In order to prevent the occurrence of corrosion due to the sliding of a relatively wide aluminum conductive layer (12) such as a power source conductive layer or a ground conductive layer, formed on a semiconductor substrate (11), breakage of a lower conductive layer due to the sliding of an upper aluminum conductive layer (12) in case of a multilayer interconnection, and the creation of voids in the lower aluminum conductive layer due to the moisture beneath the relatively wide metal conductive layer in case of a multi layer interconnection etc., the conductive layer structure is constructed so that the conductive layer (12) relatively great in width is divided into several conductive layer portions and so that the width of each of the divided conductive layer portions is in a range of 10 .mu.m to 40 .mu.m.

Recently, it has become popular to package semiconductor devices such as, for example, IC or LSI devices using a resin instead of a ceramic material.
Conventionally, encapsulating a semiconductor chip by use of resin is performed by fixing, in a mold, a lead frame having the semiconductor chip mounted thereon and by flowing a sealing resin thereinto having a high temperature of approximately 170.degree. C. When the resulting mold has been cooled down to a room temperature, since the silicon, which is a material constituting the chip, has a small thermal expansion coefficient and the sealing resin has a thermal expansion coefficient greater than that of silicon, the surface of the chip comes to receive a stress acting toward a center thereof due to shrinkage of the resin. As a result, a sliding phenomenon takes place in which an aluminum conductive layer having a large width, such as a high voltage power source conductive layer or a ground conductive layer, is forcibly biased toward the center of the chip. Such a phenomenon occurs also when cyclic temperature tests are performed.
To prevent the occurrence of the sliding phenomenon of the aluminum conductive layer, some countermeasures have been proposed in Japanese Laid Open Patent Nos. 62-111451, 62-174948 or 63-211648 which disclose that the aluminum conductive layer width is made narrow to constitute the conductive layers by a plurality of the narrower layer, or that the substantial width of the conductive layer is made small by providing a slit or slits in the layer, etc.
However, if the conductive layer or the ground conductive layer is made excessively small in width, electromigration will inconveniently occur. In addition, even if the aluminum conductive layer is divided into several parts, the effect of preventing the occurrence of the aluminum conductive layer sliding phenomenon will vanish if the divided conductive layer portion is made relatively large in width.

Structure of a semiconductor chip having a conductive layer


A golf bag with stand having legs being capable of being automatically extended by weight of golf clubs received in the golf bag when the golf bag stands in inclined position and also being automatically retracted by weight the golf clubs when the golf bag is carried and transported in horizontal position. The golf bag a golf bag body having an opening, a pair of hinge members mounted on a position close to the opening, a pair of legs pivotally mounted on the hinge members at bent ends thereof, a pair of arms which are mounted on the bent ends of the legs at lower ends thereof and have head portions at upper ends thereof, respectively, a pair of connecting links which are connected to the head portions of the arms at one ends thereof and disposed inside of the golf bag body at the other ends thereof, and a case for receiving golf clubs which is fixed to an inner surface of the body at one end thereof and connected to the head portions of the arms at the other end thereof, the other end being movable upwards and downwards. The golf bag may also have a hook mounted on an end of the golf bag and a connecting strap connected to the head portions of the arms at one end thereof and selectively connected to the hook at the other end thereof.

1. Field of the Invention
The present invention relates to golf bags with support stand, and more particularly to golf bags with support stand wherein a pair of legs are movable between their extended position and their retracted position by ascending and descending movement of case mounted therein for receiving golf clubs as result of weight of golf clubs.
2. Description of the Prior Art
Conventionally, there have been proposed various golf bags which have stands for standing the golf bags in their inclined positions. For example, such type of golf bags are disclosed in U.S. Pat. Nos. 4,506,854, 4,676,464 and 4,921,192 and Korean Utility Model Application Nos. 90-2102, 90-5195, 90-9915, 91-6800 and 91-6801, the Korean applications being filed by the present applicant. The golf bags disclosed in the above-mentioned patents and applications have stands for standing the golf bags in their inclined positions.
However, since the above-mentioned golf bags must be inevitably provided with complicate and expensive actuating members between the golf bags and their legs in order to extend and retract the legs, it is required complicate manufacturing process and high cost to manufacture the stands and the golf bags.


The present invention provides electrodeposited copper foil with a carrier foil which permits the formation of finer-pitch circuits and also enables the multilayer process to be easily performed to meet the requirements for recent printed wiring boards. According to the invention, there is provided electrodeposited copper foil with a carrier foil in which an adhesive interface layer is formed on a surface of the carrier foil and an electrodeposited copper foil layer is formed on the adhesive interface layer, which is characterized in that the electrodeposited copper foil layer is provided with a passivated layer formed without performing roughening treatment as nodular treatment and that a nickel-zinc alloy consisting essentially of 50 to 99% nickel by weight and 50 to 1% zinc by weight is adopted as the passivated layer.

Electrodeposited copper foil with a carrier foil has hitherto been used as a basic material for the manufacturing of printed wiring boards which are widely used in the field of the electrical and electronic industries. In general, electrodeposited copper foil with a carrier foil is bonded to a polymer insulating substrate, such as a glass-epoxy substrate, a phenol substrate and a polyimide, by hot pressing forming to form a copper-clad laminate, and is used in the manufacturing of printed wiring boards.
Electrodeposited copper foil with a carrier foil prevents wrinkles from occurring in the copper foil during hot press forming, thereby preventing the exudation of resin from copper foil cracks initiated by wrinkle portions and from a prepreg. Also, electrodeposited copper foil with a carrier foil is receiving attention as epoch-making copper foil which solves such problems as described above and can prevent foreign matter from mixing onto the copper foil surface until the completion of hot press forming.
In general, this electrodeposited copper foil with a carrier foil is broadly divided into the peelable type and the etchable type, and it is known that in the bonding of the electrodeposited copper foil to the carrier foil, an inorganic or organic adhesive interface layer is provided. For example, there are electrodeposited copper foil with a carrier foil having an inorganic adhesive interface layer of oxides, sulfides, etc. of Cr, Pb, Ni, etc. and electrodeposited copper foil with a carrier foil having an organic adhesive interface layer of nitrogen-containing compounds, sulfur-containing compounds, carboxylic acid, etc. (refer to the Japanese Patent Laid-Open No. 2000-309898), and there are many types of electrodeposited copper foil with a carrier foil.
Incidentally, recent years have seen increasing requirements for the downsizing of electronics and electric machinery and apparatus without showing any sign of an end to this trend, and multilayer design of printed wiring boards, which are the basic parts of electronics and electric equipment, high density design of copper foil circuits, and high density packaging design of mounted parts have been required more strongly than before. For this reason, it has been strongly required that recent copper foil provide properties which can easily realize ultrafine pitches in the etching during the manufacturing of printed wiring boards and also enables the multilayer process to be easily performed.
The hitherto used electrodeposited copper foil with a carrier foil permits the formation of fine circuits, because it can be formed into a copper-clad laminate without causing wrinkles etc. to occur in its very thin electrodeposited copper foil. However, recent printed wiring boards are strongly required to permit the formation of finer-pitch circuits. In order to form fine circuits which have further advanced in comparison with conventional one, it is thought that there is room for improvement not only in conventional electrodeposited copper foil, but also in conventional electrodeposited copper foil with a carrier foil. The present invention has been made under the circumstances as described above and has as its object the provision of electrodeposited copper foil with a carrier foil which permits the realization of fine circuits of such a level as might not be realized with conventional electrodeposited copper foil with a carrier foil and which also enables the multilayer process to be easily performed.

This patent is subject to a terminal disclaimer.

Electrodeposited copper foil with carrier foil


A relatively dense composite refractory material which has reasonable strength and good thermal shock resistance comprises an alumina matrix material within which are dispersed particles of polycrystalline zirconia comprises from 1.0 to 40 percent by volume of the composite material. Each particle of zirconia is an agglomerate of microcrystals which are strongly bonded together. Due to the agglomerates of the bonding together of the microcrystals at their grain boundaries. The microcrystals contain no matrix material within their agglomerates, and exhibit strong thermal expansion anisotropy. They have a size such that cracks do not form spontaneously within the agglomerates during cooling from about 1600.degree. C. to room temperature. Typically the agglomerates have a mean diameter of from 10 to 15 micrometers, while the average diameter of the microcrystals in an agglomerate is from 1 to 2 micrometers.

It is well known that brittle materials cannot be simultaneously dense (which is synonymous with corrosion resistance) and thermal shock resistant. For example, if samples of a dense alumina refractory are heated in a furnace to progressively higher temperatures and then quenched in water to room temperature, and the mechanical strength of the quenched samples is measured, it will be found that at a critical temperature (which varies according to the size of the sample and the conditions under which the experiment is conducted), there is a sudden and significant reduction in the strength retained by the sample after the quenching. In one reported instance, experiments with samples of a dense alumina showed that:
(a) after quenching the sample following heating in a furnace to temperatures of up to (typically) 150.degree. C., the modulus of rupture of the quenched sample remains high (about 230 MPa in a test run conducted by the present inventor); that is, no damage to the sample has resulted from the quenching; PA0 (b) with samples quenched after heating to a furnace temperature of about 150.degree. C., the modulus of rupture of the quenched sample drops dramatically (to about 60 MPa in the test run), showing that the thermal stresses generated during the quench are sufficient to activate pre-existing surface flaws (cracks) in the alumina refractory, so that these flaws propagate catastrophically through the material, causing the sudden loss of strength of the quenched sample; and PA0 (c) when the sample is quenched from temperatures in excess of about 240 .degree.the strength of the quenched samples falls approximately exponentially, the modulus of rupture reaching a value of about 19 MPa in the test run when the furnace temperature was 400.degree. C. PA0 (a) occupy from 1.0 percent by volume to 40 percent by volume of the composite refractory material; PA0 (b) each comprise a polycrystalline agglomerate of microcrystals with no matrix material within the agglomerate, the microcrystals (i) being strongly bonded together, (ii) exhibiting a strong thermal expansion anisotropy, and (iii) having a size such that cracks do not form spontaneously within the agglomerate during cooling from a temperature of about 1600.degree. C. to room temperature; and PA0 (c) each have a mean diameter of from 10 to 15 micrometers, with the microcrystals therein having a mean diameter in the range of from 1 to 2 micrometers. PA0 (a) a matrix of a refractory material; PA0 (b) particles of a ceramic material dispersed in the matrix, the particles occupying from 1.0 percent by volume to 40 percent by volume of the composite refractory material, each particle comprising a polycrystalline agglomerate of microcrystals with no matrix material within the agglomerate, the microcrystals (i) being strongly bonded together, (ii) exhibiting a strong thermal expansion anisotropy, and (iii) having a size such that cracks do not form spontaneously within the polycrystalline agglomerate during cooling from a temperature of about 1600.degree. C. to room temperature; the ceramic material and the refractory material of the matrix being mutually chemically inert in the temperature range of the use of the composite refractory material. PA0 (a) mixing together a powder of the matrix alumina material, a powder of the polycrystalline ceramic material to be dispersed within the matrix material, and a fugitive binder; PA0 (b) allowing the mixture to dry; PA0 (c) granulating the dried powder mixture; PA0 (d) preforming the granulated powder into billets by die pressing; PA0 (e) isostatically pressing the die pressed billets to form green billets for sintering; PA0 (f) heating the green billets at a predetermined rate until a sintering temperature in the range from 1200.degree. C. to 1800.degree. C. is reached; PA0 (g) holding the green billets at the sintering temperature for a period in the range from 0 to 5 hours; and PA0 (h) furnace cooling the sintered billets to ambient temperature.
To overcome the problem of unstable crack propagation in the quenching process, the traditional approach has been to introduce porosity into the refractory material. This reducation in density also reduces the low temperature strength of the refractory but the effect of quenching from higher temperatures is less dramatic. For example, samples of the same alumina material that has been described above which have a 5 percent porosity had an inherent low temperature strength of about half that of the dense material, the low temperature modulus of rupture being approximately 103 MPa. At the critical temperature of 150.degree. C., quenching reduced the strength of the material with 5 percent porosity, but the modulus of rupture of the quenched material was about 87 MPa. Quenching samples of this material from a temperature of 400.degree. C. produced samples having a modulus of rupture of about 70 MPa.
A refractory brick which is high in alumina content and has a porosity in the range from 15 percent to 25 percent completely solves the thermal shock problem. The modulus of rupture of quenched samples of such a material varies substantially linearly from about 19 MPa when the material is quenched from low temperatures to about 17 MPa when it is quenched from a temperature of about 400.degree. C. The small loss in strength when the material is quenched from higher temperatures is because there has been stable crack propagation, but the mechanical strength at low temperatures has been sacrificed, being only about one tenth of the strength of a dense commercial alumina ceramic material. An even more serious sacrifice has also occurred, for in the case of a porous alumina refractory brick, the rate of slag erosion (corrosion) of the alumina increases exponentially with the increase in porosity.
Another illustration of the problems that can be encountered when dense ceramic materials are subjected to thermal shock is found in ceramic capacitors made from barium titanate (BaTiO.sub.3). These capacitors are important components of modern integrated circuit boards, but they are prone to failure as a consequence of thermal shock when metal electrical contacts are soldered onto the capacitors.
All ceramics contain flaws generated during manufacturing and handling which render them prone to failure by unstable crack propagation when they are subject to tensile stresses. In the case of multilayer ceramic oxide capacitors, even if only 0.5 percent of such capacitors fail, as components of integrated circuit boards, the annual economic loss in the USA is about $20,000,000. The topic of reliability of multilayer ceramic capacitors is discussed in detail in the Journal of the American Ceramic Society, volume 72, number 12, 1989, pages 2221-2294.

Commonwealth Scientific & Industrial Research Organization


A spark plug for a stationary, gas-powered internal combustion engine, having a metallic body, an insulator mounted in a passage of the body, a center electrode passing through the insulator, a ground electrode mounted on the body that, together with the center electrode, forms a spark air gap, and a cap attached to the body. The cap shields the center and ground electrodes from the combustion chamber after the spark plug is installed in a combustion chamber of the internal combustion engine, and that, together with the body of the spark plug, forms a prechamber in which the center and ground electrodes are located. The cap has at least one opening that permits gas exchange between the prechamber and the space outside of the prechamber. A sensor receiving space is provided in the body of the spark plug, which space opens into the prechamber and serves to receive a pressure sensor in a replaceable manner, and a connecting channel for routing a connecting line of the pressure sensor leads from the sensor receiving space to the end of the body opposite the cap.

A spark plug of this nature is disclosed in DE 101 44 976 A1. In this spark plug, the center electrode and the ground electrode do not project directly into the combustion chamber of the internal combustion engine, but instead into a prechamber that is formed at the forward end of the spark plug and communicates with the combustion chamber of the internal combustion engine through one or more openings. As a result of the openings in the prechamber, an exchange of gas is possible between the prechamber and the combustion chamber. Spark plugs of this type, which are also known as prechamber spark plugs, are used for the ignition of lean fuel/air mixtures in stationary, gas-powered internal combustion engines. A fuel/air mixture is referred to as lean when the ratio, lambda, of the quantity of air actually present in the combustion chamber to the quantity of air stoichiometrically required for complete combustion of the fuel is greater than 1, where lambda values of 1.6 to 1.7 are desired. In the compression stroke of the internal combustion engine, an ignitable mixture is introduced into the prechamber through the openings of the prechamber. In terms of its function, the prechamber is a precombustion chamber. The ignitable gas/air mixture flowing into the prechamber is first ignited in the prechamber by means of an ignition spark produced between the center electrode and the ground electrode of the spark plug. The flame produced in the prechamber is ejected from the prechamber through the openings therein as a result of the pressure of the combustion arising in the prechamber, and ignites the lean fuel/air mixture present outside the prechamber in the combustion chamber of the internal combustion engine.
Stationary, gas-powered internal combustion engines are designed for a very long service life and accordingly are also in use for long time periods. In order to optimize combustion and running performance, as well as to reduce fuel consumption and pollutant emissions, it is desirable to obtain information about the combustion taking place in the combustion chamber and to adjust the engine controller on the basis of this information. In stationary, gas-powered internal combustion engines that have already been in use for a relatively long time, there oftentimes is still no way of acquiring information from the combustion chamber during operation, since no appropriate sensors or channels are provided in the combustion chamber. It is very resource-intensive to retrofit openings or channels terminating in the combustion chamber, so retrofitting is not possible in practical terms.

Spark plug for a gas-powered internal combustion engine


Techniques are provided for preventing suspicious computer operations using a multi-channel protocol. An exemplary method includes detecting an operation comprising suspicious activity on a first device of a user; in response to the detecting, providing a control signal to suspend the operation on the first device; providing a notification of the suspicious activity to an identity system, wherein the identity system (i) provides an approval request to a distinct second device of the user to verify whether the operation is an authorized operation, (ii) receives a reply from the second device comprising an indication of whether the operation is an authorized operation, and (iii) notifies the first device of whether the operation is an authorized operation; and providing a control signal to enable the operation to proceed on the first device responsive to the reply from the second device indicating that the operation was an authorized operation.

A computer network is typically configured to incorporate security functionality in order to protect the computers of the network against malicious activity. Malware (i.e., malicious software) is a common computer security risk that typically aims to disrupt computer operations, gather sensitive information, and/or gain access to a computing device. Such malicious activity can include, for example, ransomware attacks in which malware infecting one or more computers of the computer network will systematically encrypt files on those computers and possibly other computers of the network. The attacker withholds the corresponding decryption key unless a ransom is paid by the victim.
Conventional techniques for combatting ransomware and other malware attacks detect the attacks and notify a security analyst of the event. A need exists for techniques for preventing suspicious computer operations unless they are authorized by a legitimate user.

Methods and apparatus for protecting against suspicious computer operations using multi-channel protocol


The disclosure relates an illumination system that has an optical axis and a polarization-influencing arrangement. The arrangement can include a first wedge plate with a first wedge direction which extends perpendicularly to the optical axis in the direction of a maximum change in thickness of the first wedge plate, and a second wedge plate with a second wedge direction which extends perpendicularly to the optical axis in the direction of a maximum change in thickness of the second wedge plate. The first wedge plate and the second wedge plate can be arranged rotatably about the optical axis. The first wedge plate and the second wedge plate can be respectively made from birefringent crystal material having a respective optical crystal axis. In a starting position of the arrangement in which the first wedge direction and the second wedge direction extend in mutually parallel relationship, the optical crystal axis of the first wedge plate and the optical crystal axis of the second wedge plate can be oriented at an angle of 45°±3° relative to each other. One of the two crystal axes can be oriented perpendicularly or parallel to the preferred polarization direction of the light impinging on the arrangement.

The production of light which as far as possible is unpolarized is desired in an illumination system of a microlithographic projection exposure apparatus for many uses. In general, the light emitted by the corresponding laser source is linearly polarized light. Accordingly, the linearly polarized light should be depolarized. To the extent that there is residual polarization, this can lead to effects as a consequence of polarization-dependent transmission or reflection properties of mirrors and because of AR-layers which are present on lenses and which are dependent in respect of their strength and the preferred polarization direction which is respectively obtained, on the illumination setting which is used.
An illumination system is known which includes an arrangement for modifying the degree of polarization, which in the direction of light propagation in succession has a lambda/4 plate, a lambda/2 plate and wedge-shaped deflection prisms which are freely rotatable in order to achieve a variation in the degree of polarization of the illumination light between a linear polarization state and an unpolarized state, via a change in the orientation of the optical crystal axes.

Illumination system of a microlithographic projection exposure apparatus


A system is provided with the ability to automatically shut off a backup power source from further sourcing power for the system, when AC is absent, after the backup power source has sourced power for the system for a period of time.

Advances in integrated circuits and microprocessor technologies have made possible the availability of computing devices, such as personal computers, with computing power that was once reserved for "main frames". As a result, increasingly computing devices, such as personal computers, are being used for a wide array of computations, and often, "important" computations.
However, computing devices, such as personal computers, are still being provided without integral backup power support. Further, unlike their server brethrens, typically, supplemental external backup power supports are seldom employed. Thus, whenever the power supply fails, these computing devices go into an un-powered state, and the system states are lost.
For those computing devices endowed with power management implemented in accordance with the Advanced Configuration and Power Interface (ACPI) (jointly developed by Hewlett Packard, Intel, et al), the computing devices are said to be in the "un-powered" G3 state.
Moreover, when power is restored, and a user presses the power button of the computing device, the user typically gets a number of messages from the operating system (OS) of the computing device. Unfortunately, many of these messages are understood by sophisticated users only. Examples of these messages include asking the user whether the user desires to boot the computing device into a safe mode, have the disk drive scanned, and so forth.
If acceptance of computing devices, such as personal computers, is to continue to expand, and the computing devices are to be used by more and more users for an increasing variety of applications, such as "entertainment" applications, it is necessary for their usability, availability, and/or reliability to continue to improve. Further, it is necessary for the usability, availability, and/or reliability to be improved cost effectively.

Automatic shut off of backup power source in the extended absence of AC power


A broadband light source unit that produces a supercontinuum lightwave having a flat spectral form and has a light source that outputs a first source lightwave, which is a pulse lightwave having periodic pulses with a constant intensity, an intensity modulator that receives the first source lightwave, produces a second source lightwave having pulses whose intensities are different from one another, and outputs it, and a nonlinear optical medium section that receives the second source lightwave, produces a supercontinuum lightwave having a wavelength band broadened through a nonlinear optical phenomenon, and outputs it. An optical analyzer includes a light-applying section that applies a supercontinuum lightwave outputted from the broadband light source unit to a light-receiving region of a measurement-undergoing object, and an image pickup section that receives a lightwave generated at the light-receiving region by the application of the supercontinuum lightwave and picks up an image of the measurement-undergoing object.

1. Field of the Invention
The present invention relates to a broadband light source unit and an optical analyzer incorporating the unit.
2. Description of the Related Background Art
A supercontinuum lightwave (SC lightwave), which is a type of broadband lightwaves, can be obtained by passing a pulse lightwave having a narrow spectral width, or the like, through a nonlinear optical medium. The lightwave broadens its spectral width through undergoing dispersion and a nonlinear optical effect in the nonlinear optical medium. Usually, the spectral width of the SC lightwave is broadened to the extent of 10 to 100 times the spectral width of the inputted pulse lightwave. The SC lightwave combines the characteristics of a white lightwave and a laser lightwave and can be produced using a relatively simple method. Consequently, the SC lightwave attracts attention as a multiwavelength light source for optical communication and as an illuminating light source for an analyzer. However, the SC lightwave has a problem in that it sometimes cannot achieve a flat spectral form. For example, the spectrum, which is supposed to be flat, is sometimes split into a plurality of portions having different wavelengths.
In view of the above circumstances, M. S. Kahn et al. have disclosed a broadband light source unit intended to flatten the spectral form of the SC lightwave in a paper entitled "Short-term spectral stability of super-continuum source using noise-like pulses generated from an EDF laser," CLE02005, CMV5. In this light source unit, a lightwave outputted from a noise-like-mode fiber laser is introduced into a highly nonlinear fiber (HNLF). This method suppresses the spectral intensity deviation in a range of 1,200 to 1,700 nm in wavelength over the conventional SC lightwave produced by using a mode-locked actuating pulse. Nevertheless, the noise-like laser is not only limited in its applications but also disadvantageous both in cost and in reproducibility as a product.

Broadband light source unit that produces a supercontinuum lightwave, and optical analyzer


Disclosed is a tablet liquid crystal display device which senses light applied from a light irradiating device to receive an input signal applied from an exterior. The tablet liquid crystal display device comprising: a liquid crystal panel for displaying an image, including a black matrix formed in a lattice form; and a signal recognizing section for generating an electromotive force according to a light signal inputted from an exterior, wherein the signal recognizing section comprises: a plurality of first photoelectromotive force generation layers, each of which is located above the black matrix in a sectional view, is overlapped with the black matrix in a plan view, and extends in a first direction; an insulating layer deposited to cover at least an upper surface of the first electromotive force generation layers; a plurality of second photoelectromotive force generation layers, each of which is located above the black matrix in a sectional view, is overlapped with the black matrix in a plan view, and extends in a second direction perpendicular to the first direction; and a protection layer deposited over an entire area of the signal recognizing section.

1. Field of the Invention
The present invention relates to a tablet liquid crystal display device, and more particularly to a tablet liquid crystal display device which senses light applied from a light irradiating device to receive an input signal applied from an exterior.
2. Description of the Prior Art
As generally known in the art, a tablet personal computer (PC) including a tablet liquid crystal display device is a PC having merits of both a notebook computer and a personal digital assistant (PDA). Such a tablet PC has the same basic structure as that of a notebook computer to enable the user to directly write, and can be assembled/disassembled to be used as a paper. The tablet liquid crystal display device of the tablet PC includes a separate reception device for receiving exterior signals, may be classified into a touch screen type device and a digitizer type device depending on input and reception methods.
In the touch screen type of tablet liquid crystal display device, a touch screen panel is attached to a front portion of the liquid crystal display device and generates a voltage or current signal corresponding to a position pressed by a user finger or a pressure transmitting device which is an input means, thereby receiving a command or information indicated by the user. A liquid crystal panel of the liquid crystal display device displays an image according to a command or information indicated by the user as described above. Meanwhile, the digitizer type of tablet liquid crystal display device has a separate antenna board attached to a rear portion of the liquid crystal display device in order to receive an input signal from an electronic pen which is an input means. Therefore, a command or information indicated by the user is inputted through the electronic pen, and a liquid crystal panel of the liquid crystal display device displays an image according to such a command or information.
From among such conventional tablet liquid crystal display devices, since the touch screen type of tablet liquid crystal display device includes a touch panel attached to the front portion of the liquid crystal display device, the permeability of the liquid crystal panel is deteriorated, so that the displayed image has a decreased luminance. Also, according to the conventional touch screen type of tablet liquid crystal display device, since the touch panel and the liquid crystal panel include a plurality of transparent layers, a light interference phenomenon may occur between the transparent layers, thereby deteriorating the image quality of the display screen. Besides, since an input signal is inputted by a user finger or the pressure transmitting device, a touch error of the user may cause a wrong operation of the tablet liquid crystal display device.
Meanwhile, in the digitizer type of tablet liquid crystal display device, since the antenna board for receiving an input signal from the electronic pen and a control panel for signal processing are separately contained, the thickness, weight and manufacturing cost of a system including the tablet liquid crystal display device increase, thereby deteriorating the value of the tablet liquid crystal display device. Also, the electromagnetic waves generated from the electronic pen may cause an image signal distortion phenomenon at an outer portion of a display area due to a metallic bezel surrounding the outline of the liquid crystal display device, thereby causing an input error and a wrong operation of the tablet PC to deteriorate the image quality of the display screen. Besides, the electromagnetic waves generated from the electronic pen and driving signals of the liquid crystal display device are interfered with each other, so that the tablet liquid crystal display device may malfunction.


A vacuum attachment for a vacuum cleaner including a housing having a vacuum channel. A roller is rotatably and displaceably disposed in a region of the vacuum channel and driveable during a vacuuming operation. The roller includes at least one of bristles and baffle walls configured to be in partial contact with a floor covering during the vacuuming operation. At least one roller magnet is disposed on the roller at least one end thereof. At least one housing magnet is non-rotatably disposed on the housing axially adjacent to the at least one roller magnet and configured to interact with the at least one roller magnet so as to alternately at least one of attract and repel the roller so that the roller performs an oscillatory motion as it rotates.

German document DE 43 43 432 C2 describes a vacuum attachment for a vacuum cleaner having a rotating brush roller. In that approach, the bristles agitate the pile in the region of the suction mouth to provide effective pick-up of dirt. In the process, the carpet pile is "opened up" as the carpet surface is combed by a bristle bundle in the moving direction of the nozzle, or in the opposite direction, during rotation of the brush roller. However, the bristles are effective only in the direction of rotation of the brush roller.
To improve the cleaning performance of such a vacuum attachment, the attachments described in DE 101 26 354 A1, DE 102 10 862 A1, DE 102 00 346 A1 and DE 12 43 838 Bare designed such that the brush roller and/or its drive is capable of performing an oscillatory motion in an axial direction in addition to its rotation. Various motor or mechanical drives are described in the aforementioned documents.
Japanese document JP 2001 245 832 A, describes a brush roller of a vacuum attachment that can be floatingly supported by magnets.
A vacuum attachment having a rotatably mounted roller is known from GB 2 376 876 A.


A control unit box and one of standard point members are provided close to a connection of first and second bars. A standard plane is defined by the standard point members. A loop antenna is provided in a mount unit situated on the top surface of the control unit box. The box is positioned such that a ratio of a second distance to a first distance is less than tan 8xc2x0. The first distance is from the point member to the mount unit, along the standard plane, and the second distance is from the standard plane to the top surface of the mount unit, along a direction perpendicular to the standard plane. The antenna is connected to an oscillator of 310 MHz. With respect to the antenna, the total length is approximately 0.48 m, a height from the top surface of the unit box is approximately 9.5 mm, and the inner diameter is approximately 25 mm.

1. Field of the Invention
This invention relates to a target for use in a photogrammetric analytical measurement system, in which a survey map is produced on the basis of a set of photographed pictures obtained at different photographing positions.
2. Description of the Related Art
For example, photogrammetry is carried out at a traffic accident spot. The traffic accident spot is photographed by a camera from at least two different positions, and a survey map of the traffic accident spot is produced, based on a set of photographed pictures obtained at the different positions. A target is placed in a photogrammetry spot, for example the above-mentioned traffic accident spot, in order to calculate positional data of the camera at which the pictures are photographed. The target includes three standard point members (indicating members). The three standard point members are made of a material of high luminance. Namely, an amount of incident light reflected from the material is increased to facilitate recognition of the standard point members in the photographed pictures.
The photogrammetry spot is photographed with the target by the camera at different positions and angles. The photographed images are converted to a plurality of digital image data which are stored in a memory of a computing system. A pair of digital image data are chosen from among the plurality of digital image data, and they are displayed on a monitor which is connected to the computing system.
A given measurement point is selected in one of the chosen pair of digital image data, and a corresponding measurement point is selected in another of the chosen pair of digital image data. The selection is carried out with a cursor by manipulating a mouse. This operation is repeatedly performed such that a plurality of pairs of measurement points are selected. A series of predetermined operations is carried out based on positional data of the above-mentioned standard points and the indicated measurement points, so that a survey map of the photogrammetry spot is produced.
Besides the positional data of the standard point members, data regarding positioning of the target is required for the predetermined operations, and therefore, the target for the above-mentioned photogrammetric analytical measurement system is provided with sensors, for example a tilt sensor, an azimuth sensor and so on. Information from these sensors is utilized to create the data regarding the position of the target. The data regarding the position of the target is transmitted to the camera during a photographing operation via an antenna which is provided in the target. After the data is received by the camera, the data is stored in a memory of a processor, which is included in the camera, with the photographed image data.
Usually, a predetermined distance exists between the target and the position of the camera, when the photogrammetry spot is photographed. Further, the target is situated on a surface of a road of the photogrammetry spot, and the camera is positioned at a predetermined height from the surface of the road. Accordingly, a rod antenna may be utilized to make the transmittance from the antenna to the camera highly sensitive.
However, as the rod antenna projects further than other components of the target, the rod antenna may be hit when it is carried, or may be kicked by mistake when it is set on the road. Namely, the rod antenna has a problem in that it is easy to be broken. Further, due to a positional relationship between the standard point members, the rod antenna and the position of the camera, the standard point members may be obstructed by the rod antenna, so that the standard point members may not be photographed. If the standard point members are not photographed, precise positional data of the standard point members can not be obtained, so that the above-mentioned operation for producing a survey map cannot be carried out.
Therefore, an object of the present invention is to provide a target for a photogrammetric analytical measurement system, including an antenna which transmits data to a camera reliably without obstructing any indicating members of the target.
In accordance with an aspect of the present invention, there is provided a target for photogrammetric analytic measurement comprising: a first bar and a second bar which are connected at adjacent end portions; indicating members that are able to be recognized in a photographed image by a camera, placed on the first and second bars to define an identical plane; a box in which sensors for detecting data utilized to calculate a photographing position of the camera, provided on the first bar or the second bar at a position close to the connecting end portion; a loop antenna that transmits the data detected by the sensors to an outer device; and a projecting portion in which the loop antenna is provided, being placed on the box, at a side at which the indicating members are placed, on the first and second bars. A relationship between a first distance and a second distance are defined by an expression to follow. The first distance is along the identical plane between a first indicating member of the indicating members, which is positioned close to the connecting end portion, and the projecting portion. The second distance is along a direction perpendicular to the identical plane between a top surface of the projecting portion and the identical plane. The expression is:
K2/K1 less than tan 8xc2x0
(herein, K1 is the first distance, K2 is the second distance)
Preferably, a total length of a conductor, which is wound to construct the loop antenna, is approximately half of a wavelength of a radio wave sent from the loop antenna. The inner diameter of the winding of the conductor is within a range between approximately 25 mm (millimeters) through 50 mm, and a distance, along the perpendicular direction, between the identical plane and the loop antenna is greater than or equal to approximately 8 mm.
Preferably, the projecting portion has a generally cylindrical configuration which is coaxial with a center axis of the loop antenna. The center axis exists on a bisector of the first indicating member and a second indicating member of the indicating members, which is placed on the first or second bar at which the box is provided, being adjacent to the first indicating member.
Optionally, the projecting portion comprises: a holding member that holds the loop antenna, being fixed on the top surface of the box; and a covering member that protects the loop antenna from the outer side.
Optionally, the projecting portion is fixed on the top surface of the box, being made of resin, and the loop antenna is molded in the projecting portion.
Preferably, the box is positioned at an area of a right angle or an acute angle made by the first and second bars.
As described above, according to the present invention, the data detected by the sensors is transmitted by the loop antenna. Accordingly, the size of the projecting portion in which the antenna is provided can be changed such that the projection above other components of the target, can be reduced. Further, the first indicating member is not obstructed by the antenna in a photographed image, by positioning the projecting portion on the box such that the first distance and the second distance satisfies the aforementioned expression.
Due to the reduction in size of the projecting portion, the projecting portion is prevented from being broken by carelessly hitting or kicking the projecting portion when the target is carried or set on a photogrammetric spot.
Further, according to the present invention, the total length of the conductor, which is wound to construct the loop antenna, is set to approximately half the a wavelength of a radio wave sent from the loop antenna, and the inner diameter of the conductor winding is set to a range between approximately 25 mm through 50 mm, and the distance, along the perpendicular direction, between the identical plane and the loop antenna is set to a value greater than or equal to approximately 8 mm. Therefore, a predetermined communication distance of the antenna can be obtained, so that data utilized for the photogrammetric analytic measurement can be reliably transmitted from the target to an outer device, for example a camera.

Target for photogrammetric analytical measurement system


A semiconductor device testing apparatus that has a laminate structure composed of a contact sheet having a first opening, an elastic sheet having a second opening and a base plate having a third opening. A supply voltage is applied to an external terminal located on a peripheral portion of the contact sheet. A probe of a probe portion is contacted to a signal electrode of a semiconductor device through the third, second and first openings.

1. Field of the Invention
The present invention relates to a semiconductor device testing apparatus, and more particularly to a semiconductor device testing apparatus using a contact sheet made of a flexible and thin sheet material and a high frequency probe having a general structure, in which the supply voltage is applied to the semiconductor device from the power source via an external terminal located on the contact sheet, and in which the high frequency probe contacts with a signal electrode and performs the measurement.
2. Description of the Related Art
A semiconductor device that operates in a bandwidth of equal to or more than 10 GHz often has more supply voltage and ground electrodes, that is, more electrodes for high and low supply voltages and less signal electrodes for inputting and/or outputting operating signals in order to lower the power source impedance. A flexible membrane sheet is often used in a testing apparatus to measure the electrical characteristics of such a semiconductor device.
FIG. 1 is a cross sectional view of a probe card described in Kokusai Kokai No. WO98/58266 as a probe card structure of a semiconductor device testing apparatus using a conventional flexible membrane sheet.
In this figure, by contacting a pad 23a of a semiconductor device 23 to a bump 5c on a flexible membrane sheet 5 located on a printed board 4, power source voltage is supplied through a power supply wiring and a signal is extracted from a signal wiring by connecting a terminal 6 to the wiring on the printed board 4. Particularly, when conducting a high frequency signal, a micro-strip structure, in which signal wiring is formed on the front surface and a ground line is entirely formed on the back surface, is often used.
However, as seen in this figure, because the membrane sheet 5 is inserted in bent shape, the distance between a signal line on the front surface and a ground line on the back surface changes at the bent area and the characteristic impedance of the micro-strip line, which is determined by the distance between the signal line and the ground line, changes. Moreover, the characteristic impedance is disturbed by a discontinuous structure at a junction between the membrane sheet 5 and the printed board 4. When testing a semiconductor device whose operating frequency is low, these effects are small and it is possible to perform the measurement. However, when testing a semiconductor device whose operating frequency is equal to or more than 10 GHz, these effects are large and there is a problem that using a probe structure with the conventional membrane sheet 5 limits the frequency characteristic of a line which transfers a high frequency signal, and the electrical characteristic of the semiconductor device cannot be measured accurately.
An object of the present invention, related to the than the contact sheet, covering the first and second supply voltage applying electrodes and located on the opposite side from the side where said first and second supply voltage applying electrodes of the contact sheet are located; a base plate having a concavity with a shape that matches the outer dimension and thickness of the elastic sheet and the contact sheet, and installed the elastic sheet and the contact sheet in the concavity such that the first and second supply voltage applying electrodes are exposed; a power source portion for applying a predetermined supply voltage to the external terminal on said contact sheet; and a probe portion having a position setting section moving X and Y directions, and Z direction perpendicular to the X and Y directions, assuming the surface of the base plate to be an X-Y plane, and a high frequency probe coupled to the position setting section to electrically contact to the signal electrode of the semiconductor device.
The above mentioned semiconductor device testing apparatus may be such a structure as the contact sheet has a first opening formed at a portion where the first and second wirings are absent; the elastic sheet has a second opening connected with the first opening; the base plate has a third opening connected with the second opening; and a high frequency probe is contacted to the signal electrode through the third, second and first openings.
Further, the semiconductor device testing apparatus may be a structure in which a through-hole filled with a conductive material is formed at a portion of the contact sheet on the measurement of an electrical characteristic of a semiconductor device that has many electrodes and operates at high frequency, is to provide a semiconductor device testing apparatus that applies supply voltages including ground voltage by making an accurate contact with many electrodes, and performs a high frequency signal measurement.
In order to achieve the above object, according to the present invention, there is provided a semiconductor device testing apparatus for testing an electrical characteristic of a semiconductor device which has a first electrode applied a high supply voltage, e.g. positive voltage from a power source, a second electrode applied a low power source voltage, e.g. ground voltage or negative voltage from a power source and signal electrode for inputting and/or outputting an operating signal formed, respectively, on its front surface side. The apparatus comprises a device stage holding the semiconductor device to be tested; a contact sheet including a insulating sheet, first and second supply voltage applying electrodes on the insulating sheet and electrically contacting with the first and second electrodes of the semiconductor device, respectively, at the testing state, first and second external terminals located on a peripheral portion on the insulating sheet and positioned with a lager interval each other than that of the first and second supply voltage applying electrodes, a first wiring connecting the first supply voltage applying electrode and the first external terminal, a second wiring connecting the second supply voltage applying electrode and the second external terminal; elastic sheet having a smaller size signal electrode; a first signal testing electrode connected to the conductive material at one end of the through-hole and contacting the signal electrode is formed; a extracting out wiring layer connected to the conductive material at the other of the through-hole and extending on the contact sheet is formed; a second signal testing electrode connected to the extracting out wiring layer is formed; the high frequency probe is contacted to the second signal testing electrode of the semiconductor device through openings provided, respectively, in the base plate and the elastic sheet; and a support ring located on the side opposite from the second signal testing electrode is provided to support the portion of the contact sheet where the second signal testing electrode is formed.
Moreover, the semiconductor device testing apparatus may be a structure in which a through-hole filled with a conductive material is formed at a portion of the contact sheet on the signal electrode; a first signal testing electrode connected to the conductive material at one end of the through-hole and contacting the signal electrode is formed; a second signal testing electrode connected to the conductive material at the other end of the through-hole is formed; and the high frequency probe is contacted to the second signal testing electrode of the semiconductor device through openings provided, respectively, in the base plate and the elastic sheet.
Further, each of the first and second supply voltage applying electrodes of the contact sheet may have a bump electrode structure. Or else, each of the first and second electrodes of the semiconductor device may have a bump electrode structure.
Furthermore, the first signal-testing electrode on the contact sheet may have a bump electrode structure. Or else, the signal electrode of the semiconductor device may have a bump electrode structure.
Yet further, a bypass capacitor connecting between the first wiring and the second wiring may be provided.
Moreover, the contact sheet may have a larger area than the semiconductor device to be tested.
Further, the semiconductor device may be tested in a semiconductor wafer state in which a plurality of the semiconductor devices are formed. Or else, a form of the semiconductor device to be tested may be a bare chip diced from a semiconductor wafer.
Furthermore, the semiconductor device testing apparatus may further comprise a scrubbing portion. The scrubbing portion includes a piezoelectric device moving the device stage and a controller to control the piezoelectric device so that the electrodes on the semiconductor device and the electrodes on the contact sheet are relatively vibrated at their contact state to break a thin oxide film which has been unfavorably formed on the surface on said electrodes.

Semiconductor device testing apparatus having a contact sheet and probe for testing high frequency characteristics


A method for maintaining security of a retail terminal having a docking station and a portable computer includes the computer-implemented steps of receiving an unlocking attempt to unlock the portable computer from the docking station; determining whether the unlocking attempt is valid; and unlocking the portable computer from the docking station if the unlocking attempt is valid. A multi-functional retail terminal is also disclosed.

The present invention relates generally to point of sale terminals, and more particularly to a multi-functional retail terminal having a software controlled locking mechanism for securing a portable computer to a docking station.
Retailers are currently maintaining three separate store automation platforms in their stores in order to remain competitive. These automation platforms include data collect terminals, point of sale (POS) systems, and multi-functional terminals. The data collect terminals are primarily used to perform a physical inventory, cycle counts, price management, store receiving and transfers, markups, and markdowns. The POS systems are primarily used to record transactions, to perform credit authorization, and to feed host inventory and merchandising systems. Furthermore, the multi-functional terminals are used to provide decision support, sales assisted shopping, category management, scheduling, and other managerial tasks.
The problem with maintaining these three automation solution platforms is that each piece on average costs $2,000. Therefore, retailers are finding it very difficult to afford to keep up to date due to the cost multiplier of maintaining three automation solution platforms. Therefore, there is needed a multi-functional terminal which provides the retailer with the functionality of all three automation solution platforms.
One such multi-functional terminal is that of the present invention and includes a docking station and a portable computer which is capable of general purpose computing. As a result of this configuration, the multi-functional terminal can provide the retailer with a wide array of functionality via various software programs executing on the portable computer. However, the problem with portable computers is that they are highly portable as well as highly concealable. Therefore, the retailer is faced with issues of how to maintain tight control over who, when and how the portable computers are used.
Docking stations serve a well-known purpose of connecting portable computers to peripheral components, computer networks and recharging equipment. Some docking stations also provide an option for locking a portable computing device securely to the docking station using a conventional key and mechanical latch. However, the loss or theft of keys can result in costs incurred to re-key the lock(s) if security is compromised. In addition, breakage and reliability problems with keys can result in key replacement costs. If each docking station has a unique key associated therewith, then each user must be provided with a key for each docking station which the person is authorized to use. In a retail environment, this could mean issuing dozens of keys per user. In addition, if a user is issued keys on a daily basis for the docking station(s) that the user is expected to use, then the flexibility to easily move to other docking stations is lost. In contrast, if all docking stations in a given department, or in the entire store use the same keys, then individual accountability for the portable computers is lost, and tracking mobile users can be complicated and time consuming.
What is needed therefore for this multi-functional retail terminal is a method for securing a portable computing device to a docking station which overcomes the disadvantages associated with using a conventional key and mechanical latch to lock a portable computing device securely to a docking station.

Multi-functional retail terminal and associated method


Hard imaging devices and hard imaging device operational methods are described. According to one arrangement, a hard imaging device includes a pen adjacent to a first location of a media path and configured to eject a plurality of droplets of a liquid marking agent in a direction towards the media moving along the media path to form hard images using the media, the ejection of the droplets of the liquid marking agent from the pen creating aerosol droplets of the liquid marking agent, and a gas injection system adjacent to a second location of the media path which is downstream from the first location with respect to a direction of movement of the media along the media path, and wherein the gas injection system is configured to inject a gas towards the media.

Imaging devices capable of printing images upon paper and other media are ubiquitous and used in many applications including monochrome and color applications. The use and popularity of these devices continues to increase as consumers at the office and home have increased their reliance upon electronic and digital devices, such as computers, digital cameras, telecommunications equipment, etc.
A variety of methods of forming hard images upon media exist and are used in various applications and environments, such as home, the workplace and commercial printing establishments. Some examples of devices capable of providing different types of printing include laser printers, impact printers, inkjet printers, commercial digital presses, etc.
Some configurations of printers which use liquid marking agents may be subjected to contamination by satellites formed during printing operations. For example, in some inkjet configurations, the jetting of drops of a liquid marking agent may also result in the formation of satellites of the liquid marking agent which may contaminate media being imaged upon, nozzles, or other equipment of the printer. Imaging operations may be suspended to implement cleaning operations to remove the contamination which results in reduced productivity of the printer or press.
At least some aspects of the disclosure are directed towards improved imaging methods and apparatus.

Hewlett-Packard Development Company, L.P.


A circuit for applying delays to ATM cells in an ISDN comprises a dummy cell generating circuit for generating dummy cells at a controllable time interval, a first cell filter for extracting from an input signal only those cells to which delays are to be applied, a cell multiplexing circuit for synthesizing an output of the dummy cell generating circuit and an output of the cell filter, a delay adding circuit for delaying an output of the cell multiplexing circuit, and a second cell filter for eliminating the dummy cells from the output of the delay adding circuit. In case the dummy cell generating circuit is arranged to generate idle cells, the second cell filter is omitted. By multiplexing the signal cells inputted to the delay adding circuit with the dummy cells, the time taken for the input cells to pass through a shift register constituting the delay adding circuit can be controlled.

1. Field of the Invention
The present invention generally relates to a tester for evaluating influence given to a terminal unit by variations in propagation delay time of information cells transmitted through a high-speed wide-band ISDN (Integrated Services Digital Network) system, and more particularly to an ATM cell delaying circuit for giving variable delays to the ATM cells.
The ATM (Asynchronous Transfer Mode) transmission technique is considered a promising means in implementing a transmission network of the high-speed wide-band ISDN system. With the ATM transmission, a variety of information or data are divided into blocks known as cells in the art, each of which has a fixed length and is affixed with a header, wherein transmission efficiency is improved through statistical multiplexing of these cells. Consequently, the propagation delay time of the cells on the network tends to vary in dependence on the amount of traffic. (H. Murakami et al., Considerations on ATM Network Performance Planning, IEICE Trans. Commun., Vol. E75-B, No. 7, July, 1992, hereby incorporated by reference.) Accordingly, means for correcting the variation in the propagating delay time must be incorporated in the terminal unit of the high-speed wide-band ISDN system. (H. Uematsu et al., STM Signal Transfer Technique in ATM Network, Conference Proceedings of IEEE International Conference on Communications, Jun. 14-18, 1992, Chicago, Ill., hereby incorporated by reference.) The nature of the ATM network with respect to such variation in delay must be known. Such nature of variation can be evaluated according to the present invention by generating a cell stream which is formed by adding a given delay to a cell stream which has no variation in delay, which is then passed through the ATM 1network for evaluation.
2. Description of the Prior Art
FIGS. 2A and 2B of the accompanying drawings show schematically structures of an ATM cell delay circuit known heretofore. In the case of the circuit configuration shown in FIG. 2A, a delay adding circuit 4 applies a desired amount of delay to an input signal. The delay adding circuit 4 is constituted by a multi-stage shift register. In general, in the ATM network, the transmission rate is selected high (e.g. 155,52M bps or more) with a view to enhancing the statistical multiplexing effect. Consequently, a shift register of a large capacity is required in order to increase the delay time to be added or applied to the input signal. Moreover, with the circuit configuration shown in FIG. 2A, it is difficult to accommodate change or vibration in the propagation delay time which is a feature characteristic of the ATM network.
FIG. 2B shows another example of the ATM cell delay circuit known heretofore. This circuit differs from that shown in FIG. 2A in that a cell filter 2 is additionally provided for extracting only the cells to which the delay is to be applied. With the arrangement shown in FIG. 2B, the delay time to be added can significantly be increased, while allowing variations in the propagation delay time. However, since the propagation delay time is closely related to cell arrival time interval, difficulty is involved in controlling the width of distribution or dispersion of the delay times.
Next, operation of the ATM delay cell delay circuits shown in FIGS. 2A and 2B will be described by reference to FIGS. 3A and 3B, in which FIG. 3A is a timing chart for illustrating a distribution of arrival times of those cells which are extracted from the input signal to be delayed, and FIG. 3B is a timing chart for illustrating operation of the delay adding circuit 4 constituted by the shift register having a number of stages corresponding to, for example, five cells. An input signal "1" shown in FIG. 3A can make appearance at the output of the shift register only after five cells have been inputted to the delay adding circuit 4 in succession to the input signal "1". Consequently, the delay times as added to the cells vary in dependence on the dispersion of the cell arrival times. In the case of the abovementioned example, the input cells are delayed by 5.times.Pa on an average, wherein Pa represents a mean cell arrival time interval of the input signal. When there is included a quiescent period in the communication, the quiescent period h in the output signal will be covered at least partially by the delay time as added.
In a two-way communication in which an answer is returned to an query message, communication is performed in such manners as illustrated in FIGS. 3A and 3C when the delay adding circuit shown in FIG. 2B is employed. Assuming that the cells shown at f in FIG. 3B represent information at the start of the communication, the two-way communication is so performed that only after the answer signal i shown in FIG. 3C is sent back in response to the information d shown in FIG. 3A, the succeeding information e shown in FIG. 3 is sent out. Consequently, when a delay is added to the communication, the information of the cells "6" to "10" contained in the input signal d shown in FIG. 4 can not be outputted until the input signal i is sent back when the delay adding circuit 4 operates in the manner illustrated in FIG. 3A. However, because the information of the cells "6" to "10" is not transmitted, the answer signal i is not sent back, resulting in that the input signal e is not sent out, whereupon the communication is terminated at this time point, giving rise to a serious problem.
The circuit configuration shown in FIG. 2A requires large scale hardware for applying a great amount of delay. Moreover, the delay time has to be maintained at a constant value. With the circuit configuration shown in FIG. 2B, the amount of hardware as required can be reduced with the amount of delay to be added being variable. However, because of strong correlation observed between the permissible amount of delay and the cell arrival time interval, the delay to be added will remain at a constant value when the arrival time interval between the input cells is constant, which means that the circuit configuration shown in FIG. 2B is not suited for the ATM cell delaying application in the two-way communication.


An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.

1. Field of the Invention
The present invention relates to an arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, the invention is also directed to a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages.
An electronic package for a computer may be assembled by connecting a microprocessor chip, for instance, possessing typical dimensions of about 15×15 mm to a substrate of about 50×50 mm in size. The chip is typically made of silicon, whereas the substrate is most frequently constituted of a composite structure, having several layers of copper lines and planes embedded in a polymeric matrix, which is broadly referred to as "resin". The electrical connection between the microprocessor chip and the substrate is formed by an operatively guaranteed by an array of solder joints referred to as C4s (Controlled Collapse Chip Connections). Each C4 brazes or solders a metal pad on the bottom surface of the chip to a respective symmetrical pad, which is located on the top surface of the substrate, wherein the C4 brazing process is identified as the reflow. During reflow, the package and the C4s are subjected to a temperature which is higher than the melting point of the solder material (about 185° C.-230° C.); whereby a few minutes of exposure to this temperature range is typically adequate to achieve a good electrical and mechanical connection between the components. The resulting shape of the C4s, as described hereinbelow in more specific detail, is governed by the shape of the pads.
The solder material, which is normally constituted of tin/lead (Sn/Pb) or tin/silver/copper (Sn/Ag/Cu—SAC), is known to be subject to a finite fatigue life when subjected to a cyclical strain, whereby in the field, the cyclical strain encountered in the C4s is the result of thermal cycles sustained by the electronic package; in which the chip and substrate have different coefficients of thermal expansion (CTE), and upon being exposed to temperature variations, their respective materials deform differently, consequently shearing and destroying the C4s. In order to reduce the shear strain, which is applied to the C4s, a layer of an underfill material is added so as to bind the chip and the substrate following the first or initial reflow process. The underfill material significantly reduces the relative motion between the chip and the substrate surfaces, thereby forcing the overall assembly to bend. Bending stresses are much more benign than shear stresses for the C4 connects, which will result in an enhanced reliability and mechanical robustness or strength of the electronic package.
2. Discussion of the Prior Art
Pertaining to the present state-of-the-technology, this is elucidated on the basis of FIGS. 1(a) through 1(c) of the drawings, illustrative of silicon chips mounted on a substrate by employing current types of C4 connections.
A schematic of a silicon chip mounted on a substrate is depicted in FIG. 1(a) plan view; FIG. 1(b) in a cross-sectional view; and FIG. 1(c) in a close-up on one C4, shown enlarged, whereby the chip is connected to the substrate through the C4s. The circular shape of the pads, which are embedded in both the chip and the substrate represents a guarantee that the C4 will have two circular faces; whereby this aspect, together with the bulging profile deriving from the reflow process, imparts to the C4 a nearly spherical shape, as shown in FIG. 1(c). Hereby, a typical C4 may possess a diameter of about 120 μm at its center, and about 100 μm at the joints, with a height of about 100 μm. In a widely adopted industry standard ('4 on 8'), C4s with 100 μm pad diameter are distributed on a square grid with a pitch of 200 μm. The industry trend is to reduce the C4 diameter and distribution pitch so that the joint density necessary for high input/output (I/O) connections can be increased. As an example, the industry is also investigating the performance of micro-C4s with 25 μm diameter pads, 10-20 μm heights and a pitch of 50 μm.
The chip-substrate assembly has to survive not only temperature cycles in the field, but also standard deep thermal cycles (DTC) before shipment. Under both environments, the differential motion between the chip and the substrate induces a shear strain in the C4, as described hereinabove; concerning which, an encountered shear strain in excess of a threshold value (typically 0.1%) results in plastic deformation, whereby repetitive strain cycles with plastic deformation lead to a cumulative damaging process, which eventually culminates in fatigue failure of the C4s at a relatively low number of cycles, typically between 1000 to 2000. The C4s, which are located furthest from the chip's neutral point (distance from neutral point—DNP) undergo the largest strain during thermal cycling and are known to fail first, leading to the conclusion that an increase in chip size is bound to reduce the service life expectancy of a C4 chip joint.
The number of cycles to failure (N) at a given temperature is represented approximately by an empirical formula, motivated by Coffin/Manson about 50 years ago; as follows:N=c/(Δen)
The constant c and exponent n (˜2) are material-dependent, whereas Δe represents the plastic deformation encountered during a cycle. During most of the time in a DTC, the temperature of the solder is high enough for the C4s to creep. Inclusion of this effect results in a more complex formulation; however, the fundamental observation is that a reduction in plastic strain results in a substantial (non-linear) improvement in the number of cycles up to failure.
In particular, pursuant to the prior art, there is described a method of analyzing solder shapes after reflow, wherein problems are addressed with regard to comparison between elliptical and round solder pads. Hereby, this aspect is treated in an article by Kuo-Ning Chiang, et al., entitled "A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads", Journal of Electronic Packaging, June 2001, Volume 123, Pages 127-131.

Elliptic C4 with optimal orientation for enhanced reliability in electronic packages

International Business Machines Coporation


A ratio-varying component for a transmission of the toroidal-race rolling-traction type, in which each of the rollers (1) transmitting torque between an input disc (51, FIG. 3) and a corresponding output disc (40) is positioned hydraulically by means of an attached hydraulic piston (5) and cylinder (6) combination, in which all the cylinders lie to the same side of a common plane (43a) including the axis (43) of the discs. The cylinders may be supported on a common block-like structure (41), in which hydraulic conduits (31a, 32a, 37a, 44) may be contained.

This invention relates to transmissions of the toroidal-race rolling-traction type. It relates in particular to ratio-varying components, or "variators", for such transmissions, the variators being of the kind in which each of a set of rollers transmitting traction between an input disc and an output disc is connected to hydraulic mechanism by which it is positioned, the roller position being a key factor in determining the transmitted ratio.

Transmission of the toroidal-race rolling-traction type


A method to establish, maintain and control pH using carbon dioxide in aqueous dyeing processes applicable to dyeing a wide range of substrates with an aqueous dyeing solution incorporating either a water soluble or insoluble, natural or synthetic type of dye in batch or continuous processes, and at atmospheric pressure or under pressure.

Different dyes are used to impart color to an infinite variety of substrates in both batch and continuous type of processing. Dyes may be either synthetic or natural, water soluble or insoluble. Having a unique chemistry, one dye may be more suitable for a given type of substrate than another. The desired color or shading on a particular substrate will often dictate the dye selected.
For example, disperse dyes such as Disperse Yellow 3 (N-[4-[(2-hydroxy-5-methylphenyl)azo]phenyl]-acetamide) or Disperse Red 55 (1-amino-4-hydroxy-2-(2-hydroxyethoxy)-9,10 anthracenedione) are used extensively on polyester over a full shade range. However, when applied on acrylic fibers, disperse dyes are used primarily for pastel shades. Similarly, vat dyes such as Vat Black 25 (3-(1-anthraquinonylamino)anthra[2,1,9-m,n,a]naphth[2,3-h]acridine-5,10,15 -(16H)-trione) are used almost exclusively for dull color shades on substrates including cotton and rayon. On the other hand, basic (cationic) dyes such as Basic Red 29 (thiazolium) or Basic Blue 41 (Benzothiazolium) have an almost unlimited range of shades with good color value. Basic dyes provide among the brightest colors such as mauve, fuchsia, violet and blue and are employed extensively on acrylics and often on paper, silk and leather. Likewise, azoic dyes such as the Naphthol compounds offer a wide range of shades but are typically used to produce full shades of red, scarlet and burgundy on substrates including cotton, polyester, linen, jute, hemp, and rayon.
Although many dyes can be used in both batch and continuous processing, dye selection may be contingent on the type of dyeing process required. For example, direct dyes such as Direct Black 80 (7-amino-2-{7-[p-(4-amino-6-1-naphthylazo)phenylazo]-8-hydroxy-6-sulfo-2-n aphthylazo}-1-naphthol-3-sulfonic acid) used on a variety of substrates including cotton and rayon are processed continuously or in batch. The same is true for azoic dyes and sulfur dyes such as Sulfur Black 1 (constitution unknown). However, the acid dyes such as Acid Blue 40 (2-Anthracenesulfonic acid) or Acid Orange 156 (Benezenesulfonic acid) originally were devised exclusively for dyeing wool and will typically undergo batch processing in order to acquire uniformity of color.
Regardless of the physical and chemical nature of a dye or substrate employed, it is always important to have the correct solution pH. A good general description of the coloration and dyeing processes for many of the above listed substrates can be found in DYEING PRIMER, a series of short papers on the Fundamentals of Dyeing in Textile Chemist and Colorist. The following articles from Textile Chemist and Colorist are included: "What are Dyes? What is Dyeing?" by J. Richard Aspland, Vol. 12, No. 1, 1980; "Dyeing With Acid Dyes" by J. Lee Rush, Vol. 12, No. 2, 1980; "Dyeing With Basic Dyes" by Mathias J. Schuler, Vol. 12, No. 3, 1980; "Dyeing with Direct Dyes" by Marshall White, Jr., Vol. 12, No. 4, 1980; "Dyeing With Vat Dyes" by Claude S. Hughey, Vol. 12, No. 5, 1980; "Dyeing With Sulfur Dyes" by Leon Tigler, Vol. 12, No. 6, 1980; "Dyeing With Azoic Dyes" by Herbert B. Moore, Jr., Vol. 12, No. 7, 1980; "Dyeing With Disperse Dyes" by Mathias J. Schuler, Vol. 12, No. 8, 1980; "Dyeing With Reactive Dyes" by Peter J. Dolby, Vol. 12, No. 9, 1980; "Special Coloration Techniques" by J. Richard Aspland, Vol. 12, No. 10, 1980; "The Application of Color Technology in Today's Textile Industry" by Ralph Besnoy, Vol. 12, No. 11, 1980; "Kinetics and Equilibria in Dyeing" by Ralph McGregor, Vol. 12, No. 12, 1980.
A dyeing solution must maintain the proper pH to provide accurate and consistent shading of color. This applies to virtually any type of dye or substrate regardless of the mechanical processing employed. Control of pH in a dyeing process is critical and is a function of many factors including: the dye, the amount of dye used, the chemistry of the application medium (typically water), the rate of temperature change of the dyeing process, and the rate and method of dye exhaustion onto the substrate.
In order to preserve proper pH, chemical buffering systems are incorporated into dyeing solutions. A chemical buffering system is one that maintains the correct acidity or alkalinity of the dyeing solution and consists of a weak acid or weak base and its salt. The combination or concentrations of the weak acid/base and its salt determines the buffering range and capacity. Commonly used prior art systems for buffering a dyeing solution and controlling pH include ammonium sulfate, phosphoric acid and acetic acid. The availability of these chemicals and their ability to lower the dye bath pH has made them desirable.
Ammonium sulfate, for example, is a very common pH control for a variety of dyes and substrates. Azoic dyes, disperse dyes, vat dyes, acid dyes, and basic dyes have all utilized ammonium sulfate to control pH. A conventional prior art process using ammonium sulfate pH control consists of a solution made up of about 2% ammonium sulfate having water as the application medium. 1-2% leveling agent and 0.25% surfactant are then added. The substrate such as nylon or polyester is introduced into the bath at about 40.degree. C. and runs without the dye for 5 minutes. Once the dye is added, the solution is heated by introducing stem for 25-35 minutes to complete the dyeing process. Here, the ammonium sulfate is used to control pH and maintain an acidic dye solution. Steam is employed at either atmospheric pressure or under pressure to each and maintain a near boiling temperature.
Another prior art process which uses phosphoric acid as the pH control employs a solution of about 0.50% phosphate buffer (which includes the phosphoric acid) and 0.50% surfactant. The dye is added to cold water in a batch process and then steamed until well mixed with water. All other chemicals such as antifoams and water softeners are added except the phosphate buffer. The batch is circulated for 3-5 minutes. Thereafter, the substrate is added and circulated for 2 minutes. The buffer is then added and the temperature is raised to 180.degree. F. at a rate of 4.degree. F. per minute using steam. Once the 18020 C. temperature is maintained for 5 minutes, a substrate sample is tested for accuracy and consistency of shading.
Many such prior art methods of maintaining proper pH in dyeing solutions are considered hazardous and toxic according to current environmental regulations. For example, acetic acid, ammonium sulfate and phosphoric acid all enhance microbial growth in receiving water systems such as lakes and rivers. These microorganisms require nutrients encompassing a variety of carbon compounds such as acetate from spent acetic acid, nitrogen from ammonium sulfates, and phosphates from phosphoric acid. The bacteria also consume large amounts of oxygen indicative of an increase in the Biological Oxygen Demand (BOD) of the water.
Consequently, the bi-products of the prior art methods if discharged into a water system will escalate the growth of bacterial. Hence, the oxygen level is depleted leaving little if any oxygen for aquatic growth such as fish. The result is a lifeless water stream and an imbalance in the ecosystem. Therefore, prior art methods of pH control require careful effluent treatment and disposal.
In addition, a bi-product of an ammonium sulfate buffer is an ionized form of ammonia that cannot be leached into an effluent water going into city waste treatment system. Further, the acetic acid method of pH control results in zinc removal from the latex backing of conventional textile materials such as "scatter" rugs. It is very difficult to dispose this material.
As a result, the dye industry has been seeking new methods to maintain and control pH that obviate the use of such chemicals as acetic acid, ammonium sulfate and the like. Moreover, environmental problems with effluent discharge have caused dyers to incorporate more exacting controls in the dyeing operations while looking for new methods to monitor pH. Many prior art methods only add the pH adjusting chemical(s) such as acetic acid, during the initial batch formulation and do not provide an ongoing capability to adjust the pH during the dyeing cycle. Without capability to continuously adjust the pH, rework is frequently necessary and consequently more dye is utilized. Therefore, better methods of repeatability which lessen the amount of rework have been sought.

Adjusting pH in dyeing processes using CO.sub.2


A DC/DC converter has DC input terminals to which a DC power is inputted, a transformer, and a bidirectional switching device on the primary side of the transformer.

Conventionally, a DC/DC converter having a DC input terminal has been used to boost or drop a DC voltage and output it (see, e.g., Japanese Patent Application Publication No. 2010-022077). In such a type of the DC/DC converter having the DC input terminal, when reverse polarity is connected to the DC input terminal, an internal circuit of the converter is broken. Various configurations as shown in FIGS. 28A to 28C have been known as countermeasures against the reverse connection to the DC input terminal.
FIG. 28A illustrates the configuration in which a diode is connected in series to one input terminal, thereby preventing a voltage from being applied to the internal circuit of the DC/DC converter in reverse connection. In this configuration, when polarity is normally connected to the DC input terminal, voltage loss is always generated by a voltage drop of the connected diode. Since the voltage is not applied to the internal circuit of the DC/DC converter in the reverse connection, the DC/DC converter does not operate.
FIG. 28B illustrates the configuration in which a diode is connected from one input terminal to the other input terminal and the internal circuit is short-circuited by the diode in reverse connection, thereby preventing a voltage from being applied to the internal circuit of the DC/DC converter in the reverse connection. In this configuration, a protection circuit is additionally required to protect a circuit connected to the DC input terminal from the short-circuit current. Alternatively, this configuration is limitedly applied to a power supply, such as a solar photovoltaic power generating panel, to which current limiting acts. Also, since the voltage is not applied to the internal circuit of the DC/DC converter in the reverse connection, the DC/DC converter does not operate.
FIG. 28C illustrates the configuration in which a bridge circuit is provided in an input unit, so that a normal voltage is applied to the internal circuit of the DC/DC converter even in any one of forward and reverse connections, such as when an AC power supply is connected to the DC/DC converter. In this configuration, the DC/DC converter operates even in any one of the forward and reverse connections, but voltage loss corresponding to the voltage of two diodes included in the bridge circuit always occurs.

Panasonic Intellectual Property Management Co., Ltd.


A liner assembly includes a plurality of flaps arranged about a central axis and operable to move relative to the central axis. Each of the plurality of flaps defines a forward end and an aft end, lateral sides, and an inner surface and an outer surface relative to the central axis. Each of the plurality of flaps has a thickness between the inner surface and the outer surface, and thickness varies in a lateral direction between the lateral sides.

This disclosure relates to thermal management in a liner assembly, such as a convergent-divergent nozzle.
A gas turbine engine typically includes a fan section that moves air downstream towards a compressor section. The compressor section compresses the air and delivers it into a combustion section for hot combustion gases. The hot combustion gases are delivered downstream to a turbine section and then discharged through a nozzle.
The nozzle may be a convergent-divergent nozzle that is generally known and used to vary a cross-sectional area of the nozzle by moving nozzle flaps that pivot inwardly and outwardly. The nozzle flaps are subject to thermal gradients and thus one challenge in designing nozzle flaps is managing thermal gradients.

Convergent-divergent gas turbine nozzle comprising movable flaps having a variable thickness in a lateral direction


The present invention is a cremation urn and a system for retaining cremation remains, the invention comprising in one embodiment, a top shelf, a bottom shelf and a middle portion defining an artwork channel, recess or void between the top and bottom shelves. In another embodiment, the bottom shelf and the top shelf have a larger surface area than the middle portion so that both the top and bottom shelf protrude further out away from the middle portion. In this regard, the middle portion can then be defined to have a channel of surface space between the top and bottom shelves, so that optional ornamental designs or artwork can be variously, sequentially or randomly coupled to the middle portion's viewable surface area within the artwork channel, recess or void. In another embodiment, the top shelf has a top surface which is adapted to receive and retain optional ornamental designs or artwork. In another embodiment, the artwork recess formed in the urn is covered by a protective sheet which is preferably transparent in nature, to thereby substantially or permanently encapsulate any artwork within the recess for viewing. An optional rotatable base for the urn is also disclosed.

The business of cremation and placing the cremated remains in an urn is expanding, as it is an inexpensive alternative to typical funeral costs. While there are several cremation urn designs in the funeral industry, consumers are demanding more urns which can be quickly modified to create a uniquely designed cremation urn that commemorates and memorializes their deceased loved one. In this regard, the cremation urn industry has seen a tremendous increase in market presence due to the popularity of a wider variety of choices amongst cremation urns.
Several of these cremation urn designs have resulted in a patent. Thus, for example, U.S. Design Pat. No. 350,010 to May et al. discloses a decorative ornamental four-sided, wooden cremation urn having a pair of columns on each side façade. U.S. Design Pat. No. 359,831 to Parker discloses a ornamental four-sided wooden cremation urn where one façade includes a decorative etched carving. U.S. Design Pat. 421,672 to Thesken discloses an ornamental device for scattering cremation remains. U.S. Design Pat. No. 432,285 to Baldwin et al. discloses an ornamental four-sided, wooden cremation urn having a generally square or box-like appearance having four bumper corners joining each side façade. In contrast, U.S. Design Pat. No. 433,209, also to Baldwin et al. discloses the same ornamental four-sided, wooden cremation urn having a generally square or box-like appearance, but does not claim the four bumper corners joining each side façade found in the previous patent.
Continuing, U.S. Design Pat. No. D438,362 S discloses a four-sided urn having a top surface that slants from back to front. U.S. Design Pat. No. D438,687 S to Robinson discloses an ornamental, wooden cremation urn having a generally rectangular appearance, and includes an ornamental dog picture upon the top surface. U.S. Design Pat. No. D442,347 S to Parker discloses an ornamental cremation urn featuring gardening artwork upon a top surface. U.S. Design Pat. No. D444,288 S to Parker discloses an ornamental square cremation urn featuring decorative columns and bumpers which are surrounded or otherwise encircled by an elongated string, yarn or rope structure. U.S. Design Pat. No. D494,727 S to Poteet discloses a cremation urn featuring a longer height middle portion when compared to either its top portion or its bottom portion, and which is devoid of any artwork. U.S. Design Pat. No. D543,005 S to Pertz discloses a heart-shaped cremation urn, with the heart shape forming all of the top, middle and bottom portions.
U.S. Pat. No. 6,735,831 B1 to Greiwe et al. discloses a cremation urn having a retractable plaque at its base, along with a lid having a transparent top. The top of the urn contains a recess where memorabilia may, be placed, and viewed when the lid is closed. This patent fails to appreciate the use of the other surfaces of the urn as display areas for commemorative purposes or placing of memorabilia.
U.S. Patent Publication No. 2006/0174461 A1 to Roberts discloses a cremation urn having replaceable panels, where each panel is engraved with a design by laser engraving. U.S. Patent Publication No. 2007/0033777 A1 to Blessing discloses a solid surface luminous urn, while U.S. Patent Publication No. 2009/0030804 A1 discloses a method for ordering a customized cremation urn over a computer network.
While increasing demand exists for newer, more modern cremation urns, there is a strong need for a novel cremation urn which is capable of ease of manufacture, ease of storage, and an urn which may be easily modified or otherwise customized in order to memorialize the loved one in a graceful and ornamental manner.

Cremation urn, kit and system for retaining cremation remains