A patterned first metal plate (310)is joined to an upper surface of a first ceramic substrate (301), and a second metal plate (330) is joined to an emitter electrode (310E) of the first metal plate (310) through a second ceramic substrate (320). Power devices (4) are mounted on a collector electrode (310C) of the first metal plate (310), and control devices (5) are mounted on the second metal plate (330). The emitter electrode (310E) of a metal layer lies between a high-voltage circuit having the first metal plate (310) and power devices (4) and a control (low-voltage) circuit having the control devices (5) and second metal plate (330). The emitter electrode (310E) serves as a shielding material, and the electrostatic shielding effect prevents noises applied to the high-voltage circuit from being led to the control circuit, so that the faulty operations of the control devices (5) are prevented and the reliability of the semiconductor device is improved.

1. Field of the Invention
The present invention relates to a semiconductor device including power semiconductor devices and control semiconductor devices for controlling the power semiconductor devices and a method of fabricating the semiconductor device. The invention also relates to a composite substrate for use in the semiconductor device and a method of fabricating the composite substrate.
2. Description of the Background Art
FIG. 13 is a cross-sectional view of a conventional semiconductor power module, and FIG. 14 is a schematic cross-sectional view of a composite substrate for use in the power module. The power module 100 includes a composite substrate (insulating substrate) 110 on a copper base plate 101, as shown in FIG. 13. The composite substrate 110 includes a ceramic substrate 111 and copper plates 112 and 113 joined respectively to both surfaces of the ceramic substrate 111, as shown in FIG. 14. The copper plate 112 is patterned to the configurations of electronic circuits to be formed thereon so that it is separated into a first region 112a and a second region 112b. power semiconductor devices (referred to as "power devices" hereinafter) 103 used under high voltage and high-current conditions are mounted in the first region 112a, as shown in FIG. 13, so that a high-voltage circuit is formed. Control semiconductor devices (referred to as "control devices" hereinafter) 104 used under low-voltage and low-current conditions and for controlling the power devices 103 are mounted in the second region 112b (See FIG. 14). so that a control circuit (low-voltage circuit) is formed.
Referring to FIG. 13, an outsert case 130 having first and second connecting terminals 131 and 132 is bonded at its end portion 133 to the copper base plate 101. This permits the outsert case 130 to accommodate the composite substrate 110, power devices 103 and control devices 104. A first connecting terminal portion 131a connected electrically to the first connecting terminals 131 is soldered to the first region 112a of the copper plate 112, so that the first connecting terminals 131 and the power devices 103 are connected electrically to each other. A second connecting terminal portion 132a connected electrically to the second connecting terminals 132 is soldered to the second region 112b, so that the second connecting terminals 132 and the control devices 104 are connected electrically to each other
The lower portion of the interior of the outsert case 130 is filled with silicon gel 141, and the upper portion thereof is filled with epoxy resin 142.
In the power module 100, when a control signal is applied to the control devices 104 through the second connecting terminals 132, a signal from the control devices 104 is applied to the power devices 103 to control the drive of the power devices 103. This provides for the drive control of a load circuit (not shown) connected electrically to the power devices 103 through the first connecting terminals 131.
Since both of the high-voltage circuit and the control circuit are disposed on the single ceramic substrate 111 in the conventional power module 100, there is formed a capacitance between the high-voltage circuit and control circuit through the ceramic substrate 111. When noises are produced in the high-voltage circuit due to external factors such as load fluctuation, the noises are led to the control circuit through the capacitance in the ceramic substrate 111 to cause the faulty operations of the control devices 104. There arises a problem that the power devices 103 also faultily operate, resulting in deterioration of the reliability of the power module 100.

Semiconductor device and method of fabricating semiconductor device


An arithmetic processing part in a controller detects a position of a defect such as a chip or a crack that occurs at an outer periphery of a semiconductor wafer, and then a memory in the controller stores position information of the defect. The controller reads the position information of the defect through a network in each process. On the basis of this position information, the controller determines a direction of joining a dicing tape to the semiconductor wafer or a direction of separating a protective tape from a front face of the semiconductor wafer.

(1) Field of the Invention
The present invention relates to a method for joining and separating an adhesive tape such as a protective tape to and from a pattern formation side of a semiconductor wafer.
(2) Description of the Related Art
A chip component is fabricated from a semiconductor wafer (hereinafter, appropriately referred to as a "wafer") in the following manner. For example, a circuit pattern is formed on a front face of a wafer, and then a protective tape is joined to the front face of the wafer. Thereafter, a back face of the wafer is subjected to a grinding process (back grinding) such that the wafer has a small thickness. The wafer having the small thickness is attached to and held by a ring frame through a dicing tape. Thereafter, the protective tape is separated from the front face of the wafer, and then the wafer is transported to a dicing process (refer to, for example, JP-A 2002-124494).
As described above, the processing for the semiconductor wafer involves joining or separating various adhesive tape, such as joining the protective tape to the semiconductor wafer, joining the semiconductor wafer to the dicing tape and separating the protective tape from the semiconductor wafer.
In a case where the semiconductor wafer is subjected to the processing of joining or separating such an adhesive tape, however, since a strength of the semiconductor wafer is insufficient due to its small thickness, there is a high risk of a damage of the semiconductor wafer due to a stress applied to the wafer when the adhesive tape is joined to/separated from the wafer. In particular, a minute chip or crack occurs at an outer periphery of the wafer in the back grinding. In such a case, there is a high possibility that the chip or the crack becomes deteriorated due to the stress applied to the wafer when the adhesive tape is joined to/separated from the wafer.

Method for joining adhesive tape to semiconductor wafer and method for separating protective tape from semiconductor wafer


The present invention provides methods and materials for use in repairing a worn component having thin walls. One kind of thin wall may be the wall of a cylindrical portion of the component where such wall has a worn inner surface and an opposite outer surface. The method includes the steps of preparing the outer surface of the component for cold spraying; cold spraying material onto the outer surface so as to form a strengthening coating; reaming the inner surface so as to create a repair surface with a repair diameter greater than the inner diameter; and installing an insert on the repair surface. The thickness of the coating is selected so as to impart a desired degree of strength to the wall. The method allows the repair of expensive aluminum castings that would otherwise, because of the thin wall construction, not be suitable for repair.

Various components are designed and manufactured to have thin walls. Thin wall technology is increasingly used in components that have application in the transportation industry where it is desired to save weight. Thin wall manufacturing is also used in order to minimize material consumption, and the associated cost, during manufacturing. Thin wall design, described generally, means designing a component with a wall thickness set at or near a minimum needed thickness consistent with the strength requirements for the part. For example, fluid pump housings used in aircraft applications may be complex aluminum castings with thin wall technology. Housing walls in such a component may have a thickness of between about 0.050 to about 0.070 inches. Other structures presently used in aircraft that may have a thin wall design include fuel control housings, lube modules, oil pump housings, and pneumatic valve bodies.
However, the thin wall construction technique is creating difficulties when the time comes to repair the component. After a period of service, a component surface may experience wear or erosion. Fluid pumps, for example, may encounter fluid erosion at surface areas of the component along fluid paths. Mechanical erosion also occurs on those surfaces of a component that experience metal to metal contact. In order to repair surfaces suffering wear, erosion, or scratching, it is generally necessary to machine away a portion of the worn surface. However, if the worn surface is part of a thin wall structure, there is little to no tolerance for machining away material. Machining away material from a worn surface may so weaken the structure that the part could not meet basic strength specifications. However, scrapping the part is often not an attractive alternative. Aluminum castings, such as those described above, can be expensive to replace. Moreover, when a component becomes damaged, it may be that only the wear surface needs to be repaired, while the remainder of the structure is still usable. Thus, it would be desired to find an acceptable repair technique if possible.
Some repair strategies, such as various welding processes, add material to a worn component. Welding, however, is often not well suited to those components having thin wall construction. Welding typically involves heating a component surface to a high temperature sufficient to melt both the surface substrate and an additive material. This high heat can damage the component being repaired. A thin wall structure is particularly subject to warpage during a high heating process such as may be encountered during welding. Moreover, aluminum parts, often found in aviation applications, are also susceptible to heat induced warpage. Thus, it would be desired to identify a repair technique that avoids the potentially negative effects of high heat.
Hence there is an ongoing need to provide improved methods for repairing damaged components with thin walls. It would be desirable to develop repair methods that are simple, inexpensive, and restore the component to a level of performance at least equal to, or preferably, superior to that of the original construction. Finally, it is desired that the repair method allow the assembly to be quickly returned to service. The present invention addresses one or more of these needs.


An information display system and an information display method are provided. The information display system includes a display screen, an image-capture device, and a processing device. The image-capture device captures a picture sequence. The processing device is coupled to the display screen and the image-capture device. The processing device recognizes at least one dynamic object in the picture sequence and generates a recognition frame and a recognition information corresponding to the dynamic object. The processing device tracks a recognition frame of a plurality of first pictures in the picture sequence to obtain a tracking result. The processing device compensates a display coordinate of a recognition information of a second picture in the picture sequence according to the tracking result to obtain a compensated coordinate, and displays the recognition information on the display screen according to the compensated coordinate to reduce a jitter of the recognition information displayed on the display screen. The first pictures are prior to the second picture in terms of time sequence.

With the development of technology, the application of transparent displays has become more diverse. The transparent display is such that its display panel has a certain degree of light penetration and may clearly display the background behind the panel. The transparent display is suitable for a variety of applications such as building windows, vehicle windows, and shop windows.
In addition to the original transparent display function, the transparent display may also be applied to the display of dynamic information. That is, when a user views an object of the display panel relative to the other side of the user via the transparent display, the recognition information of the object may be correspondingly displayed in the periphery of the object display position of the transparent display. However, when the object moves or jitters, the display position of the recognition information of the object also correspondingly moves or jitters. As a result, the viewing comfort of the user is affected.

Information display system and information display method

Industrial Technology Research Institute

Intellectual Property Innovation Corporation


A cylindrical oil contamination collector for removal of ultra-fine particulate includes a rectangular and continuous length of single-sided, corrugated, phenolic coated paper overlaid with three rectangular electrodes affixed thereto in a spaced-apart, side-by-side arrangement. Two of the electrodes are electrode grounds and the other electrode is a high voltage electrode. The phenolic coated paper is spiral-wound into a continuous spiral with at least one of the three rectangular electrodes sandwiched between adjacent, overlapping turns of the spiral-wound phenolic coated paper.

Cleanliness of fluids is commonly measured using laser particle counters. Particle count can be represented in two different formats:
(i) ISO 4406 (1998) which measures total particle numbers per milliliter of fluid, by scaling the particle numbers in a range from 1-28, and the total particle count from 0.01 to 250,000. Particle count is measured in a 3-digit code X representing total particles >4 μm, Y representing total particles >6 μm, and Z representing total particles >14 μm.
(ii) NAS 1638 separates total particle count into 5 size ranges; 5-15 μm, 15-25 μm, 25-50 μm, 50-100 μm, and >100 μm.
Overall fluid particle code is a singular number that defines the worst particle count of the 5 scales. Total particle count is measured per 100 milliliters of fluid.
Laser particle counters can be limited in their ability to accurately measure small particles. Their ability to measure particles is often accepted as greater than 4.6 μm in size, leaving all particulate smaller than 4.6 μm as not reportable by this method.
It is also understood that the total number of particles in a typical in-service hydraulic or lubricating fluid contains 95% of contaminants that are less than 4.6 μm.
Existing configurations and design of electrostatic oil purifiers is varied. Electrostatic purifiers can often be categorized into 2 types:
A) Electrostatic purifiers induce a charge on the insoluble particles in the fluid and allow the capture of those particles in a collection medium. These electrostatic purifiers may be referred to as electrostatic oil cleaners.
B) Electrostatic purifiers that induce agglomeration, and make no attempt to contain flocculated particles within the fluid processing unit. These electrostatic purifiers depend on external mechanical filtration equipment to collect flocculated particles, and may be described as uncontained agglomeration purifiers.
Both purifier types depend upon a non-conductive environment to operate. Their performance can be impacted when conductive fluids, such as water, is introduced.
Voltage levels for type A purifiers are in the general range of about 10 kV to 15 kV. With reference to FIG. 1, reproduced from a paper presented by Akira Sasaki and Shinji Uchiyame, reference NCFP 102-1.2/SAE OH 2002-01-1352 (the Sasaki paper), it shows that the if oil flow is not precisely controlled, a net negative charge will be applied to the oil, as it continues on its path throughout the circulating oil system. Agglomeration of particles within the negatively charged oil occurs throughout the oil system. It can therefore be important to optimize a purifier design that minimizes voltage applied to the electrodes, so that external agglomeration does not occur.
Type B purifiers that initiate uncontained agglomeration may be represented by Munson WO 03/000406 A1, whereby a dual polarity electrode system is utilized to apply an appropriate voltage greater than 13 kV to apply a charge on particulate contaminant, and to a lesser degree on the fluid depending on its dielectric properties. The charge applied to the fluid and contaminants is dispersed throughout the entire fluid volume, whereby agglomeration occurs throughout the fluid system. Rate of agglomeration in a typical large gas turbine application will be dependant on parameters such as oil velocity and temperature in small hydraulic lines, electrostatic relaxation properties, fluid turbidity in large oil return lines to the turbine oil reservoir and air release properties of the fluid, along with oil residence time in the operating reservoir. Removal of particles is dependant on conventional mechanical filtration medias located external to the electrostatic high voltage electrodes and vessels containing same thereof.
Fouling of last-chance filters located in sensitive servo-valve hydraulic systems used to control gas turbine air-flow variable geometry is often initiated by the agglomeration process. This process is clearly undesirable.
There are several different concepts of cylindrical collectors that attempt to capture contaminants within the fluid processing unit. The Kawasaki U.S. Pat. No. 5,501,783 construction includes of a series of cylindrical components, including, multiple layers of pleated paper, interlined with cylindrical sheets of phenolic paper, and cylindrical electrodes. Each component is manufactured individually, cut to precise length, glued into a cylindrical shape, and finally installed into the outermost aluminum ground electrode. The integrity for eliminating oil channeling voids within the collector, when oil flows from bottom to top is dependent on the tight, and close tolerance between each successive layer of material. This type of construction is time consuming and leads to inconsistencies in product quality control and overall efficiencies of operation. Since oil flow is from bottom-to-top of collector in the '783 patent, there is opportunity for oil channeling along the walls of the phenolic paper inserts, see FIG. 2. The relatively large area within the paper pleats decreases the migration vector of small particles that may be centered between the pleats. The pleats form a triangle having approximately a 12 mm base and a 12 mm height.

Spiral-wound cylindrical electrostatic oil cleaner


Provided is an observation method by an electron microscope, in which a biological sample can be observed as it is alive and a situation that the biological sample is moving can be observed using an electron microscope, and a composition for evaporation suppression under vacuum, a scanning electron microscope, and a transmission electron microscope used in the method.

A sample is put under vacuum in order to perform sample observation using a scanning electron microscope and a transmission electron microscope, and thus the sample is desired to be resistant to vacuum and to be imparted with electrical conductivity required to acquire an image thereof.
The preparation of a sample for scanning electron microscope is performed as follows. The sample is dehydrated by vacuum drying in advance, and then an electrically conducting material (platinum, carbon, gold, palladium, osmium, and the like) is coated on the surface of the sample by a means of vapor deposition, sputtering or the like in order to impart electrical conductivity and improve the generation efficiency of secondary electrons.
Materials, such as metals and semiconductors, which have electrical conductivity and resistance to vacuum, do not require such a pretreatment, but materials, which do not have electrical conductivity, requires conductive film coating by an electrically conductive material. In addition, conductive film coating by an electrically conductive material is required for materials deteriorating in resistance to vacuum, that is, materials deformed by vacuum drying or irradiation of an electron beam in a vacuum at the time of electron microscopic observation, as well.
Biological/living body samples contain a large amount of water, and thus vacuum drying in advance is required in many cases. For this reason, the surface shape thereof is significantly deformed in some cases, and thus it is difficult to observe a biological/living body sample in the living state as it is using an electron microscope.
Water-retaining state of wet samples such as gelatinous materials and foods can be observed at room temperature using a low vacuum SEM or a cryo-SEM, an environmental SEM (ESEM), and the like. According to these techniques, not only wet samples but also untreated samples can be observed. However, a high vacuum is required in order to perform observation at a high magnification, and thus the sample is required to be resistant to vacuum or electrically conductive. For that reason, it is difficult to acquire an image in the living state as it is at a high magnification in the observation of a biological/living body sample, as well.
In recent years, electron microscopic observation methods using an ionic liquid have been suggested. Patent Literature 1 and Non Patent Literature 2 disclose that a wet sample is scanning electron microscopically observed using an ionic liquid. Non Patent Literature 2 discloses the application of the method on cells, as well. In addition, Patent Literature 2 discloses a method using the technique on ionic liquids in transmission electron microscopic observation.

Electron microscopic observation method for observing biological sample in shape as it is, and composition for evaporation suppression under vacuum, scanning electron microscope, and transmission electron microscope used in the method

Abstract: The sample observation method by an electron microscope according to the invention includes applying a composition for evaporation suppression containing at least one kind selected from an amphiphilic compound, oils and fats, and an ionic liquid to the surface of a sample to form a thin film, and covering the sample with the thin film, and displaying an electron microscopic image of the sample, which is covered with the thin film and accommodated in a sample chamber under vacuum, on a display device.


A connecting device may include first and second connecting elements that are axially oppositely coupled to each other so as to be rotatable relative to each other, a locking member that is positioned between the first and second connecting elements, an operating member that is positioned between the first and second connecting elements, and a retainer member that is arranged and constructed to circumferentially clamp the first and second connecting elements. The retainer member has a retainer portion and is fixed to the first connecting element while the second connecting element is axially supported by the retainer portion of the retainer member.

1. Field of the Invention
The present invention relates to connection devices in vehicle seats. More particularly, the present invention relates to connection devices for rotatably connecting two components (i.e., seat backs and seat cushions) of vehicle seats.
2. Description of Related Art
Generally, a vehicle seat includes a seat back and a seat cushion. The seat back and the seat cushion are rotatably connected via a seat reclining device for adjusting a tilt angle of the seat back. Such a seat reclining device is taught, for example, by Japanese Laid-Open Patent Publication Number 2007-130237.
The known seat reclining device includes a pair of opposing disk-shaped housings, i.e., a first or rotational housing (ratchet) and a second or stationary housing (guide). The first housing is affixed to the seat back. The second housing is affixed to the seat cushion. The first and second housings are circumferentially connected by an annular fastener or clip ring along peripheral edges thereof, so that the first housing can move or rotate around a rotational shaft relative to the second housing.
The seat reclining device further includes a locking mechanism that can prevent the first housing from rotating relative to the second housing, so as to lock the seat reclining device. The locking mechanism essentially consists of a slide cam and slide pawls that are positioned between the housings. The slide cam is slidably received between guide members that are formed within the second housing, so as to radially move on the second housing when the rotational shaft is rotated. Conversely, the slide pawls are slidably received between the guide members, so as to radially move on the second housing. Further, the slide pawls are respectively arranged so as to move in the directions perpendicular to the slide cam. In addition, each of the slide pawls is provided with a convex toothed portion.
When the rotational shaft is rotated to a locking position, the pawls are radially moved outward via the slide cam, so that the respective convex toothed portions of the pawls engage a concave toothed portion that is circumferentially formed over an inner circular surface of a peripheral edge of the first housing. In this state, the first housing is prevented from rotating relative to the second housing, so that the seat reclining device is locked. As a result, the seat back is locked in position relative to the seat cushion.
In the seat reclining device, the second housing (guide) is constructed to receive the first housing (ratchet) therein. That is, the first and second housings are respectively constructed such that a peripheral edges of the second housing can circumferentially encircle a peripheral edge of the first housing when they are mated or coupled to each other.
In order to assemble the seat reclining device using a manufacturing machine, first, the slide cam and the slide pawls are attached to the second housing (guide) that is disposed on the manufacturing machine. Thereafter, the first housing (ratchet) is placed on the second housing, so that the first and second housings are mated or coupled to each other. At this time, the peripheral edge of the first housing can be encircled by the peripheral edge of the second housing. Subsequently, the clip ring is placed on the first housing while a retainer portion of the clip ring contacts the first housing, so that the first and second housings are coupled to each other. The clip ring thus positioned is then fixed to the second housing by crimping, so that the first and second housings can be circumferentially fastened or clamped to each other.
However, in order to fix the clip ring to the second housing, the mated first and second housings must be turned over such that the second housing can be positioned above the first housing. This is because the second housing is positioned below the first housing when the first and second housings are coupled to each other in the manufacturing machine. This may lead to an increased number of steps of a manufacturing process of the seat reclining device.


Footwear and sole structures include structures and properties, e.g., to support urban dance and urban dance moves. Such dance styles include various dance moves and movements that require contact between side edges of the wearer's shoes and the dance floor surface (e.g., made from concrete, asphalt, wood, etc.). Such dance styles also require transition of the body's center of mass along the edge(s) of the foot. Footwear and sole structures in accordance with this technology provide structures and properties to support to support such dance styles and moves, including one or more of: selected materials and/or selected material properties in various areas to promote sliding or gliding along various surfaces and/or other desired interactions with various surfaces; selected sizing and/or dimensional features of components in various areas; various flexion promoting structures and/or characteristics; etc.

Conventional articles of athletic footwear include two primary elements, an upper and a sole structure. The upper may provide a covering for the foot that securely receives and positions the foot with respect to the sole structure. In addition, the upper may have a configuration that protects the foot and provides ventilation, thereby cooling the foot and removing perspiration. The sole structure may be secured to a lower surface of the upper and generally is positioned between the foot and any contact surface. In addition to attenuating ground reaction forces and absorbing energy, the sole structure may provide traction and control potentially harmful foot motion, such as over pronation.
The upper forms a void on the interior of the footwear for receiving the foot. The void has the general shape of the foot, and access to the void is provided at an ankle opening. Accordingly, the upper extends over the instep and toe areas of the foot, along the medial and lateral sides of the foot, and around the heel area of the foot. A lacing system often is incorporated into the upper to allow users to selectively change the size of the ankle opening and to permit the user to modify certain dimensions of the upper, particularly girth, to accommodate feet with varying proportions. In addition, the upper may include a tongue that extends under the lacing system to enhance the comfort of the footwear (e.g., to modulate pressure applied to the foot by the laces), and the upper also may include a heel counter to limit or control movement of the heel.

Sole structures having multiple hardnesses and/or flex promoting structures


A jacket device is configured to be used with a mobile communication device. The jacket device includes a sidewall and a baseplate, wherein the sidewall and the baseplate cooperate to form a receiving chamber for receiving the mobile communication device. The jacket device also includes a rocker bar having a pressing portion connected to a rack portion, wherein the rack portion extends through the sidewall. A transmission is disposed on the baseplate and connected with the rocker bar. An electric generator is disposed on the baseplate. An electric generator includes a rotor coupled with the transmission and a stator fixed on the baseplate. When the pressing portion is pressed, the rack portion drives the rotor to rotate via the transmission so that electric power is generated by the electric generator.

Due to advancement of technologies, use of mobile communication apparatuses such as mobile phones, personal digital assistants (PDAs) and tablet computers (e.g., iPads) is increasingly widespread. Because their functions become increasingly diversified, power consumption of such mobile communication apparatuses also increases continuously. Meanwhile, as such mobile communication apparatuses are used more and more frequently, energy consumed is also increasing, and it is often the case that several backup batteries must be used every day or the battery must be recharged frequently. Furthermore, if a user staying in an environment where no recharging power source is available (e.g. a suburban area) does not carry a backup battery with him/her, then his/her mobile communication apparatus may run out of power and fail to operate any longer, which may present unnecessary troubles for the user. Also, in some emergencies, if the mobile communication apparatus runs out of power and cannot be recharged in time, unnecessary losses might be caused or the user might be put at risk.

Recharging jacket assembly for a mobile communication device


A deserializer includes an input interface configured to receive an N-bit serialized stream at a source clock frequency; a modified-tree deserializing architecture that receives the first N−1 bits of the serialized stream from the input interface and generates N−1 parallel outputs corresponding to the first N−1 bits; and a last-bit flip-flop that directly samples the input interface to obtain an Nth bit, such that all N bits are available within one source clock cycle after the Nth bit arrives at the input interface.

1. Technical Field
The present invention relates to the conversion of serial data streams to multi-bit parallel data streams and, more particularly, to a modified-tree data deserializer.
2. Description of the Related Art
In electronic systems and circuits, when data is transferred from one system to another, the source system and destination system may process data at different rates. In such a case, it may be beneficial to convert between serial data at a high data rate to parallel data that is processed at a lower rate.
When selecting a data deserializer, speed, latency, power, and chip area are all metrics of the utility of that component. In modern high-speed systems, for example, a data deserializer may need to work at data rates in the tens of gigabytes per second. When data is transferred from the input of the deserializer to the output, a certain time delay is introduced called the latency. Different applications will have different latency needs, and high-performance computing systems may need a very low latency. The power dissipation and the related chip area, meanwhile, need to be low to generally reduce system power consumption and cost.
One conventional type of deserializer is a tree-type deserializer, where data delay elements such as registers or latches are allocated in a hierarchical structure, with some elements being operated at a significantly lower frequency than the source clock frequency. The tree deserializer has a significant advantage over register shift desrializers in its power consumption, but because the data is delivered among a variety of different clock domains, the data latency increases. Conventional tree deserializers are then unsuitable for applications that need low latency.

INTERNATIONAL BUSINESS MACHINES CORPORATION


A filter device for compressed air in which the filter packings can be easily and quickly replaced. A first packing is accommodated in a first sleeve, a second packing is accommodated in a second sleeve, and an inlet passage portion defines an inlet passage for introducing compressed air from the exterior to the first sleeve. A guide passage portion defines a guide passage for guiding compressed air from the first sleeve to the second sleeve, and an outlet passage portion defines an outlet passage for discharging the compressed air out of the second sleeve to the exterior. The first and second sleeves, the inlet passage portion, the guide passage portion and the outlet passage portion are integrally formed of a synthetic resin, thus forming a unitary body for the filter device. The body contains access openings through which the first and second packings are independently removable, and a closure member is removably attached to each access opening to close the access opening and provide fluid-tightness.

1. Field of the Invention
The present invention relates in general to a filter device for compressed air which has filter means having suitable packings accommodated in suitable sleeves, and more particularly to such a filter device for compressed air in which the packings can be easily and quickly replaced.
2. Discussion of the Related Art
Generally, passages for supplying compressed air to various pneumatically operated components used in various factories and atomic plants, for example, are provided with filter devices for removing water and oil contained in a flow of the compressed air, for the purpose of protecting the pneumatic components or improving the performance of those components.
One type of such a filter device for compressed air is disclosed in laid-open Publication No. 62-1763 of examined Japanese Patent Application, which is constructed as shown in FIG. 14. This disclosed filter device includes two kinds of filter means. Namely, the filter device 90 includes first filter means 12 having a suitable first packing 93 accommodated in a first sleeve 92 thereof, and second filter means 14 having a suitable second packing 95 accommodated in a second sleeve 94 thereof. The first and second filter means 12, 14 are disposed parallel with each other on a trap chamber 96 having a suitable volume capacity, so as to extend in the vertical direction from the trap chamber 96, such that each of the first and second filter means 12, 14 communicates with the trap chamber 16.
The trap chamber 96 consists of a guide passage portion 98 and a drain portion 100 which are fixed to each other by suitable bolts. The guide passage portion 98 communicates with the first and second filter means 12, 14, and has a guide passage 44 formed therein, so that the compressed air is fed through the guide passage 44 from the first filter means 12 to the second filter means 14. The lower open end of the guide passage 98 is fluid-tightly closed by the drain portion. To the bottom wall of the drain portion 100, there is attached a drain device in the form of a weep valve 102 through which a liquid separated from the compressed air by the first filter means 12 and accumulated in the trap chamber 96 is discharged out of the filter device 90.
On the first and second filter means 12, 14, there is disposed a manifold 108 which includes an inlet passage portion 104 and an outlet passage portion 106. The inlet passage portion 104 has an inlet passage 37 formed therein, through which the compressed air is introduced into the filter device 90. The outlet passage portion 106 has an outlet passage 39 formed therein, through which the compressed air is fed out of the filter device 90. The inlet and outlet passages 37, 39 communicate with the first and second filter means 12, 14, respectively.
The first and second filter means 12, 14, the trap chamber 96 and the manifold 108 are assembled together and fixed to each other by a plurality of bolts 110 which extend through the manifold 108 and which are screwed in the guide passage portion 98 of the trap chamber 96. According to this arrangement, the compressed air entering the inlet passage 37 of the manifold 108 is fed through the first filter means 12 into the trap chamber 96, and then through the second filter means 14 into the outlet passage 39 of the manifold 108, whereby an air passage for the compressed air is formed through the filter device 90.
In the filter device 90 constructed as described above, usually, a wound wire mesh fabric formed of stainless steel fibers or other metallic materials is used for the first packing 93 of the first filter means 12, so that vapor and/or liquid particles like water and oil contained in the compressed air are condensed or coalesced as the compressed air passes through the first filter means 12. For the second packing 95 of the second filter means 14, usually, a wound fabric mesh formed of cotton fibers is used, so that the liquid particles contained in the compressed air are absorbed and vaporized as the compressed air passes through the second filter means 14.
Thus, in the filter device 90 disclosed in the above-indicated publication, the vapor and/or liquid particles are condensed or coalesced as the compressed air is introduced into the trap chamber 96 through the inlet passage 37 of the manifold 108 and the first filter means 12, so that the vapor and/or liquid particles are separated from the compressed air. Further, the compressed air from which the vapor and/or liquid particles have been thus separated is introduced into the second filter means 14 through the trap chamber 98, so that the amount of the liquid particles remaining in the compressed air is minimized.
The first and second packings 93, 95 constituting the first and second filter means 12, 14, respectively, are required to be replaced with clean ones when the packings 93, 95 get clogged with dust and/or grease. The replacement requires the following operations.
First, the plurality of bolts 110 serving to connect the first and second filter means 12, 14, the manifold 108 and the trap chamber 96 into an integral assembly are all removed, and the assembly is disassembled into the four parts. Secondly, the clogged first and second packings 93, 95 which are accommodated in the first and second sleeves 92, 94, respectively, are replaced with clean ones. And then, the first and second filter means 12, 14, the trap chamber 96 and the manifold 108 are assembled together and fixed to each other, as described before, by screwing the plurality of bolts 110 in the respective positions.
That is, in the conventional filter device 90 disclosed in the above-identified publication, each time the first and second packings 93, 95 of the first and second filter means 12, 14 are replaced, the device 90 has to be disassembled into the parts before the replacement, and the parts have to be reassembled into the device 90 after the replacement.
The filter device 90 is advantageously used in various factories, atomic plants and medical field owing to its high filtering performance. However, the filter device 90 requires the above-described operations for replacing the first and second packings 93, 95, which operations are cumbersome and time-consuming, as described above. There is still a room for improvement in this filter device 90.


A liquid application material that is capable of forming an oxidized insulator as a result of baking is applied onto a support substrate to produce an object of processing. Then, a mold having projection structures with intervals of nanometers is pressed against the applied liquid material to produce corresponding recess structures. Thereafter, the applied liquid material is baked in oxygen-containing gas or oxidized in ozone or oxygen plasma to make it electrically highly resistive. Subsequently, a layer to be anodized is formed on said oxidized insulator. Then, the layer to be anodized is actually anodized in an acidic solution to form fine holes that are aligned with the respective recess structures in the anodized layer. Accordingly, fine recess structures can be manufactured with ease.

1. Field of the Invention
This invention relates to a method of manufacturing recess/projection structures with very fine intervals of a scale of nanometers. This invention also relates to a magnetic device using a structure.
2. Related Background Art
So-called nano-imprinting methods have been proposed in recent years as techniques for forming micro-structures of dimensions of nanometers on the surface of an object to be processed by directly pressing a mold of recess/projection structures against the object (see, inter alia, U.S. Pat. No. 5,772,905 and Japanese Patent Application Laid-Open No. 2000-232095). They represent new technological developments and do not relate to lithography that uses light and/or an electron beam.
With any of the proposed techniques, a mold 101 prepared through a process using an electron beam as shown in FIGS. 6A, 6B, 6C, 6D and 6E of the accompanying drawings and having a pattern of projection structures that are arranged at intervals of tens to hundreds of several nanometers is pressed against the resist 102 formed on a flat semiconductor wafer 103 and then removed to produce a pattern of recess/projection structures. Then, the recess structures 104 are removed by ion-milling and the product of ion-milling is used as mask for etching the semiconductor wafer 103 to produce structures of a size of nanometers including recesses/projections that corresponds to the original stamper. With the technique, it is possible to form a micro-pattern easily within a short period of time that cannot be realized by photolithography. Additionally, the substrate and the mold are prevented from being destroyed as the pressure of the press operation is reduced by means of a resin layer and etching is used for the actual processing operation.
Meanwhile, there are also known techniques for forming an alumina nano-hole at any selected position by preparing a recess structure on the surface of an aluminum thin film, using photolithography, direct writing with a beam or a press technique as described above, and conducting an anodization (anodic oxidation) process, using the recess as starting point for forming the nano-hole (see, inter alia, Japanese Patent Application Laid-Open No. H10-121292). However, recesses/projections formed on the surface of a metal thin film by agglomerations of grains have a height of several to tens of several nanometers, they can be obstacles when forming a very fine starting point pan em (to be referred to as nano-structures hereinafter) on the surface of the thin film that shows gaps substantially as large as the above cited height.
A metal thin film of the type under consideration is formed not completely by single crystals but by a number of agglomerations of crystal grains. Steps are produced at the crystal boundaries. In other words, recesses/projections are formed on the surface of the thin film.
FIGS. 7A, 7B, 7C, 7D, 7E and 7F illustrate a technique for avoiding such recesses/projections. Referring to FIGS. 7A, 7B, 7C, 7D, 7E and 7F, an electro-conductive layer 202, an insulation layer 201 and a resist layer 204 are sequentially formed on a support substrate 203 (FIGS. 7A and 7B) and then a pattern of recesses 205 is formed in the resist layer 204 by photolithography or an interference exposure technique (FIG. 7C). Then, the electro-conductive layer 202 is made to become exposed by etching the insulation layer, using the resist pattern as mask (FIG. 7D). Then, an aluminum film 206 is arranged thereon and subjected to anodization. With the above-described process, nano-holes can be formed as a pattern on the electro-conductive layer due to the electric current that flows from the exposed parts of the electro-conductive layer 202 (FIGS. 7E and 7F). While recess structures may be formed as a pattern on the aluminum film as shown in FIG. 7E, it accelerates the formation of nano-holes aligned with the pattern of the electro-conductive layer and hence does not give rise to any problem. Thus, it is possible to prepare nano-holes arranged at very fine intervals without being affected by the recesses/projections of agglomerations of grains on the surface of the aluminum film.
Techniques for filling such regular nano-structures with metal, semiconductor or a magnetic material have also been proposed along applications of the techniques including coloring, magnetic recording mediums, EL light emitting elements, electrochromic elements, optical elements, solar cells and gas sensors.


A method of increasing the conductivity of a transparent conductive layer, in which a photoresist layer which patterns the transparent layer is given tapered edges and is partially etched. The partial etching exposing the edge regions of the underlying transparent conductor layer, which are the selectively plated. This method has a single patterning stage of the transparent layer, but uses partial etching of a tapered resist layer in order to expose a small edge region of the transparent layer for coating with a conductive layer (which can be opaque).

This invention relates to a method of increasing the conductivity of transparent layers, in particular for use in the manufacture of pixellated devices such as active matrix liquid crystal displays. The invention also relates to the transistor substrate, known as the active plate, used in the manufacture of such displays.
A liquid crystal display typically comprises an active plate and a passive plate between which liquid crystal material is sandwiched. The active plate comprises an array of transistor switching devices, typically with one transistor associated with each pixel of the display. Each pixel is also associated with a pixel electrode on the active plate to which a signal is applied for controlling the brightness of the individual pixel. Liquid crystal displays may be arranged as transmissive or reflective devices.
FIG. 1 shows the electrical components which make up the pixels of one known example of active plate of an LCD. The pixels are arranged in rows and columns. The row conductor 10 of a pixel is connected to the gate of the-TFT 12, and the column electrode 14 is coupled to the source. The liquid crystal material provided over the pixel effectively defines a liquid crystal cell 16 which extends between the drain of the transistor 12 and a common ground plane 18. An optional pixel storage capacitor 20 is connected between the drain of the transistor 12 and the row conductor 10 associated with an adjacent row of pixels.
A large area of the active plate is at least partially transparent, and this is required because the display is typically illuminated by a back light. In conventional display devices, the pixel electrode must be transparent, whereas row and column conductors are formed as metallic opaque lines. Metallic layers, such as chromium, molybdenum, aluminium, alloys or multilayer structures , are used for the row and column conductors because of the high conductivity, which improves the device performance. The conductivity of the lines (usually the column lines) to which the pixel drive signals are applied is particularly important in large displays, because a sizeable voltage drop occurs over the length of the line, making it impossible to drive uniformly all pixels along the line (column).
A problem with the use of metallic column conductors is that separate deposition and lithographic procedures are required to form the column conductors and the pixel electrodes. The pixel electrodes must be transparent, and are typically formed from a transparent conductive oxide film. It is well known that the lithography steps in the manufacturing process are a major contributing factor to the expense of the manufacturing process. Each lithographic step can be considered to reduce the yield of the process, as well as increasing the cost.
The conventional manufacturing process for the active plate of an LCD is a five mask process. With reference to the bottom gate TFT LCD active plate shown in FIG. 2, the process steps, each requiring a separate mask definition, are:
(i) defining the gate 22 (which is part of the row conductor) over the substrate 21;
(ii) defining the amorphous silicon island (which overlies a gate dielectric 23 which covers the entire structure), comprising a lower intrinsic layer 24 and an upper doped contact layer 26;
(iii) defining the metallic source 28, drain 30 and column electrode 32;
(iv) defining a contact hole 34 in a passivation layer 36 which covers the entire substrate; and
(v) defining the transparent pixel electrode 38 which contacts the drain 10 through the hole 34.
The capacitor shown in FIG. 1 may simply be formed from the gate dielectric by providing an area of overlap of one pixel electrode with a portion of the row/gate conductor of the adjacent row.
There have been various proposals to reduce the number of lithography steps, and thereby the mask count, of the manufacture process in order to reduce cost and increase yield.
For example, it has been proposed to form the column conductors from the same transparent conductive oxide film as the pixel electrode, so that these components of the pixel structure can be deposited and patterned together. Additional measures can result in a two mask process, and this is explained with reference to the bottom gate TFT LCD active plate shown in FIG. 3. The process steps, each requiring a separate mask definition, are:
(i) defining the gate 22 (and row conductors); and
(ii) defining the transparent column electrode 32 (which also forms is the TFT source 28) and the pixel electrode 38 (which also forms the TFT drain 30).
The definition of the semiconductor island 24, 26 can be achieved by a self-aligned process using the gate 22, for example by using UV exposure through the substrate. Of course, the semiconductor could equally be formed with a third mask step (between steps (i) and (ii) above). In the periphery of the array, the gate dielectric 23 is etched away using a low-precision stage, to allow contact to the gate lines at the periphery of the display.
In this structure, the high resistivity of the transparent conductive oxide film used for the column lines prevents the use of the structure in large (TV-sized) displays or in higher resolution displays, for example above VGA.
For this reason, there are further proposals to treat the column conductor area of the layer to increase the conductivity, whilst not affecting the transparency of the pixel electrode. For example, the article xe2x80x9cConductivity Enhancement of Transparent Electrode by Side-Wall Copper Electroplatingxe2x80x9d, J. Liu et al, SID 93 Digest, page 554 discloses a method of enhancing the conductivity by electroplating a copper bus to the side of the metal oxide column line. The process involves an incomplete etching process to leave metal oxide residues which act as seeds for the copper growth. The process is complicated and difficult to control. In addition, the copper bus will surround the source and drain electrodes, and there is a risk of shorts between the source and drain resulting from fast lateral copper growth when forming the bus. The copper bus around the source and drain electrodes also influences the channel length of the TFT and therefore makes the TFT characteristics unpredictable.
WO 99/59024 discloses a method for enhancing the conductivity of a transparent electrode by providing patterned metallic layers adjacent to the transparent electrodes.
There is still a need for a simple process for increasing the conductivity of a transparent metal oxide layer, such as ITO, without increasing dramatically the complexity of the process. Such a process will find application in active matrix LCD manufacture, but will also be useful for other technologies where mask count reduction could be achieved if a transparent conductive layer could be made to be more conductive without losing the transparency. This may be of benefit for polymer LEDs and large area image sensors.
According to a first aspect of the invention, there is provided a method of increasing the conductivity of a transparent conductive layer, comprising:
depositing and patterning a photoresist layer into a configuration corresponding to the desired pattern of the transparent conductive layer; and
patterning the transparent conductor layer using the photoresist layer, wherein the edge regions of the photoresist layer are provided with a taper, the method further comprising the steps of:
partially etching the photoresist layer such that at least part of the edge regions are completely removed thereby exposing the underlying transparent conductor layer;
selectively plating the exposed parts of the transparent conductor layer with a metallic layer.
This method has a single patterning stage, but using partial etching of a tapered resist layer in order to expose a small edge region of the transparent layer for coating with a conductive layer (which can be opaque).
The tapered edge regions may be provided by a photoresist reflow technique. This does not need any masking steps, and can be achieved using a raised temperature baking process.
The step of selectively plating may comprise:
activating the exposed parts of the transparent conductive layer;
removing the partially etched photoresist layer;
performing electroless plating of the activated areas of the transparent conductive layer.
The removal of the photoresist can instead be after the plating operation.
The metallic layer preferably comprises copper or silver and the transparent conductor layer comprises a conductive oxide, for example ITO.
The increased conductivity transparent conductive layer can be used in liquid crystal display manufacture. For this purpose, according to a second aspect of the invention, there is provided a method of forming an active plate for a liquid crystal display, comprising:
depositing and patterning a gate conductor layer over an insulating substrate;
depositing a gate insulator layer over the patterned gate conductor layer;
depositing a silicon layer over the gate insulator layer;
depositing a transparent conductor layer over the silicon layer;
depositing and patterning a photoresist layer over the transparent layer having a configuration defining source and drain areas, pixel electrode areas and line conductor areas associated with the source or drain conductors; and
patterning the transparent conductor layer using the photoresist layer,
wherein edge regions of the photoresist layer are provided with a taper, the method further comprising:
partially etching the photoresist layer such that at least part of the edge regions are completely removed thereby exposing the underlying transparent conductor layer;
selectively plating the exposed parts of the transparent conductor layer with a metallic layer.
This method can enable a two mask process to be used, wherein the gate conductor is deposited and patterned with a first lithographic process and the photoresist layer is deposited and patterned with a second lithographic process, the silicon layer being self aligned to the gate conductor.
According to a third aspect of the invention, there is provided an active plate for a liquid crystal display, comprising:
a gate conductor layer, a gate insulator layer, and a silicon layer together defining pixel transistors;
a transparent conductor layer defining source and drain conductors for the pixel transistors and also defining column conductors each connected to one of the source and drain of an associated transistor, and also defining pixel electrodes; and
a metallic layer overlying edge regions of the transparent conductor layer.
The metallic layer overlying the edge regions is the result of the method of the invention.
Each pixel may be associated with at least two column conductors, each column conductor having a metallic layer overlying both edges, and the two column conductors being connected together by a bridging portion. This reduces further the resistance of the columns, without increasing the required thickness of the metallic layer. The bridging portion may be completely covered by the metallic layer.
Alternatively, each column conductor may comprise a grid configuration, with all edges of the grid having an overlying metallic layer.

Method of increasing the conductivity of a transparent conductive layer


A floppy disk drive is disclosed which is for use with a host system capable of connecting its own power supply to the disk drive when its operation is needed, and disconnecting the power supply from the disk drive when its operation is not needed. The disk drive includes a stepper motor for moving a data transducer from track to track on a rotating magnetic disk, and a track counter for ascertaining the radial position of the transducer on the disk by counting the stepping pulses fed from the host system to a stepper motor control circuit. In order to maintain the count of the track counter despite power suspension, the track counter is connected to a supply terminal of the disk drive via a reverse blocking diode, and a capacitor is connected between the diode and ground. The track counter is therefore fed from the capacitor when the disk drive is disconnected from the power supply of the host system. Preferably, the count of the track counter when the disk drive is disconnected from the power supply may be temporarily stored on an electrically erasable, programmable read only memory, and the stored count may be returned to and preset on the track counter when the disk drive is subsequently powered on.

This invention relates generally to apparatus for data transfer with a rotating data storage disk such as a flexible magnetic disk having a multiplicity of concentric annular record tracks, and more specifically to a system in such a rotating disk data storage apparatus for holding the count of a track counter unaltered despite power suspension.
The rotating disk data storage apparatus, or disk drive according to common parlance, has a transducer or transducers for reading and writing digital data on one or both major surfaces of the disk. Retrieved from the disk by the transducer, the data is directed through an amplifier, a filter and a differentiator to a comparator thereby to be shaped into form suitable for further processing.
Data retrieval from magnetic disks needs special consideration because of the fact that the record tracks on the disk become progressively less in diameter from the radially outmost one inward, that is, that the recording density of digital data becomes progressively higher from the radially outmost track inward. Consequently, were it not for the filter, the differentiator would produce different output waveforms for the same datum depending upon its radial position on the disk. The resolution of the differentiator would then deteriorate as the transducer travels radially inwardly of the disk.
The filter on the preceding stage of the differentiator represents a solution to this problem. The filter constant is varied in order to compensate for the difference in the resolution of the differentiator depending upon the radial position of the transducer on the disk. For instance, in a disk drive for use with a five and a quarter inch disk, the filter constant is set at one value when the transducer is on Tracks 0-43, and at another when the transducer is on Tracks 44-79. Further, in writing data on the disk, the write current for Tracks 44-76 is made approximately 20 percent less in magnitude than that for Tracks 0-43.
The track counter is a standard component of the disk drive, being needed for changing the filter constant and the write current magnitude depending upon the radial position of the transducer on the disk. Despite its name, however, the track counter does not actually count the tracks being traversed by the transducer. As is well known, the transducer travels from track to track on the disk as a bidirectional stepper motor rotates by small increments determined by stepping pulses and in a direction determined by a stepping direction signal. Both stepping pulses and stepping direction signal are supplied from the host system controlling the disk drive. Reset each time the transducer is recalibrated on Track Zero, the track counter counts the stepping pulses in an increasing or a decreasing direction depending upon the stepping direction signal, thereby indirectly counting the tracks being traversed by the transducer. The host system is supplied with this count and thus knows at every instant the current transducer position on the disk.
Usually, in personal computers, word processors and like data processing systems comprising a disk drive, the disk drive has no power switch of its own but is powered on and off with the host system. Recently, however, systems have been developed in which the host system disconnects the disk drive from the power supply when it is not in use, with a view to saving power.
Suppose that the disk drive is powered off while the host system remains on. Conventionally, being comprised of flip flops, the track counter was then incapable of holding the count. The track counter was reset when subsequently powered on. Then the transducer traveled to Track Zero as the host system delivered a recalibration command to the disk drive, so that the count of the track counter agreed with the transducer position on the disk.
The recalibration of the transducer each time the disk drive is reconnected to the power supply is objectionable because of the waste of time and electric energy. Reading or writing of data on the disk will be resumed far more quickly if the transducer traveled to a destination track directly from its position when the disk drive was powered off, instead of after being recalibrated on Track Zero.
Conventionally, however, the count of the track counter disagreed with the transducer position on the disk and with what the host system knew as the transducer position if the transducer was not recalibrated when the disk drive was powered on. It then became impossible for the track counter to correctly change the filter constant and the write current magnitude according to the radial position of the transducer on the disk.
The inconvenience discussed above is not limited to systems wherein the host system causes disconnection of the disk drive from the power supply. In some systems the disk drive may be separably connected to the host system and powered off for reasons other than the inherent function of the host system. When the disk drive is subsequently powered on, the count of the track counter also disagreed with the transducer position on the disk and with what the host system knew as the transducer position if the transducer was not recalibrated.

System for holding a track counter active despite power suspension in rotating disk data storage apparatus


A process of making a laser diode device includes these steps: applying a bonding layer such as molybdenum manganese to surfaces of first and second bodies of dielectric material such as beryllium oxide; joining the first and second bodies together to form a cavity; and bonding a sectored conductor ring to the bonding layer within the cavity.

1. Technical Field
This invention relates to a laser diodes mounted in an array, surrounding a laser medium for excitation thereof, and particularly to the fabrication and structure of the surrounding array.
2. Background Information and Disclosure
Excitation of a laser medium from an adjacent or surrounding array of laser diodes is known in the prior art.
U.S. Pat. No. 5,033,058 to Cabaret et al discloses a laser rod in a glass tube with a segmented reflective coating. Laser diodes placed around the glass tube emit through windows in the reflective coating to excite the laser rod.
U.S. Pat. No. 5,040,187 to Karpinski, and U.S. Pat. No. 5,128,951 to Karpinski both disclose flat laser diode arrays mounted in a ceramic substrate with a metallized surface. Current through the metallized surface energizes the laser diodes, which then excite an adjacent laser medium, not shown in the patents.
U.S. Pat. No. 5,521,936 to Irwin discloses a radial array of laser diodes mounted in a sectored conductive ring surrounding a laser rod. An inner tube forms a coolant channel around the laser rod, and an outer sleeve forms a coolant channel around the ring and the laser diodes.
The most relevant prior art that I know of is U.S. Pat. No. 5,627,850 to Irwin et al. It discloses a laser diode array which includes a dielectric block with a conductor layer "direct bonded" to it. The conductor layer is divided into sectors by spaced diode bar spaces. A laser diode bar is positioned in each space. The conductor layer and laser diode bars together surround a laser medium which is excited by the laser diode bars.


A casing for encapsulation of an electrical component, for example a piezoelectric actuator, comprising an outer layer of a semipermeable material and an inner layer comprising a chemically active, hydrophilic substance that chemically combines with water to form a compound.

It may be necessary to encapsulate a piezoelectric element in order to protect it from potentially damaging environmental conditions. For example, in one known application, described in EP 0 995 901, a piezoelectric element is surrounded with high pressure fuel. However, the fuel and the piezoelectric element must be kept separate in order to prevent any moisture present within the fuel having an electrochemical effect on the compounds in the piezoelectric material.
In many applications, such as that described in EP 0 995 901, the material encapsulating the piezoelectric element must be flexible in order to enable the piezoelectric element to change in length. At present preferred materials for the casing are polymers as these exhibit many desirable characteristics. However, polymers are not an ideal material because they cannot provide a permanent moisture barrier, due to their inherent permeability. Even in the most permeation resistant polymers, such as fluorinated polymers or elastomers, water permeation is significant.
Moisture that has entered the casing of a piezoelectric element at the manufacturing stage can also cause problems. This moisture has the same potential to damage the piezoelectric element as that permeating through the casing and therefore it is desirable to remove it.


A paper feeding device includes a back plate, a first bracket, a second bracket, a shaft, and a friction roller. The first bracket is arranged on the back plate and formed of a first socket. The second bracket is arranged on the back plate and formed of a second socket. The shaft has a first end and a second end opposite to the first end. The first end of the shaft is rotatably mounted in the first socket. The second end of the shaft is rotatably mounted in the second socket. At least one of the first and second sockets is an open-ended socket for facilitating both the insertion and removal of the shaft. The friction roller wraps around the shaft for conveying a piece of paper.

1. Field of the Invention
This invention relates to a paper feeding device having a replaceable paper conveying roller, in particularly, to a replaceable paper conveying roller for paper feeding devices such as a scanner, a printer, a fax machine, or a copier.
2. Brief Description of Related Art
Prior art has used a roller to convey papers in a paper feeding device, as shown in FIG. 1. A back shell 16 wraps around two brackets 11 and 12, which reinforce the shell. The brackets 11 and 12 have two sockets 112 and 122 respectively for mounting a shaft 15. A roller 16, made of friction material, is mounted over the shaft 15. The left end 18 of the shaft 15 feeds through the socket 112, and the right end 19 of the shaft 15 feeds through the socket 122. The shaft 15 is indirectly driven by a gear 17 located at the right end of the shaft 15. When the gear 17 is driven by a motor (not shown), the roller 16 rotates and the friction coveys the paper P forward.
Due to high-speed operation of modern paper feeding devices, the roller 16 experiences wear and tear. The lifetime of the paper feeding device is thus adversely affected.
An object of this invention is to increase the useful lifetime of a paper feeding device. Another object is to reduce the servicing cost of a paper feeding device.
These objects are achieved by using a replaceable paper conveying roller for a paper feeding device. A paper feeding device of the invention includes a back plate, a first bracket, a second bracket, a shaft, and a friction roller. The first bracket is arranged on the back plate and formed of a first socket. The second bracket is arranged on the back plate and formed of a second socket. The shaft has a first end and a second end opposite to the first end. The first end of the shaft is rotatably mounted in the first socket. The second end of the shaft is rotatably mounted in the second socket. At least one of the first and second sockets is an open-ended socket for facilitating both the insertion and removal of the shaft. The friction roller wraps around the shaft for conveying a piece of paper.

Paper feeding device having a replaceable paper conveying roller


A control device serves the steering of the distal end of an endoscope, this being by operating control cables running to the distal end of the endoscope by way of a handle. The control device is accomodated by a control housing at the proximal end of the endoscope and has an adjusting and braking mechanism for adjusting and fixing the distal endoscope end as well as further as a handle, a lever which is to be operable with one hand and which serves as a combined braking and control member. This lever, from a first position, can be rotated about an axis wherein it acts upon the control cables via a shaft connected to the handle as well as via an insert rotatably mounted in the housing and connected to the shaft, and in a second position together with the insert can be fixed against rotation by way of a friction fit via a brake effective between the control housing and the insert. The lever comprises a locking member which is operable by hand and which effects an axial offset of the shaft and the insert in the direction of the mentioned axis, wherein on operating the locking member in one direction, the insert can be brought into frictional engagement with a stationary braking element and by way of this the distal endoscope end is fixed in its respective position.

The invention relates to a control device for steering the distal end of an endoscope by operating control cables running to the distal end of the endoscope by way of a handle, wherein the control device is accomodated by a control housing at the proximal end of the endoscope, and it comprises an adjusting and braking mechanism for adjusting and fixing the mentioned distal end and furthermore as a handle, a lever which is operable with one hand, serves as a combined braking and control member, and which from a first position can be rotated about an axis passing through the control housing and at the same time acts upon the control cables via a shaft connected to the handle and an insert rotatably mounted in the housing and connected to the shaft, and which in a second position together with the insert can be fixed against rotation by way of a friction fit via a brake effective between the control housing and the insert.
Such a control device for flexible endoscopes is known from the patent DE 37 29 131 C1. With this control device the control lever operating the insert in the control housing and thus the control cables is formed with a design such that it may be used for steering the distal end of the endoscope as well as for fixing the momentary setting. By way of lateral pivoting of the control lever the control device may be brought from a first operating position into a second operating position in which the brake is effective.
The disadvantage with this control device is the complicated handling and the relatively high technical expense in the assembly as well as in the adjustment of the individual components within the proximally located control housing.


A finder indication optical system, in which an indication device is provided, includes a correction surface provided in the finder indication optical system to correct an astigmatic difference thereof. The origin of the correction surface is defined on the optical axis; the optical axis defines an X-axis; the transverse direction of the correction surface, perpendicular to the X-axis, defines a Y-axis; the longitudinal direction of the correction surface, perpendicular to the X-axis, defines a Z-axis; the coordinates of the center of the correction surface are (xcex1,xcex2); and the absolute value of curvature C in a section parallel with a X-Z plane, at the coordinates (y, z) of the correction surface, is |CZ(y, z)|. The correction surface is formed so that the absolute value |CZ(y, z)| of the curvature C increases as the absolute value of z at y=xcex1 increases.

1. Field of the Invention
The present invention relates to a finder indication optical system which can be advantageously used for an indicator within a finder of a camera, and in particular a small camera, such as a digital camera.
2. Description of the Related Art
In a view finder of a conventional camera, in particular a single lens reflex camera, an indication device is provided in the vicinity of an image surface (focusing screen) of an objective optical system (photographing lens) or provided in a position optically equivalent to the image surface, so that together with an object image formed by the objective optical system, the indication of the indication device can be viewed outside of the photographing area which defines the periphery of a picture to be exposed on a film.
In a view finder of a single lens reflex digital camera or a real-image type view finder of a compact camera in which the image of the objective optical system is smaller than that in a single lens reflex camera using a silver-halide film, an eyepiece (eyepiece optical system) provided within the finder optical system to view an object image formed by the objective optical system is small and has a large magnification. However, the number of the lenses of the eyepiece is decreased in order to reduce the manufacturing cost, and consequently it is difficult to maintain a good image peripheral portion of the field of view. Nevertheless, if the object image formed by the objective optical system is viewed through the eyepiece, the deterioration of the image quality peripheral portion of the is not serious because, normally, a viewer tends not to focus on the peripheral portion of the photographing area. However, in the indication within the finder in which only the peripheral portion of the field of view is utilized, if an indication of high contrast is viewed, deterioration of a finder indication image in the meridional direction or sagittal direction due to aberration and, in particular, astigmatic difference is apparent.
In order to solve the above-mentioned problem of the prior art, it is an object of the present invention to provide an optical system in which an astigmatic difference correction device is provided in a light path of a finder indication optical system to reduce or eliminate distortion of a finder indication image, so that an image of high quality can be viewed within the finder.
To achieve the object, according to the present invention, a finder indication optical system is provided, in which an indication device is provided in the vicinity of an image surface of an objective optical system or provided in a position in which the diopter is substantially equivalent to the image surface of the objective optical system when viewed through a finder field of view of a finder optical system, so that photographing information formed by the indication device can be viewed outside of the photographing area which is formed to be seen in the finder field of view, said indication optical system comprising: a correction surface which is provided along a light path of the finder indication optical system to correct an astigmatic difference thereof,
wherein the correction surface is provided at a predetermined position from the optical axis of the finder optical system as the origin point, and
wherein the correction surface is formed in the following manner:
the optical axis defines an X-axis;
the direction parallel to the transverse direction of said correction surface and perpendicular to the X-axis, defines a Y-axis;
the direction parallel to the longitudinal direction of said correction surface and perpendicular to the X-axis, defines a Z-axis;
the coordinates of the center of said correction surface are (xcex1,xcex2); and
the absolute value of curvature C in a section parallel with a plane defined by said X-axis and said Z-axis, at the coordinates (y, z) of the correction surface, is |Cz(y, z)|;
wherein said correction surface is formed so that the absolute value |CZ(y, z)| of the curvature C increases as the absolute value of z at y=xcex1 increases. Preferably, the absolute value |CY(y, z)| of the curvature C in a section parallel with a plane defined by the X-axis and the Y-axis, at the coordinates (y, z) of the correction surface, satisfies the following condition (1) at y=xcex1 and z=xcex2:
|CY(y, z)|/|CZ(y, z)|xe2x89xa71xe2x80x83xe2x80x83(1)
Preferably, the following condition (2) is satisfied:
S/fr less than 0.5xe2x80x83xe2x80x83(2);
wherein fr designates the combined focal length of the optical system which constitutes the finder optical system provided optically behind the correction surface; and S designates the reduced spatial distance between a indication surface of the indication device and the correction surface.
Preferably, the following condition (3) is satisfied:
0.1 less than S/frxe2x80x83xe2x80x83(3).
In an embodiment, the finder indication optical system includes a prism, wherein the correction surface is formed on at least one of an incidence surface, a reflection surface and an emission surface, of the prism.
In an embodiment, the correction surface is defined by a part of a rotationally symmetric aspherical surface whose rotational axis is to the same as the optical axis of the finder optical system.
In an embodiment, the finder indication optical system includes a real-image finder in which an object image formed by a photographing lens on a primary imaging plane is formed and viewed on a secondary imaging plane through a condenser lens, a relay lens system, and an eyepiece lens system.
In an embodiment, an indicator is further provided, which is located in the vicinity of the primary imaging plane and outside of the light path of the finder optical system, so that the indication surface thereof is located at a position optically equivalent to the primary imaging plane, wherein the prism is provided between the primary imaging plane and the condenser lens, and in the vicinity of the upper portion of the primary imaging plane.
The present disclosure relates to subject matter contained in Japanese Patent Application No.2000-47468 (filed on Feb. 24, 2000) which is expressly incorporated herein by reference in its entirety.


The disclosure relates to an optical arrangement for three-dimensionally patterning a radiation-sensitive material layer, such as a projection exposure apparatus for microlithography. The optical arrangement includes a mask for forming a three-dimensional radiation pattern, a substrate with the radiation-sensitive material layer, and a projection optical unit for imaging the three-dimensional radiation pattern from the mask into the radiation-sensitive material layer. The optical arrangement is designed to compensate for spherical aberrations along the thickness direction of the radiation-sensitive material layer in order to generate a stigmatic image of the three-dimensional radiation pattern.

Photonic crystals, interconnect layers of semiconductor components and micromechanical elements drive the demand for three-dimensional patterning of elements in the field of microelectronics. Conventionally lithographic methods are used for producing three-dimensional structures, which methods involve producing the semiconductor elements layer by layer using different masks. In this case, firstly a photoresist (resist) as radiation-sensitive material layer is applied to a carrier (substrate) and exposed by a first lithographic mask. This is followed by a chemical development step, in which the illumination pattern produced in the course of the preceding exposure in the photoresist is transferred into a physical structure in the photoresist. In order to achieve a three-dimensional patterning, the abovementioned steps, namely the application of a photoresist layer, the exposure of the layer and the subsequent chemical development, are typically to be repeated a number of times using different lithography masks. This method can be very complicated and hence time- and cost-intensive.

Optical arrangement for three-dimensionally patterning a material layer


An oil reservoir for vehicle transmissions includes an oil pan, cover, and filter cartridge which are manufactured as separate components. The cover 14 is attached to the pan 12 preferably with a snap-fit connection. The filter cartridge 16 is releasably secured in position between the cover 14 and pan 12 so as to enable the module 16 to be installed and removed without having to disconnect the cover 14 from the pan 12.

1. Technical Field
This invention relates generally to oil reservoirs for vehicle transmissions, and more particularly to those having an in-pan filter.
2. Related Art
Vehicular transmissions are typically equipped with an oil reservoir which includes an oil pan mounted at the bottom of the transmission to serve as a reservoir for lubricating oil. It is common also to incorporate within the interior of the oil pan a filter for cleaning the oil in the reservoir before being drawn back into the transmission. In some applications, the filter is provided as a separate, self-contained module having a filter medium encased by a filter housing which is supported off the floor of the pan. Replacement of a spent filter medium requires replacement of the entire module, including the housing. Other known constructions use the floor of the pan as the lower half of the filter housing and fix a cover permanently to the wall of the pan, with the filter medium being trapped between the cover and floor. In this arrangement, the filter medium is permanently attached to the cover and pan and is thus not replaceable without replacement of the entire oil pan. In both constructions, the upper housing portion or cover is fitted with an integrated flow tube which couples to a transmission oil pump for drawing filtered oil from beneath the cover into the transmission. Both the cover and pan are known to be made of plastics material.
It is an object of the present invention to simplify the construction and maintenance of the filter system for such oil reservoirs.
An oil reservoir according to the invention includes an oil pan, a cover mountable to the pan, and an oil filter cartridge formed separately from the pan and cover and supported in such manner between the cover and pan so as to be separable and removable therefrom to facilitate replacement of the filter cartridge without having to remove the cover from the pan.
According to another aspect of the invention, an oil reservoir is provided having an oil pan, a cover, and filter cartridge, wherein the cover is secured with a snap-fit connection to the pan and supports the filter cartridge releasably between the cover and pan in such manner as to enable separation and removal of the filter cartridge for replacement and/or installation without removal of the cover from the pan.
The invention further contemplates a method of manufacturing an oil reservoir including forming an oil pan, cover, and filter cartridge separately from one another, and securing the cover and filter cartridge to the pan in such manner that the cartridge is separable and removable for facilitating replacement of the cartridge without removing the cover from the pan.
The invention has the advantage of providing a oil reservoir of simple construction.
The invention has a further advantage of providing a reservoir having a replaceable filter module without requiring replacement of the other components, including the cover and pan.
Another advantage of the invention is that the filter module can be detached and separated from the pan and cover without having to remove the cover from the pan, thereby simplifying and reducing the cost and labor involved in replacing a spent filter module.
Another advantage of the invention is that the cover mounts with a snap-fit connection to the oil pan while still enabling removal and replacement of the filter module without removal of the cover, simplifying the manufacture and serviceability of oil reservoirs.

Oil pan including a snap-fit cover and removable oil filter element


A function of a switch apparatus is realized as an adapter. Signaling data which cannot be processed in the adapter, is output to a mainframe bus of a computer through an AAL controller, a RAM, and a bus controller. The computer processes the signaling data and sends it to a switch adapter through the mainframe bus. The signaling data is input to an 8.times.8 switch through the bus controller, the RAM, the AAL controller. Usual user information is switched by a PHY unit, a TC/ATM controller, an address converter, and the 8.times.8 switch. By connecting the switch adapter to the computer, it is possible for the computer to operate as a switch apparatus without damaging its function.

1. Field of the Invention
This invention relates to a switch adapter in which the switch function is implemented as a single adapter. More specifically, this invention relates to a computer which can operate as a switch without damaging the function of the computer just by connecting the switch adapter to the computer.
2. Description of the Prior Art
FIG. 25 illustrates a conventional Asynchronous Transfer Mode (ATM) switch.
The conventional ATM switch is made of a single hardware frame. The inside of the ATM switch has a switch unit and a plurality of line interface units. A dedicated proprietary bus is mounted to connect the switch unit to the line interface units. A dedicated proprietary interface architecture can be utilized instead of the dedicated proprietary bus to connect the switch unit to the line interface units.
Since the ATM switch is realized as proprietary hardware, it is necessary to develop the switch according to proprietary specifications, depending on the ATM switch in a case where additional functions are implemented for the ATM switch.
FIG. 26 shows a network configuration in a case where the conventional ATM switch, as shown in FIG. 25, is utilized.
A plurality of computers and terminals are wired centrally to the ATM switch. Since a plurality of computers and terminals are wired centrally for a single ATM switch, a function for switching the ATM switch should be performed at a high speed. In addition, the number of accommodated communication lines in the line interface units of the ATM switch should be increased.
FIG. 27 shows a cell format. The cell comprises a header and a pay load. The header contains a Virtual Pass Identifier (VPI) and a Virtual Channel Identifier (VCI).
FIG. 28 shows a conventional ATM switch as shown in "B-ISDN illustration reader", page 67, Ohmu-sha, Jan. 30, 1993.
There are various controls required in the ATM switch. The basic controls are described with reference to FIG. 28 and the description of pages 66 to 71 in "B-ISDN illustration reader".
(1) routing control
The communication is started when a communication requirement called a "calling" process occurs from the terminal. In a line switching system, the "calling" process is performed according to the subscriber's line signal, such as a dial number (D channel signal in N-ISDN). In the ATM switch system, the "calling" signal is transferred to the ATM switch by the cell, found in FIG. 27. The cell that transfers the control information, such as a signal, is called as a control cell and given a predetermined VCI. This control cell can be distinguished from a cell that transmits the user information. The ATM switch receives information such as the destination to which the ATM switch is connected, types of services and a transmission speed of cells and then determines which ATM switch in the network is passed through. This procedure is called routing control.
(2) Connection Admission Control
According to the routing control, the ATM switches are connected in series. The ATM switch transfers the control cells one after another to the connected ATM switch, determined by the routing control. The ATM switch then confirms that all of the ATM switches can pass the control cells under the required service condition. For example, it judges if required traffic exceeds the transmission capacity.
When the ATM switch determines that the transmission capacity is large enough for the required traffic, it indicates that communication can be implemented for the terminal and enters a communication mode. The described communication allowing procedure is called Connection Admission Control (CAC).
(3)Usage Parameter Control
Connection Admission Control of the ATM switch differs from line switching and packet switching. The ATM switch differs because certain parameters peculiar to the ATM switch, such as transmission capacity and quality, required for transmission, are reported. Since a flow of burst traffic is allowed in the ATM switch system, transmission capacity is defined by the peak speed when the interval between cells approaches its minimum and the average speed in a long period. In the ATM switch system, management of system capacity is carried out so as to effectively handle burst traffic through use of the system equipment. When a call exceeds the quantity of contract and large quantities of cells are flown, there is a danger of lowering the quality of the whole network. Accordingly, a communication network which admits call monitors at its entrance must determine whether the transmission capacity reported by the control cell, from the transmitting terminal, matches the actual incoming quantity of cells, from the transmitting terminal.
In this method, at each contract with the subscriber, the process of discarding irregular cells, for instance, is performed when the actual traffic exceeds the predefined value. This procedure is called Usage Parameter Control (UPC).
A cell which passes through the function of UPC is transferred via the ATM switch to a route for the next node. The VCI in correspondence with the route as information required for switching is given on the header of the cell and transmitted to the next node.
(4) Shaping
Since cells are switched to each route according to the ATM switch, cells may be centralized to the specific route. As a result, there happens a case where cells should be transmitted at a fast instantaneous speed which exceeds the capacity of a Virtual Path (VP). In this case, each cell is temporarily stored in a buffer memory and read out in order that the instantaneous speed of cells might not exceed a fixed value (capacity of the VP). This procedure is called shaping.
(5) Priority control of cells
It is possible to control which cell should be transmitted with priority and then to provide a higher quality than a normal quality (the quality is shown at a cell loss rate) for the cell to be transmitted with priority. A Cell Loss Priority (CLP) bit is defined in the header of the cell, allowing user to indicate which cell should be transmitted with priority.
(6) Congestion Control
In the public network, it is important to provide the control technique such as a congestion control technique that will prevent the network from panicking when traffic is congested. There are various methods for providing a congestion control technique. For example, one method will reject the new requirement of connection according to the CAC at the time of congestion. Another method changes the parameter value of the usage parameter control, for example, restricting the peak speed at which the user can transmit.
FIGS. 29 to 31 and the following description explains the protocol based on the conventional ATM system, as shown on pages 84 to 87 of the "B-ISDN illustration reader".
A physical layer is related to the physical medium. An ATM layer deals with a transfer of the cells common to all the service. An ATM Adaptation Layer (AAL) deals with a function that depends on each service and prescribes a plurality of protocols in correspondence with each service. The addition and change of the function of the upper layer, which will depend on each service is absorbed by the ATM adaptation layer in order to prevent affecting the transferring function for cells. Protocols above the ATM adaptation layer, which will depend on the service, are all handled on the side of the terminal (This is applicable to the user information, apart from the control information to deal with the setting and release of the call).
In the ATM adaptation layer, as shown in FIG. 31, information fields (or pay loads) of several cells are connected in series. These information fields are then covered with header information on the top and trailer information on the tail. They are treated as a data unit. The ATM adaptation layer is separated into a Segmentation and Reassembly Sublayer (SARS) and a Convergence Sublayer (CS). The SARS segments the data unit into a plurality of cells and reassembles a plurality of cells into the data unit. The CS checks and testifies the correctness of data and corrects data errors depending on a requirement of each type of services. The CS then provides the result to the upper layer.
Control information deals with setting, maintenance and release of the call and connection between the network and the terminal. As in FIG. 32, the upper layer of the AAL utilizes a call control protocol based on N-ISDN.
In the figure, Q. 93B shows a B-ISDN layer 3 User Network Information (UNI) protocol, B-ISUP shows a B-ISDN User Part (B-ISDN layer 3 Network Node Interface (NNI) protocol), MTP3 is a Message Transfer Part 3 (No. 7 signal system message transfer part), S-AAL shows a Signaling-ATM adaptation Layer.
The above descriptions are quotations from the articles in "B-ISDN illustration reader", pages 66 to 71 and 84 to 87, Ohmu-sha, Jan. 30, 1993.
Since a conventional ATM switch is realized in the proprietary frame based on the specific specification, it is difficult to extend the function of the ATM switch.
For example, when the interface for a local area network (LAN) is added, it is necessary to carry out the specific development dependant on the ATM switch.
When an interface with a wide area network, like an ISDN, is adopted, it is necessary to carry out the specific development dependant on the ATM switch.
Furthermore, when a bridge function, a route function and a communication line monitoring function are added, it is necessary to carry out the specific development depending to the ATM switch.
A network configuration which utilizes a conventional ATM switch has to implement the centralized connection in which a switch is centered. As a result, problems such as the increase of the number of accommodated communication lines and the high-speeding of the processing speed of the ATM switch arise.

Switching adapter and method for a computer system