A method of determining a center of gravity of an aircraft in flight by comparing actual control surface actuator displacements to expected control surface actuator displacements. And a method of fuel/load management based on an offset of the center of gravity from a preferred center of gravity and a handling qualities factor.

The center of gravity of an aircraft may change during flight. The changes to the center of gravity may be gradual, for example, fuel consumption during flight may slowly alter the center of gravity of the aircraft. Alternatively, the center of gravity of the aircraft may change rapidly, for example, when air-dropping cargo or discharging large munitions. As the center of gravity deviates from the optimal location, the pilot, or the flight control system, must deploy flight control surfaces to maintain the desired attitude. In addition, if the center of gravity deviates beyond the center of gravity envelope for the aircraft, the aircraft can become unflyable.
The dilemma of the changing center of gravity has been managed by making pre-flight calculations that predict the changing center of gravity by calculating burn rates and scheduling a predetermined tank burn order. This method is sometimes augmented with fuel tank sensors for high fidelity mapping of fuel levels to monitor burn rates and loads. Another method of determining the center of gravity during flight involves utilizing six or more accelerometers to determine aircraft lean. Other methods for determining the center of gravity while in flight are disclosed in U.S. Pat. Nos. 9,464,958; 5,571,953; and 5,034,896; all of which are incorporated herein by reference in their entireties.

Method of determining the center of gravity of an aircraft and a method of fuel/load management based thereon


A roofing system including horizontal or sloped metal framing members, for example, C-joists, U-joists, open web joists, or other metal frame systems that support a reinforced, lightweight, dimensionally stable SCP panel. The roofing system is non-combustible, water durable, mold and rot resistant, termite resistant and is capable of resisting shear loads equal to or exceeding shear loads provided by plywood or oriented strand board panels. The panels employ one or more layers of a continuous phase resulting from the curing of an aqueous mixture of inorganic binder, for example, calcium sulfate alpha hemihydrate, hydraulic cement, an active pozzolan and lime. The continuous phase is reinforced with glass fibers and contains lightweight filler particles, for example, ceramic microspheres.

Roof construction for commercial, residential, and industrial buildings, must meet performance standards generated by legislation primarily at the state and local levels through the adoption of state and local building codes which set forth very specific performance factors. In general, these performance standards are divided into two broad areas: (1) Sloped roofs, generally 30 degrees or greater from horizontal and (2) Flat roofs, 0 degrees to 30 degrees slope from horizontal.
The performance standards for flat roof construction vary slightly from area to area but generally conform to the following:
1. Vertical Load Strength: A roof must be able to carry a total load consisting of dead load plus live load and satisfy legislated design or performance values for the materials being utilized in the roof assembly. Example: Conventional steel roofs manufactured from 50,000 to 60,000 psi steel must not be stressed under working conditions beyond a flexural tensile stress of 20,000 psi.
2. Live Load Deflections: While supporting the designed dead load (weight of steel, built-up roof and insulation) the roof must not deflect under live load application more than 1/240 th of the distance between the support members or less deflection as dictated by local building codes or other considerations.
Example: A roof supported by members 6′0″ on center must not deflect more than 6′0″×12 in./ft.× 1/240 equal 0.30″ under live load application. Live loads will vary in different climate areas from 20 pounds per sq. ft. to 60 lbs./sq. ft., depending upon weather conditions.
3. Wind Up-Lift Resistance: Typically, the roof must resist negative and positive pressures applied to it and remain structurally serviceable. Performance values for this standard vary depending upon geographical areas, but in general, range from 30 psf uplift resistance (equivalent of 100 mph winds) to 90 psf uplift resistance (equivalent of 188 mph winds).
Typical steel roof assemblies have utilized sections formed from mild steel in patterns normally referred to as "Type A", "Type B", "Type AB", and the like. The common feature of the sections is a wide flat surface element, formed between stiffening ribs that provide the stiffness and strength to the section. The steel sections, supported by purlins, have been designed heretofore to meet strength requirements specified by building codes. The flat surfaces have been employed to provide a supporting surface for one or more layers of sheet material comprising a single board serving to insulate and provide a surface to which waterproof covering was attached.
A typical "Type A" section, for example, provides a flat portion of approximately 5 and ½ inches wide between 1 and ½ inch deep stiffening ribs spaced six inches apart. The "Type B, AB" and other sections are similar in profile to a Type A section except that the flat portions between stiffening ribs is progressively reduced in width to create a closer spacing of the stiffening ribs, increasing the load capacity for a given span. However, the width of rib openings on the top surface of the sheet, for example of a Type B section is greater than that of a Type A section.
The most efficient light gauge steel sections from a strength standpoint are those that have the greatest number of stiffening ribs per unit of width; the ultimate, being the symmetrical rib pattern sections, which have an equal distribution of steel above and below a neutral axis lying in a plane passing through the center of the sheet and disposed parallel with upper and lower surfaces of the sheet.
It may be mandatory in some cases, or desirable in other cases, for economy reasons, to utilize the roof assembly as a structural diaphragm to reinforce a building against lateral loads created by earthquake shocks (seismic), explosion forces or wind. In such application, the roof assembly is considered to be the plate web of a girder oriented in a horizontal plane with the perimeter members of the building serving as the compression and tension chords of the girder.
The diaphragm (plate web) strength of a given roof assembly is evaluated in terms of its ability to transfer diagonal tension stresses, which involves consideration of the shear resistance of the assembly, and in-plane deflection (referred to as "diaphragm deflection"), which is governed to a large extent by the "diaphragm stiffness" of the steel panel sections that are utilized. Diaphragm stiffness is related to the ability of the steel panel sections to resist distortion under load.
Since the flexural strength of a steel panel section is, to a large degree, a function of the depth of the section, it is naturally opposed to the reduction of depth (approaching a thin plane of steel) that contributes to diaphragm strength. The most efficient roof assemblies, from the standpoint of diaphragm strength, are those that can provide adequate flexural strength, utilizing steel sections with the maximum degree of effective steel in the diaphragm stress plane. Diaphragm stiffness increases proportionally to increases in the yield strength of the steel that is utilized, hence, steel sections made of high tensile steel are more effective than those made of mild steel.
Heavy gauge, mild steel (for example, 22 gauge, 20 gauge and 18 gauge with a stress limit of 20,000 lbs. per square inch) is generally employed in the manufacture of Type A and similar flat profile sections. This has been due to the fact that heavier gauges are necessary to satisfy the minimum steel thickness to element-width ratios that govern the design of light gauge steel sections. On the other hand, the symmetrical rib pattern sections have smaller unit-width elements and hence can utilize the more effective high tensile strength steel in lighter gauges providing greater working strength per pound of steel.
Asphalt built-up roof coverings usually consist of several layers of asphalt-saturated felt with a continuous layer of hot-mopped asphalt between the layers of felt. The top layer of such a roof covering may consist of a hot mopping of asphalt or coal tar pitch only, a top pouring of hot asphalt with slag or gravel embedded therein, or a mineral-surfaced cap sheet embedded in a hot mopping of asphalt.
Built-up roofs cannot generally be applied directly to steel roof sections and consequently an underlayment of substrate material has typically been installed after the steel roof sections have been secured in place. There have been embodiments which have employed a single sheet of underlayment material generally referred to as "rigid roof insulation board". However, the insulating efficiency of the rigid board insulation is generally directly related to the density of the materials of which it is constructed, lighter density materials providing proportionally better insulation for a given thickness. Strength characteristics of these boards are inversely related to reductions in density. Accordingly, the lighter the density of these boards, the less the strength. Since "rigid insulation board" has heretofore been used over steel to provide a suitable base for roofing as well as insulation, the board had to be manufactured in densities that would compromise the minimum requirements for strength versus insulation values. Typical of compromised situations, the "rigid insulation boards" have been made to be adequate, but under the circumstances could not be fully efficient in the performance of either function, i.e., providing thermal insulation and strength.
U.S. Pat. No. 4,736,561 to Lehr et al., U.S. Pat. No. 4,783,942 to Nunley et al., U.S. Pat. No. 4,601,151 to Nunley et al. and U.S. Pat. No. 4,707,961 to Nunley et al. disclose horizontally disposed multi-layer flat building roofs.
Steel framing can be used to build purlins and trusses like conventional framing for both flat and sloped roofs. Roof trusses made of steel framing resemble wood framing with rafters and ceiling joists formed of C-shaped studs. A ridge member constructed of a C-shaped stud inside a track section connects the rafters. In a conventional wood or steel framed house having peaked roof sections, the rafters are perpendicular to and rest on the load-bearing walls. The end walls and interior walls parallel to the rafters are typically non-load bearing.
A number of approaches have been proposed to utilize steel roof trusses. In U.S. Pat. No. 2,541,784 issued to H. S. Shannon, "C" or "U" shaped sections are used for the bottom chord member as well as the top chord members of a building truss.
U.S. Pat. No. 4,435,940 issued to Jeanne A. Davenport, et al. and U.S. Pat. No. 4,982,545 to Gustaf M. Stromback describe truss arrangements wherein the horizontal, bottom chord section of a roof truss is formed from a U-shaped section of sheet steel. In the Stromback patent the ends of the legs of the U are tightly folded back to form a double thick edge. The top chords of both the Davenport and the Stromback patent are formed of inverted U-shaped sections having flanges projecting outwardly from the ends of each of the legs to provide greater rigidity.
U.S. Pat. No. 5,463,873 to Early, et al. discloses a metal roof truss wherein, the bottom horizontal chord piece and the top chord pieces are of substantially uniform shape and cross-section. Both the bottom and top chord members include a radiused or rolled hem at the end of the legs. Further, one or more stiffening ribs are formed in the side walls of the chord members.
The trusses are typically arranged parallel to each other with 8″, 16″ or 24″ between their respective centers, depending upon the load characteristics that the roof must accommodate. A sheathing material such as plywood or OSB is then fastened to the upper chords of the trusses using nails, screws or other mechanical fasteners to form the roof surface. To prevent the trusses from twisting or moving laterally, small pieces of wood or metal, known as purlins, are commonly nailed between adjacent trusses. Insulation is sometimes installed between the trusses and sheathing, drywall, plasterboard, etc. may then be applied to the bottom of the joists to form a ceiling for the space located under the roof truss system.
The outside dimensions of the metal framing members and studs, and the weight or gauge of the member or stud, vary. Typically the members are fabricated to be approximately 4 inches wide by 2 inches deep, corresponding thereby to the width and depth of wood framing and stud members, in which case the lips may extend ¼ to ½ inch from the sides of the studs. Eighteen to 20 gauge metal may be used for light gauge, residential construction and commercial wall construction. A heavier range of metal gauge is used in some residential and commercial framing and particularly in multiple story commercial construction.
Metal roofing framing members have been modified to include saw or punch slots, tabs and brackets intended to facilitate the interconnection of these studs and framing member to adjoining studs and framing members and/or to cross-bars and other non-framing members that serve to reinforce the studs and framing members. Known connectors, including bracket, plate and tie connectors, presently used to tie together and interconnect metal studs, are generally drilled and screwed on site. Drilling and screwing unsecured connectors pose a safety risk to the worker since the connectors tend to be small and light, and thus easily grabbed and spun by a hand drill.
It is known to place plywood or OSB sheathing on cold formed, light gauge steel roofing trusses. However, plywood and OSB are combustible.
U.S. Pat. No. 6,620,487 to Tonyan et al., incorporated herein by reference in its entirety, discloses a reinforced, lightweight, dimensionally stable structural cement panel (SCP) capable of resisting shear loads when fastened to framing equal to or exceeding shear loads provided by plywood or oriented strand board panels. The panels employ a core of a continuous phase resulting from the curing of an aqueous mixture of calcium sulfate alpha hemihydrate, hydraulic cement, an active pozzolan and lime, the continuous phase being reinforced with alkali-resistant glass fibers and containing ceramic microspheres, or a blend of ceramic and polymer microspheres, or being formed from an aqueous mixture having a weight ratio of water-to-reactive powder of 0.6/1 to 0.7/1 or a combination thereof. At least one outer surface of the panels may include a cured continuous phase reinforced with glass fibers and containing sufficient polymer spheres to improve nailability or made with a water-to-reactive powders ratio to provide an effect similar to polymer spheres, or a combination thereof.
U.S. Pat. No. 6,241,815 to Bonen, incorporated herein by reference in its entirety, also discloses formulations useful for SCP panels.
U.S. patent application Ser. No. 10/666,294, incorporated herein by reference, discloses a multi-layer process for producing structural cementitious panels (SCP's or SCP panels), and SCP's produced by such a process. After one of an initial deposition of loosely distributed, chopped fibers or a layer of slurry upon a moving web, fibers are deposited upon the slurry layer. An embedment device mixes the recently deposited fibers into the slurry, after which additional layers of slurry, then chopped fibers are added, followed by more embedment. The process is repeated for each layer of the board, as desired.
There is a need for an economical, easy to assemble, durable and non-combustible total framing and roofing system.

This patent is subject to a terminal disclaimer.

Non-combustible reinforced cementitious lightweight panels and metal frame system for roofing


A terminal applicator (50) for attaching electrical terminals (52) to a wire includes a terminal hold down device (90) for limiting movement of the terminal during the crimping process. The hold down device (90) includes a hold down arm (92), a pair of guide rods (102), and a removable standoff (130). The guide rods (102) are carried by a reciprocating ram (68) and are arranged so that when the standoff abuts a travel limit block (148) the hold down arm remains in close proximity to the terminal while the ram (68) continues its motion to complete the crimping cycle.

Terminal applicator machines are widely used in the industry to attach electrical terminals to conductors. These terminal applicators are typically secured in a press which supplies the power and motion that operates the applicator. The applicator may be used manually where an operator inserts an already prepared wire end into the crimping area between a crimping tool and an anvil containing a terminal and holds the wire in place while activating the press to complete the termination. Alternatively, the terminal applicator and associated press may be attached to a host machine, such as a lead maker, where the prepared wire end is automatically presented to the applicator tooling for termination. These terminal applicators typically feed a strip of terminals along a guide rail into a workstation where one of the terminals is positioned over an anvil. The wire, its end having been previously stripped of insulation, is positioned in the workstation and the apparatus is activated to cause crimping tools to engage and crimp the tabs of the terminal onto the end of the wire. There are two variations of terminal feeding arrangements, depending on the arrangement of the terminals on their carrier strip. Carrier strips can be designed for either side feed or end feed in conformance with the configuration of the terminal. Each presents its own unique characteristics when considering the design of a terminal hold down for controlling and limiting movement of the terminal during the actual crimping of the terminal onto the wire.
An example of a prior art terminal hold down for an end feed application is shown in FIG. 1. There a partial view is shown of a ram 2 of a terminal applicator having terminal crimping tooling 4 and a terminal hold down 6, both of which are carried by the ram during the crimping process. The hold down 6 is in sliding engagement with an opening 8 formed in the ram 2 so that the hold down is free to undergo limited movement in the directions indicated by the arrows 10 and 12. An elastic member, not shown, is positioned within the opening 8 so that it urges the hold down 6 in the direction of the arrow 12. The hold down 6 includes a terminal hold down surface 14 and a projection 16 having a stop surface 18 spaced from the surface 14 a specific amount. This spacing is chosen so that, when the ram 2 has reached the end of its stroke and the tooling 4 is in crimping engagement with a terminal, the stop surface 18 has engaged a fixed surface, not shown, and the hold down surface 14 is in a desired close proximity to the terminal for limiting adverse movement of the terminal. This type hold down 6 must necessarily have the projection 16 and stop surface 18 accurately machined so that the spacing of the surface 18 from the surface 14 corresponds to the requirements of the terminal being crimped. Every terminal having different spacing requirements necessitates a hold down 6 with a unique spacing of the surface 18 from the surface 14. This results in many different, relatively complex, hold downs being manufactured and maintained and, of course, their corresponding substantial cost.
An example of a prior art terminal hold down for a side feed application is shown in FIG. 2. There a partial view is shown of a ram 24 of a terminal applicator having terminal crimping tooling 26 and a terminal hold down 28, both of which are carried by the ram during the crimping process. The hold down 28 has a hold down surface 30 and is constructed of a urethane and includes a stud 32 that is threaded into a hole in a member 34 attached to the ram 24 and a lock nut 36 arranged to lock the stud in a desired position. The hold down 28 is positioned so that when the ram 24 has reached the end of its stroke and the tooling 26 is in crimping engagement with a terminal, the hold down surface 30 is in a desired close proximity to the terminal for limiting adverse movement of the terminal. This arrangement requires that the hold down 28 be positioned very accurately so that the terminal is not damaged when the ram 24 is fully extended during crimping. The urethane material provides a slightly pliable surface to aid in preventing damage of the terminal should an out of tolerance condition be encountered. This material, however, has the disadvantage of becoming warn during use, requiring occasional replacement. Another disadvantage is that each time the crimp height is adjusted, the position of the hold down 28 must be readjusted. This can be a tedious operation during initial set up of the applicator.
What is needed is a terminal applicator machine having a simple and inexpensive terminal hold down device that will work for a wide range of different terminal sizes, in both end feed and side feed application, and that need not be readjusted upon adjusting the crimp height of the applicator.

Hold down device in a terminal applicator


By transforming a query into a product of conditional selectivity expressions, an existing set of statistics on query expressions can be used more effectively to estimate cardinality values. Conditional selectivity values are progressively separated according to rules of conditional probability to yield a set of non-separable decompositions that can be matched with the stored statistics on query expressions. The stored statistics are used to estimate the selectivity of the query and the estimated selectivity can be multiplied by the Cartesian product of referenced tables to yield a cardinality value.

Most query optimizers for relational database management systems (RDBMS) rely on a cost model to choose the best possible query execution plan for a given query. Thus, the quality of the query execution plan depends on the accuracy of cost estimates. Cost estimates, in turn, crucially depend on cardinality estimations of various sub-plans (intermediate results) generated during optimization. Traditionally, query optimizers use statistics built over base tables for cardinality estimates, and assume independence while propagating these base-table statistics through the query plans. However, it is widely recognized that such cardinality estimates can be off by orders of magnitude. Therefore, the traditional propagation of statistics can lead the query optimizer to choose significantly low-quality execution plans.

Method and apparatus for selecting candidate statistics to estimate the selectivity value of the conditional selectivity expression in optimize queries based on a set of predicates that each reference a set of relational database tables


Methods for plasma treatment of films to remove impurities are disclosed herein. Methods for removing impurities can include positioning a substrate with a barrier layer in a processing chamber, the barrier layer comprising a barrier metal and one or more impurities, maintaining the substrate at a bias, creating a plasma comprising a treatment gas, the treatment gas comprising an inert gas, delivering the treatment gas to the substrate to reduce the ratio of one or more impurities in the barrier layer, and reacting a deposition gas comprising a metal halide and hydrogen-containing gas to deposit a bulk metal layer on the barrier layer. The methods can further include the use of diborane to create selective nucleation in features over surface regions of the substrate.

1. Field of the Invention
Embodiments of the invention relate generally to methods for processing a substrate during semiconductor manufacturing. Specifically, embodiments of the invention relate to methods of treating a nucleation layer prior to a CVD deposition process.
2. Description of the Related Art
Reliably producing nanometer-sized features is one of the key technologies for the next generation of semiconductor devices. The shrinking dimensions of circuits and devices have placed additional demands on processing capabilities. The multilevel interconnects that lie at the heart of integrated circuit technology require precise processing of high aspect ratio features, such as vias and other interconnects. Reliable formation of these interconnects is very important to future success and to the continued effort to increase circuit density and quality of individual substrates.
Metallization of features formed on substrates includes CVD deposition of metals such as tungsten. Tungsten can be used for metal fill of source contacts, drain contacts, metal gate fill and gate contacts as well as applications in DRAM and flash memory. Growth of CVD tungsten from WF6 and H2 gas mixtures typically requires a pre-deposited underlayer of metallic tungsten to crack H2 into adsorbed atomic hydrogen and to initiate metal film growth.
In previous techniques, a tungsten nucleation layer is deposited from WF6 and SiH4 or WF6 and B2H6 on a barrier and adhesion layer of TiN or WN by an ALD process. However, this technique is rapidly losing extendability into less than 20 nm features due to the increasing volume fraction of the feature being consumed by the barrier metal and ALD-W nucleation.
Therefore, there is much effort in the art to create a tungsten deposition process which reduces the use of intermediate layers prior to bulk tungsten fill.

Plasma treatment of film for impurity removal


First and second data sources transmit a data signal on a data connection and a transmit clock signal on a clock connection. The data signal is clocked into a FIFO resident in the network interface equipment in response to the transmit clock signal, and out of the FIFO to the network in response to a reference clock signal. The FIFO generates a signal indicating how full it is and a local clock generator which generates the transmit clock signal in response to this status indication signal. The first and second data sources hold the data signal and transmit clock signal high for longer than a single period of the reference clock signal when switching between them. The local clock generator alters an average rate of the transmit clock signal in response to the status indication signal from the FIFO in order to keep it half-full.

I. Field of the Invention
The present invention relates to synchronous communication of data. More particularly, the present invention relates to a novel and improved method and apparatus for switching between two or more different data sources on a synchronous data port having an external timing reference.
II. Description of the Related Art
In the field of data communications, several well-known standards exist for communicating serial data from one communication device to another communication device. These standards include RS-232, RS-422, T1, and E1 and the like. In accordance with these standards, binary data is transmitted over a serial communication line by a serial driver device, and received at the other end of the serial communication line by a serial receiver device. In a synchronous data communication system, this binary data is transmitted according to the timing of a reference clock signal.
In a communication system where high-speed, reliable data communication is required, such as in a telecommunications network application, redundant communication resources are often provided. For example, the system architecture may provide a "one plus one" redundancy scheme for serial driving devices so that if one driver fails, the other will be switched onto the communication line in order to provide continuing data communication with the receiver device.
An example of a wireless communication system which uses high-speed, redundant communication resources may be found in U.S. patent application Ser. No. 08/513,306, filed Aug. 9th, 1995, entitled "METHOD AND APPARATUS FOR PROVIDING A RELIABLE PACKET SWITCHED INTERCONNECTION SYSTEM," assigned to the assignee of the present invention and incorporated herein by reference. In the just-mentioned patent application, a redundant packet switching architecture is disclosed which comprises a cellular base station in communication with the Public Switched Telephone Network (PSTN) through an ISDN switch. Hardware redundancy is provided among network interface resources that interface the cellular base station to the PSTN.
For example, consider the wireless communication system 100 of FIG. 1. FIG. 1 illustrates a Base Station Transceiver Subsystem (BTS) 102 in communication with a Base Station Controller Subsystem (BSC) 114. On the forward link, BSC Distribution and Consolidation Subsystem (BSC DISCO) 118 routes voice signals and other data from various sources (not shown) to BSC Network Interface Equipment (BSC NIE) 116 for further routing to BTS 102. BSC NIE 116 routes the voice signals and data and also clock signals over T1, line 112 to BTS Network Interface Equipment (NIE) 110. NIE 110 and 116 which may each be an Inverse Multiplexer (IMUX), Channel Service Unit (CSU), or other conventional type of interface, translate between the T1, format and a Base Station Communication Network (BCN) format. BTS NIE 110 passes the data over lines 108 to at least one of the N Base Station Communication Network Interface Cards (BCNIC) 106A-106N resident in BTS DISCO 104. BTS DISCO 104 then routes the incoming data to the appropriate BTS 102 resources (not shown) which, in turn, transmit the data to one or more Mobile Stations (MS) 101. The converse path is followed for the reverse link from the MS to the BSC. BSC DISCO 118 and BTS DISCO 104 are similar in nature and structure and are further described in the above mentioned U.S. patent application Ser. No. 08/513,306. BSC DISCO 118 may also employ the present invention, and communicate with other BSC's (not shown).
As shown in FIG. 1, hardware redundancy on the order of 1:N may be provided for BCNICs 106A-106N. When one of the BCNICs fails, for example BCNIC 106A, the redundant BCNIC 106N is automatically switched in to replace the failed unit. Furthermore, in an effort to prevent catastrophic failure, the BCNICs 106A-106N are sequentially tested by Controller 105 taking one at a time "off-line" to perform diagnostic and functional testing as described in the above-mentioned patent application Ser. No. 08/513,306. As each of the BCNICs 106A-106N completes off-line testing, it is placed back in service, and the next BCNIC 106A-106N is then removed from service to be tested. This cyclic sequential testing controller by controller 105 is often referred to as "roving test," and decreases the probability of a catastrophic failure by orders of magnitude. Thus, there are two ways in which the BCNICs 106A-106N are switched in and out of service; for maintenance purposes (i.e. "roving" ), and also upon actual failure.
When switching between these redundant communication resources, it is clearly desirable to eliminate any loss or corruption of data, because the data may not be recoverable, and in any case, it may take a significant amount of time to re-synchronize the BTS NIE 110 with the BSC NIE 116 after discovering the error and perhaps resetting. At very high data rates, such as on the order of 10 Mbps, the problem of error-free switching between redundant data sources is exacerbated by the finite switching time necessary to bring an "off-line" data source to an "on-line" state. That is to say that it may not be possible to reliably and automatically switch one BCNIC 106A "off-line" and also switch a replacement BCNIC 106N "on-line" within a single clock pulse at high data speeds.
For example, consider a BCNIC 106A clocking data in/out to the BTS NIE 110 at an exemplary data rate of 10 Mbps. At this rate, the clock period is 100 ns, which means one clock pulse is either "high" or "low" for only 50 ns. If one takes into account the realities of clock jitter, clock skew, and lot-to-lot component variation among clock drivers, the clock pulse will not be perfectly square, and may only be 30 ns or 40 ns in duration. In order to make a reliable switch between the two redundant cards without losing data, the "off-line" BCNIC 106N would need to detect the proper clock edge, and then turn on its data drivers, whereas the "on-line" BCNIC 106A would need to properly detect the same clock edge, and then turn off its drivers after the "off-line" BCNIC 106N had turned its data drivers on. This manner of switching is often referred to as "make before break". There is a high probability that not all of these events would occur properly, in which case both BCNICs 106A and 106N could be driving data out during this same time, causing contention which could last for more than a single clock pulse, perhaps longer than 50 ns, and result in errors in the data. Alternately, the failure to make an effective "make before break" switch could result in a period where neither BCNIC 106A or 106N is driving data or clock signals. Thus, a method and system is needed to provide reliable switching among redundant high-speed data sources.
In a conventional network interface between a BSC NIE 116 and a BTS NIE 110 over a T1, line 112, BSC NIE 116 the provides a network reference clock signal for synchronous communications of data. The BTS NIE 110 may derive a local transmit clock signal from the network reference clock, an internal oscillator (not shown), or perhaps a separate stable time reference such as a GPS receiver (not shown). BTS NIE 110 provides the local transmit clock to the BCNICs 106A-106N. In response to the local transmit clock signal, data is clocked out from the BCNIC 106A-106N, and into the BTS NIE 110. In response to the network reference clock signal provided by BSC NIE 116, data is clocked out from the BTS NIE 110 over the T1, line 112 to the BSC 114 for further routing to its destination address. By industry standards, the data clocked out on the T1, line 112 between the BSC NIE 116 and the BTS NIE 110 is packetized into frames, with the 193rd bit in each frame being reserved for overhead signaling or synchronization use. Since no user data is provided on the forward link from the BSC NIE 116 during this 193rd bit, the BTS NIE 110 generally does not provide user data to the BSC NIE 116 on the reverse link in response to the 193rd network reference clock signal either, and thus the BTS NIE 110 generally does not replicate the 193rd network reference clock signal in generating its local transmit clock signal for use by the BCNICs 106A-106N. It should be noted that there may be some delay between the 193rd network reference clock signal and the local transmit clock signal.
In the BTS NIE 110, it is a conventional design matter to provide a FIFO (not shown in FIG. 1) in the serial data path and buffer the data in order to account for uncertainties in this network clock signal caused by such things as cable length delay (which may be on the order of 1.5 ns per foot), internal delays within the BSC 114 switching equipment and the BTS 102 equipment, and clock tolerances. Such a FIFO is also useful for allowing a "margin of safety" needed when switching or "roving" between redundant data sources, such as the BCNICs 106A-106N. The "margin of safety" provided by such a FIFO is proportional to its depth. The deeper the FIFO, the more data can be stored, and thus the longer it would take to overflow if data was clocked into it by the BCNIC 106A-106N faster than it was clocked out onto the T1, line 112 by the NIE 110. However, deeper FIFOs generally cost more than shallower ones. Additionally, regardless of how deep a FIFO is, it may still fail to prevent data errors if it underflows if the BCNIC 106A-106N missed several clock pulses from the network, and thus failed to send any data. In either case, an underflow or an overflow would generally causes a reset of the NIE 110 and the accompanying re-synchronization time.
In a perfect system, the FIFO in the NIE 110 would remain one-half full. Additionally, in that perfect system, the switching among redundant data sources would occur instantaneously without any errors or gaps in the data. However, due to the uncertainties mentioned above, as well as the need for high-speed data communications there is a clear need for a reliable high-speed data system that can reliably switch between redundant data sources without introducing data errors.

Reliable switching between data sources in a synchronous communication system


System and method for controlling the thickness profile of deposited thin film layers over three-dimensional topography are disclosed, wherein low pressure chemical vapor deposition conditions are employed with the reactant beam collimated and chosen to impinge at a specific angle onto the surface, such that the reactive sticking coefficient s.sub.r with the deposition surface is <1. Compared with conventional approaches, this method permits new shapes of the deposited thin film layer to be achieved over topography (such as trenches), including (i) tapered rather than re-entrant shapes (i.e., thicker at bottom rather than at top), (ii) enhanced sidewall and/or bottom coverage of trench structures (cf. the top surface), (iii) voidless, seamless filling of trench or via structures even at high aspect ratio (depth/width), and (iv) asymmetric sidewall coverage.

1. Field of the Invention
The present invention relates to semiconductor fabrication, and particularly to a system and method for controlling the thickness distribution of chemically deposited thin film layers over three-dimensional topography on the scale of 0.1-10 .mu.m, such dimensions being characteristic of features used in semiconductor devices.
More specifically, the invention relates to the challenges presented by the surface of a semiconductor which, before the deposition, contains trench or via structures protruding down into the surface and having for example rectangular (trench) or circular (via) shapes as viewed from above. The two shapes will be referred to interchangeably throughout this description. The lateral dimension of such structures is hereafter referred to as the width of the trench or via; the vertical dimension of such structures is referred to as the depth. The aspect ratio AR of the trench or via is the ratio of depth to width. The invention is directed to providing a process that offers the capability of controlling deposited layer profiles over such three-dimensional trench or via structures, and particularly the ability to choose how the thickness of the deposited layer varies with position along the surface of the trench bottom or sidewall surface, as well as with respect to the thickness deposited on the top surface next to the trench.
2. Prior Art and Problem to be Solved
The geometry of a trench and of a deposited overlayer structure is depicted schematically in FIGS. 1(a) and 1(b), respectively. In FIG. 1(a) a semiconductor substrate with a three-dimensional trench or via structure having a depth d and width w is shown in cross-section, while a thin film overlayer on the top, sidewall, and bottom surfaces is illustrated in FIG. 1(b) with thickness dimensions t.sub.t, t.sub.s, and t.sub.b, respectively. The step coverage SC is conventionally defined as the ratio of sidewall to top coverage, i.e., SC=t.sub.s /t.sub.t.
Overlayer deposition processes provide differing degrees of conformality as indicated in FIGS. 2(a) and 2(b), which schematically show the conformality of deposited layers on trench structures of different ARs. In FIG. 2(a), where AR.perspectiveto.1.0, the sidewall coverage is nearly equal to the top coverage, and consequently conformality is very good. In FIG. 2(b) the higher aspect ratio AR>>1.0 causes sidewall coverage to be smaller with increasing depth into the trench, and the resulting conformality is poor. The high conformality coverage of FIG. 2(a) is typically that achieved with chemical deposition mechanisms. The poor conformality of FIG. 2(b) is more commonly found with physical deposition techniques in which the impinging flux on the feature surface is limited by geometrical shadowing. In many--if not most--cases, conformal coverage is desired. For example, if the deposited layer is a dielectric used to electrically isolate a material subsequently put into the trench over the dielectric, thinner regions on the sidewall would represent a serious yield and reliability detractor.
Typically, the sidewall coverage will not be uniform along its height. Such variations are illustrated in FIGS. 3(a) and (b), which respectively show (a) tapered and (b) re-entrant sidewall profiles of deposited thin films or layers of finite conformality. The tapered shape has thicker sidewall coverage toward the bottom of the sidewall than toward the top, while the situation is reversed for the re-entrant shape. Generally speaking the tapered shape is more desireable than the re-entrant, because the overhang of deposited material near the top of the trench shadows the region below, and the consequences of subsequent deposition can be ill-defined. With tapered or re-entrant shapes, the step coverage may ned to be defined more precisely, but one can refer to it simple in terms of the average sidewall coverage.
When the deposited film is employed to completely fill the trench structure, as shown in FIG. 4, three different results can emerge as illustrated by cases (a), (b), and (c). In case (a) the deposited material fills the trench without leaving a seam or void. In case (b) a seam is shown, arising from the point where the sidewall layers merge during deposition. In case (c) a void is depicted, which can readily arise if the deposition produces re-entrant profiles at earlier stages of the filling process. For integrity and reliability microelectronic structures, case (a) is ideal. The cases of remaining seams (b) and voids (c) are undesireable, since chemicals or materials may be present in the seam or void to corrode or degrade the structure. Furthermore, voids are rarely hermetically sealed, so subsequent exposure to chemicals or materials deposition can alter the material structure substantially. Deposition onto trench and via structures is commonly practiced at several stages in the fabrication of semiconductor devices and interconnections. Most often the objective is to provide rather highly conformal films or void-free (and possibly seam-free) filling. The problem and challenge presented is that of increasing aspect ratio trench structures, consistent with the trend toward higher lateral device density.
Low pressure chemical vapor deposition (LPCVD) is widely used to achieve conformal deposition of microelectronic films over topography. Physical vapor deposition techniques (evaporation, sputter-deposition) are typically limited to low AR (<2) since they involve relatively collimated or directional impinging beams with sticking coefficients s.sub.r .perspectiveto.1.0. LPCVD processes offer much better conformality and filling properties for several reasons.
First, the reactive species in the gas phase exhibit isotropic impingement properties, so that they can impinge on sidewalls substantially.
Second, the chemical processes involved provide intermediate species, some of which may be mobile on the surface and thereby may migrate to sidewalls and bottom trench surfaces. Third, the reaction probability of chemical reactants hitting the surface may be <1.0, in contrast to the case of physical vapor deposition, so that some species bounce off the surface to impinge on neighboring surfaces in the trench from different angles, a phenomenon called redeposition. Indeed, conformal deposition can be achieved with very high AR (.about.40), as has been found with CVD Si.sub.3 N.sub.4 deposition for triple-layer dielectrics in dynamic RAM trench capacitors, or with the subsequent filling of high AR trenches with polycrystalline Si films by CVD. The important distinction is that CVD processes involve isotropic impingement of reactant species together with reactive sticking coefficients s.sub.r (i.e., reaction probabilities) which are less than unity.
Current CVD processes have important limitations. With higher integration levels or higher performance structures, higher aspect ratios are required, stretching the ability of known CVD processes. Re-entrant profiles, seams, and voids all endanger the manufacturability of the semiconductor product due to yield and reliability problems. Where higher growth temperatures improve conformality or profiles, other properties of the 3-D structure may be degraded (e.g., abrupt doping profiles due to diffusion). Alternatively, lower reaction probabilities ("reactive sticking coefficient") for well-chosen CVD chemistries can yield higher conformality, but throughput is degraded, making the approach less competitive. Thus, conventional CVD processes may not be capable of achieving the 3-D profiles and filling characteristics needed for next-generation technologies.

Apparatus for directional low pressure chemical vapor deposition (DLPCVD)

International Business Machines Corporation


The present invention provides a method and resulting device for producing a low-loss spectrally periodic all fiber filter by providing a multi-mode fiber capable of propagating an LP01 mode and an LP02 mode at wavelengths of interest and providing a single-mode fiber capable of propagating a fundamental mode at the wavelengths of interest and splicing a selected length of the multi-mode fiber between lengths of the single-mode fiber, where the properties of the multi-mode fiber and the single-mode fiber are related such that the optical field distribution resulting from the coherent superposition of the optical field of the LP01 mode and the optical field of the LP02 mode in the multi-mode fiber is sufficiently similar to the optical field distribution of the fundamental mode in the single-mode fiber at the wavelengths of interest, such that transmission across the two splices taken together at the wavelengths of interests is at least 70%, desirably at least 80% and most desirably at least 90%, and the extinction ratio of the filter is at least 10 dB. The method may also include the step of monitoring light passing through the spliced length of the multi-mode fiber while tapering the multi-mode fiber to adjust the spectral profile of the resulting filter.

1. Field of the Invention
The present invention relates generally to optical communications, and more specifically to fiber-based devices and methods for providing low-loss spectrally periodic filtering of an optical signal.
2. Technical Background
Soliton optical communication systems can greatly benefit from the use of narrowband spectral filters spaced at appropriate intervals along the optical fiber within the system. Narrowband filters pass through the useful spectral content of an optical signal and reject broadband ASE (amplified-spontaneous-emission) noise. By "guiding" the central frequency of the soliton pulses to the middle of the filter passband, such filters can significantly reduce the accumulation of jitter in soliton pulse arrival times caused by Gordon-Haus and acoustic-interaction effects. For this reason, such filters are often known as frequency-guiding filters. See, for example, P. V. Mamyshev, "Solitons in optical fiber communication systems", in Fiber Optics Handbook, McGraw-Hill, 2003.
It has also been suggested that narrowband spectral filters, inserted at certain intervals between segments of nonlinear positive dispersion fiber, can significantly increase the dynamic range of a nonlinear-fiber-based dispersion compensator. See, for example, U.S. Patent Publication Number 2004-0184815, published 23 Sep. 2004, and assigned to the assignee of the present case. Similar to soliton transmission, the increase is achieved by limiting the signal distortion and timing jitter that arises from the nonlinear mixing of the optical data signal and broadband ASE noise.
For application in wavelength-division-multiplexed optical transmission systems, frequency-guiding or noise-rejecting spectral filters need to have multiple passbands, one for each channel. Since WDM channels are typically positioned at standard frequencies corresponding to the ITU grid, with spacing of 50 GHz or an integer multiple thereof (typically 100, 200, or 400 GHz), the same relatively small periodicity is required of a bandpass filter.
To reduce the amount of additional signal amplification required in a soliton-transmission application, it is desirable to use frequency-guiding filters with low insertion loss. For use in dynamic dispersion compensation applications, low filter loss is critical, since optical signal power must be kept close to the fundamental soliton power at every point within the nonlinear fiber.
Several technologies have been used or suggested for producing low loss periodic (frequency or spectrum-periodic) filters. One well-known technology is based on fiber Mach-Zehnder interferometers, using the so-called BFT (biconic fused tapered) couplers. In a typical BFT Mach-Zehnder interferometer, two dissimilar fibers are fused and tapered together at two different points. Approximately half of the light entering the first fuse point in one of the fibers is transferred to the second fiber. The interferometer is completed at the second fuse point, at which the light is coupled back into the first fiber. Unfortunately it is difficult to manufacture this type of device with bandpass periodicity as small as 50-400 GHz, because this requires a relatively large fiber length between tapers.
Periodic filters can also be made using planar waveguide interferometers, but small spacing between transmission peaks is difficult to achieve with this technology as well.
Filters with small spectral periods can be made using thin-film Fabry-Perot etalons or bulk optics based Mach-Zehnder interferometers, but they typically have an insertion loss on the order of 1 dB or even higher because of the additional optics required to collimate the light beam from the input fiber and to couple it into the output fiber.
Modal interference within multi-mode fiber has also been used to produce spectrally-periodic (or "comb") filters. For example, in A. J. Poustie, N. Finlayson, P. Harper, "Multiwavelength fiber laser using a spatial mode beating filter", Optics letters, v. 19, No. 10, pp. 716-717, 1994, a comb filter is formed within a laser cavity by splicing a section of multi-mode fiber between two sections of a single-mode fiber. Similarly, in Q. Li, C-H Lin, P-Y Tseng, H. P. Lee, "Demonstration of High Extinction Ratio Modal Interference in a Multi-mode Fiber and Its Applications for All-Fiber Comb Filter and High-Temperature Sensor", Optics Communications 250 (2005), 280-285, modal interference within a multi-mode fiber was used to produce a spectrally periodic filter with relatively small period. But insertion loss (>2 dB) and filtering performance were less than optimal for soliton-based systems, and particularly for dynamic dispersion compensation.
A need thus exists to develop suitable filters and suitable methods for producing filters with relatively high bandpass periodicity (of 400-50 GHz, or even tighter spacing) together with low insertion loss and sufficient extinction ratio (of at least 10 dB or more).

Low loss spectrally periodic all-fiber filters


In a quadrature circuit, when a large frequency variation is detected, the carrier reproduction is conducted by using the carrier reproduction loop having a signal distortion but a small delay, and then, if the reproduced carrier becomes stable at some degree, the carrier reproduction is conducted by using the carrier reproduction loop having a less signal distortion but a large delay. When the number of the errors detected by an error detecting and correcting circuit is larger than a predetermined value, a selector supplies a digital in-phase signal and a digital quadrature signal outputted from A/D converters located before a waveform equalizer, to a carrier phase error detecting circuit which generates a digital phase error signal feedback through a D/A converter to a local carrier oscillator. When the number of errors detected by the error detecting/correcting circuit is not larger than the predetermined value, the selector supplies a digital in-phase demodulated signal and a digital quadrature demodulated signal outputted from the waveform equalizer to the carrier phase error detecting circuit.

1. Field of the Invention
The present invention relates to a multilevel QAM (quadrature amplitude modulation) demodulation circuit, and more specifically to a carrier reproduction control loop circuit for a local carrier oscillator for demodulation.
2. Description of Related Art
A multilevel QAM transmission system, which is one of digital transmission systems, has been well known in the field of a microwave radio communication from the past. Recently, attention has been paid to a bi-directional TV, an internet distribution using a cable modem, etc., and the multilevel QAM transmission system is being studied as the technology for transferring a large amount of digital data in the field of a cable transmission.
In the multilevel QAM transmission system in the field of the radio communication, a major problem is how to compensate for transmission distortion caused by a channel characteristics variation attributable to various factors including meteorological conditions. However, since communication is based on a fixed channel in one-to-one relation, a problem of the transmission distortion caused by reflection and another problem of the channel switch-over could not have become a major problem.
In a cable transmission, however, the transmission channel characteristics depends upon a construction of the transmission channel, and therefore, the degree of transmission distortion does not change almost. On the other hand, since the cable transmission is fundamentally based on a one-to-multipoint transmission, the transmission distortion is caused by reflection in a transmission cable. In addition, since it is necessary to conduct the transmission while switching over from one channel to another, a quickness of synchronism detection after a frequently occurring channel switch-over becomes an important problem. In the other words, the problems which were not the major problems in the radio transmission, have becomes the major problems in the cable transmission.
On the other hand, in order to reduce the cost of apparatuses, research is required to construct a roll-off filter into a digital LSI circuit, in place of a conventional analog SAW (surface acoustic wave) filter.
Referring to FIG. 1, there is shown a block diagram illustrating a construction of a conventional quadrature demodulation circuit used in a conventional multilevel QAM demodulation system and using a digital roll-off filter.
As shown in FIG. 1, the conventional quadrature demodulation circuit is so constructed that, an intermediate frequency signal (abbreviated to an "IF signal" hereinafter) (multilevel QAM signal) supplied to a signal input terminal 1, is divided into two signals, namely, a first IF signal and a second IF signal. The first IF signal is supplied to a mixer 3 where the input signal is multiplied with an in-phase (equiphase or same-phase) local carrier which is reproduced in a voltage controlled local carrier oscillator (abbreviated to a "VCO" hereinafter) 5, and the mixed signal is supplied through a low pass filter (abbreviated to a "LPF") 20 for the purpose of eliminating surplus high frequency components, so that an in-phase signal I is obtained. On the other hand, the second IF signal is supplied to a mixer 4 where the second IF signal is multiplied with a quadrature local carrier which is obtained by supplying the local carrier reproduced in the VCO 5, into a 90.degree. phase shifter 6, and the output of the mixer 4 is supplied to the a low pass filter 21 for the purpose of eliminating surplus high frequency components, so that a quadrature signal Q is obtained.
The in-phase signal I and the quadrature signal Q are supplied to an analog to digital (A/D) converters 7 and 8, respectively, so that the analog in-phase signal I and the analog quadrature signal Q are converted into a digital in-phase signal ID and a digital quadrature signal QD, respectively. The digital in-phase signal ID and the digital quadrature signal QD are supplied through roll-off filters 9 and 10, respectively, to a waveform equalizer 12, in which these signals are subjected to a waveform equalizing processing, and then, converted into an in-phase demodulation signal IMD and a quadrature demodulation signal QMD, respectively.
The in-phase demodulation signal IMD and the quadrature demodulation signal QMD, obtained from the waveform equalizer 12, are converted by a code conversion circuit 16, and then, an error detection/correction is conducted by an error detection/correction circuit 17, so that an error corrected signal is outputted through a data output terminal 18.
Furthermore, the in-phase demodulation signal IMD and the quadrature demodulation signal QMD are fed back to a carrier phase error detection circuit 11, in which a carrier phase error is detected, and an error signal is fed back through a digital to analog (D/A) converter 19 to the VCO 5, so that the VCO 5 reproduces the local carrier having a correct frequency and phase. Thus, a control loop is constituted.
Here, the conventional carrier phase error detection is conducted by using the outputs of the waveform equalizer 12. The reason for this is that: If the carrier phase error detection was conducted by using the signals which have not yet been subjected to the waveform equalizing processing, since the signals includes the transmission distortion, the carrier phase error detection circuit 11 mis-discriminates the transmission distortion as the phase error to change the control voltage supplied to the VCO 5, with the result that the local carrier rather becomes unstable.
However, when the roll-off filters 9 and 10, which were constructed of the analog SAW filter in the prior art, are constituted of a digital circuit, the roll-off filters 9 and 10 are put after the A/D converters 7 and 8 as shown in FIG. 1. In this case, in order to obtain a desired characteristics, the roll-off filter must have a number of taps, with the result that the carrier recovery or reproduction loop delay becomes large.
In order to realize a stable carrier reproduction, for example, Japanese Patent Application Pre-examination Publication No. JP-A-02-150145, (an English abstract of which is available from the Japanese Patent Office, and the content of the English abstract of JP-A-02-150145 is incorporated by reference in its entirety into this application) proposes a multilevel QAM transmission system for a multiplex digital radio transmission, which is configured to adaptively switch over one signal channel to another in accordance with the degree of stability in frequency.
Referring to FIG. 2, there is shown a block diagram illustrating the construction of the quadrature demodulation circuit used in the multilevel QAM transmission system proposed by JP-A-02-150145. In FIG. 2, elements similar or corresponding to those shown in FIG. 1 are given the same Reference Numerals, and explanation thereof will be omitted.
As seen from comparison between FIGS. 1 and 2, the carrier phase error detection circuit 11 shown in FIG. 1 is replaced with a carrier phase error detection circuit 30, which comprises a control circuit 301 receiving a pair of input signals of the waveform equalizer 12 for generating a phase error signal, another control circuit 302 receiving the in-phase demodulation signal IMD and the quadrature demodulation signal QMD outputted from the waveform equalizer 12, for generating a phase error signal, a selector 303 receiving the phase error signal generated by the control circuit 301 and the phase error signal generated by the control circuit 301, a comparator 304 comparing the phase error signal generated by the control circuit 301 with the phase error signal generated by the control circuit 301, for generating a control signal for the selector 303, and a loop filter 305 receiving an output of the selector 303 for filtering the received signal to output the filtered signal to the D/A converter 19. In addition, the error detection/correction circuit 17 is not provided in the circuit shown in FIG. 2, but this is not an essential difference.
In the circuit shown in FIG. 2, the phase error signal (or control result) obtained from the input signals of the waveform equalizer 12 is compared with the phase error signal (or control result) obtained from the output signals of the waveform equalizer 12. Here, it is considered that, if both are consistent, it is called a "stationary time", and if both are not consistent, it is called an "unstationary time", namely, in a condition in which since the transmission distortion occurs, the waveform equalizing processing is conducted in the waveform equalizer 12. Therefore, at the stationary time, a control loop having a small delay is constituted by using the input signals of the waveform equalizer 12, and at the unstationary time, a control loop having a large delay is constituted by using the output signals of the waveform equalizer 12. As a result, since the control loop having the small delay is used at the stationary time, it is possible to provide a circuit having a fast response to frequency variation.
In the cable transmission, however, the transmission channel characteristics is determined by fixed factors including the structure of the transmission channel, not by variable factors such as meteorological conditions. Therefore, the transmission channel of a bad condition remains bad indefinitely, so that the control loop having the large delay is constituted always.
In addition, when the channel is switched over, the control loop becomes the control loop having the large delay, and therefore, the delay time is not improved until the synchronism becomes stable.
Furthermore, since the roll-off filter is included both in the control loop having the large delay and in the control loop having the small delay, the loop delay cannot be shortened.
As mentioned above, in the conventional quadrature demodulation circuit, since the roll-off filter and the waveform equalizer are included in the carrier reproduction loop, the response to the frequency variation is low. Therefore, when the channel is switched over, it is not possible to quickly responds to the frequency change, and therefore, a substantial time is required, until the synchronism becomes stable.
The reason for this is considered as follows: In the conventional quadrature demodulation circuit, if the roll-off filter, which was constructed of the analog SAW filter in the prior art, is digitized and internally provided in a demodulation IC for the purpose of reduce the cost, it is necessary to provide a number of taps in order to obtain a desired characteristics, with the result that the loop delay becomes large.
In the multilevel QAM transmission system, the waveform equalizer is indispensable to compensate for the waveform distortion. In applications including CATV (cable television), the waveform equalizer inevitably has an increased number of taps, and therefore, the loop delay becomes further large.

Quadrature demodulation circuit with carrier control loop


A structure of a shielding case is changed into a fixing apparatus for holding a digital photography module on a mobile telephone. A first component of the fixing apparatus has several folded sides. These folded sides are used to fix the horizontal movement of the digital photography module. A second component of the fixing apparatus has at least one engagement portion. The engagement portion is used to fix the vertical movement of the digital photography module.

1. Field of Invention
The present invention relates to a portable electronic device. More particularly, the present invention relates to a fixing apparatus.
2. Description of Related Art
Mobile telephones are portable and wireless telephone devices installed on conveyances, such as vehicles and ships, or carried on someone's person. Mobile telephones are different from extensions of the telephone or long distance radio transceivers. Mobile telephones provide users with the same functions of immobile telephones as well as the greater convenience of mobility. By cooperating with international direct dialing, mobile telephone users can communicate with any other person in the world in an available range of a mobile telephone system.
Following the great progress of the communication bandwidth, the color panel and the digital photography module, more and more mobile telephones are configured with digital modules thereon to provide users further with video support. A mobile telephone user can use a built-in digital photography module of a mobile telephone to take pictures or record videos anytime and anywhere, and then transmits the pictures or videos by the mobile telephone to a remote receiver who can then get the firsthand information.
FIG. 1 illustrates a schematic view of a mobile telephone with a built-in digital photography module. A mobile telephone 100 includes a digital photography module 102 on a case surface 104 thereof. A user can use the digital photography module 102 to take pictures or record videos. For good photography effect, the digital photography module 102 usually needs to be fixed in an immovable position to prevent the pictures or videos taken thereby from being out of focus due to shaking.
A convention fixing way is use an additional plastic element to fix the position of the digital photography module 102 on the mobile telephone 100. However, considering the electromagnetic interference, a conductive lacquer needs to be spread on surfaces of the plastic element to prevent electromagnetic waves from passing through the plastic element to damage electronic elements inside the mobile telephone 100. If the conductive lacquer on the plastic element falls out, the electromagnetic protection function thereof is destroyed. Moreover, because the plastic element is an additional element, it may become loose and unable to fix the digital photography module 102 securely. Therefore, the convention fixing way using the plastic element to fix and protect the digital photography module 102 is unstable and uneconomical.

Fixing apparatus used to hold a digital photography module on a mobile telephone


A semiconductor laser module according to the present invention includes a polarization-synthesizing module having a polarization-synthesizing means configured to polarization synthesize two laser beams and a holder member for holding the polarization-synthesizing means with an approximately cylindrical circumferential surface, and a supporting member for supporting the holder member at least to rotate about an central axis and fixing the holder member at a predetermined position.

(1) Technical Field
The present invention relates to a semiconductor laser module and a method of manufacturing the same.
(2) Description of Related Art
Up to now, a semiconductor laser device that outputs laser light obtained by combining two laser lights (or through polarization synthesis of two laser lights) has been disclosed in, for example, U.S. Pat. No. 5,589,684 B or JP 2000-31575 A.
FIG. 15 is an explanatory diagram showing a conventional semiconductor laser apparatus as disclosed in U.S. Pat. No. 5,589,684.
As shown in FIG. 15, the conventional semiconductor laser apparatus comprises a first semiconductor laser device 100 and a second semiconductor laser device 101 emitting laser beams of identical wavelengths in mutually orthogonal directions; a first collimating lens 102 configured to collimate the laser beam emitted from the first semiconductor laser device 100; a second collimating lens 103 configured to collimate the laser beam emitted from the second semiconductor laser device 101; a polarization-synthesizing device (i.e. cube beam splitter) 104 configured to polarization-synthesize the laser beams that were collimated by the first collimating lens 102 and the second collimating lens 103; a convergent lens 105 configured to converge the laser beams polarization-synthesized by the polarization-synthesizing device 104; and an optical fiber 106 for receiving the laser beams converged by the convergent lens 105 and letting the laser beams travel outside.
In the conventional semiconductor laser apparatus, the laser beams are emitted from the first semiconductor laser device 100 and the second semiconductor laser device 101 in mutually vertical directions and are polarization-synthesized by the polarization-synthesizing device 104 to obtain a laser beam of reduced DOP (Degree Of Polarization) from the optical fiber 106. (This technology will hereinafter be called a prior art 1.)
Further, Japanese Patent Application Laid-open No. 2000-31575 discloses a semiconductor laser module including a thermoelectric cooler; a first and a second semiconductor laser devices mounted on the thermoelectric cooler; two lenses each for collimating the first and second laser beams emitted from the first and second semiconductor laser devices; a polarization-synthesizer for synthesizing the first and second laser beams; and an optical fiber for receiving the laser beams emerging from the polarization synthesizer and letting the laser beams travel outside (see FIG. 5 or FIG. 10 of Japanese Patent Application Laid-open No. 2000-31575). Moreover, the first and second semiconductor laser devices are formed in an LD array, in which the laser diodes are arrayed at a pitch between their light-emitting centers (hereinafter referred to as inter-emission-center pitch) of 500 μm. Further, the first and second convergent lenses are formed in a lens array such as a ball lens array or a Fresnel lens array. (This technology will hereinafter be called a prior art 2.)
Further, the applicant of the present invention has proposed a semiconductor laser module in which two laser beams emitted from two light-emitting stripes (hereinafter referred to simply as stripes) formed in a single semiconductor laser device are polarization-synthesized and received by an optical fiber. (See Japanese patent application No. 2001-383840, for example. This technology will hereinafter be called a related art.)
FIG. 2 is an explanatory diagram schematically showing a configuration of the semiconductor laser module of the related art.
As shown in FIG. 2, the semiconductor laser module of the related art includes a single semiconductor laser device 2 having a first stripe 9 and a second stripe 10 formed in parallel to each other interposed therebetween and emitting a first laser beam K1 and a second laser beam K2 from a front end face (i.e. an end face on right-hand side in FIG. 2) of the first stripe 9 and the second stripe 10 respectively; a first lens 4 positioned so that the first laser beam K1 and the second laser beam K2 are incident therealong and configured to separate the first laser beam K1 and the second laser beam K2 in the direction in which the first and second stripes 9, 10 are arrayed; a half-wave plate 6 (a polarization rotating means) configured to rotate a polarization direction of at least one of the first and second laser beam K1, K2 (i.e. the first laser beam K1 in FIG. 2) by a predetermined angle (by 90 degrees, for example); a PBC (Polarization Beam Combiner) 7 configured to optically synthesize therealong the first laser beam K1 and the second laser beam K2; and an optical fiber 8 optically coupled to the synthesized laser beams emerging from the PBC 7 and letting the synthesized beams to travel outside.
In addition, a prism 5 is disposed between the first lens 4 and the half-wave plate 6 so that the first laser beam K1 and the second laser beam K2 are incident thereon and output therefrom along their respective optical axes parallel to each other. This prism 5 includes an incident surface 5a positioned so that the first laser beam K1 and the second laser beam K2 are incident and vertically disposed to the optical axis of optical fiber 8, and an exit surface 5b inclined at a predetermined angle from the incident surface 5a. Further, a second lens 16 is disposed between the birefringence element 7 and the optical fiber 8 in order to optically couple the first and second laser beams K1, K2 optically combined by the PBC 7 to the optical fiber 8 which is supported by a ferrule 23.
The first laser beam K1 and the second laser beam K2 emitted respectively from the front end face 2a of the first stripe 9 and the second stripe 10 of the semiconductor laser device 2 travel through the first lens 4, intersect and separate until the separation between the two beams is enough, before entering the prism 5.
During propagation through the prism 5, the first laser beam K1 and the second laser beam K2 are made parallel to each other, and are emitted from the prism 5. The first laser beam K1 then enters the half-wave plate 6, where its polarization direction is rotated by 90 degrees, and then enters a first input port 7a of the PBC 7, while the second laser beam K2 enters a second input port 7b of the PBC 7.
The first laser beam K1 incident on the first input port 7a and the second laser beam K2 incident on the second input port 7b are optically coupled along the PBC 7, and output from an output port 7c.
The laser beams emerging from the output port 7c of the PBC 7 are then converged by the second lens 16, enter an end face of the optical fiber 8 supported by the ferrule 23, and propagate to outside.
In Prior Art 1, Prior Art 2, and Related Art, a semiconductor laser device is fixed to the top of a base by solder or the like, and YAG laser welding or the like is used to fix a lens to the top of the base. If the thickness of solder is not uniform or the lens is YAG-welded at a wrong position in this fixing process, for example, it makes the plane defined by optical axes of two laser lights that are emitted from the one or two semiconductor laser devices unparallel to a mount surface (principal surface) of the base to which the semiconductor laser device(s) is (are) to be fixed. In this case, the two laser lights have different spot positions at the output port of the light combining element, and the exit optical axes do not coincide with each other, leading to a failure in combining the light beams appropriately.
In the case of polarization synthesis, a problem is that the intensity of synthesized light after polarization synthesis is lowered by polarization split, which takes place when laser light emitted from the semiconductor laser device enters the light combining element (polarized wave synthesizing element) while polarized in an inappropriate polarization direction.
A specific description is given on the problems referring to FIGS. 16. FIG. 16(A) is a perspective view schematically showing the structure of the semiconductor laser module of Related Art illustrated in FIG. 2. FIG. 16(B) is a diagram showing positions and polarization directions of the laser lights K1 and K2 on the incident surface 5a of the prism 5. FIG. 16(C) is a diagram showing positions and polarization directions of the laser lights K1 and K2 in the input ports 7a and 7b of the PBC 7.
As shown in FIGS. 16(A) and 16(B), when the two laser lights K1 and K2 enter the prism 5 while a plane P, which is defined by the optical axes of the two laser lights K1 and K2, is not parallel to a mount surface Q of a base to which the semiconductor laser device 2 and others are fixed, the laser lights K1 and K2 on the exit surfaces 5b have different refraction angles. Accordingly, the optical axes of the two laser lights that have exited the prism are no longer on the same plane. After the two laser lights K1 and K2 exit the exit surfaces 5b, the laser light K1 of the two laser lights K1 and K2 enters the input port 7a of the light combining element (PBC) 7 with its polarization direction rotated by 90° by the half-wave plate 6 whereas the laser light K2 enters the input port 7b of the light combining element 7 as it is. The laser lights are then subjected to polarization synthesis in the light combining element 7 and exit from the output port 7c. As a result, the laser lights K1 and K2 in the output port 7c are offset from each other in the Y-axis direction by δ and the exit optical axes of the laser lights K1 and K2 do not coincide with each other.
In the case where a polarized wave synthesizing element is used as a light combining element as in the semiconductor laser module of Related Art shown in FIG. 2, the two laser lights K1 and K2 enter the input ports 7a and 7b, respectively, of the light combining element (PBC) 7 with their polarization directions shifted from a given direction as shown in FIG. 16(C). This causes polarization split in which the laser light K1 is split into an ordinary ray K1n and an extraordinary ray K1a, and the laser light K2 is split into an ordinary ray K2n and an extraordinary ray K2a (see FIG. 16(A)). As a result, the intensity of laser light that exits from the output port 7c is lowered.
Accordingly, synthesized light coupled to the optical fiber 8 does not have desired intensity and degree of polarization in some cases.

Semiconductor laser module and method of manufacturing the same


An applicator for cream-like or gel-like compounds having an elevator in a container that is advanced toward a dome applicator head at one end of the container by turning a helical ramp that engages ramp follows attached to the elevator, the ramp having valleys therein that allow pressure that is present in the compound after a portion has been dispensed through the apertures to force the elevator away from the dome so as to relieve the pressure and prevent the formation of liquid-phase separation products from weeping through the apertures.

Deodorants, pharmaceuticals and beauty aids in the form of cream or gel products are often applied by forcing them through apertures in the dome of a container with an elevator within the container that is advanced toward the dome by turning a knob or by some other manually operable mechanism.
One of the problems encountered is that continuous application of pressure by the elevator in the contained cream product, after a desired amount of gel or cream (such as an antiperspirant, for example) has been dispensed causes a liquid phase separation of the cream or any product that would separate into the liquid phase under compression, allowing the silicon portion of an antiperspirant, for example, to separate and flow through the apertures in the dome and down the sides of the container so as to get on the hands of a user as well as on the surface where the container is stored. This is generally referred to as weeping. This same problem may occur with certain gel products.
In some applicators designed to overcome this problem, a spring forces the elevator away from the dome of the container so as to relieve pressure on the cream after a desired amount of cream or gel has been dispensed. Examples of such applicators are described in U.S. Pat. Nos. 3,756,730 and 5,000,356, and in the European Patent No. 95307297.2.


An undercarriage assembly for a tracked vehicle with a prime mover that provides a torque to the tracked vehicle, a final drive sprocket configured to provide a final drive torque on a track, a transmission mechanically coupled to the prime mover and the final drive sprocket to selectively transfer at least some of the torque generated by the prime mover to the final drive sprocket, at least one idler wheel that contacts the track, and an electric motor that provides an idler torque to the at least one idler wheel. Wherein, torque is distributed to the track through both the final drive sprocket and the idler wheel.

Many work machines utilize tracked assemblies for propelling the work machine along an underlying surface. Often, a prime mover such as a gas or diesel engine burns fuel to generate torque that is transferred to the tracked assemblies. The torque is frequently mechanically coupled to the tracked assemblies through a transmission that utilizes clutches, gears, and the like to provide an adequate amount of torque to the tracked assemblies to facilitate movement of the work machine.
Large or high-powered machines require prime movers capable of producing substantial torque in order to properly move the work machine along with any implements or work tools coupled thereto. Accordingly, the transmission must be able to transfer the torque generated by the prime mover to the tracked assemblies without being damaged. If a single work machine chassis is offered with different prime movers capable of generating different torque values, each prime mover is often coupled with a specific transmission to ensure the transmission can transfer the torque to the tracked assemblies without being damaged. Further, tracked work machines are often torque limited based on the capabilities of the transmission. In this situation, the work machine cannot utilize a prime mover that provides a greater torque than the transmission can transfer without being damaged.
Accordingly, there is a need for a tracked work machine that can utilize a prime mover that provides high torque to the tracked assemblies without damaging the transmission.

Power distribution through undercarriage idler wheels


A device for stiffening workpieces of paper includes elements that provide the workpieces with an undulated profile. The elements may be in the form of freely rotatable disks or belts that revolve around freely rotatable rollers. Respective sections of the disks or belts which come in contact with the workpieces extend through a common central plane in such a way that they provide the workpieces with an undulated profile. In order to prevent the profiling elements from laterally displacing the workpieces, a conveyor is provided which clamps the workpieces between respective conveyor sections.

1. Field of the Invention
This invention pertains to a device for stiffening workpieces of paper or the like and, in particular, to a device for stiffening tubular sections used in the manufacture of bags.
2. Description of Related Art
When collecting or additionally processing sections that have been severed from a paper web, the sections need to be stacked or transported. The flexibility or limberness of the paper sections can cause problems in properly positioned depositing or additional transporting of these paper sections.
In the manufacture of paper bags, paper webs are initially unwound from reels. The paper webs are placed on top of one another in a multilayered fashion. Subsequently, tubular webs are formed by folding in overlapping side parts and gluing together the overlapping regions. Tubular sections that are either stacked or deposited on a slat belt conveyor in imbricated fashion at high speeds are subsequently severed from these tubular webs. In order to prevent the tubular sections that were severed from the tubular web from assuming an oblique position and not exactly aligning with one another due to their limberness and/or flexibility while they are deposited on the slat belt conveyor, it is known to convey the tubular sections through cooperating disks that provide the tubular sections with an undulated profile. This undulated profile stiffens the tubular sections such that they are no longer able to bend or overturn about their lateral axes. However, the profiling disks that are usually arranged on both sides of the central longitudinal axis of the workpieces tend to laterally entrain the material of the tubular sections in an uncontrollable fashion. In this case, it is uncertain on which side the material is entrained. The lateral edges of the workpieces, therefore, may not be exactly aligned when the workpieces are deposited on the subsequently arranged slat belt conveyor in imbricated fashion.

Device for stiffening flat workpieces of paper or the like


An electronic device for enhancing voltage driving efficiency for a source driver and a liquid crystal display (LCD) monitor is disclosed. The electronic device includes a reference voltage generator, a plurality of first coupling lines, a second coupling line wider than the first coupling lines, a data statistical unit and a reference voltage modulating module. The reference voltage generator generates a plurality of grayscale reference voltages. Each first coupling line and the second coupling line are utilized for transmitting one of the grayscale reference voltages. The data statistic unit statistically calculates a plurality of grayscale data values to generate a statistical result indicating a grayscale reference voltage corresponding to the most of the grayscale data values among the grayscale reference voltages. The reference voltage modulating module adjusts transmission relationship between the grayscale reference voltages and the first coupling lines and the second coupling line according to the statistic result.

1. Field of the Invention
The present invention relates to an electronic device for enhancing voltage driving efficiency for a source driver and a liquid crystal display (LCD) monitor thereof, and more particularly to an electronic device and a LCD monitor thereof for enhancing efficiency of driving grayscale reference voltages to reduce total charging time for equivalent capacitance units.
2. Description of the Prior Art
A liquid crystal display (LCD) monitor featuring slim design, low power consumption, and no radiation pollution has been applied widely to a computer system, a mobile phone, a Personal Digital Assistant (PDA) and so on. The operation principle of a LCD monitor is based on different alignments of liquid crystal molecules with different effects of polarization and deflection. By means of different alignments of the liquid crystal molecules, the light can be allowed to pass through in varying amount, thus constituting different intensities of the emitting light and different levels of grayscales in red, blue and green.
Please refer to FIG. 1, which is a schematic diagram of a thin film transistor (TFT) LCD monitor 10 according to the prior art. The LCD monitor 10 includes an LCD panel 100, a timing control circuit 102, a data line output circuit 104, and a scan line output circuit 106. The LCD panel 100 includes two substrates with liquid crystal material in between. One substrate has a plurality of data lines 110, a plurality of scan lines (gate lines) 112 perpendicular to the data lines 110, and a plurality of TFTs 114. For convenient explanation, only four TFTs 114 are shown in FIG. 1. There exists one TFT 114 at every intersection of each of the plurality of data lines 110 and scan lines 112 in practice. In other words, the TFTs 114 are distributed on the LCD panel 100 in matrix. Each data line 110 corresponds to a column of the LCD monitor 100, each scan line 112 corresponds to a row of the LCD monitor 10, and each TFT 114 corresponds to a pixel. Furthermore, the circuit characteristic of the two substrates of the LCD monitor corresponding to each pixel is regarded as an equivalent capacitance unit 116.
In the LCD monitor 10, the timing control circuit 102 generates input signals to the data line output circuit 104 and the scan line output circuit 106, respectively. The scan line output circuit 106 inputs a pulse into the scan lines 112 to conduct the TFTs 114, and thereby voltage signals driven from the data line output circuit 104 to the data lines 110 can be transmitted to the equivalent capacitance units 116 through the TFTs 114 to control the gray level status of the corresponding pixel.
As the LCD monitor 10 is a large size monitor, the data line output circuit 104 usually includes multiple source drivers. Each source driver is responsible for signal output to data lines 110. The main function of the source drivers is to transfer the received digital grayscale data into analog driving voltages and perform Gamma correction, driving voltage polarity control, etc.
Please refer to FIG. 2, which is an internal schematic diagram of a source driver 20 of the data line output circuit 104 shown in FIG. 1. A LCD panel 26 coupled to the source driver 20 can display 64 levels of grayscales (denoted by values 0-63). The source driver includes a reference voltage generator 22, a data latch 24, digital to analog converters (DACs) DAC(1)-DAC(640), coupling lines L1-L64 and operational amplifiers (OPs) OP(1)-OP(64). The data latch 24 is utilized to receive 6 bits (capable of representing grayscale values from 0 to 63) grayscale data values GD0-GD63 which correspond to DAC (1)-DAC (640) and equivalent capacitances C1-C64 on the LCD panel 26 respectively. The reference voltage generator 22 generates grayscale reference voltages GV0-GV63 which are regarded as Gamma correction voltages when the source driver 20 equipped with the Gamma correction function. The OP (1)˜OP (64) drive the grayscale reference voltages GV0-GV63 to feed DAC (1)-DAC (640) through the coupling lines L1-L64, respectively. For simplicity, assume that the voltage gain of OP (1)˜OP (64) is equal to 1. Based on GD0˜GD639, DAC (1)˜DAC (640) select the corresponding coupling lines to output the corresponding reference voltages to the equivalent capacitances C1-C640. For example, if grayscale data values GD0 and GD1 are 32 and 63 respectively, the DAC (1) and DAC (2) selects the coupling lines L33 and L64 to output the grayscale reference voltages GV32 and GV63.
As mentioned above, when more DACs receive the same grayscale reference data, the coupling line corresponding to the grayscale reference data is selected by the DACs at the same time. This makes the corresponding OP's loading heavier such that it is hard to drive the grayscale reference voltages. More charging time will be needed for the equivalent capacitances, resulting in decrease of the displaying efficiency.

Electronic device for enhancing voltage driving efficiency for a source driver and LCD monitor thereof


This invention relates to a humane animal live trap for application to the immobilizing of various animals and mammals. The device consists of a generally vertically positioned, compressed sleeve or cylindrical body of a generally resilient interwoven spring-like stranded material forming by strands interwoven at acute angles with each other a hollow doubly tapered cylindrical opening the sleeve is adapted to elongate when the trigger is actuated and the compressed sleeve is released by the sleeve guards, from its state of compression and circumvallates the animal or animal part that entered in to the hollow sleeve with its central tapered cylindrical opening, and tripped the trigger located centrally at the sleeve bottom. The sleeve is comprised of a loop series which is formed by the upper ends of the resilient strands, to allow compressing and depressing of the centrally doubly tapered cylindrical opening to release the captured animal and reset the trap sleeve.

1. FIELD OF INVENTION
This invention relates to a humane animal live trap for application to the immobilizing of various animals and mammals. The device consists of a generally vertically positioned, compressed sleeve or cylindrical body of a generally resilient interwoven spring-like stranded material forming by strands interwoven at acute angles with each other a hollow doubly tapered cylindrical opening the sleeve is adapted to elongate when the trigger is actuated and the compressed sleeve is released by the sleeve guards, from its state of compression and circumvallates the animal or animal part that entered in to the hollow sleeve with its central tapered cylindrical opening, and tripped the trigger located centrally at the sleeve bottom. The sleeve is comprised of a loop series which is formed by the upper ends of the resilient strands, to allow compressing and depressing of the centrally doubly tapered cylindrical opening to release the captured animal and reset the trap sleeve.
This provides accessing and automatic tightening of the sleeve around the paw or extremity of the animal and thus immobilizing the animal or animal part that has been inserted therein. To facilitate the removal of the animal or part from the sleeve, which sleeve has a longitudinal dimension being slightly lesser in distance than the overall distance between a the part of the animal to be trapped and its body.
A slight compression of the trigger against its resilient characteristic position releases the sleeve restraint bar slide from its compressed condition, which in turn allows the sleeve to receive and immobilize the animal or animal part. Using the principal of the well known "Chinese finger trap", the lateral forces of resilient strands of the sleeve hug the animal part (foot, paw, or other extremity). The sprung trap hugs and restrains the animal part with uniform circular and diagonal pressing. This provides distribution of the compressive forces uniformly over the outer surface of the animal part, in a manner circumvallates the trapped animal or animal part, thus avoiding any of the painful and often damaging action of prior art type, "bear trap" two high pressure point, traps.
The term "circumvallate" in Webster is defined as something being surrounded by or as if by a rampart, specially enclosed by a ridge, wall or material; and is defined in Steadman's Medical Dictionary (1982) as denoting a structure surrounded by a wall, as the circumvallate papillae of the tongue.
The invention relates further to a method of making device comprising the steps of; forming a resilient clamping sleeve or cylindrical body of a generally resilient stranded material having and forming a double tapered open center sleeve adapted to circumvallate the animal part, by an action of natural springing extension and resultant diminution of the circumference of the double helix formed sleeve. This provides a series of uniformly radially disposed intertwined sleeve forming strands extending along at least one axis element thereof to provide spring-like urging of the extension of the sleeve toward and constrictingly around the animal part or its supporting member. A slight compression of the trigger, against its resilient characterization and tending to release the sleeve from its compressed condition, which in turn allows the sleeve that has a lower section with a LARGER diameter and has a middle section with a smaller diameter and the upper section that has the upper end section with a LARGER opening formed of sufficient size to receive the animal or animal part. Using the principal of the well known "Chinese finger trap", the lateral forces of resilient hugging of the animal part (foot, paw, or other extremity) by the resilient strands forming the sleeve, the sprung trap hugs and restrains the animal part with uniform circular and diagonal pressing.
This provides distribution of the compression forces uniformly over the outer surface of the animal part. To effect a slight compression of the sleeve against its resilient character and tendency in locus around and against the periphery of the animal or animal part trapped, can cause the release of the animal, as more particularly described herein.


A method of integrating wireless and wireline billing information in an integrated wireless-wireline system. Existing Automatic Measurement Accounting (AMA) capabilities resident in the Advanced Intelligent Network (AIN) Service Control Point (SCP) of the wireline section are leveraged, thereby avoiding development of an independent billing capability in the wireless section. Problems associated with the allocation and exchange of the wireless call identifier are avoided.

1. Field of the Invention
The present invention relates to a communication system having an integrated wireline-wireless system (IWWS) architecture. More particularly, the present invention relates to a method for integrating billing capabilities in the IWWS.
2. Description of the Related Art
Recent efforts to expand wireless communication and to import wireline features and performance into wireless communication systems have resulted in dramatic changes to network architecture. An IWWS has been proposed in U.S. application Ser. No. 08/942,895, filed Oct. 2, 1997 (Attorney Docket No. STA.001), which is incorporated herein by reference.
The proposed IWWS provides an architecture which does not require a Mobile Switching Center (MSC), but which effectively uses existing wireline switching equipment and capabilities to provide integrated wireless/wireline services to wireless users. The resulting "meld" of wireless communication system components with wireline network components offers many commercial and technical advantages to service providers. For example, the IWWS architecture allows service providers to reduce network equipment purchases, to lower maintenance costs, and to simplify equipment integration. In fact, service providers offering wireline and wireless services have the option of leveraging existing wireline capabilities, without recourse to a separately procured MSC, to effect lower cost wireless service.
Historically, wireline and wireless sections of a network, integrated or otherwise, have respectively collected separate billing data and produced separate billing records. Each wireless call within the network was allocated a unique identifier common to the wireline and wireless billing records. This identifier was subsequently used to merge wireline and wireless billing records. Several investigations have considered the problem of allocating the identifier, and the problem of communicating the identifier between the wireless and wireline sections.
The term "call," as used herein, refers broadly to PCS, fax, and other data exchanges, as well as voice data exchanges. The term "communicat[ing]" refers to a broad class of information exchanges between network sections and elements. Communication may be made via hardware and/or open air interfaces, and may involve complex, bi-directional hand-shaking as is commonly understood in the telecommunications field.
In addition to the wireless call identifier, other mechanisms and methodologies have been proposed to allow downstream merging of the wireless and wireline billing records. At a minimum, such "post-processing" requires a significant extra step with its associated time and cost. More commonly, the post-processing of separately acquired wireless and wireline billing data requires the development and maintenance of hardware and software to perform the merging function.

Method for integrated billing in an integrated wireline-wireless system