A silver halide photographic material is descloosed, comprising a support having thereon at least one silver halide emulsion layer, wherein the silver halide emulsion layer contains at least 1.times.10.sup.-4 mol of a compound represented by formula (I) per mol of silver halide and from 1.times.10.sup.-3 to 1.times.10.sup.-1 mol of compound represented by formula (II) per mol of the compound of formula (I) and the iodine content of the silver halide emulsion is 1 mol % or less: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7, Z.sub.1, Z.sub.2, Z.sub.3, Z.sub.4, X.sup..crclbar. and n are defined in the specification. The photographic material is highly sensitive, can be processed rapidly, and does not fatigue the developer, yet it contains only a small percentage of iodine, if any. The photographic material is useful in photographic films including X-ray films.

The increasing use in recent years of silver halide photographic materials has resulted in a need for rapid processing of such materials. This trend is seen, for example, in the field of medical X-ray photographic films. As the number of X-ray diagnoses associated with health examinations increases, the number of X-ray photographs increases also. At the same time, the necessity of obtaining the results of the diagnoses as soon as possible has placed a premium on rapid photographic processing.
To process large amounts of photographic materials and do it rapidly, it is necessary to decrease the replenishing amount of each processing solution and to shorten the processing time for the development, fixing, washing and drying steps.
Decreasing the replenishing amounts and the time for each processing step leads to problems recognized in the art. These include: (1) developer fatigue; (2) residual color formation due to the hindrance of the desorption of dyes; and (3) inadequate fixing. These problems cannot be ignored.
The use of iodine or an iodine ion is one recognized means of addressing some of the problems inherent in rapid processing. However, the use of iodine has its own set of problems. When an iodine ion is used to lower developer fatigue and the development restraining action, the amount of developer replenisher must be increased. Also, as described for example in JP-A-2-68540 (The term "JP-A" as used herein means an unexamined published Japanese patent application), while iodine improves the adsorption of dyes, it increases residual color formation associated with spectral sensitizing dyes. To prevent this increase in residual color formation, the processing times for fixing and washing must be increased. This is same as to inadequate fixing.
Despite the problems associated with the use of iodine, the general outlook in the art has been that iodine is an essential component in silver halide emulsions, and, in particular, in silver halide emulsions that are highly sensitive, have excellent development properties, and are rapidly processable. This is described, for example, in JP-B-63-38692 (The term "JP-B" as used herein means an examined Japanese patent publication) and JP-A-63-305343.


A hinge assembly (300) for use in a flat display monitor includes a base seat (10), a fixing seat (20), a pivotal shaft (30), a resilient element (80) and a plurality of washers. The base seat includes a pivot flange (14) having a retaining hole (12) formed therein. The pivot flange defines a protrusion (18) therein, and the protrusion extending into the retaining hole. The fixing seat includes an extending portion (26) defining an engaging hole. The resilient element resists between the base seat and the fixing seat. The pivotal shaft has at least one flat surface, and the pivotal shaft is positioned within the retaining hole of the pivot flange. One of the at least one flat surface pivotably engages with the protrusion. The pivotal shaft extends beyond the retaining hole of the pivot flange, and the plurality of washers is fastened together to the pivotal shaft.

1. Field of the Invention
The present invention generally relates to a hinge assembly and, particularly, to a hinge assembly for a flat display monitor.
2. Discussion of the Related Art
With the widespread use and the variety of computers available, display devices, configured for such a variety of computers also come in a wide range of sizes, shapes, and weight. In general, a typical cathode-ray tube (CRT) monitor includes a display panel for displaying an image, a vacuum tube coupled to the rear of the display panel, and an electron gun coupled to the rear of the vacuum tube. This configuration is a huge factor in limiting the total volume and final weight of the CRT monitor. In addition to the problem mentioned above, the CRT monitor carries a huge problem in that a user is easily fatigued when looking at the CRT monitor over long hours due to its low image quality. It is this problem alone that many people have recently switched into using a flat screen display monitor, e.g., Liquid Crystal Display (LCD) monitor, from the conventional CRT monitors. Such flat display monitors generally offer the advantages of a greatly reduced size and weight properties including the ability to produce a high image quality. Furthermore, flat screen display monitors may help to overcome space limitations through folding over (such as with a laptop computer) or rotating (such as with a desktop monitor) so as to facilitate adjustment of the position thereof relative to the user.
The rotating or folding-over functions of the flat display monitor are realized with a hinge assembly. For example, a hinge assembly is disclosed in U.S. Pat. Pub. No. 2002/0083554. The hinge assemble includes an L-shaped fixed seat, a pivotal axle, and multiple oiled washers. The fixed seat has a retaining hole defined thereof. The pivotal axle is pivotally connected with the fixed seat. The pivotal axle has a retaining shoulder formed at a middle portion thereof, a connecting end portion integrally formed at a first end of the retaining shoulder, and a fixing end portion integrally formed at a second end of the retaining shoulder. The connecting end portion of the pivotal axle is extended through a retaining hole of the fixed seat along with multiple oiled washers, and then fastened by a fastening piece. The hinge assembly may realize a maximum inclination angle of the flat display monitor so that the LCD shall not over fold, over shifting a center of gravity, causing the LCD to fall over. However, in use, it is needed to use great efforts to rotate the hinge assembly, since a greater force is exerted thereon. Therefore, the flat display monitor is highly damaged prone. As a result, it is inconvenient for a user to operate the hinge assembly.
Therefore, a new hinge assembly is desired in order to overcome the above-described shortcomings.

Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.


An apparatus defining a travel path for dyeing a traveling textile strand in a continuous in-line process includes: an applicator for metering and applying a predetermined amount of a liquid to a traveling textile strand along a travel path defined by the apparatus whereby the traveling strand is saturated with the liquid; means for heating the traveling strand to a first predetermined temperature and then to a second predetermined temperature for drying and finishing the traveling strand, the heating means including at least one heated roll disposed along the travel path adjacent to and downstream of said applicator; and a winding arrangement disposed at the end of the travel path adjacent to and downstream of the heating means for winding the dried and finished traveling strand on a bobbin to form a finished package following the heating of the traveling strand. The heating means includes a first pair of heated rolls for heating the traveling strand to the first predetermined temperature ad a second pair of heated rolls for heating the traveling strand to the second predetermined temperature. Alternatively, the heating means includes a single roll having a first heating zone which heats the traveling strand to the first predetermined temperature and a second heating zone which heats the traveling strand to the second predetermined temperature. Preferably, the travel path extends from the applicator directly to the heating means, and from the heating means directly to the winding arrangement.

The present invention relates broadly to apparatus for dyeing textile materials and, more specifically, to an apparatus for dyeing a textile strand to prevent dye splatter when using aqueous dye.
During the course of dyeing a textile strand, it typically becomes necessary to heat the strand with the dye thereon in order to set the dye or to cause some other chemical reaction within the dye or between the dye and the strand. Several methods are available for dyeing textile strands, particularly traveling textile strands. According to the basic process used in the present invention, the dye in the solution with a polymer or silicone is metered onto the traveling strand so that dye is not wasted. Only a predetermined amount of dye, i.e., that which the strand will fully accept, is applied. The strand is then typically heated to a predetermined temperature within the range of 120.degree. C. to 220.degree. C. to set the dye or cause the aforesaid other chemical reactions to occur.
A problem with this method is that when using an aqueous dye the water within the dye solution is caused to rapidly boil away which can cause dye splatter. As may be expected, the dye splatter causes unsightly disturbances in the textile strand, which are ultimately seen in a finished textile product. It is accordingly desirable to apply the dye and achieve the desired temperature without the resultant dye splatter.

Method for dyeing a traveling textile strand


Coordinated wireless communications using multiple transmission time intervals (TTIs) are described. Multiple TTIs may include a first TTI and a second TTI, the second TTI having a shorter duration than the first TTI. One or more parameters may be determined for communications using the first TTI and the second TTI. A first parameter of the determined parameters for the second TTI may be associated or linked with a corresponding parameter of the first TTI, and communications using the first TTI or the second TTI may be performed using the first parameter. Wireless network nodes using the first TTI may form a CoMP cooperating set, and wireless network nodes using the second TTI may for another CoMP cooperating set, and the first parameter may be applied to each of the CoMP cooperating sets.

The present disclosure, for example, relates to wireless communication systems, and more particularly to communications using several different transmission time intervals of various durations among two or more base stations.
Wireless communications systems are widely deployed to provide various types of communication content such as voice, video, packet data, messaging, broadcast, and so on. These systems may be multiple-access systems capable of supporting communication with multiple users by sharing the available system resources (e.g., time, frequency, and power). Examples of such multiple-access systems include code division multiple access (CDMA) systems, time division multiple access (TDMA) systems, frequency division multiple access (FDMA) systems, and orthogonal frequency division multiple access (OFDMA) systems, (e.g., a Long Term Evolution (LTE) system).
Wireless multiple-access technologies have been adopted in various telecommunication standards to provide a common protocol that enables different wireless devices to communicate on a municipal, national, regional, and even global level. An example telecommunication standard is Long Term Evolution (LTE). LTE is designed to improve spectral efficiency, lower costs, improve services, make use of new spectrum, and better integrate with other open standards. LTE may use OFDMA on the downlink (DL), single-carrier frequency division multiple access (SC-FDMA) on the uplink (UL), and multiple-input multiple-output (MIMO) antenna technology
By way of example, a wireless multiple-access communications system may include a number of base stations, each simultaneously supporting communication for multiple communication devices, which may each be referred to as a user equipment (UE). A base station may communicate with the communication devices on downlink channels (e.g., for transmissions from a base station to a UE) and uplink channels (e.g., for transmissions from a UE to a base station).
Increasingly, many wireless applications benefit from reduced latency communication. Some wireless communications networks may employ communications having different (e.g., shorter) transmission time intervals (TTIs), which may reduce latency. However, coordination among multiple base stations using these different TTIs may present challenges.


The present invention relates to a low impedance band-gap voltage reference circuit which comprises a band-gap reference circuit, a buffer circuit to reduce the impedance and related noise associated with band-gap references electronically coupled with the band-gap voltage reference circuit and a voltage pull-up device electronically coupled with both the band-gap reference circuit and the buffer circuit. The voltage pull-up device acts to reduce the supply voltage required to maintain a stable, low Z band-gap reference voltage.

In the arena of complex integrated circuits, there are sometimes portions of circuits that require voltage references for proper functioning. A voltage reference provides a precise output voltage, one that is much more accurate than can be produced by a voltage regulator. Its output voltage is compared to other voltages in a system and, usually, adjustments are made to those other voltages based on the reference difference. References are similar to regulators in how they function, but they are used much differently. While regulators are used to deliver power to a load, references are normally used with a small, stable load (if any) to preserve their precision. Only a few of the existing reference designs have the capability to deliver a load greater than a few milliamps while maintaining a precision output voltage. A reference is not used to supply power but to provide a system with an accurate analog voltage for comparison purposes. The band-gap reference circuit has long been used in integrated circuits for that purpose.
A band-gap reference takes advantage of the electro-chemical properties of a material. In a semiconductor, the amount of energy which allows the material to become conductive, i.e. move current in the presence of a voltage, is known as the band gap energy. The band gap energy is different for a variety of materials. However, silicon, the foundation material for a preponderance of integrated circuits, has a predictable band-gap energy that changes little with temperature over most of the temperature range of normal integrated circuit operations.
The band-gap reference is widely used in almost every application of IC technology. One common method of band-gap implementation is use of current generated by the delta Vbe of a pair of unijunction transistors which essentially function as diodes. The current then flows through a diode chain to achieve a constant reference band-gap voltage. A significant problem with such simple reference circuits is a high output impedance which can change the reference behavior if the band-gap reference circuit were connected to a high noise stage.
Some early band-gap reference circuits used conventional junction-isolated bipolar-IC technology to make relatively stable low-voltage references. This type of reference became popular as a stable voltage reference for low-voltage circuits, such as in 5-volt data acquisition systems where zener diodes were not suitable.
A common failing in band-gap reference circuits, as mentioned above, is a characteristically high impedance that results in a noisy circuit. Because the demands on a reference get ever tighter with higher precision circuits, a stable low-noise performance is crucial.
Another common failing of band-gap circuits is the requirement for a relatively high VCC, substantially higher than the reference voltage. Since a band-gap voltage is almost always very close to 1.2 volts, a minimum value for VCC is usually somewhere around 2 volts. Since modern digital ICs using 1 volt technology are becoming daily more common, the requirement for a higher VCC can be a design limitation.
What is needed, then, is a band-gap reference circuit that has an innate low impedance to allow for stable low-noise operation. A further need exists for a band-gap reference circuit that can produce a usable reference voltage while being powered by a low supply voltage.


An image analysis device includes: an acquiring unit configured to acquire a moving image showing a variation of a respiratory status, the moving image being formed with frame images including an image of a heart; an image analyzing unit configured to generate a first index indicating a cardiac status with respect to each of the frame images; and an index analyzing unit configured to derive a second index indicating lung function from a change caused in the first indexes by the respiratory status.

Field of the Invention
The present invention relates to an image analysis device that generates an index indicating lung function, an imaging system, and an image analysis program.
Description of the Related Art
In determining whether a person is affected with a pulmonary disease such as chronic obstructive pulmonary disease (COPD), spirometry is performed in some cases. In spirometry, the ventilation volume of the person being tested is measured. From the measured ventilation volume, an index such as vital capacity or forced expiratory volume % in one second is generated in some cases, and a diagram called spirogram is created in other cases.
According to an invention disclosed in PCT/JP 2007/078012, blood flow information is generated. In the invention disclosed in PCT/JP 2007/078012, the site of the heart wall is automatically detected from a chest X-ray moving image, and a change in the site of the heart wall is regarded as movement of the heart wall. A heartbeat phase is estimated from the movement of the heart wall.
Spirometry is useful in diagnosing a pulmonary disease such as COPD. However, spirometry imposes a heavy strain on the person being tested, and reproducibility of test results is not preferable.

Image analysis device, imaging system and non-transitory recording medium generating an index indicating a cardiac status with respect to frame images


An electromagnetic noise filter has a plurality of U-shaped wires passing through a ferrite core. Some of the wires are singly fitted in throughholes, whereas other wires are commonly fitted in throughholes. The wires can be interconnected to provide for impedance to both differential-mode and common-mode noise.

Electronic devices may experience serious operating difficulties when subjected to unintended electromagnetic noise. Such electromagnetic noise, which interferes with the normal operation of the devices, is generally known as EMI. In order to ensure the reliable operation of electronic devices it is desirable that EMI be reduced to a minimum.
The manner in which electromagnetic interference is suppressed is dependent on the nature of the interference. There are two ways undesirable noise can propagate in signal transmission paths: one is differential-mode interference, and the other is common-mode interference.
Differential-mode interference causes the potential of one side of a signal transmission path to be changed with respect to another side. With this type of interference, the interference current path is wholly in the signal transmission path.
Common-mode interference appears between two signal transmission paths and a common reference plane (ground), and causes the potential of both sides of the transmission path to be changed simultaneously and by the same amount relative to the reference plane. Common-mode noise may be caused by an electric (capacitive) or magnetic (inductive) field when interference is induced in both signal transmission paths equally. The noise voltage that is developed is the same in both transmission paths.
Through a process known as common-mode conversion, common-mode noise currents can be converted to differential-mode voltages due to the inherent impedance and capacitance characteristics of the signal transmission paths and the reference plane.
It is well known that noise in signal transmission paths can be reduced by surrounding the electrical conductors of the signal transmission path with a substance capable of absorbing undesired harmonics. Ferrite materials can be used for this purpose.
A typical prior art differential filtering component is constructed as a magnetic core having one or more separately imbedded conductors. However, it is well known that at certain field strengths the core becomes saturated, its permeability reduced, thereby limiting the ability of the core to produce high impedance to undesired noise. When there are more than one conductors imbedded in the same ferrite structure each works as an individual differential inductor with limited mutual coupling. Most of the magnetic flux lines related to the field around one of the conductors will close without encircling other conductors, and any mutual inductance is only due to stray fields. In such a configuration the equivalent circuit consists of differential inductors and common-mode inductors of relatively much smaller value. Such an arrangement results in poor mutual coupling and the structure is suitable mainly for low power differential-mode noise attenuation applications.
In other prior art arrangements, the ferrite core is configured as, for example, an annular ring, with a commonly shared air space for several conductors. The conductors may be wrapped around the core several times in an interleaved fashion to increase mutual coupling. Although such an arrangement may provide high common-mode inductance, this type of core and winding can not be used in circuits requiring high differential inductance. Only leakage inductance, contributed by that part of the magnetic flux not coupled into the other side, produces some differential attenuation. However, this reduces the common-mode effect of the part and forces the designer to compromise on performance. In other words, typical prior art noise filters are generally designed to be effective in applications requiring either a differential-mode inductor or a common-mode inductor, but not both.
Therefore, it is desirable to provide an apparatus which is capable of common-mode noise rejection for pairs of wires carrying differential signals as well as capable of filtering differential-mode noise by in-line inductance.

Combined differential-mode common-mode noise filter


The present disclosure provides methods, systems, and computer-readable media for the detection of valve faults based on transient air pressure measurements. For example, a method for fault detection may comprise actuating a shut off valve to an open position, determining a first air pressure of air in an enclosed space at a first time, determining a second air pressure of the air in the enclosed space at a second time and in response to actuation of the shut off valve to an open position, subtracting the first air pressure and the second air pressure to obtain an actual pressure difference, comparing the actual pressure difference to a predetermined pressure difference, and determining, based on the transient comparison, whether at least one of the shut off valve and a check valve is in a failed state.

Gas turbine engines typically include at least a compressor section, a combustor section, and a turbine section. Such engines may also include a buffer air system. In a buffer air system, multiple bleed ports are regulated by valves and communicate air from the compressor sections to a manifold, from which buffer supply air may be communicated to other portions of the engine or released externally from the engine.
Buffer air systems and mechanical systems in general may fail. The failure of buffer air system valves may impede the proper functioning of the gas turbine engine, as well as systems the engine may power.

Transient fault detection methods and systems


An RS-232C line receiver IC includes a reference voltage generating circuit, a switching circuit, a switch control circuit and a hysteresis output circuit. The reference voltage generating circuit produces a first low reference voltage at a node and a second low reference voltage at a node. The switching circuit has a first and a second switching device connected respectively to the nodes of the reference voltage generating circuit. The switch control circuit selectively makes conductive the first or the second switching device. The hysteresis output circuit to which an input is applied is connected to the first and second switching devices and receives the first or second low reference voltage applied through the first or the second switching device as low input threshold voltages. Selection can be made either for threshold characteristics with a high noise margin and a low error rate for transmitting a high speed clock signal, or for threshold characteristics, which can determine the receiver output state when the input is disconnected and can prevent malfunction of the system, for transmitting a control signal.

The present invention relates to an integrated circuit device for RS-232C line receiver and, more particularly, to an integrated circuit device for RS-232C line receiver (hereinafter referred to as "RS-232 line receiver IC") conforming to the RS-232C standards for a digital data transmission system through an electric cable.
As a type of conventional line receiver IC conforming to the RS-232C standards, the line receiver IC shown in FIG. 3 is the most typical. In such conventional type RS-232C line receiver IC, the hysteresis width is determined by a feedback resistor and the input threshold is fixed. Therefore, although the characteristics of optimal input threshold for transmitting a high speed clock signal are different from those for transmitting a control signal, either of the characteristics must be sacrificed, which is a disadvantage as explained later.

Integrated circuit device for RS-232C line receiver


An antenna array includes an upper antenna and a lower antenna. Each antenna includes a driver dipole element and a director element horizontally spaced apart approximately one eighth wavelength from the driver dipole element. The driver dipole element is preferably approximately one half wavelength in overall length and the director element is preferably one half wavelength in length. The upper antenna is vertically spaced above the ground by approximately one wavelength and the upper and lower antennas are vertically spaced approximately one half wavelength apart. A preferred use of the antenna array is as an amateur radio antenna and a preferred frequency band is 14.0 to 14.350 MHZ corresponding to an approximately 20 meter wavelength.

The present invention relates to a directional antenna and in particular, the spacing between the radiating and directing elements of the antenna.
In some radio communication applications, a radio operator finds it mandatory to communicate with a distant station located in a particular direction. This is particularly important for a radio operator when: a distant station is difficult to hear, the distant station cannot hear the radio operator, or the radio operator wishes to reduce adjacent station interference from another station located in a different direction than the distant station. To accomplish this task, directional antennas are used. Directional antennas are used to boost the effective transmitted radiated power and increase the receiving sensitivity of a station to other stations in a desired direction. Current solutions are found in multi-element antennas (such as a Yagi or a Quad). These antennas generally contain elements which are separated by a half wavelength. Such antennas are usually large in size and may be impracticable to erect in certain locations. A large antenna is also susceptible to wind loading (which could lead to eventual material failure). Additionally, there is always a desire for an antenna with higher performance.
U.S. Pat. No. 2,183,784 for "Directional Antenna," discloses an array of vertically spaced apart antennas. Each antenna comprises a driven element and a directing element, with the antennas vertically spaced apart by approximately one half wavelength. The '784 patent discloses a maximum gain with a horizontal spacing between the driven and directing elements of 0.2 wavelengths and a minimum back radiation with a horizontal spacing between 0.25 and 0.3 wavelengths. While the antenna of the '784 patent achieves some improvement over previous antennas, it also creates wind load issues and even greater improvements are desired. The '784 patent is herein incorporated by reference.
Therefore, a need remains for a directional antenna design which possesses higher gain and a more compact design than present technology antennas with larger footprints and a lesser gain.


Cylindrical battery cell vessels are coupled together in plural sets by pairs of half-shell sleeves. The sleeves conduct heat preferentially in an axial direction. Each sleeve set is mounted onto a heat rejection plate for direct radiation to space. Each satellite of a set of spacecraft has a North and/or South-facing region for mounting the heat rejection plates of the requisite number of cells. Each plate may be fitted with an optical solar reflector (OSR) for reflecting insolation, and for radiating heat energy.

This invention relates to spacecraft, and more particularly to a heat rejection and control mounting for the cells of a battery.
Spacecraft have become important in the fields of communications, military surveillance, monitoring for ecologic conditions, global positioning determination and for weather, including advance notification of storms. The various differing payloads, mission durations and the like make it impossible to use a single spacecraft "bus" to carry the various payloads, because a small bus cannot carry sufficient propellant in addition to its payload for an extremely long mission, whereas a very large bus might be too expensive for the case of a small payload for a short-duration mission. Battery cells are temperature sensitive, and produce heat. Many spacecraft designs isolate the battery cells within the spacecraft structure for better temperature control. The different number of cells required for different missions thus requires detailed thermal analysis. Consequently, the satellite fabrication industry engages in extremely expensive crafting and customization, using such bits and pieces of the design of existing structures as may happen to meet the requirements of the job at hand. The resulting spacecraft must be individually space-qualified, because each differs markedly from the previous spacecraft. The individual crafting and space qualification tends to drive up the cost of the spacecraft and to increase procurement time. Lower costs are desired and shorter procurement times are desired.
FIG. 1 illustrates a spacecraft designated generally as 2100, which includes unfurled four-section solar panels designated 30a and 30b, a body designated generally as 1, including access panels 29a1 and 29a2, an oxidizer tank 20, a first mission-dependent antenna system including a dual-polarization reflector 31a1 and its feed 31a2, and a second reflector 31b1 and its feed 31b2, all as described in copending patent applications filed Sep. 21, 1992 entitled, "Low Cost, Selectable Configuration Spacecraft", in the name of Homer et al; "Spacecraft Thermal Panels & Make-Break Thermal Joints", in the name of Mackey et al; and "Spacecraft-to-Launch-Vehicle Transition", in the name of Homer et al.
FIG. 2a is a simplified, partially exploded perspective or isometric view of spacecraft 2100 of FIG. 1 in its stowed state. In its stowed state, protruding elements, such as solar panels 30a and 30b, and deployed reflectors 31a1 and 31b1 of FIG. 1, are collapsed into close proximity with the main body of the spacecraft, so as to allow the spacecraft in its stowed state to be accommodated within the relatively confined interior of a launch vehicle. Elements of FIGS. 2a, b and c corresponding to those of FIG. 1 are designated by like reference numerals. In FIG. 2a, main body 1 of the spacecraft bus is surrounded by a dash line. Main spacecraft body 1 is generally centered on a longitudinal axis 100. Longitudinal axis 100 is parallel to the axis of a launch vehicle (not illustrated in FIG. 2a). Within main body 1, a payload module portion is designated generally as 2, and includes a north transponder panel assembly 5, a south transponder panel assembly 6, and an earth panel assembly 7, in which the terms "north", "south", "earth" and the like refer to a preferred orientation when the spacecraft is in normal operation. Main body 1 also includes a core module designated generally as 3, which includes a north intercostal panel assembly 16, a south intercostal assembly 17, an east intercostal panel assembly 18, and a west intercostal panel assembly 19, as well as a pair of oxidizer tanks 20 and 21, and a fuel tank 22. Main body also includes a bus module designated generally as 4, which includes an east base panel 24 and a west base panel 25. The Main body 1 further includes a south bulkhead panel 8, a north bulkhead panel 9, southwest access panel 29a1, northwest access panel 29a2, southeast access panel 29b1, and northeast access panel 29b2. The various panels and their associated reference numerals are illustrated separately in FIG. 2c. In general, payload module 2 is arranged to be supported by core module 3, and both payload module 2 and core module 3 are provided with attitude control, electrical power control, and other services by bus module 4 after launch.
In addition to main body 1, the structure of FIG. 2a includes a stowed north-side solar array panel assembly 30a, and a stowed south-side solar array panel assembly 30b. Antenna reflector 31a1 and its feed 31a2 are illustrated in close proximity on the west side of the spacecraft. Similarly, on the east side, stowed reflector 31b1 is in close proximity to its feed 31b2. Two sets of access panels designated 29a1, 29a2 and 29b1 and 29b2, are illustrated exploded away from their normal positions, which are between intercostal panel assemblies 16, 17 and corresponding portions of transponder panel assemblies 5 and 6.
FIG. 2 also illustrates a bulkhead panel 8, which lies between south transponder panel assembly 6 and south intercostal panel assembly 17, and a further bulkhead panel 9 which lies between north transponder panel assembly 5 and north intercostal panel assembly 16. An optional extension panel designated 10 extends south transponder panel 6, and a similar panel extension 11 extends north transponder panel 5. Various boxes designated 13a, 13b, 13c, 13d, 13e and 13f are mounted on panel extensions 10 and 11, on earth panel 7 and on the interior of north transponder panel 5. Boxes 13 represent portions of the payload, which may vary from mission to mission.
A portion of the outer surface 507 of south transponder panel 6 and the interior support honeycomb in FIG. 2a is cut away, to reveal portions of heat pipes designated 12 and the reverse surface 506 of panel 6. A portion of the outer surface 597 of earth panel 7 is similarly cut away to reveal portions of its heat pipes 612. The heat pipes are further described below in conjunction with FIGS. 5 and 6. A few of the optical surface radiators (OSRs) 505 are illustrated, mounted on surface 507 of transponder panel 6.
An unmanned launch vehicle such as Atlas, Delta or Ariane generally includes a support or adapter ring which supports the spacecraft during lift into orbit. In FIG. 2a, the launch vehicle adapter ring is illustrated as 14. A transition support illustrated as 15 transfers forces between adapter ring 14 and various panel members of core module 3, such as intercostal panel assemblies 16, 17, 18 and 19. As described below in conjunction with FIGS. 3a, 3b, 3c and 3d, transition 15 is a reinforced composite ring of varying cross-sectional shape, the circumference of which remains constant along its axial length. A series of projecting tabs, individually designated 60, are associated with transition 15, for providing support for base panels 24 and 25 of bus module 4. FIG. 2a also illustrates various attitude control thrusters, which are designated 23, and which are connected by propellant and control lines to core module 3. Bus electrical components 26, reaction or momentum wheels 27, and battery modules 28 are mounted on bus module 4. A portion of an apogee thruster 35 is visible, projecting below core module 3.
FIG. 2b illustrates core module 3, further exploded to reveal interior details. Elements of FIG. 2b corresponding to those of FIG. 2a are designated by like reference numerals. In FIG. 2b, the structure of intercostal panel assemblies 18 and 19, and their interface with the upper end of support transition 15 may be seen. Also, it is evident from FIG. 2b that oxidizer tanks 20 and 21 are supported at their tops and bottoms by support struts illustrated as 33, and fuel tank 22 is supported at its top by support struts 34.
FIG. 3a is a perspective or isometric view of launch vehicle adapter ring 14, support transition 15, and upper "ring" 62. Upper ring 62 provides the interface between transition 15 and the intercostal panels 16, 17, 18 and 19 of FIG. 1. Since the intercostal panels are straight, upper support "ring" 62 is formed of straight segments 62a, 62b, 62c and 62d in a square or rectangular configuration. Each section, such as section 62b, of upper support ring 62, includes an upper socket portion 63 dimensioned to accept an intercostal panel, such as intercostal panel 19 illustrated in the cross-sectional view of FIG. 3b. Ring portion 62b of FIG. 3b also includes a lower socket portion 64 dimensioned to accept the upper edge of transition support element 15. As also illustrated in FIG. 3b, launch vehicle adapter support ring 14 includes a lower socket, circular in form, dimensioned to accept the lower edge of transition support structure 15. The spacecraft with its transition support structure is held to launch vehicle adapter support 14 by a clamp band (not illustrated), which is released at the time of separation. Referring once again to FIG. 3a, transition support structure 15 supports the intercostal panels, as mentioned above, by way of upper support ring 62. A portion of the load of the spacecraft is also applied part-way down the transition by a series of protruding tabs 60. Tabs 60, in association with the lower part of transition 15, transfer loads between launch vehicle adapter ring 14 and east and west base panels 24 and 25 of bus module 4, illustrated in FIG. 2a. FIG. 3c is a cross-sectional view through a portion of transition support member 15 at a tab 60, illustrating how protruding tabs 60 are positioned for attachment to east base panel 24. The actual connection may be by an adhesive, bolts, or a combination. Items 65 and 66 of FIG. 3a, and their counterparts (not visible) on the other side of the transition, are protruding tabs for attachment of the transition support to the north and south bulkheads, and north and south intercostal panels, respectively.
FIG. 3d illustrates support transition 15 during its fabrication. As mentioned, support transition 15 is a reinforced composite structure. The upper end of transition 15 has the overall form of a square (or rectangle, or other polygon, if desired) with rounded corners, and the lower end is circular. In one embodiment, the structure is fabricated using carbon reinforcing fiber tape laid up on a mold, and impregnated with a resin matrix. FIG. 3d illustrates a reinforcing fiber tape 67a in the process of being laid from the lower edge toward the upper edge, along a longitudinal track 67b illustrated by dash lines. As mentioned, the circumference of support transition 15 at any plane orthogonal to longitudinal axis 100 is equal to that at any other plane. This has the advantage that, when tapes 67a are laid along longitudinal tracks 67b, they may be laid side-to-side without overlapping at the top, as would be the case if the support transition were smaller in circumference at the top than at the bottom. Consequently, support structure 15 does not become thicker toward the top (due to the overlap of the tapes) compared with the bottom, but remains of the same thickness throughout its axial length. Such increased thickness at the top would undesirably add weight to the vehicle, and provides additional strength in regions in which it is not necessary. The forces during launch are greatest near the bottom of the transition, as a result of torques, which act through a moment arm equal to the axial length of the support transition, and also because support tabs 60, described above in conjunction with FIGS. 3a and 3c, cause some of the loads to be applied to support transition 15 half-way down the transition. Thus, strength is needed at the bottom, not the top. The constant circumference of support transition 15 has a further advantage, in that a layer of reinforcing fiber tape, such as 67c of FIG. 3d, which is applied to the structure along a track illustrated as 67d which is at some selected angle, such as 45.degree., relative to the longitudinal axis 100, will maintain that same (45.degree.) angle throughout its entire track from the lower edge to the upper edge of the structure. Thus, the known characteristics of successive layers of longitudinal and .+-.45.degree.-oriented fiber reinforcements can be relied upon. If the circumference were not constant along the length of the transition, the angle of track 67d would vary along its length, with the result that, under extreme conditions, track 67d might take on angles resulting in a return of the tape to the lower edge, rather than continuing to the upper edge. In any case, the angle of the fiber reinforcement could not be guaranteed.
FIG. 4a illustrates, superimposed upon one another, various members, designated 2100.sup.1, 2100.sup.2, 2100.sup.3 . . . of a set of spacecraft. FIG. 4a is merely illustrative, and the set of spacecraft may have more or fewer members than 5. Each member of the set has an axial length, measured in the direction of longitudinal axis 100, which is different from that of other members of the set. For example, member 2100.sup.1 of FIG. 4a is shorter than member 2100.sup.2. The longest member of the set illustrated in
FIG. 4a is 2100.sup.5. The lateral or cross-sectional dimensions W1 of all member spacecraft of the set of spacecraft of FIG. 4a are identical, so that they may be fitted within the same launch vehicle. Naturally, payload-specific portions, while they must lie within the confines of the launch vehicle, may deviate from this requirement.
As mentioned, low cost is achieved when certain standardized incremental axial dimensions are used, which as an example may be five inches. The length dimension difference among the members 2100 of the set of FIG. 4a is five inches. FIG. 4b represents a range of sizes of the combination of support transition element 15 and core modules 3 which are associated with the various members of the set illustrated in FIG. 4a. The cross-sectional dimensions, as represented by dimensions W.sub.2 of core module 3.sup.1 and 3.sup.5 of FIG. 4b, are identical for all members of the set of spacecraft. As illustrated in FIG. 4b, a core module 31 is associated with the shortest axial length member, 2100.sup.1, of the set of spacecraft illustrated in FIG. 4a. A longer core module 3.sup.5 is associated with the longest member, 2100.sup.5, of the set of spacecraft illustrated in FIG. 4a. Other members of the set of spacecraft of FIG. 4a having axial lengths lying between the extremes will have core module lengths lying between the two lengths illustrated in FIG. 4b. FIG. 4c illustrates a spherical fuel tank 22.sup.1, which is associated with the shortest member, 2100.sup.1, of the set of spacecraft of FIG. 4a. As illustrated, fuel tank 22.sup.1 is made up of two hemispheres 222. FIG. 4c represents a range of fuel tank sizes created by adding cylindrical portions, such as cylindrical portion 223, between hemispheres 222. Cylindrical portion 223, together with end hemispheres 222, form a fuel tank 22.sup.5 elongated in the direction of axis 100, which is associated with the longest member of the set of spacecraft of FIG. 4a, namely member 2100.sup.5. Other spacecraft of the set will have fuel tanks 22 with lengths lying between the lengths illustrated in FIG. 4c, by addition of other lengths of cylindrical portion 223. The length increments of cylindrical portions 223 of the fuel tanks are five inches, to correspond to the other length increments illustrated in FIGS. 4a through 4g. It will be clear that all of the fuel tanks 22.sup.1 . . . 22.sup.5 of FIG. 4c will have identical cross-sectional dimensions in a plane perpendicular to longitudinal axis 100. The increased length of fuel tank provided by the addition of cylinder 223 increases the tank's volume, so a longer spacecraft can carry more fuel, without being larger in lateral dimensions. This method of increasing the volume of the tank is particularly important, because the incremental cylindrical tank portion does not result in a need to space-qualify the different volume tank.
FIG. 4d represents a south transponder panel assembly 61 having a first length in the direction of axis 100, and represents a range of sizes in predetermined increments of five inches, up to a length represented by south transponder panel assembly 6.sup.5. The width dimension W.sub.4 of panel 6.sup.1 is equal to that of panel 6.sup.5. The longest panel assembly 6.sup.5 is associated with the longest member spacecraft, member 2100.sup.5, of the set of spacecraft illustrated in FIG. 4a, while panel 61 of FIG. 4d represents the south transponder panel assembly associated with the shortest member spacecraft, member 2100.sup.1, of the set of FIG. 4a. The overall dimensions of body 1 of the spacecraft of FIG. 2a are established at least in part, by the widths of transponder panels 5 and 6, and in the other direction by the widths of intercostal panels 18 and 19 and bulkhead panels 8 and 9. So long as the widths of these panels are identical among members of a set of spacecraft, the cross-sectional dimensions of the spacecraft will be the same from one member of the set to the other. Naturally, other panel assemblies, such as those described in detail in conjunction with FIGS. 2a, 2b and 2c, may be extended in axial length in a similar manner. The increase in the axial length of the transponder panels of longer spacecraft of the set, compared with shorter spacecraft, increases the heat rejection capability of the spacecraft relative to a shorter spacecraft. Therefore, a longer spacecraft of a set can carry a higher-power payload, without change in the lateral dimensions, than a shorter spacecraft. The increase in axial length of the transponder panels of longer spacecraft of the set also increases the available mounting area and volume available for mounting payload boxes.
FIG. 4e represents a solar panel 301, which has a dimension in the direction of axis 100 which is less than the corresponding dimension of another solar panel 30.sup.5, but all of which have a common lateral dimension W.sub.5. FIG. 4e represents a range of values in predetermined increments of five inches. Each solar panel represented by FIG. 4e is associated with a corresponding length member spacecraft of the set of spacecraft of FIG. 4a, for providing greater surface area notwithstanding the constant panel width W.sub.5, to thereby provide, when deployed, increased power generation for the longer spacecraft.
FIG. 4f represents a range of oxidizer tanks which may be used with the various different length members of the set of spacecraft of FIG. 4a. The smallest member of the set of tanks illustrated in FIG. 4f is designated 20.sup.2, suggesting that the set may include a smaller member tank, if desired, which would be in the form of a sphere (not illustrated) including two hemispheres 220. As illustrated, member 20.sup.2 is formed of two hemispheres 220, together with a cylindrical portion 221.sup.2. The largest tank of FIG. 4f is designated 20.sup.5, and includes hemispheres 220 and a longer cylindrical portion 221.sup.5. The diameters of hemispheres 220 are identical, so the cross-sectional dimensions of all oxidizer tanks 20.sup.x of a set of spacecraft are identical, where superscript x is an index representing any one of the members. The volume of tanks 20, of course, increases with increasing length, so more oxidizer can be fitted within a longer member of the set of spacecraft than within a shorter member, without further space qualification.
FIG. 4e represents as structures 50.sup.1 and 50.sup.5, heat pipe assemblies of various lengths, each of which may be associated with a panel, such as a transponder panel, of a member of the set of spacecraft of FIG. 4a. The heat pipe assemblies are further described below in conjunction with FIGS. 5 and 6. As illustrated in FIG. 4g, "vertical" portions of the heat pipes may be elongated in a direction parallel with longitudinal axis 100. The lengths of the heat pipes may be adjusted in increments to adjust the area available for thermal radiation to match the panel heat rejection capability to the requirements of high or low power payloads. Thus, while the panels change dimensions, the heat pipe structures may or may not change length, depending upon the payload heat load.
FIG. 4h tabulates some of the variables associated with a particular set of spacecraft being planned. Row I indicates that the fuel tank length ranges from a minimum of 36 inches in the longitudinal direction to a maximum of 76 inches, in 5-inch increments. Rows II through VIII are self-explanatory. Row IX indicates that the solar array panels each have a maximum area of 63 square feet, and a minimum of 40 square feet, and "one or the other" means that the initial plans, for cost and manpower reasons, is limited to one increment, which is a multiple of five inches. It is expected that later spacecraft members of the set will include intermediate dimensions. As also listed in Row XI of FIG. 4h, upper thrusters 23a, illustrated in FIGS. 2a and 2b, are fixed with respect to earth panel 7, and as the transponder panel lengths increase in 5" length increments, upper thrusters 23a also become more distant from the launch vehicle separation plane (S.P.) by 5" increments. The position of arcjets 236 listed in Row XII is "TBD", to be determined based on the specifics of the mission and the resulting location of the center of gravity (CG). The lower thrusters 23c are at a fixed height with respect to the launch vehicle separation plane. The multiplex (MUX) extension panels 616 listed in Row XIV and the Earth heat pipes in Row XV are described in conjunction with FIG. 6a. The number of nickel-hydrogen battery cell pressure vessels (Pvs) are listed in Row XVI.
FIG. 5a is a cross-section of a portion of south transponder panel 6 of FIG. 2a, illustrating an inner face sheet 506, face sheet 507, and an interior low density core in the form of a honeycomb 508. As known, the face sheets and honeycomb are conventionally made from aluminum for low cost, light weight and good thermal conduction, but may be of other materials. In particular, face sheets of carbon fiber reinforced resin are contemplated. FIG. 5b is an elevation view of panel 6 with face sheet 507 and the honeycomb filling 508 removed, to expose the heat pipes extending therethrough. As illustrated in FIG. 5b, a first "header" heat pipe 502 extends from left to right across the top of panel 6, and a second header heat pipe 504 extends from left to right across the bottom of the panel. Also in FIG. 5b, a first set of heat pipes, designated generally as 570, lying between header heat pipes 502 and 504, includes a heat pipe 12a, which has a straight portion which extends upwardly from header 504 to a plane 514 transverse to axis 100. Heat pipe 12a includes, in addition to the straight portion, a portion in the general shape of a letter "J", with a bottom portion 566a in thermal contact with header pipe 504, and with a "hook" portion 568a which extends upwardly a short distance away from header heat pipe 504. The "hook" portion of the heat pipe is a location in which excess heat transfer liquid tends to accumulate when ambient conditions create such an excess. Heat pipe set 570 of FIG. 5b includes another heat pipe designated 512a, which also includes a straight portion which extends downwardly from header heat pipe 502 to a transverse plane 510 which lies below transverse plane 514. Heat pipe 512, in addition to the straight portion described above, also includes a portion in the general shape of the letter "J", including a "bottom" portion 516a and a "hook" portion 518a which extends downwardly a short distance. In an overlap region O lying between transverse planes 510 and 514, the straight portions of heat pipes 12a and 512a are juxtaposed and in thermal contact.
A plurality of additional sets or pairs of heat pipes 12, 512 are arranged between upper header heat pipe 502 and lower header pipe 504. For example, a heat pipe 12b includes a straight portion extending upwardly from header heat pipe 504 to transverse plane 514, and a J-shaped portion including a bottom portion 566b in thermal contact with header 504, and a hook portion 568b extending upwardly a short distance from header 504. The hook portion of heat pipe 12b is in thermal contact with heat pipe 12a. Heat pipe 12b is juxtaposed in region 0 with a straight portion of a heat pipe 512b, which extends downward from header 502, and which also includes a bottom portion 516b extending along header 502, and a hook portion 518b, extending downwardly from header heat pipe 502, which is in contact with the straight portion of heat pipe 512a Additional heat pipe pairs 12c, 512c . . . 12n, 512n, each with its associated bottom portion 566c, 516c. . . 566n, 516n and hook portion 568c, 518c . . . 568n, 518n, respectively, provide heat distribution throughout panel 6. An additional set of heat pipes similar to that described above, and designated generally as 570', is symmetrically disposed about axis 100 in FIG. 5b relative to set 570. The numbering of heat pipes of set 570' is the same as that of the heat pipes of set 570, with the addition of a prime. As mentioned, FIG. 5b represents south transponder panel 6 of FIG. 2a, and a similar set of heat pipes is embedded within north transponder panel 5, as illustrated below in conjunction with FIG. 6a.
In general, one of north or south transponder panels 5 or 6 of FIG. 2a will be facing a cold region of space, and will not be subject to heat loading from the sun. That transponder panel will radiate thermal energy to space through its optical surface radiators (OSRs) 505. Heat pipes 12 and 512 associated with panel 6 distribute heat "vertically" through the panel to tend to equalize temperature. Overlap region 0 is particularly suited for the mounting of higher-power portions of payload modules 13 (FIG. 2a), because heat generated within overlap region O is carried both upward (by heat pipes 512) and downward (by heat pipes 12).
As mentioned in conjunction with FIGS. 4a-4g, the heat rejection capability of the transponder panels increases as the dimension of the heat pipe network in the direction of axis 100 increases. FIG. 5c illustrates a south transponder panel 506, with a heat pipe network 12, 512 which is axially extended compared with that of FIG. 5b (longer in the direction of axis 100 than in the panel of FIG. 5b), but in which individual the heat pipes 12, 512 have the same physical lengths as in FIG. 5b. That is, lengths L1 of heat pipes 12 of FIG. 5b are equal to lengths L1 of heat pipes 12 of FIG. 5c, and lengths L2 of heat pipes 512 of FIG. 5b are equal to lengths L2 of heat pipes 5 of FIG. 5c. Overlap region 01, however, is shorter than overlap region 0 of FIG. 5b, so the area within which higher power payload components may be installed is smaller. Such an arrangement, in which different members of a set of spacecraft have the same length heat pipes, notwithstanding that the panel itself and the heat pipe network are longer, is advantageous when heat pipes of a particular length are stocked in inventory, and cutting is not desired.
FIG. 5d illustrates a panel 506.sup.2 corresponding to panel 506 of FIG. 5c in dimensions, but in which heat pipes 12 and 512 are lengthened to lengths L.sub.1.sup.1 and L.sub.2.sup.1, respectively, to maintain overlap region 0 identical in size to overlap region 0 of FIG. 5b. Both extended panels 506 and 506.sup.2 have the same area, and therefore ultimately have the same heat rejection capability for a given temperature rise, but the heat distribution capability and thermal radiation in the presence of high power payload components will be improved in the arrangement of panel 506.sup.2 of FIG. 5d. Such an arrangement, in which the heat pipes themselves are adjusted in length, may be desirable when long heat pipes can be fabricated, which are pinched off, cut at the pinch, and welded closed, to produce the desired length.
FIG. 6a represents north and south transponder panels 5 and 6, and earth panel 7 of FIG. 2a, skeletonized by removal of OSRs 505, surface sheets 507 and honeycomb core 508 of panel 6, and by removal of most of a surface sheet 597, and all of the honeycomb of panel 7 to expose the entire heat pipe configuration of those panels. In FIG. 6a, the heat pipe arrangement of panel 6 is similar to that described in conjunction with FIG. 5b, and corresponding elements are designated by the same reference numerals. Elements of north transponder panel 5 corresponding to those already described in conjunction with south transponder panel 6 are designated by the same reference numerals primed. In FIG. 6a, a set of heat pipe pairs, one of which is designated as 612, is incorporated into earth panel 7. Heat pipes such as 612 are in juxtaposed pairs, with J-shaped ends, similar to the heat pipe pairs 12, 512 of transponder panel 6. The J-shaped ends of heat pipe pairs 612 of earth panel 7 abut header pipes such as 502 or 502.sup.1. This allows heat flow across panel 7, from header 502 to header 5021, and vice versa. The heat transfer from panel to panel is accomplished in a heat transfer region designated 695, as for example heat transfer between panels 6 and 7 occurs in heat transfer region 695a, and, between panels 5 and 7, in region 695b. The arrangement illustrated in FIG. 6a has the advantage that, when one of north or south transponder panels 5 or 6 is hotter than the other, as may occur, for example, due to sun loading or due to an unbalanced heat load, heat will travel upward along that transponder panel, will transfer by way of a header heat pipe 502 in a heat transfer region 695 to the heat pipes 612 of earth panel 7, through heat pipes 612 to the header pipe of the other, cooler one of the north or south transponder panels, and will raise the temperature of the initially cooler panel. The increased temperature results in rejection of the heat. Also, the header heat pipe tends to decrease transverse temperature gradients across the panels. Thus, the heat rejection capability of the spacecraft as a whole is enhanced. Additionally, that portion of the heat load produced by payload components, such as components 13a, 13b, and 13c of FIG. 2a which are mounted on earth-facing panel 7, which exceeds the heat rejection capability of panel 7, is transferred efficiently along heat pipes 612 to header pipes 502, 502.sup.1, and transferred to the transponder panels 5 and 6 for rejection thereby. Regions 615 and 616 of north and south transponder panels 5 and 6 lack heat pipe temperature transfer capability. These regions, which may vary in size, may be used for mounting of low-power equipment. Thus, the Earth panel 7 may be used for mounting of equipment, as well as the transponder panels 5 and 6. The available mounting areas may therefore be more fully populated, with a resulting reduction in overall spacecraft size.
FIG. 6b is a detail of FIG. 6a, illustrating thermal components in a portion of the juncture of south transponder panel 6 and earth panel 7. Elements of FIG. 6b corresponding to those of FIG. 6a are designated by like reference numerals. In FIG. 6b, the cross-sectional exterior shape of the heat pipes is seen to be square. This provides flat surfaces for maximum heat transfer among the heat pipes. The 3-dimensional "J" shape precludes incorrect orientation during installation of the heat pipes. However, square cross-section is desirable, because the "J's" may be bent in the wrong plane, and even in a region of straight heat pipes using a rectangular cross-section other than square, adjacent heat pipes might be differently oriented, and the panel sheet would make good thermal contact with the "taller" pipe, but would have to deform away from a flat condition to contact the adjacent "shorter" heat pipe. As illustrated in FIG. 6b, heat pipe 512a, on panel 6 has a straight lower portion in contact with the straight upper portion of heat pipe 12a', its bottom portion 516a, in contact with header heat pipe 502, and its hook portion 518a, thermally free. Also in panel 6, heat pipe 512b, has its bottom portion 516b positioned adjacent header 502, and its hook portion 518b, positioned adjacent the straight portion of heat pipe 512a. On earth panel 7, a corresponding set of "J" shaped heat pipes 612, 6512, is similarly arranged. For example, heat pipe 612a' has a straight portion lying against a straight portion of a heat pipe 6512a4- , a bottom portion 666a' positioned somewhat offset, overlapping a portion of header heat pipe 512 and also a portion of the bottom portion 516a' of south panel 7 heat pipe 512a', and a free hook portion 668a. Similarly, another heat pipe 612b' of earth panel 7 includes a straight portion in thermal contact with a straight portion of a heat pipe 6512b', and also has a bottom portion 666b' lying in an overlapping relationship against both header heat pipe 502 and the bottom portion 516b' of heat pipe 512b', and further has its hook portion 668b' against the straight portion of heat pipe 612a'. The relationship of the other heat pipes of panels 6 and 7 in the region near header pipe 502 will be understood from FIG. 6b without additional description.
FIG. 6c is a view of the panel junction of FIG. 6b looking in the direction of section lines 6c-6c. In FIG. 6c, elements corresponding to those of FIG. 6b are designated by like reference numerals. Also, the letter "J" has been added to identify the "J"-shaped portion of a heat pipe, and the letter "H" identifies a header heat pipe. In FIG. 6c, the overlapping position of the "J" bottom portion 666d, relative to header heat pipe 502 and the "J" bottom portion 516d, is evident.
South transponder panel 6 as illustrated in FIG. 6c is fastened to earth panel 7 by fasteners, designated generally as 680, which connect through panel 6 (and an extension designated 6', if desired) into a flange 670 associated with panel 7. A thermally conductive grease, or other thermally conductive material or gasket, may be applied between the flange and panel 6 to improve heat transfer in heat transfer region 695. One thermally conductive material currently being evaluated is Grafoil, a sheet gasket material produced by Union Carbide.
FIG. 6d illustrates another embodiment, similar to FIG. 6c, but in which two additional header heat pipes 602 provide increased heat transfer along the junction, and an additional set of heat pipes 603 extends through earth panel 7, to increase the heat flow capacity. FIG. 6e shows yet another embodiment, with two header heat pipes and two "J" portions in earth panel 7, and with two header heat pipes and one "J" section in the adjacent south transponder panel 6.
When prior art spacecraft panels support electrical equipment such as RF power amplifiers, they also include controllable heaters associated with each amplifier, which heaters are designated to dissipate about the same amount of heat as the associated RF power amplifier. When an amplifier has its energizing power removed, as when it is taken off-line, the associated heater is switched on, to thereby help to maintain thermal balance. Since the spacecraft bus is intended to be readily used with different payloads, it is advantageous to do away with the individual heaters for each piece of electrical equipment. Instead, a feedback heat control system is associated with each panel. The heat control systems uses thermostats and heaters, represented by 72 of FIG. 2a, located on the inside surfaces of north and south transponder panels 5 and 6, and on the inside surface of earth panel 7. One heater is ordinarily provided for each heat pipe of a network of heat pipes. The set-point temperature and available power are based upon a detailed study of the payload.
FIG. 7 tabulates the characteristics of three spacecraft members of a set of communications spacecraft, intended to launch on three different launch vehicles. The three different versions are designated by column headings la, 1b and 1c. As tabulated in Row I, the launch vehicles are Atlas II, Delta II, and Ariane 4. The characteristics of the spacecraft bus and payload in Rows II through V are self-evident. The payload set of Row VI represents the number of communication channels, the design transmission watts per channel, and the frequency band. Thus, in the "1a" column, the spacecraft carries 24 12-watt C-band amplifiers, and another 24 60-watt Ku-band amplifiers, for a total of 48 channels. The antennas listed in Row VIII of FIG. 7 are dual-surface (DUAL SURF), frequency reuse by polarization diversity types. The 1a column lists a total of 2 antennas, each with a reflector diameter (.phi.) of 85 inches. The other two versions tabulated in FIG. 7 each carry one dual-surface 60-inch diameter reflector. The remaining items in FIG. 7 are self-explanatory.
FIGS. 8a, 8b and 8c are simplified elevation outline views of the three spacecraft tabulated in columns 1a, 1b and 1c of FIG. 7, respectively, mounted on their boosters, ready for launch.


An electronic device includes a fork structure having a pair of arms disposed in spaced relation and defining an open-ended channel therebetween. A surface of channel defines a seat opposite the open end. The channel has a width W1 at its narrowest section. A rigid wire of an electrical component is disposed in the channel generally adjacent to the seat. The wire has a width W2 that is greater than the width W1 so surfaces of the channel at the narrowest section defined by width W1 interfere with the wire, preventing the wire from moving towards the open end of the channel. The pair of arms are constructed and arranged to be moved toward each other so as to crimp the wire to the fork structure.

With reference to FIG. 1, a portion of an electric component, such as a capacitor 10, is shown having a rigid wire 12. An end 14 of the wire 12 is shown crimped and welded to a conventional fork structure 16 to make a mechanical and electrical connection therewith. As shown in FIG. 2, prior to crimping, the fork structure 16 has a U-shaped distal end 18 having a constant width channel 20 that receives the end 14 of the wire. FIG. 3 shows the wire end 14 crimped and welded to the fork structure 16. With such a U-shaped channel 20, it is difficult to assembly the wire end 14 to the fork structure 16 in a drop-down orientation, since there is no positive retention for the wire end 14. Thus, the wire end 14 can ride-up the channel 20 during crimping and thus can become over-compressed or damaged. Also, the fork structure 16 can be damaged. Note that as shown in FIG. 3, the wire 12 cross-section is deformed from circular (FIG. 2) to oval shape due to being over-compressed by the fork structure 16.
Thus, there is a need to provide a fork structure for an electrical and mechanical connection that positively retains and centers a wire during crimping and welding to avoid over-compressing the wire.

Fork structure for positive retention and centering a wire for electrical connection


The present invention relates to an improvement in the safety and a reduction in a current consumption in a battery device which is capable of calculating the remaining amount of a lithium ion secondary battery. If the charging and discharging current becomes equal to or lower than a given value, circuits including a current monitoring circuit operate so as to reduce the current consumption. In this situation, the current monitoring circuit stops to function. A control circuit is connected with a differentiating circuit, and if a voltage between both ends of the sense resistor changes, a charging and discharging current monitoring circuit is again operated. With the above solving means, the current consumption can be suppressed, and a precision in the current monitor can be enhanced.

The present invention relates to a technique of improving the safety and reducing a current consumption in a battery device and in a battery state monitoring circuit capable of calculating the remaining amount of a secondary battery such as lithium ion secondary battery.
As a conventional battery state monitoring circuit, there has been known a device shown in a circuit block diagram of FIG. 2. This structure is disclosed in, for example, Japanese Patent Application Laid-open No. Hei 9-312172, xe2x80x9cBattery Pack, Charger, Charging System and Charging Method.xe2x80x9d This relates to a battery device which is called xe2x80x9cSmart Battery Systemxe2x80x9d.
The lithium ion secondary battery used in the smart battery system requires an over-charge protecting circuit since it is not provided with a self-protecting operation unlike a nickel/cadmium battery. A battery device 22A is equipped with a battery voltage monitoring circuit 4A for detecting a battery voltage and a switch element 12 for stopping the charging from an external charger 21.
The battery device 22A controls the indication of the remaining amount of each of secondary batteries 7 to 10, the stop of charging, etc. A microcomputer 6A is inputted with an output voltage V3a of a current monitoring circuit 3A and an output voltage V4a from a battery voltage monitoring circuit 4A. The microcomputer 6A is capable of calculating the charging currents and the discharging currents of the secondary batteries 7 to 10 and the respective battery voltages based on the inputted voltages V3a and V4a to calculate the remaining amounts of the secondary batteries 7 to 10. Also, the microcomputer 6A controls the on/off operation of the switching elements 12 and 13 in accordance with the state (normal, over-charging, over-discharging and over-current) of the secondary battery. That is, the microcomputer 6A controls the protecting function (over-charging protection, over-discharging protection and over-current protection) of the battery device 22A.
In the battery device 22A, a battery state monitoring circuit 14A has a total battery voltage VBa of the secondary batteries 7 to 10 as a power supply.
The microcomputer 6A is inputted with an output V1a of a regulator 1A as a power supply of the microcomputer 6A. since the total battery voltage VBa of the secondary batteries 7 to 10 changes in accordance with the status of a load 20 connected between a plus terminal 15 and a minus terminal 17 of the battery device 22A, the total battery voltage Vba is regulated to a constant voltage V1a such as 3.3 V or 5.0 V by a regulator 1A and then supplied to the microcomputer 6A.
The microcomputer 6A is inputted with an output current I3a (in the for m of a voltage V3a) of the current monitoring circuit 3A and calculates the remaining amount of the battery in accordance with the output current I3a. In general, the output of the current monitoring circuit 3A is an analog value which needs to be converted into a digital value in order to calculate the remaining amount of battery by the microcomputer 6A. For that reason, an A/D convertor circuit is installed in the microcomputer 6A.
As described above, because the power supply of the battery state monitor circuit 14A is supplied from the secondary batteries 7 to 10, an electric power is consumed from those secondary batteries.
Also, the charging and discharging voltage/current from the secondary batteries are not constant but largely change in a short period of time in accordance with the status of the load 20 or the status of the charger 21. For that reason, in order that the battery state monitoring circuit 14A monitors the charging and discharging current from the secondary batteries 7 to 10 with a higher precision, the operating frequency of the A/D convertor installed in the microcomputer 6A needs to be set as high. As the operating frequency of the A/D convertor is set as high, the current consumption of the microcomputer 6A is further increased, to thereby further increase the consumption of a power from the secondary batteries.
Under the above circumstances, there has been proposed a method of stopping the A/D convertor within the microcomputer 6A and the charging/discharging current monitoring function as a technique in which, in the battery state monitoring circuit 14A, when the charging and discharging current of the secondary batteries 7 to 10 is small, for example 0 to 10 mA, as compared with the battery capacity of the secondary batteries, the current consumption of the entire circuit including the charging and discharging monitoring circuit 3A is reduced, to thereby suppress the power consumption of the secondary batteries 7 to 10.
In this state, the consumed current of the battery state monitoring circuit 14A is reduced down to 1/10 to 1/1000. In this way, the state where the consumed current is reduced is called xe2x80x9cpower save modexe2x80x9d.
However, certain conditions are required when the operation is returned from the power save mode to the normal operation. A function of returning the battery state monitoring circuit 14A to the normal operation is called xe2x80x9cwake upxe2x80x9d. The condition for waking up is set, for example when xe2x80x9cthe charging and discharging current of the secondary batteries 7 to 10 exceeds 1 ampere.xe2x80x9d Under that condition, the minus pole voltage V21a of the charger 21A is a small value lower than 50 mV.
In order to detect such a fine voltage, the current monitoring circuit 3A must make an offset voltage small so that the fluctuation of the detected wake-up voltage is reduced. Also, since the current monitoring circuit 3A operates even in the power save mode, the current consumption must be reduced. The current monitoring circuit of this type is complicated in structure and cannot be realized by a simple and inexpensive circuit.
In order to solve the above problems, according to the present invention, a filter is disposed between a sense resistor terminal and a control circuit, which is capable of reducing the current consumption of the entire circuit when the charging and discharging current value becomes small and detecting the current when the charging and discharging current becomes large.
The circuit is structured in such a manner that only the current monitoring circuit operates when the charging and discharging current value becomes small, and the sense resistor terminal and an input terminal of the control circuit current are connected with a capacitor so that all the functions for detecting the remaining amount of a battery start to be executed when the charging and discharging current changes.

Battery state monitoring circuit having differentiating circuit


An article of footwear includes an upper and a sole connected to the upper. The sole includes a plurality of cleat mounts. A plurality of cleats is releasably connected to the cleat mounts of the sole. Each of the plurality of cleats includes a mount coupling and a plurality of legs connected to the mount coupling. The mount coupling is configured to engage one of the plurality of cleat mounts and releasably connect the cleat to the sole. The plurality of legs includes at least one lateral leg having a first hardness and at least one medial leg having a second hardness, the first hardness different from the second hardness.

Cleats are commonly used by athletes participating in any of various sports and other athletic activities. The configuration and arrangement of cleats on the sole of the shoe typically varies from sport-to-sport in order to provide the athlete with desired ground engagement when participating in a particular sport.
In the sport of golf, cleats contribute to stabilizing the golfer during backswing, downswing, and follow-through. Each golfer has a unique swing resulting in different traction and stability requirements on the foot of the user during the swing. As a result, golfers with different types of swings may be interested in different levels of stability and traction in different locations on the sole of the golf shoe.
In view of the foregoing, it would be advantageous to provide a cleat configured to provide unique athletic performance characteristics not offered by other cleats. In addition, it would be advantageous to provide a cleat that is capable of being configured differently on the shoe for different athletes depending on the athlete's unique motion. It would also be advantageous if the cleat could be manufactured relatively easily and at a reasonable cost.

This patent is subject to a terminal disclaimer.


An active matrix substrate according to one aspect of the present invention is a TFT array substrate including a TFT. The active matrix substrate includes a gate signal line electrically connected to a gate electrode of the TFT, a first insulating film formed above the gate signal line, an auxiliary capacitance electrode formed above the first insulating film and supplied with a common potential, a second insulating film formed above the auxiliary capacitance electrode, a source signal line formed above the second insulating film and electrically connected to a source electrode of the TFT, a third insulating film formed above the source signal line, and a pixel electrode formed above the third insulating film so that the pixel electrode overlaps with a part of the auxiliary capacitance electrode.

1. Field of the Invention
The present invention relates to an active matrix substrate and a method of manufacturing the same.
2. Description of Related Art
An active matrix type display element is known as one of electro-optic display elements such as liquid crystal or organic EL. In the active matrix type display element, a switching element such as TFT is arranged on one principal surface of an insulating substrate, and independent voltage and electric field are applied to each pixel.
In the electro-optic display elements, it is important to realize the active matrix substrate in which a display area of each pixel is as large as possible, or aperture ratio is high, in order to realize clear display with high quality.
Now, a method of manufacturing a TFT array substrate which is an active matrix substrate will be described with reference to FIG. 10. FIG. 10 is a cross sectional view schematically showing the structure of a TFT array substrate 100. First, a conductive film is formed on an insulating substrate 1. Then, the conductive film is patterned by a photolithography process. Thus, a gate electrode 2, a gate signal line, and an auxiliary capacitance electrode 4 are formed on the insulating substrate 1. Next, a first insulating film 3 and a second insulating film 5 are successively formed. Next, a semiconductor active film 6 and an ohmic contact film 7 are successively formed. Then, the semiconductor active film 6 and the ohmic contact film 7 are patterned by the photolithography process.
Next, a metallic thin film is formed. Then, the metallic thin film is patterned by the photolithography process. Thus, a source electrode 9, a source signal line 110, and a drain electrode 10 are formed on the ohmic contact film 7. Then, the ohmic contact film 7 is etched by using the pattern of the drain electrode 10, the source signal line 110, and the source electrode 9 as a mask. Thus, a channel portion 8 is formed. Next, a third insulating film 11 is formed so as to cover them. Then, the third insulating film 11 is patterned by the photolithography process. Thus, a contact hole 12 is formed on the drain electrode 10. After that, the conductive film is formed. Then, the conductive film is patterned by the photolithography process. As such, a pixel electrode 13 that is connected to the drain electrode 10 by the contact hole 12 is formed. The TFT array substrate 100 is thus manufactured.
As stated above, when the active matrix substrate is formed by five photolithography processes, the gate electrode 2, the gate signal line, and the auxiliary capacitance electrode 4 are formed in the same process at the same time. The method of forming them at the same time is disclosed, for example, in Japanese Unexamined Patent Application Publication No. 10-268353. In such a case, the gate electrode 2, the gate signal line, and the auxiliary capacitance electrode 4 are formed by the conductive film of the same material. The gate electrode 2 and the gate signal line are preferably made of low-resistance material so as not to delay the gate signal. Thus, the metallic thin film should be used as the gate electrode 2 and the gate signal line. Thus, the gate electrode 2, the gate signal line, and the auxiliary capacitance electrode 4 are formed of the metallic thin film. As the metallic thin film interrupts light, there is a limit to increase the aperture ratio. Further, in the method described above, the gate electrode 2, the gate signal line, and the auxiliary capacitance electrode 4 are formed in the same layer, which may cause short defect.

Active matrix substrate and method of manufacturing the same


A fluid channeling system includes a fluid ejector, a heat exchanger, and a fluid pump disposed in series flow communication The ejector includes a primary inlet for receiving a primary fluid, and a secondary inlet for receiving a secondary fluid which is mixed with the primary fluid and discharged therefrom as ejector discharge. Heat is removed from the ejector discharge in the heat exchanger, and the heat exchanger discharge is compressed in the fluid pump and channeled to the ejector secondary inlet as the secondary fluid In an exemplary embodiment, the temperature of the primary fluid is greater than the maximum operating temperature of a fluid motor powering the fluid pump using a portion of the ejector discharge, with the secondary fluid being mixed with the primary fluid so that the ejector discharge temperature is equal to about the maximum operating temperature of the fluid motor.

Gas turbine engines and industrial equipment utilize hot fluids, such a air, for various functions. Where the temperature of the fluid is greater than the maximum operating temperature capability of the materials disposed in contact therewith, the fluid temperature is considered excessive or too hot for practical use and a useful lifetime. Accordingly, either the excessive temperatures may not be used, or suitable means must be provided for cooling or protecting the materials from the excessive temperature, or both. For example, fluids are typically channeled through heat exchangers, fluid motors such as turbines, and fluid pumps such as compressors which are disposed in direct contact with the fluid and, therefore, the useful maximum temperature of the fluid cannot exceed the maximum operating temperature of these components without suitable protection thereof from excessive heat.


A computer-implemented method for running an encrypted file and system are provided, where the method includes the following steps: receiving a file running instruction; invoking an encrypted target file according to the file running instruction, and performing memory-based decryption on the encrypted target file according to key information corresponding to the encrypted target file; and running the encrypted target file on which the memory-based decryption is performed.

With the increasing development and widespread application of computers, mobile phones, and other terminal electronic devices, security problems have caught increasing attention, and one kind of security is reflected in security protection on specific files (including software and so on). For the protection on the specific files, a manner currently adopted is described as follows: these files are encrypted through encryption/decryption software and so on; when a file needs to be run or is run, after a password of the encryption/decryption software is input correctly, a user finds a directory where an encrypted file is located; inputs a correct password of the file that needs to be run or is run; decrypts the file; and runs the file after the decryption is completed, or runs a file or software on which memory-based decryption is performed. Based on this manner, when a file on which memory-based decryption is performed needs to be run or is run, it is required to manually input a password of the file that needs to be run, and the file is run after password authentication is correct and the file is decrypted, which severely affects the efficiency of running of the encrypted file.

Method and system for running encrypted files

TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED


The present invention provides a waveform data-processing device. This waveform data-processing device is equipped with a generation component and a sequencing component. The generation component, on the basis of each of a plurality of waveforms which are specified by respective durations and amplitudes, generates a plurality of waveform data sets. Each waveform data set is structured by partial waveform data representing, for each of nodes which are points in the waveform at which amplitude alters, a period until a next node in time and an amplitude change condition. The sequencing component sequences the partial waveform data of the respective nodes for each of the plurality of waveform data sets that have been generated by the generation component. In this waveform data-processing device, the sequencing component sequences partial waveform data of nodes with times which are the same between the waveform data sets to sequence positions which are the same.

1. Field of the Invention
The present invention relates to a waveform data-processing program, a waveform data-processing method, a waveform data-processing device and a droplet ejection device, and more specifically relates to a waveform data-processing program, waveform data-processing method, waveform data-processing device and droplet ejection device in which: a plurality of waveform data sets are generated, each of which is structured by partial waveform data sets representing, for each of nodes which are points in a waveform at which amplitude alters, a period until a next node and an amplitude change condition; and, for each of the plurality of waveform data sets that have been generated, the partial waveform data sets of the respective points are sequenced.
2. Description of the Related Art
Heretofore, an inkjet head has been proposed which includes a pressure generation chamber charged with ink and a piezoelectric actuator. A driving waveform which is structured by a collection of trapezoid waves and/or triangular waves is applied to the piezoelectric actuator of the inkjet head, causing an ink droplet to be ejected by altering volume of the piezoelectric actuator and pressure of the pressure generation chamber.
Further, as a driving waveform generation device for such an inkjet head, a device has been proposed (see Japanese Patent Application Laid-Open (JP-A) No. 2003-237068) which generates a digital driving waveform of digital signals from waveform information which has been read from a storage component, modulates the generated digital driving waveform, demodulates output of the modulation to generate an analog waveform corresponding to an actual driving waveform and, on the basis of output of the demodulation, supplies voltages and currents which are capable of driving the inkjet head. In the device disclosed in JP-A No. 2003-237068, a single digital driving waveform is processed. If this is extended to a plurality of waveforms, then there are simultaneous accesses to the storage component, and delays arise in reading of the digital driving waveforms from the storage component. As a result, delays occur in waveform generation.

Waveform data-processing device and waveform data-processing method


A communication device (16) comprises first and second transceivers and apparatus for determining when the communication device (16) is in an on-site area (11) and when the communication device (16) is in an off-site area. The first transceiver transmits and receives signals on a first communication medium (17), when the communication device (16) is in a first area (11); whereas, second transceiver transmits and receives signals on a second communication medium (28), when the communication device (16) is in a second area.

Generally, local area communication systems, commonly referred to as on-site systems, operate as low power communication systems that facilitate communication within a building or other small geographic area (site). By employing low power transmitters, on-site transceivers enjoy a longer battery life, and may be made physically smaller and lighter than their high power transceiver counterparts. However, on-site systems may be subject to problems such as radio-frequency (RF) channel overcrowding. Thus, the present invention solves this problem by providing a communication system whereby different communication media may be used for communication within and without the on-site environment.


Multiple novel keto-substituted intermediates are provided for the synthesis of epoxymexrenone, useful as an Aldosterone Receptor Antagonist.

This invention relates to the novel processes for the preparation of 9,11-epoxy steroid compounds, especially those of the 20-spiroxane series and their analogs, novel intermediates useful in the preparation of steroid compounds, and processes for the preparation of such novel intermediates. Most particularly, the invention is directed to novel and advantageous methods for the preparation of methyl hydrogen 9,11α-epoxy-17α-hydroxy-3-oxopregn-4-ene-7α,21-dicarboxylate, γ-lactone (eplerenone; epoxymexrenone).
Methods for the preparation of 20-spiroxane series compounds are described in U.S. Pat. No. 4,559,332. The compounds produced in accordance with the process of the '332 patent have an open oxygen containing ring E of the general formula:
in which
—A—A—represents the group —CH2—CH2— or —CH═CH—,
R1 represents an α-oriented lower alkoxycarbonyl or hydroxycarbonyl radical.
—B—B—represents the group —CH2—CH2— or an α- or β-oriented group

R6 and R7 being hydrogen
X represents two hydrogen atoms or oxo,
Y1 and Y2 together represent the oxygen bridge —O—, or
Y1 represents hydroxy, and
Y2 represents hydroxy, lower alkoxy or, if X represents H2, also lower alkanoyloxy,
and salts of such compounds in which X represents oxo and Y2 represents hydroxy, that is to say of corresponding 17β-hydroxy-21-carboxylic acids.
U.S. Pat. No. 4,559,332 describes a number of methods for the preparation of epoxymexrenone and related compounds of Formula IA. The advent of new and expanded clinical uses for epoxymexrenone create a need for improved processes for the manufacture of this and other related steroids.


Provided is alumina material comprising alumina and zirconium, wherein in a radial distribution function obtained by Fourier-transforming an extended X-ray absorption fine structure (EXAFS) spectrum of a K absorption edge of the zirconium in the alumina material, the value of IB/IA is 0.5 or less where IA is a maximum intensity among the intensities of peaks present at 0.1 nm to 0.2 nm, and IB is a maximum intensity among the intensities of peaks present at 0.28 nm to 0.35 nm.

Alumina is excellent in heat resistance, insulation properties, abrasion resistance, corrosion resistance and so on, and is therefore widely used for various applications. Examples of specific applications of alumina include treatment of exhaust gas from internal combustion engines of automobiles, two-wheeled vehicles and the like, and treatment of exhaust gas at a high temperature in gas turbines, boilers and the like, and alumina is widely used as a catalyst support or a noble metal support material. A noble metal supported on the surface of alumina imparts high catalytic activity.
When used for such applications, alumina is exposed to a high temperature of 900° C. to 1000° C., or higher than 1200° C., and therefore may cause reduction of the specific surface area due to sintering. In this case, a noble metal supported on the surface of alumina may be aggregated, or involved in sintering to be caught in the alumina, resulting in deterioration of catalytic activity. Thus, alumina is required to have high heat resistance, and to have a small reduction in specific surface area even when used under a high-temperature condition.
As a study for imparting heat resistance to alumina, for example, Japanese Unexamined Patent Publication No. S62-176542 (Patent Literature 1) describes a method in which from a liquid mixture of an aqueous solution in which powder of alumina or alumina hydrate with a particle size of 500 microns or less is dispersed, and a solution containing a rare earth substance, the rare earth substance is deposited on the alumina or the alumina hydrate.
Japanese Unexamined Patent Publication No. S63-242917 (Patent Literature 2) describes a method in which a mixed solution of an aluminum alkoxide and a lanthanum alkoxide is hydrolyzed to obtain a sol, the sol is then turned into a gel, and the gel is fired.
Japanese Unexamined Patent Publication No. 2005-193179 (Patent Literature 3) discloses secondary particles including primary particles consisting of Al2O3, primary particles consisting of one or two or more metal oxides among ZrO2, SiO2 and TiO2, and a rare earth element and/or a rare earth oxide, wherein the primary particles consisting of Al2O3 and the primary particles consisting of the metal oxides are dispersed with the former primary particles interposed between the latter primary particles and the latter primary particles interposed between the former primary particles. The average particle size of the metal oxides is stated as being several nanometers in the description, and as being 30 nm in Examples.
In addition, WO 2009/112356 (Patent Literature 4) discloses particles including zirconium oxide as a supported oxide on a support having alumina or aluminum oxyhydroxide as a base, with the supported oxide attached to the support after firing the particles at 900° C. for 4 hours. The zirconium oxide has a maximum particle size of 10 nm, and is stated as having a particle size of 4 nm as measured by quasielastic light scattering in Examples.


A chassis air guide thermal cooling solution including a fan to which protruding edges are wedged at wedge grooves of a locating assembly to locate the fan therein, locating notches of a flexible ring are positioned in the locating assembly, an accommodating ring is accommodated around the flexible ring, and the locating assembly is fastened with a locating plate by means of screws; a side panel is devised with ventilation openings for drawing external air or discharging hot air at the interior of the device. The locating assembly is provided with a plurality of flexible openings, and after having fixed the locating plate therein, an assembled position of the chassis air guide thermal cooling solution is adjusted; after having assembled the chassis air guide thermal cooling solution therein, a distance between the accommodating ring and the heat dissipating fan is adjusted using the flexible ring.

(a) Field of the Invention
The invention relates to a chassis air guide thermal cooling solution. More particularly, to a chassis air guide thermal cooling solution characterized that, protruding edges of a fan are wedged at wedge grooves of a locating assembly to locate the fan in the locating assembly, locating notches of a flexible ring are positioned in the locating assembly, an accommodating ring is accommodated around the flexible ring, and the locating assembly is fastened with a locating plate by means of screws; a side panel is devised with ventilation openings for facilitating the fan to draw external air or to discharge hot air in an interior of the device; and the locating assembly is provided with a plurality of flexible openings.
To assemble the chassis air guide thermal cooling solution, after having fixed the locating plate to the interior of the device, an assembled position of the chassis air guide thermal cooling solution is adjusted, and the locating assembly, the locating plate and a power supply are fixed using screws.
After having assembled the chassis air guide thermal cooling solution at the interior, a distance between the accommodating ring and the heat dissipating fan is adjusted using the flexible ring, so as to further favor a user to adjust a length of the flexible ring for coordinating with equipment arrangement at the interior of the device.
(b) Description of the Prior Art
A prior heat dissipating device, such as a heat dissipating device used in a central processing unit of a personal computer, utilizes cooling fins made of materials having high thermal conductance and a fan having high rotational speed. However, the entire heat dissipating device is located in an enclosed space, and hot air is continuously circulated by convection within an interior with reduced heat dissipating effects. Supposed that the interior accommodates numerous devices, heat dissipating effects are further lowered, and hence damages are likely resulted in case that the devices are precision equipments.
Therefore, it is a technical issue of the invention as how to enhance heat dissipating effects of a chassis air guide thermal cooling solution and to reinforce air convection relative to an interior and an exterior of the device.

Chassis air guide thermal cooling solution