A shower system comprises a support, a handheld sprayer, a flexible conduit, and a weight. The support is configured to be coupled in a shower environment. The handheld sprayer is disposed below the support. The flexible conduit is coupled to the handheld sprayer, and extends through the support. The weight is coupled to the flexible conduit opposite the handheld sprayer. The weight is configured to bias the handheld sprayer to a first position in the shower environment.

The present disclosure relates generally to shower systems. More specifically, the present disclosure relates to a shower system including a shower column with a retractable conduit system, a height-adjustable handheld sprayer and associated accessories, and a control system that allows for synchronization of music and light with the discharge of water from the handheld sprayer and other water delivery devices in a shower environment.


A system and method which implement a memory component of an integrated circuit as multiple, relatively small sub-arrays of memory to enable great flexibility in organizing memory within the integrated circuit are provided. In a preferred embodiment, the memory component of an integrated circuit is implemented as multiple, relatively small sub-arrays of memory, which enable a designer great flexibility in arranging such sub-arrays within an integrated circuit. Also, in a preferred embodiment, the memory component of an integrated circuit is implemented as multiple memory sub-arrays that are each independent. For example, in a preferred embodiment, each memory sub-array comprises its own decode circuitry for decoding memory addresses that are being requested to be accessed by an instruction, and each memory sub-array comprises its own I/O circuitry. In one implementation of a preferred embodiment, each of the independent memory sub-arrays implemented in an integrated circuit comprises no more than approximately five percent of the total memory implemented on the integrated circuit. In another implementation, each of the independent memory sub-arrays on an integrated circuit is no larger than approximately the average size of other non-memory components implemented on the integrated circuit. Additionally, in further implementation, the memory component of an integrated circuit comprises at least a 20 independent memory sub-arrays. Therefore, in a preferred embodiment, each independent sub-array is relatively small in size to enable great flexibility in organizing the memory on an integrated circuit. Furthermore, because each sub-array is independent, greater flexibility is available in repairing defects through redundancy.

This invention relates in general to memory architecture, and in particular to a flexible memory architecture implementation that can be easily adapted in response to compositional changes in the die of a chip.
Computer systems may employ a multi-level hierarchy of memory, with relatively fast, expensive but limited-capacity memory at the highest level of the hierarchy and proceeding to relatively slower, lower cost but higher-capacity memory at the lowest level of the hierarchy. The hierarchy may include a relatively small, fast memory called a cache, either physically integrated within a processor or mounted physically close to the processor for speed. The computer system may employ separate instruction caches (xe2x80x9cI-cachesxe2x80x9d) and data caches (xe2x80x9cD-cachesxe2x80x9d). In addition, the computer system may use multiple levels of caches. The use of a cache is generally transparent to a computer program at the instruction level and can thus be added to a computer architecture without changing the instruction set or requiring modification to existing programs.
Turning to FIG. 1, an integrated circuit (chip) design of the prior art for a microprocessor is shown. As shown in FIG. 1, the design for chip 100 includes a non-memory block, shown as CPU core 40, which may include such components as an ALU for integer execution, a floating point execution unit, and lower level caches (e.g., level 1 cache), as well as other various components. Therefore, as used herein a non-memory block may refer to a non-memory portion of an integrated circuit, such as the CPU core of a microprocessor chip. Furthermore, such a non-memory block may comprise several smaller, non-memory components therein, such as an ALU, floating point execution unit, and other non-memory components of a microprocessor chip. As processor speeds increase and greater performance is required for processors, it becomes increasingly important for larger caches to be implemented for a processor. As described above, cache memory is typically capable of being accessed by a processor very quickly. Thus, the more data contained in cache, the more instructions a processor can satisfy quickly by accessing the fast cache. That is, generally, the larger the cache implemented for a processor, the better the performance of such processor. Therefore, processor chips of the prior art commonly implement large cache structures. For example, as shown in FIG. 1, a higher level memory (e.g., level 2 cache) is implemented on the processor chip in memory blocks 10, 20, and 30. It is common in prior art designs for such additional memory to consume half (or even more) of the surface area of the die for a chip.
In memory architecture (or memory organization) of the prior art, memory blocks, such as memory blocks 10, 20, and 30, are typically implemented in relatively large, rectangular (or square) blocks. For example, memory blocks are commonly implemented having 256 by 256 memory cells, 512 by 512 memory cells, or 1024 by 1024 memory cells. Such memory blocks of the prior art are typically limited to being rectangular blocks. Each of the blocks 10, 20, and 30 typically have an independent decode and input/output (I/O) circuits. For example, block 10 may have a decode circuitry 12 and I/O circuitry 13 that is 10 utilized for the entire memory block 10. That is, a common decode circuitry 12 and I/O circuitry 13 is typically utilized for the large memory block 10.
In integrated circuit designs of the prior art, a large rectangular block of memory, such as memory block 10, 20, or 30 of FIG. 1, typically comprises approximately 10 to 50 percent of the total memory implemented within the integrated circuit. Therefore, each block of memory typically provides a relatively large percentage of the total memory implemented in an integrated circuit. Also, because of the relatively large size and inflexible shape of prior art memory blocks, a relatively small number of blocks are typically implemented within an integrated circuit 100 of the prior art. For example, in prior art designs, typically no more than 10 memory blocks are implemented within an integrated circuit. Moreover, the memory blocks implemented in integrated circuits that comprise non-memory components are typically larger in size than most of the non-memory components implemented within such integrated circuit. For example, in a microprocessor chip 100, memory blocks 10, 20, and 30 are typically larger than most of the non-memory components contained within the CPU core 40, such as the ALU, floating point execution unit, etcetera.
Because the memory blocks 10, 20, and 30 of the prior art are typically implemented only as relatively large, rectangular blocks of memory, the organization of such memory within the chip 100 is very inflexible. For example, suppose in developing the core 40 for chip 100 a component, shown as component 42, needs to expand in size, thus requiring such component 42 to consume more surface space. For example, suppose that in designing component 42, it had to expand in size, in the manner illustrated in FIG. 1, in order to achieve its performance target. As shown in FIG. 1, it may be necessary for component 42 to expand such that it violates the boundary of rectangular cache block 10. Such a violation of cache block 10 is extremely problematic in prior art designs because it is very difficult to redesign prior art cache block 10 around the expanding component 42. For example, it is very difficult to redesign cache block 10 such that its upper, lefthand corner is cut out to make room for the expanding component 42. Therefore, such a redesign of cache block 10 would typically be very complex and time consuming, and therefore presents a large cost obstacle in designing the cache block 10 around the changing composition of the chip, as needed. For example, the large arrays of the prior art depend on their rectangular structure to share drivers and decoders.
Because of the great difficulty involved in redesigning such prior art cache block 10 to various shapes and sizes to respond to the changing composition of a chip (e.g., the expansion of component 42), designers typically respond to such changes in composition by moving (or relocating) an entire memory block within the chip. So, for example, in response to the changing size of component 42, which would otherwise violate the boundary of cache block 10, a designer of the prior art chip 100 would typically attempt to relocate the entire cache block 10 to a new location on chip 100. Often, such a relocation of the large, rectangular cache block 10 results in an undesirably large amount of white space (i.e., unused surface space of a chip) on the die. Additionally, sufficiently large blocks of space may not be available on the surface of chip 100 in which to relocate such a large rectangular block of cache. Thus, a smaller overall amount of cache memory may have to be implemented within chip 100 because sufficient large blocks of space are not available for implementing one or more of the large rectangular blocks 10, 20, and 30. For example, because the memory block 10 is likely much larger than the non-memory component 42, it is difficult to rearrange the memory block 10 around the expanding non-memory component 42 in a desirable manner (e.g., that does not result in a large amount of white space on the chip 100.) Therefore, organizing memory blocks within a chip of the prior art is typically a very difficult and complex task because of the inflexibility of the large, rectangular blocks commonly implemented in such prior art designs. That is, the large, rectangular blocks of memory typically implemented in prior art designs are very inflexible and result in great difficulty in reorganizing such memory blocks in response to changes in the composition of a chip.
In memory architecture of the prior art, memory blocks, such as blocks 10, 20, and 30 of FIG. 1, are commonly implemented with redundancy. For example, each memory block 10, 20, and 30, may each comprise smaller sub-blocks of memory therein. Also, each memory block 10, 20, and 30 may include a redundant sub-block therein, such as redundant sub-blocks 11, 21, and 31. It is common in manufacturing (or xe2x80x9cfabricatingxe2x80x9d) memory blocks within a chip that a defect may occur within a portion of a memory block. That is, a portion of a memory block may not allow for the proper storage and/or retrieval of data. Accordingly, redundant sub-blocks are typically implemented within such memory blocks, which can be used to effectively replace a defective sub-block of memory within the chip. For example, redundant sub-block 11 may be utilized to replace a defective sub-block of memory within the large memory block 10. Likewise, redundant sub-blocks 21 and 31 may each be utilized to replace defective sub-blocks within memory blocks 20 and 30, respectively.
Each sub-block of memory may typically be referred to as a xe2x80x9ccolumnxe2x80x9d of memory. However, such a xe2x80x9ccolumnxe2x80x9d of memory may actually comprise multiple columns and rows of memory cells. As shown in FIG. 1, a redundant sub-block (or column) is typically utilized to repair a defective column within a memory block. Accordingly, defective columns may be repaired by re-routing data from a defective column to the redundant column for a block of memory. However, in typical prior art designs implementing such column redundancy, defects that exist in xe2x80x9crowsxe2x80x9d of a memory block may not be repairable by a redundant column. Moreover, a redundant sub-block (e.g., redundant column) typically does not allow for repairing defects in the memory block""s decoder circuitry or I/O circuitry. Thus, some defects that may occur within a memory block are not capable of being repaired with a redundant sub-block of a prior art design. Therefore, prior art redundancy implementations typically allow little flexibility in repairing defects of a memory block.
In view of the above, a desire exists for a memory architecture that provides flexibility in how the memory may be organized within an integrated circuit. That is, a desire exists for a memory architecture that provides sufficient flexibility to enable designers to easily organize the memory component of an integrated circuit around other components of the integrated circuit in a desirable manner. A further desire exists for a memory architecture that provides greater flexibility in repairing defects within the memory component of an integrated circuit. That is, a desire exists for a memory architecture that enables a greater number of defects to be repairable through redundancy within the memory component of an integrated circuit.
These and other objects, features and technical advantages are achieved by a system and method which implement a memory component of an integrated circuit as multiple, relatively small sub-arrays of memory. In a preferred embodiment, the memory component of an integrated circuit is implemented as multiple, relatively small sub-arrays of memory, which enable a designer great flexibility in arranging such sub-arrays within an integrated circuit. That is, the small sub-arrays of memory enable a designer to easily arrange the memory component of an integrated circuit around the non-memory components of such integrated circuit in a desirable manner. Thus, a designer may arrange the sub-arrays of memory around the non-memory components of an integrated circuit such that the non-memory components do not violate the boundary of the memory component. Further, a designer may arrange the sub-arrays of memory in a manner that minimizes the amount of white space on an integrated circuit. Alternatively, a designer may arrange the sub-arrays of memory in a manner that provides a desired amount of white space strategically positioned within an integrated circuit to provide margin around portions of the integrated circuit that have uncertain dimensions early in the design stages.
In a preferred embodiment, the memory component of an integrated circuit is implemented as multiple memory sub-arrays that are each independent. For example, in a preferred embodiment, each memory sub-array comprises its own decode circuitry for decoding memory addresses that are being requested to be accessed by an instruction, and each memory sub-array comprises its own I/O circuitry. Thus, in a preferred embodiment, each memory sub-array is physically and electrically independent of the other memory sub-arrays.
In one implementation of a preferred embodiment, each of the independent memory sub-arrays implemented in an integrated circuit comprises no more than approximately 5 percent of the total memory implemented on the integrated circuit. Most preferably, each of the independent memory sub-arrays implemented in an integrated circuit comprises approximately 1 percent of the total memory implemented on the integrated circuit. In another implementation of a preferred embodiment, each of the independent memory sub-arrays on an integrated circuit is no larger than approximately the average size of other non-memory components implemented on the integrated circuit. Therefore, in a preferred embodiment, each independent sub-array is relatively small in size to enable great flexibility in organizing the memory on an integrated circuit. Additionally, in a preferred embodiment, the memory component of an integrated circuit comprises at least 20 independent memory sub-arrays. More preferably, the memory component of an integrated circuit comprises at least 30 independent memory sub-arrays, and even more preferably, the memory component of an integrated circuit comprises at least 50 independent sub-arrays. Additionally, in a most preferred embodiment, the memory component of an integrated circuit comprises approximately 100 independent sub-arrays. In a most preferred embodiment, the integrated circuit comprises a processor and the memory component of the integrated circuit comprises a cache for the processor, and most preferably such memory component comprises at least 1 megabyte of cache memory for the processor.
As discussed above, in a preferred embodiment, the memory component of an integrated circuit is implemented as multiple, small sub-arrays, which enable great flexibility in organizing the memory component within an integrated circuit. As also discussed above, in a preferred embodiment, each sub-array is implemented as an independent, stand-alone array of memory. As a result, such independent sub-arrays of memory may be implemented as redundant sub-arrays that are capable of effectively repairing any defect within another sub-array. That is, redundant sub-arrays can be implemented within the memory component of an integrated circuit that are capable of replacing a defective sub-array (e.g., by rerouting data from the defective sub-array to the redundant sub-array). Because the entire defective sub-array is replaceable with a redundant sub-array, a preferred embodiment provides great flexibility in repairing any defect that is detected within a memory sub-array.
It should be appreciated that a technical advantage of one aspect of the present invention is that a flexible memory architecture is provided. Accordingly, a memory architecture of a preferred embodiment allows a designer great flexibility in organizing a memory component of an integrated circuit. For example, a memory architecture of a preferred embodiment allows a designer to readily respond to compositional changes within an integrated circuit by easily reorganizing the memory component of such integrated circuit. A further technical advantage of one aspect of the present invention is that the memory component of an integrated circuit may be organized in an optimum manner. For example, the memory component of an integrated circuit may be organized in a manner that minimizes the amount of white space within the integrated circuit (e.g., by arranging sub-arrays of memory on substantially all of the available white space of a chip). As another example, the memory component of an integrated may be organized in a manner that provides a desired amount of white space positioned strategically within the integrated circuit during the design phase. It should be recognized that in general, a designer""s goal is to minimize the amount of white space present in an integrated circuit at the end of the design phase. However, during the design phase it may be helpful to budget white space within the integrated circuit to be used as margin when other components (e.g., the CPU core) within the circuit grow, as they often do throughout the actual design phase. Yet a further technical advantage of one aspect of the present invention is that great flexibility is available in repairing defects within the memory component of an integrated circuit. That is, because the entire defective sub-array is replaceable with a redundant sub-array in a preferred embodiment, such a preferred embodiment provides great flexibility in repairing any defect that is detected within a memory sub-array.
The foregoing has outlined rather broadly the features and technical advantages of the present invention in order that the detailed description of the invention that follows may be better understood. Additional features and advantages of the invention will be described hereinafter which form the subject of the claims of the invention. It should be appreciated by those skilled in the art that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures for carrying out the same purposes of the present invention. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the invention as set forth in the appended claims.

Flexible cache architecture using modular arrays


Provided are a method of deriving cell quality and a device supporting the method. According to an embodiment of the present invention, the method includes: detecting reference signals in a first period; detecting that a specific reference signal among the reference signals is not detected in a second period; and considering that a quality of the specific reference signal which is not detected in the second period as a quality of the specific reference signal measured in the first period.

Efforts have been made to develop an improved 5th-generation (5G) communication system or a pre-5G communication system in order to satisfy a growing demand on radio data traffic after commercialization of a 4th-generation (4G) communication system. A standardization act for a 5G mobile communication standard work has been formally started in 3GPP, and there is ongoing discussion in a standardization working group under a tentative name of a new radio access (NR).
Meanwhile, an upper layer protocol defines a protocol state to consistently manage an operational state of a user equipment (UE), and indicates a function and procedure of the UE in detail. In the discussion on the NR standardization, an RRC state is discussed such that an RRC_CONNECTED state and an RRC_IDLE state are basically defined, and an RRC_INACTIVE state is additionally introduced.
In NR, the UE may derive RSRP, RSRQ and SINR measurement results per cell associated to NR measurement objects based on parameters configured in the measObject, e.g. maximum number of beams to be averaged and beam consolidation thresholds.
However, in multi-beams operation on unlicensed frequency, it is not guaranteed that all beams are taken into account for cell measurement, because the network supporting LBT operation may transmit reference signals only when the channel is occupied successfully by the network. That is, in multi-beams operation on unlicensed frequency, network may not transmit whole SS/PBCH blocks burst because the occupation period can be inadequate to sweep all beams.

Method for deriving cell quality and device supporting the same


In order to check hand luggage and other objects carried by persons, control stations are needed, which have a control unit, in particular an X-ray checking unit, a conveyor which extends through the control unit, a depositing point which is arranged ahead of the conveyor, and a removal point which is arranged behind the conveyor, for the objects and having transport tubs which can be placed onto the conveyor. Small objects and items of clothing are placed in the transport tubs and conveyed through the control unit for checking. A return conveyor for the transport tubs is arranged next to or below the conveyor which passes through the control unit, which return conveyor reaches from the removal point behind the conveyor at least as far as into the region of the depositing point ahead of the conveyor.

1. Field of the Invention
The present invention relates to an inspection station for screening hand luggage and other items carried by persons, having an inspection unit, in particular an X-ray inspection device, a conveyor extending through the inspection unit for conveying the items through the inspection unit, a deposit point located ahead of the conveyer, and a retrieval point located behind the conveyor for the items, and having transport bins that can be placed on the conveyor, in which small items and articles of clothing are placed and conveyed through the inspection unit for screening.
2. Description of the Background Art
For security screening of hand luggage and other items carried by persons, for example for security screening at airports, it is known to use inspection stations with X-ray inspection devices that transradiate the items. The items to be screened are conveyed on a conveyor, typically a conveyor belt, through the inspection unit, which is run by an operator. Located at the entry side ahead of the conveyor is a roller conveyor, which is used for depositing the items to be screened. In a similar manner, a roller conveyor from which the screened items can be retrieved is located at the output side following the conveyor.
In a known manner, transport bins are used for transporting small items (wallets, cell phones, laptops, small backpacks, etc.) and articles of clothing, with the items being placed in the bins. The transport bins containing the items are placed on the conveyor and are conveyed by it through the inspection unit, in exactly the same way as larger items (briefcases, carry-on bags, etc.). After the screening, the items are removed from the bins by the passengers at the retrieval point. After being emptied, the transport bins must be brought back to the entry of the inspection station. For this purpose, they are either carried back by operating personnel, or are lifted up at the retrieval point and transferred to a non-driven roller section and pushed back on it. All known methods are not ergonomic and place considerable physical and time demands on the operating personnel.

Inspection station for screening hand luggage and other items carried by persons


The present invention relates to a polyester film produced by melt-extruding a polyester composed of a dicarboxylic acid unit and a diol unit, wherein 1 to 80 mol % of the diol unit is a unit containing a cyclic acetal skeleton, and the polyester film has an in-plane retardation of 20 nm or less at a wavelength of 550 nm. The polyester film is an optically isotropic polyester film which is easily produced by an extrusion-molding method and has an economical advantage. The polyester film is useful for production of optical members or optical products such as phase difference films, protective films for polarizing plates, light diffusion films, lens sheets, anti-reflection films and optical information recording media.

[1] Polyesters and Polyester Films
In recent years, there is a rapid increase in demand for flat panel displays such as liquid crystal displays and plasma displays which are used as a display for personal computers, televisions, cellular phones, personal digital assistants, car navigation systems, liquid crystal projectors and clocks.
The flat panel displays are constructed of various optical films such as a polarizing plate, a phase difference film, a prism sheet and an anti-reflection film. Among properties required for these films, a birefringence contributing to an image-forming property is one of important optical properties thereof. In general, the optical films presently used are classified into optically isotropic films having a small birefringence such as protective films for polarizing plates, and optically anisotropic films exhibiting a birefringence to some extent such as phase difference films. The optically anisotropic films are produced by subjecting the optically isotropic films to stretching, etc. From this viewpoint, the optically isotropic films are more important.
As the optically isotropic films, there are known films made of triacetylcellulose, polycarbonates, amorphous cyclic polyolefins, polyether sulfones, polyarylates and polyesters. Almost all of these films are produced by a casting method in which a solution of a resin cast and formed into a film while evaporating the solvent (Patent Documents 1-6). However, the casting method tends to be considerably deteriorated in productivity, and has problems such as adverse influence owing to a residual solvent in the films. Further, the casting method as a production method using a solvent is also undesirable from the standpoint of reducing burdens on environments.
To solve the problems, there have been proposed other film forming methods using a melt-extrusion method. For example, there has been proposed a method of obtaining optically isotropic films by melt-extruding amorphous cyclic polyolefins (Patent Document 7). However, the resultant films is expensive because expensive amorphous cyclic polyolefins are used, and the bonding between the film and another material needs a special adhesive because of a low polarity of the amorphous cyclic polyolefins.
There has been also proposed a method of forming polyether sulfones into a film by a melt-extrusion method (Patent Document 8). However, the obtained films are also expensive because expensive raw resins are used, a smooth surface is difficult to obtain, and the film forming process is complicated.
There has been further proposed a method for obtaining optically isotropic films by reheating a polycarbonate film produced by an extrusion method (Patent Document 9). However, the method is economically disadvantageous because the increased number of steps are required, and the surface of the film is likely to be damaged during the film forming process. Thus, the conventional extrusion-molding methods have failed to produce optically isotropic films in an economically suitable manner.
[2] Phase Difference Films
The phase difference films are produced by stretching an optically isotropic film to allow the film to exhibit a birefringence. The phase difference films are an important member for image display devices such as liquid crystal displays to enhance the contrast and broaden the viewing angle by the optical compensation. Examples of resins generally used for forming the phase difference films include engineering plastic resins such as polycarbonates (PC), triacetylcellulose (TAC) and cycloolefin polymers (COP). The phase difference films are produced by forming these resins into a raw film by a casting method or a melt-extrusion method and then stretching the obtained raw film so as to exhibit a desired retardation.
The raw film having an optional thickness is required to have a small thickness unevenness, a low retardation, a small retardation unevenness and a high ability of generating a retardation even when stretched at a low stretch ratio. By stretching a raw film having these properties, phase difference films having a less unevenness in the thickness and optical properties are obtained.
Also, in recent years, with the entry of foreign competitors into the Japanese market and development of new type displays other than liquid crystal displays such as SED (surface-conduction electron-emitter display), makers of displays have now made severe price-cutting competition for survival. Under these circumstances, the makers of electric and electronic equipments have been forced to reduce the costs of liquid crystal displays, this requiring to bring the costs of various parts down. Therefore, there is a demand for further reducing the costs of phase difference films which are indispensable to liquid crystal displays.
However, in general, the raw PC or TAC films have been conventionally produced only by a casting method requiring high production costs, because a low-cost melt-extrusion method hardly produces films having a low retardation. In addition, COP films produced by the conventionally known melt-extrusion method tend to generate a retardation because of the orientation of polymer chains or stress thereon during the molding (Patent Document 10). Further, since optimum production conditions are unstable, there tends to arise such a problem that a very long period of time is required until reaching a stable production of the raw film sheets satisfying properties as required, resulting in poor yield and high production costs.
In order to prevent the discoloration and the deterioration in contrast of display colors due to a birefringence of STN (super twisted nematic) liquid crystal cell, there has been proposed a method of superimposing an inverse-twisted STN liquid crystal cell thereon (phase compensation of STN liquid crystal cell) (Non-Patent Document 1). Since the liquid crystal has a continuously oriented structure, a birefringence of the liquid crystal must be compensated by using a STN liquid crystal cell also having a continuously oriented structure. Also, in Non-Patent Document 1, a plurality of phase difference films are laminated on the liquid crystal cell in place of the inverse-twisted STN liquid crystal cell, and it is described that the same effect as that of the inverse-twisted STN liquid crystal cell is obtained by laminating 10 phase difference films such that the slow axes thereof are offset from each other. It is also described that although even one phase difference film exhibits the effect to a certain extent, the lamination of two phase difference films is more effective. However, the method of laminating the phase difference films is not described.
In addition, in Non-Patent Document 2, there is disclosed a method of laminating a phase difference film (referred to as an optical compensation film in Non-Patent Document 2) between a polarizing plate and a glass substrate. Since a polarizing plate made of only a polyvinyl alcohol (PVA) stretched film has a poor strength and tends to undergo a considerable change in dimension and shape upon exposure to heat or moisture, a triacetylcellulose (TAC) layer as a protective layer is generally laminated on both surfaces of the polarizing plate (Non-Patent Document 2).
[3] Protective Film for Polarizing Plates
The protective film for polarizing plates is obtained by using an optically isotropic film.
The liquid crystal displays have come to be widely used year by year as a space-saving image displaying device with low power consumption. The conventional liquid crystal displays have such a large disadvantage that images largely depend on a viewing angle. However, in recent years, a wide viewing angle liquid crystal mode such as VA mode and IPS mode has been developed and put into practice, this rapidly increasing the demand of the liquid crystal displays in the applications requiring a wide viewing angle such as televisions. The liquid crystal displays are constituted from liquid crystal cell, orientation film, polarizing plate, phase difference film, viewing angle-expansion film and backlight. The polarizing plate used in the liquid crystal displays is also required to be further improved in quality and productivity.
Typical optical films used in the liquid crystal displays include a protective film for polarizing plates, an orientation film, a phase difference film, a viewing angle-expansion film, etc. The orientation film is directly contacted with liquid crystal and has a function of orienting the liquid crystal relative to a substrate. Examples of a typical material of the orientation film include aromatic polyimides. The phase difference film is used for optical compensation, and serves for preventing the occurrence of viewing angle dependency such as the optical strain due to birefringence and the discoloration of displayed colors due to modulation in a direction of the viewing angle. Examples of a typical material of the phase difference film include polycarbonates and triacetylcellulose (TAC). In addition, in recent years, bulky cyclic olefin resins such as "Zeonor" available from Zeon Corporation and "Arton" available from JSR Corporation have also been used. The viewing angle-expansion film serves for producing a clear image even when viewed from the inclined direction. Examples of a typical material of the viewing angle-expansion film include stretched TAC films and films composed of a film substrate and an oriented discotic liquid crystal applied on its surface.
The polarizing plate is capable of allowing only a light polarized in a specific direction of a random polarized light (non-polarized light) such as natural light to pass therethrough, and is usually constituted from a polarizing film and a protective film. The polarizing film is formed from a polyvinyl alcohol-based stretched film dyed with iodine or a dichromatic dye. The protective film is a transparent resin film provided on one or both surfaces of the polarizing film for the purpose of protecting the polarizing film, and is required to have an optical transparency, a uniform thickness, a low retardation which is expressed by a product of birefringence and thickness, a small retardation unevenness, and a low moisture absorption. If the in-plane retardation is large, the retardation unevenness is high or the thickness unevenness is high, the image quality of liquid crystal displays is considerably deteriorated. Namely, the color irregularity phenomenon in which displayed colors are partially faded and the deflection of images occurs. At present, as the protective film for polarizing plates, there have been most extensively used TAC films having a good transparency, a low birefringence and an adequate rigidity (Non-Patent Document 3).
During the production of these films, the films being produced undergo various stresses due to melt-flowing of resins, drying contraction upon removal of solvents, heat shrinkage, stress upon transportation, etc. Therefore, there tends to occur such a problem that the resultant films have a residual retardation due to birefringence which is attributed to the molecular orientation induced by these stresses. These films have been generally produced by a solution casting method or a melt-extrusion method. The optical films such as the above protective film for polarizing plates are required to exhibit not only good optical properties with an extremely high accuracy, but also a uniform thickness and a good appearance as especially important properties thereof. Therefore, the films have been produced by using the solution casting method. More specifically, the protective film for polarizing plates has been produced by subjecting a concentrated solution of TAC to filtration, casting the filtrate on an endless support such as a roll and a band to form a self-supporting film, and then separating the film from the support, followed by removing the solvent by drying.
However, the solution casting method tends to be deteriorated in productivity and requires high production costs as compared with the melt-extrusion method because the former method needs the solvent removal step. If the time for the removal of the solvent is shortened to avoid these problems, there tend to occur other drawbacks such as the whitening of the films and the increase in retardation thereof and its unevenness, thereby making the production of the protective film for polarizing plates having desired properties difficult. Also, the complete removal of the solvent from the film is difficult. If the residual solvent is prevent in the film, the film undergoes stress unevenly upon stretching, thereby failing to realize a uniform retardation. When such a film is applied to liquid crystal displays such as portable OA devices and displays for automobiles which are used under conditions where temperature changes largely, the film tends to suffer from warpage, resulting in poor image quality. Also, the complete removal of the solvent needs an expensive drying apparatus to increase the facility costs and consumes a large quantity of energy to increase the running costs. Since a large amount of an organic solvent such as methylene chloride is used upon production of the film, there tend to arise additional problems such as adverse influence on heath of workers and environmental pollution due to volatilization of the solvent into atmospheric air.
Under these circumstances, in recent years, it has been attempted to use the melt-extrusion method in place of the solution casting method for producing the optical films. For example, there has been proposed a method for producing an optical polycarbonate film exhibiting a low in-plane retardation (10 nm or lower) in a visible range by the melt-extrusion method (Patent Document 11). However, since the in-plane retardation of the film obtained by the melt-extrusion method is still as high as from 22 to 50 nm, the film produced by this method should be held in a heating apparatus such as an oven and a drying furnace for a predetermined time while applying a tension in the processing direction to reduce the retardation to 10 nm or lower. Thus, since the film having a low in-plane retardation is not produced only by the melt-extrusion method, a low retardation is achieved by the subsequent heat-treatment step.
In addition, the water vapor permeability of the TAC films tends to be too high to use the films as a protective film for polarizing plates. If the protective film for polarizing plates has a high water vapor permeability, the wet heat resistance is reduced, the polarizing performance is reduced due to the dissociation or elimination of iodine in the polarizing film, and the warpage of the polarizing plate may occur. To solve these problems, there have been proposed various techniques for preventing the films from suffering from deterioration in wet heat resistance. However, many of these techniques relate to the methods of reducing a water vapor permeability by adding a hydrophobic additive to TAC or introducing a hydrophobic group into TAC (Patent Documents 12-15). However, TAC films excessively hydrophobilized tend to be hardly bonded to the polarizing film. In addition, some of the additives tend to cause the films to exhibit a birefringence, resulting in a high retardation of the obtained films. Thus, conventionally, it has been quite difficult to obtain the protective film for polarizing plates which satisfies all of a high yield, good optical properties such as a low retardation and a high total light transmittance, a low water vapor permeability and a suitable adhesion to the polarizing film at the same time.
[4] Lens Sheet
The lens sheet is produced by using an optical isotropic film as a substrate.
In recent years, color liquid crystal displays have been extensively used in various application fields such as liquid crystal monitors for portable note-type personal computers and disk top-type personal computers, monitors for liquid crystal televisions and car navigation systems, and monitors for cellular phones. Since the liquid crystal itself is not a self-light emitting element, a device called a backlight is used for lighting the liquid crystal from the back side. The backlight is constituted from a fluorescent tube, a light guide plate, a reflection sheet, a prism sheet, etc. The prism sheet is disposed on the light emitting surface of the light guide plate and serves for improving the optical efficiency of the backlight to enhance the luminance. For example, the prism sheet is obtained by arranging prisms having a triangular sectional shape on a resin film in parallel rows to form an optical element thereon. Further, there may be also used a lens sheet provided with an optical element having Fresnel lenses concentrically arranged on the surface of the resin film (Fresnel lens sheet). In addition, there may be also used a lens sheet provided with an optical element having lenticular lenses formed by arranging a plurality of cylindrical lenses in parallel rows on a surface of the resin film (lenticular lens sheet). The prism sheet, the Fresnel lens sheet and the lenticular lens sheet are generally referred to as lens sheet.
The prism sheet is generally produced by filling a mold having a desired prism pattern with an activation energy radiation-curable resin, superimposing a transparent substrate on the resin and irradiating the resin with an activation energy radiation through the transparent substrate to cure the resin. As the transparent substrate, there may be frequently used a stretched heat-set polyethylene terephthalate film (O-PET) from the standpoints of a good mechanical strength, low costs and a good transparency (Patent Document 16). However, in order to prevent the heat shrinkage due to the irradiation heat upon curing, the amount of radiation energy must be reduced, thereby preventing the improvement of the productivity. In addition, the process for production of the O-PET includes various steps such as melt-extrusion, stretching and heat-setting and, therefore, is complicated (Patent Document 17). Further, in the applications, particularly those exposed to high temperature such as monitors for car navigation systems and cellular phones, the O-PET is required to have a large thickness from the standpoint of a good dimensional stability, thereby preventing the reduction in the thickness. Also, as described in Non-Patent Document 4, since molecular orientation is undesirable for optical films, there is a demand for resin films which are non-oriented (low retardation) and show a good strength without stretching. However, no resin films satisfying these requirements have been presently obtained.
[5] Light Diffusion Film
The light diffusion film is produced by using an optical isotropic film as the substrate.
Conventionally, polyethylene terephthalate stretched films (PET stretched films) have been used as the substrate of the light diffusion films for use in liquid crystal displays because of their excellent mechanical strength, heat resistance and dimensional stability at high temperatures.
In recent years, to improve the contrast of liquid crystal display panels and increase their size, a light source of the backlight is required to emit an increased amount of light. Although the conventional PET films are improved in heat resistance by stretching, the heat resistance is still insufficient, thereby failing to emit an increased amount of light because of the temperature rise during use. To solve the problem, there has been proposed a film for light diffusion plates which is obtained by biaxially stretching a raw film made of polyimide and polyethylene terephthalate to improve the heat resistance (Patent Document 18). However, the stretching requires high costs similarly to the conventional PET stretched films. Further, as described in Non-Patent Document 4, November 4, in order to avoid the undesirable molecular orientation, there is a demand for resin films which are non-oriented (low retardation) and show a good strength without stretching. However, no resin films satisfying these requirements have been presently obtained.
[6] Anti-Reflection Film
The anti-reflection film is produced by using an optical isotropic film as the substrate.
In recent years, there is a rapid increase in demand for flat panel displays such as liquid crystal displays, plasma displays and projection displays which are used as an image display device for personal computers, televisions, cellular phones, personal digital assistants, car navigation systems, liquid crystal projectors and clocks. In these image display devices, in order to suppress deterioration in visibility due to reflection of an external light, the image display devices are provided with an anti-reflection film as an outermost layer.
The anti-reflection film is composed of a substrate mainly made of triacetylcellulose (TAC) or polyethylene terephthalate (PET), a hard coat layer and an anti-reflection layer each being laminated on the substrate.
The TAC substrate is produced by a solution casting method in which a solution is prepared by dissolving TAC having a bonded acetic acid amount (acetylation degree) of 60 to 62% together with a plasticizer in a mixed solvent composed of methylene chloride and methanol, the solution is continuously cast, and then the solvent is evaporated from the cast solution. However, the solution casting method requires a prolonged time and a large amount of energy for the dissolving step and drying step, resulting in high costs and environmental problems (Patent Document 19). Since the TAC film is easily broken during the coating of the anti-reflection layer, a continuous take-up coating method is hardly applicable. Therefore, the coating should be conducted by a single coating manner, resulting in poor productivity (Non-Patent Document 5).
Since the PET unstretched films are poor in the heat resistance, they may heat-shrink when coating the film with an anti-reflection layer by vapor deposition. Therefore, the amount of energy radiation irradiated on the films must be reduced, this being a cause for preventing the improvement of productivity. Further, the process for producing PET films which are enhanced in heat resistance by stretching and heat-setting is complicated because of various steps such as melt-extrusion, stretching and heat-setting (Patent Document 20). In addition, in the application, particularly those exposed to high temperatures such as monitors for car navigation systems and cellular phones, the stretched PET films are required to have a large thickness from the standpoint of a good dimensional stability, thereby inhibiting the reduction of thickness. Also, as described in Non-Patent Document 4, since molecular orientation is undesirable for optical films, there is a demand for resin films which are non-oriented (low retardation) and show a good strength without stretching. However, no resin films satisfying these requirements have been presently obtained.
[7] Optical Information Recording Medium
The optical information recording medium is produced by using an optical isotropic film as the protective layer.
In recent years, development of high-density optical information recording rapidly proceeds. For example, ultra-high density optical disks such as blu-ray discs have now been put into practice. The blu-ray discs having a diameter of 120 mm are capable of recording a large capacity data of 23 GB (giga byte) or more by a single-layer recording, and 47 GB or more by a dual-layer recording. In the blu-ray discs, the high-density recording is realized by reducing the track pitch of grooves on the disks to about 0.32 μm by using an optical system having a recording/reproducing wavelength of about 405 nm and a numerical aperture of about 0.85. With such a large numerical aperture, the distance between a pick-up lens and an information recording/reproducing layer (also merely recording layer) is very small as compared with current DVD disks. Therefore, the protective layer for the recording layer is required to have a thickness as extremely small as 100 μm. In addition, since the information is reproduced by using a polarized laser, the protective layer is required to be optically isotropic. The protective layer is usually constituted from a transparent adhesive layer and an optically isotropic film, and it is strongly required to produce the optically isotropic film at low costs.
In the standard of the blu-ray discs, the thickness of the protective layer formed on a laser incident side of the information recording/reproducing layer is limited to 100 μm (±2 μm). The optical properties required for the protective layer include an in-plane retardation of 5 nm or less at a wavelength of 405 nm. The protective layer is usually mainly made of a film of polycarbonate (PC). However, the PC film has a poor productivity, resulting in high production costs of the disks. Also, it is well known in the art that the PC film produced by melt extrusion hardly shows a reduced retardation. Therefore, the PC film fails to satisfy the properties required as an optically isotropic film for forming the protective layer of the blu-ray discs (Non-Patent Document 6).
The blu-ray films are usually constituted from a substrate having guide grooves, a reflection layer and a recording layer mainly composed of an organic pigment which are sequentially formed on the substrate, and a protective layer formed on the recording layer (Patent Document 21).    Patent Document 1: JP 9-95544A    Patent Document 2: JP 7-256664A    Patent Document 3: JP Patent 3404027    Patent Document 4: JP 7-73876A    Patent Document 5: JP 8-318538A    Patent Document 6: JP 7-41572A    Patent Document 7: JP 2003-279741A    Patent Document 8: JP Patent 3035204    Patent Document 9: JP Patent 2769020    Patent Document 10: JP 2004-109355A    Patent Document 11: JP 2003-302522A    Patent Document 12: JP 2002-22956A    Patent Document 13: JP 2002-146044A    Patent Document 14: JP 2001-343528A    Patent Document 15: JP 9-90101A    Patent Document 16: JP 10-197702A    Patent Document 17: JP 2004-131728A    Patent Document 18: JP 2002-341114A    Patent Document 19: JP 7-11055A    Patent Document 20: JP 2004-131728A    Patent Document 21: JP 2005-186607A    Non-Patent Document 1: Kobayashi, Hirakata and Nagae "Analysis of Phase Plate type Monochrome STN-LCD", Singaku Technical Report, Vol. 88, No. 54, pp. 9 to 16, 1988    Non-Patent Document 2: Satake "Adhesives for Polarizing Plates"; Bonding Technologies, Vol. 25, No. 1, 2005, No. 78, pp. 25 to 30    Non-Patent Document 3: Optical films for Displays" edited by Fumio Ide, CMC Publishing, 2004    Non-Patent Document 4: "Analysis of Demand and Competition for Optical Transparent Plastic Films", Fuji Chimera Research Institute, Inc., Nov. 4, 2004, p. 128    Non-Patent Document 5: "Prospect and Strategy of High-Performance Film Market 2005", published by Yano Research Institute Ltd., pp. 86 to 87    Non-Patent Document 6: Yahata, Kazuo "Features and Mold Processing Techniques of Optical Transparent Resins, and Application to Optical Films/Mold Processing Techniques and Development of Optical Applications of Polycarbonate Films", Technology Information Institute, Mar. 28, 2005, pp. 1 to 36

Polyester film, process for producing the same and use thereof


Methods for filtering a file written in Extensible Application Markup Language (XAML) and incrementally returning the logical content contained therein to the environment, e.g., a search engine, are provided. Additionally provided are methods for extracting logical content contained in a XAML file to facilitate searching and/or indexing thereof. The methods provided permit the filtering of files containing only flow-format elements, files containing only elements representing fixed-format pages, and/or files containing both flow-format and elements representing fixed-format pages.

Extensible Application Markup Language (XAML) is a particular Extensible Markup Language (XML) schema that defines the layout and behavior of interactive files similar in functionality to dynamic Hyper Text Markup Language (HTML) files. Searching for files or building search indices for files involves extracting the indexable logical contents, i.e., the textual contents, of the file. Extracting the indexable logical content from an XAML file involves filtering out all formatting and behavior data therefrom.
Files written in XAML cannot be suitably filtered for indexing and/or searching of the indexable logical content contained therein as an arbitrary XML file because such filtering methods do not take into account the markup semantics. Markup semantics include information regarding whether a particular instance of text content or a particular attribute value is to be treated as indexable content rather than non-content (e.g., structural information). Filtering out element and attribute names, for example, and treating all attribute values and text data as content, as a conventional generic XML filter would do, would result in metadata (non-content) being improperly returned as data.
Accordingly, a method for filtering a file written in XAML that accounts for markup semantics and processes elements and attributes would be desirable for accurately determining the content of the file for searching and indexing applications, or any application that needs to specifically process the content of the file.

Methods and systems for filtering an Extensible Application Markup Language (XAML) file to facilitate indexing of the logical content contained therein


There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns are transferred onto a thermoplastic resin, without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns of the original plate against a thermoplastic resin with the copper foil interposed therebetween to transfer portions of the copper foil in contact with the protruding patterns onto the surface of the thermoplastic resin, thereby forming the circuit patterns.

1. Field of the Invention
The present invention relates to a method for manufacturing a printed circuit board and, more particularly, to a method for manufacturing a printed circuit board, in which a step of forming circuit patterns is improved.
2. Description of the Related Art
A subtract method is conventionally known as a method for manufacturing a printed circuit board, A method for manufacturing a through hole printed circuit board according to the subtract method will be described below. First, after drilling is performed for a copper-clad laminated to form a hole, and electroless copper plating and, if necessary, electric copperplating are performed on the entire surface of the copper-clad laminate including the hole, thereby depositing a copper plating film in the inner wall surface of the hole to form a through hole. Subsequently, a filler for protecting the through hole is filled in the through hole and on the peripheral portion of the hole, and etching resist patterns are formed on the copper plating film by a photolithography method or a tenting method. The resist patterns are used as a mask to remove portions of the copper plating film and a copper foil exposed from the mask by etching to form circuit patterns, thereby manufacturing a printed circuit board.
An operation, however, of the above subtract method is cumbersome because the method requires a large number of manufacturing steps. In addition, since a large amount of waste liquors in which copper is dissolved is produced upon etching, countermeasures against environmental pollutions such as waste liquor disposal are required to result in a high running cost. Furthermore, it is difficult to form circuit patterns having a fine line width because an undercut is formed or side etching occurs during etching.
In view of the foregoing, an additive method using no copper-clad laminate is developed. In this additive method, drilling is performed for a laminate to form a hole, and the entire surface of the laminate is subjected to a catalyst treatment. Subsequently, plating resist patterns as complementary patterns of circuit patterns to be formed are formed, and electroless copper plating is performed to deposit an electroless copper plating film on the inner wall surface of the hole and the surface of the laminate exposed from the resist patterns, thereby forming a through hole and circuit patterns. Thereafter, removal of the plating resist patterns and the catalyst layer is performed to manufacture a printed circuit board. This additive method, however, requires a special plating solution in order to improve adhesion properties between the copper plating film and the laminate. In addition, since copper tends to precipitate on portions of the laminate except for a necessary portion, it is difficult to form fine circuit patterns. Furthermore, this method also has the same problem of waste liquor disposal as the subtract method.
As a method for manufacturing a printed circuit board without producing any waste liquor, a conventional die stamp method (Published Unexamined Japanese Patent Application No. 51-126277) is known. In this method, a metal mold having a blade protruding toward the outer peripheries of protruding patterns having the same shape as circuit patterns to be formed is used, and a metal foil with an adhesive is superposed on the surface of an insulating base. The metal mold is heated or pressed at room temperature to cut the metal foil with an adhesive into the shape of the circuit patterns, and at the same time the periphery of the metal foil is pushed in and bonded to the insulating base. In this method, however, since the cutting blade is formed at the peripheries of the circuit patterns of the metal mold so as to be vertical with respect to the circuit surface, it is difficult to form fine circuit patterns. In addition, when the cutting blade wears in use, the cut circuit width becomes nonuniform. Since further use of the worn cut blade makes the blade unable to make a cut, noncircuit portions are bonded with each other. Since it is very difficult to sharpen such a dull blade because of the above-mentioned shape of the mold, the number of products manufacturable per blade is very small.
In addition, when a resin film is used as the insulating base, a cut portion is formed on the surface of the resin film upon punching by the blade of the metal mold to possibly cause poor insulation. Furthermore, when wide circuit patterns are to be formed, since the blade of the metal mold initially abuts against a copper foil, air cells are easily formed between the copper foil and the insulating base. As a result, since the air cells are not removed even when the protruding patterns of the metal mold are urged against punched portions of the copper foil, circuit patterns cannot be formed on the insulating base with high adhesion force. This method also has a problem of difficulty in micropatterning of circuit patterns.

Method for manufacturing printed circuit board


This invention provides novel azido linkers for deoxynucleotide analogues having a detectable marker attached thereto.

The completion of the Human Genome Project (HGP) in early 2000 (1) was a monumental achievement with incredible amount of combined efforts among genome centers and scientists worldwide. The engine behind this decade long project was the Sanger sequencing method, which still currently maintains as the staple of large-scale genome sequencing methodology in high-throughput genome sequencing centers. The main reason behind this prolonged success was in the basic and efficient, yet elegant method that is Sanger dideoxy chain terminating reaction (2). With incremental improvements in this DNA sequencing technology including the use of laser induced fluorescent excitation of energy transfer dyes (3), engineered DNA polymerases (4) and capillary electrophoresis (5) as well as in the areas of sample preparation, informatics, and sequence analysis software (6-9), the Sanger sequencing platform has been able to maintain its status as champion in the sequencing world. Current state-of-the-art Sanger based DNA sequencers can produce over 700 bases of clearly readable sequence in a single run from templates up to 30 kb in length (10-12). However, as is with most of technological inventions, the continual improvements in this sequencing platform has come to a stagnant plateau, with the current cost estimate for producing a high-quality microbial genome draft sequence at around $10,000 per megabase pair. Current DNA sequencers based on the Sanger method allow up to 384 samples to be analyzed in parallel.
While fluorescent-based SBS methods have almost unlimited ability for parallelization, restricted only by the resolution of the imaging system, to date they have been limited to read lengths of about 35 bases. The successful implementation of sequencing by synthesis (SBS) is effectively dependent on the read length of the target DNA template. One of the major factors that determines the read length when performing SBS is the number of available templates. Our laboratory has recently developed two powerful approaches for SBS: 1) Hybrid SBS with nucleotide reversible terminator (NRTs, 3′-O—R1-dNTPs) in combination with fluorescently labeled dideoxynucleotide (ddNTPs-R2-fluorophore), and 2) SBS with cleavable fluorescent nucleotide reversible terminator (C—F-NRTs, 3′-O—R1-dNTPs-R2-fluorophore). ("Four-color DNA Sequencing with 3′-O-modified Nucleotide Reversible Terminators and Chemically Cleavable Fluorescent Dideoxynucleotides". J. Guo, N. Xu, Z. Li, S. Zhang, J. Wu, D. Kim, M. S. Marma, Q. Meng, H. Cao, X. Li, S. Shi, L. Yu, S. Kalachikov, J. Russo, N. J. Turro, J. Ju. Proceedings of the National Academy of Sciences USA. 2008, 105, 9145-9150) ("Four-Color DNA Sequencing by Synthesis Using Cleavable Fluorescent Nucleotide Reversible Terminators". J. Ju, D. Kim, L. Bi, Q. Meng, X. Bai, Z. Li, X. Li, M. S. Marma, S. Shi, J. Wu, J. R. Edwards, A. Romu, N. J. Turro. Proceedings of the National Academy of Sciences USA. 2006, 103, 19635-19640). Since the incorporation of ddNTPs-R2-fluorophore into a strand of DNA permanently terminates further extensions of that template in the first approach and the incorporation and cleavage of C—F-NRTs leaves a tail of the modified nucleotide that causes possible steric hindrance to lower the incorporation efficiency of the subsequent base in the second approach, the total number of sequenceble templates decreases after each cycle of SBS reaction. Various means can be employed to minimize this rate of template reduction. Among those, a powerful method termed template "walking" can potentially diminish the negative effect of template termination or reduction and extend the read length of SBS at least two to three-fold.

Synthesis of cleavable fluorescent nucleotides as reversible terminators for DNA sequencing by synthesis

THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK


An extensible configuration system to allow a website to authenticate users based on an authorization protocol is disclosed. In some embodiments, the extensible configuration system includes receiving an identifier for an authentication provider; and automatically configuring a website to use the authentication provider for logging into the website.

Various services such as Facebook®, Twitter®, Linkedin®, and others expose service APIs that adhere to various authentication protocols (e.g., OAuth 1.0/2.0, etc.) so that external websites or applications may use such "trusted" services as sources of authorization and authentication (in lieu of, or in addition to, their own internal authentication mechanisms).

Extensible configuration system to allow a website to authenticate users based on an authorization protocol