A method is disclosed for image reconstruction of an object with the aid of at least one-dimensional projections of the object into a three-dimensional volume image data record, it being possible to generate the projections by at least one detector/source system with reference to different positions and angles relative to the object, and at least two projections forming a reconstruction volume in an overlap region as basis for a backprojection of the projections into the three-dimensional volume image data record, in particular computed tomography. An apparatus for carrying out the method is further disclosed. In at least one embodiment, supplemented reconstruction volumes are generated by supplementing reconstruction volumes, covered only partially by projections, by way of virtual projections that are derived from volume image data records. By comparison with reconstruction volumes that are merely interpolated, supplementing a reconstruction volume with the aid of virtual projections can decisively improve the image quality of the computed tomography images that are backprojected therefrom.

Medical image recording methods require a multiplicity of processing steps for the images of an object to be examined that are generated mostly by a detector/source system. In this case, the detector/source system records projections of the radiation attenuated by the object with reference to different angles. These projections can be used to derive in the overlap region of the projections a so-called reconstruction volume that is a precondition for the backprojection into a three-dimensional volume image data record of the object.
The basis of the medical image recording methods is provided here by image projection and image transformation methods that combine the recorded projections on the basis of the orientation of the detector/source system during a projection recording with the orientation-dependent attenuation of the respective radiation by the object to be examined to form a reconstruction volume, and subsequently backproject it as images. The spatially dependent attenuation values thus determined then serve as basis for the backprojection into the volume image data record. In order to record the projections of the object to be examined, such as, for example, the body of a patient, radiation sources and correspondingly arranged radiation detectors are frequently arranged for transirradiating the object. The object to be transirradiated, or subregions of the object, characteristically attenuate the radiation emitted by the radiation source, characteristic projections of the attenuation profile respectively being determined in the radiation detector as a function of the relative position and distance of the radiation source and the radiation detector in relation to the object.
A line integral can respectively be formed relative to the object for each beam profile on the basis of the known angular dependence of the detected projections by means of the so-called Radon transformation. In the overlap region of the projections, the line integrals form the reconstruction volume that serves as database for a subsequent backprojection into the three-dimensional volume image data record.
The backprojection of the reconstruction volume in relation to a volume image data record is frequently performed by way of a so-called inverse Radon transformation. The Fourier slice theorem or a filtered backprojection is frequently used for this purpose. The filtered backprojection is mostly used in medical image recording systems because of the high numerical stability. The medical images can subsequently be extracted from this volume image data record thus generated, doing so with reference to freely selectable image planes.
For the purpose of completely covering a three-dimensional image data record, it is necessary, moreover, to determine inside the overlap region the data points that are not covered by the overlapping of at least two projections in an overlap region.
Currently, the missing data points inside the overlap region are interpolated by way of additional projection data from additional detectors on the basis of the projection data of the largest detector. Only in the case of complete coverage of the overlap region of all the beam profiles is a filtered backprojection of the projections of the attenuation profiles possible. Moreover, it is necessary to take account in the case of the backprojection of the type of projection, for example a parallel projection or a fan projection.
In order to generate an interpolated reconstruction volume, recording the projections therefore frequently requires a particularly high rotational speed for the detector/source system rotating by 360° or 180° on a circular path, in order to obtain a complete image of the object to be examined within a short time period. In particular, pictures of moving organs of a patient such as, for example, pictures of the lung or of the heart, must be recorded within a very short time interval, since otherwise the movement of the organ would distort the medical images. The conventional approach is to use a number of detector/source systems fitted in an offset fashion in the direction of rotation in order to generate the projections during a revolution, and subsequently to combine the projections by way of image projection and image transformation methods, and to backproject them into a three-dimensional volume image data record.
During the generation of the projections, in commonly used image recording systems two detector/source systems move about the object to be examined, the relative position of the two systems in relation to one another remaining the same during the recordings. For reasons of cost and space, it is often customary to give the second and the further detectors smaller design dimensions than the main detector of the first detector/source system such that the overlap region of all the beam profiles of the two detector/source system does not detect the entire object to be examined, or the overlap region thus produced is smaller than in the case of detectors of a multidetector/source system that have the same dimensions.
An additional complicated factor here is that a mathematical stipulation of the filtered backprojection of the reconstruction volume enables a complete overlapping of all the beam profiles only when all the data points of the reconstruction volume are determined. In particular, in the case of multidetector/source systems with different detector sizes, the problem arises of an overlap region that is reduced and covered by projections only incompletely in part by comparison with multidetector/source systems of the same detector size.
The problem is currently solved by determining the projections with the aid of a two-fold detector/source system, the first detector/source system having a large detector, and the second detector/source system having a smaller detector. While taking account of the projections of the first detector/source system, the data points inside the reconstruction volume of the additional detector/source systems are interpolated by considering adjacent line integrals inside the overlap regions covered only partially by projections. The reconstruction volume thus mathematically completed is subsequently completely backprojected into a volume image data record by way of a backprojection. No comparison currently exists with measured data for the inadequately covered data points of the only partially covered overlap regions.
Subsequently, it is optionally possibly after completion of the abovedescribed image processing method to carry out filtering and image reprocessing of the image points in the reconstruction volume and/or of the medical images thus generated.
Thus, DE 198 42 944 A1 describes a method for the reconstruction of a three-dimensional image of an object scanned in the course of a tomosynthesis, as well as an apparatus for the tomosynthesis. By selecting two- and three-dimensional filter functions for the reconstruction volume by taking account of suitable weighting elements and optimized filters, the invention mentioned there provides the possibility of improving the image quality and—for the slicewise display of the volume image data record—of reducing high frequency image components.
In the case of all the reconstruction methods known in the prior art, it is disadvantageous for projections that, in order to completely cover the reconstruction volume, mathematical interpolations of data points are undertaken on the basis of adjacent line integrals in the reconstruction volume that can lead during the backprojection to an impairment of the image quality of the volume image data record, as in computed tomography (CT), for example.

Method for image reconstruction of an object with the aid of projections, and apparatus for carrying out the method


A system comprising instrumentalities and methods for removing intramedullary stem component pieces of a tibial implant from a distal tibia.

Generally, there are several designs of total ankle replacement prostheses. One type of total ankle replacement prostheses comprises a tibial implant with an elongated intramedullary stem. This type of prosthesis is exemplified by a total ankle replacement prostheses sold by Wright Medical Technology, Inc. (5677 Airline Road, Arlington, Tenn. 38002, USA) under the trademark INBONE Total Ankle System. In this system, the total ankle replacement prostheses is comprised of a tibial implant having an elongated intramedullary stem formed by a plurality of modular stem component pieces, a talar implant, and a polyethylene spacer.
Generally, this system has five sizes of implant sets that are employed as a function of the size of the ankle bones of a particular patient. Additionally, the tibial implant is constructed from different stem component pieces. The inferior part is a tibial tray. This has a set size and morphology specified by the size of the implant set chosen. Superior to this is a base, which also has a set size and morphology specified by the size of the implant set chosen. Superior to this are a variable number and size of stem component pieces that are chosen by the surgeon during the procedure to give the best fit in the tibial intramedullary canal. Furthermore, the talar implant has a set size and morphology specified by the size of the implant set chosen. There is a stem that fits into the inferior portion of the talar implant and extends inferiorly either 10 mm or 14 mm at a defined angle. The choice of which stem length to use is made by the surgeon during the procedure. Moreover, each implant set has a defined number of polyethylene spacers of varying height that fit into the tibial tray on the tibial implant. The height of the spacer to be used is chosen by the surgeon during the procedure, after the tibial and talar implant have been fit into the bones.
During the surgical procedure, the elongated intramedullary stem is constructed by coupling together the plurality of modular stem component pieces through an anterior ankle opening in a space formed between the lower end of the tibia and the upper end of the talus. This construction is performed after bone cuts have been made in those two bones, and the cut sections of bone have been removed to form the space. A second opening in the skin is made on the bottom of the heel, and a channel is drilled up through this skin incision, and then further up through the calcaneus and talus bones. That channel allows passage of instruments that aid in coupling the modular stem component pieces together to form the elongated intramedullary stem of the tibial prosthesis at a desired location in the tibia. The combination of these modular component pieces to form the tibial implant requires an intramedullary approach to the distal tibia.
There is a need to overcome the significant shortcomings in the removal of total ankle replacement prostheses such as the total ankle replacement prostheses delineated above during revision surgical procedures. In particular, there is a need to overcome the significant shortcomings in the removal of the elongated intramedullary stem of the tibial implant from the distal tibia during revision surgical procedures.
Of particular concern in the existing techniques for the removal of the tibial implant is the requirement for large bone windows to be cut into the lower end of the tibia to remove the elongated intramedullary stem component pieces of the tibial implant that have become fixed into the bone during the initial surgical procedures. The result of this bone destruction yields a tibia that makes further reconstructive procedures particularly problematic.
Accordingly, there is a particular need to overcome the significant shortcomings in the removal of the elongated intramedullary stem component pieces of the tibial implant from the distal tibia during revision surgical procedures.

Systems and instrumentalities for use in removal of tibial prostheses of total ankle replacements


Methods and apparatus for detecting a device, such as a cell phone, by transmitting signals in various formats and detecting a response from the device. In general, different devices respond to different signal formats. Upon detecting the device, an alert can be generated.

As is known in the art, cellular devices, such as mobile phones, can be used to activate other devices. For example, a landmine or other explosive device can be triggered by a mobile phone that is activated by a remote device, such as another mobile phone. The devastation resulting from such devices is well known.

Methods and apparatus for device detection in response to signal broadcast


An arrangement of differential pairs in a multi-layer printed circuit board is provided for eliminating crosstalk. The arrangement of differential pairs in the multi-layer printed circuit board includes a first differential pair, and a second differential pair. The first differential pair and the second differential pair may each be a driven pair or a victim pair. By properly arranging the first differential pair and the second differential pair, in accordance with the present invention, the resultant crosstalk on the first differential pair induced by the second differential pair, or vice versa, is substantially zero or negligible.

1. Field of the Invention
The present invention relates generally to printed circuit boards, and more particularly, to arrangements of different pairs in printed circuit boards.
2. Prior Art
Crosstalk is an omnipresent phenomenon in a high frequency circuits. The existence of crosstalk in high frequency circuits induces unexpected erroneous signals from a driven signal trace to a victim signal trace, the crosstalk screws up the original signals intended to be sent on the victim signal trace. For this reason, efforts have been devoted to develop means for eliminating such unwanted crosstalk phenomena.
One reason for employing differential pairs in high frequency circuits is that crosstalk in differential pairs may largely be reduced. The electronics industry has evolved to demand a higher and higher integration of signal traces in one single printed circuit board, however, since crosstalk is sensitive to the spacing between signal traces, i.e. the larger the spacing, the smaller the crosstalk, crosstalk between two differential pairs is no longer negligible. Referring to FIG. 1, wherein an arrangement of two differential pairs in a printed circuit board 100 is illustrated. As shown, the printed circuit board 100 comprises a dielectric layer 110, a first differential pair 120 comprising a first signal trace 121 and a second signal trace 122, and a second differential pair 130 comprising a third signal trace 131 and a fourth signal trace 132. In this particular example of prior art, the spacing between the first signal trace 121 and the second signal trace 122 is equal to the spacing between the third signal trace 131 and the fourth signal trace 132. Both the first differential pair 120 and the second differential pair 130 are disposed on the dielectric layer 110. Conventionally, the dielectric layer 110 is disposed on a ground plane (not shown). Since the presence of a ground plane does not affect crosstalk between the first differential pair 120 and the second differential pair 130, the illustration of which is thus neglected.
As shown in FIG. 1, suppose that the first differential pair 120 is a driven pair and the second differential pair 130 is a victim pair, the crosstalk on the second differential pair 130 due to the first differential pair 120 is equal to the sum of the crosstalk induced on the third signal trace 131 and on the fourth signal trace 132. The crosstalk induced on the third signal trace 131 and on the fourth signal trace 132 are equal to the sum of crosstalk due to the first signal trace 121 and the second signal trace 122. One may denote the crosstalk on the third signal trace 131 due to the first signal trace 121 by X31, the crosstalk on the third signal trace 131 due to the second trace 122 by X32, the crosstalk on the fourth signal trace 132 due to the first signal trace 131 by X41, and the crosstalk on the fourth signal trace 132 due to the second signal trace 132 by X42. Since crosstalk is primarily induced at the rise time or the fall time of a signal, if a positive crosstalk is induced at the rise time, a negative crosstalk is then induced at the fall time. Therefore, the total crosstalk induced on the second differential pair 130 due to the first differential pair 120 is equal to (X31−X32)−(X41−X42). Since the spacing between the third signal trace 131 and the first signal trace 121 is equal to the spacing between the fourth signal trace 132 and the second signal trace 122, X31 equals X42. Consequently, the total crosstalk induced on the second differential pair 130 due to the first differential pair 120 is equal to (2*X31−X32−X41). In order to make this resultant total crosstalk negligible, one way is to increase the spacing between the first differential pair 120 and the second differential pair 130, leaving X31 approaching X32 and X41 approaching X31 (or X42). By doing so, large real estate of a printed circuit board is required, which greatly limits the integration of signal traces on a printed circuit board. Alternatively, the other way is to set the second differential pair at another layer of the printed circuit board and electrically isolated from the first differential pair.

Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk

Hon Fu Jin Precision Ind. (Shenzhen) Co., Ltd.


Coatings for components of electrochemical cells (e.g., layers for protecting electrodes) are generally described. Associated compounds, articles, systems, and methods are also generally described.

Coatings for components of electrochemical cells may be useful for a variety of purposes, such as for protective layers. Rechargeable and primary electrochemical cells oftentimes include one or more protective layers to protect the electroactive surface. Depending upon the specific protective layer(s), the protective layer(s) isolates the underlying electroactive surface from interactions with the electrolyte and/or other components within the electrochemical cell. Although techniques for forming protective layer(s) exist, methods that would allow formation of protective layer(s) that would improve the performance of an electrochemical cell and/or provide for simplified and/or more reliable and/or more economically efficient manufacturing processes would be beneficial.


A method and system for graphic representation of the availability of desired meeting attendees, meeting sites and elements of equipment for use in a data processing system having a display and a calendar database listing scheduled calendar events. A graphically distinctive object is associated with each desired meeting attendee, meeting site and/or element of equipment for use in a data processing system having a display and a calendar database listing scheduled calendar events. A graphically distinctive object is associated with each desired meeting attendee, meeting site and element of equipment. Thereafter scheduled calendar events for all desired meeting attendees, meeting sites and elements of equipment are examined within a selected time span and tiers of graphically distinctive objects are displayed, perpendicular to a time axis, at selected time points along that axis in response to the existence of each scheduled calendar event for a desired meeting attendee, meeting site and/or element of equipment. In alternate embodiments of the present invention, a graphically distinctive object is displayed at a selected time point along the time axis in response to either the presence or the absence of a scheduled calendar event at that time point. Additionally, a graphic depiction of an element of equipment may be utilized within a graphically distinctive object associated with that element of equipment, enabling a user to intuitively determine the availability of selected elements of equipment or desired meeting attendees.

1. Technical Field
The present invention relates to data processing system based meeting scheduling systems, and in particular to a method and system for permitting a user to select alternate meeting parameters when all desired meeting parameters cannot be met. Still more particularly, the present invention relates to an intuitive and graphical method for displaying the availability of desired meeting attendees, meeting sites and elements of equipment in a data processing system.
2. Description of the Related Art
The scheduling of meetings has always been fraught with problems. This is particularly true in cases when the person scheduling the meeting has no management or other control over those whose attendance is either desired or necessary.
The prior art initially eased the scheduling burden in that keyboard/display terminal users' schedules were stored in varying calendar forms, and all could be available for call-up at each terminal. These schedules could be called and scanned to determine common available times. This was extremely time consuming as schedules were only available in narrative form on a day-at-a-time basis. Even when monthly abbreviated schedules or calendars were available for call-up, mental or pencil and paper notation of available times was both error-prone and no minor chore.
The prior art has now gone further in solving the above-noted problems. Calendar application programs, stored in a host computer to which the terminal users are connected, are able to read calendars of prospective attendees and provide a listing of available meeting times and dates. The available times and dates are derived from date and time ranges provided by a meeting scheduler. From this listing, a meeting scheduler may select a suitable time and date. After making a selection, either writing down or making a mental note of the suitable time and date, the meeting scheduler may key and transmit a message to each attendee. These systems still require excessive keying in terms of rekeying attendees' names, and a meeting time and date.
More recently, a technique has been developed which presents available meeting times and dates to a meeting scheduler as an option screen. The option screen is then keyed in order to select a time and date for the meeting. When utilizing this technique, a notification screen is presented to the scheduler after selection from the option screen. The scheduler then keys into the notification screen, filling in the purpose and location of the meeting and, if appropriate, shortening the duration of the meeting. Upon completing the notification screen, the screen is then transmitted to notify all attendees of the meeting. While this system represents an advance in time savings, error reduction, and reduced keying requirements, it does not address the problem which occurs when a meeting time cannot be determined which complies with all of the required parameters as determined by the meeting scheduler.
One attempt at solving this problem is described in U.S. Pat. No. 5,050,077, in which desired meeting times, dates and attendees are automatically altered or "relaxed" in order to achieve an acceptable meeting time. An option list of meeting times is then presented to the scheduler for selection of a meeting time. Based upon the selection of the scheduler of one of the optional lists of meeting times, a meeting notification screen is constructed for transmittal to each attendee. While this approach represents a substantial increase in efficiency over the prior art, the increased complexity in meeting scheduling systems makes the selection of a less than optimal meeting time difficult for a meeting scheduler.
Therefore, it should be apparent that a need exists for a method and system which presents an intuitive and graphic representation of meeting parameters within a data processing system such that a meeting scheduler may simply and easily select a less than optimal set of meeting parameters for a desired meeting.

Method and system for graphic representation of meeting parameters in a data processing system

International Business Machines Corporation


A push and release operator control for selectively opening or closing the discharge blocking flap of a lawnmower. The first portion of travel of the actuator raises the discharge blocking flap toward its balance point. As the blocking flap reaches the balance point the actuator is released which allows the blocking flaps momentum to carry it through the balance point where gravity takes over to finish the travel. The actuator is reset by the blocking flaps motion after passing the balance point. Once the actuator is reset by the blocking flaps travel the same push and release of the actuator will return the blocking flap to it original starting position.

The present invention relates to a method for controlling the flow of clippings from the discharge opening of a rotary mowing deck on powered lawn mowing equipment.
Previous attempts to control the discharge of clippings are based on selectively placing a movable flap in the discharge path of the clippings; the position of the flap is controlled by the mower operator and requires one motion to block the discharge and a separate motion to allow the discharge. The prior approach of Bellis Jr. as set forth in U.S. Pat. No. 6,874,309 shows a hand operated blocking flap located adjacent to the operator station. The flap can be operated without affecting the speed of the mower however the operator is required to free one hand to operate the flap this can be a problem on lever operated mowers. The problem of having a free hand to operate a flap is over come by Exmark Mfg Co, U.S. Pat. No. 7,594,379 B2, they use a foot pedal to operate the flap. The Exmark design utilizes an over center locking pedal to hold the flap in the closed position with separate release pedal to return the flap to the open position. The Exmark design allows the pedal to be partially depressed to feather the flow of clippings. There are disadvantages to the over center design. For example; the over center mechanism is complicated with many moving parts these can become clogged with debris from mowing causing the pedal to loose functionality; having an independent release forces the operator to recall which pedal to push to move the flap to the desired position. It would be desirable to have a single pedal that would open or close the blocking flap. In addition if the same pushing motion of the pedal could open or close the flap it would make it very simple to operate the flap.

Mechanism for controlling position of discharge blocking flap for rotary mowing deck


A chemical process for producing bulk quantities of an iron-silica gel composite in which particle size, form, and magnetic state of the iron can be selected. The process involves polymerizing an ethanolic solution of tetraethylorthosilicate, ferric nitrate and water at low temperature under the influence of an HF catalyst. The chemical and magnetic states of the iron in the resultant composite are modified in situ by exposure to suitable oxidizing or reducing agents at temperatures under 400.degree. C. Iron-containing particles of less than 200 .ANG. diameter, homogeneously dispersed in silica matrices may be prepared in paramagnetic, superparamagnetic, ferrimagnetic and ferromagnetic states.

Composite "granular metals" have been prepared by co-evaporating an immiscible metal and a non-metal under properly controlled conditions onto a suitable substrate to form an intimate mixture of the two constituent phases where the particle size of the metallic phase is of the order of nanometers. These composite materials exhibit properties which are not only related to the properties of the constituent phases but are also strongly composition and particle-size dependent. However, the nature of the co-evaporation procedure makes it most suitable for the production of thin films of the composite material.

Process for the controlled preparation of a composite of ultrafine magnetic particles homogeneously dispersed in a dielectric matrix

The United States of America as repesented by the Secretary of Commerce


In a scroll-type fluid machine (4), a refrigerant in a discharge chamber (80) is adjusted at prescribed discharge pressure by using a discharge valve (84), discharged from a scroll unit (52), and supplied to a refrigeration circuit (2), and the machine has a circulation path (7) for introducing the refrigerant in the discharge chamber from the refrigeration circuit toward a drive casing (22) while maintaining the refrigerant pressure, and an inlet path (93) formed in a compression casing (24) and leads the refrigerant in the circulation path to the rear side of a movable scroll (54) to make the led refrigerant counteract the refrigerant discharge pressure acting on the front side of the movable scroll.

A scroll-type fluid machine of this kind, for example, a scroll-type compressor, is provided with a scroll unit for carrying out a series of processes including the suction, compression, and discharge of a refrigerant. Specifically, the unit comprises fixed and movable scrolls that are engaged with each other. The movable scroll makes a rotating movement around the fixed scroll. Therefore, the capacity of a space formed by each of the scrolls is reduced, and the above-mentioned processes are carried out.
In the compression process, a high-pressure space is produced in the scroll unit due to the discharge pressure of the refrigerant. This pressure acts as thrust load from the front side of the movable scroll toward the rear side thereof. This load moves the movable scroll in the direction of moving away from the fixed scroll. The rear side of the movable scroll is supported on a surface oriented to the fixed scroll in order to perform the above-mentioned processes without fail. In other words, a supporting reaction force counteracting the thrust load acts on the rear side of the movable scroll so as to move the movable scroll in the direction of approaching the fixed scroll. As a result, the front side of the movable scroll abrades away due to friction against the fixed scroll, which degrades the performance of the scroll unit.
Therefore, there has been disclosed a technology of reducing the thrust load by escaping the refrigerant acting on the front side of the movable scroll to the rear side through the inside of the movable scroll (se Unexamined Japanese Patent Publication Nos. 2000-136782, 2000-249086, and 2000-352386).
Since the above-mentioned processes are carried out in the scroll unit, the refrigerant pressure acting on the front side of the movable scroll constantly fluctuates until reaching the discharge pressure.
To be concrete, as disclosed in the conventional technology, when the refrigerant in the process of being compressed is escaped to the rear side of the movable scroll through its inside, the pressure acting on the rear side also fluctuates. Moreover, the refrigerant acting on the front side of the movable scroll is not always immediately delivered to the rear side of the movable scroll. This arouses concern that the thrust load cannot be effectively offset. That is, the above-described technologies have not yet solved the issue of reducing the thrust load.
In recent years, a refrigeration circuit using a refrigerant having a small global warming potential (GWP) value has been developed in consideration to global environment. An example of this kind of refrigerant is natural CO2 (carbon dioxide) gas. As this refrigerant has high working pressure, it is especially requested in this case to reduce the thrust load.
In order to use a CO2 refrigerant having high working pressure, it is preferable that the scroll unit have both simplicity and rigidity. It should be noted that, for example, the structure in which a communication hole is formed in the movable scroll, in which there is provided a check valve for preventing a counter flow from the rear side of the movable scroll to the front side thereof, in which an elastic member is provided to the rear side of the movable scroll, or the like, potentially becomes a hindrance to the above-mentioned processes performed by the scroll unit. Especially in case that the communication hole is formed in the movable scroll, it should be noted that compression efficiency is lowered when the refrigerant acting on the front side of the movable scroll moves to the rear side.

Scroll type fluid machine having a circulation path and inlet path for guiding refrigerant from a discharge chamber to a drive casing and to a rear-side of movable scroll


Poly(alkylene ether) amines having the formula: ##STR1## wherein A is an amine moiety having at least one basic nitrogen atom; R.sub.1 is a hydrocarbyl group having a sufficient number of carbon atoms to render the poly(vinyl ether) amine soluble in hydrocarbons boiling in the gasoline or diesel fuel range; R.sub.2 is an alkylene group having 2 to about 8 carbon atoms; R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7 and R.sub.8 are each independently hydrogen or a lower alkyl group having 1 to about 4 carbon atoms; R.sub.9 is an alkyl group having 1 to about 10 carbon atoms; m is 0 or 1; n is an integer from 5 to 99; and W is a hydroxy(oxypropylene) group having the formula: ##STR2## or mixtures thereof. The poly(vinyl ether) amines of formula I are useful as fuel additives for the prevention and control of engine deposits.

1. Field of the Invention
This invention relates to novel end-functionalized poly(vinyl ethers). More particularly, this invention relates to novel poly(vinyl ether) amines having a hydroxy(oxypropylene) connecting group and their use in fuel compositions to prevent and control engine deposits.
2. Description of the Related Art
It is well known that automobile engines tend to form deposits on the surface of engine components, such as carburetor ports, throttle bodies, fuel injectors, intake ports and intake valves, due to the oxidation and polymerization of hydrocarbon fuel. These deposits, even when present in relatively minor amounts, often cause noticeable driveability problems, such as stalling and poor acceleration. Moreover, engine deposits can significantly increase an automobile's fuel consumption and production of exhaust pollutants. Therefore, the development of effective fuel detergents or "deposit control" additives to prevent or control such deposits is of considerable importance and numerous such materials are known in the art.
Deposit control additives, however, differ in their effectiveness for preventing or controlling deposits on various engine components. This is believed to be due primarily to the fact that each engine component has a different operating temperature and some deposit control additives are not sufficiently stable on the surface of certain engine components to perform their intended function. In this regard, deposits on intake valves are particularly difficult to control, since intake valve operating temperatures can exceed 300.degree. C. At such high temperatures, many fuel additives are too volatile to be effective, while others thermally decompose.
Therefore, it would be particularly desirable to provide effective deposit control additives which have improved thermal stability at normal engine intake valve operating temperatures and which further have a sufficient molecular weight so as to be nonvolatile at such temperatures. The present invention discloses a new class of poly(vinyl ether) amine fuel additives having such properties.
Polyether fuel additives are well known in the art. These prior art additives, however, have a poly(oxyalkylene) "backbone", i.e. the polyether portion of the molecule consists of repeating oxyalkylene units, i.e. [--CHR--CHR--O--.sub.x. In contrast, the fuel additives of the present invention have a vinyl ether polymer backbone consisting of repeating vinyl ether units, i.e. [--CHR--CR(OR)--].sub.x. U.S. Pat. No. 4,261,704, issued Apr. 14, 1981 to W. K. Langdon, for example, discloses a poly(oxyalkylene) polyamine prepared by first reacting a poly(oxyalkylene) polyol or a poly(oxyalkylene) glycol monoether with a halogen-containing compound, such as an epihalohydrin. The resulting halogenated ether is then aminated by reaction with a mono- or polyamine. The resulting mono- or polyamine derivatives are taught to be useful as intermediates for preparing cationic surfactants, cationic polymers and as fuel detergent additives.
Similar poly(oxyalkylene) polyamines, prepared using an epihalohydrin, are described in U.S. Pat. No. 4,281,199, issued Jul. 28, 1981 to W. K. Langdon. The compounds described in each of the aforementioned patents have a poly(oxyalkylene) backbone.
Other fuel additive compositions having a connecting group derived from an epihalohydrin are known. For example, U.S. Pat. No. 4,975,096, issued Dec. 4, 1990 to T. F. Buckley, discloses long chain aliphatic hydrocarbyl amines having a long chain aliphatic hydrocarbyl component and an amine component connected by an oxy-alkylene hydroxy connecting group. These compounds are taught to be useful as deposit control additives in fuel compositions and as dispersants in lubricating oil compositions. Similar multipurpose additives for hydrocarbon fuels and lubricating oils, prepared from substituted phenols, epichlorohydrin and amines, are described in U.S. Pat. No. 4,134,846, issued Jan. 16, 1979 to W. H. Machleder et al. The deposit control additives described in these patents do not have a polyether backbone.
End-functionalized poly(vinyl ethers) are also known in the art. For example, A. Verma et al. in Polymer Preprints, 1991, 32, 322, describe the synthesis and characterization of functionalized poly(butyl vinyl ether) oligomers having an aldehyde or a primary hydroxyl endgroup. These poly(vinyl ethers) are prepared by the living polymerization of butyl vinyl ether using a hydrogen iodide/zinc iodide initiating system. The polymerization reaction is terminated with aqueous potassium carbonate to form the aldehyde endgroup, which can subsequently be reduced to form the primary hydroxyl endgroup. Poly(vinyl ethers) having amine end-groups are also known. C. G. Cho et al., Polymer Preprints, 1987, 28, 356, describe the synthesis of amine-terminated poly(alkyl vinyl ethers) by quenching the living polymerization of alkyl vinyl ethers with p-methyl styrene and an amine. The resulting poly(alkyl vinyl ether) is covalently linked to the amine through a p-methyl styrenic unit. M. Miyamoto et al., Macromolecules, 1985, 18, 123, describe the synthesis of poly(vinyl ethers) having a terminal amine group by quenching the living polymerization reaction of vinyl ether monomers with aliphatic amines. The resulting poly(vinyl ether) amines have an .alpha.-amino ether endgroup. Similarly, M. Sawamoto et al., Polymer Bulletin, 1987, 18, 117, describes quenching vinyl ether polymerization reactions with anilines to form aniline-terminated poly(vinyl ethers).
Amine-terminated poly(isobutyl vinyl ethers) having a primary amine at the beginning of the vinyl ether polymer are described by T. Hashimoto et al. in J. Poly. Sci. Polym. Chem. Ed., 1990, 28, 1137. These poly(vinyl ethers) are prepared by initiating the living polymerization of isobutyl vinyl ether with 2-(vinyloxy)ethyl phthalimide. The phthalimide group is then removed with hydrazine to produce a poly(isobutyl vinyl ether) having a 2-aminoethyl ether moiety on the first vinyl ether unit of the polymer.
It has now been discovered that the thermal stability of polyether fuel additives can be substantially improved by replacing the poly(oxyalkylene) component of such additives with a poly(vinyl ether) component. The resulting poly(vinyl ether) amines are surprisingly effective for controlling fuel system deposits, particularly intake valve deposits.

Poly(alkylene ether) amines having a hydroxy(oxypropylene) connecting group


Embodiments of the present invention provide a wear-leveling method, a storage device, and an information system, where a storage region is divided into a plurality of storage sub-regions of the same size. The method includes: recording the accumulated number of write operations of each storage sub-region; and when the accumulated number of write operations of any one storage sub-region of the plurality of storage sub-regions reaches a predetermined remapping rate, mapping a logical address of the storage sub-region to a remapping physical address. With the wear-leveling method, the storage device, and the information system in the embodiments of the present invention, a logical address of a local data block on which too many write operations are performed may be evenly mapped to an overall physical storage region, thereby avoiding that local data is too hot and prolonging a service life of a storage medium.

In recent years, a new storage technology—a phase-change memory (Phase-Change Memory, PCM) gradually shows a potential of replacing a dynamic random access memory, so that the phase-change memory is highly concerned in the industry. Compared with the dynamic random access memory, the phase-change memory mainly has two major advantages. One is that the phase-change memory is highly integrated and has strong expandability, and the other is that the phase-change memory is energy-saving.
However, a storage unit of the phase-change memory can bear only a certain number of write operations, which is generally around 105 to 108. When the number of write operations exceeds this number, a stuck-at fault (Stuck-at Fault) occurs to the storage unit, so that a new write request cannot change an original written state, and the storage unit is permanently stuck at an originally data written state. A major reason is that after the number of write operations exceeds a certain number, due to frequent expansion and contraction, a heating resistor falls off, so that the storage unit can no longer change a phase state, that is, new data can no longer be written into the storage unit, but a read operation may still be performed on originally-written data.

Wear-leveling method, storage device, and information system


A test pad is formed outside an array of pads included in connection structures such as pin mounting pads to which connection pins may be brazed in, for example, bottom side metallurgy of a multi-layer modular electronic package. In-line voltage plane testing may then be accomplished through temporary connections to the test pads for any desired layer, such as top side metallurgy distribution layers, while protecting the pin-mounting pads from physical and/or chemical damage or contamination during manufacturing processes for addition of layers to the electrical interconnection structure of the multi-layer module.

1. Field of the Invention
The present invention generally relates to the manufacture and testing of electronic circuit modules which include a plurality of integrated semiconductor chips and, more particularly, to the testing of modular circuit structures during the course of manufacture and within an automated manufacturing line.
2. Description of the Prior Art
It has long been recognized that high density of integration of electronic circuits on semiconductor chips yields substantial economy of manufacture so long as manufacturing yield can be maintained since many more electronic elements can be formed and connected during the necessary process steps. At the same time, performance improvements are realized since connections of reduced length have reduced capacitance and accordingly reduced signal propagation time and susceptibility to electrical noise. The same economies and performance improvements accrue to arrangements for connecting multiple chips for the same reasons.
In order to realize such advantages in arrangements for connecting plural integrated circuit chips, so-called multi-layer modular (MLM) packages have been developed in recent years. Such packages are, at the present time, generally rectangular and between 40 mm and 125 mm on a side and can accommodate from as few as two to several hundred chips. These packages are comprised of a plurality of lamina, each having a pattern of connections formed thereon and providing apertures known as vias which are filled or lined with metal or conductive paste or other conductive material such as plated metal to provide connections from one layer of conductive pattern to another. These lamina carrying conductive patterns and vias are aligned with each other in a stack and bonded together (e.g. by sintering if the lamina are ceramic, thermoplastic bonding if of polyimide and the like in accordance with the material of the lamina) to form a mechanically robust network of finely spaced connections embedded in a solid body of material, referred to thereafter as a substrate.
For numerous manufacturing reasons, vias and conductors on or in the substrate are generally provided at a pitch which is significantly larger than the pitch of connection pads on chips through the major portion of the body of an MLM device. Similarly, the connection pads to which pins may be later attached for connecting the module to a circuit board, another substrate or the like may be at a different pitch (either larger or smaller) or pattern than vias and conductors carrying power and signals within the substrate. Accordingly, it is customary to provide a plurality of additional layers or lamina, generally of a polyimide thin film construction, on the top and bottom surfaces of the multi-layer module substrate (e.g. a multi-layer ceramic portion in multi-layer ceramic (MLC) packages) principally to provide alteration of connection pad spacing or pattern, sometimes in plural stages. Such layers are generally referred to as "distribution" or "redistribution" layers.
The complexity of MLMs makes provision for testing and repair (referred to as engineering changes (ECs)) during manufacture very desirable since the patterns on the lamina and via filling is generally accomplished by relatively expensive individual screening processes. While connections and connection pads are very dense, small and closely spaced, it is usually possible to provide redundant connection structures which are accessible by mechanical automated repair apparatus as part of the design. Thus, repair of marginal or defective connections can avoid loss of the economic cost of manufacturing processes prior to testing when a marginal or defective connection is found. Conversely, detection of a module substrate which cannot be repaired allows the cost of further processing of a substrate which must eventually be discarded to be avoided.
In recent years, however, the performance of integrated circuit chips has advanced to the point where connections through the distribution layers to the major (substrate) portion of the MLM package (where complex interconnections are generally formed) may be of excessive length for numerous critical signal paths. Therefore, it has become the practice to include connections for at least some of such critical signal paths within the distribution layers rather than the substrate in order to shorten the required connections. Connection patterns in the distribution layers have thus become markedly more complex and more densely populated with conductors. Testing of these more complex layers, particularly at points during manufacture when repair is most likely to be possible, has become correspondingly more intricate and stringent. Increased numbers of thin film distribution layers increases the required number of tests, as well.
It is desirable, during such testing, to test the entirety of the modular device assembled up to the point of the test. That is, all wiring or connection layers which have been assembled up to the point of the test should be tested together. Such tests should be run at intervals of no more than a few lamina (and preferably at each thin film lamina level) so that engineering changes can be made most simply or, if not possible to correct the condition of the structure, so that few, if any, further process steps will be carried out on a structure beyond the processing which produced the irreparable defect.
From the accommodation of multiple chips and the nominal dimensions of the modular package structure alluded to above, it can be understood that a much larger area must meet functional requirements than is involved on a single chip. To test the functionality of the device over such an area, connections must be made to the so-called voltage plane or bottom surface metallurgy (BSM) pads which will eventually receive the pins to attach the module to the device in which it will be placed in service. One of these tests is a so-called voltage plane test which is principally directed to determining if certain extensive connections running throughout the substrate and distribution layers are shorted to each other or to other connections.
Generally, it is desirable that the testing of modular package structures be performed without removing the module from the manufacturing line (and thus is referred to as "in-line" testing) to preserve alignment within automated manufacturing devices and to avoid incidental damage and contamination due to additional handling of partially completed packages. In-line testing also preserves potential throughput of the manufacturing line even when numerous tests must be done at a number of points in the manufacturing process since only the time of the test, itself, is required and interference with the manufacturing line to remove and re-insert structures is avoided. Voltage plane tests are among a series of standard tests which are preferably performed as in-line tests.
It should be appreciated, in this regard, that while connections may also be made to the top surface connections (referred to as top side metallurgy) of the module being manufactured for a single particular test or test series, additional lamina may later be placed thereon and any damage to the conductive pattern due to the connection to top surface metallurgy (TSM) patterns occasioned by the test may generally be repaired. In contrast, temporary connections must be repeatedly made to the BSM pads for a plurality of tests and, for that reason, at the current state of the art, the BSM pads remain exposed through the further lamination and chip attachment TSM processes. Either the repeated formation of temporary connections for testing or the exposure during manufacturing processes or a combination thereof often results in mechanical and/or chemical damage to and/or contamination of the BSM pads reducing yield or requiring rework during subsequent pin attachment (e.g. brazing) processes. Damage to the connection pads may also compromise tests which may be performed as the package structure nears completion and unnecessarily further reduce manufacturing yield after most of the cost of completion of the package has been incurred.
While BSM connection pads could theoretically be covered during TSM lamina processing steps, any such covering must be removed, opened or pierced prior to or as part of further testing. Placement and removal of such a covering or portions thereof can also be a source of damage to the BSM connection pads. Further, covering of the pads during processing for addition of distribution layers does not address the issue of damage to BSM pads due to repeated formation of temporary connections for testing. In this regard, the metallurgy of BSM pads can not generally be altered to make them more chemically and/or mechanically durable during manufacture and testing incident thereto without compromising the pin attachment process. Provision of redundant pads within the array of BSM pads is inconvenient in regard to development of convenient and desirable connection pin configurations and occupies module connection pad space while necessarily preventing minimization of connection length and would require additional redundant wiring within the MLM which would occupy valuable wiring area, locations and volume.
Formation of redundant connections for engineering changes alluded to above generally includes the formation of so-called EC or dog-bone pads on the surface of the package structure (at appropriate points during the manufacturing process) which are at intermediate locations along many conductors in the design, including redundant conductors and which are accessible when repairs may be needed and performed. Such EC pads are essentially a pair of pads placed close together and connected by a narrow strip of conductor. The pads are of a size which is accessible by automated connection forming machinery while the narrow conductor is dimensioned to be readily destroyed by laser ablation processes, mechanical cutting or the like, including fusing by application of high current.
Thus, potentially any portion of potentially any conductor and/or redundant conductor in the design can be isolated from the remainder of the conductor and new connections made such as to substitute a portion of any convenient redundant conductor. Nevertheless, it should be recognized that such formations as EC pads are intended only for the formation of permanent connections (as opposed to repeated, temporary connections of test pads) and then only as needed for repair of other connections in the module.
It is also known to provide test connections for individual chips on a wafer so that electrical properties of the individual chips can be determined prior to dicing of the wafer into such individual chips. However, to avoid increasing required chip space, such test connections are generally made in the kerf areas of the wafer which will be consumed by the dicing process. Therefore, test connections do not ordinarily exist at the individual chip or package level. Further, processing of and connections to wafers involve only a single side of the wafer; specific areas of which can generally be masked and opened as may be necessary. Accordingly, chemical and mechanical damage and contamination of connections during processing does not generally present a problem since a covering layer may be readily applied and removed without damage to metallization. In any event, testing prior to completion or dicing of a chip is generally limited to screening for process-related defects at the wafer level. Additionally, at the individual chip level, temporary test connections are not generally made to the chip itself but rather are made to lead frames, solder preforms or bumps or the like which are permanently connected to contact pads on the chip.
Additionally, it is often desirable to perform other types of tests such as metallurgical or adhesion tests on connection pads. However, pads which are needed for mounting of pins and connections to the circuit package would necessarily be damaged by metallurgical and mechanical tests since such tests, by their nature, generally involve the application of potentially destructive forces or the removal of material. Tests on other structures such as metallization specifically provided for such testing may not provide reliable information since their function as connectors is not testable because they are not generally connected to the circuitry of the package and processing differences, such as heat exposure during pin brazing, may affect the properties being tested.
It is also becoming more desirable to provide for diagnostic testing of an installed electronic circuit package as package complexity increases since increased complexity is generally reflected in the number of connection pins on the package. An increased number of connection pins increases the potential for damage to one or more pins or the package itself during removal of the package from a device in which it is installed, connection to and/or disconnection from a tester and reinsertion into the device. Increased integration density allows some diagnostic circuitry to be placed in the package, if desired, but pin locations to extract signals from the package are often not available and cannot be efficiently provided in any event since the anticipated low frequency of such testing does not justify the package space required or the manufacturing costs of adding dedicated pins on the package.
In summary, no alternative has been available in the art to avoid exposure of BSM pads during MLM package manufacture consistent with avoidance or limitation of damage to BSM pads and compromise of pin attachment processes while permitting repeated in-line testing at points in the manufacturing process and/or line at which repairs may be most readily carried out. Additionally, the current trend toward increased complexity of connections and number of lamina used in TSM thin film distribution layers and testing incident to its manufacture and rework increases the potential for damage and/or contamination of BSM pads in modern MLM and MLC packages as well as their cost of manufacture which is put at risk by such damage or contamination. Further, no alternative has existed for avoiding provision of separate structures for electrical, mechanical and chemical/metallurgical testing or for testing the package after it is placed in service.

In-line voltage plane tests for multi-chip modules


A keyphrase extraction system and method are provided. The system and method can be employed to create an automatic summary of a subset of document(s). The system can automatically extract a list of keyword(s) that can operate on multiple documents, and across many different domains. The system is unsupervised and requires no prior learning.

Search or information retrieval systems are common tools enabling users to find desired information relating to a topic. Search engines or other search systems are often employed to enable users to direct user-crafted queries in order to find desired information. Unfortunately, this often leads to frustration when many unrelated files are retrieved since users may be unsure of how to author or craft a particular query, or because queries may be ambiguous. This often causes users to continually modify queries in order to refine retrieved search results to a reasonable number of files.
As an example of this dilemma, it is not uncommon to type in a word or phrase in a search system input query field and retrieve several thousand files—or millions of web sites in the case of the Internet, as potential candidates. In order to make sense of the large volume of retrieved candidates, the user will often experiment with other word combinations to further narrow the list since many of the retrieved results may share common elements, terms or phrases yet have little or no contextual similarity in subject matter. This approach is inaccurate and time consuming for both the user and the system performing the search. Inaccuracy is illustrated in the retrieval of thousands if not millions of unrelated files/sites the user is not interested in. Time and system processing are also sacrificed when searching massive databases for possible yet unrelated files.
It is important to ensure that the documents displayed to a user be ordered according to relevance, with the most relevant displayed first. In some applications involving search over large collections of documents, such as search within a company's corporate domain, human editors review the most common search terms and select documents that should be displayed in future in response to those query terms (e.g., using keyphrases). For example, the human editors might select solutions to common problems experienced by users. As can be appreciated, manual processing over hundreds or thousand of terms can be time consuming and inefficient.
A user's understanding of a collection of documents can be greatly enhanced by a summary of the contents of subsets of the collection. The collection of documents can include, for example, word processing documents, emails and/or web pages. The summary can identify the contents of subsets the collection with one or more keyphrases.
Conventional methods for generating lists of keywords from documents have operated on a single document at a time. Further, conventional methods have been trained on specific domains and hence do not translate well to different domains.

Multi-document keyphrase extraction using partial mutual information

Abstract: A term identifier identifies candidate terms (e.g., words and/or phrases) in the document subset which are used to form a document-term matrix. A probability computation component calculates probability values of: (1) the joint probability of a word (e.g., term) and a document, (2) the marginal probability of the word (e.g., term), and (3) the marginal probability of the document. Based on the probability values, a partial mutual information metric can be calculated for each candidate term. Based on the partial mutual information metric, one or more of the terms can be identified as summary keyphrases.


The electronic device for sensing and/or actuating comprises a device surface to which an biological cell (40) is applied, further comprising a sensor and/or an actuator (25), and an access channel (20) with a channel port (21), said channel port being located in said surface. The access channel (20) is designed such that the biological cell (40) can enter the access channel (20) to thereby provide access to the sensor (25). Particularly the cell (40) forms a protruding portion (41) by entering the access channel (20), which portion is sensed. The access channel (20) may be provided with a specific sensor port at which the sensor (25) is present. The device may be used for sensing or actuating biological cells, such as neurons, for instance in electroporation treatments.

Sensors comprising micro-electrode arrays are used for measuring electrical activity in small networks of biological cells, such as neurons. Theses sensors are often relatively big and only small matrices or arrays of micro-electrodes can be made. Current state-of-the-art micro-electrode arrays (MEAs) may contain a maximum of 64 electrodes with a minimal spacing of 100 μm between neighbouring electrodes. The electrodes are often made of flat TiN pads with a diameter of maximum 10 μm. For some applications, smaller spacings, e.g. <10 μm, and a larger number of electrodes, e.g. >60000, may be required.
On-chip single cell recording of electrical activity using field-effect transistors has been demonstrated for large neurons or tissue slices (see P. Bergveld et al, IEEE Transactions on Biomedical Engineering, 1976. P. Fromherz et al., Science, May 1991, A. Cohen et al, Biosensors and Electronics, January 2004). In the case of mammalian neurons, e.g. hippocampal neurons, the cells are much smaller, which leads to a less efficient electrical coupling onto the chip surface and make a reliable electrical contact between the cell membrane and the recording device.
Hoogerwerf et al. have disclosed an array of microneedles for sensing of neurons. The array of microneedles or probes is assembled to a silicon platform with a construction in which the microneedles run through holes in the platform and then are connected using a certain flange. Electrical connection is made with bumps, e.g. eutectic metal bumps or plated contacts on a plated gold beam. The beams are coupled to interconnects extending on the substrate flange and from there extend on the microneedles. Such needles are particularly suitable for probing a cell. The overall array with microneedles bears a large similarity to probe cards with a plurality of probes used for testing integrated circuits. The conductive probes of such an array make contact with selective test pads on the integrated circuits and provide series of suitably digital signals to the integrated circuit for testing proper operation. However, when applying such array of probes to a biological cell, an adequate measuring of cell properties turns out difficult. The cell membrane does not have a solid and fixed plate of test pads. Therefore, an adequate stimulation by electric pulses and subsequent measuring is not achievable.
Fujimoto et al. disclose "Electroporation microarray for parallel transfer of small interfering RNA into mammalian cells" in Analytical and Bioanalytical Chemistry, Springer, Heidelberg, Del., Vol. 392, no. 7-8, 12-2008, pages 1309-1316. The document recites transfer of chemical substances into living cells, specifically transfer of siRNA into mammalian cells by an electroporation microarray.
Braeken et al. disclose "Local electrical stimulation of single adherent cells using three-dimensional electrode arrays with small interelectrode distances" in Engineering in Medicine and Biology Society 2009, Annual Int. Conf. IEEE, IEEE, Piscataway, N.J., USA, Vol. 1, 3 Sep. 2009, pages 2756-2759. The document recites cell electroporation by applying voltage pulses by a microneedle being smaller than the cell.
Han et al. disclose "A single cell multi-analysis system for electrophysiological studies" in Transducers '03, 12th Int. Conf. Solid State sensors, actuators and Microsystems, 2003, IEEE, Piscataway, N.J., USA, Vol. 1, 9 Jun. 2003, pages 674-677. The document recites a micro analysis system for multi purpose electrophysiological studies of single cells. It recites an electrode at a sidewall for coupling between a cell and an electrode.
Huys et al. disclose "Novel concepts for improved communication between nerve cells and silicon electronic devices" in Solid State Electronics, Elsevier Science Publishers, Barking, GB, Vol. 52, no. 4, 3 Dec. 2007, pages 533-539. The document recites a high density matrix of sensors and actuators on a CMOS chip. The document recites that electrical coupling can be improved by increasing the contact area between cell and electrode.
Jaber et al. disclose "Action potential recording from dielectrophoretically positioned neurons inside micro-wells of a planar microelectrode array" in J. Neuroscience Methods, Elsevier Science Publishers, Amsterdam, NL, Vol. 182, no. 2, 15 Sep. 2009, pages 225-235. The document recites 4×4 planar microelectrode arrays for studying and organising in vitro neural networks at a cellular level. The document recites growth of a biological cell into a channel, and sensing and actuating a portion of the cell.
EP-A 1967581 discloses CMOS compatible microneedles. A diagrammatical cross-sectional drawing hereof is shown in FIG. 9. The microneedles 6 are present on a substrate 1. The compatibility with CMOS is enabled, in one embodiment, with a manufacturing process as typically in use for the manufacture of interconnect structures of integrated circuits. While Hoogerwerf et al provide contacts on the outside of the microneedle, EP1967581 defines conductors 3 and/or microfluidic channels inside the microneedle 6. Thereto a dielectric matrix with a conductor 3 on top of an interconnect 2 is defined. Subsequently, the dielectric matrix is patterned so as to define the microneedles 6 with an insulating shaft around the conductor.
The use of such CMOS compatible technology for manufacturing results therein that a top surface of the microneedle may be planar. This is particularly the case at a stage during processing of the microneedles, before the partial removal of the dielectric matrix around the microneedles. As a result, a sensor or actuator device 4 may be defined on top of the microneedle 6. The interconnects 3 and/or microfluidic channels then run towards the sensor or actuator device 4 on top of the microneedle 6. On application of a biological cell 40, engulfment of the microneedle 6 has been found. This engulfment is beneficial as it leads to reduction of the amplitude of a stimulation current for the actuation of the biological cell.
However, it turns out that the area of the sensor or actuator device on top of the microneedle is limited. Increase of the area by increasing the diameter of the microneedle turns out limited, as the engulfment of the microneedle 6 by the biological cell 40 may be lost, which is undesired.

Katholieke Universiteit Leuven, KU Leuven R&D


A composition is described which is useful in improving the adhesion of siccative organic coatings to metal surfaces. The composition generally comprises a liquid carrier, a borate composition which is the reaction product of at least one amino alcohol with boric acid or an analogue of boric acid, and, at least one organic carboxylic acid.

It is well known in the metal finishing art that metal surfaces such as aluminum, iron, steel, galvanized and zinc surfaces may be coated with an inorganic phosphate by contacting the surface with an aqueous phosphating solution. The phosphate coating protects the metal surface to a limited extent against corrosion and serves primarily as an excellent base for the later application of corrosion-inhibiting compositions and siccative organic coating compositions such as oils, waxes, paint, laquer, varnish, primers, synthetic resins, enamel, and the like.
The inorganic phosphate coatings generally are formed on a metal surface by means of aqueous solutions which contain phosphate ion, and optionally, certain auxiliary ions including metallic ions such as sodium, manganese, zinc, cadmium, copper, lead, and antimony ions. These aqueous solutions also may contain non-metallic ions such as ammonium, chloride, bromide, fluoride, nitrate, sulfate, and borate ions. These auxiliary ions influence the reaction with the metal surface, modify the character of the phosphate coating and adapt it for a wide variety of applications. Other auxiliary agents such as oxidizing agents, coloring agents and metal cleaning agents also may be incorporated in the phosphating solution.
Such phosphating solutions are well known in the art and are effective in improving the adhesion of paint to metal surfaces. Although the adhesion of the siccative organic coating to the metal surfaces is improved by the phosphate coating, it has been noted, for example, where ferrous metal, galvanized ferrous metal or phosphated ferrous metal parts are provided with a siccative top coat of laquer or enamel, and such top coat is scratched or scored during, for example, handling, forming or assembling operations, the metal substrate becomes a focal point for corrosion and for a phenomenon known as "undercutting". Undercutting, or the loosening of the top-coat and areas adjacent to a scratch or score causes a progressive flaking of the top-coat from the affected area. The undercutting also results in a reduction of the desirable corrosion-resistance properties.
In addition, phosphating solutions are necessarily highly acidic and thus require special handling and appropriate equipment. Sludge formation in the phosphating baths also can be problematic, and spent phosphating solutions and rinse waters require treatment prior to disposal to meet stringent state and local regulations pertaining to phosphate in effluent streams.

Composition and process for improving the adhesion of a siccative organic coating compositions to metal substrates


A device redirects and concentrates direct sunlight into buildings. The device includes: at least one transparent element having a substantially planar top surface in an x-y-plane and a substantially planar bottom surface, wherein the top and bottom surfaces are arranged at an angle with respect to each other around the x-axis; and a light reflector for each transparent element. The light reflector has a reflective surface arranged substantially parallel and adjacent the bottom surface of the transparent element. The reflective surface is spaced apart from the transparent element by a transparent medium having a lower refractive index than the transparent element. Light incident to the device is refracted by each material transition interface and reflected by the reflecting element. By arranging the device substantially perpendicular to direct sunlight at noon, with one of its edges adjacent a building wall or window, the device can redirect and concentrate sunlight into buildings.

For several reasons it is desirable to use daylight as much as possible for providing lighting inside buildings. One reason is to save electrical energy and thereby save the environment from carbon dioxide, since a lot of, or at the present date, most, of the electrical energy produced in the world comes from some kind of combustion.
Another reason is that daylight is desirable before electrical lighting by humans in most situations. This has been shown in research as well as in observations of human behaviour and the arrangement of office space. Windows that admit daylight in buildings are important for the view and connection they provide with the outdoors. Daylight is also important for its quality, spectral composition, and variability. Indoor daylight is desired to be able to see well, and to experience environmental stimulation. Working long-term in electric lighting may affect health while working by daylight is believed to result in less stress and discomfort. Daylight provides high illuminance and permits excellent colour discrimination and colour rendering. Daylight may, however, also lead to uncomfort due to glare.
It is thus desirable to distribute daylight into buildings as long as glare is avoided. The traditional way to distribute daylight is to have windows of glass, allowing visible daylight to pass through the window and illuminate the room inside the window. If glare is produced by too direct or bright sunlight the traditional way has been to use shades to absorb or reflect some of the incident daylight and thereby reduce the light inside the room. A problem is then that the amount of light that is transmitted into the room often is too small to be sufficient and electrical lighting has to be used as compensation. Another way to reduce glare is to use frosted or structured glass in the window to scatter the incident light in all directions. In strong sunlight this solution, however, still produces too much glare. A scattering surface also reduces the transparency of the window so that it is useless for viewing through.
Another solution to reduce glare has been to have redirecting surfaces in all or part of the window, redirecting some of the incident light towards the ceiling of the room, e.g. by arranging prisms inside the window. Prism structures for light redirection are well known as well as a double rotating prism structure for optimal light redirection of (time varying) direct sunlight, see e.g. U.S. Pat. No. 5,729,387. Using prisms also reduce or destroy the ability to see through the window, affecting the function of the window to view through. Another problem using prisms inside the window is that the illumination of the ceiling will change as the sun angle shifts during the day if not active movement of the prisms is achieved to follow the sun movements.
Some rooms in a building are so large that light from windows do not reach all parts, and some rooms deep inside buildings does not have any walls to the outside to let daylight in through. In these cases systems have been developed to use optical fibres or light ducts to transport light deep into the building. A light duct is a pipe having strongly reflective inner walls. A system of light ducts is for example shown in the source book "Daylight In Buildings" published by the International Energy Agency (IEA). In these systems the collecting side of the duct is often equipped with collecting optics, often placed in a favourable angle to the sun. The collection systems are, however, bulky and not favourable from an esthetical point of view, leading to a resistance to them from architects. The bulky construction may also be in the way of other equipment wanted on the building.
There is thus a need to have a more efficient way of directing daylight into buildings through windows and light ducts in an efficient way while keeping cost down and producing a solution that is attractive or discrete enough so that people, and especially architects, want to use them.


A configuration is presented that enables viewing a plurality of data objects situated in a virtual space as the visual field defined in the virtual space is changed smoothly; and that at the same time enables: supplemental information in connection with displayed data objects to be displayed; information in connection with displayed data objects to be displayed in more detail; means for dialogue with a user to be provided in situations where required; and application programs linked to the display of information and associated with that information to be executed. Included are: a step of accepting virtual-viewpoint position changes; a step of continuously changing visual field based on the virtual-viewpoint position changes, and uninterruptedly changing the display of a data object positioned within the visual field; a step of determining whether a data object positioned within the visual field satisfies predetermined geometric conditions for the visual field; and in respect of a data object that satisfies the predetermined geometric conditions, a step of executing a process preset in that data object.

1. Technical Field
The present invention relates to a display method and display control device for displaying, in accordance with a visual field from a set viewpoint, data objects situated in a three-dimensional virtual space.
2. Description of Related Art
Computers connected to networks, such as the Internet for example, are capable of retrieving massive amounts of diverse information. In addition, as the capacity of storage media increases, even stand-alone information machines have become able to utilize vast amounts of diverse information.
In order to make use of such large amounts of diverse information, GUIs (graphical user interfaces) that employ a desktop metaphor, such as Microsoft Windows™ are being used, as are web browsers such as Microsoft Internet Explorer™ and Netscape Navigator™. These applications display viewing target informational content arranged on a screen in a static and planar manner; and in order to view the informational-content items in turn, succeeding subject matter must be displayed by replacing the subject matter being displayed in the active window, or must be displayed by changing the active attribute of windows being displayed on the screen in an overlapping manner.
When a plurality of informational items is displayed by switching from one display to another, the sense of continuity on the screen is lost, leading to the problem of a 25 user having trouble understanding how the individual contents are related to each other.
In order to solve such problems, an information display method has been proposed (Japanese Pat. App. No. 2001-162322 [filed May 30, 2001]; Laid-Open No. 2000-172248) wherein concatenatedly linked data objects are arranged in a three-dimensional virtual space, and based on a visual field defined in the virtual space, the data objects are displayed on a display screen; and wherein information can be perused by following along links while the display screen is changed uninterruptedly by changing the visual field smoothly.
A conventional technique of this sort will be explained using FIGS. 5 and 6. FIG. 5 is a conceptual view of a link structure of concatenatedly linked data objects, and FIG. 6 10 is example displays of the concatenatedly linked data objects.
In FIG. 5, data objects 102 and 103 are represented within data object 101 as links 112 and 113, respectively, and data objects 104 and 105 are represented within data object 102 as links 114 and 115, respectively. Data object 106 is represented within data object 104 as link 116.
In display example 301 at (A) in FIG. 6, data object 101 and data objects 102 and 103 linked to data object 101 are displayed.
When a shift-viewpoint instruction is accepted, the display range is changed according to the instruction, transitioning, for example, to the state shown in display example 302 at (B) in FIG. 6. In this display example 302, data object 101, data object 102 linked to data object 101, and data objects 104 and 105 linked to data object 102 are displayed.
When a further shift-viewpoint instruction is accepted, the state shown in display example 303 at (C) in FIG. 6 ensues. In this display example 303, data object 102, data object 104 linked to data object 102, and data object 106 linked to data object 104 are displayed.
In display examples 301 through 304, the data object that occupies the largest area within the display screen is displayed in detail, and the preceding/following relationships of the data objects are set in correspondence with the link modes and displayed. The fact that the display within the field of view always changes smoothly in response to the shift-viewpoint instructions enables a user to follow the links and view the data objects.
The information display method described above readily enables viewing by following concatenatedly linked information, and enables remedying the problem of losing sight of the interrelationships among the informational-content items. However, this method does not take into consideration such matters as: displaying supplemental information in connection with displayed data objects; displaying information in more detail in connection with displayed data objects; providing means for dialogue with a user in situations where required; or executing application programs linked to the display of information and associated with that information.

This patent is subject to a terminal disclaimer.

Information processing device and data object display method


A method and apparatus for balancing power plane pin currents in a printed wiring board (PWB) uses a set of collinear slots in the form of a dashed line to reduce pin counts required for power plane (including ground plane) connections and/or reduction in requirements for connector current handling per pin. The slots are introduced in the metal layer implementing the power plane that alter the current distribution in the power plane. The per-pin current profile for connector pins connected to the power plane is equalized by tuning the length of the slot(s). The slots may be shaped around a connector end when the power plane pin allocation is not uniform at the connector ends. The resulting equalization reduces either pin count required for carrying the power plane current or reduces connector pin current requirements.

1. Technical Field
The present invention relates generally to electrical and electronic circuits and systems fabricated on printed wiring boards and more specifically to a method for balancing power plane pin currents and printed wiring board having balanced pin currents.
2. Description of the Related Art
Printed wiring boards (PWBs), also referred to as printed circuit boards (PCBS) have been in use for decades for fabricating circuits and entire systems. The PWBs provide the interconnects for discrete and integrated components and subsystems and provide power paths or power planes for interconnecting the components to power supplies.
Power distribution in PWBs has always been a concern and in particular, high current systems such as today's processing systems and interchangeable processing sub-units ("blades") require the handling of very high currents per PWB on some power supply connections, which can generate substantial voltage drops within the PWB conductor(s) and require multiple connector pins or other connector contacts connected in parallel to carry the amount of current supplied to a particular power supply distribution net.
To alleviate the voltage drop problem (and also provide electromagnetic shielding), processing systems and subsystems integrated on a PWB typically use specific layers of a multilayer PWB to carry the power supply voltages and returns or may include a few other connections, but will primarily be power supply layers. A layer dedicated to power supply distribution may actually include multiple power planes distributing two or more separate power supply outputs or may be dedicated to distributing a single power supply output.
The large metal areas typically used for power planes reduces the voltage drop to the connector pins or other terminals used to connect the PWB to a power supply. However, differential voltages exist between the power supply terminal connections, even with a continuous metal plane, because of differing resistive path lengths between the terminals and the current sinks or sources (e.g., a large current consumer such as a processor) and the individual terminals. Additionally, the current distribution in the power plane metal, which is not uniform, contributes to the differential voltages between the terminals, and the differential voltages cause non-uniform distribution of terminal currents. In general: 1) terminals that are closer to the current sources and sinks (i.e., the device power terminals) on the PWB carry more current due to the shorter paths; and 2) terminals that are toward the outside of the terminal array carry higher currents due to the decreased current density away from the center of the connector length (because of lowered voltage drop per unit length along the paths passing through lower current density regions). Both of the above-recited factors superimpose to yield a particular terminal current distribution for each power plane and for each PWB/terminal configuration.
In present-day systems, such as large scalable server systems operating at relatively low voltages, the current levels per PWB and per-terminal are very large. As such, a significant amount of power is dissipated in the connectors due to pin resistance and in the PWBs themselves due to the finite conductivity of the metal layers used to implement the power planes. The use of thin laminated PWBs having many layers also increases the effective resistance of the paths between devices on the PWB and the connector terminals, leading to an increase in the terminal current distribution described above.
The disparity in terminal currents leads to a need to over-specify a connector for pin current handling, which is typically set by the maximum power dissipation through the pin and the overall tolerable pin resistance (dictated by the maximum voltage drop(s) to the components on the PWB). Alternatively, an increase in the total number of terminals required to couple the power supply to the PWB power plane(s) is required.
Also, overall power dissipation is increased by a disparate terminal current distribution. Because the power dissipation per terminal (both in the power plane and the connector pin) is a function of the square of the current through the terminal, the average power dissipation in a connector is not constant over all the possible terminal current distributions, but is at a minimum when the terminal current distribution is equal. For example, for two terminals carrying a total of 4A, if the pin currents are equal, the power dissipation in watts is 8R where R is the resistance of the pins. If the pin currents are 1A and 3A respectively, the power dissipation in watts is 10R. Equalizing the terminal current distribution minimizes the power dissipation in the connector, as well as generally minimizing average power dissipation in the power plane metal area.
It is therefore desirable to provide a method for PWB power plane design and a PWB power plane implementation that equalizes the connector terminal currents for power supply connections.

Method for balancing power plane pin currents in a printed wiring board using collinear slots

International Business Machines Corporation


The present invention relates to a circuit configuration (10) having a feedback operational amplifier (AMP) for amplifying an input signal (Vin) input into the circuit arrangement (10) and outputting the amplified input signal as an output signal (Vout). In order to be able to change the circuit amplification (Vout/Vin) easily and reliably in the circuit configuration (10) and simultaneously keep an impairment of the output signal (Vout) caused by noise relatively low, capacitance values (Cb, C) of the coupling path (12) and of the feedback path (14) are adjusted simultaneously to one another correlated in a special way.

1. Area of the Invention
The present invention relates to a circuit configuration having a feedback operational amplifier for amplifying an input signal input into the circuit configuration and outputting the amplified input signal as an output signal.
Circuit configurations of this type are known in manifold forms. Solely for exemplary purposes, reference is made to the textbooks "U. Tietze, Ch. Schenk, Halbleiter-Schaltungstechnik [Semiconductor Circuit Technology], 5th Edition, Springer-Verlag, 1980", in particular pages 93 through 108, and "Paul Horwitz, Winfield Hill, The Art of Electronics, Second Edition, Cambridge University Press, 1989", in particular pages 175 through 195.
The term "operational amplifier" as defined in the present invention is to be understood very broadly as a configuration capable of amplifying an electrical variable such as a voltage. In particular, it refers to amplifiers, for example, in which a signal applied to the amplifier input is provided having relatively high voltage amplification at the amplifier output. This open amplification ("open loop again") may be in the magnitude of approximately 104 through 105, for example.
An essential characteristic of the circuit configuration according to the species is that the circuit amplification, i.e., the ratio between output signal and input signal, is practically completely independent of this open amplification (except for transient occurrences) and is solely predefined by an additional (external) configuration of the operational amplifier.
The term "feedback network" in the circuit configuration according to the species refers to any such configuration of the operational amplifier which exerts an influence on the resulting circuit amplification. In the simplest case, the feedback network comprises a configuration of one or more (ohmic) resistors. Alternatively or additionally, other components such as capacitors and/or inductors may be provided to produce the feedback network. Very generally, these components provided to produce the feedback network are thus identified in the following as impedances.
2. Description of the Prior Art
There are applications in which a circuit configuration is required in which the circuit amplification is changeable or even continuously changeable. In order to achieve this, essentially two approaches are followed in the prior art.
One possibility is to connect a damping element, whose damping is changeable, upstream of an amplifier having a fixed predefined amplification.
Another possibility is to implement amplification-determining resistors of the feedback network on an operational amplifier by MOS transistors, which are operated in the triode range. The effective resistance of these transistors may be changed continuously by a corresponding change of activation signals (gate source voltages).
Both achievements of the object are not satisfactory in all applications. In the first achievement of the object, nonlinearities typically occur in the damping element, for example, which have an effect on the circuit amplification.
In the second achievement of the object, above all, a disadvantage is the restricted linearity of the resistors implemented by MOS transistors in the triode range and, accompanying this, a reduced linearity of the circuit configuration.
In addition, a further disadvantage of the known circuit configurations is that their output signal is often impaired by interference signals, particularly noise unavoidably occurring at the input side of the operational amplifier, for example. In a resistive feedback amplifier configuration, the extent of the "white noise" (flat curve of the frequency-dependent noise output), which is at least to be observed as dominant, such as the noise output or the noise voltage occurring at a resistor element, is a function of the relevant resistance values(s). A greater resistance value results in a greater effective noise voltage. The use of resistor elements having resistance values in the magnitude of approximately 100 Ω or less is to be derived from this law for a circuit configuration implemented in CMOS technology for many applications (if noise up to a few nV/(Hz)0.5 is to be permitted). Although resistance values this low may be implemented in CMOS technology, it is extremely difficult to change resistance values of this type in operation at great precision or with high linearity in relation to an activation signal in order to change the circuit amplification precisely during operation of the circuit configuration.

Circuit configuration having a feedback operational amplifier


A novel fluorinated ether compound useful as an inert medium is provided.

As fluorinated inert media, perfluoroalkanes such as C5F12 or C8F18, perfluoroethers such as a compound represented by the following formula (2), and perfluoroalkylamines such as (C4F9)3N, are, for example, known. These fluorinated inert media are used as an insulating oil in the field of electronics, as a medium for e.g. thermal shock tests or leak tests, as an oxygen carrier in the medical field, or as a cleaning or dewatering agent in the industrial field (e.g. Non-Patent Document 1).

Non-Patent Document 1: "Newest Aspect of Fluoro Functional Material" compiled by Masaki Yamabe and Masashi Matsuo, published by CMC, 1994, p. 172-176

Abstract: The compound is represented by the following formula (1) such as the compound represented by the following formula (1a) or the compound represented by the following formula (1b):RF1OCFRF2CFRF2ORF1   (1)F(CF2)4OCF(CF3)CF(CF3)O(CF2)4F   (1a)F(CF2)6OCF(CF3)CF(CF3)O(CF2)6F   (1b)wherein the symbols have the following meanings:                RF1 is a C4-7 linear perfluoroalkyl group; and        RF2 is a fluorine atom or a trifluoromethyl group.


An apparatus for executing a block program includes a block table listing records corresponding to a plurality of blocks in the block program. A block library is included to hold algorithms associated with the blocks. An executing program selectively processes the blocks in the block program that receive a new input value that is different from a previous input value, in accordance with the associated algorithms in the block library.

The present invention generally relates to block programming, and more particularly to block programming in which the blocks in a program are selectively executed based on changes in the input values of the blocks.
Block programming is well known in the control industry. In contrast to the traditional control programs using sequential language to write lines of codes, block programming is done generally through drawings. For those who are in the control industry, such as building managers or building operations system dealers who install control systems, it is generally more intuitive and easier to draw the control strategies pictorially into blocks that perform various functions, rather than writing it in some programming language such as C or BASIC, for example. These blocks are compiled into a file of records that describe the operations or functions of the blocks, and an interpreter or execution engine interprets the records. Generally, each block in the program represents a subroutine or algorithm that performs various specified tasks. These blocks are connected together through input and output lines or connectors to form a complete program.
Typically, the control systems that employ block programs execute all the blocks within the program each time the program is run. In a block program for operating a heating/ventilation/air conditioning (HVAC) system, for example, there could be from about 1,000 to 2,000 blocks, each of which must be executed every run of the program, which could be every few hundred milliseconds to give the appearance of smooth real-time operation to a human observer. Performing these executions in the required time is not a problem if a relatively fast computer is used. However, such computers are expensive and add to the cost of the control system.

Apparatus and method for executing block programs