The present invention relates to the identification of alleles of the MET2 and SKP2 genes having the effect of reducing the production of sulphites, of hydrogen sulphide and of acetaldehyde by Saccharomyces, and to the use of these alleles in methods for controlling the production of these compounds during alcoholic fermentation.

The present invention relates to the control of the production of sulfites, of hydrogen sulfide and of acetaldehyde during alcoholic fermentation by yeasts.
Sulfur dioxide (SO2) and its various forms in equilibrium in solution (HSO3−, SO3−), collectively denoted sulfites, are used as additives in enology, principally to improve the conservation of wines, owing to its antioxidant and antibacterial properties. However, an excessive amount of sulfites in wine can lead to intolerances and allergies in certain consumers; they may also be prejudicial to its organoleptic qualities, given that they give, if there in excess, drying sensations. Excessive amounts of sulfites at the end of alcoholic fermentation can thus be disadvantageous when the wine producer wants to carry out malolactic fermentation. Lactic acid bacteria, responsible for this fermentation, are inhibited by low sulfite contents, and an excess delays the initiation of said fermentation. Hydrogen sulfide is also a metabolite formed by yeasts in fermentation which is prejudicial to the quality of wines when it is present in excess owing to the "rotten egg" or "reduced" tastes that it imparts.
It is therefore important to be able to optimize the amount of sulfites and of hydrogen sulfide in wines and during winemaking. A major difficulty in this context comes from the fact that part of the sulfites and of the hydrogen sulfide present in the wine comes from the fermentative metabolism of yeasts, where they constitute intermediates in the synthesis of sulfur-containing amino acids. Inorganic sulfate enters the cell by means of a sulfate permease. It is activated to give adenosylphosphosulfate (APS) by ATP-sulfurylase, then the APS is phosphorylated by adenosylphosphosulfate kinase to produce phosphoadenosylphosphosulfate (PAPS). The PAPS is then reduced to SO2 by PAPS reductase. The SO2 is reduced to H2S by sulfite reductase. Homocysteine, which is the precursor of sulfur-containing amino acids, is synthesized by reaction of H2S with O-acetylhomoserine, catalyzed by O-acetylhomoserine sulfhydrylase.
Since the amount of sulfites produced by yeasts during fermentation varies from one yeast strain to another, this complicates the control of the overall sulfite content. The same is true for hydrogen sulfide, the amount of which formed depends greatly on the yeast strain.
Another compound, the presence of which in wine above certain amounts is considered to be undesirable, is acetaldehyde. Acetaldehyde at too high a concentration gives wines "musty" notes which are considered to be negative. It is produced by yeasts during fermentation, and its production appears to correlate with the SO2 content, and like that of the SO2, varies from one yeast strain to another.
Various approaches have been proposed for obtaining yeast strains producing reduced amounts of sulfites and/or of hydrogen sulfide.
PCT application WO 2008/115759 and PCT application WO 2009/046485, and also the publications by Cordente et al. (FEMS Yeast Res, 9, 446-59, 2009) and Linderholm et al. (Appl Environ Microbiol, 76, 7699-707, 2010), describe various mutations in the METS or MET10 genes (encoding the 2 catalytic subunits of sulfite reductase) which have the effect of reducing hydrogen sulfide production. Application WO 2009/030863 and the publication by Marullo et al. (FEMS Yeast Res, 7, 1295-306, 2007) describe various markers associated with characteristics of interest in enological yeasts. One of these markers (YOL083w) located on chromosome XV is associated with a reduced H2S production.

Method for controlling the production of sulphites, of hydrogen sulphide and of acetaldehyde by yeasts

INSTITUTE NATIONAL DE LA RECHERCHE AGRONOMIQUE

CENTRE INTERNATIONAL D'ETUDES SUPERIEURES EN SCIENCES AGRONOMIQUES (MONTPELLIER SUPAGRO)


The invention features a method of treating an inflammatory condition in an individual, comprising administering an agent inhibits the interaction between a Toll-like receptor 2 (TLR2) and a high mobility group B (HMGB) polypeptide to the individual. The invention also features methods for identifying agents that inhibit the interaction between TLR2 and HMGB.

Inflammation is often induced by proinflammatory cytokines, such as tumor necrosis factor (TNF), interleukin (IL)-1α, IL-1β, IL-6, platelet-activating factor (PAF), macrophage migration inhibitory factor (MIF), and other compounds. These proinflammatory cytokines are produced by several different cell types, including immune cells (for example, monocytes, macrophages and neutrophils), and non-immune cells such as fibroblasts, osteoblasts, smooth muscle cells, epithelial cells, and neurons. These proinflammatory cytokines are part of an inflammatory cytokine cascade that contributes to the occurrence of inflammation. In addition to mediation of inflammation, early proinflammatory cytokines (e.g., TNF, IL-1, etc.) induce the late release of high mobility group box 1 (HMGB1; also known as HMG-1 and HMG1), a protein that accumulates in serum and mediates delayed lethality and further induction of early proinflammatory cytokines.
HMGB1 was first identified as the founding member of a family of DNA-binding proteins termed high mobility group box (HMGB) proteins that are critical for DNA structure and stability. It was identified nearly 40 years ago as a ubiquitously expressed nuclear protein that binds double-stranded DNA without sequence specificity. The HMGB1 protein has three domains: two DNA binding motifs termed HMGB A and HMGB B boxes, and an acidic carboxyl terminus. The two HMGB boxes are highly conserved 80 amino acid, L-shaped domains.
Recent evidence has implicated HMGB1 as a mediator of a number of inflammatory conditions (U.S. Pat. No. 6,303,321). The delayed kinetics of HMGB1 appearance during endotoxemia makes it a potentially good therapeutic target, but little is known about the molecular basis of HMGB1 signaling and toxicity.

This patent is subject to a terminal disclaimer.

Inhibitors of the interaction between HMGB polypeptides and toll-like receptor 2 as anti-inflammatory agents

The Feinstein Institute for Medical Research


An image processing apparatus comprises an image generating unit for generating an image from image data for an image containing an embossed part formed on a medium, the image generated by the image generating unit being different in form of the embossed part or neighborhood thereof from the image formed on the medium, and a display control unit for displaying the image generated by the image generating unit on a display apparatus.

1. Field of the Invention
The present invention relates to an image processing apparatus, an image processing program, and an image processing method for displaying an image simulating a printed form of image data subject to embossing print, and more specifically to an image processing apparatus, an image processing program, and an image processing method for showing a preview allowing easy recognition of an embossed part.
2. Description of the Related Art
Today, an image forming apparatus such as a printer and a copying machine which applies electrophotography and electrostatic recording to form an embossed image using foaming toner is known.
Publicly known art for print of these types of embossed images (embossing print) include, for example, technology which uses achromatic foaming toner to print character data such as braille and image data such as a map representing topography as embossing print.
Publicly known art for achieving embossing print including a color image by coloring a foaming toner image includes art described in Japanese Unexamined Patent Publications 2001-134006, 2001-134091, and 2001-194846.
In the aforementioned publicly known art, toner images each containing a color material of a predetermined color are placed on a foaming toner image in an electrophotography recording process, for example, and individual toner images placed on the foaming toner image are melted and fixed after the foaming toner image are foamed with the heat generated in the fixing process, thereby providing an embossed image.
A system configuration for realizing such embossing print includes a configuration where a personal computer (PC) and an embossing printer are connected with each other over a network, a print file where a tag and the like is used to specify a region for an embossed part is generated on the PC using different types of application software, and printing is instructed to the embossing printer.
Usually, a user interface (UI) is provided to show a print preview for reviewing a finished state when a print instruction is provided from the PC to the printer, and this UI allows repeating the review of the print state on the print preview, and then providing the print instruction, thereby obtaining a print with a desired finish.
This standard print preview provides a display faithful to a top view appearance of an image to be printed out (printed matter) as much as possible.
However, it is impossible to recognize where the embossed parts exist when the image faithful to the top view appearance of the printout is displayed as a preview in the aforementioned embossing print.
The reasons for this mainly include that the height of the embossed part on the embossing print is about some hundreds microns, the embossment is achieved by vertical protrusions with respect to the surface of the sheet, and an embossed image cannot be recognized if the embossed image underlie a normal image.
As described above, there has been such a problem that any standard print preview equipped for a PC does not provide an effective preview display for an embossing print so that how and where an embossed image is printed cannot be recognized.

Image processing apparatus, image processing program and image processing method


A laminated ceramic capacitor includes a ceramic substrate and a plurality of internal electrodes. The ceramic substrate is of a shape defined by length, width and thickness directions. The internal electrodes are stacked one over another within the ceramic substrate at spaced intervals in the thickness direction and alternately led out to opposite ends of the ceramic substrate in the length direction. The ceramic substrate has opposite surfaces in the thickness direction, one of which is planar. In the laminated ceramic capacitor, 1<Db/Da≦2.1, where Da represents a distance between the planar surface and an outermost internal electrode at a center between the opposite ends of the ceramic substrate, and Db represents a distance between the planar surface and the outermost internal electrode at one of the opposite ends of the ceramic substrate.

1. Field of the Invention
The present invention relates to a laminated ceramic capacitor and a manufacturing method therefor.
2. Description of the Related Art
Generally, laminated ceramic capacitors are constructed such that a plurality of internal electrodes are stacked one over another with ceramic layers interposed therebetween and alternately led out to opposite ends of a ceramic substrate. Such a laminated ceramic capacitor has steps due to the presence or absence of the internal electrode between the ends and the center of the ceramic substrate, i.e., between the location where the internal electrodes and spaces alternate with each other in the direction of lamination and the location where the internal electrodes are stacked one over another without the spaces. The steps invite dimensional distortion of the ceramic substrate, which contributes to improper mounting of the laminated ceramic capacitor.
As means for solving the problem of steps, Japanese Patent Application Publication No. 2001-358036 discloses a technology of printing a ceramic paste around the internal electrodes for absorbing the steps.
However, the ceramic paste for absorbing the steps has to be printed around the internal electrodes in a precise pattern, which requires high-precision printing. Adding such an operation complicates the manufacturing process.
In addition, printing the ceramic paste around the internal electrodes for absorbing the steps tends to cause a problem of sheet attack. That is, there is a possibility that a solvent of the ceramic paste will penetrate in between a green sheet and a polyethylene terephthalate (PET) film to cause separation of the green sheet from the PET film.

Laminated ceramic capacitor and manufacturing method therefor


A pump is disclosed that comprises a primary control unit comprising a first processor and one or more modular pumping units removably docked to the primary control unit. Each modular pumping unit comprises a pumping mechanism and a second processor configured to control the pumping mechanism and communicate with the first processor. The modular pumping unit is configured to manipulate a portion of a fluid delivery set to pump a fluid. The first processor and the second processor are configured to exchange one or more operating parameters when the modular pumping unit is docked to the primary control unit. The modular pumping unit is configured to pump the fluid after being undocked.

1. Field
The present disclosure generally relates to systems and methods of delivering medical fluid to patients, and, in particular, relates to infusion pumps.
2. Description of the Related Art
Infusion pumps have become commonplace within the healthcare world as a way to precisely administer intravenous (IV) fluids. Use of a pump in place of an elevated fluid container with a simple roller clamp to control the flow of the IV fluid allows more accurate and consistent control of the rate of delivery of the fluid to the patient.
The assembly of tubing, valves, fittings, and needles that connect the fluid container to the patient may be referred to as an "IV set." IV sets are typically disposable to reduce the risk of infection and contamination. When used with an infusion pump, the IV set includes a segment intended to be manipulated by the pump to cause the fluid to flow at a controlled rate. For a peristaltic type of pump, this segment may be as simple as a length of tubing that is fitted into the pumping compartment. A patient 10 receiving an infusion of medical fluid from source of medical fluid 14 delivered by a typical IV pump system 12 using an IV set 18 is shown in FIG. 1.
Many IV pumps are large and heavy enough that they are mounted on a rolling stand that may be positioned next to the bed or rolled by the patient as they walk around the room or hospital. Walking while pushing one of these rolling stands is sometimes awkward for the patient, as the patient may be weak or have impaired balance as a result of injury or surgery.
Some IV pumps are modular, in that there is a main unit that contains the control system to which can be attached additional modules that may have one or more of a variety of functions. FIG. 1 illustrates an example modular IV pump 12 wherein the control unit 16 contains the processor, memory, and user interface with two pumping modules 20 attached, one module 20 on each side.


A diaper buddy including a container with a base plate. A first side wall is affixed to, and extends downwardly from, the base plate. The first side wall has a closed outline defining the plan of a first compartment for holding a plurality of baby wipes. A first lid is hingedly attached to the first side wall for closing the first compartment. A second side wall is affixed to, and extends upwardly from, the base plate. The second side wall has a closed outline defining the plan of a second compartment for holding a tube of ointment. A second lid is hingedly attached to the second side wall for closing the second compartment. A third side wall is affixed to, and extends upwardly from, the base plate. The third side wall is positioned adjacent to the second side wall, outside the second compartment. The third side wall has a closed outline defining the plan of a third compartment for holding a roll of plastic bags. A third lid is hingedly attached to the third side wall for closing the third compartment. An elastomeric band has opposed ends that are affixed to the base wall between the second compartment and the third compartment for securing a plurality of disposable diapers to the container.

Changing diapers has never been fun, but it is simple. First, a baby is positioned, face up, upon a changing table or other supporting surface. Then, the retaining tabs of the baby's soiled diaper are unfastened. Next, the baby's buttocks are elevated by raising the baby's feet and any fecal matter on the baby is wiped away with a clean portion of the soiled diaper. Afterward, the soiled diaper is closed and placed in a plastic bag for disposal. Now, the baby's genitals and buttocks are cleaned from front to back with premoistened wipes. Then, the baby's buttocks are lowered onto an open, clean diaper. At this time, the genitals and buttocks can be dried with a towel and a light application of powdered cornstarch. Also, if needed, diaper-rash cream can be applied to irritated skin. Now, the back of the clean diaper is positioned above the waist of the baby to prevent leaks and the front of the diaper is positioned opposite the back. Finally, the retaining tabs of the clean diaper are brought around from the back of the diaper and fastened to the front thereby securing the clean diaper upon the baby. The entire process requires just a few minutes to complete.
When away from home, most caregivers of babies tote the items needed to change diapers in a diaper bag. A diaper bag normally resembles a large purse with numerous interior and exterior pockets. Into these pockets can be positioned: two to four clean diapers, premoistened wipes, cream, powder, plastic bags for containing soiled diapers, washcloths, toys, extra clothing, bottled formula, and medications. So that the "basics" are not inadvertently left behind, some caregivers keep their diaper bags adjacent their front doors or in their cars.
Over time, diaper bags have been improved. For example, some manufacturers have added shoulder straps so that their bags can be carried like a backpack or can be placed over the handles of a stroller. Others offer diaper bags that are compact in size so that a caregiver need not rummage around in massive pockets to find items in a crisis situation. Still others provide bags made with washable fabrics. Nonetheless, many women find diaper bags to be a lot to carry around on anything but the longest outings and prefer to carry: one or two diapers, diaper rash cream, and some wipes in their purses.


A passive current limiting device and isolator is particularly adapted for use at high power levels for limiting excessive currents in a circuit in a fault condition such as an electrical short. The current limiting device comprises a magnetic core wound with two magnetically opposed, parallel connected coils of copper, a high temperature superconductor or other electrically conducting material, and a fault element connected in series with one of the coils. Under normal operating conditions, the magnetic flux density produced by the two coils cancel each other. Under a fault condition, the fault element is triggered to cause an imbalance in the magnetic flux density between the two coils which results in an increase in the impedance in the coils. While the fault element may be a separate current limiter, switch, fuse, bimetal strip or the like, it preferably is a superconductor current limiter conducting one-half of the current load compared to the same limiter wired to carry the total current of the circuit. The major voltage during a fault condition is in the coils wound on the common core in a preferred embodiment.

A wire wound into a coil with overlapping layers (turns) insulated from one another functions as an inductive element and is commonly used in a current limiting application. Winding the coil around a material having little resistance to the flow of magnetic flux, i.e., a material which is easily magnetized, increases the inductance. Electrically conductive coils are frequently wound around a ferromagnetic core to increase the inductance. The inductance can be even further increased by using a "closed loop core," which is a core forming a ring or square or similar unbroken path. Alternatively, if a low inductance is desired, two coils may be wound in magnetic opposition on the same closed loop core, with the magnetic field of each coil cancelling the other. This produces a low impedance effect. When there is an imbalance in the currents between the two coils, the impedance increases. The capability to alter the impedance of the inductor by controlling the balance of the magnetic flux density forms the basis for use of the coil as a fault current limiter.
One approach to fault current limiting using a pair of magnetically coupled coils is disclosed in "Recovery Time of Superconducting Non-Inductive Reactor Type Fault Current Limiter," by T. Hoshino et al., Transactions on Magnetics, Vol. 32, No. 4, July 1996, which discloses the use of two superconducting coils with different critical currents non-inductively wound on a magnetic core in magnetic opposition. Under normal operating conditions, both coils are in the superconducting state and there is little resistance across the two coils. Current is shared equally between the two coils and there is no inductive voltage drop either across the coils. Under fault conditions one or both critical currents are exceeded to cause an imbalance in the currents in the coils and an increase in impedance for limiting the fault current. Because one of the coils must first become non-superconducting to provide the necessary resistance, restoration of normal operating conditions with removal of the fault may be delayed until the resistance in the coils decays to a low value and excessive heating may occur. Another approach to a superconducting fault current limiter is disclosed in "Tests of 100 kW High-T.sub.c Superconducting Fault Current Limiter," by W. Paul et al., IEEE Transactions on Applied Superconductivity, Vol. 5, No. 2, June 1995, which discloses an inductive superconductor fault current limiter where a superconductor shield prevents the formation of a field in the ferromagnetic core. Because this device is triggered magnetically and carries the total current load in the circuit, high currents in the circuit under normal conditions restrict the number of turns in the windings and limit performance under fault conditions. The current limiting performance of inductive fault current limiters based on Bi-2212 high temperature superconducting tubes is discussed in "Short Circuit Test Performance of Inductive High T.sub.c Superconducting Fault Current Limiters," by D. W. A. Willen et al., IEEE Transactions on Applied Super-conductivity, Vol. 5, No. 2, June 1995.
The present invention addresses the aforementioned limitations of the prior art by providing a passive fault current limiting device which presents a low impedance over a specified range of currents, converting passively and automatically to a large impedance when the current exceeds a predetermined design limit, and then passively and automatically returning to a low impedance value when the excessive current level drops below the design limit. The inventive fault current limiting device is capable of handling the electromechanical forces and thermal effects of large power components and is in the form of a small, easily installed and maintained package which can be economically manufactured.


A method of using an airway treatment system for treating a dorsal displacement disorder in a horse includes detecting an elevated activity level of the horse using one or more treatment sensors, generating a treatment signal based on the detected elevated activity level, using a pacemaker processor, to strengthen one or more muscles involved in displacing a laryngeal anatomical structure relative to an airway of the horse, and using one or more stimulation electrodes, configured to interface with tissue of the horse, to deliver the treatment signal to the tissue of the horse to maintain an unobstructed airway.

FIG. 1 shows various anatomical structures associated with the head of a horse. Among these, the airway structures, and in particular the larynx and pharynx, are susceptible to various disorders which affect the horse's health and its ability to perform normally. The larynx is innervated by the recurrent laryngeal nerves (RLN) which contain motor fibers that innervate both the abductor/opener and adductor/closer muscles of the arytenoid cartilages and their associated vocal folds. The soft palate normally fits closely around the ventral border of the epiglottis.
Airway impairment produces two symptoms, abnormal sounds and/or poor performance. Abnormal sounds are detected by the human ear (riders, judges) and can be quantitate by time-frequency spectrogram. Horses produce inspiratory sounds characterized by three frequency bands centered at approximately 0.3, 1.6, and 3.8 k Hz; See Derksen F J et al., Spectrum Analysis Of Respiratory Sounds In Exercising Horses With Experimentally Induced Laryngeal Hemiplegia Or Dorsal Displacement Of The Soft Palate, Am J Vet Res. 2001 May; 62 (5):659-64, incorporated herein by reference. Respiratory sounds of horses have been recorded using a radiostethoscope such as that disclosed by Attenburrow et al., Resonant Frequency of the Lateral Ventrical and Saccule and Whistling, Equine Exercise Physiology, pp 27-32, and in U.S. Pat. No. 4,218,584 to Attenburrow, both of which describe a stethoscope for detecting and recording data from a horse while the horse is walking, trotting, cantering, jumping, and galloping. A transducer such as a microphone is attached to the animal's skin adjacent to the windpipe. The electrical output from the transducer is transferred to a radio transmitter mounted on the animal or its harness. The radio transmitter can transmit signals a distance from the horse to allow for monitoring the horse's breathing from a distance. U.S. Pat. No. 6,228,037 describes a method and apparatus for recording and analysis of respiratory sounds in exercising horse, and U.S. Pat. No. 6,659,960 describes a method and system for continuous monitoring and diagnosis of body sounds, which discloses a portable unit for recording the upper airway respiratory sounds of an exercising horse to determine whether the horse suffers from an upper airway obstruction condition.
Some horses exhibit a disorder of the upper airway known as dorsal displacement of the soft palate (DDSP). Pulmonary ventilation at rest is adequate, but during exercise the cross sectional area of the horse pharynx is reduced by collapse during exhalation. This results in significant airflow reduction which is generally associated with an abnormal upper respiratory noise at exercise. In horses used for competition, the decreased volume of airflow interferes with performance and may impair the horse's ability to compete. Although conventional methods of treatment have been useful in some horses, they are less than ideal since they have only modest success rates and significant complications.
The specific pathophysiology of DDSP is that during exercise horses normally interlock their soft palate and the epiglottis to form a direct open airway from the nasal cavity to the trachea. But in some horses, the soft palate displaces dorsally during exercise, the free end of the palate then lies in the airway and causes a major obstruction to expired air. The exact cause of DDSP is not known, however, it is believed to be caused by either direct mechanical displacement by posterior movements of the tongue, or weakness in the muscles of the soft palate or those that raise the epiglottis or the entire larynx.
Several muscles are related to movement of the larynx and pharynx, but the specific role of each is not well understood. US Patent Publication 2007123950 described a twelve muscle model of the pharyngeal and laryngeal airway and showed that neuromuscular stimulation of just one or two of the muscles sufficed to move the hyoid bone. Two airway muscles could be coordinated synergistically to protect the pharyngeal and laryngeal airway by a distance reduction of the hyoid complex and larynx relative to the chin. Specifically, stimulating the thyrohyoid muscle reduced the distance of the hyoid complex relative to the larynx. And geniohyoid muscle stimulation in combination with at least one other muscle also generated the synergy of simultaneous reduction of distance of the hyoid complex and the larynx relative to the chin. Multiple intramuscular electrodes were placed in two or more upper airway muscles and controlled by an implanted stimulation device.
Functional electrical stimulation ("FES") refers to the application of stimulation devices to nerves and muscles to treat medical disorders. Application of FES to paralyzed laryngeal muscles was introduced into human clinical otolaryngology in 1977 by Zealear D L, Dedo H H, Control Of Paralyzed Axial Muscles By Electrical Stimulation, Acta Otolaryngol (Stockholm) 1977, 83:514-27, incorporated herein by reference. The most successful FES system to date is the cardiac pacer which has become a routine part of cardiac disease therapy: Lynch, Cardiovascular Implants, in Implants, Lynch ed., Van Nostrand Rheinhold, New York 1982, incorporated herein by reference. However, there are a variety of other FES systems, of which the most heavily researched are FES systems to restore locomotion to paraplegics and arm motion to quadriplegics: Peckham, IEEE Trans. Biomed. Eng. 1991, 28: 530, incorporated herein by reference. Other motor control devices restore bladder control to paraplegics and diaphragm function to high quadriplegics: Erlandson, Scand. J. Urol. Nephrol. 44 Suppl: 31, 1978; Glenn, Ann. Surg. 183: 566, 1976, incorporated herein by reference. There also are FES devices designed to rehabilitate the sensory deficits, such as the cochlear implant: Hambrecht, Ann. Otol. Rhinol. Laryngol. 88: 729, 1979, incorporated herein by reference. To date such systems have not been developed for horses which present different clinical conditions from humans.
An FES device for the equine applications must be effective and also must conform to the rules of the governing bodies that oversee equine sports. In thoroughbred and standard breed racing, this requires that the device must not give the horse an unfair advantage. In addition, it cannot allow tampering with the horse's performance. Specifically, as wagering is an integral part of the sport, there cannot be a way of adjusting the device to manipulate the horse's performance.

Adaptive airway treatment of dorsal displacement disorders in horses


A metalized film capacitor includes a metal deposition electrode on a dielectric film. The metal deposition electrode includes slits provided and divided only at a side opposite to low resistance portions connected to a metalized contact, and fuses provided between the slits. In a laminated metalized film, slits provided at a central portion in a width direction of the metalized deposition electrode and extending in the longitudinal direction of the dielectric film do not overlap with each other.

Conventionally, an electrode of an electrode drawing portion in a wound plastic film capacitor having a self-security mechanism is formed to be thick. This increases strength of contact with a metalized contact which is an electrode introducing portion. Such a film capacitor is disclosed in Japanese Patent Unexamined Publication No. S62-183506.
There has been known a self-security mechanism in which microscopic blocks are formed in a deposited electrode using slits in which metal is not deposited, and fuses provided between the slits are connected between the microscopic blocks, with divided electrodes interconnected in parallel. There has been also recently known a self-security mechanism that employs a divided electrode pattern having slits provided in the form of a lattice. In addition, Japanese Patent Unexamined Publication No. 2004-134561 discloses a self-security mechanism pattern having the characteristic that fuses emit little heat and the amount of reduction of their capacitance is low when current flows.
FIGS. 6A to 7B are schematic views showing conventional metalized film capacitors. FIG. 6A is a perspective plan view of a conventional metalized film capacitor, FIG. 6B is a sectional view taken along line C-C′ of FIG. 6A, FIG. 7A is a perspective plan view of another conventional metalized film capacitor, and FIG. 7B is a sectional view taken along line D-D′ of FIG. 7A.
In the structure shown in FIGS. 6A and 6B, high resistance portions 12A and 12B and low resistance portions 13A and 13B, both of which are formed of metal deposition films, are respectively provided on dielectric films (hereinafter abbreviated as films) 11A and 11B such as polypropylene films. First slits 16B, second slits 16A and third slits 16C are provided in high resistance portions 12A and 12B. Portions between the slits function as fuses 14. Microscopic blocks 17 are surrounded by the slits.
A metalized contact (not shown) as an electrode drawing portion is welded to low resistance portions 13A and 13B at the sides of films 11A and 11B. Accordingly, low resistance portions 13A and 13B are formed to be thicker than high resistance portions 12A and 12B, and has low film resistance. Band-shaped portions 15A and 15B, on which metal is not deposited, are provided as insulation margins on films 11A and 11B such that short-circuit between the metal deposition films on films 11A and 11B does not occur when the metalized contact is welded. First slits 16B, second slits 16A and third slits 16C are provided at the center in the width direction of films 11A and 11B or at a side closer to band-shaped portions 15A and 15B than the center.
In the structure shown in FIGS. 7A and 7B, an electrode pattern in high resistance portions 12C and 12D is different from that shown in FIGS. 6A and 6B. That is, first slits 16B, second slits 16A and third slits 16C are provided in the entire width direction of high resistance portion 12C, and no slit is provided in high resistance portion 12D.
Fuses 14 function as a self-security mechanism in the metalized film capacitor shown in FIGS. 6A and 6B. However, when films 11A and 11B, in which the slits are provided in this manner, are laminated to form the capacitor, fuses 14 provided at the center in the width direction of laminated films 11A and 11B overlap with each other. That is, first slits 16B provided at upper film 11A and lower film 11B overlap with each other. Accordingly, fuses 14 provided in first slits 16B overlap with each other, too. A good deal of heat is locally generated in this overlap portion when large current flows.
On the other hand, in the metalized film capacitor shown in FIGS. 7A and 7B, fuses 14 are provided in the entire of high resistance portion 12C, and fuses 14 are also formed at a side closer to an electrode drawing portion than the center in the width direction of film 11A. The heat generation at fuses 14 on the side of the electrode drawing portion is large.
The conventional film capacitors having the structure as described above generate a lot of heat, which results in reduction of the lifetime of the capacitor and non-uniformity in operation of fuses 14 as the self-security mechanism.

Metalized film capacitor and inverter smoothing capacitor for automobile


An electrophotographic apparatus capable of forming a high quality image by a contact type developing system using a photoconductive belt and a developing roller. The belt has a tubular configuration. A single friction roller is made of rubber and received in the tubular belt to drive it in a rotary motion. The friction roller has an outside diameter smaller than the inside diameter of the belt to provide the belt with a slack. The developing roller contacts the slack of the belt and, therefore, contacts the belt over a sufficient nip width.

The present invention relates to an electrophotographic apparatus capable of forming a high quality image by contact type development in which a photoconductive belt and a developing roller are held in contact.
Among conventional developing systems using a single component developer, i.e., a toner, a system of the type maintaining a blade in contact with a developing roller to charge and regulate the thickness of the toner is predominant. In the case of non-contact development wherein the developing roller does not contact a photoconductive element, it is necessary to apply an AC bias to the developing roller. This kind of development is generally referred to as a jumping development system. When the developing roller is operated in contact with a hard photoconductive element, the developing roller and photoconductive element make line-to-line contact since both of them are hard. The problem with the line-to-line contact is that the nip width of the developing roller and photoconductive element and, therefore, the contact thereof is extremely unstable. This is apt to result in a partly omitted image or similar defective image. Moreover, the linear velocity of the developing roller is usually three times to four times as high as that of the photoconductive element. Consequently, an extremely great torque is required to drive the developing roller and photoconductive element both of which are hard.
In the light of the above, it is a common practice with the contact type development to use a photoconductive element implemented as a belt. The belt is passed over and driven by two to three spaced rollers. The developing roller is held in contact with the belt at a particular position between the rollers over a predetermined nip width. The developing roller is rotated at a linear speed about three times as high as that of the belt. However, the rollers for supporting and driving the belt increase the number of parts and, therefore, the cost of the apparatus. In addition, the resulting belt unit is bulky to prevent the entire apparatus from being miniaturized.


A method for loading tube bundles on a railcar includes placing the tube bundles lengthwise on the car and stacked above the bed of the car to form tube bundle packs. The packs are separated by panels. A spacing block is configured to go within the longitudinally extending remaining space left over after loading a finite number of packs. This spacing block include parallel plates which are rigidly displaced one from another by blocks. Padding is arranged on the outer side of the plates and the panels. Padding is arranged on the bulkheads as well. The panels and spacing block may be tied to the railcar through boards and dunnage.

The field of the present invention is systems for loading railcars and packs thereon.
The rail industry has developed a great deal of experience in the handling of materials on railcars. Particular requirements have been established for stacking materials on flat cars including dunnage, blocking and specific strapping requirements.
With bundled, elongate products such as tubing, wood beams are laid laterally across the car as dunnage to support the bundles. The tubes are in bundles and extend longitudinally of the railcar. Short stakes, blocking and strapping then retain the load in place. FIG. 2 illustrates one such recommended stacking.
In spite of these carefully defined methods and devices for retaining tube bundles, the natural vibration of the car can result in individual tubes slowly working longitudinally outwardly from the bundle. If left unattended, the individual tubes can extend into harms way or come into contact with adjacent tube bundles or bulkheads. This can make the bundles difficult to unload and cause damage to the tubing. Substantial damage to the ends of tubes has been experienced in the industry from this phenomenon. Naturally, bulkheads can be placed against the ends of the tubing or the tubing against barriers. However, such assemblies create their own problems in terms of loading, unloading and damage from motion of the tubes relative to other tubes, the bulkheads and barriers.

Method for loading tube bundles on railcars and tube packs for railcars


A fluidified inert material spreading device configured to bury a pipeline in a body of water is configured to travel in the body of water in a travelling direction along and over the pipeline, and has a hull, which extends along a longitudinal axis, houses at least one expansion chamber for fluidified inert material, is connected to at least one feed port to feed the fluidified inert material to the expansion chamber, and has a quantity or number of outlet ports configured to release the fluidified inert material from the expansion chamber, close to the pipeline, and which as a whole define a flow cross section greater than the flow cross section of the feed port.

Burying underwater pipelines in fluidified inert material is known from documents U.S. Pat. No. 4,352,590, PCT Patent Application No. WO 2005/005736, PCT Patent Application No. WO 2009/141409, U.S. Pat. No. 4,992,000, U.S. Pat. No. 4,334,801, U.S. Pat. No. 4,400,115 and U.S. Pat. No. 5,659,983. In WO 2009/141409, the pipeline is buried by fluidifying a tilled portion of the bed of the body of water underneath the pipeline. Though effective, this method has the drawback of dispersing particles of inert material in the water. Fluidifying the inert material causes the pipeline to sink into the bed of the body of water, but tilling the bed and forced fluidification in situ of the tilled inert material produce minute particles of inert material that take a long time to settle, and so pose various problems: poor coverage of the pipeline, resulting in a depression along the trench; and dispersion of inert material in the pipeline area, thus contaminating flora and fauna. If caught and transported by water currents, the inert material particles in the pipeline area may even be carried relatively long distances. In documents PCT Patent Application No. WO 2009/141409, U.S. Pat. Nos. 4,992,000, 4,334,801, 4,400,115 and 5,659,983, dispersion of the fluidified material is contained by releasing it inside a protective hood over the bed of the body of water.
These known solutions are only partly successful in preventing dispersion, on account of the hood being moved parallel to the pipeline, so convection sustaining the inert material particles still persists in the areas from which the hood is removed.
Regardless of dispersion of the fluidified inert material, known solutions also fail to ensure even coverage of the pipeline.

Fluidified inert material spreading device for burying an underwater pipeline, and method of spreading fluidified inert material over an underwater pipeline


A method for producing a silver halide photographic emulsion, a method for producing thereof, and a light-sensitive material using the same, the method comprising the steps of: (a) producing a host emulsion comprising silver bromide or silver iodobromide tabular grains having an average silver iodide content (I.sub.1 mol %) of the entire silver halide grains of 5 mol % or less, in which 60% or more of the projected area of the entire silver halide grains accounting for tabular grains having an aspect ratio of 3.0 or more; (b) dissolving a periphery of the tabular grains completely with an iodide ion being added to the host emulsion; and then (c) producing final tabular grains by reclaiming a periphery containing silver iodobromide from the region containing the periphery having been completely dissolved.

Various mechanical stresses are put on a photographic material coated with a silver halide emulsion, in general. For example, a negative film for general photographing is rolled up into a magazine, folded when loading in a camera, or pulled for frame sliding. Further, an emulsion face is pressed in a swollen state, in some cases, depending on processors when an exposed negative film is development processed.
As described above, when various stresses are put on a photographic material, stresses are put on silver halide grains through gelatin, which is a binder of silver halide grains, and a plastic film support. It is known that if stress is put on silver halide, photographic properties of a photographic material are fluctuated. Examples thereof are disclosed in detail, for example, in K. B. Mother, J. Opt. Soc. Am., 38 (1948), p. 1054, P. Faelens and P. de Smet, Sci. et Ind. Phot., 25, No. 5 (1954), p. 178, and P. Faelens, J. Phot. Sci., 2 (1954), p. 103.
With respect to tabular silver halide grains, production methods and techniques for using thereof have been disclosed in U.S. Pat. Nos. 4,433,048 and 4,434,226, etc. It has been known in this field of industry that the shape of tabular grains has various advantages which contribute to the improvement of sensitivity/graininess relationship, the improvement of sharpness due to the peculiar optical nature of tabular grains and the improvement of covering power, and tabular grains have supported the rapid progress of silver halide photographic materials in recent years.
Because of their peculiar "tabular shape", on the other hand, the performance degradation of photographic properties by stress (pressureability) of tabular grains is large, and therefore, various means have been contrived to cope with this drawback.
For example, U.S. Pat. No. 4,806,461, JP-A-63-220238 and JP-A-3-189642 (the term "JP-A" as used herein means an "unexamined published Japanese patent application") disclose techniques for improving sensitivity/graininess relationship, dependency on illumination intensity of exposure, pressureability and storage stability by introducing dislocation lines into tabular silver halide grains while controlling.
The technique of improving sensitivity/graininess ratio by forming tabular silver iodobromide grains having iodide nonuniformly dispersed in the grains is disclosed in U.S. Pat. No. 4,414,310. Further, JP-A-3-136032, JP-A-3-136033 and U.S. Pat. No. 5,061,616 disclose techniques of improving the desensitization due to pressure by forming a silver bromoiodide thin layer shell which comprise adding iodide to a tabular host emulsion and then prescribing the pAg and the temperature. However, the techniques disclosed therein only refer to the improvement of the desensitization due to pressure among the degradations of photographic properties caused by various stresses. Therefore, the effects of these techniques have been insufficient concerning very important and annoying performance degradations of photographic properties due to other stresses in photographic materials, that is, stress marks by folding and stress marks in a swollen state of a coated film.
While, in recent years, demands for tabular silver halide emulsions have become increasingly strict, in particular, the development of high sensitivity emulsions which are improved in performance degradation of photographic properties due to various stresses has been desired.

Silver halide photographic emulsion, method for producing thereof, and light-sensitive material using the same


A membrane (2) for a microphone (1) is disclosed which comprises a first portion (A1), a second portion (A2), and elements (E1 . . . E4, E1′ . . . E4′), which connect said first (A1) and said second portion (A2). The second portion (A2) is arranged for a movement in relation to said first portion (A1) around an idle position, which movement includes at least a translatory component in a direction of movement (dm) normal to said membrane (2). The elements (E1 . . . E4, E1′ . . . E4′) are provided for definition of a spring constant for said movement around said idle position and are arranged substantially along the outer border of said second portion (A2).

In principle, a condenser microphone comprises a thin membrane or diaphragm that is mounted in close proximity to a back plate. The thin membrane is fixed at its edges, so that it is able to deflect when sound pressure is acting on it. Together, the membrane and the back plate form an electric capacitor, where the capacitance changes according to said deflection of the membrane. In use, the capacitor will be charged using a DC voltage, usually called polarization or bias voltage. When the capacitance varies due to a varying sound pressure, an AC voltage that is proportional to the sound pressure will be superimposed on the DC voltage, which AC voltage is used as an output signal of the microphone.
The ever decreasing size of electronic devices has now lead to so-called MEMS (Micro Electro-Mechanical Systems) microphones, which mark a technical borderline what today is possible with respect to miniaturization of microphones. Those microphones have special requirements and need for special manufacturing processes. Micromachined microphones are usually developed for a lower voltage than standard microphones, normally for a voltage below 10V, which is why also the air gap is much smaller, usually less than 5 μm so as to obtain a sufficient field strength for an acceptable sensitivity of the microphone. However, the voltage cannot be increased to any value, because if the electric field strength exceeds a certain limit, the membrane snaps to the back plate which causes a short circuit. Of course this depends also on the stiffness of the membrane, which increases with thickness and Young's modulus of material used. On the other hand, smooth membranes at a high voltage are wanted for a high sensitivity or a low noise level respectively. Therefore designing a microphone means always finding the balance between a wanted sensitivity and the threatening collapse of the membrane. Hence the aforementioned concrete values for an air gap and a polarization voltage only serve as an example, just for illustration of the dimensions of a MEMS microphone.
FIG. 1a shows a cross section of a prior art MEMS microphone 1. First of all a silicon die 3 is coated with a conductive layer, which forms the membrane 2′. After this coating a cavity is etched into the die 3, thus freeing the membrane 2′. On top of this construction is placed a back plate 4 comprising holes 5, wherein an insulator 6 electrically separates the membrane 2′ from the back plate 3. Optionally, the membrane 2′ is made of an insulator. In this case a conductive layer on or under the membrane is used as an electrode. This conductive layer may also serve as an shielding against electromagnetic interference.
In use a polarization voltage is now applied to the membrane 2′ and the conducting back plate 3, thus mechanically preloading and therefore bending the membrane 2′. The bold-line membrane 2′ in FIG. 1b indicates the idle position IDL after biasing the system by means of a polarization voltage. Varying air pressure in front of or behind the membrane 2′ caused by sound waves leads to a further bending of the membrane 2′. Thin lines indicate the upper and lower dead center UDC and LDC of the membrane 2′ for a given sound pressure. It should be noted that there is no translatory movement involved. The three positions of the membrane 2′ are separated for better visualization. In reality the outer area of the membrane is fixed and does not move so that there is only a bending within the membrane 2′.
The holes 5 in the back plate 3 serve as a necessary ventilation. Otherwise the up-moving membrane 2′ would compress the air between membrane 2′ and back plate 3, which would hinder the movement of the membrane 2′.
This prior art construction has some drawbacks: First, a certain stress within the membrane 2′ is a result of the production process. Unfortunately, this stress is neither predictable nor adjustable so that the idle position of the membrane 2′ is unknown as well. As a consequence, there is a great spread of the sensitivity across a couple of different microphones. Therefore the membrane 2′ may have a couple of small holes in the outer area, thereby decreasing the stress within the membrane 2′. FIG. 2a shows a top view of such a membrane 2′, wherein in the upper left corner the back plate 4 with holes 5 and in the lower right corner the membrane 2′ with holes 7 is shown. FIG. 2b shows an corresponding cross sectional view B, B′ of the microphone 1 which is quite similar to the one shown in FIGS. 1a and 1b. Of course the size of the holes 7 may not exceed a certain diameter because otherwise the ventilation through these holes 7 is too high, thereby decreasing the sensitivity of the microphone 1. In some solutions therefore these holes 7 are sealed again with a different material, which does not influence the stress within the membrane 2′ but only closes the holes 7.
Second, due to the construction the membrane 2′ only bends when different air pressures acts on it. Hence the center area contributes much more to an AC signal than the outer areas, which are more or less wasted.

Membrane for a MEMS condenser microphone


Fabrication of a microstructure device includes assembling a mold component and a mold body to form a device mold for the microstructure device. The microstructure device is cast from the device mold, then the mold component is removed from the microstructure device. The microstructure device is then released from the mold body.

A micro total analysis system ("μTas", also called a lab-on-a-chip system) integrates microfluidics components with microelectromechanical systems (MEMS) into a single miniaturized device. The micro total analysis system can be used to perform chemical and biological analyses, such as capillary electrophoresis (CE), flow cytometry, liquid chromatography (LC), and mass spectroscopy (MS). The micro total analysis system can also be used to synthesize chemicals and drugs, and carry out clinical analyses. The micro total analysis system includes microfluidic devices that are used to manipulate and analyze fluid samples. Examples of microfluidic devices include microchannels, microvalves, micropumps, and micromixers. Because the components of the μ Tas are integrated together, only small amounts of fluid and sample are required for the analyses. This improves system performance and reduces sample, reagent, and analysis costs.

Microstructure fabrication and microsystem integration


Example apparatus disclosed herein generate blocks of a blockchain, the blockchain to store a neural network that has input nodes, hidden nodes and output nodes, with respective ones of the blocks of the blockchain including respective code and respective data to represent corresponding ones of the output nodes of the neural network, a first one of the blocks including first code and first data to implement operations to be performed by a first one of the output nodes, the hidden nodes and the input nodes on input data applied to the neural network to determine an output of the first one of the output nodes. Disclosed example apparatus also train the neural network to determine at least portions of the respective data to include in the respective ones of the blocks of the blockchain, and forward the blockchain to a server that is to distribute the neural network to client(s).

Artificial intelligence is becoming an important component of leading-edge computer security products. For example, neural networks and other machine learning algorithms allow such computer security products to detect zero-day threats that exploit unknown computer security vulnerabilities, which may be undetectable by at least some prior threat detection solutions. However, machine learning algorithms, such as neural networks, can be vulnerable to adversarial attacks intended to poison and/or evade the neural network, such as through gaining access to the neural network to tamper with the neural network's model parameters, apply doctored data to the neural network to reduce the neural network's detection accuracy, etc.
The figures are not to scale. In general, the same reference numbers will be used throughout the drawing(s) and accompanying written description to refer to the same or like parts, elements, etc. Connection references (e.g., attached, coupled, connected, and joined) are to be construed broadly and may include intermediate members between a collection of elements and relative movement between elements unless otherwise indicated. As such, connection references do not necessarily infer that two elements are directly connected and in fixed relation to each other.
Descriptors "first," "second," "third," etc. are used herein when identifying multiple elements or components which may be referred to separately. Unless otherwise specified or understood based on their context of use, such descriptors are not intended to impute any meaning of priority, physical order or arrangement in a list, or ordering in time but are merely used as labels for referring to multiple elements or components separately for ease of understanding the disclosed examples. In some examples, the descriptor "first" may be used to refer to an element in the detailed description, while the same element may be referred to in a claim with a different descriptor such as "second" or "third." In such instances, it should be understood that such descriptors are used merely for ease of referencing multiple elements or components.

Distribution of neural networks with blockchains


An integrated optical component structure designed to operate at a rare earth ion fluorescence wavelength .lambda..sub.1 comprises at least a thin layer of a mixed rare earth fluoride solid solution having the formula (1-x)(M.sub.1-y M'.sub.y F.sub.2)-x TRF.sub.z deposited on a substrate of a monocrystalline semiconductor material where M and M' denote an alkaline earth ion, TRF.sub.z denotes a rare earth fluoride, x is in the range ]0,1[ and y is in the range [0,1]. The component structure finds applications in telecommunications using optical waveguides.

1. Field of the Invention
The present invention concerns an integrated optical component structure designed to operate at a rare earth ion fluorescent wavelength .lambda..sub.1. It also concerns a method of implementing a structure of this kind and various applications.
The invention has a particularly advantageous application in the field of optical waveguide telecommunications.
2. Description of the Prior Art
Diluted in a solid, rare earth ions fluoresce to emit visible light and near infrared due to electron transitions internal to their 4 f layer protected by their 5 s and 5 p layers. The erbium ion Er.sup.3+ has a .sup.4 I.sub.13/2 >.sup.4 I.sub.15/2 radiative transition which is of particular interest because in this case the emitted wavelength .lambda..sub.2 (1.54 .mu.m) matches the minima of absorption and relative index variation dn/d.lambda. of silica optical waveguides.
A prior art integrated optical component structure as defined above comprises a silicon or III-V semiconductor material doped with erbium for example either by ionic implantation or by molecular beam epitaxy.
Investigation of this type of prior art structure has confirmed that the nature of the host material has little influence on the energy of radiation emitted by the rare earth ion.
On the other hand, it has been clearly established that the fluorescence yield as a function of the rare earth content increases at constant temperature in proportion to the forbidden energy band of the semiconductor material. To obtain at ambient temperature a yield comparable with that obtained at 77 K it would appear that a host matrix forbidden energy band of around 2.5 eV is required.
Furthermore, in the case of erbium at least, it has been shown that although initially the intensity of luminescence increases in proportion to the doping element concentration, a maximum is reached for concentrations as low as 10.sup.18 cm.sup.-3. The decrease in fluorescence for high luminescent center concentrations is explained by the phenomena of cross relaxation and self-extinction by concentration. It is favored by the creation of atom ordering defects at the time of doping.
Thus the technical problem to be solved by the present invention is to provide an integrated optical component structure designed to operate at a rare earth ion fluorescence wavelength .lambda..sub.1 which enables the aforementioned constraints and in particular that connected with the decrease in fluorescence at high concentrations to be eliminated.


A brake control device for a brake system of a rail vehicle, wherein the brake control device is designed to control at least one electromagnetic track brake device of the brake system on the basis of rail condition data. Also disclosed is a corresponding brake system, a rail vehicle, and a corresponding method.

Modern rail vehicles often have brake systems having a plurality of brake devices which act in different ways. A friction brake device, such as a pressure-operated brake device, for example a hydraulic or pneumatic brake, or an electric or electromagnetic brake is generally provided as the service brake to be used primarily. Besides this, eddy current brakes, retarders or else magnetic track brakes, amongst others, are additionally used. In contrast to the eddy current brake, the magnetic track brake device here is a friction brake device which, when it is operated, is brought into frictional contact with the rail. As a result of current being applied, the magnetic track brake device is magnetized and adheres strongly to the rail. The magnetic track brake device is subject to considerable wear in the process. Magnetic track brake devices are used for supporting the braking action of the normal service brake device, in particular when carrying out rapid braking or emergency braking.
Disclosed embodiments allow improved operation of a magnetic track brake device. In particular, wear of the magnetic track brake device is intended to be reduced in the process during braking.

Brake system having an electromagnetic track brake device

KNORR-BREMSE SYSTEME FUR SCHIENENFAHRZEUGE GMBH


An end cover to be attached to an end of a string is provided. The end cover includes a finger-hooking projecting portion having a first finger-hooking face, and a base portion having a second finger-hooking face, and the second finger-hooking face is provided at a position to suppress a rotation of the end cover as a support point of the first finger-hooking face when a pulling force acts on the string using the first finger-hooking face.

There is a string stopper comprising a cylindrical socket for housing an end portion of a string, and a plug to fit into the socket, and from a state wherein a leg portion of the plug is interposed between two string end portions, a leg portion side of the plug fits into the socket so that the string stopper is attached to the string end portions by clamping the string end portions between the leg portion of the plug and the socket (see Patent Document 1).
Such a string stopper becomes also a handle to be gripped when performing an operation to pull the string. However, the socket of the Patent Document 1 merely has a simple flat square cylindrical shape, and a particular shape facilitating the gripping is not applied.


A high voltage transformer is small-sized, lightweight and less costly to fabricate. The high voltage transformer is designed to maintain equal the potential difference between the components of two transforming component groups and also to keep the components of the respective transforming component groups equipotential at the same distance in the direction extending from a first end to a second end. This eliminates the need to dispose an insulating body between the components of the first and second transforming component groups. This also makes it possible to fabricate the high voltage transformer with a small size and in a cost-effective manner.

A conventional high voltage transformer includes a magnetic core, a high voltage transforming part provided with a low voltage bobbin and a high voltage bobbin surrounding the magnetic core, a rectifying part for rectifying a high voltage current induced in the high voltage bobbin and then smoothing the rectified high voltage current, and a high voltage switch part. One of the points to be duly considered in fabricating the high voltage transformer is how to electrically insulate the components of the high voltage transformer with a view to reduce the volume and fabrication costs thereof.
One typical method of electrically insulating the components of the high voltage transformer is to arrange all the components within a transformer housing and then to fill the transformer housing with an insulating material. Examples of the insulating material used for this purpose include gaseous insulating materials, such as an air, oxygen, nitrogen, and hydrogen and liquid insulating materials, such as petroleum-based insulating oil, silicon oil and chlorinated oil.
Another typical method of electrically insulating the components of the high voltage transformer is to insert insulating bodies made of, e.g., plastics or glass, into between the components of the high voltage transformer.
Even if the components of the high voltage transformer are electrically insulated by filling the insulating material or inserting the insulating bodies as noted above, it is impossible to completely eliminate the stray capacitance generated between the components of the high voltage transformer. For this reason, the components of the high voltage transformer need to be arranged in a spaced-apart relationship in order to perfectly eliminate the stray capacitance.
The spacing between the components of the high voltage transformer varies with the magnitude of the voltage applied to the respective components. This means that the respective components should be spaced apart by a distance corresponding to the magnitude of the voltage applied thereto. Such an increase in the distance between the components of the high voltage transformer leads to an increased size and weight of the high voltage transformer, thereby making the transformer costly to fabricate.


A telecommunications network (12) includes a digital cross-connect system (10) that receives frame relay information carried in individual DS-0 signals over DS-0 links (14) and/or multiple DS-0 signals over FT-1 links (16). The digital cross-connect system (10) includes a cross-connect matrix (44) that consolidates DS-0 signals into DS-1 signals. The digital cross-connect system (10) further includes a frame groomer (40) that extracts frames from each DS-0 signal for consolidation into a frame groomed consolidated circuit. The frame groomed consolidated circuit is transferred to an edge switch (24) in DS-1 signals through the frame groomer (40) and the cross-connect matrix (44).

Frame relay service providers, as well as asynchronous transfer mode service providers, require a sufficient number of ports in order to provide frame relay, and asynchronous transfer mode, services. However, these ports are extremely expensive to obtain compared to ports for a conventional cross-connect systems. Further, time division multiplexed links that provide access to frame relay services are extremely under-utilized due to the bursty nature of the information being transferred. The frame relay traffic is carried on fully allocated digital circuits such as DS-0, nxDS-0, T1, E1, T3, E3, et al. As a result, the variable bit rate characteristic of the frame relay traffic is not effectively exploited. Therefore, it is desirable to improve the efficiency of frame relay traffic transfer that would reduce the number of frame relay or asynchronous transfer mode ports required by the service provider.

System, device, and method for consolidating frame information into a minimum of output links


A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected to the conductive layer, whereby the interconnect structure is formed off to only one side of the semiconductor die.

Semiconductor devices are commonly found in modern electronic products. Semiconductor devices vary in the number and density of electrical components. Discrete semiconductor devices generally contain one type of electrical component, e.g., light emitting diode (LED), small signal transistor, resistor, capacitor, inductor, and power metal oxide semiconductor field effect transistor (MOSFET). Integrated semiconductor devices typically contain hundreds to millions of electrical components. Examples of integrated semiconductor devices include microcontrollers, microprocessors, charged-coupled devices (CCDs), solar cells, and digital micro-mirror devices (DMDs).
Semiconductor devices perform a wide range of functions such as signal processing, high-speed calculations, transmitting and receiving electromagnetic signals, controlling electronic devices, transforming sunlight to electricity, and creating visual projections for television displays. Semiconductor devices are found in the fields of entertainment, communications, power conversion, networks, computers, and consumer products. Semiconductor devices are also found in military applications, aviation, automotive, industrial controllers, and office equipment.
Semiconductor devices exploit the electrical properties of semiconductor materials. The atomic structure of semiconductor material allows its electrical conductivity to be manipulated by the application of an electric field or base current or through the process of doping. Doping introduces impurities into the semiconductor material to manipulate and control the conductivity of the semiconductor device.
A semiconductor device contains active and passive electrical structures. Active structures, including bipolar and field effect transistors, control the flow of electrical current. By varying levels of doping and application of an electric field or base current, the transistor either promotes or restricts the flow of electrical current. Passive structures, including resistors, capacitors, and inductors, create a relationship between voltage and current necessary to perform a variety of electrical functions. The passive and active structures are electrically connected to form circuits, which enable the semiconductor device to perform high-speed calculations and other useful functions.
Semiconductor devices are generally manufactured using two complex manufacturing processes, i.e., front-end manufacturing, and back-end manufacturing, each involving potentially hundreds of steps. Front-end manufacturing involves the formation of a plurality of die on the surface of a semiconductor wafer. Each semiconductor die is typically identical and contains circuits formed by electrically connecting active and passive components. Back-end manufacturing involves singulating individual semiconductor die from the finished wafer and packaging the die to provide structural support and environmental isolation. The term "semiconductor die" as used herein refers to both the singular and plural form of the words, and accordingly, can refer to both a single semiconductor device and multiple semiconductor devices.
One goal of semiconductor manufacturing is to produce smaller semiconductor devices. Smaller devices typically consume less power, have higher performance, and can be produced more efficiently. In addition, smaller semiconductor devices have a smaller footprint, which is desirable for smaller end products. A smaller semiconductor die size can be achieved by improvements in the front-end process resulting in semiconductor die with smaller, higher density active and passive components. Back-end processes may result in semiconductor device packages with a smaller footprint by improvements in electrical interconnection and packaging materials.
A semiconductor die has an active surface containing analog or digital circuits implemented as active devices, passive devices, conductive layers, and dielectric layers formed within the die and electrically interconnected according to the electrical design and function of the die. The active surface performs the electrical and mechanical design function of the semiconductor die. The active surface may also contain a sensor such as a photodiode, phototransistor, Hall effect device, piezoelectric device, nanoelectronic device, and microelectromechanical device. The active surface responses to stimulus such as light, sound, heat, electromagnetic radiation, electric fields, magnetic fields, motion, ionizing radiation, vibration, motion, acceleration, rotation, pressure, and temperature to enable the semiconductor die to perform design functions. For example, an optical sensor on the active surface reacts to light which passes through an opening or window in the semiconductor package to reach the sensor.

Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus


A novel method and apparatus for the imaging of a continuous web on an internal drum type imaging device is disclosed. The method and apparatus may further be included in a process to produce punched, imaged sheets. A web is punched with registration holes and imaged in an internal drum-type imager prior to cutting the web into individual imaged plates particularly for use as printing plates. The web with an imageable surface is serially punched, imaged and sheeted with the punched holes being utilized to assure registration and alignment in the imaging operation and in the subsequent use of the plates on a printing press. The imaging station has an arcuate concave imaging platen. The web is advanced under tension and then stopped while a roller on an arm forces the web down into contact with the platen. Vacuum is then used to hold the web on the imaging platen while the web is imaged.

In the typical process for the formation of lithographic printing plates, the sensitized web of lithographic plate stock is cut into individual plates and stacked prior to imaging. The individual plates are optionally separated by individual sheets of interleaving paper where needed to protect the integrity of the coating. To image the plates, each individual plate is picked up from the stack, the interleaving paper is removed when present, and the plate is transferred to the imaging device. One common type of imaging device which is used is the internal drum type imager in which individual plates are held in position on the internal surface of the drum and imaged, usually by a laser. Typically, individual sheets or plates are loaded into the imaging drum either manually or with an automated plate handling system of some type. After positioning the plate in the imaging drum, vacuum is employed to hold the plate securely in place against the interior surface of the drum. Once the image is formed, the vacuum is released and the plate is removed from the imaging device. U.S. Pat. No. 5,619,246 discloses an apparatus for loading and unloading of individual plates into such an imaging device. Where punched plates are desired, the individual plates are optionally punched prior to or subsequent to the imaging process as a discrete, separate operation. Such prior art processes require considerable material handling equipment, precise alignment techniques and consume a lot of time. An imaged plate must be completely removed from the drum before the next plate can be loaded for imaging.

Method and apparatus for punching and imaging a continuous web


The invention relates to a device and a method for measuring a blood constituent in blood for an extracorporeal blood treatment device, comprising a dialyzer or a filter, and a hose line system comprising hose lines that are pervious to electromagnetic radiation. The kinetics of a liquid flowing at a measuring site in one of the hose lines of the hose line system is varied by varying the flow properties of the liquid in the hose line at the measuring site, particularly by stopping a blood pump arranged in the hose line and/or by closing a shut-off member in the hose line. The invention analyzes the intensity of the light entering the hose line at the measuring site and the light exiting the hose line at the measuring site.

In cases of chronic kidney failure, various methods of extra-corporeal blood treatment or cleansing are used to remove substances that need to be excreted and to withdraw fluids. In hemodialysis, the patient's blood is cleaned outside the body in a dialyzer. The dialyzer has a blood chamber and a dialysis-fluid chamber which are separated by a semi-permeable membrane. During the treatment the patient's blood flows through the blood chamber. To allow the blood to be cleansed effectively of substances that need to be excreted, there is a continuous flow of fresh dialysis fluid through the dialysis-fluid chamber.
Whereas in hemodialysis (HD) the transport of low-molecular substances through the membrane of the dialyzer is determined in essence by the differences in concentration between the dialysis fluid and the blood (diffusion), in hemofiltration (HF) substances dissolved in the water of the plasma, and in particular substances of fairly high molecular weight, are effectively removed by a high flow of fluid through the membrane of the dialyzer (convection). A combination of the two methods is called hemodiafiltration (HDF).
In dialysis patients, what often occur in addition to kidney failure are accompanying conditions, one of which, in a third of all cases, is diabetes mellitus. To minimize any further damaging sequelae, it is necessary for the therapy for the diabetes to be optimally adjusted. Diagnosis of diabetes mellitus and the monitoring of the therapy are performed by measuring blood sugar (blood glucose).
Both invasive and non-invasive methods of measuring blood glucose are known. Known non-invasive methods of determining blood glucose are based on measurement of the transmission of light in the patient's blood. In the infrared region, the absorption bands of glucose are at 760 nm, 920 nm and 1000 nm. However, the absorptions are so small as to be scarcely detectable. Use is therefore made of what is referred to as artificial blood kinetics.
What is used in the known non-invasive methods to measure the concentration of glucose in the patient's blood is a measuring set-up that has a pressure cuff that is applied to the patient's finger, the pressure cuff having a light source, and optical sensors for measuring transmission. A pressure that is above the systolic pressure is applied briefly to the pressure cuff on the patient's finger and the flow of blood in the finger is thus stopped, by which means what are referred to as artificial blood kinetics are produced. The red blood corpuscles collect together in groups and there is thus an increase in the size of the scattering bodies. It is possible in this way for the concentration of glucose in the blood to be determined on the basis of a measurement of transmission.
The known methods of measurement make provision for the individual measured results to be analyzed in different ways. However, what all the methods of measurement have in common is that a measurement of transmission is made at the patient's finger while pressure is being applied to the patient's finger with a pressure cuff to produce artificial blood kinetics.
The methods described above of measuring the concentration of glucose in blood are described in detail in for example the article entitled "Ilya Fine, et al: Occlusion Spectroscopy as a New Paradigm for Non-Invasive Blood Measurement, Proceedings of SPIE, Vol. 4263, pp. 122-130, 2001". The known methods of measurement for measuring glucose concentration are also described in detail in WO 2006/006153 A1 , WO 2007/020647 A1 and WO 2004/105596 A1.
WO 2004/105596 A1 describes a method of measuring glucose concentration in which the blood flow in a finger is stopped by a first pressure cuff and the blood flow in the fingertip is modulated by a second pressure cuff which is arranged between the first cuff and the fingertip. Artificial blood kinetics are produced by this means in the fingertip and these effect the measurement of transmission and are used to allow the hemoglobin value to be calculated.
A method of determining the concentration of glucose in a dialysis fluid during a dialysis treatment is known from EP 1 083 948 B1. However, it is a precondition of this known method that a sample of dialysis fluid be taken during the dialysis treatment.
The known methods of measuring glucose have proved successful in practice. However, it is a disadvantage that a pressure cuff has to be fitted to the patient's finger or that a sample has to be taken.

Device and method for measuring a blood constituent in blood for an extracorporeal blood treating device


A template (10) configured for use with an annular preform (26) having a periphery (32) and an inner opening (34), the template (10) having an annular body with an outer periphery (16) and an inner opening (18) and a plurality of spacer openings (12) through its body each for receiving a spacer (25), one of the template inner opening (18) and the template outer periphery (16) having a width equal to the width of the preform inner opening (34) or the preform outer periphery (32). Also a method for densifying preforms that includes a step of positioning spacers using a template.

Carbon-carbon and/or ceramic matrix composite disks may be used as brake rotors and/or stators in automotive and aircraft brake systems. During the manufacture of these discs, non-woven fiber preforms may be placed in a furnace and subjected to multiple CVI/CVD process cycles. During these processes, multiconstituent hydrocarbons and/or other precursor process gases are deposited in the body of the preforms as pyrocarbon or other ceramic matrices. This processing is referred to as "densification" and results in an increase in the density of the preform with each process cycle. The process will be referred to as CVD. Before the first CVD process cycle, for example, the preforms may have a density of about 0.5 g/cc.
Normally, CVD processes are carried out on multiple composite preforms that have been arranged in stacks in a CVD furnace. The composite preform are generally annular or ring shaped and must be spaced from adjacent preforms to allow gases to flow around and into the preforms. One way of spacing the preforms is to manually place a number of separate spacers on a preform. Typically, about 8 to 12 spacers are used between layers in the stack. If a stack includes 10 preforms, for example, 72 to 84 separate spacers will have to be placed, which is a time-consuming process.
If too few spacers are used or if the spacers are not positioned properly, the spacers may leave indentations in the preforms that must be machined off. In some cases, the indentations are too deep to be removed completely, and preforms with such deep indentations must be discarded. Care must therefore be taken to position the spacers accurately so that the preforms above the spacers are properly supported and the weight of the higher preforms in the stack is evenly distributed across the surface of the lower preforms. It would be desirable to provide a method of densifying preforms that allowed for rapid and accurate placement of spacers.

Template for arranging spacers on a preform and method of densifying a preform including the use of spacers positioned by a template


The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wafer-independent patterns that encode digits of a first significance for SAW identification tags; and (2) using different ones of a library of coding reticles to form, on each of the piezoelectric wafers, wafer-dependent patterns that encode digits of a second significance for SAW identification tags.

A fascinating and increasingly important technology is that dealing with object identification systems. Such systems range from simple bar codes to very sophisticated systems still in the process of development and implementation. Among the most promising object identification systems are those using electronic tags attached to or associated with objects. Such tags respond to an electronically generated interrogation signal by providing a return signal containing a numeric or alpha-numeric identification code identifying the object to which it is attached or with which it is associated.
One such identification system is based on attaching or associating a radio frequency identification ("RFID") tag with an object. As the name implies, when interrogated by a radio frequency signal, the RFID tag reflects or retransmits the signal to provide a code that identifies the object. RFID tags are of two basic types; those that contain a microchip and those that do not. The difference in cost and performance between the two types is so radical that the two categories rarely compete with one another for a particular type of use.
Chip tags are by far the most extensively used. A chip tag consists of four elements or features: (1) a computer microchip; (2) circuits for converting radio signals to computer data signals and back to radio signals; (3) an antenna; and (4) a means for providing DC power to the chip circuitry. In low cost RFID chip tags, the first two features are often partially or totally integrated into a single microchip, which integration requires certain compromises in tag performance (read range, number of bits, etc.). This combination of features also leads to certain integrated circuit (IC) cost and/or design compromises to accommodate both digital and radio frequency circuitry on a single IC. The impact of these design compromises can be partially compensated for by use of low radio frequency (RF) operating frequencies that, in turn, lead to rather large and expensive antennas.
The most daunting problem with chip tags is the need for DC power for the chip circuitry. The combination of environmental issues coupled with severe constraints on cost, size and weight usually requires that the tag not have a battery or other on-board power source. The only generally useable solution is to obtain DC power by converting RF power received from the tag reader signal into DC power within the tag. Those skilled in the pertinent art term tags without a battery or other power source as "passive" tags, while those that contain a battery or other source are termed as "active" tags. The passive method of providing DC power to a chip tag requires a more efficient tag antenna (i.e., larger size and cost) and higher transmitted power levels from the reader. It also requires added components which will either add to the cost of the microchip or to the cost of the tag for the required extra electrical components in the tag, which will also result in an increased tag size. The most important limitation of passive powered chip tags, however, is the severe restriction on the read range of the tag because a signal that is sufficiently strong to power the tag only extends a short distance from the tag reader antenna.
"Chipless" RFID tags do not contain a microchip but, instead, rely on magnetic materials or transistorless thin film circuits to store data. A major advantage of chipless RFID tags is their relatively low cost. The disadvantages of chipless tags include that they are range limited (several centimeters at the most) and only contain limited amounts of information. The severity of these problems has prevented their market acceptance in spite of their low cost potential.
In the year 2000, the global market for conventional RFID systems and services was in the order of 500 million U.S. dollars. This market was largely for chip tags that typically cost from about one dollar to tens of dollars each. While chipless tags are not selling well, they have generated great interest from a number of potential users because of their low cost potential. A huge gap exists in the automatic identification market between the very low cost bar codes and the higher performing RFID chip tags. The overall market is clamoring for a technical solution to fill that gap.
The critical characteristics of any new automatic identification technology designed to fill this gap are: (1) a cost of between one cent and ten cents per tag when manufactured in high quantities; (2) reliable reading without the need for manual scanning by a human operator; (3) reliable reading without a line of sight between the tag and tag reader (i.e., reliable reading even if the tag is scratched, or covered with dirt, or on the wrong side of the package, etc.); (4) a reliable read range of at least one to two meters; and (5) a tag data capacity of roughly 100 bits. Such tags are of vital interest to postal authorities, airlines and airports, mass transit authorities, animal breeders, the livestock industry, delivery businesses, any business with significant supply chains, particularly those that maintain inventory or handle fast moving consumer goods, and so on. These are all applications where a high priced tag is not practicable, particularly where the tag is disposable or is going to be sold with the product.
To address and overcome the existing limitations in RFID tags of cost, data capacity and reliable range, a new type of RFID tag technology has been developed. This new technology is described in detail in U.S. patent application Ser. No. 10/024,624, entitled "Surface Acoustic Wave Identification Tag Having Enhanced Data Content and Methods of Operation and Manufacture Thereof," by Hartmann, commonly assigned with the invention and incorporated herein by reference. To take advantage of this promising new technology, it is imperative to economically manufacture the RFID tags described by Hartmann.
Accordingly, what is needed in the art is a method to economically manufacture identification tags having an enhanced data storage capacity.

Method of manufacturing piezoelectric wafers of saw identification tags


Arrangements for transmitting network credentials from a user device to a second device to enable the second device to connect to a network are disclosed. At the user device, a user inputs network credentials for the second device to enable the second device to connect to a network. The user device transmits modulated light to the second device. The light is modulated so that the transmitted light is encoded with the network credentials. The second device has a photo sensor for receiving the modulated light from the user device and a processor for processing the modulated light to obtain the network credentials from the received modulated light.

In order for a device to be able to connect to a network it is usually necessary for the device to provide network credentials to the network. In the case of some devices, a user can simply input the network credentials to the device manually and directly, using for example a keyboard which is connected to the device. However, there are many devices that need to connect to a network but which do not have a user interface such as a keyboard or the like.

Method, device and computer program for transmitting and obtaining network credentials

VESTEL ELEKTRONIK SANAYI VE TICARET A.S.


Apparatus and methods for popping popcorn comprise a heated kettle which is controlled and monitored according to the temperature of the kettle. The kettle is initially heated to a start cook temperature and a buzzer and light alert an operator to add uncooked popcorn and oil to the kettle which lowers the temperature of the kettle below a predetermined start temperature and initiates a cooking cycle. An oil pump system is enabled at the initiation of the cooking cycle for adding oil to the kettle. As the popcorn and oil cook, the kettle temperature increases and passes through a predetermined dump temperature and the kettle automatically tilts and dumps the cooked popcorn. After the dump, the kettle temperature increases to the start cook temperature again and the buzzer and light are activated to alert the operator to add another batch of ingredients for consecutive batches of popcorn.

Popcorn is mass-produced for sale at movies and other events in commercial popcorn poppers which include an enclosed, transparent cabinet containing a tiltable kettle suspended above a catch area or platform. The kettle is heated and uncooked popcorn kernels are placed therein to be cooked and popped. Once the kernels are popped, the kettle is manually tilted and the popcorn spills onto the platform to be scooped up, packaged and sold to customers.
Conventionally, commercial popcorn poppers have been manually operated and have required an operator's constant attention for cooking the kernels and subsequently dumping the popped popcorn. For example, an operator would load the kettle with popping oil and unpopped corn kernels and then listen and watch for the unpopped corn to pop. When the operator decided, somewhat arbitrarily, that the corn was sufficiently popped, they would then dump the kettle and spill the popcorn onto the serving platform. Additional oil and corn would then be added for the next batch. While such conventional popcorn poppers are generally effective in mass-producing popcorn; the constant attention they require prevents the operator from other important tasks, such as selling the popcorn and other concession products, taking money and generally servicing customers.
As may be appreciated, the multiple duties entrusted concessionaire operators are not conducive to having them constantly monitor a popcorn popper. If attention is diverted for an extended length of time, the popcorn is susceptible to being burned or overcooked. In addition to the waste of burned popcorn, the aroma of the burned popcorn is not attractive to customers and may actually discourage purchases. Furthermore, if the operator inadvertently dumps the burned corn onto the platform, it will contaminate the usable popcorn which has already been produced and may render the entire batch inedible and thus unusable. Still further, the results and mess from burned popcorn is not easy to clean. The kettle is hot and must be allowed to cool before the burned popcorn is removed and the kettle placed back in service.
Additionally, the arbitrary nature of the dumping process with conventional poppers makes them subject to messes associated with premature dumping. For example, if the operator mistakenly believes that the corn has been completely popped and the oil used when indeed uncooked corn and oil remains in the kettle, tilting the kettle will spill oil onto the serving platform and possibly onto the counter. Such spills ruin and waste popcorn and create a mess which must be cleaned, adding to the already numerous tasks of a concessionaire.
Still further, too much oil may be added for a particular cooking cycle, and even if the cooking cycle is completed, excess oil might be left, again resulting in a mess upon dumping of the batch. For example, one operator may load the uncooked corn and oil for a batch, and another operator may subsequently and inadvertently load more oil, believing it had not been added. The excess oil does not burn off or cook and remains in the kettle. Not only is a mess created upon dumping, but the excess oil may also foul the batch of popcorn.
Another drawback of conventional popcorn poppers is the inherent delays which will occur between cooked batches of popcorn. When the popcorn has been cooked and dumped, the operator may begin serving it to customers without replenishing the supply of corn and oil and starting the next batch. Therefore, the next batch of popcorn will not be produced until the operator consciously sets aside time from his other activities to do so. Such delays interrupt production rates and introduce inefficiencies into the operation which reduce popcorn sales.
It is also desirable to pop popcorn consistently so that it produces consistent taste from batch to batch. The vagaries of prior systems leave much to chance in this regard so that batches of corn are undercooked, burned or the like and at the least are inconsistent in taste.
Still another drawback to conventional popping mechanisms is that they sometimes provide inconsistent or improper heating of the popcorn so that proper expansion of the kernels upon popping is not achieved. Particularly, when the heat is too high, the steam from the kernel is prematurely forced out and the popped kernel is small. If the temperature is too low, the kernels do not experience proper hull expansion and brittleness at popping and the popped kernels are small. As may be appreciated, small popcorn kernels reduce the yield of popped popcorn per unit of uncooked kernels, thus reducing the efficiently of the popping apparatus and raising the cost of the operation.
As a result, it is one objective of the present invention to provide improved apparatus and/or methods to pop popcorn continuously in consecutive batches with minimal attention by an operator.
It is another objective to ensure that the popcorn is consistently and properly cooked in each batch.
It is a further objective of the present invention to reduce the burning of popcorn sometimes associated with conventional machines and operator inattention.
It is also an objective of the invention to always provide the proper amount of cooking oil and thus reduce the messes associated with such burned popcorn or spilled, uncooked oil and thereby allow an operator to focus upon customers and popcorn sales.
It is a still further objective of the invention to reduce the delays between fresh batches of popcorn attributable to lack of attention by the operator.
It is a still further objective of the invention to increase the production rate of consecutive batches of fresh popcorn to thereby increase the sales from and the profitability of a commercial popcorn popper.
Still further, it is an objective to provide the proper and consistent temperature to the kernels as they cook to ensure proper popping conditions and to maximize the popcorn yield per unit of kernels.

Automatic popcorn popper with thermal controller