A system and method of manufacturing directed to an attachment system for use in an optical device. The attachment system mechanically couples a light source to an illumination lens using an attachment device. The attachment device can be an auto-centering device for reducing positional errors in a light beam emitted from the light source.

A. Field of the Invention
The present invention relates generally to an attachment system for use with optical technology based displacement detection, and more particularly, to an attachment system for use with optical technology in an input device.
B. Description of the Related Art
Optical technology displacement detection is used in many contexts, including in optical input devices. There are many different types of input devices, including a mouse, a trackball, a joystick, and a digital pen. There are significant advantages to using optical input devices over mechanical and opto-mechanical input devices. For example, mechanical or opto-mechanical input devices have mechanical components that are more susceptible to breakdown, wear out, or clogging. Optical devices having only solid-state components are less susceptible to such breakdown, dirt, or wear out.
Optical input devices use a displacement of an image to detect movement of the input device relative to a surface, e.g., a table surface in the case of a mouse or a ball in the case of a trackball. Optical input devices use an illumination lens, an imaging lens, a sensor, and a light source to detect movement of the input device. Typically the light source is a light emitting diode (LED). The LED is usually attached with a conventional clip to a printed circuit board (PCB). The sensor is mounted on the PCB. The sensor is attached to the imaging lens. The conventional clip is not a precise clip. For example, if the PCB becomes warped or bent, the conventional clip will be holding the LED in place, but not in an optimum place. The LED package dimensions have large tolerances. These dimension errors also degrade the alignment of the LED.
Now referring to FIG. 1, there is shown an overview of a prior art attachment system. FIG. 1 shows an optical system 105, an optical illumination lens 115, a light source 100, a conventional clip 120, a PCB 125, and a sensor 130. The conventional clip 120 is attached to the PCB 125. The sensor 130 is mounted on the PCB 125. The sensor 130 is attached to the imaging lens.
A mechanical assembly for attaching the LED (the conventional clip) and its alignment with the illumination lens, imaging lens, and the sensor is critical to efficient performance of the optical device. The LED alignment has a direct impact on the surface illumination and therefore on image quality. Good surface illumination and good image quality is essential to an efficient optical system in an input device. A surface illumination has an illumination spot with a predetermined amount of energy, distributed as evenly as possible, and in alignment with the imaging lens. It also makes the device less sensitive to "difficult" surfaces. A "difficult" surface is one on which the optical device does not detect displacement very well, for example, a dark surface or a glossy surface. There are several reasons the alignment is not always good. One reason is the attachment system.
There are several main problems with conventional attachment systems. One problem with conventional systems is the illumination of the imaged area analyzed by the sensor. This problem results from the fact that the LED is not correctly and precisely positioned with respect to the illumination system. Thus, the illumination spot, the area actually lighted by the illumination system, is shifted relative to the imaged area. One solution conventional systems have employed to overcome this problem is to make the illumination spot much larger than the imaged area. However, this solution is inefficient because it wastes light, which translates to a waste of power.
Also, in conventional systems the LED is mounted on the PCB using a conventional clip. The PCB is coupled to the sensor, which is coupled to the illumination lens. The illumination lens is coupled to the imaging lens. Thus, the coupling between the LED and the illumination lens is dependent on the integrity of the conventional clip, the PCB, and the sensor. The conventional clip is a cylindrical tube, which holds the LED in place. However, due to large play required to accommodate the LED dimension errors, the LED can wiggle or wobble in the cylindrical tube causing positional errors in the light beam.
What is needed is an attachment system for use in an optical system that overcomes the above described problems and limitations of precise positioning of the light source relative to the illumination system.

Attachment system for use in an optical illumination system


Example apparatus and methods monitor conditions in a tiered storage system. The conditions monitored may include the availability of different numbers and types of devices including an erasure code based object storage system. The conditions monitored may also include the availability and type of devices available to the erasure code based object storage system. A redundancy policy for storing an item using the erasure code based object storage system may be determined based on the conditions. Erasure codes associated with the item may then be stored in the erasure code based object storage system as controlled, at least in part, by the redundancy policy. The redundancy policy for the erasure codes may be updated dynamically in response to changing conditions on the tiered storage system.

Different approaches, devices, and collections of devices may be used to protect files, information about files, or other electronic data. For example, a tiered archive system may use tape drives, disk drives, solid state drives (SSD), and an object store to store a file, to store information about a file, to store redundant copies of files, or to store other electronic data.
To insure data protection, different approaches for storing redundant copies of items have been employed. Erasure codes are one such approach. An erasure code is a forward error correction (FEC) code for the binary erasure channel. The FEC facilitates transforming a message of k symbols into a longer message with n symbols such that the original message can be recovered from a subset of the n symbols, k and n being integers, n>k. The original message may be, for example, a file. The fraction r=k/n is called the code rate, and the fraction k′/k, where k′ denotes the number of symbols required for recovery, is called the reception efficiency. Optimal erasure codes have the property that any k out of the n code word symbols are sufficient to recover the original message. Optimal codes may require extensive memory usage, CPU time, or other resources when n is large.
Erasure codes are described in coding theory. Coding theory is the study of the properties of codes and their fitness for a certain purpose (e.g., backing up files). Codes may be used for applications including, for example, data compression, cryptography, error-correction, and network coding. Coding theory involves data compression, which may also be referred to as source coding, and error correction, which may also be referred to as channel coding. Fountain codes are one type of erasure code.
Fountain codes have the property that a potentially limitless sequence of encoding symbols may be generated from a given set of source symbols in a manner that supports ideally recovering the original source symbols from any subset of the encoding symbols having a size equal to or larger than the number of source symbols. A fountain code may be optimal if the original k source symbols can be recovered from any k encoding symbols, k being an integer. Fountain codes may have efficient encoding and decoding algorithms that support recovering the original k source symbols from any k′ of the encoding symbols with high probability, where k′ is just slightly larger than k. A rateless erasure code is distinguished from an erasure code that exhibits a fixed code rate.
Object based storage systems may employ rateless erasure code technology (e.g., fountain codes) to provide a flexible level of data redundancy. The appropriate or even optimal level of data redundancy produced using a rateless erasure code system may depend, for example, on the number and type of devices available to the object based storage system. The actual level of redundancy achieved using a rateless erasure code system may depend, for example, on the difference between the number of readable redundancy blocks (e.g., erasure codes) written by the system and the number of redundancy blocks needed to reconstruct the original data. For example, if twenty redundancy blocks are written and only eleven redundancy blocks are needed to reconstruct the original data that was protected by generating and writing the redundancy blocks, then the original data may be reconstructed even if nine of the redundancy blocks are damaged or otherwise unavailable.
Object based storage systems using rateless erasure code technology may facilitate storing erasure codes generated according to different redundancy policies (e.g., 7/3, 20/9, 20/2). A redundancy policy may be referred to as an N/M redundancy policy where N total erasure codes are generated and the message can be regenerated using any N−M of the N total erasure codes, M and N being integers, M<N.
When an object storage is used in a tiered archive system, the overall data redundancy achieved by the tiered archive system depends on the distribution of data between devices and the redundancy policies associated with the object store. The distribution of data refers to the number and types of devices participating in storing data. The redundancy policies may include an N/M policy. For example, if the tiered archive system includes a RAID-6 tier at one site, and if data is present in the RAID-6 tier, then an optimal overall data redundancy might be provided by implementing a 20/2 erasure code policy at an object storage at a single other site. If the RAID-6 tier is released or becomes otherwise unavailable, then the optimal overall data redundancy may be provided by an 18/8 erasure code policy spread across three sites. The "optimal" overall data redundancy may be defined by, for example, a system administrator or data retention expert.
Since conditions in a tiered archive system can vary dynamically as, for example, devices become available or unavailable, the optimal overall data redundancy may also vary dynamically. However, conventional tiered archive systems may use pre-defined configuration settings to statically determine erasure code policies.

Dynamically configuring erasure code redundancy and distribution


A system comprises a first detector for detecting whether a multi-occupancy space is occupied by at least one individual and a plurality of second detectors for detecting whether an individual is present in each of a respective plurality of spaces within the multi-occupancy space. A controller is configured to monitor whether an individual is present in the multi-occupancy space based on a signal derived from the first detector. If the presence of at least one individual is detected based on the signal derived from the first detector, the controller determines occupancy of the multi-occupancy space based on signals derived from the plurality of second detectors.

Detection and knowledge of occupancy levels in office spaces is the first step in improving overall utilisation of real estate assets. With real estate costs sky rocketing in cities like London, this activity has become of ongoing relevance. Further with the growth of knowledge workers in the economy, the importance of collaborative working has increased. This in turn has resulted in the creation of more contiguous spaces for group interaction such as meeting rooms of various sizes, collaboration spaces, conference facilities, social spaces etc. in the average office. With these two trends, it has become relevant to understand the dynamics of the usage of contiguous or semi-contiguous collaborative spaces.

Determining occupancy of a multi-occupancy space


A method is provided for distributing data content in a P2P live streaming network comprising a plurality of peers and a streaming source periodically producing segments representing the data content to be distributed, wherein a group of the peers are assigned to download the data content from the streaming source and to distribute the data content to remaining peers. The method comprises a first peer making requests for a current segment produced by the streaming source, the requests being made at a rate higher than a rate with which the segments are produced by the streaming source. If the first peer is the first to download the current segment, then the current segment has been downloaded, wherein the network peers can download the current segment from the first peer. Otherwise, a second peer downloads the current segment and it announces this to the group on the P2P network.

In recent years, Hypertext Transfer Protocols (HTTP) for streaming have become the de-facto standard for distribution of live and video-on-demand content over the Internet.
Peer-to-Peer live streaming (PLS) enables improving distribution efficiency for a given online live broadcast by having viewers of content contribute with their resources, namely bandwidth, to other viewers. Previous work in this area has proposed systems such as PPlive, CoolStreaming, T-bone, and more recently Bittorrent live. Peer-to-Peer (P2P) overlay construction for such applications falls mainly into two classes: tree-based and mesh-based systems. Although a consensus has not been reached on the best approach, mesh-based approaches have lately become more popular as they are more robust to peer churn, while tree-based overlays are more cumbersome to maintain in the same condition.
There is a recent trend of using HTTP-live streaming instead of the traditional Real Time Streaming Protocol/Real-time Transport Protocol (RTSP/RTP) for broadcast of live video content over the Internet. HTTP-live streaming consists of a set of protocols which all utilize the HTTP for transport. HTTP-live streaming changes the way a producer of the content (i.e. the streaming server) and a consumer of the content (i.e. the media player) interact.
Traditional streaming protocols such as the RTSP/RTP are based on a push-based model, where the player requests a certain stream and then the server pushes content over User Datagram Protocol (UDP) to the player controlling the speed of the delivery. HTTP-live streaming protocols are instead based on a pull-model, where it is the player that requests pieces of content over HTTP at the pace it deems suitable. On top of that, the HTTP-live protocols have been designed to support adaptive bitrate mode of operation, which avails the stream in a number of qualities. The choice of which quality to retrieve/reproduce is left to the player.
All major actors in the online broadcasting business have developed technologies which embrace HTTP-streaming and the concept of adaptive bitrate switching as a main approach for broadcasting. HTTP live has been adopted by content services and creators with support across all platforms and operating systems, including computers, tablets and smart phones. The shift from the push-based RTSP/RTP protocol to the pull-based HTTP-live protocols has rendered many of the established assumptions made in the current state-of-the art PLS obsolete. For all practical purposes, any new PLS algorithm, irrespective of its theoretical soundness, will not be deployable if it does not take into account the realities of the mainstream broadcasting ecosystem around it. Currently, both the Content Delivery Networks (CDNs) and the live streaming solution vendors are focusing on HTTP-based solutions.


A print array head and a fabrication method thereof. The print array head includes a positioning means for aligning coordinates of a nozzle plate of a page width size with coordinates of a heater chip. The positioning means includes a pair of aligning holes formed on opposite sides of a nozzle section of the nozzle plate, and a pair of aligning marks formed on of a recess of the heater chip. Since the nozzle plate and the heater chip are aligned with each other through observation of the aligning marks through the aligning holes, possible error between a desired an and actual attaching location of the heater chip with respect to the nozzle plate is minimized, and accordingly, printing quality and productivity are increased, while the fabricating costs are decreased.

This application claims the benefit of Korean Application No. 2000-63807, filed Oct. 28, 2000, in the Korean Industrial Property Office, the disclosure of which is incorporated herein by reference.
1. Field of the Invention
The present invention relates to an inkjet print head and a fabrication method thereof, and more particularly to an array type inkjet print head in which a plurality of nozzle sections on a nozzle plate of a page width size are aligned with a plurality of heater chips, and a fabrication method thereof.
2. Description of the Related Art
Generally, an inkjet print head prints a desired image on a printing medium by instantly heating a plurality of heater chips, thus explosively vaporizing a certain amount of ink charged in ink chambers to cause ink bubbles. That is, by the expansion pressure of the ink bubbles, ink droplets are ejected out through nozzle holes to form a desired image.
As the demand for high resolution printing quality and high speed printing has increased recently, many efforts are made to develop a so-called page width array head that could print image information with a page unit by aligning the plurality of heater chips in a printing width size. Such an inkjet print array head is aimed at simplifying the design and improving the printing speed, and reference can be made to U.S. Pat. Nos. 5,469,199 and 4,851,371 for a detailed example thereof.
In the above-mentioned inkjet print array head, nozzle sections and the heater chips must be attached to each other in a highly accurate alignment. For example, in a printer having a resolution of 600 dpi (dots per inch), misalignment between the nozzle sections and the heater chips of the general inkjet print head is allowable within xc2x125 xcexcm, while the misalignment in the page width array head is allowable approximately within only xc2x112 xcexcm. However, due to alignment error generated during alignment of the heater chips in the general inkjet print array head, misalignment occurs in the alignment of the nozzle sections and the heater chips, and accordingly, the accuracy of the alignment is limited.
In order to secure high accuracy in the alignment of the nozzle sections and the heater chips during the fabrication process, expensive equipment such as a vision system is required, in addition to labor and other costs. Accordingly, productivity deteriorates while the fabrication costs increase. Also, due to the effect of heat during the operation of the general inkjet print array head, there is a high possibility that the alignment of the heater chips may vary, or distortion may occur due to a crack in the processing section.
Furthermore, the general inkjet print array head usually has a nozzle plate made of a polymer sheet or a metal sheet. Since the metal sheet is processed through an electro-forming process to form the nozzle holes, reproductibility deteriorates, and high accuracy is not guaranteed. Also, a distortion occurs due to a residual stress.
Accordingly, it is an object of the present invention to provide an inkjet print array head and a fabrication method thereof to improve productivity and printing quality by ensuring and maintaining an alignment accuracy between the nozzle sections and the heater chips.
Additional objects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
The above and other objects are accomplished by a print array head in accordance with the present invention, including a nozzle plate of a predetermined size having a plurality of nozzle sections formed thereon in a predetermined pattern, each nozzle section comprising a plurality of nozzle holes, a plurality of heater chips aligned with the plurality of nozzle sections and attached to the nozzle plate, an ink supplying channel interconnected to each nozzle section, and a printer bar connected to the nozzle plate, facing the nozzle plate. The present print array head further includes a positioning means for aligning the plurality of heater chips with the plurality of nozzle sections.
According to the present invention, the positioning means includes an aligning hole formed at a predetermined location around each nozzle section, and an aligning mark formed at a predetermined location on each of the heater chips, coordinates of the aligning marks being aligned with coordinates of the aligning holes.
The above and other objects are also accomplished by a method to fabricate a print array head in accordance with the present invention, including forming a plurality of nozzle sections on a nozzle plate in a predetermined pattern, each nozzle section comprising a plurality of holes, forming an aligning hole at a predetermined location around each nozzle section, forming an aligning mark at a predetermined position on each of a plurality of heater chips, forming a pad-type recess on the printer bar, attaching each heater chip to the pad-type recess, and connecting the nozzle plate with the plurality of heater chips with reference to the aligning holes and the aligning marks.
According to one aspect of the present invention, the forming of the plurality of nozzle sections includes applying a photo-resist on both sides of the nozzle plate, exposing the photo-resist to a light in a predetermined pattern by using a mask, and forming a nozzle hole by etching the nozzle plate through a portion of the photo-resist that is exposed to the light and removed.

Print array head and fabrication method thereof


An electronic component unit such as a speaker unit which is to be installed in the main body of a notebook-sized PC, includes an integral connector with compression type terminals that are connected with lead wires to a speaker. When the speaker unit is disposed on a speaker-unit mounting portion, the compression type terminals are disposed at a position where they contact with the lands of a system board. The speaker unit is fixed by inserting screws into the support portions of a housing, and at the same time, the compression type terminals are elastically contacted with the lands and electrically connected thereto.

The present invention relates to an electrical connection structure for an electronic component unit that is applied to computers and electronic equipment, and more particularly to an electrical connection structure for electrically connecting a terminal portion of a Compression type connector, equipped in an electronic component unit, to an electrode portion on a circuit board mounted on electronic equipment when installing the electronic component unit in the electronic equipment.
In general, electronic equipment employs a connector to electrically interconnect a circuit board, an electronic component, an electronic device, etc. When assembling such electronic equipment, the connector is frequently connected by manual operation.
FIG. 10 illustrates a conventional notebook-sized personal computer (hereinafter referred to as a notebook-sized PC) in which a speaker unit is mounted on a PC main body portion and connected to a system board (main board).
In FIG. 10 is shown the rear of the speaker unit 100 including speakers 104 disposed at the laterally opposite positions on a front face (side facing in direction of arrow FR in the drawing) of a frame 102 constituting the speaker unit 100, respectively. The lead wires (harnesses) 108 connected to the speakers 104 through the interior of the frame 102 protrude from the lower portion of a mounting portion 106 provided on the rear of the frame 102, and a plug-in type connector 110 is connected to the ends of the lead wires 108.
A support block 114 for mounting the speaker unit 100 is provided on the bottom surface of a housing 112 constituting the lower portion of the housing of the PC main body portion. Furthermore, the system board 116 is installed within the housing 112, and a connector 118 (plug-in type) which is paired with the connector 110 on the side of the speaker unit 100 is mounted on the system board 116.
When mounting this speaker unit 100 on the notebook-sized PC, the speaker unit 100 is first fixed on the support block 114 of the housing 112 by means of screws 120. Then, the connector 110 is plugged into the connector 118 on the system board 116 thereby effecting mechanical and electrical connection.
In the notebook-sized PC market, pricing has become ever more competitive in recent years. Because of this, it is an important consideration to reduce manufacturing costs by simplifying operation to reduce the number of assemblers. Therefore, in the aforementioned operation of installing an electronic component unit, reconsideration of the assembly efficiency has also been required. Particularly, there has been a desire to move away from the manual operation of connecting the connector, which is complicated and tends to cause connection failure such as half-locking.
On the other hand, a wide variety of connectors suitable for various uses, in addition to a general plug-in type, have been developed and put to practical use. As an example, spring connectors are known, the assembly structure being disclosed in Japanese Published Unexamined Patent Application Nos. 5-13115 and 5-13116.
The spring connectors are employed when constituting a high-voltage circuit. The spring connectors include a fixed resistor and are also equipped with a terminal portion consisting of a coil spring. The spring terminal portion is pressed against the contact portion of a corresponding component, whereby an electrical connection is established.
In the above-mentioned prior art, a connecting fitting, connected with a fixed resistor fitted into a coil spring and lead wires, is inserted and mounted within the housing of the connector, and furthermore, the coil spring, the lead terminals of the fixed resistor, and the connecting fitting are not firmly connected by soldering or the like, but they are connected by press fitting and elastic gripping means so that they can be electrically conductive. Also, in order to easily enhance product yield and productivity, a structure has been proposed in which the assembly can be automated. To electrically interconnect circuit boards, another technique for mounting a spring connector on one of the circuit boards and connecting it with the electrode portion of the other circuit board is disclosed in Japanese Published Unexamined Patent Application Nos. 11-339920 , 2000-021468 , 2000-012124 , 10-261858.
This conventional spring connector is a type in which the spring terminal portion is elastically contacted with the contact portion of the corresponding component, but since the connector is singly employed, a structure for fixing the connector housing to a corresponding component, and the installing operation of the structure, are required. Therefore, although the terminal portion is a spring type, the manner in which the spring connector is used is essentially the same as the aforementioned plug-in type connector.
In view of the aforementioned facts, it is an object of the present invention to provide an electrical connection structure for an electronic component unit that is capable of facilitating an assembly operation in installing the electronic component unit. Another object of the invention is to provide an electrical connection structure for an electronic component unit which is capable of preventing connection failure and reducing manufacturing costs. Still another object of the invention is to provide a computer and electronic equipment to which the electrical connection structure is applied.
To achieve the above objects, according to an aspect of the present invention there is provided an electrical connection structure for electrically connecting an electronic component unit, which is to be installed in an electronic apparatus, to a circuit board mounted on the electronic apparatus, the structure comprising: an electrode portion provided on the circuit board; and a connector, which is mounted on the electronic component unit and equipped with compression type terminals, the terminals being connected to lead wires of an electronic component included in the electronic component unit, and being contacted with the electrode portion, compressed, and electrically connected thereto when the electronic component unit is mounted on the circuit board.
In the aforementioned electrical connection structure for an electronic component unit, a connector with compression type terminals is mounted integrally on an electronic component unit, and the compression type terminals of the connector are connected with the lead wires of an electronic component equipped in the electronic component unit.
With such a connector, when the electronic component unit is assembled to the circuit board, the compression type terminals of the connector are contacted with the electrode portion of the circuit board and are compressed and electrically connected. Thus, the assembly operation in installing an electronic component unit in electronic equipment is made easy. In addition, connection failure, such as half-locking, etc., is prevented because there is no manual connection of the connector. Furthermore, the number of assemblers is reduced and the manufacturing costs are reduced.
In addition, as the electronic component unit and the connector can be connected by lead wires, the connecting operation is easy, there is no need to prepare a circuit board for connecting the connector, and there are various freedoms in operation.
The electronic component unit used herein includes a unit in which an electronic component or device, such as a speaker, a microphone, an LCD display, etc., is equipped with a connector. The electronic component (portion which functions electrically), such as a speaker, etc., and the connector are connected by lead wires or cables.
In the aforementioned electrical connection structure for an electronic component unit, the connector may be provided with a first engaging portion, and the electronic component unit may be provided with a first engaged portion which is engaged by the first engaging portion.
When the connector is mounted on the electronic component unit, the first engaging portion engages the first engaged portion so that the connector is held by the electronic component unit. Therefore, the mounting operation can be easily performed without employing a fixing means such as screws, an adhesive, etc.
The aforementioned electrical connection structure for an electronic component unit may further include a fixing means, disposed near the connector, for fixing the electronic component unit to the circuit board.
For example, if fixing means such as hooks, screws etc., is disposed near the connector, the electrical connection between the compression type terminals and the electrode portion becomes firm when the electronic component unit is fixed to the circuit board. Therefore, even if the compressing force of the compression type terminals varies, or the circuit board warps, the compression type terminals reliably contact with the electrode portion, whereby connection failure, etc., can be avoided. In addition, resistance to vibration is enhanced by this disposition and therefore a satisfactory connection state is maintained.
In the aforementioned compression type terminal, a contact portion, which contacts with the electrode portion and is compressed by elastic deformation and electrically connectable, is provided on one end of a main body portion formed from an electrically conductive metal, and a connecting portion to which the lead wires are connected is provided on the other end. These portions are formed integrally with each other. Furthermore, the main body portion may be equipped with a second engaging portion which engages a second engaged portion provided in the housing of the connector.
If the compression type terminal is constructed so that the contact portion, which contacts with the electrode portion, and the connecting portion, which connects the lead wires, are connected integrally to the main body portion, the assembling of the terminal to the connector becomes easy. In addition, the second engaging portion engages the second engaged with portion provided in the housing of the connector, whereby the terminal is fixed. Therefore, the terminal is easily assembled without providing additional fixing means.
The aforementioned electrical connection structure for an electronic component unit may further have: a support portion for supporting the electronic component unit at the electrically connectable position; a third engaged portion for preventing movement of the electronic component unit in one direction on a plane approximately perpendicular to the mounting direction when engaged by a third engaging portion provided in the electronic component unit; and a fourth engaged portion for preventing movement of the electronic component unit in a direction perpendicular to the one direction on the plane when engaged by a fourth engaging portion provided in the electronic component unit, when the electronic component unit is disposed in a position where the compression type terminal is electrically connectable with the electrode portion,
If the electronic component unit is disposed in a position where the compression type terminal is electrically connectable with the electrode portion, the unit is supported by the support portion at the connectable position. At the same time, the third engaging portion provided in the electronic component unit engages the third engaged portion, whereby movement of the electronic component unit in one direction on a plane approximately perpendicular to the mounting direction of the electronic component unit is prevented. Also, the fourth engaging portion provided in the electronic component unit engages the fourth engaged portion, whereby movement of the electronic component unit in a direction perpendicular to the one direction on the plane is prevented.
With this, if the electronic component unit is disposed at a predetermined position where it is electrically connected with the circuit board, the compression type terminal is aligned with the electrode portion. Therefore, if only the electronic component unit is disposed at the predetermined position, it can be fixed as it is with screws or the like, without positioning the unit with respect to the circuit board, or holding the unit by hands. Thus, assembling of the electronic component unit becomes simple.
The present invention is also applicable to a computer or electronic apparatus equipped with the aforementioned electrical connection structure for an electronic component unit.
A preferred embodiment of the invention will now be described, by way of example only, with reference to the accompanying drawings.

Electrical connection structure for electronic apparatus

International Business Machines Corporation


A method and apparatus for a highpass filter structure using transmission line construction which has multiple output tabs for selection of corner frequencies utilizing a plurality of resonators coupled to the transmission line. The transmission line has a characteristic impedance which increases exponentially with respect to a distance from the input.

Passive lowpass, highpass, bandpass, and bandreject filters, including radio frequency (RF) filters, are commonly used in electronic equipment. Communications equipment in particular relies on the extensive use of passive filtering to aid in the extraction of a desired signal from noise and interference, to ensure spectral purity of transmitted signals, and other uses.
Multiband designs may use large numbers of switchable passive filters to make recovery of the desired signal feasible, economical, or to provide enhanced performance. Some switchable passive filters use varactors as the main tuning component, and several types of active filters have been suggested (i.e., gmC and logarithmic) but they all suffer from dynamic range and current drain limitations when compared to passive filter counterparts.
Filter hardware suitable for a Software Defined Radio (SDR) in general needs to be frequency agile. In order to be most useful, the hardware filters typically must be able to cover a wide bandwidth and be capable of providing various bandwidths at a particular operating frequency within a given frequency range of interest. Common radio applications require both wideband and narrowband filters, and the filter frequency of operation which is required depends on the radio design and the point of use of the filter within the radio.
SDR applications also require that properties of hardware bandpass and bandstop filters, such as center frequency and bandwidth, be controllable by software/digital means. Similarly, where highpass filtering is employed it is desirable that the highpass filtering have a selectable corner frequency under software control. Prior art flexible lowpass RF filters are incapable of meeting this flexible highpass RF filtering requirement.
No truly satisfactory solution to this requirement exists in the prior art. What is needed is a method and apparatus for creating a filter that has flexibility in corner frequency selection, and maintains the low current drain and high dynamic range performance of passive filters.
Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of embodiments of the present invention.

Method and apparatus for a communications filter


A P-type metal oxide semiconductor (PMOS) device can include an N-well that does not extend completely throughout the active region of the PMOS device. For example, the PMOS device can be fabricated using a masking step to provide an N-well having an inner perimeter and an outer perimeter. The inner perimeter of the N-well surrounds at least a portion of the active region of the PMOS device. According to an embodiment, the inner perimeter of the N-well surrounds the entire active region. The PMOS device can include a deep N-well in contact with the N-well.

1. Field of the Invention
The present invention generally relates to semiconductors, and more specifically to PMOS technology.
2. Background
A semiconductor device is generally fabricated by performing operations on a semiconductor substrate to provide certain electrical characteristics. These operations can include deposition, diffusion, etching, ion implantation, lithography, and oxidation, to provide some examples.
The semiconductor substrate is typically formed of silicon (Si) and can be either N-type or P-type. An N-type substrate is generally doped with phosphorus atoms (e.g., phosphorus atoms are implanted into, or otherwise added to, the substrate) to provide excess electrons that can be mobilized by applying a voltage to the substrate. A P-type substrate is generally doped with boron atoms to provide excess holes that can be mobilized. Excess electrons or holes are commonly referred to as excess carriers.
A P-type metal oxide semiconductor field effect transistor (PMOSFET), for example, can be fabricated by implanting phosphorus atoms into a P-type substrate to create an N-well. P+ regions are formed in the N-well to provide source and drain regions. The "+" indicates that the region is doped with a higher carrier concentration than a region not designated by a "+". For instance, the P+ regions typically have a greater number of excess holes than the P-type substrate. An N+ region generally has a greater number of excess electrons than an N-type region.
A gate is located (typically on an oxide layer, called a "gate oxide") between the source and the drain to control the on/off state of the PMOSFET. The PMOSFET is generally turned on when the voltage applied to the gate goes below a threshold. The threshold voltage of a conventional PMOSFET is negative, and the magnitude of this negative threshold voltage is too great for the PMOSFET to be used in some applications.
What is needed is a low threshold voltage PMOS apparatus and method that addresses one or more of the aforementioned shortcomings of conventional PMOSFET devices and methods.

This patent is subject to a terminal disclaimer.

Low threshold voltage PMOS apparatus and method of fabricating the same


A video communication method includes: acquiring a plurality of 2D images corresponding to a talker using a 3D camera; adjusting a point of convergence of the plurality of 2D images using a feature point of the talker; detecting an object located between the talker and the 3D camera using the acquired plurality of 2D images; scaling an original sense of depth of the detected object to a new sense of depth; and generating a 3D talker image including the object with the new sense of depth and transmitting the 3D talker image to a 3D video communication apparatus of a listener.

1. Field
Apparatuses and methods consistent with exemplary embodiments relate to three dimensional (3D) video communication apparatus and method for video processing thereof.
2. Description of the Related Art
A video communication apparatus enables video communication between a talker and a listener using a camera, a microphone or a speaker.
For example, a video communication apparatus with one camera can provide two dimensional (2D) video communication between a talker and a listener. A video communication apparatus using a plurality of cameras can provide 3D video communication using a plurality of videos, for example, left-side videos and right-side videos.
A video communication apparatus generates the sense of depth of a 3D video using captured left-side video and right-side video. The implementation of the 3D video can generally be categorized into glasses type and non-glasses type.
The glasses type generally includes passive type, active type and anaglyph type. The non-glasses type generally includes lenticular type and parallax barrier type.

3D video communication apparatus and method for video processing of 3D video communication apparatus


Non-volatile memory devices and arrays are described that utilize back-side trapped floating node memory cells with band-gap engineered gate stacks with asymmetric tunnel barriers. Embodiments of the present invention allow for direct tunneling programming and efficient erase with electrons and holes, while maintaining high charge blocking barriers and deep carrier trapping sites for good charge retention and reduces the possibility of damage to the channel/insulator interface. The direct tunneling program and efficient erase capability reduces damage to the gate stack and the crystal lattice from high energy carriers, reducing write fatigue and leakage issues and enhancing device lifespan. Memory device embodiments of the present invention are presented that are arranged in NOR or NAND memory architecture arrays. Memory cell embodiments of the present invention also allow multiple levels of bit storage in a single memory cell, and allow for programming and erase with reduced voltages.

Memory devices are typically provided as internal storage areas in the computer. The term memory identifies data storage that comes in the form of integrated circuit chips. There are several different types of memory used in modem electronics, one common type is RAM (random-access memory). RAM is characteristically found in use as main memory in a computer environment. RAM functions as a read and write memory; that is, you can both write data into RAM and read data from RAM. This is in contrast to read-only memory (ROM), which permits you only to read data. Most RAM is volatile, which means that it requires a steady flow of electricity to maintain its contents. As soon as the power is turned off, whatever data was in RAM is lost.
Computers almost always contain a small amount of ROM that holds instructions for starting up the computer. Unlike RAM, ROM cannot be written to. An EEPROM (electrically erasable programmable read-only memory) is a special type non-volatile ROM that can be erased by exposing it to an electrical charge. EEPROM comprise a memory array which includes a large number of memory cells having electrically isolated gates. Data is stored in the memory cells in the form of charge on the floating gates or floating nodes associated with the gates. Each of the cells within an EEPROM memory array can be electrically programmed in a random basis by charging the floating node. The charge can also be randomly removed from the floating node by an erase operation. Charge is transported to or removed from the individual floating nodes by specialized programming and erase operations, respectively.
Yet another type of non-volatile memory is a Flash memory. A Flash memory is a type of EEPROM that is typically erased and reprogrammed in blocks instead of a single bit or one byte (8 or 9 bits) at a time. A typical Flash memory comprises a memory array, which includes a large number of memory cells. Each of the memory cells includes a floating gate field-effect transistor (FET) capable of holding a charge. The data in a cell is determined by the presence or absence of the charge in the floating gate/charge trapping layer. The cells are usually grouped into sections called "erase blocks." Each of the cells within an erase block can be electrically programmed in a random basis by charging the floating gate. The charge can be removed from the floating gate by a block erase operation, wherein all floating gate memory cells in the erase block are erased in a single operation.
The memory cells of both an EEPROM memory array and a Flash memory array are typically arranged into either a "NOR" architecture (each cell directly coupled to a bit line) or a "NAND" architecture (cells coupled into "strings" of cells, such that each cell is coupled indirectly to a bit line and requires activating the other cells of the string for access).
Floating gate memory cells are typically programmed by injecting electrons to the floating gate by channel hot carrier injection (CHE), typically placing the cell in a high threshold voltage state. Floating gate memory cells can also be erased by hot hole injection from the substrate. Alternatively, floating gate memory cells can be programmed and erased by electron tunneling to and from the substrate by Fowler-Nordheim tunneling to put the cell in a programmed or erased threshold state. Both mechanisms require the generation of high positive and negative voltages in the memory device and can place high fields across the gate insulation layers with resulting adverse effects in device characteristics and reliability.
A problem with CHE, hot hole injection and Fowler-Nordheim tunneling is that the high energy required for their operation damages the oxide interfacing silicon substrate, reducing memory cell retention, endurance, and degrading transconductance of the FET. In particular, the tunnel insulation layer, which is placed between the channel and the floating node/charge trapping layer is typically damaged by the programming process by having hot carriers injected or tunneled through it. As high control fields are also typically asserted on the channel during writing and erasing through the tunnel insulation layer by the application of voltage to the control gate of the memory cell, damage to the tunnel insulator by the hot carrier injection or high fluence tunneling process can significantly affect device characteristics. Hot carrier injection can generate interface states, degrade device transconductance, and enhance device leakage via enhanced short channel effect, besides affecting charge retention and read-disturb. Hot hole injection can generate fixed charge trapping centers in the tunneling insulators and associated defects in the trapping layer, thus breaking stable bonds and eventually degrading the insulator/dielectric properties of the device. For a conventional Flash or SONOS non-volatile memory device, the same control gate is also used during a read operation as a FET to read the state of the memory cell. When the tunnel insulator (also known as the tunnel oxide) is degraded, the read characteristics of the memory cell are also degraded due to the transconductance degradation and enhanced leakage. This affects the read speed of the memory cell.
An additional problem in Flash and SONOS memory cell arrays is that voltage scalability affects the minimum cell size, and consequently the overall memory density of any resulting array. As integrated circuit processing techniques improve, manufacturers try to reduce the feature sizes of the devices produced and thus increase the density of the IC circuits and memory arrays. In modem IC circuits and memory arrays, as SONOS transistors and floating gate memory cells are scaled to smaller feature sizes, the device characteristics of the component transistors and floating gate memory cells can alter and leave the resulting IC or memory device non-functional. These issues include, but are not limited to, short channel effect, signal cross-talk, device programming and operating voltages, reduced logic windows, oxide punch-through, and charge leakage and retention.
For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for methods and apparatus for a non-volatile memory cell that allows for feature and voltage scaling, prevents read degradation while providing enhanced retention, speed, endurance, and exhibits increased device integrity.

Back-side trapped non-volatile memory device


Components for HVAC systems used in hybrid and fuel cell vehicles are mounted in modular configuration on a frame with air conditioning components connected to one another by metal pipes welded to the components. An alternating current motor, integral with a compressor, is driven by 310 volt alternating current from an inverter, which inverter converts 310 volt direct current that is used to power the vehicle. PTC heaters in fluid communication with an evaporator employed by the air condition system are directly energized by the 310 volt direct current. The modular system is mounted directly on the chassis of the vehicle, facilitative assembly of the vehicle, and is readily removable as a unit from the chassis for repair or replacement.

Hybrid vehicles that rely on both internal combustion engines and direct current motors for power, and fuel cell vehicles that rely on electric motors driven by current from fuel cells, both have passenger compartments that are ventilated, heated and air conditioned, and have windshield glass that is defrosted. Automotive vehicles powered by internal combustion engines generate heat by combustion that is used to heat passenger compartments and defrost windshields, and use mechanical power transmitted from the engine by belts to compressors that drive air conditioning systems. Hybrid vehicles normally use only electric motors when cruising, but rely on internal combustion engines for acceleration, heat and air conditioning. It is desirable with hybrid vehicles to minimize operation of internal combustion engines. Fuel cell vehicles have no internal combustion engines, consequently air conditioning and heating can only be provided by electric current. In view of these considerations there is a need for heating, ventilating and air conditioning (HVAC) systems for hybrid and fuel cell vehicles, which operate at high efficiency and consume minimal space.

Modular electric HVAC systems for vehicles


The present invention provides viral vectors that have been engineered to contain a synthetic promoter that controls at least one essential gene. The synthetic promoter is induced by a specific gene product not normally produced in the cells in which the viral vector is to be transferred. The vectors are propagated in producer or helper cells that express the inducing factor, thereby permitting the virus to replicate to high titer. The lack of the inducing factor in the target cells precludes viral replication, however, meaning that no vector toxicity or immunogenicity arises. Where the virus carries a gene of interest, this should provide for higher level expression for longer periods of time than with current vectors. Methods for making the vectors, helper cells, and their use in protein production, vaccines and gene therapy are disclosed.

1. Field of the Invention
The present invention relates generally to the field of viral vectors, packaging cell lines, and the use of such viral vectors to express foreign DNA in mammalian cells. The invention also relates to the field of gene therapy, and more specifically to the use of viral vectors to transport genetic material into cells in vivo for therapeutic purposes. More particularly, it concerns viral promoter replacement in order to reduce the expression levels of viral genes in host cells.
2. Description of the Related Art
Gene therapy is an area that offers an attractive approach for the treatment of many diseases and disorders. Many diseases are the result of genetic abnormalities such as gene mutations or deletions, and thus the prospect of replacing a damaged or missing gene with a fully functional gene is provocative. Throughout the last decade, studies of oncogenes and tumor suppressor genes have revealed increasing amounts of evidence that cancer is a disease caused by multiple genetic changes (Chiao et al., 1990; Levine, 1990; Weinberg, 1991; Sugimara et al., 1992). Based on this concept of carcinogenesis, new strategies of therapy have evolved rapidly as alternatives to conventional therapies such as chemo- and radiotherapy (Renan, 1990; Lotze et al., 1992; Pardoll, 1992). One of these strategies is gene therapy, in which tumor suppressor genes, antisense oligonucleotides, and other related genes are used to suppress the growth of malignant cells.
Gene therapy has also been contemplated for transfer of other therapeutically important genes into cells to correct genetic defects. Such genetic defects include deficiencies of adenosine deaminase that result in severe combined immunodeficiency, human blood clotting factor IX in hemophilia B, the dystrophin gene in Duchenne muscular dystrophy, and the cystic fibrosis transmembrane receptor in cystic fibrosis. Gene transfer in these situations requires long term expression of the transgene, and the ability to transfer large DNA fragments, such as the dystrophin cDNA, which is about 14 kB in size.
High efficiency transduction of cells and the ability to administer multiple doses of a therapeutic gene are particularly important points in gene therapy. The ability to transfer a gene into a cell requires a method of transferring the new genetic material across the plasma membrane of the cell and subsequent expression of the gene product to produce an effect on the cell. There are several means to transfer genetic material into a cell, including direct injection, lipofection, transfection of a plasmid, or transduction by a viral vector. The natural ability of viruses to infect a cell and direct gene expression make viral vectors attractive as gene transfer vectors. Other desirable elements of gene transfer vectors include a high transduction efficiency, large capacity for genetic material, targeted gene delivery, tissue-specific gene expression, and the ability to minimize host immunologic responses against the vector.
One particularly gene therapy vector, adenovirus, has been widely studied and well-characterized as a model system for eukaryotic gene expression, and have become the vector of choice for in vivo gene transfer. Adenoviruses are easy to grow and manipulate, and they exhibit broad host range both in vitro and in vivo. They can be produced to high titers, e.g., 109–1011 plaque-forming units (PFU)/ml, and they are highly infectious for both dividing and non-dividing cells. The life cycle of adenovirus does not require integration into the host cell genome; the foreign genes encoded by adenovirus vectors are expressed episomally, and therefore have low genotoxicity to the host cells. Adenoviruses are not, however, associated with any significant pathologies. They appear only to be linked to mild forms of disease, and there are no known human malignancies associated with adenovirus infection. Moreover, no side effects have, been reported in studies of vaccination with wild-type adenovirus (Couch et al., 1963; Top et al., 1971), demonstrating their safety and therapeutic potential as in vivo gene transfer vectors.
Many viral vectors have not showed the in vivo results that many have hoped, adenovirus being one of these. Expression levels and duration of expression appear to be two problems. It is thought that one of the causes for these problems is the toxicity and immunogenicity of adenovirus, especially and high dosage.
One way of attaining this goal is to reduce or eliminate the expression of adenoviral proteins in the host. The diminution of viral gene expression and viral replication is desirable for the development of viral vectors used for gene therapy, for attenuated live viral vaccines and for the transformation of cells in vitro for the purpose of protein production. A common approach to this endeavor in the adenoviral system has been to delete certain viral genes. Of course, if the gene is essential to viral replication, the function must be complemented. This complementation is accomplished by providing a "helper" cell line that is transformed with a copy of the deleted viral gene. When this cell is infected, the gene produces its essential product, thereby allowing the virus to replicate. However, in a cell not so transformed, the virus can infect but will not replicate.
Thus, there are many benefits to be obtained by the development of new viral vectors and methods for reducing the viral gene expression of such vectors in host cells.

Diminishing viral gene expression by promoter replacement

The Board of Regents of the University of Texas System


An electrical connector (100) mounted on an outer PCB for mating with corresponding plugs includes an insulative housing (1), a couple of contact modules (3) and a metal shield (2) enclosing the insulative housing. The housing includes a first plug-receiving cavity (101) and a second plug-receiving cavity (102) stacked under the first cavity (101). The contact modules (3) include a number of conductive contacts (33) defining a plurality of inclined contact portions (331) extending into the cavities (101, 102). The metal shield includes a planar top face (21), a pair of side face (22) integrally extending downward from the lateral edges of the top face, and a slant rear face (23) integrally bending from the side face. A lower edge of said side face is larger than an upper edge of the side face in a plug insertion direction.

1. Field of the Invention
The present invention relates to an electrical connector and a method thereof, and more particularly, to an electrical connector mounted on a printed circuit board (PCB) for mating with a corresponding plug and a method for making such an electrical connector.
2. Description of the Prior Art
U.S. Pat. No. 6,910,917 B2 issued to Chen on Jun. 28, 2005 discloses a conventional electrical connector mounted on a printed circuit board. The conventional electrical connector has a first connector, a second connector stacked vertically below the first connector, and an integral metal shield covering the first and second connectors. The electrical connector has a relatively large height and small width. With insertion of a first plug into the first connector on the upper level, the electrical connector trends to be overturned, thereby affecting the performance of signal transmission.
Hence, an improved electrical connector with reliable structure and method thereof are needed to overcome the disadvantages above.

Electrical connector with reliable structure and method for making the same


Disclosed are methods for modifying the topography of HDP CVD films by modifying the composition of the reactive mixture. The methods allow for deposition profile control independent of film deposition rate. They rely on changes in the process chemistry of the HDP CVD system, rather than hardware modifications, to modify the local deposition rates on the wafer. The invention provides methods of modifying the film profile by altering the composition of the reactive gas mixture, in particular the hydrogen content. In this manner, deposition profile and wiw uniformity are decoupled from deposition rate, and can be controlled without hardware modifications.

This invention relates to electronic device fabrication processes and associated apparatus. More specifically, the invention relates to chemical vapor deposition processes for controlling the deposition profile of dielectric layers on semiconductor substrates.
It is often necessary in semiconductor processing to deposit layers of dielectric. For example, blanket layers of dielectric are deposited and patterned to provide electrical isolation between vertical layers of semiconductor or conductor (e.g., metalization) in semiconductor devices (e.g., inter-layer dielectric (ILD) or inter-metal dielectric (IMD), as sacrificial protection layers during semiconductor processing, and to fill trenches to electrically isolate adjacent regions in a semiconductor device (e.g., shallow trench isolation (STI).
In these semiconductor processing techniques, it is often necessary to control the deposition profile of dielectric material on the wafer. Depending on the application, the objective may be control (minimization) of within wafer (wiw) uniformity, deposition of a profile compatible with a subsequent processing technique (e.g., CMP), or high aspect ratio gap fill.
Dielectric deposition processes for semiconductor fabrication applications are well known. For example, TEOS/ozone SACVD (sub atmospheric chemical vapor deposition) has generally provided good results. However, such processes are expiring due to incompatibility with the advanced device constraint of a maximum thermal budget of 700° C.
Going forward, the deposition of silicon dioxide assisted by high density plasma chemical vapor deposition (HDP CVD)—a directional (bottom-up) CVD process—is the method of choice for dielectric deposition, including blanket deposition and high aspect ratio gap-fill.
The deposition profile of HDP CVD deposited dielectrics is essentially dictated by the flow rates of reactant gases (e.g., silane and oxygen), the source power set-point, and the hardware configuration. Therefore, it has often been necessary to modify hardware settings in order to optimize film properties as processes evolve in order to meet requirements of future device generations.
To improve fabrication of advanced technology devices, the art requires better dielectric deposition processes that provide deposition profile control without the need for costly and time consuming hardware modifications.

Deposition profile modification through process chemistry


Disclosed is a process wherein a mixture of methanol or a methanol source, a halide and carbon monoxide are contacted in the vapor phase with a supported catalyst comprising iridium and at least one second metal selected from ruthenium, molybdenum, tungsten, palladium, platinum and rhenium deposited on a catalyst support material.

Processes for the manufacture of acetic acid from methanol by carbonylation are operated extensively throughout the world. A thorough review of these commercial processes and other approaches to accomplishing the formation of acetyls from single carbon sources is described by Howard et al. in Catalysis Today, 18 (1993) 325-254. All commercial processes for the preparation of acetic acid by the carbonylation of methanol presently are performed in the liquid phase using homogeneous catalyst systems comprising a Group VIII metal and iodine or an iodine-containing compound such as hydrogen iodide and/or methyl iodide. Rhodium is the most common Group VIII metal catalyst and methyl iodide is the most common promoter. These reactions are conducted in the presence of water to prevent precipitation of the catalyst. U.S. Pat. No. 5,144,068 describes the inclusion of lithium in the catalyst system which allows the use of less water in the Rh-I homogeneous process. Iridium also is an active catalyst for methanol carbonylation reactions but normally provides reaction rates lower than those offered by rhodium catalysts when used under otherwise similar conditions. U.S. Pat. No. 5,510,524 teaches that the addition of rhenium improves the rate and stability of both the Ir-I and Rh-I homogeneous catalyst systems. European Patent Application EP 0 752 406 A1 teaches that ruthenium, osmium, rhenium, zinc, cadmium, mercury, gallium, indium, or tungsten improve the rate and stability of the liquid phase Ir-I catalyst system. Generally, the homogeneous carbonylation processes presently being used to prepare acetic acid provide relatively high production rates and selectivity. However, heterogeneous catalysts offer the potential advantages of easier product separation, lower cost materials of construction, facile recycle and even higher rates.
Schultz, in U.S. Pat. No. 3,689,533, describes the use of supported rhodium as a heterogeneous catalyst for the carbonylation of alcohols to carboxylic acids in the vapor phase in the presence of a halide promoter. In U.S. Pat. No. 3,717,670, Schultz describes a similar supported rhodium catalyst in combination with promoters selected from Groups IB, IIIB, IVB, VB, VIB, VIII, (current notations: 11, 3, 4, 5, 6 and 8-10 respectively) lanthanide and actinide elements of the Periodic Table. Uhm, in U.S. Pat. No. 5,488,143, describes the use of alkali, alkaline earth or transition metals as promoters for supported rhodium for the halide-promoted, vapor phase methanol carbonylation reaction. Pimblett, in U.S. Pat. No. 5,258,549, teaches that the combination of rhodium and nickel on a carbon support is more active than either metal by itself.
In addition to the use of iridium as a homogeneous alcohol carbonylation catalyst, Paulik et al., in U.S. Pat. No. 3,772,380, describe the use of iridium on an inert support as a catalyst in the vapor phase, halogen-promoted, heterogeneous alcohol carbonylation process. European Patent Applications EP 0 120 631 A1 and EP 0 461 802 A2 describe the use of special carbons as supports for single transition metal component carbonylation catalysts.
European Patent Application EP 0 759 419 A1 , published Feb. 26, 1997, after the filing date of Provisional Application No. 60/037,186 cited above, pertains to a process for the carbonylation of an alcohol and/or a reactive derivative thereof. EP 0 759 419 A1 discloses a carbonylation process comprising a first carbonylation reactor wherein an alcohol is carbonylated in the liquid phase in the presence of a homogeneous catalyst system and the off gas from this first reactor is then mixed with additional alcohol and fed to a second reactor containing a supported catalyst. The homogeneous catalyst system utilized in the first reactor comprises a halogen component and a Group VIII metal selected from rhodium and iridium. When the Group VIII metal is iridium, the homogeneous catalyst system also may contain an optional co-promoter selected from the group consisting of ruthenium, osmium, rhenium, cadmium, mercury, zinc, indium and gallium. The supported catalyst employed in the second reactor comprises a Group VIII metal selected from the group consisting of iridium, rhodium and nickel, and an optional metal promoter on a carbon support. The optional metal promoter may be iron, nickel, lithium and cobalt. In the process exemplified in EP 0 759 419 A1, the conditions within the second carbonylation reactor zone are such that mixed vapor and liquid phases are present in the second reactor. The presence of a liquid phase component in the second reactor inevitably leads to leaching of the active metals from the supported catalyst which, in turn, results in a substantial decrease in the activity of the catalyst.
The literature contains several reports of the use of rhodium-containing zeolites as vapor phase alcohol carbonylation catalysts at one bar pressure in the presence of halide promoters. The lead references on this type of catalyst are presented by Maneck et al. in Catalysis Today, 3 (1988), 421-429. Gelin et al., in Pure & Appl. Chem., Vol 60, No. 8, (1988) 1315-1320, provide examples of the use of rhodium or iridium contained in zeolite as catalysts for the vapor phase carbonylation of methanol in the presence of halide promoter. Krzywicki et al., in Journal of Molecular Catalysis, 6 (1979) 431-440, describe the use of silica, alumina, silica-alumina and titanium dioxide as supports for rhodium in the halide-promoted vapor phase carbonylation of methanol, but these supports are generally not at efficient as carbon. Luft et al., in U.S. Pat. No. 4,776,987 and in related disclosures, describe the use of chelating ligands chemically attached to various supports as a means to attach Group VIII metals to a heterogeneous catalyst for the halide-promoted vapor phase carbonylation of ethers or esters to carboxylic anhydrides. Evans et al., in U.S. Pat. No. 5,185,462, describe heterogeneous catalysts for halide-promoted vapor phase methanol carbonylation based on noble metals attached to nitrogen or phosphorus ligands attached to an oxide support. Panster et al., in U.S. Pat. No. 4,845,163, describe the use of rhodium-containing organopolysiloxane-ammonium compounds as heterogeneous catalysts for the halide-promoted liquid phase carbonylation of alcohols. Drago et al., in U.S. Pat. No. 4,417,077, describe the use of anion exchange resins bonded to anionic forms of a single transition metal as catalysts for a number of carbonylation reactions including the halide-promoted carbonylation of methanol. Although supported ligands and anion exchange resins may be of some use for immobilizing metals in liquid phase carbonylation reactions, in general, the use of supported ligands and anion exchange resins offer no advantage in the vapor phase carbonylation of alcohols compared to the use of the carbon as a support for the active metal component.
Nickel on activated carbon has been studied as a heterogeneous catalyst for the halide-promoted vapor phase carbonylation of methanol, and increased rates are observed when hydrogen is added to the feed mixture. Relevant references to the nickel-on-carbon catalyst systems are provided by Fujimoto et al. In Chemistry Letters (1987) 895-898 and in Journal of Catalysis, 133 (1992) 370-382 and in the references contained therein. Liu et al., in Ind. Eng. Chem. Res., 33 (1994) 488-492, report that tin enhances the activity of the nickel-on-carbon catalyst. Mueller et al., in U.S. Pat. No. 4,918,218, disclose the addition of palladium and optionally copper to supported nickel catalysts for the halide-promoted carbonylation of methanol. In general the rates of reaction provided by nickel-based catalysts are lower than those provided by the analogous rhodium-based catalysts when operated under similar conditions.
Other single metals supported on carbon have been reported by Fujimoto et al. in Catalysis Letters, 2 (1989) 145-148 to have limited activity in the halide-promoted vapor phase carbonylation of methanol. The most active of these metals is Sn. Following Sn in order of decreasing activity are Pb, Mn, Mo, Cu, Cd, Cr, Re, V, Se, W, Ge and Ga. None of these other single metal catalysts are nearly as active as those based on Rh, Ir, Ni or the catalyst of the present invention.
A number of solid materials have been reported to catalyze the carbonylation of methanol without the addition of the halide promoter. Gates et al., in Journal of Molecular Catalysis, 3 (1977/78) 1-9, describe a catalyst containing rhodium attached to polymer bound polychlorinatedthiophenol for the liquid phase carbonylation of methanol. Current, in European Patent Application EP 0 130 058 A1, describes the use of sulfided nickel containing optional molybdenum as a heterogeneous catalyst for the conversion of ethers, hydrogen and carbon monoxide into homologous esters and alcohols. Smith et al., in European Patent Application EP 0 596 632 A1, describe the use of mordenite zeolite containing Cu, Ni, Ir, Rh, or Co as catalysts for the halide-free carbonylation of alcohols. Feitler, in U.S. Pat. No. 4,612,387, describes the use of certain zeolites containing no transition metals as catalysts for the halide-free carbonylation of alcohols and other compounds in the vapor phase. Wegman, in U.S. Pat. No. 5,218,140, describes the use of polyoxometallate anions containing Fe, Ru, Os, Co, Rh, Ir, Ni, Pd or Pt as catalysts for the halide-free carbonylation of alcohols and other compounds in the vapor phase. Although alcohol carbonylation without the use of halide promoters is very desirable, none of these halide-free catalyst systems have rates comparable to those of catalysts promoted by halide.

Heterogeneous vapor phase carbonylation process


An improved cleaning and sterilizing apparatus adapted for cleaning and sterilizing medical instruments in which a wash cycle and rinse cycle are repeated if proper cleaning of the instrument has not been obtained. Using a turbidity monitor or comparable instrument, an indicia representative of the particles in the rinse water is obtained. If the indicia does not meet some pre-defined standard, such as those set by the Food and Drug Administration, then the wash/rinse cycles are repeated. This is done either until the standards are met or for a certain number of times. If the standards are met, then the medical instrument is sterilized for later use. In the preferred embodiment, proper sterilization is monitored by the turbidity monitor.

This invention relates generally to mechanisms used to clean tubular items and more particularly to mechanisms used to sterilize as well.
The apparatus of this invention is particularly well suited for endoscope cleaning and sterilization. Other areas of application include: dental tools, surgical instruments, implants, etc.
Endoscopes are flexible tubes having a multiplicity of endings. Merely soaking endoscopes in a sterilant or detergent is unacceptable since numerous pockets exist within the tubing where the sterilant or detergent cannot reach effectively. This leaves areas of contamination within the endoscope. With the prevalence of highly contagious diseases such as hepatitis B and Acquired Immune Deficiency Syndrome, sterilization or disposal of all medical tools becomes mandatory.
Once used, endoscopes are usually discarded due to the complexity in getting the endoscope sterilized before any subsequent uses. Endoscopes themselves are extremely expensive so their disposal after one use is seen as wasteful since the structural integrity of the endoscope has not been jeopardized by its use, only its sterile nature.
It is clear from the foregoing that there is a significant need for a device which will assist in cleaning a device and improve the sterilizing effects.


The present invention provides a low temperature heat shrinkable film comprising a linear low density polyethylene resin having a short branched chain and a density of 0.935 g/cm.sup.3, and whose film properties are such that the haze value is 5% or less, the heat shrinkages at 90.degree. C. in the M and T directions are 30% or more and 5% or less, respectively , and the shrinkage stress at 90.degree. C. in the M direction is 300 g/mm.sup.2 or more. This transparent film having an excellent low temperature heat shrinkability can be produced by drawing a film of the above-mentioned polyethylene resin between two rolls having a diameter of 200 mm or less at an air gap of 10 mm or less at a draw ratio of 3.0 to 6.0. Further, an inflation film having a multilayer structure can be obtained by press bonding or press bonding and drawing a plurality of films comprising the above-mentioned polyethylene resin. This laminate film has an excellent transparency and strength, and has a uniform film thickness.

The present invention relates a low temperature heat shrinkable film and a process for producing the same. More specifically, the present invention relates to a low temperature heat shrinkable film which has high heat shrinkability at low temperature and high shrinkage stress and which has a remarkably excellent transparency as compared with conventional shrink films, and process for producing such a film. Moreover, the present invention relates to an inflation film consisting of a multilayer structure of a single resin.
Conventionally, there have been used low temperature heat shrinkable films exhibiting a low temperature shrinkability at 90.degree. to 100.degree. C. of 30 to 50% which are obtained by drawing a low density polyethylene resin (LDPE) having a long branched chain usually called high-pressure polyethylene, or a blend of the low density polyethylene resin with an ethylene-vinyl acetate copolymer, a butene type rubber or the like at a draw ratio of 1.5 to 3.0.
However, these films are disadvantageous in that, because the LDPE having a number of long branched chains has a remarkably inferior stretchability, it can be drawn only at a low draw ratio and it cannot be uniformly drawn, with the result that unevenness in drawing is generated in the resultant film and unevenness in thickness or jetting are generated in the film due to the internal strain remaining in the film. Therefore, there are serious problems with regard to the productivity of these films. Further, these films have another disadvantage in that they cannot exhibit a display effect to a sufficient degree because the haze value indicative of the transparency of the film, which is a very important factor in a packaging film, is 5% or more, typically about 10%.
The present inventors made extensive investigations to improve the above-mentioned defects. As a result, the present inventors discovered that when a film made of a linear low density polyethylene resin having a short branched chain and density of 0.935 g/cm.sup.3 or less (hereinafter referred to as LLDPE) was drawn at a draw ratio of 3.0 to 6.0 between two rolls having a diameter of 200 mm or less using an air gap of 10 mm or less, a low temperature shrinkable film could be produced which had an extremely excellent transparency, was free from unevenness in drawing, and had a uniform thickness and an excellent film strength.
As is well known, an inflation method is one method for forming plastics films. This inflation method generally comprises blowing air into a tube extruded from an inflation die attached to an extruder to expand the tube, and cooling the expanded tube, thereby continuously forming a plastics film.
When a film is produced by means of an inflation method, in order to prevent the films in the form of a tube from being blocked, the addition of an antiblocking agent is carried out or other measures are adopted.
In the course of extensive investigations to develop a low temperature heat shrinkable polyethylene film having excellent transparency and excellent properties which is suitable for use in shrink packaging, the present inventors discovered that, when a linear low density polyethylene resin having a short branched chain and a density of 0.935 g/cm.sup.3 or less was formed into a film in the form of a tube by means of an air cooling inflation method or a water cooling inflation method, and two films were allowed to be strongly blocked by a strong nip-roll pressure, while effecting sufficient cooling and folding the tubular film by means of a guide plate, in contrast with the conventional technique in which blocking of films is avoided as much as possible, so as to form a two layer structured film, the tubular film could be easily blocked by forming the above-mentioned polyethylene resin according to a water cooling inflation method, a two-stage air cooling inflation method and other methods which exhibit an excellent cooling efficiency because the polyethylene resin has a remarkable tendency to be blocked by a rapid cooling method having a high cooling efficiency in an inflation forming method.
Moreover, it was discovered that when the film obtained above was drawn by means of heat rolls, the blocking of the two films was further strengthened so as to obtain a drawn film of two layer structure which could not be readily separated into two pieces, and at the same time, the transparency was rapidly enhanced to a high level equal to that of a vinylon film (haze value: 3% or less).
In addition, since the above-mentioned drawn film was of a two layer structure in which the two films were blocked, it was found that the film strength such as impact strength and tear strength, especially longitudinal tear strength, was remarkably excellent. As shown in the comparative examples described hereinafter, it was also found that the drawn film exhibited remarkably excellent impact strength and tear strength as compared with an inflation film or a T-die film of single structure having the same thickness. When the strength of a film is to be enhanced, it is a common practice to increase the thickness of the film. In this case, the transparency of the film is likely to be decreased. In contrast, it was found in the above-mentioned case that the transparency became rather improved. As described hereinabove, the conventional low temperature heat shrinkable film was disadvantageous in that the thickness was uneven, the jetting was generated, the quality of the product was poor, and the transparency of the film was unsatisfactory. The present inventors succeeded in obtaining a film of multilayer structure which was heat shrinkable at a lower temperature, had a remarkably excellent transparency and exhibited a conspicuously excellent strength, especially a high resistance to longitudinal tearing, as compared with the conventional inflation films and the like, by press bonding or press bonding and drawing a plurality of films composed of a linear polyethylene resin having a short branched chain and a density of 0.935 g/cm.sup.3 or less by means of an inflation method so as to provide a laminated film.

Low temperature heat shrinkable film and process for producing the same


A plumbing connection hub for connecting household plumbing to appliances or basins is provided. The hub includes a container formed by a continuous wall and at least one open side, a tubular drain outlet leading out of the container through an operatively lower portion of the wall and the outlet being connectable to the sewage system of a house, and a drain inlet leading into the container from an open side with the tube fixed to the wall, and with the inner ends of the inlet and outlet positioned to receive a s-trap between them. The hub further includes a water connection elbow pipe locator for locating a water connection elbow pipe.

The applicant is aware that the plumbing connections of baths, wash basins and appliances such as dishwashers and washing machines normally need to be connected to municipal water system of a house and to a sewage system of a house. These connections of a house are usually solely functional, low cost and not aesthetically pleasing. These connections are usually visible especially if the appliance is not connected. The connections may sometimes also be out of reach of the piping of the appliance. The applicant is further aware of DE 2745843, which discloses a box shaped plumbing hub having holes for piping and an integrally moulded s-trap. This s-trap, however has right angled corners which collect dirt. The s-trap is also covered by a lid rather than an inspection hole, which may cause leaks. The applicant made a similar invention in PCT/ZA06/00110, with an integrally formed s trap in the form of an integrally formed pipe. However, the applicant found this to be excessively expensive to manufacture by means of moulding. The use of the known plumbing connection hubs and other plumbing connection hubs as described in U.S. Pat. No. 4,637,422 and U.S. Pat. No. 4,410,004 are limited to specific uses, and the US patents further does not provide for an s-trap. It is an object of this invention to provide a versatile, cost effective, convenient and aesthetically pleasing means for connecting such appliances, basins and baths.
It is an object of this invention to provide an improved plumbing hub which can be used for any household plumbing application.


The present invention relates to 2-imino-1,3-thiazine derivatives, in specific, 2-imino-1,3-thiazine derivatives having a selective antagonistic activity or agonistic activity to a cannabinoid type 2 receptor and their pharmaceutical use.

Cannabinoid was discovered as the main active substance contained in marijuana in 1960 and found to exhibit an activity to the central nervous system (illusion, euphoria, sensory confusion of time and space) and an activity to the peripheral cell system (immunosuppressive activity, anti-inflammatory activity, analgesic activity).
After that, anandamide and 2-arachidonoylglycerol produced from phospholipid containing arachidonic acid were discovered as endogenous agonists to a cannabinoid receptor. These endogenous agonists were known to exhibit an activity to the central nervous system and an activity to the peripheral cell system. It was disclosed in Hypertension (1997) 29, 1204-1210 that anandamide exhibits an activity to the cardiovascular system.
A cannabinoid type 1 receptor discovered in 1990 was found to distribute in the central nervous system such as the brain. Agonists to this receptor were found to suppress the release of neurotransmitters to cause central actions such as illusion or the like. A cannabinoid type 2 receptor discovered in 1993 was found to distribute in immune tissues such as the spleen or the like. Agonists to this receptor were found to suppress an activation of cells in immunocyte or phlogocyte to exhibit an immunosuppressive activity, an anti-inflammatory activity and an analgesic activity (Nature, 1993, 365, 61-65).
Therefore, selective antagonists or agonists to the cannabinoid type 2 receptor are expected as immunosuppressive agents, anti-inflammatory agents, analgesic agents without causing side effects on the central nervous system such as illusion or the drug dependence, which are associated with the cannabinoid type 1 receptor (Nature, 1998, 349, 277-281).
Known as compounds having an antagonistic activity or agonistic activity to the cannabinoid type 2 receptor are isoindolynone derivatives (WO97/29079 and WO99/02499), pyrazole derivatives (WO98/41519) and the like
On the other hand, Japanese Patent Publications (Kokai 1986-65894, Kokai 1987-29594) disclose that organophosphorus compounds having a 2-imino-1,3-thiazine skeleton are useful as insecticides.
However, it is not known that 2-imino-1,3-thiazine derivatives have an antagonistic activity or agonistic activity to the cannabinoid type 2 receptor.


Optimally scheduling a plurality of computation processes including all-to-all communications (A2A) among a plurality of nodes (processors) constituting an n-dimensional (a torus or a mesh) network.

In parallel computers connected via a torus or mesh network, the performance of communication among a plurality of nodes (processors) significantly affects the speed of computation processes. As a typical communication pattern, there has been known an all-to-all communication (A2A for short), in which all nodes send data different from each other to other all nodes, requiring the largest amount of communication traffic. The all-to-all communication is known as communication frequently used in a lot of computations including a matrix transpose (T for short) and a fast Fourier transform (FFT for short).
Patent Document 1 defines that a matrix transpose in FFT computation or computation as a two-dimensional (2D) FFT in one-dimensional (1D) FFT computation is the general state of the art. The one-dimensional FFT is processed across a plurality of processors and the two-dimensional FFT is processed across a plurality of processors.
Patent Document 2 describes an idea of making more efficient processing within the all-to-all communication in an n-dimensional torus by superimposing phases. Here, the present invention is described by comparison with Patent Document 2. The present invention is to convert an all-to-all communication to a plurality of partial all-to-all communications to pipeline the all-to-all communications, while the present invention does not include an implementation method within the all-to-all communication and therefore is intended for a different purpose. In addition, scheduled objects of the present invention differ from those of Patent Document 2, and Patent Document 2 does not include the superposition of processes other than those of an all-to-all communication on processes within the all-to-all communication as in the present invention.

Scheduling computation processes including all-to-all communications (A2A) for pipelined parallel processing among plurality of processor nodes constituting network of n-dimensional space

Abstract: The plurality of nodes (processors) constituting the network are divided into a communication (computation process) phase (A2A-L) required for all-to-all communications only among a plurality of nodes included in a first subgroup and a communication (computation process) phase (A2A-P) required for all-to-all communications only among a plurality of nodes included in a second subgroup to perform parallel processing with the phases overlapped with each other across a plurality of threads (thread 1, thread 2, thread 3, and thread 4). It is also possible to perform the parallel processing with respect to a plurality of computation processes such as a fast Fourier transform (FFT) and a transpose (T) (internal transpose).

International Business Machines Corporation


This invention is an after market stand alone complete replacement fuel delivery system that works independent of and after disconnecting the standard liquid fuel delivery system for a fuel injected internal combustion engine. This device creates pressurized gasoline vapors at approximately 35 psi to 90 psi mixed and charged with large amounts of processed compressed air to achieve a gasoline vapor in it's purest form to utilize substantially more of the gasoline's energy potential which will greatly reduce engine emissions to much lower levels and improving the general performance of a gasoline fueled internal combustion engine essentially in the same pressurized gas form as found in a propane or natural gas fuel system, and to be refitted to existing gasoline fuel injected engines.

1. Field of the Invention
The present invention relates generally to a method and apparatus for producing a combustible vapor, mixing gasoline (or other fuel) with air, for an internal combustion engine, more particularly, to vaporization devices for fuel for such engines.
2. Description of the Prior Art
The internal combustion engine has been with us for a long time, since the designs of Christian Huygens in 1680 which burned gunpowder. Significant improvements over the years have been made in many areas of the engine, with the development of better fuels and better designs to burn those fuels. Since the development of the gasoline engine, one particular area that has seen advancement is the carburetor and carburetor/fuel injection systems. In U.S. Pat. No. 3,945,352 to Reimuller in 1976, the Applicant there noted that "[h]eretofore, virtually all internal combustion engines using liquid hydrocarbon fuel, such as gasoline or diesel oil, have utilized carburetors or fuel injectors to deliver the liquid fuel into the intake air, or into the combustion chamber, in the form of finely atomized mist, which is supposed to evaporate completely, with the result that some of the fuel is still in liquid form during the combustion state, and because of this it burns incompletely, leaving a considerable amount of unburned fuel in the exhaust to pollute the atmosphere . . . [which] . . . also means reduced efficiency, lower power output, and poor fuel consumption characteristics."
Given such, different approaches to minimizing droplet size have been tried over the years as evidenced in a plethora of prior art patents. Some of the earlier inventors to consider actually utilizing vapor instead of liquid gasoline were Christian Reimuller (U.S. Pat. No. 3,945,352) in 1976, Arnold Feuerman (U.S. Pat. No. 4,011,843) in 1977, and S. Smith Sommervile (U.S. Pat. No. 4,015,570) in 1977. Reimuller's early attempt utilized vaporizing gasoline in a flash boiler wherein the gasoline would then instantly ignite when introduced to air. This method did reduce the amount of gasoline used, however, the instant ignition required the introduction of air to be in the combustion chamber itself and increased the explosive danger of an engine. Feuerman's device, instead of utilizing a boiler, creatively passed electric current through an electrolytically conductive emulsion of gasoline and water.
Unfortunately, modern engines are not equipped to handle the introduction of water, even in vapor form. Feuerman, who has been prolific, also obtained related U.S. Pat. Nos. 4,133,847 (1979); 4,246,082 (1981); and 4,276,131 (1981) which suffer from the same difficulty. Sommerville, utilizes a somewhat simple vaporization system wherein fuel is atomized into a vaporizer chamber and contained hot water pipes extending through the chamber heat the fuel to promote vaporization, and baffles are utilized to "catch" non-aerosolized droplets. Air is "fed" into the chamber by means of engine vacuum pulling air through the chamber. The difficulty with the Sommerville device is the need to heat the chamber and the lack of control over the exact air/vapor mix. Later devices such as that introduced in 1980 by Perepolkin (U.S. Pat. No. 4,204,485), also suffer from similar deficiencies such as utilization of water in the admixture or utilization of engine vacuum by Strem et al. (U.S. Pat. Nos. 4,191,153 (1980) and 4,257,366 (1981)).
Therefore, what is needed in the art is a device that is compatible with modern engines which provides a reliable concentration of fuel vapor mixed with air without relying on external heating to produce the vapor since that would require pre-heating of an engine).

Fuel vaporization apparatus and method for use in combustion engines