On a SIMOX substrate having a plurality of STI layers and first conductivity type semiconductor layers disposed in the row direction, a stacked-layer structure SS is formed on a gate dielectric film formed on the first conductivity type semiconductor layer, the structure SS being made of a first polysilicon film, a second gate dielectric film and a second polysilicon film. Second conductivity type source and drain regions are formed in the first conductivity type semiconductor layer on both sides of the structure SS. In a plurality of source regions adjacent in the column direction between the stacked-layer structures SS, a common source line CSL is formed which is made of second conductivity type source region connecting semiconductor regions, source regions and conductive films formed on these semiconductor and source regions.

a) Field of the Invention
The present invention relates to a nonvolatile semiconductor memory device capable of reading, writing and erasing data and its manufacture method using SOI (silicon on insulator), SIMOX (separation by implanted oxygen) and the like.
Because of ultra fine patterns and a rapid increase in the memory capacity, nonvolatile semiconductor memories such as flash memories and EEPROMs are expected to be used as alternatives of hard disks widely used as storage devices, and some of then are actually used as such alternatives. If flash memories, EEPROMs or the like can be integrated highly to provide a large memory capacity sufficient for the alternatives of hard disks, many advantages are expected. Namely, products using such memories are resistant to vibrations because mechanical components are not used, and have a low power consumption which is suitable for a battery operation of the products, particularly for various types of portable digital equipments. New techniques allowing a much higher integration and larger capacity have been long desired.
b) Description of the Related Art
A field oxide film as an element separation region of a flash memory, EEPROM or the like is formed on a semiconductor substrate to a thickness of 400 nm to 800 nm by local oxidation of silicon (LOCOS).
On the substrate formed with element separation regions through LOCOS, a first gate dielectric film, a floating gate (polysilicon), a second gate dielectric film, and a control gate (polysilicon) are sequentially laminated to form the memory cell structure of a nonvolatile memory. The control gate extends in a direction (column direction) crossing the element separation region to form a word line of the nonvolatile semiconductor memory.
A common source wiring line running in parallel with the word line is formed by selectively removing the LOCOS oxide film between adjacent two control gates and implanting arsenic or the like into the p-type semiconductor substrate under the conditions of, for example, a dose of 3xc3x971015 cmxe2x88x922 and an acceleration energy of 60 keV. Source regions (each being generally formed between adjacent two control gates) formed in the semiconductor substrate on one side of the floating gate are electrically connected in the column direction by the impurity doped regions to form the common source region.
The nonvolatile semiconductor memory device described above has, however, an element separation width limit and is not suitable for ultra fine patterning because LOCOS is used for element separations.
This problem also occurs when a hybrid nonvolatile semiconductor memory device is formed having a logic circuit and a nonvolatile semiconductor memory device formed on the same substrate.
It is essential to make fine transistors in order to speed up the operation of a logic circuit. As a transistor is made fine (e.g., a short gate length), it is necessary to shallow the depth of the source/drain regions. In order to retain a certain degree of a current capacity, the doping concentration of the source/drain regions is required to be set high. In this case, parasitic capacitance increases and hinders the high speed operation of a nonvolatile semiconductor memory device.
Instead of forming the common source region by etching the element separation region through self-alignment using the control gates (actually, sidewall spacers formed on the side walls of the control gates) as a mask, a nitride film patterned by using photoresist may be used as an etching mask. In this case, the edge of the resist pattern is rounded and so the edge of the nitride film is rounded. Therefore, there is a variation in the etching amounts of the element separation region so that memory cells of the nonvolatile memory device have a variation in their characteristics.
Further, since adjacent source regions are connected only by regions (doped layers) formed by implanting arsenic or the like into the p-type semiconductor substrate, the sheet resistance of the common source region is high. With a high sheet resistance, a voltage dropped by this resistance becomes high. Therefore, when data stored in the memory device is erased, a variation in the accumulated charge amounts in the floating gates of a plurality of memory cells becomes large.
It is an object of the present invention to provide a high performance nonvolatile semiconductor memory device capable of a high speed operation and a high integration.
According to one aspect of the present invention, there is provided a nonvolatile semiconductor memory device comprising: a semiconductor substrate; an underlying dielectric layer formed on the semiconductor substrate; a plurality of first conductivity type striped-shape semiconductor layers formed on the underlying dielectric layer and disposed apart from each other in a row direction; a trench formed between each pair of adjacent first conductivity type semiconductor layers and extending in the row direction; a plurality of buried dielectric portions filled with a separation dielectric layer and formed discontinuously in the row direction in each of the trenches and aligned in a column direction; an opening formed in the underlying dielectric layer between the buried dielectric portions adjacent in the column direction; at least a first gate dielectric film formed on each of the first conductivity type semiconductor layers, a plurality of floating gates each formed on each of the first gate dielectric films and all separated in the column direction on the buried dielectric portions, a second gate dielectric film formed on each of the floating gates, and a plurality of control gates formed on the second gate dielectric films and extending in same column directions as the plurality of floating gates; a source region of a second conductivity type formed in the first conductivity type semiconductor layer between the openings adjacent in the column direction on one side of each of the floating gates; a drain region of a second conductivity type formed in the first conductivity type semiconductor layer between the buried dielectric portions adjacent in the column direction on the other side of each of the floating gates; a source region connecting semiconductor layer of the second conductivity type being continuous with the source region and formed at least on the semiconductor substrate in the trench formed in the opening between the source regions in the column direction; and a conductive film formed on the source region connecting semiconductor layers and the source regions and extending in the column direction.
According to another aspect of the present invention, there is provided a method of manufacturing a nonvolatile semiconductor memory device comprising the steps separating a first conductivity type semiconductor layer formed on a semiconductor substrate having a buried dielectric layer on a front surface side of the semiconductor substrate, by forming a plurality of trenches elongated in a row direction; filling a dielectric layer in the trench; forming a first gate dielectric film at least on the first conductivity type semiconductor layer; forming a first conductive polysilicon layer on the substrate formed with the first gate dielectric film; removing the first polysilicon layer to leave islands disposed apart from each other in the row direction; forming a second gate dielectricfilm at least on a surface of the first polysilicon layer; forming a second polysilicon layer on the second gate dielectric film; etching at least the second polysilicon layer, the second gate dielectric layer and the first polysilicon layer in a striped-shape in a column direction to form a stacked-layer structure including the second polysilicon layer, the second gate dielectric layer and the first polysilicon layer; forming source and drain regions in the first conductivity type semiconductor layer on both sides of the stacked-layer structure by alternately introducing impurities of the first conductivity type and impurities of a second conductivity type opposite to the first conductivity type; forming dielectric side spacer films on both side walls of the stacked-layer structure extending in the column direction; removing the dielectric layer filled in the trench between source regions adjacent in the column direction and the buried dielectric layer under the dielectric layer to expose a surface of semiconductor; growing a source region connecting semiconductor layer at least on the semiconductor surface exposed by removing the buried dielectric layer; introducing the second conductivity type impurities at least into the source region connecting semiconductor layer; and forming a conductive film at least on the source regions and the source region connecting semiconductor layers, the conductive film extending in a the column direction same as a direction of the source regions and the source region connecting semiconductor layers.
As above, parasitic resistance of each semiconductor element of the nonvolatile semiconductor memory device reduces and a variation in the characteristics of the semiconductor element reduces. The width of an element separation region can be narrowed.
High speed operation, high uniformity and high integration of the nonvolatile semiconductor device are therefore possible.

Method of manufacturing a nonvolatile semiconductor memory device


This invention relates to a process for encapsulation and particularly for the preparation of microcapsules having a capsule wall of a solid polymeric substance enclosing a water-immiscible material, which process comprises preparing a solution of a first reactive component required to form the capsule wall in the water-immiscible material, then dispersing the mixture in an aqueous medium containing a surfactant which is a salt of a partial ester of a styrene-maleic anhydride copolymer, to form an oil-in-water emulsion, and subsequently adding a second reactive component required to form the capsule wall which is complementary to the first one and reacts with it under the mixing conditions, whereby a solid polymeric wall is formed about the dispersed water-immiscible material. The resulting stable aqueous suspension of microcapsules can either be used directly or after dilution with water, or the microcapsules can be separated from the aqueous phase.

The present invention relates to a process for the preparation of microcapsules having a capsule wall of a polymeric substance enclosing a water-immiscible material, by interfacial polymerization of an aqueous dispersion of a first polymer-forming substance dissolved in a water-immiscible material with a second polymer-forming substance which reacts with the first one under the mixing conditions, to form a stable aqueous suspension of microcapsules of the water-immiscible material. The invention also relates to a composition comprising said microcapsules and the use of said microcapsules.
It is known per se to prepare microcapsules by carrying out an interfacial polycondensation reaction in a liquid, with one of the reactive components required to form the capsule wall being dissolved in the disperse phase and the other being dissolved in the continuous phase. Such a process is disclosed for example in U.S. Pat. No. 3,577,515. This process is carried out by initially dispersing a solution of the first reactive component required to form the capsule wall and an immiscible material in a continuous phase with high shear and then adding a solution of a second complementary reactive component dissolved in the medium containing the continuous phase to it with mixing. In the process of U.S. Pat. No. 3,577,515, it is recommended to use nonionic protective colloids such as polyvinyl alcohol, gelatin and methyl cellulose for the dispersion of a water-immiscible organic phase in a continuous aqueous phase. A variety of wall-forming components are disclosed.
One drawback of this process is that it is incapable of encapsulating concentrated amounts of material, such as 45% by weight or more, because the microcapsules tend to agglomerate into large unusable masses.
Several U.S. patents such as U.S. Pat. Nos. 4,280,833, 4,640,709 and 4,938,797 disclose processes for microencapsulation via an interfacial polycondensation reaction whereby concentrated amounts of water-immiscible materials, such as 45% by weight or more, can be encapsulated within a polymeric shell wall, with the finished microcapsules forming a stable suspension in an aqueous medium. The ability to obtain high concentrations of microcapsules is taught to critically depend on the use of a specific type of surfactant or a combination of surfactants, for example, a salt of a lignin sulfonate in U.S. Pat. No. 4,280,833, an alkylated polyvinyl pyrrolidone polymer in U.S. Pat. No. 4,640,709 and a combination of a formaldehyde condensate of a naphthalene sulfonate with ethylene oxide/propylene oxide/ethylene oxide block polymers in U.S. Pat. No. 4,938,797.
Microcapsules prepared by interfacial polycondensation can advantageously contain materials which have a variety of uses, such as for dyes, inks, color formers, pharmaceuticals, cosmetics, flavoring materials, agricultural chemicals and the like. Any liquid, oil, low melting solid or solvent-soluble material into which a first wall-forming material can be dissolved and which is non-reactive with said wall-forming material may be encapsulated with this technique. Once encapsulated, the liquid or other form is preserved until it is released by some means which breaks, crushes, melts, dissolves, or otherwise removes the capsule skin or until release by diffusion is effected under suitable conditions.
The process of the present invention is particularly suitable for the production of microcapsules of very small capsule size which are suspended in an aqueous medium and which contain agricultural chemicals such as pesticides and herbicides.
Aqueous suspensions of pesticide and herbicide microcapsules are particularly useful in controlled release pesticide and herbicidal formulations because they can be diluted with water or liquid fertilizer and sprayed using conventional equipment, thereby producing uniform field coverage of the agricultural chemical. Additives such as film forming agents can be added directly to the finished formulation to improve the adhesion of microcapsules to foliage. In some instances, reduced toxicity and extended activity of encapsulated herbicides and pesticides have been noted.
Most conventional oil-in-water surfactants fail to produce emulsions which are suitable for microencapsulation via interfacial polymerization. More importantly, they fail to maintain a stable suspension of microcapsules during the critical wall-forming step, particularly when high concentrations of water-immiscible materials are involved. This results in coalescence of the partially formed capsules into larger agglomerates which cannot be redispersed, or even solidification of the entire nonaqueous phase when the second reactive component is stirred into the oil-in-water emulsion. The critical factor in achieving stable, high concentrations of microencapsulated materials is therefore the selection and use of a special type of surfactant or adjuvant which is able to both produce a stable oil-in-water emulsion and, more importantly, to stabilize the subsequent suspension of capsules during the wall-formation step so that coalescence to large unusable agglomerates is avoided.
It has now been discovered that by using salts of partial esters of styrene-maleic anhydride copolymers in the process of microencapsulation via interfacial polymerization, it is possible to obtain highly concentrated, stable microcapsule suspensions. The the present invention thus provides a new and improved method of encapsulation via interfacial polymerization which provides a rapid and effective way to obtain high concentrations of water-immiscible materials in the form of an aqueous microcapsule suspension.
Generally, the water-immiscible material can be effectively encapsulated at concentrations up to about 45% by weight or higher without difficulty. Once the water-immiscible material, for example, a pesticide or herbicide, is encapsulated, the system becomes a solid-in-liquid suspension which can be directly combined with other water-based materials, for example, liquid fertilizers. Or it can be diluted with water and sprayed by a conventional applicator.

Process for the preparation of microcapsules using a salt of a partial ester of a styrene-maleic anhydride copolymer


A method and system are provided for thermal management of a portable computing apparatus. Accelerometers are provided to detect changes in attitude, and temperature sensors are provided to detect changes in temperature. A fan is used to cool the internal temperature of the electronic components of the computer. In response to lift of the computer from a stationary surface, the computer may transition to an alternative state of operation. The transition may include the change of the speed of the fan and/or adjustment of the processor clock.

1. Technical Field
This invention relates to thermal management of a personal computer. More specifically, the thermal management applies to detection of movement of a personal computer from a stationary surface and managing cooling of heat generating components in response to the movement.
2. Description of the Prior Art
It is known in the art that electronic parts in computer systems generate heat. Fans and heat sinks have been developed to manage heat dissipation of electronic parts. Laptop computers are a category of personal computers that are relatively compact and, as such, are portable. However, problems arise when a user of a laptop computer moves the laptop from a stationary position on a stationary surface, to their lap or another part of their body. The problems that arise are found in excess heat reaching the surface of the body of the user through a base surface of the computer, which can cause discomfort. Accordingly, there is a need to accurately detect movement from a stationary surface and to efficiently dissipate heat from the computer components so that a user of the laptop will not suffer discomfort.
There are several patents that address thermal management of a laptop computer. For example, U.S. Pat. No. 6,760,649 to Cohen provides a pressure sensor on a base cover of a laptop computer to determine whether the base surface of the laptop is in direct contact with a lap of the user and to initiate a cooling function in response to activation of the pressure sensor. When the laptop is on a stationary surface, the pressure sensor does not become activated since the sensor has consideration for a gap frequently formed between the base surface of a laptop casing and a resting surface, such as a stationary surface. As such, the pressure sensor does not activate on a stationary surface. However, there are limitations associated with the '649 patent to Cohen. For example, an erroneous determination may arise when the user of the laptop is not in direct contact with the base surface of the casing. One such example is if an object becomes caught between the casing and stationary surface, or an edge of the stationary surface is detected as a lap when a portion of the casing is placed into a position to jut out from the stationary surface without support. Activation of the sensor results in initiation of cooling measures, which in turn results in an increase in fan noise and may result in lowering the frequency of the processor clock. Cooling measures which lower the frequency of the processor clock affect the performance of the personal computer. If the cooling measures are initiated in response to a false reading of a sensor, then the personal computer may inappropriately operate at a lower performance level. Accordingly, the prior art does not address the need for an accurate tool for detecting movement of a laptop from a stationary surface.
Therefore, there is a need for an accurate method of determining when a laptop computer has been moved from a stationary surface to a lap of a user or other part of the body. The method should include the entire surface area of the base surface of the laptop, and restrictively respond to the movement with a minimal thermal management adjustment so that the adjustment should not interfere with internal or external operations of the computer.

Thermal management of a personal computing apparatus


A transistor comprises a substrate, a pair of spacers on the substrate, a gate dielectric layer on the substrate and between the pair of spacers, a gate electrode layer on the gate dielectric layer and between the pair of spacers, an insulating cap layer on the gate electrode layer and between the pair of spacers, and a pair of diffusion regions adjacent to the pair of spacers. The insulating cap layer forms an etch stop structure that is self aligned to the gate and prevents the contact etch from exposing the gate electrode, thereby preventing a short between the gate and contact. The insulator-cap layer enables self-aligned contacts, allowing initial patterning of wider contacts that are more robust to patterning limitations.

Metal-oxide-semiconductor (MOS) transistors, such as MOS field effect transistors (MOSFET), are used in the manufacture of integrated circuits. MOS transistors include several components, such as a gate electrode, gate dielectric layer, spacers, and diffusion regions such as source and drain regions. An interlayer dielectric (ILD) is typically formed over the MOS transistor and covers the diffusion regions.
Electrical connections are made to the MOS transistor by way of contact plugs that are typically formed of a metal such as tungsten. The contact plugs are fabricated by first patterning the ILD layer to form vias down to the diffusion regions. The patterning process is generally a photolithography process. Next, metal is deposited in the vias to form the contact plugs. A separate contact plug is formed down to the gate electrode using the same or a similar process.
One problem that can occur during the fabrication of a contact plug is the formation of a contact-to-gate short. A contact-to-gate short is a short circuit that occurs when the contact plug is misaligned and comes into electrical contact with the gate electrode. One conventional approach to preventing contact-to-gate shorts is by controlling registration and critical dimensions (CDs). Unfortunately, for transistors with gate pitches (gate length+space) at or below 100 nanometers (nm), CD control for gate and contact dimensions needs to be less than 10 nm and the registration control between gate and contact layers also needs to be less than 10 nm to deliver a manufacturable process window. Thus, the likelihood of a contact shorting to a gate is very high. This problem becomes more prevalent as transistor gate pitch dimensions are scaled down further because the critical dimensions become much smaller.


A method and apparatus is provided for decreasing the scrubber exhaust from gas panels, lower the cost of operation, lower the facilitation cost and power consumption by increasing the air velocity in areas of high potential risk of ignition. The apparatus includes a supply of compressed dry air (CDA) through the tubing with individual dispersion nozzles. The CDA dispersion nozzles can be installed at various key locations in order to provide additional ventilation turbulence and reduce potential dead zones inside the gas panel. Aspects of the invention help to save the energy and protect the environment by reducing the power consumption. In addition human safety shall be improved by minimizing the potential risk of ignition.

The present invention relates to the field of gas delivery systems, in particular, scrubbing of leaked process gas from gas panels.
A conventional processing system includes a processing chamber, sources of processing gases and a gas panel to control the flow of the processing gases from the sources to the processing chamber. One of the common uses of the gas panels is in the fabrication facilities. Gas panels are equipped with Mass flow controllers (MFC) and air operated valves and their arrangement is dependent on a particular application. An MFC is used to measure and control the flow of gases or fluids on the gas panels. This is further explained with the help of FIG. 1 for a conventional gas panel.
FIG. 1 illustrates an example arrangement for a conventional gas panel.
As illustrated in the figure, conventional gas panel 100 includes a plurality of MFC 102, a plurality of gas valves 104, and an exhaust system 106.
Each of MFC 102 receives a gas supply from a gas source via a respective gas supply line 108. A gas source may provide a gas or, more generally speaking, a fluid. Each gas supply line may carry a different respective gas or a fluid to a respective MFC 102. Each MFC 102 is designed and calibrated to control the flow of its received gas. In the example arrangement of FIG. 1, seventeen MFCs are arranged to receive seventeen different gas supplies from gas sources via inlet valves (not shown). Out of the different gases feeding in to gas panel 100, some may be process gases or compressed dry air (CDA) or inert gases as required by a particular application.
Each MFC 102, as shown by gas supply lines 110, feeds a respective gas valve. Each gas valve 104 can be an on/off valve or a controllable valve in order to control the flow of gas through it. Gas valve 104 further supplies gas to a process chamber (not shown) via supply lines 112.
Exhaust system 106 is used to extract any trapped gases within gas panel 100 via an outlet 114. Scrubber exhaust is an example, where unwanted gases are removed from the exhaust streams.
Some of the processing gases going in to MFC 102 via gas supply lines 108 are hazardous, e.g., flammable and/or poisonous. If any of the processing gases leak within gas panel 100, such as a result of a break in a processing gas line break, the leaked processing gas may pool within gas panel 100. The pooled processing gas creates a hazardous situation. This is further explained with the help of FIG. 2.
FIG. 2 illustrates a broken gas supply line between a MFC and a gas valve.
FIG. 2 illustrates a processing gas 206 being fed to a MFC 202. A gas supply line 208 between MFC 202 and a gas valve 204 is broken, resulting in a leaked gas 212. In one embodiment, MFC 202 and gas valve 204 are part of gas panel 100. In this example, leaked gas 212 gets pooled in gas panel 100, which must be removed. There may be dead space within gas panel 100, which may cause a hazardous situation. A dead space is a space within gas panel 100 in which there is little or no movement of the gas, e.g., no air current. Accordingly, leaked gas 212 may pool in such dead space.
Exhaust system 106 helps to extract gases from within gas panel 100 to address the leaked processing gases in gas panel 100. This is further explained with the help of FIG. 3.
FIG. 3 illustrates a conventional gas panel 300 with a broken processing gas line 208.
Conventional gas panel 300 includes all the components of conventional gas panel 100 except MFC 202 and gas valve 204. As illustrated in the figure, gas supply line 208 between MFC 202 and gas valve 204 is broken, resulting in leaked gas 212. Leaked gas 212 is trapped in dead zones within gas panel 300 as indicated by dotted lines. Gas panel 300 may include a mechanism to indicate the presence of unwanted gases inside gas panel 300. The amount of leaked gas 212 is concentrated in some pockets within gas panel 300, which may be more than the minimum allowable amount as per the safety requirements. Some of the processing gases are toxic and flammable; therefore, leaked gas 212 must be removed to avoid a hazardous situation.
Conventional gas panel 300 uses exhaust system 106 to extract gases from within gas panel 300. In many cases, exhaust system 106 may run continuously at its full capacity, and still be unable to remove the leaked gases pooled inside gas panel 300. In other words, in some instances exhaust system 106 does not work efficiently in performing its intended operation, whereas in other instances, exhaust system 106 does not perform its intended operation.
In case the amount of toxic gases within gas panel 300 is more than the minimum allowable amount, the conventional systems may increase the exhaust and scrubber to take care of the leaked gases. However, these conventional systems are not efficient at scrubbing leaked processing gas 212 from gas panel 300.
Additionally, scrubber exhaust from the gas panels adds to higher facilitation cost and power consumption. Most of the fabrication facilities, where the gas panels are used, are constantly requiring lowering the cost of operation, facilitation cost, power consumption, and building capital expenses. In addition, human safety shall be improved by minimizing the potential risk of ignition.
What is needed is an efficient system and method for scrubbing leaked processing gas from a gas panel.

System and method for decreasing scrubber exhaust from gas delivery panels


In the top face of a piston (6), there is formed a cavity (30) having a bottom surface (32) which slopes downward toward an exhaust side and which includes a raised part (32a) extending from near the center of the bottom surface to an intake-side wall surface. The cavity guides fuel spray (15) which has been injected by an injector (12) and passed by an electrode part (14a) of a spark plug (14), to arrive near the electrode part of the spark plug again in the form of an air-fuel mixture (15a).

1. Field of the Invention
This invention relates to a direct-injection spark-ignition internal combustion engine, and specifically, a technique for forming an air-fuel mixture.
2. Description of the Related Art
In respect of a direct-injection spark-ignition internal combustion engine in which fuel is injected directly into a combustion chamber, there is known a technique called spray guide method, in which an injector is fitted to an upper wall of the combustion chamber, in a central area thereof, and a spark plug is arranged with its electrode part located within or near a fuel injection area, so that stratified charge combustion can be carried out by directly igniting fuel spray formed from fuel injected by the injector and vaporized in part.
In such stratified charge lean combustion by the spray guide method, ignition is carried out during fuel injection period, so that combustion begins during the compression stroke in which fuel is injected. When combustion begins during or directly after fuel injection like this, an excessively rich air-fuel mixture is formed locally within the fuel spray, and such excessively rich air-fuel mixture burns at high temperatures and produces an increased amount of NOx.
Further, in the spray guide method, fuel spray gradually moves away from the spark plug, and flames generated by ignition by the spark plug spread within the combustion chamber in a manner following the movement of the fuel spray. Thus, combustion progresses relatively slowly. When combustion progresses slowly like this, the allowable limit of exhaust gas introduction quantity in EGR lowers, which makes the reduction of NOx difficult.
Slowly progressing combustion also causes a problem such that when the vaporization of fuel progresses so that the air-fuel mixture diffuses excessively, flames cannot keep up with the movement of the air-fuel mixture and vanishes so that unburned HC is emitted.
Particularly in the stratified charge combustion in low-load operation, fuel injection quantity is small and therefore injection period is short, so that the period of time in which ignition can be carried out by the spray guide method is short. Thus, there is a problem that in low-load operation, stable combustion region is narrow and stability of combustion is not sufficient.
Thus, in order to carry out stratified charge combustion stably in the direct-injection spark-ignition internal combustion engine, a technique has been developed, in which intake air flowing in through an intake port is caused to rise as tumbling flow by a cavity formed in the top face of a piston, and fuel is injected toward the side to which the tumbling flow rises (Japanese Unexamined Patent Publication No. Hei 11-210472).
In the technique disclosed in the above publication, however, the tumbling flow formed from the intake air is relatively weak. Thus, actually, it is difficult to guide the fuel spray by means of such tumbling flow, thereby stabilizing the stratified charge combustion.

Direct-injection spark-ignition internal combustion engine

Mitsubishi Jidosha Kogyo Kabushiki Kaisha


A pressure transducer includes a base ply, a resistance ply disposed on the base ply and at least two spaced apart contacts juxtaposed in relation to the resistance ply whereby at least one of the contacts may be pressed against the surface of the resistance ply. The resistance ply is made by spraying or silk screening a mixture of resin resistive to electrical conduction and a conductive particulate and then curing the composition to form a thin resistance ply having a surface with a multiplicity of micro-protrusions formed by the conductive particulate. The ratio of conductive particulate to resin is such that the mean distance between microprotrusions is greater than about five time the size of the conductive particles. The particles are in the range of about 0.5 to 10 microns and the resin layer is about is 0.4 to 0.8 microns thick.

The present invention relates to pressure transducers and compositions for making pressure transducers and in particular to transducers having a variable resistance layer made from a composition of conductive particulate intermixed with a continuous matrix resistive resin which is applied in a thin layer to a surface and thereafter cured to form the resistance layer.
Pressure responsive transducers are known. For example, U.S. Pat. No. 3,806,471 to Mitchell describes a typical pressure transducer wherein conduction paths through a volume of a thick compressible layer would be increased thereby decreasing the resistance through the layer in response to application of an external force. These volume type pressure transducers are subject to many disadvantages including the size of the transducer and the relatively rapid degeneration in performance with time and use.
An improved pressure transducer relying on variable contacts across the surface of a thin layer is disclosed in Eventoff U.S. Pat. Nos. 4,489,302 and 4,314,227. However, the Eventoff patents taught that the particulate was an insulative or semiconductor particulate which was believed necessary to insure there would be a resistance across the layer and that the resistance would vary in response to pressure. As such, the Eventoff patents taught away from the use of a conductive particulate. However, it has been discovered that a conductive particulate such as iron spheres or germanium can be used to form an effective pressure transducer when the particulate size and spacing in the resistive resin layer is selected, relative to the thickness of the resin layer, to be within certain ranges.
Accordingly, the pressure transducer of the present invention is made by applying a composition comprising a mixture of a resistive resin and a conductive particulate such as iron spheres or germanium. The resistive resin may be a carbon filled resin which conducts but has a resistance to conductance. The composition is disposed on a base ply to form a resistance layer where the mean spacing between conductive particles creating microprotrusion across the surface of the resistance layer, is greater than about five times the diameter of the particulate and the particle diameter is about 1.3 to three times the thickness of the resultant layer of resistive resin.
The present invention results in a pressure transducer which has stable, predictable performance characteristics largely independent of manufacturing conditions and subsequent environmental changes permitting a significant reduction in the cost of manufacture and an cost effective means of meeting customer tolerances and specifications.


Full automatic washing machine, and method for controlling the same, the fall automatic washing machine including a spinning tub 2 movably fitted in an outer tub 1, a pulsator 3 rotatably fitted in the spinning tub 2 to be rotatable independent from the spinning tub 2, a spinning shaft 5 rotatably supported on a shaft bearing case 20 for transmission of a rotating power to the spinning tub 2, a washing shaft 4 for transmission of the rotating power to the pulsator 3, a BLDC motor 7 having a rotor 7b and a stator 7a for rotating the rotor 7b as power is applied to the stator 7a, and a clutch mechanism for switching a power transmission path of the BLDC motor 7 either to the washing shaft 4 or to the spinning shaft 5 in correspondence to a washing cycle, or a spinning cycle, thereby permitting noiseless, and stable switching of the rotation power within a short time when the rotating power is transmitted to the pulsator or the spinning tub from a driving-part having the stator and the rotor.

The washing machine, in general removing various dirt stuck to clothes, beddings, and the like by using softening action of detergent, friction caused by water circulation coming from rotation of the pulsator, and impact given to laundry by the pulsator, carries out washing after sensing amount and kind of the laundry by sensors, to make automatic setting of a washing method, and supplying water to proper level according to the amount and kind of the laundry.
In related art methods for driving a full automatic washing machine, there are a method in which a rotating power of a driving motor is transmitted either to a washing shaft, or a spinning shaft by putting a power transmission belt, a pulley, and the like in between, for rotating either the pulsator, or the spinning tub, and a method in which a washing and spinning tub is rotated at speeds different from each other in washing and spinning by means of speed control of a BLDC motor (Brushless DC motor).
In the meantime, recently a structure makes an appearance, in which, though the BLDC motor is employed, power transmission paths are controlled to be different in washing and spinning, such that the pulsator is rotated slowly in washing, and the pulsator and the spinning tub are rotated at a high speed simultaneously in spinning, an example of which is disclosed in Japanese Laid Open Patent No. H11-347289.
However, the type disclosed in Japanese Laid Open Patent No. H11-347289 shows an unstable operation, and produces much noise during tooth engagement of the driving mechanism, since a tooth engagement clutch mechanism is put into operation by a solenoid.

This patent is subject to a terminal disclaimer.

Full automatic washing machine and method for controlling the same


Disclosed herein is a modular cluster lighting fixture having a plurality of lamp supports for mounting lamps connected to each other by a plurality spacers. The lighting fixture can be suspended by a plurality of tubular hangers connected to the lamp supports and in which pairs of electrical conductors are disposed for supplying energy to the lamps. Preferably, each lamp support includes a two-piece clamp body and two tubular support arms. The clamp bodies mount the support arms at one or more sides and are clamped around ends of the spacers. The clamp bodies have an opening at a top side for receiving an end of a hanger, preferably at a pivotal connection.

Not applicable
Not applicable
The present invention relates to lighting fixtures and in particular to a modular lighting fixture that can be assembled in various configurations.
Home and work spaces typically have some type of fixture for mounting one or more light bulbs, be it incandescent, flourescent or otherwise. Lighting fixtures that suspend light bulbs from a ceiling or wall must include a means for running the electric conductors from the electric wiring of the building to the light bulbs. It is usually desired to conceal the electrical conductors for aesthetic reasons. This is particularly true for cluster lighting fixtures having numerous light bulbs, and thus multiple electrical lines.
Lighting fixtures have been developed that have hollow hangers acting as conduit for the electrical conductors. An example of such a lighting fixture is given in U.S. Pat. No. 1,680,094 which defines a spoked fixture with lamps fixed at the ends of the spokes.
This fixture and other conventional cluster lighting fixtures do not provide the flexibility to change the number or position of the light bulbs because the light bulbs typically branch from a center base or circular (or otherwise) banding. For users wishing a different number or position of lights, suppliers must inventory a wide variety of different structures.
Some modular lighting fixtures have been developed with separate spacer components that can be connected in various orientations to change the configuration of the lighting fixture as well as increase or decrease the number of lamps. An example of such a lighting fixture is given in U.S. Pat. No. 5,329,434.
Existing cluster lighting fixtures, however, typically require time consuming rewiring or reconstruction when changing the configuration of the fixture or when adding or removing one or more lamps to the fixture.
Accordingly, an improved modular cluster lighting fixture is desired.
The present invention provides an improved cluster lighting fixture comprised of modular components allowing for the overall configuration of the lighting fixture to be changed readily.
In particular, the present invention provides a lighting fixture suspended from above by a hanger and having a plurality of lamps supported by a plurality of lamp supports. Two of the lamp supports are joined together removably by a spacer structure. Electrical wiring extends along the hanger through the lamp supports and to the lamps.
In a preferred form, each lamp support includes a clamp body and two tubular support arms. Each clamp body includes inner and outer parts that clamp around ends of the spacers, which can be tubular or solid and arcuate or rectilinear. The inner and outer parts have an opening at a top side for receiving an end of a hanger and one or more of the parts have openings for receiving the ends of the support arm. Mounting brackets fastened to the inside of the clamp body engage and hold the spacers to the clamp body. Pairs of electrical conductors for the lamps can run through the hangers and in between the inner and outer parts of the clamp bodies. Other pairs of conductors run through the support arms from the clamp bodies to the lamps.
In another preferred form, the lighting fixture includes plurality of lamps and a lamp support, suspended by a hanger, for supporting the lamps. The lamp support has a clamp body and support arm structures removably extending from opposite sides of the clamp body to support lamps on opposite sides of the clamp body.
In another preferred form, the hangers connect to the clamp bodies at pivotal connections.
In yet another preferred form, one or more of the plurality of lamp supports includes two or more support arms extending from opposite sides of the clamp bodies. In such lamp supports, both the inner and outer parts have one or more openings for receiving support arms.
In still another preferred form, the spacers and the lamp supports are connected to form a closed path, such as a circle, triangle, oval, square or rectangle. In this case, a correspondingly shaped lens can be placed onto the lighting fixture within the closed path. Alternatively, the lighting fixture can form an open-ended path, such as an a wavy or S-curve configuration.
Thus, the present invention provides a lighting fixture that can be easily assembled into various configurations and to have any number or configuration of lamps. This is accomplished by connecting the suspension elements and the lamps to lamp supports, thereby allowing the spacers to be of any configuration and the lamps to be added to or removed from the lamp supports as desired.
Another object and advantage of the lamp fixture is that it can be suspended from an angled surface, such as a sloped ceiling. This allows the fixture to be mounted in more spaces where light is required. This is accomplished by the pivotal connection of the hangers to the clamp bodies. The pivotal connection also allows the fixture to sway slightly if moved, thereby absorbing some of the energy from an impact or shift in the supporting structure, as in the event of an earthquake.
The foregoing and other advantages of the invention will appear from the following description. In that description reference is made to the accompanying drawings which form a part hereof and in which there is shown by way of illustration preferred embodiments of the invention. These embodiments do not represent the full scope of the invention. Thus, the claims should be looked to in order to judge the full scope of the invention.


An apparatus and method for a diaphragm valve includes a valve body having a chamber in fluid communication with a first channel and a second channel. A diaphragm is disposed in the chamber, and a tapered seat member is at least partially disposed in the first channel. A sleeve is compressively disposed in the seat member between the seat member and the first channel to maintain a fluid tight seal between the seat member and the first channel. A valve member is movable to controllably urge the diaphragm into and out of engagement with the seat member to control flow of fluid between the first the first and second channel.

Valves are widely used to provide precision flow and/or pressure control of fluids. Diaphragm valves are preferred in many applications due to the valve member being directed into and out of contact with a diaphragm, which likewise directs a valve seat into and out of engagement with the diaphragm to effect the desired fluid flow/pressure control. Other attributes diaphragm valves have are low internal volume, high sealing integrity, compact size and fast actuation/operation.
After being subjected to operational use, especially involving caustic or abrasive fluids and/or particulates or condensates, valve components, notably the valve seats, become worn or damaged so that the valve can no longer function properly. One solution is to replace the entire valve, which requires disconnecting the old valve from the connections of the using application or system, and then re-establishing those system connections. In addition to the cost of the replacement valve, care must be taken to ensure the system connections to the replacement valve do not leak.
In an attempt to address this problem, replacement valve seats have been developed. For example, U.S. Pat. No. 4,715,578 to Seltzer discloses a valve seat member composed of a synthetic resin that is threadedly engaged with the valve body, including an O-ring disposed between the valve seat member and the valve body. However, for reasons including the difference in thermal coefficients of expansion/contraction between the non-metallic valve seat member and the metallic valve body, the valve seat member is susceptible to working loose from the valve body.
Another valve construction is U.S. Pat. No. 6,854,713 to Lin et al., that discloses a valve body having a cylindrical opening formed in a flow channel for receiving a cylindrical non-metal valve base. The opening includes a groove formed in the valve body. Once the cylindrical non-metal valve base has been inserted into the cylindrical opening in the valve body, a tapered ring is directed into the inside diameter of the cylindrical non-metal valve base. Flanges extending outwardly from the ring further compress the valve base between the ring and the valve body, with the groove formed in the valve body opening sized to receive a portion of the valve base, due to expansion of the valve base. However, while being configured to address valve base expansion, U.S. Pat. No. 6,854,713 is not directed to a replaceable valve base. Moreover, the process of press-fitting the tightly fitting ring inside the valve base will necessarily deform the surface of the valve base contacting the diaphragm, which will compromise the quality of the seal between the valve base and the diaphragm. Finally, due to a portion of the valve base flowing into the groove in the opening securing the valve base within the valve body as it is deformed, it is unlikely that the valve base can be removed without damaging the valve body, which would necessitate replacement of the entire valve.
What is needed is an improved valve construction that permits replacement of the valve seat without damaging the valve body, which replacement can be accomplished with a manual hand tool.

Removable valve seat member for diaphragm valve

Circor Instrumentation Technologies, Inc.


A system and method of injecting a chemical into a high pressure process stream without pumps or other active components. The system utilizes the differential pressure created by resistive losses of downstream components within a high pressure process stream. A bypass side stream is taken from an upstream pressure location and returned to the downstream side of the resistive inline process component. The chemical solution vessel is pressurized by the higher side of the pressure differential. The solution then passes through a flow controlling capillary tube exiting on the lower pressure differential side into the bypass stream. The high flow rate chemically diluted bypass stream then returns to the process stream at the lower differential process stream tie-in. The chemical solution is isolated from the process water pressuring the vessel by a movable separating device preventing mixing of the two fluids. The vessel can also be pressurized by gas.

In various industries such as the power generation industry, there is a need to inject chemical solutions into flowing process streams at elevated pressures and temperatures for various purposes. In particular, it is necessary to inject solutions of noble metal containing chemicals, such as Na2Pt(OH)6, into the feedwater piping of boiling water nuclear reactors to aid in inhibiting intergranular stress corrosion cracking of susceptible structural materials in the reactor vessel in the presence of hydrogen.
As reported by Hettiarachchi and Diaz, the noble metal chemical solution Na2Pt(OH)6 is added to the feedwater piping of boiling water nuclear reactors over a 10 day period. Such 10 day injection periods are repeated during each subsequent yearly fuel cycle. For boiling water nuclear reactors with longer fuel cycles, the 10 day applications are conducted on an annual basis. The total mass of noble metal injected annually is also limited to a fixed value by an industry consensus standard described by Garcia et al. Because of a phenomenon known as "crack flanking", described by Andresen and Kim, it is advantageous to inject the noble metal chemical over the entire operating period of a fuel cycle, not just during an annual 10 day period. Active metering pumps used for these 10 day injections, such as positive displacement pumps, have experienced maintenance problems due to interaction with the noble metal chemicals such as Na2Pt(OH)6 and are not optimum for long term injection.
A boiling water nuclear reactor that follows the industry consensus recommendation will typically add between 200 and 1, 200 gm of Pt (as Na2Pt(OH)6) each calendar year, depending on plant specific features such as fuel surface area and power rating. If the addition is made continuously at a constant rate over 365 days, the addition rate will vary between 3.8×10−4 and 2.3×10−3 gm (Pt)/min. If the feedstock is a 1% solution of Na2Pt(OH)6, the addition rate will be between 0.038 and 0.23 ml/minute (cc/m). The resulting concentration of Pt in the feedwater would be on the order of 10 parts per trillion. Accordingly, there has been a need in the nuclear industry for a chemical injection system that does not employ active pumps and is capable of adding small, metered amounts of noble metal chemicals, such as Na2Pt(OH)6, into the feedwater during the entire fuel cycle.
U.S. Pat. No. 8,054,933 (Tran et al) describes a method of injecting chemicals into flowing nuclear reactor water streams teaching the use of positive displacement pumps, a process computer, various valves, chemical storage tanks, weighing scales and a source of deionized water. While this system is useful in injecting chemicals over short periods of time, it is quite complicated and not necessarily suited for trouble free injection of dilute solutions over longer periods of time.
U.S. Pat. No. 2,266,981 (Miller) discloses a method and apparatus for injecting chemicals into a natural gas pipeline operating at elevated pressures that does not use a pump. The apparatus teaches a fluid supply for storing the chemical to be injected, a pressure feed tank for pressurizing and injecting the chemical into the pipeline and a series of lines, manual valves and gauges for controlling the flow of chemicals from the supply tank into the feed tank and ultimately into the pipeline using gravity. The natural gas line pressurizes the pressure feed tank to the same pressure as the gas in the pipeline and gravity allows the solution in the pressurized tank to flow into the gas pipeline. This arrangement would not work in adding low flow rates of chemicals into a flowing water filed pipe; as the pressurizing gas above the liquid in the feed tank would eventually become saturated. Degassing of the feed solution within the flow restrictor (valve, capillary) would occur and alter the rate of injection precision. An active flow rate control is required to maintain a constant injection rate as the change in height of the feed solution drains the tank. U.S. Pat. No. 6,779,548 (McKeary) teaches a similar method as U.S. Pat. No. 2,266,981 (Miller) but adds a system for automatically controlling the quantity of chemical injected into a pressurized gas system by employing two tanks, one pressurized and one not pressurized. While this system could work well adding liquid to a gas process stream, it will not control a liquid addition to a liquid stream to the accuracy and precision required for very low flow rates required in Pt injection nuclear applications. Similar problems will occur as with U.S. Pat. No. 2,266,981 (Miller)
All injection patents researched for this application have some sort of active displacement component, do not account for dilution of the primary injection solution, have cover gas pressurization (that saturate the chemical injection solution), have active flow controls, or cannot yield very low flow rates (sub ccm) continuously over very long periods (months-year) without intervention.

Passive injection of a chemical solution into a process stream


A gas turbine arrangement with heat accumulation segments (3) which are arranged, opposite moving blades, on a casing of the gas turbine, and with guide vanes (1) which are arranged adjacently to the heat accumulation segments (3) over the circumference between the casing of the gas turbine and the rotor, the moving blades and the guide vanes (1) being arranged in a hot-gas duct (5) of the gas turbine. At least one sealing element (4) arranged over the circumference is present between the guide vanes (1) and the heat accumulation segments (3) and can be separated from the hot-gas duct (5) by means of a protective shield (6).

1. Field of the Invention
The invention relates to a gas turbine arrangement with a heat protection shield and with an adjacent guide vane.
2. Brief Description of the Related Art
Numerous gas turbine arrangements are known from the prior art. U.S. Pat. Nos. 3,807,891, 3,995,971, 4,384,822, 4,512,712, 4,792,277, 4,863,343, 4,869,640, 4,902,198, 4,930,980, 5,158,430 5,238,364, 5,380,155, 5,429,478 disclose arrangements of this type.
In various arrangements, the guide vanes are connected directly to the adjacent heat accumulation segments, as disclosed, for example, in FIG. 1 of U.S. Pat. Nos. 4,384,822, 4,863,343, and 4,930,980 or in FIG. 2 of U.S. Pat. No. 5,429,478.
Problems arise, in general, in arrangements in which a gap occurs between the guide vanes and the adjacent heat accumulation segments, said gap allowing the hot gases to penetrate and consequently making it possible for the parts involved to be damaged. This is known, for example, from FIG. 1 of U.S. Pat. No. 4,902,198.


The present invention is directed to a nucleic acid encoding a lepidopteran glutamate-gated chloride channel. Vectors and host cells comprising the nucleic acid are also provided. A method of identifying agents that modulate the activity of a lepidopteran glutamate-gated chloride channel is also provided. Such agents are useful as insecticides.

Glutamate-gated chloride channels are a family of ligand-gated chloride channels unique to invertebrates. Glutamate-gated chloride channels have been cloned from Caenorhabditis elegans (Cully et al. (1994) Nature 20:371; U.S. Pat. No. 5,527,703), Drosophila melanogaster (Cully et al. (1996) J. Biol. Chem. 271:20187 and U.S. Pat. No. 5,693,492), Haemonchus contortus (Delany et al. (1998) Mol. Biochem. Parasit. 97:177), Lucilia cuprina (GenBank Accession No. AAC31949) and Schistocerca americana (Cohen et al. (1999) 29th Annual Neuroscience Meeting, p. 199). The clones isolated from C. elegans, D. melanogaster and S. americana have been functionally expressed in Xenopus oocytes, and shown to be activated by glutamate and avermectin. (Arena et al. (1991) Molecular Pharm. 40:368; Arena et al. (1992) Molecular Brain Research 15:339; U.S. Pat. No. 5,693,492; U.S. Pat. No. 5,527,703; Cohen et al., supra).
Because glutamate-gated chloride channels are specific to invertebrates, the channels provide a target for insecticides. In particular, the glutamate-gated chloride channels are the target of the avermectin class of insecticides. Avermectins are naturally occurring and synthetic macrocylic lactones that are widely used in the treatment of parasites and insects.
Insects of the order lepidoptera are significant pests, and in particular the larvae are destructive defoliaters. Further, lepidopteran pests are typically harder to control than diptera. Accordingly, there is a need to identify and develop safe and specific insecticides against lepidopteran pests. The present invention addresses this need by providing isolated nucleic acids encoding a lepidopteran glutamate-gated chloride channel, recombinant lepidopteran glutamate-gated chloride channels, and a method of identifying agents that modulate the activity of the channel.


The present disclosure relates to a Doppler shift compensation scheme applicable in a high mobility communication system. In some examples, a Doppler shift compensation apparatus may include an angle measuring unit configured to measure Angle Of Arrival (AOA) information of a User Equipment (UE); a velocity calculating unit configured to calculate a velocity information of the UE based on the measured AOA information; a frequency shift estimating unit configured to estimate Doppler shift of the UE based on the measured AOA information and the calculated velocity of the UE; a frequency shift compensation triggering unit configured to trigger Doppler frequency shift compensation based on the estimated Doppler shift of the UE; and a frequency shift compensating unit configured to perform the Doppler frequency shift compensation based on a trigger instruction from the frequency shift compensation triggering unit. Doppler shift compensation methods are also described in some other examples of the present disclosure.

LTE and LTE-A aim at addressing the increasing requirements for broad band services in high user density areas while maintaining good performance in extreme channel condition such as high mobility of high speed trains. Scale and speed of High-Speed Rail/Highway (HSR/HSH) are rising continually. The top operation speed of HSR even reaches 380 km/h.
Increasing of speed will result in decreasing communication quality of passengers. Effect of Doppler is obvious and Doppler shift produces a greater negative impact on quality of mobile communication traffic in HSR/HSH. Therefore, communication operators and equipment manufacturers are anxious to resolve related issues. Users have great potential requirements in the scenario. And mobile communication coverage has its specified characters in HSR/HSH comparing with that of other scenarios.                (1) Nowadays most of LTE and LTE-A Base Stations (BS) are deployed at high frequencies (e.g., 2.6 GHz) which results in higher Doppler shift than that of low frequencies (e.g., 700 MHz).        (2) Variety of Doppler shift is not frequency linearity. It depends on not only the speed of UE but also the angle between moving direction of UE and BS.        (3) UE goes through a cell in a very short time, which results in the frequentness of Doppler shift are changed quickly. That will increase frequency shift, Block Error Rate (BLER), etc.
In radio access network, there are a lot of standards (2G/3G) consider the effect of Doppler, especially for LTE and LET-A (4G). LTE and LTE-A adopt OFDM requiring carries orthogonal. Restraining Inter-Cell Interference (ICI), estimating and compensating frequency shift are vital technologies. Therefore issues of Doppler shift are important for mobile communication system.
Standards [1] [2] [3] of 3GPP special describe propagation conditions of high speed train scenario. They show the simulation results of Doppler shift trajectory. However they just suppose the velocity is uniform and doesn't propose any methods to overcome Doppler shift.

Doppler shift compensation apparatus and method


Holographic storage mediums, methods for producing the storage medium, methods for storing data in the holographic storage medium, and optical storage reading methods are described herein. The holographic storage medium can be formed from a composition comprising a thermally crosslinked polysiloxane binder; a photoactive material; and a photo-initiator, wherein the photoactive material has a concentration that remains about the same before and after a thermal cure process to form the thermally crosslinked polysiloxane binder.

The present disclosure relates to optical data storage media, and more particularly, to holographic storage mediums as well as methods of making and using the same.
Holographic storage is data storage of holograms, which are images of three dimensional interference patterns created by the intersection of two beams of light, in a photosensitive medium. The superposition of a reference beam and a signal beam, containing digitally encoded data, forms an interference pattern within the volume of the medium resulting in a chemical reaction that changes or modulates the refractive index of the medium. This modulation serves to record as the hologram both the intensity and phase information from the signal. The hologram can later be retrieved by exposing the storage medium to the reference beam alone, which interacts with the stored holographic data to generate a reconstructed signal beam proportional to the initial signal beam used to store the holographic image.
Each hologram may contain anywhere from one to 1×106 or more bits of data. One distinct advantage of holographic storage over surface-based storage formats, including CDs or DVDs, is that a large number of holograms may be stored in an overlapping manner in the same volume of the photosensitive medium using a multiplexing technique, such as by varying the signal and/or reference beam angle, wavelength, or medium position. However, a major impediment towards the realization of holographic storage as a viable technique has been the development of a reliable and economically feasible storage medium.
Early holographic storage media employed inorganic photorefractive crystals, such as doped or undoped lithium niobate (LiNbO3), in which incident light creates refractive index changes. These index changes are due to the photo-induced creation and subsequent trapping of electrons leading to an induced internal electric field that ultimately modifies the index through a linear electro-optic effect. However, LiNbO3 is expensive, exhibits relatively poor efficiency, and requires thick crystals to observe any significant index changes.
More recent work has led to the development of polymers that can sustain larger refractive index changes owing to optically induced polymerization processes. These materials, which are referred to as photopolymers, have significantly improved optical sensitivity and efficiency relative to LiNbO3 and its variants. In prior art processes, "single-chemistry" systems have been employed, wherein the media comprise a homogeneous mixture of at least one photoactive polymerizable liquid monomer or oligomer, an initiator, an inert polymeric filler, and optionally a sensitizer. Since it initially has a large fraction of the mixture in monomeric or oligomeric form, the medium may have a gel-like consistency that necessitates an ultraviolet (UV) curing step to provide form and stability. Unfortunately, the UV curing step may consume a large portion of the photoactive monomer or oligomer, leaving significantly less photoactive monomer or oligomer available for data storage. Furthermore, even under highly controlled curing conditions, the UV curing step may often result in variable degrees of polymerization and, consequently, poor uniformity among media samples.
Other prior examples of holographic recording media are based on "two-chemistry" systems, wherein a binder or material that provides the medium with form and stability, is different from the photoactive component. These systems comprise a mixture of at least one photoactive polymerizable liquid monomer or oligomer, an initiator, at least one precursor (i.e., monomers or oligomers) to the binder polymer, and optionally a sensitizer. These mixtures also initially have a gel-like consistency until the precursors to the binder polymer are partially cured to provide form and stability to the medium. Problems similar to those described for single-chemistry systems may occur during the UV binder cure step. The medium, prior to data storage, has a uniform refractive index based on the weight fraction of each component and their individual refractive indices. Polymerization of the photoactive monomers (or oligomers) leads to the formation of a polymer that has a refractive index different from that of the binder. Photoactive monomer molecules diffuse into the region of polymerization, while binder material diffuses out because it does not participate in the polymerization. Spatial separation of the photopolymer, formed from the monomer, and the binder provides the refractive index modulation required to form a hologram. While better results are obtained using these two-chemistry systems, the possibility exists for reaction between the precursors to the binder polymer and the photoactive monomer. Such reaction would reduce the refractive index contrast between the binder and the polymerized photoactive monomer, thereby affecting any stored holograms. Furthermore, two-chemistry systems may also be plagued by changes in dimension owing to shrinkage induced by polymerization of the photoactive monomers during data recording.
Thus, there remains a need for improved polymer systems suitable for holographic data storage media. It would be advantageous if the binder curing step, which provides stability and form to the media, did not reduce the amount of photoactive material available for data storage. It would be further advantageous if the curing step resulted in consistent levels of binder polymerization between media samples, the possibility for reaction between the binder and the photoactive material were diminished, and dimensional changes during data recording were eliminated.


A switching device of the type that can be placed between electric outlet and a load and is provided with a switch and electronic circuits including a programmable control device in order to close and break the circuit according to predetermined conditions. This is not provided with any external mechanical or electromechanical means for setting, and the conditions for switching and time adjustment are fixedly built in or programmed. In one embodiment moreover functions for switching and time setting are controlled by an optic or acoustic sensor connected to the control device. Hereby, a compact structure and a simple but reliable function is obtained.

1. Field of the Invention
The present invention refers to a new structure and function of switching devices of the type that can be placed between an electrical outlet and a load in order to close and/or break the circuit between the outlet and the load at defined times or after occurrence of predetermined conditions.
2. Description of the Background Art
Switching timers for connection in a wall outlet or with a socket for a plug are well known. These are however cumbersome, mostly because they are provided with devices for setting of times for connection and disconnection. Electro mechanical switching timers are commonly constituted by a ring with tabs or other actuation devices which actuate a switch at times corresponding to the position of the tabs or actuation devices. In electronic switching timers, the actuation devices generally correspond to different function keys and a display.

Program controlled switching device insertable into a power supply outlet


A communication system for rock climbing and other activities is provided. The communication system comprises a first communication device having a first front surface. A first faceplate is mounted on the first front surface of the first communication device with the first faceplate preferably having three columns. A plurality of depressible status command buttons are mounted on the first front surface of the first communication device outside the first faceplate. A plurality of depressible action command buttons are mounted on the first front surface of the first communication device outside the first faceplate. A depressible variable command button is mounted on the first front surface of the first communication device outside the first faceplate. A depressible confirmation button is mounted on the first front surface of the communication device outside the columns.

1. Field of the Invention
This invention relates generally to a communication device for rock climbing and other activities and, more particularly, the invention relates to a communication device for rock climbing and other activities used to make rock climbing and other similar activities safer by improving the methods in which climbing partners communicate and a variety of activities where voice free, single hand operated communication is desired.
2. Description of the Prior Art
Climbing is a unique, exciting, and challenging endeavor. However, even in the best of conditions, numerous variables exist which result in an inherent risk of serious injury or even death. The goal of any climber, novice or experienced, is to minimize the number of uncontrollable variables by planning for as many different aspects of an outing before departure including bringing the correct amount of food, water, gear, etc. Whether consciously or unconsciously, all successful climbers do this process of preemptive planning in order to both increase the chance of success and decrease the possibility of serious injury.
One such aspect of an outing that has not yet been adequately identified is that of communication. Communication not only has the potential to affect the success of the climb, but also the safety of both climbers. Most experienced rock climbers that use ropes will agree that when separated by as short of a distance as one rope length, the ability to communicate with your partner drops to nearly zero. While verbal communications may work in some situations, the commonly used method of communication between climbing partners is accomplished primarily by tugging on the rope.
Unfortunately, tugging on the rope is an extremely unreliable and difficult to interpret method of communication. Was that two tugs or three tugs? Did four tugs mean belay on or belay off? Do they need slack? Was that one long tug or two short tugs? These questions can never be answered with certainty solely from the tug of a rope, and an incorrect interpretation could result in death.
The possibility of such a serious consequence due to lack of communication is something that should be unacceptable to the average climber. With today's technological advances in the communication industry, specifically in wireless communications and walkie-talkies, one must ask why climbers do not take advantage of these valuable resources. The answer is clear: no communication device has ever been specifically designed for the use of rock climbing and other similar climbing activities.
Accordingly, there exists a need for a communication device designed to meet the unique needs of a climber including, but not limited to, voice-free, single hand operation, operational ability while attached to a harness or gear sling, and durability designed to endure a variety of climbing environments.

Communication device for rock climbing and other activities


An equalization method receiving a received sample to generate an equalizer output. A channel profile is first provided, comprising a main path and a plurality of echoes distributed in time domain. Echoes anterior to the main path are precursors, and echoes posterior to the main path are postcursors. The received sample is filtered with a linear equalizer (LE) comprising a plurality of taps to generate an LE output. A slicer slices the equalizer output to generate a sliced sample. The sliced sample is further sent to a decision feedback equalizer (DFE) comprising a plurality of taps to generate a DFE output. Simultaneously, an equalizer span is determined based on the channel profile. The LE output and the DFE output are combined to generate the equalizer output having the equalizer span. The equalizer span is determined by allocating the position of main tap.

1. Field of the Invention
The invention relates to digital television system, and in particular, to decision feedback equalizers with adjustable equalizer span.
2. Description of the Related Art
FIG. 1 shows a conventional decision feedback equalizer. Received sample x(n) denotes a sampled symbol corresponding to time n. The linear equalizer (LE) 102 filters the received sample x(n) to generate part of the equalizer output y(n). A slicer 106 slices the equalizer output y(n) to generate a sliced sample d(n), and the decision feedback equalizer (DFE) 104 filters the sliced sample d(n) to contribute the equalizer output y(n) by an adder 108. The linear equalizer 102 and decision feedback equalizer 104 each comprises a delay line formed by a plurality of taps, and the received sample x(n) and sliced sample d(n) shifting in the delay lines are multiplied with coefficients to generate the equalizer output. The coefficients are also recursively updated by another algorithm such as the least-mean-square (LMS) algorithm. This architecture is typical and widely known, and detailed implementation varies with application.
FIG. 2 shows an equalizer span formed by linear equalizer taps and decision feedback equalizer taps. Each tap in the LE delay line 202 stores a sample value. The tap storing received sample x(n) is referred to as the main tap. Number of taps anterior to the main tap is LEL, and number of taps posterior to the main tap is LER. An equalizer output y(n) is the combination of the LE delay line 202 output and the DFE delay line 204 output, expressed as:
                              y                                (            n            )                          =                                            ∑                              k                =                                  -                  LEL                                            LER                                                                  f                k                                                          x                                                  (                                      n                    -                    k                                    )                                                              +                                    ∑                              k                =                1                            DFE                                                                  b                k                                                          d                                                  (                                      n                    -                    k                                    )                                                                                (        1        )
Where LEL is the number of taps anterior to the main tap, and DFE is the number of DFE delay line 204 taps. The LEL and DFE are predetermined numbers, and the equalizer span is equal to LEL+DFE+1. fk and bk are coefficients of the linear equalizer 102 and decision feedback equalizer 104, respectively.
Since the channel conditions are unpredictable, a predetermined main tap allocation scheme, which corresponds to a fixed equalizer span, may not always render good SNR results. Dynamic main tap allocation methods have been proposed. However, some methods require significant computation resources, making the hardware implementations unacceptable. Therefore a more efficient improvement is desirable.

Equalization method with adjustable equalizer span


Disclosed are 2-bromoaniline or 2-chloroaniline compounds of formula (I):

The indole nucleus is a prominent structure motif found in numerous natural products and pharmaceutically active compounds. Examples of substituted indoles used in the preparation of pharmaceutical agents and as pharmaceutical agents themselves include Indomethacin, an anti-inflammatory medicine, Tropesin, an anti-inflammatory and analgesic agent, Mebhydroline, antihistaminic agent and Vinpocetine, a vasodilator agent. Other examples of indole compounds used as pharmaceutical agents those disclosed in U.S. patent application Ser. No. 10/198,384 and U.S. provisional application 60/546,213, filed Feb. 20, 2004 the contents of which are incorporated herein by reference. Many methods have been developed to meet the need building indole structures, among which the Fisher indolization still remains the most commonly used technique in industry. See: Indoles; Sundberg, R. J., Ed.; Academic: London, 1996; Sundberg, R. J. Pyrroles and their Benzo Derivatives: Synthesis and Applications. In Comprehensive Heterocyclic Chemistry. Notwithstanding this plethora of methodologies, regioselective formation of indoles with substitution at positions other than C-5 has proved to be challenging. The recently developed palladium-catalyzed indolization method by Larock et al (Larock, R. C.; Yum, E. K. J. Am. Chem. Soc. 1991, 113, 6689; Larock, R. C.; Yum, E. K.; Refvik, M. D. J. Org. Chem. 1998, 63, 7652) has provided one approach to the aforementioned regioselectivity issue. Larock reported that the best results could be obtained by reacting substituted ortho-iodolines with an excess of a suitable internal alkyne sodium or potassium acetate or carbonate base plus 1 equivalent of either LiCl or n-Bu4NCl, and occasionally adding the ligand triphenylphosphine. Larock reported that this ligand was not essential for the palladium-catalyzed reaction. Larock also reported the use of triphenylphosphine as a ligand and did not find that it provided better indolization results.
This versatile "ligandless" heteroannulation of internal alkynes with 2-iodoanilines allows access to a variety of indoles which may not be readily available by conventional methods in terms of the degree of substitution and type of functionalization (eq. 1, Scheme 1). Replacing the iodoanilines with the corresponding 2-bromo or 2-chloro derivatives would be of significant practical and economical value from a cost and throughput perspective. However, Larock's protocol was not applicable to the indolization of acetylenes with 2-bromo or chloroanilines. The presence of iodide was postulated to have pronounced effect on the nature of the products in these alkyne insertion processes. (Larock, R. C.; Yum, E. K.; Refvik, M. D. J. Org. Chem. 1998, 63, 7652.) In addition, previous research on the reaction of ortho-palladation complexes with alkynes demonstrated the exclusive formation of multiple insertion products (eq. 2, Scheme 1). (Maassarani, F.; Pfeffer, M.; Borgne, G. L. Organometallics 1987, 6, 2029; (b) Maassarani, F.; Pfeffer, M.; Borgne, G. L., Organometallics 1987, 6, 2043; (c) Maassarani, F.; Pfeffer, M.; Spencer, J.; Wehman, E. J. Organomet. Chem. 1994, 466, 265.

There is a need in the art for conditions that are not substrate-specific and that could be used for performing palladium catalyzed indolizations on internal alkynes having a variety of substitutions at R2 and R3.

2-Bromoanaline and 2-chloroaniline compounds

Abstract: wherein R, R1 and X are as defined. The compounds are useful as intermediates for preparing indole compounds.


In a granulation process only a small proportion of the material being treated is at any time subjected to a wetting and collision followed by a very fast drying whereby harmful increase of moisture content in the powder is avoided. By the process the particles to be granulated are sprayed with granulation liquid, brought into mutual contact, and dried while influenced by a fast swirling- upward gas stream in a vertical pipe. The fast drying prevents excessive penetration of coating liquid into the interior of the particles.

The invention relates to granulation,. i.e. transforming particles into granules each comprising several particles.
Granulation of fine powder materials is applied within various industries. Granulation is used to transform a powder with poor free flowing capability into a product with proper free flowing capabilities. Another reason for granulation is to avoid that the final product has an unwanted dust emission.
In the pharmaceutical industry granulation is used mainly for treating materials to be pressed into tablets.
In the food industries, incl. the dairy industry, granulation is used, inter alia to improve dispersibility and reconstitutional properties.
In the chemical industry granulation is used to improve the handling characteristics of the materials and the exactness of the dosage. Furthermore, granulation is used to bind active dust materials to harmless base substances.
Many chemical products, incl. detergents, fertilizers, catalysts, pesticides and dyestuffs, are wanted in a granulated form.
In the present specification, the term granulation is used including what is often termed agglomeration.
In general, all granulation processes follow the same basic technique. The material to be granulated is wetted with a solvent or a solution to make the primary particles forming the material tacky A binder may be present in the particles or in the solution, or the ability of becoming tacky when wet may be inherent in the particles. The wet and tacky particles adhere to each other when brought into mutual contact and the junction is fixed by drying the material. Various materials differ in their ability to absorb the solvent or solution without getting totally wet and they become adhesive at different product humidity levels, so obviously not all materials are equally easy to granulate. To make the process more robust and easier to control, normally a combination of materials is used with different abilities to become tacky. Another approach to obtain adhesion between the particles is to use a mechanical force simultaneously with the wetting.
Granulation can be performed, using methods of different types.
One of these types is mechanical granulation. In mechanical granulation the solvent addition is low and the force, applied on the product, high. Mechanical granulations are classified in two main groups, high shear and low shear granulation. The advantage with high shear granulation is, that a broad range of formulations can be granulated. The granules produced in a high shear granulation are hard and compact, and the process is fast. One of the shortcomings of high shear granulation is the broad particle size distribution, which normally demands sizing by milling. The large sized compact granules (lumps) often found also give problems in the subsequent drying process.
Low shear granulation (such as ROTO-PROCESSOR(trademark) from Aeromatic-Fielder) gives less compact granules and a more narrow particle size distribution. This type of granulation does not demand milling and the granules produced by it are easy to dry.
A disadvantage with the low shear granulation is the difficulty in scaling up and the limit in the size of the batch.
In both, high shear and low shear granulation, pure solvent or solvent combined with binder can be used.
Another type of conventional granulation is fluid bed granulation. In fluid bed granulation, the product is kept fluidized while the solvent or solution is applied by means of a nozzle above or within the fluidized layer. The process of getting the single particles of the product together has to rely on the random movement of the product and on the fact that the product particles are wet enough to adhere to each other. The fact that various parts of the product absorb the solvents at a different rate and get tacky at different levels of product humidity, prevents certain formulations, to be granulated in a fluid bed. An advantage with fluid bed granulation is that the particle distribution can be more narrow than in mechanical granulation and the process is easy to scale up. Critical parameters for fluid bed granulation are the product layer thickness and the distribution of the solution spray over the product.
A disadvantage with fluid bed granulation can be that the granules are not so compact and stable as the granule produced in the mechanical process. Another disadvantage is, that when treating products having a critical wetting rate, the process is difficult to control. During the granulation process the particle size is changing, which means that the volume flow has to be increased at the same rate as the particle size growth to ensure the same grade of suspension of the product layer throughout the process. Because the granule produced in fluid bed granulation is not as stable as in the mechanical granulation process, the granule is vulnerable to attrition during the drying process. Examples of fluid bed granulation are described in U.S. Pat. No. 5,695,701 (Niro).
Several equipments have been designed to employ a combination of mechanical granulation with fluid bed granulation. The fundamental feature of this hybrid granulation process is to add force when the primary particles are brought into contact. The advantage with this granulation is, that the amount of solvent, added to the product, is less than in a pure fluid bed granulation for which reason the drying time of the granules is shorter. However, the control of this hybrid granulation is complicated. A problem with this granulation process is also the difficulty to scale up the batch size, which is rather limited, as in the mechanical granulation process.
Granulation is also performed as an integrated part of a spray drying process in which fine particles produced by spray drying are recycled to the spraying zone in the spray drying apparatus for contacting droplets and wet particles and subsequent drying. However, said method involves a risk of heat-damaging and is, moreover, only suitable when at least a substantial part of the starting material is present as a liquid. Besides, plant investments are high and only acceptable when a spray drying process is necessitated to transform a starting liquid into dry solid. Thus. such processes are out of .consideration when the problem is to granulate a material already present as particles
Although the process of the present invention does not involve treatment of particulates while these are in a fluidized bed, the above described fluidized bed granulation processes may be regarded as the closest prior art relative to the present invention.
Various equipment has been used or suggested for fluidized bed granulation. Thus, in published German Patent Application DE 3323418 A1 an apparatus is disclosed for fluidized bed processes primarily for coating of bodies such as tablets, however, also granulation is mentioned as a hypothetical possibility.
A feature of this fluidized bed apparatus is a vertical pipe arranged over an upwardly directed nozzle for spraying liquid droplets onto particles moving upward through said pipe.
From the top of the pipe the thus wetted particles reach the fluidized layer from the bottom of which the particles are again blown up through the pipe until the desired humidity has been achieved.
It is an essential feature of that process as well as of all other prior art fluidized bed granulation processes that although that part of the process in which the particles are wetted may be performed while a certain simultaneous drying takes place, the wetting takes place as a first step followed by a drying step. This means that the liquid sprayed onto the surface of the particles is present on/in the particles for a relatively long time, e.g. for more than 30 min, which leaves ample time for the liquid to penetrate into the interior of the particles. The liquid thus penetrated into the particles is obviously not at disposal on the particle surface for creating the stickiness essential for mutual adhesion between the particles which means that the total amount of liquid to be sprayed and evaporated increases.
This increased consumption of liquid not only impairs the heat-economy of the process but also causes operational problems.
Thus, especially when crystalline materials are granulated, the moisture content in the particles may suddenly exceed a value by which the particles are partly transformed into droplets causing a total caking of the whole batch being treated.
Also the high moisture content of the particles causes problems if a temporary interruption of the process is necessitated. If the flow of fluidizing gas is interrupted, the wet particles immediately collect as a mass on the bottom of the equipment. This mass can no longer be fluidized and must be removed by mechanical means or manually.
The fact that the wetting and the drying are performed to a substantial extent independent of each other involves the drawback that the result of the process cannot be evaluated until the total process is finalized. As explained above, the process cannot be stopped in a critical phase since the result thereof can be destructive and necessitate discharging of the whole batch.
Apart from these shortcomings of the fluidized bed granulation processes, the granulation results are not always satisfactory. often such processes deliver products having a too high proportion of non-agglomerated particles, even if the agglomeration process has been carried on to achieve a desired mean size of the granules.
It has now turned out that the above drawbacks related to the relevant prior art can be avoided or mitigated by a new process which inter alia involves that the particles to be granulated are subjected to collision promoting conditions and drying extremely short after having been wetted by spraying.
The process of the invention may be performed using equipment of a design similar to or even identical to equipment described for a completely different purpose, viz. coating of particles while avoiding any substantial granulation or agglomeration. Said equipment is described inter alia in U.S. Pat. No. 5,718,764 and termed PRECISION COATER(trademark) (Aeromatic-Fielder). Said U.S. patent is incorporated herein by reference. Details on this equipment will appear from the description below with reference to the drawings.
The invention deals with a process for granulation of a particulate material by subjecting the particles to a repeated circulating movement comprising an upward pneumatical movement from a starting area inside a vertical granulation pipe while the particles are entrained in a stream of drying and moving gas and simultaneously being subjected to a spray of droplets of granulation liquid, said circulating movement further comprising a downward movement outside said pipe, and a horizontal movement towards the starting area for said pneumatical movement, which process is characterized in passing the particles at said starting area into a zone above an annular horizontal aperture of a diameter less than the diameter of said vertical pipe, from which aperture a swirling flow of drying and carrying gas is emitted at a momentum accelerating and controlling the flow of particles in a rotation-symmet-rical, hollow zone above the annular aperture and around an imaginary vertical centre line of said aperture; and from a location on said imaginary centre line producing an upward spray of droplets of granulation liquid hitting the particles while these are in said zone thereby creating efficient contact between wet sticky particles combined with a fast drying to produce stable granules leaving the top of the granulation pipe in a non sticky condition.
It is essential features of this process that the active spray zone is small, only a few percent of the total amount of the batch is in the spray zone at any given time. When the particles pass into said zone above the annular aperture where drying and carrying gas is introduced, the product gets accelerated to ensure sufficient suspension so the individual particle can be wetted evenly. When the product leaves the exit at the top of the duct above the nozzle it has been wetted, particles have been sticked together to form granules, and these have been dried to a substantial extent.
By repeated passages through said pipe, further particles, viz. elementary particles and minor granules, stick to the already formed granules to increase their size as desired. Each granule may typically be subjected to from 20 to 1,000 passages through the pipe.
By the process of the invention it is possible to produce granulates which to the best knowledge of the inventor are not immediately obtainable by prior art granulation processes.
Therefore, the invention also deals with a granulate being the direct product of the process and characterized in having a content of non-granulated particles less than 5% by weight.
Fine lactose particles having a particle size below 38 xcexcm cannot be granulated satisfactorily by the prior art granulation methods discussed above, for which reason it is a further object of the invention to provide a lactose granulate having a mean granulate size above 200 xcexcm, consisting essentially of primary lactose particles having a particle size below 38 xcexcm.
Also fine particles of other crystalline materials are generally regarded as difficult to granulate, for which reason a further object of the invention is to provide a granulate of crystalline particles of high. solubility having a mean granulate size above 200 xcexcm and being essentially formed of crystalline primary particles of a mean particle size below 25 xcexcm.
The invention is elucidated further in the follow ing with reference to the drawings.

Abstract: The low moisture content during the process involves operational advantages and allow for interruption and re-start of the operation at any time.