A MEMS apparatus comprising composite vibrating unit and the manufacturing method thereof are disclosed. The vibrating unit includes a stiffness element on which a first material is disposed. A second material being a conductive material is disposed on the first material and is extended to the stiffness element to remove electric charge on first material. When a temperature is changed, a variation direction of a Young's modulus of the first material is opposite to a variation direction of a Young's modulus of the stiffness element. The unique attributes above allow vibrating unit of the MEMS apparatus such as resonator and gyroscope to have stable resonance frequency against the change of temperature.

Owing to the development of electronic products, such as smart phones, tablet computers, and motion sensing gaming machines, and integration of electronic products, wireless communication, and broadband network, micro-electro-mechanical-system (MEMS) inertial sensors, e.g. accelerometer, gyroscope, and oscillator, became extensively used in these electronic products and the demand for MEMS inertial sensors has increased significantly in these years. The environments where the MEMS inertial sensors are used are subject to significant temperature change. The current trend is to develop an MEMS inertial sensor adaptable to different environment temperatures.
FIG. 1A is a simplified schematic view of a vibrating unit of an accelerometer. FIG. 1B is a simplified schematic view of a vibrating unit of an oscillator. Referring to FIG. 1A and FIG. 1B, these MEMS inertial sensor may be simplified as a vibrating unit composed of a flexure and a mass.
The resonance frequency of the vibrating unit can be obtained by the following equation:
  f  =            1                        2                                                              π                                        k        m            wherein f represents the resonance frequency of the vibrating unit, k represents the stiffness of the stiffness element, and m represents the mass of the mass. That is, the resonance frequency of the vibrating unit is determined by two important factors, i.e. the stiffness of the stiffness element and the mass of the mass.
The definition of the stiffness element is specified below. Among the elements of the vibrating unit, one can be defined as the stiffness element if the stiffness thereof is a critical factor for determining the resonance frequency of the vibrating unit. More specifically, in the aforementioned equation for calculating the resonance frequency of the vibrating unit, the stiffness parameter (k) is determined by the stiffness element.
Thus, in the accelerometer of FIG. 1A, the vibrating unit 10 is composed of a flexure 12 (spring) and a mass 14. The resonance frequency of the vibrating unit 10 is mainly determined by the stiffness of the flexure 12 and the mass of the mass 14. Therefore, in the accelerometer of FIG. 1A, the flexure 12 can be defined as the stiffness element.
In the oscillator of FIG. 1B, the vibrating unit 10a is a beam-shaped mass 12a and the resonance frequency of the vibrating unit 10a is mainly determined by the stiffness of the beam-shaped mass 12a and the mass of the beam-shaped mass 12a. Therefore, in the oscillator of FIG. 1B, the beam-shaped mass 12a can be defined as the stiffness element.
It can be known from the above that the stiffness of the stiffness element has a significant effect on the resonance frequency of the vibrating unit. The material properties, e.g. Young's modulus, of the stiffness element of the conventional MEMS inertial sensor are subject to change with the temperature, which may change the stiffness of the stiffness element and the resonance frequency of the vibrating unit, and consequently cause the obtained sensing value to be inaccurate. A variation of the Young's modulus due to temperature change may be represented by a temperature coefficient of Young's modulus (TCE). More specifically, the temperature coefficient of Young's modulus (TCE) may be defined as: the variation of the Young's modulus in a temperature unit.
FIG. 2 is a diagram showing the variation of a resonance frequency of a vibrating unit under different temperatures. When the resonance frequency of the vibrating unit changes with the change of temperature, the degree of change of the resonance frequency may be represented by a temperature coefficient of frequency (TCf), as shown in FIG. 2. Likewise, the temperature coefficient of frequency (TCf) may be specifically defined as: the variation of the resonance frequency in a temperature unit. When the resonance frequency of the vibrating unit does not change with the temperature, the temperature coefficient of frequency (TCf) of the vibrating unit is 0, which is called zero TCf.
FIG. 3 is a simplified schematic view of a micro-electro-mechanical-system (MEMS) resonator. Referring to FIG. 3, a stiffness element 22 of the MEMS resonator 20 is a beam-shaped mass. The stiffness element 22 is connected to an anchor 26 by a flexure 24 and driven by a driving electrode 28a to generate a periodical oscillation. When the beam-shaped mass reaches the state of resonance, the beam-shaped mass has the greatest amplitude of oscillation and the sensing electrode 28b senses the biggest voltage change, and the MEMS resonator 20 outputs the frequency of the measured voltage change as a clock signal. At the same time, the material properties, e.g. Young's modulus, of the stiffness element 22 change with the temperature, which changes the stiffness and the resonance frequency of the stiffness element 22 (beam-shaped mass). Consequently, the clock signal also changes with the temperature.
FIG. 4 is a simplified schematic view of a micro-electro-mechanical-system (MEMS) accelerometer. Referring to FIG. 4, when an MEMS accelerometer 30 is accelerated in the Y axis direction, a mass 34 that is connected to the anchor 26 by a stiffness element 32 (e.g. spring) is translated in the Y axis direction, and a relative distance between a stationary electrode 36a and a movable electrode 36b is changed due to the displacement of the mass 34. To be more specific, the change of the relative distance between the stationary electrode 36a and the movable electrode 36b results in change of capacitance between the stationary electrode 36a and the movable electrode 36b. Accordingly, the MEMS accelerometer 30 senses the capacitance change to calculate the acceleration. At the same time, the material properties, e.g. Young's modulus, of the stiffness element 32 change with the temperature, which changes the stiffness of the stiffness element 32. Thus, under the environments of different temperatures, the same acceleration excites the mass 34 of the MEMS accelerometer 30 to translate with different displacements and causes the capacitance change to be different. As a result, the acceleration value measured by the MEMS accelerometer 30 is inaccurate.
FIG. 5 is a simplified schematic view of a micro-electro-mechanical-system (MEMS) gyroscope. Referring to FIG. 5, a stiffness element 42 (spring) of the MEMS gyroscope 40 connects a frame 44a with a mass 44b and the stiffness element 42 (spring) of the MEMS gyroscope 40 connects a frame 44a and an anchor. The frame 44a oscillates along the Y axis direction at the resonance frequency thereof to drive the mass 44b to oscillate along the Y axis direction. When an angular velocity is applied in the Z axis direction, the mass 44b is translated in the X axis. Thus, a relative distance between a stationary electrode 46a and a movable electrode 46b changes. To be more specific, the change of the relative distance between the stationary electrode 46a and the movable electrode 46b results in change of capacitance between the stationary electrode 46a and the movable electrode 46b. Accordingly, the MEMS gyroscope 40 senses the capacitance change to calculate the angular velocity. At the same time, the material properties, e.g. Young's modulus, of the stiffness element 42 change with the temperature, which changes the stiffness of the stiffness element 42 and causes the resonance frequency of the peripheral frame 44a to change. Therefore, under the environments of different temperatures, the mass 44b has different displacements in the X axis direction and causes the capacitance change to be different when the same angular velocity in the Z axis direction is applied on the MEMS gyroscope 40. As a result, the angular velocity value measured by the MEMS gyroscope 40 is inaccurate.
From aforesaid examples, an issue in the development of MEMS inertial sensors, the current trend is to design an MEMS resonator having constant resonance frequency, an MEMS gyroscope having constant resonance frequency, or an MEMS accelerometer having constant spring stiffness even under different temperatures.
FIG. 6 is a simplified schematic view of a passive temperature compensated micro-electro-mechanical-system (MEMS) oscillator. Referring to FIG. 6, which discloses a passive temperature compensated MEMS oscillator 50, wherein SiO2 56 is filled into the trench 54 of the Si mass 52, so as to form the oscillating element (mass 52) with materials of two different Young's moduli. The Young's moduli of the two materials change with the temperature, and the variation of one of the Young's moduli is positive while the variation of another one is negative. Therefore, the resonance frequency of the MEMS oscillator 50 does not change with the temperature.
FIG. 7 is a simplified schematic view of another temperature compensated micro-electro-mechanical-system (MEMS) oscillator. Referring to FIG. 7, which discloses a composite MEMS oscillator 60, wherein four exterior surfaces of the Si oscillating element 62 are covered by SiO2 64 (see the cross-sectional view at the lower right corner of FIG. 7), so as to form the oscillating element 62 with materials of different Young's moduli. The Young's moduli of the two materials change with the temperature. Therefore, the resonance frequency of the MEMS oscillator 60 does not change with the temperature.
Further to the above, a paper "Temperature-Insensitive Composite Micromechanical Resonators" discloses an equation, as below, for calculating the temperature coefficient of frequency (TCf) of a composite resonator provided with a beam-shaped mass:
                    TCf        =                                            r              ·                              TCf                1                                      +                          TCf              2                                            r            +            1                                              (                  Equation                                                              1                )                                r        =                                                            m                1                            ·                              f                1                2                                                                    m                2                            ·                              f                2                2                                              =                                                    E                1                            ·                              I                1                                                                    E                2                            ·                              I                2                                                                        (                  Equation                                                              2                )                                          TCf          1                =                                            TCE              1                        +                          α              1                                2                                    (                  Equation                                                              3                )                                          TCf          2                =                                            TCE              2                        +                          α              2                                2                                    (                  Equation                                                              4                )            where E1 represents the Young's modulus of the mass, E2 represents the Young's modulus of the covering material, I1 represents the area moment of inertia of the mass, I2 represents the area moment of inertia of the covering material, TCf represents the temperature coefficient of frequency of the composite resonator, TCf1 represents the temperature coefficient of frequency of the mass, TCf2 represents the temperature coefficient of frequency of the covering material, TCE1 represents the temperature coefficient of Young's modulus of the mass, TCE2 represents the temperature coefficient of Young's modulus of the covering material, α1 represents the thermal expansion coefficient of the mass, α2 represents the thermal expansion coefficient of the covering material, f1 represents the resonance frequency of the mass, f2 represents the resonance frequency of the covering material, m1 represents the mass of the mass, and m2 represents the mass of the covering material.
The paper also discloses that, in order to prevent the resonance frequency of the composite resonator from changing with the temperature, the temperature coefficient of frequency (TCf) of the composite resonator has to be zero TCf. Based on the deduction below:
                              TCf          =                                                                      r                  ·                                      TCf                    1                                                  +                                  TCf                  2                                                            r                +                1                                      =            0                                                                              r          =                      -                                                            TCf                  2                                                  TCf                  1                                            .                                                          (                  Equation                                                              5                )
It is known from the above that the composite vibrating unit in the common passive temperature compensated MEMS oscillator is formed by using a silicon material and the first material (e.g. SiO2). In the case where the variation direction of the Young's modulus of the first material is opposite to the variation direction of the Young's modulus of the silicon material when the temperature changes, and the area moment of inertia of the mass of the composite resonator and the area moment of inertia of the covering material satisfy Equation 2 and Equation 5, the stiffness of the stiffness element (beam-shaped mass) in the oscillating direction remains unchanged, and the resonance frequency of the beam-shaped mass does not change with the temperature. As a result, the clock signal generated by the oscillator does not change with temperature.

Composite micro-electro-mechanical-system apparatus and manufacturing method thereof

Industrial Technology Research Institute


In the air conditioning apparatus, the air conditioning amplifier unit e is connected to the plurality of door actuators through a single communication line and a single power source line, and also there is provided a fan motor maximum voltage limit control means which not only can create a communication signal to be transmitted through the single communication line in the form of two-way signals including a transmission signal containing door target stop position data to be transmitted to the door actuators, and a response signal to be sent back from the door actuators, but also, when the door target stop position data transmitted last time is different from the door target stop position data transmitted this time, can exert a maximum voltage limit on a fan motor, and, when the signal to be sent back from the door actuators, to the air conditioning amplifier unit is a control end signal which indicates that the door position reaches the target position and the door control is ended, can remove the exertion of the maximum voltage limit.

1. Field of the Invention
The present invention relates to air conditioning apparatus in an air conditioning system for use in a vehicle in which an air conditioning amplifier unit (a master station) is connected to one or more door actuators (slave stations) through a single communication line and a single power source line to provide an LAN (Local Area Network) system, thereby controlling the angle of opening of a plurality of doors.
2. Description of the Related Art
Conventionally, as air conditioning apparatus in an air conditioning system for use in a vehicle, for example, as disclosed in Japanese Patent Publication No. Hei. 6-8746, there is known air conditioning apparatus in which actuator drive circuits respectively for driving respective door actuators are incorporated into an air conditioning amplifier unit, and the actuators respectively for an air mix door, for a mode door, and for an intake door are connected to the drive circuits by harnesses.
However, in the above-mentioned conventional air conditioning apparatus in an air conditioning system for use in a vehicle, the drive circuits and their respective door actuators are connected together through five to nine harnesses, so that the number and weight of the harnesses are large. Also, the door actuators vary in type such as a potentiometer system, an encoder type, and the like, which makes it impossible to mass produce the door actuators. Further, since the actuator drive circuits are incorporated into the air conditioning amplifier unit, the amplifier becomes large in size and the load of the microcomputer also becomes large.
Here, as means for solving these problems, there is known a method in which an air conditioning amplifier unit is connected to a plurality of door actuators by a single communication line to thereby provide an LAN system.
That is, employment of the LAN system can reduce the number of harnesses used, can integrate the actuators, and can realize a compact amplifier, with the result that there can be provided excellent advantages, that is, the weight reduction of the system as well as the reduction of the system cost.
However, when employing the LAN system instead of the current system, there are still left the following problems to be solved.
In the current system, if the target value of a fan motor voltage is equal to or higher than 8.5 V during the operation of the mode door or during the full hot side operation of the air mix door in a bent mode, then the maximum voltage value of the fan motor voltage is limited to 8.5 V, that is, the maximum voltage of the fan motor to secure a torque used to operate the door is limited to this value.
However, when the LAN system is employed and thus the door opening angle data or the like are transmitted unilaterally from the amplifier through a single communication line to the actuators, it is impossible to judge, for example, whether the mode door is in operation or not and, therefore, even if the 8.5 V limit of the fan motor voltage is to be executed, the conditions for removal of the limits of the fan motor voltage cannot be detected and thus the fan motor voltage remains left at 8.5 V, which makes it inevitable to relinquish the 8.5 V limit.

Air conditioning apparatus in an air conditioning system for use in a vehicle


A niobium hydride or niobium hydride alloy is ground at a temperature of −200 to 30° C. in the presence of a dispersion medium to obtain a niobium powder for capacitors, having a low oxygen content, the niobium powder for capacitors is granulated to obtain a niobium granulated product for capacitors, having an average particle size of 10 to 500 μm, the niobium powder or granulated powder for capacitors is sintered to obtain a sintered body, and a capacitor is fabricated by forming a dielectric material on the surface of the sintered body and providing another part electrode on the dielectric material, whereby a capacitor having good LC characteristics and less dispersed in the LC characteristics is obtained.

Capacitors for use in electronic instruments such as cellular phone and personal computer are demanded to have a small size and a large capacitance. Among these capacitors, a tantalum capacitor is preferred because of its large capacitance for the size and good performance. In this tantalum capacitor, a sintered body of tantalum powder is generally used for the anode moiety. In order to increase the capacitance of the tantalum capacitor, it is necessary to increase the mass of the sintered body or to use a sintered body increased in the surface area by pulverizing the tantalum powder.
The method of increasing the mass of the sintered body necessarily involves enlargement of the capacitor shape and cannot satisfy the requirement for downsizing. In the method of pulverizing tantalum powder to increase the surface area, the pore size of the tantalum sintered body decreases and closed pores increase, as a result, impregnation of the cathode agent in the later step becomes difficult. As one of means for solving these problems, a capacitor using a sintered body of a material having a dielectric constant larger than that of tantalum is being studied. The material having a larger dielectric constant includes niobium and a niobium alloy.
With respect to the method for producing a niobium powder for capacitors, JP-A-55-157226 (the term "JP-A" as used herein means an "unexamined published Japanese patent application") discloses a method for producing a sintered element for capacitors by molding agglomerated powder into niobium powder having a particle size of 2.0 μm or less and sintering the niobium powder. However, details on the properties of the capacitor are not described in this patent publication.
U.S. Pat. No. 4,084,965 discloses a capacitor using a sintered body of niobium powder of 5.1 μm obtained by hydrogenating and grinding a niobium ingot. However, the capacitor disclosed is large in the leakage current (hereinafter sometimes simply referred to as "LC") and the practicability thereof is low.
JP-A-10-242004 discloses a technique of partially nitriding niobium powder and thereby improving the LC value. However, when a high-capacitance capacitor is produced by using a niobium sintered body of niobium powder having a fine particle size, a capacitor having a peculiarly large LC value appears in some cases.

This patent is subject to a terminal disclaimer.


An array substrate for a narrow bezel type liquid crystal display device and method of manufacturing the same are provided. The array substrate includes: gate lines (GLs) on a substrate, the substrate including a display area and first to fourth non-display areas at respective sides, pixel regions, a gate insulating layer (GIL) on the GLs, a plurality of data lines on the GIL and crossing the GLs, a plurality of gate auxiliary lines parallel to the data lines and connected to respective GLs, an auxiliary line in the third non-display area with a first layer under the GIL and a second layer on the GIL, the first layer contacting the second layer through a first auxiliary contact hole in the GIL, a thin film transistor in each pixel region and connected to the GLs and data lines, and a pixel electrode connected to each thin film transistor.

1. Technical Field
The following description relates to a liquid crystal display device and method, and more particularly, to an array substrate for a liquid crystal display device having a narrow bezel by reducing a non-display area at right and left sides and method of manufacturing the same.
2. Discussion of the Related Art
Recently, as liquid crystal display (LCD) devices become increasingly lighter in weight and thinner, and require lower power consumption, LCD devices have been widely used as a substitute for cathode-ray tube type display devices.
As an LCD device that includes a thin film transistor (TFT) as a switching element, i.e., an "active matrix LCD (AM-LCD)" device, has desirable characteristics of high resolution and displaying moving images, the AM-LCD device has been widely used.
Generally, a fabricating process of the LCD device includes an array-substrate process for forming a TFT and a pixel electrode, a color-filter-substrate process for forming a color filter and a common electrode, and a cell process for forming a liquid crystal layer between an array substrate and a color filter substrate.
FIG. 1 is an exploded perspective view of the related art liquid crystal panel. As shown in FIG. 1, the liquid crystal panel includes an array substrate 10, a color filter substrate 20, and a liquid crystal layer 30. The array substrate 10 and the color filter substrate 20 face each other, and the liquid crystal layer 30 is interposed therebetween.
The array substrate 10 includes a first substrate 12, a gate line 14, a data line 16, a thin film transistor (TFT) Tr, and a pixel electrode 18. The gate line 14 and data line 16 are formed on the first substrate 12 and cross each other to define a pixel region P. The TFT Tr is formed at a crossing portion of the gate line 14 and data line 16. The pixel electrode 18 is formed in the pixel region P and connected to the TFT Tr.
The color filter substrate 20 includes a second substrate 22, a black matrix 25, a color filter layer 26, and a common electrode 28. The black matrix 25 is formed on the second substrate 22 and has a lattice shape. The black matrix 25 corresponds to a non-display region of the first substrate 12. The non-display region of the first substrate 12 includes the gate line 14 and data line 16 and the TFT Tr. The color filter layer 26 corresponds to the pixel region P and includes red R, green G, and blue B color filter patterns 26a, 26b, and 26c. The common electrode 28 is formed on the black matrix 25 and the color filter layer 26. The common electrode 28 generates an electric field with the pixel electrode 18 such that the liquid crystal layer 30 is driven by the electric field.
A seal pattern (not shown) is formed along edges of the first and second substrates 12 and 22. The seal pattern prevents the liquid crystal layer 30 from overflowing. In addition, first and second alignment layers (not shown) may be formed between the first substrate 12 and the liquid crystal layer 30 and between the second substrate 22 and the liquid crystal layer 30. A polarization plate (not shown) may be formed on an outer surface of one of the first and second substrates 12 and 22. A backlight unit (not shown) is disposed under the first substrate 12 to supply light into the liquid crystal panel.
A driving unit (not shown) for driving a pixel is formed on the first substrate 10. The driving unit is installed on a printed circuit board (PCB). The PCB may be classified into a gate PCB connected to a gate pad (not shown) at one end of the gate line 14 and a data PCB connected to a data pad (not shown) at one end of the data line 16.
For example, as shown in FIG. 2, which is a plan view of the related art LCD device 1 with a printed circuit board (PCB), first and second non-display areas NA1, NA2 (opposite to each other) and third and fourth non-display areas NA3, NA4 (opposite to each other) are defined at outer sides of the display area DA.
The data PCB 50 is installed at one of the first and second non-display areas NA1, NA2. FIG. 2 shows the data PCB 50 at the first non-display area NA1. The PCB 50 is connected to the data pad via a plurality of data flexible printed circuits (FPCs) 62. A plurality of gate FPCs 61 including a driving integrated circuit (IC) 71 are installed at one of the third and fourth non-display areas NA3, NA4 without a gate PCB. The FPC 61 is connected to the gate pad at one end of the gate line 14 (FIG. 1).
The LCD device 1 having the above structure is widely used for various applications such as TVs, monitors, note-book computers, mobile phones and PDAs.
On the other hand, a desire for a narrow bezel having light weight and slimness has increased. Accordingly, development of an LCD device having a narrow bezel, for example, by reducing a width of the third and fourth non-display areas NA3, NA4 is desired.

Array substrate for narrow bezel type liquid crystal display device and method of manufacturing the same


A method for detecting whether a file includes malware is performed on a device. The method includes extracting information of at least two predetermined items in the file; creating a genetic map for the file by altering the extracted information into a previously set format; comparing the created genetic map with a previously stored malware genetic map to obtain a similarity between the created genetic map and the previously stored malware genetic map; and determining that the file is a malware when the similarity is higher than a reference value.

Malware is the malicious software. Generally, such malware is infiltrated into a computer by being as a file. The infiltrated malware causes a malfunction of the computer by disturbing computer operations, or functions as an information leakage path allowing the personal information of a user to be externally leaked from the computer. As such, it is necessary to delete or modify a file after an inspection for determining whether the file is malware, in order to prevent the damage caused by the malware.
Conventionally, a signature is used to detect malware or determine whether an inspection target file is malware. More particularly, a value, such as a hash value or CRC (Cyclic Redundancy Check) value, representing characteristics of a file is derived from a part of the file which has been known as malware and is stored in a data base. If a target file to be inspected about infection with malware is received, a signature is derived from the target file in the same way as the above and is compared with the previously derived signatures of files including the malware, thereby determining whether the target file is malware.

System and method for detecting malware in file based on genetic map of file


A retractable visual display is movable along a longitudinal axis of the visual display from a retracted position within the device housing of the portable communication device to an extended position where at least a portion of the visual display is exposed outside of the device housing in the extended position. The visual display is off when retracted and power is supplied to the visual display only in the extended position although the communication functions are active when the visual display is retracted within the device housing. In some circumstances, a secondary display presents limited information when the visual display is retracted.

Many portable communication devices such as cellular telephones and wireless personal digital assistants (PDAs) include visual displays for presenting information to the user. Many conventional devices include a liquid crystal display (LCD) that is attached to a main device housing or to a hinged cover (flip display). Typically the visual displays are implemented using large color displays in order to facilitate user tasks such as web browsing, viewing contact, file, and song lists, and playing games. Conventional devices, however, are limited in that the visual display must be exposed to perform tasks that do not require the large color display. As a result, the form factor of the conventional devices is larger than necessary during these tasks. For example, where the display is implemented as part of the rotating flip, the flip must be opened to answer an incoming call even when the user does not require the display. In devices where the display is attached to the main housing, the device has a form factor that must provide adequate area for the display, the keypad, and other user interface devices. In addition to the larger than necessary form factor, conventional devices unnecessarily consume power since current is supplied to the large color display when such a display is not needed.
Accordingly, there is a need for a portable communication device with an extendable visual display.

Portable communication device with extendable visual display


An apparatus and method for detecting electrical arc faults that has reduced susceptibility to nuisance tripping. The apparatus includes a current sensor, an input sense circuit, an arcing sense circuit, a power supply, a tripping circuit, a processing unit, and an electromechanical interface. The processing unit measures multiple voltage levels provided by the arcing sense circuit during a specified number of consecutive time periods. Next, the processing unit determines the number of consecutive time periods during which the voltage levels exceeded a specified minimum value, take on successively lower or higher values, or fall outside a predetermined normal range of values. Based upon the results of this determination, the processing unit either trips the electromechanical interface to interrupt power to a load, or inhibits tripping of the electromechanical interface, thereby reducing the occurrence of nuisance tripping.

The present invention relates generally to apparatus and methods for detecting arc faults, and more specifically to arc fault detection apparatus and methods that are less susceptible to nuisance tripping.
Arc fault detection apparatus and methods are known that employ a micro-controller to measure voltages associated with a load, and to process data representing the voltage measurements to determine the presence of electrical arcing. For example, a conventional arc fault detection apparatus may be configured to sense an alternating load current, to filter and rectify the AC signal, and to provide the rectified signal to an integrating capacitor. The conventional arc fault detection apparatus may then use a micro-controller to take measurements of the voltage across the integrating capacitor, and to convert the voltage measurements to digital data for subsequent processing using an algorithm. For example, such an algorithm may be employed to analyze the measured voltage levels corresponding to respective cycles of the line voltage, and to determine whether the voltage measurements are characteristic of an electrical arc fault such as point contact, low level, or series electrical arcing, or a nuisance load such as a dimmer control, a motor, incandescent lighting, appliance thermostat switching, drill current transitions, random line voltage spikes, EMI bursts, etc. In the event the voltage measurements are characteristic of an arc fault, the conventional arc fault detection apparatus typically trips a circuit breaker to disconnect the power output from the load.
Although the above-described conventional arc fault detection apparatus can be employed to detect and distinguish between electrical arc faults and nuisance loads, there is a need for arc fault detection techniques that have increased reliability. For example, electrical arcing indicative of an arc fault is generally chaotic in nature. In contrast, nuisance loads such as triac-controlled dimmer circuits can produce electrical arcing events that are periodic. However, conventional arc fault detection apparatus often cannot reliably distinguish between periodic and non-periodic electrical arcing events, and are therefore prone to nuisance tripping. Further, nuisance loads such as dimmer controls, motors, and incandescent lighting can generate high voltage transients as the settings of these devices are changed, thereby producing decreasing or increasing levels of electrical arcing over consecutive time periods. However, conventional arc fault detection apparatus frequently have difficulty distinguishing between electrical arc faults and electrical arcing events characterized by a transient decrease or increase in voltage levels, which are generally indicative of a nuisance load. In addition, although some loads may produce noisy switching signals having abnormally high voltage levels, such high voltage levels are not necessarily indicative of electrical arcing and may be incorrectly characterized as arc faults by conventional arc fault detection apparatus.
It would therefore be desirable to have improved arc fault detection apparatus and methods that avoid the drawbacks of the above-described conventional arc fault detection apparatus and methods.

Methods of detecting arc faults characterized by consecutive periods of arcing

Sensata Technologies Massachusetts, Inc.


DNA segments have been discovered, and characterized by sequence, which are response elements operative to confer responsiveness to ligands for several members of the steroid/thyroid superfamily of receptors, for the transcriptional activation and/or repression of promoters in cells. By using transcriptional control regions comprising response elements of the present invention in combination with a functional promoter, it is now possible to provide recombinant DNA vectors containing a gene, the transcription (and, thereby, also expression) of which is under the control of a promoter, the transcriptional activity of which is responsive to ligands for members of the steroid/thyroid superfamily of receptors.

The present invention relates to the superfamily of nuclear receptors known as the steroid/thyroid hormone receptors and their cognate response elements. More particularly, the present invention relates to the discovery of novel response elements which may be used to control the transcriptional activity of promoters.
A central question in eukaryotic molecular biology is how specific DNA-binding proteins bind regulatory sequences to influence cell function and fate. The steroid/thyroid hormone receptors form a superfamily of ligand-dependent transcription factors that are believed to play a part in such cell function and fate. For example, it is known that these receptors transduce extracellular hormonal signals to target genes that contain specific enhancer sequences (referred to as hormone-response elements, or HREs). Each receptor contains a ligand-binding domain and a DNA-binding domain. The receptor undergoes a conformational change when it binds ligand. This conformational change permits the receptor-ligand complex to bind its cognate response element and thereby regulate transcriptional activity of an associated promoter. Transcriptional activation of promoter drives transcription of an operatively associated structural gene.
Sequence comparison and mutational analyses of hormone receptors, such as the glucocorticoid receptor (GR), have identified functional domains responsible for transcriptional activation and repression, nuclear localization, DNA binding, and hormone binding. The DNA binding domain, which is required in order to activate transcription, consists of 66-68 amino acids of which about 20 sites, including nine cysteines (C1 to C9), are invariant among different receptors. The modular structure of members of this receptor superfamily allows the exchange of one domain for another to create functional, chimeric receptors.
The hormone response elements identified thus far are generally structurally related, but they are in fact functionally distinct. The response elements for GR [i.e., the glucocorticoid response element (GRE)], estrogen receptor [i.e., the estrogen response element (ERE)], and thyroid hormone receptor [i.e., the thyroid hormone response elements (TREs)] have been characterized in detail; they each consist of a palindromic pair of xe2x80x98half sitesxe2x80x99 [Evans, Science 240, 889 (1988); Green and Chambon, Trends in Genetics 4, 309 (1988)]. With optimized pseudo- or consensus response elements, only two nucleotides per half site are different in GRE and ERE [Klock, et al., Nature 329, 734 (1987)]. On the other hand, identical half sites can be seen in ERE and TRE, but their spacing is different [Glass, et al., Cell 54, 313 (1988)]. Moreover, TRE has been shown to mediate transcriptional activation by transfected retinoic acid receptors (RARs) in CV-1 cells whereas non-transfected cells show no response [Umesono et al., Nature 336, 262 (1988)]. In other words, both TR and RAR receptors can activate TREs.
Thus far, however, the response elements for only a few members of the steroid/thyroid superfamily of receptors have been identified. The response elements for many other members of the superfamily, and the relationship between them, if any, remain to be described.
We have discovered, and characterized by sequence, DNA segments which are response elements operative to confer responsiveness to ligands for several members of the steroid/thyroid superfamily of receptors, for the transcriptional activation and/or repression of promoters in cells. We have also discovered that the transcriptional activity modulating effect of the invention response elements occurs in all mammalian cells in the presence of ligands for several members of the steroid/thyroid superfamily of receptors, indicating that the various hormone receptors recognized by the invention response elements are present endogenously in all of these cells.
Contrary to what has previously been reported in the art for the GRE, ERE and TRE, the novel response elements disclosed herein have a tandem repeat sequence, as opposed to a palindromic sequence which has previously been reported for GRE, ERE and TRE. In addition, the invention response elements are much less susceptible to transcriptional activation by non-cognate receptors than are the previously described response elements (GRE, ERE, TRE).
By using transcriptional control regions comprising response elements of the present invention and a functional promoter, it is now possible to provide recombinant DNA vectors containing a gene, the transcription (and, thereby, also expression) of which is under the control of a promoter, the transcriptional activity of which is responsive to (and modulated by) ligands for several members of the steroid/thyroid superfamily of receptors.

Response element compositions and assays employing same

The Salk Institute for Biological Studies


This invention describes a method for optimizing a valve-lift changeover on spark-ignition engines with lambda control. On the basis of the evaluation of an acceleration characteristic and a lambda characteristic during the valve-lift changeover, it is determined whether cylinder charging errors and/or torque errors that require correction are present in the spark-ignition engine.

The principle of valve-lift changeover on internal combustion engines is known from the prior art. Thus, systems such as Vario-Cam-Plus from Porsche have already been in series production for several years (see also "Handbuch Verbrennungsmotor", Publisher: van Basshuysen/Schäfer, Vieweg Verlag, 1st edition 2002, chapter 10.4
The problem with this technology is still the lift changeover process itself. Difficulties arise with respect to the torque neutrality of the internal combustion engine precisely at the changeover from a small to a large valve lift. Compared with this, the changeover from a large to a small valve lift can preferably take place in the overrun fuel cut-off phases and is therefore inclined to be uncritical with regard to torque neutrality.
The valve-lift changeover frequently leads to jerky running of the motor vehicle. The reason for this is in the barely unavoidable inaccuracies in the model of the degree of aspiration or delivery (manifold model). These models calculate, in the engine management system, the air mass supplied to each cylinder. From this, the amount of fuel to be injected to maintain a specific air/fuel ratio (lambda) is calculated. The amount of fuel in turn determines the amount of engine torque produced for the particular combustion cycle.
A separate model is stored in the engine management system for each valve-lift configuration of the internal combustion engine. The model data is stored in maps formed from sampling points. Because the data content of these maps is usually identical for a variety of vehicles, for example from series production, the system individuality plays a considerable role in this case. Even small manufacturing tolerances can mean that two systems that are supposedly the same behave differently.
A measure of the quality of the valve-lift changeover is obtained by a comparison of the torque in both valve-lift configurations, i.e. directly before and directly after the valve-lift changeover. The torque for both valve lifts before and after the valve-lift changeover should be as equal as possible. Even small errors in the model calculation can lead to differences in torque and therefore to jerky running of the vehicle during the valve-lift changeover. Even though the cylinder charging models are usually adjusted by existing sensors, such as inlet manifold pressure sensors, air mass meters etc, these components are themselves subject to tolerances and therefore small inaccuracies cannot be ruled out.
This brings us to the cost-accuracy problem. At a realistic price it is possible to develop and manufacture a sensor with only a limited accuracy. A further difficulty is that the combustion behavior of the spark-ignition engine will in all probability alter due to the valve-lift changeover. This is to be expected mainly with ported injectors due to the changed flow cross section and changed flow conditions at the valve. A particular problem then arises if a change in the combustion process also takes place during the valve-lift changeover. This, for example, will be a change from a spark-ignition engine type combustion to a controlled spontaneous ignition.
In principle, the models can be translated in the engine management system with any required accuracy. The disadvantage, however, is the rapidly increasing complexity of the data processing sequences that arise when all the influencing parameters have to be captured with a specific accuracy on a variable to be mapped. Even modern engine management systems quickly reach their limits in this case. In particular, the storage and computing capacity of the engine management system is quickly exhausted, so that finally compromises have to be made and limits placed with regard to accuracy. A similar approach applies for the sensor systems used in the spark-ignition engine, because large series products demand inexpensive components for which a certain measuring tolerance has to be accepted.

Method for optimizing a valve-lift changeover on spark-ignition engines


An electrical cable connector is disclosed for connecting a plurality of electrical conductors to a printed circuit board. The cable connector includes a cable socket connector having a plurality of female insulation displacement contacts which can be mated with male signal-carrying pins contained in a pin shroud on a printed circuit board. The cable socket connector is comprised of a hood which retains two or more wafers. Each wafer contains a plurality of insulation displacement contacts. The cable socket connector may include a latch for securing the cable socket connector to the pin shroud and shielding to prevent extraneous signals from being transmitted into the circuits on the printed circuit board through the cable connector. The cable connector also includes an arrangement for keying the cable socket connector to the pin shroud to control the location of insertion of the cable socket connector into the pin shroud.

1. Field of the Invention
This invention relates to electrical connectors in general, and, in particular, to a cable connector which permits an electrical cable having multiple conductors to be removably connected to electrical circuits on a printed circuit board or back panel.
2. Summary of the Prior Art
Electronic circuits for many applications including, for example, for telecommunications applications, are becoming increasingly faster and more complex with a need to accommodate many electrical circuits and components on printed circuit boards or back panels. It is frequently necessary in complex systems to interconnect circuits contained on back panels to circuits in other locations, for example by using multi-wire electrical cabling. As electronic circuits increasingly become more complex and faster in operation, their sensitivity to radio frequency interference and other electromagnetic radiation increases. Consequently, there is a need to protect the interconnections between back panels and other components which are connected by cable from stray electromagnetic interference and other forms of interferences (sometimes referred to as "EMI-RFI" interference). Electrical cables connecting electronic circuits in other locations to back panels are frequently isolated from cross-talk by encasing the signal conductors in a conductive shield. Since it is advantageous to connect a multi-wire electrical cable to a back panel with a connector which can be readily disconnected without breaking solder joints, it would also be advantageous to have shielding on the electrical connector to avoid introducing cross-talk into the signal carrying conductors through the unshielded connector. This arrangement would be particularly useful where a cable connector is connected to signal carrying pins which are installed in a pin field on a back panel, since failure to properly insulate the pin field from stray electromagnetic signals may result in the pins acting as antennae with the attendant degradation of signals being transmitted between the cable and circuits on the back panel. In addition, it would also be advantageous to have an electrical connector which provides grounding between the conductive surfaces on the cable-end of the connector and ground planes contained on the back panel.
Use of metal shielding to shield connectors from stray electromagnetic radiation is known in the prior art. However, metal shielding is bulky and is frequently difficult to accommodate in high density connectors, that is, in connectors having a substantial number of contacts in a confined space. In addition to having the contacts in a connector electrically isolated from stray electromagnetic radiation, it would be also advantageous to shield adjacent pins and pin contacts from both stray electromagnetic radiation and cross-talk produced by the transmission of signals from one wire in a multi-wire cable into adjacent contacts through the electrical connector.
One form of cable connector for use in effecting contact between multi-wire cables and circuits on printed circuit boards is manufactured by Harting Electronik of Germany and is sold under the trademark "Har-Pak". While the system is modular and permits making high density contacts between cables and circuits on printed circuit boards, there is still a need for a more flexible approach to making interconnections between multi-wire cables and a printed circuit board, including a need for achieving EMI-RFI shielding on both the male and female portions of the connector system.
While there are a variety of electrical connectors available for effecting connections between signal carrying wires in a multi-wire cable and electrical circuits contained on a printed circuit board or back panel, the combination of an electrical connector which includes closely spaced contacts for connecting circuits in a multi-wire cable to a pin field on a back panel and which also provides EMI/RFI shielding to isolate the circuits from stray electromagnetic radiation and which also includes a keying capability to insure that the cable-end of the connector makes electrical contact with the proper pins in a pin field is not known. Furthermore, it would advantageous to have an electrical connector for making connections between a multi-wire cable and a pin field on a back panel which can be configured to permit the number of contacts in the cable-portion of the connector to be designed to accommodate a specific number of pins in a pin field on a back panel. The connector disclosed herein not only permits the quick connection of multiple wires in a cable to circuits on a printed circuit board but also insures that isolation from stray electromagnetic radiation is achieved between the cable-end of the connector and the printed circuits contained on the back panel.


An improved system and method for safe booting an electronic device. In situations such as where a virus is infecting various devices within a network, the present invention provides an authentication centre with the ability to instruct a device on the network to safe boot. During the safe boot, it can be arranged such that no third party applications are run, only backup, restoration, or uninstallation of programs are possible, and/or only programs in the device's read-only memory are loaded. The present invention also provides a user with the ability to go through the boot process in a step-by-step manner.

Open platform devices such as mobile telephones, personal computers and personal digital assistants include large amounts of software. In many instances, some of the individual software programs may be malicious and/or do not behave satisfactorily with other software programs on the device. In the case of a virus or a propagating Trojan horse (worm) attack, virus killing programs may not react quickly enough to prevent the malicious entity from contaminating other programs and/or any data on the device. Furthermore, in devices such as mobile telephones, there may not be any virus killing programs installed at all.
Virus killers have recently been implemented on open mobile phone platforms. These programs, however, require a network connection in order to update their virus databases. Although platform security enhancements help to reduce worm and virus threats, they cannot completely eliminate them. In any event, it is extremely important for the device to be capable of halting the propagation of harmful software from the devices extremely quickly.
Various safe-boot systems currently exist for allowing a device to start up in a "safe" mode. In a safe boot, the end user is given the opportunity to go step-by-step through the boot process. This is often initiated by actuating a certain key, such as a "function" key on a personal computer.
One system for implementing a safe boot is described in U.S. Pat. No. 6,640,316, issued on Oct. 28, 2003 and incorporated herein by reference. In this system, the contents of a diagnostics indicator are evaluated to determine whether the indicator contains a "simple boot" value. In at least one embodiment, the "simple boot" value is equivalent to a "set" state. The method includes determining, if the diagnostics value is set, whether a platform corruption has occurred. If the simple boot flag is set and a platform corruption has not occurred, then a simple boot is performed. Otherwise (i.e., either the simple boot flag is not set or a platform corruption has occurred, or both) one or more diagnostic routines are executed.
In many Symbian telephones and other conventional systems, a safe boot can be conducted by loading only programs stored in the devices read-only memory (ROM) or other software whose trustworthiness can be assured by other methods. However, the decision whether to load programs from the device's ROM is based on self-diagnostics and is not dependent on any external commands. Furthermore, a mobile phone may reach a condition where it can no longer boot properly due to user data failure.

System and method for safe booting electronic devices


In an active matrix type liquid crystal electro-optical device using thin-film transistors, a metal film is formed on a transparent electrode that is opposed to the thin-film transistors. The metal film is oxidized by anode oxidation method using the electrode as an anode, to form a metal oxide film that serves as a short circuit preventing film. Alternatively, after a grid-shaped mask is formed on the metal film, the metal film is oxidized using the electrode as an anode, the mask is removed, and the metal film is again anode-oxidized, to form a non-oxidized portion. Thus, transparent and opaque regions, i.e., a black matrix is formed.

1. Field of the Invention
The present invention relates to a short circuit preventing film for preventing short-circuiting between electrodes which is suitable for use in a liquid crystal electro-optical device. The invention also relates to a manufacturing method of such a film.
2. Description of the Related Art
In recent years, liquid crystal electro-optical devices have been investigated actively. A liquid crystal electro-optical device is constructed such that a pair of substrates are facing with each other, electrodes or electrodes and switching elements such as thin-film transistors are provided inside the respective substrates, and a space between the substrates are filled with a liquid crystal material. The liquid crystal electro-optical device may be used as display or some other function utilizing an optical response characteristic of the liquid crystal material.
Each of the substrates of the liquid crystal electro-optical device that face each other has an electrode on its surface, and the interval between those electrodes is very small; for instance, 5-8 .mu.m in TN (twisted nematic) type devices and 1-4 .mu.m (typically, 1.5 .mu.m) in devices using a ferroelectric liquid crystal. Therefore, when a very small impurity, dust, etc. exists between the electrodes, very serious problems occur. More specifically, short-circuit between the electrodes produces by existence of the impurity or the like. Therefore, a display failure, a defective point in a display, or other problems occur.
Conventionally, to solve this problem, a silicon oxide (SiO.sub.2) film of about 1,000 .ANG. in thickness is formed as a short circuit preventing film. However, pinholes are likely to produced in this film. The breakdown voltage of SiO.sub.2 film having 1,000 .ANG. in thickness is low, in a range of 5 to 20 V and changes largely. Therefore, this film does not have sufficient characteristics for short circuit prevention. In addition, since the relative dielectric constant of this film is as low as 2 to 5, a loss of an electric field to be applied to the liquid crystal material produces, deteriorating characteristics of the device, such as the contrast.

Short circuit preventing film of liquid crystal electro-optical device and manufacturing method thereof

Semiconductor Energy Laboratory Co., Ltd.


A liquid crystal display includes a back substrate, a front substrate, and an optical filter layer interposed therebetween. The optical filter layer contains a liquid crystal material which forms a bend configuration when a voltage is applied between electrodes of the back and front substrates. The electrodes of the back and front substrates are covered with alignment layers which include corrugated surfaces at positions of the electrodes. Each corrugated surface includes upslopes and downslopes steeper than the upslopes or vertical surfaces which are alternately joined.

1. Field of the Invention
The present invention relates to a liquid crystal display which employs a display mode utilizing birefringence and, more particularly, to a liquid crystal display employing a display mode in which a liquid crystal material forms bend configuration.
2. Description of the Related Art
In a liquid crystal display using an optically compensated birefringence (OCB) mode, a liquid crystal material is caused to form bend configuration, and the tilt angles of liquid crystal molecules are changed near each alignment layer, thereby changing the optical retardation of an optical filter layer. Because of utilizing bend configuration, the OCB-mode is one of the display mode capable of realizing a high response speed and a wide viewing angle, and has attracted attention in recent years.
As described above, bend configuration is essential in the OCB-mode. However, bend configuration is difficult to stabilize as will be explained below.
That is, a liquid crystal material of OCB-mode liquid crystal display forms splay configuration in an initial state in which the power supply is off. Therefore, a process of changing splay configuration to bend configuration is necessary every time energizing the display. Due to uncontrollable factors regarding to the shape of the substrate surface or the electric field distribution, an unchanged region sometimes remains in the optical filter layer. In addition, splay configuration is intrinsically more stable than bend configuration under usual surface alignment conditions. Accordingly, if a voltage is not continuously applied, bend configuration may change to splay configuration.
To solve this problem, Japanese Patent No. 3459916 describes a structure in which the opposed surfaces of an active matrix substrate and counter substrate are inclined to each other. Japanese Patent No. 3459916 also describes a structure in which grooves having a V-shaped section are formed on the opposed surfaces of the active matrix substrate and counter substrate, such that the cell gap at a position corresponding to the center of a pixel electrode is wider than the cell gap at positions corresponding to the two ends of the pixel electrode.
Bend alignment can be stabilized by the use of these structures. However, the present inventors have found that a liquid crystal display which stabilizes bend configuration by using the above structures readily causes stripe-like modulation in the display brightness.


An electronic device and method for detection of intentional contact between an object and a body part of a player are provided. An electronic device receives a plurality of frames of a video from an imaging device. The electronic device tracks a movement of the object and a movement of the body part across the plurality of frames. The electronic device determines, based on the tracked movement, a frame of interest from the plurality of first frames in which degree of overlap between position coordinates of the object and position coordinates of the body part of the player exceeds an overlap threshold. The electronic device detects a contact between the object and the body part of the player based on the frame of interest. The electronic device applies a machine learning model on the frame of interest and the tracked movement to determine whether the contact is intentional.

Recent advancements in the field of sports officiating technology have led to the development of various platforms and applications for video assistant referee (VAR) for reviewing decision of a foul in a sport (such as soccer). The VAR may be equipped with cameras installed at different positions on the field for acquiring videos of the players from different points of view. The VAR may analyze the videos acquired from the cameras to make or review a decision for different types of foul (such as a handball event) according to the rules of the sport (such as soccer), in order to minimize human errors by on-field referees. For example, the decision may be associated with whether the handball event by a player is intentional or not. However, in some scenarios, the VAR may take a long time to review the videos from multiple camera angles for events that involve rapid movements to make a decision. This delay in the decision may affect the progress of the match and may make players lose focus of the match. In addition, the decision made by the VAR may be still be prone to human error, and the decision may be different from the actual event, which may significantly influence the outcome of the match. Thus, the current process of the VAR may be time consuming and prone to human errors.
Limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art, through comparison of described systems with some aspects of the present disclosure, as set forth in the remainder of the present application and with reference to the drawings.

Detection of intentional contact between object and body part of player in sport


A device for reclaiming waste heat from cooking appliances. The device includes a baffle through which exhaust from the cooking appliance flows, an inlet for receiving exhaust from the cooking appliance, and an outlet for venting exhaust to the atmosphere outside the building or vehicle in which the cooking appliance is located. The baffle extracts heat from the exhaust as the exhaust flows therethrough. The baffle is in thermal communication with a heat sink that directs the extracted heat to the building or vehicle spaces to be heated. The heat reclamation device has a generally thin profile so that the device may be installed above and behind the work surface of the cooking appliance so as to consume a minimal amount of space while not interfering with the normal use of the appliance. The heat reclamation device has means to vent the exhaust directly to the atmosphere, bypassing the baffle.

This invention relates to heating devices, particularly heat reclamation devices that are adapted to be attached to ovens, ranges or similar cooking appliances so as to reclaim waste heat from the exhaust thereof in order to heat buildings or vehicles in which the cooking appliance is located, while requiring minimal space and being relatively maintenance free.
Ovens, ranges and similar cooking appliances generate waste heat in their exhaust that is ordinarily lost in venting the exhaust to the atmosphere. It is often desirable to reclaim the waste heat from that exhaust in order to heat, for example, the interior spaces of the building or vehicle in which the cooking appliance is located. It is also desirable to reclaim that heat using a device that consumes a minimal amount of space, is lightweight, is relatively maintenance free, is thermally efficient, and includes a simple means by which the extraction of heat may be selectively turned on or off. In addition, it is desirable to reclaim the heat using a device that vents dangerous gases and moisture out of the appliance into the atmosphere, rather than into living spaces, and that provides sufficient draft as to prevent backdraft of the gases and moisture into the cooking appliance.
The above-identified features are particularly desirable when reclaiming heat in small manufactured homes, campers, motor homes, trailers and other structures where interior space generally is limited and cooking appliances frequently use propane, a fuel that produces exhaust containing moisture and dangerous gases.
Heating devices that reclaim waste heat from the exhaust of various heat sources for use in heating living spaces are known, and take a variety of forms, each with significant limitations. One conventional form includes an enclosure seated on and covering the entire cooking surface of a stove. The enclosed air is heated both by the stove's radiant heat and by the waste heat contained in the stove's exhaust. Examples of this form are described in Rogant U.S. Pat. No. 2,553,278 and Hilby U.S. Pat. No. 413,367.
This form of heating device is subject to significant limitations, including that the simultaneous use of the stove for heating and for cooking is precluded because the enclosure must be either seated to heat o removed to cook. This form also tends to consume a large amount of space. Accordingly, this form is not well adapted for use in small manufactured homes, campers, motor homes, trailers and other such structures.
A second conventional form reclaims waste heat from the exhaust of a cooking surface by collecting the exhaust using a hood fixed in position above and away from the cooking surface. This form is particularly adapted for use in restaurants. An example of this form is described in Huggins U.S. Pat. No. 4,171,722 ("Huggins").
This second form of heating device, as shown by Huggins, is also subject to significant limitations. For example, Huggins is complex in design, requiring a hood, conduits, blowers, filters, heat exchanger elements, dampers, and an electric motor. With its complexity, Huggins' heating device tends to be expensive and to require a relatively high amount of maintenance. Moreover, Huggins' heating device consumes a large amount of space, and it is to be installed largely on the exterior of the structure in communication with the cooling surface and the heated space by means of a network of conduits. Accordingly, this form also is not well adapted for use in small manufactured homes, campers, motor homes, trailers and other such structures.
A third conventional form of heating device reclaims waste heat from the flue gases of heating stoves and furnaces. This form generally is used to supplement the heat generated by heating stoves and furnaces, and is available in a large number of variations having various features. In one variation, this form is positioned above and behind the stove and consumes a smaller amount of space than the aforementioned forms, in particular, by having a somewhat flat geometry. An example of this form is described in Johnson U.S. Pat. No. 4,206,742 ("Johnson") wherein flue gases pass though a set of vertical tubes having outside surfaces that transfer heat to air directed thereover by a blower.
This third form of heating device is also subject to significant limitations, including that this form tends to consume more than the desired minimal amount of space. Although Johnson is somewhat flat in geometry, it must be deep enough to accommodate a large number of tubes disposed in spaced, offset rows so as to provide efficient heat exchange. Moreover, use of tubes increases maintenance because the tubes' relatively narrow internal diameter tends to cause depositing that must be removed regularly when the heat source's exhaust contains particulates. Indeed, Johnson provides access to the tubes in order to facilitate that maintenance. While wider diameter tubes may be used to lessen maintenance, such wider tubes tend to increase space consumption by increasing the depth of the apparatus and tend to reduce heat reclamation efficiency. Accordingly, this form also is not well adapted for use in small manufactured homes, campers, motor homes, trailers and other such structures.
Because known conventional heating devices that reclaim heat have inherent shortcomings when used in small manufactured homes, campers, motor homes, trailers and other such structures, a need exists for an improved heating device that reclaims waste heat, particularly for use in such buildings and vehicles.


A server apparatus includes a communication interface and a controller configured to transmit/receive information to/from another apparatus using the communication interface. Upon receiving a request for vehicle dispatch from a terminal apparatus, the controller is configured to transmit an instruction to pick up a user of the terminal apparatus to a vehicle that includes a game apparatus corresponding to a game preference of the user.

Various technologies have been proposed for users to play games in a network environment. Examples of online games, such as executing a game program, distributed from a server, on a terminal apparatus or executing a game program on a plurality of game machines that can communicate via a network for a plurality of user compete against each other, are disclosed in patent literature (PTL) 1 and 2.

Server apparatus, system, in-vehicle apparatus, vehicle, and method of operating a system


After analog-to-digital conversion, a luminance signal 103 and a chrominance signal 109 are stored in a line memory circuit 128. Such stored signals are read out of said line memory circuit, using a read clock 124 obtained by parabolically modulating a read frequency with both the horizontal period and the vertical period. The read-out digital signal is again converted into an analog luminance signal 132 and analog color difference signals 135, 136 by digital-to-analog conversion. By this procedure, inner pincushion distortion or inner barrel distortion is corrected. Since such distortion is corrected by modulating an image signal itself by digital processing, no circuit drift due to the conventional analog correction occurs and no analog circuit design such as troublesome setting of parts constants is required.

1. Field of the Invention
The present invention relates to a distortion correction circuit which is mounted on a television receiver or the like to correct image distortion.
2. Description of the Related Art
Conventionally, a raster on a fluorescent screen showed pincushion distortion in the deflection process of a color television receiver because the radius of curvature of a fluorescent screen is longer than the axial length from a deflection center to a fluorescent screen. This distortion is called pincushion distortion. Even though a uniform pincushion correction is applied to the entire screen, pincushion distortion still remains in the center part (hereinafter called inner pincushion distortion) because of the difference of distortion degree between the peripheral part and the center part of the screen. Such inner pincushion distortion which is a shrinkage in the center part is caused by the difference of a horizontal linearity between the upper/lower parts and the center part of the screen.
FIG. 7 shows a distortion correction circuit of voltage modulation type called a diode modulator circuit. A diode modulator circuit of negative system will be described below. In this circuit, distortion is corrected by using the negative potential at a point C.
In FIG. 7, pulses of the horizontal period are supplied to an input terminal 1 and supplied to the base of a horizontal output transistor Q1. A damper diode D1 is connected in parallel between the collector and the emitter of the horizontal output transistor Q1 so that the cathode of the former is connected with the collector of the latter. In addition, a resonant capacitor C2 is connected in parallel with the horizontal output transistor Q1. Furthermore, the combination of a horizontal deflection coil Ly, a linearity coil L1 and a damping resistor R1 which are connected in parallel with each other, and S-shape correction capacitors C4 and C5 serially connected are connected in parallel with that transistor Q1.
The collector of the horizontal output transistor Q1 is connected with a power supply terminal 2 through the primary winding T1 of a flayback transformer FBT so as to supply the power supply voltage VB. Additionally, a resonant capacitor C1 is connected between the collector of the horizontal output transistor Q1 and the reference potential point.
The emitter of the horizontal output transistor Q1 is connected with the reference potential point via a parallel circuit of a modulation diode D2 and a resonant capacitor C3, and at the same time via a modulation coil L3 and a modulation capacitor C6. A joint A between the S-shape correction capacitors C4 and C5 is connected with the reference potential point via a coil L2.
A joint B of the modulation coil L3 and the modulation capacitor C6 is connected with the reference potential point via a resistor R2 and the collector-emitter path of the transistor Q2. A parabolic wave generating circuit (not shown) which generates the parabolic wave voltage of the vertical period is connected with a terminal 3 which is connected with the base of the transistor Q2.
The above-mentioned circuit is a horizontal output circuit in which the damper diode D1 and the resonant capacitor C2 are connected in parallel with the horizontal output transistor Q1. In addition, in this circuit, a distortion correction circuit is connected with the peripheral part of the S-shape correction capacitors C4 and C5. The S-shape capacitor is divided into C4 and C5. A coil L2 is connected between the joint A of these capacitors C4 and C5 and the reference potential point. For the purpose of distortion correction, a distortion correction circuit consisting of a series circuit of the coil L3 and the capacitor C6 as well as the resonant capacitor C3 is connected in parallel between one terminal of the S-shape correction capacitor C5 (the emitter of Q1) and the reference potential point. The diode D2 maintains the negative voltage generated at the emitter of the transistor Q1 and guarantees the operation of the horizontal output transistor Q1.
In the horizontal scanning period, the horizontal deflection current flows through the horizontal output transistor Q1 or the damper diode D1. The current I1 flows from the S-shape correction capacitor C5 through the coil L2. The charge stored in the S-shape correction capacitors C4 and C5 flows to the horizontal deflection coil Ly through the coil L1 as a horizontal deflection current ly. Only the horizontal deflection current ly flows through the S-shape correction capacitor C4 on the horizontal deflection coil side. Both I1 and ly flow through the S-shape correction capacitor C5. The parabolic wave voltage of the vertical period is applied to the terminal 3 connected with the base of the transistor Q2 to modulate the terminal voltage Vm of the capacitor 6 parabolically. When the voltage Vm of the capacitor C6 is modulated parabolically with the vertical period, the S-shape capacitor voltage (Vc5+Vc4) as the power source of the horizontal deflection current ly is modulated as expressed by Vc5+Vc4=VB+Vm. In the above equation, Vc5 is the voltage across the S-shape correction capacitor C5, and Vc4 is the voltage across the S-shape correction capacitor C4. In this case, the capacity of the S-shape correction capacitor is set as C5<<C4, so Vc4 can be disregarded. That is, Vc5 is modulated parabolically with the vertical period by modulating Vm. Therefore, as shown in FIG. 8, the voltage of the horizontal period Vc5 modulated parabolically with the vertical period appears across the S-shape correction capacitor C5.
By using the voltage waveform modulated parabolically with the vertical period, inner pincushion distortion which occurs different horizontal linearities in the upper/lower and the center parts of the screen and occurs a shrinkage in the center part of the screen, is corrected to a uniform pincushion distortion as shown with the dotted line and the solid line in FIG. 9(a). Such corrected pincushion distortion is further corrected as shown in FIG. 9(b) by adjusting the parabolic wave by a DPC (Dynamic Pincushion Correction) circuit.
FIG. 10 shows the circuit diagram of a diode modulator circuit of positive system. Compared with the diode modulator circuit of the negative system shown in FIG. 7, the emitter of the horizontal output transistor Q1 is connected with the reference potential point and the diode D2 is connected serially in the same direction as that of the damper diode D1. In this circuit, the resonant capacitor C1 is removed between the collector of the horizontal output transistor Q1 and the reference potential point. In the circuit shown in FIG. 7, distortion is corrected by using the negative potential at the point C, but in the circuit shown in FIG. 10, such correction is performed by using the positive voltage at the point C.
However, the circuits shown in FIG. 7 or 10 are disadvantageous in the substrate area and the cost, because large parts such as coils and capacitors are employed. In addition, each time the inductance of a deflection yoke and the curvature of a picture tube change due to the model change, it is necessary to redesign the part constants, which is troublesome.


Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

1. Field of the Invention
This invention generally relates to detecting defects on a wafer using defect-specific and multi-channel information.
2. Description of the Related Art
The following description and examples are not admitted to be prior art by virtue of their inclusion in this section.
Inspection processes are used at various steps during a semiconductor manufacturing process to detect defects on wafers. One important goal for any wafer inspection system is to suppress nuisance defects. Nuisance defects are detected events which may not be relevant to semiconductor yields. Nuisance defects may be caused by wafer noise and system noise or are physical objects on the wafer. Nuisance defects may appear anywhere on a wafer. In contrast, some defects of interest (DOI) may appear at only certain locations on a wafer.
Context information for a DOI may be used as prior knowledge for defect detection. Several approaches that use context information have been developed to detect defects. One such approach uses graphical data stream (GDS) data or design information to find hot spots where defects may occur at a higher probability and to inspect defects around the hot spots. Another such approach matches defect background and keeps or removes matched defects after defect detection.
There are, however, a number of disadvantages to such approaches. For example, the first approach works with GDS data. However, GDS information may not be available in all circumstances such as for defect engineers in semiconductor fabrication plants. In addition, the user may need software that is separated from inspection software to find the defect areas. Furthermore, the user needs to do pixel-to-design alignment (PDA) and run-time swath-based alignment to overlap care areas accurately on the images. Since a swath image which covers the entire die is very large, image distortion may cause alignment inaccuracies. If swath-based alignment fails, the locations covered by the swaths will not be inspected.
The second approach, which is performed after defect detection, can significantly slow down inspection if the defect count and types of nuisance defects are relatively large. In addition, if the defect signal is relatively weak, huge amounts of nuisance defects may be detected. The defect signal may be defined as the maximum gray-level difference between an image with a defect and a reference image without the defect. The reference image is spatially-aligned with the defect image and may be acquired from neighboring dies or from multiple dies on the wafer. Furthermore, if the methods are performed for keeping systematic DOIs, other nuisance removal mechanisms are needed to separate nuisance defects and randomly-distributed DOIs.
None of these approaches use defect-specific information and a multi-channel system with multiple optics modes to acquire wafer and defect information.
Accordingly, it would be advantageous to develop methods and/or systems for detecting defects on wafers that do not have one or more of the disadvantages described above.

Detecting defects on a wafer using defect-specific and multi-channel information


A method and apparatus for operating a gas sensor are disclosed. In an embodiment a method for operating a gas sensor includes providing, by at least one gas sensor element, a sensing signal and correcting, by a neural network, the sensing signal, wherein the neural network comprises an input layer, an output layer and at least one hidden layer, wherein the input layer comprises a given number k>1 of input neurons for each gas sensor element, and wherein a respective gas sensor element provides its sensing signal to one of the corresponding input neurons dependent on a measurement parameter applied to the at least one gas sensor element.

More and more sensors are being used in smartphones. Most of them have a human counterpart:
Eyes↔camera, ears↔microphone, sense of touch↔touchscreen, sense of balance↔gyroscope etc.
What is still missing is the sense of smell. Recently new miniaturized gas sensors capable of detecting different gases have been introduced, which are cheap and small. In many applications it is sufficient to just measure one gas. But from an application perspective it is much more interesting to detect more than one gas. There are many different ways of building such a multi-gas sensor. However, today's gas sensors are either very complex or not very reliable.

Method and apparatus for operating a gas sensor


A dishwasher tub includes a bottom wall having a sump basin formed therein for containing a reservoir of washing fluid. The sump basin has an upper rim having a rear portion spaced inwardly from the rear edge of the bottom wall, opposite side portions spaced inwardly from the opposite side edges of the bottom wall, and a front portion spaced inwardly from the front edge of the bottom wall. The rim of the sump forms two spaced apart leg portions of the basin which extend forwardly into close proximity to the front spaced apart corners of the front wall of the tub. In addition to the sump basin, the bottom wall includes front, rear, and opposite side margins sloping upwardly from the rim of the sump basin to the rear, side, and front walls of the dishwasher tub. The resulting sump basin has a horseshoe-shaped configuration.

The present invention relates to a dishwasher tub bottom wall construction.
Prior art dishwashers normally include a bottom wall which functions as a reservoir for washing fluid. The washing fluid is filled into the bottom of the dishwasher to a predetermined level. A pump in the bottom of the dishwasher tub takes in the washing fluid through an inlet opening and pumps the washing fluid to various spray arms located within the dishwasher. The pump forces the washing fluid out through the spray arms where it engages and washes the dishes. The washing fluid then falls to the bottom of the dishwasher and is recirculated by the pump.
Prior art dishwashers often have a heating coil or element located within the bottom of the dishwasher. The heating coil heats the air after the dishes have been washed to help dry the dishes. In some cases the heating coil is used to increase the temperature of the washing fluid or water above the hot tap water temperature. This feature will become increasingly more important in the future in view of recent energy conservation measures which encourage homeowners to maintain tap water temperature below 140.degree. Fahrenheit. A temperature of 140.degree. Fahrenheit or higher is preferable for obtaining satisfactory washing results because certain fats require higher temperatures before dissolving.
Water conservation has also become an increasingly important feature for dishwashers, particularly in areas of the country which have water shortages. Not only is the conservation of water important, but because the water is heated, a reduction in the amount of water used also results in a reduction of the energy needed to heat that quantity of water.
Some dishwashers utilize a plastic molded tub formed from a plastic which for proper functioning should be kept at temperatures below 200.degree. to 250.degree. Fahrenheit. Most heating elements utilized in dishwashers, however, may reach surface temperatures of 800.degree. to 1,000.degree. Fahrenheit. It is therefore important to provide a dishwasher construction which prevents the plastic from being heated beyond the maximum temperature at which it will function properly, while at the same time accommodating a heating element wherein the element surface temperature reaches 800.degree. to 1,000.degree. Fahrenheit.
Another problem sometimes encountered in dishwashers is the accumulation of food particles in the bottom of the dishwasher. A desirable feature of any dishwasher bottom wall construction is that any food particles are swept into the pump for discharge by the pump into a drain after the dishwashing operation is complete.


A semiconductor device includes: a first insulating layer with a flat surface formed over a semiconductor substrate structure in which a plurality of semiconductor elements are formed; column-like conductive plugs formed to penetrate the first insulating layer in the thickness direction; elongated wall-like conductive plugs formed through the first insulating layer in the thickness direction; a second insulating layer with a flat surface formed on the first insulating layer covering the column-like conductive plugs and the wall-like conductive plugs; and first wirings having dual damascene structures. Each of the first wirings has a first portion penetrating the second insulating layer in the thickness direction and connected to at least one of the columnar conductive plugs, and a second portion formed in the second insulating layer to an intermediate depth and apparently intersects at least one of the wall-like conductive plugs when viewed above.

A) Field of the Invention
The present invention relates to a semiconductor device and its manufacture method, and more particularly to a semiconductor device having crossing cubic wirings and its manufacture method.
B) Description of the Related Art
As an integration degree of semiconductor devices is improved, wirings are becoming finer. An integration degree of lower layer wirings near a semiconductor substrate is particularly high and there is high demands for miniaturization. Even if wirings are made fine, it is desired to lower parasitic resistance and parasitic capacitance. Various proposals have been made for lowering parasitic resistance and capacitance.
A conductive plug is formed by forming an insulating film on an underlying layer having a conductive layer, forming a contact hole for the conductive layer, embedding polysilicon or tungsten in the contact hole by chemical vapor deposition and removing an unnecessary portion by etch-back or chemical mechanical polishing (CMP).
After the connection region is led upward by the conductive plug, a damascene wiring is used often. The damascene wiring is formed by forming an insulating film, forming an interlayer connection via hole and a wiring trench in the insulating film, embedding a conductive layer in the via hole and wiring trench and removing an unnecessary portion by CMP or etch-back. For example, after the via hole and wiring trench are formed, a barrier layer of TiN, TaN or the like and a copper layer are formed by sputtering, and a copper layer is formed by electroplating. This method is suitable for forming a wiring having a high precision by using copper with a low resistivity.
There are high demands for improving an integration degree of a semiconductor device having a repetitive pattern such as memories. Various proposals have been made for improving wiring patterns. It is necessary to form in addition to a control gate, a ground source wiring and a read drain wiring (bit line) for a flash memory. Crossed wirings are therefore necessary.
JP-A-2001-244353 proposes to form a wall-like conductive plug extending along a word line direction for a source diffusion layer of a flash memory element, and form an isolated column-like conductive plug for the drain diffusion layer.
FIGS. 11A, 11B, 11C and 11D show a typical wiring structure disclosed in JP-A-2002-244353. FIG. 11A is a plan view. FIGS. 11B, 11C and 11D are cross sectional views taken along lines III-III, IV-IV and V-V, respectively.
Referring to FIG. 11A, a first source line SL1 is a wall-like conductive plug connected to a source diffusion layer of a memory device, disposed vertically in FIG. 11A and being parallel to a word line. A drain contact plug DCP is an isolated column-like conductive plug formed on each drain diffusion layer of the memory device. A drain line DL is a drain wiring disposed horizontally in FIG. 11A and connected to the drain contact plug DCP. An insulating layer is involved between the drain line DL and first source line SL1. A second source line SL2 and the drain line DL are alternately disposed horizontally.
As shown in FIG. 11B, the drain contact plug DCP is a column-like plug made of a first drain contact plug DCP1 buried in a first interlayer insulating film IL1 and a second drain contact plug DCP2 buried in a second interlayer insulating film IL2 and stacked on the first drain contact plug DCP1. The drain line DL is formed by growing a conductive film of Al or the like on the second interlayer insulating film IL2 and pattering the film.
Stacked on a semiconductor substrate 130 are a tunnel insulating film 132, a floating gate 133, an insulating film 134, a word line (control gate) WL and a protective oxide film 136, and on this lamination structure, a silicon nitride film 137 and the first interlayer insulation film IL1 are formed. In the following, the first interlayer insulating film IL1 and silicon nitride film 137 are collectively called the first interlayer insulating film IL1.
As shown in FIGS. 11B and 11C, the first source line SL1 is buried in the first interlayer insulating film IL1 and extends parallel to the word line WL. A ground line resistance is lowered by forming the wall-like conductive plug having the same height as that of the first interlayer insulating film IL1.
As shown in FIG. 11D, the second source line SL2 has the structure similar to the drain line DL and extends parallel to the drain line. A source contact plug SCP is formed in the second interlayer insulating film at the position where the first source line SL1 and second source line SL2 cross, to electrically connect the first and second source lines.
The first drain contact plug DCP1 and first source line SL1 are formed in a self-alignment manner relative to the word line WL to improve an integration degree. However, as shown in FIG. 11D, the second drain contact plug cannot be formed under the second source line SL2 so that the memory elements under the second source line SL2 are dummy. This publication does not teach mixture of a memory circuit and a peripheral circuit.
Similar structures to the structure of the above-described conductive plug are also disclosed in JP-A-HEI-7-74326, JP-2001-111013 and JP-A-2001-203286.
Patent Document 1
JP-A-2001-244353
Patent Document 2
JP-A-HEI-7-74326
Patent Document 3
JP-A-2001-111013
Patent Document 4
JP-A-2001-203286
If a memory circuit and a peripheral logic circuit are mixedly mounted, wirings of the memory circuit are required to have a low parasitic capacitance, and wirings of the peripheral logic circuit are required to have a low parasitic resistance. These requirements are hard to be met by using the same wiring structure. In order to meet these requirements, it is effective that thin wirings are formed in the memory circuit and thick wirings are formed in the peripheral circuit.
Thin wirings in the memory circuit and thick wirings in the peripheral logic circuit can be formed by etching and lowering a lower interlayer insulating film in the peripheral circuit, forming an etch stopper layer and an upper interlayer insulating film and forming damascene wirings.
Patent Document 5
JP-A-HEI-10-223858
Patent Document 6
JP-A-HEI-10-200075
Thick and thin wirings can also be formed by performing wiring trench forming etching twice by using different masks to form deep and shallow trenches, and embedding wirings in the trenches.
Patent Document 7
JP-A-HEI-11-307742
Patent Document 8
JP-A-HEI-9-321046
Patent Document 9
JP-A-2000-77407

Semiconductor device and its manufacture method


A new and distinct Echeveria hybrid plant named ‘AMIECH2001’ which is characterized by an abundance of foliage held upright in a basal rosette, foliage with lightly serrulate and moderately undulate margins, light greyed-green foliage that is margined nearly white and lightly suffused with blue-green, and the stability of these characteristics from generation to generation.

Parentage: 'AMIECH2001' is an interspecific hybrid seedling selection resulting from the controlled pollination of an unnamed Echeveria elegans plant (not patented), the seed parent, with an unnamed Echeveria shaviana plant (not patented), the pollen parent. The crossing was made by the inventor in the spring of 2013 at a commercial greenhouse in Heerhugowaard, the Netherlands. In summer of 2014, one seedling was observed which exhibited unique growth and foliage characteristics. The seedling was isolated for further evaluation in order to confirm the distinctness and stability of the characteristics first observed. In the winter of 2014, upon confirmation of distinctness and stability, 'AMIECH2001' was selected for commercialization.
Asexual Reproduction: Asexual reproduction of the new cultivar 'AMIECH2001', by way of rooting leaf cuttings, was first initiated in the autumn of 2015 at the inventor's commercial greenhouse in Heerhugowaard, the Netherlands. Through five subsequent generations, the unique features of this cultivar have proven to be stable and true to type.