This invention relates to the storage under pressure in a container and subsequent transport of the filled pressurized container of particular natural gas or natural gas-like mixtures that contain methane or natural gas plus an additive, and which mixtures have been refrigerated to less than ambient temperature. (This invention also relates to a similar mixture which has been created by the removal of methane or a lean gas from a richer natural gas mixture.)

As is well known, natural gas defines a very broad range of gas compositions. Methane is the largest component of produced natural gas, and usually accounts for at least 80% by volume of what is known as marketable natural gas. Other components include, in declining volume percentages, ethane (3%-10%), propane (0.5%-3%), butane and C4 isomers (0.3%-2%), pentane and C5 isomers (0.2%-1%), and hexane+and all C6+ isomers (less than 1%). Nitrogen and carbon dioxide are also commonly found in natural gas, in ranges of 0.1% to 10%.
Some gas fields have carbon dioxide contents of up to 30%. Common isomers found in natural gas are iso-butane and iso-pentane. Unsaturated hydrocarbons such as ethylene and propylene are not found in natural gas. Other contaminants include water and sulphur compounds, but these must typically be controlled to very low levels prior to sale of the marketable natural gas, regardless of the transport system used to get the produced gas from wellhead to market.
Secord and Clarke in U.S. Pat. Nos. 3,232,725 (1963) and 3,298,805 (1965) describe the benefits of storage of gas at conditions of temperature and pressure which occur when the gas exists at a single dense phase fluid state, at pressures just above the phase transition pressure. This state is shown in the generic phase diagram (taken from U.S. Pat. No. 3,232,725) attached hereto at FIG. 12, and is shown as occurring within the dotted lines on the diagram.
The relation between pressure, volume and temperature of a gas can be expressed by the Ideal Gas Law, which is stated as PV=nRT where, using English units:
P=pressure of the gas in pounds per square inch absolute (psia)
V=volume of the gas in cubic feet (CF)
n=number of moles of the gas
R=the universal gas constant
T=temperature of the gas in degrees Rankin (degrees Fahrenheit plus 460)
The Ideal Gas Equation must be modified when dealing with hydrocarbon gases under pressure, because of the intermolecular forces and the molecular shape. To correct for this, an added term, the compressibility factor z must be added to the Ideal Gas Equation such that PV=znRT. This z is a dimensionless factor that reflects the compressibility of the particular gas being measured, at the particular conditions of temperature and pressure.
At or near atmospheric pressure, the z factor is sufficiently close to 1.0 that it can be ignored for most gases, and the Ideal Gas Equation can be used without the added z term.
However, where pressures exceed a few hundred psia the z term can be much lower than 1.0 so that it must be included in order for the Ideal Gas Equation to give correct results.
According to the van der Waal's theorem, the deviation of a natural gas from the Ideal Gas Law depends on how far the gas is from its critical temperature and critical pressure. Thus, the terms Tr and Pr (known as reduced temperature and reduced pressure respectively) have been defined, whereTr=T/TcPr=P/PcWhere,
T=the temperature of the gas in degrees R
Tc=the critical temperature of the gas in degrees R
P=the pressure of the gas in psia
PC=the critical pressure of the gas in psia
Critical pressures and critical temperatures for pure gases have been calculated, and are available in most handbooks. Where a mixture of gases of known composition is available, a "pseudo critical temperature" and "pseudo critical pressure" which apply to the mixture can be obtained by using the averages of the critical temperatures and critical pressures of the pure gases in the mixture, weighted according to the mole percentage of each pure gas present. The pseudo reduced temperature and the pseudo reduced pressure can then be calculated using the pseudo critical temperature and the pseudo-critical pressure respectively.
Once a pseudo reduced temperature and pseudo reduced pressure are known, the z factor can be found by using standard charts. An example of one of these is "FIG. 23-3 Compressibility Factors for Natural Gas", by M. B. Stranding and D. L. Katz (1942), published in the Engineering Data Book, Gas Processors Suppliers Association, edition (Tulsa, Okla., U.S.A.) 1987 (and a copy of that chart is attached hereto as FIG. 13).
One aspect of the prior art is described in U.S. Pat. No. 6,217,626 "High pressure storage and transport of natural gas containing added C2 or C3, or ammonia, hydrogen fluoride or carbon monoxide". That patent describes a method for storing and subsequently transporting gas by pipeline whereby adding the light hydrocarbons of ethane and propane (or ammonia, hydrogen fluoride or carbon monoxide) can increase the capacity of the pipeline or can reduce the horsepower required on a pipeline to propel such a gas mixture down the line. The primary claim is for creating a mixture by addition of propane of ethane where the product of the z factor (z) and the molecular weight (MW) for the new mixture reduces as compared to a mixture without the added ethane or propane, yet where there is no presence of liquids, only a single phase gas vapor.
The benefit arises because of the gas pipeline flow equation. There are several forms of this equation, but they all have the following features in common:Flow=constant 1 [((P1^2−P2^2)/(S*L*T*z))^0.5 ]*(D^2.5)Where:
PI=starting pressure in a pipeline
P2=ending pressure in a pipeline
S=specific gravity of the gas (which is equivalent to molecular weight)
L=length of the pipeline
T=temperature of the gas
z=compressibility factor of the gas
D=internal diameter of the pipeline
In this equation, the two factors that are altered by changing the gas composition are the specific gravity (or molecular weight) "S", and the z factor "z". Both of these appear in the denominator of the equation. Therefore, if the product of z and MW or "S" reduces, and all other factors remain constant, flow on the pipeline will increase at a similar pressure differential between the starting and ending points. This is a benefit in pipeline transmission, which can be described either as a capacity gain or a reduced horsepower requirement to propel a given volume down the pipeline.
The primary claim in the U.S. Pat. No. 6,217,626 is adding C2 or C3 to natural gas for a reduction in the product of z and MW (or S), above a pressure of 1000 psig and with no discernible liquid formation. The benefits described under the patent relate to increased capacity or reduced horsepower on a pipeline.
The teachings under the patent describes a mixture in which the primary barrier to increasing benefits is the two-phase state created if too much NGL is added to the gas. This two-phase state leads to physical damage of the pipeline equipment, and reduced flow, and must be avoided. Several of the subsequent claims limit the amount of ethane to 35% and the amount of propane to 12% in order to avoid this two-phase state on the pipeline. Several of the claims state a minimum amount of added ethane and propane, again based on the benefits in pipeline application. No mention is made in U.S. Pat. No. 6,217,626 of adding any hydrocarbons heavier than propane, such as butane or pentane, and in fact, the teachings describe how these heavier hydrocarbons should be avoided, as they lead to premature development of the two-phase state. See page 6, "Thus C4 hydrocarbons are not additives contemplated by this invention." Furthermore, "The presence of more than 1% C4 hydrocarbons in the mixture is not preferred, however, as C4 hydrocarbons tend to liquefy easily at pressures between 1000 psia and 2200 psia and more than 1% C4 hydrocarbons give rise to increased danger that a liquid phase will separate out. C4 hydrocarbons also have an unfavorable effect on the mixture's z factor at pressures under 900 psia so care should be taken that, during transport through a pipeline, mixtures according to the invention that contain C4 hydrocarbons are not allowed to decompress to less than 900 psia and preferably not to less than 1000 psia.
The control mechanism proposed in the '626 invention to avoid the two-phase state is thus the type and amount of NGL added to the mixture. This is because, in a pipeline, temperature and pressure are usually exogenous variables, not subject to any fine degree of control. Refrigeration is mentioned only once in '626, and in a negative sense. While some of the claims deal with mixtures down to a temperature of −40 degrees F., the following statement appears on page 10 of the '626 patent: "Even more preferred pressures are 1350-1750 psia (which gives good results without requiring vessels to withstand higher pressures) and particularly preferred temperatures are 35 to 120 degrees F. (Which do not require undue refrigeration)". The benefits of the invention are illustrated in the graphs attached to '626, which all terminate at a lower temperature limit of 30 to 35 degrees F. Even though the pipeline flow equation illustrates that pipelines are more efficient at colder temperatures (see the factor T in the denominator), no analysis is provided at lower temperatures. This is primarily because refrigeration is not practical in pipeline applications, as the pipe temperature should be above the freezing point of water, in order to prevent frost build up on and around the pipeline.
It is clear that the invention in U.S. Pat. No. 6,217,626 is based on preparation in storage of a fluid with the stated desire of subsequent pipeline transport, and that no refrigeration is contemplated, that the type and minimum amount of NGL added is limited by the benefits provided in pipeline transport, that the type and maximum amount of NGL added is limited by the two-phase problem which will occur on the contemplated pipeline transmission, and that the pressure regime is limited by the subsequent pipeline transmission. While the prior art implies benefits for both storage and pipeline transport, the storage aspect of the prior art is limited to or by pipeline applications, and does not contemplate storage in containers which are themselves later transported.
Another aspect of the prior art is contained within U.S. Pat. No. 5,315,054 "Liquid Fuel Solutions of Methane and Light Hydrocarbons". This patent deals with a method to store a liquid product where Liquified Natural Gas (LNG) is put into an insulated tank at a temperature of about −265 degrees F. Both methane and NGL are introduced into the tank, the methane and LNG is dissolved in the NGL hydrocarbon solution (typically propane or butane), and the resulting mixture is stored as a stable liquid under moderate pressure. This invention does not contemplate storage as a single dense phase fluid, and it is also conditional upon LNG being present in the tank to begin with.
Another aspect of the prior art is described in U.S. Pat. Nos. 5,900,515 and 6,111,154 "High energy density storage of methane in light hydrocarbon solutions". This invention is similar to the previous example 315,054 and is described as the "dissolution of gaseous methane into at least one light hydrocarbon into a storage tank" and "storage of the solution". In addition, the solution has to be maintained at a temperature above −1 degree C. at a pressure above 8.0 Mpa comprise a maximum of 80% methane and have an energy density of at least 11,000.
Another aspect of the prior art is described in the previously referenced U.S. Pat. No. 3,298,805 which describes storage of natural gas under pressure, without any additives, at or near the phase transition pressure but at a temperature below the critical temperature of methane (−116.7 degrees F.). This is a continuation of U.S. Pat. No. 3,232,725 which describes storing natural gas under pressure, again without any additives, at or near the phase transition pressure at a temperature 20 degrees (F.) below ambient temperature.
Another aspect of the prior arts is described in U.S. Pat. No. 4,010,622 which describes adding hydrocarbons in the range of C5-C20 sufficient to liquefy the gas at ambient pressure and store it as a liquid, which is given as an example with bearing on the formulae expressed above, but not of much relevance to this invention.

Method and substance for refrigerated natural gas transport


Slacking off device (24) for use on a drilling device (2) for rock drilling. The drilling device (2) comprises a rock drill (4) to which a drill string (10) is adapted to be jointed by means of a thread joint. The drill string (10) comprises an arbitrary number of drill rods (12, 14, 16) which are adapted to be jointed together by means of thread joints. The drilling device (2) comprises a driving device for forward and back rotation of the drill string (10). The slacking off device (24) comprises a clamping device (25) arranged to clamp up the drill string (10) and a separate striking device (33) arranged to strike with an angle towards the longitudinal direction of the drill string (10) of principally 75°-105° on a first (32) of any of said thread joints under back rotation so that an impressed torque on the drill string (10) is obtained in a thread slacking rotation direction to provide slacking of the first thread joint (32).

Drill rods are rods that usually have a male thread in one end and a female thread in the other end. A common drill rod may be 6 m long but may extend to up to ca 10 meters. A number of drill rods, that have been jointed by screwing the male thread in a drill rod together with the female thread in the adjacent drill rod in thread joint, form a drill string whose length commonly is 50 meters long, up to 100 meters. One end of the drill string culminates in a drill bit which drills into the rock when it strikes and rotates. The other end of the drill rod is jointed to a driving device via a shank adapter. At operation the drill string strikes and is rotated by means of the driving device that is arranged on a drill rig from which the drill string projects. When almost all of the drill string is drilled into the rock, the drill string is lengthened with one drill rod at a time by slacking the drill string from the shank adapter and screwing another drill rod on the other end of the drill string and the shank adapter.
At drilling with high torques on the drill string a strong tightening of the thread joints of the drill string is often obtained. To be able to slacken these thread joints, the striking apparatus is allowed to continue to strike on the drill string in axial direction after drilling of the hole has been completed to shake loose the first thread joint to be slackened, i.e. the thread joint that joints the shank adapter with its closest drill rod. This leads to large loadings on drill rig, feeding beam, drill and drill steel. In addition is not sure that the drill rod that is closest to the shank adapter slackens off, but that another rod joint that is inside the rock. There is then a risk that parts of the drill string are lost, especially if the drilling takes place downwards the rock and the drill string is affected by the gravitation. This is a time consuming process that requires a large torque in back rotation in order for the drill string to slacken off.
WO0201041 discloses a method to slacken joints in drill steel in a drilling device. At slacking the pressure from a striking device on the drill steels and the joint receives a gentle axial impact as mentioned above. The drill steel is held simultaneously as it is rotated.
WO 03/033858 shows a striking device with a striking head, which striking device is adapted to reduce torque between two jointed drill rods at slacking off. The device is manually turned to the drill rods to be slackened and manually damped around these by an operator. The device clamps around the jointed drill rods from two diametrically different directions. This is done by a transferring arm on the striking device pressing on the jointed drill rods against the very striking head on the striking device by means of a coil spring. The striking head, i.e. one of the clamping points then strikes with radial strikes against or close to the joint to decrease the tensions that result due to deformations in the joint. The drill steels are then relatively rotated and thereby detached. This is a complicated device that must be manually handled. In addition it is difficult to achieve stability since one of the clamp points also is strike point, which means that the clamping power decreases when the striking head is on its way back and until a new strike comes. This may also imply a risk that parts of the drill string are dropped, especially if the drilling takes place downwards the rock and is affected by the gravity.


A technique for accessing an electronic commerce function (ECF) is provided. A first signal identifying an entity and an ECF associated with the entity is transmitted to a user from a contact list service. The user selects the ECF, causing a second signal indicating the selection to be transmitted to the contact list service. In response to receipt of the second signal, the contact list service transmits a third signal. The third signal identifies a network address associated with an electronic commerce service provider for providing and/or facilitating the ECF. The third signal also identifies information associated with the entity. The third signal, either directly or indirectly, is operable to cause a fourth signal to be transmitted to the user from the service provider. The fourth signal includes information associated with invoking the ECF and is based upon the information associated with the entity included in the third signal.

Many computing applications, including Web-based applications, have user-specific and application-specific lists of contacts or other entities that are acted upon by that computing application. For example, an e-mail client, such as Microsoft Outlook or Lotus Notes, typically contains a personal address book, and an electronic billing and payment (EBP) client, such as CheckFree's WebBillPay (WBP), contains a payee list. These entity lists are commonly referred to as contact lists. A primary benefit of such contact lists is elimination of repeated user entry of the same data within an application.
Some applications "scrub" user supplied contact list data to ensure that improved information is consistently utilized by the application. Scrubbing can include normalizing and/or correcting user supplied data. For example, an application might correct a name, address, funding account information, or a user's account number with a payee. Often a user is unaware that contact list data has been scrubbed. That is, when accessing a contact list, a user may see the originally supplied contact list data, while the computing application may actually utilize scrubbed data in providing functionality to the user.
The scope of each contact list is restricted to its application context. Thus, there may be redundancy in the data between contact lists associated with various computing applications. For example, an e-mail client address entry might contain a name and an e-mail identifier (address), and possibly address/phone information, while an EBP client payee entry might contain the same name and address information, and possibly e-mail identifier. Beyond the same information being stored in multiple locations, i.e., in association with multiple applications, a user must input and update this same information repeatedly, i.e., into each application. This multiple information entry, as will be recognized, is at best inefficient.
Computing applications presuppose a function-centric application invocation metaphor. In other words, a user first launches or otherwise access a computing application, then selects a function to perform within the accessed computing application, and then finally specifies the data to be operated upon by the accessed computing application, perhaps from an available contact list.
While computing applications are function-centric, in some computing domains there is precedence for a data-centric approach in which data is presented via a user interface first, then a function is selected and applied to an element of the data. A simple example is the list of folders/files in the My Documents folder of the Window's operating system. From the My Documents folder a user can right-click on one of the displayed items in the folder (stored files) to bring up a set of function choices that can be performed on that selected file, such as opening the selected file, or deleting the selected file.
There also are computer-based "rolodex" type lists that exist just on their own, independent of any computing application. For example, personal digital assistants (PDAs) such as Palm devices, can maintain an address book conveniently populated through a PC-based user interface. These contact lists are currently incapable of doing more than integrating with other tools (typically e-mail or calendar clients through synchronization). Thus, these type contact lists cannot be used to drive application functionality.
A "Web service" is a network accessible interface to application functionality built using standard Internet technologies. Web services are also known as "common services." A collection of software and tools that enable developers to create, deploy, and access Web services has been proposed by Microsoft. It is important to understand that even though Microsoft's software suite for enabling Web services, known as the .NET platform, is perhaps the most well known, it is by no means the only way to build or use Web services.
A component of Microsoft's original .NET proposal was to offer to consumers a suite of commonly used Web services, dubbed Microsoft .NET My Services. Two of the proposed services are .NET My Contacts, which stores an electronic relationships/address book for a subscriber at a network location distinct from a subscriber's computer, and .NET Passport, which is a subscriber authentication service.
.NET Passport, which has been introduced by Microsoft into the marketplace, allows participating subscribers to create one sign-in name and password for use across participating .NET Passport sites. Additionally, subscribers can save time and avoid repetitive data entry by storing basic demographic information that can be shared with .NET Passport sites. When a subscriber signs in to a participating .NET Passport site, .NET Passport sends the subscriber's identifying information such as ZIP Code, country/region, and city information to the site upon request, or, alternatively a .NET Passport data repository can be accessed by participants in the Web service. Subscribers can also choose to provide more personal information, such as their nickname, E-mail address, age, gender, and language preference.
.NET My Contacts, as disclosed by Microsoft, will allow subscribers to store "address book" type of information, presumably protected and accessed through Passport, at a central location. Microsoft has not defined a user interface for My Contacts, or proposed use scenarios, including interactions between .NET My Contacts data and applications, particularly in the context of EBP.
As will be understood from the discussion above, data stored in existing contact lists and proposed contact lists cannot be utilized by multiple applications. Also, existing and proposed contact lists cannot trigger application functionality. Further, existing and proposed contact lists are not structured such that flexible access control over various aspects of contact information, including population and/or modification of some data by other than the user, is available.
Accordingly, a need exists for an application-independent contact list in which contact data stored therein can be utilized by multiple applications. Also, a need exists for a contact list user interface that supports the triggering of one or more of multiple applications based upon selection of contact data. And, a need exists for an application-independent contact list that provides flexible access control over various segments of contact information, including the ability to allow population or modification of at least a portion of contact data by one or more entities other than a user.
Introduced above, existing EBP computing applications have a function-centric process flow. That is, to direct an EBP transaction a user must first trigger or otherwise access an EBP application, which may be Web-based. After triggering the EBP computing application, the user must select a function (transaction type) to be executed by the accessed EBP computing application. Then, the user must specify or select data, sometimes from an application-specific contact list, associated with the desired function. The specified or selected data might be a payee name, an electronic biller name, or other data, such as an account identifier or date. Only after the user has performed these steps is the desired function executed by the accessed EBP computing application. Thus, due to the function-centric nature of EBP applications, a user cannot conveniently access EBP functionality. He or she must first access an EBP computing application, select a function to be performed, and then select data to be utilized with the selected function. A data-centric EBP process flow would eliminate steps, allowing instant access to desired functionality.
Accordingly, a need exists for an EBP process flow that is data-centric, rather than function-centric.

System using contact list to identify network address for accessing electronic commerce application


A surge detection system for use in a fluid system having a load driven by a centrifugal compressor, the compressor being driven by an electric motor. The surge detection system comprises a means for sensing a differential pressure developed across the compressor and a means for sensing a current representing input power to the motor. The surge detection system further comprises a first computing means responsive to the differential pressure developed across the compressor for indicating when a valid surge is occurring in the compressor, and a second computing means responsive to the variable speed drive current for indicating when a valid surge is occurring in the compressor.

1. Field of the Invention
The present invention relates generally to surge detection devices, and, more particularly, to methods and apparatuses for detecting surge in a compressor of a compressor-driven system, such as a refrigeration system.
2. Description of the Related Art
As is generally known, surge or surging is an unstable condition that may occur when compressors, such as centrifugal compressors, are operated at light loads and high pressure ratios. It is a transient phenomenon characterized by high frequency oscillations in pressures and flow, and, in some cases, the occurrences of a complete flow reversal through the compressor. Such surging, if uncontrolled, causes excessive vibrations in both the rotating and stationary components of the compressor, and may result in permanent compressor damage. In particular, at surge conditions there exists a momentary reduction in flow and pressure developed across the compressor. Further, there is a reduction in the net torque and mechanical power at the compressor driving shaft. In the case where the drive device is an electric motor, these oscillations in torque and power will cause oscillations in motor current and excessive electrical power consumption.
While a number of surge detection devices and systems have been utilized, there exists a need for an improved surge detection arrangement, particularly but not exclusively, for use in refrigeration systems having a centrifugal compressor driven by an electric motor.

Methods and apparatuses for detecting surge in centrifugal compressors


A vibration isolator including at least one bearing element or assembly providing a contact interface along which structural elements connected together by the vibration isolator are allowed to substantially freely move within a limited range one relative to the other, with the effect of isolating the respective structural elements from vibrations or vibratory movements of the other structurally element, particular those vibratory movements directed or oriented at least generally along or parallel to the contact interface, with particular effect for isolating low frequency vibratory movements.

Vibration generally, and particularly of structural elements supporting humans and sensitive equipment and apparatus, can have many negative effects. Such negative effects can include, but are not limited to, discomfort to, and premature fatigue of, human operators and passengers, and noise and degradation of equipment.
A category or type of vibrations generated during operation of vehicles, and particularly, work machines such as those used in agricultural, construction, mining, forestry and earthmoving applications, hereinafter sometimes collectively referred to by the term "work machine", is low frequency, relatively high amplitude vibrations, having generally horizontal or planar vectors or components. Such low frequency horizontal vibrations can be especially discomforting to human operators and passengers of the vehicles and machines who are supported on structures such as operator and passenger cabs and seats, and who are subjected to such vibrations for long periods of time.
Vibrations of this category can include horizontal vibrations, including fore and aft and side-to-side vibrations; pitch vibrations; roll vibrations; and yaw vibrations, and can result from one or more sources, including environmental and external sources, such as rough terrain and roads over which a work machine passes, and internal sources, such as engine and power train operation, lugged wheel rotation, and particularly, operation of various systems of a work machine. In this latter regard, agricultural work machines, and specifically harvesting machines such as combines, windrowers and cotton harvesters, can include multiple operating systems in addition to the power plant and drive train, which generate a multitude of potentially annoying and discomforting low frequency vibrations. Towing loads, such as grain carts, by a harvesting machine or tractor, can also generate these types of vibratory movements. Such vibrations and vibratory movements are typically within a range of from about 1 to about 20 cycles per second (Hz), and up to as much as about 100 Hz, and can have a wide variety of amplitudes, for instance, of as much as 15 millimeters. The characteristics of the rubber mount will not effectively isolate the low frequency vibrations in the horizontal or vertical directions. Accordingly, generally horizontal, low frequency, high amplitude vibrations and resulting vibratory movements of structural elements of work machines such as those set forth above have been found to be particularly problematic and difficult to isolate or reduce.
Compounding this difficulty, is that a work machine such as a combine, windrower or cotton harvester, may have several sources generating these vibrations in different directions. Examples of systems on a typical agricultural combine which have been found to generate particularly annoying and discomforting low frequency vibrations include the sidewardly reciprocating cutter knife or sickle bar of a small grain header; the fore and aft reciprocating cleaning shoes or sieves of the cleaning system; and various rotating apparatus, including the rotary separator, and numerous conveyor devices. Large lugged tires can also generate annoying low frequency, low amplitude vibrations when rolling.
A variety of mounts and support structures for operator and passenger cabs and platforms, seats, and the like, have been proposed for isolating, damping, and attenuating vibrations of work machines and vehicles. Reference in this regard Ochsner U.S. Pat. No. 4,271,921, issued Jun. 9, 1981 to Deere & Company; Hoefle U.S. Pat. No. 5,368,118, issued Nov. 29, 1994 to Deere & Company; and Higuchi U.S. Pat. No. 6,340,201, issued Jan. 22, 2002 to Hitachi Construction Machinery Co., Limited. However, observed shortcomings of these and other known proposed devices variously include, high complexity and expense; requirements of tuning for achieving desired vibration attenuation; and, in the instance of the latter referenced patent, possible increases in horizontal vibratory movements as a consequence of reducing occurrences of pitching, rolling and yawing vibrations.
It is also well known to use rubbery, viscous, and pneumatic devices for vibration isolation. Essentially, known devices of these types simulate a spring and damper system in connection with a movable mass, for reducing vibration transmission. However, it has been found that such devices still provide only poor reduction of transmission or isolation of the low frequency horizontal vibration and vibratory movements identified as problems above. In particular, known rubbery vibration isolators have been found to only provide satisfactory vibration isolation when the forcing frequency fd of the vibration is significantly larger than the natural frequency fn of the isolator itself. And, when the forcing frequency fd is near or less than the natural frequency fn, the isolator can actually amplify the vibration. One proposed approach to isolate low frequency vibration has been to use a pneumatic mount that has a very low natural frequency. However, this has been found to have negative effects, including high costs, and large size. The effectiveness of pneumatic devices can also be temperature sensitive.
Thus, what is sought is a vibration isolator adapted for isolating low frequency vibrations and vibratory movements, particularly high amplitude, horizontal components or vectors thereof, which overcomes one or more of the shortcomings and/or limitations set forth above, and which is adapted for use in connection with support structures and elements for holding or carrying human operators and passengers on vehicles and work machines, such as agricultural harvesting machines, tractors and the like.

Vibration isolator with limited free movement


An image-forming device includes a plurality of developer cartridges, a developer moving member and a conveying belt. Each of the developer cartridges includes a casing, a developing roller and a leakage restraining member. The peripheral surface of the developer cartridge has a first peripheral part to convey the developer accommodated in the casing and a second peripheral part. The leakage restraining member is disposed between the casing and the second peripheral part and slidingly contacts the second peripheral part so as to restrain the developer from leaking out of the first peripheral part. The developer moving member moves developer leaked from between the second peripheral part and the leakage restraining member out of a predetermined region at a position opposing the leakage restraining member.

Image-forming devices such as laser printers include tandem color image-forming devices that are well known in the art, such as that disclosed in Japanese unexamined patent application publication No. 2003-015378. These types of image-forming devices have a plurality of detachably mounted developer cartridges for supplying developer to the surfaces of respective photosensitive drums.
The developer cartridge generally includes a casing for accommodating developer, and a developing roller rotatably supported in the casing for carrying developer supplied within the casing. An elongated opening is formed in the casing so that a portion of the surface of the developing roller is exposed therethrough and opposes the surface of the photosensitive drum. The developing roller carries developer from the casing on the surface thereof. As the developing roller rotates, the developer carried on the surface of the developing roller comes into contact with the surface of the photosensitive drum and is supplied to the electrostatic latent image formed on the surface of the photosensitive drum. The developer develops the electrostatic latent image into a developer image, and the developer image is subsequently transferred onto a sheet of paper, thereby forming an image on the paper.
In this type of developer cartridge, a side seal is provided on both ends of the developing roller in order to prevent developer from leaking between the ends of the developing roller and the casing.
Japanese unexamined patent application publication No. 2001-60040 proposes fixing a safeguard film formed of PET film on the lower front edge of the casing in the developer cartridge at the front part of the side seals. With this construction, even if developer leaks from the developer cartridge, the safeguard film can minimize the damage caused by such leakage.

Image-forming device and developer cartridge having leakage restraining member and developer moving member


A filling system for a toilet tank prevents continual flow to the tank in the event of a leak from the tank by providing a hydraulically actuated safety valve for halting water flow to the filling valve in the event that the water flow continues for a time longer than an expected time of filling. The safety valve has a valve member connected to a piston mounted in a cylinder defining a first chamber on one side of the piston and a second chamber on the other side. A venturi in the supply duct provides in a low pressure chamber of the venturi a water pressure lower than the supply pipe pressure such that a pressure difference across the piston caused by the difference in pressure between the supply pressure and the low pressure chamber causes the piston to move from the first end toward the second end. A flow control orifice regulates a rate of flow of water such that a time of movement of the piston is greater than an expected time required to fill the toilet tank. A spring biases the piston to return the piston to the first end after the toilet tank is filled.

Standard porcelain toilet tanks may develop leaks due to improper float arm levels, worn ball cocks, corroded flappers or worn or deteriorated tank to bowl gaskets. Porcelain tanks may also crack or fracture due to defects, over tightened tank bolts, fatigue, vibrations or temperature changes. Such a crack can result in flooding of the premises with consequential damage significantly greater than the cost of the damage to the toilet.
It is known therefore to provide devices which time a period of flow of water to a device and shut off the flow when the flow continues after a required period of time.
Such a situation may occur in the event that the tank cracks. More commonly such an event occurs when the flapper valve leaks or sticks open. While the second event may not be catastrophic, if not properly monitored can lead to significant excess water usage.
A device of this type is particularly important in rental accommodations where the occupants may be less attentive to the operation of and costs associated with the devices in the accommodations and may therefore leave a toilet tank filling continuously, provided it operates when required.
A number of devices have been previously provided but many of these require a supply of electricity either from a main supply or a battery supply to provide actuation of electrical components such as timers and solenoid valves. Such devices are of course undesirable and it is much more suitable for an arrangement of this type to be operated solely by the hydraulic pressure and action of the water passing through the valve.


A hose handling apparatus for gripping, advancing, and maneuvering a high pressure hose is provided. The hose handling apparatus comprises a support member comprising a first end, a middle section, and a second end, a generally cylindrical handle detachably connected to and substantially perpendicular to the first end of the support member forming a rigid connection with the support member to provide grip to a user's hand, a first generally cylindrical curvilinear gripping element detachably connected to and substantially perpendicular to the middle section of the support member, and a second generally cylindrical curvilinear gripping element detachably connected to and substantially perpendicular to the second end of the support member. The support member is angled at the middle section. The handle and the gripping elements form a parallel configuration which is perpendicular to a planar surface of the support member. The gripping elements grip the hose positioned between them firmly.

A hose is a flexible tube used for conveying liquids or gases under pressure. The shape of a hose is typically cylindrical. Hoses are made of different materials, for example, nylon, polyurethane, polyethylene, neoprene, canvas, or rubber based on the environment and pressure rating. Hoses are used in gardening, firefighting, underwater diving, agriculture, industries, hydraulics, chemical engineering, and construction. High pressure hoses, made of tight-woven canvas either with rubber lining inside or without lining, are typically used in firefighting where water is discharged through the hose at high pressures using high pressure pumps which, in turn, creates a back pressure on the hose at or near the discharge or outlet section of the hose.
High pressure hoses are often required to be manually held, lifted, or grasped for long periods of time while fighting and extinguishing fires in oil refineries, petrochemical plants, and building structures, for example, apartment buildings, warehouses, etc. Handling these high pressure hoses with a user's hand is difficult. Furthermore, a high pressure hose is difficult to grasp or maneuver when the outside surface of the hose is wet, for example, when the hose is exposed to water from rain, or water discharged from the hose. Firefighters also find it difficult to hold on to, or position the hose due to the back pressure exerted on the hose as the high pressure water is discharged from the hose. Furthermore, maneuvering the high pressure hose to different positions and moving the hose is difficult.
Hence, there is a need for an apparatus that enables a user to handle a hose that is discharging water at a high pressure with an improved grip. There is also a need for an apparatus that enables the user to advance and maneuver the hose without difficulty.


Low-sudsing detergent compositions comprise an N-alkyl polyhydroxy fatty acid amide surfactant, wherein the N-alkyl substituent is at least C.sub.2, preferably C.sub.3 -C.sub.8. Such compositions are useful under cleaning conditions where excessive sudsing may be problematic.

The formulation of detergent compositions containing typical detersive surfactants necessarily results in products which have, to a more or less degree, the inherent tendency to form suds when the compositions are agitated in an aqueous medium. In many circumstances, the formation of suds is desirable, and consumers have come to expect high, rich suds in various shampoo, personal cleansing and hand dishwashing compositions. On the other hand, in certain other compositions the presence of suds can be problematic. For example, most hard surface cleansers are designed to have low suds levels, thereby obviating the need for extensive rinsing of the surfaces after the cleanser has been applied. Likewise, some washing machines, especially European-style front-loading machines which are designed to use substantially less water than the more familiar American style top-loading machines, typically employ higher concentrations of detersive surfactants. Suds levels must be kept low or else the suds can actually spill from such machines. A similar situation occurs with most automatic dishwashing machines where surfactant levels are kept very low and suds controlling agents are used extensively to provide a nearly sudsless cleaning of dishware. Low sudsing can also be advantageous in concentrated laundering processes such as those described in U.S. Pat. Nos. 4,489,455 and 4,489,574.
Considerable attention has lately been directed to the polyhydroxy fatty acid amide class of nonionic surfactants. These surfactants have the advantage that they can be prepared using mainly renewable resources, such as fatty acid esters and sugars, and thereby provide substantial advantages to the formulators of detergent compositions who are seeking non-petrochemical, renewable resources for the manufacture of detersive surfactants. Moreover, the polyhydroxy fatty acid amides exhibit particularly good cleaning performance, especially when used in conjunction with various anionic surfactants. There is considerable impetus to begin using polyhydroxy fatty acid amide surfactants in commercial cleaning compositions of all types.
Unfortunately, many of the polyhydroxy fatty acid amide surfactants are suds boosters and stabilizers, especially when used in combination with conventional anionic surfactants. Accordingly, the formulator of low sudsing detergent compositions either must curtail the use of this desirable class of surfactants when formulating low sudsing detergents, or must use relatively high amounts of suds controlling agents in such compositions.
By the present invention, it has been unexpectedly determined that certain members of the class of polyhydroxy fatty acid amides provide good cleaning performance, but do not undesirably enhance sudsing. Indeed, it has been further discovered that the aforesaid "low sudsing" polyhydroxy fatty acid amide surfactants can actually diminish the sudsing of their counterpart high sudsing polyhydroxy fatty acid amide surfactants. This sub-class of low sudsing polyhydroxy fatty acid amides is employed in the practice of this invention to provide low sudsing compositions for use under circumstances where, as disclosed above, low sudsing is desired.

Low sudsing polyhydroxy fatty acid amide detergents


An assembly for mounting an electric/electronic device (300) to a printed circuit board (PCB) (310) of an electronic system. The printed circuit board (310) is provided with first and second openings (311 and 312, respectively). The assembly includes a connector (320) mounted on a first side of the PCB (310) and the device (300) mounted on a second side of the PCB (310), the device (300) including a bushing (302) which extends through the first opening (311) and is fastened to the connector (320) by a nut (330). Male leads (304) of the device (300) are each plugged into a female terminal opening (324) of the connector (320) through the second opening (312). The connector (320) also includes leads having first ends located in the female terminal (323) for contacting the male device leads (304), and second ends which are soldered to conductive traces formed on the PCB (310) for providing connections between the PCB (310) and the device (300). Nut (330) is used to fasten bushing (302) to connector (320). In alternative embodiments, spring clips (430, 530, or 630) or latches (726, 727, 826, or 827) are used to fasten the bushing to the connector.

1. Field of the Invention
The present invention generally relates to an assembly for mounting an electric or electronic device to a printed circuit board of an electronic system, to an electronic system incorporating the assembly, and to a method for mounting an electric or electronic device to a printed circuit board.
2. Description of the Prior Art
FIG. 1 shows a simplified diagram of a typical potentiometer 100 which is used, for example, as a volume control in a car stereo. The potentiometer 100 includes a C-shaped fixed resistor 110 which is formed on a substrate 120. A wiper contact 130 is mounted on a pivotable shaft 140 (shown in end view) extending through a center of the substrate 120. The wiper contact 130 is positioned to slide along a surface of the fixed resistor 110 as the shaft 140 is manually pivoted in clockwise and counterclockwise directions. A first end 111 of the fixed resistor 110 is connected to a reference potential V.sub.REF through a first terminal 151, a second end 112 of the fixed resistor 110 is connected to ground through a second terminal 152, and an output voltage V.sub.OUT of the wiper contact 130 is applied to a third terminal 153.
In operation, when the shaft 140 is pivoted fully counterclockwise, the wiper contact 130 is positioned adjacent the first end 111 of the fixed resistor 110, thereby causing V.sub.OUT to substantially equal V.sub.REF. Conversely, when the shaft 140 is pivoted fully clockwise, the wiper contact 130 is positioned adjacent the second end 112 of the fixed resistor 110, causing V.sub.OUT to substantially equal 0V (ground). When the shaft 140 is pivoted to position the wiper contact 130 between the first and second ends of the fixed resistor 110, the resulting circuit acts as a voltage divider such that V.sub.OUT is a portion of V.sub.REF determined by the rotated position of the shaft 140.
Potentiometers are often used as control elements in electronic systems mounted in automobiles, such as stereo volume controls and heater control units. In many applications, the potentiometers are mounted on printed circuit boards (PCBs) which are housed within an electronic system.
FIG. 2 shows a first example of a known structure for mounting potentiometers 200 onto a main PCB 210. Each potentiometer 200 includes a housing 201, which houses the fixed resistor and wiper contact (not shown), and a bushing 202 which extends from the housing 201 and surrounds a base portion of the shaft 203.
In accordance with the known structure shown in FIG. 2, the potentiometers 200 are mounted onto auxiliary PCBs 220 which are then fixedly connected to main PCB 210 using adhesive or a mounting bracket (not shown). The terminals of the potentiometers 200 are soldered to conductive traces (not shown) formed on the surfaces of the auxiliary PCBs 220, and the conductive traces are electrically connected to the pins of a connector 221. When the auxiliary PCBs 220 are mounted to main PCB 210, the bushings 202 and shafts 203 of the potentiometers 200 extend through holes 211, and the bushings are fastened to main PCB 210. Cable connectors 212 are then connected to connectors 221. As shown in FIG. 2, main PCB 210 may also include several push button switches 240 which provide additional control inputs.
A problem with the above-mentioned known structure is that it requires a substantial amount of time to mount the potentiometers onto the main PCB. In addition, if one of the potentiometers fails, it is necessary to disconnect the auxiliary PCB from the main PCB, to disconnect and replace the malfunctioning potentiometer on the auxiliary PCB, and then to reconnect the auxiliary PCB to the main PCB. This causes the overall maintenance costs of the electronic device to be very expensive.
To avoid the problems associated with the first known mounting structure (described above), a second known mounting structure includes the use of vertical mount potentiometers which are mounted and soldered directly onto the main PCB. However, vertical mount potentiometers have a disadvantage in that soldering errors can ruin the main PCB, thereby increasing overall production costs. Further, if one or more of the vertical mount potentiometers fails, it is often less expensive to replace the entire main PCB rather than remove and replace the malfunctioning potentiometer, thereby creating high maintenance costs.

Assembly for connecting an electric/electronic device to a printed circuit board


The neodymium catalyst system prepared by the technique of this invention can be used in the polymerization of isoprene monomer into synthetic polyisoprene rubber having an extremely high cis-microstructure content and high stereo regularity. This polyisoprene rubber will crystallize under strain and can be compounded into rubber formulations in a manner similar to natural rubber. This invention more specifically discloses a process for preparing a neodymium catalyst system which comprises (1) reacting a neodymium carboxylate with an organoaluminum compound in an organic solvent to produce neodymium-aluminum catalyst component, and (2) subsequently reacting the neodymium-aluminum catalyst component with an elemental halogen to produce the neodymium catalyst system. The present invention further discloses a synthetic polyisoprene rubber which is comprised of repeat units that are derived from isoprene, wherein the synthetic polyisoprene rubber has a cis-microstructure content which is within the range of 98.0% to 99.5%, a 3,4-microstructure content which is within the range of 0.5% to 2.0%, and a trans-microstructure content which is within the range of 0.0% to 0.5%.

Neodymium salts activated with aluminum alkyl co-catalysts have been known to catalyze the polymerization of conjugated dienes since the early 1960's. To date, many papers and patents have been published which describe variations and improvements to the original systems (see U.S. Pat. No. 3,297,667, U.S. Pat. No. 3,676,441, and U.S. Pat. No. 3,794,604). Much of this work was driven by the eventual commercialization of high cis-polybutadiene in the 1980s for the use in tire applications (see U.S. Pat. No. 4,242,232, U.S. Pat. No. 4,260,707, U.S. Pat. No. 4,699,960, and U.S. Pat. No. 4,444,903).
The type of catalyst system employed and its method of preparation are crucial to the success of the polymerization. Traditionally, there are two main types of catalyst systems, the first is a ternary system based on soluble neodymium carboxylates in conjunction with an alkylaluminum co-catalyst and a halogen source (see R. P. Quirk, A. M. Kells, K. Yunlu, J. P. Cuif, Polymer 41, 5903 (2000) and A. Pross, P. Marquardt, K. H. Reichert, W. Nentwig, T. Knauf, Angew. Makromol. Chem. 211, 89 (1993)). The second system is a binary catalyst comprising of an insoluble neodymium halide complexed with three equivalence of a Lewis base such as an alcohol, amine, or phosphonate and an alkylaluminum activator (see H. Iovu, G. Hubca, E. Simionescu, E. Badea, J. S. Hurst, Eur. Polymer J. 33, 811 (1997); H. Iovu, G. Hubca, D. Racoti, J. S. Hurst, Eur. Polymer J. 35, 335 (1999); and J. H. Yang, M. Tsutsui, Z. Chen, D. Bergbreiter, Macromolecules 15, 230 (1982)).
In general, the two systems behave similarly; however, the ternary system appears to have gained acceptance commercially in the production of polybutadiene (see D. J. Wilson, J. Polym. Sci., Part A. 33, 2505 (1995)). Typically, the most active ternary systems consist of treating a branched long chain neodymium carboxylate with branched trialkyl-aluminum or dialkylaluminum hydrides, in an Al/Nd ratio between 10–40/1, and the use of 2–3 equivalents of a halide source, such as diethylaluminum chloride or tert-butylchloride.
The active catalyst is typically prepared in one of two ways. The simplest method is to generate the catalyst in-situ by sequentially introducing the catalyst components to the polymerization solution. It is usually most effective to introduce the aluminum alkyl components first, thereby scavenging impurities from the premix prior to contact with the neodymium salt. The other method for catalyst preparation is to preform the catalyst components prior to introducing them into the polymerization vessel. The most common practice involves sequentially treating the catalyst components in the presence of at least a few equivalents of monomer followed by an aging period. For example U.S. Pat. No. 3,794,604 discloses an improved preforming technique which is carried out in the presence of a small portion of a conjugated diene.
Aging the catalyst components with a diene prior to polymerization results in a more active catalyst then when the conjugated diene is absent. The disclosed technique for catalyst formation is to age after all of the components have been mixed together. U.S. Pat. No. 4,429,089 also teaches the use of a diolefin during catalyst formation and states that the particular procedure which is followed has no bearing on the polymerization run. Likewise, U.S. Pat. No. 4,461,883 discloses that the use of a conjugated diene in the catalyst make-up is preferable for improving the activity of the catalyst. In this example, the diene is mixed with the catalyst components at any time in the preforming step with aging occurring after all components are mixed together.
U.S. Pat. No. 4,533,711 teaches the practice of adding the catalyst components together first followed by the addition of a small amount of diene and then aging the preformed catalyst. This patent states that the diene is not essential in the make-up but it does serve to increase catalyst activity. U.S. Pat. No. 4,663,405 continues to teach the use of conjugated dienes as components in preformed catalysts. It goes on to state that soluble catalysts result when diolefins are present in the make-up while insoluble catalysts frequently result when no diene is present. This patent teaches a process where aging of the catalyst occurs after the reagents are added.
U.S. Pat. No. 5,502,126 again practices the use of a diene in the preformed catalyst make-up and again states that it is preferred to age the catalyst after the labile halogen compound is added. In U.S. Pat. No. 5,659,101 the use of a diolefin in conjunction with a boron derived halogen source results in a preformed catalyst that partially forms a solid precipitate in aliphatic solvents.
When silicone halides are used, as in U.S. Pat. No. 5,686,371, aging in the presence of a diene again is performed after the addition of all the catalyst components. U.S. Pat. No. 6,136,931 discloses an improved boron halide dependent preformed catalyst that has excellent solubility in non-polar solvents. Finally, U.S. Pat. No. 6,255,416 also practice preformed catalyst generation in the presence of a small amount of diene. Aging in this case again occurs after all of the catalyst components are mixed.


The invention is an electrolytic microfinishing process which utilizes a conductive tool as a cathode and a conductive workpiece as an anode both connected to a power supply. Electrolytic fluid is pumped between the tool and workpiece, creating a decomposition of the workpiece surface allowing the surface of the workpiece to be removed or wiped away by the interaction of the flowing electrolyte and rotation of the tool without generating any heat at a rate significantly faster than any other known machining process. The tool has no contact with the workpiece and accordingly, requires very low clamping loads to hold the workpiece in the spindle during the finishing operation. Due to the low clamping loads, the distortion of the workpiece is completely eliminated. Modulating the power supply during the work cycle allows the use of a single tool for both roughing and finishing as a continuous cycle to significantly provide surface finishes previously unobtainable.

1. Field of the Invention
The invention relates in general to a method and apparatus of electrolytically microfinishing metallic workpieces. More particularly, this invention has specific reference to the application of electrolytic machining to a microfinishing process with a view to decrease considerably, the cycle time of finishing the workpiece to be treated while reducing appreciably, the cost of the microfinishing operation for a given degree of precision.
2. Description of the Related Art
There are two well know methods of machining work pieces using electrolytic cutting.
The first is electrochemical machining (ECM) which is done by using a cathode having the shape of the part to be machined. The shape of the cathode is transferred to the workpiece (anode) by deplating, similar to electroplating in accordance with Faraday's Laws. In an electrolytic conductive solution, electrical current is applied to the workpiece to de-plate the material while an electrolyte is pumped between the cathode and the workpiece (anode) and prevents the deplated material from plating out on the cathode. For the purpose of this document, the electrolytic process referred to in the various discussions can include both electrical discharge machining and electrochemical machining although they have recognized distinct differences.
The second is electrochemical grinding (ECG). In this process, the cathode is the grinding wheel. As the electric current flows between the workpiece and the wheel, the material removed by electrolysis is carried off by the abrasives in the rotating wheel. The wheel is made of a conductive material into which abrasive particles have been embedded and touches the workpiece very lightly. The tool and workpiece are connected to a direct current source. The electrolyte is applied onto the grinding wheel near the workpiece in a manner that will result in the wheel carrying it into the cut. This brings about electrochemical action, molecular decomposition or deplating of the workpiece.
Electrolytic cutting has advantages over mechanical and heating methods of cutting metals. Electrolytic methods provide cuts that are free from mechanical or thermal strain and thus do not disturb the grain structure of the cut material. Electrolytic cutting methods also avoid the burrs and jagged edges and the avoidance of metal as dust or other small particles in mechanical cutting or as vapor that is evaporated or burned away where a cutting flame is used.
The advantages and techniques involved in removing particles of electrically conductive materials by electrolytic erosion (often called electrochemical decomposition) are also well established in the industry. Both of these electrolytic stock removal processes have been found useful in grinding, as well as shaping operations, particularly when the workpiece materials are extremely hard.
Electrolytic grinding briefly consists of bringing a workpiece against the face of a rotating metal bonded grinding wheel under conditions where a low voltage direct current passes through an electrolyte between the workpiece and a wheel during the operation so as to remove material from the workpiece by electrolytic action. Electrochemical grinding (ECG) is principally used for specialized areas, for example, the grinding of flat surfaces or cutting form surfaces with preformed grinding wheels. In electrolytic grinding, the abrasive particles serve to remove non-conductive films which may form on the surface of the material of the workpiece which is being ground and may serve also to provide abrasive cutting action. By this conjoint electrolytic and abrasive action, the cutting speed is very much enhanced as compared to that obtained by surface grinding alone. On the other hand, it is also possible to rely almost entirely upon electrolytic action thereby reducing the rate of wear on the abrasive particles to a minimum. Because metal removal is largely brought about by non-mechanical action, only about 10% of the conventional grinding wheel pressure is required, corresponding to the fact that only about 10% of the material is removed by the abrasive action of the conductive grinding wheel. Most of the metal removal is brought about by the electrochemical action. The metal removal rate is largely governed by the amount of electric current and electrolyte applied, regardless of the material's hardness. It is possible with good process controls to achieve surface finishes as low as Ra=0.1 μm using electrolytic grinding techniques.
In spite of the many advantages, electrolytic decomposition or grinding may provide little or no success that has been achieved in applying the principle of electrolytic erosion to the microfinishing process.
Microfinishing is a somewhat misunderstood process. In the prior art it is at times referred to as superfinishing, lapping, honing, mirror finishing, fine grinding, or just plain finishing. Microfinishing, as used herein is intended to encompass all of the above-listed prior art terminology. Accordingly, microfinishing is a surface finishing process that is performed after rough, medium machining, or fine grinding of the surface of a workpiece, such as a previously machined workpiece or medical prosthesis. Microfinishing is typically performed using a machine that brings some form of rotating and/or oscillating abrasive material into contact with the workpiece while the workpiece is rotated. The abrasive material applied subsequent to a previous machining operation removes any defects, like surface imperfections, and is used to obtain particularly accurate geometrical characteristics of the surface including exceptional surface finishes. Microfinishing is a low temperature machining process which combines the motion of the workpiece and the motion of a bonded abrasive "stone" or "tape" to generate both a geometrically accurate form and specific surface finish. The surface characteristics of the generated surface are typically the function of the specific stone or tape grit size used. The abrasive, under an extremely low and relatively constant force, will produce the repeatable surface characteristics or qualities required generating little or no heat. One advantage of microfinishing is the elimination of the amorphous layer after grinding. The amorphous layer or recast layer is a product of any heat generating process. In machining or grinding with any calculated feed method, the ability of the tool to cut is not the only determining factor for the feed rate. The incoming geometry and the surface finish are also an integral part of the equation. These are at best all variables. In many cases the derived feed rate may be extremely small. In the true microfinishing process, the stone determines the rate and duration of feed depending upon the incoming conditions and geometry of the workpiece. Once the stone has progressed through the soft amorphous layer, however thick, and has reached the solid base material, the stock removal rate will dramatically reduce to the point when the stone glazes. Once this occurs, the geometry generating portion of the process will be complete and the second stage begins. During the second stage, a measurable amount of stock will no longer be removed, but the glazed stone will act as a polishing tool and create the required finish. The specific stone and grit size is picked for its ability to remove the soft amorphous layer, produce the desired geometry and also the required finish. This process induces no metallurgical alteration and provides a clean, burr-free workpiece.
As set forth above, in the first stage, the smooth microfinish tool of bonded abrasive grain contacts the rough surface of the workpiece. The rough surface of the workpiece removes the glazed portion of the stone from the previous operation and aggressive cutting of the amorphous layer begins. During this second stage, the rough abrasive tool surface continues to cut and wear. As the geometry and finish of the workpiece improves, the abrasive surface of the stone also becomes smoother and starts to re-glaze. This results in a lower feed rate and consequently decreases wear. Finally, in the third stage the workpiece and abrasive tool surfaces are both extremely smooth. The ability of the stone to cut is minimal and the final finishing stage is achieved. The cutting speed and contact pressure of the microfinish process are so small that heating of the workpiece surface remains well below a detrimental limit thereby avoiding the generation of a new amorphous layer on the workpiece.
Microfinishing can generate flat, spherical, or cylindrical surfaces. There are three basic types of spherical shapes that are applicable to the microfinish process. These are complete spheres, internal or concave spheres, and partial conical shapes. Flat and complete spherical surfaces are the easiest shapes to achieve a very accurate, uniform geometry and finish, while the partial/conical shape proves to be the most difficult. With carefully selected angular approaches and properly selected stones, results of the relative same degree of accuracies for full spheres can be achieved. Outside diameters on cylinders, shafts, piston and journals, inside diameters and bores are microfinished by using an area contact instead of a line contact as by conventional grinding. This improves the roundness, surface finish and eliminates leads.
Since stock removal is obtained at relatively low cutting forces and speeds, as compared to grinding, this leads to a surface characterized by higher compressive stresses, and the elimination of damage to the finish surface by excessive heat. As discussed above, a first step is used in order to optimize the stock removal and geometry process and then followed by a secondary step in order to create the surface structure required. This second step is characterized by a small stock removal. Abrasive grit sizes can range from approximately 320 to 1500, and include silicon carbide, aluminum oxide, C.B.N. (cubic, boron nitride) and diamond bonded abrasives. Where required, prior art production microfinishing processes achieve cylindrical surfaces with Ra as low as 0.05 μin and with roundness of 1 μin (0.025 μm) Ra is defined as the arithmetical average profile deviation of the surface irregularities with respect to a hypothetical perfect surface established by an arithmetical average line (see U.S. Pat. No. 6,222,628).
In comparison, fine grinding without the use of electrolytic action utilizes tools made of similar abrasives i.e., silicon nitrate, aluminum oxide, C.B.N. or diamond in grit size from 280 to 1200. Since fine grinding involves rotation by either chucking or centerless driving, during the relative rotational motions of the workpiece and wheel, combined with the corresponding contact angle, generates the required surface form i.e., flat, spherical (concave or convex) with a characteristic cross hatch pattern as shown in prior art FIG. 1. The requirements for the same low cutting forces are utilized in the fine grinding process. Surface speeds generally are higher than microfinishing, especially when using C.B.N. or diamond tools. The feed systems utilized are normally very sensitive so as to not force the grinding tool into the work area and develop excessive heat. N.C. feeds are generally not sensitive enough for many applications, and air feed with hydraulic damping is usually preferred. The surface produced by grinding is more or less wavy. It is these wavy surface defects that are eliminated with microfinishing. Temperatures of up to 1100° C. can develop in the line of contact between the workpiece and grinding wheel, generating an amorphous layer, also known as "soft skin". This amorphous layer substantially reduces the load carrying capacity and therefore has to be eliminated by microfinishing in order to take advantage of the maximum performance characteristics of the metallic workpiece. Production fine grinding processes with carefully controlled process parameters can achieve flat surfaces with Ra's as low as 4.0 μin (0.1 μm).
Increased demands for more accurate processing of newly developed materials, shorter lead time, more accurate dimensional as well as surface characteristics has resulted in the investigation of new machine processing techniques. Of course these increased demands are always expected to be developed at lower costs for automotive, diesel engine, aerospace, hydraulic, medical devices and many other precision part manufacturers. In response to these demands there have been some attempts to obtain more accurate dimensional surfaces as well as surface finishing characteristics. For example, U.S. Pat. Nos. 4,140,598 and 4,328,083 to Kimoto et al. disclose a mirror finishing process which combines electrolytic machining with an abrasive tool. In Kimoto et al., abrasive powder is mixed into the electrolyte and under pressure this mixture is forced to flow into the gap between the workpiece and the electrode tool. Kimoto et al. discloses that a clean mirror surface finish of not more than 0.5 μm Rmax may be obtained when the current density is not more than 2.5 A/cm2. The polishing time being one minute for such result. However, where current density is from 0.5 to 1 A/cm2, a polishing time of 3-5 minutes is required. Kimoto et al. further discloses that either an abrasive cloth or an abrasive buff may be used instead of the abrasive powder mixture of the electrolyte. Rmax is defined as the largest of the individual surface peak to valley from each sample length.
Further attempts have been made to increase the accuracy of electrolytic machining. For example, Rhoades, U.S. Pat. No. 5,114,548, discloses a method of electrochemical machining a workpiece utilizing an electrode that is passive to the workpiece, wherein the conductive tools are provided with a non-conductive abrasive surface, and the tool and workpiece are brought together with a contacting relative motion so that the abrasive surface will selectively abrade the workpiece to remove any passivation layer therefrom in those areas to be machined and such that the unabraded surface areas will retain the passivation layer to prevent electrochemical machining thereof. Reciprocal motion between the tool and workpiece is also effective to pump the electrolyte through the gap between the tool and workpiece and prevent the workpiece from becoming overheated. Orbital abrading is a nontraditional machining process which is entirely different and distinct from electrochemical machining. Unlike conventional grinding techniques, orbital abrading utilizes a very small relative movement having a radius of orbit, typically of 0.020 to 0.100-inch at a typical rate, of 1200 oscillations per minute. Because of the very small orbital displacement of the workpiece and tool during working, the difference in size is small, and further, permits production of rather detailed and intricate ground configurations with a high degree of resolution, either two or three dimensional forms.
While orbital abrading is a well accepted nontraditional machining process based solely on its own merits, there are other known machining processes wherein orbital abrading, or at least orbital motion between the tool and workpiece, has been combined with other machining techniques. For example, U.S. Pat. No. 3,593,410 issued to Taylor, teaches a machining process which utilizes vibratory motion between an abrasive tool and workpiece wherein the interface is submerged in a solution which will chemically alter the workpiece surface to facilitate a mechanical abrasion. U.S. Pat. No. 3,663,786, issued to O'Connor, teaches an electrical discharge machine tool which provides an abrasive relative motion between the electrode and the workpiece, primarily for the purpose of machining graphite electrical discharge machining electrodes. Of more relevance to this invention, U.S. Pat. No. 3,564,190, issued to Kandajan et al. teaches a number of machining processes including an electrochemical machining process wherein a relative motion, orbital or otherwise is imparted between the tool and workpiece, so that the workpiece is machined by the combined activity of the two processes. This reference does not, however, teach or suggest the unique features of this invention as essential to affect the greater degree of precision, but rather, relies merely on the combined metal removal technique to speed the machining process. Further, the use of a tool with a surface covered with abrasive particles can result in the embedding of abrasive particles into the surface of the article being processed, and this factor can detract from the surface quality of the processed workpiece when an abrasive coated tool is used as a final step in the electrochemical machining process.

Electrolytic microfinishing of metallic workpieces


A straddle-type vehicle includes a rear arm, a seat, a rear suspension located below the seat, and a first silencer at least partially located below the seat and the rear suspension. The rear arm includes the left arm portion, the right arm portion, and a second cross member. The right arm portion is provided with a through-hole extending therethrough in a vehicle width direction and located between the top edge and the bottom edge of the right arm portion. The second cross member includes a coupling portion to which a bottom end portion of the rear suspension is coupled. As seen in a vehicle side view, at least a portion of the coupling portion overlaps the through-hole.

1. Field of the Invention
The present invention relates to a straddle-type vehicle.
2. Description of the Related Art
Conventionally, a straddle-type vehicle includes a rear suspension that absorbs impact from the ground in order to improve the riding comfort. Japanese Laid-Open Patent Publication No. 2009-241922 discloses a motorcycle which includes a rear suspension located below a seat, a silencer located below the rear suspension and a rear arm that supports a rear wheel, and in which a bottom end portion of the rear suspension is coupled to the rear arm.
In a straddle-type vehicle, it is desired to lower the position of the seat in order to improve the contact between a rider's foot and the ground. However, in the case where the rear suspension is located below the seat and the silencer is located below the rear suspension, it is not easy to lower the position of the seat.
For the motorcycle disclosed in Japanese Laid-Open Patent Publication No. 2009-241922, it is conceivable to lower the position of the rear suspension in order to lower the position of the seat. Specifically, it is conceivable that the bottom end portion of the rear suspension can be located below the rear arm. However, the silencer is located below the rear suspension. In order to lower the position of the rear suspension while maintaining the minimum ground clearance of the silencer, the capacity of the silencer needs to be decreased.
In the motorcycle disclosed in Japanese Laid-Open Patent Publication No. 2009-241922, the rear suspension is inclined such that the size thereof in a vehicle up-down direction is larger than the size thereof in a vehicle front-rear direction. In order to lower the position of the seat and provide a sufficient capacity of the silencer with certainty, it is conceivable to decrease the size of the rear suspension in an axial direction to decrease the size thereof in the vehicle up-down direction. However, when the size of the rear suspension in the axial direction is decreased, the stroke amount of the rear suspension is decreased. This deteriorates the riding comfort. Alternatively, it is conceivable to locate the rear suspension such that the bottom end portion (rear end portion) thereof is farther rearward with respect to a top end portion (front end portion) thereof in the vehicle front-rear direction without changing the size of the rear suspension in the axial direction. Specifically, it is conceivable to increase the inclination angle of the rear suspension. In this case, since the size of the rear suspension in the vehicle up-down direction is decreased, the position of the seat can be lowered. However, the rear wheel is located rearward of the rear suspension. Therefore, when the rear suspension is inclined at a large inclination angle, the rear suspension and the rear wheel interfere with each other. In order to avoid such interference, the rear wheel needs to be located farther rearward, which may undesirably increase the length of the vehicle in the vehicle front-rear direction.
In the motorcycle disclosed in Japanese Laid-Open Patent Publication No. 2009-241922, the rear arm includes a left arm portion, a right arm portion, and a bridge portion that couples the left arm portion and the right arm portion to each other. The bottom end portion of the rear suspension is attached to a top portion of the bridge portion. Specifically, an attachment portion of the bottom end portion of the rear suspension is located above the rear arm. Therefore, the rear suspension can be attached to the rear arm from a position to the side of the rear arm by use of a tool such as a driver or the like. In order to attach the rear suspension to the rear arm from a position to the side of the rear arm by use of a tool in the state where the position of the bottom end portion of the rear suspension is lowered, the rear suspension needs to be attached at a position below the arm portions. This decreases the capacity of the silencer as described above. For this reason, merely lowering the position of the bottom end portion of the rear suspension is not sufficient, and it is necessary to consider the attachment of the rear suspension to the rear arm.


A bus interface device for interfacing a secondary peripheral bus with a system having a host CPU and a primary peripheral bus. The bus interface enables "virtual integration" of multiple physically distinct peripheral devices so that the collection of devices can function as a single integrated unit. The "virtually integrated" devices can share resources such as a dedicated bus, memory space, and memory bandwidth just as if the devices were physically integrated. An intelligent device configuration process and a dynamic internal memory map allow each peripheral device to be independently added to the system, removed from the system, or upgraded just as if each device was a completely separate peripheral. In this way, flexibility and modularity are maintained while achieving the advantages and memory cost reductions associated with physically integrated devices. Additionally, the bus interface provides a dedicated secondary bus that enables multimedia and graphics bus traffic to be isolated from the CPU's primary peripheral bus. This separation allows the CPU's peripheral bus to provide sufficient bandwidth for all peripheral devices and allows room for the system to be upgraded with new or faster peripherals. The dedicated bus can also offer multimedia devices the higher bandwidth they require for applications such as 3-D graphics, digital audio, and motion video.

The PCI (Peripheral Component Interconnect) bus is a standardized local-bus that is used for connection between a CPU and its peripherals. At its inception, the PCI bus was designed to allow for motherboard connection of high-speed peripherals. Soon thereafter, the PCI bus began to replace the ISA local-bus as the bus used to connect add-in cards to the motherboard CPU. The PCI bus now dominates the desktop PC (personal computer) market as the primary way of connecting peripherals to the CPU, and variants of the standard PCI bus have evolved for industrial, compact, and mobile applications.
The PCI bus and peripherals connected to the bus operate in accordance with the PCI specification, which is published by the PCI Special Interest Group ("SIG"). Because it is processor-independent, any CPU or peripheral can be connected to the bus. In accordance with revision 2.1 of the specification, the PCI bus provides a 32-bit data path running at a 33 MHz clock rate for a maximum bandwidth of 132 megabytes per second ("MB/s"). Definitions for 64-bit data path and 66 MHz clock rate options are also included in the current specification. This combination of speed and flexibility has made the PCI bus the standard interconnection method between peripherals and a host CPU.
FIG. 11 shows a block diagram of the arrangement of a host CPU and add-on peripherals in a conventional PC. The conventional PC is implemented on a motherboard MB and includes a central processing unit CPU and its associated main memory M0, which is a large block of DRAM. A cache of fast memory SRAM, logic control chip set, and CPU bus are also provided on the motherboard MB along with a PCI bus. Peripherals (C1, C2, and C3), each in the form of an add-in card, are connected to the motherboard PCI bus. In this example, the peripherals consist of an MPEG2 decoder C3, a 3-D graphics accelerator C2, and a combination 2-D graphics accelerator and VGA controller C1. The VGA controller C1 is connected to a monitor CRT. An ISA bridge may also be provided to allow ISA-based peripherals to be connected to the system.
As shown in FIG. 11, each add-on peripheral (C1, C2, or C3) can only transfer data to or from another peripheral, or to or from the large main memory M0, by using the PCI bus. However, the PCI bus may not be able to provide the type of performance required by high-bandwidth multimedia and graphics peripherals for applications such as 3-D graphics, digital audio, and motion video. For example, the three add-in cards shown in FIG. 11 will find it extremely difficult, if not impossible, to operate together over the motherboard PCI bus. While the theoretical maximum bandwidth of the PCI bus is 132 MB/s, typical sustainable throughput on the bus ranges from 40 to 80 MB/s due to factors such as bus contention. Meanwhile, for 3-D graphics, the stream of 3-D polygon information coming from the CPU can range from 10 to 15 MB/s and the resulting rendered pixel stream from the 3-D accelerator C2 will be in the range of 40 MB/s. Thus, even if the 3-D graphics accelerator has its own memory and the ability to transfer data directly to screen memory, 3-D graphics alone requires a bandwidth of over 50 MB/s.
In the case of motion video, the compressed data stream going to the MPEG2 decoder C3 is only about 1 MB/s but the uncompressed video stream is around 30 MB/s. Additionally, these two graphics applications must contend for bus bandwidth along with other transactions required for applications such as audio, CD-ROM access, hard disk access, and joystick or controller input. In fact, providing multimedia peripherals with the necessary bandwidth is made even more difficult because all requests for the PCI bus are handled based on a fairness algorithm (i.e., all peripherals have the same priority when requesting access to the PCI bus). Even if the motherboard PCI bus in a conventional PC system could provide the bandwidth required by all of the connected peripherals, it is apparent that the multimedia traffic saturates the PCI bus. In the long run, such overburdening of the PCI bus compromises system performance and makes further system upgrades impossible.
Additionally, this type of add-on architecture requires a great deal of single function memory. In order to minimize required bus bandwidth and to increase its own speed, each multimedia add-on peripheral typically has an on-card dedicated RAM memory that it can use during data processing. A major drawback exists in that the RAM provided on each peripheral card cannot be reused or reallocated for other purposes--it is single-function memory. For example, the MPEG2 decoder C3 and the 3-D graphics accelerator C2 shown in FIG. 11 each require about 2 MB of dedicated memory M3 and M2, respectively, in addition to the multi-megabyte screen memory M1 provided with the VGA controller C1. Such large single-function memories are costly and wasteful and lead to add-on peripherals that are too expensive and inflexible.
To overcome some of the bandwidth problems discussed above, physically integrated devices that combine several independent features into a single add-on peripheral card have been developed. While a physically integrated device may lower the amount of bandwidth required on the motherboard PCI bus, such a design greatly sacrifices modularity. A typical integrated device is designed to include circuitry to perform many functions. Even if only a subset of these functions is desired by a user, the cost of the device is the same because all of the functions are part of a single physical component and cannot be broken up. Thus, both the integrated device and the corresponding single peripherals must be available to satisfy different price ranges and performance levels in the marketplace. Further, for each combination of features that is desired to be integrated, a separate and distinct integrated device must be designed, produced, and supported.
Thus, in a conventional PC, multimedia peripherals connected to the motherboard PCI bus saturate the PCI bus and are expensive due to large single-function memories and/or a lack of modularity. Furthermore, the PCI bus may not be able to provide the bandwidth presently required by a modest combination of multimedia peripherals--let alone accommodate future upgrades to the system to improve performance or provide additional functions.

Bus interfacing device for interfacing a secondary peripheral bus with a system having a host CPU and a primary peripheral bus


A grating portion has a plurality of convex portions provided on at least one principal plane of a transparent substrate having a first layer containing a first transparent material and a second layer containing a second transparent material, and extended in parallel to each other in a first direction as well as periodically arranged in a second direction orthogonal to the first direction. A filling portion fills a third layer containing a third transparent material at least between the plurality of convex portions. Assuming that the change rate of the refractive index with the change of temperature of the first transparent material is αA, the change rate of the refractive index with the change of temperature of the second transparent material is αB, and the change rate of the refractive index with the change of temperature of the third transparent material is αC, the relationship αA<αC<0 and |αC|>|αB| is satisfied.

Conventionally, there is a diffractive element for use in an optical head device of this kind which divides an emitted light from a laser light source into three beams including a principal beam and two sub-beams, in which the sub-beams are used for tracking control. In this usage, the diffractive element is usually one in which a material such as plastic or glass is processed into a periodic concave and convex shape, in which the depth of concave and convex is about several hundreds nm. Herein, for example, in the diffractive element which contains air in the concave portion of the concave and convex shape and glass in the convex portion, the temperature dependency of the diffraction efficiency is so small as to cause no problem in practice.
On the other hand, with a technology for integrally forming the semiconductor lasers having a plurality of oscillation wavelengths in recent years, a so-called twin LD in which the semiconductor lasers having two wavelengths of 660 nm band (for DVD) and 785 nm band (for CD) are composed as one package has been manufactured commercially. In the optical head device using the twin LD, it is expected that the number of parts in the device is reduced by sharing a part of the optical path for the laser beam of each wavelength. Supposing that the device is used in the shared optical path, a diffractive element with a wavelength selection function of the diffraction efficiency added has been proposed (e.g., refer to JP-A-2004-342295).
According to the above publication, for example, in a DVD wavelength selection diffractive element for the twin LD, the convex portion in the periodic concave and convex shape is formed of an optical multilayer for controlling the transmission phase in two wavelengths, and the concave portion is filled with a transparent material to obtain the wavelength selectivity for the diffraction efficiency. In this diffractive element, the depth of the concave and convex, or the depth of grating, is about 5 μm.
However, in the diffractive element as shown in the above publication, with a structure in which the convex portion forming the grating is formed of the optical multilayer made of inorganic material, and the concave portion is formed of an organic material, the change rate of the refractive index with the change of temperature is greatly different between the convex portion and the concave portion, whereby there is a problem that the diffraction efficiency is likely to change depending on the temperature of the system.

Diffraction element and optical head device equipped therewith


The present invention provides KLK3 peptides, FOLH1 peptides, recombinant polypeptides comprising same, recombinant nucleotide molecules encoding same, recombinant Listeria strains comprising same, and immunogenic and therapeutic methods utilizing same.

Stimulation of an immune response is dependent upon the presence of antigens recognized as foreign by the host immune system. Bacterial antigens such as Salmonella enterica and Mycobacterium bovis BCG remain in the phagosome and stimulate CD4+ T-cells via antigen presentation through major histocompatibility class II molecules. In contrast, bacterial antigens such as Listeria monocytogenes exit the phagosome into the cytoplasm. The phagolysosomal escape of L. monocytogenes is a unique mechanism which facilitates major histocompatibility class I antigen presentation of listerial antigens. This escape is dependent upon the pore-forming sulfhydryl-activated cytolysin, listeriolysin O (LLO).
ActA is a surface-associated Listerial protein, and acts as a scaffold in infected host cells to facilitate the polymerization, assembly and activation of host actin polymers in order to propel the Listeria organism through the cytoplasm. Shortly after entry into the mammalian cell cytosol, L. monocytogenes induces the polymerization of host actin filaments and uses the force generated by actin polymerization to move, first intracellularly and then from cell to cell. A single bacterial protein, ActA is responsible for mediating actin nucleation and actin-based motility. The ActA protein provides multiple binding sites for host cytoskeletal components, thereby acting as a scaffold to assemble the cellular actin polymerization machinery. The NH2 terminus of ActA binds to monomeric actin and acts as a constitutively active nucleation promoting factor by stimulating the intrinsic actin nucleation activity. ActA and hly are both members of the 10-kb gene cluster regulated by the transcriptional activator PrfA, and is upregulated approximately 226-fold in the mammalian cytosol.
Prostate cancer is the most frequent type of cancer in American men and it is the second cause of cancer related death in this population. Prostate Specific Antigen (PSA) is a marker for prostate cancer that is highly expressed by prostate tumors.
There exists a long-felt need to develop compositions and methods to enhance the immunogenicity of antigens, especially antigens useful in the prevention and treatment of tumors and intracellular pathogens.

Compositions and methods comprising KLK3 or FOLH1 antigen

THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA


Provided are an adhesive composition and a film roll whereby blocking can be prevented and excellent temporary pressure bonding properties can be obtained. The adhesive composition of the present invention contains an epoxy resin, a latent curing agent, and an acrylic rubber having a carboxyl group or a glycidyl group, and the acrylic rubber phase-separates from the epoxy resin at a normal temperature and is compatible with the epoxy resin at a predetermined temperature higher than the normal temperature and lower than the curing temperature. Adhesive force is thereby reduced at the normal temperature, blocking can be prevented from occurring and excellent adhesive force can be obtained during temporary pressure bonding.

Conventionally, anisotropic conductive film (ACF) is used as an adhesive film to electrically connect respective electronic components such as in connecting a liquid-crystal panel and an IC chip. This anisotropic conductive film is used, for example, to connect terminals of flexible print circuits (FPC) or IC chips to ITO (indium tin oxide) electrodes formed onto a glass substrate of an LCD panel and can be used both to bond and electrically connect a variety of respective terminals (for example, refer to PLT 1 and 2).
As an anisotropic conductive film, an epoxy resin type electrically insulating adhesive agent having conductive particles dispersed therein is generally used, for example, by conductive particles being trapped and deformed between a terminal of an IC chip and an ITO electrode of a glass substrate, the IC chip and the ITO electrode are electrically connected, and by curing the adhesive agent in this state, the IC chip and the ITO electrode are mechanically connected.
Such an adhesive film is formed onto a long and narrow release sheet and is shipped as a film roll wound around a reel in roll-form; at utilization time, the adhesive film is pulled off the reel and, after cutting to the needed length, used to connect electronic components.
At utilization time of a film roll, when unwinding an adhesive film from the reel, winding tension occurs. Stress caused by this winding tension increases towards the roll core. Furthermore, this stress increases along with increasing length of an adhesive film wound around a reel. In the case of this stress being too large, the adhesive agent component protrudes outside of the film roll and is deposited on flanges of the reel which causes blocking in which normal dispensing of the adhesive film from the reel is made impossible.
It is possible to prevent blocking by shortening the adhesive film to sufficiently reduce stress caused by winding tension of the film roll; however, this increases the frequency of reel replacement for which a line must be stopped each time, thus lowering productivity. Furthermore, while it may be possible to improve blocking properties by lowering adhesive force, this would adversely affect adhesive properties during temporary pressure bonding.

This patent is subject to a terminal disclaimer.