A solid-state imaging device includes: a pixel region in which a plurality of pixels composed of a photoelectric conversion section and a pixel transistor is arranged; an on-chip color filter; an on-chip microlens; and a multilayer interconnection layer in which a plurality of layers of interconnections is formed through an interlayer insulating film. The solid-state imaging device further includes a light-shielding film formed through an insulating layer in a pixel boundary of a light receiving surface in which the photoelectric conversion section is arranged.

1. Field of the Invention
The invention relates to a solid-state imaging device, a method of manufacturing the same, and an electronic apparatus such as a camera including the solid-state imaging device.
2. Description of the Related Art
A digital video camera or digital still camera which is for use by consumers has called for high resolution power to transmit details of a photographic subject and a reduced-size device with a regard to portability. In addition, in order to realize these demands, development on a reduction in the pixel size while maintaining the image capturing property has been performed in regard to a solid-state imaging device (image sensor). However, in recent years, in addition to existing demands for high resolution and reduction in size, demand has been increasing for improvement in low luminance for photographic subjects or high-speed image capturing and the like. In order to realize these, expectation has increased for improvement in comprehensive image quality starting from the SN ratio in the solid-state imaging device.
The CMOS solid-state imaging device is categorized into a front-illuminated device shown in FIG. 5 and a back-illuminated device shown in FIG. 6. The front-illuminated solid-state imaging device 111 includes a pixel region 113 where a plurality of unit pixels 116 composed of photodiode PDs, which become a photoelectric conversion section, and a plurality of pixel transistors, are formed in plural number on a semiconductor substrate 112, as shown in the schematic configuration diagram of FIG. 5. The pixel transistor (not shown) represents a gate electrode 114 in FIG. 5, representing schematically the presence of the pixel transistor. Each of the photodiodes PD is isolated by an element isolation region 115 formed of an impurity diffused layer. A multilayer of interconnection layers 119, in which a plurality of interconnections 118 is disposed through an interlayer insulating film 117, is formed on the surface side of a semiconductor substrate 112 where the pixel transistor is formed. The interconnection 118 is formed in other parts than those corresponding to the position of the photodiode PD. On the multilayer of the interconnection layers 119, an on-chip color filter 121 and an on-chip microlens 122 are formed in this order through a planarization film 120. The on-chip color filter 121 is constituted by arranging each color filter of, for example, red (R), green (G) and blue (B). In the front-illuminated solid-state imaging device 111, the light L is incident from the side of the substrate surface, on which the multilayer of the interconnection layers 119 is formed, using this substrate surface as a light receiving surface 123.
A back-illuminated type solid-state imaging device 131 includes the pixel region 113 where a plurality of unit pixels 116 composed of the photodiodes PD, which become a photoelectric conversion section, and a plurality of pixels transistors are formed in plural number on the semiconductor substrate 112, as shown in the schematic configuration diagram of FIG. 6. The pixel transistor (not shown) is formed on the surface side of the substrate, and represents a gate electrode 114 in FIG. 6, representing schematically the presence of the pixel transistor. Each of the photodiodes PD is isolated by the element isolation region 115 formed of an impurity diffused layer. The multilayer of the interconnection layers 119, in which a plurality of interconnections 118 is disposed through the interlayer insulating film 117, is formed on the surface side of the semiconductor substrate 112 where the pixel transistor is formed. In the back-illuminated device, the interconnection 118 can be formed regardless of the position of the photodiode PD. On the other hand, an insulating layer 128, the on-chip color filter 121 and the on-chip microlens 122 are formed in this order on the backside of the semiconductor substrate 112 to which the photodiode PD faces. In the back-illuminated solid-state imaging device 131, the light L is incident from the substrate backside, which is the side opposite to the substrate surface on which the multilayer of the interconnection layers 119 and the pixel transistor are formed, using this substrate backside as a light receiving surface 132. Since the light L is incident to the photodiode PD with no restriction of the multilayer of the interconnection layers 119, apertures of the photodiode PD can be broadly taken, and high sensitivity can be achieved.
The present applicants have succeeded in the development of experimental production of a back-illuminated CMOS solid-state imaging device that improves sensitivity, which is one of the main elements for high image quality and noise reduction rate by changing the basic structure of pixels to the back-illuminated type without losing the advantages of low power consumption and high speed that the CMOS solid-state imaging device has. This developed back-illuminated CMOS solid-state imaging device has 5 million effective pixels, each pixel size being 1.75 μm×1.75 μm, and is driven at a rate of 60 frames per second.
In the front-illuminated device of a related art, the interconnection 118 or the pixel transistor on the surface side of a substrate, where the photodiodes PD are formed, hinders the incident light collected with an on-chip microlens, which is an issue in reduction of pixel size and variation of incident angle. In comparison to this, in the back-illuminated device, applying the light from the backside inverted from the silicon substrate allows an increase in the amount of the light incident to unit pixels while also suppress sensitivity reduction in regard to angle variation of incident light with no influence of the interconnection 118 or the pixel transistor.
The back-illuminated CMOS solid-state imaging device is disclosed, for example, in Japanese Unexamined Patent Application Publication Nos. 2003-31785, 2005-353631, 2005-353955, and 2005-347707. In addition, a technique of using hafnium oxide (HfO2) as an antireflection film used in the back-illuminated CMOS solid-state imaging device is disclosed in Japanese Unexamined Patent Application Publication No. 2007-258684.
Solid-state imaging devices are largely divided into a CCD (Charge Coupled Device) type solid-state imaging device and a CMOS (Complementary Metal Oxide Semiconductor) type solid-state imaging device.
In these solid-state imaging devices, the light-receiving portion composed of photodiodes is formed for each pixel. In the light-receiving portion, signal charges are generated by photoelectric conversion by incident light to the light-receiving portion. In the CCD type solid-state imaging device, signal charges generated in the light-receiving portion are transferred to a charge transfer portion that has the CCD structure and output in the output portion as converted to pixel signals. On the other hand, in the CMOS type solid-state imaging device, signal charges generated in the light-receiving portion are amplified for each pixel and the amplified signals are output as pixel signals by signal ray.
In such solid-state imaging device, there are problems that aliasing is generated in a semiconductor substrate by tilted incident light or incident light diffusely reflected in the upper portion of the light-receiving portion, and optical noise such as smear, flare is generated.
Japanese Unexamined Patent Application Publication No. 2004-140152 mentioned below describes the constitution of the CCD type solid-state imaging device that allows the suppression of smear generation by forming a light-shielding film, which is formed in the upper portion of the charge transfer portion, to be buried in the groove portion that is formed in the interface between the light-receiving portion and the read gate portion. Since the CCD type solid-state imaging device in Japanese Unexamined Patent Application Publication No. 2004-140152 is constituted to form the light-shielding film in the groove portion formed using the LOCOS oxide film, it is difficult to form the light-shielding film deep in the substrate, and not possible to completely prevent incidence of tilted light, which is a cause of smear. In addition, since the pixel area is reduced in proportion to the burying depth of the light-shielding film, it is practically difficult to bury deep the light-shielding film.
In recent years, a back-illuminated solid-state imaging device has been proposed, in which the light is applied from the side opposite to the side of the substrate on which the interconnection layer is formed (see Japanese Unexamined Patent Application Publication No. 2004-71931 described below). In the back-illuminated solid-state imaging device, the light application side does not include the interconnection layer, the circuit element and the like, and thereby the aperture rate of the light-receiving portion formed on the substrate can be enhanced. Furthermore, since the incident light is incident to the light-receiving portion with no reflecting to the interconnection layer and the like, sensitivity is improved.
Even in such a back-illuminated solid-state imaging device, there is a concern about optical noise due to tilted light, and thus a light-shielding film is preferably formed between the light-receiving portions of the backside of the substrate, which becomes the light application side. In this case, a layer, that has the light-shielding film on the backside of the substrate that becomes the light application side, may be considered to be formed as one layer. However, the distance between the substrate and the on-chip lens side is lengthened in proportion to the height of the light-shielding film, and thus deterioration of light-collecting property may occur. When the light-collecting property is deteriorated, problems may occur such that the tilted light transmitted through a color filter of other pixels is incident to the light-receiving portion of different pixels from the pixels, and color mixing and sensitivity reduction are also generated.
Meanwhile, it has been found that in the back-illuminated CMOS solid-state imaging device, the light-collecting structure made of only the on-chip microlens 122 has following problems remarkably that may happen.
(1) It is very difficult to completely suppress optical color mixing with adjacent pixel. It may not be a problem in use such as monitoring, cellular phone, but color mixing has to be further reduced in use of audio/video (AV) (camcorder, digital still camera and the like).
(2) A light-shielding film is provided in the effective pixel peripheral portion to prevent noise in the peripheral circuit region and determine optical black level. However, the light-collecting state changes in the effective pixel peripheral portion by level difference of the light-shielding film, and thus uniform optical property is not realized. That is, as shown in FIG. 4, the light-shielding film 126 is formed through the insulating film 127 from optical black level region (so-called optical black region) 113B outside the effective pixel region 13A to the peripheral circuit section 125. On top of this, the on-chip color filter 121 and the on-chip microlens 122 are formed. At this time, height difference d of the lens surface of the on-chip microlens 122 occurs by the level difference by presence or absence of the light-shielding film 126, in the peripheral portion of the effective pixel region 113A and the central part in the inside thereof. The light-collecting state changes due to this height difference d, and the peripheral portion becomes dark in comparison to the brightness of the central part of the effective pixel region, and thus uniform optical property is not obtained. So-called sensitivity unevenness happens.
(3) Reflection happens by the on-chip microlens 122 or the on-chip color filter 121 in photographing using high-intensity light source. Diffracted light is reflected to the seal glass and the like on the package of the solid-state imaging device, and further incident thereto, and color mixing happens uniformly to the RGB pixel. By this color mixing, streaky image defect of Mg color (hereinafter, called as flare of Mg color) happens in a radial fashion from the high-intensity light source, which is unique in the back-illuminated solid-state imaging device.
Specifically, the problems will be described using the green pixel 151G and the red pixel 151R of FIG. 3 A. The light L that is incident to the on-chip microlens 122 of the green pixel 151G, is incident to the photodiode PD of the green pixel through the green filter 121G. However, some tilt light La is incident to the photodiode PD of the red pixel 151R that is adjacent to the pixel boundary. This is shown with simulation of the light intensity when the light of 550 nm wavelength is incident to two pixels of the green pixel and the red pixel of FIG. 3 B. In FIG. 3 B, the regional part A represents a part where the light intensity is strong, the light-colored regional part B represents a part where the light intensity is weak, and the heavy-colored regional part (streaky part) C represents a part where the light intensity is almost absent. The fine periodical streak pattern shows the progress of the light wave surface. If the light is looked at, which is incident to the photodiode PD under the light receiving surface 153, it is found that weak light is incident to the photodiode PD of the red pixel 151R, and color mixing happens in the region D shown in the round shape near the pixel boundary.
On the other hand, as shown in FIG. 1, a seal glass 135 is disposed through a space 134 in the window of the incident light side of the package (not shown) where the back-illuminated CMOS solid-state imaging device 131 is stored. Furthermore, an optical low-pass filter 136 is disposed on this seal glass 135 through the space 134, and an infrared cutoff filter 137 is disposed on this through the space 134. Furthermore, a camera lens 138 is disposed on the upper side. The incident light L1, which transmits the camera lens 138 and incident to the solid-state imaging device 131, is reflected partially at each medium interface of the solid-state image capturing element 131. The incident light L1 is mainly reflected at the lens surface of the on-chip microlens 122, and the silicon surface that becomes the light receiving surface. The on-chip microlens 122 is periodically arranged, and thus diffraction phenomenon occurs. The reflected and diffracted light L2, which has been reflected in the solid-state imaging device 131, is reflected in various angles such as nearly vertical reflection, distant-direction reflection. The light L2 is reflected at the seal glass 135, the optical low-pass filter 136 and the infrared cutoff filter 137, and is incident again to the solid-state imaging device 131 as re-incident light L3. Among them, the light diffracted at great angle is reflected at the seal glass 135, and incident again to the solid-state imaging device 131, which becomes Mg flare 141 in a radial fashion shown in FIG. 2 (see the circular frame E). The white streak (white flare) 142 in a radial fashion occurs due to the iris in camera lens side, and is a phenomenon that also occurs in the front-illuminated solid-state imaging device, and cause no such uncomfortable feeling. However, Mg flare 141, which is unique in the back-illuminated solid-state imaging device, is noticeable in comparison to the back green, for example, when photographing is taken for sunbeams streaming through leaves, and becomes problems.
Happening of this Mg flare 141 is due to the treatment of the white balance in the process of the signal processing for uniform spectroscopic characteristics of red (R), green (G) and blue (B). Although color mixing is performed for each pixel to be equal by re-incidence of the diffracted light, Mg flare happens since signals of red (R) and blue (B) come to have greater gain in comparison to that of green (G), and thus are emphasized with the white balance treatment.
In the back-illuminated solid-state imaging device, Mg flare may happen by above-described optical color mixing and reflected light by leakage of incident light to adjacent pixel. However, optical color mixing to adjacent pixel may happen also in the front-illuminated solid-state imaging device.

Solid-state imaging device, method of manufacturing the same, and electronic apparatus


A method includes programmatically placing a first call to a destination phone number associated with a line, and recording the first call as a first recording; receiving a signal corresponding to an incoming call directed to a first phone number; determining, based on stored data representing association of the first phone number with the destination phone number, that the destination phone number is associated with the first phone number; routing, based on the determination that the destination phone number is associated with the first phone number, call data corresponding to the incoming call to a destination device associated with the destination phone number, and recording the call as a second recording; comparing the second recording to the first recording, and effecting communication, based on a determination that the first and second recordings match, of an alert to one or more phone numbers.

The present invention generally relates to lead generation and retention and providing alerts for a voicemail line.
In sales, retail, and many other fields, it is common for one or more lines to be set up to receive incoming calls expressing interest in a product or service. For example, a magazine advertisement might advertise a particular number to call for goods or services. If an incoming call generated by such an advertisement is missed, it can lead to lost revenue. Voicemail has long been known, but does not ensure that revenue is not lost.
A need exists for improvement in ensuring that revenue is not lost from incoming calls. One or more needs, including this need, are addressed by one or more aspects of the present invention, although some needs, such as this need, may not be addressed by every aspect.


Heat sink and electrically non-conducting thermal interface having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The base plate is attachable to a heat-dissipating component, and may optionally include a ground contact connection for use with components that are not already grounded.

Interface systems for use in transferring heat produced from a heat-dissipating electronic component to a heat dissipator or heat sink are well-known in the art. In this regard, such electronic components, the most common being computer chip microprocessors, generate sufficient heat to adversely affect their operation unless adequate heat dissipation is provided. To achieve this end, such interface systems are specifically designed to aid in the transfer of heat by forming a heat-conductive pathway from the component to its mounting surface, across the interface, and to the heat sink.
In addition to facilitating the transfer of heat, certain applications further require electrical insulation. Accordingly, such interface systems are frequently further provided with materials that are not only effective in conducting heat, but additionally offer high electrical insulating capability. Among the materials frequently utilized to provide such electrical insulation are polyimide substrates, and in particular KAPTON (a registered trademark of DuPont) type MT.
Exemplary of such contemporary thermal interfaces are THERMSTRATE and ISOSTRATE (both trademarks of Power Devices, Inc. of Laguna Hills, Calif.). The THERMSTRATE interface comprises thermally conductive, die-cut pads which are placed intermediate the electronic component and the heat sink so as to enhance heat conduction therebetween. The THERMSTRATE heat pads comprise a durable-type 1100 or 1145 aluminum alloy substrate having a thickness of approximately 0.002 inch (although other aluminum and/or copper foil thickness may be utilized) that is coated on both sides thereof with a proprietary thermal compound, the latter comprising a paraffin base containing additives which enhance thermal conductivity, as well as control its responsiveness to heat and pressure. Such compound advantageously undergoes a selective phase-change insofar the compound is dry at room temperature, yet liquifies below the operating temperature of the great majority of electronic components, which is typically around 51Exc2x0 C. or higher, so as to assure desired heat conduction. When the electronic component is no longer in use (i.e., is no longer dissipating heat), such thermal conductive compound resolidifies once the same cools to below 51Exc2x0 C.
The ISOSTRATE thermal interface is likewise a die-cut mounting pad that utilizes a heat conducting polyimide substrate, namely, KAPTON (a registered trademark of DuPont) type MT, that further incorporates the use of a proprietary paraffin based thermal compound utilizing additives to enhance thermal conductivity and to control its response to heat and pressure. Advantageously, by utilizing a polyimide substrate, such interface is further provided with high dielectric capability.
Additionally exemplary of prior-art thermal interfaces include those disclosed in U.S. Pat. No. 5,912,805, issued on Jun. 15, 1999 to Freuler et al. and entitled THERMAL INTERFACE WITH ADHESIVE. Such patent discloses a thermal interface positionable between an electronic component and heat sink comprised of first and second generally planar substrates that are compressively bonded to one another and have a thermally-conductive material formed on the outwardly-facing opposed sides thereof. Such interface has the advantage of being adhesively bonded into position between an electronic component and heat sink such that the adhesive formed upon the thermal interface extends beyond the juncture where the interfaces interpose between the heat sink and the electronic component.
The process for forming thermal interfaces according to contemporary methodology is described in more detail in U.S. Pat. No. 4,299,715, issued on Nov. 10, 1981 to Whitfield et al. and entitled METHODS AND MATERIALS FOR CONDUCTING HEAT FROM ELECTRONIC COMPONENTS AND THE LIKE; U.S. Pat. No. 4,466,483, issued on Aug. 21, 1984 to Whitfield et al. and entitled METHODS AND MEANS FOR CONDUCTING HEAT FROM ELECTRONIC COMPONENTS AND THE LIKE; and U.S. Pat. No. 4,473,113, issued on Sep. 25, 1984 to Whitfield et al. and entitled METHODS AND MATERIALS FOR CONDUCTING HEAT FROM ELECTRONIC COMPONENTS AND THE LIKE, the contents of all three of which are expressly incorporated herein by reference.
In addition to the construction of thermal interfaces, there have further been advancements in the art with respect to the thermal compositions utilized for facilitating the transfer of heat across an interface. Exemplary of such compounds include those disclosed in U.S. Pat. No. 6,054,198, issued on Apr. 25, 2000 to Bunyan et al. and entitled CONFORMAL THERMAL INTERFACE MATERIAL FOR ELECTRONIC COMPONENTS, and U.S. Pat. No. 5,930,893, issued on Aug. 3, 1999 to Eaton and entitled THERMALLY CONDUCTIVE MATERIAL AND METHOD OF USING THE SAME, the teachings of which are expressly incorporated by reference.
In addition to being able to facilitate the transfer of heat and provide electrical insulation, many interface systems additionally employ a grounded substrate formed from a conductive material, such as copper, to suppress radiated emissions, namely electromagnetic interference (EMI), generated in high frequency transistor applications. In this regard, such grounded substrate is utilized to minimize capacitance to the heat sink to which it is attached, as well as to provide shielding effectiveness and attenuation of radiated EMI. With respect to the latter, it has been shown that electrically grounded copper substrates can provide shielding effectiveness to 60 dB at 1000 KHz, which is an attenuation percentage of 99.9%.
One such commercially-available thermal interface incorporating a grounded conductive substrate is EMI-STRATE (a registered trademark of Power Devices, Inc. of Laguna Hills, Calif.). Such interface comprises a grounded copper substrate sandwiched between two polyimide film substrates, the latter being comprised of KAPTON-type MT. The exterior sides of such interface are further coated with a proprietary thermal compound to thus facilitate the transfer of heat away from the electronic component to a heat sink.
Notwithstanding the effectiveness of thermal interfaces currently in use, a substantial need exists in the art for an interface that provides greater EMI attenuation, shielding effectiveness, and thermal conductivity. In this regard, newer electronic componentry continues to have ever increasing power dissipation and EMI emission. While such electronic componentry typically is constructed and/or packaged to be electrically isolated, the aforementioned increases in power dissipation and EMI emission currently present drawbacks that must be addressed if such componentry is to perform optimally. Additionally, as such advances are made in such componentry, it is certain that the aforementioned concerns regarding radiated emission and power dissipation will continue to create a demand for an interface system that can adequately address the same.
Prior art interface systems, however, are ill-suited to meet such needs insofar as such interface systems, because of their multiple-layer construction, substantially reduces the flow of heat thereacross. In this regard, it has been found that the use of thermal interface systems having six layer construction does not provide desirable heat transfer from a given electronic component to a heat sink. Moreover, not only does each individual layer impede heat flow, but, as those skilled in the art will appreciate, each interface of adjacent layers additionally inhibits heat flow. In this respect, each layer contributes three distinct impediments to heat flow, namely, each layer introduces the material of which the layer itself is comprised, as well as the two interfaces at either surface of the layer. Thus, it will be appreciated that it is highly desirable to minimize the number of layers, and consequently the number of interfaces, comprising such interface system. In addition to the foregoing, it should be noted from a practical standpoint that manufacturing such interface systems having multiple layers is expensive.
In addition to the need for improved interface systems is the need for improved heat sinks to be used therewith that are capable of more effectively and efficiently dissipating the heat transfer thereto. In this regard, most heat sinks in use, which are typically fabricated from extruded aluminum, are formed to have a base with a plurality of fins extending therefrom. The fins are equidistantly spaced from one another and are formed to have sufficient surface area to dissipate the heat into the surrounding air. In this respect, a fan is frequently used to assure adequate circulation of air over the fins, so as to maintain desirable heat dissipation therefrom.
Unfortunately, however, the number of fins and the spacing therebetween is limited by the aluminum extrusion process. As is well-known, fins spaced closer together than 0.2 inches tends to block natural convection air flow and cannot be optimized for use in forced convection. Additionally, conventional extrusion technology limits the amount of surface area, namely, the height of the fins of the heat sink, which further constrains heat removal. In this respect, it is well-known that the amount of surface area is proportional to the amount of heat that can be removed. Hence, a decrease in surface area thus translates into limited heat removal.
To partially address the aforementioned inadequacies with extruded aluminum heat sinks has been the introduction of folded-fin heat sinks. Such assemblies comprise a relatively thin base section and a set of fins folded into corrugated sections mounted thereon. The base section is typically formed to be either very thin to reduce mass or, alternatively, thicker to act as a heat spreader. The folded fins coupled to the base act as a heat-transfer area, allowing a stream of forced air to remove heat from the base. Currently, such folded-fin heat sinks offer the maximum potential in surface area and reduced weight. In this respect, thermal resistance as low as 0.40Exc2x0 C./W can be reached with folded-fin assemblies in forced-air cooling at 500 ft/min of air velocity. Moreover, in utilizing a corrugated piece of aluminum or copper, there is thus eliminated the restrictions otherwise faced in the extrusion process.
Notwithstanding the desirability of such folded-fin heat sinks, the same still suffer from the drawback of failing to achieve optimal heat transfer and dissipation insofar as current folded-fin heat sinks fail to achieve optimal heat transfer from the base to the folded-fin assembly coupled thereto. As such, the maximum amount of heat that could otherwise be dissipated by the assembly is not attained.
Accordingly, there is a need in the art for a thermal interface that provides greater thermal conductivity and greater electrical insulation than prior art interfaces. There is additionally a need in the art for such a thermal interface that is of low cost, easy to manufacture, and may be readily utilized with existing componentry requiring the integration of a thermal interface system. Moreover, there is a need in the art for an improved heat sink that is more effective and efficient at dissipating heat transferred thereto from an electronic component. There is further a need for such an improved heat sink that is particularly more effective in transferring heat from a given heat source to the fins or other apparatus by which the same is dissipated.
The present invention specifically addresses and alleviates the aforementioned deficiencies in the art. Specifically, the present invention is directed to an interface system for use with electronic componentry that has superior electrical insulation and thermal conductivity properties than prior art systems. In the preferred embodiment, the interface system of the present invention comprises the combination of a generally planar substrate, preferably being comprised of a non-conductive material having a high dielectric strength. The planar substrate defines two outwardly facing flatwise surfaces that are configured to mate with the interface surfaces formed on the electronic component and the interface surface formed on the heat dissipator or heat sink, on the other surface Each respective outwardly facing surface has formed thereon a layer of a thermally conductive compound having a high degree of thermal conductivity to thus further facilitate the transfer of heat. In a preferred embodiment, such compound is preferably formed to have selective phase-change properties whereby the composition exists in a solid phase at normal room temperature, but melts, and therefore assumes a liquid phase, when subjected to the elevated temperatures at which the electronic component usually operates.
The present invention further includes an improved heat sink that is more efficient and effective in dissipating heat transferred thereto via an electronic component. Specifically, such improved heat sink comprises the combination of a base plate attachable to a heat-dissipating component and a folded-fin assembly compressively attached thereto. In a preferred embodiment, the heat sink is provided with one or more pressure clips (or other fastener arrangement) detachably fastenable to the baseplate that apply a compressive force, via a pressure spreader engagable therewith, against the folded-fin assembly that causes the assembly to remain compressively bonded with the baseplate from which the heat to be dissipated is received. To further facilitate the transfer of heat from the baseplate to the folded-fin assembly, there is preferably provided upon the baseplate a layer of a thermally-conductive compound having selective phase-change properties (i.e., liquefies during the operational temperature of the electronic component coupled to the heat sink), to eliminate any air gaps or voids between the baseplate and folded-fin assembly that would otherwise impede the transfer of heat. Alternatively, to the extent a greater degree of electrical isolation is desired, a thermal interface having a high dielectric capability may be interposed between the baseplate and folded-fin assembly.
The present invention thus provides a thermal interface system that provides both electrical insulation and sufficient thermal conductivity to effectively facilitate the removal of heat therefrom more so than prior art interface systems.
The present invention further provides a thermal interface having electrical isolation capability that utilizes a minimal number of layers in the construction thereof.
Another object of the present invention is to provide a thermal interface that is relatively simple and inexpensive to manufacture compared to prior art interface systems, and may be readily and easily utilized in a wide variety of commercial applications.
Another object of the present invention is to provide an improved heat sink that is more effective and efficient at dissipating heat transferred thereto from an electronic component, and especially more so than conventional heat sinks formed from extruded aluminum.
Another object of the present invention is to provide an improved heat sink that is capable of more effectively transferring heat received thereby to the heat-dissipating component thereof than prior art heat sinks.
A still further object of the present invention is to provide an improved heat sink that is of simple construction, may be readily and easily fabricated from existing materials well-known to those skilled in the art, is relatively inexpensive, and may be readily and easily utilized in numerous commercial applications.

Heat sink and thermal interface having shielding to attenuate electromagnetic interference


Disclosed is a method and apparatus for dynamically varying the amount of time a hybrid access terminal operates on a first air interface protocol between instances of temporarily switching over to scan a second air interface protocol for broadcast information such as network operational parameters or page messages. The hybrid access terminal dynamically sets a minimum interval of operation on the first air interface protocol based on how long the access terminal has tended to be temporarily switched away to scan for broadcast information on the second air interface protocol. For example, as the switch-away time increases, the access terminal may increase the interval on the first air interface protocol, and as the switch-away time decreases, the access terminal may decrease the interval on the first air interface protocol.

In a typical cellular radio communications system (wireless communication system), an area is divided geographically into a number of coverage areas (namely, cells and cell sectors), each defined by a radio frequency (RF) radiation pattern from a respective base transceiver station (BTS) antenna. The base station antennae in the cells may then be coupled with a base station controller (BSC) (or radio network controller (RNC)), which may then be coupled with a telecommunications switch or gateway, such as a mobile switching center (MSC) or packet data serving node (PDSN) for instance. The switch or gateway may then be coupled with a transport network, such as the public switched telephone network (PSTN) or a packet-switched network (e.g., the Internet).
When an access terminal (such as a cellular telephone, pager, or appropriately equipped portable computer, for instance) is positioned in a coverage area, the access terminal communicates via an RF air interface with the BTS antenna of the coverage area. Consequently, a communication path can be established between the access terminal and the transport network, via the air interface, the BTS, the BSC and the switch or gateway.
As an access terminal moves between coverage areas of a wireless communication system, or when network conditions change or for other reasons, the access terminal may "hand off" from operating in one coverage area to operating in another coverage area. In a usual case, this handoff process is triggered by the access terminal monitoring the signal strength of signals that it is receiving in various available coverage areas, and the access terminal or the BSC determining when one or more threshold signal strength criteria are met. For instance, the access terminal may monitor signal strength in various available coverage areas and notify the BSC when a given coverage area has a signal strength that is sufficiently higher than the coverage area in which the access terminal is currently operating. The BSC may then direct the access terminal to hand off to that other coverage area.
In practice, communications over the air interface between a BTS (base station) and a access terminal will comply with a defined air interface protocol or "access technology." Numerous such protocols are well known in the art, and others will be developed in the future. Examples of existing protocols include CDMA (e.g., 1xRTT, 1xEV-DO), iDEN, TDMA, AMPS, GSM, GPRS, UMTS, EDGE, WiMAX (e.g., IEEE 802.16), LTE, microwave, satellite, MMDS, Wi-Fi (e.g., IEEE 802.11), and Bluetooth. Each protocol may define its own procedures for handoff between coverage areas and may define other procedures and parameters related to air interface communication, such as particular air interface transmission mechanisms (e.g., coding, frequency, etc.)
Furthermore, in some cases, more than one air interface protocol might be implemented in a given market area. For example, a given market area might provide both legacy CDMA 1xRTT coverage under a standard protocol such as EIA/TIA/IS-2000 Rel. 0, Rel. A or another version thereof (hereafter "an IS-2000 protocol") and also high data rate 1xEV-DO coverage according to a standard protocol such EIA/TIA/IS-856 Rel. 0, Rel. A, or another version thereof (hereafter "an IS-856 protocol"). In a system that provides two or more air interface protocols in a single area, a access terminal might not only hand off between coverage areas under a common air interface protocol (e.g., between IS-2000 sectors) but may also hand off between the different air interface protocols (e.g., between IS-2000 and IS-856) within a given physical location or when moving between locations. Handoff between different air interface protocols is known as "vertical" handoff.

Method and apparatus for dynamically varying interval on first air interface protocol based on switch-away time for scanning second air interface protocol


An apparatus and method for detecting defects in a wafer are provided. An optical part is disposed under an inspection stage and radiates infrared light. An image obtaining part detects the infrared light transmitted through the wafer to output an image signal. A conveying part conveys the image obtaining part or the inspection stage in a short side direction of a photographing region of a line sensor included in the image obtaining part, and outputs a pulse signal. A controller counts the pulse signal and outputs a photographing instruction signal controlling the image obtaining part to photograph the wafer whenever the wafer is conveyed in the short side direction of the photographing region of the line sensor toward the image obtaining part by a distance corresponding to the length of short sides of the photographing region. A defect detection part combines each image signal to generate an inspection image.

In general, a wafer is manufactured through a plurality of subdivided processes, and defects may be generated inside the wafer or on its surface during each process. Such defects may be classified into inherent defects such as cracks in a material itself, and external defects such as foreign substances attached to the wafer surface or contained therein. Defects generated during a process of manufacturing the wafer, depending on their positions and sizes, may result in the wafer having to be discarded. In particular, an air-pocket, a type of molding defect existing in an ingot, may be transferred to a bare wafer manufactured by slicing the ingot. In most cases, a wafer manufactured using a bare wafer having an air-pocket has to be discarded. Therefore, defects should be effectively detected at an appropriate time during the wafer manufacturing process.
One method of inspecting a wafer for defects is a reflective illumination method whereby light is radiated onto a wafer, reflected by the wafer, and detected using a line scan camera or an area camera. However, since this inspection method uses reflected light, a light source that emits with high linearity and intensity should be employed, and the illumination of a work space where the inspection apparatus is installed may have an effect on defect detection results. In addition, since the light source and the camera are disposed on the same space, the inspection apparatus may be quite large.
Another method of inspecting a wafer for defects is a transmissive illumination method whereby infrared radiation is modified according to characteristics of a wafer through which it is transmitted and detected using an infrared camera. An inspection apparatus using a transmissive illumination method is disclosed in U.S. Pat. No. 5,981,949.
FIG. 1 is a view of a conventional wafer defect inspection apparatus using a transmissive illumination method.
Referring to FIG. 1, the conventional wafer inspection apparatus includes a light source 10, a diffusion plate 14, an optical filter 13, a wafer fixing part 20, an infrared camera 22, a controller 28, a frame grabber 30, a computer 32, and a monitor 26.
The light source 10 is disposed opposite to one surface of the wafer 18 mounted on the wafer fixing part 20 to radiate light onto the wafer 18. The diffusion plate 14 is disposed between the light source 10 and the wafer 18 to uniformly distribute infrared light radiated from the light source 10. The optical filter 13 outputs only infrared wavelengths of the light output from the diffusion plate 14 to the wafer 18, or outputs only infrared wavelengths of the light output from the wafer 18 to the infrared camera 22. The infrared camera 22 is disposed opposite to the other side of the wafer 18 to detect the infrared light transmitted through the wafer 18 and output an image thereof. The controller 28 controls operation of the infrared camera 22, and selectively outputs an image input from the infrared camera 22 to the monitor 26 or the frame grabber 30. The frame grabber 30 digitizes the image input from the controller 28 and outputs the digitized image. The computer 32 analyzes the digitized image input from the frame grabber 30 to determine optical characteristics, defect density, and uniformity of the wafer.
The conventional wafer inspection apparatus having the above constitution can be manufactured to have a simple structure and a compact size, and a single wafer can be inspected within two minutes. However, the time consumed in inspecting a single wafer is much longer than when using an indirect illumination method, thus making it difficult to apply in an actual manufacturing process. In addition, since a plane array infrared camera capable of obtaining an image through a single photographing process and a diffusion plate having an optical transmissivity of 20%-60% are used, in order to obtain an image sufficient to detect defects in a wafer, a high-energy infrared light source should be used.

Apparatus and method for detecting defects in wafer using line sensor camera


The present invention relates to an integrated percussion power tool which contains a percussion mechanism and a lift assist mechanism to reduce the physical demands for its operation by facilitating the lifting and extracting of the percussion power tool. In general, the integrated percussion power tool is a T-shaped machine which has a vertical cylindrical body with two handles, two hand control levers cross the top, and a working tool and a lifting foot on the bottom for engaging with a working surface. The first hand lever is for controlling the operation of the percussion mechanism, whereas the second hand lever is for manipulating the operation of the lift assist mechanism. The percussion mechanism and the lift assist mechanism are both housed in the vertical cylindrical body of the integrated percussion power tool.

A portable percussion power tool such as a pneumatic jackhammer employs a linearly reciprocating piston-driven anvil which rapidly and repeatedly hammers on the end of a chisel bit and impels it into a working surface. Its effectiveness relies on the inertia of the mass of its body and gravity to bring the chisel bit back into contact with the working surface after each blow. As such, the percussion power tool tends to be very heavy, typically having a weight from about 60 to 100 pounds. During a routine operation, an operator is required to repetitively lift and reposition the heavy device for next operation. When working with a tool of such weight, the operator has to endure a great physical stress and is thus prevented from being able to operate the jackhammer for an extended period of time. Furthermore, the chisel bit is also often jammed into the material being worked and requires a great deal of effort to remove, which makes the operation even more physically demanding. As a consequence, it greatly reduces the productivity but also poses a great health-risk to its operators.
Several different types of lift assist devices have been developed to reduce these physical demands by facilitating the lifting and the extracting of the equipment. U.S. Pat. No. 2,622,562 to Longenecker discloses a detachable lift assist device for a percussion power tool, such as a pavement breaker. The lift assist device is a fluid actuated lifting jack which is controlled by a throttle valve with an operating lever adjacent to one of the hand grips of the percussion power tool. When the throttle valve is engaged, actuating media is admitted into the lifting jack and provides forces to lift the percussion power tool. When the throttle valve is disengaged, the actuating media pressure is released, but the piston of the lifting jack remains in contact with the working surface. There is no retracting mechanism provided for the piston of the lifting jack in the disclosure. However, the piston can be manually pushed back to a retracted position.
U.S. Pat. No. 2,776,653 to Eaton discloses an improvement in a pneumatic drill by attaching a pair of pneumatic lifting jacks with a substantially semicircular foot to engage with a working surface for lifting the pneumatic drill. A mechanism is also provided for retracting the lifting foot upon the return of the pneumatic drill to the working position.
U.S. Pat. No. 4,548,279 to Zaruba discloses a demolition tool with an extractor for freeing a jammed demolition tool. The extractor has a pneumatic cylinder with a lifting foot. There is no retracting mechanism provided for the piston in the disclosure. The lifting foot is constantly in contact with the working surface. A flow control valve is provided to regulate the lifting speed.
U.S. Pat. No. 4,986,370 to Johnson discloses a pneumatic lift attachment for a pneumatic jackhammer for applying an upward force to the jackhammer. The lift attachment is a cylinder with a lift foot. The body of the cylinder is enclosed within a support housing which has a lift plate with a guide hole and an adjustable chain for securing a pneumatic hammer to the lift plate. Once engaged, the lifting foot is in constant, contact with the working surface.
U.S. Pat. No. 6,050,345 to Jarvinen et al. discloses an ergonomic tool which includes a jackhammer and a lift assist mechanism. The lift assist mechanism contains a slidable frame with a lifting foot attached to the lower end and a piston attached to the upper end. The piston is directly connected to the upper body of the jackhammer and not movable. The frame which contains a rodless cylinder moves and provides a lifting force to raise the jackhammer.
More than a year ago, the present inventors disclosed a prototype of a lift assist device for a percussion power tool, such, as a pneumatic jackhammer. The lift assist device contains a double acting cylinder with a lifting foot and a commercial four-way directional control valve with five ports. The actuating cylinder and the directional control valve are from commercial sources and supplied as two separate parts. The direction control valve is mounted to the top end of the cylinder using a mounting bracket and the foot is mounted to the bottom end of the cylinder. The lift assist device is then secured to the upper body of the jackhammer using the same mounting bracket. By using a double acting cylinder, the lifting foot may be retracted by redirecting the flow of the compressed air from the upper chamber to the lower chamber to prevent damages to the lift assist device when the percussion power tool is in operation. One significant limitation of this prototype is that the lift assist device is heavy with an overall weight of over 20 pounds, which adds additional unnecessary physical burdens to the operator.
However, all these previous lift assist devices are designed as a separate unit to be attached to the body of a percussion power tool. One disadvantage of such design is that the lift assist device adds additional weight and transportation of such an assembly becomes problematic. One solution to reduce the overall weight of the assembly of the percussion power tool and the lift assist device is to integrate the lift assist device into the body of a percussion power tool. Accordingly, it is an object of the present invention to provide an integrated percussion power tool with a lift assist mechanism.

This patent is subject to a terminal disclaimer.


A method and system for detecting asymmetric utilizing lateral tower acceleration data may include: providing a lateral tower acceleration monitoring system; determining from the lateral tower acceleration monitoring system whether a lateral tower acceleration is above an acceleration limit; determining whether a rotor-mass imbalance condition exists; and determining whether the lateral tower acceleration coincides with icing on a rotor.

The present invention relates to ice accumulation occurring on the rotor blades of a wind turbine; and more particularly a method and system for detecting asymmetric icing.
Wind turbines are commonly installed in areas where the climatic conditions allow for ice accumulation (hereinafter icing). Icing on the rotor blades (hereinafter blades) of a wind turbine typically leads to several problems including a reduction in power output; and higher stresses on several components. Icing may be divided into two forms, symmetric (icing on all blades) and asymmetric, (icing on some blades). Asymmetric icing increases the wind turbine tower vibration, and increases the lateral tower acceleration. Asymmetric icing may also yield a rotor-mass imbalance leading to higher fatigue loads, and thus requiring more robust and expensive wind turbine components.
Current systems of detecting asymmetric icing typically require additional hardware such as sensors, anemometers, piezoelectric transducers, or the like. Moreover, wind turbine operators generally must purchase and install this additional hardware.
There are a few problems with the current systems and methods for addressing icing. The requirement of additional hardware increases the installation and operational costs of the wind turbine. Furthermore, for geographical areas having an average yearly temperature above freezing, the additional costs associated with detecting asymmetric icing may prohibit wind turbine operation.
For the foregoing reasons, there is a need for a method and system for detecting asymmetric icing utilizing existing wind turbine hardware. The method should not require additional hardware. Furthermore, the method should incorporate lateral tower acceleration data to detect asymmetric icing.

Method and system for utilizing lateral tower acceleration to detect asymmetric icing


A method of calculating the discrete cosine transform (DCT) of blocks of pixels of a picture includes the steps of defining first subdivision blocks called range blocks, having a fractional and scaleable size N/2i*N/2i, where i is an integer number, with respect to a maximum pre-defined size of N*N pixels of blocks of division of the picture, referred to as domain blocks, shiftable by intervals of N/2i pixels. The method also includes the step of calculating the DCT on 2i range blocks of a subdivision of a domain block of N*N pixels of the picture, in parallel.

The calculation of the discrete cosine transform (DCT) of a pixel matrix of a picture is a fundamental step in processing picture data. A division by a quantization matrix is performed on the results of the discrete cosine transform for reducing the amplitude of the DCT coefficients, as a precondition to data compression which occurs during a coding phase, according to a certain transfer protocol of video data to be transmitted or stored. Typically, the calculation of the discrete cosine transform is carried out on blocks or matrices of pixels, in which a whole picture is subdivided for processing purposes.
Increasing speed requisites of picture processing systems for storage and/or transmission, imposes the use of hardware architectures to speed up various processing steps among which, primarily, the step of discrete cosine transform calculation by blocks of pixels. Use of hardware processing imposes a pre-definition of few fundamental parameters, namely the dimensions of the blocks of pixels into which a picture is subdivided to meet processing requisites.
Such a pre-definition may represent a heavy constraint that limits the possibility of optimizing the processing system, for example a MPEG2 coder, or its adaptability to different conditions of use in terms of different performance requisites. It is also evident the enormous economic advantage in terms of reduction of costs of an integrated data processing system that may be programmed to calculate in parallel the DCT on several blocks of pixels of size selectable among a certain number of available sizes.

Method and scalable architecture for parallel calculation of the DCT of blocks of pixels of different sizes and compression through fractal coding


CMOS circuitry used to multiplex between data inputs suffers from high sensitivity to power supply noise, resulting in delay variations. By utilizing current controlled inverters in a multiplexer structure, power supply insensitivity can be achieved with either of two multiplexing methods. The first method places switches on the data inputs while the second places the switches on the analog bias voltages inherent to a current controlled inverter.

1. Field of the Invention
This invention relates to digital multiplexer circuits and particularly to noise insensitive multiplexer designs.
2. Description of Background
Before our invention there were many means by which the multiplexing of signals could occur. U.S. Pat. Nos. 5,598,115; 5,625,303; 5,646,558; 5,773,995 and patent application 2004/0008073 all show circuits in which transistor passgates are used to drive a common node. These designs suffer from high sensitivity to power supply noise perturbations, as the delay from input to output is directly proportional to the power supply value.

Power supply noise insensitive multiplexer

International Business Machines Corporation


An instrument for conducting nucleic acid amplification reactions in a disposable test device. The test device includes a first reaction chamber containing a first nucleic acid amplification reagent (e.g., primers and nucleotides) and a second reaction chamber either containing, or in fluid communication, with a second nucleic acid amplification reagent (e.g., an amplification enzyme such as RT). The instrument includes a support structure receiving the test device. A temperature control system maintains the first reaction chamber at a first elevated temperature but simultaneously maintains the second nucleic acid amplification reagent at a second temperature lower than the first temperature so as to preserve the second nucleic acid amplification reagent. An actuator operates on a fluid conduit in the test device to place the first and second reaction chambers in fluid communication with each other after a reaction has occurred in the first reaction chamber at the first temperature. A pneumatic system is also provided that assists in fluid transfer of a reaction solution from the first chamber to the second chamber.

A. Field of the Invention
This invention relates to the field of methods and devices for performing nucleic acid amplification reactions. More particularly, the invention relates to an automated instrument for performing nucleic acid amplification reactions.
B. Description of Related Art
Nucleic acid based amplification reactions are now widely used in research and clinical laboratories for the detection of genetic and infectious diseases. The currently known amplification schemes can be broadly grouped into two classes, based on whether, after an initial denaturing step (typically performed at a temperature of ≧65 degrees C.) for DNA amplifications or for RNA amplifications involving a high amount of initial secondary structure, the reactions are driven via a continuous cycling of the temperature between the denaturation temperature and a primer annealing and amplicon synthesis (or polymerase activity) temperature ("cycling reactions"), or whether the temperature is kept constant throughout the enzymatic amplification process ("isothermal reactions"). Typical cycling reactions are the Polymerase and Ligase Chain Reaction (PCR and LCR, respectively). Representative isothermal reaction schemes are NASBA (Nucleic Acid Sequence Based Amplification). Transcription Mediated Amplification (TMA), and Strand Displacement Amplification (SDA). In the isothermal reactions, after the initial denaturation step (if required), the reaction occurs at a constant temperature, typically a lower temperature at which the enzymatic amplification reaction is optimized.
Prior to the discovery of thermostable enzymes, methodologies that used temperature cycling were seriously hampered by the need for dispensing fresh polymerase into an amplification tube (such as a test tube) after each denaturation cycle, since the elevated temperature required for denaturation inactivated the polymerase during each cycle. A considerable simplification of the PCR assay procedure was achieved with the discovery of the thermostable Taq polymerase (from Thermophilus aquaticus). This improvement eliminated the need to open amplification tubes after each amplification cycle to add fresh enzyme. This led to the reduction of both the contamination risk and the enzyme-related costs. The introduction of thermostable enzymes has also allowed the relatively simple automation of the PCR technique. Furthermore, this new enzyme allowed for the implementation of simple disposable devices (such as a single tube) for use with temperature cycling equipment.
TMA requires the combined activities of at least two (2) enzymes for which no optimal thermostable variants have been described. For optimal primer annealing in the TMA reaction, an initial denaturation step (at a temperature of ≧65 degrees C.) is performed to remove secondary structure of the target. The reaction mix is then cooled down to a temperature of 42 degrees C. to allow primer annealing. This temperature is also the optimal reaction temperature for the combined activities of T7 RNA polymerase and Reverse Transcriptase (RT), which includes an endogenous RNase H activity or is alternatively provided by another reagent. The temperature is kept at 42 degrees C. throughout the following isothermal amplification reaction. The denaturation step, which precedes the amplification cycle, however forces the user to add the enzyme to the test tube after the cool down period in order to avoid inactivation of the enzymes. Therefore, the denaturation step needs to be performed separately from the amplification step.
In accordance with present practice, after adding the test or control sample or both to the amplification reagent mix (typically containing the nucleotides and the primers), the test tube is subject to temperatures ≧65 degrees C. and then cooled down to the amplification temperature of 42 degrees C. The enzyme is then added manually to start the amplification reaction. This step typically requires the opening of the amplification tube. The opening of the amplification tube to add the enzyme or the subsequent addition of an enzyme to an open tube is not only inconvenient, it also increases the contamination risk.
An alternative approach to amplification of a DNA sample is described in Corbett et al., U.S. Pat. No. 5,270,183. In this technique, a reaction mixture is injected into a stream of carrier fluid. The carrier fluid then passes through a plurality of temperature zones in which the polymerase chain reactions take place. The temperature of the different zones and the time elapsed aked for the carrier fluid to traverse the temperature zones is controlled such that three events occur: denaturation of the DNA strands, annealing of oligonucleotine primers to complemetary sequences in the DNA, and synthesis of the new DNA strands. A tube and associated temperature zones and pump means are provided to carry out the '183 patent process.
The present invention provides a nucleic amplification reaction system that substantially eliminates the risk of contamination, and provide a convenient, simple and easy to use approach for nucleic acid amplification reactions. The test devices and amplification station in accordance with the present invention achieves the integration of the denaturation step with the amplification step without the need for a manual enzyme transfer and without exposing the amplification chamber to the environment. The contamination risks from sample to sample contamination within the processing station are avoided since the amplification reaction chamber is sealed and not opened to introduce the patient sample to the enzyme. Contamination from environmental sources is avoided since the amplification reaction chamber remains sealed. The risk of contamination in nucleic acid amplification reactions is especially critical since large amounts of the amplification product are produced.

Nucleic acid amplification reaction station for disposable test devices


A latching mechanism for attachment to a boat trailer and for securely latching onto the U-bolt typically found on a boat bow includes an integral weldment providing a pair of oppositely-disposed side plates and a cooperating support plate positioned therebetween. Assembled to the side plates are a pair of alignment cones which help to guide and direct the bow of the boat and in particular the U-bolt into the latching mechanism. The support plate defines a receiving channel having a closed base and an open entrance. A pair of spring-biased latching jaws are pivotally attached to the support plate on opposite sides of the receiving channel and are normally positioned in a closed and latching condition. Each latching jaw includes a tip portion and the two tip portions are oriented so as to extend inwardly toward each other and across the open end of the receiving channel. As the U-bolt moves into the open end of the channel and pushes against the tip portions, the latching jaws spring open, allowing the U-bolt to position itself within the receiving channel. At this point the latching jaws close back and prevent the U-bolt from exiting the receiving channel. In order to free the U-bolt from the latching mechanism, a release member is provided which is manually pushed in between the two latching jaws to separate those jaws and allow removal of the U-bolt.

The present invention relates in general to latching mechanisms which are designed to securely connect or attach one object to another object, such as a boat to a boat trailer. More specifically the present invention relates to an automatic latching mechanism which is attached to a boat trailer and which securely receives the U-bolt which is fixed to the bow of a boat.
Boat trailers for transporting, launching, and retrieving fishing boats and pleasure boats are widely used by the boating public. While a variety of different winch and tow rope arrangements have been and may be employed, one commonly used element of such arrangements is an U-bolt or eyelet of some configuration which is fixed to the bow of the boat, typically on the centerline of the boat. Since the bow U-bolt is typically located in a similar position, independent of the particular boat style, it provides one aspect of some consistency between varying designs, styles, sizes, and makes of boats.
A review of earlier patents indicates that one disadvantage, as viewed by other designers, with a winch and tow rope arrangement is that at least two people are required to effectively retrieve and load the boat onto the trailer. One person is normally needed to connect the tow line to the boat and operate the winch. The other person is required to navigate and maintain the boat in alignment with the boat trailer. Since there are situations where two people are not always available to load a boat onto a boat trailer, it has been suggested that it would be an improvement to existing trailer designs with a winch and tow rope arrangement if an automatic latching mechanism could be provided which securely attaches to the U-bolt of the boat bow. While an automatic latching mechanism on the boat trailer would conceivably only require one individual to load the boat onto the boat trailer, as a practical matter you would prefer to have one individual handling the boat and a second individual handling the boat trailer and the vehicle towing the boat trailer. This is the most efficient approach. However, even with two individuals and even if a winch and tow rope arrangement is available, there is still a certain awkwardness to the currently practiced method. While one individual will stay with the trailer and tow vehicle, the individual directing the boat onto the trailer may be required to lean forward over the bow and hook the winch rope into the U-bolt. It would thus be an improvement to this procedure if an automatic latching mechanism could be provided.
Over the years certain designers have tried to provide improvements to the winch and tow rope arrangements, even suggesting elimination of those arrangements. One such earlier design effort involves the use of a latching mechanism with a locking pin. This type of design is represented by U.S. Pat. No. 3,989,267 which issued Nov. 2, 1976 to Robinson. In order to perform its intended function, the pin 27 of U.S. Pat. No. 3,989,267 must be initially pulled out, set in a cocked position, and biased by spring 33 against the edge of trigger plate 30. The associated spring compression and preload is a disadvantage in that this arrangement results in greater wear and a greater risk that the cocked arrangement will be jarred loose and released prior to connecting to the U-bolt. If the cocked arrangement is jarred loose and released, it would not be properly conditioned to receive and thereafter securely hold the U-bolt. Another concern with this design is the constant load on pin 27 when it is inserted through the U-bolt due to the weight of the boat.
While the '267 patent represents one trailer latch mechanism which does not involve a winch and tow rope arrangement, other similar design arrangements are represented by the following patents:
______________________________________ PATENT NO. PATENTEE ISSUE DATE ______________________________________ 3,938,829 Anderson Feb. 17, 1976 4,114,920 Boettcher Sep. 19, 1978 4,919,446 Higgins Apr. 24, 1990 ______________________________________
In evaluating the efficiency, reliability, cost and suitability of these other designs, it is important to keep in mind that reliability is of primary importance. The preferred latching mechanism is one which is normally unloaded and not in a highly spring-biased condition, one which operates in an automatic manner and is virtually fool-proof, one which is suitable for a wide range of boat shapes and sizes, and one which will securely anchor the boat to the trailer regardless of external conditions such as the angle of the trailer, size and weight of the boat, and the speed at which the boat ramps up onto the boat trailer. It is also preferred that the latching mechanism be designed such that it is extremely strong and any wear loading is minimal. The present invention provides each of these desirable features with a structure that is novel and unobvious.

Trailer-mounted latching mechanism for a boat


The invention relates to a method of monitoring the diameter of columns made in the ground by jet grouting. In the method, a measuring instrument is provided which is constituted by a tubular element of length substantially equal to the length of the column, said tubular element being fitted with a plurality of emission electrodes for creating an electric field, and with a plurality of measurement electrodes for measuring the resulting potential differences; a reference borehole is made in the ground; an axial borehole is made in the column to be tested; said measuring instrument is inserted in the borehole in said column and voltage measurements are performed at different depths; and said measurements are processed.

The present invention relates to a method of monitoring the diameter of columns made by the technique of injection under pressure known as xe2x80x9cjet groutingxe2x80x9d.
That technique consists in drilling a substantially cylindrical vertical hole in the ground by using a tool which delivers one or more jets of liquid under pressure enabling the ground installation to be prepared, with the hole obtained in this way being filled with a grout or analogous material so as to obtain a column which is molded in the borehole. That technique is described in particular in French patent No. 2 700 128.
It will be understood that during the operation of xe2x80x9cdrillingxe2x80x9d the hole by means of jets of liquid. Under pressure, the actual diameter of the borehole can vary significantly at successive depths, depending on the irregularities encountered in the subsoil, and in particular depending on the varying nature of the subsoil. As a result, the column obtained in this way can have significant relative differences of diameter depending on the depth under consideration. This problem is particularly severe when the depth of the column is large, which depth can be as much as 15 meters.
In some cases, a succession of adjacent columns are made so as to constitute a continuous barrier in the ground. It is clear that for that type of application, it is particularly important to be able to monitor the diameter of each column at different depths so as to be sure that the resulting barrier is continuous over its entire height.
At present there is no method of monitoring the diameter of columns made by jet grouting once they have been made. The technique used consists in making a test column whose top portion is unearthed so as to inspect its diameter visually. It will nevertheless be understood that that technique is relatively burdensome to use and in any event does not enable the diameter of the deeper portions of the column to be monitored.
Techniques are also known for making electrical measurements in order to determine the nature of the ground to a certain depth. In those techniques, a probe comprising a succession of regularly spaced apart electrodes is installed in a borehole, and the electrodes serve both as electrodes for measuring potential difference and as electrodes for injecting electricity into the ground.
The electrodes that inject electric current create electric field lines in a cylindrical volume surrounding the borehole, and the potential difference measurements performed at different depths in the borehole enable the characteristics of the ground to be determined at different depths by measuring a physical magnitude representative of the nature of the ground. This physical magnitude is constituted by the resistivity of the ground which, when determined, can be used to evaluate the nature of the ground. One such technique is described in detail in European patent No. 0 518 686, in the name of the Applicant.
An object of the present invention is to provide a method of monitoring the diameter of columns made in the ground by jet grouting, which method is not of the destructive type, and enables monitoring to be performed over the full height of the column made.
To achieve this object, the invention provides a method of monitoring the diameter of columns made in the ground by jet grouting, the method comprising the following steps:
a measuring instrument is provided that is constituted by a tubular element of length substantially equal to that of the column, said tubular element being fitted with a plurality of emission electrodes for creating an electric field and with a plurality of measurement electrodes for measuring potential differences created by said electric field, the electrodes being connected respectively to a source of electricity and to potential measuring means;
a reference borehole is made in the ground close to the location where the columns are made, and said measuring instrument is placed therein to take voltage measurements representative of the physical characteristics of the ground at different depths of the reference borehole so as to obtain a series of reference measurements for said depths;
an axial borehole is bored in the column to be tested, with the diameter of the axial borehole being much smaller than the diameter of said column;
said measuring instrument is inserted into the borehole made in said column and voltage measurements are made corresponding to different depths, thus obtaining actual measurements of voltages representative of a physical characteristic associated with said column and with the surrounding ground at different depths; and
said actual measurements are processed with reference to said reference measurements so as to obtain information representative of the diameter of said column at said different depths.
It will be understood that in this method, a reference borehole is made initially close to the location where the columns are to be made. Electrical measurements are taken in the reference borehole to obtain the reference physical magnitudes corresponding to different depths in the resulting borehole. The depth of the borehole naturally corresponds to the depth of the columns to be made.
In a second step, after the column has been made by jet grouting, an axial borehole is made in the resulting column and the same measuring apparatus is used to take measurements at different depths of the borehole, and thus of the column. The measurements taken in this way serve to obtain, for each depth, a physical parameter which is associated firstly with the diameter of the column at said depth and secondly with the surrounding portion of ground involved in the electric field that is created. By processing these measurements at each depth in association with the results obtained when performing reference measurements in the reference borehole, it is possible to deduce values which are inherent to the column on its own, and thus to deduce the diameter thereof or at least a relative magnitude representative of variations in the diameter thereof.
In a first implementation, while boring the axial borehole in said column, any inclination of said borehole relative to the vertical is measured at different depths so as to obtain a series of inclination measurements, and the information representative of column diameter for the different depths is corrected with the help of said inclination measurements.
In this improved implementation, it will be understood that account is taken of any inclination of the borehole made in the column prior to installing the measuring instrument. Determining inclination at different measurement depths enables the actual measurements to be corrected and thus enables diameter measurements to be corrected.
In a first implementation, said axial borehole is made when the material for making said column has not yet set.
In a second implementation, said axial borehole is made when the material constituting said column has set, at least partially.
Preferably, the physical magnitude is the resistivity of the ground or of the material constituting the column, and in order to process said actual measurements with the help of said reference measurements, special software is used for providing a three-dimensional interpretation of the reference resistivity measurements and of the actual resistivity measurements relating both to the shape of the column and to the surrounding ground.

Method of monitoring the diameter of columns made by injection


Methods of using control data to control a display of an image by a display device include encoding the control data as a line of video data, including the line of encoded control data in a video signal having a number of lines of image video data, transmitting the video signal to the display device, and using the control data to process the video signal and display the image.

The advent of computers, interactive electronic communication, the Internet, and other advances in the digital realm of consumer electronics have resulted in a great variety of display options for users of electronic devices such as personal computers, televisions, and digital projector systems. For example, various electronic images may be displayed by personal computer screens, television screens, projector screens, and other electronic display devices that are driven by a video signal source. An exemplary video signal source is a video graphics card.
It is often desirable for a single display device to be able to display an image in different display positions, sizes, and resolutions. Accordingly, the display device has to be capable of receiving and processing a variety of different video signals comprising video data corresponding to an image to be displayed. However, conventional video signal sources are not configured to include control data in a video signal specifying a particular frequency of the video signal, phase of the video signal, resolution of the image to be displayed, or other characteristic that corresponds to the video signal. Likewise, conventional display devices are not configured to process and decode such control data.
Consequently, display devices currently depend on the existence of characteristic data included in the video data itself to determine the display characteristics of a particular image that is to be displayed. The absence of control data in a video signal specific to the particular video signal often results in the misinterpretation of video data and degradation of video quality.

Methods and systems for using control data to control a display of an image by a display device

Hewlett-Packard Development Company, L.P.


A universal housing body for a refrigeration expansion device including a movable orifice piston. The body is adapted for interchangeable use with a piston of a first variety having a radial boss portion extending along a first axial distance, L.sub.1, from a forward boss end having an annular sealing surface of a first maximum sealing diameter, d.sub.max1, to a rearward boss end, and a piston of a second variety having a radial boss portion and an annular seal member having a forward surface defining with a rearward end of the boss portion a second axial distance, L.sub.2, therebetween greater than the first axial distance L.sub.1, and having a second minimum sealing diameter, d.sub.min2, greater than d.sub.min1 and less than d.sub.max1. The housing body has an internal fluid passageway extending from a forward end to a rearward end which couplable with a flange end of an associated adapter. An annular valve seat, having an inner diametric extent, d.sub.i, intermediate d.sub.min2 and d.sub.max1, is defined within the passageway such that a stop surface of the adapter is positionable within the passageway a spaced-apart distance from the valve seat to define a third axial distance, L.sub.3, greater than L.sub.2. The passageway is configured to receive the piston for movement between a forward and a rearward piston position, whereby in the forward position the sealing surface of the first variety piston and the forward surface of the second variety piston is disposed in an abutting, fluid-tight sealing engagement with the valve seal.

The present invention relates broadly to orifice piston expansion devices for metering the flow of a refrigerant along two or more fluid flow paths within a refrigeration system such as between the condenser and evaporator coils of a heat pump or other reversible refrigeration cycle, and more particularly to a universal body for such device which is adapted to be interchangeable with existing pistons of a 3- or 5-fluted, gasketed variety, or of a double headed variety.
Air conditioning and other refrigeration systems are operated in a thermodynamic cycle which conventionally employs in series, as is shown at 10 in FIG. 1, a compressor, 12, a first heat exchanger or condenser, 14, an expansion function, represented at 16, and a second heat exchanger or evaporator, 18, all of which are arranged in a closed-loop circuit. Within such circuit 10, a refrigerant medium is cycled therethrough for its alternate conversion from a partially liquid to a partially gaseous state effecting a concomitant loss of heat.
When operated in a conventional cooling mode, energy is supplied into the thermodynamic cycle via the compressor 12 which is operated as having a low pressure inlet or suction side, 20, and a high pressure outlet or discharge side, 22. Within the compressor, the refrigerant is compressed and super-heated to exit the outlet side 22 thereof at a relatively high pressure. The refrigerant next is passed through the first heat exchanger 14 wherein a heat transfer is effected with a lower temperature fluid to remove the heat of compression from the refrigerant for its further cooling. From the first heat exchanger 14, the flow of the refrigerant, which is now in a liquefied and pressurized state, is regulated by the expansion function 16 and then is passed into the second heat exchanger 18. The refrigerant within the second heat exchanger 18 is volumetrically expanded with a state change from a high to a low pressure liquid, and subsequently a phase change to a low pressure gas. The specific and latent heats associated with the state and phase changes of the refrigerant effect the cooling of the area surrounding the second heat exchanger 18 or, with forced convective systems, of a higher temperature cooling medium such as air which is circulated in a heat transfer relationship with the heat exchanger. From the second heat exchanger 18, the refrigerant, now in a relatively low pressure gaseous phase, is returned to the suction side 20 of the compressor 12 wherein it is again compressed and thereafter cooled for the repetition of the cycle.
However, and as is detailed in U.S. Pat. Nos. 3,992,898 and 5,341,656, refrigeration systems of the above-described type also may be operated in an alternate thermodynamic or "heat pump" cycle to additionally heat the working environment. When operated in such mode, the duty of the two heat exchangers typically is reversed thermodynamically by physically reversing the direction of the flow of refrigerant through the system. In this regard, and as is shown at 30 in FIG. 1, a multi-position valve may be coupled in fluid communication with the suction and discharge sides of the compressor to selectively connect the heat exchangers to alternate sides of the compressor such that the first heat exchanger may be operated in a cooling or evaporator mode, with the second heat exchanger being operated in a heating or condenser mode.
As will be appreciated, to complete the thermodynamic reversal of the cycle, the refrigerant within circuit 10 must be throttled in the opposite direction through the expansion device. Therefore, the expansion function of such circuits conventionally may employ a double expansion device arrangement wherein a pair of expansion devices, referenced in FIG. 1 at 16a-b, are positioned in opposition within the supply line, 32, extending between heat exchangers 14 and 18. That is, devices 16a-b are arranged to throttle refrigerant in opposite directions. Expansion devices, which encompass capillary tubes, thermostatic expansions valves, and orifice piston-operated check valves, are further described in U.S. Pat. Nos. 5,695,225; 5,564,754; 5,553,902; 5,341,656; 5,131,695; 4,674,673; 4,643,222; 3,992,898; 3,877,248; 3,745,787; 3,120,743; and D341,409. Further, it is common practice to distribute the refrigerant discharged from each of the expansion devices 16 into a plurality of different circuit tubes, one of which is referenced at 34a for device 16a, and at 34b for device 16b, each of which is connected to a different section of the corresponding heat exchanger coil.
As is detailed in U.S. Pat. Nos. 3,992,898 and 5,341,656, a representative orifice piston expansion device of a "doubled headed" piston variety comprises an, elongate housing including a generally cylindrical internal chamber which extends intermediate a forward and a rearward end. The forward end terminates at axially rearwardly-facing raised ring which defines a generally annular, flat seating surface. The second end, in turn, terminates at a generally annular stop surface which may be presented from the leading edge of the forward or flange end of a union-type adapter. The other, rearward end of the adapter may be configured for a sweat or other connection with the interconnecting supply line which couples the paired expansion devices. Accordingly, in the circuit arrangement illustrated in FIG. 1, the forward chamber end may be coupled in fluid communication with the corresponding coil, with the rearward chamber end being coupled in fluid communication with the other expansion device.
A free-floating piston is received within the housing chamber to be slidably movable responsive to the direction of fluid flow from a first position disposed at the forward end of the chamber, to a second position disposed at the rearward end of the chamber. The piston, which extends intermediate truncated frusto-conical first end disposed confronting the forward chamber end and a truncated frusto-conical second end disposed confronting the rearward chamber end, is specially constructed as having a centrally-disposed, axial throughbore. The throughbore functions as a metering orifice to throttle refrigerant flowing into the corresponding coil. The piston further is formed a having an enlarged diameter boss portion extending intermediate the first and second ends thereof. The boss portion has a forward end defining a generally annular sealing surface configured for an abutting, fluid-tight engagement with the seating surface of the forward chamber end, and a rearward end. The boss portion is further configured to define a plurality of spaced-apart fins, each having a pair of opposing lateral surfaces and extending radially-outwardly from the boss portion. Each of the fins further extends axially along the boss portion from a forward end to a rearward end which is abuttingly engagable with the stop surface disposed at the rearward chamber end for delimiting the travel of the piston in the rearward direction. The lateral surfaces of the fins each defines a peripheral fluid passageway with an opposing lateral surface of an adjacent fin and the interior surface of the chamber.
In operation, with refrigerant flowing in a forward direction through the device, the piston is advanced responsive to fluid pressure to a first position wherein the boss seating surface is disposed in abutting, fluid-tight contact with the chamber seating surface. With the piston being disposed in such first position, the entirety of the refrigerant flow is throttled through the metering orifice. When the refrigerant flow is reversed, the piston is advanced responsive to reverse fluid pressure to a second position wherein the rearward ends of the fins are disposed in an abutting engagement with the chamber stop surface. With the piston being disposed in such first position, a lower pressure drop refrigerant flow is vented through the peripheral passageways.
Representative orifice piston expansion devices of a gasketed piston variety are detailed in U.S. Pat. Nos. 5,695,225; 5,564,754; and 4,643,222. Such devices operate similarly to the double headed piston devices described hereinbefore, with the exception that in the first or forward position of the piston, the fluid tight seal between the piston forward end and the chamber seating surface is effected by way of a compressible seal ring. In this regard, an annular groove or gland is integrally-formed about the forward end of the piston. The gland is configured to receive an o-ring, rectangular cross-section, or other gasket seal which may be formed of a fluoropolymer material such as polytetrafluoroethylene (PTFE) or a synthetic rubber material such as a neoprene. The seal is mounted within the gland such that a forwardly-presented axial surface thereof defines the sealing surface of the piston for abutting contact with the chamber seating surface. Gasketed piston are commercially provided as having either 3 or 5 fins and a to define a corresponding number of peripheral passageways or "fluted" channels.
Orifice pistons of the above-described double headed and gasketed varieties are manufactured commercially by the Byron Manufacturing Division of Parker-Hannifin Corporation (Siloam Springs, Ariz.), by Chatleff Controls, Inc. (Buda, Tex.), and by Spinco Metal Products, Inc. (Newark, N.J.). Refrigeration system manufacturers include Carrier Corporation (Syracuse, N.Y.), Rheem Manufacturing Co. (Fort Smith, Ariz.), and Trane Co. (La Crosse, Wis).
With respect to component manufacturers, the type and configuration of the expansion device, whether as original equipment or for replacement parts, typically are specified by the systems manufacturer. Accordingly, component manufacturers and their distributors heretofore had to maintain stocks of different device varieties to satisfy customer requirements. Particularly with respect to expansion devices of the orifice piston variety, however, the need to maintain separate stocks of housing body components for accommodating the different varieties of pistons such as double headed and gasketed varieties represented a significant inventory expense. That is, it is known that body styles adapted for use with fluted pistons are not functional with pistons of a double headed construction, and vice versa.
Moreover, the forward end of the housing body typically is configured to receive a plurality of circuit tubes for connection to the associated coil. These tubes typically are brazed or otherwise welded to the coil, which then is supplied with the housing body as an integral unit. At least two separate stocks of these coil and body units therefore had to be maintained depending upon whether the particular application involved a device utilizing a gasketed or a double headed piston design.
In view of the foregoing, it is apparent that continued improvements in expansion devices for heat pump and other refrigeration circuits would be well-received by industry. A preferred orifice piston device construction would decrease inventory costs and the need to maintain separate body designs for different types of pistons while continuing to maintain proper operation of the refrigeration system.

Universal housing body for an expansion device having a movable orifice piston for metering refrigerant flow


A magnetic disk drive includes a base which supports a head stack assembly having a coil portion, a flex circuit cable having a grounding portion, and a flex clamp and in which a voice coil motor (VCM) is formed from the coil portion's interaction with upper and lower VCM plates that carry at least one permanent magnet. The disk drive includes a Z-shaped grounding portion which wraps around one end of the flex clamp and permits a single screw to secure that end of the flex clamp to the base and simultaneously make grounding contact with the grounding portion and an elongated protrusion extending from one of the VCM plates that is adjacent to the flex clamp to hold that end of the flex clamp against the base when the VCM plates are fastened to the base.

1. Field of the Invention
The present invention relates to a disk drive and more particularly to a magnetic disk drive having a flex clamp with an integrated VCM plate connection, a single-sided flex circuit cable having a Z-shaped grounding portion, or both.
2. Description of the Prior Art and Related Information
A typical hard disk drive includes a head disk assembly (HDA) and a printed circuit board assembly (PCBA). The HDA includes an enclosure having a base and cover, at least one magnetic disk (disk), a spindle motor for rotating the disk, and a head stack assembly (HSA) that includes a transducer head (head) for reading and writing data.
The HSA is controllably positioned by a servo system in order to read or write information from or to particular tracks on the disk. The typical HSA includes:(1) an actuator assembly that moves in response to the servo control system; (2) a head gimbal assembly (HGA) that extends from the actuator assembly and biases the head towards the disk; (3) a flex circuit cable for carrying read/write signals and a ground line to and from the head; (4) a "flex clamp" for clamping a connector end of the flex circuit cable to a connector port on the base; and (5) a ground connection to the base at the connector end of the flex circuit cable.
As to the actuator assembly, the industry presently prefers a "rotary" or "swing-type" actuator assembly which conventionally comprises an actuator body that rotates on a pivot assembly between limited positions, a coil portion that extends from one side of the actuator body and interacts with one or more permanent magnets held by "VCM plates" to form a voice coil motor, and an actuator arm that extends from an opposite side of the actuator body to support the HGA.
As to the HGA, a typical HGA includes a load beam, a gimbal, and a head or slider. The load beam has a spring function which provides a "gram load" biasing force and a hinge function which permits the head to follow the surface contour of the spinning disk. The load beam has an actuator end that connects to the actuator arm and a gimbal end that connects to the gimbal which carries the head and transmits the gram load biasing force to the head to "load" the head against the disk. A rapidly spinning disk develops a laminar air flow above its surface that lifts the head away from the disk in opposition to the gram load biasing force. The head is said to be "flying" over the disk when in this state.
With reference to FIG. 1, a prior art magnetic hard disk drive, a portion of which is shown, requires five screws 801-805 and five corresponding threaded holes 841-845 in the base 840 to attach voice coil motor (VCM) plates 850 and 860, a flex circuit cable 830, and a flex clamp 820 to the base. Two screws 802, 803 secure the VCM plates 850, 860 to the base 840 via corresponding aperture pairs (852;862), (853;863), and threaded holes 842, 843. The lower VCM plate 860 includes a permanent magnet 864. Two screws 801, 804 secure the flex clamp 820 and flex circuit cable 830 to the base 840 via corresponding aperture pairs (821;831), (824;834) and threaded holes 841, 844. One individual screw 805 connects a metal grounding contact 837 of the flex circuit cable 830 to the base 840 via an aperture 835 and threaded hole 845.
However, using screws presents some potential drawbacks such as:
the cost of the screws; PA1 the time and cost required for positioning and driving the screws; PA1 the time and cost of forming threaded screw holes in the base to receive the screws; PA1 the environmental leak paths that may be caused by the screw holes in the base; and PA1 the particulate contamination that may be generated by fastening each screw to a corresponding screw hole.
Accordingly, there is a need for a magnetic disk drive that reduces the number of screws needed to secure the VCM plates, flex clamp, and flex circuit cable including the ground connection to the base.

Magnetic disk drive having a VCM plate which includes an elongated protrusion for securing a flex clamp to the base