", Hoppe-Seyler's Zeitschrift für Physiologische Chemie, vol. 282, 1947, pages 137-142 studied the metabolites of a triglyceride of 2-propyl pentanoic acid and of 3-propyl hexanoic acid when fed to dogs, by urine analysis. A. Aydin et al., in "The synthesis of mono- and triglycerides of branched fatty acids and physical properties of the synthesized glycerides.", Chimica Acta Turcica, vol. 5, 1977, pages 93-101, determined physical properties of 2-ethyl hexanoic acid and of 2-propyl hexanoic acid, and predicted usefulness of such triglycerides in numerous future applications in various fields of industry, more specifically in textile industry as softening material in sanforization, i.e. a mechanical shrinking process for fabrics before these are manufactured into articles such as clothing, in cosmetic formulations and in the food industry.
Polyol esters of branched C6 to C9 acids are known as lubricants and lubricant components. A. D. Godwin et al. in U.S. Pat. No. 6,307,093 disclose in col. 12 as useful in this field the esters of branched C9 acids with pentaerythritol, di(pentaerythritol), tri(pentaerythritol); trimethylolethane, trimethylolpropane, trimethylolbutane, and dimers and trimers thereof, and neopentylglycol.
Plasticizers based on triglycerides have been tried in the past, based on natural triglycerides from various vegetable oils. The alkyl groups on these natural triglycerides are linear, and the products can be incompatible when the alkyl chain is too long.
"Structural Expressions of Long-Chain Esters on Their Plasticizing Behavior in Poly(vinyl Chloride)", H. K. Shobha and K. Kishore, Macromolecules 1992, 25, 6765-6769, reported the influence of branching and molecular weight in long-chain esters in PVC. Triglycerides (TGE's) having linear alkyl groups were studied.
"A Method for Determining compatibility Parameters of Plasticizers for Use in PVC Through Use of Torsional Modulus", G. R. Riser and W. E. Palm, Polymer Engineering and Science, April 1967, 110-114, also investigate the use of triglycerides and their plasticizing behavior with PVC, including tri-iso-valerin (3-methyl butanoate) triglyceride. It was reported that "these materials have volatilities that are much too high for good long-time permanence".
Nagai et al. in U.S. Pat. No. 5,248,531, teaches the use of articles comprising vinyl chloride-type resins (among others) using triglyceride compounds as a hemolysis depressant, and also comprising 10 to 45 wt % of plasticizers selected from trialkyl trimellitates, di-normal alkyl phthalates, and tetraalkyl pyromellitates. The alkyl chains of the acid moiety R1-R3 in the structure below, formula (I), are independently an aliphatic hydrocarbon group of 1 to 20 carbon atoms and in embodiments at least one of the alkyl chains is branched. One specific triglyceride disclosed is glyceryl tri-2-ethylhexanoate, having the following formula (I).

Zhou et al. discloses, in U.S. Pat. Nos. 6,652,774; 6,740,254; and 6,811,722; phthalate-free plasticizers comprising a mixture of different triesters of glycerin, formed by a process of esterifying glycerin with a mixture comprising a mixture of alkyl acids and aryl acids. A triglyceride ester produced from a 50/50 mixture of 2-ethyl-hexanoic acid and benzoic acid is exemplified. It was found to be compatible with PVC resin, while glyceryl tribenzoate and glyceryl tri(2-ethyl)hexanoate are stated in paragraph [0020] to be known as being incompatible in such resin.
Nielsen et al., in U.S. Pat. No. 6,734,241, teach a composition comprising a thermoplastic polymer as in formula (I) above, wherein at least one of the R groups is a short alkyl group having from 1-5 carbon atoms and at least one of the R groups is a saturated branched alkyl group having from 9 to 19 carbon atoms and also having a hydrophilic group.
U.S. Pat. No. 6,740,254 mentions plasticizer esters based on C4 and benzoic acids.
However, the prior art has not recognized the advantages of using esters, including triglycerides, based on polyols together with particularly selected branched alkyl acids as plasticizers, and in combination with aryl acids as fast fusing plasticizers. The latter may be used with other slower fusing plasticizers in plastics systems. It was stated already hereinbefore that the TGE of 2-ethyl hexanoic (2EH) acid has a problem of compatibility with PVC. A particular problem with esters from alkyl acids having an ethyl branch on the second carbon is a toxicity concern. An ester, when introduced into a living organism such as a human or an animal, may become at least partly hydrolysed. The ester hydrolysis liberates the acid. When the ester comprises high amounts of the 2-ethyl hexyl moiety on the acid alkyl group, 2-ethyl hexanoic acid is liberated in significant amounts in the living organism, which is undesirable because of the toxicity concern associated with this specific acid (Manninen et al, 1989, Archives of Toxicology 63(2), pages 160-1). This effect may be attributed to the specificity of the ethyl branch on the second carbon, and the concern may therefore also relate to other acids having that branch in that location.
Among the problems presented by the aforementioned triglycerides is they cannot be made conveniently and thus generally are quite expensive and/or are specialty chemicals not suitable as replacements for phthalates from an economic standpoint and/or are not as compatible with the range of polymer systems that phthalates are compatible with, and thus are not viable general purpose replacements for phthalates from a physical property standpoint.
For instance, some synthesis methods involve at least two separate steps, such as where the glycerol is first partially esterified with the C10 to C20 branched chain acyl group and then reacted with acetic acid or acetic anhydride.
Other syntheses involving mixed acid feeds will require addition of a hydrocarbon solvent for azeotropic distillation of the water to drive the esterification reaction to completion (as measured by the hydroxyl number of the ester, which is a measure of the amount of unreacted OH groups), due to the spread in boiling points between the mixed acids. In addition, the use of mixed acid feedstock such as cited in Zhou et al. and in Nielsen et al. can increase the process complexity when recycling unreacted acids.
Triglycerides based on acids derived from natural products will be limited to naturally occurring linear alkyl groups with even carbon numbers, which offer very little flexibility in designing an appropriate plasticizer system for a given polymer system.
Thus what is needed is a method of making a general purpose non-phthalate plasticizer having high throughput and providing a plasticizer having suitable melting or pour point, increased compatibility, good general purpose performance and low temperature properties.
The present inventors have surprisingly discovered that triglyceride and or glycol esters, produced by esterification of glycerol, ethylene glycol or propylene glycol with acids derived from the hydroformylation of olefins and subsequent oxidation of the oxygenate to a branched C6 to C9 acid, provide for polyol esters having appropriately branched alkyl groups for providing compatibility with a wide variety of resins and which are obtainable with a high throughput. Esterification of glycerol using an acid mixture with a narrow carbon number range eliminates many of the aforementioned problems, and enables high yield of the glycerol triesters to be obtained, having low residual hydroxyl numbers.

This patent is subject to a terminal disclaimer.

Polyol ester plasticizers and process of making the same


A rotor blade for a turbine of a combustion turbine engine having an airfoil that includes a pressure and a suction sidewall defining an outer periphery and a tip portion defining an outer radial end. The tip portion includes a rail that defines a tip cavity. The airfoil includes an interior cooling passage configured to circulate coolant. The rotor blade further includes: a slotted portion of the rail; and at least one film cooling outlet disposed within at least one of the pressure sidewall and the suction sidewall of the airfoil. The film cooling outlet includes a position that is adjacent to the tip portion and in proximity to the slotted portion of the rail.

The present application relates generally to apparatus and systems for cooling the tips of gas turbine rotor blades. More specifically, but not by way of limitation, the present application relates to the configuration of rotor blade tip rails that enhance cooling performance.
In a gas turbine engine, it is well known that air is pressurized in a compressor and used to combust a fuel in a combustor to generate a flow of hot combustion gases, whereupon such gases flow downstream through one or more turbines so that energy can be extracted therefrom. In accordance with such a turbine, generally, rows of circumferentially spaced rotor blades extend radially outwardly from a supporting rotor disk. Each blade typically includes a dovetail that permits assembly and disassembly of the blade in a corresponding dovetail slot in the rotor disk, as well as an airfoil that extends radially outwardly from the dovetail.
The airfoil has a generally concave pressure side and generally convex suction side extending axially between corresponding leading and trailing edges and radially between a root and a tip. It will be understood that the blade tip is spaced closely to a radially outer turbine shroud for minimizing leakage therebetween of the combustion gases flowing downstream between the turbine blades. Maximum efficiency of the engine is obtained by minimizing the tip clearance or gap such that leakage is prevented, but this strategy is limited somewhat by the different thermal and mechanical expansion and contraction rates between the rotor blades and the turbine shroud and the motivation to avoid an undesirable scenario of having excessive tip rub against the shroud during operation.
Because turbine blades are bathed in hot combustion gases, effective cooling is required for ensuring a useful part life. Typically, the blade airfoils are hollow and disposed in flow communication with the compressor so that a portion of pressurized air bled therefrom is received for use in cooling the airfoils. Airfoil cooling in certain areas of the rotor blade is quite sophisticated and may be employed using various forms of internal cooling channels and features, as well as cooling outlets through the outer walls of the airfoil for discharging the cooling air. Nevertheless, airfoil tips are particularly difficult to cool since they are located directly adjacent to the turbine shroud and are heated by the hot combustion gases that flow through the tip gap. Accordingly, a portion of the air channeled inside the airfoil of the blade is typically discharged through the tip for the cooling thereof.
It will be appreciated that conventional blade tip design includes several different geometries and configurations that are meant to prevent leakage and increase cooling effectiveness. Exemplary patents include: U.S. Pat. No. 5,261,789 to Butts et al.; U.S. Pat. No. 6,179,556 to Bunker; U.S. Pat. No. 6,190,129 to Mayer et al.; and, U.S. Pat. No. 6,059,530 to Lee. However, conventional blade tip cooling designs, particularly those having a "squealer tip" design, have certain shortcomings, including the inefficient usage of compressor bypass air, which reduces plant efficiency. As a result, an improved turbine blade tip design that increases the overall effectiveness of the coolant directed to this region would be highly desired.

Cooling structures for turbine rotor blade tips


Seismic systems and methods are provided to synchronize both source and receiver data using inexpensive timers and/or low energy timers to obtain high resolution seismic data.

Seismic surveys image or map the subsurface of the earth by imparting acoustic energy into the ground and recording the reflected energy or "echoes" that return from the rock layers below. The source of the acoustic energy can be generated by explosions, air guns vibrators, and the like. The energy source is positioned on or near the surface of the earth. Each time the energy source is activated it generates a seismic signal that travels into the earth, is partially reflected, and, upon its return, may be detected at many locations on the surface as a function of travel time. The sensors used to detect the returning seismic energy commonly include geophones, accelerometers, and hydrophones. The returning seismic energy is recorded as a continuous signal representing displacement, velocity, acceleration, or other recorded variation as a function of time. Multiple combinations of energy source and sensor can be subsequently combined to create a near continuous image of the subsurface that lies beneath the survey area. One or more sets of seismic signals may be assembled in the final seismic survey.
Technology continues to increase resolution and complexity of seismic systems such as high fidelity vibroseis seismic acquisition including ZENSEIS™. Vibroseis is a method used to propagate energy signals into the earth over an extended period of time as opposed to the near instantaneous energy provided by impulsive sources. The data recorded through vibroseis must be correlated to convert the extended source signal into an impulse. The source signal using this method was originally generated by a servo-controlled hydraulic vibrator or shaker unit mounted on a mobile base unit, but electro-mechanical versions have also been developed. Signals transmitted through the earth are reflected and analyzed to identify changes in signal. The exact distance the vibrations travel before being reflected are unknown and the transmission rates of the vibrations through different features is unknown, thus the time from transmission of the signal to recordation of the seismic signal is the only direct measure of distance. The exact time is additionally required to extract phase data when more than one vibroseis or other vibrational source is operated simultaneously.
Global Positioning Systems (GPS) are currently used by military and civilians to accurately determine location, direction and rate of movement, as well as time. GPS systems have been used by seismic operators to accurately place source and sensors during seismic surveys and to provide an accurate time for a GPS survey as a single source of time. Other methods are then used to synchronize time between a central recorder, source, and receivers. These methods include high-precision microsecond time recorders, accurate radio-pulse transponders and receivers, as well as other methods of high accuracy time synchronization. Radio-pulse synchronization requires radio communication with a large number of source and autonomous sensors, requires a powered receiver at each sensor, and a very accurate clock or GPS timing device to obtain microsecond precision among all of the integrated devices required for seismic surveying.
Bassett, U.S. Pat. No. 3,972,019, describes accurate timing at distant points where each unit produces synchronized time pulses at time intervals which are the same in the different units and methods for synchronizing the units by direct connection with each other.
Siems and Porter, U.S. Pat. No. 4,281,403, describe a decentralized seismic data recording system including a central station and a plurality of remote seismic recording units. A master clock is provided in the central station. A local clock is provided in each remote recording unit. At the beginning of a work period, the local clocks are synchronized with the master clock. Thereafter, a plurality of seismic data recordings is made. At the end of a work period, the time difference due to tuning drift between the master clock and each respective local clock is ascertained and is recorded. The time difference is linearly prorated over the recordings made during the work period, thereby synchronizing the time base of each seismic data recording with the master clock.
Kostelnicek and Montes, U.S. Pat. No. 4,879,696, describe a method for initiating seismic data storage in an Isolated Distributed Recording System, identifying correlation between a "correlation" signal and a refracted seismic signal containing the correlation signal. Triggering the isolated distributed recorder to store incoming seismic data when the correlation signal is identified. Time Synchronization Systems may be employed that include an accurate clock or other similar timing device at the central station, and each isolated distributed recorder would also have an equally accurate timing device or "local" clock in relationship with the timing device at the central station. Usually, the local clocks are synchronized with the clock at the central station prior to the initiation of active seismic exploration activities.
Reed, et al., U.S. Pat. No. 4,885,724, describe a cableless seismic digital recording system which records seismic-trace data generated by any type of seismic source, including high energy impulsive seismic sources and low energy surface seismic sources such as vibrators. A seismometer is connected to a remotely deployed radio-controlled portable recorder which contains circuitry for sampling, digitizing, processing, storing, and recording seismic-trace data. Coded radio signals instruct each recorder to commence an operation or sequence of operations from a predetermined set of programmed instructions stored in program read only memory included in each recorder. Such operations include seismic-trace data acquisition; optional weighting and vertical stacking; normalization; recording; and seismic source initiation (abstract and p. 8, 1.25-33).
Norris, U.S. Pat. No. 6,002,339, synchronizes seismic event data using a programmable subsystem with an independent timer that can be zeroed, time transmitted with a set of instructions, and the timer can be reset when the instructions are complete. The timer is activated in response to the event and is reset following completion of the event.
Harmon, U.S. Pat. No. 6,002,640, describes use of a Series of nearly Identical Seismic Shots (SISS) to generate a system synchronization signal and instruct remote units. The timing and information contained in the SISS can be used to synchronize and communicate with the data acquisition unit(s).
Iseli, et al., U.S. Pat. No. 7,012,853, describes a method of seismic data acquisition, comprising: a) sensing acoustic energy with a plurality of sensors, each sensor providing an output indicative of the sensed energy; b) collecting a plurality of time samples of each sensor output; c) forming one or more data packets with the collected plurality of time samples: d) adding one or more characterizing bits to the data packets, the characterizing bits representing the time of only the first time sample within the data packet; e) storing the data packets in predetermined memory locations in a field unit; and f) transmitting the data packets. A synchronizing signal is included in the data packets.
Longaker, WO0116622, describes a method and apparatus for controlling vibroseis sources in survey operations. A wireless local area network establishing a communications link among vibroseis sources operating in a group may enable the group to operate independent of a remote control unit and may also provide a distributed system solution that mitigates communication difficulties between the sources and the remote control unit.
Current systems require contact, either radio or direct contact, before, during, and after the seismic survey to synchronize various parts of the system and accurately decode the information encoded in the seismic data. The systems described above use a radio pulse, pre- and post-survey synchronization, a high precision microsecond clock, or other method to synchronize the various independent recorders with the source and central recorder. The receivers, high precision time instruments, and coordinated communications described require expensive and energy intensive equipment. This is not always convenient or possible if multiple seismic measurements are required, when one or more sources or receivers are inaccessible, or when the system is dispersed over a large area.
The industry is plagued with system failures, bulky wiring systems, and lost data due to failures in timing and communication. Current systems do not provide an inexpensive and accurate method to synchronize multiple independent systems used for seismic surveys and record sufficient data to obtain a high resolution image of the geological structures. What is required are inexpensive and simple methods to synchronize equipment for seismic surveys.

Practical autonomous seismic recorder implementation and use


In a surface emitting laser element, on a substrate whose normal direction of a principal surface is inclined, a resonator structural body including an active layer, and a lower semiconductor DBR and an upper semiconductor DBR sandwiching the resonator structural body are stacked. A shape of a current passing through region in an oxide confinement structure of the upper semiconductor DBR is symmetrical to an axis passing through a center of the current passing through region parallel to an X axis and symmetrical to an axis passing through the center of the current passing through region parallel to a Y axis, and a length of the current passing through region is greater in the Y axis direction than in the X axis direction. A thickness of an oxidized layer surrounding the current passing through region is greater in the −Y direction than in the +X and −X directions.

1. Technical Field
This disclosure generally relates to a surface emitting laser element which emits laser beams in a direction perpendicular to a surface of a substrate of the surface emitting laser element, a surface emitting laser array in which the surface emitting laser elements are arrayed, an optical scanning device using the surface emitting laser element or the surface emitting laser array, and an image forming apparatus using the optical scanning device.
2. Description of the Related Art
A VCSEL (vertical cavity surface emitting laser) emits laser beams in a direction perpendicular to a surface of a substrate of the VCSEL and has low cost, low current consumption, a small size, and high efficiency, and is suitable for a two-dimensional device, when the VCSEL is compared with an edge emitting laser. Therefore, the VCSEL has been greatly researched.
As application fields of the VCSEL, there are a light source of an optical writing system of a printer (oscillation wavelength is in a 780 nm band), a writing light source of an optical disk device (oscillation wavelength is in a 780 nm band and a 850 nm band), a light source of an optical transmission system using an optical fiber, for example, a LAN (local area network) (oscillation wavelength is in a 1.3 μm band and a 1.5 μm band). In addition, the VCSEL has been expected to be used as a light source between boards, inside the board, between chips in an LSI (large scale integration), and inside the LSI.
In the application fields of the VCSEL, in many cases, a laser beam output from the VCSEL (hereinafter in some cases referred to as an output laser beam) is required to be that a polarization mode of the output laser beam is constant and a cross sectional shape of the output laser beam is a circle.
With respect to control of the polarization mode, in manufacturing of a VCSEL using a substrate (non-inclined substrate) whose principal surface is a (100) surface, a current passing through region (current channel region) has an anisotropic shape (for example, see Patent Documents 1 though 3).
In addition, the polarization mode is controlled by using a so-called inclined substrate (see Patent Document 4 and Non-Patent Document 1).
Further, with respect to the cross sectional shape of the output laser beam, the shape of the current passing through region is determined to be a circle or a square by adjusting a column shape (mesa shape) of a resonator structural body (see Patent Document 5).
However, when the current passing through region has the anisotropic shape, it is difficult for the cross sectional shape of the output laser beam to be a circle. In addition, when an inclined substrate is simply used, the shape of the current passing through region becomes asymmetrical (see FIG. 27A), and it is difficult for the cross sectional shape of the output laser beam to be a circle. In FIG. 27B, a current passing through region whose shape is symmetrical for two axes is shown.
[Patent Document 1] Japanese Unexamined Patent Publication No. H9-172218
[Patent Document 2] Japanese Patent No. 2891133
[Patent Document 3] Japanese Unexamined Patent Publication No. 2008-28424
[Patent Document 4] Japanese Patent No. 4010095
[Patent Document 5] Japanese Patent No. 3762765
[Non-Patent Document 1] T. Ohtoshi, T. Kuroda, A. Niwa, and S. Tsuji "Dependence of optical gain on crystal orientation in surface emitting lasers with strained quantum wells", Appl. Phys. Lett. 65(15), pp. 1886-1877, 1994
The inventors of the present invention have studied a relationship between a shape of a current passing through region, and a polarization suppression ratio and a radiation angle of an output laser beam in detail by manufacturing a surface emitting laser element having an inclined substrate. Then, the inventors have newly found the following. That is, in some cases, it is difficult for a cross sectional shape of an output laser beam to be a circle, by only causing the shape of the current passing through region to be a circle or a square.
The inventors have studied the reasons of the above results in detail and have newly found that the thickness of an oxide surrounding the current passing through region greatly influences the radiation angle of the output laser beam when an inclined substrate is used.

Surface emitting laser element, surface emitting laser array, optical scanning device, and image forming apparatus


Wafer test control and methodologies are provided for resuming the probing of a wafer, in connection with random, distributed or statistical wafer probing. The resumption of testing may occur after an interruption of a previous probe of the wafer and removal of the wafer from a testing chuck. Parameter settings are retained in addition to probe results from the previous wafer probe session in order to construct a resume probe map according to applicable probing rules and conditions. Wafer probing may be restarted according to the resume probe map.

An array of die, which may include integrated circuits and their components, may be supported on a wafer during various semiconductor fabrication processes. At various stages during fabrication processes, it may be desirable to perform testing on the die to read information from the die, write information to the die, or otherwise gather information about various die and components on various die. During testing, a probe map is downloaded to a prober which is used by the prober to position the wafer to sequentially align die on the wafer with testing equipment.
Although it is generally desirable to test die on the wafer in a single pass, or probing session, in certain situations, a probing session may be aborted before all of the intended die for testing on the wafer are tested. For example, a single probing session may require several hours of testing time. If a lot of higher priority wafers is received in the fabrication facility, a probing session of a lower priority wafer already underway may be aborted in favor of testing the lot of higher priority wafers. In such a case, an operator of the probing and testing equipment may manually abort the probing session of the lower priority wafer. In other examples, a probing session may be automatically aborted in connection with the occurrence of an unplanned event such as a test program crash. Regardless of the cause, when a probing session is aborted, the time spent performing the probing session and the data gathered from the probing session are lost. A later probing session requires the retesting of any already probed die on the wafer to regenerate the lost data. Because each probing session of a wafer results in wear to each die tested on the wafer, multiple probing sessions performed on the same areas of a wafer may degrade the integrity of the wafer.
A wafer testing system may intelligently probe a wafer based on a generated map, a probe map, incorporating previous probe passes to influence which die need to be tested, retested or excluded from test. The probe map sets forth, among other things, the locations, on a wafer, to be probed. The system also has the ability to resume from an aborted probe by saving probed data, collected prior to an abort, in a database. This data can be recalled at a later time to generate a resume map. The resume map is the original probe map minus the devices already tested. Currently, most wafer probing systems involve testing all of the die on a wafer.
For wafer test systems involving tests of less than all die on a wafer, resuming testing presents a challenge since data placed in a database from previous test on an incomplete testing run abort is lost. With existing systems, the aborted partial data in the database will need to be removed and the entire die testing run for the wafer must start from the beginning. Consequently, all testing prior to the abort is wasted, providing no information to properly resume testing after an abort. Data concerning the random map generated for wafer probing and the multiple iterative probing possibly used in testing is lost during the abortion of the test.
Based on the foregoing, there is a need in the art to develop a method and system enabling a successful testing of die after an aborted wafer probe which will accommodate die testing, according to a statistical testing distribution, of less than all die on a production lot of wafers


A novel foldable display device or an electronic device using the same, a portable information processor or a portable communication information device, is provided. A foldable display device of which a display panel can be folded n times (n≧1, and n is a natural number) at a curvature radius of greater than or equal to 1 mm, and less than or equal to 100 mm is obtained. The display device can be miniaturized by being foldable. In addition, in the state where the flexible display panel is opened, display which is unbroken and continuous over a plurality of housings is possible. The plurality of housings can store a circuit, an electronic component, a battery and the like inside as appropriate, and the thickness of each housing can be small.

The social infrastructures relating to means for transmitting information have advanced. This has made it possible to acquire, process, and send out many pieces and various kinds of information with the use of an information processor not only at home or office but also at other visiting places.
Under the circumstance, portable information processors such as a smartphone, a tablet, and a phablet are under active development. For example, an electronic device using a flexible display panel has been known (Patent Document 1). In addition, a multi-panel electronic device has been known (Patent Document 2).

Display device and manufacturing method thereof

Semiconductor Energy Laboratory Co., Ltd.


An EBA system is provided which includes a primary source of pressurized air, a secondary source of pressurized air, hoses leading the primary and secondary sources of pressurized air to an EBA valve, and two hoses for directing pressurized air to the interior of a protective suit for over-pressurization and to a mouthpiece of a user. The valve is constructed and arranged to operate under two modes of operation, in one of which air from the primary air source is directed to an over-pressurization hose and an inhalation hose while air from the secondary air source hose is blocked, and a second mode in which air from the secondary or auxiliary supply is directed to the inhalation hose but not to the pressurization hose.

The present invention is directed to an emergency breathing apparatus of the type which includes a protective suit, first and second sources of air, and a valve for selectively directing the air from either of the first and second air sources to an inhalation orifice of the protective suit. A wearer of the protective suit is normally supplied air from the first air source through a relatively long (100 feet) hose or conduit, but should the latter rupture, a valve can be manually operated to cut-off the air flow to the valve from the first hose and cut-in air from the second air source, such as a compressed air tank, to the inhalation orifice of the protective suit. Accordingly, should the first hose to the first air source break or rupture, the secondary air source provides the user a sufficient time period (10 to 30 minutes) to complete whatever might be the task assigned and/or leave the area before the secondary air source has been depleted.


A sprayable zinc oxide composition is provided. The sprayable zinc oxide composition can be used in the treatment of various skin conditions. The sprayable zinc oxide composition includes zinc oxide particles and a fluoro-olefin propellant. The present inventors have found that by selecting a propellant having a certain specific gravity, vapor pressure, and molecular weight, and by controlling the viscosity of the various components of the composition, the resulting zinc oxide composition resists settling such that a substantially homogeneous distribution of zinc oxide particles is maintained and can be evenly sprayed onto a surface without running once applied.

Much of the population has experienced a skin condition such as a rash, pressure ulcer, or a wound such as a cut or first degree burn, that has required topical application of a cream or ointment to assist in the healing process. Often, these conditions are more prevalent in infants, the elderly, and infirm. For instance, infants, the elderly, and infirm can be susceptible to developing incontinent dermatitis, which occurs when the skin is exposed to prolonged wetness, increased skin pH caused due to contact with urine and feces, and the resulting breakdown of the stratum corneum, or the outermost layer of the skin. Meanwhile, pressure ulcers, also known as decubitus ulcers or bedsores, are also a concern. Pressure ulcers are localized injuries to the skin and/or underlying tissue that usually occur over a bony prominence as a result of pressure, or pressure in combination with shear and/or friction. The most common sites are the sacrum, coccyx, heels or the hips, but other sites such as the elbows, knees, ankles or the back of the cranium can be affected. Pressure ulcers occur due to pressure applied to soft tissue resulting in completely or partially obstructed blood flow to the soft tissue. Factors that can contribute to the formation of ulcers include protein-calorie malnutrition, microclimate (skin wetness caused by sweating or incontinence), diseases that reduce blood flow to the skin, such as arteriosclerosis, or diseases that reduce the sensation in the skin, such as paralysis or neuropathy.
The aforementioned conditions, and other skin conditions, can be prevented or treated, for instance, by the application of zinc oxide to the affected area of the skin. Zinc oxide can help speed up the wound healing process and can also limit the skin's exposure to excessive moisture. As such, one approach for treating these skin conditions is to block moisture from reaching the skin, such as by the application of oil-based protectants or barrier creams, including various over-the-counter creams or ointments containing zinc oxide, to the affected area. However, if the skin is not thoroughly dry, some of these oil-based protectants and creams can actually seal the moisture inside the skin rather than outside the skin. Further, such protectants and creams are very viscous and can be greasy, resulting in difficulty in removing the protectants and creams from one's hands after application onto the affected area of the skin. In addition, rubbing these products into the skin can cause additional discomfort or pain, and in the event that a caretaker or healthcare provider must apply the product to a patient, this could lead to embarrassment for both the patient and caretaker depending on the location of application.
As such, a need exists for a composition that can provide a sufficient moisture barrier without the risk of sealing moisture inside the skin and that can be more easily applied without causing discomfort. One approach is to use a treatment composition in conjunction with a propellant to create an aerosol spray composition. However, the high viscosity of the resulting aerosol spray composition means that it is often difficult to formulate the composition into a medium that can be sprayed due to issues with clogging of the valves and nozzle in the dispenser. Further, many propellants have too high of a vapor pressure, which could result in an erratic spray or stream of product that is not evenly controlled, meaning that applying a smooth, even coating of the aerosol spray composition to the area of the skin requiring treatment cannot be achieved.
Still another problem associated with the aforementioned sprayable compositions is that the particulate ingredients of the sprayable compositions, such as zinc oxide, often settles to the bottom of the container in which the sprayable composition is stored, resulting in settling of the composition and caking of the product in the container. In addition, many sprayable compositions have a low viscosity to allow for spraying, but this results in compositions that are not viscous enough when applied to the skin's surface, resulting in a runny product that does not evenly coat or effectively contact the skin.
As such, a need exists for a sprayable zinc oxide composition containing zinc oxide particles that remain substantially homogeneously distributed and that can be evenly sprayed onto the skin as a fine mist.

Sprayable composition containing zinc oxide and a fluoro-olefin propellant


A method and an apparatus to provide a personalized page to a user have been disclosed. In one embodiment, a user is identified as a member of a first group and a member of a second group. The first group's level of interest (LOI) in a first item is identified, as well as the second group's LOI in a second item. The user's LOI in at least one of the first and the second items is identified.

With the increasing use of the Internet, lots of information becomes available on the Internet. Some of the information is interesting to a user while some of the information is of little value to the user. Conventionally, users can use online search engines to search for specific information the users are interested in. Typically, the users search for the specific information because the users need such information. However, there is some information potentially interesting to the users but the users may not need the information. Sometimes, the users may not even be aware of the existence of such information on the Internet. Thus, the users probably do not actively search for this information on the Internet.
Currently, some online service providers and/or individuals provide pages of interesting items. In the description herein, items include a variety of information available on the internet, such as news articles, websites, products, etc. For example, there are currently pages of most searched queries, pages of most viewed news stories, blogs created by individuals on specific topics, etc. In general, the items on these pages are typically chosen based on the interest in these items among the general population. Furthermore, these pages are typically accessible by the general public. Although these pages and blogs may include some items that may be potentially interesting to a user, these pages and blogs are also likely to include a lot of items that the user may not care about at all. Hence, the user may not keep coming back to visit these pages.

Method and an apparatus to provide a personalized page