A semiconductor mask correcting device is provided with an image acquiring unit acquiring a mask image, an extraction unit extracting only a main pattern from the mask data, an inspection unit inspecting a defective portion by comparing the extracted main pattern with a main pattern which is obtained from the mask image after a drawing by matching to each other, and a correction unit correcting the defective portion specified by the inspection unit, wherein the extraction unit includes a recognition section recognizing the main pattern and the assist pattern as a figure, a specification section specifying the assist pattern from figures which is recognized on the basis of a predetermined condition, and a main pattern extracting section extracting as the main pattern a figure other than the assist pattern.

The invention relates to a semiconductor mask correcting device and a semiconductor mask correcting method of correcting a defective portion of a photo mask, which is used in the process of fabricating a semiconductor device, into a non-defective photo mask.
Since a photo mask used in the process of fabricating a semiconductor device is an original form of a pattern, an existence of a defective portion is necessarily inspected and the defective portion is appropriately corrected as needed, after a mask pattern is drawn on a mask substrate.
In a fabrication method of a usual photo mask, first, design data of the mask pattern is designed by using a computer, and then the designed data is transformed into drawing data for a drawing device. Next, a drawing of the mask pattern is performed on a mask substrate by the drawing device on the basis of the drawing data. Due to this, the photo mask a mask pattern of which is drawn on the mask substrate can be made.
Additionally, after making the photo mask, it is possible to check an existence of a defect of the photo mask or a location of the existence of that by using a defect inspecting device, and when the defect exists, a semiconductor mask correcting device performs the defect correction before transferring an image of the mask to a wafer.
As for the defects of the mask pattern, there are examples such as an extrusion which is projected as an extra protrusion from a desired pattern, and an intrusion which is a concave portion such as an empty on the desired pattern. The mask correction device specifies a location by finding the defective portions, and appropriately corrects them. In methods of the correction, for example, when the protrusion is found, the protrusion portion is corrected by a focused ion beam to be cut off (i.e. an etching process). Additionally, when the concave is found, the concave portion is corrected by gas assist method so that a predetermined material is deposited therein (i.e. a deposition process).
In addition, as for a method of inspecting the mask pattern, there are usually two ways available. That is, systems of a die to die and a die to database are available.
The die to die system is a method which is used when the same mask pattern of at least two or more is drawn on the mask substrate, and finds the defective portion from differences between the patterns by matching them to each other. The die to die system has advantages that an inspection time is short and comparatively performed in a simple way, while the system does not cope with the defective portion occurring in the same way on all patterns and the case of drawing only one pattern on the mask substrate.
Particularly, a pattern shape which is subjected to the correction becomes a fine size and a complicated shape in company with a decrease in size of a semiconductor device, recently. Therefore, it is difficult to compare the pattern shape with an original design of that. That's reason why a die to database system is required more and more instead of the die to die system.
The die to database system is a method comparing a mask image acquired by scanning a mask pattern which is actually drawn on the mask substrate with drawing data stored as CAD data, by using a pattern matching.
Using this method, an actual pattern and a designed pattern can be compared by being directly matched (piled up) to each other, and thus the defective portion such as the protrusion or the concave portion is detected in high accuracy. Thanks to this, the die to database system will be a mainstream as an inspection method from now on.
Recently, accompanied with a decrease in size of the semiconductor circuit, an optical proximity effect correction (i.e. OPC) which is one of the kinds of a resolution enhancement technology (i.e. RET) such as phase shift mask technology is just applied in the semiconductor mask fields. That is a technology using a mask for improving a transfer characteristic by controlling a phase and a transmittance of light, and OPC patterns such as a serif, a jog, and a hammer head are added on the mask pattern. In this way, even if the mask pattern is a fine pattern, it is possible to obtain a desired transfer image by using exposure.
Particularly, the transfer image transferred by the mask pattern is mostly used in a semiconductor circuit. Hence, such a method is also employed to obtain a high-accuracy semiconductor circuit.
Additionally, in addition to the OPC pattern recently, a method adding an assist pattern which is an application of the OPC pattern is contrived to expose an edge of the mask pattern more accurately (see, for example, Benjamin G. Eynon, Jr.: "Photomask Fabrication Technology", McGraw-Hill ELECTRONIC ENGINEERING, 2005, Chapter 7: Resolution Enhancement Techniques, P457-P467).
The assist pattern which is occasionally called a different name as SRAF (i.e. Sub Resolution Assist Feature) is mostly arranged to surround a vicinity of the main pattern to become a circuit pattern. The assist pattern has a characteristic that it is formed excessively thinner than the main pattern, and the pattern itself does not resolve during exposure, but when the main pattern around which the assist pattern is disposed is exposed, highly accurate transfer is enabled by solving fluctuation of the edges of the main pattern. That is, the assist pattern functions as auxiliary of the main pattern.
As mentioned above, to fabricate the fine semiconductor circuit in high accuracy, a method using a mask pattern which combines the assist pattern with the main pattern is just employed recently.
The assist pattern is disposed in accordance with a shape of the main pattern, and thus design data of the main pattern is designed first, then the assist pattern is inserted by being designed in accordance with the main pattern. Next, the pattern designs of the main pattern and the assist pattern are employed as final circuit diagram data, and then the final circuit diagram data is transformed into the mask data which is drawing data. The photo mask is fabricated by drawing on the mask substrate in accordance with the mask data.
After making the photo mask, the photo mask and the mask data is compared by the die to database system which is directly matched to each other, and the correction is appropriately performed along with the inspection of the defective portion such as the protrusion and the concave portion.
However, there are the following problems that still remain in the assist pattern mentioned above.
First, the final circuit diagram data adding the assist pattern to the main pattern transforms into the mask data which is the drawing data through a process usually called a fracturing. Because of the reason, all pattern data of the final circuit diagram data is minutely partitioned in the form of a trapezoid and a rectangle.
In particular, as shown in FIG. 9, a recent main pattern MP is formed in a complicate shape by adding the OPC pattern thereto as mentioned above. Therefore, through the fracturing process, the main pattern on data is recognized as an aggregate of a plurality of the trapezoid or the rectangular shape partitioned as shown in FIG. 10.
On the contrary, as shown in FIG. 9, the assist pattern AP is arranged around the main pattern MP in a comparatively thin and rectangular shape with a certain width, but it has a simple shape compared with the main pattern MP, and thus the assist pattern is recognized as just own shape itself as shown in FIG. 10 after the processing.
By the way, since the main pattern MP is recognized as an aggregate of shapes such as a rectangle, the main pattern can not be distinguished from the assist pattern AP on data. That is, as shown in FIG. 10, a part of figure mp forming the main pattern MP takes the same shape by comparison with the assist pattern AP, so there is a concern about an error recognizing the part of figure mp as the assist pattern AP.
Accordingly, in a step of mask data, the main pattern MP and the assist pattern AP can not be clearly recognized to be distinguished between them. Additionally, the mask data is stored into a mask data file in a partitioned state.
Accordingly, when the die to database system is attempted to inspect the photo mask after drawing on a substrate in actual situation, it is difficult to match the mask data with a photo mask image in high accuracy, and thus the inspection of the defective portion can not be performed.
Above all, since, as for the main pattern of the photo mask, the transfer image becomes semiconductor circuit when exposure is performed, it is necessary to match with the main pattern MP of the mask data in high measurement accuracy and location accuracy to inspect the defective portion, and properly correct by specifying the defective portion. However, since the main pattern MP can not be distinguished from the assist pattern AP on the mask data as mentioned above, it is not possible to inspect the main pattern which is required after the drawing.
In addition, even if it is possible to distinguish the main pattern MP of the mask data from the assist pattern AP, it is difficult to match the main pattern in high accuracy in an actual situation.
In detail, since the assist pattern AP stored as the mask data is mostly designed as a fine line shape different with the main pattern MP (to prevent resolving in the process of exposure), it is easily affected by a distortion during drawing on the mask substrate. Therefore, the assist pattern drawn in actual situation becomes distorted shape, and mostly, does not necessarily match with the assist pattern AP of the mask data. However, the assist pattern is not resolved even though the exposure is performed, so it is allowed even if there are some defective portions or errors. Accordingly, there is commonly no correction for the drawn assist pattern. That is, the correction of the photo mask is commonly performed for only the main pattern.
Because of that, when the photo mask image is matched with the mask data, it is required to inspect the defective portion by matching between locations of both main patterns only in high accuracy.
However, when the photo mask image and the mask data is subjected to the pattern matching, the high distorted assist pattern is formed on the photo mask as mentioned above, whereupon it adversely affects matching of the main pattern. For example, it is attempted to perform as the high distorted assist pattern of the photo mask is compulsory matched with the assist pattern AP of mask data, or the high distorted assist pattern of the photo mask is compulsory matched with the main pattern MP of the mask data since it is failed to correctly recognize the assist pattern.
As mentioned above, the assist pattern AP of the photo mask is one of the noise factors in the process of matching, whereupon an accuracy of matching decreases. Accordingly, the matching of the main pattern can not be performed in high accuracy, and it is not possible to exactly perform the inspection and the correction on the defective portion.
In is an object of the invention which is contrived in consideration of the situations mentioned above to provide a semiconductor mask correcting device and a semiconductor mask correcting method capable of performing the pattern matching process which matches the photo mask having the assist pattern with the mask data in high accuracy by using a die to database system, and fabricating the photo mask with high quality by performing the mask correction in high accuracy.

Semiconductor mask correcting device and semiconductor mask correcting method


A gun securing and storage device for securing a handgun from access and accidental discharge. The gun securing and storage device includes a case having a base portion and a cover portion hingedly coupled together. The base portion includes a bottom panel having a peripheral wall extending upwardly therefrom. The bottom panel has an inner wall and an outer wall such that a chamber is defined between the inner and outer walls. A plurality of aligned holes extends through the inner wall and into the chamber. A locking means is attached to the case for locking the case. A plurality of trigger guard engaging members is positionable within a trigger guard of a handgun. Each of trigger guard engaging members includes a male portion removably coupled to one of the holes, a female portion coupled to the top panel and aligned with one of the holes in the bottom panel.

1. Field of the Invention
The present invention relates to gun locking devices and more particularly pertains to a new gun securing and storage device for securing a handgun from access and accidental discharge.
2. Description of the Prior Art
The use of gun locking devices is known in the prior art. More specifically, gun locking devices heretofore devised and utilized are known to consist basically of familiar, expected and obvious structural configurations, notwithstanding the myriad of designs encompassed by the crowded prior art which have been developed for the fulfillment of countless objectives and requirements.
Known prior art includes U.S. Pat. No. 5,647,158; U.S. Pat. No. 5,680,726; U.S. Pat. No. 4,083,341; U.S. Pat. No. 5,768,819; U.S. Pat. No. 5,621,996; and U.S. Des. Pat. No. 196,542.
While these devices fulfill their respective, particular objectives and requirements, the aforementioned patents do not disclose a new gun securing and storage device. The inventive device includes a case having a base portion and a cover portion hingedly coupled together. The base portion includes a bottom panel having a peripheral wall extending upwardly therefrom. The bottom panel has an inner wall and an outer wall such that a chamber is defined between the inner and outer walls. A plurality of aligned holes extends through the inner wall and into the chamber. The holes are generally centrally located in the bottom panel. Each of the holes is threaded. A locking means is attached to the case and selectively locks the case in a closed position. A plurality of trigger guard engaging members is positionable within a trigger guard of a handgun. Each of trigger guard engaging members includes a male portion removably coupled to one of the holes, a female portion coupled to the top panel and aligned with one of the holes in the bottom panel.
In these respects, the gun securing and storage device according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in so doing provides an apparatus primarily developed for the purpose of securing a handgun from access and accidental discharge.
In view of the foregoing disadvantages inherent in the known types of gun locking devices now present in the prior art, the present invention provides a new gun securing and storage device construction wherein the same can be utilized for securing a handgun from access and accidental discharge.
The general purpose of the present invention, which will be described subsequently in greater detail, is to provide a new gun securing and storage device apparatus and method which has many of the advantages of the gun locking devices mentioned heretofore and many novel features that result in a new gun securing and storage device which is not anticipated, rendered obvious, suggested, or even implied by any of the prior art gun locking devices, either alone or in any combination thereof.
To attain this, the present invention generally comprises a case having a base portion and a cover portion hingedly coupled together. The base portion includes a bottom panel having a peripheral wall extending upwardly therefrom. The bottom panel has an inner wall and an outer wall such that a chamber is defined between the inner and outer walls. A plurality of aligned holes extends through the inner wall and into the chamber. The holes are generally centrally located in the bottom panel. Each of the holes is threaded. A locking means is attached to the case and selectively locks the case in a closed position. A plurality of trigger guard engaging members is positionable within a trigger guard of a handgun. Each of trigger guard engaging members includes a male portion removably coupled to one of the holes, a female portion coupled to the top panel and aligned with one of the holes in the bottom panel.
There has thus been outlined, rather broadly, the more important features of the invention in order that the detailed description thereof that follows may be better understood, and in order that the present contribution to the art may be better appreciated. There are additional features of the invention that will be described hereinafter and which will form the subject matter of the claims appended hereto.
In this respect, before explaining at least one embodiment of the invention in detail, it is to be understood that the invention is not limited in its application to the details of construction and to the arrangements of the components set forth in the following description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced and carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting.
As such, those skilled in the art will appreciate that the conception, upon which this disclosure is based, may readily be utilized as a basis for the designing of other structures, methods and systems for carrying out the several purposes of the present invention. It is important, therefore, that the claims be regarded as including such equivalent constructions insofar as they do not depart from the spirit and scope of the present invention.
Further, the purpose of the foregoing abstract is to enable the U.S. Patent and Trademark Office and the public generally, and especially the scientists, engineers and practitioners in the art who are not familiar with patent or legal terms or phraseology, to determine quickly from a cursory inspection the nature and essence of the technical disclosure of the application. The abstract is neither intended to define the invention of the application, which is measured by the claims, nor is it intended to be limiting as to the scope of the invention in any way.
It is therefore an object of the present invention to provide a new gun securing and storage device apparatus and method which has many of the advantages of the gun locking devices mentioned heretofore and many novel features that result in a new gun securing and storage device which is not anticipated, rendered obvious, suggested, or even implied by any of the prior art gun locking devices, either alone or in any combination thereof.
It is another object of the present invention to provide a new gun securing and storage device which may be easily and efficiently manufactured and marketed.
It is a further object of the present invention to provide a new gun securing and storage device which is of a durable and reliable construction.
An even further object of the present invention is to provide a new gun securing and storage device which is susceptible of a low cost of manufacture with regard to both materials and labor, and which accordingly is then susceptible of low prices of sale to the consuming public, thereby making such gun securing and storage device economically available to the buying public.
Still yet another object of the present invention is to provide a new gun securing and storage device which provides in the apparatuses and methods of the prior art some of the advantages thereof, while simultaneously overcoming some of the disadvantages normally associated therewith.
Still another object of the present invention is to provide a new gun securing and storage device for securing a handgun from access and accidental discharge.
Yet another object of the present invention is to provide a new gun securing and storage device which includes a case having a base portion and a cover portion hingedly coupled together. The base portion includes a bottom panel having a peripheral wall extending upwardly therefrom. The bottom panel has an inner wall and an outer wall such that a chamber is defined between the inner and outer walls. A plurality of aligned holes extends through the inner wall and into the chamber. The holes are generally centrally located in the bottom panel. Each of the holes is threaded. A locking means is attached to the case and selectively locks the case in a closed position. A plurality of trigger guard engaging members is positionable within a trigger guard of a handgun. Each of trigger guard engaging members includes a male portion removably coupled to one of the holes, a female portion coupled to the top panel and aligned with one of the holes in the bottom panel.
Still yet another object of the present invention is to provide a new gun securing and storage device that has adjustable securing devices for holding multiple types of handguns.
These together with other objects of the invention, along with the various features of novelty which characterize the invention, are pointed out with particularity in the claims annexed to and forming a part of this disclosure. For a better understanding of the invention, its operating advantages and the specific objects attained by its uses, reference should be made to the accompanying drawings and descriptive matter in which there are illustrated preferred embodiments of the invention.


A system and method for authenticating suspect code includes steps of: receiving the suspect code for a first instance of a trusted platform module; loading the suspect code into a trusted platform module device operatively associated with a processor, wherein the suspect code is loaded outside of a shielded location within the trusted platform module device; retrieving a validation public key from a table and storing it in a register in the trusted platform module device, the validation public key indexed by the suspect code; and retrieving a hash algorithm from the table, the hash algorithm indexed by the suspect code. The hash algorithm is run to derive a first hash value; then, using the validation public key, the second hash value is decrypted to derive a second decrypted hash value. The two hash values are compared; and upon determining a match, the suspect code is loaded into the shielded location of the processor for execution by the processor.

E-commerce, e-government and e-business are all growing in tandem with an increase in cyber crime. Many high tech security technologies have been implemented to address the increasing threat of cyber crime, but there is a tradeoff emerging in the use of security technologies for protecting data and authenticating identities and transactions. IT owners of processes involving these identities and transactions desire to use specific authentication and encryption algorithms tailored to their risk profiles. Associated with these algorithms, they want to use specific, feature set implementations of Trusted Platform Modules (TPMs) to support the required assurance level of their end to end systems and operational models. TPMs are microchips designed to provide certain basic security-related functions to the software that utilizes the TPM. As a hardware-based security system, a TPM is much safer than a software-based security feature, but this increased safety comes at a high price and usually more administrative work. FIG. 1 shows a simplified block diagram of a basic TPM 100. The hardware components of the TPM 100 include: a hardware engine 120, a hash engine 140, a random number generator 160, and internal hardware-protected storage 180. Currently, TPMs require specific cryptographic algorithms, such as RSA SHA-1 and HMAC (hash function based message authentication code). RSA was developed by R. L. Rivest, A. Shamir, and L. M. Adleman. SHA-1 is a secure hash algorithm standard.
Referring to FIG. 2 there is shown a TPM software stack. At the lowest level is the TPM hardware device 210, which is a chip usually located on a motherboard. The TPM is accessed via a TPM device driver library 220. Applications use the TPM through standard interfaces, or by directly implementing communication with the TSS 230. The TSS 230 is the TCPA (Trusted Computing Platform Alliance) Software Stack which provides the supporting functionality to the TPM. The next higher level is the cryptographic service provider 240, such as Microsoft's® CAPI. At the highest level are the applications 250 that use the TPM 210.
The typical approach of implementing various algorithms and TPMs as delivered in unique or integrated hardware devices will keep security costs rising. What is needed is a flexible, yet secure, approach that uses a secure programmable microcontroller to support various selectable authentication and encryption algorithms and to also use these with the emulation of different instances of TPM hardware. When execution code in a programmable microcontroller is loaded and unloaded from a cache for various operations the integrity of a particular security operation cannot be validated each time it is used. Bulk encryption (or block encryption) is on answer to this problem, but it is considered too slow.
Therefore, there is a need for a security system to overcome the shortcomings of the prior art.

Authenticating suspect data using key tables


A trimming device and method maintains a first trimming member of a tree harvester head at a preselected transverse position relative to a tree trunk during relative longitudinal movement of the tree trunk. A first control device having a tree trunk engaging portion movably connected to the first trimming member selectively establishes the relative transverse position of the first trimming member and the tree trunk. An actuator urges the tree trunk engaging portion into engagement with the tree trunk and the first trimming member at the preselected transverse position.

Tree trimming devices have been known to delimb and debark a tree. Such trimming devices have been provided with a harvester head of the type used with a tree harvesting machine. Some tree trimming devices have tree trimming members that are pivotally connected to a frame of the harvesting head. Such harvester heads have a driving device that provides relative movement between the tree and the trimming members. Such trimming devices have been known to have a knife edge or debarking device which provides delimbing or debarking functions.
The tree trimming members are pivotally movable into position about the trunk of the tree being trimmed. At this position it is assumed that the trimming members are adequately pressed against the circumference of the tree trunk and in position to trim the tree. However, due to the various different types of trees being trimmed and variations in the tree diameter and size, the position of the trimming members relative to the tree trunk may not be or may not remain in the desired transverse position relative to the tree trunk as the tree trunk is longitudinally moved relative to the tree trimming members. As a result, poor quality delimbing or debarking occurs. This may result in a loss of the wood product and a need for further time consuming processing.
The present invention is directed to overcoming one or more of the problems as set forth above.


A device for connecting operating units (8) for doors and windows comprising: a control element (4) mounted on the operating side (3 a) of a mobile frame (3); a rod segment (5) that is slidably mounted in a groove (C), made at least in the operating side (3a) and is connected to the control element (4) in such a way as to slide in both directions within the groove (C) to define the open and closed configurations of the door/window (1a, 1b); the rod segment (5) being associated by respective connecting means (10, 12), with elements (105, 6) that are functional or accessory to the operation of the rod segment (5), said elements (105, 6) protruding from the groove (C); these connecting means comprise at least one base (10) connected to at least one functional or accessory element (105, 6) defined by an operative portion (9); the size of the base (10) is such that, in use, it covers a free front section of the rod segment (5), the base (10) being frontally applicable to the rod segment (5) before the latter is inserted into the groove (C), and a bottom end extension (12) protruding transversally of the base (10), shaped to match the profile of the operating rod segment (5) and designed to be coupled to a respective slot (5a) formed on the rod (5) in such a way as to create a portion for uninterruptedly connecting and stiffening the rod segment (5) itself.

Generally speaking, doors and windows essentially comprise:                a fixed frame;        a mobile frame, or sash in the case of tilt and turn units, slidably connected or hinged to the fixed frame;        a control handle mounted on one of the vertical members of the mobile frame;        at least one rod segment slidably mounted in a groove made in the vertical member and connected to, and controlled by, the control handle (in some cases, where there is a traditional handle, the connection is obtained by drive elements constituting accessories of the rod) in such a way as to slide in both directions in the groove to define at least one open configuration and one closed configuration of the door or window;        closing means associated with, and protruding from, the operating rod (to define additional accessories of the rod) and designed to oppose or engage respective fixed abutment means located on the vertical member of the fixed frame in order to define the closed configuration.
More specifically, the accessories may comprise, for the drive means, two facing protrusions or tabs or two bosses forming a space occupied by the handle lever to permit transmission of the motion produced by turning the handgrip of the handle and thus displacing the rod in the groove.
The closing means, on the other hand, may be embodied by pins or bosses and catches (in the case of sliding doors/windows) stably associated with the rod.
As is known, these drive and closing elements are applied to the operating rod by connecting means consisting of: a socket made in the central section of the rod (half way along the width of the rod) and a suitable bottom portion of these elements housed in the socket and locked in place preferably by plastic deformation of the material the bottom portion of the element is made of or by caulking.
Examples of these applications are disclosed in document EP 1.454.708 (in the name of the same Applicant as this invention) as regards an example of a drive boss, in documents EP 1.132.169 and EP 1.460.216 (also both in the name of the same Applicant as this invention) as regards the above mentioned pins or bosses, and in Italian patent applications BO2007A000444 and BO2007A000445 (also in the name of the same Applicant as this invention) as regards the closing catches for sliding doors and windows which, in one of these cases, is locked to the rod by means of the specially shaped bottom portion of an element or pin.
These connecting means, very practical for positioning the accessories and quick to apply, have been shown to have one drawback due to poor holding strength over time leading to deterioration of the rod-accessory assembly.
As regards the striker elements, the step of moving the rod to close the door or window, in the case of pins or bosses, comprises sliding the rod along the groove until the boss is laterally or tangentially coupled to a retaining wall of the above mentioned abutment element.
This coupling pushes the boss sideways and produces a force (moment) both on the boss and on the zone where the connecting means are coupled to the rod (usually made of a synthetic material such as polyamide) housed relatively loosely—precisely because it is slidable—in the operating groove: these forces, with repeated use over time, eventually deteriorate the coupling and weaken the join between the rod and the boss and, more seriously still, the area surrounding the rod.
This deterioration reduces the strength of the door or window and, in the more serious cases, causes the rod to break or the boss to be detached from the rod, with obvious problems in terms of door/window security.
Similarly, as regards the above mentioned catch, the coupling to the respective abutment element—first abutting the front inside a socket and then lifting or lowering inside the socket for locking in the closed configuration—produces upwardly or downwardly directed lateral strain, leading to front stresses on the point where the catch and the rod are joined and creating the same problems as those mentioned above for the boss.
As regards the drive elements, one or more protrusions or levers are pushed in onto the tab or boss, producing an upwardly or downwardly directed lateral force (moment) similar to the one mentioned above in connection with the catch, leading to front stresses on the point where the tab and the rod are joined and creating the same problems as those mentioned above for the closing bosses.
In addition to the above, account must also be taken of break-in attempts which not only produce further, contingent strain on the door or window but are also facilitated by existing wear, especially on the closing elements.

Device for connecting door and window operating units


Described herein are methods and systems capable of generating weighted parameter sets, which can be randomly addressed for dictating a waveform of each pulse to be generated by using a probability distribution function loader to load a memory table with waveform parameter values, wherein the values are loaded according to a weighted probability distribution function. Each value is then randomly addressed in the memory table and/or randomly selected from the memory table by a random number generator and fed into a signal generation circuit for creation of the waveform to be transmitted.

In various electronic signal applications, e.g., communications, mobile phones, mobile data, RADAR, LADAR, electronic jamming, and/or any other civilian or military electronic signal application, it is often desirable to transmit or detect one or more signals having a varying parameter set, e.g., frequency, pulse width, amplitude, pulse repetition rate, chirp rate. For example, in various applications, it is desirable for one or more parameters of an electronic signal system to be "agile", i.e., variable, from pulse to pulse.
In various state of the art applications, parameter sets are determined a priori in a lookup table fashion. The operating conditions are identified and a single parameter set or a fixed sequence of parameter sets, determined a priori for the operating condition, are looked up in a database through a standard lookup table. In various other applications, pseudo-random number generators are often used to create "random" pulse-to-pulse agile waveforms. In other fields, random number generators are used to vary pulse width for power electronics. Each of these methodologies relies on fixed parameter sets or uniformly "random" parameter distributions (i.e., for each parameter, the uniformly random distribution is designed to spend uniform dwell time on each value) to vary transmitted signal properties.
However, in various applications, dwell time for some values of each parameter is preferably higher or lower than for others. For example, in some applications, it may be desirable to increase or decrease dwell time on one or more particular frequencies because the frequency is more or less useful than others, because more systems generally operate at that frequency, because conditions dictate that the frequency is more likely to be preferred, because there are a plurality of systems operating at different frequencies, because the system can transmit at a plurality of different frequencies, where some frequencies need to be used more often than others, or because the particular frequency is otherwise considered a higher or lower priority.

Creation of radio waveforms according to a probability distribution using weighted parameters


A network device is configured in a manner to prevent connectivity loops such as one way connectivity loops. A user configures a port of the network device to have an associated state. The state indicates that the port is for communication up the spanning tree towards a root network device, or down the spanning tree away from the root network device. The spanning tree protocol is then executed and determines a role for the port. The role determined by the spanning tree protocol is compared to the user selected state, and if there is an inconsistency, for example one that would indicate a one way connectivity loop, the port is blocked.

1. Field of the Invention
This invention relates to networks of switches operating at layer 2 and executing the spanning tree protocol.
2. Background Information
A longstanding problem in computer network design is the problem of one way loops. A one way loop is formed when a port develops one way communication, the port fails to receive superior BPDUs, and so transitions to designated role and begins forwarding data packets. The ports on each end of the one way link may make this transition, and the port which the fault permits to send packets to the next switch then forms the loop.
The computer network is formed from layer 2 switches with redundant connections, where the redundancy is introduced in order to provide automatic switchover in the event of failure of a switch or link. The layer 2 network having redundant connections is normally prevented from having loops by use of the spanning tree protocol (STP).
The STP selects a "root layer 2 switch" as the root of a spanning tree, and establishes a single link to each switch lower in the spanning tree. One link is established between the root switch and each switch in the first lower layer. Each switch in the first lower layer has one link established to one or more switches in the second lower layer, and each switch in the second lower layer has only one link upstream to one switch in the first lower layer, etc. A logical tree is built, so that communications between a first end station and a second end station is by sending packets from the first end station up the spanning tree to a common switch, and then back down another branch of the tree until the packet reaches the end station to which it is addressed.
Redundant links are eliminated by switching redundant ports into a role known as "blocking". A port of a switch may be established in one of three roles: "root" role for communications upstream toward the root switch; "designated" role for communications to a switch in the next lower layer in the spanning tree; and, "blocking" role in order to remove the port from communications by the spanning tree protocol in order to eliminate loops in the layer 2 network.
The ports are chosen for the roles of root, designated, or blocking by exchange of STP packets referred to as Bridge Protocol Data Units (BPDU packets). The BPDU packets have an 8 byte field referred to as the "switch ID" and a field referred to as the "port ID". The BPDUs from one switch and one port are "superior" or "inferior", depending upon the switch ID field and port ID fields. The switch having the smallest switch ID is chosen as the root switch, and then the switch ID becomes the Root ID. Switches lower in the tree exchange BPDUs, and the switch having the lowest switch ID is superior, and is chosen as the active switch in the logical tree. In the event of redundant ports between a root switch and the next lower switch in the spanning tree, the port having the smallest ID is superior. The superior port is chosen to establish the link. The ports not used to establish a link are transitioned into "blocking" role.
A port is maintained in blocking role by receipt of BPDUs superior to any BPDU which the port could transmit, and the ports each have a timer. If no superior BPDU is received during a timer period, referred to as a BPDU timeout period, the port transitions into designated role. The timer and BPDU timeout period are used to transition the network to a backup switch in the event that a switch being used in the spanning tree develops a fault, and consequently does not transmit its BPDU during the BPDU timeout period. The blocked port then transitions to designated role and begins an active role in the spanning tree, and in some cases triggers a new execution of the STP algorithm.
The one way connectivity problem arises when a particular port develops a faulty receiver, or the port on the other end of a link develops a faulty transmitter. In either case, the particular port receives no packets, and in particular no superior BPDUs. The absence of superior BPDUs causes the particular port to transition into designated port role, and to begin forwarding packets received from structures internal to its switch. The switch at the other end of the link begins receiving the packets and forwarding them, and so creates a loop in the network.
Attempts to solve the one way connectivity loop problem have mainly concentrated on establishing that one way connectivity exists by attempting to detect the absence of packets travelling in one direction along the affected link. These methods are inadequate for reliably detecting one way connectivity loops. These methods are discussed by Radia Perlman in her book Interconnections, Second Edition , published by Addison Wesley, Copyright date 2000, all disclosures of which are incorporated herein by reference, especially at pages 74-75.
There is needed a better method for eliminating loops formed as a result of one way connectivity faults.

Apparatus and method for preventing loops in a computer network


A refrigeration apparatus includes two sub passages which are branched from a main passage located between a condenser and an expansion part and which are connected to a compressor. On the sub passages are provided supercooling-use expansion parts, and supercooling-use heat exchangers for performing heat exchange between a refrigerant on an outlet side of the supercooling-use expansion part and a refrigerant of the main passage. Therefore, each time the refrigerant of the main passage passes through the two supercooling-use heat exchangers the degree of liquid supercooling of the refrigerant is increased.

The present invention relates to a refrigeration apparatus in which, for example, a compressor, a condenser, an expansion part and an evaporator are connected to one another.
In a conventional refrigeration apparatus, a compressor, a condenser, an expansion valve and an evaporator are connected to one another in a loop, where a supercooling-use heat exchanger is placed between the condenser and the expansion valve. Then, a liquid refrigerant derived from the condenser is branched into two flows. One flow of the liquid refrigerant makes a main flow liquid, while the other flow of the liquid refrigerant, after passing through the supercooling-use heat exchanger, super-cools the main flow liquid via the supercooling-use heat exchanger, then being led to the compression chamber of the compressor (see, for example, JP H11-248264 A).
However, the prior art refrigeration apparatus is incapable of further increasing the degree of liquid supercooling of the refrigerant immediately before the expansion valve. Thus, there have been limitations in improving the refrigerating capacity and energy efficiency (COP).


A semiconductor device comprising a semiconductor substrate of a first conductivity type, an element separating field oxide film formed on the semiconductor substrate and a MOS transistor formed in an element area defined by the field oxide film. The MOS transistor includes a gate electrode and source and drain regions each comprising a diffusion layer of a second conductivity type opposite the conductivity type of the semiconductor substrate. The semiconductor device further comprises a channel stopper of the first conductivity type and a punch-through stopper of the first conductivity type provided below the field oxide film and gate electrode, respectively. Furthermore, a diffusion layer of the second conductivity type of the MOS transistor does not contact the channel stopper and the punch-through stopper. Also disclosed is a method of fabricating the semiconductor device.

1. Field of the Invention
The present invention relates to a semiconductor device and a fabrication method thereof and, more particularly, to a semiconductor device having a reduced leakage current. The semiconductor device includes a MOS transistor having a channel stopper below a field oxide film and a punch-through stopper in a region below and in the vicinity of the gate electrode of the MOS transistor.
2. Description of the Related Art
With the miniaturization of integrated circuit devices formed in a semiconductor substrate, there has been a need to miniaturize the constituent elements of the integrated circuit device and to increase the integration density thereof. In order to accommodate such requirements, the distance between elements, that is, the width of the field oxide film which is an element separating region, must also be minimized. Practically, a field oxide film having a width of 0.5 .mu.m or narrower is required. However, when the width of the element separating region is minimized, the element separating performance thereof is degraded. A punch-through phenomenon then occurs between adjacent elements which results in current leakage. In order to solve this problem, a method has been proposed in which a guard ring is provided in a portion of the semiconductor substrate which is immediately below the field oxide film. The guard ring is provided by forming an impurity region of the same conductivity type as that of the semiconductor substrate but having a partially increased impurity concentration. Another method is known in which an impurity region of the same conductivity type as that of the semiconductor substrate is formed not only in the portion of the semiconductor substrate which is immediately below the field oxide film but also in portions of the semiconductor substrate which are below the diffusion layer and the gate electrode. That is, the subject impurity region may be formed in the whole surface of the semiconductor substrate.
An example of a conventional MOS transistor utilizing this technique is shown in FIG. 4. This figure shows an example of a dynamic RAM cell constructed with a MOS transistor and a MOS capacitor, in which an element region is defined by forming a field oxide film 2 on a p type semiconductor substrate 1, a gate oxide film 4 and a gate electrode 5 are formed in the element region, and n type diffusion layers 6S and 6D are formed as respective source and drain, regions. A contact hole is formed in an inter-layer insulating film 8, and a storage electrode 9 is then formed which is connected to the drain region 6D through an n.sup.+ type diffusion layer 7. The MOS capacitor is formed by providing a capacitance insulating film 10 and then a plate electrode 11 on an upper surface of the storage electrode. Furthermore, a channel stopper 3A is formed immediately below the field oxide film 2 of the p type semiconductor substrate 1, and a punch-through stopper 3B contiguous to the channel stopper is formed immediately below the MOS transistor.
FIGS. 5(a) and 5(b) show cross sections of the dynamic RAM cell of FIG. 4, including the main fabrication steps thereof. First, as shown in FIG. 5(a), a field oxide film 2 which becomes the element separating region of the p type semiconductor substrate 1 is formed to a thickness of 400 nm by the LOCOS method, etc. In this technique, only the element separating region is exposed to thermal oxidation using a mask of an anti-oxidation material such as a silicon nitride film. The p.sup.+ type channel stopper 3A for preventing the punch-through phenomenon, that is, the structure for preventing current leakage between adjoining elements, is formed immediately below the element separating region. The p.sup.+ type channel stopper 3A may be formed by masking a region prior to forming the field oxide film 2 by thermal oxidation, and implanting boron ion into only those portions in which the field oxide film is to be formed. However, in order to reduce the number of fabrication steps, a method is used in which the channel stopper 3 is formed by implanting boron into the whole surface of the semiconductor substrate after the field oxide film 2 is formed. That is, boron is implanted by adjusting the implanting energy thereof such that, in the element separating region, boron penetrates the field oxide film 2 to form a region having a peak boron concentration value immediately below the field oxide film 2. In the element region, the implant extends slightly deeper into the semiconductor substrate as measured from the surface of the semiconductor substrate, and in the prior art example, the boron concentration has a peak value located about 400 nm below the substrate surface. According to this method, the high concentration p.sup.+ region functions as a channel stopper 3A in the region below the element separating region, and the high concentration p.sup.+ region functions as a punch-through stopper 3B of the transistor in the region below the gate of the transistor. That is, both of these effects can be obtained in a single operation.
Then, as shown in FIG. 5(b), after the gate oxide film 4 is formed in the element region defined by the field oxide film 2 to a thickness of 10-15 nm, an n.sup.+ type polysilicon film is deposited to a thickness of 200 nm and the gate electrode 5 (wordline) is patterned by etching the n.sup.+ type polysilicon film by a known photolithography technique. Then, the n type diffusion layers 6S and 6D are formed by implanting phosphorous ion at a dose of 3.times.10.sup.13 cm.sup.-2 using the gate electrode 5 and the field oxide film 2 as a mask. The junction depth of the n type diffusion layers 6S and 6D is about 0.3 .mu.m. These n type diffusion layers become the source and drain regions of the MOS transistor, respectively. Then, as the inter-layer insulating film 8, a silicon oxide film, for example, is deposited to a thickness of 500 nm. Thereafter, a contact hole 13 is formed using a photolithographic technique (not shown) to expose the n type diffusion layer 6D. Then, in order to reduce the contact resistance, phosphorous ion is again implanted (at a dose of about 1.times.10.sup.14 cm.sup.-2) into the contact portion, an n type polysilicon film is deposited on the whole surface of the substrate and, then, the polysilicon film is patterned to form the storage electrode 9 of the capacitor in the contact portion. Thereafter, the substrate is heat treated to thermally diffuse the impurity from the storage electrode 9 formed of the n type polysilicon through the contact hole into the n type diffusion layer 6D of the semiconductor substrate, and to thermally diffuse the impurity implanted into the contract portion of the storage electrode 9 into the n type diffusion layer 6D of the semiconductor substrate. This forms the extended n.sup.+ type diffusion layer 7. Alternatively, the storage electrode 9 may be made into an n type storage electrode by depositing a non-doped polysilicon film, patterning it and diffusing an impurity such as phosphorous therein. In such case, it is possible to form the n.sup.+ diffusion layer 7 simultaneously with the diffusion of phosphorous.
Thereafter, as shown in FIG. 4, capacitance insulating silicon oxide film 10 having a film thickness of 3-5 nm is formed on the upper and side surfaces of the storage electrode 9, and plate electrode 11 is formed from a 200 nm thick n type polysilicon film. The capacitance portion of the dynamic RAM cell is thus obtained. The final depth of the n.sup.+ diffusion layer 7 is about 0.4-0.5 .mu.m. The dynamic RAM cell is completed by forming a wiring (not shown) which becomes a bitline. That is, charge stored in the storage electrode 9 is transferred from the n.sup.+ type diffusion layer 7 to the n type diffusion layer 6S by ON/OFF operation of the gate electrode 5 of the MOS transistor, so that data can be input/output.
In the construction shown in FIG. 4, however, the n.sup.+ type diffusion layer 7 must be opened in the vicinity of the field oxide film 2 in order to miniaturize the element. Therefore, the n.sup.+ type diffusion layer 7 contacts the p.sup.+ type channel stopper 3A and the punch-through stopper 3B, resulting in a p.sup.+ -n.sup.+ junction 15. FIG. 6 shows a profile of the impurity concentration of the p.sup.+ -n.sup.+ junction 15, particularly, a profile thereof with respect to the punch-through stopper 3B. The profile of the p.sup.+ type punch-through stopper 3B has an impurity concentration peak at a depth of about 0.4 .mu.m and a concentration of about 5.times.10.sup.17 cm.sup.-3. On the other hand, the profile of the n.sup.+ type diffusion layer 7 has an impurity concentration peak at the surface of the substrate and a concentration of about 5.times.10.sup.18 cm.sup.-3. Therefore, the p.sup.+ -n.sup.+ junction 15 occurs at a depth of about 0.3 .mu.m. However, the p.sup.+ -n.sup.+ junction occurs at a depth where the p.sup.+ and n.sup.+ impurity concentrations of the p.sup.+ -n.sup.+ junction are not peaks.
As a result, when a potential is applied thereto, a depletion layer extends substantially on both the p.sup.+ and n.sup.+ sides. Particularly, when the depletion layer extends to the n.sup.+ side, there is a problem in that a G-R center (generation and recombination center which is related to the impurity concentration) in the n.sup.+ type diffusion layer 7 may enter the depletion layer such that the stored charge leaks to the substrate side through the G-R center as a leakage path. Furthermore, in order to prevent this phenomenon, the amount of impurity diffusion from the storage electrode 9 may be increased to a value that is sufficient to compensate for the density of the p.sup.+ type punch-through stopper 3B. However, there is a problem in that the n.sup.+ type diffusion layer 7 may expand substantially not only in the depth direction but also in the lateral direction. As a result, the interval against an adjacent n.sup.+ type diffusion layer may decrease, the breakdown voltage between n.sup.+ -n.sup.+ areas may be reduced and charge may leak.
Alternatively, in order to reduce the leakage current, the impurity concentration of the p.sup.+ type punch-through stopper 3B and the p.sup.+ type channel stopper 3A may be reduced to restrict the expansion of the depletion layer to the n.sup.+ type diffusion layer 7. However, the resulting performance of the stopper is insufficient and causes an increase in the leakage current. When a sufficient impurity concentration is set, the leakage at the p.sup.+ -n.sup.+ junction increases resulting in an increase in the leakage current, as described above. As a result, in the case of a dynamic RAM, the stored charge leaks, the charge holding characteristics thereof are substantially degraded and the reliability thereof is decreased.
Patent Application Laid-open No. S60-10769 gazette proposes a structure having a punch-through stopper 3B and a channel stopper 3A independently formed below a gate electrode 5 and a field oxide film 2, respectively, as shown in FIG. 7. In this structure there is no p.sup.+ type channel stopper below an n.sup.+ type diffusion layer 6D of a contact portion. Thus, it is possible to reduce the junction leakage from the bottom surface of the n.sup.+ type diffusion layer 6D. However, the side surface of the n.sup.+ type diffusion layer 6D is in contact with the channel stopper 3A below the field oxide film 2 as well as the p.sup.+ type punch-through stopper 3B below and in the vicinity of the gate electrode 5. Therefore, a p.sup.+ -n.sup.+ junction ultimately exists in a lateral surface portion of the n.sup.+ type diffusion layer 6D. Leakage from that junction is dominant and causes the same problem as described in the above prior art example.

Semiconductor device and fabrication method thereof


The invention is of a new design for a room air conditioner. An air conditioner according to the present design will emit a substantially lower operating noise level than units of comparable cooling capacity and energy consumption. Additionally, the present design prescribes a coil design which requires approximately one-third less aluminum and copper than similarly performing room air conditioner units. The benefits of the present design arise from its reliance on a single row, wrap-around coil design which is used in conjunction with a tangential blower assembly. The single row evaporator coil of the present invention inherently produces less "wind noise" than multiple row coils. The positioning of the blower relative to the evaporator coil (the blower is enveloped by the coil in the preferred embodiment) and the positioning of the evaporator coil relative to the inner wall of the unit (which separates interior from exterior space) causes room air to flow into the space defined by the wrap-around evaporator coil from all directions, including the space adjacent to the inner wall, which air flow reduces the temperature gradient across the inner wall and reduces chassis insulation requirements.

1. Field of The Invention
Applicant's invention relates to air conditioning systems.
2. Background Information
Despite the prevalence of central heating and air conditioning systems in modern home and apartment construction, there remains a very large market and need for room-sized air conditioners.
Users of room air conditioners (also known by many as "window units") often fault the units because of the noise which they tend to generate. While the compressor and fan motor(s) of conventional room air conditioners do contribute to the units' operating noise, much of the noise heard by persons nearby a room air conditioner arises from the air flow through the units' evaporator coil assemblies.
In many circumstances, using room air conditioner(s) in lieu of central HVAC systems to cool only used portions of a dwelling can represent a substantial energy savings--something which benefits the resident from a financial standpoint, and, for obvious reasons, affords ecological benefits as well. Making available a room air conditioner which obviates the bases for consumer resistance to use of room air conditioners (noise being a principal one) could effect wide-spread benefits, as just mentioned.
Part of any effort to launch a new product, especially if to do so will necessarily require the participation of existing industry manufacturers, and even if it is a societally beneficial product, includes enticements to manufacturers to make the necessary investments to change production lines, etc. Enticements may be in the form of some promise of a larger, new market, or might relate to manufacturing or marketing efficiencies (and thus larger profits) in serving existing markets.
At least in part in view of the above, it would be desirable to make available to the consuming public a design for a room air conditioner unit which: (1) emits a substantially lower operating noise level than conventional units of comparable performance; (2) affords substantial material and manufacturing savings for those who make the unit; and (3) is highly energy efficient.


Refrigerant compositions are provided which include:                (a) pentafluoroethane or trifluoromethoxydifluoromethane or hexafluorocyclopropane or mixtures thereof, in an amount from about 60 to about 70% by weight based on the weight of the composition;        (b) 1,1,1,2- or 1,1,2,2-tetrafluoroethane or trifluoromethoxypentafluoroethane or 1,1,1,2,3,3-heptafluoropropane or mixtures thereof, in an amount from about 26 to 36% by weight based on the weight of the composition; and        (c) an ethylenically unsaturated or saturated hydrocarbon, optionally containing one or more oxygen atoms, having a boiling point from −12° C. to +10° C., or a mixture thereof, or a mixture of one or more of the hydrocarbons with one or more other hydrocarbons or ethers, said mixture having a bubble point from −12° C. to +10° C., in an amount from about 1% to 4% by weight based on the weight of the composition. Also provided is a process of refrigeration using the refrigerant compositions and a refrigeration apparatus containing the refrigerant compositions.

Refrigeration and air conditioning equipment frequently require large amounts of cooling. Recently, R22 (CHCIF2) has been used for this purpose. However, since R22 is an ozone depleter that will be phased out over the next decade, in accordance with the Montreal protocol, there is a need for an alternative refrigerant that has similar properties to R22, but is not an ozone depleter. Of particular concern is that the temperature/vapour pressure relationship for such a refrigerant should be sufficiently similar to R22 that it can be used in R22 equipment without having to change the control systems which are usually programmed in the factory making the equipment.
This is of particular concern for systems that have sensitive control devices, which rely on both the inlet pressure to the expansion valve and the outlet pressure. These control systems are based on R22 properties. Therefore, if an R22 substitute does not have a temperature/vapour pressure behavior which is similar to R22, the system will not operate correctly.
By similar, it is meant that the vapour pressure of the substitute should not differ from that of R22 by more than ±12% and preferably not more than ±6% at any given mean evaporating temperature between −40° C. to +10° C. It is also important that any such refrigerant has a similar capacity and efficiency as R22.Similar capacity means a capacity that is no more than 20% lower than that of R22 and preferably not more than 10% lower than R22 at mean evaporating temperatures between −35° C. to −28° C. Similar efficiency means not more than 10% lower than that of R22 and preferably not more than 5% lower at mean evaporating temperatures between −35° to −280° C.


The invention relates to a light comprising a light source or connection means for a light source, and a transparent panel which extends crosswise to a direction of light emission. An object of the invention is to improve the light in terms of glare suppression. To this end, the transparent panel is provided with a microstructure and light homogenization means are provided. The latter ensure that the brightness of the light entering the panel is approximately equal in all parts of the panel.

1. Field of the Invention
The present invention relates to a light comprising a light source or connection means for a light source, and a transparent panel which extends crosswise to the direction of emission.
2. Description of the Related Art
A light of this type belongs to a known lighting technology principle and is described for example in DE 299 06 884 U. Essential parts of such a light are at least one receptacle for at least one light source that generates the light required to illuminate a space (room), a transparent panel that is arranged between the receptacle and the space to be illuminated and whose outer surface facing the space forms an emission surface, and a base member on which the light source or connection means therefor and the panel are secured.
With known lights of the above type the panel of the light is arranged so that it is enclosed by the base member. The panel in many cases is secured to the base member in such a way that it rests against an inner arm of the base member extending roughly parallel to the panel.
With built-in lights an edge strip in the form of an outer arm may optionally in addition project outwardly from the base member roughly parallel to the panel, which serves to cover the installation gap of an installation opening so that the installation gap is not visible from the surrounding space.
In these modifications the base member comprises edge strips that are visible from the space to be illuminated, which strips are arranged in the case of a light of a lighting fascia on at least two oppositely facing sides of the light, and in the case of an individual light are arranged over the whole perimeter of the light and are visible as dark regions especially when the light is on.
A light panel is described in DE 296 02 576 U1 that is inserted into a ceiling covering and has a flat dome-shaped reflector, a light source arranged therein and a glass panel whose width corresponds to the width of the reflector and that rests on flat edge sections of the reflector. The panel and the reflector, which in their edge regions are thus superimposed on one another in a sandwich-like arrangement, are secured to the underneath of a holding frame that is in turn secured to the existing ceiling.
During operation of an installed light a light pattern produced by the luminous radiation that is of varying brightness and/or variously bright lit surfaces is/are generated at the emission surface of the panel, which are caused by the light source appearing as a surface or profile and by its environment or the reflecting surface. On the one hand this is attributed to the fact that the light intensity of the light emitted at the emission surface of the panel is greater in the immediate region of the light source than adjacent to the light source, which as a rule is arranged in the central region of the panel, i.e. in the lateral regions of the emission surface. Secondly, this is attributed to the fact that the distance between the light source and the panel increases in the lateral regions of the panel and the light is incident at smaller angles on the panel and has to illuminate a larger surface.
In order to homogenize the light pattern it is already known to provide a diffuse or opal panel. Although differences in the light panel and differences in the brightness caused for example by the structure of the light source are reduced, nevertheless in practice the light is undirected, with the result that a certain amount of glare occurs. The latter in any case interferes if the light is observed at a low angle from the side.


The present invention relates to inventory item expiration and renewal in a virtual universe. A method for in accordance with an embodiment of the present invention provides at least one item in the inventory of an avatar with metadata specifying whether the item must be renewed and how often. Instructions are obtained regarding a renewal of the item and the item is renewed based on the instructions.

A virtual universe is an interactive simulated environment accessed by multiple users through an online interface. Users inhabit and interact in the virtual universe via avatars, which are two or three-dimensional graphical representations of humanoids. There are many different types of virtual universes, however there are several features many virtual universes generally have in common:    A) Shared Space: the virtual universe allows many users to participate at once.    B) Graphical User Interface: the virtual universe depicts space visually, ranging in style from 2D "cartoon" imagery to more immersive 3D environments.    C) Immediacy: interaction takes place in real time.    D) Interactivity: the virtual universe allows users to alter, develop, build, or submit customized content.    E) Persistence: the virtual universe's existence continues regardless of whether individual users are logged in.    F) Socialization/Community: the virtual universe allows and encourages the formation of social groups such as teams, guilds, clubs, cliques, housemates, neighborhoods, etc.
An avatar can have a wide range of business and social experiences. Such business and social experiences are becoming more common and increasingly important in on-line virtual universes, such as that provided in the on-line world Second Life (Second Life is a trademark of Linden Research in the United States, other countries, or both). The Second Life client program provides its users (referred to as residents) with tools to view, navigate, and modify the Second Life world and participate in it's virtual economy.
Second Life and other on-line virtual universes present a tremendous new outlet for both structured and unstructured virtual collaboration, gaming and exploration, as well as real-life simulations in virtual spaces. These activities, along with yet to be disclosed new dimensions, in turn provide a wide open arena for creative and new business interactions, methods and mechanisms.
Inventory items are used to enhance a user's virtual life, allowing them, for example, to impress others or conduct business. An avatar can store personal and decorative software items such as clothing, accessories, or pets. Additionally, an avatar may store software for performing certain tasks such as playing music, decrypting documents that are received, etc., or store software tokens permitting access to certain areas within the virtual universe (e.g., a weeklong pass to an ongoing, virtual universe event). These inventory items can be bought, sold, traded, or given away to others, and can be modifiable by the user, or locked by the supplier to prevent modification or copying.

Inventory item expiration and renewal in a virtual universe

International Business Machines Corporation


The process includes impregnating carbon threads with molten pitch in an impregnation tank 4, shaping them by means of a short die 8, subjecting the so thread to thermal treatment by progressive heating while it is continuously passed through a treatment furnace 9, then cutting the shaped member when it leaves the furnace.

The shaped members in question, which may or may not be of square cross-section, or in the shape of thin circular bars, may be used in the formation of certain high performance and low density composite materials which can be used in the aerospace industry.
The use of methods of pultrusion, by means of which it is known to calibrate a material by passing it through a die of precise internal cross-section, is well known for the production of threads or shaped members of composite material. In certain cases a shaped die formed by a simple diaphragm of small thickness is used, through which a staple sliver is drawn under force and calibrated after impregnation in a resin bath. In other cases, the thread preimpregnated in that manner is wound on a former of rectangular cross-section such that each preimpregnated rectilinear cord stretched across one side of the former can, after polymerization and cutting, constitute a rigid shaped composite member. Those discontinuous methods of manufacture are best used for shaped members of a length limited to the length of the support frame and therefore cannot be adapted to industrial applications that aim to produce shaped members that are calibrated with the greatest degree of accuracy and are of long length. Indeed the known methods do not allow reproducibility of shaping and cross-section since the setting of the material is effected discontinuously and is not rigorously carried out in an identical manner from one operation to another.
Pultrusion methods, comprising the calibration of a shaped member through one or more dies by means of traction of the shaped member, have allowed an improvement in the products obtained. A pultrusion bench is known generally to be constituted by a continuous unwinding station for dry threads, followed by a tank for impregnating the composite material with resin, the material then being displaced continuously by a traction mechanism inside a long heating die which ensures the shaping of the product and its polymerization. A cutting device for cutting the shaped member into lengths is provided at the outlet of that bench. Such continuous manufacture by that pultrusion method, however, requires a relatively long passing time through the heating die if complete and correct polymerization of the resin is desired without deformation of the shaped member, for example without twisting, and this is accomplished to the detriment of the speed of production. In addition, the die stands in the way of total elimination of volatile products from the resin. Finally, the existence of a single long shaping die does not eliminate completely the jamming of composite material fibrillae at the inlet, since frictional forces are associated with the length of the die and promote jamming. Whether there are several dies or one long die, these jams necessitate numerous manual interventions, especially for the purpose of cleaning, which involves stopping the machine and the loss of time in replacing the thread in the die. It is therefore not possible to use those dies for the manufacture of carbon/carbon shaped members of small cross-section since the shaped members would break.
This method of manufacture by means of a long heating die is not suitable for carbon/carbon composite material shaped members of small cross-section, that is to say, of a cross-section smaller than 1 mm. Indeed the use of that method is very tricky since the pultrusion force necessary for the shaping is significant and might cause breakage of the carbon fibers. Furthermore, the alignment of the dies is critical and it would not be possible, owing to the duration of the production, to be assured of continuous manufacture over long lengths.

Process of making shaped members length made from carbon-carbon composite materials

Aerospatiale Societe Nationale Industrielle


The present invention provides a DNA vaccine for carps for inducing protective immunity against Koi herpesvirus (KHV). The DNA vaccine comprises a DNA comprising a nucleotide sequence encoding an immunogenic polypeptide against Koi herpesvirus (KHV) of carps, or an expression vector comprising the DNA as an active ingredient.

Koi herpesvirus disease is a disease that develops in black carps (Magoi) or colored carps (Nishikigoi) by being infected with Koi herpesvirus (KHV). When the disease is developed, the fishes' motion becomes slower or their appetite decreases. There is no remarkable visible symptom, but color degradation or erosion (sore) of brachia is observed. It is a disease developed from immature fishes to mature fishes, with high mortality rate.
The Koi herpesvirus disease was reported for the first time in May 1998, in Israel. Later, also in Israel, the disease has been reported twice, in autumn of the same year and in the next spring, and about 600 tons of carps, including those for exportation, died. The total damage exceeded 4 million U.S. dollars. After that, many onsets have been reported successively in many countries around the world including Israel, Great Britain, Germany, Netherlands, Belgium, United States, Indonesia, and Taiwan.
In November 2003, the Ministry of Agriculture, Forestry and Fisheries of Japan announced that carps suspected of being infected by Koi herpesvirus disease have been observed in Kasumigaura, Ibaraki prefecture. After which, onsets of Koi herpesvirus have been reported in various regions of the country, including Aomori, Yamanashi, Mie, Okayama and Miyazaki. The Ministry of Agriculture, Forestry and Fisheries is currently making efforts to determine the infection pathway of the disease as well as to prevent dispersion of this disease.
Though some vaccines for fish and shellfish have been developed for bacterial infection, there are almost none for viral or parasitic diseases other than the vaccine against iridovirus in some salmonids and Perciformes (for example, see patent document 1).
Generally, vaccines are used to prevent or treat viral infections. Vaccines include inactivated vaccines (Japanese encephalitis, Weil's disease, etc.), toxoids (tetanus, diphtheria, etc.), attenuated vaccines (BCG, polio, etc.), recombinant vaccines (hepatitis B, etc.). Inactivated vaccines and toxoids, which have detoxified exotoxins, are relatively safe vaccines that induce antibody production. Recombinant vaccines on the other hand do not contain impurities compared to inactivated vaccines, and are believed to be safer vaccines. The only vaccines for fisheries currently authorized in Japan are inactivated vaccines against Vibrio disease, alpha-hemolytic Streptococcus disease, iridovirus and beta-hemolytic Streptococcus.
Although these vaccines can induce antibody production, cellular immunity is hardly induced, which is a deficit. Moreover, it is commercially necessary to obtain large amount of virus to be the antigens for inactivated vaccines and attenuated vaccines, and it is essential to secure appropriate viral particles. Moreover, in many cases, immune effect obtained with attenuated vaccines is maintained for a long period of time, and so are the side-effects or risks. As for inactivated and recombinant vaccines, the maintenance of antigens is thought to be short in hosts, and adjuvants or the like are therefore needed. All these conventional types of vaccines need refrigeration from manufacture until inoculation to a subject. As such, problems of cost increase and decrease in effect are encountered.
Recently, research and development of vaccines are proceeding creating new types of vaccines. DNA vaccine is a leading new generation vaccine done by administering a plasmid DNA encoding an immunogenic protein to the host. With DNA vaccine, disadvantages of conventional vaccines, as described in the following, have been addressed. These DNA vaccines can induce strongly not only humoral immune response but also cellular immune responses; can endow protective ability against infections; can be purified in large amounts; and because it is stable at room temperature or under high temperature, it does not require refrigeration and have a longer shelf-life. Furthermore, construction or change of DNA vaccines can be readily made by genetic engineering, hence the time necessary to develop it is shortened.
As examples, there have been reports on intramuscular injection of a gene encoding glycoprotein, a constituent protein of Rhabdovirus, stimulating immune response of Oncorhynchus mykiss (for example, see non-patent document 1), and of DNA vaccines (for example, see non-patent document 2); of DNA vaccines against viral hemorrhagic septicemia of Paralichthys olivaceus (for example, see patent document 2); or of DNA vaccines against virus encoding apoptosis-inducing protein of infectious hemapatopoietic necrosis (IHN) virus (for example, see patent document 3); or of DNA vaccines for cultured types using genetic expression system that can induce expression of an immunogenic polypeptide (for example, see patent document 4). However, DNA vaccines for stimulating protective immunity against Koi herpes virus of carps have not yet been reported.
[Patent document 1] Japanese Laid-Open Patent Application No. 9-176043
[Patent document 2] Japanese Laid-Open Patent Application No. 2005-112726
[Patent document 3] Japanese Laid-Open Patent Application No. 2002-125674
[Patent document 4] Japanese Laid-Open Patent Application No. 9-285291
[Non-Patent document 1] P. Boudinot et. al, Virology, (USA), 1998, Vol. 249, p. 297-306
[Non-Patent document 2] McLauchlan et. al, Fish and Shellfish Immunology, England, 2003, Vol. 15, p. 39-50

DNA vaccine for Koi herpes virus (KHV) disease

National University Corporation Tokyo University of Marine Science and Technology


This invention generally relates to a method for producing an analytical system, and to a analytical system for detecting an analyte in a body fluid. The analytical system comprises a test element and a lancet which is movable relative to the test element and which is received on the test element. The lancet is connected to the test element via an elastomer spring.

Test elements in the form of test strips for detection of analytes in blood have been state of the art for some time now. Test elements in test strip form are used particularly in the field of blood sugar measurement. Measurement of blood sugar levels by the patients themselves has led to continued development of test systems and of the test strips, mainly designed as test strips, used in said systems. The aims of this development were improved analysis, improved operating safety, a reduction in the volumes of blood that have to be taken from the patient, and simplified handling, particularly a reduction in the handling steps needed.
To obtain the blood for carrying out the analysis by means of test elements designed as test strips, various designs of puncturing aids have been developed which are used to perforate the patient's skin and to allow emergence of the quantity of blood needed for the analysis. To improve handling, test elements have been proposed that permit a combination of puncturing and measuring devices.
Prior art systems have disclosed a puncturing aid with a lancet system that is protected against reuse.
The puncturing aid is used to create an opening in the skin and typically comprises a housing into which a lancet system can be inserted. The housing moreover comprises a retaining element which cooperates with a corresponding retaining element of the lancet system, so that the lancet system can be positioned in the housing at a defined location. The housing moreover comprises an opening from which a needle tip of at least one needle of the lancet system can emerge during a puncturing procedure. A drive mechanism for driving the at least one needle is provided, so that the needle can be transferred from a rest position to a puncturing position. The needle is connected to a needle body in such a way that the needle and a protection area of the needle body are movable relative to one another. In a first position, the protection area of the needle body at least partially surrounds the needle tip, whereas, in a second position, the needle and the protection area of the needle body are arranged relative to one another such that the needle tip is freed from the protection area of the needle body. The needle body moreover includes a blocking mechanism which is actuated through cooperation with the puncturing aid and changes the needle body so that, after the lancet system has been ejected from the puncturing aid, interaction between the retaining element of the puncturing aid and retaining element of the lancet system is prevented upon renewed insertion.
According to know solution, the metal needle is secured on a plastic body and is fixedly connected to the plastic body. An area is formed on the plastic body for the purpose of coupling the lancet system to a drive ram, so that the needle can be moved along the axis in the direction of puncturing. The rear area of the plastic body is designed for coupling to the drive ram such that two arms, provided with projections, permit a form-fit connection of the plastic body to the puncturing aid. Therefore, producing a coupling between the lancet needle and the puncturing drive mechanism represents an additional outlay, both in terms of the lancet needle and in terms of the measurement appliance.
The solutions known from the prior art, regarding a system composed of a combination of test element and puncturing aid, are all either associated with the disadvantage of having a large overall size or require a coupling to the measurement appliance, which, from the technical point of view, is an unsatisfactory situation. Therefore, there is a need to have a system is comprised of test element and puncturing aid that overcomes the disadvantages of prior art.

Test element with elastically mounted lancet


Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

This application relates generally to thermal ground planes. More specifically, this application relates to methods, apparatuses, and systems for flexible thermal ground planes.
The complexity and size of integrated circuits may been limited by the heat generated. Heat pipes have been used to transfer heat efficiently from one location to another. They have also been used to cool integrated circuits. The existing heat pipes for these purposes may consist of a rigid structure composed of copper, silicon, etc. Some modern electrical devices and systems demand a flexible circuit board along with a high capacity for heat dissipation.
There is thus a need for methods, systems, and devices that may also be flexible while transferring heat efficiently from one location to another or spread high flux heat from a small area to low heat flux over a larger area.

Flexible thermal ground plane and manufacturing the same


In a motor control system and method controlled by a d-axis current command value i.sub.ds and a q-axis current command value i.sub.qs, a d-axis voltage command value V.sub.d * and a q-axis voltage command value v.sub.q * are computed on the basis of d-axis current deviation .DELTA.i.sub.d of d-axis current value i.sub.d from the d-axis current command value i.sub.ds and q-axis current deviation .DELTA.i.sub.q of q-axis current value i.sub.q from the q-axis current command value i.sub.qs and on the basis of q-axis inductance value L.sub.q and d-axis inductance value L.sub.d wherein the inductance values L.sub.q and L.sub.d are tuned or adjusted so that the d-axis current deviation .DELTA.i.sub.d and q-axis current deviation .DELTA.i.sub.q approach zero.

1. Field of the Invention
The present invention relates to systems and methods for controlling motors.
2. Related Art
In the prior art, an electric vehicle employs a motor such as a brushless motor including a permanent magnet rotor and a stator having coils to which U, V and W phases of electric current are fed to drive the motor.
A motor control circuit or unit receives a current command value from a vehicle control circuit which controls the electric vehicle. The motor control circuit generates pulse width modulated signals forming the U, V and W individual phases in accordance with the current command value. The pulse width modulated signals are output to a drive circuit.
This drive circuit generates transistor drive signals corresponding to the pulse width modulated signals and outputs the transistor drive signals to an inverter bridge. The inverter bridge has six transistors which are turned ON only when the corresponding transistor drive signals are ON to generate and feed the currents to individual phases of the stator coils. Thus the electric vehicle is run by activating the motor drive unit to drive the motor.
When the values of currents of two of the three phases are determined, the value of the current of the third phase can be computed. In order to control the currents of the individual phases, only the currents of the U and V phases, for example, need be detected by current sensors. Feedback control is performed on a d-q axis model in which the d-axis is taken in a direction of a magnetic pole pair of the rotor and the q-axis is taken in a direction perpendicular to the d-axis.
In the motor control circuit, the sensed currents of the U and V phases are converted into a d-axis current and a q-axis current by a three-phase to two-phase conversion. A deviation of the d-axis current from a d-axis current command value is computed so that a d-axis voltage command value is generated on the basis of the d-axis current deviation. Similarly, a deviation of the q-axis current from a q-axis current command value is computed so that a q-axis voltage command value is generated on the basis of the q-axis current deviation. These d-axis and q-axis voltage command values are converted into U, V and W phase voltage command values by two-phase to three-phase conversion. The pulse width modulation signals of the individual phases are generated from the corresponding voltage command values.
In order to compute the d-axis and q-axis voltage command values using the respective d-axis and q-axis current deviations, corresponding inductances of the motor are employed so as to prevent interference between the d-axis and q-axis voltage command values. These inductances are estimated from the transient changes in the corresponding d-axis and q-axis currents.
However the prior art drive unit estimating the inductances from the transient changes in the d-axis and q-axis currents required complicated estimating computations enlarging the scale and cost of the motor control circuit. Additionally to avoid instability in the currents of the individual phases, relatively long time constants for measuring transient changes are required and such long time constants reduce the quickness of response to changing conditions.


The invention relates to a method for configuring a vehicle, which is provided for a plurality of users. The method includes storing user data, where the user data are gathered in a user account, and available vehicle features of the vehicle in a storage unit. The method further includes defining vehicle groups based on the association of a respective user account to be assigned to the vehicle with a respective user group and defining a configuration by assigning respective availabilities of vehicle features of the vehicle to a user of a respective vehicle group. The method further includes storing the configuration in the storage unit. The invention also relates to a vehicle, which is designed to implement the method according to the invention.

Today's new cars, i.e., newly produced vehicles, are usually designed individually for an end customer. Usually, the end customer is also the proprietor and owner of the vehicle. This means that each end customer selects the vehicle features according to his or her wishes. If the selected vehicle features only relate to settings of parts installed in the vehicle, the so-called hardware, they can usually be set via software. Existing services in the vehicle are subsequently activated or deactivated via the software. Among other things, this also applies to safety-critical functions, such as the configuration of a vehicle access or the connection of a user account to a vehicle. For example, vehicle settings, such as an orientation of the rearview mirrors, seating position and the like, can also be loaded via the user account.
However, the same software is also available in a vehicle that is available to multiple users, such as in fleet vehicles of traditional vehicle rental companies or so-called car-sharing companies that provide a fleet of vehicles for use by multiple users. Such a user is only a short-time owner and user of the vehicle, namely during the agreed rental period.
Possibilities are known from the prior art to influence the configuration of a vehicle for a user.
From DE 10 2015 114 684 A1, a vehicle total reset is known. When detecting a new user, settings of a fleet vehicle are supposed to be reset.
From DE 10 2015 113 262 A1, a system for shared vehicles is known. It is supposed to be determined whether the vehicle is within sight of a user device camera. The user device is supposed to be provided at least with directions to the shared vehicle, and data of the shared vehicle are supposed to be identified. Furthermore, from '262 A1, the configuration of a fleet vehicle on the basis of a user profile, and the blocking of an adjustment of settings of a main user by a second user of the fleet vehicle is known.
From DE 10 2013 015 737 A1, a method for the configuration of a motor vehicle is known. Here, a user profile is to be retrieved from a central computer in order to perform a configuration of settings of a fleet vehicle.
For that purpose, the software is equally available to each user of such a fleet vehicle. With the method known from the prior art, a respective only short-term user can access all setting options offered by the respective vehicle, and thus individually adjust or adapt the settings. As a result, changes and configurations in the vehicle and in vehicle modules are possible by a user who has only temporary vehicle access. Such changes may sometimes not be intentional or pose a security risk. Furthermore, it is disadvantageous that changes or availabilities of software or settings are not communicated to the vehicle, since shutdowns of services partly relate to entire country identifications and the fleet use of the vehicle is not known to the system.


A probe apparatus having a probe card having plurality of probes, a member arranged above the probe card to hold an object to be probed, and a test head electrically connected to the probes of the probe card.

1. Field of the Invention
The present invention relates to a probe apparatus and, more particularly, it relates to a probe apparatus for examining electric characteristics of objects such as semiconductor wafers while contacting probes of the probe apparatus with electrode pads of each of the wafers.
2. Description of the Related Art
The probe apparatus has been well-known as means for examining electric characteristics of objects such as semiconductor wafers.
One of the conventional probe apparatuses of this type has such an arrangement as shown in FIG. 1. More specifically, it comprises a table 11 attached to an apparatus body 1, which can be moved in horizontal and vertical directions, and on which a wafer 10 is mounted, a probe card 13 arranged above the wafer-mounted table 11 and provided with probes 12 which are contacted with electrode pads of the wafer 10, and a test head 15 contacted with contact elements 18 on the top of the probe card 13 through input/output pins 14 to convert electric signals applied from the probe card 13. The test head 15 is connected to measuring equipment located outside through a plurality of wirings in a cable 16. Hinges 17 are attached to the test head 15 to enable the latter to be swung in those directions which are shown by arrows in FIG. 1. A manipulator (not shown) is attached to one side of the apparatus body 1 to move up and down the probe card 13 and the test head 15 as a unit.
When electric characteristics of the wafer 10 are to be examined by the above-arranged probe apparatus, the test head 15 is moved and set relative to the top of the probe card 13. Electrode pads of the wafer 10 on the wafer-mounted table 11 are aligned with probes of the probe card 13 by an alignment device (not shown). The probe card 13 is moved downward together with the test head 15 to contact the probes 12 of the probe card 13 with the electrode pads of the wafer 10. Electric characteristics of the wafer 10 are thus examined.
In the case of this probe apparatus, however, the number of input/output pins must be increased and the wiring must be made more complicated as the number of electrodes of the wafer is increased. This makes the test head 15 extremely heavy such as 800 kg, for example. In addition, the diameter of the cable 16 through which the test head 15 is connected to the external measuring equipment must be made larger. The structure of the apparatus body 1 must also be made more rigid to make stronger the hinge system by which the test head 15 is swung. Therefore, the probe apparatus becomes largersized. Further, there is a possibility that wirings in the cable must be broken because the diameter of the cable becomes larger and because more excessive load is thus added to the cable when the test head 15 is to be swung.
In the case of the above-arranged probe apparatus, too, it cannot be avoided that the cable through which the test head 15 is connected to the external measuring equipment becomes longer. When electric characteristics of objects such as semiconductor wafers are to be examined, it is usually preferable that the examination is carried out using a frequency substantially equal to or near that of signals applied from the objects to be examined. When the cable is long, however, signal delay of about 1 nsec is caused per 10 cm of the cable. Therefore, the examination cannot be carried out at a high frequency of about 500 MHz. The above-arranged probe apparatus was not satisfactory in this point when it was used to examine such semiconductor chips that must meet high speed for super computers.
Another tester comprising a tester body 2 provided with the measuring equipment and a test head 20 combined with the tester body 2, as shown in FIG. 2, is wellknown. In the case of this tester, the cable through which the test head 20 is connected to the measuring equipment is shorter, as compared with the abovementioned one. This can prevent signal delay from being caused.
However, this tester takes a longer time for measurement because the measuring person must examine a semiconductor chip 22 after it is manually picked up from its packaged cassette and must manually return it to the cassette after the examination is finished. This makes it impossible to examine a large number of matters with high efficiency.

Probe apparatus for probing an object held above the probe card